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LED TV
SERVICE MANUAL
CHASSIS : LA57H
MODEL : 49LF5400
49LF5400-UB
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
P/NO : MFL68646508(1502-REV00) Printed in Korea
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 4
ADJUSTMENT INSTRUCTION .............................................................. 10
TROUBLE SHOOTING ............................................................................16
BLOCK DIAGRAM .................................................................................. 22
EXPLODED VIEW .................................................................................. 23
SCHEMATIC CIRCUIT DIAGRAM ............................................APPENDIX
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 2 LGE Internal Use Only
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc.
If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 M Ω and 5.2 MΩ.
When the exposed metal has no return path to the chassis the reading must be infinite.
An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check
(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 3 LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this service manual.
CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F) b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 4 LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 5 LGE Internal Use Only
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This spec sheet is applied LED TV with LA57H chassis
2. Test condition
Each part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC(77 ± 9 ºF) , CST : 40 ºC±5 ºC
2) Relative Humidity: 65 % ± 10 %
3) Power Voltage
Market
USA
Input voltage
100~240V
Frequency
50/60Hz Standard Voltage of each product is marked by models
Remark
4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM
5) The receiver must be operated for about 20 minutes prior to the adjustment
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
Safety : UL, CSA, IEC specification
EMC: FCC, ICES, IEC specification
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 6 LGE Internal Use Only
4. General Specification
No Item
1.
Receiving System
2.
Available Channel
3.
Input Voltage
4.
Market
5.
Screen Size
Specification
ATSC / NTSC-M / 64 & 256 QAM
1) VHF : 02~13
2) UHF : 14~69
3) DTV : 02-69
4) CATV : 01~135
5) CADTV : 01~135
AC 100 ~ 240V 50/60Hz
NORTH AMERICA
32/42/43/49/55 inch Wide
(1920 × 1080)
Result
FHD / 60Hz
6.
7.
8.
Aspect Ratio
Tuning System
Module
9.
Operating Environment
10. Storage Environment
Direct
32 inch Wide (1366 × 768)
16:9
FS
LC320DXE-MGA3
HC320DXN-ABHS3
LC320DUE-MGA3
NC320DUN-VBBP3
LC420DUE-MGA3
NC420DUN-VUBP5
LC420DUE-MGA6
NC420DUN-VUBP8
LC490DUE-MGA6
LC550DUE-MGA6
NC430EUN-AACR1
NC490EUN-AACR1
1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %
Remark
Mark : 110V, 60Hz (N.America)
32LF5600-Ux
42LF5500-Ux
42LF5600-Ux
43LF5400-Ux
49LF5500-Ux
49LF5400-Ux
55LF5500-Ux
32LF560B-Ux HD / 60Hz
LGD
BOE
LGD
BOE
LGD
AUO
LGD
AUO
LGD
LGD
LGD
LGD
HD / 60Hz
HD / 60Hz
32LF560B-Ux
32LF560B-Ux
FHD / 60Hz 32LF5600-Ux
FHD / 60Hz 32LF5600-Ux
FHD / 60Hz 42LF5600-Ux
FHD / 60Hz 42LF5600-Ux
FHD / 60Hz 42LF5500-Ux
FHD / 60Hz 42LF5500-Ux
FHD / 60Hz 49LF5500-Ux
FHD / 60Hz 55LF5500-Ux
FHD / 60Hz 43LF5400-Ux
FHD / 60Hz 49LF5400-Ux
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 7 LGE Internal Use Only
5. Supported video resolutions
5.1. Component input(Y, CB/PB, CR/PR)
3
4
5
No
1
2
Resolution
720*480
720*480
720*480
720*480
1280*720
8
9
6
7
1280*720
1920*1080
1920*1080
1920*1080
10 1920*1080
11 1920*1080
12 1920*1080
13 1920*1080
14 1920*1080
H-freq(kHz)
15.73
15.73
31.47
31.50
44.96
45.00
33.72
33.75
26.97
27.00
33.71
33.75
67.432
67.50
V-freq.(Hz)
59.94
60.00
59.94
60.00
59.94
60.00
59.94
60.00
23.976
24.00
29.97
30.00
59.94
60.00
Pixel clock(MHz)
13.50
13.5135
27.00
27.027
74.176
74.25
74.176
74.25
74.176
74.25
74.176
74.25
148.352
148.50
Proposed
SDTV ,DVD 480I
SDTV ,DVD 480I
SDTV 480P
SDTV 480P
HDTV 720P
HDTV 720P
HDTV 1080I
HDTV 1080I
HDTV 1080P
HDTV 1080P
HDTV 1080P
HDTV 1080P
HDTV 1080P
HDTV 1080P
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 8 LGE Internal Use Only
5.2. HDMI Input (DTV / PC)
H-freq(kHz) No.
Resolution
DTV
1 640*480
2 640*480
3 720*480
31.46
31.5
15.73
4 720*480
5 720*480
6 720*480
7 1280*720
8 1280*720
9 1920*1080
10 1920*1080
11 1920*1080
12 1920*1080
13 1920*1080
14 1920*1080
15 1920*1080
16 1920*1080
PC
1 640*350 @70Hz
2 720*400 @70Hz
3 640*480 @60Hz
4 800*600 @60Hz
5 1024*768 @60Hz
6 1152*864 @60Hz
7 1280*1024 @60Hz
8 1360*768 @60Hz
9 1920*1080 @60Hz
31.46
31.46
31.46
37.87
48.36
54.34
63.98
47.71
67.5
15.75
31.47
31.5
44.96
45
33.72
33.75
26.97
27.00
33.71
33.75
67.43
67.5
70.09
70.08
59.94
60.31
60.00
60.05
60.02
60.01
60.00
V-freq.(kHz)
59.94
60.00
59.94
60.00
59.94
60.00
59.94
60.00
59.94
60.00
23.97
24.00
29.97
30.00
59.94
60.00
25.17
28.32
25.17
40.00
65.00
80.002
108.0
85.50
148.5
Pixel clock(MHz)
25.125
25.125
13.500
13.514
27.00
27.027
74.176
74.25
74.176
74.25
74.176
74.25
74.176
74.25
148.352
148.50
Proposed
SDTV 480P
SDTV 480P
SDTV 480I
SDTV 480I
SDTV 480P
SDTV 480P
HDTV 720P
HDTV 720P
HDTV 1080I
HDTV 1080I
HDTV 1080P
HDTV 1080P
HDTV 1080P
HDTV 1080P
HDTV 1080P
HDTV 1080P
EGA
DOS
VESA(VGA)
VESA(SVGA)
VESA(XGA)
VESA
VESA (SXGA)
VESA (WXGA)
WUXGA(CEA 861D) O
O
O
O
O
X
O
O
O
Remarks
Spec-Out.
(Just Display)
Spec-Out.
(Just Display)
FHD only
FHD only
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 9 LGE Internal Use Only
ADJUSTMENT INSTRUCTION
1. Application
This spec. sheet applies to LA57H Chassis applied LED TV all models manufactured in TV factory
2. Specification
(1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if there is no specific designation
(4) The input voltage of the receiver must keep 100~240V,
50/60Hz
(5) At first Worker must turn on the SET by using Power Only key.
(6) The receiver must be operated for about 5 minutes prior to the adjustment when module is in the circumstance of over
15 ºC
In case of keeping module is in the circumstance of 0°C, it should be placed in the circumstance of above 15°C for 2 hours
In case of keeping module is in the circumstance of below
-20°C, it should be placed in the circumstance of above
15°C for 3 hours.
4. MAIN PCBA Adjustments
* Download
(1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK” message. If display “Error”, Check connect computer, jig, and set.
(3) Click “Connect” tab. If display “Can’t ”, Check connect computer, jig, and set.
(4) Click “Read” tab, and then load download file(XXXX.bin) by clicking “Read”
※ Caution
When still image is displayed for a period of 20 minutes or longer (especially where W/B scale is strong.
Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area
3. Adjustment items
3.1. Main PCBA Adjustments
(1) ADC adjustment: Component 480i, 1080p / RGB-PC 1080p
(2) EDID download: HDMI and RGB-PC
(5) Click “Auto” tab and set as below
(6) Click “Run”.
(7) After downloading, check “OK” message.
■ Above adjustment items can be also performed in Final
Assembly if needed. Adjustment items in both PCBA and final assembly tages can be checked by using the INSTART
Menu(1.ADJUST CHECK)
Component 1080p and RGB-PC Adjust will be calculated by
480i adjust value.
3.2. Final assembly adjustment
(1) White Balance adjustment
(2) RS-232C functionality check
(3) Factory Option setting per destination
(4) Shipment mode setting (In-Stop)
(5) GND and HI-POT test
3.3. Appendix
(1) Shipment conditions
(2) Tool option menu
(3) USB Download (S/W Update, Option and Service only)
(4) Preset CH Information
4.1. ADC Calibration
4.1.1. Overview
▪ ADC adjustment is needed to find the optimum black level and gain in Analog-to-Digital device and to compensate RGB deviation
▪ ADC adjustment is OTP (Auto ADC)
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 10 LGE Internal Use Only
4.2. EDID Download
4.2.1. Overview
▪ It is a VESA regulation. A PC or a MNT will display an optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”.
4.2.2. Equipment
▪ Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need.
▪ Adjust by using remote controller
4.2.3. Download method (using DFT)
※ PC(for communication through RS-232C), UART baud rate:
115200 bps
Command : aa 00 00 (Start Factory mode)
Command : ae 00 10 (Download All EDID)
Command : aa 00 90 (End of Factory mode)
▪ 2D / 8bit / FHD
(1) EDID Block 0, Bytes 0-127 [00H-7FH]
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
4.2.4. Download method
1) Press Adj. key on the Adj. R/C,
2) Select EDID D/L menu.
3) By pressing Enter key, EDID download will begin
4) If Download is successful, OK is display, but If Download is failure, NG is displayed.
5) If Download is failure, Re-try downloads.
※ Caution) When EDID Download, must remove RGB/HDMI
Cable.
6) EDID Write confirmation
■ L15_M1L EDID - AC3
▪ 2D / 8bit / HD
(1) EDID Block 0, Bytes 0-127 [00H-7FH]
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
4.2.5. Models for EDID Data
North America
(PCM)
HD / 8bit
HDMI 2ea
32LF560B-Ux
32LF550B-Ux
4.2.6. EDID DATA
■ L15_M1L EDID - PCM
▪ 2D / 8bit / HD
(1) EDID Block 0, Bytes 0-127 [00H-7FH]
2D
FHD / 8bit
HDMI 2ea
32/42LF5600-Ux
42/49/55LF5500-Ux
43/49LF5400-Ux
▪ 2D / 8bit / FHD
(1) EDID Block 0, Bytes 0-127 [00H-7FH]
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 11 -
4.2.7. Tool Option Input
▪ Input Model Tool Option according to BOM
LGE Internal Use Only
5. Final Assembly Adjustment
5.1. White Balance Adjustment
5.1.1. Overview
5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation
(2) How-it-works: When R/G/B gain in the OSD is at 192, it means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of
R/G/B is fixed at 192, and the other two is lowered to find the desired value.
(3) Adj. condition: normal temperature
- Surrounding Temperature: 25±5 °C
- Warm-up time: About 5 Min
- Surrounding Humidity: 20% ~ 80%
- Before White balance adjustment, Keep power on status, don’t power off
5.1.1.2. Adj. condition and cautionary items
(1) Lighting condition in surrounding area surrounding lighting should be lower 10 lux. Try to isolate adj. area into dark surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be within 10cm and perpendicular of the module surface
(80°~ 100°)
(3) Aging time
- After Aging Start, Keep the Power ON status during 5
Minutes.
- In case of LCD, Back-light on should be checked using no signal or Full-white pattern.
5.1.2. Equipment
(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)
(2) Adj. Computer (During auto adj., RS-232C protocol is needed)
(3) Adjust Remocon
(4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49)
→ Only when internal pattern is not available
※ Color Analyzer Matrix should be calibrated using CS-1000
5.1.3. Equipment connection
5.1.4. Adjustment Command (Protocol)
(1) RS-232C Command used during auto-adj.
RS-232C COMMAND
CMD DATA
Wb 00
Wb 00
ID
00 ff
Explanation
Begin White Balance adj.
End White Balance adj.
(internal pattern disappears )
Ex) wb 00 00 -> Begin white balance auto-adj.
wb 00 10 -> Gain adj.
ja 00 ff -> Adj. data
jb 00 c0
...
...
wb 00 1f -> Gain adj. complete
*(wb 00 20(start), wb 00 2f(end)) -> Off-set adj.
wb 00 ff ->End white balance auto adj.
(2) Adjustment Map
Adj. item
Cool R Gain
G Gain
B Gain j j
Command
(lower case ASCII)
Data Range
(Hex.)
CMD1 CMD2 MIN j g 00 h i
00
00
MAX
C0
C0
C0
R Cut
G Cut
B Cut
Medium R Gain
G Gain
B Gain j j j a b c
00
00
00
C0
C0
C0
R Cut
G Cut
B Cut
Warm R Gain
G Gain
B Gain
R Cut
G Cut
B Cut j j j d e f
00
00
00
C0
C0
C0
Default
(Decimal)
128
128
128
192
192
172
128
128
128
172
172
192
128
128
128
192
192
192
▪ When you connect the RS232 to set Phone jack, please use
3pin phone jack cable.
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 12 LGE Internal Use Only
5.1.5. Adjustment method
5.1.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON key)
(2) Place optical probe on the center of the display
- It need to check probe condition of zero calibration before adjustment.
(3) Connect RS-232C Cable
(4) Select mode in ADJ Program and begin a adjustment.
(5) When WB adjustment is completed with OK message, check adjustment status of pre-set mode (Cool, Medium,
Warm)
(6) Remove probe and RS-232C cable.
▪ W/B Adj. must begin as start command “wb 00 00” , and finish as end command “wb 00 ff”, and Adj. offset if need
5.1.5.2. Manual adjustment
(1) Set TV in Adj. mode using POWER ON
(2) Zero Calibrate the probe of Color Analyzer, then place it on the center of LCD module within 10cm of the surface..
(3) Press ADJ key → EZ adjust using adj. R/C → 6. White-
Balance then press the cursor to the right (KEY►).
(When KEY(►) is pressed 204 Gray(80IRE) internal pattern will be displayed)
(4) One of R Gain / G Gain / B Gain should be fixed at 192, and the rest will be lowered to meet the desired value.
(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of color temperature.
※ CASE
First adjust the coordinate far away from the target value(x, y).B
(1) x, y >target
i) Decrease the R, G.
(2) x, y< target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x >target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
► How to adjust
(1) Fix G gain at least 172 :
Adjust R, B Gain ( In Case of Mostly Blue Gain Saturation )
(2) When R or B Gain > 255, Release Fixed G Gain and
Readjust
※ CASE : Medium / Warm mode
First adjust the coordinate far away from the target value(x, y).
(1) x, y >target
i) Decrease the R, G.
(2) x, y< target
i) First decrease the B gain,
ii) Decrease the one of the others.
(3) x >target , y< target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
(4) x < target , y >target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
5.1.6. Reference (White Balance Adj. coordinate and color temperature)
▪ Luminance: 204 Gray, 80IRE
6
7
4
5
8
9
** (normal line) LGD Cell (LF56xx, LF55xx,LF54xx)
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
Cool
L15
Aging time
(Min)
X Y
Medium
X Y X
Warm
Y
1
2
3
0-2
3-5
6-9
271 270 286 289 313 329
281 285 296 304 323 344
280 284 295 303 322 343
279 282 294 301 321 341
10-19
20-35
36-49
50-79
80-119
Over 120
277
275
273
272
271
271
279
275
273
272
270
270
292
290
288
287
286
286
288
294
292
291
289
289
319
317
315
314
313
313
338
334
332
331
329
329
8
9
6
7
3
4
5
** (Aging chamber) LGD Cell (LF56xx, LF55xx,LF54xx)
▪ Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
Cool Medium Warm
L15
Aging time
(Min)
X Y X Y X Y
271 270 286 289 313 329
1
2
0-5
6-10
280 285 295 304 319 340
276 280 291 299 315 335
11-20
21-30
31-40
41-50
51-80
81-119
Over 120
272
269
267
275
272
268
287
284
282
294
291
287
311
308
306
330
327
323
266 265 281 284 305 320
265 263 280 282 304 318
264 261 279 280 303 316
264 260 279 279 303 315
** For INX,AUO,SHARP,CSOT Module.( In the case of , the color temperature spec of cool mode is 13000K)
L15 x cool y x med y x warm y spec target
271
276
270
277
286
291
289
296
313
318
329
336
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 13 LGE Internal Use Only
5.2. Option selection per country
5.2.1. Overview
(1) Tool option selection is only done for models in Non-USA
North America due to rating
(2) Applied model: LA57H Chassis applied to CANADA and
MEXICO
5.2.2. Country Group selection
(1) Press ADJ key on the Adj. R/C, and then select Country
Group Menu
(2) Depending on destination, select US, then on the lower
Country option, select US, CA, MX.
Selection is done using +, - KEY
(3) Using DFT(Auto)
※ PC (for communication through RS-232C) -> UART Baud rate : 115200 bps
Command : ah 00 00 DATA(Area Number(hexadecimal))
ITEM
AREA OPTION1
DATA(Area Number)
0
1
2
AREA
USA
CANADA
MEXICO
6. GND and HI-POT Test
6.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion condition
6.2. GND & HI-POT auto-check
(1) Pallet moves in the station. (POWER CORD / AV CORD is tightly inserted)
(2) Connect the AV JACK Tester.
(3) Controller (GWS103-4) on.
(4) GND Test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, execute next process (Hi-pot test).
(Remove A/V CORD from A/V JACK BOX)
(5) HI-POT test (Auto)
- If Test is failed, Buzzer operates.
- If Test is passed, GOOD Lamp on and move to next process automatically.
6.3. Checkpoint
(1) Test voltage
- GND: 1.5KV/min at 100mA
- SIGNAL: 3KV/min at 100mA
(2) TEST time: 1 second
(3) TEST POINT
- GND Test = POWER CORD GND and SIGNAL CABLE
GND.
- Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.
(4) LEAKAGE CURRENT: At 0.5mArms
5.2.3. Tool Option inspection
▪ Press Adj. key on the Adj. R/C, then select Tool option.
Model
-
2,3th
Suffix
4th
Suffix Module Tool 1 Tool 2 Tool 3 Tool 4
M Sharp 13074 13314 41036 28768 32LF560B
-Ux
32LF550B
-Ux
CC/US M
WM M
CC/US F
Sharp 13074 17410 53324 24672
Sharp 13074 17410 53316 24672
BOE 21266 17410 53324 24672
32LF5600
-Ux
32LF5600
-Ux
42LF5600
-Ux
42LF5500
-Ux
49LF5500
-Ux
55LF5500
-Ux
LGD
LGD
LGD
LGD
AUO
LGD
LGD
AUO
AUO
BOE
BOE
LGD
LGD
AUO
BOE
LGD
LGD
LGD
LGD
WM D
CC/US Y
WM Y
CC/US D
WM D
CC/US Y
WM Y
CC/US Y
WM Y
WM F
CC/US Y
WM Y
CC/US Y
WM Y
CC/US F
WM F
CC/US Y
WM Y
CC/US D
21266 17410 53316 24672
785 17410 49228 24672
785
785
785
17410 49220 24672
1030
1030
45132 28768
45124 28768
21264 1030 49228 20576
21264 1030 49220 20576
1553 1030 49228 28768
1553 1030 49220 28768
9744 1030 49228 24672
9744 1030 49220 24672
1553 5126 49228 28768
1553 5126 49220 28768
9744 5126 49228 24672
9744 5126 49220 24672
2321 5126 49228 24672
2321 5126 49220 24672
2833 5126 53324 24672
2833 5126 53316 24672
※ Tool option can be reconstructed by Software
7. AUDIO output check
7.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation
(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)
(3) RGB PC: 1KHz sine wave signal (0.7Vrms)
7.2. Specification
No Item Min
1 Audio practical max Output,
L/R
(Distortion=10% max
Output)
4.5
6.0
Typ
5.0
6.3
2 Audio practical max Output,
L/R
(Distortion=10% max
Output)
9.0
8.5
10.0
8.9
Max Unit
6.0
6.9
W
Vrms
12.0
9.8
W
Vrms
Remark
(1) Measurement condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker (8Ω
Impedance)
(3) LF55 Series
(1) Measurement condition
- EQ/AVL/Clear
Voice: Off
(2) Speaker (8Ω
Impedance)
(3) LF56 Series
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 14 LGE Internal Use Only
8. USB S/W Download
(optional, Service only)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is lower than that of TV set, it didn’t work. Otherwise USB data is automatically detected.
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically
(6) If your TV is turned on, check your updated version and
Tool option.
* If downloading version is more high than your TV have, TV can lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn’t have a DTV/
ATV test on production line.
* After downloading, TOOL OPTION setting is needed again.
(1) Push "IN-START" key in service remote controller.
(2) Select "Tool Option 1" and Push “OK” button.
(3) Punch in the number. (Each model has their number.)
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 15 LGE Internal Use Only
TROUBLE SHOOTING
1. Power-up boot check
Check PSU DC Voltage
P401_5,6,7,8 pin : 13.2V
OK
Check stand-by Voltage
L202 : +3.3V
OK
Check X100 clock
24 MHz
OK
Check P200 PWR_ON.
1pin : 3.3V
OK
NO
NO
NO
NO
Check 12pin
Power connector
Main B/D 3.3V Line
Short Check
Replace X100
Re-download software.
Check IC402/3/4 Output
Voltage
IC202 : 1.15V & 5V
IC200 : 1.8V
Q204 : 3.3V
OK
NO Replace IC402, IC403,
IC404, Q403
OK Main B/D 13.2V Line
Short Check
OK Replace IC201
(DCDC)
NO Replace Mstar(IC102) or Main board
Check TCON(Module)
Panel_VCC
Q205 : 13.2V
OK
NO
C h e c k M s t a r LV D S
Output
OK
NO
NO Check DRV ON Control
P200 11pin : High
OK
Change Module
Replace Q205
Replace Mstar(IC102) or
Main Board
Check PSU
OK Replace PSU
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 16 LGE Internal Use Only
2. Digital / Analog TV Video
Check RF Cable & Signal
OK
Check Tuner 3.3V Power
L500
OK
NO
Check IF_P/N Signal
TU501 6,7 Pin
OK
NO
Check Mstar LVDS Output NO
Replace L500
Bad Tuner. Replace
Tuner.
Replace Mstar(IC102) or Main Board.
3. AV Video
Check input signal format.
Is it supported?
OK
Check AV Cable for damage f o r d a m a g e o r o p e n conductor
OK
Check JK401,
CVBS Signal Line
R120
OK
NO
Check CVBS_DET Signal NO
Replace Jack
Replace AR401 or R110
OK
C h e c k M s t a r LV D S
Output
NO Replace Mstar(IC102)
or Main Board.
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 17 LGE Internal Use Only
4. Component Video
Check input signal format.
Is it supported?
OK
Check Component Cable f o r d a m a g e o r o p e n conductor.
OK
NO Check JK401
Y/PB/PR signal Line
OK
C h e c k C O M P _ D E T
Signal
OK
NO
C h e c k M s t a r LV D S
Output
NO
Replace Jack
Replace AR401or R109
Replace Mstar(IC101) or
Main Board.
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 18 LGE Internal Use Only
5. HDMI Video
Check input signal format.
Is it supported?
OK
Check HDMI Cable conductors for damage or open conductor.
OK
Check EDID
AR102, AR101, AR410, AR411 I2C
Signal
NO
OK
Check JK403, JK404 NO
Replace the defective IC or re-download EDID data
Replace Jack
OK
Check HDMI_DET (HPD) NO Replace R418, R410,
Q400, R419
OK
Check HDMI Signal NO Check other set
If no problem, check signal line
OK
C h e c k M s t a r LV D S
Output
NO Replace Mstar(IC101) or
Main Board.
NO Replace Main Board
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 19 LGE Internal Use Only
6. All Source Audio
Check the TV Speaker Menu
(Menu -> Audio -> TV Speaker)
ON
OFF Toggle the Menu
Check AMP IC(IC5600) Power
24V, 3.3V
OK
NO Main B/D 3.3V Line
Short Check
Check Mstar AUDIO_MASTER_CLK
R148
OK
NO
Check AMP I2C Line
R140, R141
OK
NO
Replace Mstar(IC101) or Main Board.
Check signal line.
Or replace Mstar(IC101)
Check Mstar I2S Output
IC5600 20,21,22 Pin
OK
NO Check signal line.
Or replace Mstar(IC101)
Check Output Signal
P5600
1, 2, 3, 4 pin.
NO
OK
Check Connector &
P5600
OK
NO
Replace Audio AMP
IC(IC5600)
Replace connector if found to be damaged.
Check speaker resistance and connector damage.
NO Replace speaker.
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 20 LGE Internal Use Only
7. Digital / Analog TV Audio
Check RF Cable & Signal
OK
Check Tuner 3.3V Power
L500
OK
Check Tuner I2C
AR500, R502, R503
OK
Check IF_P/N Signal
TU501 6/7 Pin
OK
Follow procedure
‘7. All source audio’
trouble shooting guide.
NO Replace L500
NO Replace AR500, R502,
R503
NO Bad Tuner. Replace
Tuner.
8. AV Audio
Check AV Cable for damage for damage or open conductor
OK
Check JK401 Signal Line
R409 ,R406
OK
Follow procedure
‘7. All source audio’ trouble shooting guide.
NO Replace Jack
9. Component Audio
Check Component Cable for damage or open conductor.
OK
Check JK401 Signal Line
R409 ,R406
OK
Follow procedure
‘7. All source audio’ trouble shooting guide.
NO Replace Jack
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 21 LGE Internal Use Only
KEY1
IR
KEY2
LED
67 ~ 78
BLOCK DIAGRAM
JK605 JK603
AV1 In
In /L
In ,Pr p. R Com
Y,Pb
V_on
RL_on
IN
PWM
P_13.2V
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 22 LGE Internal Use Only
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
Copyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 23 LGE Internal Use Only
<SOC_RESET>
C100
4.7uF
10V
OPT
OPT
R103
470
POWER_DET_RESET
+3.3V_ST
C101
4.7uF
10V
R104
470K
C103
0.1uF
16V
SOC_RESET
<HW_OPTION>
+3.3V_NORMAL
FHD
R102
4.7K
MODEL_OPT
HD
R101
4.7K
SUB_NVRAM_ROHM
IC100-*1
BR24G512FJ-3
A0
1
A1
2
A2
3
GND
4
8
VCC
7
WP
6
SCL
5
SDA
EEPROM(512KB)
NVRAM_ATMEL
IC100
AT24C512C-SSHD-T
A0
1
A1
2
A2
3
GND
4
8
VCC
7
WP
6
SCL
5
SDA
OPT
C102
8pF
C105
0.1uF
16V
AR100
33
1/16W
+3.3V_ST
R106
2.2K
R107
2.2K
AVDD_MOD
KEY1
KEY2
LED_RED
+1.15V_VDDC
DDR_DATA
AV_DET
DDC_SCL_1
DDC_SDA_1
COMP_DET
5V_DET_HDMI_2
DDC_SDA_2
DDC_SCL_2
HPD2
HDMI2_5V
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
CK-_HDMI2
I2C_SCL
I2C_SDA
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
R111
AR103
100
1/16W
R110 1K
AR102
100
1/16W
1/16W
1K
R109
R108
1K
10K
R128
MHL Disable
10K
AR101 100
+1.15V_VDDC
DM_P1
GPIO54
DDCDD_CL
125
DP_P1
AVDD_MOD_4
SAR0/GPIO75
SAR1/GPIO74
SAR2/GPIO73
126
127
128
129
VDDC_3
VDDIO_DATA
130
131
132
133
134
DDCDD_DA
DDCDA_CL
VDDC_4
RXCN_D
RXCP_D
135
136
DDCDA_DA
MHL_DET/GPIO86
137
138
DDCDB_DA 139
DDCDB_CL
GND_EFUSE
140
HOTPLUG_B
AVDD_5V_MHL
141
142
143
144
145
RX0N_D
RX0P_D
146
147
148
RX1N_D
RX1P_D
149
150
RX2N_D
RX2P_D
151
152
RXCN_B
RXCP_B
RX0N_B
153
154
155
RX0P_B
E-PAD
156
OPT
C104
8pF
SERIAL FLASH(64MB)
+3.3V_ST
/FLASH_WP
R100
10K
/SPI_CS
SPI_SDO
OPT
R105
4.7K
IC101
W25Q64FVSSIG
CS
1
DO[IO1]
2
WP[IO2]
3
GND
4
8
VCC
7
%HOLD[IO3]
6
CLK
5
DI[IO0]
C106
0.1uF
16V
SPI_SCK
SPI_SDI
Not USe Macronix (EAN63146601)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
OPT
AR105
4.7K
Closed to SoC as possible
AR107
33
1/16W
<Chip config.>
4.7K
1/16W AR108
R114
10K
R117
10K
Closed to SoC as possible
IC102
LGE8220(MSD8220LBM)
[M1L]
TP1
C116
0.1uF
16V
C117
10uF
6.3V
<MAIN SoC Vcc>
L102
PZ1608U121-2R0TF
+3.3V_ST
C121
10uF
6.3V
C127
1uF
10V
C131
0.1uF
16V
+1.15V_VDDC
C120
10uF
6.3V
C126
1uF
10V
+1.8V_DDR
L101
PZ1608U121-2R0TF
DDR_CMD
C129
0.1uF
16V
C132
0.1uF
16V
C130
0.1uF
16V
C139
0.1uF
C137
0.1uF
16V
16V
C138
AVDD_MOD
+3.3V_ST
L105
PZ1608U121-2R0TF
C140
0.1uF
16V
C147
0.1uF
16V
L108
PZ1608U121-2R0TF
0.1uF
16V
+1.8V_DDR
L104
PZ1608U121-2R0TF
DDR_DATA
AVDD_DADC
AVDD_AU33
C146
0.1uF
16V
L107
PZ1608U121-2R0TF
AVDD_DMPLL
C145
0.1uF
16V
L106
PZ1608U121-2R0TF
AVDD_VIDEO
C144
0.1uF
16V
C118
10uF
6.3V
C119
0.1uF
16V
OPT
C125
0.1uF
16V
C135
10uF
6.3V
C136
0.1uF
16V
OPT
C141
0.1uF
16V
Closed to Main SoC Each Pin
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
78
77
76
75
74
73
72
71
70
69
G_ODD[3]/LVA0-/LLV1-/EPI1-
G_ODD[2]/LVA0+/LLV1+/EPI1+
G_ODD[1]/LVA1-/LLV2-/EPI0-
G_ODD[0]/LVA1+/LLV2+/EPI0+
B_ODD[7]/LVA2-/LLV3(CLK)-
B_ODD[6]/LVA2+/LLV3(CLK)+
B_ODD[5]/LVACLK-/LLV4-
B_ODD[4]/LVACLK+/LLV4+
B_ODD[3]/LVA3-/LLV5-
B_ODD[2]/LVA3+/LLV5+
B_ODD[1]/LVA4-/LLV6-
B_ODD[0]/LVA4+/LLV6+
GPIO53/I2S_OUT_SD
GPIO52/I2S_OUT_BCK
GPIO51/I2S_OUT_MCK
GPIO50/I2S_OUT_WS
GPIO49/SPDIF_OUT
GPIO47
SPDIF
R126
100
RXA3+
RXA3-
RXACK+
RXACK-
RXA2+
RXA2-
RXA1+
RXA1-
RXA0+
RXA0-
AUD_LRCH
AUD_SCK
AUD_MASTER_CLK
AUD_LRCK
SPDIF_OUT
VCOM_SDA
GPIO46/MHL_VBUS
GPIO45/I2C_SCLM/UART_RX1
GPIO44/I2C_SDAM/UART_TX1
VDDC_2
VDDIO_CMD
AVDD_MOD_2
XOUT
XIN
AVDD3P3_DMPLL
AVDD3P3_DADC
VIFM
R122
VIFP
IFAGC
LINEOUTR0
R123
0
0
C124
0.1uF
16V
C123
0.1uF
16V
+1.15V_VDDC
DDR_CMD
AVDD_MOD
AVDD_DMPLL
AVDD_DADC
OPT
C128
100pF
R127
1M
VCOM_SCL
TU_SCL
TU_SDA
C143
X100
24MHz
C142
15pF
15pF
Closed to SoC
IF_N_MSTAR
IF_P_MSTAR
OPT
C134
100pF
Closed to SoC
+3.3V_NORMAL
C122
0.1uF
16V R124
10K
R125
100
IF_AGC_MAIN
C133
0.047uF
25V
Close to MSTAR
L15_M1L
MAIN 1
140822
5
LGE Internal Use Only
L15 NA POWER BLOCK
FROM LIPS or POWER B/D
+3.3V_ST
TR_NXP
MMBT3906(NXP)
Q201
TR_KEC
Q201-*1
2N3906S-RTK
E C
RL_ON
OPT
R201
10K
R205
10K
1
2
3
OPT
R215
33K
B
R202
10K
OPT
R207
0
To make high at RL_ON when AC On
INV_CTL
+3.3V_ST
R200
10K
R203
10K
B
C
TR_KEC
Q200-*1
2N3904S
B
E
P200
SMAW200-H12S5K(BK)(LTR)
+3.3V_NORMAL
OPT
VR200
ICVS0518150FR_
C
R206
1K
R209
100
TR_NXP
Q200
MMBT3904(NXP)
E
L208
MLB-201209-0120P-N2
OPT
L201
MLB-201209-0120P-N2
PWR_ON
GND
D13.2V
A13.2V
GND
DRV_ON
1
3
5
7
9
11
13
M13.2V
10
12
6
8
2
4
PDIM#2
D13.2V
D13.2V
A13.2V
GND
PDIM#1
C203
10uF
25V
C205
0.1uF
25V
C241
0.1uF
25V
A13.2V
PWM_DIM2
PWM_DIM
PANEL_Vcc
M13.2V
L203
UBW2012-121F
OPT
C212
0.1uF
25V
PANEL_CTL
R219
33K
10%
1608
Q205
SSM3J332R
D S
Panel_Cgs_0.22uF
C213
0.22uF
25V
G
R220
120K
B
10%
1608
Panel_Cgs_0.1uF
C213-*1
0.1uF
50V
C
TR_NXP
Q202
MMBT3904(NXP)
B
C
TR_KEC
Q202-*1
2N3904S
E E
PANEL_VCC
R224
3.3K
OPT
R225
3.3K
SUB_FET_3.3V_AOS
+3.3V_Normal
+3.3V_ST
R221
12K
C214
4.7uF
10V
FET_3.3V_TOSHIBA
Q204
SSM3J332R
+3.3V_NORMAL
L204
PZ1608U121-2R0TF
C215
0.1uF
16V
C218
10uF
6.3V
OPT
ZD202
5V
OPT
R216
10K
POWER_ON/OFF
OPT
R217
10K
R218
10K
B
R222
1.8K
C
TR_NXP
Q203
MMBT3904(NXP)
E
B
C
TR_KEC
Q203-*1
2N3904S
E
+1.8V_DDR
+3.3V_NORMAL
C201
10uF
6.3V
IN
IC200
AZ1117EH-ADJTRG1
OUT
ADJ/GND
R1
1%
R212
3.9K
R2
1%
R213
1.6K
+1.8V_DDR
R214
0
C208
10uF
6.3V
ZD200
2.5V
OPT
ZD205
5.1v
Check ESR!!
Vout=1.25*(1+R2/R1)+I(ADJ)XR2
Power_DET
C224
0.1uF
16V
+13.2V --> 3.56V
PANEL_VCC
R232
14K
1%
R233
5.6K
1%
+3.3V_ST
OPT
R236
0
OPT
R237
0
+3.3V_ST
R241
100K
Reset_IC_KEC
IC203
KIC7529M2
VCC
3
1
GND
2
OUT
R245
300
RESET_IC_DIODES
IC203-*1
APX803E29
VCC
3
1
GND
2
RESET
POWER_DET_RESET
R246
4.7K
POWER_DET
C238
0.1uF
+5V_Normal & +1.15V_VDDC
+3.3V_STANDBY
M13.2V
L200
BLM18PG121SN1D
C200
10uF
25V
OPT
C202
0.1uF
25V
+3.3V_ST
R210
100K
R204
6.2K
R208
68K
1/16W
1%
C204
100pF
50V
1/16W
1%
R1
R2
R248
33K
IC201
BD9D321EFJ [EP]
C206
1uF
10V
EN
1
FB
2
8
VIN
7
BOOT
VREG
3 6
SW
C207
2200pF
50V
SS
4
3A
5
GND
16V
0.1uF
C209
L202
2uH
C210
22uF
10V
3216
125C
CST Check!!
C211
22uF
10V
3216
125C
OPT
ZD201
5V
SD05
Vout=0.765*(1+R1/R2)
+3.3V_NORMAL
R223
10K
L205
CB2012PK501T
R226
10K
M13.2V
+3.3V_ST
OPT
C216
4700pF
50V
OPT
R249
300K
USB_CTL
OPT
C217
4700pF
50V
OPT
R250
300K
+3.3V_NORMAL
R227
4.7K
OPT
+3.3V_NORMAL
R247
3.3K
C219
10uF
25V
C220
10uF
25V
0
R230
OPT
C221
2200pF
50V
50V
OPT
C222
2200pF
R229
91K
SS2
1
EN1
2
EN2
ROSC/SYNC
THERMAL
25
18
17
3 IC202 16
4
SN1406035RGER
15
SW_EN
5 14
NFAULT
6 13
COMP1
FB1
AGND
RSET
FB2
COMP2
R231
0
L206
4.7uH
Vout=0.6(R1/R2)+0.6
+1.15V_VDDC
R1
R238
4.7K
1%
R2
R239
5.1K
1%
OPT
C231
82pF
50V
OPT
ZD203
2.5V
OPT
C234
10uF
6.3V
C237
22uF
6.3V
C240
22uF
6.3V
OPT
ZD204
5.1v
C233
22pF
50V
R240
10K
C232
3300pF
50V
R242
200
1%
R243
5.1K
1%
R234 15K
R2
C230
22pF
50V
R235
20K
C229
3300pF
50V
R244
39K
1%
R1
C235
47pF
50V
+5V_NORMAL
C228
0.047uF
25V
L207
4.7uH
USB_OCD
+5V_NORMAL
C236
22uF
16V
3216
85C
C239
22uF
16V
3216
85C
+5V_USB
C227
1uF
16V
Vout=0.6(R1/R2)+0.6
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
L15_M1L
POWER
141020
2 5
LGE Internal Use Only
AUDIO AMP(TI)/LVDS/IR
IR
+3.3V_ST
[51Pin LVDS Connector]
(For FHD 60Hz)
FHD
P300
SP14-11592-01-51Pin
52
45
46
47
42
43
44
39
40
41
36
37
38
48
49
50
51
33
34
35
30
31
32
26
27
28
29
23
24
25
20
21
22
17
18
19
14
15
16
11
12
13
8
9
10
5
6
7
1
2
3
4
AR300
0
VCOM_SDA_M
VCOM_SCL_M
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
R300
R320
0
0
FHD_GND_26
FHD_GND_27
RXB0-
RXB0+
RXB1-
RXB1+
RXB2-
RXB2+
RXBCK-
RXBCK+
RXB3-
RXB3+
FHD_GND_42_43
FHD_VCC_Cap
C300
10uF
25V
LVDS_SEL
+3.3V_NORMAL
OPT
R302
3.3K
OPT
R301
10K
PANEL_VCC
FHD
L300
UBW2012-121F
FHD
C301
0.1uF
25V
[30Pin LVDS Connector]
(For HD 60Hz_Normal)
HD
P301
10031HR-30
31
22
23
24
19
20
21
16
17
18
13
14
15
28
29
30
25
26
27
10
11
12
7
8
9
4
5
6
1
2
3
VCOM_SCL_M
VCOM_SDA_M
RXA0-
RXA0+
RXA1-
RXA1+
RXA2-
RXA2+
RXACK-
RXACK+
RXA3-
RXA3+
LVDS_SEL
+3.3V_NORMAL
OPT
R307
3.3K
OPT
R306
10K
HD_VCC_Cap
C303
10uF
25V
PANEL_VCC
HD
L302
120OHM
UBW2012-121F
HD
C306
0.1uF
25V
Need to Check.
AMP_MUTE
POWER_DET
R303
0
1/16W
Separate DGND AND AVSS
OPT
R304
0
AMP_SDA
AMP_SCL
+3.3V_NORMAL
R305
4.7K
A13.2V
AUD_MASTER_CLK
L301
120OHM
OPT
C302
1000pF
50V
+3.3V_NORMAL
AUD_LRCK
AUD_SCK
AUD_LRCH
AMP_RESET
V-COM I2C or GPIO(Tuner)
+3.3V_NORMAL
VCOM_SCL_M
VCOM_SDA_M
V_COM
R316
2K
AR302
0
V_COM
OPT
R323
2K
V_COM
R317
2K
OPT
R324
2K
VCOM_SCL
VCOM_SDA
KEY1
AR303
10K
1/16W
VR302
OPT
C338
0.1uF
16V
KEY2
OPT
VR301
OPT
C337
0.1uF
16V
+3.3V_ST
L307
PZ1608U121-2R0TF
C335
0.1uF
16V
LED_RED
C336
1000pF
50V
OPT
VR300
+3.3V_ST
OPT
R322
3.3K
IR
C339
100pF
50V
OPT
VR303
+13.2V_AMP
OPT
C307
0.1uF
50V
+3.3V_NORMAL
C305
0.1uF
16V
AUDIO AMP(TI)
This parts are Located on AVSS area.
R311
470
C313
4700pF C314
0.047uF
C310
0.047uF
C311
4700pF
R310
470
C315
2200pF
50V
C318
0.033uF
50V
C309
0.1uF
16V
R309
2.2K
R308
18K 1%
AVDD
A_SEL_FAULT
MCLK
OSC_RES
DVSSO
VR_DIG
PDN
LRCLK
SCLK
SDIN
SDA
SCL
13
14
15
16
17
18
19
20
21
22
23
24
C308
0.1uF
16V
+3.3V_NORMAL
IC300
TAS5733
C316
0.1uF
16V
+13.2V_AMP
R312
18
1/16W
1%
C326
330pF
50V
C320
0.1uF
50V
C322
10uF
25V
48
47
46
45
44
43
42
41
40
39
38
37
[EP]
PGND_AB_2
PGND_AB_1
OUT_B
NC_6
NC_5
BST_B
BST_C
NC_4
NC_3
OUT_C
PGND_CD_2
PGND_CD_1
R313
18
C327
330pF
50V
1/16W
1%
C324
0.033uF
50V
C325
0.033uF
50V
+13.2V_AMP
C321
0.1uF
50V
C323
10uF
25V
R314
18
1/16W
1%
C328
330pF
50V
C329
330pF
50V
R315
18
1/16W
1%
OPT
ZD300
5V
C317
1uF
16V
C319
0.033uF
50V
C312
0.1uF
16V
L304
10.0uH
NRS6045T100MMGK
L306
10.0uH
NRS6045T100MMGK
L303
10.0uH
NRS6045T100MMGK
L305
10.0uH
NRS6045T100MMGK
C330
0.33uF
50V
C331
0.33uF
50V
C332
0.1uF
50V
C333
0.1uF
50V
C334
0.1uF
50V
C340
0.1uF
50V
OPT
P302
12507WR-08L
7
8
5
6
3
4
1
2
9
P303
12507WR-10L
7
8
5
6
9
10
3
4
1
2
11
Close to Speaker
SPK_L+
OPT
C341
2200pF
50V
OPT
C342
2200pF
50V
SPEAKER_L
SPK_L-
SPK_R+
OPT
C343
2200pF
50V
OPT
C344
2200pF
50V
SPEAKER_R
SPK_L+
SPK_L-
SPK_R+
SPK_R-
P304
250A1-WR-H04M
4
3
2
1
SPK Wafer Box Type
SPK_R-
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
L15_M1L
LVDS/S_AMP/IR
140828
3 5
LGE Internal Use Only
EXTERNAL INTERFACE
AV/COMPONENT
JK401
PPJ245N2-01
[RD2]E-LUG
6E
5E
[RD2]O-SPRING
4E
[RD2]CONTACT
5D
[WH]O-SPRING
4C
[RD1]CONTACT
5C
[RD1]O-SPRING
7C
[RD1]E-LUG-S
5B
[BL]O-SPRING
4A
[GN/YL]CONTACT
5A
[GN/YL]O-SPRING
6A
[GN/YL]E-LUG
UART For DEBUG
JK400
KJA-PH-1-0177
6 M6
1 M1
3 M3_DETECT
4 M4
5 M5_GND
OPT
R400
0
1/16W
5%
VR403
OPT
R402
470K
OPT
C402
1000pF
50V
R409
10K
R408
12K
COMP_R_IN
VR401
OPT
R401
470K
OPT
C401
1000pF
50V
R406
10K
R407
12K
AR401
10K
1/16W
COMP_L_IN
+3.3V_NORMAL
COMP_DET
OPT
VR402
COMP_Pr+
ZD404
ZD405
OPT
VA402
R405
75 1%
ICVS0518150FR_ comp-shape=1005
COMP_Pb+
ZD402
ZD403
OPT
VA401
ICVS0518150FR_
R404
75 1% comp-shape=1005
AV_DET
OPT
VR400
COMP_Y+
ZD401
ZD400
OPT R403
75
VA400
ICVS0518150FR_
1% comp-shape=3216
+3.3V_ST
C400
0.1uF
AR400
100
1/16W
P400
12507WS-04L
1
2
3
4
5
IC400
MAX3232CDR
VCC
16
GND
15
DOUT1
14
1
C1+
2
V+
3
C1-
C406
0.1uF
C405
0.1uF
RIN1
ROUT1
13
12
DIN1
11
DIN2
10
ROUT2
9
EAN41348201
4
C2+
5
C2-
C404
0.1uF
6
V-
7
DOUT2
C403
0.1uF
8
RIN2
SPDIF OPTIC JACK
SPDIF_OUT
+3.3V_NORMAL
OPT
C408
1uF
10V
ESD Ready
GND
SPDIF
JK402
JST1223-001
VCC
VINPUT
SPDIF
C412
18pF
50V
HDMI_1(REAR)
OPT
R414
10K
JK404
GND
20
SHIELD
5
4
3
8
7
6
19
18
17
HP_DET
5V
GND
DDC_DATA
DDC_CLK
16
15
14
13
NC
CE_REMOTE
CK-
12
11
10
9
CK_GND
CK+
D0-
D0_GND
D0+
D1-
D1_GND
D1+
D2-
2
1
D2_GND
D2+
R410
1K
R413
2.7K
OPT
VR404
L401
DLP11SA900HL2L
4 3
1 2
L402
DLP11SA900HL2L
4 3
1 2
L403
DLP11SA900HL2L
4 3
1 2
L404
DLP11SA900HL2L
4 3
1 2
TR_NXP
Q400
MMBT3904(NXP)
C
E
OPT
VR408
5V_DET_HDMI_1
C
B
R418
10K
B
TR_KEC
Q400-*1
2N3904S
E
VR409
OPT
R416
4.7K
AR410
4.7K
1/16W
OPT
VR410
OPT
VR412
AR406
AR407
AR408
AR409
5.1
1/16W
5.1
1/16W
5.1
1/16W
5.1
1/16W
CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
D2+_HDMI1
HDMI_EMI_Filter
+5V_NORMAL
HPD1
DDC_SDA_1
DDC_SCL_1
USB(SIDE)
P401
3AU04S-305-ZC-(LG)
+5V_USB
OPT
ZD406
5V
C407
22uF
16V
3216
OPT
C409
22uF
16V
3216
OPT
C417
22uF
10V
2012
OPT
C418
22uF
10V
2012
RCLAMP0502BA
OPT
D400
OPT
C413
5pF
50V
OPT
C414
5pF
50V
SIDE_USB_DM
SIDE_USB_DP
HDMI_2(SIDE)
JK403
20
GND
BODY_SHIELD
19
HP_DET
18
5V
17
GND
16
DDC_DATA
15
DDC_CLK
14
NC
13
CE_REMOTE
12
CK-
11
CK_GND
CK+
10
D0-
9
D0_GND
8
D0+
7
D1-
6
D1_GND
5
D1+
4
D2-
3
D2_GND
2
D2+
1
Check!!
HPD2 Pull-Up
HDMI2_5V
R420
10
OPT
R411
1K
R412
2.7K
VR405
OPT
AR404
AR405
AR402
AR403
5.1
1/16W
5.1
1/16W
5.1
1/16W
5.1
1/16W
OPT
VR406
5V_DET_HDMI_2
VR407
OPT
R415
4.7K
OPT
D401
IP4283CZ10-TBA
3
4
5
1
2
10
9
8
7
6
3
4
5
1
2
D402
IP4283CZ10-TBA
OPT
10
9
8
7
6
R419
33
OPT
VR411
CK-_HDMI2
CK+_HDMI2
D0-_HDMI2
D0+_HDMI2
D1-_HDMI2
D1+_HDMI2
D2-_HDMI2
D2+_HDMI2
AR411
4.7K
1/16W
OPT
VR413
+5V_NORMAL
HPD2
DDC_SDA_2
DDC_SCL_2
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
L15_M1L
COMP/USB/SPDIF
141020
4 5
LGE Internal Use Only
TUNER for ATSC W/O Isolator
TU501
TDJH-H301F
A1
A1
1
2
3
4
5
8
9
6
7
+3.3V
NC_1
DIF_AGC
SCL_RF
SDA_RF
DIF[P]
DIF[N]
SIF
CVBS
B1
B1
47
SHIELD
3.3V_NORMAL -> 3.3V_TU
+3.3V_NORMAL
C507
0.1uF
16V
+3.3V_TU
C508
22uF
6.3V
L500
PZ1608U121-2R0TF
C509
22uF
6.3V
C510
0.1uF
16V
+3.3V_TU
C500
100pF
50V
C503
0.1uF
16V close to the tuner pin
C502
0.1uF
16V should be guarded by ground
IF_AGC_MAIN
+3.3V_TU
C501
15pF
50V
C504
15pF
50V
R501
33
1/16W
5%
R500
33
1/16W
5%
Close to the tuner
AR500
33
1/16W
OPT
C505
20pF
50V
OPT
C506
20pF
50V
IF_P_MSTAR
IF_N_MSTAR
R502
1.8K
R503
1.8K
TU_SCL
TU_SDA
1. should be guarded by ground
2. No via on both of them
3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright ⓒ 2015 LG Electronics. Inc. All right reserved.
Only for training and service purposes
L15_M1L
TUNER
140822
5 5
LGE Internal Use Only
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