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TB67S111PG
TOSHIBA BiCD Integrated Circuit Silicon Monolithic
TB67S111PG
Full parallel controlled solenoid driver / unipolar motor driver
The TB67S111PG is a solenoid driver /unipolar motor driver for full parallel
input.
Using the BiCD process, the power supply voltage of 45 V, the output
voltage of 80 V, and the output current of 1.5 A/ch (absolute maximum
rating) are realized.
Features
Weight: 1.11 g (typ.)
• BiCD integrated circuit silicon monolithic.
• Capable of driving up to four solenoids simultaneously. (4-ch sink driver)
• Capable of driving a unipolar stepping motor with a single chip.
• Built-in over current detection (automatic return / time control) at each output.
• Built-in thermal shutdown detection (automatic return / time control), which detects errors of the whole device.
• Output (ERR) pin for thermal shutdown signal.
• Built-in output MOSFET for low ON resistance (0.25 Ω (typ.)).
• High voltage and large current (as for specifications, please refer to the absolute maximum ratings and
operation ranges).
• Built-in abnormal detection functions (thermal shutdown detection (TSD), over current detection (ISD), and
undervoltage detection (POR)).
• Built-in VCC regulator for internal circuit control, capable of being used as the pull-up point of an error output
function.
Note: Please be careful about the thermal conditions during use.
© 2017
Toshiba Electronic Devices & Storage Corporation
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TB67S111PG
Pin Assignment
(Top View)
VCC
1
16
VM
ERR
2
15
COM
IN1
3
14
OUT1
GND
4
13
GND
GND
5
12
GND
IN2
6
11
OUT2
IN3
7
10
OUT3
IN4
8
9
OUT4
TB67S111PG
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Block Diagram
(Top View)
VCC
1
ERR
2
IN1
3
GND
4
GND
5
IN2
6
IN3
7
IN4
8
VCCREG
POR
TSD
ISD
Logic
ISD
ISD
ISD
16
VM
15
COM
14
OUT1
13
GND
12
GND
11
OUT2
10
OUT3
9
OUT4
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
IC considerations
All the grounding wires of the device must run on the solder mask on the PCB and be externally terminated at only
one point. Also, a grounding method should be considered for efficient heat dissipation.
Careful attention should be paid to the layout of the output, VM and GND traces, to avoid short circuits across
output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently damaged.
Also, the utmost care should be taken for pattern designing and implementation of the device since it has power
supply pins (VM, OUT, GND, etc.) through which a particularly large current may run. If these pins are wired
incorrectly, an operation error may occur or the device may be destroyed.
The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current running
through the IC that is larger than the specified current. Careful attention should be paid for IC pattern design and
mounting method.
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Pin Function Description
Function description (Pin No. 1 to 16)
Pin No.
Pin name
Function
1
VCC
Voltage monitor pin for internal regulator
2
ERR
Output pin for thermal shutdown signal
3
IN1
OUT1 output control pin
4
GND
GND pin
5
GND
GND pin
6
IN2
OUT2 output control pin
7
IN3
OUT3 output control pin
8
IN4
OUT4 output control pin
9
OUT4
Output pin 4
10
OUT3
Output pin 3
11
OUT2
Output pin 2
12
GND
GND pin
13
GND
GND pin
14
OUT1
Output pin 1
15
COM
COM pin
16
VM
Connection pin for motor power supply
* All the grounding wires of the device must run on the solder mask on the PCB and be externally terminated at only
one point. Also, a grounding method should be considered for efficient heat dissipation.
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TB67S111PG
Input / Output Equivalent Circuit
IN1
IN2
IN3
IN4
Input / output signal
Equivalent circuit
1 kΩ
Logic
input
Digital input (VIH/VIL)
pin
100 kΩ
Pin name
VIH: 2.0 V (min) to 5.5 V (max)
VIL: 0 V (min) to 0.8 V (max)
GND
ERR
ERR
Digital output VOD(L)
(Pull-up resistance: 10 kΩ to 100 kΩ)
GND
VCC
VCC
VCC voltage range
4.75 V (min) to 5.0 V (typ.) to 5.25 V
(max)
GND
COM
OUT1
OUT2
OUT3
OUT4
GND
COM
Output pin
Output pin
VM voltage operation range
10 V (min) to 40 V (max)
OUT pin withstanding voltage
10 V (min) to 80 V (max)
GND
* The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
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Functional Description
Relation between logic inputs and output MOSFET
Logic input
IN1
L
H
L
L
L
H
IN2
L
L
H
L
L
H
IN3
L
L
L
H
L
H
IN4
L
L
L
L
H
H
OUT1
Off
On
Off
Off
Off
On
Output MOSFET
OUT2
OUT3
Off
Off
Off
Off
On
Off
Off
On
Off
Off
On
On
OUT4
Off
Off
Off
Off
On
On
Output pin for thermal shutdown detection signal (ERR output function)
ERR
Function
H
Normal operation
L
Thermal shutdown detection (TSD): active
Note: ERR pin is the Nch MOS output pin of open drain type. When using this function, please pull up the voltage
level of the ERR pin to VCC. It is in the Hi-Z state (internal MOS = OFF) in the normal operation. It outputs
low (internal MOS = ON) when the thermal shut down detection (TSD) is active.
When the thermal shutdown detection is cleared, the ERR pin outputs high level again (internal MOS = OFF).
Moreover, when the ERR pin is not used, please leave this pin open.
VCC
Pull-up resistor
(10 kΩ to 100 kΩ)
Output (ERR) pin for thermal shutdown signal
ERR logic
[MOSFET for thermal shutdown signal]
ON: TSD is active.
OFF: Normal operation
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Absolute Maximum Ratings (Ta=25°C)
Characteristics
Symbol
Rating
Unit
VM (max)
45
V
Difference voltage between VM and COM
VDIFF (max)
45
V
Motor output voltage
VOUT (max)
80
V
Motor output current (per one channel)
IOUT (max)
1.5
A
Internal logic power supply
VCC (max)
6.0
V
VIN(H) (max)
6.0
V
VIN(L) (min)
-0.4
V
ERR output pin voltage range
VOD (max)
6.0
V
ERR output pin inflow current range
IOD (max)
20
mA
Motor power supply VM
Logic input voltage
1.47 (Note 1)
Power dissipation (standalone)
PD
W
Operating temperature
Topr
-20 to 85
°C
Storage temperature
Tstr
-55 to 150
°C
Junction temperature
Tj (max)
150
°C
2.7 (Note 2)
Note 1: Standalone. When Ta exceeds 25°C, derating with 11.8 mW/°C is necessary.
Note 2: On PCB (size: 50 mm × 50 mm × 1.6 mm, Cu area: 50 %, single-side glass epoxy). When Ta exceeds 25°C,
derating with 21.6 mW/°C is necessary.
Absolute maximum ratings
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings. Exceeding the rating (s) may cause device breakdown, damage or
deterioration, and may result in injury by explosion or combustion, including peripheral circuits and parts. The
value of even one parameter of the absolute maximum ratings should not be exceeded under any circumstances. The
device does not have overvoltage detection circuit. Therefore, the device is damaged if a voltage exceeding its rated
maximum is applied. All voltage ratings, including supply voltages, must always be followed. The other notes and
considerations described later should also be referred to.
Operation Ranges (Ta=-20 to 85°C)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
VM
―
10
―
40
V
Motor output voltage
VOUT
―
0
―
80
V
Motor output current
IOUT
Ta=25°C, per one channel
―
0.75
1.5
A
Internal logic power supply voltage
VCC
―
4.75
5.0
5.25
V
VIN(H)
Logic input high level
2.0
―
5.5
V
VIN(L)
Logic input low level
0
―
0.8
V
Motor power supply VM
Logic input voltage
Note: Please use the device with extra margin regarding the absolute maximum ratings. Moreover, please pay
attention to the thermal conditions enough during use.
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Electrical Characteristics 1 (Ta=25°C and VM=24 V, unless otherwise specified.)
Characteristics
Symbol
Logic input voltage
Input hysteresis voltage
Logic input current
Test condition
Min
Typ.
Max
Unit
VIH
Logic input voltage High level (Note)
2.0
―
5.5
V
VIL
Logic input voltage Low level (Note)
GND
―
0.8
V
Logic input pin (Note)
100
―
300
mV
VIN(HYS)
High
IIN(H)
Logic input voltage High level (VIN=3.3 V)
―
33
55
μA
Low
IIN(L)
Logic input voltage Low level (VIN=0 V)
―
―
1
μA
―
3.0
5.0
mA
IM consumption current
Remaining voltage of ERR
output
IM
Output pins: open, in normal operation,
motor output-stage operation
VOD(L)
IOD=10 mA
0
―
0.5
V
VFN
IOUT=1.5 A
0.9
1.1
1.5
V
Ileak
VOUT=80 V, Output MOSFET: OFF
―
―
1
μA
IOUT=1.5 A
―
0.25
0.35
Ω
Regenerative diode forward
voltage
Output MOSFET
OFF leakage current
Output MOSFET
Between drain and source
On-resistance
RON
(D-S)
Note: VIH is defined as the VIN voltage that causes the outputs to change when the voltage of the test pin is
gradually raised from 0 V.
VIL is defined as the VIN voltage that causes the outputs to change when the voltage of the pin is then
gradually lowered. The difference between VIL and VIH is defined as the input hysteresis(VIN(HYS)).
Electrical Characteristics 2 (Ta=25°C and VM=24 V, unless otherwise specified.)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
―
2.5
5.0
mA
VCC pin current
ICC
4.75 V≤VCC≤5.25 V
Temperature threshold of thermal
shutdown detection (TSD) (Note 1)
TjTSD
―
155
170
185
°C
VM recovery voltage
VMR
―
7.0
8.0
9.0
V
Over current detection (ISD) threshold
(Note 2)
ISD
(Design value)
2.1
3.0
5.0
A
Note 1: Thermal shutdown (TSD)
When the junction temperature of the IC reaches the TSD threshold, the TSD circuit operates and turns off
the output transistors. Noise rejection blanking time is provided to avoid misdetection by switching. The IC
operation recovers automatically after specified recovery time passes. The TSD circuit is a backup function to
detect a thermal error, therefore it is not recommended to be used aggressively.
Note 2: Over-current detection (ISD)
When the output current reaches the threshold, the ISD circuit operates and turns off the output transistors.
Noise rejection blanking time is provided to avoid misdetection by switching. The IC operation recovers
automatically after specified recovery time passes.
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TB67S111PG
Cautions on over current detection (ISD) and thermal shutdown detection (TSD)
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an
output short-circuits; they do not necessarily guarantee the complete IC safety. If the device is used beyond the
specified operating ranges, these circuits may not operate properly: then the device may be damaged due to an
output short-circuit. The ISD circuit is only intended to provide a temporary protection against an output
short-circuit. If such condition persists for a long time, the device may be damaged due to overstress. Overcurrent
conditions must be removed immediately by external hardware.
Back-EMF
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the motor
current recirculates back to the power supply due to the effect of the motor back-EMF. If the power supply does not
have enough sink capability, the power supply and output pins of the device might rise above the rated voltages. The
magnitude of the motor back-EMF varies with usage conditions and motor characteristics. It must be fully verified
that there is no risk that the device or other components will be damaged or fail due to the motor back-EMF.
IC mounting
Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or
deterioration of the device.
AC Electrical Characteristics (Ta=25°C and VM=24 V, unless otherwise specified.)
Characteristics
Symbol
Test condition
Min
Typ.
Max
Unit
Minimum pulse width of logic
tIN(twp)
(Design value)
1.0
―
―
μs
input
tIN(twn)
(Design value)
1.0
―
―
μs
Output MOSFET switching
tr
―
0.05
0.10
0.15
μs
characteristics
tf
―
0.05
0.10
0.15
μs
Output MOSFET response
tpLH(IN)
Between IN and OUT
0.20
0.70
1.20
μs
characteristics
tpHL(IN)
Between IN and OUT
0.20
0.70
1.20
μs
OSCS frequency
fOSCS
―
5120
6400
7680
kHz
tISD(mask)
fOSCS(=6.4 MHz)×8 clk
1.0
1.25
1.5
μs
―
―
260
320
390
μs
tTSD(mask)
fOSCS(=6.4 MHz)×32 clk
4.0
5.0
6.0
μs
―
―
260
320
390
μs
Over current detection (ISD)
masking time
Off time after over current
detection (ISD)
Thermal shutdown detection
(TSD) masking time
Off time after thermal shutdown
detection (TSD)
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AC Characteristics Timing chart
tIN(twn)
[IN]
50 %
50 %
50 %
tIN(twp)
tpLH(IN)
tpHL(IN)
[OUT]
90 %
90 %
50 %
50 %
10 %
10 %
tr
tf
Timing charts may be simplified for explanatory purposes.
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Application Circuit Example
47 μF
(Top View)
0.1 μF
1
2
VCC
ERR
VM
16
COM
15
14
ZD
CPU
47 kΩ
3
IN1
OUT1
4
GND
GND
5
GND
GND
6
IN2
OUT2
7
IN3
OUT3
10
8
IN4
OUT4
9
13
12
11
24 V
The application circuits shown in this document are provided for reference purposes only, and are not guaranteed for
mass production.
As for zener diodes, recommended zener voltage is higher than VM.
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Package Dimensions
DIP16-P-300-2.54A
Unit: mm
Weight: 1.11 g (typ.)
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Notes on Contents
1.
Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2.
Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3.
Timing Charts
Timing charts may be simplified for explanatory purposes.
4.
Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation
is required, especially at the mass-production design stage.
Providing these application circuit examples does not grant a license for industrial property rights.
IC Usage Considerations
Notes on handling of ICs
(1)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause
device breakdown, damage or deterioration, and may result in injury by explosion or combustion.
(2)
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the
case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead to smoke or ignition. To minimize the effects of the flow of a large current in the
case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit
location, are required.
(3)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in
protection functions. If the power supply is unstable, the protection function may not operate, causing
IC breakdown. IC breakdown may cause injury, smoke or ignition.
(4)
Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative
terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in
injury by explosion or combustion.
In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is
applied even just once.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as from input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load
(BTL) connection-type IC that inputs output DC voltage to a speaker directly.
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TB67S111PG
Points to remember on handling of ICs
Overcurrent detection Circuit
Overcurrent detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the overcurrent detection circuits operate against the overcurrent, clear the overcurrent status
immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the
overcurrent detection circuit to operate improperly or IC breakdown may occur before operation. In addition,
depending on the method of use and usage conditions, if overcurrent continues to flow for a long time after
operation, the IC may generate heat resulting in breakdown.
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits
operate against the over-temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the
thermal shutdown circuit to operate improperly or IC breakdown to occur before operation.
Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is
appropriately radiated, in order not to exceed the specified junction temperature (Tj) at any time or under any
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to
decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take
into consideration the effect of IC heat radiation with peripheral components.
Back-EMF
When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power
supply owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s
motor power supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To
avoid this problem, take the effect of back-EMF into consideration in system design.
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TB67S111PG
RESTRICTIONS ON PRODUCT USE
Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.
Hardware, software and systems described in this document are collectively referred to as “Product”.
•
TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
•
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
•
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions
of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application
notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU
USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
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Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
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Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
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The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
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ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF
SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES
OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION
AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS
RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
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Do not use or otherwise make available Product or related software or technology for any military purposes, including without
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technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
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Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of
Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled
substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR
LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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