Model 7037 Single-Pole Relay-Digital I/O Card Instruction Manual

Model 7037 Single-Pole Relay-Digital I/O Card Instruction Manual
Test Equipment Depot - 800.517.8431 - 99 Washington Street Melrose, MA 02176 - TestEquipmentDepot.com
Instruction Manual
Model 7037
Single-Pole Relay-Digital I/O Card
Contains Operating and Servicing Information
7037-901-01 Rev. A / 5-97
WARRANTY
Keithley Instruments, Inc. warrants this product to be free from defects in material and workmanship for a period of 1 year from date of
shipment.
Keithley Instruments, Inc. warrants the following items for 90 days from the date of shipment: probes, cables, rechargeable batteries,
diskettes, and documentation.
During the warranty period, we will, at our option, either repair or replace any product that proves to be defective.
To exercise this warranty, write or call your local Keithley representative, or contact Keithley headquarters in Cleveland, Ohio. You will
be given prompt assistance and return instructions. Send the product, transportation prepaid, to the indicated service facility. Repairs
will be made and the product returned, transportation prepaid. Repaired or replaced products are warranted for the balance of the original warranty period, or at least 90 days.
LIMITATION OF WARRANTY
This warranty does not apply to defects resulting from product modification without Keithley’s express written consent, or misuse of
any product or part. This warranty also does not apply to fuses, software, non-rechargeable batteries, damage from battery leakage, or
problems arising from normal wear or failure to follow instructions.
THIS WARRANTY IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING ANY IMPLIED
WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR USE. THE REMEDIES PROVIDED HEREIN ARE
BUYER’S SOLE AND EXCLUSIVE REMEDIES.
NEITHER KEITHLEY INSTRUMENTS, INC. NOR ANY OF ITS EMPLOYEES SHALL BE LIABLE FOR ANY DIRECT, INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING OUT OF THE USE OF ITS INSTRUMENTS AND
SOFTWARE EVEN IF KEITHLEY INSTRUMENTS, INC., HAS BEEN ADVISED IN ADVANCE OF THE POSSIBILITY OF
SUCH DAMAGES. SUCH EXCLUDED DAMAGES SHALL INCLUDE, BUT ARE NOT LIMITED TO: COSTS OF REMOVAL
AND INSTALLATION, LOSSES SUSTAINED AS THE RESULT OF INJURY TO ANY PERSON, OR DAMAGE TO PROPERTY.
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Model 7037 Single-Pole Relay-Digital I/O Card
Instruction Manual
©1997, Keithley Instruments, Inc.
All rights reserved.
Cleveland, Ohio, U.S.A.
First Printing, May 1997
Document Number: 7037-901-01 Rev. A
Manual Print History
The print history shown below lists the printing dates of all Revisions and Addenda created for this manual. The Revision
Level letter increases alphabetically as the manual undergoes subsequent updates. Addenda, which are released between Revisions, contain important change information that the user should incorporate immediately into the manual. Addenda are numbered sequentially. When a new Revision is created, all Addenda associated with the previous Revision of the manual are
incorporated into the new Revision of the manual. Each new Revision includes a revised copy of this print history page.
Revision A (Document Number 7037-901-01)........................................................................................ May 1997
All Keithley product names are trademarks or registered trademarks of Keithley Instruments, Inc.
Other brand and product names are trademarks or registered trademarks of their respective holders.
Safety Precautions
The following safety precautions should be observed before using
this product and any associated instrumentation. Although some instruments and accessories would normally be used with non-hazardous voltages, there are situations where hazardous conditions
may be present.
This product is intended for use by qualified personnel who recognize shock hazards and are familiar with the safety precautions required to avoid possible injury. Read the operating information
carefully before using the product.
The types of product users are:
Responsible body is the individual or group responsible for the use
and maintenance of equipment, and for ensuring that operators are
adequately trained.
Operators use the product for its intended function. They must be
trained in electrical safety procedures and proper use of the instrument. They must be protected from electric shock and contact with
hazardous live circuits.
Maintenance personnel perform routine procedures on the product
to keep it operating, for example, setting the line voltage or replacing consumable materials. Maintenance procedures are described in
the manual. The procedures explicitly state if the operator may perform them. Otherwise, they should be performed only by service
personnel.
Service personnel are trained to work on live circuits, and perform
safe installations and repairs of products. Only properly trained service personnel may perform installation and service procedures.
Exercise extreme caution when a shock hazard is present. Lethal
voltage may be present on cable connector jacks or test fixtures. The
American National Standards Institute (ANSI) states that a shock
hazard exists when voltage levels greater than 30V RMS, 42.4V
peak, or 60VDC are present. A good safety practice is to expect
that hazardous voltage is present in any unknown circuit before
measuring.
Users of this product must be protected from electric shock at all
times. The responsible body must ensure that users are prevented
access and/or insulated from every connection point. In some cases,
connections must be exposed to potential human contact. Product
users in these circumstances must be trained to protect themselves
from the risk of electric shock. If the circuit is capable of operating
at or above 1000 volts, no conductive part of the circuit may be
exposed.
As described in the International Electrotechnical Commission
(IEC) Standard IEC 664, digital multimeter measuring circuits
(e.g., Keithley Models 175A, 199, 2000, 2001, 2002, and 2010)
measuring circuits are Installation Category II. All other instruments’ signal terminals are Installation Category I and must not be
connected to mains.
Do not connect switching cards directly to unlimited power circuits.
They are intended to be used with impedance limited sources.
NEVER connect switching cards directly to AC mains. When connecting sources to switching cards, install protective devices to limit fault current and voltage to the card.
Before operating an instrument, make sure the line cord is connected to a properly grounded power receptacle. Inspect the connecting
cables, test leads, and jumpers for possible wear, cracks, or breaks
before each use.
For maximum safety, do not touch the product, test cables, or any
other instruments while power is applied to the circuit under test.
ALWAYS remove power from the entire test system and discharge
any capacitors before: connecting or disconnecting cables or jumpers, installing or removing switching cards, or making internal
changes, such as installing or removing jumpers.
Do not touch any object that could provide a current path to the
common side of the circuit under test or power line (earth) ground.
Always make measurements with dry hands while standing on a
dry, insulated surface capable of withstanding the voltage being
measured.
Do not exceed the maximum signal levels of the instruments and accessories, as defined in the specifications and operating information, and as shown on the instrument or test fixture panels, or
switching card.
When fuses are used in a product, replace with same type and rating
for continued protection against fire hazard
Chassis connections must only be used as shield connections for
measuring circuits, NOT as safety earth ground connections.
If you are using a test fixture, keep the lid closed while power is applied to the device under test. Safe operation requires the use of a
lid interlock.
If a
screw is present, connect it to safety earth ground using the
wire recommended in the user documentation.
The ! symbol on an instrument indicates that the user should refer to the operating instructions located in the manual.
The
symbol on an instrument shows that it can source or measure 1000 volts or more, including the combined effect of normal
and common mode voltages. Use standard safety precautions to
avoid personal contact with these voltages.
The WARNING heading in a manual explains dangers that might
result in personal injury or death. Always read the associated information very carefully before performing the indicated procedure.
The CAUTION heading in a manual explains hazards that could
damage the instrument. Such damage may invalidate the warranty.
Instrumentation and accessories shall not be connected to humans.
Before performing any maintenance, disconnect the line cord and
all test cables.
To maintain protection from electric shock and fire, replacement
components in mains circuits, including the power transformer, test
leads, and input jacks, must be purchased from Keithley Instruments. Standard fuses, with applicable national safety approvals,
may be used if the rating and type are the same. Other components
that are not safety related may be purchased from other suppliers as
long as they are equivalent to the original component. (Note that selected parts should be purchased only through Keithley Instruments
to maintain accuracy and functionality of the product.) If you are
unsure about the applicability of a replacement component, call a
Keithley Instruments office for information
To clean the instrument, use a damp cloth or mild, water based
cleaner. Clean the exterior of the instrument only. Do not apply
cleaner directly to the instrument or allow liquids to enter or spill
on the instrument.
Table of Contents
1
General Information
Introduction .......................................................................................................................................................... 1-1
Features ............................................................................................................................................................... 1-1
Warranty information.......................................................................................................................................... 1-2
Manual addenda .................................................................................................................................................. 1-2
Safety symbols and terms ................................................................................................................................... 1-2
Specifications ...................................................................................................................................................... 1-2
Unpacking and inspection ................................................................................................................................... 1-2
Inspection for damage ................................................................................................................................. 1-2
Handling precautions ................................................................................................................................... 1-2
Shipping contents ........................................................................................................................................ 1-2
Instruction manual....................................................................................................................................... 1-3
Repacking for shipment ...................................................................................................................................... 1-3
Optional accessories............................................................................................................................................ 1-3
2
Relay Switch Configuration
Introduction ......................................................................................................................................................... 2-1
Basic switch configuration (SPST) ..................................................................................................................... 2-1
3
Digital I/O Configuration
Introduction .........................................................................................................................................................
Digital outputs.....................................................................................................................................................
Controlling pull-up devices.................................................................................................................................
Controlling devices using pull-up resistors.........................................................................................................
Digital inputs.......................................................................................................................................................
3-1
3-1
3-1
3-2
3-2
i
4
Card Connections and Installation
Introduction ......................................................................................................................................................... 4-1
Handling precautions........................................................................................................................................... 4-2
Digital I/O connections........................................................................................................................................ 4-2
Voltage source jumper................................................................................................................................. 4-2
Pull-up resistors ........................................................................................................................................... 4-2
Configuring digital I/O output logic............................................................................................................ 4-4
Configuring digital I/O input pull-up resistance ......................................................................................... 4-4
Multi-pin (mass termination) connector card ...................................................................................................... 4-5
Typical relay switch connection scheme ........................................................................................................... 4-10
Typical digital I/O connection schemes ............................................................................................................ 4-11
Output connection schemes....................................................................................................................... 4-11
Input connection scheme ........................................................................................................................... 4-12
Model 7037 installation and removal ................................................................................................................ 4-13
Card installation......................................................................................................................................... 4-13
Card removal ............................................................................................................................................. 4-13
5
Operation
Introduction ......................................................................................................................................................... 5-1
Power limits......................................................................................................................................................... 5-1
Digital I/O maximum signal levels.............................................................................................................. 5-1
Relay switch maximum signal levels .......................................................................................................... 5-1
Reactive loads.............................................................................................................................................. 5-1
Mainframe control of the card ............................................................................................................................. 5-2
Channel assignments ................................................................................................................................... 5-3
Closing and opening channels ..................................................................................................................... 5-5
Scanning channels ....................................................................................................................................... 5-5
Reading input channels................................................................................................................................ 5-6
IEEE-488 bus operation .............................................................................................................................. 5-6
Measurement considerations ............................................................................................................................... 5-8
Path isolation ............................................................................................................................................... 5-8
Magnetic fields ............................................................................................................................................ 5-8
Radio frequency interference ...................................................................................................................... 5-9
Ground loops ............................................................................................................................................... 5-9
Keeping connectors clean.......................................................................................................................... 5-10
AC frequency response.............................................................................................................................. 5-10
ii
6
Service Information
Introduction ......................................................................................................................................................... 6-1
Handling and cleaning precautions ..................................................................................................................... 6-1
Performance verification..................................................................................................................................... 6-2
Environmental conditions ........................................................................................................................... 6-2
Recommended equipment........................................................................................................................... 6-2
Card connections......................................................................................................................................... 6-2
Channel resistance tests .............................................................................................................................. 6-3
Offset current tests ...................................................................................................................................... 6-4
Contact potential tests ................................................................................................................................. 6-5
Channel to channel isolation tests ............................................................................................................... 6-5
Common-mode isolation tests..................................................................................................................... 6-8
Channel functionality test ................................................................................................................................... 6-9
Special handling of static-sensitive devices........................................................................................................ 6-9
Principles of operation ...................................................................................................................................... 6-10
Block diagram ........................................................................................................................................... 6-10
ID data circuits .......................................................................................................................................... 6-11
Relay control ............................................................................................................................................. 6-12
Relay power control .................................................................................................................................. 6-12
Digital I/O output channel control ............................................................................................................ 6-12
Digital I/O input channel control .............................................................................................................. 6-12
Power-on safeguard................................................................................................................................... 6-12
Troubleshooting ................................................................................................................................................ 6-13
Troubleshooting equipment ...................................................................................................................... 6-13
Troubleshooting access ............................................................................................................................. 6-13
Troubleshooting procedure ....................................................................................................................... 6-14
7
Replaceable Parts
Introduction ......................................................................................................................................................... 7-1
Parts lists .............................................................................................................................................................. 7-1
Ordering information .......................................................................................................................................... 7-1
Factory service .................................................................................................................................................... 7-1
Component layouts and schematic diagrams ...................................................................................................... 7-1
Index
iii
List of Illustrations
2
Relay Switch Configuration
Figure 2-1
Model 7037 relay switch configuration (simplified schematic) ................................................................. 2-1
3
Digital I/O Configuration
Figure 3-1
Figure 3-2
Figure 3-3
Output configuration for pull-up devices.................................................................................................... 3-1
Output configuration using pull-up resistance ............................................................................................ 3-2
Input configuration...................................................................................................................................... 3-2
4
Card Connections and Installation
Figure 4-1
Figure 4-2
Figure 4-3
Figure 4-4
Figure 4-5
Figure 4-6
Figure 4-7
Figure 4-8
Figure 4-9
Figure 4-10
Figure 4-11
Figure 4-12
Figure 4-13
Figure 4-14
Figure 4-15
Figure 4-16
Voltage source jumper for output channels ................................................................................................ 4-2
Component locations - connector board ..................................................................................................... 4-3
Voltage source jumper installation ............................................................................................................. 4-3
Digital I/O output logic location ................................................................................................................. 4-4
Digital I/O output logic selection................................................................................................................ 4-4
Digital I/O input pull-up resistance selection.............................................................................................. 4-5
Multi-pin connector card terminal identification ........................................................................................ 4-6
Typical round cable connection techniques ................................................................................................ 4-8
Model 7011-MTR connector pinout ........................................................................................................... 4-9
Model 7011-KIT-R (with cable) assembly ................................................................................................. 4-9
Typical connection scheme for Model 7037............................................................................................. 4-10
Digital output, solenoid control ................................................................................................................ 4-11
Digital output, motor control .................................................................................................................... 4-11
Digital output, logic device control........................................................................................................... 4-12
Digital input, monitoring micro-switches ................................................................................................. 4-12
Model 7037 card installation in Model 7001 ............................................................................................ 4-13
v
5
Operation
Figure 5-1
Figure 5-2
Figure 5-3
Figure 5-4
Figure 5-5
Figure 5-6
Figure 5-7
Figure 5-8
Figure 5-9
Figure 5-10
Limiting inductive reaction voltage............................................................................................................. 5-2
Limiting capacitive reaction current............................................................................................................ 5-2
Model 7001 channel status display.............................................................................................................. 5-3
Model 7022 channel status display (slot 1) ................................................................................................. 5-3
Channel display organization ...................................................................................................................... 5-3
Model 7037 programming channel assignments......................................................................................... 5-4
Path isolation resistance .............................................................................................................................. 5-8
Voltage attenuation by path isolation resistance ......................................................................................... 5-8
Power line ground loops.............................................................................................................................. 5-9
Eliminating ground loops ............................................................................................................................ 5-9
6
Service Information
Figure 6-1
Figure 6-2
Figure 6-3
Figure 6-4
Figure 6-5
Figure 6-6
Figure 6-7
Figure 6-8
Figure 6-9
Channel resistance testing ........................................................................................................................... 6-3
Offset current testing ................................................................................................................................... 6-4
Contact potential testing .............................................................................................................................. 6-5
Channel to channel testing........................................................................................................................... 6-6
Common-mode isolation testing.................................................................................................................. 6-8
Testing an input or output channel .............................................................................................................. 6-9
Model 7037 block diagram........................................................................................................................ 6-10
Start and stop sequences............................................................................................................................ 6-11
Transmit and acknowledge sequence ........................................................................................................ 6-11
vi
List of Tables
4
Card Connections and Installation
Table 4-1
Table 4-2
Mass termination accessories...................................................................................................................... 4-5
Multi-pin connector card terminal designation cross-reference.................................................................. 4-7
6
Service Information
Table 6-1
Table 6-2
Table 6-3
Table 6-4
Verification equipment ............................................................................................................................... 6-2
Channel to channel isolation tests ............................................................................................................... 6-7
Recommended troubleshooting equipment............................................................................................... 6-13
Troubleshooting procedure ....................................................................................................................... 6-14
7
Replaceable Parts
Table 7-1
Table 7-2
Table 7-3
Relay card for Model 7037 parts list............................................................................................................ 7-2
Mass terminated connector card for Model 7037 parts list.......................................................................... 7-3
Model 7011-KIT-R 96-pin female DIN connector kit parts list .................................................................. 7-3
vii
1
General Information
Introduction
Features
This section contains general information about the Model
7037 single-pole relay-digital I/O card.
The Model 7037 has 30 independent channels of single-pole
switching. It also has ten independent inputs and outputs for
digital I/O capabilities. Some of the key features include:
The Model 7037 consists of a multi-pin (mass termination)
connector card and a relay card. External test circuit connections are made via the 96-pin male DIN connector on the
connector card. Keithley offers a variety of optional accessories that can be used to make connections to the connector
card. (See the available accessories at the end of this section.)
The rest of Section 1 is arranged in the following manner:
• Features
• Warranty information
• Manual addenda
• Safety symbols and terms
• Specifications
• Unpacking and inspection
• Low contact potential and offset current for minimal
effects on low-level signals.
• High density switching and control.
• High capacity digital output sink of 250mA.
• 1A pathway current carrying capacity.
• High isolation resistance >1GΩ for minimal load
effects.
• Model 7011-KIT-R connector kit that includes a 96-pin
female DIN connector that will mate directly to the connector on the Model 7037 or to a standard 96-pin male
DIN bulkhead connector (see Model 7011-MTR). This
connector uses solder cups for connections to external
circuitry and includes an adapter for a round cable and
the housing.
• Repacking for shipment
• Optional accessories
1-1
General Information
Warranty information
Specifications
Warranty information is located at the front of this instruction manual. Should your Model 7037 require warranty service, contact the Keithley representative or authorized repair
facility in your area for further information. When returning
the card for repair, be sure to fill out and include the service
form at the back of this manual in order to provide the repair
facility with the necessary information.
Model 7037 specifications are found at the front of this manual. These specifications are exclusive of the mainframe
specifications
Unpacking and inspection
Inspection for damage
Manual addenda
Any improvements or changes concerning the card or manual will be explained in an addendum included with the card.
Addenda are provided in a page replacement format. Replace
the obsolete pages with the new pages.
Safety symbols and terms
The following symbols and terms may be found on an instrument or used in this manual.
The ! symbol on an instrument indicates that the user
should refer to the operating instructions located in the
instruction manual.
The
symbol on an instrument shows that high voltage
may be present on the terminal(s). Use standard safety precautions to avoid personal contact with these voltages.
The WARNING heading used in this manual explains dangers that might result in personal injury or death. Always
read the associated information very carefully before performing the indicated procedure.
The CAUTION heading used in this manual explains hazards that could damage the card. Such damage may invalidate the warranty.
1-2
The Model 7037 is packaged in a resealable, anti-static bag
to protect it from damage due to static discharge and from
contamination that could degrade its performance. Before
removing the card from the bag, observe the following precautions on handling.
Handling precautions
1. Always grasp the card by the side edges and shields. Do
not touch the board surfaces or components.
2. When not installed in a Model 7001/7002 mainframe,
keep the card in the anti-static bag and store it in the
original packing carton.
After removing the card from its anti-static bag, inspect it for
any obvious signs of physical damage. Report any such damage to the shipping agent immediately.
Shipping contents
The following items are included with every Model 7037
order:
• Model 7037 Single-Pole Relay-Digital I/O Card
• Model 7011-KIT-R 96-pin Female DIN Connector Kit
• Model 7037 Instruction Manual
• Additional accessories as ordered
General Information
Instruction manual
Optional accessories
The Model 7037 Instruction Manual is three-hole drilled so
it can be added to the three-ring binder of the Model 7001 or
7002 Instruction Manual. After removing the plastic wrapping, place the manual in the binder following the mainframe
instruction manual. Note that a manual identification tab is
included and should precede the Model 7037 Instruction
Manual.
The following accessories are available for use with the
Model 7037:
If an additional instruction manual is required, order the
manual package, Keithley part number 7037-901-00. The
manual package includes an instruction manual and any pertinent addenda.
Model 7011-MTC-2  This two-meter round cable assembly is terminated with a 96-pin female DIN connector on
each end. It will mate directly to the connector on the Model
7037 and to a standard 96-pin male DIN bulkhead connector
(see Model 7011-MTR).
Model 7011-MTR  This 96-pin male DIN bulkhead connector uses solder cups for connections to external circuitry.
It will mate to the Model 7011-KIT-R connector and Model
7011-MTC-2 cable assembly.
Repacking for shipment
Should it become necessary to return the Model 7037 for
repair, carefully pack the unit in its original packing carton,
or the equivalent, and include the following information:
• Advise as to the warranty status of the card.
• Write ATTENTION REPAIR DEPARTMENT on the
shipping label.
• Fill out and include the service form located at the back
of this manual.
1-3
2
Relay Switch Configuration
Introduction
IN1
This section covers the basic single-pole, single-throw
(SPST) switch configuration
Basic switch configuration (SPST)
A simplified schematic of the Model 7037 relay switch configuration is shown in Figure 2-1. The card has 30 independent channels. Each channel is made up of a single-pole,
single-throw (SPST), normally open (NO) switch.
OUT1
One of 30 Channels
Figure 2-1
Model 7037 relay switch configu ation
(simplified s hematic)
2-1
3
Digital I/O Configuration
Introduction
Controlling pull-up devices
This section covers the basic digital input and output config
urations for the Model 7037. Connection information for
these configurations is provided in Section 4 of this manual,
while operation (front panel and IEEE-488 bus) is explained
in Section 5.
Typically, the digital outputs are used to provide drive for relatively high current devices such as solenoids, relays, and
small motors. The configurations for these applications are
shown in Figure 3-1. Figure 3-1 allows you to use an external
voltage source (V) for devices that require a higher voltage
(42V maximum). An internal jumper is used to select the
internal pull-up voltage. At the factory, the internal 5V
source is selected.
Digital outputs
Output channels are user configurable for negative (low) or
positive (high) true logic. That is, the output can be high or
low when the channel is turned on (closed) depending upon
user configuration. Conversely, the output can be high or low
when the channel is turned off (open). Refer to Section 4 to
configure the logic to your requirement
Each output channel uses a fly-back diode for protection
when switching an inductive device, such as a solenoid coil.
This diode diverts the potentially damaging fly-back voltage
away from the driver.
7037
V (42V maximum)
Jumper
VEXT
5V
10kΩ
Solenoid or
relay coil
NOTE: Output configuration uses
an external voltage source
(42V maximum).
Driver
Figure 3-1
Output configu ation for pull-up devices
3-1
Digital I/O Configuration
7037
+V
Jumper
VEXT
5V
RP
10kΩ
A
B
Driver
Or
Gate
Y
Logic
Device
GND
Figure 3-2
Output configu ation using pull-up resistance
Controlling devices using pull-up resistors
CAUTION
Failure to set J201 to the Vext position
when using external pull-up voltages
may result in damage to the output
drivers.
When interfacing outputs to high-impedance devices (i.e.,
logic devices), internal pull-up resistors are used to
achieve the appropriate logic level. Figure 3-2 shows the
output configuration using the 10 Ω pull-up resistor (Rp).
The configuration in Figure 3-2 uses the internal 5V source
as the high logic level. If you need a higher logic level, you
can place the jumper in the alternate position and apply an
external voltage (via VEXT).
When the resistor is connected to 5V, the channel is pulled
high. Thus, with nothing connected to the channel, the input
is pulled high to 5V which displays the channel as on.
When the resistor is connected to ground, the channel is
pulled low. Thus, with nothing connected to the channel, the
input is pulled low to ground which displays the channel as
off.
The digital input is compatible with external TTL logic.
Each built-in pull-up resistor provides level shifting so
devices such as micro-switches can be monitored. Each input
has a protection network that clamps the input at 5.7V. This
allows logic levels up to 42V peak to be monitored.
7037
5V
R2
10kΩ
Digital inputs
Input channels use positive true logic but can be pulled up or
pulled down based on the configuration of the pull-up resistor. Each channel uses a 10kΩ pull-up resistor (R1). The pullup resistors can be pulled up to 5V or pulled down to ground
depending on the positioning of the jumper on the input
logic bank. Refer to Section 4 for more information. Figure
3-3 shows the resistor being pulled up to 5V.
INPUT
GND
R1 = Pull-up resistor
R2 = Input protection resistor
Figure 3-3
Input configu ation
3-2
R1
10kΩ
4
Card Connections and
Installation
Introduction
WARNING
The procedures in this section are
intended only for qualified service personnel. Do not perform these procedures unless qualified to do so. Failure
to recognize and observe normal safety
precautions could result in personal
injury or death.
The information in this section is arranged as follows:
• Handling precaution — Explains precautions that
must be followed to prevent contamination to the card.
Contamination could degrade the performance of the
card.
• Digital I/O connections — Explains the voltage source
jumpers, pull-up resistors, output logic, and input resistance and how to configure them.
• Multi-pin (mass termination) connector card — Covers the basic connections to the 96-pin DIN male connector and identifies each terminal.
• Typical relay switch connection scheme — Provides
a typical connection scheme for a relay switch
configuration
• Typical digital I/O connection schemes — Provides
some typical connection schemes for output solenoid,
relay, motor, and logic device control and for input
micro-switch monitoring.
• Model 7037 installation and removal — Provides the
procedures to install and remove the card from the
Model 7001/7002 mainframe.
4-1
Card Connections and Installation
Handling precautions
To maintain high impedance isolation, care should be taken
when handling the relay and connector cards to avoid contamination from such foreign materials as body oils. Such
contamination can substantially lower leakage resistances,
thus degrading performance.
To avoid possible contamination, always grasp the relay and
connector cards by the side edges or shields. Do not touch
the board surfaces or components. On connectors, do not
touch areas adjacent to the electrical contacts. Dirt buildup
over a period of time is another possible source of contamination. To avoid this problem, operate the mainframe and
card in a clean environment.
If a card becomes contaminated, it should be thoroughly
cleaned as explained in Section 6.
Digital I/O connections
A plug-in jumper for the bank allows you to select the internal +5V source or an external source. In Figure 4-1, the
banks are using the external voltage source.
5V
J201
Vext
U203
31
32
33
34
U201
35
36
37
38
39
40
U202
Figure 4-1
Voltage source jumper for output channels
The voltage source jumper is located on the connector board
as shown in Figure 4-2. Figure 4-3 shows how the plug-in
jumper is installed on J201.
Voltage source jumper
Digital output high uses the internal +5V source as the high
logic level. If higher voltages are required, a user-supplied
voltage can be used (42V maximum). At the factory, the
internal jumper is set to use the internal +5V source.
CAUTION
Failure to set J201 to the Vext position
when using external pull-up voltages
may result in damage to the output
drivers.
4-2
Pull-up resistors
When interfacing outputs to high-impedance devices (i.e.,
logic devices), pull-up resistors are used to achieve the
appropriate logic level. These resistors are installed at the
factory.
Card Connections and Installation
U203
U202
Vext
U201
J201
5V
Figure 4-2
Component locations — connector board
Jumper
Jumper
VEXT
5V
A. 5V Source Selected
VEXT
5V
B. External Source Selected
Figure 4-3
Voltage source jumper installation
4-3
Card Connections and Installation
Configuring digital I/O output logic
Jumper
Referring to Figure 4-4 for the digital I/O output logic location, perform the following steps to configure J101
1. If mated together, separate the relay card from the connector card by removing the mounting screw and then
pulling the two cards away from each other. Remember
to only handle the cards by the edges and shields to
avoid contamination.
2. Locate J101 on the relay board. Refer to Figure 4-4.
3. Determine if you require positive (high) or negative
(low) logic.
4. Install the plug-in jumper in the appropriate position as
shown in Figure 4-5.
Low
A. High Selected
Jumper
Low
B. Low Selected
Figure 4-5
Digital I/O output logic selection
LOW
DOWN
UP
J100
OUTPUT
LOGIC
HIGH
INPUT LOGIC
Configuring digital I/O input pull-up
resistance
J101
WARNING: USER SUPPLIED LETHAL VOLTAGES MAY BE
PRESENT ON CONNECTORS OR P.C. BOARD.
High
Figure 4-4
Digital I/O output logic location
4-4
High
Referring to Figure 4-4 for digital I/O input pull-up resistance location, perform the following steps to configur
J100:
1. If mated together, separate the relay card from the connector card by removing the mounting screw and then
pulling the two cards away from each other. Remember
to only handle the cards by the edges and shields to
avoid contamination.
2. Locate J100 on the relay board. Refer to Figure 4-4.
3. Determine if you require pull-up (5V) or pull-down
(ground) input logic.
4. Install the plug-in jumper in the appropriate position as
shown in Figure 4-6.
Card Connections and Installation
Keithley has a variety of cable and connector accessories
available to accommodate connections from the connector
card to test instrumentation and DUTs (devices under test).
In general, these accessories, which are summarized in
Table 4-1, utilize a round cable assembly for connections.
Jumper
Down
Up
A. Pull-down Resistance
Jumper
Down
Up
Table 4-1
Mass termination accessories
Model
Description
7011-KIT-R
96-pin female DIN connector and housing for round cable (provided with the
Model 7037 card).
7011-MTC-2
Two-meter round cable assembly terminated with a 96-pin female DIN connector on each end.
7011-MTR
96-pin male DIN bulkhead connector.
Terminal identification for the DIN connector of the multipin connector card is provided by Table 4-2 and Figure 4-7.
This connector will mate to a 96-pin female DIN connector.
B. Pull-up Resistance Selected
Figure 4-6
Digital I/O input pull-up resistance selection
Multi-pin (mass termination) connector
card
Since connections to external circuitry are made at the 96-pin
male DIN bulkhead connector, there is no need to separate
the connector card from the relay card. If the connector card
is separated from the relay card, carefully mate them
together. Make sure to handle the cards by the edges and
shields to avoid contamination.
4-5
Card Connections and Installation
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
c
b
a
Relay
Channel
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
View from pin side
of connector
Schematic Schematic
Designator Connector
IN OUT
IN OUT
75 43
11c 11b
74 13
10c 13a
44 12
12b 12a
77 45
13c 13b
76 15
12c 15a
46 14
14b 14a
79 47
15c 15b
78 17
14c 17a
48 16
16b 16a
81 49
17c 17b
80 19
16c 19a
50 18
18b 18a
83 51
19c 19b
82 21
18c 21a
52 20
20b 20a
85 53
21c 21b
84 23
20c 23a
54 22
22b 22a
87 55
23c 23b
86 25
22c 25a
56 24
24b 24a
89 57
25c 25b
88 27
24c 27a
58 26
26b 26a
91 59
27c 27b
90 29
26c 29a
60 28
28b 28a
93 61
29c 29b
92 31
28c 31a
62 30
30b 30a
IN
1
1a
10
10a
11
11a
32
32a
33
1b
42
10b
63
31b
64
32b
73
9c
94
30c
95
31c
96
32c
OUT
VEXT 34 2b
5V
10K
Digital
Output
Channel
GND
2 2a
31
32
33
34
35
36
37
38
39
40
Schematic
Designator
4
6
8
36
38
40
66
68
70
72
Connector
Designator
4a
6a
8a
4b
6b
8b
2c
4c
6c
8c
• Relay switch or digital I/O channels.
• Connector designation, consisting
of rows a-c and columns 1-32.
• Schematic and component layout
designation (1-96).
41
9b
5V
9
9a
10K
Digital
Input Channel
10K
GND
2 2a
Figure 4-7
Multi-pin connector card terminal identificatio
4-6
Pins of the Model 7037 mass
termination connector can be identified
in one of three ways:
1
2
3
4
5
6
7
8
9
10
Schematic
Designator
Connector
Designator
3
5
7
35
37
39
65
67
69
71
3a
5a
7a
3b
5b
7b
1c
3c
5c
7c
Shield
Connection
Card Connections and Installation
Table 4-2
Multi-pin connector card terminal designation cross-reference
Conn.
desig.
1a-32c
Switch
terminal
Schem.
desig.
1-96
Conn.
desig.
1a-32c
Switch
terminal
Schem.
desig.
1-96
Switch
terminal
Conn.
desig.
1a-32c
Schem.
desig.
1-96
Chan 1
IN
OUT
11c
11b
75
43
Chan 17 IN
OUT
20c
23a
84
23
DIG OUT 35
DIG OUT 36
6b
8b
38
40
Chan 2
IN
OUT
10c
13a
74
13
Chan 18 IN
OUT
22b
22a
54
22
DIG OUT 37
DIG OUT 38
2c
4c
66
68
Chan 3
IN
OUT
12b
12a
44
12
Chan 19 IN
OUT
23c
23b
87
55
DIG OUT 39
DIG OUT 40
6c
8c
70
72
Chan 4
IN
OUT
13c
13b
77
45
Chan 20 IN
OUT
22c
25a
86
25
DIG IN 1
DIG IN 2
3a
5a
3
5
Chan 5
IN
12c
76
Chan 21 IN
24b
56
DIG IN 3
7a
7
OUT
15a
15
OUT
24a
24
DIG IN 4
3b
35
Chan 6
IN
OUT
14b
14a
46
14
Chan 22 IN
OUT
25c
25b
89
57
DIG IN 5
DIG IN 6
5b
7b
37
39
Chan 7
IN
OUT
15c
15b
79
47
Chan 23 IN
OUT
24c
27a
88
27
DIG IN 7
DIG IN 8
1c
3c
65
67
Chan 8
IN
OUT
14c
17a
78
17
Chan 24 IN
OUT
26b
26a
58
26
DIG IN 9
DIG IN 10
5c
7c
69
71
Chan 9
IN
OUT
16b
16a
48
16
Chan 25 IN
OUT
27c
27b
91
59
Vext
gnd
2b
2a
34
2
Chan 10 IN
OUT
17c
17b
81
49
Chan 26 IN
OUT
26c
29a
90
29
Shield
Shield
9a
9b
9
41
Chan 11 IN
OUT
16c
19a
80
19
Chan 27 IN
OUT
28b
28a
60
28
nc
nc
1a
10a
1
10
Chan 12 IN
OUT
18b
18a
50
18
Chan 28 IN
OUT
29c
29b
93
61
nc
nc
11a
32a
11
32
Chan 13 IN
OUT
19c
19b
83
51
Chan 29 IN
OUT
28c
31a
92
31
nc
nc
1b
10b
33
42
Chan 14 IN
OUT
18c
21a
82
21
Chan 30 IN
OUT
30b
30a
62
30
nc
nc
31b
32b
63
64
Chan 15 IN
OUT
20b
20a
52
20
DIG OUT 31
DIG OUT 32
4a
6a
4
6
nc
nc
9c
30c
73
94
Chan 16 IN
OUT
21c
21b
85
53
DIG OUT 33
DIG OUT 34
8a
4b
8
36
nc
nc
31c
32c
95
96
4-7
Card Connections and Installation
Typical connection techniques
of the circuit shall be exposed. Properly
cover the conductive parts, or death by
electric shock may occur.
All external circuitry, such as instrumentation and DUTs,
that you want to connect to the card must be terminated with
a single 96-pin female DIN connector. The following connection techniques provide some guidelines and suggestions
for wiring your circuitry.
NOTE
It is recommended that external circuitry
be connected (plugged in) after the Model
7037 is installed in the Model 7001/7002
mainframe and with the mainframe power
off. Installation is covered at the end of
this section.
WARNING
Before beginning any wiring procedures, make sure all power is off and
any stored energy in external circuitry is
discharged.
Round cable assemblies  Figure 4-8 shows typical round
cable connection techniques using accessories available
from Keithley.
WARNING
When wiring a connector, do not leave
any exposed wires. No conductive part
A)
Wire instrumentation
and DUT to bulkhead
connector (See Table 4-2
and Figures 4-7 and 4-9
for terminal identification)
Multi-Pin
Connector
Card
7011-MTC-2
cable assembly
B)
7011-MTR
bulkhead connector
Wire directly to
instrumentation
and DUT
Multi-Pin
Connector
Card
7011-MTC-2
(Cut in Half)
C)
Wire directly to
instrumentation
and DUT
Multi-Pin
Connector
Card
Cable
7011-Kit-R
Connector Kit
Notes: Figure 4-10 provides an exploded view showing
how the connector (with cable) is assembled.
Cable Hitachi p/n N2807-P/D-50TAB is a
50-conductor cable. Two of these cables
can be used to supply 100 conductors.
Figure 4-8
Typical round cable connection techniques
4-8
Card Connections and Installation
In Figure 4-8A, connections are accomplished using a Model
7011-MTC-2 cable and a Model 7011-MTR bulkhead connector. The two-meter round cable is terminated with a 96pin female DIN connector at each end. This cable mates
directly to the multi-pin connector card and to the bulkhead
connector. The bulkhead connector has solder cups to allow
direct connection to instrumentation and DUT. Figure 4-9
provides pinout for the bulkhead connector. The view shown
is from the solder cup end of the connector.
In Figure 4-8B, connections are accomplished using a Model
7011-MTC-2 cable assembly that is cut in half. The 96-pin
female DIN connector on one end of the cable mates directly
to the multi-pin connector card. The unterminated end of the
cable is wired directly to instrumentation and DUT. The
other half of the cable assembly could be used for a second
card.
In Figure 4-8C, connections are accomplished using a
custom-built cable assembly that consists of a Model 7011KIT-R connector and a suitable round cable. Hitachi cable
part number N2807-P/D-50TAB is a 50-conductor round
cable. Two of these cables can be used to provide 100
conductors. The connector has solder cups to accommodate
the individual wires of the unterminated cable. Figure 4-10
provides an exploded view of the connector assembly and
shows how the cable is connected. For further Model
7011-KIT-R assembly information, refer to the packing list
provided with the kit. The connector end of the resultant
cable assembly mates directly to the multi-pin connector
card. The unterminated end of the cable assembly is wired
directly to instrumentation and DUT.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
c
b
a
View from solder
cup side of
connector
Note: See Figure 4-7 for terminal identification.
Figure 4-9
Model 7011-MTR connector pinout
Figure 4-10
Model 7011-KIT-R (with cable) assembly
4-9
Card Connections and Installation
Typical relay switch connection scheme
The following paragraphs show how the Model 7037 could
be connected to a system that activates external devices and
circuits.
Figure 4-11 shows how external connections can be made to
the system using the Model 7011-MTC-2 cable that is unterminated at one end. The unterminated end of the cable can be
hard-wired directly to the external devices and power
supplies.
The other end will mate to the Model 7037 card. Connection
details are provided in the Multi-pin (mass termination) connections paragraph.
If adding more Model 7037 cards to a system, simply wire
them in the same manner as the f rst. Remember that
Model 7037 cards installed in the same mainframe are electrically isolated from each other.
7037
Indicator
Lamp
Alarm
7011-MTC-2
Cable (Cut in half)
Relay
5V
12V
30V
7037
IN 1
OUT 1
Indicator
Lamp
5V
IN 21
OUT 21
IN 2
OUT 2
IN 22
OUT 22
Alarm
12V
IN 3
OUT 3
IN 23
OUT 23
30V
Relay
Equivalent Circuit
Figure 4-11
Typical connection scheme for Model 7037
4-10
Card Connections and Installation
Typical digital I/O connection schemes
Output connection schemes
The following examples show output connections from the
card to external circuitry and summarize the required internal connections on the card. Each example assumes negative
true logic is used. To conf gure for positive true logic, refer
to the Conf guring digital I/O output logic paragraph.
Motor control — Figure 4-13 shows a digital output connection scheme to control small 12V dc motors. An external 12V
source is used to provide the necessary voltage level. A
motor is turned on when the corresponding output channel is
turned on (closed).
7037
Motors
VEXT
+
Solenoid control — Figure 4-12 shows a digital output connection scheme to control solenoids. This example assumes
that an external 24V source is being used. A solenoid is energized when the corresponding output channel is turned on
(closed).
7037
12V
–
M
M
OUT 39
Solenoids
OUT 40
VEXT
+
24V
GND
–
OUT 31
Internal connections:
External voltage source (VEXT) selected.
OUT 32
OUT 33
Figure 4-13
Digital output, motor control
GND
Internal Connections:
External voltage source (VEXT) selected.
Figure 4-12
Digital output, solenoid control
4-11
Card Connections and Installation
Logic device control — Figure 4-14 shows a digital output
connection scheme to control a logic device. This example
assumes that an internal +5V voltage source is being used.
Microswitches
7037
IN 1
+5V
Logic device
7037
A
OUT 31
B
OUT 32
74LS138
DMUX
Y0
IN 3
Y1
Y2
C
OUT 33
IN 2
Y3
Y4
VCC
GND
GND
G2A
GND
Y5
Y6
Y7
Internal connections:
Internal voltage source (+5V) used.
A. Input resistor is set to pull up.
Microswitches
7037
IN 1
Figure 4-14
Digital output, logic device control
IN 2
IN 3
The logic device is a demultiplexer (DMUX). The binary
pattern (value) seen at the input of the DMUX (lines A, B,
and C) determines which DMUX output line (Y0 through
Y7) is selected (pulled low). For example, with channels 1,
2, and 3 off (open), lines A, B and C are high. The binary 7
at the DMUX input (A = 1, B = 1 and C = 1) selects (pulls
low) output Y7. If channel 32 is turned on (closed), line B
goes low. The binary 5 seen at the DMUX input (1, 0, 1)
selects (pulls low) Y5.
Input connection scheme
Figure 4-15 shows a digital input connection scheme to monitor the state of micro-switches. With a switch open and the
input resistor conf gured for pull up as shown in
Figure 4-15a, the corresponding input channel is pulled high
by the internal input resistor. As a result, the input channel is
high (appears as a bar on the Model 7001 display or a lit LED
on the Model 7002). When a switch is closed, the corresponding input channel is pulled low to ground. As a result,
the input channel is low (appears as a single dot on the Model
7001 display or an unlit LED on the Model 7002).
4-12
+V
B. Input resistor is set to pull down.
Figure 4-15
Digital input, monitoring micro-switches
With a switch open and the input resistance conf guration set
to pull down as shown in Figure 4-15b, the corresponding
input channel is pulled low by the internal input resistor. As
a result, the input channel is low. When a switch is closed, the
corresponding input channel is pulled high. As a result, the
input channel is high.
For more information on conf guring pull-up resistance,
refer to the Conf guring digital I/O input pull-up resistance
paragraph.
Card Connections and Installation
Model 7037 installation and removal
The following paragraphs explain how to install and remove
the Model 7037 card from the Model 7001/7002 mainframe.
WARNING
Installation or removal of the Model
7037 is to be performed by qualified service personnel. Failure to recognize and
observe standard safety precautions
could result in personal injury or death.
CAUTION
To prevent contamination to the Model
7037 card that could degrade performance, only handle the card by the
edges and shields.
1. Mate the connector card to the relay card if they are separated. Install the supplied 4-40 screw at the end of the
card to secure the assembly. Make sure to handle the
cards by the edges and shields to prevent contamination.
2. Facing the rear panel of the mainframe, select the slot
(CARD 1 or CARD 2) that you want to install the
Model 7037 card in.
3. Referring to Figure 4-16, feed the Model 7037 card into
the desired slot so the edges of the relay card ride in the
rails.
4. With the ejector arms in the unlocked position, push the
Model 7037 card all the way into the mainframe until
the arms engage into the ejector cups. Then push both
arms inward to lock the card into the mainframe.
WARNING
To avoid electric shock that could result
in injury or death, make sure to properly
install and tighten the safety ground
screw shown in Figure 4-16.
Card installation
Perform the following steps to install the Model 7037 card in
the Model 7001/7002 mainframe:
WARNING
5. Install the screw shown in Figure 4-16.
Card removal
Turn off power from all instrumentation
(including the Model 7001/7002 mainframe) and disconnect their line cords.
Make sure all power is removed and
stored energy in external circuitry is discharged.
To remove the Model 7037 card, f rst unloosen the safety
ground screw, unlock the card by pulling the latches outward, and then pull the card out of the mainframe. Remember to handle the card by the edges and shields to avoid
contamination that could degrade performance.
Ejector
Arms (2)
Screw
Unlock card
Screw
Lock card
Figure 4-16
Model 7037 card installation in Model 7001
4-13
Card Connections and Installation
4-14
5
Operation
Introduction
Digital I/O maximum signal levels
The information in this section is formatted as follows:
Output channels
• Power limits — Summarizes the maximum power limits of the Model 7037 card assembly.
• Mainframe control of the card — Summarizes programming steps to control the card from the Model
7001/7002 Switch System mainframe.
• Measurement considerations — Reviews a number of
considerations when using the Model 7037 to make
measurements.
Power limits
CAUTION
To prevent damage to the card, do not
exceed the maximum signal level specifications of the card. For reactive loads,
be sure to use voltage clamping and current limiting as explained in the Reactive loads paragraph.
Maximum user-supplied pull-up voltage: 42V
Maximum sink current:
Per channel: 250mA
Per card: 1A
Input channels
Maximum voltage level: 42V peak
Relay switch maximum signal levels
To prevent overheating or damage to the relays, never exceed
the following maximum signal levels: 110V DC, 110V rms,
155V peak between any two inputs or chassis, 1A switched,
30VA (resistive load).
Reactive loads
Operation is specified for resistive loads. Reactive loads
require voltage clamping (for inductive loads) and current
surge limiting (for capacitive loads) to prevent damage to the
relays and to external circuitry.
5-1
Operation
Inductive loads  Inductive reaction voltage must be limited to less than 110V in DC circuits or 110V rms, 155V peak
in AC circuits. Also consider the load when determining the
voltage limit. Clamping circuits that can be used are shown
in Figure 5-1.
Capacitive loads  The initial surge current from a capacitive reactive load must be limited. Figure 5-2 shows circuits
that can be used to limit current surges. To protect the relay,
limit current to 1A. Also consider the load when determining
the current surge limit.
7037
IN 1
1A
FUSE
OUT 2
V
A. Resistor Limited R = I Limit
7037
IN 1
OUT 1
1A
FUSE
IN 2
OUT 1
1A
FUSE
R
Load
OUT 2
IN 2
Load
IN 2
7037
IN 1
R
OUT 1
Thermistor*
(Rs)
Load
OUT 2
* High resistance when cold.
Low resistance when hot.
Fast thermal recovery.
V
B. Thermistor Limited Rs = I Limit
A. Resistor Clamped (AC or DC Voltages)
7037
IN 1
+
OUT 1
1A
FUSE
D
Figure 5-2
Limiting capacitive reaction current
Load
OUT 2
IN 2
Mainframe control of the card
B. Diode Clamped (DC Voltages)
The following information pertains to the Model 7037 card.
It assumes you are familiar with the operation of the Model
7001/7002 mainframe.
7037
IN 1
OUT 1
Zener
Diode
Diode
1A
FUSE
Load
OUT 2
IN 2
Zener
Diode
Diode
C. Zener Clamped (AC Voltages)
7037
IN 1
OUT 1
C
1A
FUSE
IN 2
Load
R
OUT 2
D. Resistor-Capacitor Clamped (AC Voltages)
Figure 5-1
Limiting inductive reaction voltage
5-2
If you are not familiar with the operation of the mainframe,
it is recommended that you proceed to Getting Started (Section 3) in the Model 7001 or Model 7002 Instruction Manual
after reading the following information.
Operation
7001 Display
CARD 1
1
2
3
4
5
CARD 2
6
7
8
9
10
1
2
3
4
5
6
7
8
9
10
= Open Channel
= Closed Channel
Figure 5-3
Model 7001 channel status display
7002 LED Display
Channel assignments
SLOT 1
The Model 7001 has a channel status display (Figure 5-3)
that provides the real-time state of each available channel.
The left portion of the display is for slot 1 (card 1), and the
right portion is for slot 2 (card 2). With two Model 7037
cards installed in the mainframe, the 40 channels of each
card will be displayed as shown in Figure 5-3. For the Model
7002, channel status LED grids are used for the ten slots. The
LED grid for slot 1 is shown in Figure 5-4.
Organization of the channel status display for each slot is
shown in Figure 5-5. The card contains 40 channels and
is made up of 30 independent channels of one-pole switching
and ten digital output channels.
Digital
Output
Channels
ROW
1
1
2
3
4
COLUMN
5 6 7
8
9 10
2
3
4
= Open channel
= Closed channel
Figure 5-4
Model 7002 channel status display (slot 1)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Figure 5-5
Channel display organization
5-3
Operation
To control the card from the mainframe, each relay and
digital output must have a unique channel assignment.
The channel assignments for the card are provided in
Figure 5-6. Each channel assignment is made up of the slot
designator (1 or 2) and the relay or digital output channel.
For the Model 7002, the slot designator can be from 1 to 10
since there are ten slots. To be consistent with Model 7001/
7002 operation, the slot designator and channel are separated
by exclamation points (!). Some examples of channel
assignments are as follows:
All digital input and output channels are isolated from the
backplane of the mainframe. With the mainframe in the normal display state, the status (on or off) of the output and relay
channels is displayed. When the mainframe is in the read
input channels mode, the status (on or off) of the input channels is displayed.
The hardware for the digital output channels is user config
urable for negative or positive true logic. That is, depending
on the user configuration, the output can go high or be pulled
low when the channel is turned on (closed) or off (open). To
configure output logic, refer to Section 4
CHANNEL 1!1 = Slot 1, Channel 1
CHANNEL 1!40 = Slot 1, Channel 40 (Output 40 of
Digital I/O)
CHANNEL 2!2 = Slot 2, Channel 2
CHANNEL 2!34 = Slot 2, Channel 34 (Output 34 of
Digital I/O)
Input channels use positive true logic but can be configure
to pull up or pull down. Thus, a channel can be pulled high
or pulled low when the input is open depending on the
jumper configuration. Input channels will be displayed as
high (on) when the input has a high logic level applied. Conversely, an input channel will be displayed as low (off) when
a low logic level is applied.
A. Slot 1
(Card 1)
B. Slot 2
(Card 2)
1
2
3
4
5
6
7
8
9
10
1!1
1!2
1!3
1!4
1!5
1!6
1!7
1!8
1!9
1!10
1!11
1!12
1!13
1!14
1!15
1!16
1!17
1!18
1!19
1!20
1!21
1!22
1!23
1!24
1!25
1!26
1!27
1!28
1!29
1!30
1!31
1!32
1!33
1!34
1!35
1!36
1!37
1!38
1!39
1!40
1
2
3
4
5
6
7
8
9
10
2!1
2!2
2!3
2!4
2!5
2!6
2!7
2!8
2!9
2!10
2!11
2!12
2!13
2!14
2!15
2!16
2!17
2!18
2!19
2!20
2!21
2!22
2!23
2!24
2!25
2!26
2!27
2!28
2!29
2!30
2!31
2!32
2!33
2!34
2!35
2!36
2!37
2!38
2!39
2!40
Examples:
1!18 = Slot 1, Channel 18
2!36 = Slot 2, Channel 36 (Output 36, Digital I/O)
Figure 5-6
Model 7037 programming channel assignments
5-4
These channels are displayed and controlled from the normal
display state of the mainframe. If currently in the menu
structure, return to the normal display state by pressing
EXIT.
Operation
Closing and opening channels
NOTE
This procedure applies to relay channels
(channels 1!1 through 1!30) and digital
I/O output channels (1!31 through 1!40).
Digital input channels are read only.
A channel is closed (turned on) from the front panel by simply keying in the channel assignment and pressing CLOSE.
For example, to close channel 18 of a card installed in slot 2,
key in the following channel list and press CLOSE:
SELECT CHANNELS 2!18
The above closed channel can be opened (turned off) by
pressing OPEN or OPEN ALL. The OPEN key opens only
the channels specified in the channel list, and OPEN ALL
opens all channels.
NOTE
For the Model 7002, you can use the light
pen to open and close channels.
Pressing CLOSE will turn on channel 2!1 and the channels
that make up channel pattern M1. Refer to the instruction
manual for the mainframe and for information on definin
channel patterns.
Scanning channels
Channels are scanned by creating a scan list and configurin
the Model 7001/7002 to perform a scan. The scan list is created in the same manner as a channel list. (See the previous
Closing and opening channels paragraph.) However, the scan
list is specified from the SCAN CHANNELS display mode.
(The SCAN LIST key toggles between the channel list and
scan list.) The following shows an example of a scan list:
SCAN CHANNELS 2!1, 2!3, 2!1-2!5
When a scan is performed, the channels specified in the scan
list will be scanned in the order that they are presented in the
scan list.
Channel patterns can also be used in a scan list. This allows
you to control specific bit patterns for logic circuits.
Example:
SCAN CHANNELS M1, M2, M3, M4
The following display is an example of a channel list that
consists of several channels:
SELECT CHANNELS 2!1, 2!3, 2!222!25
Notice that channel entries are separated by commas (,). A
comma is inserted by pressing ENTER or the right cursor
key (©). The channel range is specified by using the hyphen
(-) key to separate the range limits. Pressing CLOSE will
close all the channels specified in the channel list. Pressing
OPEN (or OPEN ALL) will open the channels.
Channel patterns can also be used in a channel list. This
allows you to control specific bit patterns for logic circuits.
Example:
When M1 is scanned, the channels that make up channel pattern M1 will turn on. When M2 is scanned, the M1 channels
will turn off and the channels that make up M2 will turn on.
M3 and M4 are scanned in a similar manner. Refer to the
instruction manual for the mainframe for information on
defining channel patterns
A manual scan can be performed by using the RESET
default conditions of the Model 7001/7002. RESET is
selected from the SAVESETUP menu of the main MENU.
When RESET is performed, the mainframe is configured for
an infinite number of manual scans. The first press of STEP
takes the mainframe out of the idle state. The next press of
STEP will close the first channel specified in the scan list.
Each subsequent press of STEP will select the next channel
in the scan list.
SELECT CHANNELS 2!1, M1
5-5
Operation
Reading input channels
Closing and opening channels
Input channels are read from the READ-I/O-CARD option
of the CARD CONFIG MENU of the mainframe. This menu
is accessed by pressing the CARD key. In this “read input
channels” display mode, the mainframe displays the realtime state of each input channel.
The following SCPI commands are used to open and close
relay and digital I/O output channels:
Input channels use positive true logic but can be configure
to pull up or pull down. Open inputs will read high (on) if
inputs are configured for pull up. Conversely, open inputs
will read low (off) when configured for pull down. To config
ure pull-up resistance, refer to Section 4.
The following program statement turns on channels 1!1, 1!4
through 1!6, and the channels that make up channel pattern
M1.
Perform the following steps to configure the mainframe to
display the digital input channels.
Notice that the colon (:) is used to separate the range limits.
1. Press the CARD CONFIGURATION key to display the
CARD CONFIG MENU.
2. Use the § and © keys to place the cursor on READ-I/
O-CARD and press ENTER.
Model 7001 mainframe — The real-time state (on or
off) of each input channel is provided on the first row of
the display. Only digital I/O input channels are displayed.
Model 7002 mainframe — The real-time state (on or
off) of each input channel is provided on the first row of
the appropriate LED display grid. Use the TYPE option
of the CARD CONFIG MENU if you do not know
which slot the card is installed in.
3. Use the EXIT key to exit from the “read input channels”
display mode.
NOTE
With input channels displayed, you can
turn off (open) all other channels by pressing OPEN ALL.
IEEE-488 bus operation
Bus operation is demonstrated using Microsoft QuickBASIC
4.5, the Keithley KPC-488.2 (or Capital Equipment Corporation) IEEE interface and the HP-style Universal Language
Driver (CECHP). Refer to “QuickBASIC 4.5 Programming”
in the mainframe manual for details on installing the Universal Language Driver, opening driver files, and setting the
input terminal. Program statements assume that the primary
address of the mainframe is 07.
5-6
:CLOSe <list>
:OPEN <list>|ALL
Closes specified channels
Opens specified (or all) channels.
PRINT #1, "output 07; clos (@ 1!1, 1!4:1!6, M1)"
Either of the following statements turns off channels 1!1, 1!4
through 1!6, and the channels of M1:
PRINT #1, "output 07; open (@ 1!1, 1!4:1!6, M1)"
PRINT #1, "output 07; open all"
Scanning output channels
There are many commands associated with scanning. However, it is possible to configure a scan using as little as four
commands. These commands are listed as follows:
*RST
:TRIGger:COUNt:AUTo ON
:ROUTe:SCAN <list>
:INIT
The first command resets the mainframe to a default scan
configuration. The second command automatically sets the
channel count to the number of channels in the scan list, the
third command defines the scan list, and the fourth command
takes the Model 7001/7002 out of the idle state.
The following program fragment will perform a single scan
of channels 1 through 4 of slot 1 and the channels that make
up channel pattern M1:
PRINT
PRINT
PRINT
PRINT
#1,
#1,
#1,
#1,
"output
"output
"output
"output
07;
07;
07;
07;
*rst"
trig:coun:auto on"
scan (@ 1!1:1!4, M1)"
init"
Operation
The first statement selects the *RST default configuration for
the scan. The second statement sets channel count to the
scan-list-length (5). The third statement defines the scan list,
and the last statement takes the mainframe out of the idle
state. The scan is configured to start as soon as the :INIT
command is executed.
When the above program fragment is run, the scan will be
completed in approximately 240msec (3msec delay for
channel closures and 3msec delay for each open), which is
too fast to view from the front panel. An additional relay
delay can be added to the program to slow down the scan for
viewing. The program is modified by adding a statement to
slow down the scan. Also, a statement is added to the beginning of the program to ensure that all channels are open
before the scan is started. The two additional statements are
indicated in bold typeface.
PRINT
PRINT
PRINT
PRINT
PRINT
PRINT
#1,
#1,
#1,
#1,
#1,
#1,
"output
"output
"output
"output
"output
"output
07;
07;
07;
07;
07;
07;
open all"
*rst"
trig:coun:auto on"
trig:del 0.5"
scan (@ 1!1:1!4, M1)"
init"
The first statement opens all channels, and the fourth statement sets a 1/2 second delay after each channel closes.
Reading digital I/O input channels
The following SCPI commands are used to read the status of
digital I/O input channels:
:SENSe2:DATA?
:SENSe3:DATA?
:SENSe4:DATA?
:SENSe5:DATA?
:SENSe6:DATA?
:SENSe7:DATA?
:SENSe8:DATA?
:SENSe9:DATA?
<list>
<list>
<list>
<list>
<list>
<list>
<list>
<list>
Read input channels; slot 1
Read input channels; slot 2
Read input channels; slot 3
Read input channels; slot 4
Read input channels; slot 5
Read input channels; slot 6
Read input channels; slot 7
Read input channels; slot 8
:SENSe10:DATA? <list>
:SENSe11:DATA? <list>
Read input channels; slot 9
Read input channels; slot 10
The conventional form for the <list> parameter includes the
slot and input channel number. However, for these commands you do not need to include the slot number. For example, you can send either of the following two commands to
read input channel 2 in slot 6:
:SENSe7:DATA? (@6!2) or :SENSe7:DATA? (@2)
After the mainframe is addressed to talk, the response message will indicate the state of each listed input channel. A
returned “0” indicates that the channel is off (open), and a
returned “1” indicates that the channel is on (closed).
The following program fragment reads channel 3 of a digital
I/O card installed in slot 1:
PRINT #1, "output 07; sens2:data? (@3)"
PRINT #1, "enter 07"
LINE INPUT #2, A$
PRINT A$
The first statement reads input channel 3 (slot 1). The second
statement addresses the mainframe to talk (sends response
message to computer). The third statement reads the
response message, and the last statement displays the message (0 or 1) on the computer CRT.
The above program fragment is modified to read all ten digital I/O input channels in slot 1 as follows. The modifie
statement is shown in bold typeface.
PRINT #1, "output 07; sens2:data? (@1:10)"
PRINT #1, "enter 07"
LINE INPUT #2, A$
PRINT A$
The response message will include a “0” (off) or “1” (on) for
each of the ten input channels (i.e. “0, 0, 0, 1, 0..... 0, 1”).
5-7
Operation
Measurement considerations
R DUT
Many measurements made with the Model 7037 are subject
to various effects that can seriously affect low-level measurement accuracy. The following paragraphs discuss these
effects and ways to minimize them.
E DUT
R PATH
Path isolation
The path isolation is simply the equivalent impedance
between any two test paths in a measurement system. Ideally,
the path isolation should be infinite, but the actual resistance
and distributed capacitance of cables and connectors results
in less than infinite path isolation alues for these devices.
Path isolation resistance forms a signal path that is in parallel
with the equivalent resistance of the DUT, as shown in Figure 5-7. For low-to-medium device resistance values, path
isolation resistance is seldom a consideration; however, it
can seriously degrade measurement accuracy when testing
high-impedance devices. The voltage measured across such
a device, for example, can be substantially attenuated by the
voltage divider action of the device source resistance and
path isolation resistance, as shown in Figure 5-8. Also, leakage currents can be generated through these resistances by
voltage sources in the system.
E OUT =
E DUT R PATH
R DUT + R PATH
Figure 5-8
Voltage attenuation by path isolation resistance
Any differential isolation capacitance affects DC measurement settling time as well as AC measurement accuracy.
Thus, it is often important that such capacitance be kept as
low as possible. Although the distributed capacitance of the
card is generally fi ed by design, there is one area where you
do have control over the capacitance in your system: the connecting cables. To minimize capacitance, keep all cables as
short as possible.
Magnetic fields
R DUT
R PATH
R IN
V
E DUT
DUT
7037
Card
Measure
Instrument
R DUT
= Source Resistance of DUT
E DUT
= Source EMF of DUT
R PATH
= Path Isolation Resistance
R IN
= Input Resistance of Measuring Instrument
Figure 5-7
Path isolation resistance
5-8
When a conductor cuts through magnetic lines of force, a
very small current is generated. This phenomenon will frequently cause unwanted signals to occur in the test leads of a
relay switching system. If the conductorhas sufficient length,
even weak magnetic fields like those of the earth can create
sufficient signals to a fect low-level measurements.
Two ways to reduce these effects are: (1) reduce the lengths
of the test leads, and (2) minimize the exposed circuit area.
In extreme cases, magnetic shielding may be required. Special metal with high permeability at low flux densities (such
as mu metal) is effective at reducing these effects.
Even when the conductor is stationary, magnetically induced
signals may still be a problem. Fields can be produced by
various signals such as the AC power line voltage. Large
inductors such as power transformers can generate substantial magnetic fields, so care must be taken to keep the switching and measuring circuits a good distance away from these
potential noise sources.
Operation
At high current levels, even a single conductor can generate
significant fields. These effects can be minimized by using
twisted pairs, which will cancel out most of the resulting
fields
Radio frequency interference
Radio Frequency Interference (RFI) is a general term used to
describe electromagnetic interference over a wide range of
frequencies across the spectrum. Such RFI can be particularly troublesome at low signal levels, but it can also affect
measurements at high levels if the problem is of sufficien
severity.
RFI can be caused by steady-state sources such as radio or
TV signals or some types of electronic equipment (microprocessors, high speed digital circuits, etc.), or it can result from
impulse sources, as in the case of arcing in high-voltage environments. In either case, the effect on the measurement can
be considerable if enough of the unwanted signal is present.
RFI can be minimized in several ways. The most obvious
method is to keep the equipment and signal leads as far away
from the RFI source as possible. Shielding the Model 7037
relay-digital I/O card, signal leads, sources, and measuring
instruments will often reduce RFI to an acceptable level. In
extreme cases, a specially constructed screen room may be
required to sufficiently attenuate the troublesome signal
Many instruments incorporate internal filtering that may
help to reduce RFI effects in some situations. In some cases,
additional external filtering may also be required. Keep in
mind, however, that filtering may have detrimental effects on
the desired signal.
shown in Figure 5-9, the resulting ground loop causes current to fl w through the instrument LO signal leads and then
back through power line ground. This circulating current
develops a small, but undesirable, voltage between the LO
terminals of the two instruments. This voltage will be added
to the source voltage, affecting the accuracy of the measurement.
Figure 5-10 shows how to connect several instruments together to eliminate this type of ground loop problem. Here,
only one instrument is connected to power line ground.
Signal Leads
Instrument 1
Instrument 2
Ground Loop
Current
Power Line Ground
Figure 5-9
Power line ground loops
Instrument 1
Instrument 2
Ground loops
When two or more instruments are connected together, care
must be taken to avoid unwanted signals caused by ground
loops. Ground loops usually occur when sensitive instrumentation is connected to other instrumentation with more
than one signal return path such as power line ground. As
Instrument 3
Instrument 3
Power Line Ground
Figure 5-10
Eliminating ground loops
5-9
Operation
Ground loops are not normally a problem with instruments
having isolated LO terminals. However, all instruments in
the test setup may not be designed in this manner. When in
doubt, consult the manual for all instrumentation in the test
setup.
Keeping connectors clean
As is the case with any high-resistance device, the integrity
of connectors can be damaged if they are not handled properly. If connector insulation becomes contaminated, the insulation resistance will be substantially reduced, affecting
high-impedance measurement paths.
Oils and salts from the skin can contaminate connector insulators, reducing their resistance. Also, contaminants present
in the air can be deposited on the insulator surface. To avoid
5-10
these problems, never touch the connector insulating material. In addition, the Model 7037 card should be used only in
clean, dry environments to avoid contamination.
If the connector insulators should become contaminated,
either by inadvertent touching or from airborne deposits,
they can be cleaned with a cotton swab dipped in clean methanol. After thorough cleaning, they should be allowed to dry
for several hours in a low-humidity environment before use,
or they can be dried more quickly using dry nitrogen.
AC frequency response
The AC frequency response of the Model 7037 is important
in test systems that switch AC signals. Refer to the specifica
tions at the front of this manual.
6
Service Information
WARNING
The information in this section is
intended only for qualified service personnel. Some of the procedures may
expose you to hazardous voltages that
could result in personal injury or death.
Do not attempt to perform these procedures unless you are qualified to do so.
Introduction
This section contains information necessary to service the
Model 7037 relay-digital I/O card and is arranged as follows:
• Handling and cleaning precautions  Discusses handling procedures and cleaning methods for the card.
• Performance verificatio  Covers the procedures
necessary to determine if the card is operating properly.
• Channel functionality test  Provides a test procedure to determine if a digital I/O input or output channel
is functioning properly.
• Special handling of static-sensitive devices  Reviews precautions necessary when handling static-sensitive devices.
• Principles of operation  Briefly discusses circuit operation.
Handling and cleaning precautions
Because of the high impedance circuits on the Model 7037,
care should be taken when handling or servicing the card to
prevent possible contamination that could degrade performance. The following precautions should be taken when
handling the card.
Do not store or operate the card in an environment where
dust could settle on the circuit board. Use dry nitrogen gas to
clean dust off the card if necessary.
Handle the card only by the side edges and shields. Do not
touch any board surfaces, components, or connectors. Do not
touch areas adjacent to electrical contacts. When servicing
the card, wear clean cotton gloves.
If making solder repairs on the circuit board, use an
OA-based (organic activated) flux. Remove the flux from
these areas when the repair is complete. Use pure water
along with plenty of clean cotton swabs to remove the flux
Take care not to spread the flux to other areas of the circuit
board. Once the flux has been removed, swab only the
repaired area with methanol, then blowdry the board with
dry nitrogen gas.
After cleaning, the card should be placed in a 50°C low
humidity environment for several hours.
• Troubleshooting  Presents some troubleshooting
tips for the card.
6-1
Service Information
Performance verification
Environmental conditions
The following paragraphs discuss performance verificatio
procedures for the Model 7037, including channel resistance, offset current, contact potential, and isolation.
All verification measurements should be made at an ambient
temperature between 18° and 28°C, and at a relative humidity of less than 70%.
CAUTION
Recommended equipment
Contamination will degrade the performance of the card. To avoid contamination, always grasp the card by the side
edges and shields. Do not touch the connectors and do not touch the board surfaces or components. On plugs and
receptacles, do not touch areas adjacent
to the electrical contacts.
Table 6-1 summarizes the equipment necessary for performance verification, along with an application for each unit.
Card connections
The following information summarizes methods that can be
used to connect test instrumentation to the connector card.
Detailed connection information is provided in Section 4.
NOTE
Failure of any performance verification
test may indicate that the switch card is
contaminated. See the Handling and
cleaning precautions paragraph to clean
the card.
Table 6-1
Verification equipmen
Description
Model
Specifications
Applications
DMM
Keithley Model 2000
100Ω; 0.01%
Path resistance
Electrometer w/voltage source
Keithley Model 6517A
20pA, 200pA; 1%
100V source; 0.15%
Offset current, path isolation
Sensitive Digital Voltmeter
Keithley Model 182
3mV; 60ppm
Contact potential
Triax cable (unterminated)
Keithley Model 7025

Offset current
Low thermal cable
(unterminated)
Keithley Model 1484

Contact potential
6-2
Service Information
One method to make instrument connections to the card is to
hard-wire a 96-pin female DIN connector and then mate it to
the connector on the Model 7037. Shorting connections can
also be done at the connector. The connector in the Model
7011-KIT-R connection kit (see Table 4-1) can be used for
this purpose. Pin identification for the multi-pin connector
for the connector card is provided by Figure 4-7 and
Table 4-2.
Channel resistance tests
Referring to Figure 6-1, perform the following steps to verify
that each contact of every relay is closing properly and that
the resistance is within specification
WARNING
When wiring a connector, do not leave
any exposed wires. No conductive part
of the circuit may be exposed. Properly
cover the conductive parts, or death by
electric shock may occur.
CAUTION
After making solder connections to a
connector, remove solder flux as
explained at the beginning of this section. Failure to clean the solder connections could result in degraded
performance, preventing the card from
passing verification tests.
1. Turn off the Model 7001/7002 if it is on.
2. Set the Model 2000 to the 100Ω range and connect four
test leads to the INPUT and SENSE Ω 4 WIRE input.
3. Short the four test leads together and zero the Model
2000. Leave zero enabled for the entire test.
4. Connect INPUT HI and SENSE Ω 4 WIRE HI of the
Model 2000 to the input (IN) terminal of channel 1 as
shown in Figure 6-1.
5. Connect INPUT LO and SENSE Ω 4 WIRE LO to the
output (OUT) terminal of channel 1.
6. With the card installed in slot 1 (CARD 1) of the mainframe, turn on the Model 7001/7002 and program it to
close channel 1!1 (slot 1, channel 1). Verify that the
resistance of this channel is <1.25Ω.
7. Repeat the basic procedure of steps 1 through 6 to test
the rest of the channels of the Model 7037 card. Remember to close the channel that the Model 2000 is connected to.
Before pre-wiring any connector plugs, study the following
test procedures to fully understand the connection
requirements.
Each Channel:
Sense Ω 4 Wire HI
7037
IN
Input HI
HI
LO
POWER
Model 2000
(Measure 4-Wire Ohms)
Input LO
Sense Ω 4 Wire LO
OUT
Path Resistance Test
Figure 6-1
Channel resistance testing
6-3
Service Information
Offset current tests
3. Install the Model 7037 card in slot 1 (CARD 1) of the
Model 7001/7002 if it is not already installed.
4. On the Model 6517A, select the 200pA range and
enable zero check and zero correct the instrument.
Leave zero correct enabled for the entire procedure.
5. Turn on the Model 7001/7002.
6. Program the Model 7001/7002 to close channel 1!1.
7. On the Model 6517A, disable zero check and verify that
it is <100pA. This measurement is the common-mode
leakage current of the channel.
8. On the Model 6517A, enable zero check.
9. Repeat the basic procedure in steps 1 through 8 to check
the other channels. Remember to close the channel that
the electrometer is connected to.
These tests check leakage current from input (IN) and output
(OUT) to chassis (common mode) for each channel. In general, these tests are performed by simply measuring the leakage current with an electrometer. In the following procedure,
the Model 6517A is used to measure leakage current.
Referring to Figure 6-2, perform the following procedure to
check offset current:
1. Turn off the Model 7001/7002 if it is on.
2. Connect the Model 6517A electrometer to channel 1 as
shown in Figure 6-2. Note that electrometer HI is connected to input (IN) of channel 1. Electrometer LO is
connected to chassis ground, which is accessible at the
rear panel of the mainframe.
Model 7025
Unterminated
Triax Cable
Each Channel:
WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.
90-110V
105-125V
115V
!
7037
180-220V
210-250V
HI
!
IN
LO
CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.
Model 6517A
(Measure Current)
Chassis ground can be
accessed at the rear
panel of the 7001/7002
Figure 6-2
Offset current testing
6-4
OUT
Service Information
Contact potential tests
These tests check the EMF generated by each relay contact
for each channel. The tests simply consist of using a sensitive
DVM (Model 182) to measure the contact potential.
Perform the following procedure to check contact potential
of each path:
1. Turn off the Model 7001/7002 if it is on.
2. Set the Model 182 to the 3mV range, short the input
leads, and press REL READING to null out internal offset. Leave REL enabled for the entire procedure.
3. Connect the Model 182 to channel 1 as shown in
Figure 6-3.
4. Install the Model 7037 card in slot 1 (CARD 1) of the
Model 7001/7002 if it is not already installed.
5. Turn on the Model 7001/7002.
6. Program the Model 7001/7002 to close channel 1!1.
7. Verify that the reading on the Model 182 is <4µV. This
measurement is the contact potential of the channel.
8. Repeat the basic procedure in steps 1 through 7 to test
the rest of the channels of the Model 7037.
Channel to channel isolation tests
These tests check the leakage resistance (isolation) between
adjacent channels. A channel is the circuit from the input
(IN) to the output (OUT) that results by closing the channel
relay.
In general, the test is performed by applying a voltage
(+100V) across two adjacent channels and then measuring
the leakage current across the channels. The isolation resistance is then calculated as R = V/I. In the following procedure, the Model 6517A functions as both a voltage source
and an ammeter. In the R function, the Model 6517A internally calculates the resistance from the known voltage and
current levels and displays the resistance value.
Model 1484
Low Thermal Cable
(Unterminated)
KEITHLEY 182 SENSITIVE DIGITAL VOLTMETER
TRG
SRQ
REM
TALK
LSTN
Each channel:
7037
IN
HI
LO
Model 182
OUT
Figure 6-3
Contact potential testing
6-5
Service Information
Model 7025
Unterminated
Triax Cable
Banana to
Banana Cable
Ground Link
Removed
Each Adjacent Channel Pair:
WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.
90-110V
105-125V
180-220V
210-250V
HI
(Red)
115V
!
7037
IN
!
CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.
Model 6517A
HI
Source V and
Measure V/I
OUT
IN
Unterminated
Banana Cables
OUT
Figure 6-4
Channel to channel testing
Refer to Figure 6-4 and perform the following steps to test
channel to channel isolation:
1. Turn off the Model 7001/7002 if it is on.
2. Connect the Model 6517A to channels 1 and 2 as shown
in Figure 6-4. Make sure the voltage source is off.
3. Install the Model 7037 in slot 1 (CARD 1) of the
Model 7001/7002 if it is not already installed.
WARNING
The following steps use hazardous voltage (100V). Be sure to remove power
from the circuit before making connection changes.
4. On the Model 6517A, select the ohms function and
choose the 2GΩ range.
5. On the Model 6517A, set the voltage source for +100V.
Make sure the voltage source is off.
6. Place the Model 6517A in the R measurement function.
7. Turn on the Model 7001/7002, and program it to close
channels 1!1 and 1!2 (channels 1 and 2).
6-6
8. On the Model 6517A, turn on the output of the voltage
source.
9. After allowing the reading on the Model 6517A to settle,
verify that it is >1GΩ. This measurement is the channel
to channel leakage resistance (isolation) between channels 1 and 2.
10. Turn off the Model 6517A voltage source.
11. Turn off the Model 7001/7002.
12. Disconnect the Model 6517A from channels 1 and 2,
and, in a similar manner, reconnect it to channels 2 and
3 (electrometer high to channel 2, and voltage source
high to channel 3).
13. Install the card in slot 1 (CARD 1) of the
Model 7001/7002 if it is not already installed.
14. Turn on the Model 7001/7002 and program it to close
channels 1!2 and 1!3.
15. On the Model 6517A, turn on the voltage source.
16. After allowing the reading on the Model 6517A to settle,
verify that it is >1GΩ. This is the isolation between
channels 2 and 3.
17. Using Table 6-2 as a guide, repeat the basic procedure of
steps 11 through 16 for the rest of the path pairs (starting
with test 3).
Service Information
Table 6-2
Channel to channel isolation tests
Test no.
Isolation test
Test equipment location
Channels closed
1
2
3
Channel 1 to Channel 2
Channel 2 to Channel 3
Channel 3 to Channel 4
Channels 1 and 2
Channels 2 and 3
Channels 3 and 4
1!1 and 1!2
1!2 and 1!3
1!3 and 1!4
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
Channel 4 to Channel 5
Channel 5 to Channel 6
Channel 6 to Channel 7
Channel 7 to Channel 8
Channel 8 to Channel 9
Channel 9 to Channel 10
Channel 10 to Channel 11
Channel 11 to Channel 12
Channel 12 to Channel 13
Channel 13 to Channel 14
Channel 14 to Channel 15
Channel 15 to Channel 16
Channel 16 to Channel 17
Channel 17 to Channel 18
Channel 18 to Channel 19
Channel 19 to Channel 20
Channel 20 to Channel 21
Channel 21 to Channel 22
Channel 22 to Channel 23
Channel 23 to Channel 24
Channel 24 to Channel 25
Channel 25 to Channel 26
Channel 26 to Channel 27
Channel 27 to Channel 28
Channel 28 to Channel 29
Channel 29 to Channel 30
Channels 4 and 5
Channels 5 and 6
Channels 6 and 7
Channels 7 and 8
Channels 8 and 9
Channels 9 and 10
Channels 10 and 11
Channels 11 and 12
Channels 12 and 13
Channels 13 and 14
Channels 14 and 15
Channels 15 and 16
Channels 16 and 17
Channels 17 and 18
Channels 18 and 19
Channels 19 and 20
Channels 20 and 21
Channels 21 and 22
Channels 22 and 23
Channels 23 and 24
Channels 24 and 25
Channels 25 and 26
Channels 26 and 27
Channels 27 and 28
Channels 28 and 29
Channels 29 and 30
1!4 and 1!5
1!5 and 1!6
1!6 and 1!7
1!7 and 1!8
1!8 and 1!9
1!9 and 1!10
1!10 and 1!11
1!11 and 1!12
1!12 and 1!13
1!13 and 1!14
1!14 and 1!15
1!15 and 1!16
1!16 and 1!17
1!17 and 1!18
1!18 and 1!19
1!19 and 1!20
1!20 and 1!21
1!21 and 1!22
1!22 and 1!23
1!23 and 1!24
1!24 and 1!25
1!25 and 1!26
1!26 and 1!27
1!27 and 1!28
1!28 and 1!29
1!29 and 1!30
6-7
Service Information
Ground Link
Removed
Model 7025
Unterminated
Triax Cable
Banana to
Banana Cable
Chassis ground
is accessible at
7001/7002
rear panel
WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.
90-110V
105-125V
180-220V
210-250V
Each channel:
7037
HI
115V
!
(Red)
IN
!
HI
CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.
Model 6517A
HI
Source V and
Measure V/I
Unterminated
Banana Cables
OUT
Figure 6-5
Common-mode isolation testing
Common-mode isolation tests
These tests check the common-mode isolation (leakage
resistance) between the input (IN) and chassis ground of
every channel.
In general, the test is performed by applying a voltage
(+100V) and then measuring the leakage current. The isolation resistance is then calculated as R = V/I. In the following
procedure, the Model 6517A functions as a voltage source
and an ammeter. In the R function, the Model 6517A internally calculates the resistance from the known voltage and
current levels and displays the resistance value.
Refer to Figure 6-5 and perform the following steps to test
common-mode isolation.
1. Turn off the Model 7001/7002 if it is on.
2. Connect the Model 6517A to channel 1 as shown in
Figure 6-5. Make sure the voltage source is off. Note
that the voltage source HI is connected to the input (IN).
Electrometer HI can be connected to chassis ground at
the rear panel of the Model 7001/7002.
3. Install the Model 7037 in slot 1 (CARD 1) of the
Model 7001/7002 if it is not already installed.
6-8
WARNING
The following steps use hazardous voltage (100V). Be sure to remove power
from the circuit before making connection changes.
4. On the Model 6517A, select the ohms function and
choose the 2GΩ range.
5. On the Model 6517A, set the voltage source for +100V.
Make sure the voltage source is still off.
6. Place the Model 6517A in the R measurement function.
7. Turn on the Model 7001/7002 and program the mainframe to close channel 1!1 (slot 1, channel 1).
8. On the Model 6517A, turn on the voltage source.
9. After allowing the reading on the Model 6517A to settle,
verify that it is >1GΩ. This measurement checks the
common-mode isolation of channel 1.
10. Turn off the Model 6517A voltage source.
11. Repeat the basic procedure in steps 1 through 10 to
check differential isolation of the other Model 7037
channels. Remember to close the relay of the channel
being checked.
12. Turn off the Model 6517A voltage source and the
Model 7001/7002.
Service Information
Channel functionality test
1. As shown in Figure 6-6, connect the suspect input or
output channel to an output or input channel that is
known to be functioning properly. The internal 5V
supply must be used.
2. From the front panel of the mainframe, turn on (close)
the output channel. Verify that the display indicates that
the output channel is on (closed). Keep in mind that the
output can be high (positive) or low (negative) when the
channel is turned on, depending on the logic
configuration
3. Place the mainframe in the “read input channels” display mode. Verify on the display that the input channel
is off (open).
4. On the mainframe, turn off (open) the output channel
and verify on the display that the input channel turns on
(closes).
5. On the mainframe, return the instrument to the normal
display mode and verify on the display that the output
channel is off (open).
Output Channel
Input Channel
OUT
IN
GND
GND
Special handling of static-sensitive
devices
CMOS and other high-impedance devices are subject to possible static discharge damage because of the high-impedance
levels involved. The following precautions pertain specifi
cally to static-sensitive devices. However, since many
devices in the Model 7037 are static-sensitive, it is recommended that they all be treated as static-sensitive.
1. Such devices should be transported and handled only in
containers specially designed to prevent or dissipate
static buildup. Typically, these devices will be received
in anti-static containers made of plastic or foam. Keep
these parts in their original containers until ready for
installation.
2. Remove the devices from their protective containers
only at a properly grounded work station. Also, ground
yourself with a suitable wrist strap while working with
these devices.
3. Handle the devices only by the body; do not touch the
pins or terminals.
4. Any printed circuit board into which the device is to be
inserted must first be grounded to the bench or table.
5. Use only anti-static type de-soldering tools and
grounded-tip soldering irons.
Internal connections:
Internal voltage source (+5V) selected.
Figure 6-6
Testing an input or output channel
6-9
Service Information
Principles of operation
Block diagram
The following paragraphs discuss the basic operating principles for the Model 7037 and can be used as an aid in troubleshooting the card. The schematic drawings of the card are
shown on drawing numbers 7037-106 and 7021-172 located
in Section 7.
Figure 6-7 shows a simplified block diagram of the
Model 7037. Key elements include the ROM, which contains
card ID and configuration information, relay drivers and
relays, digital I/O output channel drivers, and digital I/O
input channel registers. These various elements are discussed
in the following paragraphs.
OUTCLOCK
OUTDATA
To Mainframe
Relay
Drivers
STROBE
ENABLE
U106U109
Relay
Channels
1-30
User
connections
+3.5V (Steady State)
+5.7 (≈ 100 msec during
relay actuation)
OUTCLOCK
OUTDATA
To Mainframe
STROBE
ENABLE
INDATA
From
Mainframe
Output
Channel
Drivers
INCLOCK
U105
and
U106
Input
Channel
Registers
U101
and
U102
IDCLK
ROM
IDDATA
U110
Figure 6-7
Model 7037 block diagram
6-10
IN 1
IN 2
User
connections
Relay
Power
Control
Q100, Q101
U114, U115
STROBE
ENABLE
To/From
Mainframe
Output
Channels
31-40
IN 10
+6V, +15V
Service Information
ID data circuits
Upon power-up, card identification information from each
card is read by the mainframe. This ID data includes such
information as card ID, hardware settling time, and relay and
channel configuration information.
ID data is contained within an on-card EEPROM (U110). In
order to read this information, the sequence described below
is performed on power-up.
1. The IDDATA line (pin 5 of U110) is set from high to low
while the IDCLK line (pin 6 of U110) is held high. This
action initiates a start command to the ROM to transmit
data serially to the mainframe (Figure 6-8).
2. The mainframe sends the ROM address location to be
read over the IDDATA line. The ROM then transmits an
acknowledge signal back to the mainframe, and it then
transmits data at that location back to the mainframe
(Figure 6-9).
3. The mainframe then transmits an acknowledge signal,
indicating that it requires more data. The ROM will then
sequentially transmit data after each acknowledge signal it receives.
4. Once all data is received, the mainframe sends a stop
command, which is a low-to-high transition of the
IDDATA line with the IDCLK line held high
(Figure 6-8).
IDCLK
IDDATA
Start Bit
Stop Bit
Figure 6-8
Start and stop sequences
IDCLK
1
8
9
IDDATA
(Data output
from mainframe
or ROM)
IDDATA
(Data output
from mainframe
or ROM)
Start
Acknowledge
Figure 6-9
Transmit and acknowledge sequence
6-11
Service Information
Relay control
Digital I/O input channel control
Card relays are controlled by serial data transmitted via the
relay OUTDATA line. A total of fi e bytes for each card are
shifted in serial fashion into latches located in the card relay
driver ICs. The serial data is clocked in by the OUTCLOCK
line. As data overfl ws one register, it is fed out the Q’s line
of the register down the chain.
The mainframe reads digital input channels of the I/O card
from a serial, two-byte data stream (via INDATA line).
Once all fi e bytes have shifted into the card, the STROBE
line is set high to latch the relay information into the Q outputs of the relay drivers, and the appropriate relays are energized (assuming the driver outputs are enabled, as discussed
below). Note that a relay driver output goes low to energize
the corresponding relay.
Relay power control
Digital inputs are applied in a parallel fashion to the two
input channel registers (U102 contains eight channels and
U101 contains two channels). When the digital inputs are
read, the STROBE line goes high to latch the input channel
information. The INCLOCK line then clocks out the information as a serial, two-byte data stream (via INDATA line)
to the mainframe. As data empties from the lead register
(U102), it is replaced by data via the Q7 line of the registers
down the chain.
Power-on safeguard
NOTE
A relay power control circuit, made up of U114, U115,
Q100, Q101, and associated components, keeps power dissipated in relay coils at a minimum, thus reducing possible
problems caused by thermal EMFs.
The power-on safeguard circuit discussed
below is actually located on the digital
board in the mainframe.
During steady-state operation, the relay supply voltage, +V,
is regulated to +3.5V to minimize coil power dissipation.
When a relay is first closed, the STROBE pulse applied to
U114 changes the parameters of the relay supply voltage regulator, Q100, allowing the relay supply voltage, +V, to rise to
+5.7V for about 100msec. This brief voltage rise ensures that
relays close as quickly as possible. After the 100msec period
has elapsed, the relay supply voltage (+V) drops back down
to its nominal steady-state value of +3.5V.
A power-on safeguard circuit, made up of a D-type flip-fl
and associated components, ensures that relays and digital
I/O output channels do not randomly energize on power-up
and power-down. This circuit disables all relays and output
channels (all relays and output channels are open) during
power-up and power-down periods.
Digital I/O output channel control
Digital output channels are controlled by serial data transmitted from the mainframe to the card via the OUTDATA
line. A total of two bytes are shifted in a serial fashion into
latches located in the output channel driver ICs. The serial
data is clocked in by the OUTCLK line. As data overfl ws
one register, it is fed out the Q’s line of the register down the
chain.
Once all bytes have shifted into the card, the STROBE line
is set high to latch the output channel information into the Q
outputs of the output channel drivers. Note that a channel
driver output can go low or high when it is turned on (closed)
depending on its logic configuration
6-12
The PRESET line on the D-type flip-flo is controlled by the
68302 microprocessor, while the CLK line of the D-type
flip-flo is controlled by a VIA port line on the 68302 processor. The Q output of the flip-flo drives each switch card
relay/output channel driver IC enable pin (U105-U109,
pin 8).
When the 68302 microprocessor is in the reset mode, the
flip-flo PRESET line is held low, and Q out immediately
goes high, disabling all relays and output channels (driver IC
enable pins are high). After the reset condition elapses
(≈200msec), PRESET goes high while Q out stays high.
When the first valid STROBE pulse occurs, a low logic level
is clocked into the D-type flip-flop setting Q out low and
enabling all relay drivers and output channel drivers simultaneously. Note that Q out stays low, (enabling relay drivers
and output channels) until the 68302 processor goes into a
reset condition.
Service Information
Troubleshooting
Troubleshooting equipment
WARNING
Lethal voltages are present within the
Model 7001/7002 mainframe. Some of
the procedures may expose you to hazardous voltages. Observe standard
safety precautions for dealing with live
circuits. Failure to do so could result in
personal injury or death.
CAUTION
Observe the following precautions when
troubleshooting or repairing the card.
To avoid contamination, which could
degrade card performance, always handle the card only by the handle and side
edges. Do not touch edge connectors,
board surfaces, or components on the
card. Also, do not touch areas adjacent
to electrical contacts on connectors.
Use care when removing relays from the
PC board to avoid pulling traces away
from the circuit board. Before attempting to remove a relay, use an appropriate de-soldering tool, such as a solder
sucker, to clear each mounting hole
completely free of solder. Each relay pin
must be free to move in its mounting
hole before removal. Also, make certain
that no burrs are present on the ends of
the relay pins.
Table 6-3 summarizes recommended equipment for troubleshooting the Model 7037.
Table 6-3
Recommended troubleshooting equipment
Description
Manufacturer
and model
Application
Multimeter
Keithley 2000
Measure DC voltages
Oscilloscope
TEK 2243
View logic waveforms
Troubleshooting access
In order to gain access to the relay card top surface to measure voltages under actual operation conditions, perform the
following steps:
1.
2.
3.
4.
Disconnect the connector card from the relay card.
Remove the Model 7001/7002 cover.
Install the relay card in the CARD 1 slot location.
Turn on Model 7001/7002 power to measure voltages
(see following paragraph).
6-13
Service Information
Troubleshooting procedure
Table 6-4 summarizes relay-digital I/O card troubleshooting.
Table 6-4
Troubleshooting procedure
Step
Item/Component
Required Condition
Comments
1
GND pad
All voltages referenced to digital ground
(GND pad).
2
Q100, pin 2
+6VDC
Relay voltage.
3
U101, pin 16
+5VDC
Logic voltage.
4
R135
+15VDC
Relay bias voltage.
5
Q100, pin 3
+3.5VDC*
Regulated relay voltage.
6
U110, pin 6
IDCLK pulses
During power-up only.
7
U110, pin 5
IDDATA pulses
During power-up only.
8
U106, pin 7
STROBE pulse
End of relay update sequence.
9
U106, pin 2
CLK pulses
During relay update sequence only.
10
U106, pin 3
DATA pulses
During relay update sequence only.
11
U105-U109, pins 10-18
Low with relay energized; high
with relay de-energized.
Relay driver outputs.
*+3.5VDC present at +V pad under steady-state conditions. This voltage rises to +5.7VDC for about 100msec when relay configurat on is changed.
6-14
7
Replaceable Parts
Introduction
This section contains replacement parts information, schematic diagrams, and component layout drawings for the
Model 7037.
Parts lists
Parts lists for the various circuit boards are included in tables
integrated with schematic diagrams and component layout
drawings for the boards. Parts are listed alphabetically in
order of circuit designation.
Ordering information
To place an order, or to obtain information concerning
replacement parts, contact your Keithley representative or
the factory (see inside front cover for addresses). When
ordering parts, be sure to include the following information:
1.
2.
3.
4.
5.
Card model number 7037
Card serial number
Part description
Circuit description, if applicable
Keithley part number
Factory service
If the card is to be returned to Keithley Instruments for repair,
perform the following:
1. Complete the service form at the back of this manual
and include it with the card.
2. Carefully pack the card in the original packing carton or
the equivalent.
3. Write ATTENTION REPAIR DEPT on the shipping
label.
NOTE
It is not necessary to return the mainframe
with the card.
Component layouts and schematic
diagrams
Component layout drawings and schematic diagrams are
included on the following pages after the parts lists:
Table 7-1 — Parts List, Relay Card for 7037.
Table 7-2 — Parts List, Mass Terminated Connector Card
for 7037.
Table 7-3 — Parts List, Model 7011-KIT-R 96-pin Female
DIN Connector Kit.
7037-100 — Component Layout, Relay Card for 7037.
7037-106 — Schematic, Relay Card for 7037.
7021-170 — Component Layout, Mass Terminated Connector Card for 7037.
7021-176 — Schematic, Mass Terminated Connector Card
for 7037.
7-1
Replaceable Parts
Table 7-1
Relay card for Model 7037 parts list
Circuit
designation
C100112,114,115,
118,121,122,
125
C116,117,126
C119,127
C120
C123,124
CR100-119
J100,101
J1002,1003
K100-129
P2001
Q100
Q101
R100-130,132
R131
R133
R134,135
R136
R137
R138
S110
ST1
U100,103,104
U101,102
U105-109
U110
U111
U112
U113
U114
U115
VR100
7-2
Keithley
part no.
3-56X3/16PPH
2-56X5/16PPHSEM
FA-245-1
Description
2-56X3/16 PHILLIPS PAN HEAD SCREW (BOARD TO SHIELD)
2-56X5/16 PHILLIPS PAN HEAD SEMS SCREW (BOARD TO SHIELD)
2-56X5/8 PHILLIPS PAN HEAD FASTENER (FOR P2001 TO STANDOFF AND SHIELD)
4-40X3/16 PHILLIPS PAN HEAD SEMS SCREW (FOR Q100)
4-40 PEM NUT
CONNECTOR, JUMPER
EJECTOR ARM
IC, SERIAL EPROM, 24C01P
ROLL PIN (FOR EJECTOR ARMS)
SHIELD
STANDOFF, 2 CLEARANCE
CAP, 0.1µF, 20%, 50V, CERAMIC
4-40X3/16PPHSEM
FA-131
CS-476
7011-301B
IC-737
DP-6-1
7011-305C
ST-204-1
C-365-.1
CAP, 150PF, 10%, 1000V, CERAMIC
CAP, 1µF, 20%, 50V, CERAMIC
CAP, 0.001µF, 20%, 500V, CERAMIC
CAP, 10µF, -20+100%, 25V, ALUM ELEC
DIODE, SILICON, IN4148 (D0-35)
CONN, BERG
CONN, 48-PIN, 3-ROW
RELAY, ULTRA-SMALL POLARIZED TF2E-5V
CONN, 32-PIN, 2-ROW
TRANS, NPN PWR, TIP31 (T0-220AB)
TRANS, N CHAN MOSPOW FET, 2N7000 (T0-92)
RES, 10K, 5%, 1/4W, COMPOSITION OR FILM
RES, 1K, 5%, 1/4W, COMPOSITION OR FILM
RES, 220K, 5%, 1/4W, COMPOSITION OR FILM
RES, 560, 10%, 1/2W, COMPOSITION
RES, 2.49K, 1%, 1/8W, METAL FILM
RES, 1.15K, 1%, 1/8W, METAL FILM
RES, 1K, 1%, 1/8W, METAL FILM
SOCKET
STANDOFF, 4-40X0.812LG
IC, QUAD 2-INPUT EXCLUSIVE OR 74HCT86
IC, 8-BIT PARALLEL TO SERIAL, 74HCT165
IC, 8-BIT, SERIAL-IN LATCH DRIVER, 5841A
PROGRAM
IC, HEX INVERTER, 74HCT04
IC, QUAD 2 INPUT OR 74HCT32
IC, HIGH SPEED BUFFER, 74HC125
IC, RETRIG MONO MULTIVIB, 74HC123
IC, AJD SHUNT REGULATOR, TL431CLP
DIODE, ZENER, 5.1V, IN751 (D0-7)
C-64-150P
C-237-1
C-22-.001
C-314-10
RF-28
CS-339
CS-736-2
RL-149
CS-775-1
TG-253
TG-195
R-76-10K
R-76-1K
R-76-220K
R-1-560
R-88-2.49K
R-88-1.15K
R-88-1K
S0-72
ST-137-20
IC-707
IC-548
IC-536
7037-800A01
IC-444
IC-443
IC-451
IC-492
IC-677
DZ-59
Replaceable Parts
Table 7-2
Mass terminated connector card for Model 7037 parts list
Circuit
designation
C201-203
J201
J202,203
J1004
P1002,1003
R201-205,207210,212
U201-203
Keithley
part no.
2-56X3/16PPH
2-56X3/8PPH
2-56X7/16PPH
4-40X1/4PPHSEM
Description
2-56X3/16 PHILLIPS PAN HEAD SCREW (FOR SHIELD)
2-56X3/8 PHILLIPS PAN HEAD SCREW (FOR BRACKET)
2-56X7/16 PHILLIPS PAN HEAD SCREW
4-40X1/4 PHILLIPS PAN HEAD SEMS SCREW (CONNECTS RELAY
BOARD TO CONNECTOR BOARD)
BRACKET
CONN, JUMPER (FOR J201)
SHIELD
STANDOFF
CAP, 0.1µF, 20%, 50V, CERAMIC
CONN, BERG
CONNECTOR SHIM
CONN, 96-PIN, 3-ROW
CONNECTOR, 48-PIN, 3-ROW
RES, 10K, 5%, 1/4W, COMPOSITION OR FILM
7011-307
CS-476
7011-311A
ST-203-1
C-365-.1
CS-339
7011-309A
CS-514
CS-748-3
R-76-10K
IC, 4-CHANNEL PWR DRIVER, 2549B
IC-1044
Table 7-3
Model 7011-KIT-R 96-pin female DIN connector kit parts list
Description
96-PIN FEMALE DIN CONNECTOR
BUSHING, STRAIN RELIEF
CABLE ADAPTER, REAR EXIT (INCLUDES TWO CABLE
CLAMPS)
CONNECTOR HOUSING
Keithley
part no.
CS-787-1
BU-27
CC-64
CS-788
7-3
4
3
2
1
LTR.
ECA NO.
A
19587
REVISION
RELEASED
ENG.
DATE
SZ
2/11/97
ADDED NO POP NOTE FOR MODEL 7037,K201,K202
CR202,CR201,J204,J205,C204,R211,R206,R213,Q201
70 21 -1 70
NO.
A1
D
D
TOP SIDE COMPONENTS (SIDE -06)
C
C
J1004
* R206
*
*
Q201
R213
*
K202
*
K201
*
CR202
*
*
R211
*
R202
*
*
CR201
C204
R212
J205
J204
J202
J203
U201
U202
C202
C201
R208
C203
R207
R210
P1003
R204
R205
R209
R203
J201
P1002
R201
U203
B
B
NOTE:
FOR COMPONENT INFORMATION, SEE PRODUCT STRUCTURE.
*DO NOT POPULATE THESE PARTS FOR MODEL 7037;
R211,C204,K202,CR202,Q201,R213,R206,CR201,K201,J204,J205.
A
A
MODEL
NEXT ASSEMBLY
QTY.
USED ON
KEITHLEY
KEITHLEY INSTRUMENTS INC.
CLEVELAND, OHIO 44139
4
3
DIM ARE IN IN. UNLESS OTHERWISE NOTED
DATE
1/6/97
SCALE
DIM. TOL. UNLESS OTHERWISE SPECIFIED
DRN
CAB
APPR.
XX=+.01
XXX=+.005
DO NOT SCALE THIS DRAWING
2
ANG.=+1
FRAC.=+1/64
1:1
TITLE
C
COMPONENT LAYOUT,
CONNECTOR BOARD
NO.
7021-170
1
PG
1 OF 1
Index
A
D
I
AC frequency response 5-10
Digital I/O connections 4-2
Digital I/O input channel control 6-12
Digital I/O maximum signal
levels 5-1
Digital I/O output channel
control 6-12
Digital inputs 3-2
Digital outputs 3-1
ID data circuits 6-11
IEEE-488 bus operation 5-6
Input connection scheme 4-12
Inspection for damage 1-2
Instruction manual 1-3
B
Basic switch configuration
(SPST) 2-1
Block diagram 6-10
K
Keeping connectors clean 5-10
C
E
Card connections 6-2
Card installation 4-13
Card removal 4-13
Channel assignments 5-3
Channel functionality test 6-9
Channel resistance tests 6-3
Channel to channel isolation tests 6-5
Closing and opening channels 5-5
Common-mode isolation tests 6-8
Component layouts and schematic
diagrams 7-1
Configuring digital I/O input pull-up
resistance 4-4
Configuring digital I/O output
logic 4-4
Contact potential tests 6-5
Controlling devices using pull-up
resistors 3-2
Controlling pull-up devices 3-1
Environmental conditions 6-2
F
Factory service 7-1
Features 1-1
G
M
Magnetic fields 5-8
Mainframe control of the card 5-2
Manual addenda 1-2
Measurement considerations 5-8
Model 7037 installation and
removal 4-13
Multi-pin (mass termination)
connector card 4-5
Ground loops 5-9
O
H
Handling and cleaning
precautions 6-1
Handling precautions 1-2, 4-2
Offset current tests 6-4
Optional accessories 1-3
Ordering information 7-1
Output connection schemes 4-11
i-1
P
S
U
Parts lists 7-1
Path isolation 5-8
Performance verification 6-2
Power-on safeguard 6-12
Power limits 5-1
Principles of operation 6-10
Pull-up resistors 4-2
Safety symbols and terms 1-2
Scanning channels 5-5
Shipping contents 1-2
Special handling of static-sensitive
devices 6-9
Specifications 1-2
Unpacking and inspection 1-2
T
W
Troubleshooting 6-13
Troubleshooting access 6-13
Troubleshooting equipment 6-13
Troubleshooting procedure 6-14
Typical digital I/O connection
schemes 4-11
Typical relay switch connection
schemes 4-10
Warranty information 1-2
R
Radio frequency interference 5-9
Reactive loads 5-1
Reading input channels 5-6
Recommended equipment 6-2
Relay control 6-12
Relay power control 6-12
Relay switch maximum signal
levels 5-1
Repacking for shipment 1-3
i-2
V
Voltage source jumper 4-2
Service Form
Model No.
Serial No.
Date
Name and Telephone No.
Company
List all control settings, describe problem and check boxes that apply to problem.
❏
Intermittent
❏
Analog output follows display
❏
Particular range or function bad; specify
❏
❏
IEEE failure
Front panel operational
❏
❏
Obvious problem on power-up
All ranges or functions are bad
❏
❏
Batteries and fuses are OK
Checked all cables
Display or output (check one)
❏
❏
❏
Drifts
Unstable
Overload
❏
❏
Unable to zero
Will not read applied input
❏
❏
Calibration only
❏
Certificate of calibration require
Data required
(attach any additional sheets as necessary)
Show a block diagram of your measurement system including all instruments connected (whether power is turned on or not). Also, describe
signal source.
Where is the measurement being performed? (factory, controlled laboratory, out-of-doors, etc.)
What power line voltage is used?
Relative humidity?
Ambient temperature?
Other?
Any additional information. (If special modifications h ve been made by the user, please describe.)
Be sure to include your name and phone number on this service form.
°F
Keithley Instruments, Inc.
28775 Aurora Road
Cleveland, Ohio 44139
Printed in the U.S.A.
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