TB2909FNG - TOSHIBA Semiconductor

TB2909FNG

BiCMOS Linear Integrated Circuit Silicon Monolithic

TB2909FNG

Maximum Power 3W SEPP

× 1ch Audio Power IC

1. Description

The TB2909FNG is a one-channel SEPP power for engine sound applications.

It includes a standby switch, mute function and various protection features.

2. Applications

Power IC developed for engine sounds.

P-HTSSOP16-0505-0.65-001

Weight: 0.062g (typ.)

3. Features

Built-in various mute function (low voltage, standby on/off)

Built-in standby switch (pin7)

Built-in mute functions (pin6)

Built-in various protection circuits(short to GND,short to Vcc, outpin short,thermal shut down, over-voltage,)

Built-in thermal detection (pin9)

Built-in over-voltage detection (pin10)

Built-in output short detection (pin11)

Built-on speaker open detection (pin12)

Table1 Typical Characteristics

(Note1)

Output noise voltage (V

NO

)

DIN_AUDIO, Rg = 620

Ω

Typ.

Output power(P

OUT MAX

Vcc=16V MaxPower

MaxPower

THD=10%

Condition

Total harmonic distortion(THD)

P

OUT

=0.125W (Vout=1Vrms)

5

3

2

Operating Supply voltage range(V

CC

RL=8

0.08

50

6 to16

Unit

W

W

W

%

µV

V

Note1: Typical test Condition : V

CC specified

= 12 V, f = 1 kHz, R

L

= 8Ω, G

V

= 20 dB, Ta = 25°C; unless otherwise

Rg: signal source resistance

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4. Block Diagram

R2

C1 R1

4

IN

8

Test

AMP

16

OUT

15

Monitor

7 Stby

V

P

Play

Mute

R3

6 Mute

14

PW-GND1

13

PW-GND2

3 Ripple

2 NC

5 Pre-GND

Speaker Open

Short

Over Voltage

Thermal

12

Diag1

11

Diag2

10

Diag3

9

Diag4

Vcc

1

+B

Note2: Some of the functional blocks, circuits or constants may be omitted from the block diagram or simplified for explanatory purposes.

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5. Pin Configuration and Function Descriptions

5.1 Pin Configuration (top view)

Vcc

NC

Ripple

IN

Pre-GND

Mute

Stby

Test

5

6

7

3

4

8

1

2

13

12

11

16

15

14

10

9

Out

Monitor

PW-GND1

PW-GND2

Diag1

Diag2

Diag3

Diag4

TB2909FNG

5.2 Pin Function Description

Pin Symbol

10

11

12

13

14

7

8

9

15

16

4

5

6

1

2

3

Vcc

NC

Ripple

IN

Pre-GND

Mute

Stby

Test

Diag4

Diag3

Diag2

Diag1

PW-GND2

PW-GND1

Monitor

OUT

I/O

OUT

OUT

OUT

OUT

IN

OUT

V

CC

-IN

IN

V

MUTE

-IN

V

ST-

IN

IN

Description

Supply voltage

Not connection

Ripple voltage

Input

Signal ground

Mute voltage input

Standby voltage input

Test

Thermal mute detection

Over-voltage detection

Output short detection

Speaker open detection

Ground for output1

Ground for output2

Monitor

Output

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6. Detailed Description

6.1 External component specification

V

P

Play

Mute

C1 R1

R3

4

IN

8

Test

7 Stby

6 Mute

3 Ripple

2 NC

5 Pre-GND

Vcc

1

Compon ent

Name

Recommended

Value

Pin Purpose

C1 4.7

μF

IN To eliminate DC

R2

AMP

Speaker Open

Short

Over Voltage

Thermal

16

OUT

15

Monitor

14

PW-GND1

13

PW-GND2

12

Diag1

11

Diag2

10

Diag3

9

Diag4

Effect (Note3)

+B

Lower than Recommended Value Higher than Recommended Value

Cut-off frequency becomes higher Cut-off frequency becomes lower

C2

C3

C4

C5

C6

1

μF

Mute To reduce pop noise

High pop noise.

Duration until mute function turned on/off is short.

4.7

μF (Note4) Ripple

1000

μF

OUT

470

μF

Vcc

Ripple filter

To eliminate DC

Ripple filter

Turn on/off time is short

Cut-off frequency becomes higher

Low pop noise.

Duration until mute function is turned on/off is long.

Turn on/off time is long

Cut-off frequency becomes lower

Power supply ripple filtering

0.1

μF

Vcc

To provide sufficient oscillation margin

Reduces noise and provides sufficient oscillation margin

C7

R1

0.22

μF

2k

Ω

OUT

To provide sufficient oscillation margin

Setting of gain

Provides sufficient oscillation margin

R2 20k

Ω

IN

IN,

OUT

Setting of gain

R3 47k

Ω

Mute To reduce pop noise

High pop noise.

Duration until mute function is turned on/off is short.

Low pop noise.

Duration until mute function is turned on/off is long.

R4 2.2

Ω

OUT

To provide sufficient oscillation margin

Provides sufficient oscillation margin

Note3: When the unrecommended value is used, please examine it enough by system evaluation.

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Note4: Please examine C3 over 4.7μF in consideration of POP sound.

6.2 Setting of Gain

This product can adjust the voltage gain of built-in amplifier with a setup of R1 and R2.

The voltage gain is determined by R1 and R2 as below expression.

It become Gv=20dB(typ.) when it is setting the R1:2kΩ and R2:20kΩ.

Gv(dB) = 20log

10

(R2 / R1)

6.3 Setting of Cut-off frequency

The lower cutoff frequency is determined by C1,R1 and C4,RL as below expression.

Lower frequency cutoff (Hz) fcl = 1 / (2πC1×R1) / fcl = 1 / (2πC4×RL)

6.4 Standby Switch(Pin7)

The power supply can be turned on or off via pin

7 (Stby). The power supply current is about

0.01μA (typ.) in the standby state.

Table 2 Pin control volgate list(V

SB

)

Power

ON

OFF

7 to Bias

Stand-by Power V

SB

(V)

ON OFF 0 to 0.8

OFF ON 2.4 to V

CC

Figure1 The Schematic of Stby

Benefit of the standby switch, Vcc can be directly turned on or off by a microcontroller.

Low-current-rated switch

From microcontroller

Standby V

CC

Battery

Standby

V

Figure 2 Standby Switch

CC

Battery

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6.5 Mute Switch(Pin6)

The mute mode in this product is a mute at standby on/off, an internal mute for low voltage. If the mute is turned off before charging R3 and C2 is finished, pop noise occurs because of input offset. Set “mute-off” with sufficient margin in considering a charge time. And this terminal is designed on the control voltage of 5 V.

For example, when the control voltage is changed from 5 V to 3.3 V, the pull-up resistor should be:

3.3 V/5 V × 47 kΩ = 31 kΩ

ATT – V

MUTE

20

0

Vp

R3

C2

6

Mute On/Off control

−20

−40

−60

−80

−100

−120

0 0.5 1 1.5 2 2.5

Pin control voltage: V

MUTE

(V)

Figure 3 Mute Function Figure4 Mute Attention

− V

MUTE

(V)

3

6.6 Speaker Open Detection(Pin12)

Speaker open detection can be detected in Diag1 for using Test terminal and monitor terminal.

At the time of startup, by setting speaker open detection mode for Test terminal applied over 2.4V, detect it by monitoring the voltage to occur on monitor terminal connected to a speaker between capacitor.( RL≧80

Ω

(typ.))

At the speaker open detection, after the Test terminal high, it takes 100ms (typ.) at time to detect Diag1.

After diagnostication,please set “Low” at Test terminal. When diagnostic at the time of the Stby-OFF, please use it in the condition of no inputting or Mute-on.

Since the current capability of the collector current of Q1 is set to about 1 mA, please use the pull-up resistor more than 4.7kΩ for Diag2 terminal by 5V at the time of a pull-up. microcomputer

IN

Test

4

8

OUT

1000

μF

16

C5

Q1

15

Monitor

V

P

12

Diag1

8

Ω

Ripple

C3

3

Bias circuit

Figure 5 Speaker open detection

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V

ST

Stby terminal

(pin7)

0

V

Rip

Ripple terminal

(pin3)

0

TB2909FNG

At normal connect

At speaker open

t t

Mute terminal

(pin6)

V

M

0

t

Test terminal

(pin8)

V

T

0

t

Monitor teminal

(pin15)

0

100ms

(typ.)

100ms

(typ.)

100ms

(typ.)

t

Diag1 terminal

(pin12)

V

P

0

Speaker open detection

Speaker open detection

Speaker open detection

(Note5)

t

Figure6 Speaker open detection sequence

Table 3 Control list

Stby

0

0

1

1

Test

0

1

0

1

Condition

Stand-by ON

Speaker open detection

Stand-by OFF

Speaker open detection(Note5)

Note5: When diagnostic at the time of the Stby-OFF, please use it in the condition of no inputting or Mute-on.

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V

P

Diag2 terminal

(pin11)

GND

6.7 Short Detection(Pin11)

In case of shorting output to Vcc/GND, NPN transistor (Q2) is turned on and can be detected in Diag2.

(Reference: Figure 7)

In case of shorting output to GND, NPN transistor (Q2) is turned on and off in response to the input signal voltage. (Reference: Figure 8)

Since the current capability of the collector current of Q2 is set to about 1 mA, please use the pull-up resistor more than 4.7kΩ for terminal by 5V at the time of a pull-up.

V

P

Diag2

11

Output short

Microcomputer protector

Q2

V

Out pin short

Normal operation

Out pin short cancel short detection

Figure 7 OUT pin short detection

t

V

P

Diag2 terminal

(pin11)

GND

V output short

Normal operation

20

μs (min)

short cancel short detection t

Figure 8 Out put to GND short detection

6.8 Overvoltage Detection(Pin10)

Microcomputer

In case of over power supplied, NPN transistor (Q3) is turned on and can be detected in Diag4.

Threshold of over voltage protection: Vcc=22V(typ.) Overvoltage detection has hysteresis.

And it will be detected off under 18V(typ.) since it has hysteresis.

The current capability of the collector current of Q3 is set to about 1 mA, please use the pull-up resistor more than 4.7kΩ for terminal by 5V at the time of a pull-up

Over voltage protector

Q3

Diag3

10

V

P

V

P

10pin voltage

V

Overvoltage

Normal operation

Overvoltage Cancel

GND

Figure 9 Overvoltage Detection

18V(min) 22V

Note6: The supply voltage (operation) of absolute maximum ratings is 16V. Please use less than 16V.

Vcc

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6.9 Thermal Detection(Pin9)

In case of rising the junction temperature over 165°C (typ.), NPN transistor (Q4) is turned on and can be detected in Diag4.

Since the current capability of the collector current of Q4 is set to about 1 mA, please use the pull-up resistor more than 4.7kΩ for Diag1 terminal by 5V at the time of a pull-up

Microcomputer

Thermal protector

Q4

9

Diag4

V

P

Normal operation

Thermal Mute Thermal shutdown

Output terminal

DC

(pin16)

Diag4 terminal

(pin9)

Thermal detection

Tj

150°C

165°C (typ.) 175°C (typ.)

Figure10 Thermal Detection

185°C (typ.)

Note7:The junction temperature of absolute maximum ratings is 150°C. Please use less than 150°C.

Note8:If it is over 185°C (typ.),Diag4 and Daig2 become “Low”.

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Mute control voltage

V

M

0

V

M

Mute terminal

(pin6)

0

V

CC

/2+1.75

Ripple terminal

(pin3)

0

V

CC

/2

Output terminal

(pin16)

0

TB2909FNG

6.10 Mute Function

The mute mode in this product is a mute at standby on/off, an internal mute for low voltage.

6.10.1 Low Voltage Mute

When the supply voltage became lower than about 5.5V, it operates the mute circuit automatically.

And when the Vcc voltage reached about 5.7V, this mute is turned off, it has the hysteresis.

6.10.2 Standby ONOFF Mute

After pin4(the standby voltage input terminal) is turned “Low”, until the ripple terminal voltage became about 1/2Vcc+1.4V. it operates the mute circuit automatically.

V

SB

Stby terminal

(pin7)

0

t

The time until sound output:

500ms(max)

Figure11 The timing chart at the time of a standup1 t t t t

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6.10.3 Mute off sequence after stby off

If the mute is turned off before charging C4 is finished, pop noise occurs. Please set “Mute-off” with sufficient margin in considering a enough charge time after the middle point potential stable.

V

SB

Stby terminal

(pin7)

0

Mute control

V

M voltage

0

V

M

Mute terminal

(pin6)

0

V

CC

/2+1.75

Ripple terminal

(pin3)

0

V

CC

/2

Output terminal

(pin16)

0

Figure12 The timing chart at the time of a standup2 t t t t t

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6.11 Protection Functions

This product has internal protection circuits such as thermal shut down, over-voltage, out to Vcc, and

Outpin short circuit protections.

(1) Thermal shut down

It operates when junction temperature exceeds 165°C. (Note9)

When it operates, it is protected in the following order.

1. An attenuation of an output starts first and the amount of attenuation also increases according to a temperature rising,

2. All outputs become in a mute state, when temperature continues rising in spite of output attenuation.

3. Shutdown function starts, when a temperature rise continues though all outputs are in a mute state.

(2) Over-voltage (Note10)

It operates when voltage exceeding operating range is supplied to Vcc pin. If voltage falls, it will return automatically. When it operates, output bias is turned off.

(3) Short to Vcc, Outpin short

It operates when each pin is irregular connection. If irregular connection is canceled, it will return automatically. When it operates, output bias is turned off.

Note9: This function does not recommend to use over the absolute maximum ratings. Applications using the device should be designed under absolute maximum ratings.

Note10: In the case of applies over the operating supply voltage range before stby off, it will be operated the protection function.

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7. Absolute Maximum Ratings

(Ta = 25°C unless otherwise specified)

Characteristics Condition Symbol Rating Unit

Supply voltage (surge)

Supply voltage (DC)

Supply voltage (operation)

Output current (peak)

Power dissipation

Operating temperature range

Storage temperature

Junction temperature

Max0.2s

(Note11)

V

CC (surge)

V

CC (DC)

V

CC (opr)

I

O (peak)

P

D

T opr

T stg

Tj

40

25

16

2.5

3.3

−40 to 110

−55 to 150

150

A

W

°C

°C

°C

V

V

V

Note11: Ta = 25°C, Package thermal resistance θ j-a

= 37.6°C /W

Note12: The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not be exceeded during operation, even for an instant. If any of these rating would be exceeded during operation, the device electrical characteristics may be irreparably altered and the reliability and lifetime of the device can no longer be guaranteed. Moreover, these operations with exceeded ratings may cause break down, damage, and/or degradation to any other equipment. Applications using the device should be designed such that each maximum rating will never be exceeded in any operating conditions.

Note13: Before using, creating, and/or producing designs, refer to and comply with the precautions and conditions set forth in this document.

7.1 Power Dissipation

P

D (max)

– Ta

Ambient Temperature Ta (°C)

・Package thermal resistance θ j-a

= 37.6°C/W

Condition board material:FR-4 (JEDCE4layer)

board area:114.3x76.2mm t=1.6mm

1-layer (surface layer) Cu-are:45x70mm Cu-surface:12% Cu-thickness:70μm

2-layer (inner layer) Cu-are:74x74mm Cu-surface:100% Cu-thickness:35μm

16-Thermal via connected to 1-layer and 2-layer.

Connect to the back of package e-pad and Cu of 1-layer by solder.

Note14: This package thermal resistance is the evaluation result at board included in chip, package and

Substrate, the power dissipation is calculated from thermal resistance. Regarning to using this product, please use the low resistance board and give a margin to the power dissipation.

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8. Operating Ranges

Characteristics

Supply voltage

Symbol Test Circuit

V

CC

R

L

=8

Ω

Min

6

Typ.

Max

16

Unit

V

9. Electrical Characteristics

Characteristics

Quiescent supply current

Output power

Total harmonic distortion

Voltage gain

Output noise voltage

Ripple rejection ration

Standby current

Standby control voltage

Mute control voltage

Test control voltage

Mute attenuation

VCC = 12 V, f = 1 kHz, RL = 8 Ω, Gv=20dB,Ta = 25°C unless otherwise specified

Symbol

Test

Circuit

Test Condition Min Typ. Max Unite

I

CCQ

P

OUT

MAX1

P

OUT

P

OUT

MAX2

VIN = 0V

― max POWER

THD = 10%

Vcc=16V,max POWER

7

3

2

5

― mA

W

Pin x1-x4 saturation voltage

THD

G

V

V

NO

R.R.

I

SB

V

SB

H

V

SB

L

V

M

H

V

M

L

V

T

H

V

T

L

ATT M

Pxx -Sat

Pout= 0.125 W(Vout=1Vrms)

Filter=400Hz-30kHz

Vout = 0.775 Vrms

Input resistance(±1%)

Rg = 0

Ω, DIN_AUDIO frip = 100 Hz, Rg = 620

Ω(Note15)

Vrip = 0.775Vrms

Standby condition

POWER: ON

POWER: OFF

MUTE: OFF

MUTE: ON

Test: ON

Test: OFF

Vout =0.775 Vrms

→ Mute: ON

DIN_AUDIO

Rpull-up = 10 k

Ω, +V

SB

= 5.0 V

When detect(pin Low)

19

2.4

0

2.4

0

2.4

0

0.08

20

50

50

0.01

85

100

21

9

Vcc

0.8

Vcc

0.8

Vcc

0.8

500

% dB

― μVrms dB

μA

V dB mV

Note15: f

RIP

: Ripple frequency

V

RIP

: Ripple signal voltage (AC fluctuations in the power supply)

Note16: V

SB

H、V

M

H、V

T

H : 16V(max)

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10. Test Circuit

R2

20kΩ

4.7

μF 2kΩ

4

IN

C1 R1

8

Test

7 Stby

V

P

Play

Mute

R3 47kΩ

6 Mute

3 Ripple

2 NC

5

Pre-GND

AMP

16

OUT

15

Monitor

Vcc

1

Speaker Open

AC short

Over Voltage

Thermal

14

PW-GND1

13

PW-GND2

12

Diag1

11

Diag2

10

Diag3

9

Diag4

+B

TB2909FNG

Components in the test circuits are only used to obtain and confirm the device characteristics.

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11. Characteristic Chart

11.1 Total Harmonic Distortion vs. Output Power

THD – P

OUT

100

VCC = 12 V

GV = 20dB

RL = 8 Ω

Filter

10

100 Hz : to 30 kHz

1 kHz : 400 Hz to 30 kHz

10 kHz : 400 Hz to

20 kHz : 400 Hz to

100

VCC = 12 V

GV = 20dB

RL = 8 Ω

Filter

400 Hz to 30kHz

THD – P

OUT

10

1

20 kHz

10 kHz

100 Hz

1

6 V 12V 16V

0.1

0.1 f = 1 kHz

0.01

0.1 1

Output power POUT (W)

10

0.01

0.1 1

Output power P

OUT

(W)

10

Figure 8 Total Harmonic Distortion of Each Frequency Figure 9 Total Harmonic Distortion by Power-supply Voltage

11.2 Various Frequency Characteristics

THD – f

3

1

RL = 8 Ω

POUT = 0.125 W

Filter nothing

0.3

0.1

0.03

0.01

12 V

0.003

0.001

0.01

8 V

16 V

0.1 1 10

Frequency f (kHz)

100

Figure 10 Frequency Characteristics of Total Harmonic Distortion

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25

20

15

10

5

0.01

G

V

– f

VCC = 12 V

RL = 8 Ω

VOUT = 0.775 Vrms

0.1 1 10

Frequency f (kHz)

100

−60

−80

−100

−120

0.01

0

VCC = 12 V

−20

RL = 8 Ω

VOUT = 0.775 Vrms

ATT

MUTE

– f

−40

0.1 1 10

Frequency f (kHz)

TB2909FNG

100

Figure 11 Frequency Characteristics of Voltage Gain and Mute Attenuation

R.R. – f

0

VCC = 12 V

RL = 8 Ω f = 1 kHz

−20

VOUT = 0.775 Vrms (0dB)

RG = 620 Ω

−40

−60

−80

−100

0.01 0.1 1 10 100

Frequency f (kHz)

Figure 12 Frequency Characteristics of Ripple Rejection Rate

11.3 Output Power Characteristics to Input Voltage

P

OUT

– V

IN

5

10 kHz f = 20 kHz

4

3

2

100 Hz

1 kHz

1

0

0 1 2 3

VCC = 12 V

RL = 8 Ω

Filter nothing

4

Input voltage V

IN (rms)

(V)

5

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11.4 Power Dissipation vs. Output Power

P

D

– P

OUT

(R

L

= 8

Ω)

2 f = 1 kHz

RL = 8 Ω

16 V

1.5

1

11.5 Other Characteristic

12 V

0.5

0

0 0.5

6.0 V

1 1.5 2 2.5

Output power P

OUT

(W)

3

I

CCQ

– V

CC

15

10

5

25

20

VIN = 0 V

RL = ∞

0

0 5 10 15 20

Supply voltage V

CC

(V)

25

18

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12. Package Dimensions

Package:P-HTSSOP16-0505-0.65-001 Unit:mm

Weight: 0.062 g (typ.)

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13. Package Dimensions

This dimension is the pattern layer “RP-2024Z” for Toshiba 1ch power IC evaluation board using

P-HTSSOP16-0505-0.65-001.

This product evaluate below board.

1-layer:(surface layer) Cu-area;57x57mm Cu-surface;about 20% Cu-thickness;35

μm

2-layer:(inner layer)Cu-area;57x57mm Cu-surface;about 80% Cu-thickness;70

μm

3-layer:(inner layer) Cu-area;57x57mm Cu-surface;about 80% Cu-thickness;70

μm

4-layer:(solder layer) Cu-area;57x57mm Cu-surface;about 20% Cu-thickness;35

μm

Component part(1-layer)

GND layer(2-layer)

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Vcc layer(3-layer)

Solder layer(4-layer)

Note17: This board can share some product, for that it does not accord the part od silk and part number.In case of make the board, please confirm the external component of evaluation product.

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14. Attention in Use

• Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.

• If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. For details on how to connect a protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition.

• Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.

• Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.

• Over current Protection Circuit

Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown.

• Thermal Shutdown Circuit

Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately.

Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.

• Heat Radiation Design

When using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components.

• Installation to Heat Sink

Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC chip. In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of

22 2014-09-09

TB2909FNG

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for

Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH

MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE

PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your

TOSHIBA sales representative.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

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• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export

Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES

OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

23 2014-09-09

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