Model 7035 - Advanced Test Equipment Rentals

Model 7035 - Advanced Test Equipment Rentals
®
E stablished 1981
Advanced Test Equipment Rentals
www.atecorp.com 800-404-ATEC (2832)
Instruction Manual
Model 7035
9-Bank, 1×4 Multiplexer Card
Contains Operating and Servicing Information
7035-901-01 Rev. A / 5-97
WARRANTY
Keithley Instruments, Inc. warrants this product to be free from defects in material and workmanship for a period of 1 year from date of
shipment.
Keithley Instruments, Inc. warrants the following items for 90 days from the date of shipment: probes, cables, rechargeable batteries,
diskettes, and documentation.
During the warranty period, we will, at our option, either repair or replace any product that proves to be defective.
To exercise this warranty, write or call your local Keithley representative, or contact Keithley headquarters in Cleveland, Ohio. You will
be given prompt assistance and return instructions. Send the product, transportation prepaid, to the indicated service facility. Repairs
will be made and the product returned, transportation prepaid. Repaired or replaced products are warranted for the balance of the original warranty period, or at least 90 days.
LIMITATION OF WARRANTY
This warranty does not apply to defects resulting from product modification without Keithley’s express written consent, or misuse of
any product or part. This warranty also does not apply to fuses, software, non-rechargeable batteries, damage from battery leakage, or
problems arising from normal wear or failure to follow instructions.
THIS WARRANTY IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING ANY IMPLIED
WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR USE. THE REMEDIES PROVIDED HEREIN ARE
BUYER’S SOLE AND EXCLUSIVE REMEDIES.
NEITHER KEITHLEY INSTRUMENTS, INC. NOR ANY OF ITS EMPLOYEES SHALL BE LIABLE FOR ANY DIRECT, INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES ARISING OUT OF THE USE OF ITS INSTRUMENTS AND
SOFTWARE EVEN IF KEITHLEY INSTRUMENTS, INC., HAS BEEN ADVISED IN ADVANCE OF THE POSSIBILITY OF
SUCH DAMAGES. SUCH EXCLUDED DAMAGES SHALL INCLUDE, BUT ARE NOT LIMITED TO: COSTS OF REMOVAL
AND INSTALLATION, LOSSES SUSTAINED AS THE RESULT OF INJURY TO ANY PERSON, OR DAMAGE TO PROPERTY.
Keithley Instruments, Inc. • 28775 Aurora Road • Cleveland, OH 44139 • 216-248-0400 • Fax: 216-248-6168 • http://www.keithley.com
CHINA:
FRANCE:
GERMANY:
GREAT BRITAIN:
ITALY:
NETHERLANDS:
SWITZERLAND:
TAIWAN:
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Model 7035 9-Bank, 1×4 Multiplexer Card
Instruction Manual
©1997, Keithley Instruments, Inc.
All rights reserved.
Cleveland, Ohio, U.S.A.
First Printing, May 1997
Document Number: 7035-901-01 Rev. A
Manual Print History
The print history shown below lists the printing dates of all Revisions and Addenda created for this manual. The Revision
Level letter increases alphabetically as the manual undergoes subsequent updates. Addenda, which are released between Revisions, contain important change information that the user should incorporate immediately into the manual. Addenda are numbered sequentially. When a new Revision is created, all Addenda associated with the previous Revision of the manual are
incorporated into the new Revision of the manual. Each new Revision includes a revised copy of this print history page.
Many product updates and revisions do not require manual changes and, conversely, manual corrections may be done without
accompanying product changes. Therefore, it is recommended that you review the Manual Update History.
Revision A (Document Number 7035-901-01)......................................................................................... May 1997
All Keithley product names are trademarks or registered trademarks of Keithley Instruments, Inc.
Other brand and product names are trademarks or registered trademarks of their respective holders.
Safety Precautions
The following safety precautions should be observed before using
this product and any associated instrumentation. Although some instruments and accessories would normally be used with non-hazardous voltages, there are situations where hazardous conditions
may be present.
This product is intended for use by qualified personnel who recognize shock hazards and are familiar with the safety precautions required to avoid possible injury. Read the operating information
carefully before using the product.
The types of product users are:
Responsible body is the individual or group responsible for the use
and maintenance of equipment, and for ensuring that operators are
adequately trained.
Operators use the product for its intended function. They must be
trained in electrical safety procedures and proper use of the instrument. They must be protected from electric shock and contact with
hazardous live circuits.
Maintenance personnel perform routine procedures on the product
to keep it operating, for example, setting the line voltage or replacing consumable materials. Maintenance procedures are described in
the manual. The procedures explicitly state if the operator may perform them. Otherwise, they should be performed only by service
personnel.
Service personnel are trained to work on live circuits, and perform
safe installations and repairs of products. Only properly trained service personnel may perform installation and service procedures.
Exercise extreme caution when a shock hazard is present. Lethal
voltage may be present on cable connector jacks or test fixtures. The
American National Standards Institute (ANSI) states that a shock
hazard exists when voltage levels greater than 30V RMS, 42.4V
peak, or 60VDC are present. A good safety practice is to expect that hazardous voltage is present in any unknown circuit before measuring.
Users of this product must be protected from electric shock at all
times. The responsible body must ensure that users are prevented
access and/or insulated from every connection point. In some cases,
connections must be exposed to potential human contact. Product
users in these circumstances must be trained to protect themselves
from the risk of electric shock. If the circuit is capable of operating
at or above 1000 volts, no conductive part of the circuit may be
exposed.
As described in the International Electrotechnical Commission
(IEC) Standard IEC 664, digital multimeter measuring circuits
(e.g., Keithley Models 175A, 199, 2000, 2001, 2002, and 2010)
measuring circuits are Installation Category II. All other instruments’ signal terminals are Installation Category I and must not be
connected to mains.
Do not connect switching cards directly to unlimited power circuits.
They are intended to be used with impedance limited sources.
NEVER connect switching cards directly to AC mains. When connecting sources to switching cards, install protective devices to limit fault current and voltage to the card.
Before operating an instrument, make sure the line cord is connected to a properly grounded power receptacle. Inspect the connecting
cables, test leads, and jumpers for possible wear, cracks, or breaks
before each use.
For maximum safety, do not touch the product, test cables, or any
other instruments while power is applied to the circuit under test.
ALWAYS remove power from the entire test system and discharge
any capacitors before: connecting or disconnecting cables or jumpers, installing or removing switching cards, or making internal
changes, such as installing or removing jumpers.
Do not touch any object that could provide a current path to the
common side of the circuit under test or power line (earth) ground.
Always make measurements with dry hands while standing on a
dry, insulated surface capable of withstanding the voltage being
measured.
Do not exceed the maximum signal levels of the instruments and accessories, as defined in the specifications and operating information, and as shown on the instrument or test fixture panels, or
switching card.
When fuses are used in a product, replace with same type and rating
for continued protection against fire hazard.
Chassis connections must only be used as shield connections for
measuring circuits, NOT as safety earth ground connections.
If you are using a test fixture, keep the lid closed while power is applied to the device under test. Safe operation requires the use of a
lid interlock.
If a
screw is present, connect it to safety earth ground using the
wire recommended in the user documentation.
The ! symbol on an instrument indicates that the user should refer to the operating instructions located in the manual.
The
symbol on an instrument shows that it can source or measure 1000 volts or more, including the combined effect of normal
and common mode voltages. Use standard safety precautions to
avoid personal contact with these voltages.
The WARNING heading in a manual explains dangers that might
result in personal injury or death. Always read the associated information very carefully before performing the indicated procedure.
The CAUTION heading in a manual explains hazards that could
damage the instrument. Such damage may invalidate the warranty.
Instrumentation and accessories shall not be connected to humans.
Before performing any maintenance, disconnect the line cord and
all test cables.
To maintain protection from electric shock and fire, replacement
components in mains circuits, including the power transformer, test
leads, and input jacks, must be purchased from Keithley Instruments. Standard fuses, with applicable national safety approvals,
may be used if the rating and type are the same. Other components
that are not safety related may be purchased from other suppliers as
long as they are equivalent to the original component. (Note that selected parts should be purchased only through Keithley Instruments
to maintain accuracy and functionality of the product.) If you are
unsure about the applicability of a replacement component, call a
Keithley Instruments office for information.
To clean the instrument, use a damp cloth or mild, water based
cleaner. Clean the exterior of the instrument only. Do not apply
cleaner directly to the instrument or allow liquids to enter or spill
on the instrument.
MODEL 7035 SPECIFICATIONS
MULTIPLEX CONFIGURATION: Nine independent 1×4 2-pole
multiplex banks.
CONTACT CONFIGURATION: 2-pole Form A (Hi, Lo).
CONNECTOR TYPE: 96-pin male DIN connector.
MAXIMUM SIGNAL LEVEL: 60VDC, 30V rms, 42V peak betwen any
two inputs or chassis, 1A switched. 30VA (resistive load).
CONTACT LIFE: Cold Switching: 108 closures.
At Maximum Signal Levels: 105 closures.
CHANNEL RESISTANCE (per conductor): <1Ω.
CONTACT POTENTIAL: <1µV per channel contact pair
<3µV typical per single contact.
OFFSET CURRENT: <100pA.
ACTUATION TIME: 3ms.
ISOLATION:
Bank: >109Ω, <25 pF.
Channel to Channel: >109Ω, <50 pF.
Differential: >109Ω, <100pF.
Common Mode: >109Ω, <200pF.
CROSSTALK (1MHz, 50Ω Load): Bank: <–40dB.
Channel: <–40dB.
INSERTION LOSS (50Ω Source, 50 Load): <0.25dB below 1MHz,
<3dB below 10MHz.
RELAY DRIVE CURRENT (per relay): 16mA.
ENVIRONMENT: Operating: 0° to 50°C, up to 35°C <80% RH.
Storage: –25°C to 65°C.
EMC: Conforms with European Union Directive 89/336/EEC
EN 55011, EN 50082-1, EN 61000-3-2 and 61000-3-3, FCC part 15
class B.
SAFETY: Conforms with European Union Directive 73/23/EEC
EN 61010-1, UL 3111-1.
Bank A
HI
Channel 1
LO
Channels 2–3
HI
HI
Channel 4
LO
Output
LO
Bank I
HI
Channel 1
LO
Channels 2–3
HI
HI
Channel 4
LO
Specifications are subject to change without notice.
Output
LO
Table of Contents
1
General Information
Introduction .........................................................................................................................................................
Features ...............................................................................................................................................................
Warranty information..........................................................................................................................................
Manual addenda ..................................................................................................................................................
Safety symbols and terms ...................................................................................................................................
Specifications ......................................................................................................................................................
Unpacking and inspection ...................................................................................................................................
Inspection for damage .................................................................................................................................
Handling precautions .................................................................................................................................
Shipping contents ........................................................................................................................................
Instruction manual.......................................................................................................................................
Repacking for shipment ......................................................................................................................................
Optional accessories............................................................................................................................................
2
1-1
1-1
1-1
1-2
1-2
1-2
1-2
1-2
1-2
1-2
1-2
1-3
1-3
Multiplexer Configuration
Introduction .........................................................................................................................................................
Basic multiplexer configuration..........................................................................................................................
Typical multiplexer switching schemes ..............................................................................................................
Single-ended switching ...............................................................................................................................
Differential switching .................................................................................................................................
Sensing ........................................................................................................................................................
SMU connections ........................................................................................................................................
Multiplexer expansion.........................................................................................................................................
2-1
2-1
2-2
2-2
2-2
2-3
2-3
2-4
i
3
Card Connections and Installation
Introduction ......................................................................................................................................................... 3-1
Handling precautions........................................................................................................................................... 3-1
Multi-pin (mass termination) connections........................................................................................................... 3-1
Typical connection technique...................................................................................................................... 3-4
Typical connection scheme ......................................................................................................................... 3-6
Model 7035 installation and removal .................................................................................................................. 3-8
Card installation........................................................................................................................................... 3-8
Card removal ............................................................................................................................................... 3-8
4
Operation
Introduction ......................................................................................................................................................... 4-1
Power limits......................................................................................................................................................... 4-1
Maximum signal levels................................................................................................................................ 4-1
Mainframe control of card................................................................................................................................... 4-1
Channel assignments ................................................................................................................................... 4-2
Closing and opening channels ..................................................................................................................... 4-4
Scanning channels ....................................................................................................................................... 4-4
IEEE-488 bus operation .............................................................................................................................. 4-5
Multiplexer switching examples.......................................................................................................................... 4-6
Two-wire resistance tests ............................................................................................................................ 4-6
Four-wire resistance tests ............................................................................................................................ 4-7
Measurement considerations ............................................................................................................................... 4-7
Path isolation ............................................................................................................................................... 4-7
Magnetic fields ............................................................................................................................................ 4-8
Radio frequency interference ...................................................................................................................... 4-8
Ground loops ............................................................................................................................................... 4-9
Keeping connectors clean............................................................................................................................ 4-9
AC frequency response................................................................................................................................ 4-9
5
Service Information
Introduction ......................................................................................................................................................... 5-1
Handling and cleaning precautions ..................................................................................................................... 5-1
Performance verification ..................................................................................................................................... 5-2
Environmental conditions............................................................................................................................ 5-2
Recommended equipment ........................................................................................................................... 5-2
Multiplexer connections .............................................................................................................................. 5-2
Channel resistance tests............................................................................................................................... 5-3
Offset current tests....................................................................................................................................... 5-4
Contact potential tests.................................................................................................................................. 5-6
Bank and channel-to-channel isolation tests ............................................................................................... 5-8
Differential and common-mode isolation tests.......................................................................................... 5-12
Special handling of static-sensitive devices ...................................................................................................... 5-16
Principles of operation....................................................................................................................................... 5-16
Block diagram ........................................................................................................................................... 5-16
ID data circuits .......................................................................................................................................... 5-17
Relay control ............................................................................................................................................. 5-17
Relay power control .................................................................................................................................. 5-17
ii
Power-on safeguard...................................................................................................................................
Troubleshooting ................................................................................................................................................
Troubleshooting equipment ......................................................................................................................
Troubleshooting access .............................................................................................................................
Troubleshooting procedure .......................................................................................................................
6
5-18
5-18
5-18
5-18
5-18
Replaceable Parts
Introduction ......................................................................................................................................................... 6-1
Parts lists .............................................................................................................................................................. 6-1
Ordering information .......................................................................................................................................... 6-1
Factory service .................................................................................................................................................... 6-1
Component layouts and schematic diagrams ...................................................................................................... 6-1
Index
iii
List of Illustrations
2
Multiplexer Configuration
Figure 2-1
Figure 2-2
Figure 2-3
Figure 2-4
Figure 2-5
Figure 2-6
Model 7035 simplified schematic ...............................................................................................................
Single-ended switching example.................................................................................................................
Differential switching example ...................................................................................................................
Sensing example .........................................................................................................................................
SMU connections ........................................................................................................................................
Multiplexer expansion example ..................................................................................................................
3
Card Connections and Installation
Figure 3-1
Figure 3-2
Figure 3-3
Figure 3-4
Figure 3-5
Figure 3-6
Multi-pin connector card terminal identification ........................................................................................
Typical round cable connection techniques ................................................................................................
Model 7011-MTR connector pinout ...........................................................................................................
Model 7011-KIT-R (cable) assembly .........................................................................................................
Typical connection scheme for Model 7035...............................................................................................
Model 7035 card installation in Model 7001 ..............................................................................................
4
Operation
Figure 4-1
Figure 4-2
Figure 4-3
Figure 4-4
Figure 4-5
Figure 4-6
Figure 4-7
Figure 4-8
Figure 4-9
Figure 4-10
Figure 4-11
Model 7001 channel status display .............................................................................................................
Model 7002 channel status display (slot 1).................................................................................................
Display organization for multiplexer channels ...........................................................................................
Channel assignments...................................................................................................................................
Two-wire resistance testing.........................................................................................................................
1x36 multiplex bank....................................................................................................................................
Four-wire resistance testing ........................................................................................................................
Path isolation resistance ..............................................................................................................................
Voltage attenuation by path isolation resistance.........................................................................................
Power line ground loops .............................................................................................................................
Eliminating ground loops............................................................................................................................
2-1
2-2
2-2
2-3
2-3
2-4
3-2
3-4
3-5
3-5
3-7
3-8
4-2
4-2
4-3
4-3
4-6
4-6
4-7
4-8
4-8
4-9
4-9
v
5
Service Information
Figure 5-1
Figure 5-2
Figure 5-3
Figure 5-4
Figure 5-5
Figure 5-6
Figure 5-7
Figure 5-8
Figure 5-9
Figure 5-10
Path resistance test connections................................................................................................................... 5-3
Differential offset current test connections ................................................................................................. 5-5
Contact potential test connections ............................................................................................................... 5-7
Bank isolation test connections ................................................................................................................... 5-8
Channel-to-channel isolation test connections .......................................................................................... 5-10
Differential isolation test connections ....................................................................................................... 5-13
Common-mode isolation test connections................................................................................................. 5-15
Model 7035 block diagram........................................................................................................................ 5-16
Start and stop sequences............................................................................................................................ 5-17
Transmit and acknowledge sequence ........................................................................................................ 5-17
vi
List of Tables
3
Card Connections and Installation
Table 3-1
Table 3-2
Multi-pin connector card terminal designation cross-reference.................................................................. 3-3
Mass termination accessories...................................................................................................................... 3-3
4
Operation
Table 4-1
Paired channels in four-wire resistance example ........................................................................................ 4-7
5
Service Information
Table 5-1
Table 5-2
Table 5-3
Table 5-4
Table 5-5
Table 5-6
Verification equipment ............................................................................................................................... 5-2
Bank isolation test summary ....................................................................................................................... 5-9
Channel-to-channel isolation test summary .............................................................................................. 5-11
Differential and common-mode isolation testing...................................................................................... 5-14
Recommended troubleshooting equipment............................................................................................... 5-18
Troubleshooting procedure ....................................................................................................................... 5-19
6
Replaceable Parts
Table 6-1
Table 6-2
Table 6-3
Relay board for Model 7035 parts list ........................................................................................................ 6-2
Mass-terminated connector board for Model 7035 parts list ...................................................................... 6-3
Model 7011-KIT-R 96-pin female DIN connector kit parts list .................................................................. 6-3
vii
1
General Information
Introduction
Features
This section contains general information about the Model
7035 9-Bank, 1×4 Multiplexer Card.
The Model 7035 is a general purpose multiplexer card with
nine independent, 1×4, two-pole, multiplex banks. Some of
the key features include:
The Model 7035 assembly consists of a multi-pin (mass termination) connector card and a relay card. External test circuit connections to the Model 7035 are made via the 96-pin
male DIN connector on the connector card. Keithley offers a
variety of optional accessories that can be used to make connections to the connector card. See the available optional
accessories at the end of this section.
The rest of Section 1 is arranged in the following manner:
• Features
• Warranty information
• Low contact potential and offset current for minimal
effects on low-level signals.
• High isolation resistance (>1GΩ) for minimal load
effects.
• Model 7011-KIT-R connector kit that includes a 96-pin
female DIN connector that will mate directly to the connector on the Model 7035 or to a standard 96-pin male
DIN bulkhead connector (see Model 7011-MTR). This
connector uses solder cups for connections to external
circuitry and includes an adapter for a round cable and
the housing.
• Manual addenda
• Safety symbols and terms
• Specifications
• Unpacking and inspection
• Repacking for shipment
• Optional accessories
Warranty information
Warranty information is located at the front of this instruction manual. Should your Model 7035 require warranty service, contact the Keithley representative or authorized repair
facility in your area for further information. When returning
the card for repair, be sure to fill out and include the service
form at the back of this manual in order to provide the repair
facility with the necessary information.
1-1
General Information
Manual addenda
Any improvements or changes concerning the card or manual will be explained in an addendum included with the card.
Addenda are provided in a page-replacement format.
Replace the obsolete pages with the new pages.
Safety symbols and terms
The following symbols and terms may be found on an instrument or used in this manual.
! symbol on an instrument indicates that you
The
should refer to the operating instructions located in the
instruction manual.
The
symbol on an instrument shows that high voltage
may be present on the terminal(s). Use standard safety precautions to avoid personal contact with these voltages.
The WARNING heading used in this manual explains dangers that might result in personal injury or death. Always
read the associated information very carefully before performing the indicated procedure.
The CAUTION heading used in this manual explains hazards that could damage the card. Such damage may invalidate the warranty.
Specifications
Model 7035 specifications may be found at the front of this
manual. These specifications are exclusive of the Model
7001/7002 mainframe specifications.
Unpacking and inspection
Inspection for damage
The Model 7035 is packaged in a resealable, anti-static bag
to protect it from damage due to static discharge and from
1-2
contamination that could degrade its performance. Before
removing the card from the bag, observe the following precautions on handling.
Handling precautions
1. Always grasp the card by the side edges and shields. Do
not touch the board surfaces or components.
2. When not installed in a Model 7001/7002 mainframe,
keep the card in the anti-static bag and store it in the
original packing carton.
After removing the card from its anti-static bag, inspect it for
any obvious signs of physical damage. Report any such damage to the shipping agent immediately.
Shipping contents
The following items are included with every Model 7035
order:
• Model 7035 9-Bank, 1×4 Multiplexer Card
• Model 7011-KIT-R 96-pin Female DIN Connector Kit
• Model 7035 Instruction Manual
• Additional accessories as ordered
Instruction manual
The Model 7035 Instruction Manual is three-hole drilled so
it can be added to the three-ring binder of the Model 7001 or
Model 7002 Instruction Manual. After removing the plastic
wrapping, place the manual in the binder following the mainframe instruction manual. Note that a manual identification
tab is included and should precede the multiplexer card
instruction manual.
If an additional instruction manual is required, order the
manual package, Keithley part number 7035-901-00. The
manual package includes an instruction manual and any pertinent addenda.
General Information
Repacking for shipment
Optional accessories
Should it become necessary to return the Model 7035 for
repair, carefully pack the unit in its original packing carton,
or the equivalent, and include the following information:
The following accessories are available for use with the
Model 7035:
• Advise as to the warranty status of the card.
• Write ATTENTION REPAIR DEPARTMENT on the
shipping label.
• Fill out and include the service form located at the back
of this manual.
Model 7011-MTC-2 — This two-meter round cable assembly is terminated with a 96-pin female DIN connector on
each end. It will mate directly to the connector on the
Model 7035 and to a standard 96-pin male DIN bulkhead
connector (see Model 7011-MTR).
Model 7011-MTR ⎯ This 96-pin male DIN bulkhead connector uses solder cups for connections to external circuitry.
It will mate to the Model 7011-KIT-R connector and Model
7011-MTC-2 cable assembly.
1-3
2
Multiplexer Configuration
Introduction
This section covers the basics for multiplexer switching and
is arranged as follows:
• Basic multiplexer configuration — Covers the basic
multiplexer configuration.
• Typical multiplexer switching schemes — Explains
some of the basic ways a multiplexer can be used to
source or measure. Covers single-ended switching, differential (floating) switching, sensing, and SMU
connections.
• Multiplexer expansion — Discusses how to configure
a larger multiplexer configuration.
Model 7035
A simplified schematic of the Model 7035 multiplex banks is
shown in Figure 2-1. It is organized as nine independent
1×4 banks. Each bank has four inputs and one output. Twopole switching is provided for each multiplexer input, with
HI and LO switched.
4
1
4
1
4
1
4
1
4
1
4
1
4
1
4
1
4
Input (1 of 36)
HI
LO
Bank A
Bank B
Bank C
Bank D
Bank E
Bank F
Basic multiplexer configuration
1
Bank G
Bank H
Bank I
HI
LO
Bank
Switching Topology
for all Channels
Figure 2-1
Model 7035 simplified schematic
2-1
Multiplexer Configuration
Input 1-4
Bank A-I
Optional
Shield
H
HI
Out
In
DUT
L
LO
Source or
Measure
7035
Figure 2-2
Single-ended switching example
Typical multiplexer switching schemes
The following paragraphs describe some basic switching
schemes that are possible with a two-pole switching multiplexer. These switching schemes include some various
shielding configurations to help minimize noise pick-up in
sensitive measurement applications. These shields are shown
connected to chassis ground. For some test configurations,
shielding may prove to be more effective connected to circuit
common. Chassis ground is accessible at the rear panel of the
Model 7001/7002 mainframe.
single pathway as shown in Figure 2-2. The instrument is
connected to the output of one of the banks, and the DUT is
shown connected to one of the inputs for that bank.
Differential switching
The differential or floating switching configuration is shown
in Figure 2-3. The advantage of using this configuration is
that the terminals of the source or measure instrument are not
confined to the same pathway. Each terminal of the instrument can be switched to any available input in the test
system.
Single-ended switching
In the single-ended switching configuration, the source or
measure instrument is connected to the DUT through a
Bank A
Input 1-4
H
HI
Out
In
L
DUT
H
LO
Out
In
L
Bank B
Source or
Measure
Figure 2-3
Differential switching example
2-2
Input 5-8
7035
Multiplexer Configuration
Input 1-4
Bank A
Source HI
H
Out L
Sense HI
In
DUT
H
Sense LO
Out L
Source LO
In
Bank B
7035
Source or
Measure
Input 5-8
Figure 2-4
Sensing example
Sensing
SMU connections
Figure 2-4 shows how the multiplexer can be configured to
use instruments that have sensing capability. The main
advantage of using sensing is to cancel the effects of switch
card path resistance (<1Ω) and the resistance of external
cabling. Whenever path resistance is a consideration, sensing
should be used.
Figure 2-5 shows how to connect a Keithley Model 236, 237,
or 238 Source Measure Unit to the multiplexer. By using
triax cables that are unterminated at one end, the driven
guard and chassis ground are physically extended all the way
to the card.
Input 1-4
Bank A
H
Output HI
Guard
Out L
In
DUT
H
Sense HI
Guard
Out L
In
Bank B
7035
Input 5-8
Sense LO
Output LO
Output LO
WARNING: Hazardous voltages may be present on
GUARD. Make sure all cable shields are
properly insulated before applying power.
Triax
Cables (3)
236/237/238
Figure 2-5
SMU connections
2-3
Multiplexer Configuration
Multiplexer expansion
Larger multiplexers can be configured by externally connecting the individual Model 7035 multiplex banks using customer-supplied external jumpers. You can configure a
multiplexer as large as 1×36 (Figure 2-6).
Inputs
1
2
2
Bank A
4
Output A
2
2
1
2
2
Bank B
4
Customer-supplied
external jumpers
2
2
1
Bank C
4
2
2
2
2
1
2
4
Customer-supplied
external jumpers
2
Bank D
2
2
1
2
2
Bank E
4
2
2
1
2
4
Customer-supplied
external jumpers
2
Bank F
2
2
1
2
2
Bank G
4
2
2
1
2
4
Customer-supplied
external jumpers
2
Bank H
2
2
1
2
4
2
2
Bank I
Figure 2-6
Multiplexer expansion example
2-4
3
Card Connections
and Installation
Introduction
WARNING
The procedures in this section are intended only for qualified service personnel. Do not perform these procedures
unless qualified to do so. Failure to recognize and observe normal safety precautions could result in personal injury
or death.
The information in this section is arranged as follows:
• Handling precautions ⎯ Explains precautions that
must be followed to prevent contamination to the card
assembly. Contamination could degrade the performance of the card.
• Multi-pin (mass termination) connections ⎯ Covers
the basics for connecting external circuitry to the connector card.
• Model 7035 installation and removal ⎯ Provides the
procedure to install and remove the card assembly from
the Model 7001/7002 mainframe.
To avoid possible contamination, always grasp the relay card
and the connector card by the side edges or shields. Do not
touch the board surfaces or components. On connectors, do
not touch areas adjacent to the electrical contacts. Dirt
buildup over a period of time is another possible source of
contamination. To avoid this problem, operate the mainframe
and card assembly in a clean environment.
If a card becomes contaminated, it should be thoroughly
cleaned as explained in Section 5.
Multi-pin (mass termination)
connections
Since connections to external circuitry are made at the 96-pin
male DIN bulkhead connector, there is no need to separate
the connector card from the relay card. If the connector card
is separated from the relay card, carefully mate them
together and install the supplied 4-40 screw to secure the
cards. Make sure to handle the cards by the edges and shields
to avoid contamination.
The connector will mate to a 96-pin female DIN connector.
Terminal identification for the DIN connector of the multipin connector card is provided by Figure 3-1 and Table 3-1
and can be identified in one of three ways:
Handling precautions
To maintain high impedance isolation, take care when
handling the card to avoid contamination from such foreign
materials as body oils. Such contamination can substantially
lower leakage resistances and degrade performance.
1. Mux terminal consisting of banks A-I, channels 1-36.
2. Connector description consisting of rows a-c, pins 1-32.
3. Schematic and component layout designation consisting
of pins 1-96.
3-1
Card Connections and Installation
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
c
b
a
View pin side
of connector
Bank A
Bank B
2
2a HI
3
3a LO
4
4a HI
5
5a LO
6
6a HI
7
7a LO
Channel 1
14
14a LO
15
15a HI
Channel 2
16
16a LO
17
17a HI
Channel 3
18
18a LO
HI 11
11a
8
8a HI
10
10a LO
20
20a LO
Bank D
37
5b LO
38
6b HI
39
7b LO
40
8b
HI 21
21a
Channel 8
Channel 13
46
14b LO
47
15b HI
Channel 14
48
16b LO
49
17b HI
Channel 15
50
18b LO
HI 43
11b
Output D
Channel 16
52
20b LO
72
8c LO
Channel 18
Channel 25
76
12c LO
77
13c HI
Channel 26
78
14c LO
79
15c HI
Channel 27
80
16c LO
HI 73
9c
Channel 19
HI 53
21b
Channel 20
Output E
HI 31
31a
Channel 12
Output G
82
18c LO
LO 32
32a
Bank F
HI
60
28b LO
61
29b
Channel 21
Channel 22
Channel 23
HI 63
31b
HI
62
30b LO
Channel 24
88
24c LO
89
25c HI
HI 83
19c
Output H
LO 84
20c
1
1a
95
31c
33
1b
96
32c
41
9b
9
9a
LO 64
32b
86
22c LO
87
23c HI
Channel 31
LO 74
10c
Output F
Bank I
Channel 30
Channel 32
Output C
85
21c HI
Channel 29
81
17c HI
Figure 3-1
Multi-pin connector card terminal identification
3-2
30
30a LO
58
26b LO
59
27b HI
Bank H
Channel 28
Channel 11
29
29a HI
56
24b LO
57
25b HI
75
11c HI
71
7c HI
Channel 10
LO 54
22b
Bank G
70
6c LO
28
28a LO
55
23b
Channel 17
51
19b HI
65
1c HI
68
4c LO
69
5c HI
Output B
Bank E
LO 44
12b
66
2c LO
67
3c HI
27
27a HI
Channel 7
45
13b HI
HI
42
10b LO
26
26a LO
Channel 9
LO 22
22a
HI
35
3b LO
36
4b HI
24
24a LO
25
25a HI
Channel 6
19
19a HI
Output A
Channel 4
23
23a HI
Channel 5
LO 12
12a
34
2b
Bank C
13
13a HI
90
26c LO
Channel 33
Channel 34
Channel 35
HI 93
29c
91
27c HI
92
28c LO
Channel 36
Output I
LO 94
30c
Card Connections and Installation
Table 3-1
Multi-pin connector card terminal designation cross-reference
Mux
terminal
Bank A Chan 1, HI
Chan 1, LO
Chan 2, HI
Chan 2, LO
Chan 3, HI
Chan 3, LO
Chan 4, HI
Chan 4, LO
Output A, HI
Output A, LO
Bank D Chan 13, HI
Chan 13, LO
Chan 14, HI
Chan 14, LO
Chan 15, HI
Chan 15, LO
Chan 16, HI
Chan 16, LO
Output D, HI
Output D, LO
Bank G Chan 25, HI
Chan 25, LO
Chan 26, HI
Chan 26, LO
Chan 27, HI
Chan 27, LO
Chan 28, HI
Chan 28, LO
Output G, HI
Output G, LO
Shield
Shield
Conn.
desig.
1a-32c
2a
3a
4a
5a
6a
7a
8a
10a
11a
12a
2b
3b
4b
5b
6b
7b
8b
10b
11b
12b
1c
2c
3c
4c
5c
6c
7c
8c
9c
10c
9a
9b
Schem.
desig.
1-96
2
3
4
5
6
7
8
10
11
12
34
35
36
37
38
39
40
42
43
44
65
66
67
68
69
70
71
72
73
74
9
41
Mux
terminal
Bank B Chan 5, HI
Chan 5, LO
Chan 6, HI
Chan 6, LO
Chan 7, HI
Chan 7, LO
Chan 8, HI
Chan 8, LO
Output B, HI
Output B, LO
Bank E Chan 17, HI
Chan 17, LO
Chan 18, HI
Chan 18, LO
Chan 19, HI
Chan 19, LO
Chan 20, HI
Chan 20, LO
Output E, HI
Output E, LO
Bank H Chan 29, HI
Chan 29, LO
Chan 30, HI
Chan 30, LO
Chan 31, HI
Chan 31, LO
Chan 32, HI
Chan 32, LO
Output H, HI
Output H, LO
Not Used
Not Used
Keithley has a variety of cable and connector accessories
available to accommodate connections from the connector
card to test instrumentation and DUTs (devices under test).
In general, these accessories, which are summarized in
Table 3-2, utilize a round cable assembly for connections.
Conn.
desig.
1a-32c
13a
14a
15a
16a
17a
18a
19a
20a
21a
22a
13b
14b
15b
16b
17b
18b
19b
20b
21b
22b
11c
12c
13c
14c
15c
16c
17c
18c
19c
20c
1a
1b
Schem.
desig.
1-96
13
14
15
16
17
18
19
20
21
22
45
46
47
48
49
50
51
52
53
54
75
76
77
78
79
80
81
82
83
84
1
33
Mux
terminal
Bank C Chan 9, HI
Chan 9, LO
Chan 10, HI
Chan 10, LO
Chan 11, HI
Chan 11, LO
Chan 12, HI
Chan 12, LO
Output C, HI
Output C, LO
Bank F Chan 21, HI
Chan 21, LO
Chan 22, HI
Chan 22, LO
Chan 23, HI
Chan 23, LO
Chan 24, HI
Chan 24, LO
Output F, HI
Output F, LO
Bank I Chan 33, HI
Chan 33, LO
Chan 34, HI
Chan 34, LO
Chan 35, HI
Chan 35, LO
Chan 36, HI
Chan 36, LO
Output I, HI
Output I, LO
Not Used
Not Used
Conn.
desig.
1a-32c
23a
24a
25a
26a
27a
28a
29a
30a
31a
32a
23b
24b
25b
26b
27b
28b
29b
30b
31b
32b
21c
22c
23c
24c
25c
26c
27c
28c
29c
30c
31c
32c
Schem.
desig.
1-96
23
24
25
26
27
28
29
30
31
32
55
56
57
58
59
60
61
62
63
64
85
86
87
88
89
90
91
92
93
94
95
96
Table 3-2
Mass termination accessories
Model
Description
7011-KIT-R
96-pin female DIN connector and housing for round cable (provided with the
Model 7035 card).
7011-MTC-2
Two-meter round cable assembly terminated with a 96-pin female DIN connector on each end.
7011-MTR
96-pin male DIN bulkhead connector.
3-3
Card Connections and Installation
Typical connection technique
NOTE
All external circuitry, such as instrumentation and DUTs,
that you want to connect to the card must be terminated with
a single 96-pin female DIN connector. The following connection techniques provide some guidelines and suggestions
for wiring your circuitry.
It is recommended that external circuitry
be connected (plugged in) after the Model
7035 assembly is installed in the Model
7001/7002 mainframe. Installation is covered at the end of this section.
WARNING
Round cable assemblies — shows typical round cable connection techniques using accessories available from
Keithley.
Before beginning any wiring procedures, make sure all power is off and
stored energy in external circuitry is discharged.
In Figure 3-2A, connections are accomplished using a Model
7011-MTC-2 cable and a Model 7011-MTR bulkhead connector. The two-meter round cable is terminated with a 96pin female DIN connector at each end. This cable mates
directly to the multi-pin connector card and to the bulkhead
connector. The bulkhead connector has solder cups to allow
direct connection to the instrumentation and DUT.
Figure 3-3 provides the pinout for the bulkhead connector.
WARNING
When wiring a connector and device under test, do not leave any exposed wires
or connections. No conductive part of
the circuit may be exposed. Properly
cover the conductive parts and ensure
maximum signal levels are not exceeded
or death by electric shock may occur.
A)
Wire instrumentation
and DUT to bulkhead
connector (See Table 3-1
and Figures 3-1 and 3-3
for terminal identification)
Multi-Pin
Connector
Card
7011-MTC-2
cable
7011-MTR
assembly
bulkhead connector
B)
Multi-Pin
Connector
Card
Wire directly to
instrumentation
and DUT
7011-MTC-2
(Cut in Half)
C)
Wire directly to
instrumentation
and DUT
Multi-Pin
Connector
Card
Cable
7011-Kit-R
Connector Kit
Notes: Figure 3-4 provides an exploded view showing
how the connector (with cable) is assembled.
Cable Hitachi p/n N2807-P/D-50TAB is a
50-conductor cable. Two of these cables
can be used to supply 100 conductors.
Figure 3-2
Typical round cable connection techniques
3-4
Card Connections and Installation
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
c
b
a
View from solder
cup side of
connector
Note: See Figure 3-1 and Table 3-1 for terminal identification.
Figure 3-3
Model 7011-MTR connector pinout
In Figure 3-2B, connections are accomplished using a
Model 7011-MTC-2 cable assembly that is cut in half. The
96-pin female DIN connector on one end of the cable mates
directly to the multi-pin connector card. The unterminated
end of the cable is wired directly to the instrumentation and
DUT. The other half of the cable assembly could be used for
a second card.
In Figure 3-2C, connections are accomplished using
a custom-built cable assembly that consists of a
Model 7011-KIT-R connector and a suitable round cable.
Hitachi cable part number N2807-P/D-50TAB is a 50-conductor cable. Two of these cables can be used to supply 100
conductors. The connector has solder cups to accommodate
the individual wires of the unterminated cable. Figure 3-4 provides an exploded view of the connector assembly and shows
how the cable is connected. For further Model 7011-KIT-R
assembly information, refer to the packing list provided with
the kit. The connector end of the resultant cable assembly
mates directly to the multi-pin connector card. The unterminated end of the cable assembly is wired directly to the instrumentation and DUT.
Figure 3-4
Model 7011-KIT-R (cable) assembly
3-5
Card Connections and Installation
Typical connection scheme
The following information provides a typical connection
scheme for the Model 7035. Keep in mind that this is only an
example to demonstrate wiring a test system.
Figure 3-5 shows how external connections can be made to
the system. Instrumentation and DUTs are hard-wired to the
Model 7011-MTR male bulkhead connector. This connector
has solder cups that will accept wire size up to #24 AWG.
The test system is connected to the Model 7035 multiplexer
3-6
using the Model 7011-MTC-2 round cable assembly. This
cable mates directly to both the external bulkhead connector
and the Model 7035 card. Notice that the bulkhead connector
is shown mounted to a fixture to help keep the cabling stable
during the test. Connection details are provided in the Multipin (mass termination) connections paragraph.
If adding more Model 7035 cards to a system, simply wire
them in the same manner as the first. Remember that Model
7035 cards installed in the same mainframe are electrically
isolated from each other.
Card Connections and Installation
HI and LO to Bank A
Instrument
HI and LO to Bank B
Instrument
Instrument
HI and LO to Bank C
Instrument
HI and LO to Bank D
7035
90 Individual Conductors
Fixture for
Bulkhead
Connector
HI and LO to Bank E
Instrument
HI and LO to Bank F
Instrument
HI and LO to Bank G
Instrument
HI and LO to Bank H
Instrument
HI and LO to Bank I
Instrument
Model 7011-MTC-2
Cable Assembly
7011-MTR
Bulkhead
Connector
1
1
4
4
1
1
1
4
1
4
1
4
1
4
1
4
1
4
1
4
1
4
1
4
4
1
DUT Test Fixture
4
1
4
DUTs
1
4
1
4
1
4
1
4
4
1
4
1
4
1
Instruments
4
1
4
1
4
1
1
4
1
4
4
7035
Simplified Equivalent Circuit
Figure 3-5
Typical connection scheme for Model 7035
3-7
Card Connections and Installation
Model 7035 installation and removal
The following paragraphs explain how to install and remove
the Model 7035 card from the Model 7001/7002 mainframe.
WARNING
Installation or removal of the Model
7035 is to be performed by qualified service personnel. Failure to recognize and
observe standard safety precautions
could result in personal injury or death.
CAUTION
To prevent contamination to the card
that could degrade performance, only
handle the card by the edges and
shields.
WARNING
To avoid electric shock that could result
in injury or death, make sure to
properly install and tighten the safety
ground screw shown in Figure 3-6.
Card installation
Perform the following steps to install the Model 7035 card in
the Model 7001/7002 mainframe:
To remove the Model 7035 card, first unloosen the safety
ground screw, unlock the card by pulling the latches outward, and pull the card out of the mainframe. Remember to
handle the card by the edges and shields to avoid contamination that could degrade performance.
Turn off power from all instrumentation
(including the Model 7001/7002 mainframe) and disconnect their line cords.
Make sure all power is removed and any
stored energy in external circuitry is discharged.
Unlock card
Figure 3-6
Model 7035 card installation in Model 7001
3-8
5. Install the screw shown in Figure 3-6.
Card removal
WARNING
Screw
1. Mate the connector card to the relay card if they are separated. Install the supplied 4-40 screw to secure the
assembly. Make sure to handle the cards by the edges
and shields to prevent contamination.
2. Facing the rear panel of the Model 7001/7002, select the
slot that you wish to install the Model 7035 card in.
3. Referring to Figure 3-6, feed the Model 7035 card into
the desired slot so the edges of the relay card ride in the
rails.
4. With the ejector arms in the unlocked position, push the
Model 7035 card all the way into the mainframe until
the arms engage into the ejector cups. Then push both
arms inward to lock the card into the mainframe.
Ejector
Arms (2)
Screw
Lock card
4
Operation
Introduction
Maximum signal levels
The information in this section is formatted as follows:
To prevent overheating or damage to the relays, never exceed
the following maximum signal levels:
•
Power limits — Summarizes the maximum power limits of the Model 7035 card.
•
Mainframe control of card — Summarizes the programming steps to control the card from the
Model 7001/7002 mainframe.
•
Multiplexer switching examples — Provides some
typical applications for using the Model 7035.
•
Measurement considerations — Reviews a number of
considerations when using the Model 7035 to make
measurements.
Power limits
60V DC, 30V rms, 42V peak between any two inputs or
chassis, 1A switched, 30VA (resistive load).
Mainframe control of card
The following information pertains to the Model 7035. It
assumes that you are familiar with the operation of the
Model 7001 or Model 7002 mainframe—whichever is used.
If you are not familiar with the operation of the mainframe in
use, proceed to Getting Started (Section 3) of the
Model 7001 or Model 7002 Instruction Manual after reading
the following information.
CAUTION
To prevent damage to the card, do not
exceed the maximum signal level specifications of the card.
4-1
Operation
7001 Display
CARD 1
1
2
3
4
5
CARD 2
6
7
8
9
10
1
2
3
4
5
6
7
8
9
10
= Open Channel
= Closed Channel
Figure 4-1
Model 7001 channel status display
Channel assignments
The Model 7001 has a channel status display (Figure 4-1)
that provides the real-time state of each available channel.
The left portion of the display is for slot 1 (card 1), and the
right portion is for slot 2 (card 2). For the Model 7002, channel status LED grids are used for the ten slots. The LED grid
for slot 1 is shown in Figure 4-2.
7002 LED Display
SLOT 1
1
2
3
4
COLUMN
5 6 7
8
9 10
1
ROW
2
3
4
= Open Channel
= Closed Channel
Figure 4-2
Model 7002 channel status display (slot 1)
Organization of the channel status display for each slot is
shown in Figure 4-3. The card contains 36 channels and is
made up of nine multiplex banks (banks A through I) totaling
36 channels as shown in the illustration.
4-2
To control the card from the mainframe, each multiplexer
input must have a unique channel assignment that includes
the slot number that the card is installed in. The channel
assignments for the card are provided in Figure 4-4. Each
channel assignment is made up of the slot designator (1 or 2)
and the channel (1 to 36). For the Model 7002, the slot designator can be from 1 to 10 since there are 10 slots. To be
consistent with Model 7001/7002 operation, the slot designator and channel are separated by an exclamation point (!).
Some examples of channel assignments are as follows:
CHANNEL 1!1 = Slot 1, Channel 1 (Input 1 of Bank A)
CHANNEL 1!36 = Slot 1, Channel 36 (Input 36 of Bank I)
CHANNEL 2!23 = Slot 2, Channel 23 (Input 23 of Bank F)
CHANNEL 2!36 = Slot 2, Channel 36 (Input 36 of Bank I)
These channels are displayed and controlled from the normal
display state of the mainframe. If currently in the menu
structure, return to the normal display state.
Operation
Bank
Channel
A
A
A
A
B
B
B
B
C
C
1
2
3
4
5
6
7
8
9
10
C
C
D
D
D
D
E
E
E
E
11
12
13
14
15
16
17
18
19
20
F
F
F
F
G
G
G
G
H
H
21
22
23
24
25
26
27
28
29
30
Not
Used
Not
Used
Not
Used
Not
Used
H
H
I
I
I
I
31
32
33
34
35
36
Figure 4-3
Display organization for multiplexer channels
A. Slot 1
(Card 1)
B. Slot 2
(Card 2)
1
2
3
4
5
6
7
8
9
10
1!1
1!2
1!3
1!4
1!5
1!6
1!7
1!8
1!9
1!10
1!11
1!12
1!13
1!14
1!15
1!16
1!17
1!18
1!19
1!20
1!21
1!22
1!23
1!24
1!25
1!26
1!27
1!28
1!29
1!30
1!31
1!32
1!33
1!34
1!35
1!36
1
2
3
4
5
6
7
8
9
10
2!1
2!2
2!3
2!4
2!5
2!6
2!7
2!8
2!9
2!10
2!11
2!12
2!13
2!14
2!15
2!16
2!17
2!18
2!19
2!20
2!21
2!22
2!23
2!24
2!25
2!26
2!27
2!28
2!29
2!30
2!31
2!32
2!33
2!34
2!35
2!36
Examples:
1!18 = Slot 1, Channel 18 (Input 18 of Bank E)
2!36 = Slot 2, Channel 36 (Input 36 of Bank I)
Figure 4-4
Channel assignments
4-3
Operation
Closing and opening channels
Scanning channels
A channel is closed from the front panel by simply keying in
the channel assignment and pressing CLOSE. For example,
to close channel 6 (input 6 of bank B) of a multiplexer card
installed in slot 2, key in the following channel list and press
CLOSE:
Multiplexer channels are scanned by creating a scan list and
configuring the Model 7001/7002 to perform a scan. The
scan list is created in the same manner as a channel list (See
the previous Closing and opening channels paragraph).
However, the scan list is specified from the SCAN CHANNELS display mode. (The SCAN LIST key toggles between
the channel list and the scan list.) The following shows an
example of a scan list:
SELECT CHANNELS 2!6
The above closed channel can be opened by pressing OPEN
or OPEN ALL. The OPEN key opens only the channels specified in the channel list, and OPEN ALL turns off (opens) all
channels.
NOTE
For the Model 7002 mainframe, you can
use the light pen to turn output channels on
and off.
SCAN CHANNELS 2!1, 2!3, 2!21-2!25
When a scan is performed, the channels specified in the scan
list will be scanned in the order that they are presented in the
scan list.
Channel patterns can also be used in a scan list. This allows
you to scan unique relay patterns. Example:
SCAN CHANNELS M1, M2, M3, M4
The following display is an example of a channel list that
consists of several channels:
SELECT CHANNELS 2!1, 2!3, 2!22-2!25
Notice that channel entries are separated by commas (,). A
comma is inserted by pressing ENTER or the right cursor
key ( ). The channel range is specified by using the hyphen
(-) key to separate the range limits. Pressing CLOSE will
close all the channels specified in the channel list. Pressing
OPEN (or OPEN ALL) will open the channels.
Channel patterns can also be used in a channel list. This
allows you to control unique relay patterns. Example:
SELECT CHANNELS 2!1, M1
Pressing CLOSE will close channel 2!1 and the channels that
make up channel pattern M1. Refer to the mainframe instruction manual for information on defining channel patterns.
4-4
When M1 is scanned, the channels that make up channel pattern M1 will close. When M2 is scanned, the M1 channels
will open and the channels that make up M2 will close. M3
and M4 are scanned in a similar manner. Refer to the instruction manual for the mainframe for information on defining
channel patterns.
A manual scan can be performed by using the RESET
default conditions of the Model 7001/7002. RESET is
selected from the SAVESETUP menu of the main MENU.
When RESET is performed, the mainframe is configured for
an infinite number of manual scans. The first press of STEP
takes the mainframe out of the idle state. The next press of
STEP will close the first channel specified in the scan list.
Each subsequent press of STEP will select the next channel
in the scan list.
Operation
IEEE-488 bus operation
Bus operation is demonstrated using Microsoft QuickBASIC
4.5, the Keithley KPC-488.2 (or Capital Equipment Corporation) IEEE interface, and the HP-style Universal Language
Driver (CECHP). Refer to “QuickBASIC 4.5 Programming”
in the mainframe manual for details on installing the Universal Language Driver, opening driver files, and setting the
input terminal. Program statements assume that the primary
address of the mainframe is 07.
Closing and opening channels
The following SCPI commands are used to close and open
multiplexer channels:
:CLOSe <list>
:OPEN <list>|ALL
Closes specified channels.
Opens specified (or all) channels.
The following program statement closes channels 1!1, 1!4
through 1!6 and the channels that make up channel pattern
M1.
PRINT #1, "output 07; clos (@ 1!1, 1!4:1!6, M1)"
Notice that the colon (:) is used to separate the range limits.
Either of the following statements opens channels 1!1, 1!4
through 1!6 and the channels of M1:
PRINT #1, "output 07; open (@ 1!1, 1!4:1!6, M1)"
PRINT #1, "output 07; open all"
Scanning channels
There are many commands associated with scanning. However, it is possible to configure a scan using as little as four
commands. These commands are listed as follows:
*RST
:TRIGger:COUNt:AUTo ON
:ROUTe:SCAN <list>
:INIT
The first command resets the mainframe to a default scan
configuration. The second command automatically sets the
channel count to the number of channels in the scan list, the
third command defines the scan list, and the fourth command
takes the Model 7001/7002 out of the idle state.
The following program fragment will perform a single scan
of channels 1 through 4 of slot 1, and the channels that make
up channel pattern M1:
PRINT
PRINT
PRINT
PRINT
#1,
#1,
#1,
#1,
"output
"output
"output
"output
07;
07;
07;
07;
*rst"
trig:coun:auto on"
scan (@ 1!1:1!4, M1)"
init"
The first statement selects the *RST default configuration for
the scan. The second statement sets channel count to the
scan-list-length (5). The third statement defines the scan list,
and the last statement takes the mainframe out of the idle
state. The scan is configured to start as soon as the :INIT
command is executed.
When the above program fragment is run, the scan will be
completed in approximately 216 milliseconds (3msec delay
for channel closures and 3msec delay for each open), which
is too fast to view from the front panel. An additional relay
delay can be added to the program to slow down the scan for
viewing. The program is modified by adding a statement to
slow down the scan. Also, a statement is added to the beginning of the program to ensure that all channels are open
before the scan is started. The two additional statements are
indicated in bold typeface.
PRINT
PRINT
PRINT
PRINT
PRINT
PRINT
#1,
#1,
#1,
#1,
#1,
#1,
"output
"output
"output
"output
"output
"output
07;
07;
07;
07;
07;
07;
open all"
*rst"
trig:coun:auto on"
trig:del 0.5"
scan (@ 1!1:1!4, M1)"
init"
The first statement opens all channels, and the fourth statement sets a 1/2 second delay after each channel closes.
4-5
Operation
Multiplexer switching examples
This paragraph presents some typical applications for the
Model 7035. These include two-wire and four-wire resistance tests.
The Model 7035 can be used to test a large number of resistors using only one test instrument or group of instruments.
Such tests include two-wire and four-wire resistance measurements using a DMM as discussed in the following paragraphs.
Two-wire resistance tests
Figure 4-5 shows a typical test setup for making two-wire
resistance measurements using one of the nine Model 7035
multiplex banks. The Model 7035 provides the switching
function, while the resistance measurements are made by a
Model 2000 DMM.
Since only two-pole switching is required for two-wire resistance testing, one Model 7035 card can be used to switch up
to 36 resistors by externally connecting the bank outputs
using customer-supplied jumpers (Figure 4-6). Figure 4-6 is
a simplified schematic, and each input contains two-pole
switching.
Accuracy of measurements can be optimized by minimizing
stray resistance.
Make connecting wires as short as possible to minimize path
resistance. Another technique is to short one of the multiplexer inputs, close the shorted channel and then enable the
DMM zero feature to cancel path resistance. Leave zero
enabled for the entire test.
1
7035
1
4
1
HI
Bank A (1×4)
1
4
Bank B (1×4)
1
5
4
8
Instruments
LO
DUTs
POWER
Customer-supplied
external bank
connections
4
MODEL 2000 DMM
4
Single 1×4 MUX
DUTs
(4)
A. Test Configuration
1
Bank I (1×4)
32
4
36
Single 1×36 Multiplexer
Ω
R
Model 2000
DMM
7035
B. Simplified Equivalent Circuit
Figure 4-5
Two-wire resistance testing
4-6
DUT
Figure 4-6
1×36 multiplex bank
Operation
Four-wire resistance tests
Table 4-1
Paired channels in four-wire resistance example
More precise measurements over a wider range of system
and DUT conditions can be obtained by using the four-wire
measurement scheme shown in Figure 4-7. Here, separate
sense leads from the Model 2000 DMM are routed through
the multiplexer to the resistor under test. The extra set of
sense leads minimizes the effects of voltage drops across the
test leads. Note, however, that an extra two poles of switching are required for each resistor tested. For this reason, only
16 resistors per card can be tested using this configuration
because two channels must close at the same time.
The example shown in Figure 4-7 tests four devices using
banks A and B. The appropriate channel pairs to close for the
example are shown in Table 4-1.
7035
Input HI
Sense
Ω4
Wire HI
1
1
4
4
HI
DUTs
(4)
LO
POWER
Model 2000
DMM
Input LO
5
Sense
Ω 4 Wire
LO
Device
under test
(DUT)
Channel
pair
Connection
designations
1
1 and 5
Bank A, IN 1 and
Bank B, IN 5
2
2 and 6
Bank A, IN 2 and
Bank B, IN 6
3
3 and 7
Bank A, IN 3 and
Bank B, IN 7
4
4 and 8
Bank A, IN 4 and
Bank B, IN 8
Note that banks A and B must be electrically isolated. Likewise, if you were to configure a dual 1×8 four-wire resistance
test by externally connecting the outputs of banks A and B
and banks C and D using customer-supplied jumpers, you
must electrically isolate banks A and B from banks C and D.
Although the four-wire connection scheme minimizes problems caused by voltage drops, there is one other potentially
troublesome area associated with low resistance measurements: thermal EMFs caused by the relay contacts. In order
to compensate for thermal EMFs, the offset-compensated
ohms feature of the Model 2000 DMM should be used.
8
Measurement considerations
Many measurements made with the Model 7035 are subject
to various effects that can seriously affect low-level measurement accuracy. The following paragraphs discuss these
effects and ways to minimize them.
Dual 1×4 MUX
A. Test Configuration
Input HI
Path isolation
Sense Ω 4 Wire HI
Ω
R
Sense Ω 4 Wire LO
Input LO
Model 2000
DMM
7035
DUT
The path isolation is simply the equivalent impedance
between any two test paths in a measurement system. Ideally,
the path isolation should be infinite, but the actual resistance
and distributed capacitance of cables and connectors results
in less than infinite path isolation values for these devices.
B. Simplified Equivalent Circuit
Figure 4-7
Four-wire resistance testing
4-7
Operation
R DUT
R PATH
R IN
V
E DUT
DUT
Measure
Instrument
7035 Mux
Card
R DUT
= Source Resistance of DUT
E DUT
= Source EMF of DUT
R PATH
= Path Isolation Resistance
R IN
= Input Resistance of Measuring Instrument
Figure 4-8
Path isolation resistance
Path isolation resistance forms a signal path that is in parallel
with the equivalent resistance of the DUT, as shown in Figure 4-8. For low-to-medium device resistance values, path
isolation resistance is seldom a consideration; however, it
can seriously degrade measurement accuracy when testing
high-impedance devices. The voltage measured across such
a device, for example, can be substantially attenuated by the
voltage divider action of the device source resistance and
path isolation resistance, as shown in Figure 4-9. Also, leakage currents can be generated through these resistances by
voltage sources in the system.
R DUT
Any differential isolation capacitance affects DC measurement settling time as well as AC measurement accuracy.
Thus, it is often important that such capacitance be kept as
low as possible. Although the distributed capacitance of the
multiplexer card is generally fixed by design, there is one
area where you do have control over the capacitance in your
system: the connecting cables. To minimize capacitance,
keep all cables as short as possible.
Magnetic fields
When a conductor cuts through magnetic lines of force, a
very small current is generated. This phenomenon will frequently cause unwanted signals to occur in the test leads of a
switching multiplexer system. If the conductor has sufficient
length, even weak magnetic fields like those of the earth can
create sufficient signals to affect low-level measurements.
Two ways to reduce these effects are: (1) reduce the lengths
of the test leads, and (2) minimize the exposed circuit area.
In extreme cases, magnetic shielding may be required. Special metal with high permeability at low flux densities (such
as mu metal) is effective at reducing these effects.
Even when the conductor is stationary, magnetically induced
signals may still be a problem. Fields can be produced by
various signals such as the AC power line voltage. Large
inductors such as power transformers can generate substantial magnetic fields, so care must be taken to keep the switching and measuring circuits a good distance away from these
potential noise sources.
At high current levels, even a single conductor can generate
significant fields. These effects can be minimized by using
twisted pairs, which will cancel out most of the resulting
fields.
Radio frequency interference
E DUT
E OUT =
R PATH
E DUT R PATH
R DUT + R PATH
Figure 4-9
Voltage attenuation by path isolation resistance
4-8
Radio Frequency Interference (RFI) is a general term used to
describe electromagnetic interference over a wide range of
frequencies across the spectrum. Such RFI can be particularly troublesome at low signal levels, but it can also affect
measurements at high levels if the problem is of sufficient
severity.
Operation
RFI can be caused by steady-state sources such as radio or
TV signals or some types of electronic equipment (microprocessors, high speed digital circuits, etc.), or it can result from
impulse sources, as in the case of arcing in high-voltage environments. In either case, the effect on the measurement can
be considerable if enough of the unwanted signal is present.
Figure 4-11 shows how to connect several instruments together to eliminate this type of ground loop problem. Here,
only one instrument is connected to power line ground.
Instrument 1
Instrument 2
RFI can be minimized in several ways. The most obvious
method is to keep the equipment and signal leads as far away
from the RFI source as possible. Shielding the card, signal
leads, sources, and measuring instruments will often reduce
RFI to an acceptable level. In extreme cases, a specially constructed screen room may be required to sufficiently attenuate the troublesome signal.
Many instruments incorporate internal filtering that may
help to reduce RFI effects in some situations. In some cases,
additional external filtering may also be required. Keep in
mind, however, that filtering may have detrimental effects on
the desired signal.
Ground loops
When two or more instruments are connected together, care
must be taken to avoid unwanted signals caused by ground
loops. Ground loops usually occur when sensitive instrumentation is connected to other instrumentation with more
than one signal return path such as power line ground. As
shown in Figure 4-10, the resulting ground loop causes current to flow through the instrument LO signal leads and then
back through power line ground. This circulating current
develops a small but undesirable voltage between the LO terminals of the two instruments. This voltage will be added to
the source voltage, affecting the accuracy of the measurement.
Signal Leads
Instrument 1
Instrument 2
Instrument 3
Ground Loop
Current
Power Line Ground
Figure 4-10
Power line ground loops
Instrument 3
Power Line Ground
Figure 4-11
Eliminating ground loops
Ground loops are not normally a problem with instruments
having isolated LO terminals. However, all instruments in
the test setup may not be designed in this manner. When in
doubt, consult the manual for each instrument in the test
setup.
Keeping connectors clean
As is the case with any high-resistance device, the integrity
of the connectors can be damaged if they are not handled
properly. If connector insulation becomes contaminated, the
insulation resistance will be substantially reduced, affecting
high-impedance measurement paths.
Oils and salts from the skin can contaminate connector insulators, reducing their resistance. Also, contaminants present
in the air can be deposited on the insulator surface. To avoid
these problems, never touch the connector insulating
material. In addition, the multiplexer card should be used
only in clean, dry environments to avoid contamination.
If the connector insulators should become contaminated,
either by inadvertent touching or from airborne deposits,
they can be cleaned with a cotton swab dipped in clean methanol. After thoroughly cleaning, they should be allowed to
dry for several hours in a low-humidity environment before
use, or they can be dried more quickly using dry nitrogen.
AC frequency response
The AC frequency response of the Model 7035 is important
in test systems that switch AC signals. Refer to the specifications at the front of this manual.
4-9
Operation
4-10
5
Service Information
WARNING
The information in this section is
intended only for qualified service personnel. Some of the procedures may
expose you to hazardous voltages that
could result in personal injury or death.
Do not attempt to perform these procedures unless you are qualified to do so.
Introduction
This section contains information necessary to service the
Model 7035 multiplexer card and is arranged as follows:
• Handling and cleaning precautions — Discusses handling precautions and methods to clean the card should
it become contaminated.
• Performance verification — Covers the procedures
necessary to determine if the multiplexer card meets
stated specifications.
• Special handling of static-sensitive devices —
Reviews precautions necessary when handling staticsensitive devices.
• Principles of operation — Briefly discusses circuit
operation.
Handling and cleaning precautions
Because of the high-impedance areas on the Model 7035,
care should be taken when handling or servicing the card to
prevent possible contamination. The following precautions
should be taken when handling the card.
Handle the card only by the edges and shields. Do not touch
any board surfaces, connectors, or components not associated with the repair. Do not touch areas adjacent to electrical
contacts. When servicing the card, wear clean cotton gloves.
Do not store or operate the card in an environment where
dust could settle on the circuit board. Use dry nitrogen gas to
clean dust off the board if necessary.
Should it become necessary to use solder on the circuit
board, use an OA-based (organic activated) flux. Remove the
flux from the work areas when the repair has been completed. Use pure water along with clean cotton swabs or a
clean soft brush to remove the flux. Take care not to spread
the flux to other areas of the circuit board. Once the flux has
been removed, swab only the repaired area with methanol,
and then blowdry the board with dry nitrogen gas.
After cleaning, the card should be placed in a 50°C low
humidity environment for several hours before use.
• Troubleshooting — Presents some troubleshooting tips
for the Model 7035 including relay replacement precautions.
5-1
Service Information
Performance verification
Multiplexer connections
The following paragraphs discuss the performance verification procedures for the Model 7035, including path resistance, offset current, contact potential, and isolation.
The following information summarizes methods that can be
used to connect test instrumentation to the card. Detailed
connection information is provided in Section 3.
CAUTION
One method to make instrument connections to the multiplexer card is by hard-wiring a 96-pin female DIN connector
then mating it to the connector on the Model 7035. Input and
output shorting connections can also be done at the connector. The connector in the Model 7011-KIT-R connection kit
(Table 3-2) can be used for this purpose. Pin identification
for the connector is provided by Figure 3-1 and Table 3-1.
Contamination will degrade the performance of the card. To avoid contamination, always grasp the card by the side
edges or shields. Do not touch the connectors and do not touch the board surfaces or components. On plugs and
receptacles, do not touch areas adjacent
to the electrical contacts.
WARNING
When wiring a connector and device
under test, do not leave any exposed
wires or connections. No conductive
part of the circuit may be exposed. Properly cover the conductive parts, or death
by electric shock may occur.
NOTE
Failure of any performance verification
test may indicate that the card is contaminated. See the Handling and cleaning precautions paragraph to clean the card.
CAUTION
After making solder connections to a
connector, remove solder flux as
explained in the Handling and cleaning
precautions paragraph. Failure to clean
the solder connections could result in
degraded performance and prevent the
card from passing verification tests.
Environmental conditions
All verification measurements should be made at an ambient
temperature between 18° and 28°C and at a relative humidity
of less than 70%.
Recommended equipment
Table 5-1 summarizes the equipment necessary for performance verification along with an application for each unit.
Before pre-wiring any connectors or plugs, study the following test procedures to fully understand the connection
requirements.
Table 5-1
Verification equipment
Description
Model
Specifications
Applications
DMM
Keithley Model 2000
100Ω; 0.01%
Path resistance
Electrometer w/voltage source
Keithley Model
6517A
20pA, 200pA; 1%
100V source; 0.15%
Offset current, path isolation
Sensitive Digital Voltmeter
Keithley Model 182
3mV; 60ppm
Contact potential
Triax cable (unterminated)
Keithley Model 7025
⎯
Offset current
Low thermal cable
(unterminated)
Keithley Model 1484
⎯
Contact potential
5-2
Service Information
7. Connect INPUT LO and INPUT Ω4 WIRE LO to the HI
(H) terminal of bank A.
8. Install the Model 7035 in slot 1 (CARD 1) of the Model
7001/7002.
9. Turn on the Model 7001/7002 and program it to close
channel 1!1 (bank A, input 1). Verify that the resistance
of this path is <1Ω.
10. Open channel 1!1 and close channel 1!2 (bank A,
input 2). Verify that the resistance of this path is <1Ω.
11. Using the basic procedure in steps 9 and 10, check the
resistance of bank A HI (H) terminal paths for inputs 3
and 4 (channels 1!3 and 1!4).
12. Turn off the Model 7001/7002 and move the INPUT LO
and INPUT Ω4 WIRE LO test leads to the LO (L) terminal of bank A.
13. Repeat steps 9 and 10 to check the LO (L) terminal paths
of bank A (channels 1!1 through 1!4).
14. Repeat the basic procedure in steps 1 through 13 for
bank B through I (channels 1!5 through 1!36).
Channel resistance tests
Perform the following steps to verify that each contact of
every relay is closing properly and that the resistance is
within specification.
1. Turn off the Model 7001/7002 mainframe if it is on.
2. Turn on the Model 2000 and allow it to warm up for one
hour before making measurements.
3. Connect all input terminals of bank A together to form
one common terminal, as shown in Figure 5-1.
4. Set the Model 2000 to the 100Ω range and connect the
four test leads to the INPUT and INPUT Ω4 WIRE
jacks.
5. Short the four test leads together and zero the Model
2000. Leave zero enabled for the entire test.
6. Connect INPUT HI and INPUT Ω4 WIRE HI of the
Model 2000 to the common terminal (jumper on bank A
inputs). It is recommended that the physical connections
be made at inputs 1 and 4 of bank A, as shown in
Figure 5-1.
Input Ω 4 Wire
HI
LO
Customer-supplied
jumpers
Input HI
Input LO
POWER
A
Model 2000
(Measure 4-Wire Ohms)
1
2
3
4
H
Input Ω
4 Wire LO
L
B
H
L
Note: Connections are set
up to test Bank A HI.
C
H
L
D
Bank
Outputs
H
L
E
H
L
F
H
L
G
H
L
H
H
L
I
H
L
H L
H L
H L
H L
Bank Inputs
Model 7035
Figure 5-1
Path resistance test connections
5-3
Service Information
Offset current tests
These tests check for leakage current between HI (H) and LO
(L) (differential offset current) and from HI (H) and LO (L)
to chassis (common-mode offset current) of each pathway. In
general, these tests are performed by measuring the leakage
current with an electrometer. In the following procedure, the
Model 6517A is used to measure the leakage current. Test
connections are shown in Figure 5-2.
Perform the following procedure to check offset current:
1. Turn off the Model 7001/7002 mainframe if it is on, and
remove any jumpers or wires connected to the card.
2. Connect the triax cable to the Model 6517A, but do not
connect it to the card at this time.
3. Turn on the Model 6517A and allow the unit to warm up
for two hours before testing.
4. After warm up, select the 200pA range, and enable zero
check and zero correct the instrument. Leave zero correct enabled for the entire procedure.
5. Connect the triax cable to bank A HI and LO, as shown
in A.
6. Install the Model 7035 in slot 1 (CARD 1) of the mainframe.
5-4
7. Turn on the mainframe.
8. Program the unit to close channel 1!1 (bank A, input 1).
9. On the Model 6517A, disable zero check and allow the
reading to settle. Verify that the reading is <100pA. This
specification is the offset (leakage) current of the pathway.
10. Enable zero check on the Model 6517A and open channel 1!1 from the front panel of the mainframe.
11. Repeat the basic procedure in steps 8 through 10 to
check the rest of the pathways (inputs 2 through 4) of
bank A (channels 1!2 through 1!4).
12. Turn off the mainframe and change the electrometer
connections to the next bank.
13. Repeat the basic procedure in steps 7 through 12 to
check bank B through I, (channels 1!5 through 1!36).
14. Turn off the Model 7001/7002 and change the electrometer connections as shown in B. Note that electrometer
HI is connected to HI and LO of the bank A output,
which are jumpered together. Electrometer LO is connected to chassis.
15. Repeat steps 7 through 13 to check that the common
mode offset current is <100pA.
Service Information
Model 7025
Unterminated
Triax Cable
Bank Inputs
WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.
90-110V
105-125V
180-220V
210-250V
115V
!
HI (Red)
A
1
2
3
4
H
L
!
CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.
LO (Black)
B
H
Model 6517A
(Measure Current)
L
C
Note: Setup shown is configured
to test Bank A pathways for
offset current.
H
L
D
H
L
E
H
L
Bank Outputs
F
H
L
G
H
L
H
H
L
I
H
L
H
L
H
Model 7025
Unterminated
Triax Cable
90-110V
105-125V
115V
CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.
L
H
L
Bank Inputs
180-220V
210-250V
!
H
Model 7035
A) Differential
WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.
!
L
HI (Red)
A
LO
(Black)
B
Model 6517A
(Measure Current)
1
2
3
4
H
L
H
L
C
H
Short
L
D
Note: Setup shown is configured
to test Bank A pathways for
offset current.
H
L
E
H
L
F
H
Bank Outputs
L
G
H
L
H
H
L
I
H
L
H
L
H
L
H
L
H
L
Model 7035
B) Common-Mode
Figure 5-2
Differential offset current test connections
5-5
Service Information
Contact potential tests
These tests check the EMF generated by each relay contact
pair (H and L) for each pathway. The tests simply consist of
using a sensitive digital voltmeter (Model 182) to measure
the contact potential (Figure 5-3).
Perform the following procedure to check the contact potential of each path:
1. Turn off the Model 7001/7002 mainframe if it is on.
2. Place jumpers between banks A-B, B-C, C-D, D-E, E-F,
F-G, G-H, and H-I.
3. Turn on the Model 182 and allow the unit to warm up to
achieve rated accuracy.
4. Place a short between HI to LO on each input (channels
1-36).
5. Place a short between HI to LO on output bank I (long
enough to cut with wire cutters).
6. Connect the Model 182 input leads to HI and LO output
bank A using copper wires.
5-6
7. Install the Model 7035 in the Model 7001/7002 slot 1
and turn on the mainframe.
8. Allow Models 7001/7002, 7035, and 182 to warm up for
two hours.
9. Select the 3mV range on the Model 182.
10. Press REL READING (on the Model 182) to null out
internal offsets. Leave REL READING enabled for the
entire procedure.
11. Turn off the mainframe. Remove the Model 7035 from
slot 1. Cut the short on bank I output HI to LO.
12. Install the Model 7035 in mainframe slot 1, and turn on
power.
13. Wait 15 minutes.
14. Program the mainframe to close channel 1!1.
15. After settling, verify that reading on the Model 182 is
<1µV.
16. From the mainframe, open channel 1!1.
17. Repeat steps 14 through 16 for all 36 channels.
Service Information
Model 1484
Low Thermal Cable
(Unterminated)
KEITHLEY
182 SENSITIVE DIGITAL VOLTMETER
Low thermal short.
Clean, high purity
copper (1 of 36)
Bank Inputs
TRG
SRQ
REM
TALK
LSTN
HI
1
A
2
3
4
H
LO
Model 182
L
B
H
L
C
Note: Setup shown is configured
to test Banks A through I
relays for contact potential.
H
L
D
H
L
Bank
Outputs
E
H
L
F
H
L
G
H
Customer-supplied
jumpers
L
H
H
L
I
Low thermal short.
Clean, high purity
copper (1 of 1)
H
L
H
L
H
L
H
L
H
L
Model 7035
Figure 5-3
Contact potential test connections
5-7
Service Information
Bank and channel-to-channel isolation tests
1. Turn off the Model 7001/7002 mainframe if it is on, and
remove any jumpers or test leads connected to the multiplexer.
2. Turn on the Model 6517A and allow the unit to warm up
for two hours before testing.
3. Connect the electrometer to the Model 7035 as shown in
Figure 5-4.
4. Install the Model 7035 in slot 1 (CARD 1) and turn on
the mainframe.
Bank isolation tests check the leakage resistance between
adjacent banks. Channel-to-channel isolation tests check the
leakage resistance between a bank output connection and a
bank input connection with an adjacent bank input relay
closed. In general, the tests are performed by applying a voltage (60V) across the leakage resistance and then measuring
the current. The isolation resistance is then calculated as
R = V/I. In the following procedure, the Model 6517A functions as both a voltage source and an ammeter. In the R function, the Model 6517A internally calculates the resistance
from the known voltage and current levels and displays the
resistive value.
WARNING
The following steps use a 60V source. Be
sure to remove power from the circuit
before making connection changes.
Perform the following steps to check bank and channel-tochannel isolation:
5. Place the Model 6517A in the R measurement function.
Ground Link
Removed
Model 7025
Unterminated
Triax Cable
Banana to
Banana Cable
Bank Inputs
WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.
90-110V
105-125V
1
180-220V
210-250V
HI
115V
!
A
2
3
4
H
(Red)
L
!
B
CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.
Source V and
Measure V/I
H
L
Model 6517A
C
H
L
Unterminated
Banana Cables
D
H
L
E
Note: Setup shown is configured
to test isolation between
Bank A and Bank B.
Bank
Outputs
H
L
F
H
L
G
H
L
H
H
L
I
H
L
H
L
H
L
H
Model 7035
Figure 5-4
Bank isolation test connections
5-8
L
H
L
Service Information
6. Turn on the Model 7001/7002 and program it to close
channels 1!1 and 1!6 (bank A, input 1 and bank B,
input 2).
7. On the Model 6517A, source +60V.
8. After allowing the reading on the Model 6517A to settle,
verify that it is >1GΩ (109Ω). This measurement is the
leakage resistance (bank isolation) between bank A,
input 1 and bank B, input 2.
9. Turn off the Model 6517A voltage source and the Model
7001/7002.
10. Move the electrometer connections to banks B and C.
11. Using Table5-2 as a guide, repeat the basic procedure of
steps 6 through 10 for the rest of the path pairs (test
numbers 2 through 9 in the table).
Table 5-2
Bank isolation test summary
Test
number
Bank isolation
Test equipment location
Channels closed*
1
Bank A, Input 1 to Bank B, Input 2
Bank A and Bank B
1!1 and 1!6
2
Bank B, Input 2 to Bank C, Input 3
Bank B and Bank C
1!6 and 1!11
3
Bank C, Input 3 to Bank D, Input 4
Bank C and Bank D
1!11 and 1!16
4
Bank D, Input 1 to Bank E, Input 2
Bank D and Bank E
1!13 and 1!18
5
Bank E, Input 2 to Bank F, Input 3
Bank E and Bank F
1!18 and 1!23
6
Bank F, Input 3 to Bank G, Input 4
Bank F and Bank G
1!23 and 1!28
7
Bank G, Input 1 to Bank H, Input 2
Bank G and Bank H
1!25 and 1!30
8
Bank H, Input 2 to Bank I, Input 3
Bank H and Bank I
1!30 and 1!35
9
Bank H, Input 3 to Bank I, Input 4
Bank H and Bank I
1!31 and 1!36
*Assumes Model 7035 is installed in slot 1 of the mainframe. Program as slot (1) and channel.
5-9
Service Information
12. Turn off the Model 6517A voltage source and the Model
7001/7002.
16. On the Model 6517A, source +60V.
17. After allowing the reading on the Model 6517A to settle,
verify that it is >1GΩ (109Ω).
18. Turn off the Model 6517A voltage source and the Model
7001/7002.
19. Using Table 5-3 as a guide, perform tests 2 and 3 using
steps 13 through 18 for the remaining bank A inputs.
Remember to move bank input connections as indicated
in the table.
20. Use Table 5-3 (test numbers 4 through 29) and steps 6
through 19 to test banks B through I inputs. Move the
electrometer connections shown in Figure 5-5 to the
appropriate bank and move the bank input connections
as indicated in the table.
NOTE
Refer to the following procedure to check
channel-to-channel isolation.
13. Connect the Model 6517A to the card as shown in
Figure 5-5.
14. Install the Model 7035 in slot 1 and turn on the mainframe.
15. Program the mainframe to close channel 1!2 (bank A,
input 2). Make sure all other channels are open.
Ground Link
Removed
Model 7025
Unterminated
Triax Cable
Banana to
Banana Cable
Customer-supplied
Jumper
Bank Inputs
WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.
90-110V
105-125V
180-220V
210-250V
115V
!
1
A
HI
(Red)
2
3
4
H
L
!
CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.
Source V and
Measure V/I
Model 6517A
B
H
L
C
H
L
D
H
L
E
H
L
F
H
L
G
H
L
H
H
L
I
H
L
Unterminated
Banana Cables
Bank
Outputs
Note: Setup shown is configured
to test isolation between
path 1!1 and 1!2.
H
L
H
L
H
Model 7035
Figure 5-5
Channel-to-channel isolation test connections
5-10
L
H
L
Service Information
Table 5-3
Channel-to-channel isolation test summary
Test
number
Channel
closed*
Channel-to-channel isolation
Test equipment location
1
2
3
Bank A, Input 1 to Bank A, Input 2
Bank A, Input 2 to Bank A, Input 3
Bank A, Input 3 to Bank A, Input 4
Bank A and Input 1
Bank A and Input 2
Bank A and Input 3
1!2
1!3
1!4
5
6
7
Bank B, Input 5 to Bank B, Input 6
Bank B, Input 6 to Bank B, Input 7
Bank B, Input 7 to Bank B, Input 8
Bank B and Input 5
Bank B and Input 6
Bank B and Input 7
1!6
1!7
1!8
9
10
11
Bank C, Input 9 to Bank C, Input 10
Bank C, Input 10 to Bank C, Input 11
Bank C, Input 11 to Bank C, Input 12
Bank C and Input 9
Bank C and Input 10
Bank C and Input 11
1!10
1!11
1!12
12
13
14
Bank D, Input 13 to Bank D, Input 14
Bank D, Input 14 to Bank D, Input 15
Bank D, Input 15 to Bank D, Input 16
Bank D and Input 13
Bank D and Input 14
Bank D and Input 15
1!14
1!15
1!16
15
16
17
Bank E, Input 17 to Bank E, Input 18
Bank E, Input 18 to Bank E, Input 19
Bank E, Input 19 to Bank E, Input 20
Bank E and Input 17
Bank E and Input 18
Bank E and Input 19
1!18
1!19
1!20
18
19
20
Bank F, Input 21 to Bank F, Input 22
Bank F, Input 22 to Bank F, Input 23
Bank F, Input 23 to Bank F, Input 24
Bank F and Input 21
Bank F and Input 22
Bank F and Input 23
1!22
1!23
1!24
21
22
23
Bank G, Input 25 to Bank G, Input 26
Bank G, Input 26 to Bank G, Input 27
Bank G, Input 27 to Bank G, Input 28
Bank G and Input 25
Bank G and Input 26
Bank G and Input 27
1!26
1!27
1!28
24
25
26
Bank H, Input 29 to Bank H, Input 30
Bank H, Input 30 to Bank H, Input 31
Bank H, Input 31 to Bank H, Input 32
Bank H and Input 29
Bank H and Input 30
Bank H and Input 31
1!30
1!31
1!32
27
28
29
Bank I, Input 33 to Bank I, Input 34
Bank I, Input 34 to Bank I, Input 35
Bank I, Input 35 to Bank I, Input 36
Bank I and Input 33
Bank I and Input 34
Bank I and Input 35
1!34
1!35
1!36
*Assumes Model 7035 is installed in slot 1 of the mainframe. Program as slot (1) and channel.
5-11
Service Information
Differential and common-mode isolation tests
WARNING
These tests check the leakage resistance (isolation) between
HI (H) and LO (L) (differential) and from HI (H) and LO (L)
to chassis (common-mode) of every bank and channel. In
general, the test is performed by applying a voltage (60V)
across the terminals and then measuring the leakage current.
The isolation resistance is then calculated as R = V/I. In the
following procedure, the Model 6517A functions as a voltage source and an ammeter. In the R function, the Model
6517A internally calculates the resistance from the known
voltage and current levels and displays the resistance value.
The following steps use a 60V source. Be
sure to remove power from the circuit
before making connection changes.
Perform the following steps to check differential and common mode isolation:
1. Turn off the Model 7001/7002 mainframe if it is on, and
remove any jumpers and test leads connected to the
card.
2. Turn on the Model 6517A and allow the unit to warm up
for two hours for rated accuracy.
5-12
3. On the Model 6517A, set the voltage source for +60V.
Make sure the voltage source is off.
4. Place the Model 6517A in the R measurement function.
5. With the Model 6517A off, connect the electrometer to
bank A as shown in Figure 5-6.
6. Install the Model 7035 in slot 1 (CARD 1), and turn on
the mainframe.
7. Make sure all the relays are open.
8. On the Model 6517A, source +60V.
9. After allowing the reading on the Model 6517A to settle,
verify that it is >1GΩ (109Ω). This measurement is the
differential leakage resistance (isolation) of bank A.
Service Information
Ground Link
Removed
Model 7025
Unterminated
Triax Cable
Banana to
Banana Cable
Bank Inputs
WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.
90-110V
105-125V
1
180-220V
210-250V
115V
!
HI
(Red)
A
2
3
4
H
L
!
CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.
B
Source V and
Measure V/I
H
L
Model 6517A
C
H
L
Unterminated
Banana Cable
D
H
L
Note: Setup shown is configured to
test isolation between HI and
LO of Bank A.
E
H
Bank
Outputs
L
F
H
L
G
H
L
H
H
L
I
H
L
H
L
H
L
H
L
H
L
Model 7035
Figure 5-6
Differential isolation test connections
5-13
Service Information
10. Turn off the Model 6517A voltage source.
11. Program the mainframe to close channel 1!1 (bank A,
input 1).
12. On the Model 6517A, source +60V.
13. After allowing the reading on the Model 6517A to settle,
verify that it is also >1GΩ (109Ω). This measurement
checks the differential isolation of input 1.
14. Using Table 5-4 as a guide, repeat the basic procedure in
steps 10 through 13 to test inputs 2 through 4 of bank A
(test numbers 3 through 5 of the table).
15. Using Table 5-4 (test numbers 6 through 45), repeat the
basic procedure in steps 5 through 14 to test banks B
through I.
16. Turn off the Model 6517A voltage source.
NOTE
Refer to the following procedure to check
common-mode isolation.
17. Turn off the mainframe and connect the electrometer to
the Model 7035 as shown in Figure 5-7.
18. Repeat steps 3 through 15 to check common mode isolation. Verify that each reading is >1GΩ (109Ω).
Table 5-4
Differential and common-mode isolation testing
Test
number
Differential or common mode isolation
Channel
closed*
Test
number
Differential or common mode isolation
1
2
3
4
5
Bank A
Bank A, Input 1
Bank A, Input 2
Bank A, Input 3
Bank A, Input 4
None
1!1
1!2
1!3
1!4
26
27
28
29
30
Bank F
Bank F, Input 21
Bank F, Input 22
Bank F, Input 23
Bank F, Input 24
None
1!21
1!22
1!23
1!24
6
7
8
9
10
Bank B
Bank B, Input 5
Bank B, Input 6
Bank B, Input 7
Bank B, Input 8
None
1!5
1!6
1!7
1!8
31
32
33
34
35
Bank G
Bank G, Input 25
Bank G, Input 26
Bank G, Input 27
Bank G, Input 28
None
1!25
1!26
1!27
1!28
11
12
13
14
15
Bank C
Bank C, Input 9
Bank C, Input 10
Bank C, Input 11
Bank C, Input 12
None
1!9
1!10
1!11
1!12
36
37
38
39
40
Bank H
Bank H, Input 29
Bank H, Input 30
Bank H, Input 31
Bank H, Input 32
None
1!29
1!30
1!31
1!32
16
17
18
19
20
Bank D
Bank D, Input 13
Bank D, Input 14
Bank D, Input 15
Bank D, Input 16
None
1!13
1!14
1!15
1!16
41
42
43
44
45
Bank I
Bank I, Input 33
Bank I, Input 34
Bank I, Input 35
Bank I, Input 36
None
1!33
1!34
1!35
1!36
21
22
23
24
25
Bank E
Bank E, Input 17
Bank E, Input 18
Bank E, Input 19
Bank E, Input 20
None
1!17
1!18
1!19
1!20
*Assumes Model 7035 is installed in slot 1 of the mainframe. Program as slot (1) and channel.
5-14
Channel
closed*
Service Information
Ground Link
Removed
Model 7025
Unterminated
Triax Cable
Banana to
Banana Cable
Customer-supplied
Jumper
Bank Inputs
WARNING:NO INTERNAL OPERATOR SERVICABLE PARTS,SERVICE BY QUALIFIED PERSONNEL ONLY.
90-110V
105-125V
1
180-220V
210-250V
115V
!
HI
(Red)
A
2
3
4
H
L
!
CAUTION:FOR CONTINUED PROTECTION AGAINST FIRE HAZARD,REPLACE FUSE WITH SAME TYPE AND RATING.
B
Source V and
Measure V/I
H
L
Model 6517A
C
H
L
Unterminated
Banana Cable
D
H
L
Note: Setup shown is configured
to test isolation between
Bank A and chassis ground.
E
H
L
Bank
Outputs
F
H
L
G
H
L
H
H
L
I
H
L
H
L
H
L
H
L
H
L
Model 7035
Figure 5-7
Common-mode isolation test connections
5-15
Service Information
Special handling of static-sensitive
devices
CMOS and other high-impedance devices are subject to possible static discharge damage because of the high-impedance
levels involved. The following precautions pertain specifically to static-sensitive devices. However, since many
devices in the Model 7035 are static-sensitive, it is recommended that they all be treated as static-sensitive.
1. Such devices should be transported and handled only in
containers specially designed to prevent or dissipate
static buildup. Typically, these devices will be received
in anti-static containers made of plastic or foam. Keep
these parts in their original containers until ready for
installation.
2. Remove the devices from their protective containers
only at a properly grounded work station. Also, ground
yourself with a suitable wrist strap while working with
these devices.
3. Handle the devices only by the body; do not touch the
pins.
CLK
Data
To Mainframe
Relay
Drivers
4. Any printed circuit board into which the device is to be
inserted must first be grounded to the bench or table.
5. Use only anti-static type de-soldering tools and
grounded-tip soldering irons.
Principles of operation
The paragraphs below discuss the basic operating principles
for the Model 7035 and can be used as an aid in troubleshooting the card. The schematic drawings of the Model 7035 card
are shown on drawing numbers 7035-106 and 7035-176 at
the end of Section 6.
Block diagram
Figure 5-8 shows a simplified block diagram of the
Model 7035. Key elements include the relay drivers and
relays, as well as the ROM, which contains card ID and configuration information. These various elements are discussed
in the following paragraphs.
Relays
User connections
Strobe
Enable
U101U105
+3.5V (Steady State)
+5.7 (≈ 100 msec during
relay actuation)
ID CLK
To Mainframe
ROM
ID DATA
U107
+6V, +15V
Figure 5-8
Model 7035 block diagram
5-16
Relay
Power
Control
Q101, Q102
U106, U108
Service Information
ID data circuits
Upon power-up, card identification information from each
card is read by the mainframe. This ID data includes such
information as card ID, hardware settling time, and relay
configuration information.
ID data is contained within an on-card EEPROM (U107). In
order to read this information, the sequence described below
is performed on power-up.
1. The IDDATA line (pin 5 of U107) is set from high to low
while the IDCLK line (pin 6 of U107) is held high. This
action initiates a start command to the ROM to transmit
data serially to the mainframe (Figure 5-9).
ID CLK
ID DATA
Start Bit
Stop Bit
4. Once all data is received, the mainframe sends a stop
command, which is a low-to-high transition of the
IDDATA line with the IDCLK line held high
(Figure 5-9).
Relay control
Card relays are controlled by serial data transmitted via the
relay DATA line. A total of five bytes for each card are
shifted in serial fashion into latches located in the card relay
driver ICs. The serial data is clocked in by the CLK line. As
data overflows one register, it is fed out the Q’s line of the
register down the chain.
Once all five bytes have shifted into the card, the STROBE
line is set high to latch the relay information into the Q outputs of the relay drivers, and the appropriate relays are energized (assuming the driver outputs are enabled, as discussed
below). Note that a relay driver output goes low to energize
the corresponding relay.
Relay power control
A relay power control circuit, made up of Q101, Q102,
U106, U108, and associated components, keeps power dissipated in relay coils at a minimum, thus reducing possible
problems caused by thermal EMFs.
Figure 5-9
Start and stop sequences
2. The mainframe sends the ROM address location to be
read over the IDDATA line. The ROM then transmits an
acknowledge signal back to the mainframe, and it then
transmits data at that location back to the mainframe
(Figure 5-10).
3. The mainframe then transmits an acknowledge signal,
indicating that it requires more data. The ROM will then
sequentially transmit data after each acknowledge signal it receives.
During steady-state operation, the relay supply voltage, +V,
is regulated to +3.5V to minimize coil power dissipation.
When a relay is first closed, the STROBE pulse applied to
U106 changes the parameters of the relay supply voltage regulator, Q101, allowing the relay supply voltage, +V, to rise to
+5.7V for about 100msec. This brief voltage rise ensures that
relays close as quickly as possible. After the 100msec period
has elapsed, the relay supply voltage (+V) drops back down
to its nominal steady-state value of +3.5V.
ID CLK
1
8
9
IDDATA
(Data output
from mainframe
or ROM)
IDDAT
(Data output
from mainframe
or ROM)
Start
Acknowledge
Figure 5-10
Transmit and acknowledge sequence
5-17
Service Information
Power-on safeguard
Troubleshooting access
NOTE
The power-on safeguard circuit is actually
located on the digital board in the Model
7001/7002 mainframe.
A power-on safeguard circuit, made up of U114 (a D-type
flip-flop) and associated components, ensures that relays do
not randomly energize on power-up and power-down. This
circuit disables all relays (all relays are open) during powerup and power-down periods.
The PRESET line on the D-type flip-flop is controlled by the
68302 microprocessor, while the CLK line of the D-type
flip-flop is controlled by a port line on the 68302 processor.
The Q output of the flip-flop drives each card relay driver IC
enable pin (U101-U105, pin 8).
When the 68302 microprocessor is in the reset mode, the
flip-flop PRESET line is held low, and Q out immediately
goes high, disabling all relays (relay driver IC enable pins are
high, disabling the relays.) After the reset condition elapses
(≈200msec), PRESET goes high while Q out stays high.
When the first valid STROBE pulse occurs, a low logic level
is clocked into the D-type flip-flop, setting Q out low and
enabling all relay drivers simultaneously. Note that Q out
stays low, (enabling relay drivers) until the 68302 processor
goes into a reset condition.
Troubleshooting
Troubleshooting equipment
Table 5-5 summarizes recommended equipment for troubleshooting the Model 7035.
Table 5-5
Recommended troubleshooting equipment
Description
Manufacturer
and model
Application
Multimeter
Keithley 2000
Measure DC voltages
Oscilloscope
TEK 2243
View logic waveforms
5-18
In order to gain access to the relay card top surface to measure voltages under actual operation conditions, perform the
following steps:
1.
2.
3.
4.
Disconnect the connector card from the relay card.
Remove the Model 7001/7002 cover.
Install the relay card in the CARD 1 slot location.
Turn on Model 7001/7002 power to measure voltages
(see the following Troubleshooting procedure
paragraph).
Troubleshooting procedure
Table 5-6 summarizes card troubleshooting.
WARNING
Lethal voltages are present within the
Model 7001/7002 mainframe. Some of
the procedures may expose you to hazardous voltages. Observe standard
safety precautions for dealing with live
circuits. Failure to do so could result in
personal injury or death.
CAUTION
Observe the following precautions when
troubleshooting or repairing the card:
To avoid contamination, which could
degrade card performance, always handle the card only by the handle and side
edges. Do not touch edge connectors,
board surfaces, or components on the
card. Also, do not touch areas adjacent
to electrical contacts on connectors.
Use care when removing relays from the
PC board to avoid pulling traces away
from the circuit board. Before attempting to remove a relay, use an appropriate de-soldering tool such as a solder
sucker to clear each mounting hole completely free of solder. Each relay pin
must be free to move in its mounting
hole before removal. Also, make certain
that no burrs are present on the ends of
the relay pins.
Service Information
Table 5-6
Troubleshooting procedure
Step
Item/component
Required condition
Comments
1
GND test point (C114)
All voltages referenced to digital ground
(GND pad).
2
+6V pad (Q101, pin 2)
+6VDC
Relay voltage.
3
+5V pad (C103)
+5VDC
Logic voltage.
4
+15V pad (R101)
+15VDC
Relay bias voltage.
5
+V pad (C114)
+3.5VDC*
Regulated relay voltage.
6
U107, pin 6
ID CLK pulses
During power-up only.
7
U107, pin 5
ID DATA pulses
During power-up only.
8
U101, pin 7
STROBE pulse
End of re lay update sequence.
9
U101, pin 2
CLK pulses
During relay update sequence only.
10
U101, pin 3
DATA pulses
During relay update sequence only.
11
U101-U105, pins 10-18
Low with relay energized; high
with relay de-energized.
Relay driver outputs.
*+3.5VDC present at +V pad under steady-state conditions. This voltage rises to +5.7VDC for about 100msec when relay configuration is changed.
5-19
Service Information
5-20
6
Replaceable Parts
Introduction
This section contains replacement parts information, schematic diagrams, and component layout drawings for the
Model 7035.
Parts lists
Parts lists for the various circuit boards are included in tables
integrated with schematic diagrams and component layout
drawings for the boards. Parts are listed alphabetically in
order of circuit designation.
Ordering information
To place an order, or to obtain information concerning
replacement parts, contact your Keithley representative or
the factory (see inside front cover for addresses). When
ordering parts, be sure to include the following information:
1.
2.
3.
4.
5.
Card model number 7035
Card serial number
Part description
Circuit description, if applicable
Keithley part number
Factory service
If the card is to be returned to Keithley Instruments for repair,
perform the following:
1. Complete the service form at the back of this manual
and include it with the card.
2. Carefully pack the card in the original packing carton or
the equivalent.
3. Write ATTENTION REPAIR DEPT on the shipping
label.
NOTE
It is not necessary to return the mainframe
with the card.
Component layouts and schematic
diagrams
Component layout drawings and schematic diagrams are
included on the following pages integrated with the parts
lists:
Table 6-1 — Parts List, Relay Card for Model 7035.
7035-100 — Component Layout, Relay Card for Model
C7035.
7035-106 — Schematic, Relay Card for Model 7035.
Table 6-2 — Parts List, Mass-Terminated Connector Card
for Model 7035.
7035-170 — Component Layout, Mass-Terminated Connector Card for Model 7035.
7035-176 — Schematic, Mass-Terminated Connector Card
for Model 7035.
Table 6-3 — Parts List, Model 7011-KIT-R 96-pin Female
DIN Connector Kit.
6-1
Replaceable Parts
Table 6-1
Relay card for Model 7035 parts list
Circuit
designation
6-2
Description
2-56×3/16 PHILLIPS PAN HEAD SCREW
(RELAY BOARD TO SHIELD)
2-56×5/8 PHILLIPS PAN HEAD FASTENER
2-56×5/16 PHILLIPS PAN HEAD SEMS SCREW
(CONNECTOR TO SHIELD)
4-40×3/16 PHILLIPS PAN HEAD SEMS SCREW
4-40 PEM NUT
EJECTOR ARM
IC, SERIAL EPROM, 24C01P
ROLL PIN (FOR EJECTOR ARMS)
SHIELD
STANDOFF, 2 CLEARANCE
Keithley
part no.
2-56×3/16PPH
FA-245-1
2-56×5/16PPHSEM
4-40×3/16PPHSEM
FA-131
7011-301B
IC-737
DP-6-1
7011-305C
ST-204-1
C101-107, 112,
114,116,123,125
C108,113,115
C109,111
C110
C122,124
CAP, 0.1mF, 20% 50V, CERAMIC
C-365-.1
CAP, 150pF, 10%, 1000V, CERAMIC
CAP, 1mF, 20% 50V, CERAMIC
CAP, 0.001mF, 20%, 500V, CERAMIC
CAP, 10mF, -20+100% 25V, ALUM ELEC
C-64-150P
C-237-1
C-22-.001
C-314-10
J1002,1003
CONN, 48-PIN, 3-ROW
CS-736-2
K101-136
RELAY, ULTRA-SMALL POLARIZED, TF2E-5V
RL-149
P2001
CONN, 32-PIN, 2-ROW
CS-775-1
Q101
Q102
TRANS, NPN PWR, TIP31 (T0-220AB)
TRANS, N CHAN MOSPOW FET, 2N7000 (T0-92)
TG-253
TG-195
R101,102
R103
R104
R105
R106
R107
RES, 560, 10%, 1/2W, COMPOSITION
RES, 1K, 1%, 1/8W, METAL FILM
RES, 2.49K, 1%, 1/8W, METAL FILM
RES, 1.15K, 1%, 1/8W, METAL FILM
RES, 10K, 5%, 1/4W, COMPOSITION OR FILM
RES, 220K, 5%, 1/4W, COMPOSITION OR FILM
R-1-560
R-88-1K
R-88-2.49K
R-88-1.15K
R-76-10K
R-76-220K
S107
SOCKET
S0-72
ST101
4-40×0.812 STANDOFF
ST-137-20
U101-105
U106
U107
U108
IC, 8-BIT SERIAL-IN LATCH DRIVER, 5841A
IC, RETRIG MONO MULTIVIB, 74HC123
PROGRAM
IC, AJD SHUNT REGULATOR, TL431CLP
IC-536
IC-492
7035-800A01
IC-677
Replaceable Parts
Table 6-2
Mass-terminated connector card for Model 7035 parts list
Circuit
designation
Description
2-56×3/16 PHILLIPS PAN HEAD SCREW (FOR SHIELD)
2-56×3/8 PHILLIPS PAN HEAD SCREW (FOR BRACKET)
2-56×7/16 PHILLIPS PAN HEAD SCREW
(FOR SHIELD AND SHIMS)
4-40×1/4 PHILLIPS PAN HEAD SEMS SCREW
(RELAY BOARD TO CONNECTOR BOARD)
BRACKET
CONNECTOR SHIM
SHIELD
STANDOFF
Keithley
part no.
2-56×3/16PPH
2-56×3/8PPH
2-56×7/16PPH
4-40×1/4PPHSEM
7011-307
7011-309A
7011-311A
ST-203-1
J1004
CONN, 96-PIN, 3-ROW
CS-514
P1002,1003
CONN, 48-PIN, 3-ROW
CS-748-3
Table 6-3
Model 7011-KIT-R 96-pin female DIN connector kit parts list
Description
96-PIN FEMALE DIN CONNECTOR
BUSHING, STRAIN RELIEF
CABLE ADAPTER, REAR EXIT (INCLUDES TWO CABLE
CLAMPS)
CONNECTOR HOUSING
Keithley
part no.
CS-787-1
BU-27
CC-64
CS-788
6-3
A
B
C
D
4
7035-170
4
NO.
J1004
NOTE:
P1002
3
CLEVELAND, OHIO 44139
2
XX=+.01
XXX=+.005
ANG.=+1
FRAC.=+1/64
DIM. TOL. UNLESS OTHERWISE SPECIFIED
DIM ARE IN IN. UNLESS OTHERWISE NOTED
MAXIMUM VOLTAGE
RATING OF CONNECTORS.
KEITHLEY INSTRUMENTS INC.
KEITHLEY
WARNING: USER SUPPLIED
LETHAL VOLTAGE MAY BE
PRESENT ON CONNECTORS
OR P.C. BOARD.
2
! REFER TO MANUAL FOR
FOR COMPONENT INFORMATION, PLEASE REFER TO PRODUCT STRUCTURE.
P1003
3
CAB
2/18/97
ECA NO.
APPR.
SCALE
1:1
DO NOT SCALE THIS DRAWING
DRN
DATE
A
LTR.
C
NO.
TITLE
REVISION
1
USED ON
NEXT ASSEMBLY
ENG.
QTY.
DATE
PG
1 OF 1
7035-170
COMPONENT LAYOUT
CONNECTOR BOARD
MODEL
1
A
B
C
D
Index
A
C
D
AC frequency response 5-14
Analog matrix maximum signal
levels 5-1
Card connections and installation 4-1
Card installation 4-18
Card removal 4-18
Channel assignments 5-2
Channel functionality test 6-10
Channel resistance tests 6-3
Closing and opening channels 5-4
Common-emitter characteristics
curves 5-12
Component layouts and schematic diagrams 7-1
Configuring digital I/O input pull-up
resistance 4-4
Configuring digital I/O output
logic 4-4
Contact potential tests 6-6
Controlling devices using pull-up
resistors 3-2
Controlling pull-up devices 3-1
DC parameter checks 5-11
Differential and common-mode
isolation test 6-8
Differential switching 2-3
Digital I/O configuration 3-1
Digital I/O connections 4-2
Digital I/O input channel control 6-13
Digital I/O maximum signal
levels 5-1
Digital I/O output channel
controls 6-13
Digital inputs 3-3
Dgital outputs 3-1
B
Backplane jumpers 2-1
Backplane row jumpers 4-2
Basic matrix configuration (5 × 6) 2-1
Block diagram 6-11
E
Environmental conditions 6-2
i-1
F
K
P
Factory service 7-1
Features 1-1
Four-terminal ohms measurements 5-8
Keeping connectors clean 5-14
Partial matrix implementation 2-9
Parts lists 7-1
Path isolation 5-12
Path isolation tests 6-7
Performance verification 6-2
Power-on safeguard 6-13
Power limits 5-1
Principles of operation 6-11
Pull-up resistors 4-3
M
G
General information 1-1
Ground loops 5-14
H
Handling and cleaning
precautions 6-1
Handling precautions 1-2, 4-1
I
ID data circuits 6-12
IEEE-488 bus operation 5-5
Input channels 5-1
Input connection scheme 4-17
Inspection for damage 1-2
Instruction manual 1-2
J
Jumper installation 4-2
Jumper removal 4-2
i-2
Magnetic fields 5-13
Mainframe control of the card 5-1
Mainframe matrix expansion 2-8
Manual addenda 1-2
Matrix configuration 2-1
Matrix connections 4-2, 6-2
Matrix expansion 2-5
Matrix relay control 6-13
Matrix relay power control 6-13
Matrix switching examples 5-7
Measurement considerations 5-12
Mixing card types 2-8
Model 7022 installation and
removal 4-18
Multi-pin (mass termination)
connector card 4-5
R
Radio frequency interference 5-13
Reading digital I/O input channels 5-6
Reading input channels 5-5
Recommended equipment 6-2
Repacking for shipment 1-3
Replaceable parts 7-1
S
N
Narrow matrix expansion (4 × 12
matrix) 2-6
O
Offset current tests 6-4
Operation 5-1
Optional accessories 1-3
Ordering information 7-1
Output channels 5-1
Output connection schemes 4-16
Safety symbols and terms 1-2
Scanning channels 5-4
Scanning output channels 5-5
Sensing 2-4
Separate switching systems 2-5
Service information 6-1
Shipping contents 1-2
Single-card system 4-11
Single-ended switching 2-3
Special handling of static-sensitive
devices 6-11
SMU connections 2-4
Specifications 1-2
T
U
Thick film resistor network testing 5-7
Transistor testing 5-10
Troubleshooting 6-14
Troubleshooting access 6-14
Troubleshooting equipment 6-14
Troubleshooting procedure 6-14
Turning channels on and off 5-5
Two-card switching systems 2-5
Two-card system 4-12
Two-mainframe system 4-14
Typical connection techniques 4-8
Typical digital I/O connection
schemes 4-16
Typical matrix connection
schemes 4-11
Typical matrix switching schemes 2-2
Unpacking and inspection 1-2
V
Voltage divider checks 5-8
Voltage source jumper 4-2
W
Warranty information 1-2
Wide matrix expansion (10 × 6
matrix) 2-7
i-3
Service Form
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Keithley Instruments, Inc.
28775 Aurora Road
Cleveland, Ohio 44139
Printed in the U.S.A.
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