TB2996HQ
Bi-CMOS Linear Integrated Circuit Silicon Monolithic
TB2996HQ
Maximum Power 49 W BTL × 4ch Audio Power Amp IC
1.
Description
The TB2996HQ is a power IC with built-in four-channel BTL
amplifier developed for car audio application. The maximum
output power POUT is 49 W using a pure complementary P-ch and
N-ch DMOS output stage.
In addition, a standby switch, a mute function, output offset
voltage detector and various protection features are included.
2.
Applications
Weight: 7.7 g (typ.)
Power Amp IC developed for car audio applications.
3.
Features
High output power, low distortion, and low noise property (for details, refer to the Table 1 Typical
Characteristics).
• Built-in detecting output offset voltage and shorted to GND
(Pin25)
• Built-in muting function. (Pin22)
• Built-in auto muting functions (for low Vcc and stand-by
sequence)
Table 1 Typical Characteristics
(Note1)
Test condition
• Built-in standby switch. (Pin4)
Typ.
Unit
Output power (POUT)
• Built-in 6v operation and start stop cruising circuit
• Built-in various protection circuits (thermal shut down,
over-voltage, short to GND, short to VCC, and output to output
short)
VCC = 15.2 V, JEITA max
49
VCC = 14.4V, JEITA max
44
VCC = 14.4V,THD = 10%
29
THD = 10%
24
W
Total harmonic distortion (THD)
POUT = 4 W
0.006
%
Output noise voltage (VNO) (Rg = 0 Ω)
Filter : DIN AUDIO
50
µV
Operating Supply voltage range (VCC)
RL = 4 Ω
6～18
RL = 2 Ω
6～16
V
Note1: Typical test conditions : VCC = 13.2 V, f = 1 kHz, RL = 4 Ω, GV = 26 dB, Ta = 25°C; unless otherwise specified.
Note2: Rg = signal source resistance
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20
VCC1
11
IN1
C1: 0.22 µF
9
8
C1: 0.22 µF
IN2
7
AC-GND
12
Pre-GND
2
13
C1: 0.22 µF IN3
15
AC-GND
C6: 1 µF
5
3
AC-GND
17
18
16
19
AC-GND
5V
Play
MUTE
C1: 0.22 µF IN4
14
21
VMUTE
R1: 47 kΩ
LPF
24
22
23
AC-GND
25 Offset/Short
DET
4
VCC
C3
6
VCC2
C5
1
TAB
0.1 µF
10
3900 µF
C2
Ripple
10 µF
Block Diagram
C4: 1 µF
4.
OUT1 (+)
PW-GND1
RL = 4Ω
OUT1 (−)
OUT2 (+)
PW-GND2
RL = 4Ω
OUT2 (−)
OUT3 (+)
PW-GND3
RL = 4Ω
OUT3 (−)
OUT4 (+)
PW-GND4
RL = 4Ω
OUT4 (−)
STBY
Some of the functional blocks, circuits or constants labels in the block diagram may have been omitted or simplified
for clarity.
In the following explanation, a "channel" is a circuit which consists of INx, OUTx (+), OUTx (-), and PW-GNDx. (x:1
to 4)
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5.
Pin Configuration and Function Descriptions
5.1 Pin Configuration (top view)
DET
PW-GND4
OUT4(－)
MUTE
OUT4(＋)
VCC1
OUT3(－)
PW-GND3
OUT3(＋)
AC-GND
IN3
IN4
Pre－GND
IN2
IN1
Ripple
OUT１(＋)
PW-GND1
OUT1(－)
VCC2
OUT2(＋)
STBY
OUT2(－)
PW-GND2
TAB
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5.2
Pin Function Descriptions
Pin
Symbol
I/O
1
TAB
―
Ground (TAB)
2
PW-GND2
―
Ground for OUT2
3
OUT2(-)
OUT
OUT2(-) output
4
STBY
VST-IN
Standby voltage input
5
OUT2(+)
OUT
OUT2(+) output
6
VCC2
VCC-IN
Supply voltage 2
7
OUT1(-)
OUT
OUT1(-) output
8
PW-GND1
―
Ground for OUT1
9
OUT1(+)
OUT
OUT1(+) output
10
Ripple
―
Ripple voltage
11
IN1
IN
OUT1 input
12
IN2
IN
OUT2 input
13
Pre-GND
―
Signal ground
14
IN4
IN
OUT4 input
15
IN3
IN
OUT3 input
16
AC-GND
―
Common reference voltage for all input
17
OUT3(+)
OUT
OUT3(+) output
18
PW-GND3
―
Ground for OUT3
19
OUT3(-)
OUT
OUT3(-) output
20
VCC1
VCC-IN
Supply voltage 1
21
OUT4(+)
OUT
OUT4(+) output
22
MUTE
VmuteIN
Mute voltage input
23
OUT4(-)
OUT
OUT4(-) output
24
PW-GND4
―
Ground for OUT4
25
DET
(OC)
Note1
Description
Offset detector output / Out to GND short detector
Note1：OC means are open collector output
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6
20
VCC2
VCC1
11
IN1
C1: 0.22 µF
9
8
C1: 0.22 µF
IN2
7
AC-GND
12
5
2
Pre-GND
13
C1: 0.22 µF IN3
15
AC-GND
C6: 1 µF
3
AC-GND
17
18
16
19
AC-GND
Play
21
VMUTE
R1: 47 kΩ
C4: 1 µF
5V
C1: 0.22 µF IN4
14
MUTE
LPF
24
22
23
AC-GND
25 Offset/Short
Det
Component
Recommended
Name
Value
C1
0.22 μF
C2
10 μF
C3
Pin
4
Purpose
VCC
C3
1
TAB
C5
10
0.1 µF
C2
Ripple
3900 µF
Functional Description
10 µF
6.
OUT1 (+)
PW-GND1
RL = 4 Ω
OUT1 (−)
OUT2 (+)
PW-GND2
RL = 4 Ω
OUT2 (−)
OUT3 (+)
PW-GND3
RL = 4 Ω
OUT3 (−)
OUT4 (+)
PW-GND4
RL = 4 Ω
OUT4 (−)
STBY
Effect (Note1)
Lower than Recommended Value
Higher than Recommended Value
To eliminate DC
Cut-off frequency becomes higher
Cut-off frequency becomes lower
Ripple
To reduce ripple
Turn on/off time shorter
Turn on/off time longer
0.1 μF
VCC1,
VCC2
To provide sufficient
oscillation margin
Reduces noise and provides sufficient oscillation margin
C6
1 μF
AC-GND
Common reference
voltage for all input
Pop noise is suppressed when C1: C6 = 1:4. (Note2)
C5
3900 μF
VCC1,
VCC2
Ripple filter
Power supply ripple filtering
R1 / C4
47kΩ / 1 μF
MUTE
INx
(x:1 to 4)
Mute ON/OFF
Pop noise becomes larger
Smooth switching
Switching time becomes longer
Note1: When the unrecommended value is used, please examine it enough by system evaluation.
Note2: Since “AC-GND” pin is a common reference voltage for all input, this product needs to set the ratio of an input
capacitance (C1) and the AC-GND capacitance (C6) to 1:4
Note3: Use the low leak current capacitor for C1 and C6.
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7.
Standby Function (Pin 4)
The power supply can be turned on or off via
pin 4 (STBY). The threshold voltage of pin 4 is
below table. The power supply current is about
0.01 µA (typ.) in the standby state.
Power
ON
4
OFF
to Bias
Standby Control Voltage (VSB): Pin 4
STBY
Power
VSB (V)
ON
OFF
0~0.9
OFF
ON
2.2~VCC
Figure 1 Internal circuit for standby
Benefits of the Standby Switch
VCC can be directly turned on or off by a microcontroller, eliminating the need for a switching relay.
Since the control current is minuscule, a low-current-rated switching relay can be used.
Relay
High-current-rated switch
Battery
VCC
Battery
From
microcontroller
VCC
– Conventional Method –
Low-current-rated switch
Battery
Standby
From microcontroller
Battery
Standby
VCC
VCC
– Using the Standby Switch –
Figure 2 Standby Switch
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Mute Function (pin 22)
The audio mute function is enabled by setting pin 22 Low. R1 and C4 determine the time constant of the
mute function. The time constant affects pop noise generated when power or the mute function is turned on
or off; thus, it must be determined on a per-application basis. (Refer to Figures 3 and 4.)
The value of the external pull-up resistor is determined, based on pop noise value.
For example :
when the control voltage is changed from 5V to 3.3V, the pull-up resistor should be: 3.3V/5V×47 kΩ=31kΩ
ATT (dB)
ATT – VMUTE
Mute attenuation
8.
5V
R1
22
C4
1 kΩ
Mute
ON/OFF
control
Pin 22 Control voltage : VMUTE
Figure 3 Mute Function
(V)
Figure 4 Mute Attenuation − VMUTE (V)
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9.
Auto Muting Functions
The TB2996HQ has two automatic mute function.
a) Low Vcc Mute
b) Stand-by Off Mute.
9.1 Low Vcc Mute
When the supply voltage became lower than about 5.5V (Typ), The TB2996HQ operates the mute circuit
automatically. This function prevents the large audible transient noise which is generated by low Vcc
9.2 Standby-Off Mute
The TB2996HQ operates the mute circuit during the standby-off transition. When the ripple voltage
reached Vcc/5, the standby-off mute is terminated. The external mute has to be ON till the internal
mute-OFF.
Ripple terminal voltage
Standby OFF
Ripple voltage
Vcc/5 →
t
Standby Off transition
(Mute-ON)
Tmute＜500ms Vcc=13.2V
Normal operation (mute-OFF)
Figure 5 standby-Off Mute
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10. Output DC Offset Detection
10.1
Offset circuit explanation
Offset Circuit This function detects the offset voltage between OUT(+) and OUT(-). The detection result is
gotten by pin25.
The result of detection does not judge the abnormal offset or not. This function detects only the offset
voltage which is decided by specification.
Positive DC offset (+)
(caused by RS1)
V
VCC/2 (normal DC voltage)
Leakage current
or short-circuit
Vref
Negative DC offset (−)
(caused by RS2)
+
RS1
Vref/2
RS2
Elec. vol
Vbias
5V
−
25
LPF
A
B
To a microcontroller
The microcontroller shuts down
the system if the output is lower
than the specified voltage.
Irregular offset occurred
VTH
t
Output
waveform
0
-VTH
VST
Offset detector
output pin 1
0
Volume down
Judgement
VST
Waveform
LPF output
0
Detection delay time
Figure 6
Waiting time for Prevention
misjudgement
The detected result and audio output waveform
10.2 Outputshort detector
TB2996HQ has output shorting detector.
In case of shorting output to VCC/GND or over voltage power supplied, NPN transistor is turned on.
In case of shorting output to output NPN Tr. is turned on and off in response to the input signal voltage.
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11. Protection Functions
This product has internal protection circuits such as thermal shut down, over-voltage, out to VCC, out to
GND, and out to out short circuit protections.
(1)
Thermal shut down
It operates when junction temperature exceeds 150°C (typ.).
When it operates, it is protected in the following order.
1.
2.
3.
An Attenuation of an output starts first and the amount of attenuation also increases according
to a temperature rising,
All outputs become in a mute state, when temperature continues rising in spite of output
attenuation.
Shutdown function starts, when a temperature rise continues though all outputs are in a mute
state.
In any case if temperature falls, it will return automatically.
(2)
Over-voltage
It operates when voltage exceeding operating range is supplied to VCC pin. If voltage falls, it will
return automatically. When it operates, all outputs bias and high-side switch are turned off and all
outputs are intercepted. Threshold voltage is 23V(Typ.)
(3)
Short to VCC, Short to GND, Output to output short
It operates when each output pin is in irregular connection and the load line goes over the SOA of
power transistor (DMOS). When it operates, all outputs bias circuits are turned off and all outputs are
intercepted. If irregular connection is canceled, it will return automatically.
Note 1: When the current phase shifts widely, the protection will operate for the capacitor etc are connected with
the output. Please confirmation to use enough by using your testing board etc.
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12. Absolute Maximum Ratings
(Ta = 25°C unless otherwise specified)
Characteristics
Condition
Symbol
Rating
Unit
max0.2s
VCC (surge)
50
V
supply voltage (DC)
VCC (DC)
25
V
supply voltage (operation)
VCC (opr)
18
V
supply voltage (surge)
output current (peak)
IO (peak)
9
A
PD
125
W
Operating temperature range
Topr
-40 to 85
°C
Storage temperature
Tstg
-55 to 150
°C
power dissipation
(Note)
Note: Package thermal resistance Rth(j-t) = 1°C/W (typ.) (Ta = 25°C, with infinite heat sink)
The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not
be exceeded during operation, even for an instant.
If any of these rating would be exceeded during operation, the device electrical characteristics may be irreparably
altered and the reliability and lifetime of the device can no longer be guaranteed. Moreover, these operations with
exceeded ratings may cause break down, damage, and/or degradation to any other equipment. Applications using
the device should be designed such that each maximum rating will never be exceeded in any operating conditions.
Before using, creating, and/or producing designs, refer to and comply with the precautions and conditions set forth
in this document.
Allowable Power Dissipation PD (MAX)（W）
12.1 Power Dissipation
PD (max) – Ta
120
(1) Infinite heat sink
Rth(j-t) = 1°C/W
100
(2) Heat sink (Rth(HS) = 3.5°C/W)
Rth(j-t) + Rth(HS) = 4.5°C/W
(3) No heat sink
80
Rth(j-a) = 39°C/W
(1)
60
40
20
(2)
(3)
0
0
25
50
75
Ambient Temperature
100
Ta
125
150
(°C)
13. Operating Ranges
Characteristics
Supply voltage
Symbol
VCC
Condition
Min
Typ
Max
Unit
RL=4Ω
6
---
18
V
RL=2Ω
6
---
16
V
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14. Electrical Characteristics
(VCC = 13.2 V, f = 1 kHz, RL = 4 Ω, Ta = 25°C unless
Characteristics
Quiescent supply current
Output power
Output power(RL=2Ω)
Symbol
Min
Typ.
Max
Unit
VIN = 0
―
200
320
mA
POUT MAX (1)
VCC = 15.2 V, MAX POWER
―
49
―
POUT MAX (2)
VCC = 14.4 V, MAX POWER
―
44
―
POUT MAX (3)
VCC = 13.7 V, MAX POWER
―
40
―
POUT (1)
VCC = 14.4 V, THD = 10%
―
29
―
POUT (2)
THD = 10%
21
24
―
POUT MAX (4)
VCC = 14.4 V, MAX POWER
―
80
―
POUT MAX (5)
VCC = 13.7 V, MAX POWER
―
73
―
ICCQ
Test Condition
otherwise specified)
W
W
POUT (3)
VCC = 14.4 V, THD = 10%
POUT (4)
THD = 10%
―
45
―
THD
POUT = 4 W
―
0.006
0.07
%
GV
VOUT = 0.775 Vrms
25
26
27
dB
Channel-to-channel voltage gain
∆GV
VOUT = 0.775 Vrms
−1.0
0
1.0
dB
Output noise voltage
VNO
Rg = 0 Ω, BW=20Hz to 20KHz
―
50
70
µV
Ripple rejection ratio
R.R.
fRIP = 100 Hz, Rg = 620 Ω
VRIP = 0.775 Vrms
60
70
―
dB
Crosstalk
C.T.
Po = 4W, Rg = 620 Ω,
―
80
―
dB
Total harmonic distortion
Voltage gain
46
(note1)
VOFFSET
―
−90
0
90
mV
Input resistance
RIN
―
―
90
―
kΩ
Standby current
ISTBY
VSTB = 0V,V22=0
―
0.01
1
µA
Mute attenuation
ATT M
MUTE: ON
VOUT = 7.75 Vrms → MUTE: OFF
85
100
―
dB
VSB H
POWER : ON
2.2
―
VCC
VSB L
POWER : OFF
0
―
0.9
VM H
MUTE : OFF
2.2
―
VCC
VM L
MUTE : ON , R1 = 47 kΩ
0
―
0.9
±1.0
±1.5
±2.0
V
100
500
mV
Output offset voltage
Standby control voltage
Mute control voltage
Offset detection threthold voltage
Terminal 25 saturation voltage
Note 1 :
Vosdet
P25-Sat
Rpull-up = 47 kΩ, +V= 5.0 V
Reference of Vout DC voltage
Rpull-up = 10 kΩ, +V = 5.0 V
P25 is LOW at the detective.
V
V
fRIP : repple frequency
Note2： VRIP : Ripple signal voltage ( AC fluctuations in the power supply )
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20
VCC1
11
IN1
C1: 0.22 µF
9
8
C1: 0.22 µF
IN2
7
AC-GND
12
Pre-GND
2
13
C1: 0.22 µF IN3
15
AC-GND
C6: 1 µF
5
3
AC-GND
17
18
16
19
AC-GND
Play
MUTE
21
VMUTE
R1: 47 kΩ
C4: 1 µF
5V
C1: 0.22 µF IN4
14
LPF
24
22
23
AC-GND
25 Offset/Short
Det
4
VCC
C3
6
VCC2
C5
1
TAB
0.1 µF
10
3900 µF
C2
Ripple
10 µF
15. Test Circuit
OUT1 (+)
PW-GND1
RL = 4Ω
OUT1 (−)
OUT2 (+)
PW-GND2
RL = 4Ω
OUT2 (−)
OUT3 (+)
PW-GND3
RL = 4Ω
OUT3 (−)
OUT4 (+)
PW-GND4
RL = 4Ω
OUT4 (−)
STBY
components in the test circuit are only used to determine the device characteristics.
It is not guaranteed that the system will work properly with these components.
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16. Electrical characteristics
16.1 Total Harmonic Distortion vs. Output Power
THD – POUT (ch1)
THD – POUT (ch2)
VCC = 13.2 V
VCC = 13.2 V
GV = 26dB
10
10
100 Hz : ~30 kHz
: 400 Hz~30 kHz
(%)
1 kHz
(%)
10 kHz : 400 Hz~
THD
20 kHz : 400 Hz~
THD
1
Total harmonic distortion
Total harmonic distortion
GV = 26dB
RL = 4 Ω
Filter
20 kHz
0.1
10 kHz
100 Hz
0.01
RL = 4 Ω
Filter
100 Hz : ~30 kHz
1 kHz
: 400 Hz~30 kHz
10 kHz : 400 Hz~
20 kHz : 400 Hz~
1
20 kHz
0.1
10 kHz
100 Hz
0.01
f = 1 kHz
f = 1 kHz
0.001
0.1
1
10
Output power
POUT
0.001
100
0.1
1
(W)
THD – POUT (ch3)
VCC = 13.2 V
GV = 26dB
GV = 26dB
RL = 4 Ω
Filter
RL = 4 Ω
Filter
100
(W)
10 kHz : 400 Hz~
1 kHz
20 kHz : 400 Hz~
Total harmonic distortion
1
20 kHz
0.1
10 kHz
100 Hz
0.01
100 Hz : ~30 kHz
(%)
: 400 Hz~30 kHz
THD
(%)
20 kHz : 400 Hz~
Total harmonic distortion
10
100 Hz : ~30 kHz
1 kHz
POUT
THD – POUT (ch4)
VCC = 13.2 V
THD
10
10
Output power
: 400 Hz~30 kHz
10 kHz : 400 Hz~
1
20 kHz
0.1
10 kHz
100 Hz
0.01
f = 1 kHz
f = 1 kHz
0.001
0.001
0.1
1
10
Output power
POUT
100
0.1
1
Output power
(W)
10
POUT
100
(W)
Fig. 7-1 Total Harmonic Distortion of Each Frequency (RL=4Ω)
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THD – POUT (ch1)
GV = 26dB
RL = 2 Ω
f = 1 kHz
Filter
400 Hz~30 kHz
10
GV = 26dB
RL = 2 Ω
f = 1 kHz
Filter
400 Hz~30 kHz
(%)
THD
1
Total harmonic distortion
Total harmonic distortion
THD
(%)
10
THD – POUT (ch2)
6V
0.1
13.2 V
0.01
18 V
0.001
1
6V
0.1
13.2 V
18 V
0.01
0.001
0.1
1
10
Output power
POUT
0.1
100
(W)
POUT
100
(W)
THD – POUT (ch4)
GV = 26dB
RL = 2 Ω
f = 1 kHz
Filter
400 Hz~30 kHz
10
GV = 26dB
RL = 2 Ω
f = 1 kHz
Filter
400 Hz~30 kHz
(%)
(%)
THD
1
0.1
6V
13.2 V
18 V
0.01
Total harmonic distortion
THD
Total harmonic distortion
10
Output power
THD – POUT (ch3)
10
1
0.001
1
0.1
6V
13.2 V
18 V
0.01
0.001
0.1
1
Output power
10
POUT
100
0.1
(W)
1
Output power
10
POUT
100
(W)
Fig.7-2 Total Harmonic Distortion by Power-supply Voltage (RL=4Ω)
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TB2996HQ
(%)
GV = 26dB
RL = 4 Ω
f = 1 kHz
Filter
400 Hz~30 kHz
10
GV = 26dB
RL = 4 Ω
f = 1 kHz
Filter
400 Hz~30 kHz
THD
10
THD – POUT (ch2)
Total harmonic distortion
Total harmonic distortion
THD
(%)
THD – POUT (ch1)
1
0.1
6V
13.2 V
1
0.1
6V
13.2 V
0.01
0.01
18 V
18 V
0.001
0.001
0.1
1
Output power
10
POUT
(W)
0.1
100
(%)
GV = 26dB
RL = 4 Ω
f = 1 kHz
Filter
400 Hz~30 kHz
THD
10
Total harmonic distortion
Total harmonic distortion
10
POUT
(W)
100
THD – POUT (ch4)
THD
(%)
THD – POUT (ch3)
1
Output power
1
6V
0.1
13.2 V
10
GV = 26dB
RL = 4 Ω
f = 1 kHz
Filter
400 Hz~30 kHz
1
6V
0.1
13.2 V
0.01
0.01
18 V
18 V
0.001
0.001
0.1
1
10
Output power
POUT
0.1
100
(W)
1
Output power
10
POUT
100
(W)
Fig.7-3 Total Harmonic Distortion by Power-supply Voltage (RL=4Ω)
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16.2 Various Frequency Characteristics
THD – f
(%)
10
Total harmonic distortion
THD
1
6V
0.1
18 V
13.2 V
0.01
VCC = 13.2 V
RL = 4 Ω
POUT = 5 W
0.001
0.01
No Filter
0.1
1
frequency f
10
(kHz)
Fig.7-4 Frequency Characteristics of Total Harmonic Distortion
GV – f
ATTMUTE – f
ATTMUTE
1
1ch~4ch
0.1
Mute attenuation
Voltage gain
GV
(dB)
(dB)
10
VCC = 13.2 V
0.01
RL = 4 Ω
VOUT = 0.775 Vrms
(0dBm)
0.001
0.01
0.1
1
frequency f
(kHz)
0
-20
VCC = 13.2 V
RL = 4 Ω
VOUT = 7.75 Vrms (20dBm)
-40
-60
-80
-100
0.01
10
1ch~4ch
0.1
1
furequency f
10
(kHz)
Fig. 7-5 Frequency Characteristics of Voltage Gain and Mute Attenuation
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R.R. – f (GV = 26dB)
0
VCC = 13.2 V
Ripple rejection ratio
R.R.
(dB)
RL = 4 Ω
RG = 620 Ω
-20
Vrip = 0.775 Vrms (0dBm)
GV = 26dB
-40
1ch
4ch
-60
3ch
-80
0.01
0.1
1
2ch
10
frequency f
(kHz)
Fig. 7-6 Frequency Characteristics of Ripple Rejection Rate
C.T. – f (ch1)
VCC = 13.2 V
RL = 4 Ω
f = 1 kHz
VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
2ch
3ch
0.1
1
-100
0.01
10
C.T. – f (ch3)
-30
VCC = 13.2 V
RL = 4 Ω
f = 1 kHz
VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
4ch
-70
2ch
(dB)
-40
1ch
-50
-60
-90
-100
0.01
1
frequency f
-60
-80
0.1
(kHz)
C.T.
-50
3ch
-90
Cross talk
-40
4ch
-80
-80
-30
1ch
-70
frequency f
(dB)
-60
-70
-100
0.01
C.T.
-50
4ch
-90
Cross talk
(dB)
-40
C.T. – f (ch2)
VCC = 13.2 V
RL = 4 Ω
f = 1 kHz
VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
C.T.
(dB)
-60
Cross talk
-50
C.T.
-40
-30
Cross talk
-30
10
(kHz)
C.T. – f (ch4)
VCC = 13.2 V
RL = 4 Ω
f = 1 kHz
VOUT = 0.775 Vrms (0dBm)
RG = 620 Ω
-70
3ch
1ch
2ch
-80
-90
-100
0.01
0.1
1
10
frequency f (kHz)
0.1
1
frequency f
10
(kHz)
Fig. 7-7 Frequency Characteristics of Cross Talk
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16.3 Output Power vs Input Voltage
POUT (ch1) – VIN
50
100 Hz
1 kHz
10 kHz
POUT
f = 20 kHz
(W)
(W)
30
20
10
出力電力
Output power
40
POUT
50
POUT (ch2) – VIN
VCC = 13.2 V
RL = 4 Ω
No Filter
0
0
5
Input signal voltage VIN (rms) (V)
1 kHz
40
f = 20 kHz
20
10
VCC = 13.2 V
RL = 4 Ω
No Filter
0
0
10
5
Input signal voltage
1 kHz
50
10 kHz
20
VCC = 13.2 V
RL = 4 Ω
No Filter
0
0
5
Input signal voltage
1 kHz
10
100 Hz
f = 20 kHz
30
20
10
10 kHz
VCC = 13.2 V
RL = 4 Ω
No Filter
0
0
10
VIN (rms)
(V)
40
POUT
(W)
100 Hz
f = 20 kHz
10
VIN (rms)
POUT (ch4) – VIN
出力電力
(W)
POUT
30
Output power
40
10 kHz
30
POUT (ch3) – VIN
50
100 Hz
10
5
(V)
Input signal voltage
VIN (rms)
(V)
16.4 Power Dissipation vs. Output Power
(W)
PD – POUT (RL = 4 Ω)
Power dissipation
PD
18 V
13.2 V
f = 1 kHz
RL = 4 Ω
4ch drive
6V
Output power
POUT/CH (W)
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16.5 Other characteristics
VNO – Rg
200
VCC = 13.2 V
RL = 4 Ω
f = 1 kHz
Filter
to 20 kHz
(mA)
VIN = 0 V
RL = ∞
ICCQ
250
ICCQ – VCC
150
Quicent current
Output noise voltage
VNO
(μV)
300
1ch~4ch
100
50
0
0.001
0.01
0.1
1
Ambient input resistance
10
Rg (Ω)
Supply voltage
20
VCC
(V)
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17. Package Dimensions
* From center to parting line.
Weight : 7.7 g (typ.)
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18. Board Layout for TOSHIBA 4-Channel Power Circuitry
The layout diagrams below illustrate the front and back sides of the test board “RP-2024” for testing Toshiba’s
4-channel power circuitry, which is housed in a HZIP25-P-1.00F (SPP25) package.
Note 1: This test board is designed to be used for several power amplifiers. Therefore, devices that are externally
connected to the power amplifier to be tested must be checked before setting up the test board.
Front Side
Back Side
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Attention in Use
• Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of
over current and/or IC failure. The IC will fully break down when used under conditions that exceed its
absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs
from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or
ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings,
such as fuse capacity, fusing time and insertion circuit location, are required.
• If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design
to prevent device malfunction or breakdown caused by the current resulting from the inrush current at
power ON or the negative current resulting from the back electromotive force at power OFF. For details on
how to connect a protection circuit such as a current limiting resistor or back electromotive force adsorption
diode, refer to individual IC datasheets or the IC databook. IC breakdown may cause injury, smoke or
ignition.
• Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or
ignition.
• Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator. If there is a large amount of
leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If
this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can
cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular,
please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage
to a speaker directly.
• Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under
all circumstances. If the Over current protection circuits operate against the over current, clear the over
current status immediately. Depending on the method of use and usage conditions, such as exceeding
absolute maximum ratings can cause the over current protection circuit to not operate properly or IC
breakdown before operation. In addition, depending on the method of use and usage conditions, if over
current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown.
• Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown
circuits operate against the over temperature, clear the heat generation status immediately. Depending on
the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the
thermal shutdown circuit to not operate properly or IC breakdown before operation.
• Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, please design the device
so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can
lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the
device taking into considerate the effect of IC heat radiation with peripheral components.
• Installation to Heat Sink
Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive
mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal
IC chip. In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the
use of silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation
design and heat sink installation, refer to individual technical datasheets or IC databooks.
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in
compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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