PS3108-S8 2.5`` SATA SSD Specification
Phison Electronics Corporation
PS3108-S8 2.5’’ SATA SSD Specification
Version 2.3
Document Number: S-14161
Phison Electronics Corporation
No.1, Qun-Yi Road, Jhunan, Miaoli County, Taiwan 350, R.O.C.
Tel: +886-37-586-896
Fax: +886-37-587-868
E-mail: sales@phison.com / suppport@phison.com
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countries. Products and specifications discussed herein are for reference purposes only. Copies of
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© 2013 Phison Electronics Corp. All Rights Reserved.
Revision History
Revision
Draft Date
History
1.0
2012/09/26
First Release
James Lu
1.1
2012/10/2
Modify identify device data
James Lu
1.2
2012/11/16
Modify the default and on demand supported density
James Lu
1.3
2013/02/25
Add TBW, Performance and Power Consumption Table
Allen Chiu
1.4
2013/04/08
Update performance table
Allen Chiu
1.5
2013/04/25
Update Device Identification Table: Word 76, 78, 83, 84, 88, 222
Allen Chiu
1.6
2013/05/07
Add Note for Performance Table
Allen Chiu
1.7
2013/06/27
1.8
2013/08/08
Update Physical Dimension Picture.
Allen Chiu
1.9
2013/10/17
Update TBW table
Allen Chiu
2.0
2014/01/03
Update template
Allen Chiu
2.1
2014/01/03
Update Performance Table
Allen Chiu
2.2
2014/2/10
2.3
2014/3/18
Add information about capacity 960GB/1TB (performance, TBW,
and power consumption)
Round numbers up in performance, power consumption and
TBW.
Add NCQ support queue depth
Author
Allen Chiu
James Lu
James Lu
Product Overview






Capacity
■ 30GB up to 960GB
SATA Interface
■ SATA Revision 3.1
■ SATA 1.5Gbps, 3Gbps, and 6Gbps
interface
Flash Interface
■
Flash Type: SLC / MLC
■
1pcs to 16pcs of TSOP/BGA flash
Performance
■
Read: up to 520 MB/s
■
Write: up to 490 MB/s
Power ConsumptionNote1
■
Active mode: < 6,040mW
■
Idle mode: < 320mW


MTBF
■
More than 1,000,000 hours
Advanced Flash Management
■
Static and Dynamic Wear Leveling
■
Bad Block Management
■
TRIM
SMART
■
Over-Provision
■
Firmware Update
Low Power Management
■
DIPM/HIPM Mode
Temperature Range
■
Operation: 0°C ~ 70°C
■
Storage: -40°C ~ 85°C
RoHS compliant
■



Note2
TBW (Terabytes Written)
■
2540 TBW for 960GB
Notes:
1. Please see “4.2 Power Consumption” for details.
2. Please see “TBW (Terabytes Written)” in Chapter 2” for details.
Performance and Power Consumption
Power Consumption
Performance
Capacity
Flash Structure
CrystalDiskMark
ATTO
Read
(MB/s)
Write
(MB/s)
Read
(MB/s)
Write
(MB/s)
Read
(mW)
Write
(mW)
Idle
(mW)
30GB
4GB x 8, TSOP, Type B
520
100
550
530
2,575
1,895
290
60GB
8GB x 8, TSOP, Type B
520
100
550
530
2,510
2,020
280
16GB x 8, TSOP, Type B
520
210
550
530
2,605
2,990
285
16GB x 8, BGA, Type C
520
375
550
530
2,765
3,495
295
16GB x 16, TSOP, Type B
520
410
550
530
2,535
3,505
305
32GB x 8, BGA, Type C
520
470
550
530
2,555
4,220
305
32GB x 16, TSOP, Type B
520
405
550
510
2,575
4,880
295
32GB x 16, BGA, Type C
520
490
550
520
3,795
5,520
315
64GB x 16, BGA, Type C
520
410
550
500
4,255
6,040
320
120GB
240GB
480GB
960GB
NOTE:
For more details on Power Consumption, please refer to Chapter 4.2.
TABLE OF CONTENTS
1.
INTRODUCTION............................................................................................................... 1
1.1.
General Description .......................................................................................................... 1
1.2.
Controller Block Diagram ................................................................................................. 1
1.3.
Product Block Diagram..................................................................................................... 2
1.4.
Flash Management .......................................................................................................... 2
1.4.1.
Error Correction Code (ECC) ................................................................................. 2
1.4.2.
1.4.3.
1.4.4.
1.4.5.
1.4.6.
1.4.7.
Wear Leveling ....................................................................................................... 2
Bad Block Management ....................................................................................... 3
TRIM ..................................................................................................................... 3
SMART .................................................................................................................. 3
Over-Provision ...................................................................................................... 3
Firmware Upgrade ............................................................................................... 4
1.5.
Low Power Management ................................................................................................. 4
1.5.1.
DIPM/HIPM Mode ................................................................................................ 4
1.6.
Power Loss Protection: Flushing Mechanism ................................................................... 4
1.7.
Advanced Device Security Features ................................................................................. 5
1.7.1.
Secure Erase ......................................................................................................... 5
1.7.2.
Write Protect ........................................................................................................ 5
1.8.
SSD Lifetime Management ............................................................................................... 5
1.8.1.
Terabytes Written (TBW) ...................................................................................... 5
2.
PRODUCT SPECIFICATIONS .............................................................................................. 7
3.
ENVIRONMENTAL SPECIFICATIONS.................................................................................. 9
4.
3.1.
Environmental Conditions ............................................................................................... 9
3.1.1.
Temperature and Humidity .................................................................................. 9
3.1.2.
Shock .................................................................................................................. 10
3.1.3.
Vibration ............................................................................................................ 10
3.1.4.
Drop .................................................................................................................... 10
3.1.5.
Bending .............................................................................................................. 10
3.1.6.
Torque................................................................................................................. 10
3.1.7.
Electrostatic Discharge (ESD) ............................................................................. 11
3.2.
MTBF .............................................................................................................................. 11
3.3.
Certification & Compliance ............................................................................................ 11
ELECTRICAL SPECIFICATIONS ......................................................................................... 12
4.1.
Supply Voltage ............................................................................................................... 12
4.2.
5.
INTERFACE .................................................................................................................... 13
5.1.
6.
Power Consumption ....................................................................................................... 12
Pin Assignment and Descriptions ................................................................................... 13
SUPPORTED COMMANDS .............................................................................................. 14
6.1.
ATA Command List ......................................................................................................... 14
6.2.
Identify Device Data ....................................................................................................... 15
7.
PHYSICAL DIMENSION ................................................................................................... 19
8.
REFERENCES .................................................................................................................. 22
9.
TERMINOLOGY .............................................................................................................. 23
LIST OF FIGURES
Figure 1-1 PS3108 2.5’’ SATA SSD Controller Block Diagram ............................................................... 1
Figure 1-2 PS3108 2.5’’ SATA SSD Product Block Diagram ................................................................... 2
Figure 5-1 PS3108 2.5’’ SATA SSD Pin Assignment ............................................................................. 13
LIST OF TABLES
Table 3-1 High Temperature Test Condition ......................................................................................... 9
Table 3-2 Low Temperature Test Condition.......................................................................................... 9
Table 3-3 High Humidity Test Condition ............................................................................................... 9
Table 3-4 Temperature Cycle Test ........................................................................................................ 9
Table 3-5 PS3108 2.5’’ SATA SSD Shock Specification ........................................................................ 10
Table 3-6 PS3108 2.5’’ SATA SSD Vibration Specification................................................................... 10
Table 3-7 PS3108 2.5’’ SATA SSD Drop Specification .......................................................................... 10
Table 3-8 PS3108 2.5’’ SATA SSD Bending Specification..................................................................... 10
Table 3-9 PS3108 2.5’’ SATA SSD Torque Specification....................................................................... 10
Table 3-10 PS3108 2.5’’ SATA SSD Contact ESD Specification ............................................................ 11
Table 4-1 Supply Voltage of PS3108 2.5’’ SATA SSD ........................................................................... 12
Table 4-2 Power Consumption of PS3108 2.5’’ SATA SSD .................................................................. 12
Table 5-1 Signal Segment Pin Assignment and Descriptions ............................................................. 13
Table 5-2 Power Segment Pin Assignment and Descriptions ............................................................. 13
Table 6-1 ATA Command List .............................................................................................................. 14
Table 6-2 List of Device Identification ................................................................................................ 15
Table 6-3 List of Device Identification for Each Capacity ................................................................... 18
Table 8-1 List of References................................................................................................................ 22
Table 9-1 List of Terminology ............................................................................................................. 23
1. INTRODUCTION
1.1. General Description
Phison 2.5” SATA SSD delivers all the advantages of flash disk technology with Serial ATA I/II/III interface,
including being fully compliant with standard 2.5-inch form factor, providing low power consumption
compared to traditional hard drive and hot-swapping when removing/replacing/upgrading flash disks. The
device is designed based on the standard 7-pin interface for data segment and 15-pin for power segment,
as well as operating at a maximum operating frequency of 300MHz with 40MHz external crystal. Its
capacity could provide a wide range up to 960GB. Moreover, it can reach up to 520MB/s read as well as
490MB/s write high performance based on Toshiba’s 19nm Toggle MLC flash (with 256MB/512MB DDR3
cache enabled and measured by CrystalDiskMark v3.0). Meanwhile, the power consumption of the 2.5” SSD
is much lower than traditional hard drives.
1.2. Controller Block Diagram
8 Channel Flash
Controller and ECC
Engine
8
Channel
Flash
I/F
GPIO
DMA
BUS
SATA III PHY
SATA III
Mask ROM
CPU
SATA
Controller
I2C
Master
SDR
Controller
DATA SRAM
I/F
XTAL
Programmable
SRAM
GPIO
JTAG
DDR3 I/F
Figure 1-1 PS3108 2.5’’ SATA SSD Controller Block Diagram
1
1.3. Product Block Diagram
Figure 1-2 PS3108 2.5’’ SATA SSD Product Block Diagram
1.4. Flash Management
1.4.1. Error Correction Code (ECC)
Flash memory cells will deteriorate with use, which might generate random bit errors in the stored data.
Thus, PS3108 SATA SSD applies the BCH ECC algorithm, which can detect and correct errors occur during
read process, ensure data been read correctly, as well as protect data from corruption.
1.4.2. Wear Leveling
NAND flash devices can only undergo a limited number of program/erase cycles, and in most cases, the flash
media are not used evenly. If some areas get updated more frequently than others, the lifetime of the
device would be reduced significantly. Thus, Wear Leveling is applied to extend the lifespan of NAND Flash
by evenly distributing write and erase cycles across the media.
Phison provides advanced Wear Leveling algorithm, which can efficiently spread out the flash usage through
the whole flash media area. Moreover, by implementing both dynamic and static Wear Leveling algorithms,
the life expectancy of the NAND flash is greatly improved.
2
1.4.3. Bad Block Management
Bad blocks are blocks that include one or more invalid bits, and their reliability is not guaranteed. Blocks
that are identified and marked as bad by the manufacturer are referred to as “Initial Bad Blocks”. Bad blocks
that are developed during the lifespan of the flash are named “Later Bad Blocks”. Phison implements an
efficient bad block management algorithm to detect the factory-produced bad blocks and manages any bad
blocks that appear with use. This practice further prevents data being stored into bad blocks and improves
the data reliability.
1.4.4. TRIM
TRIM is a feature which helps improve the read/write performance and speed of solid-state drives (SSD).
Unlike hard disk drives (HDD), SSDs are not able to overwrite existing data, so the available space gradually
becomes smaller with each use. With the TRIM command, the operating system can inform the SSD which
blocks of data are no longer in use and can be removed permanently. Thus, the SSD will perform the erase
action, which prevents unused data from occupying blocks all the time.
1.4.5. SMART
SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is an open standard that allows
a hard disk drive to automatically detect its health and report potential failures. When a failure is recorded
by SMART, users can choose to replace the drive to prevent unexpected outage or data loss. Moreover,
SMART can inform users of impending failures while there is still time to perform proactive actions, such as
copy data to another device.
1.4.6. Over-Provision
Over Provisioning refers to the inclusion of extra NAND capacity in a SSD, which is not visible and cannot be
used by users. With Over Provisioning, the performance and IOPS (Input/Output Operations per Second)
are improved by providing the controller additional space to manage P/E cycles, which enhances the
reliability and endurance as well. Moreover, the write amplification of the SSD becomes lower when the
controller writes data to the flash.
3
1.4.7. Firmware Upgrade
Firmware can be considered as a set of instructions on how the device communicates with the host.
Firmware will be upgraded when new features are added, compatibility issues are fixed, or read/write
performance gets improved.
1.5. Low Power Management
1.5.1. DIPM/HIPM Mode
SATA interfaces contain two low power management states for power saving: Partial and Slumber modes.
For Partial mode, the device has to resume to full operation within 10 microseconds, whereas the device
will spend 10 milliseconds to become fully operational in the Slumber mode. SATA interfaces allow low
power modes to be initiated by Host (HIPM, Host Initiated Power Management) or Device (DIPM, Device
Initiated Power Management). As for HIPM, Partial or Slumber mode can be invoked directly by the
software. For DIPM, the device will send requests to enter Partial or Slumber mode.
1.6. Power Loss Protection: Flushing Mechanism
Power Loss Protection is a mechanism to prevent data loss during unexpected power failure. DRAM is a
volatile memory and frequently used as temporary cache or buffer between the controller and the NAND
flash to improve the SSD performance. However, one major concern of the DRAM is that it is not able to
keep data during power failure. Accordingly, the PS3108 applies the GuaranteedFlush technology, which
requests the controller to transfer data to the cache. For PS3108, DDR performs as a cache, and its sizes
include 256MB or 512MB. Only when the data is fully committed to the NAND flash will the controller send
acknowledgement (ACK) to the host. Such implementation can prevent false-positive performance and the
risk of power cycling issues.
Additionally, it is critical for a controller to shorten the time the in-flight data stays in the cache. Thus,
Phison’s PS3108 applies an algorithm to reduce the amount of data resides in the cache to provide a better
performance. This SmartCacheFlush technology allows incoming data to only have a “pit stop” in the cache
and then move to the NAND flash at once. If the flash is jammed due to particular file sizes (such as random
4KB data), the cache will be treated as an “organizer”, consolidating incoming data into groups before
written into the flash to improve write amplification.
In sum, with Flush Mechanism, PS3108 proves to provide the reliability required by consumer, industrial,
and enterprise-level applications.
4
1.7. Advanced Device Security Features
1.7.1. Secure Erase
Secure Erase is a standard ATA command and will write all “0xFF” to fully wipe all the data on hard drives
and SSDs. When this command is issued, the SSD controller will empty its storage blocks and return to its
factory default settings.
1.7.2. Write Protect
When a SSD contains too many bad blocks and data are continuously written in, then the SSD might not be
usable anymore. Thus, Write Protect is a mechanism to prevent data from being written in and protect the
accuracy of data that are already stored in the SSD.
1.8. SSD Lifetime Management
1.8.1. Terabytes Written (TBW)
TBW (Terabytes Written) is a measurement of SSDs’ expected lifespan, which represents the amount of
data written to the device. To calculate the TBW of a SSD, the following equation is applied:
TBW = [(NAND Endurance) x (SSD Capacity) x (WLE)] / WAF
NAND Endurance: NAND endurance refers to the P/E (Program/Erase) cycle of a NAND flash.
SSD Capacity: The SSD capacity is the specific capacity in total of a SSD.
WLE: Wear Leveling Efficiency (WLE) represents the ratio of the average amount of erases on all the blocks
to the erases on any block at maximum.
WAF: Write Amplification Factor (WAF) is a numerical value representing the ratio between the amount of
data that a SSD controller needs to write and the amount of data that the host’s flash controller
writes. A better WAF, which is near 1, guarantees better endurance and lower frequency of data
written to flash memory.
5
1.9. An Adaptive Approach to Performance Tuning
1.9.1. Throughput
Based on the available space of the disk, PS3108 will regulate the read/write speed and manage the
performance of throughput. When there still remains a lot of space, the firmware will continuously perform
read/write action. There is still no need to implement garbage collection to allocate and release memory,
which will accelerate the read/write processing to improve the performance. Contrarily, when the space is
going to be used up, PS3108 will slow down the read/write processing, and implement garbage collection
to release memory. Hence, read/write performance will become slower.
1.9.2. Predict & Fetch
Normally, when the Host tries to read data from the SSD, the SSD will only perform one read action after
receiving one command. However, PS3108 applies Predict & Fetch to improve the read speed. When the
host issues sequential read commands to the SSD, the SSD will automatically expect that the following will
also be read commands. Thus, before receiving the next command, flash has already prepared the data.
Accordingly, this accelerates the data processing time, and the host does not need to wait so long to
receive data.
6
2. PRODUCT SPECIFICATIONS
 Capacity

Default supported capacityNote1 : 30GB, 60GB, 120GB, 240GB, 480GB, 960GB (support 48-bit
addressing mode)

On demand supported capacity : 32GB, 64GB, 128GB, 256GB, 512GB, 1TB
Note: Recommended as for best performance.
 Electrical/Physical Interface
■


SATA Interface

Compliant with SATA Revision 3.1

Compatible with SATA 1.5Gbps, 3Gbps and 6Gbps interface

NCQ support up to queue depth = 32

Support power management

Support expanded register for SATA protocol 48 bits addressing mode

Embedded BIST function for SATA PHY for low cost mass production
Supported NAND Flash

Toshiba 24nm/19nm SLC, MLC, Toggle 1.0 and Toggle 2.0

Intel/Micron 25nm/20nm SLC, MLC, ONFI 2.3 and ONFI 3.0

Hynix 20nm (TBD)

Support all types of SLC/MLC large block: 8KB/page and 16K/page page NAND flash

Support ONFI 2.3 and ONFI 3.0 interface: 5 channels at maximum

Contain 1pc to 16pcs of TSOP/BGA flash
ECC Scheme

PS3108 2.5” SSD can correct up to 72 bits error in 1K Byte data.

UART function

GPIO

Support SMART and TRIM commands
7
 Performance
Capacity
Flash
Structure
Sequential
Flash Type
Read
Write
(MB/s)
(MB/s)
30GB
8GB x 4
TSOP, Type B
520
100
60GB
8GB x 8
TSOP, Type B
520
100
16GB x 8
TSOP, Type B
520
210
16GB x 8
BGA, Type C
520
375
16GB x 16
TSOP, Type B
520
410
32GB x 8
BGA, Type C
520
470
32GB x 16
TSOP, Type B
520
405
32GB x 16
BGA, Type C
520
490
64GB x 16
BGA, Type C
520
410
120GB
240GB
480GB
960GB
NOTES:
1. The performance was measured using CrystalDiskMark with SATA 6Gbps host.
2. Samples were built using Toshiba 19nm Toggle MLC NAND flash.
3. Performance may differ according to flash configuration and platform.
4. The table above is for reference only. The criteria for MP (mass production) and for
accepting goods shall be discussed based on different flash configuration.
 TBW (Terabytes Written)
Capacity
Flash Structure
TBW
30G
8GB x 4
88
60G
8GB x 8
168
120G
16GB x 8
350
240G
16GB x 16
730
480GB
32GB x 16
1,370
960GB
64GB x 16
2,540
NOTES:
1. Samples were built using Toshiba 19nm Toggle MLC NAND flash.
2. TBW may differ according to flash configuration and platform.
3. The endurance of SSD could be estimated based on user behavior, NAND endurance
cycles, and write amplification factor. It is not guaranteed by flash vendor.
8
3. ENVIRONMENTAL SPECIFICATIONS
3.1. Environmental Conditions
3.1.1. Temperature and Humidity


Temperature:

Storage: -40°C to 85°C

Operational: 0°C to 70°C
Humidity: RH 90% under 40°C (operational)
Table 3-1 High Temperature Test Condition
Temperature
Humidity
Test Time
Operation
70°C
0% RH
72 hours
Storage
85°C
0% RH
72 hours
Result: No any abnormality is detected.
Table 3-2 Low Temperature Test Condition
Temperature
Humidity
Test Time
Operation
0°C
0% RH
72 hours
Storage
-40°C
0% RH
72 hours
Result: No any abnormality is detected.
Table 3-3 High Humidity Test Condition
Temperature
Humidity
Test Time
Operation
40°C
90% RH
72 hours
Storage
40°C
93% RH
72 hours
Result: No any abnormality is detected.
Table 3-4 Temperature Cycle Test
Operation
Storage
Temperature
Test Time
0°C
30 min
70°C
30 min
-40°C
30 min
85°C
30 min
Cycle
10 Cycles
10 Cycles
Result: No any abnormality is detected.
9
3.1.2. Shock
Table 3-5 PS3108 2.5’’ SATA SSD Shock Specification
Acceleration Force
Half Sin Pulse Duration
500G
2ms
Non-operational
Result: No any abnormality is detected when power on.
3.1.3. Vibration
Table 3-6 PS3108 2.5’’ SATA SSD Vibration Specification
Condition
Non-operational
Frequency/Displacement
Frequency/Acceleration
20Hz~80Hz/1.52mm
80Hz~2000Hz/20G
Vibration Orientation
X, Y, Z axis/30 min for each
Result: No any abnormality is detected when power on.
3.1.4. Drop
Table 3-7 PS3108 2.5’’ SATA SSD Drop Specification
Non-operational
Height of Drop
Number of Drop
110cm free fall
6 face of each unit
Result: No any abnormality is detected when power on.
3.1.5. Bending
Table 3-8 PS3108 2.5’’ SATA SSD Bending Specification
Non-operational
Force
Action
≥ 10N
Hold 1min/5times
Result: No any abnormality is detected when power on.
3.1.6. Torque
Table 3-9 PS3108 2.5’’ SATA SSD Torque Specification
Non-operational
Force
Action
0.5N-m or 5 deg
Hold 5min/5times
Result: No any abnormality is detected when power on.
10
3.1.7. Electrostatic Discharge (ESD)
Table 3-10 PS3108 2.5’’ SATA SSD Contact ESD Specification
Device
Capacity
Temperature
Relative Humidity
+/- 4KV
Result
Device functions are affected, but
2.5’’ SSD
240GB
24.0°C
49% (RH)
EUT will be back to its normal or
PASS
operational state automatically.
3.1.8. EMI Compliance

FCC: CISPR22

CE: EN55022

BSMI 13438
3.2. MTBF
MTBF, an acronym for Mean Time Between Failures, is a measure of a device’s reliability. Its value
represents the average time between a repair and the next failure. The measure is typically in units of hours.
The higher the MTBF value, the higher the reliability of the device. The predicted result of Phison’s PS3108
2.5’’ SATA SSD is more than 1,000,000 hours.
3.3. Certification & Compliance

RoHS

SATA III (SATA Rev. 3.1)

Up to ATA/ATAPI-8 (Including S.M.A.R.T)
11
4. ELECTRICAL SPECIFICATIONS
4.1. Supply Voltage
Table 4-1 Supply Voltage of PS3108 2.5’’ SATA SSD
Parameter
Rating
Operating Voltage
5V+/-5%
Maximum Ripple
100mV, 0~30MHz
4.2. Power Consumption
Table 4-2 Power Consumption of PS3108 2.5’’ SATA SSD
Capacity
Flash Structure
Flash Type
Read
Write
Partial
Slumber
Idle
30GB
8GB x 4
TSOP, Type B
2,575
1,895
80
55
290
60GB
8GB x 8
TSOP, Type B
2,510
2,020
80
55
280
16GB x 8
TSOP, Type B
2,605
2,990
80
55
285
16GB x 8
BGA, Type C
2,765
3,495
80
55
295
16GB x 16
TSOP, Type B
2,535
3,505
80
60
305
32GB x 8
BGA, Type C
2,555
4,220
85
65
305
32GB x 16
TSOP, Type B
2,575
4,880
85
65
295
32GB x 16
BGA, Type C
3,795
5,520
95
75
315
64GB x 16
BGA, Type C
4,255
6,040
105
85
320
120GB
240GB
480GB
960GB
Unit: mW
NOTES:
1.
The average value of power consumption is achieved based on 100% conversion efficiency.
2.
The measured power voltage is 5V.
3.
Samples were built of Toshiba 19nm Toggle MLC NAND flash and measured under ambient temperature.
4.
Sequential R/W is measured while testing 4000MB sequential R/W 5 times by CyrstalDiskMark.
5.
Power Consumption may differ according to flash configuration and platform.
12
5. INTERFACE
5.1. Pin Assignment and Descriptions
Figure 5-1 PS3108 2.5’’ SATA SSD Pin Assignment
Table 5-1 Signal Segment Pin Assignment and Descriptions
Pin Number
Function
S1
GND
S2
A+ (Differential Signal Pair A)
S3
A – (Differential Signal Pair A)
S4
GND
S5
B – (Differential Signal Pair B)
S6
B+ (Differential Signal Pair B)
S7
GND
Table 5-2 Power Segment Pin Assignment and Descriptions
Pin Number
Function
P1
Not Used (3.3V)
P2
Not Used (3.3V)
P3
DEVSLP
P4
GND
P5
GND
P6
GND
P7
5V pre-charge
P8
5V
P9
5V
P10
GND
P11
Reserved
P12
GND
P13
Not Used (12V pre-charge)
P14
Not Used (12V)
P15
Not Used (12V)
13
6. SUPPORTED COMMANDS
6.1. ATA Command List
Table 6-1 ATA Command List
Op Code
Description
Op Code
Description
E5h
Check power mode
F6h
Security Disable Password
06h
Data Set management
F3h
Security Erase Prepare
B1H
DCO
F4h
Security Erase Unit
92h
Download Microcode PIO
F5h
Security Freeze Lock
93h
Download Microcode DMA
F1h
Security Set Password
90h
Execute drive diagnostic
F2h
Security Unlock
E7h
Flush cache
70h
Seek
Eah
Flush cache Ext
Efh
Set features
Ech
Identify device
F9h
Set Max Address
E3h
Idle
37h
Set Max Address Ext
E1h
Idle immediate
C6h
Set multiple mode
91h
Initialize drive parameters
E6h
Sleep
E4h
Read buffer
B0h
Smart
C9h
Read DMA (w/o retry)
E2h
Standby
C8h
Read DMA (w/retry)
E0h
Standby immediate
25h
Read DMA Ext
E8h
Write buffer
60h
Read FPDMA QUEUED
CBh
Write DMA (w/o retry)
2Fh
Read Log Ext
Cah
Write DMA (w/retry)
C4h
Read multiple
35h
Write DMA Ext
29h
Read multiple Ext
3Dh
Write DMA FUA Ext
F8h
Read native max address
61h
Write FPDMA QUEUED
27h
Read native max Ext
3Fh
Write Log Ext
21h
Read sector(s) (w/o retry)
C5h
Write multiple
20h
Read sector(s) (w/retry)
39h
Write multiple Ext
24h
Read sector(s) Ext
Ceh
Write multiple FUA Ext
42h
Read Verify Ext
31h
Write sector(s) (w/o retry)
41h
Read verify sector(s) (w/o retry)
30h
Write sector(s) (w/retry)
40h
Read verify sector(s) (w/retry)
34h
Write sector(s) Ext
10h
Recalibrate
45h
Write uncorrectable
14
6.2. Identify Device Data
The following table details the sector data returned by the IDENTIFY DEVICE command.
Table 6-2 List of Device Identification
F: Fixed
Word
V: Variable
Default Value
Description
X: Both
0
F
0040h
General configuration bit-significant information
1
X
*1
2
V
C837h
Specific configuration
3
X
0010h
Obsolete – Number of logical heads (16)
4-5
X
00000000h
6
X
003Fh
Obsolete – Number of logical sectors per logical track (63)
7-8
V
00000000h
Reserved for assignment by the Compact Flash Association
9
X
0000h
Retired
10-19
F
Varies
Serial number (20 ASCII characters)
20-21
X
0000h
Retired
22
X
0000h
Obsolete
23-26
F
Varies
Firmware revision (8 ASCII characters)
27-46
F
Varies
Model number (xxxxxxxx)
47
F
8010h
7:0- Maximum number of sectors transferred per interrupt on
Obsolete – Number of logical cylinders
Retired
MULTIPLE commands
48
F
0000h
Reserved
49
F
2F00h
Capabilities
50
F
4000h
Capabilities
51-52
X
000000000h
53
F
0007h
54
X
*1
55
X
0010h
Obsolete – Number of logical heads (16)
56
X
003Fh
Obsolete – Number of logical sectors per track (63)
57-58
X
*2
59
F
0110h
Obsolete
Words 88 and 70:64 valid
Obsolete – Number of logical cylinders
Obsolete – Current capacity in sectors
Number of sectors transferred per interrupt on MULTIPLE
commands
60-61
F
*3
Maximum number of sector ( 28bit LBA mode)
62
X
0000h
Obsolete
63
F
0407h
Multi-word DMA modes supported/selected
64
F
0003h
PIO modes supported
65
F
0078h
Minimum Multiword DMA transfer cycle time per word
15
F: Fixed
Word
V: Variable
Default Value
Description
0078h
Manufacturer’s recommended Multiword DMA transfer cycle
X: Both
66
F
time
67
F
0078h
Minimum PIO transfer cycle time without flow control
68
F
0078h
Minimum PIO transfer cycle time with IORDY flow control
69
F
0100h
Additional Supported (support download microcode DMA)
70
F
0000h
Reserved
71-74
F
000000000000000
Reserved for the IDENTIFY PACKET DEVICE command
0h
75
F
001Fh
Queue depth
76
F
C70Eh
Serial SATA capabilities
77
F
0000h
Reserved for future Serial ATA definition
78
F
004Ch
Serial ATA features supported
79
V
0040H
Serial ATA features enabled
80
F
01F8h
Major Version Number
81
F
0000h
Minor Version Number
82
F
346bh
Command set supported
83
F
7D09h
Command set supported
84
F
6063h
Command set/feature supported extension
85
V
3469h
Command set/feature enabled
86
V
bc01h
Command set/feature enabled
87
V
6023h
Command set/feature default
88
V
007Fh
Ultra DMA Modes
89
F
001Eh
Time required for security erase unit completion
90
F
001Eh
Time required for Enhanced security erase completion
91
V
0000h
Current advanced power management value
92
V
FFFEh
Master Password Revision Code
93
F
0000h
Hardware reset result. The contents of the bits (12:0) of this
word can be changed only during the execution of hardware
reset.
94
V
0000h
Vendor’s recommended and actual acoustic management
value
95
F
0000h
Stream Minimum Request Size
96
V
0000h
Streaming Transfer Time – DMA
97
V
0000h
Streaming Access Latency – DMA and PIO
98-99
F
0000h
Streaming Performance Granularity
100-103
V
*4
Maximum user LBA for 48 bit Address feature set
16
F: Fixed
Word
V: Variable
Default Value
Description
X: Both
104
V
0000h
Streaming Transfer Time – PIO
105
F
0000h
Maximum number of 512-byte blocks per DATA SET
MANAGEMENT command
106
F
4000h
Physical sector size/Logical sector size
107
F
0000h
Inter-seek delay for ISO-7779 acoustic testing in microseconds
108-111
F
000000000000000
Unique ID
0h
112-115
F
000000000000000
Reserved
0h
116
V
0000h
Reserved
117-118
F
00000000h
119
F
4015h
Supported settings
120
F
4015h
Command set/Feature Enabled/Supported
121-126
F
0h
Reserved
127
F
0h
Removable Media Status Notification feature set support
128
V
0021h
Security status
129-159
X
0h
Vendor specific
160
F
0h
Compact Flash Association (CFA) power mode 1
161-167
X
0h
Reserved for assignment by the CFA
168
F
3h 2.5 inch
Words per logical Sector
Device Nominal Form Factor
4h 1.8 inch
5h Less than 1.8
inch
169
F
0001h
170-173
F
0h
Additional Product Identifier
0h
Reserve
174-175
DATA SET MANAGEMENT command is supported
176-205
V
0h
Current media serial number
206
F
0h
SCT Command Transport(
207-208
F
0h
Reserved
209
F
4000h
Alignment of logical blocks within a physical block
210-211
V
0000h
Write-Read-Verify Sector Count Mode 3 (not support)
212-213
F
0000h
Write-Read-Verify Sector Count Mode 2 (not support)
0000h
NV Cache relate (not support)
Non-rotating media device
214-216
217
F
0001h
218
F
0h
Reserved
219
F
0h
NV Cache relate (not support)
17
F: Fixed
Word
V: Variable
Default Value
Description
X: Both
220
V
221
0h
Write read verify feature set current mode
0h
Reserved
222
F
103Fh
Transport major version number
223
F
0h
Transport minor version number
224-229
0h
reserved
230-233
0h
Extend number of user addressable sectors
234
0001h
Minimum number of 512-byte data blocks per DOWNLOAD
MICROCODE command for mode 03h
235
00FFh
Maximum number of 512-byte data blocks per DOWNLOAD
MICROCODE command for mode 03h
236-254
F
0h
255
X
XXA5h
Reserved
Integrity word (Checksum and Signature)
XX is variable
Table 6-3 List of Device Identification for Each Capacity
Capacity
*1
*2
*3
*4
(GB)
(Word 1/Word 54)
(Word 57 – 58)
(Word 60 – 61)
(Word 100 – 103)
30
3FFFh
FBFC10h
37E90F0h
37E90F0h
60
3FFFh
FBFC10h
6FCCF30h
6FCCF30h
120
3FFFh
FBFC10h
DF94BB0h
DF94BB0h
240
3FFFh
FBFC10h
FFFFFFFh
1BF244B0h
480
3FFFh
FBFC10h
FFFFFFFh
37E436B0h
960
3FFFh
FBFC10h
FFFFFFFh
6FC81AB0h
18
7. PHYSICAL DIMENSION
Two kinds of housing dimension are supported:
A.

100.00mm (L) x 69.85mm (W) x 7.00mm (H)

100.00mm (L) x 69.85mm (W) x 9.50mm (H)
Dimension: 100.00mm (L) x 69.85mm (W) x 7.00mm (H)
Bottom View
19
Side View
B.
Top View
Dimension: 100.00mm (L) x 69.85mm (W) x 9.50mm (H)
Bottom View
20
Side View
Top View
21
8. REFERENCES
The following table is to list out the standards that have been adopted for designing the product.
Table 8-1 List of References
Title
RoHS
mSATA
Serial ATA Revision 3.1
ATA-8 spec
FCC: CISPR22
CE: EN55022
Acronym/Source
Restriction of Hazardous Substances Directive; for further information,
please contact us at sales@phison.com or support@phison.com.
http://www.jedec.org
http://www.sata-io.org
http://www.t13.org
Federal Communications Commission; for further information, please
contact us at sales@phison.com or support@phison.com.
Consumer electronics certification; for further information, please
contact us at sales@phison.com or support@phison.com.
The Bureau of Standards, Metrology and Inspection; for further
BSMI: 13438
information, please contact us at sales@phison.com or
support@phison.com.
22
9. TERMINOLOGY
The following table is to list out the acronyms that have been applied throughout the document.
Table 9-1 List of Terminology
Term
Definitions
ATTO
Commercial performance benchmark application
DDR
Double data rate (SDRAM)
DIPM
Device initiated power management
HIPM
Host initiated power management
LBA
Logical block addressing
MB
Mega-byte
MTBF
Mean time between failures
NCQ
Native command queue
SATA
Serial advanced technology attachment
S.M.A.R.T.
SSD
Self-monitoring, analysis and reporting technology
Solid state disk
23
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