LM4901 1.6 Watt Audio Power Amplifier with

LM4901 1.6 Watt Audio Power Amplifier with
LM4901
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LM4901
SNAS139F – DECEMBER 2001 – REVISED DECEMBER 2001
1.6 Watt Audio Power Amplifier with Selectable
Shutdown Logic Level
Check for Samples: LM4901
FEATURES
DESCRIPTION
•
The LM4901 is an audio power amplifier primarily
designed for demanding applications in mobile
phones and other portable communication device
applications. It is capable of delivering 1 watt of
continuous average power to an 8Ω BTL load and 1.6
watts of continuous avearge power to a 4Ω BTL load
with less than 1% distortion (THD+N) from a 5VDC
power supply.
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Available in Space-Saving Packages: WSON
and VSSOP
Ultra Low Current Shutdown Mode
BTL Output can Drive Capacitive Loads
Improved Pop & Click Circuitry Eliminates
Noise During Turn-On and Turn-Off
Transitions
2.0 - 5.5V Operation
No Output Coupling Capacitors, Snubber
Networks or Bootstrap Capacitors Required
Unity-Gain Stable
External Gain Configuration Capability
User Selectable Shutdown High or Low logic
Level
APPLICATIONS
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Mobile Phones
PDAs
Portable Electronic Devices
KEY SPECIFICATIONS
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Improved PSRR at 217Hz & 1KHz 62 dB
Power Output at 5.0V, 1% THD, 4Ω 1.6 W (typ)
Power Output at 5.0V, 1% THD, 8Ω 1.07 W (typ)
Power Output at 3.0V, 1% THD, 4Ω 525 mW
(typ)
Power Output at 3.0V, 1% THD, 8Ω 390 mW
(typ)
Shutdown Current 0.1μA (typ)
Boomer audio power amplifiers were designed
specifically to provide high quality output power with a
minimal amount of external components. The
LM4901 does not require output coupling capacitors
or bootstrap capacitors, and therefore is ideally suited
for mobile phone and other low voltage applications
where minimal power consumption is a primary
requirement.
The LM4901 features a low-power consumption
shutdown mode. To facilitate this, Shutdown may be
enabled by either logic high or low depending on
mode selection. Driving the shutdown mode pin either
high or low enables the shutdown pin to be driven in
a likewise manner to enable shutdown.
The LM4901 contains advanced pop and click
circuitry which eliminates noise which would
otherwise occur during turn-on and turn-off
transitions.
The LM4901 is unity-gain stable and can be
configured by external gain-setting resistors.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001, Texas Instruments Incorporated
LM4901
SNAS139F – DECEMBER 2001 – REVISED DECEMBER 2001
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Typical Application
Figure 1. Typical Audio Amplifier Application Circuit
Connection Diagrams
Top View
Top View
Figure 2. Mini Small Outline (VSSOP) Package
See Package Number DGS0010A
Figure 3. WSON Package
See Package Number NGZ0010B
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Absolute Maximum Ratings (1) (2)
Supply Voltage (3)
6.0V
−65°C to +150°C
Storage Temperature
−0.3V to VDD +0.3V
Input Voltage
Power Dissipation (4) (5)
ESD Susceptibility
Internally Limited
(6)
2000V
ESD Susceptibility (7)
200V
Junction Temperature
150°C
Thermal Resistance
θJC (VSSOP)
56°C/W
θJA (VSSOP)
190°C/W
θJA (WSON)
63°C/W
12°C/W (8)
θJC (WSON)
Soldering Information
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(8)
See AN-1187 "Leadless Leadframe
Package (WSON)" (SNOA401)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
If the product is in Shutdown mode and VDD exceeds 6V (to a max of 8V VDD), then most of the excess current will flow through the
ESD protection circuits. If the source impedance limits the current to a max of 10mA, then the device will be protected. If the device is
enabled when VDD is greater than 5.5V and less than 6.5V, no damage will occur, although operation life will be reduced. Operation
above 6.5V with no current limit will result in permanent damage.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature
TA. The maximum allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever
is lower. For the LM4901, see power derating curves for additional information.
Maximum power dissipation in the device (PDMAX) occurs at an output power level significantly below full output power. PDMAX can be
calculated using Equation 2 shown in the Application Information section. It may also be obtained from the power dissipation graphs.
Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Machine Model, 220 pF–240 pF discharged through all pins.
The Exposed-DAP of the NGZ0010B package should be electrically connected to GND or an electrically isolated copper area. The
LM4901NGZ demo board (views featured in the Application Information section) has the Exposed-DAP connected to GND with a PCB
area of 86.7mils x 585mils (2.02mm x 14.86mm) on the copper top layer and 550mils x 710mils (13.97mm x 18.03mm) on the copper
bottom layer.
Operating Ratings
Temperature Range TMIN ≤ TA ≤ TMAX
−40°C ≤ TA ≤ 85°C
2.0V ≤ VDD ≤ 5.5V
Supply Voltage
Electrical Characteristics VDD = 5V (1) (2)
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for TA = 25°C.
Parameter
Typical (3)
Limit (4) (5)
Units
(Limits)
3
7
mA (max)
VIN = 0V, Io = 0A, 8Ω Load
4
10
mA (max)
VSD = VSD Mode
0.1
2.0
µA (max)
Shutdown Voltage Input High
VSD MODE = VDD
1.5
V (min)
Shutdown Voltage Input Low
VSD MODE = VDD
1.3
V (max)
Shutdown Voltage Input High
VSD MODE = GND
1.5
V (min)
Quiescent Power Supply Current
ISD
Shutdown Current
VSDIH
VSDIL
VSDIH
(3)
(4)
(5)
LM4901
VIN = 0V, Io = 0A, No Load
IDD
(1)
(2)
Test Conditions
All voltages are measured with respect to the ground pin, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
Typicals are measured at 25°C and represent the parametric norm.
Limits are ensured to TI's AOQL (Average Outgoing Quality Level).
Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
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Electrical Characteristics VDD = 5V(1)(2) (continued)
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for TA = 25°C.
Parameter
VSDIL
Shutdown Voltage Input Low
VOS
Output Offset Voltage
ROUT
VSD MODE = GND
50
mV (max)
9.7
kΩ (max)
7.0
kΩ (min)
0.9
W (min)
1.3
V (max)
1.07
(4Ω) (7) (8)
THD = 1% (max); f = 1 kHz
1.6
W
100
ms (max)
0.2
%
Total Harmonic Distortion+Noise
Po = 0.5 Wrms; f = 1kHz
Power Supply Rejection Ratio
Vripple = 200mV sine p-p
Input terminated with 10Ω
(8)
Units
(Limits)
THD = 1% (max); f = 1 kHz
Wake-up time
(7)
Limit (4) (5)
(8Ω)
THD+N
(6)
Typical (3)
8.5
TWU
PSRR
LM4901
7
Resistor Output to GND (6)
Output Power
Po
Test Conditions
60 (f = 217Hz)
64 (f = 1kHz)
55
dB (min)
RROUT is measured from the output pin to ground. This value represents the parallel combination of the 10kΩ output resistors and the
two 20kΩ resistors.
The Exposed-DAP of the NGZ0010B package should be electrically connected to GND or an electrically isolated copper area. The
LM4901NGZ demo board (views featured in the Application Information section) has the Exposed-DAP connected to GND with a PCB
area of 86.7mils x 585mils (2.02mm x 14.86mm) on the copper top layer and 550mils x 710mils (13.97mm x 18.03mm) on the copper
bottom layer.
The thermal performance of the WSON package (LM4901NGZ) when used with the exposed-DAP connected to a thermal plane is
sufficient for driving 4Ω loads. The LM4901NGZ demo board (views featured in the Application Information section) can drive 4Ω loads
at the maximum power dissipation point (1.267W) without thermal shutdown circuitry being activated. The other available packages do
not have the thermal performance necessary for driving 4Ω loads with a 5V supply and are not recommended for this application.
Electrical Characteristics VDD = 3V (1) (2)
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for TA = 25°C.
Parameter
Test Conditions
LM4901
Typical (3)
Limit (4) (5)
Units
(Limits)
VIN = 0V, Io = 0A, No Load
2
7
mA (max)
VIN = 0V, Io = 0A, 8Ω Load
3
9
mA (max)
VSD = VSD Mode
0.1
2.0
µA (max)
VSD MODE = VDD
1.1
V (min)
Shutdown Voltage Input Low
VSD MODE = VDD
0.9
V (max)
VSDIH
Shutdown Voltage Input High
VSD MODE = GND
1.3
V (min)
VSDIL
Shutdown Voltage Input Low
VSD MODE = GND
1.0
V (max)
VOS
Output Offset Voltage
IDD
Quiescent Power Supply Current
ISD
Shutdown Current
VSDIH
Shutdown Voltage Input High
VSDIL
ROUT
Resistor Output to GND (6)
Output Power
Po
7
8.5
kΩ (min)
mW
(4Ω)
THD = 1% (max); f = 1 kHz
525
mW
75
ms (max)
0.1
%
Total Harmonic Distortion + Noise
Po = 0.25 Wrms; f = 1kHz
Power Supply Rejection Ratio
Vripple = 200mV sine p-p
Input terminated with 10Ω
4
kΩ (max)
7.0
390
Wake-up time
(3)
(4)
(5)
(6)
9.7
THD = 1% (max); f = 1 kHz
THD+N
(1)
(2)
mV (max)
(8Ω)
TWU
PSRR
50
62 (f = 217Hz)
68 (f = 1kHz)
55
dB (min)
All voltages are measured with respect to the ground pin, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
Typicals are measured at 25°C and represent the parametric norm.
Limits are ensured to TI's AOQL (Average Outgoing Quality Level).
Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
RROUT is measured from the output pin to ground. This value represents the parallel combination of the 10kΩ output resistors and the
two 20kΩ resistors.
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Electrical Characteristics VDD = 2.6V (1) (2)
The following specifications apply for the circuit shown in Figure 1, unless otherwise specified. Limits apply for TA = 25°C.
Parameter
Test Conditions
LM4901
Typical (3)
Limit (4)
(5)
Units
(Limits)
VIN = 0V, Io = 0A, No Load
2.0
mA (max)
VIN = 0V, Io = 0A, 8Ω Load
3.0
mA (max)
Shutdown Current
VSD = VSD Mode
0.1
µA (max)
VSDIH
Shutdown Voltage Input High
VSD MODE = VDD
1.0
V (min)
VSDIL
Shutdown Voltage Input Low
VSD MODE = VDD
0.9
V (max)
VSDIH
Shutdown Voltage Input High
VSD MODE = GND
1.2
V (min)
VSDIL
Shutdown Voltage Input Low
VSD MODE = GND
1.0
VOS
Output Offset Voltage
IDD
Quiescent Power Supply Current
ISD
ROUT
Po
Resistor Output to GND (6)
Output Power
THD = 1% (max); f = 1 kHz
275
( 4Ω )
THD = 1% (max); f = 1 kHz
340
Wake-up time
THD+N
Total Harmonic Distortion + Noise
Power Supply Rejection Ratio
(1)
(2)
(3)
(4)
(5)
(6)
8.5
( 8Ω )
TWU
PSRR
5
V (max)
50
mV (max)
9.7
kΩ (max)
7.0
kΩ (min)
mW
70
ms (max)
Po = 0.15 Wrms; f = 1kHz
0.1
%
Vripple = 200mV sine p-p
Input terminated with 10Ω
51 (f = 217Hz)
51 (f = 1kHz)
dB (min)
All voltages are measured with respect to the ground pin, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
Typicals are measured at 25°C and represent the parametric norm.
Limits are ensured to TI's AOQL (Average Outgoing Quality Level).
Datasheet min/max specification limits are ensured by design, test, or statistical analysis.
RROUT is measured from the output pin to ground. This value represents the parallel combination of the 10kΩ output resistors and the
two 20kΩ resistors.
External Components Description
(See Figure 1)
Components
Functional Description
1.
Ri
Inverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a high pass
filter with Ci at fC= 1/(2π RiCi).
2.
Ci
Input coupling capacitor which blocks the DC voltage at the amplifiers input terminals. Also creates a highpass filter with
Ri at fc = 1/(2π RiCi). Refer to the section, Proper Selection of External Components, for an explanation of how to
determine the value of Ci.
3.
Rf
Feedback resistance which sets the closed-loop gain in conjunction with Ri.
4.
CS
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing section for
information concerning proper placement and selection of the supply bypass capacitor.
5.
CB
Bypass pin capacitor which provides half-supply filtering. Refer to the section, Proper Selection of External
Components, for information concerning proper placement and selection of CB.
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Typical Performance Characteristics
6
THD+N vs Frequency
at VDD = 5V, 8Ω RL, and PWR = 500mW
THD+N vs Frequency
at VDD = 3V, 8Ω RL, and PWR = 250mW
Figure 4.
Figure 5.
THD+N vs Frequency
at VDD = 2.6V, 8Ω RL, and PWR = 150mW
THD+N vs Frequency
at VDD = 2.6V, 4Ω RL, and PWR = 150mW
Figure 6.
Figure 7.
THD+N vs Power Out
at VDD = 5V, 8Ω RL, 1kHz
THD+N vs Power Out
at VDD = 3V, 8Ω RL, 1kHz
Figure 8.
Figure 9.
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Typical Performance Characteristics (continued)
THD+N vs Power Out
at VDD = 2.6V, 8Ω RL, 1kHz
THD+N vs Power Out
at VDD = 2.6V, 4Ω RL, 1kHz
Figure 10.
Figure 11.
Power Supply Rejection Ratio (PSRR) vs Frequency
at VDD = 5V, 8Ω RL
Power Supply Rejection Ratio (PSRR) vs Frequency
at VDD = 5V, 8Ω RL
Figure 12. Input terminated with 10Ω
Figure 13. Input Floating
Power Supply Rejection Ratio (PSRR) vs Frequency
at VDD = 3V, 8Ω RL
Power Supply Rejection Ratio (PSRR) vs Frequency
at VDD = 3V, 8Ω RL
Figure 14. Input terminated with 10Ω
Figure 15. Input Floating
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Typical Performance Characteristics (continued)
8
Power Supply Rejection Ratio (PSRR) vs Frequency
at VDD = 2.6V, 8Ω RL
Power Supply Rejection Ratio (PSRR) vs Frequency
at VDD = 2.6V, 8Ω RL
Figure 16. Input terminated with 10Ω
Figure 17. Input Floating
Open Loop Frequency Response, 5V
Open Loop Frequency Response, 3V
Figure 18.
Figure 19.
Open Loop Frequency Response, 2.6V
Noise Floor, 5V, 8Ω
80kHz Bandwidth, Input to GND
Figure 20.
Figure 21.
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Typical Performance Characteristics (continued)
Power Derating Curves
Power Dissipation vs
Output Power, VDD=5V
Figure 22.
Figure 23.
Power Dissipation vs
Output Power, VDD=3V
Power Dissipation vs
Output Power, VDD=2.6V
Figure 24.
Figure 25.
Shutdown Hysteresis Voltage
5V, SD Mode = VDD (High)
Shutdown Hysteresis Voltage
5V, SD Mode = GND (Low)
Figure 26.
Figure 27.
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Typical Performance Characteristics (continued)
10
Shutdown Hysteresis Voltage
3V, SD Mode = VDD (High)
Shutdown Hysteresis Voltage
3V, SD Mode = GND (Low)
Figure 28.
Figure 29.
Shutdown Hysteresis Voltage
2.6V, SD Mode = VDD (High)
Shutdown Hysteresis Voltage
2.6V, SD Mode = GND (Low)
Figure 30.
Figure 31.
Output Power vs.
Supply Voltage, 4Ω
Output Power vs
Supply Voltage, 8Ω
Figure 32.
Figure 33.
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Typical Performance Characteristics (continued)
Output Power vs
Supply Voltage, 16Ω
Output Power vs
Supply Voltage, 32Ω
Figure 34.
Figure 35.
Frequency Response vs
Input Capacitor Size
Figure 36.
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APPLICATION INFORMATION
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4901 has two internal operational amplifiers. The first amplifier's gain is externally
configurable, while the second amplifier is internally fixed in a unity-gain, inverting configuration. The closed-loop
gain of the first amplifier is set by selecting the ratio of Rf to Ri while the second amplifier's gain is fixed by the
two internal 20kΩ resistors. Figure 1 shows that the output of amplifier one serves as the input to amplifier two
which results in both amplifiers producing signals identical in magnitude, but out of phase by 180°. Consequently,
the differential gain for the IC is
AVD= 2 *(Rf/Ri)
(1)
By driving the load differentially through outputs Vo1 and Vo2, an amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode operation is different from the classical single-ended amplifier
configuration where one side of the load is connected to ground.
A bridge amplifier design has a few distinct advantages over the single-ended configuration, as it provides
differential drive to the load, thus doubling output swing for a specified supply voltage. Four times the output
power is possible as compared to a single-ended amplifier under the same conditions. This increase in attainable
output power assumes that the amplifier is not current limited or clipped. In order to choose an amplifier's closedloop gain without causing excessive clipping, please refer to the Audio Power Amplifier Design section.
A bridge configuration, such as the one used in LM4901, also creates a second advantage over single-ended
amplifiers. Since the differential outputs, Vo1 and Vo2, are biased at half-supply, no net DC voltage exists across
the load. This eliminates the need for an output coupling capacitor which is required in a single supply, singleended amplifier configuration. Without an output coupling capacitor, the half-supply bias across the load would
result in both increased internal IC power dissipation and also possible loudspeaker damage.
POWER DISSIPATION
Power dissipation is a major concern when designing a successful amplifier, whether the amplifier is bridged or
single-ended. A direct consequence of the increased power delivered to the load by a bridge amplifier is an
increase in internal power dissipation. Since the LM4901 has two operational amplifiers in one package, the
maximum internal power dissipation is 4 times that of a single-ended amplifier. The maximum power dissipation
for a given application can be derived from the power dissipation graphs or from Equation 2.
PDMAX = 4*(VDD)2/(2π2RL)
(2)
It is critical that the maximum junction temperature TJMAX of 150°C is not exceeded. TJMAX can be determined
from the power derating curves by using PDMAX and the PC board foil area. By adding copper foil, the thermal
resistance of the application can be reduced from the free air value of θJA, resulting in higher PDMAX values
without thermal shutdown protection circuitry being activated. Additional copper foil can be added to any of the
leads connected to the LM4901. It is especially effective when connected to VDD, GND, and the output pins.
Refer to the application information on the LM4901 reference design board for an example of good heat sinking.
If TJMAX still exceeds 150°C, then additional changes must be made. These changes can include reduced supply
voltage, higher load impedance, or reduced ambient temperature. Internal power dissipation is a function of
output power. Refer to the Typical Performance Characteristics curves for power dissipation information for
different output powers and output loading.
POWER SUPPLY BYPASSING
As with any amplifier, proper supply bypassing is critical for low noise performance and high power supply
rejection. The capacitor location on both the bypass and power supply pins should be as close to the device as
possible. Typical applications employ a 5V regulator with 10 µF tantalum or electrolytic capacitor and a ceramic
bypass capacitor which aid in supply stability. This does not eliminate the need for bypassing the supply nodes of
the LM4901. The selection of a bypass capacitor, especially CB, is dependent upon PSRR requirements, click
and pop performance (as explained in the section, Proper Selection of External Components), system cost, and
size constraints.
12
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SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the LM4901 contains shutdown circuitry that is used to
turn off the amplifier's bias circuitry. In addition, the LM4901 contains a Shutdown Mode pin, allowing the
designer to designate whether the part will be driven into shutdown with a high level logic signal or a low level
logic signal. This allows the designer maximum flexibility in device use, as the Shutdown Mode pin may simply
be tied permanently to either VDD or GND to set the LM4901 as either a "shutdown-high" device or a "shutdownlow" device, respectively. The device may then be placed into shutdown mode by toggling the Shutdown pin to
the same state as the Shutdown Mode pin. For simplicity's sake, this is called "shutdown same", as the LM4901
enters shutdown mode whenever the two pins are in the same logic state. The trigger point for either shutdown
high or shutdown low is shown as a typical value in the Supply Current vs Shutdown Voltage graphs in the
Typical Performance Characteristics section. It is best to switch between ground and supply for maximum
performance. While the device may be disabled with shutdown voltages in between ground and supply, the idle
current may be greater than the typical value of 0.1µA. In either case, the shutdown pin should be tied to a
definite voltage to avoid unwanted state changes.
In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry, which
provides a quick, smooth transition to shutdown. Another solution is to use a single-throw switch in conjunction
with an external pull-up resistor (or pull-down, depending on shutdown high or low application). This scheme
ensures that the shutdown pin will not float, thus preventing unwanted state changes.
PROPER SELECTION OF EXTERNAL COMPONENTS
Proper selection of external components in applications using integrated power amplifiers is critical to optimize
device and system performance. While the LM4901 is tolerant of external component combinations,
consideration to component values must be used to maximize overall system quality.
The LM4901 is unity-gain stable which gives the designer maximum system flexibility. The LM4901 should be
used in low gain configurations to minimize THD+N values, and maximize the signal to noise ratio. Low gain
configurations require large input signals to obtain a given output power. Input signals equal to or greater than 1
Vrms are available from sources such as audio codecs. Please refer to the section, Audio Power Amplifier
Design , for a more complete explanation of proper gain selection.
Besides gain, one of the major considerations is the closed-loop bandwidth of the amplifier. To a large extent, the
bandwidth is dictated by the choice of external components shown in Figure 1. The input coupling capacitor, Ci,
forms a first order high pass filter which limits low frequency response. This value should be chosen based on
needed frequency response for a few distinct reasons.
Selection Of Input Capacitor Size
Large input capacitors are both expensive and space hungry for portable designs. Clearly, a certain sized
capacitor is needed to couple in low frequencies without severe attenuation. But in many cases the speakers
used in portable systems, whether internal or external, have little ability to reproduce signals below 100 Hz to
150 Hz. Thus, using a large input capacitor may not increase actual system performance.
In addition to system cost and size, click and pop performance is effected by the size of the input coupling
capacitor, Ci. A larger input coupling capacitor requires more charge to reach its quiescent DC voltage (nominally
1/2 VDD). This charge comes from the output via the feedback and is apt to create pops upon device enable.
Thus, by minimizing the capacitor size based on necessary low frequency response, turn-on pops can be
minimized.
Besides minimizing the input capacitor size, careful consideration should be paid to the bypass capacitor value.
Bypass capacitor, CB, is the most critical component to minimize turn-on pops since it determines how fast the
LM4901 turns on. The slower the LM4901's outputs ramp to their quiescent DC voltage (nominally 1/2 VDD), the
smaller the turn-on pop. Choosing CB equal to 1.0 µF along with a small value of Ci (in the range of 0.1 µF to
0.39 µF), should produce a virtually clickless and popless shutdown function. While the device will function
properly, (no oscillations or motorboating), with CB equal to 0.1 µF, the device will be much more susceptible to
turn-on clicks and pops. Thus, a value of CB equal to 1.0 µF is recommended in all but the most cost sensitive
designs.
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13
LM4901
SNAS139F – DECEMBER 2001 – REVISED DECEMBER 2001
www.ti.com
AUDIO POWER AMPLIFIER DESIGN
A 1W/8Ω Audio Amplifier
Given:
Power Output
1 Wrms
Load Impedance
8Ω
Input Level
1 Vrms
Input Impedance
Bandwidth
20 kΩ
100 Hz–20 kHz ± 0.25 dB
A designer must first determine the minimum supply rail to obtain the specified output power. By extrapolating
from the Output Power vs Supply Voltage graphs in the Typical Performance Characteristics section, the supply
rail can be easily found.
5V is a standard voltage in most applications, it is chosen for the supply rail. Extra supply voltage creates
headroom that allows the LM4901 to reproduce peaks in excess of 1W without producing audible distortion. At
this time, the designer must make sure that the power supply choice along with the output impedance does not
violate the conditions explained in the Power Dissipation section.
Once the power dissipation equations have been addressed, the required differential gain can be determined
from Equation 3.
(3)
(4)
Rf/Ri = AVD/2
From Equation 3, the minimum AVD is 2.83; use AVD = 3.
Since the desired input impedance was 20 kΩ, and with a AVD impedance of 2, a ratio of 1.5:1 of Rf to Ri results
in an allocation of Ri = 20 kΩ and Rf = 30 kΩ. The final design step is to address the bandwidth requirements
which must be stated as a pair of −3 dB frequency points. Five times away from a −3 dB point is 0.17 dB down
from passband response which is better than the required ±0.25 dB specified.
fL = 100 Hz/5 = 20 Hz
fH = 20 kHz * 5 = 100 kHz
As stated in the External Components section, Ri in conjunction with Ci create a highpass filter.
Ci ≥ 1/(2π*20 kΩ*20 Hz) = 0.397 µF; use 0.39 µF
The high frequency pole is determined by the product of the desired frequency pole, fH, and the differential gain,
AVD. With a AVD = 3 and fH = 100 kHz, the resulting GBWP = 300kHz which is much smaller than the LM4901
GBWP of 2.5MHz. This figure displays that if a designer has a need to design an amplifier with a higher
differential gain, the LM4901 can still be used without running into bandwidth limitations.
14
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LM4901
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SNAS139F – DECEMBER 2001 – REVISED DECEMBER 2001
Figure 37. Higher Gain Audio Amplifier
The LM4901 is unity-gain stable and requires no external components besides gain-setting resistors, an input
coupling capacitor, and proper supply bypassing in the typical application. However, if a closed-loop differential
gain of greater than 10 is required, a feedback capacitor (C4) may be needed as shown in Figure 37 to
bandwidth limit the amplifier. This feedback capacitor creates a low pass filter that eliminates possible high
frequency oscillations. Care should be taken when calculating the -3dB frequency in that an incorrect
combination of R3 and C4 will cause rolloff before 20kHz. A typical combination of feedback resistor and
capacitor that will not produce audio band high frequency rolloff is R3 = 20kΩ and C4 = 25pf. These components
result in a -3dB point of approximately 320 kHz.
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LM4901
SNAS139F – DECEMBER 2001 – REVISED DECEMBER 2001
www.ti.com
Figure 38. Differential Amplifier Configuration for LM4901
Figure 39. Reference Design Board Schematic
16
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LM4901
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SNAS139F – DECEMBER 2001 – REVISED DECEMBER 2001
LM4901 VSSOP DEMO BOARD ARTWORK
Silk Screen
Top Layer
Bottom Layer
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LM4901
SNAS139F – DECEMBER 2001 – REVISED DECEMBER 2001
www.ti.com
LM4901 WSON DEMO BOARD ARTWORK
Composite View
Silk Screen
Top Layer
Bottom Layer
Table 1. Mono LM4901 Reference Design Boards
Bill of Material
Part Description
Quantity
Reference Designator
LM4901 Audio AMP
1
U1
Tantalum Capcitor, 1µF
2
C1, C3
Ceramic Capacitor, 0.39µF
1
C2
Resistor, 20kΩ, 1/10W
2
R2, R3
Resistor, 100kΩ, 1/10W
2
R1, R4
Jumper Header Vertical Mount 2X1 0.100“ spacing
2
J1, J2
PCB LAYOUT GUIDELINES
This section provides practical guidelines for mixed signal PCB layout that involves various digital/analog power
and ground traces. Designers should note that these are only "rule-of-thumb" recommendations and the actual
results will depend heavily on the final layout.
GENERAL MIXED SIGNAL LAYOUT RECOMMENDATION
Power and Ground Circuits
For 2 layer mixed signal design, it is important to isolate the digital power and ground trace paths from the
analog power and ground trace paths. Star trace routing techniques (bringing individual traces back to a central
point rather than daisy chaining traces together in a serial manner) can have a major impact on low level signal
performance. Star trace routing refers to using individual traces to feed power and ground to each circuit or even
device. This technique will require a greater amount of design time but will not increase the final price of the
board. The only extra parts required will be some jumpers.
18
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LM4901
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SNAS139F – DECEMBER 2001 – REVISED DECEMBER 2001
Single-Point Power / Ground Connections
The analog power traces should be connected to the digital traces through a single point (link). A "Pi-filter" can
be helpful in minimizing High Frequency noise coupling between the analog and digital sections. It is further
recommended to put digital and analog power traces over the corresponding digital and analog ground traces to
minimize noise coupling.
Placement of Digital and Analog Components
All digital components and high-speed digital signal traces should be located as far away as possible from analog
components and circuit traces.
Avoiding Typical Design / Layout Problems
Avoid ground loops or running digital and analog traces parallel to each other (side-by-side) on the same PCB
layer. When traces must cross over each other do it at 90 degrees. Running digital and analog traces at 90
degrees to each other from the top to the bottom side as much as possible will minimize capacitive noise
coupling and cross talk.
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LM4901
SNAS139F – DECEMBER 2001 – REVISED DECEMBER 2001
www.ti.com
REVISION HISTORY
20
Rev
Date
Description
1.0
12/10/02
Re-released the D/S to the WEB. Edited
WSON Markings (LM4901 to L4901).
1.1
7/25/06
Removed all references to IBL (micro SMD)
package per Troy, then re-released the D/S
to the WEB.
F
05/02/2013
Changed layout of National Data Sheet to TI
format.
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PACKAGE OPTION ADDENDUM
www.ti.com
2-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
LM4901MMX/NOPB
ACTIVE
Package Type Package Pins Package
Drawing
Qty
VSSOP
DGS
10
3500
Eco Plan
Lead/Ball Finish
(2)
Green (RoHS
& no Sb/Br)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
CU SN
Level-1-260C-UNLIM
(4)
-40 to 85
GC1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LM4901MMX/NOPB
Package Package Pins
Type Drawing
VSSOP
DGS
10
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3500
330.0
12.4
Pack Materials-Page 1
5.3
B0
(mm)
K0
(mm)
P1
(mm)
3.4
1.4
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM4901MMX/NOPB
VSSOP
DGS
10
3500
367.0
367.0
35.0
Pack Materials-Page 2
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