Thermal Interface Materials For Electronics Cooling
aerospace
climate control
electromechanical
filtration
fluid & gas handling
hydraulics
pneumatics
process control
sealing & shielding
Thermal Interface Materials
For Electronics Cooling
Products & Custom Solutions Catalog
Chomerics
ENGINEERING YOUR SUCCESS.
Customer Responsibility and Offer of Sale Statement
CUSTOMER RESPONSIBILITY
!
WARNING – USER RESPONSIBILITY
FAILURE OR IMPROPER SELECTION OR IMPROPER USE OF THE PRODUCTS DESCRIBED HEREIN
OR RELATED ITEMS CAN CAUSE DEATH, PERSONAL INJURY AND PROPERTY DAMAGE.
This document and other information from Parker-Hannifin Corporation, its subsidiaries and authorized
distributors provide product or system options for further investigation
by users having technical expertise.
The user, through its own analysis
and testing, is solely responsible
for making the final selection of
the system and components and
assuring that all performance,
endurance, maintenance, safety
and warning requirements of the
application are met. The user must
analyze all aspects of the application, follow applicable industry
standards, and follow the information concerning the product in
the current product catalog and in
any other materials provided from
Parker or its subsidiaries or authorized distributors.
To the extent that Parker or its
subsidiaries or authorized distributors provide component or system
options based upon data or speci-
fications provided by the user, the
user is responsible for determining
that such data and specifications
are suitable and sufficient for all
applications and reasonably foreseeable uses of the components or
systems.
authorized distributors. This offer
and its acceptance are governed by
the provisions stated in the detailed
“Offer of Sale” elsewhere in this
document or available at
www.chomerics.com or
www.parker.com.
OFFER OF SALE
The items described in this
document are hereby offered
for sale by Parker Hannifin
Corporation, its subsidiaries or its
Chomerics
2
Thermal Management
Products & Custom Solutions Catalog
Customer Responsibility ............................................................................ 2
Offer Of Sale ............................................................................................... 2
Introduction ................................................................................................ 4
Heat Transfer Fundamentals....................................................................... 6
Gap Filler Pads
THERM-A-GAP™ HCS10, 569, 570, 579, 580, Thermal Pads ....................... 11
THERM-A-GAP™ 974, G974, 976, High Performance Thermal Pads ........... 13
THERM-A-GAP™ TS15 Tough Thermally Conductive Gap Filler Pads ......... 15
THERM-A-GAP™ 575NS, Silicone-Free Thermal Pads ............................... 17
Thermal Gels
THERM-A-GAP™ T63X Series Thermally Conductive Dispensable Gels .... 18
GEL 8010 & GEL30 Thermally Conductive Dispensable Gels ..................... 20
Phase Change Material
THERMFLOW® Phase Change Pads ............................................................ 22
Attachment Tapes
THERMATTACH® Double-Sided Thermal Tapes .......................................... 25
Liquids (Compounds)
THERM-A-FORM™ Cure-in-Place Potting and Underfill Materials ............. 29
Thermal Grease
Thermal Greases ...................................................................................... 31
Dielectric Pads
CHO-THERM® Commercial Grade Insulator Pads ...................................... 33
CHO-THERM® High Power Insulator Pads ................................................. 35
Heat Spreaders
T-WING® and C-WING™ Thin Heat Spreaders ............................................. 40
Glossary ....................................................................................................... 44
Safety Guide ................................................................................................. 47
Terms of Sale ............................................................................................... 57
ENGINEERING YOUR SUCCESS.
3
Introduction
Chomerics, a division of Parker
Hannifin Corporation (NYSE:PH), is
a global provider of EMI shielding,
thermal interface materials,
plastics and optical products.
Chomerics specializes in providing
products and services to OEM and
CEM electronics companies in the
telecommunications, information
technology, consumer, power
conversion, medical device, defense,
and transportation markets.
Since 1961, Chomerics has been
a leader in the development of
electrically conductive elastomers
for use as extruded, molded and
form-in-place EMI gaskets for
telecommunications and electronics
applications. Chomerics also offers
an extensive family of thermal
interface materials, which transfer
heat from electronic components to
heat sinks. Careful management
of thermal interfaces is crucial
to maintaining the reliability and
extending the life of electronic
devices and equipment. As
each new electronic product
generation requires higher
power in smaller packages, the
challenges associated with thermal
management become more intense.
Thermal material drivers include:
ä Lower thermal impedance
ä Higher thermal conductivity
ä Greater compliance and
conformability
ä High reliability
ä Greater adhesion
ä Ease of handling, application and
use
ä Long service life
Thermal Interface
Materials (TIMs) for
Light Emitting Diode
(LED) and Industrial
Applications
TIMs for Military
and Aerospace
Applications
Chomerics
Chomerics has a successful history
of providing thermal materials expertise and commitment to developing new, high performance products
to meet the thermal challenges of
systems designers.
Chomerics products have been
designed into thousands of
applications and help assure
the performance, integrity,
survivability and maintainability of
communications equipment, radar,
aircraft, computers, control systems,
telecommunications, consumer
devices, automotive and industrial
electronics. Our customers are
supported with comprehensive
applications engineering, supply
chain and fabrication services
worldwide.
Gap Filler Pad and Dispensed
Gels for Telecommunications
Dispensed Gels in
Automotive Electronic Control Unit
(ECU) Application
4
Parker Chomerics Capabilities include:
THERMAL MANAGEMENT
& CONTROL
ä
ä
ä
ä
ä
ä
ä
ä
ä
ä
ä
Thermally conductive gap filler pads
Fully cured dispensable thermal gels
Silicone-free thermal pads
Phase-change materials (PCM)
Polymer solder hybrids (PSH)
Dispensable thermal compounds
Thermal grease
Dielectric pads
Thin flexible heat spreaders
Custom integrated thermal/EMI assemblies
RF absorbing gap filler pads
EMI SHIELDING & COMPLIANCE
ä Conductive elastomers – molded, extruded, and
form-in-place (FIP)
ä Conductive foam based gaskets – fabric-over-foam
and z-axis foam
ä Conductive compounds – adhesives, sealants and
caulks
ä RF absorbing materials
ä EMI shielding plastics and injection molding
services
ä Coatings – direct metallization and conductive
paints
ä Metal gaskets – Springfingers, metal mesh and
combination gaskets
ä Foil laminates and conductive tapes
ä EMI shielding vents – commercial and military
honeycomb vents
ä Shielded optical windows
ä Cable shielding – ferrites and heat-shrink tubing/
wire mesh tape/zippered cable shielding
ä Compliance and safety test services
OPTICAL DISPLAY PRODUCTS
ä EMI shielding filters
(conductive coating & wire mesh)
ä Ant-reflective/contrast enhancement filters
ä Plastic or glass laminations
ä Hard coated lens protectors
ä Touchscreen lenses
PLASTIC INJECTION MOLDING
ä PREMIER® and other filled, electrically-conductive
plastics
ä Traditional thermoplastics
ä EMI and cosmetic coating services
ä EMI and environmental gasket integration
ä Assembly, pad printing, hot stamping, welding, and
heat staking
ä Insert molding, two-shot molding, and
overmolding capability
About Parker Hannifin Corporation
With annual sales exceeding $10 billion, Parker Hannifin is the world’s leading diversified manufacturer of motion
and control technologies and systems, providing precision-engineered solutions for a wide variety of mobile,
industrial and aerospace markets. The company’s products are vital to virtually everything that moves or requires
control, including the manufacture and processing of raw materials, durable goods, infrastructure development
and all forms of transport. Traded on the New York Stock Exchange under the symbol “PH,” Parker is strategically
diversified, value-driven and well positioned for global growth as the industry consolidator and supplier of choice.
ENGINEERING YOUR SUCCESS.
5
Heat Transfer Fundamentals
The objective of thermal
management programs in
electronic packaging is the
efficient removal of heat from the
semiconductor junction to the
ambient environment. This process
can be separated into three major
phases:
1. heat transfer within the
semiconductor component
package;
2. heat transfer from the package
to a heat dissipater (the initial
heat sink);
3. heat transfer from the heat
dissipater to the ambient
environment (the ultimate heat
sink)
The first phase is generally
beyond the control of the system
level thermal engineer because
the package type defines the
internal heat transfer processes.
In the second and third phases,
the packaging engineer’s goal
is to design an efficient thermal
connection from the package
surface to the initial heat spreader
and on to the ambient environment.
Achieving this goal requires a
thorough understanding of heat
transfer fundamentals as well as
knowledge of available interface
materials and how their key
physical properties affect the heat
transfer process.
Basic Theory
The rate at which heat is conducted
through a material is proportional
to the area normal to the heat flow
and to the temperature gradient
along the heat flow path. For a one
dimensional, steady state heat flow
the rate is expressed by Fourier’s
equation:
(1)
Q = kA
'T
d
Where:
Chomerics
k = thermal conductivity, W/m-K
Q = rate of heat flow, W
A = contact area, m2
d = distance of heat flow, m
T = temperature difference, C
Thermal conductivity, k, is an
intrinsic property of a homogeneous
material which describes the
material’s ability to conduct heat.
This property is independent of
material size, shape or orientation.
For non-homogeneous materials,
those having glass mesh or
polymer film reinforcement, the
term “relative thermal conductivity”
is appropriate because the thermal
conductivity of these materials
depends on the relative thickness of
the layers and their orientation with
respect to heat flow.
Another inherent thermal property
of a material is its thermal
resistance, R , as defined in
Equation 2.
(2)
R = A 'T
Q
This property is a measure of how
a material of a specific thickness
resists the flow of heat. The
relationship between k and R is
shown by substituting Equation (2)
into (1) and rearranging to form (3)
(3)
k= d
R
Equation 3 shows that for
homogeneous materials, thermal
resistance is directly proportional to
thickness. For non-homogeneous
materials, the resistance generally
increases with thickness but the
relationship may not be linear.
Thermal conductivity and thermal
resistance describe heat transfer
within a material once heat has
entered the material. Because real
surfaces are never truly flat or
smooth, the contact plane between
a surface and a material can also
Figure 1a. Schematic representation of two
surfaces in contact and heat flow across the
interface
T557 Impedance vs Pressure
tested at 70 deg C per ASTM D5470
0.025
Thermal Impedance, deg C-in2/W
Introduction
0.02
0.015
0.01
0.005
0
0
20
40
60
80
100
120
140
160
Pressure, psi
Figure 1b. T557 PCM compressed between
two contacting surfaces. As the material softens and deflects, thermal impedence drops.
produce a resistance to the flow
of heat. Figure 1a depicts surface
irregularities on a micro scale and
surface warp on a macro scale.
Actual contact occurs at the high
points, leaving air-filled voids where
the valleys align. Air voids resist
the flow of heat and force more of
the heat to flow through the contact
points. This constriction resistance
is referred to as surface contact
resistance and can be a factor at all
contacting surfaces.
The thermal impedance [ ] of a
material is defined as the sum
of its thermal resistance and any
contact resistance between it and
the contacting surfaces as defined
in Equation 4.
(4)
Ĭ = Rmaterial +Rcontact
Surface flatness, surface
roughness, clamping pressure,
material thickness, the presence of
pressure sensitive adhesive (PSA)
6
and compressive modulus have a
major impact on contact resistance.
Because these surface conditions
can vary from application to
application, thermal impedance of
a material will also be application
dependent.
Thermal Interface
Materials (TIMs)
Heat generated by a semiconductor
must be removed to the ambient
environment to maintain the
junction temperature of the
component within safe operating
limits. Often this heat removal
process involves conduction
from a package surface to a heat
spreader that can more efficiently
transfer the heat to the ambient
environment. The spreader has to
be carefully joined to the package to
minimize the thermal resistance of
this newly formed thermal joint.
Attaching a heat spreader to a
semiconductor package surface
requires that two commercial grade
surfaces be brought into intimate
contact. These surfaces are usually
characterized by a microscopic
surface roughness superimposed
on a macroscopic non-planarity that
can give the surfaces a concave,
convex or twisted shape. When two
such surfaces are joined, contact
occurs only at the high points. The
low points form air-filled voids.
Typical contact area can consist
of more than 90 percent air voids,
which represents a significant
resistance to heat flow.
Thermally conductive materials are
used to eliminate these interstitial
air gaps from the interface by
conforming to the rough and
uneven mating surfaces. Because
the TIM has a greater thermal
conductivity than the air it replaces,
THERMATTACH®
Adhesive Tapes
the resistance across the joint
decreases, and the component
junction temperature will be
reduced. A variety of material types
have been developed in response
to the changing needs of the
electronic packaging market. These
materials can be categorized as
follows:
Phase-Change Materials
THERMFLOW® materials are
formulated with polymer resins
that are loaded with thermally
conductive fillers. They combine
the high thermal performance of
grease with the ease of handling
and “peel-and-stick” application
of pads. They are used between
high performance microprocessors,
graphics processors, chipsets and
heat sinks.
ä Can achieve less than 0.06 °Cin2/W thermal impedance
ä Conform at operating
temperature to minimize
thermal path thickness
ä Excellent surface “wetting”
eliminates contact resistance
Phase change materials behave
like thermal greases after they
reach their melt temperature,
typically 45–62°C: their viscosity
rapidly diminishes and they flow
throughout the thermal joint to
fill the gaps that were initially
present. This process requires
some compressive force, usually a
few psi, to bring the two surfaces
together and cause the material
to flow. This process continues
until the two surfaces come into
contact at a minimum of three
points, or the joint becomes
so thin that the viscosity of the
material prevents further flow.
PCM materials inherently do not
provide electrical isolation because
they may allow the two surfaces to
make contact; however, variations
with dielectric films are available.
These materials have demonstrated
excellent long-term reliability and
performance.
THERMFLOW® Phase-Change Materials
Polymer Solder Hybrids
These THERMFLOW® materials
incorporate low-melt metal alloy
fillers which flow at temperatures
around 65°C and provide ultra low
thermal impedance, less than 0.1
°C-cm2/W at minimum bond line
thickness.
Thermal Tapes
THERMATTACH® tapes are
formulated with acrylic or
silicone based pressure sensitive
adhesive (PSA) loaded with
thermally conductive fillers. They
are designed to securely bond
heat sinks to power dissipating
components without an additional
clamping mechanism.
ä Acrylic based adhesives for
metal or ceramic packages
ä Silicone based adhesive for
bonding plastic packages to heat
sinks
ä Ionically pure formulations for
use inside component packages
and on printed circuit boards
ä Limited gap filling properties
require reasonable surface
flatness
ä High shear strength at elevated
temperatures
Thermal tapes are used primarily
for their mechanical adhesive
properties, and to a lesser extent
for their thermal properties. The
thermal conductivity of these tapes
is moderate and their thermal
performance in an application is
dependent on the contact area
that can be achieved between the
bonding surfaces.
ENGINEERING YOUR SUCCESS.
7
between a component and a cold
surface is highly variable. They are
dispensed onto the component
and readily conform over complex
geometries and then cured in place.
ä Low-modulus, ceramic filled
compounds
ä Fill gaps ranging from 0.005
to 0.25 inch without stressing
components
ä Can cure at room temperature
ä Localized encapsulating of
components
Insulating Pads
CHO-THERM® Insulator Pads
Gap Fillers
component.
THERM-A-GAP™ gap fillers are
a family of low modulus (soft),
thermally conductive silicone
elastomers for applications where
heat must be conducted over a
large and variant gap between a
semiconductor component and a
heat dissipating surface.
These unique materials result in
much lower mechanical stress on
delicate components than even
the softest gap-filling sheets. They
are ideal for filling variable gaps
between multiple components and
a common heat sink.
ä Soft silicone gel binder provides
low modulus for conformability
at low pressures
ä Low modulus allows materials
to make up for large tolerance
stack ups
ä Low pressure applications
Gap fillers are used to bridge large
gaps between hot components
and a cold surface. The gaps are
not only large, but their tolerances
can be ±20 % or greater. This
means that the gap filler must
have sufficient compliance to fill
such spaces without stressing
components beyond their safe
limits. Non-silicone gap fillers
are available for silicone sensitive
applications.
Form-In-Place Compounds
Gap fillers are supplied in pad-form
over a wide range of thickness,
0.5 to 5mm, and can be molded
into complex shapes. THERMA-GAP GELs are also supplied
as pre-cured, single component
compounds that can be dispensed
over the heat generating
Chomerics
Thermal gels are silicone-based
formulations that are loaded with
conductive fillers and are crosslinked to form a low-modulus paste.
They are highly conformable and
provide low thermal impedance
like greases but are designed to
overcome the pump-out and dryout issues of grease.
THERM-A-FORM™ compounds
are reactive, two-component
silicone RTVs (room temperature
vulcanizing materials) that can be
used to form thermal pathways in
applications where the distance
Form-in-Place Compounds and THERM-A-GAP Gels
CHO-THERM® insulating pads
were developed as a user-friendly
alternative to greased mica
insulators to be used between
discrete power devices and heat
sinks.
ä Silicone binder provides high
temperature stability and good
electrical insulation properties
ä Glass mesh reinforcement
provides cut-through resistance
ä High mounting pressure
required to minimize contact
resistance
ä U.L. recognized flammability
ratings
This class of product is
characterized by high thermal
conductivity, very high dielectric
strength and volume resistivity.
Pads must conduct very large
heat loads from discrete power
semiconductors to heat sinks,
while providing long-term electrical
insulation between the live
component case and the grounded
heat sink.
Thermal Greases
Thermal greases are formulated
with silicone or hydrocarbon oils
that are loaded with conductive
fillers. They are viscous liquids that
are typically stenciled or screen
printed onto the heat spreader
or heat sink. Greases have good
surface wetting characteristics and
flow easily to fill up voids at the
interfaces resulting in low thermal
impedance even at low application
pressure.
8
Key Properties of
Thermal Interface
Materials
Thermal Properties
The key properties of interface
materials are thermal impedance
and thermal conductivity.
Thermal Impedance
This is the measure of the total
resistance to the flow of heat from
a hot surface through an interface
material into a cold surface.
Thermal impedance is measured
according to the ASTM D5470 test
method. Although the current
version of this method is specific
to high durometer insulating pad
materials tested at high clamping
forces, the method has been
successfully adapted for use with
low durometer materials as well as
fluid compounds.
Thermal impedance can be
measured using ASTM D5470
at several clamping forces to
generate a pressure versus thermal
impedance plot as shown in Figure
2. This type of data can be used
to generate information about the
ability of a material to conform
to surfaces to minimize contact
resistance. Care must be taken with
this type of data because contact
resistance is also highly influenced
by surface characteristics. To
minimize the impact of test
equipment variations, this type of
work is best performed with the
same test surfaces for all materials
being tested.
Thermal Conductivity
Thermal impedance data measured
according to ASTM D5470 can
be used to calculate the thermal
conductivity of an interface
material. Rearranging Equation (3)
to give Equation (5)
(5)
Rmaterial =
d
k
and substituting into Equation (4)
yields Equation (6).
(6) Ĭ =
d
k
+ Rcontact
Equation (6) shows that for a
homogeneous material, a plot of
thermal impedance [Ĭ] versus
thickness (d) is a straight line
whose slope is equal to the inverse
of the thermal conductivity and
the intercept at zero thickness is
the contact resistance shown in
Figure 2. Thickness can be varied by
either stacking up different layers
of the material or by preparing the
material at different thicknesses.
1
Slope = 1/k
Strength by dividing the voltage
breakdown value by the specimen
thickness where the dielectric
failure occurred. This test is an
indication of the ability of a material
to withstand high voltages, but
does not guarantee how a material
will behave over time in a real
application. The value is influenced
by several factors. Humidity and
elevated temperature will reduce
the voltage breakdown because
absorbed water will degrade the
electrical properties of the material.
The size of the test electrode will
affect the observed breakdown
voltage. A larger test electrode will
typically yield a lower breakdown
voltage. The presence of partial
discharge, as well as mechanical
stresses imposed on the interface
material, also reduce voltage
breakdown.
Heat Capacity
Heat capacity or thermal mass
represents the ability of a material
to store heat.
Volume Resistivity
Volume resistivity is a measure of
the bulk electrical resistance of
a unit cube of a material. When
determined per ASTM D257, volume
resistivity can give an indication of
how well an interface material can
limit leakage current between an
active component and its grounded
metal heat sink. As with voltage
breakdown, volume resistivity can
be significantly lowered by humidity
and elevated temperature.
Electrical Properties
Elastomeric Properties
Rcontact
d
Figure 2. Thermal Impedance vs. Thickness
Coefficient of Thermal Expansion
CTE is the tendency of a material
to change in volume in response to
changes in temperature.
Voltage Breakdown
This is a measure of how much
voltage differential a material can
withstand under a specific set of
test conditions. This property is
usually measured using ASTM D149
where a test specimen is subjected
to ramped alternating current
voltage such that dielectric failure is
reached within twenty seconds after
the start of the test. Five specimens
are tested and the average voltage
breakdown is calculated and
reported. The value is an average,
not a minimum. Voltage Breakdown
can be converted to Dielectric
Interface materials exhibit
properties typical of highly filled
elastomers, namely compression
deflection, compression set and
stress relaxation.
Compression Deflection
Compression deflection refers
to resultant forces a material
exerts while being deflected. As a
compressive load is applied, the
elastomer material is deformed
but the volume of the material
remains constant. The compression
deflection characteristics can vary,
depending on part geometry (i.e.,
thickness and surface area), rate of
deflection, size of probe, etc.
ENGINEERING YOUR SUCCESS.
9
Stress Relaxation
When a compressive load is applied
to an interface material, there is an
initial deflection followed by a slow
relaxation process whereby some
of the load is relieved. This process
continues until the compressive
load is balanced by the cohesive
strength of the material.
Compression Set
Compression set is the result
of stress relaxation. After a
material has been subjected to a
compressive load for an extended
time, part of the deflection
becomes permanent and will not
be recoverable after the load is
reduced.
Thermal Interface Materials (TIMs) for Consumer
Electronics and Information Technology
Chomerics
10
THERM-A-GAP™ HCS10,569,570,579 and 580
Thermally Conductive Gap Filler Pads
Description
THERM-A-GAP™ gap-filler
sheets and pads offer excellent
thermal properties and highest
conformability at low clamping
forces.
Features / Benefits
ä Ultra low deflection force
ä High thermal conductivity
ä High tack surface reduces
contact resistance
ä “A” version offers high strength
acrylic PSA for permanent
attachment
ä UL recognized V-0 flammability
ä RoHS compliant
All products are available on
aluminum foil “A’ or on “clean
break” glass “G” fiber carrier. As
with all previous Chomerics gapfillers, the “A” versions have a high
strength acrylic pressure sensitive
adhesive (PSA) for permanent
attachment to the cold surfaces.
THERM-A-GAP™ HCS10, 569, 570, 579 and 580 Thermally Conductive Pads
Typical Properties
HCS10
569
570
579
580
Test Method
Orange /
Grey Carrier
Grey
Blue
Pink
Yellow
Visual
A or G
A, G, PB, or PT
A or G
A, G, PB,
PT or KT
A or G
--
0.010 - 0.200
(0.25 - 5.0)
0.010 - 0.200
(0.25 - 5.0)
2.0
2.2
2.2
2.9
2.9
ASTM D792
4
10
25
30
45
ASTM D2240
% Deflected
26
36
59
73
% Deflected
20
30
50
65
%
Deflected
10
15
25
35
% Deflected
22
33
55
68
% Deflected
7
10
20
30
ASTM C165 MOD
(0.125 in “G” Type,
0.50 in dia. probe,
0.025 in/min rate)
Operating Temperature Range, °F (°C)
-67 to 392
(-55 to 200)
-67 to 392
(-55 to 200)
-67 to 392
(-55 to 200)
-67 to 392
(-55 to 200)
-67 to 392
(-55 to 200)
--
Thermal Conductivity, W/m-K @ 25 psi
1
1.5
1.5
3
3
ASTM D5470
1.5
(9.7)
1.4
(9.1)
1.4
(9.1)
0.7
(4.5)
0.7
(4.5)
ASTM D5470
Color
Physical
Carrier
G = Woven glass - no PSA
A = Aluminum foil - with PSA
PB = PET carrier laminated to glass side***
PT = PET carrier laminated to the unsupported side***
KT = Thermally Enhanced Polyimide Carrier
Standard Thicknesses*, inch (mm)
Specific Gravity
Hardness, Shore 00
Thermal
Percent Deflection @ Various Pressures**
(0.125 in thick sample)
@ 5 psi (34 kPa)
@ 10 psi (69 kPa)
@ 25 psi (172 kPa)
@ 50 psi (345 kPa)
2
2
Thermal Impedance, °C-in /W (°C-cm /W)
@ 10 psi, @ 1mm thick, G version
Heat Capacity, J/g-K
Regulatory
Electrical
Coefficient of Thermal Expansion, ppm/K
Dielectric Strength, VAC/mil (KVAC/mm)
Volume Resistivity, ohm-cm
0.020 - 0.200 0.010 - 0.200 0.020 - 0.200
(0.5 - 5.0)
(0.25 - 5.0)
(0.5 - 5.0)
ASTM D374
1
1
1
1
1
ASTM E1269
N/A
250
250
150
150
ASTM E831
200 (8)
200 (8)
200 (8)
200 (8)
200 (8)
ASTM D149
1014
1014
1014
1014
1014
ASTM D257
Dielectric Constant @1,000 kHz
5.3
6.5
6.5
8.0
8.0
ASTM D150
Dissipation Factor @ 1,000 kHz
0.013
0.013
0.013
0.010
0.010
Chomerics Test
Flammability Rating
(See UL File E140244 for Details)
V-0
V-0
V-0
V-0
V-0
UL 94
RoHS Compliant
Yes
Yes
Yes
Yes
Yes
Chomerics
Certification
0.44 (0.13)
0.42 (0.08)
0.35 (0.09)
0.19 (0.06)
0.18 (0.05)
ASTM E595
24 (18)
24 (18)
24 (18)
24 (18)
24 (18)
Chomerics
Outgassing, % TML (% CVCM)
Shelf Life,
months from date of shipment G (A)
*Thickness tolerance, in(mm) ±10% nominal thickness @ 0.1in (2.5mm) or less; ± 0.01in (0.25mm) @ nominal thickness greater than 0.1in
(2.5mm). Custom thicknesses may be available upon request.
**The typical deflection range is approximately 5-50%
***Laminated polyester film provides low abrasion on one side as well as improved dielectric isolation.
ENGINEERING YOUR SUCCESS.
11
THERM-A-GAPTM HCS10, 569, 570, 579 and 580 Thermally Conductive Pads
TYPICAL APPLICATIONS
ä Telecommunications equipment
ä Consumer electronics
ä Automotive electronics (ECUs)
ä LEDs, lighting
ä Power conversion
ä Desktop computers, laptops,
servers
ä Handheld devices
ä Memory modules
ä Vibration dampening
HANDLING INFORMATION
These products are defined by
Chomerics as “articles” according
to the following generally
recognized regulatory definition for
articles:
An article is a manufactured item
“formed to a specific shape or
design during manufacturing,”
which has “end use functions”
dependent upon its size and shape
during end use and which has
generally “no change of chemical
composition during its end use.”
In addition:
ä
There is no known or
anticipated exposure to
hazardous materials/
substances during routine and
anticipated use of the product.
ä
The product’s shape, surface,
and design is more relevant
than its chemical composition.
PRODUCT ATTRIBUTES
HCS10
ä Economical solution
ä Highest conformability
gap filler sheet
569
ä Economical combination of
thermal performance and
conformability
570
ä Best for molding complex parts
and vibration dampening
579
ä Combination of excellent
thermal performance and
conformability
ä Lowest outgassing
580
ä Best for molding complex parts
and vibration dampening
ä Lowest outgassing
These materials are not deemed by
Chomerics to require an MSDS. For
further questions, please contact
Chomerics at 781-935-4850.
With Glass Carrier
HCS10A
With Aluminium PSA Carrier
Ordering Information
Part Number:
XX
YYYYY
ZZZZ
W
XX
YYYYY
ZZZZ
1 = OEM Sheet - No PSA
(“G” carrier and HCS40)
2 = OEM Sheet with PSA 1 side
(“A” Carrier only)
Material thickness* is in ten
mil increments
(e.g. 10 = 0.100” or 2.54 mm)
(e.g. 02 = 0.020” or 0.50 mm)
6W
OEM Part Number Examples
0909 = (9” X 9” Sheet / 22.9 cm X 22.9 cm).
Thermally conductive pads are available in the following formats.
Distributor Part Numbers - 18” X 18” Sheets
9 = Custom configuration
11 = Custom, no PSA
(“G” carrier and HCS40)
12 = Custom, with PSA 1 side
(“A” Carrier only)
0.010 in = 28539
0.015 in = 28540
0.020 in = 20698
0.030 in = 20913
0.040 in = 20684
0.050 in = 27395
0.060 in = 20991
0.070 in = 20685
0.080 in = 21259
0.100 in = 20672
0.120 in = 27102
0.130 in = 20675
0.140 in = 27100
0.150 in = 27101
0.160 in = 20686
0.180 in = 27103
0.200 in = 20687
THERM-A-GAP™ Material
Code
HCS10G & HCS10A
G569 & A569
G570 & A570
G579 & A579
G580 & A580
(THERM-A-GAP™ 174, 274
and 574 are legacy products
and are available upon
special request.)
Custom configuration
(Please contact Chomerics for a pre-assigned part number, for
custom widths, part sizes, etc. )
* See typical properties table for thicknesses.
Chomerics
Custom die-cut parts on sheets, or as individual parts
“A” version offered die-cut (up to 40 mil) on continuous rolls (higher volumes)
Custom thicknesses available upon request
(up to 1” thick)
Custom molded designs and ribbed sheets
12
THERM-A-GAP™ 974, G974 and 976
High Thermal Conductivity Gap Filler Pads
Description
Typical Applications
THERM-A-GAP™ 97X gap
fillers offer the highest thermal
conductivity for low to moderate
clamping force applications.
ä Telecommunications
equipment
ä Consumer electronics
ä Automotive electronics
(ECUs)
ä LEDs, lighting
ä Power conversion
ä Power semiconductors
Features/Benefits
ä High thermal conductivity
ä 974 and G974 supplied with
PSA for ease of use
ä 976 is softer compared to
similar high conductivity
materials
THERM-A-GAP™ 974, G974 and 976 Thermally Conductive Gap Filler Pads
Typical Properties
Color
Carrier
Physical
Test Method
Gold
Visual
Fiberglass with PSA
None
--
0.010 - 0.100
(0.25 - 1.50)
0.040 - 0.200
(1.00 - 5.00)
ASTM D374
1.40
1.40
1.30
ASTM D792
Hardness, Shore A
40
40
10
ASTM D2240
Penetrometer, mm
25
25
60
Chomerics
% Deflected
% Deflected
% Deflected
7
11
12
13
7
11
12
13
6
10
11
45
6.0
5.0
6.5
ASTM D5470
0.45
(2.9)
0.51
(3.3)
0.30
(1.9)
ASTM D5470
Specific Gravity
Thermal Conductivity, W/m-K
2
Thermal
976
Blue
PSA
Percent Deflection @ Various Pressures
(0.060 in thick sample)
@ 5 psi (34 kPa)
@ 10 psi (69 kPa)
@ 25 psi (172 kPa)
@ 50 psi (345 kPa)
2
Thermal Impedance, °C-in /W (°C-cm /W)
50 psi (@ 345 kPa), 0.040 in (1 mm)
ASTM C165 MOD
(0.060” thick,
0.50 in diameter,
0.025 in/min rate)
Heat Capacity, J/g-K
0.9
0.9
0.9
ASTM E1269
Coefficient of Thermal Expansion, ppm/°C
100
100
100
ASTM E831
-67 to 392
(-55 to 200)
-67 to 392
(-55 to 200)
-67 to 392
(-55 to 200)
--
200 (5.1)
200 (5.1)
200 (5.1)
ASTM D149
Operating Temperature Range, °F (°C)
Electrical
G974
0.020 - 0.080
(0.5 - 1.50)
Standard Thicknesses*, in (mm)
Regulatory
974
Blue
Dielectric Strength, Vac/mil (KVac/mm)
Volume Resistivity, ohm-cm
10
14
14
10
14
10
ASTM D257
Dielectric Constant @1,000 kHz
3.2
3.2
3.2
ASTM D150
Dissipation Factor @ 1,000 kHz
< 0.001
< 0.001
< 0.001
Chomerics Test
Flammability Rating
(See UL File E140244 for Details)
Not Tested
V-0
V-0
UL 94
Outgassing, % TML (% CVCM)
0.59 (0.18)
0.59 (0.18)
0.64 (0.21)
ASTM E595
RoHS Compliant
Yes
Yes
Yes
Chomerics
Certification
Shelf Life,
months from date of shipment
12
12
24
Chomerics
*Thickness tolerance, mm(in.) ±10% nominal thickness @ 2.5mm (100 mil) or less;
± 0.25mm (10mil) @ nominal thickness greater than 2.5mm (100 mil). Custom thicknesses may be available upon request.
ENGINEERING YOUR SUCCESS.
13
THERM-A-GAP™ 974, G974 and 976 Thermally Conductive Gap Filler Pads
These products are defined by
Chomerics as “articles” according to
the following generally recognized
regulatory definition for articles:
Product Attributes
974
ä Excellent thermal performance
ä Acrylic PSA for improved
application
An article is a manufactured item
“formed to a specific shape or
design during manufacturing,”
which has “end use functions”
dependent upon its size and shape
during end use and which has
generally “no change of chemical
composition during its end use.”
G974
ä Excellent thermal performance
ä Acrylic PSA for improved
application
ä Fiberglass reinforced for
improved tear strength and
improved rework capabilities
ä There is no known or anticipated
exposure to hazardous
materials/substances during
routine and anticipated use of
the product.
ä The product’s shape, surface,
and design is more relevant than
its chemical composition.
These materials are not deemed by
Chomerics to require an MSDS. For
further questions, please contact
Chomerics at 781-935-4850.
In addition:
976
ä Superior thermal performance
ä Low compression force under
pressure
ä Minimal stress on components
Material Handling
Ordering Information
THERM-A-GAP products are available in the following formats.
Contact Chomerics for custom widths, part sizes, etc.
ä Full Sheets, 9”x12” to 20”x25”
ä Die-cut parts on sheets
ä Custom die-cut parts on sheets, or as individual parts
Part Number:
6W
W
XX
YYYYY
ZZZZ
XX
YYYYY
ZZZZ
1 = Sheet - No PSA (976 only)
2 = Sheet with PSA 1 side
(974/G974 only)
Material thickness* is in ten
mil increments
(e.g. 10 = 0.100” or 2.54 mm)
(e.g. 02 = 0.020” or 0.50 mm)
0912 = (9” X 12” Sheet / 22.9 cm X 30.5 cm).
2025 = (20” X 25” Sheet / 50.8 cm X 63.5 cm).
9 = Custom configuration
11 = Custom, no PSA (976 only)
12 = Custom, with PSA 1 side
(974/G974 only)
YYYYY = Custom configuration
(Please contact Chomerics for a
pre-assigned part number if necessary)
ZZZZ = 974, G974, or 976
* See typical properties table for thicknesses.
Chomerics
14
THERM-A-GAP™ TS15
Thermally Conductive Gap Filler Pads
THERM-A-GAP™ TS15 is designed
to provide excellent mechanical
integrity in applications where
clamping forces exert extreme
pressure on parts and where gaps
are thicker than what is typical of
dielectric pads.
ä
Product Attributes
ä
ä
Product Features
ä
Thermal performance
decreases electronic
component temperatures,
increasing product lifetimes
Increased tear resistance
eliminates dielectric failures
by preventing puncture from
sharp components.
ä
Good thermal conductivity
Excellent mechanical
strength
Excellent cut-through
resistance
THERM-A-GAP™ TS15 Thermally Conductive Pads
Typical Properties
TS15
Test Method
Teal / Blue
Visual
Fiberglass reinforced
dielectric layer with PSA
--
0.040 - 0.200
(1.0 – 5.0)
ASTM D374
Specific Gravity
2.2
ASTM D792
Hardness, Shore A
50
ASTM D2240
Color
Carrier
Thermal
Physical
Standard Thicknesses*, inch (mm)
Percent Deflection @ Various Pressures
(0.125 in thick sample)
@ 5 psi (34 kPa)
@ 10 psi (69 kPa)
@ 25 psi (172 kPa)
@ 50 psi (345 kPa)
Electrical
ASTM C165 MOD
3
5
7
9
(0.125in “G” Type, 0.50 in dia.
sample, 0.025 in/min rate)
Tensile Strength, psi
250
ASTM D412
Tear Strength, lb/in
40
ASTM D624
Elongation, %
20
ASTM D412
1.5 (9.7)
ASTM D5470
1
ASTM E1269
Thermal Impedance, °C-in2/W (°C-cm2/W) @ 10 psi (69 kPa)
@ 0.04” (1mm) thickness
Heat Capacity, J/g-K
Coefficient of Thermal Expansion, ppm/K
Regulatory
% Deflected
250
ASTM E831
200 (8)
ASTM D149
Volume Resistivity, ohm-cm
1014
ASTM D257
Dielectric Constant @1,000 kHz
6.5
ASTM D150
Dissipation Factor @ 1,000 kHz
0.013
Chomerics Test
Flammability Rating
(See UL File E140244 for Details)
Pending
UL 94
Yes
Chomerics
Certification
Outgassing, % TML (% CVCM)
Pending
ASTM E595
Shelf Life,
months from date of shipment
18
Chomerics
Dielectric Strength, VAC/mil (KVAC/mm)
RoHS Compliant
*Thickness tolerance, inch (mm) ±10% nominal thickness @ 0.100in. (2.5mm) or less;
± 0.010in.(0.25mm) @ nominal thickness greater than 0.100in. (2.5mm). Custom thicknesses may be available upon request.
ENGINEERING YOUR SUCCESS.
15
THERM-A-GAPTM TS15 Thermally Conductive Pads
Bad
Good
Board
Board
Typical TIM
Solution
Therm-A-Gap™
TS15
Sink / Case
Electrical
Shorts
Sink / Case
Picture depicts rupture of typical gapfiller pad by
way of unusual high profile / sharp mechanical
components
TS15 deflects while resisting rupture to
prevent electrical shorts.
Ordering Information
Part Number:
6W
W
2 = OEM Sheet
with PSA 1 side
(“T” Carrier only)
XX
YYYYY
XX
Material thickness* is in ten
mil increments
(e.g. 10 = 0.100” or 2.54 mm)
(e.g. 04 = 0.040” or 1.00 mm)
YYYYY
ZZZZ
ZZZZ
OEM Part Number Examples
0909 = (9” X 9” Sheet / 22.9 cm X 22.9 cm).
Thermally conductive pads are available in the following formats.
Distributor Part Numbers - 18” X 18” Sheets
9 = Custom
configuration
12 = Custom, with PSA 1 side
(“T” Carrier only)
0.040 in = 20684
0.050 in = 27395
0.060 in = 20991
0.070 in = 20685
0.080 in = 21259
0.100 in = 20672
0.120 in = 27102
0.130 in = 20675
0.140 in = 27100
0.150 in = 27101
0.160 in = 20686
0.180 in = 27103
0.200 in = 20687
THERM-A-GAP™ Material Code
TS15
Custom configuration
(Please contact Chomerics for a pre-assigned part number, for
custom widths, part sizes, etc. )
* See typical properties table for thicknesses.
Custom die-cut parts on sheets
Custom thicknesses available upon request
Chomerics
16
THERM-A-GAP™ 575-NS
Silicone-Free Soft Acrylic Thermally Conductive Gap Filler Pads
Description
THERM-A-GAP™ acrylic gap filler
pads are used in silicone sensitive
applications.
Features / Benefits
ä Economical with good thermal
conductivity
ä No silicone outgassing or
extractables
ä RoHs compliant
ä Inherently tacky on both sides
for ease of application (No
pressure sensitive adhesive
option available/necessary)
Typical Applications
ä
ä
ä
ä
Hard disk drives/storage
Optical electronics
Aerospace/Defense
Desktop computers, laptops,
servers
ä Telecommunications equipment
ä Consumer electronics
THERM-A-GAP™ Silicone-Free Soft Acrylic Thermally Conductive Pads
Typical Properties
Color
575-NS
Test Method
Yellow
Visual
Composition
Ceramic Filled Acrylic
---
Thickness, in (mm)
0.020 -0.100 (0.5 – 2.5)
ASTM D374
Specific Gravity
1.8
ASTM D792
Thermal Conductivity, W/m-K
1.2
ASTM D5470 @ 50 psi
Hardness (Shore 00)
Operating Temperature Range, °F (°C)
RoHS Compliant
70
ASTM D2240
-4 to 212 (-20 to 100)
--
Yes
Chomerics Certification
Ordering Information
Chomerics P/N
Thickness / in. (mm)
69-11-27154-575NS
0.020 (0.5)
69-11-27155-575NS
0.040 (1.0)
69-11-27156-575NS
0.047 (1.2)
69-11-27157-575NS
0.060 (1.5)
69-11-27158-575NS
0.080 (2.0)
69-11-27159-575NS
0.100 (2.5)
Sheet Size
11.8 X 15.7
(300 X 400 mm)
7.9 X 11.8
(200 X 300 mm)
ENGINEERING YOUR SUCCESS.
17
THERM-A-GAP™ Gels
Dispensable, Very Low Compression Force, Thermal Gap Fillers
lower mechanical stress on delicate
components than even the softest
gap-filling sheets. They are ideal
for filling variable gaps between
multiple components and a common
heat sink.
Features / Benefits
Description
THERM-A-GAP™ Gels are highly
conformable, pre-cured, singlecomponent compounds. The
cross-linked gel structure provides
superior long term thermal stability
and reliable performance. These
unique materials result in much
ä Dispensable
ä Fully cured
ä Highly conformable at low
pressures
ä No refrigeration, mixing or filler
settling issues in storage
ä Single dispensable TIM can
eliminate multiple pad part
sizes/numbers
ä Reworkable
Typical Applications
ä Automotive electronic control
units (ECUs)
- Engine control
- Transmission control
- Braking/traction control
ä Power conversion equipment
ä Power supplies and
uninterruptible power supplies
ä Power semiconductors
ä MOSFET arrays with common
heat sinks
ä Televisions and consumer
electronics
THERM-A-GAP™ Dispensed Thermal Gels
Typical Properties
T630/T630G
T635
T636
Test Method
White
White
Yellow
Visual
10
8
8
Chomerics
2.25
1.50
1.20
ASTM D792
Percent Deflection @ Various Pressures
(0.5 psi)
(1 psi)
(2 psi)
(3 psi)
(4 psi)
(5 psi)
% Deflection
-36
47
54
59
63
% Deflection
-13
33
43
50
56
% Deflection
-6
23
35
43
48
Modified ASTM C165
Dispensed 1.0 cc of material
Brought 1” x 1” probe
down to 0.100”
Test rate 0.025 in/min
Typical minimum bondline thickness,
in (mm)
0.004 (0.10)/
0.010 (0.25)
0.015 (0.38)
0.015 (0.38)
--
Thermal Conductivity, W/m-K
0.7
1.7
2.4
ASTM D5470
Heat Capacity, J/g-K
1.1
0.9
0.9
ASTM E1269
Coefficient of Thermal
Expansion, ppm/K
350
400
400
ASTM E831
-67 to 392
(-55 to 200)
-67 to 392
(-55 to 200)
-67 to 392
(-55 to 200)
--
200 (5.0)
200 (5.0)
200 (5.0)
ASTM D149
1014
1014
1014
ASTM D257
Color
Flow Rate, cc/min - 30cc taper tip,
0.130” orifice, 90psi (621 kPa)
Thermal
Physical
Specific Gravity
Regulatory
Electrical
Operating Temperature Range, °F (°C)
Dielectric Strength,
VAC / mil (KVAC/mm)
Volume Resistivity, ohm-cm
Dielectric Constant @1,000 kHz
5.5
4.0
4.0
ASTM D150
Dissipation Factor @ 1,000 kHz
0.010
0.003
0.003
Chomerics
Flammability Rating
(See UL File E140244 for Details)
V-0
Not Tested
V-0
UL 94
RoHS Compliant
Yes
Yes
Yes
Chomerics
Certification
Outgassing, % TML
0.55
0.5
0.4
ASTM E595
18
18
18
Chomerics
Shelf Life,
months from date of manufacture
Chomerics
18
THERM-A-GAPTM Dispensed Thermal Gels
Product Attributes
T630 / T630G
ä Years of proven reliability in
high-volume automotive
applications
ä General use material
ä Good thermal performance
ä Lowest deflection force required
ä Minimal stress on components
ä “G” version has 0.010” glass
beads as compression stops for
electrical isolation
ä Excellent thermal performance
ä Low deflection force required
ä Minimal stress on components
T636
ä Superior thermal performance
ä Solves the toughest heat transfer
problems
ä Low deflection force required
ä Minimal stress on components
Consult Applications Engineering for
automated dispensing equipment
recommendations
T635
Ordering Information
These materials are available in the following formats.
Contact Chomerics for custom widths, part sizes, etc.
6W
XX
W
XX
YYYYY
ZZZZ
YYYYY
ZZZZ
THERM-A-GAP GEL
5 = Standard Packaging
0030 = 30cc Taper Tip Tube
00
GELS
T630(G), T635 & TT636
9 = Custom
Configuration
11
0300 = 300cc Aluminum Cartridge (Caulking Style)
25177
T630 (G) = 1 Gallon Pail (1125cc, 5Kg)*
32768
T635 = 1 Gallon Pail (2800cc, 4.2Kg)*
32769
T636 = 1 Gallon Pail (2800cc, 3.4Kg)*
Custom Part Number
THERM-A-GAP Gel Material Code
T630(G), T635 & T636
*High volume dispensing equipment required. Please contact Applications Engineering for additional support.
Other custom container sizes may be available upon request
Optional Supplier
Description
Hand-Gun Pneumatic Dispensing 300cc cartridges
Dispensing Equipment Options
Bergdahl Associates
Semco Model 550
Hand-Gun Pneumatic Dispensing 180cc (6oz) cartridges
Bergdahl Associates
Model 250A-6oz
Sealant Gun
http://www.bergdahl.com
Ultra 2400 Series
Pneumatic Shot Size Controllers
30cc, 180cc and 300cc Shot Size Dispensing Equipment
EFD
30cc/55cc Adapter Assembly
EFD
10000D5152
Dispensing Sleeve to support 6oz (180cc) Semco Tubes
EFD
5192-6
Ultra 1400 Series
Ultra 870 Series
http://www.efd-inc.com
SEMCO is a trademark of Bergdahl Associates, Inc
ENGINEERING YOUR SUCCESS.
19
THERM-A-GAP™ GEL 8010 & GEL 30
High Performance Fully Cured Dispensable GELS
Description
Typical Applications
Parker Chomerics fully cured
dispensable GELs eliminate
timeconsuming hand assembly,
decreasing installation costs and
reducing customer manufacturing
and purchasing (logistical)
complexity. These products require
no mixing or curing, providing
superior design flexibility.
ä Automotive Electronic Control
Units (ECU’s)
ä Power Supplies &
Semiconductors
ä Memory & Power Modules
ä Microprocessors / Graphics
Processors
ä Flat Panel Displays & Consumer
Electronics
ä Provides low thermal impedance
at thin and thick gaps, allowing
use of common heat spreaders
ä Proven reliability in extreme
temperature cycling and shock &
vibration
ä Deflects easily under very low
compressive forces, decreasing
stress on components thus
decreasing component failures.
Typical Properties
Color
Physical
Flow Rate, grams/min - 30cc syringe with no tip attachment
0.100” orifice, 90psi (621 kPa)
Specific Gravity
Thermal
Easily dispensable
Fully-cured / No pump out
High bulk thermal conductivity
Low thermal impedance
Ultra low compression force
High tack surface & reworkable
Proven long-term reliability
GEL 8010
GEL 30
Test Method
White
Light Pink
Visual
60
20
Chomerics
2.70
3.20
ASTM D792
Modified ASTM C165
Dispensed 1.0 cc of material
Brought 1” x 1” probe
down to 0.100”
Test rate 0.025 in/min
% Deflection
% Deflection
Typical minimum bondline thickness, in (mm)
0.002 (0.05)
0.004 (0.10)
Chomerics
3.0
3.5
ASTM D5470
1
1
ASTM E1269
150
150
ASTM E831
-67 to 392
(-55 to 200)
-67 to 392
(-55 to 200)
Chomerics
200 (8.0)
200 (8.0)
ASTM D149
Volume Resistivity, ohm-cm
1014
1014
ASTM D257
Dielectric Constant @100 kHz
6.3
7.0
ASTM D150
Dissipation Factor @ 100 kHz
Heat Capacity, J/g-K
Coefficient of Thermal
Expansion, ppm/K
Operating Temperature Range, °F (°C)
Electrical
ä
ä
ä
ä
ä
ä
ä
Percent Deflection @ Various Force Levels
(See graph on following page)
Thermal Conductivity, W/m-K
Regulatory
Features/Benefits
Dielectric Strength,
Vac / mil (KVac/mm)
0.002
0.002
Chomerics
Flammability Rating
V-0
V-0
UL 94
RoHS Compliant
Yes
Yes
Chomerics Certification
1.33 (0.34)
0.15 (0.05)
ASTM E595
18
18
Chomerics
Outgassing, % TML (CVCM)
Shelf Life,
months from date of manufacture
Chomerics
20
GEL 8010 & GEL 30 Thermally Conductive Dispensable Gels
Product Attributes
Installation Guidelines
GEL 30
ä Accommodates a variety of bond
line thicknesses for application
to multiple devices
ä Moderate bondline gel
(approximately 4-40+ mils)
ä High Bulk Thermal Conductivity
ä Excellent performance-to-price
ä Compatible with high volume,
automated dispense processes
ä Meets Telcordia (Bellcore)
silicone specifications
GEL 8010
ä Thin bondline gel (approximately
2-10 mils)
ä Low thermal impedance gel
ä Stencil printable with no pump
out
ä Ideal for high-volume dispensing
ä Proven long-term reliability
Thermal gels are supplied in plastic
syringes and aluminum cartridges.
Apply pressure to the rear of the
cartridge, simply dispense the
desired amount onto components
or cooling plates. The gel is
reworkable and excess material can
be easily wiped off.
Since GEL 8010 gel is conformable,
the gel can be stencil printed
onto the plates. The thickness of
the printed gel can be adjusted
depending on the component type
and size, but about 6mil thickness is
recommended.
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3UHVVXUHSVL
Ϯ
Ϯ͘ϱ
ϯ
ϯ͘ϱ
ϰ
WƌĞƐƐƵƌĞ;ƉƐŝͿ
Ordering Information
6W
W
5 = Standard Packaging
GELS
YYYYY
ZZZZ
XX
YYYYY
ZZZZ
00
THERM-A-GAP
GEL 8010 & GEL 30
XX
9 = Custom
Configuration
11
0030 = 30cc Taper Tip Tube
0300 = 300cc Aluminum Cartridge (Caulking Style)
33579
GEL 8010 = 1 Gallon Pail (2800cc, 7.6Kg)*
28020
GEL 30 = 1 Gallon Pail (2800cc, 9Kg)*
THERM-A-GAP GEL Material Code
GEL 8010 & GEL 30
Custom Part Number
*High volume dispensing equipment required. Please contact Applications Engineering for additional support.
Other custom container sizes may be available upon request
Dispensing Equipment Options
Hand-Gun Pneumatic Dispensing 300cc cartridges
Optional Supplier
Description
Bergdahl Associates
Semco Model 550
http://www.bergdahl.com
Ultra 2400 Series
Pneumatic Shot Size Controllers
30cc, 180cc and 300cc Shot Size Dispensing Equipment
EFD
30cc/55cc Adapter Assembly
EFD
10000D5152
EFD
5192-6
Ultra 1400 Series
Ultra 870 Series
Dispensing Sleeve to support 6oz (180cc) Semco Tubes
http://www.efd-inc.com
SEMCO is a trademark of Semco, Inc.
ENGINEERING YOUR SUCCESS.
21
THERMFLOW®
Non-Silicone, Phase-Change Thermal Interface Pads
Completely fills interfacial air gaps and voids for best thermal performance
phase-change, decreasing their
electrical isolation properties.
PC07DM-7 is the only phase-change
materials recommended for use as
a dielectric insulator.
Chomerics offers two types of phase
change materials—traditional
thermal interface pads and Dual
Phase Change Polymer Solder
Hybrids.
Description
THERMFLOW® phase-change
Thermal Interface Materials (TIMs)
completely fill interfacial air gaps
and voids. They also displace
entrapped air between power
dissipating electronic components.
Phase-change materials are
designed to maximize heat
sink performance and improve
component reliability.
Upon reaching the required melt
temperature, the pad will fully
change phase and attain minimum
bond-line thickness (MBLT) - less
than 0.001 inch or 0.0254mm, and
maximum surface wetting. This
results in a low thermal resistance
path.
At room temperature, THERMFLOW
materials are solid and easy to
handle. This allows them to be
consistently and cleanly applied
as dry pads to a heat sink or
component surface. THERMFLOW
material softens as it reaches
component operating temperatures.
With light clamping pressure it
will readily conform to both mating
surfaces.
This ability to completely fill air
gaps and voids typical of component
packages and heat sinks allows
THERMFLOW pads to achieve
performance superior to any other
thermal interface materials.
Standard THERMFLOW products are
electrically non-conductive however
metal-to-metal contact is possible
after the material undergoes
Chomerics
Dual Phase Change Polymer
Solder Hybrid Materials
Dual Phase Change Thermal
Interface Materials consist of binder
and fillers which both phasechange to exhibit the lowest thermal
impedance of the phase-change
family.
These Thermal Interface Materials
provide superior long term
reliability performance.
For optimum performance, the pads
must be exposed to temperatures
above 64ºC during operation or by
a burn-in cycle to achieve lowest
thermal impedance and highest
thermal performance.
Features/Benefits
ä Low thermal impedance
ä Proven solution – years of
production use in personal
computer OEM applications
ä Demonstrated reliability through
thermal cycling and accelerated
age testing
ä Can be pre-applied to heat sinks
ä Protective release liner prevents
contamination of material prior
to final component assembly
ä Tabs available for easy removal
of release liner (T710, T725*,
T557, T777, PCO7DM)
* T725 is only offered with a tab
ä Available in custom die-cut
shapes, kiss-cut on rolls
ä RoHS Compliant
Typical Applications
ä
ä
ä
ä
ä
ä
Microprocessors
Graphics Processors
Chipsets
Memory Modules
Power Modules
Power Semiconductors
Handling Information
These products are defined by
Chomerics as “articles” according
to the following generally
recognized regulatory definition for
articles:
An article is a manufactured item
“formed to a specific shape or
design during manufacturing,”
which has “end use functions”
dependent upon its size and shape
during end use and which has
generally “no change of chemical
composition during its end use.”
In addition:
ä There is no known or anticipated
exposure to hazardous
materials/substances during
routine and anticipated use of
the product.
ä The product’s shape, surface,
and design is more relevant than
its chemical composition.
These materials are not deemed by
Chomerics to require an MSDS. For
further questions, please contact
Chomerics at 781-935-4850.
Application
Material may flow when oriented
vertically, especially at higher
temperatures. This does not affect
thermal performance, but should
be considered if appearance is
important.
Clean Up
THERMFLOW material can be
removed with solvens such a
toluene, MEK or isopropyl alcohol.
22
Regulatory
Electrical
Thermal
Physical
12
Shelf Life,
months from date of
shipment
12
Yes
12
Yes
V-0
N/A
1014
-67 to 257
(-55 to 125)
12
Yes
Not Tested
ENGINEERING YOUR SUCCESS.
T558
12
Yes
Not Tested
N/A
Nonconductive** /
Metal Foil*
-67 to 257
(-55 to 125)
0.03 (0.19)
0.13 (0.02)
0.097 (0.013)
Minimum
Bond-line
Thickness
<0.5%
45 / 62***
3.65
0.0045 (0.115)
1 mil
Metal Foil
Gray /
Gray foil
12
Yes
V-0
N/A
Nonconductive**
-67 to 257
(-55 to 125)
0.02 (0.13)
0.015 (0.097)
0.0055 (0.035)
Minimum
Bond-line
Thickness
<0.5%
45 / 62***
1.95
0.0045 (0.115)
None Free film
Gray
T777
Chomerics
Chomerics
Certification
UL 94
ASTM D149
ASTM D257
--
ASTM D5470
--
--
ASTM D3418
ASTM D792
ASTM D374
--
Visual
Test Method
*** The lower phase-transition temperature is for the polymer. The higher value is for the low melting alloy filler.
**The phase-change material is electrically non-conductive. However, as it contains dispersed solder for enhanced thermal properties, it can exhibit through-conductivity at
thinner bond line thickness (approximately <2 mils). It should not be used as an electrical insulator.
12
Yes
Not Tested
N/A
Nonconductive **
1014
Metal Foil*
N/A
-67 to 257
(-55 to 125)
0.02 (0.13)
0.015 (0.097)
0.008 (0.052)
Minimum
Bond-line
Thickness
<0.5%
45 / 62***
2.4
0.005 (0.125)
None Free film
Gray
T557
-67 to 257
(-55 to 125)
0.15 (0.97)
0.09 (0.58)
0.06 (0.39)
Minimum
Bond-line
Thickness
<0.5%
55
2.6
0.0035 (0.088)
0.006 (0.152)
1 mil
Metal Foil
Purple /
Gray foil
T766 / T766-06
*Phase-change material exhibits 1014 ohm-cm volume resistivity. Metal foil is electrically conductive.
Yes
Not Tested
N/A
5
Not Tested
1014
-67 to 257
(-55 to 125)
0.11 (0.71)
0.06 (0.39)
0.04 (0.26)
2.9 mil
Minimum
Bond-line
Thickness @
50°C
0.23 (1.48)
0.16 (1.03)
0.12 (0.77)
<0.5%
55
1.1
0.005 (0.125)
<0.5%
45
1.15
0.0055 (0.138)
1014
-67 to 257
(-55 to 125)
RoHS Compliant
Flammability Rating
Voltage Breakdown (kVac)
Volume Resistivity,
ohm-cm
Operating Temperature
Range, °F (°C)
0.35 (2.2)
0.30 (1.93)
0.28 (1.81)
@ 10 psi (69 kPa)
@ 25 psi (172 kPa)
@ 50 psi (345 kPa)
<0.5%
Weight Loss,
125°C for 48 Hours
Minimum
Bond-line
Thickness
55
Phase Transition
Temperature, °C
Thermal Impedance @
70°C,
°C-in2/W (°C-cm2/W)
1.1
Specific Gravity
0.007 (0.178)
2 mil
Fiberglass
1 mil
polyester
Carrier
Standard Thicknesses,
in (mm)
Pink
Pink
Color
None Free Film
T725
Light gray /
off-white
PC07DM-7
T710 with PSA
Typical Properties
THERMFLOW® Non-Silicone, Phase-Change Thermal Interface Pads
THERMFLOW® Non-Silicone Phase-Change Thermal Interface Pads
23
THERMFLOW® Non Silicone Phase-Change Thermal Interface Pads
TRADITIONAL PHASE CHANGE MATERIALS (PCM)
PC07DM-7
ä Utilizes proven T725 phasechange material
ä Polyester dielectric layer offers
excellent mechanical and
electrical insulation properties
ä Inherently tacky – no adhesive
required
ä Good thermal properties
ä Tabs available for easy removal
T725
ä Excellent thermal performance
ä Inherently tacky – no adhesive
required
ä Ideal for vertical applications
ä Sticky nature limits flowing in
vertical applications
ä Tabs available for easy removal
T766
ä Excellent thermal performance
ä Protective foil eliminates top
liner
ä Inherently tacky – no adhesive
required
ä Sticky nature limits flowing in
vertical applications
ä Also available at 0.006”
POLYMER SOLDER HYBRID MATERIALS (PSH)
T710
ä General use material
ä Good thermal performance
ä Low deflection force required
ä Fiberglass provides dielectric
standoff
ä Only available with adhesive
ä Tabs available for easy removal
T557
ä Superior thermal performance
ä For attachment remove white
release liner first
ä Dispersed solder filler offers
added thermal performance
ä Resin system designed for
higher temperature reliability
ä Inherently tacky – no adhesive
required
ä Tabs available for easy removal
T558
ä Superior thermal performance
ä Conformal foil allows clean
break/rework and eliminates top
liner
ä Dispersed solder filler offers
added thermal performance
ä Resin system designed for
higher temperature reliability
ä Inherently tacky – no adhesive
required
T777
ä Superior thermal performance
ä Ideal solution for mobile
microprocessors
ä Dispersed solder filler offers
added thermal performance
ä Resin system designed for
higher temperature reliability
ä Inherently tacky – no adhesive
required
ä Tabs available for easy removal
Ordering Information
THERMFLOW materials are
supplied in several standard
formats (see part number guide
below).
Custom die-cut shapes can also be
provided on kiss-cut rolls by
Chomerics’ extensive network of
distributor/ fabricators. To ease
release liner removal, an optional
tab can be added.
Part Number:
6W
XX
YYYY
6W
XX
YYYY
4 = Roll stock
6 = Roll stock with PSA
(T710 only)
8 = Roll stock
with release tabs
9 = Custom die-cut part
10 = 100 ft.
40 = 400 ft.
XX = Custom length
YYYY =Roll stock width:
Examples
0100 = 1”
0750 = 7.5”
2400 = 24”
11 = without PSA
12 = with PSA one side
(T710 Only)
Custom Part Number.
Contact Chomerics
Chomerics
Standard tolerances for slitting
widths and individually cut pieces
are ±0.020 inch (±0.51 mm).
ZZZZ
ZZZZ
ZZZZ = Material class
(T710, T725, T766, T557, T558, T777,
PC07DM-7)
24
THERMATTACH® Double-Sided Thermal Tapes
Thermally Conductive Attachment Tapes
Typical Applications
ä Mount heat sinks to components
dissipating < ~25 W
ä Attach heat sinks to PC (esp.
graphics) processors
ä Heat sink attachment to motor
control processors
ä Telecommunication
infrastructure components
Product Attributes
Description
THERMATTACH® double-sided
thermal interface tapes provide
exceptional bonding properties
between electronic components and
heat sinks, eliminating the need for
mechanical fasteners.
THERMATTACH® tapes are proven
to offer excellent reliability when
exposed to thermal, mechanical,
and environmental conditioning.
They are offered in a variety of
configurations, as detailed in the
typical properties table.
T418
ä Superior adhesive strength
ä Best conformability to
components
ä UL94 V-0 rated
ä Good thermal performance
T411
ä Designed for adhesion to plastic
packages
ä Attaches to low surface energy
packages
T404/T414
ä Excellent dielectric strength due
to polyimide carrier
ä Good thermal performance
ä UL94 V-0 rated
T405
ä General use tape with added
thermal conductivity of Al foil
layer
ä Excellent thermal performance
ä UL94 V-0 rated
T412
ä Good adhesion
ä Superior thermal performance
ä General use tape with added
thermal conductivity of Al foil
layer
Features / Benefits
ä Offered in various forms to
provide thermal, dielectric, and
flame retardant properties
ä Offered in custom die-cut
configurations to suit a variety of
applications
ä Eliminates the need for
mechanical attachment (i.e.
screws, clips, rivets, fasteners)
ä Proven reliability under various
mechanical, thermal, and
environmental stresses
ä Embossed version available
ä UL recognized V-0 flammability
ä Meets RoHS specifications
ä No curing required, unlike epoxy
or acrylic preforms or liquid
systems
ä Easily reworkable
ENGINEERING YOUR SUCCESS.
25
Electrical
Mechanical / Adhesion
Regulatory
Chomerics
Thermal
Physical
150 (1,034)
Lap Shear Al-Al @25°C, psi (kPa)
12
Not Tested
Shelf-Life, months from shipment
Outgassing, % TML (% CVCM)
Yes
V-0
Flammability Rating (See UL File E140244)
RoHS Compliant
>50
>10
150 (1,034)
Creep Adhesion, days
77ºF (15ºC)
302ºF (125ºC)
Die Shear Adhesion after
400 psi attachment, kPa (psi)
– 2 hour sample dwell time 77ºF (25ºC)
4.0 (6.9)
1.0 X 102
1.0 X 1013
Volume Resistivity, (ohm-cm)
90° Peel Adhesion to 0.002”
aluminum foil, lbf /in (N/cm)
N/A
5
Voltage Breakdown (kVac)
0.14 (0.00)
12
Yes
Not Tested
>50
>10
135 (931)
1.0 (1.76)
70 (480)
1.4
0.5
Thermal Conductivity W/m-K
0.30 (2.0)
-22 to +257
(-30 to + 125)
-22 (-30)
1.2 (7.7)
-22 to +257
(-30 to + 125)
-4 (-20)
300
± 0.001
(0.025)
± 0.001
(0.025)
300
0.009 (0.23)
0.010 (0.25)
Thermal Impedance
°C-in2 / W (°C-cm2/W) @ 300psi
Operating Temperature
Range, ºF (ºC)
Glass Transition Temperature
Range ºF (ºC)
Adhesive CTE, ppm/ºF
Thickness Tolerance, inch (mm)
Thickness, inch (mm)
Standard
Aluminum Mesh
Optional
Fiberglass
Embossed
Reinforcement Carrier
No
T412
Gray
No
T418
Light Yellow
Color
Recommended for Plastic
Component Attachment
Typical Properties
Thermally Conductive Attachment Tapes
0.56 (0.02)
12
Yes
V-0
>50
>10
130 (897)
1.5 (2.6)
100 (689)
3.0 X 1014
5
0.4
0.6 (3.7)
-22 to +257
(-30 to + 125)
-22 (-30)
300
± 0.001
(0.025)
0.005 (0.127)
Filled Polyimide
Standard
Beige
No
T404 / T414
0.25 (0.01)
12
Yes
V-0
>50
>10
125 (862)
1.5 (2.6)
100 (689)
N/A
N/A
0.5
0.5 (3.4)
-22 to +257
(-30 to + 125)
-22 (-30)
300
± 0.001
(0.025)
0.006 (0.15)
Aluminum
Standard
White
No
T405 / T405-R
Not Tested
12
Yes
Not Tested
>50
>10
110 (759)
2.0 (3.5)
40 (270)
NA
NA
0.5
1.0 (6.5)
-58 to +302
(-50 to +150)
-58 (-50)
400
± 0.001
(0.025)
0.010 (0.25)
Aluminum Mesh
No
Clear / Metallic
Yes
T411
ASTM E595
Chomerics
Chomerics
Certification
UL94
PSTC-7
Chomerics
# 54
ASTM D1000
ASTM D1002
ASTM D257
ASTM D149
ASTM D5470
ASTM D5470
--
ASTM D1356
ASTM D3386
--
ASTM D374
Visual
--
--
--
Method
THERMATTACH® Thermally Conductive Attachment Tapes
26
THERMATTACH® Thermally Conductive Attachment Tapes
Ordering Information
These attachment tapes are available in the following formats.
Contact Chomerics for custom widths, part sizes, etc.
Sheets form, roll form, or die-cut parts. Offered on continuous rolls.
A general ordering information table is included below for reference.
Part Number:
6W
XX
YYYY
W = 0 (Standard Part)
XX = 13 for PSA two sides
YYYY = 4 digit alpha/numeric part number.
Contact Chomerics.
W = 7 (Roll of material)
XX = 10 (100 foot roll)
XX = 40 (400 foot roll)
YYYY = 0600 for 6” wide
YYYY = 1000 for 10” wide
YYYY = 1150 for 11 ½” wide
YYYY = 2400 for 24” wide
(other sizes available. Contact Chomerics)
W = 9 (Custom part)
XX = 13 for PSA two sides
YYYYY = Custom Part Number.
Contact Chomerics
Handling Information
In addition:
These products are defined by
Chomerics as “articles” according
to the following generally
recognized regulatory definition for
articles:
ä There is no known or anticipated
exposure to hazardous
materials/substances during
routine and anticipated use of
the product.
ä The product’s shape, surface,
and design is more relevant than
its chemical composition.
These materials are not deemed by
Chomerics to require an MSDS. For
further questions, please contact
Chomerics at 781-935-4850.
An article is a manufactured item
“formed to a specific shape or
design during manufacturing,”
which has “end use functions”
dependent upon its size and shape
during end use and which has
generally “no change of chemical
composition during its end use.”
ZZZZ
Material Type
ZZZZ =
T405
T405-R
T411
T412
T418
ENGINEERING YOUR SUCCESS.
27
THERMATTACH® Tape
THERMATTACH® Thermally Conductive Attachment Tapes
Tape Application Instructions: T404, T405, T405-R, T411, T412, T413, T414, T418
Materials Needed
ä Clean lint-free cloth rag
ä Industrial solvent
ä Rubber gloves
For optimal performance,
Chomerics recommends interface
flatness of 0.001 in/in (0.025 mm/25
mm) to 0.002 in/in (0.050 mm/25
mm) maximum.
Step 1: Ensure that bonding
surfaces are free from oil, dust, or
any contamination that may affect
bonding. Using rubber gloves, wipe
surfaces with a cloth dampened
with industrial solvents such as
MEK, toluene, acetone or isopropyl
alcohol.
Step 2: Cut tape to size* and
remove a liner or remove pre-cut
tape from roll.
between the heat sink and the
component. The penetration need
not be very deep.
Minimum: 10 psi at room
temperature for 15 seconds
PREFERRED: 30 psi at room
temperature for 5 seconds
contact surfaces. A twisting motion
during assembly of the substrates
will typically improve wetting.
*Note: Due to variations in heat
sink surfaces, Chomerics’ data
indicates that it sometimes
is beneficial to be cut slightly
smaller than the area of the heat
sink. See illustration.
Step 3: Apply to center of heat sink
bonding area and smooth over
entire surface using moderate hand
pressure / rubbing motion. A roller
may be useful to help smooth the
part to the surface by rolling from
the center out to beyond the edges
of the part. This ensures optimal
contact between tape and heat sink.
Note that typically 70% of the
ultimate adhesive bond strength
is achieved with initial application,
and 80-90% is reached within 15
minutes. Ultimate adhesive strength
is achieved within 36 hours;
however the next manufacturing
step can typically occur immediately
following the initial application.
Removal Instructions
Step 4: Center heat sink onto
component and apply using any one
of the recommended temperature/
pressure options:
Materials needed: Single-edged
razor blade or a small, thin-bladed
pocketknife; soft, thin metal
spatula. Use safety precautions
when handling sharp instruments
and organic solvents.
More pressure equals better
wetting out of the adhesive to the
Step 1: Carefully insert the blade
edge into the bond line at a corner
Step 2: Remove the blade and insert
the spatula into the wedge. Slowly
twist the spatula blade so that it
exerts a slight upward pressure.
Step 3: As the two surfaces start
to separate, move the spatula
blade deeper into the bond line and
continue the twisting motion and
upward force.
Step 4: After the two components
are separated, the tape can be
removed and discarded. If adhesive
remains on the component surfaces,
it must be removed. Wipe with a
clean rag (lint-free) dabbed with
MEK, toluene, or isopropyl alcohol.
Use sufficient solvent to remove all
adhesive.
Step 5: Solvent cleaned components
must be verified 100% free
of cleaning solvent prior to
reattachment of adhesive.
Relative Thermal Performance
Thermally Conductive Attachment Tapes
Performance*
Typical Properties
T418
T412
T404 / T414
T405 / T405-R
T411
Ceramic Attachment
5
3
4
4
4
Metal Attachment
5
3
4
4
4
Plastic Attachment
N/R
N/R
Dielectric Performance
Thermal Performance
3
2
N/R
N/R
N/R
5
5
3
5
N/R
N/R
4
2
* Performance rated on a scale of 1-5, 5 being the best. N/R = Not Recommended.
Chomerics
28
THERM-A-FORM™ T64x and 164x Series
Cure-in-Place Potting and Underfill Materials
Description
THERM-A-FORM™ thermally
conductive silicone elastomer
products are dispensable formin-place compounds designed for
heat transfer without excessive
compressive force in electronics
cooling applications. These versatile
liquid reactive materials can be
dispensed and then cured into
complex geometries for cooling of
multi-height components on a PCB
without the expense of a molded
sheet. Each compound is available
in ready-to-use cartridge systems,
eliminating weighing, mixing, and
degassing procedures.
THERM-A-FORM™ Cure-in-Place Potting and Underfill Materials
Typical Properties
Physical
Thermal
T644
T642
1642
1641
Test Method
Gray
Yellow
Pink
Blue
Purple
White
Visual
Binder
Silicone
Silicone
Silicone
Silicone
Silicone
Silicone
--
Aluminum
Oxide
Aluminum
Oxide
Boron
Nitride
Boron
Nitride
Aluminum
Oxide
Aluminum
Oxide
--
Number of Components
Electrical
T646
Color
Filler
2-part
2-part
2-part
2-part
2-part
1-part
--
Mix Ratio
1:1
1:1
1:1
10 : 1
100 : 3
N/A
--
Specific Gravity
2.80
2.45
1.45
1.50
2.30
2.10
ASTM D792
25
50
15
70
76
56
ASTM D2240
> 5000
> 5000
3000
2500
2500
3000
ASTM D2196
Hardness, Shore A
Viscosity, poise
300
300
360
60
60
30
Time to 2X Starting
Viscosity at 23 ºC
Cure Cycles
3 min.
@ 150 ºC
60 min.
@ 60 ºC
48 hrs.
@ 23 ºC
3 min.
@ 150 ºC
60 min.
@ 60 ºC
48 hrs.
@ 23 ºC
3 min.
@ 150 ºC
60 min.
@ 60 ºC
72 hrs.
@ 23 ºC
3 min.
@ 150 ºC
30 min.
@ 70 ºC
48 hrs.
@ 23 ºC
60 min.
@ 100 ºC
4 hrs.
@ 65 ºC
1 week
@ 23 ºC
48 hrs. @
23 ºC
@ 50% RH
Chomerics
Brittle Point, ºF (ºC)
-67 (-55)
-67 (-55)
-67 (-55)
-67 (-55)
-103 (-75)
-103 (-75)
ASTM D2137
Extractable Silicone, %
4
8.5
15
1-2
Not Tested
Not Tested
Chomerics
Thermal Conductivity,
W/m-K
3.00
0.90
1.20
1.20
0.95
0.90
ASTM D5470
Heat Capacity, J/g-K
0.9
1.0
1.0
1.0
1.0
1.0
ASTM E1269
Coefficient of Thermal
Expansion, ppm/K
150
250
300
300
200
150
ASTM E831
Operating Temperature
Range, °F (°C)
-58 to 302
(-50 to 150)
-58 to 302
(-50 to 150)
-58 to 302
(-50 to 150)
-58 to 302
(-50 to 150)
-94 to 392
(-70 to 200)
-94 to 392
(-70 to 200)
--
Dielectric Strength,
KVac/mm (Vac / mil)
10 (250)
10 (250)
20 (500)
20 (500)
20 (500)
20 (500)
ASTM D149
Volume Resistivity,
ohm-cm
1.0 x 1014
1.0 x 1014
1.0 x 1013
1.0 x 1013
1.0 x 1013
1.0 x 1013
ASTM D257
Dielectric Constant
@1,000 kHz
8
6.5
4.0
4.0
3.9
3.9
ASTM D150
Dissipation Factor
@ 1,000 kHz
0.010
0.013
0.001
0.001
0.010
0.010
Chomerics
VO
Not Tested
HB
Not Tested
Not Tested
Not Tested
Not Tested
UL 94
Yes
Yes
Yes
Yes
Yes
Yes
Chomerics
Certification
Not Tested
0.17 (0.10)
0.39 (0.29)
0.32 (0.21)
0.40 (0.18)
Not Tested
ASTM E595
3
3
3
3
12
6
Chomerics
Pot Life, minutes
Flammability Rating
(See UL File E140244)
Regulatory
T647
RoHS Compliant
Outgassing, % TML
(%CVCM)
Shelf Life, months from
date of manufacture
ENGINEERING YOUR SUCCESS.
29
THERM-A-FORM™ T64x and 164x Series
Features / Benefits
ä Dispensable form-in-place gap
filling, potting, sealing, and
encapsulating
ä Excellent blend of high thermal
conductivity, flexibility, and ease
of use
ä Conformable to irregular shapes
without excessive force on
components
ä Ready-to-use cartridge system
eliminates weighing, mixing, and
de-gassing steps
ä Variety of kit sizes and
configurations available to suit
any application (handheld
twin-barrel cartridges,
Semco® tubes, and pneumatic
applicators)
ä Vibration damping
Product Attributes
1641
ä One-component moisture-cure
RTV, supplied with primer 1086
(primer is not required for cure
but promotes adhesion)
ä Non-acetic acid generating
1642
ä General duty, economical
thermal solution
ä Two-component thermally
conductive encapsulant/sealant/
caulk/potting compound,
supplied with primer 1087.
(primer is not required for cure
but promotes adhesion)
T642
ä High thermal performance with
flexibility
ä Ideal for underfilling
ä Low outgassing
T644
ä Very low modulus material for
transferring heat from fragile
electronic components
T646
ä Provides combination of high
thermal performance and low
cost
Application Instructions
35cc and 45cc Kits (See Figure 1)
Push safety latch (A) upward.
Insert the pushrod (B) into the
applicator with the pushrod gear
teeth facing downward. Insert the
cartridge (C) into the slots on top
of the applicator. Push the retainer
clamp (D) down firmly to lock the
cartridge in place. Remove the
cartridge cap (E) with a 1/4 turn
counter-clockwise. Attach the static
mixer (F) to the cartridge. (For the
10:1 cartridge, make certain that
the small notch on the mixer tube
face is toward the large barrel
containing Part A.) Turn the mixer
tube 1/4 turn clockwise to lock it
in place. Cut the tip of the mixing
nozzle to obtain the desired bead
size, or attach a needle with the
Luer adapter. After use, discard the
static mixer and replace the cap on
any remaining material.
T647
ä Superior thermal performance
while maintaining low modulus
ä Flows into complex geometries
to maintain intimate contact with
components
Ordering Information
Product
Part Number
Figure 1: Typical Applicator
®
Mixpac Dispensing Systems are available from
multiple sources. When contacting Mixpac®
equipment suppliers, reference cartridge volume
(cc) and dual element cartridge A:B mix ratio.
Refer to table for volume and mix ratio
information.
MIXPAC is a trademark of ConProTec, Inc.
SEMCO is a trademark of Bergdahl Associates, Inc.
Chomerics
Description
65-00-1641-0000
2.5 fluid
ounces
(70 grams)
1-Component squeeze tube
65-01-1641-0000
12 fluid
ounces
(340 grams)
1-Component
SEMCO® cartridge
65-00-1642-0000
277 grams
(approx 120
cc)
1-Pint Plastic jar A / vial of B
65-00-T642-0035
35 cc
(53 grams)
65-00-T642-0250
250 cc
(372 grams)
65-00-T644-0045
45 cc
(68 grams)
65-00-T644-0200
200 cc
(300 grams)
65-00-T646-0045
45 cc
(115 grams)
65-00-T646-0200
200 cc
(507 grams)
65-00-T647-0045
45 cc
(125 grams)
65-00-T647-0200
200 cc
(560 grams)
1641
1642
Volume
(mass)
T642
T644
T646
T647
10:1 Dual element Cartridge
1:1 Dual element Cartridge
30
THERMAL GREASES
High-Performance and General Duty Thermal Greases
The excellent surface wetting
results in low interfacial resistance.
Description
Chomerics thermal greases offer a
range of performance covering the
simplest to the most demanding
thermal requirements. These
materials are screened, stenciled or
dispensed and require virtually no
compressive force to conform under
typical assembly pressures.
ä T670 is offered with a very high
bulk thermal conductivity of
3 W/m-K. Product offers low
impedance as it will achieve a
thin bondline of about 0.001 in.
ä T660 contains solder fillers
for extremely low thermal
impedance at thinner bondline
thicknesses (down to about
0.001in.).
ä T650 is a general duty grease for
typical applications.
Features/Benefits
ä Silicone based materials conduct
heat between a hot component
and a heat sink or enclosure
ä Fills interface variable
tolerances in electronics
assemblies and heat sink
applications
ä Dispensable, highly conformable
materials require no cure cycle,
mixing or refrigeration
ä Thermally stable and require
virtually no compressive force to
deform under typical assembly
pressures
ä Supports high power
applications requiring material
with minimum bond line
thickness and high conductivity
ä Ideal for rework and field repair
situations
Thermal Greases
Typical Properties
Color
Physical
Specific Gravity
Thermal
Electrical
T660
T670
Test Method
Light Gray
White
Visual
2.3
2.4
2.6
ASTM D792
190,000
170,000
350,000
NA
Operating Temperature Range, ºF (ºC)
-58 to 392
(-50 to +200)
-58 to 392
(-50 to +200)
-58 to 392
(-50 to +200)
NA
Phase Transition Temperature, °F (°C)
N/A
144 (62)
N/A
ASTM D3418
Weight Loss % @150°C, 48 Hours
0.21
0.17
< 0.2
TGA
Viscosity, cps
Thermal Conductivity, W/m-K
Thermal Impedance,°C-in2/W (°C-cm2/W) @ 100 psi
Heat Capacity, J/g-K
0.8
0.9
3.0
ASTM D5470
0.02 (0.13) @ 50°C
0.02 (0.13) @ 65°C
0.02 (0.13) @ 50°C
0.009 (0.06) @ 65°C
0.01 (0.07) @ 50°C
0.01 (0.07) @ 65°C
ASTM D5470
1
1
1
ASTM E1269
Coefficient of Thermal Expansion, ppm/K
300
300
150
ASTM E831
Volume Resistivity, ohm-cm
1014
N/A
1014
ASTM D257
Voltage Breakdown Vac/mil
150*
N/A*
150*
ASTM D149
Not Tested
Not Tested
Not Tested
UL 94
RoHS Compliant
Yes
Yes
Yes
Chomerics
Certification
Outgassing, % TML
0.21
0.17
<0.2
ASTM E595
24
24
24
Chomerics
Flammability Rating
Regulatory
T650
Pale Blue
Shelf Life, months from date of manufacture
*Not recommended for dielectric applications.
ENGINEERING YOUR SUCCESS.
31
Thermal Greases
Typical Applications
Material Application
ä Mobile, desktop, server CPUs
ä Engine and transmission control
modules
ä Memory modules
ä Power conversion equipment
ä Power supplies and UPS
ä Power semiconductors
T650
Material is supplied in 3, 15 or 30cc
syringes for easy dispensing onto
components or heat sinks. Bulk
packaging is also available. Excess
material can be wiped with a clean
cloth and suitable solvent.
Product Attributes
T660
Packaging the same as T650.
For optimum performance, the
processor should be allowed to
reach temperatures greater than
65ºC (149°F). This causes the
solder fillers to melt and conform
to the mating surfaces, obtaining a
minimum bondline thickness at the
interface. This process only needs to
occur one time to achieve optimum
thermal performance of the grease.
T670 Highest Thermal
Performance
ä High bulk thermal conductivity
ä Extremely low thermal
impedance at thin and thick
bondline thicknesses
ä Stencil screen printed part
application
T660 High Performance
ä Dispersed solder spheres
for high performance
applications above 62°C
ä Excellent thin bondline
performance (less than
0.002 - 0.003 in)
T670
T670 high performance thermal
grease is supplied in easy access
metal cans or pails. Mix with a
spatula and remove the desired
amount onto the component or
stencil screen. Stencil desired
pad part size onto heat sink for
immediate assembly or shipping.
T650 General Duty
ä Used on general purpose
applications
Ordering Information
Part Number Examples
65-00-T650-0003 = T650 Material in a 3 cc Syringe
65-00-T670-3790 = T670 Material in a 3790 cc (Gallon Pail)
Part Number:
65
00
YYYY
YYYY = Material
(T670, T660 , or T650)
Chomerics
ZZZZ
ZZZZ = Volume in cc
0003 = 3 cc syringe
0015 = 15 cc syringe
0030 = 30 cc syringe
0300 = 300 cc cartridge
3790 = 1 gallon pail
32
CHO-THERM®
Commercial Grade Thermally Conductive Electrical Insulator Pads
Description
Features / Benefits
CHO-THERM®Commercial Grade
Thermal Insulator Pads are
designed for use where solid
thermal and electrical properties
are required at an economical
price. These products are
offered as dry pads, or with an
optional adhesive (PSA) layer for
attachment. Materials with PSA
are available die-cut on continuous
rolls. Versions are offered with
either polyimide or fiberglass
reinforcement to protect pads
against tear, cut-through and
punctures.
ä Good thermal properties
ä Good to excellent dielectric
strength
ä Excellent mechanical strength
and puncture resistance
ä Available with and without
acrylic PSA
ä UL recognized V-0 flammability
rating
ä Meet RoHS specifications
ä Available on continuous
rolls for easy peel and stick
application
CHO-THERM® Commercial Grade Thermal Insulator Pads
Physical
Properties
Thermal
Electrical
Mechanical
T444
1674
T441
Method
Color
Lt. Green
Beige
Blue
Pink
Visual
Reinforcement Carrier
Fiberglass
Kapton® MT
Fiberglass
Fiberglass
Visual
Thickness, inch (mm)
0.010 (0.25)
0.003 (0.08)
0.010 (0.25)
0.008 (0.20)
0.013 (0.33)
0.018 (0.46)
ASTM D374
Thickness Tolerance,
inch (mm)
0.001
(± 0.025 )
0.0005
(± 0.013)
0.001
(± 0.025)
0.001
(± 0.025)
0.001
(± 0.025)
0.001
(± 0.025)
--
-40 to +392
(-40 to +200)
-40 to +392
(-40 to +200)
-40 to +392
(-40 to +200)
-40 to +392
(-40 to +200)
-40 to +392
(-40 to +200)
-40 to +392
(-40 to +200)
--
0.33 (2.1)
0.37 (2.4)
0.41 (2.6)
0.41 (2.6)
0.56 (3.6)
0.64 (4.1)
ASTM D5470
Operating Temperature Range,
ºF (ºC)
Regulatory
T609
Thermal Impedance,
°C-in2/W (°C-cm2 / W)
@ 300 psi*
Thermal Conductivity, W/m-K
1.5
0.4
1.0
1.1
1.1
1.1
ASTM D5470
Heat Capacity, J/g-°C
1.0
1.0
1.0
1.0
1.0
1.0
ASTM E1296
Coefficient of Thermal
Expansion, ppm/°C
150
400
300
300
300
300
ASTM E831
Voltage Breakdown Dry, Vac
4,000
5,000
2,500
8,700
11,400
13,800
ASTM D149
Voltage Breakdown Wet, Vac
Not Tested
Not Tested
Not Tested
8,100
10,500
12,900
ASTM D149
1014
1014
1014
1014
1014
1014
ASTM D257
14
14
1014
ASTM D257
Volume Resistivity Dry, ohm-cm
Volume Resistivity Wet, ohm-cm
Not Tested
Not Tested
Not Tested
Tensile Strength, psi (Mpa)
3,900 (26.9)
3,000 (20.7)
1,500 (10.3)
2,800 (19.3)
2,500 (17.3)
2,000 (13.8)
ASTM D412
Tear Strength, lb/in (kN/m)
300 (52.5)
150 (26.3)
100 (17.5)
135 (23.6)
110 (19.3)
70 (12.25)
ASTM D642
Elongation, %
30
NA
2
40
40
40
ASTM D412
Hardness, Shore A
70
90
85
80
80
80
ASTM D2240
Specific Gravity
2.10
1.70
2.45
2.45
2.45
2.45
ASTM D792
Flammability Rating
(See UL File E140244)
V-0
V-0
V-0
V-0
V-0
V-0
UL94
RoHS Compliant
Yes
Yes
Yes
Yes
Yes
Yes
Chomerics
Certification
Not Tested
Not Tested
0.45 (0.20)
Not Tested
Not Tested
Not Tested
ASTM E595
24 (6)
12 (12)
24 (12)
24 (12)
24 (12)
24 (12)
Chomerics
Outgassing, % TML (%CVCM)
Shelf-Life,
months from shipment,
Dry Pad (with PSA)
10
10
KAPTON is a trademark of E.I. DuPont de Nemours and Company.
*Tested without PSA. PSA typically adds 0.05 °C-in2/W (0.30 °C-cm2/W)
ENGINEERING YOUR SUCCESS.
33
CHO-THERM® Commercial Grade Thermal Insulator Pads
1674
ä Original commercial grade pad
with good thermal and electrical
performance
ä Available in economical kiss-cut
format on continuous rolls (with
and without PSA)
ä Passes NASA outgassing
Typical Applications
ä
ä
ä
ä
ä
ä
Power conversion equipment
Power supplies and UPS
Power semiconductors
Automotive electronics
Motor and engine controllers
Televisions and consumer
electronics
T444
ä Non-silicone with excellent
dielectric and mechanical
strength (polyimide interlayer)
ä Strong acrylic adhesive
(one side)
ä Available in economical kiss-cut
format on continuous rolls
Product Attributes
T609
ä Good thermal and dielectric
properties
ä Economically priced
ä Best value for moderate to high
performance pad
ä PSA version available in
economical kiss-cut format on
continuous rolls
T441
ä Superior dielectric strength
(wet and dry)
ä Economically priced
ä Excellent for outdoor,
high-humidity power supplies
ä PSA version available in
economical kiss-cut format
on continuous rolls
Handling Information
These products are defined by
Chomerics as “articles” according
to the following generally
recognized regulatory definition for
articles:
An article is a manufactured item
“formed to a specific shape or
design during manufacturing,”
which has “end use functions”
dependent upon its size and shape
during end use and which has
generally “no change of chemical
composition during its end use.”
In addition:
ä There is no known or anticipated
exposure to hazardous
materials/substances during
routine and anticipated use of
the product.
ä The product’s shape, surface,
and design is more relevant than
its chemical composition.
These materials are not deemed by
Chomerics to require an MSDS. For
further questions, please contact
Chomerics at 781-935-4850.
Ordering Information
Thermal insulator pads are available in the following formats.
Contact Chomerics for custom widths, part sizes, etc.
Die-cut parts on continuous rolls
Slit rolls from ½” wide to 24” wide
Custom die-cut parts on sheets, or as individual parts
Part Number:
6W
6W
W=O
Standard die-cut Part
XX
YYYY
ZZZZ
XX
YYYY
ZZZZ
11 = without PSA
12 = with PSA one side
YYYY = For standard die-cut parts,
please see tables on pages 37 to 39
0075=
0100=
0150=
0200=
W=4
Roll Stock
10= 100 ft Roll Stock
40 = 400 ft Roll Stock
W=6
Roll Stock with PSA
W=9
Custom die-cut part
11 = without PSA
12 = with PSA one side
0.75 in
1.00 in
1.50 in
2.00 in
1150 = 11.5 in.
2400 = 24 in. (T444*)
0800 = 8 in.
1600 = 16 in. (1674*)
1100 = 11 in.
2200 = 22 in. (7441*)
ZZZZ = Material class
(1674, T441, T444, T609)
YYYYY = Custom Part Number.
Contact Chomerics
* Standard bulk roll width
Chomerics
34
CHO-THERM®
High Power Thermally Conductive Electrical Insulator Pads
designed for use where the
highest possible thermal, dielectric,
and mechanical properties are
required.
Fiberglass cloth reinforcement
strengthens CHO-THERM® pads
against tear, cut-through and
punctures.
Description
CHO-THERM® HIGH-POWER
THERMAL INSULATOR PADS are
thermally conductive materials
These materials are available
in sheet form and die-cut
configurations. An optional acrylic
adhesive layer (with PSA) is
available on one or two sides. With
a proven track record spanning
several decades in multiple
applications, these products are
the first choice for high-end power
supplies, industrial, aerospace, and
military/avionics applications.
Available in several different forms
to suit various applications.
Features / Benefits
ä Excellent thermal properties
ä High dielectric strength
ä Excellent mechanical strength
and puncture resistance
CHO-THERM® High Power Insulator Pads
Typical Properties
Thermal
Physical
Color
Electrical
Mechanical
1678
1671
Method
Green
Pink
White
Visual
Reinforcement Carrier
Fiberglass
Fiberglass
Fiberglass
--
Thickness, inch (mm)
0.010 (0.25)
0.010 (0.25)
0.015 (0.38)*
ASTM D374
Thickness Tolerance, inch (mm)
± 0.002
(0.050)
± 0.002
(0.050)
± 0.002
(0.050)
--
Operating Temperature Range,
ºF (ºC)
-40 to +392
(-40 to +200)
-40 to +392
(-40 to +200)
-40 to +392
(-40 to +200)
--
0.19 (1.2)
0.20 (1.26)
0.23 (1.48)
ASTM D5470
Thermal Conductivity, W/m-K
2.1
2.0
2.6
ASTM D5470
Heat Capacity (J/g-°C)
1.0
1.0
1.0
ASTM E1269
Thermal Impedance,
°C-in2/W (°C-cm2 / W) @ 300 psi**
Coefficient of Thermal Expansion (ppm/K)
Regulatory
T500
250
250
250
ASTM E831
4,000
2,500
4,000
ASTM D149
Volume Resistivity Dry, (ohm-cm)
1016
1016
1016
ASTM D149
Dielectric Constant at 1,000 kHz
3.5
3.6
3.6
ASTM D150
Dissipation Factor at 1,000 kHz
0.003
0.007
0.007
Chomerics Test
Tensile Strength, psi (Mpa)
3,000
(20.7)
3,000
(20.7)
3,000
(20.7)
Chomerics
Tear Strength, lb/in (kN/m)
400 (70)
200 (35)
400 (70)
Chomerics
Elongation, %
20
20
15
Chomerics
Hardness, Shore A
80
80
80
ASTM D2240
Voltage Breakdown Dry, (Vac)
Specific Gravity
1.60
1.55
1.55
ASTM D792
Flammability Rating
(See UL File E140244)
V-0
V-0
HB
UL 94
RoHS Compliant
Yes
Yes
Yes
Chomerics
Certification
0.40 (0.10)
0.55 (0.12)
0.76 (0.07)
ASTM E595
24 (18)
24 (18)
24 (18)
Chomerics
Outgassing, % TML (%CVCM)
Shelf-Life,
months from shipment, Dry Pad (with PSA)
* 1671 material is available in custom thicknesses.
** Tested without PSA. PSA typically adds 0.05 °C-in2/W (0.30 °C-cm2/W)
ENGINEERING YOUR SUCCESS.
35
CHO-THERM® High Power Thermal Insulator Pads
Features/Benefits...cont.
Typical Applications
Handling Information
ä 100% inspected for dielectric
properties on every sheet
ä Acrylic PSA attachment option
available
ä UL recognized flammability
ratings
ä Meets RoHS specifications
ä Extremely low NASA outgassing
ä Proven through decades of use
in demanding military and
aerospace applications
ä
ä
ä
ä
ä
ä
These products are defined by
Chomerics as “articles” according
to the following generally
recognized regulatory definition for
articles:
Power conversion equipment
Power supplies and UPS
Power semiconductors
Automotive electronics
Motor and engine controllers
Televisions and consumer
electronics
An article is a manufactured item
“formed to a specific shape or
design during manufacturing,”
which has “end use functions”
dependent upon its size and shape
during end use and which has
generally “no change of chemical
composition during its end use.”
Product Attributes
T500
ä Best thermal performance
ä Excellent dielectric properties
1671
ä Highest reliability in rigorous
applications
ä Proven in aerospace/defense
applications
In addition:
ä There is no known or anticipated
exposure to hazardous
materials/substances during
routine and anticipated use of
the product.
ä The product’s shape, surface,
and design is more relevant than
its chemical composition.
These materials are not deemed by
Chomerics to require an MSDS. For
further questions, please contact
Chomerics at 781-935-4850..
1678
ä Economically-priced
ä Low thermal impedance
Ordering Information
Thermal insulator pads are available in the following formats.
Contact Chomerics for custom widths, part sizes, etc.
Sheets 8” X 10” or 17” X 21”
Custom die-cut parts on sheets, or as individual parts
Part Number:
6W
XX
YYYY
ZZZZ
W
XX
YYYY
ZZZZ
W=0
Standard die-cut part
11 = without PSA
12 = with PSA one side
13 = PSA 2 Sides
YYYY = Custom 4- part alpha/numeric
part number. See pages 37 to 39 or
contact Chomerics.
W=1
Sheet stock
W=2
Sheet stock with PSA 1 Side
W=3
Sheet stock with PSA 2 Sides
XX = material thickness in
mils (1671 material available
up to 60 mils)
0808 = 8” X 8” Sheet
0810 = 8” X 10” Sheet
ZZZZ = Material class
(T500, 1671, or 1678)
11 = without PSA
W=9
Custom die-cut part
12 = with PSA one side
YYYYY = Custom Part Number.
Contact Chomerics
13 = with PSA both sides
Chomerics
36
How to Order Die-Cut CHO-THERM® Insulators
Thermattach Tapes & Reinforced Therm-A-Flow Products
Standard die-cut parts are ordered using the following part number system. For custom parts, contact Chomerics.
Part Number:
60
60 = standard die cut part
Recommended
Screw Torque
XX
YYYY
ZZZZ
6WDQGDUG&RQ¿JXUDWLRQ
'UDZLQJ1XPEHU
11 = No PSA
12 = PSA one side
13 = PSA both sides
CHO-THERM® Material
Example: 1671, T500, etc.
Dimensions (inches)
Configuration
E
F
G
Ordering Number
A
B
C
D
#4-40 5 in-lb
#6-32 6 in-lb
1.563
1.563
1.593
1.650
1.650
1.650
1.650
1.650
1.650
1.700
1.730
1.780
1.780
1.780
2.07
1.050
1.050
1.100
1.065
1.140
1.140
1.140
1.140
1.140
1.187
1.250
1.250
1.250
1.250
1.56
0.140
0.140
0.156
0.140
0.122
0.140
0.165
0.140
0.165
0.156
0.156
0.140
0.165
0.140
0.122
0.080
0.140
0.070
0.046
0.062
0.093
0.062
0.046
0.062
0.062
0.093
0.094
0.046
0.062
#4-40 5 in-lb
#6-32 6 in-lb
1.65
1.140
0.140
0.093
1.187
#4-40 5 in-lb
#6-32 6 in-lb
1.560
1.563
1.050
1.050
0.158
0.156
0.080
0.063
1.170
1.187
#4-40 5 in-lb
#6-32 6 in-lb
1.650
1.187
0.156
0.60
WW-XX-D382-ZZZZ
#4-40 5 in-lb
#6-32 6 in-lb
1.650
1.140
0.165
0.040
WW-XX-D383-ZZZZ
WW-XX-D065-ZZZZ
WW-XX-4305-ZZZZ
WW-XX-4511-ZZZZ
WW-XX-D370-ZZZZ
WW-XX-D371-ZZZZ
WW-XX-6875-ZZZZ
WW-XX-D372-ZZZZ
WW-XX-D373-ZZZZ
WW-XX-D374-ZZZZ
WW-XX-4996-ZZZZ
WW-XX-5442-ZZZZ
WW-XX-D375-ZZZZ
WW-XX-D376-ZZZZ
WW-XX-D377-ZZZZ
WW-XX-D378-ZZZZ
0.430
WW-XX-D379-ZZZZ
WW-XX-D380-ZZZZ
WW-XX-D381-ZZZZ
ENGINEERING YOUR SUCCESS.
37
Recommended
Screw Torque
Configuration
Dimensions (inches)
A
B
C
D
#4-40 3 in-lb
#6-32 4 in-lb
1.250
1.312
1.375
1.440
0.700
0.762
0.825
1.000
0.140
0.140
0.140
0.140
0.062
0.062
0.062
0.075
#4-40 3 in-lb
#6-32 4 in-lb
1.275
0.750
0.156
0.100
0.960
#4-40 3 in-lb
#6-32 4 in-lb
1.312
0.762
0.140
0.062
0.960
0.200
0.100
WW-XX-D386-ZZZZ
#4-40 3 in-lb
#6-32 4 in-lb
1.440
1.000
0.140
0.055
0.960
0.480
0.325
WW-XX-D387-ZZZZ
#4-40 3 in-lb
#6-32 4 in-lb
1.35
0.800
0.140
0.400
WW-XX-D388-ZZZZ
#4-40 2 in-lb
0.437
0.437
0.500
0.610
0.687
0.710
0.750
0.750
0.750
0.750
0.750
0.750
0.855
0.855
0.860
1.125
1.410
0.312
0.312
0.385
0.560
0.562
0.500
0.410
0.500
0.500
0.500
0.600
0.600
0.562
0.630
0.740
0.625
0.810
0.140
0.140
0.170
0.245
0.218
0.160
0.225
--0.187
0.187
0.240
0.240
0.218
0.230
0.200
0.200
0.355
0.093
0.122
0.120
0.125
0.125
0.141
0.156
--0.147
0.125
0.150
0.115
0.125
0.093
0.160
0.145
0.147
WW-XX-D389-ZZZZ
WW-XX-D390-ZZZZ
WW-XX-D391-ZZZZ
WW-XX-D392-ZZZZ
WW-XX-5791-ZZZZ
WW-XX-8302-ZZZZ
WW-XX-D393-ZZZZ
WW-XX-8531-ZZZZ
WW-XX-6956-ZZZZ
WW-XX-D394-ZZZZ
WW-XX-D395-ZZZZ
WW-XX-D396-ZZZZ
WW-XX-D397-ZZZZ
WW-XX-D398-ZZZZ
WW-XX-D399-ZZZZ
WW-XX-D400-ZZZZ
WW-XX-D401-ZZZZ
#4-40 2 in-lb
0.910
0.983
0.500
0.750
0.200
0.432
0.125
0.156
Chomerics
E
Ordering Number
F
G
WW-XX-4353-ZZZZ
WW-XX-5527-ZZZZ
WW-XX-4997-ZZZZ
WW-XX-D384-ZZZZ
0.580
0.665
WW-XX-D385-ZZZZ
0.046
0.101
0.265
0.217
WW-XX-402-ZZZZ
WW-XX-D403-ZZZZ
38
Recommended
Screw Torque
Configuration
A
Ordering Number
B
C
D
E
1.00
0.500
0.200
0.141
0.626
0.360
0.510
0.510
0.512
0.625
0.260
0.140
0.200
0.161
0.195
WW-XX-D404-ZZZZ
WW-XX-D405-ZZZZ
WW-XX-D406-ZZZZ
WW-XX-D407-ZZZZ
WW-XX-4659-ZZZZ
0.750
0.800
0.800
0.812
0.812
0.875
1.000
1.000
1.180
1.250
1.500
1.500
0.125
0.190
0.260
0.115
0.145
0.313
0.140
0.255
0.515
0.380
0.200
0.500
WW-XX-D408-ZZZZ
WW-XX-D409-ZZZZ
WW-XX-D410-ZZZZ
WW-XX-D411-ZZZZ
WW-XX-D412-ZZZZ
WW-XX-D413-ZZZZ
WW-XX-D414-ZZZZ
WW-XX-4661-ZZZZ
WW-XX-D415-ZZZZ
WW-XX-D416-ZZZZ
WW-XX-D417-ZZZZ
WW-XX-D418-ZZZZ
TO-36
1.063
0.690
0.200
WW-XX-4306-ZZZZ
TO-5 and TO-18
3 holes
0.250
0360
0.390
0.100
0.200
0.200
0.036
0.040
0.040
WW-XX-D419-ZZZZ
WW-XX-4374-ZZZZ
WW-XX-D420-ZZZZ
0.250
0.360
0.390
0.100
0.200
0.200
0.036
0.040
0.040
WW-XX-D421-ZZZZ
WW-XX-D422-ZZZZ
WW-XX-D423-ZZZZ
WW-XX-D424-ZZZZ
WW-XX-D425-ZZZZ
WW-XX-D426-ZZZZ
#4-40 2 in-lb
#10-32 2 in-lb
#25-28 7 in-lb
Dimensions (inches)
DIODE WASHERS
DO-4
DO-5
4 holes
#4-40 2 in-lb
RECTIFIER
1.000
1.125
1.250
1.000
1.125
1.250
0.187
0.140
0.200
#4-40 2 in-lb
TIP
PACKAGE
0.865
0.865
0.984
0.984
1.260
0.650
0.650
0.787
0.787
0.787
0.650
0.650
--0.780
0.984
0.140
0.140
--0.142
0.142
F
G
WW-XX-4969-ZZZZ
WW-XX-5792-ZZZZ
WW-XX-D427-ZZZZ
WW-XX-D428-ZZZZ
WW-XX-D429-ZZZZ
WW-XX-D430-ZZZZ
(1 in-lb = 1.152 kg-cm)
ENGINEERING YOUR SUCCESS.
39
T-WING® and C-WING™ Heat Spreaders
Thin Heat Spreaders
to the component. The compliant
nature of these “thermal wing” heat
spreaders permits nearly 100%
adhesive contact with non-flat
package surfaces, optimizing
thermal and mechanical
performance.
Description
Chomerics’ family of thin heat
spreaders provides a low-cost,
effective means of cooling IC
devices in restricted spaces
where conventional heat sinks are
inappropriate.
T-Wing spreaders consist of 5oz.
(0.007inch/0.18mm thick) flexible
copper foil between electrically
insulating films. High strength
silicone PSA (pressure-sensitive
adhesive) provides a strong bond
C-Wing spreaders are a ceramic
version available for EMI-sensitive
applications. They consist of
aluminum oxide substrates with the
same silicone PSA used on T-Wing
heat spreaders.
Features/Benefits
ä Component junction
temperature reduction of
10-20°C is common
ä Easily added to existing
designs to lower component
temperatures and improve
reliability
ä Custom shapes available for
complex designs
Typical Applications
ä Microprocessors
ä Memory modules
ä Laptop PCs and other high
density, handheld portable
electronics
ä High speed disk drives
C-Wing
ä Used where localized sensitivity
to EMI (electromagnetic
interference) exists
ä Low profile
ä Peel and stick application
T- Wings
ä Low profile (0.33mm/0.013in)
allows use in limited space
environments
ä Easy peel and stick adhesion to
all surfaces, including packages
with residual silicone mold
release
ä Offers low cost cooling for many
package types
T-WING® and C-WING™ Heat Spreaders
Typical Properties
Color
Total Thicknesses, inches (mm)
Physical
PSA Type
PSA thickness, inches (mm)
Insulator Type
Insulator Layer Thickness, inches (mm)
Weight, oz/inch
2
Themal Conductor
Maximum Operating Temperature °F (°C)
Regulatory
Electrical
Thermal Conductor Thickness, inches (mm)
Dielectric Strength,
Vac/mil (KVac/mm)
T-Wings
C-Wings
Test Method
Black
Tan
Visual
0.013 (0.33)
0.060 (1.53)
ASTM D374
Silicone based
Silicone based
--
0.002 (0.05)
0.003 (0.076)
Visual
Black polyester
N/A
--
0.001 (0.025)
N/A
--
0.039
0.076
--
Copper
Aluminum Oxide
--
257 (125)
257 (125)
--
0.007 (0.178)
0.063 (1.6)
--
300 (12)
ASTM D149
5,000 (200)
for each dielectric layer
Volume Resistivity, (ohm-cm)
N/A
>1014
ASTM D149
Dielectric Constant @1,000 MHz
N/A
9.1
ASTM D150
Dissipation Factor @ 1,000 kHz
N/A
0.001
Chomerics Test
Flammability Rating (See UL File E140244)
V-0
Not Tested
UL 94
RoHS Compliant
Yes
Yes
Chomerics
Certification
Shelf Life, months from date of manufacture
12
12
Chomerics
Chomerics
40
T-Wing® and C-WingTM Heat Spreaders
T-Wings Continued...
ä Low application force
(<5psi/ 0.03MPa) minimizes risk
of damage to component
ä Available in a range of standard
sizes
ä Pliable nature allows
conformance to concave or
otherwise non-flat surfaces for
optimal thermal and mechanical
performance
ä Light weight (0.039 oz/inch2)
ä Standard parts are scored for
easy forming and alignment
ä Easy removal for device
replacement
ä Available die-cut on continuous
rolls
Standard Part Size inches(mm)
Typical Thermal Properties
(Performed on surface of 196 lead 3 Watt PQFP package)
Environment*
T-Wing
Restricted
Convection**
Sizes (inches)
Without
T-Wing
0.5x2
(12.7x50.8)
0.5x3
(12.7x76.2)
0.75x3
(19.1x76.2)
1x3
(25.4x76.2)
1x4
(25.4x101.6)
1.5x4
(38.1x101.6)
Thermal Resistance
Rj-a (°C/W)
26
25
23
23
22
20
19
Case
Temperature (°C)
92
82
78
76
72
70
68
Thermal Resistance
Rj-a (°C/W)
18
16
14
14
14
13
12
Case
Temperature (°C)
68
57
52
49
46
44
44
Sizes (inches)
Without
C-Wing
0.5x2
(12.7x50.8)
0.5x3
(12.7x76.2)
0.75x2
(19.1x76.2)
0.75x3
(19.1x76.2)
1.5x1.5
(38.1x38.1)
N/A
102
96
90
90
87
87
N/A
85
80
75
76
73
74
N/A
100 LFM***
Environment*
C-Wing
Restricted
Convection**
Case
Temperature (°C)
100 LFM
* Measured values do not account for heat losses through bottom of case and leads. Ambient temperature range from 21oC to 24oC
** Restricted convection in a simulated notebook computer environment-a 1x5x6inch (2.54x12.7x15.2cm) plexiglass box
*** T-Wing long axis perpendicular to air flow direction in wind tunnel
Notes
Rj-a = thermal resistance from junction to ambient
LFM = airflow rate (linear feet per minute)
Typical Adhesion Performance
Test
Procedure
Result
Test Method
2
Lap Shear - Room Temperature
apply/60 min. R.T. dwell/R.T. pull
960 oz/in (414 kPa)
ASTM D1000
Lap Shear - Elevated Temperature
apply/60 min. R.T. dwell/100°C pull
53 oz/in2 (23 kPa)
ASTM D1000
90° Peel - Room Temperature
apply/1 min. R.T. dwell/R.T. pull
40 oz/in (441 g/cm)
ASTM B571/D2861
90° Peel - Elevated Temperature
apply/60 min. R.T. dwell/100°C pull
20 oz/in (220g/cm)
ASTM B571/D2861
Creep Adhesion, days
275°F (135°C), 7 oz/in2 (3 kPa), on aluminum
>80 days, no failure
P.S.T.C. No. 7
ENGINEERING YOUR SUCCESS.
41
T-Wing® and C-WingTM Heat Spreaders
Environmental Stress Adhesive Performance
Environmental Stress Thermal Performance
Environment
Before
90° Peel Strength
After
Environment
Heat Aging
Rj-a (°C/W) Restricted Convection
Rj-a (°C/W) 100 LFM
20.3
12.7
oz/in
(gm/cm)
20.6
Control
36
393
13.1
Heat Aging
36
393
High Temperature/Humidity
46
514
High Temperature/Humidity
Rj-a (°C/W) Restricted Convection
21.4
21.4
Temperature Shock
38
424
Rj-a (°C/W) 100 LFM
14.1
14
Temperature Cycling
30
335
Temperature Cycling
Note: Average of three samples tested per ASTM B571/D2861.
Rj-a (°C/W) Restricted Convection
21.4
21.7
Rj-a (°C/W) 100 LFM
14.1
13.9
Note: Tested with a 1” x 4” (25.4 x 101.6 mm) T-WING
Testing Summary
Summaries of test procedures
used for T-Wing heat spreaders
are described below. Thermal
performance, adhesion strength
and visual inspection were used as
pass/fail criteria.
Apparatus
Anatek® Thermal Analyzer: The ATA
was used to measure Rj-a before and
after environmental stressing. PQFP:
196 lead, plastic PQFPs known to
contain silicone mold release were
evaluated. T-Wing Heat Spreader: 1
inch x 4 inch TWing parts were applied
to the PQFP packages with a 5 psi (0.03
MPa) mounting pressure.
Thermal Performance
Various sizes of T-Wing heat spreaders
were applied to a 196 lead PQFP
using less than 5 psi (0.03 MPa)
bonding pressure. Within 30 minutes
of application, the test boards were
mounted in an Analysis Tech® thermal
analyzer. The devices were heated to
equilibrium (45 to 60 minutes) with
approximately 3 watt load on 3 x 3 inch
(7.6 x 7.6 cm) test boards. Two test
environments were used: restricted
convention, achieved with a 1 x 5 x 6
Chomerics
inch (2.5 x 12.7 x 15.2 cm) plexiglass
box; and 100 LFM (30m/min) air
flow. Results were obtained using
thermocouples for Tc (centered on
case) and Rj-a.
Environmental Stressing
Control: Specimens were maintained
for 1000 hours at standard laboratory
conditions, 23°C, 35-60% RH.
Heat Aging: Test specimens were
placed in a forced convection hot air
oven maintained at 150°C ±5°C for
1000 hours. Test specimens were then
removed and tested.
Elevated Temperature/High Humidity:
Specimens were placed in a humidity
chamber maintained at 85°C ±2°C and
90%-0 +10% RH for 1000 hours.
Evaluation Procedure
Visual: All test specimens were examined for de-bonding, delamination or
other signs that the tape was failing
after environmental stress.
Thermal Performance: T-Wing was
applied to the PQFP with 5 psi mounting pressure. After a one hour dwell,
the Rj-a of each specimen was measured at 100 LFM and under restricted
convection conditions. The Rj-a was
again measured after environmental
stressing.
90° Peel Strength: A T-Wing heat
spreader was applied to each PQFP
with 5 psi mounting pressure. The
specimens were subjected to environmental stress and then tested for 90°
peel strength at room temperature.
Temperature Cycling: Specimens were
subjected to 500 cycles from -50°C
to +150°C in a Tenney Temperature
Cycling Oven.
Temperature Shock: Specimens were
subjected to 100 temperature shocks
by immersion into -50° and +150°C
liquids. Temperatures were monitored
with thermocouples.
42
T-Wing® and C-WingTM Heat Spreaders
Ordering Information
Available in standard sizes 1,000 parts per plastic tray. Also available die-cut on continuous rolls.
Size (inches/mm)
Material
Part Numbers
T-Wing
C-Wing
A: Length mm (inches)
B: Width mm (inches)
C: Adhesive Width mm (inches)
60-12-20264-TW10
50.8 (2.0)
12.7 (0.50)
12.7 (0.50)
60-12-20265-TW10
76.2 (3.0)
12.7 (0.50)
12.7 (0.50)
60-12-20266-TW10
76.2 (3.0)
19.1 (0.75)
19.1 (0.75)
60-12-20267-TW10
76.2 (3.0)
25.4 (1.00)
25.4 (1.00)
60-12-20268-TW10
101.6 (4.0)
25.4 (1.00)
25.4 (1.00)
60-12-20269-TW10
101.6 (4.0)
38.1 (1.50)
38.1 (1.50)
69-12-22745-CW10
14.0 (0.55)
20.0 (0.79)
N/A
69-12-23802-CW10
19.1 (0.75)
19.1 (0.75)
N/A
69-12-22849-CW10
31.8 (1.25)
31.8 (1.25)
N/A
Figure 1.
A
B
C
Folding Scores
0.0015 in. Black PVF
0.007 in. RA Copper
0.0015 in. Black PVF
Release Liner
0.002 in. Thermattach PSA
Dimensions are typical
Standard Parts: Refer to table below
for Part Numbers and sizes. T-Wing
heat spreaders are available in standard
packages of 100 parts/pkg.
The data shows that the average peel
strength actually increases with high
temperature/humidity and temperature
shock, while remaining unchanged with
heat aging and decreasing slightly with
temperature cycling.
Custom Parts: Custom configured TWing parts are also available. Contact
Chomerics’ Applications Engineering
Department for details.
Application Instructions
Ordering Information
Results
Materials needed: Clean cotton cloth
or rag, industrial solvent, rubber
gloves.
Visual: There was no visual evidence
of T-Wing adhesion failure to the PQFP
after the environmental stresses.
Step 1: For best results, clean the top
surface of the component using a lintfree cotton cloth.
Thermal Performance: The before and
after thermal resistances are given in
Table 4. The data shows that the thermal
resistances were essentially unchanged
by the exposures.
Step 2: Wipe the bonding surface of the
component with an industrial solvent,
such as MEK, acetone or isopropyl alcohol. In the case of a plastic package,
select a cleaner that will not chemically attack the plastic substrate. Do
not touch the cleaned surface during
any part of the assembly process. If the
90° Peel Strength: The results of the
peel strength tests are given above.
surface has been contaminated, repeat
Steps 1 and 2.
Step 3: Remove the clear release liner
from the T-Wing part, exposing the
pressure-sensitive adhesive (PSA).
Avoid touching exposed adhesive with
fingers.
Step 4: For best bond strength and
contact area, center the exposed PSA
onto the component. Press and smooth
the entire T-Wing bonding area with
firm finger pressure of about 5 psi, for
5 seconds.
Note: Bond strength will increase as a
function of time as the adhesive continues to wet out the bonding surface.
Increasing any of the application variables (pressure, temperature and time)
can improve bonding results.
ENGINEERING YOUR SUCCESS.
43
Thermal Management Glossary
Alumina (Al2O3): A relatively
inexpensive ceramic in powder or
sintered sheet form. Its thermal
conductivity of 30 W/m-K and
excellent dielectric properties make
it useful in low to moderate power
commercial applications.
Ambient Temperature: The
temperature of the air surrounding a
heat source.
Apparent Thermal Conductivity:
This value differs from bulk thermal
conductivity as apparent thermal
conductivity also includes contact
resistance when measured, as
described in the Heat Transfer
Fundamentals section of this guide.
Also see Thermal Conductivity.
Arcing: An electrical discharge
between the edges of metal
semiconductor package and the
metal heat sink on which it is
mounted.
Binder: A polymer (i.e. silicone,
urethanes, acrylic, epoxy etc.) used
in thermal interface materials to
provide desired mechanical, thermal
and electrical properties and hold
in a stable form the fillers whose
primary purpose is the transfer
of heat. Binders are also good
electrical insulators.
Bondline Thickness: Average
thickness between heat spreading
device and components.
Boron Nitride (BN): A non-abrasive
ceramic material that has higher
thermal conductivity than alumina.
Because it is an expensive raw
material, it is usually used in high
performance interface materials.
Breakdown Voltage: The amount of
voltage required to cause a dielectric
failure through an insulator when
tested under a set of specific
conditions. This value does not
imply that the insulator can be
operated at those voltages.
Burr: A thin ragged fin left on
the edge of a piece of metal
(semiconductor package or heat
Chomerics
sink) by a cutting or punching tool.
Calorie: A unit of energy equal to
the quantity of heat required to raise
the temperature of 1 gram of water
by one degree Celcius.
Ceramic: A name given to oxides of
metals. Ceramics are usually hard,
heat and corrosion resistant and
high dielectric strength powders that
can be formed into shapes by fusion
or sintering.
Chamfer: A bevel cut into the edge
of heat sink mounting holes.
Coefficient of Thermal Expansion
(CTE) : A measure of a material’s
change in volume in response to a
change in temperature.
Compression Set: The permanent
deformation of an elastomeric
material caused by a compressive
force.
Conduction: The transfer of heat
energy through matter.
Convection: The transfer of heat
that results from motion of a fluid
(gas or liquid).
Corona: An electrical discharge
within or on an insulator
accompanied by ionization of the
air within or contacting the surface
of the insulator. Also called partial
discharge. It is the main mode of
insulation failure exposed to long
term AC voltages.
Creep Distance: The distance that
an insulator has to extend beyond
the edge of a semiconductor
package to prevent arcing.
Cure-In-Place: Any material that is
dispensed as a liquid and cures in
the application.
Cut-Through: A phenomenon
that occurs when sharp edges or
burrs on the metal semiconductor
package or heat sink cut through
the thermal pads and reduce or
eliminate their insulating strength.
Compression / Deflection:
The change in thickness of an
elastomeric interface material
in response to a compressive
load. Because these materials
are incompressible, deflection is
accompanied by a proportional
increase in area.
Degreaser or Degreasing Solvent:
The solvent used to clean flux
and other organic residues off
printed circuit boards after they are
manufactured. Interface materials
must be able to tolerate exposure
to degreasing solvents without
degrading performance.
Dielectric: A material that acts as
an insulator.
Dielectric Constant: See
Permittivity.
Dielectric Strength: The voltage
gradient, expressed as kV/mm, that
will cause a dielectric failure in
an insulating material under very
specific test conditions. Dielectric
strength does not imply that the
insulator can withstand those
potential gradients for an extended
period of time.
Durometer: An instrument for
measuring the hardness of rubber.
Measures the resistance to the
penetration of an indentor point into
the surface of the rubber.
Electronic Control Unit or Electronic
Control module (ECU/ECM): Various
electronic coltrollers, typically used
in automotive applications. (i.e.
steering anf braking)
Electrical Insulator: A material
having high electrical resistivity
and high dielectric strength and
therefore suitable for separating
components at different potentials
to prevent electrical contact between
them.
Filler: A fine, dispersible ceramic or
metallic powder (i.e. boron nitride,
alumina, graphite, silver flake, etc.)
whose thermal conductivity is at
least twenty times greater than that
44
of the binder.
Flow Rate: The volume, mass, or
weight of a fluid passing through a
device of any type, per unit of time,
expressed in gallons -or liters-perhour.
Flux: An organic compound used to
enhance the wetting and adhesion
of metal solder to the copper
surfaces on printed circuit boards.
Footprint: The area of the base of
an electronic device which comes
in contact with a thermal interface
material.
Hard Tooling: A die cutting tool
manufactured from a machined
metal block. The cost is high,
therefore it is normally used when
long runs are anticipated.
Hardness: A measure of the
ability of a material to withstand
penetration by a hard pointed
object. Regarding thermal interface
materials, this property is usually
inversely proportional to the ability
of a material to conform to uneven
surfaces.
Hardness Shore A (Shore D, Shore
00): An instrument reading on a
scale of 0 to 100 measuring the
hardness of a material. There are
three scales: Shore 00, A and D.
Shore 00 is used for soft rubbers
like gels, Shore A is used for hard
rubbers and Shore D for inelastic
plastics.
Heat (Q): A form of energy
generated by the motion of atoms
or molecules. Heat energy is
expressed in units of joules.
by means of conduction, convection,
or radiation.
Interface: A boundary that exists
between any two contacting
surfaces. There are five types of
interfaces that can exist between
the different forms of matter:
gas-liquid, liquid-liquid, gas-solid,
liquid-solid, and solid-solid.
Junction: The junction is the active
part of a semiconductor, usually
silicon, where the current flow
causes heat to be generated.
MBLT: Minimum bond line
thickness. When two opposing
substrates obtain closest possible
distance under pressure.
Micro-inch: This unit of measure,
a millionth of an inch, is used to
describe the roughness of a surface
and is the average distance between
the peaks and valleys on the
surface.
Mil: A unit of length equal to onethousandth of an inch.
PCM: Abbreviation of phase change
material.
Permeability: A measure of
a material’s ability to align its
magnetic domains in response to an
applied magnetic field.
Permittivity: A measure of a
dielectric material’s ability to
polarize in response to an applied
electric field, and transmit the
electric field through the material.
Heat Capacity: The measure of a
materials ability to store heat.
Polyimide: An organic polymer with
exceptional electrical insulation and
high temperature capabilities. In
film form, it is used on everything
from printed circuit boards to space
suits.
Heat Flow: The rate at which heat
is flowing per unit time expressed
as Watts.
Power Supply: A self contained
unit which converts AC current to
DC for use in electronic devices.
Heat Flux (Q/A): The rate of
heat flow per unit surface area
expressed as Watts / cm2.
Pressure Sensitive Adhesive (PSA):
An adhesive that is tacky at normal
temperatures and requires only
slight pressure to form a permanent
bond. A PSA requires no further
cure to maintain the bond.
Heat Transfer: The movement
of heat from one body to another
(solid, liquid, gas, or a combination)
PSH: Class of polymer solder
hybrid. A synergistic blend of
eutectic solder and specialty
polymers. They provide a highly
reliable thermal interface material
with a resin carrier and filler
content that both melt to obtain
minimum bond line thickness.
Radiation: A heat transfer process
whereby heat is given off through
electromagnetic radiation, usually
infrared rays.
Reinforcement: A woven glass
mesh or polymer film that is used
as a support in thermal interface
materials.
Permanent Set: Permanent Set is
defined as the amount of residual
displacement in a rubber part
after the distorting load has been
removed.
Relaxation: Stress Relaxation is
a gradual increase in deformation
of an elastomer under constant
load over time, accompanied by a
corresponding reduction in stress
level.
Rheology: The science of the
deformation and flow of materials.
Semiconductor: An electronic
material that can be an insulator
under one condition and switch
to a conductor under a different
condition
Shear-Thinning: A characteristic
of a fluid whereby the fluid’s
viscosity decreases with increased
shear stress. Materials the exhibit
shear-thinning are also described
as pseudoplastic. Filled polymer
resins commonly exhibit this
behavior. (Example: toothpaste is
shear-thinning. It does not flow
when left alone, but when squeezed
with increased force, it flows more
readily)
Silicon: A non-metallic element
occurring extensively in the earth’s
crust in silica and silicates. Silicon
is the basis for the junction found in
most semiconductor devices.
ENGINEERING YOUR SUCCESS.
45
Solder: A mixture of metals that is
used to connect electronic devices
to the copper patterns on a printed
circuit board.
Solvent Resistance: The ability of
thermal management products to
resist swelling when exposed to
organic solvents such as degreasing
solvents, hydraulic fluids, coolants
and jet fuel.
Temperature determines the
direction of heat flow between any
two systems in thermal contact.
Heat will always flow from the area
of higher temperature (T source) to
one of lower temperature (T sink).
Thermocouple: A thermoelectric
device consisting of two dissimilar
metallic wires fused into a
bead which generates a voltage
proportional to the temperature of
the bead.
Temperature Gradient (¨T): The
difference in temperatures in the
direction of the heat flow between
two points in a system.
Specific Gravity: The ratio of the
density of a substance to the density
of water. The specific gravity of
water is 1 at standard condition
temperature and pressure.
Tensile Strength: A measure of the
ability of a material to withstand a
tension (pulling apart) force. It is
usually measured in MPa or psi of
material cross section.
Thixotropy: a characteristic of a
fluid whereby the fluid’s viscosity
decreases as a function of time at
a fixed shear rate. Viscosity tends
to re-build with time as the shear
stress is reduced. (Example: gels
and colloids are often thixotropic.
The longer they are shaken in a can,
the more readily they flow)
Specific Heat: The amount of heat
per unit mass required to raise the
temperature by one degree Celsius.
(See Heat Capacity.)
Thermal Conductivity (K): A
quantitative measure of the ability
of a material to conduct heat
expressed in units of W/m-K.
Tolerance: The permissible
variations in the dimensions or
other characteristic of a part or
substance.
Steel Mill Die: A die cutting tool of
moderate cost, cast from steel. It is
used for high speed cutting.
Thermal Contact Resistance (Ri):
The resistance to the flow of heat
caused by interstitial air trapped
in the irregularities of between
contacting solid surfaces. Units are
K-cm2/W.
Torque: A turning or twisting that
is equal to the value of the force (f)
multiplied by the rotational distance
over which it is applied (usually
measured in ft-lbs.).
Steel Rule Die: A low cost die
cutting tool manufactured by
shaping sharpened steel foil to
the desired shape and fixing in a
plywood and steel rule metal. It is
used for short runs.
Surface Finish: A measure of the
roughness of a surfaces, usually
expressed in units of micro-inches.
Swelling: A phenomenon that
results when an elastomer is
exposed to a degreasing solvent and
the elastomer absorbs the solvent.
The volume of the elastomer
increases and its physical strength
is greatly reduced. In this swollen
state, the elastomer can be easily
damaged and should not be
subjected to any mechanical stress
until the elastomer has been dried.
Tear Strength: A measure of the
ability of a material to withstand
tearing/ ripping stresses. It is
usually measured in pounds force
per inch of thickness.
Temperature: A measure of
the average kinetic energy of
a material. The standard unit
of temperature is a Kelvin, (K).
Chomerics
Thermogravimetric Analysis:
Chemical analysis by the
measurement of weight changes of
a system or compound as a function
of increasing temperature.
Thermal Impedance (T): Thermal
impedance is the sum of the
thermal resistance of an interface
material and the thermal
resistances at the interfaces in
contact with the material. K-in2 /
Watt.
Thermal Interface Materials
(TIMs): Materials that are inserted
between two contacting solid
surfaces and aid heat flow by
eliminating gaps between the
irregular surfaces. Interstitial
air is replaced by material that is
significantly more conductive than
air.
Viscoelastic material: A material
whose response to a deforming
load combines both viscous (does
not recover its original shape/ size
when load removed) and elastic
(will recover size/shape when load
removed) qualities. The common
name for such a material is
“plastic.”
Volume Resistivity: A measure
of a material’s inherent electrical
resistance expressed as ohm-cm.
Watt: An SI unit of power equal to
one joule per second.
Thermal Resistivity: The
quantitative measure of a material’s
resistance to the conduction of
heat. (It is the inverse of thermal
conductivity.)
46
Parker Safety Guide
Parker Safety Guide for Selecting and Using Parker Seals, Isolation Devices, EMI Shielding Materials,
Thermal Management Materials and Related Accessories
!
WARNING – USER RESPONSIBILITY
Failure or improper selection or improper use of Parker seals, isolation devices, EMI shielding,
thermal management materials, or related accessories can cause equipment failure or damage,
personal injury or death. Possible consequences of such failure, improper selection or improper use
include, but are not limited to:
ä
ä
ä
ä
ä
Contamination of systems and environments from leaking fluids or gases.
Ingress of dust, fluids or other substances.
High velocity fluid discharge.
Physical contact with released fluids or gases that may be hot, cold, toxic or otherwise injurious.
Contact with suddenly moving, falling or suddenly halted objects that are to be held in position or
moved in part or fully by the function of the product.
ä Improper function or failure of host devices or equipment, or connected devices or equipment.
ä Burn-inducing temperatures, smoke or flame from overheated devices or equipment.
ä Injuries resulting from inhalation, ingestion or physical exposure to solvent-based systems.
Before selecting or using any Parker seals, isolation devices, EMI shielding, thermal management
materials, or related accessories, it is important that you read and follow the following instructions:
1.0 General Instructions
1.0.1 Scope
This safety guide provides
instructions for selecting and using
(including designing, assembling,
installing and maintaining)
seals (including all elastomeric,
polymeric, thermoplastic,
metallic and/or plastic products
commonly called ‘seals’); isolation
devices (including elastomeric,
polymeric, thermoplastic and/
or thermoplastic in the form
of boots, bearings, bellows,
bushings, grommets, and/or
vibration isolation mounts); EMI
(electromagnetic interference)
shielding (including all conductive
elastomers, metal-based
materials, conductive fabrics
and conductive fabric-based
materials, conductive paints,
conductive adhesives and caulks,
metal/plastic laminates, and/
or conductively coated or plated
substrates commonly referred
to as ‘EMI shielding ’); and
thermal management materials
(including thermally conductive
elastomer or acrylic-based
interface materials, thermally
conductive adhesive tapes, metal
or ceramic-based heat spreaders,
thermally conductive adhesives
and caulks, and/or solder/filmbased thermally conductive
assemblies) manufactured or
sold by the world wide Parker
Hannifin organization (including
its Chomerics operations) . It
also includes related accessories
(including mounting hardware,
surface preparation solvents,
protective liners, application
systems, containers and packaging
materials). All such devices
are collectively referred to as
“Products” in this safety guide.
This safety guide is a supplement
to and is to be used with the
specific Parker publications
for the specific seals, isolation
devices, EMI shielding, thermal
management materials, and
related accessories that are being
considered for use.
1.0.2 Fail-Safe
Products can and do fail without
warning for many reasons. Design
all systems and equipment in a
fail-safe mode, so that failure of
the Products will not endanger
persons or property.
1.0.3 Distribution
Provide a copy of this safety guide
to each person who is responsible
for
designing, specifying, selecting,
purchasing of these Products.
Do not select these Products
without thoroughly reading and
understanding this safety guide
as well as the specific Parker
publications for the products
considered or selected.
1.0.4 User Responsibility
Due to the wide variety of
operating conditions and uses
for these Products, Parker and
its distributors do not represent
or warrant that any particular
Product is suitable for any
specific end use system. This
safety guide does not analyze all
technical parameters that must be
considered in selecting a product.
The users, through their own
analyses and testing, are solely
responsible for:
ENGINEERING YOUR SUCCESS.
47
ä Making the final selection of
the seal, isolation device, EMI
shielding product or thermal
management material.
ä Assuring that the users’
requirements are understood
and met and that the use
presents no health or safety
hazards.
ä Providing all appropriate health
and safety warnings on and
with the equipment on which
the seals, isolation devices,
EMI shielding or thermal
management materials are
used.
1.0.5 Additional Questions
Contact the appropriate Parker
applications engineering
department or your Parker
representative if you have any
questions or require any additional
information. See the Parker
publication or web pages for
the product being considered
or used, for telephone numbers
and/or e-mail addresses of
the appropriate applications
engineering department.
2.0 Sealing Performance
2.0.1 Sealing Performance: Seals
In general, seals are used to
maintain an unbroken sealing line
separating adjoining volumes of
media or fluid, under all normal
operating conditions. Some seals
may be designed to provide other
functions (e.g., mechanical check
valves). Maintaining the sealing
line may be necessary when that
line is formed on a surface that
remains stationary relative to the
seal (i.e., static sealing). Or, the
sealing line may be formed against
a surface that moves (i.e., dynamic
sealing). Numerous criteria
are involved in typical sealing
designs, including choice of sealing
material, gland design, and/or
other seal retention and mating
features, etc. Specific sealing
requirements and the performance
of any related sealing system must
be clearly defined for every given
application in order to select the
Chomerics
best sealing solution. The user
should provide these definitions,
ideally in partnership with
applications support from Parker
at the earliest possible stages of
the design process.
2.0.2 Sealing Performance:
Isolation Devices
Many isolation devices are used to
prevent ingress of environmental
contaminants, including moisture,
grease and dirt under normal
operating conditions, while
isolating noise, vibration and
harshness. Other isolation
products are used for absorbing
shock, reducing equipment noise
and insulating against vibration.
Performance safety concerns
should include the ability of the
Parker isolation device to prevent
contaminant ingress, and/or
isolate noise, vibration, and shock
depending on the application
requirements. The user should
provide Parker application
engineers with the isolation
performance criteria early in the
design stages to optimize material
choices and overall design/use
of the isolation device. Certain
isolation device solutions may be
designed to incorporate separate
and distinct sealing systems. For
these applications, the specific
sealing performance should also
adhere to the goals described in
Section 2.0.1.
2.0.3 Sealing Performance: EMI
Shielding
EMI shielding materials are used
to reduce the transmission of
electromagnetic energy. While
many EMI shielding materials may
also provide some level of sealing,
any specific sealing performance
requirements should adhere to
the goals described in Section
2.0.1 above. Certain EMI shielding
solutions may be designed to
incorporate separate and distinct
sealing systems. For these
applications, the specific sealing
performance should also adhere
to the goals described in Section
2.0.1. Other types of EMI shielding
materials provide no sealing
performance, inconsequential
sealing performance, or widely
varied sealing properties. Finally,
EMI shielding materials, like other
materials used in a given design,
may affect the performance of
proximate sealing systems. The
above factors should be considered
in the design stages and
specification of EMI shielding (and
seals), ideally in partnership with
applications support from Parker
at the earliest possible stages of
the design process.
2.0.4 Sealing Performance:
Thermal Management Materials
Thermal management materials
are used to assist in the
transmission of heat energy.
Some thermal management
products may also provide some
level of sealing, but any specific
sealing performance should
adhere to the goals described
in Section 2.0.1 above. Certain
thermal management solutions
may be designed to incorporate
separate and distinct sealing
systems. For these applications,
specific sealing performance
should also adhere to the goals
described in Section 2.0.1. Other
types of thermal management
materials provide no sealing
performance, inconsequential
sealing performance, or widely
varied sealing properties. Finally,
thermal management materials,
like other materials used in a
given design, may affect the
performance of proximate sealing
systems. The above factors should
be considered in the design stages
and specification of thermal
management materials (and
seals), ideally in partnership with
applications support from Parker
at the earliest possible stages of
the design process.
2.1 Electrical
Conductivity
2.1.1: Electrical Conductivity: Seals
Extreme care must be exercised
when selecting seals for
48
applications in which electrical
conductivity or non-conductivity is
a factor. Parker seals designed for
sealing against liquids and gases
may be developed with electrically
conductive properties to meet
specific application requirements.
Conversely, non-conductive seals
can be provided for applications
prohibiting electrical conductivity.
The electrical conductivity or
non-conductivity of Parker seals
is dependent upon many factors
and may be susceptible to change.
These factors include, but are
not limited to, the materials used
to make the seal and/or related
parts (including seal-bearing
assemblies provided by Parker),
how and where the seals and/
or related parts are installed,
moisture content of the seal at
any particular time, and other
factors. Users should be aware
of any safety-related issues with
using electrically conductive,
or insulating, seals in a given
application. These concerns
should be documented and
discussed with Parker before or
during the seal selection process.
2.1.2: Electrical Conductivity:
Isolation Devices
Most isolation device materials
are made from elastomeric,
polymeric, thermoplastic or
plastic materials that are typically
non-conductive. However, some
isolation devices are fabricated
with conductive features, e.g.,
metal frames, threaded fasteners,
metallic sealing materials,
etc. Users should be aware of
any safety-related issues with
using electrically conductive,
or insulating, isolation devices
in a given application. These
concerns should be documented
and discussed with Parker before
or during the isolation device
selection process.
2.1.3: Electrical Conductivity:
EMI Shielding
Parker EMI shielding materials are
inherently electrically conductive,
which is essential to providing
shielding performance. Levels of
conductivity vary by product type
and factors of application. Thus,
care should be used when selecting
these materials. EMI shielding
products can be designed with
non-conductive elements, (e.g.,
mounting features) depending on
the application requirements.
The electrical performance of
Parker EMI shielding is dependent
upon many factors and may be
susceptible to change. These
factors include but are not limited
to the various materials used to
make the EMI shielding and/or
related parts (including shielding
assemblies provided by Parker),
how and where the EMI shielding
and/or related parts are installed,
moisture content of the shielding at
any particular time, corrosion over
time, and gap mechanics (stiffness,
fastener spacing, etc.).
2.1.4: Electrical Conductivity: Thermal Management Materials
Extreme care must be used when
selecting thermal management
products in which electrical
conductivity or non-conductivity
is a factor. Certain Parker
thermal management materials
are designed to be electrically
non-conductive, i.e., electrical
insulators, while others are
specifically designed to be
electrically conductive. And other
thermal management materials
are inherently electrically nonconductive only below certain
current levels.
The electrical conductivity of
Parker thermal management
products is dependent upon many
factors and may be susceptible to
change. These factors include the
various materials used to make the
thermal management materials
and/or related parts (including
thermal management assemblies
provided by Parker), how and
where the thermal management
parts and/or related parts are
installed, moisture content of the
thermal products at any particular
time, and other factors.
2.2 Temperature Range And
Flammability
2.2.1 Temperature Range and
Flammability: Seals
Temperatures can affect
seal performance, including
occurrences such as heat
hardening and oxidation. The
temperature range of a given seal
application, and the expected
performance of any sealing system
within this range, must be clearly
defined in order to select the best
sealing solution. Temperature at
the seal itself may vary widely from
the ambient condition, sometimes
by hundreds of degrees. The user
should provide the temperature
range, ideally in partnership with
applications support from Parker
at the earliest possible stages of
the design process. Temperature
range is generally defined as
the maximum and minimum
temperature limits within which
a seal compound is expected
to function properly in a given
application.
Virtually all Parker sealing
materials feature a recommended
use temperature range, which
should be regarded in the seal
selection process. This information
can normally be found on related
Parker web pages, product
literature or from Parker Seal
Group applications engineering.
In addition, temperature range
should be considered for all
integral seal elements (e.g.,
fasteners, adhesives, plastics,
metals, etc.) and for application
features such as gland dimensions,
fluid temperatures, dynamic or
static operation, etc. For example,
temperature, or the range of
temperature, for a given operation
may require some modification of
the gland dimensions.
Changing the fluids a seal is
exposed to will change the
ENGINEERING YOUR SUCCESS.
49
temperature limits of the seal.
This is because some chemical
reactions take place at elevated
temperatures, but not necessarily
at lower temperatures. Seals can
fail at low temperatures as well.
These failures are typically caused
by some mechanical instability
in the system, which would
cause the seal to loose its seal
interface. The temperature limit
in a particular sealing application
cannot be properly determined
without knowing what specific
fluids or other media the seal
will be exposed to. Flammability
information is available for most
Parker seal materials. Certain
materials are available with various
UL (Underwriters Laboratories)
ratings for flammability/flame
resistance. When Parker seal
materials are integrated with other
materials (e.g., plastic frames),
the user, or Parker, may need to
determine the flammability data for
these other materials.
For more safety information on
temperature and flammability,
consult with Parker Seal Group
applications engineering.
2.2.2 Temperature Range and Flammability: Isolation Devices
Most Parker isolation devices
are produced from materials that
perform over a broad temperature
range, e.g., -65 to +600 degrees F.
Some materials are better suited
for wider temperature ranges, or
for higher or lower temperature
extremes. Temperature range
data is available for most of these
materials and should be considered
in the overall selection process.
Users should also determine
whether flammability issues are
of concern to their application.
When Parker isolation devices are
integrated with other materials
(e.g., plastic frames), the user,
or Parker, may also need to
determine the flammability data
for these other materials. Consult
with Parker engineers on available
flammability data, e.g., UL ratings,
required for a choice of an isolation
Chomerics
device.
2.2.3 Temperature Range and Flammability: EMI Shielding
Temperatures can affect EMI
shielding performance to the
extent they may affect electrical
continuity within a shielding
design. This could result from
physical changes to electrically
conductive shielding components
(conductive panels, coatings,
platings, flanges, compounds,
gaskets, fasteners, adhesives,
etc.) due to temperature extremes,
changes, etc. In addition, while
some shielding materials such as
conductive compounds (paints,
adhesives, caulks, inks) should be
applied at specific temperature
ranges (e.g., ambient), they will
provide shielding performance
over a broader temperature range.
Other shielding materials such as
compounds may require curing at
elevated temperatures, which may
in turn affect substrates or other
exposed components. Temperature
ranges for effective shielding
performance are available for most
Parker EMI shielding materials,
including integral attachment
systems (e.g., pressure sensitive
adhesives). Consult Parker’s
literature or web pages, and
consult with Parker applications
engineers to review shielding
material selection relevant to
temperature range.
Flammability information is
available for many Parker shielding
materials. Certain materials
are available with various UL
(Underwriters Laboratories)
ratings for flammability/flame
resistance. When Parker shielding
products are integrated with other
materials (e.g., plastic frames),
the user, or Parker, may need to
determine the flammability data for
these other materials.
For more safety information on
temperature and flammability,
consult with Parker technical
service department. Curing of
products at elevated temperatures
may generate off gas components.
Any need to use local exhaust
ventilation should be based off
customer assessment.
2.2.4 Temperature Range and Flammability: Thermal
Management Materials
Temperature range is defined
as the maximum and minimum
temperature limits within which
a thermal management material
or product will function properly
in a given application. Normally,
the key feature of these products
is their ability to conduct thermal
energy (heat), particularly within
a target temperature range and
in specific design configurations.
However, temperature extremes
can affect the performance of these
thermal management materials or
systems.
Many Parker thermal management
materials feature a recommended
application temperature range,
which should be regarded in
the seal selection process. This
information can normally be found
on related Parker web pages,
product literature or from Parker
technical services departments.
In addition, temperature range
should be considered for all
integral elements of a thermal
management system (e.g.,
fasteners, adhesives, plastics,
metals, etc.) and for various
other application features, such
as mounting surfaces, etc. The
temperature range of a given
thermal management system,
and the expected performance of
any thermal management system
within this range, must be clearly
defined in order to select the best
solution. The user should provide
the temperature range, ideally
in partnership with applications
support from Parker at the earliest
possible stages of the design
process.
Flammability information is
available for most Parker thermal
management materials. Certain
materials are available with various
UL (Underwriters Laboratories)
50
ratings for flammability/flame
resistance. When Parker thermal
management materials are
integrated with other materials
(e.g., plastic frames), the user, or
Parker, may need to determine the
flammability data for these other
materials. For more information,
consult with Parker technical
service department.
2.3 Compression And Pressure
Most Products require some
level of compression to function
properly. Different materials and
configurations will have varying
compression characteristics,
including resilience, and diverse
compressive force requirements.
Product materials may undergo
compression set or other
compression-related changes
depending on the specific
application. Fluids and other media
may physically affect a Product
and cause changes to the Product’s
compression characteristics in
an application. Compression
(and decompression) qualities
of materials, compression force
requirements, and related
compression requirements
should be considered for a given
application in order to select the
best Product solution. This also
includes the number of pressure
cycles to which the Product will be
exposed, and the number of times
a Product will be disassembled.
Compression data is available on
most Parker Product materials,
and users should consult with
Parker applications engineering
early in their design and Product
selection processes.
Pressure has a bearing on Product
design and selection, as it may
affect the choice of compound
composition, geometry, hardness
and other properties. Proper
selection may require the choice
of higher or lower durometer
materials to accommodate more
severe pressure situations.
Compatibility with the medium
should be of concern e.g.,
excessive swell in an application
can generate extremely high
pressures. If not considered in
the design and selection stages,
high pressures in an application
can affect mating assemblies and
lead to Product failure, e.g., by
extrusion of the Product material.
Pressure data should be provided
as part of the selection process,
as well as the choice of interface
design and materials. This
includes maximum and minimum
pressures and cycling conditions.
2.4 Fluid And Other Media Compatibility
2.4.1 Compatibility: Seals
This is a critical aspect of proper
seal selection, based on the
number of fluids or other media
with which seals are expected
to interact. All media that may
come in contact with the seal and
retainer should be considered.
For example, if the system is to be
cleaned or purged periodically, be
sure to anticipate what cleaning
fluids will be used. Also, consider
any lubricants, e.g., friction
reducers, which may be affected by
the sealed media. These secondary
fluids are as important to selecting
the most compatible seal material
as the principal operating media
selects.
Any increase in seal mass (volume)
due to exposure to the sealed fluid,
must be a design consideration.
Excessive swell in an application
can generate extremely high
pressures and affect the seal
function. Conversely, any decrease
in seal volume, caused by a
reaction to the sealed fluid can also
degrade performance by reducing
compression force or causing
other severe dimensional changes
resulting in possible loss of the
sealing interface.
Seals exposed to atmosphere,
including ozone and air pollutants,
or to vacuum may experience some
types of degradation. Corrosion
issues should also be considered,
particularly of metallic mating
or seal mounting hardware (see
2.6.1). In all cases, fluid and
gas compatibility should be a
major consideration for every
sealing application, and fully
discussed with Parker Seal Group
applications engineering.
2.4.2 Compatibility: Isolation Devices
Many isolation devices are
designed to retain or seal a
number of fluids across a variety of
applications, while also protecting
against contaminants (see 2.6.2).
Others are designed exclusively to
control noise, vibration, shock or
motion. Users should assess the
nature, volume, etc., of all fluids
and gases that will be contact
with the isolation devices in their
applications. These assessments
should be discussed with Parker
applications engineers in selecting
and designing the appropriate
isolation device solution.
2.4.3 Compatibility: EMI Shielding
Fluid and gas compatibility
concerns in EMI shielding
applications include the potential
effects on electrical conductivity,
corrosion, and issues related
to shielding materials that also
provide environmental sealing.
Consider ALL media that may
come in contact with the shielding
components. For example, if
the system is to be cleaned or
purged periodically, be sure to
anticipate what cleaning fluids
will be used. Exposure to fluids
and gases may effect shielding
performance (immediately and
long term) and the application
conditions should be discussed
with Parker engineers. Occurrence
of galvanic corrosion should be
a major concern where metal or
metal-filled shielding materials
are used in the presence of fluids
or humidity. This includes metallic
parts used for attaching shielding
gaskets or other shielding
components. Consult with Parker
applications engineers to optimize
the shielding design and/or choice
of shielding materials to address
ENGINEERING YOUR SUCCESS.
51
corrosion issues. Many EMI gasket
forms will provide little or no
barrier to fluids or gases, unless
they include an integrated sealing
system. The environmental seal,
such as a non-conductive rubber,
will feature its own fluid and
gas compatibility issues. (Refer
to 2.4.1 when considering nonconductive and/or conductive
elastomers for use in an EMI
shielding system.) In all cases,
fluid and gas compatibility should
be addressed in each EMI shielding
application, and fully discussed
with Parker technical service
department.
2.4.4 Compatibility: Thermal
Management Materials
Fluid and gas concerns in thermal
management applications
include the potential effects on
thermal performance, and safetyrelated effects such as corrosion
occurring to the Parker thermal
product or associated hardware.
Consider ALL media that may
come in contact with the thermal
components. For example, if the
system is to be cleaned or purged
periodically, be sure to anticipate
what cleaning fluids will be used.
Exposure to fluids and gases
may effect thermal performance
(immediately and long term)
and the application conditions
should be discussed with Parker
engineers. Fluid or gas exposure
may also affect integral portions of
the supplied thermal management
product, such as pressure sensitive
adhesives. Occurrence of corrosion
should be a concern where metal
or metal-filled thermal materials
are used in the presence of fluids
or humidity. This also includes
metallic parts used for attaching
thermal management components.
Consult with Parker applications
engineers to optimize the thermal
design and/or choice of materials
to address corrosion issues. In all
cases, fluid and gas compatibility
should be addressed in each
application, and fully discussed
with Parker technical service
department.
Chomerics
2.5 Corrosion And
Environment
2.5.1 Corrosion and Environment:
Seals
Seal corrosion is not typically
seen with elastomer-based
sealing materials, but corrosion of
integrated metal seal components,
mounting devices and mating
hardware can be a safety-related
factor when choosing sealing
solutions. Corrosion of these
materials can compromise
the integrity, proper function
and normal results of the seal
design. As such, potential
corrosion opportunities should
be determined and accounted
for in the seal design process
(e.g., using coated or plated
metals). Similarly, environmental
issues should be considered
when developing sealing designs
and specifying seal materials.
Environmental conditions, e.g.,
weather, temperature, salt spray,
dust, etc. can affect the sealing
material, sealing hardware and/
or the media being sealed, which
in turn can affect the sealing
properties. Consult with Parker
Seal specialists on seal design
in respect to corrosion and
environmental issues.
2.5.2 Corrosion and Environment:
Isolation Devices
Corrosion issues should factor
into selecting elastomeric and
thermoplastic-based isolation
devices. Isolation devices with
integral metal plates, flanges,
screws, fasteners and other
metallic features may experience
corrosion under certain conditions.
Further, corrosion can affect the
integrity of other component parts
in an isolation system. Corrosion
control should be part of the
design and selection process when
choosing isolation devices.
Some types of isolation devices,
such as boots and bellows, are
typically designed for preventing
ingress of environmental dust
and dirt, water, fuel and other
fluids, grease and other potential
contaminants. Users should
carefully review potential
environmental conditions and
contaminants to which an isolation
device or system may be exposed.
Some isolation materials may
also be affected by exposure to
ultraviolet (UV) light, e.g. reflected
solar energy. Selection of the
materials, attachment systems
and overall design should have
the primary goal of keeping
out contamination from the
environment. Review corrosion
and environmental issues with
Parker applications engineers as
part of the selection process.
2.5.3 Corrosion and Environment:
EMI Shielding
Corrosion issues must be
considered in the design and
selection of EMI shielding. The
metals used in providing a
conductive pathway, enclosure,
etc. and ultimately an effective
EMI shield can be subject to
corrosion that can affect shielding
performance. The level of this
corrosion is determined by
the metals used and by their
exposure to corrosion-supporting
environments. For example,
galvanic corrosion can occur when
conductive shielding materials
experience battery-like physical
conditions. As such, potential
corrosion opportunities should
be determined and accounted
for in the EMI shielding design
process (e.g., choice of EMI gasket
type, use of corrosion inhibiting
coatings, weather seals, etc.).
Similarly, environmental factors
should be considered when
developing EMI shielding designs
and selecting shielding materials.
Environmental situations, e.g.,
weather, temperature, radiation,
salt spray, dust, etc. can affect
the shielding material, integrated
hardware and other components of
a system’s overall shielding design.
Consult with Parker technical
service department on shielding
design in respect to corrosion and
environmental issues.
52
2.5.4 Corrosion and Environment:
Thermal Management Materials
Corrosion should be addressed
when designing and choosing
thermal management products.
Those products containing
metals as thermal conductors
or as part of an integral thermal
management assembly can be
subject to corrosion that may affect
thermal performance. The level
of this corrosion is determined
by the metals used and by their
exposure to corrosion-supporting
environments. Potential
corrosion opportunities should
be determined and accounted
for in the thermal management
design process (e.g., choice of
thermally conductive materials,
integrated fasteners or other
components, use of corrosion
inhibiting coatings, weather seals,
etc.). Similarly, environmental
issues should be considered
when designing and selecting
thermal management systems.
Environmental situations, e.g.,
weather, temperature, radiation,
salt spray, dust, etc. can affect
the thermal transfer material,
integrated hardware (fasteners,
clips, heat sinks, etc.), and other
components of a system’s overall
thermal management design.
Consult with Parker specialists
on thermal management design
in respect to corrosion and
environmental issues.
2.6 Leakage
2.6.1 Leakage: Seals
Leakage control and acceptable
leakage rates are fundamental to
the design of any efficient sealing
system. When properly used in
sealing liquids there should be
no detectable leakage of a liquid
over a given period of time in the
case of static sealing. Dynamic
sealing provides of a controlled
leakage that is typically very low
concentrations over extended
periods of time.
Gases, on the other hand, will
typically diffuse through the
rubber at some very low rate that
can be detected by a leak detector,
a mass spectrometer or other very
sensitive measuring device. The
leakage rate depends primarily
on the temperature, the pressure
differential, the type of gas and
the type of elastomer used. Outgassing is a vacuum phenomenon
wherein a substance spontaneously
releases volatile constituents
in the form of vapors or gases.
In rubber compounds, these
constituents may include water
vapor, plasticizers, air, inhibitors,
etc. To identify and address safety
concerns, consult with Parker Seal
applications engineers on leakage
issues relevant to all seal designs
and selections.
2.6.2 Leakage: Isolation Devices
When properly designed and
installed, isolation devices for
preventing ingress of contaminants
should demonstrate either no
leakage or an ingress level
well within the user-provided
specifications. This need for
properly selecting isolation devices
may also pertain to preventing or
minimizing ‘leakage’, or egress,
of noise, vibration, shock or other
phenomena. Leakage problems
can lead to system malfunctions,
breakdowns, and safety hazards
to equipment, operators and other
personnel. User-specifications
must address any and all safety
concerns over leakage. These
should be reviewed with Parker
applications engineers early in the
selection process.
2.6.3 Leakage (Including Electromagnetic Energy Leakage): EMI
Shielding
Leakage in an EMI shielding design
can refer to the flow of fluids and
gases, as well as the passage of
electromagnetic energy through
the shield.
With respect to the flow of fluids
and gases, some Parker EMI
shielding products will provide
a certain barrier level to fluid
and gas leakage, e.g., shielded
windows, conductive elastomer
gaskets. However, only a limited
number of these products are
specifically designed for this
feature, e.g., conductive sealants.
Other Parker shielding products
e.g., shielded vents, are actually
designed to facilitate airflow.
Conductive elastomers and other
kinds of conductive shielding
materials may also experience
out-gassing. This is a vacuum
phenomenon wherein a substance
spontaneously releases volatile
constituents in the form of vapors
or gases. In rubber compounds,
these constituents may include
water vapor, plasticizers, air,
inhibitors, etc. In addition,
improperly installed shielding
products, as well as gaps
throughout a device’s shielding
system, may lead to leakage. This
includes any leakage of improperly
cured shielding compounds, e.g.,
coatings, inks, epoxies, etc. To
help you identify and address fluid
and gas leakage concerns, consult
with Parker Seal applications
specialists on leakage issues
relevant to all EMI shielding
designs and selections.
With respect to the passage of
electromagnetic energy through
the EMI shielding material, EMI
shielding materials reduce but
do not eliminate this passage.
Specifications and testing of
EMI shielding materials are
directed toward the amount of the
reduction. The electromagnetic
energy that is emitted from any
electronic device is dependent
upon many factors including the
source of the electromagnetic
energy, the amount of
electromagnetic energy developed
or transmitted by the source,
the distance from the source,
and any desired transmission of
signals from the device such as
through an antennae. The EMI
shielding material is just one
component of the entire device,
and the designers of the device are
solely responsible to determine
ENGINEERING YOUR SUCCESS.
53
the amount of electromagnetic
energy transmitted by the device
under all conditions and to assure
that all performance, endurance,
maintenance, safety and warning
requirements for the device are met.
2.6.4 Leakage: Thermal
Management Materials
Leakage potential of fluids or gases
through thermal management
materials should be addressed by
consulting with Parker Seal design
engineers before or during the
material selection process. Some
Parker thermal management
products will provide a certain
barrier level to fluid and gas
leakage, but only a limited number
of these products are specifically
designed for this feature, e.g.,
thermal potting compounds.
Elastomers and other types of
thermally conductive materials
may also experience out-gassing.
This is a vacuum phenomenon
wherein a substance spontaneously
releases volatile constituents
in the form of vapors or gases.
In rubber compounds, these
constituents may include water
vapor, plasticizers, air, inhibitors,
etc. In addition, improperly installed
thermal management products,
as well as gaps throughout a
thermal management system,
may lead to leakage and resulting
safety problems. This includes
any leakage of improperly
cured thermally compounds,
e.g., adhesives, caulks, etc.
To identify and address safety
concerns, consult with Parker
Seal applications specialists on
leakage issues relevant to all
thermal management designs and
selections.
2.7 Aging
Product selection should consider
both the shelf life and the installed
life. Parker maintains cure date
records for many Products. For
some Products, Parker also
follows established industrial,
customer, United States or other
global age control standards.
Chomerics
Certain materials, e.g. conductive
coatings, inks, adhesives, etc.
have a relatively limited shelf life
and use life. Integral materials,
e.g., pressure sensitive adhesives;
on Products may have aging
properties different from the main
Product material. Users should
consult available Parker data, and
consult with Parker applications
engineers to determine shelf life
standards and installed seal life
guidelines, and relevant procedures,
when selecting seals for their
applications.
2.8 System Weight
Product selection should include
considerations related to Product
weight, hardware/peripherals
weight, and total system weight.
Material weights are available from
Parker web sites, literature, or
from Parker applications engineers.
When weight is critical to achieving
a proper application, this should be
addressed as early as possible with
Parker applications engineers.
Parker can often provide technical
prediction of Product performance
via finite element analysis and other
analytical tools. Successful results
are best accomplished by working
closely with Parker applications
engineers beginning early in the
design stages.
3.0 Handling
Safe handling of Products refers
to the safety of the handlers and to
the security of the seal parts. Any
safety concerns relative to the safety
of Product assemblers; inspectors,
maintenance personnel, etc. should
be addressed with Parker before the
Products enter the handling stages.
Though not usually required, Parker
can provide available Material
Safety Data Sheets and other safe
handling and storage documents
for certain Products. Consult with
Parker applications engineers on
the need and availability of this form
of documentation. The Products
should always be handled in ways
that will not cause physical (visible
or not) changes to the materials
that could affect performance
in their intended application. It
is recommended that Parker
applications engineers be consulted
on best practices for safe storage
and handling of these Products
Safe operation of automated
handling, assembly, insertion,
storage, etc. equipment used
with the Products, should be
optimized for safe use by operators,
maintenance personnel, etc.
Automated or manual equipment,
used for handling seal products,
should not affect the Products in any
way that can alter their attributes
and result in unsafe conditions.
It is recommended that Parker
applications engineers be consulted
on best practices for safe handling
of the Products.
3.1 Pre-Installation
Inspection
Prior to installation, a careful
examination of the Product must be
performed. This includes checking
for correct size, style, quantity, and
part number. The Product should be
examined for cleanliness, abrasion
and any other visible defects.
Faulty Products should be properly
discarded or carefully stored away
from other inventories. Quality
assurance testing programs for the
Products should be established in
consultation with Parker quality
engineers or other authorized
personnel.
3.2 Preparing The
Installation Area
Cleanliness of the Product and
its installation area are key
to successful installation and
performance. Every precaution
must be taken to insure that all
parts are clean at assembly.
Cleanliness is important for proper
Product functions. Foreign particles
in the installation area, including
dirt, metal debris etc. can damage
the Product or impede function.
Remove all sharp edges near
mounting surfaces. When required,
use lubricants on the isolation
54
parts and/or contacting surfaces
only after discussion with Parker
applications engineers. Cleaning
solvents can cause swelling or
other damage of some Products.
Thus, cleaning solvents should
be cleaned off thoroughly. Some
Products may require priming
of installation surfaces. These
processes should be done
according to instructions from
Parker. EMI gaskets may have
specific installation requirements
depending on their construction
and composition. Consult with
Parker applications engineers
for specific gasket application
needs and to review installation
requirements for all Parker EMI
shielding. Customer assumes
responsibility/risk assessment
when handling hazardous
substances for cleaning or surface
preparation.
Consult with Parker Seals
applications engineers with any
questions or concerns regarding
the safe assembly, sizing or mixing
of EMI shielding and thermal
management materials.
3.4 Installation
The Products have various
installation methods, including
manual insertion,, use of hand
tools and automated systems.
Sharp-edged installation tools
should be used with care, or
avoided, to prevent Product
damage. If clamping or crimping
is used, avoid over clamping
or over crimping. Consult with
Parker applications engineers
to determine the issues to be
addressed using whatever
installation method is selected.
3.5 Cure/Set Time
3.3.1 Assembly: Seals And Isolation
Devices
Seal and isolation devices typically
do not have assembly requirements
beyond normal installation into a
system or a system sub-assembly.
3.5.1 Cure/Set Time: Seals and Isolation Devices
Parker seals and isolation devices
are typically supplied in cured
form. When using uncured
seal material (or other curable
products) follow the cure time
instructions provided by Parker.
3.3.2 Assembly: EMI Shielding and
Thermal Management Materials
While most Parker EMI shielding
and thermal management
materials are provided ready to
install, some types require minor
assembly, sizing, mixing or other
preparatory operations prior to
installation. Assembly may include
customer-performed integration
of attachment systems, i.e. adding
hardware or adhesive. Sizing
operations include customerperformed trimming or other
fabrication. Mixing operations are
often required of customers using
Parker conductive coatings and
adhesive products. In all cases,
customers should use good safety
procedures and equipment used
in performing these functions.
3.5.2 Cure/Set Time: EMI Shielding
and Thermal Management
Materials
Some Parker EMI shielding and
thermal management materials
require customer-managed cure
periods. These include conductive
coatings, inks, adhesives, and
form-in-place gasket compounds,
caulks and primers. Some
adhesives (conductive or nonconductive) used for bonding
may have a recommended set
time. Temperature, humidity and
other conditions can affect curing.
Improperly cured materials may
provide abnormal performance,
working life, abrasion resistance,
attachment, and other properties.
Some curable materials are
volatile and/or pose health issues
3.3 Assembly
in uncured form. Refer to all
relevant Material Safety Data
Sheets (MSDS) and consult with
Parker applications engineers on
the appropriate curing methods,
timing and evaluation for Products
requiring curing or setting periods.
3.6 Post Installation Inspection
And Testing
Installed Products should be
inspected for proper fit and
any damage incurred during
installation. In some cases,
pressure, conductivity (electrical or
thermal), or impedance testing, or
other procedures can help identify
any performance problems.
Identified problems should be
documented and brought to the
attention of all associates involved.
Consult with Parker applications
engineers in developing
appropriate inspection and test
standards and procedures.
3.7 Removal
3.7.1 Removal: Seals
Seal removal may require use of
manual or automated tools. Safety
procedures and training may also
be necessary to ensure the safe
use of removal tools, compounds,
etc. Care must be taken to
preserve surface finishes and other
application part features. Inspect
and clean/repair application parts
as needed prior to installing new
seals. Inspect removed seals for
wear, damage and other features
that may indicate conditions
requiring attention. Consult with
Parker regarding appropriate
removal tools and procedures.
3.7.2 Removal: Isolation Devices
Many isolation devices are intended
to remain in place for the life of
the system, e.g. vehicle. When
necessary, these parts must
be carefully removed to avoid
damaging material or attachment
hardware; changing the part
dimensions, or contaminating
ENGINEERING YOUR SUCCESS.
55
protected areas. Inspect removed
devices for wear, damage and
other features that may indicate
conditions requiring attention.
Consult with Parker regarding
appropriate tools and procedures.
3.7.3 Removal: EMI Shielding and
Thermal Management Materials
Removing EMI shielding or
thermal management materials
may require use of manual or
automated tools, as well as the
use of solvents, abrasives or other
compounds. Safety procedures and
training may also be necessary
to ensure the safe use of removal
tools, compounds, etc. Care must
be taken to preserve surface
finishes and other part features,
particularly those comprising the
shielding or thermal management
system. Inspect and clean/repair
application parts as needed
prior to installing new Products.
If possible, inspect removed
materials for wear, damage,
performance and other features
that may indicate conditions
requiring attention. Consult with
Parker regarding appropriate
removal tools and procedures.
4.0 Storage
Storage conditions can affect
Product integrity and performance,
and pose safety issues. These
include temperature extremes,
contamination and time. Storage
procedures should address
these issues. Typically, the
Products should be kept at room
temperature, and away from
temperature extremes or high
humidity. Product lots and part
numbers should be identified and
tracked to ensure attention to shelf
life and that the correct Products
are always installed. Products
installed on stored equipment
should also be protected from
potential temperature and
environmental effects. Avoid
sulfur containing packaging
materials when storing conductive
Chomerics
elastomers as it will promote
corrosion. Their working life must
also be tracked and distinguished
from typical bulk/bag storage life.
Discuss proper storage procedures
with Parker engineers. Follow
guidelines in Parker literature
for special handling and storage
instructions.
must analyze all aspects of the
application, follow applicable
industry standards, and follow the
information concerning the product
in the current product catalog and
in any other materials provided
from Parker or its subsidiaries or
authorized distributors.
4.1 Maintenance
Users of these Products
should establish maintenance
procedures, and these are
typically determined through
customer component testing.
Maintenance should normally
include Product inspection, correct
part replacement, and for those
specific Products approved by
Parker, conditioning of the Product
for reuse. Parker applications
engineers can be consulted when
creating maintenance procedures.
5.0 User
Responsibility
This document and other
information from the world wide
Parker-Hannifin organization
(including Chomerics) and its
subsidiaries and authorized
distributors provide product
or system options for further
investigation by users having
technical expertise. To the extent
that Parker or its subsidiaries
or authorized distributors
provide component or system
options based upon data or
specifications provided by the
user, the user is responsible for
determining that such data and
specifications are suitable and
sufficient for all applications and
reasonably foreseeable uses of
the components or systems. The
user, through its own analysis
and testing, is solely responsible
for making the final selection of
the system and components and
assuring that all performance,
endurance, maintenance, safety
and warning requirements of the
application are met. The user
56
Chomerics Division Of Parker Hannifin Corporation Terms
And Conditions Of Sale (7/21/04)
1. Terms and Conditions of Sale: All
descriptions, quotations, proposals,
offers, acknowledgments,
acceptances and sales of Seller’s
products are subject to and shall
be governed exclusively by the
terms and conditions stated herein.
Seller’s prices for the products
have been established on the
understanding and condition that
the terms set forth herein shall
apply to this sale to the exclusion of
any other terms. Seller expressly
reserves the right to an equitable
adjustment to the price in the event
that any material provision hereof is
deemed not to govern the rights and
obligations of the parties hereto.
Buyer’s acceptance of any offer to
sell is limited to these terms and
conditions. Any terms or conditions
in addition to, or inconsistent with
those stated herein, proposed by
Buyer in any acceptance of an offer
by Seller, are hereby objected to.
No such additional, different or
inconsistent terms and conditions
shall become part of the contract
between Buyer and Seller unless
expressly accepted in writing
by Seller. Seller’s acceptance of
any offer to purchase by Buyer
is expressly conditional upon
Buyer’s assent to all the terms
and conditions stated herein,
including any terms in addition to,
or inconsistent with those contained
in Buyer’s offer. Acceptance of
Seller’s products shall in all events
constitute such assent.
2. Product Selection. If Seller has
provided Buyer with any component
and/or system recommendations,
such recommendations are based
on data and specifications supplied
to Seller by Buyer. Final acceptance
and approval of the individual
components as well as the system
must be made by the Buyer after
testing their performance and
endurance in the entire application
under all conditions which might be
encountered.
3. Payment: Payment shall be made
by Buyer net 30 days from the date
of delivery of the items purchased
hereunder. Any claims by Buyer
for omissions or shortages in a
shipment shall be waived unless
Seller receives notice thereof within
30 days after Buyer’s receipt of the
shipment.
4. Delivery: Unless otherwise
provided on the face hereof, delivery
shall be made F.O.B. Seller’s
plant. Regardless of the method of
delivery, however, risk of loss shall
pass to Buyer upon Seller’s delivery
to a carrier. Any delivery dates
shown are approximate only and
Seller shall have no liability for any
delays in delivery.
5. Warranty: Seller warrants
that the items sold hereunder
shall be free from defects in
material or workmanship for
a period of 365 days from the
date of shipment to Buyer. THIS
WARRANTY COMPRISES THE
SOLE AND ENTIRE WARRANTY
PERTAINING TO ITEMS PROVIDED
HEREUNDER. SELLER MAKES NO
OTHER WARRANTY, GUARANTEE,
OR REPRESENTATION OF
ANY KIND WHATSOEVER.
ALL OTHER WARRANTIES,
INCLUDING BUT NOT LIMITED
TO, MERCHANTABILITY AND
FITNESS FOR PURPOSE, WHETHER
EXPRESS, IMPLIED, OR ARISING
BY OPERATION OF LAW, TRADE
USAGE, OR COURSE OF DEALING
ARE HEREBY DISCLAIMED.
NOTWITHSTANDING THE
FOREGOING, THERE ARE NO
WARRANTIES WHATSOEVER
ON ITEMS BUILT OR ACQUIRED,
WHOLLY OR PARTIALLY,
TO BUYER’S DESIGNS OR
SPECIFICATIONS.
6. Limitation of Remedy: SELLER’S
LIABILITY ARISING FROM OR IN
ANY WAY CONNECTED WITH THE
ITEMS SOLD OR THIS CONTRACT
SHALL BE LIMITED EXCLUSIVELY
TO REPAIR OR REPLACEMENT
OF THE ITEMS SOLD OR REFUND
OF THE PURCHASE PRICE PAID
BY BUYER, AT SELLER’S SOLE
OPTION. IN NO EVENT SHALL
SELLER BE LIABLE FOR ANY
INCIDENTAL, CONSEQUENTIAL
OR SPECIAL DAMAGES OF ANY
KIND OR NATURE WHATSOEVER,
INCLUDING BUT NOT LIMITED TO
LOST PROFITS ARISING FROM OR
IN ANY WAY CONNECTED WITH
THIS AGREEMENT OR ITEMS
SOLD HEREUNDER, WHETHER
ALLEGED TO ARISE FROM BREACH
OF CONTRACT, EXPRESS OR
IMPLIED WARRANTY, OR IN TORT,
INCLUDING WITHOUT LIMITATION,
NEGLIGENCE, FAILURE TO WARN
OR STRICT LIABILITY.
7. Inspection: Seller shall be
given the opportunity to correct or
replace defective products prior
to cancellation. Final acceptance
by Buyer shall take place not later
than 90 days after shipment.
8. Changes, Reschedules and
Cancellations: Buyer may request to
modify the designs or specifications
for the items sold hereunder as well
as the quantities and delivery dates
thereof, or may request to cancel
all or part of this order; however,
no such requested modification or
cancellation shall become part of
the contract between Buyer and
Seller unless accepted by Seller
in a written amendment to this
Agreement. Acceptance of any
such requested modification or
cancellation shall be at Seller’s
discretion, and shall be upon such
terms and conditions as Seller may
require.
9. Special Tooling: A tooling charge
may be imposed for any special
tooling, including without limitation,
ENGINEERING YOUR SUCCESS.
57
dies, fixtures, molds and patterns,
acquired to manufacture items sold
pursuant to this contract. Such
special tooling shall be and remain
Seller’s property notwithstanding
payment of any charges by Buyer.
In no event will Buyer acquire any
interest in apparatus belonging
to Seller that is utilized in the
manufacture of the items sold
hereunder, even if such apparatus
has been specially converted or
adapted for such manufacture and
notwithstanding any charges paid
by Buyer. Unless otherwise agreed,
Seller shall have the right to alter,
discard or otherwise dispose of any
special tooling or other property in
its sole discretion at any time.
10. Buyer’s Property: Any designs,
tools, patterns, materials,
drawings, confidential information
or equipment furnished by Buyer
or any other items which become
Buyer’s property, may be considered
obsolete and may be destroyed by
Seller after two (2) consecutive
years have elapsed without Buyer
placing an order for the items
which are manufactured using
such property. Seller shall not be
responsible for any loss or damage
to such property while it is in
Seller’s possession or control.
11. Taxes: Unless otherwise
indicated on the face hereof, all
prices and charges are exclusive
of excise, sales, use, property,
occupational or like taxes which
may be imposed by any taxing
authority upon the manufacture,
sale or delivery of the items sold
hereunder. If any such taxes must
be paid by Seller or if Seller is liable
for the collection of such tax, the
amount thereof shall be in addition
to the amounts for the items sold.
Buyer agrees to pay all such taxes
or to reimburse Seller therefor
upon receipt of its invoice. If Buyer
claims exemption from any sales,
use or other tax imposed by any
taxing authority, Buyer shall save
Seller harmless from and against
any such tax, together with any
interest or penalties thereon which
may be assessed if the items are
Chomerics
held to be taxable.
12. Indemnity For Infringement
of Intellectual Property Rights:
Seller shall have no liability for
infringement of any patents,
trademarks, copyrights, trade
secrets or similar rights except
as provided in this Part 12. Seller
will defend and indemnify Buyer
against allegations of infringement
of U.S. patents, U.S. trademarks,
copyrights, and trade secrets
(hereinafter ‘Intellectual Property
Rights’). Seller will defend at its
expense and will pay the cost of any
settlement or damages awarded
in an action brought against Buyer
based on an allegation that an
item sold pursuant to this contract
infringes the Intellectual Property
Rights of a third party. Seller’s
obligation to defend and indemnify
Buyer is contingent on Buyer
notifying Seller within ten (10) days
after Buyer becomes aware of
such allegations of infringement,
and Seller having sole control over
the defense of any allegations or
actions including all negotiations
for settlement or compromise. If
an item sold hereunder is subject
to a claim that it infringes the
Intellectual Property Rights of a
third party, Seller may, at its sole
expense and option, procure for
Buyer the right to continue using
said item, replace or modify said
item so as to make it non infringing,
or offer to accept return of said
item and return the purchase price
less a reasonable allowance for
depreciation. Notwithstanding the
foregoing, Seller shall have no
liability for claims of infringement
based on information provided
by Buyer, or directed to items
delivered hereunder for which the
designs are specified in whole or
part by Buyer, or infringements
resulting from the modification,
combination or use in a system
of any item sold hereunder. The
foregoing provisions of this Part
12 shall constitute Seller’s sole
and exclusive liability and Buyer’s
sole and exclusive remedy for
infringement of Intellectual
Property Rights. If a claim is based
on information provided by Buyer or
if the design for an item delivered
hereunder is specified in whole or
in part by Buyer, Buyer shall defend
and indemnify Seller for all costs,
expenses or judgments resulting
from any claim that such item
infringes any patent, trademark,
copyright, trade secret or any
similar right.
13. Export Limitations. The items
sold hereunder are authorized by
the U.S. government for export
only to the country of ultimate
destination indicated on the face
hereof for use by the end-user.
The items may not be transferred,
transshipped on a non-continuous
voyage, or otherwise be disposed
of in any other country, either in
their original form or after being
incorporated into other end-items,
without the prior written approval of
the U.S. government.
14. Commercial Items. Unless
otherwise indicated on the face
hereof, the items being sold
hereunder if sold for military or
government purposes constitute
Commercial Items in accordance
with FAR 2.101, and as such
the assertions delineated in the
DFAR’s 252.227-7013, 252.2277014, 252.227-7017 and FAR
52.227-15 (c) shall not apply to this
contract. Additionally, in view of
the Commercial Item status, any
deliverable technical data and/or
computer software to be provided
will contain Seller’s normal
commercial legend subject to the
restrictions contained therein.
15. Force Majeure: Seller does
not assume the risk of and shall
not be liable for delay or failure to
perform any of Seller’s obligations
by reason of circumstances beyond
the reasonable control of Seller
(hereinafter ‘Events of Force
Majeure’). Events of Force Majeure
shall include without limitation,
accidents, acts of God, strikes or
labor disputes, acts, laws, rules or
regulations of any government or
government agency, fires, floods,
58
delays or failures in delivery of
carriers or suppliers, shortages
of materials and any other cause
beyond Seller’s control.
16. Premier™ Conductive Plastics:
Parker Chomerics™ Premier™
conductive plastics are sold
under license solely for use in the
following applications: (i) EMI/RFI
shielding, i.e., electromagnetic and/
or radio frequency interference
shielding or compatibility and
surface grounding therefore; (ii)
earth grounding, corona shielding,
and anti-static and/or electrostatic
discharge protection shielding;
and (iii) as thermally conductive
members to dissipate heat
generated by electronic devices.
The resale of Premier™ conductive
plastics in pellet or any other
raw material form is expressly
prohibited, as is their use in any
application other than as stated
above, and any such resale or use
by you or your customers shall
render any and all warranties null
and void ab initio.
You shall defend, indemnify, and
hold Parker Hannifin Corporation
and its subsidiaries (Parker)
harmless from and against any and
all costs and expenses, including
attorney’s fees, settlements, and
any awards, damages, including
attorney’s fees, and costs, resulting
from any claim, allegation, suit or
proceeding made or brought against
Parker arising from any prohibited
use of Premier™ conductive
plastics by you or your customers.
17. Entire Agreement/Governing
Law: The terms and conditions
set forth herein, together with any
amendments, modifications and
any different terms or conditions
expressly accepted by Seller in
writing, shall constitute the entire
Agreement concerning the items
sold, and there are no oral or other
representations or agreements
which pertain thereto. This
Agreement shall be governed in all
respects by the law of the State of
Ohio. No actions arising out of the
sale of the items sold hereunder or
this Agreement may be brought by
either party more than two (2) years
after the cause of action accrues.
Parker Hannifin plc
Conditions of Sale
(Practice Note: These terms are not
suitable for use in other countries
unless Parker Hannifin Plc is the
Seller) (as of March, 08 2005)
Goods sold under these conditions
are subject to retention of title Condition 10
1. Definitions
In these Conditions:
“the Company” means Parker
Hannifin plc including all divisions
and businesses thereof and any
subsidiary undertaking thereof (as
defined in Sections 258 and 259
Companies Act 1985 as amended);
“Conditions” means the Standard
Conditions of Sale set out in this
document together with any special
terms agreed in writing between
the Company and the Buyer;
“Contract” means any contract
between the Company and the
Buyer for the sale and purchase of
the Goods formed in accordance
with Condition 2;
“the Buyer” means any company,
firm or individual or agent thereof
to whom the Company’s quotation
or acknowledgement of order is
addressed;
“the Goods” means the products
(including any parts or accessories),
materials and/or services to be
supplied by the Company.
2. Applicability Of Conditions
The Company concludes Contracts
for the supply of Goods subject
only to these Conditions. The Buyer
accepts that these Conditions shall
govern relations between himself
and the Company to the exclusion
of any other terms and conditions
including, without limitation,
conditions and warranties written
or oral express or implied even
if contained in any of the Buyer’s
documents which purport to
provide that the Buyer’s own terms
and conditions shall prevail. No
variation or qualification of these
Conditions or of any quotation or
Contract arising herefrom shall
be valid unless agreed in writing
by the Secretary or a Director of
the Company or other person duly
authorised by the Board of Directors
of the Company.
3. Quotations
The Company’s quotations are
given without commitment and no
Contract between the Company and
the Buyer shall arise unless and
until the Company has accepted in
writing the Buyer’s order placed
on the Company’s quotation.
Quotations shall be valid for a
period of 30 days from the date of
issue, or (if different) the period
specified with the quotation itself.
4. Representations
No employee of the Company
other than the Secretary or
a Director of the Company is
authorised to make any statement
or representations as to the Goods,
save that this restriction shall not
apply to any notice or statement
ENGINEERING YOUR SUCCESS.
59
containing a warning or restriction
of use (“Warnings”) which may
be provided in connection with
the Goods. Subject to such
Warnings, the Buyer, therefore,
shall not be entitled to rely or to
seek to rely upon any statement
or representation made by an
employee or agent of the Company
other than the Secretary or a
Director.
5. Prices
(i). Subject to Condition 3, prices
contained in a quotation price list
catalogue and similar matter shall
be based upon current costs ruling
at the date thereof and are for
guidance only. Subject to the later
provisions of this Condition 5 the
contract price shall be the price
current at the date of delivery of
the goods and/or when services are
performed as the case may be.
(ii). Where firm prices are agreed
(including without limitation
any quotation where the price is
fixed pursuant to Condition 3) the
prices will remain firm provided
that full information permitting
manufacture to proceed is received
by the Company promptly after
acknowledgement of the order by
the Company, and further provided
the Buyer takes delivery of the
order when ready. If delivery of the
order or any part thereof is delayed
at the ‘Buyer’s request or through
the Buyer’s failure to provide the
full information mentioned above,
the Company reserves the right to
amend the price of the undelivered
portion to the Company’s price list
prevailing at the date when delivery
is made.
(iii). Where a quotation is given
dependent on information supplied
by the Buyer, the Buyer will be
responsible for the accuracy of
the information given, and for the
supply of all relevant particulars.
Any increased cost incurred either
during or after manufacture
resulting from any inaccuracy or
omission shall be borne by the
Buyer alone and shall be paid
promptly, and independently of the
main contract price.
Chomerics
(iv). Unless otherwise stated prices
do not include VAT which will be
chargeable at the date of despatch
and/or performance of services as
the case may be.
6. Despatch And Delivery
(i). Delivery shall be deemed
to occur and the risk of loss
or damage of any kind in the
Goods shall pass to the Buyer on
whichever of the following events
occur earlier.
(a) collection by or on behalf of the
Buyer or by a carrier for despatch
to the Buyer (whether or not such
carrier be the Company’s agent or
servant)
(b) 14 days from the date of notice
given by the Company that the
Goods are ready for collection or
despatch.
(ii). In the event that the Company
shall at the specific request of the
Buyer store the Goods or arrange
for the Goods to be despatched
or dealt with otherwise than by
collection by the Buyer then the
Buyer shall pay to the Company
any reasonable charges made in
the Company’s absolute discretion
for the provision or procurement of
such services. Any such services
provided by the Company shall
be performed subject to these
Conditions. In the event that such
services are to be provided by a
carrier or other third party then
the Company shall in arranging for
the provision of the same act only
as the agent of the Buyer and the
Buyer shall indemnify the Company
against any cost, charge liability
or expense (including demurrage)
thereby incurred by the Company.
(iii). The Buyer shall carefully
examine the Goods on receipt of the
same and shall by written notice to
be received by the Company within
21 days of receipt of the Goods
notify the Company of any short
delivery, over delivery or any defects
reasonably discoverable on careful
examination. In the absence of
receipt of such notice, then subject
only to Condition 11, the Company
shall be discharged from all liability
in respect of such defects or short
or over delivery.
(iv). If the Buyer neglects to serve
notice under sub Condition (iii)
above of any over delivery then the
Company may at its option either
repossess the excess Goods or
invoice them and be paid forthwith
by the Buyer for the excess Goods
at the price ruling at the date of
delivery.
7. Time For And Form Of Delivery
(i). The Company will use
reasonable commercial endeavours
to deliver the Goods and to perform
services in accordance with any
time stated in the contract but time
of delivery or performance shall not
be of the essence to the contract.
Any such times are stated by way
of general information only and
in the event of failure to despatch
or deliver or perform within such
times for any cause (whether
within or) outside the Company’s
reasonable control, the same shall
not be a breach or repudiation of
the contract nor shall the Company
have any liability to the Buyer for
any direct, indirect or consequential
loss (all three of which terms
include without limitation pure
economic loss, loss of profits, loss
of business, depletion of goodwill
and like loss) however caused
(including as a result of negligence)
by delay or failure in delivery except
as set out in this Condition 7(i).
Any delay or failure in delivery will
not entitle the Buyer to cancel the
order unless and until the Buyer
has given 60 days’ written notice to
the Company requiring delivery to
be made and the Company has not
fulfilled delivery within that time. If
the Buyer then cancels the order:
(a) the Company will refund the
Buyer any sums the Buyer has paid
to the Company in respect of that
cancelled order; and
(b) the Buyer will be under no
liability to make any payments in
respect of that cancelled order.
(ii). (a) If the Contract does not
otherwise provide the Company
shall be entitled to deliver Goods by
60
single delivery or by instalments at
its option.
(b) If the Contract provides for
delivery by instalments or the
Company so elects each instalment
shall be deemed to be the subject
of a separate contract on these
conditions and without prejudice
to sub-paragraph (i) hereof nondelivery or delay in delivery shall
not affect the balance of the
contract nor entitle the Buyer to
terminate the same.
(iii). In the event that the Goods
shall not have been collected by
or on behalf of the Buyer or by a
carrier for despatch to the Buyer
within 14 days of the Company’s
written notice pursuant to Condition
6 (i) (b) hereof then the Company
may at any time thereafter send to
the Buyer a further notice notifying
the Buyer of the Company’s
intention to sell the same after the
expiration of a period of not less
than 7 days from the date of the
notice and any such sale by the
Company may be on a forced sale
basis. The Buyer shall be liable
for the Company’s charges and
expenses for the sale and for the
storage of the Goods (which shall
be at the risk of the Buyer) pending
their sale hereunder or delivery
to the Buyer. The Company shall
charge all costs incurred on a
weekly basis for storage.
8. Performance Prevented Or
Hindered
The Company shall not be liable
for any delay of failure in carrying
out its obligations which is caused
wholly or partly by reason of act of
God, delay in transportation, labour
disputes, fire, flood, war, accident,
Government action, inability to
obtain adequate labour, materials,
manufacturing facilities or energy,
or any other cause beyond the
Company’s control or that of its
servants or agents, and if the delay
or failure has continued for a period
of 3 months then either party may
give notice in writing to the other
determining the contract and on
such termination the Company
shall refund to the Buyer the price
of the Goods or any part thereof
already paid to the Company after
deduction of any amount due to the
Company including any amount
under Condition 17 hereof.
9. Payment
(i). Unless expressly agreed in
writing payment shall be made in
sterling in cleared funds without
any deduction set-off, restriction
condition or deferment on account
of any disputes or cross claims
or present or future taxes, levies,
duties or charges whatsoever
(unless and to the extent the Buyer
is required by law to make such
deduction) on or before the last day
of the month following the month
of the invoice for the Goods. Where
full payment is not received by the
due date interest shall accrue on
the sum outstanding at the rate
of 3% per annum above the base
rate of Lloyds Bank plc (as varied
from time to time) calculated on a
daily basis but without prejudice
to the Company’s rights to receive
payments on the due dates.
(ii). Time for payment shall be of the
essence and in the event of delay
or default in any payment for more
than 7 days, the Company shall
be entitled to suspend deliveries
of Goods (being those Goods the
subject of the default and any other
Goods the subject of any agreed
order) and/or treat the Contract
(and any other Contract between
the Company and the Buyer) as
repudiated and/or re sell any of
the Goods in its possession and be
indemnified by the Buyer for any
loss thereby incurred.
(iii). All sums payable to the
Company under the Contract
will become due immediately on
termination of the Contract.
(iv). The Buyer shall pay for any
samples, sale or return, loan
or demonstration goods and/or
materials, including drawings,
plans, specifications etc. not
returned within one month from the
date of receipt by the Buyer unless
a different period for the return
of such goods and/or materials is
agreed between the Company and
the Buyer.
10. Property In Goods
(i) The Company shall retain
absolute ownership of the property
in the Goods which shall not pass to
the Buyer and the Buyer shall keep
and retain the Goods as bailee for
and on behalf of the Company and
shall deliver up the Goods to the
Company at the Company’s request
until the Company has received full
payment of the price of the Goods
and full payment of any other sums
whatsoever which are outstanding
from the Buyer to the Company
whether or not due and owing, and
until such time the Buyer:
(a) shall insure the Goods against
the usual risks with an insurance
office of repute;
(b) shall store separately the Goods
or in some other way ensure that
the Goods are readily identifiable as
the property of the Company;
(c) irrevocably authorises the
representatives of the Company at
any time in circumstances where
the provisions of Condition 19 may
apply to enter the Buyer’s premises
where the Goods are or are thought
by the Company to be stored for the
purpose of repossessing the Goods;
(d) shall keep and retain the Goods
free from any charge lien or other
encumbrance thereon.
(ii). Provided always that no
circumstances have arisen where
the provisions of Condition 17
may apply the Buyer shall be
entitled to offer for sale and sell
the Goods in the ordinary course
of business as principal and not
as agent at the best obtainable
price, and shall be a sale of the
Company’s property on the Buyer’s
own behalf and the Buyer will deal
as principal in respect of such
sale. Notwithstanding the other
provisions of the Contract, payment
shall become due (unless payment
ENGINEERING YOUR SUCCESS.
61
has already become due or been
paid) when the Buyer receives
payment upon its own sale of the
Goods (or other items incorporating
the Goods).
(iii). If the Buyer incorporates any
Goods within other equipment
or products provided that the
Goods remain readily identifiable
and a removable part of such
other equipment or products the
provisions of Condition 10(i) shall
apply.
(iv). If the provisions of Condition
10(iii) apply the Buyer shall store
separately the other equipment or
products incorporating the Goods
and shall notify the Company of
the precise location and position
thereof. The provisions of Condition
10(ii) hereof shall apply mutatis
mutandis in respect of the Goods
contained within such other
equipment or products owned by
the Company.
(v). The Company shall be entitled
to exercise a general lien or right
of retention on all goods or any
parts thereof in the Company’s
possession which are the Buyer’s
property for any sums whatsoever
due to the Company and pursuant
to such lien or right the Company
shall be entitled without notice to
the Buyer to sell all or any part of
such Goods or part thereof privately
or by auction or otherwise and
to keep the proceeds of sale in
diminution of such sums and of all
costs and expenses incurred by the
Company in effecting the said sales.
11. Warranty And Limitation Of
Liability
(i). The Company warrants that
products, parts or materials
manufactured by it will be of
good materials and workmanship
and that reasonable care will
be employed in assembling
or incorporating items not
manufactured by it and in
performing services so that upon
the Buyer giving written notice
to the Company that Goods have
not been supplied or services
performed as aforesaid if the same
Chomerics
be established the Company will at
its own expense at its option replace
or repair such defective goods or
remedy such defaults in service.
The warranty obligation shall not
apply where the Goods have been
tampered with, improperly altered,
repaired or maintained, installed
or connected or subject to misuse
(in each case other than as a result
of the Company’s own acts or
omissions). The Buyer shall at its
own cost return the Goods to the
Company for inspection.
(ii). The same term shall apply
mutatis mutandis in respect of such
replacement, repair or remedial
services.
(iii). The above warranty shall apply
in respect of matters whereof the
Buyer gives written notice within
12 months of delivery or 6 months
from installation (whichever is the
shorter period) or within 12 months
of performance or of replacement
repair or remedial services
respectively after which any claim in
respect thereof shall be absolutely
barred (subject to the other
provisions of this Condition 11).
(iv) . The Company does not exclude
its liability (if any) to the Buyer:
(a) for breach of the Company’s
obligations arising under Section 12
Sale of Goods Act 1979 or Section
2 Supply of Goods and Services Act
1982;
or consequential loss (all three
of which terms include, without
limitation, pure economic loss,
loss of profits, loss of business,
depletion of goodwill and like loss)
howsoever caused arising out of or
in connection with:
(a) any of the Goods, or the
manufacture or sale or supply, or
failure or delay in supply, of the
Goods or performance or failure or
delay in performance of services by
the Company or on the part of the
Company’s employees, agents or
sub-contractors;
(b) any breach by the Company of
any of the express or implied terms
of the Contract;
(c) any use made or resale by the
Buyer of any of the Goods, or of any
product incorporating any of the
Goods;
(d) any statement made or not
made, or advice given or not given,
by or on behalf of the Company.
(vi). Except as set out in Conditions
7(i) and 11(i) to (iv), the Company
excludes to the fullest extent
permissible by law all conditions,
warranties and stipulations,
express (other than those set out in
the Contract) or implied, statutory,
customary or otherwise which, but
for such exclusion, would or might
subsist in favour of the Buyer.
(e) for fraud.
(vii) Each of the Company’s
employees, agents and
subcontractors may rely upon
and enforce the exclusions
and restrictions of liability in
Conditions 7(i) and 11(iv) to (vi) in
that person’s own name and for
that person’s own benefit as if
the words “its employees, agents
and subcontractors” followed
“Company” where it appears in
those Conditions (save for Condition
11(v)(a)).
(v). Except as provided in Conditions
7(i) and 11(i) to (iv), the Company
will be under no liability to the
Buyer whatsoever (whether in
contract, tort (including negligence),
breach of statutory duty, restitution
or otherwise) for any injury,
death, damage or direct, indirect
(viii). Without prejudice to the
foregoing if called upon so to do by
the Buyer in writing the Company
shall use its best endeavours to
assign to the Buyer the benefits
of any warranty, guarantee,
indemnity, claim, privilege or other
rights which the Company may
(b) for personal injury or death
resulting from the Company’s
negligence;
(c) under section 2(3) Consumer
Protection Act 1987;
(d) for any matter which it would be
illegal for the Company to exclude
or to attempt to exclude its liability;
or
62
have in regard to manufacturers
or suppliers of any goods not
manufactured by the Company in
relation to the quality, condition or
description of such goods.
12. Operating Instructions
(i) The Company supplies with the
Goods adequate information as
to their design and conditions of
the instructions for operation for
compliance with its obligations
under Section 6 (1) (c) of the Health
and Safety at Work Act 1974.
(ii) The Buyer undertakes that all
necessary steps will be taken to
ensure that the Goods will be safe
and without risk to health when
properly used in accordance with
Section 6 (8) of the Health and
Safety at Work etc. Act 1974.
13. Drawings, Specifications Etc.
(i) All descriptions, drawings,
illustrations, particulars of
weights and measures rating
standard statements or details or
specifications or other descriptive
matter, whether or not contained
in the contract document, are
approximate only. The Goods
will be in accordance with the
Company’s specifications at the
time of manufacture and any
earlier specifications drawings,
descriptions, illustrations,
particulars as to weights and
measures rating standard
statements or details shall not
form part of the description of the
parts or services supplied or to be
supplied so that the Company shall
not be under any liability in respect
thereof.
(ii) Where Goods are supplied
by the Company to the Buyer
in accordance with the Buyer’s
design or specification or where
the Company shall design items
not within the standard range of
products at the Buyer’s request
no warranty is given or implied
as to the suitability of such goods
or items unless the Buyer has
made the Company aware of the
particular purpose for which the
Buyer is proposing to use the goods
or items in which case Condition
11 shall apply. The Company shall
be entitled to charge a fee for any
research or design undertaken in
connection with the supply of Goods
not within their standard range of
products.
14. Inspection And Testing
The Company undertakes
inspection of all Goods prior to
delivery and where practicable
submits to standard tests at the
Company’s premises Special tests
or standard tests in the presence
of the Buyer or his representative
may be undertaken by the Company
at the request and expense of the
Buyer but unless otherwise agreed
such tests shall be conducted at the
Company’s premises.
15. Industrial Property Rights
(i) All intellectual property rights
subsisting in or relating to any
calculations, data, specifications,
designs, drawings, papers,
documents, procedures, techniques,
acceptance, maintenance and other
tests special and recommended
parts and other equipment and
any other material and information
whatsoever given to the Buyer by
the Company in connection with
the supply of the Goods by the
Company to the Buyer or otherwise
are vested in the Company. The
Buyer will not whether by itself
its officers servants agents or any
of them or otherwise howsoever
copy or reproduce any such items
or material in whole or in part nor
will it disclose any such information
in whole or in part to any third
party. Further the Company shall
be entitled to the ownership of
all intellectual property rights
subsisting in or relating to any
calculations, data, specifications,
designs, drawings, papers,
documents or other items material
or information conceived originated
developed or produced by the
Company for the Buyer pursuant to
the contract for the supply of Goods.
(ii) The Buyer shall not at any time
for any reason whatsoever disclose
or permit to be disclosed to any
person or persons whatsoever or
otherwise make use of or permit to
be made use of any trade secrets
or other confidential information
relating to the equipment
technology business affairs or
finances of the Company or any
associated Company or organisation
of the Company or relating to the
Company’s agents distributors
licensees or other customers or in
respect of any of their dealings or
transactions.
(iii) The Buyer shall not seek to
apply or apply to register in its
own name any of the Company’s
intellectual property rights and
in particular those subsisting in
or relating to the Goods or a part
thereof nor shall it represent in
any way that it has any right or
title to the ownership of any such
intellectual property rights nor shall
it do any act or thing which might be
contrary to the interest or rights of
the Company in such rights and in
particular challenge the ownership
or validity of such rights.
(iv) The Buyer at its own expense
shall do all such acts and things
and shall sign and execute all
such deeds and documents as
the Company in its sole discretion
may require in connection with
any steps or proceedings taken
by the Company to restrain the
infringement of it intellectual
property rights.
(v) The Buyer undertakes and
agrees that the use of any of its
calculations, data, specifications,
designs, drawings, papers,
documents, procedures, techniques,
acceptance, maintenance and other
tests special and recommended
parts and other equipment and
other material and information by
the company when manufacturing
and supplying the Goods will not
infringe any intellectual property
ENGINEERING YOUR SUCCESS.
63
rights of a third party and shall
indemnify the Company in respect
of any such infringement.
(vi) The Buyer shall not alter or
remove any trade mark of the
Company which has been applied to
the Goods nor apply any other trade
mark to the Goods nor make any
alteration to their packaging and
get up.
(vii) The provisions of this Condition
15 shall survive the expiry or
termination of any Contract for
whatever reason.
16. Sub Contracting
The Company shall be entitled
to sub contract all or any of its
obligations hereunder.
17. Determination
If the Buyer shall make default in
or commit a breach of the contract
or of any of his obligations to the
Company or if any distress or
execution shall be levied upon the
Buyer’s property or assets, or if the
Buyer shall make or offer to make
any arrangement or composition
with creditors or commit any act
of bankruptcy, or if any petition or
receiving order in bankruptcy shall
be presented or made against him,
or if the Buyer is a limited company
and any resolution or petition to
wind up such company’s business
(other than for the purpose
of a solvent amalgamation or
reconstruction) shall be passed or
presented, or if a receiver of such
company’s undertaking property or
Chomerics
assets or any part thereof shall be
appointed the Company shall have
the right forthwith to determine any
Contract then subsisting and upon
written notice of such determination
being given to the Buyer any
subsisting Contracts shall be
deemed to have been determined
and the Company shall be entitled
to recover from the Buyer all losses
thereby arising including but not
limited to those under Condition 18
of these Conditions or otherwise.
18. Partial Completion
In the case of partial completion
of an order by reason of any of the
events referred to in Conditions 8
or 17 the Company shall be entitled
to a quantum meruit in respect
of all work done by it including
labour costs and materials and
any charges or expenses which the
Company is committed to pay sub
contractors or third parties without
prejudice to its rights should non
completion be occasioned by the
Buyer.
20. Waiver
Any failure by the Company to
enforce any or all these Conditions
shall not be construed as a waiver
of any of the Company’s rights.
21. Contracts (Rights Of Third Parties) Act
The parties to the Contract do not
intend that any of its terms will
be enforceable by virtue of the
Contracts (Rights of Third Parties)
Act 1999 by any person not a party
to it.
22. Law And Interpretation
The Contract shall be governed
by English law and the Buyer
shall submit to the non exclusive
jurisdiction of the English Courts.
If any of these Conditions or any
part thereof is rendered void or
unenforceable by any legislation to
which it is subject or by any rule of
law it shall be void or unenforceable
to that extent and no further.
19. Notices
Unless otherwise provided in
writing any written communication
or notice under the Contract shall
be made or given by sending the
same by ordinary prepaid first
class letter post in the case of the
Company to its current address and
in the case of the Buyer to its last
known address and if so sent shall
be deemed to be made or given two
days after the date when posted.
64
Notes:
ENGINEERING YOUR SUCCESS.
65
Notes:
Chomerics
66
Parker Chomerics Capabilities include:
THERMAL MANAGEMENT
& CONTROL
ä
ä
ä
ä
ä
ä
ä
ä
ä
ä
ä
Thermally conductive gap filler pads
Fully cured dispensable thermal gels
Silicone-free thermal pads
Phase-change materials (PCM)
Polymer solder hybrids (PSH)
Dispensable thermal compounds
Thermal grease
Dielectric pads
Thin flexible heat spreaders
Custom integrated thermal/EMI assemblies
RF absorbing gap filler pads
EMI SHIELDING & COMPLIANCE
ä Conductive elastomers – molded, extruded, and
form-in-place (FIP)
ä Conductive foam based gaskets – fabric-over-foam
and z-axis foam
ä Conductive compounds – adhesives, sealants and
caulks
ä RF absorbing materials
ä EMI shielding plastics and injection molding services
ä Coatings – direct metallization and conductive paints
ä Metal gaskets – Springfingers, metal mesh and
combination gaskets
ä Foil laminates and conductive tapes
ä EMI shielding vents – commercial and military
honeycomb vents
ä Shielded optical windows
ä Cable shielding – ferrites and heat-shrink tubing/wire
mesh tape/zippered cable shielding
ä Compliance and safety test services
OPTICAL DISPLAY PRODUCTS
ä EMI shielding filters
(conductive coating & wire mesh)
ä Ant-reflective/contrast enhancement filters
ä Plastic or glass laminations
ä Hard coated lens protectors
ä Touchscreen lenses
PLASTIC INJECTION MOLDING
ä PREMIER® and other filled, electrically-conductive
plastics
ä Traditional thermoplastics
ä EMI and cosmetic coating services
ä EMI and environmental gasket integration
ä Assembly, pad printing, hot stamping, welding, and
heat staking
ä Insert molding, two-shot molding, and overmolding
capability
About Parker Hannifin Corporation
With annual sales exceeding $10 billion, Parker Hannifin is the world’s leading diversified manufacturer of motion and
control technologies and systems, providing precision-engineered solutions for a wide variety of mobile, industrial and
aerospace markets. The company’s products are vital to virtually everything that moves or requires control, including
the manufacture and processing of raw materials, durable goods, infrastructure development and all forms of transport.
Traded on the New York Stock Exchange under the symbol “PH,” Parker is strategically diversified, value-driven and well
positioned for global growth as the industry consolidator and supplier of choice.
ENGINEERING YOUR SUCCESS.
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