NXQ8006 Sapphire
NXQ8006
Sapphire
With the increased demand for LED processing on compound semiconductor substrates up to 6”,
Neutronix Quintel has developed the NXQ8006 Sapphire Mask Alignment System that is
dedicated for optimal performance in this sector. With a lower price point than the NXQ8008 as
well as an industry leading throughput of over 200 wafers per hour in First Mask Mode and over
140 wafers per hour with auto alignment, the NXQ8006 Sapphire is one of the highest Return on
Investment (ROI) mask aligners available in the marketplace. The Sapphire Optics feature a 6”
Full Field broadband intensity of over 40 mw per square cm with a 350W Lamp, and an improved
collimation angle as well as dual integration for enhanced proximity printing and light uniformity
under +/-3% for excellent CD control. With a fourth software configurable cassette I/O added, the
tool can run up to 100 wafers without interruption.
HB LED
LED
NXQ8006 Sapphire HIGH VOLUME PRODUCTION MASK ALIGNER
685A Jarvis Drive, Morgan Hill, CA 95037 • Ph: (408) 776-5190 • Fax: (408) 776-1039 • www.neutronixinc.com
NXQ8006 Sapphire PRODUCTION MASK ALIGNER
The NXQ8000 Sapphire Integrates the latest in Robotic Automation with a state of the art next
generation design from Milara Corporation. The Dual Arm Robot not only delivers lightning fast
wafer transfer at twice the accuracy of competitors, but incorporates the latest motion control
expertise from Logisol. A 32 bit real time kernal delivers fast and accurate motion profiling along
smooth and continuous trajectories. With a rigid structural backbone milled from a single billet of
aluminium and maintenance free brushless servo motors, the Milara Robot has a MTBF of an
incredible 60,000 Hours! Teamed with the Logisol Prealigner that is accurate to within +/-25
microns and is perfect for compound semiconductor applications since it can detect opaque, semi
transparent and transparent wafers, it is a wafer transfer system combination that is hard to beat.
Standard Features
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Wafer sizes from 2” to 6” diameter
State if the art dual arm robot from Milara Corporation
Logisol Pre-Aligner – detects opaque, semi transparent and transparent wafers
Four software configurable cassette I/O stations
Windows based menu driven Graphical User Interface
Modular Lamp house design allowing easy conversion from Broadband and NUV to DUV
Fully Motorized X-Y-θ Alignment. Controlled with Joystick or Computer
Motorized top and bottom microscopes with recipe stored microscope positions
Fiberoptic thru objective illumination with recipe stored intensity settings
Easy manual tray-load for loading wafers or pieces
Multiple contact and proximity exposure modes
Precise control of contact force during WEC – Ideal for fragile substrates
Chamber Purge Feature – Recipe driven electronic controlled regulator for purge gas in
mask / wafer chamber.
VideoView Splitfield/ Singlefield Microscope with Quadcam – Two high resolution CCD
cameras per objective, switch between Wide View and High Magnification without
refocusing! Customer can select magnification range to meet specific needs.
Large Gap Alignment and Pulsed Exposure Timer Sequencing Software Included
Simple topside mask loading
UltraSense constant power or constant intensity UV power supply with dual channel
feedback loop
Choice of UV exposure power supply – 350/500 Watt or 500/1KW
Enhanced Printing Optics utilizing dual integration and collimation for excellent printing
resolution and CD
Active Shock Isolation table and Active Isolation from Robot Section
Very Low maintenance – Z Axis air bearing guide set and air bearing frictionless ball seat
for WEC
Q-Vision Automatic Alignment Vision Recognition Software
o Excellent Contrast on Textured and Transparent wafers allowing the most difficult
alignment mark recognition
Align for Speed or Accuracy, recipe configurable
Smart Align Technology - Final alignment verification confirmed at print gap with software
algorithms that recognize and adjust for alignment mark trends between align gap and
print gap
Optional Features
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Production Enclosure
Automated mask changing
Integrated bar code reader and SECS / GEM Software
Optical Backside Alignment and Backside Infrared (IR)
Fiberoptic Ring Illumination for oblique and dark field illumination
Matrox Geometric Model Finder (synthetic pattern generation) Optional
NUV (280-350nm) / MUV (280-450) / DUV (220-280nm) exposure optics
500 Watt / 1KW Constant Power / Constant Intensity power supply
Edge Handling Robot, Pre-Aligner and alignment stage
685A Jarvis Drive, Morgan Hill, CA 95037 • Ph: (408) 776-5190 • Fax: (408) 776-1039 • www.neutronixinc.com
Technical Data
Exposure Modes
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Soft, Pressure, Vacuum Contact and Proximity Printing Modes
Print Resolution
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Proximity
3um at 20um gap
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Soft Contact
2um
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Hard Contact
1um
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Vacuum Contact
0.5um
o Note: Achievable resolution depends on many process conditions including
wafer flatness, resist type and therefore might vary according to actual process.
Cycle Time and Alignment Accuracy (1 sec exposure) with Dual Arm Robot
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First Mask Mode
200+ wph
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TSA Auto Alignment Mode (Contact)
140+ wph: +/- 0.5um 3 sigma
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TSA Auto Alignment Mode (Proximity)
140+ wph: +/- 0.5um 3 sigma
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BSA Auto Alignment Mode (Contact)
120+ wph: +/-0.75um 3 sigma
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BSA Auto Alignment Mode (Proximity)
120+ wph: +/- 0.75um 3 sigma
Substrate Size
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Round
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Diameter Square
2” to 6” up to 10mm thick
2” to 4” up to 10mm thick
Mask Size
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2.5” X 2.5” up to 7” X 7”
Alignment Stage
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Alignment Travel X-Y and Theta Motorized with automatic re-centering
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X-Y Movement
+/- 4mm, 100nm resolution
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Theta Rotation Range
+/- 7.5 degrees, 4x10e-5 resolution
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Mask/ Wafer separation
0 – 1000um with 1um resolution
Video View Microscope Travel Range
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Left Microscope Travel X
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Right Microscope Travel X
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R/L Microscope Tavel in Y
-12.5 to -87.5mm
+12.5 to + 87.5mm
+/- 12.7mm
Top Side Microscopes
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Quadcam – 2 CCD Cameras per objective
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5x Objectives Standard, 2x, 10x and 20x optional
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Two high resolution CCD cameras per objective, switch between Wide View and High
Magnification without refocusing! Customer can select magnification range to meet specific
needs.
Specifications depend on individual process conditions and can vary. Not all specification may be valid simultaneously.
685A Jarvis Drive, Morgan Hill, CA 95037 • Ph: (408) 776-5190 • Fax: (408) 776-1039 • www.neutronixinc.com
NXQ8006 Sapphire PRODUCTION MASK ALIGNER
Electronics
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Programming & Control PC based.
Device Net Control System for pneumatics and sensors
Ethernet Motor Control
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UV Lamphouse
Standard Exposure Optics
Optional NUV
Optional MID UV
Optional DUV
UV Uniformity
6” Full Field Intensity (405nm probe)
350/500W or 500/1KW
Broadband (350-450 nm)
280-350nm
280-450nm
220-280nm
+/- 3%, 150mm
40 mw/cm2
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Voltage
Compressed Air
Vacuum
Nitrogen (or CDA)
110VAC/60Hz or 240VAC/50Hz
6.2 -7.6 bar (90-110 PSI)
-0.7 bar (21” Hg)
4.2 bar (60 PSI)
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WxDxH
Weight
~1622 x 1214x 1740mm (63.85” x 47.79”x 68.51”)
1700 lbs
UV Lamphouse/
UV Exposure Optics System Requirements
System/Module Data
685A Jarvis Drive, Morgan Hill, CA 95037 • Ph: (408) 776-5190 • Fax: (408) 776-1039 • www.neutronixinc.com
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