Intel BOXDX79SR Specification

Intel® Desktop Board

DX79SR

Technical Product Specification

November 2013

Order Number: G62925-003

The Intel

®

Desktop Board DX79SR may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DX79SR Specification Update.

ii

Revision History

Revision

-001

-002

-003


First release of the Intel ® Desktop Board DX79SR Technical Product

Specification

Specification Clarification

Specification Clarification

Date

April 2012

October 2012

November 2013

This product specification applies to only the standard Intel

®

Desktop Board DX79SR with BIOS identifier SIX7910J.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL

®

PRODUCTS. NO LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS

GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR

SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR

IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR

WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT

OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN

WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN

WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR

DEATH MAY OCCUR.

All Intel ® desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by

Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Intel, Intel Core, and Xeon are trademarks of Intel Corporation in the U.S. and/or other countries.

* Other names and brands may be claimed as the property of others.

Copyright  2012, 2013 Intel Corporation. All rights reserved.

Board Identification Information

Basic Desktop Board DX79SR Identification Information

AA Revision BIOS Revision

G57199-201 SIX7910J.0281

Notes

1,2

Notes:

1. The AA number is found on a small label on the component side of the board.

2. The X79 chipset used on this AA revision consists of the following component:

Device Stepping S-Spec Numbers

82X79 Express Chipset C1 SLJN7

Specification Changes or Clarifications

The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel

®

Desktop Board DX79SR.

Specification Changes or Clarifications

Date

October 2012

Type of Change Description of Change or Clarification

Spec Clarification

Updated Table 30. Environmental Specifications to address

operating temperature requirements for the board.

November 2013 Spec Clarification

Updated Section 1.5 System Memory.

Errata

Current characterized errata, if any, are documented in a separate Specification

Update. See http://www.intel.com/content/www/us/en/motherboards/desktopmotherboards/motherboards.html?wapkw=desktop+boards for the latest documentation. iii

Intel Desktop Board DX79SR Technical Product Specification

iv

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the

Intel

®

Desktop Board DX79SR.

Intended Audience

The TPS is intended to provide detailed, technical information about the Intel Desktop

Board DX79SR and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

3

4

5

Chapter Description

1 A description of the hardware used on the Intel Desktop Board DX79SR

2 A map of the resources of the Intel Desktop Board

The features supported by the BIOS Setup program

A description of the BIOS error messages, beep codes, and POST codes

Regulatory compliance and battery disposal information

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

v


Other Common Notation

#

GB

GB/s

Gb/s

KB

Kbit kbits/s

MB

MB/s

Mbit

Mbits/s xxh x.x V

*

Used after a signal name to identify an active-low signal (such as USBP0#)

Gigabyte (1,073,741,824 bytes)

Gigabytes per second

Gigabits per second

Kilobyte (1024 bytes)

Kilobit (1024 bits)

1000 bits per second

Megabyte (1,048,576 bytes)

Megabytes per second

Megabit (1,048,576 bits)

Megabits per second

An address or data value ending with a lowercase h indicates a hexadecimal value.

Volts. Voltages are DC unless otherwise specified.

This symbol is used to indicate third-party brands and names that are the property of their respective owners. vi

Contents


Board Identification Information .................................................................. iii

Specification Changes or Clarifications ......................................................... iii

Errata ...................................................................................................... iii

Preface

Intended Audience ..................................................................................... v

What This Document Contains ..................................................................... v

Typographical Conventions ......................................................................... v

1 Product Description

1.1 Overview ......................................................................................... 11

1.1.1 Feature Summary ................................................................. 11

1.1.2 Board Layout ........................................................................ 13

1.1.3 Block Diagram ...................................................................... 15

1.2 Legacy Considerations ....................................................................... 16

1.3 Online Support ................................................................................. 16

1.4 Processor ........................................................................................ 16

1.4.1 PCI Express x16 Graphics ....................................................... 17

1.5 System Memory ............................................................................... 17

1.5.1 Memory Configurations .......................................................... 19

1.6 Intel

®

X79 Express Chipset ................................................................ 21

1.6.1 USB ..................................................................................... 21

1.6.2 SATA Interfaces .................................................................... 22

1.7 Real-Time Clock Subsystem ............................................................... 23

1.8 Legacy I/O Controller ........................................................................ 23

1.8.1 Consumer Infrared (CIR) ........................................................ 23

1.9 Audio Subsystem .............................................................................. 24

1.9.1 Audio Subsystem Software ..................................................... 24

1.9.2 Audio Subsystem Components ................................................ 24

1.10 LAN Subsystem ................................................................................ 26

1.10.1 Intel

®

82579L and Intel

®

82574L Gigabit Ethernet Controllers .... 26

1.10.2 LAN Subsystem Software ....................................................... 27

1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 27

1.11 Bluetooth*/WiFi Module ..................................................................... 28

1.11.1 Bluetooth Technology ............................................................ 28

1.11.2 WiFi 802.11 Wireless ............................................................. 29

1.12 Hardware Management Subsystem ..................................................... 29

1.12.1 Hardware Monitoring and Fan Control ...................................... 29

1.12.2 Fan Monitoring ...................................................................... 30

1.12.3 Chassis Intrusion and Detection .............................................. 30

1.12.4 Thermal Monitoring ............................................................... 31

vii


1.13 Power Management .......................................................................... 32

1.13.1 ACPI .................................................................................... 32

1.13.2 Hardware Support ................................................................. 35

1.14 Board Status LEDs ............................................................................ 38

1.15 Onboard Power and Reset Buttons ...................................................... 41

2 Technical Reference

2.1 Memory Resources ........................................................................... 43

2.1.1 Addressable Memory.............................................................. 43

2.1.2 Memory Map ......................................................................... 45

2.2 Connectors and Headers .................................................................... 45

2.2.1 Back Panel Connectors ........................................................... 46

2.2.2 Component-side Connectors and Headers ................................. 48

2.3 Jumper Block ................................................................................... 58

2.4 Mechanical Considerations ................................................................. 60

2.4.1 Form Factor .......................................................................... 60

2.5 Electrical Considerations .................................................................... 61

2.5.1 Power Supply Considerations .................................................. 61

2.5.2 Fan Header Current Capability ................................................ 62

2.5.3 Add-in Board Considerations ................................................... 62

2.6 Thermal Considerations ..................................................................... 63

2.7 Reliability ........................................................................................ 65

2.8 Environmental .................................................................................. 65

3 Overview of BIOS Features

3.1 Introduction ..................................................................................... 67

3.2 BIOS Flash Memory Organization ........................................................ 68

3.3 Resource Configuration ..................................................................... 68

3.3.1 PCI Autoconfiguration ............................................................ 68

3.4 System Management BIOS (SMBIOS) ................................................. 69

3.5 Legacy USB Support ......................................................................... 69

3.6 BIOS Updates .................................................................................. 70

3.6.1 Language Support ................................................................. 70

3.6.2 Custom Splash Screen ........................................................... 71

3.7 BIOS Recovery ................................................................................. 71

3.8 Boot Options .................................................................................... 72

3.8.1 Optical Drive Boot ................................................................. 72

3.8.2 Network Boot ........................................................................ 72

3.8.3 Booting Without Attached Devices ........................................... 72

3.8.4 Changing the Default Boot Device During POST ......................... 72

3.9 Adjusting Boot Speed ........................................................................ 73

3.9.1 Peripheral Selection and Configuration ..................................... 73

3.9.2 BIOS Boot Optimizations ........................................................ 73

3.10 BIOS Security Features ..................................................................... 74

3.11 BIOS Performance Features ............................................................... 75

viii

Contents

4 Error Messages and Beep Codes

4.1 Speaker .......................................................................................... 77

4.2 BIOS Beep Codes ............................................................................. 77

4.3 Front-panel Power LED Blink Codes ..................................................... 78

4.4 BIOS Error Messages ........................................................................ 78

4.5 Port 80h POST Codes ........................................................................ 79

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance ...................................................................... 85

5.1.1 Safety Standards................................................................... 85

5.1.2 European Union Declaration of Conformity Statement ................ 86

5.1.3 Product Ecology Statements ................................................... 87

5.1.4 EMC Regulations ................................................................... 89

5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 92

5.1.6 Regulatory Compliance Marks (Board Level) ............................. 93

5.2 Battery Disposal Information .............................................................. 94

Figures

1. Major Board Components .................................................................. 13

2. Block Diagram .................................................................................. 15

3. Memory Channel and DIMM Configuration ............................................ 20

4. Back Panel Audio Connectors ............................................................. 25

5. LAN Connector LED Locations ............................................................. 27

6. Bluetooth/WiFi Module ...................................................................... 28

7. Thermal Sensors and Fan Headers ...................................................... 31

8. Location of Board Status LEDs ............................................................ 39

9. Location of the Onboard Power and Reset Buttons ................................ 41

10. Detailed System Memory Address Map ................................................ 44

11. Back Panel Connectors ...................................................................... 46

12. I/O Shield Reference Diagram ............................................................ 47

13. Component-side Connectors and Headers ............................................ 48

14. Connection Diagram for Front Panel Header ......................................... 55

15. Connection Diagram for Front Panel USB 2.0 Headers ........................... 57

16. Location of the Jumper Block ............................................................. 58

17. Board Dimensions ............................................................................. 60

18. Localized High Temperature Zones ..................................................... 64

Tables

1. Feature Summary ............................................................................. 11

2. Components Shown in Figure 1 .......................................................... 14

3. Supported Memory Configurations ...................................................... 18

4. Audio Jack Support ........................................................................... 24

5. LAN Connector LED States ................................................................. 27

6. Effects of Pressing the Power Switch ................................................... 32

7. Power States and Targeted System Power ........................................... 33

ix


8. Wake-up Devices and Events ............................................................. 34

9. Board Status LEDs ............................................................................ 40

10. System Memory Map......................................................................... 45

11. Component-side Connectors and Headers Shown in Figure 13 ................ 49

12. Front Panel Audio Header for Intel HD Audio ........................................ 50

13. Front Panel Audio Header for AC ’97 Audio ........................................... 50

14. IEEE 1394a Header ........................................................................... 51

15. SATA Connectors .............................................................................. 51

16. S/PDIF Header ................................................................................. 51

17. USB 2.0 Headers .............................................................................. 51

18. USB 3.0 Connector ........................................................................... 52

19. Chassis Intrusion Header ................................................................... 52

20. Processor, Front and Rear Chassis, and Auxiliary (4-Pin) Fan Headers ..... 52

21. Processor Core Power Connector ........................................................ 54

22. Main Power Connector ....................................................................... 54

23. Front Panel Header ........................................................................... 55

24. States for a One-Color Power LED ....................................................... 56

25. States for a Two-Color Power LED....................................................... 56

26. BIOS Setup Configuration Jumper Settings .......................................... 59

27. Recommended Power Supply Current Values ........................................ 61

28. Fan Header Current Capability ............................................................ 62

29. Thermal Considerations for Components .............................................. 64

30. Environmental Specifications .............................................................. 65

31. BIOS Setup Program Menu Bar ........................................................... 68

32. BIOS Setup Program Function Keys .................................................... 68

33. Acceptable Drives/Media Types for BIOS Recovery ................................ 71

34. Boot Device Menu Options ................................................................. 72

35. Supervisor and User Password Functions ............................................. 74

36. BIOS Beep Codes ............................................................................. 77

37. Front-panel Power LED Blink Codes ..................................................... 78

38. BIOS Error Messages ........................................................................ 78

39. Port 80h POST Code Ranges .............................................................. 79

40. Port 80h POST Codes ........................................................................ 80

41. Typical Port 80h POST Sequence ........................................................ 84

42. Safety Standards .............................................................................. 85

43. EMC Regulations ............................................................................... 89

44. Regulatory Compliance Marks ............................................................ 93

x

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the board.

Table 1. Feature Summary

Form Factor

ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])

Processor

Memory

Chipset

• Intel

® Core™ i7 and Intel ® Xeon ® processors in an LGA 2011 socket:

― Two PCI Express 3.0 x16 graphics interfaces

― One PCI Express 3.0 x16 graphics interface (x8 electrical)

― Four DDR3 memory channels (Quad Channel total of 8 DIMMs)

• Eight 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets arranged as four channels

• Support for DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and

1066 MHz DIMMs

• Support for 1 Gb, 2 Gb, and 4 Gb memory technology

• Support for up to 64 GB of system memory with eight DIMMs using 4 Gb memory technology

• Support for non-ECC and ECC memory

• Support for 1.35 V low voltage JEDEC memory

• Support for XMP memory

• Support for manual memory over clocking (voltage, clock, ratio)

Intel

®

X79 Express Chipset consisting of the Intel

®

X79 Platform Controller

Hub (PCH)

Audio

Intel ® High Definition Audio subsystem using the Realtek* ALC892 audio codec

Legacy I/O Control Nuvoton* legacy I/O controller for Consumer Infrared (CIR)

Peripheral

Interfaces

Wireless Module

Six USB 3.0 ports:

• Four USB 3.0 ports are implemented with stacked back panel connectors

(blue)

• Two front panel USB 3.0 ports are implemented through one internal connector

(blue)

• Fourteen USB 2.0 ports:

― Six ports are implemented with stacked back panel connectors (black)

― Eight front panel ports implemented through four internal headers

Eight Serial ATA (SATA) ports:

• Two SATA 6.0 Gb/s interfaces through the Intel X79 Express Chipset with

Intel

®

Rapid Storage Technology RAID support (blue)

• Two Serial ATA (SATA) 6.0 Gb/s interfaces through a Marvell 88SE9128 controller (gray)

• Four internal SATA 3.0 Gb/s interfaces through the Intel X79 Express Chipset with Intel Rapid Storage Technology RAID support (black)

• Two IEEE 1394a ports:

― One port via a back panel connector

― One port via a front-panel header (blue)

• Separate module that provides both Bluetooth* and WiFi is included continued

11


Table 1. Feature Summary (continued)

BIOS

Instantly Available

PC Technology

LAN Support

Expansion

Capabilities

Hardware Monitor

Subsystem

• Intel

® BIOS resident in the SPI Flash device

• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS

• Fast Boot

• Support for advanced over clocking

• Support for PCI* Local Bus Specification Revision 2.3

• Support for PCI Express* Revision 3.0

• Suspend to RAM support

• Wake on PCI, PCI Express, LAN, front panel, CIR, and USB ports

Dual-Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel

®

Intel ® 82574L Gigabit Ethernet Controllers

82579L and

• Two PCI Express 3.0 x16 connectors

• One PCI Express 3.0 x16 connector (x8 electrical)

• Two PCI Express 2.0 x1 bus add-in card connectors from the PCH

• One Conventional PCI bus add-in card connector from the PCH

• Hardware monitoring and fan control through the Nuvoton I/O controller

• Voltage sense to detect out of range power supply voltages

• Thermal sense to detect out of range thermal values

• Four fan headers using PWM control

• Four fan sense inputs used to monitor fan activity

• Fan speed control using voltage control (4-pin fan headers for processor, front, rear, and auxiliary) with selectable support in BIOS for 3 wire fans

• Support for Platform Environmental Control Interface (PECI)

12

Product Description

1.1.2 Board Layout

Figure 1 shows the location of the major components on Intel Desktop Board DX79SR.

Figure 1. Major Board Components

Table 2 lists the components identified in Figure 1.

13


Table 2. Components Shown in Figure 1

Label Description

A Front panel audio header

X

Y

Z

AA

BB

CC

DD

EE

S

T

U

V

W

N

O

P

Q

R

K

L

M

H

I

J

E

F

G

B

C

D

LL

MM

NN

OO

PP

QQ

RR

SS

TT

FF

GG

HH

II

JJ

KK

PCI Express x1 add-in card connector

S/PDIF out header

PCI Express 3.0 x16 add-in card connector (x8 electrical)

Piezoelectric speaker

Conventional PCI add-in card connector

PCI Express 3.0 x16 add-in card connector



Rear chassis fan header

Battery

Back panel connectors

Processor fan header

DIMM 1 (Channel A, DIMM 0)

DIMM 5 (Channel A, DIMM 1)

DIMM 2 (Channel B, DIMM 0)

DIMM 6 (Channel B, DIMM 1)

LGA 2011 processor socket

12 V processor core voltage connector (2 x 4 pin)

DIMM 8 (Channel D, DIMM 1)

DIMM 4 (Channel D, DIMM 0)

DIMM 7 (Channel C, DIMM 1)

DIMM 3 (Channel C, DIMM 0)

Main power connector (2 x 12 pin)

Remote thermal probe header

Front chassis fan header

SATA 6.0 Gb/s connectors through the PCH (blue)

SATA 3.0 Gb/s connectors through the PCH (black)

SATA 6.0 Gb/s connectors through a Marvell 88SE9128 controller (gray)

Intel X79 Express Chipset

Front panel USB 2.0 headers (4)

Consumer IR emitter (output) header

BIOS Setup configuration jumper block

Power Fault LED

Front panel USB 3.0 connector

Alternate front panel power LED header

Consumer IR receiver (input) header

Voltage measurement test points

Front panel header

Post Code LED display

Front panel IEEE 1394a header

Onboard Reset button

Onboard Power button

Chassis intrusion header

Auxiliary fan header

Board Status LEDs

14


1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.

Figure 2. Block Diagram

15


1.2 Legacy Considerations

This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following:

• No parallel port connector

• No floppy drive connector

• No PS/2 connectors

1.3 Online Support

To find information about… Visit this World Wide Web site:

Intel Desktop Board DX79SR http://www.intel.com/products/motherboard/index.htm

Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support

Available configurations for the Intel

Desktop Board DX79SR

Supported processors

Chipset information

BIOS and driver updates

Tested memory

Integration information http://ark.intel.com http://processormatch.intel.com http://www.intel.com/products/desktop/chipsets/index.htm http://downloadcenter.intel.com http://www.intel.com/support/motherboards/desktop/sb/CS-

025414.htm http://www.intel.com/support/go/buildit

1.4 Processor

The board is designed to support Intel Core i7 and Intel Xeon processors in an

LGA 2011 socket.

Other processors may be supported in the future. This board is designed to support processors with a maximum wattage of 130 W with margin to allow for greater than

200 W operation. The processors listed above are only supported when falling within the wattage requirements of the Intel Desktop Board DX79SR. See the Intel web site listed below for the most up-to-date list of supported processors.

For information about…

Supported processors

Refer to:

http://processormatch.intel.com

CAUTION

Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power supply.

NOTE

This board has specific requirements for providing power to the processor. Refer to

Section 2.5.1 on page 61 for information on power supply requirements for this board.

16


1.4.1 PCI Express x16 Graphics

Intel Core i7 and Intel Xeon processors in an LGA2011 package support PCI Express add-in graphics cards via the board’s PCI Express x16 connectors. These processors support the following generations of PCI Express:

• PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of

8.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16 interface is 16 GB/s in each direction, simultaneously, for a bandwidth of 32 GB/s.

• PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of


• PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of


For information about

PCI Express technology

Refer to

http://www.pcisig.com

1.5 System Memory

The board has eight DIMM sockets and supports the following memory features:

• 1.35 V DDR3 SDRAM DIMMs (JEDEC Specification)

• Four independent memory channels with interleaved mode support

• Unbuffered, single-sided or double-sided DIMMs with the following restriction:

 Double-sided DIMMs with x16 organization are not supported.

 Double-sided 2400 MHz DIMMs are not supported.

• 64 GB maximum total system memory (using 4 Gb memory technology). Refer to

Section 2.1.1 on page 43 for information on the total amount of addressable

memory.

• Minimum total system memory: 1 GB using 512 MB x16 module

• Non-ECC and ECC DIMMs

• Serial Presence Detect

• DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and 1066 MHz

SDRAM DIMMs

• XMP performance profile support for memory speeds above 1600 MHz

• DIMM slots are numbered in installation order

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance.

17


CAUTION

1.5 V is the recommended and default setting for DDR3 memory voltage. The other memory voltage settings in the BIOS Setup program are provided for performance tuning purposes only. Altering the memory voltage may (i) reduce system stability and the useful life of the system, memory, and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance;

(iv) cause additional heat or other damage; and (v) affect system data integrity.

Intel has not tested and does not warranty the operation of the processor beyond its specifications. For information on the processor warranty, refer to http://www.intel.com/support/processors/sb/CS-

020033.htm?wapkw=(processor+warranty) .

Intel assumes no responsibility that the memory installed on the desktop board, if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. Check with the memory manufacturer for warranty terms and additional

details.

Table 3 lists the supported DIMM configurations.

Table 3. Supported Memory Configurations

DIMM

Capacity

512 MB

1024 MB

1024 MB

2048 MB

2048 MB

4096 MB

SS

DS

SS

DS

Configuration

(Note)

SS

SS

SDRAM

Density

1 Gbit

1 Gbit

2 Gbit

1 Gbit

2 Gbit

2 Gbit

SDRAM Organization

Front-side/Back-side

64 M x16/empty

128 M x8/empty

128 M x16/empty

128 M x8/128 M x8

128 M x16/empty

256 M x8/256 M x8

4

16

8

16

Number of SDRAM

Devices

4

8

4096 MB

8192 MB

SS

DS

4 Gbit

4 Gbit

512 M x8/empty

512 M x8/512 M x8

8

16

Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to single-sided memory modules (containing one row of SDRAM).

For information about…

Tested Memory

XMP Tested Memory

Refer to:

http://support.intel.com/support/motherboards/desktop/sb/CS-

025414.htm http://www.intel.com/personal/gaming/extremememory.htm

18


1.5.1 Memory Configurations

The Intel Core i7 and Intel Xeon processors support the following types of memory organization:

• Quad channel (Interleaved) mode. This mode offers the highest throughput for real world applications.

• Tri channel (Interleaved) mode. Tri channel mode is enabled when the installed memory capacities of any three DIMM channels are equal.

• Dual channel (Interleaved) mode. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.

• Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.

For information about… Refer to:

Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-

011965.htm

19


Figure 3 illustrates the memory channel and DIMM configuration.

20

Figure 3. Memory Channel and DIMM Configuration

NOTE

For best memory performance always install memory into the blue DIMM memory sockets if installing four DIMMs or less in your configuration.


1.6 Intel

®

X79 Express Chipset

The Intel X79 Express Chipset consisting of the Intel X79 Platform Controller Hub

(PCH) provides interfaces to the processor and the USB, SATA, LAN, PCI, and PCI

Express interfaces. The PCH is a centralized controller for the board’s I/O paths.

For information about Refer to

The Intel X79 Express Chipset

Resources used by the chipset http://www.intel.com/products/desktop/chipsets/index.htm

Chapter 2

1.6.1 USB

The board supports up to 14 USB 2.0 ports and six USB 3.0 ports.

The Intel X79 Express Chipset provides the USB controller for the 2.0 ports. The six

USB 3.0 ports are provided by two NEC* UPD720200 controllers. The port arrangement is as follows:

• Four USB 3.0 ports are implemented with stacked back panel connectors (blue)

• Two USB 3.0 front panel ports implemented through one internal connector (blue)

• Six USB 2.0 ports are implemented with stacked back panel connectors (black)

• Eight USB 2.0 front panel ports implemented through four internal headers

All 20 USB ports are high-speed, full-speed, and low-speed capable. The USB 3.0 ports are super-speed capable.

NOTE

Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices.


The location of the USB connectors on the back panel

The location of the front panel USB headers

Refer to

Figure 11, page 46

Figure 13, page 48

21


1.6.2 SATA Interfaces

The board provides eight SATA connectors which support one device per connector:

• Two internal SATA 6.0 Gb/s connectors through the PCH (blue)

• Two internal SATA 6.0 Gb/s connectors through a Marvell 88SE9128 controller

(gray)

• Four internal SATA 3.0 Gb/s connectors through the PCH (black)

The PCH provides independent SATA ports with a theoretical maximum transfer rate of

6.0 Gb/s for four ports and 3.0 Gb/s for four ports. A point-to-point interface is used for host to device connections.

The underlying SATA functionality is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE

I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI

Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Microsoft Windows* XP, Windows Vista*, and Windows 7 operating systems.

NOTE

Many SATA drives use new low-voltage power connectors and require adapters or power supplies equipped with low-voltage power connectors.

For more information, see: http://www.serialata.org/ .


The location of the SATA connectors

Refer to

Figure 13, page 48

1.6.2.1 SATA RAID

The board supports the following RAID (Redundant Array of Independent Drives) levels via the PCH:

• RAID 0 - data striping

• RAID 1 - data mirroring

• RAID 0+1 (or RAID 10) - data striping and mirroring

• RAID 5 - distributed parity

NOTE

In order to use supported RAID features, you must first enable RAID in the BIOS. Also, during Microsoft Windows XP installation, you must press F6 to install the RAID drivers. See your Microsoft Windows XP documentation for more information about installing drivers during installation. Both Microsoft Windows Vista and Microsoft

Windows 7 include the necessary RAID drivers for both AHCI and RAID without the need to install separate RAID drivers using the F6 switch in the operating system installation process.

22


1.7 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at

25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.

NOTE

If the battery and AC power fail, date and time values will be reset and the user will be notified during POST.

When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the

battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.8 Legacy I/O Controller

The I/O controller provides the following features:

• Consumer Infrared (CIR) headers

• Serial IRQ interface compatible with serialized IRQ support for PCI systems

• Intelligent power management, including a programmable wake-up event interface

• PCI power management support

The BIOS Setup program provides configuration options for the I/O controller.

1.8.1 Consumer Infrared (CIR)

The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer

Infrared usage models. Microsoft Windows Vista and Microsoft Windows 7 are the supported operating systems.

The CIR feature is made up of two separate pieces: the receiving (receiver) header, and the output (emitter) header. The receiving header consists of a filtered translated infrared input compliant with Microsoft CIR specifications, and also a “learning” infrared input. This learning input is simply a high pass input which the computer can use to “learn” to speak the infrared communication language of other user remotes.

The emitter header consists of two output ports which the PC can use to emulate

“learned” infrared commands in order to control external electronic hardware.

Customers are required to buy or create their own interface modules to plug into Intel

Desktop Boards for this feature to work.

23


1.9 Audio Subsystem

The board supports the Intel High Definition Audio subsystem based on the Realtek

ALC892 audio codec. The audio subsystem supports the following features:

• Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to the user’s definition, or can be automatically switched depending on the recognized device type.

•

Stereo input and output for all back panel jacks

• Line out and Mic in functions for front panel audio jacks

• A signal-to-noise (S/N) ratio of 90 dB

Table 4 lists the supported functions of the front panel and back panel audio jacks.

Table 4. Audio Jack Support

Audio Jack

FP Green

Micro- phone

FP Pink

Rear Blue

Default

Rear Green

Rear Pink Default

Rear Black

Rear Orange

Head- phones

Default

Front

Speaker

Ctrl panel Default

Line In

Default

Rear

Surround

Default

Center/

Sub

Default

Side

Surround

Ctrl panel

1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.


Obtaining audio software and drivers

Section 1.3, page 16

1.9.2 Audio Subsystem Components

The audio subsystem includes the following components:

• Intel X79 Express Chipset

• Realtek ALC892 audio codec

• Front panel audio header that supports Intel HD audio and AC ’97 audio (a 2 x 5pin header that provides mic in and line out signals for front panel audio connectors) (yellow)

• S/PDIF digital audio out header (1 x 4-pin header) (yellow)

• S/PDIF digital audio out connector on the back panel

• 5-port analog audio input/output stack on the back panel

The back panel audio connectors are configurable through the audio device drivers.

The available configurable back panel audio connectors are shown in Figure 4.

24


C

D

E

F

Item Description

A

B

Rear surround

Center channel and LFE

(subwoofer)

Line in

Line out/front speakers

Mic in/side surround

S/PDIF digital audio out

(optical)

Figure 4. Back Panel Audio Connectors

NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.


The locations of the front panel audio header and S/PDIF audio header

The signal names of the front panel audio header and S/PDIF audio header

The back panel audio connectors

Refer to

Figure 13, page 48

Section 2.2.2.1, page 50

Section 2.2.1, page 46

25


1.10 LAN Subsystem

The Intel GbE Dual LAN subsystem consists of the following:

• Intel 82579L and Intel 82574L Gigabit Ethernet Controllers (10/100/1000 Mbits/s)

• Intel X79 Express Chipset

• RJ-45 LAN connectors with integrated status LEDs

Additional features of the LAN subsystem include:

• CSMA/CD protocol engine

• LAN connect interface between the PCH and the LAN controller

• Conventional PCI bus power management

 ACPI technology support

 LAN wake capabilities (only the Intel 82579L Gigabit Ethernet Controller supports PXE)

• LAN subsystem software


LAN software and drivers

Refer to

http://downloadcenter.intel.com

1.10.1 Intel

®

82579L and Intel

®

82574L Gigabit Ethernet

Controllers

The Intel 82579L and Intel 82574L Gigabit Ethernet Controllers support the following features:

• 10/100/1000 BASE-T IEEE 802.3 compliant

• Energy Efficient Ethernet (EEE) IEEE802.3az support [Low Power Idle (LPI) mode]

• Dual interconnect between the Integrated LAN Controller and the Physical Layer

(PHY):

 PCI Express-based interface for active state operation (S0) state

 SMBUS for host and management traffic (Sx low power state)

• Compliant to IEEE 802.3x flow control support

• 802.1p and 802.1q

• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)

• Full device driver compatibility

• Provides lower power usage to meet Energy Star 5.0 and ErP specifications

26


1.10.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.


Obtaining LAN software and drivers http://downloadcenter.intel.com

1.10.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).


A

B

C

D

Link LED (Green)

Data Rate LED (Green/Yellow)

Link LED (Green)

Data Rate LED (Green/Yellow)

Figure 5. LAN Connector LED Locations

Table 5 describes the LED states when the board is powered up and the LAN subsystem is operating.

Table 5. LAN Connector LED States

LED

Link

Data Rate

LED Color

Green

Green/Yellow

LED State

Off

On

Blinking

Off

Green

Yellow

Condition

LAN link is not established.

LAN link is established.

LAN activity is occurring.

10 Mbits/s data rate is selected.



27


1.11 Bluetooth*/WiFi Module

The Bluetooth*/WiFi module is supplemental hardware that is included (see Figure 6).

Figure 6. Bluetooth/WiFi Module

1.11.1 Bluetooth Technology

The Bluetooth/WiFi Module enables the user to connect with a variety of Bluetooth enabled devices. Driver support is provided by Microsoft operating systems like

Microsoft Vista and Microsoft Windows 7. The basic Bluetooth driver stack is supplied by Microsoft but additional features are available using the driver supplied with the motherboard.

• CSR Bluetooth module (BC0401PC08)

• Maximum data rate 3.0 Mb/s

• Forward and backward compatibility with Bluetooth v1.1, v1.2, v2.0, and v2.1

• Integrated antenna

• Operating system support (Windows XP, Windows Vista, and Windows 7 both 32 bit and 64 bit)


Obtaining Bluetooth information and drivers http://downloadcenter.intel.com http://msdn.microsoft.com/enus/library/aa362932(VS.85).aspx

28


1.11.2 WiFi 802.11 Wireless

The Bluetooth/WiFi Module enables the user to connect with a variety of WiFi enabled networks, access points and allows peer to peer connections. Driver support is provided by Microsoft operating systems like Microsoft Vista and Microsoft Windows 7 with additional support provided by the supplied WiFi driver included on the Driver

DVD and online.

• Ralink WiFi 802.11 (RT8070)

• Range up to 300 meters

• Supports the following:

 IEEE 802.11B supports up to 11 Mb/s data rate

 IEEE 802.11G supports up to 54 Mb/s data rate

 IEEE 802.11N supports up to 150 Mb/s data rate

• Integrated Antenna

• Operating system support (Windows XP, Windows Vista, and Windows 7 both 32 bit and 64 bit)


Obtaining WiFi information and drivers http://msdn.microsoft.com/enus/library/aa362932(VS.85).aspx

http://downloadcenter.intel.com

1.12 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following:

• Fan monitoring and control

• Thermal and voltage monitoring

• Chassis intrusion detection

1.12.1 Hardware Monitoring and Fan Control

The hardware monitoring and fan control subsystem is based on the Winbond

W83677HG-I device, which supports the following:

• Processor and system ambient temperature monitoring

• Chassis fan speed monitoring

• Power monitoring of +12 V, +5 V, +3.3 V, V_SM1, V_SM2, 3.3V_Standby and

+VCCP

• SMBus interface

29


1.12.2 Fan Monitoring

Fan monitoring can be implemented using Intel

®

Desktop Utility, or third-party software.

Extreme Tuning Utility, Intel

®


The functions of the fan headers

Section 1.13.2.2, page 36

1.12.3 Chassis Intrusion and Detection

The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion header. When the chassis cover is removed, the mechanical switch is in the closed position.


The location of the chassis intrusion header

Figure 13, page 48

30


1.12.4 Thermal Monitoring

Figure 7 shows the locations of the thermal sensors and fan headers.


A

B

C

D

E

F

G



Thermal diode, located on processor die


Front chassis fan header

Intel X79 Express Chipset


Figure 7. Thermal Sensors and Fan Headers

31


1.13 Power Management

Power management is implemented at several levels, including:

• Software support through Advanced Configuration and Power Interface (ACPI)

• Hardware support:

 Power connector

 Fan headers

 LAN wake capabilities

 Instantly Available PC technology

 Wake from USB

 PME# signal wake-up support

 WAKE# signal wake-up support

 Wake from Consumer IR

 Wake from S5

 Power Supervisor

 +5 V Standby Power Indicator LED

1.13.1 ACPI

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires an operating system that provides full ACPI support. ACPI features include:

• Plug and Play (including bus and device enumeration)

• Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives

• Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state

• A Soft-off feature that enables the operating system to power-off the computer

(refer to the Advanced Configuration and Power Interface Specification at http://www.acpi.info/ )

•

Support for multiple wake-up events (see Table 8 on page 34)

• Support for a front panel power and sleep mode switch

Table 6 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 6. Effects of Pressing the Power Switch

If the system is in this state…

Off

(ACPI G2/G5 – Soft off)

On

(ACPI G0 – working state)

On


Sleep

(ACPI G1 – sleeping state)

Sleep


…and the power switch is pressed for

Less than four seconds


More than six seconds


More than six seconds

…the system enters this state

Power-on


Soft-off/Standby


Fail safe power-off


Wake-up


Power-off


32


1.13.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications.

Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.

Table 7 lists the power states supported by the board along with the associated

system power targets. See the ACPI specification for a complete description of the various system and power states.

Table 7. Power States and Targeted System Power

Global States

G0 – working state

G1 – sleeping state

G1 – sleeping state

Sleeping States

S0 – working

S3 – Suspend to

RAM. Context saved to RAM.

S4 – Suspend to disk. Context saved to disk.

Processor

States Device States

C0 – working D0 – working state.

No power D3 – no power except for wake-up logic.

No power D3 – no power except for wake-up logic.

Targeted System

Power (Note 1)

Full power > 30 W

Power < 5 W

Power < 5 W

(Note 2)

(Note 2)

G2/S5

G3 – mechanical off

AC power is disconnected from the computer.

S5 – Soft off.

Context not saved.

Cold boot is required.

No power to the system.

No power

No power

D3 – no power except for wake-up logic.

D3 – no power for wake-up logic, except when provided by battery or external source.

Power < 5 W

(Note 2)

No power to the system.

Service can be performed safely.

Notes:

1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis’ power supply.

2. Dependent on the standby power consumption of wake-up devices used in the system.

33


1.13.1.2 Wake-up Devices and Events

Table 8 lists the devices or specific events that can wake the computer from specific

states.

Table 8. Wake-up Devices and Events

Devices/events can wake up the computer… …from this state

Power switch

S3, S4, S5

(

Note 1)

RTC alarm

LAN

S3, S4, S5

(Note 1)

S3, S4, S5

(Note 1)

USB

PME# signal

WAKE#

Consumer IR

S3

S3, S4, S5

(Note 1)

S3, S4, S5

(Note 1)

S3, S4, S5 (Note 2)

Notes:

1. S4 implies operating system support only.

2. Wake from S4 and S5 is recommended by Microsoft.

3. Wake from device/event not supported immediately upon return from AC loss.

…from this global state

G1, G2, G3

G1, G2

(Note 3)

G1, G2

(Note 3)

G1

G1, G2

(Note 3)

G1, G2

(Note 3)

NOTE

The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.

34


1.13.2 Hardware Support

CAUTION

Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.

The board provides several power management hardware features, including:

• Power connector

• Fan headers

• LAN wake capabilities

•

Instantly Available PC technology

• Wake from USB

• PME# signal wake-up support

• WAKE# signal wake-up support

• Wake from Consumer IR

• Wake from S5

• Power Supervisor

• +5 V Standby Power Indicator LED

LAN wake capabilities and Instantly Available PC technology require power from the

+5 V standby line.

NOTE

The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support.

1.13.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages.

When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu.


The location of the main power connector

Refer to

Figure 13, page 48

The signal names of the main power connector

Table 22, page 54

35


1.13.2.2 Fan Headers

The function/operation of the fan headers is as follows:

• The fans are on when the board is in the S0 state

• The fans are off when the board is off or in the S3, S4, or S5 state

• Each fan header is wired to a fan tachometer input of the hardware monitoring and fan control SIO

• All fan headers support closed-loop fan control that can adjust the fan speed or switch the fan on or off as needed

• All fan headers have a +12 V DC connection

• 4-pin fan headers are controlled by Pulse Width Modulation


The location of the fan headers

The location of the fan headers and sensors for thermal monitoring

Figure 13, page 48

Figure 7, page 31

1.13.2.3 LAN Wake Capabilities

CAUTION

For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply.

LAN wake capabilities enable remote wake-up of the computer through a network.

The LAN subsystem PCI bus network adapter monitors network traffic at the Media

Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer. Depending on the LAN implementation, the board supports LAN wake capabilities with ACPI in the following ways:

• The PCI Express WAKE# signal

• The PCI bus PME# signal for PCI 2.3 compliant LAN designs

 By Ping

 Magic Packet

• The onboard LAN subsystem

36


1.13.2.4 Instantly Available PC Technology

CAUTION

For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply.

Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-

RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to

its last known wake state. Table 8 on page 34 lists the devices and events that can

wake the computer from the S3 state.

The board supports the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer.

The use of Instantly Available PC technology requires operating system support and

PCI 2.2 compliant add-in cards, PCI Express add-in cards, and drivers.

1.13.2.5 Wake from USB

USB bus activity wakes the computer from an ACPI S3 state.

NOTE

Wake from USB requires the use of a USB peripheral that supports Wake from USB and is supported by the operating system.

1.13.2.6 PME# Signal Wake-up Support

When the PME# signal on the Conventional PCI bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state (with Wake on PME enabled in the BIOS).

1.13.2.7 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state.

1.13.2.8 Wake from Consumer IR

CIR activity wakes the computer from an ACPI S3, S4, or S5 state.

1.13.2.9 Wake from S5

When the RTC Date and Time is set in the BIOS, the computer will automatically wake from an ACPI S5 state.

37


1.13.2.10 Power Supervisor

The Power Supervisor actively monitors the input voltages from the power supply and protects the board and any attached peripherals from electrical overstress and possible physical damage. The Power Supervisor will activate if it detects the power supply voltage rails have deviated outside the current ATX power supply specification and safe operating levels.

If the Power Supervisor detects an out of spec voltage, the following will happen:

1. The board will be powered down immediately to protect circuits from electrical overstress and possible physical damage.

2. A red warning LED on the board will activate as a visual cue.

3. During the next power on, a message will be displayed on the screen to notify the user that the power supply voltage rails have deviated outside the current ATX power supply specification and safe operating levels.

4. A message will be added to the BIOS Event Log for each event that takes place until the BIOS Event Log is cleared.

1.13.2.11 +5 V Standby Power Indicator LED

The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off.

1.14 Board Status LEDs

The Desktop Board provides eight board status LEDs that allow you to monitor the board’s progress through the BIOS Power-on Self-Test. At initial power on, all the

LEDs are off. When the BIOS starts an activity such as memory initialization, the corresponding LED starts flashing. Once the activity has completed, the LED will remain on. Six additional LEDs can be used to monitor board functions such as hard

drive activity, processor errors, and power faults. Refer to Table 9 for a description of

all of the LEDs. Figure 8 shows the location of the LEDs.

38

Figure 8. Location of Board Status LEDs


39


I

J

K

Table 9. Board Status LEDs

Item in

Figure 8

A

B

C

D

E

F

G

H

L

M

N

LED Name LED Color

OS Start

Storage

Initialization

Green

Green

USB Initialization Green

Option ROM

Initialization

Green

Green Video

Initialization

Memory

Initialization

Green

CPU Initialization Green

Hard Drive

Activity

Blue

CPU Hot Red

VR Hot

Watch Dog

Fire/Back to BIOS

Red

Red

+5 V standby power indicator

Green

CPU Error Red

Power Fault LED Red

Supported

Modes

On/Off/Flash

On/Off/Flash

On/Off/Flash

On/Off/Flash

On/Off/Flash

On/Off/Flash

On/Off/Flash

On/Off

On/Off

On/Off

On/Off/Flash

On/Off

On/Off

On/Off

Control Source

BIOS

BIOS

BIOS

BIOS

BIOS

BIOS

BIOS

Hard drive controller(s)

Discrete circuit

Discrete circuit

BIOS

Power Supply

Processor

Power Supply

40


1.15 Onboard Power and Reset Buttons

The lighted onboard power button has the same behavior as the front panel power button connected via the front panel header. The onboard power button does NOT remove standby power. This button is intended for use at integration facilities for testing purposes. The power button on the front panel is recommended for all other instances of turning the computer on or off. To turn the computer off using the onboard power button, keep the button pressed down for three seconds.

The lighted onboard reset button can be used to reset the board. This button

duplicates the function of the front panel reset button. Figure 9 shows the location of

the onboard power and reset buttons.


A

B

Onboard power

Onboard reset

Figure 9. Location of the Onboard Power and Reset Buttons

CAUTION

Electrostatic discharge (ESD) can damage components. The onboard power and reset buttons should be used only at an ESD workstation using an antistatic wrist strap and a conductive foam pad. If such a station is not available, some ESD protection can be provided by wearing an antistatic wrist strap and attaching it to a metal part of the computer chassis.

41


42

2 Technical Reference

2.1 Memory Resources

2.1.1 Addressable Memory

The board utilizes 64 GB of addressable system memory. Typically the address space that is allocated for Conventional PCI bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM

(total system memory). On a system that has 64 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following:

• BIOS/SPI Flash device (64 Mbit)

• Local APIC (19 MB)

• Direct Media Interface (40 MB)

• PCI Express configuration space (256 MB)

• PCH base address registers PCI Express ports (up to 256 MB)

• Memory-mapped I/O that is dynamically allocated for Conventional PCI and PCI

Express add-in cards (256 MB)

The board provides the capability to reclaim the physical memory overlapped by the memory mapped I/O logical address space. The board remaps physical memory from the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical address range located just above the 4 GB boundary. Figure 10 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.

43


44

Figure 10. Detailed System Memory Address Map

Technical Reference

2.1.2 Memory Map

Table 10 lists the system memory map.

Table 10. System Memory Map

Address Range (decimal) Address Range (hex)

1024 K - 67100672 K 100000 – FFFFFFFFFH

960 K - 1024 K F0000 - FFFFF

896 K - 960 K

800 K - 896 K

E0000 - EFFFF

C8000 - DFFFF

640 K - 800 K

639 K - 640 K

A0000 - C7FFF

9FC00 - 9FFFF

512 K - 639 K

0 K - 512 K

80000 - 9FBFF

00000 - 7FFFF

2.2 Connectors and Headers

Size Description

65528 MB Extended memory

64 KB Runtime BIOS

64 KB

96 KB

160 KB

1 KB

127 KB

512 KB

Reserved

Potential available high DOS memory (open to the Conventional

PCI bus). Dependent on video adapter used.

Video memory and BIOS

Extended BIOS data (movable by memory manager software)

Extended conventional memory

Conventional memory

CAUTION

Only the following connectors and headers have overcurrent protection: back panel and front panel USB, as well as IEEE 1394a.

The other internal connectors and headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors or headers to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves.

Furthermore, improper connection of USB or 1394 header single wire connectors may eventually overload the overcurrent protection and cause damage to the board.

This section describes the board’s connectors. The connectors can be divided into these groups:

• Back panel I/O connectors

•

Component-side I/O connectors and headers (see page 48)

45


2.2.1 Back Panel Connectors

Figure 11 shows the location of the back panel connectors for the board.


E

F

G

H

I

A

B

C

D

M

N

O

J

K

L

Back to BIOS button

USB 3.0 ports

USB 3.0 ports

LAN connector

USB 2.0 ports

IEEE 1394a connector

USB 2.0 ports

LAN connector

USB 2.0 ports

Rear surround

Center channel and LFE (subwoofer)

S/PDIF digital audio out (optical)

Line in

Line out/front speakers

Mic in/side surround

Figure 11. Back Panel Connectors

NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

46


2.2.1.1 I/O Shield

The I/O shield provided with the board allows access to all back panel connectors and

is compatible with standard mini-ITX and ATX chassis. Figure 12 shows an I/O shield

reference diagram.

Figure 12. I/O Shield Reference Diagram

47


2.2.2 Component-side Connectors and Headers

Figure 13 shows the locations of the component-side connectors and headers.

Figure 13. Component-side Connectors and Headers

Table 11 lists the component-side connectors and headers identified in Figure 13.

48


Table 11. Component-side Connectors and Headers Shown in Figure 13

W

X

Y

Z

S

T

U

V

AA

BB

CC

P

Q

R

I

J

G

H

K

L

M

N

O

C

D

E

F

Item/callout

from Figure 13

A

B

Description

Front panel audio header


S/PDIF out header

PCI Express 3.0 x16 add-in card connector (x8 electrical)

Conventional PCI add-in card connector






12 V processor core voltage connector (2 x 4 pin)

Main power connector (2 x 12 pin)



SATA 6.0 Gb/s connectors through the PCH (blue)

SATA 3.0 Gb/s connectors through the PCH (black)

SATA 6.0 Gb/s connectors through a Marvell 88SE9128 controller (gray)

Front panel USB 2.0 header




Consumer IR emitter (output) header

Front panel USB 3.0 connector

Consumer IR receiver (input) header

Alternate front panel power LED header

Front panel header

Front panel IEEE 1394 a header

Chassis intrusion header


49


2.2.2.1 Signal Tables for the Connectors and Headers

Table 12. Front Panel Audio Header for Intel HD Audio

5

6

7

Pin

1

2

3

4

8

9

10

Signal Name

PORT_1L

GND

PORT_1R

PRESENCE#

PORT_2R

SENSE1_RETURN

SENSE_SEND

KEY

PORT_2L

SENSE2_RETURN

Description

Analog Port 1 – left channel (microphone)

Ground

Analog Port 1 – right channel (microphone)

Active low signal that signals BIOS that an Intel HD Audio dongle is connected to the analog header. PRESENCE#=0 when an Intel HD Audio dongle is connected

Analog Port 2 – right channel (headphone)

Jack detection return for front panel (JACK1)

Jack detection sense line from the Intel HD Audio CODEC jack detection resistor network

No pin

Analog Port 2 – left channel (headphone)

Jack detection return for front panel (JACK2)

Table 13. Front Panel Audio Header for AC ’97 Audio

2

3

4

5

6

7

8

9

Pin

1

10

Signal Name

MIC

AUD_GND

MIC_BIAS

PRESENCE#

FP_OUT_R

AUD_GND

RESERVED

KEY

FP_OUT_L

AUD_GND

Description

Front panel microphone input signal (biased when supporting stereo microphone)

Ground used by analog audio circuits

Microphone power/additional MIC input for stereo microphone support

Active low signal that signals BIOS that an Intel HD Audio dongle is connected to the analog header. PRESENCE#=0 when an Intel HD Audio dongle is connected.

Right channel audio signal to front panel (headphone drive capable)


Reserved

No pin

Left channel audio signal to front panel (headphone drive capable)


50


Table 14. IEEE 1394a Header

5

7

9

Pin

1

3

Signal Name

Data A (positive)

Ground

Data B (positive)

+12 V DC

Key (no pin)

Table 15. SATA Connectors

3

4

5

6

7

Pin

1

2

Signal Name

Ground

TXP

TXN

Ground

RXN

RXP

Ground

Table 16. S/PDIF Header

2

3

4

Pin

1

Signal Name

Ground

S/PDIF out

Key (no pin)

+5 VDC

Table 17. USB 2.0 Headers

Pin

1

2

3

4

5

Signal Name

+5 V DC

D−

D+

Ground

Key (no pin)

Pin

2

4

6

8

10

Signal Name

Data A (negative)

Ground

Data B (negative)

+12 V DC

Ground

51


Table 18. USB 3.0 Connector

Pin

1

2

11

12

13

14

15

16

17

7

8

9

10

3

4

5

6

18

19

Signal Name

Vbus

IntA_P1_SSRX−

IntA_P1_SSRX+

GND

IntA_P1_SSTX−

IntA_P1_SSTX+

GND

IntA_P1_D−

IntA_P1_D+

ID

IntA_P2_D+

IntA_P2_D−

GND

IntA_P2_SSTX+

IntA_P2_SSTX−

GND

IntA_P2_SSRX+

IntA_P2_SSRX−

Vbus

Table 19. Chassis Intrusion Header

Pin

1

2

Signal Name

Intruder#

Ground

Description

Power

USB3 ICC Port1 SuperSpeed Rx−

USB3 ICC Port1 SuperSpeed Rx+

Ground

USB3 ICC Port1 SuperSpeed Tx−

USB3 ICC Port1 SuperSpeed Tx+

Ground

USB3 ICC Port1 D− (USB2 Signal D−)

USB3 ICC Port1 D+ (USB2 Signal D+)

Over Current Protection

USB3 ICC Port2 D+ (USB2 Signal D+)

USB3 ICC Port2 D− (USB2 Signal D−)

Ground

USB3 ICC Port2 SuperSpeed Tx+

USB3 ICC Port2 SuperSpeed Tx−

Ground



Power

Table 20. Processor, Front and Rear Chassis, and Auxiliary

(4-Pin) Fan Headers

Pin

1

2

3

Signal Name

Ground

(Note)

+12 V

FAN_TACH

4 FAN_CONTROL

Note: These fan headers use Pulse Width Modulation control for fan speed.

52


Table 20. Back Panel CIR Emitter (Output) Header

3

4

5

6

Pin

1

2

Signal Name

Emitter out 1

Emitter out 2

Ground

Key (no pin)

Jack detect 1

Jack detect 2

Table 21. Front Panel CIR Receiver (Input) Header

4

5

6

7

8

Pin

1

2

3

Signal Name

Ground

LED

NC

Learn-in

5 V standby

VCC

Key (no pin)

CIR Input

2.2.2.2 Add-in Card Connectors

The board has the following add-in card connectors:

• PCI Express 3.0 x16: three PCI Express 3.0 x16 connectors supporting simultaneous transfer speeds up to 16 GB/s of peak bandwidth per direction and up to 32 GB/s concurrent bandwidth.

• PCI Express 2.0 x1: two PCI Express 2.0 x1 connectors. The x1 interface supports simultaneous transfer speeds up to 500 MB/s of peak bandwidth per direction and up to 1.0 GB/s concurrent bandwidth.

• Conventional PCI (rev 2.3 compliant) bus: one Conventional PCI bus add-in card connector.

Note the following considerations for the Conventional PCI bus connector:

• The Conventional PCI bus connectors are bus master capable.

• SMBus signals are routed to the Conventional PCI bus connectors. This enables

Conventional PCI bus add-in boards with SMBus support to access sensor data on the desktop board. The specific SMBus signals are as follows:

 The SMBus clock line is connected to pin A40.

 The SMBus data line is connected to pin A41.

53


2.2.2.3 Power Supply Connectors

The board has the following power supply connectors:

• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, attach that cable on the leftmost pins of the main power connector, leaving pins 11, 12, 23, and

24 unconnected.

• Processor core power – a 2 x 4 connector. This connector provides power directly to the processor voltage regulator and must always be used. Failure to do so will prevent the board from booting.

Table 21. Processor Core Power Connector

Pin

1

3

5

7

Signal Name

Ground

Ground

Ground

Ground

Pin

2

4

6

8

Signal Name

+12 V

+12 V

+12 V

+12 V

Table 22. Main Power Connector

4

5

6

7

8

9

10

11

12

Pin

1

2

3

Signal Name

+3.3 V

+3.3 V

Ground

+5 V

Ground

+5 V

Ground

PWRGD (Power Good)

+5 V (Standby)

+12 V

+12 V

(Note)

2 x 12 connector detect

(Note)

16

17

18

19

20

21

22

23

24

Pin

13

14

15

Signal Name

+3.3 V

-12 V

Ground

PS-ON# (power supply remote on/off)

Ground

Ground

Ground

No connect

+5 V

+5 V

+5 V

(Note)

Ground

(Note)

Note: When using a 2 x 10 power supply cable, this pin will be unconnected.


Power supply considerations

Refer to

Section 2.5.1 on page 61

54


2.2.2.4 Front Panel Header

This section describes the functions of the front panel header. Table 23 lists the signal

names of the front panel header. Figure 14 is a connection diagram for the front panel header.

Table 23. Front Panel Header

Pin Signal

Hard Drive Activity LED

In/

Out Description

1

3

HD_PWR

HDA#

Out

Out

Hard disk LED pull-up to +5 V

Hard disk active

LED

Reset Switch

5

7

Ground

FP_RESET# In

Power

9 +5 V

Ground

Reset switch

Power

Pin Signal

Power LED

2

In/

Out

HDR_BLNK_GRN Out

4 HDR_BLNK_YEL Out

On/Off Switch

6

8

FPBUT_IN

Ground

Not Connected

10 N/C

In

Description

Front panel green

LED

Front panel yellow

LED

Power switch

Ground

Not connected

Figure 14. Connection Diagram for Front Panel Header

2.2.2.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires a SATA hard drive or optical drive connected to an onboard SATA connector.

55


2.2.2.4.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the

POST.

2.2.2.4.3 Power/Sleep LED Header

Pins 2 and 4 can be connected to a one- or two-color LED. Table 24 shows the

possible states for a one-color LED. Table 25 shows the possible states for a two-color

LED.

Table 24. States for a One-Color Power LED

LED State

Off

Steady Green

Description

Power off/sleeping

Running

Table 25. States for a Two-Color Power LED

LED State

Off

Steady Green

Steady Yellow

Description

Power off

Running

Sleeping

NOTE

The colors listed in Table 24 and Table 25 are suggested colors only. Actual LED colors

are chassis-specific.

2.2.2.4.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal.

56


2.2.2.5 Front Panel USB 2.0 Headers

Figure 15 is a connection diagram for the front panel USB 2.0 headers.

NOTE

• The +5 V DC power on the headers is fused.

• Use only a front panel USB 2.0 connector that conforms to the USB 2.0

specification for high-speed USB devices.

Figure 15. Connection Diagram for Front Panel USB 2.0 Headers

57


2.3 Jumper Block

CAUTION

Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged.

Figure 16 shows the location of the jumper block. The 3-pin jumper block determines

the BIOS Setup program’s mode. Table 26 describes the jumper settings for the three

modes: normal, configure, and recovery. When the jumper is set to configure mode and the computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match.

Figure 16. Location of the Jumper Block

58


Table 26. BIOS Setup Configuration Jumper Settings

Function/Mode

Normal

Configure

Jumper Setting

1-2

2-3

Configuration

The BIOS uses current configuration information and passwords for booting.

After the POST runs, Setup runs automatically. The maintenance menu is displayed.

Note that this Configure mode is the only way to clear the

BIOS/CMOS settings. Press F9 (restore defaults) while in

Configure mode to restore the BIOS/CMOS settings to their default values.

Recovery None The BIOS attempts to recover the BIOS configuration. A recovery CD or flash drive is required.

59


2.4 Mechanical Considerations

2.4.1 Form Factor

The board is designed to fit into an ATX-form-factor chassis. Figure 17 illustrates the

mechanical form factor for the board. Dimensions are given in inches [millimeters].

The outer dimensions are 12.00 inches by 9.60 inches [304.80 millimeters by

243.84 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification.

Figure 17. Board Dimensions

60


2.5 Electrical Considerations

2.5.1 Power Supply Considerations

CAUTION

The +5 V standby line from the power supply must be capable of providing adequate

+5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.

Additional power required will depend on configurations chosen by the integrator.

The power supply must comply with the indicated parameters of the ATX form factor specification.

• The potential relation between 3.3 VDC and +5 VDC power rails

• The current capability of the +5 VSB line

• All timing parameters

• All voltage tolerances

For example, for a system consisting of a supported 130 W processor (see section 1.4 on page 16 for a list of supported processors), 8 GB DDR3 RAM, one high end video

card, one hard disk drive, one optical drive, and all board peripherals enabled, the

minimum recommended power supply is 460 W. Table 27 lists the recommended

power supply current values.

Table 27. Recommended Power Supply Current Values

Output Voltage

Current

3.3 V

22 A

5 V

20 A

12 V1

16 A

12 V2

16 A

-12 V

0.3 A

5 VSB

1.5 A


Selecting an appropriate power supply

Refer to

http://support.intel.com/support/motherboards/desktop/sb

/CS-026472.htm

61


2.5.2 Fan Header Current Capability

CAUTION

The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation.

Table 28 lists the current capability of the fan headers.

Table 28. Fan Header Current Capability

Fan Header

Processor fan

Front chassis fan

Rear chassis fan

Auxiliary fan

Maximum Available Current

2.0 A

1.5 A

1.5 A

1.5 A

2.5.3 Add-in Board Considerations

The board is designed to provide 2 A (average) of current for each add-in board from the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board

(all six expansion slots filled) must not exceed the system’s power supply +5 V maximum current or 14 A in total.

62


2.6 Thermal Considerations

CAUTION

A chassis with a maximum internal ambient temperature of 38

o

C at the processor fan inlet is a requirement. Use a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area. If a non omni-directional thermal solution is used customer might need to provide supplemental cooling to the processor voltage regulator area.

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm

All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system

with adequate thermal performance.

CAUTION

Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating

temperature, see the environmental specifications in Section 2.8.

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit.

Failure to do so may result in damage to the voltage regulator circuit. The processor

voltage regulator area (shown in Figure 18) can reach a temperature of up to 85

o

an open chassis.

C in

63


Figure 18 shows the locations of the localized high temperature zones.


A

B

Processor voltage regulator area

Processor

Figure 18. Localized High Temperature Zones

Table 29 provides maximum case temperatures for the components that are sensitive

to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.

Table 29. Thermal Considerations for Components

Component

Processor

Maximum Case Temperature

For processor case temperature, see processor datasheets and processor specification updates

Intel X79 Express Chipset 104 o C (under bias)


Processor datasheets and specification updates

Refer to

Section 1.3, page 16

64


2.7 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using a parts count method. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at

55 ºC. The MTBF for the board is 134,526 hours.

2.8 Environmental

Table 30 lists the environmental specifications for the board.

Table 30. Environmental Specifications

Parameter

Temperature

Non-Operating

Operating

Shock

Unpackaged

Packaged

Vibration

Unpackaged

Packaged

Specification

-20 °C to +70 °C (Note)

0 °C to +55 °C

The operating temperature of the board may be determined by measuring the air temperature from within 1 inch of the edge of the chipset/PCH heatsink and

1 inch above the board, in a closed chassis, while the system is in operation.

50 g trapezoidal waveform

Velocity change of 170 inches/second²

Half sine 2 millisecond

Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec²)

<20 36 167

21-40

41-80

30

24

152

136

81-100 18 118

5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz

20 Hz to 500 Hz: 0.02 g² Hz (flat)

5 Hz to 40 Hz: 0.015 g² Hz (flat)

40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

Note: Before attempting to operate this board, the overall temperature of the board must be above the minimum operating temperature specified. It is recommended that the board temperature be at least room temperature before attempting to power on the board.

65


66

3 Overview of BIOS Features

3.1 Introduction

The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash

Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN

EEPROM information, and Plug and Play support.

The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as SIX7910J.86A.

When the BIOS Setup configuration jumper is set to configure mode and the computer is powered-up, the BIOS compares the CPU version and the microcode version in the

BIOS and reports if the two match.

The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the

Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below.

Maintenance Main Configuration Performance Security Power Boot Exit

NOTE

The maintenance menu is displayed only when the board is in configure mode.

Section 2.3 on page 58 shows how to put the board in configure mode.

67


Table 31 lists the BIOS Setup program menu features.

Table 31. BIOS Setup Program Menu Bar

Maintenance

Clears passwords and displays processor information

Main

Displays processor and memory configuration

Configuration

Configures advanced features available through the chipset

Performance

Configures

Memory, Bus and Processor overrides

Security

Sets passwords and security features

Table 32 lists the function keys available for menu screens.

Power

Configures power management features and power supply controls

Boot

Selects boot options

Table 32. BIOS Setup Program Function Keys

BIOS Setup Program

Function Key

<←> or <→>

<↑> or <↓>

<Tab>

<Enter>

<F9>

<F10>

<Esc>

Description

Selects a different menu screen (Moves the cursor left or right)

Selects an item (Moves the cursor up or down)

Selects a field (Not implemented)

Executes command or selects the submenu

Load the default configuration values for the current menu

Save the current values and exits the BIOS Setup program

Exits the menu

Exit

Saves or discards changes to

Setup program options

3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 32 Mbit (4096 KB) flash memory device.

3.3 Resource Configuration

3.3.1 PCI Autoconfiguration

The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having to configure the system. When a user turns on the system after adding a PCI card, the BIOS automatically configures interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are considered to be available for use by the add-in card.

68

Overview of BIOS Features

3.4 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network.

The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The

MIF database defines the data and provides the method for accessing this information.

The BIOS enables applications such as third-party management software to use

SMBIOS. The BIOS stores and reports the following SMBIOS information:

• BIOS data, such as the BIOS revision level

• Fixed-system data, such as peripherals, serial numbers, and asset tags

• Resource data, such as memory size, cache size, and processor speed

• Dynamic data, such as event detection and error logging

Non-Plug and Play operating systems require an additional interface for obtaining the

SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page.

3.5 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the

BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled.

Legacy USB support operates as follows:

1. When you apply power to the computer, legacy support is disabled.

2. POST begins.

3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu.

4. POST completes.

5. The operating system loads. While the operating system is loading, USB keyboards and mice are recognized and may be used to configure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.)

6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the

BIOS is no longer used.

7. Additional USB legacy feature options can be access by using Intel Integrator

Toolkit.

69


To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s installation instructions.

3.6 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site:

• Intel

®

Express BIOS Update utility, which enables automated updating while in the

Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), an optical drive, or from the file location on the Web.

• Intel

®

•

Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or an optical drive.

Intel

®

F7 switch allows a user to select where the BIOS .bio file is located and perform the update from that location/device. Similar to performing a BIOS

Recovery without removing the BIOS configuration jumper.

Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS.

NOTE

Review the instructions distributed with the upgrade utility before attempting a BIOS update.


BIOS update utilities

Refer to

http://support.intel.com/support/motherboards/desktop/sb

/CS-022312.htm

.

3.6.1 Language Support

The BIOS Setup program and help messages are supported in US English. Check the

Intel web site for support.

70


3.6.2 Custom Splash Screen

During POST, an Intel

®

splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen.

NOTE

If you add a custom splash screen, it will share space with the Intel branded logo.


Intel ® Integrator Toolkit

Refer to

http://developer.intel.com/design/motherbd/software/itk/

Additional Intel

®

software tools http://developer.intel.com/design/motherbd/software.htm

3.7 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption

occurs, the BIOS could be damaged. Table 33 lists the drives and media types that

can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable.

Table 33. Acceptable Drives/Media Types for BIOS Recovery

Media Type

Optical drive connected to the SATA interface

USB removable drive (a USB Flash Drive, for example)

USB diskette drive (with a 1.44 MB diskette)

USB hard disk drive

Can be used for BIOS recovery?

Yes

Yes

No

No


BIOS recovery

Refer to

http://www.intel.com/support/motherboards/desktop/sb/ cs-023360.htm

71


3.8 Boot Options

In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drive, USB drive, USB flash drive, optical drive, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the optical drive third. If enabled, the last default boot device is the network.

3.8.1 Optical Drive Boot

Booting from the optical drive is supported in compliance to the El Torito bootable

CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the optical drive is listed as a boot device. Boot devices are defined in priority order.

Accordingly, if there is not a bootable CD in the optical drive, the system will attempt to boot from the next defined drive.

3.8.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed.

Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.

3.8.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present:

• Video adapter

• Keyboard

• Mouse

3.8.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices (as set in the BIOS setup program’s

Boot Device Priority Submenu). Table 34 lists the boot device menu options.

Table 34. Boot Device Menu Options

Boot Device Menu Function Keys

<↑> or <↓>

<Enter>

<Esc>

Description

Selects a default boot device

Exits the menu, saves changes, and boots from the selected device

Exits the menu without saving changes

72


3.9 Adjusting Boot Speed

These factors affect system boot speed:

• Selecting and configuring peripherals properly

• Optimized BIOS boot parameters

3.9.1 Peripheral Selection and Configuration

The following techniques help improve system boot speed:

• Choose a hard drive with parameters such as “power-up to data ready” in less than eight seconds to minimize hard drive startup delays.

• Select an optical drive with a fast initialization rate. This rate can influence POST execution time.

• Eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode changes in POST. These features may add time to the boot process.

• Try different monitors. Some monitors initialize and communicate with the BIOS more quickly, which enables the system to boot more quickly.

3.9.2 BIOS Boot Optimizations

Use of the following BIOS Setup program settings reduces the POST execution time.

• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the

POST does not first seek a diskette drive, which saves about one second from the

POST execution time.

• In the Peripheral Configuration submenu, disable the LAN device if it will not be used. This can reduce up to four seconds of option ROM boot time.

• The BIOS will automatically not load the option ROM for the SATA controller if no drives are installed in it during POST.

NOTE

It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen.

Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen.

This boot time may be so fast that some drives might be not be initialized at all. If this condition should occur, it is possible to introduce a programmable delay ranging from zero to 30 seconds by 5 second increments (using the Hard Disk Pre-Delay feature of the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup program).

73


3.10 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions:

• The supervisor password gives unrestricted access to view and change all the

Setup options in the BIOS Setup program. This is the supervisor mode.

• The user password gives restricted access to view and change Setup options in the

BIOS Setup program. This is the user mode.

• If only the supervisor password is set, pressing the <Enter> key at the password prompt of the BIOS Setup program allows the user restricted access to Setup.

• If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to

Setup respective to which password is entered.

• Setting the user password restricts who can boot the computer. The password prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer.

• For enhanced security, use different passwords for the supervisor and user passwords.

• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to

16 characters in length.

Table 35 shows the effects of setting the supervisor password and user password.

This table is for reference only and is not displayed on the screen.

Table 35. Supervisor and User Password Functions

Password

Set

Neither

Supervisor only

User only

Supervisor and user set

Supervisor

Mode

Can change all options

(Note)


N/A


User Mode


(Note)

Can change a limited number of options


Can change a limited number of options

Setup Options

None

Enter Password

Clear User Password

Supervisor Password

Enter Password

Password to Enter

Setup

None

Supervisor Password Supervisor

User

Supervisor or user

Note: If no password is set, any user can change all Setup options.

Password

During

Boot

None

None

User

Supervisor or user

74


3.11 BIOS Performance Features

The BIOS includes the following options to provide custom performance enhancements when using an Intel Core i7 and Intel Xeon processor in an LGA2011 socket.

• Processor frequency adjustment

• Processor voltage adjustment

• Memory clock adjustments

• Memory voltage adjustments

• QPI Bus voltage adjustment

• PCI Bus speed adjustment

• Fast Boot

75


76

4 Error Messages and Beep Codes

4.1 Speaker

The board-mounted speaker provides audible error code (beep code) information during POST.


The location of the onboard speaker

Figure 1, page 13

4.2 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s

speaker to beep an error message describing the problem (see Table 36).

Table 36. BIOS Beep Codes

Type Pattern

F2 Setup/F10 Boot Menu

Prompt

BIOS update in progress None

Video error On-off (1.0 second each) two times, then

2.5-second pause (off), entire pattern repeats

(beeps and pause) once and the BIOS will continue to boot.

Memory error

One 0.5 second beep when BIOS is ready to accept keyboard input

On-off (1.0 second each) three times, then


(beeps and pause) until the system is powered off.

Thermal trip warning Alternate high and low beeps (1.0 second each) for 8 beeps, followed by system shut down.

Frequency

932 Hz

932 Hz

When no VGA option ROM is found.

932 Hz

High beep 2000 Hz

Low beep 1500 Hz

77


4.3 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front

panel power LED to blink an error message describing the problem (see Table 37).

Table 37. Front-panel Power LED Blink Codes

Type

F2 Setup/F10 Boot Menu

Prompt

Pattern

None

BIOS update in progress Off when the update begins, then on for

0.5 seconds, then off for 0.5 seconds. The pattern repeats until the BIOS update is complete.

Video error On-off (1.0 second each) two times, then


(blink and pause) until the system is powered off.

Memory error

Thermal trip warning

On-off (1.0 second each) three times, then


(blinks and pause) until the system is powered off.

Each beep will be accompanied by the following blink pattern: .25 seconds on, .25 seconds off,

.25 seconds on, .25 seconds off. This will result in a total of 16 blinks.

Note

When no VGA option ROM is found.

4.4 BIOS Error Messages

Table 38 lists the error messages and provides a brief description of each.

Table 38. BIOS Error Messages

Error Message

CMOS Battery Low

CMOS Checksum Bad

Memory Size Decreased

No Boot Device Available

Explanation

The battery may be losing power. Replace the battery soon.

The CMOS checksum is incorrect. CMOS memory may have been corrupted. Run Setup to reset values.

Memory size has decreased since the last boot. If no memory was removed, then memory may be bad.

System did not find a device to boot.

78

Error Messages and Beep Codes

4.5 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred.

Displaying the POST codes requires a PCI bus add-in card, often called a POST card.

The POST card can decode the port and display the contents on a medium such as a seven-segment display.

NOTE

The POST card must be installed in PCI bus connector 1.

The following tables provide information about the POST codes generated by the BIOS:

•

Table 39 lists the Port 80h POST code ranges

•

Table 40 lists the Port 80h POST codes themselves

•

Table 41 lists the Port 80h POST sequence

NOTE

In the tables listed above, all POST codes and range values are listed in hexadecimal.

Table 39. Port 80h POST Code Ranges

Range

0x00 – 0x05

0x10, 0x20, 0x30,

0x40, 0x50

0x08 – 0x0F

0x11 – 0x1F

0x21 – 0x29

0x2A – 0x2F

0x31 – 0x35

0x36 – 0x3F

0x41 – 0x4F

0x50 – 0x5F

0x60 – 0x6F

0x70 – 0x7F

0x80 – 0x8F

0x90 – 0x9F

0xA0 – 0xAF

0xB0 – 0xBF

0xC0 – 0xCF

0xD0 – 0xDF

0xF0 – 0xFF

Subsystem

Entering SX states S0 to S5.

Resuming from SX states. 0x10 – 0x20 – S2, 0x30 – S3, etc.

Security (SEC) phase

PEI phase pre MRC execution

MRC memory detection

PEI phase post MRC execution

Recovery

Platform DXE driver

CPU Initialization (PEI, DXE, SMM)

I/O Buses: PCI, USB, ATA etc. 0x5F is an unrecoverable error. Start with PCI.

BDS

Output devices: All output consoles.

For future use

Input devices: Keyboard/Mouse.

For future use

Boot Devices: Includes fixed media and removable media. Not that critical since consoles should be up at this point.

For future use

For future use

79


Table 40. Port 80h POST Codes

Port 80 Code

0x1B

0x1C

0x21

0x23

0x24

0x27

0x15

0x16

0x17

0x18

0x19

0x1A

0x28

0x29

0x2A

0x2B

0x0E

0x0F

0x11

0x12

0x13

0x14

0x00,0x01,0x02,0x03,0x04,0x05

0x10,0x20,0x30,0x40,0x50

0x08

0x09

0x0A

0x0B

0x0C

0x0D

Progress Code Enumeration

ACPI S States

Entering S0, S2, S3, S4, or S5 state

Resuming from S2, S3, S4, S5

Security Phase (SEC)

Starting BIOS execution after CPU BIST

SPI prefetching and caching

Load BSP microcode

Load APs microcodes

Platform program baseaddresses

Wake Up All APs

Initialize NEM

Pass entry point of the PEI core

PEI before MRC

PEI Platform driver

Set bootmode, GPIO init

Early chipset register programming including graphics init

Basic PCH init, discrete device init (1394, SATA)

LAN init

Exit early platform init driver

PEI SMBUS

SMBUSriver init

Entry to SMBUS execute read/write

Exit SMBUS execute read/write

PEI CK505 Clock Programming

Entry to CK505 programming

Exit CK505 programming

PEI Over-Clock Programming

Entry to entry to PEI over-clock programming

Exit PEI over-clock programming

Memory

MRC entry point

Reading SPD from memory DIMMs

Detecting presence of memory DIMMs

Configuring memory

Testing memory

Exit MRC driver

PEI after MRC

Start to Program MTRR Settings

Done Programming MTRR Settings continued

80


Port 80 Code

0x50

0x51

0x52

0x58

0x59

0x5A

0x5B

0x49

0x4A

0x4B

0x4C

0x4D

0x4E

0x4F

0x43

0x44

0x45

0x46

0x47

0x48

0x31

0x33

0x34

0x41

0x42

Table 40. Port 80h POST Codes (continued)


PEIMs/Recovery

Crisis Recovery has initiated

Loading recovery capsule

Start recovery capsule/ valid capsule is found

CPU Initialization

CPU PEI Phase

Begin CPU PEI Init

XMM instruction enabling

End CPU PEI Init

CPU PEI SMM Phase

Begin CPU SMM Init smm relocate bases

Smm relocate bases for APs

End CPU SMM Init

CPU DXE Phase

CPU DXE Phase begin

Refresh memory space attributes according to MTRRs

Load the microcode if needed

Initialize strings to HII database

Initialize MP support

CPU DXE Phase End

CPU DXE SMM Phase

CPU DXE SMM Phase begin

Relocate SM bases for all APs

CPU DXE SMM Phase end

I/O BUSES

Enumerating PCI buses

Allocating resources to PCI bus

Hot Plug PCI controller initialization

USB

Resetting USB bus

Reserved for USB

ATA/ATAPI/SATA

Resetting PATA/SATA bus and all devices

Reserved for ATA continued

81



Port 80 Code

0x98

0x99

0x9A

0x9B

0xB0

0xB1

0x6F

0x90

0x91

0x92

0x93

0x94

0x95

0x67

0x68

0x69

0x6A

0x6B

0x6C

0x6D

0x6E

0x60

0x61

0x62

0x63

0x64

0x65

0x66


BDS

BDS driver entry point initialize

BDS service routine entry point (can be called multiple times)

BDS Step2

BDS Step3

BDS Step4

BDS Step5

BDS Step6

BDS Step7

BDS Step8

BDS Step9

BDS Step10

BDS Step11

BDS Step12

BDS Step13

BDS Step14

BDS return to DXE core (should not get here)

Keyboard (PS/2 or USB)

Resetting keyboard

Disabling the keyboard

Detecting the presence of the keyboard

Enabling the keyboard

Clearing keyboard input buffer

Instructing keyboard controller to run Self Test (PS/2 only)

Mouse (PS/2 or USB)

Resetting mouse

Detecting mouse

Detecting presence of mouse

Enabling mouse

Fixed Media

Resetting fixed media

Disabling fixed media

0xB2

0xB3

Detecting presence of a fixed media (IDE hard drive detection etc.)

Enabling/configuring a fixed media continued

82


0xBB

0xE4

0xE7

0xE8

0xE9

0xEB

0xF8

0xF9


Port 80 Code

0xB8

0xB9

0xBA


Removable Media

Resetting removable media

Disabling removable media

Detecting presence of a removable media (IDE, CDROM detection etc.)

Enabling/configuring a removable media

DXE Core

Entered DXE phase

BDS

Waiting for user input

Checking password

Entering BIOS setup

Calling Legacy Option ROMs

Runtime Phase/EFI OS Boot

EFI boot service ExitBootServices ( ) has been called

EFI runtime service SetVirtualAddressMap ( ) has been called

83


Table 41. Typical Port 80h POST Sequence

POST Code Description

21 Initializing a chipset component

22 Reading SPD from memory DIMMs

5A

28

90

94

E7

5A

92

90

94

01

00

51

92

90

94

95

EB

58

E4

12

13

50

23

25

28

34

Detecting presence of memory DIMMs

Configuring memory

Testing memory

Loading recovery capsule

Entered DXE phase

Starting application processor initialization

SMM initialization

Enumerating PCI buses

Allocating resourced to PCI bus


Resetting keyboard


Keyboard Self Test

Calling Video BIOS

Resetting USB bus



Resetting keyboard



Testing memory

Resetting keyboard


Waiting for user input

INT 19

Ready to boot

84

5 Regulatory Compliance and Battery

Disposal Information

5.1 Regulatory Compliance

This section contains the following regulatory compliance information for Intel Desktop

Board DX79SR:

• Safety standards

• European Union Declaration of Conformity statement

• Product Ecology statements

• Electromagnetic Compatibility (EMC) standards

• Product certification markings

5.1.1 Safety Standards

Intel Desktop Board DX79SR complies with the safety standards stated in Table 42

when correctly installed in a compatible host system.

Table 42. Safety Standards

Standard

CSA/UL 60950-1

EN 60950-1

IEC 60950-1

Title

Information Technology Equipment – Safety - Part 1: General

Requirements (USA and Canada)


Requirements (European Union)


Requirements (International)

85


5.1.2 European Union Declaration of Conformity

Statement

We, Intel Corporation, declare under our sole responsibility that the product Intel

Desktop Board DX79SR is in conformity with all applicable essential requirements

® necessary for CE marking, following the provisions of the European Council Directive

2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC

(ROHS Directive).

The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions.

This product follows the provisions of the European Directives 2004/108/EC,

2006/95/EC, and 2002/95/EC.

Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC,

2006/95/EC a 2002/95/EC.

Dansk Dette produkt er i overensstemmelse med det europæiske direktiv

2004/108/EC, 2006/95/EC & 2002/95/EC.

Dutch Dit product is in navolging van de bepalingen van Europees Directief

2004/108/EC, 2006/95/EC & 2002/95/EC.

Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja

2002/95/EC kehtestatud nõuetele.

Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC määräyksiä.

Français Ce produit est conforme aux exigences de la Directive Européenne

2004/108/EC, 2006/95/EC & 2002/95/EC.

Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie

2004/108/EC, 2006/95/EC & 2002/95/EC.

Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών

2004/108/EC, 2006/95/EC και 2002/95/EC.

Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai

Irányelv előírásainak.

Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer

2004/108/EC, 2006/95/EC, & 2002/95/EC.

Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,

2006/95/EC & 2002/95/EC.

Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un

2002/95/EC noteikumiem.

Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir

2002/95/EC nuostatas.

Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej

2004/108/EC, 2006/95/EC u 2002/95/EC.

Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet

2004/108/EC, 2006/95/EC & 2002/95/EC.

Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej

2004/108/EC, 206/95/EC i 2002/95/EC.

86

Regulatory Compliance and Battery Disposal Information

Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC,

2006/95/EC & 2002/95/EC.

Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC,

2006/95/EC & 2002/95/EC.

Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív

2004/108/EC, 2006/95/EC a 2002/95/EC.

Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC,

2006/95/EC in 2002/95/EC.

Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC,

2006/95/EC & 2002/95/EC.

Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC yönergelerine uyar.

5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns and regulations.

5.1.3.1 Disposal Considerations

This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly.

5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the

Intel Product Recycling Program to allow retail consumers of Intel’s branded products to return used products to selected locations for proper recycling.

Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc.

中文

作为其对环境责任之承诺的部分，英特尔已实施

Intel Product Recycling Program

（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰

当的重复使用处理。

请参考 http://www.intel.com/intel/other/ehs/product_ecology

了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。

Deutsch

Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel

Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel

Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben.

Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der http://www.intel.com/intel/other/ehs/product_ecology

87


Español

Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado.

Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envío, términos y condiciones, etc.

Français

Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à des adresses spécifiées.

Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les instructions d'expédition, les conditions générales, etc.

日本語

インテルでは、環境保護活動の一環として、使い終えたインテル

ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル

プログラムを発足させました。

対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、 http://www.intel.com/in tel/other/ehs/product_ecology （英語）をご覧ください。

Malay

Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,

Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.

Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb.

Portuguese

Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o

Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos são reciclados de maneira adequada.

Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponíveis, as instruções de envio, os termos e condições, etc.

88


Russian

В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации.

Пожалуйста, обратитесь на веб-сайт http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой программе, принимаемых продуктах, местах приема, инструкциях об отправке, положениях и условиях и т.д.

Türkçe

Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin

Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur.

Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen http://www.intel.com/intel/other/ehs/product_ecology

Web sayfasına gidin.

5.1.4 EMC Regulations

Intel Desktop Board DX79SR complies with the EMC regulations stated in Table 43

when correctly installed in a compatible host system.

Table 43. EMC Regulations

Regulation

FCC 47 CFR Part 15,

Subpart B

ICES-003

EN55022

EN55024

EN55022

CISPR 22

CISPR 24

VCCI V-3, V-4

KN-22, KN-24

CNS 13438

Title

Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio

Frequency Devices. (USA)

Interference-Causing Equipment Standard, Digital Apparatus. (Canada)

Limits and methods of measurement of Radio Interference Characteristics of Information Technology Equipment. (European Union)

Information Technology Equipment – Immunity Characteristics Limits and methods of measurement. (European Union)

Australian Communications Authority, Standard for Electromagnetic

Compatibility. (Australia and New Zealand)

Limits and methods of measurement of Radio Disturbance Characteristics of

Information Technology Equipment. (International)

Information Technology Equipment – Immunity Characteristics – Limits and

Methods of Measurement. (International)

Voluntary Control for Interference by Information Technology Equipment.

(Japan)

Korean Communications Commission – Framework Act on

Telecommunications and Radio Waves Act (South Korea)

Bureau of Standards, Metrology, and Inspection (Taiwan)

89


FCC Declaration of Conformity

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC performance of this product, contact:

Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124

1-800-628-8686

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.

This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications to the equipment not expressly approved by Intel

Corporation could void the user’s authority to operate the equipment.

Tested to comply with FCC standards for home or office use.

Canadian Department of Communications Compliance Statement

This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian

Department of Communications.

Le présent appareil numerique német pas de bruits radioélectriques dépassant les limites applicables aux appareils numériques de la classe B prescrites dans le

Réglement sur le broullage radioélectrique édicté par le ministére des Communications du Canada.

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Japan VCCI Statement

Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment

(VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.

Korea Class B Statement

Korea Class B Statement translation: This equipment is for home use, and has acquired electromagnetic conformity registration, so it can be used not only in residential areas, but also other areas.

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5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP

Compliance

The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements.

Intel Desktop Board DX79SR meets the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply:

• Energy Star v5.0, category B

• EPEAT*

• Korea e-Standby

• European Union Energy-related Products Directive 2009 (ErP) Lot 6

NOTE

Energy Star compliance is based at the system level not the board level. Use of an

Intel Desktop Board alone does not guarantee Energy Star compliance.


ENERGY STAR requirements and recommended configurations

Refer to

http://www.intel.com/go/energystar

Electronic Product Environmental Assessment Tool (EPEAT)

Korea e-Standby Program

European Union Energy-related Products Directive 2009 (ErP) http://www.epeat.net/ http://www.kemco.or.kr/new_eng/pg02/ pg02100300.asp

http://ec.europa.eu/enterprise/policies/s ustainable-business/sustainableproduct-policy/ecodesign/index_en.htm

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5.1.6 Regulatory Compliance Marks (Board Level)

Intel Desktop Board DX79SR has the regulatory compliance marks shown in Table 44.

Table 44. Regulatory Compliance Marks

Description

UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel Desktop Boards: E210882.

Mark

FCC Declaration of Conformity logo mark for Class B equipment.

CE mark. Declaring compliance to the European Union (EU) EMC directive,

Low Voltage directive, and RoHS directive.

Australian Communications Authority (ACA) and New Zealand Radio

Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code number, N-232.

Japan VCCI (Voluntary Control Council for Interference) mark.

Korea Certification mark. Includes an adjacent KCC (Korean Communications

Commission) certification number:

KCC-REM-CPU-DX79SR.

Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.

Includes adjacent Intel company number, D33025.

Printed wiring board manufacturer’s recognition mark. Consists of a unique

UL recognized manufacturer’s logo, along with a flammability rating (solder side).

China RoHS/Environmentally Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associated collateral. The color of the mark may vary depending upon the application. The Environmental

Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined to be 10 years.

V-0

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5.2 Battery Disposal Information

CAUTION

Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.

PRÉCAUTION

Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement.

FORHOLDSREGEL

Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning.

OBS!

Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning.

VIKTIGT!

Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbestämmelserna.

VARO

Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti.

VORSICHT

Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen

Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.

AVVERTIMENTO

Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.

Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.

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PRECAUCIÓN

Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.

WAARSCHUWING

Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.

ATENÇÃO

Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.

As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região.

AŚCIAROŽZNAŚĆ

Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.

Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.

UPOZORNÌNÍ

V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí.

Προσοχή

Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία

λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι

δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με

τους κατά τόπο περιβαλλοντικούς κανονισμούς.

VIGYÁZAT

Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni.

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AWAS

Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan.

OSTRZEŻENIE

Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.

PRECAUŢIE

Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.

Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului.

ВНИМАНИЕ

При использовании батареи несоответствующего типа существует риск ее взрыва.

Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям.

UPOZORNENIE

Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.

Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.

POZOR

Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.

Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi.

UYARI

Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.

OСТОРОГА

Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.

Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.

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Intel BOXDX79SR Specification

Assistant Bot

Intel® Desktop Board

DX79SR

Technical Product Specification

Revision History

Board Identification Information

Specification Changes or Clarifications

Errata

Preface

Intended Audience

What This Document Contains

Typographical Conventions

Notes, Cautions, and Warnings

NOTE

CAUTION

Other Common Notation

Contents

Revision History

Preface

1 Product Description

2 Technical Reference

3 Overview of BIOS Features

4 Error Messages and Beep Codes

5 Regulatory Compliance and Battery Disposal Information

Figures

Tables

1 Product Description

1.1 Overview

1.1.1 Feature Summary

1.1.2 Board Layout

1.1.3 Block Diagram

1.2 Legacy Considerations

1.3 Online Support

1.4 Processor

CAUTION

NOTE

1.4.1 PCI Express x16 Graphics

1.5 System Memory

NOTE

CAUTION

1.5.1 Memory Configurations

NOTE

1.6 Intel

®

X79 Express Chipset

1.6.1 USB

NOTE

1.6.2 SATA Interfaces

NOTE

1.6.2.1 SATA RAID

NOTE

1.7 Real-Time Clock Subsystem

NOTE

1.8 Legacy I/O Controller

1.8.1 Consumer Infrared (CIR)

1.9 Audio Subsystem

1.9.1 Audio Subsystem Software

1.9.2 Audio Subsystem Components

NOTE

1.10 LAN Subsystem

1.10.1 Intel

82579L and Intel

82574L Gigabit Ethernet

Controllers

1.10.2 LAN Subsystem Software

1.10.3 RJ-45 LAN Connector with Integrated LEDs

1.11 Bluetooth*/WiFi Module

1.11.1 Bluetooth Technology

1.11.2 WiFi 802.11 Wireless

1.12 Hardware Management Subsystem

1.12.1 Hardware Monitoring and Fan Control

1.12.2 Fan Monitoring

1.12.3 Chassis Intrusion and Detection

1.12.4 Thermal Monitoring

1.13 Power Management

1.13.1 ACPI

1.13.1.1 System States and Power States

1.13.1.2 Wake-up Devices and Events

NOTE

**1.11 Bluetooth*/WiFi Module**