10GBASE-LR SFP+ Optical Transceiver

LCP-10G3B4QDR

Preliminary

FEATURES

RoHS compliant

Compliant to SFP+ Electrical MSA SFF-8431

Compliant with SFF-8472 MSA

Standard LC duplex fiber-optic connector

I 2

C for integrated Digital Optical Monitoring

Power consumption ＜1W

Description Applications

The LCP-10G3B4QDR is a hot pluggable

10Gbps small form factor plus transceiver module integrated with the high performance

1310nm DFB Laser transmitter, high sensitivity linear PD-TIA receiver for 10Gbps applications.

It is compliant with the SFF-8431 SFP+

Electrical Multi-source Agreement (MSA) with five digital monitoring functions: Temperature,

Vcc, Tx optical power, Tx laser bias current and

Rx received optical power.

10G LAN switch

10G Ethernet switch/router

10G Fiber channel

SAN applications

Performance

LCP-10G3B4QDR: Link distance up to 10km over 9um SMF

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LCP-10G3B4QDR

Absolute Maximum Ratings

Parameter

Storage Temperature

Supply Voltage Range @3.3V

Symbol Min.

T

S

Typ. Max. Unit

-40 85 ºC

V

CC3

-0.5 3.6 V

Recommended Operating Conditions

Parameter

Case Operating Temperature

Supply Voltage @3.3V

Relative Humidity (non condensation)

DC Common Mode Voltage

Symbol Min.

T

C

V

CC3

-

3.135

5

Typ. Max. Unit

-5 +70 ºC

3.30 3.465

85

V

%

V

CM

0 3.6 V

Low Speed Electrical Characteristics

(V

CC

=3.135V to 3.465V)

Parameter

Total Supply Current

Power Consumption

TX_Fault, RX_LOS

TX_Disable

RS0, RS1

Symbol

I

CC

PC

V

OL

V

OH

V

IL

V

IH

V

IL

V

IH

Min.

Host_Vcc-0.5

1. Shall be pulled up with 4.7k-10k ohms to 3.3 volt in the module.

Typ. Max. Unit

Host_Vcc+0.3

-0.3

-0.3

Note

0.8 V

0.8 V

2. Shall be pulled low to GND with a ＞30k ohms resistor in the module.

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Optical Transmitter Characteristics (T

C

= -5

℃

to 70

℃

LCP-10G3B4QDR

Parameter Symbol Min Typ Max Units Notes

Signaling speed (nominal)

Signaling speed variation from nominal

Center Wavelength

Side Mode Suppression

Ratio

R

λ

10.3125

SMSR 30

± 100

Gb/s ppm

dB

Optical Modulaion

Amplitude

Average output power

OMA -5.2

AP

Extinction Ratio

Transmitter eye mask definition

{X1, X2, X3, Y1, Y2, Y3}

ER

-8.2

3.5

{0.25, 0.40, 0.45, 0.25, 0.28, 0.40}

dBm

+0.5 dBm dB

Notes:

1. Even if the TDP < 1 dB, the OMA (min) must exceed this value.

Transmitter eye mask definition

4. Optical Receive Characteristics

(T

C

=0 ºC to 70 ºC)

Parameter Symbol Min Typ Max Units Notes

Signaling speed (nominal)

Signaling speed variation from nominal

Center Wavelength

Ts 10.3125

± 100

Gb/s ppm

λ

Overload P

O

Receiver sensitivity in OMA RSO

Stressed Receiver sensitivity in OMA

SRS

-12.6 dBm

-10.3

[1]

[1]

LOS De-assert

LOS Assert

LOS

D

LOS

A

-30 dBm

Notes:

1. Measured with 2^31-1 PRBS for BER = 10

-12

. Per IEEE802.3ae

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SFP+ Transceiver Electrical Pad Layout

LCP-10G3B4QDR

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LCP-10G3B4QDR

Module Electrical Pin Definition

Pin Logic Symbol Name/Description Note

1

2 LVTTL-O

3 LVTTL-I

4 LVTTL-I/O

VeeT

TX_Fault

Module Transmitter Ground

Module Transmitter Fault

TX_Disable Transmitter Disable; Turns off transmitter laser output

SDA 2- write Serial Interface Data Line

5 LVTTL-I/O SCL 2- write Serial Interface Clock

6 MOD_ABS Module Absent, connected to V ee

T or V ee

R in the module

7 LVTTL-I RS0 Not

8 LVTTL-O RX_LOS Receiver Loss of Signal Indication

13

14

15

16

9 LVTTL-I RS1 Not

10

11

12 CML-O

VeeR

VeeR

RD-

Module Receiver Ground

Module Receiver Ground

Receiver Inverted Data Output

CML-O RD+

VeeR

VccR

VccT

Receiver Non-Inverter Data Output

Module Receiver Ground

Module Receiver 3.3V Supply

Module Transmitter 3.3V Supply

17

18

19

20

CML-I

CML-I

VeeT

TD+

TD-

VeeT

Module Transmitter Ground

Transmitter Non-Inverted Data Input

Transmitter Inverted Data Input

Module Transmitter Griund

Note:

1. The module signal ground pins, VeeR and VeeT, shall be isolated from the module case.

2. This pin is an open collector/drain output pin and shall be pulled up with 4.7k-10k ohms to Host_Vcc on the host board. Pull ups can be connected to multiple power supplies, however the host board design shall ensure that no module pin has voltage exceeding module VccT/R + 0.5V.

3. This pin is an open collector/drain input pin and shall be pulled up with 4.7k-10k ohms to VccT in the

Module.

4. This pin shall be pulled up with 4.7k-10k ohms to Host_Vcc on the host board.

1

1

1

1

1

3

1

2

4

2

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Low speed electrical control pins and 2-wire interface

LCP-10G3B4QDR

In addition to the 2-wire serial interface, the SFP+ module has the following low speed pins for control and status:

‧ TX_Fault

‧ TX_Disable

‧ RS0/RS1

‧ MOD_ABS

‧ RX_LOS

1 TX_Fault

.TX_Fault is a module output pin that when High, indicates that the module transmitter has detected a fault condition related to laser operation or safety.

The TX_Fault output pin is an open drain/collector and must be pulled p to the Host_Vcc with 4.7k-10k ohms on the host board

2 TX_Disable

TX_Disable is a module input pin. When TX_Disable is asserted High or Left open, the SFP+ module transmitter output must be turned off. The TX_DIS pin must be pulled up to VccT in the SFP+ module..

3 RS0/RS1

RS0 and RS1 are module input rate select pins and are pulled low to VeeT with a > 30kΩ resistor in the module. RS0 is an input hardware pin which optionally selects the optical receive data path rate coverage for an SFP+ module. RS1 is an input hardware pin which optionally selects the optical transmit path data rate coverage for an SFP+ module.

4 MOD_ABS

Mod_ABS is pulled up to Host_Vcc with 4.7k-10k ohms on the host board and connected to VeeT or VeeR in the SFP+ module. MOD_ABS is then asserted “High” when the SFP+ module is physically absent from a host slot. In the SFP MSA (INF8074i) this pin had the same function but is called MOD_DEF0.

5 SCL/SDA

SCL is the 2-wire interface clock and SDA is the 2-wire interface data line. SCL and SDA are pulled up to a voltage in the range of 3.14V to 3.46V on the host.

6 RX_LOS

RX_LOS when High indicated an optical signal level below that specified in the relevant standard. The

RX_LOS pin is an open drain/collector output and must be pulled up to host Vcc with a 4.7k-10k ohms on the host board.

RX_LOS assert min and de-assert max are defined in the relevant standard. To avoid spurious transition of RX_LOS a minimum hysteresis of 0.5 dB is recommended.

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Recommend Circuit Schematic

LCP-10G3B4QDR

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Package Outline Drawing for Metal Housing with Bail de-latch

LCP-10G3B4QDR

Latch Color Identifier

Blue

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Timing parameters for SFP+ management

LCP-10G3B4QDR

Parameter

TX_DISABLE Assert time

TX_DISABLE Negate time

Symbol t_off t_on

Min. Max.

10

2

Unit Note

µsec 1 msec 2

Time to initialize 2-wire interfase t_2w_start_up 300 msec 3

Time to initialize t_start_up 300 msec 4 module

Time to Power Up to Level 2 t_power_level2

Time to Power Down from

Level 2

T_power_down

300 msec 5

TX_Fault assert

TX_Fault assert for cooled module

TX_Fault Reset

Module Reset

RS0, RS1 rate select timing for FC

RS0, RS1 rate select timing non FC

TX_Fault_on

TX_Fault_on t_reset t_module_reset t_RS0_FC,

RS1_FC t_RS0, t_RS1

10

1

50 msec 7

TBD

500

10 msec

µsec msec

µsec msec

7

8

TBD

9

9

RX_LOS assert delay

RX_LOS negate delay t_los_on t_los_off

100

100

µsec 10

µsec 11

Notes:

1)

2)

Rising edge of TX_Disable to fall of output signal below 10% of nominal.

Falling edge of TX_Disable to rise of output signal above 90% of nominal. This only applies in normal

3)

4) operation, not during start up or fault recovery.

From power on or negation of TX_Disable.

From power on or TX_Disable negated during power up, or TX_Fault recovery, until non-cooled power level 1 part (or non-cooled power level 2 part already enabled at power level 2 for TX_Fault recovery) is fully operational.

5) From falling edge of stop bit enabling power level 2 until non-cooled module is fully operational.

6) From falling edge of stop bit disabling power level 2 until module is within power level 1 requirements.

7) From Occurrence of fault to assertion of TX_Fault.

8) Time TX_Disable must be held High to reset TX_Fault.

10) From Occurrence of loss of signal to assertion of LOS

11) From Occurrence of presence of signal to negation of RX_LOS.

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LCP-10G3B4QDR

Enhanced Digital Diagnostic Interface

The memory map in the following describes an extension to the memory map defined in SFP MSA. The enhanced interface uses the two wire serial bus address 1010001X(A2h) to provide diagnostic information about the module’s present operating conditions.

2 wire address 1010000 X (A0h) 2 wire address 1010001 X (A2h)

0 0

Alarm and Warning Thresholds

(56 bytes)

Serial ID Defined by SFP MSA

(96 bytes)

55

95

56

95

96 96

Cal Constants

(40 bytes)

Real Time Diagnostic Interface

(24 bytes)

Vender Specific

(32 bytes)

119

120

127 127

Vender Specific

128 128

User Writable EEPROM

(120 bytes)

Reserved in SFP MSA

(128 bytes)

247

248

255 255

Vender Specific

(8 bytes)

Digital Diagnostic Memory Map Specific Data Field Descriptions

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EEPROM Serial ID Memory Contents (2-Wire Address A0h)

LCP-10G3B4QDR

Address Hex ASCII Address Hex ASCII Address Hex ASCII

00 03 43 2D - 86 DC

01 04 44 31 1

02 07 45 30 0 88 DC

03

04

05

06

20 10G Base-LR

00

00

00

46

47

48

49

47

33

42

34

G

3

B

4

89

90

91

92

DC

DC

DC

68

07 00 50 51 Q 93 F0

08 00 51 44 D 94 03

09 00 52 52 R 95 CS2 4

10 00 53 20 96 00

11 03 54 20 97 00

12 67 55 20 98 00

13

14

15

16

17

00

0A

64

00

00

10km

10km

56

57

58

41

20

20

20

99

100

101

00

00

00

102 00

18 00 61 1E

19 00

20

21

22

23

44

45

4C

54

D

E

L

T

63

64

65

66

CS1

01

1A

00

Note 1 106

107

108

109

00

00

00

00

00

25 20 68 SN

26 20 69 SN 112 00

27 20 70 SN 113 00

28

29

30

31

20

20

20

20

71

72

73

74

SN

SN

SN

SN

114

115

116

117

00

00

00

00

32 20 75 SN 118 00

33 20 76 SN 119 00

34 20 77 SN 120 00

35 20 78 SN 121 00

36 00 79 SN 122 00

37

38

00

00

80

81

SN

SN

123

124

00

00

39 00 82 SN 125 00

40 4C L 83 SN 126 00

Note

42 50 P 85 DC 128 00

Notes:

1) Byte 63: Check sum of bytes 0-62.

2) Byte 68-83: Serial number.

3) Byte 84-91: Date code.

4) Byte 95: Check sum of bytes 64-94.

5) Byte 128 to 255 had been set hex 00.

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Digital Diagnostic Monitoring Interface

Alarm and Warning Thresholds (2-Wire Address A2h)

LCP-10G3B4QDR

Address

#

Bytes

Name Value (Dec.) Unit Note

04-05

06-07

08-09

10-11

12-13

14-15

20-21

22-23

24-25

26-27

28-29

30-31

32-33

34-35

36-37

38-39

40-45

56-91

92-94

95

96-97

98-99

100-101

102-103

104-105

106-109

110

111

112-119

Notes:

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

2

Temp High Warning

Temp Low Warning

Voltage High Alarm

Voltage Low Alarm

Voltage High Warning

Voltage Low Warning

16 Reversed

36 External Calibration Constants

3

1

2

2

2

2

2

4

1

1

8

Bias High Warning

Bias Low Warning

TX Power High Alarm

TX Power Low Alarm

TX Power High Warning

TX Power Low Warning

RX Power High Alarm

RX Power Low Alarm

RX Power High Warning

RX Power Low Warning

Reversed

Checksum

Real Time Temperature

Real Time Supply Voltage

Real Time Tx Bias Current

Real Time Tx Optical Power

Real Time Rx Received Power

Reserved

Optional Status/ Control Bits

Reserved

Optional Set of Alarm and Warning

T

C

(MAX.)+8

T

C

T

C

T

C

(MIN.)-8

(MAX.)+3

(MIN.)-3

3.8

2.8

3.5

3.1

I

I

OP

*2+35

I

OP

-13

OP

*2+30

–8 I

OP

P h

P l

P h

+2

-2

+1

-1 P l

P

0

P

S

P

0

P

S

+2

-2

+1

-1

1) T

C

: Case Operating temperature

2) I

OP

: Operating current at room temperature. The min. setting current is 0 mA.

3) P h

: Maximum value of transmitter optical power

P l

: Minimum value of transmitter optical power

4) P

0

P

S

: Overload optical power of receiver

: Sensitivity optical power of receiver

5) Byte 95 contains the low order 8bits of sum of bytes 0~94

℃ 1

Volt mA 2 dBm 3 dBm 4

5

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6)

State/ Control Bits

Byte

110

110

Bit

7

6

Name

Tx Disable State

Soft Tx Disable

110

110

110

4

3

2

Rate Select State

Soft Rate Select

Tx Fault

110 0 Data_Ready_Bar

7)

Optional Set of Alarm and Warning

Byte

113

113

113

116

116

116

116

116

112

112

112

112

112

112

112

112

116

116

116

117

117

117

Bit

6

5

4

3

7

6

5-0

7

3

2

1

0

7

6

5

4

2

1

0

7

6

5-0

Name

Temp High Alarm

Temp Low Alarm

Vcc High Alarm

Vcc Low Alarm

Tx Bias High Alarm

Tx Bias Low Alarm

Tx Power High Alarm

Tx Power Low Alarm

Rx Power High Alarm

Rx Power Low Alarm

Reserved

Temp High Warning

Temp Low Warning

Vcc High Warning

Vcc Low Warning

Tx Bias High Warning

Tx Bias Low Warning

Tx Power High Warning

Tx Power Low Warning

Rx Power High Warning

Rx Power Low Warning

Reserved

LCP-10G3B4QDR

Description

Digital state of the Tx disable input pin

Read/ Write bit that allow software disable of laser

Rate Select State

Software Rate Select State

Digital state of the Tx fault output pin

NA

Description

Set when internal temperature exceeds high alarm level

Set when internal temperature is below low alarm level

Set when internal supply voltage exceeds high alarm level

Set when internal supply voltage is below low alarm level

Set when Tx Bias current exceeds high alarm level

Set when Tx Bias current is below low alarm level

Set when Tx output power exceeds high alarm level

Set when Tx output power is below low alarm level

Set when received power exceeds high alarm level

Set when received power is below low alarm level

Set when internal temperature exceeds high warning level

Set when internal temperature is below low warning level

Set when internal supply voltage exceeds high warning level

Set when internal supply voltage is below low warning level

Set when Tx Bias current exceeds high warning level

Set when Tx Bias current is below low warning level

Set when Tx output power exceeds high warning level

Set when Tx output power is below low warning level

Set when received power exceeds high warning level

Set when received power is below low warning level

Digital Diagnostic Monitor Accuracy

Parameter Typical Value Note

Transceiver Temperature

Power Supply Voltage

TX Bias Current

TX Optical Power

RX Optical Power

Notes:

1) Temperature is measured internal to the transceiver

± 3℃ 1

± 3% 2

± 10%

± 1.5dB

± 3dB

2) Voltage is measured internal to the transceiver

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Regulatory Compliance

LCP-10G3B4QDR

Feature Test Method Reference

Electromagnetic

Interference (EMI)

FCC Part15 Class B

EN 55022 Class B

(CISPR 22A)

Radio Frequency

Electromagnetic Field

Immunity

Electrostatic Discharge

(ESD) to the Duplex LC

Receptacle

Electrostatic Discharge

(ESD) to the Electrical

Pins

Laser Eye Safety

Component

Recognition

Contact Discharge

Air Discharge

Human Body Model

(HBM)

IEC/EN 61000-4-3

IEC/EN 61000-4-2

IEC/EN 61000-4-2

MIL-STD-883E Method 3015.7

EIA-JESD22-A114

Machine Model (MM) EIA-JESD22-A115

FDA/CDRH

TUV

US FDA CDRH AEL Class 1

IEC/EN 60825-1

IEC/EN 60825-2

TUV

UL/CSA

IEC/EN 60950-1

UL60950

Performance

(1) Satisfied with electrical characteristics of product spec.

(2) No physical damage

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