TD62308APG,TD62308AFG - TOSHIBA Semiconductor
TD62308APG/AFG
TOSHIBA Bipolar Digital Integrated Circuit
Silicon Monolithic
TD62308APG,TD62308AFG
4ch Low Input Active High-Current Darlington Sink Driver
The TD62308APG/AFG is a non−inverting transistor array
which is comprised of four NPN darlington output stages and
PNP input stages.
This device is low−level input active driver and is suitable for
operation with 5-V TTL, 5-V CMOS and 5-V Microprocessor
which have sink current output drivers.
Application include relay, hammer, lamp and stepping motor
drivers.
Features
TD62308APG
TD62308AFG
•
Output current (single output): 1.5 A (max)
•
High sustaining voltage output: 50 V (min)
•
Output clamp diodes
•
Input compatible with TTL and 5 V CMOS
•
Low level active inputs
•
Standard supply voltage
•
Two VCC terminals VCC1, VCC2 (separated)
•
GND and SUB terminal = Heat sink
•
Package type-APG: DIP-16 pin
•
Package type-AFG: HSOP-16 pin
Weight
DIP16-P-300-2.54A: 1.11 g (typ.)
HSOP16-P-300-1.00: 0.50 g (typ.)
Pin Assignment (top view)
TD62308APG
Heat sink
& GND
COM
O4
I4
I3
O3
COM
16
15
14
13
12
11
10
9
1
VCC1
2
O1
3
I1
4
5
6
I2
7
O2
8
VCC2
Heat sink
& GND
TD62308AFG
COM
O4
I4
NC
16
15
14
13
1
VCC1
2
O1
3
I1
4
NC
Heat sink
& GND
Heat sink
& GND
NC
I3
O3
COM
12
11
10
9
5
NC
6
I2
7
O2
8
VCC2
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TD62308APG/AFG
Schematics (each driver)
4kΩ
2 kΩ
VCC
COMMON
Output
8.2 k Ω
1.1 kΩ
600 Ω
Input
GND
Note: The input and output parasitic diodes cannot be used as clamp diodes.
Precautions for Using
(1)
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, VCC, COMMON and GND line since IC may be
destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
(2)
If a TD62308APG/AFG is being used to drive an inductive load (such as a motor, solenoid or relay), Toshiba
recommends that the diodes (pins 9 and 16) be connected to the secondary power supply pin so as to absorb
the counter electromotive force generated by the load. Please adhere to the device’s absolute maximum ratings.
Toshiba recommends that zener diodes be connected between the diodes (pins 9 and 16) and the secondary
power supply pin (as the anode) so as to enable rapid absorption of the counter electromotive force. Again,
please adhere to the device’s absolute maximum ratings.
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Supply voltage
Output sustaining voltage
Output current
Symbol
Rating
Unit
VCC
−0.5 to 10
V
VCE (SUS)
−0.5 to 50
V
IOUT
1.5
A/ch
Input current
IIN
−10
mA
Input voltage
VIN
−0.5 to 30
V
Clamp diode reverse voltage
VR
50
V
Clamp diode forward current
IF
1.5
A
APG
Power dissipation
PD
AFG
1.47/2.7
(Note 1)
0.9/1.4
(Note 2)
W
Operating temperature
Topr
−40 to 85
°C
Storage temperature
Tstg
−55 to 150
°C
Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)
Note 2: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%)
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TD62308APG/AFG
Recommended Operating Conditions (Ta = −40 to 85°C)
Symbol
Test Condition
Min
Typ.
Max
Unit
VCC

4.5

5.5
V
VCE (SUS)

0

50
V
0

1250
Duty = 10%
0

1250
4 circuits
Duty = 50%
0

700
Ta = 85°C
Duty = 10%
0

1250
Tj = 120°C
Duty = 50%
0

390
Characteristics
Supply voltage
Output sustaining voltage
DC1 circuit, Ta = 25°C
APG
Output current
tpw = 25 ms
IOUT
AFG
VIN

0

25
VIN (ON)

0

VCC
−3.6
VIN (OFF)

VCC
−1.0

VCC
VR



50
V
A
Output ON
Input voltage
Output OFF
Clamp diode reverse voltage
Clamp diode forward current
IF
APG
Power dissipation
mA/ch

1.25
(Note 1)


1.4
Ta = 85°C
(Note 2)


0.7
Min
Typ.
Max
VCE = 50 V, Ta = 25°C


50
VCE = 50 V, Ta = 85°C


100
IOUT = 1.25 A


1.8
IOUT = 0.7 A


1.3

PD
AFG

Ta = 85°C
V
V
W
Note 1: On glass epoxy PCB (50 × 50 × 1.6 mm Cu 50%)
Note 2: On glass epoxy PCB (60 × 30 × 1.6 mm Cu 30%)
Electrical Characteristics (Ta = 25°C)
Symbol
Test
Circuit
ICEX
1
VCE (sat)
3
High level
VIH


VCC
−1.6

25
Low level
VIL




VCC
−3.6
High level
IIH




10
µA
Low level
IIL



−0.05
−0.36
mA
Clamp diode reverse current
IR
4
VR = 50 V, Ta = 25°C


50
µA
Clamp diode forward voltage
VF
5
IF = 1.25 A

1.5
2.0
V
VCC = 5.5 V, VIN = 0 V

8.5
12.5
mA/ch
VCC = 5.5 V, VIN = VCC


1.0
µA
Characteristics
Output leakage current
Output saturation voltage
Test Condition
Input voltage
Input current
Supply current
Output ON
ICC (ON)
Output OFF
ICC (OFF)
2
Unit
µA
V
V
Turn-ON delay
tON
6
CL = 15 pF, VOUT = 50 V,
RL = 40 Ω

0.2

µs
Turn-OFF delay
tOFF
6
CL = 15 pF, VOUT = 35 V,
RL = 40 Ω

5.0

µs
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TD62308APG/AFG
Test Circuit
1. ICEX
2. ICC
VCC
3. VCE (sat)
VCC
ICEX
IIN
VCC
Open
ICC
IOUT
Open
Open
VCE
VIN
4. IR
VIL
VCE (sat)
5. VF
VCC
VCC
IR
Open
VF
VR
IF
Open
6. tON, tOFF
Input
Output
VIN
(Note 1)
tf
tr
VOUT
RL
Pulse
generator
(Note 1)
VCC Open
Input
CL = 15 pF
(Note 2)
90%
50%
10%
tON
Output
10%
50 µs
50%
90%
50%
tOFF
VIH = 5 V
VOH
50%
VOL
Note 1: Pulse Width 50 µs, Duty Cycle 10%
Output Impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns
Note 2: CL includes probe and jig capacitance
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TD62308APG/AFG
30
VOUT – VIN
30
Ta = 25°C (typ.)
(V)
Output voltage VOUT
Output voltage VOUT
20
5.0
VCC = 4.5 V
5.5
10
0
0
2
4
Input voltage VIN
20
25
Ta = −40°C
4
Input voltage VIN
(W)
Power dissipation PD
1.0
Ta = 85°C
0.5
25
−40
0.5
1.0
1.5
(2)
(3)
(4)
0.6
(V)
40
80
120
Ambient temperature
IOUT – Duty cycle
1500
1.8
0
0
2.0
Output saturation voltage VCE (sat)
2.4
1.2
(V)
(1) DIP-16 pin
type-APG on PCB
(50 × 50 × 1.6 mm Cu 50%)
(2) DIP-16 pin type-AP free air
(3) HSOP-16 pin
Type-AFG on PCB
(60 × 30 × 1.6 mm Cu 30%)
(4) HSOP-16 pin free air
(1)
VIN = 0 V
6
PD – Ta
3.0
VCC = 5 V
(A)
2
(V)
(typ.)
0
0
85
10
0
0
6
IOUT – VCE (sat)
1.5
Output current IOUT
VCC = 5.0 V
IOUT = 0.9 A
(V)
IOUT = 0.9 A
VOUT – VIN
160
Ta
(°C)
IOUT – Duty cycle
1500
(mA)
n=3
n=2
n=4
900
Output current IOUT
Output current IOUT
(mA)
n=1
1200
600
TD62308APG
300
Ta = 25°C
n=3
n=2
TD62308APG
300
Ta = 85°C
VCC = 5.5 V
n-ch ON
20
n=4
600
VCC = 5.5 V
0
0
n=1
1200
900
200
40
Duty cycle
60
80
0
0
100
(%)
n-ch ON
20
40
Duty cycle
5
60
80
100
(%)
2014-05-30
TD62308APG/AFG
IOUT – Duty cycle
1500
IOUT – Duty cycle
1500
n=3
n=4
900
(mA)
n=2
Output current IOUT
Output current IOUT
(mA)
n=1
1200
600
TD62308AFG
300
Ta = 25°C
1200
900
600
n=4
Ta = 85°C
VCC = 5.5 V
n-ch ON
20
n=2
n=3
TD62308AFG
300
VCC = 5.5 V
0
0
n=1
40
60
80
0
0
100
Duty Cycle (%)
n-ch ON
20
40
60
80
100
Duty Cycle (%)
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TD62308APG/AFG
Package Dimensions
Weight: 1.11 g (typ.)
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TD62308APG/AFG
Package Dimensions
Weight: 0.50 g (typ.)
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TD62308APG/AFG
Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
2. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2)
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4)
Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5)
Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
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TD62308APG/AFG
Points to Remember on Handling of ICs
(1)
Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2)
Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into
consideration in system design.
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TD62308APG/AFG
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
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WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
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limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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2014-05-30
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