TCB502HQ - TOSHIBA Semiconductor
TCB502HQ
CDMOS Linear Integrated Circuit Silicon Monolithic
TCB502HQ
Maximum Power 49 W BTL × 4ch Audio Power Amp IC
1.
Description
The TCB502HQ is a power IC with built-in four-channel BTL
amplifier developed for car audio application. The maximum
output power POUT is 49 W using a pure complementary P-ch
and N-ch DMOS output stage.
In addition, a standby switch, a mute function, output offset
voltage detector, various protection features are included.
2.
Applications
Power Amp IC developed for car audio applications.
3.
Weight: 7.7g (typ.)
Features
 High output power, low distortion, and low noise property
(for details, refer to the Table 1 Typical Characteristics).
 Built-in output offset detection for full time (Pin25)
 Built-in muting function (Pin 22)
 Built-in auto muting functions (for low VDD and standby
sequence)
Table 1 Typical characteristics
(Note 1)
Test condition
 Built-in standby switch (Pin4)
 Built-in various protection circuits (thermal shut down,
over-voltage, short to GND, short to VDD, and output to output
short)
 Start stop Cruising corresponded to VDD = 6 V (Engine idle
reduction capability)
Typ.
Unit
Output power (POUT)
VDD = 15.2 V, max POWER
49
VDD = 14.4 V, max POWER
44
VDD = 14.4 V, THD = 10%
29
THD = 10%
24
W
Total harmonic distortion (THD)
POUT = 4 W
0.006
%
Output noise voltage (VNO) (Rg = 0 Ω)
Filter: A weighted
45
µV
Operating Supply voltage range (VDD)
RL_amp = 4 Ω
6 to 18
RL_amp = 2 Ω
6 to 16
V
Note 1:
Typical test conditions: Unless otherwise specified, VDD = 13.2 V, f = 1 kHz, RL_amp = 4 Ω, and Ta = 25°C
Rg: Signal source resistance
©2016 TOSHIBA Corporation
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TCB502HQ
1
6
20
NC
VDD2
VDD1
11
C1: 0.22 μF
9
IN1
8
7
AC-GND
C1: 0.22 μF
C3: 0.1 μF
10
Ripple
C5:
3900 μF
C2: 10 μF
Block Digaram
+B
OUT1 (+)
PW-GND1
RL_amp
OUT1 (−)
IN2
12
5
2
13 Pre-GND
3
AC-GND
C1: 0.22 μF IN3
15
17
OUT2 (+)
PW-GND2
RL_amp
OUT2 (−)
OUT3 (+)
PW-GND3
16 AC-GND
19
AC-GND
C1: 0.22 μF IN4
14
Mute
OUT3 (−)
OUT4 (+)
21
24
5V
Play
RL_amp
18
C6: 1 μF
PW-GND4
RL_amp
4 Stby
R1: 47 kΩ
C4: 1 μF
4.
22 Mute
23
AC-GND
Offset Det
OUT4 (−)
25
Some of the functional blocks, circuits or constants labels in the block diagram may have been omitted or simplified for
clarity.
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5.
5.1
Pin Configuration
Pin configuration (top view)
Offset Det
PW-GND4
OUT4 (-)
Mute
OUT4 (+)
VDD1
OUT3 (-)
PW-GND3
OUT3 (+)
AC-GND
IN3
IN4
Pre-GND
IN2
IN1
Ripple
OUT1 (+)
PW-GND1
OUT1 (-)
VDD2
OUT2 (+)
Stby
OUT2 (-)
PW-GND2
NC
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5.2
Pin Description
Pin
Symbol
I/O
Description
1
NC
―
No Connect
2
PW-GND2
―
Ground for OUT2
3
OUT2(-)
OUT
OUT2 (-) output
4
Stby
VST-IN
Stand-by voltage input
5
OUT2(+)
OUT
OUT2 (+) output
6
VDD2
VDD-IN
Supply voltage 2
7
OUT1(-)
OUT
OUT1 (-) output
8
PW-GND1
―
Ground for OUT1
9
OUT1(+)
OUT
OUT1 (+) output
10
Ripple
―
Ripple voltage
11
IN1
IN
OUT1 input
12
IN2
IN
OUT2 input
13
Pre-GND
―
Signal ground
14
IN4
IN
OUT4 input
15
IN3
IN
OUT3 input
16
AC-GND
―
Common reference voltage for all input
17
OUT3(+)
OUT
OUT3 (+) output
18
PW-GND3
―
Ground for OUT3
19
OUT3(-)
OUT
OUT3 (-) output
20
VDD1
VDD-IN
Supply voltage 1
21
OUT4(+)
OUT
OUT4 (+) output
22
Mute
VmuteIN
Mute voltage input
23
OUT4(-)
OUT
OUT4 (-) output
24
PW-GND4
―
Ground for OUT4
25
Offset Det
Vod-OUT
Output offset/short voltage detector output
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1
NC
6
VDD2
20
VDD1
11
C1: 0.22 μF
9
IN1
8
7
AC-GND
C1: 0.22 μF
C3: 0.1 μF
10
Ripple
C5:
3900 μF
Specification of External Parts
C2: 10 μF
6.
+B
OUT1 (+)
PW-GND1
RL_amp
OUT1 (−)
IN2
12
5
2
13 Pre-GND
3
AC-GND
C1: 0.22 μF IN3
15
17
OUT2 (+)
PW-GND2
RL_amp
OUT2 (−)
OUT3 (+)
PW-GND3
C6: 1 μF
16 AC-GND
19
AC-GND
C1: 0.22 μF IN4
14
OUT4 (+)
24
Component Recommended
Name
Value
PW-GND4
RL_amp
4 Stby
R1: 47 kΩ
C4: 1 μF
Mute
OUT3 (−)
21
5V
Play
RL_amp
18
22 Mute
23
AC-GND
Offset Det
OUT4 (−)
25
Effect (Note 1)
Pin
Purpose
Lower than Recommended Value
Higher than Recommended Value
C1
0.22 μF
Inx (x: 1 to 4)
To eliminate DC
Cut-off frequency becomes higher
Cut-off frequency becomes lower
C2
10 μF
Ripple
To reduce ripple
Turn on time shorter
Turn on time longer
C3
0.1 μF
VDD1, VDD2
To provide sufficient
oscillation margin
Reduces noise and provides sufficient oscillation margin
C6
1 μF
AC-GND
Common reference
voltage for all input
Pop noise is suppressed when C1:C6 = 1:4 (Note 2).
C5
3900 μF
VDD1, VDD2
Ripple filter
Filter for power supply humming and ripple
R1
47 kΩ
Mute
Mute ON/OFF
Smooth switching
C4
1 μF
Pop noise becomes larger
Switching time becomes longer
Note 1: When the unrecommended value is used, please examine it enough by system evaluation.
Note 2: Since "AC-GND" pin is a common reference voltage for all input, this product needs to set the ratio of an input
capacitance (C1) and the AC-GND capacitance (C6) to 1:4.
Note 3: Use the low leak current capacitor for C1 and C6.
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7.
Standby switch function (Pin 4)
The power supply can be turned on or off via pin 4 (Stby).
The threshold voltage of pin 4 is below table. The power
supply current is about 0.01 μA (typ.) in the standby state.
Power
ON
10 kΩ
4
OFF
Table 2 Standby Control Voltage (VSB): Pin 4
Stand-by
Power
VSB (V)
ON
OFF
0 to 0.8
OFF
ON
2.2 to VDD
Figure 1
Internal circuit for standby
Benefits of the Standby Switch
(1)
(2)
VDD can be directly turned on or off by a microcontroller, eliminating the need for a switching relay.
Since the control current is minuscule, a low-current-rated switching relay can be used.
Relay
High-current-rated switch
Battery
Battery
VDD
VDD
From micro controller
– Conventional method –
From micro controller
Low-current-rated switch
Battery
Battery
Stby
Stby
VDD
VDD
– Using the standby switch -
Figure 2 Standby switch
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8.
Mute Function (Pin 22)
The audio mute function is enabled by setting pin 22 Low. R1 and C4 determine the time constant of the mute
function. The time constant affects pop noise generated when power or the mute function is turned on or off; thus, it
must be determined on a per-application basis (Refer to Figures 3 and 4).
The values of external elements (R1, C4) of this pin have decided them based on 5 V control. In case that it is
controlled by other than 5 V, please reexamine the value of the external pull-up resistor as follows;
For example:
When the control voltage is changed from 5 V to 3.3 V, the pull-up resistor should be: 3.3 V/5 V  47 kΩ = 31 kΩ
ATT – VMUTE
ATT (dB)
5V
10 kΩ
22
C4
Mute attenuation
R1
Control voltage: VMUTE (V)
Figure 4 Mute attenuation − VMUTE (V)
Figure 3 Mute Function
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9.
Auto Muting Functions
The TCB502HQ has two automatic mute functions.
a) Low VDD Mute (Automatic mute function)
b) Standby Off Mute.
9.1
Low VDD Mute
When the supply voltage became lower than 5.5 V (typ.), The TCB502HQ operates the mute circuit automatically.
This function prevents the large audible transient noise which is generated by low VDD.
9.2
Standby-Off Mute
The TCB502HQ operates the mute circuit during the standby-off transition. When the ripple voltage reached
VDD/5, the standby-off mute is terminated. Additionally, in the standby-off transition, it is recommended that the
external mute has to be ON till the internal mute-OFF, and that the timing of the external mute-OFF has to be set
after the internal mute-OFF.
VSB
Stby pin
(Pin 4)
t
0
VM
Mute control
voltage
t
0
VM
Mute pin
(Pin 22)
t
0
VDD/4
VDD/5
Ripple pin
(Pin 10)
t
0
Out sound time 500 ms (max) (Note 1)
VDD/2
Output pin
t
0
Figure 5 Timing chart when standby-off
Note 1: Out sound time is changed due to capacity of the C2 capacitor.
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9.3
Mute off after standby off
The pop noise is generated when the capacitor of ripple, input, and ACGND has not finished to charge fully.
Please set "Mute-off" that it is sufficient margin in considering an enough charge time after the middle point
potential stable.
VSB
Stby pin
(Pin 4)
t
0
VM
Mute control
voltage
t
0
VM
Mute pin
(Pin 22)
t
0
VDD/4
Ripple pin
(Pin 10)
t
0
VDD/2
Output pin
t
0
Figure 6 Mute-off transition after standby-off
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10. Output DC Offset Detection
This function detects the offset voltage between OUT (+) and OUT (-). The detection result is gotten by pin25.
When the offset voltage appeared by the external parts accident, for example the leak of coupling capacitor, this
function can contribute to a part of safety system to prevent the speaker damage.
The example flowchart: The safety system to prevent damaging to speakers by abnormal offset.
(a) Offset detection → (b) Judgment Normal/Abnormal → (c) To reduce the speaker stress Standby-ON, Mute-ON etc.
The result of detection does not judge the abnormal offset or not. This function detects only the offset voltage
which is decided by specification.
10.1
Operation description of output offset pin
The result of output offset voltage detection of Pin25 is gotten by the internal open-drain transistor which
synchronizes with offset voltage. This function is always available.
If this pin does not be used, connect to GND or open.
Power Amp IC
Leak or short
Vref
Vref
25
Vin(dc)
V25
+
RS1
(Reference)
The specification defines the Offset voltage as
"OUT(+) - OUT(-)"
Rs1: generates the positive offset voltage.
Rs2: generates the negative offset voltage.
E. vol
Vout(dc)
Vout(dc) > Vin(dc)
RS2
Vos-det(on)
−
Leak or short
Figure 7 Generating example of abnormal output offset voltage
Abnormal offset voltage
+Vos-det(on)
t
Output waveform 0
OUT(+) to OUT(-)
-Vos-det(on)
V25
Outputing low when the
voltage exceeds the
threshold value.
Offset
detection
output
0
Term of abnormal offset vlotage
Figure 8 Output waveform of amplifier and pin25
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10.2 Output Short detection
This function can detect an output short in the case that the OUT pin is short-circuiting to VDD/GND or the
overvoltage which is more than 23 V (typ.) is applied to the power supply pin (Refer to Figure 9).
In the case of a load short-circuit, the MOS transistor also repeats turning on/off depending on output signals (Refer
to Figure 10).
Furthermore, set the pull-up resistance so that Io = 500 μA or less.
VP
IO
Output pin short/
Over voltage
25
Output short/
Over voltage
Detector
Microcomputer
Cancel
V25
V25
Normal
Operation
25pin voltage
Output short
V
V
25pin voltage
Normal
Operation
GND
t
GND
Cancel
t
20 µs (min)
Out short detection/
Over voltage detection
Output short
Figure 9 Output short detection/
Overvoltage detection
10.3
Figure10 Output to GND short detection
Layer Short Detection
The TCB502HQ may be properly connected to a load such as a 2-Ω speaker, but one of the speaker lines may be
shorted to ground through a low-impedance path. The TCB502HQ can detect such a condition.
VDD
IC
out
SP = 2 Ω
out
GND
The negative (−) speaker connection is shorted to ground
through a low-impedance path due to some irregularities.
Figure 11 Layer Short
As is the case with output DC offset detection, pin25 is also activated when there is a short on one of the speaker
lines as shown above. The detection impedance is 2.5 Ω (typ.).
This feature allows detection of the short-circuit through a low-impedance path other than the speaker impedance.
It helps to avoid speaker damage in case of anomalous system conditions and improve system reliability.
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11. Low voltage operation
The TCB502HQ applies the amplifier circuit to reduce the audible pop noise and sound cutting due to low VDD
voltage.
11.1
Operation description at Cruising
When the headroom voltage is suppressed by the low VDD, the TCB502HQ switches output middle point potential
from VDD/2 to VDD/4 and reduces the audible pop noise and the sound cutting. The behavior of outputs (Vout) and
ripple (Vrip) is showed the figure 12 below.
(A) VDD > Vth1
(B) VDD < Vth1
(C) VDD < Vth2
Normal operation
Switch middle point potential from VDD/2 to Vrip to keep the headroom voltage.
The C2 (ripple) is discharged with muting, and amplifier is off.
Each of threshold voltage is below.
Vrip = 3 V (Ripple pin voltage)
Vhr1 = 2.2 V (typ.), Vhr2 = 1.7 V (typ.)
Vth1 = Vout + Vhr1 = 2Vrip + Vhr1, Vth2 = Vrip + Vhr2
Figure 12 Output VDD/2 voltage in lowering VDD
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12. Protection Functions
This product has internal protection circuits such as thermal shut down, over-voltage, short to VDD, short to GND,
and out to out short circuit protections.
(1)
Thermal shut down
It operates when junction temperature exceeds 150°C (typ.).
When it operates, it is protected in the following order.
1.
2.
3.
An Attenuation of an output starts first and the amount of attenuation also increases according
to a temperature rising,
All outputs become in a mute state, when temperature continues rising in spite of output
attenuation.
Shutdown function starts, when a temperature rise continues though all outputs are in a mute
state.
In any case if temperature falls, it will return to normal operation automatically.
(2)
Over-voltage
It operates when voltage exceeding operating range is supplied to VDD pin. If voltage falls, it will
return to normal operation automatically. When it operates, all outputs bias and high-side switch are
turned off and all outputs are shut-off. Threshold voltage is 21.5 V (typ.)
(3)
Short to VDD, Short to GND, Output to output short
It operates when each output pin is in irregular connection and the load line goes over the SOA (Safe
Operation Area) of power transistor (DMOS). When it operates, all outputs bias circuits are turned off
and all outputs are shut-off. If irregular connection is canceled, it will return to normal operation
automatically.
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13. Absolute Maximum Ratings
(Ta = 25°C unless otherwise specified)
Characteristics
Symbol
Rating
Unit
VDD (surge)
50
V
Max 0.2 s
Supply voltage (DC)
VDD (DC)
25
V
Max voltage applied for 1 min
Output current of amplifier (surge)
Io (Peak)
9
A
Supply voltage (surge)
Condition
Power dissipation
PD
125
W
(Note 1)
Junction temperature
Tj
150
°C
(Note 2)
Operating temperature range
Topr
-40 to 85
°C
Storage temperature
Tstg
-55 to 150
°C
dV1-2
±0.3
V
Permissive voltage difference
between VDD1 and VDD2
Pre-GND to PW-GND
dV_Gnd
±0.3
V
Permissive voltage difference
between Pre-GND and PW-GND
VDD
VDD1,2
6 to 18
V
RL = 4 Ω
Stby
Stby
GND-0.3 to VDD+0.3
V
Mute
Mute
GND-0.3 to VDD+0.3
V
In1,2,3,4
GND-0.3 to VDD+0.3
V
ACG
GND-0.3 to VDD+0.3
V
Ripple
Rip
GND-0.3 to VDD+0.3
V
P25 Diag
Diag
GND-0.3 to VDD+0.3
V
Voltage
difference
between pins
Voltage of
input pin
VDD1 to VDD2
IN
ACGND
The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not be
exceeded during operation, even for an instant.
If any of these rating would be exceeded during operation, the device electrical characteristics may be irreparably
altered and the reliability and lifetime of the device can no longer be guaranteed. Moreover, these operations with
exceeded ratings may cause break down, damage, and/or degradation to any other equipment. Applications using the
device should be designed such that each maximum rating will never be exceeded in any operating conditions.
Before using, creating, and/or producing designs, refer to and comply with the precautions and conditions set forth in
this document.
Note 1: Package thermal resistance Rth(j-t) = 1°C/W (typ.) (Ta = 25°C, with infinite heat sink)
Note 2: When the TAB temperature is more than absolute maximum ratings, the thermal shut down system (mute)
operates. The threshold TAB temperature is 160°C (typ.). The threshold TAB temperature is defined as the
highest temperature point of the metal side surface. Regarding heat radiation design, please design the device
so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and
condition.
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14. Power dissipation
PD (max) – Ta
120
Power Dissipation PD (max)
(W)
(1) Infinite heat sink
Rth(j-t) = 1°C/W
100
(2) Heat sink (Rth(HS) = 3.5°C/W)
Rth(j-t) + Rth(HS) = 4.5°C/W
(3) No heat sink
80
Rth(j-a) = 39°C/W
(1)
60
40
20
(2)
(3)
0
0
25
50
75
Ambient Temperature
100
Ta
125
150
(°C)
15. Operating Range
Characteristics
Supply voltage
Symbol
VDD
Condition
Min
Typ.
Max
Unit
RL = 4 Ω
6
—
18
V
RL = 2 Ω
6
—
16
V
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16. Electrical Characteristics
16.1
Amplifier
(Unless otherwise specified, VDD = 13.2 V, f = 1 kHz, RL_amp = 4 Ω, Vsb/Vm = 5 V, Ta = 25°C)
Characteristics
Symbol
Quiescent supply current
IQ
Test Condition
VIN = 0V
Min
Typ.
Max
Unit
100
180
320
mA
POUT MAX (1)
VDD = 15.2 V, max POWER
—
49
—
POUT MAX (2)
VDD = 14.4 V, max POWER
—
44
—
POUT (1)
VDD = 14.4 V, THD = 10%
27
29
—
POUT (2)
THD = 10%
21
24
—
VDD = 14.4 V, max POWER
—
80
—
POUT (3)
VDD = 14.4 V, THD = 10%
—
46
—
POUT (4)
THD = 10%
—
45
—
THD
POUT = 5 W
—
0.006
0.07
%
GV
VOUT = 0.775 Vrms
25
26
27
dB
Channel-to-channel voltage gain
ᇞGV
VOUT = 0.775 Vrms
−1.0
0
1.0
dB
Output noise voltage
VNO
Rg = 0 Ω, DIN Audio
—
45
80
μV
Ripple rejection ratio
R.R.
frip = 100 Hz, Rg = 620 Ω
Vrip = 0.775 Vrms
50
70
—
dB
Crosstalk
C.T.
Rg = 620 Ω
POUT = 4 W
—
80
—
dB
Output power
POUT MAX (3)
Output power (RL = 2 Ω)
Total harmonic distortion
Voltage gain
W
VOFFSET
—
−70
0
70
mV
Input resistance
RIN
—
—
100
—
kΩ
Standby current
ISB
Standby, V4 = 0, V22 = 0
—
0.01
1
μA
VSB H
POWER: ON
2.2
—
VDD
VSB L
POWER: OFF
0
—
0.8
VM H
MUTE: OFF
2.2
—
VDD
VM L
MUTE: ON, R1 = 47 kΩ
0
—
0.8
MUTE: ON, DIN Audio
VOUT = 7.75 Vrms → Mute: OFF
85
100
—
Output offset voltage
Standby control voltage
Mute control voltage
Mute attenuation
16.2
ATT M
V
V
dB
Output offset voltage detection
(Unless otherwise specified, VDD = 13.2 V, f = 1 kHz, RL_amp = 4 Ω, Rpull-up = 10 kΩ, Vsb/Vref = 5 V, and Ta = 25°C)
Test condition
Characteristics
Symbol
Supply voltage for detection of output offset
VDD_offset1
Vsb = 5 V, Vref = 5 V
Detection voltage for output offset
Vos1-det(on)
Vsb = 5 V, Vo(+)-Vo(-)
Saturated voltage in detection
P25-sat
Detection time for output offset
Dtime
Rpull-up = 10 kΩ, Vref = 5.0 V
In detection (Pin: Low )
Quiescent
16
Min
Typ.
Max
Unit
6
―
18
V
±1.5
±2.0
V
―
100
500
mV
―
300
500
ms
±1.0
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TCB502HQ
1
NC
6
VDD2
20
VDD1
11
C1: 0.22 μF
9
IN1
8
7
AC-GND
C1: 0.22 μF
C3: 0.1 μF
10
Ripple
C5:
3900 μF
C2: 10 μF
17. Test circuit
+B
OUT1 (+)
PW-GND1
RL_amp
OUT1 (−)
IN2
12
5
2
13 Pre-GND
3
AC-GND
C1: 0.22 μF IN3
15
17
OUT2 (+)
PW-GND2
RL_amp
OUT2 (−)
OUT3 (+)
PW-GND3
C6: 1 μF
16 AC-GND
19
AC-GND
C1: 0.22 μF IN4
14
OUT4 (+)
24
PW-GND4
RL_amp
4 Stby
R1: 47 kΩ
C4: 1 μF
Mute
OUT3 (−)
21
5V
Play
RL_amp
18
22 Mute
23
AC-GND
Offset Det
17
OUT4 (−)
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18. Characteristic Chart
18.1
Total Harmonic Distortion vs. Output Power
THD – POUT (ch2)
Vdd = 13.2 V
Vdd = 13.2 V
GV = 26 dB
GV = 26 dB
RL = 4 Ω
Filter
RL = 4 Ω
Filter
1 kHz
(%)
100 Hz : to 30 kHz
: 400 Hz to 30 kHz
THD
10 kHz : 400 Hz or more
20 kHz : 400 Hz or more
100 Hz : to 30 kHz
1 kHz
: 400 Hz to 30 kHz
10 kHz : 400 Hz or more
20 kHz : 400 Hz or more
20 kHz
Total harmonic distortion
20 kHz
Total harmonic distortion
THD
(%)
THD – POUT (ch1)
10 kHz
100 Hz
10 kHz
100 Hz
f = 1 kHz
f = 1 kHz
Output power
POUT
(W)
Output power
THD – POUT (ch3)
20 kHz
Total harmonic distortion
100 Hz : to 30 kHz
10 kHz : 400 Hz or more
1 kHz
: 400 Hz to 30 kHz
20 kHz : 400 Hz or more
Total harmonic distortion
20 kHz : 400 Hz or more
(%)
10 kHz : 400 Hz or more
: 400 Hz to 30 kHz
THD
RL = 4 Ω
Filter
(%)
GV = 26 dB
RL = 4 Ω
Filter
THD
Vdd = 13.2 V
GV = 26dB
1 kHz
(W)
THD – POUT (ch4)
Vdd = 13.2 V
100 Hz : to 30 kHz
POUT
10 k
20 kHz
10 kHz
100 Hz
100 Hz
f = 1 kHz
f = 1 kHz
Output power
POUT
(W)
Output power
POUT
(W)
Figure 13-1 Total Harmonic Distortion of Each Frequency (RL = 4 Ω)
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THD – POUT (ch1)
GV = 26 dB
RL = 4 Ω
f = 1 kHz
Filter
400 Hz to 0 kHz
10
GV = 26 dB
RL = 4 Ω
f = 1 kHz
Filter
400 Hz to 30 kHz
(%)
THD
1
0.1
Total harmonic distortion
Total harmonic distortion
THD
(%)
10
THD – POUT (ch2)
6V
13.2 V
18 V
0.01
0.001
1
6V
0.1
13.2 V
18 V
0.01
0.001
0.1
1
10
Output power
POUT
100
0.1
(W)
POUT
100
(W)
THD – POUT (ch4)
GV = 26 dB
RL = 4 Ω
f = 1 kHz
Filter
400 Hz to 30 kHz
10
GV = 26 dB
RL = 4 Ω
f = 1 kHz
Filter
400 Hz to 30 kHz
(%)
(%)
THD
1
Total harmonic distortion
THD
Total harmonic distortion
10
Output power
THD – POUT (ch3)
10
1
6V
0.1
13.2 V
18 V
0.01
0.001
1
6V
0.1
13.2 V
18 V
0.01
0.001
0.1
1
Output power
10
POUT
100
0.1
1
Output power
(W)
10
POUT
100
(W)
Figure 13-2 Total Harmonic Distortion by Power-supply Voltage (RL = 4 Ω)
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18.2
Various Frequency Characteristics
THD – f(ch2)
18 V
RL = 4 Ω
POUT = 5 W
13.2 V
No Filter
frequency f
6V
No Filter
frequency f
(kHz)
(%)
THD – f(ch4)
THD
THD
(%)
RL = 4 Ω
POUT = 5 W
13.2 V
18 V
(kHz)
THD – f(ch3)
Total harmonic distortion
Total harmonic distortion
6V
13.2 V
6V
RL = 4 Ω
POUT = 5 W
18 V
Total harmonic distortion
Total harmonic distortion
THD
THD
(%)
(%)
THD – f(ch1)
13.2 V
6V
RL = 4 Ω
POUT = 5 W
18 V
No Filter
frequency f
No Filter
(kHz)
frequency f
(kHz)
Figure 13-3 Frequency Characteristics of Total Harmonic Distortion
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GV – f
ATTMUTE
1ch to 4ch
VDD = 13.2 V
RL = 4 Ω
VOUT = 7.75 Vrms (20 dBm)
Mute attenuation
VDD = 13.2 V
RL = 4 Ω
VOUT = 0.775 Vrms
1ch to 4ch
(0 dBm)
frequency
周 波 数f (kHz)
f (kHz)
frequency f
(kHz)
Figure 13-4 Frequency Characteristics of Voltage Gain and Mute Attenuation
R.R. – f
(dB)
VDD= 13.2 V
RL = 4 Ω
RG = 620 Ω
R.R.
Vrip = 0.775 Vrms (0 dBm)
GV = 26 dB
Ripple rejection ratio
Voltage gain
GV
(dB)
(dB)
ATTMUTE – f
1ch
3ch
2ch
4ch
frequency f
(kHz)
Figure 13-5 Frequency Characteristics of Ripple Rejection Rate
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C.T. – f (ch2)
Cross talk
4ch
3ch
1ch
Cross talk
2ch
VDD = 13.2 V
RL = 4 Ω
f = 1 kHz
VOUT = 0.775 Vrms (0 dBm)
RG = 620 Ω
C.T.
(dB)
VDD = 13.2 V
RL = 4 Ω
f = 1 kHz
VOUT = 0.775 Vrms (0 dBm)
RG = 620 Ω
C.T.
(dB)
C.T. – f (ch1)
4ch
3ch
frequency f
(kHz)
frequency f
C.T. – f (ch3)
C.T. – f (ch4)
VDD = 13.2 V
RL = 4 Ω
f = 1 kHz
VOUT = 0.775 Vrms (0 dBm)
RG = 620 Ω
(dB)
VDD = 13.2 V
RL = 4 Ω
f = 1 kHz
VOUT = 0.775 Vrms (0 dBm)
RG = 620 Ω
(dB)
(kHz)
C.T.
C.T.
1ch
2ch
3ch
Cross talk
Cross talk
4ch
2ch
1ch
frequency f
(kHz)
frequency f
(kHz)
Figure 13-6 Frequency Characteristics of Cross Talk
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18.3
Output Power Characteristics to Input Voltage
POUT (ch2) – VIN
10 kHz
10 kHz
POUT
POUT
1 kHz
100 Hz
Output power
f = 20 kHz
VIN (rms)
VDD = 13.2 V
RL = 4 Ω
No Filter
(V)
Input signal voltage
(V)
(W)
f = 20 kHz
VDD = 13.2 V
RL = 4 Ω
No Filter
VIN (rms)
10 kHz
1 kHz
POUT
100 Hz
100 Hz
f = 20 kHz
Output power
1 kHz
VDD = 13.2 V
RL = 4 Ω
No Filter
Input signal voltage
(V)
VIN (rms)
(V)
Power Dissipation vs. Output Power
(W)
PD – POUT (RL = 4 Ω)
18 V
PD
Power dissipation
18.4
VIN (rms)
POUT (ch4) – VIN
10 kHz
Output power
POUT
(W)
POUT (ch3) – VIN
Input signal voltage
100 Hz
f = 20 kHz
VDD = 13.2 V
RL = 4 Ω
No Filter
Input signal voltage
1 kHz
Output power
(W)
(W)
POUT (ch1) – VIN
13.2 V
f = 1 kHz
RL = 4 Ω
6V
4ch drive
Output power
POUT/CH
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(W)
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18.5
Other characteristics
ICCQ – VDD
VNO – Rg
VIN = 0 V
(mA)
RL = 4 Ω
f = 1 kHz
Filter
ICCQ
to 20 kHz
RL = 
Quicent current
Output noise voltage
VNO
(μV)
VDD = 13.2 V
1ch to 4ch
Signal source resistance
Supply voltage
Rg (Ω)
24
VDD
(V)
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19. Package Dimensions
Unit: mm
Weight: 7.7 g (typ.)
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20. Attention in Use
 Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case
of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its
absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise
occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead
smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate
settings, such as fuse capacity, fusing time and insertion circuit location, are required.
 If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
For details on how to connect a protection circuit such as a current limiting resistor or back electromotive
force adsorption diode, refer to individual IC datasheets or the IC databook. IC breakdown may cause
injury, smoke or ignition.
 Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or
ignition.
 Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator. If there is a large amount of
leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If
this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure
can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In
particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs
output DC voltage to a speaker directly.
 Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs
under all circumstances. If the Over current protection circuits operate against the over current, clear the
over current status immediately. Depending on the method of use and usage conditions, such as
exceeding absolute maximum ratings can cause the over current protection circuit to not operate
properly or IC breakdown before operation. In addition, depending on the method of use and usage
conditions, if over current continues to flow for a long time after operation, the IC may generate heat
resulting in breakdown.
 Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal
shutdown circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
 Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any
time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation
design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,
please design the device taking into considerate the effect of IC heat radiation with peripheral
components.
 Installation to Heat Sink
Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive
mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of
internal IC chip. In addition, depending on the IC, the use of silicon rubber may be prohibited. Check
whether the use of silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC
heat radiation design and heat sink installation, refer to individual technical datasheets or IC databooks.
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RESTRICTIONS ON PRODUCT USE
 Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
 This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
 Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
 PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
 Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
 Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
 The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
 ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
 Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
 Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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