BOOSTXL-AUDIO Audio BoosterPack Plug

BOOSTXL-AUDIO Audio BoosterPack Plug

User's Guide

SLAU670 – March 2016

BOOSTXL-AUDIO Audio BoosterPack™ Plug-in Module

When plugged into a LaunchPad™ development kit, the BOOSTXL-AUDIO Audio BoosterPack™ Plug-in

Module adds audio input functionality from a microphone and audio output through an onboard speaker.

Headphone input and output are also supported, and are automatically enabled when a plug is inserted into the BoosterPack module. This audio input/output stream lets developers experiment with the digital signal processing (DSP) and filtering capabilities of the microcontroller found on the attached LaunchPad development kit.

Figure 1. BOOSTXL-AUDIO BoosterPack Plug-in Module

LaunchPad, BoosterPack, Code Composer Studio are trademarks of Texas Instruments.

IAR Embedded Workbench, C-SPY are registered trademarks of IAR Systems AB.

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Contents

Getting Started

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3

Hardware

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4

Software Examples

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7

Additional Resources

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10

Schematics

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List of Figures

BOOSTXL-AUDIO BoosterPack Plug-in Module

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BOOSTXL-AUDIO Overview

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BoosterPack Pinout

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Record

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Playback

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Alternate Microphone Configuration

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TI Resource Explorer Cloud

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CCS Cloud

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Directing the Project →Import Function to the Demo Project

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When CCS Has Found the Project

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Software Examples in TI Resource Explorer

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Schematics

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List of Tables

DAC8311 Pinout

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Microphone Pinout

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Hardware Change Log

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Software Examples

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IDE Minimum Requirements for MSP-EXP430FR5994

Source File and Folders

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Source File and Folders

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1 Getting Started

Getting Started

1.1

Introduction

When plugged into a LaunchPad development kit, the BOOSTXL-AUDIO Audio BoosterPack Plug-in

Module adds audio input functionality from a microphone and audio output through an onboard speaker.

Headphone input and output are also supported, and are automatically enabled when a plug is inserted into the BoosterPack module. This audio input/output stream lets developers experiment with the digital signal processing (DSP) and filtering capabilities of the microcontroller found on the attached LaunchPad development kit.

There are various options, selectable by a jumper on the BoosterPack module, for connecting the speaker to the processor on the LaunchPad development kit: (1) output audio data over SPI to the SPI DAC provided on the Audio BoosterPack module; (2) directly connecting to the DAC of the MCU on the

LaunchPad kit (if available) or (3) use the PWM output of the LaunchPad kit together with a basic R/C filter on the BoosterPack module to create a simple low-cost analog audio signal.

1.2

Key Features

• TI DAC8311 14-bit digital-to-analog converter for high-quality audio output

• Onboard low-profile speaker

• Onboard microphone with front-end amplifier

• Volume control slider

• TI TS3A225E for autonomous headset type detection which supports 4-pin or 3-pin 3.5-mm audio jack headset

• 40-pin BoosterPack plug-in module standard for use with any LaunchPad development kit

1.3

What’s Included

1.3.1

Kit Contents

• 1 x BOOSTXL-AUDIO BoosterPack plug-in module

• 1 x Quick start guide

1.3.2

Software Examples

• MSP-EXP430FR5994 LaunchPad development kit + BOOSTXL-AUDIO demos (see

Section 3

)

– BOOSTXL-AUDIO_RecordPlayback_MSP430FR5994

– Signal Processing with LEA TI Design

1.4

Next Steps: Looking Into the Provided Code

After the EVM features have been explored, the fun can begin. It’s time to open an integrated development environment (IDE) and start looking at the code examples.

Section 3

describes the example projects available to make it easy to understand the provided software. For more information on where to find and download an IDE, see

Section 4

.

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Hardware

2 Hardware

Figure 2

shows an overview of the BoosterPack plug-in module hardware.

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Figure 2. BOOSTXL-AUDIO Overview

2.1

Hardware Features

2.1.1

BoosterPack Pinout

Figure 3

shows the pinout of this BoosterPack module.

Figure 3. BoosterPack Pinout

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Hardware

The audio signal processing BoosterPack kit adheres to the 40-pin LaunchPad and BoosterPack pinout standard. This standard was created to aid compatibility between LaunchPad development kit and

BoosterPack module tools across the TI ecosystem.

The 40-pin standard is compatible with the 20-pin standard that is used by other LaunchPad kits like the

MSP-EXP430G2 LaunchPad development kit. This allows for 40-pin BoosterPack modules to be used with 20-pin LaunchPad kits with some limited functionality.

The BOOSTXL-AUDIO supports BoosterPack module stacking with its male and female BoosterPack headers. See how many BoosterPack modules you can stack onto your LaunchPad development kit to add more functionality like wireless and battery power.

More information about compatibility can also be found at http://www.ti.com/launchpad .

2.1.2

Audio Output

There are three options to select how the audio output is generated: the onboard TI DAC8311 digital-toanalog converter (DAC), a built-in DAC on the LaunchPad development kit, or a PWM that generates audio out. Select an option by moving the J5 jumper.

2.1.2.1

TI DAC8311 14-Bit Digital-to-Analog Converter

The DAC8311 is a 14-bit low-power single-channel linear-voltage-output DAC. This DAC uses a 3-wire serial interface that operates at clock rates of up to 50 MHz and is compatible with standard SPI, QSPI,

Microwire, and digital signal processor (DSP) interfaces (see

Table 1 ). The reference designator for the

DAC8311 is U2. Move jumper J5 to the SPI DAC location to use the DAC8311 to generate the audio signal.

More information on the DAC8311 DAC can be found at http://www.ti.com/product/dac8311 .

Table 1. DAC8311 Pinout

BoosterPack Header Connection

J1.8

J1.9

J5.10

Pin Function

DAC8311 Sync

SPI SCLK

SPI MOSI

2.1.2.2

DAC Integrated on LaunchPad Development Kit

If the LaunchPad development kit that the user has selected has an integrated DAC that is pinned out to the BoosterPack headers (for example, the MSP-EXP430FR5994), this DAC can be used to generate audio for the BOOSTXL-AUDIO BoosterPack plug-in module. The DAC output pin is J3.30 for the output of the onboard DAC on the LaunchPad development kit. Move jumper J5 to the LP DAC location to use the onboard DAC of the LaunchPad development kit to generate the audio signal.

2.1.2.3

PWM Audio

A varying duty-cycle PWM can also generate audio. See Voice Band Audio Playback using a PWM DAC

TI-Design for more information. Move jumper J5 to the PWM location to configure the audio input when using a PWM to generate the audio signal. Two pins can be used to drive the PWM audio: J2.19 (default) and J4.39 (alternate). To configure the BoosterPack module to use the alternate PWM pin, move the 0Ω resistor on R9 to R10.

2.1.3

TI TS3A225E Audio Jack Detection

The TS3A225E is an audio-headset switch device. This device detects the presence of a headset and an analog microphone and switches a system analog microphone pin between different connectors in an audio stereo jack. The microphone connection in a stereo connector can be swapped with the ground connection depending on manufacturer. When the TS3A225E detects a certain configuration, the device automatically connects the microphone line to the appropriate pin. The device also reports the presence of an analog microphone on an audio stereo jack. The reference designator for the TS3A225E is U1.

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Hardware

For more information on the TS3A225E autonomous audio switch with headset detection, see http://www.ti.com/product/TS3A225E .

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2.1.4

Microphone With Front-End Amplifier

The PUI POM-2242P-C33-R omnidirectional microphone utilizes a TI TLV2760 operational amplifier to boost the output of the microphone. The human ear can hear frequencies of 0 to 20 kHz, and the operating range of the microphone is 20 Hz to 20 kHz. The reference designator for the microphone is

MIC1, and the reference designator for the TLV2760 is U5. The microphone can also be powered on and off from GPIO pin J1.5 (default) or J4.31 (alternate) (see

Table 2

). To configure the microphone for its alternate pins, move the 0Ω resistors on R1 and R4 to R3 and R5, respectively.

For more information on the microphone, see http://www.puiaudio.com/pdf/pom-2242p-c33-r.pdf

.

Table 2. Microphone Pinout

(1)

BoosterPack Header Connection

J1.6

Pin Function

Microphone Output

J1.5

J3.26

(1)

J4.31

(1)

Microphone Power

Alt Microphone Output

Alt Microphone Power

The alternate microphone output and power are required if also using the Sharp LCD BoosterPack plug-in module.

2.1.5

Onboard Loudspeaker

The onboard loudspeaker is a PUI ASE03008MR-LW150-R with reference designator S1. It is driven by an onboard audio amplifier, the TI TPA301, which has reference designator U4. The TPA301 is a bridgetied load (BTL) audio power amplifier developed for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250 mW of continuous power into a BTL

8-ohm load at less than 1% total harmonic distortion plus noise throughout voice-band frequencies. The

TPA301 also uses a GPIO for turning on and off the amplifier using software through pin J2.13 (default) or

J4.38 (alternate). To configure the amplifier on and off switch to use J4.38, move the 0Ω resistor on R6 to

R8.

For more information on the loudspeaker, see http://www.puiaudio.com/pdf/ASE03008MR-LW150-R.pdf

.

2.2

Power

The board is designed to be powered by the attached LaunchPad development kit and requires 3.3 V.

2.3

Design Files

2.3.1

Hardware

See

Section 5

for the schematics. All design files including schematics, layout, bill of materials (BOM),

Gerber files, and documentation are available on the BOOSTXL-AUDIO Hardware Design Files on the download page .

2.3.2

Software

All design files including TI-TXT object-code firmware images, software example projects, and documentation are available in the software folder that is specific to each LaunchPad development kit. To determine which LaunchPad development kits feature BOOSTXL-AUDIO examples, visit the download page .

2.3.3

Quick Start Guide

See the

BOOSTXL-AUDIO BoosterPack Plug-in Module Quick Start Guide

for an overview of this

BoosterPack plug-in module and help getting started.

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2.4

Hardware Change Log

Table 3

lists the revision history of the BOOSTXL-AUDIO hardware releases.

Table 3. Hardware Change Log

PCB Revision

Rev 1.0

Initial Release

Description

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Hardware

3 Software Examples

Two software examples are included with the MSP-EXP430FR5994 LaunchPad development kit for the

Audio BoosterPack module (see

Table 4

). These examples can be found in the MSP-EXP430FR5994

Software Examples zip folder.

Demo Name

BOOSTXL-AUDIO_

RecordPlayback_MSP430FR5994 tidm-filtering-signalprocessing-lea

Table 4. Software Examples

LaunchPad and

BoosterPack Required

• MSP-EXP430FR5994

• BOOSTXL-AUDIO

• MSP-EXP40FR5994

• BOOSTXL-AUDIO

• 430BOOST-SHARP96

Description

Demonstrates how to record and playback audio from FRAM memory using DMA

Demonstrates the performance of the MSP

Low Energy Accelerator (LEA_SC) by performing FFT and FIR

More Details

Section 3.1

Section 3.2

To use any of the software examples with the LaunchPad development kit, you must have an integrated development environment (IDE) that supports the MSP430FR5994 device.

Table 5

lists the minimum IDE requirements.

Table 5. IDE Minimum Requirements for MSP-EXP430FR5994

Code Composer Studio™ IDE

CCS v6.1.3 or later

IAR Embedded Workbench

®

IDE

IAR Embedded Workbench for Texas Instruments 430 6.40 or later

For more details on how to get started quickly and where to download the latest CCS, IAR, see

Section 4

.

3.1

BOOSTXL-AUDIO_RecordPlayback_MSP430FR5994

This section describes the functionality and structure of the BOOSTXL-

AUDIO_RecordPlayback_MSP430FR5994 demo that is included in the MSP-EXP430FR5994 Software

Examples download or is more easily accessible through MSPWare (see

Section 4.6

).

3.1.1

Source File Structure

The project is split into multiple files (see

Table 6

). This makes it easier to navigate and reuse parts of it for other projects.

Name

main.c

application/application.c

application/audio_collect.c

application/audio_playback.c

application/dac8311.c

application/global.h

Library: driverlib

Table 6. Source File and Folders

Description

The demo’s clock, GPIO, DAC and interrupt configurations.

Main application loop and interrupt service routines

Setup, start, stop and shutdown audio collect functions

Setup, start and stop playback functions and interrupt service routines

Operating modes or functions of the onboard SPI DAC

Global variables definitions

Device driver library ( MSP Driver Library )

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Software Examples

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3.1.2

Operation

This demo uses the built-in ADC12 on the MSP430FR5994 to sample from the output of the analog microphone on the Audio BoosterPack module. Using direct memory access (DMA), the 12-bit microphone data is stored to and retrieved from FRAM memory. During playback, the microphone data is sent through SPI to the onboard DAC to drive the audio output of the onboard speaker or headphones.

To begin recording an audio sample, press switch S1 on the MSP-EXP430FR5994 LaunchPad development kit(see

Figure 4

). LED1 is on while audio is being recorded, and it turns off when the recording phase is complete. You can also use headphones with an inline microphone to record audio.

The BoosterPack module automatically detects the inline microphone when the headphones are plugged into the provided jack (J6) and records from it instead of the onboard microphone.

Figure 4. Record

To play the recorded audio sample, press switch S2 on the MSP-EXP430FR5994 LaunchPad development kit (see

Figure 5 ). LED2 turns on during playback and turns off when the playback phase is

complete. You can use headphones to listen to the audio playback by plugging headphones into the provided jack (J6).

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Software Examples

Figure 5. Playback

3.2

Filtering and Signal Processing With LEA_SC TI Design

This section describes the functionality and structure of the tidm-filtering-signalprocessing-lea demo that is included in the MSP-EXP430FR5994 Software Examples download, or more easily accessible through

MSPWare (see

Section 4.6

).

3.2.1

Source File Structure

The project is split into multiple files (see

Table 7

). This makes it easier to navigate and reuse parts of it for other projects.

Name

main.c

application/application.c

application/audio_collect.c

application/audio_playback.c

application/dac8311.c

application/global.h

application/fir.c

application/FFT.c

application/FFT_430.asm

application/benchmark.c

application/fir_coefficient

Library: DSPLib

Library: grlib

Library: driverlib

Table 7. Source File and Folders

Description

The demo’s clock, GPIO, display and interrupt configurations.

Main application loop and interrupt service routines

Setup, start, stop and shutdown audio collect functions

Setup, start and stop playback functions and interrupt service routines

Operating modes/functions of the onboard SPI DAC

Global variables definitions

FIR filtering functions

Fast Fourier Transform filtering functions

MSP430™ Fast Fourier Transform filtering functions in assembly

Performance benchmark timer and interrupt service routines

FIR coefficient definitions

MSP430 DSP Library

MSP430 Graphics Library

Device driver library ( MSP Driver Library )

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Additional Resources

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3.2.2

Operation

This demo is a TI Design that highlights the signal processing capabilities and performance of the

MSP430FR5994 MCU and its integrated Low Energy Accelerator (LEA). This example also uses the

430BOOST-SHARP96 BoosterPack module to display the filtered output of the audio signal and act as a user interface. To use this code example, configure the Audio BoosterPack module to use its alternate microphone power and output pins by moving the 0Ω resistors on R1 to R3 and R4 to R5 (see

Figure 6 ).

For more information on this example, visit the TI Design page at http://www.ti.com/tool/tidm-filteringsignalprocessing .

Figure 6. Alternate Microphone Configuration

4 Additional Resources

4.1

TI LaunchPad Development Kit Portal

More information about LaunchPad development kits, supported BoosterPack plug-in modules, and available resources can be found at:

• TI LaunchPad portal : information about all LaunchPad development kits from TI, for all microcontrollers

4.2

TI Cloud Development Tools

TI cloud-based software development tools provide instant access to MSPWare software content and a web-based IDE.

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Additional Resources

4.2.1

TI Resource Explorer Cloud

TI Resource Explorer Cloud (see

Figure 7 ) provides a web interface for browsing the examples, libraries,

and documentation that are found in the MSPWare software without having to download files to your local drive.

Go check out TI Resource Explorer Cloud now at https://dev.ti.com/ .

Figure 7. TI Resource Explorer Cloud

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Additional Resources

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4.2.2

Code Composer Studio Cloud IDE

Code Composer Studio Cloud (CCS Cloud) IDE (see

Figure 8

) is a web-based IDE that enables you to quickly create, edit, build, and debug applications for a LaunchPad development kit. No need to download and install large software packages, simply connect the LaunchPad development kit and begin. You can select from a large variety of examples in MSPWare software and Energia or develop your own application. CCS Cloud IDE supports debug features such as execution control, breakpoints and viewing variables.

A full comparison between CCS IDE Cloud and CCS Desktop is available here .

Go check out Code Composer Studio Cloud IDE now at https://dev.ti.com/ .

Figure 8. CCS Cloud

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Additional Resources

4.3

Code Composer Studio IDE

Code Composer Studio IDE Desktop is a professional integrated development environment that supports

TI's microcontroller and embedded processor portfolio. Code Composer Studio IDE comprises a suite of tools that are used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build environment, debugger, profiler, and many other features.

Learn more about CCS and download it at http://www.ti.com/tool/ccstudio .

CCS IDE v6.1 or higher is required. When CCS has been launched, and a workspace directory chosen, use Project →Import Existing CCS Eclipse Project. Direct the wizard to the desired demo project directory that contains main.c (see

Figure 9 ).

Figure 9. Directing the Project →Import Function to the Demo Project

Selecting the \CCS subdirectory also works. The CCS-specific files are located there.

When you click OK, the CCS IDE should recognize the project and allow you to import it. The indication that CCS has found it is that the project appears in the box shown in

Figure 10 , and it has a checkmark to

the left of it.

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Additional Resources

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Figure 10. When CCS Has Found the Project

Sometimes the CCS IDE finds the project but does not show a checkmark. This might mean that the workspace already has a project by that name. Resolve this by renaming or deleting that project. Even if you do not see it in the CCS IDE workspace, be sure to check the workspace directory on the file system.

4.4

IAR Embedded Workbench for MSP430

IAR Embedded Workbench for MSP430 MCUs is another very powerful integrated development environment that allows you to develop and manage complete embedded application projects. It integrates the IAR C/C++ Compiler, IAR Assembler, IAR ILINK Linker, editor, project manager, command line build utility, and IAR C-SPY

®

Debugger.

Learn more about IAR Embedded Workbench for MSP430 and download it at http://supp.iar.com/Download/SW/?item=EW430-EVAL .

IAR 6.10 or higher is required. To open the demo in IAR, click File

→Open→Workspace…, and browse to the *.eww workspace file inside the \IAR subdirectory of the desired demo. All workspace information is contained within this file.

The subdirectory also has an *.ewp project file. This file can be opened into an existing workspace by clicking Project →Add-Existing-Project….

Although the software examples have all of the code required to run them, IAR users may download and install MSPWare software, which contains MSP430 MCU libraries and the TI Resource Explorer. By default, these are included in a Code Composer Studio installation.

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Additional Resources

4.5

Energia

Energia is a simple open-source community-driven code editor that is based on the Wiring and Arduino framework. Energia provides unmatched ease of use through very high-level APIs that can be used across hardware platforms. Energia is a light-weight IDE that does not have the full feature set of Code

Composer Studio IDE or IAR Embedded Workbench IDE. However, Energia is great for anyone who wants to get started very quickly or who does not have significant coding experience.

Learn more about Energia and download it at www.energia.nu

.

4.6

MSPWare Software and TI Resource Explorer

MSPWare software is a complete collection of libraries and tools. It includes a driver library (driverlib), graphics library (grlib), and many other software tools. MSPWare software is optionally included in a CCS installation or can be downloaded separately. IAR users must download it separately.

MSPWare software includes the TI Resource Explorer, for easily browsing tools. For example, all of the software examples are shown in the tree (see

Figure 11 ).

Figure 11. Software Examples in TI Resource Explorer

Inside TI Resource Explorer, these examples and many more can be found and easily imported into Code

Composer Studio IDE with one click.

4.7

The Community

4.7.1

TI E2E™ online community

Search the forums at http://e2e.ti.com

. If you cannot find an answer, post your question to the community.

4.7.2

Community at Large

Many online communities focus on the LaunchPad development kit and BoosterPack plug-in module ecosystem. One example is http://www.43oh.com

. You can find additional tools, resources, and support from these communities.

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Schematics

5 Schematics

Figure 12

shows the schematics. All hardware design files are included in the BOOSTXL-AUDIO Hardware Design Files .

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Figure 12. Schematics

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1.

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1.1

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1.2

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2.2

TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM.

2.3

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Regulatory Notices:

3.1

United States

3.1.1

Notice applicable to EVMs not FCC-Approved:

This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.

3.1.2

For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.

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Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

FCC Interference Statement for Class B EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada

3.2.1

For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210

Concerning EVMs Including Radio Transmitters:

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:

(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Concernant les EVMs avec appareils radio:

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.

Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur

3.3 Japan

3.3.1

Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2

Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of

Japan to follow the instructions below with respect to EVMs:

1.

Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for

Enforcement of Radio Law of Japan,

2.

Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to

EVMs, or

3.

Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて

いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの

措置を取っていただく必要がありますのでご注意ください。

1.

電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。

2.

実験局の免許を取得後ご使用いただく。

3.

技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。

上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ

ンスツルメンツ株式会社

東京都新宿区西新宿6丁目24番1号

西新宿三井ビル

3.3.3

Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ

い。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

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4

EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT

LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:

4.3.1

User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.

During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm.

4.3.2

EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.

User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements.

5.

Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free.

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6.

Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE

DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER

WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED

WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY

THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND

CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY

OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD

PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY

INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF

THE EVM.

7.

USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS

LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,

EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY

HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION

SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY

OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8.

Limitations on Damages and Liability:

8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE

TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS

BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED

TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS

OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,

LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL

BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION

ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM

PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER

THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE

OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND

CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9.

Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.

Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2015, Texas Instruments Incorporated spacer

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

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