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Product Specification for SDWF-13B
SDWF-13B
Product Specification
IEEE 802.11b/g/n Mini 2.4G 2T2R USB WiFi Module
Realtek RTL8192EU 11n 2T2R WIFI Module
深圳市瑞科慧联科技有限公司
Shenzhen Rakwireless Technology Co., Ltd
深圳市南山区科技园北区清华信息港综合楼406室 ,518057
Room 406, R&D Building of Tsinghua Hi-Tech Park, Shenzhen, 518057,China
TEL:+755-26506594 FAX:+755-86152201
Email: info@rakwireless.com
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Product Specification for SDWF-13B
CONTENT
0. REVESION HISTORY……………………………………………………….3
0.1 MODEL NO DIFINITION.……………………………………………….3
1. INTRODUCTION……………………………………………………………..4
1.1 OVERVEIW……………………………………………………………….4
1.2 SPECIFICATION REFERENCE…………………………………….…4
1.3 SYSTEM CHARACTERISTICS………………………………………...5
2. MECHANICAL SPECIFICATION…………………………………………..6
2.1 OUTLINE DRAWING……………………………………………………6
2.2 PIN DEFENITION….........................……………………………………7
2.3 LAYOUT REFERENCE..…………………………………………………8
3. Electric Current……………………….………..……………..………………8
4. PACKAGE…………………………………………………………..………...9
5. USER’S MANUAL…………………………………………………...……….10
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Product Specification for SDWF-13B
0. Revision History
REV NO
Rev1.0
Date
2014-03-13
Rev1.1
2015-01-28
Modifications
First version
Update the pin number
Approved
SYMEN SONG
William Tan
Draft
SJ LI
Neal Yu
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Product Specification for SDWF-13B
1. Introduction
SDWF-13B is a highly integrated and excellent performance Wireless LAN (WLAN) USB network interface device. High-speed wireless connection up to 300 Mbps.
1.1 Overview
The general hardware for the module is shown in Figure 1. This WLAN Module design is based on Realtek RTL8192EU. It is a highly integrated single-chip 2*2 MIMO (Multiple In Multiple Out)
Wireless LAN (WLAN) USB network interface controller complying with the 802.11n
specification. It can work in two modes: Infrastructure and Ad-Hoc It combines a MAC, a 2T2R capable baseband, and RF in a single chip. It is designed to provide excellent performance with low power Consumption and enhance the advantages of robust system and cost-effective.
1.2 SPECIFICATION REFERENCE
This specification is based on additional references listed as below.
iEEE 802.11b
iEEE 802.11g
iEEE 802.11n
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Product Specification for SDWF-13B
1.3 System Characteristics
Main Chipset
Operating voltage
Host Interface
Realtek RTL8192EU
3.3V(3.0-3.5V)
USB 2.0
Operating channel 2.4G: 1-13
Operating Frequency 2.4G: 2.405~2.485GHz
WIFI Standard IEEE 802.11b/g/n 、IEEE 802.11e(WMM)、IEEE 802.11i(WPA,WPA2)、
IEEE 802.11hTPC 、IEEE 802.11k、WAPI
Modulation
11 n: MCS
11 g: OFDM
11b: CCK(11, 5.5Mbps), QPSK(2Mbps), BPSK(1Mbps)
PHY Data rates
11n:6.5~72.2Mbps(20MHzBandwidth),13~300Mbps(40MHzBandwidth)
11g: 54,48,36,24,18,12,9,6 Mbps
11b: 11,5.5,2,1 Mbps
802.11b@11Mbps 16±2dBm
Transmit Output
Power
802.11g@54Mbps 14±2dBm
802.11n@65Mbps 13±2dBm (MCS 0_HT20)
13±2dBm (MCS 7_HT20)
13±2dBm (MCS 0_HT40)
13±2dBm (MCS 7_HT40
)
Receiver Sensitivity 300 Mbps:-65dBm@10% PER;
Operation Range
130 Mbps:-70dBm@10% PER;
108 Mbps:-70dBm@10% PER;
54 Mbps:-70dBm@10% PER;
11 Mbps:-87dBm@8% PER;
6 Mbps:-90dBm@10% PER;
1 Mbps:-92dBm@8% PER
Up to 100meters in open space
RF Power
RF Antenna
<14dBm@11n,<18dBm@11b,<15dBm@11g
External Antenna (2.4GHz 50Ohm Resistance)
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OS Support
Security
Operating
Temperature
Product Specification for SDWF-13B
Android/ Win 8 /Win 7 /Vista/ Linux/ Win CE /Windows XP
WEP,TKIP,AES,WPA,WPA2
-20~ +50°C Ambient Temperature
Storage Temperature -40~ +70°C Ambient Temperature
Operating Temperature 10% to 90%maximum (non-condensing)
Humidity
Storage Temperature 5% to 90%maximum (non-condensing)
Dimension Typical 12.90X12.19X1.4mm
2. Mechanical Specification
2.1 Outline Drawing(Unit: ±0.15mm)
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2.2 Pin Definition
Product Specification for SDWF-13B
Pin #
1
2
3
4~5
6
7
8
9~14
Name
VCC
U-
U+
GND
RFB
RFA
CLK
NC
Description
Power Supply Voltage (3.0-3.5V)
USB DATA PIN (USB DM)
USB DATA PIN (USB DP)
GROUND
RFB OUTPUT/INPUT
RFA OUTPUT/INPUT
EXTERNAL 40MHz CRYSTAL(HOLD)
NO CONNECTED
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2.3 Layout reference(Unit:mm)
Product Specification for SDWF-13B
3. Electric Current
Test Environment:Win XP SP3、Voltage:3.3V
ITEMS
WLAN module not connecting with AP
2.4G Current (mA)
129
WLAN module connecting with AP
Disable WLAN module
WLAN RF OFF
Tx (n mode 40MHz MCS15)
Rx (n mode 40MHz MCS15)
Tx (n mode 40MHz MCS7)
802.11g mode
Tx (OFDM 54M)
Rx (OFDM 54M)
802.11b mode
Tx
Rx
150
0.8
19
340
220
83
245
195
270
185
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4. Package
4.1 blister packaging
Product Specification for SDWF-13B
A piece of 100 PCS
4.2 the take-up package
A roll of 2000pcs
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5. User’s Manual
5.1 Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : ≤2 times
Product Specification for SDWF-13B
5.2 Patch WIFI modules installed before the notice:
WIFI module installed note:
1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil
2. Take and use the WIFI module, please insure the electrostatic protective measures.
3. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 ℃ for the MID motherboard.
About the module packaging, storage and use of matters needing attention are as follows:
1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: temperature in: < 40 ℃, relative humidity: < 90% r.h.
2. The module vacuum packing once opened, time limit of the assembly:
Card: 1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption.
2.) factory environmental temperature humidity control: ≦ 30% ℃, ≦ 60% r.h..
3). Once opened, the workshop the preservation of life for 168 hours.
3. Once opened, such as when not used up within 168 hours:
1). The module must be again to remove the module moisture absorption.
2). The baking temperature: 125 ℃, 8 hours.
3.) after baking, put the right amount of desiccant to seal packages.
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