LG | U250 | User's Manual | LG U250 User's Manual

Service Manual
Service Manual
U250/KU250
Model : U250/KU250
Date: June, 2007 / Issue 1.0
Table Of Contents
1. INTRODUCTION .............................. 5
1.1 Purpose................................................... 5
1.2 Regulatory Information............................ 5
2. PERFORMANCE...............................7
2.1 System Overview .....................................7
2.2 Usable environment .................................8
2.3 Radio Performance ..................................8
2.4 Current Consumption.............................14
2.5 RSSI BAR ..............................................14
2.6 Battery BAR ...........................................15
2.7 Sound Pressure Level............................16
2.8 Charging ................................................16
4.16 Receiver Path ....................................107
4.17 Headset path......................................109
4.18 Speaker phone path...........................111
4.19 Main microphone ...............................113
4.20 Headset microphone..........................115
4.21 Vibrator ..............................................117
5. DOWNLOAD..................................119
5.1 U250/KU250 DOWNLOAD ..................119
5.1.1 Introduction ...................................119
5.1.2 Downloading Procedure ...............119
5.1.3 Troubleshooting Download Errors 129
5.1.4 Caution .........................................133
3. TECHNICAL BRIEF ........................17
6. BLOCK DIAGRAM ........................134
3.1 General Description ...............................17
3.2 GSM Mode.............................................19
3.3 UMTS Mode...........................................23
3.4 LO generation and distribution circuits...25
3.5 Off-chip RF Components .......................25
3.6 Digital Baseband(DBB/MSM6245).........34
3.7 Block Diagram(MSM6245).....................36
3.8 Subsystem(MSM6245) ..........................37
3.9 Power Block ...........................................45
3.10 External memory interface ...................50
3.11 H/W Sub System..................................52
3.12 Main Features ......................................68
6.1 GSM & UMTS RF Block.......................134
6.2 Interface Diagram ................................136
7. Circuit Diagram ............................143
8. pcb layout .....................................147
9. Calibration & RF Auto Test
Program (Hot Kimchi)..................149
9.1 Configuration of HOT KIMCHI .............149
9.2 How to use HOT KIMCHI.....................152
10. Factory Test Mode .....................154
4. TROUBLE SHOOTING ...................73
4.1 RF Component.......................................73
4.2 SIGNAL PATH_UMTS RF .....................75
4.3 SIGNAL PATH_GSM RF .......................76
4.4 Checking VC-TCXO Block .....................77
4.5 Checking Front-End Module Block ........79
4.6 Checking UMTS Block ...........................81
4.7 Checking GSM Block .............................86
4.8 Checking Bluetooth Block ......................92
4.9 Power ON Troubleshooting....................94
4.10 Charger Troubleshooting .....................96
4.11 USB Troubleshooting...........................99
4.12 SIM Detect Troubleshooting ..............100
4.13 Camera Troubleshooting ...................102
4.14 Keypad Backlight Troubleshooting ....105
4.15 Main LCD Troubleshooting ................106
-3-
10.1. Test Program Setting ........................154
10.2. WCDMA Test Mode ..........................155
10.3. GSM Test Mode................................156
11. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 157
11.1 EXPLODED VIEW ............................ 157
11.2 Replacement Parts
<Mechanic component>.................... 159
<Main component> ........................... 161
11.3 Accessory ......................................... 174
-4-
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of commoncarrier
telecommunication service of facilities accessed through or connected to it. The manufacturer will not
be responsible for any charges that resultfrom such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net
work, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
-5-
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the
Following information is ESD handling:
sign.
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
-6-
2. PERFORMANCE
2. PERFORMANCE
2.1 System Overview
Item
Shape
Size
Specification
GSM900/1800/1900 and WCDMA2100 - Bar type Handset
110.9 X 46.7 X 15.6 mm
Weight
Under 83 g (with 950mAh Battery)
Power
3.7 V normal, 950 mAh Li-Ion
Talk Time
Over 200 min (WCDMA, Tx=12 dBm, Voice)
(with 950mAh)
Over 180 min (GSM, Max Tx Power, Voice)
Standby Time
Over 350 Hrs (WCDMA, DRX=1.28)
(with 950mAh)
Over 450 Hrs (GSM, Paging period=9)
Antenna
LCD
LCD Backlight
Internal type
Main 1.76” TFT, QCIF, 262K
White LED Back Light
Camera
1.3 Mega pixel + VGA Video Call Camera
Vibrator
Yes ( Cylinder Type)
LED Indicator
No
MIC
Yes
Receiver
Yes
Earphone Jack
Yes (18 pin)
Connectivity
Bluetooth, USB
External Memory
Yes(Micro SD)
I/O Connect
18 Pin
-7-
2. PERFORMANCE
2.2 Usable environment
1) Environment
Item
Specification
Voltage
3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V]
Operation Temp
-20 ~ +60°C
Storage Temp
-20 ~ +70°C
Humidity
85 % (Max)
2) Environment (Accessory)
Reference
Spec.
Min
Typ.
Max
Unit
TA Power
Available power
100
220
240
Vac
* CLA : 12 ~ 24 V(DC)
2.3 Radio Performance
1) Transmitter - GSM Mode
No
Item
GSM
100k~1GHz
DCS & PCS
MS allocated
Channel
1G~12.75GHz
-39dBm
1G~[A]MHz
-33dBm
[A]M~[B]MHz
-39dBm
[B]M~12.75GHz
-33dBm
-33dBm
Conducted
1
9k ~ 1GHz
-39dBm
Spurious
100k~880MHz
-60dBm
100k~880MHz
-60dBm
Emission
880M~915MHz
-62dBm
880M~915MHz
-62dBm
915M~1GHz
-60dBm
915M~1GHz
-60dBm
1G~[A]MHz
-50dBm
1G~[A]MHz
-50dBm
[A]M~[B]MHz
-56dBm
[A]M~[B]MHz
-56dBm
[B]M~12.5GHz
-50dBm
[B]M~12.5GHz
-50dBm
Idle Mode
* In case of DCS : [A] -> 1710, [B] -> 1785
* In case of PCS : [A] -> 1850, [B] -> 1910
-8-
2. PERFORMANCE
No
Item
GSM
30M ~ 1GHz
DCS & PCS
MS allocated
Channel
1G ~ 4GHz
-36dBm
1G~[A]MHz
-30dBm
[A]M~[B]MHz
-36dBm
[B]M~4GHz
-30dBm
-30dBm
Radiated
2
30M~1GHz
-36dBm
Spurious
30M ~ 880MHz
-57dBm
30M~880MHz
-57dBm
Emission
880M ~ 915MHz
-59dBm
880M~915MHz
-59dBm
915M~1GHz
-57dBm
915M~1GHz
-57dBm
1G~[A]MHz
-47dBm
1G~[A]MHz
-47dBm
[A]M~[B]MHz
-53dBm
[A]M~[B]MHz
-53dBm
[B]M~4GHz
-47dBm
[B]M~4GHz
-47dBm
Idle Mode
3
Frequency Error
4
Phase Error
±0.1ppm
±0.1ppm
±5(RMS)
±5(RMS)
±20(PEAK)
±20(PEAK)
3dB below reference sensitivity 3dB below reference sensitivity
5
Frequency Error
RA250 : ±200Hz
RA250: ±250Hz
Under Multipath and
HT100 : ±100Hz
HT100: ±250Hz
Interference Condition
TU50 : ±100Hz
TU50: ±150Hz
TU3 : ±150Hz
TU1.5: ±200Hz
Due to
modulation
0 ~ 100kHz
+0.5dB
0 ~ 100kHz
+0.5dB
200kHz
-30dB
200kHz
-30dB
250kHz
-33dB
250kHz
-33dB
400kHz
-60dB
400kHz
-60dB
600 ~ 1800kHz
-66dB
600 ~ 1800kHz
-60dB
1800 ~ 3000kHz
-69dB
1800 ~ 6000kHz
-65dB
3000 ~ 6000kHz
-71dB
≥6000kHz
-73dB
≥6000kHz
-77dB
400kHz
-19dB
400kHz
-22dB
600kHz
-21dB
600kHz
-24dB
1200kHz
-21dB
1200kHz
-24dB
1800kHz
-24dB
1800kHz
-27dB
Output RF
6
Spectrum
Due to
Switching
transient
* In case of DCS : [A] -> 1710, [B] -> 1785
* In case of PCS : [A] -> 1850, [B] -> 1910
-9-
2. PERFORMANCE
No
Item
GSM
DCS & PCS
Frequency offset
800kHz
Intermodulation product should
7
Intermodulation attenuation
–
be Less than 55dB below the
level of Wanted signal
Power control Power Tolerance Power control Power Tolerance
8
9
Transmitter Output Power
Burst timing
Level
(dBm)
(dB)
Level
(dBm)
(dB)
5
33
±3
0
30
±3
6
31
±3
1
28
±3
7
29
±3
2
26
±3
8
27
±3
3
24
±3
9
25
±3
4
22
±3
10
23
±3
5
20
±3
11
21
±3
6
18
±3
12
19
±3
7
16
±3
13
17
±3
8
14
±3
14
15
±3
9
12
±4
15
13
±3
10
10
±4
16
11
±5
11
8
±4
17
9
±5
12
6
±4
18
7
±5
13
4
±4
19
5
±5
14
2
±5
15
0
±5
Mask IN
- 10 -
Mask IN
2. PERFORMANCE
2) Transmitter - WCDMA Mode
No
Item
Specification
1
Maximum Output Power
Class 3 : +24dBm(+1/-3dB)
2
Frequency Error
±0.1ppm
3
Open Loop Power control in uplink
±9dB@normal, ±12dB@extreme
Adjust output(TPC command)
4
Inner Loop Power control in uplink
cmd
1dB
2dB
3dB
+1
+0.5/1.5
+1/3
+1.5/4.5
0
-0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1
-0.5/-1.5
-1/-3
-1.5/-4.5
Group (10 equel command group)
+1
5
Minimum Output Power
+8/+12
+16/+24
-50dBm(3.84MHz)
Qin/Qout : PCCH quality levels
6
Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB
Ton@DPCCH/Ior : -24 -> -18dB
7
Transmit OFF Power
8
Transmit ON/OFF Time Mask
-56dBm(3.84MHz)
±25us
PRACH,CPCH,uplinlk compressed mode
±25us
Power varies according to the data rate
9
Change of TFC
DTX : DPCH off
(minimize interference between UE)
10
Power setting in uplink compressed
±3dB(after 14slots transmission gap)
11
Occupied Bandwidth(OBW)
5MHz(99%)
-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k
-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M
12
Spectrum emission Mask
-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M
-49dBc@∆f=8.5~12.5MHz,1M
- 11 -
2. PERFORMANCE
No
Item
Specification
33dB@5MHz, ACP>-50dBm
13
Adjacent Channel Leakage Ratio(ACLR)
43dB@10MHz, ACP>-50dBm
-36dBm@f=9~150KHz, 1K BW
-36dBm@f=50KHz~30MHz, 10K BW
-36dBm@f=30MHz~1000MHz, 100K BW
Spurious Emissions
-30dBm@f=1~12.5GHz, 1M BW
(*: additional requirement)
(*)-41dBm@f=1893.5~1919.6MHz, 300K
14
(*)-67dBm@f=925~935MHz, 100K BW
(*)-79dBm@f=935~960MHz, 100K BW
(*)-71dBm@f=1805~1880MHz, 100K BW
-31dBc@5MHz,Interferer -40dBc
15
Transmit Intermodulation
-41dBc@10MHz, Interferer -40dBc
17.5%(>-20dBm)
16
Error Vector Magnitude (EVM)
(@12.2K, 1DPDCH+1DPCCH)
-15dB@SF=4.768Kbps, Multi-code
17
Transmit OFF Power
transmission
3)Receiver - GSM Mode
No
Item
GSM
DCS & PCS
1
Sensitivity (TCH/FS Class II)
-105dBm
-105dBm
C/Ic=7dB
Storage -30 ~ +85
Co-Channel Rejection
2
(TCH/FS Class II, RBER, TU high/FH)
3
4
Adjacent Channel
200kHz
C/Ia1=-12dB
C/Ia1=-12dB
Rejection
400kHz
C/Ia2=-44dB
C/Ia2=-44dB
Wanted Signal :-98dBm 1st
Wanted Signal :-96dBm 1st
interferer:-44dBm 2nd
interferer:-44dBm 2nd
interferer:-45dBm
interferer:-44dBm
Blocking Response
Wanted Signal :-101dBm
Wanted Signal :-101dBm
(TCH/FS Class II, RBER)
Unwanted : Depend on Frequency
Unwanted : Depend on Frequency
Intermodulation Rejection
5
- 12 -
2. PERFORMANCE
4) Receiver - WCDMA Mode
No
1
Item
Specification
Reference Sensitivity Level
-106.7 dBm(3.84 MHz)
-25dBm(3.84MHz)
2
Maximum Input Level
-44dBm/3.84MHz(DPCH_Ec)
UE@+20dBm output power(Class3)
33dB
3
Adjacent Channel Selectivity (ACS)
UE@+20dBm output power(Class3)
-56dBm/3.84MHz@10MHz
4
In-band Blocking
UE@+20dBm output power(Class3)
-44dBm/3.84MHz@15MHz
UE@+20dBm output power(Class3)
-44dBm/3.84MHz@f=2050~2095 and
2185~2230MHz
UE@+20dBm output power(Class3)
-30dBm/3.84MHz@f=2025~2050 and
5
Out-band Blocking
2230~2255MHz
UE@+20dBm output power(Class3)
-15dBm/3.84MHz@f=1~2025 and
2255~12500MHz
UE@+20dBm output power(Class3)
-44dBm CW
6
Spurious Response
UE@+20dBm output power(Class3)
-46dBm CW@10MHz
7
Intermodulation Characteristic
-46dBm/3.84MHz@20MHz
UE@+20dBm output power(Class3)
-57dBm@f=9KHz~1GHz, 100K BW
8
Spurious Emissions
-47dBm@f=1~12.5GHz, 1M BW
-60dBm@f=1920MHz~1980MHz, 3.84M BW
-60dBm@f=2110MHz~2170MHz, 3.84M BW
- 13 -
2. PERFORMANCE
2.4 Current Consumption
1) U250/KU250 Current Consumption
WCDMA
GSM
Stand by
Voice Call
VT
Under 2.80 mA
Under 290 mA
Under 410mA
(DRX=1.28)
(Tx=12dBm)
(Tx=12dBm)
Under 2.12 mA
Under 320 mA
Paging=9 period
(Max Tx Power)
(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test
Condition : Speaker off, LCD backlight On)
2.5 RSSI BAR
Level Change
WCDMA
GSM
BAR 4 → 3
-85 ± 2 dBm
-90 ± 2 dBm
BAR 3 → 2
-95 ± 2 dBm
-95 ± 2 dBm
BAR 2 → 1
-106 ± 2 dBm
-100 ± 2 dBm
BAR 1 → 0
-111 ± 2 dBm
-106 ± 2 dBm
- 14 -
2. PERFORMANCE
2.6 Battery BAR
Indication
Standby
Bar 4
Over 3.83 ± 0.05V
Bar 4 → 3
3.82 ± 0.05V
Bar 3 → 2
3.73 ± 0.05V
Bar 2 → 1
3.68 ± 0.05V
Bar 1 → Empty
3.58 ± 0.05V
Low Voltage,
3.58± 0.05V (Stand-by) / 3.58 ± 0.05V (Talk)
Warning message+ Blinking
[Interval : 3min(Stand-by) / 1min(Talk)]
Power Off
3.20 ± 0.05V
- 15 -
2. PERFORMANCE
2.7 Sound Pressure Level
No
1
Test Item
Sending Loudness Rating (SLR)
2
Receiving Loudness Rating (RLR)
3
4
5
Side Tone Masking Rating (STMR)
Echo Loss (EL)
Idle Noise-Sending (INS)
6
Idle Noise-Receiving (INR)
7
Sending Loudness Rating (SLR)
8
Receiving Loudness Rating (RLR)
9
10
11
Side Tone Masking Rating (STMR)
Echo Loss (EL)
Idle Noise-Sending (INS)
12
Idle Noise-Receiving (INR)
MS
Headset
Nor
Specification
8 ±3 dB
-4 ± 3 dB
-15 ± 3 dB
17 dB
40 dB
-64 dBm0p
Under -47 dBPA
Under -36 dBPA
8±3dB
-1 ±3 dB
Max
Min
Min
Max
Nor
Max
-12 ±3 dB
25 dB
40 dB
-55 dBm0p
Under -45 dBPA
Under -40 dBPA
Max
Under -62 dBm
Nor
Max
Min
Min
Max
Nor
Max
TDMA Noise
-. GSM : Power Level : 5
DCS/PCS : Power Level : 0
(Cell Power : -90 ~ -105 dBm)
MS and
Headset
13
-. Acoustic (Max Vol.)
MS/Headset SLR : 8 ± 3dB
MS/Headset RLR : -15 ± 3dB/-12
(SLR/RLR : Mid-value setting)
2.8 Charging
• Charging Method : CC & CV (Constant Current and Constant Voltage)
• Maximum Charging Voltage : 4.2 V
• Maximum Charging Current : 700 mA
• Normal Battery Capacity : 950 mAh
• Charging Time : Max 3 hours (except for trickle charging time)
• Full charging indication current (charging icon stop current) : 80 mA
• Cut-off voltage : 3.20 V
- 16 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 General Description
The U250/KU250 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based
GSM/GPRS/UMTS. All receivers and the UMTS transmitter use the radio One1Zero-IF architecture to
eliminate intermediate frequencies, directly converting signals between RF and baseband. The quadband GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop
that translates the GMSK-modulated signal to RF.
UMTS (2100)
GSM (900, 1800, 1900)
Bluetooth
1. RTR6275 for GSM Tx
and WCDMA Tx
2. RTR6275 for GSM Rx
and WCDMA Rx
3. Bluetooth RF module
4. PM6650 for power
management
[Fig 1.1] Block diagram of RF part
1
QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.
- 17 -
3. TECHNICAL BRIEF
A generic, high-level functional block diagram of U250/KU250 is shown in Figure 1-1. One antenna
collects base station forward link signals and radiates handset reverse link signals. The antenna
connects with receive and transmit paths through a FEM(Front End Module).
The UMTS receive path each include a LNA, a RF band-pass filter, and a downconverter that translate
the signal directly from RF-to-baseband using radioOne ZIF technique. The RFIC Rx analog baseband
outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs
share the same inputs to the MSM IC.
For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSM
device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The
RTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then
amplified by their respective UMTS PA. The high- and low-band UMTS RF transmit signals emerge
from the RTR6275 transceiver.
In the GSM receive paths, the received RF signals are applied through their band-pass filters and
down-converted directly to baseband in the RTR6275 transceiver IC. These baseband outputs are
shared with the UMTS receiver and routed to the MSM IC for further signal processing.
The GSM transmit paths employ one stage of up-conversion and, in order to improve efficiency.
1. The on-chip quadrature up-converter translates the GMSK-modulated signal to a constant envelope
phase signal at RF;
2. The amplitude-modulated (AM) component is applied to the ramping control pin of power amplifier
from a DAC within the MSM
U250/KU250 power supply voltages are managed and regulated by the PM6650 Power Management
IC. This versatile device integrates all wireless handset power management, general housekeeping,
and user interface support functions into a single mixed signal IC. It monitors and controls the external
power source and coordinates battery recharging while maintaining the handset supply voltages using
low dropout, programmable regulators.
The device’s general housekeeping functions include an ADC and analog multiplexer circuit for
monitoring on-chip voltage sources, charging status, and current flow, as well as userdefined off-chip
variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter
circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout
and crystal oscillator signal presence are monitored to protect against detrimental conditions.
- 18 -
3. TECHNICAL BRIEF
3.2 GSM Mode
3.2.1 GSM Receiver
The Dual-mode U250/KU250’s receiver functions are split among the three RFIC’s as follows:
• GSM-900, DCS-1800, and PCS-1900 UMTS-2100 modes use the RTR6275 IC only. Each mode has
independent front-end circuits and down-converters, but they share common baseband circuits (with
only one mode active at a time). All receiver control functions are beginning with SBI2-controlled
parameters.
RF Front end consists of antenna, antenna switch module(D5011) which includes three RX saw
filters(GSM900, DCS and PCS). The antenna switch module allows multiple operating bands and
modes to share the same antenna. In U250/KU250, a common antenna connects to one of six paths:
1) UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800 Tx, PCS1900 Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx. UMTS operation requires
simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that
separates receive and transmit signals. The GSM900, DCS, and PCS operation is time division
duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not
required.
GSM 1800 / GSM1900 RX
GSM 900 RX
GSM 900 TX / WCDMA
GSM 1800 / GSM 1900 TX
[Table 1.1] Antenna Switch Module Control logic
2
The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application
Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS
Software documentation for details.
- 19 -
3. TECHNICAL BRIEF
The GSM900, DCS, and PCS receiver inputs of RTR6275 are connected directly to the transceiver
front-end circuits(filters and antenna switch module). The GSM900, DCS, and PCS receiver inputs use
differential configurations to improve common-mode rejection and second-order non-linearity
performance. The balance between the complementary signals is critical and must be maintained from
the RF filter outputs all the way into the IC pins
Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or
transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers this is accomplished in the switch module.
The GSM900, DCS, and PCS receive signals are routed to the RTR6275 through band selection filters
and matching networks that transform single-ended 50-Ω sources to differential impedances optimized
for gain and noise figure. The RTR input uses a differential configuration to improve second-order intermodulation and common mode rejection performance. The RTR6275 input stages include MSMcontrolled gain adjustments that maximize receiver dynamic range.
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters.
The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q)
having passband and stopband characteristics suitable for GMSK processing. These filter circuits
include DC offset corrections. The filter outputs are buffered and passed on to the MSM6245 IC for
further processing (an interface shared with the RFR6275 UMTS receiver outputs).
- 20 -
3. TECHNICAL BRIEF
[Fig 1.2] RTR6275 RX feature
- 21 -
3. TECHNICAL BRIEF
3.2.2 GSM Transmitter
The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT)include on-chip output matching
inductors. The 50ohm output impedance is achieved by adding a series capacitor at the output pins.
The capacitor value may be optimized for specific applications and PCB characteristics based on passband symmetry about the band center frequency, the suggested starting value is shown in Figure1.3.
6pF
51Ω
91Ω
12pF
100 Ω
91Ω
39 Ω
100 Ω
[Fig 1.3] GSM Transmitter matching
The RTR6275 IC is able to support GSM 900 and GSM 1800/1900 mode transmitting. This design
guideline shows a tri-band GSM application.
Both high-band and low band outputs are followed by resistive pads to ensure that the load presented
to the outputs remains close to 50ohm. The low-band GSM Tx path also includes a Tx-band SAW filter
to remove noise-spurious components and noise that would be amplified by the PA and appear in the
GSM Rx band
- 22 -
3. TECHNICAL BRIEF
3.3 UMTS Mode
3.3.1 Receiver
The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx
input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides
differential downconverter. This second stage input is configured differentially to optimize second-order
intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and
the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic
range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RFtobaseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass
filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter
circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with
GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6275 is
downconverting GSM signals and on when the UMTS is operating.
3.3.2 Transmitter
The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These
analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The upconverter output is amplified by multiple variable gain stages that provide transmit AGC control. The
AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated
matching inductor that simplifies the external matching network to a single series capacitor to achieve
the desired 50-Ω interface.
The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly
high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer
to the antenna through the switch module. The transceiver LO synthesizer is contained within the
RTR6275 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides
a simplified design for multimode applications. The PLL circuits include a reference divider, phase
detector, charge pump, feedback divider, and digital logic generator.
UMTS Tx using PLL1, the LO generation and distribution circuits create the necessary LO signals for
different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the
signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6275 IC design
achieves this without allowing FVCO to equal FRF.
The RTR6275 IC is able to support UMTS 2100/1900 and UMTS 850 mode transmitting. This design
guideline shows only UMTS 2100 applications.
- 23 -
3. TECHNICAL BRIEF
WCDMA_2100_TX
WCDMA_2100_RX
[Figure 1.4] RTR6275 IC functional block diagram
- 24 -
3. TECHNICAL BRIEF
3.4 LO generation and distribution circuits
The integrated LO generation and distribution circuits are driven by internal VCOs to support various
modes to yield highly flexible quadrature LO outputs that drive all GSM and UMTS band upconverters
and downconverters; with the help of these LO generation and distribution circuits, zero-IF architecture
is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from
RF to baseband and from baseband to RF.
Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the
RTR6275 IC. The first synthesizer (PLL1) creates the transceiver LOs that support the UMTS
2100/1900/1800 transmitter, and all four GSM band receivers and transmitters including: GSM 850,
GSM 900, GSM 1800, and GSM 1900. The second synthesizer (PLL2) provides the LO for the UMTS
2100/1900/1800 receiver. An external TCXO input signal is required to provide the synthesizer
frequency reference to which the PLL is phase and frequency locked. The RTR6275 IC integrates
most of PLL loop filter components on-chip except two off-chip loop filter series capacitors, and
significantly reduces off-chip component requirement. With the integrated fractional-N PLL
synthesizers, the RTR6275 has the advantages of more flexible loop bandwidth control, fast lock time,
and low-integrated phase error
3.5 Off-chip RF Components
3.5.1 WCDMA PAM (U103: WS2512-TR1G)
The UMTS PA output power is monitored by l power detector circuits(U100 : RTR6275) .
This detector voltage can be used for transmitter calibration and monitor to meet RF system
WCDMA
Rev_1.0
C154
1.5p
Rev.D
+VPWR
+VPWR
C155
4.7u
L404
1.8nH
FL104
9
L123
1nH
Rev_1.0
C162
8
GND4
RFOUT
C157
10nH
L122
NA
RFIN
GND1
IN
3
U103
VCC1
FL102
5 EFCH1950TDF1
O1 G3
1
G2 G1
2
1
2
3
2
3.3p
VCONT
VREF
4
PA_R0
5
1
TR100
KRX102U
U102
PA_ON
CP0402A1950DNTR
3
Rev.B
4
51R119
2
20dB
C165
1p
7
GND3
6
GND2
11
BGND
5
OUT
50OHM
4
C164
0.5p
IN
1
1
2
COUP
RX
TX
ACMD-7602
3
PGND
ANT
4
C159
15p
WS2512_TR1G
10
VCC2
4
3
0.5p
L125
C158
15p
VREG_TCXO_2.85V
PWR_DET
R120
R121
47
130
7dB
C192
100p
R122
130
[Figure 1.5] WCDMA PAM, Duplexer, Coupler
- 25 -
C170
0.1u
3. TECHNICAL BRIEF
3.5.2 VCTCXO (X100 : DSA321SCE-19.2M)
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the
reference frequency for all RFIC synthesizers as well as clock generation functions within the
MSM6245 IC. The oscillator frequency is controlled by the MSM6245 IC.
TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control
TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line.
The PM6650 IC controls the handset power-up sequence, including a special VCTCXO warm-up
interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller
functions) is enabled by the MSM TCXO_EN line . The PM6650 IC VREG_TCXO regulated output
voltage is used to power the VCTCXO and is enabled before most other regulated outputs.
Any GSM mode power control circuits within the MSM6245 IC require a reference voltage for proper
operation and sufficient accuracy. Connecting the PM6650 IC REF_OUT directly to the MSM6245 IC
GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 •ÏF low
frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both
sides, plus ground above and below if routed on internal layers.
3.5.3 Front-End Module (U500 : D5011)
This equipment uses a single antenna to support all handset operating modes, with an antenna switch
module select the operating frequency and band. UMTS operation requires simultaneous reception
and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and
transmit signals. The active connection is MSM-selected by three control lines (GPIO[9], GPIO[10]).
Two GPIO are programmed to be ANT_SEL0_N, ANT_SEL1_N) respectively.
GSM 1800 / GSM1900 RX
GSM 900 RX
GSM 900 TX / WCDMA
GSM 1800 / GSM 1900 TX
[Table 1.2] Front End Module control logic
- 26 -
3. TECHNICAL BRIEF
3.5.4 PMIC Functional Block Diagram (U300 : PM6650-2M)
• Input power management
- Valid external supply attachment and removal detection
- Supports unregulated (closed-loop) external charger supplies and USB supplies as input power
sources
- Supports lithium-ion main batteries
- Trickle, constant current, constant voltage, and pulsed charging of the main battery
- Supports coin cell backup battery (including charging)
- Battery voltage detectors with programmable thresholds
- VDD collapse protection
- Charger current regulation and real-time monitoring for over-current protection
- Charger transistor protection by power limit control
- Control drivers for two external pass transistors and one external battery MOSFET - MOSFET is
optional
- Voltage, current, and power control loops
- Automated recovery from sudden momentary power loss
• Output voltage regulation
- One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hosting
USBOTG
- Three buck (step-down) switched-mode power supplies that efficiently generate MSMC, MSME,
and PA (or second MSMC) supply voltages
- Supports dynamic voltage scaling (DVS) for MSMC and PA
- Eleven low dropout regulator circuits with programmable output voltages, implemented using three
different current ratings: 300 mA (two), 150 mA (six), and 50 mA (three). These can be used to
power MSMA, MSMP, RFRX1, RFRX2, RFTX, SYNT, TCXO, WLAN, MMC, USB, and RUIM
circuits.
- All regulators can be individually enabled/disabled for power savings
- Low power mode available on MSMA and MSMP regulators
- All regulated outputs are derived from a common bandgap reference-close tracking
• Integrated handset-level housekeeping functions reduces external parts count, size, cost
- Analog multiplexer selects from 8 internal and up to 18 external inputs
- Multiplexer output’s offset and gain are adjusted, increasing the effective ADC resolution
- Adjusted multiplexer output is buffered and routed to an MSM device ADC
- Dual oscillators - 32.768 kHz off-chip crystal and on-chip RC assures MSM device sleep clock
- Crystal oscillator detector and automated switch-over upon lost oscillation
- Real time clock for tracking time and generating associated alarms
- On-chip adjustments minimize crystal oscillator frequency errors
- Circuits control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal
- TCXO buffer control for optimal QPH/catnap timing
- Three-stage over-temperature protection (smart thermal control)
- 27 -
3. TECHNICAL BRIEF
• Integrated handset-level user interfaces
- Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash,
and general-purpose drivers
- Vibration motor driver programmable from 1.2 to 3.1V in 100 mV increments
- Speaker driver with programmable gain, turn-on time, and muting; differential operation (drives
external 8 Ω speakers with volume controlled 500 mW)
• IC-level interfaces
- MSM device-compatible 3-line SBI for efficient initialization, status, and control
- Supports the MSM device’s interrupt processing with an internal interrupt manager
- Many functions monitored and reported through real-time and interrupt status signals
- Dedicated circuits for controlled power-on sequencing, including the MSM device’s reset signal
- Several events continuously monitored for triggering power-on/power-off sequences
- Supports and orchestrates soft resets
- USB-OTG transceiver for full-speed (12 Mb/s) and low speed (1.5 Mb/s) interfacing of the MSM
device to computers as a USB peripheral, or connecting the MSM device to other peripherals RUIM level translators enable MSM device interfacing with external modules
• Twelve multi-purpose pins that can be configured as digital or analog I/Os, bi-directional I/Os, or
current sinks. Default functions support the RUIM level translators, power-on circuits, analog
multiplexer inputs, an LED driver, and a reference voltage buffer.
• Highly integrated functionality in a small package - 84-pin BCCS with a large center slug for electrical
ground, mechanical stability, and thermal relief
[Figure 1.6] MSM6245 Interface
- 28 -
3. TECHNICAL BRIEF
[Figure1.7] PM6650 Block Diagram
- 29 -
3. TECHNICAL BRIEF
3.5.5 GSM PAM (U101 : SKY77318)
GSM_PA_RA
The SKY77318 is an extremely small (6 x 6 mm), GSM PAM for handset applications. This module
has been optimized for excellent efficiency and Pout while maintaining high GSM/GPRS efficiency.
The small size and high performance is achieved with high-reliability GaAs HBT technology.
With 50Ω and output, no external matching or bias components are required. The module incorporates
two highly-integrated GaAs power amplifier die with a BiCMOS controller.
Each amplifier has three gain stages with on-die inter-stage matching implemented with a high Q
passives technology for optimal performance. The CMOS controller implements a fully integrated
power control within the module for GSM operations, and serves as the GPRS operations. This
eliminates the need for any external couplers, power detectors, current sensing etc., to assure the
output power level. The module has Tx enable and band select inputs. Module construction is a lowprofile overmolded land-grid array on laminate.
L406
8.86dB Rev.1.0
C136
0.01u
C139
68p
91 R111
91 R110
ENABLE
RSVD_GND
P_GND
2
6
U101
EGSM_IN
SKY77318
BS
3
7.5dB
4
5
O1 G3
IN
G2 G1
4
R113
18
100ohm
GSM_PA_EN
C149
15p
1
3
R112
1
GSM_TX
2
EFCH897MTDB1
R117 100ohm
GSM_PA_BAND
C153
15p
GSM_PA_BAND
LOW
HIGH
[Figure 1. 8] GSM PAM Schematic
- 30 -
MODE
GSM
DCS/PCS
39
R115
21
FL101
DCS_PCS_IN
100ohm
19
EGSM_OUT
DCS_PCS_TX
R114
11
DCS_PCS_OUT
VCC1A
17
VAPC
15
R108
51
20
C138
NA
2.7nH
C134
0.01u
C438
100p
GND9
GND8
GND7
GND6
GND5
GND4
GND3
GND2
GND1
C137
NA
C121
33u
16
14
13
12
10
9
8
7
5
C441
5.6p
C123
0.01u
L111
5.6nH
NA
R107
100ohm
L116
10nH
VCC1B
L403
1.5nH
VBATT
C124
100p
L115
18nH
EGSM
+VPWR
100ohm
Rev.D
3. TECHNICAL BRIEF
3.5.6 UMTS Duplexer(FL104:ACMD-7602)
A UMTS duplexer splits a single operating band into receive and transmit paths. Important
performance requirements include;
• Insertion loss. this component is also in the receive and transmit paths ; In the U250/KU250 typical
losses : UMTS2100_ Tx = 1.2 dB, UMTS2100_ Rx = 1.4 dB
• Out-of-band rejection or attenuation. the duplexer provides input selectivity for the receiver, output
filtering for the transmitter, and isolation between the two. Rejection levels for both paths are
specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver
performance:
• Rx-band isolation. the transmitter is specified for out-of-band noise falling into the Rx band. This
noise leaks from the transmit path into the receive path, and must be limited to avoid degrading
receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and
Rx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 51 dB.
• Tx-band isolation. the transmit channel power also leaks into the receiver. In this case, the leakage is
outside the receiver passband but at a relatively high level. It combines with Rx band jammers to
create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band
isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimum
duplexer Tx-band isolation value is about 58dB.
• Passband ripple. the loss of this fairly narrowband device is not flat across its passband. Passband
ripple increases the receive or transmit insertion loss at specific frequencies, creating performance
variations across the band.s channels, and should be controlled.
• Return loss. minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).
• Power handling. high power levels in the transmit path must be accommodated without degraded
performance. The specified level depends on the operating band class and mobile station class (per
the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics
depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be
used between the UMTS PA and duplexer to assure proper performance.
- 31 -
3. TECHNICAL BRIEF
3.5.7 UMTS Rx RF filter (FL103 : EFCH2140TDE1)
• Frequency range : 2110 ~ 2170MHz
An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as
critical as losses before the LNA. The most important parameters of this component include:
• Out-of-band rejection or attenuation levels, usually specified to meet these conditions:
- FFar out-of-band signals - ranging from DC up to the first band of particular concern and from the
last band of particular concern to beyond three times the highest passband frequency.
- Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still
presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must
provide rejection of this Tx-band leakage.
- Other frequencies of particular concern . bands known to include other wireless transmitters that
may deliver significant power levels to the receiver input.
Table 1.3 WCDMA Rx SAW Filter Specification
- 32 -
3. TECHNICAL BRIEF
3.5.8 Bluetooth (M100 : LBRQ-2B43A)
The MSM6245 includes BT baseband embedded BT 1.1 compliant baseband core, so the other
bluetooth components are an bluetooth RF module and Antenna. Figure1.9 shows the bluetooth
system architecture in the U250/KU250.
MSM6245
Bluetooth
baseband
[Figure1.9] Bluetooth system architecture
- 33 -
3. TECHNICAL BRIEF
3. BB Technical Description
3.6 Digital Baseband(DBB/MSM6245)
3.6.1 General Description
A. Features(MSM6245)
• Support for multimode operation - tri-band WCDMA (UMTS), quad-band GSM/GPRS/EDGE
• Support for WCDMA (UMTS) uplink data rate up to 384 kbps
• High-performance ARM926EJ-S running at up to 225 MHz
• ARM Jazelle Java hardware acceleration for faster Java-based games and other applets
• QDSP4000 high-performance DSP cores
• Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals
• Qcamera™ with 30 fps QCIF viewfinder resolution, and support for 2 MP camera sensors
• Direct interface to digital camera module with video front end (VFE) image processing
• True 3D graphics for advanced wireless gaming
• SecureMSM v2.0 includes support for Open Mobile Alliance (OMA) DRM v2.0, SIM-lock and IMEI
integrity. Support for Q-fuse. Only trusted boot is supported
• Audio that is on par with portable music players
• Vocoder support (AMR, FR, EFR, HR)
• Advanced 14 x 14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology
• SD/SDIO hardware support
- 34 -
3. TECHNICAL BRIEF
USB
PM6650
-2M
Bluetooth
RF Module
SPK/RCV
VCTCXO
GSM Block
MIC
GSM
PAM
GSM
TX SAW
GSM900 Tx
GSM1800/1900 Tx
GSM900 Rx
GSM
VCO
MAIN LCD
GSM1800 Rx
GSM1900 Rx
MSM6245
Front
End
Module
WCDMA Block
1.3M CAM
VGA CAM
RTR6275
COUPLER
WCDMA
PAM
WCDMA
TX SAW
U-SIM
HDET
WCDMA2100 Tx
Duplexer
WCDMA2100 Rx
WCDMA
VCO
WCDMA
RX SAW
NAND, SDRAM
FLASH
KEYPAD
AntSW Logic
Figure 1.10 Simplified Block Diagram
- 35 -
3. TECHNICAL BRIEF
3.7 Block Diagram(MSM6245)
NAND Flash
512Mbit
SDRAM
512Mbit
MSM6245
UMTS, WCDMA
Modem QDSP 4000
Open GL ES
3D, 2D
BT 1.2
processor
PLL
VIDEO
ARM 926ejs
With Jazelle
QDSP 4000
I/O Conn
UART2 / RUIM1
UART1
MP3, AAC,
EVRC, QCELP
AMR, CMX, MIDI
USB
AUDIO
Keypad I/F
CONNECTIVITY
PM6650
US B
Figure 1.11 Simplified Block Diagram of MSM6245
- 36 -
UART3 / PMIC SBI
MPEG-4
H.263, H.264
GSM/GPRS/EDGE
processor
DUAL MEMORY BUS
GRAPHICS
VGA camera
EBI 2
JTAG
Camera 1.3M
EBI 1
CAMERA
PROCESSING
(Default 8bit
Interface)
LCD
(1.76inch)
GPIO
RF SBI
Rx ADC
Tx DAC
USIM
3. TECHNICAL BRIEF
3.8 Subsystem(MSM6245)
3.8.1. ARM Microprocessor Subsystem
The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor,
through the system software, controls most of the functionality for the MSM, including control of the
external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a Generic
single-wire serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the
RTR6275, RFR6275 and PM6650 devices.
3.8.2. WCDMA R99 features
The MSM6245 device supports release 99 June 2004 of the W-CDMA FDD standard, including the
following features:
■ All modes and data rates for W-CDMA frequency division duplex (FDD), with the following
restrictions:
❏ The downlink supports the following specifications:
- Up to four physical channels, including the broadcast channel (BCH), if present
- Up to three dedicated physical channels (DPCHs)
- Spreading factor (SF) range support from 4 to 256
- The following transmit diversity modes are supported:
❏ Space time transmit diversity (STTD)
❏ Time-switched transmit diversity (TSTD)
❏ Closed-loop feedback transmit diversity (CLTD)
■ The uplink supports the following specifications:
❏ The uplink provides the following UE support:
- One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary
- A maximum data rate of 384 kbps
❏ Full SF range support from 4 to 256
■ SMS (CS and PS)
■ PS data rate - 384 kbps DL / 384 kbps UL
■ CS data rate - 64 kbps DL / 64 kbps UL
■ AMR (all rates)
- 37 -
3. TECHNICAL BRIEF
3.8.3. GSM features
The following GSM modes and data rates are supported by the MSM6245 device hardware. Support
modes conform to release '99 specifications of the sub-feature.
■ Voice features
❏ FR
❏ EFR
❏ AMR
❏ HR
❏ A5/1, A5/2, and A5/3 ciphering
■ Circuit-switched data features
❏ 9.6k
❏ 14.4k
❏ Fax
❏ Transparent and non-transparent modes for CS data and fax
❏ No sub-rates are supported.
3.8.4. GPRS features
■ Packet switched data (GPRS)
❏ DTM (Simple Class A) operation
❏ Multi-slot class 12 data services
❏ CS schemes: CS1, CS2, CS3, and CS4
❏ GEA1, GEA2, and GEA3 ciphering
■ Maximum of four Rx timeslots per frame
3.8.5. EDGE features
■ EDGE E2 power class for 8 PSK
■ DTM (simple Class A), multi-slot class 12
■ Downlink coding schemes - CS 1-4, MCS 1-9
■ Uplink coding schemes - CS 1-4, MCS 1-9
■ BEP reporting
■ SRB loopback and test mode B
■ 8-bit, 11-bit RACH
■ PBCCH support
■ 1 phase/2 phase access procedures
■ Link adaptation and IR
■ NACC, extended UL TBF.
- 38 -
3. TECHNICAL BRIEF
3.8.6. MSM6245 device audio processing features
■ Integrated wideband stereo CODEC
❏ 16-bit DAC with typical 88 dB dynamic range
❏ Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path
■ VR- Voice mail + voice memo
■ Acoustic echo cancellation
■ Audio AGC
■ Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8
(G2)
■ Internal vocoder supporting AMR, FR, EFR, and HR
3.8.7. MSM6245 microprocessor subsystem
■ Industry standard ARM926EJ-S embedded microprocessor subsystem
❏ 16 kB instruction and 16 kB data cache
❏ Instruction set compatible with ARM7TDMI®
❏ ARM version 5TEJ instructions
❏ Higher performance 5 stage pipeline, Harvard cached architecture
❏ Higher internal CPU clock rate with on-chip cache
■ Java hardware acceleration
■ Enhanced memory support
❏ 75 MHz and 90 MHz bus clock for SDRAM
❏ 32-bit SDRAM
❏ Dual memory buses separating the high-speed memory subsystem (EBI1) from low-speed
peripherals (EBI2) such as LCD panels
❏ 1.8 memory interface support for EBI1 and 1.8 V or 2.6 V memory interface support EBI2
❏ NAND FLASH memory interface
- 8/16-bit data I/O width NAND flash support
- 1- or 4-bit ECC
- 512-byte/2KB page-size support
- 2 chip selects supported for NAND Flash
❏ Boot from NAND
❏ Low-power SDRAM (LP-SDRAM) interface
■ Internal watchdog and sleep timers
3.8.8. Supported interface features
■ USB On-the-Go core supports both slave and host functionality
■ Three universal asynchronous receiver transmitter (UART) serial ports
■ USIM controller (via UART)
■ Integrated 4-bit secure digital (SD) controller for SD and Mini SD cards
■ Parallel LCD interface
■ General-purpose I/O pins
■ External keypad interface
- 39 -
3. TECHNICAL BRIEF
3.8.9. Supported multimedia features
■ Provide additional general purpose MIPS by using:
❏ Two QDSP4000s
❏ Dedicated hardware accelerators and compression engines
■ Improve Java, BREW, and game performance
❏ Integrated Java and 2D/3D graphics accelerator with Sprite engine
■ Enable various accessories via USB host connectivity.
❏ Integrated USB host controller functionality
■ Enable compelling visual and audio applications.
QcameraTM
■ High-quality digital camera processing, supporting CCD or CMOS image sensors up to 2MP
■ 30 fps QCIF viewfinder
QtvTM
■ Audio and video decoder that supports VOD, MOD and Broadcast multimedia services.
■ Audio codecs supported: AMR-NB, AMR-WB, AMR-WB+, AAC, AAC Plus, Enhanced AAC Plus,
Windows® Media Audio v9, RealAudio® v8
■ Integrated stereo wideband codec for music/digital clips
■ CMX
■ Video codecs supported: MPEG-4, H.263, H.264, Windows Media® v9 and RealNetworks® v10
Video telephony services: QvideophoneTM
■ A two-way mobile video conferencing solution that delivers 15 fps @ QCIF, 64kbps
■ Video codecs supported: MPEG-4 and H.263
■ Audio codecs supported: AMR-NB.
QcamcorderTM
■ Real time mobile video encoder
■ Video codecs supported: MPEG-4, H.263.H.264
■ Audio codecs supported: AMR-NB
■ Recording performance: 15 fps @ QCIF, 192 kbps
CMXTM (MIDI and still image, animation, text, LED/vibrate support)
■ 72 simultaneous polyphonic tones
■ 44 kHz sampling rate
■ 512 kB wave table
■ Support of universal file formats
❏ Standard MIDI Format (SMF)
❏ SP-MIDI
❏ SMAF Audio playback (MA-2, MA-3, MA-5)
❏ XMF/OLS
❏ MFi (requires Docomo license)
- 40 -
3. TECHNICAL BRIEF
■ PNG decoder
■ Pitch bend range support
■ LED/vibrate support
■ Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2)
■ MLZ decoder
■ Integrated PNG/SAF A.T.
Table 1-1 Summary of MSM6245 device features
Note:
1. At this time, only 32-bit SDRAM is supported on the MSM6245 device. There are potential MIPS
issues when running Bluetooth and video telephony concurrently with any other memory configuration.
16-bit SDRAM and NOR FLASH are currently being evaluated and documentation will be updated
accrdingly in the next revision.
- 41 -
3. TECHNICAL BRIEF
Table 1-2 Description of RF configurations
- 42 -
3. TECHNICAL BRIEF
3.8.10. Stereo Wideband CODEC
The MSM6245 device integrates a wideband voice/audio CODEC into the mobile station modem
(MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one
single-ended earphone output, and a differential analog auxiliary interface.
The CODEC integrates the microphone and earphone amplifiers into the MSM6245 device, reducing
the external component count to just a few passive components.
The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set
externally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission
systems.
3.8.11. Vocoder Subsystem
The MSM6245 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has
modules to support DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx
automatic gain control (AGC), Rx Automatic Volume Control (AVC), ear seal echo canceller (ESEC),
Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR,
Tx/Rx compensation filters. The MSM6245 device’s integrated ARM9TDMI processor downloads the
firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.
3.8.12. ARM Microprocessor subsystem
The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor,
through the system software, controls most of the functionality for the MSM device, including control of
the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a
generic single serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of
the RFR6275, RTR6275, and PM6650 devices.
3.8.13. Mode Select and JTAG Interfaces
The mode pins to the MSM6245 device determine the overall operating mode of the ASIC. The options
under the control of the mode inputs are Native mode, which is the normal subscriber unit operation,
ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM6245
device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used
to test digital interconnects between devices within the mobile station during manufacture.
- 43 -
3. TECHNICAL BRIEF
3.8.14. General-Purpose Input/Output Interface
The MSM62450 device has general-purpose bidirectional input/output pins. Some of the GPIO pins
have alternate functions supported on them. The alternate functions include USB interface, additional
RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function
of these pins is documented in the various software releases.
3.8.15. UART
The MSM6245 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3
share multiplexed pins.
3.8.16. USB
The MSM6245 device integrates a universal serial bus (USB) controller that supports both
unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral
communicating with the USB host. MSM6245 supports the 3-wire functionality.
- 44 -
3. TECHNICAL BRIEF
3.9 Power Block
3.9.1. General
MSM6245, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of
MSM6245, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are :
3.9.2. PM6650
The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power
management portion accepts power from all the most common sources - battery, external charger,
adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate
handset electronics. It monitors and controls the power sources, detecting which sources are applied,
verifying that they are within acceptable operational limits, and coordinates battery and coin cell
recharging while maintaining the handset electronics supply voltages.
Eight programmable output voltages are generated using low dropout voltage regulators, all derived
from a common trimmed voltage reference. A dedicated controller manages the TCXO warm-up and
signal buffering, and key parameters (under-voltage lockout and crystal oscillator signal presence) are
monitored to protect against detrimental conditions.
MSM device controls and statuses the PM6650 IC using Single Serial Bus Interface (SSBI)
supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface
circuit monitors multiple trigger events and controls the power-on sequence.
- 45 -
3. TECHNICAL BRIEF
Figure 1.12 PM6650 Functional Block Diagram
- 46 -
3. TECHNICAL BRIEF
3.9.3. Charging control
A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for
the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this
pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or
not. For additional accuracy or to capture variations over time, this voltage is routed internally to the
housekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER and
ICHARGE pins to determine which supply should be used and when to switch between the two
supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the
pass transistor respectively.
4.2V~3.82V
100~70 (%)
3.81V~3.74V
69~45 (%)
3.73V~3.69V
44~20 (%)
3.68V~3.59V
19~3 (%)
3.58V~3.20V
2~0 (%)
Figure 1.13 U250/KU250 Battery Bar Display(Stand By Condition)
- 47 -
3. TECHNICAL BRIEF
Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided
by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current
from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its
performance specified below (3.2V). The charging current is set to 80mA.
Parameter
Min
Typ
Max
Unit
Trickle Current
60
80
100
mA
- 48 -
3. TECHNICAL BRIEF
Constant Current Charging
The PM6650 IC supports constant current charging of the main battery by controlling the charger pass
transistor and the battery transistor. The constant current charging continues until the battery reaches
its target voltage, 4.2V.
Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of
constant voltage charging is commonly detected 10% of the full charging current.
• Charging Method : CC & CV (Constant Current & Constant Voltage)
• Maximum Charging Voltage : 4.2V
• Maximum Charging Current : 600mA
• Nominal Battery Capacity : 950mAh
• Charger Voltage : 5.1V
• Charging time : Max 3h (Except time trickle charging)
• Full charge indication current (icon stop current) : 100mA
• Low battery POP UP : Idle - 3.58V, Dedicated(GSM/WCDMA) - 3.58V
• Low battery alarm interval : Idle - 3 min, Dedicated - 1min
• Cut-off voltage : 3.20V
- 49 -
3. TECHNICAL BRIEF
3.10 External memory interface
The MSM6245 device was designed to provide two distinct memory interfaces. EBI1 was targeted for
supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower
asynchronous devices such as LCD, NAND flash, SDRAM, etc.
• EBI1 Features
- 16 bit static and dynamic memory interface
- 32 bit dynamic memory interface
- 24 bits of address for static memory devices which can support up to 32MBytes on each chip select
- Synchronous burst memories supported (burst NOR, burst PSRAM)
- Synchronous DRAM memories supported
- Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses
- Pseudo SRAM (PSRAM) memory support
• EBI2 Features
- Support for asynchronous FLASH and SRAM(16bit & 8bit).
- Interface support for byte addressable 16bit devices (UB_N & LB_N signals).
- Support for 8 bit/16bit wide NAND flash.
- Support for parallel LCD interfaces, port mapped of memory mapped(18 or 16 bit).
• 512Mb NAND(8bit) flash memory + 512Mb SDRAM (32bit)
Interface Spec
Device
Part Name
Maker
Read Access Time
Write Access Time
FLASH
HYC0UEH0MF3P
hynix
60 ns
60 ns
SDRAM
HYC0UEH0MF3P
hynix
7 ns
7 ns
Table#1. External memory interface
- 50 -
3. TECHNICAL BRIEF
EBI1
EBI2
ADDRESS[14:0]
NAND_CS*
DATA[31:0]
NAND_RE*
NAND_WE*
WE*
SDRAM
CS*
512Mb
CAS*
NAND_CLE
NAND
NAND_WP*
512Mb
RAS*
NAND_ALE
(64MB)
CLK_EN
NAND_READY
CLK
DATA[7:0]
MSM6245
DQM[3:0]
Figure 1.14 Simplified Block Diagram of Memory Interface
- 51 -
3. TECHNICAL BRIEF
3.11 H/W Sub System
3.11.1. RF Interface
A. RTR6275(WCDMA_Tx, GSM_Tx/Rx)
MSM6245 controls RF part(RTR6275) using these signals.
• SBST : SSBI I/F signals for control Sub-chipset
• PA_ON1 : Power AMP on RF part
• RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF
• TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier
• DAC_REF : Reference input to the MSM Tx data DACs
XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77
UART3_RFR_N_GPIO87
UART2_DP_RX_DATA_GPIO89
SYNTH0_GP_PDM0_GPIO92
SBST1_GPIO93
L25
H6
F18
H18
RCV_EN_N
Close to MSM
LCD_IF_MODE_1
H13
Q_OUT_N
Q_OUT
I_OUT_N
I_OUT
DAC_REF
Q_IM_CH1
Q_IP_CH1
I_IM_CH1
I_IP_CH1
Q_IM_CH0
Q_IP_CH0
I_IM_CH0
I_IP_CH0
A12
B12
A13
B13
F12
TX_QM
TX_QP
TX_IM
TX_IP
DAC_REF
R213
C246
2K
TCXO_EN
PA_ON
33nF
TX_AGC_ADJ
L13
TRK_LO_ADJ
F19
TCXO_EN_GPIO94
F17
PA_ON0
W23
V23
RF
V25
W25
AA25
Y25
AB25
AC25
RX_QM
RX_QP
RX_IM
RX_IP
D17
GP_PDM2_PA_RAN_GE1
H17
GP_PDM1_PA_RAN_GE0
TRST_N
TCK
TMS
TDI
TDO
RTCK
AUX_PCM_CLK_GRFC14_GPIO80
AUX_PCM_DIN_GRFC13_GPIO14
AUX_PCM_DOUT_GRFC12_GPIO103
AUX_PCM_SYNC_GRFC11_GPIO102
TX_ON_GRFC10
GRFC8_GPIO11
GRFC7_GPIO10
GRFX6_GPIO9
GRFC5_AUX_SBST_GPIO8
GRFC4_AUX_SBCK_GPIO7
GRFC3_GPIO6
GRFC2_GPIO5
GRFC1_AUX_SBDT_GPIO4
GRFC0_GPIO3
BT_CLK_GPIO25
BT_SBST_GPIO24
BT_SBCK_GPIO23
BT_SBDT_GPIO22
BT_TX_RX_N_GPIO21
BT_DATA_GPIO20
PA_R0
H15
D16
F15
D15
A17
H16
K19
N21
G4
SPK_AMP_EN
J8
H12
TX_ON
B4
T23
T19
D11
ANT_SEL1
ANT_SEL0
H10
F10
D9
A8
B8
G23
F23
E26
E25
H21
R19
GSM_PA_BAND
GSM_PA_EN
BT_CLK
BT_SBST
BT_SBCK
BT_SBDT
BT_TX_RX_N
BT_DATA
Figure 1.15 Schematic of RF Interface of MSM6245
- 52 -
TX_AGC_ADJ
TRK_LO_ADJ
3. TECHNICAL BRIEF
B. the others
• TRK_LO_ADJ : TCXO(19.2M) Control
• PA_ON : WCDMA(2100) TX Power Amp Enable
• ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)
• GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp
• GSM_PA_RAMP : Power Amp Gain Control of APC_IC
• GSM_PA_EN : Power Amp Gain Control Enable of APC_IC
- 53 -
3. TECHNICAL BRIEF
3.11.2. MSM Sub System
3.11.2.1. USIM Interface
SIM interface scheme is shown in Figure.
And, there control signals are followed
• USIM_CLK : USIM Clock
• USIM_Reset : USIM Reset
• USIM_Data : USIM Data T/Rx
VREG_UIM 2.85V
USIM CLK
USIM Reset
MSM6245
USIM CLK
PM6650
USIM Data
USIM Reset
USIM
USIM Data
Figure 1.16 SIM Interface
3.11.2.2. UART Interface
UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.
GPIO_Map
Name
Note
GPIO_96
UART_RXD
Data_Rx
GPIO_95
UART_TXD
Data_Tx
Table. UART Interface
- 54 -
3. TECHNICAL BRIEF
3.11.2.3. USB
The MSM6245 device contains a Universal Serial Bus (USB) interface to provide an efficient
interconnect between the mobile phone and a personal computer (PC). The USB interface of the
MSM6245 was designed to comply with the definition of a peripheral as specified in USB Specification,
Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB
Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation,
namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the
MSM6245.
Name
Note
USB_DAT
Data to/from MSM
USB_SE0
Data to/from MSM
USB_OE_N
Out-Put Enable of Transceiver
USB_VBUS
USB_Power From Host(PC)
USB_D+
USB Data+ to Host
USB_D-
USB Data- to Host
12
USB_OE_N
15
16
17
18
19
20
21
VREG_5V
USB_OE_N
VSW_5V
USB_CTL_N
USB_VBUS
USB_DAT
USB_D_P
USB_SE0
USB_D_M
GP1_DRV_N(
2.2K
C336
4.7u
1608
22
MMC_CMD
MMC_DATA
MMC_CLK
USB_DAT
USB_SE0
USB_OE_N
PM_INT_N
PS_HOLD
14
USB_CTL_N
USB_VBUS
USB_DAT
USB_D+
USB_SE0
USB_DR309
USIM_CLK
USIM_RST_N
USIM_DATA
13
LCD DRV N
MMC_CMD_GPIO30
MMC_DATA_SDCC_DAT0_GPIO32
MMC_CLK_SDCC_CLK_GPIO31
L14
H14
M16
USB_DAT_VP
USB_SE0_VM
USB_OE_TP_N
N25
N23
N26
UART3_CTS_N_GPIO86
UART3_DP_RX_DATA_GPIO85
UART3_DP_TX_DATA_GPIO84
D6
GPIO40
D7
GPIO42
L23
M19
M21
F4
E4
G6
UART2_RFR_N_GPIO91
UART2_CTS_N_GPIO90
UART2_DP_TX_DATA_GPIO88
Table. USB Signal Interface
Figure 1.17 Schematic of USB block(MSM6245 Side & PM6650 Side)
- 55 -
3. TECHNICAL BRIEF
3.11.3 HKADC(House Keeping ADC)
The MSM6245 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to
digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF
power levels. The MSM6245 device has six analog input pins which are multiplexed to the input of the
internal HKADC.
Figure 1.18 MSM6245 HKADC Block diagram
Channel
Signal
Note
HKADC0
AMUX_OUT
RF PAM Temperature Check
HKADC1
VBATT_SENSE
Battery voltage level
HKADC2
NC
NC
HKADC3
NC
NC
HKADC4
PCB_Rev_ADC
PCB Version Check
HKADC5
Battery_THERM
Battery Temperature Check
Table. HKADC channel table
- 56 -
3. TECHNICAL BRIEF
3.11.4. Key Pad
There are 23 main key buttons in Figure.
Shows the Keypad circuit. ‘END’ Key is connected to PMIC(PM6650).
COL0
COL1
ROW(0)
COL2
COL3
COL4
-
CLR
MENU
ROW(1)
1
2
3
LEFT
UP
ROW(2)
4
5
6
OK
RIGHT
ROW(3)
7
8
9
SEND
SEARCH
ROW(4)
*
0
#
DOWN
BACK
Table. Key Matrix Mapping Table
VREG_MSMP_2.7V
100K
1
3
5
7
100K
RA400
R423
2
4
6
8
KEY MAP
CLR
MENU
LEFT
UP
OK
RIGHT
SND
SEARCH
DN
BACK
KEY_ROW(0)
400
401
402
1
2
3
403
404
405
4
5
6
406
407
408
7
8
9
HOT400
409
HOT401
HOT4
0
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
HOT3
KEY_ROW(4)
KEY_COL(0)
KEY_COL(1)
KEY_COL(2)
KEY_COL(3)
KEY_COL(4)
Figure 1.19 Main Keypad Circuit
END
END
PM_ON_SW_N
Figure 1.20 END Keypad Circuit
- 57 -
3. TECHNICAL BRIEF
3.11.5 Camera Interface
U250/KU250 Installed a 1.3M Pixel and 0.3Mega Camera. Below figure shows the camera socket type
connector and camera I/F signal.
CAMERA
PGND1
PGND2
PGND3
PGND4
PGND5
PGND6
PGND7
PGND8
32
31
30
29
28
27
26
25
MEGA CAMERA CONNECTOR
22
23
24
1
2
3
4
5
D0
D1
D2
D3
D4
D5
D6
D7
REV_1.0
CN403
R436 0
20
19
18
12
11
10
9
7
PCLK
VSYNC
HSYNC
STANDBY
SCK
SDA
RESETB
MCLK
CAM_PCLK
CAM_VSYNC_OUT
CAM_HSYNC_OUT
MEGA_CAM_PWR_DOWN
I2C_SCL
I2C_SDA
MEGA_CAM_RESET_N
CAM_MCLK
DGND1
DGND2
DGND3
AGND1
AGND2
DVDD
VDDIO
AVDD
CAM_DATA_OUT(0)
CAM_DATA_OUT(1)
CAM_DATA_OUT(2)
CAM_DATA_OUT(3)
CAM_DATA_OUT(4)
CAM_DATA_OUT(5)
CAM_DATA_OUT(6)
CAM_DATA_OUT(7)
8
15
21
6
17
13
14
16
R437 20
C414
C415
C448
C413
C449
0.1u
10p
NA
10p
NA
0.1uF
1u
C411
C412
VREG_CAM_AVDD_2.8V
VREG_CAM_DVDD_1.8V
REV_1.0
COMMON_CAM_MCLK
INOUT_B2
INOUT_A3
INOUT_B3
INOUT_A4
INOUT_B4
5
9
ICVE21184E150R500FR
CAM_DATA(3)
CAM_DATA(4)
CAM_DATA(5)
CAM_DATA_OUT(0)
CAM_DATA_OUT(1)
CAM_DATA_OUT(2)
8
7
6
1
2
3
4
INOUT_A1
INOUT_B1
INOUT_A2
INOUT_B2
INOUT_A3
INOUT_B3
INOUT_A4
INOUT_B4
G1
10
G1
4
INOUT_B1
INOUT_A2
5
3
INOUT_A1
FL406
9
8
7
6
CAM_DATA_OUT(3)
CAM_DATA_OUT(4)
CAM_DATA_OUT(5)
10
2
G2
1
G2
ICVE21184E150R500FR
CAM_DATA(0)
CAM_DATA(1)
CAM_DATA(2)
FL407
ICVE21184E150R500FR
2
3
INOUT_B1
INOUT_A2
INOUT_B2
INOUT_A3
INOUT_B3
INOUT_A4
INOUT_B4
5
9
CAM_DATA_OUT(6)
CAM_DATA_OUT(7)
CAM_VSYNC_OUT
CAM_HSYNC_OUT
8
7
6
10
G1
4
INOUT_A1
G2
1
CAM_DATA(6)
CAM_DATA(7)
CAM_VSYNC
CAM_HSYNC
FL408
VT_CAMERA_CONNECTOR
VGA_CAM_RESET_N
I2C_SCL
I2C_SDA
GND7
P20
P19
P18
P17
P16
P15
P14
P13
P12
P11
6
7
8
9
10
CAM_DATA_OUT(1)
CAM_DATA_OUT(2)
CAM_DATA_OUT(3)
CAM_DATA_OUT(4)
GND3
P6
P7
P8
P9
P10
GND1
GND2
GND6
GND5
CN404
15
14
13
12
11
EVL14K02200
P1
P2
P3
P4
P5
CAM_HSYNC_OUT
CAM_VSYNC_OUT
CAM_DATA_OUT(7)
CAM_DATA_OUT(6)
VA430
CAM_PCLK
CAM_DATA_OUT(0)
1
2
3
4
5
GND4
VREG_CAM_DVDD_1.5V
COMMON_CAM_MCLK
REV_1.0
GND8
NA
20
19
18
17
16
C424
VREG_CAM_AVDD_2.8V
CAM_DATA_OUT(5)
Figure 1.21 Camera Socket Type Connector
- 58 -
3. TECHNICAL BRIEF
The MEGA Camera module is connected to socket type connector with 24 pin (F95M08). Its interface
is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to
camera module and receive 49.152MHz pixel clock (15fps), vertical sync signal, horizontal sync signal,
reset signal and 8bits data from camera module. The camera module is controlled by I2C port from
MSM6245.
No
Name
Port
Note
1
CAM_DATA_OUT(3)
O
Data
2
CAM_DATA_OUT(4)
O
Data
3
CAM_DATA_OUT(5)
O
Data
4
CAM_DATA_OUT(6)
O
Data
5
CAM_DATA_OUT(7)
O
Data
6
GND
GND
7
MCLK
I
8
GND
GND
9
MEGA_CAM_RESET_N
I
10
I2C_SDA
O
Camera reset signal
I2C Data
11
I2C_SCL
O
I2C Clock
12
MEGA_CAM_PWR_DN
I
Camera power down
GND
Master Clock(24.576M)
GND
13
VREG_CAM_DVDD_1.8V
I
DVDD
14
VREG_CAM_AVDD_2.8V
I
VDDIO
15
GND
16
GND
VREG_CAM_AVDD_2.8V
I
AVDD
17
GND
GND
GND
18
CAM_HSYNC_OUT
O
GND
Horizontal Sync
19
CAM_VSYNC_OUT
O
Vertical Sync
20
CAM_PCLK
O
Pixel Clock (49.152M)
21
GND
22
GND
GND
CAM_DATA_OUT(0)
O
Data
23
CAM_DATA_OUT(1)
O
Data
24
CAM_DATA_OUT(2)
O
Data
Table. Interface between MEGA Camera Module and MAIN PCB (in camera module)
- 59 -
3. TECHNICAL BRIEF
The VGA Camera module is connected to socket type connector with 20 pin (CLE9120-2761E). Its
interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master
clock to camera module and receive 12.288MHz pixel clock (15fps), vertical sync signal, horizontal
sync signal, reset signal and 8bits data from camera module.
The camera module is controlled by I2C port from MSM6245.
No
Name
Port
1
VREG_CAM_DVDD_1.8V
I
DVDD
2
CAM_MCLK
I
Master Clock(24.576M)
3
GND
4
CAM_PCLK
O
Clock for Camera Data Out(12.288M)
5
CAM_DATA(0)
O
Data
6
CAM_DATA(1)
O
Data
7
CAM_DATA(2)
O
Data
8
CAM_DATA(3)
O
Data
9
CAM_DATA(4)
O
Data
10
CAM_DATA(5)
O
Data
11
CAM_DATA(6)
O
Data
12
CAM_DATA(7)
O
Data
13
CAM_VSYNC
O
Vertical Sync
14
CAM_HSYNC
O
Horizontal Sync
15
GND
16
I2C_SDA
I
I2C Data
17
I2C_SCL
I
I2C Clock
18
VGA_CAM_RESET_N
I
Camera reset signal
19
VREG_AVDD_2.8V
I
Camera I/O Power
20
VREG_AVDD_2.8V
I
Camera I/O Power
GND
GN D
Note
GND
GND
Table. Interface between VGA Camera Module and MAIN PCB (in camera module)
- 60 -
3. TECHNICAL BRIEF
3.11.6 Keypad Light
There are 8 Blue LEDs in Main key backlight circuit, which are driven by KYDB_BACKLIGHT line from
PM6650.
KEY_BACK_LIGHT LED(8EA)
+VPWR
LD400
LEBB-S14H
LD403
LEBB-S14H
LD406
LEBB-S14H
R411
100ohm
R414
100ohm
R417
LD404
LEBB-S14H
LD407
LEBB-S14H 100ohm
R418
R415
LD402
LEBB-S14H
LD405
LEBB-S14H
R413 100ohm
LD408
LEBB-S14H
R416 100ohm
100ohm
100ohm
REV_B : EDLH0013501 --> EDLH0006001
KYBD_BACKLIGHT
Figure 1.22 Schematic of KEY back light circuit (KEY side)
- 61 -
R419 100ohm
3. TECHNICAL BRIEF
3.11.7. LCD Module (NM176CN1 : Tovis)
- The NM176CN1 model is a Color TFT Main supplied by Tovis. This LCD Module has a 1.76 inch
diagonally measured active display area with 176(RGB)X220 resolution. each pixel is divided into
Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes.
* Features
- Display mode(Main LCD) : Normally White, Transmissive TN mode 265K colors.
- LCD Driver IC: NT3916 (NOVATEK).
- 16 bit CPU interface Parallel
3.11.8. Display & LCD FPC Interface
LCD module is connected to LCD KEY FPCB with 35 pin (XF2B-3545-31A / OMROM) The LCD
module is controlled by 16-bit EBI2 in MSM6245.
LCD CONNECTOR
CN400
ICVE21184E150R500FR
G1
INOUT_A4 INOUT_B4
5
28
27
10
29
7
6
7
6
INOUT_B1
INOUT_A1
INOUT_B2
INOUT_A2
INOUT_B3
INOUT_A3
INOUT_B4
INOUT_A4
G2
INOUT_A3 INOUT_B3
8
8
LCD_CS_N
LCD_ADS
EBI2_WE_N
EBI2_OE_N
FL401
26
9
7
6
24
3
4
FL400
INOUT_B1
INOUT_A1
INOUT_B2
INOUT_A2
INOUT_B3
INOUT_A3
INOUT_B4
INOUT_A4
G2
23
10
22
21
20
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
2
ICVE21184E150R500FR
8
25
1
G1
3
4
30
INOUT_A2 INOUT_B2
9
10
32
31
2
INOUT_A1 INOUT_B1
1
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
2
3
4
G1
33
1
5
34
G2
LCD_RESET_N
LCD_IF_MODE_0
LCD_IF_MODE_1
LCD_VSYNC
5
9
ICVE21184E150R500FR
35
FL402
ICVE21184E150R500FR
19
1
17
2
16
3
15
4
INOUT_B1
INOUT_A2
INOUT_B2
INOUT_A3
INOUT_B3
INOUT_A4
INOUT_B4
5
13
12
EBI2_DATA(8)
EBI2_DATA(9)
EBI2_DATA(10)
EBI2_DATA(11)
9
8
7
6
FL403
10
G1
14
INOUT_A1
G2
18
11
10
ICVE21184E150R500FR
9
1
2
6
3
5
4
INOUT_B1
INOUT_A2
INOUT_B2
INOUT_A3
INOUT_B3
INOUT_A4
INOUT_B4
5
3
2
10
G1
4
INOUT_A1
EBI2_DATA(12)
EBI2_DATA(13)
EBI2_DATA(14)
EBI2_DATA(15)
9
8
7
6
G2
8
7
FL405
LCD_MAKER_ID
VREG_LCD_2.8V
WLED_1
WLED_2
WLED_3
WLED_PWR
- 62 -
INSTPAR
0.1u
C409
Figure 1.23 Interface between LCD Module and MAIN PCB.
PLW0501H-LF
D402
VA409
EVL14K02200
VA410
EVL14K02200
1
3. TECHNICAL BRIEF
3.11.8.1. Audio Signal Processing & Interface
Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio
signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip
(MSM6245). This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to
RF Chipset. The downlink path amplifies the signal from DBB chip (MSM6245) and outputs it to
receiver (or speaker).
The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The
outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_P, LINE_N) are differential outputs.
Earphone2 (HPH_L, HPH_R) is a single-ended output stage designed to drive a headset speaker.
The microphone interface consists of two differential microphone inputs, one differential auxiliary input
and a two-stage audio amplifier.
(+16.5dB)
Figure 1.24 Audio Interface Detailed Diagram(MSM6245)
- 63 -
3. TECHNICAL BRIEF
36
RCVRCV+
MSM6245 CODEC pins
Near to MSM
47p
C201
MIC2N
MIC2P
MIC1N
MIC1P
HPH_R
HPH_L
C200
47p
22n
C210
MSM pin W18
(CODEC VSS)
AE20
AA20
AF20
C211
AF21
AE19
AF19
AC20
AC19
AC21
AA19
AC22
AA18
T15
AF18
AE18
W17
AA17
AC17
Place near
C212
0.1u
10%
LINE_ON
LINE_OP
HPH_R
HPH_L
EAR1ON
EAR1OP
MICBIAS
AUXOUT
HPH_VREF
LINE_L_IP
LINE_L_IN
LINE_R_IP
LINE_R_IN
AUXIN
AUXIP
MIC2N
MIC2P
MIC1N
MIC1P
CCOMP
AC18
22n
C204
10p
AF22
LINE_N
LINE_P
MICBIAS
C203
C202
220n
220n
R202
AUDIO
F25
SDCC_DAT1_GPIO99
M25
SDCC_DAT2_GPIO100
M26
Figure 1.25 Audio part schematics
I/O CONNECTOR
2.2K
VREG_MSMP_2.7V
MICBIAS
R400
R401
R402
5.1K
C400
0.1u
R403
VREG_MSMP_2.7V
CN401
HSEJ-18S04-25R
3
VIN+
VCC
GND
2
U400
NCS2200SQ2T2G
10K
R404
100K
1
OUT
VIN-
R405
HOOK_KEY
4
1M
51K
5
MIC2N
MIC2P
C401
HPH_L
HPH_R
C402
33u
33u
R406 100ohm
R407 100ohm
USB_D+
USB_D-
EAR_SENSE_N
VBATT
Figure 1.26 Audio part schematics
- 64 -
21
19
1
2
3
4
5
6
7
8
9
3. TECHNICAL BRIEF
AUDIO
SELECT_SPK&RCV
U401
NLAS5223BMNR2G
1
C410
0.01u
10
VCC
NO2
NO1
COM2
2
SPK-
3
SPK_RCV-
COM1
10
RCV_EN_N
IN2
10
7
IN1
NC2
NC1
GND
5
R421
6
RCV+
EVL14K02200
EVL14K02200
VA414
R422
SPK_RCV+
8
4
RCV-
SPK+
9
VA412
+VPWR
REV_B
MIC
MICBIAS
C417
47p
C416
10u
REV_B : SUMY0010301 --> SUMY0003802
R424
2.2K
MIC400
OB4-15L42-C33L
39p
39p
2.2K
C420
C421
R425
INSTPAR
C418
0.1u
C419
0.1u
D404
INSTPAR
PSD05-LF
D403
PSD05-LF
1
2
REV_B : EDTY0008606 --> EDTY0008601
Figure 1.27 Audio part schematics
- 65 -
MIC1P
MIC1N
3. TECHNICAL BRIEF
Audio AMP
NCP2890DMR2
C422
C423
C4275600p
1K
1K
C4265600p
LINE_N
LINE_P
R427
R429
0.1u
0.1u
R428 5.6K
2
20K
_SD
OUTB
BYPASSU402
3
INP
4
INM
R430 5.6K
8
SPK-
7
VM
6
VP
OUTA
+VPWR
5
SPK+
C428
1u
R431
20K
C425
10u
C431
NA
1000p
1000p
REV_C : 20K --> 3K
R426
L401
100nH
RCVN
L402
100nH
RCVP
SPK_RCVSPK_RCV+
REV_E : For Antenna Radiation
Audio part schematics
- 66 -
C429
C430
1
SPK_AMP_EN
3. TECHNICAL BRIEF
3.11.8.2. Audio Mode
There are three audio modes (Voice call, speaker phone, MIDI/MP3).
MODE
Voice Call
Speaker phone
Device
Description
Receiver Mode
Receiver Voice Call
Loud Mode
Speaker Phone
Headset
Headset Voice Call
Loud Mode
Speaker Phone
Loud Mode
Speaker MIDI Bell
Headset
Headset MIDI Bell
Loud Mode
Speaker MP3
Headset
Headset MP3
MIDI
MP3
Table. Audio Mode
Audio & Sound Main Component
There are 6 main components in U250/KU250.
Component
Design No.
Maker Part No.
Note
1
MSM6245
U201
MSM6245
Base-Band Modem
2
Audio amp
U402
NCP2890DMR2
1W Audio Amp
3
Analog Switch
U401
NLAS5223BMNR2G
Dual Analog Switch
4
Speaker/Receiver
EMS1810TP
Speaker/Receiver
5
MIC
OB4-15L42-C33L
-42 dB microphone
6
Ear jack
RMBLGG080STSB
Ear jack
MIC400
Table. Audio main component list
- 67 -
3. TECHNICAL BRIEF
3.12 Main Features
1. LG-U250/KU250 Main features
- Bar Type
- WCDMA(2100) + GSM Tri-Band (900/1800/1900)
- Color LCD (Main:262K TFT, 1.76”)
- Dual Camera (1.3Mega + VGA(0.3M))
- 1810 speaker/receiver
- Stereo Headset
- Speaker phone (in GSM and WCDMA)
- MP3/AAC decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Supports Bluetooth, USB
- 950 mAh (Li-Ion)
- 68 -
3. TECHNICAL BRIEF
2. U250/KU250 Main Component
Logic
/Audio
RF
Bluetoot
h
Logic
Main board (Bottom)
Main board (Top)
- 69 -
3. TECHNICAL BRIEF
RF
SW100
U101
U500
FL101
U100
FL104
U103
X100
Reference
Description
Reference
Description
SW100
Ant. Switch module
FL104
W2100 Duplex
U500
Front End module
U103
WCDMA PAM
U101
GSM PAM
X100
VCTCXO
FL101
GSM SAW
U100
RTR6275
BT module
- 70 -
3. TECHNICAL BRIEF
Logic / Audio
BAT300
U303
CN403
CN401
U402
Reference
Description
Reference
Description
BAT300
Backup Battery
CN401
MMI connector (18pin)
U303
1.3M Cam. LDO
CN403
1.3M Cam. Connector
U402
Audio AMP
- 71 -
3. TECHNICAL BRIEF
Logic
CN400
U300
U201
U301
J300
S300
Reference
Description
Reference
Description
U201
MSM6245_A
U300
PMIC
U301
Memory MCP
J300
U-SIM socket
CN400
Main To LCD Connector
S300
T-FLASH socket
- 72 -
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RF Component
LGMC
- 73 -
4. TROUBLE SHOOTING
Block
Diagram
Block
Ref. Name
Part Name
Function
UMTS
- 74 -
Comment
4. TROUBLE SHOOTING
4.2 SIGNAL PATH_UMTS RF
Common Tx/Rx
UMTX 2100 Tx/Rx
UMTX 2100 Tx
UMTX 2100 Rx
Tx I/Q
LO
RX I/Q
- 75 -
4. TROUBLE SHOOTING
4.3 SIGNAL PATH_GSM RF
Common Tx/Rx
GSM900 Tx
DCS/PCS Tx
EGSM900 RX
PCS Rx
DCS RX
Tx I/Q
LO
RX I/Q
- 76 -
4. TROUBLE SHOOTING
4.4 Checking VC-TCXO Block
The reference frequency (19.2MHz) from X100 (VC-TCXO) is used in UMTS
TX part, GSM part and BB part.
TCXO
X100
DSA321SCE-19.2M
NC3
7
NC4
8
NC2
NC1
6
5
VREG_TCXO_2.85V
3
OUTPUT
GND
2
100ohm
VCONT
1
TRK_LO_ADJ
0.01u
0.1u
C182
1000p
19.2MHz
C181
R124
VREG_BT_2.85V
4
VCC
C183
TP1
TP4
R128
C185
100K
100p
C186
TCXO_PM
1000p
VCC
C187
1000p
TP2
C188
5
0.01u
2
RTR6275_TCXO
U104
TC7SH04FU
4
3
GND
TP3
Schematic of the VC-TCXO Block
TP3
TP4
TP2
TP1
Test Point of the VC-TCXO Block
- 77 -
TCXO_BT
4. TROUBLE SHOOTING
T
Check C312 of PMIC (U300)
Check R213 of MSM (U201)
- 78 -
4. TROUBLE SHOOTING
4.5 Checking Front-End Module Block
TP1
11
19
15nH
C117
10p
Rev.B
7
8
10
12
13
15
17
20
21
23
VDD
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
ANT
VREG_RF_SMPS
Rev.C
U500
Rev.D
L108
GSM900_RX1
GSM900_RX2
GSM1800_RX1
GSM1800_RX2
GSM1900_RX1
GSM1900_RX2
WCDMA2100
D5011
5
6
1
2
3
4
9
16
GSM900_TX
14
GSM18001900_TX
Schematic of the Front-End Module Block
TP1
ANT_SEL0
ANT_SEL1
Test Point of the Front-End Module Block
- 79 -
1K
1K
18
CTRL1
22
CTRL2
C110
33p
C109
33p
R100
R101
ANT_SEL0
ANT_SEL1
4. TROUBLE SHOOTING
Logic Table of the FEM
GSM 1800 / GSM1900 RX
GSM 900 RX
GSM 900 TX / WCDMA
GSM 1800 / GSM 1900 TX
TP1 VREG RF SMPS
- 80 -
4. TROUBLE SHOOTING
4.6 Checking UMTS Block
4.6.1 Checking Tx level
TP1
TP2
TP3
TP4
ANT101 ANT102
TP1
C450
22p
1p
C437
C101
56p
SW100
ANT
G2
G1
KMS-507
C102
NA
L101
NA
RF
L102
100nH
TP2
U500
11
Rev.D
WCDMA
Rev_1.0
C154
1.5p
Rev.D
+VPWR
9
L123
1nH
Rev_1.0
C162
8
GND4
RFOUT
L122
NA
C157
10nH
RFIN
GND1
IN
3
U103
VCC1
FL102
5 EFCH1950TDF1
O1 G3
1
G2 G1
2
1
2
3
2
3.3p
7
GND3
6
GND2
11
BGND
VCONT
VREF
4
PA_R0
5
TP4
1
TR100
KRX102U
5
2
U102
PA_ON
3
20dB
C165
1p
VREG_TCXO_2.85V
CP0402A1950DNTR
Rev.B
4
OUT
50OHM
4
51R119
C164
0.5p
IN
1
ACMD-7602
1
2
COUP
RX
TX
3
PGND
ANT
4
C159
15p
C158
15p
WS2512_TR1G
10
VCC2
FL104
4
3
0.5p
L125
+VPWR
C155
4.7u
TP3
L404
1.8nH
PWR_DET
R121
130
R120
47
C192
100p
R122
130
7dB
For testing, Max power of UMT 2100 is needed.
- 81 -
C170
0.1u
4. TROUBLE SHOOTING
- 82 -
4. TROUBLE SHOOTING
4.6.2 Checking UMTS PAM Control Block
• PAM control signal
1. PWR_DET : UMTS Tx Power Detected value (Check R120)
2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control
3. VREG_TCXO_2.85V : UMTS PAM enable (C170) (about 2.85V)
4. +VPWR : UMTS PAM Main Voltage ( 3V < +VPWR < 4.2V)
5. PA_ON : Turns the PA on and off
6. PA_R0 : Control signals that step the active PA mode and bias
VREG_TCXO_2.85
+VPWR
PWR_DET
- 83 -
4. TROUBLE SHOOTING
4.6.3 Checking RF Rx Level
TP1
TP2
TP4
Vbias
TP3
ANT101 ANT102
TP1
C450
22p
1p
C437
C101
56p
SW100
ANT
G2
G1
KMS-507
C102
NA
L101
NA
RF
L102
100nH
R
U500
D
Vbias
TP2
TP4
WCDMA
Rev_1.0
+VPWR
+VPWR
C155
4.7u
L404
1.8nH
C158
15p
9
L123
1nH
Rev_1.0
C162
8
GND4
RFOUT
C157
10nH
L122
NA
RFIN
O1 G3
IN
L121
1nH
1
G2 G1
3
U103
VCC1
GND1
C156
100p
FL102
5 EFCH1950TDF1
2
Rev.D
1
2
Rev.D
L409
4.7nH
C161
C444
2.2p
2.2p
3
C164
0.5p
IN
C165
1p
7
GND3
6
GND2
11
BGND
VCONT
VREF
4
PA_R0
5
VREG_TCXO_2.85V
PWR_DET
C192
100p
R122
130
C170
0.1u
7dB
L128
1.8nH
C174
10p
Rev.D
L407
2.7nH
- 84 -
IN
4
G2 O2 FL103
G1 O1 EFCH2140TDE1
2
1
3
Rev.B
4
51R119
PA_ON
CP0402A1950DNTR
R120
47
1
L408
10nH
U102
R121
130
5
TP3
TR100
KRX102U
5
20dB
2
4
50OHM
OUT
2
3.3p
1
ACMD-7602
1
2
COUP
RX
TX
3
PGND
ANT
4
C159
15p
WS2512_TR1G
10
VCC2
FL104
4
3
0.5p
L125
VDD_RX
C154
1.5p
Rev.D
L411
4.7nH
3
L410
4.7nH
C445
2.2p
4. TROUBLE SHOOTING
- 85 -
4. TROUBLE SHOOTING
4.7 Checking GSM Block
1
2
- 86 -
3
4. TROUBLE SHOOTING
4.7.1 Checking RF Tx level
TP1
TP3
TP2
4.7.2 Schematic of RF Tx level
C101
56p
SW100
ANT
G1
RF
KMS-507
C102
NA
L102
100nH
11
1K
1K
18
CTRL1
22
CTRL2
C110
33p
Rev.D
L116
10nH
C138
NA
15
TP2
11
19
TP3
21
VBATT
DCS_PCS_OUT
EGSM_OUT
DCS_PCS_IN
U101
RSVD_GND
P_GND
2
C139
68p
20
C137
NA
C134
0.01u
C438
100p
6
C441
5.6p
R107
100ohm
L115
18nH
C121
33u
C123
0.01u
VCC1A
L403
1.5nH
VCC1B
C124
100p
ANT_SEL0
ANT_SEL1
C109
33p
GSM_PA_RAMP
16
GSM900_TX
14
GSM18001900_TX
R100
R101
17
D5011
5
6
1
2
3
4
9
VAPC
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GSM900_RX1
GSM900_RX2
GSM1800_RX1
GSM1800_RX2
GSM1900_RX1
GSM1900_RX2
WCDMA2100
EGSM_IN
ENABLE
SKY77318
GND9
GND8
GND7
GND6
GND5
GND4
GND3
GND2
GND1
7
8
10
12
13
15
17
20
21
23
VDD
16
14
13
12
10
9
8
7
5
19
15nH
C117
10p
Rev.C
U500
Rev.D
L108
ANT
TP1
G2
- 87 -
BS
3
4
18
1
4. TROUBLE SHOOTING
4.7.3 Checking RF Tx level
- 88 -
4. TROUBLE SHOOTING
4.7.4 Checking PAM Block
TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.6V
TP2. GSM_PA_EN : Power Amp Enable
(Power ON : higher than 1.25V , Power OFF : lower than 0.4V)
TP3. GSM_PA_BAND : Power Amp Band Selection Control
(GSM Mode : -0.2V < VBS < 0.4V , DCS/PCS Mode : 1.25V < VBS < 3.0V)
TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.0V
TP1
TP4
TP2
TP3
GSM_PA_RAMP
TP4
Rev.D
L116
10nH
TP1
C134
0.01u
C438
100p
C138
NA
C121
33u
C123
0.01u
R107
100ohm
C136
0.01u
19
21
EGSM_OUT
2
6
DCS_PCS_OUT
DCS_PCS_IN
U101
EGSM_IN
ENABLE
RSVD_GND
P_GND
TP3
FL1
SKY77318
BS
GND9
GND8
GND7
GND6
GND5
GND4
GND3
GND2
GND1
15
11
VCC1A
17
VAPC
VBATT
20
C139
68p
VCC1B
L403
1.5nH
16
14
13
12
10
9
8
7
5
4
p
EGSM
+VPWR
3
4
R113
18
100ohm
EFC
R117 100ohm
GSM_PA_BAND
C153
15p
TP2
Schematic of GSM PAM Block
- 89 -
GSM_PA_EN
C149
15p
1
4. TROUBLE SHOOTING
4.7.5 Checking RF Rx Block
TP1. DCS RX INPUT
TP1
TP3
TP2. PCS RX INPUT
TP3. GSM RX INPUT
TP2
L102
100nH
Rev.C
Rev.C
C439
5p
C440
5p
7
8
10
12
13
15
17
20
21
23
VDD
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GSM900_RX1
GSM900_RX2
GSM1800_RX1
GSM1800_RX2
GSM1900_RX1
GSM1900_RX2
WCDMA2100
5
6
1
2
3
4
9
TP1
DCS
C105
NA
0.5p
C190
C442 5.6p
D5011
1K
1K
18
CTRL1
22
CTRL2
R100
R101
ANT_SEL0
ANT_SEL1
TP2
16
GSM900_TX
14
GSM18001900_TX
C110
33p
PCS
C116
NA
C109
33p
C443 5.6p
L405
Rev.D
C124
100p
L115
18nH
L403
1.5nH
L116
10nH
GSM_PA_RAMP
19
ANT
11
U500
TP3
+VPWR
C123
0.01u
EGSM
C121
33u
Schematic of GSM900/DCS/PCS Rx Block
- 90 -
2.7nH
C120
NA
L406
NA
C191
L111
5.6nH
2.7nH
4. TROUBLE SHOOTING
- 91 -
4. TROUBLE SHOOTING
4.8 Checking Bluetooth Block
Test Point of the Bluetooth Block
TP2
TP1. VREG_BT_2.85V
TP2. VREG_MSMP_2.7V
TP1
TP3. TCXO_BT
TP3
TP4. BT ANT Output
TP4
Test Point of the Bluetooth Block
TP4
BLUETOOTH
ACS2450HBAXX
NC1
R118
FEED
M100
9
C172
1u
3
C173
2.2u
2
R123
10
VREG_MSMP_2.7V
0
0.1uF
2.2u
100p
C177
C180
C178
VCC_OUT
VDD_INT
4
SBST
11
SBCK
12
SBDT
SYNC_DET_TX_EN
VDD_MSM
RX_BB_TX_BB
VDD_BAT
XTAL_IN
PGND4
20
PGND3
19
PGND2
18
PGND1
17
100p
14
C179
VREG_BT_2.85V
CLK_REF
ANT
1000p
BT_SBST
BT_SBCK
BT_SBDT
5
BT_TX_RX_N
13
BT_DATA
7
1000p
TCXO_BT
C176
GND4
15
GND3
8
GND2
6
GND1
1
C171
BT_CLK
16
LBRQ-2B43A
NC2
ANT103
NA
TP2
0
C169
L126
NA
TP3
TP1
Schematic of the Bluetooth Block
- 92 -
4. TROUBLE SHOOTING
Start
TP1,TP2
Signals exits?
NO
Change the Main board
YES
TP3
Is clock ok? 19.2M
NO
Change the X100
YES
NO
TP4
Signals exits?
Change the M100
YES
Change the Main board
- 93 -
4. TROUBLE SHOOTING
4.9 Power ON Troubleshooting
Power On sequence of U250/KU250 is :
PWR key press → PM_ON_SW_N go to low, PM6650 KPDPWR_N (pin24) → PM6650 Power Up →
VREG_MSMC_1.2V, VREG_MSME_1.8V, VREG_MSMP_2.7V, VREG_MSMA_2.6V,
VREG_TCXO_2.85V power up and system reset assert to MSM6245 → Phone booting and
PS_HOLD assert to PMIC
Start
NO
Change or charging the
Battery voltage. higher
than 3.20V?
Battery
YES
NO
Check the Key Dome
Key press?
YES
NO
VREG_MSMC_1.2V,VREG_MSMP_2.7V,
VREG_MSME_1.8V, VREG_TCXO_2.85V,
VREG_MSMA_2.6V power up?
YES
Change the Main board
NO
Is clock ok?
R306 : 19.2M
X300 : 32.768Khz
Check the TXCO
YES
Change the Main board
- 94 -
4. TROUBLE SHOOTING
VREG_MSMC
VREG_MSME
VREG_MSMP
X300 : 32.768Khz
VREG_MSMA
[U250/KU250 Main PCB BOTTOM]
- 95 -
R306 : 19.2Mhz
4. TROUBLE SHOOTING
4.10 Charger Troubleshooting
CHARGER
ICHARGEOUT
SI3493DV-E3
Q301
R313
USB_VBUS
0.1
6
5
4
Q300
QST4
D3 D4
+VPWR
C1
1
3 B
C2
2
USB_CTL_N
G
D1 D2
S
VBATT
+5V_PWR
BATT_FET_N
6
5
4
Q302
QST4
C1
1
C2
3 B
2
CHG_CTL_N
ICHARGE
Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT
Charging Procedure
- Connect TA or USB Cable
- Control the charging current by PM6650 IC
- Charging current flows into the battery
Troubleshooting Setup
- Connect TA and battery to the phone
Check Point
- Connection of TA or USB Cable
- Charging current path
- Battery
Troubleshooting Procedure
- Check the charger (TA or USB Cable) connector
- Check the charging current Path
- Check the battery
- 96 -
4. TROUBLE SHOOTING
Start
Check the pin and battery
Connect terminals of I/O
connector
NO
Connection OK?
Change I/O connector
Yes
NO
Change TA
(or USB Cable)
Is the TA (or USB Cable)
voltage 5.1V (or 5.0V)?
Yes
Is it charging properly
After turning on Q301(or Q302)
, Q302?
Yes
END
NO
Change the board
[ Charger Troubleshooting Flow ]
- 97 -
4. TROUBLE SHOOTING
Q302
Q300
R313
Q301
[ Charging part ( Main PCB Front ) ]
- 98 -
4. TROUBLE SHOOTING
4. BB Trouble Shooting
4.11 USB Troubleshooting
USB Initial sequence of U250/KU250 is :
USB connected to U250/KU250 power on → USB_VBUS(Q300) go to 5V → USB_D+ go to 3.3V →
USB_DAT is triggered → USB work.
Start
Power is on?
NO
Go to power on trouble shooting
YES
Cable is inserted?
NO
Insert cable
YES
Q400 pin 4 is 5V?
NO
Check Q300 (pin 4)
YES
USB_D+ is 3.3V?
NO
Check VA401
YES
Change the Main board
- 99 -
4. TROUBLE SHOOTING
4.12 SIM Detect Troubleshooting
USIM Initial sequence of U250/KU250 is :
USIM_CLK,USIM_RST,USIM_DATA triggered → VREG_UIM_2.85V go to 2.8V → USIM IF work
Start
Re-insert the SIM card
Work well?
Yes
End
No
VREG_UIM_2.85V is 2.85V?
USIM_P_CLK is run?
NO
Check J300
YES
Change SIM card
Yes
Work well?
No
Change the Main board
- 100 -
End
4. TROUBLE SHOOTING
2
R317
2
USIM_P_RST_N
3
USIM_P_CLK
7
USIM_P_DATA
J300 HSSC-8P-18
1
GND1
VCC
2
VPP
RST
3
CLK
IO
4
RSV2 RSV1
11
GND2 GND5
12
VREG_USIM_2.85V
USIM_P_RST_N
USIM_P_CLK
Figure. USIM part schematics
- 101 -
EVLC18S02003
VA302
smd_1005h_5_r
L302
56nH
C353
GND3 GND4
33p
EVLC18S02003
VA300
USIM_P_DATA
VREG_USIM_2.85V
15K
0.1u
5
6
7
8
9
10
1
EVL14K02200
VA301
USIM
1
C352
3
5
6
smd_1005h_5_r
7
4. TROUBLE SHOOTING
4.13 Camera Troubleshooting
Camera control signals are generated by MSM6245.
4.13.1 MEGA CAMERA
Start
Check the camera connector and
reconnect the camera
Yes
Camera is OK?
NO
END
NO
Change the Main board
Yes
NO
Check the CAM_MCLK
Change the Main board
Yes
Change the camera
Yes
Camera is OK
END
NO
Change the Main board
- 102 -
4. TROUBLE SHOOTING
4.13.2 VGA CAMERA
Start
Check the camera connector and
reconnect the camera
Yes
Camera is OK?
NO
END
NO
Change the Main board
Yes
NO
Change the Main board
Check the CAM_MCLK
Yes
Change the camera
Yes
Camera is OK
END
NO
Change the Main board
- 103 -
4. TROUBLE SHOOTING
C350
C447
C347
U501
C348
U303
C349
CAMERA LDO
+VPWR
CAM_LDO_EN
C447
1u
PGND
C347
1u
U303 RT9011-MGPQW
1
8
VIN
VOUT1
2
7
EN1
VOUT2
6
3
NC2
EN2
4
5
NC1
GND
9
+VPWR
CAM_LDO_EN
VIN
VOUT
3
4
GND BGND
2
6
STBY
NC
1
5
U501
BH15LB1WHFV
REV_D
- 104 -
VREG_CAM_AVDD_2.8V
VREG_CAM_DVDD_1.8V
C348
1u
C349
1u
VREG_CAM_DVDD_1.5V
C350
1u
4. TROUBLE SHOOTING
4.14 Keypad Backlight Troubleshooting
Key Pad Back Light is on as below :
Key pressing → KYBD_BACKLIGHT go to 0V → MAIN Key Backlight LED On
Start
Key press
NO
Check battery
+VPWR is above 3.2V?
Yes
Yes
NO
KYBD_BACKLIGHT is 0V ?
Change the Main board
Yes
YES
END
Backlight LED ON?
No
Change the Main board
+VPWR
KEY_BACK_LIGHT LED(8EA)
+VPWR
LD400
LEBB-S14H
LD403
LEBB-S14H
LD406
LEBB-S14H
R411
100ohm
R414
100ohm
R417
LD404
LEBB-S14H
LD407
LEBB-S14H 100ohm
R418
100ohm
R415
LD402
LEBB-S14H
LD405
LEBB-S14H
R413 100ohm
LD408
LEBB-S14H
R416 100ohm
100ohm
REV_B : EDLH0013501 --> EDLH0006001
KYBD_BACKLIGHT
Figure.Keypad backlight LED part
- 105 -
R419 100ohm
4. TROUBLE SHOOTING
4.15 Main LCD Troubleshooting
Main LCD control signals are generated by MSM6245. The signal path is :
MSM6245 → CN400 → LCD Module
Start
Press END key
Key LED is on?
NO
GO to power on trouble shooting
Yes
Disconnect and reconnect
The LCD connector
LCD display OK?
Yes
END
No
Change the LCD module
LCD display OK?
Yes
END
No
Change the Main board
- 106 -
4. TROUBLE SHOOTING
4.16 Receiver Path
MSM6245 EAR1ON/EAR1OP → R421,R422 → Analog Switch(U401) → Receiver
Start
Connect the phone to network
Equipment and setup call
Setup 1KHz tone out
YES
Can you hear the tone?
END
NO
The sine wave appears at
L401, L402?
YES
Change receiver
NO
The sine wave appears at
R421, R422?
YES
Check the analog switch
NO
Change the Main board
- 107 -
4. TROUBLE SHOOTING
R421
R422
U401
- 108 -
4. TROUBLE SHOOTING
4.17 Headset path
MSM6245 HPH_R, HPH_L → C402/C401 → R407/R406 → CN401 (MMI Connector)
Start
Connect the phone to network
equipment and setup call.
Setup 1KHz tone out
and insert headset.
YES
END
Can you hear the tone?
NO
YES
Sine wave appears at
R407/R406?
Change the Headset
NO
Change the Main board
- 109 -
4. TROUBLE SHOOTING
CN401
R406
C401
C402
C407
- 110 -
4. TROUBLE SHOOTING
4.18 Speaker phone path
MSM6245 LINE_P,LINE_N → R429/R427, C423/C422, R431/R426 → Audio AMP(U402) → Analog
Switch(U401) → Speaker
Start
Connect the phone to network
equipment and setup call
Setup 1KHz tone out
YES
END
Can you hear the tone?
NO
Sine wave appears at
NO
Change the Main board
R429/R427 and C423/C422
And R431/R426 ?
YES
SPK_AMP_EN is2.6V?
NO
Change the Main board
YES
The sine wave appears at
SPK+, SPK- ?
NO
Change the Audio Amp
YES
The sine wave appears at
SPK_RCV-,SPK_RCV+?
YES
Change speaker
NO
Change the Main board
- 111 -
4. TROUBLE SHOOTING
Analog Switch
SPK+
Audio Amp
- 112 -
4. TROUBLE SHOOTING
4.19 Main microphone
MIC400 → MIC1P, MIC1N (MSM6245)
Start
Make a call
MIC_BIAS(C416)
is 1.8V
NO
Change main board
YES
Make sound to MIC
Sine wave appears at
C418/C419?
NO
Change the MIC
YES
Change the Main board
YES
NO
Work well?
- 113 -
END
4. TROUBLE SHOOTING
R424
C417
MIC400
- 114 -
4. TROUBLE SHOOTING
4.20 Headset microphone
Headset → C210/C211 → MIC2P, MIC2N (MSM6245)
Start
Make a call
OK
Change the headset and retry
END
NO
YES
NO
Change the MAIN board
HOOK_KEY is detected?
Yes
NO
MICBIAS is biased
by 1.8V?
Change the MAIN board
Yes
NO
Sine wave appears at
C210/C211 ?
Yes
Change the Main board
- 115 -
Change the headset or
Main board and retry.
4. TROUBLE SHOOTING
Ear_Sense_N
MIC Input
- 116 -
4. TROUBLE SHOOTING
4.21 Vibrator
The Vibrator is connected between +VPWR and VIB_DRV_N (PM6650 25 pin).
The Vibrator motor driver is an SBI-programmable voltage out that is reference to +VPWR.
Start
Operate the Vibrator
Yes
Work well?
End
NO
Change vibrator
or PM6650
+VPWR
TP400
TP401
L400
56nH
MOTOR_PWRD400
RB521S-30
- 117 -
4. TROUBLE SHOOTING
MOTOR_PWR-
+VPWR
- 118 -
5. DOWNLOAD
5. DOWNLOAD
5.1 U250/KU250 DOWNLOAD
5.1.1 Introduction
LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a
download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple
to use and easy enough for the beginner to upload executable images to the handset. LGMDP
supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed.
Additionally, LGMDP allows multi downloading up to 9 handsets at the same time.
5.1.2 Downloading Procedure
• Connect the phone to your desktop PC using the USB cable and run the LGMDP application.
Before getting started, set up LGMDP preferences from the Preferences of the file menu the way
you want. Click on the File menu and select Preferences.
➢ Play a success sound
It will be played a .wav file when the download has been completed. To enable this simply check
the box.
➢ Always on Top
Check if LGMDP always appears at the top of the window so that user can monitor it all the time.
➢ Automatically run Select Port When LGMDP starts
When LGMDP starts, it will automatically select Select Port button to download new image file.
- 119 -
5. DOWNLOAD
5.1.2.1 Connecting to PC
• Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable
for the port to be connected for downloading images. Then click on the Connect button. (The port
number(COM7) shall be different from that of the port number in the snapshot.)
• The status Ready is displayed when the application is ready for downloading. While the images are
transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of
transmission of data is displayed.
U250/KU250
- 120 -
5. DOWNLOAD
1) Image Folder indicates loot path where all image files are placed. To change location of the default
image path, select Browse… button. The edit box shows the file path where images are located.
Please note that all images should be located in a selected folder.
2) Click on the Browse… button to select image files to be downloaded on the handset.
3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option.
Backup the NV data and restore the backed up NV data automatically.
U250/KU250
1)
U250/KU250
U250/KU250
U250/KU250
2)
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
3)
5)
U250/KU250
U250/KU250
U250/KU250
U250/KU250
4)
6)
7)
4) Reset database & Contents:
User related data including the setting data on the EFS is reset in the handset. The user contents in
the handset will be erased. If you want to reset all the user data back to the way they were before
you started downloading new images, check the option.
Erase_EFS:
The calibration data, user contents, media, and module are erased. Only calibration data is kept
when NV backup/restore is checked. The user contents and file system physically are wiped out.
Keep All Contents
Maintain user data including WAP, AD, DRM, E-mail, Play lists, and images when downloading a
new S/W images. User data stated above are maintained if this option is selected.
5) Additional Options:
Display Information is defaultly not selected and user cannot choose. Override partition table is also
also defaultly not selected and user cannot choose.
6) Clear: Clearing all directory paths of images in the dialog.
7) Start: Starting downloading the selected individual image.
- 121 -
5. DOWNLOAD
5.1.2.2 Choosing image files
• Select the image folder, where all the image files are located, by clicking on the Browse…. (The
folder name shall be different from that of the folder name in the snapshot. The folder name
indicates the path where the image files are located.)
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
- 122 -
5. DOWNLOAD
• Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automatically
load images accordingly. Also you can select images by manually. For instance, select the path of
AMSS Modem Image file by clicking on the Browse… button. The selected AMSS image will be
downloaded to the handset from the path directory in the PC. Make sure that you have chosen
correct file. In case of wrong AMSS Modem file is file is selected, the phone may not work.
(The file name shall be different from that of the file name in the snapshot.)
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
- 123 -
5. DOWNLOAD
• If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the
desired NV file to be downloaded on the handset. To enable this simply check the box or select the
NV file from the LGMDP installation directory by clicking on the Browse… button.
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
• Click on the START button to start downloading. A summary of the selected images and option
information window will be displayed. Click on the No button if this is not the setting you are
downloading for. Otherwise click on the Yes button to continue downloading selected image file
with options.
Yes
No
- 124 -
5. DOWNLOAD
5.1.2.3 Downloading
• This message box informs that a new file for
NV backup will be created in the displayed
NV_U250/KU250
file name in the LGMDP installation
directory.
• Backing up NV data and backed up NV data
U250/KU250
will be stored in the LGMDP installation
directory.
• Erasing the existing directories and files
U250/KU250
before the Module image is downloaded.
• Downloading the AMSS modem image
U250/KU250
- 125 -
5. DOWNLOAD
• Rebooting the handset and re-establishing
the connection
• Restoring NV data which backed up in the
U250/KU250
Backing up process. User can also restore
NV data using NV Default image selection.
• Rebooting the handset and re-establishing
the connection
• Erasing the existing directories and files
U250/KU250
before downloading the selected Media
image
- 126 -
5. DOWNLOAD
• Downloading Media image in progress
U250/KU250
• Downloading Module image in progress
U250/KU250
• Downloading process has completed
U250/KU250
successfully
- 127 -
5. DOWNLOAD
5.1.2.4 Tools
• Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is
designed to monitor USB connectivity and check where the COM has been installed . Select Device
Manager from the Tools of the file menu.
- 128 -
5. DOWNLOAD
5.1.3 Troubleshooting Download Errors
1) When the phone does not work after downloading has been completed.
2) Media Erasing Error
3) NV Restore Error
5.1.3.1 When the phone does not work
• Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and
then try to download all the images up to AMSS. In the emergency mode, you can not download
media or module image.
The phone supports a special mode called emergency mode. In this mode, minimum units for
downloading is running so that users can download the images again in case of emergency
situation. (AMSS modem, Media, and Module images can not be running in this mode.)
- 129 -
5. DOWNLOAD
• The below dialog shows parameters of Select Port when phone is booted in Emergency mode.
Click on the Connect button to continue.
U250/KU250
• Choose Image file after clicking on the Browse… button. Make sure that you have chosen the right
image file. After choosing valid images, then click on the Start button to start downloading selected
images. The selected image will be downloaded to the handset from the path directory in the PC.
After downloading images successfully, it will boot to normal mode.
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
- 130 -
5. DOWNLOAD
5.1.3.2 NV Restore Error
• Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt.
U250/KU250
• Connect the handset and Press the Connect button in the Select Port window. (Enable state in the
window indicates that the Phone has been detected and is ready to download.)
U250/KU250
U250/KU250
- 131 -
5. DOWNLOAD
• Click on Browse… . Select the LGMDP installation directory and a list of NV Backup files(*.nv2) will
be shown. These nv files were saved every time NV Backup option was selected, and the name of
the nv file is determined based on the time when NV Backup was done. Choose the desired NV file
to be downloaded on the handset, and click on Start.
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
U250/KU250
- 132 -
5. DOWNLOAD
5.1.4 Caution
1) Multi-downloading using the USB hub is not recommendable.
2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore
and image (media and module) download.
3) The NV data saved at LGMDP folder as following format.
D:\LGMDP\004400-01-429926\_COM14_
LGMDP folder name
IMEI number
Port number
4) Recommended that the Module and Media Image have to be downloaded at the same
time.
5) Erase EFS option will erase everything (media, module, nv items, and user data) in the
EFS area.
- 133 -
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
6.1 GSM & UMTS RF Block
[Fig 2.1] U250/KU250 RF Functional Block Diagram
- 134 -
6. BLOCK DIAGRAM
[Table 2.1] RF Block Component
- 135 -
6. BLOCK DIAGRAM
6.2 Interface Diagram
6.2.1 RTR6275 & MSM6245 Interface Diagram
[Fig 2.2] RTR6275 & MSM6245 Interface Diagram
- 136 -
6. BLOCK DIAGRAM
6.2.2 Memory Interface
ADDRESS[14:0]
[Fig 2.3] Memory Interface Diagram
- 137 -
6. BLOCK DIAGRAM
6.2.3 USB,UART,SIM,JTAG Interface
[Fig 2.4] USB, UART, SIM, JTAG Interface
- 138 -
6. BLOCK DIAGRAM
Main RF signal
Control signal
Control signal
Description
Comment
UMTS PA_CTL signal
PA_R0
UMTS Tx High/Low Power Control
GSM PA_CTL signal
GSM_PA_BAND
DCS or PCS /GSM Mode Selection
GSM_PA_EN
Power Amp Gain Control Enable
GSM_PA_RAMP
Power Amp Gain Control
UMTS,
ANT_SEL 0,1
Ant Switch Module Mode Selection
GSM900Tx/Rx,
DCS Tx/Rx,
PCS Tx/Rx
- 139 -
6. BLOCK DIAGRAM
6.2.4 Placement
*Top Side
LGMC
- 140 -
6. BLOCK DIAGRAM
*Bottom Side
LGMC
- 141 -
- 142 -
7. CIRCUIT DIAGRAM
1
3
2
4
5
14
ANT_SEL0
ANT101 ANT102
C450
22p
G1
HIGH
LOW
GSM 850/GSM 900 TX/ WCDMA
LOW
HIGH
LOW
GSM 1800/GSM 1900 TX
HIGH
HIGH
A
RF
KMS-507
C102
NA
L101
NA
G2
LOW
GSM 850/ GSM 900 RX
L102
100nH
TX_IP
C103
180p
Rev.C
Rev.C
U500
5p
Rev.C
5
6
1
2
3
4
9
C105
NA
DCS
0.5p
C190
C106
5p
C440
DCS_PCS_TX
GSM_TX
55
8.2p
C107
6p
C112
12p
51
TX_IP
50
TX_IN
53
TX_QP
52
TX_QN
43
LB_RF_OUT1
42
LB_RF_OUT2
B
C113
180p
TX_QM
C118
12p
14
BS
C128
C129
C130
C131
C132
22p
0.1u
22p
0.1u
22p
C126
C127
22p
0.1u
C
Rev.B
Rev.D
VREG_RF_SMPS
2.7
5.1
L114
C122
22u
47nH
C189
22p
Rev.C
L119
VREG_SYNTH_2.6V
47nH
D
VDD_RX
C135
0.1u
R109 10
R112
GSM_PA_EN
C149
15p
1
3
2
EFCH897MTDB1
39
C144
22u
100ohm
GSM_TX
VREG_RF_SMPS
47nH
C143
0.1u
5
R115
R113
18
C147
7.5dB
4
O1 G3
1
IN
G2 G1
4
100ohm
SKY77318
2.7
R434
R106
C141
29
91 R111
91 R110
WLNA_IN
R433
C142
26
PWR_DET
5.1
R105
4
6
8
9
15
16
19
20
28
41
45
47
48
49
VDDA1
VDDA2
VDDA3
VDDA4
VDDA5
VDDA6
VDDA7
VDDA8
VDDA9
VDDA10
VDDA11
VDDA12
VDDA13
VDDA14
L120
3
Rev.D
R116
VREG_MSMP_2.7V
E
100ohm
R117 100ohm
GSM_PA_BAND
16
14
13
12
10
9
8
7
5
E
DCS_PCS_TX
2
EGSM_IN
ENABLE
RSVD_GND
P_GND
R108
R114
VBATT
U101
RX_QP
RX_QM
FL101
DCS_PCS_IN
GND9
GND8
GND7
GND6
GND5
GND4
GND3
GND2
GND1
21
6
20
19
DCS_PCS_OUT
EGSM_OUT
22
CAL_INP
23
CAL_INN
8.86dB Rev.1.0
51
VAPC
11
2.7nH
C136
0.01u
RX_IP
RX_IM
10
RX_QP
11
RX_QN
40
PWD_DET_IN
21
TEST
31
GCELL_INP
30
GCELL_INN
32
EGSM_INP
33
EGSM_INN
C134
0.01u
C139
68p
15
22p
36
GPCS_INP
37
GPCS_INN
C438
100p
C138
NA
C137
NA
D
L406
RTR6275
38
DCS_INP
39
DCS_INN
VCC1A
C441
5.6p
C119
R107
100ohm
L116
10nH
VCC1B
L403
1.5nH
17
C124
100p
L115
18nH
EGSM
+VPWR
C121
33u
C123
0.01u
U100
SBDT
3
R_BIAS1
27
R_BIAS2
12
RX_IP
13
RX_IN
R104 680 (1%)
SSBDT_RTR
L111
5.6nH
100ohm
Rev.D
2.7nH
3300p
C114
1000p
C115
VTUNE-Connected directly to GND
DAC_REF
100p
GSM_PA_RAMP
L405
C120
NA
RTR6275_TCXO
5
VTUNE1
18
VTUNE2
VCONTROL
C140
C443 5.6p
C109
33p
54
DAC_REF
7
TCXO
RF_ON
VDDM
C110
33p
56
TX_AGC_ADJ
NA
C191
17
16
GSM900_TX
14
GSM18001900_TX
24
TX_ON
C116
NA
PCS
22p
ANT_SEL0
ANT_SEL1
22p
R100
R101
22p
1K
1K
18
CTRL1
22
CTRL2
D5011
C
GSM_PA_BAND
C153
15p
C150
1000p
MODE
LOW
C152
0.01u
C151
22p
Rev.D
GSM
DCS/PCS
HIGH
GSM/EDGE
WCDMA
Rev_1.0
VDD_RX
C154
1.5p
Rev.D
+VPWR
+VPWR
F
C155
4.7u
L404
1.8nH
C158
15p
FL104
GND4
RFOUT
L122
NA
O1 G3
C157
10nH
IN
VCC1
RFIN
L121
1nH
F
1
G2 G1
3
U103
GND1
C156
100p
FL102
5 EFCH1950TDF1
2
Rev.D
1
2
Rev.D
L409
4.7nH
C161
C444
2.2p
2.2p
3
VCONT
VREF
4
PA_R0
5
5
1
IN
1
U102
PA_ON
CP0402A1950DNTR
BLUETOOTH
L411
4.7nH
ACS2450HBAXX
3
L410
4.7nH
C445
2.2p
FEED
M100
7dB
C171
1000p
9
C172
1u
3
C173
2.2u
2
BT_CLK
L128
1.8nH
D
C174
10p
R123
10
VREG_MSMP_2.7V
0
NC3
7
NC4
8
NC2
NC1
2.2u
100p
C178
100p
0.1uF
C179
L407
2.7nH
TCXO
X100
DSA321SCE-19.2M
C177
VREG_BT_2.85V
14
C180
Rev.D
CLK_REF
4
SBST
11
SBCK
12
SBDT
VCC_OUT
VDD_INT
NC2
ANT103
16
LBRQ-2B43A
C170
0.1u
C192
100p
R122
130
ANT
R120
47
0
SYNC_DET_TX_EN
VDD_MSM
RX_BB_TX_BB
VDD_BAT
XTAL_IN
BT_SBST
BT_SBCK
BT_SBDT
5
BT_TX_RX_N
D
13
BT_DATA
7
1000p
C176
TCXO_BT
GND4
15
GND3
8
GND2
6
GND1
1
3
VREG_TCXO_2.85V
PWR_DET
R121
130
C
NC1
R118
L126
NA
Rev.B
4
51R119
L408
10nH
4
G2 O2 FL103
G1 O1 EFCH2140TDE1
2
2
20dB
TR100
KRX102U
PGND4
20
PGND3
19
PGND2
18
PGND1
17
2
7
GND3
6
GND2
11
BGND
C165
1p
5
50OHM
C164
0.5p
IN
1
3.3p
4
C
Rev_1.0
8
OUT
0.5p
L125
9
L123
1nH
C162
COUP
ACMD-7602
1
2
3
RX
TX
4
C159
15p
WS2512_TR1G
10
VCC2
PGND
ANT
TX_QP
C108
180p
C442 5.6p
R103 12K (1%)
4
3
2
ENV_LNP
1
ENV_LNN
ENV_OUT
46
HB_RF_OUT1
44
HB_RF_OUT2
25
GND
57
PGND
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
TX_IM
GSM900_RX1
GSM900_RX2
GSM1800_RX1
GSM1800_RX2
GSM1900_RX1
GSM1900_RX2
WCDMA2100
WLNA_OUT
7
8
10
12
13
15
17
20
21
23
VDD
34
WMIX_INP
35
WMIX_INN
Rev.B
B
ANT
19
15nH
C117
10p
C439
11
Rev.D
L108
VREG_RF_SMPS
C104
180p
NA
1p
C437
C101
56p
SW100
ANT
ANT_SEL1
GSM 1800/GSM 1900 RX
C169
A
16
15
6
5
VREG_TCXO_2.85V
3
OUTPUT
GND
2
100ohm
VCONT
1
R128
C185
R124
TRK_LO_ADJ
E
0.01u
C182
1000p
0.1u
C181
19.2MHz
VREG_BT_2.85V
VCC
C183
4
E
Date
Sign & Name
Designer
MAR. 07. 2007
KANG. H. S
Sheet/
MODEL
KU250
U250/KU250
Sheets
1/4
100K
C186
100p
TCXO_PM
1000p
VCC
C187
Section
C188
1000p
5
0.01u
2
RTR6275_TCXO
U104
F
TC7SH04FU
4
Checked
TCXO_BT
RF
DRAWING
3
GND
Approved
LG Electronics Inc.
1
2
4
5
6
7
8
DRAWING
REV_1.2
NO.
9
LG Electronics Inc.
LG(42)-A-5505-10:01
LGMC
- 143 -
7. CIRCUIT DIAGRAM
1
2
3
4
6
5
7
8
10
9
12
11
13
14
16
15
RCVRCV+
HPH_R
HPH_L
MIC2N
MIC2P
MIC1N
MIC1P
MICBIAS
BT_CLK_GPIO25
BT_SBST_GPIO24
BT_SBCK_GPIO23
BT_SBDT_GPIO22
BT_TX_RX_N_GPIO21
BT_DATA_GPIO20
2200p cap => place between
D12(VDDA1) and F12(DAC_REF)
H11
D5
J21
C231
2200p
CAM_MCLK
LCD_IF_MODE_0
A6
N19
W15
C232
1000p
VGA_CAM_RESET_N
AA15
AE13
LCD_LDO_EN
LCD_RESET_N
HOOK_KEY
H9
B6
F8
C233
1000p
C234
1000p
C235
1000p
C236
0.01u
C237
1000p
C239
1000p
C238
1000p
DAC_REF
C242
0.1uF
C240
0.1uF
D
Near to B18 (VDD_PLL)
GPIOs
VREG_MSMA_2.6V
AA1
Y6
R211
L25
0
H6
C243
0.1u
AF6
W23
AF11
RF
AF23
AF24
TX_ON
B4
T23
ANT_SEL1
ANT_SEL0
T19
D11
AF17
AA16
AE24
AA26
AE23
U26
Y26
U25
P23
B21
B18
A3
B15
B9
D12
(VDD_DAC_REF)
VDD_PLL
VDD_MDDI
VDD_PAD4_0
K25
AE15
AE11
R25
VDD_PAD3_0
VDD_PAD3_1
VDD_PAD3_2
VDD_PAD3_3
R2
U2
M2
K2
F2
B5
B11
AE6
VDD_PAD2_0
VDD_PAD2_1
VDD_PAD2_2
VDDA1
VDDA2
VDDA3
VDDA4
VDDA5
VDDA6
VDDA7
VDDA8
VDDA9
VDDA10
H1
W1
AC1
AF8
AF16
T26
G26
D26
A24
A14
A11
A5
AC23
VSS39
VSS41
VSS43
VSS44
VSS45
VSS46
VSS47
VSS48
VSS49
VSS50
AA21
MSM6280 Reference Rev.B : AA21 -> NC
AC23: VSS_DIG
AA6
AC4
AE1
AE2
AE25
AE26
AF1
AF2
AF25
AF26
C
W19
AC26
AD25
T16
W8
AC16
SPK_AMP_EN
w18 (Analog VSS guard ring for CODEC)
T11
AB26
R15
W18
W26
H16
R14
W16
A17
R13
V26
D15
P15
F15
C1
F
NC
P14
U19
P13
D16
N15
P12
H15
D19
P26
N14
PA_R0
N13
D13
VSSA1
VSSA2
VSSA3
VSSA4
VSSA5
VSSA6
VSSA7
VSSA8
VSSA9
VSSA10
VSSA11
VSSA12
VSSA13
VSSA14
VSSA15
VSSA16
N12
A21
U201-2
MSM6245_B
M15
AC25
VSS_PAD3_0
VSS_PAD3_1
A15
VSS_PAD3_2
A9
VSS_PAD3_3
C26
E
VSS_DIG_0
VSS_DIG_1
VSS_DIG_2
VSS_DIG_3
VSS_DIG_4
VSS_DIG_5
VSS_DIG_6
VSS_DIG_7
VSS_DIG_8
VSS_DIG_9
VSS_DIG_10
VSS_DIG_11
VSS_DIG_12
VSS_DIG
B17
M14
AB25
RESERVED
R26
RX_QM
RX_QP
RX_IM
RX_IP
Y25
C244
0.01u
10%
(PLLOUT_TEST)
VSS_PAD2_0
VSS_PAD2_1
VSS_PAD2_2
M13
AA25
AF15
M11
V23
V25
W25
VDD_PAD1_0
VDD_PAD1_1
VDD_PAD1_2
VDD_PAD1_3
VDD_PAD1_4
VSS_PAD1_0
VSS_PAD1_1
VSS_PAD1_2
VSS_PAD1_3
U1
VSS_PAD1_4
R1
M12
F12
F1
K1
M1
L11
L16
B13
K10
A13
H19
TX_QM
TX_QP
TX_IM
TX_IP
DAC_REF
B12
TX_AGC_ADJ
TRK_LO_ADJ
H8
A12
R213
F6
2K
TCXO_EN
PA_ON
B14
LCD_IF_MODE_1
B24
Close to MSM
H18
G25
D25
RCV_EN_N
F18
H10
F10
D9
GSM_PA_BAND
GSM_PA_EN
A8
B8
G23
BT_CLK
BT_SBST
BT_SBCK
BT_SBDT
BT_TX_RX_N
BT_DATA
F23
E26
E25
H21
R19
for VSS_THERMAL
D
VDD_EF_USE
MDDIH_STBN
MDDIH_STBP
MDDIH_DATN
B20
MDDIH_DATP
MDDIC_DATP
A23
MDDIC_DATN
B22
MDDIC_STBP
B23
MDDIC_STBN
R16
B19
A20
A19
P25
PA_POWER_CTL
GSM_PA_DAC_REF
A22
AD26
L19
J26
J25
K26
H23
G21
K23
E23
J19
C25
D21
B3
D22
L15
CAMIF_DATA9_GPIO61
CAMIF_DATA8_GPIO60
CAMIF_DATA7_GPIO59
CAMIF_DATA6_AUX_TDO_GPIO58
CAMIF_DATA5_AUX_TDI_GPIO57
CAMIF_DATA4_AUX_TMS_GPIO56
CAMIF_DATA3_AUX_TCK_GPIO55
CAMIF_DATA2_AUX_TRST_N_GPIO54
CAMIF_VSYNC_GPIO16
CAMIF_HSYNC_GPIO15
CAMIF_PCLK_GPIO82
CAMIF_DATA0_GPIO83
CAMIF_DATA1_GPIO81
GPIO19
GPIO17
SYNTH1_GPIO41
RINGER_GPIO18
F16
F20
D20
I2C_SCL_GPIO27
K21
I2C_SDA_GPIO26
N16
U21
AE9
SBST
SBDT
L21
SBCK
AF9
J23
W11
H26
AC10
MMC_CMD_GPIO30
MMC_DATA_SDCC_DAT0_GPIO32
MMC_CLK_SDCC_CLK_GPIO31
AC11
AA11
D
L14
T12
H14
W12
M16
AA12
USB_DAT_VP
N23
USB_SE0_VM
N25
USB_OE_TP_N
AC12
N26
AF12
AE12
UART3_CTS_N_GPIO86
UART3_DP_RX_DATA_GPIO85
M19
UART3_DP_TX_DATA_GPIO84
D6
GPIO40
D7
GPIO42
AA13
L23
AE14
W13
AC13
M21
T13
UART2_RFR_N_GPIO91
UART2_CTS_N_GPIO90
UART2_DP_TX_DATA_GPIO88
AA14
AC14
A2_20_GPIO34
A2_19
A2_18
A2_17
A2_16
A2_15
A2_14
A2_13
A2_12
A2_11
A2_10
A2_9
A2_8
A2_7
A2_6
A2_5
A2_4
A2_3
A2_2
A2_1
F4
AF13
GRFC8_GPIO11
GRFC7_GPIO10
GRFX6_GPIO9
GRFC5_AUX_SBST_GPIO8
GRFC4_AUX_SBCK_GPIO7
GRFC3_GPIO6
GRFC2_GPIO5
GRFC1_AUX_SBDT_GPIO4
GRFC0_GPIO3
E4
AC5
G6
AF3
C230
0.1uF
F26
K19
UART1_CTS_N_GPIO97
UART1_DP_RX_DATA_GPIO96
L26
UART1_DP_TX_DATA_GPIO95
D8
GPIO44
F7
GPIO39
F14
GPIO64
AC6
AE4
C229
0.1uF
C228
0.01u
C227
0.01u
C226
0.01u
TP200 WDOG monitoring
H25
AUX_PCM_CLK_GRFC14_GPIO80
N21
AUX_PCM_DIN_GRFC13_GPIO14
G4
AUX_PCM_DOUT_GRFC12_GPIO103
J8
AUX_PCM_SYNC_GRFC11_GPIO102
H12
TX_ON_GRFC10
M23
AE5
P21
UART1_RFR_N_PA_POWER_CTL_M_GPIO98
P16
AF5
AA7
GPIO45
GPIO53
GPIO52
GPIO51
B7
GPIO50
F9
GPIO49
W9
AA8
AC7
TRST_N
TCK
TMS
TDI
TDO
RTCK
A7
AC8
AD2
GP_PDM2_PA_RAN_GE1
H17
GP_PDM1_PA_RAN_GE0
KEYSENSE0_N_GPIO62
LCD_ADS
AA9
AE7
LCD_MAKER_ID
LCD_VSYNC
D17
A4
(ADS signal for LCD)
W10
D2_15
D2_14
D2_13
D2_12
D2_11
D2_10
D2_9
D2_8
D2_7
D2_6
D2_5
D2_4
D2_3
D2_2
D2_1
D2_0
C221
0.1uF
C
AE3
A18
L12
C
AC9
MSM6245_A
D10
NAND & LCD
AA10
KEYSENSE4_N_GPIO48
KEYSENSE3_N_GPIO47
KEYSENSE2_N_GPIO46
F
OE2_N
WE2_N
AE10
LB2_N_A2_0
T14
NAND2_FLASH_READY_GPIO33
AF4
P19
KEYSENSE1_N_GPIO63
R21
EBI2_DATA(15)
EBI2_DATA(14)
EBI2_DATA(13)
EBI2_DATA(12)
EBI2_DATA(11)
EBI2_DATA(10)
EBI2_DATA(9)
EBI2_DATA(8)
EBI2_DATA(7)
EBI2_DATA(6)
EBI2_DATA(5)
EBI2_DATA(4)
EBI2_DATA(3)
EBI2_DATA(2)
EBI2_DATA(1)
EBI2_DATA(0)
Q_IM_CH1
Q_IP_CH1
I_IM_CH1
I_IP_CH1
Q_IM_CH0
Q_IP_CH0
I_IM_CH0
I_IP_CH0
U201-1
UB2_N
W14
XMEM2_CS_N0
AF7
D14
EBI2_DATA(0:15)
AF10
R23
LCD_CS_N
NAND_CLE
NAND_CS_N
EBI2_OE_N
EBI2_WE_N
NAND_ALE
NAND_READY
C225
0.01u
C220
0.1uF
C219
0.1uF
C218
0.01u
M26
T25
22n
22n
C210
C211
AF20
AE20
AA20
AF22
AF21
AE19
AF19
AC20
AC21
AC19
AA19
AC22
AA18
T15
AF18
W17
AE18
AA17
LINE_ON
LINE_OP
HPH_R
HPH_L
EAR1ON
EAR1OP
MICBIAS
AUXOUT
HPH_VREF
LINE_L_IP
LINE_L_IN
LINE_R_IP
LINE_R_IN
AUXIN
AUXIP
MIC2N
MIC2P
MIC1N
MIC1P
CCOMP
AC17
AB23
Y21
AC18
V19
W21
AA23
V21
AD1
AE22
AE21
BOOT_MODE
BOOT_MODE2
BOOT_MODE3
HKAIN0
HKAIN1
HKAIN2
HKAIN3
HKAIN4
HKAIN5
Y23
U23
MODE2
MODE1
MODE0
T21
AE17
AA4
RESIN_N
RESOUT_N
RESOUT_N_EBI1
WDOG_EN
F11
F13
B10
A16
B16
A10
D18
W6
V2
L2
M6
V8
U4
U8
AA2
XMEM2_CS_N1
AF14
LCD_CS_N_GPIO38
C223
1000p
C217
0.01u
M25
TX_AGC_ADJ
L13
TRK_LO_ADJ
F19
TCXO_EN_GPIO94
F17
PA_ON0
AC15
C222
1000p
C216
0.1uF
F25
H13
Q_OUT_N
Q_OUT
I_OUT_N
I_OUT
DAC_REF
C215
0.01u
AE16
220n
C203
LINE_N
LINE_P
R208
R209
VBAT_TEMP
AMUX_OUT
VBAT_SENSE
R205
51K
51K
R206
51K
NA
R202
R201
150K
R204
51K
RESIN_N
RESOUT_N
SLEEP_CLK
TCXO_MSM
R207
K8
G1
N4
Y4
AB1
P8
P11
P2
P6
P1
N1
N2
N6
N11
N8
M8
M4
51
WDOG_STB_SBCK1_GPIO0
SBDT1_GPIO1
PA_ON1_GPIO2
GRFC9_GPIO12
CAMCLK_PO_GP_MN_GPIO13
GPIO28
USB_RX_DATA_GPIO29
XMEM2_CS_N2_GPIO35
XMEM2_CS_N3_GPIO36
LCD_EN_GPIO37
GPIO43
SYNTH2_GPIO65
GPIO66
XMEM1_CS_N1_GPIO76
XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77
UART3_RFR_N_GPIO87
UART2_DP_RX_DATA_GPIO89
SYNTH0_GP_PDM0_GPIO92
SBST1_GPIO93
C214
0.01u
F21
E2
SDCC_DAT1_GPIO99
SDCC_DAT2_GPIO100
SDCC_DAT3_GPIO101
MDP_VSYNC_SECONDA_GPIO104
MDP_VSYNC_PRIMARY_GPIO105
C213
0.01u
D23
D2
MSM pin W18
(CODEC VSS)
D4
D1
AB2
B
C209
0.1uF
Place near
C212
0.1u
10%
B26
J6
AB4
C206
10u
AE8
P4
H4
G2
VREG_MSMA_2.6V
C205
4.7u
AC2
J2
J4
VREG_MSMP_2.7V
(CAD : 10uF=>Input MSMA_2.6V)
C204
10p
B1
K6
VREG_MSME_1.8V
B2
B25
L8
K4
J1
VREG_MSMC_1.25V
W2
L6
150K : 680K : 2.13V
150K : 750K : 2.17V
A26
V4
U6
150K : 300K : 1.73V
2012 10uF 6.3V +80/-20% Ceramic
H2
R11
47p
A25
E1
C201
C2
Y2
Y1
1
150K : 150K : 1.30V
150K : 470K : 1.97V
1005 0.1uF 16V +80/-20%
VDD_DIG_0
VDD_DIG_1
VDD_DIG_2
VDD_DIG_3
VDD_DIG_4
VDD_DIG_5
VDD_DIG_6
VDD_DIG_7
VDD_DIG_8
VDD_DIG_9
VDD_DIG_10
VDD_DIG_11
VDD_DIG_12
W4
V6
1
A
150K : 100K : 1.04V
PMIC_AUXIN[1]
PMIC_AUXIN[2] - PA_THERM
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
VSS13
VSS14
VSS15
VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
VSS35
VSS36
VSS37
VSS38
R4
1
8-bit, NAND, Normal
16-bit, NAND, Normal
8-bit, NAND, Trusted
16-bit, NAND, Trusted
150K : 47K : 0.62V
150K : 68K : 0.81V
Near to MSM
47p
A2
T2
T1
R6
TCXO
USB_XTAL48_IN
USB_XTAL48_OUT
SLEEP_XTAL_IN
SLEEP_XTAL_OUT
R8
A1_22
A1_21
A1_20
A1_19
A1_18
A1_17
A1_16
A1_15
GPIO_74
GPIO_73
GPIO_72
GPIO_71
GPIO_70
GPIO_69
GPIO_68
GPIO_67
SDRAM1_D15
SDRAM1_D14
SDRAM1_D13
SDRAM1_D12
SDRAM1_D11
SDRAM1_D10
SDRAM1_D9
SDRAM1_D8
SDRAM1_D7
SDRAM1_D6
SDRAM1_D5
SDRAM1_D4
SDRAM1_D3
SDRAM1_D2
SDRAM1_D1
SDRAM1_D0
1
1
1
A1
E
T4
AUDIO
C200
C246
SDRAM
T6
300K
33nF
D
T8
ROM1_CLK_SDRAM1_CLK
XMEM1_CS_N2_SDRAM1_CS_N0
SDRAM1_CLK_EN
ROM1_ADV_N_SDRAM1_RAS_N
XMEM1_LWAIT_N_SDRAM1_CAS_N
XMEM1_HWAIT_N
WE1_N_SDRAM1_WE_N
A1_25_SDRAM1_DQM3_GPIO75
A1_23_SDRAM1_DQM2_GPIO78
UB1_N_SDRAM1_DQM1
LB1_N_SDRAM1_DQM0
OE1_N
XMEM1_CS_N0
SDRAM_DATA(31)
SDRAM_DATA(30)
SDRAM_DATA(29)
SDRAM_DATA(28)
SDRAM_DATA(27)
SDRAM_DATA(26)
SDRAM_DATA(25)
SDRAM_DATA(24)
SDRAM_DATA(23)
SDRAM_DATA(22)
SDRAM_DATA(21)
SDRAM_DATA(20)
SDRAM_DATA(19)
SDRAM_DATA(18)
SDRAM_DATA(17)
SDRAM_DATA(16)
SDRAM_DATA(15)
SDRAM_DATA(14)
SDRAM_DATA(13)
SDRAM_DATA(12)
SDRAM_DATA(11)
SDRAM_DATA(10)
SDRAM_DATA(9)
SDRAM_DATA(8)
SDRAM_DATA(7)
SDRAM_DATA(6)
SDRAM_DATA(5)
SDRAM_DATA(4)
SDRAM_DATA(3)
SDRAM_DATA(2)
SDRAM_DATA(1)
SDRAM_DATA(0)
L4
SDRAM_ADDR(0)
SDRAM_ADDR(1)
SDRAM_ADDR(2)
SDRAM_ADDR(3)
SDRAM_ADDR(4)
SDRAM_ADDR(5)
SDRAM_ADDR(6)
SDRAM_ADDR(7)
SDRAM_ADDR(8)
SDRAM_ADDR(9)
SDRAM_ADDR(10)
SDRAM_ADDR(11)
SDRAM_ADDR(12)
SDRAM_ADDR(13)
SDRAM_ADDR(14)
C
REV_B
Change 32 bit
L1
V1
A1_24_GPIO79
A1_1
A1_2
A1_3
A1_4
A1_5
A1_6
A1_7
A1_8
A1_9
A1_10
A1_11
A1_12
A1_13
A1_14
SDRAM_DATA(0:31)
SDRAM_WE_N
SDRAM_DQM(3)
SDRAM_DQM(2)
SDRAM_DQM(1)
SDRAM_DQM(0)
SDRAM_CLK
SDRAM_CS_N(0)
SDRAM_CLK_EN
SDRAM_RAS_N
SDRAM_CAS_N
SDRAM_ADDR(0:14)
B
1%R435
VREG_MSME_1.8V
220n
CLOCK
REV_B
C202
RESET
SDRAM
0
1
0
150K : 10K : 0.016V
HKADC[0] - AMUX_OUT
HKADC[1] - VBATT_SENSE
HKADC[2] - HDET1
HKADC[3] - TTY_ADC_DET
HKADC[4] - PCB_Rev_ADC
HKADC[5] - VBATT_TEMP
Native, ARM JTAG
0
0
1
HKADC(4):PCB_Rev_ADC
( Default Pull-Down)
0
BOOT_MODE3 BOOT_MODE2 BOOT_MODE1
HKADC
1%
MODE0
0
R12
VREG_MSMP_2.7V
ADC
0
36
A
VREG_MSMP_2.7V
VREG_MSMP_2.7V
MODE
MODE2 MODE1
E
CAMERA
USIM PMIC
USB MicroSD
R214
UART
R215
2.2K
2.2K
C247
0.1u
10%
1
2
3
4
5
6
Section
Date
Sign & Name
Designer
MAR.07.2007
Jaykay
Place near
MSM pin AD26
USB_D+
USB_DUSB_VBUS
VBATT
REMOTE_PWR_ON
UART_TXD
UART_RXD
VREG_CAM_AVDD_2.8V
(Check CAM_DATA PINOUT !!!!)
TP402
TP403
TP404
TP405
TP406
12
11
10
9
8
7
6
5
4
3
2
1
CTS
RTS
Sheet/
MODEL
U250/KU250
KU250
DSR
UTXD
URXD
PWR
VBAT VBAT
Sheets
2/4
NC4
NC3
NC2
Checked
ON_SW ON_SW
NC1
TX
RX
GND
UFLS
TX
RX
GND
DRAWING
MSM
NAME
Approved
2.5G
3G
UART
I2C_SDA
I2C_SCL
F
GSM_PA_RAMP
GSM_PA_PWR_CTL_REF
SSBDT_PM
SSBDT_RTR
MMC_CMD
MMC_DATA
MMC_CLK
USB_DAT
USB_SE0
USB_OE_N
PM_INT_N
PS_HOLD
CAM_DATA(7)
CAM_DATA(6)
CAM_DATA(5)
CAM_DATA(4)
CAM_DATA(3)
CAM_DATA(2)
CAM_DATA(1)
CAM_DATA(0)
CAM_VSYNC
CAM_HSYNC
CAM_PCLK
CAM_LDO_EN
MEGA_CAM_PWR_DOWN
LCD_BL_CTRL
MEGA_CAM_RESET_N
EAR_SENSE_N
KEYPAD
USIM_CLK
USIM_RST_N
USIM_DATA
MMC_CD
UART_RXD
(NAND_BOOT_ERR) UART_TXD
KEY_COL(0)
KEY_COL(1)
KEY_COL(2)
KEY_COL(3)
KEY_COL(4)
KEY_ROW(4)
KEY_ROW(3)
KEY_ROW(2)
KEY_ROW(1)
KEY_ROW(0)
E
LG Electronics Inc.
7
8
DRAWING
REV_1.0
NO.
9
LG(42)-A-5505-10:01
LG Electronics Inc.
LGMC
- 144 -
7. CIRCUIT DIAGRAM
6
7
8
9
10
11
12
VREG_TCXO_2.85V
A
HYC0UEH0MF3P-6SS0E
VDD_MSM : 0.1uF
VDD_ANA : 0.1uF
VDD_RUIM : 0.1uF
VDD_RF : 0.1uF
VDD_WLAN : 0.1uF
VDD_MAIN : 0.1uF
VDD_SPKR : 0.1uF
C305
C307
C308
C310
0.1u
4.7u
4.7u
C304
C306
0.1u
0.1u
C303
0.1u
0.1u
0.1u
C301
C302
0.1u
1u
C316
+VPWR
+VPWR
+VPWR
2.2u
C311
1u
64
1u
59
53 51
52
R306
51 51K
50
R307
49 51K
R308
48
47
TP308
45
44
43
SLEEP_CLK
LCD_LDO_EN
1
USIM_P_RST_N
VREG_MSMP_2.7V
2
D
MC-146_7pF
32.768KHz
REV_D
1608
C344
C358
22u
REV_E
Power Line --> Route carefully!!!!!
Draw the Artwork_line thickly !!!!!
--->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-
0.1u
4.7u
1608
C389
C340
2.2u
E
F
2
GND1
5
GND2
VREG_LCD_2.8V
C345
1u
C346
1u
VREG_MSME_1.8V
MEMORY
3
4
Artwork --> Place resistor and capacitor close to PM6650 !!
U302 R1114D281D-TR-F
3
VDD VOUT
4
NC
6
CE
PS_HOLD
VREG_MSMA_2.6V
X300
LCD LDO
1
4.7u
SSBDT_PM
46
1608
C339
2.2u
4.7uH L301
smd_2520h1_6_r
L300
4.7u
C434
1000p
1608
C433
0.1u
C343
C436
10u
4.7uH
smd_2520h1_6_r
4.7uH
VREG_RF_SMPS
C341
L305
+VPWR
C326
4.7u
C333
smd_1608h_9_r
TCXO_EN
+VPWR
TCXO_MSM
+VPWR
VREG_MSMP_2.7V
54
smd_1608h_9_r
55
+VPWR
USIM_RST_N
USIM_P_CLK
USIM_CLK
USIM_DATA
VREG_USIM_2.85V
VREG_MMC_3.0V
REV_B
MCP(512Mb NAND + 512Mb 1 piece SDRAM)
R304
56
KYBD_BACKLIGHT
PM_ON_SW_N
MOTOR_PWRUSIM_P_DATA
A2
A9
A10
R1
R2
R9
R10
470K
C323
PM_INT_N
TCXO_PM
58
57
VREG_RUIM
VDD_RUIM
60
NBL414R-F9J
BAT300
C338
XTAL_IN
121K
1%
12p
SLEEP_CLK
RUIM_RST(MPP6)
R303
61
41
42
RUIM_M_RST(MPP5)
40
VREG_MMC
VREG_MSME
VSW_MSME
VDD_MSME
RUIM_CLK(MPP10)
39
38
37
35
36
RUIM_M_CLK(MPP9)
VDD_MSMC
C336
4.7u
1608
VSW_MSMC
GP1_DRV_N(MPP7)
34
USB_D_M
33
USB_SE0
2.2K
VREG_MSMC
XTAL_OUT
RUIM_M_IO(MPP11)
SBDT
USB_D_P
C322
62
C337
VBACKUP
USB_VBUS
USB_DAT
0.1u
63
12p
66
65
VDD_WLAN
VREG_WLAN
CBL1PWR_N(MPP4)
68
69
70
71
72
67
VREG_RFRX2
VREG_RFRX1
VDD_RF
AMUX_IN1(MPP1)
AMUX_IN2(MPP2)
CBL0PWR_N(MPP3)
73
76
75
74
SPKR_BYP
VDD_SPKR
SPKR_IN_P
VREG_RFTX
SPKR_OUT_P
77
79
78
SPKR_IN_M
SPKR_OUT_M
80
82
83
84
81
VREG_SYNT
REF_OUT(MPP8)
VDD_MAIN
GND_SLUG
AMUX_OUT
SBCK
31
32
20
21
SBST
VREG_MSMP
USB_CTL_N
VDD_PA
19
VDD_ANA
VSW_5V
VREG_PA
18
TCXO_EN
TCXO_OUT
VDD_MSM
USB_OE_N
30
16
17
28
R309
VREG_MSMP_2.7V
15
USB_ID
VREG_5V
29
13
14
VREG_MSMA
U300
PM6650-2M
PON_RESET_N
VREG_USB
27
12
USB_CTL_N
USB_VBUS
USB_DAT
USB_D+
USB_SE0
USB_D-
VCOIN
PS_HOLD
FLSH_DRV_N
C435
22u
DNU0
DNU1
DNU2
DNU3
DNU4
DNU5
DNU6
+VPWR
AMUX_OUT
C312
11
C
REF_BYP
REF_GND
TCXO_IN
BAT_FET_N
26
10
1u
VREG_TCXO
85
0.1u
12p
C324
C327
Check if it is LOW enable.
MSM_INT_N
VBAT
KPDPWR_N
9
RESIN_N
VREG_MSME_1.8V
CHG_CTL_N
LCD_DRV_N
J7
H7
H8
B1
B2
B10
E5
F3
G1
G5
M3
M4
M7
N4
N7
N8
P1
P2
P3
P4
P5
P10
1608
REF_ISET
ISNS_M
VIB_DRV_N
0.1uF
8
ISNS_P
KPD_DRV_N
C321
0.1uF
6
7
USB_OE_N
B5
VCC0
N5
VCC1
NC0
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9
NC10
NC11
NC12
NC13
NC14
NC15
NC16
NC17
NC18
NC19
NC20
NC21
0.1uF
B8
D1
H1
H10
P8
M1
4
5
ADC_BYP
VCHG
25
0.1uF
C320
10K
3
ICHARGE
CHG_CTL_N
ICHARGEOUT
VBATT
BATT_FET_N
23
0.1uF
0.1uF
C319
R305
C332
VDD0
VDD1
VDD2
VDD3
VDD4
VDD5
C446
33u
B
VREG_MSMC_1.25V
F
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
A
0.1u
E
L4
L5
L6
L7
K8
L8
K7
K5
K6
G7
J6
J5
H6
H5
J4
G3
G4
F4
E4
F5
H3
H4
E6
F7
F6
D5
E8
D6
D8
D7
C8
C7
2
+5V_PWR
22
SDRAM_DATA(0)
SDRAM_DATA(1)
SDRAM_DATA(2)
SDRAM_DATA(3)
SDRAM_DATA(4)
SDRAM_DATA(5)
SDRAM_DATA(6)
SDRAM_DATA(7)
SDRAM_DATA(8)
SDRAM_DATA(9)
SDRAM_DATA(10)
SDRAM_DATA(11)
SDRAM_DATA(12)
SDRAM_DATA(13)
SDRAM_DATA(14)
SDRAM_DATA(15)
SDRAM_DATA(16)
SDRAM_DATA(17)
SDRAM_DATA(18)
SDRAM_DATA(19)
SDRAM_DATA(20)
SDRAM_DATA(21)
SDRAM_DATA(22)
SDRAM_DATA(23)
SDRAM_DATA(24)
SDRAM_DATA(25)
SDRAM_DATA(26)
SDRAM_DATA(27)
SDRAM_DATA(28)
SDRAM_DATA(29)
SDRAM_DATA(30)
SDRAM_DATA(31)
B9
C1
H9
J1
P9
M2
1005
J8
DQM0
G6
DQM1
F8
DQM2
E7
DQM3
PMIC VPWR BYPASS
VDD_MSME : 4.7uF
REMOTE_PWR_ON
C325
VSS0
VSS1
VSS2
VSS3
VSS4
VSS5
D
SDRAM_DQM(0)
SDRAM_DQM(1)
SDRAM_DQM(2)
SDRAM_DQM(3)
SDRAM_DATA(0:31)
VREG_MSME_1.8V
1
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
C331
K4
L1
L2
L3
C2
D2
E1
D3
E2
D4
K3
F2
F1
C330
SDRAM_ADDR(0:12)
J10
K9
L9
M10
N9
C9
D10
E9
F10
G9
0.1uF
SDRAM_ADDR(0)
SDRAM_ADDR(1)
SDRAM_ADDR(2)
SDRAM_ADDR(3)
SDRAM_ADDR(4)
SDRAM_ADDR(5)
SDRAM_ADDR(6)
SDRAM_ADDR(7)
SDRAM_ADDR(8)
SDRAM_ADDR(9)
SDRAM_ADDR(10)
SDRAM_ADDR(11)
SDRAM_ADDR(12)
C
VDDQ0
VDDQ1
VDDQ2
VDDQ3
VDDQ4
VDDQ5
VDDQ6
VDDQ7
VDDQ8
VDDQ9
IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
0.1uF
N1
N2
N3
M5
P7
M6
N6
M8
C328
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
0.1uF
J3
BA0
K2
BA1
SDRAM_ADDR(13)
SDRAM_ADDR(14)
EBI2_DATA(0:7)
C329
100K
R302
RESOUT_N
_WEN
R_B
ALE
CLE
_RE
_WP
0.01u
NAND_ALE
NAND_CLE
EBI2_OE_N
16
15
VDD_MSMC : 4.7uF
REV_B
0.1u
B7
C6
C4
B4
B3
C3
EBI2_WE_N
NAND_READY
J9
K10
L10
M9
N10
C10
D9
E10
F9
G10
C334
NAND_CS_N
B
14
+VPWR
VSSQ0
VSSQ1
VSSQ2
VSSQ3
VSSQ4
VSSQ5
VSSQ6
VSSQ7
VSSQ8
VSSQ9
0.1uF
G8
CK
E3
CKE
B6
_CE
X16 SDRAM --> X32 SDRAM
C317
SDRAM_CLK
SDRAM_CLK_EN
C5
VSSN0
P6
VSSN1
C318
J2
_CS
K1
_WED
G2
_RAS
H2
_CAS
C335
R300
51K
VREG_MSMP_2.7V
R301 100K
REV_B
SDRAM_CS_N(0)
SDRAM_WE_N
SDRAM_RAS_N
SDRAM_CAS_N
24
U301
13
VREG_BT_2.85V
5
VREG_SYNTH_2.6V
GSM_PA_PWR_CTL_REF
4
3
2
RUIM_IO(MPP12)
VSW_PA
1
C
C
CAMERA LDO
U303 RT9011-MGPQW
1
8
VIN
VOUT1
2
7
EN1
VOUT2
6
3
NC2
EN2
4
5
NC1
GND
ICHARGEOUT
+VPWR
C349
1u
USB_VBUS
0.1
6
QST4
MMC_CLK
VSS
DAT0_DO
L302
56nH
USB_CTL_N
D
C447
1u
+5V_PWR
BATT_FET_N
6
C350
1u
5
Q302
QST4
C1
GND3 GND4
1
2
ICHARGE
Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT
U305
5
+VPWR
8
WLED_PWR
11
REV_B
100K
R380
REV_C
IN
C357
1u
4
9
C17
C2+
CP
C2EN_SET
GND
E
AAT3157ITP-T1
10
C1+
6
1
D1
2
D2
3
D3
12
NC
C354
1u
Section
Date
Sign & Name
C356
1u
Designer
MAR.07.2007
Jaykay
Sheet/
MODEL
OJ302
3/4
WLED_1
WLED_2
WLED_3
Checked
OJ303
MEM & POWER
NAME
Approved
LG Electronics Inc.
1
2
3
4
5
6
7
8
Sheets
KU250
U250/KU250
DRAWING
OJ301
3 B
CHG_CTL_N
LCD_BL_CTRL
OJ300
C2
LCD BACKLIGHT
REV_B
C355
1u
F
4
REV_D
33p
VA306
EVLC18S02003
VA305
EVLC18S02003
VA303
EVLC18S02003
R318
E
MMC_DATA
C351
0.1u
VA304
EVLC18S02003
470K
DAT1_RSV
GND
VREG_USIM_2.85V
USIM_P_RST_N
USIM_P_CLK
EVLC18S02003
VA302
USIM_P_DATA
C353
CLK_SCLK
2
VREG_CAM_DVDD_1.5V
VIN
VOUT
3
4
GND BGND
2
6
STBY
NC
1
5
U501
BH15LB1WHFV
CAM_LDO_EN
smd_1005h_5_r
MMC_CD
MMC_CMD
VDD
EVLC18S02003
VA300
CD_DAT3_CS
CMD_DI
J300 HSSC-8P-18
1
GND1
VCC
2
VPP
RST
3
CLK
IO
4
RSV2 RSV1
11
GND2 GND5
12
EVL14K02200
VA301
DAT2_RSV
+VPWR
smd_1005h_5_r
5
6
7
8
9
10
3 B
C2
C1
1
G
D1 D2
R317
0.1u
100K
USIM
4
15K
C352
R315
S300
SCHA1A0100
GND
VREG_MMC_3.0V
0
R316
100K
R314
D
5
Q300
S
VBATT
R313
D3 D4
C348
1u
9
C347
1u
SI3493DV-E3
Q301
VREG_CAM_AVDD_2.8V
VREG_CAM_DVDD_1.8V
PGND
+VPWR
CAM_LDO_EN
T-FLASH
CHARGER
DRAWING
REV_1.0
NO.
9
LG(42)-A-5505-10:01
LG Electronics Inc.
LGMC
- 145 -
7. CIRCUIT DIAGRAM
1
2
3
4
5
7
6
9
8
10
11
LCD CONNECTOR
12
14
13
16
I/O CONNECTOR
2.2K
VREG_MSMP_2.7V
15
MICBIAS
R400
3
4
C400
0.1u
FL400
L400
56nH
TP401
5
MOTOR_PWR-
5
3
2
8
7
6
R410
VREG_MSMP_2.7V
FL405
80.6K
1
LCD_MAKER_ID
VREG_LCD_2.8V
WLED_1
WLED_2
WLED_3
WLED_PWR
0.1u
C409
PLW0501H-LF
D402
D
VBAT
20
22
C
REV_1.0
VBAT_GND
INSTPAR
VA409
VA410
EVL14K02200
EVL14K02200
1
2
3
4
VBAT_TEMP
EVL14K02200
INOUT_B4
EBI2_DATA(12)
EBI2_DATA(13)
EBI2_DATA(14)
EBI2_DATA(15)
9
EVL14K02200
INOUT_A4
G1
4
INOUT_B3
10
C
4
INOUT_B2
INOUT_A3
VA408
3
5
INOUT_B1
INOUT_A2
3
B
CN402
REV_B : Change Pin Description
INOUT_A1
IN
G1
NTS104B
EVL14K02200
2
G2
1
G2
1
VA407
ICVE21184E150R500FR
6
OUT
4
USB_VBUS
UART_TXD
UART_RXD
C404 0.1uF
10
9
8
REV_B
VA490
FL403
2
47p
6
REMOTE_PWR_ON
+5V_PWR
47p
7
470K
10
5
8
11
7
FL404
R407 100ohm
C408
INOUT_B4
12
33u
C1005X7R1H471KT
INOUT_B3
G1
INOUT_A3
INOUT_A4
13
VBAT_SENSE
EBI2_DATA(8)
EBI2_DATA(9)
EBI2_DATA(10)
EBI2_DATA(11)
9
680K
4
INOUT_B2
R409
3
14
INOUT_B1
INOUT_A2
47n
C403
16
15
INOUT_A1
G2
2
C402
R406 100ohm
EAR_SENSE_N
VBATT
R408
1
HPH_L
HPH_R
33u
USB_D+
USB_D-
19
18
C401
FL402
ICVE21184E150R500FR
17
21
19
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
MIC2N
MIC2P
C407
G2
10
20
U400
NCS2200SQ2T2G
RB521S-30
C432 470p
INOUT_A4
22
21
3
4
10K
R404
SD12T1G
INOUT_B4
23
2
VIN-
VIN+
1u
INOUT_A3
4
3
VCC
GND
C406
INOUT_A2
INOUT_B3
1
OUT
D401
24
INOUT_B2
HOOK_KEY
2
D400
EBI2_DATA(4)
EBI2_DATA(5)
EBI2_DATA(6)
EBI2_DATA(7)
EVL14K02200
6
1
EVL14K02200
7
INOUT_A1
VA405
8
26
25
INOUT_B1
CN401
HSEJ-18S04-25R
51K
VA404
9
R403
VREG_MSMP_2.7V
+VPWR
TP400
ICVE21184E150R500FR
FL401
A
5.1K
EBI2_DATA(0)
EBI2_DATA(1)
EBI2_DATA(2)
EBI2_DATA(3)
2
0.01u
INOUT_A4
EVL14K02200
INOUT_A3
INOUT_B4
C405
INOUT_A2
INOUT_B3
VA403
INOUT_A1
INOUT_B2
EVLC18S02003
INOUT_B1
EVLC18S02003
6
6
R402
7
EVL14K02200
7
VA401
5
10
28
27
8
VA400
G1
INOUT_A4 INOUT_B4
29
8
LCD_CS_N
LCD_ADS
EBI2_WE_N
EBI2_OE_N
9
1M
INOUT_A3 INOUT_B3
100K
4
30
INOUT_A2 INOUT_B2
R405
31
INOUT_A1 INOUT_B1
G2
2
3
10
1
G1
32
G2
LCD_RESET_N
LCD_IF_MODE_0
LCD_IF_MODE_1
LCD_VSYNC
34
33
G1
ICVE21184E150R500FR
35
5
A
1
5
9
B
R401
ICVE21184E150R500FR
VA402
CN400
KEY_BACK_LIGHT LED(8EA)
D
+VPWR
LD400
LEBB-S14H
LD403
LEBB-S14H
LD406
LEBB-S14H
R411
100ohm
R414
100ohm
R417
LD404
LEBB-S14H
LD407
LEBB-S14H 100ohm
R418
100ohm
LD402
LEBB-S14H
LD405
LEBB-S14H
R413 100ohm
LD408
LEBB-S14H
R416 100ohm
R419 100ohm
100ohm
REV_B : EDLH0013501 --> EDLH0006001
CAMERA
AUDIO
10
R422
10
10
7
IN1
NC2
NC1
GND
5
END
PM_ON_SW_N
KEY MAP
F
1
3
5
7
CLR
MENU
LEFT
UP
OK
RIGHT
SND
SEARCH
DN
BACK
REV_B
C449
KEY_ROW(0)
MIC
NA
10p
C413
C448
C415
10p
0.1u
NA
C414
C411
C412
0.1uF
1u
RCV+
EVL14K02200
VA414
6
EVL14K02200
8
15
21
6
17
13
14
16
VREG_MSMP_2.7V
R421
R437 20
VREG_CAM_AVDD_2.8V
VREG_CAM_DVDD_1.8V
END
RCV_EN_N
IN2
COM1
4
RCV-
SPK_RCV+
8
2
4
6
8
SPK_RCV-
I2C_SCL
I2C_SDA
MEGA_CAM_RESET_N
CAM_MCLK
SPK+
9
100K
COM2
100K
NO2
NO1
3
RA400
VCC
2
SPK-
R423
C410
0.01u
CAM_PCLK
CAM_VSYNC_OUT
CAM_HSYNC_OUT
MEGA_CAM_PWR_DOWN
DGND1
DGND2
DGND3
AGND1
AGND2
DVDD
VDDIO
AVDD
CN403
1
+VPWR
REV_1.0
R436 0
20
19
18
12
11
10
9
7
PCLK
VSYNC
HSYNC
STANDBY
SCK
SDA
RESETB
MCLK
VA412
32
31
30
29
28
27
26
25
D0
D1
D2
D3
D4
D5
D6
D7
E
U401
NLAS5223BMNR2G
PGND1
PGND2
PGND3
PGND4
PGND5
PGND6
PGND7
PGND8
22
23
24
1
2
3
4
5
CAM_DATA_OUT(0)
CAM_DATA_OUT(1)
CAM_DATA_OUT(2)
CAM_DATA_OUT(3)
CAM_DATA_OUT(4)
CAM_DATA_OUT(5)
CAM_DATA_OUT(6)
CAM_DATA_OUT(7)
KYBD_BACKLIGHT
SELECT_SPK&RCV
MEGA CAMERA CONNECTOR
E
F
R415
400
401
402
1
2
3
403
404
405
4
5
6
406
407
408
KEY_ROW(1)
MICBIAS
COMMON_CAM_MCLK
FL406
6
FL407
D
ICVE21184E150R500FR
INOUT_B2
INOUT_A3
INOUT_B3
INOUT_A4
INOUT_B4
5
CAM_DATA_OUT(6)
CAM_DATA_OUT(7)
CAM_VSYNC_OUT
CAM_HSYNC_OUT
8
7
6
1
SPK_AMP_EN
REV_C : 20K --> 3K
20
19
18
17
16
P20
P19
P18
P17
P16
GND7
GND8
GND3
0.1u
0.1u
R428 5.6K
R426
2
20K
_SD
9
HOT401
HOT4
0
HOT3
KEY_ROW(4)
KEY_COL(0)
KEY_COL(1)
KEY_COL(2)
KEY_COL(3)
KEY_COL(4)
D
KEYS
OUTB
8
SPK-
7
BYPASSU402 VM
6
VP
3
INP
4
INM
R430 5.6K
OUTA
+VPWR
E
5
SPK+
C428
1u
R431
20K
C425
10u
C431
NA
Section
Date
Sign & Name
Designer
MAR.07.2007
Jaykay
Sheet/
MODEL
Checked
KEY / MMI
LCD/CAMERA
DRAWING
CAM_DATA_OUT(1)
CAM_DATA_OUT(2)
CAM_DATA_OUT(3)
CAM_DATA_OUT(4)
Sheets
KU250
U250/KU250
4/4
CAM_HSYNC_OUT
CAM_VSYNC_OUT
CAM_DATA_OUT(7)
CAM_DATA_OUT(6)
VA430
6
P6
7
P7
8
P8
9
P9
10
P10
GND2
EVL14K02200
15
P15
14
P14
13
P13
12
P12
11
P11
GND1
F
GND6
C422
C423
GND5
CN404
GND4
NA
CAM_PCLK
CAM_DATA_OUT(0)
1K
1K
C4275600p
LINE_N
LINE_P
R427
R429
C4265600p
C424
VGA_CAM_RESET_N
I2C_SCL
I2C_SDA
1
P1
2
P2
3
P3
4
P4
5
P5
VREG_CAM_DVDD_1.5V
COMMON_CAM_MCLK
REV_1.0
8
409
MIC1N
NCP2890DMR2
VT_CAMERA_CONNECTOR
VREG_CAM_AVDD_2.8V
7
HOT400
KEY_ROW(3)
MIC1P
Audio AMP
FL408
E
0.1u
REV_B : EDTY0008606 --> EDTY0008601
10
G1
4
INOUT_A2
9
0.1u
C419
C429
C430
3
INOUT_B1
C418
1000p
1000p
2
INOUT_A1
G2
CAM_DATA(6)
CAM_DATA(7)
CAM_VSYNC
CAM_HSYNC
1
39p
7
39p
INOUT_B3
INOUT_B4
2.2K
INOUT_B2
INOUT_A3
INOUT_A4
C421
INOUT_A2
C420
4
R425
1
2
CAM_DATA_OUT(3)
CAM_DATA_OUT(4)
CAM_DATA_OUT(5)
8
INSTPAR
3
9
D404
6
INOUT_B1
10
5
7
INOUT_A1
D403
PSD05-LF
INOUT_B4
1
2
INSTPAR
INOUT_B3
CAM_DATA(3)
CAM_DATA(4)
CAM_DATA(5)
PSD05-LF
INOUT_B2
INOUT_A3
INOUT_A4
CAM_DATA_OUT(0)
CAM_DATA_OUT(1)
CAM_DATA_OUT(2)
G2
INOUT_A2
9
8
10
4
INOUT_B1
G1
3
INOUT_A1
5
2
G2
1
G1
CAM_DATA(0)
CAM_DATA(1)
CAM_DATA(2)
MIC400
OB4-15L42-C33L
ICVE21184E150R500FR
C
KEY_ROW(2)
R424
2.2K
REV_1.0
ICVE21184E150R500FR
C417
47p
C416
10u
REV_B : SUMY0010301 --> SUMY0003802
L401
100nH
RCVN
L402
100nH
RCVP
NAME
Approved
SPK_RCVSPK_RCV+
CAM_DATA_OUT(5)
REV_E : For Antenna Radiation
LG Electronics Inc.
1
2
3
4
5
6
7
8
DRAWING
REV_1.2
NO.
9
LG(42)-A-5505-10:01
LG Electronics Inc.
LGMC
- 146 -
LGMC
- 147 -
U250/KU250
8. PCB LAYOUT
LGMC
- 148 -
U250/KU250
8. PCB LAYOUT
9. Calibration & RF Auto Test Program (Hot Kimchi)
9. Calibration & RF Auto Test Program (Hot Kimchi)
9.1 Configuration of HOT KIMCHI
9.1.1 Configuration of directory
C:
Cm_Grut
Common
dll_serialat
LG_CL_009.dll
Log
At_Serial_Cmd.xml
Diag_NV6250_RevB.dll
Diag_NV6275.dll
Diag_NV.dll
DLL_E5515CD.DLL
DLL_PwrControlD.dll
Dll_SerialATD.dll
LG_CL_011.dll
PwrSupply_Cmd.xml
Debug
: Directory
: File
- 149 -
Auto
KU250
Cal
KU250
CalAuto
KU250
9. Calibration & RF Auto Test Program (Hot Kimchi)
Hot_Kimchi
Debug
image
Log
ComLMPLib_11.dll
Dll_EzLooksMQ_004.dll
GuiTk115d.dll
HK_25.exe
ijl11.dll
SBCmd.xml
ShieldBox_DllD.dll
Model
KU250
Log
LG_RfTest_E5515C_211.dll
AutoSetup_110.xml
QMSL_MSVC6R.dll
Cal_Setup_Test.xml
Ezlooks.xml
LG_RfCal_Q3G6280N_Polar_006.dll
Procedure_KU250_103.xml
script_auto_001.xml
: Directory
script_cal_003.xml
: File
Spec_3GPP_030.xml
- 150 -
9. Calibration & RF Auto Test Program (Hot Kimchi)
dll,ocx
(Win98)MFCD DLL COPY.bat
(Win2000)MFCD DLL COPY.bat
(WinXP)MFCD DLL COPY.bat
MFC42D.DLL
MFCD42D.DLL
MFCN42D.DLL
MFCO42D.DLL
MSVCP60D.DLL
MSVCRTD.DLL
Vsflex7L.ocx
vsflex7l_ocx_regist.bat
Result
UI
Auto
KU250
Cal
KU250
CalAuto
KU250
image
result.bmp
LG_UI_Ad6500_002.dll
LG_UI_EmKU250_001.dll
: Directory
LG_UI_Qu6250_003.dll
: File
LG_UI_Qu6275_004.dll
1.
_New_HK_0808.reg
- 151 -
9. Calibration & RF Auto Test Program (Hot Kimchi)
9.2 How to use HOT KIMCHI
➀
➁
➂
* Procedure
1. Click “Logic Operation” of “SETTING” menu bar
2. Select “UART Port” that PC can communicate with the phone
3. Select “LOGIC MODE” that you want
- Logic Mode -> 1: Calibration Only
- 152 -
9. Calibration & RF Auto Test Program (Hot Kimchi)
KU250
➄ Click "Start"
➃
Select "U250/KU250"
* Procedure
4. Select the model name “U250/KU250”
5. Click “Start” button
- 153 -
10. Factory Test Mode
10. Factory Test Mode
10.1. Test Program Setting
1) Open “LG FTM GUI”
2) Click “Options >> Port Settings”
3) Select Com Port and click “OK”
- 154 -
10. Factory Test Mode
10.2. WCDMA Test Mode
1) Click “Tools >> FTM GUI WCDMA”
2) Select “FTM” Mode
3) Select RF Frequencies, insert “9750” in “Uplink chan” and push “Enter”. Then “2140” is
written at Rx UHF automatically.
4) For Deciding to “TX AGC”, insert 380 as a maximum value . And then WCDMA Power is
decided.
5) To set PA Range, select ON in R1 for High power mode or select ON in R0 for Low power
mode.
6) Depending on a situation, Click “Tx On” or “Tx Off”.
Channel Select
Tx Control
7) Set Rx mode. Click LNA Range, 0~4.
8) Click “Get IM2” and “Get Rx AGC”. Confirm the value.
- 155 -
Rx Control
10. Factory Test Mode
10.3. GSM Test Mode
1) To switch GSM Mode, Select Mode -> GSM mode at menu commands
2) Select RF Mode, Click “GSM” or “GSM1800” or “GSM1900”
3) Write wanted channel. We usually set “1”
4) For Deciding to “PA DAC Value”, insert 14300 as a maximum value
5) Click “Tx On” or “Tx Off”.
6) SET RX mode. Click LNA Range, 0~4.
7) Click “RX ON”
Channel Control
Tx Power Control
- 156 -
Rx Gain Control
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.1 EXPLODED VIEW
32
35
31
28
29 30
22
20
19
17
18
15
16
36
13
12
34
8
5
6
7
4
3
33
2
1
24 25
23
37
14
10
11
9
- 157 -
26
27
- 158 -
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.2 Replacement Parts
<Mechanic component>
Level
Location
No.
1
Description
Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
Part Number
Spec
Color
IMT,BAR/FLIP
TIMT0000614
Black
Black
Remark
2
AAAY00
ADDITION
AAAY0219401
3
MCJA00
COVER,BATTERY
MCJA0040601
MOLD, PC LUPOY SC-1004A, , , , ,
Without Color
2
APAY00
PACKAGE
APAY0095904
U250 HIT Packing(P/Label66-Angle-9501)
Without Color
3
BSEA00
SUPPLEMENTARY PART
BSEA0003901
PACKING-LIST ENVELOPE
2
APEY00
PHONE
APEY0394202
Black
3
ACGK00
COVER ASSY,FRONT
ACGK0085601
Without Color
4
MCCC00
CAP,EARPHONE JACK
MCCC0043601
COMPLEX, (empty), , , , ,
Without Color
10
4
MCCG00
CAP,MULTIMEDIA CARD
MCCG0007601
COMPLEX, (empty), , , , ,
Without Color
4
4
MCJK00
COVER,FRONT
MCJK0069301
MOLD, PC LUPOY SC-1004A, , , , ,
Without Color
5
5
MICE00
INSERT,NUT
MICE0000601
COMPLEX, (empty), , , , ,
Without Color
5
MICE01
INSERT,NUT
MICE0000701
COMPLEX, (empty), , , , ,
Without Color
4
MFBC00
FILTER,SPEAKER
MFBC0029401
COMPLEX, (empty), , , , ,
Without Color
6
4
MFBZ00
FILTER
MFBZ0002801
COMPLEX, (empty), , , , ,
Without Color
9
4
MHGJ00
HOLDER,SPEAKER
MHGJ0001701
COMPLEX, (empty), , , , ,
Black
7
4
MKAZ00
KEYPAD
MKAZ0035901
COMPLEX, (empty), , , , ,
Without Color
11
4
MPBG00
PAD,LCD
MPBG0058301
COMPLEX, (empty), 1.2, , , ,
Without Color
12
4
MPBT00
PAD,CAMERA
MPBT0039101
COMPLEX, (empty), 1.2, , , ,
Without Color
8
4
MTAB00
TAPE,PROTECTION
MTAB0160501
COMPLEX, (empty), , , , ,
Without Color
1
4
MTAB01
TAPE,PROTECTION
MTAB0160601
COMPLEX, (empty), , , , ,
Without Color
13
4
MTAD00
TAPE,WINDOW
MTAD0065801
COMPLEX, (empty), 0.2, , , ,
Without Color
3
4
MWAC00 WINDOW,LCD
MWAC0077201
COMPLEX, (empty), 1.0, , , ,
Without Color
2
3
ACGM00
COVER ASSY,REAR
ACGM0087501
4
ENZY00
CONNECTOR,ETC
ENZY0019701
4 PIN,3.0 mm,ETC , ,H=5.8
4
MCCF00
CAP,MOBILE SWITCH
MCCF0042501
COMPLEX, (empty), , , , ,
4
MCJN00
COVER,REAR
MCJN0065501
MOLD, PC LUPOY SC-1004A, , , , ,
4
MHGZ00
HOLDER
MHGZ0028701
4
MLAB00
LABEL,A/S
4
MLAN00
4
36
Without Color
24
Black
29
Without Color
28
COMPLEX, (empty), , , , ,
Black
22
MLAB0001102
C2000 USASV DIA 4.0
White
27
LABEL,QUALCOMM
MLAN0000603
White,95C
MPBH00
PAD,MIKE
MPBH0029101
COMPLEX, (empty), , , , ,
Black
26
4
MPBN00
PAD,SPEAKER
MPBN0039001
CUTTING, NS, , , , ,
Black
18
4
MPBZ00
PAD
MPBZ0186001
COMPLEX, (empty), , , , ,
Without Color
19
4
MPBZ01
PAD
MPBZ0186801
COMPLEX, (empty), , , , ,
Without Color
25
- 159 -
Transparent
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
Description
Part Number
4
MTAB01
TAPE,PROTECTION
MTAB0178301
4
MTAD00
TAPE,WINDOW
4
Spec
Color
Remark
COMPLEX, (empty), , , , ,
Without Color
32
MTAD0065901
COMPLEX, (empty), 0.2, , , ,
Without Color
30
MWAE00 WINDOW,CAMERA
MWAE0024501
COMPLEX, (empty), 1.0, , , ,
Without Color
31
4
SJMY00
VIBRATOR,MOTOR
SJMY0007903
3 V,0.85 A,4*8 ,Height 5.8T Cylinder ,; ,3V , , ,11000 , , , ,
23
4
SNGF00
ANTENNA,GSM,FIXED
SNGF0023102
3.0 ,-2 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL ,;
,QUAD ,-2.0 ,50 ,3.0
20
3
MLAA00
LABEL,APPROVAL
MLAA0042001
COMPLEX, (empty), , , , ,
Without Color
6
MCBA00
CAN,SHIELD
MCBA0017101
COMPLEX, (empty), , , , ,
Without Color
6
MPBZ00
PAD
MPBZ0179301
COMPLEX, (empty), 0.6t, , , ,
Without Color
16
5
ADCA00
DOME ASSY,METAL
ADCA0064001
Without Color
14
5
MTAZ00
TAPE
MTAZ0186301
COMPLEX, (empty), 0.1, , , ,
Without Color
5
MLAZ00
LABEL
MLAZ0038301
PID Label 4 Array
Without Color
- 160 -
34
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.2 Replacement Parts
<Main component>
Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
Level
Location
No.
3
GMEY00
SCREW MACHINE,BIND
GMEY0011201
3
SAFY00
PCB ASSY,MAIN
SAFY0196602
4
SAFB00
PCB ASSY,MAIN,INSERT
SAFB0072901
5
ACKA00
CAN ASSY,SHIELD
ACKA0002101
5
SUMY00
MICROPHONE
SUMY0010301
FPCB ,-42 dB,4*1.5T ,Standard Holder
5
SUSY00
SPEAKER
SUSY0026801
ASSY ,8 ohm,88 dB, mm,wire 15mm ,; , , , , , ,18*10*3T
,WIRE
5
SVCY00
CAMERA
SVCY0014401
CMOS ,MEGA ,1.3M, Magnachip(1/4"), 8x8x5t, Socket
Type
5
SVCY01
CAMERA
SVCY0014301
CMOS ,VGA ,Socket type
5
SVLM00
LCD MODULE
SVLM0025001
MAIN ,176*220 (1.76") ,34*46.7*2.5(T) ,262k ,TFT ,TM
,NT3916(Novatek) ,NTSC:60%
4
SAFF00
PCB ASSY,MAIN,SMT
SAFF0117802
5
SAFC00
PCB ASSY,MAIN,SMT
BOTTOM
SAFC0088501
6
ANT103
ANTENNA,GSM,FIXED
SNGF0026001
3.0 ,-2.0 dBd, ,Bluetooth, SMD, 8.0*2.0*1.2 ,; ,SINGLE ,2.0 ,50 ,3.0
6
BAT300
BATTERY,CELL,LITHIUM
SBCL0001701
2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67,
phi 4.8, Pb-Free
6
C101
CAP,CHIP,MAKER
ECZH0000841
56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C103
CAP,CERAMIC,CHIP
ECCH0001002
180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C104
CAP,CERAMIC,CHIP
ECCH0001002
180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C106
CAP,CHIP,MAKER
ECZH0000846
8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C107
CAP,CERAMIC,CHIP
ECCH0000107
6 pF,50V,D,NP0,TC,1005,R/TP
6
C108
CAP,CERAMIC,CHIP
ECCH0001002
180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C109
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C110
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C112
CAP,CHIP,MAKER
ECZH0000816
12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C113
CAP,CERAMIC,CHIP
ECCH0001002
180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C114
CAP,CERAMIC,CHIP
ECCH0000149
3.3 nF,50V,K,X7R,HD,1005,R/TP
6
C115
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C117
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C118
CAP,CHIP,MAKER
ECZH0000816
12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C119
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C121
CAP,TANTAL,CHIP,MAKER
ECTZ0005603
33 uF,10V ,M ,L_ESR ,2125 ,R/TP ,; , ,[empty] ,[empty] ,
,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]
6
C122
CAP,CERAMIC,CHIP
ECCH0000393
22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
Description
Part Number
Spec
1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK
Color
Remark
Without Color
33
15
Without Color
- 161 -
17
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C123
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C124
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C126
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C127
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C128
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C129
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C130
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C131
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C132
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C134
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C135
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C136
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C139
CAP,CHIP,MAKER
ECZH0000844
68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C140
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C141
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C142
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C143
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C144
CAP,CERAMIC,CHIP
ECCH0000393
22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
6
C147
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C149
CAP,CERAMIC,CHIP
ECCH0000112
15 pF,50V,J,NP0,TC,1005,R/TP
6
C150
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C151
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C152
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C153
CAP,CERAMIC,CHIP
ECCH0000112
15 pF,50V,J,NP0,TC,1005,R/TP
6
C154
CAP,CHIP,MAKER
ECZH0000802
1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C155
CAP,TANTAL,CHIP
ECTH0002202
4.7 uF,10V ,M ,STD ,1608 ,R/TP
6
C156
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C157
INDUCTOR,CHIP
ELCH0001427
2.2 nH,S ,1005 ,R/TP ,Pb Free
6
C158
CAP,CERAMIC,CHIP
ECCH0000112
15 pF,50V,J,NP0,TC,1005,R/TP
6
C159
CAP,CERAMIC,CHIP
ECCH0000112
15 pF,50V,J,NP0,TC,1005,R/TP
6
C161
CAP,CERAMIC,CHIP
ECCH0000901
2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C162
CAP,CERAMIC,CHIP
ECCH0000180
3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C164
CAP,CERAMIC,CHIP
ECCH0000101
.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C165
CAP,CERAMIC,CHIP
ECCH0000101
.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C170
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C171
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C172
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
Description
Part Number
Spec
- 162 -
Color
Remark
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C173
CAP,CERAMIC,CHIP
ECCH0000198
2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
6
C174
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C176
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C177
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C178
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C179
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C180
CAP,CERAMIC,CHIP
ECCH0005602
2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP
6
C181
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C182
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C183
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C185
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C186
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C187
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C188
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C189
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
C190
CAP,CERAMIC,CHIP
ECCH0000101
.5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C192
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C200
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C201
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C202
CAP,CHIP,MAKER
ECZH0001211
220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP
6
C203
CAP,CHIP,MAKER
ECZH0001211
220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP
6
C204
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C205
CAP,TANTAL,CHIP,MAKER
ECTZ0004701
4.7 uF,6.3V ,M ,STD ,1608 ,R/TP
6
C206
CAP,TANTAL,CHIP
ECTH0003701
10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6
C209
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C210
CAP,CERAMIC,CHIP
ECCH0000179
22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6
C211
CAP,CERAMIC,CHIP
ECCH0000179
22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP
6
C212
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C213
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C214
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C215
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C216
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C217
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C218
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C219
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C220
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C221
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
Description
Part Number
Spec
- 163 -
Color
Remark
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C222
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C223
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C225
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C226
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C227
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C228
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C229
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C230
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C231
CAP,CERAMIC,CHIP
ECCH0000147
2.2 nF,50V,K,X7R,HD,1005,R/TP
6
C232
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C233
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C234
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C235
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C236
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C237
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C238
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C239
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C240
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C242
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C243
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C244
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C246
CAP,CERAMIC,CHIP
ECCH0000161
33 nF,16V,K,X7R,HD,1005,R/TP
6
C247
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C301
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C302
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C303
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C304
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C305
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C306
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C307
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C308
CAP,CERAMIC,CHIP
ECCH0007801
4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6
C310
CAP,CERAMIC,CHIP
ECCH0007801
4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6
C311
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C312
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C316
CAP,CERAMIC,CHIP
ECCH0005602
2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP
6
C317
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C318
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
Description
Part Number
Spec
- 164 -
Color
Remark
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C319
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C320
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C321
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C322
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C323
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C324
CAP,CHIP,MAKER
ECZH0000816
12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C325
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C326
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C327
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C328
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C329
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C330
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C331
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C332
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C333
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C334
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C335
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C336
CAP,CERAMIC,CHIP
ECCH0007801
4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP
6
C337
CAP,CHIP,MAKER
ECZH0000816
12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C338
CAP,CHIP,MAKER
ECZH0000816
12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C339
CAP,CERAMIC,CHIP
ECCH0005602
2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP
6
C340
CAP,CERAMIC,CHIP
ECCH0005602
2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP
6
C341
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C343
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C344
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C345
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C346
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C347
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C348
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C349
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C350
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C351
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C352
CAP,CHIP,MAKER
ECZH0000830
33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C353
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C354
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C355
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C356
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
Description
Part Number
Spec
- 165 -
Color
Remark
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C357
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C358
CAP,CERAMIC,CHIP
ECCH0000393
22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
6
C389
CAP,CERAMIC,CHIP
ECCH0006201
4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
6
C400
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C401
CAP,TANTAL,CHIP
ECTH0004402
33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP
6
C402
CAP,TANTAL,CHIP
ECTH0004402
33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP
6
C403
CAP,CERAMIC,CHIP
ECCH0002002
47000 pF,10V ,K ,B ,HD ,1005 ,R/TP
6
C404
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C405
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C406
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C407
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C408
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C409
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C410
CAP,CERAMIC,CHIP
ECCH0000155
10 nF,16V,K,X7R,HD,1005,R/TP
6
C411
CAP,CHIP,MAKER
ECZH0004402
0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6
C412
CAP,CERAMIC,CHIP
ECCH0004904
1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
6
C413
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C414
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C415
CAP,CERAMIC,CHIP
ECCH0000110
10 pF,50V,D,NP0,TC,1005,R/TP
6
C416
CAP,TANTAL,CHIP
ECTH0003701
10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
6
C417
CAP,CERAMIC,CHIP
ECCH0000122
47 pF,50V,J,NP0,TC,1005,R/TP
6
C418
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C419
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C420
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C421
CAP,CERAMIC,CHIP
ECCH0000120
39 pF,50V,J,NP0,TC,1005,R/TP
6
C422
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C423
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C425
CAP,TANTAL,CHIP
ECTH0001902
10 uF,10V ,M ,L_ESR ,1608 ,R/TP
6
C426
CAP,CERAMIC,CHIP
ECCH0000152
5.6 nF,25V,K,X7R,HD,1005,R/TP
6
C427
CAP,CERAMIC,CHIP
ECCH0000152
5.6 nF,25V,K,X7R,HD,1005,R/TP
6
C428
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C429
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C430
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C432
CAP,CHIP,MAKER
ECZH0001121
470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6
C433
CAP,CERAMIC,CHIP
ECCH0000182
0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP
6
C434
CAP,CERAMIC,CHIP
ECCH0000143
1 nF,50V,K,X7R,HD,1005,R/TP
6
C435
CAP,TANTAL,CHIP
ECTH0001903
22 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
Description
Part Number
Spec
- 166 -
Color
Remark
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
C436
CAP,CERAMIC,CHIP
ECCH0005604
10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
6
C437
CAP,CHIP,MAKER
ECZH0000802
1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C438
CAP,CHIP,MAKER
ECZH0000813
100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6
C439
CAP,CHIP,MAKER
ECZH0000806
5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C440
CAP,CHIP,MAKER
ECZH0000806
5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C441
CAP,CERAMIC,CHIP
ECCH0000185
5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C442
CAP,CERAMIC,CHIP
ECCH0000185
5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C443
CAP,CERAMIC,CHIP
ECCH0000185
5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C444
CAP,CERAMIC,CHIP
ECCH0000901
2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C445
CAP,CERAMIC,CHIP
ECCH0000901
2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6
C446
CAP,TANTAL,CHIP,MAKER
ECTZ0005603
33 uF,10V ,M ,L_ESR ,2125 ,R/TP ,; , ,[empty] ,[empty] ,
,[empty] , ,[empty] ,[empty] ,[empty] ,[empty]
6
C447
CAP,CHIP,MAKER
ECZH0001215
1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
6
C450
CAP,CERAMIC,CHIP
ECCH0000115
22 pF,50V,J,NP0,TC,1005,R/TP
6
CN400
CONNECTOR,FFC/FPC
ENQY0010901
35 PIN,0.3 mm,ETC , ,H=1.2
6
CN401
CONNECTOR,I/O
ENRY0006401
18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type
6
CN403
CONN,SOCKET
ENSY0020101
24 PIN,ETC , ,0.9 mm,
6
D400
DIODE,SWITCHING
EDSY0011901
EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,
IR=30uA(VR=10V)
6
D401
DIODE,TVS
EDTY0007401
SMD ,12 V,350 W,R/TP ,
6
D402
DIODE,TVS
EDTY0008610
SOD-523 ,5 V,250 W,R/TP ,PB-FREE
6
D403
DIODE,TVS
EDTY0008601
SOD-323 ,6 V,400 W,R/TP ,PB-FREE
6
D404
DIODE,TVS
EDTY0008601
SOD-323 ,6 V,400 W,R/TP ,PB-FREE
6
FL101
FILTER,SAW
SFSY0030201
897.5 MHz,1.4*1.1*0.6 ,SMD ,Pbfree_SAW_GSM900_Tx
6
FL102
FILTER,SAW
SFSY0031101
1950 MHz,1.4*1.1*0.62 ,SMD ,RF Filter for WCDMA
2Ghz ,; ,1950 ,1.4*1.1*0.62 ,SMD ,P/TR
6
FL103
FILTER,SAW
SFSY0031201
2140 MHz,1.4*1.1*0.62 ,SMD ,2110M~2170M, IL 2.0,
5pin, U-B, 50-100_10, WCDMA BAND I Rx ,; ,2140
,1.4*1.1*0.62 ,SMD ,R/TP
6
FL104
DUPLEXER,IMT
SDMY0001301
1950 MHz,2140 MHz,1.6 dB,2.0 dB,53 dB,44
dB,3.0*2.5*1.2 ,SMD ,FBAR, WCDMA duplexer ,; ,2140
,44 ,1950 ,53 ,2.0 ,1.6 ,3.0X2.5X1.2 ,DUAL ,SMD ,R/TP
6
FL400
FILTER,EMI/POWER
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),
Pb-free
6
FL401
FILTER,EMI/POWER
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),
Pb-free
6
FL402
FILTER,EMI/POWER
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),
Pb-free
6
FL403
FILTER,EMI/POWER
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),
Pb-free
6
FL404
FILTER,EMI/POWER
SFEY0006001
SMD ,
Description
Part Number
Spec
- 167 -
Color
Remark
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
FL405
FILTER,EMI/POWER
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),
Pb-free
6
FL406
FILTER,EMI/POWER
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),
Pb-free
6
FL407
FILTER,EMI/POWER
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),
Pb-free
6
FL408
FILTER,EMI/POWER
SFEY0007103
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),
Pb-free
6
J300
CONN,SOCKET
ENSY0019201
8 PIN,ETC ,8Pin ,2.54 mm,Korean 8Pin Stopper UIM
6
L102
INDUCTOR,CHIP
ELCH0005009
100 nH,J ,1005 ,R/TP ,
6
L108
INDUCTOR,CHIP
ELCH0001031
15 nH,J ,1005 ,R/TP ,PBFREE
6
L111
INDUCTOR,CHIP
ELCH0004718
5.6 nH,S ,1005 ,R/TP ,
6
L114
INDUCTOR,CHIP
ELCH0003813
47 nH,J ,1005 ,R/TP ,COIL TYPE
6
L115
INDUCTOR,CHIP
ELCH0001032
18 nH,J ,1005 ,R/TP ,PBFREE
6
L116
INDUCTOR,CHIP
ELCH0001041
10 nH,S ,1005 ,R/TP ,PBFREE
6
L119
INDUCTOR,CHIP
ELCH0003813
47 nH,J ,1005 ,R/TP ,COIL TYPE
6
L120
INDUCTOR,CHIP
ELCH0003813
47 nH,J ,1005 ,R/TP ,COIL TYPE
6
L121
INDUCTOR,CHIP
ELCH0005020
1 nH,S ,1005 ,R/TP ,
6
L123
INDUCTOR,CHIP
ELCH0005020
1 nH,S ,1005 ,R/TP ,
6
L125
INDUCTOR,CHIP
ELCH0001410
12 nH,J ,1005 ,R/TP ,Pb Free
6
L128
INDUCTOR,CHIP
ELCH0005010
1.8 nH,S ,1005 ,R/TP ,
6
L300
INDUCTOR,SMD,POWER
ELCP0008001
4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
6
L301
INDUCTOR,SMD,POWER
ELCP0008001
4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
6
L302
INDUCTOR,CHIP
ELCH0001550
56 nH,J ,1608 ,R/TP ,
6
L305
INDUCTOR,SMD,POWER
ELCP0008001
4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,
6
L400
INDUCTOR,CHIP
ELCH0003825
56 nH,J ,1005 ,R/TP ,chip inductor,PBFREE
6
L401
INDUCTOR,CHIP
ELCH0005009
100 nH,J ,1005 ,R/TP ,
6
L402
INDUCTOR,CHIP
ELCH0005009
100 nH,J ,1005 ,R/TP ,
6
L403
INDUCTOR,CHIP
ELCH0001033
1.5 nH,S ,1005 ,R/TP ,PBFREE
6
L404
INDUCTOR,CHIP
ELCH0005010
1.8 nH,S ,1005 ,R/TP ,
6
L405
INDUCTOR,CHIP
ELCH0005002
2.7 nH,S ,1005 ,R/TP ,
6
L406
INDUCTOR,CHIP
ELCH0005002
2.7 nH,S ,1005 ,R/TP ,
6
L407
INDUCTOR,CHIP
ELCH0005002
2.7 nH,S ,1005 ,R/TP ,
6
L408
INDUCTOR,CHIP
ELCH0001041
10 nH,S ,1005 ,R/TP ,PBFREE
6
L409
INDUCTOR,CHIP
ELCH0001035
4.7 nH,S ,1005 ,R/TP ,PBFREE
6
L410
INDUCTOR,CHIP
ELCH0001035
4.7 nH,S ,1005 ,R/TP ,PBFREE
6
L411
INDUCTOR,CHIP
ELCH0001035
4.7 nH,S ,1005 ,R/TP ,PBFREE
6
M100
MODULE,ETC
SMZY0012601
4.5x3.2x1.2 Bluetooth RF Module
6
Q300
TR,BJT,PNP
EQBP0009901
TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680
Description
Part Number
Spec
- 168 -
Color
Remark
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
Q301
TR,FET,P-CHANNEL
EQFP0004701
TSOP6 ,1.5 W,20 V,-5 A,R/TP ,P-CHANNEL 20-V(D-S)
MOSFET, Pb free
6
Q302
TR,BJT,PNP
EQBP0009901
TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680
6
R100
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
6
R101
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
6
R103
RES,CHIP,MAKER
ERHZ0000212
12 Kohm,1/16W ,F ,1005 ,R/TP
6
R104
RES,CHIP,MAKER
ERHZ0000310
680 ohm,1/16W ,F ,1005 ,R/TP
6
R105
RES,CHIP,MAKER
ERHZ0003801
5.1 ohm,1/16W ,J ,1005 ,R/TP
6
R106
RES,CHIP,MAKER
ERHZ0003801
5.1 ohm,1/16W ,J ,1005 ,R/TP
6
R107
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R108
RES,CHIP,MAKER
ERHZ0000490
51 ohm,1/16W ,J ,1005 ,R/TP
6
R109
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
6
R110
RES,CHIP,MAKER
ERHZ0000517
91 ohm,1/16W ,J ,1005 ,R/TP
6
R111
RES,CHIP,MAKER
ERHZ0000517
91 ohm,1/16W ,J ,1005 ,R/TP
6
R112
RES,CHIP,MAKER
ERHZ0000473
39 ohm,1/16W ,J ,1005 ,R/TP
6
R113
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R114
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R115
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R116
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R117
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R118
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R119
RES,CHIP,MAKER
ERHZ0000490
51 ohm,1/16W ,J ,1005 ,R/TP
6
R120
RES,CHIP,MAKER
ERHZ0000483
47 ohm,1/16W ,J ,1005 ,R/TP
6
R121
RES,CHIP,MAKER
ERHZ0000415
130 ohm,1/16W ,J ,1005 ,R/TP
6
R122
RES,CHIP,MAKER
ERHZ0000415
130 ohm,1/16W ,J ,1005 ,R/TP
6
R123
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R124
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R128
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R201
RES,CHIP,MAKER
ERHZ0000222
150 Kohm,1/16W ,F ,1005 ,R/TP
6
R202
RES,CHIP,MAKER
ERHZ0000469
36 ohm,1/16W ,J ,1005 ,R/TP
6
R204
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R205
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R207
RES,CHIP,MAKER
ERHZ0000490
51 ohm,1/16W ,J ,1005 ,R/TP
6
R208
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R209
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R211
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R213
RES,CHIP,MAKER
ERHZ0000437
2 Kohm,1/16W ,J ,1005 ,R/TP
Description
Part Number
Spec
- 169 -
Color
Remark
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
R214
6
Description
Part Number
Spec
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
R215
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
6
R300
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R301
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R302
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R303
RES,CHIP,MAKER
ERHZ0004201
121000 ohm,1/16W ,F ,1005 ,R/TP
6
R304
RES,CHIP,MAKER
ERHZ0000487
470 Kohm,1/16W ,J ,1005 ,R/TP
6
R305
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
6
R306
RES,CHIP,MAKER
ERHZ0000490
51 ohm,1/16W ,J ,1005 ,R/TP
6
R307
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R308
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R309
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
6
R313
RES,CHIP
ERHY0008602
0.1 ohm,1/4W ,J ,2012 ,R/TP
6
R314
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R315
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R316
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R317
RES,CHIP,MAKER
ERHZ0000422
15 Kohm,1/16W ,J ,1005 ,R/TP
6
R318
RES,CHIP,MAKER
ERHZ0000487
470 Kohm,1/16W ,J ,1005 ,R/TP
6
R380
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R400
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
6
R401
RES,CHIP,MAKER
ERHZ0000530
5.1 Kohm,1/16W ,J ,1005 ,R/TP
6
R402
RES,CHIP,MAKER
ERHZ0000407
1000 Kohm,1/16W ,J ,1005 ,R/TP
6
R403
RES,CHIP,MAKER
ERHZ0000493
51 Kohm,1/16W ,J ,1005 ,R/TP
6
R404
RES,CHIP,MAKER
ERHZ0000405
10 Kohm,1/16W ,J ,1005 ,R/TP
6
R405
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
R406
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R407
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R408
RES,CHIP,MAKER
ERHZ0000288
470 Kohm,1/16W ,F ,1005 ,R/TP
6
R409
RES,CHIP,MAKER
ERHZ0000537
680000 ohm,1/16W ,F ,1005 ,R/TP
6
R410
RES,CHIP,MAKER
ERHZ0000318
80.6 Kohm,1/16W ,F ,1005 ,R/TP
6
R421
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
6
R422
RES,CHIP,MAKER
ERHZ0000402
10 ohm,1/16W ,J ,1005 ,R/TP
6
R424
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
6
R425
RES,CHIP,MAKER
ERHZ0000443
2200 ohm,1/16W ,J ,1005 ,R/TP
6
R426
RES,CHIP,MAKER
ERHZ0000438
20 Kohm,1/16W ,J ,1005 ,R/TP
6
R427
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
6
R428
RES,CHIP,MAKER
ERHZ0000499
5600 ohm,1/16W ,J ,1005 ,R/TP
- 170 -
Color
Remark
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
R429
RES,CHIP,MAKER
ERHZ0000404
1 Kohm,1/16W ,J ,1005 ,R/TP
6
R430
RES,CHIP,MAKER
ERHZ0000499
5600 ohm,1/16W ,J ,1005 ,R/TP
6
R431
RES,CHIP,MAKER
ERHZ0000438
20 Kohm,1/16W ,J ,1005 ,R/TP
6
R433
RES,CHIP
ERHY0013101
2.7 ohm,1/16W ,J ,1005 ,R/TP
6
R434
RES,CHIP
ERHY0013101
2.7 ohm,1/16W ,J ,1005 ,R/TP
6
R435
RES,CHIP,MAKER
ERHZ0000487
470 Kohm,1/16W ,J ,1005 ,R/TP
6
R436
RES,CHIP,MAKER
ERHZ0000401
0 ohm,1/16W ,J ,1005 ,R/TP
6
R437
RES,CHIP,MAKER
ERHZ0000435
20 ohm,1/16W ,J ,1005 ,R/TP
6
RA400
RES,ARRAY,R
ERNR0000404
100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP
6
S300
CONN,SOCKET
ENSY0013501
8 PIN,ETC ,PUSH-PUSH TYPE / RECTANGULAR ,1.1
mm,TRANS FLASH SOCKET / EXTERNAL MEMORY
CARD SOCKET
6
SW100
CONN,RF SWITCH
ENWY0003301
,SMD ,0.4 dB,
6
TR100
TR,BJT,ARRAY
EQBA0000601
UMT5 ,.2 W,R/TP ,
6
U100
IC
EUSY0300501
QFN ,56 PIN,R/TP ,GSM, WCDMA Single RF
Transceiver, 8X8X0.9
IC
EUSY0300502
QFN ,56 PIN,R/TP ,chartered,GSM, WCDMA Single RF
Transceiver, 8X8X0.9 ,; ,IC,Tx/Rx
Description
Part Number
Spec
6
U101
PAM
SMPY0014001
35.5 dBm,56 %, A, dBc, dB,6x6x1.15 ,SMD ,Tri Band
6
U102
COUPLER,RF
DIRECTIONAL
SCDY0003403
-18 dB,-.25 dB,-33 dB,1.0*0.58*0.35 ,SMD ,1920M ~
1980M, 4pin, Pb Free , ,[empty] , , ,SMD ,R/TP
6
U103
PAM
SMPY0014201
28 dBm,40 %,465 mA,-44 dBc,26.5 dB,4x4x1.1 ,SMD ,
6
U104
IC
EUSY0073401
SSOP5-P-0.65A ,5 PIN,R/TP ,INVERTER, Pb Free
6
U201
IC
EUSY0318401
CSP ,409 PIN,R/TP ,WEDGE Baseband Platform
6
U300
IC
EUSY0306302
BCCS ,84 PIN,R/TP ,7x7, MSMC(1.2V), pbfree
6
U301
IC
EUSY0332001
FBGA ,137 PIN,ETC ,512M(64Mx8)
NAND+512M(16Mx32) SDRAM , ,IC,MCP
6
U302
IC
EUSY0232812
SON1612-6 ,6 PIN,R/TP ,2.8V, 150mA LDO
6
U303
IC
EUSY0319001
WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual
LDO
6
U305
IC
EUSY0238702
TSOPJW-12 ,12 PIN,R/TP ,3PORT Charge
Pump(AAT2154 Low cost version)
6
U400
IC
EUSY0250501
SC70 ,5 PIN,R/TP ,Comparator, pin compatible to
EUSY0077701
6
U401
IC
EUSY0300101
WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog
Switch, PB-Free
6
U402
IC
EUSY0176401
MICRO8 ,8 PIN,R/TP ,1W AUDIO AMPLIFIER
6
U500
FILTER,SEPERATOR
SFAY0007402
900.1800 ,1900.2100 , dB, dB, dB, dB,ETC ,1800GSM
Quad, WCDMA2100 FEM, 5.4X4.0X1.2, Improved D5006
6
U501
IC
EUSY0223001
HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH
OUTPUT CONTROL / 1.5V
6
VA300
VARISTOR
SEVY0004001
18 V, ,SMD ,3pF, 1005
6
VA301
VARISTOR
SEVY0004201
14 V, ,SMD ,120pF, 1005
- 171 -
Color
Remark
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
VA302
VARISTOR
SEVY0004001
18 V, ,SMD ,3pF, 1005
6
VA303
VARISTOR
SEVY0004001
18 V, ,SMD ,3pF, 1005
6
VA304
VARISTOR
SEVY0004001
18 V, ,SMD ,3pF, 1005
6
VA305
VARISTOR
SEVY0004001
18 V, ,SMD ,3pF, 1005
6
VA306
VARISTOR
SEVY0004001
18 V, ,SMD ,3pF, 1005
6
VA400
VARISTOR
SEVY0004001
18 V, ,SMD ,3pF, 1005
6
VA401
VARISTOR
SEVY0004001
18 V, ,SMD ,3pF, 1005
6
VA402
VARISTOR
SEVY0004201
14 V, ,SMD ,120pF, 1005
6
VA403
VARISTOR
SEVY0004201
14 V, ,SMD ,120pF, 1005
6
VA404
VARISTOR
SEVY0004201
14 V, ,SMD ,120pF, 1005
6
VA405
VARISTOR
SEVY0004201
14 V, ,SMD ,120pF, 1005
6
VA407
VARISTOR
SEVY0004201
14 V, ,SMD ,120pF, 1005
6
VA408
VARISTOR
SEVY0004201
14 V, ,SMD ,120pF, 1005
6
VA409
VARISTOR
SEVY0004201
14 V, ,SMD ,120pF, 1005
6
VA410
VARISTOR
SEVY0004201
14 V, ,SMD ,120pF, 1005
6
VA412
VARISTOR
SEVY0004201
14 V, ,SMD ,120pF, 1005
6
VA414
VARISTOR
SEVY0004201
14 V, ,SMD ,120pF, 1005
6
VA430
VARISTOR
SEVY0004201
14 V, ,SMD ,120pF, 1005
6
VA490
VARISTOR
SEVY0004201
14 V, ,SMD ,120pF, 1005
6
X100
VCTCXO
EXSK0005703
19.2 MHz,1.5 PPM,40 pF,SMD ,3.2*2.5*0.9 , ,; , ,1.5PPM
,2.8V ,3.2 ,2.5 ,0.9 , ,SMD ,P/TP
6
X300
X-TAL
EXXY0004601
.032768 MHz,20 PPM,7 pF,65000 ohm,SMD ,6.9*1.4*1.3
,
5
SAFD00
PCB ASSY,MAIN,SMT TOP
SAFD0087801
6
CN404
CONN,SOCKET
ENSY0020001
6
LD400
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD402
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD403
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD404
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD405
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD406
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD407
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
LD408
DIODE,LED,CHIP
EDLH0006001
Blue ,1608 ,R/TP ,Blue SMD LED
6
R411
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R413
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R414
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R415
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R416
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
Description
Part Number
Spec
- 172 -
Color
Remark
11. EXPLODED VIEW & REPLACEMENT PART LIST
Level
Location
No.
6
R417
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R418
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R419
RES,CHIP
ERHY0003301
100 ohm,1/16W ,J ,1005 ,R/TP
6
R423
RES,CHIP,MAKER
ERHZ0000406
100 Kohm,1/16W ,J ,1005 ,R/TP
6
SPFY00
PCB,MAIN
SPFY0147601
FR-4 ,1.0 mm,BUILD-UP 8 ,
Description
Part Number
Spec
- 173 -
Color
Remark
11. EXPLODED VIEW & REPLACEMENT PART LIST
Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
11.3 Accessory
Level
Location
No.
Description
Part Number
Spec
3
SBPL00
BATTERY PACK,LI-ION
SBPL0090501
3.7 V,950 mAh,1 CELL,PRISMATIC ,KU250 Europe
BATT, IP, Pb-Free ,; ,3.7 ,950 ,0.2C ,PRISMATIC
,50x34x55 , ,BLACK ,Innerpack ,Europe Label
3
SSAD00
ADAPTOR,AC-DC
SSAD0024501
100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,;
,85Vac~264Vac ,5.1V +0.15V, -0.2V ,700mA ,5060 ,
,WALL 2P ,I/O CONNECTOR ,
ADAPTOR,AC-DC
SSAD0024502
100-240V ,5060 Hz,5.1 V,0.7 A,CE ,AC-DC ADAPTOR ,;
,5.1V +0.15V, -0.2V ,5.1V ,700mA ,5060 , ,WALL 2P ,I/O
CONNECTOR ,
ADAPTOR,AC-DC
SSAD0024503
100-240V ,5060 Hz,5.2 V,0.7 A,CE ,AC-DC ADAPTOR ,;
,85Vac~264Vac ,5.2±0.3V ,700mA ,5060 , ,WALL 2P ,I/O
CONNECTOR ,
ADAPTOR,AC-DC
SSAD0024504
100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,;
,85Vac~264Vac ,5.1V(+0.15V, -0.2V) ,700mA ,5060 ,
,WALL 2P ,I/O CONNECTOR ,
- 174 -
Color
Black
Remark
35
Note
Note
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