Philips TDA6106Q User manual

Philips TDA6106Q User manual

INTEGRATED CIRCUITS

DATA SHEET

TDA6106Q

Video output amplifier

Product specification

File under Integrated Circuits, IC02

1997 Mar 03

Philips Semiconductors

Video output amplifier

Product specification

TDA6106Q

FEATURES

No external heatsink required

Black current measurement output for Automatic Black current Stabilization (ABS)

Internal 2.5 V reference circuit

Internal protection against positive appearing CRT flashover discharges

Single supply voltage of 200 V

Simple application with a variety of colour decoders

Controlled switch-off behaviour.

GENERAL DESCRIPTION

The TDA6106Q is a monolithic video output amplifier with a 6 MHz bandwidth and is contained in a 9-lead plastic

DIL-bent-SIL medium power package. The device uses high-voltage DMOS technology and is intended to drive the cathode of a CRT. To obtain maximum performance, the amplifier should be used with black current control.

ORDERING INFORMATION

TYPE NUMBER

TDA6106Q

PACKAGE

NAME DESCRIPTION

DBS9MPF plastic DIL-bent-SIL medium power package with fin; 9 leads

VERSION

SOT111-1

BLOCK DIAGRAM

handbook, full pagewidth n.c.

n.c.

n.c.

1

2

7 supply voltage

6 feedback output

9

MIRROR 1 in out

Vbias

1

×

MIRROR 2 out in

1

×

8 cathode output

TDA6106Q

CURRENT

SOURCE inverting input

3

DIFFERENTIAL

STAGE

+

5 black current measurement output

1997 Mar 03 out out

MIRROR 3 out out in gnd

4 ground

(substrate)

MBG343

Fig.1 Block diagram.

2

Philips Semiconductors

Video output amplifier

Product specification

TDA6106Q

PINNING

SYMBOL PIN

n.c.

n.c.

V in

GND

I om

V

DD n.c.

V oc

V of

7

8

9

5

6

3

4

1

2

DESCRIPTION

not connected not connected inverting input voltage ground, substrate black current measurement output supply voltage not connected cathode output voltage feedback output voltage handbook, halfpage n.c.

1 n.c.

2

Vin

3

GND 4

Iom 5

VDD

6 n.c.

7

TDA6106Q

Voc

Vof

8

9

MBG342

Fig.2 Pin configuration.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134); voltages with respect to pin 4 (ground) unless otherwise specified; currents specified as in Fig.1.

MIN.

I

SYMBOL

V

DD

V in

V om

V oc

V of

I oc(l) oc(h)

P max

T stg

T j

V esd

PARAMETER

supply voltage inverting input voltage black current measurement output voltage cathode DC output voltage feedback output voltage low non-repetitive peak cathode output current high non-repetitive peak cathode output current maximum power dissipation storage temperature junction temperature electrostatic discharge

CONDITIONS

flashover discharge = 100

µ

C; note 1 flashover discharge = 100 nC; note 2 note 3 note 4

0

0

0

0

0

0

0

0

55

20

MAX.

UNIT

250

8

6

V

DD

V

DD

5

V

V

V

V

V

A

10 tbf

+150

+150

A

W

2000 +2000 V

300 +300 V

°

C

°

C

Notes

1. The cathode output is protected against peak currents (caused by positive voltage peaks during high-resistance flash) of 5 A maximum with a charge content of 100

µ

C.

2. The cathode output is also protected against peak currents (caused by positive voltage peaks during low-resistance flash) of 10 A maximum with a charge content of 100 nC.

3. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k

resistor.

4. Machine model: equivalent to discharging a 200 pF capacitor through a 0

resistor.

1997 Mar 03 3

Philips Semiconductors

Video output amplifier

Product specification

TDA6106Q

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices” ).

QUALITY SPECIFICATION

Quality specification “SNW-FQ-611 part E” is applicable, except for ESD Human body model see Chapter “Limiting values”, and can be found in the

“Quality reference handbook” (ordering number 9397 750 00192).

THERMAL CHARACTERISTICS

SYMBOL

R th j-a

R th j-c

PARAMETER

(1) thermal resistance from junction to ambient in free air thermal resistance from junction to case

Note

1. External heatsink not required.

VALUE

56

12

UNIT

K/W

K/W

CHARACTERISTICS

Operating range: T amb

Test conditions: T amb

=

20 to +65

°

C; V

DD

= 25

°

C; V

DD

= 180 to 210 V (see note 1), V

= 200 V; V om

= 4 V; C

L

= 10 pF (C

L om

= 1.4 to 6 V.

consists of parasitic and cathode capacitance); measured in test circuit of Fig.5; unless otherwise specified.

I

SYMBOL

I

DD

I bias

V int

I om(os)

∆ of(max)

V

V

V

I

I oc(min) oc(max)

GB

Tint oc

BW

BW

S

L

PARAMETER

quiescent voltage supply current input bias current (pin 3)

V ocDC

= 100 V

V ocDC

= 100 V internal reference voltage input stage V ocDC offset current of black current I oc

= 100 V

= 0

µ

A; measurement output V in

= 1.5 to +3.5 V;

V om

= 1.4 to 6 V temperature drift of internal reference voltage input stage

V ocDC

= 100 V linearity of current transfer maximum peak output current (pin 9)

I oc

=

10

µ

A to 3 mA;

V in

V om

= 1.5 to +3.5 V;

= 1.4 to 6 V

V oc

= 20 V to V

DD

30 V minimum output voltage (pin 8) maximum output voltage (pin 8)

V in

= 3.5 V

V in

= 1.5 V gain bandwidth product of open-loop gain V os

/V i, dm small signal bandwidth large signal bandwidth f = 500 kHz;

V ocDC

CONDITIONS

= 100 V

V ocAC

V ocDC

= 60 V (p-p);

= 100 V

V ocAC

V ocDC

= 100 V (p-p);

= 100 V

2.8

0

10

0.9

5

4.7

MIN.

3.0

2.5

0

0.5

1.0

25

7

6

5.7

TYP.

3.3

20

+10

MAX.

UNIT

mA

µ

A

V

µ

A

1.1

12

V

DD

14 V

DD

0.52

10

− mV/K mA

V

V

GHz

MHz

MHz

1997 Mar 03 4

Philips Semiconductors

Video output amplifier

Product specification

TDA6106Q t t t t

SYMBOL

f pd r s

SR

O

V

10% output

PARAMETER

cathode output propagation delay time 50% input to 50% output cathode output rise time 10% output to 90% output cathode output fall time 90% output to settling time 50% input to

(99% < output < 101%) slew rate between 50 and 150 V cathode output voltage overshoot

CONDITIONS

V oc

= 50 to 150 V square wave; f < 1 MHz; t rin

= t fin

= 40 ns; see Figs 3 and 4

V oc

= 50 to 150 V square wave; f < 1 MHz; t fin

= 40 ns; see Fig.4

V oc

= 150 to 50 V square wave; f < 1 MHz; t rin

= 40 ns; see Fig.4

V oc

= 50 to 150 V square wave; f < 1 MHz; t rin

= t fin

= 40 ns; see Figs 3 and 4 t

V in

= 2 V (p-p) square wave; f < 1 MHz; rin

= t fin

= 40 ns

V oc

= 50 to 150 V square wave; f < 1 MHz; t rin

= t fin

= 40 ns; see Figs 3 and 4 f < 50 kHz; note 2

38

62

62

MIN.

49

74

74

1

TYP.

1200

MAX.

60

87

87

350

UNIT

ns ns ns ns

V/

%

µ s

PSRR power supply rejection ratio

60

− dB

Notes

1. The rating of supply voltage is 250 V, but because of flash the maximum operating range for supply voltage is 210 V.

2. PSSR: The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.

1997 Mar 03 5

Philips Semiconductors

Video output amplifier

Vi x

0 t x t s overshoot (in %)

Voc

150

140

100

151

149

60

50 t r t

MGA974 t pd

Fig.3 Output voltage (pin 8 rising edge) as a function of AC input signal.

Product specification

TDA6106Q

1997 Mar 03 6

Philips Semiconductors

Video output amplifier

Product specification

TDA6106Q

Vi x

0 t x t s

150

Voc

140

100

60

50 overshoot (in %) t pd t f

51

49 t

MGA975

Fig.4 Output voltage (pin 8 falling edge) as a function of AC input signal.

Flashover protection

The TDA6106Q incorporates a protection diode against

CRT flashover discharges that clamp the cathode output voltage to a maximum of V

DD

+ V diode

. To limit the diode current, an external 1.5 k

Ω carbon high-voltage resistor in series with the cathode output and a 2 kV spark gap are needed (for this resistor-value, the CRT has to be connected to the main PCB). This addition produces an increase in the rise and fall times of approximately 7.5 ns and a decrease in the overshoot of approximately 1.3%.

V

DD

to GND must be decoupled:

1. With a capacitor larger than 20 nF with good HF behaviour (e.g. foil). This capacitor must be placed as close as possible to pins 6 and 4, but definitely within

5 mm.

2. With a capacitor larger than10

µ

F on the picture tube base print (shared by three output stages).

Switch-off behaviour

The output pins of the TDA6106Q are still under the control of the input pin for a supply voltage down to approximately

30 V.

1997 Mar 03 7

Philips Semiconductors

Video output amplifier

Product specification

TDA6106Q

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

Vin

GND

R1

50

C1

22 nF

C2

22

µ

F

R9

866

0.98 mA

Cpar

Rfb

R10 100 k

200 V

C6

100 nF

Cn

560 pF

6 9

3

TDA6106Q

8

4 5

A

Vom

4 V

C8

6.8 pF

C7

3.2 pF

C9

136 pF

R3

20 M

Ω probe

R2

1 M

MBG344

C par

= 150 fF.

Fig.5 Test circuit with feedback factor

1

116

.

Dissipation

With respect to dissipation, distinction must be made between static dissipation (independent of frequency) and dynamic dissipation (proportional to frequency).

The static dissipation of the TDA6106Q is due to supply currents and load currents in the feedback network and

CRT.

P stat

= V

DD

×

I

DD

+ V oc

×

I oc

– V of

×

V

--------

R fb

Where:

R fb

= value of feedback resistor.

I oc

= DC value of cathode current.

The dynamic dissipation equals:

P dyn

=

V

DD

× (

C

L

+

C fb

+

C int

) × f

×

V

Where:

(

– p

)

× b

C

L

= load capacitance.

C fb

= feedback capacitance.

C int

= internal load capacitance (

4 pF).

f = input frequency.

V o(p-p)

= output voltage (peak-to-peak value).

b = non-blanking duty-cycle.

The IC must be mounted on the picture tube base print to minimize the load capacitance (C

L

).

1997 Mar 03 8

Philips Semiconductors

Video output amplifier

INTERNAL PIN CONFIGURATION

handbook, full pagewidth

GND

4

VDD

6

Vin

3 esd

TDA6106Q

from input circuit esd from reference circuit from input circuit

Vbias esd esd

9

Vof

Product specification

TDA6106Q

Iom

5 esd esd flash prot.

flash prot.

from pin 9 from reference circuit

6.8 V from pin 9 to BCS-circuit output

8

Voc

MBG345

1997 Mar 03

Fig.6 Internal pin configuration.

9

Philips Semiconductors

Video output amplifier

PACKAGE OUTLINE

DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads

D

Product specification

TDA6106Q

SOT111-1

P

D

1 q

P

1

Q

A

2 q

1 q

2

A

3

A

A

4

E pin 1 index

Z

1 b

2 e

9 b b

1 w

M

L c e

2

θ

0 5 scale

10 mm

DIMENSIONS (mm are the original dimensions)

UNIT A

A

2 max.

A

3

A

4 b b

1 b

2

mm

18.5

17.8

3.7

8.7

8.0

15.5

15.1

1.40

1.14

0.67

0.50

1.40

1.14

c

0.48

0.38

D

(1)

D

1

E

(1) e e

2

21.8

21.4

21.4

20.7

6.48

6.20

2.54

2.54

L

3.9

3.4

P P

1

2.75

2.50

3.4

3.2

Q q q

1

1.75

1.55

15.1

14.9

4.4

4.2

q

2

5.9

5.7

w

0.25

Z

(1) max.

1.0

θ

65 o

55 o

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

SOT111-1

IEC

REFERENCES

JEDEC EIAJ

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17

95-03-11

1997 Mar 03 10

Philips Semiconductors

Video output amplifier

Product specification

TDA6106Q

SOLDERING

Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011).

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T stg max

). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300

°

C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400

°

C, contact may be up to 5 seconds.

Soldering by dipping or by wave

The maximum permissible temperature of the solder is

260

°

C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed

5 seconds.

DEFINITIONS

Data sheet status

Objective specification

Preliminary specification

Product specification

This data sheet contains target or goal specifications for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

1997 Mar 03 11

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Internet: http://www.semiconductors.philips.com

© Philips Electronics N.V. 1997 SCA53

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

547047/1200/01/pp12 Date of release: 1997 Mar 03 Document order number: 9397 750 01869

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