Computer-On-Modules
Engineering Leadership
Computer-On-Modules
03 | 2017
MSC Technologies at a Glance
”Our aim is to deliver
the best engineering
performance to provide
our customers with a
leadership position in
their markets.”
youtube.com/mscembedded
2 | www.msc-technologies.eu
Silvano Geissler, Vice President
Board Solutions, MSC Technologies
3
Computer on Module Product Range
ARM Technology
X86 Technology
MSC has the complete portfolio of COM Ex-
The SMARC 2.0 product range is steadily grow-
press modules. From low end Intel Atom to
ing and spans ARM Cortex-A9 to latest x86
high end Core i7 and Xeon processors, from
Atom SOCs.
Mini to Basic format.
The nanoRISC module family combines comMSC’s widespread Qseven portfolio is one of
pact size with low power and low cost. With
the widest in the industry. From Single-Core
ARM Cortex-A8 and A9 processors.
®
ARM to Quad-Core x86, Cortex-A9 to latest x86.
4 | www.msc-technologies.eu
5
Vertical Markets
Industrial
Medical
Gaming
Transportation
POS/POI
Building Automation
Security
Scalability of COMs
“Scalability of Performance“ describes the capability of COMs to allow
alternative modules of different performance and feature levels to be
used in the module socket of the same carrier board.
Other Advantages of COMs
• Reduced complexity
• Focuses core competence on system design
• Faster development cycles – shorter Time to Market
• Lower cost-of-ownership
• Minimizes development risk
• High flexibility
• Extended lifecycle concept
• Second source availability due to standardization
6 | www.msc-technologies.eu
7
Fitness
Center
Smart
Grid
Factory
Automation
Smart
Store
Medical
Devices
MSC - The Standards Innovator
Since 2005 MSC is an executive member of the PCI Computer Manufacturer Group (PICMG), and has been driving the development of new
SMART CITY
Traffic
Optimization
CLOUD &
SERVICE
Intelligent
Digital Signage
Hospital
Information
Network
Optimization
INTELLIGENT HOSPITAL
Renewable
Energy
Home
Automation
SMART LIVING
Traffic
Camera
INDUSTRY 4.0
Security
versions of the popular COM Express™ standard.
MSC was one of the founders of the Standardization Group for Embed-
Microsoft Azure Cloud
ded Technologies (SGeT), focusing on the development of specifications
for embedded computer products. As a prominent member of SGeT,
Internet of Things
MSC has been driving the standardization process for the Qseven™ and
In the course of the next industrial revolution, billions of intelligent
the SMARC™ 2.0 specifications.
devices, systems and machines are going to be interconnected by the
Internet of Things. All of MSC’s Computer-on-Modules are ready for application in IoT devices, network concentrators and the cloud.
MSC - The Technology Leader
Cloud Services are available from Microsoft for a wide range of require-
IoT
Technology
Id
ments. Microsoft Azure is a growing collection of integrated cloud ser-
Premier Partners
vices implemented through Microsoft’s global network of data centers.
MSC is a premier partner of Intel and AMD, and has early access to all
®
new microprocessor generations.
MSC is providing an On-Board Tool which allows connecting to IoT nodes
consisting of Computer-on-Modules and/or Computer Boards effective-
Processors
ly reading out status information and application results.
We are using the best ARM processors from NXP and Texas Instruments
on our Qseven, SMARC 2.0 and nanoRISC® modules.
Microsoft Azur
for IoT product
BIOS Partnership
All current Computer-on-Modules from MSC are certified for the Mic-
Get a head start connect
Our BIOS partnership with AMI ensures that our software engineering
rosoft Azure Cloud and can be employed for IoT-related applications.
Azure cloud and take a
capabilities in the BIOS/ UEFI development includes customization of
the source code.
solutions available in
today with any of Av
platforms (developed b
for a high-quality hardw
8 | www.msc-technologies.eu
Eval kits featuring support documentation an
9
to Microsoft Azure are available for Window
MSC - Research & Development
MSC - Production
Best-in-class Engineering since 1987
Leading-Edge Manufacturing
MSC has more than 30 years of experience in complex and high-speed
MSC runs three state-of-the art manufacturing sites in Germany and in
circuit design, development and production. Our skilled design engineers
Malta. Latest production equipment and a high degree of automation
have many years of experience designing boards with high-end x86 and
allows us to achieve best-in-class throughput at very low manufacturing
ARM CPUs as well as with fast memory technology and programmable de-
cost and highest quality.
Certificate of Registration
This is to certify that the Quality Management System of
vices (CPLD, FPGA). Ultra-fast system signal design and layout has always
MSC Technologies GmbH
Industriestraße 16
D-76297 Stutensee
been one of our specialties.
Best-in-Class Quality
has been assessed and registered by Intertek Certification GmbH as conforming to
the requirements of
The MSC product engineering, test development and production engi-
Development, production and sales of customer specific and own electronic systems,
boards, components and display solutions as well as distribution of electronic components
and display products at the sites listed in the annex.
DIN EN ISO 9001:2015
The Quality Management System is applicable to
Certificate Reg. No.:
neers are working hand in hand to achieve optimized product quality.
2015-02239
Validity Date:
03.12.2015
Initial Certification on:
17.08.1999
Issue Date:
24.11.2015
till
02.12.2018
The appendix is part of this certificate and consists of 1 page.
Christina Weiglein, Certification Body
Intertek Certification GmbH - Hanns-Martin-Schleyer-Straße 2, D-41199 Moenchengladbach, Germany
• x86 CPU Architecure
Our sophisticated SAP-integrated MES and quality system ensures
• ARM Cortex-Ax Architecture
full traceability of our products, and includes strict version control for
• FPGA / FPGA SOC Design
each product made.
• High Speed Designs (DDRx DRAM, PCIe, USB 3.0,
Frontside Buses, Graphics, ….)
• Simulation (Thermal, Signal Integrity, Functional)
• Operating System support
In the issuance of this certificate, Intertek assumes no liability to any party other than to the Client, and then
only in accordance with the agreed upon Certification Agreement. This certificate’s validity is subject to the
organization maintaining their system in accordance with Intertek’s requirements for systems certification.
Validity may be confirmed via email at certificate.validation@intertek.com or by scanning the code to the right
with a smartphone.
Certificate
The certificate remains the property of Intertek, to whom it must be returned upon request.
It is hereby confirmed that company
MSC Technologies GmbH
including the sites of the companies:
141026U-A
MSC Technologies GmbH
Industriestrasse 16
D-76297 Stutensee
scope of application:
Development and production of electronic
devices and systems as well as distribution
of electronic components and devices
141026U-B
Avnet Logistics Stutensee GmbH
Industriestrasse 18
D-76297 Stutensee
scope of application:
Services in logistics division
141026U-C
Avnet Logistics PMC Stutensee GmbH
Industriestrasse 16
D-76297 Stutensee
scope of application:
Programming of electronic components
has fully implemented a management system in accordance with the standard
(Windows / Windows Embedded / Linux Embedded)
• BIOS and software development
DIN EN ISO 14001:2009
for the above-named scope of application.
Date of initial certification: 12/12/2011
Certificate registration no.: 141026U
This certificate is valid until: 11/12/2017
Chemnitz, 12/12/2014
ICG Zertifizierung GmbH, Wildparkstraße 3, D-09247 Chemnitz / Germany
10 | www.msc-technologies.eu
Certifying Body
11
BIOS / Software
D
RE
U
C
E
S
UEFI BIOS
Operating Systems
For all x86 modules MSC is using the advanced AMI Aptio V BIOS which
MSC is supporting all popular and important operating systems, i.e. Windows 10, Windows 7 and
implements the UEFI architecture with Secure Boot enhancements.
Linux. Older modules are supporting Windows 7 and/or Windows 8. For most recent modules,
MSC ontinuously improves its BIOS solutions with new functions and
Linux support is based on the Yocto Project which is the standard for up-to-date embedded sys-
technologies such as Advanced Boot Device Configuration.
tems controlled by Linux.
MSC is offering to adapt the BIOS for customers, but is also offering the
MSC BIOS Configuration Tool which enables users to easily modify BIOS
Distributed/
Network Apps
MSC-On-Board Controller
MSC implements a powerful microcontroller (EC) on all advanced modules which helps to control
binary images and set configuration defaults, add splash screen images,
pre-define passwords etc. MSC is maintaining user-friendly interfaces
Apps
correct operation of the module and takes over most of the house holding functions: it controls
the fan speed, monitors temperatures and voltage levels and controls power on/off of the board.
such as EAPI (Embedded Application Programming Interface) to allow
low-level control of non-volatile memory, I2C bus access, backlight set-
OS Drivers
Besides health monitoring and logging, the EC has implemented a power-on and boot watchdog
and display backlight control. The optional smart battery support makes it easy to design full
tings, watchdog timer etc.
battery powered systems.
Security
The AMI Aptio V BIOS as used by MSC supports the “Chain of Trust”
®
Boot
Loader
according to the TCG (Trusted Computing Group):
Option ROMs
• From power-on every step is monitored
• CRTM (Core root of trust for measurement) is essential
• Hash values in TPM are compared to actual values of SW modules
• Boot process stops if integrity of one chain link is doubtful
• SecureFlash update tool allows signed update files only
BIOS
(POST Phase)
“Chain of Trust”
OS Kernel
Monitoring
Fan Control
Power Sequencing
Watchdog
Display Backlight Control
Boot Block
Smart Battery Support
Health Data
• Root of Trust cannot be modified
TPM
EDID Emulation
Customized Functions
Runtime Metering
“Root of Trust”(CRTM)
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13
Cooling Solutions
Thermal Simulations
MSC is offering a large number of different cooling devices for its Com-
MSC performs thermal simulations prior to producing cooling solutions
puter-on-Modules portfolio. Among these are various heatspreaders,
in hardware. This ensures that all requirements will be considered and
heatsinks and a selection of heatsinks with fans for active cooling. All
that the result will perform near the theoretical optimium. MSC provides
coolers can be customized by MSC to optimize functionality, efficien-
thermal consulting as a service to its customers helping to ensure that
cy and cost. For high-volume applications, MSC offers to design custom
the resulting cooling solutions will be adequate on the system basis.
cooling solutions optimized for specific purposes.
14 | www.msc-technologies.eu
15
Environmental Testing & Certification
ED
RUGG
Built to Fit
Thermal Characteristics of Standard Products
Compliance Test
MSC offers customization of its standard modules accord-
Customized Assembly – Individual Solutions
MSC is offering most products in standard temperature and
• Pre & Post Layout Signal Simulations
ing to the requirements of the customers. This will help to
• Mounted and tested (memory, cooling, baseboard)
in industrial temperature variants. This temperature rating
• EMC, ESD in Reference Environment (CE)
achieve required price points for volume projects by not
• Individual test profile
is tested on a sample basis since all components used for
• Signal Compliance of High-Speed Interfaces
populating components which are not required, i.e. less
• Pre-configured BIOS
memory or less controllers of unnecessary functionality.
• Baseboard Electronic Manufacturing Service (EMS)
these products are specified accordingly.
Environmental Test
In addition, MSC offers to assemble Computer-on-Modules
• Temperature Tests
on carrier boards, optionally with suitable cooling and with
For boards which are only specified in the standard tem-
• Shock
memory modules inserted.
perature range, MSC is offering a screening service result-
• Vibration
Product Screening and Ruggedization
ing in the same products available in an extended temperature range to be specified by the customers.
Certification
• Support for applications specific certifications
• Collaboration with external certification agencies
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17
< Standard Qseven Module
Customization Service
FPGA Capabilities
From Standard to Full-Custom
MSC has been designing FPGA-based boards and systems for several de-
A complete Computer-on-Module can be treated as a functional macro
cades. For very many application areas, we have successfully designed
and inserted into a full-custom board design. That will shorten the de-
cutting-edge high-speed and high-complexity boards providing ultimate
velopment time of customer-specific board designs dramatically, and
performance and functionality.
help to achieve the shortest possible time-to-market because the functional macro is already proven to work, and comes with full software
and firmware support.
< Standard Qseven Module
on Baseboard
Custom Development
• Carrier board
• Single-Board Computer
• Add-on boards
• Non-standard modules
< Qseven Technology into
18 | www.msc-technologies.eu
full-custom design
19
Global Leadership
Worldwide Support
No matter where in the world you are, the next
Avnet regional sales office is only a phone call
away. MSC Technologies is Avnet’s own brand of
embedded boards and systems, and is supported
by the entire Avnet sales force around the planet.
Regional sales engineers are supported by local
FAEs and Business Development Managers, who
all have direct access to MSC’s Product Marketing
and Technical Support groups.
MSC Headquarters and
Boards Manufacturing Plant
Stutensee
MSC Systems Manufacturing Plant
Freiburg
Design-in Services
Technical Support
• Pre- and Post-Sales Support
• Experience sharing
Avnet Headquarters
Phoenix / Arizona
MSC Boards Manufacturing Plant
Malta
• OEM baseboard design reviews and debugging
• Baseboard Design Guidelines and Trainings
• Benchmark performance comparisons
• Customized starter kits
Support Website
• Drivers, BSPs, BIOS updates
• Software APIs (EAPI) and other Software Tools
900 Employees
• User Manuals, App Notes, Mechanical infos, etc….
120 Engineers in R&D
4 Design Centers
3 Manufacturing Sites
More than 500,000 Boards per year
20 | www.msc-technologies.eu
21
COM Express™ Properties
for allsupports
Form four
Factors
The COMCommon
Express™ Standard
sizes:
Common for all Form Factors
Extended only
Basic only
Compact only
Compact and Basic only
Mini only
Extended
only
Mini, Compact,
Basic and
Extended. All sizes utilize
Basic 220-pin
only connectors except for the
two high-speed,
Mini format
which only
supports one connector.
Compact
only
Signal distribution
of this
connector
similar to the
Compact
and
Basicis only
other formats but by no means identical.
Mini only
106.00
Compact
Extended
Compact
91.00
Basic
Mini70.00
51.00
18.00
Mini
6.00
COM Express™
91.00
74.20
80.00
16.50
0.00
18.00
4.00
0.00
All dimensions are shown in millimeters.
6.00
4.00
COM Express™, the widely spread COM standard
as high-end computing and graphics intensive
in the embedded world, has been defined by the
solutions. It is designed for the latest chipsets
PICMG (PCI Industrial Computer Manufacturers
and serial signaling protocols, including PCI Ex-
Group) in 2005. Since that time and after a few
press Gen 3, SATA, USB 3.0, and high resolution
COM Express™ Extended
updates, COM Express has become the most ver-
video interfaces. COM Express provides the high-
• For special applications only
satile and most scalable COM standard support-
est performance of the many small form factor
• Not commonly used
• Highly integrated, fully featured and space saving solution
ing small and cost-sensitive applications as well
standards and products available.
• 155 mm x 110 mm
• 95 mm x 95 mm
COM Express™ Basic
COM Express™ Mini
• Standard COM Express format for high level
• Entry level format for small and rugged solutions
®
COM Express™ Compact
• Preferred format for entry and mid level solutions
All dimensions are shown in millimeters.
solutions
• 125 mm x 95 mm
22 | www.msc-technologies.eu
151.00
121.00
91.00
80.00
74.20
16.50
0.00
4.00
0.00
• Reduced feature set (uses only one connector)
• 84 mm x 55 mm
23
Ba
COM Express™ - Basic
COM Express™ - Basic
MSC C6B-KLH
Intel Core™ - 7th Generation
®
MSC C6B-8SB
NEW
Intel® Core™ - 5th Generation
Type 6
Type 6
95 x 125
The MSC C6B-KLH module is based on Intel‘s 7th generation Core processor family. The Intel two-chip solution allows highest performance in graphics and computing on a COM Express module in basic form factor.
35/55 W
95 x 125
55 W
This module is based on Intel's 5th generation Core™ processors produced in 14nm technology. It
supports triple independent displays, DirectX 11.1, fast low-power DDR3L-1600 memory and USB
3.0 on a COM Express Type 6 module.
Highlights
• Intel® Core™ i7-7820EQ (quad-core, 3.0/3.7GHz),
• Four SATA 6Gb/s mass storage interfaces
Highlights
Intel Core™ i5-7440EQ (quad-core, 2.9/3.6GHz),
• Three DisplayPort/HDMI/DVI interfaces
• Intel® Core™ i7-5850EQ (quad-core, 2.7/3.4GHz)
• LVDS (24 Bit, dual channel) and CRT interface
Intel Core™ i5-7442EQ (quad-core, 2.1/2.9GHz),
• Embedded DisplayPort / LVDS (24 Bit,
• Intel Core™ i7-5700EQ (quad-core, 2.6/3.4GHz)
• Triple independent display support
• Intel HD Graphics GT2 or GT3e
• DirectX 11.1, OpenGL 3.2, OpenCL 1.2
®
®
Intel Core™ i3-7100E (dual-core, 2.9GHz),
®
®
dual channel) interface
®
Intel Core™ i3-7102E (dual-core, 2.1GHz),
• Triple independent display support
• Intel 8-Series chipset
• Resolution up to 4096 x 2304
Intel Xeon E3-1505Mv6 (quad-core, 3.0/4.0GHz),
• DirectX 12, OpenGL 4.4, OpenCL 2.x
• Up to 16GB DDR3L-1600 SDRAM, dual channel
• Seven PCI Express™ x1 lanes
Intel Xeon E3-1505Lv6 (quad-core, 2.2/3.0GHz)
• Resolution up to 4096 x 2304
• Four SATA mass storage interfaces, up to 6Gb/s
• Four USB 3.0/2.0 and four USB 2.0 interfaces
• Intel HD Graphics 630, P630
• Eight PCI Express™ x1 lanes; PEG x16
• Three DisplayPort/HDMI/DVI interfaces
• Trusted Platform Module
• Intel chipsets QM175, HM175 or CM238
• Four USB 3.0/2.0 and four USB 2.0 interfaces
• Two embedded DisplayPort interfaces
• Up to 32GB DDR4-2133 SDRAM, dual channel
• Trusted Platform Module
®
®
®
®
®
®
®
(ECC optional)
®
• UEFI Firmware
MSC C6B-SLH
MSC C6B-8S / CXB-8S
Intel Core™ - 6th Generation
Intel® Core™ - 4th Generation
Type 6
Type 6 / Type 2
®
95 x 125
35 / 55 W
The MSC C6B-SLU module is based on Intel‘s 6th generation Core™ processor family with a new
processor architecture based on 14 nm process technology. The Intel two-chip solution allows
highest performance in graphics and computing on a COM Express module in basic form factor.
95 x 125
35 / 55 W
Based on Intel's 4th generation Core™ processors this COM Express family supports the latest
digital display interfaces like DisplayPort, HDMI and DVI and controls up to three independent
displays. USB 3.0 interfaces connect to the fastest peripheral devices available.
Highlights
Highlights
• Intel Core™ i7-6820EQ (quad-core, 2.8/3.5GHz)
• Intel HD Graphics 530, P530
• Intel® Core™ i7-4700EQ (quad-core, 2.4/3.4GHz)
• Three DisplayPort/HDMI/DVI interfaces
• Intel Core™ i7-6822EQ (quad-core, 2.0/2.8GHz)
• Intel chipsets QM170, HM170 or CM236
• Intel Core™ i5-4400E (dual-core, 2.7/3.3GHz)
• Two embedded DisplayPort interfaces
• Intel Core™ i5-6440EQ (quad-core, 2.7/3.4GHz)
• Up to 32GB DDR4 SDRAM, dual ch. (ECC opt.)
• Intel Core™ i5-4402E (dual-core, 1.6/2.7GHz)
• LVDS (24 Bit, dual channel) and CRT interface
• Intel Core™ i5-6442EQ (quad-core, 1.9/2.7GHz)
• Three DisplayPort/HDMI/DVI interfaces
• Intel Core™ i3-4100E (dual-core, 2.4GHz)
• Triple independent display support
• Intel Core™ i3-6100E (dual-core, 2.7GHz)
• LVDS (24 Bit, dual channel) or eDP interface
• Intel Core™ i3-4102E (dual-core, 1.6GHz)
• DirectX 11.1, OpenGL 3.2, OpenCL 1.2
• Intel Core™ i3-6102E (dual-core, 1.9GHz)
• Triple independent display support (4K)
• Intel Celeron 2000E (dual-core, 2.2GHz)
• Resolution up to 3800 x 2400
• Intel Celeron G3900E (dual-core, 2.4GHz)
• DirectX 12, OpenGL 4.4, OpenCL 2.x
• Intel Celeron 2002E (dual-core, 1.5GHz)
• Seven PCI Express™ x1 lanes
• Intel Celeron G3902E (dual-core, 1.6GHz)
• Four SATA 6Gb/s; Trusted Platform Module
• Intel HD Graphics GT1/GT2
• Four USB 3.0 and four USB 2.0 interfaces
• Intel Xeon E3-1505Mv5 (quad-core, 2.8/3.7GHz) • Eight PCI Express™ x1 lanes; PEG x16
• Intel 8-Series chipset
• Trusted Platform Module
• Intel Xeon E3-1505Lv5 (quad-core, 2.0/2.8GHz) • Four USB 3.0/2.0 and four USB 2.0 interfaces
• Up to 16GB DDR3L-1600 SDRAM, dual-channel
• Also available in Type 2 pin-out
®
®
®
®
®
®
®
®
®
®
®
®
®
®
®
®
®
®
®
®
®
®
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®
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®
• Four SATA mass storage interfaces, up to 6Gb/s
24 | www.msc-technologies.eu
25
COM Express™ - Basic / Compact
COM Express™ - Compact
MSC C6B-7S / CXB-6SI
MSC C6C-SLU
Intel Core™ - 3rd Generation
Intel® Core™ - 6th Generation
Type 6 / Type 2
Type 6
®
95 x 125
25 / 65 W
Based on Intel’s 3rd generation Core™ processors this COM Express module supports the latest
digital display interfaces, up to three independent displays and USB 3.0. Ultra low-power variants with only 17W CPU power dissipation allow passively cooled system designs.
95 x 95
17 / 19 W
The MSC C6C-SLU module is based on Intel‘s 6th generation Core™ processor family with a new
processor architecture based on 14 nm process technology. The multi-chip-package includes processor, graphics and chipset on one carrier and allows extremely compact high-performance designs.
Highlights
Highlights
• Intel Core™ i7-3612QE (quad-core, 2.1GHz)
• Three DisplayPort/HDMI/DVI interfaces
• Intel Core™ i7-3615QE (quad-core, 2.3GHz)
• Two embedded DisplayPort interfaces
• Intel Core™ i7-3555LE (quad-core, 2.5GHz)
• LVDS (24 Bit, dual channel) and CRT interface
• Intel Core™ i7-3517UE (dual-core, 1.7GHz)
• Triple independent display support
• Intel Core™ i5-3610ME (dual-core, 2.7GHz)
• DirectX 11, OpenGL 3.1, OpenCL 1.1
• Intel Core™ i3-3120ME (dual-core, 2.4GHz)
• Resolution up to 2560 x 1600
• Intel Core™ i3-3217UE (dual-core, 1.6GHz)
• Seven PCI Express x1 lanes, four SATA-300
• Intel Celeron 1020E (dual-core, 2.2GHz)
• Four USB 3.0 and four USB 2.0 interfaces
• Intel Celeron 1047UE (dual-core, 1.4GHz)
• Trusted Platform Module
• Integrated Intel Gen. 9 HD graphics
• Intel Celeron 927UE (single-core, 1.5GHz)
• Also available in Type 2 pin-out
• Up to 32GB DDR4 SDRAM, dual-channel
®
®
®
®
®
®
®
®
®
®
®
®
®
• Intel® Core™ i7-6600U dual-core 2.6/3.4GHz,
4MB L2, 15W TDP, 7.5/25W cTDP
• Intel Core™ i5-6300U dual-core 2.4/3.0GHz,
®
3MB L2, 15W TDP, 7.5/25W cTDP
• Intel Core™ i3-6100U dual-core 2.3GHz, 3MB
®
L2, 15W TDP, 7.5 cTDP
• Intel Celeron 3955U dual-core 2.0GHz, 2MB
®
®
L2, 15W TDP, 10W cTDP
®
• Three SATA 6Gb/s mass storage interfaces
• MicroSD card socket
• DisplayPort/HDMI/DVI interface
• LVDS/embedded DisplayPort interface
• Three independent displays supported
• DirectX 12, OpenGL 4.4, OpenCL 2.x
• Four USB 3.0/2.0 and four USB 2.0 interfaces
• Eight PCI Express™ x1 lanes
• Trusted Platform Module
• Up to 16GB DDR3-1600 SDRAM, dual channel
MSC C6C-KLU
Intel Core™ - 7th Generation
®
MSC C6C-AL
NEW
Intel® Atom™/Pentium®/Celeron® SOC
Type 6
95 x 95
17 / 19 W
NEW
Type 6
The MSC C6C-KLU module is based on Intel‘s 7th generation Core processor family. The Intel
multi-chip-package in 14 nm technology includes processor, graphics and chipset on one carrier
and allows extremely compact high-performance designs.
95 x 95
7/14 W
The MSC C6C-AL module is based on Intel‘s latest multi-core system-on-chip (SOC) Atom™ generation
that integrates next generation Intel® processor core, graphics, memory, and I/O interfaces into one
solution. The modules with Intel® Atom™ processors are also available in extended temperature versions.
-40... +85 °C
Highlights
Highlights
• Intel Core™ i7-7600U dual-core 2.8/3.9GHz,
®
4MB L2, 15W TDP
• Intel Core™ i5-7300U dual-core 2.6/3.5GHz,
®
3MB L2, 15W TDP
• Intel Core™ i3-7100U dual-core 2.4GHz,
• MicroSD card socket
• Intel® Atom™ E3950 quad-core 1.6/2.0GHz, 12W
• Two DisplayPort/HDMI/DVI interfaces
• Intel Atom™ E3940 quad-core 1.6/1.8GHz, 9.5W • Three independent displays supported
• Embedded DisplayPort / LVDS
• Intel® Atom™ E3930 dual -core 1.3/1.8GHz, 6.5W
(24 Bit, dual channel) interface
• LVDS/embedded DisplayPort interface
®
• DirectX 12, OpenGL 4.3, OpenCL 2.0
• Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W • Four USB 3.0/2.0 and four USB 2.0 interfaces
®
®
• Three independent displays supported
• Intel® Celeron® N3350 dual-core 1.1/2.4GHz, 6W
• Two high-speed UARTs
• DirectX 12, OpenGL 4.4, OpenCL 2.x
• Integrated Intel Gen. 9 HD graphics
• eMMC option
• Resolution up to 4096 x 2304
• Up to 16GB DDR3L SDRAM, dual-channel
• Up to five PCI Express™ x1 lanes
• Four USB 3.0/2.0 and four USB 2.0 interfaces
• Two SATA 6Gb/s mass storage interfaces
• UEFI Firmware
• Integrated Intel Gen. 9 HD graphics
• Eight PCI Express™ x1 lanes
• MicroSD card socket
• Trusted Platform Module
• Up to 32GB DDR4 SDRAM, dual-channel
• Trusted Platform Module
• eMMC option
• Extended temperature variants
• Three SATA 6Gb/s mass storage interfaces
• UEFI Firmware
• DisplayPort/HDMI/DVI interface
®
3MB L2, 15W TDP
• Intel Celeron™ 3965U dual-core 2.2GHz,
®
2MB L2, 15W TDP
®
26 | www.msc-technologies.eu
®
27
COM Express™ - Compact
COM Express™ - Compact
MSC C6C-BW
MSC C6C-GX
Intel Pentium / Celeron
®
®
AMD Embedded G-Series SOC
®
Type 6
Type 6
Segments: Embedded and Server
95 x 95
8 / 14 W
The MSC C6C-BW module is based on Intel‘s next generation Atom processors in14nm techno-
This compact COM Express
Type 6 module is based on AMD‘s Embedded G-Series SOC platform,
Opteron
95 x 95
Embedded
logy . These multi-core systems-on-chip provide outstanding computing and graphics power
a high-performance, low-power System-on-Chip solution with outstanding HD graphics and
12 / 30 W
and are more power efficient compared to their predecessors. The new module brings triple in-
-40
+85 °C
Embedded Solutions
dependent display support, DirectX 11.1, fast DDR3L memory and USB 3.0 on a compact, power
53120B
saving and cost-efficient module. Dual- and quad-core processors are supported by this design.
multimedia capabilities. The power saving and cost-efficient module offers dual independent
Embedded Solutions
“R” Series X
53057B
Embedded Solutions
Family fast DDR3
Opteron X memory and
Opteron AUSB 3.0.
display
support, DirectXOpteron
11.1,
“R” Series A
53117B
53118B
53119B
(showcase specific Opteron X86
technology platform)
(For future use)
Highlights
Highlights
• AMD GX-420CA quad-core 2.0GHz, 25W TDP,
Embedded Solutions
“G” Series X
53058B
• Intel Pentium N3700 quad-core 2.40GHz, 6W TDP • DisplayPort/HDMI/DVI interface
®
®
Embedded Solutions
“G” SeriesB
• Intel Celeron N3150 quad-core 2.08GHz, 6W TDP • LVDS/embedded DisplayPort interface
®
• Intel Celeron N3000 dual -core 2.08GHz, 4W TDP • DirectX 11.1, OpenGL 4.2, OpenCL 1.2
®
• AMD GX-217GA dual-core 1.65GHz, 15W TDP,
®
• Integrated Intel Gen. 8 HD graphics
• Four USB 3.0 and four USB 2.0 interfaces
• Up to 8GB DDR3L SDRAM, dual-channel
• Up to five PCI Express™ x1 lanes
• Two SATA 6Gb/s mass storage interfaces
• Trusted Platform Module (option)
®
Embedded Solutions
Radeon Graphics
53121B
Embedded Solutions
Opteron X
53116B
Embedded Solutions
Opteron A
95 x 95
• Integrated AMD HD 8000E graphics
• Two USB 3.0 and six USB 2.0 interfaces
8 / 14 W
PAGE 12
MSC C6C-BT / CXC-BT
MSC C6C-A7
Intel Atom™ / Celeron SOC
AMD Embedded R-Series
Type 6 / Type 2
Type 6
®
95 x 95
Based on Intel‘s multi-core system-on-chip (SOC) Atom generation this COM Express module
brings display interfaces like DisplayPort, HDMI 1.4a and DVI, supports dual independent displays, USB 3.0 and fast DDR3L memory on a compact, power saving and cost-efficient module.
Based on AMD‘s Embedded R-Series platform this compact COM Express Type 6 module offers
25 / 35 W
Segments: Embedded and Server
-40 +85 °C
• Intel® Atom™ E3845 quad-core 1.91GHz, 10W TDP
• Two SATA 3Gb/s mass storage interfaces
• Intel Atom™ E3827 dual-core 1.75GHz, 8W TDP
• MicroSD card socket
®
• Intel Atom™ E3826 dual -core 1.46GHz, 7W TDP
• DisplayPort/HDMI/DVI interface
• Intel Atom™ E3825 dual -core 1.33GHz, 6W TDP
• LVDS/embedded DisplayPort interface
• Intel Atom™ E3815 single-core 1.46GHz, 5W TDP
• VGA interface
• Intel Celeron N2920
• Two independent displays supported
®
®
®
®
®
quad-core 1.86/2.00GHz, 7.5W TDP
• Intel Celeron J1900
®
®
quad-core 2.00/2.42GHz, 10W TDP
• Integrated Intel Gen. 7 HD graphics
®
• Up to 8GB DDR3L SDRAM, dual-channel
28 | www.msc-technologies.eu
• DirectX 11.1, OpenGL 3.2, OpenCL 1.1
display support, DirectX 11 and USB 3.0. Turbo overclocking and accelerated video encoding /
Opteron
Highlights
• AMD R-460L quad-core 2.0/2.8GHz, 25W TDP,
Embedded Solutions
53120B
Embedded Solutions
“R” Series X
53057B
Embedded Solutions
“R” Series A
Opteron Family
53117B
Radeon HD 7620G
Opteron X
53118B
(showcase specific Opteron X86
technology platform)
Opteron A
53119B
(For future use)
• AMD R-252F dual-core 1.7/2.3GHz, 17W TDP ,
Radeon HD 7400G
Embedded Solutions
“G” Series X
53058B
Embedded Solutions
“G” SeriesB
Embedded Solutions
Geode
• One USB 3.0 and up to seven USB 2.0 interface
• AMD R-452L quad-core 1.6/2.4GHz, 19W TDP,
Radeon HD 7600G
• AMD R-260H dual-core 2.1/2.6GHz, 17W TDP,
• Trusted Platform Module (option)
• Also available in Type 2 pin-out
unprecedented integrated graphics and multi-display capabilities. It brings quad independent
decoding support graphics- and video-centric applications.
Embedded
Highlights
• Two independent displays supported
• DirectX 11.1, OpenGL 4.2, OpenCL 1.2
Radeon HD 8310E
AMD PRODUCT BADGE GUIDELINES
®
• LVDS/embedded DisplayPort interface
• VGA interface
(For future use)
Radeon
HD 8280E
• AMD GX-210HA dual-core 1.0GHz, 9W TDP,
• MicroSD card socket
• MicroSD card socket
• DisplayPort/HDMI/DVI interface
Radeon HD 8330E
®
• Up to 16GB DDR3 SDRAM, dual-channel
• Two SATA 3Gb/s mass storage interfaces
Radeon HD 8400E
• AMD GX-415GA quad-core 1.5GHz, 15W TDP,
®
• Intel Celeron N3050 dual -core 2.16GHz, 6W TDP • Three independent displays supported
®
Embedded Solutions
Geode
Radeon HD 7500G
Embedded Solutions
Radeon Graphics
53121B
Embedded Solutions
Opteron X
53116B
Embedded Solutions
Opteron A
(For future use)
• Four SATA 3Gb/s mass storage interfaces
• MicroSD card socket, bootable
• Three DisplayPort/HDMI/DVI interfaces
• LVDS/embedded DisplayPort interface
• VGA interface
• Four independent displays supported
• DirectX 11, OpenGL 4.2, OpenCL 1.1
• Resolution up to 4000 x 2000 @ 30 Hz
• Integrated AMD HD 7000G graphics
• Six PCI Express x1 lanes
• Up to 16GB DDR3-1333 SDRAM, dual-channel
• Four USB 3.0 and four USB 2.0 interfaces
29
COM Express™ - Mini
COM Express™ - Accessories
MSC C10M-AL
Intel Atom™/Pentium /Celeron SOC
®
®
®
MSC C6-MB-EV
NEW
Evaluation Motherboard
Type 10
55 x 84
7/14 W
-40... +85 °C
Type 6
The MSC C10M-AL module is based on Intel‘s latest multi-core system-on-chip (SOC) Atom™ generation
170 x 170
that integrates next generation Intel processor core, graphics, memory, and I/O interfaces. The
This evaluation board in the popular Mini-ITX format provides the interface infrastructure for
COM Express Type 6 modules and offers various PC type connectors for external access.
®
rugged design with soldered memory, optional ECC support and extended temperature range
combined with a long-term availability commitment make it perfectly suited for modern IoT solutions.
Highlights
Highlights
• Socket for COM Express™ Type 6 modules
• GbE interface
• PCI Express x16 slot (useable as PEG or x4)
• SD Card slot
• Intel Atom™ E3950 quad-core 1.6/2.0GHz, 12W
• LVDS/embedded DisplayPort interface
• PCI Express Mini Card slot
• HD audio codec
• Intel Atom™ E3940 quad-core 1.6/1.8GHz, 9.5W
• Two independent displays supported
• Four SATA connectors
• Super I/O
• Intel Atom™ E3930 dual -core 1.3/1.8GHz, 6.5W
• DirectX 12, OpenGL 4.3, OpenCL 2.0
• Four USB 3.0 interfaces
• Various additional COM Express™ specific interfaces
• Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W • Two USB 3.0/2.0 and six USB 2.0 interfaces
• Up to four USB 2.0 ports
• Power supply via ATX-style power connector or
• Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W
• Two high-speed UARTs
• Three DisplayPort connectors
• Integrated Intel Gen. 9 HD graphics
• Up to four PCI Express™ x1 lanes
• LVDS and eDP connectors
• Up to 8GB DDR3L SDRAM (ECC option)
• UEFI Firmware
• Two SATA 6Gb/s mass storage interfaces
• Trusted Platform Module (option)
• eMMC option
• Extended temperature variants
®
®
®
®
®
®
®
®
12V-only power jack
• Wide power input range
• DisplayPort/HDMI/DVI interface
MSC C10M-BT / C10M-BTC
MSC C6-MB-EVA
Intel Atom™ / Celeron SOC
Evaluation Motherboard
Type 10
Type 6
®
55 x 84
8 /14 W
-40... +85 °C
®
Based on Intel‘s multi-core system-on-chip (SOC) Atom generation this COM Express Type 10 mod-
305 x 244
This versatile carrier board was designed for evaluation, prototyping and software development.
ule brings dual independent display support, DirectX 11.1 and fast DDR3L memory on a very com-
It provides the interface infrastructure for COM Express Type 6 modules and offers various PC
pact, power saving and cost-efficient COM Express Mini module. The rugged design with soldered
type connectors for external access.
memory, optional ECC support and extended temperature range opens new application areas.
Highlights
Highlights
• Socket for COM Express Type 6 modules in
• LVDS interface
• Intel Atom™ E3845 quad-core 1.91GHz, 10W TDP
• eMMC option
• Intel Atom™ E3827 dual-core 1.75GHz, 8W TDP
• DisplayPort/HDMI/DVI interface
• One PCI Express x4 slot
• HD audio codec; six audio jacks and SPDIF
• Intel Atom™ E3826 dual-core 1.46GHz, 7W TDP
• LVDS/embedded DisplayPort interface
• Four PCI Express x1 slots
• LAN interface
• Intel Atom™ E3825 dual-core 1.33GHz, 6W TDP
• Two independent displays supported
• One PCI Express x16 PEG slot
• mSATA and Mini PCI Express sockets
• Intel Atom™ E3815 single-core 1.46GHz, 5W TDP
• DirectX 11.1, OpenGL 3.2, OpenCL 1.1
• Four SATA connectors
• Various additional COM Express specific interfaces
• Intel Celeron N2930 quad-core 1.83/2.16GHz, 7.5W TDP
• One USB 3.0 and up to seven USB 2.0 interfaces
• Four USB 3.0, four USB 2.0 interfaces
• ATX-style power connector
• Intel Celeron J1900 quad-core 2.00/2.42GHz, 10W TDP
• Trusted Platform Module (option)
• Two DisplayPort/HDMI connectors
• POST code LED display
• Integrated Intel Gen. 7 HD graphics
• Extended temperature variants
• VGA/DVI connector
• ATX form factor
• Up to 8GB DDR3L SDRAM (ECC option)
• Also available with USB client support
®
®
®
®
®
®
®
®
®
®
Basic or Compact form factor
• Embedded DisplayPort connector
• Two SATA 3Gb/s mass storage interfaces
30 | www.msc-technologies.eu
31
COM Express™ - Accessories
170 x 170
COM Express™ - Accessories
MSC C10-MB-EV
MSC C10-SK
Evaluation Motherboard
Starterkits for COM Express
Type 10
Type 10
This evaluation board in the popular Mini-ITX format provides the interface infrastructure for
The COM Express Starterkit for Type 10 modules is available for the whole range of Type 10 mod-
COM Express Type 10 modules and offers various PC type connectors for external access.
ules. The kit contains all necessary products to quickly enable the user to run and evaluate COM
Express Type 10 modules. The kit does not include a COM Express module in order to give the
user greater flexibility as to which particular module variant and CPU core and speed is desired.
Highlights
• Socket for COM Express™ Type 10 modules
• GbE interface
Highlights
• PCI Express x4 slot
• SD Card slot
• COM Express Type 10 Baseboard
• PCI Express Mini Card slot
• HD audio codec
• Two SATA connectors
• Super I/O
• Two USB 3.0 interfaces
• Various additional COM Express™ specific interfaces
• Up to six USB 2.0 ports
• Power supply via ATX-style power connector or
• DisplayPort connectors
• LVDS and eDP connectors
in Mini-ITX format
• Suitable Heatspreader for COM Express
Mini Modules Type 10
• 12V Power Supply with suitable connector
for COM Express baseboard
12V-only power jack
• Getting Started Manual with download links
• Wide power input range
for drivers and BSP
• PCI-Express x4 Slot
• PCI-Express Mini Card Socket and SD Card Socket
• 2x SATA Gen. 3.0 Connectors
• 2x USB 3.0 and 8x USB 2.0 Connectors
• DisplayPort Connector
• Embedded DisplayPort Connector
• LVDS Single-Channel JILI30 Connector
• Audio Codec with 1x3 Jacks and SPDIF In/Out
• Gigabit LAN Connector
• Baseboard Size 170 x 170 mm
COM Express™
Cooling Solutions
MSC C6-SK
Starterkits for COM Express
Type 6
Depending on the computing performance,
MSC has developed various solutions that help
The COM Express Starterkit for Type 6 modules is available for the whole range of Type 6
processor technology and system environ-
the system designer to quickly solve the heat
modules. The kit contains all necessary products to quickly enable the user to run and evaluate
ment, COM Express modules require different
dissipation problems and ensure optimal envi-
COM Express Type 6 modules. The kit does not include a COM Express module in order to give the
cooling measures.
ronmental conditions for the module.
user greater flexibility as to which particular module variant and CPU core and speed is desired.
Highlights
• COM Express™ Type 6 baseboard
• Up to three DisplayPort connectors
• 2x 4GB DDR3L SO-DIMM memory modules
• LVDS and eDP connectors
• Heatsink for safe operation of module
• GbE Interface, SD Card slot
• Type 6 module socket
• HD audio codec, Super I/O
• PCI Express Mini Card slot
• Baseboard size 170 x 170 mm
Heatspreaders
Passive cooling
Active cooling
• Up to four SATA connectors
• Getting Started Manual
Standardized thermal interfaces for easy
Optimized heatsinks for best cooling
Heatsinks combined with a dedicated
• Up to four USB 3.0 interfaces
• Download link for drivers and BSPs
integration in customers' cooling con-
performance even in industrial envi-
speed controlled fan. Off-the-shelf solu-
• Up to four USB 2.0 ports
• Optional display kits with cables
cepts and full interchangeability.
ronments.
tions for demanding ambient conditions.
32 | www.msc-technologies.eu
33
The most popular embedded Computer-On-
The Qseven™ specification has been extended to
The Qseven™ Standard uses the inexpensive
Module standard for entry level performance
include module architectures based on the ARM
MXM-2 connector which provides 230 pin con-
and low power applications with a very attractive
processor which is renowned for its excellent
nections. The connector is robust and proven,
price performance ratio. Qseven is an open stan-
performance to power ratio. Providing differ-
and there are versions available which are certi-
dard of the SGeT Standardization Group. Taking
ent processor architectures and a wide range
fied for automotive use. The edge contacts en-
advantage of the ongoing development in pro-
of modules for commercial and extended tem-
able a low-resistance high-speed contact which
cessor technology towards smaller and more
perature together with matching baseboards,
is usable even for advanced signal speed up to
power efficient CPUs, Qseven has in recent years
the MSC Qseven family leads the way to feature
Gigabit Ethernet, PCI-Express and SATA.
become the most widely adopted new standard
rich and small, low power modular systems.
70 mm
Qseven™ Properties
Qseven™
for small form factor modules.
70 mm
34 | www.msc-technologies.eu
35
Qseven™
Qseven™
MSC Q7-AL
Intel Atom™/Pentium /Celeron SOC
®
®
®
MSC Q7-BT
NEW
Intel® Atom™ E3800 SoC
Qseven™ Rev. 2.1
70 x 70
Qseven™ Rev. 2.0
The new MSC Q7-AL module features Intel's next-generation low-power System-on-Chip (SOC)
for the Internet of Things. The Intel Atom™ Processor E3900 series integrates processor core,
70 x 70
®
7/12 W
-40... +85 °C
graphics, memory, and I/O interfaces into one solution and provides considerably higher graphics
and computing performance compared to its predecessors.
7/12 W
-40 +85 °C
Highlights
The quad-core, dual-core or single-core Atom processor provides outstanding computing and
graphics power and is accompanied by a comprehensive set of peripherals.
• Intel Atom™ E3950 quad-core 1.6/2.0GHz, 12W
• LVDS/embedded DisplayPort interface
• Intel® Atom™ E3845 quad-core 1.91GHz, 10W TDP
• Integrated Intel® Gen. 7 HD Graphics
• Intel® Atom™ E3940 quad-core 1.6/1.8GHz, 9.5W
• Triple Independent Display support
• Intel® Atom™ E3827 dual-core 1.75GHz, 8W TDP
• HDMI up to 1920x1200
• Intel Atom™ E3930 dual-core 1.3/1.8GHz, 6.5W
• DirectX 12, OpenGL 4.3, OpenCL 2.0
• Intel Atom™ E3826 dual -core 1.46GHz, 7W TDP
• DisplayPort 1.1a up to 2560x1600
• Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W
• Up to 4x PCI Express x1 Gen. 2
• Intel Atom™ E3825 dual -core 1.33GHz, 6W TDP
• Dual-Channel LVDS 24 or 18 bit up to 1920x1200
• Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W
• Up to 3x USB 3.0 Host interfaces
• Intel Atom™ E3815 single-core 1.46GHz, 5W TDP
• 3x PCI Express x1 Gen. 2.0 ports, GbE LAN
• Integrated Intel Gen. 9 HD graphics
• Up to 8x USB 2.0 Host interfaces
• Up to 8GB DDR3L SDRAM (opt. ECC)
• USB 3.0 Host, optional USB 3.0 Device
• Up to 8GB DDR3L SDRAM (ECC option)
• 1x USB 2.0 Host/Device support
• Up to 64GB SATA Flash Disk (optional)
• Up to 6x USB 2.0 Host, optional USB 2.0 Device
• Up to 64GB eMMC Flash (optional)
• Trusted Platform Module (optional)
• Up to 32GB eMMC Flash (optional)
• UART, LPC, I2S Audio, SPI, I2C, SMBus, SDIO, TPM
• Two SATA-III interfaces (6Gbps)
• Qseven Rev. 2.1 compliant
• 2x SATA interfaces (1 used for opt. Flash Disk)
• DisplayPort/HDMI/DVI interface
• UEFI Firmware
®
®
®
®
®
®
®
®
®
MSC Q7-BW
MSC Q7-IMX6PLUS
Intel Atom™ / Pentium / Celeron SOC
NXP™ i.MX6 ARM® Cortex™ -A9 SoC
Qseven™ Rev. 2.0
Qseven™ Rev. 2.0
®
6/9 W
System-On-Chip (SOC) Atom E3800 generation based on Intel’s 22nm processor technology.
Highlights
®
70 x 70
The MSC Q7-BT module is based on the Qseven Rev. 2.0 standard and uses Intel‘s multi-core
®
®
The MSC Q7-BW module is based on Intel‘s next generation Atom™ processors in 14nm
technology. These multi-core systems-on-chip provide outstanding computing and graphics
power and are more power efficient compared to their predecessors. The new module brings
triple independent display support, DirectX 11.1, fast DDR3L memory and USB 3.0 on a compact,
70 x 70
4/6 W
-40 +85 °C
The MSC Q7-IMX6PLUS module provides the NXP™ i.MX6 ARM Cortex-A9 CPU (quad, dual, dual-lite or single core) as well as the new i.MX 6QuadPlus and 6DualPlus Processors with up to
1.2 GHz, up to 4GB DDR3 DRAM and up to 64GB eMMC Flash memory as well as an extensive
set of interface controllers.
power saving and cost-efficient module.
Highlights
• NXP™ i.MX6 ARM® Cortex™-A9
Highlights
• HDMI/DVI up to 1920 x 1200 @30Hz
• Intel Pentium N3710 quad-core 2.56GHz, 6W TDP
• HDMI/DVI interface up to 3840x2160
• Intel Celeron N3160 quad-core 2.24GHz, 6W TDP
• DisplayPort 1.1a up to 3840x2160
• Supports i.MX 6QuadPlus, i.MX 6DualPlus
• Triple independent display support
• Intel Celeron N3060 dual-core 2.48GHz, 6W TDP
• Dual-Channel LVDS 24 or 18 bit up to 1920x1200
• “Triple-Play“ Graphics and Video Subsystem
• SATA-II (3Gbps, quad-/dual-core only)
• Intel Celeron N3010 dual-core 2.24GHz, 4W TDP
• DirectX 11.1, OpenGL 4.2, OpenCL 1.2
• Up to 4GB DDR3L SDRAM
• USB Host / Device + up to 4x USB 2.0
• Intel Atom™ x5-E8000 quad-core 2.0GHz, 5W TDP
• Triple Independent Display support
• Up to 64GB eMMC or 4GB NAND Flash
• MMC / SD / SDIO Interface
• Integrated Intel Gen. 8 HD Graphics
• 3x PCIe x1, GbE, SATA-III, UART, LPC, SPI, I2C, SMBus
• Gigabit Ethernet
• CAN Interface, I2S Audio
• Up to 8GB DDR3L SDRAM (dual-channel)
• USB 3.0, opt. USB 3.0 Device
• PCI Express x1 port
• MIPI CSI-2 Camera Interface
• Up to 64GB SATA Flash Disk (optional)
• Up to 7x USB 2.0, opt. USB 2.0 Device
®
®
®
®
®
®
®
®
®
®
quad-, dual-, dual-lite or single-core CPU
• Dual-Channel LVDS 18/24 bit up to 1920 x 1200
• Up to 64GB eMMC Flash (optional)
36 | www.msc-technologies.eu
37
Qseven™ - Accessories
Qseven™ - Accessories
MSC Q7-MB-EP5
MSC Q7-MB-EP6
Embedded Platform Qseven™ Rev. 2.0
Embedded Platform Qseven™ Rev. 2.0
The new Qseven™ Rev. 2.0 embedded platform MSC Q7-MB-EP5 offers a variety of interfaces
148 x 102
-40... +85 °C
148 x 102
The Qseven™ Rev. 2.0 Embedded Platform MSC Q7-MB-EP6 offers a variety of embedded
commonly used in embedded applications such as Gigabit LAN, USB 3.0, USB 2.0, RS232/485
interfaces such as dual Gigabit LAN, USB 3.0, USB 2.0, RS232/485 and CAN as well as HDMI,
and CAN as well as DisplayPort and LVDS display interfaces. By design the EP5 was optimized
DisplayPort and LVDS display interfaces. In addition a mini PCI Express™, an mSATA and an SD
for low production cost and simple customization. MSC is offering to produce any customized
Card socket are supported. Module slot on bottom side.
variant of the MSC Q7-MB-EP5 for medium to high volume.
Highlights
• HDMI and DisplayPort connectors for direct
Highlights
• Low-cost application board for any Qseven
• RS-232, RS-485 or opt. CAN
output of TMDS signals from Qseven module
• USB 3.0 host connector
• 2x USB 2.0 host connector
• Dual-channel LVDS on JILI30 connector
• Dual Gigabit Ethernet
• 1x USB 2.0 on pin header
• Dual Gigabit Ethernet
• Backlight power 3.3V, 5V or 12V
• Mini PCI Express card slot
• 1x microUSB 2.0 OTG connector
• Up to 2x SATA-II connectors
• Adjustable Backlight intensity
• MMC/SD card and mSATA card sockets
• LVDS / eDP via Jili30 connector
• Mini PCI Express Card
• WLAN / Bluetooth / NFC with antenna (option)
• 1x SATA connector
• Backlight interface 3.3 / 5 / 12VDC
• mSATA Card socket
• 4-wire touch controller (option)
• RS-232 on DB9 connector
• SPI / I2C / SMBus, CAN bus, I2S audio
• MMC/SD Card slot
• I2S or HD Audio codec (option)
• RS-485 and RS-232 on pin header
• Wide input range from 10 - 28VDC
• 1x USB 3.0, up to 3x USB 2.0 connectors
• SPI / I2C / GPIO on Feature Connector
• LPC / GPIO on pin header
• 1x USB 2.0 Host/Client on µUSB connector
• Input voltage up to 36V
• DisplayPort connector for output of graphics
• Industrial temperature versions available
computer module (x86 and ARM based)
signals from Qseven module
MSC Q7-MB-EP4
Embedded Platform DDI
QSeven Slot
Note: can also be used as PCAP Touch I/F
MicroAB
Host/Client
4-Wire Res. USB
Touch Controller
Microchip AR1100
4-Wire Touch
USB1
USB2
5 Pin Header
USB0
USB3
Single USB 2.0 Type A
USB5
Single USB 2.0 Type A
Micro SIM
card slot
SATA Conn
Intel® mSATA Card Socket
SATA 0
Feature
Connector 2
20 Pin Header
4 Pin JST Conn
4 Pin JST Conn
Feature
Connector 1
20 Pin Header
POWER IN
38 | www.msc-technologies.eu
USB4
PCIe 0
WLAN Module
H&D Wireless
SPB209A
SDIO
UART
RS232
Driver
RS485
Driver
CAN
Driver
PCI Mini Card Socket
PCI 1
LAN Controller
PCIe intel® I210
Q7 Eth
LVDS/eDP
CAN
3.3V and 5V
Regulator
Other
Regulator
The Qseven™ Rev. 1.2 Embedded Platform MSC Q7-MB-EP4 offers many interfaces often used
in embedded applications such as dual Gigabit LAN, USB 2.0, RS232, CAN and LVDS as well as
DVI/HDMI. In addition a mini PCI Express™ and an mSATA slot as well as an SD-Card socket are
supported. Module slot on bottom side.
HDMI/DP
Power
Highlights
• One DVI port up to 1920 x 1080 for Qseven
Gbit LAN RJ45
Analog/PWM
3.3V/5V/12V
Opto
Coupler
Gbit LAN RJ45
Backlight
LVDS JILI 30
HDMI-DP
Converter
DisplayPort
SPI, I2C, GPIO
12V
Regulator
148 x 102
SATA 1
uSD / SD Card Socket
System Signals
Single USB 3.0
Type A
USB6/7
modules with SDVO
• One CAN interface
• Six USB 2.0 interfaces, four external
• Dual Gigabit Ethernet
• Touch screen controller on board
• Mini PCI Express slot
• LVDS display connection via Jili30
• MMC/SD Card socket
• Backlight interface 3.3 / 5 / 12VDC
• Two SATA onboard connectors
• Size 148 x 102 mm
• One RS-232 onboard pin header
• Wide input range from 10 - 28VDC
I25 Codec
Audio
Audio Header
HDA Codec
39
Qseven™ - Accessories
435 x 170
Qseven™ - Accessories
MSC Q7-MB-RP3
MSC Q7-SK-IMX6-EP4
Reference Platform Qseven™ 2.0
Starterkit for ARM-based Qseven™ 2.0 Modules
The MSC Q7-MB-RP3 is the third generation reference platform provided to test and qualify
The MSC Q7-SK-IMX6-EP4 Starterkit is based on the 3.5" carrier board MSC Q7-MB-EP4 and
Qseven™ Rev. 2.0 modules for compatibility with the specification. It offers a large variety of
contains all necessary products to quickly enable the user to run and evaluate the Qseven™
interfaces commonly used in industrial applications. It is a key instrument to shorten design
range of ARM-based modules. The kit does not contain a Qseven module allowing the user to
cycles and to improve time to market of new Qseven™ based systems.
select the most suitable one from MSC’s wide offerings.
Highlights
Highlights
• One PCI Express™ x16 slot and 3 x1 slots
• EXAR X28V384 Super I/O
• Two graphic card slots for
• 7x COM, HW monitor
HDMI / DP / eDP / LVDS
• CAN Transceiver
• Mini PCI Express™ & mSATA slot
• HD audio codec
• SD Card socket and SIM Card slot
• USB 3.0, 4x USB 2.0 Host and USB 2.0 Client interfaces
• Two SATA onboard connectors
• 3.5" Qseven carrier board with socket for
Qseven module
• Heatspreader with heatsink for all module
variants of the Q7-IMX6PLUS module family
• 12V power supply and cable kit included for
immediate operation of the Starter Kit
• Winbond W83627DHG Super I/O
• Resource USB Flash stick with drivers,
manuals etc.
• DVI/HDMI graphics output
• LVDS graphics output on standard 30-pin connector;
backlight connector includes adjustable backlight
voltage and dimming
• 2x Ethernet (10/100/1000 LAN) connector
• SATA connector
• 4x USB 2.0, 1x microUSB OTG
• UART/RS-232 on pin header
• MMC/SD-Card socket, mSATA slot
• I2C, CAN connectors
• Optional 7" WVGA (800 x 480) and 12.1" XGA
MSC Q7-SK-AL-EP6
MSC Q7-SK-BT-EP6
(1024x768) TFT kit
Starterkits for x86-based Qseven™ 2.0 Modules
The MSC SK-AL-EP6 is the new Starterkit for Qseven™ modules based on the Intel E3900
Qseven™
Cooling Solutions
"Apollo Lake" processor family. The MSC SK-BT-EP6 is the Starterkit suitable for Qseven™ modules based on the Intel E3800 “BayTrail" and the N3000 “Braswell” processors. Both kits are
For all its Qseven modules, MSC is offering tai-
MSC is providing a heatspreader for each Qseven
based on the 3.5" Qseven 2.0 carrier board MSC Q7-MB-EP6 and contain all necessary products
lored cooling solutions which perfectly fit the
module, and a single-piece heatsink for the high-
to quickly enable the user to run and evaluate the Qseven module range.
geometry of the COM product.
er-performance modules.
Heatspreaders
Heatsinks
• MiniPCIexpresss and mSATA slots
A heatspreader offers a blank surface allowing to
A heatsink is shaped like the heatspreader,
• Optional 7" WVGA (800 x 480) and 12.1" XGA
mount a cooling device or to contact the metal
but shows cooling fins on the upper side so
housing of a system, while the underside provides
as to maximize the surface used to dissipate
contact areas for the heat generating parts of the
heat into the surrounding air.
Highlights
• 3.5" Qseven carrier board with socket
for Qseven 2.0 module
• Heatspreader with heatsink for all module
variants of the respective Qseven family
• 12V power supply and cable kit included for
immediate operation of the Starter Kit
• Resource USB Flash stick with drivers, manuals etc.
• DP graphics output
• LVDS graphics output on standard 30-pin connector; backlight connector includes adjust-
• 2x Ethernet (10/100/1000 LAN) connector
• SATA connector
• USB 3.0, 3x USB 2.0, 1x microUSB OTG
• 2x UART
• SD-Card socket
(1024x768) TFT kit
module’s geometry.
able backlight voltage and dimming
40 | www.msc-technologies.eu
41
SMARC™ 2.0 Properties
The SMARC™ 2.0 Standard uses the inexpensive MXM-3 connector which provides 314 pin connections. The connector is robust
and proven, and there are versions available which are certified for automotive use. The edge contacts enable a low-resistance
high-speed contact which is usable even for advanced signal speed up to Gigabit Ethernet, PCI-Express and SATA. The Standard
SMARC™ 2.0
alternatively can be used for embedded Dis-
standard (Smart Mobility ARChitecture) has
playPort (eDP) or for DSI, two Gigabit Ethernet
every ingredient to become the best and most
ports are now supported, Audio has indepen-
future-proof standard for small form-factor
dent HDA and I2S ports and up to 4 UARTs are
embedded modules. With 314 pins available
available. In addition to SPI, also eSPI is sup-
on its inexpensive and robust MXM3 connec-
ported for attachment of peripheral devices
tor, SMARC has ample space for proven and
on the baseboard or the application hardware.
popular interfaces. In the new standard revi-
And still there are a lot of reserved pins left for
sion, PCIe now features 4 lanes instead of 3,
future upgrades. Never again has it been so
USB now covers up to 2x USB 3.0 and up to
easy and natural to use ARM-based and x86-
6x USB 2.0 interfaces, LVDS now supports two
based computer modules on a modern and up-
independent dual-channel connections which
to-date module standard.
80 mm
The recent revision 2.0 of the SMARC module
50 mm
defines two Module sizes: 82mm x 50mm (short size) and 82mm x 80mm (full size).
82 mm
82 mm
42 | www.msc-technologies.eu
43
SMARC™ 2.0
SMARC™ 2.0
MSC SM2F-AL
Intel Atom™/Pentium /Celeron SOC
®
®
®
MSC SM2S-IMX6
NEW
SMARC™ 2.0
SMARC™ 2.0
82 x 80
7/14 W
-40... +85 °C
The MSC SM2F-AL module is based on Intel‘s multi-core system-on-chip (SOC) Atom™ generation that
integrates next generation Intel processor core, graphics, memory, and I/O interfaces into one
®
solution. Fast DDR3-1866 memory, eMMC, SATA Flash, USB 3.0 and a on-board Wireless Module are
82 x 50
4/6 W
-40... +85 °C
integrated on this SMARC 2.0 Full Size module.
Highlights
The MSC SM2S-IMX6 module is fully compliant with the new SMARC™ 2.0 standard and is
based on NXP's i.MX6 CPUs offering quad-, dual- and single-core ARM Cortex-A9 compute
performance at very low power consumption and excellent graphics performance combined
with a high dregree of functional integration.
Highlights
• Intel Atom™ E3950 quad-core 1.6/2.0GHz, 12W
• DisplayPort++ / HDMI interface
• Intel Atom™ E3940 quad-core 1.6/1.8GHz, 9.5W
• LVDS / embedded DisplayPort interface
• Intel Atom™ E3930 dual-core 1.3/1.8GHz, 6.5W
• Triple Independent Display support
• Supports i.MX 6QuadPlus, i.MX 6DualPlus
• 1x SATA-II (3Gbps, quad-/dual-core only)
• Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W
• DirectX 12, OpenGL 4.3, OpenCL 2.0
• MPEG-4 Video En-/Decoding 1080p,
• 1x USB Device/Host + up to 5x USB 2.0 Host
• Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W
• Dual MIPI CSI-2 Camera Interface
• HDMI graphics 1920x1080x30fps,
• 1x MMC / SD / SDIO interface
• Integrated Intel Gen. 9 HD graphics
• Up to 4x PCI Express x1 Gen. 2
• dual-channel LVDS 1920x1080x30fps
• 2x CAN interface
• Up to 8GB DDR3L SDRAM (ECC option)
• 2x USB 3.0 Host, 5x USB 2.0 Host interfaces
• Up to 4GB DDR3L DRAM
• I2S Audio interface
• Up to 64GB eMMC Flash (optional)
• 1x USB 2.0 Host/Device interface
• Up to 64GB eMMC Flash memory
• MIPI CSI-2 camera interface
• Up to 64GB SATA NAND Drive (optional)
• Gigabit Ethernet, Wireless Module (optional)
• SATA-III interface (6Gbps)
• Trusted Platform Module (optional)
®
®
®
®
®
®
®
®
MSC SM2S-AL
Intel Atom™/Pentium /Celeron SOC
®
®
®
• NXP™ i.MX6 ARM® Cortex™-A9 quad-, dual-,
dual-lite or single-core CPU
• 10/100/1000 GbE LAN interface
• 1x PCI Express x1
MSC SM2-MB-EP1
NEW
SMARC™ 2.0
SMARC™ 2.0
82 x 50
The MSC SM2S-AL module is based on Intel‘s multi-core system-on-chip (SOC) Atom™ generation
7/14 W
that integrates next generation Intel processor core, graphics, memory, and I/O interfaces into
®
one solution. Fast LPDDR4 memory, eMMC and USB 3.0 are integrated on this SMARC 2.0 Short
-40... +85 °C
170 x 170
2W
-40...+85 °C
Size module.
Highlights
The SMARC™ 2.0 Embedded Platform MSC SM2-MB-EP1 offers many embedded interfaces
such as dual Gigabit LAN, USB 3.0, USB 2.0, SATA, UART/RS232 and CAN as well as DVI/HDMI,
embedded DisplayPort and LVDS display interfaces. In addition a PCI Express™ socket and an
SD Card socket are supported.
Highlights
• Intel Atom™ E3950 quad-core 1.6/2.0GHz, 12W
• DisplayPort++ interface
• Socket for SMARC™ 2.0 modules
• SATA connector
• Intel Atom™ E3940 quad-core 1.6/1.8GHz, 9.5W
• LVDS / embedded DisplayPort interface
• PCI Express x4 slot
• Two GbE interfaces
• Intel Atom™ E3930 dual-core 1.3/1.8GHz, 6.5W
• Triple Independent Display support
• SD Card slot
• Two CAN interfaces
• Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W
• DirectX 12, OpenGL 4.3, OpenCL 2.0
• Mini-PCI-Express Card slot
• I2S audio and HD audio codec
• Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W
• Dual MIPI CSI-2 Camera Interface
• Two USB 3.0 interfaces
• Two UART interfaces
• Integrated Intel Gen. 9 HD graphics
• Up to 4x PCI Express x1 Gen. 2
• USB 2.0 OTG, two USB 2.0 Host
• Various additional SMARC™ specific interfaces
• Up to 8GB LPDDR4 SDRAM
• 2x USB 3.0 Host, 5x USB 2.0 Host interfaces
• DVI/HDMI and DisplayPort connectors
• Power supply via ATX-style power connector
• Up to 64GB eMMC Flash (optional)
• 1x USB 2.0 Host/Device interface
• LVDS and eDP connectors
• Power jack for 12-24V input voltage
• SATA-III interface (6Gbps)
• Gigabit Ethernet
®
®
®
®
®
®
®
®
• Trusted Platform Module (optional)
44 | www.msc-technologies.eu
45
SMARC™ 2.0 - Accessories
SMARC™ 2.0 - Accessories
SMARC™ 2.0
Cooling Solutions
MSC SM2F-SK-AL-EP1
MSC SM2S-SK-AL-EP1
Starterkits for x86-based SMARC™ 2.0 Modules
For all its SMARC modules, MSC is offering tai-
MSC is providing a heatspreader for each SMARC
The SMARC 2.0 Starter Kits for SMARC modules with the Intel E3900 “Apollo Lake” processors are
lored cooling solutions which perfectly fit the
module, and a single-piece heatsink for the high-
based on a Mini-ITX SMARC 2.0 carrier board MSC SM2-MB-EP1 and contain all necessary products to
geometry of the COM product.
er-performance modules.
®
quickly enable the user to run and evaluate the SM2F-AL and SM2S-AL module families, respectively.
The kits do not contain a SMARC 2.0 module allowing the user to select the most suitable one from
MSC’s offerings.
Heatspreaders Full and Short Size
Highlights
• SMARC 2.0 carrier board in Mini-ITX format with
socket for SMARC 2.0 modules
• Heatspreader suitable for all module variants of
the SM2F-AL or SM2S-AL module families
• 12V power supply and cable kit included for
immediate operation of the Starterkit
• Bootable Linux installation in Flash, ready-to-run
• DVI/HDMI graphics output
• DisplayPort Connector
• LVDS graphics output on standard 30-pin connector;
backlight connector includes adjustable backlight
voltage and dimming
• Ethernet (10/100/1000 LAN) connector
• SATA, 4x USB 2.0 Host, USB Host/Client,
UART, SD-Card socket
• Optional TFT Kits available
A heatspreader offers a blank surface allowing to
mount a cooling device or to contact the metal
housing of a system, while the underside provides
contact areas for the heat generating parts of the
MSC SM2-SK-IMX6-EP1
module’s geometry.
Starterkit for ARM-based SMARC™ 2.0 Modules
Heatsinks Full and Short Size
The SMARC 2.0 Starter Kit for SMARC modules with the NXP™ i.MX6 processors is based on a
Mini-ITX SMARC 2.0 carrier board MSC SM2-MB-EP1 and contains all necessary products to quickly enable the user to run and evaluate the SM2S-IMX6 module range. The kit does not contain a
SMARC 2.0 module allowing the user to select the most suitable one from MSC’s offerings.
Highlights
• SMARC 2.0 carrier board in Mini-ITX format with
socket for SMARC 2.0 modules
• Heatspreader suitable for all variants of the
SM2S-IMX6 module family
• 12V power supply and cable kit included for
immediate operation of the Starterkit
• Bootable Linux installation in Flash, ready-to-run
• LVDS graphics output on standard 30-pin connector;
backlight connector includes adjustable backlight voltage
and dimming
• Ethernet (10/100/1000 LAN) connector
A heatsink is shaped like the heatspreader,
• SATA, 4x USB 2.0 Host, USB Host/Client, UART, SD-
but shows cooling fins on the upper side so
Card socket
• Optional TFT Kits available
as to maximize the surface used to dissipate
heat into the surrounding air.
• DVI/HDMI graphics output
46 | www.msc-technologies.eu
47
Module PCB
Depending of socket used
Carrier PCB
1.20±0.1
max. 6.00, typ. 3.01.20
(depending on module) 0±0.1
max. 2.501.20±0.1
®
nanoRISC® Properties
The nanoRISC module standard has been created
nanoRISC modules can be used as a processing
The nanoRISC® Standard uses a compact module
for applications requiring a small form factor and
“supercomponent”, while users only need to add
size of 70mm x 50mm. The module PCBs have
lowest power consumption.
application-specific periphery. The 230-pin MXM
230 edge fingers that mate with a low profile 230
connector used as interface to the baseboard is
pin 0.5mm pitch connector called MXM-2 which
The nanoRISC modules simplify the design of
inexpensive but robust and proven. A variety of
is available in abundance, rugged and proven.
embedded systems by providing a processor
easy-to-use interfaces are available. All popular
core with an extensive set of interfaces on a
embedded interfaces are included, and addi-
small form factor board. Boot loader and adap-
tional interfaces can be provided by adding
tations for popular Operating Systems will be
suitable controllers on the baseboard and con-
provided by MSC so that design times will be
necting them to the processor bus available on
shortened dramatically.
the MXM connector.
48 | www.msc-technologies.eu
®
50 mm
nanoRISC®
70 mm
49
nanoRISC®
70 x 50
2.5 /4.5 W
-40 +85 °C
nanoRISC®
MSC NANORISC-IMX6
MSC NANORISC-MB2
NXP™ i.MX6 ARM MPU
Embedded Platform
The MSC NANORISC-IMX6 module is based on the NXP™ Cortex™-A9 processor i.MX6x which is
available as quad-core, dual-core and single-core CPU. On the module it is combined with up to
4GB DDR3 SDRAM, up to 4GB SLC NAND Flash, optionally up to 64GB eMMC Flash and Gigabit
and SPI. In addition touch controllers for projected capacitive touches and for resistive touches are
Highlights
Highlights
• Graphics Interfaces: HDMI/DVI, LVDS, RGB up to
1920 x 1080, dual independent display support
• Socket for nanoRISC compatible modules
• ITU656 video input interface on ext. connector
• LCD panel interfaces with RGB TTL output
• 2x COM ports on 9pin Sub-D connector
• Up to 4GByte DDR3 SDRAM soldered
• Video decoder and scaler
• Backlight power 8..20VDC
• I2S audio codec with standard audio connectors
• Up to 4GByte SLC NAND Flash soldered
• CAN 2.0B, 3x UART, 2x SPI, 2x I²C
• Graphics extension connector for optional
• SD Card socket
• Up to 64Gbyte eMMC Flash
• I²S audio interface
• Gigabit Ethernet interface
• SD V3.0 / SDIO V2.0 / MMC V4.3
• 2x 10/100 Base-T Ethernet interface or GbE
• USB 2.0 Host
• Parallel bus interface
• 2x USB Host, USB OTG Host/Client port
• Battery charger support (Lithium cell)
• USB 2.0 OTG Host/Client High Speed
• Camera interface ITU656 / CSI
• Touch Screen support (capacitive + resistive)
• 8..20V power supply input
graphics modules (LVDS, HDMI)
• PCIe, SATA, CAN, Local Bus, SPI, I2S
on extension pad field
MSC NANORISC- AM335X
MSC NANORISC-SK
Texas Instruments AM335X
Evaluation and Development Kit
The MSC NANORISC-AM335X module is based on the Texas Instruments® Cortex™-A8 processor
The MSC NANORISC-SK is a complete, ready-to-run Starterkit for MSC’s range of nanoRISC
AM335x family which ranges from 300 to 800MHz. On the module it is combined with up to
processor modules. It consists of the nanoRISC Embedded Platform board MB2, a 7-inch WVGA
512MB DDR3 SDRAM, up to 512MB SLC NAND Flash, optionally up to 64GB eMMC Flash and
display with capacitive touch and a suitable power supply.
®
-40 +85 °C
RGB 18/24 Bit and extension connectors for graphics, SATA, PCIe, CAN (CPU I/O), Local Bus, I²C
provided. An SD Card socket is supported.
clocked up to 1.2GHz
2.0 W
-40 +85 °C
The Evaluation Platform MSC NANORISC MB2 offers dual LAN, USB, UARTs, audio and graphics
Ethernet LAN.
• NXP™ i.MX6 Cortex™-A9, 1/2/4 core(s) CPU
70 x 50
160 x 110
10/100 Ethernet LAN, optionally second LAN or GbE LAN.
Highlights
• Evaluation and Development Kit for all
Highlights
• Texas Instruments Cortex™-A8 CPU AM335x
clocked up to 800MHz
• CAN 2.0B, 3x UART, 2x SPI, 2x I²C
• I²S audio interface
nanoRISC modules
®
• Includes 7" LCD panel 800 x 480 pixels with
• nanoRISC CPU module not contained
- please order separately
• Complete range of usable interfaces
• Up to 512MB DDR3 SDRAM soldered
• SD V2.0 / SDIO V1.0 / MMC V4.2
• Up to 512MB SLC NAND Flash soldered
• Optional SGX530 graphics acceleration
• Power supply included
• 1 or 2 USB Host Port (dep. on module)
• Up to 64GB eMMC Flash soldered
• Optional industrial (Realtime) Ethernet
• Integrated Debug Adapter on-board
• USB OTG Port (dep. on module)
• 10/100 Base-T Ethernet Interface
• Commercial and extended commercial
• SD Card with pre-installed Linux or Android
• CAN Bus, 2x COM Ports on 9-pin Sub-D
• Optional 2nd 10/100 LAN or GbE
• USB 2.0 HS Host, USB 2.0 HS OTG
• RGB 16/18/24 bit up to 1366 x 768
50 | www.msc-technologies.eu
temperature range
• Support for Linux
all required interface cables
Operating System to be ordered with CPU
module of choice
• GbE or 2x 10/100 Base-T (dep. on module)
• I2S or AC97 audio codec with standard
audio connectors
(Android, Windows EC7 on demand)
51
Engineering Leadership
HEADQUARTERS
STUTENSEE
HEADQUARTERS
FREIBURG
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79111 Freiburg im Breisgau
Phone +49 7249 910 0
Phone +49 761 8819 0
Fax
Fax
+49 7249 799 3
info@msc-technologies.eu
www.msc-technologies.eu
+49 761 8819 849
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www.avnet.com
Phone +90 216 411 2333
www.avnet-embedded.eu
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Phone +45 3678 6250
Phone +39 02 660 92 1
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Phone +358 20 749 9 260
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finland@avnet-embedded.eu
sales@avnet.co.za
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Phone +33 1 64 47 29 29
Phone +46 8 587 46 400
paris@avnet-embedded.eu
sweden@avnet-embedded.eu
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Phone +44 1628 518 900
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avnet-newzealand@avnet.com
© MSC Technologies. All rights reserved. Although great care has been taken in preparing this printed matter, MSC can not be held responsible for any errors or omissions.
All information in here is subject to change without notice. All hardware and software names used are trade names and/or trademarks of the respective manufacturer.
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