Diener FEMTO Operating Instructions Manual

OPERATING

INSTRUCTIONS

Type: Femto

Please read this manual carefully before installing the machine.

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P

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P

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Y

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M

A

S

M

S u m m a r y O f f D e l l i i v e r e d C o m p o n e n t t s

Customer:

Date of delivery:

Please note, that for the handling with your machine, it is only neccesary to read the marked chapters!

1.

Cabinet/

Basic Unit

1.1.1

1.1.2

1.1.3

1.1.4

1.1.5

1.1.6

1.1.7

1.1.8

2.

Gas supply

1.2.1

1.2.2

1.2.3

3. Connections

obligatorisch

4.

Vacuumchamber

1.4.1

1.4.2

5.

Carrier

6.

Electrodes

1.5.1

1.6.1

1.5.2

1.6.2

1.4.3

1.5.3

1.6.3

7.

Control

1.7.1

1.7.2

1.7.3

8.

Generator

1.8.1

9.

Vacuum

Pump

1.9.1

1.8.2

1.9.2

10.

Options

1.10.1

1.10.10

1.10.19

1.10.27

1.10.2

1.10.11

1.10.20

1.10.28

1.8.3

1.9.3

1.10.3

1.10.12

1.10.21

1.10.29

1.2.4

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1.4.4

1.5.4

1.6.4

1.2.5

1.2.6

1.4.5

1.5.5

1.6.5

1.4.6

1.5.6

1.6.6

1.8.4

1.9.4

1.8.5

1.9.5

1.8.6

1.9.6

1.10.4

1.10.13

1.10.22

1.10.30

1.10.5

1.10.14

1.10.23

1.10.6

1.10.15

1.10.24

1.2.7

1.5.7

1.5.8

1.5.9

1.9.7

1.9.8

1.10.7

1.10.16

1.10.25

1.10.8

1.10.17

1.10.26

1.10.9

1.10.18

Special

11.

Options:

S u m m a r r y O f f D e l l i i v e r e d C o m p o n e n t t s

12. Remarks:

Specify

13.

Connections:

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T a b l l e O f f C o n t t e n t t s

1. Delivered components and description.................................................

2. Connecting of the machine …………………………………………………..

3. Technical features of machine ..............................................................

4. Safety warnings ....................................................................................

5. Maintenance .........................................................................................

6. Emergency maintenance ......................................................................

7. Spare part list........................................................................................

8. EG declaration of conformity.................................................................

9. Warranty................................................................................................

10. Information according plasma processes.............................................

11. Index.....................................................................................................

12. Circuit diagram .....................................................................................

Manual for

Low Pressure Plasma Systems

Of following production series:

Producer:

Femto

Diener electronic GmbH + Co. KG

Talstr.

Nagold

Germany

Tel.: 00 49 (0) 74 52 / 8 88 07 – 0

Fax: 00 49 (0) 74 52 / 8 88 07 – 50

E-mail: www.plasma.de

As of:

Copyright:

2008-12-31

Diener electronic GmbH + Co. KG

All rights reserved. This publication may be reproduced or transmitted only with permission in writing form from the publisher (Diener electronic GmbH +

Co. KG)

Technical modifications are subject to change.

© Diener electronic GmbH + Co. KG

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Checkliste

2. Baratron Datenblatt dabei

3. MFC Datenblatt dabei

5. Pumpendoku dabei

6.

7.

8.

9.

10.

Dies wird dem Kunden nicht ausgeliefert.

Datenblätter in jedes Kapitel gleich dazuheften.

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1.1 Delivered Components and Description

1.1 Cabinet / Basic Unit

1.1.1 BASIC UNIT TYPE A

•

Dimensions: Width approx. 345 mm

Depth approx. 420 mm (570 mm incl. plugs)

Height approx. 211 mm

1.1.2 BASIC UNIT TYPE B

• Dimensions: Width approx. 560 mm

Depth approx. 600 mm (750 mm incl. plugs)

Height approx. 310 mm

1.1.3 BASIC UNIT TYPE C

•

Dimensions: Width approx. 562 mm

Depth approx. 420 mm

(570 mm incl. plugs)

Height approx. 211 mm

1.1.4 BASIC UNIT TYPE D

• Dimensions: Width approx. 211 mm

Depth approx. 420 mm (570 mm incl. plugs)

Height approx. 570 mm

1.1.5 BASIC UNIT TYPE E

•

Dimensions: Width approx. 500 mm

Depth approx. 550 mm (700 mm incl. plugs)

Height approx. 460 mm

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1.1.6 BASIC UNIT TYPE F

•

Dimensions: Width approx. 500 mm

Depth approx. 550 mm (700 mm incl. plugs)

Height approx. 600 mm

1.1.7 BASIC UNIT TYPE G

• Dimensions: Width approx. 350 mm

Depth

Height approx. 860 mm

1.1.8 BASIC UNIT TYPE H

•

Dimensions: Width approx. 600 mm (850 mm incl. plugs)

Depth approx. 800 mm

Height approx.1700 mm

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SELECTION

GAS SUPPLY

Qty. of gas channels

Material

Description

1 .

.

2 G a s S u p p l l y

2.1

TYPE

A

2.2

TYPE

B

2.3

TYPE

C

2.4

TYPE

D

2.5

TYPE

E

1 2 1 2 3 stainless steel stainless steel stainless steel stainless steel stainless steel needle valve needle valve MFC MFC MFC

Vögtlin Vögtlin MKS MKS MKS

Manufacturer

Available flow values in sccm

on request on request on request on request on request

Figure

The handling of the needle valve is very easy. To control the gas flow and therefore the process pressure, the valve will be opened or closed.

The direction (to open and close the valve) is easily to see.

Please note following things:

•

If the valve is completely closed, the plasma will turn off after consumption of tail gas in the tubes.

• The gas flow ball, in the glass gauge tube of the valve, sometimes gets caught at the upper end of the scale. That

•

•

• happens when the valve has been opened too much. To detach the ball, knock at the security glass of the gauge tube.

Liquids

may damage the needle valve. (Agglutinating of the valve)

Some aggressive solutions and gases (like HNO3, HCl, NH4,

…) may destroy the sealing of the needle valve. If you want to use such chemicals, you should order the Special Option with a Kalrez

– Sealing.

To ensure a long-lasting and save operating with such materials, the complete machine and pump has to be modified

(Corrosive – Gas – Version).

At usage of aggressive gases and chemicals, please contact

us

to clarify if your machine is suitable for this process.

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1 .

.

2 G a s S u p p l l y

There are two variations of MFC’s (Mass Flow

Controller)

Variation 1

: manual control, which has to be controlled like the needle valve

And Variation 2: PC – controlled MFC. Detailed

Information according the handling of PC – controlled

MFC’s you will find in chapter 1.7 Controls, section PC-

Control.

Control MFC

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1 .

.

3 C o n n e c t t i i o n s

1.3.1

Connections for basic unit type A

•

•

•

6mm

Voltage / Power: 230 V / 16 A

Exhaust Air: tube, inner diameter approx. 10 mm

Ventilator

Type label

Connection pump

Main power supply

(220 – 240 V /

50/60 Hz)

Fuse

Timer

Evacuation tube for vacuum chamber

Ventilation

1.3.2

Connection for basic unit type D

•

•

•

Gas:

Voltage / Power: 230 V / 16 A

Exhaust Air: tube, inner diameter approx. 10 mm

Type label

Ventilator

Fuse

Connection pump

Main power supply

(220 – 240 V /

50 Hz)

Gas connection

6 mm Swagelok

Evacuation tube for vacuum chamber

Ventilation

1 Gas connection

6 mm Swagelock

2 Gas connection

6 mm Swagelock

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1 .

.

3 C o n n e c t t i i o n s

1.3.3

Connections for basic unit type H

•

•

•

Gas: Swagelok

Voltage / Power: 400 V / 16 A

Exhaust Air: tube, inner diameter approx. 10 mm

Gas connection 2

Gas connection 1

Main power switch

Evacuation tube for vacuum chamber

Ventilation

Power supply

Gas connection 3

(optional)

Compressed air

Scavenging gas / flushing gas connection

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1 .

.

4 V a c u u m C h a m b e r r

SELECTION

VACUUM

CHAMBER

Chamber configuration

Material: vacuum chamber

Chamber cover

1.4.1

TYPE

A

stainless steel cap

1.4.2

TYPE

B

borosilicate glass cap

1.4.3

TYPE

C

borosilicate glass hinged door

1.4.4

TYPE

D

quartz glass cap

1.4.5

TYPE

E

quartz glass stainless steel hinged door

1.4.6

TYPE

F

hinged door

Covering material

Inner diameter

Opening diameter of recipient

Chamber volume

Application areas

aluminium, glass pane

Dia. 100 mm

D 278 mm

Dia. 100 mm approx.

2 litres standard plasma processes, small batchand laboratory equipment aluminium, glass pane

Dia. 95 mm

D 320 mm

Dia. 90 mm aluminium, glass pane

Dia. 95 mm

D 320 mm

Dia. 90 mm aluminium, glass pane

Dia. 95 mm

D 320 mm

Dia. 90 mm aluminium, glass pane

Dia. 95 mm

D 320 mm

Dia. 90 mm aluminium, glass pane

W 103 mm

D 285 mm

H 103 mm

W 103 mm

H 103 mm approx.

2 litres approx.

2 litres approx.

2 litres for pure plasma processes, small batch- and laboratory equipment for pure plasma processes, bulk production and manufacturing for ultra pure plasma processes, small batch- and laboratory equipment approx.

2 litres approx.

3 litres for ultra pure plasma processes, bulk production and manufacturing standard plasma processes, bulk production and manufacturing

Figure

Cleaning of the chamber:

To clean the chamber a simple oxygen gas process is enough. The process duration should be one hour with an empty chamber (the trays are loaded into the chamber, but no sample parts).

If the machine is heavier contaminated (dusty, thick Polymerization layers), we advise to clean the chamber manual with metal (chrome) polish or a standard trade oven cleaning spray. For harder contaminations you can use steel wool (only in metal chambers).

Never use acetone to clean the chamber!

If you want to clean your machine after a coating process with HMDSO (Hexamethyldisiloxane), a

plasma process with CF

4

(Tetra fluorine methane) and O

2

(Oxygen) is the most effective process.

Use CF

4

only if your machine and pump are made for corrosive gases!

Check

regularly the door seal and the chamber seal of the machine. Dust on the seals may cause

leakage

, which may disturb / irritates some sensitive coating processes. Remove those pollutions before starting the process.

Also check regularly the metal filters at the back of the chamber. Are the filters dark discoloured, it is possible that their pores might be clogged. In this case clean the filters or replace them. The consequences of clogged metal filters are the reduction of the suction power and the pirani sensor might be disturbed in his measurement results (the results might be weighted).

Clean

regularly the chamber window. Remains of coatings may disturb other processes and you keep a better process control if you see the colour and spreading of the plasma.

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1 .

.

5 C a r r r i i e r

SELECTION

TRAYS

Description

Material: Tray

Dimensions

1.5.1

TYPE

A

flat tray

1.5.2

TYPE

B

flat tray aluminium

W 90 mm

D 255 mm

H 3 mm stainless steel

W 90 mm

D 255 mm

H 3 mm

1.5.3

TYPE

C

flat tray

1.5.4

TYPE

D

flat tray

1.5.5

TYPE

E

flat tray

1.5.6

TYPE

F

flat tray

1.5.7

TYPE

G

quartz glass boat

1.5.8

TYPE

H

quartz glass boat borosilicate glass

W 83 mm

D 265 mm

H 5 mm quartz glass

W 83 mm

D 265 mm

H 5 mm aluminium stainless steel

W 100 mm

D 270 mm

H 3 mm

W 100 mm

D 270 mm

H 3 mm quartz glass

2 “

L 200 mm for 15 pcs.

Wafer quartz glass

3 “

L 200 mm for 15 pcs.

Wafer

Qty. of possible trays

on request on request 1 piece 1 piece on request on request 1 piece 1 piece

Application areas

standard plasma processes standard plasma processes pure plasma processes standard plasma processes standard plasma processes standard plasma processes ultra pure plasma processes,

Wafer treatment ultra pure plasma processes,

Wafer treatment

Figure

5.9 Device for powder treatment

•

•

•

•

•

•

Powder is treated in a rotating glass bottle

To fill the bottle, it can be removed from the mounting support

Please note, that the bottle can only be filled to a third of the volume, according to the size to the grain size / product fineness we advise an even smaller amount, because fine powders have bigger surfaces.

A suction filter is necessary at operating with abrasive chemicals

More information can be found in chapter 10 Plasma Processes

Only available with glass chambers

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1 .

.

6 E l l e c t t r o d e s

Selection Of

Electrodes

Title

Suitable For

Following Vacuum

Chambers

Material

Area Of Application

Miscellaneous

1.6.1

Type

A

1.6.2

Type

B

1.6.3

Type

C

1.6.4

Type

D

1.6.5

Type

E

1.6.6

Type

F

standard electrode round standard electrode square multi level electrode round multi level electrode square

RIE-electrode round / square

RIE-electrode with gas shower square stainless steel / aluminium-plate stainless steel / aluminium-plate stainless steel / aluminium-plate stainless steel / aluminium-plate standard plasma processes standard plasma processes standard plasma processes standard plasma processes stainless steel anisotropic and isotropic etching stainless steel anisotropic etching scope of delivery scope of delivery to treat more parts at once to treat more parts at once to achieve higher etching rates to achieve higher etching rates through homogeneous gas spread

Picture

Information concerning electrodes

1. Avoid short circuits. Short circuits may occur, when the Electrode gets in Contact with the chamber wall or when electric conductive sample parts produce a contact between the chamber wall and the electrode.

2. Metals, like stainless steel or aluminium, may start to sputter in little doses caused by constant ion bombardment during the plasma process. Usually that does not bother / disturbs the process in any kind. At very high expectations regarding the cleanness of a product, it is advisable to use a glass chamber instead of a metal chamber.

3. The electrode has to be cleaned in regular intervals. At coating processes in the machine, the interval should be shorter than at cleaning or activation processes. The cleaning intervals are set by user.

4. The closer the carrier is placed to the electrode, the more intense the plasma will work on the surface, whereas a distance of 20 mm to the electrode has to be kept.

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1 .

.

7 .

.

C o n t t r o l l s

At all machines, without reference to the type of control, there are 5 process steps:

1. Pumping down:

Recipient is evacuating to lower pumping down pressure

2. Gas stabilization time:

3. Process time:

4. Flushing time:

5. Venting time:

Gas is feeding in and pressure stabilize automatic

HF-Generator is turned on

Pump is running while purge gas (f.e. Air) rushes into the chamber.

The chamber is flushed from eventually harmful process gases.

Chamber is filling with Air. The pump has to be off.

For more Information see chapter 10 ‘Information According Plasma Processes’ and the brochure ‘Plasma Technology’

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1 .

.

7 .

.

C o n t t r o l l s

1.7.1 Control type A: semi - automatic

•

•

•

The controlling of the process happens semi automatic

Pump, gas flow, plasma process and venting have to be started manual.

Selectable parameters: process time, power, kind of gas, gas flow

The single process steps are selected manual by user:

1. turn on pump

2. turn on process gas

3. set time

4. set power

5. start generator

6. flush

7. vent door electrode main power switch pump venting

gas

generator c a r r r r i i e r r

Set timer a) Version with manual timer (at the back of the machine, see 1.3.1) timer power

HF-generator needle valve scale

0,15 – 3 min

3 – 60 sec

0,5 – 10 sec

0,15 – 3 sec

0,05 - 1 sec

0,5 – 10 min

3 – 60 min

0,15 – 3 h

0,5- 10 h

3 – 30 h

Timer

1 .

.

7 .

.

S t t e u e r u n g e n

1 .

.

7 .

.

C o n t t r o l l s

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Choose the time range accordingly the process:

Example: Process duration

Pre chosen time range

5 minutes

½ - 10 minutes:

At the potentiometer on the front of the machine the time can be varied between ½ und 10 minutes via the scale division parts 0 – 10. b) Version with digital timer: control timer settings

For more Information see chapter 10 ‘Information According Plasma Processes’ and the brochure ‘Plasma Technology’.

•

•

•

•

•

Connect 230 V (16 A)

Turn on main power switch

Turn off venting valve

Load machine

Take the door and push it against the chamber opening (while pump is on)

(Version with hinged door: close door)

This type of control is very comfortable to handle by operating with just one switch.

The single process steps are shown via analog measurement instruments.

1.7.2 Control type B: automatic

•

•

The control of procedures happens automatic

By pushing of the start button the pump, gas flow, plasma process (timer, generator) and venting starts automatically.

• Selectable parameters: process time, power, kind of gas, pressure

Operating with automatic control:

1. Activate main power switch to start up machine

2. Push ‚start’ button

3. Activate and select the process gas (gas channel 1 or gas channel 2), the generator and the venting button (‚flood’)

4. As soon as a pressure of 0.4 mbar is reached the timer, the gas and the generator will enable to start. To install a new program it is advisable to start the process without parts inside. After setting the parameters, a continuous process is possible.

5. Set the timer (see chapter 10.15)

6. Setting of wanted generator power via turning of button (potentiometer). The upper number shows the ten’s, the lower number shows the unit place. The real power is shown in the analog display.

7. Setting of the pressure via needle valve (Regulating the gas flow via opening and closing of the needle valve).

8. Process ends up automatic after expiration of time. Also venting is automatic.

9. The ‚stop’ button exists only to interrupt a running process.

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1 .

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7 .

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C o n t t r o l l s

Documentation for the control-software of the plasma machine (PRS)

Femto-Nano-Pico-Tetra V 4.0

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1 .

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7 .

.

C o n t t r r o l l s

1. General ___________________________________________________________________ 21

2. System requirements, installation_____________________________________________ 21

3. Operating modes___________________________________________________________ 22

3.1.1 Login / Logout_________________________________________________________________ 22

3.2 Operating Modes ________________________________________________________________ 24

3.2.1 Manual Mode ___________________________________________________________________________25

3.2.1.1 Generators____________________________________________________________________________26

3.2.1.1.1 LF-Generator ________________________________________________________________________26

3.2.1.1.2 RF-Generator ________________________________________________________________________26

3.2.1.1.3 RF-Generator with DC-Bias _____________________________________________________________27

3.2.1.1.4 RF-Generator with pulse width modulation __________________________________________________28

3.2.1.2 Matching _____________________________________________________________________________30

3.2.1.2.1 Diener eletronic Auto Matching___________________________________________________________30

3.2.1.2.2 Hüttinger Matching ____________________________________________________________________31

3.2.1.3 Pressure______________________________________________________________________________32

3.2.1.3.1 Pressure control with gases _____________________________________________________________32

3.2.1.3.2 Pressure control with gases or vapor ______________________________________________________32

3.2.1.4 Recipient _____________________________________________________________________________33

3.2.1.5 Pump stand ___________________________________________________________________________34

3.2.1.5.1 Pump stand with rotary vane pump _______________________________________________________34

3.2.1.5.2 Pump stand with rotary vane pump and roots pump___________________________________________34

3.2.1.6 Rotary drive ___________________________________________________________________________35

3.2.1.7 Vaporizer _____________________________________________________________________________36

3.2.1.7.1 Vaporizer with Cycle time and On time _____________________________________________________36

3.2.1.7.2 Vaporizer with two valves _______________________________________________________________36

3.2.1.8 Temperature __________________________________________________________________________37

3.2.1.9 Gas supply____________________________________________________________________________38

3.2. Automatic mode ________________________________________________________________ 39

3.2.1. Pumping down __________________________________________________________________________40

3.2.2. Gas supply time _________________________________________________________________________40

3.2.2.1 Gas supply time without vaporizer _________________________________________________________40

3.2.2.2 Gas supply time with vaporizer with Cycle time and On time _____________________________________41

3.2.2. 3 Gas supply time with vaporizer with two valves _______________________________________________42

3.2.3. Plasma process time _____________________________________________________________________43

3.2.3.1 Plasma process time with LF-Generator without heating_________________________________________43

3.2.3.2 Plasma process time mit LF-Generator or RF-Generator mit Puls width modulation and heating__________44

3.2.3.3 Plasma process time with LF-Generator and rotary drive ________________________________________45

3.2. 3.4 Plasma process time with RF-Generator with matching and with heating ___________________________47

3.2.4. Flushing period _________________________________________________________________________48

3.2.5. Venting period __________________________________________________________________________48

3.2.6. Saving of programs ______________________________________________________________________48

4. Operating _________________________________________________________________ 49

4.1. Start of the automatic mode ______________________________________________________ 49

4.2. Error messages/Alarmlist ________________________________________________________ 53

4.2.1 New list ________________________________________________________________________________54

4.2.2 Old list_________________________________________________________________________________56

4.2.3 Chronicle_______________________________________________________________________________57

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1 .

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7 .

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C o n t t r r o l l s

5. Settings __________________________________________________________________ 58

5.1.1 Gas types ______________________________________________________________________________59

5.1.2 Mass-Flow-Controller _____________________________________________________________________59

5.1.3 Pressure Controller _______________________________________________________________________60

5.1.4 RF generator____________________________________________________________________________60

5.1.5 Rotary drive_____________________________________________________________________________60

5.1.6 Heating ________________________________________________________________________________60

5.1.7 Vaporizer with two valves __________________________________________________________________61

5.1.8 Controller ______________________________________________________________________________61

5.1.9 System ________________________________________________________________________________62

5.1.10 Password _____________________________________________________________________________64

5.1.11 Save _________________________________________________________________________________64

5.1.12 Load factory settings_____________________________________________________________________64

6. Diagram __________________________________________________________________ 65

6.1. Settings _______________________________________________________________________ 65

6.1 Channel dialogue __________________________________________________________________________66

6.2 Y-axis dialogue ___________________________________________________________________________68

6.3 Y-axes dialogue ___________________________________________________________________________68

6.3.1 Axes alignment: _________________________________________________________________________70

6.3.2 Axes __________________________________________________________________________________70

6.3.3 Minimum/Maximum value __________________________________________________________________70

6.3.4 Scaling ________________________________________________________________________________70

6.3.5 Format ________________________________________________________________________________70

6.3.6 Precision _______________________________________________________________________________71

6.3.7 Colour _________________________________________________________________________________71

6.3.8 Y-Axis _________________________________________________________________________________71

6.3.9 Grid ___________________________________________________________________________________71

6.3.10 Zero line ______________________________________________________________________________71

6.3.11 Context menu __________________________________________________________________________71

6.3.12 Function of the diagram __________________________________________________________________72

6.3.13 Functions of the diagram in the manual mode _________________________________________________75

7. Archive ___________________________________________________________________ 76

7. 1 Load... ________________________________________________________________________ 77

7.2. Print __________________________________________________________________________ 77

7.3 Export Process data _____________________________________________________________ 78

8. Maintenance ______________________________________________________________ 79

8.1. General _______________________________________________________________________ 80

8.2. Oil change _____________________________________________________________________ 80

8.3 Backup ________________________________________________________________________ 80

8.4 Leakage rate measuring __________________________________________________________ 82

8.5 Information _____________________________________________________________________ 82

9. Quitting the software _______________________________________________________ 82

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1 .

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7 .

.

C o n t t r r o l l s

1. General

The software ‚Plasma Reaktor Steuerung PRS’ is for the control of a plasma machine.

PRS allows the input of all necessary parameters, and shows all interesting process parameters during the process (process picture and diagram).

There are two operating facilities:

• Manual mode

2. System requirements, installation

To run PRS you need an IBM compatible PC (standard PC, industrial PC) and the operating system Windows 2000 Professional or Windows XP Professional.

To install the software PRS insert the CD-ROM in your CD-ROM drive. Usually it will start automatically the setup program.

If not you can start the setup program in the following way:

Please choose the menu item execute from the start menu of Windows and type:

[Drive]:\setup, in which [drive] is the drive letter of your CD-ROM drive.

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1 .

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7 .

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C o n t t r r o l l s

3. Operating modes

3.1.1 Login / Logout

If the button ‘Login…’ (F9) is pressed the following mask appears:

If the right password is entered and OK is pressed the main picture is shown in the following way:

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1 .

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7 .

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C o n t t r r o l l s

3.2 Operating Modes

There are two operation modes, automatic and manual. The manual mode is only for inauguration and service and is protected by password.

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1 .

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7 .

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C o n t t r r o l l s

3.2.1 Manual Mode

The manual mode is only available if the right password is entered.

Now the manual mode can be used (CTRL+ M Manual).

In the manual mode all operating parameters in the process figure can be entered.

For example the edge valve can be switched manual, the flows of the mass-flow-controllers can be entered singled etc.. Locked control elements show, that the belonging actions cannot be done caused by actual process conditions or safety reasons. (E.g. as long as the edge valve is open, it is not allowed to flush the chamber).

At the process gas flows should be noticed, that they have to be entered in sccm, as long as the pressure controller is not switched on.

After switching on the pressure controller the input of the share of the process gas flows will be done in %.

Notice that the sum of the process gas flows is always 100%.

The input of the maximum gas flows of the mass-flow-controllers will be made in the picture

Settings

, which will be explained exactly in chapter 5.

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1 .

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7 .

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C o n t t r r o l l s

3.2.1.1 Generators

3.2.1.1.1 LF-Generator

Set power value can be entered, the actual power value will be displayed.

The generator must be enabled, if the generator is enabled, the display field next to the button will be switch to green.

3.2.1.1.2 RF-Generator

The operating mode must be chosen (normal or pulse).

Set power value can be entered, the actual forward and backward power values will be displayed.

The generator must be enabled, is the generator enabled, the display field next to the button will be switch to green.

If overtemperature will be detected, the led blinks red and an entry in the Æalarmlist will be done.

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1 .

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7 .

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C o n t t r r o l l s

3.2.1.1.3 RF-Generator with DC-Bias

The operating mode must be chosen (normal or pulse).

Set power value can be entered, the actual forward and backward power values will be displayed.

The actual value of DC-Bias will also be displayed.

The generator must be enabled, is the generator enabled, the display field next to the button will be switch to green.

If overtemperature will be detected, the led blinks red and an entry in the Æalarmlist will be done.

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3.2.1.1.4 RF-Generator with pulse width modulation

Operating mode (normal or pulsed) can be chosen.

Set power value can be entered, the actual forward and backward power values will be displayed.

The generator must be enabled, is the generator enabled, the display field next to the button will be switch to green.

If overtemperature will be detected, the led blinks red and an entry in the Æalarmlist will be done.

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If operating mode “pulsed” is chosen, the period duration and the pulse width can be set.

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3.2.1.2 Matching

3.2.1.2.1 Diener eletronic Auto Matching

Manual can be switched on or off. Set values for C-Load and C-Tune can be entered, the actual values will be displayed.

If the button “Manual” is pressed, the set values will be used for the whole process.

If the button “Manual” is not pressed, the set values will be used as start values for the auto matching.

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3.2.1.2.2 Hüttinger Matching

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Set values for C-Load and C-Tune can be entered, the actual values will be displayed.

If an error will be detected, the “ERR”-led blinks red, errors can be reseted by the resetbutton.

DC-Bias will be displayed.

If the button “Auto” is not pressed, the set values will be used for the whole process.

If the button “Manual” is pressed, the set values will be used as start values for the auto matching.

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3.2.1.3 Pressure

3.2.1.3.1 Pressure control with gases

Input of set pressure and display of actual pressure.

Further the pressure controller can be chosen. Pressure will be controlled by gases.

3.2.1.3.2 Pressure control with gases or vapor

Input of set pressure and display of actual pressure.

Further the pressure controller can be chosen. Pressure will be controlled by gases or vaporizer.

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3.2.1.4 Recipient

The state of the door switch, the overtemperature recipient switch, the interlock vacuum switch and the interlock pirani will be displayed.

As soon as vacuum is in the chamber, the vacuum switch switches and the display field of the switch will be green.

The actual temperature is displayed.

In the manual mode, the flushing valve and the venting valves can be switched (if process conditions allow this).

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3.2.1.5 Pump stand

3.2.1.5.1 Pump stand with rotary vane pump

In the manual mode the edge valve can be switched on/or off. The roots pump switches on automatically 10 seconds after switching the edge valve.

If motor safety device for pump released the LED "Q2" will blink red and an alarm appears in the Æ Alarmlist.

3.2.1.5.2 Pump stand with rotary vane pump and roots pump

In the manual mode the edge valve can be switched on/or off.

The rotary vane pump will be automatically switched on with the main switch.

If motor safety device for pump released the LED "Q2" will blink red and an alarm appears in the Æ Alarmlist.

The roots pump switches on automatically after passing the delay time (Æ Settings) after switching the edge valve (and reaching or underrun the minimum pressure Æ Settings). The roots pump will be switched off with switching off the edge valve.

If motor safety device for pump released the LED "Q3" will blink red and an alarm appears in the Æ Alarmlist.

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3.2.1.6 Rotary drive

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If the button „Postioning“ is pressed, the rotary drive drives until he reaches the limit switch.

“Enable” enables the moving of the rotary drive.

If the supervisory time will be exceeded (ÆSettings) the alarm light “Error” is blinking red.

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3.2.1.7 Vaporizer

3.2.1.7.1 Vaporizer with Cycle time and On time

The vaporizer valve can be enabled. Cycle time and ON time can be entered. The vaporizer will be operated pulse-width modulated.

Tcycle means time of a periode, which consist of Ton and Toff, in wich Ton will be entered as a percentages of Tcycle.

Example: Tcycle is 10 seconds with a Ton of 20%, the corresponding valve is respectively for

2 seconds open and for 8 seconds closed.

3.2.1.7.2 Vaporizer with two valves

In the manual mode the vaporizer valves can be switched on or off manually (if process conditions allows ist).

Cycle times will be set by Æ settings.

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3.2.1.8 Temperature

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Input of set temperature and display of actual temperature (actual temperature is sometimes displayed in recipient visualization).

Further the temperature controller can be chosen.

If the temperature controller is switched off, the heating can be switched on or off manually.

(Button for manual use of the heating is placed in the recipient visualization).

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3.2.1.9 Gas supply

The set value for each MFC can be entered, the actual values will be displayed.

The input will be made in sccm, as long as the pressure controller is switched off. If the pressure controller will be switched on, the share of the gas flows will be entered in %.

Notice: The sum of the shares of the gas flows have to be 100%.

Each valve can be switched.

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3.2. Automatic mode

For the automatic mode the software PRS offers the opportunity to program different processes through the process parameters.

With the function F3 Programs these processes will be created. Creating processes is only possibly, if the user is logged in (password).

100 program places are prepared, in which each program number is belonging to a program name.

A program can be build by subprograms. A program can consist of up to 10 subprograms.

The subprograms will be worked off in numbered order.

Creating of a subprogram will be done in the following sequence:

1. Pumping down

2. Gas supply

3. Plasma process

4. Flushing period

5. Venting period

The process gases which are used can be chosen:

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3.2.1. Pumping down

At this point the input of the Pumping down pressure and the maximum pumping down time will be made. If this time will be exceeded an error message and an entry in the Alarm list appears.

3.2.2. Gas supply time

3.2.2.1 Gas supply time without vaporizer

Duration means that time, which will be waited between the first open of the mass-flowcontrollers and the switching on of the LF-generator. This time should be chosen as long as the desired process pressure needs to stabilize.

At this point the input of the involved gas flows for the process will be made. As in the manual mode, the input will be made in sccm, as long as the pressure controller is switched off. If the pressure controller will be switched on, the share of the gas flows will be entered in %.

Notice: The sum of the shares of the gas flows will always be 100%. The software controls and adapt it automatically.

In addition a maximum deviation can be entered. If this value will be exceeded an error message and an entry in the Alarm list appears. Also the process will be cancelled.

Now the input for the pressure controller will be done. There is the opportunity of switching the pressure controller on or off. The pressure will be controlled by gases.

The last entry at this mask is the desired process pressure and its maximum valid deviation.

If the pressure controller is switched on, this value will be used as the set point for the controller.

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3.2.2.2 Gas supply time with vaporizer with Cycle time and On time

Duration means that time, which will be waited between the first open of the mass-flowcontrollers and the switching on of the generator. This time should be chosen as long as the desired process pressure needs to stabilize.

At this point the input of the involved gas flows for the process will be made. As in the manual mode, the input will be made in sccm, as long as the pressure controller is switched off. If the pressure controller will be switched on, the share of the gas flows will be entered in %.

Notice: The sum of the shares of the gas flows will always be 100%. The software controls and adapt it automatically.

In addition a maximum deviation can be entered. If this value will be exceeded an error message and an entry in the Alarm list appears. Also the process will be cancelled.

The vaporizer can be switched on or off. Cycle time and ON time can be entered. The vaporizer will be operated pulse-width modulated.

Tcycle means time of a periode, which consist of Ton and Toff, in wich Ton will be entered as a percentages of Tcycle.

Example: Tcycle is 10 seconds with a Ton of 20%, the corresponding valve is respectively for

2 seconds open and for 8 seconds closed.

Now the input for the pressure controller will be done. There is the opportunity of switching the pressure controller on or off. The pressure will be controlled by gases.

The last entry at this mask is the desired process pressure and its maximum valid deviation.

If the pressure controller is switched on, this value will be used as the setpoint for the controller.

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3.2.2. 3 Gas supply time with vaporizer with two valves

Duration means that time, which will be waited between the first open of the mass-flowcontrollers and the switching on of the generator. This time should be chosen as long as the desired process pressure needs to stabilize.

At this point the input of the involved gas flows for the process will be made. As in the manual mode, the input will be made in sccm, as long as the pressure controller is switched off. If the pressure controller will be switched on, the share of the gas flows will be entered in %.

Notice: The sum of the shares of the gas flows will always be 100%. The software controls and adapt it automatically.

In addition a maximum deviation can be entered. If this value will be exceeded an error message and an entry in the Alarm list appears. Also the process will be cancelled.

The vaporizer can be switched on or off.

Now the input for the pressure controller will be done. There is the opportunity of switching the pressure controller on or off. The pressure will be controlled by gases.

The last entry at this mask is the desired process pressure and its maximum valid deviation.

If the pressure controller is switched on, this value will be used as the setpoint for the controller.

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3.2.3. Plasma process time

3.2.3.1 Plasma process time with LF-Generator without heating

At this point the entry for the duration of plasma process in hours, minutes and seconds will be made.

The set power and its maximum absolute deviation will be entered. If this value will be exceeded an error message and an entry in the Alarm list appears. Also the process will be cancelled.

The monitorings for actual pressure, actual gas flows and actual powers start after a parameterizable time. If this time is passed the monitoring begins.

The error active time min means, the time which the respectively value has to be out of ranges before an alarm will be generated.

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3.2.3.2 Plasma process time mit LF-Generator or RF-Generator mit Puls width modulation and heating

At this point the entry for the duration of plasma process in hours, minutes and seconds will be made.

The used generator must be chosen.

The set power and its maximum absolute deviation will be entered. If this value will be exceeded an error message and an entry in the Alarm list appears. Also the process will be cancelled.

Fort the RF-generator the operating mode must be chosen. If the operating mode “Pulsed” is chosen, the period duration and the pulse width must be entered.

The set temperature must be entered, also the minimum and the maximum temperature. The process can only be started if the minimum temperature is reached.

The set temperature will be used for temperature controlling (2-point controller with hysteresis).

The monitorings for actual pressure, actual gas flows, actual powers and actual temperature start after a parameterizable time. If this time is passed the monitoring begins.

The error active time min means, the time which the respectively value has to be out of ranges before an alarm will be generated.

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3.2.3.3 Plasma process time with LF-Generator and rotary drive

At this point the entry for the duration of plasma process in hours, minutes and seconds will be made.

The set power and its maximum absolute deviation will be entered. If this value will be exceeded an error message and an entry in the Alarm list appears. Also the process will be cancelled.

The rotary drive must be configured. The state of the rotary drive can be chosen between

“Always on”, Always off” or “Interval”.

If the state „Interval“ will be chosen, the following input dialogue appears:

The „Interval on duration“ and the „Interval off duration“ will be configured by the scrollbars.

The monitorings for actual pressure, actual gas flows, and actual powers start after a parameterizable time. If this time is passed the monitoring begins.

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The error active time min means, the time which the respectively value has to be out of ranges before an alarm will be generated.

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3.2. 3.4 Plasma process time with RF-Generator with matching and with heating

At this point the entry for the duration of plasma process in hours, minutes and seconds will be made.

The operating mode for the RF-generator must be chosen.

The set power and its maximum absolute deviation will be entered. If this value will be exceeded an error message and an entry in the Alarm list appears. Also the process will be cancelled.

For the matching the set values for C-Load and C-Tune must be entered, also Manual matching can be chosen.

If the button “Manual” is pressed, the set values will be used for the whole process.

If the button “Manual” is not pressed, the set values will be used as start values for the auto matching.

The set temperature must be entered, also the minimum and the maximum temperature. The process can only be started if the minimum temperature is reached.

The monitorings for actual pressure, actual gas flows, actual temperature and actual powers start after a parameterizable time. If this time is passed the monitoring begins.

The error active time min means, the time which the respectively value has to be out of ranges before an alarm will be generated.

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3.2.4. Flushing period

At this point the time of pumping down and time of flushing the chamber will be entered.

3.2.5. Venting period

At this point the venting time will be entered. The venting time should be chosen in that way, that in the vessel is atmospheric pressure and the chamber door can be opened.

3.2.6. Saving of programs

The program parameters can be saved with F9 Save. With this saving all programs will be saved, not only the actual created program.

If the program window will be left without saving the actual changes, the following message box appears:

Note: Program changes will be effective after saving!

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4. Operating

4.1. Start of the automatic mode

After creating the process in the picture F3 Programs it can be changed back in the main

picture (F1).

A program can be chosen by the program number; the corresponding program name will be shown.

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If an automatic program should be started, the button “start” must be pressed and the following dialogue appears:

If F2 “Yes” is chosen, the comment input mask appears:

Rank and operator must be filled out, then the button F2”OK” can be pressed and the chosen program will be started.

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If the machine is build up with a heating and the actual temperature is too low, the following dialogue appears:

After using a heat on program the process can be started with If F2 “Yes”, then the comment input mask appears.

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Under the heading „process stage” the actual process step is displayed by green blinking.

Near the actual process step the actual passed step time is displayed.

Stop

stops the actual process, it stops exactly at the point the stop-button is pressed. If a possible evacuated chamber should be vented, it is necessary to change to the manual mode.

The breaking off will also be done if a critical error occurred. An error will be displayed by the red blinking of the error lamp. The corresponding error message can be looked up in the

Alarm list

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During the process runs, the ready lamp is steady green.

If the process has finished the ready lamp will change from green to white (off) and the standby lamp changes from white (off) to yellow.

The Standby lamp changes to yellow if no automatic process has been started and there has no error occured, the machine is ready to be started.

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4.2. Error messages/Alarmlist

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In the alarm list (to reach with F5 Alarm list) all appeared alarms/errors will be listed with date and time of its appearing.

With red letters the incoming alarm/error will be shown and in green letters the gone of the alarm/error.

The horn can be switched on or off.

The alarm list is divided in new list, old list and chronicle.

The alarm list contents on the right margin a menu bar. With this menu bar the different lists can be displayed, alarms can be acknowledged.

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4.2.1 New list

In the new list are all new and not acknowledged alarms listed. The new list can be displayed with the button

in the menu bar of the alarm list.

The following alarms can appear:

• Internal error occured! Please inform service!

• Error occurred in communication with control!

• Emergency-off has been pressed!

• The temperature of the recipient is too high!

• The temperature of the RF-generator is too high!

• Motor safety device for pump released!

• Motor safety device for roots pump released!

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• Motor safety device for rotary drive released!

• Rotary drive doesn't rotate!

• Matching signals an error!

• Chamber door switch open and vacuum switch on! Please check!

• Chamber door switch open and actual pressure less than 1 mbar! Please check!

• Actual pressure is less than 1 mbar and vacuum switch is NOT ON! Please check!

• Actual pressure is greater than 500 mbar and vacuum switch is ON! Please check!

• The operator stopped the process!

• The chamber door is not closed!

• The maximum evacuating duration was exceeded!

• The actual pressure is too low!

• The actual pressure is too high!

• The actual gas flow of gas 1 deviates notably from set value!

• The actual gas flow of gas 2 deviates notably from set value!

• The actual gas flow of gas 3 deviates notably from set value!

• The actual gas flow of gas 4 deviates notably from set value!

• The actual gas ratio of gas 1 deviates notably from set value!

• The actual gas ratio of gas 2 deviates notably from set value!

• The actual gas ratio of gas 3 deviates notably from set value!

• The actual gas ratio of gas 4 deviates notably from set value!

• The actual power of the LF-generator deviates notably from set value!

• The actual power of the RF-generator deviates notably from set value!

•

The actual temperature of the recipient is too high!

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4.2.2 Old list

In the old list all alarms listed, which are acknowledged but still activ.

The old list can be displayed with the button in the menu bar of the alarm list.

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4.2.3 Chronicle

The chronicle contents the last 100 alarms (came, gone and acknowledged) in chronological order.

The chronicle can be displayed with the button in the menu bar of the alarm list.

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5. Settings

At the point F7 Settings there will be made the settings, which not depend on the process but depend on the machine and the customer.

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5.1.1 Gas types

The for the mass-flow-controllers necessary correction factors for the gases will be entered at this point.

5.1.2 Mass-Flow-Controller

The maximum gas flows for the installed mass-flow-controllers have to be entered.

These settings will be done by the supplier and should not be changed in normal case.

Another setting for the mfc’s is the warm up time.

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5.1.3 Pressure Controller

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The input of the parameters of the pressure controller will be done by the supplier and should not be changed in normal case.

5.1.4 RF generator

The ignition power and ignition duration can be set.

5.1.5 Rotary drive

Supervisory time for rotary drive can be set.

5.1.6 Heating

The base temperature for the heating can be set.

The base temperature is the temperature, which will be adjusted anytime even if no automatic process is started.

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5.1.7 Vaporizer with two valves

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The input of the clock times will be done by the supplier and should not be changed in normal case.

5.1.8 Controller

The interface, where the controller is connected, must be chosen.

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5.1.9 System

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At this point it can be chosen, if the data should be saved after the end of process and in which directory it should be written.

Also the automatic data export, which allows reading the exported data with other programs like Excel, can be chosen.

The data will be exported in the tsv/csv format. If the option “Perform at end of process” is chosen, a directory for the saved data can be chosen. A click on the button “…” opens the following dialog:

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Also the option “monthly saving in sub directory (JJJJ-MM) can be chosen. If this option is chosen, a file with the format JJJJ-MM (e.g. 2004-10 for October 2004) will be monthly created. In this file all exported data of one month are saved.

The automatic protocol printout of end of process can also be activated. If this option is activated, it will be printed a protocol at the end of process.

Settings for the comment can be made at this point.

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5.1.10 Password

The interface where the controller is connected can be set.

5.1.11 Save

All settings can be saved with F9 save.

5.1.12 Load factory settings

If the settings have been changed and saved inadvertently, the factory settings (delivery state) can be loaded any time.

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6. Diagram

6.1. Settings

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All process parameter are shown over the process time, each parameter has its own Y-axis.

The displayed channels and Y-axes can be adapted arbitrary, there are different dialogues avaiable:

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6.1 Channel dialogue

The channel dialogue could be displayed in following ways:

Double-click on the area of the diagram, where the channels appears (cursor changes) or right mouse button in an empty space in the legend area of „Properties“ or click the symbol

in the diagram

The following dialog appears:

Channel

: The displayed signals are listed.

Show:

If the signal should be shown in the diagram it must be signed.

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Color

: Every signal assigns its own colour. To change the colour double click on the colour area. The colour dialog opened and you can assign the colours to the signal.

Style: The style of the lines will be chosen at this point.

Line style:

The line style can also be changed in the same way. Double click on the respectively line and the line dialog appears:

Group:

Signal can be put in groups.

Toolbar of the channel dialogue:

Show all: Shows all signals in the diagram.

Hide all: All signals will be hidden.

Show/hide group: If Signals are put into a group, this group can be shown or hidden.

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6.2 Y-axis dialogue

The single Y-axis dialogue could be displayed in following ways:

Double-click on the area of the diagram, where the Y-axis appears (cursor changes) or right mouse button „Properties“.

The following dialog appears:

Label:

Name of the Y-axis.

Display value min/max

: Minimum value and maximum value of the indicating range of the y-axis can changed arbitrary. But make sure that the minimum value in logarithmic display is greater than 0.

Scaling

: Scaling can be linear or logarithmic.

Display format

: The format for the signals can be shown in 4 different formats:

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AUTO: The format, which corresponds best to the data type of the deposit variable.

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FLOAT: Floating point number

EXP: Exponential number

BOOL: Bool (0/1 or TRUE/FALSE)

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Precision

: Number of fractional digit, which are displayed.

Others

: It can be chosen if grid and/or zero line should be shown.

6.3 Y-axes dialogue

The Y-axes dialogue could be displayed in following ways:

Click the symbol in the diagram-toolbar:

The following dialog appears:

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6.3.1 Axes alignment:

The digital channels can be displayed either overlaid side by side or separately one above the other.

The analog channels can be displayed either overlaid side by side or separately one above the other.

The analog and digital channels can be arranged in the following ways:

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Digital axes above and analog axes below

Analog axes above and digital axes below

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Digital axes left and anlog axes right

Analog axes left and digital axes right

6.3.2 Axes

The displayed signals are listed.

6.3.3 Minimum/Maximum value

Minimum value and maximum value of the indicating range of the y-axis can changed arbitrary. But make sure that the minimum value in logarithmic display is unequal to 0.

6.3.4 Scaling

Scaling can be linear or logarithmic. To change between these two kinds of scaling, you have to double click on the area. After that a combo box will open and you can chose the scaling kind.

6.3.5 Format

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The format for the signals can be shown in 4 different formats:

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AUTO: The format, which corresponds to the data type of the deposit variable.

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EXP: Exponential number

BOOL: Bool (0/1 or TRUE/FALSE)

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6.3.6 Precision

Number of fractional digit, which are displayed.

6.3.7 Colour

Every axis assigns its own colour. To change the colour double click on the colour area. The colour dialog opened and you can assign the colours to the signal.

6.3.8 Y-Axis

The label y-axis allows the choice of displaying each signal in the diagram.

6.3.9 Grid

The label grid allows the selection of displaying a grid for each signal in the diagram.

6.3.10 Zero line

The label zero allows the selection of displaying a zero line for each signal in the diagram.

6.3.11 Context menu

With the context menu (right mouse button) further settings can be done:

Hide

: Hiding the y-axis, where the cursor is located (appearing will be done with properties…)

Show grid

: Grid will be displayed

Show zero line

: Zero line will be displayed

Into the foreground

: The chosen y-axis will be displayed as first in the foreground, the others move correspondingly into the background.

Into the background

: The chosen y-axis will be displayed as last in the background, the others move correspondingly into the foreground.

Properties

: The property dialog of the y-axes will be shown.

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6.3.12 Function of the diagram

At the lower range of the diagram there is a function bar.

In this function bar there are 10 buttons and 1 scrollbar.

This button is used for auto scroll on/off. Is this button pressed, the diagram is automatically scrolled, and always the actual record is shown in the visible area.

Remove this button and the scrollbar can be used to regard the history of the process.

Recording of data will not be stopped. If the auto scroll button will pressed again the actual data will be shown in the diagram.

This button is used for auto scaling on/off. If the data record is wider than the screen width, it will be scaled on the half screen width. After the time of one hour, the autoscaling is stopped and the diagram will only be auto scrolled.

This button is used for „Halve time axis range (zoom in)". The time intervals will be smaller and the curve will be wider.

This button is used for „Double time axis range (zoom out)". The time interval will be bigger and the curve will be smaller.

This button is used for adjusting time axis. The following dialog appears:

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The visible range will be adjusted with this dialog, every possible time range can be displayed.

1 .

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7 .

.

C o n t t r r o l l s

This button is used for the y-axes-dialogue (see above).

This button is used for free zooming on/off.

With pressed left mouse key an arbitrary range can be dragged. If the mouse button will be let off, this range will be displayed maximized.

This button is used for restore previous zoom.

- 73 -

1 .

.

7 .

.

C o n t t r r o l l s

This button is used for ruler on/off.

If this button is pressed, two rulers appear in the diagram (at the left and right margin). As well a table is shown where the actual values of the signals between the two rulers are displayed. On this way each signal can be measured.

The rulers can be moved very simply. The mouse will be moved above the ruler until the cursor changes. With pressed left mouse button the rulers can be moved.

This button is used for "Grid on/off".

1 .

.

7 .

.

C o n t t r r o l l s

- 74 -

For all signals, which will be achieved, it will be made a legend automatically.

If one signal should be hidden or shown, the mouse cursor has to be moved above the corresponding signal name until the cursor changes and then double clicking the left mouse button.

6.3.13 Functions of the diagram in the manual mode

These functions of the diagram are only available in the manual mode.

Data logging can be started and stopped manual. If data are logged, they can be saved as an arbitrary name (F10 Save). Saved data can be loaded with F9 (Load). Saved data only can be loaded if data logging is stopped.

Actual displayed data can be printed (F11 Print).

Manual logged process data can be exported (Æ 7.3 Export process data).

- 75 -

1 .

.

7 .

.

C o n t t r r o l l s

7. Archive

In the archive all saved processes including file info can be shown each time.

- 76 -

1 .

.

7 .

.

C o n t t r r o l l s

7. 1 Load...

F9 Load... the „File open dialog“ appears and a file can be chosen and loaded.

If a file is very large (Process time <= 24 h) the loading time could be longer (>= 5 minutes).

At this time the software PRS do not react on inputs, but the active process is still running.

It will be better to load large files only if the process is stopped.

In the saved file are the diagram data and the file info. They can be chosen with the registers below.

The function of the archive diagram is the same as in the online-diagram.

7.2. Print

The loaded diagram, or alarm list or file info (depending on which is actual visible) will be printed on the installed printer.

- 77 -

1 .

.

7 .

.

C o n t t r r o l l s

7.3 Export Process data

At this point all process data or some single process data can be exported.

A file name must be entered for the exported data.

The data will be exported in the *.tsv-format. This format can be imported e.g. in EXCEL or

ORIGIN.

It can be also entered the start date, start time, end date and end time for the exporting data.

In the lower range of the dialog appears the channel list with all available channels. It can be selected all channels, ranges of channels or single channel for the export. The selection is made with the Shift key for range selection and the CTRL key for the single selection.

- 78 -

8. Maintenance

1 .

.

7 .

.

C o n t t r r o l l s

The maintenance parameters can be entered in this mask and the current values will be displayed.

As soon as maintenance must be done (maintenance of the whole plant or oil change of a pump) a red flashing text appears in the main picture.

- 79 -

1 .

.

7 .

.

C o n t t r r o l l s

8.1. General

The most important general parameter is the maintenance interval (input in months).

The date of the next maintenance is displayed. If the maintenance is done, it must be confirmed by the button “maintenance done” and the date of the next necessary maintenance will be calculated and displayed.

Also the date of the last maintenance is displayed and the number of all done processes and operating hours.

8.2. Oil change

The oil change interval of the pump can be entered here. As soon as an oil change has been done, it must be confirmed with the “oil changed” confirmation button.

8.3 Backup

To save the actual settings and programs the button “Backup data” can be pressed.

Then the following dialog will appear, in which the directory for the backup data can be chosen.

- 80 -

If the button „Restore data…“ is pressed the same dialog appears, to select the directory in which the backup data should be loaded and the data will be restored.

- 81 -

8.4 Leakage rate measuring

1 .

.

7 .

.

C o n t t r r o l l s

To do a leakage rate measuring the button “Leakage rate measuring” has to be pressed. The following mask appears:

The pumping down pressure, the duration of measuring and the chamber volume must be input. Then the measuring can be started. During the measuring the actual duration is displayed, after the measuring the leakage rate will be displayed.

8.5 Information

9. Quitting the software

To quit the software PRS the button “X” (right upper edge) have to be clicked.

All programs and settings will be saved.

- 82 -

SELECTION

GENERATOR

Frequency

Power

Pulse function

Impedance matching

Display of forward power

Display of reflected power

Safety switches: vacuum safety switch and door safety switch

Quartz stabilized frequency (+/- 0,05 %)

PC Interface

Main applications

1.8.1

TYPE

A

40 kHz

0 - 100 W

1 .

.

8 G e n e r a t t o r

1.8.2

TYPE

B

1.8.3

TYPE

C

40 kHz 13.56 MHz

1.8.4

TYPE

D

13.56 MHz

0 – 1,000 W 0 - 50 W 0 - 100 W

- - -

9

-

-

9

9

-

9

-

-

9

9

9

9

1.8.5

TYPE

E

13.56 MHz

0 – 100 W

9

9

9

9

1.8.6

TYPE

F

2.45 GHz

0-300 W

-

-

9

-

9

-

9 9 9

-

-

9

-

9 9 9 activation, cleaning, etching, semiconductor

(back-end) plasmapolymerization activation, cleaning, etching, semiconductor

(back-end) plasmapolymerization activation, cleaning, etching, semiconductor

(front-end), semi conductor

(back-end), plasmapolymerization activation, cleaning, etching, semiconductor

(front-end),

Semiconductor

(back-end), plasmapolymerization activation, cleaning, etching, semiconductor

(front-end),

Semiconductor

(back-end), plasmapolymerization activation, cleaning, etching, semiconductor

(front-end),

Semiconductor

(back-end), plasmapolymerization

- 83 -

Manual matching:

1 .

.

8 G e n e r a t t o r

The handling of the manual matching takes a certain extent of patience and sensitivness.

The display ‘Forward’ shows the forward power of the generator (that means the power which is sent into the chamber). The display ‘Reflected’ shows the reflected power of the generator (that means the power which is sent back to the generator). The forward power should meet the value which is expected for the process power. The reflected power is ideally at 0%, but at the utmost 20%, because reflected power may loads or damages the generator.

The matching will be operated with the two rotary knobs C1 and C2, which shift the tuning capacitors.

These two knobs have to be turned slowly, because the matching reacts very sensitive. Keep an eye on the displays during the adjustment.

Beginning with C1 the knobs shall be set in that way, that the forward power is on the maximum and the reflected power on the minimum.

The rolling direction is arbitrary. The capacitor changes within one turn over his complete range.

The matching has to be adjusted at each process start and sporadically controlled and matched during the process.

Handmatching figure:

Chamber

R iG

= Internal Resistance Generator

R iP

= Internal Resistance Plasma chamber

C = Capacitor

- 84 -

1 .

.

8 G e n e r a t t o r

Automatching:

The capacitors will be automatic adjusted and if changes appear automatic readjusted at the automatching.

In case that the operating conditions (pressure, temperature, etc.) change dramatically it might be necessary to restart the adjusting process, therefore press the ‘Reset’ button.

Press the button ‘Retuning’ if the automatching does not find / meet the minimum value of reflected power. The button ‘Retuning’ repeats the fine tuning.

The both light-emitting-diodes (LED’s) ‘Tuned’ and ‘Tuning’ show the tuning status (already done or still in progress).

Automatching figure:

Chamber

R iG

= Internal Resistance Generator

R iP

= Internal Resistance Plasma chamber

C = Capacitor

- 85 -

1 .

.

8 G e n e r a t t o r

LFG - 40 - Generator

Front

3. Power Display

1.

Main Power

Switch with

Indicator Lamp

2. Power (potentiometer for desired value)

5. Green

Indicator Lamp

„LF on“

4. Red

Signal Lamp

„Overheat“

1. Main Power Switch with Control Lamp

2. Power (potentiometer for desired value)

With this potentiometer the desired HF-power value can be adjusted in manual operating mode.

3. Power Display

Shows the real/actual value of the power.

4. Red Signal Lamp „Overheat“

This lamp shines when the generator is overheated.

5. Green Display Lamp “LF on”

It has to be pushed. The lamp shines when the power output is approx. higher than 10%.

- 86 -

1 .

.

8 G e n e r a t t o r

LFG - 40 - Generator

2. LF-output

B:

1. Ventilator

4. Sub-D-connector

3. Type label

6. Power supply line

5. Fuses

1. Ventilator

2. LF-output (electrode-connections)

3. Type label

4. Sub-D-connector for automatic operation mode resp. with dummy plug for manual operating mode.

5. Fuses

6. Power supply line

Accessories:

3. Power supply line

1. Electrode connector line

2. Sub-D-

testconnector

- 87 -

1 .

.

8 G e n e r a t t o r

RFG 13,56 / 100 Generator:

Front

1. Ventilator

RFG 13,56 / 100 Generator:

Back

6. Power supply

1. Ventilator

2. LED „DC on“

Status power supply

3. LED „RF on“

Status high frequency / generator

4. Remote

Connection for control

5. HF output

6. Power supply

- 88 -

2. “DC on”

3. Green indicator lamp

„RF on“

4. Sub-Dconnector for control

5. HF-output

1 .

.

8 G e n e r a t t o r

RFG 13,56 / 300 Generator:

Front

3. Power display

‚Forward Power’

1. Main power switch with

control lamp

4. Green indicator lamp

„RF on“

8. LED overload

3. Power display

‚Reflected Power’

2. Power

(set point potentiometer)

5. LED overheat

6. LED max. power

7. LED +50 V

9. LED pulse

1. Main power switch with control lamp

2. Power (set point potentiometer)

The set point of RF-Power can be set with this potentiometer in manual operating mode.

3. Power display

Shows the real/actual power value of the generator.

4. Green indicator lamp “LF on”

It has to be activated. The lamp shines if output power is higher than approx. 10%.

5. LED overheat

The LED shines if generator is overheated.

6. LED max. power

The LED

shines when the max. power is reached resp. exceeds.

7. LED +50V

8. LED overload

The LED shines if generator is overloaded.

9. LED pulse

This LED is only of matter if you have a pulse generator. It shows the actual operating mode (pulsed or continuous wave).

- 89 -

RFG 13.56 / 300 Generator:

Back

Ventilator

1 .

.

8 G e n e r a t t o r

HF output

Protection conductor / grounding

Fuses

Power supply

Oscillator

Control plug

Ventilator

- 90 -

1 .

.

9 V a c u u m p u m p

Vacuum pumps are necessary to produce a vacuum in the plasma machine’s recipient.

SELECTION

VACUUM PUMPS

1.9.1

TYPE

A

1.9.2

TYPE

B

1.9.3

TYPE

C

1.9.4

TYPE

D

Description

Description

Exhaust filter

Manufacturer

Suction power

(m³/hour)

Oil type

Can work with oxygen, argon and all other usual process gases

The pump can work with corrosive gases

rotary vane pump rotary vane pump rotary vane pump dry pump

9 9 9

-

Leybold Leybold Ilmvac Leybold

1.5 m³ / h 2.5 m³ / h 2 m³ / h 5 m³ / h mineral oil mineral oil mineral oil

-

9

-

9

-

9

9

*

9

-

Figure

* by using CF

4

/ O

2

or SF

6

the pump has a limited life time

- 91 -

1 .

.

9 V a c u u m p u m p

SELECTION

VACUUM PUMPS

Description

Description

Exhaust filter

Al

2

O

3— oil filter

Manufacturer

Suction power

(m³/hour)

Oil type

Can work with oxygen, argon and all other usual process gases

The pump can work with corrosive gases

Figure

1.9.5

TYPE

E

D16B N62 rotary vane pump

9

9

-

1.9.6

TYPE

rotary vane pump

9

9

F

1.9.7

TYPE

9

9

G

rotary vane pump

1.9.8

TYPE

H

D16BCS

PFPE-Al

2

O

3 rotary vane pump

9

9

9

*

Leybold Leybold Leybold Leybold

16 m³ / h mineral oil

* will be needed for etching processes with CF

4

/ SF

6

D16BCS N62 D16BCS PFPE

9

16 m³ / h mineral oil

9

16 m³ / h

PFPE oil

16 m³ / h

PFPE oil

- 92 -

1 .

.

9 V a c u u m P u m p s

* The working life of the pump is limited at using of CF

4

/ O

2

or SF

6 .

Purge gas valve for pump

By the factory made installation (by Diener electronic) of a purge gas valve, a save working method is guaranteed.

The rotary slide pump compress the gas, therefore a oil mist can arise and in worst case it may happen, that a explosive mixture of oil mist and oxygen gas arises.

To avoid this risk the purge gas valve will be installed. The venting prevents the arising of the critical mass.

For better understanding see figure on next page.

Figure: Function of pump with purge gas valve:

O

2

+ N

2

Pressure side

O

2

N

2

O

2

N

2

O

2

O

2

N

2

O

2

O

2

Suction side

O

2

N

2

O

2

N

2

O

2

O

2

N

2

O

2

-Amount < 30 %

Vacuum pump oil

Purge gas valve

N

2

or air

- 93 -

1 .

.

9 V a c u u m P u m p s

Connect vacuum pump with chamber. Place pump below the machine (on the floor) to avoid that in case of malfunction pump oil flows back to the chamber.

Femto Pump

Femto

Pump

Connect exhaust pipe. Exhausts have to be directed to fresh air or a professional exhaust system.

•

Connect pump power supply line at plug ‘Pump’ at the back of the machine.

• Connect process gases (Pre - pressure at gas bottle approx. 0,5-2 bar)

Pumps must not be operated with Cl-, Br- and I- containing gases! Leybold standard pumps

(D16B, …) are working with mineral oil. At corrosive gas resistant pumps we advise to use dry vacuum pumps. Alternative to dry vacuum pumps, there is the possibility to run the pumps with PFPE – oil. This oil is very expensive and the dispose of this oil is also problematic, therefore we discourage about it.

Which pump for which gases?

Pump

D xy

B

Standard Pump

D xy

BCS

Corrosive gas equipment

D xy

BCS PFPE

Corrosive gas equipment

D xy

BCS PFPE-

Al2O3

Corrosive gas equipment

Permitted Gases

argon, helium, hexamethyldisiloxan, carbon monoxide, carbon dioxide, air, oxygen, nitrogen, nitrogen dioxide, nitrogen oxide, hydrogene, ammonia, octafluoro cyclobutane, tetrafluoro methan and all other non-corrosive gases sulfur hexa fluorine, nitrogen tri fluorine and all other non-corrosive gases sulfur hexa fluorine, nitrogen tri fluorine and all other non-corrosive gases

Short name

Ar, He, HMDSO, CO,

CO

2

, O

2

, N, NO

2

, NO,

H

2

NH

3

, C

4

F

8

, CF

4, and

Ar, He, HMDSO, CO,

CO

2

, O

2

, N, NO

2

, NO,

H

2

SF

6

, NF

3

, and

Ar, He,

HMDSO, CO, CO

2

, O

2

,

N, NO

2

, NO, H

2

SF

6

, NF

3

, and

Ar, He,

HMDSO, CO, CO

2

, O

2

,

N, NO

2

, NO, H

2

- 94 -

1 .

.

9 V a c u u m P u m p s

Pump – Connections

Pump S 1.5:

Purge gas valve

Connection vacuum pipe

Power supply machine

Pump 2.5:

Power supply machine

Power supply pump

Power supply pump

- 95 -

Connection vacuum pipe

Connection vacuum pump

On / Off switch

Connection for power supply pump

Exhaust pipe with filter

Exhaust filter

Exhaust pipe

Vacuum pipe

Pump SC5D:

Power supply machine

1 .

.

9 V a c u u m P u m p s

Pump PK2DC:

Connection vacuum pipe to pump

Connection vacuum pipe

Power supply machine

Power supply pump

Connection vacuum pipe

Connection for power supply of pump

Exhaust filter

Exhaust pipe

Connection pump with vacuum tube

- 96 -

1 .

.

9 V a c u u m P u m p s

Pump D16B; D16BCS; D16BCS PFPE; D16BCS PFPE-Al2O3

Connection vacuum pipe

Exhaust tube

Power supply machine Connection power supply pump

- 97 -

1 .

.

1 0 O p t t i i o n s

1.10.1 Spare Part Set – Standard

•

•

•

•

•

1 clamping ring + 1 seal

1 glass window

1 door seal

10 pcs. fuses for plasma machine

1 litre mineral oil for vacuum pump

1.10.2 Spare Part Set – PFPE

•

•

•

•

•

1 clamping ring + 1 seal

1 glass window

1 door seal

10 pcs. fuses for plasma machine

1 litre PFPE-oil for vacuum pump

1.10.3 Corrosive Gas Version

•

•

•

•

Valves made of stainless steel

Piping made of stainless steel

Machine is permitted to operate with corrosive gases (NH

The machine must not be operated with Cl2, F2, BCl3,…

3

; H

2

O ; CF

4

; SF

6

…)

- 98 -

1 .

.

1 0 O p t t i i o n s

•

•

•

•

•

1.10.4 Pressure Regulatores

For connection to the gas bottle - 200 bar

Available / pressure: 200 bar

Different gases require different pressure regulators

Pressure regulators for noble gases, H

Pressure regulator for NH

3

2

, O

2

, N

2

, CF

4

, C

4

F

8

connector no. permitted gases

1

3

5

6 methane, silane, hydrogen acetylene carbon monoxide ammonia, argon, helium, hexafluoroethane, carbon dioxide, sulfur hexafluoride, tetrafluoromethane

thread

W 21,80 x 1/14" LH connection for clamp

1" LH

W 21,80 x 1/14"

8

9

10 hydrogen chloride, nitrogen dioxide oxygen nitrogen

1"

G 3/4"

W 24,32 x 1/14"

- 99 -

1 .

.

1 0 O p t t i i o n s

1.10.5 Hot Plate

The parts will be placed on the hot plate.

The hot plate can be heated up to a max. temperature of 150°C

For defined process conditions, higher etching rates

•

•

•

•

•

Temperature Monitor

• A thermo sensor will be mounted in the vacuum chamber

Therewith it is possible to measure e.g. the surface temperature of the part

Short Manual:

To switch between the monitorings press ‚Return’ button.

To set a heating up temperature change value in first display (sign on the left: arrow up). To set a maximum temperature, press ‘Return’ button and set the temperature. In this mode the LED ‘AL’ for alarm shines.

The temperature can be changed with the arrow buttons.

For more information see data sheet of manufacturer.

Remark: This short manual is only of importance if a heating element is installed!

Otherwise the instrument works just as a display not as controller.

or

Temperature Monitor Incorporated In PC Control

•

•

A thermo sensor will be mounted in the vacuum chamber

Therewith it is possible to measure f.e. the surface temperature of the part

• The temperature is shown on the screen.

- 100 -

1 .

.

1 0 O p t t i i o n s

1.10.6 Heatable Chamber

•

•

•

The chamber can be heated up to approx. 80 °C

The temperature is adjustable.

For defined process conditions, higher etching rates

1.10.7 Faraday Box / Cage

•

•

•

For electric sensitive parts

The parts will be placed at the inside of the box.

The Faraday Box can be moved out of the vacuum chamber.

1.10.8 Monomer Bottle

•

•

•

•

Accessory for polymerizations

To connect liquid monomeres with the vacuum chamber

Connection is only possible with needle valve, not with MFC!

PC – controlled machines need extra valve!

Figure: Connection monomer bottle

chamber

- 101 -

1 .

.

1 0 O p t t i i o n e n

•

1.10.9 Bubbler Bottle:

•

•

•

Accessory for polymerization

To connect liquid monomeres with the vacuum chamber

Works with carrier gas instead of a simple monomere bottle

Carrier gas (e.g. Argon) is flushed through the monomere. figure: Connection bubbler bottle with needle valve

Safety valve

(Kalrez) needle valve chamber

figure: Connection bubbler bottle with MFC

Safety valve

(Kalrez) chamber

1.10.10 Test Ink Set

•

•

•

Test inks for an easy analysis of the surface energy.

Included sizes in ink set: 28, 38, 56, 64, 72 and 105 mN/m

Other values are available on request.

For more information see brochure ‚Plasma Technology’.

- 102 -

1 .

.

1 0 O p t t i i o n s

1.10.11 Oxygen Generator

•

•

•

Oxygen will be produced out of air.

Type: Kroeber O

2

6

For more information see data sheet of manufacturer.

1.10.12 Pressure Measurement

• Pirani Sensor

1.

The pirani sensor measures the pressure in the vacuum chamber at a process pressure below 10 mbar.

The pirani sensor itself is made of a thin metal wire.

This wire has a resistor of approx. 2.5 Ω at atmospheric pressure.

The resistor rises with lower pressure, when the wire is heating up by current flow (approx. 0.1 A).

- 103 -

1 .

.

1 0 O p t t i i o n s

Pirani Measurement

2. Test of Pirani-Sensor:

To test the sensor, the resistor should be tested with an ohmmeter. Before the testing, the plug for the pirani sensor has to be disconnected.

The resistance has to be between 2.2 and 2.6 Ω.

P 4

P 2

P 1

Plug for

Pirani Sensor

M 1

P 3

GND

Voltmeter

Setpoint Voltage: 9.9 V

M 1 against GND

P 1 – P 4: Potentiometer

Relais

- 104 -

1 .

.

1 0 O p t t i i o n s

3. Calibration of Printed Circuit Board (PCB):

3.1. The PCB has to linger with all connections in the machine.

3.2. Ventilate the vacuum chamber.

3.3. Apply voltmeter to M1 and GND.

3.4. Adjust 9.9 V with the potentiometer P3.

3.5. Check the adjusted value:

PC-controlled machine: 9.99 mbar other machines: 10 mbar

3.6 Now evacuate vacuum chamber.

3.7. The relay will turn on / off the gas supply and the generator.

3.8. Lower switchpoint: The LED shines green at a pressure below 0.3 mbar (adjust with P1).

In special cases, the pressure can be raised up to max. 1 mbar.

Normally the machine has to be pumped down to a pressure of approx. 0,3 mbar.

In special cases (heavy outgasing parts) up to approx. 1 mbar.

3.9. Upper switchpoint: The LED turns off at a pressure over 0.4 mbar (adjust with P2).

For safety reasons the gas supply has to be closed at a process pressure over 4 mbar, for the same reason the generator turns off.

3.10. The PCB is a window comparator, the machine works with a pressure between 0.3 and 4 mbar.

Prozess- druck

4 mbar

0,3 mbar

© Diener electronic GmbH + Co. KG

- 105 -

1 .

.

1 0 O p t t i i o n s

1.

10.13 Pressure Measuring Instrument

•

•

•

Baratron

Manufacturer: MKS ( www.mksinstruments.de

Designated use: mainly for processes with CF

)

4

1.10.14 Power Display

•

•

Shows the actual power of the generator.

Analog display

1.10.15 Timer LT4H – Instead Of Standard Timer

•

•

To set process time

Manufacturer: NAIS, Type LT4H

Operation Of Timer:

1. The timer turns on automatic at running machine, when the pressure setpoint is reached (0.4 mbar).

2. The timer setting is installed into minutes by standard (max. 999.9 minutes), if you want to change the settings into hours or seconds, you have to open the machine

(left or right side wall). There you find the back of the timer. Then follow the instructions in the manual of the timer.

3. To adjust the time, press the arrow keys up or down. The numbers in front of the comma are ‚real’ numbers, the place behind the comma is indicated in tenth. (e.g.:

15.5 on the timer display means: 15 minutes and 30 seconds).

4. To confirm the process time press ‚Reset’.

5. At starting the generator, the time will run down. That means you see how many time to the end of the process is left.

6. The generator stops / turns off automatic after course of time.

- 106 -

1 .

.

1 0 O p t t i i o n s

1.10.16 Process Gas Bottle

•

Oxygen

– gas bottle as process gas

•

Hydrogen

– gas bottle as process gas

•

Argon

– gas bottle as process gas

Purity Of Gases:

In general gases with technical purity are used. Do you want to treat parts with a very high demand on the surface purity so choose a gas with high purity.

This is relevant special for semi conductor front end processes or analytic applications

(SEM, …).

For more information to the gases see chapter 10 Information According Plasma

Processes.

10.17 2/2 Directional Valve For Liquid Feed Regulation

• Valve for defined dosing of monomers valve voltage pressure chamber

The liquid dosage is regulated by the continuous opening and closing of the valve.

Induced by these delays (hysteresis) small pressure fluctuations occur, which do not disturb the process too much. See figure below.

Setpoint: 0.3 mbar

Hysteresis: 0.1 mbar

- 107 -

1 .

.

1 0 O p t t i i o n s

10.18 Safety Valve

• Safety valve for operating with H

2

To guarantee a safe operating with hydrogen, we offer a safety valve, which will be mounted between MFC and chamber. This safety valve prevents, that the chamber might sucks air when the machine is off and therefore might an explosive mixture of air and hydrogen arises. The critical point of an air-/hydrogen mixture arises when hydrogen amounts 4% in air.

This safety valve betters the leak rate of the machine.

10.19 Slowly Venting of Vacuum Chamber

•

•

The vacuum chamber will be vented slower by installing a filter.

The gyrate of small parts will be prevented.

10.20 Slowly Pumping Down of Vacuum Chamber

•

•

The chamber will be slowly pumped down by bypass valve.

The gyrate of small parts will be prevented.

10.21 Bias Voltage Measurement

•

•

Measurement Device

The bias voltage measurement is available for kHz – and MHz – generators.

The electrode loads negative during the process period (the small electrons meet/hit the electrode more often than the bigger slower protons) therefore results a negative bias voltage.

Some semi conductors must not outrun a specified value of bias voltage, because they might be damaged.

The bias voltage measurement device is available (optional) to visualize these values for a process control.

At high sensitive semi conductors it is advisable to use a faraday cage. See paragraph

1.10.7.

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10.22 Laundry Bag

•

•

•

For the precleaning of small parts in a washing machine.

Dimensions: 500 mm x 300 mm

Minimum order: 20 pieces

10.23 Washing Machine / Dryer

•

•

•

For the first cleaning of small parts before the plasma treatment.

Only necessary at heavy polluted parts.

Manufacturer: Miele: Type WT 2670 WPM

10.24 Lacquer Spray / Glass Plates – Set (LABS-Free Test)

•

•

•

Lacquer spray in cans, 5 pieces each 400 ml

Glass plates, 100 pieces, each 90 mm x 110 mm

Accessory for LABS – test (german: Lack-Benetzungs-Störungs-Test)

This test is a quick qualitative analysis for releasing agents remains on a surface.

For more information see chapter 10 Information According Plasma Processes.

10.25 Water Cooled Carrier Plate

•

•

•

The water cooled plate will be mounted on chamber ground.

Incl. water pump and tank

For cooling of thermo sensitive parts.

10.26 TEM Carrier

•

•

Special device for introducing from the outside of the chamber.

Each size is feasible. Please send us the dimensions / drawings of your parts.

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10.27 OES – Optic Emission Spectrometer

•

•

•

Supervising of plasma processes for quality assurance.

Detection of plasma process endpoint.

OES only in combination with PC – controlled machine.

The optic emission spectroscopy offers a possibility for online process supervising of low pressure plasma processes.

For the process supervising the optic emission of plasma will be recorded and spectral analysed.

The radiation that comes from plasma is characteristic for the procedures which happen during a plasma process.

That’s the way online quality assurance, appropriate and also a control of plasma processes for the treatment of parts can be realized.

For instance it is possible to detect, if and at which moment the treated parts get an adequate plasma cleaning (detection of process endpoint). The endpoint detection is on many etch – and ashing – processes applicable. fig.: Picture of emission spectra of low pressure plasma for process supervising by OES. fig.: Screenshot of process supervising by optic emission spectroscopy (OES).

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10.28 Further Software Features

•

•

The Software can be upgraded anytime for further features.

Please tell us your requirements.

10.29 Maintenance Quote for Your Plasma Machine

•

•

•

•

• oil change control of all connections, seals, plugs,… leak rate test adjustment of pressure sensor function check –out

10.30 Documentation In National Language

•

•

•

Documentation by macchine guideline 89/392/EWG

Not valid for the languages german and english.

This option is not automatic contained with machine and has to be ordered separate.

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2.

C o n n e c t t i i n g T h e M a c h i i n e

1. Place machine on table or on the place you supposed for it.

2. Place pump on the floor.

3. Remove protective caps from pump and machine.

Femto

Pump

4. Place seals between vacuum tube and junctions

(1x machine, 1x vacuum exit of pump), before mounting the clamp to fix the tube with the junctions.

5. Connect exhaust tube with pump. Normally a picture is sticked on the pump by the manufacturer, which clearly shows the in- and output of the suction power.

or

6. Connect power supply of pump with machine. (The connections are obvious marked on the back of the machine.) Turn on main power switch of pump. See pictures below: or

7. Connect power supply of machine with mains.

8. Connect gas tube with machine and gas bottle. order for connection of gas

9. Adjust max. a pre-pressure of 2.5 bar at the gas bottle!

gas connection on machine

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2.

C o n n e c t t i i n g T h e M a c h i i n e

10. The operating mode of machine is according to installed control (semi-automatic, automatic or PC – control). Find more information to the controls in chapter 1.7 Controls.

As a matter of principle read following procedure for the plasma treatment: a) Load chamber. b) Press cover / door against chamber opening.

Important:

pay attention to the door switch. The door switch has to build a contact with the door, because the generator can not ignite without this contact (safety switch).

The door switch is located next to the door seal.

Mostly on the left side horizontal. c) Turn on pump (’Pump’ button), press door against chamber opening until it will be primed. d) Adjust time (main interval at the back of the machine, process time at the potentiometer at machine front). More information in chapter 1.7 Controls. e) Turn on gas supply (’Gas’ button) f) Adjust desired gas flow or pressure. g) Adjust the desired generator power. At semi-automatic and automatic machines, the power will be adjusted via a potentiometer. The upper row of numbers shows the tenth, the lower the unit place. See figures below:

100% power power h) Start generator (The generator turns off automatic after cycle of time.) i) Turn off pump, by pushing of ‚Pump’ button. j) Vent chamber („Vent“ or „Flood“) k) When chamber is ventilated, the door let’s easily open/remove.

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3.

F e a t t u r e s o f f M a c h i i n e f f r o m C u s t t o m e r X Y Z

Hardware:

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

Software:

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

__________________________________________________________________

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4 .

.

S a f f e t t y G u i i d e l l i i n e s

•

Voltage

• The altitude of generators idle may has until approx. 2000 V! Handle with care!

The machine has to be connected with a power supply system, which voltage is conformable with specification on type label.

0H

• Diener electronic GmbH & Co. KG does not grants liability for defects caused by incorrect usage (e.g. short circuit caused by unsuitable power supplies)!

Damp Rooms

• The plasma machine is not moisture proof.

The machine must not be used in damp rooms.

•

Short Circuit

The electrode must not be circuited. Conductive parts must not touch the electrode.

Thermic Endanger

• The electrode may become hot during operation. Take care while loading the machine, to not touch the electrode (to avoid burn).

Process Gas

•

•

•

• Check for leaks in the pipes before any start.

It is forbidden to produce explosive gas mixtures in the chamber.

The machine must not be operated with flammable gases.

Please note the appropriate rules (TRG) of each process gas.

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.

S a f f e t t y G u i i d e l l i i n e s

Gas Ballast

• At operating with oxygen the gas ballast valve has to be open. (see manual vacuum pump).

Exhausts

•

•

Exhausts have to be piped into fresh air/ outside.

Outlet of exhaust pipe must not be closed, to not destroy pump.

•

Aggressive Liquids

Needle valves may be destroyed by agggressive liquids (formic acid).

Standard

(brass pipes, oil pump) argon, helium, hexamethyldisiloxan, carbon monoxide, carbon dioxide, air, oxygen, nitrogen, nitrogen dioxide, nitrogen oxide, hydrogen,

short

Ar, He, HMDSO,

CO, CO2, O2, N,

NO2, NO, H2

Corrosive Gas

Equipment

(stainless steel pipes, dry pump) ammonia, octafluorocyclobutane, sulphur hexafluorine, nitrogen trifluorine, tetrafluoromethane and all non-corrosive gases

NH3, C4F8, SF6,

NF3, CF4

Following materials must never be connected with our machines:

Bromine, chlorine, iodine, bortrichlorine, tetrachloromethane and all other chlorine containing and high corrosive materials.

The company Diener electronic GmbH & Co. KG will not grant liability for damages on the machine which are caused by using those materials (corrosive gases on standard machines and oil pumps)!

Please contact us before using aggressive gases and chemicals to clarify if your machine is suitable for those processes.

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4 .

.

S a f f e t t y G u i i d e l l i i n e s

•

•

•

Power Plug

Do not pull out power plug on wire.

In case that the power plug of the plasma system is damaged it has to be replaced, to avoid endanger.

Before open the cabinet, pull power plug.

Animals

•

Animals must not be encased in the plasma system.

Contaminations

• Try to avoid contaminations like dust, dirt, glass- and metal splinters before and during the operation. Those can damage the machine permanent and change the effect of the plasma treatment as well.

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.

S a f f e t t y G u i i d e l l i i n e s

•

•

•

Maintenance and Repair

The maintenance has to be done on demand by Diener electronic GmbH + Co. KG.

Only mineral oil from Diener electronic must be refilled into the pump. We don’t use fluorine containing oil. Therefore the pumps can be used for oxygen processes.

Do not perform unlicensed changes on the machine.

•

Repairs on this machine are only permitted by experts of Diener electronic

GmbH + Co. KG. Otherwise the liability expires.

Further Manuals

•

Please follow all information in the supplied manuals!

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5 .

.

M a i i n t t e n a n c e

4.1. Pump

•

•

• Check oil level daily.

Please follow manual of pump manufacturer.

For oil change interval see manual. The oil change has to occur every 3 months.

4.2. Safety Components

•

Check following components semi-annual (see circuit diagram):

6.2.1. door switch

6.2.2. vacuum switch

6.2.3. relay on PCB

6.2.4. timer

6.2.5. valves

•

4.3. Cleaning

• For the cleaning of the outside of the plasma system use only a light wet cloth. For the cleaning of the chamber see chapter 1.4 Vacuum

Chamber. Never use solvents for the cleaning!

Stainless steel recipients are easier to clean with chrome polisher. Therefore remove / uninstall electrode previously.

•

4.4. Seals

The door seal should be wiped off every day and semi-annual changed.

4.5. Electrode Retainer

•

•

•

•

• Please test / check electrode retainer for leaks:

Pump off machine

Start plasma process

Wet electrode retainer with ethanol

The plasma colour should not change from purple into light blue.

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.

T r o u b l l e s h o o t t i i n g

Fault Possible cause

gas line is not opened

Remedy

open gas line plasma system running, plasma not burning door can not be opened needle valve is closed open needle valve short circuit, caused by conductive parts touching the electrode place conductive parts in that way, that they don’t touch the electrode pump is still running turn off pump protections trips / fuse blows pump is still cold (room temperature < 20° C) regard on a room temperature higher than 20° C power switch on pump is off turn on power switch pump not running plasma turns off machine doesn’t start the generator power plug of pump is off check power plug and plug in needle valve is closed, no gas flow comes into the recipient, therefore generator is not able to support power open needle valve and adjust gas flow needle valve is opened too much close needle valve and decrease gas flow

Otherwise: Contact our service technicians!

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S p a r e P a r t t L i i s t t F e m t t o

Description

Metal filter

Order no.

28849

Filter ring 26672

29036 O-ring seal for ignition coil

O-ring seal for ignition coil – silicone

Electrode bushing (ceramic)

(ignition coil)

KF-seals (set) 10511

29355 Glass seal Femto

Door seal Femto 29356

27108 O-ring 130x5mm

O-ring 130x5mm, silicone red 30725

O-Ring 66x4mm 27109

Price / piece

20.00 EUR

25.00 EUR

? EUR

30.00 EUR

? EUR

? EUR

? EUR

2.00 EUR

? EUR

Timer

Oil for vacuum pump (5 litre)

N62

Vacuum switch

28777

10058

120.00 EUR

40.00 EUR

As of: 2008-07-01

Minimum order value for spare parts: 50,00 EUR

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S p a r r e P a r t t L i i s t t F e m t t o

Description

MFC Viton 10sccm

MFC Viton 20sccm

MFC Viton 50sccm

MFC Viton 100sccm

MFC Viton 200sccm

MFC Viton 500sccm

MFC Viton 1.000sccm

MFC Viton 5.000sccm

MFC Viton 2.000sccm

Order no.

27513

26283

26548

26618

26549

26550

27514

27904

30591

MFC Kalrez 10sccm

MFC Kalrez 100sccm

MFC Kalrez 200sccm

MFC Kalrez 500sccm

MFC Kalrez 2.000sccm

MFC Neoprene 200sccm

29816

30475

29531

28872

28912

29815

Price / piece

1550.00 EUR

1550.00 EUR

1550.00 EUR

1550.00 EUR

1550.00 EUR

1550.00 EUR

1550.00 EUR

1550.00 EUR

1550.00 EUR

1550.00 EUR

1550.00 EUR

1550.00 EUR

1550.00 EUR

1550.00 EUR

1550.00 EUR

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S p a r r e P a r t t L i i s t t F e m t t o

Description Order no.

needle valves of manufacturer Vögtlin float-type flow meter

40-430 sccm, stainless steel float-type flow meter

10-100 sccm, stainless steel float-type flow meter

200-2200 sccm, stainless steel float-type flow meter

2,5-25 sccm, stainless steel

Price / piece

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.

E C

-

D e c l l a r a t t i i o n o f f C o n f f o r m i i t t y

We hereby declare that our plasma systems in the

Diener electronic GmbH + Co. KG

Talstr. 5

D-72202 Nagold

Production series: Femto, Pico, Nano, Tetra 30, Tetra 100 und Tetra 150

in the versions that we placed on the market, meet the following fundamental safety requirements. This declaration loses its validity where a modification is made without our agreement.

Applicable EU Directives:

Applied, harmonized standards:

EU Machinery Directive 98/37/EC

EU EMC Directive (2004/108/EEC)

EU Low Voltage Directive (73/23/EEC)

EN 12100 Parts 1 and 2

EN

EN 61000-4-2 (ESD)

EN 61000-4-4 (EFT/burst)

Applied national standard: VDE

Nagold, dated 2008-07-01

Diener electronic GmbH + Co. KG

Christof Diener

Managing Director

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9 .

.

W a r r r a n t t y

The warranty is for 1 year commencing on the date of the invoice.

If you have any problems with your plasma system, we'll be very pleased to help. Please call us on:

Tel: 00 49 74 52 8 88 07 0

From USA: 011 49 74 52 888 07 0

During the warranty period:

The faulty plasma system can be sent back to us. You will receive a new or repaired device in return.

After the warranty period runs out:

You can also send the faulty device to the address below for repair. A charge will then be made for the repair.

The warranty is invalidated if the device is misused or handled incorrectly, if excessive force is applied, or in the case of intervention by anyone other than ourselves.

For repair purposes, please pack the plasma system carefully and send it to:

Diener electronic GmbH + Co. KG

Talstr. 5

D-72202 Nagold

Germany

Tel.: 00 49 74 52 888 07 0

From USA: Tel.: 011 49 74 52 888 07 0

Fax: 00 49 74 52 888 07 50

E-mail: [email protected] www.plasma.de

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Directory Plasma Process:

10.1

10.2

Parameters…………………………………………………………………………………

Materials….…………………………………………………………………….…………..

10.3

10.4

Spread of plasma………………………………….…………………….………………..

Pressure of gas bottle…..………………………………………………………………

10.5 Selection of gases…………………………………………………………………………

10.5.1

10.5.2

Purity of gases……………………………………………………………………………

Selection of pressure regulator………………………….……………………………… piping…………………………………………………………………………………

10.7 Gas bottle safety guidelines……..……………………………………………………… consumption………………………………………………………………………….

10.9

10.10

Gas correction factor (GKF)……………………………………………………………

Process parameters in general………………………………………….……………….

10.10.1 Cleaning……………………………………………………………………………………

10.10.1.1 Cleaning of metals…………………………………………………………..

10.10.1.2 Cleaning of plastics………………………………………………………...

10.10.1.3 Cleaning of glasses and ceramics…………………………………………

10.10.2

Activation metals…………..……………………………………………

Activation plastics…………………………………………………………

Activation glasses and ceramics…..……………………………………

Activation powders.………………………………………………………

Etching……………………………………………………………………………………

10.10.3.1 Etching of metals…………………………………………………………

10.10.3.2 Etching of plastics….………………………………………………………

10.10.3.3 Etching of glasses and ceramics…………………………………………

10.10.4 Coating by means of plasma polymerization…………………………………………

10.10.4.1 Coating of metals…… ……………………………………………………...

10.10.4.2 Coating of plastics…………..……………………………………………….

10.10.4.3 Coating of glasses and ceramics……….…………………………………

10.10.4.4 Coating of textiles……..……………………………………………………

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In the following chapter you will find some information, which shall help you to find the right process parameters.

10.1 Parameters:

These parameters are not exact specifications, which refer to our standard systems. For the parameters it doesn’t matter what kind of generator is installed.

10.2 Materials:

Regard the product attributes concerning sensitivity to heat, UV or single process gases, by choosing the process parameters.

10.3 Spread of Plasma:

For an optimal plasma treatment, the plasma has to be spread equable into the chamber (see pictures).

air plasma (kHz – generator) oxygen plasma (kHz-generator)

RIE – plasma (MHz – generator) microwave plasma, with radiation protection

10.4 Pressure of gas bottle:

Pleas check the pressure of the gas bottle before starting the process (Is there enough gas in the bottle?) and check the adjusted pre-pressure on pressure regulator (pre – pressure not higher than

2,5 bar, because MFC may be damaged).

Display pre-pressure

Display (pressure of bottle)

Connection to bottle

Valve (Connection bottle to chamber)

Connection for tube

Regulation pre – pressure

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10. 5 Selection of gases

To select the right gases for the different plasma processes, look for information in the chapters cleaning, activation, etching and coating according to your application.

10.5.1 Purity of gases:

Most commonly used are gases with technical purity, if you want to treat parts with very high requirements to the surface purity, choose a gas with ultra high purity.

This applies special to semi-conductor-front-end – processes or for analysis applications (SEM,…)

10.5.2 Selection of pressure regulator:

There are some standard pressure regulators for oxygen, flammable gases (e.g. hydrogen) and noble gases (e.g. argon), also there exist some special pressure regulators for special gases. To select the right pressure regulator, see table below.

Standard Pressure Regulator:

O

2

– pressure regulator

Special Pressure Regulator:

Ar – pressure regulator H

2

– pressure regulator

CO – pressure regulator NH

3

– pressure regulator

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Find following table as an overview to select the right pressure regulator for your gas bottle.

For special gases ask your local gas supplier.

Gas connections according to DIN 477:

Connectionno.

1

3

5

Allowed gases

methane, silane, hydrogen acetylene carbon monoxide

Threads

W 21,80 x 1/14" LH

Anschluss für Spannbügel

1" LH

6 ammonia, argon, helium, hexafluoroethane, carbon dioxide, sulfurhexafluoride, tetrafluormethane

W 21,80 x 1/14"

9

10 oxygen nitrogen

1"

G 3/4"

W 24,32 x 1/14"

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10.6 Gas piping

Our machines are equipped with swageloks of the size 6 mm, therefore you need stainless steel tubes with an inner diameter of 4 mm and an outer diameter of 6 mm to observe the regulation TRGS (no.

220) for gas piping.

To open and close the piping you will need an open-end-wrench with a size of 14 mm. For laboratory operation with incombustible and non-toxic gases you can use pressure resistant flexible tubes (PUhose with Ø outside: 6 mm, Ø inside: 4 mm) instead of stainless steel tubes.

Quite safely gases are: N

2

, O

2

, noble gases, CF

4

,

Etching gases like NF

3

and NH

3 have to be piped with stainless steel.

At use of special gases contact your local gas supplier.

More information on www.swagelok.com.

10.7 Gas bottle safety guideline:

To ensure a riskless operation with gas bottles note following things:

•

Store gas bottles in suitable containers at the outside of the building (if possible).

•

In case that it is not possible to store the containers outside (by structural engineering of the building), the gas bottle has to be protected from impacts and falling down. Therefore special equipment is available, like bottle retainers with chains.

•

Check fitting for leaks by connecting the fitting with the bottle. At obscurities check the fitting audible (is there a hissing to hear?) and visual (drop some water on fitting and look for bubbles).

•

The connection for the tube towards the fitting (see fig. above) must never be mounted with tools!

This will squeeze the flexible tube too much and may damage it.

•

By using PU-tubes as gas piping, you have to operate with the right equipment (bracing sleeve, clamping ring, screw cap). Brass connectors must ever be mixed with stainless steel

connectors!

Screw cap clamping ring bracing sleeve correct order of connection

•

Concerning the safety guidelines for special gases, please contact your local gas supplier or read the particular safety data sheet (chapter ‘safety data sheets’).

•

An amount of 4 % hydrogen in the air is already explosive. To calculate the explosion hazard for your workstation use following formula:

e.g.:

Volume of hydrogen bottle: 2 litres

Pressure of bottle (full): 200 bar

Dimension of room: 50 m²,

Height of room: 3 m

Volume of room: 150 m³

Gas escapes / leak: 2l (200bar)

→ 400l (1bar)

400l

→ 0.4 m³/150 m³ = 0.0026 % hydrogen in atmosphere of a 50m² big and 3 m high room.

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10.8 Gas consumption

The enclosed table should create an overview on the gas consumption:

The values are in relation to the max. flow per MFC. That means: at a MFC with 50 sccm we originated from a gas flow of 50 sccm/min. per process.

To calculate your individual gas consumption, you find the formula below the table.

The individual gas consumption strongly depends on the suction power of your pump.

Formula:

1. Volume of bottle (litre) x volume (in bar) = volume (litre) at 1 bar

2. Volume at 1 bar x 1000 = t [minutes]

Gas flow in cm³

3. t [minutes] = t [hours]

60

Calculation example Femto (first line of table)

1. 2 l x 200 bar = 400 l (at 1 bar)

2. 400 l x 1000 = 20.000 minutes

20 cm³

60

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10.9 Gas correction factor (GKF)

The gas correction factor (GKF) has to be typed in at computer controlled machines. This setting can be changed in the software ‘PRS’ in the table ‘settings’.

Changing the gas correction factor:

1. First you have to login (password: PRS)

2. Select table ’settings’.

3. Type in the name of the gas in data item ’gas correction factor’ (overwrite therefore the data item

’frei’)

4. Change gas correction factor as shown in table below.

5. Don’t forget to save the changing!

In case that your gas is not listed here, contact the company MKS, our supplier of MFC’s.

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10.10 Process parameters in general:

Following parameters can be adjusted:

•

Process duration

•

Gas

•

Pressure (process pressure)

•

Power (is shown in %)

•

(Temperature, only if chamber heating is installed)

At computer controlled machines, the single parameters can be adjusted more detailed. The software is customized according to the machine design.

It is possible to write 100 programs, each with 10 subprograms. For an automatic protocol printout install a printer to the system.

The handling of the computer control is explained in the chapter ’Controls’.

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Detailed process parameters:

10.10.1 Cleaning

Application Group Material Gas

Pressure

[mbar]

Power

[%]

Time

[min.]

Aluminium O

2

0,2-0,5 1-60

Metal

Copper H

2

/A r

0,3-0,8 1-60

Gold O

2

/Ar 0,2-0,5 1-60

Silver H

2

/Ar 0,3-0,8 1-60 plastic

Stainless steel O

2

0,2-0,5 1-60

ABS O

2

0,2-0,5 1-20

PA O

2

0,2-0,5 1-30

PE O

2

0,2-0,5 1-30

POM O

2

0,2-0,5 10-40

PP O

2

0,2-0,5 1-20 other

Al2O3 O

2

0,2-0,5 1-60

SiO

2

O

2

0,2-0,5 1-60

10.10.1.1 Cleaning of metals

Removing of oils, fat and releasing agents:

Some parts are covered with oils, fat, releasing agents and other organic and inorganic (also oxides) pollutions.

With plasma it is only possible to remove some nm/s. Are the layers too thick, the pollutions may be hardened.

Fat contains e.g. lithium connections, from those only the organic compounds can be removed. The same applies to fingerprints.

Group Material Gas

Pressure

[mbar]

Power

[%]

Time

[min.]

Aluminium O

2

0,2-0,5 1-60

Metal

Copper H

2

/A r

0,3-0,8 1-60

Gold O

2

/Ar 0,2-0,5 1-60

Silver H

2

/Ar 0,3-0,8 1-60

Stainless steel O

2

0,2-0,5 1-60

(The process parameters power and time have to be adapted according to the specification of the machine (type of generator, power of generator, type of electrode) and according to the properties of the product/sample.)

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There are two methods to measure the cleaning effect:

1. Measuring the surface energy with test inks (see also brochure ’Plasma Technology’)

2. Perform a LABS –Test

(german: Lack Benetzungs Stoerung; english: lacquer wetting fault)

LABS-Test performance:

Place the sample parts on a clean glass plate and flush the part with acetone. After evaporating of the acetone paint the glass plate with a silicone free lacquer. In case that the sample contains silicone, the painting will not bond on the surface (see pictures below).

At the reduction of oxides the metal oxide reacts chemical with the process gas.

As process gas pure hydrogen or a mixture with argon is used.

The mode of action of plasma can be read in the brochure ‘Plasma Technology’.

General parameter (valid for all machines):

(The process parameters power and time have to be adapted according to the specification of the machine (type of generator, power of generator, type of electrode) and according to the properties of the product/sample.)

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Example of program (valid for PC controlled machines):

Reduction of Oxides on Copper:

Program step:

Subprogram1

Pumping Off Period

Gas Supply Period

Introduction

last Subprogram

1. Pumping off pressure

2. max. Pumping off time

3. select gas

Value

don't change

0,2 mbar

30 min.

Gas1: H2 Gas2: free

4. Gas supply period

5. select process gas no.

1 min.

(= MFC resp. Gas connection as installed on machine. Gas 1 =

MFC 1 at machine,...)

Plasma Process Period

Flushing Period

Venting Period

6. Gas rate

7. Max. deviation

8. Gas flow min.

9. Gas flow

10. Gas flow max.

100%

10%

0 sccm

50 sccm

200 sccm (max.of MFC, may vary)

11. Process pressure 0,4 mbar

12. Max. deviation process pressure - 0,20 mbar/ + 0,60 mbar

13. Control via gases

14. Duration check off

15 min.

15. Power setpoint 100%

16. Max. absolute deviation power. 10%

17. observed generatores

18. Max. temperature

19. Monomer setpoint check off (all)

100°C

0 mg/min

-0 mg/min / + 100 mg/min 20. Max. deviation

21. Monitorings

22.1 actual pressure

22.2 error active time pressure

23.1 actual gas flow

23.2 error active time gas flow don't change

000:00:00 hhh:mm:ss

000:00:30

000:01:00

000:00:30

24.1 actual power

24.2 error active time power

25.1 actual temperature

000:00:00

000:00:20

000:00:00

25.2 error active time temperature 000:00:10

22. flushing time 000:00:10

23. venting period 000:01:00

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10.10.1.2 Cleaning of plastic parts

At the cleaning of plastic parts there is always an activation of the surface at the same time included.

As process gas oxygen with technical purity is used, sometimes air as process gas is enough.

The plasma treatment can be repeated. The principle of the process is conform to the cleaning of metals.

Group Material Gas

Pressure Time

[min.]

ABS O

2

0,2-0,5 1-20

PA O

2

0,2-0,5 70-100 plastic

PE O

2

0,2-0,5 50-100

POM O

2

0,2-0,5 100 10-40

PP O

2

0,2-0,5 70-100

PTFE H2 0,3-0,5 100 20-60

(The process parameters power and time have to be adapted according to the specification of the machine (type of generator, power of generator, type of electrode) and according to the properties of the product/sample.)

10.10.1.3 Cleaning of glass and ceramics

The cleaning of glasses and ceramics happens in the same way as the cleaning of metals.

As process gas for the cleaning of glasses argon or oxygen is advisable.

Group Material Gas

other

Pressure

Al2O3 O

2

0,2-0,5 1-60

SiO

2

Time

[min.]

O

2

0,2-0,5 1-60

(The process parameters power and time have to be adapted according to the specification of the machine (type of generator, power of generator, type of electrode) and according to the properties of the product/sample.)

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10.10.2 Activation

General Parameters:

Application Group Material Gas

Pressure

[mbar] Power [%]

Time

[min.]

Aluminium O

2

0,2-0,5 1-10

Metal

Copper H

2

0,3-0,8 1-10

Gold O

2

/Ar 0,2-0,5 1-10

Silver H

2

0,3-0,8 1-10 plastic

Stainless st. O

2

0,2-0,5 1-10

ABS O

2

0,2-0,5 1-20

PA O

2

0,2-0,5 1-30

PE O

2

0,2-0,5 1-20

POM O

2

0,2-0,5

PP O

2

0,2-0,5 1-20 other

Al2O3 O

2

0,2-0,5 1-60

SiO

2

O

2

0,2-0,5 1-60

Powder O

2

0,2-0,5 30-70 30-120

10.10.2.1 Activation of metals

As a matter of principle it is possible to activate metals, but the activation is very unsteady and therefore just of short shelf life.

Activated metal has to be processed very fast (within half an hour, max. one hour), because the adherent radicals and ions react fast with the particles of the air.

Nearly any material can be treated with oxygen, except easily corrosive materials as f.e. copper.

Group Material Gas

Pressure

[mbar]

Power [%]

Time

[min.]

Aluminium O

2

0,2-0,5 1-10

Metal

Copper H

2

0,3-0,8 1-10

Gold O

2

/Ar 0,2-0,5 1-10

Silver H

2

0,3-0,8 1-10

Stainless st. O

2

0,2-0,5 1-10

(The process parameters power and time have to be adapted according to the specification of the machine (type of generator, power of generator, type of electrode) and according to the properties of the product/sample.)

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10.10.2.2 Acitivation of plastics

Plastics like polypropylene or PTFE are covalent. That means, that those materials have to be pretreated before printing, painting and bonding.

The common process gas for this application is oxygen with technical purity. Exceptions are fluorine containing plastics like PTFE, FEP, …

Most of the activations can be performed with air as process gas.

The durability of the activation varies between some minutes (e.g. on rubber) and several weeks (e.g. on PA, PE, …) Some plastics have to be etched for a better adhesion, see chapter ‘Etching’.

General Parameters:

Group Material Gas

Pressure

[mbar] Power [%]

Time

[min.]

plastic

ABS O

2

0,2-0,5 1-20

PA O

2

0,2-0,5 1-30

PE O

2

0,2-0,5 1-20

POM O

2

0,2-0,5

PP O

2

0,2-0,5 1-20

(The process parameters power and time have to be adapted according to the specification of the machine (type of generator, power of generator, type of electrode) and according to the properties of the product/sample.)

untreated plasma

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Example for process with rotary drum:

Activation of polyamide-parts

Machine: Femto LF PC, rotary drum

Program step:

Subprogram1

Pumping Off Period

Gas Supply Period

Introduction

last Subprogram

1. Pumping off pressure

2. max. Pumping off time

3. select gas

Value

don't change

0,2 mbar

30 min.

Gas1: O2 Gas2: free

4. Gas supply period

5. select process gas no.

1 min.

(= MFC resp. Gas connection as installed on machine. Gas 1 =

MFC 1 at machine,...)

Plasma Process

Period

Flushing Period

Venting Period

6. Gas rate

7. Max. deviation

8. Gas flow min.

9. Gas flow

10. Gas flow max.

100%

10%

0 sccm

50 sccm

200 sccm (max. of MFC, may vary)

11. Process pressure 0,3 mbar

12. Max. deviation process pressure - 0,20 mbar/ + 0,40 mbar

13. Control via gases

14. Duration

15. Power setpoint check off

30 min.

70%

16. Max. absolute deviation power. 10%

17. observed generatores check off (all)

18. Max. temperature

19. Monomer setpoint

20. Max. deviation

21. Interval rotary drive / drum

100°C

0 mg/min

-0 mg/min / + 100 mg/min always on

22. Monitorings

22.1 actual pressure

22.2 error active time pressure

23.1 actual gas flow

23.2 error active time gas flow

24.1 actual power

24.2 error active time power

25.1 actual temperature don't change

000:00:00 hhh:mm:ss

000:30:00

000:01:00

000:00:30

000:00:00

000:00:20

000:00:00

25.2 error active time temperature 000:00:10

22. flushing time 000:00:10

23. venting period 000:01:00

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Example for process with standard electrode:

Activation of polyethylene

Machine: Tetra 30 LF PC, multi tray electrode

Program step:

Subprogram1

Pumping Off Period

Gas Supply Period

Introduction

last Subprogram

1. Pumping off pressure

2. max. Pumping off time

3. select gas

Value

check off

0,2 mbar

30 min.

Gas1: O2 Gas2: free

4. Gas supply period

5. select process gas no.

1 min.

(= MFC resp. Gas connection as installed on machine. Gas 1 =

MFC 1 at machine,...)

Plasma Process

Period

Flushing Period

Venting Period

6. Gas rate

7. Max. deviation

8. Gas flow min.

9. Gas flow

10. Gas flow max.

100%

10%

0 sccm

50 sccm

200 sccm (max. of MFC, may vary)

11. Process pressure 0,3 mbar

12. Max. deviation process pressure - 0,20 mbar/ + 0,60 mbar

13. Control via gases

14. Duration check off

10 min.

15. Power setpoint 100%

16. Max. absolute deviation power. 10%

17. observed generatores

18. Max. temperature

19. Monomer setpoint check off (all)

100°C

0 mg/min

-0 mg/min / + 100 mg/min 20. Max. deviation

22. Monitorings

22.1 actual pressure

22.2 error active time pressure

23.1 actual gas flow don't change

000:00:00 hhh:mm:ss

000:30:00

000:01:00

23.2 error active time gas flow

24.1 actual power

24.2 error active time power

25.1 actual temperature

000:00:30

000:00:00

000:00:20

000:00:00

25.2 error active time temperature 000:00:10

22. flushing time 000:00:00

23. venting period 1 min.

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10.10.2.3 Activation of glasses and ceramics:

Glasses and ceramics have similar activation attributes as metals (see chapter above) and are not easy to activate (long-term durable), but be etched. (See chapter ’Etching of glasses and ceramics’.)

Group Material Gas

other

Pressure

[mbar] Power [%]

Time

[min.]

Al2O3 O

2

0,2-0,5 1-60

SiO

2

O

2

0,2-0,5 1-60

Powder O

2

0,2-0,5 30-70 30-120

(The process parameters power and time have to be adapted according to the specification of the machine (type of generator, power of generator, type of electrode) and according to the properties of the product/sample.)

10.10.2.4 Activation of Powder

In our machines we are also able to treat powder. Therefore two machine designs are existing:

1. Glass chamber:

Herewith the powder will be filled in a square glass bottle (max. to 1/10, because powder has a big surface compared to solid other materials) and fixed into a rotary retainer. This design is very recommended, because the powder will not burn and stick to the electrode, and so the chamber stays clean.

2. Rod electrode:

This design is suitable for the additional installation into stainless steel or aluminium chambers.

Therefore a rod electrode will be fed into the glass bottle. The main disadvantage of this design is, that the powder will burn and stick to the electrode, cause of that the electrode has to be cleaned at least once a day of this burned remains.

10.10.3 Etching

For the plasma etching process gases are used which are able to transform the to be etched material into gas phase. (e.g. Etching of silicon with fluorine containing gases) The gas which contains the raw material will be vacuumed, fresh gas will be fed in. Therefore a continuous removal is reached. By an against the process gas resistant etching mask (e.g. chrome) defined parts can be protected. So a surface can be structured specific. The structures are in nanometre range.

Application Group Material Gas

Aluminium Ar (Sputter etching)

Pressure

[mbar] Power [%]

0,2-0,5 100

Time

[min.]

30-120

Metal plastic other

Gold

Iron

(Fe,Ni)

(Sputter etching) 0,1-0,3 100 30-120

Ar+O

2

0,2-0,5 30-120

0,2-0,5 30-120

Titanium NF

3

0,1-0,4 30-120

POM O

2

/O

2

+CF

4

0,1-0,4 30-120

PPS O

2

0,1-0,4 30-120

PTFE H

2

0,2-0,5 20-120

Al2O3 CF

4

0,1-0,6 30-120

SiO

2

CF

4

100

(with

RIE)

30-120

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10.10.3.1 Etching of metals

It is possible as a matter of principle to etch metals, though only with high corrosive gases, which might cause corrosion on the metal. To enhance the etch effect, the parts can be preheated, or if the plasma system has a heater, be heated continuous.

Pressure

Group Material Gas

Aluminium Ar (Sputter etching) 0,2-0,5 100

Time

[min.]

30-120

Metal

Gold

Iron

(Fe,Ni)

(Sputter etching) 0,1-0,3 100 30-120

Ar+O

2

0,2-0,5 30-120

Titanium NF

3

0,1-0,4 30-120

(The process parameters power and time have to be adapted according to the specification of the machine (type of generator, power of generator, type of electrode) and according to the properties of the product/sample.)

10.10.3.2 Etching of plastics:

As written in the chapter ’Activation of plastic’, some plastics like POM, PPS or PTFE need to be etched for a good adhesion. Caused by the bigger surface the bonding adhesion grows.

Typical etching gases are oxygen, different fluorine containing gases and hydrogen.

Group Material Gas

Pressure

[mbar] Power [%]

Time

[min.]

POM O

2

/O

2

+CF

4

0,1-0,4 plastic

PPS O

2

0,1-0,4 30-120

PTFE H

2

0,2-0,5 20-120

(The process parameters power and time have to be adapted according to the specification of the machine (type of generator, power of generator, type of electrode) and according to the properties of the product/sample.)

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Example for process with standard electrode:

Etching of POM

Machine:

Program step:

Subprogram1

Pumping Off Period

Gas Supply Period

Femto LF PC, standard electrode

Introduction

last Subprogram

1. Pumping off pressure

2. max. Pumping off time

3. select gas

Value

don't change

0,2 mbar

30 min.

Gas1: O2 Gas2: free

4. Gas supply period

5. select process gas no.

1 min.

(= MFC resp. Gas connection as installed on machine. Gas 1 =

MFC 1 at machine,...)

Plasma Process

Period

Flushing Period

Venting Period

6. Gas rate

7. Max. deviation

100%

10%

8. Gas flow min.

9. Gas flow

10. Gas flow max.

0 sccm

50 sccm

200 sccm (max. of MFC, may vary)

11. Process pressure 0,4 mbar

12. Max. deviation process pressure - 0,20 mbar/ + 0,60 mbar

13. Control via gases

14. Duration check off

30 min.

15. Power setpoint 100%

16. Max. absolute deviation power. 10%

17. observed generatores

18. Max. temperature

19. Monomer setpoint check off (all)

150°C

0 mg/min

-0 mg/min / + 100 mg/min 20. Max. deviation

22. Monitorings

22.1 actual pressure

22.2 error active time pressure

23.1 actual gas flow

23.2 error active time gas flow

24.1 actual power

24.2 error active time power

25.1 actual temperature don't change

000:00:00 hhh:mm:ss

000:30:00

000:01:00

000:00:30

000:00:00

000:00:20

000:00:00

25.2 error active time temperature 000:00:10

22. flushing time 000:00:10

23. venting period 1 min.

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10.10.3.3 Etching of glasses and ceramics:

The plasma etching of glasses in vacuum is time-consuming and expensive. Glass will be slowly removed by the ionised gas particles. Glass is mainly made of SiO

2

which can only be etched with fluorinated hydrocarbon (under addition of oxygen). The low denudation rate and the long process time are responsible for the high cost of such processes.

Ceramics (like Al

2

O

3

) can be etched with corrosive and non-corrosive gases.

Corrosive gases are f.e. all chlorine containing gases. Non-corrosive gases are argon and some fluorine containing gases (f.e. C

4

F

8

,CF

4

).

In general it can be said, that fluorine containing gases a higher etching rate occupy, than other noncorrosive gases and that chlorine containing gases have a higher etching rate than non-corrosive gases. For etching of Al

2

O

3

fluorine containing gases reach the best results.

Group Material Gas

other

Pressure

[mbar] Power [%]

Time

[min.]

Al2O3 CF

4

0,1-0,6

SiO

2

CF

4

0,1-0,3

(with RIE)

30-120

(The process parameters power and time have to be adapted according to the specification of the machine (type of generator, power of generator, type of electrode) and according to the properties of the product/sample.)

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10.10.4 Coating via plasma polymerization

For coating processes in low pressure plasma monomers (as gas or as liquid) will be fed into the machine to polymerize under plasma influence.

The thickness of the plasma polymer coatings is anywhere in the range of 1 micrometer.

The adhesion of the coatings to the surface is very good.

The process technology is much more complex than at activation and cleaning processes. It is possible to create different kind of coatings like e.g.: barrier coatings in tanks, anti-scratch coatings on

CD’ or headlights, PTFE- like coatings and hydrophobic coatings.

There are three established coating processes:

1. Hydrophobic Coatings: Monomer e.g.: hexamethyldisiloxane (HMDSO)

2. PTFE-like Coatings:

3. Hydrophilic Coatings:

Monomer: fluorine containing processgases

Monomer: vinyl acetate, hexamethyldisiloxane mixed with oxygen

(more HMDSO than O

2

)

Application Group Material

Metal

Gas

Pressure

[mbar] Power [%]

Time

[min.]

Aluminium HMDSO+O

2

0,1-0,5

Stainless st. HMDSO+O

2

0,1-0,3 50-100 1-60 plastic plastic HMDSO+O

2

0,1-0,5 plastic C

4

F

8

0,1-0,5 1-60

Glass

Glass C

4

F

8

0,1-0,5 50-100 30-120

Special

Process

Special Processes

1. Activation: 5 Minutes O2

2. Coating: 5 Minutes HMDSO

3. „Etching“: 12 Seconds O2

4. Coating: 5 Minutes HMDSO

5. „Etching“: 12 Seconds O2

6. Coating: 5 Minutes HMDSO

(The process parameters power and time have to be adapted according to the specification of the machine (type of generator, power of generator, type of electrode) and according to the properties of the product/sample.)

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10.10.4.1 Coating of metals via plasma polymerization

By coating metals via plasma polymerization different effects can be reached. E.g.: a long term stable activation, functional and decorative coatings.

In general, the usage of a sputter machine is the best way to create metal coatings. This machine is explained in detail in the chapter ‘Coating via sputtering’. decorative coatings on metal functional coatings on metal (picture: long term stable hydrophilic coating, left: untreated, right: treated)

Group Material Gas

Pressure

[mbar] Power [%]

Metal

Time

[min.]

Aluminium HMDSO+O

2

0,1-0,5

Stainless steel HMDSO+O

2

0,1-0,3 50-100 1-60

(The process parameters power and time have to be adapted according to the specification of the machine (type of generator, power of generator, type of electrode) and according to the properties of the product/sample.)

For a permanent hydrophilic coating with HMDSO mix the gases as following:

HMDSO:O

2

= 1:4

For a hydrophobic coating with HMDSO mix the gases as following:

HMDSO:O

2

= 4:1

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Example for mulit layer coating process:

Coating of metals (permanent hydrophilic)

Machine: Femto LF PC, multi layer carrier

Program step:

Subprogram1

Pumping Off Period

Gas Supply Period

Introduction

last Subprogram

1. Pumping off pressure

2. max. Pumping off time

3. select gas

Value

clear hook / inaktive

0,2 mbar

30 min.

Gas1: O2 Gas2: free

4. Gas supply period

5. select process gas no.

1 min.

(= MFC resp. Gas connection as installed on machine. Gas 1 =

MFC 1 at machine,...)

Plasma Process

Period

Flushing Period

Venting Period

6. Gas rate

7. Max. deviation

8. Gas flow min.

9. Gas flow

10. Gas flow max.

100%

10%

0 sccm

50 sccm

200 sccm (max. of MFC, may vary)

0,3 mbar 11. Process pressure

12. Max. deviation process pressure - 0,20 mbar/ + 0,60 mbar

13. Control via gases

14. Duration

17. observed generatores

18. Max. temperature

19. Monomer setpoint check off

10 min.

15. Power setpoint 100%

16. Max. absolute deviation power. 10% check off (all)

100°C

20. Max. deviation

22. Monitorings

0 mg/min

-0 mg/min / + 100 mg/min don't change

22.1 actual pressure

22.2 error active time pressure

23.1 actual gas flow

23.2 error active time gas flow

000:00:00 hhh:mm:ss

000:30:00

000:01:00

000:00:30

24.1 actual power

24.2 error active time power

25.1 actual temperature

000:00:00

000:00:20

000:00:00

25.2 error active time temperature 000:00:10

22. flushing time 000:00:10

23. venting period 0 min.

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Subprogram2

Pumping Off Period

Gas Supply Period

Plasma Process

Period

Flushing Period

Venting Period last Subprogram

1. Pumping off pressure

2. max. Pumping off time

3. select gas

4. Gas supply period

5. select process gas no. clear hook / inaktive

0,2 mbar

30 min.

Gas1: free Gas2: free

30 sek. none, because monomer

(HMDSO) is selected

6. Gas rate

7. Max. deviation

8. Gas flow min.

9. Gas flow

10. Gas flow max.

0%

0%

0 sccm

50 sccm

200 sccm (max. of MFC, may vary)

11. Process pressure

12. Max. deviation process pressure

13. Control via gases

0,3 mbar

- 0,20 mbar/ + 0,40 mbar clear hook / inaktive

14. Duration

15. Power setpoint

10 min.

80%

16. Max. absolute deviation power. 10%

17. observed generatores check off (all)

18. Max. temperature

19. Monomer setpoint

20. Max. deviation

22. Monitorings

100°C

10 mg/min

-1 mg/min / + 30 mg/min don't change

22. flushing time

23. venting period

000:00:10

0 min.

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Subprogram3

Pumping Off Period

Gas Supply Period

Plasma Process

Period last Subprogram

1. Pumping off pressure

2. max. Pumping off time

3. select gas

4. Gas supply period

5. select process gas no.

6. Gas rate clear hook / inaktive

0,2 mbar

30 min.

Gas1: O2 Gas2: free

30 sek.

(= MFC resp. Gas connection as installed on machine. Gas 1 =

MFC 1 at machine,...)

100%

Flushing Period

Venting Period

7. Max. deviation

8. Gas flow min.

9. Gas flow

10. Gas flow max.

11. Process pressure

10%

0 sccm

50 sccm

200 sccm (max. of MFC, may vary)

0,3 mbar

12. Max. deviation process pressure

13. Control via gases

14. Duration

- 0,20 mbar/ + 0,40 mbar check off

5 sek.

15. Power setpoint 80%

16. Max. absolute deviation power. 10%

17. observed generatores

18. Max. temperature

19. Monomer setpoint

20. Max. deviation

22. Monitorings

22. flushing time check off (all)

100°C

0 mg/min

-0 mg/min / + 100 mg/min don't change

000:00:10

23. venting period 0 min.

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Subprogram4

Pumping Off Period

Gas Supply Period

Plasma Process

Period last Subprogram

1. Pumping off pressure

2. max. Pumping off time

3. select gas

4. Gas supply period

5. select process gas no.

6. Gas rate clear hook / inaktive

0,2 mbar

30 min.

Gas1: free Gas2: free

30 sek. none, because monomer

(HMDSO) is selected

0%

Flushing Period

Venting Period

7. Max. deviation

8. Gas flow min.

9. Gas flow

10. Gas flow max.

11. Process pressure

0%

0 sccm

50 sccm

200 sccm (max. of MFC, may vary)

0,3 mbar

12. Max. deviation process pressure

13. Control via gases

14. Duration

- 0,20 mbar/ + 0,40 mbar clear hook / inaktive

10 min.

15. Power setpoint 80%

16. Max. absolute deviation power. 10%

17. observed generatores

18. Max. temperature check off (all)

100°C

19. Monomer setpoint

20. Max. deviation

22. Monitorings

22. flushing time

10 mg/min

-1 mg/min / + 30 mg/min don't change

000:00:10

23. venting period 0 min.

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Subprogram5

Pumping Off Period

Gas Supply Period

Plasma Process

Period

Flushing Period last Subprogram

1. Pumping off pressure

2. max. Pumping off time

3. select gas

4. Gas supply period

5. select process gas no.

6. Gas rate

7. Max. deviation check off

0,2 mbar

30 min.

Gas1: O2 Gas2: free

30 sek.

(= MFC resp. Gas connection as installed on machine. Gas 1 =

MFC 1 at machine,...)

100%

10%

Venting Period

8. Gas flow min.

9. Gas flow

10. Gas flow max.

11. Process pressure

12. Max. deviation process pressure

0 sccm

50 sccm

200 sccm (max. of MFC, may vary)

0,3 mbar

- 0,20 mbar/ + 0,40 mbar

13. Control via gases

14. Duration

15. Power setpoint check off

5 sek.

80%

16. Max. absolute deviation power. 10%

17. observed generatores

18. Max. temperature

19. Monomer setpoint check off (all)

100°C

20. Max. deviation

22. Monitorings

0 mg/min

-0 mg/min / + 100 mg/min don't change

22. flushing time

23. venting period

000:00:10

1 min.

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10.10.4.2 Coating of plastics via plasma polymerization

Plastics are mostly easy to coat via plasma polymerization. So e.g. can CD’s and DVD’s be coated with an anti-scratch coating without a reduction of their quality.

PTFE-like coatings can be created to enhance the slippage of the sample parts / products.

It is also possible to create functional groups on the surface (e.g. amino groups for bio analytic applications).

Original surface scratch test (untreated) scratch test (treated)

Group Material Gas

Pressure

[mbar]

Power [%]

Time

[min.]

plastic plastic HMDSO+O

2

0,1-0,5 plastic C

4

F

8

0,1-0,5 1-60

(The process parameters power and time have to be adapted according to the specification of the machine (type of generator, power of generator, type of electrode) and according to the properties of the product/sample.)

The polymerization can also happen in several steps. f.e.:

1. activation:

2. coating:

5 minutes O

2

5 minutes HMDSO

4. coating:

2

5 minutes HMDSO

6. coating:

2

5 minutes HMDSO

Afterwards you may harden the surface by some seconds of oxygen plasma. By this step the coating will be hydrophilic.

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10.10.4.3 Coating of glasses and ceramics via plasma polymerization

The main problem in coating glasses and ceramics is to prepare the surface (see chapter activation and etching). As soon as this problem is solved, there is no limit in the variety of coating applications.

The particular bonding adhesion of the coating has to be tested in individual case. At incompatibility between the coating and the substrate material, may be intermediate layers as bonding agents have to be spread on the surface.

An example for a successful hydrophobic and oliophobic coating is shown on the photo below. oil Isopropyl alc.

water oil

treated glass

Isopropyl alc. water

untreated glass

Group Material Gas

Pressure Time

[min.]

Glass glass C

4

F

8

0,1-0,5 50-100 30-120

(The process parameters power and time have to be adapted according to the specification of the machine (type of generator, power of generator, type of electrode) and according to the properties of the product/sample.)

10.10.4.4 Coating of textiles via plasma polymerization

Textiles are easy to coat in plasma. The durability of the hydrophobic coating is at the moment limited on 10 washing cycles (with detergents) for a very good hydrophobic effect and then the hydrophobic effect starts to decrease fast. Hydrophobic coatings are reached by using fluorine containing gases and monomers. untreated cotton (water) treated cotton (water) treated cotton (Isopropyl alcohol)

(Water drop has been coloured for better visibility.)

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A

Aggressive

Animals .........................................................................................................................chap. 3

C

Carrier ........................................................................................................................chap. 1.7

Ceramic isolator for electrode.......................................................................................chap. 6 volume .......................................................................................................chap. 1.4

Chamber diagram....................................................................................................... Attachment

Cleaning........................................................................................................................chap. 4

Connections....................................................................................................chap. 1.3, 1.9, 2

Connecting the machine……………………………………………………………………..chap. 2

D

Damp

Description of parts.............................................................................................chap. 1.3, 1.7

Door .......................................................................................................................chap. 1.3, 5

Door switch ...................................................................................................................chap. 4

E

Electric

Electrode................................................................................................................chap. 1.7, 3

EG- Declaration of Conformity......................................................................................chap. 7

Electrode

Spare retainer .....................................................................................................chap. 4, 6

Exhausts .......................................................................................................................chap. 3

G

Gas, Gas connection ......................................................................................chap. 1.3, 1.7, 5 ballast ....................................................................................................................chap. 3

Generator...................................................................................................................chap. 1.8

K

KF-seals........................................................................................................................chap. 6

M

Maintenance .................................................................................................................chap. 4

Main power switch .....................................................................................................chap. 1.7

N

Needle

O

Oil for vacuum pump chap. 4, 6

P

Pollutions ......................................................................................................................chap. 3

Power supply connection...........................................................................................chap. 1,3

Power Supply Switch .................................................................................................chap. 1.7

Process parameters…………………………………………………………chap. 10.10.1-10.10.4

R

Relay.............................................................................................................................chap. 4

Repairs..........................................................................................................................chap. 3 material ......................................................................................................chap. 1.4

Room

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S

Safety

Fuses ........................................................................................................................................

Clamp........................................................................................................................................

Voltage...................................................................................................................................... connection ...................................................................................................................

Control ......................................................................................................................................

Sealing ......................................................................................................................chap. 4, 6

Suction pipe for vacuum chamber .............................................................................chap. 1.3

Suction

T

Technical data ..........................................................................................................................

Timer...................................................................................................................chap.

Type

Troubleshooting .....................................................................................................chap. 1.7, 5

V

Vacuum pump............................................................................................................chap. 1.9

Vacuum pump oil ......................................................................................................chap. 4, 6 switch..............................................................................................................chap. 6

Valves ........................................................................................................................chap. 1.2

Ventilation ..................................................................................................................chap. 1.3

W

Warranty .......................................................................................................................chap. 8

Working

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