MCP601/602/603/604 2.7V to 5.5V Single Supply CMOS Op Amps FEATURES • • • • • • • • • ates with a single supply voltage that can be as low as 2.7V, while drawing less than 325µA of quiescent current. In addition, the common-mode input voltage range goes 0.3V below ground, making these amplifiers ideal for single supply operation. Specifications rated from 2.7V to 5.5V supplies Rail-to-rail swing at output Common-mode input swing below ground 2.8MHz GBWP Unity gain stable Low power IDD = 325µA max Chip Select capability with MCP603 Industrial temperature range (-40°C to 85°C) Available in single, dual and quad These devices are appropriate for low-power battery operated circuits due to the low quiescent current, for A/D Converter driver amplifiers because of their wide bandwidth, or for anti-aliasing filters by virtue of their low input bias current. The MCP601, MCP602 and MCP603 are available in standard 8-lead PDIP, SOIC and TSSOP packages. The MCP601 is also available in the SOT23-5 package. The quad MCP604 is offered in 14-lead PDIP, SOIC and TSSOP packages. PDIP and SOIC packages are fully specified from -40°C to +85°C with power supplies from 2.7V to 5.5V. APPLICATIONS • • • • • • • Portable Equipment A/D Converter Driver Photodiode Pre-amps Analog Filters Data Acquisition Notebooks and PDAs Sensor Interface TYPICAL APPLICATION AVAILABLE TOOLS • Spice Macromodels (at www.microchip.com) • FilterLab™ Software (at www.microchip.com) VIN VDD -IN 2000 Microchip Technology Inc. MCP60X DESCRIPTION VOUT OUT +IN VREF The Microchip Technology Inc. MCP601/602/603/604 family of low power operational amplifiers are offered in single (MCP601), single with a Chip Select pin feature (MCP603), dual (MCP602) and quad (MCP604) configurations. These operational amplifiers (op amps) utilize an advanced CMOS technology, which provides low bias current, high speed operation, high open-loop gain and rail-to-rail output swing. This product offering oper- VSS Rail-to-Rail Output Swing Low Input Bias Current Over Temperature 2nd Order Low Pass Filter PACKAGES MCP601 MCP601 PDIP, SOIC, TSSOP 8 NC NC 1 -IN 2 - +IN 3 + VSS 4 7 VDD 6 OUT SOT23-5 +IN 3 5 NC MCP602 MCP604 PDIP, SOIC, TSSOP PDIP, SOIC, TSSOP NC 1 OUT 1 VSS 2 MCP603 PDIP, SOIC, TSSOP 5 VDD + - 4 -IN 8 CS - 7 VDD -INA 2 +IN 3 + 6 OUT +INA 3 VSS 4 5 NC 8 VDD OUTA 1 -IN 2 VSS 4 A B + - -A+ +D- 13 -IND 6 -INB +INA 3 5 +INB VDD 4 11 VSS +INB 5 10 +INC -INB 6 OUTB 7 2000 Microchip Technology Inc. 14 OUTD OUTA 1 7 OUTB -INA 2 - + 12 +IND -B+ + C - 9 -INC 8 OUTC DS21314D-page 1 MCP601/602/603/604 1.0 1.1 ELECTRICAL CHARACTERISTICS PIN FUNCTION TABLE NAME Maximum Ratings* VDD ..................................................................................7.0V All inputs and outputs w.r.t. ............. VSS -0.3V to VDD +0.3V Difference Input voltage ....................................... |VDD - VSS| Output Short Circuit Current ..................................continuous Current at Input Pin .......................................................±2mA Current at Output and Supply Pins .............................±30mA Storage temperature .....................................-65°C to +150°C Ambient temp. with power applied ................-55°C to +125°C Soldering temperature of leads (10 seconds) ............. +300°C ESD Tolerance .................................3KV Human Body Model *Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. FUNCTION +IN, +INA, +INB, +INC, +IND Non-inverting Input Terminals -IN, -INA, -INB, -INC, -IND Inverting Input Terminals VDD Positive Power Supply VSS Negative Power Supply OUT, OUTA, OUTB, OUTC, OUTD Output Terminals CS Chip Select NC No internal connection to IC DC CHARACTERISTICS Unless otherwise indicated, all limits are specified for VDD = +2.7V to +5.5V, VSS = GND, TA = 25 °C, VCM = VDD/2, RL = 100kΩ to VDD/2, and VOUT ~ VDD/2 PARAMETERS INPUT OFFSET VOLTAGE Input Offset Voltage (1) Over Temperature Drift with Temperature Power Supply Rejection INPUT CURRENT AND IMPEDANCE Input Bias Current Over Temperature(2) SYMBOL MIN. VOS -2 TYP. MAX. UNITS +2 mV CONDITIONS VOS -3 +3 mV TA= -40°C to +85°C dVOS/dT — ±2.5 — µV/°C TA= -40°C to +85°C PSRR — 40 100 µV/V for VDD = 2.7V to 5.5V IB — 1 — pA IB — 20 60 pA TA= -40°C to +85°C Input Offset Bias Current IOS — 1 — pA Common Mode Input Impedance ZCM — 1013||6 — Ω||pF Differential Input Impedance ZDIFF — 1013||3 — Ω||pF COMMON MODE Common-Mode Input Range VCM VSS−0.3 — VDD−1.2 V CMRR 75 90 — dB VDD = 5V, VCM = -0.3 to 3.8V OPEN LOOP GAIN DC Open Loop Gain AOL 100 115 — dB RL = 25kΩ to VDD/2, 50mV < VOUT < (VDD − 50 mV) DC Open Loop Gain AOL 95 110 — dB RL = 5kΩ to VDD/2, 100mV < VOUT < (VDD − 100mV) VOL, VOH VSS + 0.015 — VDD − 0.020 V RL = 25kΩ to VDD/2 VOL, VOH VSS + 0.045 — VDD − 0.060 V RL = 5kΩ to VDD/2 VOUT VSS + 0.050 — VDD − 0.050 V RL = 25kΩ to VDD/2, AOL ≥ 100dB VOUT VSS + 0.100 — VDD − 0.100 V RL = 5kΩ to VDD/2, AOL ≥ 95dB 20 — mA Common-Mode Rejection Ratio OUTPUT Low Level/High Level Output Swing Linear Region Maximum Output Voltage Swing Output Short Circuit Current ISC POWER SUPPLY Supply Voltage VDD Quiescent Current Per Amp IQ 2.7 — 5.5 V 230 325 µA VOUT = 2.5V, VDD = 5V IL = 0 Note 1: Max. and Min. specified for PDIP and SOIC packages only. Typical refers to all other packages Note 2: Max. and Min. specified for PDIP, SOIC, and TSSOP packages only. Typical refers to all packages. DS21314D-page 2 2000 Microchip Technology Inc. MCP601/602/603/604 AC CHARACTERISTICS Unless otherwise indicated, all limits are specified for VDD = +2.7V to +5.5V, VSS = GND, TA = 25°C, VCM = VDD/2, RL = 100kΩ to VDD/2, and VOUT ~ VDD/2 PARAMETERS SYMBOL MIN. TYP. GBWP — 2.8 Phase Margin Θm — 50 Slew Rate SR Gain Bandwidth Product Setting Time to 0.01% MAX. UNITS MHz — degrees — 2.3 — V/µs — 4.5 — µs CONDITIONS VDD = 5V CL = 50pF, VDD = 5V G = +1V/V, VDD = 5V for ∆VOUT = 3.8VSTEP, CL = 50pF, VDD = 5V, G = +1V/V NOISE Input Voltage Noise en — 7 — µVP-P Input Voltage Noise Density en — 29 — nV/ Hz f = 1kHz Input Current Noise Density in — 0.6 — fA/ Hz f = 1kHz f = 0.1Hz to 10Hz SPECIFICATIONS FOR MCP603 CHIP SELECT FEATURE Unless otherwise indicated, all limits are specified for VDD = +2.7V to +5.5V, VSS = GND, TA = 25°C, VCM = VDD/2, RL = 100kΩ to VDD/2, and VOUT ~ VDD/2 PARAMETERS SYMBOL MIN. TYP. MAX. UNITS CONDITIONS CS Logic Threshold, Low VIL VSS 0.42 VDD 0.2 VDD V For entire VDD range CS Input Current, Low ICSL -1.0 — — µA CS = 0.2VDD — 1 — nA CS LOW SPECIFICATIONS Amplifier Output Leakage, CS High CS HIGH SPECIFICATIONS CS Logic Threshold, High VIH 0.8 VDD 0.51 VDD VDD V For entire VDD range CS Input High, Shutdown CS Pin Current ICSH — 0.7 2.0 µA CS = VDD IQ — 0.7 2.0 µA CS = VDD CS Low to Amplifier Output High Turn-on Time tON — 3.1 10 µs CS low ≤ 0.2VDD CS High to Amplifier Output High Z tOFF — 100 — ns CS high ≥ 0.8VDD, No Load — 0.3 — V CS Input High, Shutdown GND Current DYNAMIC SPECIFICATIONS CS Threshold Hysteresis TEMPERATURE SPECIFICATIONS Unless otherwise indicated, all limits are specified for VDD = +2.7V to +5.5V, VSS = GND PARAMETERS SYMBOL MIN. TYP. MAX. UNITS CONDITIONS TEMPERATURE RANGE Specified Temperature Range TA -40 — +85 °C Operating Temperature Range TA -40 — +85 °C Storage Temperature Range TA -65 — +150 °C Thermal Resistance, 5L-SOT23-5 θJA — 256 — °C/W Thermal Resistance, 8L-PDIP θJA — 85 — °C/W Thermal Resistance, 8L-SOIC θJA — 163 — °C/W Thermal Resistance, 8L-TSSOP θJA — 124 — °C/W Thermal Resistance, 14L-PDIP θJA — 70 — °C/W Thermal Resistance, 14L-SOIC θJA — 120 — °C/W Thermal Resistance, 14L-TSSOP θJA — 100 — °C/W THERMAL PACKAGE RESISTANCE 2000 Microchip Technology Inc. DS21314D-page 3 MCP601/602/603/604 2.0 TYPICAL PERFORMANCE CURVES Note: Unless otherwise indicated, VDD = +2.7V to +5.5V, TA = 25°C, VCM = VDD/2, RL = 25kΩ to VDD/2 and VOUT ~ VDD/2 260 Gain 80 150 100 60 50 40 0 20 -50 0 IL = 0 200 -100 Phase -20 -150 -40 -200 -60 -250 10M 10000000 0.1 0 10 10 FIGURE 2-1: Frequency 1K 100K 1000 100000 Frequency (Hz) Quiescent Current per Amplifier (µA) Open Loop Gain (dB) 100 C L = 50pF, R L = 100kΩ V DD = 5V Phase Margin (degrees) 120 220 200 180 160 140 120 100 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Power Supply, VDD (V) Open Loop Gain, Phase Margin vs. FIGURE 2-4: 3.5 Quiescent Current vs. Power Supply Quiescent Current per Amplifier (µA) 300 High-to-Low Transition 3 Slew Rate (V/ µs) 240 CL=50pF, RL=100kΩ, VDD=5V 2.5 Low-to-High Transition 2 1.5 1 -40 -20 0 20 40 60 IL=0 280 260 240 VDD = 5.5V 220 200 VDD = 2.7V 180 160 140 120 100 80 -40 Temperature (°C) -20 0 20 40 60 80 Temperature (°C) Slew Rate vs. Temperature FIGURE 2-5: 4.5 85 CL = 55pF Gain Bandwidth Product 3.5 75 3 70 2.5 65 2 60 1.5 55 Phase 1 Quiescent Current vs. Temperature 10000 80 50 0.5 45 0 Phase Margin (degrees) Gain Bandwidth Product (MHz) 4 Input Voltage Noise Density (nV/ √Hz) FIGURE 2-2: RL = 10kΩ 1000 100 40 -40 -20 0 20 40 60 Temperature (°C) 80 10 0.1 1 10 100 1k 10k 100k 1M Frequency (Hz) FIGURE 2-3: Temperature Gain Bandwidth Product vs. DS21314D-page 4 FIGURE 2-6: Frequency Input Voltage Noise Density vs. 2000 Microchip Technology Inc. MCP601/602/603/604 Note: Unless otherwise indicated, VDD = +2.7V to +5.5V, TA = 25°C, VCM = VDD/2, RL = 25kΩ to VDD/2 and VOUT ~ VDD/2 40 60 VDD = 5.5V RL = 100kΩ Sample Size = 203 op amp Number of Occuracnes 35 Number of Occurances 30 VDD = 5.5V RL = 100kΩ Sample Size = 203 Temperature Range = -40°C to +85°C 50 25 20 15 10 40 30 20 10 5 0 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 -0.25 -0.50 -0.75 -1.00 -1.25 -1.50 -2.00 -1.75 0 0 1 FIGURE 2-7: Offset Voltage Occurrences with VDD = 5.5V 40 Number of 4 5 6 7 8 60 VDD = 2.7V RL = 100kΩ Sample Size = 203 Temperature Range = -40°C to +85°C 50 30 25 20 15 10 40 30 20 10 5 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 -0.25 -0.50 -0.75 -1.00 -1.25 -1.50 -1.75 -2.00 0 0 0 1 FIGURE 2-8: Offset Voltage Occurrences with VDD = 2.7V. vs. Number of RL = 100kΩ 300 200 100 VDD = 2.7V 0 -100 VDD = 5.5V -200 -300 -400 -500 -40 -20 0 20 40 60 80 Temperature (°C) FIGURE 2-9: Normalized Offset Voltage vs. Temperature with VDD = 2.7V 2000 Microchip Technology Inc. 3 4 5 6 7 8 FIGURE 2-11: Offset Voltage Drift vs. Number of Occurrences with VDD = 2.7V Common Mode Rejection Ratio, Power Supply Rejection Ratio (dB) 500 400 2 Change in Offset Voltage with Temperature (µV/°C) Offset Voltage (mV) Offset Voltage (µV) 3 FIGURE 2-10: Offset Voltage Drift vs. Number of Occurrences with VDD = 5.5V Number of Occurances Number of Occurances vs. VDD = 2.7V RL = 100kΩ Sample Size = 203 op amp 35 2 Change in Offset Voltage with Temperature (µV/°C) Offset Voltage (mV) 100 CMRR VDD = 2.7V VCM = -0.3V to 1.5V 95 PSRR, VDD = 2.7V to 5.5V 90 CMRR VDD = 5.5V VCM = -0.3V to 4.3V 85 80 75 -40 -20 0 20 40 60 80 Temperature (° C) FIGURE 2-12: Common-Mode Rejection Ratio, Power Supply Rejection Ratio vs. Temperature DS21314D-page 5 MCP601/602/603/604 Note: Unless otherwise indicated, VDD = +2.7V to +5.5V, TA = 25°C, VCM = VDD/2, RL = 25kΩ to VDD/2 and VOUT ~ VDD/2 240 Representative Part 220 VDD = 5.5V 80 180 PSRR, CMRR (dB) Offset Voltage (µV) 100 PSRR+ 200 160 140 120 VDD = 2.7V 100 VDD=5.0V, CL=50 pF PSRR- 60 CMRR 40 20 80 0 60 -20 40 11 -1 0 1 2 3 4 10 10 100 100 1K 1000 5 Common Mode Voltage (V) FIGURE 2-13: Offset Voltage vs. Common-Mode Voltage 100K 100000 1M 10000000 10M 1000000 FIGURE 2-16: Common-Mode Rejection Power Supply Rejection Ratio vs. Frequency Ratio, 20 20 18 16 14 12 10 Input Bias Current 8 6 Input Offset Current Input Bias Current Levels are Typically less than 1pA Below 25°C 4 2 VDD = 5.5V RL = ∞ TA = 85 °C 18 VDD = 5.5V Input Bias, Input Offset Current (pA) Input Bias Current, Input Offset Current (pA) 10K 10000 Frequency (Hz) 16 Input Bias Current 14 12 10 8 6 4 Input Offset 2 0 -40 -20 0 20 40 60 0 80 0 0.5 1 1.5 Temperature (°C) 2 2.5 3 3.5 4 4.5 5 5.5 Common-mode Voltage (V) FIGURE 2-14: Input Bias Current, Input Offset Current vs. Temperature FIGURE 2-17: Input Bias Current, Input Offset Current vs. Common Mode Input Voltage 120 115 110 110 Open Loop Gain (dB) DC Open Loop Gain (dB) VDD = 5.5V VDD = 2.7V 100 90 105 100 95 90 80 00 2K 20000 4K 40000 6K 60000 8K 80000 10K 100000 Load Resistance (Ω) FIGURE 2-15: DC Open Loop Gain vs. Output Load DS21314D-page 6 2 2.5 3 3.5 4 4.5 5 5.5 Power Supply Voltage, VDD (V) FIGURE 2-18: DC Open Loop Gain vs. Power Supply 2000 Microchip Technology Inc. MCP601/602/603/604 Note: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS = GND, TA = 25°C, VCM = VDD/2, RL = 25kΩ to VDD/2 and VOUT ~ VDD/2 120 3.5 100 115 90 2.5 80 2 70 1.5 60 1 0.5 50 Phase Margin VDD = 5.0V, CL= 50 pF Phase Margin (degs) Gain-Bandwidth (MHz) 3 DC Open Loop Gain (dB) Gain-Bandwidth VDD = 5.5V, VOUT = 50mV to 5.45V 110 105 100 95 VDD = 2.7V, VOUT = 50mV to 2.65V 90 40 85 0 100 100 1000 1K 30 100000 100K 10000 10K 80 Resistance (W) -40 FIGURE 2-19: Gain Bandwidth, Phase Margin vs. Load Resistance 0 20 40 Temperature (°C) 80 12 VDD-VOH VDD=5.5V 600 10 400 VOH, VOL (mV) VOL - VSS VDD=5.5V 500 VDD-VOH VDD=2.7V 300 VDD-VOH, VDD=5.5V 8 VOL-VSS, VDD=5.5V 6 VDD-VOH, VDD=2.7V 4 200 100 VOL - VSS VDD=2.7V VOL-VSS, VDD=2.7V 2 0 0 100 100 1K 1000 10K 10000 100K 100000 -40 -20 0 FIGURE 2-20: Low Level and High Level Output Swing vs. Resistive Load 40 60 80 FIGURE 2-23: Low Level and High Level Output Swing vs. Temperature 40 5.5 VDD = 5V 5 Positive Short Circuit Current VDD = 5.5V 30 Short Circuit Current (mA) 4.5 4 3.5 3 2.5 2 1.5 1 20 10 0 Positive Short Circuit Current VDD = 2.7V Negative Short Circuit Current VDD = 2.7V -10 -20 -30 Negative Short Circuit Current VDD = 5.5V 0.5 -40 0 1K 1000 20 Temperature (°C) Load Resistance (Ω) Full-Scale Output Voltage Swing (V) 60 FIGURE 2-22: DC Open Loop Gain vs. Temperature 700 VDD-VOH, VOL-VSS (mV) -20 10K 10000 100K 100000 1M 1000000 10M 10000000 -40 -30 -20 -10 0 FIGURE 2-21: Maximum Full Scale Output Voltage Swing vs. Frequency 2000 Microchip Technology Inc. 10 20 30 40 50 60 70 80 Temperature (°C) Frequency (Hz) FIGURE 2-24: Output Temperature Short Circuit Current vs. DS21314D-page 7 MCP601/602/603/604 Note: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS = GND, TA = 25°C, VCM = VDD/2, RL = 25kΩ to VDD/2 and VOUT ~ VDD/2 CL=50pF, RL=100kΩ, VDD = 5V RL = 100kΩ CL = 50pF G = +1V/V 500 mV / div 500 mV/div VDD = 5V, G= -1V/V 1µS / div 1µS / div FIGURE 2-25: Large Signal Non-Inverting Signal Pulse Response FIGURE 2-28: Large Signal Inverting Signal Pulse Response 50 mV/div CL=50 pF G = +1V/V 50 mV/div VDD = 5V RL = 100kΩ CL=50pF, RL=100kΩ, VDD = 5V, G= -1V/V 1µS / div 1µS / div FIGURE 2-26: Small Response Signal Non-inverting Pulse FIGURE 2-29: Small Signal Inverting Signal Pulse Response 100 500 mV/div CL = 50pF G = +1V/V VIN+ = 2.5V Amplifier Output Active VDD = 5V 0 GND Current (µA) RL = 100kΩ to GND CS -100 -200 -300 -400 -500 -600 VDD = 5.5V -700 Hi-Z -800 0.0 DS21314D-page 8 Select 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 CS Pin Voltage (V) 5 µS/div FIGURE 2-27: Chip Response Time 0.5 to Amplifier Output FIGURE 2-30: GND Current vs. CS Voltage 2000 Microchip Technology Inc. MCP601/602/603/604 Note: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS = GND, TA = 25°C, VCM = VDD/2, RL = 25kΩ to VDD/2 and VOUT ~ VDD/2 0.9 0.8 3 Internal CS Switch Output (V) 0.7 CS Pin Current (uA) V DD = 5.5V 0.6 0.5 0.4 0.3 0.2 0.1 0 Amplifier Output Active (driven) 2.5 VDD = 5V 2 CS Input Low to High 1.5 CS Input High to Low 1 Amplifier Output in Hi-Z state 0.5 0 -0.5 -0.1 0.0 1.0 2.0 3.0 4.0 5.0 6.0 CS Pin Voltage (V) FIGURE 2-31: Input CS Current vs. CS Voltage 0 1 2 3 4 CS Input Voltage (V) 5 6 FIGURE 2-33: CS hysteresis Channel to Channel Isolation (dB) -150 -145 RL = ∞ -140 -135 -130 -125 -120 -115 -110 -105 -100 100 100 1K 1000 10K 10000 Frequency (Hz) 100K 100000 1M 1000000 FIGURE 2-32: Channel to Channel Separation 2000 Microchip Technology Inc. DS21314D-page 9 MCP601/602/603/604 APPLICATIONS INFORMATION The MCP601/602/603/604 family of operational amplifiers are fabricated on Microchip’s state-of-the-art CMOS process. They are unity gain stable and suitable for a wide range of general purpose applications. With this family of operational amplifiers, the power supply pin should be by-passed with a 1µF capacitor. 3.1 Rail-to-Rail Output Swing There are two specifications that describe the output swing capability of the MCP601/602/603/604 family of operational amplifiers. The first specification, Low Level and High Level Output Voltage Swing, defines the absolute maximum swing that can be achieved under specified loaded conditions. For instance, the Low Level Output Voltage Swing of the MCP601/602/603/ 604 family is specified to be able to swing at least to 15mV from the negative rail with a 25kΩ load to VDD/2. VDD 10 8 0.5 0.3 VOH VOL 6 0.1 Input Signal (V) 4 -0.1 VSS 2 -0.3 0 -0.5 VOH, VOL (0.1mV/div) This output swing performance is shown in Figure 3-1, where the output of an MCP601 is configured in a gain of +2V/V and over driven with a 40kHz triangle wave. In this figure, the degradation of the output swing linearity is clearly illustrated. This degradation occurs after the point at which the open loop gain of the amplifier is specified and before the amplifier reaches its maximum and minimum output swing. G=+2V/V, VDD= 5V -0.7 10 20 30 40 50 Time (µs) FIGURE 3-1: Swing The classical definition of the open loop gain of an amplifier is: AOL = ∆VOUT / ∆VOS where: AOL is the DC open loop gain of the amplifier, ∆VOUT is equal to (VDD - 50mV) - (VSS + 50mV) for RL= 25kΩ, and ∆VOS is the change in offset voltage with the changing output voltage of the amplifier. 3.2 Input Voltage and Phase Reversal Since the MCP601/602/603/604 amplifier family is designed with CMOS devices, it does not exhibit phase inversion when the input pins exceed the negative supply voltage. Figure 3-2 shows an input voltage exceeding both supplies with no resulting phase inversion. 6 G = +2V/V VDD = 5V 5 4 Output Signal 3 Input Signal 2 1 0 -1 0 -2 0 The Linear Region Maximum Output Voltage Swing of the MCP601/602/603/604 family is specified within 50mV from the positive and negative rail with a 25kΩ load and 100mV from the rails with a 5kΩ load. The overriding condition that defines the linear region of the amplifier is the open loop gain that is specified over that region. In the voltage output region between VSS + 50mV and VDD - 50mV, the open loop gain is specified to 100dB (min) with a 25kΩ load. Input and Output Voltage (V) 3.0 Low Level and High Level Output 10 20 30 40 50 Time(µS) FIGURE 3-2: The MCP601/602/603/604 family of op amps do not have phase reversal issues. For the graph, the amplifier is in a unity gain or buffer configuration. The second specification that describes the output swing capability of these amplifiers is the Linear Region Maximum Output Voltage Swing. This specification defines the maximum output swing that can be achieved while the amplifier is still operating in its linear region. DS21314D-page 10 2000 Microchip Technology Inc. MCP601/602/603/604 80 3.5 Gain-Bandwidth 3 VDD=5.0V, 70 RL=100 kΩ 60 2.5 2 1.5 50 40 Phase Margin 30 1 20 0.5 10 0 10 10 100 100 1E3 1000 10E3 10000 100E3 100000 Phase Margin (degrees) 4 Gain-Bandwidth (MHz) The maximum operating common-mode voltage that can be applied to the inputs is VSS - 0.3V to VDD - 1.2V. In contrast, the absolute maximum input voltage is VSS - 0.3V and VDD + 0.3V. Voltages on the input that exceed this absolute maximum rating can cause excessive current to flow in or out of the input pins. Current beyond ±2mA can cause possible reliability problems. Applications that exceed this rating must be externally limited with an input resistor as shown in Figure 3-3. 0 1E6 1000000 Capacitance (pF) FIGURE 3-4: Gain Bandwidth, Phase Margin vs. Capacitive Load MCP60X VDD RIN RISO RIN = (Maximum expected voltage - VDD) / 2mA or (VSS - Minimum expected voltage)/ 2mA. FIGURE 3-3: If the inputs of the amplifier exceed the Absolute Maximum Specifications, an input resistor, RIN , should be used to limit the current flow into that pin. 3.3 Capacitive Load and Stability Driving capacitive loads can cause stability problems with many of the higher speed amplifiers. For any closed loop amplifier circuit, a good rule of thumb is to design for a phase margin that is no less than 45°. This is a conservative theoretical value, however, if the phase margin is lower, layout parasitics can degrade the phase margin further causing a truly unstable circuit. A system phase shift of 45° will have an overshoot in its step response of approximately 25%. A buffer configuration with a capacitive load is the most difficult configuration for an amplifier to maintain stability. The Phase versus Capacitive Load of the MCP60X amplifier is shown in Figure 3-4. In this figure, it can be seen that the amplifier has a phase margin above 40°, while driving capacitance loads up to 100pF. 2000 Microchip Technology Inc. MCP60X VOUT CL VIN FIGURE 3-5: Amplifier circuits that can be used when driving heavy capacitive loads. If the amplifier is required to drive larger capacitive loads, the circuit shown in Figure 3-5 can be used. A small series resistor (RISO) at the output of the amplifier improves the phase margin when driving large capacitive loads. This resistor decouples the capacitive load from the amplifier by introducing a zero in the transfer function. This zero adjusts the phase margin by approximately: ∆θm = tan-1 (2π GBWP x RISO x CL) where: ∆θm is the improvement in phase margin, GBWP is the gain bandwidth product of the amplifier, RISO is the capacitive decoupling resistor, and CL is the load capacitance DS21314D-page 11 MCP601/602/603/604 3.4 The Chip Select Option of the MCP603 The MCP603 is a single amplifier with a Chip Select option. When CS is pulled high the supply current drops to 0.7µA (typ), which is pulled through the CS pin to VSS. In this state, the amplifier is put into a high impedance state. By pulling CS low or letting the pin float, the amplifier is enabled. Figure 3-6 shows the output voltage and supply current response to a CS pulse. CS VIH VIL tON Output tOFF Hi-Z Hi-Z 230µA (typ) VDD Supply Current 2.0nA (typ) GND Current 0.7µA (typ) 0.7µA (typ) CS Current FIGURE 3-6: 3.5 230µA (typ) 2.0nA (typ) 0.7µA (typ) 0.7µA (typ) 2nA(typ) Timing Diagram for the CS Function of the MCP603 Amplifier Layout Considerations In applications where low input bias current is critical, PC board surface leakage effects and signal coupling from trace to trace need to be taken into consideration. -In 3.5.1 +In V- SURFACE LEAKAGE Surface leakage across a PC board is a consequence of differing DC voltages between two traces combined with high humidity, dust or contamination on the board. For instance, the typical resistance from PC board trace to pad is approximately 1012Ω under low humidity conditions. If an adjacent trace is biased to 5V and the input pin of the amplifier is biased at or near zero volts, a 5pA leakage current will appear on the amplifier’s input node. This type of PCB leakage is five times the room temperature input bias current (1pA, typ) of the MCP601/602/603/604 family of amplifiers. Guard Ring FIGURE 3-7: Example of Guard Ring for the MCP601, the A-amplifier of the MCP602 or the MCP603 in a PC Board Layout The simplest technique that can be used to reduce the effects of PC board leakage is to design a ring around sensitive pins and traces. An example of this type of layout is shown in Figure 3-7. DS21314D-page 12 2000 Microchip Technology Inc. MCP601/602/603/604 Circuit examples of ring implementations are shown in Figure 3-8. In Figure 3-8A, B and C, the guard ring is biased to the common-mode voltage of the amplifier. This type of guard ring is most effective for applications where the common-mode voltage of the input stage changes, such as buffers, inverting gain amplifiers or instrumentation amplifiers. The strategy shown in Figure 3-8D, biases the common-mode voltage and guard ring to ground. This type of guard ring is typically used in precision photo sensing circuits. Figure 3-8A 3.5.2 SIGNAL COUPLING The input pins of the MCP601/602/603/604 amplifiers have a high impedance providing an opportunity for noise injection, if layout issues are not considered. These high impedance input terminals are sensitive to injected currents. This can occur if the trace from a high impedance input is next to a trace that has fast changing voltages, such as a digital or clock signal. When a high impedance trace is in close proximity to a trace with these types of voltage changes, charge is capacitively coupled into the high impedance trace. C= w x L x eo x er pF d PCB Trace MCP60X d L w (typ 0.003mm) Figure 3-8B w= thickness of PCB trace PCB Cross-Section L= length of PCB trace d= distance between the two PCB traces MCP60X FIGURE 3-9: Capacitors can be built with PCB traces allowing for coupling of signals from one trace to another. As shown in Figure 3-9, the value of the capacitance between two traces is primarily dependent on the distance (d) between the traces and the distance that the two traces are in parallel (L). From this model, the amount of current generated into the high impedance trace is equal to: Figure 3-8C I = C ∂V/∂t MCP60X Voltage where: (could be ground) I equals the current that appears on the high impedance trace, Figure 3-8D C equals the value of capacitance between the two PCB traces, Reference VDD ∂V equals the change in voltage of the trace that is switching, and ∂t equals the amount of time that the voltage change took to get from one level to the next. MCP60X FIGURE 3-8: Examples of how to design PC Board traces to minimize leakage paths to the high impedance input pins of the MCP601/602/603/604 amplifiers. 2000 Microchip Technology Inc. DS21314D-page 13 MCP601/602/603/604 3.6 Typical Applications 3.6.1 ANALOG FILTERS of poles that are required for the application. Finally, the program will generate a SPICE macromodel, which can be used for spice simulations. Examples of two second order low pass filters are shown in Figure 3-10 and Figure 3-11. The filter in Figure 3-10 can be configured for gain of +1V/V or greater. The filter in Figure 3-11 can be configured for inverting gains. Sallen-Key C2 R2 VIN C1 R1 3.6.2 INSTRUMENTATION AMPLIFIER CIRCUITS The instrumentation amplifier has a differential input, which subtracts one analog signal from another and rejects common mode signals. This amplifier also provides a single ended analog output signal. The three op amp instrumentation amplifier is illustrated in Figure 3-12 and the two op amp instrumentation amplifier is shown in Figure 3-13. VDD VOUT MCP60X V2 * R4 R3 MCP60X VDD R4 R3 R2 RG VOUT VIN K/(R1R2C2C1) = s2+s(1/R1C2+1/R2C2+1/R2C1 – K/R2C1+1/R1R2C2C1) K = 1 + R4 /R3 FIGURE 3-10: 2nd Order Low Pass Sallen-Key Filter R2 VIN R3 R1 C2 * MCP60X R3 R2 VOUT R4 MCP60X V1 VREF 2R 2 R 4 R4 VOUT = (V1 –V 2 ) 1 + --------- ------ + V REF ------ RG R3 R3 *Bypass Capacitor, 1µF C1 VOUT MCP60X FIGURE 3-12: An instrumentation amplifier can be built using three operational amplifiers and seven resistors. RG VOUT VIN = –1/R1R3C2C1 R1 s2C2C1 + sC1(1/R1 + 1/R2 + 1/R3) + 1/(R2R3C2C1) FIGURE 3-11: 2nd Order Multiple-Feedback Filter Low Pass The MCP601/602/603/604 family of operational amplifiers are particularly well suited for these types of filters. The low input bias current, which is typically 1pA (up to 60pA at temperature), allows the designer to select higher value resistors, which in turn reduces the capacitive values. This allows the designer to select surface mount capacitors, which in turn can produce a compact layout. The rail-to-rail output operation of the MCP601/602/ 603/604 family of amplifiers make these circuits well suited for single supply operation. Additionally, the wide bandwidth allows low pass filter design up to 1/10 of the GBWP or 300kHz. VREF R2 VDD R1 * MCP60X R2 V2 V1 MCP60X VOUT R 1 2R 1 VOUT = (V1 –V2 ) 1 + ------ + --------- + VREF R 2 RG *Bypass Capacitor, 1µF FIGURE 3-13: An instrumentation amplifier can also be built using two operational amplifiers and five resistors. These filters can be designed using the calculations provided in the Figures or with Microchip’s interactive FilterLab software. FilterLab will calculate capacitor and resistor values, as well as, determine the number DS21314D-page 14 2000 Microchip Technology Inc. MCP601/602/603/604 An advantage of the three op amp configuration is that it is capable of unity gain operation. A disadvantage, as compared to the two op amp instrumentation amplifier, is that the common mode range reduces with higher gains. The two op amp configuration uses fewer op amps, so power consumption is also low. Disadvantages of this configuration are that the common-mode range reduces with gain and it must be configured in gains of two or higher. 3.6.3 PHOTO DETECTION The amplifiers in the MCP601/602/603/604 family of devices can be used to easily convert the signal from a sensor that produces an output current, such as a photodiode, into a voltage. This is implemented with a single resistor and an optional capacitor in the feedback loop of the amplifier as shown in Figure 3-14. In contrast, a photodiode that is configured in the photoconductive mode has a reverse bias voltage, which is applied across the photo sensing element as shown in Figure 3-14. The width of the depletion region is reduced when this voltage is applied across the photo detector, which reduces the photodiode parasitic capacitance significantly. This reduced parasitic capacitance facilitates high speed operation, however, the linearity and offset errors are not optimized. The design trade off for this action is increased diode leakage current and linearity errors. A key amplifier specification for this application is high speed digital communication. The MCP601/602/603/604 family is well suited for medium speed photoconductive applications with their wide bandwidth and rail-to-rail output swing. Photodiode in Photovoltaic Mode C2 R2 D1 ID1 Light MCP60X VOUT Photodiode in Photoconductive Mode VBIAS R2 D1 Light ID1 MCP60X VOUT VOUT = R2 ID1 FIGURE 3-14: Photo Sensing Circuits Using the MCP60X Amplifier A photodiode that is configured in the photovoltaic mode has no voltage potential placed across the element or is zero biased (Figure 3-14). In this mode, the light sensitivity and linearity is maximized making it best suited for precision applications. The key amplifier specifications for this application are low input bias current, low noise and rail-to-tail output swing. The MCP601/602/603/604 family is capable of meeting all three of these difficult requirements. 2000 Microchip Technology Inc. DS21314D-page 15 MCP601/602/603/604 4.0 SPICE MACROMODEL The Spice macromodel for the MCP601, MCP602, MCP603 and MCP604 simulates the typical amplifier performance of offset voltage, DC power supply rejection, input capacitance, DC common mode rejection ratio, open loop gain over frequency, phase margin with no capacitive load, output swing, DC power supply current, power supply current change with supply voltage, input common mode range and input voltage noise. The characteristics of the MCP601, MCP602, MCP603, and MCP604 amplifiers are similar in terms of performance and behavior. This single op amp macromodel supports all four devices with the exception of the chip select function of the MCP603, which is not modeled. The listing for this macromodel is shown on the next page. The most recent revision of the model can be downloaded from Microchip’s web site at www.microchip.com. DS21314D-page 16 2000 Microchip Technology Inc. MCP601/602/603/604 .subckt mcp601 1 2 3 4 5 * | | | | | * | | | | Output * | | | Negative supply * | | Positive Supply * | Inverting input * Non-inverting input * * Macromodel for MCP601 (single), MCP602 (dual), MCP603 (single w/CS), and MCP604 (quad) * * The characteristics of the MCP601, MCP602, MCP603, and MCP604 have the same fundamental * performance and behavior. Consequently, this single op amp macromodel supports all four * devices. However, the chip select function of the MCP603 is not modeled. * * Revision History: * REV A : 6-30-99 created BCB * REV B : 7-10-99 corrected DC Iq BCB * REV C : 11-30-99 Placed “.subckt” command as first line, added L, W to Ptype model in : listing BCB * * This macromodel models typical amplifier offset voltage, DC power supply rejection, input * capacitance, DC common mode rejection ratio, open loop gain over frequency, phase margin * with no capacitive load, output swing, power supply current, input voltage noise. * * NOTICE: THE INFORMATION PROVIDED HEREIN IS BELIEVED TO BE RELIABLE, * HOWEVER, MICROCHIP ASSUMES NO RESPONSIBILITY FOR INACCURACIES OR * OMISSIONS. MICROCHIP ASSUMES NO RESPONSIBILITY FOR THE USE OF THIS * INFORMATION, AND ALL USE OF SUCH INFORMATION SHALL BE ENTIRELY AT * THE USER’S OWN RISK. NO INTELLECTURAL PROPERTY RIGHTS OR LICENSES * TO ANY OF THE TECNOLOGY DESCRIBED HEREIN ARE IMPLIED OR GRANTED TO * ANY THIRD PARTY. MICROCHIP RESERVES THE RIGHT TO CHANGE THIS MODEL * AT ANY TIME WITHOUT NOTICE. * *Input Stage, pole at 5MHz M1 9 64 7 3 Ptype L=2 W=275 M2 8 2 7 3 Ptype L=2 W=275 CDIFF 1 2 3E-12 CCM1 1 4 6E-12 CCM2 2 4 6E-12 IDD 3 7 30e-6 RA 8 6 1.485e3 RB 9 6 1.485e3 CA 8 9 10.71e-12 *Input Stage Common-Mode Clampling VCMM 4 6 0.35 ECM 55 4 3 64 1 RCM DCMP VCMP 57 56 57 56 55 4 1E3 DX 1.2 RST DST VST 58 59 58 59 55 4 1E3 DX 1.6 GCMP2 23 4 POLY(2) 57 56 58 59 0 -0.5E-3 0.5E-3 *Input errors (vos, en, psr, cmr) ERR 64 1 POLY(3) (67,4) (3, 4) (1,34) 0 1 40e-6 3.2e-6 *Second GS R1 C2 Stage, pole 23 4 23 4 23 4 at 3.3Hz 8 9 0.397e9 122.8e-12 2000 Microchip Technology Inc. 5.7e-3 DS21314D-page 17 MCP601/602/603/604 VSOP VSOM DSOP DSOM 3 25 23 25 24 4 24 23 *HCM 23 3 4.784 -3.48 DY DY VCMP FS 3 4 POLY(11) VO3 VO5 VO4 VO6 VO1 VO2 VO9 VO10 VMID1 VSOP VSOM + 200E-6 -1 -1 -1 1 -1 -1 1 1 -1 -1 -1 *mid-supply reference, output swing limit RMID1 3 35 61.62E3 VMID1 35 34 0 RMID2 4 34 61.62E3 ELEVEL 34 4 23 4 -1 *output DO3 DO4 DO5 DO6 DO7 DO8 VO3 VO4 GO5 VO5 GO6 VO6 GO1 VO1 GO2 VO2 RO9 VO9 RO10 VO10 stage 34 43 44 34 3 45 3 46 4 45 4 46 43 5 5 44 3 47 47 5 4 48 48 5 49 4 49 45 50 4 50 46 3 51 51 5 52 4 52 5 * input VN1 DN1 RN1 voltage noise 65 4 0.6 65 67 DX 67 4 13E3 DY DY DY DY DY DY 0.1 0.1 3 0 34 0 5 0 34 0 100 0 100 0 34 10E-3 4 10E-3 34 10E-3 5 10E-3 .model Ptype PMOS .model DY D(IS=1e-15 BV =50) .model DX D(IS=1e-18 AF=0.6 KF=10e-17) .ENDS DS21314D-page 18 2000 Microchip Technology Inc. MCP601/602/603/604 MCP60X PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. MCP60X — X /X Package: Temperature Range: Device: P SN SL ST OT = = = = = Plastic DIP (300 mil Body), 8-lead and 14-lead Plastic SOIC (150 mil Body), 8-lead Plastic SOIC (150 mil Body), 14-lead Plastic TSSOP, 8-lead and 14-lead Plastic SOT23, 5-lead I = –40°C to +85°C MCP601 MCP601T MCP602 MCP602T MCP603 MCP603T = = = = = = Single Operational Amplifier Single Operational Amplifier (Tape and Reel-SOIC/TSSOP/SOT23-5) Dual Operational Amplifier Dual Operational Amplifier (Tape and Reel-SOIC/TSSOP) Single Operational Amplifier w/CS Function Single Operational Amplifier w/CS Function (Tape and Reel-SOIC/TSSOP) MCP604 = Quad Operational Amplifier MCP604T = Quad Operational Amplifier (Tape and Reel-SOIC/TSSOP) Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 786-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2000 Microchip Technology Inc. DS21314D-page 19 Note the following details of the code protection feature on PICmicro® MCUs. • • • • • • The PICmicro family meets the specifications contained in the Microchip Data Sheet. Microchip believes that its family of PICmicro microcontrollers is one of the most secure products of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the PICmicro microcontroller in a manner outside the operating specifications contained in the data sheet. The person doing so may be engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable”. Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our product. If you have any further questions about this matter, please contact the local sales office nearest to you. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. 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