BOC Edwards Auto 306 E-beam Evaporator

BOC Edwards Auto 306 E-beam Evaporator
BOC Edwards Auto 306 E-beam Evaporator
Operating Instructions
This machine is to be used by authorized personnel only. For training & consultation
contact: Manager, Omid Mahdavi, (520) 621-9849, omidm@email.arizona.edu
Enter all necessary information in the Log Book for each use.
1. Contact a Staff Member immediately if you observe anything unusual, e.g. no
power to the tool or chamber not under vacuum or strange and unusual noises
from the pump stack below. DO NOT ATTEMPT TO OPERATE THE
EVAPORATOR!
2. Place the “Ebeam Reserved” sign on the evaporator and make sure you are signed
in the logbook.
3. ENABLE Ebeam on Coral.
Loading Substrates & Pumpdown
4. Press the VENT button to vent the chamber to atmosphere. Wait until the pressure
display reads (>5.0 +2 TR). Gently attempt to open the chamber door. If the door
resists opening, wait an additional minute or so and try again.
NOTE: DO NOT FORCE THE DOOR OPEN UNDER ANY CIRCUMSTANCES!
5. Press the SEAL button to terminate the chamber vent.
6. Locate the 8 pocket acrylic crucible liner. Refer to Figure 2. Remove the lid and
remove the desired crucible liner.
7. If needed, add the desired authorized material to be evaporated into the correct
crucible liner (See Table 1). Do not over fill the crucible liner. If there is too much
material in the crucible it may cause a thermal short or contaminate the material in
the adjacent pockets. Contact the Lab Manager to obtain permission to evaporate
any materials that are not listed. No un-authorized evaporations are allowed!
8. Use an IPA soaked cleanroom wipe to clean the crucible pockets and remove the
accumulated dust from previous evaporations. Locate and use cleanroom vacuum
if necessary to assist with particle removal.
9. Place liner inside the crucible pocket. Rotate crucible CLOCKWISE using
external knob. If more than one film is to be deposited, then arrange the liners in a
clockwise fashion inside the 4-pocket crucible according to the desired
evaporation sequence.
10. Place/load substrates onto the appropriate substrate holder. There are separate
work plates for different size wafers. There is also an extension piece for
evaporation at lower working distance/power levels. Covering the substrate
holders with aluminum foil prior to mounting the samples is highly
recommended.
Rev. 6, 10/7/13, Omid Mahdavi, UofA Micro/Nano Fab Center
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11. Ensure Quartz Crystal Monitor USAGE is < 300. If not, please contact staff for
crystal replacement.
12. Close the chamber door. Press CYCLE. This will start the chamber pumpdown
process.
NOTE: Liquid N2 may be used to accelerate pumpdown to base pressure when the
chamber has reached the 10-5 Torr region. Pour Liquid N2 into the metal cylinder
located on the outside and on the left portion of the evaporator chamber.
Evaporation
13. For best results load samples late in the evening of the day before and allow
overnight pumpdown of the chamber.
14. When the chamber pressure reaches the mid 10–6 Torr (5.0 -6 TR) range press the
SEAL key followed by the PROCESS key on the Auto 306 Controller panel. The
vacuum interlock LED on the EB3 source panel should light up.
15. Locate the FTM7 Film Thickness Monitor and select the appropriate layer for the
metal you wish to deposit (see Table 1). To set the desired thickness press the
DATA button until the TERMINATE light is illuminated. Press the UP or
DOWN arrow keys to set the desired thickness. Continue pressing the DATA
button until the RATE light is illuminated.
16. Turn on the Sweep Control & use the X-Axis control knob located on the separate
control box on the top to ensure the beam is centered inside the liner. You can
sweep or oscillate the beam inside the liner for a more uniform melt.
17. On the EB3 Source Control panel ensure that the CURRENT knob is set to the
minimum. Press in the HIGH VOLTAGE ON/OFF button. Press in the GUN
button and make sure the high voltage and ebeam current displays turn on. After
10-15seconds the high voltage display should read a value between 4.7 and 4.9
kV.
18. Verify that the REMOTE and the SS1 buttons are pressed in on the shutter control
panel.
19. On the EB3 Source Control panel, increase the current slowly by rotating the
CURRENT knob clockwise to 10-15mA if practical based on Table 2 data. Let
the metal and crucible stay (soak) at this setting for a few minutes. The metal
inside the liner should start glowing.
NOTE: Materials such as Bismuth (Bi),Tellurium (Te), Quartz (SiO2) start
evaporating below 10mA at 4.8kV beam setting.
20. Increase the current in increments of 4-5mA and soak periods of 4-5 minutes until
a desired deposition rate appears on the FTM7 monitor. Use Table 2 as a guide.
21. Press the RUN button on the FTM7 panel to open the shutter and begin measuring
the deposited film thickness on your samples.
22. The shutter will close automatically when the desired thickness is reached.
Rev. 6, 10/7/13, Omid Mahdavi, UofA Micro/Nano Fab Center
2
NOTE: The shutter will close automatically at the set point, however, the evaporation
will not stop until the operator lowers and turns off the current,i.e. if you leave the
area you risk evaporating all the precious source material. You MUST REMAIN in
the lab until the deposition is complete.
23. Slowly reduce the current by turning the CURRENT knob counter-clockwise at
around 5-10mA per minute, back to zero.
24. Ensure the CURRENT knob is at the minimum setting. Allow the crucible to cool
until it is no longer giving off a glow as you look through the viewport.
25. Enter all required information in the logbook.
26. Using the turn knob change to a different liner position clockwise and repeat ramp
and soak process starting at step 12.
27. If you are done with evaporation, then first depress the GUN and then the HIGH
VOLTAGE buttons in that order to turn them OFF.
28. On the Main Controller panel press the SEAL button to isolate the high vacuum
pump.
29. Press the VENT button to bring the chamber to atmosphere. Wait until the
pressure display reads (>5.0 +2 TR). Gently attempt to open the door. If the door
resists opening, wait a few additional minutes. Never force the chamber door
open. Give the chamber a few minutes to vent and the door will not offer
resistance.
30. Press SEAL to stop the vent N2.
31. Contact a MNFC staff member for a designated vacuum cleaner, if you observe
metal flakes and other debris.
32. Remove the crucible liners and place them back in the acrylic liner holder seen in
Figure 2.
33. Close the evaporator door and press the CYCLE button to leave the system under
vacuum for the next user.
Rev. 6, 10/7/13, Omid Mahdavi, UofA Micro/Nano Fab Center
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Table 1 – Allowable/Authorized Evaporation Material & Relevant Properties
Metal
Liner Material Layer Density z-value
(g.cm-3)
(Contact Staff)
Aluminum (Al)
1
2.70
8.17
Titanium (Ti)
Intermetallic
2
4.50
14.05
Copper (Cu)
Graphite
3
8.93
20.20
Chromium (Cr)
Graphite
4
7.20
28.94
Gold (Au)
Graphite
5
19.3
23.17
Platinum (Pt)
Graphite
6
21.4
36.06
Bismuth (Bi) **
Graphite
7
9.80
8.1
Nickel (Ni)
Intermetallic
8
8.91
26.66
Tellurium (Te) ** Intermetallic
9
6.25
9.3
Silver (Ag)
Graphite
10
10.5
16.68
Germanium (Ge)
Graphite
(11)
5.35
17.1
Quartz (SiO2)
Graphite
(11)
2.2
8.3
** - Both Bismuth & Tellurium require extensive preparation. Only MNFC staff are
allowed to evaporate these metals. Handling of Tellurium requires respiratory protection
equipment. You must contact the Staff Engineer to deposit any material not listed.
Rev. 6, 10/7/13, Omid Mahdavi, UofA Micro/Nano Fab Center
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Table 2 – Typical Evaporation Behavior in the MNFC Auto 306 E-beam
Evaporation System.
(This is only a guide. Dep rates vary depending on volume of material, beam conditions, etc.)
Metal
Chromium
(Cr)
Copper (Cu)
Germanium
(Ge)
Gold (Au)
8
4.5
47
Source-toSubstrate
Distance (cm)
28.6
13.3
(extension)
28.6
8
8
4.5
4.8
50
53
28.6
28.6
0.5
0.5
0.4
0.07
8
4.81
55
1.9
0.07
Gold (Au)
Gold (Au)
Nickel (Ni)
Nickel (Ni)
8
9.5
8
8
4.5
4.5
4.81
4.81
75
82
30
42
0.5
0.5
0.5
1.9
0.1
0.04
0.03
0.09
Platinum (Pt)
Platinum (Pt)
9.5
8
4.5
4.82
290
165
0.5
1.9
0.05
0.04
8
4.81
85
1.9
0.04
8 & 9.5
4.45
500
13.3
(extension)
28.6
28.6
28.6
13.3
(extension)
28.6
13.3
(extension)
13.3
(extension)
28.6
0.5
No Dep!
9.5
8
8
4.45
4.5
4.81
2
72
<10mA
28.6
28.6
13.3
0.5
0.5
1.9
0.2
0.04
0.1
Bismuth (Bi)
Bismuth (Bi)
Silver (Ag)
Tantalum
(Ta)**
Tellurium (Te)
Titanium (Ti)
Quartz (SiO2)
Pole Piece Voltage Current
Width
(kV)
(mA)
(mm)
10.5
4.5
9
8
4.81
6
Tooling
Factor
0.5
1.9
Dep.
Rate
(nm/sec)
0.2
0.31
0.5
0.08
Data compiled by Omid Mahdavi & Steve Orozco
** We were unable to process this metal on our tool. Do not attempt to evaporate!
Rev. 6, 10/7/13, Omid Mahdavi, UofA Micro/Nano Fab Center
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Figure 1 - Evaporation Behavior of Titanium at 4.5kV (8mm pole piece)
0.08
0.07
Deposition Rate (nm/s)
0.06
0.05
0.04
0.03
0.02
0.01
0
Data by Sean Essex
-0.01
0
10
20
30
40
50
60
70
80
90
100
Beam Current (mA)
Figure 2 – Acrylic Crucible Liner Holder for common Metals
Rev. 6, 10/7/13, Omid Mahdavi, UofA Micro/Nano Fab Center
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2cc Crucible Liner Dimensions
Reference Position for the Quartz Crystal Monitor (Adjustment by STAFF ONLY)
Ensure center of detector head is in the same y-plane as the center of the pocket
Z (vertical distance from detector head to z-plane of the hearth) = 4”
X (horizontal distance from the center of pocket to x-plane of the detector head) = 4”
Process Consumables
Liners (Graphite, Intermetallic): 2cc, Super Conductor Materials Inc.
Copper: Kurt J. Lesker, Pellets 1/8”x1/8”, 99.99%, EVMCU40EXEB or CERAC
Inc., 3mmx3mm pellets, 99.99%, C-2073
Gold: Kurt J. Lesker, <4mm pieces, 99.99% EVMAU40SHOT
Bismuth: Kurt J. Lesker, 2-4mm pieces, 99.999%, EVMBI2-4MMB
Chromium: Kurt J. Lesker,0.8-6.0mm, 99.95%, EVMCR35D
Titanium: CERAC Inc., 3mmx3mm pellets, 99.8%, T-2069
Germanium: Alfa Aesar, 2mm & down, 99.999%, stock#43986
Rev. 6, 10/7/13, Omid Mahdavi, UofA Micro/Nano Fab Center
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