Orion CMS390-00-0100-132

Orion CMS390-00-0100-132

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

Actual size

Features

• Small (10.4 x 6.7 x 2.7mm)

• Proven and robust silicon MEMS vibrating ring gyro

and dual-axis accelerometer

• Excellent bias over temperature (1.75˚/s, 30mg)

• Flat and orthogonal mounting options (CMS300

and CMS390)

• User selectable dynamic ranges (150˚/s, 300˚/s, 2.5g

and 10g)

• Digital (SPI

®

) output mode

• User selectable bandwidth (Rate; 45, 55, 90 or 110Hz

Acc; 45, 62, 95 or 190Hz)

• Range and bandwidth independently selectable for

each axis

• Low power consumption (8mA) from 3.3V supply

• High shock and vibration rejection

• Temperature range -40 +125˚C

• Hermetically sealed ceramic LCC surface mount

package for temperature and humidity resistance

• Integral temperature sensor

• RoHS compliant

Applications

• Measurement and control

• Navigation and personal navigation

• Inertial Measurement Units

• Inclinometers/tilt sensors

• Low cost AHRS and attitude measurement

• Levelling

• Robotics

1 General Description

Orion

TM

is a new family of integrated MEMS inertial

‘Combi-Sensors’ from Silicon Sensing, combining high performance single-axis angular rate and dual-axis linear acceleration measurement in a small surface mounted package. It comprises two discrete MEMS sensing devices with a dedicated control ASIC in a single ceramic LCC package. Sensor data is output onto a SPI

®

digital interface. Dynamic range and bandwidth of all three channels can be independently selected by the user for optimal sensitivity. Two package confi gurations are available; part numbers

CMS300 (Flat) and CMS390 (Orthogonal).

The datasheet relates to the CMS390 part. CMS390 provides the in-plane angular rate sensing (Z axis parallel to the PCBA), and two axes of linear acceleration where the X axis is parallel (in-plane) to the PCBA and the Y axis is perpendicular (out-ofplane) to the PCBA.

Angular rate is accurately measured using Silicon

Sensing’s proven 5th generation VSG5 Silicon

MEMS ring gyroscope with multiple piezoelectric actuators and transducers. The 3mm ring is driven into resonance by a pair of primary drive actuators.

Primary pick-off transducers provide closed loop control of ring amplitude and frequency. Pick-off transducers detect rate induced motion in the secondary axis, due to Coriolis force effects, the amplitude of which is proportional to angular velocity.

Precise linear acceleration sensing is achieved by a

Silicon MEMS detector forming an orthogonal pair of sprung masses. Each mass provides the moving plate of a variable capacitance formed by an array of interlaced ‘fi ngers’. This structure also provides critical damping to prevent resonant gain. Linear acceleration results in a change of capacitance which is measured by demodulation of the square wave excitation. The sensor has high linearity and shock resistance.

ASIC processing includes rate and acceleration bias, bias temperature sensitivity and scale factor sensitivity trim for all three sensors allowing sensor calibration over temperature in production.

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

CMS390-00-0100-132 Rev 6 Page 1

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

X Drive

X

Y Drive

Y

2.7 to 3.6V

Vdd

C1

10

μF

0.1

μF

Vss

Vref

XPO Demod XP/O

YPO

Demod

YP/O

C3

0.1

μF

Reset

Vref_cap

Calibration

POR

Interface Control

PPO

Amplitude

O

Driver

Z

Trim Sets

BIT

Interface

SPO

Real

QUAD

ADC

Rate O/P

Bit_Out

C.G.18434

Figure 1.1 CMS390 Functional Block Diagram

10.40

Pads for factory use only

Z

Y

+ ve ve

13 1 2 3 4 5 6

X

+ ve

All dimensions in millimetres.

14

4x (R0.20)

15 7 8 9 10 11 12

6x0.50

(0.90Px9=8.10)

6x(2.30)

16

Figure 1.2 CMS390 Overall Dimensions

2.7

C.G.18604

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

Page 2 CMS390-00-0100-132 Rev 6

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

2 Ordering Information

Part

Number

CMS300

CMS390

Sense Axes Description Measurement Range

°/s

Single-axis (Z) rate and dualaxis (X,Y) MEMS Combi-Sensor.

Z-axis perpendicular to the host PCBA.

User selectable

±150 & ±300

Single-axis (Z) rate and dualaxis (X,Y) MEMS Combi-Sensor.

Z-axis parallel to the host PCBA.

User selectable

±150 & ±300

X,Y g

User selectable

±2.5g & ±10g

User selectable

±2.5g & ±10g

Modes

Overall

Dimensions

mm

Supply

Voltage

V

Digital SPI

®

10.4x6.0x2.2H 2.7 ~ 3.6

Digital SPI

®

10.4x2.7x

6.7H

2.7 ~ 3.6

CMS300-

02-0302

Evaluation Board for the

CMS300 Combi-Sensor

(includes the sensor). See

Section 9 for more details.

User selectable

±150 & ±300

User selectable

±2.5g & ±10g

Digital SPI ®

26.0x20.0x

4.0H

2.7 ~ 3.6

CMS390-

02-0305

Evaluation Board for the

CMS390 Combi-Sensor

(includes the sensor). See

Section 9 for more details.

User selectable

±150 & ±300

User selectable

±2.5g & ±10g

Digital SPI

®

26.0x20.0x

8.5H

2.7 ~ 3.6

3 Specifi cation

Unless stated otherwise, the following specifi cation values assume Vdd = 3.15V to 3.45V and an ambient temperature of +25°C. ‘Over temperature’ refers to the temperature range -40°C to +125°C.

Minimum Typical Parameter

Rate Channel:

Dynamic Range

Resolution –

±150˚/s, ±300˚/s

0.005˚/s (±150˚/s)

0.01˚/s (±300˚/s)

Scale factor variation over, temperature, environment and life

Scale factor variation over temperature

Maximum

0.05˚/s

±2.75%

Notes

User selectable

SPI

®

scaling:

±150˚/s = 204.8 lsb/(˚/s),

±300˚/s =102.4 lsb/(˚/s)

<±1% ±2.0% –

Scale factor non-linearity error

Bias over temperature, environment and life

<±0.15°/s (±150°/s)

<±0.3°/s (±300°/s )

<±0.30°/s (±150°/s)

<±0.75°/s (±300°/s )

Deviation from best fi t straight line over operating range

±2.75˚/s –

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

CMS390-00-0100-132 Rev 6 Page 3

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

Specifi cation Continued

Parameter

Bias variation with temperature

Minimum

– Initial bias setting

Bias switch on repeatability

Bias drift with time after switch on

Bias drift with temperature ramp

Acceleration sensitivity

Noise

Frequency response

Maximum phase delay

Mechanical resonance

Acceleration Channels:

Dynamic range

40Hz

50Hz

80Hz

95Hz

– Resolution

Scale factor variation temperature environment and life

Scale factor variation over temperature

Scale factor non-linearity error

Orthogonality

Noise

Frequency response

Maximum phase delay

Mechanical resonance

40Hz

55Hz

85Hz

170Hz

Typical

±1.0°/s

±0.5°/s

±0.03°/s

±0.02°/s

±0.025°/s/g

0.06°/s

45Hz

55Hz

90Hz

110Hz

22kHz

±2.5g, ±10g

0.079mg (2.5g)

0.313mg (10g)

±1%

3mg (2.5g)

5mg (10g)

±0.1°

1mg

45Hz

62Hz

95Hz

190Hz

2.9kHz

Maximum

±1.75˚/s

±1.75°/s

±0.15°/s

±0.2°/s

±0.1°/s/g

0.1°/s

50Hz

60Hz

100Hz

125Hz

11ms (BW 45Hz)

1mg

±3%

±2.5%

12.5mg (2.5g)

50mg (10g)

2mg

50Hz

70Hz

105Hz

210Hz

10ms (BW 45Hz)

Notes

At constant temperature (25°C)

At constant ambient

temperature

At constant ambient

temperature

RMS to 45Hz

-3dB, second order user selectable

Frequency of operation

User selectable

SPI

®

scaling:

±2.5g = 12800lsb/g

±10g =3200lsb/g

50mg over range ±8g

NL error is proportional to acceleration cubed

Relative to the other acceleration sensor

RMS in 45Hz

-3dB, second order user selectable

MEMS resonance

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

Page 4 CMS390-00-0100-132 Rev 6

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

Specifi cation Continued

Parameter

Bias (±2.5g):

Minimum

Turn on bias –

Bias variation with temperature

Bias over temperature, environment and life

Bias switch on repeatability

Bias drift with time after switch on

Bias drift with temperature ramp

Bias (±10g):

Turn on bias

Bias variation with temperature

Bias over temperature, environment and life

Bias switch on repeatability

Bias drift with time after switch on

Bias drift with temperature ramp

Temperature Sensors:

Scale factor

Offset –

Repeatability

Start Up:

Time to full performance

Self Test (CBIT) Rate Sensor:

At 25°C

+54°/s (150°/s)

+90°/s (300°/s)

Variation with temperature

Typical

±0.3mg

±50mg

±0.3mg

150ms

+64°/s (150°/s)

+107°/s (300°/s)

<=±0.6°/s (±150°/s)

<=±1.2°/s (±300°/s)

Maximum

±30mg

±30mg

±75mg

±1.5mg

±10mg

±75mg

±75mg

±125mg

±2.0mg

±10mg

±3%

±20°C

±5°C

300ms

+74°/s (150°/s)

+125°/s (300°/s)

Notes

At 25 ±5˚C

(see Note 1)

-40˚C to +85˚C normalised to +25˚C

-40˚C to +85˚C normalised to +25˚C

At constant temperature

During 1 hour at constant temperature

At 25 ±5˚C

(see Note 1)

-40˚C to +85˚C normalised to +25˚C

At constant temperature

During 1 hour at constant temperature

11lsb/°C

-40˚C to +125˚C normalised to +25˚C

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

CMS390-00-0100-132 Rev 6 Page 5

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

Specifi cation Continued

Parameter Minimum

Self Test (CBIT) Acceleration Sensors:

At 25°C

+1.0g (2.5g)

+4.7g (10g)

Variation with temperature

Physical:

Mass

Rate Sensor misalignment

(Cross-axis Sensitivity)

Acceleration Sensor misalignment

(Cross-axis Sensitivity)

Environmental:

Temperature

(Operating)

-40°C

Temperature (Storage) -55°C

Humidity

Vibration rectifi cation error

Vibration induced noise

Electrical:

Supply voltage

2.7V

3.15V

Current consumption

(inrush - during start-up)

Current consumption

(operating - after start-up)

Interface:

SPI

®

message rate

SPI ® clock rate

1Hz

100kHz

Typical

+1.25g (2.5g)

+6.2g (10g)

<=±0.03g (2.5g)

<=±0.1g (10g)

0.6grams

0.001°/s/g

2 rms

0.06°/s rms

/g

2 rms

3.3V (nom)

3.3V (nom)

1kHz

1MHz

Maximum

+1.50g (2.5g)

+7.7g (10g)

±3%

±3%

+125°C

+150°C

90% RH

0.003°/s/g

2 rms

0.072°/s rms

/g

2 rms

3.6V

3.45V

8.0mA

8.0mA

10kHz

7MHz

Notes

-40˚C to +125˚C normalised to +25˚C

Alignment of sensing element to package mounting face

Alignment of sensor to package

Non-condensing

8.85g

rms

stimulus, 10Hz to 5kHz, random

8.85g

rms

stimulus, 10Hz to 5kHz, random

Full specifi cation

Excluding charging decoupling capacitors

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

Page 6 CMS390-00-0100-132 Rev 6

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

4 Absolute Minimum/Maximum Ratings

Minimum

Angular Velocity:

Powered (saturated) –

– Unpowered

Angular Acceleration:

Powered (saturated)

Linear Acceleration (any axis):

Powered

Unpowered

Operating

Electrical:

Vdd

-0.3V

ESD protection

EMC radiated

Duration of short circuit on any pin (except Vdd)

Temperature:

Operating

Max storage (survival)

Humidity

Life:

Unpowered

Powered

-40°C

-55°C

15 years

12,000 hours

Maximum

150,000°/s

150,000°/s

>10,000°/s

2

1,000g 1ms

1/2

sine

10,000g 0.5ms

95g 6ms

1/2

sine

+4.0V

2kV HBM

250V CDM

200V/m 14 kHz to 1.8GHz

100 seconds

+125°C

+150°C

90% RH non-condensing

Notes:

1. Turn on bias is specifi ed at

25 ±5˚C and at a power supply voltage of 3.3V. At other power supply voltages, a bias change of typically 40mg/V can be expected.

2. Exposure to the Absolute Maximum Ratings for extended periods may affect performance and reliability.

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

CMS390-00-0100-132 Rev 6 Page 7

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet

5 Typical Performance Characteristics

Graphs showing typical performance characteristics for Orion

TM

are shown below:

Note: Typical data is with the device powered from a 3.3V supply.

Rate Channel

www.siliconsensing.com

Figure 5.1 Bias vs Temperature

(±300°/s)

Figure 5.2 Bias vs Temperature

(±150°/s)

Figure 5.3 SF Error vs Temperature

(±300°/s)

Figure 5.4 SF Error vs Temperature

(±150°/s)

Figure 5.5 Non-linearity vs Temperature

(±300°/s)

Figure 5.6 Non-linearity vs Temperature

(±150°/s)

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

Page 8 CMS390-00-0100-132 Rev 6

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet

Typical Performance Characteristics Continued

Rate Channel

www.siliconsensing.com

Figure 5.7 Non-linearity vs Applied Rate (at 25°C)

Rate and Acceleration CBIT

Figure 5.8 Micro-linearity vs Applied Rate (at 25°C)

Figure 5.9 CBIT °/s vs Temperature

(±300°/s)

Figure 5.10 CBIT °/s vs Temperature

(±150°/s)

Figure 5.11 CBIT g vs Temperature

(±10g)

Figure 5.12 CBIT g vs Temperature

(±2.5g)

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

CMS390-00-0100-132 Rev 6 Page 9

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

Typical Performance Characteristics Continued

Acceleration Channels

Figure 5.13 Acceleration Bias at 25°C (±10g) Figure 5.14 Acceleration Bias at 25°C (±2.5g)

Figure 5.15 Accelerometer Y Bias vs Temperature

(±10g)

Figure 5.16 Accelerometer Y Bias vs Temperature

(±2.5g)

Figure 5.17 Accelerometer X Bias vs Temperature

(±10g)

Figure 5.18 Accelerometer X Bias vs Temperature

(±2.5g)

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

Page 10 CMS390-00-0100-132 Rev 6

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

Typical Performance Characteristics Continued

Acceleration Channels

Figure 5.19 Accelerometer Y SF Error vs

Temperature (±10g)

Figure 5.20 Accelerometer Y SF Error vs

Temperature (±2.5g)

Figure 5.21 Accelerometer X SF Error vs

Temperature (±10g)

Figure 5.22 Accelerometer X SF Error vs

Temperature (±2.5g)

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

CMS390-00-0100-132 Rev 6 Page 11

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

6 Glossary of Terms

NEC

PCBA

POR

PPO

SF

SMT

SOG

SPI

®

ADC

ARW

ASIC

BIT

Analogue to Digital Converter

Angular Random Walk

Application Specifi c Integrated Circuit

Built-In Test

BW

CBIT

CDM

DAC

Bandwidth

Commanded Built-In Test

Charge Device Model

Digital to Analogue Converter

DRIE Deep Reactive Ion Etch

DSBSC Double Side-Band Suppressed Carrier

Signal

EMC

ESD

HBM

IPC

Electro-Magnetic Compatibility

Electro-Static Damage

Human Body Model

Institute of Printed Circuits

LCC

LSB

Leadless Chip Carrier

Least Signifi cant Bit

MEMS Micro-Electro Mechanical Systems

SPO

Not Electrically Connected

Printed Circuit Board Assembly

Power On Reset

Primary Pick-Off

Scale Factor

Surface Mount Technology

Silicon On Glass

Serial Peripheral Interface

A registered trademark of

Motorola, Inc.

Secondary Pick-Off

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

Page 12 CMS390-00-0100-132 Rev 6

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

7 Interface

Physical and electrical inter-connect and SPI

® message information.

7.1 Physical and Electrical Interface,

Pad Layout and Pinouts

15

NEC

14

NEC

7 8

HOST SYSTEM

Vdd (3.15V to 3.45V)

9 10

CMS390

C2

100nF

11 12

NEC

16

NEC

13

C1

10

μF

NEC

16 Pad 12 11 10 9 8 7 15 Pad

NEC

NEC

13 Pad 1 2 3 4 5 6 14 Pad

NEC

4

C3

100nF

C4

100nF

10k

C.G. 18570

Figure 7.3 Peripheral Circuit

NOTE: Pins 13, 14, 15 & 16 are for mechanical fixing purposes and should be soldered to a pad with NO electrical connection

Figure 7.1 Pinout (Top View)

C.G.18572

4 - 2.6

4 - 0.35

12 - 0.6

16 12 11 10 9 8 7 15

13 1 2 3 4 5 6

0.9P x 5 = 4.5

11

14

All dimensions in millimetres.

Figure 7.2 Recommended Pad Layout

C.G. 18571

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

CMS390-00-0100-132 Rev 6 Page 13

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

Pin Number

1

4

5

2

3

6

Pin Name

Acc_Vdd_Cap

NEC

Vss_Acc

BIT_Out

Vss

Vref_Cap

7

8

9

10

11

Data_Out

Dclk

Data_In

SS

RESET

12

Centre and

Side Pads

(13,14,15 &

16)

Vdd

NEC

Signal

Direction

Output

Output

Input

Input

Input

Input

Pin Function

Used to smooth supply to ACC MEMS.

A 100nF X7R dielectric ceramic capacitor(C4) is recommended.

Not Electrically Connected.

Return connection for ACC applied power (0V)

BIT result, logical low indicates fault

Return connection for applied power (0V)

Used to decouple the internal voltage reference via an external capacitor. A

100nF X7R dielectric ceramic capacitor (C3) is recommended.

SPI

®

Data Output line from Orion

TM

. Only enabled when SS is low.

Tri-stated when SS is high.

SPI

®

Clock Output line from the Host System. Internal Pull-up

Data Input line from the Host System. Internal Pull-up

SPI_SELECT. Internal Pull-up

Used to reset the sensor, this will reload the internal calibration data. Active

Low. Internal Pull-up

Positive power supply to the sensor. Range from 2.7 to 3.6V. Should be decoupled with a 100nF X7R dielectric ceramic capacitor (C2), a bulk storage capacitor of 10μF should be nearby (C1).

Not Electrically Connected. These pins provide additional mechanical fi xing to the Host System and should be soldered to an unconnected pad.

Table 7.1 Input/Output Pin Defi nitions

Parameter

Supply

Supply voltage (functional)

Supply voltage (full specifi cation)

Supply voltage limits

Supply current

Discretes

Input voltage low

Input voltage high

Output voltage low

Output voltage high

Minimum

2.7

3.15

-0.3

Maximum

3.6

3.45

4.0

8

-0.5

0.7xVdd

0.8xVdd

0.3xVdd

Vdd+0.5

0.4

Table 7.2 Electrical Characteristics

Units

V

V

V mA

V

V

V

V

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

Page 14 CMS390-00-0100-132 Rev 6

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

7.2 SPI

®

Digital Interface

This section defi nes the SPI

®

interface timing and the message types and formats to and from the Orion

TM

CMS390 sensor. It also defi nes the memory maps of the internal functional memory.

The SPI

®

interface, when selected, will be a 4-wire interface with the following signals:

Dclk

Data_In

SPI

®

clock

Message data input to sensor (MOSI)

Data_Out Message data output by sensor (MISO)

SS Select sensor

Signal electrical characteristics are defi ned in Table 7.3.

Parameter

Input voltage low

Input voltage high

Output voltage low

Output voltage high

Output current

Leakage current

Pull up current

Minimum

-0.5

0.7xVdd

0.8xVdd

2.0

-2

10

Maximum

0.3xVdd

Vdd+0.5

0.4

2.4

2

50

Table 7.3 SPI

®

Electrical Characteristics

Units

V

V

V

V mA

μA

μA

The interface will transfer 4 bytes (32 bits) in each message. The message rate will be 1kHz (nom), (1Hz-min,

10kHz-max) with a SPI

®

clock frequency of 1MHz (nom), (100kHz-min, 7MHz-max).

The sensor will be a slave on the interface. All accesses shall use SPI

®

Mode 0.

Figure 7.4 below specifi es the interface timing for correct operation.

Inter - Message Delay

850 ns ( min )

143ns (min)

SPI

®

Clock Out

MOSI

MISO

D 31 D 0

D 31

D 0

Figure 7.4 Timing Diagram

Note: The inter-message delay varies dependent on the command message type see section 7.2.1

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

CMS390-00-0100-132 Rev 6 Page 15

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

7.2.1 Messages to Sensor (MOSI)

Table 7.4 outlines the command message types available from the host to the Orion

TM

sensor:

Message Type

Rate

Acceleration Y

Acceleration X

Temperature

Device Confi guration Status Request

Device Confi guration Set

BIT Status Request

NVM Read (including serial number)

NVM write data

NVM Write

NVM Erase

REV

INV REV

Mode

Data Monitor

Data Monitor

Data Monitor

Data Monitor

Global

Global

Global

Global

Global

Global

Global

Global

Global

Operation

Request axis rate value in next message

Request Y axis acceleration value in next message

Request X axis acceleration value in next message

Request Temperature value in next message

Request Status of device confi guration e.g. BW, Range, Sense

Direction etc in next message

This once only command will set the device confi guration e.g.

BW, Range, Sense Direction. This data will override the NVM selection and will remain set until a POR or Reset occurs.

(see section 7.2.5)

Request status of internal BIT fl ags in next message

Output NVM data in next message. For user locations no access limitations. For serial number locations only read access is allowed

Load write data into ASIC write data store (needs to be written before block write or any other write)

Load Address selected with write data from above.

Restricted access - see section 8.1 for NVM memory map

Erases Address selected.

Restricted access - see section 8.1 for NVM memory map

Device revision state

Inverse of device revision state

Table 7.4 Command Message Types

Table 7.5 details the command bit format for messages to the Orion

TM

sensor:

Operation

Rate

Acceleration Y

Acceleration X

Temperature

Device Confi guration

Status Request

Device Confi guration

Set

Data Content

D31:16

Not Used (set all to’0’)

Not Used (set all to’0’)

Not Used (set all to’0’)

Not Used (set all to’0’)

Not Used (set all to’0’)

D31:16 Data to be written

(16-bits)

Mode

D15:13

Address

D12:8

101 00000

101

101

101

00001

00010

00011

D7

Note 1

CBIT_en

CBIT_en

CBIT_en

CBIT_en

D6 D5 D4

0

0

0

0

0

0

0

0

0

0

0

0

CRC D3:0

Note 2

CRC

Inter

Message

Delay

5.0μs(min)

CRC

CRC

CRC

Notes

-

5.0μs(min)

5.0μs(min)

Refer to Fig 1.2 for axis and sense defi nition

Refer to Fig 1.2 for axis and sense defi nition

5.0μs(min) -

000 00000 CBIT_en 0 0 0 CRC

000 00010 CBIT_en 0 0 0 CRC

5.0μs(min) -

6.5μs(min)

See Section 8 for operation

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

Page 16 CMS390-00-0100-132 Rev 6

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

Operation

BIT Status Request

NVM Read

NVM Write Data

NVM Write

NVM Erase

REV

INV REV

Data Content

D31:16

Not Used (set all to’0’)

D31:21 Not Used (set all to’0’)

D20:16 NVM address

D31:16 Data to be written

(16-bits)

D31:21 Not Used (set all to’0’)

D20:16 NVM address

Mode

D15:13

000

000

000

000

Address

D12:8

00011

00100

00101

00110

D31:21 Not Used (set all to’0’)

D20:16 NVM address

D31:16 = 0xFFFF

D31:16 = 0x0000

000

000

000

00111

10000

00001

D7

Note 1

CBIT_en

CBIT_en

CBIT_en

CBIT_en

CBIT_en

1

0

D6 D5 D4

0

0

0

0

0

1

0

0

0

0

0

1

0

0

0

0

0

0

CRC D3:0

Note 2

CRC

Inter

Message

Delay

5.0μs(min)

CRC

CRC

CRC

CRC

CRC

Notes

9.5μs(min)

5.0μs(min)

6.1ms(min)

6.1ms(min)

5.0μs(min)

-

See Section 8 for NVM memory map and access

Stored data for write ops

See Section 8 for NVM memory map and access

See Section 8 for NVM memory map and access

-

0 0 1 CRC 5.0μs(min) -

Table 7.5 Command Message Format

NOTE 1: CBIT_en: 0 = inactive, 1= active. See section 7.2.6 for CBIT behaviour.

NOTE 2: In all messages to and from the sensor a 4-bit CRC (data bits D3:0) shall be added. The CRC polynomial

used shall be x

4

+1. A seed value of “1010” shall be used with a calculation order MSB to LSB. The CRC

shall be checked for all I/P messages. If the CRC fails then the message shall be ignored and a SPI

®

error

message output in the next message.

7.2.2 Messages from Sensor (MISO)

Table 7.6 outlines the status message types available from the Orion

TM

sensor to the host:

Message Type

Rate

Acceleration Y

Acceleration X

Temperature

Confi guration Status

BIT Status

NVM Read (including serial number)

REV

INV REV

NVM ECC Error

SPI ® Error

Invalid Command

Mode

Data Monitor

Data Monitor

Data Monitor

Data Monitor

Global

Global

Global

Global

Global

Global

Global

Global

Operation

Rate value (16-bit 2’s compliment)

Axis Y acceleration value (16-bit 2’s compliment)

Axis X acceleration value (16-bit 2’s compliment)

Temperature value (16-bit)

Request Status of device confi guration e.g. BW, Range,

Sense Direction etc

Status of internal BIT fl ags

Read of requested NVM location (16-bit data)

See Section 8 for memory map

Revision status

Inverse revision status

NVM Parity error detected

SPI ® clock error detected

SPI

®

request invalid

Table 7.6 Status Message Types

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

CMS390-00-0100-132 Rev 6 Page 17

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

Table 7.7 details the bit format for messages from the Orion

TM

sensor:

Message Type

Note 5, 6 & 7

Rate

Acceleration Y

Acceleration X

Temperature

Confi guration

Status

BIT Status

NVM Normal

Read

NVM ECC Error

SPI

®

Error

D31:16

Data Content

Rate Data

16-bit 2’s compl iment

Acceleration Y Data

16-bit 2’s compl iment

Acceleration X Data

16-bit 2’s compl iment

Temperature 1 Data

16-bit

Confi guration Data

16-bit

D15:13

Mode

Note 2

D12:8

Address

101 00000

101

101

101

000

00001

00010

00011

00000

BIT Flag Status 16-bit

16-bit NVM Location

Data

D31:16 = 0x0000

000

000

000

00010

00011

01000

D7

CBIT

Note 1

CBIT

CBIT

CBIT

CBIT

CBIT

D6

Note 3

D5 D4

0

ACC Bit

ACC Bit

0

KACT

Note 4

KACT

Note 4

KACT

Note 4

KACT

Note 4

0 0 0

CBIT

CBIT

0

0

0

0

0

0

0

0

0

0

D31:16 = 0x0000 000 01001 CBIT 0 0 0

D3:0

CRC

Note 8

CRC

CRC

CRC

CRC

CRC

CRC

CRC

CRC

CRC

CRC

CRC

CRC

Comments

Scale Factor: see Note 9

Scale Factor: see Note 10

Scale Factor: see Note 10

Scale Factor and Offset:

see Note 11

See Section 7.2.5 for format

See Section 7.2.3 for format

See Section 8 for memory map of NVM

Sent if NVM error detected

Sent if Wrong No clocks or

CRC failed for I/P message

Note 7

Sent if an invalid command was received (inc illegal NVM command Note 7

See Section 7.2.4 for format

See Section 7.2.4 for format

Invalid SPI

®

Command

REV

INV REV

D31:16 = 0x0000

16-bit data

16-bit data

000 01010 CBIT 0 0 0

000 10000 1 1 1 0

000 00001 0 0 0

Table 7.7 Status Message Format

1

NOTE 1: CBIT = 1 if CBIT is Active, 0 if CBIT is inactive. See section 7.2.6 for CBIT behaviour.

NOTE 2: If D15:14 = “01” then a fault condition has been detected.

NOTE 3: Acc Bit will be set to fail (1) if a fault with the accelerometer channels is detected. If it indicates a

pass (0) then the acc channels are still operational even if bits D15:14 indicate a fault.

NOTE 4: KACT = Keep alive count; a 2 bit count that increments every data monitor message and rolls over at “11”.

NOTE 5: On POR or from Reset the fi rst message type from the sensor shall be the confi guration status, for any

command message.

NOTE 6: On receipt of one of the following command message types in SPI ®

next SPI

®

exchange (N+1) will be that output in SPI exchange (N-1).

exchange (N) the response sent in the

NVM Write Data

NVM Write

NVM Erase

NOTE 7: If an invalid command message or a SPI

®

error message is sent by the ASIC then this message will be

held until a valid status message request has been requested i.e. a message listed in section 7.2.2.

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

Page 18 CMS390-00-0100-132 Rev 6

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

NOTE 8: In all messages to and from the ASIC a 4-bit CRC (data bits D3:0) shall be added. The CRC polynomial

used shall be x

4

+1. A seed value of “1010” shall be used with a calculation order MSB to LSB. The CRC

shall be checked for all I/P messages. If the CRC fails then the message shall be ignored and a SPI

®

error

message output in the next message.

NOTE 9: The rate data shall be a 16 bit 2’s complement number, where a rate O/P of 0000h = 0°/s. Scale factor

204.8 lsb/(°/s) – Low Range, 102.4 lsb/(°/s) – High Range.

NOTE 10: The acceleration data shall be a 16 bit 2’s complement number, where acc output of 0000h = 0g.

Scale factor 12800 lsb/g (low range), 3200 lsb/g (high range).

NOTE 11: The temperature data shall be a 16 bit number, as follows -40°C = 06A4h (1700

10

), 0°C = 0852h (2130

10

),

+25°C = 0960h (2400

10

). Scale factor 0.091°C/lsb (or 10.99 lsb/°C).

7.2.3 BIT Flag Format

The BIT status message data word is enclosed as defi ned in table 7.8.

BIT No.

D31

D24

D23

D22

D21

D30

D29

D28

D27

D26

D25

D20

D19

D18

D17

BIT Flag

Trim Data Store Data

AGC Level BIT

QUAD Level BIT

DAC BIT

QUAD Channel BIT

RATE Channel BIT

AGC Low BIT

AGC High BIT

NONINT (sine drive switch)

ACC Y Channel BIT

ACC X Channel BIT

Vref Cap Check

ACC Vdd Filter Cap BIT

Trim Check NVM Read Error

MEMS Ref Bit

Operation

0 = OK 1 = FAIL

0 = OK 1 = FAIL

0 = OK 1 = FAIL

0 = OK 1 = FAIL

0 = OK 1 = FAIL

0 = OK 1 = FAIL

0 = OK 1 = FAIL

0 = OK 1 = FAIL

0 = OK 1 = FAIL

0 = OK 1 = FAIL

0 = OK 1 = FAIL

0 = OK 1 = FAIL

0 = OK 1 = FAIL

0 = OK 1 = FAIL

0 = OK 1 = FAIL

Table 7.8 BIT Status Format

7.2.4 REV and INREV Format

The REV and INV REV messages can be decoded as follows:

The Device ID and revision numbers will be stored in the NVM.

REV contains devices ID and revision. The message is encoded as defi ned in table 7-9.

BIT No.

D31:25

D24:22

D21

D20:16

D15:4

D3:0

REV

“1111111”

Device ID (2:0)

“1”

Device Revision (4:0)

“000100001110”

CRC

Table 7.9 REV Message Format

INV REV contains devices ID and revision.

The message is encoded as defi ned in table 7-10.

BIT No.

D31:25

D24:22

D21

D20:16

D15:4

D3:0

INV REV

“0000000”

Inverse of Device ID (2:0)

“0”

Inverse of Device Revision (4:0)

“000000010001”

CRC

Table 7.10 INV REV Message Format

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

CMS390-00-0100-132 Rev 6 Page 19

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

7.2.5 Device Confi guration

The default device confi guration is stored in location

00 of the NVM (see section 8.2). To change the default device configuration see section 8.3.

This data is loaded on power-up or reset. This data can be over-ridden by a SPI

®

Device Confi guration

Set message with the following data format. A SPI

® confi guration selection is latched and cannot be overwritten by any further Device Confi guration messages. A power or reset cycle will be required to clear the SPI

®

selection and reload the default NVM selection.

A device confi guration status request will output the confi guration currently in use within the device. The status format is defi ned in table 7-11.

BIT No.

D31:28

D27:26

D25:24

D23:22

D21

D20

D19

D18

D17

D16

Parameter

Spare

Gyro Bandwidth

ACC Y Bandwidth

ACC X Bandwidth

Gyro Rate Range

(rate_range(0))

ACC Y Range

ACC X Range

ACC Y Sense Direction

(see note 1)

ACC X Sense Direction

(see note 1)

Gyro Sense Direction

(see note 1)

Decode

Set to “0000”

“11” = 45Hz

“10” = 55Hz

“01” = 90Hz

“00” = 110Hz

“11” = 45Hz

“10” = 62Hz

“01” = 95Hz

“00” = 190Hz

“11” = 45Hz

“10” = 62Hz

“01” = 95Hz

“00” = 190Hz

“1” = 150°/s

“0” = 300°/s

“1” = 2.5g

“0” = 10g

“1” = 2.5g

“0” = 10g

“0” = Pos

“1” = Neg

“0” = Pos

“1” = Neg

“0” = + ve

Rate is CW

“1” = + ve

Rate is ACW

Note 1: See fi gure 1.2 for defi nition of positive sense direction.

Table 7.11 Confi guration Status Message

Format

7.2.6 CBIT

A CBIT function can be used to check the operation of the internal control loops.

When enabled, via a SPI

®

message CBIT will add a fi xed offset to the Rate and both Acceleration outputs,

BIT_Out will be set to the fault condition and the sensor message will show a fault. The offset applied depends on the range selected. See page 5 and 6 for details.

8 NVM Memory

The NVM will be an EEPROM block with 32 locations of 16 bit data plus 6 bit ECC parity. The ECC parity bits will be able to correct single bit errors. The

EEPROM block will generate two error bits; one if a single bit error is detected the other if multiple error bits are detected.

The memory will be split into two areas of 13 and 19 locations of 16 bit words.

The fi rst area (address 00 to 0C) allows unlimited read, write or erase access by the User. The fi rst location (address 00) is used to confi gure the device

(e.g. Bandwidth, Range selection – see section 8.2).

The remaining locations have no limitations on data content.

The second area (address 0D to 1F) is used to store calibration, setup and serial number data. The

User will only be allowed read access of the serial number data (locations 0D to 10). Access to all other locations in this area are not allowed.

Section 8.3 details the sequence of messages required for each operation.

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

Page 20 CMS390-00-0100-132 Rev 6

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

8.1 NVM Memory Map

Table 8.1 details the content and accesses allowed for each location in the NVM.

1B

1C

1D

1E

18

19

1A

1F

14

15

16

17

10

11

12

13

0C

0D

0E

0F

08

09

0A

0B

04

05

06

07

01

02

03

Access

Confi guration

Address

(hex)

00

Access Modes

(see note)

R,W,E

User Data

Calibration

Data

Content

16 bits Confi guration, see section 8.2

User Location 16-bit data

User Location 16-bit data

User Location 16-bit data

User Location 16-bit data

User Location 16-bit data

User Location 16-bit data

SSSL Use Only

SSSL Use Only

SSSL Use Only

SSSL Use Only

SSSL Use Only

SSSL Use Only

Bits 15:0 Serial Number 1

Bits 15:0 Serial Number 2

Bits 15:0 Serial Number 3

Bits 15:0 Serial Number 4

SSSL Use Only

SSSL Use Only

SSSL Use Only

SSSL Use Only

SSSL Use Only

SSSL Use Only

SSSL Use Only

SSSL Use Only

SSSL Use Only

SSSL Use Only

SSSL Use Only

SSSL Use Only

SSSL Use Only

SSSL Use Only

SSSL Use Only

-

-

-

-

-

-

-

-

-

-

-

-

-

-

R

-

R,W,E

R,W,E

R,W,E

R,W,E

R,W,E

R

R

R

R,W,E

R,W,E

R,W,E

R,W,E

R,W,E

R,W,E

R,W,E

Note: Access codes: R, W, E - Unlimited Read, Write or Erase.

Table 8.1 NVM Memory Map

8.2 Confi guration Word Format

The device confi guration data stored in location

00(hex) of the NVM shall have the format defi ned in table 8.2. Factory default settings 0FF8 (h).

BIT No.

Bits 15:12

Parameter

Spare

Bits 11:10

Bits 9:8

Bits 7:6

Bit 5

Bit 4

Bit 3

Bit 2

Bit 1

Gyro Bandwidth

ACC Y Bandwidth

ACC X Bandwidth

Gyro Rate Range

ACC Y Range

ACC X Range

ACC Y Sense Direction

(see note 1)

ACC X Sense Direction

(see note 1)

Decode

Set to “0000”

“11” = 45Hz

“10” = 55Hz

“01” = 90Hz

“00” = 110Hz

“11” = 45Hz

“10” = 62Hz

“01” = 95Hz

“00” = 190Hz

“11” = 45Hz

“10” = 62Hz

“01” = 95Hz

“00” = 190Hz

“1” = 150°/s

“0” = 300°/s

“1” = 2.5g

“0” = 10g

“1” = 2.5g

“0” = 10g

“0” = Pos

“1” = Neg

“0” = Pos

“1” = Neg

Bit 0

Gyro Sense Direction

(see note 1)

“0” = + ve

Rate is CW

“1” = + ve

Rate is ACW

Note 1: See fi gure 1.2 for defi nition of positive sense direction.

Table 8.2 Confi guration Format in NVM

8.3 NVM Operations

This section defi nes the steps required for NVM access operations.

Read from User NVM location:

Reads from the user area of the NVM or the serial number locations.

1. NVM Read SPI

®

message requesting data from

NVM address specifi ed in message.

Write to User NVM location:

The for correct storage of required data the location must be erased before writing new data.

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

CMS390-00-0100-132 Rev 6 Page 21

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

1. NVM Write Data message containing the 16-bit

data to be written.

2. NVM Write command containing the 5 bit NVM

address to be written to.

Erase of User NVM location:

1. NVM Erase message containing the 5 bit NVM

address to be erased.

9 Design Tools and Resources Available

Item Description of Resource Part Number

Orion TM

Brochure: A one page sales brochure describing the key features of the Orion

TM

Combi ensor.

CMS300-00-0100-131

Orion

TM

CMS300 Datasheet: Full technical information on all

Orion

TM

Combi Sensor part number options. Specifi cation and other essential information for assembling and interfacing to

Orion

TM

Combi Sensors, and getting the most out of them.

Orion

TM

CMS390 Datasheet: Full technical information on all

Orion

TM

Combi Sensor part number options. Specifi cation and other essential information for assembling and interfacing to

Orion

TM

Combi Sensors, and getting the most out of them.

Orion

TM

Presentation: A useful presentation describing the features, construction, principles of operation and applications for the Orion

TM

Combi Sensor.

CMS300-00-0100-132

CMS390-00-0100-132

Order/Download

Download

(www.siliconsensing.com)

Download

(www.siliconsensing.com)

Download

(www.siliconsensing.com)

Download

(www.siliconsensing.com)

Order

Orion

TM

evaluation boards (CMS300 & CMS390 options):

Single Orion TM fi tted to a small PCBA for easy customer evaluation and test purposes. Supplied with connector and fl ying lead.

CMS300-02-0302

CMS390-02-0305 Order

Solid Model CAD fi les for Orion TM

Available in .STP and .IGS fi le format

Combi Sensors:

Library Parts:

Useful library component fi les of Orion

TM

Combi Sensors:

DxDesigner Schematic Symbols.

PADS Decal (Footprint)

PADS Part Type File.

Reference Circuit: A useful reference circuit design gerber fi les for the Orion

TM

Combi Sensor for use in host systems.

CMS300-00-0100-408

CMS390-00-0100-408

Download

(www.siliconsensing.com)

Download

(www.siliconsensing.com)

Download

(www.siliconsensing.com)

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

Page 22 CMS390-00-0100-132 Rev 6

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

Design Tools and Resources Available Continued

Item Description of Resource

Interface: Off-the-peg pseudo code and a simple fl owchart with message handling instructions for use as a customer aid to developing their own interface directly to a Orion

TM

Combi

Sensor via the SPI

®

.

Questions and Answers: Some useful questions asked by customers and how we’ve answered them. This is an informal (uncontrolled) document intended purely as additional information.

Part Number

RoHS compliance statement for Orion TM

: Orion TM

is fully compliant with RoHS. For details of the materials used in the manufacture please refer to the MDS Report.

Order/Download

Download

(www.siliconsensing.com)

Download

(www.siliconsensing.com)

Download

(www.siliconsensing.com)

MDS Reports for Orion

TM

for automotive applications.

: Material declaration required

Download

(www.siliconsensing.com)

10 Cleaning

Due to the natural resonant frequency and amplifi cation factor (‘Q’) of the sensor, ultrasonic cleaning should NOT be used to clean the Orion

TM

Combi Sensor.

11 Soldering Information

Temp (°C)

260°C

255°C

Max 180sec

Max 40sec

217°C

200°C

150°C

Max 120sec

Time (sec)

C.G. 18384

Figure 11.1 Recommended Refl ow

Solder Profi le

12 Part Markings

Silicon Sensing

Company Logo

Part Number

2D Data Matrix Code

Containing the

Production Number

Assembly Lot

(See Table 12.2)

CMS390

PPYYMMLLLLRDD

Made In J apan

YYMMLLLL_XXXX

Indicates Location of Pin 1

Production Number

(See Table 12.1)

Country of Origin of Final

Assembly and Test

Figure 12.1 Part Marking

Item

Year number

Month number

Lot number

(Space)

Serial number

Code

YY

MM

LLLL

XXXX

Range

00 - 99

01-12

0000 -9999

0001 - 9999

Table 12.1 Production Number Code

C.G. 18595

Item

Confi guration

Year number

Month number

Lot number

Measurement times

Serial split

Code

PP

YY

MM

LLLL

R

DD

Range

11 - 99

00-99

01-12

0000 -9999

0-2

00,01,--

Table 12.2 Assembly Lot Code

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

CMS390-00-0100-132 Rev 6 Page 23

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

13 Packaging Information Reel Information

110

Frame for label

3

B

3 B

Layer

CMS390

Inner Bag

Inner Box

Outer Box

Type

Tape and Reel

Aluminium

Damp-proof Bag

Cardboard Box

Cardboard Box

Quantity

Max. 600 pcs/

1 Reel

1 Reel/Bag

Inner Bag x 1/Inner

Box

Inner Box/Outer

Box

Table 13.1 Packaging Information

10

270

W1±1.0

B

3±0.5

30

172

2±0.5

21±0.8

Centre Shape

13±0.2

R1

EIAJ.RRM.24.D

Reel width

Reel width mm

W1

W2

8

9.5

13.5

12

13.5

17.5

16

17.5

21.5

24

25.5

29.5

32

33.5

37.5

44

45.5

49.5

W2±1.0

5±0.5

9±0.5

7±0.5

Centre details

C.G. 18547

3±0.5

5±0.5

Emboss Tape Carrier Information

12±0.1

1.5 ±0.1 Hole

B

4±0.1

2±0.1

(Tolerance between each hole is ±0.2)

0.4±0.05

Item

Reel

Emboss

Tape

Cover Tape

Label for

Reel

Desiccant

Inner Bag

Tray

Pad

Inner Box

Outer Box

Label for

Outer Box

Dimension Quantity Material

DR2 23316C

TE1612-

091009-2

ALS-ATA

13.5mm x

480m

40mm x

80mm

FA 10g

0.101mm x 450mm x

530mm

451mm x

429mm x

55mm

451mm x

429mm x

20mm

413mm x

391mm x

52mm

462mm x

440mm x

208mm

102mm x

127mm

1 Reel

1 Roll

1 Roll

1 label/Reel

1 Inner Bag

1 Reel/Inner

Bag

2 Tray/Outer

Box

3 Pad/Outer

Box

2 Inner Box/

Outer Box

1 Box

1 label/Outer

Box

PS

PS

PET, PE, PS

Paper

MB4800

Cardboard

Cardboard

Paper

Table 13.2 Packaging Specifi cation

A

3.2±0.1

A A VIEW

Tape Information

400mm ~ 700mm

Empty

B

6.4±0.3

A

Sensor packing 400mm

Empty

B B VIEW

C.G.18597

Drawing direction

2000mm

Cover tape

Reel label position

C.G. 18409

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

Page 24 CMS390-00-0100-132 Rev 6

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

Outer Box Packing Information Label for Reel Information

Part Number

CMS390

Number

No. S3011002001

C.G. 18596

Pad

Inner Bag Packing Information

Desiccant

Inner Bag

Inner Box

Tray

Pad

Inner Box

Tray

Pad

Box

Reel

Craft Tape

C.G. 18392

Inner Box Packing Information

1

2

Maximum of two Reels per Outer Box.

If 1 Reel is contained in Outer Box, label is pasted in position 1.

If 2 Reels are contained in Outer Box, labels are pasted in positions 1 and 2.

Each label shows packaged reel information.

C.G. 18390

Inner Bag

Inner Box

C.G. 18389

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

CMS390-00-0100-132 Rev 6 Page 25

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

14 Internal Construction and Theory of Operation

Construction

Orion™ is available in two basic package confi gurations:

Part Number CMS300 (fl at): Relative to the plane of the host PCBA, this part measures angular velocity about a single perpendicular axis (Z) and linear acceleration about two parallel axes (X,Y).

Part Number CMS390 (orthogonal): Relative to the plane of the host PCBA, this part measures angular velocity about a single parallel axis (Z) and linear acceleration about one parallel axis (X) and one perpendicular axis (Y).

Orion™ (CMS300 and CMS390) is supplied as a PCBA surface mountable LCC ceramic packaged device.

It comprises six main components; Silicon MEMS

Single-Axis Angular Rate Sensor, Silicon On Glass

(SOG) Dual-Axis MEMS Accelerometer, Silicon

Pedestal, ASIC and the Package Base and Lid.

The MEMS Sensors, ASIC and Pedestal are housed in a hermetically sealed package cavity with a nitrogen back-fi lled partial vacuum, this has particular advantages over sensors supplied in plastic packages which have Moisture Sensitivity Level limitations.

A exploded drawing of CMS300 showing the main components is given in Figure 14.1 below. The principles of construction for CMS390 are the same as CMS300.

Seal Ring

Vacuum Cavity

Bond Wires

CMS300

PPYYMMLLLLRDD

Made In J apan

YYMMLLLL_XXXX

MEMS Ring

Pedestal

Dual-Axis Accelerometer

ASIC

Lid

Package Base

C.G. 18542

Figure 14.1 CMS300 Main Components

Figure 13.2 CMS300 (Lid Removed)

Silicon MEMS Ring Sensor (Gyro)

The 3mm diameter by 65μm thick silicon MEMS ring is fabricated by Silicon Sensing using a DRIE (Deep

Reactive Ion Etch) bulk silicon process. The annular ring is supported in free-space by eight pairs of

‘dog-leg’ shaped symmetrical spokes which radiate from a central 1mm diameter solid hub.

The bulk silicon etch process and unique patented ring design enable close tolerance geometrical properties for precise balance and thermal stability and, unlike other MEMS gyros, there are no small gaps to create problems of interference and stiction.

These features contribute signifi cantly to Orion

TM

’s bias and scale factor stability over temperature, and vibration and shock immunity. Another advantage of the design is its inherent immunity to acceleration induced rate error, or ‘g-sensitivity’.

Piezoelectric (strain) fi lm actuators/transducers are attached to the upper surface of the silicon ring perimeter and are electrically connected to bond pads on the ring hub via tracks on the spokes.

These actuate or ‘drive’ the ring into its Cos2  mode of vibration at a frequency of 22kHz or detect radial motion of the ring perimeter either caused by the primary drive actuator or by the coriolis force effect when the gyro is rotating about its sensing axis. There is a single pair of primary drive actuators and a single pair of primary pick-off transducers, and two pairs of secondary pick-off transducers.

The combination of transducer technology and eight secondary pick-off transducers improves Orion

TM

’s signal-to-noise ratio, the benefi t of which is a very low-noise device with excellent bias over temperature performance.

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

Page 26 CMS390-00-0100-132 Rev 6

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

Silicon MEMS Dual-Axis Accelerometer

The Orion

TM

dual-axis open loop accelerometer is a one-piece resonating silicon MEMS structure anodically bonded to top and bottom glass substrates to form a hermetically sealed Silicon on Glass (SOG) wafer sub-assembly. The same DRIE bulk silicon process as used to create the gyro in Orion

TM

is used to create two orthogonal fi nger-like spring/seismic proof mass structures, each measuring 1.8mm square, and with a resonant frequency of 2.9kHz.

Figure 14.4 shows a schematic cross section through the SOG wafer.

Capacitive drive and pick-off signals are transmitted by wire bond interconnections, in through-glass vias, between the metallised transducer plates on the

MEMS proof mass and the Orion

TM

ASIC.

Multiple inter-digitated fi ngers create increased capacitance thus enabling a high signal-to-noise ratio. The fi ngers are tapered to increase the resonant frequency and also have a high aspect ratio to provide highly stable performance. The differential gaps between the static electrode fi ngers and those of the proof mass provide an air squeeze fi lm with nearcritical damping.

Control of the accelerometer is handled by the Orion

TM

ASIC.

Support flexure Through-glass via

ASIC

The ASIC is a 5.52mm x 3.33mm device fabricated using 0.35μm CMOS process. ASIC and MEMS are physically separate and are connected electrically by using gold bond wires and thus the ASIC has no MEMS-to-ASIC internal tracking, meaning there is reduced noise pick-up and excellent EMC performance. Gold bond wires also connect the ASIC to the internal bond pads on the Package Base.

Package Base and Lid

The LCC ceramic Package Base is a multi-layer aluminium oxide construction with internal bond wire pads connected through the Package Base via integral multi-level tungsten interconnects to a series of external solder pads. Similar integral interconnects in the ceramic layers connect the Lid to Vss, thus the sensitive elements are inside a Faraday shield for excellent EMC. Internal and external pads are electroplated gold on electroplated nickel.

The Package Base incorporates a seal ring on the upper layer onto which a Kovar

®

metal Lid is seam welded using a rolling resistance electrode, thus creating a totally hermetic seal. Unlike other MEMS gyro packages available on the market, Orion

TM has a specially developed seam weld process which eliminates the potential for internal weld spatter.

Inferior designs can cause dislodged weld spatter which affects gyro reliability due to interference with the vibratory MEMS element, especially where the

MEMS structure has small gaps, unlike Orion

TM with its large gaps as described above.

Glass Substrates Seismic proof mass Cavity Silicon

C.G. 18538

Figure 14.4 Schematic Section of the Silicon

On Glass Accelerometer MEMS Wafer

Sub-Assembly

Pedestal

The hub of the MEMS ring is supported above the

ASIC on a 1mm diameter cylindrical silicon pedestal, which is bonded to the ring and ASIC using an epoxy resin.

Theory of Operation (Gyro)

Orion

TM

rate sensor is a solid-state device and thus has no moving parts other than the defl ection of the ring itself. It detects the magnitude and direction of angular velocity by using the ‘coriolis force’ effect.

As the gyro is rotated coriolis forces acting on the silicon ring cause radial movement at the ring perimeter.

There are eight actuators/transducers distributed evenly around the perimeter of the silicon MEMS ring.

Located about its primary axes (0° and 90°) are a single pair of ‘primary drive’ actuators and a single pair of ‘primary pick-off’ transducers. Located about its secondary axes (45° and 135°) are two pairs of

‘secondary pick-off’ transducers.

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

CMS390-00-0100-132 Rev 6 Page 27

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

The ‘primary drive’ actuators and ‘primary pick-off’ transducers act together in a closed-loop system to excite and control the ring primary operating vibration amplitude and frequency (22kHz). Secondary ‘pick-off’ transducers detect radial movement at the secondary axes, the magnitude of which is proportional to the angular speed of rotation and from which the gyro derives angular rate. The transducers produce a double sideband, suppressed carrier signal, which is demodulated back to a baseband. This gives the user complete fl exibility over in system performance, and makes the transduction completely independent of DC or low frequency parametric conditions of the electronics.

Referring to Figures 14.3(a) to 14.3(d)

Figure 14.3(a) shows the structure of the silicon MEMS ring. Figure 14.3(b) shows the ring diagrammatically, the spokes, actuators and transducers removed for clarity, indicating the Primary Drive actuators (single pair), Primary Pick-Off transducers (single pair) and

Secondary Pick-Off transducers (two pairs).

In Figure 14.3(b) the annular ring is circular and is representative of the gyro when unpowered.

When powered-up the ring is excited along its primary axes using the Primary Drive actuators and Primary

Pick-Off transducers acting in a closed-loop control system within the ASIC. The circular ring is deformed into a ‘Cos2θ’ mode which is elliptical in form and has a natural frequency of 22kHz. This is depicted in

Figure 14.3(c). In Figure 14.3(c) the gyro is powered-up but still not rotating. At the four Secondary Pick-Off nodes located at 45° to the primary axes on the ring perimeter there is effectively no radial motion.

If the gyro is now subjected to applied angular rate, as indicated in Figure 14.3(d), then this causes the ring to be subjected to coriolis forces acting at a tangent to the ring perimeter on the primary axes. These forces in turn deform the ring causing radial motion at the Secondary Pick-Off transducers. It is the motion detected at the Secondary Pick-off transducers which is proportional to the applied angular rate.

The DSBSC signal is demodulated with respect to the primary motion, which results in a low frequency component which is proportional to angular rate.

All of the gyro control circuitry is hosted in the ASIC.

A block diagram of the ASIC functions is given in

Figure 1.1 in Section 1.

PPO+

SPO-

PD+

SPO+

SPO-

SPO+

PD-

SPO+

SPO-

SPO-

PPO+

Figure 14.3(a)

PD-

SPO+

PD+

C.G 18398

PD

SPO

PPO

SPO SPO

PPO

Figure 14.3(b)

ν

C.G 18399

Zero Radial

Motion

SPO

ν

Cos2

θ

Vibration

Mode at

22kHz

ν

ν

Figure 14.3(c)

SPO

PD

C.G 18400

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

Page 28 CMS390-00-0100-132 Rev 6

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

ν

F c

Resultant

Radial Motion

F c = Coriolis Force

ν

Applied Rate

ν

F c

F c

ν

Figure 14.3(d)

C.G 18400

Theory of Operation (Accelerometer)

The accelerometer contains a seismic ‘proof mass’ with multiple fi ngers suspended via a ‘spring’, all of which is formed in the silicon MEMS structure.

The proof mass is anodically bonded to the top and bottom glass substrates and thereby fi xed to the

Orion

TM

Package Base.

When the Orion

TM

sensor is subjected to a linear acceleration along its sensitive axis the proof mass tends to resist motion due to its own inertia, therefore the mass and it’s fi ngers becomes displaced with respect to the interdigitated fi xed electrode fi ngers. Air between the fi ngers provides a damping effect. This displacement induces a differential capacitance between the moving and fi xed silicon fi ngers which is proportional to the applied acceleration.

Capacitor plate groups are electrically connected in pairs at the top and bottom of the proof mass.

In-phase and anti-phase waveforms are applied by the Orion

TM

ASIC separately to the ‘left’ and ‘right’ fi nger groups. The demodulated waveforms provide a signal output proportional to linear acceleration.

Figures 14.5(a) and 14.5(b) provide schematics of the accelerometer structure and control loop respectively.

Fixed Electrode 1

Sensing axis

Fixed support

Fixed Electrode 2

Proof mass

(includes fingers)

C.G. 18613

Figure 14.5(a) Schematic of Accelerometer

Structure

Electrode 2

22kHz reference

Signal proportional to movement of proof mass

Out of Phase Square Wave at 88kHz on Electrode 2

Sensing axis

Electrode 1

Amplifier

Demodulator

Low pass filter

In Phase Square Wave at 88kHz on Electrode 1

Output signal

C.G. 18540

Figure 14.5(b) Schematic of Accelerometer

Control Loop

15 Patent Applications

The following patent applications have been fi led for the Orion

TM

Combi Sensors:

Patent Application

US5226321

US5419194

US6698271

WO2009/119205

Status

Granted

Granted

Granted

Patent Pending

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

CMS390-00-0100-132 Rev 6 Page 29

Angular Rate and Dual-Axis Linear Acceleration Combi-Sensor

CMS390

Technical Datasheet www.siliconsensing.com

Notes

Silicon Sensing Systems Limited

Clittaford Road Southway

Plymouth Devon

PL6 6DE United Kingdom

T: +44 (0)1752 723330

F: +44 (0)1752 723331

E: [email protected]

W: siliconsensing.com

Silicon Sensing Systems Japan Limited

1-10 Fuso-Cho

Amagasaki

Hyogo 6600891 Japan

T: +81 (0)6 6489 5868

F: +81 (0)6 6489 5919

E: [email protected]

W: siliconsensing.com

Specifi cation subject to change without notice.

© Copyright 2013

Silicon Sensing Systems Limited

All rights reserved.

Printed in England 06/2013

Date 24/06/2013

CMS390-00-0100-132 Rev 6

DCR No. 710004904

© Copyright 2013 Silicon Sensing Systems Limited. All rights reserved. Silicon Sensing is an Atlantic Inertial Systems, Sumitomo Precision Products joint venture company.

Specifi cation subject to change without notice.

Page 30 CMS390-00-0100-132 Rev 6

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