Embedded Computers on Modules and Single Board

Embedded Computers on Modules and Single Board
V. 6/17
Embedded Computers on Modules
and Single Board Computers
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Table of Contents
About ADLINK
Company Introduction ........................................................................................................................................................ P 2
Customized Service for Embedded Modules ....................................................................................................................... P 6
Technology
Embedded Ready for Extremes ............................................................................................................................................ P 8
Embedded Building Blocks for Edge Computing ................................................................................................................. P 12
SEMA® .................................................................................................................................................................................... P 18
Product Introduction and Selection Guides
COM Express
Introduction ......................................................................................................................................................................
Type 7 ................................................................................................................................................................................
Type 6 ................................................................................................................................................................................
Type 10 ..............................................................................................................................................................................
Type 2 ................................................................................................................................................................................
Carrier Boards ...................................................................................................................................................................
Starter Kits ........................................................................................................................................................................
Engineering Test Tools ......................................................................................................................................................
P 20
P 22
P 23
P 29
P 30
P 31
P 33
P 35
SMARC
Introduction ......................................................................................................................................................................
Intel® Processors based .....................................................................................................................................................
ARM based .........................................................................................................................................................................
Carrier Board and Starter Kits .........................................................................................................................................
P 36
P 37
P 39
P 42
Qseven
Introduction ...................................................................................................................................................................... P 42
Qseven Standard size Modules, Carrier Board and Starter Kit ...................................................................................... P 43
ETX
Introduction ...................................................................................................................................................................... P 44
ETX Module, Carrier Board and Starter Kit ..................................................................................................................... P 45
PC/104
Introduction ...................................................................................................................................................................... P 46
PCI/104, PCI-Express, PC/104-Plus and PC/104 Single Board Computers ........................................................................ P 47
Mini-ITX
Introduction ...................................................................................................................................................................... P 50
High Performance Mini-ITX Embedded Boards ............................................................................................................. P 52
Low Power Consumption Mini-ITX Embedded Boards .................................................................................................. P 53
ATX Industrial Motherboards, PICMG SHBs and SBCs
Introduction ......................................................................................................................................................................
ATX Industrial Motherboards .........................................................................................................................................
PICMG SHBs and SBCs ......................................................................................................................................................
Chassis, Power Supplies, Heatsinks, Fans and Accessories .............................................................................................
P 54
P 56
P 58
P 61
P1
Company Introduction
Leading EDGE Computing
ADLINK Technology is leading edge computing with products and platforms that enable computing
at the edge of the network, whether that network be the public Internet or an enterprise
information technology (IT)/operational technology (OT) network. With the main goal of driving
data-to-decisions, ADLINK provides solutions to connect the unconnected and simplify the design,
development and deployment of Industrial Internet of Things (IIoT) applications.
Through the integration of computing power, rugged design, high availability and industrial I/O,
ADLINK has made a name for itself providing reliable products of superior quality for cost-effective
solutions. This allows our customers around the world to significantly reduce time-to-market (TTM)
burdens while minimizing total cost-of-ownership (TCO) with customization and system integration
advantages, keeping manufacturing costs low and extending product lifecycles.
ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and is active
in several standards organizations and interoperability initiatives, including PCI Industrial
Computer Manufacturers Group (PICMG), PXI Systems Alliance (PXISA), VMEbus International
Trade Association (VITA), Standardization Group for Embedded Technologies (SGeT), European
Telecommunications Standards Institute (ETSI), and Open Compute Project (OCP).
ADLINK is a global company with a local touch. Headquartered in Taiwan, ADLINK offers
manufacturing in Taiwan and China; R&D and integration in the US, Germany, Taiwan and China;
an extensive network of worldwide sales and support offices; and a continually expanding partner
ecosystem. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on
the TAIEX Taiwan Stock Exchange (stock code: 6166). Our products are currently available in over
40 countries across five continents, supported by worldwide distribution networks and offices and
over 1600 employees.
P2
Platforms and Services
ADLINK offers a variety of building blocks and both generic and domain-specific platforms to serve the automation,
communications, medical, transportation, infotainment and defense/government markets.
Building Blocks
Mobile and Panel Computing
The communications industry requires incremental solutions
to meet the ever-growing bandwidth requirements of today’s
wired and ADLINK provides a wide range of Computeron-Modules (COMs) and small form factor Single Board
Computers (SBCs). ADLINK’s COM offerings include COM
Express®, SMARC®, Qseven® and ETX® in all sizes and pinout
specifications, and our SBCs encompass a variety of form
factors (e.g., PICMG 1.0/1.3, PC/104 and Mini-ITX), processors,
clock speeds, memory configurations, I/O options and
operating systems.
ADLINK offers rugged mobile and panel computing
products for industrial applications, including
automation, logistics management and healthcare. We
specialize in meeting the needs of harsh and demanding
environments, as well as mobile deployments in
industrial settings. Our offerings include smart touch
panel PCs, industrial and medical panel PCs and rugged
tablets.
Measurement and Automation
Many industries benefit from, if not require, rugged
electronics. In addition to military and industrial
use, professionals in medical, oil and gas, science and
transportation also need hardware that stands up to
punishing situations. ADLINK offers an innovative
portfolio of Extreme Rugged COMs, SBCs and systems
that provide wide operating temperature ranges and
meet MIL-STD, shock and vibration specifications.
ADLINK provides reliable, top quality products for industrial
I/O control, motion control, digital imaging, data acquisition
and modular instrument applications. Our comprehensive
portfolio of products, application-ready platforms and easyto-use software packages with integrated value-added service
continually exceed customer requirements.
Rugged Computing
Embedded Computing
Edge, Cloud and Fog Computing
ADLINK works closely with Intel to ensure we develop
and introduce innovative computing technologies by
implementing the latest embedded computing roadmaps
and by selecting computer solutions that best fit our target
markets. This enables ADLINK to provide the highest quality
and highest performance products with the long lifecycles
required by our customers.
ADLINK has added to its IoT portfolio with software
solutions that enable easy system connectivity and help
reduce the complexity of building IIoT applications.
Using the Data Distribution Service (DDS) middleware
standard to enable scalable, real-time, dependable,
high-performance and interoperable data exchanges,
ADLINK has moved closer to our goal of providing
complete application-ready, generic and domain-specific
platforms.
Networking and Communications
ADLINK has introduced several platforms for outdoor mobile
edge computing (MEC), broadcasting, network security,
video conferencing and video processing applications such
as surveillance. Our Modular Industrial Cloud Architecture
integrates the latest data center technologies with the most
critical aspects of traditional industrial computing equipment,
such as modular design, hardware-assisted acceleration and
carrier-grade design standards.
P3
Design and Manufacturing Services
To fulfill your requirement of high quality, cost-effective products, with quick TTM in product development, ADLINK has
established and assembled a Design and Manufacturing Services (DMS) team to cater to the specific demands that off-the-shelf
products cannot meet. ADLINK also owns and operates manufacturing facilities in our headquarters, with capabilities that
include our own printed circuit board (PCB) layout teams, surface-mount technology (SMT) lines, system integration and test
capabilities. In short, ADLINK controls the whole manufacturing process, from layout and design to prototyping and volume
production.
ADLINK also offers a wide range of customer support services and has implemented an extensive environmental protection
policy to meet the growing ‘Green’ standards of the electronics industry. To learn more, visit our website at www.adlinktech.
com.
Customer Services
ADLINK is not only devoted to providing local service worldwide, but also to providing convenient online service. The
following services are available around-the-clock on the Internet.
FAQ and Support
Our Ask an Expert (AAE) service provides answers to commonly asked questions, as well as the ability to contact ADLINK's
knowledgeable staff about a specific product or issue. ADLINK’s AAE is available 24/7 online and is staffed by dedicated
professionals who are available to address customers' needs. All issues and comments are recorded into a database and can
be tracked/reviewed at any time. ADLINK customers are invited to access the AAE system at: http://www.adlinktech.com/AAE
P4
Environmental Protection Policy
Environmental protection is a top priority at ADLINK. We implemented a Green Product Policy in May 2004 to align the
purchasing and use of green products with requirements from international environment protection statutes. Measures have
been taken to ensure that our products have little impact on the environment. In addition to planning a leadless process, we
are also focused on reducing the effect of components and raw materials on the environment. The Green Product concept has
been built into our new product development system to ensure protection of the environment and continued business success.
RoHS Compliant Computing
ADLINK is committed to fulfill its social responsibility to global environmental preservation through compliance with the
European Union's Restriction of Hazardous Substances (RoHS) directive, which restricts the use of harmful substances such as
lead, mercury and cadmium in new equipment.
Most end-user applications in which ADLINK products are used do not require RoHS compliance. However, ADLINK will
actively work with customers whose products are not RoHS exempt under category 8 or category 9 classifications. Our leadfree production line and process, including solder paste, solder bar and process control parameters, has been developed and
standardized in our manufacturing system.
Conflict Free Minerals Policy
ADLINK will not knowingly procure material supplies and components that contain minerals that directly or indirectly
finance or benefit armed groups in the Democratic Republic of Congo (DRC) or an adjoining country. We urge our suppliers to
support this policy in their own procurement guidelines and provide us with accurate country of origin information.
ADLINK shall:
Comply fully with requests from EICC-GeSI.
Conduct a reasonable country of origin inquiry to clarify the origins of the gold, tantalum, tungsten and tin used in our
products.
Establish reasonable objectives and targets with a goal of ascertaining and minimizing ADLINK's risk.
With a goal of continuous improvement for our Conflict Free Minerals Program, develop a means to measure objectives
and targets. ADLINK will also review, revise and report these measures, and overall program updates, on an annual basis.
Empower all employees, suppliers, vendors and contractors to take ownership in complying with the Conflict Free
Minerals Policy and to escalate risks in the supply chain to management's attention.
Effectively communicate to all employees this Conflict Free Minerals Policy and our Conflict Free Minerals Program.
Management Flow
The management flow of ADLINK's Green Policy begins during the development stage of a product. Only parts and raw
materials that meet RoHS requirements are sourced. Our engineers specifically design products using only qualified
components. A lead-free process ensures that manufactured products are green. Green products do not contain
environmentally hazardous elements and can easily be recycled.
REACH Declaration
The Registration, Evaluation, Authorization and Restriction of Chemicals Regulation 1907/2006, commonly referred to as
REACH, is Europe's recent chemicals legislation. The products that we supply are non-chemical products and under normal
and reasonable use, they will not release harmful substance. Furthermore, we will immediately inform our customers in
correspondence with REACH-Article 33 if any substance of content (as from a content of >0.1%) in our products will be
classified as alarming by the European Agency for Chemicals (ECHA).
P5
Customized Service for Embedded Modules
Customized Service for Embedded Modules
ADLINK customized services offers the entire development of carrier boards for various form factors, also included full
custom designs and system integration – from concept to volume production. ADLINK's many years of development
experience and extensive expertise in the area of Computer-on-Modules and carrier board development are the guarantee for
delivery of highest quality within a very short time.
Regardless whether it's about x86 or ARM architecture, in Mannheim the popular form factors are developed meeting the
latest specifications. In addition to supporting newer standards like SMARC, carrier boards for COM Express, Qseven, ETX and
other form factors are also included in the portfolio.
The Latest State of the Art Technology and Tools
Provided with the latest technical equipment, our test labs ensure conformity with form factor specifications. Special
compliance tests are carried out to verify the designs. Power integrity, signal integrity, thermal simulation and mechanical
stress tests, performed in company-owned labs, optimize the designs.
Power Integrity Simulation and Verification
Signal Integrity Simulation and Verification
Mechanical 3D Design for System Integration
Thermal Analysis
DC Drop Analysis
Eye Diagram Measurement
Cooling solutions
Compliance tests
Schematic reviews
PCB layouts
Thermal Simulation
PCB Stress & Strain Thermal Analysis
High Quality Measurement Equipment
• Real-time and professional testing environment
• Signal Integrity Test sub contracting on customer designs
• Extensive High-Speed Serial Compliance Testing
Excellent Hardware Test Equipment
P6
High frequency real-time
scope measurement
Evaluating RF components
High performance oscilloscope
for signal integrity
Spectral analysis of widebandwidth RF signals
Latest Professional Software
Radio frequency, microwave & high
speed digital EDA software
Electromagnetic simulation software
To streamline the development processes and ensure highest levels of quality, ADLINK follows well-established process
patterns. Six process steps transform a customer order into a volume-ready product to be assembled on ADLINKs latest SMT
production lines.
•
x86 and ARM module design for form factors COM Express, ETX, SMARC, Q7, PC/104
•
Carrier design for COMs
•
Full custom design with x86 or ARM core
•
Bios and BSP development
Support Services
•
Dedicated resources for problem solving, quick turnaround, and real-time support
Simulation Services
•
High Speed Signal Simulation, Power DC Analysis, Mechanical Simulation, Thermal Simulation
•
Compliance Measurement of High Speed Interfaces(HDMI, DP, SATA, USB, Ethernet etc.)
•
Thermal Validation for extended temperature
•
EMC/ESD Validation
Design Services
Validation Services
Quality Certification
Production
ISO9001-2008
•
Co-Work with MAMC, TPMC, SHOC
•
Made in Germany products
•
ISO9001 certified
Product Lifecycle Management
At ADLINK, we understand the importance of product life cycles in the embedded markets. With this, ADLINK Technology
have adopted Product Lifecycle Management (PLM) tool from the leading software solutions provider. With secure, single
platform PLM software, ADLINK deliver excellent collaboration on product-related activities, lifecycle management, and
provide accurate data across the global network. With a full-functional lifecycle management system, ADLINK has generated
many significant successes for its customers in the marketplace.
Get your new carrier design in less than 6 months.
Request and
Specification
Design with
Simulation
Prototype and
Validation
Test and
Validation
Final Design and
Proiect approval
Volume
Production
P7
Embedded Ready for Extremes
How Rugged ADLINK Solutions Are Built to Keep Going
ADLINK Solutions are built to operate without issue in a climate-controlled office. However, hostile temperatures (subzero
or Saharan), high humidity, and dust, can be very problematic. Moreover, weather isn’t the only factor with which field
professionals must contend. Shocks and vibration can also damage components. Extreme conditions demand extreme
hardware; component failure during mission-critical operations cannot be tolerated.
Many industries benefit from, if not require, rugged electronics. Military and industrial use is obvious, but professionals in
medical, oil and gas, science, transportation, and other industries also need hardware that stands up to punishing situations.
ADLINK has emerged as a trusted leader in the rugged embedded computing field, thanks to the company’s innovative
solutions and a portfolio bolstered by strategic mergers and acquisitions, such as Ampro Computers, LiPPERT, PENTA, and
PrismTech. As a result, ADLINK delivers exceptional hardware and seamlessly moves into existing sales channels, logistics
centers, and custom service networks by rapidly expanding its infrastructure and opening new markets.
ADLINK strategically adds manufacturers to its corporate umbrella in the ongoing pursuit of building a cohesive, broadly
integrated web of tools and services for next-generation industrial and commercial computing needs. This is particularly
applicable in the rugged market, where all hardware is created far from equal. For example, other component manufacturers
may simply encase commercial-grade hardware in a protective shell and brand it “ruggedized.” This approach naturally
affords a degree of protection against certain hazardous conditions, but beneath the casing rests the same circuitry found in
consumer electronics. ADLINK goes further, infusing its hardware with rugged technology from the innermost components to
the protective shell. Beginning with unrivaled R&D, ADLINK produces “Extreme Rugged” hardware in a class of its own.
Defining “Extreme Rugged"
Any manufacturer can slap an “extreme rugged” label on its products. Stickers are cheap. However, close scrutiny often
reveals that they can’t withstand constant exposure to extreme temperatures, humidity, and/or high impacts. Hardware must
be more than superficially rugged.
ADLINK serves the market as a trusted source of extremely rugged electronics because the company understands precisely
what the market needs. In addition to resilience-focused research and development, ADLINK adheres to stringent design
rules and an exhaustive component selection process to ensure that its “Extreme Rugged” family lives up to its name. Testing
and qualification (including MIL-HDBK STD specifications, HALT testing, etc.) at both the design and manufacturing phases
help ADLINK manufacture dependably durable and long-lasting products. Additionally, ADLINK stands behind its “Extreme
Rugged” promise by offering customers exceptional after-sales support.
P8
ADLINK’s Mission
Test Early, Test Often
Among a crowded field of rugged component manufacturers,
ADLINK aims to become the most trusted provider of
embedded industrial products. Aside from the company's
pursuit of incredibly resilient hardware at every stage
of product development, ADLINK subjects its embedded
components to rigorous and extensive testing. Instead of
cutting corners, ADLINK pushes solutions even harder
than necessary to exceed customer field requirements and
industrial application needs. ADLINK meets these exacting
requirements through a mix of standard, semi-custom, and
custom components.
Starting at the design phase, ADLINK uses a variety
of test protocols and methodologies. When ADLINK
selects individual components for its Extreme Rugged
embedded products, ETT plays a crucial role. Moreover,
ADLINK uses high-margin circuit design – ICs proven
to maintain functionality across wide temperature
and voltage ranges — to better ensure reliable, highperformance functionality under environmental duress
far in excess of what could be expected from consumergrade components. ADLINK complements the ICs with
IT Equipment (ITE) 180-compliant high-temperature
PCB material, as per ASHRAE recommendations. All
components feature full derating with MTBF calculations
for commercial and extended temperatures.
Many manufacturers make claims of a customer-centric
focus but fail to deliver on such promises. ADLINK delivers
extensive customer service and support that goes far beyond
official commitments to service after point of sale. ADLINK
integrates customers into the product development phase,
which presents professionals an opportunity to tailor
embedded solutions specific to their business's needs. By
working hand in hand with ADLINK, professionals receive
embedded solutions that enhance and expand end-user
applications.
ADLINK Extreme Rugged embedded solutions thrive in
environments that easily ruin commercial electronics, and
the company is very thorough in its mission. ADLINK strains
components with Extended Temperature Testing (ETT) to an
operating temperature range of up to -40° C to 85° C (-40° F to
185° F) – conditions that are lethal to humans.
HASS - Highly Accelerated Stress Screen
HALT - Highly Accelerated Life Test
ADLINK executes its vision at every step, including component
selection, circuit design, thermal management, PCB thickness,
board layout, enclosure design, and manufacturing process.
Rather than perform a single test at the end of production,
ADLINK uses a battery of tests throughout multiple stages
to ensure that products live up to the Extreme Rugged
designation.
Climate, Temperature, Humidity Testing
After ADLINK signs off on a design, the next step is
prototyping, which involves more testing. In particular,
ADLINK uses HALT (Highly Accelerated Life Test)
methodology to put prototypes through the wringer.
HALT testing reveals a design’s limitations aging. The
process batters components with extreme temperatures
at both ends of the thermometer, six-axis vibration, and
then a combination of temperature and vibration stress
testing. Ultimately, HALT allows ADLINK to pinpoint
normally undetected defects and correct them early in the
development cycle.
Because durability and reliability at high temperatures
are critical to a design’s success or failure, ADLINK also
tests thermal solutions — active and passive — to find an
optimal match for a given prototype's needs. For example,
ADLINK use advanced FloTHERM CFD (computational
fluid dynamics) techniques to assess the suitability of a
cooler in various thermal conditions. With thermal testing
at the prototype stage, ADLINK can run coolers through
several thermal parameters and customize a cooling
solution to match a design. Customers can also request
wind tunnel testing for products’ heatsinks in ADLINK’s
state of the art labs.
P9
HALT Torture Testing
ADLINK uses a variety of testing simulators to rigorously
check and verify product performance. Our Extended
Temperature Testing (ETT) procedure tests components for
proper operation in both extreme heat (up to 85° C) and
extreme cold (as low as -40° C). However, ADLINK’s procedure
is far more meticulous than sticking motherboards in an oven.
Depending on customers' specific requests, ADLINK uses an
exhaustive array of processes to verify products’ thermal
resilience.
ETT screening occurs in three stages. During the design
check, ADLINK technicians verify that a board continues
to function over and beyond the full extended temperature
range during functional, burn-in, and boot-up tests. Once
ADLINK produces an engineering sample, the company
also employs four-corner testing to guarantee stable,
dependable performance at every minimum/maximum
combination of temperature and voltage. At this stage,
technicians also complete thermal shock and HALT testing.
Prototypes must pass each of these tests before they
advance to a pilot run. At this stage, ADLINK verifies that a
component is ready for production by using functional and
burn-in tests to assess ETT yield.
During the product development process, ADLINK
implements HALT testing that places progressively higher
strain on components, including rapid thermal transition,
six-axis vibration, and tests that measure temperature and
vibration simultaneously. For each of these tests, ADLINK
examines key subsystem (CPU, I/O ports, disk controllers,
and video) performance under stress. When a failure
appears, ADLINK analyzes it and moves swiftly to engineer
an appropriate fix. Testing resumes until the component
reaches its destruct limit (the stress level at which
operation ceases). ADLINK collects both hardware failures
and physical damage data to improve its rugged designs.
ADLINK’s HALT procedure follow these essential steps:
1. Power on units in continuous functional test loop
5. Stress to failure
2. Progressively increase extremes of temperature
6. Evaluate failure
3. Induce six-axis vibration
7. Implement design improvements
4. Margin power (±5%)
Power on Units in Continuous Functional Test Loop
Progressively Increase Extremes of Temperature
Induce Six-Axis Vibration
Implement Design
Improvements
Margin Power ± 5%
Stress to Failure
Evaluate Failure
P 10
Labels matter to ADLINK. When the company gives its Extreme Rugged solutions a “Pass” label, it signifies that these products
have completed ADLINK’s gauntlet of tests, like ETT and HALT. ADLINK maintains full transparency with customers, entering
all test results into a database that clients may request, and further uses this same test data for internal quality assurance
audits.
Additionally, ADLINK’s six-axis vibration tests are one of many steps ADLINK takes to prepare products for the severe bumps
and bruises of field deployment. By default, ADLINK’s Extreme Rugged components comply with two U.S. Department of
Defense standards. Motherboards meet the MIL-STD-202G Electronic and Electrical Component Parts test standard, which
calls for multiple 50G shocks and 11.95 Grms of random vibration ranging from a minimum range of 100 to 1000 Hz along
each axis. ADLINK Extreme Rugged solutions must also pass MIL-STD-810G, the U.S. Department of Defense’s standard for
evaluating the influences of environmental stresses on materials.
After the final step, the process continues in a loop until a
component survives ADLINK’s gauntlet. To meet and exceed
the U.S. military’s strict shock and vibration requirements,
ADLINK prepares its system boards with a collection of
specialized components. These include thicker circuit
boards, high-retention sockets, epoxy-reinforced bonding of
vulnerable components (if required), test fastening for highmass components, and immersion silver plating. Of course,
rugged component design will only take a solution so far
without a similarly rugged enclosure surrounding it. ADLINK
designs and customizes enclosures certified to protect internal
components against a broad spectrum of environmental
threats. For the highest quality protection, ADLINK enclosures
pass rigorous U.S. military durability standards.
Vibration test screen shot
The Extra Mile: Conformal Coating
Although extreme temperatures and high impacts clearly
threaten electronics, other environmental conditions pose
risks, as well. Industrial, military, nautical, and aerospace
industries regularly expose components to hazards beyond
humidity. Salt spray, fungus, and other contaminants are just
as harmful, so ADLINK takes additional measures to safeguard
embedded solutions. Designs may optionally incorporate
a conformal coating that protects against moisture, dust,
dendritic growth, corrosion, short circuits, abrasions, and
other operational threats.
Coating inspection under
blacklight
Coating thickness gauge
ADLINK employs HumiSeal 1B31 acrylic coating, which possesses several advantageous properties. It dries quickly and is
typically easy to repair. HumiSeal 1B31 resists moisture, has exceptional dielectric properties, is very flexible, and contains a
UV safety tracer to simplify blacklight inspections.
ADLINK can apply the coating in several ways. Technicians can spray it over a board, submerge the board into the coating,
or use flow coating. Regardless of the method, coatings dry with an average three-mil (0.003-inch) thickness, effectively
conforming to the board. Alternatively, ADLINK can apply epoxy, urethane, paraxylylene, and silicone-based coatings upon
customer request.
P 11
Embedded Building Blocks for Edge Computing
ADLINK, the IoT, and Computer-on-Module-Enabled
Edge Computing
Impact of IoT
By 2020, Gartner predicts that 20.8 billion connected devices will be in use. Nearly one in every three of them will be
business-related. This expected growth illustrates the impact that the Internet of Things (IoT) will have on connected
industries. Communications between IoT devices – everything from sensors to security systems to vending machines – and
their on-premise hubs will constantly interconnect with other systems, continuously collecting or generating data and
relaying it to remote data centers for processing. When properly analyzed, this information can transform into useful
reports and actionable results for business decision-makers.
As a growing ecosystem, the IoT offers significant benefits for businesses that can
take advantage of it. Sensors deployed into nooks and crannies at the network’s
edges gather more usable information than a centrally located sensor ever
could. These strategically placed IoT devices collect information at faster rates
than single sensors, enabling business intelligence and productivity increases
that organizations lacking an IoT strategy can’t match – at least not without
disproportionately larger and less efficient investments in legacy technologies.
The Internet of Things is
a collection of connected devices,
systems, and networking resources
(both wired and wireless) situated
on public and private networks.
Computer-on-modules, or COMs, are one of many IoT building blocks that companies and manufacturers use to develop IoT solutions.
Even though COMs are much smaller than common desktop computers, they can incorporate a processor, memory, flash storage,
power management, USB, Gigabit Ethernet, and a host of other components able to handle demanding, data-heavy applications.
COMs tend to be scalable, cost-effective, and impressively “dense,” yielding high computing output from a small physical footprint.
Working on The Edge
IT’s most effective utilization of the IoT occurs on the outskirts of the network,
and in many cases, beyond a company’s normal infrastructure. These small
computers process incoming data at the source and send refined results back
to either an on- or off-premises data center. By decentralizing computation,
workloads get distributed and lessen the burden experienced by most other
data center infrastructures. This distribution of work at the edge has several
advantages:
Edge computing is the use
of embedded compute devices
deployed at the periphery of a
network.
Server Load Reduction: As computational horsepower off-loads onto remote IoT devices, server hardware gets
a smaller footprint on the data center floor. Not only does this reclaim physical space, but transactional workloads
will place less burden on local cloud infrastructure, freeing up resources for other projects and processes. Also, data
produced on IoT devices will be real-time, eliminating lag caused by transmission delays.
Network Load Reduction: As noted, data processed at the edge is refined and sent back to the data center for
further processing and analysis. As opposed to sending raw data that hasn’t been processed yet, the IoT model carries
the advantage of reducing the amount of network traffic, freeing up bandwidth that can be allocated for other tasks.
P 12
Geographical Advantages: A centrally-based operation can directly monitor and process data from a remote facility,
but, in the case of sensor-based data collection, it’s better to have a distributed collection of sensors physically placed onsite. IoT devices collect data directly at the source, process the information, and send it “home.” Processed data becomes
streamlined, enabling faster transmission while providing accurate information about monitored objects or environments.
Feature Support: IoT devices are customizable and designed to perform specific tasks or operations. COMs function just
like traditional computers with operating systems running specific applications that may not be available on data center
servers. For example, operations like clustering and load balancing could be configurable outside the data center. Apps
with urgent demands can be deployed more quickly at the network edge, especially when dealing with rapidly changing,
up-and-coming technologies, such as ultra-mobility and virtual reality.
Security: Remote processing means that less data transmits over-the-wire, giving malicious entities a smaller target to
attack while making the data stream easier to encrypt and protect. Moreover, if an IoT device becomes compromised, it can
help compartmentalize the attack so that the exploit doesn’t spread to other areas of the network from the remote site.
Of course, deploying IoT into an enterprise environment can be challenging. Problem areas to avoid or mitigate can include:
Complex Configurations: A company can “bite off more than it can chew,” especially if unprepared to manage
deployed IoT devices. Proper management requires planning, automation, and well-monitored environments. Anything
short of a fast, vetted deployment process can consume engineering time and resources.
Hacking Vector Increase: As devices proliferate around a remote location, the chances that one or several IoT devices
will be tampered with increases due to the possibility that malicious hackers can find them and overcome their security.
Also, if multiple devices are compromised, botnet-like attacks can be used to attack the local network or a company’s
environment.
Data Storms: Attacks from IoT devices won’t always originate maliciously. Misconfigured devices, broken patches,
or a weak infrastructure can fall victim, too. Proper safeguards and testing updates before deployment can help protect
vulnerable environments.
Licensing/Operational Costs: Costs of IoT device upkeep and maintenance beyond the initial purchase need to be
considered. Though devices like COMs are easily upgradeable, when done en masse, these changes require licensing and
staff time. Additionally, in the case of custom-built applications, a development team will need to be employed to keep the
applications going.
Infrastructure Requirements: Deploying IoT may not be simple. Having the right infrastructure to support hundreds
or even thousands of IoT devices requires sufficient bandwidth, the right software to interpret the incoming data flood,
and the right kind of computer/cloud hardware to run operations effectively. Careful planning and good foresight should
alleviate or eliminate potential problems.
P 13
Ultimately, edge computing is a foundation for several other emerging technologies and services that rely on decentralized
architecture. Each service, on its own, takes advantage of off-site computing, yet still reports into the larger infrastructure. A
sampling of these services include:
Grid Computing: Conceptually, grid computing employs multiple orchestrated IoT devices that share the same end
goal. These distributed computers don’t need to be geographically close, nor do they have to be of similar design. Rather,
grid computing’s critical ingredient is that systems can provide the necessary horsepower to complete tasks that a single
computer cannot efficiently perform.
Fog Computing: Traditional cloud computing environments run from a centralized location with client endpoints
accessing them remotely. Fog computing differs from cloud computing in that a local cloud, or fog, is built where the
connecting clients sit at the edge of the network. By being able to provide a shorter connection, fog computing clients get
faster response times, as dependencies on distant cloud computing environments are eliminated.
Mobile Edge Computing: To improve on cellular performance, networks can employ a version of edge computing
specifically for cellular services. Mobile edge computing, or MEC, takes IoT-based hardware and places it closer to where
you would find phones, tablets, and other devices that rely on a cellular signal. Like other edge computing services, MEC
helps cut down on network congestion, letting mobile devices transfer data with minimal latency – a key advantage in
today's world where cellular data transmission is in such high demand.
Across many different industries, the application of edge computing has produced a mix of results and solutions.
Local governments adopt the IoT and edge computing to help manage traffic on city streets. By integrating smart devices
and public works devices, life can become easier. For example, public works projects, such as parking space sensors, reduce
the time needed to find somewhere to park, and smart traffic signals prevent longer than necessary waits at traffic stops.
Research institutions collect data from remote locations through edge computing. Moreover, multiple participating
computers can share data processing, economizing and taking advantage of available CPU cycles across a grid’s
membership.
For IT departments, concerns over latency and productivity can spur finding better solutions for running operations at the
network edge. Fog computing provides remote offices with a local cloud environment that isn’t operating only as a network
endpoint. IoT devices, like sensors, security systems, and office automation products can take advantage of the fog.
For sports and entertainment, MEC is deployed to help broadcast events at large stadiums where cellular devices are widely
used throughout the event. Ruggedized wireless cells installed around the stadium help transmit video feeds throughout a
venue with minimal lag and stutter.
These components interoperate as seamless solutions and are categorized as follows:
ADLINK COMs (computer-on-modules) are considered IoT building blocks. These small modules are fully
operational computers when mounted on custom carrier boards designed to meet the application’s functionality and I/O
requirements.
ADLINK has a variety of COMs available, with each model targeting specific enterprise needs:
®
TM
®
COM Express – A variety of modules that support processors ranging from Intel Atom to Xeon , as well as select AMD
CPUs. ADLINK CO M Express Type 7 platforms are particularly suited to small footprint and/or highly dense server
applications requiring 10Gbit bandwidth.
SMARC – Low-powered modules, typically running under 6W, that target mobile applications and support alternate
®
TM
®
®
low-power SOCs and CPUs, including Intel Atom , Celeron , and Pentium processors, and FreeScale CPUs. The new
SMARC 2.0 standard significantly enhances features such as display flexibility (accommodating up to four digital
displays, including dual-mode DisplayPort) and higher-performance I/O (two GbE ports, eight USB ports, and more).
®
®
®
Qseven – Mid-range modules available in a standardized form factor that support Intel Pentium , Celeron , and
TM
Atom processors.
ETX – A legacy COM specification with support for graphics, networking, USB, PATA, and PCI/ISA buses. Support for this
legacy form factor remains relevant for many customers, even in the era of edge computing, especially in applications
requiring more local than cloud processing.
P 14
ADLINK Mini-ITX embedded boards are a trusted, industrial-grade solution built on an industry standard small
®
TM
®
®
form factor. ADLINK’s supported range of CPUs within its Mini-ITX line includes Intel Core , Pentium , Celeron , and
TM
Atom processors, as well as AMD Embedded R-Series APUs. Mini-ITX embedded boards provide a quick, convenient way
to create industrial computing solutions. This small form factor option serves well in a variety of applications, including
industrial automation, digital signage, retail, gaming, and medical.
ADLINK ATX industrial motherboards offer the same range of processors supported by their Mini-ITX siblings.
However, these larger motherboards include additional offerings, such as more PCI Express and PCI expansion slots, more
memory, and other features that will support more robust applications than many Mini-ITX counterparts. Additionally,
ADLINK ATX’s all-in-one PCBA design makes for one of the most durable and reliable options when balancing performance
and expandability in difficult environments.
®
TM
The latest ADLINK ATX product is the IMB-M43, an industrial ATX motherboard with 6th generation Intel Core
processor.
i7/i5/i3
ADLINK PCI/104-Express products bring PCI Express performance and versatility to the PC/104 family for today’s
demanding embedded applications. With features such as conformal coating, fanless operation even under extreme
temperatures, and adherence to ADLINK’s stringent Extreme Rugged qualifications, PCI/104-Express provides reliability
and a small footprint to a broad range of IoT-era settings.
ADLINK IoT gateways are edge devices that sit between IoT systems and the cloud while providing security,
translation services for protocols, and data management (storage, filtering, and processing). Available in several models,
TM
TM
ADLINK’s IoT gateways support Intel processors ranging from Quark to Core i7.
SEMA (Smart Embedded Management Agent) is ADLINK’S middleware tool that monitors system performance
and status, including specific characteristics of the CPU, memory, network information, GPIO control, sleep states, and
other board-related information. SEMA middleware communicates with a built-in board management controller (BMC)
installed on every ADLINK COM, SBC, and Mini-ITX product to collect the latest system information. SEMA is a boardlevel functionality that, when combined with ADLINK’s SEMA Cloud solution, turns fleets of edge computing devices into a
remotely manageable, data-driven hardware collective.
Mini-ITX
P 15
ADLINK Leads the Way in Edge Computing
ADLINK provides its customers with a wide variety of IoT solutions to help facilitate the move to edge computing. With a
company tag line of "Leading EDGE COMPUTING," ADLINK sits in the industrial forefront of designing and manufacturing
embedded devices as well as testing, measurement, and automation products. Among its vast inventory, ADLINK has
a wide assortment of COMs, computers, and systems that help companies move pertinent services and processes to an
edge computing environment. However, before any company can even consider moving to the edge, it should grasp the
importance of edge computing.
Performance is paramount. By processing information at the edge, valuable time and resources at an on-premise data
center won’t be expended by overburdened servers and networking equipment. With these faster results, companies can
quickly respond to critical business information with little to no delay. Remote offices and facilities also benefit from closer
proximity to data-gathering IoT devices, accelerating local decision making.
Businesses must consider what is needed to build and deploy IoT-based solutions for effective results:
Centralized Management: IoT infrastructure can scale more easily and efficiently when managed from a central
location. For admins, not having to jump from system to system is a definite plus, especially if a single console can control
multiple devices out at the edge.
Interoperability: Hardware and software used to run an edge computing environment need to be compatible with
on-premises data center systems. Having the wrong networking infrastructure, or outdated methodologies can delay a
project’s deployment.
APIs: Application program interfaces (APIs) help dictate how systems interact with each other. Whether they’re written
in-house or come packaged with other products, APIs are necessary for developers to build important software gateways
that let commands and calls communicate and control edge computing devices.
Environmental Reliability: Another thing to consider is the environmental soundness of your IoT device location.
Ruggedized equipment can deliver more reliability in more strenuous or risky settings, but at an additional cost.
Evaluating a location and determining if it's hostile or safe enough to run unprotected hardware can prevent loss due to
damaged, stolen, or disabled devices.
In-house Support: As with most emerging technologies, having a good support structure is important. Relying on
vendor support can delay the expediency that edge computing provides. Experienced staff and a functional support
structure should never be overlooked.
Once businesses successfully determine their readiness for edge computing, they can develop and deploy their own IoT
solutions with ADLINK’s catalog of embedded solutions. Several ADLINK product families specifically target edge-type
applications by delivering an optimized mix of high performance and feature breadth with small form factor and extreme
durability. They are built to accommodate tomorrow’s edge computing applications but with a design robustness that’s ready
for any environment.
P 16
ADLINK and the Building Blocks for Edge Computing
ADLINK presents its customers with the capability to build out their own customized corner of the Internet of Things, and
gives companies the opportunity to choose from a variety of deployable hardware solutions while helping to promote
innovation, performance, and control. Investment in embedded hardware designs and software targeted at edge computing
can help any enterprise fine-tune the critical workflows and processes it needs to stay ahead of the competition.
P 17
SEMA®
Intelligent Middleware to Monitor and Control your devices
Downtime of devices or systems is not acceptable in today's industries. To help customers to analyze their systems and take
counter measures for preventive maintenance, ADLINK has developed a tool which is able to monitor and collect system
performance and status information from the hardware in a timely, flexible and precise manner: the Smart Embedded
Management Agent (SEMA®).
SEMA® Overview
Time-to-Market (TTM) and Total-Costs-of-Ownership (TCO) are key aspects to producing competitive products. To combine
TTM and TCO in a reliable manner, a solid and reliable platform is fundamental. To assist in this endeavor, every ADLINK
computer-on-module (COM), single board computer (SBC) and Mini-ITX product is equipped with a Board Management
Controller (BMC) device supporting SEMA®.
Selection of SEMA® Board Controller Functions
Initially designed for power sequencing tasks, the
BMC has evolved to include many new and useful
features throughout the years. Measuring system
voltages and currents, controlling fan speed, accessing
GPIOs and I2C bus are only a few examples of these
new capabilities. Being compatible with the latest
PICMG Embedded Application Programming Interface
specification (EAPI) reduces your effort to port
existing calls to SEMA(r) to nearly zero! On top of that
SEMA® provides an extended set of functions e.g. to
show and control CPU Operation Mode, to read out
HDD S.M.A.R.T. data or to read out a comprehensive
set of system data.
Functional Overview
Providing the interface from the hardware to the
operating system is one of SEMA's most important
functions. The BMC first collects all relevant
information from the chipset and other sources. Using
the I2C driver and the Extended EAPI the application
layer fetches the data and presents it to the user.
The application can be a local customer specific
implementation or the SEMA Dashboard which can
access the Extended EAPI also remotely and which
shows the data in user friendly graphic interfaces,
suitable for supervision and troubleshooting.
Application Layer
Your Application
Extended EAPI
SEMA® Application
(GUI)
Extended EAPI Library
Driver Layer
I2C Protocol
Hardware / Firmware Layer
BMC
Controller
P 18
I2C-bus
Chipset
SEMA Features
At the heart of SEMA® is the Board Management Controller (BMC) supporting SEMA(r) functions. The SEMA® Extended EAPI
provides access to all functions then. And a web-based Dashboard allows to monitor remotely one or multiple devices /
computer modules.
So SEMA® comprises:
®
SEMA Board Management Controller HW and FW
®
SEMA Extended EAPI Library
SEMA supports the following functions and information:
2
CPU Operation Modes
I C Bus Control
Memory Information
Temperatures(CPU and Board)
Network Information
ACPI Power Management
Board Information
(Serial Number, Part Number, Firmware Version...)
HDD S.M.A.R.T
Fan Control
BIOS Updates
GPIO Control
Heartbeat
Support of 1-Wire Bus
Power Consumption
Logging of Power-Up Failures
User Area Access
Additional Board Information
Alerts for Power and Temperature Consumption
I C Probe Device function
®
2
Forensic information is available after system or module failures includes minimum and maximum temperature of the CPU
and system, as well as HDD S.M.A.R.T information - all of which can be used to analyze system or module failure.
SEMA® is available for Linux and Windows operating systems and for various HW platforms.
P 19
COM Express®
Overview
The COM Express standard (PICMG COM.0) is based on serial interfaces including PCI Express, SATA, USB, LVDS/eDP and DDI,
allowing designers to utilize the latest technologies for future applications. ADLINK has heavily invested in the development
and maintenance of the PICMG COM Express specification since its creation.
ADLINK was chair of the PICMG subcommittee that was tasked with defining the COM Express COM.0 Revision 3.0
specification update. This revision includes the Type 7 definition that brings server class platform capabilities to COM Express
modules and upgrades the Type 6, 10 definitions to align with recent market trends, such as IEEE 1588 support.
Types
Legacy interfaces such as PATA, PCI are supported by Type 2 modules. In contrast, Type 6 and 10 modules have PCI Express,
USB 3.0, DDI (DisplayPort/HDMI/DVI) and eDP interfaces to allow development of products for novel applications. In addition,
PEG lanes are supported by Type 6 to widen the range of possible uses by allowing connection to external graphics cards
for graphic-oriented applications or FPGAs for vertical solutions. The new Type 7 module brings server class platforms to
COM Express and supports up to four 10GbE for higher communications bandwidth and up to 32 PCIe lanes to provide more
flexible configurations.
Size and Pinout
Several sizes of COM Express module are defined by PICMG and can be paired with the desired pinout to meet the footprint
requirements of the application. The Type 10 pinout, normally used for low power consumption platforms, is most suited to
the Mini (84x55 mm) size to achieve a compact system. The Type 6 pinout is suitable for the Compact (95x95 mm) and Basic
(125x95 mm) sizes that allow scalable applications. The Type 7 pinout is currently available on Basic size modules, but an
Extended (155x110 mm) size may be an option in future.
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Thermal Solutions
PICMG defines a heat spreader as an interface to transfer heat from a COM Express module to the system. ADLINK provides
referenced passive (heat sink) and active cooling (heatsink with fan) solutions to help customer quickly achieve optimum
performance and reliability during the system integration process.
P 20
Type 7
Type 7 is the newest pinout of the COM Express specification developed
by the PCI Industrial Computer Manufacturers Group (PICMG), and is
complementary to the existing Type 6 pin out. Whereas Type 6 is focused on
graphics-oriented applications supporting audio and video interfaces, Type 7
is intended for headless platforms that don’t require graphics support. Major
advancements of the COM Express Type 7 pinout definition are support of up
to four 10GbE-KR interfaces and up to 32 PCIe lanes, making it ideally suited
for intensive parallel computing and server-grade applications requiring
high data and network throughput such as those in IoT and Industry 4.0
solutions.
By 2020, it is expected that the data created and copied annually, much of it from IoT, cloud and big data applications, will
reach 44 zettabytes. In order to minimize traffic between clients, central clouds and data centers, data should be processed as
close as possible to its place of origin or inquiry location. This decentralized capacity to process data in real time and feed/get
information from external device relies on higher CPU-core density, more PCIe lanes and 10Gigabit Ethernet.
Support for Server Grade Processors
Server grade platforms (up to 16 CPU cores) with mobile level TDP (below 45W) are ideal for decentralized applications and
space-constrained systems. These platforms are headless and do not require graphics interface support, freeing up pins on the
existing COM Express Type 6 definition to be used for server and networking-orientated applications.
Up to 32 PCIe Lanes
The Type 6 pinout supports a total of 24 PCIe lanes (PCIe x16 + PCIe x8). Type7 supports
an additional 8 PCIe lanes for a total of 32 PCIe lanes. In the Type 7 definition, the 16
PCIe lanes can support up to four devices, as is the case with Type 6. The other two PCIe
x8 lanes can support up to four devices. With support for up to 8 external devices, the
Type 7 pinout enables the connection of an increased number of data acquistion cards
for expanded information gathering capabilities. Another application of the increased
number of PCIe lanes is connecting to PCIe based storage for improved read/write
performance, thus enhancing the overall efficiency of the system. Finally, the PCIe lanes
can support additional external GPGPU cards for co-processing in applications that
require parallel computing.
COM Express Type 7 Module and
Carrier board
Bringing 10GbE to COM Express
In addition to GbE, the Type 7 pinout supports up to four 10GbE interfaces which are essential for the next generation of
edge node appliances. On the module they are implemented as 10GbE-KR, i.e. as single backplane lanes according to IEEE
802.3, paragraph 49. The physical implementation of the 10GbE interfaces takes place on the carrier board itself to allow
more flexibility in implementation. System integrators can select fiber or copper PHY on the carrier board and transmit data
through either fiber or copper cable.
Software defined pins (SDP) are an added feature of the Type7 pinout. (two SDPs per 10GbE port ) These pins can be
configured as input or output by end-user with a typical application being hardware based precision timing protocol for real
time applications.
Network Controller Sideband Interface
The Network Controller Sideband Interface (NC-SI) defines a protocol for connection to the carrier board board management
controller (BMC) which can be used for out-of-band remote management commonly found in server applications. Compared
to traditional I2C or LPC bus, the NC-SI provides higher bandwidth between network controller and the carrier board BMC.
This interface is defined by the Distributed Management Task Force (DMTF).
P 21
COM Express Type 7
Product Name
Express-BD7
CPU
Intel® Xeon® Processor D SoC
Xeon® D-1559 1.6/2.0GHz 18MB, 45W (12C) (eTEMP)
Xeon® D-1539 1.6/2.2GHz 12MB, 35W (8C) (eTEMP)
Xeon® D-1519 1.5/2.1GHz 6MB, 25W (4C) (eTEMP)
Xeon® D-1577 1.3/2.1GHz 24MB, 45W (16C)
Xeon® D-1548 2.0/2.6GHz 12MB, 45W (8C)
Xeon® D-1527 2.2/2.7GHz 6MB, 35W (4C)
Pentium® D-1508 2.2/2.6GHz 3MB, 25W (2C)
Main Chipset
-
Memory
Up to 32 GB ECC/non-ECC Dual Channel DDR4 at 2400/2133 MHz (depends on SKU)
Cache
Up to 18MB, dependent on SoC SKUs
BIOS Type
AMI Aptio EFI
TPM support (opt)
Infineon SLB9665XT 2.0 FW5.00 (TPM 2.0)
LAN
10G: 2x 10GBASE-KR
GbE: Intel® i210/i211
NC-SI
USB
4x USB 3.0/2.0/1.1
Serial ATA
2x SATA 6Gb/s
PCI Express
16x PCI Express (Gen3) (1x16 or 2 x8 or 4 x4)
8x PCI Express (Gen3) (2 x4/x2/x1)
Up to 8x PCI Express (Gen2) (2 x4/x2/x1) without GbE support (opt.)
Management Bus
I2C, SMBus
SEMA Support
Yes
Power Supply
P 22
Std: 12V±5% / 5Vsb ±5% (ATX) 12V±5% (AT)
Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5-20V (AT)
Operating Temperature
0°C to +60°C
-40°C to +85°C (opt.) (eTEMP SKU only)
OS support
Windows Server 2012 64-bit
Linux 64-bit
Form Factor &
Compatibility
PICMG COM.0 R3.0, Type 7
Basic size: 95 x 125 mm (L x W)
Notes:
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
COM Express Type 6
Product Name
Express-KL/KLE
Express-SL/Express-SLE
6th Gen. Intel® Xeon® E3-1515M (GT4e)
Intel® Xeon® E3-1505M/E3-1505L
7th Gen. Intel® Xeon® E3-1505M v6/E3-1505L v6
CPU
Intel® CoreTM i7-7820EQ
Intel® CoreTM i7-6820EQ/6822EQ
i5-7440EQ/7442EQ, i3-7100E/7102E
i5-6440EQ/6442EQ, i3-6100E/6102E
Intel® Celeron® G3900E/3902E
Chipset
Intel® CM238 (ECC/non-ECC)
Intel® QM175/HM175 (non-ECC)
Intel® CM236 (ECC/non-ECC)
Intel® QM170/HM170 (non-ECC)
Memory
Up to 32 GB ECC/non-ECC Dual Channel DDR4 at 2133/1867 MHz
(ECC support on Xeon/i3 paired with CM238)
Up to 32 GB ECC/non-ECC Dual Channel DDR4 at 2133/1867 MHz
(ECC support on Xeon/i3/Celeron paired with CM236)
AMI EFI with Intel® AMT 11.0 support
AMI EFI with Intel® AMT 11.0 support
(No AMT support with HM175)
(No AMT support with HM170)
Infineon SLB9665XT2.0 FW5.00
(TPM 2.0)
Atmel AT97SC3204
(TPM 2.0 by request)
18/24-bit singl/dual LVDS, eDP 1.4 (opt.)
18/24-bit singl/dual LVDS, eDP 1.3 (opt.)
3x DDI ports supporting DP/HDMI/DVI
3x DDI ports supporting DP/HDMI/DVI
Graphics Features
DirectX 12/11.2/11.1/11/10.1/10/9, OpenGL 4.4/4.3 and ES 2.0,
OpenCL 2.1, 2.0/1.2
Note: support H.265(HEVC) 10-bit codec / VP9 10-bit decode
DirectX 12/11.2/11.1/11/10.1/10/9, OpenGL 4.4/4.3 and ES 2.0,
OpenCL 2.1, 2.0/1.2
Note: support H.265(HEVC) 8-bit codec / VP8 8-bit codec
LAN
Intel® I219LM/V, GbE
Intel® I219LM/V, GbE
USB
4x USB 3.0/2.0/1.1, 4x USB 2.0/1.1
4x USB 3.0/2.0/1.1, 4x USB 2.0/1.1
Serial ATA
4x SATA 6Gb/s
4x SATA 6Gb/s
PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4)
PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4)
8x PCI Express x1 (Gen3) (x4, x2, x1 available)
8x PCI Express x1 (Gen3) (x4, x2, x1 available)
Audio
HDA integrated in PCH supporting ALC886
HDA integrated in PCH supporting ALC886
Management Bus
I2C, SMBus
I2C, SMBus
SEMA Support
Yes
Yes
BIOS Type
TPM Support (opt)
Integrated Graphics
PCI Express
Std: 12V±5% / 5Vsb ±5% (ATX) / 12V±5% (AT)
Std: 12V±5% / 5Vsb ±5% (ATX) / 12V±5% (AT)
Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5-20V (AT)
Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5-20V (AT)
Operating
Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C (opt.)
OS support
Windows 10 64-bit, Linux 64-bit, VxWork 64-bit (plan)
Power Supply
Windows 10/8.1 64-bit, Windows 7 32/64-bit, Linux 64-bit,
VxWork 64-bit
(WES 7 32/64-bit)
Form Factor &
Compatibillity
PICMG COM.0 R2.1, Type 6
Basic size: 95 x 125 mm (L x W)
Notes:
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 23
COM Express Type 6
Product Name
Express-BL
Express-BE
5th Gen. Intel® Xeon®
CPU
AMD® R-Series APU
RX-427BB/425BB/225FB
E3-1278L/1258L
Intel® CoreTM i7-5850EQ/5700EQ
Chipset
Intel® QM87
AMD® A77E
Memory
Up to 32 GB non-ECC Dual Channel
DDR3L at 1600/1333 MHz
Up to 16 GB non-ECC Dual Channel
DDR3L at 1600/1333 MHz
BIOS Type
AMI EFI with Intel® AMT 10.0 support
AMI EFI
TPM Support (opt)
Atmel AT97SC3204
Atmel AT97SC3204
Integrated Graphics
18/24-bit singl/dual LVDS, eDP (opt.)
3x DDI ports supporting DP/HDMI/DVI
VGA
18/24-bit singl/dual LVDS
3x DDI ports supporting DP/HDMI/DVI
(Up to 4 independent display)
Graphics Features
DirectX 11.1/11.1+/11/10.1/10/9 OpenGL 4.3
DirectX 11.1/10.1/10/9, OpenGL 4.2 and ES 2.0
OpenCL 1.2, OpenCV
LAN
Intel® i218LM, GbE
Intel® i210LM, GbE
USB
4x USB 3.0/2.0/1.1, 4x USB 2.0/1.1
4x USB 1.1/2.0/3.0, 4x USB 1.1/2.0
Serial ATA
4x SATA 6Gb/s
4x SATA 6Gb/s
PCI Express
PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4)
7x PCI Express x1 (Gen3) (x4, x2, x1 available)
PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 1x4)
7x PCI Express x1 (Gen3) (x4, x2, x1 available)
Audio
HDA integrated in PCH supporting ALC886
AMD Audio Coprocessor supporting ALC886
Management Bus
I2C, SMBus
I2C, SMBus
SEMA Support
Yes
Yes
Std: 12V±5% / 5Vsb ±5% (ATX) / 12V±5% (AT)
Std: 12V±5% / 5Vsb ±5% (ATX) / 12V±5% (AT)
Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5-20V (AT)
Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5-20V (AT)
Operating
Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
OS support
Win 7/8.1, WES 7, WE8 Std., Linux, VxWorks
Win 7/8, Linux, WES 7/8, Linux
Power Supply
Form Factor &
Compatibillity
PICMG COM.0 R2.1, Type 6
Basic size: 95 x 95 mm (L x W)
Note:
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 24
COM Express Type 6
Product Name
Express-HL/HLE
Express-IB
CPU
4th Gen. Intel® CoreTM, i7-4860EQ/4700EQ
i5-4400E/4402E,
i3-4100E/4102E
®
Intel Celeron® 2000E/2002E
Intel® CoreTM
i7-3615QE/3612QE/3555LE/3517UE
i5-3610ME,
i3-3120ME/3217UE
®
Intel Celeron® 1020E/1047UE/927UE
Chipset
Intel® QM87, Intel® HM86
Intel® QM77
Memory
Up to 16 GB Dual Channel
DDR3L at 1600/1333 MHz
Up to 16 GB non-ECC Dual Channel
DDR3L at 1600/1333 MHz
(ECC support on Express-HLE)
BIOS Type
AMI EFI with Intel® AMT 9.0 support
(no AMT support with HM86)
AMI EFI with Intel® AMT 8.0 support
TPM Support (opt.)
Atmel AT97SC3204
Infineon SLB9635TT
Integrated Graphics
18/24-bit singl/dual LVDS
3x DDI ports supporting DP/HDMI/DVI
VGA
18/24-bit singl/dual LVDS
3x DDI ports supporting DP/HDMI/DVI
(DDI 1 supports SDVO)
VGA
Graphics Features
DirectX* 11/10.1/10/9, OpenGL* 3.0
DirectX 11, OpenGL 3.1, OpenCL 1.1
LAN
Intel® i217LM/V, GbE
Intel® WG82579LM, GbE
USB
4x USB 3.0/2.0/1.1, 4x USB 2.0/1.1 (QM87)
2x USB 3.0/2.0/1.1, 6x USB 2.0/1.1 (HM86)
4x USB 3.0/2.0/1.1
4x USB 2.0/1.1
Serial ATA
4x SATA 6Gb/s (QM87)
2x SATA 6Gb/s & 2x SATA 3Gb/s (HM86)
2x SATA 6Gb/s,
2x SATA 3Gb/s
PCI Express
PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4) 7x PCI
Express x1 (Gen2) (x4, x2, x1 available)
PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4) 7x PCI
Express x1 (Gen2) (x4, x2, x1 available)
Audio
HDA integrated in PCH supporting ALC886
HDA integrated in PCH supporting ALC886
Management Bus
I2C, SMBus
I2C, SMBus
SEMA Support
Yes
-
Std: 12V±5% / 5Vsb ±5% (ATX) 12V±5% (AT)
Std: 12V±5% / 5Vsb ±5% (ATX) 12V±5% (AT)
Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5-20V (AT)
Wide: 8.5-19 V / 5Vsb ±5% (ATX) 8.5-19V (AT)
Operating Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-20°C to +70°C
OS support
Win7/8, Linux, WES 7/8, Linux , VxWorks, QNX
WES 7, Linux, VxWorks
Power Supply
Form Factor &
Compatibillity
PICMG COM.0 R2.1, Type 6
Basic size: 95 x 125 mm (L x W)
Note:
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 25
COM Express Type 6
Product Name
cExpress-KL
7th Gen. lntel® CoreTM
6th Gen. lntel® CoreTM
CPU
i7-7600U/i5-7300U/i3-7100U
i7-6600U/i5-6300U/i3-6100U
Intel® Celeron® 3965U
Intel® Celeron® 3955U
Chipset
-
-
Memory
Up to 32 GB non-ECC Dual Channel
DDR4 at 2133/1867 MHz
Up to 32 GB non-ECC Dual Channel
DDR4 at 2133/1867 MHz
BIOS Type
AMI EFI with Intel® AMT 11.0 support (depends on SKU)
AMI EFI with Intel® AMT 11.0 support (depends on SKU)
TPM Support (opt.)
Infineon SLB9665XT2.0 FW5.51
(TPM 2.0)
Atmel AT97SC3204 (depends on SKU)
Integrated Graphics
18/24-bit singl/dual LVDS, eDP 1.4(opt.)
2x DDI ports supporting DP/HDMI/DVI
Note: VGA support in place of DDI 2(opt.)
18/24-bit singl/dual LVDS, eDP (opt.)
2x DDI ports supporting DP/HDMI/DVI
DirectX 12/11.2/11.1/11/10.1/10/9
OpenGL 4.4/4.3 and ES 2.0
OpenCL 2.1, 2.0/1.2
DirectX 12/11.2/11.1/11/10.1/10/9
OpenGL 4.4/4.3 and ES 2.0
OpenCL 2.1, 2.0/1.2
Note: support H.265(HEVC) 10-bit codec / VP9 10-bit decode
Note: support H.265/HEVC
LAN
Intel® i219LM/V, GbE
Intel® i219LM, GbE
USB
4x USB 3.0/2.0/1.1
4x USB 2.0/1.1
4x USB 1.1/2.0/3.0
4x USB 1.1/2.0
Serial ATA
3x SATA 6Gb/s
CoreTM i7/i5: 3x SATA 6Gb/s
CoreTM i3/Celeron®: 2x SATA 6Gb/s
Graphics
Features
PCI Express
cExpress-SL
5x PCIe x1 (Gen3) (x4, x2, x1 available)
5x PCIe x1 (Gen3/2)
(x4, x2, x1 available)
Note: Up to 6x PCIe x1 without GbE support (opt.)
Note: Up to 6x PCIe x1 without GbE support (opt.)
Celeronl® only support Gen2
Audio
HDA integrated in SOC
supporting ALC886
HDA integrated in SOC
supporting ALC886
Management Bus
I2C, SMBus
I2C, SMBus
SEMA Support
Yes
Yes
Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)
Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)
Wide: 5-20 V / 5Vsb ±5% (ATX), 5-20V (AT)
Wide: 5~20 V / 5Vsb ±5% (ATX), 5 -20V (AT)
Operating
Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C (opt.)
OS support
Windows 10, Linux 64-bit, VxWork 64-bit (plan)
(Linux 64-bit, VxWork 64-bit (plan))
Win10/Win 8.1/7, WES 7, Linux, VxWorks
Power Supply
Form Factor &
Compatibility
PICMG COM.0 R2.1, Type 6
Compact size: 95 x 95 mm (L x W)
Notes:
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 26
COM Express Type 6
Product Name
cExpress-BL
5th Gen. Intel® CoreTM
4th Gen. lntel® CoreTM
CPU
i7-5650U/i5-5350U/i3-5010U
i7-4650/i5-4300U/i3-4010U
Intel® Celeron® 3765U
Intel Celeron® 2980U
Chipset
-
-
Memory
Up to 32 GB non-ECC Dual Channel DDR3L at 1600/1333 MHz
Up to 16 GB non-ECC Dual Channel DDR3L at 1600/1333 MHz
BIOS Type
AMI EFI with Intel® AMT 10.0 support (depends on SKU)
AMI EFI with Intel® AMT 9.0 support (depends on SKU)
TPM Support (opt.)
Atmel AT97SC3204
Atmel AT97SC3204
Integrated Graphics
18/24-bit singl/dual LVDS, eDP (opt.)
2x DDI ports supporting DP/HDMI/DVI
VGA
18/24-bit singl/dual LVDS
2x DDI ports supporting DP/HDMI/DVI
VGA
Graphics
Features
DirectX 11.1/11.1+/10.1/10/9 OpenGL 4.2/4.0
DirectX 11/10.1/10/9 OpenGL 3.0
LAN
Intel® I218LM/V, GbE
Intel® i217LM/V, GbE
USB
2x USB 3.0/2.0/1.1
6x USB 2.0/1.1
2x USB 3.0/2.0/1.1
6x USB 2.0/1.1
Serial ATA
4x SATA 6Gb/s
4x SATA 6Gb/s
4x PCIe x1 (Gen2) (x4, x2, x1 available)
Note: Up to 5 PCIe x1 without GbE support (opt.)
4x PCIe x1 (Gen2)
(x4, x2, x1 available)
Audio
HDA integrated in SOC supporting ALC886
HDA integrated in SOC supporting ALC886
Management Bus
I2C, SMBus
I2C, SMBus
SEMA Support
Yes
Yes
Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)
Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)
Wide: 5-20 V / 5Vsb ±5% (ATX), 5-20V (AT)
Wide: 5~20 V / 5Vsb ±5% (ATX), 5 ~20V (AT)
Operating
Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C (opt.)
OS support
Win 7/8.1, WES 7, WE8 Std,
Linux, VxWorks
Win 7/8, Linux, WES 7/8, Linux , VxWorks
PCI Express
Power Supply
Form Factor &
Compatibility
cExpress-HL
PICMG COM.0 R2.1, Type 6
Compact size: 95 x 95 mm (L x W)
Notes:
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 27
COM Express Type 6
Product Name
cExpress-AL
cExpress-BW
cExpress-BT
CPU
Intel® AtomTM E3950/E3940/E3930
Intel® Pentium® N4200
Intel® Celeron® N3350
Intel® Pentium® N3710
Intel® Celeron® N3160/N3060/N3010
Intel® Atom® x5-E8000
Intel® AtomTM
E3845/3827/3826/3825/3815/3805
Intel® Celeron® N2930/J1900
Chipset
-
-
-
Memory
Up to 8 GB non-ECC Dual channel
DDR3L at 1867/1600 MHz
Up to 8 GB non-ECC Dual Channel
DDR3L at 1600/1333 MHz
Up to 8 GB non-ECC Dual Channel
DDR3L at 1333/1066 MHz
BIOS Type
AMI Aptio EFI
AMI Aptio EFI
AMI Aptio EFI
TPM Support (opt.)
Infineon SLB9665XT2.0 FW5.51
(TPM 2.0)
Atmel AT97SC3204
Atmel AT97SC3204
Integrated Graphics
18/24-bit singl/dual LVDS, eDP (opt.)
2x DDI ports supporting DP/HDMI/DVI
Note: VGA support in place of DDI 2(opt.)
eDP, 18/24-bit singl/dual LVDS (opt.)
3x DDI ports supporting DP/HDMI/DVI
Note: DDI 3 muxed with eDP/LVDS
2x DDI ports supporting DP/HDMI/DVI
VGA
18/24-bit singl/dual LVDS (opt.)
Graphics
Features
DirectX 12/11.3/10/9.3
OpenGL 4.3, ES 3.0, OpenCL 2.0
DirectX 11.1,
OpenGL 4.2, ES 3.0, OpenCL 1.2
DirectX 11,
OpenGL 3.2, ES 2.0, OpenCL 1.1
LAN
Intel® i210/i211, GbE
Intel® i210/i211, GbE
Intel® i210/i211, GbE
USB
3x USB 3.0/2.0/1.1
5x USB 2.0/1.1
4x USB 3.0/2.0/1.1
4x USB 2.0/1.1
1x USB 3.0/2.0/1.1
6x USB 2.0/1.1
Serial ATA
2x SATA 6Gb/s
2x SATA 6Gb/s
2x SATA 3Gb/s
3x PCIe x1 (Gen2) (x2, x1 available)
3x PCIe x1 (Gen2) (x2, x1 available)
3x PCIe x1 (Gen2) (x2, x1 available)
Note: Up to 5 PCIe x1 with PCIe switch (opt.)
Note: Up to 5 PCIe x1 with PCIe switch (opt.)
Note: Up to 4 PCIe x1
without GbE support (opt.)
Audio
HDA integrated in SOC supporting ALC886
HDA integrated in SOC supporting ALC886
HDA integrated in SOC supporting ALC886
Management Bus
I2C, SMBus
I2C, SMBus
I2C, SMBus
Onboard Storage
8GB/16GB/32GB (opt.)
8GB/16GB/32GB (opt.)
8GB/16GB/32GB (opt.)
SD Signal
Yes (BIOS selection)
Yes (opt.)
Yes (mini SD sockete on module)
SEMA Support
Yes
Yes
Yes
Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)
Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)
Wide: 5-20 V / 5Vsb ±5% (ATX), 5-20V (AT
Wide: 5-20 V / 5Vsb ±5% (ATX), 5-20V (AT)
PCI Express
Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)
Power Supply
Wide: 4.75-20 V / 5Vsb ±5% (ATX), 4.75-20V
(AT)
Operating
Temperature
0°C to +60°C
-40°C to +85°C (opt.) (E39XX only)
0°C to +60°C
0°C to +60°C
-40°C to +85°C (opt.) (E38XX only)
OS support
Windows 10, Linux 64-bit, VxWork 64-bit
(plan)
(Linux 64-bit, VxWork 64-bit (plan))
Win 7/8, WES 7, Linux, VxWorks
Win 7/8, Linux, WES 7, WE8 Std., VxWorks,
QNX
Form Factor &
Compatibility
PICMG COM.0 R2.1, Type 6
Compact size: 95 x 95 mm (L x W)
Notes:
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 28
COM Express Type 10
Product Name
nanoX-AL
nanoX-BT
CPU
Intel® AtomTM E3950/E3940/E3930
Intel® Pentium® N4200
Intel® Celeron® N3350
Intel® AtomTM E3845/3827/3826/3825/3815/3805
Intel® Celeron® N2930/J1900
Chipset
-
-
Memory
Soldered memory,
Up to 8 GB non-ECC DDR3L at 1867/1600 MHz
(4 GB/8 GB is opt. support)
Soldered memory,
Up to 4 GB non-ECC DDR3L at 1333 MHz
BIOS Type
AMI Aptio EFI
AMI Aptio EFI
TPM support (opt)
Infineon SLB9665XT2.0 FW5.51
(TPM 2.0)
-
Integrated
Graphics
18/24-bit single channel LVDS, eDP (opt.)
1x DDI ports supporting DP/ HDMI/DVI
18/24-bit single channel LVDS, eDP (opt.)
1x DDI ports supporting DP/ HDMI/DVI
Graphics Features
DirectX 12/11.3/10/9.3
OpenGL 4.3, ES 3.0, OpenCL 2.0
DirectX 11, OpenGL 3.2, ES 2.0
OpenCL 1.1
LAN
Intel® i210/i211, GbE
Intel® i210/i211, GbE
USB
2x USB 3.0/2.0/1.1
6x USB 2.0/1.1
Note: port 7 support USB client
1x USB 3.0/2.0/1.1
3x USB 2.0/1.1
1x USB 1.1/2.0 client
Serial ATA
2x SATA 6Gb/s
2x SATA 3Gb/s
PCI Express
4x PCIe x1 (Gen2) (x4, x2, x1 available)
3x PCIe x1 (Gen2)
(up to 4 PCIe x1 without GbE, opt.)
Audio
HDA integrated in SoC supporting ALC262
HDA integrated in SoC supporting ALC262
Management Bus
I2C, SMBus
I2C, SMBus
Onboard Storage
8 GB/16 GB/32 GB (opt.)
8 GB/16 GB/32 GB (opt.)
SD Signal
Yes (opt.)
Yes (opt.)
SEMA Support
Yes
Yes
Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)
Std: 12V±5% / 5Vsb ±5% (ATX) or 12V±5% (AT)
Wide: 5-20 V / 5Vsb ±5% (ATX), 5-20V (AT)
Wide: 5-14V / 5Vsb (ATX) or 5-14V (AT)
Operating
Temperature
0°C to +60°C
-40°C to +85°C
(Opt., E39XX only)
0°C to +60°C
-40°C to +85°C
(Opt., E38XX only)
OS support
Windows 10, Linux 64-bit, VxWork 64-bit (plan)
(Linux 64-bit, VxWork 64-bit (plan))
Win 7/8, Linux, WES 7, WE8 Std., VxWorks
Power Supply
Form Factor &
Compatibility
PICMG COM.0 R2.1, Type 10
Mini size: 84 x 55 mm (L x W)
Notes:
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 29
COM Express Type 2
Product Name
Express-HL2
Express-IBE2
4th Gen. Intel® CoreTM
Intel® CoreTM
i7-4860EQ/4700EQ,
CPU
i7-3615QE/3612QE/3555LE/3517UE
i5-4400E/4402E,
i5-3610ME,
i3-4100E/4102E
i3-3120ME/3217UE
Intel® Celeron® 2000E/2002E
Intel® AtomTM
E3845/3827/3826/3825/3815/3805
Intel® Celeron® N2930/J1900
Chipset
Intel® QM87, Intel® HM86
Intel® QM77 Express
-
Memory
Up to 16 GB non-ECC Dual Channel
DDR3L at 1600/1333 MHz
Up to 16 GB non-ECC Dual Channel
DDR3L at 1600/1333 MHz
Up to 8 GB non-ECC Dual Channel
DDR3L at 1333/1066 MHz
BIOS Type
AMI EFI with Intel® AMT 9.0 support
(no AMT support with HM86)
AMI EFI with Intel® AMT 8.0 support
AMI Aptio EFI
TPM Support (opt.)
Atmel AT97SC3204
Atmel AT97SC3204
Atmel AT97SC3204
Integrated Graphics
18/24-bit single/dual channel LVDS, VGA
18/24-bit single/dual channel LVDS, VGA,
SDVO (on PEG)
18/24-bit single/dual channel LVDS, VGA
Graphics Features
DirectX* 11/10.1/10/9, OpenGL 3.0
DirectX 11, OpenGL 3.1,
OpenCL 1.1
DirectX 11,
OpenGL 3.2, ES 2.0, OpenCL 1.1
LAN
Intel® i217LM/V, GbE
Intel® WG82579LM, GbE
Intel® i210/i211, GbE
USB
8x USB 2.0/1.1
8x USB 2.0/1.1
7x USB 2.0/1.1
Parallel ATA (IDE)
one channel, one device
one channel, one device
one channel, one device
Serial ATA
4x SATA 6Gb/s (QM87)
3x SATA 6Gb/s (HM86) (port 0/2/3)
2x SATA 6 Gb/s,
2x SATA 3 Gb/s
1x SATA 3Gb/s
(up to 2x SATA 3Gb/s without PATA support)
PCI Express x16 (Gen3)
(1x16 or 2x8 or 1x8 plus 2x4)
PCI Express x16 (Gen3)
(1x16 or 2x8 or 1x8 plus 2x4)
6x PCI Express x1 (Gen2)
(x4, x2, x1 available); 1x PCI
5x PCI Express x1 (Gen2)
(x4, x2, x1 available); 1x PCI
Audio
HDA integrated in SoC supporting ALC880
HDA integrated in SoC supporting ALC880
HDA integrated in SoC supporting ALC880
Management Bus
I2C, SMBus
I2C, SMBus
I2C, SMBus
Onboard Storage
-
-
8GB/16GB/32GB (opt.)
SEMA Support
Yes
Yes
Yes
PCI Express/PCI
Std: 12V±5% / 5Vsb ±5% (ATX) or 12V±5% (AT) Std: 12V±5% / 5Vsb ±5% (ATX) or 12V±5% (AT)
Power Supply
2x PCI Express x1 (Gen2) (x2, x1 available);
1x PCI
Std: 12V±5% / 5Vsb ±5% (ATX) or 12V±5% (AT)
Wide: 8.5-20 V / 5Vsb ±5% (ATX) or 8.5-20V
Wide: 8.5-20 V / 5Vsb ±5% (ATX) or 8.5-20V
(AT)
(AT)
Operating
Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C,
-40°C to +85°C (opt.) (E38XX only)
OS support
Win 7/8, Linux, WES 7/8, Linux , VxWorks
Windows XPe, WES7, Linux, VxWorks
Win 7/8, Linux, WES 7, WE8 Std.
Form Factor &
Compatibility
P 30
cExpress-BT2
Wide: 5-20 V / 5Vsb ±5% (ATX) or 5-20V (AT)
PICMG COM.0 R2.1, Type 2
PICMG COM.0 R2.1, Type 2
Basic size: 95 x 125 mm (L x W)
Compact size: 95 x 95 mm (L x W)
Notes:
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
Reference Carrier Boards
Express-BASE7
Core module
interface
PICMG COM Express Revision 3.0, Type 7
Dimensions
305 mm x 244 mm (ATX)
Expansion Busses
1 PCI Express x16 slot
2 PCI Express x8 slots
Express-BASE6
Core module
interface
PICMG COM Express Revision 2.0, Type 6
Dimensions
305 mm x 244 mm (ATX)
Expansion Busses
1 PCI Express x16 / SDVO slot
1 PCI Express x4 slot
3 PCI Express x1 slots
POST LEDs
Onboard diagnostics for BIOS POST
Secondary BIOS
SPI flash
Audio Codec
Realtek ALC886 HDA
Super I/O
Winbond WF83627DHG on LPC bus
Digital I/O
Extensive GPIO (through PCA9535)
Connectors
Two COM Express x 220-pin (Type 6)
VGA
DB-15 connector
LVDS
Onboard 34-pin header
POST LEDs
Onboard diagnostics for BIOS POST
Secondary BIOS
SPI flash
Super I/O
Winbond WF83627DHG on LPC bus
Digital I/O
Extensive GPIO (through PCA9535)
Connectors
Two COM Express x 220-pin (Type 7)
SATA
2x SATA
Digital Display
Interface
3x DDI ports to HDMI/DVI/DP
(through T6-DDI)
Up to four 10GbE through 1 PCI Express x16 slot
(routes 10GBASE-KR signals from COM Express
module to 10GbE adapter card)
Flat Panel Control
Onboard 8-pin header
10G LAN
Audio Interface
Mic/Line-in/Line-out on I/O panel S/PDIF on
header/jack
LAN
10/100/1000BASE-T compatible RJ-45 on I/O panel
PATA
-
SATA
2x SATA, 2x eSATA
NC-SI
NC-SI (a BMC located on carrier board that can
communicate with ethernet controller for out-ofband management)
SD Card
-
LAN
10/100/1000BASE-T compatible RJ-45 on I/O
panel
USB
4x USB 3.0/2.0/1.0
4x USB 2.0/1.0
Serial Port
1x DB-9 connector (from Super I/O)
3x onboard 10-pin header (one from Super I/
O, two from COM Express module)
Parallel Port
-
KB/Mouse
2x 6-pin mini DIN
Feature Connectors
SMBus, I2C, module control signals
Miscellaneous
Reset button, Lid button, Sleep button, Power
button, Power LED, HDD LED, Buzzer
Smart Battery Support
One 10-pin header for Smart Battery
management communications (connects to
ADLINK BattMan board)
USB
Serial Port
4x USB 3.0/2.0/1.0
2x DB-9 connector (from Super I/O)
2x onboard 10-pin header (from COM Express
module)
KB/Mouse
2x 6-pin mini DIN
Feature Connectors
SMBus, I2C, module control signals
Miscellaneous
Reset button, Lid button, Sleep button, Power button,
Power LED, HDD LED, Buzzer
Note: All specifications are subject to change without further notice.
P 31
Reference Carrier Boards
P 32
Product Name
Express-BASE
miniBASE-10R
Core module
interface
PICMG COM Express Revision 2.0, Type 2
PICMG COM Express Revision 2.1, Type 10
Dimensions
305 mm x 244 mm (ATX)
150 mm x 142 mm
Expansion Busses
1 PCI Express x16 / SDVO slot
5x PCI Express x1 slots
2x 32-bit PCI v2.3 slots
1 ExpressCard slot
2x onboard mini PCIe card slot (one support mSATA)
POST LEDs
Onboard diagnostics for BIOS POST
Onboard diagnostics for BIOS POST
Secondary BIOS
LPC & SPI flash
SPI flash
Audio Codec
Realtek ALC880 HDA
Realtek ALC262 HDA
Super I/O
Winbond WF83627DHG on LPC bus
-
Digital I/O
-
Extensive GPIO (through PCA9535)
Connectors
Two COM Express x 220-pin (Type 2)
One COM Express x 220-pin (Type 10)
VGA
DB-15 connector
-
LVDS
Onboard 34-pin header
Onboard 34-pin header
Digital Display
Interface
-
1x DisplayPort connector
Flat Panel Control
-
-
Audio Interface
Mic/Line-in/Line-out on I/O panel S/PDIF on header/jack
Mic/Line-in/Line-out on I/O panel S/PDIF on jack
PATA
1x 40-pin header
-
SATA
4x SATA
1x SATA
SD Card
-
1x onboard socket
LAN
10/100/1000BASE-T compatible RJ-45 on I/O panel
2x 10/100/1000BASE-T compatible RJ-45 on I/O panel
(one from COM Express module, one from Intel i210 controller on
carrier board)
USB
6x USB 2.0/1.0
1x USB header
1x USB through ExpressCard
2x USB 3.0/2.0/1.0
2x USB 2.0/1.0
1x USB client
Serial Port
1x DB-9 connector (from Super I/O)
1x onboard 10-pin header (one from Super I/O)
2x DB-9 connector (from COM Express module)
Parallel Port
1x DB-25
-
KB/Mouse
2x 6-pin mini DIN
-
Feature Connectors
SMBus, I2C, module control signals
SMBus, I2C, module control signals
Miscellaneous
Reset button, Lid button, Sleep button, Power button, Power LED,
HDD LED
Reset button, Lid button, Sleep button, Power button, Power LED,
HDD LED
Smart Battery
Support
One 10-pin header for Smart Battery management
communications (connects to ADLINK BattMan board)
Integrated Smart Battery management system
Note: All specifications are subject to change without further notice.
Starter Kits
Product Name
COM Express Type 7 Starter Kit Plus
The Type 7 Starter Kit Plus consists of a COM Express Type 7 module (opt.)
with ATX size reference carrier board that offers one PCIe x16 Express slot
with proprietary pinout for 10GbE adapter ard, one PCI Express slot x16,
Two PCI Express x8 slot, Serial ATA, USB 3.0/2.0, Gigabit LAN, and Super I/O.
in addition, a BMC located on carrier board is used for out-of-band
management. All necessary cables are included.
Product Name
The Type 6 Starter Kit Plus consists of a COM Express Type 6 module
(opt.) with ATX size reference carrier board that offers one PCIe x16
Express slot with proprietary pinout for a DDI adapter card, one PCI
Express graphics slot x16, one PCI Express x4 slot and three PCI Express
x1 slots, Serial ATA, VGA, LVDS, USB 3.0/2.0, Gigabit LAN, and Super I/O.
All necessary cables are included.
Standard items :
Standard items :
• Reference carrier board with power supply
• Reference carrier board with power supply
• 10GbE adapter card (fiber or copper type)
• Video Adapter Card (T6-DDI, 3 DisplayPort or HDMI)
• P16TO28 (PCIe x16 to two PCIe x8 adapter card)
• P16TO28 (PCIe x16 to two PCIe x8 adapter card)
• P8TO24 (PCIe x8 to two PCIe x4 adapter card)
• Necessary cabling and Debug Card (DB40)
• Necessary cabling and Debug Card (DB40)
• Live Linux with SEMA pre-installed on USB flash drive
• Live Linux with SEMA pre-installed on USB flash drive
• USB flash driver with
• USB flash driver with
• COM Express carrier design guide
• COM Express carrier design guide
Ordering
Information
• Reference carrier board schematics, design guide
and user manuals
COM Express Type 6 Starter Kit Plus
• Reference carrier board schematics, design guide
Ordering
Information
and user manuals
• Drivers, Libraries and BSPs
• Drivers, Libraries and BSPs
Optional items :
Optional Items :
• COM Express Type 7 Module with CPU of your choice
• COM Express Type 6 Module with CPU of your choice
• Memory of your choice
• Memory of your choice
• Thermal Solution of your choice
• Thermal Solution of your choice
Note: All specifications are subject to change without further notice.
P 33
Starter Kits
Product Name
COM Express Type 10 Starter Kit Plus
The nanoX Starter Kit Plus consists of a COM Express® Type 10 module (opt.)
with a reference carrier board that provides two PCIe Mini Card slots (one
supports mSATA), two RJ-45 LAN ports, Serial ATA, USB 3.0/2.0, one USB
client, COM port, SD card socket, one DP port, LVDS/eDP connector and
Smart Battery support (opt.).
Product Name
COM Express Type 2 Starter Kit Plus
The Starter Kit consists of a COM Express Type 2 module (opt.) with ATX
size reference carrier board that offers one PCI Express graphics slot x16
, four PCI Express x1 slot, two PCI slots, Serial ATA, SDVO, VGA, LVDS,
TV-out, USB 2,0, Gigabit LAN, and Super I/O. All necessary cables are
included.
All necessary cables are included.
Standard Items :
Standard items :
• Reference carrier board with power supply
• Reference carrier board with power supply
• Necessary cabling and Debug Card (DB40)
• Necessary cabling and Debug Card (DB40)
• Live Linux with SEMA pre-installed on USB flash drive
• Live Linux with SEMA pre-installed on USB flash drive
• USB flash driver with
• USB flash driver with
• COM Express carrier design guide
• COM Express carrier design guide
• Reference carrier board schematics, design guide
• Reference carrier board schematics, design
guide and user manuals
and user manuals
Ordering
Information
• Drivers, Libraries and BSPs
• Drivers, Libraries and BSPs
Optional Items :
Optional Items :
• COM Express Type 10 Module with CPU of your choice
• COM Express Type 2 module with CPU of
• Memory of your choice
• Thermal Solution of your choice
• LVDS panel and cable
• Smart Battery
P 34
Ordering
Information
Note: All specifications are subject to change without further notice.
your choice
• Memory of your choice
• Thermal solution of your choice
(heatspreader, heatsink)
(please remove heatspreader, heatsink)
Engineering Test Tools
DB40
The DB40 Debug Card is designed for debugging of COM Express and PC/104 boards. It includes the following features:
• Port 80/81 decoding for Power On Self Test (POST) via LPC
• Interface to SPI Flash for BIOS update
• Interface to Board Management Controller (BMC) for update
• Power and Reset buttons and status LEDs
The DB40 Debug card can only be used on products that have the appropriate FFC debug connector designed for this
purpose.
Ordering Information
Description
Multipurpose debug board
SFP+ Card
BASE-T Card
10GbE PHY
Inphi CS4227/4223 Fiber PHY
10GbE PHY
Intel® X557 Copper PHY
Features
Input: up to four 10GBASE-KR
Output: up to four 10G SFP+ signals
Features
Input: up to four 10GBASE-KR
Output: up to four 10GBASE-T signals
P16TO28
P8TO24
The ADLINK PCIe x16-to-two-x8 adapter card can be used with modules
that support bifurbication on the PEG x16 interface. The card reroutes
the PCIe x16 to two x8 and allows testing of two independent PCIe addon cards with x8/x4/x2/x1 width.
The ADLINK PCIe x8-to-two-x4 adapter card can be used with modules
that support PCIe x8 interface. The card reroutes the PCIe x8 to two x4
and allows testing of two independent PCIe add-on cards with x4/x2/x1
width.
Ordering Information
Ordering Information
Description
PCIe x16-to-two-x8 adapter card
Note: All specifications are subject to change without further notice.
Description
PCIe x8-to-two-x4 adapter card
P 35
SMARC®
The Smallest Computer-on-Module Form Factor
The SMARC (Smart Mobility ARChitecture) standard specifies credit card-sized
Computer-on-Modules (COMs) for highly compact, mobile systems. While such
systems are deployed in a broad range of applications – from stationary or portable
to outdoor and in-vehicle devices – they share some common features; these systems
offer particularly small, flat and energy-saving designs that can be powered by
solar cells and/or batteries. The new SMARC 2.0 specification by the Standardization
Group for Embedded Technologies e.V. (SGET) takes mobile-grade system
development to the next level.
The SMARC 1.1 pinout is optimized for features common to ARM and SOCs rather than those of the x86 architecture.
Some of these ARM/SOC features include parallel LCD display interfaces, provisions for serial and parallel camera input,
multiple I²C, I²S and serial port options, USB client/host mode operation, and SD/eMMC card operation. The SMARC
specification, with its 314-pin board to board edge connector, is future proof by offering additional space for modern
interfaces found on today’s devices such as LVDS, PCIe, SATA, HDMI and DisplayPort. Using SMARC, systems integrators
can take full advantage of the user-interface options available to mobile device OEMs; options that are not usually found
in x86-based embedded-computing systems. LEC is ADLINK’s brand name for SMARC products. It stands for “Low Energy
Computer-on-module” and is one of ADLINK’s newest product lines.
As SGeT has published a new revision 2.0 of the SMARC specification in June 2016, ADLINK is supporting this new
specification with all new SMARC module designs, the first of which are LEC-AL and LEC-iMX6/2GbE.
SMARC defines two different module sizes: a short format of 82mm x 50 mm and a full size format of 82mm x 80mm that
provides more space for larger memory capacity, flash storage and other extensions on the module.
SMARC 2.0 Pinout
Up to three parallel displays:
2x MIPI CSI (4/2 lanes)
Dual channel LVDS (18/24-bit)
2x Gigabit Ethernet
HDMI or DP++
1x I2S and 1x HDA
DP++
4x I2C
4x PCIe
4x Serial
1x SATA3
2x CAN
1x SDIO
12x GPIO
1x SPI and 1x eSPI
2x USB 3.0
6x USB 2.0
x86 power management signals
IEEE 1588 trigger signals
P 36
Intel® Processors-based
Product Name
LEC-AL
LEC-BW
CPU
Intel® AtomTM E3900 Series or Pentium® N4200
or Celeron® N3350 Processor SoC
Intel® Atom® and Celeron®/
Pentium® N3000 Series SoC
Memory
Up to 8 GB DDR3L at 1867 MT/s
Up to 8 GB DDR3L at 1333/1600 MT/s
Cache
L2: 2 MB
L2: 2 MB
Boot Loader
AMI UEFI BIOS
AMI UEFI BIOS
Graphics Features
DirectX 12, OpenGL 4.2, OpenCL 2.0
DirectX 12/11.2,
OpenGL 4.2/3.3,
OpenCL 1.2
Integrated Graphics
9th Gen Intel® graphics core architecture,
supports 3 independent displays
(up to [email protected])
8th Gen Intel® graphics core architecture,
supports 3 independent displays
4K graphic resolution
(up to 3840 x 2160 @ 30fps)
LAN
Intel® i210IT/AT MAC/PHY
supporting 1x GbE
Intel® i211 MAC/PHY
supporting 10/100/1000 GbE
USB
1x USB 3.0 OTG
1x USB 3.0 host
1x USB 2.0 OTG
5x USB 2.0 host
1x USB 3.0 host
2x USB 2.0 host
1x USB 2.0 client
Serial ATA
1x SATA 3.0 (6 Gbit/s)
1x SDIO/SD
Onboard eMMC
2x SATA 6Gb/s
1x SDIO/SD
1x eMMC
Audio
HDA, I2S
HDA
PCI Express
4x PCIe x1
3x PCIe x1
SEMA Support
Yes
Yes
Power Supply
Module Input Voltage: 3.00 ~ 5.25V
Power Pins: 10 pins, 5A at 3V
Typical IO Voltage: 1.8V
Module Input Voltage: 3.00 ~ 5.25V
Power Pins: 10 pins, 5A at 3V
Typical IO Voltage: 1.8V
Operating
Temperature
0°C to +60°C
-40°C to +85°C
0°C to +60°C
Operating
Systems
Windows 10 IOT Enterprise, Windows 10 IOT Core,
Yocto Linux
Windows 7, 8.1, 10,
Yocto Linux, Android
Form Factor &
Compatibility
SMARC short size, 82 x 50 mm, SMARC specification v2.0
SMARC short size, 82 x 50 mm, SMARC specification v1.1
Note: All specifications are subject to change without further notice.
P 37
Intel® Processors-based
Product Name
LEC-BTS
LEC-BT
CPU
Intel® AtomTM E3800 Series SoC
Intel® AtomTM E3800 Series SoC
Memory
Up to 4GB DDR3L
at 1333/1066 MHz non-ECC
Up to 8GB DDR3L
at 1333/1066 MHz with ECC
Cache
L2: 512kB to 2 MB
L2: 512 kB to 2 MB
Boot Loader
AMI UEFI BIOS
AMI UEFI BIOS
Graphics Features
DirectX 11.1,
OpenGLES 2.0,
OpenGL 3.2
DirectX 11.1,
OpenGLES 2.0,
OpenGL 3.2
Integrated Graphics
7th Gen Intel® graphics core architecture,
supports 2 independent displays
7th Gen Intel® graphics core architecture,
supports 2 independent displays
LAN
Intel® i210IT MAC/PHY
1x GbE
Intel® i210IT MAC/PHY
1x GbE
USB
1x USB 3.0 host
2x USB 2.0 host
1x USB 2.0 client
1x USB 3.0 host
2x USB 2.0 host
1x USB 2.0 client
Serial ATA
2x SATA 3Gb/s
1x SDIO/SD
1x eMMC
2x SATA 3Gb/s
1x SDIO/SD
Audio
HDA
HDA
PCI Express
3x PCIe x1
3x PCIe x1
SEMA Support
Yes
Yes
Power Supply
Module Input Voltage: 5.0V
Power Pins: 10 pins, 5A at 3V
Typical IO Voltage: 1.8V
Module Input Voltage: 5.0V
Power Pins: 10 pins, 5A at 3V
Typical IO Voltage: 1.8V
Operating
Temperature
P 38
0°C to +60°C
-40°C to +85°C
Operating
Systems
Linux, VxWorks, Android,
Windows 7/8, WEC7
Linux, VxWorks, Android,
Windows 7/8, WEC7
Form Factor &
Compatibility
SMARC short size, 82 x 50 mm, SMARC specification v1.1
SMARC full size, 82 x 80 mm, SMARC specification v1.1
Note: All specifications are subject to change without further notice.
ARM-based
Product Name
LEC-iMX6
CPU
NXP i.MX6 Quad, Dual, DualLite and Solo Processors
Memory
Up to 4 GB DDR3L at 1066 MHz
Cache
L2: 512kB to 1 MB
Boot Loader
U-Boot
Integrated Graphics
2D/3D graphics processor
Graphics Features
3D 1080p video processing
LAN
1x GbE
USB
2x USB 2.0 host 1x USB OTG
Serial ATA
1x SATA 3Gb/s (Quad and Dual only)
1x SDIO/SD
1x eMMC
Audio
Located on carrier S/PDIF
PCI Express
1x PCIe x1
SEMA Support
Yes
Power Supply
3.0 V ~ 5.25 V DC ±5%
Operating Temperature
0°C to +60°C
-40°C to +85°C
Operation Systems
Linux, Android, WEC7, WEC2013, QNX
Form factor &
Compatibility
SMARC short size module, 82 x 50 mm (W x L), SMARC specification v1.1
Note: All specifications are subject to change without further notice.
P 39
SMARC Starter Kits
Product Name
LEC-Starter Kit R1
LEC-Starter kit with LEC-BASE R1 carrier board, 7" Flat Panel, SD card, Interface cables and power supply (without LEC module and cooling solution)
• SMARC 1.1 compliant LEC-BASE R1 carrier board
• 7” flat panel 800 x 400 display with assembly and USB touch cable
Features
• SD card and USB stick
• Interface cables for camera, GPIO, power management, I2S and SPI
• AC/DC adapter, power cord and universal socket
Items
Optional Items
(Separate Order items)
•
•
•
•
•
•
•
•
•
SMARC 1.1 compliant LEC-BASE R1 carrier board (see extra data sheet for features)
7” at panel 800 x 400 display with assembly and USB touch cable
SD card, 4GB SDHC Card (Class 10)
USB stick (8GB USB2.0 ash drive)
Interface cables for camera, GPIO, power management, I2S and SPI
AC/DC adapter, 19V, 4.7A
Power cord, 7A at 125V (USA)
Universal socket to EU plug, 10-16A, 250V (female)
Universal power socket (male): EU plug
• LEC-iMX6
• Heatspreader for LEC-iMX6
Product Name
LEC-Starter Kit R2
LEC-Starter kit with LEC-BASE R1 carrier board, including SD card and power supply (without LEC module and cooling solution)
Features
Items
•
•
•
•
SMARC 1.1 compliant LEC-BASE R1 carrier board
SD card and USB stick
Interface cables (one way open) for camera, GPIO, power management, SPI, I2C and LVDS
AC/DC adapter, power cord and universal socket
•
•
•
•
•
•
SMARC 1.1 compliant LEC-BASE R1 carrier board (see extra data sheet for features)
SD card, 4GB SDHC Card (Class 10)
USB stick (8GB USB2.0 ash drive)
Interface cables for camera, GPIO, power management, SPI, I²C and LVDS
AC/DC adapter, 19V, 4.7A
Power cord, 7A at 125V (USA)
• Universal socket to EU plug, 10-16A, 250V (female)
• Universal power socket (male): EU plug
Optional Items
(Separate Order items)
P 40
• LEC-BT, LEC-BTS
• Heatspreader for LEC-BT, LEC-BTS
Note: All specifications are subject to change without further notice.
Product Name
LEC-Starter Kit MINI Standard/Custom
LEC-Starter kit with LEC-BASE MINI Standard or Custom, including SD card and ATX power supply (without LEC module and cooling solution)
• SMARC 1.1 compliant LEC-BASE MINI Standard or Custom carrier board
Features
• SD card and USB stick
• LVDS display
• ATX power supply, US power cord, EU power cord
•
•
•
•
•
•
•
Items
Optional Items
(Separate Order items)
SMARC 1.1 compliant LEC-BASE MINI Standard or Custom carrier board (see extra data sheet for features)
7" LCD TFT LVDS display and cables
SD card, 4GB SDHC Card (Class 10)
USB stick (8GB USB2.0 flash drive)
ATX power supply, 300W
US power cord 10A, 125V
EU power cord 220V
• LEC-iMX6, LEC-BT, LEC-BTS, LEC-BW
• Heatspreader for LEC-iMX6, LEC-BT, LEC-BTS, LEC-BW
Product Name
LEC-Starter Kit 2.0
LEC-Starter kit with LEC-BASE 2.0, including SD card and ATX power supply (without LEC module and cooling solution)
Features
•
•
•
•
SMARC 2.0 compliant LEC-BASE 2.0 carrier board
SD card and USB stick
LVDS display
ATX power supply, US power cord, EU power cord
Items
•
•
•
•
•
•
•
SMARC 2.0 compliant LEC-BASE 2.0 carrier board (see extra data sheet for features)
7" LCD TFT LVDS display and cables
SD card, 4GB SDHC Card (Class 10)
USB stick (8GB USB2.0 flash drive)
ATX power supply, 300W
US power Cord 10A, 125V
EU power cord 220V
Optional Items
(Separate Order items)
• LEC-AL
• Heatspreader for LEC-AL
• Heatsink for LEC-AL
Note: All specifications are subject to change without further notice.
P 41
Qseven®
Modules for Stationary and Mobile Applications
Qseven is a Computer-on-Module (COM) standard adopted by SGET for small
sized and highly integrated systems. The Qseven concept is an off-the-shelf,
multivendor, Computer-on-Module that integrates all the core components
of a common PC and is mounted onto an application-specific carrier board.
The Qseven is a versatile small form factor Computer-on- Module standard targeting applications that require ultralow power, low cost and high performance. Qseven modules are used as building blocks for portable and stationary
embedded systems and can also be used in conjunction with carrier boards that implement application specific features
such as audio codecs, touch controllers, wireless devices, etc. This modular approach allows scalability, faster time to
market and performance diversification while maintaining lower costs, low power consumption and small physical size.
Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based
on the high-speed MXM connector, regardless of the vendor. They provide the functional requirements for an embedded
application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single
ruggedized 230 pin MXM edge connector provides the carrier board interface to carry all the I/O signals to and from the
Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly
used for PCI Express graphics cards in notebook computers. The Qseven footprint is smaller than that of COM Express,
ETX or XTX, responding to system designers’ needs for minimal space requirements. Qseven’s power consumption
envelope is below a 12 watt target, whereas SMARC’s target is below 6 watts and COM Express can be well above 20 watts.
Therefore, Qseven designs provide mid-range power values between those of SMARC and COM Express. The Qseven pin
count is 230 compared to 314 and 440 for SMARC and COM Express (Type 2), respectively. Thus, it is optimized for designs
with lower board-to-board pin requirements.
Qseven 2.1 Pinout
4x PCI Express
1x SMBus
2x SATA, max. 8x USB 2.0, max. 3x USB 3.0
1x I2C
Triple display support
1x SPI
LVDS, eDP, HDMI
1x CAN
HDA or I2S
1x Ethernet 10/100/1000Mbit
Watchdog trigger, power button,
power good, reset button
1x UART
LID button, sleep button
1x LPC
Suspend to RAM (S3 mode), wake,
battery low alarm
1x SDIO 4-bit for SD/MMC cards
Thermal & fan control
Product Name
Q7-Starterkit
The Q7-Starterkit consists of a Qseven compliant Q7-BASE carrier board, SD card, USB stick, ATX power supply,
US power cord, EU power cord.
Standard Items
P 42
• Qseven compliant Q7-BASE carrier board
• SD card, 4GB SDHC Card (Class 10)
• USB stick (8GB USB 2.0 Flash Drives)
• 300 Watt ATX power supply
• US power cord, 10A at 125V
• EU power cord, 220V
Product Name
Q7-AL
Q7-BW
Product Name
Q7-BASE
CPU
Intel® AtomTM E3900 Series or
Pentium® N4200 or Celeron® N3350
Processor SoC
Intel® Celeron®
Pentium® N3000 Series SoC
Displays
HDMI, 18/24-bit dual channel LVDS
with backlight connector
Memory
Up to 8 GB LPDDR4 at 2400 MT/s
Up to 8 GB DDR3L
at 1600 MT/s
SDIO
4/8-bit SDIO for MMC/SD
Cache
L2: 2 MB
L2: 2 MB
SPI
1x SPI interface
1x SMBus
1x misc.
Integrated
Graphics
9th Gen Intel® graphics core
architecture with up to 18 execution
units, supports three independent
displays 4k video (up to 4096 x 2160
@60fps)
8th Gen Intel® graphics core
architecture, supports three
independent displays 4K video
(up to 3840 x 2160 @ 30fps)
HD Audio
1x HD audio codec ALC886
1x line in
1x line out
1x microphone
1x S/PDIF in/out
Graphics Features
DirectX 12, OpenGL 4.2, OpenCL 2.0
DirectX 12/11.2,
OpenGL 4.2/3.3, OpenCL 1.2
I²C
1x I²C
Intel® i211 MAC/PHY
1x GbE
Asynchronous
Serial Port
1x asynchronous serial port (UART)
LAN
Intel® i210IT MAC/PHY
1x GbE
CAN Bus
1x CAN bus interface
USB
2x USB 3.0
6x USB 2.0
1x USB 3.0
5x USB 2.0 host
1x USB 2.0 client
USB
2x USB 3.0
5x USB 2.0 host
1x USB 2.0 client
Serial ATA
2x SATA 3.0 (6 Gbit/s) to carrier or
1x SATA 3.0 to carrier and 1x
onboard SATA-SSD
2x SATA 6Gb/s or
1x SATA 6Gb/s and
1x SATA SSD
PCI Express
3x PCIe x1, 1x PCIe Mini Card
SATA
2x SATA
Audio
HDA
HDA
LAN
GbE
PCI Express
3x PCIe x1
3x PCIe x1
Boot Source Select
SPI, eMMC, SD card, SATA
eMMC
Onboard eMMC 5.0 (4-64 GB)
Onboard eMMC 5.0 (4-64 GB)
SEMA Support
Yes
Yes
Camera
2x MIPI CSI 2L/4L
2x MIPI CSI 4L/2L
Miscellaneous
Power Supply
Module Input Voltage: 5.0V
Power Pins: 12 pins, 6A at 5V
Typical IO Voltage: 3.3V
Module Input Voltage: 5.0V
Power Pins: 12 pins, 6A at 5V
Typical IO Voltage: 3.3V
PPC/TPM connector
2x COM
1x LPT
2x PS/2 for keyboard & mouse
7-segment display for BIOS post
code
status LEDs and control buttons
Power Modes
ATX/AT mode
Operating
Temperature
-40°c to 85°C
0°C to 60°C
0°C to +60°C
Standard Voltage
Input
5.0V ±5%, ±50mV ripple, 12V, 3.3V
from ATX connector
Operating
Systems
Windows 10 IOT Enterprise,
Windows 10 IOT Core, Yocto Linux
Windows 7, 8.1, 10,
Yocto Linux, Android
Standby Voltage
Input
5.0V ±5%, ±50mV ripple from ATX
connector
RTC Voltage Input
2.7V to 3.3V, dependent on module
Form Factor &
Compatibillity
Qseven 2.1, 70 x 70 mm
Qseven 2.0, 70 x 70 mm
Board Connector
MXM2 230-pin edge connector
Note: All specifications are subject to change without further notice.
P 43
ETX®
The ETX® modules includes most generic functions needed for almost any application, such as graphics, Ethernet, audio, IDE,
FDD, keyboard/mouse, parallel, serial, and USB ports. ETX modules are available in different performance levels with CPU
speeds to match your requirements. A custom designed carrier board complements the ETX core module with additional
functionality that is required for a specific application. The carrier board provides the interface to connect the module to
peripherals such as hard disk, mouse, and display. Connectors on the carrier board can be placed exactly where needed to
optimize the final package and minimize cabling. This results in a more reliable product and simplified system integration.
A single carrier board can be used with different ETX modules when the same functionality is required at different
performance levels, allowing great ease in end product diversification.
Software Support
To ensure software development does not lag behind hardware development, we provide a full set of BSPs to get you up and
running in no time. BSPs for the following operating systems are provided:
Embedded Linux Development Kit
Linux BSP
Windows CE .Net BSP
VxWorks BSP
Windows XP Embedded support
Fastest Time to Market
The concept of using custom carrier boards combined with off-the-shelf Computer-on-Modules is an excellent solution when
you need to customize, but lack the time or quantity for a complete design from the ground up. The average time to design a
carrier board is less than half of that for a full custom OEM board. ETX is economically feasible for system integration projects
with production volumes in the range of 500 to 10,000 pcs per year.
The ETX concept is well accepted and has numerous advantages over full custom designs. It reduces engineering complexity,
lowers the threshold for total project quantity, and last but not least, brings your product to the market in no time.
Product Name
ETX Starter Kit
The Starter Kit consists of an ETX® core module with Reference Carrier Board that offers four PCI slots, three ISA slots, SDVO,
CRT, LVDS, TV-out, USB 2.0, LAN, and Super I/O. The Starter Kit comes with full baseboard schematics, ETX® Design Guide,
product manuals and BSP. Everything needed to get a user going with his own baseboard design and software verication in no
time.
Features
• ETX-Proto reference carrier board
• Accessory kit:
• IDE cable
• SATA cable
• TV out cable
Standard Items
• CF adapter
• USB Memory Stick with documentation, drivers, libraries, and BSP for Linux, WinCE, Embedded XP
• Baseboard design guide and product manuals
Optional Items
• ETX® module with CPU of choice
• Memory of choice
• Thermal solution of choice (heatspreader, heatsink)
P 44
Product Name
ETX-BT
Product Name
ETX-Proto
Intel Atom Processor
E3800 Family SoC
Interface
ETX v3.0
Audio
Onboard amplifier with Line-in, Speaker-out and
Mic
Line-In/Line-Out, Speaker-out
Video
VGA: DB-15 connector
for analog VGA displays
LVDS: Onboard header LVDS
TV-out: Onboard header
for PAL/NTSC TV
Expansion
Buses
Four 32-bit PCI slots
Three16-bit ISA slots
One Mini PCI slot
®
CPU
TM
Intel® Celeron® Processors
N2930/J1900
Chipset
-
Memory
Up to 4GB DDR3L at 1333/1066MHz
Cache
L2: 512 kB to 2MB
BIOS Type
AMI Aptio EFI
TPM support
(opt.)
Atmel AT97SC3204
Integrated
Graphics
Decode: H.264, MPEG2, MVC, VC-1, WMV9 and VP8
Encode: H.264, MPEG2 and MVC
Graphics
Features
DirectX 11, OCL 1.1,
OGL ES Halt/2.0/1.1, OGL 3.2
USB
Four ports 1.1/2.0 compatible
LAN
Intel® i211 MAC/PHY, supporting 10/100 Mbps
(GbE via onboard connector)
LAN
RJ-45
USB
4x USB 2.0
Parallel ATA
(IDE)
2x PATA IDE
Serial Port
2x 16550 compatible RS-232 ports
2x additional ports COM3/4 from
secondary multi I/O
Serial ATA
2x SATA 3Gb/s
Integrated on E3800 SoC,
supports,
Realtek ALC 262
IDE Port
Four IDE devices (two connectors)
Audio
Parallel Port
One port SSP, ECP, and EEP mode
SEMA Support
Yes
Power Supply
5V±5% / 5Vsb ±5% (ATX)
5V±5% (AT)
KB/Mouse
Two 6-pin mini DIN connectors
(on rear I/O panel)
Operating
Temperature
0°C to +60°C
-40°C to +85°C (optional)
KB/Mouse
Two 6-pin mini DIN connectors
(on rear I/O panel)
OS support
Windows 7/8 Linux,
(WES7, WE8 Std., WEC7; Linux, VxWorks)
Power Modes
ATX and AT onboard
Onboard reset and ATX switches
Form Factor &
Compatibility
ETX 3.02
Size: 95 x 114 mm
Dimension
304.8 x 190 mm
Note:
・ Optional TPM support for special bill of materials
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 45
PC/104
True Ruggedness by Design for Extreme Harsh Environments
ADLINK CoreModule® products (CM series) provide unmatched fanless operation over temperature extremes,
resistance to shock and vibration, conformal coating, embedded BIOS, and a long product life reputation.
CoreModule products are stackable SBCs with a PC/104 footprint (90 × 96 mm) for rugged and compact embedded systems that
continue to distinguish themselves as an Extreme Rugged solution for a multitude of applications.. They feature unmatched
fanless operation over extreme temperature ranges, resistance to shock and vibration, optional conformal coating, no “wings”
(protrusions outside the board footprint), and a long product life. PC/104 is a family of embedded computer standards which
define both a physical form factor and computer bus. The PC/104 concept was originally devised by Ampro in 1987, and later
standardized by the PC/104 Consortium in 1992. The name PC/104 comes from the SA (or PC/AT) bus and the 104 pins on the
connector.
PCI Connector
PCI Connector
PCI Connector
ISA Connector
ISA Connector
PC/104
PC/104-Plus
PCI-104
PCIe Connector
PCIe Connector
PCI/104-Express
PCIe/104
The distinguishing features of the PC/104 family that make it more suited to embedded systems than motherboards with
expansion cards are:
Compact size (90 x 96 mm)
No backplane – modules stack together like building blocks
Interoperability with boards from numerous manufacturers
Based on familiar PC technology for ease of design and development
Rugged construction: stacking bus connectors and corner mounting holes
The PC/104-Plus specification establishes a standard for the use of a high speed PCI bus in embedded applications.
Incorporating the PCI bus within the industry proven PC/104 form-factor brings many advantages to its users, including fast
data transfer over a PCI bus, low cost due to PC/104’s unique self-stacking bus, and high reliability due to PC/104’s inherent
ruggedness. The PC/104 Consortium has established the PCI/104 Express a high speed PCI bus in embedded applications.
Incorporating the PCI bus within the industry proven PC/104 form-factor brings many advantages to its users, including fast
data transfer over a PCI bus, low cost due to PC/104’s unique self-stacking bus, and high reliability due to PC/104’s inherent
ruggedness.
PCIe Device
Memory
PCIe/104 Peripheral Module
PCIe
PCIe Device
PCIe/104 Peripheral Module
Chipset
0.600 inches
(12.24 mm)
PCIe/104 Peripheral Module
PCIe
Memory
processor chip
0.600 inches
(12.24 mm)
PCI/104-Express CPU Module
PCIe Device
0.600 inches
(12.24 mm)
PCI-104 Peripheral Module
0.600 inches
(15.24 mm)
PCIe
0.600 inches
(15.24 mm)
PCIe
0.600 inches
(15.24 mm)
PCIe Device
PCIe-to-PCI Bridge
PCIe
PCIe Device
PCIe
PCI/104-Express CPU with PCIe/104 stack up
and PCI stack down
0.600 inches
(15.24 mm)
PCIe
PCIe Device
PCI-104 Peripheral Module
P 46
PCIe
PCI-104 Peripheral Module
0.600 inches
(12.24 mm)
PCIe
processor chip
PCIe/104 to PCI-104 bridge Module
PCIe
PCIe
Chipset
PCIe/104 CPU Module
PCIe Device
PCI-104 Peripheral Module
PCIe
PCIe/104 with PCIe/104 to PCI Bridge
The PC/104 Consortium has established the PCI/104 Express Specification in order to support the high performance PCI
Express interface while retaining compatibility with the existing PC/104 infrastructure. PCI/104 Express preserves the key
attributes of PC/104 such as compact size (90 x 96 mm), stackability, ruggedness, and compatibility with PC technology.
PCIe/104 is PCI/104-Express without the PCI bus.
PCI/104
Product Name
CM3-BT4
CM3-BT1
CPU
Intel® AtomTM E3845 SoC
Intel® AtomTM E3815 SoC
Cache
Primary 32 KiB, 8-way L1 instruction cache and
24 KiB, 6-way L1 write-back data cache
Primary 32 KiB, 8-way L1 instruction cache and
24 KiB, 6-way L1 write-back data cache
Memory
Up to 4 GB DDR3L SO-DIMM
Up to 4 GB DDR3L SO-DIMM
PATA / SATA
1x SATA 3G/s shared with mSATA
(opt. 2nd SATA 3Gb/s port w/o mSATA support)
1x SATA 3Gb/s shared with mSATA
Serial Port
4x RS-232/485
2x RS-232/485
USB
3x USB 2.0
3x USB 2.0
GPIO
8
8
Audio
HDA
HDA
LAN
2x GbE
1x GbE
Graphics
Intel® HD graphics
Intel® HD graphics
Video
VGA
VGA
Flat Panel
Single/dual channel 18/24-bit LVDS
Single/dual channel 18/24-bit LVDS
SEMA Support
Yes
Yes
Operating Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C (opt.)
OS support
Windows 7, Windows 8, WEC7,
Linux, QNX, VxWorks
Windows 7, Windows 8, WEC7,
Linux, QNX, VxWorks
Dimensions
(W x L)
90 x 96 mm
90 x 96 mm
Note: All specifications are subject to change without further notice.
P 47
PCI/104-Express and PC/104-Plus
Product Name
CMx-SLx
CM-920
CM2-BT2
Intel® Core® i7-3517UE, 1.7 GHz
Intel® Celeron® 807UE, 1.0 GHz
Intel® AtomTM E3825 SoC
Intel® Core®
i3-6102E 1.9GHz
CPU
P 48
Opt.: Intel® Core®, i3-6100E 2.7GHz
Intel® Xeon®
E3-1505L v5
2.0/2.8GHz
Cache
Intel® Core® i3 = 3MB
(Option: Inte® Xeon® processor = 8MB)
4MB/1MB Level 3
Primary 32 KiB, 8-way L1 instruction cache
and 24 KiB, 6-way L1 write-back data cache
Memory
Up to 16 GB soldered ECC DDR4
Up to 4 GB soldered ECC DDR3
Up to 4GB DDR3L SODIMM
PATA / SATA
2x external SATA 6Gb/s
1x internal (SATA-SSD)
2x SATA 6Gb/s
1x SATA 3Gb/s shared with mSATA
(optional 2nd SATA 3GB/s port w/o mSATA
support)
Serial Port
2x RS-232
2x RS-232
4x RS-232/485
USB
1x USB 3.1 Gen 1
4x USB 2.0
4x USB 2.0
3x USB 2.0
GPIO
8
8
8
Audio
HDA
(available on DisplayPort & HDMI port)
HDA
(available on HDMI port)
HDA
LAN
2x GbE
2x GbE
2x GbE
Graphics
Intel® HD Graphics 530
Intel® HD Graphics
Intel® HD Graphics
Video
DisplayPort, HDMI, LVDS
VGA, HDMI, LVDS
VGA
Flat Panel
Single channel 18/24-bit LVDS
Single channel
18/24-bit LVDS
Single/dual channel 18/24-bit LVDS
SEMA Support
Yes
No
Yes
Operating
Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C (opt.)
OS support
Windows 10,
Windows 7, Linux,
VxWorks 7
Windows 7, Windows XP, WEC7,
Linux, VxWorks
Windows 7, Windows 8, WEC7,
Linux, QNX, VxWorks
Dimensions
(W x L)
117.4 x 96 mm
116 x 96 mm
90 x 96 mm
Note: All specifications are subject to change without further notice.
PC/104
Product Name
CM1-BT1
CM1-86DX3
CPU
Intel® AtomTM E3815 SoC
Vortex86DX3 SoC
Cache
Primary 32 KiB, 8-way L1 instruction cache and 24 KiB, 6-way
L1 write-back data cache
L2: 512kB
Memory
Up to 4 GB DDR3L SO-DIMM
2 GB soldered DDR3L
PATA / SATA
1x SATA 3Gb/s shared with mSATA
(opt. 2nd SATA 3Gb/s port w/o mSATA support)
1x SATA 1.5Gb/s (or CFast)
Serial Port
4x RS-232/485
2x RS-232
2x RS-232/422/485
USB
3x USB 2.0
2x USB 2.0
GPIO
8
8
Audio
HDA
-
LAN
2x GbE
1x GbE
1x 10/100 Mbit
Graphics
Intel® HD Graphics
Integrated 2D graphics
Video
VGA
VGA
Flat Panel
Single/dual channel
18/24-bit LVDS
Single channel
18/24-bit TTL/TFT
SEMA Support
Yes
Yes
Operating
Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C
(opt., contact for availability)
OS support
Windows 7, Windows 8, WEC7,
Linux, QNX, VxWorks
WES2009, WES7,
Linux, QNX
on request: WEC7,
Windows CE 6.0
Dimensions
(W x L)
Note: All specifications are subject to change without further notice.
90 x 96 mm
P 49
Mini-ITX
Smaller, Standard Form Factor for Today's Compact Systems
Industry trends indicate that users require a smaller and lower cost solution for their system requirements. Mini-ITX has
a smaller board size and lower keep-out zones to enable a reduced chassis size for systems placed in the user’s solution,
mounted on a display, or installed in space-restrictive environments. Mini-ITX embedded boards bring the benefit of easy
and fast development of industrial computing solutions. In addition to deployment in smaller chassis designed around the
Mini-ITX form factor, these boards are compatible with ATX and micro-ATX chassis without the need to retool the I/O shield.
Mini-ITX embedded boards are ideal for applications in industrial automation, medical, self-service kiosks, and infotainment
driven solutions.
9.00
7.50" (19.05 cm)
6.75" (17 cm)
6.75
9.625" (24.5 cm)
9.625
12.00
9.625" (24.5 cm)
Mini-ITX
Micro-ATX
Flex-ATX
ATX
Flexible, High-Speed and Better Connectivity
ADLINK Mini-ITX embedded boards support the latest Intel and AMD processors to deliver a high performance and spacesaving platform for a wide array of embedded computing applications. Along with its compact footprint, this product
line supports high processing speeds and high-bandwidth network connectivity with PCI Express-based Gigabit Ethernet.
Coupled with ample memory, diverse I/O, storage, and audio interfaces, ADLINK Mini-ITX embedded boards are suitable for
multimedia, automation control, and gaming applications requiring a compact, easy-to deploy, and cost-effective mainboard.
Unique Features :
Consisted design of Form Fit Function: Placement layout, IO, electrical and mechanical compatibility, CPU generation
by generation,
platform by platform
Dual PCIe expansion slots
Unique power design for various power supply options: AT 12V DC-in and standard ATX power supply
Values of Design :
Compact solution dimensions
Vertical USB interface onboard (with spacing, e.g. for
security dongles)
SATA DOM support (with on-board +5VDC converter
for storage supply and spacing)
Socket BIOS and dual BIOS for fail safe operation
P 50
Multi-display support from triple-to-quad display
with 4K/2K support (up to 8 displays with PEG card)
SEMA
Low profile design available
®
TM
Extreme Rugged variants on Intel Atom
Mini-ITX
TPM support
Super rich IO (up to 13x USB, 6x COM ports, two
Mini PCIe and more)
Security solutions, BIOS and BMC customization
Latchable connectors (provide stable connections)
Thin Mini-ITX
The Thin Mini-ITX form factor is the “premier standard for designing and assembling all-in-one PCs,” according to Intel.
Measuring 170 mm square and less than 25 mm thick, Thin Mini-ITX fulfills requirements for applications in digital signage,
infotainment, medical, and industrial automation that are running in limited-space environments. ADLINK’s Thin Mini-ITX
boards also follow the Form, Fit, Function design principle to offer standardized pinout locations and are compatible with the
Micro-ATX and standard ATX chassis.
Solutions
Medical
Industrial
Digital Signage
•
High computing performance
•
Embedded OS, Linux, real-time OS
•
Multi-display
•
Powerful graphics
•
Long life cycle
•
Enhanced graphics performance
•
Lower TDP CPUs
•
Easy and fast integration
•
Ultra slim design
•
Long life cycle
Retail
•
Rich serial ports and USB ports
•
Multi-display with LVDS support
•
Effortless connectivity
Banking
•
Rich I/O and expansion with stable
connection
•
Extra security and system
protection
•
Windows based
Surveillance
•
Support RAID with hot plug
•
Support solid video storage device
•
Ample PCI Express expansion
P 51
Mini-ITX Embedded Boards
High Performance
Group
Product Name
AmITX-SL-G (Updated)
7th Gen. Intel® CoreTM
i7-7700/i7-7700T
i5-7500/i5-7500T
i3-7101E/i3-7101TE
AmITX-HL-G
AmITX-BE-G
4th Gen. Intel® CoreTM
i7-4700S/4770TE/4790S
i5-4570S/4570TE/4590S
i3-4330/4330TE/4360/4350T
Intel® Pentium® G3420/G3320TE
Intel® Celeron® G1820/G1820TE
AMD® R series RX-427BB/425BB/225FB
CPU
6th Gen. Intel® CoreTM
i7-6700/6700TE
i5-6500/-6500TE
i3-6100/6100TE
Intel® Pentium® G4400/G4400TE
®
Intel Celeron® G3900/G3900TE
Chipset
Q170 and H110
PQ87 and H81
AMD A77E
Memory
Up to 32 GB non-ECC Dual Channel
DDR4 at 2133/1866 MHz
Up to 16 GB non-ECC Dual Channel
DDR3/DDRL3 at 1600/1333 MHz
Up to 16 GB non-ECC Dual Channel
DDRL3 at 1600/1333 MHz
Integrated Graphics
Intel® Gen 9 graphics
3 DisplayPort, LVDS co-lay with eDP
(opt.)
3 DispayPort, LVDS (opt.)
AMD® Radeon HD 9000
4 DisplayPort, LVDS (opt.)
SATA
3x SATA 6 Gb/s
Q87: 3x SATA 6 Gb/s
H81: 1x SATA 3 Gb/s and 2x SATA 6Gb/s
3x SATA 6.0 Gb/s
LAN
1x Intel® i219LM/i219-V, GbE
1x Intel® i211AT, GbE
1x Intel® i218LM, GbE
1x Intel® i211AT, GbE
2x Intel® i211AT, GbE
1x RS-232/422/485
3x RS-232
Serial Port
USB
Expansion Slots
Q170: 7x USB 3.0, 4x USB 2.0
H110: 4x USB 3.0, 7x USB 2.0
Q87: 4x USB 3.0, 9x USB 2.0
H81: 2x USB 3.0, 11x USB 2.0
4x USB 3.0
9x USB 2.0
1x PCIe x16, 1x PCIe x1
1x full size Mini PCIe + USB or mSATA
1x half size Mini PCIe+USB
1x PCIe x16, 1x PCIe x1
1x full size Mini PCIe + USB or mSATA
1x half size Mini PCIe + USB
1x SPI header for external BIOS
1x PCIe x16, 1x PCIe x1
1x full size Mini PCIe + USB or mSATA
1x half size Mini PCIe + USB
1x SPI header for external BIOS
1x SPI header for external BIOS
SEMA Support
Yes
Power Supply
12V ±5% / 5Vsb ±5% (ATX), 12V ±5% (AT)
Onboard headers for fan and SATA power
Operating
Temperature
0˚C to +60˚C
Form Factor &
Compatibility
170 mm x 170 mm (L x W)
OS support
7th Gen: Windows 10. Linux, VxWorks
6th Gen: Windows 7/8.1/10, WES 7,
Linux, VxWorks
Windows 7/8, WES 7/8, Linux, VxWorks
Windows 7/8,
WES 7/8, Linux
Note:
・ Optional TPM support for special bill of materials
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 52
Low Power Consumption
Group
Product Name
AmITX-AL-I
AmITX-BW-I
AmITX-BT-I
CPU
Intel® AtomTM E3900 series SoC
Intel® Pentium® N4200
Intel® Celeron® N3350
Intel® Pentium® N3710
Intel® Celeron® N3160/N3060/N3010
Intel AtomTM x5-E8000
Intel® AtomTM E3800 series SoC
Intel® Celeron® N2930/J1900
Memory
Up to 16 GB non-ECC Dual Channel
DDR3L at 1866/1600 MHz
Up to 8GB non-ECC Dual Channel
DDR3L at 1600/1333 MHz
Up to 8 GB non-ECC Dual Channel
DDRL3 at 1333/1066 MHz
2x Intel® i211AT, GbE
LAN
Serial port
2x RS-232/422/485
4x RS-232
2x RS-232/422/485
4x RS-232
3x RS-232/422/485
3x RS-232
4x USB 1.1/2.0/3.0
4x USB 1.1/2.0
USB
Integrated Graphics
1x HDMI, 1x DisplayPort (2x DP is opt.),
LVDS, eDP (opt.)
1x HDMI, 2 DisplayPort, LVDS, eDP (opt.)
VGA, HDMI, LVDS
Expansion slots
1x PCIe x1, 1x Mini-PCIe, 1x mSATA
1x SPI header for external BIOS
1x PCIe x1, 1x Mini-PCIe, 1x mSATA
1x SPI header for external BIOS
1x PCIe x1, 1x Mini-PCIe, 1x mSATA
1x SPI header for external BIOS
SEMA Support
Yes
Power Supply
12V ±5%
Supports ATX/AT mode
Onboard headers for fan and SATA
power
12V ±5%
Supports ATX/AT mode
Onboard headers for fan and SATA
power
Std: 12V ±5% / 5Vsb ±5% (ATX ),
12V ±5% (AT)
Supports ATX/AT mode
Onboard headers for fan and SATA
power
Operating
Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0˚C to +60˚C
0°C to 60°C
-40°C to + 85°C (opt.)
Form Factor &
Compatibility
OS support
170 mm x 170 mm (L x W)
Windows 10, Linux, VxWorks
Windows 7/8.1/10, WES 7, Linux,
VxWorks
Windows 7/8, Linux, VxWorks
Note:
・ Optional TPM support for special bill of materials
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 53
ATX
ADLINK's ATX motherboards provide optimal platforms for industrial automation,
with one-piece PCBA design with no board-to-board connection significantly
improving reliability and durability. The 305 x 244 mm profile is particularly
suitable for space/cost sensitive applications where fewer than 7 slots are
required. Rich features such as multiple PCIe/PCI/LAN/USB3.0 enable immediate
multi-tasking deployment, balancing performance and expandability. ADLINK’s
flexible PCIe configuration enables integration of off-the-shelf frame grabbers,
motion controllers, and data acquisition cards into industrial computers, with
the assurance of strict verification testing presenting an optimum solution for
combined motion & vision applications.
Industrial ATX Motherboards
The ATX motherboard specification, developed originally by Intel in 1995, was the first
major change in desktop enclosure, motherboard, and power supply design in many
years, improving standardization and interchangeability of parts. The specification
defines key mechanical dimensions, mounting points, I/O panel, power, and connector
interfaces between case, motherboard, and power supply. ADLINK’s industrial
motherboards, powered by processors ranging from Intel® CoreTM -based solutions
to server-grade Intel Xeon, are provided in a variety of form factors including ATX,
Extended ATX, and Mini-ITX. Featuring reliable industrial grade design, flexible
expandability, and competitive price, they are an ideal solution for industrial
applications requiring fast time to market with reliable application control.
Industrial Chassis
ADLINK ‘s rack- and wall-mountable industrial chassis target a variety of industrial
automation applications. With integrated subsystem design and service, performance is
fully optimized for combined motion/vision/IO applications.
P 54
PICMG 1.0/1.3
ADLINK's industrial Slot Single Board Computers (SBCs) and backplanes follow PCI Industrial Computer Manufacturers
Group (PICMG) 1.0 and 1.3 standards, with card-on-backplane architecture delivering faster Mean Time to Repair (MTTR)
over conventional motherboard designs, flexible backplane configurations, functional with a broad range of off-the-shelf
peripheral cards. ADLINK’s wide range of PICMG 1.0/1.3 CPU board-compatible backplanes are fully co-functional with
ADLINK systems, for flexible configuration and expandability in industrial applications.
PICMG 1.0 Single Board Computer
Standards-based system/peripheral card-on-backplane architecture is widely accepted
in embedded computing, with PICMG 1.0 the first industry standard for system/
peripheral cards-on-backplane, with support for PCI/ISA interface from board to
backplane. Establishment of this standard provided a stable and efficient environment for
manufacturers to simplify design efforts, minimize costs, allow interoperability of products
from different vendors, and stimulate new product development.
PICMG 1.3 Single Board Computer
The PICMG 1.3 specification is the latest evolution in PICMG 1.x system design, addressing
the need for faster system platforms with high bandwidth interface with peripheral cards.
While flexible system design and PCI compatibility of the older specifications have been
preserved in PICMG 1.3, the ISA bus has been replaced by point-to-point PCI Express serial
links, providing advanced features such as high bandwidth for data transmission and robust
link integrity. The PICMG 1.3 specification allows users to take maximum advantage of
the latest chipset functionalities, increasing bandwidth capability and allowing flexible,
simplified system design.
Passive Backplanes
A wide range of ADLINK backplanes are available for PICMG 1.0/1.3 CPU boards. Fully cofunctional with ADLINK systems, they deliver flexible configuration and expandability for
industrial applications.
P 55
ATX
Product Name
IMB-M43
IMB-M42H
IMB-M40H
Socket
LGA1151
LGA1150
LGA1155
CPU Support
6th Gen. Intel® CoreTM
i7-6700/6700TE
i5-6500/6500TE
i3-6100/6100TE
®
Intel Pentium® G4400/G4400TE
®
Intel Celeron® G3900/G3900TE
4th Gen. Intel® CoreTM
i7-4790S/4770S
i5-4590S/4570S
i3-4360/4330
Intel® Pentium® G3420
Intel® Celeron® G1820
3rd/2nd Gen. Intel® CoreTM
i7-3770/2600
i5-3550S/2400
i3-3220/2120
Intel® Pentium® G2120/G850
®
Intel Celeron® G1620/G540
PCH
Q170
H81
H61
DIMM Type
DDR4
DDR3
DDR3
Speed
2133 MHz
1333/1600 MHz (based on CPU)
1066/1333/1600 MHz (based on CPU)
DIMM Slots
4
2
2
Max. Capacity
64 GB
16 GB
16 GB
ECC/Reg
-
-
-
Dimensions
305 mm x 244 mm (W x L)
305 mm x 244 mm (W x L)
305 mm x 218 mm (W x L)
Graphics
Intel® HD Graphics
Intel® HD Graphics
Intel® HD Graphics
VGA Support
1
1
1
DVI-D Support
-
-
1
HDMI Support
-
1
-
DisplayPort
2
1
-
No. of Displays
Support
3
2
2
GbE port
2
1
2
Controller
Intel® I219LM and Intel® I211-AT
Intel® I217V
Realtek® RTL8111E
Serial ATA
6x SATA 6 Gb/s ports
2x SATA 6Gb/s, 2x SATA 3Gb/s
4x SATA 3 Gb/s
RAID
Intel SW RAID 0/1/5/10
-
-
USB
8x USB 3.0 (2x pin header + 6x rear)
4x USB 2.0 (pinheader)
2x USB 2.0 (Vertical Type A)
8x USB 2.0
(4x pin header + 4x rear),
2x USB 3.0 (rear)
10x USB 2.0(6x pin header + 4x rear)
LPT
1
1
-
COM
4x RS-232(pinheader),
2x RS-232/422/485 auto flow control
(rear)
2x RS-232/422/485 (rear),
(one support 485 auto flow control),
and 4x RS-232pin header
5x RS-232(1x rear + 4x pinheader),
1x RS-232/422/485 auto flow control
(pinheader)
PS/2 KB/MS
1x PS/2 combo port
1x PS/2 combo port
1x KB, 1x MS
Audio
Realtek ALC262
Realtek ALC662
Realtek® ALC892
Expansion Slots
1x PCIe x8, 4x PCIe x4, 2x PCI slots
1 X PCIe x16, 1 x PCIe x4, 4x PCI slots
1x PCIe x16, 2x PCIe x1, 4x PCI slots
Opearation System
Microsoft® Windows® 7 32/64-bit
Microsoft® Windows® 8.1 64-bit
Microsoft® Windows® 10 64-bit
Ubuntu 15.10
Win 7 / 8.1 (32/64bit), Win XP 32 bit,
Ubuntu 13.10,FedoraTM 19,
Redhat Enterprise Linux 7.0
Win XP/ 7 (32/64 bit), Fedora 17
CPU
Chipset
Memory
Form Factor
Display
Ethernet
Storage
I/O Ports
P 56
®
Note: All specifications are subject to change without further notice.
®
Product Name
M-342
IMB-S90
Socket
LGA1155
LGA2011
CPU Support
3rd/2nd Gen. Intel® CoreTM
i7-3770/2600
i5-3550S/2400
i3-3220/2120
Intel® Pentium® G2120/G850
®
Intel Celeron® G1620/G540
Intel® Xeon® E5-2658/E5-2658 v2
E5-2648L/E5-2648L v2
E5-2640 v2
E5-2630 v2
PCH
Q67
C604
DIMM Type
DDR3
DDR3
Speed
1066/1333/1600 MHz (based on CPU)
1600 MHz
DIMM Slots
4
8
Max. Capacity
32 GB
128 GB
ECC/Reg
-
Yes, ECC RDIMM support
Dimensions
305 mm x 244 mm (W x L)
305 mm x 330 mm (W x L)
Graphics
Intel® HD Graphics
Integrated in Aspeed® AS2300
VGA Support
1
1
DVI-D Support
1
-
HDMI Support
2
-
DisplayPort
-
-
No. of
Displays
Support
2/3 (based on CPU)
1
GbE port
2
2
Controller
Intel® 82579LM and Intel® 82574L
Intel® I210-AT
Serial ATA
2x SATA 6 Gb/s ports, 4x SATA 3 Gb/s ports
4x SATA 6 Gb/s from Marvell 88SE9230,
2x SATA 6 Gb/s from PCH, 2x SATA 3 Gb/s from PCH
RAID
Intel SW RAID 0/1/5/10
RAID 0/1/10,Marvell (H/W) and
PCH 0/1/5/10 (S/W) RAID groups are independent
USB
12x USB 2.0 (8x pin header + 4x rear)
8x USB 2.0 (4x pin header + 4x rear)
LPT
1
-
COM
5x RS-232 (pinheader),
1x RS-232/422/485 auto flow control (pinheader)
1x RS-232 (pinheader),
1x RS-232/422/485 (rear)
PS/2 KB/MS
1x KB, 1x MS
-
Audio
Realtek® ALC892
Realtek® ALC262 DB-Audio2(optional)
Expansion Slots
1x PCIe x16, 1x PCIe x4, 5x PCI slots
4x PCIe x16, 1x PCIe x8 and 1x PCIe x4 slots
Opearation System
Win XP/ 7 (32/64 bit), Redhat Enterprise Linux 6.0
Win Server 2012 R2 64 bit, Win 7 64 bit,
Redhat Enterprise Linux 6
CPU
Chipset
Memory
Form Factor
Display
Ethernet
Storage
I/O Ports
Note: All specifications are subject to change without further notice.
P 57
PICMG 1.3
Product Name
NuPRO-E43
NuPRO-E72
Socket
LGA1151
LGA1150
CPU Support
6th Gen. Intel® CoreTM
i7-6700/6700TE
i5-6500/6500TE
i3-6100/6100TE
®
Intel Pentium® G4400/G4400TE
®
Intel Celeron® G3900/G3900TE
4th Gen.
Intel® Xeon® E3-1275 v3/E3-1225 v3/E3-1268L v3
i7-4790S/4770S
i5-4590S/4570S
i3-4360/4330
Intel® Pentium® G3420
Intel® Celeron® G1820
PCH
Q170
C226
DIMM Type
DDR4
DDR3
Speed
2133MHz
1333/1600 MHz(based on CPU)
DIMM Slots
2
2
Max. Capacity
32 GB
16 GB
ECC/Reg
-
Yes, ECC UDIMM support(based on CPU)
Dimensions
338mm x 126mm (L x W)
338mm x 126mm (L x W)
Graphics
Intel® HD Graphics
Intel® HD Graphics
VGA Support
Yes
Yes
DVI-D Support
Yes (pinheader)
Yes (pinheader)
GbE port
2
2
Controller
Intel® I219LM and Intel® I211-AT
Intel® I217LM and Intel® I211-AT
Serial ATA
4x SATA 6 Gb/s (onboard)
4x SATA ports 6 Gb/s (onboard)
USB
8x USB 3.0 (2x rear,6x pinheader) 4x USB 2.0 (backplane)
6x USB 3.0 (2x rear,4x pinheader) 4x USB 2.0 (backplane)
LPT
Yes
-
COM
2x RS-232
2x RS-232/422/485 auto flow control (pinheader)
5x RS-232
1x RS-232/422/485 auto flow control (pinheader)
PS/2 KB/MS
Yes (pinheader)
Yes (pinheader)
Audio
Realtek® ALC262 DB-Audio 2 (Option)
Realtek® ALC262 DB-Audio 2 (Option)
Expansion Slots
1x PCIe x8 & 3x PCIe x4 with WBP-13E4 4x PCI
1x PCIe x8, 3x PCIe x4 with WBP-13E4 4x PCI
TPM
Option
Yes
Opearation System
Microsoft® Windows® 7 32/64-bit
Microsoft® Windows® 8.1 64-bit
Microsoft® Windows® 10 64-bit
Ubuntu 15.10
Microsoft® Windows® 7 64-bit
Microsoft® Windows® 8.1 64-bit
Fedora 19 64-bit
RedHat Enterprise Linux 6.5 64-bit
CPU
Chipset
Memory
Form Factor
Display
Ethernet
Storage
I/O Ports
P 58
Note: All specifications are subject to change without further notice.
Product Name
NuPRO-E42
NuPRO-E340
Socket
LGA1150
LGA1155
CPU Support
4th Gen. Intel® CoreTM
i7-4790S/4770S
i5-4590S/4570S
i3-4360/4330
Intel® Pentium® G3420
Intel® Celeron® G1820
3rd/2nd Gen. Intel® CoreTM
i7-3770/2600
i5-3550S/2400
i3-3220/2120
Intel® Pentium® G2120/G850
PCH
Q87
Q67
DIMM Type
DDR3
DDR3
Speed
1333/1600 MHz (based on CPU)
1066/1333/1600 MHz (based on CPU)
DIMM Slots
2
2
Max. Capacity
16 GB
16 GB
ECC/Reg
-
-
Dimensions
338mm x 126mm (L x W)
338mm x 126mm (L x W)
Graphics
Intel® HD Graphics
Intel® HD Graphics
VGA Support
Yes
Yes
DVI-D Support
Yes (pinheader)
Yes (pinheader)
GbE port
2
2
Controller
Intel® I217LM and Intel® I211-AT
Intel® 82579LM and Intel® 82574L
Serial ATA
4x SATA ports 6 Gb/s (onboard)
2x SATA 6 Gb/s
4x SATA 3 Gb/s (2x onboard, 2x backplane)
USB
6x USB 3.0 (2x rear,4x pinheader)
4x USB 2.0 (backplane)
2x USB 3.0 (rear)
12x USB 2.0 (8x pinheader, 4x backplane)
LPT
-
Yes
COM
5x RS-232,
1x RS-232/422/485 auto flow control (pinheader)
5x RS-232,
1x RS-232/422/485
auto flow control (pinheader)
PS/2 KB/MS
Yes (pinheader)
Yes (pinheader)
Audio
Realtek® ALC262 DB-Audio 2 (Option)
Realtek® ALC262 DB-Audio 2 (Option)
Expansion Slots
1x PCIe x16
1x PCIe x4 or 4x PCIe x1
4x PCI
1x PCIe x16
1x PCIe x4 or 4x PCIe x1
4x PCI
TPM
Yes
Yes
Opearation System
Microsoft® Windows® XP 32-bit
Microsoft® Windows® 7 32/64-bit
Microsoft® Windows® 8 32/64-bit
Windows® XP, 7 32/64-bit
FedoraTM 14, Red Hat Enterprise Linux 5
CPU
Chipset
Memory
Form Factor
Display
Ethernet
Storage
I/O Ports
Note: All specifications are subject to change without further notice.
P 59
PICMG 1.0
Group
PICMG 1.0 SBC
Product Name
NuPRO-A40H
Socket
LGA1155
CPU Support
3rd/2nd Gen. Intel® CoreTM
i7-3770/2600
i5-3550S/2400
i3-3220/2120
Intel® Pentium® G2120/G850
Intel® Celeron® G540
PCH
H61
DIMM Type
DDR3
Clock Speed
1066/1333/1600 MHz (based on CPU)
DIMM
2
Max. Capacity
16 GB
Dimensions
338 mm x 122 mm (L x W)
Graphics
Intel® HD Graphics
VGA Support
Yes
DVI-D Support
Yes (pinheader)
Gigabit
2
Controller
Dual Intel® I211-AT
Serial ATA
4x SATA 3Gb/s
USB
8x USB 2.0 (2x rear,6x pinheader)
LPT
Yes
CPU
Chipset
Memory
Form Factor
Display
Ethernet
Storage
I/O Ports
COM
PS/2 KB/MS
Yes (pinheader)
Audio
Realtek® ALC262 DB-Audio 2 (Option)
Expansion Slots
Opearation System
P 60
5x RS-232, 1x RS-232/422/485
auto flow control (pin header)
Note: All specifications are subject to change without further notice.
PCI & ISA
Win XP / 7 (32/64bit), Fedora 17,
Redhat Enterprise Linux 6
PICMG 1.3 Backplanes
PICMG® 1.3 Backplanes
Group
Product Name
WBP-13E4
EBP-5E1
EBP-7E2
EBP-9E2
EBP-D3E1
PCI-E® x16
1*
1
1
1
-
PCI-E® x4
3
-
1
1
1
PCI-X
-
1
-
-
-
PCITM
8
2
4
6
-
AT
-
-
-
-
-
ATX
Yes
Yes
Yes
Yes
Yes
Segments
1
1
1
1
1
Dimensions
328 mm x 312 mm
153 mm x 330 mm
328 mm x 206 mm
328 mm x 206 mm
331 mm x 39 mm
SATA
2
2
2
2
2
USB 2.0
4(2x vertical,
2x pinheader)
4(pinheader)
4(pinheader)
4(pinheader)
4(pinheader)
TM
* PCIe x8 signal
PICMG® 1.3 Backplanes
Group
Product Name
EBP-6E2
EBP-D5E2
EBP-10E5
EBP-13E2
EBP-13E4
EBP-9E5
PCI-E® x16
1
1
1
1
1
1
PCI-E® x4
1
1
-
1
3
-
PCIe x1
-
-
4
-
-
4
PCI-XTM
-
-
-
-
-
-
PCITM
3
2
4
10
7
3
AT
-
-
-
-
-
-
ATX
Yes
Yes
Yes
Yes
Yes
Yes
Segments
1
1
1
1
1
1
Dimensions
328 mm x 140 mm
331 mm x 84 mm
330 mm x 318 mm
330 mm x 318 mm
330 mm x 318 mm
244 mm x 348 mm
SATA
2
2
2
2
2
2
USB 2.0
4 (pinheader)
4 (pinheader)
4 (pinheader)
4 (pinheader)
4 (pinheader)
4 (pinheader)
Note: All specifications are subject to change without further notice.
P 61
PICMG 1.0 Backplanes
PICMG® 1.0 Backplanes
Group
Product Name
HPCI-D3S2
HPCI-D6S4
HPCI-6S4
HPCI-8S4
HPCI-9S7U
PCITM
2
4
4
4
7
ISA
-
1
1
3
1
AT
-
Yes
Yes
Yes
Yes
ATX
Yes
Yes
Yes
Yes
Yes
Segments
1
1
1
2
2
Dimensions
261 mm x 39 mm
261 mm x 79.6 mm
264.2 mm x 132.7 mm
264.2 mm x 218 mm
213.4 mm x 259.1mm
PICMG® 1.0 Backplanes
Group
P 62
Product Name
HPCI-13S4LU
HPCI-14S12U
HPCI-14S/ATX
HPCI-19S18A
PCITM
4
12
4
18
ISA
7
1
8
0
AT
Yes
Yes
Yes
Yes
ATX
Yes
Yes
Yes
Yes
Segments
3
2
2
2
Dimensions
314.7 mm x 259 mm
314.7 mm x 259 mm
312 mm x 265 mm
415.3 mm x 264.2 mm
Note: All specifications are subject to change without further notice.
Chassis
Rackmount Industrial Chassis
Group
Product Name
RK-110S / RK-110SE
RK-210S / RK-210E
RK-260 /RK-260-E/
RK-260MB-GC13
Type
Rackmount
Rackmount
Rackmount
Height
1U
2U
2U
Depth
17.7” (450mm)
17.7” (450mm)
17.7” (450mm) / 19.7” (500mm)
Backplane/
Motherboard Option
HPCI-D5S2 (RK-110S)
EBP-D3E1 (RK-110SE)
HPCI-D6S4 (RK-210S)
EBP-D5E2 (RK-210E)
HPCI-D6S4 (RK-260)、
EBP-D5E2 (RK-260-E)、
ATX motherboard (RK-260MB-GC13)
Rackmount Industrial Chassis
Group
Product Name
RK-410FS
RK-440
RK-610A/RK-610AM
Type
Rackmount
Rackmount
Rackmount
Height
4U
4U
4U
Depth
17.8” (451mm)
26.4” (671mm)
17.8” (451mm)
Backplane/
Motherboard Option
HPCI-13S4LU
HPCI-14S12U、HPCI-14S/ATX
EBP-10E5、EBP-13E2
EBP-13E4、WBP-13E4
HPCI-19S18A
HPCI-13S4LU、HPCI-14S12U、
HPCI-14S/ATX、EBP-10E5、
EBP-13E2、EBP-13E4、
WBP-13E4(RK-610A)
ATX motherboard(RK-610AM)
Wallmount Industrial Chassis
Group
Product Name
RK-607B
RK-608B-E
RK-608MB-C
Type
6 slot for SBC
10 slot for SBC
7 slot for motherboard
Dimension
10 in x 6.9 in x 16.5 in
(254 mm x 175 mm x 419.1 mm)
(W x H x D)
13 in x 6.9 in x 16.5 in
(330 mm x 175 mm x 418 mm)
(W x H x D)
13 in x 7.7 in x 16 in
(330 mm x 196 mm x 406 mm)
(W x H x D)
Backplane/
Motherboard Option
HPCI-6S4、EBP-5E1、EBP-6E2
HPCI-8S4、HPCI-9S7U
EBP-7E2、EBP-9E2、EBP-9E5
ATX motherboard
Note: All specifications are subject to change without further notice.
P 63
Chassis
Rackmount Chassis
Group
Slots per Segment
PICMG 1.0
Compatible Chassis
PCI-X
RK410FS
RK-610
-
√
√
1
-
√
√
8
-
√
√
RK410FS
RK-610
Segment
PCI
ISA
HPCI-D3S2
1
2
-
-
HPCI-D6S4
1
4
1
-
HPCI-13S4LU
3
4
7
HPCI-14S12U
2
12
HPCI-14S/ATX
2
4
PICMG 1.3
PICMG
PCI
EBP-10E5
1
4
4
EBP-13E2
1
10
-
EBP-13E4
1
7
EBP-D5E2
1
EBP-D3E1
WBP-13E4
PCI-E
x1
x4
x16
PCI-X
RK110S
RK-210S
RK-260
√
√
√
RK110SE
RK-210E
RK-260E
1
-
√
√
1
1
-
√
√
-
3
1
-
√
√
2
-
1
1
-
1
-
-
1
-
-
1
8
-
3
1**
-
√
√*
√
√
√
*Missing one PCI
**PCIe-x8 signal
Wallmount Chassis
Group
PICMG 1.0
P 64
Slots per Segment
PCI-X
Compatible Chassis
Segment
PCI
ISA
HPCI-6S4
1
4
1
-
HPCI-8S4
2
4
3
-
√
HPCI-9S7U
2
7
1
-
√
PICMG 1.3
PICMG
PCI
EBP-5E1
1
EBP-7E2
PCI-E
RK-607B
RK-608B-E
√
PCI-X
RK-607B
1
1
√
1
1
-
√
-
1
1
-
√
3
-
1
1
-
3
4
-
1
-
x1
x4
x16
2
-
-
1
4
-
EBP-9E2
1
6
EBP-6E2
1
EBP-9E5
1
Note: All specifications are subject to change without further notice.
RK-608B-E
√
√
Chassis
Single Board Computers
Group
Slots per Segment
PICMG 1.0
Compatible SBCs
ISA
Segment
PCI
HPCI-D3S2
1
2
-
√
HPCI-D6S4
1
4
1
√
HPCI-6S4
1
4
1
√
HPCI-8S4
2
4
3
√
HPCI-9S7U
2
7
1
√
HPCI-13S4LU
3
4
7
√
HPCI-14S12U
2
12
1
√
HPCI-14S/ATX
2
4
8
√
HPCI-19S18A
2
18
0
√
Single Board Computers
Group
PICMG 1.3
NuPRO-A40H
Slots per Segment
PCI-E
Compatible SBCs
Segment
PCI
PCI-X
x1
x4
x16
NuPRO-E42 NuPRO-E340 NuPRO-E72
NuPRO-E43
EBP-5E1
1
2
1
-
-
1
√
√
√**
√
EBP-6E2
1
3
-
-
1
1
√
√
√**
√
EBP-7E2
1
4
-
-
1
1
√
√
√**
√
EBP-9E2
1
6
-
-
1
1
√
√
√**
√
EBP-9E5
1
3
-
4
-
1
√
√
√**
√
EBP-10E5
1
4
-
4
-
1
√
√
√**
√
EBP-13E2
1
10
-
-
1
1
√
√
√**
√
EBP-13E4
1
7
-
-
3
1
√
√
√**
√
EBP-D5E2
1
2
-
-
1
1
√
√
√**
√
EBP-D3E1
1
-
-
-
1
0
√
√
√**
√
WBP-13E4
1
8
-
-
3
1*
-
-
√
√
* PCIe x8 signal
** Need Special Part Number
Note: All specifications are subject to change without further notice.
P 65
Power Supplies
Industrial Mini-Redundant AC Power Supply
Group
Maximum DC Output Current
Power
(typical)
+3.3V
+12V
-12V
-5V
+5Vsb
AC Voltage
Input Range
Certifications
+5V
APS-946XAR
460 W
25 A
25 A
30 A
0.8 A
-
2A
Universal
UL/cUL/TUV/CCC
APS-940XAREPS12(for RK-440)
400 W
35 A
25 A
28 A
1.2 A
0.5 A
2A
Universal
UL/cUL/TUV/CCC
Product Name
* Dimensions: 195 x 160 x 86 (mm)
Industrial AC Power Supply PS2 Form Factor
Group
Maximum DC Output Current
Power
(typical)
+5V
+3.3V
+12V1
+12V2
+12V3
APS-930XAATX12
300 W
16 A
19 A
17 A
17 A
APS-946XAEPS12
460 W
20 A
24 A
16 A
16 A
APS-960XA-EPS12
600 W
25 A
25 A
16 A
16 A
APS-946XAEPS12(for RK-440)
460 W
40 A
30 A
32 A
-
Product Name
-12V
-5V
+5Vsb
AC Voltage
Input Range
Certifications
+12V4
-
-
0.5 A
0.3 A
3A
Universal
UL/cUL/TUV/
CCC
-
-
0.5 A
0.3 A
3A
Universal
UL/cUL/TUV/
CCC
0.5 A
0.3 A
4A
Universal
UL/cUL/TUV/
CCC
0.5 A
0.8 A
2A
Universal
UL/cUL/TUV/
CCC
-
-
* Dimensions : Standard PS2 form factor, 140 x 150 x 86 (mm) ; APS9100XA-EPS12 (for RK-470MB) form factor, 220 x 150 x 86 (mm)
Industrial AC Power Supply 1U/2U Form Factor
Group
Product Name
Maximum DC Output Current
+3.3V
+12V
-12V
-5V
+5Vsb
AC Voltage
Input Range
Certifications
+5V
Power (typical)
APS-9130XU
300 W
16 A
14 A
16 A
0.5 A
0.3 A
3A
Universal
UL/cUL/TUV/CCC
APS-9235XU
350 W
25 A
20 A
28 A
-
0.5 A
2A
Universal
UL/cUL/TUV/CCC
* Dimensions: APS-9130XU: 190 x 100 x 40.5 (mm)、APS-9235XU : 215 x 100 x 70 (mm)
P 66
Note: All specifications are subject to change without further notice.
Heatsinks and Fans
LGA1156 / LGA1151 / LGA1150
Group
LGA2011
Product Name
32-20131-0000
32-20113-2000
32-20113-0000
32-40289-0000
Thermal Dispatch
Performance
84Watt
95Watt
95Watt
95Watt
FAN
75mm (blower)/11.83 CFM
(5,500 ± 10%) R.P.M
95mm/ 78.74 CFM
(6,100 ± 10%) R.P.M
95mm/ 42.73 CFM
(4,200 ± 10%) R.P.M
6cm/ 50.40 CFM
(9,000 ± 10%) RPM
Heatsink Materials
Copper
Aluminum + Cooper
Aluminum + Cooper
Copper
Heatsink Dimensions
84L x 84W x 13H (mm)
ø 95*24.8H (mm)
ø 90*39.3H (mm)
63.9L x 89.7W x64H (mm)
Dimensions
84L x 84W x 28H (mm)
ø 95*50.2H (mm)
ø 90*67.7H (mm)
89.2L x 89.7W x64H (mm)
Weight
382 g
295 g
600 g
396 g
Minimum Chassis
Height
1U
2U
3U
2U
Recommended Chassis
RK-110S, RK-110SE
RK-210S, RK-210E,
RK-260-E,
RK-260MB, RK-440,
RK-610A/AM, RK-608MB-C
RK-607B, RK-608B-E
RK-440, RK-610A/AM,
RK-608MB-C
TRL-40, RK-470MB
Supported Boards
NuPRO-A40H/E72/
E42/E43, IMB-M43
NuPRO-A40H/
E72/E42/E43,
IMB-M42H/M40H/
M-342/M43
NuPRO-A40H/E42/E72/E43/
E340, IMB-M42H/M40H/
M-342/M43
IMB-S90
Note: All specifications are subject to change without further notice.
P 67
Accessories
Product
Name
HDD Adapter Brackets
4U Rear I/O Panel Kit
Riser Card
・2UE1S2 Riser Card,
PCIe x16 + 2 PCI slots
Specification
・Designed for
RK-260MB-GC13
COM Cable
・COM cable with bracket
・1 port (2.54 pitch,450mm):
30-25004-1000 (for IMBM40H,M-342)
・1 port (2.0 pitch,450mm):
30-25003-2100 (for NuPROA40H/E340/E42/E72/E43)
Ordering
Information
・One 3.5” HDD in one 5.25”
bay:34-30264-1000
・2.5” to 3.5” HDD adapter
bracket:58-80024-0000
・2 port (2.54 pitch,230mm):
30-25003-0020 (for NuPROA40H/E340/E42/E72)
・ATX rear I/O panel for RK-410:
58-80013-1000
・ATX rear I/O panel for
RK-610A:34-90063-0000
・92-97051-0010
・15-slot rear I/O panel for
RK-610A: 34-90064-0000
・2 port (2.0 pitch,230mm):
30-25003-1000 (for NuPROA40H/E340/E42/E72/E43)
・2 port (2.54 pitch,600mm):
30-25053-1000 (for IMB-M42H)
・2 port (2.54 pitch,450mm):
30-25003-3000 (for NuPROA40H/E340/E42/E72/, IMBM40H/M43,M-342)
・2 port (2.0 pitch,450mm):
30-25003-2100 (for NuPROA40H/E340/E42/E72/E43)
Product
Name
USB 3.0 Cable
USB 2.0 Cable
Specification
・2-port USB 3.0
cable with
bracket, L=450mm
・2/4-port USB 2.0
cable with bracket
・2-port (L=400mm):
30-25010-3010 (for
NuPRO- A40H/
E340, IMB-M42H/
M40H/M43, M-342)
Ordering
Information
・180° : 30-250460100
(for NuPRO-E42/
E72/E43, IMB-M43)
・90° : 30-25046-1100
(for NuPRO-E42/
E72/E43)
・4-port (L=600mm):
30-25009-3000 (for
NuPRO-A40H/E340,
IMB-M42H/M40H/
M43, M-342)
・4-port (L=600mm)
with shielding
ground:
30-25009-2000 (for
NuPRO-A40H/E340,
IMB-M42H/M40H/
M43, M-342)
KB/MS Cable
・KB/MS cable with
bracket
・2x Mini-DIN PS/2
KB/MS cable with
bracket:
30-01019-2010
(for NuPRO-E340/
E72/E42/E43/A40H)
・1x USB + 1x MiniDIN PS/2 KB/MS
“combo”cable with
bracket: 30-250270000
(for NuPRO-E340/
A40H)
DVI Cable
・DVI-D cable with
bracket for
onboard connector
Product
Name
Item name
DB-Audio2
・High Definition
Audio Daughter
Board with Linein,
Line-out and Mic-in
・Realtek ALC262 High
Definition Audio
codec
・30-01052-2000
(for NuPRO-E340/
E72/E42/E43/A40H)
・Three jacks: line-in,
line-out and mic-in
Description
・5x2 pin header for
cable connection to
external audio
header on SBC
・4-pin header
interface for CD
audio output
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