STM32 High Performance MCU
1
STM32 High Performance Platform
STM32F2, F4 and F7
Presentation Title
11/03/2016
ST Confidential
STM32 platform
8 product series / 30 product lines
STM32F2x5
STM32F2x7
High-performance
Mainstream
Ultra-low-power
STM32F401
STM32F411
STM32F405/415
STM32F407/417
STM32F427/437
STM32F429/439
STM32F030 Value line
STM32F0x1
STM32F0x2
STM32F0x8
STM32L0x1
STM32L0x2
STM32L0x3
Cortex-M0
Cortex-M0+
STM32F100 Value line
STM32F101
STM32F102
STM32F103
STM32F105/107
STM32L100 Value line
STM32L151/152
STM32L162
Cortex-M3
STM32F746/756
STM32F301
STM32F302
STM32F303
STM32F3x4
STM32F373
STM32F3x8
STM32L47x
STM32L48x
STM32L43x
STM32L42x
Cortex-M4
Cortex-M7
2
High-performance platform Cortex Mx
3
Access
Foundation
Advanced
STM32F749
STM32F401
STM32F411
• Entry level
• Dynamic efficiency
STM32F205
STM32F207
STM32F405
• Advanced Connectivity
• Security option
STM32F407
STM32F427
STM32F427
STM32F429
STM32F429
• Enhanced Graphic
• High memory density
• Security option
World’s 1st MCU based on new Cortex-M7 w/ FPU
428DMIPS/1000 Coremarks,
• High performance, rich connectivity, high integration, Dynamic Efficiency
• From 105DMIPs up to 429DMIPS, based on Cortex-M3, M4 and M7
High-performance platform
High
performance
with DSP and
FPU
High
performance
MCUs
STM32F746/56
STM32F429/39
STM32F427/37
STM32F446
STM32F207/217
STM32F407/417
STM32F405/415
STM32F205/215
STM32F401/411
Cortex-M3
Cortex-M4
Cortex-M7
STM32F4 and F7 : #1 in performance
Certified by COREMARK
5
STM32 F2 Series
STM32 F2
High-performance MCUs
• High performance Cortex-M3 MCU,
up 120 MHz/150 DMIPS
• High integration thanks to ST 90nm
process: up to 1MB Flash/128kB SRAM
• Advanced connectivity: USB OTG,
Ethernet, CAN
7
STM32 F2 Product lines
Cortex®-M3 – 120 MHz
Ethernet
Product
FCPU FLASH RAM Hardware 2x 12-bit
• ART Accelerator™
I/F
line
(MHz) (bytes) (KB) Crypto/hash
DAC
• 2x USB2.0 OTG
IEEE 1588
FS/HS
• SDIO
STM32F205
• USART, SPI, I²C
• 2x CAN
128K Up to
120

to 1M 128
• I²S + audio PLL
STM32F215

• 16 and 32-bit timers
• 3x 12-bit ADC (0.5μs)
• Low voltage 1.7 to
3.6V
Camera
I/F
FSMC

STM32F207
120
STM32F217
512K
to 1M
Up to
128


Notes: 1/ 1.7 V for WLSCP66 package only and 1.8 V for all other packages
2/ Hardware crypto/Hash available on STM32F215 and STM32F217 only



8
STM32 F2 Portfolio
9
STM32 F2 Block diagram
• Packages
• WLSCP66 (<3.7x4mm)
• LQFP64, LQFP100
• LQFP144, LQFP176
• BGA176
• Operating voltage
• 1.7 to 3.6V
• Temperature range
• -40 to 85 °C
• -40 to 105°C
10
Processing performance
• ART Accelerator™ for F2 series
• The ART (Adaptive Real-Time) memory accelerator unleashes processing
performance equivalent to 0-wait state Flash execution up to 120 MHz for F2 series
ART Accelerator
Core
Instructions-BUS
Cortex-M3
CPU
Data/Debug-BUS
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
Flash memory
Arbitration
128-bit
and
branch
128-bit
management
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
ARRAY
11
STM32F2
Providing more performance
CoreMark score
Linear execution performance from Flash
398
• 120 MHz/150 DMIPS with
ART Accelerator™
• Up to 398 CoreMark Result
• ARM Cortex-M3
CPU frequency
120 MHz
12
System performance
32-bit multi-AHB bus matrix
13
Power consumption figures
Typ current
Vdd Range
Measurements
conditions:
VDD = 3.3V
Room temperature
175µA/MHz
@ 120MHz
350µA
= 21mA
@120MHz
Wake up
time:17μs
300µA
Wake up
time:110μs
Dynamic RUN Mode*
STOP
Mode
* Run mode Conditions: Coremark executed from
Flash, peripherals OFF
2.2µA
3.3µA
Wake up
time:375μs
Standby Mode
w/o and w/ RTC
<1µA
Vbat Mode
w/o or w/ RTC
14
STM32F2 multiple applications
Industrial
•
•
•
•
•
•
•
•
PLC
Inverters
Power meters
Printers, scanners
Power meters
Industrial networking
Industrial motor drive
Communication gateway
Consumer
• PC peripherals, gaming
• Digital cameras, GPS
platforms
• Home audio
• Wi-Fi , Bluetooth modules
• Smartphone accessories
Building & security
• Alarm systems
• Access control
• HVAC
Medical
• High-end glucose meters
• Power meters
• Battery-operated applications
15
STM32F2-specific tools and Software
• Evaluation boards:
• These boards provide connection to all I/Os and
all peripherals available in the chip:
• External memories, Ethernet, two USB OTG
connectors, touchscreen TFT display, CMOS
camera, audio output…
STM3220G-EVAL
STM3221G-EVAL
• Java evaluation kit:
• Complete platform to evaluate the
development of embedded applications
in Java for the STM32 F2 series
microcontrollers.
-> www.stm32java.com
STM3220G-JAVA
16
STM32 F4 Series
STM32 F4
High-performance MCUs with DSP and FPU
• World’s highest performance
Cortex-M MCU executing from
Embedded Flash, Cortex-M4 core with
Floating Point Unit up to
180 MHz/225 DMIPS
• High integration thanks to ST 90nm
process (same platform as F2 series):
up to 2MB Flash/256kB SRAM
• Advanced connectivity USB OTG,
Ethernet, CAN, SDRAM interface, TFT
LCD controller
18
ARM Cortex™-M4 Core
FPU
Single precision
Ease of use
Better code efficiency
Faster time to market
Eliminate scaling and saturation
Easier support for meta-language tools
DSP
MCU
Ease of use of C programming
Interrupt handling
Ultra-low power
Cortex-M4
Harvard architecture
Single-cycle MAC
Barrel shifter
19
High-performance platform
20
Access
STM32F401
STM32F411
• Entry level
• Dynamic efficiency
Foundation
STM32F205
STM32F207
STM32F405
• Advanced Connectivity
• Security option
Advanced
STM32F407
STM32F427
STM32F429
• Enhanced Graphic
• High memory density
• Security option
• High performance, rich connectivity, high integration, Dynamic Efficiency
• Over 300 part numbers in production with close pin-to-pin compatibility
• From 105DMIPs up to 428DMIPS, based on Cortex-M3, M4 w/ FPU
High-performance platform
21
STM32F4 portfolio
22
Processing performance
• ART Accelerator™ for F4 series
• The ART (Adaptive Real-Time) memory accelerator unleashes processing
performance equivalent to 0-wait state Flash execution up to 180 MHz for F4 series
ART Accelerator
Core
Instructions-BUS
Cortex-M4
CPU
Data/Debug-BUS
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
Flash memory
Arbitration
128-bit
and
branch
128-bit
management
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
128-bit
ARRAY
23
System performance
32-bit multi-AHB bus matrix
24
Real-time performance
32-bit multi-AHB bus matrix
MP3 decoder code
execution by core
Access to the MP3
data for
decompression
DMA transfer to
audio output stage
(I2S)
Compressed audio
stream (MP3) to
16kByte SRAM
block
User interface:
DMA transfers of
the graphical icons
from Flash to
display
Decompressed
audio stream to
112kByte SRAM
block
STM32F4
Providing more performance
CoreMark score
Execution performance from Flash
608
STM32F429
566
Linear performance thanks to
ST ART AcceleratorTM
• Up to 180 MHz/ 225 DMIPS
with ART Accelerator™
STM32F407
• Up to 608 CoreMark Result
339
STM32F411
Dynamic
EfficiencyTM
• ARM Cortex-M4 with
floating-point unit (FPU)
285
STM32F401
CPU frequency
84
100
168 180
MHz
26
STM32F2 and F4
Providing more performance
CoreMark score
Execution performance from Flash
608
STM32F429
566
Linear performance thanks to
ST ART AcceleratorTM
• Up to 180 MHz/ 225 DMIPS
with ART Accelerator™
STM32F407
398
STM32F207
• Up to 608 CoreMark Result
339
STM32F411
Dynamic
EfficiencyTM
• ARM Cortex-M3 and
Cortex-M4 with floatingpoint unit (FPU)
285
STM32F401
CPU frequency
84
100 120
168 180
MHz
27
Advanced connectivity
Peripherals
Performance
USB FS / HS
12 Mbit/s / 480 Mbit/s
USART
Up to 12.50 Mbit/s
SPI
Up to 50 Mbit/s
I²C
Up to 1Mbit/s
GPIO toggling
Up to 90 MHz
3-phase MC timer
180 MHz PWM timer clock input
SDIO
Up to 50 MHz
I²S and SAI
From 8 kHz to 192 kHz sampling frequencies
Camera interface
Up to 54 Mbyte/s at 54 MHz (8- to 14-bit parallel)
Crypto/hash processor
AES-256 up to 149.33 Mbyte/s
FMC
Up to 90 MHz (8-/16-/32-bit data bus, supports SRAM, PSRAM, NAND and
NOR Flash, parallel graphic LCD), SDRAM, LPSDRAM (Low Power SDRAM)
12-bit ADC / 12-bit DAC
0.41 μs (2.4 MSPS, 7.2 MSPS in Interleaved mode) / 1 MSPS dual DAC
CAN 2.0B
Up to 2 independent CAN
Ethernet
10/100 Mbit/s MAC with hardware IEEE 1588
LCD TFT controller
Display size : QVGA, QWVGA, VGA, SVGA, XGA with 2-layer blending and
dithering
28
F4 Power consumption figures
Typ current
Measurements conditions:
Room temperature
244µA/MHz
@ 180MHz
= 44mA
@180MHz
280µA
Wake up time: 110μs
238µA/MHz
@ 168MHz
= 40mA
@168MHz
310µA
Wake up time: 17μs
120µA
Wake up time: 105μs
290µA
F401**/F411
Dynamic
Efficiency
lines
100µA/MHz
@ 64MHz
2.2µA
3.1µA
Wake up time: 318μs
Wake up time: 22μs
2.2µA
3.1µA
10µA
Wake up time: 375μs
Wake up time: 113μs
112µA/MHz
43µA
1.8µA
2.4µA
@ 100MHz
Wake up time: 21μs
Wake up time: 314μs
Dynamic RUN Mode*
STOP
Mode
Standby Mode
w/o and w/ RTC
STM32F427/437 and STM32F429/439
<1µA
<1µA
<1µA
Vbat Mode
w/o or w/ RTC
STM32F405/415 and STM32F407/417
Legend:
*Run mode Conditions: Coremark executed from Flash, peripherals OFF
**For STM32F401:128µA/MHz @ 60MHz, 137µA/MHz @ 84MHz
STM32F401/F411
29
244µA/MHz
Typ current
@ 180MHz
F2 and F4
Power consumption figures
30
= 44mA
@180MHz
238µA/MHz
@ 168MHz
Measurements conditions:
Room temperature
280µA
Wake up time: 110μs
310µA
= 40mA
@168MHz
Wake up time: 17μs
120µA
Wake up time: 105μs
175µA/MHz
290µA
@ 120MHz
Wake up time: 22μs
= 21mA
@120MHz
F401**/F411
Dynamic
Efficiency
lines
100µA/MHz
@ 64MHz
350µA
2.2µA
3.1µA
Wake up time: 318μs
2.2µA
3.1µA
Wake up time: 375μs
300µA
2.2µA
3.3µA
<1µA
Wake up time:375μs
<1µA
<1µA
Wake up time:110μs
10µA
Wake up time: 113μs
112µA/MHz
43µA
1.8µA
2.4µA
@ 100MHz
Wake up time: 21μs
Wake up time: 314μs
Dynamic RUN Mode*
STOP
Mode
Standby Mode
w/o and w/ RTC
STM32F427/437 and STM32F429/439
<1µA
Wake up time:17μs
STM32F405/415 and STM32F407/417
Legend:
*Run mode Conditions: Coremark executed from Flash, peripherals OFF
**For STM32F401:128µA/MHz @ 60MHz, 137µA/MHz @ 84MHz
Vbat Mode
w/o or w/ RTC
STM32F401/F411
STM32F2x
F2 and F4 High integration
Series
Flash/SRAM
(bytes)
STM32 High-performance platform
STM32F2
STM32F4
F401
256 K/64 K
WLCSP49 (3x3mm)
UFBGA100 (7x7mm)
UFQFPN48 (7x7mm)
F401
512 K/96 K
WLCSP49 (3.07x3.07mm)
UFBGA100 (7x7mm)
UFQFPN48 (7x7mm)
WLCSP49 (3.034mm x 3.22mm)
UFBGA100 (7x7mm)
UFQFPN48 (7x7mm)
F411
1 M/192 K
WLSCP90
(<4x4.3 mm)
F405
2 M/256 K
WLSCP143
(<4.5x5.6mm)
F429
512 K/128 K
1 M/128 K
WLSCP66
(<3.7x4mm)
F205
31
STM32F405/415/407/417
• Packages
• WLSCP90 (<4x4.3 mm)
• LQFP64
• LQFP100
• LQFP144
• LQFP176
• BGA176
• Operating voltage
• 1.7 to 3.6V
• Temperature range
• -40C to 85C
• -40C to 105C
32
33
STM32F4 Advanced graphic lines
STM32F427/429 Highlights
•
180 MHz/225 DMIPS
•
Dual bank Flash (in both 1-MB and 2-MB), 256kB SRAM
•
SDRAM Interface (up to 32-bit)
•
LCD-TFT controller supporting up to SVGA (800x600)
•
Better graphics with ST Chrom-ART Accelerator™:
•
x2 more performance vs. CPU alone
•
•
Offloads the CPU for graphical data generation:
•
Raw data copy
•
Pixel format conversion
•
Image blending (image mixing with some transparency)
100 µA typ. in Stop mode
Press release: http://www.st.com/web/en/press/en/p3357
34
STM32F429 as HMI* controller
STM32F4x9 using
Chrom-ART Accelerator,
internal or external
memory for frame buffer
and TFT controller for
display
•
Up to XGA (1024 x 768)
•
16-/32-bit external memory
interface
•
Recommended packages:
LQFP144,LQFP176/BGA176
or LQFP208/BGA216
Cortex-M4
Chrom-ART
Accelerator
TFT
Controller
Dedicated TFT interface
with fully programmable
panel timings
Bus Matrix
Internal
Flash up
to 2 Mbytes
Internal
SRAM
256 Kbytes
*HMI : Human Machine Interface
External
Memory
Controller
16-/32-bit
Dedicated interface
(up to 32-bit/90 MHz)
with Flash, SRAM and
SDRAM support
35
STM32F427/437/429/439
• Packages
• WLSCP143 (<4.5x5.6mm)
• LQFP100
• LQFP144
• LQFP176
• BGA176
• LQFP208
• BGA216
• Operating voltage
• 1.7 to 3.6V
• Temperature range
• -40C to 85C
• -40C to 105C
36
STM32 Dynamic Efficiency TM
Less Dynamic Power. More performance.
• STM32 Dynamic Efficiency TM stands for the reduction of Power
consumption in run mode with a simultaneous increase in Processing
Performance and Integration (P2I).
• STM32 Dynamic Efficiency TM brings innovation while applying
existing ST advanced technologies.
STM32F401 and STM32F411 microcontrollers are the first 2 lines of
STM32 Dynamic Efficiency™ devices
37
38
STM32 Dynamic Efficiency TM
Technologies
39
• ART AcceleratorTM: Highest execution performance from Flash.
• ST Adaptive Real Time (ART) Accelerator is a prefetch queue and branch cache allowing zero-wait
execution from embedded Flash. The performance of the core is then fully unleashed and available
to the user. Because it is much smaller in die size than a real cache, performance come with high
integration. Execution from the branch cache reduces the access to the Flash and reduces power
consumption.
• ST 90 nm process: Less dynamic power. More integration and performance.
• Higher integration comes with smaller capacities inside the transistors used inside the STM32
integrated circuit. This translates into faster performance as charge and discharge timings are
reduced and into lower dynamic power.
• Voltage scaling: Optimum dynamic power consumption. Whatever your performance
needs.
• By allowing the user to dynamically adapt the core voltage to the performance needs, the user
always gets the lowest dynamic current.
• Batch Acquisition Mode (BAM): Always ON data collection, even when the core is stopped.
• DMA keeps transferring incoming data from peripherals to memory, and wakes up the core only
when needed to reach the lowest power consumption. The core can either execute first level data
processing from code stored in RAM or resume executing from Flash.
STM32F401/F411 Highlights
40
The best balance
CoreMark score
339
•
Performance
282
CPU frequency (MHz)
84
•
Power consumption
•
Integration
100
STM32F401 & STM32F411
main specification details
41
Flash low power mode use cases
• Batch Acquisition Mode (BAM) where the MCU core is stopped while interfaces (I2C, SPI, I2S, …) are fetching data,
being able to put the flash in power down will reduce even further the power consumption
• Applications where the MCU core and the RAM are running without the flash
Flash low power mode application example
• MCU core is in sleep mode (core clock stopped waiting for interrupt)
• Interface are running
• Flash is in power down and flash interface (ARTTM accelerator) clock is stopped
• Only DMA channel are enabled and running
Cortex-M4
I²C
I²S
Analog sensor
DMA
128KB
RAM
ART
512KB
Flash
ADC channel
STM32F411
STM32 – Sensor hub solution
STM32F411
Enhanced peripheral sleep management
STM32F401
I2S
96KB
RAM
0111010100101001010101111
0111011000010
0011010
Cortex-M4
DMA
ADC
STM32F411
0111010100101001010101111
128KB
RAM
0111011000010
0011010
I2S
ART
512KB
FLASH
Cortex-M4
DMA
ADC
42
ART
512KB
FLASH
Core
DMA
Core
can
cancan
fetch
transfer
fetch
data
data
from
from
to Flash
RAM
RAM
while
while
while
core,
allFlash
other
Flash
and
peripherals
and
ART
ART
areare
stopped
stopped
(already
(new STM32F411
exist in STM32F401)
mode)
STM32 – Sensor hub solution
STM32F411
Batch Acquisition Mode (BAM) – Audio ex.
STM32F411
I2S
128KB
RAM
0111010100101001010101111
0111011000010
0011010
Cortex-M4
DMA
I²S
43
ART
512KB
FLASH
Cortex-M4
Flash fetch
Cortex-M4
RAM fetch
Current
consumption
BAM
Detection = N
Cortex-M4 stopped
ART stopped
Flash stopped
ART stopped
Flash stopped
DMA stopped
I2S stopped
Cortex-M4
RAM fetch
BAM
Cortex-M4 stopped
ART stopped
Flash stopped
Algorithm
processing
Detection = Y
ART stopped
Flash stopped
DMA stopped
I2S stopped
DMA stopped
I2S stopped
STM32 – Sensor hub solution
Example: STM32F401 as sensor hub
44
STM32F401 128kB/256kB Flash
Dynamic Efficiency Line
• Packages
• WLSCP49 (3x3 mm)
• UFQFN48
• LQFP64
• LQFP100
• BGA100
• Operating voltage
• 1.7 to 3.6V
• Temperature range
• -40C to 85C
• -40C to 105C
45
STM32F401 384kB/512kB Flash
Dynamic Efficiency Line
• Packages
• WLSCP49 (around 3.07x3.07
mm) pin to pin compatible
with 128kB and 256kB F401
• UFQFN48
• LQFP64
• LQFP100
• BGA100
• Operating voltage
• 1.7 to 3.6V
• Temperature range
• -40C to 85C
• -40C to 105C
46
STM32F411 256kB/512kB Flash
Dynamic Efficiency Line
• 100MHz/125 DMIPs from
flash
• Down to 100uA/MHz, 10uA
typical in STOP mode
• Batch Acquisition Mode
(BAM)
• 5 SPI/5 I2S (2 full duplex)
• Packages
• WLSCP49 (3.034mmx3.22mm)
• UFQFN48, LQFP64,
LQFP100, BGA100
• Operating voltage
• 1.7 to 3.6V
STM32F4 multiple applications
Industrial
•
•
•
•
•
•
•
PLC
Inverters
Power meters
Printers, scanners
Industrial networking
Industrial motor drive
Communication gateway
Consumer
• PC peripherals, gaming
• Digital cameras, GPS
platforms
• Home audio
• Wi-Fi , Bluetooth modules
• Smartphone accessories
Building & security
• Alarm systems
• Access control
• HVAC
Medical
• High-end glucose meters
• Power meters
• Battery-operated applications
48
STM32F4 real life applications
49
Smart watch:
Main application controller or sensor hub
Smart phone, tablets and monitor
sensor hub for MEMS and optical touch
Industrial/home automation panel:
Main application controller
STM32F4 real life applications
Wi-Fi modules for the Internet of
Things:
Appliance, Door Camera
+
Internet
50
STM32F4 specific Hardware
• Evaluation boards:
Large offer of evaluations boards:
• STM3240G-EVAL
• STM3241G-EVAL
• STM32429I-EVAL
• STM32439I-EVAL
STM32439I-EVAL
STM32429I-EVAL
• Discovery kits:
• STM32F4DISCOVERY
• 32F401CDISCOVERY
• 32F411EDISCOVERY (Q4 2014)
32F429IDISCOVERY
32F401CDISCOVERY
32F411EDISCOVERY
STM32F4DISCOVERY
• 32F429IDISCOVERY
• Nucleo kit:
• NUCLEO-F401RE
• NUCLEO-F411RE
NUCLEO-F401RE
NUCLEO-F411RE
51
STM32F4 optimal software
• Graphical Stack -> www.st.com/stemwin
• SEGGER and ST signed an agreement around emWin
graphical stack. The solution is called STemWin:
• Professional well-known stack solution
• All emWin Widgets and PC Tools: GUIBuilder, simulator,
widgets
• Free for all STM32, delivered in binary
• Takes benefit from STM32F4 Chrom-ART Accelerator! Week37
• Audio offer: Full solution optimized for STM32F4
• Full collection of codecs:
• MP3, WMA, AAC-LC, HE-AACv1, HE-AACv2, Ogg Vorbis,
G711, G726, IMA-ADPCM, Speex, …
• ST Post Processing Algorithms:
•
•
•
•
Sample Rate Converters
Filters with examples like Bass Mix, Loudness….
Smart Volume Control: volume increase with no saturation
Stereo Widening
52
STM32F4 advanced Solutions
• Beyond C Language !
• Java evaluation kit:
• Complete platform to evaluate the
development of embedded applications
in Java for the STM32 F4 series
microcontrollers.
-> www.stm32java.com
STM3240G-JAVA
• .Net Micro framework
• Full support for Microsoft .Net Micro
Framework
• Full support for Microsoft Gadgeteer
hobbyists initiative
STM3240G-ETH/NMF + STM3240G-USB/NMF
53
STM32F446
Product highlights
STM32 F446
55
Cost effective high performance MCU
with SDRAM and Quad SPI
Advanced
STM32F427
STM32F429
STM32F469
Enhanced Graphic
High memory density
Security
STM32F405
STM32F407
Foundation
STM32F205
STM32F207
STM32F446
Access
STM32F401
STM32F411
Dynamic efficiency
Enry Level
Extended Connectivity
and Features
Security
STM32F446 – Block diagram
56
STM32F446 line
• Packages
• WLSCP
• LQFP64, LQFP100, LQFP144
• BGA144 pitch 0.5, BGA 144 pitch 0.8
• Memory size:
• 256-Kbyte Flash/ 128-Kbyte SRAM
• 512-Kbyte Flash/ 128-Kbyte SRAM
Flash
512 KB
STM32F446RE
STM32F446ME
STM32F446VE
STM32F446ZE
256 KB
STM32F446RC
STM32F446MC
STM32F446VC
STM32F446ZC
Pin count
64 pins
LQFP
81 pins
CSP
100 pins
LQFP
144 pins
LQFP
BGA pitch 0.8
BGA pitch 0.5
STM32F446 Highlights
• High Performance
• Cortex-M4
• DSP and FPU
• ARTTM accelerator allowing zero wait state exection from flash
• Achieving 225 DMIPS and 608 Coremark scores
• Compact internal Memory ressources
• 512 KB internal Flash
• 128 KB internal RAM
58
STM32F446 Highlights
• External memory interfaces
• Flexible Memory controller (FMC)
• Running at 90MHz and supporting memory remap mode to offer higher
perfomance
• Supporting external SRAM,PSRAM,SDRAM/LPSDR SDRAM, Flash
NOR/NAND memories
• Supporting Intel 8080 and Motorola 6800 LCD parallel interfaces for
cost effective Graphical interfaces using LDC with embedded
controllers
• Dual Quad SPI interface (QSPI)
• Supporting external single, dual or quad SPI NOR Flash memories
• Memory Mapped mode supporting up to 256 Mbytes external SPI NOR
flash
• Up to 90 Mbytes/s in SDR mode and up to 120Mbytes/s in SDR mode
• Dual quad SPI mode allowing higher throughput
59
STM32F446 Highlights
• Upgraded USB features
• Added Dedicated USB power rails.
• additional support of Link Power Mode (LPM)
• A new intermediate low power state with short entry and exit times
• Extended Connectivity
• HDMI CEC controller
• Up to 7 simultaneous I²S channels
• 3 I²S Half duplex
• 2 Serial Audio Interfaces supporting I²S full duplex and Time Division Multiplexing
• SPDIF input interface
•
•
•
•
•
Up to 4 parallel SPDIF inputs
Supporting analog and optical inputs
Up to 12.288 MHz symbol rate
Support from 32 to 192KHz stereo streams
Support up to 5.1 multi-channel surround sound
• Power efficiency
• Targeted <100 uA in STOP mode
60
F446 – New Features Benefits
• Quad SPI interface (QSPI)
• NOR flash interface requiring a limited number of pins (5
pins in single QSPI mode and 9 pins in dual mode QSPI)
•
Allowing efficient NOR flash extension in small packages
and so enabling better BOM costs
• Dual quad SPI mode
• Allow double the throughput by accessing 2 external QSPI
flash memories in parallel
•
Possibile to have the QSPI Flash memory mapped
• Allowing to access the QSPI external Flash as an internal flash
and so avoiding all memory access implementation overhead
• Coupling the QSPI with the FMC
• Releasing the application optimization constraints when both
external Flash and external RAM are required
61
F446 – New Features Benefits
• Upgraded USB features
• Added Dedicated USB power rails
• Avoiding external PHYs when using USB in low power supply ranges
• additional support of Link Power Mode (LPM)
• Allowing finer power management leading to significant power savings
• Compliency with the latest USB standard updates.
• Extended Connectivity
• HDMI CEC controller
• Enabling the control of different HDMI connected devices through a single remote control.
• SPDIF input interface
• Allowing an integrated solution offering enabling better BOM cost in consumer audio
application using SPDIF interfaces
• Power efficiency
• Targeted <100 uA in STOP mode
62
STM32F469
Product highlights
STM32F469
High performance MCU with
Extended SDRAM, Quad SPI and MIPI DSI interface
64
Advanced
STM32F427
STM32F429
STM32F469
Enhanced Graphic
High memory density
Security
STM32F405
Extended Connectivity
& Features
Security
Foundation
STM32F205
STM32F207
STM32F446
STM32F407
Access
STM32F401
STM32F411
Entry Level
Dynamic efficiency
STM32F469/479 block diagram
• Packages :
• WLCSP168
• BGA168
• LQFP208
• BGA216
• LQFP 176
• Memory sizes
• 2MB Flash, 384KB RAM
• 1MB Flash, 384KB RAM
• 512KB Flash, 384KB RAM
• Cryptography
• F479 embeds a HW Crypto
processor
65
STM32F469/F479 lines
Flash
STM32F479AI
STM32F479II
STM32F479BI
STM32F479NI
STM32F469AI
STM32F469II
STM32F469BI
STM32F469NI
STM32F479AG
STM32F479IG
STM32F479BG
STM32F479NG
STM32F469AG
STM32F469IG
STM32F469BG
STM32F469NG
STM32F469AE
STM32F446IE
STM32F446BE
STM32F446NE
2 MB
1 MB
512 KB
Pin count
168/169 pins
CSP 168
BGA 169
176 pins
LQFP
208 pins
LQFP
216 pins
BGA
• High Performance
F469 Highlights
• Cortex-M4 with DSP and FPU
• ARTTM accelerator allowing zero wait state exection from flash
• Achieving 225 DMIPS and 608 coremark scores
• Advanced Graphics
• Chrom-ARTTM HW Graphical accelerator
• Offloads the CPU from repetitive graphics operations
• Efficient data copy, transparency effects and pixel format conversion
• Embedded display Controllers
• MIPI® DSI controller
•
•
•
•
high-speed differential serial interface
Up to 720p 30Hz resolution
Interfacing display modules w or w/o on-panel display controller or frame buffer
2 D-PHY data Lanes with up to 500Mbs for each line
• TFT LCD controller
•
•
•
•
24-bit parallel RGB interface
Up to XGA resolution
2 display layers with dedicated FIFOs
Color look-up table with up to 256 24-bit colors per display layer
67
F469 Highlights
• Extended Memory ressources
• Up to 2MBytes internal Flash
• 384 KB internal RAM including 64KB CCM
• External memory interfaces
• Flexible Memory controller (FMC)
• 90MHz I/F with memory remap capability for higher perfomance
• SRAM,PSRAM,SDRAM/LPSDR SDRAM, Flash NOR/NAND support
• Intel 8080 and Motorola 6800 LCD parallel interfaces for cost effective Graphical interfaces
using LDC with embedded controllers
• Dual Quad SPI interface (QSPI)
• SPI NOR Flash (1-bit), quad SPI (4-bit) or dual-Quad (8-bit) SPI NOR Flash support
• Memory Mapped mode supporting up to 256 Mbytes external SPI NOR flash
• Up to 90 Mbytes/s in SDR mode and up to 120Mbytes/s in DDR mode
• Upgraded USB features
• Added Dedicated USB power rails.
•
additional support of Link Power Mode (LPM)
• low power state with short entry and exit times
68
F469 Features benefits
• Chrom-ARTTM HW Graphical accelerator
• BETTER Graphics with LESS CPU load
• Enabling both advanced GUI and real time processing with a
single MCU
High quality Rendering
Smooth transitions
Motion fluidity
69
F469 Features & Benefits
• MIPI® DSI controller
• Advanced Animation and Graphical user interfaces
• Aligned on mobile industry standards
• Opening the door to next generation displays with higher pixel density
• Only 2 pins for each Lane are requested to interface with the display panels
• Availibility even on small packages => BOM cost saving
• Lower power consumption and less electromagnetic interference
• TFT LCD controller
• Advanced animation and graphical user interfaces
• Drives displays without embedded controllers  BOM cost saving
70
Display interfaces with STM32F469
71
Parallel interface LCD Display
DPI
Without controller and GRAM
Parallel interface
Up to 28 pins
Up to XGA resolution
DSI Display
Cortex-M4
ART
Chrom-ART
LCD-TFT
CTRL
W or W/O
controller and GRAM
DPI
DSI
Host
RAM
FMC
DBI
Flash
PPI
DBI
Parallel interface
Up to 22 pins
Up to VGA/WQVGA resolution
Parallel interface LCD Display
With controller and GRAM
D-PHY
Serial high speed interface
Up to 6 pins
Up to 720p 30Hz resolution
F469Features benefits
• Extended Memory ressources
• Up to 2MBytes internal Flash
• 384 KB internal RAM including 64KB CCM
• Enables advanced data processing, high integration and higher
graphic resolutions
resolution→
BUFFER SIZES
CGA
QVGA
WQVGA
VGA
WVGA
SVGA
XGA
(Kbytes) ↘
(320x200) (320x240) (480x272) (640x480) (800x480) (800x600) (1024x768)
1 (2 colors)
7.8
9.4
15.9
37.5
46.9
58.6
96.0
bpp ↓
2 (4 colors) 15.6
18.8
31.9
75.0
93.8
117.2
192.0
4(16 colors) 31.3
37.5
63.8
150.0
187.5
234.4
384.0
8 (256 colors) 62.5
75.0
127.5
300.0
375.0
468.8
768.0
16 (high color) 125.0
150.0
255.0
600.0
750.0
937.5
1536.0
24 (true color) 187.5
225.0
382.5
900.0
1125.0
1406.3
2304.0
32 (deep color) 250.0
300.0
510.0
1200.0
1500.0
1875.0
3072.0
Double buffer
Single buffer
External memory needed
72
F469 Features & Benefits
• Quad SPI interface (QSPI)
• NOR flash interface requiring a limited number of pins (5 pins in
single QSPI mode and 9 pins in dual mode QSPI)
• Fast and cost effective NOR flash extension available from the
lowest pin count MCU packages  lower BOM cost
• Dual quad SPI mode
• Double the throughput by accessing 2 external QSPI flash
memories in parallel
•
Possibile to have the QSPI Flash memory internally mapped
• Allowing to access the QSPI external Flash as an internal flash
and so avoiding all memory access overhead
• Non exclusive with the FMC
• Allowing to simplify an application using both external Flash
and external RAM.
73
F469 Features Benefits
• Upgraded USB connectivity
• Added Dedicated power rails supplying the 2 USB peripherals.
• Enables USB connectivity even when the MCU is supplied at 1.8V
• Link Power Mode (LPM)
• Compliant with USB IF specification
• Finer power management enabling significant power savings
74
Application exemples
Smart watch
Main application controller
Industrial/home automation
panel
75
STM32F469
Application example
No more DSI bridge needed
Saved cost: ~0.8$
Saved size: ~4.5x4.5 mm
USB
PHY
DSI
Bridge
RF
STM32F469
No more external USB PHY needed
Saved cost (including cristal): ~0.5$
Saved size: ~3.5x3.5 mm
External
Memory
Potentially, no more
external RAM needed
Depending on display resolution
Saved cost: ~0.6-0.7$
Saved size: ~8x13 mm
Sensors
76
STM32F469
Application exemple
No more DSI bridge needed
Saved cost: ~0.8$
Saved size: ~4.5x4.5 mm
DSI
Bridge
RF
1.8 V
3.3 V
DSI
Host
USB
PHY
USB
PHY
384KB
SRAM
QSPI
FMC
No more external USB PHY needed
Saved cost (including cristal): ~0.5$
Saved size: ~3.5x3.5 mm
External
Memory
Potentially, no more
external RAM needed
Depending on display resolution
Saved cost: ~0.6-0.7$
Saved size: ~8x13 mm
Sensors
77
STM32 F7 Series
Product highlights
High-performance platform
79
Access
STM32F401
STM32F411
• Entry level
• Dynamic efficiency
Foundation
STM32F205
STM32F207
STM32F405
Advanced
STM32F407
• Advanced Connectivity
• Security option
STM32F427
• Enhanced Graphic
• High memory density
• Security option
• High performance, rich connectivity, high integration, Dynamic Efficiency
• From 105DMIPs up to 225DMIPS, based on Cortex-M3 or M4 w/ FPU
• Over 300 part numbers with close pin-to-pin compatibility
STM32F429
High-performance platform Cortex M7
80
Access
Foundation
Advanced
STM32F749
STM32F401
STM32F411
• Entry level
• Dynamic efficiency
STM32F205
STM32F207
STM32F405
• Advanced Connectivity
• Security option
STM32F407
STM32F427
STM32F429
• Enhanced Graphic
• High memory density
• Security option
NEW STM32F746 is sampling at OEMs
428DMIPS/1000 Coremarks,
World’s 1st MCU based on new Cortex-M7 w/ FPU
High-performance platform
High
performance
with DSP and
FPU
High
performance
MCUs
STM32F429/39
STM32F427/37
STM32F207/217
STM32F205/215
STM32F407/417
STM32F405/415
STM32F401/411
Cortex-M3
Cortex-M4
Cortex-M7
STM32F746/56
STM32 F7 : World’s 1st Cortex-M7 based MCU
The smartest STM32 ever
• Twice the performance from internal and external memories :
• Create smarter and more responsive applications that were not possible before on
an MCU
• External memory interface with no performance penalty allowing unlimited
resources to fit the biggest code and data requirements
• A complete new set of peripherals
• Benefit from the latest features available in the STM32 portfolio
• Increase the performance, not the power consumption
• Bring innovation inside power constrained applications
Smartest STM32
Being smart is not about brain size, it is about connecting
the right amount of neurons at the right time.
STM32 F7 is built on the new state-of-art
ARM® Cortex®-M7 core
and
STM32 F7 is about ST’s art of combining
and interconnecting the right features
around Cortex-M7 core, to deliver the
smartest STM32 ever.
83
Smart-system architecture
for performance
• STM32 F7 uses 2 independent mechanisms to reach
0-wait execution performance:
• ST ART Accelerator™ for internal Flash memory
• L1 cache (4 Kbytes + 4 Kbytes instruction and data cache) for
external (or internal) memories
• AXI and Multi-AHB bus matrix with dual GP DMA
controllers and dedicated DMA controllers for Ethernet,
USB OTG HS and Chrom-ART graphic HW acceleration,
• Large SRAM with scattered architecture:
• 320 Kbytes including 240 Kbytes + 16 Kbytes on the bus matrix and
64 Kbytes of Data TCM RAM
• 16 Kbytes of instruction TCM RAM
• 4 Kbytes of backup SRAM
84
Smart Architecture – Use case
85
SDRAM,
QUADSPI,
NOR,
NAND
Legend: ITCM: Critical Code with deterministic execution
DTCM RAM: Critical real time data ( Stack, heap ..)
System SRAM: Concurrent data transfer CPU or DMA
External Memories: Quad SPI, and FMC for data manipulation or code execution
Record Performance
…Unleashed by STM32 F7 Silicon
ARM® data
Benchmark
Measured on STM32 F7
Silicon
Executing from
Embedded Flash
Executing from
External memory
Cortex-M4
Cortex-M7
CoreMark/MHz
3.4
5
5
DMIPS/MHz
1.25
2.14
2.14
• And : …
• Up to twice more DSP performance increase over Cortex-M4
• ARMv7-M architecture, 100% binary forwards compatibility from Cortex-M4
• STM32 F7 runs at FCPU = 200 MHz  5 x 200 = 1000 CoreMark
86
3/7
Record Performance
87
STM32 F4 = 608 CoreMark , STM32 F7 = 1000 CoreMark
More maths , more signal processing = Up to 2x DSP performance vs STM32 F4 series
CoreMark
1200
1000
800
1000 CoreMark
Cortex-M7
ST 90nm eFlash
600
400
200
608 CoreMark
398 CoreMark
Cortex-M4
ST 90nm eFlash
Cortex-M3
ST 90nm eFlash
0
120
180
200
MHz
Heavy 3D-vectorial computation benchmark
Demo from ST 1/2
• Heavy 3D-vectorial computation benchmark: Computes a complete picture
from equations to generate a 3D picture.
• Heavy vector computation based on floats (vector scaler, normalization…etc…)
• Calculation of reflection and refraction on the objects of the scene
• Highly recursive (each time an object is hit by a ray, new rays need to be computed for
reflection, refraction and lighting)
• Key performance enablers: FPU, ART Accelerator, L1 cache, memory interface
Ray tracing
algorithms are
perfect for
benchmarking
CPU computation
efficiency
88
Power Efficient
STM32 F7 power efficiency = STM32 F4 power efficiency
STM32 F7 Boosts performance, but does not compromise on power efficiency
Typ
current
STM32 F7
7 CoreMark/mW
at 1.8 V
-------
Low power modes
(leakages kept at the same level than STM32 F4)
STM32 F4
7 CoreMark/mW
at 1.8 V
Dynamic : RUN Mode*
120µA
Wake up time: 105μs
290µA
Wake up time: 22μs
2.2µA
3.1µA
Wake up time: 318μs
STOP
Mode
Standby Mode
w/o and w/ RTC
Legend: Measurements conditions depend on Room temperature
*Run mode Conditions: CoreMark executed from Flash, peripherals OFF
<1µA
VBAT Mode
w/o or w/ RTC
90
Innovation Now
Right balance of innovation and time-to-market
• Our priority: deliver innovative, upward compatible,
scalable STM32s on-time!
• STM32 F7 is designed around ST’s mass-productionready 90nm embedded Flash platform, best in class
:
• This 90nm e-Flash platform has enabled our STM32 F4 series to be
world’s highest performance Cortex-M based MCU (currently 608
CoreMark at 180 MHz). Refer to coremark.org
• Everyday MCU developers need to accelerate their
innovation pace.
Developers have no time to optimize. All their skills
must be devoted to innovation, differentiation, and
creativity.
• Computing, data/signal transfer and processing
• Large embedded and external memory resources with fast access
time, all packed inside a small single MCU.
Enjoy 1000 CoreMark now!
91
Powerful and scalable instruction set
• Cortex-M7 has the same powerful
instruction set as Cortex-M4
• MAC instructions are all single cycle
• SIMD instructions can work on 8-/16-bit
quantities packed in to a 32-bit word
• Arithmetic can be signed/unsigned,
saturating/unsaturating
From ARM®
92
Cortex-M7 Microcontroller positioning
From ARM®
93
STM32 F7 portfolio
Flash size (byte)
1M
512 K
STM32F756VG
STM32F756ZG
STM32F756IG
STM32F756BG
STM32F756NG
STM32F746VG
STM32F746ZG
STM32F746IG
STM32F746BG
STM32F746NG
STM32F756VE
STM32F756ZE
STM32F756IE
STM32F756BE
STM32F756NE
STM32F746VE
STM32F746ZE
STM32F746IE
STM32F746BE
STM32F746NE
Pin count
LQFP100
Legend:
LQFP144
WLCSP143
LQFP176
UFBGA176
without HW crypto/Hash coprocessor
LQFP208
TFBGA216
with HW crypto/Hash coprocessor
94
STM32 F7 block diagram
• NEW core: ARM Cortex-M7
• Up to 200 MHz, 428 DMIPS/1000 CoreMark
• Twice the DSP performance vs Cortex-M4 core
• New generation of Peripherals
• 2xSAI, 3xI2S half duplex, USB dedicated supply for
1.8 V operation, CEC, Quad SPI,SPDIF input, 4xI2C.
• Same packages as F429
• WLCSP143
• LQFP100,144,176,208
• BGA 176, 216
95
96
Thank you for your attention
Presentation Title
11/03/2016
ST Confidential
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