LZ Series - 10W Amber Data Sheet

LZ Series - 10W Amber Data Sheet
High Luminous Efficacy
Amber LED Emitter
LZ4-00A100
Key Features

High Luminous Efficacy 10W Amber LED

Ultra-small foot print – 7.0mm x 7.0mm

Surface mount ceramic package with integrated glass lens

Very low Thermal Resistance (1.1°C/W)

Individually addressable die

Very high Luminous Flux density

JEDEC Level 1 for Moisture Sensitivity Level

Autoclave compliant (JEDEC JESD22-A102-C)

Lead (Pb) free and RoHS compliant

Reflow solderable (up to 6 cycles)

Emitter available on Serially Connected MCPCB (optional)
Typical Applications

Emergency vehicle lighting

Strobe and warning lights

Marine and buoy lighting

Aviation and obstruction lighting

Roadway beacons and traffic signaling

Architectural lighting

Automotive signal and marker lights
Description
The LZ4-00A100 Amber LED emitter provides 10W power in an extremely small package. With a 7.0mm x 7.0mm
ultra-small footprint, this package provides exceptional luminous flux density. LED Engin’s LZ4-00A100 LED offers
ultimate design flexibility with individually addressable die. The patent-pending design has unparalleled thermal
and optical performance. The high quality materials used in the package are chosen to optimize light output and
minimize stresses which results in monumental reliability and lumen maintenance. The robust product design
thrives in outdoor applications with high ambient temperatures and high humidity.
LZ4-00A100 (5.3-01/16/13)
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Part number options
Base part number
Part number
Description
LZ4-00A100-xxxx
LZ4 emitter
LZ4-40A100-xxxx
LZ4 emitter on Standard Star 1 channel MCPCB
Notes:
1. See “Part Number Nomenclature” for full overview on LED Engin part number nomenclature.
Bin kit option codes
A1, Amber (590nm)
Kit number
suffix
Min
flux
Bin
Color Bin Range
0000
Q
A3 – A6
0A45
Q
A4 – A5
Description
full distribution flux; full distribution
wavelength
full distribution flux; wavelength A4 and
A5 bins
Notes:
1. Default bin kit option is -0000
LZ4-00A100 (5.3-01/16/13)
2
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Luminous Flux Bins
Table 1:
Bin Code
Minimum
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
(lm)
Maximum
Luminous Flux (ΦV)
@ IF = 700mA [1,2]
(lm)
Q
228
285
R
285
356
Notes for Table 1:
1.
Luminous flux performance guaranteed within published operating conditions.
2.
LED Engin maintains a tolerance of ± 10% on flux measurements.
3.
Future products will have even higher levels of luminous flux performance. Contact LED Engin Sales for updated information.
Dominant Wavelength Bins
Table 2:
Bin Code
Minimum
Dominant Wavelength (λD)
@ IF = 700mA [1,2]
(nm)
Maximum
Dominant Wavelength (λD)
@ IF = 700mA [1,2]
(nm)
A3
587.5
590
A4
590
592.5
A5
592.5
595
A6
595
597.5
Notes for Table 2:
1.
Dominant wavelength is derived from the CIE 1931 Chromaticity Diagram and represents the perceived hue.
2.
LED Engin maintains a tolerance of ± 1.0nm on dominant wavelength measurements.
Forward Voltage Bins
Table 3:
Bin Code
Minimum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
Maximum
Forward Voltage (VF)
@ IF = 700mA [1,2]
(V)
0
8.96
11.60
Notes for Table 3:
1.
LED Engin maintains a tolerance of ± 0.04V for forward voltage measurements.
2.
Forward Voltage is binned with all four LED dice connected in series.
LZ4-00A100 (5.3-01/16/13)
3
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Absolute Maximum Ratings
Table 4:
Parameter
Symbol
Value
Unit
IF
IF
IFP
VR
Tstg
TJ
Tsol
1200
1000
1500
See Note 3
-40 ~ +125
125
260
6
mA
mA
[1]
DC Forward Current at Tjmax=100°C
DC Forward Current at Tjmax=125°C [1]
Peak Pulsed Forward Current [2]
Reverse Voltage
Storage Temperature
Junction Temperature
Soldering Temperature [4]
Allowable Reflow Cycles
mA
V
°C
°C
°C
Autoclave Conditions [5]
121°C at 2 ATM,
100% RH for 168 hours
ESD Sensitivity [6]
> 8,000 V HBM
Class 3B JESD22-A114-D
Notes for Table 4:
1.
Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature.
Follow the curves in Figure 10 for current derating.
2:
Pulse forward current conditions: Pulse Width ≤ 10msec and Duty Cycle ≤ 10%.
3.
LEDs are not designed to be reverse biased.
4.
Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 3.
5.
Autoclave Conditions per JEDEC JESD22-A102-C.
6.
LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZ4-00A100
in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1.
Optical Characteristics @ TC = 25°C
Table 5:
Parameter
Symbol
Typical
Unit
Luminous Flux (@ IF = 700mA) [1]
Luminous Flux (@ IF = 1000mA) [1]
Dominant Wavelength [2]
Viewing Angle [3]
Total Included Angle [4]
ΦV
ΦV
λD
2Θ1/2
Θ0.9V
325
420
590
95
110
lm
lm
nm
Degrees
Degrees
Notes for Table 5:
1.
Luminous flux typical value is for all four LED dice operating concurrently at rated current.
2.
Amber LEDs have a significant shift in wavelength over temperature; please refer to Figure 6 for details. Caution must be exercised if designing to meet a
regulated color space due to this behavior as product may shift out of legal color space under elevated temperatures.
3.
Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value.
4.
Total Included Angle is the total angle that includes 90% of the total luminous flux.
Electrical Characteristics @ TC = 25°C
Table 6:
Parameter
Symbol
Typical
Unit
Forward Voltage (@ IF = 700mA)
Forward Voltage (@ IF = 1000mA) [1]
VF
VF
9.0
9.8
V
V
Temperature Coefficient
of Forward Voltage [1]
ΔVF/ΔTJ
-11.2
mV/°C
Thermal Resistance
(Junction to Case)
RΘJ-C
1.1
°C/W
[1]
Notes for Table 6:
1.
Forward Voltage typical value is for all four LED dice connected in series.
LZ4-00A100 (5.3-01/16/13)
4
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
IPC/JEDEC Moisture Sensitivity Level
Table 7 - IPC/JEDEC J-STD-20D MSL Classification:
Soak Requirements
Floor Life
Standard
Accelerated
Level
Time
Conditions
Time (hrs)
Conditions
Time (hrs)
Conditions
1
Unlimited
≤ 30°C/
85% RH
168
+5/-0
85°C/
85% RH
n/a
n/a
Notes for Table 7:
1.
The standard soak time is the sum of the default value of 24 hours for the semiconductor manufacturer’s exposure time (MET) between bake and bag
and the floor life of maximum time allowed out of the bag at the end user of distributor’s facility.
Average Lumen Maintenance Projections
Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for
solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original
light output remaining at a defined time period.
Based on long-term WHTOL testing, LED Engin projects that the LZ Series will deliver, on average, 70% Lumen
Maintenance at 65,000 hours of operation at a forward current of
700 mA per die. This projection is based on constant current operation with junction temperature maintained at
or below 110°C.
LZ4-00A100 (5.3-01/16/13)
5
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Mechanical Dimensions (mm)
Pin Out
1
Pad
Die
1
A
Anode
2
A
Cathode
3
B
Anode
4
B
Cathode
5
C
Anode
6
C
Cathode
7
D
Anode
8
D
Cathode
9 [2]
n/a
Thermal
2
Function
3
8
Figure 1: Package outline drawing.
4
7
6
5
Notes for Figure 1:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
Thermal contact, Pad 9, is electrically neutral.
Recommended Solder Pad Layout (mm)
Figure 2a: Recommended solder pad layout for anode, cathode, and thermal pad.
Note for Figure 2a:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
2.
This pad layout is “patent pending”.
LZ4-00A100 (5.3-01/16/13)
6
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Recommended Solder Mask Layout (mm)
Figure 2b: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad.
Note for Figure 2b:
1.
Unless otherwise noted, the tolerance = ± 0.20 mm.
Reflow Soldering Profile
Figure 3: Reflow soldering profile for lead free soldering.
LZ4-00A100 (5.3-01/16/13)
7
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Radiation Pattern
100
90
Relative Intensity (%)
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Angular Displacement (Degrees)
Figure 4: Typical representative spatial radiation pattern.
Typical Relative Spectral Power Distribution
1
0.9
Relative Spectral Power
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
400
450
500
550
600
650
700
Wavelength (nm)
Figure 5: Relative spectral power vs. wavelength @ TC = 25°C.
LZ4-00A100 (5.3-01/16/13)
8
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Dominant Wavelength Shift over Temperature
Dominant Wavelength Shift (nm)
8
7
6
5
4
3
2
1
0
0
20
40
60
80
100
800
1000
Case Temperature (ºC)
Figure 6: Typical dominant wavelength shift vs. case temperature.
Typical Relative Light Output
140
Relative Light Output (%)
120
100
80
60
40
20
0
0
200
400
600
IF - Forward Current (mA)
Figure 7: Typical relative light output vs. forward current @ TC = 25°C.
LZ4-00A100 (5.3-01/16/13)
9
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Typical Relative Light Output over Temperature
160
Relative Light Output (%)
140
120
100
80
60
40
20
0
0
20
40
60
80
100
Case Temperature (ºC)
Figure 8: Typical relative light output vs. case temperature.
Typical Forward Current Characteristics
1200
IF - Forward Current (mA)
1000
800
600
400
200
0
7
7.5
8
8.5
9
9.5
10
10.5
11
11.5
12
VF - Forward Voltage (V)
Figure 9: Typical forward current vs. forward voltage @ TC = 25°C.
Note for Figure 9:
1.
Forward Voltage curve assumes that all four LED dice are connected in series.
LZ4-00A100 (5.3-01/16/13)
10
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Current De-rating
IF - Maximum Current (mA)
1200
1000
800
700
(Rated)
600
RΘJ-A = 4.0°C/W
RΘJ-A = 5.0°C/W
RΘJ-A = 6.0°C/W
400
200
0
0
25
50
75
100
125
Maximum Ambient Temperature (°C)
Figure 10: Maximum forward current vs. ambient temperature based on TJ(MAX) = 125°C.
Notes for Figure 10:
1.
Maximum current assumes that all four LED dice are operating concurrently at the same current.
2.
RΘJ-C [Junction to Case Thermal Resistance] for the LZ4-00A100 is typically 1.1°C/W.
3.
RΘJ-A [Junction to Ambient Thermal Resistance] = RΘJ-C + RΘC-A [Case to Ambient Thermal Resistance].
LZ4-00A100 (5.3-01/16/13)
11
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Emitter Tape and Reel Specifications (mm)
Figure 11: Emitter carrier tape specifications (mm).
Figure 12: Emitter Reel specifications (mm).
LZ4-00A100 (5.3-01/16/13)
12
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Part-number Nomenclature
The LZ Series base part number designation is defined as follows:
LZA–BCDEFG–HIJK
A – designates the number of LED die in the package
1
for single die emitter package
4
for 4-die emitter package
9
for 9-die emitter package
C
for 12-die emitter package
P
for 25-die emitter package
B – designates the package level
0
for Emitter only
Other letters indicate the addition of a MCPCB. See appendix “MCPCB options” for details
C – designates the radiation pattern
0
for Clear domed lens (Lambertian radiation pattern)
1
for Flat-top
3
for Frosted domed lens
D and E – designates the color
U6
Ultra Violet (365nm)
UA
Violet (400nm)
DB
Dental Blue (460nm)
B2
Blue (465nm)
G1
Green (525nm)
A1
Amber (590nm)
R1
Red (623nm)
R2
Deep Red (660nm)
R3
Far Red (740nm)
R4
Infrared (850nm)
WW
Warm White (2700K-3500K)
W9
Warm White CRI 90 Minimum (2700K-3500K)
NW
Neutral White (4000K)
CW
Cool White (5500K-6500K)
W2
Warm & Cool White mixed dies
MC
RGB
MA
RGBA
MD
RGBW (6500K)
F and G – designates the package options if applicable
See “Base part number” on page 2 for details. Default is “00”
H, I, J, K – designates kit options
See “Bin kit options” on page 2 for details. Default is “0000”
Ordering information:
For ordering LED Engin products, please reference the base part number above. The base part number represents
our standard full distribution flux and wavelength range. Other standard bin combinations can be found on page 2.
For ordering products with custom bin selections, please contact a LED Engin sales representative or authorized
distributor.
LZ4-00A100 (5.3-01/16/13)
13
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ4 MCPCB Family
Part number
Type of MCPCB
Diameter
(mm)
LZ4-4xxxxx
1-channel
19.9
Emitter + MCPCB
Typical Vf Typical If
Thermal Resistance
(V)
(mA)
(oC/W)
1.1 + 1.1 = 2.2
9.0
700

Mechanical Mounting of MCPCB
o Mechanical stress on the emitter that could be caused by bending the MCPCB should be avoided. The
stress can cause the substrate to crack and as a result might lead to cracks in the dies.
o Therefore special attention needs to be paid to the flatness of the heat sink surface and the torque
on the screws. Maximum torque should not exceed 1 Nm (8.9 lbf/in).
o Care must be taken when securing the board to the heatsink to eliminate bending of the MCPCB. This
can be done by tightening the three M3 screws (or #4-40) in steps and not all at once. This is
analogous to tightening a wheel of an automobile
o It is recommended to always use plastic washers in combination with three screws. Two screws could
more easily lead to bending of the board.
o If non taped holes are used with self-tapping screws it is advised to back out the screws slightly after
tighten (with controlled torque) and retighten the screws again.

Thermal interface material
o To properly transfer the heat from the LED to the heatsink a thermally conductive material is required
when mounting the MCPCB to the heatsink
o There are several materials which can be used as thermal interface material, such as thermal paste,
thermal pads, phase change materials and thermal epoxies. Each has pro’s and con’s depending on
the application. For our emitter it is critical to verify that the thermal resistance is sufficient for the
selected emitter and its environment.
o To properly transfer the heat from the MCPCB to the heatsink also special attention should be paid to
the flatness of the heatsink.

Wire soldering
o For easy soldering of wires to the MCPCB it is advised to preheat the MCPCB on a hot plate to a
maximum of 150°. Subsequently apply the solder and additional heat from the solder iron to initiate a
good solder reflow. It is recommended to use a solder iron of more than 60W. We advise to use lead
free, no-clean solder. For example SN-96.5 AG-3.0 CU 0.5 #58/275 from Kester (pn: 24-7068-7601)
LZ4-00A100 (5.3-01/16/13)
14
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
LZ4-4xxxxx
1 channel, Standard Star MCPCB (1x4) Dimensions (mm)
Notes:
•
Unless otherwise noted, the tolerance = ± 0.2 mm.
•
Slots in MCPCB are for M3 or #4-40 mounting screws.
•
LED Engin recommends plastic washers to electrically insulate screws from solder pads and electrical traces.
•
Electrical connection pads on MCPCB are labeled “+” for Anode and “-” for Cathode
•
LED Engin recommends thermal interface material when attaching the MCPCB to a heatsink
•
The thermal resistance of the MCPCB is: RΘC-B 1.1°C/W
Components used
MCPCB:
ESD chips:
HT04503
BZX585-C30
(Bergquist)
(NPX, for 4 LED dies in series)
Pad layout
Ch.
1
MCPCB
Pad
+
String/die
Function
1/ABCD
Cathode Anode +
LZ4-00A100 (5.3-01/16/13)
15
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Company Information
LED Engin, Inc., based in California’s Silicon Valley, specializes in ultra-bright, ultra compact solid state lighting
solutions allowing lighting designers & engineers the freedom to create uncompromised yet energy efficient
lighting experiences. The LuxiGen™ Platform — an emitter and lens combination or integrated module solution,
delivers superior flexibility in light output, ranging from 3W to 90W, a wide spectrum of available colors, including
whites, multi-color and UV, and the ability to deliver upwards of 5,000 high quality lumens to a target. The small
size combined with powerful output allows for a previously unobtainable freedom of design wherever high-flux
density, directional light is required. LED Engin’s packaging technologies lead the industry with products that
feature lowest thermal resistance, highest flux density and consummate reliability, enabling compact and efficient
solid state lighting solutions.
LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions.
LED Engin reserves the right to make changes to improve performance without notice.
Please contact sales@ledengin.com or (408) 922-7200 for more information.
LZ4-00A100 (5.3-01/16/13)
16
LED Engin | 651 River Oaks Parkway | San Jose, CA 95134 USA | ph +1 408 922 7200 | fax +1 408 922 0158 | em sales@ledengin.com | www.ledengin.com
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising