get connected - Future Electronics

get connected - Future Electronics
Get Smart • Get Efficient • Get to Market Quickly
GET CONNECTED
with Future Connectivity Solutions
ISSUE
05
FEATURED TECHNOLOGIES
Bluetooth
Cellular
NFC
Wi-Fi
SUPPLIERS
Taking the world wireless
Connectivity Solutions
CSR
GainSpan
MultiTech
NXP
Silex
STMicroelectronics
TABLE OF CONTENTS
ISSUE 5
BLUETOOTH
Csr Audio Rom Platforms Help To Create Highly Differentiated Consumer
Products With A Fast Time To Market
CELLULAR
Multi-Tech - Programmable Gateway for the Internet of Things
NFC
Nxp Semiconductors - NFC Readers and NTAG Solutions
3
8
13
WI-FI
Gainspan - Iot Solutions Offer Flexibility To Work Optimally With Any Mcu Or Without Mcus
18
Silex - SX-PCEGN-BT: Low-Cost Mini-PCIe Combo Wi-Fi Module Features Compatibility With
Freescale’s I.MX6 Platform
20
STMicroelectronics - SPWF01SX Wi-Fi Modules For Iot Applications
23
GET CONNECTED | ISSUE 5
2
CSR AUDIO ROM PLATFORMS HELP TO
CREATE HIGHLY DIFFERENTIATED CONSUMER
PRODUCTS WITH A FAST TIME TO MARKET
CSR engineers work with the world’s audio leaders to bring a truly exceptional
listening experience to a broad range of consumer devices, including
Bluetooth® mono and stereo headsets, Bluetooth mono and stereo
speakers, and soundbars. Their all-in-one silicon and software solutions
deliver a rich user experience, small form factor options and consistently
top independent surveys for best audio performance and clarity. Their
technologies – such as aptX® and cVc® - help to differentiate many of the
world’s most desirable consumer electronics brands.
Figure 1: CSR8645
Their broad portfolio of ROM devices and associated development kits
provide a very flexible and powerful development platform for designing
advanced, high-quality, Bluetooth stereo products across the price range of
Bluetooth headset and speaker consumer products.
APPLICATIONS
BENEFITS
• Bluetooth Stereo Headsets
• Broad portfolio of devices addressing complete range of feature and
price-segments
• Bluetooth Stereo Speakers
• Bluetooth Mono Headsets
• Bluetooth Mono Speakers
• F
ully configurable ROM solution reduces development cost, risk and
time to market
• F
lexible control of I/O and user interface (buttons / LEDs / prompts)
enables differentiated user experience
• Music CODECs and EQ control deliver optimum audio enjoyment
FEATURES
• Single chip solution
• Superior audio performance
• B
C61xx ROMs deliver cost-conscious performance for entry-level and
low-end
• CSR86xx ROMs provide higher-tier user-experience features
• Programmable or fully-custom voice prompt control
Figure 2: CSR8620 Block Diagram
Figure 3: CSR8640 Block Diagram
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MONO HEADSET ROMS
BC6130
TARGET
APPLICATION
DESCRIPTION
BLUETOOTH
VERSION
BC6140
BC6145
CSR8610
CSR8620
Ultra Low Cost
Low Cost mono
headset
Low cost mono headset with music
Mid-range 1-mic
mono headset with
music
Mid-range 2-micmono
headset with music
Entry Level Headset
1 Mic NR/EC Headset
1 Mic NR/EC Headset
with music
1 Mic cVc
2 Mic cVc
v2.1 + EDR
v3.0
v3.0
v4.0
v4.0
• Bluetooth 2.1 +
EDR with secure
simple pairing
• Bluetooth 3.0
• Bluetooth V3.0
• Bluetooth 4.0
• Bluetooth 4.0
• Support for
proximity pairing
• Wide band speech
CODEC
• HFP1.6, A2DP1.2
and AVRCP1.4
• HFP1.6, A2DP1.2
and AVRCP1.4
• Support for
proximity pairing
• Enhanced HFP
Multipoint
• A2DP mono music
streaming
• HD voice
(wideband speech)
• HD voice
(wideband speech)
• HFP Multipoint
• Programmable
audio prompts
• Talk-time extension
• iOS battery status
monitor
• iOS battery status
monitor
• Smart Apps
support (Using
GAIA)
• Smart Apps
support (Using
GAIA)
• Multi-Language
custom audio
prompts
• Multi-Language
custom audio
prompts
• Configurable LED
drivers
• Configurable LED
drivers
• Talk-time Extension
• Talk-time Extension
• 6th generation
CVC®
• 6th generation
CVC®
• 1-mic Far-end NR /
AEC algorithms
• 2-mic Far-end NR /
AEC algorithms
• Near-end audio
enhancements
• Near-end audio
enhancements
• Frequency
Enhanced Speech
Intelligibility
• Frequency
enhanced speech
intelligibility (FESI)
• Selectable audio
prompts
• Optional Wind
Noise Reduction
• cVc (Clear
Voice Capture)
technology for EC
/ NR
• 1-mic solution
KEY FEATURES
• Far End and
Near End speech
enhancements
• Packet Loss & Bit
Error Concealment
• Multi-language
audio prompt
support
• Ultra-low power
WNR during active
and listening states
• Frequency
Enhanced Speech
Intelligibility
• Enhanced HFP
Multipoint
• Other features as
per BC6140
• Ultra-low power
• Ultra-low power
WNR (200μA active;
WNR (200μA active;
10μA monitoring)
10μA monitoring
PACKAGE OPTIONS
• 48-pin QFN 7x7mm • 48-pin QFN 7x7mm • 48-pin QFN 7x7mm • 5.5x5.5mm, 68-pin
0.5mm pitch
0.5mm pitch
0.5mm pitch
BGA (0.5mm pitch)
• 5.5x5.5mm, 68-pin
BGA (0.5mm pitch)
• Pin compatible
with BC6140 /
BC6145
• WLCSP Package
option (0.5mm
pitch)
• WLCSP Package
option (0.5mm
pitch)
• Pin compatible
with CSR8620
• Pin compatible
with CSR8610
• Pin compatible
with BC6130 /
BC6145
• Pin compatible
with BC6130 /
BC6140
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SPEAKER ROMS
BLUECORE
BC6145
TARGET
APPLICATION
DESCRIPTION
BLUETOOTH
VERSION
Mono Music
Speakers
CSR8630
Stereo Music
Speakers
Ultra low cost
Entry level mono
mono speaker with
speaker, no mic
mic
Entry level mono
speaker with mic
Entry level stereo
speaker, no mic
Entry level stereo
speaker with mic
Mid range stereo
speaker with mic
and aptX
Bluetooth v3.0
Bluetooth v4.1
Bluetooth v4.1
Bluetooth v4.1
Bluetooth v4.1
Bluetooth v4.1
• Bluetooth V3.0
• Bluetooth 4.1
• Bluetooth 4.1
• Bluetooth 4.1
• Bluetooth 4.1
• Bluetooth 4.1
• Wide band
• A2DP1.2 and
speech CODEC
AVRCP1.0
• HFP1.6, A2DP1.2 • A2DP1.2 and
and AVRCP1.4
AVRCP1.4
• HFP1.6, A2DP1.2
and AVRCP1.4
• A2DP mono
music
streaming
• HD voice
(wideband
speech)
• Advanced
Multi-point
(2xA2DP)
• HFP1.6,
A2DP1.2 and
AVRCP1.4
• Advanced Multipoint (2xHFP,
2xA2DP)
• Wired Audio
(Stereo Line-in)
• Wired Audio
(Mono Line-in)
• Music
Enhancements
(Multi-band
EQ)
• Smart Apps
support (GAIA)
• Wired Audio
(Stereo Line-in)
• Ultra-low power • Multi-Language • Music EnhanceWNR during
custom audio
ments (Multiactive and
prompts
band EQ)
listening states • Configurable
• iOS battery
• Frequency
LED drivers
status monitor
Enhanced
• Smart Apps
Speech
support (GAIA)
Intelligibility
• Multi-Language
• Enhanced HFP
custom audio
Multipoint
prompts
• Music
Enhancements
(Multi-band
EQ)
• iOS battery
status monitor
• Smart Apps
support (GAIA)
• Wired Audio
(Stereo Line-in)
• Music
Enhancements
(Multi-band
EQ)
• 6th generation
CVC®
• 1-mic Far-end
NR / AEC
algorithms for
headset
• 1-mic Far-end
NR / AEC
algorithms for
handsfree
• Frequency
enhanced
speech
intelligibility
(FESI)
• 68-pin QFN,
8x8mm, 0.4mm
pitch
• Advanced
Multi-point
(2xHFP,
2xA2DP)
• HD voice
(wideband
speech)
• Wired Audio
(USB and
Analogue)
• AAC-LC,
MP3 and SBC
decoders
• Leading aptX®
CODEC for highquality audio
• Multi-band EQ
(up to 6 x banks)
• Headphone
stereo separation
(soft 3D)
• iOS battery status
• Multi-Language
monitor
custom audio
• Smart Apps
prompts
support (GAIA)
• Configurable
• Multi-Language
LED drivers
custom audio
• 1-mic Far-end
NR / AEC
algorithms for
headset
• 48-pin QFN
7x7mm 0.5mm
pitch
• HD voice
(wideband
speech)
• Multi-Language
• iOS battery
custom audio
status monitor
prompts
•
Smart Apps
• Configurable
support (GAIA)
LED drivers
• 6th generation
CVC®
OPTIONS
CSR8645
Stereo Music
Speakers
• Configurable
LED drivers
PACKAGE
CSR8635
Stereo Music
Speakers
• Multi-language
audio prompt
support
FEATURES
Mono Music
Speakers
CSR8615
Mono Music
Speakers
• Talk-time
extension
KEY
CSR8605
• 6th gen dual-mic
cVc® NR / AEC
algorithms
• Frequency
enhanced
speech
intelligibility
(FESI)
• 2-mic Far-end NR
/ AEC algorithms
• 68-pin BGA,
5.5x5.5mm,
0.5mm pitch
• 68-pin QFN,
8x8mm, 0.4mm
pitch
• 68-pin QFN,
8x8mm, 0.4mm
pitch
• 68-pin QFN,
8x8mm, 0.4mm
pitch
• Pin compatible
with CSR8635
and CSR8630
• Pin compatible
with CSR8615
and CSR8635
• Pin compatible
with CSR8615
and CSR8630
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prompts
• Configurable LED
drivers
• Frequency
enhanced speech
intelligibility
(FESI)
5
STEREO HEADSET ROMS
CSR8640
CSR8645
TARGET APPLICATION
Mid-range
Mid-range with aptX high-quality audio
DESCRIPTION
2 Mic Stereo Headsets with cVc
2 Mic Stereo Headsets with cVc and aptX
•
•
•
•
•
•
•
•
•
•
•
•
Bluetooth 4.1
HFP1.6, A2DP1.2 and AVRCP1.4
HD voice (wideband speech)
Wired Audio (USB and Analogue)
AAC-LC, MP3 and SBC decoders
Multi-band EQ (up to 6 x banks)
Headphone stereo separation (soft 3D)
iOS battery status monitor
Smart Apps support (GAIA)
Multi-Language custom audio prompts
Configurable LED drivers
6th gen dual-mic cVc® NR / AEC
algorithms
• 2-mic Far-end NR / AEC algorithms
• Frequency enhanced speech
intelligibility (FESI)
•
•
•
•
•
•
• 5.5x5.5mm, 68-pin BGA (0.5mm pitch)
• Pin compatible with CSR8645
• 5.5x5.5mm, 68-pin BGA (0.5mm pitch)
• Pin compatible with CSR8640
KEY FEATURES
PACKAGE OPTIONS
A complete range of audio
development kits is available
to enable rapid evaluation and
development of Bluetooth ROM
applications. The Dev Kits include
everything a designer needs to get
started quickly and deliver a fully
functional product to market in a very
quick time.
The kit includes an SPI-USB converter
to allow software development via
USB, a level shifting interface board
is also included for communications
with the development board. The
kit also includes batteries, Bluetooth
stub antenna and high-quality
headphones as well as a quick-start
guide and all necessary cables.
•
•
•
•
•
•
•
•
•
Bluetooth 4.1
HFP1.6, A2DP1.2 and AVRCP1.4
HD voice (wideband speech)
Wired Audio (USB and Analogue)
AAC-LC, MP3 and SBC decoders
Leading aptX® CODEC for highquality audio
Multi-band EQ (up to 6 x banks)
Headphone stereo separation (soft 3D)
iOS battery status monitor
Smart Apps support (GAIA)
Multi-Language custom audio prompts
Configurable LED drivers
6th gen dual-mic cVc® NR / AEC
algorithms
2-mic Far-end NR / AEC algorithms
Frequency enhanced speech
intelligibility (FESI)
DEVELOPMENT KIT SELECTOR TABLE
TARGET DEVICE
DESCRIPTION
DEV KIT PART NUMBER
BC6130
BC6130 QFN Dev Kit
DK-BC-6130-1A
BC6140
BC6140 QFN Dev Kit
DK-BC-6140-1A
BC6145
BC6145 QFN Dev Kit
DK-BC-6145-10037-1A
CSR8605
CSR8605 QFN Dev Kit
DK-8605-10141-1A
CSR8610
CSR8610 BGA Dev Kit
DK-8610-10083-1A
CSR8615
CSR8615 QFN Dev Kit
DK-8615-10161-1A
CSR8620
CSR8620 BGA Dev Kit
DK-8620-10065-1A
CSR8630
CSR8630 QFN Dev Kit
DK-8630-10153-1A
CSR8635
CSR8635 QFN Dev Kit
DK-8635-10163-1A
CSR8640
CSR8640 BGA Dev Kit
DK-8640-10061-2A
CSR8645
CSR8645 BGA Dev Kit
DK-8645-10064-1A
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CSR8645™Development Kit Contents:
Figure 4: CSR8645 Software
Development Board
Figure 5: Wired Headset
Adaptor Board
Figure 6: SPI-USB Converter
and Interface Board
Figure 7: Cables, headphones and
Quick Start guide
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PROGRAMMABLE GATEWAY FOR
THE INTERNET OF THINGS
MultiTech’s new IoT platform includes programmable gateways, long-range
RF modules, accessory cards, and a remotely hosted application marketplace
with comprehensive device management. MultiConnect® Conduit™
is the industry’s most configurable, manageable, and scalable cellular
communications gateway for industrial IoT applications. Network engineers
can remotely configure and optimize their Conduit performance through
DeviceHQ™, the world’s first IoT Application Store and Device Management
platform.
Conduit features two accessory cards slots that enable users to plug in
MultiConnect® mCard™ accessory cards supporting their preferred wired
or wireless interface to connect a wide range of assets locally to the gateway.
Available options include a LoRaWAN mCard capable of supporting
thousands of MultiConnect® mDot™ long-range RF modules connected to
remote sensors or appliances. Backhaul options include Ethernet or carrier
approved and certified 4G-LTE, 3G & 2G options.
Figure 1: MultiTech’s new IoT
platform
BENEFITS
• Incredible asset management
range - up to 10 miles line
of sight, 1 to 3 miles into
buildings
• Backhaul options include
4G-LTE, 3G & 2G cellular or
Ethernet for cost-effective
global deployment
• Integration support with a
variety of partner and private
Cloud Platforms
• 2-way communication over
any certified cellular network
for cost effective global
deployments
• Create differentiated services
for your customers via
MultiTech’s Application Store
• Developer documentation
and support available at
www.multitech.net
Both IBM’s Node-RED, a graphical, drag and drop interface and mLinux™
Open Embedded/Yocto 1.6 are supported to provide IT professionals,
integrators and developers alike, their choice of development environments.
Opening the complex world of IoT application development to a wider
user group to monitor and control assets, utilize the distributed intelligence
available in the Conduit gateway to provide analytics on incoming data and
provide more actionable outgoing data.
APPLICATIONS
Low Power Wide Area (LPWA)
• Smart City – metering and submetering, parking, security and fire
alarms
• Smart Agriculture – environmental sensors
• Building Management
FEATURES – MULTICONNECT® CONDUIT™
• Easy, fast, flexible and unrestricted application development via Open
Linux, Java Script or Node-RED environments
• Integration support with a variety of partner and private Cloud
Platforms
• Create differentiated services for your customers via MultiTech’s
Application Store
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What’s in the MultiConnect
Conduit Box?
MTCDT-H5-210L-xx and MTCDTH5-210A-xx models include: Power
supply with US, EU and UK power
blades, Ethernet cable, USB cable,
and cellular antenna.
MTCDT-210L-xx and MTCDT-210Axx models include: Power supply
with US, EU and UK power blades,
Ethernet cable, and USB cable.
Developer Kit and Accessories
MultiTech’s MultiConnect® mDot™
Developer’s Kit is designed to work
with all versions of mDot RF modules.
The kit includes a development
board, SMA antenna and USB cable
(mDot sold separately).
Ordering Part Number:
MTUDK2-ST-MDOT
FEATURES – MULTICONNECT® MDOT™
• FCC/CE end-certified with ARM® mbed libraries for developers
• 2-way duplex communication enables ideal for emergency or mission
critical applications
• Multiple I/O interfaces for most any “Thing”
• LoRaWAN 1.0 Compliant data rates 293 bps – 20 Kbps+, FSK up to 300
Kbps
FEATURES – MULTICONNECT® MCARD™
• Manages diverse infrastructures through a wide range of interfaces
and communication protocols including, Multi-Function Serial, GPIO
and LoRa™ technologies. Wi-Fi, Bluetooth and GNSS coming soon!
• Incredible performance - manages thousands of MultiConnect mDots
connected to field assets, remote sensors and appliances
• Two mCard slots increases operational capability without incurring
extra gateway costs
FEATURES – DEVICEHQ™
•
•
•
•
“Zero Touch” asset deployment reduces costs, complexity and time
No truck-rolls via remote performance management and asset updates
Update firmware and custom applications remotely
Browse and download a wide variety of custom applications tailored to
your business needs
Figure 2: MTUDK2-ST-MDOT
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PART SPECIFICATIONS
MODEL
MTCDT-LXXX
MTCDT-H5
Technical Specifications
Performance
LTE 3GPP Release 9 (100 Mbps peak downlink/50 Mbps peak uplink)
AT&T/T-Mobile: HSPA+ 21/GPRS fallback
Europe: HSPA+ 42/GPRS fallback
Verizon: No fallback
HSPA+
Frequency Bands (MHz)
AT&T/T-Mobile:
4G: 700(B17)/850(B5)/AWS1700(B4)/1900(B2)
3G: 850(B5)/1900(B2)
2G: 850/1900
3G: 850/900/AWS1700/1900/2100
2G: 850/900/1800/1900
Europe:
4G: 800(B20)/1800(B3)/2600(B7)
3G: 850(B5)/900(B8)/2100(B1)
2G: 900/1800
Verizon:
700(B13)/AWS1700(B4)
Processor & Memory
ARM9 processor with 32-bit ARM & 16-bit Thumb Instruction sets
• 400 MHz
• 16K Instruction Cache
• 256 MB Flash Memory
• 16K Data Cache
• 128X16M DDR RAM
Packet Data
Up to 100 Mbps downlink, Up to 50 Mbps uplink
Radio Frequency
FSK, GFSK, MSK, GMSK, OOK and LoRa – a proprietary Digital Spread Spectrum technique
Storage
Input Voltage
21 Mbps downlink, 5.76 Mbps uplink
Micro SD
9V to 32VDC
Connectors
Ethernet
1 RJ-45 Ethernet 10/100 port
USB
2 USB Ports: USB Host (Type-A), USB Device (Micro-B)
Serial
1 Debug Serial: USB Micro-B
Antenna
SIM
Female SMA, 2 dBi detachable antennas (Qty 2)
SIM/USIM
Physical Description
Dimensions (LxWxH)
6.35” x 4.23” x 1.69” (161.3 mm x 107.4 mm x 42.8 mm)
Weight
1.01 lbs (16.2 oz) with two H5 accessory cards installed
Chassis Type
Metal
Environmental
Operating Temperature
-30° to +70°C
Storage Temperature
-40° to +85°C
Humidity
20% to 90% Relative Humidity, non-condensing
Certifications
EMC Compliance
US: FCC Part 15 Class B, EU: EN55022 Class B, EN 55024, Canada: ICES-003
Radio Compliance
FCC Part 22, 24, 27
Safety
Network Approvals
Quality
UL 60950-1 2nd Ed., cUL 60950-1 2nd Ed., IEC 60950-1 2nd Ed.
PTCRB, GCF certified module, AT&T, T-Mobile, Verizon, Sprint. Pending: Rogers, Bell, Telus
MIL-STD-810G: High Temp, Low Temp, Random Vibration.
SAE J1455: Transit Drop & Handling Drop, Random Vibration, Swept-Since Vibration.
IEC68-2-1: Cold Temp. IEC68-2-2: Dry Heat
*See the datasheet and developer guide for additional information at http://fcs.futureelectronics.com/
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PART SELECTOR TABLE - MULTICONNECT® CONDUIT™
PART NUMBER
DESCRIPTION
MTCDT-H5-210L-US-EU-GB
HSPA+ mLinux Programmable Gateway w/US/EU/UK Accessory Kit
MTCDT-H5-210A-US-EU-GB
HSPA+ Application Enablement Gateway w/US/EU/UK Accessory Kit
MTCDT-210L-US-EU-GB
mLinux Programmable Gateway w/US/EU/UK Accessory Kit
MTCDT-210A-US-EU-GB
Application Enablement Gateway w/US/EU/UK Accessory Kit
PART SELECTOR TABLE - MULTICONNECT® MDOT™
PART NUMBER
DESCRIPTION
MTDOT-915-X1-SMA-50
915 MHz XBee LoRa SMA (50 Pk)
MTDOT-915-X1-SMA-1
915 MHz XBee LoRa SMA (1 Pk)
MTDOT-915-X1P-SMA-1
915 MHz XBee LoRa SMA w/Programming Header (1 Pk)
MTDOT-915-X1-UFL-50
915 MHz XBee LoRa UFL (50 Pk)
MTDOT-915-X1-UFL-1
915 MHz XBee LoRa UFL (1 Pk)
MTDOT-915-M1-UFL-100
915 MHz SMT LoRa UFL (100 Pk)
MTDOT-915-M1-UFL-1
915 MHz SMT LoRa UFL (1 Pk)
MTDOT-915-M1-TRC-100
915 MHz SMT LoRa RF Pad (100 Pk)
MTDOT-915-M1-TRC-1
915 MHz SMT LoRa RF Pad (1 Pk)
MTDOT-868-X1-SMA-50
868 MHz XBee LoRa SMA (50 Pk)
MTDOT-868-X1-SMA-1
868 MHz XBee LoRa SMA (1 Pk)
MTDOT-868-X1P-SMA-1
868 MHz XBee LoRa SMA w/Programming Header (1 Pk)
MTDOT-868-X1-UFL-50
868 MHz XBee LoRa UFL (50 Pk)
MTDOT-868-X1-UFL-1
868 MHz XBee LoRa UFL (1 Pk)
MTDOT-868-M1-UFL-1
868 MHz SMT LoRa UFL (1 Pk)
MTDOT-868-M1-UFL-100
868 MHz SMT LoRa UFL (100 Pk)
MTDOT-868-M1-TRC-100
868 MHz SMT LoRa RF Pad (100 Pk)
MTDOT-868-M1-TRC-1
868 MHz SMT LoRa RF Pad (1 Pk)
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PART SELECTOR TABLE - MULTICONNECT® MCARD™
PART NUMBER
DESCRIPTION
MTAC-GPIO
GPIO Accessory Card, GPIO Cable Sold Separately
MTAC-LORA-868
868 MHz LoRa Accessory Card, Antenna Sold Separately
MTAC-LORA-915
915 MHz LoRa Accessory Card, Antenna Sold Separately
MTAC-MFSER-DCE
Multi-Function Serial Accessory Card - DCE Interface
MTAC-MFSER-DTE
Multi-Function Serial Accessory Card - DTE Interface
PART SELECTOR TABLE - ANTENNAS AND CABLES
PART NUMBER
DESCRIPTION
AN868-915-1HRA
868-915 MHz RP-SMA Antenna, 8” (3.0 dBi) – global (1 Pk)
AN868-915-10HRA
868-915 MHz RP-SMA Antenna, 8” (3.0 dBi) – global (10 Pk)
AN868-915-50HRA
868-915 MHz RP-SMA Antenna, 8” (3.0 dBi) – global (50 Pk)
CARSMA-UFL-1
Reverse SMA-to-UFL Coax RF Cable, 6” – global (1 Pk)
CARSMA-UFL-10
Reverse SMA-to-UFL Coax RF Cable, 6” – global (10 Pk)
CARSMA-UFL-50
Reverse SMA-to-UFL Coax RF Cable, 6” – global (50 Pk)
CA-USB-A-MICRO-B-3
USB Cable Type A to Type B Micro (3 ft)
CA-MTAC-GPIO
GPIO Cable for MTAC-GPIO (2.5 ft)
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NXP SEMICONDUCTORS - NFC READERS AND
NTAG SOLUTIONS
NXP presents an impressive range of NFC products in its portfolio and
includes: NFC Frontend Solutions, NFC Controller Solutions and NTAG I2C.
NFC frontend solutions are reader IC’s that require the use of an external
microcontroller or host processor. They are the cost effective way to add
NFC to a system. They work flawlessly with the firmware in NXP’s NFC reader
libraries, and are the best choice when memory size, low power, and cost
optimization are a first priority.
Figure 1: NFC Controller Solution,
PN7120
NFC Controller solutions combine an NFC radio frontend with an advanced
32-bit microcontroller. The controller solution is made for compact systems.
NXP’s product portfolio include solutions with integrated firmware for an easy,
standardized interface, or a freely programmable microcontroller with the
ability to load entire, fully-custom applications.
NXP not only offers reader IC’s, but NFC tag IC’s as well. The NTAG family
provides both, a passive RF and I2C interface. The NTAG family complies with
the NFC Forum. Some tags have additional interfaces like field detection,
energy harvesting or I²C serial interface to connect to your embedded system.
NTAG I²C products are an excellent choice for applications that require
consumer interactive marketing and embedded electronics.
Figure 2: NFC Controller Board,
PN7120
FEATURES/SPECS
NFC Frontend Solutions:
• Multi-protocol support e.g. ISO/IEC
14443 A & B, ISO/IEC 15693, FeliCa,
ISO/NFC 18092, NFC-IP1 peer-topeer (Passive Initiator Mode)
• Data rates of up to 848 kbit/s
• Support of all smart card standards
as well as NFC devices and NFC tags
• Easy to design in through dedicated
development boards and SW
libraries
• Cost-effective solution, pay for the
features required in your design
• Software tools: NFC Reader Library
for easy creation of software stack
and application
NFC Controller Solutions:
• Broad product portfolio, from readers
with integrated and customizable
firmware
• Multi-protocol support e.g. ISO/IEC
14443 A & B, ISO/IEC 15693, FeliCa,
ISO/NFC 18092, NFC-IP1 peer-topeer (Passive Initiator Mode)
• Data rates of up to 848 kbit/s
• Support of all smart card standards as
well as NFC devices and NFC tags
• Easy to design in through dedicated
development boards and SW libraries
• Software tools: Downloadable Linux
drivers validated with Raspberry Pi
and Linux kernel
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NTAG I2C:
• RF interface NFC Forum Type 2 Tag
compliant
• Configurable field detection
• Energy harvesting functionality to
power external devices
• NDEF message storage between 888
bytes -1904 bytes
• Mapping of SRAM inside the user
memory buffer allows dynamic
update of NDEF message content
• Pass through mode allows fast
download and upload of data from
RF to I2C and vice versa without
limiting the EEPROM
• Data rates of up to 106 kbit/s
• Software tools: NTAG I2C support
with Android App, downloadable
source code, LPC microcontroller
firmware
13
Figure 3: NFC Frontend
solution, PN512
Figure 4: NFC Controller solution,
PN7120
Figure 5: NTAG I2C chip
APPLICATIONS
NFC Frontend and Controller
Solutions:
• Payments
• Access control
• Secure identification,
• Gaming
• Social interaction
• Advertising
NTAG I2C:
• Goods and device
authentication
• Smart manufacturing
• Advanced device pairing
• Connection handover
• Maintenance
• Gaming
• Home automation
• Consumer electronics
• Printers
• Smart meters
• Home appliances
Figure 6: Block diagram for NFC Frontend Solution; PN512
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Figure 7: Block Diagram for NFC Controller solution; PN7120
Figure 8: Block Diagram for NTAG I2C Solution
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PART SELECTOR TABLE
PART NUMBER
DESCRIPTION
DEVELOPMENT KIT
NFC FRONTENDS DELIVERING FULL NFC FORUM COMPLIANCE
PN512
Full NFC Forum-compliant frontend
PNEV512B, PNEV512R
HIGH PERFORMANCE NFC FRONTENDS
CLRC663
MFRC631
High-performance multi-protocol
NFC frontend
High-performance ISO/IEC 14443
A/B frontend
MFRC630
High-performance MIFARE frontend
SLRC610
High-performance ISO/IEC 15693
frontend
CLEV663, CLEV663B
STANDARD- PERFORMANCE NFC FRONTENDS
MFRC523
Standard 3 V ISO/IEC 14443 A/B
frontend
MFRC522
Standard 3 V MIFARE frontend
NFC CONTROLLER SOLUTIONS
PN7120
PR601
Full NFC Forum-compliant controller
w/ integrated FW and NCI interface
High-performance multi-protocol
NFC controller w/ customizable
Firmware
OM5577/PN7120S
PREV601M
NTAG SOLUTIONS
NTAG I2C 2k
NTAG I2C 1k
NTAG 216F
NTAG 213F
Passive NFC tag with I2C interface,
1904 bytes
Passive NFC tag with I2C interface,
888 bytes
Passive NFC tag with field-detection
output signal, 888 bytes
Passive NFC tag with field-detection
output signal, 144 bytes
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NTAG I2C Demo Kit
OM5569/NT312D
NTAG I2C Demo Kit
OM5569/NT312D
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Figure 9: NTAG I2C Demo Kit
Figure 10: NTAG I2C
Demo App, available on the
Google Playstore
NXP offers a simple development resource for NFC connected tag chips,
NTAG I²C Demo Kit. Designed to simulate an NTAG I2C tag chip in an
embedded electronics system, the kit allows users to demonstrate basic
principles of dual interface. The kit enables users to not only investigate the
capabilities of the NTAG I2C chip through the various demonstrations, but
also develop and test their own applications. The kit is centered on a LPC 812
microcontroller with a temperature sensor, I2C serial bus connector and JTAG
debug connector. Combined together, they demonstrate dual interface
communication (I2C/NFC), monitor energy harvesting and provide a localized
application development environment. The kit includes a main board, a class
5 antenna board and is supported by an Android app that is available on the
Google Playstore free of charge.
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GAINSPAN IOT SOLUTIONS OFFER FLEXIBILITY
TO WORK OPTIMALLY WITH ANY MCU OR
WITHOUT MCUS
GainSpan delivers the most complete, flexible and powerful connectivity
solutions for the IoT market. One of the keys to these capabilities is the
company’s suite of software running on its Wi-Fi Chip—embedded, Serialto-Wi-Fi (S2W) and IP-to-Wi-Fi (IP2W)—which gives customers the flexibility
to work optimally with any MCU or without MCUs. Whether your design is a
simple “hostless” smartplug or a Gateway or device with a complex display,
GainSpan provides a very quick path to development and market at every
MCU performance level.
Figure 1: GS2011MIZ-shield
802.11 b/g/n Shield Compatible
with Arduino form factor
APPLICATIONS
Hostless:
• Smartplug
• Sensor node
• Weight scale
Small Host:
• Doorbells
• Video surveillance cameras
• Appliances
Big Host:
• Thermostats
• Gateways
BENEFITS
• Quick and easy way to add
Wi-Fi connectivity to billions of
devices
• Flexible solutions optimized
to accommodate varying MCU
capabilities
• Quick path to development
and market
Today, GainSpan offers three development options—a hostless (no MCU)
solution and two hosted solutions. One hosted solution, which uses S2W, is
designed for projects with 8- or 16-bit MCUs or low-cost 32-bit platforms such
as the Renesas RL78 or RX family and equivalent from other MCU vendors.
The other hosted solution, using IP2W, is designed for high-end and Linux
platforms such as the RZ family from Renesas, but could also be used with the
higher end RX family of products.
For hostless solutions, the full networking stack and customer application
run on the GS2000. GainSpan embedded software provides all the building
blocks needed for low power IoT devices from sensors to battery-powered
video cameras. It allows customers to develop custom applications on the
GS2000 SoC, through a comprehensive yet simple set of APIs.
For S2W hosted solutions, the full networking stack and services including
HTTP(s)/Web server, XML parser and Bonjour, are running on the GS2000
and hence offloading the host microcontroller. All that is required are simple
AT commands – for configuration and data communications as well as for
scanning and reporting SSID’s, power management and over the air firmware
upgrade.
For IP2W hosted solutions, the networking stack (e.g., the Micrium stack or
the native Linux networking stack) runs on the host processor.
GainSpan’s software provides a quick and easy way to add Wi-Fi capability to
billions of devices, turning them into connected devices.
FEATURES
Multiple modes of operation:
• Station
• Limited AP
• Wi-Fi Direct
• Limited AP Concurrent Mode
• Wi-Fi Direct Concurrent Mode
Easy provisioning modes:
• AP Mode
• Secure Group Provisioning
• iOS7 Provisioning
• Concurrent Provisioning
Cloud connectivity
Drivers/tools available for multiple
MCUs
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GAINSPAN EVALUATION BOARDS TO INTERFACE WITH DIFFERENT MCU DEVELOPMENT KITS
PART NUMBER
DESCRIPTION
GS2100MIP-EVB3-S2W
Evaluation Board with an 802.11 b/g/n GS2100MIP Wi-Fi module
GS2011MIES-EVB3-S2W
Evaluation Board with an 802.11 b/g/n GS2011MIES Wi-Fi module
WAB-GW-GS2011MIZ
802.11b/g/n Wi-Fi Adapter Board with PMOD connector and
Application Header Interface to interface to MCU using UART or SPI
SD-GW-GS2100MIP
SD Card providing 802.11b/g/n Wi-Fi connectivity through SDIO
GS2100MIP-Shield
GS2011MIZ-Shield
802.11 b/g/n Wi-Fi shield compatible with Arduino form factor, with
GS2100MIP module. UART AND SPI interfaces.
802.11 b/g/n Wi-Fi shield compatible with Arduino form factor with
GS2011MIZ module. UART AND SPI interfaces.
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SX-PCEGN-BT:
LOW-COST MINI-PCIe COMBO WI-FI MODULE FEATURES
COMPATIBILITY WITH FREESCALE’S I.MX6 PLATFORM
SX-PCEGN-BT, is an 802.11 b/g/n Wi-Fi plus Bluetooth combo PCIe solution
based on Qualcomm Atheros’s proven technology. It features the AR9485
chipset for Wi-Fi and AR3012 for Bluetooth 4.0. The SX-PCEGN-BT, like
other Silex PCIe offerings, is a viable wireless connectivity option for various
platforms including the Freescale i.MX6.
Figure 1: SX-PCEGN-BT
The SX-PCEGN-BT is Silex’s entry-level PCIe solution that offers Bluetooth
for users looking to add a Bluetooth connectivity option to their device using
a PCIe radio. Its low cost and Freescale compatibility combined with Silex’s
unmatched local support make it an ideal solution for customers who want to
integrate high-performance Wi-Fi into their device.
Figure 2: Performance vs. Cost Chart
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Figure 3: SX-PCEGN-BT Major Component and System Interface
APPLICATIONS
SPECIFICATIONS
The SX-PCEGN-BT is designed
to meet the demanding
performance requirements of
critical embedded applications.
Applications include:
Product Name
SX-PCEGN-BT
Radio Chipset
Atheros® AR9485 (Wi-Fi)
Atheros® AR3012 (Bluetooth)
Radio Specifications
802.11 b/g/n + BT4.0
•
•
•
•
•
•
Security
64-bit, 128-bit, 152-bit WEP Encryption
802.1x Authentication
AES-CCM & TKIP Encryption
Operation mode
Infrastructure & Ad-hoc mode
Wireless Interface
PCIe
Operating Voltage
3.3 V
Operating Temperature
-10 to 60 °C Ambient
Current Consumption
Average Tx: 295mA
Max Tx: 410mA
Dimensions
26.65 x 29.85 x 3.37 mm
Medical devices
Security Systems
Industrial
Digital Signs
Set-Top/ Net-Top Box
Embedded Industrial
applications
• Tablet PC
• Handheld devices
• Thin Client devices and many
more.
802.11b: 1, 2, 5.5, 11Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps
Transfer data rate
802.11n:
20MHz - 72.2 Mbps
40MHz -150 Mbps
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BENEFITS
FEATURES
• Low Cost
• 802.11n 1x1
• Wi-Fi + Bluetooth Combo
Module
• Works and tested with the
Freescale i.MX6 platform.
• Works well with the open source
driver
• Modular certifications for FCC
and Telec
• Supports up to 150 Mbps data rate
• Compliant with IEEE802.11 b/g/n standards
• Compliant with IEEE 802.11b, 802.11d, 802.11e and 802.11g standards
and the 802.11i specification
• Includes signal-sustain technology (SST) rate-over-range
enhancements such as low-density parity check (LDPC) and maximum
likelihood demodulation (MLD)
• Supports all mandatory IEEE 802.11n features as well as several
optional features such as HT40, half-guard interval in HT40 and Rx
space-time block coding (STBC)
• Supports low-power sleep modes and wake-on-wireless (WoW) LAN
• Features the Atheros AR3012 Bluetooth 4.0 + HS chipset and
Bluetooth Class 1 Radio
• USB 2.0 device interface supports standard HCI USB
• RoHS compliant
PART SELECTOR TABLE
PART NUMBER
SX-PCEGN-BT
SX-PCEGN-BT-SP
DESCRIPTION
The SX-PCEGN-BT is based on Qualcomm Atheros AR9485 and AR3012
radio chip. It is a wireless PCIe 802.11bgn 1x1 plus Bluetooth 4.0 solution.
The SX-PCEGN-BT is based on Qualcomm Atheros AR9485 and AR3012
radio chip. It is a 802.11bgn 1x1 plus Bluetooth 4.0 solution. Sample Pack. No
Antennas included.
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STMICROELECTRONICS SPWF01SX WI-FI
MODULES FOR IOT APPLICATIONS
The SPWF01SA and the SPWF01SC intelligent Wi-Fi modules represent a
plug and play and standalone 802.11 b/g/n solution for easy integration of
wireless Internet connectivity features into existing or new products.
Configured around a single-chip 802.11 transceiver with integrated PA and
an STM32 microcontroller with an extensive GPIO suite, the modules also
incorporate timing clocks and voltage regulators. Two different options exist
based on the integrated Flash memory.
The SPWF01Sx.1y orderable parts integrate 1.5 MB of Flash, while The
SPWF01Sx.2y orderable parts integrate 512 kB of Flash.
The module is available either configured with an embedded micro 2.45 GHz
ISM band antenna (SPWF01SA), or with a U.FL connector for external antenna
connection (SPWF01SC).
With low power consumption and small form factor, the modules are ideal
for fixed and mobile wireless applications, as well as challenging batteryoperated applications.
Figure 1: SPWF01SA & SPWF01SC
The SPWF01Sx.y1 orderable parts are released with an integrated full featured
TCP/IP protocol stack with added web server and additional application
service capabilities. The SW package also includes an AT command layer
interface for user-friendly access to the stack functionalities via the UART serial
port.
APPLICATIONS
• Smart appliances
• Industrial control and data
acquisition
• Home automation and security
systems
• Wireless sensors
• Cable replacement
• Medical equipment
• Machine-to-machine
communication
Figure 2: Block Diagram
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BENEFITS
KEY FACTORS
KEY BENEFITS
Mass Market Positioning
An affordable solution for all volumes
802.11 b/g/n integrated radio
Easy integration in WLAN systems
Full integrated device
Reduces Development Times for Time To Market
Integrated antenna or u.fl connector
No RF knowledge is required for integration
CE, FCC, IC RF certified
Reduces Certification costs of the target application
No need of a driver or external protocol stack
Extended usability with any host processor
Micro-sized form factor
SMD-like component to fit miniaturized devices
Integrated TCP/IP and Application Layer Functions
Allows an easy integration at the application level
Industrial Temperature Range
Allows integration in many different industrial
applications
FEATURES/SPECS
• 2.4 GHz IEEE 802.11 b/g/n transceiver
• STM32 ARM Cortex-M3, with 64 KB RAM and
• 512KB Flash memory
• 1MByte Extended Flash for FW update
• Firmware “Over The Air” Update (only on
SPWF01Sx.1y)
• Integrated TCP/IP protocol stack
• 8 Simultaneous TCP or UDP clients and 1 Socket
server
• 1 TLS/SSL Socket client supporting up to TLS 1.2,
including common encryption algorithms: AES
(128,256), hash (MD5, SHA-1, SHA-256) and public
key algorithms (RSA, ECC).
• Web Server supporting dynamic web pages
• RESTful API’s to get & post cloud content
• WEP/WPA/WPA2 Personal Security
• System Modes: Station, IBSS, and miniAP
• miniAP easily provisioned (SSID, PWD)
• Fast Wi-Fi reconnect after reset
• TX Power
• 18.3 dBm @ 1 Mbps DSSS
• 13.7 dBm @ 5 4Mbps OFDM
• RX Sensitivity
• -96.0 dBm @ 1 Mbps DSSS
• -74.5 dBm @ 54 Mbps OFDM
• 16 configurable GPIOs available
• UART interface to host system
• Advanced low-power modes
• Stand-by with RTC: 43 μA
• Sleep connected (DTIM=1): 15 mA
• RX Traffic: 105 mA Typical
• TX Traffic: 243 mA Typical @ 10 dBm
• Simple AT command set host interface through UART
• Small form factor: 26.92 x 15.24 x 2.35 mm
• Single voltage supply (3.3 V typical)
• Multiple antenna options:
• Integrated antenna (SPWF01SA.xy versions)
• Integrated U.FL connector (SPWF01SC.xy
versions)
• Industrial temperature range: -40 °C to 85 °C
• FCC/CE/IC certified
• RoHS compliant
• Surface mount PCB module
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Figure 3: Block Diagram
PART SELECTOR TABLE
PART NUMBER
DESCRIPTION
PRODUCTION STATUS
SPWF01SA.11
Extended Flash, Integrated Antenna, AT Full Stack
Full Production
SPWF01SC.11
Extended Flash, Integrated U.Fl. connector, AT Full
Stack
Full Production
SPWF01SA.21
Integrated Antenna, AT Full Stack
Full Production
SPWF01SC.21
Integrated U.Fl. connector, AT Full Stack
Full Production
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Figure 4: STEVAL-PCC018V1
STEVAL-PCC018V1 + STEVAL-IDW001V1
• Used as a dongle via the USB connector
• Requires to install the USB Driver
• A
llows the use of Teratem or equivalent application to use the AT
commands
STEVAL-IDW001V1 + STM32F0DISCOVERY
• Do not require any driver on the STM32
• Application Examples included in the kit
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