2U2P Server HTB V3.0
03-HUAWEI RH8100 V3_8-socket server
Pre-sales Specialist Training V1.0
Agenda
1
Click
to add Title
Scale-up Server
Trends
2
Click to add Title
RH8100 V3 Introduction
3
toHighlights
add Title
RH8100 V3 Click
Feature
4
Click 8S
to Analysis
add Title
Key competitors‘
2
S. M. A. C. Trends Are Driving Server to Change
More
efficient
Disaggregated
Social Network


Mobility
Business Analytics

Disaggregated
computing and
storage
Scale-out
software stack
Cloud computing
3

processing like
OLTP & OLAP

Virtualized &
pooled resources

Scale-out
Real-time
More
RAS features
Low IO latency
CI
Appliance

More Reliability,
Availability and
Serviceability
features to assure
business
integration
Open platform
with lower TCO
Scale-up
Mission Critical Business Requires Reliable 4S/8S Servers
Business
Fat node for
Intelligence
virtualization
Enterprise
+99.99%
Mission-criticals
4
In-Memory
In-memory
r eliability and u ptime
+
scalability
Computing
Unix-to-Linux Migration Raises More 8S x86 server Need
Legacy“IOE”architecture
New IT architecture
Enterprise Mission-criticals
DB Oracle RDBMS
DB Oracle
Unix OS
x86 4S/8S server
Unix Server
HDD Storage
HDD+SSD storage
Value-added or Cloudized business
Open source DB NoSQL/MySQL
Challenges of Legacy IOE:
• Proprietary ecosystem, hardware & software
provided by only a few vendors
• Not only high CapEx but also post-sales OpEx
5
x86 2S Server
Server SAN/Cloud storage
x86 4S/8S Ready to Replace RISC Servers
Huawei x86 4S/8S
Xeon E7 vs Power7
Up to 112%
performance
28% system cost
Intel Xeon E7-4800
4S RH5885H V3
E9000 4S blade
8S RH8100 V3
IBM Power7 (P750)
Avg Downtime (hours) /year*
0.19
0.25
0.23
0.29
0.22
IBM AIX/Power
Suse SLES/x86
Windows Server 2008 R2/x86
2013
2012
1.12
Performance/Price:
0.36
0.59
Oracle Solaris/SPARC
0
1
6
x86+ Linux
Close to
Power + Unix
2009
3.02
0.22
Red Hat RHEL/x86
RAS features:
x86 is better
2
3
4
* 来源: ITIC Global Server Hardware & Server OS Reliability Survey
Agenda
1
Click
to add Title
Scale-up Server
Trends
2
Click to add Title
RH8100 V3 Introduction
3
toHighlights
add Title
RH8100 V3 Click
Feature
4
Click 8S
to Analysis
add Title
Key competitors‘
7
E7 v2 Bypass the 32nm Sandy Bridge From 1st gen E7
Intel® Core™
Microarchitecture
Intel® Microarchitecture
Codename Sandy Bridge
Intel® Microarchitecture
Codename Nehalem
Intel® Microarchitecture
Codename Haswell
Merom
Penryn
Nehalem
Westmere
Sandy
Bridge
Ivy
Bridge
Haswell
Future
65nm
45nm
45nm
32nm
32nm
22nm
22nm
14nm
New
Microarchitecture
New
Process
Technology
New
Microarchitecture
New
Process
Technology
New
Microarchitecture
New
Process
Technology
New
Microarchitecture
New
Process
Technology
TOCK
TICK
TOCK
TICK
TOCK
TICK
TOCK
TICK
 Intel CPU usually
follows tick-tock steps;
while E7 v2 is an
exception
 E7 v2, launched in Feb
2014, bypass the Sandy
bridge since the 1st gen
E7 launched in 2011
Intel® Xeon® Processor E7 – 8800/4800/2800 v2 Product Families delivers:
PERFORMANCE
MEMORY
RELIABILITY
reliability andptime
u
+
scalability
In-Memory
Up To
Up To
3X
2X
Capacity
Throughput Improvement
8
Designed For
>99.999%
Reliability
2 Generation Xeon E7 CPU Comparison
2011
2012
2013
Boxboro-EX platform
Intel® Xeon®
processor
7500/6500 series
(NHM-EX)
Intel® Xeon®
processor E7-8800/4800/2800
product families
(WSM-EX)
(8S/8S+, 4S, 2S, 3rd party node-controller designs), Millbrook-1&2,
ICH-10, Skt-LS, QPI 1.0
Features
Up to 10
Up to 15
32 nm
22 nm
4x Intel QPI 1.0, 6.4 GT/s max.
3x Intel QPI_v1.1, 8.0 GT/s max.
Up to 30 MB
Up to 37.5 MB
800, 978, 1066 (Mill Brook 2 memory buffer)
1066, 1333, 1600 (Jordan Creek 1 Memory
Buffer)
16 DIMMs (2 DIMMS/DDR channel)
24 DIMMs/(3 DIMMs/DDR channel)
L3 cache
DIMMs /CPU
NHM-EX Baseline Features +
RAS features
Brickland platform
Intel® Xeon® processor E7Intel® Xeon® processor E78800/4800/2800 v2
8800/4800/2800 v3
Future
product families
Xeon® E7
product families
(HSW-EX)
(IVB-EX)
(8S/8S+, 4S, 2S, 3rd party node-controller designs), Skt R1, QPI v1.1,
Jordan Creek 1&2 DDR3/4, Intel® C602 chipset (Patsburg -J)
E7-8800/4800/2800 v2 (IVB-EX)
CPU process
Memory freq. (MHz)
Future
2015
E7-8800/4800/2800 (WSM-EX)
Max core count/CPU
QPI Ports/speed
2014
Patrol Scrubbing, Demand Scrubbing, Fine Grained
Memory Mirroring, Sparing, x4/x8 SDDC+1bit+
DDDC+1bit(x4)
PCIe channels /CPU
No
9
•
•
•
•
WSM EX Baseline Features +
eMCA Gen 1
MCA recovery – Execution Path
MCA recovery – IO
PCIe LER
32 PCIe* 3.0, 1x x4 DMI2
E7 v2 Features on Brickland Platform
Ivy Bridge–EX CPUs
• Socket R1: Up to 15 cores
• Last-level Cache: Up to 37.5 MB
Patsburg
(optional)
Connectivity
PCIe* 3.0
X4 DMI2
X4 DMI2
JC
JC
JC
JC
• 3 Intel® QPI v1.1 links per socket
• 8, 7.2 & 6.4 GT/s on all links
• PCI Express 3.0 : 32 lanes per socket + x4 DMI2
Patsburg
(optional)
32 PCIe*
3.0 / skt
JC
JC
QPI v1.1
JC
JC
JC
QPI v1.1
JC
JC
IVB EX
New Security features
X4 DMI2
Patsburg
(optional)
Intel® OS Guard
Intel® Secure Key
10
X4 DMI2
PCIe* 3.0
4x Jordan Creek
memory
expansion per
socket
JC
IVB EX
JC
Enhanced MCA Gen1 (eMCA Gen 1)
MCA recovery Execution Path
MCA recovery (IO)
PCIe Live Error Recovery (LER)
•
•
IVB EX
JC
New RAS capabilities
•
•
•
•
IVB EX
JC
• Up to 24 DIMMS per socket (3DPC/ 96 DIMMS)
• 4 Intel® SMI Gen 2 per-socket (w/Intel® C102/C104
Scalable Memory Buffer codenamed ‘Jordan Creek 1’)
• VMSE speed of up to 2667 MT/s (2.667 GT/s)
• RDIMMs, DDR3L, LR-DIMM
JC
Memory
32 PCIe*
3.0 / skt
Patsburg
PCH
Topology of 8-socket Server
8 x E7-8800 v2 series CPU
192 DIMMs,24 DIMMs/CPU
1 or 2 hops between two E7 v2
CPU
11
RH8100 V3 Key Specification
Form Factor
Front view
RH8100 V3 front & back view
CPU counts
4 or 8
CPU type
Intel Xeon E7-8800 v2 series, 6/8/10/12/15 cores
DIMM
Up to 192 DDR3 DIMMs,max 6TB(32GB) or 12TB (64GB)
HDD
12 or 24 2.5” SAS or SATA HDD or SSD
RAID
Rear view
8U
RAID0、1、10、5、50、6、60,max 2GB cache
PCIe slots
Up 16 PCIe slots1 (6 of 16 only for GPGPU/SSD cards )
LOM
8× GE , 4× 10GE or 4x GE + 2× 10GE
PSU
220V/110V AC -48V DC, 1+1 or 2+2 redundancy
Fans
8 hot-pluggable fans, N+1 redundancy
Temperature
5℃-40℃
Size(H×WxD)
352mm×447mm×855mm
Highlights
• High reliability:60 RAS features, support memory module hot swapable and hardware partition
• 2X performance:Support E7-8800 v2 series CPU,up to 120 cores and 12TB memory
• Large local storage:Up to 24 2.5 inch hard drives, good for big data and HANA applications
• Easy maintenance: Modular design,HDDs fans and (4) PCIe cards are hot swappable
12
RH8100 V3 Front View
CPU & Memory


8 CPU modules (1 CPU + 2 memory
sub-modules )
16 hot swappable modules
HDD



2 optional front modules, 12 or 24
HDD s
6Gb/12Gb SAS or SSD
Multiple RAID functions
Diagnostics panel

Front view of 12 HDD config.
13


Touchable LCD panel
Key components status displaying
User is able to configure thru LCD
Compute Module & Its Memory Module
Each memory module has 2 buffers and 12 DIMMs
14
FM-A: Front module A is 12x 2.5” HDDs plus 6 PCIe slots locating behind the 12 HDDs.
Notes: These 6 PCIe slots support SSD and GPU cards only, who do NOT have output ports
RH8100 V3 Back View
PCIe slot

8 fans

Up to 16 full height slot(rear: 10;
internal : 6)
4 of 16 PCIes slots support hot-swap
Ethernet Mezzanine card
2 management
modules


Two Ethernet mezz cards
3 types: 2 GE, 4 GE and 2x 10GE
PSU
4 PSUs



6 PCIe slots, not
hot-swappable
4 PCIe slots,
hot-swappable
15
Ethernet Mezz card
94%,platinum PSU
Support 2+2, or 1+1
Support power capping
4 hot-swappable PCIe Slots
 4 of 10 PCIe slots in the rear support hot-swappable
 Hot-swappable operations support Windows Server,Red Hat Linux and SUSE Linux OS
16
Agenda
1
Click
to add Title
Scale-up Server
Trends
2
Click to add Title
RH8100 V3Introduction
3
toHighlights
add Title
RH8100 V3 Click
Feature
4
Click 8S
to Analysis
add Title
Key competitors‘
17
RH8100 V3 Feature Highlights
1. 60 RAS features
1. Up to 120 core
1.Modular design
2. memory modules hot
2. Max 12TB DDR3
2.PCIe, fan etc hot-
swappable
3. Up to 16 PCIe slots
3. Fault management
4. 24 2.5”HDD/SSD
4. FusionPar hardware partition
swappable
3. Touchable LCD
4. Remote management
5.Support 40°C ambient
temperature
 Reliable
 Performance
Reliable & Powerful
18
 Easy
maintainence
60 RAS features Assure System Uptime
Memory RAS
Fault Management System
• Hot swappable memory
module
• Implemented by Sensors,
• Memory Pre-Failure
alert
CPLD, Huawei Hi1710 BMC
chip and BIOS
• Memory mirror &
sparing
Hot-swap technology
• Memory module
• PCIe slot
• Cooling fan
• HDD
19
Redundancy
• 1+1 management module
• 1 + 1 two BIOS flash chip
• 2+2 or 1+1 PSUs
• Redundant fans
Hot-swappable Memory module
16x memory modules
8 CPU module)
Each CPU module includes
2 memory sub-modules
20
RH8100 V3 memory module
•
RH8100 V3 is made of 8 CPU
modules. Each CPU modules include
1 E7 v2 CPU plus 2 memory submodules
•
Each memory module has 12 DIMM
slots.
•
Support memory hot migration
then hot replacement or hot-swap
•
Support DDR3 evolution to DDR4
How Memory Module is hot-swapped?
Hot-swapping Step by Step
High performance Fusion Console
(PCH chipset + BMC)
HFC
step1_b: Report to user
IVB-EX
step1_c: User take Hot-swao action
IVB-EX
IVB-EX
step 3:data in memory
is online relocated
MEM-15
MEM-3
New -3
MEM-1
step 4&5:Swap memory
module
step1_a: PFA finds the warnings
MEM-16
MEM-4
MEM-2
step 2:
Sparing
memory
module star
working
Each of 8 compute books has 2 memory modules
1 of 2 memory modules is plugged out
PCT patent:PCT/CN2013/087XXX
Serial NO: 20140409012xxxxx
Application date:20131122
Running
Error
Applicant:Huawei Technologies Co. Ltd
Sparing
PFA: Predictive Failure Analysis
21
Subject:A memory data migration method, computer and device
A Closer Look of RH8100 Memory Module
1 of 8 Compute
book or Compute
module
1 of 2 memory
module in each
Compute book
22
Hardware Partition: FuionPar
Hardware Partition-FusionPar
Total
8 CPU
192 DIMM
Partition-A
CPU
CPU
CPU
Partition-B
CPU
CPU
CPU
CPU
96 DIMM
96 DIMM
CPU
• RH8100 V3 can be
configured as 2 4-socket
servers
•Using FusionPar Customer
12 HDD
16 PCIe
6 HDD
6 HDD
8 PCIe
8 PCIe
can configure it through LCD
or BMC interface
•A gigabit Ethernet heartbeat
HFC-1
HFC-2
23
locates between the two 4socket
Hardware Partition: FuionPar
HFC-1
HFC-1
HFC-2
GEheartbeat
HFC-2
CPU
CPU
CPU
CPU
CPU
CPU
CPU
CPU
CPU
CPU
CPU
CPU
CPU
CPU
CPU
CPU
Two 4S
mode
Single 8S
mode
step1: Customer can partition it through BMC web UI or a button on LCD
panel
step2: RH8100 V3 would automatically finish the remaining actions
24
A Closer Look of
RH8100 Rear IO
4 hot-swappable PCIe slots
PBI module of RH8100 V3
(PCH + BMC + mezzanine IO card)
Two PBI boards locate in left and right sides.
Intel PCH chipset
Note: In both 8P and partitioned 4P
modes, the PCH on this PBI works
Mezzanine card, 4 options:
4x GE, 2x GE, 2x 10GE(RJ45) and 2x 10GE(SFP+)
25
Huawei Fault Management System
Boards AND Modules
CLK
PWR
Remote
Web
Status
主要业务资源
Local
LCD
BMA(optional)
OS
BIOS
CAT_ERR/ERROR/...
CPLD
PECI
CPLD_BUS
BMC based on Huawei
Hi1710
CPU0
I2C
BIOS Port ME
• Firmware:BIOS and out-of-band
management software
26
General
Component
Processor Platform
DMI2
User Interface
PCIe
Feature
• Core: Huawei HI1710 BMC chip
MCE
Banks AER CSR
I2C
T&P
Sensors
PCH
Critical
Component
MCE
Banks AER CSR
PCIe
FANs
CPUn
REGs
DIMMs
PMBUS
PSUs
QPI
DIMMs
LPC/SML/...
REGs
Logs
Huawei Fault Management System
• Predictive Failure Analysis: memory, HDD, Fan, PCIe SSD
• Two ways to set: Web UI and LCD panel
Able to Run in 40°C Ambient Temperature
• Well-designed air path helps take the heat away
quickly, the cooling system is able to dissipate 6000W
heat
• Noise Control:Noise level is below 69dBA
Air path in different zones
• SmartPower: Dynamic power monitoring and control
High efficiency, low noise fan
27
• Aluminum heatsink with embedded copper pipe :
Heat-resistance is lower than ever, support TDP 155Watt
CPU
Powerful Computing Capability
OLTP:
Up to 240 threads
1.7x
Virtualiztion :
Max. 12TB memory
Up to
1.7x
300 VMs
Up to 24 HDDs
0101010
1010
Huawei PCIe SSD
28
OLAP:SAP-HANA
Up to 6TB certified
Two Front HDD Modules, 12 or 24 HDDs
FM-A(12HDD)
29
FM-B(24HDD)
Agenda
1
Click
to add Title
Scale-up Server
Trends
2
Click to add Title
RH8100 V3Introduction
3
toHighlights
add Title
RH8100 V3 Click
Feature
4
Click 8S
to Analysis
add Title
Key competitors‘
30
Specification Comparison: RH8100 V3 versus Counterparts
IBM x3950 x6
Fujitsu 2800E
Oracle X4-8
Inspur TS860
Huawei RH8100 V3
Form factor
8U
10U
5U
8U
8U
CPU(note1)
2/4/8* E7-8800 v2 series
2/4/6/8* E7-8800 v2 series
4/8* E7-8800 v2 series
4/8* E7-8800 v2 series
Memory
192DIMMs/[email protected]
192DIMMs/[email protected]
192DIMMs/6TB @32GB
192DIMMs/12TB
16 hot-swappable memory
modules
max HDDs
Up to 16 x
2.5”SAS/SATA/SSD
or 32个1.8” SSD
Up to 24 2.5”SAS/SATA/SSD
8x 2.5”SAS or
8x 2.5”Emlc SATA SSD
Up to 16 x 2.5”
12 or 24 *2.5”
18(claims 22 slots,in fact
4 of 22 are dedicated for
RAID)
16 LP PCIe slots
8* x8 + 8* x16, hotpluggable via DPPC(
dual PCIe card carriers )
26
Two IO modules, no hotswappable slot
16(front 6, rear 10)
Support hot-swappable,
but have to 3 slots grouped
to hot swap, not individually
16 LP or
12(4FH+8LP)
(doesn’t support Double
Wide GPU)
No hot-swappable slot
2 ML2 LOM
LOM=2GE/4GE/2x10GE(RJ45
or SFP+),support FCoE
4个IO Unit
IO Unit = 2 GE or 2 10GbE
(SFP+)
2 GE
4 GE LAN on motherboard,
no 10GE
PCIe slots
LOM or
Mezz card
4/8* E7-8895 v2
(may also other 8800 v2 CPU)
Note 1:usually 4 or 8 CPUs are installed on an 8-socket server. 2 and 6 CPU installation is very few seen.
Note 2 : DDR3 64GB now is quite expensive so far, unquotable in UniStar yet
31
Red = advantage, blue = disadvantage
192DIMMs/12TB2
4 of rear 10 slots hotswappable individually
2 LOM Cards
Optional GE or 10GE(RJ45
or SFP+)
Specification Comparison: RH8100 V3 versus Counterparts (cont’ed)
IBM x3950 x6
Fujistu 2800E
Oracle X4-8
Inspur TS860
Huawei RH8100 V3
Form factor
8U
10U
5U
8U
8U
Other
Ports
Front : 1 VGA + 4 USB3.0
Rear:1 VGA + 8 USB2.0
+ DB-9 + GbE
management
Internal:2 USB
Front: 4 USB x (4USB + 1
VGA)
Rear: 2MMB x ( 4GbE +
DB-9)
8*1400W/900W AC ,
Power
supply units
8*750W DC;
80 PLUS Platinum
4+4
Cooling
fans
20
20 redundant hot-swap fan
packs and 10 fan zones
with N+1 fan redundancy.
Each fan pack includes two
counter-rotated dual-motor
fans.
Ambient
temperatur
e
5~40°C
1 VGA
4 USB ports (two external, Front:2USB2.0 + 1 DB-9
two internal)
Rear: 2 USB2.0 + 1
1 Serial management
management+ 1 VGA
RS232 RJ-45 port
Front: 1VGA + 2USB
Rear: 2 x ( 1 UART+ 1
VGA + GE management
+ 2 USB)
Internal:2 USB (1PCH
+ 1 out-band)
4 hot-swappable front
6*3000W AC,3+3/3+1,
accessible power supplies,
8*800W AC,4+4/4+1,hot-plug
80 PLUS Platinum
Rated input current
80 PLUS Titanium
hot-plug
[email protected]~240VAC, N+N
(website claims Titanium PSU)
redundancy
6
6fan modules contained in
PSU and FANU. i.e. Fan and
PSU are 2in1
8
dual counter rotating fan
100Watt/fan
5~35°C
5~35°C
32
4*2000W/3000W AC
4*2500W DC ,
2+2/2+1
hot-plug,80 PLUS Platinum
6
Hot-swappable, no more
detail disclosed
5~35°C (2014 Q1 brochure)
5~40 (2014-08 website)
Red = advantage, blue = disadvantage
8
Hot-swappable, N+1 fan
redundancy
5~40°C
RH8100 V3 Advantages
RH8100 V3
Features
Against vendors
RH8100 V3 advantage
Competitors’counterparts
Modular design
vs esp. against Inspur,
partially IBM
All modular design for easy maintenance.
RH8100 V3 supports single processor module
(or called block or book), totally 8 processor
module. Besides, the management module,
mezz LAN card, PSU, Fan, HDD module are
all modular
Inspur: 4 CPUs + 96 DIMM as one module, too
heavy to maintain. Fujitsu
Both IBM and Inspur 8S are two sub-4S-modules,
while Fujitsu is four sub-2S-modules.
Self-developed BMC
chip
vs All vendors
Huawei has the Hi1710 BMC chip.
IBM IMM2 uses Renesas chip, other vendors
are unknown. Maybe Aspeed chip.
Memory module hot
swappable
vs All vendors
So far the only 8S x86 server that support
memory module hot-swappable.
IBM, Fujitsu and Inspur do not support howswappable memory module
Individual PCIe slot
hot-swappable
vs All
4 of 10 PCIe locating in rear IO support hotswap individually. That is, plug in/our one PCIe
card other PCIe slots will not be afffected.
IBM x3950 X6 has to hot swap PCIe slots by
group. That is 3 PCIe slots as a group can be hot
swapped.
PCIe slots on Fujitsu 2800E and Inspur TS860 do
not support hot-swap
Flexible-LOM,
Support NCSI
management
vs All
Two mezz Ethernet cards available, each can
be 2GE , 4GE or 2x 10GE. Max configuration
can be 8 GE ports or 4x 10GE
IBM:ML2 (4GE or 2x 10GE) support out-ofband systems management.
Fujitsu: Max 8x GE or 8x 10GE
Inspur: only GE LOM, no 10GE
33
RH8100 V3 Advantages (Cont’ed)
RH8100 V3
Features
Against vendors
RH8100 V3 advantage
Competitors‘ counterparts
8S partitioned as two
4S. One GE
management port can
manage two 4S.
Vs. all
Huawei FusionPar technology support hardware
partition trhu web UI or LCD panel, no BIOS
setting change needed.
All 8S claims supporting partition.
But lack more detail in data sheet.
Built-in DVD
vs IBM, Fujitsu,
Inspur
RH8100 has a built-in DVD
Inspur TS860 is optional, but have to
remove 8 HDDs to house DVD
Touchable diagnosis
LCD panel
vs IBM、Fujistu
RH8100 has the touchable LCD panel
Fujistu:no touchable LCD panel
IBM: LCD diagnostics panel is not touchable
Single RAID mezz
card manages up to
24 HDDs
vs IBM、Fujistu
One RAID mezz card can manage either 12
HDDs FM-A or 24 HDDs FM-B.
Note: propose to configure two RAID mezz
cards in 24 HDD case for better
performance
Fujistu:single RAID support max 4 HDD
IBM:single RAID support max 8 HDD
Inspur: Unknown
PCIe SSD ES3000
vs All
ES3000 and ES3000 V2 PCIe SSD cards are
in-house design by Huawei, well validated
on RH8100 V3
IBM, Fujitsu do not have their own PCIe SSD
card, usall OEM from FusionIO etc .
6TB-Single Node
HANA
vs Inspur, (Fujitsu)
RH8100 has been certified by SAP for
128GB to 6TB HANA
IBM x3950 X6 has to use external Storage
for 6TB HANA solution, since there is not
local 24 HDDs
Support 40°C
temperature
Vs Fujitsu
RH8100 can long run in 40°C ambient
temperature
IBM x3950 X6 and Inspur claims to support
40°C. Fujitsu , Oracle35°C
34
IBM x3950 X6 - Main modules
Up to 8 PSU,
900WAC/1400WAC/
750WDC(-48V)
2 Storage Books
Each Book inlcudes:
•1 RAID for 8HDDs
2 Primary IO Books
•2 RAID for 16 1.8inch SSDs
Each Book includes
…
•1 LOM /ML2
•3x PCIe(2个x16+1x8)
8 Compute Book
Each Book includes:
4 Optional IO Books
•1 CPU
Each Book includes:
•24 DIMM(on both sides)
•3x PCIe slots, two
•2x fans
options:
Half length: 2x8+1x16
35
Half length: 2x16+1x4
•2 fans
Fujistu 2800E- Main Module
Shared 8x 2.5
HDDs,
4 compute module,each
has 2 CPU, 4HDD and
48DIMMs
4 IO Unit , each IOU
has two options:
• 2GE + 4 PCIe LP
•2 10GE + 3PCIe(2 FH
+ 1 LP)
2 system management
boards,1+1
6 fan modules contained in
PSU and FANU
36
Oracle Sun server X4-8
5U, Front view
4 PSU
8 CPU module (CMOD)
Rear view
8x HDD + 16 LP PCIe
Each CMOD:
1 CPU + 24 DIMM
16 PCIe slots in 8 carriers, each has 1 x8 + 1 x16
37
http://docs.oracle.com/cd/E40591_01/html/E40317/gnsey.html#XFESMgoako
Inspur TS860
6 cooling fans
Compute module:2x 4S
Each module:4CPU + 96 DIMM
Rear IO
Left: 8 HDD
26 PCIe slots
(suspected that a
few PCIe slots has
no IO space)
Right:
DVD or
2nd 8 HDD module
8 PSUs
Diagnostics panel
38
LOM
GE,
managemnt
HUAWEI ENTERPRISE ICT SOLUTIONS A BETTER WAY
Copyright©2012 Huawei Technologies Co., Ltd. All Rights Reserved.
The information in this document may contain predictive statements including, without limitation, statements regarding the future financial and operating results, future product
portfolio, new technology, etc. There are a number of factors that could cause actual results and developments to differ materially from those expressed or implied in the predictive
statements. Therefore, such information is provided for reference purpose only and constitutes neither an offer nor an acceptance. Huawei may change the information at any time
without notice.
Main Accessories of RH8100 V3
HDD/SDD
CPU( E7-8800 v2 series)
HDD 500GB-SATA-7200rpm-2.5"-64M
E7-8850v2-12Core-2.3GHz
HDD 1000GB-SATA-7200rpm-2.5"-64M
E7-8857v2-12Core-3.0GHz
HDD 146GB-SAS-15000rpm-2.5"-64M
E7-8870v2-15Core-2.3GHz
HDD 300GB-SAS-10000rpm-2.5"-16M
HDD 300GB-SAS 6Gb/s-15000rpm-2.5"-64M
E7-8880v2-15Core-2.5GHz
HDD 600GB-SAS 6.0Gb/s-10000rpm-2.5"-16M+
E7-8890v2-15Core-2.8GHz
HDD 900GB-SAS 6.0Gb/s-10000rpm-2.5“-64M+
E7-8891v2-10Core-3.2GHz
HDD 1200GB-SAS 6Gb/s-10000rpm-2.5inch-64M
HDD 1000GB-NL SAS 6Gb/s-7200rpm-2.5“-64M
E7-8893v2-6Core-3.4GHz
SSD-200GB-SATA 6Gb/s-2.5 inch-eMLC
Optional memory modules
DDR3 RDIMM 4GB 1333MHz 1.35V ECC
DDR3 RDIMM 8GB 1600MHz 1.5V ECC
DDR3 RDIMM 8GB 1600MHz 1.35V ECC
DDR3 RDIMM 16GB 1333MHz 1.35V ECC
DDR3 LRDIMM 32GB 1333MHz 1.35V ECC
SSD-240GB-SATA III-2.5"-MLC
SSD-400GB-SATA 6Gb/s-2.5 inch-eMLC
Optional IO mezz cards
2*GE 、4GE RJ45 cards
2*10GE RJ45
2X10GE SFP+
8Gb HBA卡
For your reference only. Please use UniStar when offering a quotation
40
新8P RH8100 V3 功率:100%负载下3588W
输入电源:240VAC,配置2个AC-DC 电源模块
测试方法: 开机进OS后,运行Intel CPU压力测试工具、内存压力测试工具、网卡压力测试、SSD读写测试
工具、GPU压力软件,运行以上软件约3小时后,在稳定状态下测试240VAC交流输入功率为3588W
测试配置
型号/容量
数 量
单项小计
CPU
至强 E7-8893 v2 (TDP 155Watt)
满配8颗
CPU 1240W
内存
16GB DDR3内存条
192条,共3TB
3TB 内存
硬盘
300GB 2.5寸SAS盘
12块
3.6TB SAS硬盘
双端口10GE 以太网卡,约10W
3块
30W
四端口 GE 以太网卡,约10W
3块
30W
nVidia M2090 GPU, 功耗225W
2 张GPU卡
450W
华为ES3000 PCIe SSD卡, 2.4TB /60W
2张
120W
华为ES3000 PCIe SSD卡, 1.2TB /45W
2张
90W
扩展卡
(10张)
减少内存条、GPU等扩展卡数量,整机功耗会低于3000W
41
8P RH8100 V3 功耗评估
基于以下配置,在不同CPU负载下对整机的功耗进行评估。实际运行业务时会有偏差。
测试配置
型号/容量
数 量
CPU
至强 E7-8870 v2
满配8颗
内存
16GB DDR3内存条
64条,共 1 TB
硬盘
600 GB 2.5寸SAS盘
4块
双端口10GE 以太网卡
2块
四端口 GE 以太网卡(板载)
1块
2*16Gb双口HBA
2块
PCIe SSD标卡
2块
PCIe扩展卡
(x 张)
注:25C,220V AC输入
负载大小
(CPU占用率)
预估功耗(W)
10%
20%
30%
50%
60%
70%
80%
90%
100%
600
712
831
1070
1189
1308
1427
1546
1666
42
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