8-line low capacitance EMI filter and ESD protection

8-line low capacitance EMI filter and ESD protection
EMIF08-VID1F3
8-line low capacitance EMI filter and ESD protection
Datasheet - production data
Description
This is a highly integrated 8-line device designed
to suppress EMI/RFI noise in all systems
exposed to electromagnetic interference.
This filter includes ESD protection circuitry, which
prevents the application from damages when
subjected to ESD surges up to 20 kV.
Figure 1: Pin configuration (top view)
Features





High efficiency in EMI filtering in wide filter
bandwidth: better than -25 dB from 700 MHz
to 3.0 GHz
Very thin package: 0.6 mm max.
High efficiency in ESD suppression on all
input and output pins (exceeds IEC61000-42 level 4: ±20 kV contact discharge)
High reliability offered by monolithic
integration
High reduction of parasitic elements through
integration and wafer level packaging
Figure 2: Basic cell configuration
input
R
output
Applications




LCD and camera for mobile phones
Computers and printers
Communication systems
MCU Boards
May 2017
R = 100 Ω
Cline = 30 pF typ. at 2.5VDC
DocID030456 Rev 1
This is information on a product in full production.
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Characteristics
1
EMIF08-VID1F3
Characteristics
Table 1: Absolute maximum ratings (Tamb = 25 °C)
Symbol
Vpp
Tj
Parameter
IESD IEC 61000-4-2
Contact discharge
Air discharge
Peak pulse voltage
Operating junction temperature
Value
Unit
±20
±30
kV
±125
°C
Tstg
Storage temperature range
-40 to +85
°C
Top
Operating temperature range
-65 to +150
°C
Figure 3: Electrical characteristics (definitions)
Table 2: Electrical characteristics (Tamb = 25 °C)
Symbol
Min.
Typ.
Max.
VBR
IR = 1 mA
5.8
9
VF
IF = 1 mA
0.4
1.5
IRM
VRM = 3.5 V per line
R
Serial resistance
Cline
FC
S21
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Test conditions
80
100
Unit
V
100
nA
120
Ω
VBIAS = 2.5 VDC reverse Bias, F = 1 MHz, VOSC = 30 mV
30
pF
Cut-off frequency
98
MHz
Attenuation from 700 MHz to 3 GHz
F = 1.7 GHz
-25
-30
-45
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dB
EMIF08-VID1F3
1.1
Characteristics
Characteristics (curves)
Figure 4: Attenuation versus frequency
Figure 5: Analog crosstalk versus frequency
Figure 6: ESD response to IEC 61000-4-2
(+8 kV contact discharge)
Figure 7: ESD response to IEC 61000-4-2
(-8 kV contact discharge)
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Package information
2
EMIF08-VID1F3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1
WLCSP 20 bumps package information
Figure 8: WLCSP 20 bumps package outline
400 µm ± 40
255 µm ± 25
170 µm
1035 µm ± 40
346.4 µm ± 40
600 µm ± 40
170 µm
3140 µm ± 40
Figure 9: Footprint recommendations, dimensions
in mm (inches)
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Figure 10: Marking layout
EMIF08-VID1F3
Package information
Figure 11: Tape dimension definitions
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Ordering information
3
EMIF08-VID1F3
Ordering information
Figure 12: Ordering information scheme
EMIF 08 - VID
1
F3
EMI Filter
08 : 8 lines
Application
Version
Package
Flip-chip
3 = lead-free, pitch 400 µm, bump = 255 µm
Table 3: Ordering information
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Order code
Marking
Package
Weight
Base qty.
Delivery mode
EMIF08-VID1F3
LN
WLCSP 20 bumps
7.2 mg
5000
Tape and reel
DocID030456 Rev 1
EMIF08-VID1F3
4
Revision history
Revision history
Table 4: Document revision history
Date
Revision
19-May-2017
1
Changes
Initial release.
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EMIF08-VID1F3
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© 2017 STMicroelectronics – All rights reserved
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