CC2592 2.4-GHz Range Extender datasheet

CC2592 2.4-GHz Range Extender datasheet
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CC2592
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CC2592 2.4GHz 范围扩展器
1 介绍
1.1
特性
1
• 与德州仪器 (TI) 2.4GHz 低功率 RF 器件的无缝对接
• +22dBm 输出功率
• CC2520,CC253X 和 CC85XX 上 3dB 典型经改进
灵敏度
• 极少的外部组件
– 集成开关
– 集成匹配网络
– 集成不平衡变压器
– 集成电感器
– 集成功率放大器 (PA)
– 集成低噪声放大器 (LNA)
• 通过 HGM 端子的 LNA 增益数字控制
1.2
•
•
•
应用范围
所有 2.4GHz 工业、科学及医疗设备 (ISM) 频带系
统
无线传感器网络
无线工业系统
1.3
• 断电时 (LNA_EN = PA_EN = 0),电流 100nA
• 低发送流耗
– 对于 +22dBm,PAE = 34%,电压 3V 时的电流
为 155mA
• 低接收流耗
– 针对高增益模式的 4.0mA 电流
– 针对低增益模式的 1.9mA 电流
• 4.7dB LNA 噪声系数,其中包括传输/接收 (T/R) 开
关和外部天线
• 符合 RoHS 环保标准的 4mm x 4mm 四方扁平无引
线 (QFN)-16 封装
• 2.0V 至 3.7V 工作电压
• -40°C 至 +125°C 运行温度范围
•
•
•
•
IEEE 802.15.4 和 ZigBee® 计量系统
IEEE 802.15.4 和 ZigBee 网关
无线消费类电子系统
无线音频系统
说明
CC2592 器件是一款针对低功率和低压 2.4GHz 无线应用的经济高效且高性能的 RF 前端。
CC2592 器件是一款针对德州仪器 (TI) 所有 CC25XX 2.4GHz 低功率 RF 收发器、发射器和片上系统产品的
范围扩展器。
为了增加链路预算,CC2592 器件提供一个可增加输出功率的功率放大器,以及一个具有低噪声系数的
LNA,以提升接收器灵敏度。
CC2592 器件提供一个极小尺寸,高输出功率 RF 设计,此设计采用 4mm x 4mm 四方扁平无引线 (QFN)16 封装。
CC2592 器件包含高性能无线应用简单设计所需的 PA,LNA,开关,RF 匹配和不平衡变压器。
1
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
English Data Sheet: SWRS159
CC2592
ZHCSC45 – FEBRUARY 2014
1.4
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功能方框图
图 1-1 显示了 CC2592 器件的简化方框图。
VDD_LNA
VDD_PA VDD_BIAS
ANT
PA
PREAMP
EN
BALUN
RF_P
EN
RF_N
LNA
EN
PA_EN
BIAS
BIAS
LOGIC
LNA_EN
HGM
图 1-1. CC2592 简化方框图
2
介绍
版权 © 2014, Texas Instruments Incorporated
CC2592
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修订历史记录
日期
文献编号
更改
2014 年 2 月
SWRS159
最初发布版本
介绍
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2 Device Characteristics
2.1
Absolute Maximum Ratings
Under no circumstances must the absolute maximum ratings be violated. Stress exceeding one or more of the limiting values
may cause permanent damage to the device.
Parameter
Conditions
Supply voltage
All supply terminals must have the same voltage
Voltage on any digital terminal
Input RF level
2.2
Value
Unit
–0.3 to 3.8
V
–0.3 to VDD+0.3, max 3.8
V
+10
dBm
Handling Ratings
Under no circumstances must the handling ratings be violated. Stress exceeding one or more of the limiting values may
cause permanent damage to the device.
Parameter
Conditions
Value
Unit
–50 to 150
°C
Human Body Model
2000
V
Charge Device Model
1000
V
Storage temperature range
ESD
2.3
Recommended Operating Conditions
The operating conditions for the CC2592 device are listed below.
Parameter
Min
Max
Unit
Ambient temperature range
–40
125
°C
Operating supply voltage
2.0
3.7
V
2400
2483.5
MHz
Operating frequency range
4
Conditions
Device Characteristics
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Electrical Characteristics
Tc = 25°C, VDD = 3.0 V, fRF = 2440 MHz (unless otherwise noted). Measured on CC2592EM reference design including
external matching components.
Parameter
Test Conditions
Receive current, high-gain mode
HGM = 1
Receive current, low-gain mode
Min
Typ
Max
Unit
4
mA
HGM = 0
1.9
mA
POUT = 20 dBm
123
POUT = 22 dBm
155
Transmit current
No input signal
50
Power down current
EN = 0
High-input level (control terminals)
PA_EN, LNA_EN, HGM
Low-input level (control terminals)
PA_EN, LNA_EN, HGM
Transmit current
0.1
1.3
mA
mA
0.3
µA
Vdd
V
0.3
V
Power down - Receive mode switching
time
1
µs
Power down - Transmit mode switching
time
1
µs
RF Receive
Gain, high-gain mode
HGM = 1
11
dB
Gain, low-gain mode
HGM = 0
6
dB
Gain variation over frequency
2400 to 2483.5 MHz, HGM = 1
2
dB
Gain variation over power supply
2.0 V to 3.7 V, HGM = 1
1.5
dB
Gain variation over temperature
–40°C to 85°C, HGM = 1
1.7
dB
Gain variation over temperature
85°C to 125°C, HGM = 1
1
dB
Noise figure, high-gain mode
HGM = 1, including internal T/R
switch and external antenna match
4.7
dB
Input 1-dB compression, high-gain mode
HGM = 1
–18
dBm
Input IP3, high-gain mode
HGM = 1
–9
dBm
Input reflection coefficient, S11
HGM = 1, measured at antenna port
–15
dB
24
dB
PIN = 0.0 dBm
20.3
PIN = 4.0 dBm
21.9
POUT = 22 dBm
34
%
15
dBm
RF Transmit
Gain
Output power, POUT
Power added efficiency, PAE
Output 1-dB compression
Output power variation over frequency
0.5
dB
Output power variation over power supply 2.0 V to 3.7 V, PIN = 4 dBm
3.8
dB
Output power variation over temperature
–40°C to 125°C, PIN = 4 dBm
1.7
Second harmonic power
FCC requirement
–41.2
dBm
Third harmonic power
FCC requirement
–41.2
dBm
VSWR
2400 to 2483.5 MHz, PIN = 4 dBm
dBm
No damage
20:1
Stability
7.5:1
dB
Device Characteristics
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3 Device Information
3.1
Terminal and I/O Configuration
GND
VDD_PA
VDD_BIAS
VDD_LNA
Figure 3-1 and Table 3-1, provide the terminal layout and description for the CC2592 device.
16
15
14
13
GND
1
12
GND
RF_N
2
11
GND
QFN-16 4x4mm
GND
4
9
GND
5
6
7
8
BIAS
ANT
HGM
10
LNA_EN
3
PA_EN
RF_P
Figure 3-1. Terminal Top View
6
Device Information
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Table 3-1. Terminal Functions
Terminal
Type
Description
No.
Name
–
GND
Ground
The exposed die attach pad must be connected to a solid ground
plane. See CC2592EM reference design for the recommended layout.
1, 4, 9, 11, 12, 16
GND
Ground
Ground connections. Only terminals 9, 11, and 12 should be shorted
to the die attach pad on the top PCB layer.
2
RF_N
RF
RF interface toward CC25xx device
3
RF_P
RF
RF interface toward CC25xx device
5
PA_EN
Digital input
Digital control terminal. See Table 9-1 for details.
6
LNA_EN
Digital input
Digital control terminal. See Table 9-1 or details.
7
HGM
Digital input
Digital control terminal
HGM = 1 → Device in High Gain Mode
HGM = 0 → Device in Low Gain Mode
8
BIAS
Analog
Biasing input. Resistor between this node and ground sets bias
current for PA and LNA.
10
ANT
RF
13
VDD_LNA
Power
Antenna interface
2.0- to 3.7-V power
14
VDD_BIAS
Power
2.0- to 3.7-V power
15
VDD_PA
Power
2.0- to 3.7-V power
Device Information
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4 Sensitivity Improvement Example
CC2592
CC2520
NF = 4.7 dB
NF = 8 dB
Gain = 11 dB
Figure 4-1.
The noise factor of a system consisting of the CC2592 device and a CC2520 device, as seen in Figure 41 is given by:
4.7
F
8
F 1
1010 1
F1 2
10 10 11
G1
1010
The noise figure is:
NF 10log(F) 10log(3.37)
3.37
(1)
5.28 dB
(2)
The noise figure is reduced from 8 dB for the CC2520 standalone to 5.28 dB for the CC2592 and CC2520
device combination, leading to a 2.72-dB theoretical improvement in sensitivity.
In practice, tests on the CC2592 and CC25XX devices show around 3-dB improvement in sensitivity. For
the CC2538 and CC2592 devices, the improvement is almost 4 dB (approximately –97 dBm to –101 dBm)
8
Sensitivity Improvement Example
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5 CC2592EM Evaluation Module
Figure 5-1 shows an evaluation module circuit of the CC2592 device.
VDD
VDD
C151
C131
C106
L101
VDD_PA
C107
VDD_LNA
C108
VDD_BIAS
VDD
LDB182G4520C-110
RF_P
RF_P
RF_P
Balun
RXTX
RXTX
SMA
C109
L103
L102
C103
RF_N
RF_N
PA_EN
PA_EN
LNA_EN
LNA_EN
C101
BIAS
C105
C152
RF_N
CC2592
ANT
SMA
C21
HGM
HGM
R81
Figure 5-1. CC2592 Evaluation Module
Table 5-1 lists the materials in the CC2592 evaluation module circuit.
Table 5-1. List of Materials
Device
Function
Value
L101
PA bias inductor
4.7 nH, Multilayer chip inductor
L102
Part of antenna match
1 nH, Multilayer chip inductor
L103
Part of antenna match
1.8 nH, Multilayer chip inductor
C101
Part of antenna match
2.2-pF 0402 Chip capacitor
C103
Part of antenna match
2.2-pF 0402 Chip capacitor
C105
Part of antenna match
0.1-pF 0402 Chip capacitor
C106
Decoupling
12-pF 0402 Chip capacitor
C107
Decoupling
1-nF 0402 Chip capacitor
C108
Decoupling
1-µF 0402 Chip capacitor
C109
DC block
18-pF 0402 Chip capacitor
C21
Balun matching capacitor
0.2-pF 0402 Chip capacitor
C152
Balun matching capacitor
0.3-pF 0402 Chip capacitor
C131
Decoupling
1-nF 0402 Chip capacitor
C151
Decoupling
12-pF 0402 Chip capacitor
R81
Bias resistor
3.9 kΩ, 0402 resistor
CC2592EM Evaluation Module
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6 Typical Characteristics
spacer
12
5.1
11
11
5.0
10
10
4.9
9
4.8
8
4.7
7
4.6
6
4.5
5
4.4
5
4
4.3
2400 2410 2420 2430 2440 2450 2460 2470 2480 2490
4
7
6
5
4
80
100
120
32
180
28
160
24
140
20
120
16
100
12
80
8
60
Pout
PAE
Ivdd
±8
±4
Input Power (dBm)
0
4
40
3.8
C002
34
180
170
32
160
30
150
28
140
26
130
24
120
22
110
20
100
C007
36
180
34
170
32
160
30
150
28
140
26
130
24
120
22
110
Pout
PAE
Ivdd
20
18
20
8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
Power Supply (V)
C004
Figure 5. Output Power, PAE, and Current Consumption Versus
Input Power
10
3.6
Frequency (MHz)
Current Consumption (mA)
Output Power (dBm) and PAE (%)
200
±12
3.4
Figure 4. Output Power, PAE, and Current Consumption Versus
Frequency
Input Power Level = +4 dBm
36
0
3.2
Pout
PAE
Ivdd
C001
Figure 3. LNA Gain Versus Temperature
4
3.0
18
90
2400 2410 2420 2430 2440 2450 2460 2470 2480 2490
Output Power (dBm) and PAE (%)
60
Temperature (ƒC)
2.8
Current Consumption (mA)
Gain (dB)
8
±16
2.6
36
9
±20
2.4
Figure 2. LNA Gain Versus Power Supply
10
40
2.2
Power Supply (V)
Output Power (dBm) and PAE (%)
11
20
HGM
LGM
2.0
HGM
LGM
0
7
C003
12
±20
8
6
Figure 1. LNA Gain and Noise Figure Versus Frequency
±40
9
3.4
3.6
Current Consumption (mA)
Gain (dB)
Frequency (MHz)
Gain (dB)
HGM
LGM
NF HGM
12
Noise Figure (dB)
5.2
13
100
90
3.8
C005
Figure 6. Output Power, PAE, and Current Consumption Versus
Power Supply
Input Power Level = +4 dBm
Typical Characteristics
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160
Pout
PAE
Ivdd
34
158
32
156
30
154
28
152
26
150
24
148
22
146
20
144
18
Current Consumption (mA)
Output Power (dBm) and PAE (%)
36
142
±40
±20
0
20
40
60
80
100
Temperature (ƒC)
120
140
C006
Figure 7. Output Power, PAE, and Current Consumption Versus Temperature
Input Power Level = +4 dBm
Typical Characteristics
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7 Controlling the Output Power from CC2592
The output power of the CC2592 device is controlled by controlling the input power. The CC2592 PA is
designed to work in compression (class AB).
Driving the CC2592 device too far into saturation might result in spurious emissions and harmonics above
regulatory limits. This caution should especially be considered for systems targeting a wide operating
temperature range, where a combination of low temperature, low supply voltage, and a transceiver that
increases output power (drive level) at low temperature, can result in high spurious emissions.
Figure 7-1 shows the maximum recommended drive level versus temperature and supply voltage.
Figure 7-1. Maximum Recommended Drive Level
8 Input Levels on Control Terminals
The three digital control terminals (PA_EN, LNA_EN, and HGM) have built-in level-shifting functionality,
meaning that if the CC2592 device operates off a 3.7-V supply voltage, the control terminals still sense
1.6- to 1.8-V signals as a logical 1. However, the input voltages should not have a logical 1 level that is
higher than the supply.
12
Input Levels on Control Terminals
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9 Connecting the CC2592 Device to a CC25xx Device
Table 9-1 shows the control logic for connecting CC2592 to a CC25xx device.
Table 9-1. Control Logic for Connecting CC2592 to a CC25xx Device
PA_EN
LNA_EN
HGM
0
0
X
Mode of Operation
Power Down
X
1
0
RX Low-Gain Mode
X
1
1
RX High-Gain Mode
1
0
X
TX
Figure 9-1 shows the application circuit for the CC2592 and CC253X devices.
VDD
VDD
C131
C151
C106
L101
VDD_PA
C107
VDD_LNA
C108
VDD_BIAS
VDD
RF_P
RF_P
RF_P
RF_P
RXTX
RXTX
SMA
C109
L103
RF_N
L102
CC2592
ANT
C103
PA_EN
P1.1
LNA_EN
P1.0
HGM
P0.7
CC2530
C101
BIAS
C105
RF_N
RF_N
RF_N
R81
Alternatively to
VDD/GND/MCU
Figure 9-1. Application Circuit Example for CC2530 + CC2592
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Connecting the CC2592 Device to a CC25xx Device
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10 Device and Documentation Support
10.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 10-1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
CC2592
Click here
Click here
Click here
Click here
Click here
10.2 Trademarks
ZigBee is a registered trademark of ZigBee Alliance.
10.3 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
10.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
14
Device and Documentation Support
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都遵循在订单确认时所提供的TI 销售条款与条件。
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用测试或其它质量控制技术。除非适用法律做出了硬性规定,否则没有必要对每种组件的所有参数进行测试。
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的功能安全性标准和要求的终端产品解决方案。尽管如此,此类组件仍然服从这些条款。
TI 组件未获得用于 FDA Class III(或类似的生命攸关医疗设备)的授权许可,除非各方授权官员已经达成了专门管控此类使 用的特别协议。
只有那些 TI 特别注明属于军用等级或“增强型塑料”的 TI 组件才是设计或专门用于军事/航空应用或环境的。购买者认可并同 意,对并非指定面
向军事或航空航天用途的 TI 组件进行军事或航空航天方面的应用,其风险由客户单独承担,并且由客户独 力负责满足与此类使用相关的所有
法律和法规要求。
TI 已明确指定符合 ISO/TS16949 要求的产品,这些产品主要用于汽车。在任何情况下,因使用非指定产品而无法达到 ISO/TS16949 要
求,TI不承担任何责任。
产品
应用
数字音频
www.ti.com.cn/audio
通信与电信
www.ti.com.cn/telecom
放大器和线性器件
www.ti.com.cn/amplifiers
计算机及周边
www.ti.com.cn/computer
数据转换器
www.ti.com.cn/dataconverters
消费电子
www.ti.com/consumer-apps
DLP® 产品
www.dlp.com
能源
www.ti.com/energy
DSP - 数字信号处理器
www.ti.com.cn/dsp
工业应用
www.ti.com.cn/industrial
时钟和计时器
www.ti.com.cn/clockandtimers
医疗电子
www.ti.com.cn/medical
接口
www.ti.com.cn/interface
安防应用
www.ti.com.cn/security
逻辑
www.ti.com.cn/logic
汽车电子
www.ti.com.cn/automotive
电源管理
www.ti.com.cn/power
视频和影像
www.ti.com.cn/video
微控制器 (MCU)
www.ti.com.cn/microcontrollers
RFID 系统
www.ti.com.cn/rfidsys
OMAP应用处理器
www.ti.com/omap
无线连通性
www.ti.com.cn/wirelessconnectivity
德州仪器在线技术支持社区
www.deyisupport.com
IMPORTANT NOTICE
邮寄地址: 上海市浦东新区世纪大道1568 号,中建大厦32 楼邮政编码: 200122
Copyright © 2014, 德州仪器半导体技术(上海)有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
15-May-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
CC2592RGVR
ACTIVE
VQFN
RGV
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
CC2592
CC2592RGVT
ACTIVE
VQFN
RGV
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-2-260C-1 YEAR
-40 to 125
CC2592
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
15-May-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
重要声明
德州仪器(TI) 及其下属子公司有权根据 JESD46 最新标准, 对所提供的产品和服务进行更正、修改、增强、改进或其它更改, 并有权根据
JESD48 最新标准中止提供任何产品和服务。客户在下订单前应获取最新的相关信息, 并验证这些信息是否完整且是最新的。所有产品的销售
都遵循在订单确认时所提供的TI 销售条款与条件。
TI 保证其所销售的组件的性能符合产品销售时 TI 半导体产品销售条件与条款的适用规范。仅在 TI 保证的范围内,且 TI 认为 有必要时才会使
用测试或其它质量控制技术。除非适用法律做出了硬性规定,否则没有必要对每种组件的所有参数进行测试。
TI 对应用帮助或客户产品设计不承担任何义务。客户应对其使用 TI 组件的产品和应用自行负责。为尽量减小与客户产品和应 用相关的风险,
客户应提供充分的设计与操作安全措施。
TI 不对任何 TI 专利权、版权、屏蔽作品权或其它与使用了 TI 组件或服务的组合设备、机器或流程相关的 TI 知识产权中授予 的直接或隐含权
限作出任何保证或解释。TI 所发布的与第三方产品或服务有关的信息,不能构成从 TI 获得使用这些产品或服 务的许可、授权、或认可。使用
此类信息可能需要获得第三方的专利权或其它知识产权方面的许可,或是 TI 的专利权或其它 知识产权方面的许可。
对于 TI 的产品手册或数据表中 TI 信息的重要部分,仅在没有对内容进行任何篡改且带有相关授权、条件、限制和声明的情况 下才允许进行
复制。TI 对此类篡改过的文件不承担任何责任或义务。复制第三方的信息可能需要服从额外的限制条件。
在转售 TI 组件或服务时,如果对该组件或服务参数的陈述与 TI 标明的参数相比存在差异或虚假成分,则会失去相关 TI 组件 或服务的所有明
示或暗示授权,且这是不正当的、欺诈性商业行为。TI 对任何此类虚假陈述均不承担任何责任或义务。
客户认可并同意,尽管任何应用相关信息或支持仍可能由 TI 提供,但他们将独力负责满足与其产品及在其应用中使用 TI 产品 相关的所有法
律、法规和安全相关要求。客户声明并同意,他们具备制定与实施安全措施所需的全部专业技术和知识,可预见 故障的危险后果、监测故障
及其后果、降低有可能造成人身伤害的故障的发生机率并采取适当的补救措施。客户将全额赔偿因 在此类安全关键应用中使用任何 TI 组件而
对 TI 及其代理造成的任何损失。
在某些场合中,为了推进安全相关应用有可能对 TI 组件进行特别的促销。TI 的目标是利用此类组件帮助客户设计和创立其特 有的可满足适用
的功能安全性标准和要求的终端产品解决方案。尽管如此,此类组件仍然服从这些条款。
TI 组件未获得用于 FDA Class III(或类似的生命攸关医疗设备)的授权许可,除非各方授权官员已经达成了专门管控此类使 用的特别协议。
只有那些 TI 特别注明属于军用等级或“增强型塑料”的 TI 组件才是设计或专门用于军事/航空应用或环境的。购买者认可并同 意,对并非指定面
向军事或航空航天用途的 TI 组件进行军事或航空航天方面的应用,其风险由客户单独承担,并且由客户独 力负责满足与此类使用相关的所有
法律和法规要求。
TI 已明确指定符合 ISO/TS16949 要求的产品,这些产品主要用于汽车。在任何情况下,因使用非指定产品而无法达到 ISO/TS16949 要
求,TI不承担任何责任。
产品
应用
数字音频
www.ti.com.cn/audio
通信与电信
www.ti.com.cn/telecom
放大器和线性器件
www.ti.com.cn/amplifiers
计算机及周边
www.ti.com.cn/computer
数据转换器
www.ti.com.cn/dataconverters
消费电子
www.ti.com/consumer-apps
DLP® 产品
www.dlp.com
能源
www.ti.com/energy
DSP - 数字信号处理器
www.ti.com.cn/dsp
工业应用
www.ti.com.cn/industrial
时钟和计时器
www.ti.com.cn/clockandtimers
医疗电子
www.ti.com.cn/medical
接口
www.ti.com.cn/interface
安防应用
www.ti.com.cn/security
逻辑
www.ti.com.cn/logic
汽车电子
www.ti.com.cn/automotive
电源管理
www.ti.com.cn/power
视频和影像
www.ti.com.cn/video
微控制器 (MCU)
www.ti.com.cn/microcontrollers
RFID 系统
www.ti.com.cn/rfidsys
OMAP应用处理器
www.ti.com/omap
无线连通性
www.ti.com.cn/wirelessconnectivity
德州仪器在线技术支持社区
www.deyisupport.com
IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
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