Computer-On-Modules Industrial Mainboards
Intelligent Solutions
Computer-On-Modules
Industrial Mainboards
Edition | 2016
Technology Partners
Content
MSC is a premier partner of Intel® and AMD,
and as a result has early access to design data
MSC Technologies
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3
Solution Concepts
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4
Internet of Things
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5
for all new microprocessor generations. Based
on latest silicon technology, MSC is developing
cutting-edge solutions for COM Express, Qseven, SMARC 2.0 and ETX module products which
we produce in our own factories. Under our
lifecycle management we have full control of
COM-Module
our embedded products’ long life support.
Selector
|6
Next to x86 technologies, our Qseven, SMARC
COM Express™
|
Qseven™
|19
SMARC™ 2.0
|
nanoRISC®
|28
8
2.0 and nanoRISC modules also utilize ARM
®
products from NXP™ and Texas Instruments.
Our partnership with BIOS/UEFI vendor AMI
has augmented our in-house software engi-
26
neering capabilities and competencies in the
BIOS/UEFI development including customization of the source code which is a key incentive
for choosing our products.
Design and
Production
|31
We are cooperating with the leading industrial
single-board manufacturers of the world and
BIOS and
have selected their highest quality, long-term
Secure Boot
|
33
available boards to offer to our customers as
part of our embedded products' portfolio.
Industrial
Mainboards
|34
Accessories &
Services
2 | www.msc-technologies.eu
|59
MSC Technologies at a Glance
The Embedded Boards Solutions unit within
But the computing board is only the beginning:
MSC Technologies is specializing in the design
MSC is offering a wide choice of TFT displays,
and production of highly integrated standard
touch solutions, DRAM and Flash memory
board-level products as well as customer-spe-
modules and cards as well as wireless interface
cific board solutions. The standard embedded
solutions. This way MSC represents a one-stop
COM products (Computer-On-Module) are
shopping partner offering our customers the
available in a variety of variants and versions,
full solution to their electronic requirements.
but also can be easily customized to satisfy the
requirements of volume OEM customers.
Vertical Market Solutions
MSC’s components and board-level products
To complement our range of COM products,
and custom developments are used in Indus-
MSC is offering single-board computers (SBC)
trial and Building Automation, Medical, POS/
from some of the world’s leading computer
POI and Signage, Transportation/Logistics,
board manufacturers. Before becoming part
Energy, Automotive and Mobile Devices as well
of our board-level offering, these boards had
as in Gaming applications.
to pass a meticulous selection process for their
design and production quality, high level of
support and long-term availability.
Synergy at Work
MSC is entering our customers‘ development
cycles where they want us to. We can provide
just a COM module so that the target system can
start with a proven, functional computing building
block, or we can custom-design a complete subsystem based on the customer‘s requirements.
3
Solution
Concepts
MSC Technologies – The Solution Company
carrier boards or even perform a customization in the de-
In the Embedded Boards Unit of MSC Technologies, we
sign thereby adapting the standard board to better suit the
can provide a wide choice of solutions for the electron-
target application. For some cases a full-custom develop-
ic needs of our customers. We will help our customers
ment of a COM carrier board may be required, and again
to find the solution to their requirements quickly, help
MSC will consider such a design if certain production vol-
them to bring it to their market first, and provide world-
ume criteria are met or exceeded.
class support during and after the development phase.
MSC has been in the electronic development industry for
SBC – Industrial Single-Board-Computer
many decades, and has several design groups of experi-
Clearly COM is the more flexible and elegant approach, but
enced engineers doing hardware and software (BIOS, Firm-
there are many applications where the solution has to be a
ware, Drivers) design. We are working at the forefront
single board, and therefore MSC is providing a wide selec-
of technology and have a stack of proven modular build-
tion of high-quality embedded SBCs in the most popular
ing blocks for any new design at hand which will reduce
formats, as well as the accessories to put them at work most
development time and risk.
efficiently. From ATX format to Pico-ITX, we can provide a
suitable solution offering the right computing performance,
COM – Computer-On-Module
power consumption and cost to suit the applications‘ re-
Our COM products are based on open standards and mod-
quirements.
ular designs, and effectively simplify any system design
and integration. COM products enable the system designer
SMARC™ 2.0
to focus on the end products. As a founding Member of
The recent revision 2.0 of the SMARC module standard
the SGeT.org consortium, MSC is actively driving new stan-
(Smart Mobility ARChitecture) has every ingredient to become
dards enabling further advances in COM technologies. MSC
the best and most future-proof standard for small form-
is committed to open specifications such as Qseven™ and is
factor embedded modules. With 314 pins available on its in-
an executive member of the PCI Industrial Computer Man-
expensive and robust MXM-3 connector, SMARC has ample
ufacturer Group (PICMG), an organization promoting open
space for proven and popular interfaces. In the new stan-
industry standards like COM Express™. COM products are
dard revision, PCIe now features 4 lanes instead of 3, USB
designed for reliability, 24/7 operation, quality, longevity
now covers up to 2x USB 3.0 and up to 6x USB 2.0 inter-
and for industrial OEM applications.
faces, LVDS now supports two independent dual-channel
connections which alternatively can be used for embedded
Standard, Customized
DisplayPort (eDP) or for DSI, two Gigabit Ethernet ports are
and Full-Custom Baseboard
now supported, Audio has independent HDA and I2S ports
Along with our families of Computer-On-Module products,
and up to 4 UARTs are available. In addition to SPI, also
we are offering a number of carefully designed Evalua-
eSPI is supported for attachment of peripheral devices on
tion Boards and Application Boards which are meant to be
the baseboard or the application hardware. And still there
used for laboratory tests as well as standard carrier boards
are a lot of reserved pins left for future upgrades. Never
for applications in which the design of a specialized car-
again has it been so easy and natural to use ARM-based and
rier board is not foreseen. From a certain minimum pro-
x86-based computer modules on a modern and up-to-date
duction volume, MSC is offering to custom-populate these
module standard.
4 | www.msc-technologies.eu
Internet of Things
Industry 4.0
the same giving the system designer the option
A Subset of the Internet of Things
to upgrade/downgrade the system in order to
As the world becomes networked and things
achieve different price/performance points.
become intelligent, the production processes in
the industrial environment will gain vastly from
Local Intelligence
the growth of information sharing and active
The Internet of Things would be impossible
control cut-through. The Intelligent Factory, as
without intelligent “things“, and that means
depicted in the above drawing, is merely a part of
computing devices inside the network nodes
the intelligent world and seamlessly blends into
which are sensors, actors, information collec-
the networked world of the Internet of Things.
tors or decision makers in control of larger machines. Depending on the task to perform, a
Scalability
large and powerful computer will be required
Only Computer-On-Module solutions come
or a small system consuming little power and
with built-in scalability of performance, power
generating little heat.
and cost. COM boards will be plugged on a carrier board which adapts the I/O of the COM to
With our COM products used for either alterna-
the local environment. This board can remain
tive, a wide choice of computing power classes
the same even if the computer module gets
exists which can reach up to high-performance
swapped to a similar one with more/less com-
multi-core engines and down to very small,
puting performance and likewise more/less pow-
power-nibbling microcomputer boards. Similar-
er consumption and related cost. In most cases,
ly, Single-Board Computers are available giving
even the software of the system can remain
a wide choice of power and performance.
5
COM-Module Selector
Product Name
CPU Range
CPU Cores
max. Memory
Extension Bus Support
C68-SLH
Intel® Core™ i3, i5, i7, Intel® Celeron® (6th generation),
1.6 – 3.7GHz
2/4
32 GB DDR4
SO-DIMM
PCI Express™
C6B-8SB
Intel® Core™ i7 (5th generation),
2.6 – 3.4GHz
4
16 GB DDR3L
SO-DIMM
PCI Express™
C6B-8S
Intel® Core™ i3, i5, i7, Intel® Celeron®
(4th generation), 1.5 – 3.4GHz
2/4
16 GB DDR3L
SO-DIMM
PCI Express™
CXB-8S
Intel® Core™ i3, i5, i7, Intel® Celeron®
(4th generation), 1.5 – 3.4GHz
2/4
16 GB DDR3L
SO-DIMM
PCI Express™, PCI
C6B-7S
Intel® Core™ i3, i5, i7, Intel® Celeron®
(3rd generation), 1.0 – 2.7GHz
1/2/4
16 GB DDR3
SO-DIMM
PCI Express™
CXB-6SI
Intel® Core™ i3, i5, i7
(3rd generation), 1.6 – 2.7GHz
2/4
16 GB DDR3
SO-DIMM
PCI Express™, PCI
C6C-SLU
Intel® Core™ i3, i5, i7, Intel® Celeron®
(6th generation), 2.0 – 3.4GHz
2
32 GB DDR4
SO-DIMM
PCI Express™
C6C-BW
Intel® Pentium® N3700, Celeron® N3xxx
2.08 - 2.4GHz
2/4
8 GB DDR3L
SO-DIMM
PCI Express™
C6C-BT
Intel® Atom™ E38xx, Celeron® N2920, J1900
1.33 - 2.42GHz.
1/2/4
8 GB DDR3L
SO-DIMM
PCI Express™
CXC-BT
Intel® Atom™ E38xx, Celeron® N2920, J1900
1.33 - 2.42GHz
1/2/4
8 GB DDR3L
SO-DIMM
PCI Express™, PCI
C6C-GX
AMD G-Series SOC
1.0 - 2.0GHz
2/4
16 GB DDR3
SO-DIMM
PCI Express™
C6C-A7
AMD R-Series
(R-460L, R-452L, R-260H, R252L), 2.3 - 2.8GHz
2/4
16 GB DDR3
SO-DIMM
PCI Express™
C10M-BT
Intel® Atom™ E38xx, Celeron® N2920, J1900
1.33 - 2.42GHz
1/2/4
8 GB DDR3L soldered
(ECC opt.)
PCI Express™
C10M-BTC
Intel® Atom™ E38xx, Celeron® N2920, J1900
1.33 - 2.42GHz
1/2/4
8 GB DDR3L soldered
(ECC opt.)
PCI Express™
Intel® Pentium® N3710, Celeron® N3xxx; 2.08 - 2.4GHz
2/4
8 GB DDR3L soldered
PCI Express™
1/2/4
4 GB DDR3L soldered
(ECC opt.)
PCI Express™
Q7-BT
Intel® Atom™ E38xx SOC
E3845 1.91GHz, E3827 1.75GHz, E3826 1.46GHz,
E3825 1.33GHz, E3815 1.46GHz
1/2/4
4 GB DDR3L soldered
PCI Express™
Q7-IMX6PLUS
NXP™ i.MX6 ARM Cortex®-A9 SOC
i.M 6QuadPlus, i.MX6Quad 0.8/1.2GHz,
i.M 6DualPlus, i.MX6Dual 0.8/1.2GHz,
i.MX6DualLite, i.MX6Solo 0.8/1.0GHz
1/2/4
4 GB DDR3 soldered
PCI Express™
Q7-IMX6
NXP™ i.MX6 ARM Cortex®-A9 SOC
i.M6Quad 0.8/1.2GHz,
i.M6Dual 0.8/1.2GHz,
i.MX6Solo 0.8/1.0GHz
Q7-TCTC-FD
Intel® Atom™ E6x0
0.6 - 1.6GHz
1
2 GB DDR2 soldered
PCI Express™
NXP™ i.MX6 ARM Cortex®-A9 SOC
i.M 6QuadPlus, i.MX6Quad 0.8/1.2GHz,
i.M 6DualPlus, i.MX6Dual 0.8/1.2GHz,
i.MX6DualLite, i.MX6Solo 0.8/1.0GHz
1/2/4
4 GB DDR3L soldered
PCI Express™
1/2/4
4 GB DDR3 soldered
PCI Express™, Processor Bus
nanoRISC-IMX6
NXP™ i.MX6 ARM Cortex®-A9 SOC
i.M 6QuadPlus, i.MX6Quad 0.8/1.2GHz,
i.M 6DualPlus, i.MX6Dual 0.8/1.2GHz,
i.MX6DualLite, i.MX6Solo 0.8/1.0GHz
TI® ARM Cortex®-A8 AM335x
AM3352 300MHz, AM3354 800MHz,
AM3359 800MHz
1
512 MB DDR2 soldered
Processor Bus
nanoRISC-AM335X
COM Express™ Family
Qseven™ Family
Q7-BW
SMARC™ 2.0 Family
SM2S-IMX6
nanoRISC® Family
6 | www.msc-technologies.eu
Specials
OS Support
Module Size
(mm)
Typ. Power
Dissipation (W)
Performance
Module Standard
Page
TPM 1.2, 4K resolution
supported
Windows® 7, 8, 10, Linux
95 x 125
35/55
High
COM Express™ Type 6
9
TPM 1.2, 4K resolution
supported
Windows® 7, 8, 10, Linux
95 x 125
55
High
COM Express™ Type 6
9
TPM 1.2, 4K resolution
supported
Windows® 7, 8, 10, Linux
95 x 125
35/55
High
COM Express™ Type 6
10
TPM 1.2, 4K resolution
supported
Windows® 7, 8, 10, Linux
95 x 125
35/55
High
COM Express™ Type 2
10
TPM 1.2
Windows® 7, 8, 10, XP, Linux
95 x 125
25/65
High
COM Express™ Type 6
11
TPM 1.2
Windows® 7, 8, XP, Linux
95 x 125
25/65
High
COM Express™ Type 2
11
TPM 1.2
Windows® 7, 8, 10, Linux
95 x 95
17/19
High
COM Express™ Type 6
12
TPM 1.2, MicroSD socket,
Windows® 7, 8, 10, Linux
95 x 95
7/9
Medium
COM Express™ Type 6
12
TPM 1.2 MicroSD socket
Windows® 7, 8, 10, Linux
95 x 95
8/14
Medium
COM Express™ Type 6
13
TPM 1.2, MicroSD socket
Windows® 7, 8, 10, Linux
95 x 95
8/14
Medium
COM Express™ Type 2
13
TPM 1.2, MicroSD socket
Windows® 7, 8, 10, Linux
95 x 95
12/30
Medium
COM Express™ Type 6
14
TPM 1.2, MicroSD socket
Windows® 7, 8, XP, Linux
95 x 95
25/35
High
COM Express™ Type 6
14
TPM 1.2, eMMC, ext. temp.
Windows® 7, 8, 10, Linux
55 x 84
8/14
Medium
COM Express™ Type 10
15
TPM 1.2, eMMC, USB 2.0
Client, ext. temp.
Windows® 7, 8, 10, Linux
55 x 84
8/14
Medium
COM Express™ Type 10
15
TPM 1.2 (opt.)
SATA Flash
eMMC Flash
Windows® 7, 8, 10, Linux,
Windows® EC7/2013
70 x 70
6/9
Medium
Qseven 2.0
20
TPM 1.2 (opt.)
SATA Flash
eMMC Flash
Windows® 7, 8, 10, Linux,
Windows® EC7/2013
70 x 70
6/12
Medium
Qseven 2.0
20
TPM 1.2 (opt.), eMMC Flash
or NAND Flash, µSD Slot, ext.
temp.
Linux, Windows® EC7/2013
70 x 70
4/7
Medium
Qseven 2.0
21
TPM 1.2 (opt.), eMMC
Flash, ext. temp.
Linux, Windows® EC7/2013
70 x 70
4/7
Medium
Qseven 1.2 / 2.0
22
TPM 1.2, CAN, SATA, Flash,
Ext. temp.
Windows® 7, XP, Linux
70 x 70
7
Entry / Medium
Qseven 1.2
21
TPM 1.2 (opt.), eMMC Flash,
µSD Slot, ext. temp.
Linux, Windows® EC7/2013
82 x 52
4/7
Medium
SMARC 2.0
27
eMMC Flash or NAND Flash,
µSD Slot, ext. temp.
Linux, Windows® EC7/2013
50 x 70
4/7
Medium
nanoRISC
29
NAND Flash
CAN, µSD Slot, ext. temp.
Linux
50 x 70
2.5
Entry
nanoRISC
29
7
COM Express™
COM Express™ was defined by the PICMG® (PCI
adopted and the support for USB 3.0, PCI Ex-
Industrial Computer Manufacturers Group) as an
press™ Gen 2 and additional digital display inter-
open specification without hidden hooks. Hence,
faces has been included. Most of these changes
this standard is supported by a large number
require new pin-outs, like Type 6 and Type 10.
of suppliers offering interchangeability of their
COM Express™ products. The latest revisions in-
MSC has introduced products based on these
troduced various changes in the COM Express
new pin-outs while still offering new technolo-
standard. New module formats have been
gies on Type 2 products as well.
8 | www.msc-technologies.eu
COM Express™
MSC C6B-SLH
Intel® Core™ - 6th Generation
NEW
Type 6
95 x 125
35/55 W
The MSC C6B-SLH module is based on Intel‘s 6th generation Core processor family with a new processor architecture based on 14 nm process technology. The Intel® two-chip solution allows highest
performance in graphics and computing on a COM Express module in basic form factor.
Highlights
• Intel® Core™ i7-6820EQ (quad-core, 2.8/3.5GHz)
• Intel® HD Graphics 530, P530
• Intel® Core™ i7-6822EQ (quad-core, 2.0/2.8GHz)
• Intel® chipsets QM170, HM170 or CM236
• Intel® Core™ i5-6440EQ (quad-core, 2.7/3.4GHz)
• Up to 32GB DDR4 SDRAM, dual ch. (ECC opt.)
• Intel Core™ i5-6442EQ (quad-core, 1.9/2.7GHz)
• Three DisplayPort/HDMI/DVI interfaces
• Intel Core™ i3-6100E (dual-core, 2.7GHz)
• LVDS (24 Bit, dual channel) or eDP interface
• Intel Core™ i3-6102E (dual-core, 1.9GHz)
• Triple independent display support (4K)
• Intel Celeron G3900E (dual-core, 2.4GHz)
• DirectX 12, OpenGL 4.4, OpenCL 2.x
• Intel Celeron G3902E (dual-core, 1.6GHz)
• Four SATA 6Gb/s; Trusted Platform Module
®
®
®
®
®
®
®
• Intel Xeon E3-1505Mv5 (quad-core, 2.8/3.7GHz) • Eight PCI Express™ x1 lanes; PEG x16
®
®
• Intel® Xeon® E3-1505Lv5 (quad-core, 2.0/2.8GHz) • Four USB 3.0/2.0 and four USB 2.0 interfaces
MSC C6B-8SB
Intel® Core™ - 5th Generation
NEW
Type 6
95 x 125
This module is based on Intel's 5th generation Core™ processors produced in 14nm technology. It
55 W
supports triple independent displays, DirectX 11.1, fast low-power DDR3L-1600 memory and USB
3.0 on a COM Express Type 6 module.
Highlights
• Intel® Core™ i7-5850EQ (quad-core, 2.7/3.4GHz)
• LVDS (24 Bit, dual channel) and CRT interface
• Intel Core™ i7-5700EQ (quad-core, 2.6/3.4GHz)
• Triple independent display support
• Intel HD Graphics GT2 or GT3e
• DirectX 11.1, OpenGL 3.2, OpenCL 1.2
• Intel 8-Series chipset
• Resolution up to 4096 x 2304
• Up to 16GB DDR3L-1600 SDRAM, dual channel
• Seven PCI Express™ x1 lanes
• Four SATA mass storage interfaces, up to 6Gb/s
• Four USB 3.0/2.0 and four USB 2.0 interfaces
• Three DisplayPort/HDMI/DVI interfaces
• Trusted Platform Module
®
®
®
• Two Embedded DisplayPort interfaces
9
COM Express™
MSC C6B-8S
Intel® Core™ - 4th Generation
Type 6
95 x 125
35 / 55 W
Based on Intel's 4th generation Core™ processors this Type 6 COM Express module supports
the latest digital display interfaces like DisplayPort, HDMI and DVI and controls up to three
independent displays. USB 3.0 interfaces connect to the fastest peripheral devices available.
Highlights
• Intel® Core™ i7-4700EQ (quad-core, 2.4/3.4GHz)
• Four SATA mass storage interfaces, up to 6Gb/s
• Intel Core™ i5-4400E (dual-core, 2.7/3.3GHz)
• Three DisplayPort/HDMI/DVI interfaces
• Intel Core™ i5-4402E (dual-core, 1.6/2.7GHz)
• Two Embedded DisplayPort interfaces
• Intel Core™ i3-4100E (dual-core, 2.4GHz)
• LVDS (24 Bit, dual channel) and CRT interface
• Intel Core™ i3-4102E (dual-core, 1.6GHz)
• Triple independent display support
• Intel Celeron 2000E (dual-core, 2.2GHz)
• DirectX 11.1, OpenGL 3.2, OpenCL 1.2
• Intel Celeron 2002E (dual-core, 1.5GHz)
• Resolution up to 3800 x 2400
• Intel HD Graphics GT1/GT2
• Seven PCI Express™ x1 lanes
• Intel 8-Series chipset
• Four USB 3.0 and four USB 2.0 interfaces
• Up to 16GB DDR3L-1600 SDRAM, dual-channel
• Trusted Platform Module
®
®
®
®
®
®
®
®
®
®
MSC CXB-8S
Intel® Core™ - 4th Generation
Type 2
95 x 125
35 / 55 W
Also based on Intel's 4th generation Core™ processors this COM Express module with Type 2
pin-out has been designed as an upgrade product for exisiting system designs still using legacy
interfaces like PCI bus and PATA.
Highlights
• Intel® Core™ i7-4700EQ (quad-core, 2.4/3.4GHz)
• Up to four SATA 6Gb/s mass storage interfaces
• Intel Core™ i5-4400E (dual-core, 2.7/3.3GHz)
• One PATA/IDE mass storage interface
• Intel Core™ i5-4402E (dual-core, 1.6/2.7GHz)
• LVDS (24 Bit, dual-channel) and CRT interface
• Intel Core™ i3-4100E (dual-core, 2.4GHz)
• Triple independent display support (option)
• Intel Core™ i3-4102E (dual-core, 1.6GHz)
• DirectX 11.1, OpenGL 3.2, OpenCL 1.2
• Intel Celeron 2000E (dual-core, 2.2GHz)
• Resolution up to 3800 x 2400
• Intel Celeron 2002E (dual-core, 1.5GHz)
• PCI Bus, six PCI Express x1 lanes
• Intel HD Graphics GT1/GT2
• Eight USB 2.0 interfaces
• Intel 8-Series chipset
• Trusted Platform Module
®
®
®
®
®
®
®
®
®
®
• Up to 16GB DDR3L-1600 SDRAM, dual-channel
10 | www.msc-technologies.eu
COM Express™
MSC C6B-7S
Intel® Core™ - 3rd Generation
Type 6
95 x 125
25 / 65 W
Based on Intel’s 3rd generation Core™ processors this Type 6 COM Express module supports
the latest digital display interfaces, up to three independent displays and USB 3.0. Ultra-low
power variants with only 17W CPU power dissipation allow passively cooled system designs.
Highlights
• Intel® Core™ i7-3612QE (quad-core, 2.1GHz)
• Up to 16GB DDR3-1600 SDRAM, dual channel
• Intel Core™ i7-3615QE (quad-core, 2.3GHz)
• Three DisplayPort/HDMI/DVI interfaces
• Intel Core™ i7-3555LE (quad-core, 2.5GHz)
• Two Embedded DisplayPort interfaces
• Intel Core™ i7-3517UE (dual-core, 1.7GHz)
• LVDS (24 Bit, dual channel) and CRT interface
• Intel Core™ i5-3610ME (dual-core, 2.7GHz)
• Triple independent display support
• Intel Core™ i3-3120ME (dual-core, 2.4GHz)
• DirectX 11, OpenGL 3.1, OpenCL 1.1
• Intel Core™ i3-3217UE (dual-core, 1.6GHz)
• Resolution up to 2560 x 1600
• Intel Celeron 1020E (dual-core, 2.2GHz)
• Seven PCI Express x1 lanes, four SATA-300
• Intel Celeron 1047UE (dual-core, 1.4GHz)
• Four USB 3.0 and four USB 2.0 interfaces
• Intel Celeron 927UE (single-core, 1.5GHz)
• Trusted Platform Module
®
®
®
®
®
®
®
®
®
®
®
®
MSC CXB-6SI
Intel® Core™ - 3rd Generation
Type 2
95 x 125
25 / 65 W
This COM Express module family with Type 2 pin-out is based on Intel’s 3rd generation Core™
processors and has been designed as an upgrade product for exisiting system designs still
using legacy interfaces like PCI bus and PATA. Ultra-low power variants with only 17W CPU
power dissipation allow passively cooled system designs.
Highlights
• Intel® Core™ i7-3612QE (quad-core, 2.1GHz)
• Up to 16GB DDR3-1600 SDRAM, dual channel
• Intel Core™ i7-3615QE (quad-core, 2.3GHz)
• Four SATA-300, one PATA mass storage interfaces
• Intel Core™ i7-3555LE (quad-core, 2.5GHz)
• LVDS (24 Bit, dual channel) and CRT interface
• Intel Core™ i7-3517UE (dual-core, 1.7GHz)
• Triple independent display support
• Intel Core™ i5-3610ME (dual-core, 2.7GHz)
• DirectX 11, OpenGL 3.1, OpenCL 1.1
• Intel Core™ i3-3120ME (dual-core, 2.4GHz)
• Resolution up to 2560 x 1600
• Intel Core™ i3-3217UE (dual-core, 1.6GHz)
• PCI Bus, five PCI Express x1 lanes
• Intel Celeron 1020E (dual-core, 2.2GHz)
• Eight USB 2.0 interfaces
• Intel Celeron 1047UE (dual-core, 1.4GHz)
• Trusted Platform Module
®
®
®
®
®
®
®
®
®
®
• Intel Celeron 927UE (single-core, 1.5GHz)
®
®
11
COM Express™
MSC C6C-SLU
Intel® Core™ - 6th Generation
NEW
Type 6
95 x 95
17 / 19 W
The MSC C6C-SLU module is based on Intel‘s 6th generation Core processor family with a new processor architecture based on 14 nm process technology. The multi-chip-package includes processor,
graphics and chipset on one carrier and allows extremely compact high-performance designs.
Highlights
• Intel® Core™ i7-6600U
(dual-core, 2.6/3.4GHz,15W)
• Intel Core™ i5-6300U
®
(dual-core, 2.4/3.0GHz, 15W)
• Intel Core™ i3-6100U (dual-core, 2.3GHz, 15W)
®
• MicroSD card socket
• DisplayPort/HDMI/DVI interface
• LVDS/embedded DisplayPort interface
• Three independent displays supported
• DirectX 11/12, OpenGL 4.3/4.4, OpenCL 2.x
• Intel Celeron 3955U (dual-core, 2.0GHz, 15W) • Resolution up to 4096 x 2304
®
®
• Integrated Intel® Gen. 9 HD graphics
• Four USB 3.0/2.0 and four USB 2.0 interfaces
• Up to 32 GB DDR4 SDRAM, dual-channel
• Eight PCI Express™ x1 lanes
• Three SATA 6Gb/s mass storage interfaces
• Trusted Platform Module
MSC C6C-BW
Intel® Pentium® / Celeron®
NEW
Type 6
95 x 95
8 / 14 W
The MSC C6C-BW module is based on Intel‘s next generation Atom processors in14nm technology . These multi-core systems-on-chip provide outstanding computing and graphics power and
are more power efficient compared to their predecessors. The new module brings triple independent display support, DirectX 11.1, fast DDR3L memory and USB 3.0 on a compact, power
saving and cost-efficient module. Dual- and quad-core processors are supported by this design.
Highlights
• Intel® Pentium® N3700 quad-core 2.40GHz, 6W TDP • DisplayPort/HDMI/DVI interface
• Intel® Celeron® N3150 quad-core 2.08GHz, 6W TDP • LVDS/embedded DisplayPort interface
• Intel® Celeron® N3050 dual -core 2.16GHz, 6W TDP • Three independent displays supported
• Intel® Celeron® N3000 dual -core 2.08GHz, 4W TDP • DirectX 11.1, OpenGL 4.2, OpenCL 1.2
• Integrated Intel® Gen. 8 HD graphics
• Four USB 3.0 and four USB 2.0 interfaces
• Up to 8GB DDR3L SDRAM, dual-channel
• Up to five PCI Express™ x1 lanes
• Two SATA 6Gb/s mass storage interfaces
• Trusted Platform Module (option)
• MicroSD card socket
12 | www.msc-technologies.eu
COM Express™
MSC C6C-BT
Intel® Atom™ / Celeron® SOC
Type 6
95 x 95
8 / 14 W
Based on Intel‘s multi-core system-on-chip (SOC) Atom generation this COM Express Type 6
module brings display interfaces like DisplayPort, HDMI 1.4a and DVI, supports dual independent
displays, USB 3.0 and fast DDR3L memory on a compact, power saving and cost-efficient module.
-40 +85 °C
Highlights
• Intel® Atom™ E3845 quad-core 1.91GHz, 10W TDP
• Up to 8GB DDR3L SDRAM, dual-channel
• Intel Atom™ E3827 dual-core 1.75GHz, 8W TDP
• Two SATA 3Gb/s mass storage interfaces
• Intel Atom™ E3826 dual -core 1.46GHz, 7W TDP
• MicroSD card socket
• Intel Atom™ E3825 dual -core 1.33GHz, 6W TDP
• DisplayPort/HDMI/DVI interface
• Intel Atom™ E3815 single-core 1.46GHz, 5W TDP
• LVDS/Embedded DisplayPort interface
• Intel Celeron N2920
• VGA interface
®
®
®
®
®
®
quad-core 1.86/2.00GHz, 7.5W TDP
• Intel Celeron J1900
®
®
quad-core 2.00/2.42GHz, 10W TDP
• Integrated Intel Gen. 7 HD graphics
®
• Two independent displays supported
• DirectX 11.1, OpenGL 3.2, OpenCL 1.1
• One USB 3.0 and up to seven USB 2.0 interface
• Trusted Platform Module (option)
MSC CXC-BT
Intel® Atom™ / Celeron® SOC
Type 2
95 x 95
8 / 14 W
Also based on Intel’s multi-core system-on-chip (SOC) Atom generation this compact COM
Express module with Type 2 pin-out has been designed as an upgrade product for exisiting
system designs still using legacy interfaces like PCI bus and PATA.
-40 +85 °C
Highlights
• Intel® Atom™ E3845 quad-core 1.91GHz, 10W TDP
• Up to 8GB DDR3L SDRAM, dual-channel
• Intel Atom™ E3827 dual-core 1.75GHz, 8W TDP
• One (two) SATA 3Gb/s mass storage interface
• Intel Atom™ E3826 dual -core 1.46GHz, 7W TDP
• One (zero) PATA/IDE mass storage interface
• Intel Atom™ E3825 dual -core 1.33GHz, 6W TDP
• MicroSD card socket
• Intel Atom™ E3815 single-core 1.46GHz, 5W TDP
• LVDS 24bit, dual-channel
• Intel Celeron N2930
• VGA interface
®
®
®
®
®
®
quad-core 1.83/2.16GHz, 7.5W TDP
• Intel Celeron J1900
®
®
quad-core 2.00/2.42GHz, 10W TDP
• Integrated Intel Gen. 7 HD graphics
®
• Two independent displays supported
• DirectX 11.1, OpenGL 3.2, OpenCL 1.1
• Eight USB 2.0 interfaces
• Trusted Platform Module (option)
13
COM Express™
MSC C6C-GX
AMD Embedded G-Series SOC
Type 6
Segments: Embedded and Server
This compact COM Express
Type 6 module is based on AMD‘s Embedded G-Series SOC platform,
Opteron
95 x 95
Embedded
a high-performance, low-power System-on-Chip solution with outstanding HD graphics and
12 / 30 W
-40
+85 °C
Embedded Solutions
53120B
multimedia capabilities. The power saving and cost-efficient module offers dual independent
Embedded Solutions
“R” Series X
53057B
• AMD GX-420CA quad-core 2.0GHz, 25W TDP,
Embedded Solutions
“G” Series X
53058B
Embedded Solutions
“G” SeriesB
ded Solutions
n Graphics
Embedded Solutions
Geode
Radeon HD 8400E
(For future use)
Radeon HD 8330E
Embedded Solutions
Radeon Graphics
53121B
• MicroSD card socket
• DisplayPort/HDMI/DVI interface
• AMD GX-217GA dual-core 1.65GHz, 15W TDP,
Embedded Solutions
Opteron X
53116B
• Up to 16GB DDR3 SDRAM, dual-channel
• Two SATA 3Gb/s mass storage interfaces
• AMD GX-415GA quad-core 1.5GHz, 15W TDP,
Embedded Solutions
Opteron A
(For future use)
Radeon
HD 8280E
• LVDS/Embedded DisplayPort interface
• VGA interface
• AMD GX-210HA dual-core 1.0GHz, 9W TDP,
Radeon HD 8310E
• Two independent displays supported
• DirectX 11.1, OpenGL 4.2, OpenCL 1.2
• Integrated AMD HD 8000E graphics
• Two USB 3.0 and six USB 2.0 interfaces
AMD PRODUCT BADGE GUIDELINES
PAGE 12
MSC C6C-A7
AMD Embedded R-Series
Type 6
95 x 95
Based on AMD‘s Embedded R-Series platform this compact COM Express Type 6 module offers
25 / 35 W
unprecedented integrated graphics and multi-display capabilities. It brings quad independent
display support, DirectX 11 and USB 3.0. Turbo overclocking and accelerated video encoding /
decoding support graphics- and video-centric applications.
bedded
dded Solutions
ies X
B
(showcase specific Opteron X86
technology platform)
Highlights
gments: Embedded and Server
dded Solutions
B
Embedded Solutions
Family fast DDR3
Opteron X memory and
Opteron AUSB 3.0.
display
support, DirectXOpteron
11.1,
“R” Series A
53117B
53118B
53119B
Opteron
Highlights
• AMD R-460L quad-core 2.0/2.8GHz, 25W TDP,
Embedded Solutions
“R” Series X
53057B
Embedded Solutions
“R” Series A
Opteron Family
53117B
Radeon HD 7620G
Opteron X
53118B
(showcase specific Opteron X86
technology platform)
Opteron A
53119B
(For future use)
• AMD R-252F dual-core 1.7/2.3GHz, 17W TDP ,
Radeon HD 7400G
Embedded Solutions
“G” SeriesB
Embedded Solutions
Geode
• AMD R-452L quad-core 1.6/2.4GHz, 19W TDP,
Radeon HD 7600G
• AMD R-260H dual-core 2.1/2.6GHz, 17W TDP,
Radeon HD 7500G
Embedded Solutions
Opteron X
53116B
Embedded Solutions
Opteron A
(For future use)
• Four SATA-300 mass storage interfaces
• MicroSD card socket, bootable
• Three DisplayPort/HDMI/DVI interfaces
• LVDS/Embedded DisplayPort interface
• VGA interface
• Four independent displays supported
• DirectX 11, OpenGL 4.2, OpenCL 1.1
• Resolution up to 4000 x 2000 @ 30 Hz
• Integrated AMD HD 7000G graphics
• Six PCI Express x1 lanes
• Up to 16GB DDR3-1333 SDRAM, dual-channel
• Four USB 3.0 and four USB 2.0 interfaces
14 | www.msc-technologies.eu
COM Express™
MSC C10M-BT
Intel® Atom™ / Celeron® SOC
NEW
Type 10
55 x 84
8 /14 W
-40... +85 °C
Based on Intel‘s multi-core system-on-chip (SOC) Atom generation this COM Express Type 10 module
brings dual independent display support, DirectX 11.1 and fast DDR3L memory on a very compact,
power saving and cost-efficient COM Express Mini module. The rugged design with soldered memory, optional ECC support and extended temperature range opens new application areas.
Highlights
• Intel® Atom™ E3845 quad-core 1.91GHz, 10W TDP
• Up to 8GB DDR3L SDRAM
• Intel Atom™ E3827 dual-core 1.75GHz, 8W TDP
• Two SATA 3Gb/s mass storage interfaces
• Intel Atom™ E3826 dual-core 1.46GHz, 7W TDP
• eMMC SSD (optional)
• Intel Atom™ E3825 dual-core 1.33GHz, 6W TDP
• DisplayPort/HDMI/DVI interface
• Intel Atom™ E3815 single-core 1.46GHz, 5W TDP
• LVDS/Embedded DisplayPort interface
• Intel Celeron N2930 quad-core
• Two independent displays supported
®
®
®
®
®
®
1.83/2.16GHz, 7.5W TDP
• Intel Celeron J1900 quad-core
®
®
2.00/2.42GHz, 10W TDP
• Integrated Intel Gen. 7 HD graphics
®
MSC C10M-BTC
Intel® Atom™ / Celeron® SOC
• DirectX 11.1, OpenGL 3.2, OpenCL 1.1
• One USB 3.0 and up to seven USB 2.0 interfaces
• Trusted Platform Module (option)
• Extended temperature variants
NEW
Type 10
55 x 84
8/14 W
-40... +85 °C
This COM Express Type 10 module is based on Intel's Atom SOC, like the C10M-BT. The outstanding new feature of the MSC C10M-BTC is a USB 2.0 client interface. It also offers dual independent display support, DirectX 11.1 and fast DDR3L memory on a very compact, power saving and
cost-efficient COM Express Mini module.
Highlights
• Intel® Atom™ E3845 quad-core 1.91GHz, 10W TDP
• Up to 8GB DDR3L SDRAM
• Intel Atom™ E3827 dual-core 1.75GHz, 8W TDP
• Two SATA 3Gb/sinterfaces; eMMC (optional)
• Intel Atom™ E3826 dual-core 1.46GHz, 7W TDP
• DisplayPort/HDMI/DVI interface
• Intel Atom™ E3825 dual-core 1.33GHz, 6W TDP
• LVDS/Embedded DisplayPort interface
• Intel Atom™ E3815 single-core 1.46GHz, 5W TDP
• Two independent displays supported
• Intel Celeron N2930 quad-core
• DirectX 11.1, OpenGL 3.2, OpenCL 1.1
®
®
®
®
®
®
1.83/2.16GHz, 7.5W TDP
• Intel Celeron J1900 quad-core
®
®
2.00/2.42GHz, 10W TDP
• Integrated Intel Gen. 7 HD graphics
®
• One USB 3.0/2.0 and four USB 2.0 interfaces
• One USB 2.0 client interface
• Trusted Platform Module (option)
• Extended temperature variants
15
COM Express™
MSC C6-MB-EV
Evaluation Motherboard
NEW
Type 6
170 x 170
This evaluation board in the popular Mini-ITX format provides the interface infrastructure for
COM Express Type 6 modules and offers various PC type connectors for external access.
Highlights
• Socket for COM Express™ Type 6 modules
• GbE interface
• PCI Express x16 slot (useable as PEG or x4)
• SD Card slot
• PCI Express Mini Card slot
• HD audio codec
• Four SATA connectors
• Super I/O
• Four USB 3.0 interfaces
• Various additional COM Express™ specific interfaces
• Up to four USB 2.0 ports
• Power supply via ATX-style power connector or
• Three DisplayPort connectors
• LVDS and eDP connectors
12V-only power jack
• Wide power input range
MSC C6-MB-EVA
Evaluation Motherboard
Type 6
305 x 244
This versatile carrier board was designed for evaluation, prototyping and software development.
It provides the interface infrastructure for COM Express Type 6 modules and offers various PC
type connectors for external access.
Highlights
• Socket for COM Express Type 6 modules in
Basic or Compact form factor
• LVDS interface
• Embedded DisplayPort connector
• One PCI Express x4 slot
• HD audio codec; six audio jacks and SPDIF
• Four PCI Express x1 slots
• LAN interface
• One PCI Express x16 PEG slot
• mSATA and Mini PCI Express sockets
• Four SATA connectors
• Various additional COM Express specific interfaces
• Four USB 3.0, four USB 2.0 interfaces
• ATX-style power connector
• Two DisplayPort/HDMI connectors
• POST code LED display
• VGA/DVI connector
• ATX form factor
16 | www.msc-technologies.eu
COM Express™
MSC C10-MB-EV
Evaluation Motherboard
NEW
Type 10
170 x 170
This evaluation board in the popular Mini-ITX format provides the interface infrastructure for
COM Express Type 10 modules and offers various PC type connectors for external access.
Highlights
• Socket for COM Express™ Type 10 modules
• GbE interface
• PCI Express x4 slot
• SD Card slot
• PCI Express Mini Card slot
• HD audio codec
• Two SATA connectors
• Super I/O
• Two USB 3.0 interfaces
• Various additional COM Express™ specific interfaces
• Up to six USB 2.0 ports
• Power supply via ATX-style power connector or
• DisplayPort connectors
• LVDS and eDP connectors
12V-only power jack
• Wide power input range
MSC C6-SK
Starterkits for COM Express
Type 6
The COM Express Starterkit for Type 6 modules is available for the whole range of Type 6
modules. The kit contains all necessary products to quickly enable the user to run and evaluate
COM Express Type 6 modules. The kit does not include a COM Express module in order to give the
user greater flexibility as to which particular module variant and CPU core and speed is desired.
Highlights
• COM Express™ Type 6 baseboard
• Up to three DisplayPort connectors
• 2x 4GB DDR3L SO-DIMM memory modules
• LVDS and eDP connectors
• Heatsink for safe operation of module
• GbE Interface, SD Card slot
• Type 6 module socket
• HD audio codec, Super I/O
• PCI Express Mini Card slot
• Baseboard size 170 x 170 mm
• Up to four SATA connectors
• Getting Started Manual
• Up to four USB 3.0 interfaces
• Download link for drivers and BSPs
• Up to four USB 2.0 ports
• Optional display kits with cables
17
COM Express™
MSC C10-SK
Starterkits for COM Express
Type 10
The COM Express Starterkit for Type 10 modules is available for the whole range of Type 10 modules. The kit contains all necessary products to quickly enable the user to run and evaluate COM
Express Type 10 modules. The kit does not include a COM Express module in order to give the
user greater flexibility as to which particular module variant and CPU core and speed is desired.
Highlights
• COM Express Type 10 Baseboard
in Mini-ITX format
• Suitable Heatspreader for COM Express
Mini Modules Type 10
• 12V Power Supply with suitable connector
for COM Express baseboard
• Getting Started Manual with download links
for drivers and BSP
• PCI-Express x4 Slot
• PCI-Express Mini Card Socket and SD Card Socket
• 2x SATA Gen. 3.0 Connectors
• 2x USB 3.0 and 8x USB 2.0 Connectors
• DisplayPort Connector
• Embedded DisplayPort Connector
• LVDS Single-Channel JILI30 Connector
• Audio Codec with 1x3 Jacks and SPDIF In/Out
• Gigabit LAN Connector
• Baseboard Size 170 x 170 mm
COM Express™
Cooling Solutions
Depending on the computing performance,
MSC has developed various solutions that help
processor technology and system environ-
the system designer to quickly solve the heat
ment, COM Express modules require different
dissipation problems and ensure optimal envi-
cooling measures.
ronmental conditions for the module.
Heatspreaders
Passive cooling
Active cooling
Standardized thermal interfaces for easy
Optimized heatsinks for best cooling
Heatsinks combined with a dedicated
integration in customers' cooling con-
performance even in industrial envi-
speed controlled fan. Off-the-shelf solu-
cepts and full interchangeability.
ronments.
tions for demanding ambient conditions.
18 | www.msc-technologies.eu
Qseven™
The latest embedded Computer-On-Module
The Qseven™ specification has been extended to
standard for entry level performance and low
include module architectures based on the ARM
power applications with a very attractive price
processor which is renowned for its excellent
performance ratio. Qseven is an open standard
performance to power ratio. Providing differ-
of the SGeT Standardization Group. Taking ad-
ent processor architectures and a wide range
vantage of the ongoing development in proces-
of modules for commercial and extended tem-
sor technology towards smaller and more power
perature together with matching baseboards,
efficient CPUs, Qseven has in recent years be-
the MSC Qseven family leads the way to feature
come the most widely adopted new standard for
rich and small, low power modular systems.
small form factor modules.
19
Qseven™
MSC Q7-BW
Intel® Atom™ N3000 SOC Rev. 2.0
70 x 70
6/9 W
NEW
The MSC Q7-BW module is based on Intel‘s next generation Atom processors in 14nm technology. These multi-core systems-on-chip provide outstanding computing and graphics power and
are more power efficient compared to their predecessors. The new module brings triple independent display support, DirectX 11.1, fast DDR3L memory and USB 3.0 on a compact, power
saving and cost-efficient module. Dual- and quad-core processors are supported by this design.
Highlights
• Intel® Pentium® N3710 quad-core 2.56GHz, 6W TDP
• HDMI/DVI interface up to 3840x2160
• Intel Celeron N3160 quad-core 2.24GHz, 6W TDP
• DisplayPort 1.1a up to 3840x2160
• Intel Celeron N3060 dual-core 2.48GHz, 6W TDP
• Dual-Channel LVDS 24 or 18 bit up to 3840x2160
• Intel Celeron N3010 dual-core 2.24GHz, 4W TDP
• DirectX 11.1, OpenGL 4.2, OpenCL 1.2
• Integrated Intel Gen. 8 HD Graphics
• Triple Independent Display support
• Up to 8GB DDR3L SDRAM (dual-channel)
• 3x PCIe x1, GbE, SATA-II, UART, LPC, SPI, I2C, SMBus
• Up to 64GB SATA Flash Disk (optional)
• USB 3.0, opt. USB 3.0 Device
• Up to 64GB eMMC Flash (optional)
• Up to 7x USB 2.0, opt. USB 2.0 Device
®
®
®
®
®
®
®
MSC Q7-BT
Intel® Atom™ E3800 SOC Rev. 2.0
70 x 70
7/12 W
-40 +85 °C
The MSC Q7-BT module is based on the Qseven Rev. 2.0 standard and uses Intel‘s multi-core
System-On-Chip (SOC) Atom E3800 generation based on Intel’s 22nm processor technology.
The quad-core, dual-core or single-core Atom processor provides outstanding computing and
graphics power and is accompanied by a comprehensive set of peripherals.
Highlights
• Intel® Atom™ E3845 quad-core 1.91GHz, 10W TDP
• Integrated Intel® Gen. 7 HD Graphics
• Intel® Atom™ E3827 dual-core 1.75GHz, 8W TDP
• HDMI up to 1920x1200
• Intel Atom™ E3826 dual -core 1.46GHz, 7W TDP
• DisplayPort 1.1a up to 2560x1600
• Intel Atom™ E3825 dual -core 1.33GHz, 6W TDP
• Dual-Channel LVDS 24 or 18 bit up to 1920x1200
• Intel Atom™ E3815 single-core 1.46GHz, 5W TDP
• 3x PCI Express x1 Gen. 2.0 ports, GbE LAN
• Up to 8GB DDR3L SDRAM (opt. ECC)
• USB 3.0 Host, optional USB 3.0 Device
• Up to 64GB SATA Flash Disk (optional)
• Up to 6x USB 2.0 Host, optional USB 2.0 Device
• Up to 32GB eMMC Flash (optional)
• UART, LPC, I2S Audio, SPI, I2C, SMBus, SDIO, TPM
®
®
®
• 2x SATA interfaces (1 used for opt. Flash Disk)
20 | www.msc-technologies.eu
Qseven™
MSC Q7-IMX6PLUS
NXP™ i.MX6 ARM Rev. 2.0
70 x 70
4/6 W
-40 +85 °C
NEW
The MSC Q7-IMX6PLUS module provides the NXP™ i.MX6 ARM Cortex-A9 CPU (quad, dual, dual-lite or single core) as well as the new i.MX 6QuadPlus and 6DualPlus Processors with up to
1.2 GHz, up to 4GB DDR3 DRAM and up to 64GB eMMC Flash memory as well as an extensive
set of interface controllers.
Highlights
• NXP™ i.MX6 ARM® Cortex™-A9
quad-, dual-, dual-lite or single-core CPU
• HDMI/DVI up to 1920 x 1200 @30Hz
• Dual-Channel LVDS 18/24 bit up to 1920 x 1200
• Supports i.MX 6QuadPlus, i.MX 6DualPlus
• Triple independent display support
• “Triple-Play“ Graphics and Video Subsystem
• SATA-II (3Gbps, quad-/dual-core only)
• Up to 4GB DDR3L SDRAM
• USB Host / Device+ up to 4x USB 2.0
• Up to 64GB eMMC or 4GB NAND Flash
• MMC / SD / SDIO Interface
• Gigabit Ethernet
• CAN Interface, I2S Audio
• PCI Express x1 port
• MIPI CSI-2 Camera Interface
MSC Q7-IMX6
NXP™ i.MX6 ARM
70 x 70
4/6 W
-40 +85 °C
The MSC Q7-IMX6 module is based on NXP™’s i.MX6 CPU offering quad-core, dual-core and
single-core ARM® Cortex™-A9 performance at very low power consumption. The MSC Q7-IMX6
CPU Module incorporates the NXP™ quad-core, dual-core or single-core processor with up to
1.2 GHz, up to 4GB DDR3 DRAM and up to 32GB eMMC Flash memory as well as an extensive
set of interface controllers.
Highlights
• NXP™ i.MX6 ARM® Cortex™-A9
quad-, dual-, dual-lite or single-core CPU
• HDMI/DVI up to 1920 x 1200 @30Hz
• Dual-Channel LVDS 18/24 bit up to 1920 x 1200
• “Triple-Play” Graphics and Video Subsystem
• Triple independent display support
• Up to 4 GB DDR3 SDRAM
• SATA-II (3Gbps, quad-/dual-core only)
• Up to 32 GB eMMC Flash
• Up to 8 USB2.0 ports, I2S Audio
• Gigabit Ethernet
• OS support: Linux, Windows EC7/2013
• PCI Express x1 port
(Android on request)
21
Qseven™
MSC Q7-TCTC-FD
Intel® Atom™ E6xx
70 x 70
7W
The MSC Q7-TCTC-FD module is based on the Intel‘s E6x0 Atom™ CPU and the EG20T Platform
Controller Hub. The module provides up to 2GB DDR2 DRAM and optionally up to 8GB on-board
SATA Flash Disk.
-40 +85 °C
Highlights
• Intel® Atom™ E6x0 (up to 1.6GHz) with
integrated Graphics EG20T PCH
• Dual independent display support
• Three PCI Express x1 lanes
• Up to 2GB DDR2 SDRAM, soldered
• Up to two SATA-300 mass storage interfaces
• Optional 4 / 8 GB on board Flash SSD, bootable
• Six USB 2.0 hosts, one USB2.0 client
• Gigabit Ethernet interface
• CAN Bus, mini SDIO socket
• LVDS (18 / 24 Bit) up to 1280 x 768 @ 60Hz
• Industrial temperature versions available
• SDVO up to 1920 x 1080
• OS support: Windows 7, XP, Linux
MSC Q7-MB-RP2
Reference Platform Qseven 1.2
305 x 173
The Qseven Rev. 1.2 Reference Platform MSC Q7-MB-RP2 offers a large variety of interfaces
commonly used in industrial applications such as Gigabit LAN, USB 2.0, 1x RS232, CAN and
LVDS/ADD2 for display attachment. In addition PCI Express is supported with four PCIe x1 slots.
This platform for rapid prototyping helps to evaluate and test Qseven modules.
Highlights
• Four PCI Express x1 slots
• COM1 / COM2, LPT, fan control and HW monitor
• One ADD2 slot for SDVO / DP / HDMI
• CAN transceiver
• Mini PCI Express, ExpressCard socket
• HD audio codec, AC97 connector
• MMC / SD Card socket
• Up to eight USB interfaces
• Two SATA onboard connectors
• LVDS display via Jili30
• Two Super I / O (Winbond/SMSC)
22 | www.msc-technologies.eu
Qseven™
MSC Q7-MB-EP6
Embedded Platform Qseven Rev. 2.0
148 x 102
The Qseven™ Rev. 2.0 Embedded Platform MSC Q7-MB-EP6 offers a variety of embedded
interfaces such as dual Gigabit LAN, USB 3.0, USB 2.0, RS232/485 and CAN as well as HDMI,
DisplayPort and LVDS display interfaces. In addition a mini PCI Express™, an mSATA and an SD
Card socket are supported. Module slot on bottom side.
Highlights
• HDMI and DisplayPort connectors for direct
output of TMDS signals from Qseven module
• USB 3.0 host connector
• 2x USB 2.0 host connector
• Dual Gigabit Ethernet
• 1x USB 2.0 on pin header
• Mini PCI Express card slot
• 1x microUSB 2.0 OTG connector
• MMC/SD card and mSATA card sockets
• LVDS / eDP via Jili30 connector
• 1x SATA connector
• Backlight interface 3.3 / 5 / 12VDC
• RS-232 on DB9 connector
• SPI / I2C / SMBus, CAN bus, I2S audio
• RS-485 and RS-232 on pin header
• Wide input range from 10 - 28VDC
• LPC / GPIO on pin header
MSC Q7-MB-EP4
Embedded Platform DDI
148 x 102
The Qseven™ Rev. 1.2 Embedded Platform MSC Q7-MB-EP4 offers many interfaces often used
in embedded applications such as dual Gigabit LAN, USB 2.0, RS232, CAN and LVDS as well as
DVI/HDMI. In addition a mini PCI Express™ and an mSATA slot as well as an SD-Card socket are
supported. Module slot on bottom side.
Highlights
• One DVI port up to 1920 x 1080 for Qseven
modules with SDVO
• One CAN interface
• Six USB 2.0 interfaces, four external
• Dual Gigabit Ethernet
• Touch screen controller on board
• Mini PCI Express slot
• LVDS display connection via Jili30
• MMC/SD Card socket
• Backlight interface 3.3 / 5 / 12VDC
• Two SATA onboard connectors
• Size 148 x 102 mm
• One RS-232 onboard pin header
• Wide input range from 10 - 28VDC
23
Qseven™
Qseven™
Cooling Solutions
For all its Qseven modules, MSC is offering tai-
MSC is providing a heatspreader for each Qseven
lored cooling solutions which perfectly fit the
module, and a single-piece heatsink for the high-
geometry of the COM product.
er-performance modules.
Heatspreaders
Heatsinks
A heatspreader offers a blank surface allowing to
A heatsink is shaped like the heatspreader,
mount a cooling device or to contact the metal
but shows cooling fins on the upper side so
housing of a system, while the underside provides
as to maximize the surface used to dissipate
contact areas for the heat generating parts of the
heat into the surrounding air.
module’s geometry.
MSC Q7-MB-EP-02 BOX
Qseven Enclosure for Q7-MB-EP2/4
175 x 117
The enclosure MSC Q7-MB-EP-02 BOS-001 was designed for use with the Qseven platform boards
MSC Q7-MB-EP2/4. The enclosure provides suitable cut-outs for the baseboards’ connectors plus
two optional cut-outs for D-Sub9 connectors for serial lines available on the baseboards.
Highlights
• Compact dimensions:
175 x 117 x 60 mm (L x W x H)
• Front plate with cut-outs for EP2/4
interface connectors:
• Material 1.5 mm sheet metal, RAL7032
- DVI, 4x USB, 2x Ethernet
• Optional DIN Rail Adaptor
- 2x optional D-Sub9 for serial lines or CAN
• Cooling slots on two sides improve air flow
inside the housing
24 | www.msc-technologies.eu
Qseven™
MSC Q7-SK-BT-EP6
Qseven 2.0 Starterkit
The Qseven Starterkit for Qseven 2.0 modules with the Intel® Atom™ E3800 or N3000 is based
on the 3.5” Qseven carrier board MSC Q7-MB-EP6 and contains all necessary products to quickly
enable the user to run and evaluate Qseven modules built to the Rev. 2.0 specification. The kit
does not contain a Qseven module in order to give the user greater flexibility as to which particular module version and CPU core and speed variant is desired.
Highlights
• 3.5” Qseven carrier board with socket for
Qseven Rev. 2.0 modules MSC Q7-BT
or Q7-BW (not included)
• Heatsink suitable for all module
variants of the Q7-BT and Q7-BW families
• 12V power supply and cable kit included for
immediate operation of the Starter Kit
• HDMI and DisplayPort graphics output
• LVDS graphics output on standard 30-pin connector;
backlight connector includes dimming output
• 2x Ethernet (10/100/1000 LAN) connectors
• SATA, USB 3.0, 3x USB 2.0, USB 2.0 OTG, 3x UARTs
• Mini PCI Express and mSATA Card slots
• SD Card socket
• Resource CD with drivers, manuals etc.
MSC Q7-SK
Qseven 1.2 Starterkits
The Qseven Starterkits for Qseven 1.2 modules are available in versions for the NXP™ i.MX6,
AMD Embedded G-Series and the Intel® Atom™ E6x0. The kits are based on the 3.5” Qseven
carrier boards MSC Q7-MB-EPx and contain all necessary products to quickly enable the user to
run and evaluate Qseven modules. The kits do not contain a Qseven module allowing the user
to select the most suitable one from MSC’s wide offerings.
Highlights
• 3.5” Qseven carrier board with socket for
Qseven Rev. 1.2 modules (not included)
• LVDS graphics output on standard 30-pin connector;
backlight connector includes dimming output
• Heatsink suitable for the chosen module family
• 2x Gigabit Ethernet connectors
• 12V power supply and cable kit included for
• SATA, 4x USB 2.0, USB 2.0 OTG
immediate operation of the Starter Kit
• HD audio or I2S audio
• Resource CD with drivers, manuals etc.
• Mini-PCI-Express and mSATA Card slots
• HDMI/DisplayPort or DVI graphics output
• SD Card socket
25
SMARC™ 2.0
The recent revision 2.0 of the SMARC module
which alternatively can be used for embedded
standard (Smart Mobility ARChitecture) has ev-
DisplayPort (eDP) or for DSI, two Gigabit Ethernet
ery ingredient to become the best and most
ports are now supported, Audio has independent
future-proof standard for small form-factor em-
HDA and I2S ports and up to 4 UARTs are avail-
bedded modules. With 314 pins available on its
able. In addition to SPI, also eSPI is supported for
inexpensive and robust MXM3 connector, SMARC
attachment of peripheral devices on the base-
has ample space for proven and popular interfac-
board or the application hardware. And still there
es. In the new standard revision, PCIe now features
are a lot of reserved pins left for future upgrades.
4 lanes instead of 3, USB now covers up to 2x USB
Never again has it been so easy and natural to use
3.0 and up to 6x USB 2.0 interfaces, LVDS now sup-
ARM-based and x86-based computer modules on
ports two independent dual-channel connections
a modern and up-to-date module standard.
26 | www.msc-technologies.eu
SMARC™ 2.0
MSC SM2S-IMX6
SMARC™ 2.0
82 x 50
4/6 W
-40... +85 °C
NEW
The MSC SM2S-IMX6 module is fully compliant with the new SMARC™ 2.0 standard and is
based on NXP's i.MX6 CPUs offering quad-, dual- and single-core ARM Cortex-A9 compute
performance at very low power consumption and excellent graphics performance combined
with a high dregree of functional integration.
Highlights
• NXP i.MX6 ARM® Cortex™-A9 quad-, dual-,
dual-lite or single-core CPU
• 1x SATA-II (3Gbps, quad-/dual-core only)
• MPEG-4 Video En-/Decoding 1080p,
• 1x USB Device/Host + up to 5x USB 2.0 Host
• HDMI graphics 1920x1080x30fps,
• 1x MMC / SD / SDIO interface
• dual-channel LVDS 1920x1080x30fps
• 2x CAN interface
• Up to 4GB DDR3L DRAM
• I2S Audio interface
• Up to 64GB eMMC Flash memory
• MIPI CSI-2 camera interface
SMARC™ 2.0
2W
-40...+85 °C
• 1x PCI Express x1
• Supports i.MX 6QuadPlus, i.MX 6DualPlus
MSC SM2-MB-EP1
170 x 170
• 10/100/1000 GbE LAN interface
NEW
The SMARC™ 2.0 Embedded Platform MSC SM2-MB-EP1 offers many embedded interfaces such
as dual Gigabit LAN, USB 3.0, USB 2.0, SATA, UART/RS232 and CAN as well as DVI/HDMI, embedded DisplayPort and LVDS display interfaces. In addition a PCI Express™ socket and an SD Card
socket are supported.
Highlights
• Socket for SMARC™ 2.0 modules
• SATA connector
• PCI Express x4 slot
• Two GbE interfaces
• SD Card slot
• Two CAN interfaces
• Mini-PCI-Express Card slot
• I2S audio and HD audio codec
• Two USB 3.0 interfaces
• Two UART interfaces
• USB 2.0 OTG, three USB 2.0 Host
• Various additional SMARC™ specific interfaces
• DVI/HDMI and DisplayPort connectors
• Power supply via ATX-style power connector
• LVDS and eDP connectors
• Power jack for 12-24V input voltage
27
nanoRISC®
®
The nanoRISC module standard has been created
nanoRISC modules can be used as a processing
for applications requiring a small form factor and
“supercomponent”, while users only need to add
lowest power consumption.
application-specific periphery. The 230-pin MXM
connector used as interface to the baseboard is
The nanoRISC modules simplify the design of
inexpensive but robust and proven. A variety of
embedded systems by providing a processor
easy-to-use interfaces are available. All popular
core with an extensive set of interfaces on a
embedded interfaces are included, and addi-
small form factor board. Boot loader and adap-
tional interfaces can be provided by adding
tations for popular Operating Systems will be
suitable controllers on the baseboard and con-
provided by MSC so that design times will be
necting them to the processor bus available on
shortened dramatically.
the MXM connector.
28 | www.msc-technologies.eu
nanoRISC®
MSC NANORISC-IMX6
NXP™ i.MX6 ARM MPU
70 x 50
2.5 /4.5 W
-40 +85 °C
NEW
The MSC NANORISC-IMX6 module is based on the NXP™ Cortex™-A9 processor i.MX6x which is
available as quad-core, dual-core and single-core CPU. On the module it is combined with up to
4GB DDR3 SDRAM, up to 4GB SLC NAND Flash, optionally up to 64GB eMMC Flash and Gigabit
Ethernet LAN.
Highlights
• NXP™ i.MX6 Cortex™-A9, 1/2/4 core(s) CPU
clocked up to 1.2GHz
• Graphics Interfaces: HDMI/DVI, LVDS, RGB up to
1920 x 1080, dual independent display support
• Up to 4GByte DDR3 SDRAM soldered
• Video decoder and scaler
• Up to 4GByte SLC NAND Flash soldered
• CAN 2.0B, 3x UART, 2x SPI, 2x I²C
• Up to 64Gbyte eMMC Flash
• I²S audio interface
• Gigabit Ethernet interface
• SD V3.0 / SDIO V2.0 / MMC V4.3
• USB 2.0 Host
• Parallel bus interface
• USB 2.0 OTG Host/Client High Speed
• Camera interface ITU656 / CSI
MSC NANORISC- AM335X
Texas Instruments® AM335X
70 x 50
2.0 W
-40 +85 °C
The MSC NANORISC-AM335X module is based on the Texas Instruments® Cortex™-A8 processor
AM335x family which ranges from 300 to 800MHz. On the module it is combined with up to
512MB DDR3 SDRAM, up to 512MB SLC NAND Flash, optionally up to 64GB eMMC Flash and
10/100 Ethernet LAN, optionally second LAN or GbE LAN.
Highlights
• Texas Instruments Cortex™-A8 CPU AM335x
clocked up to 800MHz
• CAN 2.0B, 3x UART, 2x SPI, 2x I²C
• I²S audio interface
• Up to 512MB DDR3 SDRAM soldered
• SD V2.0 / SDIO V1.0 / MMC V4.2
• Up to 512MB SLC NAND Flash soldered
• Optional SGX530 graphics acceleration
• Up to 64GB eMMC Flash soldered
• Optional industrial (Realtime) Ethernet
• 10/100 Base-T Ethernet Interface
• Commercial and extended commercial
• Optional 2nd 10/100 LAN or GbE
• USB 2.0 HS Host, USB 2.0 HS OTG
• RGB 16/18/24 bit up to 1366 x 768
temperature range
• Support for Linux
(Android, Windows EC7 on demand)
29
nanoRISC®
MSC NANORISC-MB2
Embedded Platform
160 x 110
-40 +85 °C
The Evaluation Platform MSC NANORISC MB2 offers dual LAN, USB, UARTs, audio and graphics
RGB 18/24 Bit and extension connectors for graphics, SATA, PCIe, CAN (CPU I/O), Local Bus, I²C
and SPI. In addition touch controllers for projected capacitive touches and for resistive touches are
provided. An SD Card socket is supported.
Highlights
• Socket for nanoRISC compatible modules
• ITU656 video input interface on ext. connector
• LCD panel interfaces with RGB TTL output
• 2x COM ports on 9pin Sub-D connector
• Backlight power 8..20VDC
• I2S audio codec with standard audio connectors
• Graphics extension connector for optional
• SD Card socket
graphics modules (LVDS, HDMI)
• 2x 10/100 Base-T Ethernet interface or GbE
• PCIe, SATA, CAN, Local Bus, SPI, I2S
on extension pad field
• 2x USB Host, USB OTG Host/Client port
• Battery charger support (Lithium cell)
• Touch Screen support (capacitive + resistive)
• 8..20V power supply input
MSC NANORISC-SK
Evaluation and Development Kit
The MSC NANORISC-SK is a complete, ready-to-run Starterkit for MSC’s range of nanoRISC
processor modules. It consists of the nanoRISC Embedded Platform board MB2, a 7-inch WVGA
display with capacitive touch and a suitable power supply.
Highlights
• Evaluation and Development Kit for all
nanoRISC modules
®
• Includes 7" LCD panel 800 x 480 pixels with
all required interface cables
• nanoRISC CPU module not contained
- please order separately
• Complete range of usable interfaces
• GbE or 2x 10/100 Base-T (dep. on module)
• Power supply included
• 1 or 2 USB Host Port (dep. on module)
• Integrated Debug Adapter on-board
• USB OTG Port (dep. on module)
• SD Card with pre-installed Linux or Android
• CAN Bus, 2x COM Ports on 9-pin Sub-D
Operating System to be ordered with CPU
module of choice
30 | www.msc-technologies.eu
• I2S or AC97 audio codec with standard
audio connectors
Design and Production
Expertise
Module Design
Firmware Expertise
Industrial applications require module designs
With today’s highly integrated CPUs the hard-
to be a balance between performance, price,
ware designs from different module vendors
size, reliability and power dissipation. These
tend to be similar. The BIOS/UEFI or micro-
factors are incorporated into our design guide-
controller firmware not only ensures interop-
lines ensuring that our designers select com-
erability, but also makes the modules config-
ponents appropriately for longevity, low power
urable for special requirements. MSC’s large
consumption and multiple sourcing to ensure the
BIOS/UEFI engineering team has throughout
best availability. By adopting COM technology in
the years adopted a variety of BIOS/UEFI from
the form of COM Express™, Qseven™, SMARC™
various vendors for our modules and accumu-
2.0 or nanoRISC in your system design mini-
lated significant experience and know-how to
mizes your efforts and engineering competen-
be able to support any custom specific BIOS/
cies required for high speed design and provide
UEFI. We ensure direct support, maximum ex-
you a clearly defined upgrade path.
pertise and rapid reaction to customer demand.
®
All new designs are based on the latest UEFI
Custom Development
implementations, and as a standard API they
While modules require a carrier board to oper-
follow the common EAPI definition for COM
ate, complete custom designs may be the right
Express and Qseven.
solution for high volume projects. These may
include single board requirements or special
Product Support
application demands using FPGA or DSP sup-
MSC uses a tracking system for all product sup-
port. MSC offers such custom product devel-
port issues related to our module technolo-
opment including the production and logistics
gies, ensuring quick and professional support.
according to your needs. This also includes
This helps customers to register their issues
mechanical design, certification support and
and the communication is maintained until
regulatory requirements like ISO 13485.
the reported issues are resolved. Our support
group also offers services such as compliance
Custom Adaptation
measurements on customers carrier boards
The intermediate step, before a full custom
as well as schematic and PCB layout design
design, is the adaptation of existing standard
review consultancies for volume OEMs. With a
products to your requirement by tuning the firm-
private login to our support portal, customers
ware, special assembly or integration of memory,
are able to download restricted design support
heatsink or display kits. This approach combines
documents, BIOS updates or special drivers.
standard products with some customization for
a fast time to market and minimized engineering
Please use www.msc-technologies.eu to get
efforts. MSC offers a broad spectrum of exper-
your personal user account.
tise and distribution products which can be combined with our modules and carrier boards.
31
Design and Production
Expertise / Support
Operating systems
On our website www.msc-technologies.eu you
for embedded modules and boards
will find detailed information on MSC's embed-
In addition to our BIOS competence, we are
ded products. This includes data sheets, user's
also focusing on operating system support for
manuals, mechanical data and other design sup-
our customers. Starterkits and board support
port documentation. On the software side, BIOS
packages for different board and operating
updates, drivers for multiple operating systems
system platforms are available. Customized
and BSPs for typical embedded operating sys-
driver support for dedicated applications can
tems such as Windows® 10 IoT, WES7, WEC7,
be offered on request. Major operating system
and WEC2013 are available for download. In
support is available for Microsoft Windows 8,
addition, application notes, videos, whitepapers
®
Windows 7, Windows XP (embedded), Win-
and FAQs provide deeper technical insight on
dows Embedded Compact 7, Linux and An-
specific topics. Part of the information provided
droid, depending on the architecture of the
is only available for registered customers. If you
and VxWorks are
are a customer using MSC products then you can
supported on project request. For more details
register using the link in the top line of the web-
see the table on pages 6/7 and our product
site to gain access to this private portal.
®
®
®
individual module. QNX
®
pages on www.msc-technologies.eu
Other Support services
Product Support
Our support group also offers services such
The MSC Embedded Solutions group has a
as compliance measurements for customer
dedicated support team that works in close co-
carrier boards as well as schematic and PCB
operation with the module hardware and soft-
layout design review consultancy for volume
ware developers. This rapid access to design
OEMs. If you cannot find the information
resources allows us to help our customers to
you need or if you have additional questions
achieve fast time to market. All technical issues
please use the email or telephone contact
from our customers are tracked in an internal
address below :
system, thus ensuring timely response and
enabling the support group to make use of a
Email:support@msc-technologies.eu
large technical knowledge database.
Phone: +49 (0)8165 906-200
MSC Web-based Support Center
Customers can contact our support group by
phone or email, but we also provide an extensive website for delivering as much information
as possible to help customers design-in with
our products.
32 | www.msc-technologies.eu
BIOS and Secure Boot
Built-in Security
Secure booting
New technologies
– MSC’s enhanced security features
MSC continuously improves its BIOS solutions
In many of our COM products we have imple-
with new functions and technologies, such as
mented the most advanced BIOS technologies
UEFI, Intel® Virtualization Technology, VT-d
such as UEFI architecture plus MSC Secure Boot
Virtualized I/O Support, Intel® Advanced Man-
enhancements. Using encryption algorithms,
agement Technology and Intel® Trusted Execu-
digitally signed storage devices and a Trusted
tion Technology. Continuous improvement of
Platform Module (TPM) these products pro-
security functions is also one of the most chal-
vide full TCG (Trusted Computing Group) com-
lenging tasks to meet the growing demand for
pliance and additional security against attacks,
safer embedded systems. MSC is maintaining
protection from software theft or misuse.
user friendly interfaces, such as EPI (Extended
Panel interface) and EAPI (Embedded Applica-
BIOS customization
tion Programming Interface) to allow low-level
Our BIOS solutions have been adapted to our
control of non-volatile memory, I2C bus, back-
customers’ special industrial requirements,
light, watchdog timer etc.
such as flat panel display support, booting
from various devices, extensive power and
thermal management or initialization of customer specific devices.
BOOT BLOCK
SEND HASH VALUES
Public Key System BIOS
Check signature
SYSTEM BIOS
SEND HASH VALUES
TPM
Signature System BIOS
Public Key MBR, Boot Loader
Check signatures
MASTER BOOT RECORD (MBR)
SEND HASH VALUES
Signature MBR
BOOT LOADER
SEND HASH VALUES
CHECK TPM CONTENT
Signature Boot Loader
Public Key OS etc. (optional)
Check signature
(optional)
OS KERNEL,
APPLICATION PROGRAMS, ETC.
Signature OS etc.
33
Intelligent Solutions
MSC Technologies Systems GmbH
MSC Technologies GmbH
Industriestraße 16
Phone
+49 7249 910 0
Munzinger Straße 3
Phone +49 761 8819 0
76297 Stutensee
Fax
+49 7249 799 3
79111 Freiburg im Breisgau
Fax
Germany
Europe
AACHEN
AUSTRIA (also responsible for Slovenia)
+49 761 8819 849
Pascalstr. 21
Phone
+49 2408 709 0
Aredstrasse 13
Phone +43 2256 63975 0
52076 Aachen
Fax
+49 2408 709 299
A - 2544 Leobersdorf
Fax
BERLIN
+43 2256 63975 55
BENELUX COUNTRIES
Englische Straße 28
Phone
+49 30 214882 50
Stadionstraat 2, 6th fl
Phone +31 76 5722 400
10587 Berlin
Fax
+49 30 214882 55
NL - 4815 NG Breda
Fax
DÜSSELDORF
+31 76 5722 404
CZECH REPUBLIC (also responsible for Poland and Slovakia)
Max-Planck-Str.15b
Phone
+49 211 92593 0
Nádražní 2369/10
Phone +420 516 411 494
40699 Erkrath
Fax
+49 211 92593 88
CZ - 678 01 Blansko
Fax
HANNOVER
+420 516 411 494
HUNGARY
Gaußstraße 10
Phone
+49 5132 5099 680
Budafoki út 91-93 West Irodahaz
Phone +36 1 436 72 29
31275 Lehrte
Fax
+49 5132 5099 688
H - 1117 Budapest
Fax
JENA
+36 1 436 72 20
ROMANIA
Rudolstädter Str. 68a
Phone
+49 3641 6825 0
Calea Floreasca 175, et 8
Phone +40 725 944 401
07745 Jena
Fax
+49 3641 6825 66
R - 014459 Bucharest
Fax
KOBLENZ
+40 215 296 901
SPAIN
Heerstraße 31
Phone
+49 6122 5871 460
Calle Chile 10, 2nd Planta, Oficina 222
56179 Vallendar
Fax
+49 6122 5871 466
ES - 28290 Las Matas, Madrid
Torfstecherring 6
Phone
+49 621 58649 113
Fermín Calbetón Nº4 Planta 3
67067 Ludwigshafen
Fax
+49 621 58649 198
ES - 20600 Eibar (Guipúzcoa)
Phone +34 91 721 69 51
MAUDACH
NEUFAHRN
Phone +34 943 257 105
SWITZERLAND
Zeppelinstr. 1a
Phone
+49 8165 906 100
Industriestr. 25
Phone +41 43 355 33 66
85375 Neufahrn
Fax
+49 8165 906 303
CH - 8604 Volketswil
Fax
NÜRNBERG
+41 43 355 33 77
TURKEY
Lina-Ammon-Str.19a
Phone
+49 911 24425 70
Inonu Cd. Seylan Is Merkezi 83/6 Kozyatagi
Phone +90 216 411 2333
90471 Nürnberg
Fax
+49 911 24425 75
TR - 34736 Istanbul
Fax
Gutenbergstraße 15
Phone
+49 711 78260 380
70771 Leinfelden-
Fax
+49 711 78260 378
Borsigstraße 36
Phone
+49 6122 5871 400
65205 Wiesbaden
Fax
+49 6122 5871 444
+90 216 411 3935
STUTTGART
Echterdingen
WIESBADEN
info@msc-technologies.eu
© MSC Technologies. All rights reserved. Although great care has been taken in preparing this printed matter, MSC can not be held responsible for any errors or omissions.
All information in here is subject to change without notice. All hardware and software names used are trade names and/or trademarks of the respective manufacturer.
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