Eurotech CPU-301-16 Rugged, Ultra Low Power i.MX6 SBC/CoM Owner Manual
Below you will find brief information for Development Kit CPU-301-16. The CPU-301-16 Development Kit provides a development platform for the CPU-301-16 module and a reference for custom carrier board design. Utilizing this kit allows you to validate your proposed design for both software and hardware, including operating system images with all required drivers loaded. The CPU-301-16 Development Kit maximizes the module’s functionality and implements many industry-standard interfaces, a valuable reference for your application-specific carrier board.
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USER MANUAL
Rev 1 – August 2013 – 110127-50001
CPU-301-16
Development Kit
www.eurotech.com
Trademarks
All trademarks both marked and not marked appearing in this document are the property of their respective owners.
Document Revision History
REVISION
1
DESCRIPTION
Initial release
DATE
August 2013
© 2013 Eurotech Inc.
Table of Contents
Table of Contents
110127-50001 3
CPU-301-16 Development Kit - User Manual
4 110127-50001
Important User Information
Important User Information
In order to lower the risk of personal injury, electric shock, fire, or equipment damage, users must observe the following precautions as well as good technical judgment, whenever this product is installed or used.
All reasonable efforts have been made to ensure the accuracy of this document; however, Eurotech assumes no liability resulting from any error/omission in this document or from the use of the information contained herein.
Eurotech reserves the right to revise this document and to change its contents at any time without obligation to notify any person of such revision or changes.
Safety Notices and Warnings
The following general safety precautions must be observed during all phases of operation, service, and repair of this equipment. Failure to comply with these precautions or with specific warnings elsewhere in this manual violates safety standards of design, manufacture, and intended use of the equipment.
Eurotech assumes no liability for the customer’s failure to comply with these requirements.
The safety precautions listed below represent warnings of certain dangers of which Eurotech is aware.
You, as the user of the product, should follow these warnings and all other safety precautions necessary for the safe operation of the equipment in your operating environment.
Installation in Enclosures
In the event that the product is placed within an enclosure, together with other heat generating equipment, ensure proper ventilation.
Do Not Operate in an Explosive Atmosphere
Do not operate the equipment in the presence of flammable gases or fumes. Operation of any electrical equipment in such an environment constitutes a definite safety hazard.
Alerts that can be found throughout this manual
The following alerts are used within this manual and indicate potentially dangerous situations.
Danger, electrical shock hazard:
Information regarding potential electrical shock hazards:
• Personal injury or death could occur. Also damage to the system, connected peripheral devices, or software could occur if the warnings are not carefully followed.
• Appropriate safety precautions should always be used, these should meet the requirements set out for the environment that the equipment will be deployed in.
Warning:
Information regarding potential hazards:
• Personal injury or death could occur. Also damage to the system, connected peripheral devices, or software could occur if the warnings are not carefully followed.
• Appropriate safety precautions should always be used, these should meet the requirements set out for the environment that the equipment will be deployed in.
Information and/or Notes:
These will highlight important features or instructions that should be observed.
110127-50001 5
CPU-301-16 Development Kit - User Manual
Use an Appropriate Power Supply
• Only start the product with a power supply that conforms to the voltage requirements as specified in
Power Supply , page 29 . In case of uncertainty about the required power supply, please contact your
local Eurotech Technical Support Team.
• Avoid overcharging power-points.
Antistatic Precautions
To avoid damage caused by ESD (Electro Static Discharge), always use appropriate antistatic precautions when handing any electronic equipment.
Life Support Policy
Eurotech products are not authorized for use as critical components in life support devices or systems without the express written approval of Eurotech.
Warranty
For Warranty terms and conditions users should contact their local Eurotech Sales Office.
See Eurotech Worldwide Presence , page 33 for full contact details.
WEEE
The information below is issued in compliance with the regulations as set out in the 2002/96/EC directive, subsequently superseded by 2003/108/EC. It refers to electrical and electronic equipment and the waste management of such products. When disposing of a device, including all of its components, subassemblies, and materials that are an integral part of the product, you should consider the WEEE directive.
This device is marketed after August 13, 2005 and you must separate all of its components when possible and dispose of them in accordance with local waste disposal legislations.
• Because of the substances present in the equipment, improper use or disposal of the refuse can cause damage to human health and to the environment.
• With reference to WEEE, it is compulsory not to dispose of the equipment with normal urban refuse and arrangements should be instigated for separate collection and disposal.
• Contact your local waste collection body for more detailed recycling information.
• In case of illicit disposal, sanctions will be levied on transgressors.
RoHS
This device, including all its components, subassemblies and the consumable materials that are an integral part of the product, has been manufactured in compliance with the European directive
2002/95/EC known as the RoHS directive (Restrictions on the use of certain Hazardous Substances).
This directive targets the reduction of certain hazardous substances previously used in electrical and electronic equipment (EEE).
Technical Assistance
If you have any technical questions, cannot isolate a problem with your device, or have any enquiry about repair and returns policies, contact your local Eurotech Technical Support Team.
See Eurotech Worldwide Presence , page 33 for full contact details.
6 110127-50001
Important User Information
Transportation
When transporting any module or system, for any reason, it should be packed using anti-static material and placed in a sturdy box with enough packing material to adequately cushion it.
Warning:
Any product returned to Eurotech that is damaged due to inappropriate packaging will not be covered by the warranty.
Conventions
The following table describes the conventions for signal names used in this document.
Convention
GND
#
_P
_N
Explanation
Digital ground plane
Active low signal
Positive signal in differential pair
Negative signal in differential pair
The following table describes the abbreviations for direction and electrical characteristics of a signal used in this document.
Type
I
O
IO
P
2.5
3.3
5
A
HDMI
LVDS
MIPI
NC
OD
PCIe
Reserved
SATA
USB
Explanation
Signal is an input to the system
Signal is an output from the system
Signal may be input or output
Power and ground
2.5 V signal level
3.3 V signal level
5 V signal level
Analog signal
Compliant with High-Definition Multimedia Interface Specification
Low Voltage Differential Signalling
Compliant with MIPI Specification
No Connection
Open-drain
Compliant with PCI Express v2.0 Specification
Use is reserved to Eurotech
Compliant with SATA-2 Specification
Compliant with Universal Serial Bus 2.0 Specification
Some signals include termination on the CPU-301-16 or carrier board. The following table describes the abbreviations that specify the signal termination.
Termination
PU
PD
R
C
Explanation
Pull-up resistor to the specified voltage
Pull-down resistor
Series resistor
Series capacitor
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CPU-301-16 Development Kit - User Manual
Product Overview
The CPU-301-16 Development Kit provides a development platform for the CPU-301-16 and a reference for custom carrier board design. The kit consists of the following components:
• CPU-301-16 with CPU-301-16 Development Kit carrier board
• 10.4-inch TFT LCD with SVGA resolution (800 x 600, 6-bit color) and cable
• CCFL backlight inverter and cable
• 4-wire resistive touch panel and cable
• SD card
• 12 VDC adapter and AC cord
• Plexiglas mounting
Please make sure you have received all the components before you begin your development. For details about getting started, refer to the CPU-301-16 Development Kit Quick Start (Eurotech
document #110127-5001).
As a development platform, this kit allows you to become familiar with the CPU-301-16 functionality prior to customization for your specific application. Utilize the development kit to validate your proposed design for both software and hardware. This type of testing also allows you to validate your operating system image with all required drivers loaded.
To provide flexibility and allow development across a broad spectrum of end-use applications, the
CPU-301-16 Development Kit carrier board maximizes the CPU-301-16 functionality and implements many industry-standard interfaces. This configuration provides a valuable reference for your application-specific carrier board. Use Eurotech’s carrier board as a starting point for your design.
Using the same connectivity to the module and the same components will minimize the time spent in debugging your new design.
In addition to the CPU-301-16 Development Kit, Eurotech provides a variety of services to ensure that your CPU-301-16-based product is up and running from the first prototype release. Stay in contact with your sales and support representatives throughout your development cycle to ensure a complete and robust solution with which to move forward.
8 110127-50001
Product Overview
Block Diagram
The following diagram illustrates the system organization of the CPU-301-16 Development Kit.
Functionality provided by the CPU-301-16 is included in the dark blue section, while functionality provided by the carrier board is included in the light blue-gray section. Dotted lines indicate options.
CPU-301-16 Dev Kit
Speaker Output
CPU-301-16 (CoM Version)
Line Out
Stereo
Codec
Digital Audio S/PDIF
Microphone Input
I
2
C Bus
LVDS Display I/F
Digital Display I/F
(24-bit RGB)
Resistive
Touch Panel I/F
Buf
Touch
Panel
Controller
LVDS Display 0
RGB (24-bit)
Serial NAND
Flash
SPI Bus 2
LVDS Display 1
HDMI Display microHDMI
Socket
HDMI I
2
C
MIPI DSI x 2
HDMI I
2
C Bus
I
2
C Bus
I
2
C Bus
LVDS Display I/F
HDMI Display I/F
(1080p)
MIPI Display I/F
Backlight Headers
1 x EIA-232
(8-wire)
1 x EIA-232/485
(4-wire )
SD Card Slot
(4-bit)
3 x USB 2.0
Host Ports
(Type A)
I
2
C Bus
HDMI I
2
C Bus
UART A
Xcvr
UART B
Xcvr
USB 1
USB 2
USB 3
USB 4
USB
Hub
GPIO
PWM 1-3
PWM 4
I
2
C Bus
HDMI I
2
C
UART 1
UART 2
SD 2 (4-bit) microSD
Card Slot
(4-bit)
USB 2.0 Host
Freescale
™
i.MX 6
Solo/Dual/Quad
Processor
(800MHz-1.2GHz)
MIPI CSI x 4
CSI Control
CSI Data/UART 4
CSI Data/UART 5
SD 4 (8-bit)
2-64GB eMMC
(8-bit)
I
2
C Bus
Xcvr
UART C
Xcvr
UART D
MIPI Camera I/F
CMOS Camera I/F
(8-bit)
1 x EIA-232
(4-wire)
1 x EIA-232/485
(4 wire) microSD Card Slot
(4-bit)
USB 2.0
OTG Port
(Type B)
Gigabit Ethernet
(RJ45)
USB 2.0 OTG
GigE
PHY
SATA-2
(Dual/Quad Only)
PCIe x 1
SATA Drive
Header
Gigabit
Ethernet
Header MLB
USB 4
I
2
C Bus miniPCIe Slot with USB
Dual CAN 2.0
Ports
8 x 8 Keypad/
GPIO Header
CAN
I/F
GPIO 1–5
CAN 2.0 Bus 1
CAN 2.0 Bus 2
Keypad (8 x 8)
GPIO
SPI Bus 3
GPIO
SIM
SIM Socket
DC Power Input
Power
Management
125MB-64GB
NAND Flash
GPIO 1–5
UART A
I
2
C Bus
Sys Mgmt I/O
GPIO
Header
I
2
C Bus
Sys Mgmt I/O
RTC
Sensors
Accelerometer
3.3V Input
Sys Mgmt I/O
I
2
C Bus
GPIO 1–5
I
2
C Bus
USB OTG Port
EIA-232
Power
Management
Peripherals
Header
512MB-4GB
DDR-3 DRAM
BAT
UART 2
Xcvr
USB OTG Circuitry
USB 2.0 OTG
Figure 1. CPU-301-16 Development Kit Block Diagram
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CPU-301-16 Development Kit - User Manual
Features
The following table describes the features of the CPU-301-16 Development Kit and how the design partitions these features across the CPU-301-16 and carrier board.
Feature
Processor
On-board Memory
Serial ATA (SATA)
CPU-301-16
Freescale™ i.MX 6Solo,
Freescale™ i.MX 6DualLite,
Freescale™ i.MX 6Dual, or
Freescale™ i.MX 6Quad
DDR-3 DRAM (512MB–4GB)
RAW NAND flash device (125MB–64GB) eMMC flash device (2GB–64GB)
SATA bus (i.MX 6Dual/6Quad)
Carrier Board
Boot mode configuration switches
Secure Digital (SD)
PCI Express (PCIe)
Universal Serial Bus
(USB)
Serial Ports
Ethernet
Controller Area Network
(CAN)
I
2
C Bus
SD interface (8-bit)
SD interface (4-bit)
PCIe one lane port
USB 2.0 host port signals
USB 2.0 OTG port signals
Up to four TTL-level serial ports:
8-wire
4-wire
Up to two 4-wire
(shared with CMOS Camera)
Gigabit Ethernet with physical layer transceiver
2 x CAN 2.0 bus signals
SATA header with AC coupling and ESD protection microSD socket (4-bit) with power switch
SD socket (4-bit) with power switch
Mini PCIe socket (PCIe, I
2
C, USB, SIM, LEDs) with AC coupling
USB Hub providing 4 USB host ports
3 x USB 2.0 host socket (USB Type A) with host power supply, current limiter, and over-voltage protection
(optional USB host headers)
1 x USB 2.0 OTG port socket (Mini USB Type B) with EMI/ESD protection
EIA-232 and EIA-485 transceivers
1 x EIA-232 header, 8-wire
(shared with debug port on GPIO header)
1 x EIA-232/485 header, 4-wire
1 x EIA-232 and EIA-232/485 header,4-wire
(shared with CMOS Camera)
RJ-45 socket with built-in magnetics, integrated termination, and status LEDs
2 x CAN 2.0 bus headers with level translator, transceiver, common mode filter, and ESD protection
On-board I
2
C devices and external connection on GPIO header
Included on HDMI Micro socket
SPI Bus
Display
Camera Sensors
User Interface
General-purpose I
2
C bus with bus master
HDMI I
2
C bus with bus master
General-purpose SPI bus with bus master
Support for up to two (i.MX 6Solo/6Dual Lite) or four (i.MX 6Dual/6Quad) simultaneous displays
Digital (16-, 18-, or 24-bit RGB)
Two LVDS (18- or 24-bit)
HDMI v1.4
MIPI DSI, two lanes
Backlight control signals
CMOS Camera (8-bit)
MIPI CSI, four lanes
Touch panel controller SPI bus with bus master
8 x 8 Keypad/GPIO signals
External connection on GPIO header
Digital display header with buffers, power switch, termination, and
EMI protection
2 x LVDS display headers with power switch and EMI/ESD protection
HDMI Micro socket with HDMI Transmitter Port Protection and
Interface device
MIPI DSI header with EMI/ESD protection
3 x backlight headers for intensity and on/off
CMOS Camera header with level translator for clock signal and
ESD protection
MIPI Camera header with level translator for I
2
C bus and
EMI/ESD protection
Touch panel header with touch panel controller
8x8 keypad/GPIO header with termination and ESD protection
3 x buttons (Reset, Sleep, and User)
3 x LEDs
10 110127-50001
Product Overview
Feature
Audio
GPIO
System Monitoring
Power Supply
CPU-301-16
Digital audio CODEC interface
Sony Philips Digital Interconnect Format
(S/PDIF)
5 x GPIO
3.3 V main power input supplied by carrier board
Integrated power management
Carrier Board
Stereo CODEC with supporting circuitry for
Line output header
Speaker header
Microphone header
GPIO header with termination and ESD protection
GPIO expansion for LED control
Temperature, voltage, and current sensors
Accelerometer
Real-time clock and battery
12 V main power input supplied by 100-240 VAC power adapter
On-board power supplies and power management
Power state LED
Table 1. CPU-301-16 Development Kit Features
Related Documents
This manual describes the connectivity of Eurotech’s carrier board and is intended for software application developers and system integrators.
For instructions to use the development kit, refer to the CPU-301-16 Development Kit Quick Start
(Eurotech #110125-5001).
For detailed information about the CPU-301-16, refer to the CPU-301-16 Design-In Guide.
(Eurotech #110127-4000).
Check the Eurotech support site ( http://support.eurotech-inc.com/ ) for errata reports and for the latest releases of these documents.
110127-50001 11
CPU-301-16 Development Kit - User Manual
Connectors, Switches, Jumpers, and Indicators
Identifying Connectors
The following diagram illustrates the location and numbering of the connectors on the carrier board.
The CPU-301-16 mates to two docking connectors, J1 and J2, which lie under the module when installed.
J20 J19 J5 J39 J8 J32 J28 JP2 J21
J27
JP1
J9
J14
D66
J1
D47
D46
D45
J7
J6
D56 D57 D58
S1 S2 S3 S4
J48 J51
J2
J37 J4 J3 J50 J49 J45 J29 J47
Figure 2. Connector Location, Top View
SW3 SW2 SW1
J22
J23
J10
J38
J15
J44
J40
J11
J41
J46
J13
12
J31 J30 J43
Figure 3. Connector Location, Bottom View
110127-50001
Connectors, Switches, Jumpers, and Indicators
Switches, Indicators, and Jumpers
This section describes various switches, indicators, and jumpers on the carrier board.
Boot Configuration
S1–S4: Boot Configuration Switches
The configuration switches on the carrier board are used to select a specific boot device using the processor’s BOOT_CFG signals when the module is configured for Internal Boot mode. Two jumpers located on the CPU-301-16 module select the boot mode. For a detailed explanation of Boot Mode
Configuration, refer to the CPU-301-16 Design-In Guide.
The following table describes the mapping of the BOOT_CFG signals to the configuration switches.
When the switch is in an open position, the BOOT_CFG signal is a low logic-level. When the switch is in a closed position, the BOOT_CFG signal is a high logic-level.
Switch
S1 1
S1 2
S1 3
S1 4
S2 1
S2 2
S2 3
S2 4
S3 1
S3 2
S3 3
S3 4
S4 1
S4 2
S4 3
S4 4
Boot Configuration Signal Name
BOOT_CFG1_0
BOOT_CFG1_1
BOOT_CFG1_2
BOOT_CFG1_3
BOOT_CFG1_4
BOOT_CFG1_5
BOOT_CFG1_6
BOOT_CFG1_7
BOOT_CFG2_0
BOOT_CFG2_1
BOOT_CFG2_2
BOOT_CFG2_3
BOOT_CFG2_4
BOOT_CFG2_5
BOOT_CFG2_6
BOOT_CFG2_7
Table 2. Boot Configuration Switches
Default Boot Configuration Setting
The following BOOT CFG signals are set by populating various on-board resistors. The following table describes the default setting. If your application requires different settings, contact your local Eurotech representative.
Boot Configuration Signal Name Logic-level
BOOT_CFG4_0
BOOT_CFG4_1
BOOT_CFG4_2
BOOT_CFG4_3
BOOT_CFG4_4
BOOT_CFG4_5
BOOT_CFG4_7
High
Low
Low
Low
High
Low
Low
Table 3. Default Boot Configuration Settings
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CPU-301-16 Development Kit - User Manual
The following diagram shows the carrier board reference DIP switch settings by boot source.
SD2
S1 S2 S3 S4
SD4
S1 S2 S3 S4 eMMC
S1 S2 S3 S4
Figure 4. Carrier Board Reference Dip Switch Settings
Carrier Board Switches
SW1: Reset
SW1 is the reset button for the CPU-301-16 Development Kit. Pressing SW1 initiates a hardware reset of module circuitry including the processor. Press this button to restart the system without cycling power.
SW2: Sleep
SW2 is the sleep button for the CPU-301-16 Development Kit.
SW3: Button
SW3 is a general-purpose button for the CPU-301-16 Development Kit. The output is connected to
GPIO6_IO3/GPIO_BUTTON (CPU-301-16 module J1 B30).
Carrier Board LED Indicators
D56: GPIO-controlled LED
The carrier board includes one general-purpose red/green light-emitting diode (LED) that is controlled by GPIO signals from the CPU-301-16 module. The following table describes the mapping of the control signals to the LEDs.
LED
D56
Input
Red
Green
Control Signal
GPIO5_IO16/GPIO_LED_RED (J1 B58)
GPIO7_IO2/GPIO_LED_GRN (J1 B59)
D57 and D58: I
2
C bus-controlled LEDs
The carrier board includes two general-purpose red/green light-emitting diodes (LEDs) that are software-controlled using the I
2
C bus. For the I
2
C bus address, see General-Purpose I
Addresses , page 30 . The following table describes the mapping of the control signals to the LEDs.
LED
D57
D58
Input
Red
Green
Red
Green
Control Signal
GPIO Expansion Output 0
GPIO Expansion Output 1
GPIO Expansion Output 2
GPIO Expansion Output 3
14 110127-50001
Connectors, Switches, Jumpers, and Indicators
D66: Power/Sleep LED
The Power/Sleep LED indicates the operational mode and power status as described in the following table.
Color
Green
Red
Mode
Run
Sleep
Power Status
Power on
Power on
D45–D47: Mini PCIe 0 Status LEDs
The three Mini PCIe Status LEDs indicates network connectivity as described in the following table.
LED Type
D45 Green
D46 Green
D47 Green
Description
Indicates Wireless Personal Area Network (WPAN)
Indicates Wireless Local Area Network (WLAN)
Indicates Wireless Wide Area Network (WWAN)
Ethernet LEDs
The LED on the left side of Ethernet socket J5
indicates connection as follows.
Operation
On
Off
Speed (Mbps)
On indicates an active link
No link
The LED on the right side of Ethernet socket J5
indicates connection and activity as follows.
Operation
On
Off
Link/Activity
Blinking indicates Ethernet activity
No activity
Carrier Board Jumpers
JP1: 5V
Type: 2-post header, 2 mm
Jumper JP1 is reserved for future use.
JP2: Touch Panel Configuration Jumper
Type: 2-post header, 2 mm
Jumper JP2 configures the development kit for support of 4-, 5- and 8-wire touch panels as follows.
Jumper Setting
1-2
NC
Configuration
5-wire only support
4- and 8-wire support (default)
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CPU-301-16 Development Kit - User Manual
Signal Headers
The following tables describe the electrical signals available on the connectors of the carrier board.
Each section provides relevant details about the connector including part numbers, mating connectors, signal descriptions, and references to related sections.
For the location of the connectors, see Identifying Connectors , page 12 .
J1: Docking Connector
The CPU-301-16 connector J1 mates to the carrier board connector J1. For details about this connector, refer to the CPU-301-16 Design-In Guide 110127-4000.
J2: Docking Connector
The CPU-301-16 connector J2 mates to the carrier board connector J2. For details about this connector, refer to the CPU-301-16 Design-In Guide 110127-4000.
J3: USB Host 1
Board connector: USB Type A receptacle, Molex 89485-8000
Mating connector: USB Type A plug
The USB socket J3 provides USB Host 1 supporting the USB 2.0 specification at High Speed
(480 Mbps). The connector shield is tied to chassis ground. USB Host 1 is also available on
J4: USB Host 2
Board connector: USB Type A receptacle, Molex 89485-8000
Mating connector: USB Type A plug
The USB socket J4 provides USB Host 2 supporting the USB 2.0 specification at High Speed
(480 Mbps). The connector shield is tied to chassis ground.
J5: Gigabit Ethernet
Board connector: RJ-45 socket with LEDs, Pulse Engineering JK0-0136NL
Mating connector: RJ-45 plug
Socket J5 provides a direct connection to a Gigabit Ethernet network for 10Base-T, 100Base-TX, and
1000Base-T applications. The connector shield is tied to chassis ground.
J6: Line Out
Board connector: 1x4 shrouded header, 1.25 mm, Molex 53398-0471
Mating connector: Molex 51021-0400 series housing
Header J6 provides a stereo line output.
Pin Name
1
2
3
4
LINE_OUT_L
LINE_OUT_SENSE
LINE_OUT_R
AUD_AGND2
Type
AO
AI
AO
P
Description
Line out 1, left channel
Sense
Line out 1, right channel
Audio ground
16 110127-50001
Connectors, Switches, Jumpers, and Indicators
J7: Microphone
Board connector: 1x4 shrouded header, 1.25 mm, Molex 53398-0471
Mating connector: Molex 51021-0400 series housing
Header J7 provides connection to a microphone.
Pin Name
1
2
3
4
MIC_IN_L
AUD_AGND3
MIC_IN_R
AUD_AGND1
Type
AI
P
AI
P
Description
Microphone, left channel
Audio ground
Microphone, right channel
Audio ground
J8: Keypad
Board connector: 2x12 shrouded header, 2.00 mm, Samtec STMM-112-02-T-D-SM
Mating connector: Samtec TCSD series IDC cable assembly socket
The CPU-301-16 Development Kit provides sixteen signals that can be used to support an 8x8 keypad or as general-purpose inputs and outputs (GPIO). These keypad/GPIO signals are available on connector J8.
Pin Name
1
2
3
4
GND
KP_COL0_OUT
5
6
7
8
KP_ROW0_OUT
KP_COL1_OUT
KP_ROW1_OUT
KP_COL2_OUT
KP_ROW2_OUT
KP_COL3_OUT
9 KP_ROW3_OUT
10 KP_COL4_OUT
11 GND
12 GND
13 KP_ROW4_OUT
14 KP_COL5_OUT
15 KP_ROW5_OUT
16 KP_COL6_OUT
17 KP_ROW6_OUT
18 KP_COL7_OUT
19 KP_ROW7_OUT
20 GND
21 GND
22 NC
23 V_3P3V_SW
24 V_3P3V_SW
Type
IO
IO
IO
IO
IO
P
IO
IO
P
P
IO
IO
P
PO
PO
P
IO
IO
IO
IO
IO
IO
IO
Description
Ground
Keypad, Column 0
Keypad, Row 0
Keypad, Column 1
Keypad, Row 1
Keypad, Column 2
Keypad, Row 2
Keypad, Column 3
Keypad, Row 3
Keypad, Column 4
Ground
Ground
Keypad, Row 4
Keypad, Column 5
Keypad, Row 5
Keypad, Column 6
Keypad, Row 6
Keypad, Column 7
Keypad, Row 7
Ground
Ground
Switched 3.3V
Switched 3.3V
J9: SATA
Board connector: 22-position receptacle, 1.27 mm, FCI 10029364-001LF
Mating connector: SATA plug
Header J9 provides connection to a SATA disk drive supporting the Serial ATA II Specification with data transfer rates of up to 3.0 Gbps.
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CPU-301-16 Development Kit - User Manual
J10: JTAG, CMOS Camera, and GPIO
Board connector: 38-position, MICTOR receptacle, 0.025 inch, AMP 2-5767004-2
Mating connector: AMP MICTOR plug
The CPU-301-16 Development Kit provides a full IEEE1149.1 JTAG port, connection to the CMOS
Camera signals, and several GPIO on connector J10.
Pin Name
1
2
3
4
5
6
7
8
24
25
26
27
28
29
30
31
32
33
34
35
NC
NC
NC
NC
GND
CSI_DATA_EN
PULLDN1
PULLDN2
9 JTAG_RST#
10 PULLDN3
11 JTAG_TDO
12 PULLUP1
13 PULLDN4
14 PULLUP2
15 JTAG_TCK
16 UART1_TXD
17 JTAG_TMS
18 KP_ROW7
19 JTAG_TDI
20 KP_COL7
21 JTAG_TRST#
22 KP_ROW6
23 UART5_RTS_CSI_DAT18
GPIO_USR_0 (GPIO5_IO3)
UART4_CTS_CSI_DAT17
KP_ROW5
UART4_RTS_CSI_DAT16
Type
O
I
O
I
IO
I
IO
I
IO
O
I
P
O
GPIO5_IO1/GPIO_nUSB_RST IO
UART5_RXD_CSI_DAT15
PULLDN5
UART5_TXD_CSI_DAT14
PULLDN6
UART4_RXD_CSI_DAT13
PULLUP3
UART4_TXD_CSI_DAT12
36 CSI_HSYNC
37 UART1_RXD
38 CSI_VSYNC
IO
I
IO
O
I
O
I
O
O
I
O
Description
No connection
No connection
No connection
No connection
Ground
CMOS Camera, Data enable
Pulldown resistor, 4.7k
Ω
Pulldown resistor, 4.7k
Ω
JTAG, Reset
Pulldown resistor, 4.7k
Ω
JTAG, Test Data Out
Pullup resistor, 4.7k
Ω to 3.3V
Pulldown resistor, 10k
Ω
Pullup resistor, 4.7k
Ω to 3.3V
JTAG, Test Clock
Serial 1, Transmit Data
JTAG, Test Mode Select
Keypad, Row 7
JTAG, Test Data In
Keypad, Column 7
JTAG, Test Reset
Keypad, Row 6
Serial 5, Request To Send /
CMOS Camera, Data 18
General user I/O
Serial 4, Clear To Send /
CMOS Camera, Data 17
Keypad, Row 5
Serial 4, Request To Send /
CMOS Camera, Data 16
External USB Hub reset
Serial 5, Receive Data /
CMOS Camera, Data 15
Pulldown resistor, 4.7k
Ω
Serial 5, Transmit Data /
CMOS Camera, Data 14
Pulldown resistor, 4.7k
Ω
Serial 4, Receive Data /
CMOS Camera, Data 13
Pullup resistor, 4.7k
Ω to 3.3V
Serial 4, Transmit Data /
CMOS Camera, Data 12
CMOS Camera, Horizontal sync
Serial 1, Receive Data
CMOS Camera, Vertical sync
Notes:
1. Signals connect directly to the docking connectors specified.
J1 A26
J1 A27
J1 A6
J1 A24
J1 B40
J1 A25
J1 A40
J1 A22
J1 B39
J2 A18
J2 B12
J1 A23
J1 A54
J2 A17
J1 B38
J2 A16
J1 A52
J2 A15
J2 A14
J2 A13
J2 A12
J2 B13
J1 A4
J2 B14
18 110127-50001
Connectors, Switches, Jumpers, and Indicators
J11: JTAG (Option)
Board connector: 2x5 socket strip, 0.05 inch, Samtec CLP-105-02-L-D-A
Mating connector: Terminal strip
As an option, header J11 can be populated to provide a JTAG connection.
Pin Name
1
2
3
4
5
JTAG_RST#
JTAG_TRST#
JTAG_TMS
GND
JTAG_TCK
6
7
8
9
GND
JTAG_TDI
GND
JTAG_TDO
10 V_3P3V
Type
I
I
I
P
I
P
I
P
O
PO
Description
JTAG, Reset
JTAG, Test Reset
JTAG, Test Mode Select
Ground
JTAG, Test Clock
Ground
JTAG, Test Data In
Ground
JTAG, Test Data Out
3.3V
J13: Mini PCIe (x1)
Board connector: 52-pin MiniCard, Molex 67910-0001
Mating connector: Mini PCIe card
Socket J13 provides a direct PCIe v2.0, on lane connection to the CPU-301-16 module. The socket
accepts Mini PCIe x1 cards and supports a SIM card interface ( J43 , page 25 ).
J15: Speaker
Board connector: 1x4 shrouded header, 1.25 mm, Molex 53398-0471
Mating connector: Molex 51021-0400 series housing
Header J15 provides the connection to a stereo line output capable of driving powered speakers.
Pin Name
1
2
3
4
SPKR_OUT_R_P
SPKR_OUT_R_N
SPKR_OUT_L_P
SPKR_OUT_L_N
Type
AO
AO
AO
AO
Description
Speaker, right channel positive
Speaker, right channel negative
Speaker, left channel positive
Speaker, left channel negative
J14: USB OTG
Board connector: Mini USB Type B receptacle, FCI 10033526-N3215LF
Mating connector: Mini USB Type B plug
The USB socket J14 provides a USB OTG port supporting the USB 2.0 specification at High Speed
(480 Mbps). USB functionality is automatically selected by the state of the OTG_ID pin in the cable connection. Generic devices automatically drive the OTG_ID pin to ground to cause the port to assume Host functionality. External host port connections must leave this pin open to cause this port to assume Client functionality.
The connector shield is tied to chassis ground.
110127-50001 19
CPU-301-16 Development Kit - User Manual
J19: CAN
Board connector: 2-pin header, 0.1-inch, Molex 22-23-2021
Mating connector: crimp housing, Molex 22-01-2021
Header J19 supplies a CAN bus supporting the CAN 2.0B Protocol Specification with bit rates up to
1 Mbps.
Pin Name
1
2
CAN1_H_OUT
CAN1_L_OUT
Type
IO
Description
CAN 1
J20: CAN
Board connector: 2-pin header, 0.1-inch, Molex 22-23-2021
Mating connector: crimp housing, Molex 22-01-2021
Header J20 supplies a CAN bus supporting the CAN 2.0B Protocol Specification with bit rates up to
1 Mbps.
Pin Name
1
2
CAN2_H_OUT
CAN2_L_OUT
Type
IO
Description
CAN 2
J21: Serial A
Board connector: 2x5 header, 2 mm, Molex 87832-1006
Mating connector: Molex 87568 series wire-to-board IDT housing
Header J21 supports a full-feature EIA-232 serial port.
Pin Name
1
2
3
4
5
6
7
8
9
10
DCD_A
DSR_A
RXD_A
RTS_A
TXD_A
CTS_A
DTR_A
RI_A
GND
NC
Type
I
I
I
O
O
I
O
I
P
Description
Data Carrier Detect
Data Set Ready
Receive Data
Request To Send
Transmit Data
Clear To Send
Data Terminal Ready
Ring Indicator
Ground
J22: Serial B
Board connector: 2x5 header, 2 mm, Molex 87832-1006
Mating connector: Molex 87568 series wire-to-board IDT housing
Header J22 supports an EIA-232/485 serial port.
Pin Name
1
2
NC
NC
3
4
5
6
7
8
9
RXD_485RXN_B
RTS_485TXP_B
TXD_485TXN_B
CTS_485RXP_B
NC
NC
GND
10 NC
Type
I
O
O
I
P
Description
EIA-232
Receive Data
Request To Send
Transmit Data
Clear To Send
Ground
EIA-485
Inverting Receive Data
Non-inverting Transmit Data
Inverting Transmit Data
Non-inverting Receive Data
Ground
20 110127-50001
Connectors, Switches, Jumpers, and Indicators
J23: Serial C and Serial D
Board connector: 2x6 header, 2 mm, Molex 87832-1222
Mating connector: Molex 87568 series wire-to-board IDT housing
Header J23 supports a 4-wire EIA-232 serial port and an EIA-232/485 serial port.
Pin Name
1
2
3
4
RXD_D
RTS_D
TXD_D
CTS_D
5
6
7
8
9
GND
GND
RXD_485RXN_C
RTS_485TXP_C
TXD_485TXN_C
10 CTS_485RXP_C
11 GND
12 GND
Type
P
I
O
O
I
P
I
O
O
I
P
P
Description
EIA-232
Receive Data
Request To Send
Transmit Data
Clear To Send
Ground
Ground
Receive Data
Request To Send
Transmit Data
Clear To Send
Ground
Ground
EIA-485
Ground
Ground
Inverting Receive Data
Non-inverting Transmit Data
Inverting Transmit Data
Non-inverting Receive Data
Ground
Ground
J27: DC Power Input
Board connector: 1x4 header, 3.96 mm, AMP 1-1318300-4
Mating connector: AMP 1-1123722-4 crimp housing
Header J27 accepts +12 VDC input power from an external supply such as the AC power adapter included with the CPU-301-16 Development Kit.
Pin Name
1
2
3
4
GND
GND
V_IN
V_IN
Type
P
P
PI
PI
Description
Ground
Ground
Input power (12 V nominal)
Input power (12 V nominal)
Warning:
Disconnect the power input before removing the module. Removing the module from a powered carrier board may result in damage to both the carrier board and to the module.
J28: Touch Panel (8-wire)
Board connector: 8-pin header, 2.54 mm, Molex 22-11-2082
Mating connector: Molex 22-01-2087 crimp housing
Header J28 supports an 8-wire touch panel. Standard CPU-301-16 Development Kits include a 4-wire touch panel.
4
5
6
7
8
Pin Name
1
2
3
MX_LL
PX_UR
PY_UL
MY_LR
SXM
SXP
SYM
SYP
Type 8-Wire
AIO
AIO
AIO
AIO
AIO
AIO
AIO
AIO
Left
Right
Bottom
Top
Left sense
Right sense
Top sense
Bottom sense
Description
Touch panel
110127-50001 21
CPU-301-16 Development Kit - User Manual
J29: LVDS Display 1
Board connector: 2x10 shrouded header, 2.00 mm, Molex 87832-2020
Mating connector: Molex 87568 series wire-to-board IDT housing
Header J29 provides connection to a LVDS display.
Pin Name
1
2
3
4
5
V_LVDS1_PWR
V_LVDS1_PWR
LVDS1_OUT_TX0_N
GND
GND
6
7
8
9
LVDS1_OUT_TX0_P
LVDS1_OUT_TX1_P
LVDS1_OUT_TX1_N
LVDS1_OUT_TX2_N
10 GND
11 GND
12 LVDS1_OUT_TX2_N
13 LVDS1_OUT_CLK_P
14 LVDS1_OUT_CLK_N
15 GND
16 GND
17 LVDS1_OUT_TX3_N
18 LVDS1_OUT_TX3_P
19 GND
20 GND
Type
O
O
O
O
P
P
PO
PO
O
P
P
O
O
P
P
O
O
O
P
P
Description
Software-controlled 3.3 V
Software-controlled 3.3 V
LVDS data 0, negative
Ground
Ground
LVDS data 0, positive
LVDS data 1, positive
LVDS data 1, negative
LVDS data 2, negative
Ground
Ground
LVDS data 2, negative
LVDS clock, positive
LVDS clock, negative
Ground
Ground
LVDS data 3, negative
LVDS data 3, positive
Ground
Ground
J31: microSD Card
Board connector: microSD card socket, Molex 502570-0893
Mating connector: microSD card
The CPU-301-16 Development Kit provides a microSD card (4-bit) socket on J31 for memory and I/O expansion. Power (3.3 V only) to this socket is software-controlled.
J30: SD Card
Board connector: SD card socket, Molex 67913-0002
Mating connector: SD card
The CPU-301-16 Development Kit provides a SD card (4-bit) socket on J30 for memory and I/O expansion. Power (3.3 V only) to this socket is software-controlled.
J32: LVDS Display 0
Board connector: 2x10 shrouded header, 2.00 mm, Molex 87832-2020
Mating connector: Molex 87568 series wire-to-board IDT housing
Header J32 provides connection to a LVDS display.
Pin Name
1
2
3
V_LVDS0_PWR
V_LVDS0_PWR
4
5
6
7
LVDS0_OUT_TX0_N
GND
GND
LVDS0_OUT_TX0_P
LVDS0_OUT_TX1_P
8
9
LVDS0_OUT_TX1_N
LVDS0_OUT_TX2_N
10 GND
11 GND
12 LVDS0_OUT_TX2_N
13 LVDS0_OUT_CLK_P
14 LVDS0_OUT_CLK_N
Type
O
O
P
P
O
O
O
PO
PO
O
P
P
O
O
Description
Software-controlled 3.3 V
Software-controlled 3.3 V
LVDS data 0, negative
Ground
Ground
LVDS data 0, positive
LVDS data 1, positive
LVDS data 1, negative
LVDS data 2, negative
Ground
Ground
LVDS data 2, negative
LVDS clock, positive
LVDS clock, negative
22 110127-50001
Connectors, Switches, Jumpers, and Indicators
Pin Name
15 GND
16 GND
17 LVDS0_OUT_TX3_N
18 LVDS0_OUT_TX3_P
19 GND
20 GND
Type
P
P
O
O
P
P
Description
Ground
Ground
LVDS data 3, negative
LVDS data 3, positive
Ground
Ground
J37: USB Host 3
Board connector: USB Type A receptacle, Molex 89485-8000
Mating connector: USB Type A plug
The USB socket J37 provides USB Host 3 supporting the USB 2.0 specification at High Speed
(480 Mbps). The connector shield is tied to chassis ground.
J38: GPIO
Board connector: 2x12 shrouded header, 2.00 mm, Samtec STMM-112-02-T-D-SM
Mating connector: Samtec TCSD series IDC cable assembly socket
Header J38 provides connections to the debug port, general-purpose I
2
C bus, general-purpose SPI bus, general-user IO, and power control.
Pin Name
1
2
TXD_B_OUT
RXD_B_OUT
3
4
5
6
7
8
9
USR_SCL_OUT
USR_SDA_OUT
SPI3_MISO_OUT
SPI3_MOSI_OUT
SPI3_RDY_OUT
SPI3_SCLK_OUT
SPI3_SS0_OUT
10 GND
11 GND
12 RESET_BTN_OUT
13 USR_GPIO_0_OUT
14 USR_GPIO_1_OUT
15 USR_GPIO_2_OUT
16 USR_GPIO_3_OUT
17 GND
18 SLEEP_BTN_OUT
19 PMIC_PWR_CYCLE
20 GND
21 ON_STATE
22 WDOG_TIMEOUT_OUT
23 V_3P3V_SW
24 V_5V_SW
Type
O
I
O
IO
I
O
I
O
Description Comments
O
P
P
O
IO
IO
Debug port, Transmit Data
Debug port, Receive Data
I
2
I
2
C clock
C data
SPI 3, Master input
SPI 3, Master output
SPI 3, Ready
SPI 3, Serial clock
SPI 3, Chip select 0
Ground
Ground
Reset
General user I/O
General user I/O
IO
IO
P
O
I
General user I/O
General user I/O
Ground
Sleep
Power reset
P
O
Ground
Power on
O Watchdog timeout
PO Switched 3.3V
PO Switched 5V
Connects to SW1: Reset, page 14
Connects to SW2: Sleep, page 14
Note 4, PMIC_PWR_CYCLE#, J1 B49
Buffered GPIO_ON_STATE, J1 B87
Notes:
2. Signal connects to the connector specified through a 22
Ω series resistor.
3. Signal connects to the connector specified through a 1k
Ω series resistor.
4. Signal connects directly to the docking connectors specified.
110127-50001 23
CPU-301-16 Development Kit - User Manual
J39: Digital Display
Board connector: 2x20 shrouded header, 2.00 mm, Samtec STMM-120-02-T-D-SM
Mating connector: Samtec TCSD series IDC cable assembly socket
To support display devices such as medium resolution LCDs, the CPU-301-16 Development Kit provides a parallel digital display output on header J39.
Pin Name
1
2
GND
GND
3
4
5
6
7
8
9
PNL_HSYNC
PNL_PIXCLK
PNL_VSYNC
GND
PNL_RED0
PNL_RED1
PNL_RED2
10 PNL_RED3
11 PNL_RED4
12 PNL_RED5
13 PNL_RED6
14 PNL_RED7
15 PNL_GREEN0
16 PNL_GREEN1
17 PNL_GREEN2
18 PNL_GREEN3
19 PNL_GREEN4
20 PNL_GREEN5
21 PNL_GREEN6
22 PNL_GREEN7
23 PNL_BLUE0
24 PNL_BLUE1
25 PNL_BLUE2
26 PNL_BLUE3
27 PNL_BLUE4
28 PNL_BLUE5
29 PNL_BLUE6
30 PNL_BLUE7
31 RGB_PNL_PWR
32 RGB_PNL_PWR
33 PNL_RL
34 PNL_UD
35 PNL_ENA
36 PNL_CONTRAST
37 PNL_LBIAS
38 NC
39 GND
40 GND
Type
O
O
O
O
PO
PO
O
O
O
O
O
O
O
O
O
O
O
P
P
P
P
O
O
O
P
O
O
O
O
O
O
O
O
O
O
O
O
O
O
Description
Ground
Ground
Horizontal sync
Pixel clock
Vertical sync
Ground
Red 0
Red 1
Red 2
Red 3
Red 4
Red 5
Red 6
Red 7
Green 0
Green 1
Green 2
Green 3
Green 4
Green 5
Green 6
Green 7
Blue 0
Blue 1
Blue 2
Blue 3
Blue 4
Blue 5
Blue 6
Blue 7
Software-controlled 3.3V
Software-controlled 3.3V
4.7kΩ pull-up to RGB_PNL_PWR
4.7kΩ pull-up to RGB_PNL_PWR
Enable
4.7kΩ pull-up to RGB_PNL_PWR
LCD Bias
Ground
Ground
J40: Backlight 0
Board connector: 7-pin header, 1.25 mm, Molex 53261-0771
Mating connector: Molex 51021-0700 crimp housing
Header J40 provides the signals to control a backlight.
Pin Name
1
2
3
4
5
6
7
V_BL0
V_BL0
GND
GND nBL0_ON
BL_PWM0
GND
Type
PO
PO
P
P
O
O
P
Description
Backlight power (12 V nominal)
Backlight power (12 V nominal)
Ground
Ground
Turns backlight on or off
Controls intensity of the backlight
Ground
24 110127-50001
Connectors, Switches, Jumpers, and Indicators
J41: Backlight 1
Board connector: 7-pin header, 1.25 mm, Molex 53261-0771
Mating connector: Molex 51021-0700 crimp housing
Header J41 provides the signals to control a backlight.
Pin Name
1
2
3
4
5
6
7
V_BL1
V_BL1
GND
GND nBL1_ON
BL_PWM1
GND
Type
PO
PO
P
P
O
O
P
Description
Backlight power (12 V nominal)
Backlight power (12 V nominal)
Ground
Ground
Turns backlight on or off
Controls intensity of the backlight
Ground
J43: SIM
Board connector: SIM card socket, Molex 47553-001
Mating connector: SIM cards
The carrier board includes a standard Subscriber Identity Module (SIM) socket supporting devices requiring secure subscriber identification. This SIM interface connects to the
Mini PCIe socket J13 , page 19 .
J44: CMOS Camera
Board connector: 2x12 shrouded header, 2.00 mm, Samtec STMM-112-02-T-D-SM
Mating connector: Samtec TCSD series IDC cable assembly socket
To support input from a digital camera, the CPU-301-16 Development Kit provides a parallel CMOS camera port on header J44.
Pin Name
1
2
3
4
V_2P8V_SW
V_1P5V_SW
CSI_MCLK_OUT
5
6
7
8
V_1P8V_SW
GND
V_3P3V_SW
CSI0_DAT12_OUT
CSI0_SCL_OUT
9 CSI0_DAT13_OUT
10 CSI0_SDA_OUT
11 CSI0_DAT14_OUT
12 GND
13 CSI0_DAT15_OUT
14 CSI0_DATA_EN _OUT
15 CSI0_DAT16_OUT
16 CSI0_HSYNC_OUT
17 CSI0_DAT17_OUT
18 CSI0_VSYNC_OUT
19 CSI0_DAT18_OUT
20 CSI0_PIXCLK_OUT
21 CSI0_DAT19_OUT
22 CSI0_RST_B_OUT
23 GND
24 CSI0_PWM_OUT
O
O
P
O
O
P
O
O
P
O
O
O
O
Type
PO
PO
O
PO
P
PO
O
O
O
IO
Description
Switched 2.8V
Switched 1.5V
Clock
Switched 1.8V
Ground
Switched 3.3V
Data 12
I
2
C clock
(Connects to general-purpose I
2
C bus)
Data 13
I
2
C data
(Connects to general-purpose I
2
C bus)
Data 14
Ground
Data 15
Data enable
Data 16
Horizontal sync
Data 17
Vertical sync
Data 18
Pixel clock
Data 19
Reset
Ground
PWM
110127-50001 25
CPU-301-16 Development Kit - User Manual
J45: MIPI Camera
Board connector: 2x12 shrouded header, 2.00 mm, Samtec STMM-112-02-T-D-SM
Mating connector: Samtec TCSD series IDC cable assembly socket
The CPU-301-16 Development Kit includes a two lane Mobile Industry Processor Interface (MIPI)
Camera Serial Interface (CSI) on header J45.
Pin Name
1
2
3
4
V_2P8V_SW
V_1P5V_SW
GND
5
6
7
8
V_1P8V_SW
CSI_D0P_OUT
V_3P3V_SW
CSI_D0M_OUT
CSI_SCL_OUT
9 GND
10 CSI_SDA_OUT
11 CSI_D1P_OUT
12 GND
13 CSI_D1M_OUT
14 CSI_RST_B_OUT
15 GND
16 CSI_PWM_OUT
17 CSI_CLK0P_OUT
18 GND
19 CSI_CLK0M_OUT
20 NC
21 NC
22 NC
23 GND
24 NC
P
O
P
O
P
O
O
P
O
O
Type
PO
PO
P
PO
O
PO
O
O
P
IO
Description
Switched 2.8V
Switched 1.5V
Ground
Switched 1.8V
Data 0 positive
Switched 3.3V
Data 0 negative
I
2
C clock
(Connects to general-purpose I
2
C bus)
Ground
I
2
C data
(Connects to general-purpose I
2
C bus)
Data 1 positive
Ground
Data 1 negative
Reset
Ground
PWM
Clock positive
Ground
Clock negative
Ground
J46: Backlight 2
Board connector: 7-pin header, 1.25 mm, Molex 53261-0771
Mating connector: Molex 51021-0700 crimp housing
Header J46 provides the signals to control a backlight.
1
2
3
4
5
Pin Name
V_BL2
V_BL2
GND
6
7
GND nBL2_ON
BL_PWM0
GND
Type
PO
PO
P
P
O
O
P
Description
Backlight power (12 V nominal)
Backlight power (12 V nominal)
Ground
Ground
Turns backlight on or off
Controls intensity of the backlight
Ground
26 110127-50001
Connectors, Switches, Jumpers, and Indicators
J47: MIPI Display
Board connector: 2x12 shrouded header, 2.00 mm, Samtec STMM-112-02-T-D-SM
Mating connector: Samtec TCSD series IDC cable assembly socket
The CPU-301-16 Development Kit provides a Mobile Industry Processor Interface (MIPI) Display Serial
Interface (DSI) on header J47 supporting displays in handheld or mobile devices.
Pin Name
1
2
3
4
V_5V_SW
V_3P3V_SW
GND
5
6
7
8
NC
DSI_D0P_OUT
GND
DSI_D0M_OUT
DSI_SCL_OUT
9 GND
10 DSI_SDA_OUT
11 DSI_D1P_OUT
12 GND
13 DSI_D1M_OUT
14 DSI_RST_B_OUT
15 GND
16 DSI_PWR_EN_OUT
17 DSI_CLK0P_OUT
18 NC
19 DSI_CLK0M_OUT
20 GND
21 GND
22 NC
23 NC
24 NC
O
P
O
O
P
O
O
O
P
P
Type
PO
PO
P
O
P
O
O
P
IO
Description
Switched 5V
Switched 3.3V
Ground
Data 0 positive
Ground
Data 0 negative
I
2
C clock
(Connects to general-purpose I
2
C bus)
I
Ground
2
C data
(Connects to general-purpose I
2
C bus)
Data 1 positive
Ground
Data 1 negative
Reset
Ground
Power enable
Clock positive
Clock negative
Ground
Ground
J48: USB Host 3 (Option)
Board connector: 1x4 shrouded header, 1.25 mm, Molex 53398-0471
Mating connector: housing, Molex 51021-0400
As an option, header J48 can be populated to provide connection to USB Host 3.
Pin Name
1
2
3
4
GND
HUB3_USB_P_OUT
HUB3_USB_N_OUT
V_5V_HOST3
Type Description
P
IO
Ground
USB Host 3
PO 5 V DC power output
J49: HDMI Display
Board connector: HDMI Micro socket, Molex 46765-2001
Mating connector: HDMI Micro cable assembly
Micro socket J49 provides a standard Micro HDMI connection.
110127-50001 27
CPU-301-16 Development Kit - User Manual
J50: USB Host 1 (Alternate)
Board connector: 1x4 shrouded header, 1.25 mm, Molex 53398-0471
Mating connector: housing, Molex 51021-0400
In addition to USB socket J3 , page 16 , USB Host 1 is available on header J50.
Pin Name
1
2
3
4
GND
HUB1_USB_P_OUT
HUB1_USB_N_OUT
V_5V_HOST1
Type Description
P
IO
Ground
USB Host 1
PO 5 V DC power output
J51: USB Host 2 (Option)
Board connector: 1x4 shrouded header, 1.25 mm, Molex 53398-0471
Mating connector: housing, Molex 51021-0400
As an option, header J51 can be populated to provide connection to USB Host 2.
Pin Name
1
2
3
4
GND
HUB2_USB_P_OUT
HUB2_USB_N_OUT
V_5V_HOST2
Type Description
P
IO
Ground
USB Host 2
PO 5 V DC power output
28 110127-50001
System Specifications
System Specifications
Power Supply
The CPU-301-16 Development Kit accepts input power on header J27 , page 20 .
Parameter Min Typ. Max Symbol
AC Power Adapter
V
OUT
I
OUT
Supply voltage 6 12
0.6
18
Units
V
A
Electrical
This section provides electrical specifications for the CPU-301-16 Development Kit.
GPIO Header
Symbol Parameter
USR_SCL_OUT, USR_SDA_OUT
F
USR_SCL_OUT
Bus clock
R
PU
V
PU
V
OH
SPI bus, USR_GPIO_x_OUT (note 6)
V
IH
V
IL
High-level input voltage
Low-level input voltage
High-level output voltage
IOH = -1 mA
V
OL
Low-level output voltage
IOL = 1 mA
R
DRV
Output driver impedance
Single-ended
Min
2.3
0
3.2
Typ.
100
10
50
Max
400
3.3
3.3
1
0.15
Units kHz kΩ
V
V
V
V
V
Ω
Notes:
5. Pull-up resistors included on module.
6. Specifications per the Freescale Semiconductor i.MX 6Dual/Quad Applications Processor Data Sheet, Rev. 1,
11/2012, Document Number: IMX6DQCEC, www.freescale.com
.
USB Host Ports
Symbol
USB Host Ports
I
USB
Parameter
USB current
Min Typ. Max
500
Units mA
Audio Interface
Symbol
V
IN
Gain
IN
R
IN
Parameter
Full scale input voltage
Microphone boost
Input impedance
Min
0
Typ.
500
60
Max
24
Units mVrms dB kΩ
V
OUT
Full scale output voltage,
10kΩ/50pF load
0.96 Vrms
P
OUT
Output power,
4Ω load, 1% Total Harmonic
Distortion Plus Noise
1.75 W
Note:
7. Specifications per the Wolfson Microelectronics WM8962 Ultra-Low Power Stereo Codec Production Data,
April 2013, Rev 4.1, www.wolfsonmicro.com
.
110127-50001 29
CPU-301-16 Development Kit - User Manual
General
This section provides general specifications for the CPU-301-16 Development Kit.
General-Purpose I
2
C Bus Addresses
Carrier Board I2C Device
Stereo CODEC
Accelerometer
GPIO Expansion
(general-purpose LEDs)
Board Voltage and Current
Sensor
Temperature Sensor
Real-time Clock
Mini PCIe socket
MIPI Camera
MIPI Display
CMOS Camera
Address
0011 0100
0011 0101
0011 1010
0011 1011
0100 0000
0100 0001
1000 0010
1000 0011
1001 0000
1001 0001
1101 1110
1101 1111
User-defined
User-defined
User-defined
User-defined
Table 4. General-purpose I
2
C Bus Addresses
Function
Write
Read
Write
Read
Write
Read
Write
Read
Write
Read
Write
Read
30 110127-50001
Appendix A – Reference Information
Appendix A – Reference Information
Product Information
Product notices, updated drivers, support material: www.eurotech.com
Processor i.MX 6 Solo/6Dual/6Quad Applications Processors and Power Management Integrated
Circuit data sheets: www.freescale.com
SATA
Serial ATA specification: www.sata-io.org
USB
Universal Serial Bus specification: www.usb.org
SD Card
SD Card Association and SDIO specification: www.sdcard.org
PCI SIG
MDI
CAN
CAN specification: www.semiconductors.bosch.de
I
2
C Bus
I
2
C bus specification: www.nxp.com
HDMI
Gigabit Ethernet Physical Layer Transceiver and Media Dependent Interface: www.micrel.com
HDMI specification: www.hdmi.org
MIPI
PCI Express specification: www.pcisig.com
MIPI DSI and MIPI CSI specification: www.mipi.org
110127-50001 31
CPU-301-16 Development Kit - User Manual
Appendix B – Board Revision
This manual applies to the current revision of the CPU-301-16 Development Kit carrier board as given in the following sections.
For the CPU-301-16 revision history, refer to the CPU-301-16 Design-In Guide (Eurotech #110127-
4000).
Identifying the Board Revision
The revision number of the carrier board is printed on the printed wiring board. That number is
170127-500Rx, where "x" is the revision level of the PWB.
Carrier Board Revision History
The following is an overview of the revisions to the carrier board.
Revision 1
Initial release
32 110127-50001
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- CPU-301-16 Module
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