User manual | t2 5500t Phase Change Material PCM dp 5-2002s

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Thermally Conductive Phase Change Material
5500T
Preliminary Technical Data
June 2002
è Product Note: 5500T is under restricted test market release and material performance properties and/or formulation is subject to change.
Product Description
Product
Constructions
3M™ Thermally Conductive Phase Change Material (PCM) 5500T is designed to provide a
preferential heat-transfer path between heat-generating components and heat sinks, heat
spreaders or other cooling devices (e.g., fans, heat pipes).
•
The 5500T PCM is a specially designed PCM that has a “Phase Change” that occurs at
approximately 50C. The phase change that occurs takes the 5500T from a modestly firm
film at below 50C and allows the 5500T to soften above 50C so that the 5500T can flow
and fill voids and cavities uniformly. The removal of air spaces greatly improves the
thermal flow of energy between a hot and cool side of a heat dissipating system.
•
The 5500T has excellent room temperature handling performance. The 5500T will not
easily crack or fall apart during handling or assembly.
•
Due to the integrity of the 5500T’s polymer system, the 5500T will resis t scratching and
thus improve application of the 5500T to a substrate and subsequent handling.
Preventing scratches improves yields and ultimate thermal performance as more material
is available for uniform space filling.
•
The specialized organic chemistry of the 5500T provides for good thermal stability of
the base polymer.
•
The 5500T offers good thermal conductivity. 5500T is not intended to be an electrical
insulator as the melt temperature is approximately 50C. If electrical insulation is needed,
the 5500T can be used with an electrically insulating film layer that will not melt at the
range of temperatures that the 5500T could be exposed to in the intended application.
•
The 5500T has slight tack to allow pre-assembly. The product does not have high
adhesion performance so that a mechanical means to support the assembly is required.
5500T
Color
White
Tape Type
Filled Polyolefin Polymer
Tape Thickness
0.15mm (5.9mils) and 0.25 mm (9.8mils)
Filler Type
Ceramic
Liner Type
2 liners: Silicone Coated Polyester Liner
Liner Thickness
< 0.15mm
Liner
1
5500T
Phase Change Material
5500T
Typical Properties
and Performance
Characteristics
Note: The following technical information for 3M™ Phase Change Material 5500T
should be considered representative or typical only, and should not be used for
specification purposes.
è Product Note: 5500T is under restricted test market release and material performance properties and/or formulation is subject to change.
Property
Value
Method
Product Number
5500T
Thermal Impedance ( C-cm2 /W)
See Graphs
3M TM
Thermal Conductivity (W/m-K)
2.5
3M TM
Melting Temperature
Approximately 50C
3M TM-DSC
Operating Temperature Range
-30 to 100C
12 months from date of manufacture
when stored at 25C and 50% relative
humidity in it’s original packaging
Less than 35C, No direct sunlight
----------
500 (Estimate)*
Low. 5500T is not to be used as the
primary attachment means between
two surfaces
Slight tack at room temperature
ASTM-D149
Shelf Life
Preferred Storage Conditions
Dielectric Strength (Volts/mil)
Peel Strength
Adhesion
-----------------
------------------
* 5500T is not intended to be an electrical insulator as the product has a melting temperature of
approximately 50C. If the product melts, the 5500T’s application thickness could change leading to a
change in the application electrical insulation performance. If electrical insulation is needed, the 5500T
can be used with an insulating layer that will not melt at the application temperatures. Films such as
polyester or polyimide have melting temperatures above the 5500T.
Thermal Impedance Change with Time:
Using the 3M thermal impedance test set-up, 30W of power is applied to a test plate for 30 minutes that is
under 40N/cm2 pressure. The test data shows that with time the 3M PCM 5500T will perform similarly to a
1.6 W/m-K thermal conductivity grease
Thermal Impedance (C-cm2 /W)
1.8
5500T 0.15mm
5500T 0.25mm
1.6
Thermal Grease
1.4
1.2
1
0
5
10
15
Time (minutes)
2
20
25
30
Phase Change Material
5500T
Note: The following technical information for 3M™ Phase Change Material 5500T
should be considered representative or typical only, and should not be used for
specification purposes.
Typical Properties
and Performance
Characteristics
Thermal Impedance versus Force:
Using the 3M thermal impedance test set-up, 20W of power is applied for 30 minutes to a test plate that is
under a varying pressure. The test data shows that with time the 3M PCM 5500T will perform similarly to
a 1.6 W/m-K thermal conductivity grease
Thermal Impedance (C-cm2/W)
2
5500T 0.15mm
5500T 0.25mm
Thermal Grease
1.8
1.6
1.4
1.2
1
0
10
20
30
40
50
60
70
80
Force (N/cm2)
Thickness versus Force:
Using the 3M thermal impedance test set-up, 20W of power is applied for 30 minutes to a test plate that is
under a varying pressure. The test data shows that with force the 3M Phase Change Materials 5500T will
relax as noted.
0.3
5500T 0.25mm
5500T 0.15mm
Thickness (mm)
0.25
0.2
0.15
0.1
0.05
0
10
20
30
40
Force (N/cm2)
3
50
60
70
Phase Change Material
5500T
Note: The following technical information for 3M™ Phase Change Material 5500T
should be considered representative or typical only, and should not be used for
specification purposes
Typical Properties
and Performance
Characteristics
Basic Test Set-up for Thermal Impedance and Force Measurements:
Test data was collected after 30 minutes of time in a given test set-up. Typical sample size
was 10mm x 11mm.Typical power applied was 20W.
Force
Resistor
Heat Barrier
Test Material
Thermocouple
Aluminum Plate
Water Cooling
Thermal Test Holder:
Resistor with a test sample and an aluminum plate were placed into an thermal chamber
using a test clamp. Assembly was heat aged as required. Sample was then removed from the
chamber and the clamp removed. Assembly then tested in the “Basic Test Set-up for
Thermal Impedance and Force Measurements” configuration at 40N/cm2 and 20W.
Resistor
Test Sample
Clamp
Aluminum Plate
Thermal Testing:
Test data was collected periodically after a portion of the thermal test cycle was complete.
Samples held in thermal test holder in vertical or horizontal position. Power applied was 20W.
Clamping pressure was 40N/cm2.
1.6
5500T 0.15mm Held Horizontal @ 130C
1.5
Thermal Impedance (C-cm2/W)
Thermal Impedance (C-cm2/W)
1.6
5500T 0.15mm Held Vertical @ 130C
1.4
1.3
1.2
1.1
1
5500T 0.15mm Horizontal @ Cycling
([email protected] [email protected])
1.5
1.4
1.3
1.2
1.1
1
0
100
200
300
400
500
600
Time (Hours)
700
800
900
1000
0
4
10
20
30
40
50
60
70
Cycles (-20C for 1hr / 100C for 1hr)
80
90
100
Phase Change Material
5500T
Note: The following technical information for 3M™ Phase Change Material 5500T
should be considered representative or typical only, and should not be used for
specification purposes
Typical Properties
and Performance
Characteristics
Outgassing:
A sample of the 5500T was placed into a test chamber and heated at 100C for 10minutes.
The outgassed components were analyzed using Dynamic Head Space GC/MS with a
pentadecane reference standard.
Outgassing 5500T
Outgass Component
Amount ( ppm )
Hydrocarbon
Typical
Application
Configuration
700
Other
---------
Total
700
Typical Application Configuration Suggestions:
è User to Verify Specific End Use Application Requirements
The 5500T is used as the thermal interface material between a hot surface and a cooling
surface to aid in the transfer of heat by creating an interface with minimal air gaps. The
assembly using the 5500T must be under a degree of pressure or force to ensure good
contact between the 5500T and the hot and cool surfaces. The force can be applied by some
mechanical means such as clips, screws or other fas tening or closure method.
Mechanical attachment (clips, screws)
Attach
Heat Sink
5500T
IC
PCB
Suggested application assembly configurations should provide for a flexible force application
means so that upon heating the assembly force retention upon the 5500T will be greater then
approximately 20 N/cm 2 and less then approximately 40N/cm 2. The 5500T will stress relax
and melt upon heating. The melting temperature of the 5500T is approximately 50C. The
melting and softening of the polymer allows for a degree of flow and reduced modulus to
provide for enhanced gap filling and intimate contact at surfaces. Upon heating above the
melting temperature of the 5500T, the 5500T could be reduced in thickness by 10-40% or
more depending on the application force applied.
Requirements for a successful application using the 5500T include:
è Flexible and constant application force after the 5500T experiences thermal cycles above
the melting temperature that hold a force in the approximate 20-40N/cm 2 range.
è Correct thickness of the 5500T to provide sufficient material to fill all available voids or nonuniformities or non-flatness conditions between desired surfaces.
5
Phase Change Material
5500T
Available
Sizes
Application
Guidelines
Width: --------Length: ---------Custom Sizes: Contact your local 3M sales representative for information and availability of standard
and custom sizes (width and length) or die cut parts of the PCM 5500T.
1.) Substrate surfaces should be clean and dry prior to the 5500T application. Isopropyl alcohol
(isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface
contamination such as dust or finger prints. Do not use "denatured alcohol" or glass cleaners, which
often contain oily components. Allow the surface to dry for several minutes before applying the
5500T. More aggressive solvents (such as acetone, methyl ethyl ketone (MEK) or toluene) may be
required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be
followed by a final isopropanol wipe as described above.
Note: Be sure to read and follow the manufacturers' precautions and directions when using solvents.
2.) Apply the 5500T to one substrate at a modest angle with the use of a squeegee, rubber roller or
finger pressure to help reduce the potential for air entrapment under the 5500T during its application.
The liner can be removed after positioning the tape onto the first substrate.
3.) Assemble the part by applying compression to the substrates to ensure a good wetting of the
substrate surfaces with the 5500T. Rigid substrates are more difficult to assemble without air
entrapment as most rigid parts are not flat. Use of a thicker 5500T may result in increased wetting and
reduced air entrapment of rigid substrates. Flexible substrates can be assembled to rigid or flexible
parts with much less concern about air entrapment because one of the flexible substrate can conform
to the other substrates during application.
4.) Upon assembly of the 5500T to a substrate, the 5500T/Substrate are assembled to another
component that creates the “Hot Side-5500T -Cold Side” configuration.
• The 5500T assembly (with mechanical force system in place) can be heated past the 5500T
melting temp erature to provide for maximum wet-out and reduced air entrapment.
5.) Rework Tips:
• Rework requires separation of the two substrates. Separation can be accomplished by any
practical means: prying, torquing or peeling. The tape will be destroyed upon separation and must
be replaced. The surfaces should be re-cleaned according to the recommendations in this data
page.
• Heating up the substrates can reduce the adhesion level and make removal easier.
• Part separation can be aided by immersion in warm water. This should eventually reduce the
adhesion and make prying, torquing or peeling apart the substrates easier.
6
Phase Change Material
5500T
General
Information
Product selection table for 3M ™ Thermally Conductive Materials
Bulk Thermal
Thickness
Conductivity
(mm)
(W/m-K)
3M™ Thermally Conductive Tapes
Product
8805
8810
8815
0.127
0.25
0.375
0.6
9894FR
1.0
0.6
Typical applications
Applications requiring thin bonding with good thermal
transfer; CPU, flex circuit and power transformer bonding
to heat sinks and other cooling devices. Superior tack and
wetting properties
Applications requiring gap filling and bonding with good
thermal transfer; IC packages and PCB bonding to heat
sinks, metal cases and other cooling devices.
3M™ Thermally Conductive Adhesives
TC-2707
DP-190 Grey
-------
0.7
-------
0.4
Applications requiring high adhesive strength, good
surface wetting, gap filling and good thermal transfer. IC
package and PCB thermal interfacing with heat sinks or
other cooling devices.
3M™ Thermally Conductive Pads
5506 / 5507
0.5 to 2.5
2.3 / 2.5
5509
0.5 to 2.5
5.0
Applications requiring gap filling and superior thermal
performance without bonding. IC package and PCB
thermal interfacing with heat sinks or other cooling devices
and metal cases.
Application
Ideas
3M™ Thermally Conductive 5500T PCM is designed to provide a preferential heat-transfer path
between heat-generating and cooling devices (e.g., fans, heat pipes and heat sinks).
For Additional
Information
To request additional product information or to arrange for sales assistance, call toll free 1800-362-3550. Address correspondence to 3M Engineered Adhesives Division, 3M Center, Building 220-7E-01, St.
Paul, MN 55144-1000. Our fax number is 651-733-9175. In Canada, phone: 1-800-364-3577. In Puerto Rico, phone:
1-809-750-3000. In Mexico, phone 5-728-2180.
www.3m.com/conductives
Certification/
Recognition
MSDS : 3M has not prepared a MSDS for this product which is not subject to the MSDS
requirements of the Occupational Safety and Health Administration's Hazard Communication
Standard, 29 C.F.R. 1910.1200(b)(6)(v). When used under reasonable conditions or in accordance with the 3M
directions for use, the product should not present a health and safety hazard. However, use or processing of the
product in a manner not in accordance with the directions for use may affect its performance and present potential
health and safety hazards.
TSCA: This product is defined as an article under the Toxic Substances Control Act and therefore, it is exempt
from inventory listing requirements.
UL: This product has not been recognized by Underwriters Laboratories Inc
Important Notice
3M MAKES NO WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING, BUT NOT
LIMITED TO, ANY IMPLIED WARRANTY OF MECHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE. User is responsible for determining whether the 3M product is fit for a
particular purpose and suitable for user's method of application. Please remember that many factors can affect the
use and performance of a 3M product in a particular application. The materials to be bonded with the product, the
surface preparation of those materials, the product select ed for use, the conditions in which the product is used, and
the time and environmental conditions in which the product is expected to perform are among the many factors that
can affect the use and performance of a 3M product. Given the variety of factors that can affect the use and
performance of a 3M product, some of which are uniquely within the user's knowledge and control, it is essential
that the user evaluate the 3M product to determine whether it is fit for a particular purpose and suitable for the user's
method of application.
Limitation of
Remedies and
If the 3M product is proved to be defective, THE EXCLUSIVE REMEDY, AT 3M'S
OPTION, SHALL BE TO REFUND THE PURCHASE PRICE OF OR TO REPAIR OR
REPLACE THE DEFECTIVE 3M PRODUCT. 3M shall not otherwise be liable for loss or damages, whether direct,
indirect, special, incidental, or consequential, regardless of the legal theory asserted, including negligence, warranty
or strict liability.
Liability
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