LG U250, KU250 Mobile Phone Service Manual

Date: June, 2007 / Issue 1.0

Service Manual

U250/KU250

Table Of Contents

1. INTRODUCTION .............................. 5

1.1 Purpose................................................... 5

1.2 Regulatory Information............................ 5

2. PERFORMANCE...............................7

2.1 System Overview .....................................7

2.2 Usable environment .................................8

2.3 Radio Performance ..................................8

2.4 Current Consumption.............................14

2.5 RSSI BAR ..............................................14

2.6 Battery BAR ...........................................15

2.7 Sound Pressure Level............................16

2.8 Charging ................................................16

3. TECHNICAL BRIEF ........................17

3.1 General Description ...............................17

3.2 GSM Mode.............................................19

3.3 UMTS Mode...........................................23

3.4 LO generation and distribution circuits...25

3.5 Off-chip RF Components .......................25

3.6 Digital Baseband(DBB/MSM6245).........34

3.7 Block Diagram(MSM6245).....................36

3.8 Subsystem(MSM6245) ..........................37

3.9 Power Block ...........................................45

3.10 External memory interface ...................50

3.11 H/W Sub System..................................52

3.12 Main Features ......................................68

4. TROUBLE SHOOTING ...................73

4.1 RF Component.......................................73

4.2 SIGNAL PATH_UMTS RF .....................75

4.3 SIGNAL PATH_GSM RF .......................76

4.4 Checking VC-TCXO Block .....................77

4.5 Checking Front-End Module Block ........79

4.6 Checking UMTS Block ...........................81

4.7 Checking GSM Block .............................86

4.8 Checking Bluetooth Block ......................92

4.9 Power ON Troubleshooting....................94

4.10 Charger Troubleshooting .....................96

4.11 USB Troubleshooting...........................99

4.12 SIM Detect Troubleshooting ..............100

4.13 Camera Troubleshooting ...................102

4.14 Keypad Backlight Troubleshooting ....105

4.15 Main LCD Troubleshooting ................106

4.16 Receiver Path ....................................107

4.17 Headset path......................................109

4.18 Speaker phone path...........................111

4.19 Main microphone ...............................113

4.20 Headset microphone..........................115

4.21 Vibrator ..............................................117

5. DOWNLOAD..................................119

5.1 U250/KU250 DOWNLOAD ..................119

5.1.1 Introduction ...................................119

5.1.2 Downloading Procedure ...............119

5.1.3 Troubleshooting Download Errors 129

5.1.4 Caution .........................................133

6. BLOCK DIAGRAM ........................134

6.1 GSM & UMTS RF Block.......................134

6.2 Interface Diagram ................................136

7. Circuit Diagram ............................143

8. pcb layout .....................................147

9. Calibration & RF Auto Test

Program (Hot Kimchi)..................149

9.1 Configuration of HOT KIMCHI .............149

9.2 How to use HOT KIMCHI.....................152

10. Factory Test Mode .....................154

10.1. Test Program Setting ........................154

10.2. WCDMA Test Mode ..........................155

10.3. GSM Test Mode................................156

11. EXPLODED VIEW &

REPLACEMENT PART LIST ..... 157

11.1 EXPLODED VIEW ............................ 157

11.2 Replacement Parts

<Mechanic component>.................... 159

<Main component> ........................... 161

11.3 Accessory ......................................... 174

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- 4 -

1. INTRODUCTION

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that resultfrom such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

- 5 -

1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.

Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

- 6 -

2. PERFORMANCE

2. PERFORMANCE

2.1 System Overview

Item

Shape

Size

Weight

Power

Talk Time

(with 950mAh)

Standby Time

Specification

GSM900/1800/1900 and WCDMA2100 - Bar type Handset

110.9 X 46.7 X 15.6 mm

Under 83 g (with 950mAh Battery)

3.7 V normal, 950 mAh Li-Ion

Over 200 min (WCDMA, Tx=12 dBm, Voice)

Over 180 min (GSM, Max Tx Power, Voice)

Over 350 Hrs (WCDMA, DRX=1.28)

(with 950mAh)

Antenna

LCD

LCD Backlight

Camera

Vibrator

LED Indicator

MIC

Over 450 Hrs (GSM, Paging period=9)

Internal type

Main 1.76” TFT, QCIF, 262K

White LED Back Light

1.3 Mega pixel + VGA Video Call Camera

Yes ( Cylinder Type)

No

Yes

Receiver Yes

Earphone Jack Yes (18 pin)

External Memory

I/O Connect

Yes(Micro SD)

18 Pin

- 7 -

2. PERFORMANCE

2.2 Usable environment

1) Environment

Item

Voltage

Operation Temp

Storage Temp

Humidity

Specification

3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V]

-20 ~ +60

°C

-20 ~ +70

°C

85 % (Max)

2) Environment (Accessory)

Reference

TA Power

* CLA : 12 ~ 24 V(DC)

Spec.

Available power

Min

100

Typ.

220

Max

240

Unit

Vac

2.3 Radio Performance

1) Transmitter - GSM Mode

No Item

MS allocated

Channel

100k~1GHz

1G~12.75GHz

1

Conducted

Spurious

Emission

Idle Mode

100k~880MHz

880M~915MHz

915M~1GHz

1G~[A]MHz

[A]M~[B]MHz

[B]M~12.5GHz

* In case of DCS : [A] -> 1710, [B] -> 1785

- 8 -

GSM DCS & PCS

9k ~ 1GHz -39dBm

-39dBm

1G~[A]MHz

[A]M~[B]MHz

-33dBm

[B]M~12.75GHz

-60dBm 100k~880MHz

-33dBm

-39dBm

-33dBm

-60dBm

-62dBm 880M~915MHz

-60dBm 915M~1GHz

-62dBm

-60dBm

-50dBm 1G~[A]MHz

-56dBm [A]M~[B]MHz

-50dBm

-56dBm

-50dBm [B]M~12.5GHz

-50dBm

* In case of PCS : [A] -> 1850, [B] -> 1910

2. PERFORMANCE

No

2

3

4

5

Radiated

Spurious

Emission

Item

MS allocated

Channel

Idle Mode

Frequency Error

Phase Error

Frequency Error

Under Multipath and

Interference Condition

30M ~ 1GHz

1G ~ 4GHz

915M~1GHz

1G~[A]MHz

[A]M~[B]MHz

[B]M~4GHz

±0.1ppm

±5(RMS)

±20(PEAK)

GSM

30M ~ 880MHz

880M ~ 915MHz

DCS & PCS

30M~1GHz -36dBm

-36dBm

1G~[A]MHz

[A]M~[B]MHz

-30dBm

[B]M~4GHz

-57dBm 30M~880MHz

-30dBm

-36dBm

-30dBm

-57dBm

-59dBm 880M~915MHz

-57dBm

-47dBm 1G~[A]MHz

-53dBm

915M~1GHz

[A]M~[B]MHz

-47dBm [B]M~4GHz

±0.1ppm

±5(RMS)

±20(PEAK)

-59dBm

-57dBm

-47dBm

-53dBm

-47dBm

3dB below reference sensitivity 3dB below reference sensitivity

RA250 : ±200Hz

HT100 : ±100Hz

RA250: ±250Hz

HT100: ±250Hz

TU50 : ±100Hz

TU3 : ±150Hz

0 ~ 100kHz

200kHz

+0.5dB

-30dB

TU50: ±150Hz

TU1.5: ±200Hz

0 ~ 100kHz

200kHz

6

Output RF

Spectrum

Due to

250kHz

400kHz modulation 600 ~ 1800kHz

Due to

Switching transient

* In case of DCS : [A] -> 1710, [B] -> 1785

-33dB

-60dB

250kHz

400kHz

1800 ~ 3000kHz

3000 ~ 6000kHz

≥6000kHz

400kHz

600kHz

1200kHz

-66dB 600 ~ 1800kHz

-69dB 1800 ~ 6000kHz

-71dB ≥6000kHz

-77dB

-19dB 400kHz

-21dB 600kHz

-21dB 1200kHz

1800kHz -24dB 1800kHz

* In case of PCS : [A] -> 1850, [B] -> 1910

+0.5dB

-30dB

-33dB

-60dB

-60dB

-65dB

-73dB

-22dB

-24dB

-24dB

-27dB

- 9 -

2. PERFORMANCE

No

7

8

9

Item

Intermodulation attenuation

Transmitter Output Power

Burst timing

10

11

12

13

8

9

6

7

GSM

–

DCS & PCS

Frequency offset 800kHz

Intermodulation product should be Less than 55dB below the level of Wanted signal

Power control Power Tolerance Power control Power Tolerance

Level

5

(dBm)

33

(dB)

±3

Level

0

(dBm)

30

(dB)

±3

31

29

27

25

23

21

19

17

±3

±3

±3

±3

±3

±3

±3

±3

1

2

3

4

5

6

7

8

28

26

24

22

20

18

16

14

±3

±3

±3

±3

±3

±3

±3

±3

14

15

16

17

18

19

15

13

11

9

7

5

Mask IN

±3

±3

±5

±5

±5

±5

13

14

15

9

10

11

12

8

6

12

10

4

2

0

Mask IN

±4

±5

±5

±4

±4

±4

±4

- 10 -

2. PERFORMANCE

2) Transmitter - WCDMA Mode

No

1

2

3

Item

Maximum Output Power

Frequency Error

Open Loop Power control in uplink

Specification

Class 3 : +24dBm(+1/-3dB)

±0.1ppm

±9dB@normal, ±12dB@extreme

Adjust output(TPC command) cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4.5

0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

4 Inner Loop Power control in uplink

-1 -0.5/-1.5 -1/-3 -1.5/-4.5

Group (10 equel command group)

+1 +8/+12 +16/+24

-50dBm(3.84MHz) 5 Minimum Output Power

Qin/Qout : PCCH quality levels

6 Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB

7

8

9

Transmit OFF Power

Transmit ON/OFF Time Mask

Change of TFC

Ton@DPCCH/Ior : -24 -> -18dB

-56dBm(3.84MHz)

±25us

PRACH,CPCH,uplinlk compressed mode

±25us

Power varies according to the data rate

DTX : DPCH off

(minimize interference between UE)

10 Power setting in uplink compressed

11 Occupied Bandwidth(OBW)

12 Spectrum emission Mask

±3dB(after 14slots transmission gap)

5MHz(99%)

-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k

-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M

-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M

-49dBc@∆f=8.5~12.5MHz,1M

- 11 -

2. PERFORMANCE

No Item

13 Adjacent Channel Leakage Ratio(ACLR)

14

Spurious Emissions

(*: additional requirement)

15 Transmit Intermodulation

16 Error Vector Magnitude (EVM)

17 Transmit OFF Power

Specification

33dB@5MHz, ACP>-50dBm

43dB@10MHz, ACP>-50dBm

-36dBm@f=9~150KHz, 1K BW

-36dBm@f=50KHz~30MHz, 10K BW

-36dBm@f=30MHz~1000MHz, 100K BW

-30dBm@f=1~12.5GHz, 1M BW

(*)-41dBm@f=1893.5~1919.6MHz, 300K

(*)-67dBm@f=925~935MHz, 100K BW

(*)-79dBm@f=935~960MHz, 100K BW

(*)-71dBm@f=1805~1880MHz, 100K BW

-31dBc@5MHz,Interferer -40dBc

-41dBc@10MHz, Interferer -40dBc

17.5%(>-20dBm)

(@12.2K, 1DPDCH+1DPCCH)

-15dB@SF=4.768Kbps, Multi-code transmission

3)Receiver - GSM Mode

No

1

2

Item

Sensitivity (TCH/FS Class II)

Co-Channel Rejection

(TCH/FS Class II, RBER, TU high/FH)

3 Adjacent Channel

Rejection

200kHz

400kHz

4

5

Intermodulation Rejection

Blocking Response

(TCH/FS Class II, RBER)

GSM

-105dBm

C/Ic=7dB

DCS & PCS

-105dBm

Storage -30 ~ +85

C/Ia1=-12dB

C/Ia2=-44dB

Wanted Signal :-98dBm 1st interferer:-44dBm 2nd

C/Ia1=-12dB

C/Ia2=-44dB

Wanted Signal :-96dBm 1st interferer:-44dBm 2nd interferer:-45dBm

Wanted Signal :-101dBm interferer:-44dBm

Wanted Signal :-101dBm

Unwanted : Depend on Frequency Unwanted : Depend on Frequency

- 12 -

2. PERFORMANCE

4) Receiver - WCDMA Mode

No Item

1 Reference Sensitivity Level

2 Maximum Input Level

3 Adjacent Channel Selectivity (ACS)

4 In-band Blocking

5 Out-band Blocking

6 Spurious Response

7 Intermodulation Characteristic

8 Spurious Emissions

- 13 -

Specification

-106.7 dBm(3.84 MHz)

-25dBm(3.84MHz)

-44dBm/3.84MHz(DPCH_Ec)

UE@+20dBm output power(Class3)

33dB

UE@+20dBm output power(Class3)

-56dBm/3.84MHz@10MHz

UE@+20dBm output power(Class3)

-44dBm/3.84MHz@15MHz

UE@+20dBm output power(Class3)

-44dBm/3.84MHz@f=2050~2095 and

2185~2230MHz

UE@+20dBm output power(Class3)

-30dBm/3.84MHz@f=2025~2050 and

2230~2255MHz

UE@+20dBm output power(Class3)

-15dBm/3.84MHz@f=1~2025 and

2255~12500MHz

UE@+20dBm output power(Class3)

-44dBm CW

UE@+20dBm output power(Class3)

-46dBm CW@10MHz

-46dBm/3.84MHz@20MHz

UE@+20dBm output power(Class3)

-57dBm@f=9KHz~1GHz, 100K BW

-47dBm@f=1~12.5GHz, 1M BW

-60dBm@f=1920MHz~1980MHz, 3.84M BW

-60dBm@f=2110MHz~2170MHz, 3.84M BW

2. PERFORMANCE

2.4 Current Consumption

1) U250/KU250 Current Consumption

WCDMA

GSM

Stand by

Under 2.80 mA

(DRX=1.28)

Under 2.12 mA

Paging=9 period

Voice Call

Under 290 mA

(Tx=12dBm)

Under 320 mA

(Max Tx Power)

VT

Under 410mA

(Tx=12dBm)

(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test

Condition : Speaker off, LCD backlight On)

2.5 RSSI BAR

Level Change

BAR 4 → 3

BAR 3 → 2

BAR 2

→ 1

BAR 1

→ 0

WCDMA

-85 ± 2 dBm

-95 ± 2 dBm

-106

± 2 dBm

-111

± 2 dBm

GSM

-90 ± 2 dBm

-95 ± 2 dBm

-100

± 2 dBm

-106

± 2 dBm

- 14 -

2. PERFORMANCE

2.6 Battery BAR

Indication

Bar 4

Bar 4 → 3

Bar 3 → 2

Bar 2 → 1

Bar 1 → Empty

Low Voltage,

Warning message+ Blinking

Power Off

Standby

Over 3.83 ± 0.05V

3.82 ± 0.05V

3.73 ± 0.05V

3.68 ± 0.05V

3.58 ± 0.05V

3.58± 0.05V (Stand-by) / 3.58 ± 0.05V (Talk)

[Interval : 3min(Stand-by) / 1min(Talk)]

3.20 ± 0.05V

- 15 -

2. PERFORMANCE

7

8

9

10

11

12

2

3

4

5

6

2.7 Sound Pressure Level

No

1

Test Item

Sending Loudness Rating (SLR)

Receiving Loudness Rating (RLR)

Side Tone Masking Rating (STMR)

Echo Loss (EL)

Idle Noise-Sending (INS)

Idle Noise-Receiving (INR)

Sending Loudness Rating (SLR)

Receiving Loudness Rating (RLR)

Side Tone Masking Rating (STMR)

Echo Loss (EL)

Idle Noise-Sending (INS)

Idle Noise-Receiving (INR)

TDMA Noise

-. GSM : Power Level : 5

DCS/PCS : Power Level : 0

(Cell Power : -90 ~ -105 dBm)

13

MS and

Headset

Max

-. Acoustic (Max Vol.)

MS/Headset SLR : 8 ± 3dB

MS/Headset RLR : -15 ± 3dB/-12

(SLR/RLR : Mid-value setting)

2.8 Charging

• Charging Method : CC & CV (Constant Current and Constant Voltage)

• Maximum Charging Voltage : 4.2 V

• Maximum Charging Current : 700 mA

• Normal Battery Capacity : 950 mAh

• Charging Time : Max 3 hours (except for trickle charging time)

• Full charging indication current (charging icon stop current) : 80 mA

• Cut-off voltage : 3.20 V

MS

Headset

Nor

Max

Min

Min

Max

Nor

Max

Nor

Max

Min

Min

Max

Nor

Max

Specification

8 ±3 dB

-4 ± 3 dB

-15 ± 3 dB

17 dB

40 dB

-64 dBm0p

Under -47 dBPA

Under -36 dBPA

8±3dB

-1 ±3 dB

-12 ±3 dB

25 dB

40 dB

-55 dBm0p

Under -45 dBPA

Under -40 dBPA

Under -62 dBm

- 16 -

3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.1 General Description

The U250/KU250 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based

GSM/GPRS/UMTS. All receivers and the UMTS transmitter use the radio One 1 Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quadband GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.

UMTS (2100)

GSM (900, 1800, 1900)

Bluetooth

1. RTR6275 for GSM Tx and WCDMA Tx

2. RTR6275 for GSM Rx and WCDMA Rx

3. Bluetooth RF module

4. PM6650 for power management

[Fig 1.1] Block diagram of RF part

1 QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.

- 17 -

3. TECHNICAL BRIEF

A generic, high-level functional block diagram of U250/KU250 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module).

The UMTS receive path each include a LNA, a RF band-pass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF technique. The RFIC Rx analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same inputs to the MSM IC.

For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSM device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The

RTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective UMTS PA. The high- and low-band UMTS RF transmit signals emerge from the RTR6275 transceiver.

In the GSM receive paths, the received RF signals are applied through their band-pass filters and down-converted directly to baseband in the RTR6275 transceiver IC. These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for further signal processing.

The GSM transmit paths employ one stage of up-conversion and, in order to improve efficiency.

1. The on-chip quadrature up-converter translates the GMSK-modulated signal to a constant envelope phase signal at RF;

2. The amplitude-modulated (AM) component is applied to the ramping control pin of power amplifier from a DAC within the MSM

U250/KU250 power supply voltages are managed and regulated by the PM6650 Power Management

IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as userdefined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.

- 18 -

3. TECHNICAL BRIEF

3.2 GSM Mode

3.2.1 GSM Receiver

The Dual-mode U250/KU250’s receiver functions are split among the three RFIC’s as follows:

• GSM-900, DCS-1800, and PCS-1900 UMTS-2100 modes use the RTR6275 IC only. Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SBI 2 -controlled parameters.

RF Front end consists of antenna, antenna switch module(D5011) which includes three RX saw filters(GSM900, DCS and PCS). The antenna switch module allows multiple operating bands and modes to share the same antenna. In U250/KU250, a common antenna connects to one of six paths:

1) UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800 Tx, PCS-

1900 Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. The GSM900, DCS, and PCS operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required.

GSM 1800 / GSM1900 RX

GSM 900 RX

GSM 900 TX / WCDMA

GSM 1800 / GSM 1900 TX

[Table 1.1] Antenna Switch Module Control logic

2 The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application

Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS

Software documentation for details.

- 19 -

3. TECHNICAL BRIEF

The GSM900, DCS, and PCS receiver inputs of RTR6275 are connected directly to the transceiver front-end circuits(filters and antenna switch module). The GSM900, DCS, and PCS receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance. The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins

Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers this is accomplished in the switch module.

The GSM900, DCS, and PCS receive signals are routed to the RTR6275 through band selection filters and matching networks that transform single-ended 50-Ω sources to differential impedances optimized for gain and noise figure. The RTR input uses a differential configuration to improve second-order intermodulation and common mode rejection performance. The RTR6275 input stages include MSMcontrolled gain adjustments that maximize receiver dynamic range.

The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters.

The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM6245 IC for further processing (an interface shared with the RFR6275 UMTS receiver outputs).

- 20 -

[Fig 1.2] RTR6275 RX feature

- 21 -

3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.2.2 GSM Transmitter

The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT)include on-chip output matching inductors. The 50ohm output impedance is achieved by adding a series capacitor at the output pins.

The capacitor value may be optimized for specific applications and PCB characteristics based on passband symmetry about the band center frequency, the suggested starting value is shown in Figure1.3.

6pF 51 Ω

91 Ω

12pF 39 Ω

91 Ω

100 Ω 100 Ω

[Fig 1.3] GSM Transmitter matching

The RTR6275 IC is able to support GSM 900 and GSM 1800/1900 mode transmitting. This design guideline shows a tri-band GSM application.

Both high-band and low band outputs are followed by resistive pads to ensure that the load presented to the outputs remains close to 50ohm. The low-band GSM Tx path also includes a Tx-band SAW filter to remove noise-spurious components and noise that would be amplified by the PA and appear in the

GSM Rx band

- 22 -

3. TECHNICAL BRIEF

3.3 UMTS Mode

3.3.1 Receiver

The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential downconverter. This second stage input is configured differentially to optimize second-order intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RFtobaseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with

GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6275 is downconverting GSM signals and on when the UMTS is operating.

3.3.2 Transmitter

The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The upconverter output is amplified by multiple variable gain stages that provide transmit AGC control. The

AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that simplifies the external matching network to a single series capacitor to achieve the desired 50-Ω interface.

The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the antenna through the switch module. The transceiver LO synthesizer is contained within the

RTR6275 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for multimode applications. The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital logic generator.

UMTS Tx using PLL1, the LO generation and distribution circuits create the necessary LO signals for different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal directly from baseband to RF. This requires F

LO to equal F

RF

, and the RTR6275 IC design achieves this without allowing F

VCO to equal F

RF

.

The RTR6275 IC is able to support UMTS 2100/1900 and UMTS 850 mode transmitting. This design guideline shows only UMTS 2100 applications.

- 23 -

3. TECHNICAL BRIEF

WCDMA_2100_TX

WCDMA_2100_RX

[Figure 1.4] RTR6275 IC functional block diagram

- 24 -

3. TECHNICAL BRIEF

3.4 LO generation and distribution circuits

The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM and UMTS band upconverters and downconverters; with the help of these LO generation and distribution circuits, zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from

RF to baseband and from baseband to RF.

Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the

RTR6275 IC. The first synthesizer (PLL1) creates the transceiver LOs that support the UMTS

2100/1900/1800 transmitter, and all four GSM band receivers and transmitters including: GSM 850,

GSM 900, GSM 1800, and GSM 1900. The second synthesizer (PLL2) provides the LO for the UMTS

2100/1900/1800 receiver. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked. The RTR6275 IC integrates most of PLL loop filter components on-chip except two off-chip loop filter series capacitors, and significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6275 has the advantages of more flexible loop bandwidth control, fast lock time, and low-integrated phase error

3.5 Off-chip RF Components

3.5.1 WCDMA PAM (U103: WS2512-TR1G)

The UMTS PA output power is monitored by l power detector circuits(U100 : RTR6275) .

This detector voltage can be used for transmitter calibration and monitor to meet RF system

Rev.D

WCDMA

L404

1.8nH

4

3

FL104

PGND

ANT

RX

TX

ACMD-7602

1

2

0.5p

L125

C162

3.3p

+VPWR

C155

4.7u

C158

15p

20dB

U102

CP0402A1950DNTR

R121

130

R120

47

7dB

R122

130

PWR_DET

C164

0.5p

L123

1nH

C165

1p

Rev_1.0

WS2512_TR1G

10

VCC2

9

GND4

8

RFOUT

7

6

11

GND3

GND2

BGND

U103

1

VCC1

RFIN

2

GND1

3

VCONT

4

VREF

5

C159

15p

+VPWR

C192

100p

TR100

KRX102U

PA_R0

L122

NA

C154

1.5p

Rev_1.0

C157

10nH

FL102

EFCH1950TDF1

4 5

O1 G3

G2 G1

IN

1

3 2

PA_ON

C170

0.1u

VREG_TCXO_2.85V

Rev.B

[Figure 1.5] WCDMA PAM, Duplexer, Coupler

- 25 -

3. TECHNICAL BRIEF

3.5.2 VCTCXO (X100 : DSA321SCE-19.2M)

The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the

MSM6245 IC. The oscillator frequency is controlled by the MSM6245 IC.

TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control

TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line.

The PM6650 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is enabled by the MSM TCXO_EN line . The PM6650 IC VREG_TCXO regulated output voltage is used to power the VCTCXO and is enabled before most other regulated outputs.

Any GSM mode power control circuits within the MSM6245 IC require a reference voltage for proper operation and sufficient accuracy. Connecting the PM6650 IC REF_OUT directly to the MSM6245 IC

GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 •ÏF low frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both sides, plus ground above and below if routed on internal layers.

3.5.3 Front-End Module (U500 : D5011)

This equipment uses a single antenna to support all handset operating modes, with an antenna switch module select the operating frequency and band. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. The active connection is MSM-selected by three control lines (GPIO[9], GPIO[10]).

Two GPIO are programmed to be ANT_SEL0_N, ANT_SEL1_N) respectively.

GSM 1800 / GSM1900 RX

GSM 900 RX

GSM 900 TX / WCDMA

GSM 1800 / GSM 1900 TX

[Table 1.2] Front End Module control logic

- 26 -

3. TECHNICAL BRIEF

3.5.4 PMIC Functional Block Diagram (U300 : PM6650-2M)

• Input power management

- Valid external supply attachment and removal detection

- Supports unregulated (closed-loop) external charger supplies and USB supplies as input power sources

- Supports lithium-ion main batteries

- Trickle, constant current, constant voltage, and pulsed charging of the main battery

- Supports coin cell backup battery (including charging)

- Battery voltage detectors with programmable thresholds

- VDD collapse protection

- Charger current regulation and real-time monitoring for over-current protection

- Charger transistor protection by power limit control

- Control drivers for two external pass transistors and one external battery MOSFET - MOSFET is optional

- Voltage, current, and power control loops

- Automated recovery from sudden momentary power loss

• Output voltage regulation

- One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hosting

USBOTG

- Three buck (step-down) switched-mode power supplies that efficiently generate MSMC, MSME, and PA (or second MSMC) supply voltages

- Supports dynamic voltage scaling (DVS) for MSMC and PA

- Eleven low dropout regulator circuits with programmable output voltages, implemented using three different current ratings: 300 mA (two), 150 mA (six), and 50 mA (three). These can be used to power MSMA, MSMP, RFRX1, RFRX2, RFTX, SYNT, TCXO, WLAN, MMC, USB, and RUIM circuits.

- All regulators can be individually enabled/disabled for power savings

- Low power mode available on MSMA and MSMP regulators

- All regulated outputs are derived from a common bandgap reference-close tracking

• Integrated handset-level housekeeping functions reduces external parts count, size, cost

- Analog multiplexer selects from 8 internal and up to 18 external inputs

- Multiplexer output’s offset and gain are adjusted, increasing the effective ADC resolution

- Adjusted multiplexer output is buffered and routed to an MSM device ADC

- Dual oscillators - 32.768 kHz off-chip crystal and on-chip RC assures MSM device sleep clock

- Crystal oscillator detector and automated switch-over upon lost oscillation

- Real time clock for tracking time and generating associated alarms

- On-chip adjustments minimize crystal oscillator frequency errors

- Circuits control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal

- TCXO buffer control for optimal QPH/catnap timing

- Three-stage over-temperature protection (smart thermal control)

- 27 -

3. TECHNICAL BRIEF

• Integrated handset-level user interfaces

- Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash, and general-purpose drivers

- Vibration motor driver programmable from 1.2 to 3.1V in 100 mV increments

- Speaker driver with programmable gain, turn-on time, and muting; differential operation (drives external 8 Ω speakers with volume controlled 500 mW)

• IC-level interfaces

- MSM device-compatible 3-line SBI for efficient initialization, status, and control

- Supports the MSM device’s interrupt processing with an internal interrupt manager

- Many functions monitored and reported through real-time and interrupt status signals

- Dedicated circuits for controlled power-on sequencing, including the MSM device’s reset signal

- Several events continuously monitored for triggering power-on/power-off sequences

- Supports and orchestrates soft resets

- USB-OTG transceiver for full-speed (12 Mb/s) and low speed (1.5 Mb/s) interfacing of the MSM device to computers as a USB peripheral, or connecting the MSM device to other peripherals -

RUIM level translators enable MSM device interfacing with external modules

• Twelve multi-purpose pins that can be configured as digital or analog I/Os, bi-directional I/Os, or current sinks. Default functions support the RUIM level translators, power-on circuits, analog multiplexer inputs, an LED driver, and a reference voltage buffer.

• Highly integrated functionality in a small package - 84-pin BCCS with a large center slug for electrical ground, mechanical stability, and thermal relief

[Figure 1.6] MSM6245 Interface

- 28 -

[Figure1.7] PM6650 Block Diagram

- 29 -

3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.5.5 GSM PAM (U101 : SKY77318)

The SKY77318 is an extremely small (6 x 6 mm), GSM PAM for handset applications. This module has been optimized for excellent efficiency and Pout while maintaining high GSM/GPRS efficiency.

The small size and high performance is achieved with high-reliability GaAs HBT technology.

With 50Ω and output, no external matching or bias components are required. The module incorporates two highly-integrated GaAs power amplifier die with a BiCMOS controller.

Each amplifier has three gain stages with on-die inter-stage matching implemented with a high Q passives technology for optimal performance. The CMOS controller implements a fully integrated power control within the module for GSM operations, and serves as the GPRS operations. This eliminates the need for any external couplers, power detectors, current sensing etc., to assure the output power level. The module has Tx enable and band select inputs. Module construction is a lowprofile overmolded land-grid array on laminate.

L115

18nH

C124

100p

L403

1.5nH

L116

10nH

Rev.D

C123

0.01u

C121

33u

+VPWR

EGSM

NA

L406 2.7nH

L111

5.6nH

C137

NA

C441

5.6p

C438

100p

C138

NA

C139

68p

C134

0.01u

C136

0.01u

8.86dB

R108

Rev.1.0

51

15

11

19

21

DCS_PCS_OUT

EGSM_OUT U101

DCS_PCS_IN

3

EGSM_IN

4

RSVD_GND ENABLE

18

SKY77318

P_GND BS

1

FL101

R113 100ohm

C149

15p

O1

4

G2

5

G3

G1

IN

1

3 2

GSM_PA_EN

EFCH897MTDB1

R117 100ohm

C153

15p

GSM_PA_BAND

GSM_PA_BAND

LOW

HIGH

MODE

GSM

DCS/PCS

7.5dB

R112

39

GSM_TX

DCS_PCS_TX

[Figure 1. 8] GSM PAM Schematic

- 30 -

3. TECHNICAL BRIEF

3.5.6 UMTS Duplexer(FL104:ACMD-7602)

A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include;

• Insertion loss. this component is also in the receive and transmit paths ; In the U250/KU250 typical losses : UMTS2100_ Tx = 1.2 dB, UMTS2100_ Rx = 1.4 dB

• Out-of-band rejection or attenuation. the duplexer provides input selectivity for the receiver, output filtering for the transmitter, and isolation between the two. Rejection levels for both paths are specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver performance:

• Rx-band isolation. the transmitter is specified for out-of-band noise falling into the Rx band. This noise leaks from the transmit path into the receive path, and must be limited to avoid degrading receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and

Rx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 51 dB.

• Tx-band isolation. the transmit channel power also leaks into the receiver. In this case, the leakage is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimum duplexer Tx-band isolation value is about 58dB.

• Passband ripple. the loss of this fairly narrowband device is not flat across its passband. Passband ripple increases the receive or transmit insertion loss at specific frequencies, creating performance variations across the band.s channels, and should be controlled.

• Return loss. minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).

• Power handling. high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be used between the UMTS PA and duplexer to assure proper performance.

- 31 -

3. TECHNICAL BRIEF

3.5.7 UMTS Rx RF filter (FL103 : EFCH2140TDE1)

• Frequency range : 2110 ~ 2170MHz

An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include:

• Out-of-band rejection or attenuation levels, usually specified to meet these conditions:

- FFar out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency.

- Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band leakage.

- Other frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input.

Table 1.3 WCDMA Rx SAW Filter Specification

- 32 -

3. TECHNICAL BRIEF

3.5.8 Bluetooth (M100 : LBRQ-2B43A)

The MSM6245 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure1.9 shows the bluetooth system architecture in the U250/KU250.

MSM6245

Bluetooth baseband

[Figure1.9] Bluetooth system architecture

- 33 -

3. TECHNICAL BRIEF

3. BB Technical Description

3.6 Digital Baseband(DBB/MSM6245)

3.6.1 General Description

A. Features(MSM6245)

• Support for multimode operation - tri-band WCDMA (UMTS), quad-band GSM/GPRS/EDGE

• Support for WCDMA (UMTS) uplink data rate up to 384 kbps

• High-performance ARM926EJ-S running at up to 225 MHz

• ARM Jazelle Java hardware acceleration for faster Java-based games and other applets

• QDSP4000 high-performance DSP cores

• Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals

• Qcamera™ with 30 fps QCIF viewfinder resolution, and support for 2 MP camera sensors

• Direct interface to digital camera module with video front end (VFE) image processing

• True 3D graphics for advanced wireless gaming

• SecureMSM v2.0 includes support for Open Mobile Alliance (OMA) DRM v2.0, SIM-lock and IMEI integrity. Support for Q-fuse. Only trusted boot is supported

• Audio that is on par with portable music players

• Vocoder support (AMR, FR, EFR, HR)

• Advanced 14 x 14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology

• SD/SDIO hardware support

- 34 -

3. TECHNICAL BRIEF

USB

Bluetooth

RF Module

GSM Block

VCTCXO

PM6650

-2M

GSM

PAM

GSM

TX SAW

GSM900 Tx

GSM1800/1900 Tx

GSM900 Rx

GSM1800 Rx

GSM1900 Rx

GSM

VCO

Front

End

Module

WCDMA Block

COUPLER

WCDMA

PAM

WCDMA

TX SAW

RTR6275

WCDMA2100 Tx

Duplexer

WCDMA2100 Rx

HDET

WCDMA

VCO

WCDMA

RX SAW

AntSW Logic

SPK/RCV

MIC

MAIN LCD

MSM6245

1.3M CAM

VGA CAM

U-SIM

NAND, SDRAM

FLASH

KEYPAD

Figure 1.10 Simplified Block Diagram

- 35 -

3. TECHNICAL BRIEF

3.7 Block Diagram(MSM6245)

SDRAM

512Mbit

NAND Flash

512Mbit

LCD

(1.76inch)

Camera 1.3M

VGA camera

CAMERA

PROCESSING

(Default 8bit

Interface)

GRAPHICS

Open GL ES

3D, 2D

VIDEO

MPEG-4

H.263, H.264

AUDIO

MP3, AAC,

EVRC, QCELP

AMR, CMX, MIDI

EBI 1 EBI 2

DUAL MEMORY BUS

MSM6245

Modem QDSP 4000

PLL

QDSP 4000

ARM 926ejs

With Jazelle

CONNECTIVITY

GSM/GPRS/EDGE processor

UMTS, WCDMA

BT 1.2

processor

GPIO

RF SBI

Rx ADC

Tx DAC

PM6650

US B

Figure 1.11 Simplified Block Diagram of MSM6245

USIM

- 36 -

3. TECHNICAL BRIEF

3.8 Subsystem(MSM6245)

3.8.1. ARM Microprocessor Subsystem

The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a Generic single-wire serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the

RTR6275, RFR6275 and PM6650 devices.

3.8.2. WCDMA R99 features

The MSM6245 device supports release 99 June 2004 of the W-CDMA FDD standard, including the following features:

■ All modes and data rates for W-CDMA frequency division duplex (FDD), with the following restrictions:

❏ The downlink supports the following specifications:

- Up to four physical channels, including the broadcast channel (BCH), if present

- Up to three dedicated physical channels (DPCHs)

- Spreading factor (SF) range support from 4 to 256

- The following transmit diversity modes are supported:

❏ Space time transmit diversity (STTD)

❏ Time-switched transmit diversity (TSTD)

❏ Closed-loop feedback transmit diversity (CLTD)

■ The uplink supports the following specifications:

❏ The uplink provides the following UE support:

- One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary

- A maximum data rate of 384 kbps

❏ Full SF range support from 4 to 256

■ SMS (CS and PS)

■ PS data rate - 384 kbps DL / 384 kbps UL

■ CS data rate - 64 kbps DL / 64 kbps UL

■ AMR (all rates)

- 37 -

3. TECHNICAL BRIEF

3.8.3. GSM features

The following GSM modes and data rates are supported by the MSM6245 device hardware. Support modes conform to release '99 specifications of the sub-feature.

■ Voice features

❏ FR

❏ EFR

❏ AMR

❏ HR

❏ A5/1, A5/2, and A5/3 ciphering

■ Circuit-switched data features

❏ 9.6k

❏ 14.4k

❏ Fax

❏ Transparent and non-transparent modes for CS data and fax

❏ No sub-rates are supported.

3.8.4. GPRS features

■ Packet switched data (GPRS)

❏ DTM (Simple Class A) operation

❏ Multi-slot class 12 data services

❏ CS schemes: CS1, CS2, CS3, and CS4

❏ GEA1, GEA2, and GEA3 ciphering

■ Maximum of four Rx timeslots per frame

3.8.5. EDGE features

■ EDGE E2 power class for 8 PSK

■ DTM (simple Class A), multi-slot class 12

■ Downlink coding schemes - CS 1-4, MCS 1-9

■ Uplink coding schemes - CS 1-4, MCS 1-9

■ BEP reporting

■ SRB loopback and test mode B

■ 8-bit, 11-bit RACH

■ PBCCH support

■ 1 phase/2 phase access procedures

■ Link adaptation and IR

■ NACC, extended UL TBF.

- 38 -

3. TECHNICAL BRIEF

3.8.6. MSM6245 device audio processing features

■ Integrated wideband stereo CODEC

❏ 16-bit DAC with typical 88 dB dynamic range

❏ Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path

■ VR- Voice mail + voice memo

■ Acoustic echo cancellation

■ Audio AGC

■ Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8

(G2)

■ Internal vocoder supporting AMR, FR, EFR, and HR

3.8.7. MSM6245 microprocessor subsystem

■ Industry standard ARM926EJ-S embedded microprocessor subsystem

❏ 16 kB instruction and 16 kB data cache

❏ Instruction set compatible with ARM7TDMI®

❏ ARM version 5TEJ instructions

❏ Higher performance 5 stage pipeline, Harvard cached architecture

❏ Higher internal CPU clock rate with on-chip cache

■ Java hardware acceleration

■ Enhanced memory support

❏ 75 MHz and 90 MHz bus clock for SDRAM

❏ 32-bit SDRAM

❏ Dual memory buses separating the high-speed memory subsystem (EBI1) from low-speed peripherals (EBI2) such as LCD panels

❏ 1.8 memory interface support for EBI1 and 1.8 V or 2.6 V memory interface support EBI2

❏ NAND FLASH memory interface

- 8/16-bit data I/O width NAND flash support

- 1- or 4-bit ECC

- 512-byte/2KB page-size support

- 2 chip selects supported for NAND Flash

❏ Boot from NAND

❏ Low-power SDRAM (LP-SDRAM) interface

■ Internal watchdog and sleep timers

3.8.8. Supported interface features

■ USB On-the-Go core supports both slave and host functionality

■ Three universal asynchronous receiver transmitter (UART) serial ports

■ USIM controller (via UART)

■ Integrated 4-bit secure digital (SD) controller for SD and Mini SD cards

■ Parallel LCD interface

■ General-purpose I/O pins

■ External keypad interface

- 39 -

3. TECHNICAL BRIEF

3.8.9. Supported multimedia features

■ Provide additional general purpose MIPS by using:

❏ Two QDSP4000s

❏ Dedicated hardware accelerators and compression engines

■ Improve Java, BREW, and game performance

❏ Integrated Java and 2D/3D graphics accelerator with Sprite engine

■ Enable various accessories via USB host connectivity.

❏ Integrated USB host controller functionality

■ Enable compelling visual and audio applications.

Qcamera TM

■ High-quality digital camera processing, supporting CCD or CMOS image sensors up to 2MP

■ 30 fps QCIF viewfinder

Qtv TM

■ Audio and video decoder that supports VOD, MOD and Broadcast multimedia services.

■ Audio codecs supported: AMR-NB, AMR-WB, AMR-WB+, AAC, AAC Plus, Enhanced AAC Plus,

Windows® Media Audio v9, RealAudio® v8

■ Integrated stereo wideband codec for music/digital clips

■ CMX

■ Video codecs supported: MPEG-4, H.263, H.264, Windows Media® v9 and RealNetworks® v10

Video telephony services: Qvideophone TM

■ A two-way mobile video conferencing solution that delivers 15 fps @ QCIF, 64kbps

■ Video codecs supported: MPEG-4 and H.263

■ Audio codecs supported: AMR-NB.

Qcamcorder TM

■ Real time mobile video encoder

■ Video codecs supported: MPEG-4, H.263.H.264

■ Audio codecs supported: AMR-NB

■ Recording performance: 15 fps @ QCIF, 192 kbps

CMX TM (MIDI and still image, animation, text, LED/vibrate support)

■ 72 simultaneous polyphonic tones

■ 44 kHz sampling rate

■ 512 kB wave table

■ Support of universal file formats

❏ Standard MIDI Format (SMF)

❏ SP-MIDI

❏ SMAF Audio playback (MA-2, MA-3, MA-5)

❏ XMF/OLS

❏ MFi (requires Docomo license)

- 40 -

■ PNG decoder

■ Pitch bend range support

■ LED/vibrate support

■ Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2)

■ MLZ decoder

■ Integrated PNG/SAF A.T.

3. TECHNICAL BRIEF

Table 1-1 Summary of MSM6245 device features

Note:

1. At this time, only 32-bit SDRAM is supported on the MSM6245 device. There are potential MIPS issues when running Bluetooth and video telephony concurrently with any other memory configuration.

16-bit SDRAM and NOR FLASH are currently being evaluated and documentation will be updated accrdingly in the next revision.

- 41 -

3. TECHNICAL BRIEF

Table 1-2 Description of RF configurations

- 42 -

3. TECHNICAL BRIEF

3.8.10. Stereo Wideband CODEC

The MSM6245 device integrates a wideband voice/audio CODEC into the mobile station modem

(MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface.

The CODEC integrates the microphone and earphone amplifiers into the MSM6245 device, reducing the external component count to just a few passive components.

The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set externally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission systems.

3.8.11. Vocoder Subsystem

The MSM6245 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to support DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), ear seal echo canceller (ESEC),

Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR,

Tx/Rx compensation filters. The MSM6245 device’s integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.

3.8.12. ARM Microprocessor subsystem

The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM device, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a generic single serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the RFR6275, RTR6275, and PM6650 devices.

3.8.13. Mode Select and JTAG Interfaces

The mode pins to the MSM6245 device determine the overall operating mode of the ASIC. The options under the control of the mode inputs are Native mode, which is the normal subscriber unit operation,

ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM6245 device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects between devices within the mobile station during manufacture.

- 43 -

3. TECHNICAL BRIEF

3.8.14. General-Purpose Input/Output Interface

The MSM62450 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional

RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.

3.8.15. UART

The MSM6245 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share multiplexed pins.

3.8.16. USB

The MSM6245 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral communicating with the USB host. MSM6245 supports the 3-wire functionality.

- 44 -

3. TECHNICAL BRIEF

3.9 Power Block

3.9.1. General

MSM6245, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of

MSM6245, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are :

3.9.2. PM6650

The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages.

Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference. A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (under-voltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions.

MSM device controls and statuses the PM6650 IC using Single Serial Bus Interface (SSBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.

- 45 -

3. TECHNICAL BRIEF

Figure 1.12 PM6650 Functional Block Diagram

- 46 -

3. TECHNICAL BRIEF

3.9.3. Charging control

A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER and

ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.

4.2V~3.82V

100~70 (%)

3.81V~3.74V

69~45 (%)

3.73V~3.69V

44~20 (%)

3.68V~3.59V

19~3 (%)

3.58V~3.20V

2~0 (%)

Figure 1.13 U250/KU250 Battery Bar Display(Stand By Condition)

- 47 -

3. TECHNICAL BRIEF

Trickle Charging

Trickle Charging of the main battery, enabled through SBI control and powered from V

DD

, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from V

DD to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its performance specified below (3.2V). The charging current is set to 80mA.

Parameter

Trickle Current

Min

60

Typ

80

Max

100

Unit mA

- 48 -

3. TECHNICAL BRIEF

Constant Current Charging

The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.

Constant Voltage Charging

Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected 10% of the full charging current.

• Charging Method : CC & CV (Constant Current & Constant Voltage)

• Maximum Charging Voltage : 4.2V

• Maximum Charging Current : 600mA

• Nominal Battery Capacity : 950mAh

• Charger Voltage : 5.1V

• Charging time : Max 3h (Except time trickle charging)

• Full charge indication current (icon stop current) : 100mA

• Low battery POP UP : Idle - 3.58V, Dedicated(GSM/WCDMA) - 3.58V

• Low battery alarm interval : Idle - 3 min, Dedicated - 1min

• Cut-off voltage : 3.20V

- 49 -

3. TECHNICAL BRIEF

3.10 External memory interface

The MSM6245 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SDRAM, etc.

• EBI1 Features

- 16 bit static and dynamic memory interface

- 32 bit dynamic memory interface

- 24 bits of address for static memory devices which can support up to 32MBytes on each chip select

- Synchronous burst memories supported (burst NOR, burst PSRAM)

- Synchronous DRAM memories supported

- Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses

- Pseudo SRAM (PSRAM) memory support

• EBI2 Features

- Support for asynchronous FLASH and SRAM(16bit & 8bit).

- Interface support for byte addressable 16bit devices (UB_N & LB_N signals).

- Support for 8 bit/16bit wide NAND flash.

- Support for parallel LCD interfaces, port mapped of memory mapped(18 or 16 bit).

• 512Mb NAND(8bit) flash memory + 512Mb SDRAM (32bit)

Device

FLASH

SDRAM

Part Name

HYC0UEH0MF3P

HYC0UEH0MF3P

Interface Spec

Maker hynix hynix

Read Access Time

60 ns

Table#1. External memory interface

7 ns

Write Access Time

60 ns

7 ns

- 50 -

3. TECHNICAL BRIEF

SDRAM

512Mb

EBI1

ADDRESS[14:0]

DATA[31:0]

WE*

CS*

CAS*

RAS*

CLK_EN

CLK

DQM[3:0]

EBI2

MSM6245

NAND_CS*

NAND_RE*

NAND_WE*

NAND_CLE

NAND_WP*

NAND_ALE

NAND_READY

DATA[7:0]

NAND

512Mb

(64MB)

Figure 1.14 Simplified Block Diagram of Memory Interface

- 51 -

3. TECHNICAL BRIEF

3.11 H/W Sub System

3.11.1. RF Interface

A. RTR6275(WCDMA_Tx, GSM_Tx/Rx)

MSM6245 controls RF part(RTR6275) using these signals.

• SBST : SSBI I/F signals for control Sub-chipset

• PA_ON1 : Power AMP on RF part

• RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF

• TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier

• DAC_REF : Reference input to the MSM Tx data DACs

XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77

UART3_RFR_N_GPIO87

UART2_DP_RX_DATA_GPIO89

SYNTH0_GP_PDM0_GPIO92

SBST1_GPIO93

L25

H6

F18

H18

TX_AGC_ADJ

TRK_LO_ADJ

TCXO_EN_GPIO94

PA_ON0

H13

L13

F19

F17

Q_OUT_N

Q_OUT

I_OUT_N

I_OUT

DAC_REF

A12

B12

A13

B13

F12

Q_IM_CH1

Q_IP_CH1

I_IM_CH1

I_IP_CH1

Q_IM_CH0

Q_IP_CH0

I_IM_CH0

I_IP_CH0

W23

V23

V25

W25

AA25

Y25

AB25

AC25

GP_PDM2_PA_RAN_GE1

GP_PDM1_PA_RAN_GE0

D17

H17

TRST_N

TCK

TMS

TDI

TDO

RTCK

H15

D16

F15

D15

A17

H16

AUX_PCM_CLK_GRFC14_GPIO80

AUX_PCM_DIN_GRFC13_GPIO14

AUX_PCM_DOUT_GRFC12_GPIO103

AUX_PCM_SYNC_GRFC11_GPIO102

TX_ON_GRFC10

K19

N21

G4

J8

H12

GRFC8_GPIO11

GRFC7_GPIO10

GRFX6_GPIO9

GRFC5_AUX_SBST_GPIO8

GRFC4_AUX_SBCK_GPIO7

GRFC3_GPIO6

GRFC2_GPIO5

GRFC1_AUX_SBDT_GPIO4

GRFC0_GPIO3

B4

T23

T19

D11

H10

F10

D9

A8

B8

BT_CLK_GPIO25

BT_SBST_GPIO24

BT_SBCK_GPIO23

BT_SBDT_GPIO22

BT_TX_RX_N_GPIO21

BT_DATA_GPIO20

G23

F23

E26

E25

H21

R19

SPK_AMP_EN

TX_ON

ANT_SEL1

ANT_SEL0

GSM_PA_BAND

GSM_PA_EN

BT_CLK

BT_SBST

BT_SBCK

BT_SBDT

BT_TX_RX_N

BT_DATA

RCV_EN_N

LCD_IF_MODE_1

2K R213

Close to MSM

TX_AGC_ADJ

TRK_LO_ADJ

TCXO_EN

PA_ON

TX_QM

TX_QP

TX_IM

TX_IP

DAC_REF

RF

RX_QM

RX_QP

RX_IM

RX_IP

PA_R0

Figure 1.15 Schematic of RF Interface of MSM6245

- 52 -

3. TECHNICAL BRIEF

B. the others

• TRK_LO_ADJ : TCXO(19.2M) Control

• PA_ON : WCDMA(2100) TX Power Amp Enable

• ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)

• GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp

• GSM_PA_RAMP : Power Amp Gain Control of APC_IC

• GSM_PA_EN : Power Amp Gain Control Enable of APC_IC

- 53 -

3. TECHNICAL BRIEF

3.11.2. MSM Sub System

3.11.2.1. USIM Interface

SIM interface scheme is shown in Figure.

And, there control signals are followed

• USIM_CLK : USIM Clock

• USIM_Reset : USIM Reset

• USIM_Data : USIM Data T/Rx

MSM6245

USIM CLK

USIM Reset

USIM Data

PM6650

VREG_UIM 2.85V

USIM CLK

USIM Reset

USIM Data

USIM

Figure 1.16 SIM Interface

3.11.2.2. UART Interface

UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.

GPIO_Map

GPIO_96

GPIO_95

Name

UART_RXD

UART_TXD

Note

Data_Rx

Data_Tx

Table. UART Interface

- 54 -

3. TECHNICAL BRIEF

3.11.2.3. USB

The MSM6245 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the

MSM6245 was designed to comply with the definition of a peripheral as specified in USB Specification,

Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB

Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the

MSM6245.

Name

USB_DAT

USB_SE0

USB_OE_N

USB_VBUS

USB_D+

USB_D-

Note

Data to/from MSM

Data to/from MSM

Out-Put Enable of Transceiver

USB_Power From Host(PC)

USB Data+ to Host

USB Data- to Host

Table. USB Signal Interface

USB_OE_N

USB_CTL_N

USB_VBUS

USB_DAT

USB_D+

USB_SE0

USB_D-

R309 2.2K

C336

1608

4.7u

Figure 1.17 Schematic of USB block(MSM6245 Side & PM6650 Side)

12

13

14

15

16

17

18

19

20

21

VREG_5V

USB_OE_N

VSW_5V

USB_CTL_N

USB_VBUS

USB_DAT

USB_D_P

USB_SE0

USB_D_M

GP1_DRV_N(

- 55 -

3. TECHNICAL BRIEF

3.11.3 HKADC(House Keeping ADC)

The MSM6245 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6245 device has six analog input pins which are multiplexed to the input of the internal HKADC.

Channel

HKADC0

HKADC1

HKADC2

HKADC3

HKADC4

HKADC5

Figure 1.18 MSM6245 HKADC Block diagram

Signal

AMUX_OUT

VBATT_SENSE

NC

NC

PCB_Rev_ADC

Battery_THERM

Note

RF PAM Temperature Check

Battery voltage level

NC

NC

PCB Version Check

Battery Temperature Check

Table. HKADC channel table

- 56 -

3. TECHNICAL BRIEF

3.11.4. Key Pad

There are 23 main key buttons in Figure.

Shows the Keypad circuit. ‘END’ Key is connected to PMIC(PM6650).

COL0

ROW(0)

ROW(1)

ROW(2)

ROW(3)

ROW(4)

1

4

7

*

COL1

2

5

8

0

COL2

-

3

6

9

#

Table. Key Matrix Mapping Table

COL3

CLR

LEFT

OK

SEND

DOWN

VREG_MSMP_2.7V

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_ROW(4)

KEY_COL(0)

KEY_COL(1)

KEY_COL(2)

KEY_COL(3)

KEY_COL(4)

KEY MAP

400

1

403

4

406

7

HOT400

HOT4

407

8

409

0

401

2

404

5

CLR MENU

402

3

405

6

408

9

HOT401

HOT3

LEFT

OK

SND

DN

UP

RIGHT

SEARCH

BACK

Figure 1.19 Main Keypad Circuit

COL4

MENU

UP

RIGHT

SEARCH

BACK

PM_ON_SW_N

END

END

Figure 1.20 END Keypad Circuit

- 57 -

3. TECHNICAL BRIEF

3.11.5 Camera Interface

U250/KU250 Installed a 1.3M Pixel and 0.3Mega Camera. Below figure shows the camera socket type connector and camera I/F signal.

CAMERA

MEGA CAMERA CONNECTOR

REV_1.0

R436 0

CAM_DATA_OUT(0)

CAM_DATA_OUT(1)

CAM_DATA_OUT(2)

CAM_DATA_OUT(3)

CAM_DATA_OUT(4)

CAM_DATA_OUT(5)

CAM_DATA_OUT(6)

CAM_DATA_OUT(7)

22

23

24

1

2

3

4

5

D0

D1

D2

D3

D4

D5

D6

D7

CN403

PCLK

VSYNC

HSYNC

STANDBY

SCK

SDA

RESETB

MCLK

20

19

18

9

7

12

11

10

CAM_PCLK

CAM_VSYNC_OUT

CAM_HSYNC_OUT

MEGA_CAM_PWR_DOWN

I2C_SCL

I2C_SDA

MEGA_CAM_RESET_N

CAM_MCLK

R437 20

VREG_CAM_AVDD_2.8V

VREG_CAM_DVDD_1.8V

CAM_DATA(0)

CAM_DATA(1)

CAM_DATA(2)

ICVE21184E150R500FR

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

INOUT_B1

9

8

INOUT_B2

INOUT_B3

7

6

INOUT_B4

CAM_DATA_OUT(0)

CAM_DATA_OUT(1)

CAM_DATA_OUT(2)

FL406

CAM_DATA(6)

CAM_DATA(7)

CAM_VSYNC

CAM_HSYNC

CAM_DATA(3)

CAM_DATA(4)

CAM_DATA(5)

FL407

ICVE21184E150R500FR

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

INOUT_B1

9

8

INOUT_B2

7

INOUT_B3

INOUT_B4

6

CAM_DATA_OUT(6)

CAM_DATA_OUT(7)

CAM_VSYNC_OUT

CAM_HSYNC_OUT

FL408

REV_1.0

COMMON_CAM_MCLK

ICVE21184E150R500FR

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

INOUT_B1

9

8

INOUT_B2

INOUT_B3

7

6

INOUT_B4

CAM_DATA_OUT(3)

CAM_DATA_OUT(4)

CAM_DATA_OUT(5)

VT_CAMERA_CONNECTOR

VREG_CAM_AVDD_2.8V

VGA_CAM_RESET_N

I2C_SCL

I2C_SDA

REV_1.0

VREG_CAM_DVDD_1.5V

COMMON_CAM_MCLK

CAM_PCLK

CAM_DATA_OUT(0)

1

2

3

4

5

P1

P2

P3

P4

P5

GND1

GND2

CN404

GND6

GND5

P15

P14

P13

P12

P11

15

14

13

12

11

CAM_HSYNC_OUT

CAM_VSYNC_OUT

CAM_DATA_OUT(7)

CAM_DATA_OUT(6)

CAM_DATA_OUT(1)

CAM_DATA_OUT(2)

CAM_DATA_OUT(3)

CAM_DATA_OUT(4) CAM_DATA_OUT(5)

Figure 1.21 Camera Socket Type Connector

- 58 -

3. TECHNICAL BRIEF

The MEGA Camera module is connected to socket type connector with 24 pin (F95M08). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 49.152MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from

MSM6245.

No

5

6

3

4

7

1

2

15

16

17

18

19

20

8

9

10

11

12

13

14

21

22

23

24

Name

CAM_DATA_OUT(3)

CAM_DATA_OUT(4)

CAM_DATA_OUT(5)

CAM_DATA_OUT(6)

CAM_DATA_OUT(7)

GND

MCLK

GND

MEGA_CAM_RESET_N

I2C_SDA

I2C_SCL

MEGA_CAM_PWR_DN

VREG_CAM_DVDD_1.8V

VREG_CAM_AVDD_2.8V

GND

VREG_CAM_AVDD_2.8V

GND

CAM_HSYNC_OUT

CAM_VSYNC_OUT

CAM_PCLK

GND

CAM_DATA_OUT(0)

CAM_DATA_OUT(1)

CAM_DATA_OUT(2)

Port

O

O

O

O

O

GND

I

GND

I

GND

O

O

O

GND

I

O

O

I

I

I

GND

O

O

O

Note

Data

Data

Data

Data

Data

GND

Master Clock(24.576M)

GND

Camera reset signal

I2C Data

I2C Clock

Camera power down

DVDD

VDDIO

GND

AVDD

GND

Horizontal Sync

Vertical Sync

Pixel Clock (49.152M)

GND

Data

Data

Data

Table. Interface between MEGA Camera Module and MAIN PCB (in camera module)

- 59 -

3. TECHNICAL BRIEF

The VGA Camera module is connected to socket type connector with 20 pin (CLE9120-2761E). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 12.288MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.

The camera module is controlled by I2C port from MSM6245.

8

9

6

7

10

11

12

13

14

15

16

17

18

19

20

2

3

4

5

No

1

CAM_MCLK

GND

CAM_PCLK

CAM_DATA(0)

CAM_DATA(1)

CAM_DATA(2)

CAM_DATA(3)

CAM_DATA(4)

CAM_DATA(5)

CAM_DATA(6)

CAM_DATA(7)

CAM_VSYNC

CAM_HSYNC

GND

I2C_SDA

I2C_SCL

VGA_CAM_RESET_N

VREG_AVDD_2.8V

VREG_AVDD_2.8V

Name

VREG_CAM_DVDD_1.8V

Port

I

O

O

O

O

O

O

O

O

O

I

GND

O

O

I

I

I

GN D

I

I

Note

DVDD

Master Clock(24.576M)

GND

Clock for Camera Data Out(12.288M)

Data

Data

Data

Data

Data

Data

Data

Data

Vertical Sync

Horizontal Sync

GND

I2C Data

I2C Clock

Camera reset signal

Camera I/O Power

Camera I/O Power

Table. Interface between VGA Camera Module and MAIN PCB (in camera module)

- 60 -

3. TECHNICAL BRIEF

3.11.6 Keypad Light

There are 8 Blue LEDs in Main key backlight circuit, which are driven by KYDB_BACKLIGHT line from

PM6650.

KEY_BACK_LIGHT LED(8EA)

+VPWR

LD400 LEBB-S14H

LD403 LEBB-S14H

LD406 LEBB-S14H

R411

100ohm

R414

100ohm

R417

100ohm

REV_B : EDLH0013501 --> EDLH0006001

KYBD_BACKLIGHT

LD404 LEBB-S14H

LD407 LEBB-S14H

R415

100ohm

R418

100ohm

LD402

LD405

LD408

LEBB-S14H

LEBB-S14H

R413 100ohm

LEBB-S14H

R416 100ohm

R419 100ohm

Figure 1.22 Schematic of KEY back light circuit (KEY side)

- 61 -

3. TECHNICAL BRIEF

CN400

35

34

33

32

31

30

29

28

27

25

23

22

21

20

19

17

15

16

14

13

18

12

11

10

9

8

7

24

6

5

26

4

3

2

1

3.11.7. LCD Module (NM176CN1 : Tovis)

- The NM176CN1 model is a Color TFT Main supplied by Tovis. This LCD Module has a 1.76 inch diagonally measured active display area with 176(RGB)X220 resolution. each pixel is divided into

Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes.

* Features

- Display mode(Main LCD) : Normally White, Transmissive TN mode 265K colors.

- LCD Driver IC: NT3916 (NOVATEK).

- 16 bit CPU interface Parallel

3.11.8. Display & LCD FPC Interface

LCD module is connected to LCD KEY FPCB with 35 pin (XF2B-3545-31A / OMROM) The LCD module is controlled by 16-bit EBI2 in MSM6245.

LCD CONNECTOR

LCD_RESET_N

LCD_IF_MODE_0

LCD_IF_MODE_1

LCD_VSYNC

ICVE21184E150R500FR

1

2

3

4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

9

8

7

6

FL401

LCD_CS_N

LCD_ADS

EBI2_WE_N

EBI2_OE_N

ICVE21184E150R500FR

7

6

9

8

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

1

2

3

4

FL400

ICVE21184E150R500FR

9

INOUT_B1 INOUT_A1

8

INOUT_B2 INOUT_A2

7

6

INOUT_B3

INOUT_B4

INOUT_A3

INOUT_A4

1

2

3

4

ICVE21184E150R500FR

FL402

1

2

3

4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

9

INOUT_B2

8

INOUT_B3

INOUT_B4

7

6

FL403

ICVE21184E150R500FR

1

2

3

4

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

9

INOUT_B2

8

INOUT_B3

INOUT_B4

7

6

FL405

EBI2_DATA(0)

EBI2_DATA(1)

EBI2_DATA(2)

EBI2_DATA(3)

EBI2_DATA(4)

EBI2_DATA(5)

EBI2_DATA(6)

EBI2_DATA(7)

EBI2_DATA(8)

EBI2_DATA(9)

EBI2_DATA(10)

EBI2_DATA(11)

EBI2_DATA(12)

EBI2_DATA(13)

EBI2_DATA(14)

EBI2_DATA(15)

LCD_MAKER_ID

VREG_LCD_2.8V

WLED_1

WLED_2

WLED_3

WLED_PWR

Figure 1.23 Interface between LCD Module and MAIN PCB.

- 62 -

3. TECHNICAL BRIEF

3.11.8.1. Audio Signal Processing & Interface

Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip

(MSM6245). This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to

RF Chipset. The downlink path amplifies the signal from DBB chip (MSM6245) and outputs it to receiver (or speaker).

The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_P, LINE_N) are differential outputs.

Earphone2 (HPH_L, HPH_R) is a single-ended output stage designed to drive a headset speaker.

The microphone interface consists of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.

(+16.5dB)

Figure 1.24 Audio Interface Detailed Diagram(MSM6245)

- 63 -

3. TECHNICAL BRIEF

MSM6245 CODEC pins

C200 47p

C201 47p

AUDIO

Near to MSM

C204

10p

C212

0.1u

10%

Place near

MSM pin W18

(CODEC VSS)

SDCC_DAT1_GPIO99

SDCC_DAT2_GPIO100

F25

M25

M26

Figure 1.25 Audio part schematics

VREG_MSMP_2.7V

R401

5.1K

C400

0.1u

HOOK_KEY

1

OUT

5

VCC

2

GND

U400

NCS2200SQ2T2G

4 VIN-

3 VIN+

10K

R404

MIC2N

MIC2P

HPH_L

HPH_R

USB_D+

USB_D-

EAR_SENSE_N

VBATT

2.2K

R400

MICBIAS

VREG_MSMP_2.7V

R403

51K

I/O CONNECTOR

C402

C401

33u

33u R406

R407 100ohm

100ohm

Figure 1.26 Audio part schematics

CN401

HSEJ-18S04-25R

21

19

1

2

3

4

7

8

9

5

6

- 64 -

3. TECHNICAL BRIEF

AUDIO

+VPWR

C410

0.01u

SPK-

SPK_RCV-

RCV-

SELECT_SPK&RCV

R422 10

1

U401

NLAS5223BMNR2G

10

VCC NO2

2

NO1

3

COM1

4

IN1

5

NC1

COM2

9

IN2

8

NC2

7

GND

6

10 R421

SPK+

SPK_RCV+

RCV_EN_N

RCV+

REV_B

MIC

REV_B : SUMY0010301 --> SUMY0003802

MIC400

OB4-15L42-C33L

1

2

R424

2.2K

C416

10u

C418 0.1u

C419 0.1u

C417

47p

MICBIAS

MIC1P

MIC1N

REV_B : EDTY0008606 --> EDTY0008601

Figure 1.27 Audio part schematics

- 65 -

3. TECHNICAL BRIEF

LINE_N

LINE_P

SPK_AMP_EN

R427

R429

1K

1K

C422

C423

REV_C : 20K --> 3K

0.1u

0.1u

R428 5.6K

R430 5.6K

R426

20K

R431

20K

C431

NA

Audio AMP

NCP2890DMR2

1

_SD OUTB

8

2

3

4

BYPASS

U402

VM

VP

INP

INM OUTA

7

6

5

C425

10u

C428

1u

SPK-

+VPWR

SPK+

SPK_RCV-

SPK_RCV+

L401

L402

100nH

100nH

REV_E : For Antenna Radiation

Audio part schematics

RCVN

RCVP

- 66 -

3. TECHNICAL BRIEF

3.11.8.2. Audio Mode

There are three audio modes (Voice call, speaker phone, MIDI/MP3).

MODE

Voice Call

Speaker phone

MIDI

MP3

Device

Receiver Mode

Loud Mode

Headset

Loud Mode

Loud Mode

Headset

Loud Mode

Headset

Description

Receiver Voice Call

Speaker Phone

Headset Voice Call

Speaker Phone

Speaker MIDI Bell

Headset MIDI Bell

Speaker MP3

Headset MP3

Table. Audio Mode

Audio & Sound Main Component

There are 6 main components in U250/KU250.

1

2

3

4

5

6

Component

MSM6245

Audio amp

Analog Switch

Speaker/Receiver

MIC

Ear jack

Design No.

U201

U402

Maker Part No.

MSM6245

NCP2890DMR2

U401

MIC400

NLAS5223BMNR2G

EMS1810TP

OB4-15L42-C33L

RMBLGG080STSB

Note

Base-Band Modem

1W Audio Amp

Dual Analog Switch

Speaker/Receiver

-42 dB microphone

Ear jack

Table. Audio main component list

- 67 -

3. TECHNICAL BRIEF

3.12 Main Features

1. LG-U250/KU250 Main features

- Bar Type

- WCDMA(2100) + GSM Tri-Band (900/1800/1900)

- Color LCD (Main:262K TFT, 1.76”)

- Dual Camera (1.3Mega + VGA(0.3M))

- 1810 speaker/receiver

- Stereo Headset

- Speaker phone (in GSM and WCDMA)

- MP3/AAC decoder and play

- MPEG4 encoder/decoder and play/save

- JPEG en/decoder

- Supports Bluetooth, USB

- 950 mAh (Li-Ion)

- 68 -

2. U250/KU250 Main Component

Logic

/Audio

3. TECHNICAL BRIEF

RF

Main board (Top)

Bluetoot h

Main board (Bottom)

Logic

- 69 -

3. TECHNICAL BRIEF

RF

U101

FL101

U100

X100

SW100

U500

FL104

U103

Reference

SW100

U500

U101

FL101

U100

Description

Ant. Switch module

Front End module

GSM PAM

GSM SAW

RTR6275

Reference

FL104

U103

X100

Description

W2100 Duplex

WCDMA PAM

VCTCXO

BT module

- 70 -

3. TECHNICAL BRIEF

Logic / Audio

BAT300

U303

CN403

CN401

U402

Reference

BAT300

U303

U402

Description

Backup Battery

1.3M Cam. LDO

Audio AMP

Reference

CN401

CN403

Description

MMI connector (18pin)

1.3M Cam. Connector

- 71 -

3. TECHNICAL BRIEF

Logic

U300

J300

Reference

U201

U301

CN400

Description

MSM6245_A

Memory MCP

Main To LCD Connector

Reference

U300

J300

S300

Description

PMIC

U-SIM socket

T-FLASH socket

- 72 -

CN400

U201

U301

S300

4. TROUBLE SHOOTING

4.1 RF Component

4. TROUBLE SHOOTING

- 73 -

4. TROUBLE SHOOTING

Block

Diagram

Block

Ref. Name Part Name

UMTS

Function Comment

- 74 -

4.2 SIGNAL PATH_UMTS RF

4. TROUBLE SHOOTING

- 75 -

Common Tx/Rx

UMTX 2100 Tx/Rx

UMTX 2100 Tx

UMTX 2100 Rx

Tx I/Q

LO

RX I/Q

4. TROUBLE SHOOTING

4.3 SIGNAL PATH_GSM RF

- 76 -

Common Tx/Rx

GSM900 Tx

DCS/PCS Tx

EGSM900 RX

PCS Rx

DCS RX

Tx I/Q

LO

RX I/Q

4. TROUBLE SHOOTING

4.4 Checking VC-TCXO Block

The reference frequency (19.2MHz) from X100 (VC-TCXO) is used in UMTS

TX part, GSM part and BB part.

TP1

VREG_TCXO_2.85V

TCXO

X100

DSA321SCE-19.2M

7

8

NC3

NC4

NC2

NC1

6

5

3

OUTPUT GND

2

4

VCC VCONT

19.2MHz

1

100ohm R124

TRK_LO_ADJ

TP2

TP4

TCXO_PM

RTR6275_TCXO

TP3

C185 100p

C187 1000p

R128 100K

C188 0.01u

VCC

5

2

U104

TC7SH04FU

3

GND

4

Schematic of the VC-TCXO Block

C186

1000p

TCXO_BT

TP3

TP2

TP1

Test Point of the VC-TCXO Block

- 77 -

TP4

4. TROUBLE SHOOTING

T

Check C312 of PMIC (U300)

Check R213 of MSM (U201)

- 78 -

4. TROUBLE SHOOTING

4.5 Checking Front-End Module Block

VREG_RF_SMPS

Rev.B

Rev.D

L108

15nH

C117

10p

TP1

13

15

17

20

21

23

10

12

7

8

U500

19

VDD

GND1

GND2

GND3

GND4

GND5

GND6

GND7

GND8

GND9

GND10

D5011

GSM900_RX1

GSM900_RX2

GSM1800_RX1

GSM1800_RX2

GSM1900_RX1

GSM1900_RX2

WCDMA2100

4

9

2

3

5

6

1

CTRL1

CTRL2

18

22

GSM900_TX

GSM18001900_TX

16

14

Rev.C

Schematic of the Front-End Module Block

C110

33p

C109

33p

1K

1K

R100

R101

ANT_SEL0

ANT_SEL1

TP1

ANT_SEL0

ANT_SEL1

Test Point of the Front-End Module Block

- 79 -

4. TROUBLE SHOOTING

Logic Table of the FEM

GSM 1800 / GSM1900 RX

GSM 900 RX

GSM 900 TX / WCDMA

GSM 1800 / GSM 1900 TX

TP1 VREG RF SMPS

- 80 -

4. TROUBLE SHOOTING

4.6 Checking UMTS Block

4.6.1 Checking Tx level

TP1

TP2

TP2

Rev.D

WCDMA

L404

1.8nH

4

3

PGND

ANT

FL104

RX

TX

ACMD-7602

1

2

0.5p

L125

TP3

TP4

ANT101 ANT102

1p

C437

C450

22p

L101

NA

C102

NA

G2

ANT

G1

SW100

RF

KMS-507

TP1

C101

56p

Rev.D

C162

3.3p

+VPWR

TP3

20dB

U102

CP0402A1950DNTR

R121

130

R120

47

7dB

R122

130

PWR_DET

C164

0.5p

L123

1nH

C155

4.7u

C158

15p

C165

1p

Rev_1.0

WS2512_TR1G

10

VCC2

9

GND4

8

7

6

11

RFOUT

GND3

GND2

BGND

U103

VCC1

1

RFIN

2

GND1

3

VCONT

4

VREF

5

L102

100nH

U500

C159

15p

+VPWR

L122

NA

C154

1.5p

Rev_1.0

C157

10nH

FL102

EFCH1950TDF1

4 5

O1 G3

G2 G1

IN

1

3 2

C192

100p

TR100

KRX102U

PA_R0

TP4

PA_ON

C170

0.1u

VREG_TCXO_2.85V

Rev.B

For testing, Max power of UMT 2100 is needed.

- 81 -

4. TROUBLE SHOOTING

- 82 -

4. TROUBLE SHOOTING

4.6.2 Checking UMTS PAM Control Block

• PAM control signal

1. PWR_DET : UMTS Tx Power Detected value (Check R120)

2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control

3. VREG_TCXO_2.85V : UMTS PAM enable (C170) (about 2.85V)

4. +VPWR : UMTS PAM Main Voltage ( 3V < +VPWR < 4.2V)

5. PA_ON : Turns the PA on and off

6. PA_R0 : Control signals that step the active PA mode and bias

VREG_TCXO_2.85

+VPWR

PWR_DET

- 83 -

4. TROUBLE SHOOTING

4.6.3 Checking RF Rx Level

TP1

TP4

TP2

Vbias TP3

ANT101 ANT102

TP1

1p

C437

C450

22p

L101

NA

C102

NA

G2

ANT

G1

SW100

RF

KMS-507

C101

56p

L102

100nH

R D

Rev.D

WCDMA

L404

1.8nH

4

3

PGND

ANT

FL104

RX

TX

ACMD-7602

1

2

0.5p

L125

TP2

C162

3.3p

+VPWR

C155

4.7u

C158

15p

20dB

U102

CP0402A1950DNTR

R121

130

R120

47

7dB

R122

130

PWR_DET

C164

0.5p

L123

1nH

C165

1p

Rev_1.0

WS2512_TR1G

10

VCC2

9

GND4

8

RFOUT

7

6

11

GND3

GND2

BGND

U103

VCC1

RFIN

GND1

1

2

3

VCONT

4

VREF

5

C159

15p

+VPWR

C192

100p

L122

NA

C154

1.5p

Rev_1.0

C157

10nH

5

FL102

EFCH1950TDF1

4

O1

G2

G3

IN

G1

3 2

1

TP4

TR100

KRX102U

PA_R0

PA_ON

C170

0.1u

VREG_TCXO_2.85V

Rev.B

TP3

L128

1.8nH

C174

10p

Rev.D

L407

2.7nH

U500

Vbias

VDD_RX

C156

100p

L121

1nH

Rev.D

C161

2.2p

L409

4.7nH

Rev.D

C444

2.2p

L408

10nH

1

5

G2

4

O2

IN

G1 O1

FL103

EFCH2140TDE1

2 3

L410

4.7nH

L411

4.7nH

C445

2.2p

- 84 -

- 85 -

4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

4.7 Checking GSM Block

2 3

1

- 86 -

4. TROUBLE SHOOTING

4.7.1 Checking RF Tx level

TP1

TP2

TP3

4.7.2 Schematic of RF Tx level

TP1

C102

NA

G2

ANT

G1

SW100

RF

KMS-507

Rev.D

L108

15nH

C117

10p

C101

56p

L102

100nH

13

15

17

20

21

23

7

8

10

12

19

VDD

U500

GND1

GND2

GND3

GND4

GND5

GND6

GND7

GND8

GND9

GND10

D5011

GSM900_RX1

GSM900_RX2

GSM1800_RX1

GSM1800_RX2

GSM1900_RX1

GSM1900_RX2

WCDMA2100

5

6

1

2

3

4

9

CTRL1

CTRL2

18

22

GSM900_TX

GSM18001900_TX

16

14

Rev.C

C110

33p

C109

33p

1K

1K

R100

R101

ANT_SEL0

ANT_SEL1

TP2

TP3

L115

18nH

C124

100p

L403

1.5nH

L116

10nH

Rev.D

C137

NA

C441

5.6p

C438

100p

C138

NA

C139

68p

C123

0.01u

C121

33u

C134

0.01u

15

DCS_PCS_OUT

11

EGSM_OUT U101

DCS_PCS_IN

3

EGSM_IN

4

19

RSVD_GND ENABLE

18

21

P_GND

SKY77318

BS

1

- 87 -

4. TROUBLE SHOOTING

4.7.3 Checking RF Tx level

- 88 -

4. TROUBLE SHOOTING

4.7.4 Checking PAM Block

TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.6V

TP2. GSM_PA_EN : Power Amp Enable

(Power ON : higher than 1.25V , Power OFF : lower than 0.4V)

TP3. GSM_PA_BAND : Power Amp Band Selection Control

(GSM Mode : -0.2V < VBS < 0.4V , DCS/PCS Mode : 1.25V < VBS < 3.0V)

TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.0V

TP1

TP4

TP2

TP3

+VPWR

TP4

EGSM

p

4 L403

1.5nH

L116

10nH

Rev.D

C438

100p

C138

NA

C123

0.01u

C121

33u

C134

0.01u

TP1

C136

0.01u

TP3

C139

68p

FL1

15

11

19

21

DCS_PCS_OUT

EGSM_OUT U101

DCS_PCS_IN

3

EGSM_IN

4

RSVD_GND ENABLE

18

SKY77318

P_GND BS

1

R113

C149

15p

100ohm

GSM_PA_EN

EFC

R117 100ohm

C153

15p

GSM_PA_BAND

TP2

Schematic of GSM PAM Block

- 89 -

4. TROUBLE SHOOTING

4.7.5 Checking RF Rx Block

TP1

TP2

TP3

TP1. DCS RX INPUT

TP2. PCS RX INPUT

TP3. GSM RX INPUT

L102

100nH

17

20

21

23

10

12

13

15

7

8

19

VDD

U500

GND1

GND2

GND3

GND4

GND5

GND6

GND7

GND8

GND9

GND10

D5011

GSM900_RX1

GSM900_RX2

GSM1800_RX1

GSM1800_RX2

GSM1900_RX1

GSM1900_RX2

WCDMA2100

3

4

1

2

5

6

9

CTRL1

CTRL2

18

22

GSM900_TX

GSM18001900_TX

16

14

Rev.C

TP1

DCS

C110

33p

C109

33p

1K

1K

R100

R101

ANT_SEL0

ANT_SEL1

TP2

PCS

L115

18nH

TP3

C123

0.01u

C121

33u

+VPWR

EGSM

C124

100p

L403

1.5nH

L116

10nH

Rev.D

Schematic of GSM900/DCS/PCS Rx Block

Rev.C

C439 5p

C105

NA

C440 5p

0.5p

C190

C442 5.6p

C116

NA

C443 5.6p

NA

C191

L405

C120

NA

2.7nH

L111

5.6nH

L406 2.7nH

- 90 -

- 91 -

4. TROUBLE SHOOTING

4. TROUBLE SHOOTING

4.8 Checking Bluetooth Block

Test Point of the Bluetooth Block

TP2

TP1

TP3

TP4

TP1. VREG_BT_2.85V

TP2. VREG_MSMP_2.7V

TP3. TCXO_BT

TP4. BT ANT Output

Test Point of the Bluetooth Block

BT_CLK

VREG_MSMP_2.7V

VREG_BT_2.85V

TP4

BLUETOOTH

TP2

R123

0

C171 1000p

C172

C173

1u

2.2u

L126

NA

M100

LBRQ-2B43A

9

CLK_REF

3

VCC_OUT

2

VDD_INT

10

VDD_MSM

14

VDD_BAT

SBST

SBCK

SBDT

4

11

12

SYNC_DET_TX_EN

5

RX_BB_TX_BB

13

XTAL_IN

7

R118

0

1000p C176

ACS2450HBAXX

FEED

NC1

NC2

ANT103

BT_SBST

BT_SBCK

BT_SBDT

BT_TX_RX_N

BT_DATA

TCXO_BT

TP1

Schematic of the Bluetooth Block

TP3

- 92 -

4. TROUBLE SHOOTING

Start

TP1,TP2

Signals exits?

YES

TP3

Is clock ok? 19.2M

NO

NO

Change the Main board

Change the X100

YES

TP4

Signals exits?

YES

Change the Main board

NO

Change the M100

- 93 -

4. TROUBLE SHOOTING

4.9 Power ON Troubleshooting

Power On sequence of U250/KU250 is :

PWR key press

→ PM_ON_SW_N go to low, PM6650 KPDPWR_N (pin24) → PM6650 Power Up →

VREG_MSMC_1.2V, VREG_MSME_1.8V, VREG_MSMP_2.7V, VREG_MSMA_2.6V,

VREG_TCXO_2.85V power up and system reset assert to MSM6245

→ Phone booting and

PS_HOLD assert to PMIC

Start

Battery voltage. higher than 3.20V?

YES

NO

Change or charging the

Battery

NO

Key press?

Check the Key Dome

YES

VREG_MSMC_1.2V,VREG_MSMP_2.7V,

VREG_MSME_1.8V, VREG_TCXO_2.85V,

VREG_MSMA_2.6V power up?

NO

Change the Main board

YES

Is clock ok?

R306 : 19.2M

X300 : 32.768Khz

YES

Change the Main board

NO

Check the TXCO

- 94 -

4. TROUBLE SHOOTING

VREG_MSMC

VREG_MSME

VREG_MSMP

X300 : 32.768Khz

VREG_MSMA

[U250/KU250 Main PCB BOTTOM]

R306 : 19.2Mhz

- 95 -

4. TROUBLE SHOOTING

4.10 Charger Troubleshooting

ICHARGEOUT

+VPWR

VBATT

BATT_FET_N

CHARGER

R313

0.1

6 5 4

Q300

QST4

1

C1

2

C2 3 B

USB_VBUS

USB_CTL_N

+5V_PWR

6 5 4

Q302

QST4

1

C1

2

C2 3 B

CHG_CTL_N

ICHARGE

Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT

Charging Procedure

- Connect TA or USB Cable

- Control the charging current by PM6650 IC

- Charging current flows into the battery

Troubleshooting Setup

- Connect TA and battery to the phone

Check Point

- Connection of TA or USB Cable

- Charging current path

- Battery

Troubleshooting Procedure

- Check the charger (TA or USB Cable) connector

- Check the charging current Path

- Check the battery

- 96 -

4. TROUBLE SHOOTING

Start

Check the pin and battery

Connect terminals of I/O connector

Connection OK?

NO

Change I/O connector

Yes

Is the TA (or USB Cable) voltage 5.1V (or 5.0V)?

Yes

NO

Is it charging properly

After turning on Q301(or Q302)

, Q302?

Yes

NO

Change TA

(or USB Cable)

END

Change the board

[ Charger Troubleshooting Flow ]

- 97 -

4. TROUBLE SHOOTING

Q302

Q301

Q300

R313

[ Charging part ( Main PCB Front ) ]

- 98 -

4. TROUBLE SHOOTING

4. BB Trouble Shooting

4.11 USB Troubleshooting

USB Initial sequence of U250/KU250 is :

USB connected to U250/KU250 power on

→ USB_VBUS(Q300) go to 5V → USB_D+ go to 3.3V →

USB_DAT is triggered

→ USB work.

Start

Power is on?

YES

Cable is inserted?

YES

Q400 pin 4 is 5V?

YES

USB_D+ is 3.3V?

YES

Change the Main board

NO

NO

NO

NO

Go to power on trouble shooting

Insert cable

Check Q300 (pin 4)

Check VA401

- 99 -

4. TROUBLE SHOOTING

4.12 SIM Detect Troubleshooting

USIM Initial sequence of U250/KU250 is :

USIM_CLK,USIM_RST,USIM_DATA triggered

→ VREG_UIM_2.85V go to 2.8V → USIM IF work

Start

Re-insert the SIM card

Work well?

No

VREG_UIM_2.85V is 2.85V?

USIM_P_CLK is run?

YES

Change SIM card

Yes

NO

Work well?

No

Change the Main board

Yes

End

Check J300

End

- 100 -

4. TROUBLE SHOOTING

7 6 5

3 2 1

1

2

3

7

VREG_USIM_2.85V

USIM_P_RST_N

USIM_P_CLK

USIM_P_DATA

USIM_P_DATA

USIM

L302

56nH

R317

15K

9

10

6

7

8

5

J300 HSSC-8P-18

GND1

VPP

IO

VCC

RST

CLK

1

2

3

4

RSV2 RSV1

11

GND2 GND5

12

GND3 GND4

Figure. USIM part schematics

VREG_USIM_2.85V

USIM_P_RST_N

USIM_P_CLK

- 101 -

4. TROUBLE SHOOTING

4.13 Camera Troubleshooting

Camera control signals are generated by MSM6245.

4.13.1 MEGA CAMERA

Start

Check the camera connector and reconnect the camera

Yes

Camera is OK?

NO

NO

Yes

Check the CAM_MCLK

NO

Yes

Change the camera

Yes

Camera is OK

NO

Change the Main board

END

Change the Main board

Change the Main board

END

- 102 -

4. TROUBLE SHOOTING

4.13.2 VGA CAMERA

Start

Check the camera connector and reconnect the camera

Yes

Camera is OK?

NO

NO

Yes

Check the CAM_MCLK

Yes

Change the camera

NO

Yes

Camera is OK

NO

Change the Main board

END

Change the Main board

Change the Main board

END

- 103 -

4. TROUBLE SHOOTING

C447

C350

C347

U501

U303

+VPWR

CAM_LDO_EN

C348

C349

C347

1u

CAMERA LDO

U303

3

4

1

2

VIN

EN1

EN2

NC1

RT9011-MGPQW

VOUT1

8

VOUT2

7

NC2

6

GND

5

C348

1u

C349

1u

VREG_CAM_AVDD_2.8V

VREG_CAM_DVDD_1.8V

+VPWR

CAM_LDO_EN

C447

1u

3

2

1

VIN VOUT

GND BGND

4

STBY NC

U501

BH15LB1WHFV

6

5

REV_D

C350

1u

VREG_CAM_DVDD_1.5V

- 104 -

4. TROUBLE SHOOTING

4.14 Keypad Backlight Troubleshooting

Key Pad Back Light is on as below :

Key pressing

→ KYBD_BACKLIGHT go to 0V → MAIN Key Backlight LED On

Start

Key press

NO

+VPWR is above 3.2V?

Yes

KYBD_BACKLIGHT is 0V ?

Yes

Backlight LED ON?

No

Change the Main board

NO

YES

Check battery

Yes

Change the Main board

END

+VPWR

KEY_BACK_LIGHT LED(8EA)

+VPWR

LD400 LEBB-S14H

LD403 LEBB-S14H

LD406 LEBB-S14H

R411

100ohm

R414

100ohm

R417

100ohm

REV_B : EDLH0013501 --> EDLH0006001

KYBD_BACKLIGHT

LD404 LEBB-S14H

LD407 LEBB-S14H

R415

100ohm

R418

100ohm

LD402

LD405

LD408

LEBB-S14H

LEBB-S14H

R413 100ohm

LEBB-S14H

R416 100ohm

R419 100ohm

Figure.Keypad backlight LED part

- 105 -

4. TROUBLE SHOOTING

4.15 Main LCD Troubleshooting

Main LCD control signals are generated by MSM6245. The signal path is :

MSM6245

→ CN400 → LCD Module

Start

Press END key

Key LED is on?

NO

Yes

Disconnect and reconnect

The LCD connector

GO to power on trouble shooting

LCD display OK?

Yes

No

Change the LCD module

END

LCD display OK?

Yes

No

Change the Main board

END

- 106 -

4. TROUBLE SHOOTING

4.16 Receiver Path

MSM6245 EAR1ON/EAR1OP

→ R421,R422 → Analog Switch(U401) → Receiver

Start

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out

YES

Can you hear the tone?

NO

The sine wave appears at

L401, L402?

NO

The sine wave appears at

R421, R422?

NO

Change the Main board

YES

END

Change receiver

YES

Check the analog switch

- 107 -

4. TROUBLE SHOOTING

U401

R421

R422

- 108 -

4. TROUBLE SHOOTING

4.17 Headset path

MSM6245 HPH_R, HPH_L

→ C402/C401 → R407/R406 → CN401 (MMI Connector)

Start

Connect the phone to network equipment and setup call.

Setup 1KHz tone out and insert headset.

YES

Can you hear the tone?

NO

Sine wave appears at

R407/R406?

NO

Change the Main board

YES

END

Change the Headset

- 109 -

4. TROUBLE SHOOTING

CN401 R406

C401

C402

C407

- 110 -

4. TROUBLE SHOOTING

4.18 Speaker phone path

MSM6245 LINE_P,LINE_N

→ R429/R427, C423/C422, R431/R426 → Audio AMP(U402) → Analog

Switch(U401)

→ Speaker

Start

Connect the phone to network equipment and setup call

Setup 1KHz tone out

YES

Can you hear the tone?

NO

Sine wave appears at

R429/R427 and C423/C422

And R431/R426 ?

YES

SPK_AMP_EN is 2.6V?

YES

The sine wave appears at

SPK+, SPK- ?

YES

The sine wave appears at

SPK_RCV-,SPK_RCV+?

NO

Change the Main board

NO

NO

NO

YES

END

Change the Main board

Change the Main board

Change the Audio Amp

Change speaker

- 111 -

4. TROUBLE SHOOTING

Analog Switch

SPK+

Audio Amp

- 112 -

4. TROUBLE SHOOTING

4.19 Main microphone

MIC400

→ MIC1P, MIC1N (MSM6245)

Start

Make a call

MIC_BIAS(C416) is 1.8V

YES

Make sound to MIC

NO

Sine wave appears at

C418/C419?

YES

Change the Main board

NO

NO

Change main board

Change the MIC

Work well?

YES

END

- 113 -

4. TROUBLE SHOOTING

R424

C417

MIC400

- 114 -

4. TROUBLE SHOOTING

4.20 Headset microphone

Headset

→ C210/C211 → MIC2P, MIC2N (MSM6245)

Start

Make a call

OK

Change the headset and retry

NO

HOOK_KEY is detected?

NO

Yes

MICBIAS is biased by 1.8V?

Yes

Sine wave appears at

C210/C211 ?

Yes

Change the Main board

NO

NO

END

YES

Change the MAIN board

Change the MAIN board

Change the headset or

Main board and retry.

- 115 -

4. TROUBLE SHOOTING

Ear_Sense_N

MIC Input

- 116 -

4. TROUBLE SHOOTING

4.21 Vibrator

The Vibrator is connected between +VPWR and VIB_DRV_N (PM6650 25 pin).

The Vibrator motor driver is an SBI-programmable voltage out that is reference to +VPWR.

Start

Operate the Vibrator

Work well?

NO

Change vibrator or PM6650

Yes

End

TP400

TP401

L400

56nH

D400

RB521S-30

+VPWR

MOTOR_PWR-

- 117 -

4. TROUBLE SHOOTING

MOTOR_PWR-

+VPWR

- 118 -

5. DOWNLOAD

5. DOWNLOAD

5.1 U250/KU250 DOWNLOAD

5.1.1 Introduction

LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed.

Additionally, LGMDP allows multi downloading up to 9 handsets at the same time.

5.1.2 Downloading Procedure

• Connect the phone to your desktop PC using the USB cable and run the LGMDP application.

Before getting started, set up LGMDP preferences from the Preferences of the file menu the way you want. Click on the File menu and select Preferences.

➢ Play a success sound

It will be played a .wav file when the download has been completed. To enable this simply check the box.

➢ Always on Top

Check if LGMDP always appears at the top of the window so that user can monitor it all the time.

➢ Automatically run Select Port When LGMDP starts

When LGMDP starts, it will automatically select Select Port button to download new image file.

- 119 -

5. DOWNLOAD

5.1.2.1 Connecting to PC

• Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. Then click on the Connect button. (The port number(COM7) shall be different from that of the port number in the snapshot.)

• The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed.

U250/KU250

- 120 -

5. DOWNLOAD

1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse… button. The edit box shows the file path where images are located.

Please note that all images should be located in a selected folder.

2) Click on the Browse… button to select image files to be downloaded on the handset.

3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option.

Backup the NV data and restore the backed up NV data automatically.

1)

U250/KU250

2)

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

3)

5)

4) 6)

7)

4) Reset database & Contents:

User related data including the setting data on the EFS is reset in the handset. The user contents in the handset will be erased. If you want to reset all the user data back to the way they were before you started downloading new images, check the option.

Erase_EFS:

The calibration data, user contents, media, and module are erased. Only calibration data is kept when NV backup/restore is checked. The user contents and file system physically are wiped out.

Keep All Contents

Maintain user data including WAP, AD, DRM, E-mail, Play lists, and images when downloading a new S/W images. User data stated above are maintained if this option is selected.

5) Additional Options:

Display Information is defaultly not selected and user cannot choose. Override partition table is also also defaultly not selected and user cannot choose.

6) Clear: Clearing all directory paths of images in the dialog.

7) Start: Starting downloading the selected individual image.

- 121 -

5. DOWNLOAD

5.1.2.2 Choosing image files

• Select the image folder, where all the image files are located, by clicking on the Browse…. (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.)

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

- 122 -

5. DOWNLOAD

• Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automatically load images accordingly. Also you can select images by manually. For instance, select the path of

AMSS Modem Image file by clicking on the Browse… button. The selected AMSS image will be downloaded to the handset from the path directory in the PC. Make sure that you have chosen correct file. In case of wrong AMSS Modem file is file is selected, the phone may not work.

(The file name shall be different from that of the file name in the snapshot.)

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

- 123 -

5. DOWNLOAD

• If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the desired NV file to be downloaded on the handset. To enable this simply check the box or select the

NV file from the LGMDP installation directory by clicking on the Browse… button.

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

• Click on the START button to start downloading. A summary of the selected images and option information window will be displayed. Click on the No button if this is not the setting you are downloading for. Otherwise click on the Yes button to continue downloading selected image file with options.

Yes No

- 124 -

5.1.2.3 Downloading

NV_U250/KU250

U250/KU250

U250/KU250

5. DOWNLOAD

• This message box informs that a new file for

NV backup will be created in the displayed file name in the LGMDP installation directory.

• Backing up NV data and backed up NV data will be stored in the LGMDP installation directory.

• Erasing the existing directories and files before the Module image is downloaded.

• Downloading the AMSS modem image

U250/KU250

- 125 -

5. DOWNLOAD

• Rebooting the handset and re-establishing the connection

U250/KU250

• Restoring NV data which backed up in the

Backing up process. User can also restore

NV data using NV Default image selection.

• Rebooting the handset and re-establishing the connection

U250/KU250

• Erasing the existing directories and files before downloading the selected Media image

- 126 -

5. DOWNLOAD

• Downloading Media image in progress

U250/KU250

U250/KU250

• Downloading Module image in progress

U250/KU250

• Downloading process has completed successfully

- 127 -

5. DOWNLOAD

5.1.2.4 Tools

• Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device

Manager from the Tools of the file menu.

- 128 -

5. DOWNLOAD

5.1.3 Troubleshooting Download Errors

1) When the phone does not work after downloading has been completed.

2) Media Erasing Error

3) NV Restore Error

5.1.3.1 When the phone does not work

• Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and then try to download all the images up to AMSS. In the emergency mode, you can not download media or module image.

The phone supports a special mode called emergency mode. In this mode, minimum units for downloading is running so that users can download the images again in case of emergency situation. (AMSS modem, Media, and Module images can not be running in this mode.)

- 129 -

5. DOWNLOAD

• The below dialog shows parameters of Select Port when phone is booted in Emergency mode.

Click on the Connect button to continue.

U250/KU250

• Choose Image file after clicking on the Browse… button. Make sure that you have chosen the right image file. After choosing valid images, then click on the Start button to start downloading selected images. The selected image will be downloaded to the handset from the path directory in the PC.

After downloading images successfully, it will boot to normal mode.

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

- 130 -

5. DOWNLOAD

5.1.3.2 NV Restore Error

• Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt.

U250/KU250

• Connect the handset and Press the Connect button in the Select Port window. (Enable state in the window indicates that the Phone has been detected and is ready to download.)

U250/KU250

U250/KU250

- 131 -

5. DOWNLOAD

• Click on Browse… . Select the LGMDP installation directory and a list of NV Backup files(*.nv2) will be shown. These nv files were saved every time NV Backup option was selected, and the name of the nv file is determined based on the time when NV Backup was done. Choose the desired NV file to be downloaded on the handset, and click on Start.

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

U250/KU250

- 132 -

5. DOWNLOAD

5.1.4 Caution

1) Multi-downloading using the USB hub is not recommendable.

2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore and image (media and module) download.

3) The NV data saved at LGMDP folder as following format.

D:\LGMDP\004400-01-429926\_COM14_

LGMDP folder name

IMEI number

Port number

4) Recommended that the Module and Media Image have to be downloaded at the same time.

5) Erase EFS option will erase everything (media, module, nv items, and user data) in the

EFS area.

- 133 -

6. BLOCK DIAGRAM

6. BLOCK DIAGRAM

6.1 GSM & UMTS RF Block

[Fig 2.1] U250/KU250 RF Functional Block Diagram

- 134 -

6. BLOCK DIAGRAM

[Table 2.1] RF Block Component

- 135 -

6. BLOCK DIAGRAM

6.2 Interface Diagram

6.2.1 RTR6275 & MSM6245 Interface Diagram

[Fig 2.2] RTR6275 & MSM6245 Interface Diagram

- 136 -

6.2.2 Memory Interface

ADDRESS[14:0]

[Fig 2.3] Memory Interface Diagram

6. BLOCK DIAGRAM

- 137 -

6. BLOCK DIAGRAM

6.2.3 USB,UART,SIM,JTAG Interface

[Fig 2.4] USB, UART, SIM, JTAG Interface

- 138 -

6. BLOCK DIAGRAM

Main RF signal

Control signal

Control signal

UMTS PA_CTL signal

PA_R0

GSM PA_CTL signal

GSM_PA_BAND

GSM_PA_EN

GSM_PA_RAMP

ANT_SEL 0,1

Description

UMTS Tx High/Low Power Control

Comment

DCS or PCS /GSM Mode Selection

Power Amp Gain Control Enable

Power Amp Gain Control

Ant Switch Module Mode Selection

UMTS,

GSM900Tx/Rx,

DCS Tx/Rx,

PCS Tx/Rx

- 139 -

6. BLOCK DIAGRAM

6.2.4 Placement

*Top Side

- 140 -

*Bottom Side

6. BLOCK DIAGRAM

- 141 -

- 142 -

7. CIRCUIT DIAGRAM

F

A

1 2

ANT101 ANT102

1p

C437

C450

22p

L101

NA

C102

NA

G2

ANT

G1

SW100

RF

KMS-507

B

VREG_RF_SMPS

Rev.B

Rev.D

L108

15nH

C117

10p

C

D

E

F

C

D

E

GSM/EDGE

Rev.D

WCDMA

L404

1.8nH

0.5p

L125

4

3

PGND

ANT

FL104

RX

TX

ACMD-7602

1

2

3 4 5

C101

56p

GSM 1800/GSM 1900 RX

GSM 850/ GSM 900 RX

GSM 850/GSM 900 TX/ WCDMA

GSM 1800/GSM 1900 TX

ANT_SEL0 ANT_SEL1

LOW

HIGH

LOW

HIGH

LOW

LOW

HIGH

HIGH

L102

100nH

13

15

17

20

21

23

10

12

7

8

19

VDD

U500

GND1

GND2

GND3

GND4

GND5

GND6

GND7

GND8

GND9

GND10

D5011

GSM900_RX1

GSM900_RX2

GSM1800_RX1

GSM1800_RX2

GSM1900_RX1

GSM1900_RX2

WCDMA2100

5

6

1

2

3

4

9

CTRL1

CTRL2

18

22

GSM900_TX

GSM18001900_TX

16

14

Rev.C

1K

1K

R100

R101

ANT_SEL0

ANT_SEL1

DCS

PCS

C439 5p

C105

NA

C440 5p

0.5p

C190

Rev.C

C442 5.6p

C116

NA

C443 5.6p

NA

C191

C110

33p

C109

33p

L115

18nH

C124

100p

L403

1.5nH

L116

10nH

Rev.D

C123

0.01u

C121

33u

+VPWR

EGSM

L405

C120

NA

2.7nH

L111

5.6nH

L406 2.7nH

C137

NA

C441

5.6p

C438

100p

C138

NA

C139

68p

C134

0.01u

C136

0.01u

8.86dB

R108

Rev.1.0

51

15

DCS_PCS_OUT

11

EGSM_OUT U101

DCS_PCS_IN

3

EGSM_IN

4

19

RSVD_GND ENABLE

18

21

P_GND

SKY77318

BS

1

FL101

R113

C149

15p

100ohm

O1

4

G2

5

G3

G1

IN

1

3 2

GSM_PA_EN

EFCH897MTDB1

R117 100ohm

C153

15p

GSM_PA_BAND

GSM_PA_BAND

LOW

HIGH

MODE

GSM

DCS/PCS

7.5dB

R112

39

GSM_TX

DCS_PCS_TX

C159

15p

+VPWR

L122

NA

C154

1.5p

Rev_1.0

C157

10nH

O1

4

G2

5

G3

G1

IN

FL102

EFCH1950TDF1

1

3 2

C162

3.3p

+VPWR

C155

4.7u

C158

15p

20dB

U102

CP0402A1950DNTR

R121

130

R120

47

7dB

R122

130

PWR_DET

C164

0.5p

L123

1nH

C165

1p

Rev_1.0

WS2512_TR1G

10

VCC2

9

GND4

8

RFOUT

7

6

11

GND3

GND2

BGND

U103

VCC1

RFIN

1

2

GND1

3

4

VCONT

VREF

5

VREG_TCXO_2.85V

C192

100p

TR100

KRX102U

PA_R0

C170

0.1u

PA_ON

VREG_TCXO_2.85V

Rev.B

TCXO

X100

DSA321SCE-19.2M

7

8

3

4

NC3

NC4

NC2

NC1

6

5

OUTPUT

VCC

GND

2

VCONT

1

19.2MHz

100ohm R124

TRK_LO_ADJ

L128

1.8nH

C174

10p

Rev.D

L407

2.7nH

DCS_PCS_TX

GSM_TX

TX_ON

TX_AGC_ADJ

DAC_REF

C118

12p

SSBDT_RTR

TX_IP

C103

180p

C104

180p

C106

Rev.C

8.2p

C107

C112

6p

12p

R103 12K

(1%)

R104 680 (1%)

C119 22p

55

ENV_OUT

46

44

HB_RF_OUT1

HB_RF_OUT2

43

42

LB_RF_OUT1

LB_RF_OUT2

24

RF_ON

56

VCONTROL

54

DAC_REF

14

SBDT

3

27

R_BIAS1

R_BIAS2

31

30

GCELL_INP

GCELL_INN

32

33

EGSM_INP

EGSM_INN

38

39

DCS_INP

DCS_INN

36

37

GPCS_INP

GPCS_INN

22

23

CAL_INP

CAL_INN

26

WLNA_IN

U100

RTR6275

ENV_LNP

ENV_LNN

2

1

TX_IP

TX_IN

TX_QP

TX_QN

51

50

53

52

TCXO

7

VTUNE1

VTUNE2

5

18

RX_IP

RX_IN

12

13

RX_QP

RX_QN

10

11

PWD_DET_IN

TEST

40

21

VDDA1

VDDA2

VDDA3

VDDA4

VDDA5

VDDA6

VDDA7

VDDA8

VDDA9

VDDA10

VDDA11

VDDA12

VDDA13

VDDA14

4

6

41

45

47

19

20

28

8

9

15

16

48

49

C115

C114

1000p

3300p

VTUNE-Connected directly to GND

R105 5.1

C108

180p

C113

180p

R433

R434

R106

2.7

2.7

5.1

L114 47nH

C189

22p

TX_IM

TX_QP

TX_QM

RTR6275_TCXO

RX_IP

RX_IM

RX_QP

RX_QM

PWR_DET

Rev.D

C122

22u

Rev.B

VREG_RF_SMPS

Rev.C

L119

47nH

VDD_RX

VREG_SYNTH_2.6V

R109 10

L120

47nH

VREG_RF_SMPS

B

C

D

A

Rev.D

C150

1000p

C151

22p

C152

0.01u

R116

100ohm

Rev.D

VREG_MSMP_2.7V

E

VDD_RX

14 15 16

C156

100p

L121

1nH

Rev.D

C161

2.2p

L408

10nH

L409

4.7nH

Rev.D

C444

2.2p

1

5

G2

4

O2

IN

G1 O1

FL103

EFCH2140TDE1

2 3

L410

4.7nH

L411

4.7nH

C445

2.2p

BT_CLK

VREG_MSMP_2.7V

VREG_BT_2.85V

BLUETOOTH

R123

0

L126

NA

M100

LBRQ-2B43A

C171 1000p

C172

C173

1u

2.2u

9

CLK_REF

3

VCC_OUT

2

VDD_INT

10

VDD_MSM

14

VDD_BAT

SBST

SBCK

SBDT

4

11

12

SYNC_DET_TX_EN

5

13

RX_BB_TX_BB

XTAL_IN

7

R118

0

1000p C176

ACS2450HBAXX

FEED

NC1

NC2

ANT103

BT_SBST

BT_SBCK

BT_SBDT

BT_TX_RX_N

BT_DATA

TCXO_BT

F

C

D

LG(42)-A-5505-10:01

1 2 4 5 6

TCXO_PM

RTR6275_TCXO

C185 100p

C187 1000p

7 8

R128 100K

C188 0.01u

VCC

5

2

U104

TC7SH04FU

3

GND

4

C186

1000p

TCXO_BT

9

RF

Sheet/

Sheets

1/4

E

Section

Designer

Checked

Approved

Date

MAR. 07. 2007

Sign & Name

KANG. H. S MODEL

DRAWING

LG Electronics Inc.

DRAWING

NO.

LGMC

REV_1.2

LG Electronics Inc.

- 143 -

7. CIRCUIT DIAGRAM

E

A

B

1 2

SDRAM_ADDR(0:14)

3

C

SDRAM_DATA(0:31)

REV_B

Change 32 bit

D

E

F

C

D

SDRAM

EBI2_DATA(0:15)

NAND & LCD

(ADS signal for LCD)

LCD_CS_N

NAND_CLE

NAND_CS_N

EBI2_OE_N

EBI2_WE_N

NAND_ALE

NAND_READY

EBI2_DATA(15)

EBI2_DATA(14)

EBI2_DATA(13)

EBI2_DATA(12)

EBI2_DATA(11)

EBI2_DATA(10)

EBI2_DATA(9)

EBI2_DATA(8)

EBI2_DATA(7)

EBI2_DATA(6)

EBI2_DATA(5)

EBI2_DATA(4)

EBI2_DATA(3)

EBI2_DATA(2)

EBI2_DATA(1)

EBI2_DATA(0)

SDRAM_DATA(31)

SDRAM_DATA(30)

SDRAM_DATA(29)

SDRAM_DATA(28)

SDRAM_DATA(27)

SDRAM_DATA(26)

SDRAM_DATA(25)

SDRAM_DATA(24)

SDRAM_DATA(23)

SDRAM_DATA(22)

SDRAM_DATA(21)

SDRAM_DATA(20)

SDRAM_DATA(19)

SDRAM_DATA(18)

SDRAM_DATA(17)

SDRAM_DATA(16)

SDRAM_DATA(15)

SDRAM_DATA(14)

SDRAM_DATA(13)

SDRAM_DATA(12)

SDRAM_DATA(11)

SDRAM_DATA(10)

SDRAM_DATA(9)

SDRAM_DATA(8)

SDRAM_DATA(7)

SDRAM_DATA(6)

SDRAM_DATA(5)

SDRAM_DATA(4)

SDRAM_DATA(3)

SDRAM_DATA(2)

SDRAM_DATA(1)

SDRAM_DATA(0)

LCD_ADS

AA10

AC9

W10

AA9

AE7

AC8

W9

AA8

AC7

AF5

AA7

AE5

AC6

AE4

AF3

AC5

D2_15

D2_14

D2_13

D2_12

D2_11

D2_10

D2_9

D2_8

D2_7

D2_6

D2_5

D2_4

D2_3

D2_2

D2_1

D2_0

AF13

AA14

T13

AC14

AE14

A2_20_GPIO34

A2_19

A2_18

W13

AC13

AA13

AF12

AE12

AC12

AA12

W12

T12

AC11

AA11

AC10

W11

AF9

AE9

A2_7

A2_6

A2_5

A2_4

A2_3

A2_2

A2_1

A2_17

A2_16

A2_15

A2_14

A2_13

A2_12

A2_11

A2_10

A2_9

A2_8

T8

T6

T4

R8

T2

T1

R6

A1_22

A1_21

A1_20

A1_19

A1_18

A1_17

A1_16

R4

W4

V6

Y2

Y1

E1

R11

V4

U6

L6

J4

P4

H4

G2

A1_15

GPIO_74

GPIO_73

GPIO_72

GPIO_71

GPIO_70

GPIO_69

GPIO_68

GPIO_67

SDRAM1_D15

L8

K4

J1

K6

J2

SDRAM1_D14

SDRAM1_D13

SDRAM1_D12

SDRAM1_D11

SDRAM1_D10

SDRAM1_D9

SDRAM1_D8

SDRAM1_D7

SDRAM1_D6

SDRAM1_D5

J6

AB4

D1

AB2

D2

E2

SDRAM1_D4

SDRAM1_D3

SDRAM1_D2

SDRAM1_D1

SDRAM1_D0

AC15

AF14

XMEM2_CS_N1

LCD_CS_N_GPIO38

AF10

W14

AF7

AF4

AE10

T14

UB2_N

XMEM2_CS_N0

OE2_N

WE2_N

LB2_N_A2_0

NAND2_FLASH_READY_GPIO33

4 5

SDRAM

REV_B

CLOCK

RESET

VREG_MSME_1.8V

HKADC

1%

1% R435

300K

U201-1

6

MSM6245_A

7

C200 47p

C201 47p

C204

10p

8

AUDIO

Near to MSM

9 10 11 12 13

MODE

MODE2 MODE1 MODE0

0 0 0

( Default Pull-Down)

Native, ARM JTAG

BOOT_MODE3 BOOT_MODE2 BOOT_MODE1

0 0 1

0 1 1

1 0 1

1 1 1

8-bit, NAND, Normal

16-bit, NAND, Normal

8-bit, NAND, Trusted

16-bit, NAND, Trusted

1005 0.1uF 16V +80/-20%

2012 10uF 6.3V +80/-20% Ceramic

VREG_MSMC_1.25V

VREG_MSME_1.8V

VREG_MSMP_2.7V

14

ADC

HKADC[0] - AMUX_OUT

HKADC[1] - VBATT_SENSE

HKADC[2] - HDET1

HKADC[3] - TTY_ADC_DET

HKADC[4] - PCB_Rev_ADC

HKADC[5] - VBATT_TEMP

PMIC_AUXIN[1]

PMIC_AUXIN[2] - PA_THERM

C205

4.7u

15

HKADC(4):PCB_Rev_ADC

150K : 10K : 0.016V

150K : 47K : 0.62V

150K : 68K : 0.81V

150K : 100K : 1.04V

150K : 150K : 1.30V

150K : 300K : 1.73V

150K : 470K : 1.97V

150K : 680K : 2.13V

150K : 750K : 2.17V

16

VREG_MSMA_2.6V

(CAD : 10uF=>Input MSMA_2.6V)

C206

10u

C209

0.1uF

A

B

SDCC_DAT1_GPIO99

SDCC_DAT2_GPIO100

SDCC_DAT3_GPIO101

MDP_VSYNC_SECONDA_GPIO104

MDP_VSYNC_PRIMARY_GPIO105

F25

M25

M26

AE3

AD2

WDOG_STB_SBCK1_GPIO0

SBDT1_GPIO1

PA_ON1_GPIO2

GRFC9_GPIO12

CAMCLK_PO_GP_MN_GPIO13

GPIO28

USB_RX_DATA_GPIO29

XMEM2_CS_N2_GPIO35

XMEM2_CS_N3_GPIO36

LCD_EN_GPIO37

GPIO43

SYNTH2_GPIO65

GPIO66

XMEM1_CS_N1_GPIO76

XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77

UART3_RFR_N_GPIO87

UART2_DP_RX_DATA_GPIO89

SYNTH0_GP_PDM0_GPIO92

SBST1_GPIO93

H6

F18

H18

H25

F26

H11

D5

J21

A6

N19

W15

AA15

AE13

H9

B6

F8

AA1

Y6

L25

TX_AGC_ADJ

TRK_LO_ADJ

TCXO_EN_GPIO94

PA_ON0

H13

L13

F19

F17

Q_OUT_N

Q_OUT

I_OUT_N

I_OUT

DAC_REF

A12

B12

A13

B13

F12

Q_IM_CH1

Q_IP_CH1

I_IM_CH1

I_IP_CH1

Q_IM_CH0

Q_IP_CH0

I_IM_CH0

I_IP_CH0

W23

V23

V25

W25

AA25

Y25

AB25

AC25

GP_PDM2_PA_RAN_GE1

GP_PDM1_PA_RAN_GE0

D17

H17

TRST_N

TCK

TMS

TDI

TDO

RTCK

H15

D16

F15

D15

A17

H16

AUX_PCM_CLK_GRFC14_GPIO80

AUX_PCM_DIN_GRFC13_GPIO14

AUX_PCM_DOUT_GRFC12_GPIO103

AUX_PCM_SYNC_GRFC11_GPIO102

TX_ON_GRFC10

K19

N21

G4

J8

H12

GRFC8_GPIO11

GRFC7_GPIO10

GRFX6_GPIO9

GRFC5_AUX_SBST_GPIO8

GRFC4_AUX_SBCK_GPIO7

GRFC3_GPIO6

GRFC2_GPIO5

GRFC1_AUX_SBDT_GPIO4

GRFC0_GPIO3

B8

B4

T23

T19

D11

H10

F10

D9

A8

BT_CLK_GPIO25

BT_SBST_GPIO24

BT_SBCK_GPIO23

BT_SBDT_GPIO22

BT_TX_RX_N_GPIO21

BT_DATA_GPIO20

MDDIC_DATP

MDDIC_DATN

MDDIC_STBP

MDDIC_STBN

A22

A23

B22

B23

G23

F23

E26

E25

H21

R19

C212

0.1u

10%

Place near

MSM pin W18

(CODEC VSS)

C213

0.01u

C214

0.01u

C215

0.01u

C216

0.1uF

LCD_MAKER_ID

LCD_VSYNC

TP200

WDOG monitoring

CAM_MCLK

LCD_IF_MODE_0

VGA_CAM_RESET_N

LCD_LDO_EN

LCD_RESET_N

HOOK_KEY

GPIOs

C222

1000p

C223

1000p

C225

0.01u

C226

0.01u

C227

0.01u

C232

1000p

C233

1000p

C234

1000p

C235

1000p

C236

0.01u

C237

1000p

C238

1000p

SPK_AMP_EN

TX_ON

ANT_SEL1

ANT_SEL0

GSM_PA_BAND

GSM_PA_EN

BT_CLK

BT_SBST

BT_SBCK

BT_SBDT

BT_TX_RX_N

BT_DATA

RCV_EN_N

LCD_IF_MODE_1

2K R213

Close to MSM

TX_AGC_ADJ

TRK_LO_ADJ

TCXO_EN

PA_ON

TX_QM

TX_QP

TX_IM

TX_IP

DAC_REF

RF

RX_QM

RX_QP

RX_IM

RX_IP

PA_R0

F1

K1

M1

R1

U1

VSS_PAD1_0

VSS_PAD1_1

VSS_PAD1_2

VSS_PAD1_3

VSS_PAD1_4

AF6

AF11

VSS_PAD2_0

AF15

VSS_PAD2_1

VSS_PAD2_2

R26

B17

A15

A9

VSS_PAD3_0

VSS_PAD3_1

VSS_PAD3_2

VSS_PAD3_3

A18

A21

VSSA1

D13

D19

P26

U19

V26

W16

W18

W26

AB26

AC16

AC26

AD25

AF23

AF24

VSSA2

VSSA3

VSSA4

VSSA5

VSSA6

VSSA7

VSSA8

VSSA9

VSSA10

VSSA11

VSSA12

VSSA13

VSSA14

VSSA15

VSSA16

C228

0.01u

C229

0.1uF

C230

0.1uF

C239

1000p

C240

0.1uF

C242

0.1uF

U201-2

MSM6245_B w18 (Analog VSS guard ring for CODEC) for VSS_THERMAL

C217

0.01u

C218

0.01u

C219

0.1uF

C220

0.1uF

C221

0.1uF

C

2200p cap => place between

D12(VDDA1) and F12(DAC_REF)

C231

2200p

DAC_REF

Near to B18 (VDD_PLL)

VREG_MSMA_2.6V

C243

0.1u

10%

C244

0.01u

R211

0

RESERVED

C26

(PLLOUT_TEST)

VSS_DIG_0

VSS_DIG_1

VSS_DIG_2

VSS_DIG_3

VSS_DIG_4

VSS_DIG_5

VSS_DIG_6

VSS_DIG_7

VSS_DIG_8

VSS_DIG_9

VSS_DIG_10

VSS_DIG_11

VSS_DIG_12

VSS_DIG

T26

G26

D26

A24

A14

A11

A5

AC23

C1

H1

W1

AC1

AF8

AF16

NC

AA21

VSS39

VSS41

VSS43

VSS44

VSS45

VSS46

VSS47

VSS48

VSS49

VSS50

AA6

AC4

AE1

AE2

AE25

AE26

AF1

AF2

AF25

AF26

MSM6280 Reference Rev.B : AA21 -> NC

AC23: VSS_DIG

D

E

F

C

D

F

LG(42)-A-5505-10:01

1 2 3

KEYPAD

UART

USIM PMIC USB MicroSD

C247

0.1u

10%

Place near

MSM pin AD26

R214

R215

CAMERA

2.2K

2.2K

VREG_CAM_AVDD_2.8V

(Check CAM_DATA PINOUT !!!!)

4 5 6 7 8 9

USB_D+

USB_D-

USB_VBUS

VBATT

REMOTE_PWR_ON

UART_TXD

UART_RXD

TP402

TP403

TP404

TP405

TP406

12

11

10

9

6

5

8

7

4

3

2

1

CTS

RTS

DSR

NC4

UTXD

NC3

NC2

VBAT

URXD

PWR

VBAT

ON_SW ON_SW

NC1

TX

RX

GND

UFLS

TX

RX

GND

2.5G

3G

UART

Section

Designer

Checked

Approved

Date

MAR.07.2007

Sign & Name

Jaykay

LG Electronics Inc.

MODEL

DRAWING

NAME

DRAWING

NO.

LGMC

Sheet/

Sheets

2/4

E

MSM

REV_1.0

LG Electronics Inc.

- 144 -

7. CIRCUIT DIAGRAM

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

A

B

C

D

E

F

C

D

E

F

VREG_MSMP_2.7V

NAND_CS_N

NAND_READY

RESOUT_N

SDRAM_CS_N(0)

SDRAM_WE_N

SDRAM_RAS_N

SDRAM_CAS_N

SDRAM_CLK

SDRAM_CLK_EN

EBI2_WE_N

NAND_ALE

NAND_CLE

EBI2_OE_N

SDRAM_ADDR(13)

SDRAM_ADDR(14)

EBI2_DATA(0:7)

SDRAM_ADDR(0:12)

EBI2_DATA(0)

EBI2_DATA(1)

EBI2_DATA(2)

EBI2_DATA(3)

EBI2_DATA(4)

EBI2_DATA(5)

EBI2_DATA(6)

EBI2_DATA(7)

SDRAM_ADDR(0)

SDRAM_ADDR(1)

SDRAM_ADDR(2)

SDRAM_ADDR(3)

SDRAM_ADDR(4)

SDRAM_ADDR(5)

SDRAM_ADDR(6)

SDRAM_ADDR(7)

SDRAM_ADDR(8)

SDRAM_ADDR(9)

SDRAM_ADDR(10)

SDRAM_ADDR(11)

SDRAM_ADDR(12)

SDRAM_DQM(0)

SDRAM_DQM(1)

SDRAM_DQM(2)

SDRAM_DQM(3)

SDRAM_DATA(0:31)

SDRAM_DATA(0)

SDRAM_DATA(1)

SDRAM_DATA(2)

SDRAM_DATA(3)

SDRAM_DATA(4)

SDRAM_DATA(5)

SDRAM_DATA(6)

SDRAM_DATA(7)

SDRAM_DATA(8)

SDRAM_DATA(9)

SDRAM_DATA(10)

SDRAM_DATA(11)

SDRAM_DATA(12)

SDRAM_DATA(13)

SDRAM_DATA(14)

SDRAM_DATA(15)

SDRAM_DATA(16)

SDRAM_DATA(17)

SDRAM_DATA(18)

SDRAM_DATA(19)

SDRAM_DATA(20)

SDRAM_DATA(21)

SDRAM_DATA(22)

SDRAM_DATA(23)

SDRAM_DATA(24)

SDRAM_DATA(25)

SDRAM_DATA(26)

SDRAM_DATA(27)

SDRAM_DATA(28)

SDRAM_DATA(29)

SDRAM_DATA(30)

SDRAM_DATA(31)

S300

GND

SCHA1A0100

DAT2_RSV

CD_DAT3_CS

CMD_DI

VDD

CLK_SCLK

VSS

DAT0_DO

DAT1_RSV

GND

OJ300 OJ301 OJ302 OJ303

T-FLASH

R314

0

C351

0.1u

VREG_MMC_3.0V

U301

HYC0UEH0MF3P-6SS0E

N1

N2

N3

M5

P7

M6

N6

M8

IO0

IO1

IO2

IO3

IO4

IO5

IO6

IO7

A0

A1

A2

A3

A4

A5

A6

A7

A8

A9

A10

A11

A12

C2

D2

E1

D3

E2

K4

L1

L2

L3

D4

K3

F2

F1

J8

G6

F8

E7

DQM0

DQM1

DQM2

DQM3

F5

H3

H4

E6

F7

F6

D5

E8

D6

D8

H5

J4

G3

G4

G7

J6

J5

H6

F4

E4

D7

C8

C7

L4

L5

L6

L7

K8

L8

K7

K5

K6

DQ13

DQ14

DQ15

DQ16

DQ17

DQ18

DQ19

DQ20

DQ21

DQ22

DQ23

DQ24

DQ25

DQ26

DQ27

DQ28

DQ29

DQ30

DQ31

DQ0

DQ1

DQ2

DQ3

DQ4

DQ5

DQ6

DQ7

DQ8

DQ9

DQ10

DQ11

DQ12

J2

K1

G2

H2

_CS

_WED

_RAS

_CAS

G8

E3

B6

CK

CKE

_CE

B7

C6

C4

B4

B3

C3

_WEN

R_B

ALE

CLE

_RE

_WP

J3

K2

BA0

BA1

VSSN0

VSSN1

C5

P6

VSSQ0

VSSQ1

VSSQ2

VSSQ3

VSSQ4

VSSQ5

VSSQ6

VSSQ7

VSSQ8

VSSQ9

J9

K10

L10

M9

N10

C10

D9

E10

F9

G10

VDDQ0

VDDQ1

VDDQ2

VDDQ3

VDDQ4

VDDQ5

VDDQ6

VDDQ7

VDDQ8

VDDQ9

J10

K9

L9

M10

N9

C9

D10

E9

F10

G9

VSS0

VSS1

VSS2

VSS3

VSS4

VSS5

B9

C1

H9

J1

P9

M2

VDD0

VDD1

VDD2

VDD3

VDD4

VDD5

B8

D1

H1

H10

P8

M1

VCC0

VCC1

B5

N5

G1

G5

M3

M4

M7

N4

N7

N8

P1

P2

J7

H7

H8

B1

B2

B10

E5

F3

P3

P4

P5

P10

NC0

NC1

NC2

NC3

NC4

NC5

NC6

NC7

NC8

NC9

NC10

NC11

NC12

NC13

NC14

NC15

NC16

NC17

NC18

NC19

NC20

NC21

DNU0

DNU1

DNU2

DNU3

DNU4

DNU5

DNU6

A2

A9

A10

R1

R2

R9

R10

MMC_CD

MMC_CMD

MMC_CLK

MMC_DATA

REV_B

X16 SDRAM --> X32 SDRAM

REV_B

PMIC VPWR BYPASS

VDD_MSMC : 4.7uF

VDD_MSME : 4.7uF

VDD_MSM : 0.1uF

VDD_ANA : 0.1uF

VDD_RUIM : 0.1uF

VDD_RF : 0.1uF

VDD_WLAN : 0.1uF

VDD_MAIN : 0.1uF

VDD_SPKR : 0.1uF

C446

33u

+VPWR

USIM_P_DATA

USIM

VREG_MSME_1.8V

1608

REMOTE_PWR_ON

Check if it is LOW enable.

VREG_MSME_1.8V

MCP(512Mb NAND + 512Mb 1 piece SDRAM)

MEMORY

L302

56nH

R317

15K

9

10

7

8

5

6

J300 HSSC-8P-18

GND1

VPP

IO

VCC

RST

CLK

1

2

3

RSV2

GND2

RSV1

GND5

GND3 GND4

4

11

12

VREG_MSMP_2.7V

VREG_USIM_2.85V

USIM_P_RST_N

USIM_P_CLK

+5V_PWR

R305

10K

1005

+VPWR

LCD_LDO_EN

+VPWR

CAM_LDO_EN

+VPWR

CAM_LDO_EN

C327

ICHARGE

CHG_CTL_N

ICHARGEOUT

VBATT

BATT_FET_N

1u

RESIN_N

USB_OE_N

USB_CTL_N

USB_VBUS

USB_DAT

USB_D+

USB_SE0

USB_D-

R309 2.2K

C336

1608

4.7u

KYBD_BACKLIGHT

PM_ON_SW_N

MOTOR_PWR-

USIM_P_DATA

REV_B

VREG_RF_SMPS

14

15

16

17

18

10

11

12

13

19

20

21

1

2

3

4

5

6

7

8

9

ADC_BYP

VCHG

ISNS_P

CHG_CTL_N

ISNS_M

VBAT

BAT_FET_N

FLSH_DRV_N

PON_RESET_N

VREG_USB

USB_ID

VREG_5V

USB_OE_N

VSW_5V

USB_CTL_N

USB_VBUS

USB_DAT

USB_D_P

USB_SE0

USB_D_M

GP1_DRV_N(MPP7)

L305

4.7uH

C435

22u

C436

10u

C433

0.1u

C434

1000p

U300

PM6650-2M

REF_BYP

REF_GND

REF_ISET

VCOIN

MSM_INT_N

TCXO_IN

PS_HOLD

VREG_MSMA

TCXO_EN

VDD_ANA

TCXO_OUT

VDD_MSM

SBST

VREG_MSMP

SBCK

VBACKUP

SBDT

XTAL_OUT

SLEEP_CLK

XTAL_IN

RUIM_RST(MPP6)

54

53

52

51

50

49

48

47

46

63

62

61

60

59

58

57

56

55

45

44

43

51

51K

51K

0.1u

R303

R306

R307

R308

TP308

C322

121K

1%

PM_INT_N

TCXO_PM

TCXO_EN

+VPWR

+VPWR

BAT300

TCXO_MSM

1u

VREG_MSMP_2.7V

SSBDT_PM

SLEEP_CLK

USIM_P_RST_N

NBL414R-F9J

C323

4

1

470K

R304

C326

4.7u

X300

MC-146_7pF

32.768KHz

3

2

REV_D

+VPWR

USIM_RST_N

USIM_P_CLK

USIM_CLK

USIM_DATA

VREG_USIM_2.85V

VREG_MMC_3.0V

C339

2.2u

C340

2.2u

C358

22u

REV_E

Power Line --> Route carefully!!!!!

Draw the Artwork_line thickly !!!!!

--->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-

PS_HOLD

VREG_MSMA_2.6V

VREG_MSMP_2.7V

C346

1u

LCD LDO

4

6

1

U302

VDD

NC

CE

R1114D281D-TR-F

3

VOUT

GND1

GND2

2

5

C345

1u

VREG_LCD_2.8V

Artwork --> Place resistor and capacitor close to PM6650 !!

C347

1u

CAMERA LDO

1

2

3

4

U303

VIN

EN1

EN2

NC1

RT9011-MGPQW

8

VOUT1

VOUT2

7

NC2

6

GND

5

C348

1u

C349

1u

VREG_CAM_AVDD_2.8V

VREG_CAM_DVDD_1.8V

C447

1u

3

2

1

VIN

GND

STBY

VOUT

BGND

NC

U501

BH15LB1WHFV

4

6

5

REV_D

C350

1u

LCD BACKLIGHT

LCD_BL_CTRL

REV_C

+VPWR

WLED_PWR

REV_B

C357

1u

REV_B

C355

1u

5

8

U305

IN

CP

11

EN_SET

4

GND

AAT3157ITP-T1

10

C1+

C354

1u

C1-

C2+

9

7

C356

1u

6

C2-

D1

D2

D3

NC

1

2

3

12

WLED_1

WLED_2

WLED_3

VREG_CAM_DVDD_1.5V

Section

Designer

Checked

ICHARGEOUT

+VPWR

VBATT

BATT_FET_N

Date

MAR.07.2007

D

C

CHARGER

R313

0.1

6 5 4

Q300

QST4

1

C1

2

C2 3 B

USB_VBUS

USB_CTL_N

+5V_PWR

6 5 4

Q302

QST4

1

C1

2

C2 3 B

CHG_CTL_N

ICHARGE

Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT

Sign & Name

Jaykay MODEL

D

Sheet/

Sheets

3/4

E

E

F

DRAWING

NAME

MEM & POWER

Approved

C

B

A

LG(42)-A-5505-10:01

1 2 3 4 5 6 7 8 9

LG Electronics Inc.

DRAWING

NO.

REV_1.0

LG Electronics Inc.

LGMC

- 145 -

7. CIRCUIT DIAGRAM

A

B

C

D

1

CN400

35

33

31

29

27

25

24

23

21

19

18

17

15

5

3

14

13

12

11

10

9

7

8

6

4

2

1

16

22

20

28

26

34

32

30

2 3

LCD CONNECTOR

LCD_RESET_N

LCD_IF_MODE_0

LCD_IF_MODE_1

LCD_VSYNC

4

ICVE21184E150R500FR

1

2

INOUT_A1

INOUT_A2

3

INOUT_A3

INOUT_A4

4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

7

6

9

8

FL401

5

LCD_CS_N

LCD_ADS

EBI2_WE_N

EBI2_OE_N

6 7

ICVE21184E150R500FR

9

8

INOUT_B1 INOUT_A1

7

INOUT_B2 INOUT_A2

INOUT_B3 INOUT_A3

6

INOUT_B4 INOUT_A4

3

4

1

2

FL400

ICVE21184E150R500FR

9

INOUT_B1

8

INOUT_A1

7

INOUT_B2 INOUT_A2

6

INOUT_B3 INOUT_A3

INOUT_B4 INOUT_A4

1

2

3

4

ICVE21184E150R500FR

FL402

1

INOUT_A1

INOUT_A2

2

3

INOUT_A3

4

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

9

8

7

6

FL403

ICVE21184E150R500FR

1

INOUT_A1

2

INOUT_A2

3

INOUT_A3

4

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

7

6

9

8

FL405

EBI2_DATA(0)

EBI2_DATA(1)

EBI2_DATA(2)

EBI2_DATA(3)

EBI2_DATA(4)

EBI2_DATA(5)

EBI2_DATA(6)

EBI2_DATA(7)

EBI2_DATA(8)

EBI2_DATA(9)

EBI2_DATA(10)

EBI2_DATA(11)

EBI2_DATA(12)

EBI2_DATA(13)

EBI2_DATA(14)

EBI2_DATA(15)

LCD_MAKER_ID

VREG_LCD_2.8V

WLED_1

WLED_2

WLED_3

WLED_PWR

E

F

CAM_DATA_OUT(0)

CAM_DATA_OUT(1)

CAM_DATA_OUT(2)

CAM_DATA_OUT(3)

CAM_DATA_OUT(4)

CAM_DATA_OUT(5)

CAM_DATA_OUT(6)

CAM_DATA_OUT(7)

D

E

F

CAMERA

MEGA CAMERA CONNECTOR

3

4

1

2

5

22

23

24

D0

D1

D2

D3

D4

D5

D6

D7

CN403

PCLK

VSYNC

HSYNC

STANDBY

SCK

SDA

RESETB

MCLK

12

9

7

11

10

20

19

18

REV_1.0

R436 0

CAM_PCLK

CAM_VSYNC_OUT

CAM_HSYNC_OUT

MEGA_CAM_PWR_DOWN

I2C_SCL

I2C_SDA

MEGA_CAM_RESET_N

CAM_MCLK

AUDIO

+VPWR

C410

0.01u

SPK-

SPK_RCV-

RCV-

SELECT_SPK&RCV

R422 10

1

U401

NLAS5223BMNR2G

10

VCC NO2

2

NO1

3

COM1

4

IN1

5

NC1

COM2

9

IN2

8

NC2

7

GND

6

10 R421

SPK+

SPK_RCV+

RCV_EN_N

RCV+

R437 20

VREG_CAM_AVDD_2.8V

VREG_CAM_DVDD_1.8V

MIC

CAM_DATA(0)

CAM_DATA(1)

CAM_DATA(2)

ICVE21184E150R500FR

1

2

INOUT_A1

3

INOUT_A2

4

INOUT_A3

INOUT_A4

INOUT_B1

9

8

INOUT_B2

INOUT_B3

INOUT_B4

7

6

CAM_DATA_OUT(0)

CAM_DATA_OUT(1)

CAM_DATA_OUT(2)

FL406

CAM_DATA(6)

CAM_DATA(7)

CAM_VSYNC

CAM_HSYNC

CAM_DATA(3)

CAM_DATA(4)

CAM_DATA(5)

FL407

ICVE21184E150R500FR

1

2

INOUT_A1

INOUT_A2

3

4

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

9

8

7

6

CAM_DATA_OUT(6)

CAM_DATA_OUT(7)

CAM_VSYNC_OUT

CAM_HSYNC_OUT

FL408

REV_1.0

COMMON_CAM_MCLK

ICVE21184E150R500FR

1

2

INOUT_A1

3

INOUT_A2

4

INOUT_A3

INOUT_A4

INOUT_B1

9

8

INOUT_B2

INOUT_B3

INOUT_B4

7

6

CAM_DATA_OUT(3)

CAM_DATA_OUT(4)

CAM_DATA_OUT(5)

VT_CAMERA_CONNECTOR

VREG_CAM_AVDD_2.8V

VGA_CAM_RESET_N

I2C_SCL

I2C_SDA

REV_1.0

VREG_CAM_DVDD_1.5V

COMMON_CAM_MCLK

CAM_PCLK

CAM_DATA_OUT(0)

1

4

5

2

3

P1

P2

P3

P4

P5

GND1

GND2

CN404

GND6

GND5

P15

P14

P13

P12

P11

15

14

13

12

11

CAM_HSYNC_OUT

CAM_VSYNC_OUT

CAM_DATA_OUT(7)

CAM_DATA_OUT(6)

REV_B : SUMY0010301 --> SUMY0003802

MIC400

OB4-15L42-C33L

1

2

R424

2.2K

C416

10u

C418 0.1u

C419 0.1u

REV_B : EDTY0008606 --> EDTY0008601

LINE_N

LINE_P

SPK_AMP_EN

R427

R429

1K

1K

C422

C423

REV_C : 20K --> 3K

0.1u

0.1u

R428 5.6K

R430 5.6K

R426

20K

R431

20K

C431

NA

Audio AMP

NCP2890DMR2

1

_SD OUTB

8

2

BYPASS

U402

VM

VP

3

4

INP

INM OUTA

7

6

5

C417

47p

MICBIAS

MIC1P

MIC1N

C425

10u

C428

1u

CAM_DATA_OUT(1)

CAM_DATA_OUT(2)

CAM_DATA_OUT(3)

CAM_DATA_OUT(4) CAM_DATA_OUT(5)

SPK_RCV-

SPK_RCV+

L401

L402

100nH

100nH

RCVN

RCVP

REV_E : For Antenna Radiation

REV_B

SPK-

+VPWR

SPK+

LG(42)-A-5505-10:01

1 2 3 4 5 6 7 8 9

8

TP400

TP401

L400

56nH

D400

RB521S-30

9

+VPWR

MOTOR_PWR-

10 11 12

VREG_MSMP_2.7V

R401

5.1K

C400

0.1u

5

VCC

HOOK_KEY

1

OUT

2

GND

U400

NCS2200SQ2T2G

4

3

VIN-

VIN+

VBAT_SENSE

10K

R404

MIC2N

MIC2P

HPH_L

HPH_R

USB_D+

USB_D-

EAR_SENSE_N

VBATT

R408

470K REMOTE_PWR_ON

+5V_PWR

VBAT_TEMP

REV_B : Change Pin Description

USB_VBUS

UART_TXD

UART_RXD

CN402

3

4

1

2

VBAT

VREG_MSMP_2.7V

R410

80.6K

2.2K

R400

MICBIAS

VREG_MSMP_2.7V

R403

51K

VBAT_GND

13 14

I/O CONNECTOR

C402

C401

33u

33u

R407

R406

100ohm

100ohm

2

4

FL404

OUT IN

REV_B

1

G2

3

G1

NTS104B

REV_1.0

15

KEY_BACK_LIGHT LED(8EA)

+VPWR

LD400

LD403

LD406

LEBB-S14H

LEBB-S14H

LEBB-S14H

R411

100ohm

R414

100ohm

R417

100ohm

REV_B : EDLH0013501 --> EDLH0006001

KYBD_BACKLIGHT

LD404

LD407

LEBB-S14H

LEBB-S14H

R415

100ohm

R418

100ohm

LD402

LD405

LD408

LEBB-S14H

LEBB-S14H

R413 100ohm

LEBB-S14H

R416 100ohm

R419 100ohm

VREG_MSMP_2.7V

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_ROW(4)

KEY_COL(0)

KEY_COL(1)

KEY_COL(2)

KEY_COL(3)

KEY_COL(4)

KEY MAP

400

1

403

4

406

7

HOT400

HOT4

407

8

409

0

401

2

404

5

402

3

405

6

408

9

HOT401

HOT3

CLR

LEFT

OK

SND

DN

MENU

UP

RIGHT

SEARCH

BACK

Section

Designer

Checked

Approved

Date

MAR.07.2007

Sign & Name

Jaykay

LG Electronics Inc.

PM_ON_SW_N

CN401

HSEJ-18S04-25R

20

22

13

14

15

16

17

18

9

10

11

12

21

19

1

4

5

2

3

6

7

8

KEYS

16

END

END

A

B

C

D

E

F

C

D

MODEL

DRAWING

NAME

DRAWING

NO.

LGMC

KEY / MMI

LCD/CAMERA

Sheet/

Sheets

4/4

E

REV_1.2

LG Electronics Inc.

- 146 -

8. PCB LAYOUT

- 147 -

LGMC

8. PCB LAYOUT

- 148 -

LGMC

9. Calibration & RF Auto Test Program (Hot Kimchi)

9. Calibration & RF Auto Test Program (Hot Kimchi)

9.1 Configuration of HOT KIMCHI

9.1.1 Configuration of directory

C: Cm_Grut Common

Debug dll_serialat

Log

At_Serial_Cmd.xml

Diag_NV6250_RevB.dll

Diag_NV6275.dll

Diag_NV.dll

DLL_E5515CD.DLL

DLL_PwrControlD.dll

Dll_SerialATD.dll

LG_CL_011.dll

PwrSupply_Cmd.xml

Auto

Cal

CalAuto

LG_CL_009.dll

: Directory

: File

KU250

KU250

KU250

- 149 -

9. Calibration & RF Auto Test Program (Hot Kimchi)

: Directory

: File

Hot_Kimchi

Model

Debug image

Log

ComLMPLib_11.dll

Dll_EzLooksMQ_004.dll

GuiTk115d.dll

HK_25.exe

ijl11.dll

SBCmd.xml

ShieldBox_DllD.dll

KU250

LG_RfTest_E5515C_211.dll

QMSL_MSVC6R.dll

Log

AutoSetup_110.xml

Cal_Setup_Test.xml

Ezlooks.xml

LG_RfCal_Q3G6280N_Polar_006.dll

Procedure_KU250_103.xml

script_auto_001.xml

script_cal_003.xml

Spec_3GPP_030.xml

- 150 -

9. Calibration & RF Auto Test Program (Hot Kimchi)

: Directory

: File

1.

dll,ocx

Result

UI

(Win98)MFCD DLL COPY.bat

(Win2000)MFCD DLL COPY.bat

(WinXP)MFCD DLL COPY.bat

MFC42D.DLL

MFCD42D.DLL

MFCN42D.DLL

MFCO42D.DLL

MSVCP60D.DLL

MSVCRTD.DLL

Vsflex7L.ocx

vsflex7l_ocx_regist.bat

Auto

Cal

CalAuto image

LG_UI_Ad6500_002.dll

LG_UI_EmKU250_001.dll

LG_UI_Qu6250_003.dll

LG_UI_Qu6275_004.dll

_New_HK_0808.reg

KU250

KU250

KU250 result.bmp

- 151 -

9. Calibration & RF Auto Test Program (Hot Kimchi)

9.2 How to use HOT KIMCHI

➀

➁

➂

* Procedure

1. Click “Logic Operation” of “SETTING” menu bar

2. Select “UART Port” that PC can communicate with the phone

3. Select “LOGIC MODE” that you want

- Logic Mode -> 1: Calibration Only

- 152 -

9. Calibration & RF Auto Test Program (Hot Kimchi)

KU250

➄

Click "Start"

➃

Select "U250/KU250"

* Procedure

4. Select the model name “U250/KU250”

5. Click “Start” button

- 153 -

10. Factory Test Mode

10. Factory Test Mode

10.1. Test Program Setting

1) Open “LG FTM GUI”

2) Click “Options >> Port Settings”

3) Select Com Port and click “OK”

- 154 -

10. Factory Test Mode

10.2. WCDMA Test Mode

1) Click “Tools >> FTM GUI WCDMA”

2) Select “FTM” Mode

3) Select RF Frequencies, insert “9750” in “Uplink chan” and push “Enter”. Then “2140” is written at Rx UHF automatically.

4) For Deciding to “TX AGC”, insert 380 as a maximum value . And then WCDMA Power is decided.

5) To set PA Range, select ON in R1 for High power mode or select ON in R0 for Low power mode.

6) Depending on a situation, Click “Tx On” or “Tx Off”.

Channel Select Tx Control Rx Control

7) Set Rx mode. Click LNA Range, 0~4.

8) Click “Get IM2” and “Get Rx AGC”. Confirm the value.

- 155 -

10. Factory Test Mode

10.3. GSM Test Mode

1) To switch GSM Mode, Select Mode -> GSM mode at menu commands

2) Select RF Mode, Click “GSM” or “GSM1800” or “GSM1900”

3) Write wanted channel. We usually set “1”

4) For Deciding to “PA DAC Value”, insert 14300 as a maximum value

5) Click “Tx On” or “Tx Off”.

6) SET RX mode. Click LNA Range, 0~4.

7) Click “RX ON”

Channel Control

Tx Power Control

Rx Gain Control

- 156 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.1 EXPLODED VIEW

15

16

17

18

19

20

22

28

29 30

31

32

1

2

3

4

5 6

7

8

12

13

23

24

25

26

27

14

37

9

10

11

35

33

34

36

- 157 -

- 158 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.2 Replacement Parts

<Mechanic component>

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Level

3

2

1

2

5

5

4

4

3

4

3

2

4

4

4

4

4

4

4

4

4

4

4

4

3

4

4

4

4

4

4

4

4

Location

No.

Description

IMT,BAR/FLIP

AAAY00 ADDITION

MCJA00 COVER,BATTERY

APAY00 PACKAGE

BSEA00 SUPPLEMENTARY PART

APEY00 PHONE

ACGK00 COVER ASSY,FRONT

MCCC00 CAP,EARPHONE JACK

MCCG00 CAP,MULTIMEDIA CARD

MCJK00 COVER,FRONT

MICE00 INSERT,NUT

MICE01 INSERT,NUT

MFBC00 FILTER,SPEAKER

MFBZ00 FILTER

MHGJ00 HOLDER,SPEAKER

MKAZ00 KEYPAD

MPBG00 PAD,LCD

MPBT00 PAD,CAMERA

MTAB00 TAPE,PROTECTION

MTAB01 TAPE,PROTECTION

MTAD00 TAPE,WINDOW

MWAC00 WINDOW,LCD

ACGM00 COVER ASSY,REAR

ENZY00 CONNECTOR,ETC

MCCF00 CAP,MOBILE SWITCH

MCJN00 COVER,REAR

MHGZ00 HOLDER

MLAB00 LABEL,A/S

MLAN00 LABEL,QUALCOMM

MPBH00 PAD,MIKE

MPBN00 PAD,SPEAKER

MPBZ00 PAD

MPBZ01 PAD

Part Number Spec

TIMT0000614

AAAY0219401

MCJA0040601 MOLD, PC LUPOY SC-1004A, , , , ,

APAY0095904 U250 HIT Packing(P/Label66-Angle-9501)

BSEA0003901 PACKING-LIST ENVELOPE

APEY0394202

ACGK0085601

MCCC0043601 COMPLEX, (empty), , , , ,

MCCG0007601 COMPLEX, (empty), , , , ,

MCJK0069301 MOLD, PC LUPOY SC-1004A, , , , ,

MICE0000601 COMPLEX, (empty), , , , ,

MICE0000701 COMPLEX, (empty), , , , ,

MFBC0029401 COMPLEX, (empty), , , , ,

MFBZ0002801 COMPLEX, (empty), , , , ,

MHGJ0001701 COMPLEX, (empty), , , , ,

MKAZ0035901 COMPLEX, (empty), , , , ,

MPBG0058301 COMPLEX, (empty), 1.2, , , ,

MPBT0039101 COMPLEX, (empty), 1.2, , , ,

MTAB0160501 COMPLEX, (empty), , , , ,

MTAB0160601 COMPLEX, (empty), , , , ,

MTAD0065801 COMPLEX, (empty), 0.2, , , ,

MWAC0077201 COMPLEX, (empty), 1.0, , , ,

ACGM0087501

ENZY0019701 4 PIN,3.0 mm,ETC , ,H=5.8

MCCF0042501 COMPLEX, (empty), , , , ,

MCJN0065501 MOLD, PC LUPOY SC-1004A, , , , ,

MHGZ0028701 COMPLEX, (empty), , , , ,

MLAB0001102 C2000 USASV DIA 4.0

MLAN0000603 White,95C

MPBH0029101 COMPLEX, (empty), , , , ,

MPBN0039001 CUTTING, NS, , , , ,

MPBZ0186001 COMPLEX, (empty), , , , ,

MPBZ0186801 COMPLEX, (empty), , , , ,

Color

Black

Black

Without Color

Without Color

Remark

36

Black

Without Color

Black

White

Transparent

Black

Black

Without Color

Without Color

Black

Without Color

Without Color

Without Color

Without Color

Without Color

Without Color

Without Color

Without Color

Black

Without Color

Without Color

Without Color

Without Color

Without Color

Without Color

Without Color

Without Color

10

4

5

13

3

2

8

1

11

12

6

9

7

24

29

28

22

27

26

18

19

25

- 159 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

4

4

4

Level

Location

No.

Description

MTAB01 TAPE,PROTECTION

MTAD00 TAPE,WINDOW

MWAE00 WINDOW,CAMERA

4 SJMY00 VIBRATOR,MOTOR

4

6

5

3

6

5

5

SNGF00 ANTENNA,GSM,FIXED

MLAA00 LABEL,APPROVAL

MCBA00 CAN,SHIELD

MPBZ00 PAD

ADCA00 DOME ASSY,METAL

MTAZ00 TAPE

MLAZ00 LABEL

Part Number Spec

MTAB0178301 COMPLEX, (empty), , , , ,

MTAD0065901 COMPLEX, (empty), 0.2, , , ,

MWAE0024501 COMPLEX, (empty), 1.0, , , ,

Color

Without Color

Without Color

Without Color

Remark

32

30

31

23 SJMY0007903 3 V,0.85 A,4*8 ,Height 5.8T Cylinder ,; ,3V , , ,11000 , , , ,

SNGF0023102

3.0 ,-2 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL ,;

,QUAD ,-2.0 ,50 ,3.0

MLAA0042001 COMPLEX, (empty), , , , ,

MCBA0017101 COMPLEX, (empty), , , , ,

Without Color

Without Color

MPBZ0179301 COMPLEX, (empty), 0.6t, , , ,

ADCA0064001

Without Color

Without Color

MTAZ0186301 COMPLEX, (empty), 0.1, , , ,

MLAZ0038301 PID Label 4 Array

Without Color

Without Color

20

34

16

14

- 160 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.2 Replacement Parts

<Main component>

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

4

5

3

3

Level

5

Location

No.

Description

GMEY00 SCREW MACHINE,BIND

SAFY00 PCB ASSY,MAIN

SAFB00 PCB ASSY,MAIN,INSERT

ACKA00 CAN ASSY,SHIELD

SUMY00 MICROPHONE

5

5

5

5

4

5

6

6

6

6

Part Number Spec

GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK

SAFY0196602

SAFB0072901

ACKA0002101

SUSY00

SVCY00

SVCY01

SVLM00

SPEAKER

CAMERA

CAMERA

LCD MODULE

SUMY0010301 FPCB ,-42 dB,4*1.5T ,Standard Holder

SUSY0026801

ASSY ,8 ohm,88 dB, mm,wire 15mm ,; , , , , , ,18*10*3T

,WIRE

SVCY0014401

CMOS ,MEGA ,1.3M, Magnachip(1/4"), 8x8x5t, Socket

Type

SVCY0014301 CMOS ,VGA ,Socket type

SVLM0025001

MAIN ,176*220 (1.76") ,34*46.7*2.5(T) ,262k ,TFT ,TM

,NT3916(Novatek) ,NTSC:60%

SAFF0117802 SAFF00 PCB ASSY,MAIN,SMT

SAFC00

PCB ASSY,MAIN,SMT

BOTTOM

SAFC0088501

C107

C108

C109

C110

C101

C103

C104

C106

C112

C113

C114

C115

C117

C118

C119

ANT103

BAT300

C121

C122

ANTENNA,GSM,FIXED

BATTERY,CELL,LITHIUM

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

SNGF0026001

3.0 ,-2.0 dBd, ,Bluetooth, SMD, 8.0*2.0*1.2 ,; ,SINGLE ,-

2.0 ,50 ,3.0

SBCL0001701

2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi 4.8, Pb-Free

ECZH0000841

ECCH0001002

ECCH0001002

ECZH0000846

ECCH0000107

ECCH0001002

ECZH0000830

ECZH0000830

ECZH0000816

ECCH0001002

56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

6 pF,50V,D,NP0,TC,1005,R/TP

180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

ECCH0000149

ECCH0000143

ECCH0000110

ECZH0000816

3.3 nF,50V,K,X7R,HD,1005,R/TP

1 nF,50V,K,X7R,HD,1005,R/TP

10 pF,50V,D,NP0,TC,1005,R/TP

12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

CAP,TANTAL,CHIP,MAKER ECTZ0005603

33 uF,10V ,M ,L_ESR ,2125 ,R/TP ,; , ,[empty] ,[empty] ,

,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]

CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

Color

Without Color

Remark

33

15

Without Color 17

- 161 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

C123

Description

CAP,CERAMIC,CHIP

C124

C126

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C127

C128

C129

C130

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C151

C152

C153

C154

C144

C147

C149

C150

C155

C156

C157

C136

C139

C140

C141

C131

C132

C134

C135

C142

C143

C164

C165

C170

C171

C172

C158

C159

C161

C162

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,TANTAL,CHIP

CAP,CHIP,MAKER

INDUCTOR,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

Part Number Spec

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP

ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECTH0002202 4.7 uF,10V ,M ,STD ,1608 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ELCH0001427 2.2 nH,S ,1005 ,R/TP ,Pb Free

ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECCH0000180 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECCH0000101 .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

Color Remark

- 162 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

C204

C205

C206

C209

C200

C201

C202

C203

C210

C211

C212

C186

C187

C188

C189

C181

C182

C183

C185

C190

C192

C217

C218

C219

C220

C221

C213

C214

C215

C216

Level

6

6

6

6

6

6

6

Location

No.

C173

Description

CAP,CERAMIC,CHIP

C174

C176

C177

C178

C179

C180

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

Part Number Spec

ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP

ECCH0000182

ECCH0000143

ECCH0000155

ECZH0000813

ECCH0000143

ECCH0000143

ECCH0000155

ECCH0000115

ECCH0000101

ECZH0000813

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

1 nF,50V,K,X7R,HD,1005,R/TP

10 nF,16V,K,X7R,HD,1005,R/TP

100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

1 nF,50V,K,X7R,HD,1005,R/TP

1 nF,50V,K,X7R,HD,1005,R/TP

10 nF,16V,K,X7R,HD,1005,R/TP

22 pF,50V,J,NP0,TC,1005,R/TP

.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP

ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP

CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

CAP,TANTAL,CHIP,MAKER ECTZ0004701 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP

CAP,TANTAL,CHIP

CAP,CHIP,MAKER

ECTH0003701

ECZH0004402

10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

Color Remark

- 163 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

C222

Description

CAP,CERAMIC,CHIP

C223

C225

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C226

C227

C228

C229

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C246

C247

C301

C302

C240

C242

C243

C244

C303

C304

C305

C234

C235

C236

C237

C230

C231

C232

C233

C238

C239

C311

C312

C316

C317

C318

C306

C307

C308

C310

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

Part Number Spec

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

Color Remark

- 164 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

C319

Description

CAP,CHIP,MAKER

C320

C321

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C322

C323

C324

C325

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C340

C341

C343

C344

C336

C337

C338

C339

C345

C346

C347

C330

C331

C332

C333

C326

C327

C328

C329

C334

C335

C352

C353

C354

C355

C356

C348

C349

C350

C351

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

Part Number Spec

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP

ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP

ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

Color Remark

- 165 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

C357

Description

CAP,CHIP,MAKER

C358

C389

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C400

C401

C402

C403

CAP,CERAMIC,CHIP

CAP,TANTAL,CHIP

CAP,TANTAL,CHIP

CAP,CERAMIC,CHIP

C418

C419

C420

C421

C414

C415

C416

C417

C422

C423

C425

C408

C409

C410

C411

C404

C405

C406

C407

C412

C413

C430

C432

C433

C434

C435

C426

C427

C428

C429

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,TANTAL,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,TANTAL,CHIP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

CAP,TANTAL,CHIP

Part Number Spec

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP

ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP

ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECTH0003701 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECTH0001902 10 uF,10V ,M ,L_ESR ,1608 ,R/TP

ECCH0000152 5.6 nF,25V,K,X7R,HD,1005,R/TP

ECCH0000152 5.6 nF,25V,K,X7R,HD,1005,R/TP

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECTH0001903 22 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

Color Remark

- 166 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

C436

Description

CAP,CERAMIC,CHIP

C437

C438

CAP,CHIP,MAKER

CAP,CHIP,MAKER

C439

C440

C441

C442

CAP,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

C443

C444

C445

6

6

6

6

6

6

6

6

6

6

6

C446

C447

C450

CN400

CN401

CN403

D400

D401

D402

D403

D404 DIODE,TVS

Part Number

ECCH0005604

ECZH0000802

ECZH0000813

ECZH0000806

ECZH0000806

ECCH0000185

ECCH0000185

Spec

10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP

1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

CAP,CERAMIC,CHIP

CAP,CERAMIC,CHIP

ECCH0000185 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

CAP,CERAMIC,CHIP ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

CAP,TANTAL,CHIP,MAKER ECTZ0005603

33 uF,10V ,M ,L_ESR ,2125 ,R/TP ,; , ,[empty] ,[empty] ,

,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CONNECTOR,FFC/FPC

CONNECTOR,I/O

CONN,SOCKET

DIODE,SWITCHING

ECZH0001215

ECCH0000115

ENQY0010901

ENRY0006401

1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

22 pF,50V,J,NP0,TC,1005,R/TP

35 PIN,0.3 mm,ETC , ,H=1.2

18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type

ENSY0020101 24 PIN,ETC , ,0.9 mm,

EDSY0011901

EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,

IR=30uA(VR=10V)

DIODE,TVS

DIODE,TVS

DIODE,TVS

EDTY0007401 SMD ,12 V,350 W,R/TP ,

EDTY0008610 SOD-523 ,5 V,250 W,R/TP ,PB-FREE

EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE

6

6

6

6

6

6

6

6

6

FL101

FL102

FL103

FL104

FL400

FL401

FL402

FL403

FL404

FILTER,SAW

FILTER,SAW

FILTER,SAW

DUPLEXER,IMT

FILTER,EMI/POWER

FILTER,EMI/POWER

FILTER,EMI/POWER

FILTER,EMI/POWER

FILTER,EMI/POWER

EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE

SFSY0030201

897.5 MHz,1.4*1.1*0.6 ,SMD ,Pbfree_SAW_GSM900_Tx

SFSY0031101

1950 MHz,1.4*1.1*0.62 ,SMD ,RF Filter for WCDMA

2Ghz ,; ,1950 ,1.4*1.1*0.62 ,SMD ,P/TR

SFSY0031201

2140 MHz,1.4*1.1*0.62 ,SMD ,2110M~2170M, IL 2.0,

5pin, U-B, 50-100_10, WCDMA BAND I Rx ,; ,2140

,1.4*1.1*0.62 ,SMD ,R/TP

SDMY0001301

1950 MHz,2140 MHz,1.6 dB,2.0 dB,53 dB,44 dB,3.0*2.5*1.2 ,SMD ,FBAR, WCDMA duplexer ,; ,2140

,44 ,1950 ,53 ,2.0 ,1.6 ,3.0X2.5X1.2 ,DUAL ,SMD ,R/TP

SFEY0007103

SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),

Pb-free

SFEY0007103

SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),

Pb-free

SFEY0007103

SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),

Pb-free

SFEY0007103

SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),

Pb-free

SFEY0006001 SMD ,

Color Remark

- 167 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

6

6

6

Location

No.

Description

FL405 FILTER,EMI/POWER

FL406

FL407

FILTER,EMI/POWER

FILTER,EMI/POWER

FL408 FILTER,EMI/POWER

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

MODULE,ETC

TR,BJT,PNP

CONN,SOCKET

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,CHIP

INDUCTOR,SMD,POWER

INDUCTOR,SMD,POWER

INDUCTOR,CHIP

INDUCTOR,SMD,POWER

INDUCTOR,CHIP

INDUCTOR,CHIP

L128

L300

L301

L302

L120

L121

L123

L125

L305

L400

L401

L114

L115

L116

L119

J300

L102

L108

L111

L406

L407

L408

L409

L402

L403

L404

L405

L410

L411

M100

Q300

Part Number Spec

SFEY0007103

SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),

Pb-free

SFEY0007103

SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),

Pb-free

SFEY0007103

SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),

Pb-free

SFEY0007103

SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),

Pb-free

ENSY0019201 8 PIN,ETC ,8Pin ,2.54 mm,Korean 8Pin Stopper UIM

ELCH0005009 100 nH,J ,1005 ,R/TP ,

ELCH0001031 15 nH,J ,1005 ,R/TP ,PBFREE

ELCH0004718 5.6 nH,S ,1005 ,R/TP ,

ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE

ELCH0001032 18 nH,J ,1005 ,R/TP ,PBFREE

ELCH0001041 10 nH,S ,1005 ,R/TP ,PBFREE

ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE

ELCH0003813 47 nH,J ,1005 ,R/TP ,COIL TYPE

ELCH0005020 1 nH,S ,1005 ,R/TP ,

ELCH0005020 1 nH,S ,1005 ,R/TP ,

ELCH0001410 12 nH,J ,1005 ,R/TP ,Pb Free

ELCH0005010 1.8 nH,S ,1005 ,R/TP ,

ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,

ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,

ELCH0001550 56 nH,J ,1608 ,R/TP ,

ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,

ELCH0003825 56 nH,J ,1005 ,R/TP ,chip inductor,PBFREE

ELCH0005009 100 nH,J ,1005 ,R/TP ,

ELCH0005009 100 nH,J ,1005 ,R/TP ,

ELCH0001033 1.5 nH,S ,1005 ,R/TP ,PBFREE

ELCH0005010 1.8 nH,S ,1005 ,R/TP ,

ELCH0005002 2.7 nH,S ,1005 ,R/TP ,

ELCH0005002 2.7 nH,S ,1005 ,R/TP ,

ELCH0005002 2.7 nH,S ,1005 ,R/TP ,

ELCH0001041 10 nH,S ,1005 ,R/TP ,PBFREE

ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE

ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE

ELCH0001035 4.7 nH,S ,1005 ,R/TP ,PBFREE

SMZY0012601 4.5x3.2x1.2 Bluetooth RF Module

EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680

Color Remark

- 168 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

6

Location

No.

Q301

Description

TR,FET,P-CHANNEL

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

TR,BJT,PNP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R111

R112

R113

R114

R107

R108

R109

R110

R115

R116

R117

Q302

R100

R101

R103

R104

R105

R106

R204

R205

R207

R208

R209

R211

R213

R122

R123

R124

R128

R118

R119

R120

R121

R201

R202

Part Number Spec

EQFP0004701

TSOP6 ,1.5 W,20 V,-5 A,R/TP ,P-CHANNEL 20-V(D-S)

MOSFET, Pb free

EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000212 12 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000517 91 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000473 39 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000415 130 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000415 130 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000222 150 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000469 36 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP

Color Remark

- 169 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

R214

Description

RES,CHIP,MAKER

R215

R300

RES,CHIP,MAKER

RES,CHIP,MAKER

R301

R302

R303

R304

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

R402

R403

R404

R405

R318

R380

R400

R401

R406

R407

R408

R309

R313

R314

R315

R305

R306

R307

R308

R316

R317

R424

R425

R426

R427

R428

R409

R410

R421

R422

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

RES,CHIP,MAKER

Part Number Spec

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0004201 121000 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHY0008602 0.1 ohm,1/4W ,J ,2012 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000530 5.1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000318 80.6 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP

Color Remark

- 170 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

R429

Description

RES,CHIP,MAKER

R430

R431

RES,CHIP,MAKER

RES,CHIP,MAKER

R433

R434

R435

R436

RES,CHIP

RES,CHIP

RES,CHIP,MAKER

RES,CHIP,MAKER

R437

RA400

RES,CHIP,MAKER

RES,ARRAY,R

6 S300 CONN,SOCKET

SW100 CONN,RF SWITCH

TR100 TR,BJT,ARRAY

U100 IC

IC

U101

U102

U103

U104

U201

U300

PAM

COUPLER,RF

DIRECTIONAL

PAM

IC

IC

IC

U301 IC

U302 IC

U303 IC

U305

U400

IC

IC

U401 IC

U402 IC

U500 FILTER,SEPERATOR

U501 IC

VA300

VA301

VARISTOR

VARISTOR

Part Number Spec

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000499 5600 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000438 20 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0013101 2.7 ohm,1/16W ,J ,1005 ,R/TP

ERHY0013101 2.7 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000435 20 ohm,1/16W ,J ,1005 ,R/TP

ERNR0000404 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP

ENSY0013501

8 PIN,ETC ,PUSH-PUSH TYPE / RECTANGULAR ,1.1

mm,TRANS FLASH SOCKET / EXTERNAL MEMORY

CARD SOCKET

ENWY0003301 ,SMD ,0.4 dB,

EQBA0000601 UMT5 ,.2 W,R/TP ,

EUSY0300501

QFN ,56 PIN,R/TP ,GSM, WCDMA Single RF

Transceiver, 8X8X0.9

EUSY0300502

QFN ,56 PIN,R/TP ,chartered,GSM, WCDMA Single RF

Transceiver, 8X8X0.9 ,; ,IC,Tx/Rx

SMPY0014001 35.5 dBm,56 %, A, dBc, dB,6x6x1.15 ,SMD ,Tri Band

SCDY0003403

-18 dB,-.25 dB,-33 dB,1.0*0.58*0.35 ,SMD ,1920M ~

1980M, 4pin, Pb Free , ,[empty] , , ,SMD ,R/TP

SMPY0014201 28 dBm,40 %,465 mA,-44 dBc,26.5 dB,4x4x1.1 ,SMD ,

EUSY0073401 SSOP5-P-0.65A ,5 PIN,R/TP ,INVERTER, Pb Free

EUSY0318401 CSP ,409 PIN,R/TP ,WEDGE Baseband Platform

EUSY0306302 BCCS ,84 PIN,R/TP ,7x7, MSMC(1.2V), pbfree

EUSY0332001

FBGA ,137 PIN,ETC ,512M(64Mx8)

NAND+512M(16Mx32) SDRAM , ,IC,MCP

EUSY0232812 SON1612-6 ,6 PIN,R/TP ,2.8V, 150mA LDO

EUSY0319001

WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual

LDO

EUSY0238702

TSOPJW-12 ,12 PIN,R/TP ,3PORT Charge

Pump(AAT2154 Low cost version)

EUSY0250501

SC70 ,5 PIN,R/TP ,Comparator, pin compatible to

EUSY0077701

EUSY0300101

WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog

Switch, PB-Free

EUSY0176401 MICRO8 ,8 PIN,R/TP ,1W AUDIO AMPLIFIER

SFAY0007402

900.1800 ,1900.2100 , dB, dB, dB, dB,ETC ,1800GSM

Quad, WCDMA2100 FEM, 5.4X4.0X1.2, Improved D5006

EUSY0223001

HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH

OUTPUT CONTROL / 1.5V

SEVY0004001 18 V, ,SMD ,3pF, 1005

SEVY0004201 14 V, ,SMD ,120pF, 1005

Color Remark

- 171 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

6

6

6

6

6

6

6

6

5

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

6

Level

Location

No.

VA302

Description

VARISTOR

VA303

VA304

VARISTOR

VARISTOR

VA305

VA306

VA400

VA401

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VA402

VA403

VA404

VA405

VA407

VA408

VA409

VA410

VA412

VA414

VA430

VA490

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

VARISTOR

6

6

X100

X300

VCTCXO

X-TAL

SAFD00 PCB ASSY,MAIN,SMT TOP

CN404 CONN,SOCKET

LD400 DIODE,LED,CHIP

LD402 DIODE,LED,CHIP

LD403 DIODE,LED,CHIP

LD404 DIODE,LED,CHIP

LD405 DIODE,LED,CHIP

LD406 DIODE,LED,CHIP

LD407 DIODE,LED,CHIP

LD408 DIODE,LED,CHIP

R411 RES,CHIP

R413

R414

RES,CHIP

RES,CHIP

R415

R416

RES,CHIP

RES,CHIP

Part Number Spec

SEVY0004001 18 V, ,SMD ,3pF, 1005

SEVY0004001 18 V, ,SMD ,3pF, 1005

SEVY0004001 18 V, ,SMD ,3pF, 1005

SEVY0004001 18 V, ,SMD ,3pF, 1005

SEVY0004001 18 V, ,SMD ,3pF, 1005

SEVY0004001 18 V, ,SMD ,3pF, 1005

SEVY0004001 18 V, ,SMD ,3pF, 1005

SEVY0004201 14 V, ,SMD ,120pF, 1005

SEVY0004201 14 V, ,SMD ,120pF, 1005

SEVY0004201 14 V, ,SMD ,120pF, 1005

SEVY0004201 14 V, ,SMD ,120pF, 1005

SEVY0004201 14 V, ,SMD ,120pF, 1005

SEVY0004201 14 V, ,SMD ,120pF, 1005

SEVY0004201 14 V, ,SMD ,120pF, 1005

SEVY0004201 14 V, ,SMD ,120pF, 1005

SEVY0004201 14 V, ,SMD ,120pF, 1005

SEVY0004201 14 V, ,SMD ,120pF, 1005

SEVY0004201 14 V, ,SMD ,120pF, 1005

SEVY0004201 14 V, ,SMD ,120pF, 1005

EXSK0005703

19.2 MHz,1.5 PPM,40 pF,SMD ,3.2*2.5*0.9 , ,; , ,1.5PPM

,2.8V ,3.2 ,2.5 ,0.9 , ,SMD ,P/TP

EXXY0004601

.032768 MHz,20 PPM,7 pF,65000 ohm,SMD ,6.9*1.4*1.3

,

SAFD0087801

ENSY0020001

EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED

EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED

EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED

EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED

EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED

EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED

EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED

EDLH0006001 Blue ,1608 ,R/TP ,Blue SMD LED

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

Color Remark

- 172 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

6

6

6

6

6

Level

Location

No.

R417

Description

RES,CHIP

R418

R419

RES,CHIP

RES,CHIP

R423 RES,CHIP,MAKER

SPFY00 PCB,MAIN

Part Number Spec

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

SPFY0147601 FR-4 ,1.0 mm,BUILD-UP 8 ,

Color Remark

- 173 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.3 Accessory

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Level

Location

No.

3

Description

SBPL00 BATTERY PACK,LI-ION

3 SSAD00 ADAPTOR,AC-DC

ADAPTOR,AC-DC

ADAPTOR,AC-DC

ADAPTOR,AC-DC

Part Number Spec

SBPL0090501

3.7 V,950 mAh,1 CELL,PRISMATIC ,KU250 Europe

BATT, IP, Pb-Free ,; ,3.7 ,950 ,0.2C ,PRISMATIC

,50x34x55 , ,BLACK ,Innerpack ,Europe Label

SSAD0024501

100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,;

,85Vac~264Vac ,5.1V +0.15V, -0.2V ,700mA ,5060 ,

,WALL 2P ,I/O CONNECTOR ,

SSAD0024502

SSAD0024503

100-240V ,5060 Hz,5.1 V,0.7 A,CE ,AC-DC ADAPTOR ,;

,5.1V +0.15V, -0.2V ,5.1V ,700mA ,5060 , ,WALL 2P ,I/O

CONNECTOR ,

100-240V ,5060 Hz,5.2 V,0.7 A,CE ,AC-DC ADAPTOR ,;

,85Vac~264Vac ,5.2±0.3V ,700mA ,5060 , ,WALL 2P ,I/O

CONNECTOR ,

SSAD0024504

100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,;

,85Vac~264Vac ,5.1V(+0.15V, -0.2V) ,700mA ,5060 ,

,WALL 2P ,I/O CONNECTOR ,

Color

Black

Remark

35

- 174 -

Note

Note