Analog Socket Modem
AL4200S Designers Guide
Analog Socket Modem
AL4200S, AL4200S-3V Series
Designer’s Guide
Version 105
Released 14. Dezember 2007
No. AL4200S-E00-105
xmodus swiss GmbH
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AL4200S Designer’s Guide
Information provided by xmodus swiss GmbH is believed to be accurate and reliable.
However, no responsibility is assumed by xmodus swiss for its use, nor any
infringement of patents or other rights of third parties which may result from its use.
No license is granted by implication or otherwise under any patent rights of xmodus
swiss other than for circuitry embodied in xmodus products. Xmodus swiss reserves
the right to change circuitry at any time without notice. This document is subject to
change without notice.
Product names or services listed in this publication are for identification purposes
only, and may be trademarks or registered trademarks of their respective companies.
All other marks mentioned herein are the property of their respective owners.
© 2007 xmodus swiss GmbH
Printed in Switzerland
All Rights Reserved
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AL4200S Designer’s Guide
Table of Contents
1.
INTRODUCTION ..........................................................................................................5
1.1 Overview.......................................................................................................................5
1.2 Product Options............................................................................................................5
1.3 General Modem Features.............................................................................................6
1.4 Applications ..................................................................................................................6
2.
TECHNICAL OVERVIEW.............................................................................................7
2.1 General Description......................................................................................................7
2.2 Operating Modes ..........................................................................................................7
2.3 Worldwide Operation ....................................................................................................7
2.3 TAM Mode ....................................................................................................................8
2.4 Voice / Speakerphone Mode ........................................................................................8
2.5 Audio Codec Features..................................................................................................8
2.6 Commands ...................................................................................................................9
2.6 Supported Interfaces ..................................................................................................10
2.6.1 Serial Interface: ......................................................................................................10
2.6.2 Speaker Interface: ..................................................................................................10
2.6.3 World Class Line Interface: ....................................................................................10
2.7 Command Set and S-Registers..................................................................................10
3.
HARDWARE INTERFACE .........................................................................................11
3.1 Modem Hardware Pins and Signals ...........................................................................11
3.1.1
Phone Line Interface...........................................................................................11
3.1.2
Call Progress Speaker Interface.........................................................................11
3.1.3
Serial DTE Interface and Indicator Outputs ........................................................11
3.1.4
External Reset Input ...........................................................................................11
3.2 Modem Pin Assignments and Signal Definitions ........................................................11
3.3 Firmware ROM ...........................................................................................................18
3.4 DAA Interface .............................................................................................................18
3.5 Call Progress Speaker Interface.................................................................................19
3.6 Audio Interface ...........................................................................................................20
3.6.1 Analog Audio Input Channels .................................................................................20
3.6.2 Analog Audio Output Channels ..............................................................................20
3.7 Reset Interface ...........................................................................................................21
3.7.1 Recommended Reset Circuit..................................................................................21
4.
DESIGN CONSIDERATIONS ....................................................................................22
4.1 PC Board Layout Guidelines ......................................................................................22
4.1.1 General ...................................................................................................................22
4.1.2 Electromagnetic Interference (EMI) Considerations ...............................................23
4.2 Other Considerations..................................................................................................24
4.3 Manufacturing Considerations....................................................................................24
5.
PACKAGE DIMENSIONS ..........................................................................................25
6.
SOCKET MODEM APPROVALS ...............................................................................26
6.1 Considerations for Telecom Approvals.......................................................................26
6.1.1 PSTN Connection...................................................................................................26
6.2 Considerations for Electrical Safety............................................................................26
6.2.1 Conditions for Maintaining Safety Compliance (European Countries)....................26
6.2.2 Power Supply [EN60950-1:2001, 1.6] ....................................................................27
6.2.3 Clearances, Creepage Distances [EN60950-1:2001, 2.10.3 and 2.10.4]...............27
6.3 Considerations for EMC .............................................................................................28
6.3.2 Installation in Host Systems (European Countries) ...............................................29
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List of Figures
FIGURE 2-1. TYPICAL SERIAL BLOCK DIAGRAM ............................................................. 10
FIGURE 3-1. SERIAL TTL PINOUT ................................................................................ 12
FIGURE 3-3. RECOMMENDED 2-WIRE TELEPHONE LINE INTERFACE ............................... 18
FIGURE 3-4. RECOMMENDED 4-WIRE TELEPHONE LINE INTERFACE ................................. 18
FIGURE 3-5. SOUNDUCER DRIVER CIRCUIT .................................................................. 19
FIGURE 3-6. SPEAKER DRIVER CIRCUIT ........................................................................ 19
FIGURE 3-7. SINGLE-ENDED HANDSET RECOMMENDED CIRCUIT. ................................... 20
FIGURE 3-8. DIFFERENTIAL SPEAKER/MICROPHONE RECOMMENDED CIRCUIT. ................ 20
FIGURE 5-1. AL4200S SOCKET MODEM PHYSICAL DIMENSIONS .................................... 25
List of Tables
TABLE 3-1. SERIAL TTL SIGNALS ................................................................................. 12
TABLE 3-2. SIGNAL DESCRIPTIONS ............................................................................... 13
TABLE 3-3. SIGNAL DESCRIPTIONS ............................................................................... 14
TABLE 3-4. DIGITAL ELECTRICAL CHARACTERISTICS ...................................................... 15
TABLE 3-5. ANALOG ELECTRICAL CHARACTERISTICS ..................................................... 16
TABLE 3-5. ANALOG ELECTRICAL CHARACTERISTICS ..................................................... 17
TABLE 3-6. ABSOLUTE MAXIMUM RATINGS.................................................................... 17
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1.
INTRODUCTION
1.1
Overview
The xmodus AL4200S Socket Modem Family provides the OEM with a complete
V.90, V.34 and V.32 bis data/fax/voice/speakerphone modem in a compact socketmountable module.
The compact size and high level of integration of the Socket Modem minimizes real
estate and cost for motherboard and box modem applications. Its low power
consumption makes it ideal for many applications such as embedded control
systems, POS terminals, remote diagnostics, data collection, remote maintenance,
web-enabled devices and other embedded applications. The pin compatibility
between the full range of Analog, ISDN and GSM Socket Modems allows upgrading
and production configurability without hardware changes.
This designer's guide describes the modem hardware. AT commands and S registers
are defined in the AT Command Reference Manual.
As a data modem, the AL4200S Socket Modems can receive data at speeds up to
56kbps and can send data at speeds up to 33.6 kbps. Error correction (V.42 / MNP 24) and data compression (V.44, V.42bis, MNP 5) maximize data transfer integrity and
boost average throughput up to 115.2 kbps. Non-error-correcting mode is also
supported.
PSTN as well as Leased-Line copper wire is supported as the transmit medium.
As a fax modem, the AL4200S Socket Modems supports Group 3 send and receive
rates up to 14.4 kbps (G3-Fax) and supports Class 1, Class 2 and 2.0 protocols.
The voice features uses voice coding with 8-bit linear A-law / u-law, 16-bit, ADPCM
and G.729 to support efficient digital storage of voice / audio samples using
compression and decompression with 7200, 8000 and 11025 sampling rates. This
mode supports applications such as digital telephone answering machine (TAM),
voice annotation, audio recording and playback to the telephone line.
The AL4200S Socket Modems supports position-independent, full-duplex
speakerphone (FDSP) operation using an advanced algorithm that includes both
acoustic and line echo cancellation.
1.2
Product Options
Fax Class 2 / 2.0
Leased Line (2-wire)
V.92 56K Data Modem
Voice Codec / Speakerphone
Hook Relay (4 pole phone line interface)
3V / 5V Versions
Ext. temp. option –25° to +70°
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AL4200SL
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1.3
General Modem Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
1.4
Data modem
- V.92, V.34bis, V.32bis, V.32, V.22 bis, V.22,V.23, V.21
- Bell 212A, Bell 103
- V.44 Data Compression
- V.42 LAPM and MNP 2-4 error correction
- V.42 bis and MNP 5 data compression
- V.250 and V.251 commands
Analog cellular direct connect using Voice Codec
Fax modem send and receive rates up to 33.6 kbps
- V.17, V.29, V.27 ter, and V.21 channel 2
- EIA/TIA 578 Class 1 (T.31)
- EIA/TIA 578 Class 2 / 2.0 (T.32)
Data/Fax/Voice call discrimination
Hardware-based modem controller
Hardware-based digital signal processor (DSP)
Worldwide operation
- Complies to TBR21 and other country requirements
- Call progress, blacklisting
Telephony/TAM
- V.253 commands
- 8-bit linear A-law / u-law, 16-bit, ADPCM and G.729 coding
- 7200, 8000 and 11025Hz sampling rates.
- Concurrent DTMF and ring detection
Full-duplex speakerphone (FDSP) mode using Voice Codec
- Microphone and speaker interface
- Telephone handset or headset interface
- Acoustic and line echo cancellation
- Microphone gain and muting
- Speaker volume control and muting
Differential input/output for quality audio circuits
Single-ended input for handset connection
Built-in host/DTE interface with speeds up to 115.2 kbps
- Serial ITU-T V.24 (EIA/TIA-232-E) logical interface (3V/5V Volt Level)
Direct mode (serial DTE interface)
Flow control and speed buffering
Automatic format/speed sensing
Serial async data
Hook Relay with 4-wire Line Interface.
Leased-Line copper wire supported (2-wire)
Extended temperature (-25° to +70° C) available as option.
+3V and +5V operation.
Typical power use: 750 mW (Normal Mode)
Applications
•
•
•
•
•
Embedded Systems
M2M applications
Alarm devices
Point of sales terminals
Remote monitoring and data collection
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2.
TECHNICAL OVERVIEW
2.1
General Description
Modem operation, including dialing, call progress, telephone line interface, telephone
handset interface, voice / speakerphone interface and host interface functions are
supported and controlled through the V.250, V.251, and V.253-compatible command
set.
2.2
Operating Modes
In V.34 data modem mode, the modem can operate in 2-wire, full-duplex,
asynchronous modes at line rates up to 33.6 kbps. Data modem modes perform
complete handshake and data rate negotiations. Using V.34 modulation to optimize
modem configuration for line conditions, the modem can connect at the highest data
rate that the channel can support from 33600 bps down to 2400 bps with automatic
fallback. Automode operation in V.34 is provided in accordance with PN3320 and in
V.32 bis in accordance with PN2330. All tone and pattern detection functions required
by the applicable ITU or Bell standards are supported.
In V.32 bis data modem mode, the modem can operate at line speeds up to 14.4
kbps.
In fax modem mode, the modem can operate in 2-wire, half-duplex, synchronous
modes and can support Group 3 facsimile send and receive speeds of 14400, 12000,
9600, 7200, 4800, and 2400 bps. Fax data transmission and reception performed by
the modem are controlled and monitored through the EIA/TIA-578 Fax Class 1, T.32
Fax Class 2 and 2.0 command interface. Full HDLC formatting, zero
insertion/deletion, and CRC generation/checking are provided.
2.3
Worldwide Operation
The modem operates in TBR21-compliant and other countries. Country-dependant
modem parameters for functions such as dialing, carrier transmit level, calling tone,
call progress tone detection, answer tone detection, blacklisting, caller ID, and relay
control are programmable. Country code IDs are defined by ITU-T T.35.
The default countries supported you will find in the “AT Command Manual”, Table 207
on page 111.
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2.3
TAM Mode
TAM Mode features include 8-bit linear A-law / u-law, 16-bit, ADPCM and G.729
coding at 7200, 8000 and 11025Hz sampling rates. Tone detection/generation, call
discrimination, and concurrent DTMF detection are also supported. TAM Mode is
supported by four submodes:
1. Online Voice Command Mode supports connection to the telephone line or a
microphone/speaker and handset/headset.
2. Voice Receive Mode supports recording voice or audio data input from the
telephone line or a microphone and handset/headset.
3. Voice Transmit Mode supports playback of voice or audio data to the telephone
line or a speaker and handset/headset.
4. Full-duplex Receive and Transmit Mode.
2.4
Voice / Speakerphone Mode
The AL4200S models include additional telephone handset, external microphone, and
external speaker interfaces which support voice and full-duplex speakerphone
(FDSP) operation.
Hands-free full-duplex telephone operation is supported in Speakerphone Mode
under host control. Speakerphone Mode features an advanced proprietary
speakerphone algorithm which supports full-duplex voice conversion with acoustic,
line, and handset echo cancellation. Parameters are constantly adjusted to maintain
stability with automatic fallback from full-duplex to pseudo-duplex operation. The
speakerphone algorithm allows position independent placement of microphone and
speaker. The host can separately control volume, muting, and AGC in microphone
and speaker channels.
2.5
Audio Codec Features
Audio-band 16-bit linear codec:
•
•
•
•
•
•
•
SNR is greater than 65 dB for voice band.
Single-ended input/output for handset is greater than 40 dB.
Differential input/output for speaker/microphone is greater than 65 dB
Sample rates from 7.2 kHz to 11.25 kHz
Single-ended input for handset connection
Differential input/output for quality audio circuits
Sigma-delta (S-D) based codec
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2.6
Commands
The modem supports data modem, fax class 1 modem, fax class 2 and 2.0 modem,
voice/audio, full-duplex speakerphone (FDSP) and S Registers in accordance with
modem model options. See the “AT Command Manual” for a description of the
commands.
Data Modem Operation. Data modem functions operate in response to the AT
commands when +FCLASS=0. Default parameters support U.S./Canada operation.
Fax Modem Operation. Facsimile functions operate in response to fax class 1
commands when +FCLASS=1. Fax class 2 commands when +FCLASS=2, fax class
2.0 commands when +FCLASS=2.0.
Voice/Audio Operation. Voice/audio mode functions operate in response to
voice/audio commands when +FCLASS=8.
Speakerphone Operation. FDSP functions operate in response to speakerphone
commands when +FCLASS=8 and +VSP=1 is selected.
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2.6
Supported Interfaces
The major hardware signal interfaces of the AL4200S Series Socket Modem are
illustrated in Figure 2-1.
TTL
Serial
interface
5
4
3
Power
GPIO
Reset
Socket
Modem
Module
2
6
4
RJ11
Modular
Speaker +
Micro
Handset IF
Differential
Speaker +
Micro IF
FIGURE 2-1. TYPICAL SERIAL BLOCK DIAGRAM
2.6.1 Serial Interface:
DTE serial interface and indicator outputs are supported.
Serial Interface: 8-line TTL logic serial interface to the DTE is supported.
2.6.2 Speaker Interface:
A speaker output, controlled by AT commands, is provided for an optional OEMsupplied speaker circuit.
2.6.3 World Class Line Interface:
The World Class Socket Modem includes configurations for use in many countries.
These Socket Modems are fully tested for compliance with their respective PTT
regulations and are certified for use in these countries.
2.7
Command Set and S-Registers
Modem operation is controlled by AT and S register commands issued by the DTE.
Refer to the "AT Commands for the AL4200S Modems Reference Manual" .
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3.
HARDWARE INTERFACE
3.1
Modem Hardware Pins and Signals
3.1.1
Phone Line Interface
The phone-line interface signals are:
•
•
•
•
3.1.2
TIP
RING
TIP2 (TIP return is optional)
RING2 (RING return is optional)
Call Progress Speaker Interface
The call progress speaker interface signal is:
•
Digital speaker output = SPKR (Pin 64)
DSPKOUT is a square wave output in Data/Fax mode used for call progress or carrier
monitoring. This output can be optionally connected to a low-cost on-board speaker,
e.g., a sounducer, or to an analog speaker circuit.
3.1.3
Serial DTE Interface and Indicator Outputs
The supported DTE interface signals are:
•
•
•
•
•
•
•
3.1.4
External Reset Input
The supported reset input interface signals are:
•
3.2
Serial Transmit Data input (TXD#)
Serial Receive Data output line (RXD#)
Clear to Send output (CTS#)
Received Line Signal Detector (DCD#)
Ring Indicator (RI#)
Data Terminal Ready control input (DTR#)
Request to Send control input (RTS#)
External Reset Input (RESET#)
Modem Pin Assignments and Signal Definitions
The socket modem DIL-64 hardware interface signals are shown by major interface in
Figure 3-1, are shown by pin number in Figure 3-2, and are listed by pin number in
Table 3-1.
Modem hardware interface signals are defined in Table 3-2.
I/O types are defined in Table 3-3.
DC electrical characteristics are listed in Table 3-4.
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Figure 3-1. SERIAL TTL PINOUT
1
2
3
4
TIP
RING
TIP2
RING2
SPKR
AGND
MIC
VCC
NC
SPK-N
SPK-P
MIC-N
MIC-P
64
63
62
61
60
59
58
57
56
Top View
24
25
26
27
28
29
30
31
32
RESET#
GPIO
DGND
NC
NC
NC
NC
NC
NC
DGND
DTR#
DCD#
CTS#
DSR#
RI#
TXD#
RXD#
RTS#
41
40
39
38
37
36
35
34
33
Table 3-1. Serial TTL Signals
PIN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
NAME
TIP
RING
TIP2
RING2
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
~RESET
GPIO
DGND
NC
NC
NC
NC
NC
NC
No. AL4200S-E00-105
I/O TYPE
PIN
TEL LINE
TEL LINE
TIP RETURN
RING RETURN
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
Input
Input
DIGITAL GND
NC
NC
NC
NC
NC
NC
NAME
~RTSTTL
~RXDTTL
~TXDTTL
~RITTL
~DSRTTL
~CTSTTL
~DCDTTL
~DTRTTL
DGND
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
No pin
MIC-P
MIC-N
SPK-P
SPK-N
NC
VCC
MIC
AGND
SPKR
xmodus swiss GmbH
I/O TYPE
Input
Output
Input
Output
Output
Output
Output
Input
DIGITAL GND
Micro+ Input
Micro- Input
Speaker+ Out
Speaker- Out
POWER
Micro Input
Audio Ground
Speaker Output
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Table 3-2. Signal Descriptions
LABEL
I/O TYPE
VCC
PWR
3.3V (3V models) or +5V Power
DGND
GND
Digital Ground Connect to Digital Ground on the interface circuit.
~RES
IC/OC
Modem Reset. Open collector input/output. Drive only with opencollector circuit. The Active Low ~RES input resets the Socket
Modem logic and returns the AT command set to the original factory
default values and to "stored values" in NVRAM. ~RES is connected
to a built-in reset circuit on the Socket Modem.
TIP
IF
TIP Signal from Telco/PTT
TIP
IF
TIP Signal from Telco/PTT
TIP2
IF
TIP Return from Hook Relay (optional)
RING2
IF
RING Return from Hook Relay (optional)
GPIO
IA
GPIO Input. (not used)
LABEL
I/O TYPE
~RTSTTL
~RXDTTL
~TXDTTL
~CTSTTL
SIGNAL NAME / DESCRIPTION
SIGNAL NAME / DESCRIPTION SERIAL INTERFACE
IA
Request To Send (TTL Active Low). ~RTS is used to condition
the local modem for data transmission. On a full-duplex channel,
RTS OFF maintains the modem in a non-transmit mode. A nontransmit mode does not imply that all line signals have been
removed from the telephone line. RTS OFF may be ignored if the
modem is optioned to strap ~CTS ON; this allows the modem to
receive from the DTE even though RTS is OFF. RTS input ON
causes the modem to transmit data on TXD when ~CTS becomes
active.
OA
Received Data (TTL Active Low). The modem uses the ~RXD line
to send data received from the telephone line to the DTE and to
send modem responses to the DTE. Modem responses take priority
over incoming data when the two signals are in competition for
~RXD.
IA
Transmitted Data (TTL Active Low). The DTE uses the ~TXD line
to send data to the modem for transmission over the telephone line
or to transmit commands to the modem. The DTE should hold this
circuit in the mark state when no data is being transmitted or during
intervals between characters.
OA
Clear To Send (TTL Active Low). ~CTS is controlled by the
modem to indicate whether or not the modem is ready to transmit
data. ~CTS ON, together with the ~RTS ON, ~DSR ON, and ~DTR
ON (where implemented), indicates to the DTE that signals
presented on TXD will be transmitted to the telephone line. ~CTS
OFF indicates to the DTE that it should not transfer data across the
interface on TXD. ~CTS ON is a response to ~DTR ON and ~RTS,
delayed as may be appropriate for the modem to establish a
telephone connection. ~CTS output is controlled by the AT&Rn
command.
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Table 3-3. Signal Descriptions
LABEL
I/O TYPE
SIGNAL NAME / DESCRIPTION SERIAL INTERFACE
OA
Ring Indicate (TTL Active Low). ~RI output ON (low) indicates the
presence of an ON segment of a ring signal on the telephone line.
The modem will not go off-hook.
OA
Data Set Ready (TTL Active Low). ~DSR indicates modem status
to the DTE. ~DSR OFF (high) indicates that the DTE is to disregard
all signals appearing on the interchange circuits except Ring
Indicator (~RI). ~DSR output is controlled by the AT&Sn command.
If the AT&S1 option is selected, ~DSR will come ON in the
handshaking state when carrier is detected in the originate mode or
when carrier is first sent in the answer mode. ~DSR goes OFF if
~DTR goes OFF. If AT&Q0 and AT&S0 are selected, ~DSR will
remain on at all times regardless of the modem's current state.
OA
Data Carrier Detect (TTL Active Low). When AT&C0 command is
not in effect, ~DCD output is ON when a carrier is detected on the
telephone line or OFF when carrier is not detected.
~DCD can be strapped ON using AT&C0 command.
~DTRTTL
IA
Data Terminal Ready (TTL Active Low). The ~DTR input is turned
ON (low) by the DTE when the DTE is ready to transmit or receive
data. ~DTR ON prepares the modem to be connected to the
telephone line, and maintains the connection established by the
DTE (manual answering) or internally (automatic answering). ~DTR
OFF places the modem in the disconnect state under control of the
&Dn and &Qn commands. The effect of ~DTR ON and ~DTR OFF
depends on the &Dn and &Qn commands. Automatic answer is
enabled when ~DTR is ON if the "Answer Ringcount" selectable
option is not set to 0. Regardless of which device is driving ~DTR,
the modem will respond to an incoming ring by going off-hook and
beginning the handshake sequence.
The response of the modem to the ~DTR signal is very slow (up to
10ms) to prevent noise from falsely causing the modem to
disconnect from the telephone line.
LABEL
I/O TYPE
SIGNAL NAME / DESCRIPTION AUDIO INTERFACE
MIC
AINA
SPKR
AOUTA
MIC-P
AINB
MIC-N
AINB
SPK-P
AOUTB
SPK-N
AOUTB
~RITTL
~DSRTTL
~DCDTTL
Microphone Voice Input. MIC is a single-ended microphone input
from the analog switch circuit.
Speaker Output. SPKR is a single-ended output from the analog
switch circuit. (Call progress speaker output)
Microphone Voice Input. MIC-P is a differential microphone input
from the analog switch circuit.
Microphone Voice Input. MIC-N is a differential microphone input
from the analog switch circuit.
Speaker Output. SPK-P is a differential speaker output from the
analog switch circuit.
Speaker Output. SPK-N is a differential speaker output from the
analog switch circuit.
Notes:
AINA, AINB = Analog input (see Table 3-5).
AOUTA, AOUTB = Analog output (see Table 3-5).
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Table 3-4. Digital Electrical Characteristics
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNITS
TEST
CONDITIONS
Input High Voltage
Type IA
VIH
Vdc
-
0.7 x VDD33
VDD33 +0.3
Inputs are 5V
tolerant
Input Low Voltage
VIL
Type IA
Output High
Voltage
-
0.3 x VDD33
Vdc
VOH
Type OA
Output Low
Voltage
Vdc
-0.3
VDD33 -0.7
VDD33 -0.2
-
Vdc
VOL
Type OA
Three-State (OFF)
Current
IOH = -1.8mA
IOH = -50uA
-
-
-
ITSI
IOL = 1.8mA
IOL = 50uA
0.4
0.2
±10
μADC
VIN = 0V
Circuit Type
Type IA
TTL +5V
tolerant
Type OA
TTL 3.3V
Notes:
1. Test Conditions: VDD33 = +3.3 +/- 0.3 VDC, TA = 0°C to 70°C
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Table 3-5. Analog Electrical Characteristics
TYPE
AINA
(MIC)
PARAMETER
CONDITIONS
Source Impedance ac-coupled with a 0.2 µF cap
With ac-coupled 150 mVp-p input,
PGA gain = 21 dB
Gain
493 mVrms input, 1015 Hz,
PGA gain = 0 dB
0 dBm ± 0.5 dB
Full Scale
Vin = 3.14 dBm0,
PGA gain = 0 dBm
2.0 Vp-p typical
Total Harmonic
Distortion
Vin = 2.5 dBm0, PGA gain = 0 dB
Vin = 0 dBm0, PGA gain = 0 dB
Vin = –40 dBm0, PGA gain = 0 dB
Power Supply
Rejection Ratio
AINB
(MIC-P
MIC-N)
300 Hz—10 kHz
PARAMETER
CONDITIONS
Source Impedance ac-coupled with 0.2 µF cap
–40 dB
–50 dB
–45 dB
50 dB min
VALUE
1kΩ - 3 kΩ
Input Impedance
With ac-coupled 40 mVp-p input,
PGA gain = 0 dB
12 kΩ - 30 kΩ
Preamp Gain
0 dBm0 = 9.85 mVrms, PGA gain = 6 dB
Output measured relative to measured
AINA encoder milliwatt response
28 dB ± 1.5 dB
Full Scale
Vin = 3.14 dBm0, PGA gain = 6 dB
Total Harmonic
Distortion
AOUTA
20 kΩ min
20 dBrnC0 max.
Idle Channel Noise PGA gain = 12 dB
TYPE
1kΩ - 3 kΩ
Input Impedance
Idle Channel Noise PGA = 12 dB
TYPE
VALUE
Vin = 2.5 dBm0, PGA gain = 0 dB
Vin = 0 dBm0, PGA gain = 0 dB
Vin = –40 dBm0, PGA gain = 0 dB
PARAMETER
CONDITIONS
VOUT (gain)
PCM = 0 dBm0
Measured relative to AOUTA decoder
milliwatt response
VOUT (full scale)
PCM = 3.14 dBm0
RL = 150
CLmax = 300 pF
Load Resistance
ac coupled
Total Harmonic
Distortion
PCM = 2.5 dBm0
PCM = 0 dBm0
PCM = - 40 dBm0
Idle Channel Noise PCM = idle code
No. AL4200S-E00-105
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40 mVp-p typical
26 dBmC0 max.
–40 dB
–50 dB
–45 dB
VALUE
493 mVrms ± 0.5 dB
2.00 Vp-p typical
135 Ω min
- 40 dB
- 55 dB
- 45 dB
8 dBmC0 max.
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Table 3-5. Analog Electrical Characteristics
TYPE
AOUTB
PARAMETER
CONDITIONS
VALUE
VOUT (gain)
PCM = 0 dBm0
Measured relative to AOUTA decoder
milliwatt response
VOUT (full scale)
PCM = 3.14 dBm0
RL = 16
Clmax = 300 pF
Load Resistance
Differential
Total Harmonic
Distortion
Vout = 3.6 Vp-p*
Vout = 3.2 Vp-p*
PCM = –40 dBm0
PCM = 0 dBm0
6 dB ± 0.25dB
4.00 Vp-p typical
(125 mW at 16 Ω)
15 Ω min.
–30 dB
–40 dB
–45 dB
–55 dB
Idle Channel Noise PCM = idle code
8 dBmC0 max.
Table 3-6. Absolute Maximum Ratings
PARAMETER
Supply Voltage
SYMBOL
MIN.
Input Voltage
VIN
Nominal Supply
Voltage
5V Models
3V Models
VDD
Static Discharge
Voltage
@ 25°C
VESD
-0.3
0
-
+ 7.0
+ 3.6
-0.3
-
+7.0
Supply Current
ID
Vdc
Idle
AL4200S
Online
AL4200SL
Online
AL4200S
FSDP
5.0
3.3
5.25
3.465
V
+/- 2500
°C
0
AL4200SL
CONDITIONS
Vdc
TA
UNITS
Vdc
4.75
3.135
Operating
Temperature Range
Idle
MAX.
VDD
5V Models
3V Models
AL4200S
TYP.
-
70
mA
-
125
130
88
90
-
140
145
96
98
-
188
-
190
-
Idle mode.
Online mode.
Speakerphone
mode with an 8Ω
speaker connected
Notes:
Test Conditions: VCC = 5VDC +/- 5%, TA = 25°C,
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3.3 Firmware ROM
Socket Modem firmware performs processing of general modem control, command
sets, error correction, data compression, fax Class 1 and 2.0, voice, audio, RPI, and
DTE interface functions depending on the modem model. The Socket Modem
firmware is programmed into the on-board flash.
3.4
DAA Interface
The Socket Modem is configured to be an on-board DAA (World Class DAA). Provide
TIP and RING signals from the telco jack to pins 1 and 2 of the Socket Modem. Only
EMI suppression components may be used. If other components are used, the PTT
certification for these Socket Modems will no longer apply, and recertification will be
required. The recommended telco interface for World Class Socket Modems is shown
in Figure 3-4.
TIP and RING signal traces are to be no closer than 2.5mm (0.1") from any other
traces for European applications. 2.5mm spacing must be used if the host board is to
support both U.S. and European Socket Modems.
R1
0R
P1
P2
1
1
2
4
L1
8
5
1
2
3
4
5
6
NC
OT
T
R
OR
NC
SOCKET MODEM
RJ11
R2
0R
Figure 3-3. Recommended 2-Wire Telephone Line Interface
R1
0R
P1
P2
1
2
3
4
SOCKET MODEM
1
L1
4
8
5
R2
0R
1
2
3
4
5
6
NC
OT
T
R
OR
NC
RJ11
Figure 3-4. Recommended 4-wire Telephone Line Interface
The common mode choke L1 is optional in both Figures 3.3 and 3.4. The need
depends on the characteristics of the target hardware. The need for this choke
must be evaluated at EMV measurement (conducted emission) of the final product.
If not used populate R1, R2.
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3.5
Call Progress Speaker Interface
Audio output is useful for monitoring the modem's call-progress tones and modem
system debugging, as well as for full-featured Voice applications. The two audio
amplifier circuits shown below are similar in layout but differ in audio quality. The
Sounducer circuit is suitable for basic call-progress-tone monitoring, while the
speaker circuit is appropriate for Voice applications.
In Figure 3-5, the audio amplifier drives a piezo-electric Sounducer. The SPKR signal
from the Socket Modem is fed into an audio amplifier. The 10 μF capacitor between
pin 1 and pin 8 of the amplifier bypasses internal circuitry to achieve the maximum
gain. The second 10 μF capacitor, between pin 5 of the amplifier and the Sounducer,
is used to keep the 2.5 VDC bias of the op amplifier from going into the Sounducer.
In Figure 3-6, the audio amplifier drives an 8Ω speaker. In this circuit, the amplifier's
bypass circuit includes a 760 Ω resistor, and the bias-blocking capacitor changes to
22 μF.
+5V
0.1uF
10uF
6
SPKR
(Pin 64)
0.1uF
1
2
5
7
AGND
(Pin 63)
10uF
LM386
3
8
4
50 Ohm sounducer
FIGURE 3-5. SOUNDUCER DRIVER CIRCUIT
+5V
0.1uF
10uF
6
SPKR
(Pin 64)
0.1uF
1
2
5
7
AGND
(Pin 63)
22uF
LM386
3
8
4
8 Ohm speaker
760Ω
FIGURE 3-6. SPEAKER DRIVER CIRCUIT
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3.6
Audio Interface
3.6.1 Analog Audio Input Channels
The integrated Codec circuit contains two audio analog inputs. There is a singleended input (AINA) for connection to to a standard business telephone handset
receiver and a differential input pair (AINBP, AINBN) for connection to a microphone.
The differential input is directly connected to a amplifier. The programmable gain
amplifier is adjustable from 0 dB to 21 dB in 3 dB steps (see AT commands). The
signal output from the programmable gain amplifier is then connected to the audio
codec block to be digitized. The input signals to AINB-P and AINB-N are ac-coupled
to their codec inputs by an 0.2 µF capacitor on the socket modem board. The
maximum signal input to the codec is specified in table 3.5. If the user sets the
amplification to a value that would produce a larger signal than specified, the audio
codec will saturate and clip the input waveform.
3.6.2 Analog Audio Output Channels
The codec contains two analog audio output ports. There is a single-ended output
signal (AOUTA) for connection to the speaker of a standard 150 business telephone
handset and a differential speaker driver output pair (AOUTB) for connection to a 16Ω
speaker. Both outputs receive their analog signals from the single-channel audio
codec block that converts the digital input stream to analog signals. The maximum
signal from the codec is 2.0 Vp-p. The AOUTA signal has a maximum 2.0 Vp-p signal
swing. It should maintain a midlevel bias to prevent load noises when the driver is reenabled. The speaker outputs (AOUTB) each have 2 Vp-p signal swing. Since these
outputs are of opposite polarity, the differential signal output is 4 Vp-p. This is a 6 dB
effective amplification of the codec output signal. The signals should be biased such
that, when power is re-enabled, no audible noises occur. The differential speaker
output driver does not have to produce a full 4 Vp-p signal without distortion. Signals
above 4 Vp-p measured from AOUTB may be in the nonlinear range of the differential
amplifier and exhibit a flattening or clipping characteristic at the output.
1K
P1
10uF
+
64
SPEAKER AMP.
63
62
61
MICRO
SOCKET MODEN
0.1uF
10K
2,2K
+3.3V
4.7K
47uF
0.01uF
Figure 3-7. Single-Ended Handset Recommended Circuit.
P1
59
SPK-
58
SPK+
57
MIC-
56
MIC+
SPEAKER
MICROPHONE
SOCKET MODEN
Figure 3-8. Differential Speaker/Microphone Recommended Circuit.
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3.7
Reset Interface
3.7.1 Recommended Reset Circuit
This signal is used to force a reset procedure by providing low level during at least
100uS. This signal has to be considered as an emergency reset only. A reset
procedure is already driven by an internal hardware during the power-up sequence.
If no external reset is necessary this input can be left open. If used (emergency
reset), it has to be driven by an open collector or an open drain.
RESET: PIN 24
SWITCH RESET
NPN
Switch Reset
Reset (Pin 24)
Reset Status
1
0
Active
0
1
Inactive
Additional comments on RESET:
The reset process is activated either by the external Reset signal OR by an internal
signal (coming from the internal RESET generator). This automatic reset is activated
at power-up.
The module remains in reset mode as long as the reset signal is held low. As soon as
the reset is complete, the AT interface answers “OK” to the application.
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4.
DESIGN CONSIDERATIONS
Good engineering practices must be adhered to when designing a printed circuit
board (PCB) containing the Socket Modem module. Suppression of noise is essential
to the proper operation and performance of the modem itself and for surrounding
equipment.
Two aspects of noise in an OEM board design containing the Socket Modem module
must be considered: on-board/off-board generated noise that can affect analog signal
levels and analog-to-digital conversion (ADC)/digital-to-analog conversion (DAC), and
on-board generated noise that can radiate off-board. Both on-board and off-board
generated noise that is coupled on-board can affect interfacing signal levels and
quality, especially in low level analog signals. Of particular concern is noise in
frequency ranges affecting modem performance.
On-board generated electromagnetic interference (EMI) noise that can be radiated or
conducted off-board is a separate, but equally important, concern. This noise can
affect the operation of surrounding equipment. Most local governing agencies have
stringent certification requirements that must be met for use in specific environments.
Proper PC board layout (component placement, signal routing, trace thickness and
geometry, etc.), component selection (composition, value, and tolerance), interface
connections, and shielding are required for the board design to achieve desired
modem performance and to attain EMI certification.
4.1
PC Board Layout Guidelines
4.1.1 General
1.
In a 2-layer design, provide an adequate ground grid in all unused space around
and under components (judiciously near analog components) on both sides of
the board, and connect in such a manner as to avoid small islands. A grid is
preferred over a plane to improve solderability. Typically, the grid is composed of
0.012 in. traces and 0.012 in. spaces on a 0.025 in. grid. Connect each grid to
other grids on the same side at several points and to grids on the opposite side
through the board at several points. Connect Socket Modem DGND and AGND
pins to the ground grid. All power and ground traces should be at least 0.05 in.
wide.
2.
In a 4-layer design, provide an adequate ground plane covering the entire board.
Socket Modem DGND and AGND pins are not tied together on the Socket
Modem.
3.
As a general rule, route digital signals on the component side of the PCB and the
analog signals on the solder side. The sides may be reversed to match particular
OEM requirements. Route the digital traces perpendicular to the analog traces to
minimize signal cross coupling.
4.
Route the modem signals to provide maximum isolation between noise sources
and noise sensitive inputs. When layout requirements necessitate routing these
signals together, they should be separated by neutral signals.
5.
TIP and RING signal traces are to be no closer than 2.5mm (0.1") from any other
traces for European applications. 2.5mm spacing must be used if the host board
is to support both U.S. and European Socket Modems.
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4.1.2 Electromagnetic Interference (EMI) Considerations
The following guidelines are offered to specifically help minimize EMI generation.
Some of these guidelines are the same as, or similar to, the general guidelines but
are mentioned again to reinforce their importance.
In order to minimize the contribution of the Socket Modem-based design to EMI, the
designer must understand the major sources of EMI and how to reduce them to
acceptable levels.
1.
Keep traces carrying high frequency signals as short as possible.
2.
Provide a good ground plane or grid. In some cases, a multilayer board may be
required with full layers for ground and power distribution.
3.
Decouple power from ground with decoupling capacitors as close to the Socket
Modem module power pins as possible.
4.
Eliminate ground loops, which are unexpected current return paths to the power
source and ground.
5.
Decouple the telephone line cables at the telephone line jacks. Typically, use a
combination of series inductors, common mode chokes, and shunt capacitors.
Methods to decouple telephone lines are similar to decoupling power lines,
however, telephone line decoupling may be more difficult and deserves
additional attention. A commonly used design aid is to place footprints for these
components and populate as necessary during performance/EMI testing and
certification.
6.
Decouple the power cord at the power cord interface with decoupling
capacitors. Methods to decouple power lines are similar to decoupling
telephone lines.
7.
Locate high frequency circuits in a separate area to minimize capacitive
coupling to other circuits.
8.
Locate cables and connectors so as to avoid coupling from high frequency
circuits.
10.
If a mulilayer board design is used, make no cuts in the ground or power planes
and be sure the ground plane covers all traces.
11.
Minimize the number of through-hole connections on traces carrying high
frequency signals.
12.
Avoid right angle turns on high frequency traces. Forty-five degree corners are
good, however, radius turns are better
13.
On 2-layer boards with no ground grid, provide a shadow ground trace on the
opposite side of the board to traces carrying high frequency signals. This will be
effective as a high frequency ground return if it is three times the width of the
signal traces.
14.
Distribute high frequency signals continuously on a single trace rather than
several traces radiating from one point.
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4.2
Other Considerations
The pins of all Socket Modems are grouped according to function. The DAA interface,
Host interface, and Audio interface pins are all conveniently arranged, easing the host
board layout design.
Xmodus has tested each of the AL4200S series Socket Modems for compliance with
TBR21. The certificates apply only to designs that route TIP and RING (pins 1 and 2)
directly to the telco jack. Only specified EMI filtering components are allowed on
these two signals as shown in figure 3-3.
4.3
Manufacturing Considerations
The Socket Modem has been designed to be mounted onto the host board in one of
two ways.
The first method consists of soldering two 32-pin strip sockets to the host board and
inserting the Socket Modem into the sockets. A suggested part number for the 32-pin
socket is Sam Tec SMM-132-01-F-S.
The second way is to solder the Socket Modem directly to the host board. The most
efficient way to do this is through a wave solder process. The recommended hole size
for the Socket Modem pins is 0.036 in. ±0.003 in. in diameter. Spacers can be used to
hold the Socket Modem vertically in place during the wave solder process. A spacer
should be placed on pin 32 and pin 64 of the Socket Modem. A suggested part
number for the spacer is BIVAR 938-0.130 for P1(0.310in) option Socket Modems.
The spacers can be left on permanently and will not effect operation.
Socket Modems can be put through a water wash process.
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5.
PACKAGE DIMENSIONS
64.5mm (2.54“)
26.5mm (1.04“)
1,6mm
5,6 mm
∅0.5mm
2,8mm
2,0mm
6,5mm
62.0mm
24.0mm
Figure 5-1. AL4200S Socket Modem Physical Dimensions
AL4200S Dimensions
Width
Height
Length
Weight
Operating temperature
Storage temperature
Humidity
No. AL4200S-E00-105
Europe
26,5 mm
14.1 mm
64,5 mm
~ 12 g
0...70 °C
–10...85 °C
90% non-condensing
xmodus swiss GmbH
US
~1.05"
~0.55"
~2.55"
~ 0.42 oz
32...160 °F
14...185 °F
90% non-condensing
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6.
SOCKET MODEM APPROVALS
The Socket Modem module is approved as a host-independent modem card. To
maintain type approvals, permits and/or licenses valid, the guidelines described in
this document must be followed.
6.1
Considerations for Telecom Approvals
The Socket Modem has been assessed and has been found to comply with the
relevant harmonized standards as defined by the European ETSI Directive
(ETSI TC-TE).
These standards are:
6.1.1
TBR21 / CTR21
PSTN Connection
The Socket Modem can be connected to the Public Switched Telephone Network
(PSTN) either
a)
b)
by using a 2-wire flying cable to connect pins 1 and 2 of the module to an RJ11 connector which can be assembled in a suitable location of the host system
enclosure,
OR
by providing traces on the host system motherboard for the PSTN connection
signals (TIP and RING) between the card and an RJ-11 connector
If connection option a) is used, the cable and its installation inside the host system
must be in accordance with the guidelines in IEC950/EN60950 (e.g. the insulation
material must withstand electric strength tests as described in section 3.4).
If connection option b) is used, NO additional components except those used for
EMI filtering (specified in figure 3-3) must be connected to the TIP and RING
signals. Other components not intended for use with this design may affect the
network access characteristics of the modem and may therefore invalidate the type
approvals, permits and/or licences.
In both cases, for the connection between the host and the PSTN wall connector, a
cable with RJ-11 modular jack and an appropriate national plug must be used. Note
that in Germany, an F-coded connector/plug must be used (this is one of the two
typical plugs used for PSTN connection in Germany, the other type is called Ncoded).
6.2
Considerations for Electrical Safety
6.2.1
Conditions for Maintaining Safety Compliance (European Countries)
The Socket Modem has been assessed with respect to electrical safety and has
been found to comply with relevant standards as defined by the European Low
Voltage Directive (72/23EEC). The particular standard is EN 60950-1:2001.
The card is rated as Class III equipment and it is intended for use in Pollution
Degree 2 environments only [see EN60950-1:2001, 2.10.4]. Material Group IIIa or
IIIb (Comparative Tracking Index below 400 according o IEC 112, method A) is
assumed for any host system PCB that has traces and/or circuitry with TNV
potential.
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It is assumed that the modem card will only be assembled in a host system unit that
complies with IEC60950/EN60950.
Some particular requirements are [see EN60950-1:2001, 2.1.1, 2.2, 2.3, 2.9, 2.10
and 4.7.3.2]:
the host system must have a compliant fire enclosure (e.g. made of material
with flammability class 94V-1 or better).
the power supply unit of the host system must have double or reinforced
insulation.
6.2.2
Power Supply [EN60950-1:2001, 1.6]
Before installing the Socket Modem in a host system, the installer must ensure that
the power drawn by the card, together with the host and any auxiliary cards drawing
power from the host, is within the rating of the host power supply unit.
The Socket Modem's power consumption is typically 0.8 W (+5.0 Vdc).
6.2.3
Clearances, Creepage Distances [EN60950-1:2001, 2.10.3 and 2.10.4]
SELV
RS 232
a/b
TNV3
This card must be installed such that with the exception of the connections to the
host, clearance and creepage distances shown in the table below are maintained
between
a) the TNV3 area of the card (the DAA) and conductive parts of other assemblies
inside the host,
b) if applicable, the PSTN connection traces (TIP and RING) routed through the
host system motherboard and any other conductive area (i.e. traces, through
holes, SMD pads, copper areas, etc.) on that motherboard,
which use or generate a voltage shown in the table below (values only for secondary
circuits):
EN60950:2000 Table 2K / 2L
Clearance (mm)
Creepage (mm)
Voltage used or
Generated by Host or
Other cards
1.0
1.5 (2.4)
Up to 125 Vrms or Vdc
2.0
2.5 (4.0)
Up to 250 Vrms or Vdc
2.5
3.2 (5.0)
Up to 300 Vrms or Vdc
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The larger distances shown in brackets applies for Pollution Degree 3 environments
(where the local environment within the host is subject to conductive pollution or dry
non-conductive pollution, which could become conductive due to expected
condensation).
The same clearance and creepage distances also apply between TNV3 areas of the
card and earth connections inside the host system. Clearance and creepage
between primary (mains) and secondary circuits according EN 60950-1:2001,
clause 2.10.3.2 table 2H and clause 2.10.4 table 2L.
Minimum distances between primary and secondary circuits (f.g. for mains voltage
230 VAC):
Clearance = 4 mm
Creepage = 5 mm
Failure to maintain these minimum distances would invalidate the approval.
NOTE: For a host or other expansion cards fitted in the host using or generating
voltages greater than 300 V (rms or dc), advice from a competent
telecommunications safety engineer must be obtained.
If these clearance and creepage distances cannot be provided inside the host due to
space limitations, a dielectric material may be used as a physical insulation barrier.
The dielectric material used in this insulation must have a thickness of at least
0.4mm.
After installation (or implementation) of the Socket Modem inside a host
system, it is recommended that a competent telecommunications safety
engineer inspects the complete system to ensure that safety compliance is
maintained.
(TNV = Telecommunications Network Voltages)
6.3
Considerations for EMC
6.3.1
EMC Compliance (European Countries)
The Socket Modem has been assessed with respect to emission of and immunity to
electromagnetic disturbances and has been found to comply with the relevant harmonized
standards as defined by the European EMC Directive (89/336/EEC).
These standards are:
•
Generic emission standards which refers to
EN 55022:1998 +A1:2000, Class B
•
Generic immunity standards which refers to
EN 55024:1998 +A1:2001
EN 61000-6-2:2001 (industrial environment)
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6.3.2
Installation in Host Systems (European Countries)
It is assumed that the Socket Modem will only assembled in host systems that
comply with the EMC Directive.
As per definition of the EMC Directive, the card and its host system will constitute an
"installation" similar to e.g. a PC card modem installed in a personal computer.
Therefore, if the host system complies with the EMC Directive, there should be no
need for verifying continued compliance of the complete system.
However, note that it is the responsibility of the professional installer of Socket
Modem to ensure that the complete system placed on the market complies with the
Directive.
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