Automotive Solutions - TOSHIBA Semiconductor

Automotive Solutions - TOSHIBA Semiconductor
System Catalog May 2017
Automotive Solutions
SEMICONDUCTOR
&
STORAGE PRODUCTS
h t t p s : // t o s h i b a . s e m i c o n - s t o r a g e . c o m /
With Vision and Intellect, You Can Make It!
Semiconductor devices fulfill a major role
in the evolution of automobiles.
Toshiba's Three Core Technologies
Automobiles have been making tremendous progress in terms of safety,
Technology to assist in safe driving
environmental performance, and the utilization of information technology.
Now, a suite of driver-assist technologies that enhance both vehicle and driver safety are attracting much attention,
such as collision avoidance, parking assist and self-driving.
Toshiba offers various automotive semiconductor devices designed to improve driving safety,
including advanced driver assistance systems (ADAS) using an image recognition processor.
Technology to protect the global environment
Information technology to enhance ride comfort
Toshiba provides leading-edge semiconductor technologies from a future perspective to deliver comprehensive
driver assistance solutions such as self-driving that emulate human eyes and other intricate human senses.
CONTENTS
Safety
Advanced Driver Assistance Systems
(ADAS) …………………………………………… 4
Parking Assist Systems ………………………… 6
Visconti™ Image Recognition Processors …… 7
Automotive Display Controllers Capricorn™ … 10
Automotive Video Processors ………………… 12
Functional Safety ………………………………… 14
Environment
HEVs, PHEVs, EVs and Inverters ……………… 16
Applications ……………………………………… 17
Automotive Microcontrollers …………………… 21
Analog Devices…………………………………… 22
System Power Supply ICs for Automotive …… 23
Brushed DC Motor Driver ICs ………………… 24
Brushless DC Motor Driver ICs ………………… 25
Automotive Intelligent Power Devices
(IPDs) ……………………………………………… 26
Automotive Discrete Devices …………………… 27
Photocoupler for Automotive Applications …… 30
Information
Storage for Information and
Entertainment Applications …………………… 31
Information and Entertainment Applications … 32
Interface Bridge ………………………………… 34
Automotive RF Devices ………………………… 35
Bluetooth®-Compliant ICs ……………………… 36
Car Audio ………………………………………… 37
Power Amplifier ICs ……………………………… 38
For the latest information about Toshiba's semiconductor devices,
including automotive devices, please visit the following URL:
https: // toshiba.semicon-storage.com /
2
Speech Middleware
(ToSpeak™ and Voice Trigger) ………………… 39
This catalog contains the latest information available as of May 8, 2017.
3
Safety: Advanced Driver Assistance Systems(ADAS)
Toshiba offers the Visconti™ Family of image recognition processors that provide extensive
support for image feature extraction and recognition using automotive cameras while offering an
excellent combination of high performance and low power consumption. Our image recognition
processors can run multiple image recognition applications in parallel and support system
solutions for reliable nighttime pedestrian recognition.
WADAS: Front and Surround View Monitoring Solution
The Visconti™ Family of image recognition processors is capable of
processing input images from one to four cameras in real time (and
allow connection of up to eight cameras). The Visconti Family can run
multiple ADAS applications in parallel to recognize vehicles, pedestrians, traffic lines, traffic signs and the like around the vehicle on which it
is mounted. Possible applications include vehicle detection and
collision warning; pedestrian detection and collision warning; lane
detection and departure warning; traffic sign recognition; and red-signal
detection. The Visconti Family combines high performance and low
power consumption. In order to achieve high visibility of pedestrians in
dark places where neither headlights nor street lamps reach, the Visconti4
Series combines CoHOG (Co-occurrence Histograms of Oriented
Gradients) with Color-CoHOG and three other types of color-based
feature descriptors.
Camera
CMOS
Image
Sensor
Image Recognition System for Front
and Surround View Monitoring
CMOS I/F
(RGB888, YCbCr422, BT.656,
8- 10- 12- 14- 16-bit RAW, or Y8 Y10 Y12)
LPDDR2
SDRAM
or
Image Recognition
System for Front
and Surround
Monitoring
Camera
* Monocular or
stereo camera
Video Decoder
IC
CVBS
(NTSC/PAL)
Visconti4
TMPV7608XBG
Image
Recognition
Processor
BT.656
CAN
Serial
NOR
Flash
CAN
MCU
MIPI® CSI-2 I/F
Camera
Camera
* Shown above is a typical system block diagram using the TMPV7608XBG of the Visconti4 Series.
Visit our website for examples of system block diagrams using other processors.
CAN
WImage Recognition Processors
Part Number
Series
CPU
TMPV7608XBG
Visconti4
Series
8
Affine Transformation, Filter, Histogram,
HOG, Enhanced CoHOG, Matching,
Pyramid, SfM
4
Visconti3
Series
Toshiba-original
32-bit RISC MeP and
ARM®Cortex®-A9 MPCore
TMPV7506XBG
TMPV7504XBG
Image Processing Accelerator
Two Toshiba-original
32-bit RISC MePs
TMPV7602XBG**
TMPV7528XBG
MPE
Video
Input
Main Features
Package
Up to
8 ch.*
On-chip Memory, Memory Controller, CAN,
I2C, UART, SPI, PCM, Timer/Counter,
External MCU Interface, etc.
PFBGA796
On-chip Memory, Memory Controller,
CAN FD, CAN, I2C, UART, SPI, PCM,
Timer/Counter, External MCU Interface,
Power Management Unit, etc.
PLFBGA521
Affine Transformation, Filter, Histogram,
Up to
HOG, Enhanced CoHOG, Matching, Pyramid 2 ch.*
Affine Transformation, Filter, Histogram,
HOG, Matching
On-chip Memory, Memory Controller,
PCI Express®, CAN, I2C, UART, SPI,
PCM, Timer/Counter,
External MCU Interface, etc.
Up to
4 ch.
4
Visconti2
Series
Affine Transformation, Filter,
Histogram, Matching
Up to
2 ch.
On-chip Memory, Memory Controller, CAN,
I2C, UART, SPI, PCM, Timer/Counter,
External MCU Interface, etc.
Affine Transformation, Filter, Histogram,
HOG, Matching
1 ch
On-chip Memory, Memory Controller, CAN,
I2C, UART, SPI, PCM, Timer/Counter, etc.
Toshiba-original
32-bit RISC MeP
2
TMPV7502XBG
PBGA516
* The video input interface of the TMPV7608XBG has a 4-of-8 video switch.
* The video input interface of the TMPV7602XBG has a 1-of-2 video switch.
PLFBGA324
**: Under development
WVideo Decoder ICs
Part Number
Features & Functions
TC90105FG
Two video decoder channels, 2.5-V voltage regulator, newly developed
picture adjustment function, horizontal aberration correction, ITU-R BT.656 output
Operating Temperature Supply Voltage (V)
– 40 to +85˚C
TC90107FG
4
One video decoder channel, 2.5-V voltage regulator, newly developed
picture adjustment function, horizontal aberration correction, ITU-R BT.656 output
1.4 to 1.6
2.3 to 2.7
3.0 to 3.6
Package
LQFP 80pin 12 x 12 mm
LQFP 64pin 10 x 10 mm
WADAS Monocular-Camera Rear-View Monitoring Solution
(Rear-View Monitor, Electronic Rear-View Mirror, Electronic Door Mirrors)
The TMPV7502XBG of the Visconti2 Series combines high image recognition performance with low power consumption (0.6 W typical, as
measured by Toshiba) due to the use of only a single video input interface channel for a monocular camera. Consequently, the TMPV7502XBG is
available in a small package. It is suitable for rear-view monitor applications that provide vehicle and pedestrian recognition and moving-object
detection capabilities, as well as for electronic room mirror and door mirror applications.
Image Recognition
System for
Rear-View
Monitoring
Camera
CAN
Image Recognition System for
Rear-View Monitoring
CMOS
Image
Sensor
Video Decoder
IC
Camera
Electronic Rear-View Mirror
(Application Example)
CMOS I/F
YCbCr422 (8-bit),
8- 10- 12-bit Bayer,
BT.656 or Y8 Y10 Y12
or
CVBS
(NTSC/PAL)
BT.656
Display
NOR
Flash
Visconti2
TMPV7502XBG
Image
Recognition
Processor
DDR2
SDRAM
CAN
Transceiver
MCU
* Shown above is a typical system block diagram using the TMPV7502XBG of the Visconti2 Series.
Visit our website for examples of system block diagrams using other processors.
CAN
WVisconti2 TMPV7502XBG Evaluation Board
HDMI®
Monitor
Debugging
1
Q
A
Z
®
Camera
HDMI
Visconti2
TMPV7502XBG
Evaluation Boards
(USB)
X
S
C
W
D
V
2
E
F
B
3
R
G
N
4
T
H
M
5
Y
J
6
U
K
7
I
L
8
O
9
P
0
PC
Console Serial
(USB)
Power Supply
(USB)
* MIPI is a registered trademark owned by the MIPI Alliance.
* HDMI is a trademark or registered trademark of HDMI Licensing, LLC in the United States and/or other countries.
* ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere.
* PCI Express and PCIe are trademarks or registered trademarks of PCI-SIG.
5
Parking Assist Systems
Toshiba’s Visconti™ image recognition processors are suitable for parking assist applications that
help drivers safely park their vehicles. From camera images, these image recognition processors
recognize parking stripes and detect pedestrians, vehicles and moving obstacles around a vehicle.
The image recognition processor can be combined with the Capricorn™ display controller and a
video processor to display a top-view image and parking stripes on the instrument cluster or center
information display.
Camera
Image Recognition System
for Parking Assist and
Top-View Monitoring
Camera
Camera
CAN
Camera
Image Recognition System for
Parking Assist and
Top-View Monitoring
CMOS
Image
Sensor
CMOS I/F
(RGB888 (up to 2 ch),
YCbCr422, BT.656,
8- 10- 12-bit Bayer,
or Y8 Y10 Y12)
CVBS
(NTSC/PAL)
Video
Decoder
IC
DDR2
SDRAM
Image
Recognition
Processor
Visconti2
Visconti3
or
BT.656
Display Section
LPDDR
SDRAM
NOR
Flash
Display
Controller
CapricornTM
Navigation and Center Information Panel/
Instrument Cluster
NOR
Flash
Camera
CAN
MCU
CAN
MCU
* Shown above are typical system block diagrams using the
TMPV7506XBG of the Visconti2 Series and the
TMPV7528XBG of the Visconti3 Series.
Visit our website for examples of system block diagrams
using other processors.
CAN
WImage Recognition from
Top and Rear Views
WParking Assist by
Line Rendering
WLineup
Series
Visconti4
Part Number
Page
TMPV7602XBG**
Image recognition
processors
Visconti3
TMPV7528XBG
7, 8, 9
TMPV7506XBG
Visconti2
TMPV7504XBG
TMPV7502XBG
**: Under development
Series
Video processors
Dual/single-picture
video processors
Video Decoder ICs
Part Number
Page
TC90195XBG
TC90175XBG**
12, 13
TC90105FG
TC90107FG
**: Under development
6
Series
Automotive display
controllers
TMPV7608XBG
Part Number
Capricorn-Bt 1
TMPR461XBG-300
Capricorn-Bt 0
TMPR460XBG-300
* Capricorn is a trademark of Toshiba Corporation.
Page
10, 11
ViscontiTM Image Recognition Processors
Running image recognition algorithms necessary for an ADAS at high speed and low power consumption
WFeatures
WDriving Assistance Applications
The Visconti™ Family of image recognition processors processes input
images from in-vehicle cameras and detects the motion of human beings,
and their heads and arms as well as vehicles and other objects. The
Visconti Family can provide recognition results in various manners, such
as marking the recognized objects over a camera image on an LCD
panel, alerting the driver with a voice message or beep, or notifying other
electronic units via a communication interface.
The Visconti Family recognizes, in real time, traffic lines, vehicles,
pedestrians, traffic signs, etc. around the vehicle on which it is mounted,
using image data from one to four cameras (out of up to eight), thus
enabling various advanced driver assistance applications. Possible
applications include lane departure warning, forward/backward collision
warning, forward/backward pedestrian collision warning, traffic sign
recognition, and top-view parking assistance. The Visconti Family
incorporates up to eight Media Processing Engines and various image
processing accelerators.
Since the Visconti Family can run up to eight image recognition
applications in parallel, it is suitable for advanced driving assistance
applications.
OTop-View Parking Assist
OObstacle and Pedestrian Detection
ODriver Authentication
ODriver Monitoring
OPassenger Monitoring
OLane Departure Warning
OForward Collision Warning
OTraffic Sign Recognition
OTraffic Signal Recognition
OIntersection Assist
ONight Vision
OForward Pedestrian Collision Warning
OLane Change Assist
OBackward Collision Warning
OBackover Prevention (BOP)
OLeft/Right-Turn Awareness
OBlind-Spot Detection
OLane Change Assist
WRoadmap of the Visconti Family of Image Recognition Processors
Color / Grayscale camera
2.0 mega-pixel
Next gen
N
New
a
Color / Grayscale camera
1.3 mega -pixel
- pixel
V
Visconti4
Series
TMPV7608X
TMPV7608XBG
G
Visconti3
conti3 Serie
Series
ARM Cortex-A9 MPCore
Camera input: x8*
*4 ch Selection in 8 ch Input
(CMOS + MIPI®)
TMPV7528XBG
Visconti2 Series
New
Small package (17 mm x 17 mm)
Low power consumption
mptio
Under development
Camera input:
p x4
TMPV7506XBG
TMPV7506
6XBG
6XBG
TMPV7602XBG
Camera input: x4
T5BG3XBG
G
Camera input: x2*
*2 ch Selection in 1 ch Input
(CMOS + MIPI®)
TMPV7504XB
TMPV7504XBG
BG
Grayscale camera
era
Camera input: x3
Small package (11 mm x 11 mm)
Camera input: x2
T
TMPV7502XBG
Camera
Ca
amera inpu
input:
t: x1
WLineup
PCI Express
UART
SPI
I2C
CAN FD
CAN
PCM
1
4
−
2
2
−
−
2
1
−
5
4
4
−
3
2
−
−
−
4
1
1
5
4
4
−
3
2
−
−
−
4
1
1
5
4
4
−
3
2
−
2
1
−
5
4
4
2
2
2
8
2
−
5
4
8
−
3
2
266.7
−
TMPV7506XBG
266.7
TMPV7528XBG
266.7
(300)
TMPV7602XBG**
266.7
TMPV7608XBG
266.7
−
Visconti4
* The video input interface of the TMPV7602XBG has a 1-of-2 video switch.
* The video input interface of the TMPV7608XBG has a 4-of-8 video switch.
* The value in parentheses below the maximum operating frequency of the TMPV7528XBG
indicates the clock rate of the embedded ARM core.
* Contact the Toshiba sales representative for information about RoHS compliance before you
purchase any components.
Memory
Controller
Toshiba's Proprietary
32-bit RISC CPU MeP
CPU Core
DDR2-SDRAM,
SRAM, ROM,
NOR Flash
DDR2-SDRAM,
SRAM, ROM,
NOR Flash
DDR2-SDRAM,
SRAM, ROM,
NOR Flash
DDR2-SDRAM,
SRAM, ROM,
NOR Flash
LPDDR2-SDRAM,
SRAM, ROM,
NOR Flash
LPDDR2-SDRAM,
SRAM, ROM,
NOR Flash
* Visconti is a trademark of Toshiba Corporation.
* MIPI is a registered trademark owned by the MIPI Alliance.
* MediaLB is a registered trademark of Microchip Technology Inc. in the US and
other countries.
* PCI Express and PCIe are trademarks or registered trademarks of PCI-SIG.
ARM 32-bit RISC
ARM® Cortex®-A9
MPCore
TMPV7504XBG
SfM
5
Matching
−
Enhanced CoHOG
1
−
Histogram
1
266.7
Histogram of Oriented
Gradients [HOG]
−
TMPV7502XBG
Filter
−
Pyramid
Video Output Interface (ch)
Visconti3
Video Input Interface (ch)
Visconti2
Part Number
Affine Transformation
Series
Maximum Operating
Frequency (MHz)
(MeP, MPE)
Media Processing
Engine [MPE]
Image Processing Accelerator
Package
−
PLFBGA324
−
PBGA516
−
PBGA516
PBGA516
−
PLFBGA521
−
PFBGA796
**: Under development
7
ViscontiTM Image Recognition Processors
Visconti4 Series
New Product
TMPV7608XBG: Improved recognition of nighttime pedestrians and parallel execution of up to eight image
recognition applications
WSystem Block Diagram
WPackage
Serial
NOR Flash
Package size
27 mm x 27 mm
V isconti4
Serial NOR
SRAM/NOR
Memory Controller Memory Controller
Camera Image
Inputs
(Up to 8 ch)
The TMPV7608XBG allows an ADAS to realize nighttime
pedestrian recognition as reliable as daytime pedestrian
recognition available with conventional vision systems. Toshiba’s
original Enhanced CoHOG (Co-occurrence Histograms of
Oriented Gradients) accelerators combine the conventional
luminance-based CoHOG feature descriptors with four types of
color-based feature descriptors. This enhancement leads to a
remarkable improvement in the recognition accuracy, especially
at nighttime and at scenes with less luminance differences
between objects and the background. Additionally, the Enhanced
CoHOG accelerators deliver outstanding computational
performance, reducing the time taken for recognition.
or
Camera
Camera
Camera
Camera
Camera
Camera
CVBS
(NTSC/ PAL )
V ideo
Decoder
(TC90105FG
etc.)
C MOS I/F
32bit RIS C MeP
Serial
I/Os
C MOS I/F
Media P rocessing E ngines
C MOS I/F
Camera
C MOS I/F
BT.6 5 6
TMPV7608XBG
Video Output
I/Fs
32bit RIS C MeP
RA M
CMOS I/F
(RGB 888, Y CbCr422,
B T.656, 8- 10- 12- 1416-bit RA W, or Y 8 Y 10 Y 12)
V ideo S witches
Camera
DDR SDRAM
Controller
On-chip
P eripherals
Timer/
Counters
MIPI® CSI-2 I/F
V ideo Input I/Fs *
P-FBGA 796 Ball
0.8 mm Ball pitch
LPDDR2-80 0
SDRAM
ROM
MPE 0
MPE 1
MPE 4
MPE 5
MPE 2
GP IO
LE D
MediaLB ® /
MOST
PCM
I/F
MPE 3
L2 Cache
MPE 6
720p
LCD Panel
MPE 7
CAN
I/F
CAN
Transceiver
MCU
I/F
CA N MCU
L2 Cache
Image Processing Accelerators
MIPI® CSI-2 I/F
A ffine Transformation
MIPI® CSI-2 I/F
MIPI® CSI-2 I/F
P yramid
Filter
Enhanced
CoHOG
Matching
Histogram
HOG
S fM
* The video input interface of the TMPV7608XBG has a 4-of-8 video switch.
Features of Visconti
W Feature 1: Parallel execution of up to eight image
recognition applications
The Media Processing Engine (MPE) is suitable for image recognition
and other multimedia processing. It is a very long instruction word
(VLIW) machine that can issue multiple instructions simultaneously. It
consists of Toshiba's proprietary low-power 32-bit RISC core called a
Media Embedded Processor (MeP) and either a coprocessor suitable
for multimedia processing called Image Recognition VLIW Coprocessor
2 (IVC2) or its successor, IVC2 with FPU (IVC2F). IVC2 and IVC2F can
execute one or two SIMD (single instruction stream, multiple data
stream) instructions, which perform one or two operations on multiple
data in parallel. The second-generation IVC2F can efficiently perform
double-precision floating-point operations.
The Visconti Family can execute multiple applications simultaneously*
because of its multi-core configuration containing multiple MPEs.
Vehicle Collision Warning
Pedestrian Collision Warning
at day-time and night
High-Beam Assistance
Traffic Sign Recognition
Red Signal Lamp
Recognition
General Obstacle
Collision Warning
Lane Departure Warning
Traffic Road Sign
Recognition
* See the product specifications for details.
W Feature 2: 10 times the image processing performance
of the conventional product (Visconti4)
W Visconti4 Block Diagram
The Visconti4 Series incorporates eight new image processing engines called
Media Processing Engines (MPEs) with a double-precision floating-point unit,
and various image processing accelerators*1, numbering 14 in all, to achieve
10 times*2 the image processing performance of the conventional product. All
the image processing engines and accelerators can recognize pedestrians
and vehicles simultaneously in 50 milliseconds, running at a clock frequency of
up to 266.7 MHz.
TMPV7608XBG
Multi-core Subsystem
MPE 0
32-bit
I-Cache
RISC CPU
D-Cache
MeP
w/FPU
MPE 1
32-bit
I-Cache
RISC CPU
D-Cache
MeP
w/FPU
MPE 2
32-bit
I-Cache
RISC CPU
D-Cache
MeP
w/FPU
MPE 3
32-bit
I-Cache
RISC CPU
D-Cache
MeP
w/FPU
Coprocessor
IVC2F
Coprocessor
IVC2F
Coprocessor
IVC2F
Coprocessor
IVC2F
D - RAM
D - RAM
D-RAM
D-RAM
L2-Cache
MPE 4
32-bit
I-Cache
RISC CPU
D-Cache
MeP
w/FPU
MPE 5
32-bit
I-Cache
RISC CPU
D-Cache
MeP
w/FPU
MPE 6
32-bit
I-Cache
RISC CPU
D-Cache
MeP
w/FPU
MPE 7
32-bit
I-Cache
RISC CPU
D-Cache
MeP
w/FPU
Coprocessor
IVC2F
Coprocessor
IVC2F
Coprocessor
IVC2F
Coprocessor
IVC2F
D-RAM
D - RAM
D-RAM
*1 See the product specifications for details. *2 Comparison with the previous Toshiba model
Visconti4 Series
Media Processing Engine
D-RAM
E0
MPE
Vehicle Collision Warning
E1
MPE
P
Pedestrian
Collision Warning
L2-Cache
Control CPU
32-bit
RISC CPU
MeP
CMOS
I/F
Control CPU
32-bit
RISC CPU
MeP
I-Cache
D-Cache
Image Processing Accelerator
I-Cache
D-Cache
I - RAM
I - RAM
D - RAM
D-RAM
Im
mag
ge Processing
Proces
ssing Accelerators
Image
Affine
Affine
Transformation Transformation
0
1
d0
Pyramid
Pyramid
d1
Camera
Pyramid Image Generation
Pyramid Image Generation
er 0
Filter
Camera
Affine
Transformation
2
er 1
Filter
Pyramid 0
Pyramid 1
Filter 0
Filter 1
Oriented Gradients Computation
Oriented Gradients Computation
Enhanced CoHOG
G0
Histogram
Vehicle Detection
G1
Enhanced CoHOG
Camera
Pedestrian Detection
50ms
Camera
Visconti2
Visc
conti2
2 and Visconti3 Series
Enhanced
CoHOG 0
Enhanced
CoHOG 1
Matching
0
Matching
1
Camera
Camera
Camera
Video Switch
Camera
VideoOutput I/F 0
Video Input I/F 0
Video Input I/F 1
I2C I/F
UART I/F
GPIO
Video Input I/F 3
DDR SDRAM Controller
LPDDR2-800
SDRAM
CAN I/F
SPI I/F
Video Input I/F 2
SRAM/NOR Flash Controller
MCU I/F
Serial
NOR Flash
MCU
Proces
P
s i Engine
ssing
E i
Media Processing
SfM
VideoOutput I/F 1
PCM I/F
Timer/Counter
DMA
Controller
ROM
RAM
LCD Module
Histograms
of
Oriented
Gradients
LCD Module
MIPI CSI-2
I/F
MPE 0
Vehicle
V
ehicle Collision Warning
MPE 1
P d
desttrian
i Collision
C lli i Warning
W i
Pedestrian
Image Processing Accelerators
ators
s
Affine Transformation
Filter 0
Filter 1
Pyramid Image Generation
Oriented Gradients Computation
Oriented Gradients Computation
HOG
Vehicle
Detection
Pedestrian
Detection
100ms
8
TMPV7602XBG (Under Development): Low power consumption and small package, contributing to reducing
the size of a monocular ADAS camera module
WSystem Block Diagram
WPackage
LPDDR2-800
SDRAM
Serial
NOR Flash
Package size
17 mm × 17 mm
P-LFBGA 521 Ball
0.65 mm Ball pitch
Visconti4 TMPV7602XBG
CMOS I/F
or
CVBS
(NTSC/PAL)
Video Input I/Fs*
Camera
DDR SDRAM
Controller
Video
BT.656
Decoder
( TC90105FG
etc.)
MPE0
On-chip
Peripherals
ROM
32bit RISC MeP
Timer /
Counters
32bit RISC MeP
Serial
I/Os
MPE1
MPE2
GPIO
MPE3
L2 Cache
Image Processing
Accelerators
720p
LCD Panel
Video Output
I/Fs
Media Processing Engines
MIPI® CSI-2 I/F
Camera
SRAM/NOR
Memory Controller
RAM
CMOS I/F
(RGB888, YCbCr422,
BT.656,8- 10- 12- 1416-bit RAW, or Y8 Y10 Y12)
Video Switches
The TMPV7602XBG, a new addition to the Visconti4
Series, is specifically designed for front-view monitoring
applications of advanced driver assistance systems (ADAS)
using a monocular camera. The new processor consumes
less power and is housed in a smaller package than its
predecessor while maintaining the outstanding nighttime
object recognition performance of the Visconti4 Series.
This has been made possible by reducing the number of
video input channels to one in accordance with the
application requirement and by optimizing the circuit
configuration. The 521-pin BGA package of the
TMPV7602XBG measures only 17.0 mm × 17.0 mm and has
a ball pitch of 0.65 mm. Thus, the TMPV7602XBG helps
reduce the heat dissipation and the size of a camera module.
Serial NOR
Memory Controller
Camera Image
Inputs
( Up to 2 ch )
MediaLB®/
MOST®
CAN FD
I/F
CAN
Transceiver
CAN
I/F
Affine
Transformation
Pyramid
HOG
Enhanced
CoHOG
Matching
Filter
Histogram
LED
PCM
I/F
MCU
I/F
CAN MCU
Power
Management Unit
* The video input interface of the TMPV7602XBG has a 1-of-2 video switch.
W Feature 3: Toshiba’s original pattern recognition using color features
(Visconti4)
In addition to the Toshiba-original luminance-based CoHOG, the image recognition accelerator
contained in the Visconti4 processes four kinds of feature quantities: color-based CoHOG,
Co-occurrence Histograms of Pairs of Edge Orientations and Color Differences (CoHED),
Co-occurrence Histograms of Color Differences (CoHD), and Color Histograms. This accelerator
provides high recognition performance even at nighttime and at scenes with less luminance
differences between objects and the background.
W Feature 4: Image processing solutions
The Visconti Family contains image processing accelerators that perform the image
processing required frequently in each step of image recognition at very high speed
with low power consumption. The Visconti Family contains an affine transformation
accelerator, which corrects any distortion of a fish-eye or wide-angle lens and
performs point-of-view transformation. In addition, the Visconti Family contains filter
accelerators, which perform noise reduction, edge detection, color space conversion
and other image processing. The Visconti Family also includes a histogram
accelerator that creates histograms, and a matching accelerator that performs
disparity calculation for a stereo camera system and motion detection. Furthermore,
the Visconti2 Series (except the TMPV7504XBG) and the Visconti3 Series contain a
HOG accelerator, which handles Histogram of Oriented Gradients (HOG) and/or
Toshiba Co-occurrence Histograms of Oriented Gradients (CoHOG) features that are
suitable for robust human recognition. These processors can detect both moving and
stationary pedestrians in real time. The latest Visconti4 Series incorporates an
Enhanced CoHOG accelerator that combines luminance-based CoHOG feature
descriptors with color-based feature descriptors obtained using a newly developed
technique. It delivers a significant improvement in nighttime image recognition.
Input
Preprocessing
Image capture
O Color space
conversion
O Demultiplexing
O Downscaling
O Cropping
O Gamma correction
O
Lens distortion
correction
O Noise reduction
O Parallax
computation
O Search region
selection
Feature Quantity
Extraction
Recognition
Output
O
O
O
Image analysis
Feature quantity
extraction
O
O
O
Matching
Identification
Tracking
Recognition
result display
O Warning / alert
O Image synthesis
O
W Feature 5: General obstacle detection using
3D reconstruction technology
(TMPV7608XBG of the Visconti4 Series)
The Structure from Motion (SfM) accelerator allows detection of
general stationary obstacles such as fallen objects, fallen rocks
and landslides.
Detection of Road Obstacles Using 3D Reconstruction Technique
Near
Not only pedestrians,
vehicles and moving objects but also static obstacles are detectable.
Stereo/SfM
Pattern
Recognition
and/or
motion
Detection
General
Obstacles
Examples
Vehicles
O
O
O
O
O
Media Processing Engines (MPEs) for Multi-Grain Parallel Processing (Multi-Core, VLIW, SIMD)
Video Capture I/F
Distance z
Video Output I/F
Affine Transformation Accelerator
PCM I/F
Pyramid Accelerator
MCU I/F
Filter Accelerator
UART
Matching Accelerator
Histogram Accelerator
Enhanced CoHOG Accelerator
HOG Accelerator
CAN
O
O
3D reconstruction technology
l!
arefu
Be C
Pylon
Speed bump
Railroad crossing gate
Guard Signboard
Pillars, Poles
O
O
template
Fallen objects
Fallen trees, Fallen
rocks, Landslides
Persons fell down
Road damage
Guardrail
O
Pedestrians
ROI
Visconti™ Solutions
Far
’’
X
Camera
position
at time T
W
Feature
Point
Y
W
Image
at time
T+N
W’
Image at time T
Motion of
monocular camera
Image
at time T+1
Image
Capture
Correspondence
estimation
between
multiple
sequential
images
Estimation of
camera
positions
and poses
3D
reconstruction
(triangulation)
9
Automotive Display Controllers Capricorn™
Toshiba’s automotive display controllers are designed to provide the capability to display
instrument clusters, navigation systems and other in-vehicle applications. These controllers
integrate a CPU(s), a graphics engine(s) and a variety of interfaces on a single chip. Additionally,
Toshiba offers automotive display controllers with a stepper motor controller that can also control
analog meters.
W Overview
O
O
O
O
O
O
O
Correction
Display controllers available for low-end to high-end
applications
Integrated ARM Cortex or TX49 RISC CPU
24-bit color depth plus 8-bit alpha blending
Powerful 2D/3D graphics engine
Controllers with an embedded DRAM eliminate the
need for external graphics memory.
Distortion correction for head-up display
Camera/video input with scaler
Layers
Distortion
W Capricorn Series
Large Size TFT
WVGA
800 × 480
Capricorn™-F
MP
TX4966
CapricornTM-M
MP
TX4961
Mid Size TFT
WQVGA
400 × 240
TX49
Capricorn™-Bt1
TX49
TMPR461
280 MHz
3D/2D Graphics
eDRAM
Capricorn™-Bt0
TMPR460
240 MHz
2D Graphics
Capricorn™-A
MP
1Chip Solution
ARM Cortex-R4
MP
300 MHz
2D Graphics
Stepper Motor Controller
SDRAM/LP-DDR
TX4964
TX49
Small Size TFT
MP
120 MHz
2D Graphics
eDRAM
W Capricorn-Bt1 TMPR461XBG-300: System Organization and Demo System
Capricorn-Bt1
SDRAM / LP-DDR
3.3 V or 1.8 V
ARM
Cortex-R4
300 MHz
CAN
Quad-SPI Flash
Quad SPI
Dual
GDC
Stepper
Motor
Controller
Frame
Grabber
2D
Graphics
Engine
Voltage
Regulator
Car-Networks
Optional
dual display (HUD)
5 channel Stepper-control
Analog-In (light, Temp)
~WQVGA,WVGA
* Capricorn is a trademark of Toshiba Corporation.
* OpenGL is a registered trademark of Silicon Graphics, Inc. in the US and other countries.
* MediaLB is a registered trademark of Microchip Technology Inc. in the US and other countries.
10
O
x1/y1
G1 3D Engine (TX4966)
Animation using OpenGL® ES 1.1
O Mirroring
x2/y2
2D cover flow
O
x2/y2
3D cover flow
1. Rotation engine
2. Transformation engine
3. Drawing engine
4. Blit engine
x1/y1
Toshiba’s 2D Graphics Engine
O
x1/y4
x3/y3
x4/y4
x3/y3
Rotation
engine
High-quality motion pictures using Blitting
Engine and Transformation Engine
O Antialiasing
Transformation
engine
Drawing
engine
Thanks to the graphics engine, graphical applications put
little workload on the CPU.
W Built in Individual 5 Layers by Each GDC (Graphic Display Controller) Capricorn-Bt
O
O
O
O
5-layer-GDC
Support Format
16-bit RGB (5:6:5)
32-bit RGBA (8:8:8:8)
Max layer size
Width: 64 to 4095 dots,
Height: 32 to 1023 lines
Available to set an Alpha value by each layer (e. g. for fading)
Background Color
Layer A data
Layer B data
Alpha
blend
Alpha
blend
Alpha
blend
Layer D data
D
1234 km
11:37 AM
RGB
RGBA
Alpha
blend
Layer C data
Alpha
blend
Layer E data
dot data
D
1234km
11:37 AM
W Automotive Display Controller: TMPR461XBG-300 [New]
Capricorn-Bt1
O
O
Single-chip instrument cluster control
Head-up display
Q Peripherals
Q Features
O
O
O
O
O
CPU: ARM Cortex-R4 Operating frequency: 300 MHz
Stepper motor controller: 5 channels Zero-point detection
Toshiba Security Module (TSM) AES encryption/decryption, CMAC hashing
2D graphics Dual display outputs Camera/video input: 1 channel
2D graphics engine (hardware) PNG decoder
On-chip memory: 768-KB SRAM
O
O
O
O
SRAM
768 KB
CAN controller: 3 channels
10-bit AD converter: 14 channels
MediaLB®: 1 channel
Package: PBGA328
Quad SPI
ARM
Cortex-R4
300 MHz
2D Graphics
Engine
Dual
GDC
CAN
Frame
Grabber
Stepper
Motor Controller
Voltage
Regulator
W Lineup
Feature
CPU core
TMPR460XBG-300 [New]
TMPR460XBG-300 [New]
ARM Cortex-R4
ARM Cortex-R4
300 MHz
300 MHz
2D (Hardware)
2D (Hardware)
Camera/video inputs
1 ch
1 ch
Display outputs
1 ch
2 ch
A/D converters
10 bit 8 ch
10 bit 14 ch
CAN controllers
2 ch
3 ch
–
1 ch
Operating frequency
Graphics engine
MediaLB®
4 ch
5 ch
External memory
SDRAM/LPDDR
SDRAM/LPDDR
On-chip memory
SRAM 768 KB
SRAM 768 KB
Stepper motor controller
Package
Operating temperature range
PBGA244
PBGA328
– 40 to 85˚C
– 40 to 85˚C
11
Automotive Video Processors
Dual/Single-Picture Video Processors
Function
W Roadmap
Two LCD panels
MP
Full-HD LCD Panel
Now
Planning Combining two pictures and
New picture
adjustment functions
LVDS I/F
dividing into two pictures
LVDS I/F
NEXT High End
TC90195XBG
Combining two pictures and
dividing into two pictures
Up to Full-HD
ES OK
MP 18/01
Up to HD + Panel
Higher picture quality functions
Two LCD panels
New picture
adjustment functions
LVDS I/F
MP New picture adjustment functions
Line drawing / OSD
TC90197XBG
Embedded 16-Mbit DRAM
Dual-picture
WVGA panel
Automotive Cameras & Rear View Monitors
Automotive Cameras & Rear View Monitors
MP New picture adjustment functions
Line drawing / OSD
MP New picture adjustment functions
Muteless input switch
TC90193SBG
Single-screen
TC90193ASBG
Single-screen
WQVGA to WVGA
Panel
WQVGA to WVGA
Panel
TC90175XBG
Dividing into two pictures
Up to Full-HD
Bridge IC
MP New picture adjustment functions
MP
MP New picture adjustment functions
TC90202XBG
T-CON
WQVGA to WVGA
Panel
LVDS to LVTTL
TC90205FG
T-CON
TC90207FG
WVGA Panel
VGA to WVGA
Panel
2017
WHighlights
The TC90195XBG incorporates a frame memory to
display two independent pictures. It can display two
asynchronous video signals simultaneously and
overlay graphics signals from a system-on-a-chip
(SoC) on video signals.
The TC90175XBG under development is a
single-video processor without a frame memory.
Both the TC90195XBG and the TC90175XBG
incorporate a video decoder, support various
analog and digital video input formats, and allow
optimal picture adjustment according to the specific
LCD panel. The output stage has a T-Con, which
adapts to LCD panels from multiple manufacturers.
Frame memory for
dual pictures processing
TC90195XBG Block Diagram
LVDS.A
Rx.A
LVDS.B
Rx.B
Panel
1
(Main)
Main/
Sub
Select
Digital TTL
24 bit RGB/
8 bit ITU-R BT.601/656
D.I/F
Panel
2
DIF
ME
ADC
10 bit
1 ch
C.Video
1/2 ch
Line
Draw
Font OSD
I
X
Panel
1
(Sub)
Memory
8 bit Dual or Single 2 ch
O
Signal
Processor
Output
Select
LVDS
8 bit Dual
or
Single 2 ch
Tx.A
Tx.B
WVGA to
WXGA+
Up to 1920 x 720
BF
FE
Y/C Separation
Color Decoder
IIC-Bus
WTC90175XBG (Under development)
Various screen modes
Combining two pictures
into one screen
Dividing a picture into
two screens
O
LVTTL Out
PLL 1
PLL 2
O TC90195XBG
Various Display Features
O Supports
Dividing an image into two screens
LCD Controller
Timing Controller for
Multi-panel
Multi-color Decoder
family (pin-compatible)
Full-HD panels
O Two video output channels: LVDS (for WVGA to
Full-HD) and LVTTL (for QVGA to WXGA)
O Dividing into two pictures and dual-LCD display
O Incorporates a newly developed area-adaptive gamma
correction circuit to improve visibility.
Rich picture
adjustment features
Input picture (2080 x 720)
QVGA to
WVGA
Up to 800 x 480
Output picture 1 (1280 x 720)
Output picture 2
(800 x 480)
W Lineup
Part Number
Package
TC90195XBG
LFBGA 293pin 17 x 17 mm
TC90175XBG
TC90197XBG
Function
ADC
MP
Dual pictures
1
1
1
1
4
2
Single picture
ES OK (It can divide into
MP 18/1
two pictures)
TC90207FG
12
–
FBGA 228pin 15 x 15 mm
Rear-view
monitor
1
1
–
FBGA 121pin 10 x 10 mm
Picture quality
adjustment
–
–
–
LQFP 80pin 12 x 12 mm
Picture quality
adjustment
–
–
LQFP 64pin 10 x 10 mm
LVDS-to-LVTTL
bridge IC
–
–
–
–
WVGA –40 to +85˚C
–
–
WVGA
–
–
–
WVGA
–
–
–
1.1 to 1.3
3.0 to 3.6
WVGA
–
MP
TC90205FG
Full-HD
–
Dual pictures
TC90193ASBG
Supply
Voltage (V)
WXGA+
LBGA 256pin 17 x 17 mm
TC90193SBG
TC90202XBG
Color Dual pictures Muteless New Picture LVDS Supported Operating
Decoder Overlay Input Switch Adjustment Input LCD Size Temperature
Status
WVGA
1.4 to 1.6
2.3 to 2.7
3.0 to 3.6
1.4 to 1.6
3.0 to 3.6
1.4 to 1.6
3.0 to 3.6
Video Decoder ICs
W Roadmap
W Full, Multi-Standard Video Decoder IC: TC90106FG
The TC90106FG is a full, multi-standard video decoder, which
supports not only a C-Video input, but also D1 and D2 component
inputs. For picture-quality enhancement, the TC90106FG provides a
baseband tint function that allows tint adjustment for all video formats
up to D2 resolution. In addition to the ITUR-656 output interface, an
8-bit serial (SAV/EAV insertion) output is selectable for a D2 video
input, with the clock rate converted from 27 MHz to 54 MHz.
Video Decoders with 3 ch ADCs for Component Signal
480p/576p
8-bit serial output mode
<SAV/EAV>
(D1: 27-MHz clock,
D2: 54-MHz clock)
Built-in Video SW
480p/576p
8-bit serial output mode
(D1: 27-MHz clock,
D2: 54-MHz clock)
TC90106FG
Multi 3line comb
C-DEC / BT.656
Built-in Video SW
TC90104AFG
Multi 3line comb
C-DEC / BT.656
Dynamic-Y gamma
656 8 bit (27 M) /
YCbCr 8 bit (54 M) serial 4:2:2
MP
LQFP64
MP
LQFP64
CVBS
ADC
Y/C,
ADC
Video Decoders that Provide Enhanced Visibility for Automotive Cameras
New edge enhancer
MPEG noise reduction
O Dynamic YC gamma
correction
O Color management
O
O
2 ch Video decoder
1 ch Video decoder
TC90105FG
TC90107FG
Multi 3line comb
C-DEC / BT.656
Multi 3line comb
C-DEC / BT.656
LQFP80
MP
LQFP64
Component
(D1/D2)
MP
2DYCS
Multi
Color
Decoder
ADC
TC90106FG
LTI, CTI
NAVI CORE
SoC
LVTTL
(656)
Graphic
Scaler
T-CON
Panel
CTRL
FPD
LQFP64
2017
W 2-Channel Multi-Standard Video Decoders IC: TC90105FG
OFF
CAMERA1
LPF
AGC
10 bit
ADC
Multi Color
Decoder
Color Management
Dynamic-YC a etc
CAMERA2
LPF
AGC
10 bit
ADC
P/N Color
Decoder
Color Management
Dynamic-YC a etc
Format
TC90105FG
The TC90105FG contains is two channels of video decoders, featuring
various picture adjustment functions, such as an HV & diagonal (HVD)
enhancer, color management and dynamic YC gamma correction. It
allows image rendering, according to the videos from automotive
cameras.
HVD enhancer: Provides diagonal edge enhancement in addition to
the traditional edge enhancement in the horizontal and vertical
directions. The HVD enhancer in the TC90105FG features the ability
to apply a greater amount of edge enhancement while minimizing an
artificial look.
Color management: Provides a capability to increase the saturation of
selected colors. Its objective is to improve visibility by making
particular colors such as red more prominent. The TC90105FG allows
you to select three colors and program their saturation levels. Dynamic
YC gamma correction: Suppresses black and white collapsing to
improve visibility by optimally adjusting the gamma correction curve for
luma according to images. The TC90105FG maintains the balance
between the luma and chroma levels by adjusting the chroma gain
based on the luma gamma correction.
CAMERA3
LPF
AGC
10 bit
ADC
Multi Color
Decoder
Color Management
Dynamic-YC a etc
CAMERA4
LPF
AGC
10 bit
ADC
P/N Color
Decoder
Color Management
Dynamic-YC a etc
Format
TC90105FG
Signal
Processor
Automotive
Display
Controller
T-CON
Panel
CTRL
FPD
Side Camera
Front Camera
Rear Camera
OFF
Dynamic-YC
gamma
ON
OFF
Color management
(Blue cyan enhancement)
ON
ON
Dynamic-YC
gamma
W Lineup
Part Number
Package
TC90104AFG
LQFP 64pin 10 x 10 mm
TC90106FG
LQFP 64pin 10 x 10 mm
Status
MP
TC90105FG
TC90107FG
LQFP 80pin 12 x 12 mm
LQFP 64pin 10 x 10 mm
8-Bit
Component
New
ITU-R ITU-R
Serial
Video Input Video
Picture
BT.601 BT.656 Output
(D2 Signal) Decoder(s) Adjustment Output Output (D2 Signal)
Function
ADC
Video
decoder
3
1
–
Video
decoder
Video decoder
with 2.5 V
regulator
Video decoder
with 2.5 V
regulator
3
1
–
2
1
–
–
–
–
2
1
Embedded
SAV/EAV
–
Operating
Temperature
Supply
Voltage (V)
1.4 to 1.6
–40 to +85˚C
2.3 to 2.7
3.0 to 3.6
–
13
Functional Safety
Toshiba Functional Safety Package
Toshiba offers a support environment not only from a system perspective but also from a customer perspective.
Toshiba Functional Safety Package
Functional Safety Technologies for
MCUs and Analog ICs
Full-ICE fault injection
The MCU emulator provides a fault injection tool
designed to examine the system behavior in the
presence of a fault.
O
O
Fault
Injection
Hardware-based functional safety (compliant with
ISO 26262) reduces the workload of software.
-MCUs: Technology recognized by TÜV-SÜD Automotive
-Analog ICs: Developed, based on our extensive
experience and expertise
Safety Approaches
System
Support
Kit
Chipset
offerings
TM-SILTM
Support from
a software
perspective
Support from
a system
perspective
Hardware
detection
Device
Support
Kit
Support from
a device
perspective
Safety approach
TS16949 Quality System
Documentation
Software
Support
Kit
MCU and analog IC chipset
O
O
MCU and automotive power supply IC
chipset
MCU and battery monitoring IC chipset
Functional safety documents
O
O
Protocol stacks for analog ICs
O
Software development process certified to ASIL D
Protocol stacks for analog ICs are offered.
Functional
safety IP
library
Protocol
stacks
Safety Manual
Analysis Report
Functional safety IP library
O
Software development process certified to ASIL D
Functional safety IP libraries for MCUs are offered.
WFeature 1: Support from a device perspective
Toshiba's functional safety technology is based on an optimized tightly coupled fault supervisor, which observes and directs the operation of not
only the CPU but also its peripherals. The functional safety alarm output at the interface between an MCU and a power supply IC can be
monitored to enhance automotive functional safety from a system perspective.
Example of Functional Safety Block for an Automotive MCU (including the interface between the MCU and the power supply IC)
Functional safety manuals are available.
Automotive MCU
RESET_N
STANDBY_N
NMI_N
MODE0
MODE1
TRST_N
TCK_SWDCK
TMS_SWDIO
TDO_SWV
TDI
TRACCLK
TRACD [3:0]
SRAM
32 KB
Flash
1 MB
ThwD*4
fRMEM
*1
fRMEM
Boot
ROM
fRNET
ALARM [1:0]
Automotive Power Supply IC
Asserts an error signal if a
NOK lasts for longer than
a programmed period.
ALARM out
AHB-Lite BUS (CPU BU
BUS)
fRBUS*2
CPU
Interrupt
MemoryProtect
fRCPU*3
ThwD
PPB
DMAC
2 units
NBD
In-time
OK
NBDSYNC
NBDCLK
NBDD [3:0]
NOK
ThwD
Th
D
1 0 0 1
fRBUS
EXCOUT
AIN1P
AIN1N
AIN2P
AIN2N
ENCO [A,B,Z]O
ENCO [A,B,Z]I
PO [U,X]
PO [V,Y]
PO [W,Z]
CO [U,L]0
CO [U,L]1
POEMGIN_N
COEMGIN_N
CMPOUT0 [1:0]
CMPOUT1 [1:0]
CMPOUT2 [1:0]
CMPOUT3 [1:0]
CMPOUT4 [1:0]
AHB-Lite BUS (SYSTEM B
BUS)
Shared
SRAM
32 KB
fRMEM
EXCITER
ThwD
RDC
TX [2:0]
RX [2:0]
ESEI
2 units
MOSI [1:0]
MISO [1:0]
SECLK [1:0]
SSO [1, 02:00]
ThwD
Calibration
RAM
8 KB
UART/SIO
3 units
PMD
Standby
RAM
4 KB
ThwD
ADC0
ThwD
AIN0 [10:0]
ADC1
ThwD
AIN1 [3:0]
ADC2
ThwD
AIN2 [2:0]
ADC3
ThwD
AIN3 [2:0]
ThwD
ThwD
COMPARE
5 units
CRC
ThwD
MODE
CAPTURE
2 units
RESET
IOSC
PWM
4 units
GPIO
ThwD
ThwD
CLK
EXTCLK
WDT
PLL
XIN
14
Open
Drain
OSC
NG
Error
output
CPU output
at a regular
SIOTX [2:0]
interval
SIORX [2:0]
WatchSIOCK [2:0]
dog
SIOCTS [2:0]_N
Open
Drain
The interval
is userprogrammable.
A serial interface allows
software to monitor analog
IC faults and MCU alarm
records.
Features of the Functional Safety Block
Monitors all the peripheral blocks, the CPU, buses and memories used by
application software except a few communication control blocks
O Incorporates an fRNET block that handles alarms from all the monitor
functions
O Sends alarm signals from all the monitor functions directly from fRNET to
the external world without involving the CPU
O Self-diagnosis function of fRNET to protect its alarm-handling function
O
ThwD
PWM [3:0]
Time out
Serial
communication
VE
ThwD
CAPIN [5:0]
0 1 0 1
ThwD
CAN
3 units
ThwD
XOUT
PA [7:0]
PB [4:0]
PC [6:0]
PD [5:0]
PE [4:0]
PF [3:0]
PG [6:0]
PH [5:0]
PK [5:0]
*1 Fault diagnosis circuit from Yogitech that monitors memories
*2 Fault diagnosis circuit from Yogitech that monitors the on-chip CPU buses
*3 Fault diagnosis circuit from Yogitech that monitors the entire CPU
*4 Fault diagnosis circuit developed by Toshiba
WFeature 2: Fault Injection (Under Development)
The Full-ICE MCU emulator provides a fault injection test environment that can directly be connected to a customer's hardware evaluation
environment. It is easy to learn and yet allows flexible fault injection testing.
Fault Injection System Development Flow
Fault Injection Control Software
OOO
Fault Injection
Test Scenario
MCU
RTL
LSI
Fault-Injected
Logic
Flexible script-based test
scenarios can be created.
ICE
Fault-Injected Logic
Injection Logic
In-Target Probe Board
ADC
FPGA Board
Monitoring Logic
FPGA
ADC
MCU
The Full ICE can
be connected to
existing hardware
without any
modification.
Fault Injection
System
ISO 26262 Software Development Process
Automotive Control
Software
External Trigger
ECU
Board
Functional Safety
IP Library
OO
HILS, MILS, etc
O
Customer
Automotive Control
Test Scenario
ISO 26262-Compliant Deliverables
WFeature 3: Functional Safety IP Library
The Functional Safety IP Library is a software library designed to detect faults in an automotive MCU. It has been created using a software
development process certified by TÜV-SÜD.
WThe Functional Safety IP Library helps its users reduce development time.
Software library offerings
Reduction in the time required to create a safety
mechanism
Performs requirements analysis and verification on the fault
diagnosis section of an MCU
O Identifies application-specific interfaces (APIs) to enable quick
feedback to a system design
O Guarantees that the fault coverage required by ASIL D is met
O
O
O
Data flow
Control flow
Application
Hardware
Software
RTE
MCU Hardware
Fault Diagnosis
Function
Software
Library
ECU
abstraction
Service
Software library
for Functional
Safety IP
MCAL
Reduction in the time required to meet accountability
requirements
O
MCU
Overall System
Safety Target
A set of documents necessary to achieve accountability is
pre-packaged.
Potential feature
Evidence for software library
development process compliant
with ISO 26262
Overall system safety cases
15
Environment: HEVs, PHEVs, EVs and Inverters
System Diagram of an Electric Vehicle (HEV/PHEV/EV)
In order to address the requirements for environmental regulations worldwide, it is necessary to increase electric vehicles as a proportion
of all road vehicles manufactured. Increasing the use of electric energy to reduce fossil fuel consumption helps protect the environment.
Vehicles using electric energy include hybrid electric vehicles (HEVs) that combine the advantages of both electric motors and internal
combustion engines, electric vehicles (EVs) that use electric motors for propulsion instead of an internal combustion engine, and plug-in
hybrid vehicles (PHEVs) that share the characteristics of EVs and HEVs.
Household Outlet
Standard Charging Connector
(100 V/200 V)
AC-DC
CAN
Auxiliary
Battery
Engine
DC-DC
Converter
Battery
Management
Unit
Motor
Hydraulic
Brake
Pump
Accelerator
Brake
Selector
Lever
ECU for
Each
Application
Air-Conditioner
ECU
Inverter
EPS
On-Board
Charger
CAN
Battery
Monitor
Unit
Battery
Monitor
Unit
Battery
Module
Battery
Module
Air-Conditioner
Compressor
Drive
Battery
Fast Charger
Connector
Heater
Non-Contact Charging
(Contact Charging)
: Applications using semiconductor components
AC-DC
Fast Charging Station
Automotive Drive System Block Diagram (Inverter)
Generally, HEVs, PHEVs and EVs use three-phase brushless motors for electric propulsion. Because the vehicle drive
battery supplies a dc current, it needs to be converted to a three-phase ac current using an inverter. A three-phase inverter,
which is composed of power devices, converts dc to ac during acceleration (powering) and converts ac to dc during braking
(regeneration).
Q System Block Diagram
Q 6-in-1 Evaluation Board
Boost Converter
High
Voltage
Battery
for Gate Driver Control
Inverter, Motor Generator
Isolated
IGBT
Controller
or
Isolation device
Q Reference Model for Inverter
Control
Drive
Circuit
Isolated IGBT
Controller
or
Isolation device
Isolated
IGBT
Controller
or
Isolation device
M
Drive
Circuit
Isolated IGBT
Controller
or
Isolation device
Control Circuit
LV Battery
(12V)
Power Supply
Status setup Circuit
Isolated
Signal I/O
HEV
Management
ECU
TB9150FNG
6-in-1 (TB9150FNG) Evaluation Board
System Power Supply (TB9042FTG)
Evaluation Board
MCU (TMPR454F10TFG) Starter Kit
Motor, Generator Control ECU
: Photocoupler or predriver
Q Recommended Products
Block
Type
Package
Part Number
Polarity/Generation
Feature
AEC
Pre-driver
Opto-isolated
IGBT gate driver
SSOP48
TB9150FNG**
BiCD process
Built-in fly-back controller,
Built-in isolation device (optical coupling) Topr: – 40 to 125˚C
Planning
DPAK+
TK25S06N1L
U-MOSVIII-H
Nch, 60 V/25 A, 18.5 m1, Tch = 175˚C
U-MOSIV
Nch, 60 V/35 A, 11.2 m1, Tch = 175˚C
BiCD process
Switching Reg., 5 V Reg., Watchdog timer, Topr: – 40 to 125˚C
ARM-Cortex-R4F (160 MHz)
Vector Engine, RDC, PMD, ADC, CAN, Topr: – 40 to 125˚C
MOSFET
Power Supply
MCU
Isolation
SOP Advance
Voltage Regulators
HQFN52
Motor control MCU
HLQFP144
Photocouplers
TPCA8086
TB9042FTG
TMPR454F10TFG
5pin SO6
TLX9304
–
Open collector output,1 M LOGIC, Topr = 125˚C (max)
5pin SO6
TLX9378
–
Open collector output, 10 M LOGIC, Topr = 125˚C (max)
5pin SO6
TLX9376
–
Totempole output, 20 M LOGIC, Topr= 125˚C (max)
Planning
**: Under development
16
Applications (Pump Control, EPS)
Pump Control (for Water, Oil and Fuel)
The TB9061AFNG can control a pump control unit without using a microcontroller and Hall sensors. This eliminates the need
for the development of software for electronic control units (ECUs) or reduces the workload for the development. Moreover, the reduction
in the number of components due to the elimination of Hall elements etc. helps reduce the size of ECU boards. Toshiba's semiconductor
devices designed for pump control units tolerate a high-temperature environment of up to 125°C in an engine compartment.
Q System Block Diagram
Pch
Q Pump Control Evaluation Board
Reverse Battery
Protection
Q Reference Model for
Water Pump Control
Brushless motor application
DPAK+ MOSFET
Nch: TK65S04N1L
Pch: TJ60S04M3L
Power
Supply
PreDriver
M
MCU
TB9061AFNG
Pump
Motor
(Brushless)
Q Recommended Products
Block
Type
Package
Part Number
Polarity/Generation
Feature
AEC
SSOP24
TPD7210F
TPD7211F
TPD7104AF
TB9061AFNG
TK15S04N1L
TK65S04N1L
TJ20S04M3L
TJ40S04M3L
TJ60S04M3L
TPCA8085
TPCA8122
TPCA8124
TPCC8069
TPCC8106
TB9005FNG
TB9021FNG
TTA005
IPD process
3 Phase Full Bridge Nch MOSFET Gate drive.
–
IPD process
Half bridge MOSFET Gate drive.
–
BiCD process
1 ch Nch MOSFET Gate drive.
BiCD process
3 Phase Brushless Sensor-less Pre-Driver, – 40 to 125˚C
Nch/VIII
40 V/15 A/17.8 m1 max
IPD
Pre-driver
PS-8
SSOP24-0.65
MCD
DPAK+
Motor control
Reverse
battery
protection
MOSFET
SOP Advance
TSON Advance
Power Supply
Voltage Regulators
BipTr
SSOP20
HTSSOP16
New PW-Mold
Nch/VIII
40 V/65 A/4.3 m1 max
Pch/VI
– 40 V/– 20 A/22.2 m1 max
Pch/VI
– 40 V/– 40 A/9.1 m1 max
Pch/VI
– 40 V/– 60 A/6.3 m1 max
Nch/IV
40 V/40 A/5.7 m1 max
Pch/VI
– 40 V/– 60 A/5 m1 max
Pch/VI
– 40 V/– 35 A/10.5 m1 max
Nch/VIII
40 V/30 A/8.1 m1 max
Pch/VI
– 40 V/– 30 A/12.3 m1 max
BiCD process
Single output (external transistors required) LDO (5 V) Watchdog timer, Topr: – 40 to 125˚C
Single output (with integrated output transistors) LDO (5 V, 200 mA) Window-Watchdog timer, Topr: –40 to 125˚C
NPN
Planning
– 50 V/– 5 A /hFE 200 min
Electronic Power Steering (EPS) System
EPS systems are finding widespread use in automobiles to improve mileage. Here are block diagrams of EPS systems that use power
MOSFETs for motor drivers, power supply and motor relay applications in EPS systems.
Q System Block Diagram
Q EPS Control Evaluation
EPS ECU
Q Reference Model for EPS
Board
Brushless motor
application
PreDriver
Signal
Conditioning
Circuit
PreDriver
EPS
Motor
EPS Control Evaluation Board
M
MCU
Current
Monitor
Circuit
PreDriver
Pre-Driver
Battery
Power
Supply
Circuit
PreDriver
SteeringTorque
Sensor
TK1R4F04PB
TB9044FNG
PreDriver
SteeringWheel
Angle
Sensor
Block
Driving Speed Sensor
Type
Q Recommended Products
Block
Type
IPD
SSOP24 TPD7210F
PS8
TPD7104AF
TK65S04N1L
Motor
TK100S04N1L
control
TK1R4S04PB
DPAK+
Reverse
TJ40S04M3L
battery
TJ60S04M3L
protection MOSFET
TJ80S04M3L
TPCA8085
SOP
TPCA8122
Advance
TPCA8124
Motor
Motor
control LQFP100 TMPM351F10TFG
MCU
Package
LQFP64
Package Part Number Polarity/Generation
Feature
3 Phase Full Bridge Nch
MOSFET Gate drive.
BiCD process 1 ch Nch MOSFET Gate drive.
IPD process
Nch/VIII
40 V/65 A/4.3 m1 max
Nch/VIII
40 V/100 A/2.3 m1 max
Nch/IX
40 V/120 A/1.35 m1 max
Pch/VI
– 40 V/– 40 A/9.1 m1 max
Pch/VI
– 40 V/– 60 A/6.3 m1 max
Pch/VI
– 40 V/– 80 A/5.2 m1 max
Nch/IV
40 V/40 A/5.7 m1 max
Pch/VI
– 40 V/– 60 A/5 m1 max
Pch/VI
ARM
Cortex-M3
(144 MHz)
– 40 V/– 35 A/10.5 m1 max
PMD, CAN, ADC,
Topr = – 40 to 105˚C
MCU (TMPM351F10TFG) Starter Kit
TB9081FG
AEC
Pre-driver
MCD
–
Part Number Polarity/
Generation
Feature
5-channel safety relays
Selectable operation on fault detection
Initial diagnosis of monitoring circuitry
TB9081FG**
AEC
Planning
BiCD
1-channel H-bridge pre-driver (external N-channel FET)
HTSSOP48 TB9052FNG process Built-in motor current detection circuit
1-channel H-bridge pre-driver (external N-channel FET)
Built-in motor current detection circuit
Built-in motor rotational direction detection circuit
Multiple outputs (external transistors required)
–
TB9004FNG
SSOP20
LDO1 (3.4/2.5/1.5 V), LDO2 (5 V)
Watchdog timer, Topr: –40 to 125˚C
Single
output
(external
transistors
required)
TB9005FNG
SSOP20
LDO (5 V) Watchdog timer, Topr: –40 to 125˚C
Voltage
BiCD Single output (with integrated output transistors)
TB9021FNG
HTSSOP16
Power
process LDO (5 V, 200 mA) Window-Watchdog timer, Topr: –40 to 125˚C
Regulators
Supply
Multiple outputs (with integrated output transistors)
HQFN52 TB9042FTG
DCDC1 (1.2/1.5 V),LDO1 to 2 (5 V), LDO3 (5/3.3 V)
Window-Watchdog timer, Topr: –40 to 125˚C
Multiple outputs (with integrated output transistors)
TB9044FNG
HTSSOP
LDO1 to 4 (5 V) Window-Watchdog timer, Topr: –40 to 125˚C Planning
LQEP48
Bip Tr
TB9057FG
New PW-Mold TTA005
NPN
–50 V/ –5 A/hFE 200 min
Planning
**: Under development
17
Applications (HVAC, EPB)
Heating, Ventilation and Air-Conditioning (HVAC)
In order to improve fuel efficiency, various motors are being replaced by brushless motors. Accompanying this trend, MOSFETs
with lower loss are being required for motor drive and reverse-battery protection applications. Toshiba offers MOSFETs that use a
copper (Cu) connector with lower resistance than aluminum in order to reduce conduction loss.
Q System Block Diagram
Q Recommended Products
Brushless motor application
Pch
Block
Reverse Battery
Protection
Type
IPD
Power
Supply
PreDriver
M
MCU
Blower
Motor
(Brushless)
Motor
control
Reverse MOSFET
battery
protection
Pre-driver
MCD
Power
Supply
Voltage
Regulators
Feature
Package Part Number Polarity/Generation
SSOP24 TPD7210F
PS8
IPD process 3 Phase Full Bridge Nch MOSFET Gate drive.
AEC
–
BiCD process 1 ch Nch MOSFET Gate drive.
TK100S04N1L Nch/VIII 40 V/100 A/2.3 m1 max
TPD7104AF
TK1R4S04PB
DPAK+ TK55S10N1
Nch/IX
40 V/120 A/1.35 m1 max
Nch/VIII
100 V/55 A/6.5 m1 max
TJ60S04M3L
Pch/VI
– 40 V/– 60 A/6.3 m1 max
TJ80S04M3L
Pch/VI
– 40 V/– 80 A/5.2 m1 max
TK1R4F04PB
Nch/IX
40 V/160 A/1.35 m1 max
TK200F04N1L
TO-220SM TKR74F04PB
(W)
TK160F10N1
Nch/VIII
40 V/200 A/0.9 m1 max
Nch/IX
40 V/250 A/0.74 m1 max
Planning
Nch/VIII
100 V/160 A/2.4 m1 max
Planning
TK160F10N1L
Nch/VIII
100 V/160 A/2.4 m1 max
Planning
LQFP64 TB9080FG
Planning
Quiet motor operation due to sine-wave current
BiCD process High-efficiency motor drive due to auto lead angle control
SSOP20 TB9005FNG
BiCD process
HTSSOP16 TB9021FNG
Single output (external transistors required)
LDO (5 V) Watchdog timer, Topr: –40 to 125˚C
Single output (with integrated output transistors)
LDO (5 V, 200 mA) Window-Watchdog timer, Topr: –40 to 125˚C
Heating, Ventilation and Air Conditioning (HVAC) with Dampers
Toshiba offers motor drivers for HVAC applications incorporating multiple dampers. Our product lineup includes ICs that integrate a
low-on-resistance driver capable of controlling multiple channels and those that integrate a driver that provides fine temperature
regulation and other features through LIN communications with system electronics.
Q Recommended Products
Q System Block Diagram
Block
Type
Package Part Number Polarity/Generation
Motor
driver
2 ch H-Bridge, 1.2 1 (±0.5 A),
Topr: – 40 to 125˚C
6 ch Half-bridge, -Bridge, 1.0 1(±0.5 A),
SSOP24 TB9102FNG BiCD process
Topr: – 40 to 125˚C
LIN-compatible 1 ch H-Bridge, 2.2 1(±1.5 A),
TB9056FNG
Topr: – 40 to 125˚C
Dumper Motor
(Brushed)
M
M
Motor drive
Power
Supply
H-bridge
Feature
AEC
TB9101FNG
H-bridge
–
I/F
controller
MCU
Driver
Electric parking brake (EPB), power sliding doors, precrash seat belt tensioners
Nowadays, more and more automotive applications rely on
electronic control, including electric parking brakes (EPB),
power sliding doors and precrash seat belt tensioners. The
H-bridge circuit configuration is most commonly used to
drive motors for these applications. Fabricated using the
latest silicon process, the DPAK+ MOSFET Series for motor
drive applications delivers low on-resistance, as well as low
wiring resistance by the use of a Cu connector. These
characteristics combine to help reduce the system power
consumption. Toshiba also offers pre-drivers that integrate
Q Recommended Products
Block
Type
IPD
Motor drive
Relay drive
Relay
FWD
Motor
Predriver
Power
Supply
TPD7211F
MOSFET
Nch/VIII
40 V/65 A/4.3 m1 max
TK100S04N1L
Nch/VIII
40 V/100 A/2.3 m1 max
TK1R4S04PB
Nch/IX
40 V/120 A/1.35 m1 max
MOSFET
Pre-Driver
PreDriver
M
– 40 V/– 60 A/6.3 m1 max
TJ80S04M3L
Pch/VI
– 40 V/– 80 A/5.2 m1 max
TJ60S06M3L
Pch/VI
– 60 V/– 60 A/11.2 m1 max
Nch/IV
40 V/40 A/5.7 m1 max
Pch/VI
– 40 V/– 60 A/5 m1 max
Pch/VI
– 40 V/– 35 A/10.5 m1 max
Voltage
Regulators SSOP20 TB9005FNG
SSOP16 TB9021FNG
MOSFET
18
Power
Supply
–
–
60 V/90 A/3.3 m1 max
Pch/VI
SSOP24 TB9004FNG
Motor
AEC
SSM3K337R Active Clamp Nch 38 V/2 A, [email protected] V
MOSFET SOT23F
UFM
SSM3H137TU Nch + ZD 34 V/2 A, [email protected] V
H-Bridge Pre-Driver, Current sensor,
HTSSOP48 TB9052FNG
Topr: –40 to 125˚C
BiCD process
MCD
H-Bridge Pre-Driver, Current sensor,
LQFP48 TB9057FG
Topr: –40 to 126˚C
Relay
Relay
Drive
Nch/VIII
TJ60S04M3L
M
Power
Supply
Feature
IPD process 3 Phase Full Bridge Nch MOSFET Gate drive.
IPD process Half bridge MOSFET Gate drive.
TK65S04N1L
TPCA8085
SOP
Advance TPCA8122
TPCA8124
Relay
Driver
Relay
Drive
PS8
DPAK+ TK90S06N1L
various detection circuits (for undervoltage detection, FET
short-circuit detection, thermal shutdown), a charge pump
and a high-speed pre-driver circuit.
Q System Block Diagram
Package Part Number Polarity/Generation
SSOP24 TPD7210F
BipTr
New PW-Mold TTA005
Multiple outputs (external transistors required)
–
LDO1 (3.4/2.5/1.5 V), LDO2 (5 V)
Watchdog timer, Topr: –40 to 125˚C
BiCD process Single output (external transistors required)
LDO (5 V) Watchdog timer, Topr: – 40 to 125˚C
Single output (with integrated output transistors)
LDO (5 V, 200 mA) Window-Watchdog timer, Topr: –40 to 125˚C
– 50 V/ – 5 A/hFE 200 min
NPN
Planning
Applications (Junction Box, Gasoline Engine System, Direct Injection)
Junction Box
Automotive junction boxes come in two types: those using mechanical relays and those using MOSFETs as semiconductor relays.
To meet the needs of mechanical-relay drive applications, Toshiba has developed the SSM3K337R, a MOSFET in a small
package (with 85% of the mounting area of the predecessor) that has active clamping circuitry for inductive loads. Toshiba also
offers power MOSFETs in DPAK+ and TO-220SM (W) packages suitable for semiconductor relay applications.
Q System Block Diagram
Q Recommended Products
Block
Mechanical
Relay
Load
Mechanical
Relay
Type
MOSFET
MOSFET + ZD
Power
Supply
MOSFET
Other ECU
Switch
Semiconductor
Relay
Signal
Conditioning
Circuit
Semicon.
Relay
IPD
Load
Sensor
BipTr
Package Part Number Polarity/Generation
SOT23F SSM3K337R
UFM
SSM3H137TU
Nch + ZD
34 V/2 A, [email protected] V
PS8
TPCP8R01
Nch + ZD
60 V/2 A, [email protected] V, VZ = 43 V
DPAK+ TK100S04N1L
Nch/VIII
40 V/100 A, 2.3 m1, Tch = 175˚C
TO-220SM (W) TK200F04N1L
Nch/VIII
40 V/200 A, 2.3 m1, Tch = 175˚C
PS-8
TPD7104AF
TPD7102F
New PW-Mold TTA005
MCU
SSOP24 TB9004FNG
PreDriver
Sensor
Power
Supply
Feature
Voltage
SSOP20 TB9005FNG
Regulators
SSOP16 TB9021FNG
AEC
Active Clamp Nch 38 V/2 A, [email protected] V
BiCD process 1 ch Nch MOSFET Gate drive.
NPN
– 50 V/– 5 A/hFE 200 min
Multiple outputs (external transistors required)
LDO1 (3.4/2.5/1.5 V), LDO2 (5 V)
Watchdog timer, Topr: –40 to 125˚C
Single output (external transistors required)
BiCD process LDO (5 V)
Watchdog timer, Topr: –40 to 125˚C
Single output (with integrated output transistors)
LDO (5 V, 200 mA)
Window-Watchdog timer, Topr: –40 to 125˚C
Planning
–
Gasoline Engine System
Accompanying the tightening of environmental regulations,
automotive engines are required to meet the standards for
higher efficiency and lower emissions. Toshiba's motor ICs
suitable for the control of throttle and exhaust gas recirculation
(EGR) valves help optimize engine efficiency.
Q System Block Diagram
MCU
Throttle Motor
Brushed
Motor
IPD
Relays
MCD
Pre-Driver
IPD
Driver
Package Part Number Polarity/Generation
PS-8
TPD1044F
SOP-8
TPD1046F
P-QFN28 TB9051FTG
PS-8
TPD1054F
SOP-8
TPD1058F
Lamp
Other ECU
Power
Supply
BiCD process
BiCD process
2 ch Low side switch (2 A)
–
1 ch H-Bridge driver (Pch + Nch), Iout±5 A
Topr: –40 to 125˚C
1 ch Low side switch (1 A)
–
1 ch Low side switch (6 A)
–
Nch/VIII
60 V/25 A/18.5 m1 max
TK40S06N1L
Nch/VIII
60 V/40 A/10.5 m1 max
DPAK+ TK90S06N1L
Nch/VIII
60 V/90 A/3.3 m1 max
Pch/VI
– 60 V/– 30 A/21.8 m1 max
TJ60S06M3L
Pch/VI
– 60 V/– 60 A/11.2 m1 max
Nch/IV
60 V/35 A/11.2 m1 max
Pch/VI
– 60 V/– 50 A/11.1 m1 max
MOSFET DPAK+ TJ8S06M3L
Pch/VI
– 60 V/– 8 A/104 m1 max
Voltage HQFN52 TB9042FTG
Regulators
BiCD process
TPCA8086
SOP
Advance TPCA8123
Relay
AEC
Planning
TJ30S06M3L
Semicon.
Relay
Solenoid
Drivers
(MOSFET,
IPD, etc. )
IPD process
Feature
1 ch Low side switch (1 A)
TK25S06N1L
MOSFET
Injector
Sensor
Type
EGR Motor
Sensor
Signal
Conditioning
Circuit
Block
Solenoids
Switch
Power
Supply
Q Recommended Products
Multiple outputs (with integrated output transistors)
DCDC1 (1.2/1.5 V), LDO1 to 2 (5 V),
LDO3 (5/3.3 V)
Window-Watchdog timer, Topr: –40 to 125˚C
Direct Injection
More and more gasoline cars are equipped with a direct-injection engine to improve fuel efficiency. Toshiba provides switches for
high-pressure injector control applications as well as MOSFETs suitable for DC/DC converter applications.
Q System Block Diagram
Q Recommended Products
Block
Type
Package Part Number Polarity/Generation
Boost
Converter
Battery Voltage
Drive Switch
DPAK+
DC-DC Boost
Converter
Injector
ON/OFF
Control
Nch/VIII
MOSFET
60 V/90 A/3.3 m1 max
100 V/55 A/6.5 m1 max
TK55S10N1
Nch/IV
40 V/40 A/10.9 m1 max
Nch/IV
60 V/35 A/11.2 m1 max
TK40S06N1L
Pch/VIII
60 V/40 A/10.5 m1 max
TK90S06N1L
Pch/VIII
60 V/90 A/3.3 m1 max
Injector
Control
TPCA8035
SOP
Advance TPCA8086
Drive
Switch
DPAK+
AEC
100 V/33 A/9.7 m1 max
TK33S10N1L
Drive Switch
Fuel Injector
TK90S06N1L
Feature
60 V/40 A/10.5 m1 max
TK40S06N1L
19
Applications (Cooling Fans, Transmission Control Units and Start-Stop Systems)
Cooling Fan
Automobiles have electric cooling fans of various sizes for the engine, battery pack and LED headlights. With the increasing
uptake of electric vehicles (EVs), the market demand for quieter fan motors is growing. Toshiba's sine-wave motor controller ICs
help realize quiet motor operation.
Q System Block Diagram
O Low-Side
PWM
Q Recommended Products
O High-Side
Pch
Block
PWM
Type
Package Part Number Polarity/Generation
Pch
SSOP-24 TPD7210F
IPD
Motor
(Brushed)
Reverse
Battery
Protection
Signal
Input
M
Power
Supply
M
PreDriver
MCU
MCU
PS-8
Motor drive
Motor
Control
Predriver
Pre-Driver
Power
Supply
Pch
M
LQFP64 TB9080FG
SSOP24 TB9110FNG
Motor
(Brushed)
TK100S04N1L
DPAK+ TK1R4S04PB
Motor
Control
Motor drive
full-bridge Method for BLDC Motor
Reverse Battery
Protection
Pch
Motor Control
PreDriver
Power
Supply
M
Signal
Input
Voltage
Regulators
BipTr
40 V/100 A/2.3 m1 max
100 V/55 A/6.5 m1 max
Nch/IX
40 V/160 A/1.35 m1 max
TK200F04N1L
Nch/VIII
40 V/200 A/0.9 m1 max
SSOP20 TB9005FNG
SSOP16 TB9021FNG
MCU
Nch/VIII
TK1R4F04PB
SSOP24 TB9004FNG
Motor
(Brushless)
–
3 Phase DC Brushless Motor controller
Topr: –40 to 125˚C
BiCD process
Pre-driver of Nch-MOSFET external type
Topr: –40 to105˚C
40 V/120 A/1.35 m1 max
TK160F10N1L
Power Supply
–
Nch/IX
TO-220SM TKR74F04PB
(W)
TK160F10N1
Reverse
battery
protection
New PW-Mold TTA005
AEC
IPD process Half bridge MOSFET Gate drive.
Nch/VIII
TK55S10N1
MOSFET
O 3phase
TPD7211F
Feature
3 Phase Full Bridge Nch MOSFET
IPD process Gate drive.
–
Planning
Nch/IX
40 V/250 A/0.74 m1 max
Planning
Nch/VIII
100 V/160 A/2.4 m1 max
Planning
Nch/VIII
100 V/160 A/2.4 m1 max
Planning
Multiple outputs (external transistors required)
LDO1 (3.4/2.5/1.5 V), LDO2 (5 V)
Watchdog timer, Topr: –40 to 125˚C
Single output (external transistors required)
LDO (5 V)
BiCD process
Watchdog timer, Topr: –40 to 125˚C
Single output (with integrated output transistors)
LDO (5 V, 200 mA)
Window-Watchdog timer,
Topr: –40 to 125˚C
NPN
–50 V/–5 A/hFE 200 min
–
Planning
Transmission Control
The hydraulic control in the transmission is mainly driven by a valve using an electromagnetic solenoid. Toshiba offers
semiconductor devices with a current drive capability and various protection features suitable for on-off and linear solenoids in
transmissions.
Q System Block Diagram
Q Recommended Products
Block
Relays &
solenoids
Relay
Type
IPD
Low-Side
Switch
MCU
Solenoid Control
High-Side
Switch
ON/OFF Solenoid
IPD process 1 ch High side switch (1 A)
Planning
PS-8
TPD1054F
BiCD process 1 ch Low side switch (1 A)
–
BiCD process 1 ch High side switch (3 A)
–
M
Oil Pump
Motor
High-Side
Switch
Predriver
Linear Solenoid
TPD1060F
Nch/VIII
40 V/65 A/4.3 m1 max
TK100S04N1L
Nch/VIII
40 V/100 A/2.3 m1 max
Nch/IX
40 V/120 A/1.35 m1 max
MOSFET DPAK+ TK90S06N1L
MCD
BiCD process 1 ch Low side switch (3 A)
TK65S04N1L
TK1R4S04PB
Oil pump
drive
AEC
TPD1044F
SOP-8
Pre-Driver
Sensor
Signal
Power
Supply
Feature
PS-8
SON-10 TPD1055FA
Relay Control
Switch
Package Part Number Polarity/Generation
Nch/VIII
60 V/90 A/3.3 m1 max
TJ60S04M3L
Pch/VI
–40 V/–60 A/6.3 m1 max
TJ80S04M3L
Pch/VI
–40 V/–80 A/5.2 m1 max
TJ60S06M3L
Pch/VI
–60 V/–60 A/11.2 m1 max
3 Phase Brushless Sensor-less
SSOP24 TB9061AFNG BiCD process Pre-Driver
Topr: –40 to 125˚C
Start-Stop Systems
Toshiba’s power devices and driver ICs can be combined to build efficient circuits for the charging/discharging control of lead-acid
batteries, lithium-ion batteries and generators in start-stop systems.
Q System Block Diagram
Q Recommended Products
Block
Type
Semicon.Relay
IPD
Package Part Number Polarity/Generation
PS-8
TPD7104AF
TK100S04N1L
DPAK+ TK1R4S04PB
Interleave
DC-DC Boost
Converter
Battery
Load
Reverse Battery
Protection
Motor drive or
reverse-battery
protection MOSFET
TK55S10N1
20
Voltage
Detection
Circuit
40 V/100 A/2.3 m1 max
Nch/IX
40 V/120 A/1.35 m1 max
Nch/VIII
100 V/55 A/6.5 m1 max
Nch/IX
40 V/160 A/1.35 m1 max
TK200F04N1L
Nch/VIII
40 V/200 A/0.9 m1 max
TO-220SM
TKR74F04PB
(W)
TK160F10N1
Control Circuit
Nch/VIII
TK1R4F04PB
TK160F10N1L
Power
Supply
Feature
AEC
BiCD process 1 ch Nch MOSFET Gate drive.
Planning
Nch/IX
40 V/250 A/0.74 m1 max
Planning
Nch/VIII
100 V/160 A/2.4 m1 max
Planning
Nch/VIII
100 V/160 A/2.4 m1 max
Planning
Automotive Microcontrollers
Roadmap for Automotive Microcontrollers
Toshiba is expanding its portfolio of automotive microcontrollers, based on the ARM Cortex-based CPU cores.
Memory Size
TMPR4XX
4M
Bytes
2M
Bytes
Designed for inverter control
Mass Production
Designed for inverter Integrated
inverter control
Under Consideration
TMPR431
200 MHz/176 pin
ROM 2 MB/RAM 192 KB
O
MP
TMPR454 NOW
w/ VE
160 MHz/144 pin
ROM 1 MB/RAM 80 KB
1M
Bytes
TMPM351
Designed for EPS and
general automotive applications
Designed for EPS and
general automotive applications
512 K
Bytes
Designed for battery monitoring and
general automotive applications
MP
NOW
144 MHz/100 pin
ROM 1 MB/RAM 64 KB
TMPM350
128 K
Bytes
TMPR430
240 200 MHz/144 pin
ROM 2 MB/RAM 192 KB
TMPM354
w/ VE x 2
200 MHz/241 pin
ROM 4 MB/RAM 192 KB
Designed for inverter control
MP
NOW
w/ VE
96 MHz/144 pin
ROM 1 MB/RAM 64 KB
Designed for inverter control
MCUs with Vector Engine (VE)
MP
NOW
88 MHz/100 pin
ROM 512 KB/RAM 48 KB
MP
TMPM358 NOW
40 MHz/100 pin
ROM 512 KB/RAM 80 KB
TMPM357
TMPM356
TMPM355
48 MHz/44, 48 pin
ROM 128 KB/RAM 16 KB
48 MHz/64 pin
ROM 128 KB/RAM 16 KB
48 MHz/100 pin
ROM 256 KB/RAM 20 KB
44/48 pin
64 pin
100 pin
Designed for small motors: Fans, Pumps, ISGs and
general automotive applications
144 pin
241 pin
176 pin
Vector Control Technology
Routine processes are offloaded from a CPU to the Vector Engine (VE) that can run in parallel with the CPU. This makes it possible to
implement functional safety in the CPU or modify system partitioning at a late stage of the development cycle.
25
Cycle control
Interrupt
Timer (2.5 ms)
Run-Time (+s)
20
PWM carrier
(10 kHz)
(100 μs)
15
10
CPU (Software)
5
VE task done
Programmed value
0
Interrupt
VE (Task)
PMD
(VE startup trigger)
ADC
(Motor current)
RDC
(Motor rotation angle)
VE1G(80 MHz)
VE2G(200 MHz)
VE Types
Trigger
The CPU in the VE2G operates at a higher frequency than the one in the
VE1G and supports additional computation instructions. Consequently,
the VE2G provides processing throughput three times higher the VE1G.
O In addition to commonly used tasks for vector control such as three-to-two
phase projection, coordinate system rotation and PI control, the process
includes more than 20 types of tasks including various corrections.
O
Trigger Data
Data
Comparison of the VE1G and VE2G Performance
ARM Ltd. (Yokogawa Digital Computer Corporation)
IAR Systems AB
Green Hills Software / Advanced Data Controls Corp.
ATI Japan
Elektrobit Corporation
GAIO TECHNOLOGY CO.,LTD.
KYOEI co.,LTD.
KPIT Technologies Ltd.
Computex Co.,Ltd.
Sohwa & Sophia Technologies Co.,Ltd.
dSPACE GmbH
Yokogawa Digital Computer Corporation
Teaching
Materials
/Seminar
FLASH
Programmer
/Writer
Board/
Evaluation kit
Software
development
/SI
OS
Simulator
Debugger
A wide range of development tools are available from many
partners for automotive ARM Cortex-based microcontrollers.
Choose the best development tools and partners that best suit your
needs.
IDE/Compiler
Development Tools and Partners
ON board
ON board
ON board
ON board
21
Analog Devices
Toshiba offers analog devices necessary to create various automotive systems.
Toshiba has a 0.13-+m BiCD process that can integrate analog circuitry with large logic and power (DMOS) devices on the same chip.
The BiCD process helps reduce the size and power consumption of automotive systems. With the ever-increasing computerization of
electric vehicles (EVs) and hybrid electric vehicles (HEVs), demand for electronic devices for motor and other applications is increasing.
In addition to the 0.13-+m BiCD process, Toshiba offers analog devices with a wide range of current and voltage ratings as well as circuit
technologies that are optimized for various applications.
WTarget Applications of Toshiba’s Analog Devices
V
V
Powertrain
Chassis and Safety Systems
Fuel pump (EFP)
EPS
Door mirrors
- Combustion engine control system
- Anti-lock brake system (ABS)
- Automatic transmission
- Electronic stability control (ESC)
- Hybrid car motor
- Electronic power steering system (EPS)
- Brushed motor for the EGR valve
- Collision avoidance: Millimeter-wave radar
- Brushed motor for electronic throttle control (ETC)
- Four-wheel-drive (4WD) control
Inverter
Electric oil pump
(EOP)
- Brushless DC motor for mileage management
- Brushless DC motor for water pumps
- Brushless DC motor for oil pumps
Brake
V
Body
Air conditioner (flaps)
- Battery and energy management
- Air-conditioner blower motor (brushless/brushed)
- Body control unit
- Adaptive Front-lighting System (AFS)
- Air-conditioner flap motor
- Door mirrors
- Damper motor for air conditioners
- Power windows
Air conditioner (damper)
Air conditioner (blower)
Headlights:
Adaptive front-lighting system (AFS)
W Opto-Isolated IGBT Gate Predriver IC: TB9150FNG
IGBT gate predriver IC in a small, thin package with a photocoupler for isolated communication between a control unit and the driveline
IGBT Gate Pre-Driver (ability of driving 2 IGBTs in parallel)
Built-in isolation device (Photocoupler)
O Miller clamp control function, Soft turn-off function
O Short-circuit detection functions (current sense, DESAT)
O Overcurrent detection function
O Power supply voltage decline detection function (Primary side, secondary side)
O IGBT thermal shutdown detection
O IGBT temperature monitor function (measurement accuracy: ±3°C (max))
O Built-in flyback transformer controller
O Built-in SPI communication interface
Outline
O Supply voltage: 6 to 20 V (primary side), 11 to 18 V (secondary side)
O Isolation voltage: 2500 Vrms (AC, 1minute)
O Operating temperature: Ta = –40 to 125°C
O Package: SSOP48
O
O
System Block Diagram
Isolation
Primary side
Flyback
controller
Secondary side
5V
regulator
Pre. Driver
MCU
Gate
ON/OFF
signal
PWM
signal
Protection
circuit
Protection circuits
Undervoltage lockout
O
Clock
oscillator
Clock
oscillator
O
O
Protection
Control
function
signal
O
Logic
Logic
O
SPI
O
Fail signal,
Temp. info
22
O
O
Miller Clamp
Soft turn-off
Thermal shutdown
detection
Temp. monitor
Short-circuit Current
detection
Over Current detection
Undervoltage lockout
Chip Overheat detection
Driver
Electric water
pump (EWP)
Electronic throttle
control (ETC)
EGR valve
System Power Supply ICs for Automotive
System Power Supply ICs with an Integrated DC/DC Convertor
With the increasing performance of automotive electronic devices, it is becoming essential to increase the current capability and the
number of outputs of power supply ICs. To address these needs, Toshiba offers system power supply ICs with an integrated DC/DC
converter. The latest addition to our portfolio of system power supply ICs, the TB9044FNG, is ideal for power supply applications for
electronic power steering systems that require an extremely high level of safety.
WHigh-efficiency DC/DC converter + LDO multi power IC
System Block Diagram
TB9042FTG
+B
DC-DC Converter Power Supply
Vreg1 = 1.5 V
or 1.2 V
6.0 V
DC/DC Converter (SW frequency: 370 kHz)
DCDC1: 6 V (1.0 A), Efficiency over 80%
O DCDC2: 1.5 V/1.2 V (1.0 A) output (selectable)
O
Series Power Supplies
VBU
DCDC2
DCDC1
LDO1: 5 V output (400 mA)
O LDO2: 5 V output (100 mA)
O
Reference
voltage
Power Supply for Backup
O
Error
Detect
Error
Detect
Vreg2 = 5.0 V
ON•OFF
Error
Detect LD01
VBU: 5 V/3.3 V (10 mA) (selectable)
Error
Logic
Register
SPI
SPI Communication
Vreg3 = 5.0 V
Failure notification
O MCU diagnosis
O
Error
Detect LD02
Reset Timer
Power-on-reset (POR)
O Watch-dog timer (WDT)
O Output undervoltage detection
O Output overvoltage detection
O
OSC
Reg1
Voltage
selection
ON•OFF
Control
DCDC1
WI
W High-efficiency DC/DC converter + LDO multi power IC
CK
CK
RST
RST
H or L
H or L
H or L
Step-up/step-down DC-DC Converter Power Supply
WAKE
DC1FB
DC1G2
DC1SW
VB
VDD
CAN_IN
IGN_IN
MCU_IN
DCDC1
6-V output, 2.7-V drive, built-in step-down driver, external step-up driver,
built-in phase compensation
DC1Css
DC1IN
+B
PGND1
System Block Diagram
TB9044FNG
Low-voltage drive (2.7 V or above) and three sensor supply voltage channels
Functional Safety with Automotive Safety Integrity Level D (ASIL D)
O
Low voltage
detection
Reset
MCU
ALARM
Buck/boost switching
regulator
Internal 5 V
regulator
Error Detect
Error Detect
LDO1IN
5 V series regulator
Series Power Supplies
SPI
LDO1: 5 V output (400 mA)
Tracker1: 5 V output (100 mA)
O Tracker2: 5 V output (100 mA)
O Tracker3: 5 V output (100 mA)
LDO1OUT
Error Detect
O
5V
logic
O
CK
WS
5 V tracker regulator 1
5V
Error Detect
WDT
5 V tracker regulator 2
Error logic
TSD
Various detection circuits
NRST1/2
Output undervoltage detection
Output overvoltage detection
O Overcurrent Detection
O Thermal Shutdown
O Watch-dog timer (WDT)
O Self-diagnosis of the detection circuits
O
TC
O
Tracker1
RESET
Tracker2
5V
Error Detect
5 V tracker regulator 3
Tracker3
5V
Error Detect
OSC
OSC
NDIAG
AGND
W System Power Supply ICs (Series Power Supplies)
Characteristics
Part Number
Package
TB9004FNG
SSOP24-P-300-0.65A
Functions
Output
Voltage
Typ. (V)
Output
Current
(mA)
45
(1 sec.)
O
–
O
O
TB9005FNG
TB9021FNG
SSOP20-P-225-0.65A
CPU voltage regulator,
watchdog timer
TSSOP16
CPU voltage regulator,
watchdog timer
Depends
on ext. Tr.
5
45
(1 sec.)
O
0.68
O
O
5
200
AEC
Two-channel system power supply IC
VCC1 is selectable from 3.4 V, 2.5 V and 1.5 V.
VCC2 = 5 V
WDT and low-voltage detection for each power supply
6 to 16
–
Low current consumption: 90 +A (typ.)
Watchdog timer enable/disable
Reset detection: 4.7 V/4.2 V (selectable)
External transistor required
6 to 18
–
Reset detection: 4.7 V/4.2 V (selectable)
Integrated output transistors
6 to 18
Remarks
O
CPU voltage regulator, 3.4/2.5/1.5 Depends
5
on ext. Tr.
watchdog timer
Supply
Voltage
(V)
Power
Input
Voltage Dissipation
Max (W)
Max (V)
50
2.8
O
O
O
Low current consumption: 30 +A (typ.)
Watchdog timer enable/disable
O
O
W System Power Supply ICs (DC-DC Converter Power Supply)
Output
Voltage
Typ. (V)
Characteristics
Output
Input
Power
Current
Voltage Dissipation
(mA)
Max (V)
Max (W)
Part Number
Package
TB9042FTG
HQFN52-P-0808-0.50
CPU voltage regulator
DC-DC converter & LDO
Watchdog timer
On-chip SPI
1.5/1.2
5
5
5/3.3
1000
400
100
10
40
(1 sec.)
5.5
HTSSOP48
CPU voltage regulator
DC-DC converter & LDO
Watchdog timer
On-chip SPI
5
5
5
5
400
100
100
100
40
(1 sec.)
3.84
TB9044FNG**
Functions
Remarks
O
O
O
O
O
DC/DC converter:
6 V & Vreg1 outputs
SW frequency: 370 kHz
O
O
O
3 LDO regulators
Low voltage detection, POR, WDT
SPI interface (error information output,
for MCU diagnosis)
Supply
Voltage
(V)
AEC
7 to 20
DC-DC converter
Voltage monitor, POR, WDT
Four low-dropout (LDO) regulators SPI (error information output) 2.7 to 18
5-V series power supply (with a 400-mA driver)
5-V tracking power supply (with three 100-mA driver channels)
O
O
**: Under development
23
Brushed DC Motor Driver ICs
WRoadmap
O
O
,TB9101FNG
TA8083FG
16.5 mm
2-channel H-bridge
(bipolar output)
Output current: 0.5 A
8.3 mm
TA8083
O
O
TA8050FG
O
O
TB9101/9102
drastic downsizing
O
O
6-channel half-bridge + SPI
RON: 0.5 1+0.5 1(typ.)
Output current: 1.0 A (per channel))
2
2-channel
H-bridge
RON: 0.6 1+0.6 1(typ.)
R
Output current: 1.0 A (p
O
(per channel))
O
CS: Available
O
1-channel high-current
motor pre-driver
Built-in charge pump
O
O
Built-in 5-V regulator
O
O
O
,TB9057FG
O
O
2-channel half-bridge + SPI
10-A Output
RON: 0.4 1(Pch+Nch)
CS: Available
2015
Under development
ES: ’17
Micro-stepping with a minimum resolution of 32 steps
Micro
Package: QFN28, Wettable
Pac
,TB9120FTG
O
O
2013
O
1-channel H-bridge pre-driver
Built-in charge pump (Low-voltage drive)
Stepping
Motor Drivers
2011
O
O
1-channel H-bridge pre-driver
Built-in charge pump
Being planned
ES: ’18
,TB9053FNG
1-channel H-bridge RON: 0.4 1(Pch+Nch)
5-A Output
,TB9052FNG
TB9110FNG
O
O
CS: Available
,TB9051FTG
,T
1-channel H-bridge with 0.3-A output current
Built-in 5-V regulator, LIN Version 1.3
1-channel H-bridge
(bipolar output)
Output current: 1.5 A
O
O
5-A driver for
engine applications
Being planned
ES: ’18
2-channel half-bridge + SPI
10-A Output
RON: 0.4 1(Pch+Nch)
,TB9054FNG
10-A driver for
engine applications
TB9056FNG
Single Channel
O
O
5.6 mm
O
8.8 mm
O
,: AEC
Being
planned
,TB910xFNG
,TB9102FNG
Multiple Channels
2017
2018
W1-Channel Brushed DC Motor Driver IC: TB9051FTG
DC motor driver IC in a small package that is capable of controlling the throttle and other valves of a vehicle engine
The TB9051FTG is housed in a small QFN package (measuring 6 mm × 6 mm) and contributes to reducing the size of electronic control
units (ECUs). The output stage has a low-on-resistance H-bridge that consists of P-channel and N-channel DMOS transistors. This
eliminates the need for a charge pump and thus helps reduce noise and power consumption. To ensure functional safety, the supply voltage
monitoring circuit performs initial diagnosis of each on-chip comparator. Applications of the TB9051FTG include opening and closing engine
throttle and other valves; retracting electric
5V
Battery
VBAT
VCC
door mirrors; and seat, rear door open/close
Initial
and other applications that conduct current
Undervoltage
&
Diagnostics
Overvoltage Detection
Initial Diagnostics
exceeding 3 A.
1-channel PWM H-bridge driver
O Output current: 5 A
O Low Ron DMOS: < 0.45 1
(P channel + N channel)
O Forward, reverse, brake, current limit control,
high-side current monitor, diagnostic output, initial
diagnosis
O Through-current protection
O Operating voltage range: 4.5 to 28 V
O Operating temperature range: –40 to 125°C
O Package: PQFN28 (6 mm x 6 mm)
Undervoltage
Detection
O
DIAG
Control
Overcurrent Detection
POR
Undervoltage Detection
Overvoltage Detection
Thermal Shutdown
PWM1/2
OUT1
O
MCU
O
O
Pre-Driver
Overcurrent Detection
High Side
Current Monitor
O
EN/ENB
O
M
EN/ENB Circuit
OCC
OUT2
Thermal
Shutdown
OCM
OSC
PGND
Battery
WH-Bridge Pre-driver: TB9057FG
H-bridge pre-driver IC designed for high-current applications such as
electric power steering (EPS)
O H-bridge pre-driver (that requires an external FET)
<Overview>
O Built-in charge pump (with a VB of +7 V or
O Supply voltage: 40 V peak
greater)
(load dump)
O Low-side pre-driver for low-voltage drive
O Operating voltage range: 5
A charge pump is used to boost a supply voltage.
to 21 V
O Built-in circuit for motor rotation direction detection
O PWM operating frequency:
O High-speed pre-driver
20 kHz
O Built-in high-speed and high-accuracy motor
O Operating temperature
current sense circuit
range: Ta = – 40 to 125°C
O Duplicate power and ground terminals as a
O Package: LQFP48
provision for functional safety
O Various detection circuits Undervoltage detection,
FET short-circuit detection, thermal shutdown
+
VB1/2
PCC1/2
VCC5A1/2
5V
Reg.
PCCO
SO1/2
VDD1/2
CRESET
PCCD1/2
Charge pump
VDD under voltage
detection
HO1
DR1
VB under voltage
detection
HO2
DR2
Pre-Driver
LO1
IN1 to 4
ENA
MCU
MR1/2
Motor direction
detection
VCC5A1/2
Short
detection
PD1/2
LS
AMPP1/2
Current sensor
TSD
DG1/2
M
LO2
AMP2
AMP1
AMPM1/2
Error logic
CS2
CS1
WLineup
Part Number
Package
Output
Current
Power
Supply
Recommended Applications
TB9056FNG
SSOP24-P-300-0.65A
TB9110FNG
SSOP24-P-300-0.65A
BATT
(Built-in 5-V reg.) HVAC actuator control
BATT
±0.02 A (Built-in
5-V reg.) Automotive fan motors (HVAC, seat ventilation, radiator, etc.)
TB9101FNG
SSOP24-P-300-0.65A
±0.5 A
BATT
Features & Functions
1-channel H-bridge, LIN Version 1.3 (slave)
–
1-channel pre-driver, Built-in charge pump
(external N-channel FET)
2-channel H-bridge driver,
DMOS power transistor version of the TA8083FG
–
HVAC damper control, door mirror angle control, etc.
TB9102FNG
SSOP24-P-300-0.65A
±0.5 A
BATT
HVAC damper control, door mirror angle control, etc.
6-channel half-bridge driver, SPI interface
TB9052FNG
HTSSOP48-P-300-0.50
±1.0 A
BATT
EPS, electric power brake, seat belt pretensioners, auto sunroof,
electric sliding doors, power windows, electric power seats, etc.
1-channel H-bridge pre-driver (external N-channel FET)
Built-in motor current detection circuit
TB9051FTG
P-QFN28-0606-0.65-001
±5.0 A
BATT
Open/close control for engine throttle and other valves
1-channel PWM H-bridge pre-driver
Small package, various fault detection functions
LQFP48-P-0707-0.50C
±1.0 A
BATT
EPS, electric power brake, seat belt pretensioners, auto sunroof,
electric sliding doors, power windows, electric power seats, etc.
TB9053FNG+
TB9054FNG+
HSSOP36 (T.B.D.)
±10 A
HSSOP36 (T.B.D.)
±10 A
BATT
Open/close control for engine throttle and other valves
TB9120FTG**
QFN28, Wettable
±1.0 A
BATT
Reflecting-mirror angle control for a head-up display, HVAC coolant
valve control, two-wheeler idle speed control valve control
TB9057FG
1-channel H-bridge pre-driver (external N-channel FET)
Built-in motor current detection circuit,
Built-in circuit for motor rotation direction detection
Single-channel PWM H-bridge predriver
10-A-class output stage, SPI interface,
various fault detection functions
Single-channel stepping motor driver, PWM constant-current
control, clock input, micro-stepping, mixed-decay mode
+
24
AEC
±0.3 A
Planning
Planning
: Being planned **: Under development
Brushless DC Motor Driver ICs
WRoadmap
Brushless (with Sensor Inputs)
O
O
O
O
O
Motor driver (0.3 A)
Control logic
LIN transceiver
120-degree commutation
O
O
O
O
Pre-driver
Sine-wave drive
Control logic
Built-in step-up (DC-DC) converter
,TB9081FG
TB9067FNG
TB9065FG
O
,: AEC
,TB9080FG
TB9068FG
O
Pre-driver
Built-in charge pump
LIN transceiver
O
O
O
Pre-driver
Control logic
120-degree commutation
O
O
O
ES: Now
Pre-driver (e.g., EPS)
Built-in charge pump
Package: LQFP64
,TB9064FTG
O
Brushless (sensorless)
O
O
,TB9061FNG
TB9060FNG
O
O
O
Pre-driver
120-degree commutation
Control logic
O
O
O
Driver (1.0 A)
120-degree commutation (LAP turn-on control)
Control logic
,TB9061AFNG
Pre-driver
120-degree commutation
Control logic
O
O
O
O
,TB9062FG
Pre-driver
120-degree commutation
Control logic
Fast boot & low-rpm support
O
O
O
O
2010
Being planned
ES: ’18
Pre-driver
Control logic
N-ch/N-ch driver
120-degree commutation (LAP turn-on control)
2015
WThree-Phase Brushless Motor Pre-driver IC
Being planned
ES: ’18
2018
Battery
for EPS Applications: TB9081FG
New three-phase motor pre-driver IC designed for
high-current applications such as electric powerassisted steering (EPS)
O Three-phase pre-driver (that requires an external FET)
O High-side and low-side charge pumps
O High-speed pre-driver
O 5-channel safety relays
O High-speed motor current sense circuit
O Various detection circuits
Undervoltage detection for each power supply, thermal
shutdown, external FET short-circuit detection
Initial diagnosis of the detection circuits
O The operation of pre-drivers in the event of a fault is
pre-configurable via SPI communication.
O Abnormal status readable via the SPI interface
VB
CLKOUT
5 V Reg.
OSC
Charge pump
BR1O
Power
Supply
Relay
VCC
BR2O
HS
HUO
Each voltage
detection circuit
HVO
Motor Drive
ALARM
HWO
Power Supply Relay Control Signal
SHU
Motor Relay Control Signal
RUO
Pre-Driver
/CS
SDIN
SDOUT
SCK
11ch
RESET
<Overview>
O Supply voltage: 40 V peak (load dump)
O Operating voltage range: 4.5 to 18 V
O PWM operating frequency: 20 kHz
O Operating temperature range: Ta = –40 to 125°C
O Package: LQFP64
SHV
Motor Relay
M
RVO
For Motor:
6ch
For Relay:
5ch
SPI
SHW
RWO
LUO
LVO
Motor Drive
Motor Control Signal
MCU
LWO
FET short detection
TSD
5V
VREF1
VRI
Current sensor
AMP3
NDIAG
AMP2
AMP1
Error logic
WLineup
AEC
Part Number
Package
Input
Commutation
Output
Features & Functions
Supply Voltage
TB9061FNG
SSOP24-P-300-0.65A
PWM, DC voltage
120 degree
(Sensorless)
Pre-drivers
P-ch/N-ch
Simple application circuit due to external part count reduction
Sensorless control, Overcurrent reduction
5.5 to 18 V
Pre-drivers
P-ch/N-ch
Simple application circuit due to external part count reduction
Sensorless control, Overcurrent reduction,
Wide PWM dynamic range for output
5.5 to 18 V
Pre-drivers
P-ch/N-ch
Only a few external parts required, Support for both PWM and DC inputs
120-degree commutation, 5-V sensor comparator
6 to 18 V
–
Allows direct drive of a motor with built-in 0.3-A drivers
LIN 1.3 transceiver, 5-V system power supply
7 to 18 V
–
Pre-drivers
N-ch/N-ch
Quiet motor operation due to the use of sine wave current
High drive efficiency thanks to auto lead angle control
7 to 18 V
TB9061AFNG
SSOP24-P-300-0.65A
PWM, DC voltage
120 degree
(Sensorless)
TB9067FNG
SSOP24-P-300-0.65A
PWM, DC voltage
120 degree
TB9068FG
LQFP48-P-0707-0.50
120 degree
PWM, phase signals
External control
180 degree
Sine wave
Direct
TB9080FG
LQFP64-P-1010-0.50E
PWM, DC voltage
TB9081FG**
LQFP64-P-1010-0.50E
PWM, DC voltage External control
Pre-drivers
N-ch/N-ch
5-channel safety relays, Selectable operation on fault detection
Initial diagnosis of detection circuits
4.5 to 18 V
planning
TB9062FG+
QFP48 (T.B.D.)
PWM, DC voltage
120° overlapping
commutation
(sensorless)
Pre-drivers
N-ch/N-ch
Quiet operation due to sensor control and
overlapping commutation control
High efficiency due to auto lead angle control
5.5 to 18 V
planning
TB9064FTG+
QFN28 (T.B.D.)
PWM
120° overlapping
commutation
(sensorless)
Direct
Direct motor drive with built-in 1-A drivers
Quiet operation due to sensorless overlapping commutation
High efficiency due to auto lead angle control
5.5 to 18 V
planning
+
: Being planned **: Under development
25
Automotive Intelligent Power Devices (IPDs)
Toshiba’s automotive IPDs can be directly controlled by a microcontroller. In the event of
a shorted load, overcurrent protection or thermal shutdown is tripped to protect an ECU in which
IPDs are used. Toshiba’s automotive IPDs also have a diagnostic output that feeds back the states
of their output and an ECU to a microcontroller for easy monitoring.
Q High-Side and Low-Side Power Switches
Q Gate Drivers
Toshiba's high-side and low-side power switches contain protection
circuits for a shorted load, open load and an output short-circuit to the
power supply as well as an abnormal ECU condition (overheating).
These power switches also have diagnostic outputs that provide
feedback to a microcontroller. Thus, they help to reduce the number
of components and improve the reliability of an ECU. Toshiba's
power switches are available in small packages such as SOP8, PS8
and WSON10, which contribute to reducing the ECU size.
A large-current semiconductor relay
switch can be built by combining a
gate driver and a power MOSFET.
Power MOSFET
TPD7104AF
Reference Board
Application Example of a High-Side Power Switch (TPD1055FA)
Application Example of Gate Drivers
For
For
Reverse-Battery
Load Switch
Protection
5 V/3.3 V
Input
Diagnostic Output 1
Normal/Shorted Load
Overheated/Open Load
IN
Overheating
Diagnosis
+
Battery
5V
REG
Overcurrent
(short-circuit to
ground) diagnosis
REG
DIAG1
MCU
–
VDD
On-Chip
Power Supply
Control
Logic
DIAG2
Driver
Diagnostic Output 2
Short-Circuit to Power Supply
OUT
Charge pump
for driving
an N-channel
power MOSFET
OUT
LOGIC
IS
RISfef
Load
VDD
Charge
g
Pump
Load
Blocks the current flow into
a product in the event of
a reverse battery connection
Overcurrent
to prevent an external FET
Amplifier
Detection
from turning on
Resistor
–
VBGR
Diagnosis for
short-circuit to
power supply and
output open-circuit
DIAG
IN
P
+ COMP
+
G
GND-S
SW
Battery
5V
REG
MCU
+
Output DMOS
–
GND
SUB
GND
W IPDs for High-Side Switch Lineup
Protection
Characteristics
Part Number
Output
TPD1052F
TPD1053F
TPD1055FA
TPD1060F**
Over
Current
Over
Temp.
–40 to 125˚C
PS-8
0.8A min
150˚C min
–
–40 to 125˚C
SOP-8
3A min
150˚C min
–15 V
3A min
150˚C min
–
3A min
150˚C min
–
Topr
< 0.8 A
0.8 1
<3A
0.12 1
5 to 18 V
<3A
0.12 1
–40 to 125˚C WSON10
4 to 18 V
<3A
0.12 1
–40 to 125˚C
VDD (opr)
Output
Current
1
40 V
5 to 18 V
1
60 V
5 to 18 V
1
40 V
1
40 V
Diagnosis
Package
RDS (ON) Max
/[email protected]˚C
VDS
SOP-8
Over
Over
Voltage Current
Over
Temp
–
–
–
**: Under development
Protection
Characteristics
Output
Battery
short
–
W IPDs for Low-Side Switch Lineup
Part Number
Open
Load
VDS
VDD (opr)
Output
Current
RDS (ON) Max
/[email protected]˚C
Topr
Diagnosis
Package
Over
Current
Over
Temp.
Over
Voltage
Over
Current
Over
Temp
Open
Load
TPD1030F
TPD1032F
TPD1036F
TPD1044F
TPD1046F
2
40 V
Up to 40 V
<1A
0.6 1
–40 to 110˚C
SOP-8
1A min
150˚C min
40 V
–
–
–
2
20 V
Up to 20 V
<3A
0.4 1
–40 to 110˚C
SOP-8
3A min
150˚C min
40 V
–
–
–
2
30 V
Up to 30 V
< 1.5 A
0.5 1
–40 to 110˚C
SOP-8
1.5A min
150˚C min
40 V
–
–
–
1
41 V
Up to 40 V
<1A
0.6 1
–40 to 125˚C
PS-8
1A min
150 min
41 V
–
–
–
2
40 V
Up to 20 V
<3A
0.2 1
–40 to 125˚C
SOP-8
3A min
150˚C min
40 V
–
–
–
TPD1054F
1
40 V
VOUT: Up to 40 V
VDD: Up to 5.5 V
<1A
0.8 1
–40 to 125˚C
PS-8
1A min
150˚C min
40 V
TPD1058FA
1
40 V
VOUT: Up to 40 V
VDD: Up to 5.5 V
<6A
0.1 1
–40 to 125˚C
WSON10
6A min
150˚C min
40 V
W IPDs for Power MOSFET Gate Driver Lineup
Characteristics
Part Number
TPD7101F
TPD7102F
TPD7104F
TPD7104AF
TPD7210F
TPD7211F
TPD7212F**
Function
High Side Nch
Pw-MOSFET
Gate Driver
High Side Nch
Pw-MOSFET
Gate Driver
High Side Nch
Pw-MOSFET
Gate Driver
High Side Nch
Pw-MOSFET
Gate Driver
3 Phase Full Bridge
Pw-MOSFET
Gate Driver
Half-Bridge
Pw-MOSFET
Gate Driver
3 Phase Full Bridge
Pw-MOSFET
Gate Driver
Output
Protection
Package
VDD (opr)
Output
Current
2
8 to 18 V
±0.1 A
(typ)
1
7 to 18 V
Depends on
internal –40 to 125˚C
drive
PS-8
1
5 to 18 V
Depends on
internal –40 to 125˚C
drive
PS-8
1
5 to 18 V
Depends on
internal – 40 to 125˚C
drive
PS-8
6
7 to 18 V
±1 A
(max)
–40 to 125˚C SSOP-24
2
5 to 18 V
±0.5 A
(max)
–40 to 125˚C
6
4.5 to 18 V
–1 A/
+1.5 A
– 40 to 125˚C WQFN32
Topr
–40 to 110˚C SSOP-24
PS-8
Diagnosis
Over
Current
Over
Voltage
Under
Voltage
Over
Current
Adjust
able
–
(4.5 V
max)
(DIAG-1 L)
Under
Voltage
Reverse
Battery
–
(7.3 V max,
DIAG-2 H)
–
–
High Side Nch Pw-MOSFET VGS
Monitor DIAG H
–
–
–
–
–
–
–
–
–
–
–
–
–
Input Arm-short
Detection
FAULT H
–
–
–
–
–
–
–
–
–
(18 V min)
* The up-to-date and more detailed information on automotive MOSFETs and IPDs is available on our website. https://toshiba.semicon-storage.com/
26
Over
Voltage
–
FAULT H
–
–
–
–
**: Under development
Automotive Discrete Devices
Product Overview
MOSFETs for driving
a three-phase brushless
DC motor for EPS.
LV-IPDs for MOSFET gate drive.
MOSFETs and LV-IPDs
for replacement of mechanical
relays in a junction box
MOSFETs
for LED
headlight systems
Photocouplers
er
for HEV inverter
applications
MOSFETs
for fan motor
systems
TVS diodes
for surge protection
of the CAN and LIN buses
W Improved Turn-Off Characteristics
U-MOS IV Generation (TK150F04K3)
W Increased Cycle for Thermal
Cycling Test (TCT)
U-MOS IX Generation (TK1R4F04PB)
VGS = 10 V/div
Wettable flanks
The tips of the pins of
the SOP Advance(WF)
package are plated
(highlighted in blue).
VGS = 10 V/div
Reduced bouncing
amplitude and oscillation
ID = 50 A/div
VDS = 10 V/div
t = 400 nsec/div
VDS = 10 V/div
Mold resin
ID = 50 A/div
t = 400 nsec/div
Test conditions: Inductive load, VDD = 20 V, VGS = 15 V, RG = 39 1, IDP = 120 A, Ta = 25°C
WTVS Diodes for Surge Protection of the CAN,
LIN and FlexRay Buses
Improves the reliability of in-vehicle networks through high protection
performance
OAutomotive Network/Bus line
(CAN bus/LIN bus/FlexRay bus)
CAN bus (H)
Gateway
CAN bus (L)
Features of Toshiba’s TVS Diodes for In-Vehicle LAN
Reliable protection of downstream devices: Toshiba's TVS diodes exhibit
low clamping voltage because of low dynamic resistance (Rdyn).
O High ESD immunity: High ESD tolerance requirements are specified in
IEC 61000-4-2 and ISO 10605.
O High-quality signal transmission: In-vehicle LAN signals are less
susceptible to distortion because of low-capacitance diodes.
O
DF3D18FU
/29FU/36FU
ECU A
ECU B
ECU C
ESD Protection
FlexRay bus
LIN bus
Sensor
Motor
X-by-Wire
ECU
DF2B18FU
/29FU/36FU
27
Automotive Discrete Devices
Major Power Devices Compliant with the AEC Standards
WMOSFETs
Toshiba is expanding its portfolio of power devices in TO-220SM (W), SOP-Advance and TSON-Advance and those fabricated using the UMOS-VIII and
UMOS-IX processes.
Package
Unit (mm)
Polarity
N-ch
DPAK+
6.5 x 9.5
t = 2.3
P-ch
Part Number
Absolute Maximum Ratings
VDSS (V)
RDS (ON) max (mΩ)
ID (A)
AEC
Series
|VGS| = 10 V
TK100S04N1L
40
100
2.3
U-MOSVIII
TK1R4S04PB
40
120
1.35
U-MOSIX
TK90S06N1L
60
90
3.3
U-MOSVIII
TK55S10N1
100
55
6.5
U-MOSVIII
TJ80S04M3L
–40
–80
5.2
U-MOSVI
TJ60S06M3L
–60
–60
11.2
U-MOSVI
●
WDiodes
In addition to standard rectifier diodes, Toshiba is expanding its portfolio of high-speed rectifier and Schottky barrier diodes.
Package
Unit (mm)
Absolute Maximum Ratings
Part Number
Electrical Characteristics (max)
VRRM (V)
IF (AV) (A)
VFM (V)
CRG09
400
1.0
1.1
CRG04
600
1.0
1.1
CRG05
800
1.0
1.2
M-FLAT
CMG02
400
2.0
1.1
2.4 x 4.7
t = 0.98
CMG03
600
2.0
1.1
HMG02 *1
400
0.7
1.0
S-FLAT
1.6 x 2.6
t = 0.98
AEC
●
HM-FLAT
2.4 x 3.35
t = 0.98
*1: Dual diode
WLV-IPD
Package
Unit (mm)
Part Number
Function
Characteristics
AEC
TPD1060F
1 ch High side switch
VDD = 4 to 18 V, Tj = –40 to 125˚C, ID = –3 A
●
TPD1044F
1 ch Low side switch
VDS (DC) = 41 V max, Tj = –40 to 125˚C, ID = 1 A
Planning
TPD7104F
Gate driver
VDD = 5 to 18 V, Tj = –40 to 125˚C
●
TPD7104AF
Gate driver
VDD = 5 to 18 V, Tj = –40 to 125˚C
●
SOP-8
4.9 x 6
t = 1.6
PS-8
2.9 x 2.8
t = 0.8
WBipolar Transistors
Toshiba is expanding its portfolio of bipolar transistors in the PW-Mini package.
Package
Unit (mm)
Polarity
Part Number
New
PW-Mold
6.5 x 9.5
t = 2.3
PNP
28
VCE (sat) (V)
hFE
VCEO
(V)
IC
(A)
min
VCE
(V)
IC
(A)
max
IC
(A)
IB
(mA)
50
5
400
2
0.5
0.22
1.6
32
2SC3303
80
5
70
1
1
0.4
3
150
TTC012
375
2
100
5
0.3
0.5
0.5
62.5
TTC014
800
1
100
5
0.1
1.0
0.5
50
2SD1223
80
4
2000
2
1
1.5
3
6
TTA005
– 50
–5
200
–2
–0.5
–0.27
–1.6
–53
TTA009
– 80
–3
100
–2
– 0.5
– 0.5
–1
– 100
2SA2142
– 600
–0.5
100
–5
–0.05
–1.0
–0.1
–10
TTC016
NPN
Absolute Maximum
Ratings
AEC
Planning
Major Small-Signal Devices Compliant with the AEC Standards
WMOSFETs
Package
Unit (mm)
Absolute Maximum Ratings
Polarity
RDS (ON) max (mΩ)
Part Number
VDSS (V)
VGSS (V)
ID (A)
|VGS| = 1.5 V
|VGS| = 2.5 V
|VGS| = 4.5 V
Ciss (pF)
Qg (nC)
Tch (˚C)
UFM
2.0 x 2.1
t = 0.75
Nch + Zener
SSM3H137TU
34
±20
2
–
–
280
119
3
150
Nch x 2
SSM6N24TU
SSM6N39TU
30
20
±12
±10
0.5
1.6
–
247
180
139
145
[email protected] V
245
260
–
7.5
150
150
SSM6N62TU*
20
±8
0.8
121 (typ.) @1.2 V
74 (typ.)
67 (typ.)
177
2
150
SSM6P54TU
– 20
±8
– 1.2
555
228
–
331
7.7
150
SSM6P39TU
SSM3K337R
– 20
38
±8
±20
– 1.5
2
[email protected] V
294
–
[email protected] V
176
250
120
6.4
3
150
150
SSM3K341R
SSM3K2615R
60
60
±20
±20
6
2
–
–
[email protected] V
51
[email protected] V
550
150
9.3
6
175
150
150
UF6
2.0 x 2.1
t = 0.75
Pch x 2
SOT-23F
2.9 x 2.4
t = 0.88
Nch
UDFN6
2.0 x 2.0
t = 0.8
–
SSM3K318R
60
±20
2.5
–
–
–
145
235
7
SSM3K361R
100
±20
3.5
–
–
92
430
3.2
175
Pch
SSM3J356R
– 60
– 20/+10
–2
–
–
[email protected] V
330
8.3
150
Nch
SSM6K504NU
30
±20
9
–
–
26
620
4.8
150
Nch x 2
SSM6N55NU
30
±20
4
–
–
64
280
2.5
150
*: New product
WBipolar Transistors
Package
Unit (mm)
USM (SOT-323)
Absolute Maximum Ratings
Polarity
VCE (sat) (V)
hFE
Part Number
VCEO (V)
IC (A)
PC (W)
Tj (°C)
MIN
MAX
50
0.15
0.1
125
70
700
2SC4116
NPN
2.0 x 2.1
t = 1.1
PNP
2SA1586
– 50
– 0.15
0.1
125
70
400
S-Mini (SOT-346)
NPN
2SC2712
50
0.15
0.15
125
70
700
2.9 x 2.5
t = 1.4
PNP
2SA1162
– 50
– 0.15
0.15
125
70
400
Test Condition
MAX
VCE = 6 V
IC = 2 mA
VCE = – 6 V
IC = – 2 mA
VCE = 6 V
IC = 2 mA
VCE = – 6 V
IC = – 2 mA
Test Condition
IC = 0.1 A,
IB = 10 mA
0.25
IC = –0.1 A,
IB = –10 mA
IC = 0.1 A,
IB = 10 mA
– 0.3
0.25
IC = –0.1 A,
IB = –10 mA
– 0.3
WSwitching Diodes
Package
Unit (mm)
Absolute Maximum Ratings
Part Number
Electrical Characteristics (max)
Pin Assignment
VR (V)
IFSM (A)
IO (A)
Tj (˚C)
VF (V) @IF = 0.1 (A)
IR (μA)
@VR (V)
trr (ns)
ESC (SOD-523)
0.8 x 1.6
t = 0.7
1SS307E
80
1
0.1
150
1.3
0.01
80
–
USC (SOD-323)
1SS352
80
1
0.1
125
1.2
0.1
30
4
1SS403
200
2
0.1
125
1.2
0.1
50
60
1SS302A
80
2
0.1
150
1.2
0.1
30
4
1.25 x 2.5
t = 1.1
USM (SOT-323)
2.0 x 2.1
t = 1.1
WTVS Diodes (ESD Protection Diodes)
Absolute Maximum Ratings
Package
Unit (mm)
Part Number
Pin Assignment
Electrical Characteristics (max)
Tj (˚C)
VESD (kV)
IEC 61000-4-2
VESD (kV) ISO 10605
@330 pF/2 kΩ
VBR (V)
IR (μA) (max)
@VR (V)
RRDYN (Ω) (typ.)
Ct (pF) (typ.)
USC (SOD-323)
DF2B18FU
150
±30 kV
±30 kV
16.2
0.1
12
0.8
9
1.25 x 2.5
t = 1.1
DF2B29FU
150
±25 kV
±30 kV
26
0.1
24
1.1
9
DF2B36FU
150
±20 kV
±20 kV
32
0.1
28
1.5
7
USM (SOT-323)
DF3D18FU
150
±30 kV
±30 kV
16.2
0.1
12
0.8
9
2.0 x 2.1
t = 1.1
DF3D29FU
150
±25 kV
±30 kV
26
0.1
24
1.1
9
DF3D36FU
150
±20 kV
±20 kV
32
0.1
28
1.5
7
WStandard Logic ICs (Topr: – 40°C to 125°C)
Package
Unit (mm)
TSSOP14B (5.0 x 6.4 t = 1.2)
TSSOP16B (5.0 x 6.4 t = 1.2)
TSSOP20B (6.5 x 6.4 t = 1.2)
Series
Part Number
74VHCxxFT
VHC Series
Key Electrical Characteristics
VCC = 2.0 V to 5.5 V
tpd = 8.5 [email protected] V
74VHCTxxFT
VCC = 4.5 V to 5.5 V, TTL input
74VHCVxxFT
VCC = 1.8 V to 5.5 V
tpd = 8.5 [email protected] V
For details of AEC compliance, contact your Toshiba sales representative.
Toshiba is expanding its portfolio of AEC-qualified devices. For the latest information, visit Toshiba's website.
WOne-Gate Logic ICs (Topr: –40°C to 125°C)
Package
Unit (mm)
USV (SOT-353)
Series
Part Number
TC7SHxxFU
VCC = 2.0 V to 5.5 V
tpd = 9 [email protected] V
TC7SETxxFU
VCC = 4.5 V to 5.5 V
TTL input
TC7SZxxFU
VCC = 1.65 V to 5.5 V
tpd = 5.5 [email protected] V
VHS Series
2.0 x 2.1
t = 1.1
SHS Series
Key Electrical Characteristics
29
Photocoupler for Automotive Applications
Toshiba offers photocouplers that consist of a high-power infrared LED coupled with a
photodetector fabricated using the latest process. These photocouplers provide high isolation
voltage and low power consumption, making them ideal for applications that require enhanced
safety and environmental friendliness.
W Block Diagram Example (Inverter)
Transistor-Output Photocouplers (for Feedback)
Standard
Charging Connector
TLX9300, TLX9000, TLX9185A,
TLX9291A
AC-DC
CAN
Auxiliary
Battery
Engine
DC-DC
Converter
Battery
On-Board
Management Charger
Unit
Motor
Hydraulic
Brake
Pump
Air-Conditioner
ECU
Inverter
EPS
Accelerator
Brake
External
Power Supply
Hybrid
ECU
CAN
Communications
Reactor Current
Battery Voltage
Reactor Temp.
IGBT Temp.
Board Temp.
CAN
PHEV-ECU
Selector
High-Speed Photocouplers
Lever
TLX9304, TLX9378
Transistor-Output Photocouplers
TLX9300, TLX9000
TLX9185A, TLX9291A
For BMS
Communication
TLX9376,
TLX9310
Battery Monitoring
TLX9175J
Battery
Monitor
Unit
Battery
Monitor
Unit
Battery
Module
Battery
Module
Air-Conditioner
Compressor
Drive
Battery
Drive
Circuit
Fast Charger
Connector
Gate
Drive
Control MCU
PWM
Signal Gen.
Protection
Circuits
Motor 1
IGBT
Motor 2
Gate
Drive
Drive
Circuit
3-Phase
Output Current
Gate Drive
Supply Voltage
Serial Communications
Heater
Current Sensor
Current
Detection Circuit Photocoupler
Household Outlet
(100 V/200 V)
(Isolation)
W Use of Photocouplers
Gate
Power Supply
Circuit
Gate
Drive
Control MCU
Buck/Boost Control
IGBT
Buck/Boost
Non-Contact Charging
(Contact Charging)
AC-DC
Charging Station
W IC Output (High Speed Communications)
Output Type
Data Rate
(Standard)
Characteristics
IFHL (max)
(mA)
Tstg (˚C)
(min) to (max)
Topr (˚C)
(min) to (max)
TLX9304
Open collector
1 Mbps
5
– 55 to 150
– 40 to 125
3750
5 mm
5pin SO6
TLX9378
Open collector
10 Mbps
5
– 55 to 150
– 40 to 125
3750
5 mm
5pin SO6
TLX9367
Totempole
20 Mbps
4
– 55 to 150
– 40 to 125
3750
5 mm
5pin SO6
VCEO (MIN)
(V)
Tstg (˚C)
(min) to (max)
Topr (˚C)
(min) to (max)
Part Number
Pin Configuration
Isolation Clearance/
Voltage
Creepage
BVS(Vrms) Distance
Package
AEC
Planning
W Transistor Output (DC Input)
Characteristics
Part Number
Pin Configuration
IC / IF (%)
VCE (sat) (V)
(min) to (max)
(MAX)
(mA)/IF (mA)
@I
C
@IF (mA)/VCE (V)
Isolation Clearance/
Voltage
Creepage
BVS(Vrms) Distance
Package
TLX9000
100 to 900
@5/5
0.4
@2.4/8
40
– 55 to 150
–40 to 125
3750
5 mm
SO4
TLX9300
100 to 900
@5/5
0.4
@2.4/8
40
–55 to 150
–40 to 125
3750
5 mm
4pin SO6
TLX9291A
50 to 600
@5/5
0.4
@2.4/8
80
–55 to 150
–40 to 125
3750
5 mm
SO4
TLX9185A
50 to 600
@5/5
0.4
@2.4/8
80
–55 to 150
–40 to 125
3750
5 mm
4pin SO6
AEC
Planning
W Photorelays (1-Form-A)
Part Number
OFF-State
ON-State
Pin Configuration Output Terminal
Current
Voltage
ION (MAX) (mA)
VOFF (Max) (V)
TLX9175J
600
ON-state Resistance
RON (Max)
@ION (mA)/IF (mA)
(1)
335
15
15/10
Trigger LED
IFT (Max)
(mA)
3
Isolation Clearance/
Creepage
Voltage
BVS(Vrms) Distance
3750
5 mm
Package
AEC
4pin SO6
Planning
Package
AEC
W Photovoltaic Output
Part Number
Pin Configuration
TLX9905
Short-Circuit Current
(uA) (min)
@IF (mA)
Open Voltage
VOC (V) (min)
@IF (mA)
Tstg (˚C)
(min) to (max)
Topr (˚C)
(min) to (max)
12
@10
7
@10
–55 to 150
–40 to 125
Isolation Clearance/
Creepage
Voltage
BVS(Vrms) Distance
3750
5 mm
4pin SO6
Planning
30
Control Circuit
TLX9906
12
@10
7
@10
–55 to 150
–40 to 125
3750
5 mm
4pin SO6
Storage for Information and Entertainment Applications
Toshiba offers total storage solutions for information and entertainment applications.
The portfolio has consisted of the memory products equipped with Toshiba NAND flash
technology, and the hard disk drives (HDDs) that equipped with shock-proof technology.
IVI
W Storage Application Examples
Capacity
High
Application
Automotive
Information & Entertainment
Display
Audio
Car
Navigation
Display
Audio
Car Navigation
IVI
User data
HDD
(Music, Movie, etc)
Smart
phone
Map data
+
e.MMC
(OS, Application)
e.MMC
e.MMC
+
System data
HDD
SD/microSD
memory card
+
e.MMC
e.MMC
Low
W Products with NAND Flash Memories for Information and Entertainment Applications
e.MMCTM
SD/microSD memory card
Leading-Edge NAND Flash
Memory Technology
-Industry’s smallest chip size
-Industry-leading performance
De facto standard of embedded
storage
O Optimal functionality for information
and entertainment applications
O
“e.MMC” is the trademark of
JEDEC/MMCA.
High-Performance
NAND Controller Technology
Enhanced
Support for Quality Assurance
-Data refresh function
-Robust FW algorithm for power
interruption
-Operating temperature range:
-Support based on automotive
industrial standards
W e.MMC Lineup
O
Part Number
Max. Power Supply Voltage Operating
e·MMC Speed
Temperature
version
VccQ (V)
(MB/s) Vcc (V)
(˚C)
Capacity
32 GB
32 GB THGBMHG8C4LBAAR
5.1
400
2.7 to 3.6
16 GB THGBMHG7C2LBAAR
1.7 to 1.95
– 40 to +85 FBGA153
2.7 to 3.6
16 GB
8 GB
AEC-Q100 Grade2
Part Number
Removable storage
Including data refresh function,
robust FW algorithm for power
interruption and reliability test
commands
Max. Power Supply Voltage Operating
e·MMC Speed
Temperature
version
VccQ (V)
(MB/s) Vcc (V)
(˚C)
Package
5.1
400
16 GB THGBMHG7C2LBAB7
2.7 to 3.6
1.7 to 1.95
– 40 to +105 FBGA153
2.7 to 3.6
8 GB THGBMHG6C1LBAB6
W Hard Disk Drives (HDDs) for Information and
Entertainment Applications
O Toshiba
MQ01AADxxxC series are designed for the demanding
automotive environments and applications.
Estimate
effects on the
head position
Power
Supply
Voltage
Vcc (V)
Operating
Temperature
(˚C)
Card Type
THNSR032GCA6LB
SD
THNSR032GCB6KG
microSD
THNSR016GCA6LA
SD
4.20
80
2.7 to 3.6
–40 to +85
microSD
THNSR008GCA6KA
SD
THNSR008GCB6KE
microSD
W HDD Lineup
64 GB THGBMHG9C8LBAB8
32 GB THGBMHG8C4LBAB7
Max.
Speed
(MB/s)
THNSR016GCB6KF
8 GB THGBMHG6C1LBAAL
Capacity
SD
Physical
Layer
Version
Part Number
Package
64 GB THGBMHG9C8LBAAG
O
O
W SD/microSD Lineup
AEC-Q100 Grade3
Capacity
O
O
Capacity
Part Number
320 GB
MQ01AAD032C
200 GB
MQ01AAD020C
100 GB
MQ01AAD010C
Rotation
Speed
(rpm)
Interface
Operating
Temperature
(˚C)
Dimensions
4,200
Serial ATA 2.6 /
ATA8
3.0 Gbit/s,
1.5 Gbit/s
– 30 to +85
69.85 mm (W)
x 100.0 mm (L)
x 9.5 mm (H),
109g Max. (Weight)
Definition of capacity: Toshiba defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as
1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating
system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2 30 =
1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity
(including examples of various media files) will vary based on file size, formatting, settings, software
and operating system, such as Microsoft Operating System and/or pre-installed software
applications, or media content. Actual formatted capacity may vary.
Correct the
head position
in real time
Monitor vibration
acceleration
Toshiba Automotive HDDs Shock-proof Technology:
The HDDs monitor the acceleration of the vibration. When an automobile passes
a bumpy road, the HDDs estimate effects on the read/write-head position and
correct it in real time.
The products shown herein are intended for information and entertainment
applications. Contact your Toshiba sales representative for consultation about other
applications as well as the quality test conditions of respective products.
31
Information and Entertainment Applications
Information and entertainment applications make driving safe, comfortable and fun, and convert a car cabin into an entertainment space.
Information and entertainment applications make various operations easy and convenient, creating a safe and comfortable environment
for drivers.
Moreover, information and entertainment applications constantly monitor road and vehicle conditions that change moment by moment to
provide smart solutions for safe driving.
Connecting to cloud-servers via telematics provides extensive information services.
Head-up display (HUD) helps minimize a driver's eye movement, improving driving safety.
O Car navigation systems support voice commands and provide a large touch panel, making their operations during driving more convenient.
Additionally, applications such as Apple CarPlay and Android Auto™ allow you to cast your familiar smartphone interface to the car's
information and entertainment applications display. These applications also support hands-free phone calling.
O
O
QHead-up display (HUD)
Connecting to
cloud-services via telematics
Instrument
Cluster
Cameras
Smart Key
Center Information
Display
Speakers
Q Large Touch-Operated LCD
Center Information Display (CID)
Q Linking with Smartphone
Application Examples for Center Information Displays
Application Examples for Instrument Clusters
Car navigation & information services
O Surround-view and rear-view monitor
O Cooperation with road traffic information (ETC 2.0) services
O Future cooperation with advanced intelligent transportation
system (ITS) communication services
O Multimedia playback
O Cooperation with mobile devices (Apple CarPlay, Android Auto™,
etc.)
O HEV/EV battery management information
O
O
32
Smartphone
Tablet
Data Storage
Wearable Devices
Advanced Driver Assistance Systems (ADAS)
Head-up display (HUD)
O Displaying digital meters, a mileage monitor and alerts from tire
pressure monitoring system (TPMS).
O Driver information
O Smart Key/Remote Keyless Entry (RKE)
O
* Apple CarPlay is a trademark of Apple Inc. in the US. and other countries. iPhone is a
registered trademark of Apple Inc. in the U.S. and other countries.
* Android and Android Auto are trademarks of Google Inc. in the U.S. and other countries.
* Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such
marks by Toshiba is under license.
Connected cars provide a higher level of safety and more convenient services.
A connected car is equipped with a communication device that provides Internet access and a link with infrastructure. The network link
makes it possible to gather various data on vehicles, road conditions and towns. Analysis of these data is expected to lead to new services
offering new value.
W Concept of connected cars
QCommunication with devices outside a vehicle
(via existing networks)
V2x - Safety
760 MHz & 5.8/5,9 GHz
802.11p
Central
Gateway
Module
3G, 4G, LTE
Provides traffic information
O Updates on maps for navigation systems and maps on
demand
O Concierge services provided by human operators
O Tracks a stolen vehicle
O
In-Vehicle
Networks
LID
LIDAR
Wi-Fi/BT
QCommunication with devices outside a vehicle
(via future networks)
Speech
ee
ech inten
intention
inte
n ent
un
understanding
nd
de
ersta
rsta
stand
nd
n
din
n
Speech
ee
ecch
h rrecognitio
ecog
eco
ec
og
gnition
Telematics,
e-Call
O
Camera
HDD
D te
techn
chnolo
o ogies
ol
olo
Data
Center
O
Hig
gh ca
cap
ap
pacity
ity
High
h ba
ban
bandwidt
an
ndw
dwid
dtth
h
O
Acce
A
Ac
cc
ccess
s Point
oint
oin
SSD
D technologies
te
echn
hnolo
o
ol
olo
es
s
Lo
ow la
atency
ate
ncy
cy
High
h ba
ban
bandwidth
an
ndw
dwid
dth
O
Hom
Ho
om
me Network
O
O
W Connected cars transform lifestyles
Provides AI- and speech-based concierge services as
well as recommendation services
Automatic updating of ECU firmware
Enables a automated driving vehicle to cut into and
merge with traffic and provides information about
invisible cars
Helps reduce communication costs by utilizing appropriate
communication media
Security management
Provides a seamless link between home and vehicle
networks
QVoice interaction
A speech recognition and synthesis system incorporating
advanced intention understanding technology is utilized
to provide concierge services that have conventionally
been offered by human operators. This system helps
reduce the costs of operation centers while improving
the service quality.
C xxx
Cal
Ca
Call
xxx.
You have
Yo
reached
xxx.
QImproving driving automation systems
Connected cars transmit data on driving and road
conditions gathered from on-board sensors (e.g.,
cameras and laser imaging detection and ranging
(LIDAR) devices) to data centers. These data can be
used to improve driving automation systems.
Roadmap for Bluetooth® Devices
- 2014
2015
Bluetooth® 4.0
MP
Bluetooth® 4.1
MP
Bluetooth
HCI solution
TC35661
EDR+LE
ROM-007: NBS
ROM-008: WBS
Bluetooth®
low energy
Solution
TC35667
LE Single+GATT
Peak Current 5.9 mA
2016
2017
Bluetooth® 4.2
Under
Development
Bluetooth®
low energy
Solution
TC35679
LE Single+GATT
Peak Current 3.3 mA
Ta (max.) 105˚C
EDR : Enhanced Data Rate
HCI : Host Controller Interface
LR : Long Range
Bluetooth® 5
Under
Planning
Bluetooth®
low energy
Solution
TC35681
LE Single+GATT
2 Mbps, LR
Ta (max.) 125˚C
GATT : Generic Attribute Profile
LE
: Low Energy
33
Interface Bridge
The TC9560XBG, TC9560AXBG and TC9560BXBG are compliant with the Ethernet AVB standards. These
devices provide reliable and low-latency data communication through timing synchronization and
packet prioritization. They are also compliant with Gigabit Ethernet (GbE) for high-speed connectivity.
W Bridge ICs for Next-Generation In-Vehicle Infotainment (IVI) Systems: TC9560XBG/TC9560AXBG/TC9560BXBG
(Engineering samples available)
The TC9560XBG family (TC9560XBG/TC9560AXBG/TC9560BXBG) are
bridge ICs compliant with IEEE 802.1AS and IEEE 802.1Qav, part of the set
of Ethernet AVB standards that support Gigabit Ethernet (10/100/1000 Mbps).
The TC9560XBG family provides the Ethernet AVB interface as well as
various audio, video and data interfaces, making it suitable for telematics and
next-generation IVI applications that provide audio, video and data
communication capabilities through in-vehicle IP networks. The TC9560XBG
family is designed to consume only 1 mW typically in power-saving mode at
room temperature (as measured by Toshiba) and return to normal operating
mode in 100 ms typically (as measured by Toshiba), meeting the low-latency
market requirement. Furthermore, Toshiba is planning to have the
TC9560XBG family certified for Grade 3 of AEC-Q100, a qualification
standard for automotive ICs.
Q Interfacing Example
Q System Block Diagram
Application Processor
Power Management IC
PMC
PMIC
INT
TDM
PCIe
I2C
TC9560XBG
TC9560BXBG
RGMII/
RMII/MII
PHY/AVB
Ethernet
Switch
Ethernet AVB
PHY/AVB
Ethernet
Switch
PHY/AVB
Ethernet
Switch
Ethernet AVB
PHY/AVB
Ethernet
Switch
RGMII/
RMII/MII
Head Unit
TC9560XBG
TC9560AXBG
PCle
Application
Processor
Center
Display
Application
Processor
Center
Display
Application
Processor
Center
Display
Telematics Unit
GPIO
Boot
Rom
PCle/
HSIC
Modem
Chipset
TC9560 Family
Quad SPI
I2S/TDM
RGMII
TC9560XBG
TC9560AXBG
RGMII/
RMII/MII
Headphone
RGMII/
RMII/MII
Head Unit
TC9560XBG
TC9560AXBG
PCle
Audio Amplifier
Ethernet Switch
Head Unit
Speaker
Microphone
Camera
Application
Processor
PCle
TC9560XBG
TC9560AXBG
RGMII/
RMII/MII
PHY/AVB
Ethernet
Switch
Ethernet AVB
PHY/AVB
Ethernet
Switch
RGMII/
RMII/MII
TC9560XBG
TC9560AXBG
PCle
Display
Instrument Cluster
Q Features
Q Demonstration Board
1. The TC9560XBG supports standards such as IEEE 802.1AS and IEEE
802.1Qav generally referred to as Ethernet-AVB. Connected to an
application processor or other SoC host, the TC9560XBG allows the host
device to deliver audio, video, and data through the 10/100/1000 Ethernet
network in an automotive environment.
2. The connection to the host is via PCIe® running at 2.5/5.0 GT/s (PCIe
Gen1.0/2.0), 480 Mbps HSIC or TDM (Time Division Multiplex)/I2S for
audio traffic.
3. Provides an Ethernet PHY interface selectable from RGMII, RMII and
MII*. (*) Support for MII is being planned.
4. The design target is to achieve a low-power mode that typically consumes
1 mW at room temperature (measured by Toshiba). The TC9560XBG
typically takes only 100 ms to return to normal operation (measured by
Toshiba) in order to meet the market need. The TC9560XBG is
scheduled to obtain AEC-Q100 Grade 3 qualification.
Part Number
TC9560XBG**
TC9560AXBG**
TC9560BXBG**
Package
PLFBGA170 (0.65)
Applications
Ethernet AVB Bridge Solution For Automotive Applications
Host (External application) I/F:
–
PCIe I/F [Gen2.0 (5 GT/s), Gen1.0 (2.5 GT/s), Endpoint, Single lane]
HSIC I/F (480 Mbps)
Functions
and
Features
–
–
Automotive I/F:
Ethernet AVB [IEEE802.1AS, IEEE802.1Qav]
The interface is selectable from RGMII, RMII and MII (Support for MII is being planned), MAC
–
CAN-FD (2 ch)
–
Audio I/F: I 2S/TDM
Peripheral I/F: I 2C/SPI, Quad-SPI, UART, GPIO, INTC
CPU Core: ARM ®Cortex ®-M3
Supply Voltage (V)
1.8/3.3 for IO, 1.2 for HSIC, 1.2/2.5/3.3 for RGMII/RMII/MII, 1.1 for Core
* ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere.
* PCI Express and PCIe are registered trademarks of PCI-SIG.
* System and product names mentioned herein may be trademarks or registered trademarks of respective companies or organizations.
34
**: Under development
Automotive RF Devices
Automotive RF devices are incorporated in a remote keyless entry (RKE) system, an electronic toll
collection (ETC) system and other systems that make a realization of automobile safety and comfortable.
W Transceiver IC (TC32306FTG)
W Remote Keyless Entry System
Key
Battery
Door lock/
unlock
Microcontroller
Microcontroller
Encryption-Based
Mutual
Authentication
Software
System
Power Supply
Output Interface
RF-IC
TC32306FTG
RF-IC
TC32306FTG
Operating supply voltage range: 2.0 to 5.5 V
Current consumption: RX: 9.7 mA
TX: 12 mA (+10 dBm output)
(conditions: Vdd = 3.0 V and FSK modulation)
0 +A (typ.)
(battery save mode)
O TX output: 0 dBm / +5 dBm / +8 dBm / +10 dBm
(adjustable in steps of approx. 0.5 dB)
O Receiver sensitivity (12 dB SINAD) -117 dBm at IFBW = 270 kHz
(FSK, data rate = 600 Hz, fdev = ±40 kHz)
O Multi-band operation: 315 MHz / 434 MHz / 868 MHz / 915 MHz
O Data rate (TX/RX) = 300 Hz to 10 kHz, with digital bit rate filter
O Multi-channel support (Fractional-N PLL, 5 kHz step width)
O Modulations: FSK / OOK (ASK)
O IF filter bandwidths: wide 320 kHz (typ.) at IF = 230 kHz/
middle 270 kHz (typ.) at IF = 280 kHz
O Signal detections: preamble detection, noise detection (only for FSK),
RSSI detection
O Fast response with digital high-speed comparator
O Serial control: 4-wire serial interface (SPI) read/write mode,
EEPROM programmed control
O
Automobile
Trunk open/
close
Light on/off
Warning
buzzer
Burglar-proof
device
LAN
Transceiver
Battery
W Transceiver IC (TC32306FTG) Demonstration Board
The TC32306FTG Demonstration Board acts as
a remote controller to demonstrate the transmit,
receive and answer-back functions of a remote
keyless entry (RKE) system. The on-board
organic EL display shows possible RKE
operations so that you can select one easily.
The registers in the on-board transceiver IC
can be programmed. The Demonstration
Board has optical, temperature and acceleration
sensors to accommodate the needs for
intended applications.
O
IF Filter
Menu
2
2
TC32306
FTG
3
O
3
TSB
MCU
Sensor
TSB
MCU
Chip Antenna
TC32306
FTG
Menu
1
2
TC32306
FTG
Menu
1
2
TC32306
FTG
O
3
TSB
MCU
O
Sensor
3
TSB
MCU
Multi-channel receiving
Intermittent receiving
Display the result of
signal detection
(RSSI, Noise, Preamble)
Sensor
Sensor
Answer Back
Chip Antenna
Chip Antenna
Menu
1
2
TC32306
FTG
3
TSB
MCU
O
Menu
1
2
TC32306
FTG
Sensor
3
TSB
MCU
Sensor
O
Answerback sensor
information
(optical, temperature, RSSI)
Constantly accelerometer
monitor
LNA
315/434/868
/915 MHz
PA
315/434/868
/915 MHz
Data
Comparator
DMOD
: 1/2
: 1/4
DIV : 1/6
RSSI
ASK (OOK)
VCO
1.8 GHz
FractionalPLL
1.5 V REG
X’ tal
MCU
Charge
Limiter
A/D
ASK
Data
IN/OUT
Bit Rate
LPF Filter
IF AMP
Mixer
SAW
Menu
1
Chip Antenna
1
Chip Antenna
Antenna
Multi-Channel RX
Peak
Detector
Timer
Unit
Control
Unit
Preamble
Auto Detector
Digital Circuit
3 V REG
Serial Control
Vdd: 3.0 V
5.0 V
SO SI CLK CS
SPI Interface
Package QFN36
(0.5-mm pitch)
Intermittent RX with Auto Off
Chip Antenna
Chip Antenna
Menu
1
2
TC32306
FTG
3
TSB
MCU
O
Menu
1
2
TC32306
FTG
Sensor
3
Display ON time period
in Auto Off operation
TSB
MCU
Sensor
* Toshiba offers an IC evaluation board and an RF reference board as an aid for system
development. For details, contact your Toshiba sales representative.
The following crystals have been tested:
O FCX-04 30.320 MHz-J90842 from River Eletec Corporation
O NX3225SC EXS00A-CS03981 (30.320 MHz) from Nihon Denpa Kogyo Co., Ltd.
O CX3225SA30320B0GPQCC from KYOCERA Crystal Device Corporation
* The TC32306FTG is an RF transceiver. Toshiba also offers an RF receiver version IC.
For details, contact your Toshiba sales representative.
RF IC Series for Electronic Toll Collection (ETC), ETC 2.0 and DSRC Applications
Road-to-vehicle communications provide toll collection and traffic information to enhance automobile convenience.
The collected probe data helps reduce traffic congestion.
W RF Transceiver IC for ETC,
ETC 2.0 and DSRC
Applications
W RF Combo IC for Chinese
ETC Applications
TC32168FTG
TC32163FG
O
TC32163FG evaluation board
W 5.8 GHz Automotive
Power Amplifier
TC32166FNG
Operating voltage: 1.8 to 3.6 V
Operating frequency: 5.8 GHz band
O Operating temperature: –40 to +85˚C
O Data rate: ASK 256/512 kbps
O Wake-up function (4.5 +A typ.)
O FM0 modem (addition of CRC
checksum words, postambles
and preambles)
O Small package:
VQFN32 (5 x 5 mm, 0.5-mm pitch)
O
Operating voltage: 2.7 to 3.6 V
O Operating frequency: 5.8 GHz band
O Operating temperature: –40 to +85˚C
O
TC32168FG evaluation board
Operating voltage: 3.0 to 3.6 V
Operating frequency: 5.8 GHz band
O Operating temperature: –40 to +85˚C
O
O
TC32166FNG evaluation board
35
Bluetooth® -Compliant ICs
Bluetooth® ICs
Toshiba has been serving as a Bluetooth SIG*1 Promoter for over ten years, contributing to the wider uptake of Bluetooth solutions.
Toshiba has offered not only Bluetooth-compliant ICs but also original Bluetooth profiles and stacks. Bluetooth® devices compliant with
the Bluetooth® Low Energy standard have been attracting great interest in recent years. They are widely used in mobile, wearable and
healthcare devices for short-distance wireless communication and expected to become even more pervasive.
*1 Bluetooth Special Interest Group, the body that oversees the development of Bluetooth standards
W TC35667IFTG-006
W TC35661IDBG-008/009**
Bluetooth® compliant
O ARM7TDMI-S™
O Incorporates Bluetooth® profiles
O Reliable interoperability
O Suitable for low-cost, small-footprint
applications
O Supports GATT profiles
O Reference design available
Bluetooth® compliant
Bluetooth® core: ARM7TDMI-S™
O Low-power control using a
combination of Toshiba-original circuit
and firmware
O Has the capability to execute user
application software
O Various sleep modes
O Supports GATT profiles
O Suitable for low-cost single-chip
(standalone) applications
O Reference design available
O
O
O
**: Under development
TC35667IFTG-006
TC35661IDBG-008/009
RF Block
BR/EDR/LE
Modem
Active CLK
(26 MHz X’tal)
Sleep CLK
(32 kHz External)
Power Supply
ARM7
TDMI-S
Mask ROM
(HCI)
I2S/PCM
GPIO
CLK Gen.
LDO
UART
SRAM
Host
MCU
I2C/SPI
Application
Program
Stack
&
Profiles
Reset
Sleep CLK
(32 kHz X’tal)
LE
Modem
LE
Modem
CLK Gen.
– 203
Bluetooth® version
v4.0
v3.0
Embedded
profiles
HCI
SPP
UART
EEPROM
Application
Program
DCDC
Reset IC
PWM
Application example: the IC works stand-alone
36
LEDs/Buzzers
v4.2
HCI, GATT
2.7 to 3.6 V
63 mA
5.9 mA
(3.3 V, TX-4 dBm)
3.3 mA
(3.0 V, TX0dBm)
Current consumption
in sleep mode
30 +A
–
1.8 +A
Current consumption
in deep sleep mode
–
Transmit power
Receiver
sensitivity
0.05 +A
2 dBm
–20 to 0 dBm
(4 dBm steps)
–20 to 0 dBm
(4 dBm steps)
– 90 dBm
– 92 dBm
– 93.5 dBm
– 40 to +85˚C
– 40 to +105°C
Package
P-LFBGA64
(7 mm x 7 mm)
QFN40
(6 mm x 6 mm)
QFN40
(wettable)
(6 mm x 6 mm)
Interface
UART, I2C, SPI,
I2S, PCM
UART, I2C, SPI
UART, I2C, SPI
Functional
blocks /
functions
Deliverables
Keys/Switches
ADC
TC35679IFTG-002
v4.1
Current consumption
in RX/TX active
mode (peak)
Sensors
GPIO
TC35667IFTG-006
Supply voltage
®
I2C/SPI
Battery
LEDs/Buzzers
TC35661IDBG
– 008/009
®
Mask ROM
SRAM
PWM
Application example: the IC works stand-alone
TC35679IFTG-002 (Under development)
Sleep CLK
(32 kHz X’tal)
Keys/Switches
ADC
DCDC
Operating temperature
Cortex-M0
Sensors
GPIO
SRAM
Reset IC
Bluetooth compliant
O ARM® Cortex®-M0
O Low-power control using a
combination of Toshiba-original circuit
and firmware
O Has the capability to execute user
application software
O Various sleep modes
O Supports GATT profiles
O Suitable for low-cost single-chip
(standalone) applications
O Reference design available
RF Block
Application
Program
Mask ROM
CLK Gen.
W TC35679IFTG-002 (Under development)
Active CLK
(26 MHz X’tal)
EEPROM
Battery
Application example: the IC works with host CPU
O
UART
I2C/SPI
ARM7
TDMI-S
RF Block
Active CLK
(26 MHz X’tal)
ARM core,
ARM® core,
RF analog circuitry,
RF analog circuitry,
CVSD codec,
DC-DC converter, ADC,
host wake-up,
32-KB user RAM,
wireless LAN coexistence,
sleep mode
sleep mode
ARM® core,
RF analog circuitry,
DC-DC converter, ADC,
83-KB user RAM,
sleep mode
Datasheet, command specification, application notes,
programming guide, evaluation sample board,
reference design (BOM, circuit drawings, layout, sample source code)
* Bluetooth SIG owns the registered trademark, Toshiba uses it under license.
* ARM, Cortex and ARM7TDMI-S are registered trademark of ARM Limited (or its
subsidiaries) in the EU and/or elsewhere. ARM7 is a trademark of ARM Limited (or its
subsidiaries) in the EU and/or elsewhere. All rights reserved.
Car Audio
For automotive audio systems, there is increasing consumer demand for the ability to play
back music stored in digital audio players, cell phones and smartphones and to support
Bluetooth connectivity. Toshiba offers ICs that meet these market needs.
W Roadmap
W Block Diagram of a USB (CD Mechanism-Less)
Audio System
TMPM32DC2DFG
• Bluetooth HCI Control
• DSP
• PCM I/F
• USB Embedded Host
(Full-Speed)
• CAN
TMPM32BC2DFG
• Bluetooth HCI Control
• DSP
• PCM I/F
• USB Embedded Host
(Full-Speed)
• PCM I/F
• USB Embedded Host
(Full-Speed)
ARM® Cortex®-M3 Core
S-Flash
USB FS (iPod/MSC)
BT Profile/Protocol
• SD card
• USB Memory
• iPod / iPhone
EC/NR
MP3, WMA, AAC, SBC
W Block Diagram of an Audio System with Bluetooth®,
USB and CD Mechanism Controllers
CD/MP3 processors
with audio decoders
E-vol/
Selector
Tuner
TC94A93MFG
• CD-Servo • RF Amp
• Decoder • 2 ch DAC
• 16 Mbit DRAM
49 W class-AB amp
4 ch power Amp
Main + USB MCU
TCB501HQ etc.
TMPM32BC2DFG
TMPM32EC1EFG
TMPM32DC2DFG [with CAN controller]
TMPM32FC1EFG [with CAN controller]
UI
• Display
• key
NEW
TMPM32FC1EFG
• DSP
• PCM I/F
• USB Embedded Host
(Full-Speed)
• CAN
MCU for Car Audio
TMPM32EC1EFG
Applications
• DSP
E-vol/
Selector
Tuner
TC35661
UI
• Display
• key
Bluetooth HCI IC
49 W class-AB amp
4 ch power Amp
TCB501HQ etc.
Main + USB MCU
TMPM32BC2DFG
TMPM32DC2DFG [with CAN controller]
ARM Cortex-M3 Core
USB FS (iPod/MSC)
Pin-Compatible
S-Flash
TC35661
BT Profile/Protocol
TC94A92FG
• CD-Servo • RF Amp
• Decoder
• 2 ch DAC
• SD card
• USB Memory
• iPod / iPhone
CD Servo processors
Product line expansion
· Improved playability
EC/NR
Bluetooth
HCI IC
MP3, WMA, AAC, SBC
TC94B16FG
• CD-Servo • RF Amp
• 2 ch DAC
CODEC
CD-servo
RF-amp
ESP/CDROM
Decode
2 ch DAC
CD Servo processors
TC94A92FG
TC94A93MFG
TC94B16FG
* Bluetooth is a registered trademark owned by Bluetooth SIG, Inc. and any use of such marks by
Toshiba is under license.
* iPod and iPhone are trademarks of Apple, Inc.
16
1
2
2
2
4
5
5
1
16
1
2
2
2
4
5
5
I/O Port (Pins)
1
96
Trace Function
96
NA
1
1
8
8
1
10
1
Yes Yes Yes
87
1
1
8
8
1
10
1
Yes Yes Yes
87
1
1
8
8
1
10
1
3.0 to 3.6
Yes Yes Yes 112 1.1 to 1.3
1
1
8
8
1
10
1
Yes Yes Yes 112
On-Chip Debug Unit
NA
RTC (ch)
2
Watch dog Timer (ch)
2
5
External Interrupt Pins (Pins)
5
4
16-Bit Timer/Counter (ch)
4
2
Remote Control Preprocessor (ch)
2
2
SD Host controller (ch)
2
1
10-Bit AD Converter (ch)
1
1
USB Embedded Host (High-Speed) (ch)
1
16
CAN(ch)
I2C/SIO(ch)
16
1
USB Embedded Host (Full-Speed) (ch)
SIO/URAT(ch)
1
96
I2C(ch)
SSP(ch)
UART(ch)
96
NA
PCM interface (unit)
Serial Flash controller (ch)
Sampling rate converter (ch)
NA
Static Memory Controller (ch)
Audio DSP (unit)
DMA Controller (ch)
TMPM32FC1EFG
Maximum Operating Frequency (MHz)
TMPM32EC1EFG
DRAM (Bytes)
Part Number
SRAM (Bytes)
ROM (Bytes)
W Microcontrollers for Automotive Audio Applications
Operating Operating
Voltage Temperature
(˚C)
Range
(V)
1664K
NA
TMPM32BC2DFG
2560K
TMPM32DC2DFG
2
2
–40 to
85
Package
LQFP144
(20 x 20 mm)
LQFP176
(20 x 20 mm)
Note: The following three power supplies are available: (i) For general ports, and A/D converter: 3.0 V to 3.6 V (ii) For USB Embedded Host: 3.15 V to 3.45 V (iii) For internal circuitry: 1.1 V to 1.3 V
W CD Servo and Compressed Audio Decoder ICs
Part Number
Package
Classification
Features
Supply Voltage (V)
TC94A92FG
LQFP80
Single-chip processor
CD-DA/R/RW: x2 playback, low power consumption, 1-Mbit SRAM (128 K words x 8 bits),
standby mode, Supports various compressed audio formats: MP3, WMA, AAC RF amp,
CD digital servo, 8fs digital filter, Multi-bit D/A converter
3.3/1.5
TC94A93MFG
LQFP80
Single-chip processor
CD-DA/R/RW: x2 playback, low power consumption, 1-Mbit SRAM (128 K words x 8 bits),
standby mode, Supports various compressed audio formats: MP3, WMA, AAC RF amp,
CD digital servo, 8fs digital filter, Multi-bit D/A converter, shock-proof feature
3.3/1.5
W CD Servo ICs
Part Number
TC94B16FG
Package
LQFP80
Classification
Single-chip processor
Features
Sync separation, EFM demodulation, error detection/correction, error-corrected output,
microcontroller interface, search control, digital equalizer, text data decoding, variable-speed playback,
x8 oversampling digital filter, multi-bit D/A converter, head amp, On-chip 3.3-to-1.5-V regulator,
x4 playback mode for CD-DA/R
Supply Voltage (V)
3.3/1.5
37
Power Amplifier ICs
Toshiba’s four-channel power ICs fabricated using a 0.13-+m low-on-resistance process provide
high reliability.
Toshiba is expanding its portfolio of unique high-efficiency (Class-KB) power amplifier ICs to fulfill
the market needs for low power consumption and environmental friendliness.
W 4-Channel Power ICs
W Environmental Contribution of Toshiba’s
High-Efficiency (Class-KB) Amplifier IC (TB2925HQ)
Performance
Installation of new technology based on the market demands
to expand the next-generation products.
High-quality sound
O High efficiency
O High reliability
Annual CO2 Emissions
O
The pursuit of
high-quality sound
Engine idle
TB2996HQ
reduction capability
61,091 g
New process
TCB001HQ
TCB501HQ
Start stop Cruising
corresponded to VDD = 6 V
O
TCB502HQ
Engine idle
GSM buzz noise
reduction capability
TB2941HQ
O
Approx. 35-kg
reduction
per year
26,658 g
Reduced voltage operation
Symmetry corresponded to VDD = 6 V
TB2931HQ
amplifier
OCalculation conditions
· Amp use: 4 hours per day; 365 days
per year
· Amp's audio output power: 2 W
OLife cycle assessment (LCA)
calculation conditions
· Overall gasoline-to-amp energy
conversion efficiency: 18.9%
· Gasoline-to-power conversion factor:
0.104 L/kWh
TB2926CHQ
BiCD0.6
BiCD0.13
Class AB
CD0.13
Class KB
W Supports external audible outputs from vehicles,
allowing use of electric vehicle warning sound systems in
HEVs and EVs: TB2909FNG
W Pure-MOS Power Amplifier IC: TCB001HQ
Drawing on its long experience in the development of car audio ICs,
Toshiba has developed a new power amplifier IC, the TCB001HQ,
fabricated with a pure-MOS process.
The TCB001HQ exhibits a higher immunity to external noise and
produces soft sound without any particular emphasis.
Part Number
TCB001HQ
Maximum Output
45 W x 4 ch (VCC = 15.2 V, R L = 4 1, MAXPOWER)
Supply Voltage
6 to 18 V
Total Harmonic
Distortion (THD)
0.01% (POUT = 4 W)
Output Noise Voltage
Vno = 45 +V (BW = DIN_AUDIO)
Features
The TB2909FNG is a power amplifier IC designed to generate an
external sound for quiet vehicles such as hybrid electric vehicles
(HEVs) and all-electric vehicles (EVs) in order to alert pedestrians to
the presence of an approaching vehicle.
With the guaranteed operating
temperature of up to 110°C, the
TB2909FNG ensures stable
operation of an acoustic vehicle
alerting system at high
temperatures.
5 W x 1 ch (VCC = 16 V, RL = 8 1, JEITA max)
Maximum Output
3 W x 1 ch (VCC = 12 V, RL = 8 1, JEITA max)
HZIP25-P-1.00F
Package
TB2909FNG
Part Number
High sound quality, low THD, offset detection,
short-circuit detection, various protection features
(thermal shutdown, overvoltage, short-to-VCC, short-to-load)
Supply Voltage
66 to 16 V
Operating Temperature
–40 to 110˚C
Total Harmonic
Distortion (THD)
Output Noise Voltage
0.08% (POUT = 0.125 W)
55 +V
Built-in mute and standby functions
O A range of detection features (over temperature, output short,
overvoltage and speaker-open)
O A range of protection circuits (thermal shutdown, overvoltage,
short-to-VCC and short-to-load)
O
On-chip Peripherals
Package
TSSOP16
W 4ch Power Amplifier ICs for Audio Lineup
Process
Part Number
Max Output
VCC = VCC = Class
15.2 V 14.4 V
Voltage
Gain
I2C
Bus
Half
Short
Det.
HighOffset
Clip
Short-Circuit Side
Detection Detection Detection Switch
TB2941HQ
49 W
44 W
AB
26 dB
TB2931HQ
49 W
44 W
AB
26 dB
TB2938HQ
49 W
44 W
AB
26 dB
49 W
BiCD TB2996HQ
0.13 TB2952AHQ 49 W
44 W
AB
26 dB
44 W
AB
26 dB/12 dB
CD
0.13
Speaker
6-V
Burning 2-1 Load GSM
Support Operation
Prevention
TB2975HQ
49 W
44 W
KB
26 dB/16 dB
TB2925HQ
49 W
44 W
KB
26 dB
TB2959HQ
47 W
42 W
AB
26 dB
TCB001HQ
45 W
39 W
AB
26 dB
TCB501HQ
49 W
44 W
AB
26 dB
TCB502HQ
49 W
44 W
AB
26 dB
TB2909FNG
: Available
38
Max Output Max Output
VCC = 16 V VCC = 12 V
5W
3W
Availability
HZIP25
MP
HZIP25
MP
HZIP25
MP
HZIP25
MP
HZIP25
MP
HZIP25
MP
HZIP25
MP
HZIP25
MP
HZIP25
MP
HZIP25
MP
HZIP25
MP
W Power Amplifier IC for Artificial Engine Sound
Part Number
Package
Class
Voltage
Gain
AB
Variable
Speaker
Temp.
Short-Circuit Overvoltage
Open-Circuit
Detection
Detection Detection
Detection
Note
For engine sound generation
Speech Middleware (ToSpeak™ and Voice Trigger)
ToSpeak™ is text-to-speech (TTS) software IP for reading text with natural-sounding voices. It
operates on the CPU and memory of a local device.
W Features
O
Smooth reading
O
Clear and natural sound quality even with small memory footprint
O
Small computational cost
Using a proprietary technology, Toshiba Text-To-Speech Middleware delivers smooth and natural speech with uniformly high sound quality.
Clear sound quality is kept enough even with only a few megabytes of memory for the synthesis unit dictionary (voice database).
With its compact size, Toshiba Text-To-Speech Middleware can work in real-time even when run on local terminals. In this case it eliminates the
problem of network delay, which is unavoidable with cloud solutions.
Adding one voice increases the memory requirement only by a few megabytes.
Toshiba
Text-To-Speech
ToS
T
oS
Spe
pea
pea
eak
Middleware
Smaller Memory
Footprint
PC
Version
G3
G3
ToS
oS
Spe
pea
pea
eak
Highly Natural T
G2
G2
Server
Version
Embedded
Version
Sound Quality
Natural Sound
Quality
Improvement
Conventional Speech
Synthesis Technology
Small
memory
Version
1 MB
Robotic Sound
10 MB
100 MB
1 GB
Speech Data Size (Per Voice)
ToSpeakG2
ToSpeakG3 JP
Standard voice synthesis dictionary
O
O
ToSpeakG3 TP4
Optional voice synthesis dictionary (Japanese only)
O
Phonetic Transcription Input
O
O
Embedded Tags
O
O
O
Lexicon
Basic vocabulary dictionary
Basic vocabulary dictionary
Basic/large vocabulary dictionaries
ROM/RAM (Minimum configuration, for reference only)
4.8 MB/5.3 MB
12.9 MB/5.8 MB
Total: Approx. 12.9 MB per language per speaker
MIPS (For reference only)
75
110 to 140
120
Language
Japanese
Japanese
Japanese, American English, Chinese,
Korean (Hangul phonogram specified by Toshiba)
NEW
O
(Allows custom voice development)
O
O
* The ROM and RAM sizes as well as the MIPS values shown above are the requirements for installing a Japanese basic vocabulary dictionary and
a voice synthesis dictionary for a standard female voice. They vary slightly, depending on the platform, middleware configuration and its setup.
Voice-triggered middleware is software IP that detects the utterances of the specified trigger words.
It operates on the processor and memory of a local device.
W Features
O
Switchless speech recognition
Facilitates users to control application by utterance without switch thus enabling truly
hands-free operation.
O
Realizing voice interactions using speech synthesis
and voice triggering
High-speed response
Returns a result almost as soon as the user utters a trigger word thus achieving a smooth
speech interface.
O
High robustness to noise
Capable of detecting a trigger word in a sentence, eliminating the need for user to utter
only trigger word for detection. Provides a high detection rate even in a noisy environment.
O
Runs in an embedded environment with low computing power and memory size
Runs on the processor and memory of a standalone local device
Key Specifications
Test Conditions
1
Computing
Memory
Approx. 300 Kbytes*1
Sample rate
16 kHz
Language
Japanese
Processor
ARM926
Number of trigger words
10
*1: These figures are subject to change due to software
updates. They also vary depending on the lengths
of the programmed trigger words.
39
SUBSIDIARIES AND AFFILIATES
(As of September 6, 2016)
May 2017
Toshiba America
Electronic Components, Inc.
• Irvine, Headquarters
Tel: (949)462-7700 Fax: (949)462-2200
• Buffalo Grove (Chicago)
Tel: (847)484-2400 Fax: (847)541-7287
• Duluth/Atlanta
Tel: (770)931-3363 Fax: (770)931-7602
• El Paso
Tel: (915)533-4242
• Marlborough
Tel: (508)481-0034 Fax: (508)481-8828
• Parsippany
• San Jose
Tel: (408)526-2400 Fax: (408)526-2410
• Wixom (Detroit)
Tel: (248)347-2607 Fax: (248)347-2602
TOSHIBA América do Sul Ltda.
Tel: (011)4083-7978
Toshiba India Private Ltd.
• New Delhi Office
Tel: (0124)499-6600 Fax: (0124)499-6611
• Bangalore Office
Tel: (080)251-90800
Toshiba Transmission and
Distribution Systems (Vietnam) Ltd.
Tel: (043)776-5950 Fax: (043)776-5956
• Düsseldorf Head Office
Tel: (0211)5296-0 Fax: (0211)5296-400
• France Branch
Tel: (1)47282181
• Italy Branch
Tel: (039)68701 Fax:(039)6870205
• Munich Office
Tel: (089)20302030 Fax: (089)203020310
• Spain Branch
Tel: (91)660-6798 Fax:(91)660-6799
• Sweden Branch
Tel: (08)704-0900 Fax: (08)80-8459
• U.K. Branch
Tel: (1932)841600
Toshiba Electronics Asia (Singapore) Pte. Ltd.
Tel: 6278-5252 Fax: 6271-5155
Toshiba Electronics Service (Thailand) Co., Ltd.
Tel: (02)835-3491 Fax: (02)835-3490
Toshiba Electronics Trading (Malaysia) Sdn. Bhd.
• Kuala Lumpur Head Office
Tel: (03)5631-6311 Fax: (03)5631-6307
• Penang Office
Tel: (04)226-8523 Fax: (04)226-8515
Toshiba Electronics Korea Corporation
Tel: (02)3484-4334 Fax: (02)3484-4302
Toshiba Electronic Components Taiwan Corporation
Tel: (02)2508-9988 Fax: (02)2508-9999
Toshiba Electronics Asia, Ltd.
Tel: (02)2375-6111 Fax: (02)2375-0969
Toshiba Electronics (China) Co., Ltd.
Tel: (021)6139-3888 Fax: (021)6190-8288
• Beijing Branch
Tel: (010)6590-8796 Fax: (010)6590-8791
• Chengdu Branch
Tel: (028)8675-1773 Fax: (028)8675-1065
• Hangzhou Office
Tel: (0571)8717-5004 Fax: (0571)8717-5013
• Nanjing Office
Tel: (025)8689-0070 Fax: (025)5266-5106
• Qingdao Branch
Tel: (532)8579-3328 Fax: (532)8579-3329
• Shenzhen Branch
Tel: (0755)3686-0880 Fax: (0755)3686-0816
• Dalian Branch
Tel: (0411)8368-6882 Fax: (0411)8369-0822
• Xiamen Branch
Tel: (0592)226-1398 Fax: (0592)226-1399
• GuangZhou Office
Tel: (020)8732-2646 Fax: (020) 8732-2651
• Shenyang Office
Tel: (024)3187-3325 Fax: (024)3187-3326
• Xi'an Office
Tel: (029)8720-3176 Fax: (029)8720-3565
• Wuhan Office
Tel: (027)8555-7779 Fax: (027)8555-7842
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware,
software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is
permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and
for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could
cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or
incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without
limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor
Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the
applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c)
validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR
RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR
SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment
used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related
fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative.
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual
property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by
estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM
EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR
INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA,
AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING
WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
Product may include products using GaAs (Gallium Arsenide). GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do
not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling
or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be
controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Product may include products subject to foreign exchange and foreign trade control laws.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all
applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO
LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
2017
Previous edition: SCE0023J
Storage & Electronic Devices Solutions Company
Website: https://toshiba.semicon-storage.com/
SCE0023K
• Shanghai Head Office
Automotive Solutions
Tel: (973)541-4715 Fax: (973)541-4716
Toshiba Electronics Europe GmbH
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement