Liquid Source Vaporization System

Liquid Source Vaporization System
Liquid Source Vaporization
Control Systems
Digital Liquid Mass Flow Meter
LF-F series
Digital Liquid Mass Flow Controller
LV-F series
Injection System
MV series
MI series
VC series
Compact Baking System
LSC series
Liquid Auto Refill System
LU series
01
LIQUID
Liquid Source Vaporization Control Systems
As semiconductor devices get faster and levels of
integration increase, more detail is required in device
construction, and new materials are being introduced
into the 300 mm wafer production process to increase
production efficiency. As a result of this trend, there is
now a larger variety of liquid sources used in
the semiconductor manufacturing process, and flow
rates have increased as well.
HORIBASTEC is the world leader in this area offering
a full line up of liquid source vaporization control
systems utilizing different methodologies including
baking, direct injection and mixing to guarantee
efficient and stable delivery of vapor to the point of use.
Auto refill systems complete the lineup offering
uninterrupted, safe and reliable delivery of the liquid
precursor increasing uptime and reducing operator
handling and risk of process contamination.
Liquid Source Vaporization Control Systems 02
LF-F/ LV-F series
Digital Liquid Mass Flow Meter/Controller
Featuring the world's first sensor with a unique cooling method
sOffer micro-liter to ultra low flow rate control.
sEnable precision flow control of low boiling point and high
viscosity liquids.
sUltra clean.
*Please confirm the external dimensions of the last page.
sRoHS Compliance
MI/MV series
Mixed injection
Vaporize liquids efficiently using the gas-liquid mixture vaporization method
sThe gas-liquid mixture vaporization method enables stable
vaporization of high boiling point liquids.
sHighly efficient and stable vaporization.
sCan be used for low temperature, large flow production.
sCompact vaporization system easily fits into ideal designs.
sRoHS Compliance
MI/MV series
feed back
LF-F
Liquid Source Inlet
MI/MV
Outlet
Liquid Mass Flow Meter
SEC
Carrier Gas Inlet
Mass Flow Controller
VC series
Direct injection
Compact vaporization system that can be used in different
configurations, thanks to its use of non-carrier vaporization
sCompact size
sCan be installed in a variety of positions.
sBest-selling TEOS vaporization system models.
sIt combines SEF or LF, and digital control is possible.
sNo need for a special bubbling tank or vaporization tank.
sLineup of DeviceNetTM model.
sRoHS Compliance
VC series non-carrier type
feed back
Liquid Source Inlet
VC
SEF
Outlet
High temperature
mass flow meter SEF-8240
High Temperature
Mass Flow Meter
feed back
RoHS regulations:
Liquid Source Inlet
LF-F
Liquid Mass Flow Meter
VC
Outlet
RoHS stands for “Restriction of Hazardous Substances” and is a set of regulations enforced in the EU to limit the use of
six hazardous substances (lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBBs) and
polybrominated diphenyls (PBDEs)), in electric and electronic components.
LIQUID
LSC series
Compact Baking System
Best-selling baking system model
sPioneer liquid source vaporization control system that vaporizes liquids
including ethyl silicate.
sSuitable for large flow rate vaporization: Enables vapor generation of
stable TEOS at 600SCCM.
sEasy maintenance from the front of the unit.
Basic flow
Dimensions (mm)
159±2
144
Pneumatic valve
Purge
1/4 inch VCR
type male
Outlet
3/8 inch VCR
type male
SEC
Mass flow controller
Source
1/4 inch VCR
type male
340±3
300±4
(45)
65±2
320±5
50±2
60 60
110
270
337±5
320
Valve
288±4
Drain
1/4 inch VCR
type female
Tank
LU series
Liquid Auto Refill System
Safe, efficient, and continuous, uninuous supply of liquid sources to vaporization systems
sVapor pressure monitoring function (patent pending) that checks the purge
efficiency during mother tank replacement comes standard with the unit.
sMonitoring by the load cell of the remaining amount of material in the mother tank
is available as an option.
sCompact design that allows for easier maintenance.
sDegasifier module comes standard, and the unit can be used to supply a variety
of vaporization systems, including injection and baking type vaporization systems.
sSafety standards: SEMI S2/S8/S14, CE mark
sRoHS Compliance
Basic flow
250±10
Dimensions (mm)
Vacuum
1/4 inch VCR type,
male
PS
Sensor that
detects any liquid
remaining in the
pipes after tank
replacement
(patent pending)
Subtank
Source 2 outlet
1/4 inch VCR type,
male
Liquid
cylinder
Degasifier module
(2070)
Source 1 outlet
1/4 inch VCR type,
male
Option
Pressure delivery line
Liquid supply line
Purge and/or exhaust lines
65
Purge gas inlet
1/4 inch VCR type,
male
Carrier gas inlet
1/4 inch VCR type,
male
Exhaust
1/4 inch VCR type,
male
1820±15
03
600±5
600±5
Liquid Source Vaporization Control Systems 04
LF-F/LV-F series
Model
Flow Range (g/min)
RoHS Compliance
LF-F20M-A
LF-F30M-A
LF-F40M-A
LF-F50M-A
LF-F60M-A
0.02/0.05/0.1
0.2/0.5
1/2/5
10/20
50/100
Measurement Range
0.02/0.05/0.1
1/2/5
0.2/0.5
All liquids except those corrosive to stainless steel (ex, HCl and HF)
Viscosity*2
MAX. 0.1 Pa·s (100cp)
MAX. 0.01 Pa·s (10cp)
± 1% F.S.
*3
± 0.5% F.S.
Linearity
± 0.5% F.S.
Repeatability
≦ 3 second (T98)
≦ 2 second (T98)
Less than 3sec (T98)
Response speed
Operating Temperature*4
≦ 2 second (T98)
5 to 50°C (Accuracy Guaranteed 15 to 45°C)
± 0.1%F.S./°C MAX± 1%
Temperature coefficiency
Operating Pressure*5
Max. 5MPa (as flow meter) / 50 to 300kPa (with piezo control valve)
Pressure Resistance
10MPa (as flow meter)
1MPa
MAX. 500Pa
MAX. 30kPa
Pressure Drop
50/100
10/20
5 to 100% F.S.
Application Liquid*1
Accuracy
LV-F20(PO/MO) LV-F30(PO/MO) LV-F40(PO/MO) LV-F50(PO/MO) LV-F60(PO/MO)
*6
0.05 to 0.3 MPa
Analog: 0 to 5 VDC Digital: RS485
Flow Rate Signal
+15 V ± 5%, 200 mA
Power Supply
-15 V ± 5%, 200 mA
Less than 5 x 10-12Pa·m3/s (He)
Leak Integrity
PO: Less than 1 x 10-8Pa·m3/s (He)
SUS316L, Ni
Wetted Material
1/16,8,4inch compression fitting, 1/18,4 inch VCR type
Standard Fitting
MO: Less than 5 x 10-12Pa·m3/s (He)
PO Type: SUS316L, Ni, PTFE, PFA
MO Type: SUS316L,Ni
1/16,8,4inch compression fitting, 1/18,4 inch VCR type
1/8,4 inch compression fitting, VCR type 1/4inch compression fitting, VCR type
1/8,4 inch compression fitting, VCR type 1/4inch compression fitting, VCR type
*1 With the LF-F/LV-F Series, flow rate calibration is performed using one specified type of liquid. (Please indicate the type of liquid to be used when ordering the device.)
- Liquids containing solid materials cannot be measured.
- Please consult us in advance if you plan to use these devices with liquid mixture for which the mixture ratio may vary.
- With the LV-F Series, if the liquid to be measured contains particle etc., please install a 0.2 μm (Abs) filter on the primary side.
*2 The LV-F Type can be used with a maximum viscosity of 0.01Pa_s depending on the flow rate range. Please consult us in advance if you plan to use this device with high-viscosity liquids.
*3 Specification of accuracy, linearity and repeatability is guaranteed against calibrated liquid based on SEMI E56-1296.
*4 In order to ensure precise measurement, please maintain incoming liquid temperature to be within 10 deg.C lower or 3 deg.C higher than the ambient temperature.
*5 Specification of Operating Pressure is the pressure range when liquid viscosity is 0.001Pa_s. *6 Maximum pressure loss at full-scale flow of liquids with a viscosity of 0.001 Pa_s at full-scale flow.
MI/MV series
RoHS Compliance
MI-1000
Model
MV-1000
All liquids except those corrosive to stainless steel( ex. HCl, HF)
Liquid Material
Example generated flow rate: TEOS(to 7g/min),IPA(to 3cc/min)
Leak Integrity
Max. 5.0 CCM conversion (liquid phase conversion)
Max 140°C
Control Valve: Max 140°C Vaporizer: Max 200°C
Control Valve: ≤ 1 x 10-6 Pa·m3/s (He) Air Valve Option: ≤ 1 x 10-9 Pa·m3/s (He)
Control Valve: ≤ 1 x 10-6 Pa·m3/s (He) Vaporizer: ≤ 1 x 10-9 Pa·m3/s (He)
Setting Temperature
SUS316L,PFA
Wetted parts
Thermocouple K type
Temperature Sensor
Thermocouple K type (Control valve, Vaporizer)
1.0MPa (G)
Pressure Resistance
Standard Fitting
Liquid Inlet 1/8inch VCR type Male Gas Inlet 1/4inch VCR type Female Gas Outlet 1/4inch VCR type Male
Liquid Inlet 1/8inch VCR type Male Gas Inlet 1/4inch VCR type Female Gas Outlet 1/2inch VCR type Male
15 to 50°C
Operating Temperature
Pneumatic valve
Option
Control Valve: 120V(100W) / 208V(100W) / 240V(100W) available Vaporizer: 120V(100W) / 208V(100W) / 240V(100W) available
120V(100W) / 208V(100W ) /240V(100W) available
Heater
High limit 2450RC 160°C (ELMWOOD) NC type
Temperature Switch
Control Valve: High limit 2450RC 160°C (ELMWOOD) NC type Vaporizer: High limit 2450RC 250°C (ELMWOOD) NC type
≤ 1 x 10 Pa·m3/s (He)
-8
External leak
620 ± 10g (Standard Type) , 700 ± 10g (Air Valve Option Type)
Weight (exclude cable)
VC series
1110 ± 10g (Standard Type) , 1190 ± 10g (Air Valve Option Type)
RoHS Compliance
RoHS Compliance
VC-1420
Model
Flow rate generated*1 (During TEOS generation)
Operating temperature
Max.5.0 CCM(liquid phase convention)
Liquids supported
TEOS, P(OCH3)3, C6F6
Temperature rise
Max. 150°C
± 1% F.S.
Reduced pressure
Digital interface
1.0x10-8Pa·m3/s
Leak integrity
1.0x10-6Pa·m3/s
Power Supply
316L Stainless Steel ( polished surface )
Wetted mateliar
Temperature sensor used
Standard Fitting
Liquid inlet: 1/8 inch VCR type male Gas outlet: 1/4 inch VCR type female
F-Net protcol / Analog
Less than 5x10-12Pa·m3/sec1(He)
Conforming to ODVA standards, DC24V 4.0V
+15V±5% 150mA -15V±5% 150mA
316L Stainless Steel ( polished surface )
AC100 to 120V 50/60Hz 70 to 100VA
Thermocouple K type (CA)
Pressure Resistanc
1.0MPa(G)
LSC-A100 series
DeviceNetTM protocol
Temperature sensor used
Thermocouple K type (CA)
Pressure Resistance
Max. 150°C ( Open at power-off )
Heater
AC 100V to 120V 70W(35Wx2)
Internal heater volume
HM : 100 to 120°C HL : 80 to 100°C MH : 60 to 80°C MM : 35 to 60°C
Baking temperature
External leak integrity
Wetted mateliar
SEF-8240F
Accuracy
Pressure generated
Internal Leak Integrity
SEF-8240D
Model
1.0MPa (G)
Standard Fitting
1/4 inch VCR equivalent
*1 Varies depending on the type of liquid. *CCM is a symbol indicating gas flow rate (mL/min at 25° C, 101.3 kPa).
LSC-A100 series
Model
Flow rate generated
H2O 2SLM, TEOS 600 SCCM (Max.)
Operating pressure
Max. 1.33kPa
2.7L
Source tank volume
PID control by the heat regulator
Heat regulation method
Liquid surface detection method
Floating switch
Internal mass flow controller
SEC-8400 series
Bellows type
Air pressure valve
Materials in liquid connection
and gas contact area
SUS316L, PFA
20 to 35° C
Operating Temperature
External input
Air pressure valve open/close, mass flow controller flow rate setting signal (0 to 5 V DC/0 to 100% F.S.), emergency stop signal, auto zero signal (option)
External output
Temperature alarm, liquid level H.H. alarm, liquid level signal (H, M, L), READY signal, mass flow controller flow rate output signal ((0 to 5 V DC/0 to 100% F.S.), thermoregulated bath internal fan stop alarm, valve voltage monitor (option)
Power source
Other
LU-A1000 series
Model
Liquids supported
Supply method
Gas supply pressure
Tank
Operation
Operation area display details
Gas connection
Power source
AC 100 V, single phase 50/60 Hz, 1.5 kVA
Auto-recharge system: Can be connected to LU series.
*The flow rate control range varies with the type of liquid.
* SCCM and SLM are symbols indicating gas flow rate (mL/min, L/min at 0° C, 101.3 kPa).
RoHS Compliance
LU-A1000 series
TEOS, TMOB, TMOP, BTBAS
Pressure movement from He gas
For pressure movement: 0.3 to 0.6 MPa (G); For purge: 0.3 to 0.6 MPa (G), OP N2 0.6 to 0.7 MPa (G)
Maximum 5-gallon container can be attached (outside of production range)
Automatic supply/stop using external signal from supply system
Pressure error display; When an alarm is triggered: Display hold function (manual reset); Liquid level display; Sequence, etc.
Refer to basic flow
AC 100 to 240 V, 50/60 Hz, 300 VA
Electricity connection
AC 100 to 240 V breaker connection, signal receptacle
External dimensions
See external dimensions diagram
* Please make decisions regarding the specifications above after meeting with HORIBA STEC.
LIQUID
Measurement principles
s Cooling measurement method
s Structure/Operating principle
The flow rate sensor in the LF-F/LV-F series of fine mass flow controllers for
liquids consists of an electronic cooling element (Peltier element) that is in
contact with a capillary tube, as well as several temperature detection
elements. When the liquid is flowing, the sensor detects the temperature
rise (ΔT) corresponding to the flow rate and displays it as a flow rate. Unlike
methods where heat is added, this cooling method enables flow rate
measurement of liquids with low boiling points. It also prevents problems
with interference due to the influence of secondary discharge (vaporization)
and makes accurate flow rate measurements possible.
The LV-F series of mass flow controllers are similar to the LF-F series of
mass flow meters, but also have a piezo actuator valve and an internal
comparison control circuit. They compare the flow rate setting signal and
the flow rate output signal and automatically control the valve aperture so
that the two signals will match. Since they use a feedback control system,
there are no flow rate variations as a result of external factors, and, there
fore, stable, accurate control is possible. The use of a piezo actuator valve,
which is both stable and does not generate heat, as the control valve
makes these units ideal for flow control of liquids with low boiling points.
Stainless steel capillary tube
Power supply
Ts
Liquid
Electronic cooling element
(Peltier element)
MPU
Flow rate setting signal
Flow rate output signal
Digital/Analog
correction/
comparison
control circuits
Valve drive
circuit
Piezo actuator
Amplification
circuit
When liquid is flowing
Temperature (°C)
05
Flow rate control valve
Sensor drive
circuit
Metal diaphragm
Flow rate sensor
ΔT
Inlet
When liquid is not flowing
Outlet
Temperature distribution
in sensor area
Peltier element
Principle of vaporization
s Injection method
The following list covers the major steps involved in vaporizing a liquid
source and supplying it to the process chamber.
Pressure
Liquid
1. The liquid source's flow rate is measured and the amount of liquid is
feedback controlled by the valve.
2. The liquid is instantaneously and completely vaporized.
3. The gas is released without being allowed to condense back into its
liquid form.
Vaporization systems that use the injection method sequentially carry out
steps 1, 2, and 3 listed above. The VC series units measure the liquid flow
of the liquid source using a mass flow meter and do not use a carrier gas.
The MI/MV series units use a mass flow meter for measurement and
feature a mass flow controller that introduces a carrier gas into the unit to
vaporize the liquid source.
Solid
Triple
point
Gas
Temperature
The graph above shows the different possible states of matter. There are two ways to get
from a liquid to a gaseous state. The first method involves increasing the temperature
while holding the pressure steady, as indicated by the arrow with the broken line (
).
This method is commonly used in everyday settings—to boil water and convert it to
steam, for example. Heating a liquid takes time, however, which makes rapid vaporization
difficult. On the other hand, one can also heat the liquid in advance and then abruptly
reduce the pressure, as illustrated by the arrow with the solid line (
). The pressure in
the vaporization section of the injector can be reduced instantaneously, and this makes it
possible to vaporize a liquid source instantaneously.
s Gas and liquid mixture method
s Optimal vaporization methods for different liquids
This is the vaporization method used in the MI/MV series. Since the
pressure on the carrier gas is higher at the front of the nozzle inside the
injector, it can be heated efficiently. The liquid source and the heated
carrier gas are mixed together in the gas/liquid mixing area in the front of
the nozzle, and the pressure is reduced as they pass through the nozzle,
vaporizing the mixture. Vaporization efficiency is higher than with traditional
vaporization methods. When this method is used, larger flows can be
generated, and the generation temperature can be reduced.
In semiconductor devices which continue to require greater integration and
detail, a variety of liquid sources are used to accentuate
the characteristics of the films created. HORIBA STEC offers vaporization
systems that are optimized to make the most of the characteristics of
the various liquid sources used in today's cutting-edge processes.
TMCTS DMDMOS OMCTS
4MS HMDSO
Interlayer dielectric film
Low-k
Gate insulator
High-k
Hf
TEMAH TDEAH
Capacitor Cell
High-k
Ta Hf Zr
Al Si
TAETO TEMAH TDEAH
TEMAZ TMA TDMAS
Barrier layer
Ti TiN
Si
Gas IN
Mix Gas &
Liquid OUT
Liquid IN
Others
BPSG
TEOS TEPO TEB
H2O IPA
TiCl4 TDMAT TDEAT
Liquid Source Vaporization Control Systems 06
Safe, efficient, and continuous, uninuous supply of liquid sources to vaporization systems
Automatic supply
The LU-A1000 series liquid material refill system provides
automatic,safe,waste-free material supply to liquid material baking
systems (LSC series) and injection systems (MI,MV,VC series)
HORIBA STEC has amassed a great deal of technical know-how in the precise measurement, control, and vaporization of liquids.
We offer equipment for a wide range of fields, so whether you need to deal with liquid chemicals in the semiconductor
manufacturing process or add water while developing and producing the latest in fuel cells, HORIBA STEC has the tools for you.
HORIBA STEC equipment is suitable not only for vaporization and supply to vacuum chambers, but also for vaporization and
supply to atmospheric pressure lines. We offer the ideal vaporization systems for your needs.
s An example of a system that can vaporize pure water (H2O) and supply it to a chamber with greater than atmospheric pressure
TL system
SEC
Carrier Gas Inlet
VAPO
Mass Flow Controller
Outlet
Vaporizer
In addition to the TL system, we have recently added LE system
models with a new type of vaporizer to our lineup. For details,
please contact your sales representative.
LV-F
Liquid Source Inlet
Liquid Mass Flow Controller
External dimensions
sMI-1000
sMV-1000
90.5
42.3±0.5
18.6
37.3±0.5
51.6±0.5
56
45±1
50±0.5
60
50
(92.9±1)
24.3
10
5
100.5±1
110.5
30
2-M4
20
40
2-Ø5
5
5
55
45±0.5
5
18.6
18.6
99.2±0.5
51.6±0.5
2-Ø5
22.5
75
127
25.8±0.5
125±1
40
25.8±0.5
127
40
37.3±0.5
sVC series
External dimensions
sLF-F/LV-F series
H
H
E
E
W
I
B
A
T
A
LF-F20M-A
LF-F30M-A
LF-F40M-A
LF-F50M-A
LF-F60M-A
LV-F20(PO/MO)
LV-F30(PO/MO)
LV-F40(PO/MO)
LV-F50(PO/MO)
LV-F60(PO/MO)
T
C
D
D
C
Model
W
I
B
H
T
W
112
112
112
112
112
112
112
112
112
112
30
30
30
30
30
30
30
30
30
30
55
55
55
55
55
86
86
86
86
86
I
I
I
I
I
I
A
B
C
D
E
106
106
106
106
106
137
137
137
137
137
105
105
105
105
105
136
136
136
136
136
94
94
94
94
94
125
125
125
125
125
99
99
99
99
99
130
130
130
130
130
87
87
87
87
87
118
118
118
118
118
89
89
89
89
89
120
120
120
120
120
5
5
5
5
5
5
5
5
5
5
65
65
65
65
65
96
96
96
96
96
5
5
5
5
5
5
5
5
5
5
20
20
20
20
20
20
20
20
20
20
17
17
17
17
17
17
17
17
17
17
1/4inch VCR 1/4inch Swagelok 1/8inch VCR 1/8inch Swagelok 1/16inch Swagelok 1/16inch Special
Please request other external dimension drawings from HORIBA STEC.
* Equivalent joints are sometimes used instead of the ones listed.
Please read the operation manual before using this product to ensure safe and proper handling of the product.
● The contents of this catalog are subject to change without prior notice, and without any subsequent liability to this company.
● It is strictly forbidden to copy the content of this catalog in part or in full.
● All brand names, product names and service names, in this catalog are trademarks or registered trademarks of their respective companies.
http://www.horiba-stec.jp/e.
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PGV-CE23A
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PHONE: (49)351-889-6807
FAX: (49)351-889-6808
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