null  null
» 2014/2015 Embedded Boards «
» Computer-on-Module
» Pico-ITX 2.5"
» Mini-ITX to Flex-ATX
The pulse of innovation
» Table of Contents «
Why buy an Embedded Board? ______________________ 03
Fast, complete solutions with... _____________________ 09
Lowest total cost of Ownership ______________________ 03
Motherboard _____________________________________ 10
Complete lifecycle management ______________________ 03
KTQ87/mITX ______________________________________ 11
The Longevity Factor ______________________________ 04
Embedded Mini-ITX Motherboards ____________________ 12
Embedded Motherboards Compatibility ________________ 04
Technology Highlights ______________________________ 12
Your value add beyond Hardware _____________________ 05
Hardware-based remote Diagnosis and Repair ___________ 13
Kontron‘s innovation cycle _________________________ 06
Accessories ______________________________________ 14
Computer-on-Modules _____________________________ 07
New Long-Life Cooler ______________________________ 14
Proven designs for extended temperatures _____________ 08
Evaluation Break-out Boards ________________________ 14
Rapid Shut Down (RXT Modules) _____________________ 08
PicoITX _________________________________________ 15
The Thermal Concept _______________________________ 08
Standard cooling concept ___________________________ 16
Software & Services _______________________________ 08
Technical Informations ____________________________ 17
2
Embedded Boards
» Why buy an Embedded Board? «
Lowest total cost of Ownership (TCO) with Embedded Boards
At first glance, buying an industrial board may seem to be
more expensive than a board designed for the consumer market. However, there are several factors that could contribute
to cost savings of more than 50% over the lifetime of product including:
» Strong product life management and revision control
from design to EOL
» 7-years life and beyond, giving optimal time for return
of initial design-in investment
» Fast time to market by using complete set of tools,
services and software (BSP´s)
» Logistics and service made easy with long life products
and product life management
» Free technical support (Hotline)
» Highly reduced replacement costs
» Stable and reliable products with high MTBF* and low field
failure rate due to high quality industrial grade components
» Reduced test and approval efforts
€
Sales Volume
Complete lifecycle management for all Embedded Boards
EFT
PMI
Decline
Maturity
Growth
Introduction
Development
EOL
PCN
PMI
PIB
Time
Safety for your
investment decisions!
» PIB = Product Introduction Bulletin
» EFT = Early Field Test
» PMI = Product Marketing Information
» PCN = Product Change Notification
» EOL = The End of Life Notification
www.kontron.com
Embedded Motherboards
The Longevity Factor
Kontron Embedded Board
» Availability up to 7 years and
more after release
» 7-years lifetime and beyond,
giving optimal time for return
of initial design-in investment
Consumer
IT / PC
» Availability 6 -18 Months
» Availability 6 -18 Months
Embedded Motherboards Compatibility
Kontron's entire range of motherboards offers full mechanical compatibility from Mini-ITX to full size ATX.
Pico-ITX
Mini-ITX
FLEX-ATX
ATX
Same Dimension (width)
for rear-i/O
re
from Mini-ITX
up to full ATX Size
ETH1
USB5
USB4
4
ETH2
ETH3
USB1
USB0
DP0
USB3
USB2
DP1
DVI-I
Audio
Embedded Motherboards
Your value add beyond Hardware
» Up to seven years lifecycle and long term service and support
» Extensive validation, verification and testing
» Extended technical support and documentation
» Flat panel display support expertise including LVDS, DVI,
CRT, HDMI and ADD2/PCIe Cards
» Remote hardware and hard disk monitoring/control
by original API software
» Quick time-to-market with standard form factors
» Advanced technologies such as solid capacitors and
up to 12 multilayer PCBs
» Boards are tested and approved to UL 60950 – Information
Technology Equipment (ITE) for easy validation efforts on
behalf of customers and system integrators when system-level
products must go through UL / CE safety testing
» All Motherboards are designed and tested for Industrial
Operating Temperature Range 0°C to 60°C
» All Motherboards are tested for their shock resistance,
to be prepared for rugged environments
Learn more about Kontron Motherboards at:
www.kontron.com/technologies/motherboards/collateral
The use of Solid CAPs offers the following advantages:
» Long-life cycle – enhanced MTBF
» Liquid free – no drying out
» Improved resistance against higher ambient temperature
» Optimized electric strength
Up to 12 Multilayer PCBs support more
features on smaller form factors with the
highest signal quality
Extended Documentation and Drivers –
ready for download via Website
Up to 12x
extended li
fetime
The availability of 3D-Drawings at early
introduction for all available boards
allows an instant start of housing design
www.kontron.com
Kontron's innovation cycle
» Kontron‘s innovation cycle «
One technology, three form factors
» Latest technology with actual high speed interfaces
» 100 % band width from Intel® Atom™ to Quad Core
» 100 % COMsistent, over 16 years COM experience
COM Express®
mini
84 x 55
COM Express®
compact
COM Express®
basic
95 x 95
125 x 95
2013
2012
1998
DIMM-PC®
2008
2000
ETX®
2002
X-board®
2006
2004
Ratification of
COM Express®
mini by PICMG®
COM Express®
®
mini
COM Express®
compact
COM Express®
basic
Extended
COM Express®
pin-outs
COM Express®
goes mobile – the
mini form factor
A dimension
smaller – the
compact form factor
Green light for
COM Express® – the
basic form factor
6
2010
Ratification of
SMARC Standard
by SGeT e.V.
SMARC
Computer-on-Modules
» Computer-on-Modules «
Computer-on-Modules (COM) are highly integrated computer modules that support system expansion and applicationspecific customization without the use of cables. When using
a Computer-on-Module, customers don't need to worry about
the complex design of the COM, instead freeing them to concentrate on their core business. To tailor this modular solution
to the application's specific needs, Kontron designs the carrier
board that includes all necessary interfaces for the individual application. Kontron COMs are based on industry standards
like SMARC®, ETX® and COM Express®. As such, Kontron COMs are
simply plugged into the carrier board like a component.
Advantages of COMs at a Glance:
» Scalability in size and performance
» Short time-to-market
» Simplified development
» Flexibility and interoperability
» Reuse of knowledge
» Longevity of standards and products
» Multi-vendor support
www.kontron.com
Computer-on-Modules
Proven designs for extended temperatures
Rapid Shut Down (RXT Modules)
Mission-critical applications in the military, aerospace,
transportation, energy and industrial automation markets offer
the biggest challenges for extended temperature designs. To
achieve functionality in extended temperature ranges, customers
have two recommended ways to ensure that COM solutions
perform within extended temperature environments – by design
(solutions built with all industrial grade components) and by 100
percent extended temperature testing of the solution.
The Kontron x86, ARM and Power Architecture® technology
COMs in particular SMARC-sXBTi, COMe-cBTiR6 SMARC-sAMX6i,
SMARC-sA3874i and COMe-P2020 offers a "by design" modular
solution fully approved for use under E2 industrial temperature
range (-40°C to +85°C) conditions. Kontron also offers other
high-performance COMs re-engineered to be reliable under such
extreme temperature conditions.
The Rapid Shut Down function is required by security critical
application in defense and transportation application. Kontron
enable the system to shut down by an active-high shutdown
signal on the COM Express® connector. This technology causes
all power regulators to be disabled and the internal power supply
rails to be discharged by crowbar circuits to 37% of initial
voltage value within 250µS whenelse commercial systems need
usually 300 miliseconds for their shut down. All Kontron RXT COM
are certified up to industrial temperature environment.
The Thermal Concept
COM Express® Heatspreader provides:
» Identical mechanical size – all COM Express® modules
fit in the same system
» The only surface that needs cooling is the top of the
heatspreader
» Additional active and passive Heatsinks are available
Software & Services
BIOS/Bootloader
» Configuration Services
» Customer specific bootloader
development and variant handling
Support & Services
» Getting Started Support
» ARM Baseboard & Software Training
» Enhanced Software Support
8
OS/Licenses
» Evaluation Images
» Support for Getting Started
» Image Building
» Microsoft Embedded Licenses
Board Support Package
» Windows Embedded Standard/Compact
» Linux and Yocto
» Android and VxWorks on request
» Customization and Driver
Development Services
Computer-on-Modules
Fast, complete solutions with...
Broad Knowledge Base Accelerates Time-to-Market
Kontron offers a variety of hardware and software tools to speed
up and simplify your R&D processes.
With complete starter kits that, which include all required hardand software for quick evaluation, engineers can start development while defining their application-specific solution. In addition to the available starter kits Kontron also provides various
additional Graphics Adapters help developers to convert panel
signals to the required specification of the target application.
Find out more on: kontron.com/mysafechoice
Concentrate on Your Core Business
With Kontron Computer-on-Modules (COM), customers can concentrate on their core business and only have to design the necessary interfaces and circuits for their individual carrier boards.
The standardized computer module is then simply plugged into
the carrier board. Customers can focus on their application-specific elements without worrying about the computing core.
Indiividual Carrierr Board Design
When Carrier Board design and Computer-on-Modules come from
a single source, system functionality is optimally tuned for the
application. Kontrons Team offers the correct form factor fit with
the highest quality. With x86, ARM and PowerPC design experience, Kontron develops and delivers any kind of Carrier Board,
including test, memory, heatsink, housing, assembly, individual
configuration, packaging and shipment. Even if you can't find a
suitable module in Kontron's broad product range, we'll take on
the design and the manufacturing of complete boards with any
desired CPU in any desired form factor.
Find out more on kontron.com /boardsandmore
www.kontron.com
Embedded Motherboards
» Motherboards «
Feature-packed Kontron embedded KTQM87 - Mini-ITX motherboard with soldered 4th Generation Intel® Core i7, i5, i3, Pentium & Celeron® mobile processors offers extended graphics
capabilities, best-in-class performance and highest versatility
supporting ECC RAM. Shipment including fan and cooler.
» 3x DisplayPort & LVDS
» MULTIPURPOSE Feature Connector
Based on 8085 Microcontroller for easy
customizing, KT Break-out Board available
» Solid CAPs for extended Lifetime & MTBF
» Longevity up to 7 years and enhanced
life cycle management
» License-Bundles for Microsoft
Wind River and Linux OS
10
3 independent
Display Support,
PCIe 3.0, USB 3.0
3
Embedded Motherboards
KTQ87/mITX
» 4th Generation Intel® 22nm Dual and Quad Core i7, i5, i3,
Pentium & Celeron® CPUs with Intel® Q87 Lynx Point PCH
» Long term available Embedded mITX motherboard
» High performance CPU, graphics, and media performance
supporting 3 independent displays pipes
» Graphics APIs DirectX® 11.1, OpenGL 4.x, OpenCL 1.2
» 3x DisplayPort for flexible, high resolution display drive
» 2x DDR3L/DDR3 DIMM sockets supporting
up to 16GB DDR3 Memory
Typical Applications
» Digital Signage: High graphics performance and
multi-display support
» Gaming/POS/POI: High graphics and high CPU performance
» Medical: High Graphics performance & longevity
» Industrial Automation: wide range of I/Os and longevity
» Future-oriented devices due to DisplayPort and
mSATA/compact SSD support
Widest range of Interfaces: KTQ87/mITX
mSATA socket on rear side
DD3 Slot 0
DD3 Slot 1
ATX/BTXPWR
SATA4
SATA3
FEATURE
COM2 SATA2
COM1
SPI
SATA0 SATA5
USB4
USB5
USB10
USB11
FRONTPNL
mSATA interface
for compact SSD
mSATA &
USB9
PCIe x16
eDP
mPCIe &
USB8
eDP
Embedded DisplayPort
» Standardized pinout
» High throughput to support
high resolution
» Fewer wires than LVDS –
easier wiring
» Less EMI
FAN CPU
ATX+12V
LAN1
USB3
USB2
LAN2
USB1
USB0
DP2
DP1
DP0
Audio
DisplayPort Adapter
DP to VGA
DP to HDMI
DP to DVI-D
www.kontron.com
Embedded Motherboards
Embedded Mini-ITX Motherboards
Mini-ITX has become a very successful embedded motherboard
form factor. Key features including multi LAN and a wide range
of I/O options make these products ideal for many applications.
The compact and space-saving footprint (17cm x 17cm) meets
the growing need for a small form factor board-level solution
and allows the customer to design a compact system without
sacrificing the requirement of standard ATX mounting holes and
the I/O bracket area.
Whatever your needs are – low power consumption with passive
(fanless) cooling or high CPU speed, excellent graphics performance, TCO reduction by Intel® AMT remote control or a wide
range of extension slots and accessories – you will find it here.
Additionally, all Kontron Mini-ITX boards offer longevity, low to
high-end performance and high MTBF.
The Mini-ITX form factor fills the gap between ultra small form factor boards like Pico-ITX and full-size Flex and ATX motherboards.
Technology Highlights
AMD® Embedded R-Series APU
Up to 4 independent display outputs with the AMD® R-series based Motherboards KTA70M/mITX and KTA75/FLEX
DP, single link DVI or HDMI™
DP1
DP2
DP3
DP, single link DVI or HDMI™
DP, single link DVI or HDMI™
DP, single link DVI or HDMI™
DP4
Please note: Realization requires 1 ADD-Card
KTA70M-mITX
12
ADD card KT-PCIe-DP++ to
realize the 4th DisplayPort
with AMD R-series boards
Embedded Motherboards
Hardware-based remote Diagnosis and Repair
with Intel® vPro™ Technology with Intel® Active Management Technology:
Intel® AMT is part of the Intel® Management Engine, which is
built into PCs with Intel® vPro™ Technology. Intel® AMT is running in a ME integrated into the PCH (Platform Controler Hub)
and is independent of the host CPU. This deep level hardwarebased AMT Remote Troubleshooting and Recovery for distributed
applications offers:
» Remote monitoring, maintenance and installation via
existing network connections
» Hardware-based management when system is powered
off or when OS is unresponsive
» Remote power up / power down
» Support of full KVM remote control
» Remote boot and BIOS Update
» Remote status information
» Remote BIOS parameter changes and firmware updates
» Proactive Alerting
» For enhanced security HW-based encryption is included
This means:
» Significant reduction of on-site-findings and field work
» Decrease of downtime and minimized time-to-repair
» Increased efficiency of IT technical staff
» Reduced TCO (Total Cost of Ownership)
Currently available for KTQM67/77, KTQ67/77, KTH81, KTQM87
and KTQ87 Motherboard families.
IT or Service Provider can power on, remotely access and fix inoperable Embedded systems
IT- Console
Remote power-up and access to
protected memory - asset information, BIOS settings, event logs
- when system is powered off*
Communication channel
"below" the OS through
TCP/ IP Firmware stack when the system’s working*
Factory Robots, HMI,
Industrial PC
Medical
Remote boot, console redirection,
power reset, alerting and access
to, protected memory - when OS
is unresponsive*
ATM, Kiosks, POS
POI
* Different examples for remote management and security capabilities depending on system status
www.kontron.com
Accessories
» Accessories «
New Long-Life Coolers available!
E.G. the new “Cooler Active 35W 33 mm longlife” (PN 10526345) is a cooling solution for 35W CPU’s like all mobile 3rd
Generation Core CPU’s and some 2nd Generation Core CPU’s.
It fits for KTQM67, KTQM77, KTHM65 and KTHM76 and is PWM
controlled. The highest part of the cooler is 33 mm above PCB
and the MTBF of the fan is 710.000 hours @ 40C, 177.500
hours @ 60C. Please ask for further models!
Evaluation Break-out Boards for the KT Feature Connector
The unique KT Evaluation Break-out Boards will simplify the access to the functions available on the KT Feature Connector and
to add additional functions.
Up to 4 Evaluation Break-out Boards can be connected in series.
The first board includes special functions, shared functions and
standard functions, while the other boards include shared and
standard functions only.
» 4 DAC & 5 ADC
» System Monitoring LED’s
» Thermo sensor onboard
» 2 digital 7-segment LED
» 18 Open Drain Output
» 20 GPIO’s
14
» Thermo sensor remote
» Case Open
» iBotton
» Fan1
» Fan2
Industrial
MTB
F
Pico-ITX
» Pico-ITX «
Pico-ITX – the small, powerful and cost-effective 2.5" Motherboard family.
With the Pico-ITX form factor, Kontron supports a new definition of small (100 x 72 mm), powerful and cost-effective 2.5"
Motherboards. The pITX-E38, Kontron’s latest 2.5" Motherboard
based on the Pico-ITX industry standard, features the Intel®
Atom™ E38xx series SoC, along with multiple I/O options and
microSD-Card boot.
pITX-E38
Ultrasmall 2.5“ Pico-ITX board with Intel® Atom™ E38XX System on Chip (SoC)
» Intel® Atom™ E38xx SoC (1, 2 or 4 cores), TDP: 5-10W
» SO-DIMM Socket DDR3L-1333 Memory (up to 8GB)
» Intel® Gen7 Graphics, OpenGL 3.0, OpenCL 1.2, DX11,
H.264, MPEG2, MCV, VC-1, VP8
» LVDS 24Bit dual channel and DisplayPort 1.1a
» 10/100/1000MBit RJ45 Ethernet LAN, SATA, mSATA or
mPCIe in mPCIe connector
» USB 2.0 & USB 3.0 ports, Serial ports 16550 UART, GPIOs
» Bootable high capacity micro SD Card slot
» Lockable DC power connector (5V)
» Extended temperature operating from -25°C to +75°C (E1)
Accessory
Kit Availab
le
www.kontron.com
Pico-ITX
Always On
USB3
USB2
Ext. Battery
SATA0
GPIO
SPI
COM2
COM1
Clear CMOS
mPCIe or
mSATA
Audio
SOC Temp.
Sensor
On the backside:
» ISODIMM
» ISD Card Slot
» ISystem Temp. Sensor
» IXDP (unsupported)
Fan
Power
OK LED
LAN1
DP1
Frontpanel
USB1 (USB2.0)
USB0 (USB 3.0/2.0)
5Vin Ext.
+5Vin Int.
Pico-ITX standard cooling concept – perfect for Box-PC-Design
PUTER
F NLESS COM
T FA
MINI-ITX
CONCEPT
CB 753 Dual Head
16
» Technical Information «
» Computer-on-Module
» Pico-ITX 2.5"
» Mini-ITX to Flex-ATX
The pulse www.kontron.com
of innovation
» Embedded Flex-ATX Motherboards «
Embedded
Motherboards
KTQ87/Flex
KTH81/Flex
KTQ77/FLEX
KTQM67/FLEX
KTA75/FLEX
Form Factor
Flex-ATX
Flex-ATX
Flex-ATX
Flex-ATX
Flex-ATX
Dimensions (H x W x D)
9" x 7.5" (22,86 x 19,05 cm)
9" x 7.5" (22,86 x 19,05 cm)
9" x 7.5" (22,86 x 19,05 cm)
9" x 7.5" (22,86 x 19,05 cm)
9" x 7.5" (22,86 x 19,05 cm)
CPU
Intel® Core i7-4770S GT2, i5-4570S GT2, i3-4330 GT2
Intel® Pentium-3420 GT1
Intel® Celeron® G1820TE GT1
Intel® Core i7-4770S GT2, i5-4570S GT2, i3-4330 GT2
Intel® Pentium-3420 GT1
Intel® Celeron® G1820TE GT1
Intel® Core™ i3-3220, i5-3550S, i7-3770
Intel® Pentium G2120
Intel® Core™ i7-2710QE, i3-2330E, i5-2510E
Intel® Celeron® Processor B810
R-464L Quad Core, R-460H Quad Core, R-460H Quad Core,
R-272F Dual Core, R-268D Dual Core, R-268D Dual Core
Chipset
Intel® Q87
Intel® H81
Intel® Q77
Intel® QM67
AMD A75 Hudson-D3 FCH
Main Memory
Up to 32 GB DDR3L/DDR3 (max. 4x 8 GB)
Up to 16 GB DDR3 (max. 2x 8 GB)
Up to 32 GB DDR3 (max 4x 8GB),
1067/1333/1600 MHz support
Up to 32 GB DDR3 (max. 4x 8 GB)
Up to 16GB DDR3 UDIMM (max 2x 8GB)
Front Side Bus
Up to 20 GB/s point-to-point DMI 2.0 interface to PCH
Four lanes in each direction
Up to 20 GB/s point-to-point DMI 2.0 interface to PCH
Four lanes in each direction
Up to 20 Gb/s each direction, full duplex, DMI 2.0
interface to PCH, Four lanes in each direction
5 GT/s point-to-point DMI 2.0 interface to PCH
Four lanes in each direction
UMI (Unified Media Interface) interface,
up to 4-lanes and 5GB/S per lane
Graphics Controller
Intel® HD Graphics 4600 integrated,
GT1 or GT2 depending on CPU type
Intel® HD Graphics 4600 integrated,
GT1 or GT2 depending on CPU type
Integrated
Intel® HD Graphics 3000 integrated
AMD Radeon™ HD 7000G Series,
supporting OpenGL/CL, Full DirectX® 11
Graphics
3x DisplayPort (1x shared with optionalLVDS),
1x 18/24Bit dual Link LVDS interface
2x DisplayPort (1x shared with optionalLVDS),
optional 1x 18/24Bit dual Link LVDS interface
2x DisplayPort, 1x CRT, 1x VGA
2x DisplayPort, 1x DVI-I, 1x LVDS / Embedded DP, HDMI
via Adapter, (1x PCIe x 16 PCI slot)
3x DisplayPort version 1.2, 1x DisplayPort Optionally AddOn card, 1x LVDS Optionally Add-On card (TBD), 1x VGA
Ethernet Controller
1x Intel® Clarkville i218LM (i218-LM with AMT 9.0 support),
1x Intel® Pearsonville i218AT
1x Intel® Clarkville i218V
1x Intel® Pearsonville i218AT
-
1x Intel® Lewisville 82579LM,
2x Intel® Hartwell 82574L
Intel® Pearsonville xGB PCI Express Ethernet controller
(WGI211ATSLJXZ)
Ethernet
2x Intel® GB LAN (1x AMT 9.0 support)
2x Intel® GB LAN
3x GbE-LAN, (1x AMT 8.0 support)
3x Intel® GB LAN (1x AMT 8.0 support)
2x 10/100/1000Mbits/s
Hard Disk
6x SATA (SATA 150/300/600) w. RAID 0,1,5,10 support
4x SATA (2x SATA 150/300 and 2x SATA 600)
6x SATA interfaces (4x SATA 150/300 and 2x SATA 600) w.
RAID 0/1/5/10, mSATA interface for SSD storage
6x SATA (4x SATA150/300 and 2x SATA600) w. RAID
0,1,5,10 support, mSATA for SSD storage
6x SATA (150/300 & 600)
1x mSATA shared with mPCIe
Parallel Port
n/a
n/a
-
LPT in a FFC connector
n/a
Flash Onboard
-
-
-
n/a
-
PCI
1x PCI
1x PCI
2x PCI 32bits/33MHz
3x PCI
2x PCI 32bit/33MHz
PCI Express® / PCI support
1x PCIe x16 (Gen3), 1x PCIe x4 (Gen2), 1x PCIe x1 (Gen2)
1x PCIe x16 (Gen3), 1x PCIe x4 (Gen2), 1x PCIe x1 (Gen2)
1x PCIe x16, 1x PCIe x4 (in a x16 slot)
1x PCIe x16, 1x PCIe x1
1x PCIe x16 1x PCIe x4 Slot (in x16 slot)
Mini-PCI
-
-
1x mini-PCI Express®
2x mini PCI-Express
1x mPCIe Slot 1x mPCIe/mSATA
(mechanically shared between mSATA and mPCIe)
USB
4x USB 3.0, 8x USB 2.0, (4x USB3.0/USB2.0 Rear IO, 8x USB2.0
Internal Header)
2x USB3.0, 8x USB2.0 (2x USB3.0/USB2.0 + 2x USB2.0 Rear IO;
8x USB2.0 Internal Header)
4x USB 3.0 & 10x USB 2.0
14x USB 2.0
12x USB (4x USB2.0 & 4x USB2.0/USB3.0 on Rear I/O)
IEEE 1394 Firewire
n/a
n/a
-
2x IEEE1394a (Pin header)
-
Serial
2x RS232
2x RS232
4x RS232
4x RS232
2x RS232
Rear I/O
4x USB 3.0/2.0, 3x DisplayPort, 2x RJ45 LAN ,2x3 mini Audio Jack
tower
2x USB3.0/2.0, 2x USB2.0, 2x DisplayPort, 2x RJ45 LAN,
2x3 mini Audio Jack Tower
1x DB9 serial port, 1x VGA, 1x Audio stacked 2x3 mini
Jack tower, 6x USB, 2x DisplayPort, 3x RJ45 LAN
2x Dual USB +Displayport, 1x Dual USB + Ethernet,
1x Dual Ethernet, 1x DVI, Audio 3x
2x RJ45 (stacked), 4x USB 2.0, 4x USB 3.0, 3x DP
Audio Controller
VT1708S, HD Audio 7.1 channel surround sound
VT1708S, HD Audio 7.1 channel surround sound
VIA 1708B, 7.1 Channel HD Audio, stacked 2x3 mini Jack
tower
HD Audio 7.1, Mic x2, CDROM in and SPDIF
VIA VT1708S, 7.1 Channel HD Audio 3x Audiojacks stack
(in REAR-IO area)
Keyboard
KBD/MSE pinrow connector
KBD/MSE pinrow connector
Internal PS2 Mouse/Keyboard connector
Internal PS2 Mouse/Keyboard connector
PS2 Mouse/Keyboard connector
Special Features
DAC up to 160 GPIO, TPM, KT embedded feature port with ADC,
Intel® AES security
DAC up to 160 GPIO, TPM, KT embedded feature port with ADC,
Intel® AES security
KT embedded feature connector with ADC,
DAC up to 160 GPIO
DAC up to 160 GPIO, TPM 1.2,
KT embedded feature port with ADC
152 GPIO max. expansion, 15 Multiplexed (GPIO, DAC,
ADC, PWM & TIMER), Watchdog, TPM 1.2, Exchangeable
3.0V Lithium battery for on-board Real Time Clock and
CMOS RAM, KT embedded Controller
BIOS
Phoenix
Phoenix
AMI UEFI
AMI BIOS
AMI EFI
Power Management
ACPI 3.0
ACPI 3.0
-
ACPI 3.0
ATX PSU
Operation Temperature
0°C to 60°C (32°F to 140°F)
0°C to 60°C (32°F to 140°F)
0°C - 60°C (32°F - 140°F)
0°C - 60°C (32°F - 140°F)
0°C - 60°C (32°F - 140°F)
Operating System
Win7, WES7 32/64bit, Win8, WES8, Linux, VxWorks
Win7, WES7 32/64bit, Win8, WES8, Linux, VxWorks
WinXP, Win7 (32/64), WES7 (32/64), Linux, VxWorks
WES7 32/64bit, Linux, VxWorks, WindRiver Linux
Win 7 (32 and 64bit), Win 8 (32 and 64bit),
WinXP (32 bit), WES7
18
www.kontron.com
» Embedded Mini-ITX Motherboards «
Embedded
Mini-ITX
Motherboards
170 x 170 mm
mITX-E38
KTQM87/mITX
KTQ87/mITX
KTH81/mITX
KTQM77/mITX
KTHM76/mITX
Form Factor
Thin Mini-ITX
Mini-ITX
Mini-ITX
Mini-ITX
Mini-ITX
Mini-ITX
Dimensions (H x W x D)
6.7" x 6.7" (17,0 x 17,0 cm)
6.7" x 6.7" (17,0 x 17,0 cm)
6.7" x 6.7" (17,0 x 17,0 cm)
6.7" x 6.7" (17,0 x 17,0 cm)
6.7" x 6.7" (17,0 x 17,0 cm)
6.7" x 6.7" (17,0 x 17,0 cm)
CPU
Intel® Atom™ E3845, E3826, E3815
Intel® Core™ i7-4700EQ, i5-4400E, i3-4100E
Intel® Celeron® 2000E
Intel® Core™ i5-4570S, i7-4770S GT2, i3-4330 GT2;
Intel® Pentium-3420 GT1
Intel® Celeron® G1820TE GT1
Intel® Core™ i7-4770S GT2 , i5-4570S GT2, i3-4330 GT2;
Intel® Pentium-3420 GT1,
Intel® Celeron® G1820TE GT1
Intel® Core™ i3-3120ME, i5-3610ME, i7-3610QE
Intel® Core™ i7-2710QE, i3-2330E,i5-2510E
Intel® Celeron® Processor B810
Chipset
-
Intel® QM87
Intel® Q87
Intel® H81
Intel® QM77
Intel® HM65
Main Memory
Up to 8 GB SO-DIMM Socket DDR3L-1333/1066
(max. 1x 8GB)
Up to 16 GB DDR3 (max. 2x 8 GB)
Up to 16 GB DDR3 (max. 2x 8 GB)
Up to 16 GB DDR3 (max. 2x 8 GB)
Up to 16 GB DDR3 (max. 2x 8 GB)
Up to 16 GB DDR3 (max. 2x 8 GB)
Front Side Bus
-
Up to 20 GT/s point-to-point DMI 2.0 interface
to PCH, Four lanes in each directio
Up to 20 GB/s point-to-point DMI 2.0 interface
to PCH, Four lanes in each direction
Up to 20 GB/s point-to-point DMI 2.0 interface to
PCH, Four lanes in each direction
5 GT/s point-to-point DMI 2.0 interface to PCH,
Four lanes in each direction
5 GT/s point-to-point DMI 2.0 interface to PCH,
Four lanes in each directio
Graphics Controller
Intel® Gen7 Graphics
OpenGL 3.0, OpenCL 1.2
Intel® ® HD Graphics 4600 internal
Intel® HD Graphics 4600 integrated,
GT1 or GT2 depending on CPU type
Intel® HD Graphics 4600 integrated,
GT1 or GT2 depending on CPU type
Intel® HD Graphics 4000 integrated,
supporting 3 independent Displays
Intel® HD Graphics 3000 integrated
Graphics
2x independent graphic outputs, E3815/E3826:
1x DP 1.1a, up to 2560x1600, E3845: 1x DP
1.1a, up to 2560x1600, 1x LVDS dual channel
24bit, up to 1920x1200
3x DisplayPort (1x PCIe x16 Gen3)
3x DisplayPort (1x PCIe x16 Gen3)
2x DisplayPort (1x PCIe x16 Gen2)
2x DisplayPort, 1x DVI-I, 1x LVDS / Embedded DP, HDMI via
Adapter (1 x PCIe x 16 PCI slot)
2x DisplayPort, 1x DVI-I, 1x LVDS, HDMI via Adapter
(1 x PCIe x 16 PCI slot)
Ethernet Controller
Intel® Pearsonville i211AT
1x Intel® Clarksville WGI218LM
(supporting AMT 9.0)
1x Intel® Pearsonville I211AT
1x Intel® Clarkville i218LM (with AMT 9.0
support), 1x Intel® Pearsonville i218AT
1x Intel® Clarkville i218V
1x Intel® Pearsonville i218AT
1x Intel® Lewisville 82579LM, 2x Intel® Hartwell 82574L
1x Intel® Lewisville 82579LM
Ethernet
2x Intel® GB LAN
2x Intel® GB LAN (1x AMT 9.0 support)
2x Intel® GB LAN (1x AMT 9.0 support)
2x Intel® GB LAN
3x Intel® GB LAN (1x AMT 8.0 support)
1x Intel® GB LAN
Hard Disk
2x SATA (SATA 150/300)
(1x mSATA shared with mPCIe)
4 x SATA (SATA 150/300/600) w. RAID
0,1,5,10 support, 2x mSATA
5x SATA (SATA 150/300/600) w. RAID 0,1,5,10
support, 1x mSATA (w. USB, LPC)
3x SATA (2x SATA 150/300, 1x SATA 600), 1x mSATA
(w. USB, LPC)
6x SATA (4x SATA150/300 and 2x SATA600) w. RAID 0,1,5,10
support, mSATA for SSD Storage
6x SATA (4x SATA150/300 and 2x SATA600)
Parallel Port
n/a
n/a
n/a
n/a
Optional
LPT in a FFC connector
Flash Onboard
eMMC 16GB TLC Nand. E3845 only
-
-
-
n/a
mSATA
PCI Express® /
PCI support
1x PCIe x1
1x PCIe x16 Gen3
1x PCIe x16 Gen3
1x PCIe x16 Gen2
1x PCIe x16, 1 PCIe x1
1x PCIe x16, 1x PCIe x1
Mini-PCI
1x mini-PCI Express® x1
2x mini-PCI Express®
1x mini-PCI Express® (w. USB)
1x mini-PCI Express® (w. USB)
2x mini PCI-Express®
2x mini PCI-Express®
USB
E3815/E3826: 3x USB 2.0, 1x USB2.0/3.0;
E3845: 6x USB 2.0, 1x USB2.0/3.0
4x USB 3.0/2.0, 8x USB 2.0 (2x Internal
Header, 2x PCIe sockets)
4x USB 3.0/2.0, 6x USB 2.0
2x USB 3.0/2.0, 8x USB 2.0
10x USB 2.0, 4x USB 3.0
12 x USB 2.0 (6 External + 6 Internal)
IEEE 1394 Firewire
n/a
n/a
n/a
n/a
2x IEEE1394a (Pin header)
n/a
Serial
E3815: 2x RS232 UART 16550
E3826/E3845: 6x RS232 UART 16550
2x RS232
2x RS232
2x RS232
4x RS232
4x RS232
Rear I/O
Ext. 12V, 2x DP, 2x USB 2.0,
1x USB 3.0, 2x LAN, 1x Audio Jack
4x USB3.0/USB2.0, 4x USB2.0,, 3x DisplayPort,
2x RJ45 LAN, 1x3 mini Audio Jack tower
4x USB 3.0/2.0, 3x DisplayPort,
2x RJ45 LAN, 2x3 mini Audio Jack tower
2x USB 3.0/2.0, 2x USB 2.0, 2x DisplayPort, 2x
RJ45 LAN, 2x3 mini Audio Jack tower
2x Dual USB +Displayport, 1x Dual USB + Ethernet, 1x Dual
Ethernet, 1x DVI, Audio 3x
2x Dual USB +Displayport, 1x Dual USB + Ethernet,
1x DVI, 1x Audio 3x
Audio Controller
VIA VT1708S, HD Analog, 2x Audio Jack, SPDIF
Out, Line-Out
VT1708S, HD Audio 7.1 channel surround
sound
VT1708S, HD Audio 7.1 channel surround
sound
VT1708S, HD Audio 7.1 channel surround sound
HD 7.1, Mic x2, CDROM in and SPDIF
VIA 1708B, HD Audio 7.1, Mic x2,
CDROM in and SPDIF
Keyboard
6-pin PS/2 Keyboard/Mouse
KBD/MSE pinrow connector
n/a
n/a
Internal PS2 Mouse/Keyboard connector
Internal PS2 Mouse/Keyboard connector
Special Features
DAC up to 160 GPIO, TPM (E3845 only), KT
embedded feature port with ADC; E3826 and
E3845 only: 1x Micro SD Card Slot , SD Card 3.0
interface
DAC up to 160 GPIO, TPM, KT embedded
feature port with ADC, Intel® AES security
DAC up to 160 GPIO, TPM, KT embedded
feature port with ADC, Intel® AES security,
ATX power supply only!
DAC up to 160 GPIO, TPM, KT embedded feature port
with ADC, Intel® AES security, ATX Power supply
only
DAC up to 160 GPIO, TPM, KT embedded feature port with ADC,
ATX and single 12V power supply
DAC up to 160 GPIO, TPM 1.2,
KT embedded feature port with ADC
ATX and single 12V power supply on Mini-ITX
BIOS
Phoenix
Phoenix
Phoenix
Phoenix
AMI
AMI
Power Management
-
ACPI 3.0
ACPI 3.0
ACPI 3.0
ACPI 3.0
ACPI 3.0
Operation Temperature
0°C to 60°C (32°F to 140°F)
0°C to 60°C (32°F to 140°F)
0°C to 60°C (32°F to 140°F)
0°C to 60°C (32°F to 140°F)
0°C - 60°C (32°F - 140°F)
0°C - 60°C (32°F - 140°F)
Operating System
Win7, WES7, WES8, Win8 (32 and 64bit),
Linux, WxWorks
Win XP, Win7, WES7 32/64bit, Win8,
Linux, VxWorks
Win7, WES7 32/64bit, Win8, WES8,
Linux, VxWorks
Win7, WES7 32/64bit, Win8, WES8
Linux, VxWorks
WES7 32/64bit, Linux, VxWorks, WindRiver Linux
WES7 32/64bit, Linux, VxWorks, WindRiver, Linux
20
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» Embedded Mini-ITX Motherboards «
Embedded
Mini-ITX
Motherboards
170 x 170 mm
KTA70m/mITX
KTT30/mITX
Form Factor
Mini-ITX
Mini-ITX
Dimensions (H x W x D)
6.7” x 6.7” (17,0 x 17,0 cm)
6.7” x 6.7” (17,0 x 17,0 cm)
CPU
AMD R-Series R-252F,R-452L,R-460L
NVIDIA Tegra 3ybr> ARM Cortex-A9 Quad Core 900MHz
Chipset
AMD Fusion Controller Hub A70M
-
Main Memory
Up to 16 GB DDR3 (max. 2x 8 GB)
Up to 2 GB DDR3L memory down
Front Side Bus
Unified Media Interface (UMI),
Up to 4-lanes and 2GB/S per lane
-
Graphics Controller
Integrated Graphics AMD Radeon™ HD 7000G, 2D
Acceleration Features, Open GL 4.2 & 2.0, DirectX® 11
compliant 3D Acceleration Features, Dedicated hardware
(UVD 3) for H.264, VC-1, DivX and MPEG2 decode
NVIDIA GeForce GPU, Enhanced 3D capabilities, 1080p
H264 MPEG-4 encoding/decoding Video Processor
support 2 independent displays
Graphics
3x DisplayPort, Optionally Add-On card with 1x
DisplayPort, Up to 4x independent display outputs
1x HDMI 1.4a (up to 1920x1080 pixel),
1x LVDS 24bit (up to 2048x1536 pixel @ 18bpp)), DSI
(up to 1440x900 @ 18bpp)
Ethernet Controller
Intel® Pearsonville xGB PCI Express Ethernet controller
(WGI211ATSLJXZ)
Intel® 82574L
Ethernet
2x 10/100/1000 Mbits Intel® GB LAN
1x 10/100/1000 Mbit LAN
Hard Disk
5x SATA (SATA 150/300/600) w. RAID 0,1,10 support
1x mSATA
1x SATA (SATA 150/300), 1x mSATA shared with Mini-PCI
Express
Parallel Port
n/a
n/a
Flash Onboard
n/a
1x eMMC (Bootable)
PCI Express® /
PCI support
1x PCIe x8 (in mechanically x16 slot)
1x PCIe x4 (in mechanically x16 slot)
-
Mini-PCI
1x mini-PCI Express (mechanically sharing space with
mSATA slot)
1x Mini-PCI Express x1,
1x Mini-PCI Express x1 shared with mSATA
USB
4x USB2.0/3.0, 9x USB2.0
3x USB 2.0 (2x Type A and 1x Micro (supports also one
port USB client mode))
IEEE 1394 Firewire
n/a
n/a
Serial
2x RS232
2x RS232
Rear I/O
4x USB 2.0, 2x DP + 2x USB 2.0/USB3.0,
1x DP, 1x 2x RJ45, 1x Audio Jack,
1x 4 pole External connector
2x USB 2.0 Type A, 1x USB 2.0 micro (USB client),
1x HDMI, 1x Audio (LineIn, LineOut, Mic), 1x Power
external
Audio Controller
VT1708S
HD Audio 7.1 channel surround sound
Two integrated audio controllers
(PCM and Inter-IC Sound, called IIS or I2S)
Keyboard
Internal PS2 Mouse/Keyboard connector
via GPIO or USB
Special Features
15 Multiplexed (GPIO, DAC, ADC, PWM & TIMER),
Possible 152 GPIO expansion
Software Watchdog, TPM, KT embedded controller for
feature rich Intel®ligent I/O
Up to 18 GPIOs on a Feature connector,
USB modem card interface with SIM card socket, One SPITM
interface (3.3V) on a pin header, Serial Atmel® touch screen
interface (I2CTM), CSI/DSI/12-bit par. Camera input, 2x SDcard
socket
BIOS
AMI
Bootloader on SPI Flash
Power Management
ACPI 3.0
-
Operation Temperature
0°C - 60°C (32°F - 140°F)
0°C to 60°C (32°F to 140°F)
Operating System
Win XP, Win7 (32 and 64bit), WES7,
Win 8 (32 and 64bit)
WEC7, Linux, Android
22
» Embedded Pico-ITX SBC «
2.5" Pico-ITX
pITX-E38
KTA55/pITX
KTAM3874/pITX
Form Factor
Pico-ITX
Pico-ITX
Pico-ITX
Dimensions (H x W x D)
100 x 72 mm
100 x 72 mm
100 x 72 mm
CPU
Intel® Atom™ E3845, E3826, E3815
AMD G-series 1.0 GHz dual core T40N
TI® AM3874 SitaraTM up to 800 MHz
ARM® CortexTM-A8
Chipset
-
AMD A55E
-
Main Memory
1x SO-DIMM Socket supporting
DDR3L-1333/1066 (up to 8 GB)
Up to 1x 4 GB DDR3 SODIMM
1GB Dual 32bit DDR3-800 memory
onboard (up to 2 GB optional)
Graphics
2x independent graphic outputs,
1x DP 1.1a, up to 2560x1600,
1x LVDS dual channel 24bit, up to
1920x1200
1x DVI and VGA Output via DVI-I,
2x 24 Bit LVDS dual independent
display support up to 2 x Full HD
2 independent graphic outputs,
1x HDMI 1.3a, up to 1080p,
1x LVDS dual channel 24bit,
up to 1080p
Ethernet
1x RJ45 10/100/100 Mb/s Ethernet
1x 10/100/1000Mbit Ethernet
2x 10/100 Mb/s Ethernet
with integrated optional switch
Hard Disk
1x microSD card slot (SDXC)
1x microSD-Card-Slot, bootable
1x microSD card slot,
Onboard 4GB eMMC Nand flash
(optionally up to 16GB)
SATA
1x SATA 2.0, 1x mSATA shared
with mPCIe
2x SATA connector incl.
RAID-support
1x SATA 2.0,
1x mSATA shared with mPCIe
PCI Express® / PCI support
1x mPCIe® 2.0 port (x1 lane)
-
1x mPCIe® 2.0 port (x1 lane)
USB
1x USB2.0 + 1x USB3.0/2.0
(Front IO)
2x USB2.0 (Internal)
6x USB 2.0
4x USB 2.0 (2 on front I/O, 2 internal
(1x USB client)), 1x USB 2.0 on
mPCIe connector
Serial
2x Serial ports UART 16550
(3v3 digital inputs/outputs)
-
2x RS232,
1x RS232/485
Audio
HD Analog audio interface
(Line-In, Line-Out, Mic-In)
Via VT1708S
Analog audio interface (Line-In, LineOut, Mic-In), 1 W Speaker interface
I/Os
8x GPIOs, SUSLED, SATALED
8x GPIO, Backlight Output selectable
5V or 12V, TPM 1.2
26x GPIOs, 1x I2C, 2x CAN Bus, 1x
UART, Timer and SPI output shared
with GPIO´s, 1x SIM-card slot
onBoard for mPCIe modem cards
Operating System
WEC7, WES7, WES8, Win7, Win8,
Linux, Linux Yocto, VxWork
WEC7, WinXPe, WES7, Linux, VxWorks
WEC7, Linux, Android
Operation Temperature
-25°C to +75°C (E1)
0°C - 60°C
-40°C to +85°C (E2)
Cooling
Passive (5W SoC),
Active (7-10W SoC)
-
-
Power Supply
Single supply 5V DC, Internal and
external lockable connector
Single supply 5V DC, Internal and
external lockable connector
Single supply 5V DC
Power Consumption
3.8W to 5.75W Idle
(depending on CPU)
7.25 W Idle
4.9 W Idle
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» COM Express® basic «
COM Express®
basic
COMe-bHL6
COMe-bHL6RXT
COMe-bIP#
COMe-bSC#
COMe-bSC2RXT
Compliance
COM Express® basic, Pin-out Type 6
COM Express® basic, Pin-out Type 6
COM Express® basic, Pin-out Type 2 & 6
COM Express® basic, Pin-out Type 2 & 6
COM Express® basic, Pin-out Type 2
Dimensions (H x W x D)
125 x 95 mm
125 x 95 mm
125 x 95 mm
125 x 95 mm
125 x 95 mm
CPU
Intel® Core™ i7-4860EQ, i7-4850EQ, i7-4700EQ, i5-4410E, i5-4400E,
i5-4422E, i5-4402E,
i3-4110E, i3-4100E, i3-4112E, i3-4102E
Intel® Core™ i7-4700EQ, i7-4860EQ, i5-4410E, i7-4400E
Intel® Core™ i7-3615QE, i7-3612QE, i7-3555LE, i73517UE, i5-3610ME , i3-3120ME, i3-3217UE
Intel® Core™ i7-2715QE, i7-2655LE, i7-2610UE, i5-2515E,
i3-2310E, i3-2340UE
Intel® Core™ i7-2655LE, Intel® Core™ i7-2610UE
Intel® Celeron® 1020E, 1047UE, 927UE
Intel® Celeron® 2000E, 2002E
Intel® Celeron® B810E, 847E, 827E, 807UE
Chipset
Intel® Mobile QM87 (Core™ i5, i7)
Intel® Mobile HM86 (Core™ i3 & Celeron®)
Intel® Mobile QM87
Intel® Mobile QM77 (Core™ i3, i5, i7),
Intel® Mobile HM76 (Celeron®)
Intel® Mobile QM67 (Core™ i3, i5, i7)
Intel® Mobile HM65 (Celeron®)
Intel® Mobile QM67 (Core™ i7)
Main Memory
2x DDR3L-1600 SO-DIMM
up to 2x 8GB
2x DDR3L-1600 ECC SO-DIMM
up to 2x 8GB
2x DDR3-1600 SO-DIMM up to 2x 8 GB or 2x DDR3-1600
ECC SO-DIMM
up to 2x 8 GB
2x DDR3-1333 ECC SO-DIMM up to 2x 8GB or 2x DDR31333 SO-DIMM up to 2x 8GB
2x DDR3-1333 ECC SO-DIMM
up to 2x 8GB
Graphics Controller
Intel® HD5200 (GT3e), Intel® HD4600 (GT2), Intel® HD Graphics
(GT1)
Intel® HD5200 (GT3e), Intel® HD4600 (GT2)
Intel® HD4000 (GT2),
Intel® HD Graphics (GT1)
Intel® HD3000 (GT2)
Intel® HD Graphics (GT1)
Intel® HD3000 (GT2)
Ethernet Controller
Intel® I218LM
Intel® I218LM
Intel® 82579LM
Intel® 82579LM
Intel® 82579LM
Ethernet
10/100/1000 MBit Ethernet
10/100/1000 MBit Ethernet
10/100/1000 MBit Ethernet
10/100/1000 MBit Ethernet
10/100/1000 MBit Ethernet
Hard Disk
QM87: 3x SATA 6Gb/s, 1x SATA 3Gb/s
HM86: 2x SATA 6Gb/s, 2x SATA 3Gb/s
QM87: 3x SATA 6Gb/s, 1x SATA 3Gb/s
Type 2: 2x SATA 6Gb/s, 2x SATA 3Gb/s, 1x PATA; Type 6: 2x
SATA 6Gb/s, 2x SATA 3Gb/s
Type 2: 2x SATA 6Gb/s, 2x SATA 3Gb/s, 1x PATA
Type 6: 2x SATA 6Gb/s, 2x SATA 3Gb/s
2x SATA 6Gb/s, 2x SATA 3Gb/s,
1x PATA
PCI Express® / PCI support
7x PCIe x1, 1x PEG x16
7x PCIe x1, 1x PEG x16
Type 2: 1x PEG x16, 5x PCIe x1, PCI Rev 2.3 @ 33 MHz
Type 6: 1x PEG x16, 7x PCIe x1
Type 2: 1x PEG x16, 5x PCIe x1, PCI Rev 2.3 @ 33 MHz
Type 6: 1x PEG x16, 6x PCIe x1
1x PEG x16, 5x PCIe x1, PCI Rev 2.3 @ 33 MHz
Panel signal
DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: Yes, LVDS: Dual
Channel 18/24bit
DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: Yes, LVDS: Dual
Channel 18/24bit
DDI1: DP++ or SDVO, DDI2: DP++, DDI3: DP++, VGA: Yes,
LVDS: Dual Channel 18/24bit
DDI1: DP++ or SDVO, DDI2: DP++,
DDI3: DP++ or eDP, VGA: Yes,
LVDS: Dual Channel 18/24bit
DDI1: DP++ or SDVO, DDI2: DP++, DDI3: DP++ or eDP,
VGA: Yes, LVDS: Dual Channel 18/24bit
USB
4x USB 3.0 + 4x USB 2.0
4x USB 3.0 + 4x USB 2.0
Type 2: 8x USB 2.0
Type 6: 2x USB 3.0 + 6x USB 2.0
Type 2: 8x USB 2.0,
Type 6: 6x USB 2.0 + 2x USB 3.0 (Renesas PD720200A)
8x USB 2.0
Serial
2x serial interface (RX/TX only)
2x serial interface (RX/TX only)
2x serial interface (RX/TX only) on Type 6
2x serial interface (RX/TX only) on Type 6
-
Audio
Intel® High Definition Audio
Intel® High Definition Audio
Intel® High Definition Audio
Intel® High Definition Audio
Intel® High Definition Audio
Common Features
SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS
SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS
SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS
SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS
SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, MARS
BIOS
Phoenix Secure Core UEFI
Phoenix Secure Core UEFI
AMI Aptio UEFI
AMI Aptio UEFI
AMI Aptio UEFI
Options
1x PCIe x1 additional w/o onboard LAN, vPRO (AMT/TXT/AES
Support), eDP instead of LVDS
1x PCIe x1 additional w/o onboard LAN, vPRO (AMT/TXT/AES
Support), eDP instead of LVDS
1x PCIe x1 additional w/o onboard LAN vPRO (AMT/TXT/
AES Support)
1x PCIe x1 additional w/o onboard LAN, vPRO (AMT/TXT/
AES Support)
1x PCIe x1 additional w/o onboard LAN, vPRO (AMT/
TXT/AES Support)
Power Management
ACPI 4.0, S5 Eco
ACPI 4.0, S5 Eco,
Kontron Rapid Shut down Technology
ACPI 4.0, S5 Eco
ACPI 4.0, S5 Eco
ACPI 4.0, S5 Eco,
Kontron Rapid Shut down Technology
Power Supply
8.5V – 20V Wide Range,
Single Supply Power
ATX or 12V Single Supply Power
8.5V – 20V Wide Range,
Single Supply Power
8.5V–18V Wide Range,
Single Supply Power
ATX or 12V Single Supply Power
Special Features
POSCAP capacitors, Trusted Platfom Module TPM 1.2, 4k
Resolutions, Flexible PEG lane configuration by Setup Option
POSCAP capacitors, Trusted Platfom Module TPM 1.2, 4k
Resolutions, Flexible PEG lane configuration by Setup Option
POSCAP capacitors, Trusted Platfom Module TPM 1.2, eDP
enabling by external Strap Option
POSCAP capacitors, Trusted Platfom Module TPM 1.2,
PEG/DDI sharing on Type 2
POSCAP capacitors, Trusted Platfom Module TPM 1.2
PEG/DDI sharing
Operating System
Windows® 8, Windows® 7, WE8S, WES7, Linux, VxWorks
Windows® 8, Windows® 7, WE8S, WES7, Linux, VxWorks
Windows® 8, Windows® 7, WES7, WinXP, XPe, Linux,
VxWorks
Windows® 8, Windows® 7, WES7, WinXP, XPe, Linux,
VxWorks
Windows® 8, Windows® 7, WES7, WinXP, XPe, Linux,
VxWorks
Temperature
Commercial temperature:
0°C to +60°C operating,
Extended temperature:
-25°C to +75°C operating,
Industrial temperature:
-40°C to +85°C operating
Commercial temperature:
0°C to +60°C operating
Extended temperature:
-25°C to +75°C operating,
Commercial temperature:
0°C to +60°C operating
Extended temperature:
-25°C to +75°C operating
Industrial temperature:
-40°C to +85°C operating
24
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» COM Express® compact «
COM Express®
compact
COMe-cHL6
COMe-cBTc6 / cBTi6
COMe-cBTi6R
Compliance
COM Express® compact,
Pin-out Type 6
COM Express® compact,
Pin-out Type 6
COM Express® compact, Pin-out
Type 6
Dimensions (H x W x D)
95 x 95 mm
95 x 95 mm
95 x 95 mm
CPU
Intel® Core™ i7-4650U, i5-4300U,
i3-4010U
COMe-cBTc6: Intel® Atom™
E3815; Intel® Celeron® J1900,
N2920,N2930, N2807
Intel® Atom™ E3845, E3827, E3826,
E3825, E3815
Intel® Celeron® 2980U,
COMe-cBTi6: Intel® Atom™ E3845,
E3827, E3826, E3825, E3815
Chipset
Intel® 8-Series LynxPoint-LP
integrated in CPU
-
-
Main Memory
1x DDR3L-1600 SO-DIMM up to 8GB,
1x DDR3L-1600 memory down 2-4GB
2x DDR3L-1333 SODIMM up to 2x4GB
2x DDR3L-1333 ECC memory down up
to 4GB or 2x DDR3L-1333 memory
down up to 8GB
Graphics Controller
Intel® HD5000 (GT3), Intel® HD4400
(GT2), Intel® HD Graphics (GT1)
Intel® HD Graphics (Gen7)
Intel® HD Graphics (Gen7)
Ethernet Controller
Intel® I218LM
COMe-cBTc6 Intel® I211AT
COMe-cBTi6 Intel® I210IT
USB SMSC LAN7500i,
PCIe Intel® I210IT optional
Ethernet
10/100/1000 MBit Ethernet
10/100/1000 MBit Ethernet
10/100/1000 MBit Ethernet
Hard Disk
4x SATA 6Gb/s
2x SATA 3Gb/s
2x SATA 3Gb/s
Flash Onboard
-
on E3800 CPU only:
2 - 64GB eMMC, 1x microSD Socket
2 - 64GB eMMC, 1x microSD Socket
PCI Express® / PCI support
4x PCIe Gen 2.0
3x PCIe x1
4x PCIe Gen 2.0
Panel signal
DDI1: DP++, DDI2: DP++, DDI3: -,
VGA: -, LVDS: Dual Channel 18/24bit
DDI1: DP++, DDI2: DP++ (shared w/
LVDS), DDI3: -, VGA: Yes, LVDS: Dual
Channel 18/24bit
DDI1: DP++, DDI2: DP++ (shared w/
LVDS), DDI3: -, VGA: Yes, LVDS: Dual
Channel 18/24bit
USB
2x USB 3.0, 6x USB 2.0
1x USB 3.0 (incl. USB 2.0), 3x
USB 2.0 from CPU, on COMe-cBTi6
Version only: 4x USB 2.0 from HSIC
Hub
1x USB 3.0 (incl. USB 2.0), 2x USB
2.0 from CPU, 4x USB 2.0 from HSIC
Hub, 1x USB OTG
Serial
2x serial interface (RX/TX only)
2x serial interface (RX/TX only)
2x serial interface (RX/TX only)
Audio
Intel® High Definition Audio
Intel® High Definition Audio
Intel® High Definition Audio
Common Features
SPI, LPC, SMB, Fast I²C, Staged
Watchdog, RTC, MARS
SPI, LPC, SMB, Fast I²C, Staged
Watchdog, RTC, MARS
SPI, LPC, SMB, Fast I²C, Staged
Watchdog, RTC, MARS
BIOS
Phoenix Secure Core UEFI
Phoenix Secure Core UEFI
Phoenix Secure Core UEFI
Options
1x PCIe x2 additional w/o onboard
LAN, eDP instead of LVDS, vPRO
(AMT/TXT/AES Support)
1x PCIe x1 additional w/o onboard
LAN, Trusted Platform Module TPM
1.2, on E38xx CPU only: eMMC Flash
onboard (2-32GB SLC, 4-64GB MLC),
AES-NI
ECC or non-ECC memory, eMMC Flash
onboard (2-32GB SLC, 4-64GB MLC),
microSD Socket, PCIe GBEthernet,
AES-NI
Power Management
ACPI 4.0, S5 Eco
ACPI, S5 Eco
ACPI, S5 Eco
Kontron Rapid Shut down Technology
Power Supply
8.5V – 20V Wide Range, Single
Supply Power
4.75V – 20V Wide Range, Single
Supply Power
4.75V – 20V Wide Range, Single
Supply Power
Special Features
POSCAP capacitors, Trusted Platfom
Module TPM 1.2, 4k Resolutions
POSCAP capacitors, LVDS/DP
Multiplexer
POSCAP capacitors, GPIO/SDIO
Switch, LVDS/DP Multiplexer, 2x
MIPI-CSI on PEG interface
Operating System
Windows® 8, Windows® 7, WE8S,
WES7, Linux, VxWorks
Windows® 8, Windows® 7, WE8S,
WES7, WEC7, Linux, VxWorks
Windows® 8, Windows® 7, WE8S,
WES7, WEC7, Linux, VxWorks
Temperature
Commercial temperature:
0°C to +60°C operating
Extended temperature:
-25°C to +75°C operating
Commercial temperature:
0°C to +60°C operating
Industrial temperature:
-40°C to +85°C operating
Industrial temperature:
-40°C to +85°C operating
26
COM Express®
compact
COMe-cTH6
COMe-cCT6
COMe-cOH#
Compliance
COM Express® compact,
Pin-out Type 6
COM Express® compact,
Pin-out Type 6
COM Express® compact,
Pin-out Type 2 & 6
Dimensions (H x W x D)
95 x 95 mm
95 x 95 mm
95 x 95 mm
CPU
AMD® R-Series APU R-460L, R-452L,
R-260H
Intel® Atom™ D2550, N2800, N2600
AMD® G-Series APU T56N, T40N,
T52R, T44R
Chipset
AMD™ FusionControllerHub A70M M3
Intel® NM10 Express Chipset
Type 2: AMD™ FCH A55E
Type 6: AMD™ FCH A50M
Main Memory
2x DDR3-1333 SO-DIMM up to 2x4GB
1x DDR3-1066 SO-DIMM up to 4GB
2x DDR3-1066 up to 2x4GB
Graphics Controller
AMD Radeon™HD7620G (R-460L),
AMD Radeon™HD7600G (R-452L),
AMD Radeon™HD7500G (R-260H)
Intel® GMA 3650 (D2550, N2800),
Intel® GMA 3600 (N2600)
AMD Radeon™HD6310 (T56N, T52R)
AMD Radeon™HD6250 (T40N, T44R)
Ethernet Controller
Intel® I210-AT
Intel® 82574L
Intel® 82574L
Ethernet
10/100/1000 MBit Ethernet
10/100/1000 Mbit Ethernet
10/100/1000 MBit Ethernet
Hard Disk
4x SATA 6Gb/s
2x SATA 3Gb/s
4x SATA 3Gb/s
1x PATA (Marvel 88SA8052) on Type 2
-
Flash Onboard
-
2 - 64GB SATA NANDrive
PCI Express® / PCI support
1x PEG x8, 7x PCIe x1
3x PCIe x1
6x PCIe x1, 1x PCI (Type 2 only)
Panel signal
DDI1: DP++, DDI2: DP++ shared with
LVDS, DDI3: DP++ shared with VGA,
VGA: Yes, LVDS: Dual Channel
18/24bit
DDI1: DP++, DDI2: DP++, DDI3:-,
VGA: Yes,
LVDS: Dual Channel 18/24bit
DDi1: DP++, DDI2: DP++ shared with
LVDS, DDI3: -, VGA: yes,
LVDS: Dual Channel 18/24bit (Type 2),
LVDS: Single Channel 18bit (Type 6)
USB
4x USB 2.0
4x USB 3.0
8x USB 2.0,
2x USB 3.0 optional (TI TUSB7320)
Type 2: 8x USB 2.0
Type 6: 6x USB 2.0 + 2x USB 3.0
(Renesas PD720200A)
Serial
2x serial interface (RX/TX only)
2x serial interface (RX/TX only)
optional
2x serial interface (RX/TX only)
on Type 6
Audio
High Definition Audio
Intel® High Definition Audio
High Definition Audio
Common Features
SPI, LPC, SMB, Fast I²C, Staged
Watchdog, RTC, MARS
SPI, LPC, SMB, Fast I²C, Staged
Watchdog, RTC, MARS
SPI, LPC, SMB, Fast I²C, Watchdog,
RTC, MARS
BIOS
AMI Aptio UEFI
AMI APTIO (UEFI)
AMI APTIO (UEFI)
Options
-
1x PCIe x1 additional w/o onboard
LAN, 2x USB 3.0 (TI TUSB7320),
Trusted Platfom Module TPM 1.2
2x UART, SATA Flash (2-32GB SLC,
4-64GB MLC), Secure Boot
-
Power Management
ACPI 4.0, S5 Eco
ACPI 3.0, S5 Eco
ACPI 3.0, S5 Eco
Power Supply
4.75V – 20V Wide Range,
Single Supply Power
4.75V – 20V Wide Range,
Single Supply Power
4.75V – 18V Wide Range,
Single Supply Power
Special Features
POSCAP capacitors, Trusted Platfom
Module TPM 1.2
POSCAP capacitors
POSCAP capacitors
Operating System
Windows® 8, Windows® 7, WES7,
Linux
Windows® 7, WES7, WEC7, Windows®
XP, Linux, VxWorks
Windows® 8, Windows® 7, WES7,
WEC7, WinXP, XPe, Linux
Temperature
Commercial temperature:
0°C to +60°C operating
Commercial temperature:
0°C to +60°C operating
Extended temperature:
-25°C to +75°C operating
Industrial temperature:
-40°C to +85°C operating
Commercial temperature:
0°C to +60°C operating
www.kontron.com
» COM Express® mini «
COM Express® mini
COMe-mBTi10
COMe-mBTc10
COMe-mCT10
Compliance
COM Express® mini, Pin-out Type 10
COM Express® mini, Pin-out Type 10
COM Express® mini, Pin-out Type 10
Dimensions (H x W x D)
84 x 55 mm
84 x 55 mm
84 x 55 mm
CPU
Intel® Atom™ E3845, E3827, E3826,
E3825, E3815
Intel® Atom™ E3815
Intel® Celeron® J1900, N2920,
N2930, N2807
Intel® Atom™ D2550, N2800, N2600
Chipset
-
-
Intel® NM10 Express Chipset
Main Memory
Up to 8GB DDR3L-1333 memory
down (ECC optional)
Up to 8GB DDR3L-1333/1066
memory down (E3815ECC optional)
Up to 2GB DDR3-1066 memory down
Graphics Controller
Intel® HD Graphics (Gen7)
Intel® HD Graphics (Gen7)
Intel® GMA 3650 (D2550, N2800),
Intel® GMA 3600 (N2600)
Ethernet Controller
Intel® I210IT
Intel® I211AT
Intel® 82574L
Ethernet
10/100/1000 MBit Ethernet
10/100/1000 MBit Ethernet
10/100/1000 Mbit LAN
Hard Disk
2x SATA 3Gb/s
2x SATA 3Gb/s
2x SATA 3Gb/s
Flash Onboard
2 - 64GB eMMC
E3815 only: 2 - 64GB eMMC
2-64 GB SATA NANDrive
PCI Express® / PCI support
3x PCIe x1
3x PCIe x1
3x PCIe x1
Panel signal
DDI: DP++, LVDS: Single Channel
18/24bit or eDP
DDI: DP++, LVDS: Single Channel
18/24bit or eDP
DDI: DP++, LVDS: Single Channel
18/24bit
USB
1x USB 3.0 (incl. USB 2.0), 3x USB
2.0 from CPU, 4x USB 2.0 from
HSIC Hub
1x USB 3.0 (incl. USB 2.0), 3x USB
2.0 from CPU
8x USB 2.0
Serial
2x serial interface (RX/TX only)
2x serial interface (RX/TX only)
2x serial interface (RX/TX only) opt.
Audio
Intel® High Definition Audio
Intel® High Definition Audio
Intel® High Definition Audio
Common Features
SPI, LPC, SMB, Fast I²C, Staged
Watchdog, RTC, MARS
SPI, LPC, SMB, Fast I²C, Staged
Watchdog, RTC, MARS
SPI, LPC, SMB, Fast I²C, Staged
Watchdog, RTC, MARS
BIOS
Phoenix Secure Core UEFI
Phoenix Secure Core UEFI
AMI Aptio (UEFI)
Options
1x PCIe x1 additional w/o onboard LAN,
Trusted Platform Module TPM 1.2, ECC
memory, eMMC Flash onboard (2-32GB
SLC, 4-64GB MLC), eDP instead of LVDS,
General Purpose SPI instead of Boot
SPI, AES-NI
1x PCIe x1 additional w/o onboard
LAN, Trusted Platform Module TPM
1.2, ECC memory, E3815 variant
only: eMMC Flash onboard (2-32GB
SLC, 4-64GB MLC), eDP instead of
LVDS, General Purpose SPI instead
of Boot SPI, AES-NI
1x PCIe x1 additional w/o onboard
LAN, Trusted Platfom Module TPM
1.2, 2x UART, SATA Flash (2-32GB
SLC, 4-64GB MLC), Secure Boot
Power Management
ACPI, S5 Eco
ACPI, S5 Eco
ACPI 3.0, S5 Eco
Power Supply
4.75V – 20V Wide Range, Single
Supply Power
4.75V – 20V Wide Range, Single
Supply Power
4.75V – 20V Wide Range, Single
Supply Power
Special Features
POSCAP capacitors, GPIO/SDIO
Switch, General Purpose SPI optional
POSCAP capacitors, GPIO/SDIO
Switch, General Purpose SPI optional
POSCAP capacitors
Operating System
Windows® 8, Windows® 7, WE8S,
WES7, WEC7, Linux, VxWorks
Windows® 8, Windows® 7, WE8S,
WES7, WEC7, Linux, VxWorks
Windows® 7, WEC7, WES 7, Windows®
XP, Linux, VxWorks
Temperature
Industrial temperature:
-40°C to +85°C operating
Commercial temperature:
0°C to +60°C operating
Commercial temperature:
0°C to +60°C operating
Extended temperature:
-25°C to +75°C operating
Industrial temperature:
-40°C to +85°C operating
28
» COM Express® QorIQ «
COM Express® QorIQ™
COMe-cP2020
COMe-bP5020
Compliance
COM Express® compact, Pin-out Type 6"
COM Express® basic, Pin-out Type
Dimensions (H x W x D)
95 x 95 mm
95 x 125 mm
CPU
Freescale™ QorIQ™ P2020 e500 Power Architecture®
Freescale™ QorIQ™ P5020 (P5010) e5500 Power Architecture®
Main Memory
Up to 4GB DDR3-667 72-bit
Up to 8GB DDR3-1333 MHz ECC
SerDes
4x SerDes up to 3.125 Gbps multiplexed across controllers
can be configured as: PCI Express®, sRIO, GbE; Example:
1x PCIe x4
2x PCIe x1 + 1PCIe x2 2.5 Gbps
1x PCIe x2 + 2x 1GbE SGMII
2x SRIO x1 2.5Gbps + 2x GbE SGMII
2x SRIO x1 3.125 Gbps
1x SRIO x4 with 1.25/2.5 or 3.125 Gbps
18x SerDes lanes configurable; pre-selected standard
configurations:
2x PCIe x4 + 4x 1 GbE SGMII + 1x SATA
2x PCIe x4 + 4x 1 GbE SGMII + 1x XAUI
2x PCIe x4 + 1x XAUI + 1x SATA
2x sRIO x4 + 4x 1 GbE SGMII + 1x SATA
Ethernet
3x 10/100/1000 Base-T, 2x IEEE 1588 control
1x 10/100/1000 Base-T, 2x IEEE 1588 control, see SerDes
Hard Disk
MicroSD card slot / bootable
MicroSD card slot/ bootable,
2x SATA multiplexed with SerDes
Flash Disk
64kbit I²C EEPROM, up to 2GB NAND Flash + 2MB NOR
Flash. 2nd 2MB SPI NOR Flash for boot recovery purposes,
512kB MRAM
64kbit I²C EEPROM, up to 2GB NAND Flash + 2MB NOR
Flash, 2nd 2MB SPI NOR Flash for boot recovery purposes
512kB MRAM
PCI Express® / PCI support
see SERDES
see SERDES
USB
4x USB 2.0
5x USB 2.0 (one channel device capable)
Serial
2x UART, Serial Rapid I/O see SerDes
4x UART (2x FourWire/ 4x TX/RX),
Serial Rapid I/O see SerDes
Operating System
Linux; Wind River VxWorks 6.9.2
Linux; Wind River VxWorks 6.9.2
Temperature
c-version 0° to +60,
i-version -40°C to +70°C
0 °C to 60 °C
Bus type
Processor Local Bus
Processor Local Bus
Cache
32 KB L1 instruction cache and 32 KB L1 data cache for
each core, 512 KB L2 cache with ECC
32 KB L1 instruction cache and 32 KB L1 data cache for
each core, 512 KB L2 cache with ECC, 2MB L3 cache shared
CPU Clock
2x 1.2 GHz commercial temp.,
2x 1.0 GHz industrial temp.
2x 2.0 GHz (P5010 2x 1.6 GHz)
Interface
2x GPIO (exclusive with SDHC usage), 2x I²C, 1x SDHC,
1x MDIO (IEEE 802.3 clause 22), SPI, 5x IRQ; 1x IRQ OUT,
16 bit eLBC (2 Devices), JTAG debug
12x GPIO, 1x I²C, 1x SDHC, 2x MDIO (IEEE 802.3 clause
22), SPI, 5x IRQ, JTAG debug, Aurora debug
Power Consumption
est. 12W/12V
est. 30W/12V
Watchdog
Yes
Yes
Real Time Clock
Yes
-
www.kontron.com
» ETX® «
ETX®
ETX®-OH
ETX®-LX
Compliance
ETX® 3.0 compliant
ETX® 3.0 compliant
Dimensions (H x W x D)
95 x 114 mm
95 x 114 x 10 mm (3.7 x 4.5 x 0.4")
CPU
AMD G-Series T56E, T56N, T40E, T52R, T40R, T16R
AMD® Geode™ LX800 processor 500MHz,
with integrated graphic
Chipset
AMD Fusion Controller Hub (FCH) A55E
AMD® Geode™ CS5536 Companion Device
Main Memory
Up to 4 GB DDR3-1066/1333 SO-DIMM
Up to 1 GB DDR-RAM (266/333/400 MHz)
Graphics Controller
Integrated Radeon HD6320 / HD 6310 / HD 6250,
(DirectX® 11, PS 5.0, OpenGL 4.1, OpenCL 1.1),
ATI Avivo HD with H.264, VC-1, Blue-ray Support
Integrated in AMD® Geode™ LX800
Graphics Memory
-
Up to 254 MB UMA
Ethernet
10/100 MBit Ethernet, Broadcom BCM54610
10/100 MBit Ethernet, Intel® 82551ER
Hard Disk
2x SerialATA (AHCI), 2x PATA (via PCIe bridge),
optional 2-64 GB SATA SSD
2x Serial ATA (RAID 0, 1), 1x PATA 100
USB
4x USB 2.0, optional 2x miniUSB 2.0 onbaord
4x USB 2.0
Serial
2x Serial COM ports
-
Audio Controller
HDAudio Codec Realtek ALC886GR
ALC203 AC'97 controller, line-input / output and
microphone
Power Management
AMD PowerNow!
-
Special Features
DisplayPort:via onboard FlatFoil or optional DP connector
Security Feature:TPM SLB9635TT1.2 optional
-
Operating System
Windows 7, Windows Vista®, Windows® XP, Windows® XP
Embedded, WES 7, Linux and others
Windows® XP, Windows® XP Embedded, Windows® CE,
Linux and others
Temperature
Commercial temperature:
0°C to +60°C operating
Extended temperature:
-25°C to +75°C operating
Operation: 0°C to +60°C
*Ask about extended temperature ranges
Cache
-
128 KB L2 Cache
CompactFlash
-
1 x CompactFlash™ socket on board
Parallel Port
Parallel / Floppy port shared with LPT
Parallel / Floppy port shared with LPT
ISA
ISA Bus (ETX® 3.0 compliant)
-
PCI
PCI 2.3, 32 bit / 33 MHz
-
Power Consumption
Typ. Idle ~ 10.5 W
Typ. Idle 6,5 W @ 500 MHz, 5V
Resolution
Resolution CRT: 2560x1600
Resolution LCD: 1920x1200
CRT: max. WUXGA (1920 x 1440)
LVDS: max. UXGA (1600 x 1200)
30
» SMARC «
SMARC Smart Mobility
Architecture
(82 x 50 mm)
5°C
–40°C to +8
5°C
–40°C to +8
5°C
–40°C to +8
SMARC-sXBTi
SMARC-sAMX6i
SMARC-sA3874i
SMARC-sAT30
Compliance
SMARC - Smart Mobile
Architecture by SGET small size
SMARC - Smart Mobile
Architecture by SGET small size
SMARC - Smart Mobile
Architecture by SGET small size
SMARC - Smart Mobile
Architecture by SGET small size
Dimensions (H x W x D)
82 x 50 mm
82 x 50 mm
82 x 50 mm
82 x 50 mm
CPU
Intel® Atom™ E3845, E3827,
E3826, E3825 or E3815
Freescale i.MX 6, Single, Dual
and Quad Core ARM Cortex-A9
Texas Instruments Sitara
AM3874 Cortex A8
NVIDIA Tegra 3, Quad Core
ARM Cortex A9
Main Memory
Up to 8GB DDR3L-1333
memory down (ECC optional)
Up to 2GB DDR3 memory down
Up to 2GB DDR3 memory down
On Board up to 2GB DDR3
Graphics Controller
Intel® HD Graphics (Gen7)
Dual Displayz
HD 1080p Decode/Encode,
2D/3D acceleration
HD 1080p Decode/Encode
2D/3D acceleration
Dual Displays
Ethernet Controller
Intel® i210IT
Integrated
Integrated
Integrated
Ethernet
10/100/1000 MBit Ethernet
10/100/1000 MBit Ethernet
10/100/1000 MBit Ethernet
10/100/1000 Mbit/sec
SATA
1x SATA 3Gb/s
1x SATA (dual/quad core)-solo
1x SATA
1x SATA
Flash Onboard
2-64GB eMMC
2-64GB eMMC
Up to 32GB NAND FLASH
build option
2-64GB eMMC
PCI Express® /
PCI support
3x PCIe x1
3x PCIe x1
1x PCI Express® x1 Lanes
x1 PCIe Gen 1
Panel signal
LVDS Single Channel 18/24
bit or eDP
HDMI or DP
Parallel LCD 18/24 bit
LVDS Single Channel 18/24bit
HDMI
Single Channel 18bit,24bit
(18bit compatible) LVDS
HDMI
LVDS Single Channel 18 bit
/ 24 bit - 18 bit compatible.
Support for dual channel 24
bit LVDS, HDMI
USB
3x USB 2.0 1x USB 3.0
(via AFB)
3x USB 2.0 (one OTG)
2x USB 2.0, USB OTG
3x USB 2.0 ports (one OTG)
Serial
1x RX/TX (Ser0) 2x UART
(Ser1/3)
2x RX/TX (Ser1/3)
2x UART (Ser0/2)
2x RX/TX (Ser1/3)
2x UART (Ser0/2)
2x RX/TX (Ser1/3)
2x UART (Ser0/2)
Interface
HD Audio and I2S, 5x I2C, 2x
SPI, Camera Interface
(2x MIPI CSI)
12x GPIO, SDIO, 5x I²C, 2x I²S,
2x SPI, SPDIF, WDT, 2x CAN
Camera Interface (PCAM, CSI)
GPIO, 4x I²C, 4x I²S, 2x CAN,
2x SPI, Camera input 10bit
parallel interface
1x SDIO, 1x eMMC, 2x SPI, 5x
I2C, 3x I2S, 12x GPIO, SPDIF,
WDT
Operating System
Windows® 8, Windows® 7,
WE8S, WES7, WEC7, Linux,
VxWorks
Linux, Android, WEC7
Windows CE6, WES7, Linux,
Android
Android ICS, Linux
Power Supply
3V - 5.25V Operates directly
from single level Lithium Ion
cells or fixed 3.3V or 5V power
supplies
3V - 5.25V Operates directly
from single level Lithium Ion
cells or fixed 3.3V or 5V power
supplies
3V - 5.25V Operates directly
from single level Lithium Ion
cells or fixed 3.3V or 5V power
supplies
3V to 5.25V - operates directly
from single level Lithium
Ion cells, or fixed 3.3V or 5V
power supplies
Power Consumption
tbd
Typ. 5W
Typ. 2 W
5 Watts typical
Power Management
-
Battery and System
Management
-
-
Temperature
-40°C to +85°C operating
Operation: -40° to 85°C
Operation: -40° to 85°C
0°C to 70°C
www.kontron.com
Kontron is a global leader in embedded computing technology. With more than 40 % of its employees in research and development, Kontron creates many of the standards that drive the
world’s embedded computing platforms. Kontron’s product longevity, local engineering and support, and value-added services, helps create a sustainable and viable embedded solution for
OEMs and system integrators.
Kontron works closely with its customers on their embedded application-ready platforms and
custom solutions, enabling them to focus on their core competencies. The result is an accelerated time-to-market, reduced total-cost-of-ownership and an improved overall application with
leading-edge, highly-reliable embedded technology.
Kontron is listed on the German TecDAX stock exchanges under the symbol “KBC”. For more information, please visit: www.kontron.com
CORPORATE OFFICES
Europe, Middle East & Africa
North America
Asia Pacific
Oskar-von-Miller-Str. 1
85386 Eching / Munich
Germany
14118 Stowe Drive
Poway, CA 92064-7147
USA
17 Building,Block #1, ABP.
188 Southern West 4th Ring Road
Beijing 100070, P.R.China
Tel.: + 49 (0) 8165 / 77 777
Fax: + 49 (0) 8165 / 77 219
[email protected]
Tel.: + 1 888 294 4558
Fax: + 1 858 677 0898
[email protected]
Tel.: + 86 10 63751188
Fax: + 86 10 83682438
[email protected]
Copyright © 2012 Kontron AG. All rights reserved. All data is for information purposes only and not guaranteed for legal purposes. Information has been carefully checked and is be-lieved to be accurate;
however, no responsibility is assumed for inaccuracies. Kontron and the Kontron logo and all other trademarks or registered trademarks are the property of their respective owners and are recognized.
Specifications are subject to change without notice. Embedded Boards-20140521-WMH
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