LG KS 10 mobile phone Service Manual

Below you will find brief information for mobile phone KS10. The KS10 is a dual-mode mobile phone supporting both UMTS-2100 DS-WCDMA and GSM (EGSM-900, DCS-1800, and PCS-1900). It features a slide design with a 240 x 320 pixel TFT LCD, a 1.3MP camera, and Bluetooth connectivity. The KS10 also has a microSD card slot for expandable storage and a built-in microphone and speaker.

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Date: July, 2007 / Issue 1.0

Service Manual

KS10

Internal Use Only

1. INTRODUCTION.................................. 5

1.1 Purpose ...................................................... 5

1.2 Regulatory Information ............................... 5

2. PERFORMANCE ..................................7

2.1 System Overview.........................................7

2.2 Usable environment.....................................8

2.3 Radio Performance......................................8

2.4 Current Consumption.................................14

2.5 RSSI BAR ..................................................14

2.6 Battery BAR ...............................................15

2.7 Sound Pressure Level ...............................16

2.8 Charging ....................................................16

4. TROUBLE SHOOTING.......................83

4.1 RF Component ..........................................83

4.2 SIGNAL PATH ...........................................85

4.3 Checking VCXO Block...............................87

4.4 Checking Ant. Switch Module Block ..........91

4.5 Checking WCDMA Block ...........................93

4.6 Checking GSM Block...............................103

4.7 Power on trouble......................................111

4.8 USB trouble .............................................114

4.9 SIM detect trouble....................................115

4.10 Key sense trouble ..................................116

4.11 Keypad backlight trouble .......................118

4.12 Folder on/off trouble...............................120

4.13 Micro SD trouble ....................................122

4.14 Charging trouble ....................................124

4.15 Audio trouble..........................................127

4.16 Camera trouble ......................................143

4.17 Main LCD trouble...................................149

4.18 Bluetooth trouble....................................152

3. TECHNICAL BRIEF............................17

3.1 General Description ...................................17

3.2 GSM Mode.................................................19

3.3 UMTS Mode...............................................23

3.4 LO Phase-locked Loop ..............................26

3.5 Off-chip RF Components ...........................29

3.6 Digital Baseband

(Stn8810 / MSM6275)................................34

3.7. Hardware Architecture ..............................36

3.8. Subsystem of STn8810 ............................39

3.9. Hardware Peripheral system of

Stn8810 ....................................................42

3.10. Subsystem of MSM6275.........................47

3.11. External memory interface......................50

3.12. Hardware sub system of MSM6275........51

3.13. Audio and sound.....................................61

3.14. Camera interface ....................................67

3.15 Bluetooth..................................................76

3.16 Main Features..........................................77

5. DOWNLOAD.....................................155

5.1 Composition omposition ..........................155

5.2 LGDP2 Program install LGDP2 Program install........................................................156

5.3 USB Driver setup USB Driver setup ........159

5.4 KS10 LGDP2 run file & DLL file setup .....162

5.5 Execute LGDP2 program.........................163

6. BLOCK DIAGRAM ...........................178

6.1 GSM & WCDMA RF Block.......................178

6.2 Interface Diagram ....................................180

6.3 KS10 Modem & Baseband

Block Diagram .........................................184

6.4 KS10 Application Processor Block

Diagram ...................................................185

6.5 KS10 Audio & BT Block Diagram ............186

Only for training and service purposes

- 3 -

LGE Internal Use Only

6.6 KS10 Camera Block Diagram .................187

6.7 KS10 LCD Block Diagram ......................188

6.8 KS10 Power Distribution Diagram ...........189

6.9 KS10 Clock Distribution Diagram ...........190

7. Circuit Diagram................................177

8. PCB LAYOUT ...................................202

9. Usage of Hot-Kimchi .......................209

9.1 Usage of Hot-Kimchi................................195

10. Engineering Mode .........................212

10.1 Version Info............................................213

10.2 Device Test............................................213

10.3 Factory Reset ........................................214

10.4 MTC .......................................................214

10.5 Save Log................................................214

11. EXPLODED VIEW & REPLACEMENT

PART LIST ..................................... 216

10.1 EXPLODED VIEW ................................ 216

10.2 Replacement Parts

<Mechanic component> ....................... 219

<Main component> ............................... 222

10.3 Accessory ............................................. 246

LGE Internal Use Only

- 4 -

Only for training and service purposes

1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system.

There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

Only for training and service purposes

- 5 -

LGE Internal Use Only

1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.

Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

LGE Internal Use Only

- 6 -

Only for training and service purposes

2. PERFORMANCE

2.1 System Overview

Item

Shape

Size

Weight

Power

Talk Time

(with 950mAh)

Standby Time

Specification

GSM900/1800/1900 and WCDMA Slide Handset

104 X 52 X 18.9 mm

118 g (with 950mAh Battery)

3.7V normal, 950 mAh Li-Polymer

Over 150 min (WCDMA, Tx=12 dBm, Voice)

Over 175 min (GSM, Tx=Max, Voice)

Over 200 Hrs (WCDMA, DRX=1.28)

(with 950mAh)

Antenna

LCD

LCD Backlight

Camera

Vibrator

LED Indicator

MIC

Receiver Yes

Earphone Jack Yes

Over 220 Hrs (GSM, Paging period=9)

Internal type and Antenna

Main 240 X 320 pixel TFT (QVGA LCD Module)

Blue LED Back Light (main only)

Dual Camera ; 1.3 Mega pixel (CMOS), VGA Camera (CMOS)

Yes (Cylinder Type)

Yes

Volume Key

External Memory

I/O Connect

Push Type(+, -)

Micro-SD

18 Pin

Only for training and service purposes

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LGE Internal Use Only

2. PERFORMANCE

2.2 Usable environment

1) Environment

Item

Voltage

Operation Temp

Storage Temp

Humidity

Specification

3.7 V(Typ), [Shut Down : 3.22 V]

-20 ~ +60

°C

-20 ~ +70

°C

85 % (Max)

2) Environment (Accessory)

Reference

TA Power

* CLA : 12 ~ 24 V(DC)

Spec.

Available power

Min

100

Typ.

220

Max

240

Unit

Vac

2.3 Radio Performance

1) Transmitter - GSM Mode

No Item

MS allocated

Channel

100k~1GHz

1G~12.75GHz

Conducted

Spurious

Emission

Idle Mode

100k~880MHz

880M~915MHz

915M~1GHz

1G~[A]MHz

[A]M~[B]MHz

[B]M~12.5GHz

* In case of DCS : [A] -> 1710, [B] -> 1785

LGE Internal Use Only

- 8 -

GSM DCS & PCS

9k ~ 1GHz -39dBm

-39dBm

1G~[A]MHz

[A]M~[B]MHz

-33dBm

[B]M~12.75GHz

-60dBm 100k~880MHz

-33dBm

-39dBm

-33dBm

-60dBm

-62dBm 880M~915MHz

-60dBm 915M~1GHz

-62dBm

-60dBm

-50dBm 1G~[A]MHz

-56dBm [A]M~[B]MHz

-50dBm

-56dBm

-50dBm [B]M~12.5GHz

-50dBm

* In case of PCS : [A] -> 1850, [B] -> 1910

Only for training and service purposes

2. PERFORMANCE

Radiated

Spurious

Emission

Item

MS allocated

Channel

Idle Mode

Frequency Error

Phase Error

Frequency Error

Under Multipath and

Interference Condition

30M ~ 1GHz

1G ~ 4GHz

915M~1GHz

1G~[A]MHz

[A]M~[B]MHz

[B]M~4GHz

±0.1ppm

±5(RMS)

±20(PEAK)

GSM

30M ~ 880MHz

880M ~ 915MHz

DCS & PCS

30M~1GHz -36dBm

-36dBm

1G~[A]MHz

[A]M~[B]MHz

-30dBm

[B]M~4GHz

-57dBm 30M~880MHz

-30dBm

-36dBm

-30dBm

-57dBm

-59dBm 880M~915MHz

-57dBm

-47dBm 1G~[A]MHz

-53dBm

915M~1GHz

[A]M~[B]MHz

-47dBm [B]M~4GHz

±0.1ppm

±5(RMS)

±20(PEAK)

-59dBm

-57dBm

-47dBm

-53dBm

-47dBm

3dB below reference sensitivity 3dB below reference sensitivity

RA250 : ±200Hz

HT100 : ±100Hz

RA250: ±250Hz

HT100: ±250Hz

TU50 : ±100Hz

TU3 : ±150Hz

0 ~ 100kHz

200kHz

+0.5dB

-30dB

TU50: ±150Hz

TU1.5: ±200Hz

0 ~ 100kHz

200kHz

Output RF

Spectrum

Due to

250kHz

400kHz modulation 600 ~ 1800kHz

Due to

Switching transient

* In case of DCS : [A] -> 1710, [B] -> 1785

-33dB

-60dB

250kHz

400kHz

1800 ~ 3000kHz

3000 ~ 6000kHz

≥6000kHz

400kHz

600kHz

1200kHz

-60dB 600 ~ 1800kHz

-63dB 1800 ~ 6000kHz

-65dB ≥6000kHz

-71dB

-19dB 400kHz

-21dB 600kHz

-21dB 1200kHz

1800kHz -24dB 1800kHz

* In case of PCS : [A] -> 1850, [B] -> 1910

+0.5dB

-30dB

-33dB

-60dB

-65dB

-73dB

-22dB

-24dB

-27dB

Only for training and service purposes

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LGE Internal Use Only

2. PERFORMANCE

Item

Intermodulation attenuation

Transmitter Output Power

Burst timing

GSM

–

DCS & PCS

Frequency offset 800kHz

Intermodulation product should be Less than 55dB below the level of Wanted signal

Power control Power Tolerance Power control Power Tolerance

Level

(dBm)

(dB)

±3

Level

(dBm)

(dB)

±3

Mask IN

±3

±5

Mask IN

±4

±5

±4

LGE Internal Use Only

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Only for training and service purposes

2. PERFORMANCE

2) Transmitter - WCDMA Mode

Maximum Output Power

Frequency Error

Item

Open Loop Power control in uplink

Specification

Class 3 : +24dBm(+1/-3dB)

Class 4 : +21dBm(±2dB)

±0.1ppm

±9dB@normal, ±12dB@extreme

Adjust output(TPC command) cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4.5

4 Inner Loop Power control in uplink 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4.5

Group (10 equel command group)

+1 +8/+12 +16/+24

5 Minimum Output Power -50dBm(3.84MHz)

Qin/Qout : PCCH quality levels

6 Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB

Ton@DPCCH/Ior : -24 -> -18dB

7 Transmit OFF Power -56dBm(3.84MHz)

±25us

8 Transmit ON/OFF Time Mask

PRACH,CPCH,uplinlk compressed mode

±25us

Change of TFC

Power setting in uplink compressed

Occupied Bandwidth(OBW)

Spectrum emission Mask

Power varies according to the data rate

DTX : DPCH off

(minimize interference between UE)

±3dB(after 14slots transmission gap)

5MHz(99%)

-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k

-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M

-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M

-49dBc@∆f=8.5~12.5MHz,1M

Only for training and service purposes

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LGE Internal Use Only

2. PERFORMANCE

No Item

13 Adjacent Channel Leakage Ratio(ACLR)

Spurious Emissions

(*: additional requirement)

15 Transmit Intermodulation

16 Error Vector Magnitude (EVM)

17 Transmit OFF Power

Specification

33dB@5MHz, ACP>-50dBm

43dB@10MHz, ACP>-50dBm

-36dBm@f=9~150KHz, 1K BW

-36dBm@f=50KHz~30MHz, 10K BW

-36dBm@f=30MHz~1000MHz, 100K BW

-30dBm@f=1~12.5GHz, 1M BW

(*)-41dBm@f=1893.5~1919.6MHz, 300K

(*)-67dBm@f=925~935MHz, 100K BW

(*)-79dBm@f=935~960MHz, 100K BW

(*)-71dBm@f=1805~1880MHz, 100K BW

-31dBc@5MHz,Interferer -40dBc

-41dBc@10MHz, Interferer -40dBc

17.5%(>-20dBm)

(@12.2K, 1DPDCH+1DPCCH)

-15dB@SF=4.768Kbps, Multi-code transmission

3)Receiver - GSM Mode

Item

Sensitivity (TCH/FS Class II)

Co-Channel Rejection

(TCH/FS Class II, RBER, TU high/FH)

3 Adjacent Channel

Rejection

200kHz

400kHz

Intermodulation Rejection

Blocking Response

(TCH/FS Class II, RBER)

GSM

-105dBm

C/Ic=7dB

DCS & PCS

-105dBm

Storage -30 ~ +85

C/Ia1=-12dB

C/Ia2=-44dB

Wanted Signal :-98dBm

1st interferer:-44dBm

C/Ia1=-12dB

C/Ia2=-44dB

Wanted Signal :-96dBm

1st interferer:-44dBm

2nd interferer:-45dBm

Wanted Signal :-101dBm

2nd interferer:-44dBm

Wanted Signal :-101dBm

Unwanted : Depend on Frequency Unwanted : Depend on Frequency

LGE Internal Use Only

- 12 -

Only for training and service purposes

2. PERFORMANCE

4) Receiver - WCDMA Mode

No Item

1 Reference Sensitivity Level

2 Maximum Input Level

3 Adjacent Channel Selectivity (ACS)

In-band Blocking

Out-band Blocking

Spurious Response

Intermodulation Characteristic

Spurious Emissions

Only for training and service purposes

- 13 -

Specification

-106.7 dBm(3.84 MHz)

-25dBm(3.84MHz)

-44dBm/3.84MHz(DPCH_Ec)

UE@+20dBm output power(Class3)

33dB

UE@+20dBm output power(Class3)

-56dBm/3.84MHz@10MHz

UE@+20dBm output power(Class3)

-44dBm/3.84MHz@15MHz

UE@+20dBm output power(Class3)

-44dBm/3.84MHz@f=2050~2095 and

2185~2230MHz

UE@+20dBm output power(Class3)

-30dBm/3.84MHz@f=2025~2050 and

2230~2255MHz

UE@+20dBm output power(Class3)

-15dBm/3.84MHz@f=1~2025 and

2255~12500MHz

UE@+20dBm output power(Class3)

-44dBm CW

UE@+20dBm output power(Class3)

-46dBm CW@10MHz

-46dBm/3.84MHz@20MHz

UE@+20dBm output power(Class3)

-57dBm@f=9KHz~1GHz, 100K BW

-47dBm@f=1~12.5GHz, 1M BW

-60dBm@f=1920MHz~1980MHz, 3.84M BW

-60dBm@f=2110MHz~2170MHz, 3.84M BW

LGE Internal Use Only

2. PERFORMANCE

2.4 Current Consumption

WCDMA

GSM

Stand by

Under 4.32 mA

(DRX=1.28)

Under 4.32 mA

(Paging=5period)

Voice Call

Under 335 mA

(Tx=10dBm -Low power)

Under 380 mA

(Tx=Max power)

(Stand by Test Condition : Bluetooth off, LCD backlight off)

(Call Test Condition : Bluetooth off, LCD backlight dimming mode)

(VT Test Condition : Speaker off, LCD backlight On)

2.5 RSSI BAR

Level Change

BAR 7

→ 6

BAR 6

→ 5

BAR 5

→ 4

BAR 4

→ 3

BAR 3

→ 2

BAR 2

→ 1

BAR 1

→ 0

WCDMA

-86

± 2 dBm

-90

± 2 dBm

-94

± 2 dBm

-98

± 2 dBm

-102

± 2 dBm

-106

± 2 dBm

-110

± 2 dBm

Under 569mA

(Tx=10dBm -Low power)

GSM

-82

± 2dBm

-86

± 2dBm

-90

± 2dBm

-94

± 2dBm

-98

± 2dBm

-102

± 2dBm

-106

± 2dBm

LGE Internal Use Only

- 14 -

Only for training and service purposes

2. PERFORMANCE

2.6 Battery BAR

Indication

Bar 7

→ 6

Bar 6

→ 5

Bar 5

→ 4

Bar 4

→ 3

Bar 3

→ 2

Bar 2

→ 1

Bar 1

→ Empty

Low Voltage,

Warning message + tone

Power Off

Standby

3.96 ± 0.05V

3.95 ± 0.05V

3.86 ± 0.05V

3.78 ± 0.05V

3.74 ± 0.05V

3.69 ± 0.05V

3.63 ± 0.05V

3.50 ± 0.05V

3.63,3.50 ± 0.05V (Stand-by) / 3.63, 3.50 ± 0.05V (Talk)

Bar 2

→ 1 / Bar 1 → Empty

3.20 ± 0.05V

Only for training and service purposes

- 15 -

LGE Internal Use Only

2. PERFORMANCE

2.7 Sound Pressure Level

Test Item

Sending Loudness Rating (SLR)

Receiving Loudness Rating (RLR)

Side Tone Masking Rating (STMR)

Echo Loss (EL)

Sending Distortion (SD)

Receiving Distortion (RD)

Idle Noise-Sending (INS)

Idle Noise-Receiving (INR)

Sending Loudness Rating (SLR)

Receiving Loudness Rating (RLR)

Side Tone Masking Rating (STMR)

Echo Loss (EL)

Sending Distortion (SD)

Receiving Distortion (RD)

Idle Noise-Sending (INS)

Idle Noise-Receiving (INR)

TDMA Noise

-. GSM : Power Level : 5

DCS/PCS : Power Level : 0

(Cell Power : -90 ~ -105 dBm)

-. Acoustic (Max Vol.)

MS/Headset SLR : 8 ± 3dB

MS/Headset RLR : -15 ± 3dB/-12dB

(SLR/RLR : Mid-value setting)

2.8 Charging

- Charging Method : CC & CV (Constant Current & Constant Voltage)

- Maximum Charging Voltage : 4.2V

- Maximum Charging Current : 650mA

- Nominal Battery Capacity : 950 mAh

- Charger Voltage : 4.8V

- Charging time : Max 3 h (Except time trickle charging)

- Full charge indication current (icon stop current) : 60mA

- Low battery POP UP : 3.48V

- Low battery alarm interval : Idle - 3 min, Dedicated - 1min

- Cut-off voltage : 3.22V

Headset

Nor

Max

Min

Max

Nor

Max

Nor

Max

Min

Max

Nor

Max

Specification

8 ±3 dB

-4 ± 3 dB

-15 ± 3 dB

17 dB

40 dB

Refer to Table 30.3

Refer to Table 30.4

-64 dBm0p

Under -47 dBPA

Under -36 dBPA

8±3dB

-1 ±3 dB

-12 ±3 dB

25 dB

40 dB

Refer to Table 30.3

Refer to Table 30.4

-55 dBm0p

Under -45 dBPA

Under -40 dBPA

MS and

Headset

Max

Under -62 dBm

LGE Internal Use Only

- 16 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.1 General Description

The KS10 supports UMTS-2100 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900. All receivers and the UMTS transmitter use the radio One 1 Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The EGSM, DCS1800 and

PCS1900 transmitters use a baseband-to-IF up-conversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.

KS10 high-level RF functional block diagram

1 QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.

Only for training and service purposes

- 17 -

LGE Internal Use Only

3. TECHNICAL BRIEF

A generic, high-level functional block diagram of KS10 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a switch module (plus a duplexer for UMTS-2100 operation).

UMTS band signals at the antenna are switched to the relevant UMTS duplexer. The UMTS receive band signals are amplified by the front-end LNAs of the RFR6250 IC before passing through a bandpass filter and being applied to the mixer inputs of the RFR6250 IC. On-chip circuits down-convert the received signal directly from RF to baseband using radioOne Zero-IF techniques. Generation and distribution of the UMTS LO, for the down-converter, is performed entirely on-chip (except for the loop filter). The RFR6250 IC outputs analog baseband signals for processing by the MSM device. This baseband interface is shared with the RTR6250 GSM receiver outputs, but is separate from the GPS baseband interface.

EGSM, DCS and PCS receive signals from the antenna switch module pass through their band-pass filters, then are applied to the RTR6250 IC. In a similar fashion to the UMTS paths, RTR6250 IC circuits down-convert the received signals directly from RF to baseband. The GSM LO for multiband down conversion is entirely generated within the RTR6250 IC (PLL and distribution functions) with exception of the off-chip loop filter. The RTR analog baseband outputs are routed to the MSM6275 IC for further processing (an interface shared with the RFR UMTS receive paths).

The UMTS transmit path begins with analog baseband signals from the MSM device that drive the

RTR6250 IC. Integrated PLL and VCO circuits generate the Tx LO used in the quadrature upconverter that translates baseband signals directly to RF. The RTR6250 output driver stages deliver fairly highlevel signals that are filtered and applied to the power amplifiers (PA). The PA output is routed to the antenna through a duplexer and switch module.

The shared EGSM-900, DCS-1800, and PCS-1900 transmit path begins with the same baseband interface from the MSM6275 IC that is used for the UMTS band. A single EGSM/DCS/PCS quadrature upconverter translates the GMSK-modulated signal to a convenient intermediate frequency (IF) that forms one input to an offset phase-locked loop (OPLL). OPLL functions are split between the

RTR6250 IC and off-chip loop filter and dual Tx VCO circuits, and translate the GMSK-modulated signal to the desired EGSM-900, DCS-1800 or PCS-1900 channel frequency. This signal is applied to a dual power amplifier (only one is active at a time). The enabled path continues with the PA, an automated power control (APC) circuit that samples the transmit power and adjusts its level, the switch module (which includes a band-appropriate lowpass filter), and the antenna.

KS10 power supply voltages are managed and regulated by the PM6250 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as userdefined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.

LGE Internal Use Only

- 18 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.2 GSM Mode

3.2.1 GSM Receiver

The Dual-mode KS10’s receiver functions are split between the two RFICs as follows:

• UMTS-2100 operation uses the RFR6250 Receiver ICs to implement the receive signal path, accepting an RF input and delivering analog baseband outputs (I and Q).

• EGSM-900, DCS-1800, and PCS-1900 modes both use the RTR6250 IC only. Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SBI 2 -controlled parameters.

The EGSM, DCS, and PCS receiver inputs of RTR6250 are connected directly to the transceiver frontend circuits(filters and antenna switch module). EGSM, DCS, and PCS receiver inputs are similar to the RFR6250 UMTS Rx input in that they also use differential configurations to improve commonmode rejection and second-order non-linearity performance.

The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins Since EGSM, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers - this is accomplished in the switch module.

The EGSM, DCS, and PCS receive signals are routed to the RTR6250 through band selection filters and matching networks that transform single-ended 50-Ω sources to differential impedances optimized for gain and noise figure. Similar to the RFR, the RTR input uses a differential configuration to improve second-order inter-modulation and common mode rejection performance. The RTR6250 input stages include MSM-controlled gain adjustments that maximize receiver dynamic range.

The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters.

The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM6275 IC for further processing (an interface shared with the RFR6250 UMTS receiver outputs).

2 The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application

Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS

Software documentation for details.

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3.2.2 GSM Transmitter

The shared GSM Low-band (EGSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6275 IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250. This upconverter translates the GMSK-modulated signal to a convenient intermediate frequency (IF) that forms one input to a frequency/phase detector circuit. This

IF signal is the reference input to an offset phase-locked loop (OPLL) circuit as shown in Figure 1.2.2-1.

Figure 1.2.2-1 Offset phase-locked loop interfaces

The feedback path of this OPLL circuit includes a downconversion from the RF output frequency range to the IF range. The two inputs to this downconversion mixer are formed as follows:

1. The dual Tx VCO output (operating in the desired RF output frequency range) is buffered within the

RTR6250 IC then applied to the mixer RF port.

2. The LO Generation and Distribution circuits that deliver the transmit path.s LO for the baseband-to-IF upconversion also provides the offset LO signal that is applied to the feedback path.s mixer LO port.

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The mixer IF port output is the offset feedback signal - the variable input to the frequency/phase detector circuit. The detector compares its variable input to its reference input and generates an error signal that is lowpass filtered by the loop filter and applied to the dual Tx VCO tuning port to force the

VCO output in the direction that minimizes errors. As mentioned earlier, the VCO output is connected to the feedback path thereby creating a closed-loop control system that will force frequency and phase errors between the variable and reference inputs to zero.

The waveform at the dual Tx VCO output is the GMSK-modulated signal centered at the desired GSM channel frequency. A phase-locked loop circuit is used to translate the GMSKmodulated signal from IF to RF primarily for two reasons:

1. Phase-locked loops provide a lowpass filter function from the reference input to the VCO output.

These results in a bandpass function centered at the desired channel frequency that provides steep, well-controlled rejection of the out-of-band spectrum.

2. The resulting output bandpass function is virtually unchanged as the transmitter is tuned over channels spanning the GSM operating band.

The PA is a key component in any transmitter chain and must complement the rest of the transmitter precisely. For GSM band operation, the closed-loop transmit power control functions add even more requirements relative to the UMTS PA. In addition to gain control and switching requirements, the usual

RF parameters such as gain, output power level, several output spectrum requirements, and power supply current are critical. The gain must be sufficient and variable to deliver the desired transmitter output power given the VCO output level, the subsequent passive devices’ losses, and the control set point. The maximum and minimum transmitter output power levels depend upon the operating band class and mobile station class per the applicable standard. Transmitter timing requirements and in-band and out-of-band emissions, all dominated by the PA, are also specified by the applicable standard.

The active dual Tx VCO output is applied to the dual power amplifier to continue the transmit path, and feedback to the RTR6250 IC to complete the frequency control loop. The PA operating band (EGSM or

DCS/PCS) is selected by the MSM device GPIO control. (GSM_PA_BAND).

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3.3 WCDMA Mode

3.3.1 Receiver

The UMTS duplexer receiver output is routed to LNA circuits within the RFR6250 IC. The LNA gain is dynamically controlled by the MSM6275 IC to cover full receiver dynamic range and to save current consumption.

The UMTS LNA output is routed to the down conversion mixer inputs, in the RFR6250 IC, through a band selection filter that transforms a single-ended 50-Ω source to differential 100-Ω load impedance that is matched to the RFR6250 IC. The RFR input uses a differential configuration to improve secondorder inter-modulation and common mode rejection performance. The RFR6250 IC input stages include

MSM-controlled gain adjustments that further extend receiver dynamic range.

The amplifier output drives the RF port of the quadrature RF-to-baseband down-converter. The downconverted baseband outputs are routed to low-pass filters (one I and one Q) having pass-band and stop-band characteristics suitable for DS-WCDMA processing. The filter outputs are buffered and passed on to the MSM6275 IC for further processing. This baseband interface is shared with the

RTR6250 GSM receiver outputs.

The RFR6250 IC includes LO generation and distribution circuitry to reduce off-chip component requirements. The GPS RX LO source is created using the PLL control elements of the RTR6250

PLL2, via a discrete loop filter components, in tandem with the VCO in the RFR6250. Using only this

PLL signal, the RFR6250 LO generation and distribution circuits create the necessary LO signals for the UMTS quadrature down-converter. By definition, the ZIF down-converter requires F

LO equal to F

, and the RTR6250/RFR6250 design achieves this without allowing F

VCO to equal F

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Figure 1.3.1-1 RFR6250 IC functional block diagram

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3.3.2 Transmitter

The UMTS transmit path begins with analog baseband signals from the MSM device that drive the

RTR6250 IC. The RTR6250 IC provides all the UMTS transmitter active signalpath circuits except the power amplifiers. Analog (I and Q) differential signals from the MSM device are buffered, filtered, and applied to Baseband-to-RF quadrature upconverters. Gain control is implemented on-chip. The RF outputs include an integrated matching inductor, reducing the off-chip matching network to a single series capacitor.

The RTR6250 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. The PA device used in KU950 is “Load

Insensitive PA”- no need to use isolator - and routed to the duplexer Tx port directly. Transmit power is delivered from the duplexer to the antenna through the switch module.

The RTR6250 IC integrates LO generation and distribution circuits on-chip, substantially reducing offchip requirements. Various modes and programmable features result in a highly flexible transceiver LO output that supports not only UMTS transmissions, but all EGSM900 and DCS1800/PCS1900 Rx and

Tx modes as well.

The UMTS Tx LO (PLL1) is generated almost entirely on-chip, requiring only the loop filter off-chip (two capacitors and two resistors); all UMTS Tx VCO and PLL circuits are on-chip. An internal RTR6250 switch routes the internal VCO signal to the LO generation and distribution circuits to create the necessary UMTS Tx LO signals.

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3.4 LO Phase-locked Loop

Most LO functions are fully integrated on-chip, do not require user adjustment, and need not be considered by handset designers. QUALCOMM has established and implemented frequency plans and LO generation schemes that support the radioOne 6250-IIseries chipset while requiring minimal off-chip design effort. Only one area requires handset designer attention: the loop filters of each phase-locked loop (PLL).

3.4.1 UMTS Rx PLL (PLL2)

UMTS Rx LO functional blocks are distributed between the RFR6250 IC, RTR6250 IC, and external

UMTS_RX_CH_VCO and loop filter components (Figure 1.4.1-1). The external UMTS_RX_CH_VCO must be enabled for UMTS Rx operation and disabled otherwise; a dedicated MSM6275 IC signal

(UHF_VCO_EN ) enables the VCO.

Figure 1.4.1-1 UMTS Rx PLL functional block diagram

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The RFR6250 IC accommodates single-ended or differential LO inputs; if single-ended, either pin can be active. AC-couple the inactive pin to ground using an appropriately valued capacitor (12 pF is used in KS10). The 27 pF capacitor should be used to AC-couple the active pin to the VCO signal. Using only the selected VCO signal, the RFR6250 IC LO generation and distribution circuits create the necessary LO signals for the active quadrature downconverter.

A sample of the downconverter LO is buffered and routed from RFR6250 IC pin 19 to RTR6250 IC pin

32 (RX_VCO_IN). This signal requires a terminating resistor near the RTR6250 IC input pin and an AC coupling capacitor that assures the internal RTR6250 IC biasing is not disrupted in the example. Good microstrip or stripline controlled-impedance techniques must be used.

Most UMTS Rx PLL circuits are included within the RTR6250 IC: reference divider, phase detector, charge pump, feedback divider, and digital logic that generate LOCK status. The buffered 19.2 MHz

TCXO signal provides the synthesizer input (REF), the frequency reference to which the PLL is phase and frequency locked. The reference is divided by the RCounter to create a fixed frequency input to the phase detector, FR. The other phase detector input (FV) varies as the loop acquires lock, and is generated by dividing the RX_VCO_IN frequency using the feedback path.s N-Counter. The closed loop will force FV to equal FR when locked. If the loop is not locked the error between FV and FR will create an error signal at the output of the charge pump. This error signal is filtered by the loop filter and applied to the VCO, tuning the output frequency such that the error is decreased. Ultimately the loop forces the error to approach zero and the PLL is phase and frequency locked.

Many key PLL performance characteristics are largely determined by the loop filter design - stability, transitory response, settling time, and phase noise.

3.4.2 Transceiver PLL (PLL1)

All LO functional blocks for the other handset modes(UMTS Tx, EGSM Tx/Rx, DCS Tx/Rx, PCS

Tx/Rx) are integrated into the RTR6250 IC except the loop filter components (Figure 1.4.2-1). On-chip circuits include reference divider, phase detector, charge pump, VCO, feedback divider, and digital logic status. The functional description given in Section 1.4.1 for the UMTS Rx PLL applies to the

Transceiver PLL as well.

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Figure 1.4.2-1 Transceiver PLL functional block diagram

The off-chip loop filter allows optimization of key PLL performance characteristics (stability, transitory response, settling time, and phase noise) for different applications. Guidelines are provided in the next subsection for proper implementation of this critical circuit.

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3.5 Off-chip RF Components

3.5.1 Front End Module(FL500)

Front End module integrates antenna switch module and GSM Rx filter.

The antenna switch module allows multiple operating bands and modes to share the same antenna. In the KS10 design, a common antenna connects to one of six paths:

1) UMTS-2100 Rx/Tx, 2) EGSM Rx, 3) DCS-1800 Rx, 4) PCS-1900 Rx, 5)EGSM Tx, and 6) DCS-

1800, PCS-1900 Tx. UMTS operation requires simultaneous reception and transmission, so the

UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. GSM band of operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required. The module includes lowpass filters for the GSM bands transmit paths to reduce out-of-band emissions, PA harmonics in particular.

The GSM mode RF filters are located before their LNAs, so their insertion losses are extremely critical

(1.3 dB typical). Other important parameters are:

■ Out-of-band rejection or attenuation levels

❏ Far out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency.

❏ Frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input.

❏ GSM band receivers operate while the handset transmitters are off so there are no Txband leakage attenuation requirements.

■ Phase and amplitude balance - the UMTS discussion presented above applies for GSM bands as well. See the data sheet for specific values. Of course, passband ripple and return loss are still important in all cases for the same reasons explained in the antenna switch module and duplexer sections.

3.5.2 UMTS duplexer (U506)

A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include:

- Insertion loss . this component is also in the receive and transmit paths; In the KS10 typical losses:

UMTS Tx = 1.45 dB, UMTS Rx = 1.86 dB.

- Out-of-band rejection or attenuation . the duplexer provides input selectivity for the receiver, output filtering for the transmitter, and isolation between the two. Rejection levels for both paths are specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver performance:

- Rx-band isolation . the transmitter is specified for out-of-band noise falling into the Rx band. This noise leaks from the transmit path into the receive path, and must be limited to avoid degrading receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and

Rx-band losses between the PA and LNA. Typical duplexer Rx band isolation value is 51 dB.

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- Tx-band isolation . the transmit channel power also leaks into the receiver. In this case, the leakage is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Typical duplexer Tx-band isolation value is 57 dB.

- Passband ripple . the loss of this fairly narrowband device is not flat across its passband. Passband ripple increases the receive or transmit insertion loss at specific frequencies, creating performance variations across the bands channels, and should be controlled.

- Return loss . minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).

- Power handling. high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be used between the UMTS PA and duplexer to assure proper performance.

3.5.3 UMTS Power Amplifier (U505)

The AWT6277 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6250 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-ofthe-art reliability, temperature stability, and ruggedness. Selectable bias modes that optimize efficiency for different output power levels, and a shutdown mode with low leakage current, increase handset talk and standby time. The self-contained 4 mm x 4 mm x 1.1 mm surface mount package incorporates matching networks optimized for output power, efficiency, and linearity in a 50 Ω system.

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Figure 1.5.3-1 UMTS PA functional block diagram

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3.5.4 Thermistor (R527)

This thermistor senses temperature variations around UMTS PA to adjust PA gain deviation for assure compliance with the applicable transmit power control standards. Negative temperature compensation thermistor is used in the KS10.

3.5.5. UMTS transmit power detector (U504)

This detector couples PA output power level to calibrate the transmitter characteristic over the channel variation and temperature. Its detector coupling range and converted voltage is based on diode sensitivity and transmitter power level.

The KS10 uses National Semiconductor ADL5500 power detector IC. In Figure 1.5.5-1, C580 is set to

47ohm&Coupler resulting in an attenuation of 31.4dB. The output voltage is proportional to the logarithm of the input power. Figure1.5.5-2 shows the output voltage versus PA output power of the

ADL5500 setup as depicted in Figure1.5.5-1

Figure 1.5.5-1 Block diagram of ADL5500 with resistive tap

Figure 1.5.5-2 Power detector response, Vout vs PA output power

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3.5.6 Dual band GSM power amplifier (U501)

The TQM7M5003 is a high-power, high-efficiency power amplifier module with integrated power control that provides over 50dB of control range. The devices is a self-contained 6mm°ø6mm module with 50Ω input and output terminals. The device is designed for use as the final RF amplifier in

GSM850, EGSM900, DCS and PCS hand-held digital celluar equipment and other applications in the

824MHz to 849MHz, 880MHz to 915MHz, 1710MHz to 1785MHz and 1850MHz to 1910MHz bands.

The VBATT pin connects to an internal current-sense resistor and interfaces to an integrated power amplifier control function, which is insensitive to variations in temperature, power supply, process, and input power. The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain.

Figure 1.5.6-1 GSM PA functional block diagram

3.5.7 GSM transmit VCO (U502)

The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts

PLL and transmitter performance. VCO specifications refer to muRata MQW5V0C869M datasheet.

The dual Tx VCO outputs, one for Low-band GSM and one for high band, drive a resistive network that splits the active signal into two signals: 1) the input to the active PA . this is the low loss path, and 2) the OPLL feedback signal . this is the high loss path. See Figure 8-1 for recommended topology and resistor values.

The losses from the VCO outputs to the PA inputs must be factored into the output chain.s power budget. Each path includes a π-pad that introduces approximately a 3-dB loss. The low band GSM

π-pad is formed by R516 plus R522, R521, and R524; the high band GSM π-pad is formed by R518 plus R523, R520, and R524. One leg of each π-pad is used to couple the VCO output to form the feedback path as described below.

For a given VCO output drive level, the loss to the RTR6250 input must assure the specified input level is achieved (-18 to -12 dBm). Large resistors included in the π-pads are used to lightly couple off the VCO outputs to create the feedback signal. Since the RTR6250 TX_VCO_FB pin presents fairly high impedance. A series capacitor (82 pF) AC couples the feedback signal into the RTR6250

IC.

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3.5.8 UMTS Rx RF filter (FL501)

An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include:

■ Out-of-band rejection or attenuation levels, usually specified to meet these conditions:

❏ Far out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency.

❏ Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band leakage.

❏ Other frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input.

■ Phase and amplitude balance - the ZIF architecture requires well-balanced differential inputs to the

RFR6250 IC. This is accomplished by the RF filter which takes a single-ended output from the

RFL6250 IC and provides differential outputs having nominal 180 phase separation. Phase and/or amplitude imbalance causes degraded common-mode rejection and second-order nonlinearity, so their requirements are specified jointly.

❏ ±3 degrees and ± 1 dB

❏ -12 to + 3 degrees and ± 0.7 dB

Of course, passband ripple and return loss are still important in all cases for the same reasons explained in the antenna switch module and duplexer sections.

3.5.9 VCTCXO (X500)

The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the

MSM6275 IC. The 6275-series chipset requires a 19.2 MHz nominal VCTCXO frequency. The oscillator frequency is controlled by the MSM6275’s TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control.

The filtered PDM signal results in an analog control signal into the VCTCXO tuning port whose voltage is directly proportional to the density of the digital bit stream. The MSM device varies the pulse density to change the analog control voltage that sets the oscillator frequency - all within a feedback control loop that minimizes handset frequency drift relative to the network.

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3. BB Technical Description

3.6 Digital Baseband (Stn8810 / MSM6275)

3.6.1 General features of Stn8810 device

• Support for Peripheral Device & multimedia function

• Support for high-speed downlink packet access (HSDPA) - 1.8 Mbps

• Minimal support for high-level operating system such as Symbian™, Linux and WinCE® operating systems (OSs).

• 1-Gbit NAND Flash memory, 512-Mbit DDR mobile RAM Stacked in Package

• Two DSP implementation for multimedia function

- Smart video accelerator : Programmable DSP (MMDSP+) for intermediate level processing, clocked at 66 MHz,

- Smart audio accelerator : High-performance block, flexible sophisticated audio accelerator based on the MMDSP+ programmable audio DSP, clocked at 133 MHz,

• ARM926EJ 32-bit RISC CPU at 350MHz

32-Kbyte instruction cache, 16-Kbyte data cache

• MultiMedia Card/SD Card/SDIO host controller

• 96 general-purpose I/Os (muxed with peripheral I/Os)

• Camera interfaces

- Supports high-resolution camera modules up to 4 Mpixels

- Serial camera interface up to 416 Mbit/s (MIPI legacy CSI)

- Parallel camera CCIR-656 interface up to 66 MHz (MIPI legacy CPI)

• Color LCD controller for STN or TFT panels or display interface for display module

- 24-bpp true color

- MIPI legacy DBI and DPI

• Host port interface (HPI)

- 16-bit parallel data bus,

- Multiplexed and non-multiplexed address/data bus,

- Indirect host access,

- Direct host access to a segment of STn8810 memory in multiplexed mode.

- Interface to modem for data communication

• I/O peripherals

- 3 autobaud UARTs (one with modem control signals) up to 3.692 Mbit/s

- 1 synchronous serial port (SSP) up to 24 Mbit/s

- 3 multichannel serial ports (MSP) up to 48 Mbit/s

- 2 I©˜C multi-master/slave interfaces

- One 8-channel, full-duplex high-speed serial interface, 108 Mbit/s

- Host port interface

- JTAG

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3.6.2 General features of MSM6275 device

• Support for multimode operation - WCDMA(UMTS), GSM/GPRS, EDGE

• Support for high-speed downlink packet access (HSDPA) - 1.8 Mbps

• Support for WCDMA (UMTS) uplink data rate up to 384 kbps

• High-performance ARM926EJ-S running at up to 225 MHz

• ARM Jazelle Java hardware acceleration for faster Java-based games and other applets

• QDSP4000 high-performance DSP cores

• Integrated gpsOne position location technology functionality

• Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals

• High-speed, serial mobile display digital interface (MDDI) Type I, which optimizes the interconnection cost between the MSM device and LCD panel

• Direct interface to digital camera module with video front end (VFE) image processing

• Vocoder support (AMR, FR, EFR, HR)

• Advanced 14x14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology

• WCDMA Access

- Maximum of eight simultaneous transport channels

- Four coded composite transport channels (CCTrCH)

- PS data rates supporting 384kbps DL / 64kbps UL

• GSM/GPRS Access

- GSM/GPRS network signaling (from Layer 1 to 3)

- GSM AMR,EFR,FR

• Operation and Services

- USIM Interfaces

- General Purpose I/O (GPIO) Interface

- Dual Memory Buses (EBI1-SDRAM & EBI2-NAND Flash)

- JTAG

- RTC

• Data Communication

- UARTs (ACB, EDB (RS232))

- Slave USB

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3.7. Hardware Architecture

FEM

GSM

Quadband

GSMQua d

TX VCO

GSM TX

GSM

900/1800/1900

RX FILTER

GSM RX

RTR6250

WCDMA TX

UMTS

(2100)

FILTER

WCDMA RX

RFR6250

UMTS

FILTER

MSM6275

USIM

SDRAM

+ NAND

PM6650

STw4810

HPI I/F

18pin MMI

Connector

Receiver

/ SPEAKER

MIC

BLUETOOTH

Micro SD

1.3M CAMERA

VGA CAMERA

MAIN LCD

Audio Codec.

(WM8753)

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STn8810

Figure. Simplified Block Diagram

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3.7.1. STn8810 and supported peripherals

3. TECHNICAL BRIEF

Figure. STn8810 and supported peripherals

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3.7.2. MSM6275 and supported peripherals

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Figure. MSM6275 and supported peripherals

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3. TECHNICAL BRIEF

3.8. Subsystem of STn8810

3.8.1. ARM926EJ processor

The STn8810 CPU is an ARM926EJ reduced instruction set computer (RISC) processor. This 32-bit processor core supports 32-bit ARM® and 16-bit Thumb instruction sets, enabling the user to trade off between high performance and high code density.

The cached ARM CPU features a memory management unit (MMU) and is clocked at 264 MHz.

It has a 32-Kbyte instruction cache and a 16-Kbyte data cache, and supports the Jazelle™ extensions for Java acceleration. It also includes an embedded trace module (ETM Medium+) for real-time CPU activity tracing and debugging. It supports 4-bit and 8-bit normal trace mode and 4-bit demultiplexed trace mode, with normal or half-rate clock.

3.8.2. Smart video accelerator (SVA)

Using leading-edge technology, this block is a low-power, high-performance video accelerator that supports the following features:

• MPEG-4 simple profile level 3 video encoder and decoder; real time up to VGA 30 fps (encode only or decode only)

• H.263 profile 3 level 10 video codec; real time subQCIF or QCIF 15 fps for videoconferencing

• H.263 profile 3 level 30 video encoder or decoder; real-time up to CIF 30 fps

• JPEG baseline accelerated encoder or decoder, up to 4080 x 4080 pixels

• Programmable DSP (MMDSP+) for intermediate level processing, clocked at 66 MHz

• Picture pre-/post-processing

• Low-power implementation

3.8.3. Smart audio accelerator (SAA)

This high-performance block is a flexible sophisticated audio accelerator based on the MMDSP+ programmable audio DSP, clocked at 133 MHz, and features:

• 24-bit data path

• Ultra-low power implementation

The audio accelerator features:

• MP3, AAC, AAC+ (SBR) decoding, Midi synthesis, and more

• Speech codecs: AMR (WB, NB), and more

• Audio sample rates of 32 kHz, 44.1 kHz and 48 kHz

• Noise reduction and echo cancelling

• Stereo enhancements and surround effects

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3.8.4. Advanced power management unit (PMU)

The dynamic PMU optimizes power consumption of the STn8810. It delivers all the platform clocks, and handles reset management. It also manages GPIO levels during sleep mode and emergency self-refresh of SDRAM.

The PMU controls the external voltage regulator, in order to change its settings in different modes.

In deep-sleep mode, only GPIOs, the real-time clock (RTC), system and reset controller (SRC),

PMU and secured RAM remain in operation. The PMU also controls the embedded 1.2 V voltage switch that switches off the logic supply after the platform has entered sleep mode.

The family of power manager ICs, STw481x companion chips, seamlessly interface with the

Nomadik STn8810 and optimize global system power consumption leveraging on the PMU.

3.8.5. Host port interface (HPI)

The host port interface features:

• 16-bit parallel data bus

• Multiplexed and non-multiplexed address/data bus

• Indirect host access

• Direct host access to a segment of STn8810 memory in multiplexed mode

3.8.6. General purpose inputs/outputs (GPIOs)

The STn8810 provides 96 programmable inputs or outputs that have switchable pull-up and pull-down resistors and are controllable in two modes:

• Software mode through an APB bus interface

• Hardware mode through a hardware control interface

The GPIO interface provides the following individually programmable functions:

• Any number of pins may be configured as interrupt sources

• Debouncing logic can be enabled for each GPIO to filter out glitches on I/Os

• Any GPIO may be used to wake up the device from sleep mode independent of interrupt programming, and the input level that triggers wake-up is definable for each enabled GPIO

3.8.7. Universal asynchronous receivers-transmitters (UARTs)

The STn8810 provides three autobaud UARTs, one of which offers all modem control/status signals.

They are enhanced versions of the industry-standard 16C550 UART with a high data rate up to 3.692

Mbit/s.

LGE Internal Use Only

- 40 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.8.8. USB interface

The STn8810 USB interface is USB 2.0 compliant, with On-The-Go standard extension (rev 1.0) compliance. The USB-OTG features:

• Supports full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) signaling bit rate

• Supports session request protocol (SRP) and host negotiation protocol (HNP)

• 8 bidirectional endpoints plus control endpoint 0

• Digital interface to external PHY

• Fully compatible with STw4810 power manager companion chip

3.8.9. I

C bus interface

The STn8810 provides two I©˜C bus interfaces that support the following features:

• Slave transmitter/receiver and master transmitter/receiver modes

• Multi-master capability

• 10-bit addressing

• Standard (100 kHz) and fast (400 kHz) speeds

• Compliance with I 2 C and DDC standards

In addition to receiving and transmitting data, the interface converts data from serial to parallel format and vice-versa using an interrupt or polled handshake. The interrupts are enabled and disabled in software.

3.8.10. MultiMediaCard/secure data card interface (MMC/SD/SDIO)

This interface can directly control one SD card (without encryption/decryption logic) or SDIO card, or one MultiMediaCard. It also supports several of each card type using the GPIOs for card selection.

Only for training and service purposes

- 41 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.9. Hardware Peripheral system of Stn8810

3.9.1. Keypad

KS10 has 28 buttons, 12 function keys in Sub PCB (Folder), 12 numeric keys in main and 4 side keys.

KS10 use key coder IC because Stn8810 has not enough GPIO. Key coder IC use interrupt and I2C interface for communication with STn8810. Figure shows the Keypad circuit.

°ÆEND’ Key is connected to PM_ON_SW_N to PM6650

ROW0

ROW1

ROW2

ROW3

COL0 COL1 COL2

Main

COL3

Vol. UP

Vol. DOWN

SHOT

Side Key

COL4

Left Soft Key

SEND

LEFT

COL5

DOWN

EDIT

Folder

COL6

Right Soft Key

CANCEL

END

RIGHT

Table. Key Matrix Mapping Table

KEY_ROW(0:3)

AP_VDD_IO_2.7V

R414 R415

3.3K

I2CSCL1

I2CSDA1

KEY_COL(4:7)

LGE Internal Use Only

KEY_COL(4)

KEY_COL(5)

KEY_COL(6)

KEY_COL(7)

Wake_INP6

Wake_INP7

K_Out4

K_Out5

K_Out6

K_Out7

Gen_IO_2

Gen_IO_3

U404

LM8333GGR8_NOPB

K_Out3

K_Out2

K_Out1

K_Out0

_RESET

Int_Rx

WD_Out

Int_Tx

KEY_COL(3)

KEY_COL(2)

KEY_COL(1)

KEY_COL(0)

KEYCODER_RSTN

TP406

KEYCODER_INT

TP407

KEY_COL(3:0)

C418 C419

0.1u

AP_VDD_IO_2.7V

Figure. Schematic of key coder IC

- 42 -

Only for training and service purposes

3. TECHNICAL BRIEF

AP_VDD_IO_2.7V

KEY_ROW(0)

KEY_COL(3)

KEY_ROW(1)

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_COL(0)

KEY_COL(1)

KEY_COL(2)

SW400

SW403

SW406

SW409

SW401

SW404

SW407

SW410

SW402

SW405

SW408

SW411

Side Key (Vol. UP/Down)

KEY_ON_SW_N

KEY_COL(3)

KEY_ROW(2)

CN401

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_COL(4)

KEY_COL(5)

KEY_COL(6)

Main PCB

SW100

SW103

SW106

SW109

SW101

SW104

SW107

SW110

SW102

SW105

SW108

SW111

Side Key (Power/Shot)

CN400

Sub PCB

Figure. Schematic of keypad

Only for training and service purposes

- 43 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.9.2. Folder on/off operation

There is a magnet to detect the folder status, opened or closed. If a magnet is close to the hall-effect switch, the voltage at pin1 of U402 goes to 0V. Otherwise, 2.7V. This folder signal is delivered to

GPIO0 of the Key coder IC .

AP_VDD_IO_2.7V

FOLDER_DETECT

C413

R413

100K

U402 A3212EEH-T

OUTPUT VDD

NC1 NC2

GND2

GND1 PGND

EUSY0200301

C414

0.1u

Figure. Schematic of folder on/off detection circuit

LGE Internal Use Only

- 44 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.9.3. Keypad backlight

There are 8 White LEDs on Top side of Main PCB and 9 White LEDs on Top side of sub PCB in board backlight circuit and, which are driven by KEYBD_BACKLIGHT line form PM6650. Key Pad backlight controlled by PM6650.

AP_+VPWR

LD400

R402 100ohm

SSC-TWH104-HLS

LD402

R405 100ohm

SSC-TWH104-HLS

LD404

R408 100ohm

SSC-TWH104-HLS

LD406

R411 100ohm

SSC-TWH104-HLS

LD401

R403 100ohm

SSC-TWH104-HLS

LD403

R406 100ohm

SSC-TWH104-HLS

LD405

R409 100ohm

SSC-TWH104-HLS

LD407

R412 100ohm

SSC-TWH104-HLS

KPD_DRV_N

VA400

EVL14K02200

Figure. Schematic of main PCB keypad backlight circuit

AP_+VPWR

LD100

R106 100ohm

SSC-TWH104-HLS

LD103

R109 100ohm

SSC-TWH104-HLS

LD105

R111 100ohm

SSC-TWH104-HLS

LD107

R113 100ohm

SSC-TWH104-HLS

LD101

R107 100ohm

SSC-TWH104-HLS

LD104

R110 100ohm

SSC-TWH104-HLS

LD106

R112 100ohm

SSC-TWH104-HLS

LD108

R114 100ohm

SSC-TWH104-HLS

LD102

SSC-TWH104-HLS

KPD_DRV_N

VA100

EVL14K02200

Figure. Schematic of key PCB keypad backlight circuit

Only for training and service purposes

- 45 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.9.4. Micro SD

CPU

(ST Micro.)

1.8V Signal

Clock

Command

Data

Level shifting

PMIC

(ST Micro.)

SD_INT

2.85V Signal

Clock

Command

Data

SD Socket

USBINTN

USBVM

USBRCV

USBSCL

USBSDA

MCCLK

MCFBCLK

MCCMDDIR

MCCMD

MCDAT0DIR

MCDAT0

MCDAT31DIR

MCDAT1

MCDAT3

MCDAT2DIR

MCDAT2

TP305

USBVM

USBRCV

USBINTN

USBSCL

USBSDA

MCCLK

MCFBCLK

MCCMDDIR

MCCMD

MCDAT0DIR

MCDATA0

MCDATA31DIR

MCDATA1

MCDATA3

MCDAT2DIR

MCDATA2

PMIC

(ST Micro.)

LATCHCLK

CLKOUT

VBAT_MMC

VMMC

DATAOUT3

DATAOUT2

DATAOUT1

DATAOUT0

CMDOUT

GPO1

GPO2

C334

C335

C336

C332

2.2u

VMMC_3.1V

SD Socket

S300

GCC110-8S-R-E1000

GND SWB SWA

GND

C339

C343

SD_INT

VMMC_3.1V

SD_DAT(1)

SD_DAT(0)

SD_CLK

SD_CMD

SD_DAT(3)

SD_DAT(2)

CPU

(ST Micro.)

SD_DAT(1)

SD_DAT(0)

SD_CLK

SD_CMD

SD_DAT(3)

SD_DAT(2)

LGE Internal Use Only

- 46 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.10. Subsystem of MSM6275

3.10.1. ARM Microprocessor Subsystem

The MSM6275 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM device, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a generic serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the

RFL6202, RFR6202, RTR6250, RTR6200, and PM6650 devices.

3.10.2. UMTS/HSDPA Subsystem

The UMTS/HSDPA subsystem performs the digital release 99 June 2004 of the WCDMA FDD standard and release 5 specifications of HSDPA signal processing.

The UMTS Subsystem performs the digital UMTS signal processing. Its components include:

• Searcher engine

• Demodulating fingers

• Combining block

• Frame deinterleaver

• Viterbi decoder

• Up-link subsystem

• Turbo decoder

On the down-link channel the UMTS subsystem searches, demodulates, and decodes incoming

CPICH, CCPCH, SCH, and Traffic Channel information. It extracts packet data from the downlink traffic channel and prepares the packet data for processing. For the up-link, the WCDMA subsystem processes the packet data and modulates the up-link traffic channel (DCH).

3.10.3. GSM/GPRS Subsystem

The GSM/GPRS/EGPRS subsystem reuses the MSM6275 GSM core. It performs the digital GSM signal processing and PA gain controls for GPRS support. The PA output level is controlled by an analog signal generated on the MSM. In GSM mode, the power profile ramps up before The burst and ramps down after the burst. In GPRS mode, at the beginning of each burst (up to Four active transmit slots), PA must be smoothly ramped up to some desired output power level, Held at that level for the current slot, smoothly ramped down/up during the transition period and Held to the new level for the next slot until the last slot. Then it must be smoothly ramped down to near-zero level. The MSM6275 support differential GSM PA power control output.

Only for training and service purposes

- 47 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.10.4. RF Interface

The RF interface communicates with the mobile station external RF circuits. Signals to these Circuits control signal gain in the Rx and Tx signal path, control DC offset errors, and maintain the system frequency reference.

3.10.5. Serial Bus Interface (SBI)

The MSM6275 device’s SBI is designed specifically to be a quick, low pin count control Protocol for

QUALCOMM’s RFL6202, RFR6202, RTR6250, RTR6200, and PM6650 ASICs. Using the SBI, the

RTR6250, RFR6200, RFL6200, and PM6650 devices can be configured for different operating modes and for minimum power consumption, extending battery life in standby mode. The SBI also controls

DC baseband offset errors.

3.10.6. HKADC

The MSM6275 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is Intended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels.

The MSM6275 device has seven analog input pins (HKAIN[5:0]) which are multiplexed to the input of the internal HKADC.

3.10.7. Stereo Wideband CODEC

The MSM6275 device integrates a wideband voice/audio codec into the MSM. The codec supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface. The codec integrates the microphone and earphone amplifiers into the MSM6275 device, reducing the external component count to just a few passive components. The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set externally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission systems.

3.10.8. Vocoder Subsystem

The MSM6275 QDSP4000 supports AMR, FR, EFR, and HR. In addition, the QDSP4000 has modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx automatic volume control (AVC), ear seal echo canceller (ESEC), acoustic echo canceller (AEC), noise suppression (NS), and programmable, 13-tap,

Type-I, FIR, Tx/Rx compensation filters. The MSM6275 device’s integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures the QDSP4000 to support the desired functionality.

LGE Internal Use Only

- 48 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.10.9. General-Purpose Input/Output Interface

The MSM6275 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional

RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.

3.10.10. UART

There are three UARTs in the MSM6275 ASIC:

• UART1 for data

• UART2 (can be used for USIM interface)

• UART3 (can be used for PM SBI interface)

3.10.11. USB

The MSM6275 device integrates a universal serial bus(USB) controller that supports both unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral communicating with the USB host. It is also capable of a USB OTG interface to a USB OTG

Transceiver.

Only for training and service purposes

- 49 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.11. External memory interface

The MSM6275 have two external memory interfaces with arbitration for the multi-layer AHB system and memory controllers. The EBI1 bus is a high performance bus that supports a wide variety of memories. EBI2 bus is targeted to be the interface for slow peripheral devices(i,.e., LCD) as well as the NAND flash memory.

• EBI1 Features

- 16 bit static and dynamic memory interface

- 32 bit dynamic memory interface

- 24 bits of address for static memory devices which can support up to 32MBytes on each chip select

- Synchronous burst memories supported (burst NOR, burst PSRAM)

- Synchronous DRAM memories supported

- Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses

- Pseudo SRAM (PSRAM) memory support

• EBI2 Features

- Support for asynchronous FLASH and SRAM(16bit & 8bit).

- Interface support for byte addressable 16bit devices(UB_N & LB_N signals).

- 2Mbytes of memory per chip select.

- Support for 8 bit wide NAND flash.

- Support for parallel LCD interfaces, port mapped of memory mapped(16 & 8 bit)

• 512Mb NAND flash memory + 512Mb SDRAM (1die)

Device

FLASH

SDRAM

Part Name

TY90009800COGG

Interface Spec

Maker

Toshiba

Read Access Time Write Access Time

35 ns/Bytes 50 ns/Bytes

107 ns/4Double Word 53 ns/4Double Word

Table. External memory interface for KS10

LGE Internal Use Only

- 50 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.12. Hardware sub system of MSM6275

3.12.1. RF Interface

3.12.1.1. RTR6250 (WCDMA_Tx, GSM_Tx/Rx)

MSM6275 controls RF part(RTR6250) using these signals.

• SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset

• PA_ON : Power AMP on RF part

• RX_I/Q,TX_I/Q : I/Q for Tx/Rx of RF

• TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier

3.12.1.2. RFR6250 (WCDMA_Rx)

• SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset

• RX_I/Q, : I/Q for Rx of RF

3.12.1.3. The others

• GSM_PA_BAND : DCS/GSM Band Selection of Power Amp

• TRK_LO_ADJ : TCXO(19.2M) Control

• PA_ON : WCDMA TX Power Amp Enable

• ANT_SEL[0-2] : Ant Switch Module Mode Selection (WCDMA,GSM Tx/Rx,DCS Tx/Rx)

• GSM_PA_RAMP : Power Amp Gain Control of APC_IC

• GSM_PA_EN : Power Amp Gain Control Enable of APC_IC

• GSM_TX_VCO_0_EN_N : GSM Band Tx VCO Enable of Dual VCO

• GSM_TX_VCO_1_EN_N : DCS Band Tx VCO Enable of Dual VCO

Only for training and service purposes

- 51 -

LGE Internal Use Only

3. TECHNICAL BRIEF

600-1

M6275_A

XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77

UART3_RFR_N_GPIO87

UART2_DP_RX_DATA_GPIO89

SYNTH0_GP_PDM0_GPIO92

SBST1_GPIO93

L25

F18

H18

TX_AGC_ADJ

TRK_LO_ADJ

TCXO_EN_GPIO94

PA_ON0

H13

L13

F19

F17

Q_OUT_N

Q_OUT

I_OUT_N

I_OUT

DAC_REF

A12

B12

A13

B13

F12

Q_IM_CH1

Q_IP_CH1

I_IM_CH1

I_IP_CH1

Q_IM_CH0

Q_IP_CH0

I_IM_CH0

I_IP_CH0

W23

V23

V25

W25

AA25

Y25

AB25

AC25

GP_PDM2_PA_RANGE1

GP_PDM1_PA_RANGE0

D17

H17

TRST_N

TCK

TMS

TDI

TDO

RTCK

H15

D16

F15

D15

A17

H16

AUX_PCM_CLK_GRFC14_GPIO80

AUX_PCM_DIN_GRFC13_GPIO14

AUX_PCM_DOUT_GRFC12_GPIO103

AUX_PCM_SYNC_GRFC11_GPIO102

TX_ON_GRFC10

K19

N21

H12

GRFC8_GPIO11

GRFC7_GPIO10

GRFX6_GPIO9

GRFC5_AUX_SBST_GPIO8

GRFC4_AUX_SBCK_GPIO7

GRFC3_GPIO6

GRFC2_GPIO5

GRFC1_AUX_SBDT_GPIO4

GRFC0_GPIO3

T23

T19

D11

H10

F10

BT_CLK_GPIO25

BT_SBST_GPIO24

BT_SBCK_GPIO23

BT_SBDT_GPIO22

BT_TX_RX_N_GPIO21

BT_DATA_GPIO20

G23

F23

E26

E25

H21

R19

MDDIC_DATP

MDDIC_DATN

MDDIC_STBP

MDDIC_STBN

A22

A23

B22

B23

EAR_SENSE_N

Near to MSM

TCXO_EN

PA_ON

(WCMDA 2100PAM Enable)

TX_Q_M

TX_Q_P

TX_I_M

TX_I_P

DAC_REF

R607

R608

C644

0.01u

C645

33nF

TX_AGC_ADJ

TRK_LO_ADJ

VREG_MSMP_2.7V

RX0_Q_M

RX0_Q_P

RX0_I_M

RX0_I_P

(WCMDA PAM MODE)

W_VMODE_N

MSM_TRST_N

MSM_TCK

MSM_TMS

MSM_TDI

MSM_TDO

MSM_RTCK

TX_ON

ANT_SEL2

ANT_SEL1

ANT_SEL0

GSM_TX_VCO_0_EN_N

GSM_TX_VCO_1_EN_N

GSM_PA_BAND

HPIEV_IT_STATE_ETMTRIGIN

HPI_EME_APE_ETMPSTA2_XTIDAT

HPI_EME_MOD_ETMPSTA1_XTIDAT

HPI_IT_MOD_ETMSYNCA_XTIDAT

HPI_IT_APE_ETMPSTA0_XTIDAT

GSM_PA_EN

LGE Internal Use Only

C646

0.1u

10%

Place near

MSM pin AD26

(Check CAM_DATA PINOUT !!!!)

Figure. Schematic of RF Interface of MSM6275

- 52 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.12.2. MSM sub system

3.12.2.1. SIM interface

SIM interface scheme is shown in Figure.

And, there control signals are followed

• USIM_CLK : USIM Clock

• USIM_Reset : USIM Reset

• USIM_Data : USIM Data T/Rx

MSM6275

USIM CLK

USIM Reset

USIM Data

PM6650

VREG_USIM 2.85V

USIM CLK

USIM Reset

USIM Data

USIM

Figure. SIM Interface

3.12.2.2. UART interface

UART signals are connected to MSM GPIO through IO connector with 115.2kbps speed.

And, used for RF calibration and Data download.

GPIO_Map

GPIO_96

GPIO_95

Name

UART_RXD

UART_TXD

Table. UART interface

Note

Data_Rx

Data_Tx

Only for training and service purposes

- 53 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.12.2.3. USB

The MSM6275 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the

MSM6275 was designed to comply with the definition of a peripheral as specified in USB Specification,

Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB

Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the

MSM6275. KS10’s USB interface uses the PM6650 internal logic for USB Transceiver.

Name

USB_RCV

USB_DAT

USB_SE0

USB_OE_N

USB_VBUS

USB_D+

USB_D-

Note

Rx_Data to MSM

Data to/from MSM

Out-Put Enable of Transceiver

USB_Power From Host(PC)

USB Data+ to Host

USB Data- to Host

Table. USB signal interface

MSM6275

MSM6275_USB Block

USB_OE_

USB_DAT

USB_SE0

PM6650

Figure. USB Interface

USB_VBUS

D701

RB521S-30

USB_VBU

USB_D+

USB_D-

MMI

Connector

USB_OE_N

USB_CTL_N

USB_DAT

MSM_USB_D+

USB_SE0

MSM_USB_D-

47K R710

1u C732

PM6650_USB Block

VREG_5V

USB_OE_N

VSW_5V

USB_CTL_N

USB_VBUS

USB_DAT

USB_D_P

USB_SE0

USB_D_M

GP1_DRV_N(MPP7)

Power Line --> Route carefully!!!!!

Draw the Artwork_line thickly !!!!!

--->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-

+VPWR

100K

Figure. Schematic of USB block (MSM6275 Side & PM6650 Side)

LGE Internal Use Only

- 54 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.12.2.3. HKADC (House Keeping ADC)

The MSM6275 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6275 device has six analog input pins which are multiplexed to the input of the internal HKADC.

ADC Ch#

HKADC0

HKADC1

HKADC2

HKADC3

HKADC4

HKADC5

Figure. MSM6275 HKADC Block diagram

Signal Name

AMUX_OUT

VBATT_SENSE

HDET1

Note

RF PAM Temperature sensing

Battery voltage level sensing

RF WCDMA PAM Power Level sensing

VBAT_TEMP Battery Temperature sensing

- -

Table. HKADC channel table

Only for training and service purposes

- 55 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.12.3. Power Block

3.12.3.1. General

MSM6275A, included RF, is fully covered by PM6650-1M(Qualcomm PMIC). PM6650-1M cover the power of MSM6275A, MSM memory, RF block, USIM and TCXO.

Major power components are :

PM6650-1M (U700) : Phone power supply

NUS5530MN (Q701) : External charger supply switching & Main Battery charging control

3.12.3.2. PM6650-1M

The PM6650-1M device (Figure 1-1) integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference.

A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (undervoltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions.

MSM device controls and statuses the PM6650-1M IC using a three-line Serial BusInterface(SBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.

LGE Internal Use Only

- 56 -

Only for training and service purposes

3. TECHNICAL BRIEF

Figure. PM6650-1M Functional Block Diagram

Only for training and service purposes

- 57 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.12.3.3. Charging control

A programmable charging block in PM6650-1M is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM6650-1M circuits monitor voltages at

VCHARGER and ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.

KS10 Charging Control block

4.2V~3.96V

3.95V ~ 3.87V

3.86V~3.79V

3.78V~3.75V

3.74V~3.70V

3.69V~3.64V

3.63V~3.51V

3.50V~3.20V

Figure. KS10 Battery Bar Display (Standby condition)

LGE Internal Use Only

- 58 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.12.3.3.1 Trickle charging

Trickle Charging of the main battery, enabled through SBI control and powered from V

, is provided by the PM6650-1M IC, The trickle charger is on-chip programmable current source that supplies current from V

DD to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its performance specified below (3.2V). The charging current is set to 80mA.

Parameter

Trickle Current

Min

Typ

Max

100

Unit

Only for training and service purposes

- 59 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.12.3.3.2 Constant current charging

The PM6650-1M IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.

3.12.3.3.3 Constant voltage charging

Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected 10% of the full charging current (60mA)

• Charging Method : CC & CV (Constant Current & Constant Voltage)

• Maximum Charging Voltage : 4.2V

• Maximum Charging Current : 650mA

• Nominal Battery Capacity : 950 mAh

• Charger Voltage : 4.8V

• Charging time : Max 3 h (Except time trickle charging)

• Full charge indication current (icon stop current) : 60mA

• Low battery POP UP : 3.63V , 3.50V

• Low battery alarm interval : warning tone once only

• Cut-off voltage : 3.20V

LGE Internal Use Only

- 60 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.13. Audio and sound

3.13.1. Overview of Audio & Sound & BT path

VREG_MSMP_2.7V

ANT

Filter

STLC2500C

(BT)

PCM

BT_19.2M

UART

UART0

MSPRXD0

STN8810

(CPU)

I2S

MSPRCK0

MSPRFS0

GPIO

I2CSCL0

I2CSDA0

AU_19.2M

Level

Shifter

PCM

MIC_BIAS

MIC1

GPIO

WM_DACDAT

LOUT2

ROUT2

Switch

WM_MSPRXD0

GPIO

WM_BCLK

WM_LRC

GPIO

OUT3

LOUT1

ROUT1

Switch

WM_8753

(Audio Codec)

WM_MSPTCK0

WM_MSPTFS0

Level

Shifter

I2S

PM_SCL

PM_SDA

SCL

SDA

MIC2

AMP

MIC

SPK_AMP_SD_N

Speaker

Receiver

Head Set

MSM

RXP

RSN

WM_MONO1

WM_MONO2

HOOK_SENSE_N

EAR_SENSE_N

Figure. Block diagram ofaAudio &sSound path

Only for training and service purposes

- 61 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.13.2. Audio signal processing & interface

3.13.2.1. MSM6275A audio interface

The MSM6275 device integrates a wideband audio CODEC into the mobile station modem. The wideband codec allows the MSM device to support stereo music/ringer Melody applications in addition to the 8 kHz voice band applications on the forward link. In the audio transmit path, the device operates as 13-bit linear converter with software selectable 8 kHz and 16 kHz sampling rate. In the audio receive path, the device operates as a software selectable 13-bit or 16-bit linear converter with software selectable 8 kHz, 16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, or 48 kHz sampling rate.

Through software, the Rx path can be configured as either a mono or stereo output.

The integrated CODEC contains all of the required conversion and amplification stages for the audio front end. The CODEC operates as a 13-bit linear CODEC with the transmit (Tx) and receive (Rx) filters designed to meet ITU-T G.712 requirements. The CODEC includes a programmable sidetone path for summing a portion of the Tx audio into the Rx path. An on-chip Voltage/Current reference is provided to generate the precise voltages and currents required by the CODEC.

The interface supports two differential microphone inputs and a differential auxiliary input, each of which can be configured as single-ended if desired. In addition, the interface supports one differential earphone output, one single-ended earphone output, and one differential auxiliary output or two singleended line outputs.

The CODEC is configured through the QDSP4000 command types and is not directly controlled by the microprocessor. The CODEC configuration command is sent to the QDSP4000 and then the

QDSP4000 executes the command and configures the CODEC. Data is exchanged between the codec interface and the QDSP4000 through its DMA interface. The QDSP4000 uses the Ex_DMA_4 channel for reading data from the codec and uses the Ex_DMA_5 channel to transfer data to the codec. The CODEC interface is shown in more detail in Figure below.

LGE Internal Use Only

Figure. Detailed diagram of MSM6275 audio interface

- 62 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.13.2.2. STn8810 audio interface

Smart Audio Accelerator (SAA)

This high-performance block performs an audio hardware accelerator based on a programmable audio

DSP with 24-bit data path and ultra low power implementation.

Figure. Detailed diagram of STn8810 audio interface

Only for training and service purposes

- 63 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.13.2.3. WM8753L audio interface

The WM8753L is a low Power, high quality stereo Codec with integrated Voice CODEC designed for portable digital telephony applications such as mobile phone, or headset with Hi-Fi playback capability.

The device integrates dual interfaces to two differentially connected microphones, and includes drevers for speakers, headphone and earpiece. External component requirements are reduced as no separate microphone or headphone amplifiers are required.

Advanced on-chip digital signal processing performs tone control, Bass Boost and automatic level control for the microphone or line input through the ADC.

Figure. Detailed diagram of WM8753L audio interface

LGE Internal Use Only

- 64 -

Only for training and service purposes

3. TECHNICAL BRIEF

MSM6275A BLK

L600

100nH

C600

10p

C607

0.1u

10%

Place near

MSM pin W18

(CODEC VSS)

C608 C609 C610 C611

NA NA NA NA

MIC200

SUMY0009203

Handset main MIC BLK

WM_MICBIAS

WM_MIC1P

C245 1u

C246

39p

C247

10p

C251

39p

C248 1u

C252

39p

WM_MIC1N

SDCC_DAT1_GPIO99

SDCC_DAT2_GPIO100

SDCC_DAT3_GPIO101

MDP_VSYNC_SECONDA_GPIO104

MDP_VSYNC_PRIMARY_GPIO105

F25

M25

M26

AE3

AD2

Head Set Jack BLK

CN202

FB503 1000

FB245

AP_VDD_IO_2.7V

VREG_MSMP_2.7V

R222 68

R223 68

C242 33u

C244 33u

R225

1608

AP_VDD_IO_1.8V

C239

10p

C237

10u

100K R219

U205

OUT

G1 G2

NFM21PC105B1A3

R217

2.2K

C241

C240

R216

C238

0.1u

VIN-

VIN+

VCC

GND

OUT

U203

NCS2200SQ2T2G

R218

330K

WM_MIC2N

WM_MIC2P

WM_LOUT1

WM_ROUT1

USB_D+

USB_D-

EAR_SENSE_N

VBATT

REMOTE_PWR_ON

+5V_PWR

USB_VBUS_IN

UART_TXD

UART_RXD

R224

470K

HOOK_SENSE

CONNECTOR VBATT_SENSE PIN CHECK!!

VBATT_SENSE

VREG_MSMP_2.7V

C253

33u

CN203

VBAT_TEMP

C260

0.1u

CAD for EMC Noise

Between (VBATT & +5V_PWR) and (Mic signal)

Only for training and service purposes

- 65 -

LGE Internal Use Only

3. TECHNICAL BRIEF

Audio Codec(WM8753) BLK

WM_DVDD

WM_HPH_R

WM_HPH_L

WM_RXP

WM_RXN

WM_MIC1N

WM_MIC1P

WM_MIC2N

WM_MIC2P

WM_MICBIAS

C222

C224

C225

C226

LINE1

LINE2

RXP

RXN

ACIN

ACOP

MIC1N

MIC1

MIC2N

MIC2

MICBIAS

C234

4.7u

C235

4.7u

C236

4.7u

U202

WM8753LEB-RV

AU_19.2M

WM_AVDD WM_DVDD

WM_AVDD

OUT4

OUT3

LOUT1

MONO2

MONO1

C229

C230

ROUT1

LOUT2

ROUT2

WM_MONO2

WM_MONO1

WM_ROUT1

WM_LOUT2

WM_ROUT2

100K R213

100K R214

100K R215

R209

C223

R211

C227

10p

R212

RECEIVER--

RECEIVER+

RECEIVER-

AP_VDD_CAM_1.8V

WM_LOUT1

Audio Amp for loud Speaker

C261

R230 68K

WM_ROUT2

C262

0.068u

R229

10K

SPK_AMP_EN

WM_LOUT2

C267

0.068u

R233

10K

C266

0.22u

U208 TPA6205A1DRBR

_SHUTDOWN VDD

BYPASS

IN+

IN-

VO-

VO+

GND

PGND

R232 68K

C268 NA

SPEAKER AMP

LGE Internal Use Only

SPKL-

SPKL+

C263

2.2u

AP_+VPWR

- 66 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.14. Camera interface

KS10 has two cameras : 2M Pixel CMOS and VGA Pixel CMOS Camera Below figures shows the camera board to board connector and camera I/F signal.

3.14.1. Mega Camera Interface

CCIRID(3)_CAM

CCIRID(2)_CAM

CCIRID(1)_CAM

CCIRID(0)_CAM

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

FL200 EVRC18S03Q015050R

CCIRID(3)

CCIRID(2)

CCIRID(1)

CCIRID(0)

CCIRIHS_CAM

CCIRIVS_CAM

CCIRICLK_CAM

CAMCLK_27MHZ_CAM

MCAM_27M

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

FL201 EVRC18S03Q015050R

CCIRIHS

CCIRIVS

CCIRICLK

CAMCLK_27MHZ

R206 0

CAMCLK_27MHZ

CCIRID(7)_CAM

CCIRID(6)_CAM

CCIRID(5)_CAM

CCIRID(4)_CAM

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

FL202 EVRC18S03Q015050R

CCIRID(7)

CCIRID(6)

CCIRID(5)

CCIRID(4)

Figure. Schematic of 2 Mega Camera EMI/ESD filter I/F

AP_VDD_CAM_2.7V

I2CSDA0

I2CSCL0

CAM_PWR_EN

AP_VDD_IO_2.7V

I2CSDA0_SW

I2CSCL0_SW

U200

SLAS4717EPMTR2G

VCC NO2

NO1

COM1

IN1

NC1

COM2

IN2

NC2

GND

CCIRICLK_CAM

2M_RSTn_CAM

I2CSDA0_CAM

I2CSCL0_CAM

2M_PWDN

LOW

HIGH

Driven

Hi-Z

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

C207

2M_CAMERA

CN200

G3 G4

AXK7L34227

CCIRID(7)_CAM

CCIRID(6)_CAM

CCIRID(5)_CAM

CCIRID(4)_CAM

CCIRID(3)_CAM

CCIRID(2)_CAM

CCIRID(1)_CAM

CCIRID(0)_CAM

CCIRIVS_CAM

CCIRIHS_CAM

2M_RSTn_CAM

I2CSDA0_CAM

I2CSCL0_CAM

CSC3R270000BEVRS00

OUT

GND

X200

VDD

TRI_OPEN

27MHz

R207 100K

FL203

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

EVRC18S03Q015050R

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

2M_RSTn

I2CSDA0_SW

I2CSCL0_SW

C214

0.01u

Figure. Schematic of 2 Mega Camera Board to Board Connector

Only for training and service purposes

- 67 -

LGE Internal Use Only

3. TECHNICAL BRIEF

LVDD 2.8V

AVDD 2.8V

HSYNC

VSYNC

GND

CLKIN

GND

YUV0

YUV1

YUV2

YUV3

YUV4

YUV5

YUV6

YUV7

IOVDD

DVDD 1.8V

Name

GND

PCLK

GND

RESET

GND

SDA

SCK

GND

PDOWN

GND

Port

GND

I/O

GND

Note

GND

Pixel Clock

Ground

Initializes sensor, Active Low

Ground

Non-connection

Data for two-wire serial interface

Clock for two-wire serial interface

Non-connection

Ground

Power down mode, active High

Actuator Voltage

Analog Voltage

Horizontal Synchronous signal

Vertical Synchronous signal

Ground

Master clock

Ground

Image data output

Digital I/O Voltage

Digital Core Voltage

Table. Interface between 2M Camera Module and Main Board (in camera module)

LGE Internal Use Only

- 68 -

Only for training and service purposes

3. TECHNICAL BRIEF

The 2MCamera module is connected to main board with 34pin Board to Board connector

(AXK8L34125). Its interface is dedicated camera interface port in STN8810. The camera port supply

24MHz master clock to camera module and receive 40.078MHz pixel clock (max.15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.

The camera module is controlled by I2C port from STN8810.

Only for training and service purposes

- 69 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.14.2. VGA Camera Interface

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

CCIRIHS

VGA_RSTn

I2CSDA0_CAM

I2CSCL0_CAM

LCD_VS

DIS_CSN

DIS_RS

DIS_WEN

CCIRICLK

VGA_STANDBY

MAIIN-SLIDER CON-HEADER

CN201

G1 G2

R718

R719

RECEIVER+

RECEIVER-

RECEIVER--

MOT_PWR-

FL206

INOUT_A1

EVRC18S03Q015050R

INOUT_B1

INOUT_A2 INOUT_B2

3 7

INOUT_A3 INOUT_B3

4 6

INOUT_A4 INOUT_B4

WLED_CTL

LCD_NRESET

FB224

KPD_DRV_N

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_COL(4)

KEY_COL(5)

KEY_COL(6)

KEY_COL(7)

FB221

FB223

FB230

FB233

R720

R721

R722

R723

R724

R725

R726

R727

R728

CCIRIVS

CCIRID(7)

CCIRID(6)

CCIRID(5)

CCIRID(4)

CCIRID(3)

CCIRID(2)

CCIRID(1)

CCIRID(0)

CAMCLK_27MHZ_CAM

FB225

FB229

FB232

FB235

FB237

FB239

FB241

FB243

FB227

FB231

FB234

FB236

FB238

FB240

FB242

FB244

AP_VDD_LCD_2.8V

AP_+VPWR

FB222

G3 G4

AXK7L70227

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

EVRC14S03Q030100R FL208

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

EVRC14S03Q030100R FL204

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

EVRC14S03Q030100R FL205

INOUT_B4 INOUT_A4

6 4

INOUT_B3 INOUT_A3

7 3

INOUT_B2 INOUT_A2

8 2

INOUT_B1 INOUT_A1

9 1

EVRC14S03Q030100R FL207

LCD_DATA(7)

LCD_DATA(5)

LCD_DATA(3)

LCD_DATA(1)

LCD_DATA(6)

LCD_DATA(4)

LCD_DATA(2)

LCD_DATA(0)

LCD_DATA(8)

LCD_DATA(10)

LCD_DATA(12)

LCD_DATA(14)

LCD_DATA(15)

LCD_DATA(13)

LCD_DATA(11)

LCD_DATA(9)

VGA_STANDBY

CAMCLK_27MHZ_CAM

CCIRICLK_CAM

CCIRID(0)_CAM

CCIRID(1)_CAM

CCIRID(2)_CAM

CCIRID(3)_CAM

CCIRID(4)_CAM

CCIRID(5)_CAM

Figure. Schematic of Main slider FPCB B to B connector (in main BD)

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

VGA_CAMERA

CN100

AXK720145G

I2CSCL0_CAM

I2CSDA0_CAM

CCIRIHS_CAM

CCIRIVS_CAM

CCIRID(7)_CAM

CCIRID(6)_CAM

C102

VGA_RSTn

C100

0.1u

C101

0.1u

Figure. Schematic of VGA Camera Board to Board Connector (in main slider FPCB)

LGE Internal Use Only

- 70 -

Only for training and service purposes

3. TECHNICAL BRIEF

The VGA Camera module is connected to main slider FPCB with 20pin Board to Board connector(AXK820145). The main slider FPCB is connected to main board with 70pin board to board connector.

Its interface is dedicated camera interface port in STN8810. The camera port supply 24MHz master clock to camera module and receive 13.5MHz pixel clock (max. 15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module.

The camera module is controlled by I2C port from STN8810.

VSYNC

HSYNC

GND

SDA

SCL

RESET

DVDD

Name

ENABLE

MCLK

GND

PCLK

AVDD & IOVDD

GND

I/O

Port

GND

Note

Active ëHighí

Master Clock

Ground

Video Output Clock D[0:7]

Image Data[0]

Image Data[1]

Image Data[2]

Image Data[3]

Image Data[4]

Image Data[5]

Image Data[6]

Image Data[7]

Vertical Synchronization

Horizontal Synchronization

Ground

Data for two wire serial interface

Clock for two wire serial interface

Reset initializes sensor Active Low

Digital core circuit power supply voltage

Analog core circuit power supply voltage

& Digital I/O circuit power supply voltage

Table. Interface between Camera Module and Main Board (in camera module)

Only for training and service purposes

- 71 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.14.3. LCD backlight / Camera LDO

U100(in SUB board, AAT3151) is a charge pump. U301(in main board, BH18LB1WHFB) supply a

1.8V power of mega camera and VGA camera. U303(in main board, MIC5219-2.7YM5) supply a 2.7V

power of mega camera and VGA camera.

These parts are controlled by GPIOs of STN8810.

AP_+VPWR

LED_ANODE

C102

C103

4.7u

WLED_CTL

U100

VIN

AAT3151IWP_T1

C1+

VOUT

C1-

C2+

EN_SET

GND

PGND

C2-

C100

C101

LED1

LED2

LED3

LED4

LCD_Backlight driver

Figure. Schematic of charge pump

CAM_PWR_EN

AP_+VPWR

C308

U301 BH18LB1WHFV

STBY NC

GND BGND

VIN VOUT

AP_VDD_CAM_1.8V

C309

2.2u

CAM_PWR_EN

AP_+VPWR

AP_VDD_CAM_2.7V

C305

U303

MIC5219-2.7YM5

IN OUT

GND

EN BYP

C306

470p

C307

2.2u

LGE Internal Use Only

Figure. Schematic of camera LDO

- 72 -

Only for training and service purposes

3. TECHNICAL BRIEF

3.14.4. LCD module

MM_LCD_ADS_N

MM_LCD_CS_N

MM_LCD_WE_N

STN8810

MM_LCD_DATA[0:15]

MM_LCD_RD_N

MM_LCD_VSYNC

MM_LCD_RESET

MM_LCD_ADS_N

MM_LCD_CS_N

MM_LCD_WE_N

LCD

MM_LCD_DATA[0:15]

MM_LCD_RD_N

MM_LCD_VSYNC

MM_LCD_RESET

Figure. LCD I/F Block Diagram

MAIN LCD

MODULE

260K Color TFT

240 * 320 Pixel

BD663474(Hitachi) Graphic Controller Driver Main LCD Panel

Figure. LCD Module

Only for training and service purposes

- 73 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.14.5. Display

LCD module is connected to SUB board with 35-pin zip connector(XF2B-3545-31A).

The LCD is controlled by 16-bit in STN8810.

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

CCIRIHS

VGA_RSTn

I2CSDA0_CAM

I2CSCL0_CAM

LCD_VS

DIS_CSN

DIS_RS

DIS_WEN

CCIRICLK

MAIIN-SLIDER CON-HEADER

CN201

G1 G2

R718

R719

RECEIVER+

RECEIVER-

RECEIVER--

MOT_PWR-

FL206

INOUT_A1

EVRC18S03Q015050R

INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3

INOUT_A4

INOUT_B3

INOUT_B4

WLED_CTL

LCD_NRESET

FB224

VGA_STANDBY

KPD_DRV_N

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_COL(4)

KEY_COL(5)

KEY_COL(6)

KEY_COL(7)

FB221

FB223

FB230

FB233

R720

R721

R722

R723

R724

R725

R726

R727

R728

FB225

FB229

FB232

FB235

FB237

FB239

FB241

FB243

CCIRIVS

CCIRID(7)

CCIRID(6)

CCIRID(5)

CCIRID(4)

CCIRID(3)

CCIRID(2)

CCIRID(1)

CCIRID(0)

CAMCLK_27MHZ_CAM

FB227

FB231

FB234

FB236

FB238

FB240

FB242

FB244

AP_VDD_LCD_2.8V

AP_+VPWR

FB222

G3 G4

AXK7L70227

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

EVRC14S03Q030100R FL208

INOUT_B4 INOUT_A4

INOUT_B3 INOUT_A3

INOUT_B2

INOUT_B1

INOUT_A2

INOUT_A1

EVRC14S03Q030100R FL204

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

EVRC14S03Q030100R FL205

INOUT_B4 INOUT_A4

6 4

INOUT_B3 INOUT_A3

7 3

INOUT_B2 INOUT_A2

8 2

INOUT_B1 INOUT_A1

9 1

EVRC14S03Q030100R FL207

LCD_DATA(7)

LCD_DATA(5)

LCD_DATA(3)

LCD_DATA(1)

LCD_DATA(6)

LCD_DATA(4)

LCD_DATA(2)

LCD_DATA(0)

LCD_DATA(8)

LCD_DATA(10)

LCD_DATA(12)

LCD_DATA(14)

LCD_DATA(15)

LCD_DATA(13)

LCD_DATA(11)

LCD_DATA(9)

Figure. Schematic of Main slider FPCB B to B connector (in main BD)

AP_VDD_LCD_2.8V

R102

100K

LCD Connector

(lower contact)

R103 100K

R104 100K

CN100

R115 0

C105

820p

XF2B-3545-31A-P

LED1

LED2

LED3

LED4

LED_ANODE

LCD_VS

DIS_CSN

DIS_RS

DIS_WEN

TP100

TP101

LCD_DATA(0)

LCD_DATA(1)

LCD_DATA(2)

LCD_DATA(3)

LCD_DATA(4)

LCD_DATA(5)

LCD_DATA(6)

LCD_DATA(7)

LCD_DATA(8)

LCD_DATA(9)

LCD_DATA(10)

LCD_DATA(11)

LCD_DATA(12)

LCD_DATA(13)

LCD_DATA(14)

LCD_DATA(15)

LCD_NRESET

TP102

LCD_DATA(0:15)

LGE Internal Use Only

Figure. Schematic of LCD connector (in SUB board)

- 74 -

Only for training and service purposes

3. TECHNICAL BRIEF

DB1

DB2

DB3

DB4

DB5

DB6

DB7

DB8

DB9

DB10

DB11

DB12

DB13

DB14

DB15

RESET

IM2

IM1

MID(HIGH)

VCC1

VCC2

GND

DB0

Name

GND

LED(CA)

LED(AN)

VSYNC-OUT

I/O

GND

I/O

GND

I/O

Port

GND

Note

Ground

Ground for LED

Power Supply for LED

Frame Head Pulse Signal

Chip Select

Write Strobe

Read Strobe

Ground

Data Bus (Instruction & Display Data)

Reset

Interface mode select

Maker ID (HI : VCC2 level)

Power Supply for Analog Circuit

Interface I/O Power

Ground

Table. Interface between 2M Camera Module and Main Board (in camera module

Only for training and service purposes

- 75 -

LGE Internal Use Only

3. TECHNICAL BRIEF

3.15 Bluetooth

KS10 supported bluetooth, which is possible to data file transfer, BT headset call.

CPU (STn8810) interfaces with bluetooth one chip module (U401) which includes RF and baseband.

The STLC2500C is a single chip ROM-based Bluetooth solution for applications requiring integration up to HCI level.

The STLC2500C's main interfaces are UART for HCI transport between CPU (STn8810) and bluetooth module, PCM for voice between audio codec.(WM8753) and bluetooth module and GPIOs for control purposes. Voice data is transferred to CPU(STn8810) through audio codec.(WM8753).

The radio has been designed specifically for single chip requirements and for low power consumption.

Radio signal from bluetooth antenna (ANT400) is transferred to bluetooth module through BALUN filter

(FL400). Bluetooth module has its’ own oscillator (X400, 27MHz) for normal operation and use sleep clock(32.768KHz) from PM6650, PMIC of MSM 6275.

■ Bluetooth™ specification compliance: V1.2

■ Transmit Power : Power Class2

■ Ultra low power architecture with 3 different low power levels:

- Sleep Mode

- Deep Sleep Mode

- Complete Power Down Mode

LGE Internal Use Only

Figure. Diagram of STLC2500C

- 76 -

Only for training and service purposes

3.16 Main Features

3.16.1. Main features of KS10

- Slide Type

- WCDMA(2100) + GSM(900,1800) + PCS(1900) Triple mode

- Main LCD: 320*240, 262K (2.4”)

- 2.0M Pixel CMOS Camera

- VGA CMOS Camera

φ17 speaker

- Stereo Headset

- Video telephony in WCDMA with camera

- HSDPA up to 1.8Mbps

- Loud Speaker phone(in GSM and WCDMA)

- 64 Poly Sound

- MP3/AAC/WMA decoder and play

- MPEG4 encoder/decoder and play/save

- H.263 decoder

- JPEG en/decoder

- Support Bluetooth, USB

- 104 x 52 x 18.9 mm

- 950mAh hard pack

3. TECHNICAL BRIEF

Only for training and service purposes

- 77 -

LGE Internal Use Only

3. TECHNICAL BRIEF

2. Main Components of KS10

MAIN Top Side MAIN Bottom Side

KEY Top Side

VGA camera

1.3M camera

Speaker

Intenna

LCD FPCB

KEY Bottom Side

LCD

LGE Internal Use Only

- 78 -

Only for training and service purposes

3. TECHNICAL BRIEF

2. 1

Main Top Side

U207

U406

U403

U404

U402

U701

U306

Side Key

Reference

U207

U406

U403

U404

U402

U701

U306

Description over voltage protection IC

Analog Switch

Analog Switch Multiplexer

Key Coder IC hall-effect switch IC

MCP Memory

LDO Regulator

Reference

X200

FL203

FL206

CN201

U508

U700

X500

X700

Description

27MHz OSCILLATOR

EMI_ESD FILTER

B To B CONNECTOR

RF Receiver(RFR6250E)

PMIC for MSM

TCXO 19.2MHz

TCXO 32.768kHz

Only for training and service purposes

- 79 -

LGE Internal Use Only

X200

FL203

FL206

CN201

U508

Side Key

U700

X500

X700

3. TECHNICAL BRIEF

2.2. Main Bottom Side

S300

Reference

CN200

SW500

CN402

FL500

U506

U505

U500

FL400

J300

U401

X400

U400

S300

CN200

SW500

FL500

U506

U505

U500

CN402

FL400

J300

U401

X400

U400

CN202

U501

CN203

BAT700

U208

U502

U202

U600

X100

U100

U310

L301

MIC200

Description

B To B CONNECTOR

RF SWITCH CONNECTOR

JTAG-JIG-FPCB-CON

FILTER, SAPERATOR

DUPLEXER, GSM

PAM _power amplifier module

RF Transceiver (RTR6250D)

SAW FILTER _BPF

USIM Connector

Bluetooth Single Chip

19.2MHz Oscillator

LDO Regulator

Micro-SD CONNECTOR

Reference

CN202

U501

CN203

BAT700

U208

U502

U202

U600

X100

U100

U310

L301

MIC200

Description

Connector(I/O, Ear jack, Power)

GSM/EDGE Quadband PAM

Battery Connector

Back up Battery

AUDIO AMPLIFIER

Voltage Controlled Oscillator

Audio Codec.

MSM6275 (Modem BB Chip)

19.2MHz Oscillator

STN8810S12B2V1 (CPU)

PMIC for CPU

Power Inductor

Microphone

LGE Internal Use Only

- 80 -

Only for training and service purposes

3. TECHNICAL BRIEF

2.3. KEY Top Side

SW100

2.4. KEY Bottom Side

CN100

U100

CN101

Reference

SW100

CN100

Description

Dome Switch

LCD Connector

Reference

U100

CN101

Description

LCD Backlight Driver

FUNCTION-SLIDER Connector

(FPCB to KEYPCB)

Only for training and service purposes

- 81 -

LGE Internal Use Only

3. TECHNICAL BRIEF

2.5. LCD FPCB

Vibrator PAD

CN100

Receiver

CN101

CN102

Reference

Vibrator

Receiver

CN100

Description

Vibrator PAD

Receiver PAD

VGA_CAMERA Connector

Reference

CN101

CN102

Description

FUNCTION-SLIDER

Connector (FPCB to KEYPCB)

MAIN-SLIDER CON-SOCKET

LGE Internal Use Only

- 82 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.1 RF Component

SW500

FL500

U504

U506

U507

U505

U503

U500

RF component (Bottom)

Reference

U505

U506

U503

FL500

U502

Description

WCDMA PAM

WCDMA Duplexer

WCDMA TX SAW

Front-End-Module

GSM TX VCO

Only for training and service purposes

- 83 -

U501

U502

Reference

U507

U501

U504

U500

SW500

Description

Coupler

GSM/D/PCS PAM

HDET

GSM/WCDMA Transceiver (RTR)

RF Antenna Connector

LGE Internal Use Only

4. TROUBLE SHOOTING

FL501

RF component (Top)

Reference

U508

FL501

Description

RFR6250(WCDMA RX)

WCDMA RX SAW

U508

LGE Internal Use Only

- 84 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.2 SIGNAL PATH

GSM/DCS/PCS Rx Tx PATH

A. GSM/DCS/PCS Tx PATH

B. GSM/DCS/PCS Rx PATH

Only for training and service purposes

- 85 -

LGE Internal Use Only

4. TROUBLE SHOOTING

WCDMA RX/ TX PATH

C. WCDMA Tx PATH

D. WCDMA Rx PATH

LGE Internal Use Only

- 86 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.3 Checking VCXO Block

The reference frequency (19.2MHz) from X100 (VCXO) is used WCDMA TX part, GSM part and BB part.

Only for training and service purposes

- 87 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Check 1. Crystal part

If you already check this crystal part, you can skip check 1.

Test Point (Crystal Part)

TCXO_PM

RTR6250_TCXO

RFR6250_TCXO

VREG_TCXO_2.85V

TP3

C559 100p

C562 1000p

C563 1000p

C566

0.1uF

C567

1000p

TCXO

19.2MHz

OUT GND

VCC VCONT

X500

TP1

R525

100ohm

C564

0.01u

TP2

TRK_LO_ADJ

Schematic of the Crystal Part

LGE Internal Use Only

- 88 -

Only for training and service purposes

4. TROUBLE SHOOTING

TP1

AP_VDD_IO_1.8V

C153

0.1u

REQUEST_MC

X100

VDD

CSC3M192000EEVRS00

OUT

TRI_OPEN GND

19.2MHz

TP1

PWREN

AU_CLK_EN

AP_VDD_IO_1.8V

0.1u

C151

VCC

U101

C152

GND

NL17SZ08XV5T2

AP_VDD_IO_1.8V

0.1u

C154

VCC

U103

GND

NL17SZ08XV5T2

Schematic of the Crystal Part (19.2MHz)

CPU_19.2M

AU_19.2M

Only for training and service purposes

- 89 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Check TP1

VCC of VCXO

≥

Yes

Check TP2

TRK_LO_ADJ

≥

Voltage

≥

Yes

Check TP3

With Oscilloscope

19.2MHz Signal

Yes

VCXO is OK

Check other part

Check PMIC

Check MSM

Check soldering and components

LGE Internal Use Only

- 90 -

Only for training and service purposes

4.4 Checking Ant. Switch Module Block

4. TROUBLE SHOOTING

C500

L502

C502

SW500

KMS-512 C501

L504

56nH

56p

ANT500

ANT501

ANT_SEL0

ANT_SEL1

ANT_SEL2

VREG_RFR_2.85V

C509

47p

C510

47p

L514 7.5nH

C511

47p

C519

47p

C520

0.1u

ESHS-L090UB

GND1

GND2

GND3

GND4

GND5

GND6

VC1

VC2

VC3

FL500

EGSM_RX1

EGSM_RX2

DCS_RX1

DCS_RX2

PCS_RX1

PCS_RX2

DCS_PCS_TX

EGSM_TX

UMTS_TX_RX

Schematic of the Antenna Switch Block

C507

1.5nH

C512

C513

WCDMA_2100

Only for training and service purposes

- 91 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Logic Table of the Antenna Switch

Mode

EGSM TX

EGSM RX

DCS/PCS TX

DCS RX

PCS RX

UMTS

ANT_SEL0

High

Low

Checking Switch Block power source

Check Soldering of

ANT_SEL0, 1, 2 High Level

ANT_SEL1

Low

High

Low

High

Low

2.5V < Voltgae < 3.0V

YES

Check the Logic in each mode

NO

Check VCC

TP1 VREG_RFRX_0_2.85V

ANT_SEL2

Low

High

Low

LGE Internal Use Only

- 92 -

Only for training and service purposes

4.5 Checking WCDMA Block

START

1. Check VCXO 19.2MHz

2. Check ANT. SW Module

ANT_SEL0, 1, 2

3. Check RF Tx Level

4. Check PAM Block

5. Check RF Rx Level

6. Re-download SW & CAL.

4. TROUBLE SHOOTING

2

3.4

5

1

Only for training and service purposes

- 93 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.5.1 Checking VCXO Block

Refer to 3.3

4.5.2 Checking Ant. SW module

Refer to 3.4

4.5.3 Checking RF TX Level

TP1

TP2

TP3

TP4

Test Point (RF TX Level)

LGE Internal Use Only

- 94 -

Only for training and service purposes

4. TROUBLE SHOOTING

C500

L502

C502

SW500

KMS-512

TP1

ANT500

ANT501

ANT_SEL0

ANT_SEL1

ANT_SEL2

C501 56p

L504

56nH

VREG_RFR_2.85V

C509

47p

C510

47p

L514 7.5nH

C511

47p

C519

47p

C520

0.1u

ESHS-L090UB

GND1

GND2

GND3

GND4

GND5

GND6

VC1

VC2

VC3

FL500

EGSM_RX1

EGSM_RX2

DCS_RX1

DCS_RX2

PCS_RX1

PCS_RX2

DCS_PCS_TX

EGSM_TX

UMTS_TX_RX

C507

1.5nH

C512

C513

TP2

WCDMA_2100

TP4

WCDMA

C560 1.8nH

U503

L525

8.2nH

OUT

5 2

L526

3.9nH

C561

22p

WCDMA_2100_TX_OUT

WCDMA_2100

ACMD-7601 U506

RX TX

+VPWR

TP3

C568

22u

C570

0.01u

C571

0.01u

R530

3.9nH

1.2p

L527

C575

1.8nH

C580

C581

12p

GND2

GND3

RFOUT

GND4

VCC2

GND5

AWT6277R

VREF

VMODE

GND1

RFIN

VCC1

U505

R529 6.2K

C569

15p

W_VMODE_N

C573

0.1u

C574

100p

Only for training and service purposes

- 95 -

LGE Internal Use Only

4. TROUBLE SHOOTING

For testing, Max power output is needed.

Set the Phone Tx is ON and PDM is 450

Check TP1

Over 21dBm ?

Check TP2

Over 19dBm ?

Check TP3

Over 15dBm ?

Check TP4

Over -5dBm ?

Change the board

YES

RF Tx Level is OK

Check FEM

Check Duplexer

Check PAM Block

Refer to 3.5.4

LGE Internal Use Only

- 96 -

Only for training and service purposes

4.5.4 Checking PAM Block

PAM control signal

PA_ON : WCDMA Tx Power Detect IC(HDET) Enable

PA_RO: WCDMA Tx Power Amp Gain Control

4. TROUBLE SHOOTING

PAM_OUT

PAM_IN

PA_ON must be HIGH(over 2.5V)

PA_FET_N must be LOW if the max Tx power is set (lower than 0.5V)

Only for training and service purposes

- 97 -

LGE Internal Use Only

4. TROUBLE SHOOTING

PAM IN/OUT Signal

PAM_OUT

PAM_IN

PAM OUT must be over 15dBm

PAM IN must be over -5dBm

LGE Internal Use Only

- 98 -

Only for training and service purposes

4. TROUBLE SHOOTING

WCDMA

WCDMA_2100

ACMD-7601 U506

RX TX

+VPWR

C581

12p

TP1

C560 1.8nH

L525

8.2nH

U503

OUT IN

5 2

L526

3.9nH

C561

22p

WCDMA_2100_TX_OUT

C568

22u

C570

0.01u

C571

0.01u

R530

3.9nH

1.2p

L527

C575

1.8nH

C580

GND2

GND3

RFOUT

GND4

VCC2

GND5

AWT6277R

VREF

VMODE

GND1

RFIN

VCC1

U505

TP3

R529 6.2K

C569

15p

W_VMODE_N

C573

0.1u

C574

100p

TP2

ILNA_OUT

Only for training and service purposes

- 99 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.5.5 Check RF Rx Level

BOTTOM

TP1

TP2

TOP

TP4 TP 3

Test Point (RF Rx Level)

BIAS

LGE Internal Use Only

- 100 -

Only for training and service purposes

4. TROUBLE SHOOTING

C500

L502

C502

SW500

KMS-512

C501

L504

56nH

56p

ANT500

ANT501

ANT_SEL0

ANT_SEL1

ANT_SEL2

VREG_RFR_2.85V

C509

47p

C510

47p

L514 7.5nH

C511

47p

C519

47p

C520

0.1u

TP1

ESHS-L090UB

GND1

GND2

GND3

GND4

GND5

GND6

VC1

VC2

VC3

FL500

EGSM_RX1

EGSM_RX2

DCS_RX1

DCS_RX2

PCS_RX1

PCS_RX2

DCS_PCS_TX

EGSM_TX

UMTS_TX_RX

TP2

C507

1.5nH

C512

C513

WCDMA_2100

ACMD-7601 U506

RX TX

C581

12p

TP3

C568

22u

C570

0.01u

C571

0.01u

R530

3.9nH

1.2p

L527

C575

1.8nH

C580

GND2

GND3

RFOUT

GND4

VCC2

GND5

AWT6277R

VREF

VMODE

GND1

RFIN

VCC1

U505

C586

1.2p

BIAS

VREG_RFR_2.85V

C587

680p

C594

0.1u

C595

10p

C598

0.1u

C599

100p

ILNA_OUT

C573

0.1u

C574

100p

VOPS VRMS

ADL5500 U504

C572

1500p

HDET1

PLNA_OUT

ILNA_OUT

PLNA_BIAS

PLNA_IN

ILNA_BIAS

ILNA_IN

VDDRF3

RX_IP

RX_IM

RX_QP

RX_QM

VDDA2

RX0_Q_M

RX0_Q_P

RX0_I_M

RX0_I_P

R535

CP2_OUT

C800

100p

C585

100p

(1%)

PGND

GLNA_BIAS

GLNA_IN

R_BIAS

VDDA8

SBST

SBDT

SBCK

VDDM

GRX_IP

GRX_IM

GRX_QP

GRX_QM

R532

11.3K

C592

100p

C593

4.7u

C597

100p

TP4

ILNA_OUT

L530

2.2nH

FL501

B7827

5 4

L529

33nH

L528

2.7nH

IMT_RX_P

L531

2.7nH

IMT_RX_M

Only for training and service purposes

- 101 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Set the Phone Rx is ON

Check BIAS

Over 2V ?

YES

Check TP1

Signal exist?

YES

Check TP2

Signal exist?

YES

Check TP3

Signal exist?

YES

Check TP4

Signal exist?

YES

Change the board

Check bias block soldering

Check RF s/w

Check FEM

Check Duplexer

Check RFR6250

LGE Internal Use Only

- 102 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.6 Checking GSM Block

Start

1. Check TXVCO Block

2. Check ANT.SW

Module

3. Check TX PAM Block

4. Check RF RX Level

4. Re download SW & CAL

Only for training and service purposes

- 103 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.6.1 Checking VCO Block

GSM_PA_RAMP

R513

VBATT

C543

22u

TP2

TP1

R516 15

R518 15

R522

270

R523

270

R520

220

R521

220

R524

R507 100

(1%)

C537

120p

R510

100

(1%)

R508 0

(1%)

C535

330p

C539

5.6n

ECHU1C562JX5

GSM900_I

VDDA11

TX_MOD_

VDDA12

TX_VCO_F

C541 82p

MQW5V0C869M

OUT_GSM

OUT_DCSPCS

U502

SW1

SW2

GND5

GND6

GND7

GND8

GND1

GND2

GND3

GND4

TP3

VREG_MSMP_2.7V

TP5

TX_ON

R514 100ohm

C545

0.01u

FB502

C554

33p

C553

4.7u

tcc_1608h_9_r

C556

15p

C555

0.1uF

C557

15p

C546

1000p

C547

100p

VREG_RFTX_2.85V

R517 100ohm

R519 100ohm

GSM_TX_VCO_0_EN_N

GSM_TX_VCO_1_EN_N

TX VCO CONTROL LOGIC

TP5 TP4

GSM850/900

DCS1800/PCS1900

NO OSCILLATION

HIGH

LOW

HIGH

LOW

HIGH

TP4

LGE Internal Use Only

- 104 -

Only for training and service purposes

4. TROUBLE SHOOTING

Only for training and service purposes

- 105 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.6.2 Checking Ant. SW Module

Refer to chapter 3.4

4.6.3 Checking RF Tx level

ANT500

ANT501

ANT_SEL0

ANT_SEL1

ANT_SEL2

C500

L502

SW500

KMS-512

C502

TP1

C501 56p

L504

56nH

VREG_RFR_2.85V

C509

47p

C510

47p

L514 7.5nH

C511

47p

C519

47p

C520

0.1u

TP2

C528

ANTENNA SWITCH MODULE LOGIC

GSM900 TX

DCS/PCS TX

PCS RX

UMTS 2100

DCS RX

GSM 900 RX

IN_A

HIGH

LOW

IN_B

LOW

HIGH

LOW

IN_C

LOW

HIGH

LOW

HIGH

LOW

L523

22nH

C530

33p

ESHS-L090UB

GND1

GND2

GND3

GND4

GND5

GND6

VC1

VC2

VC3

FL500

EGSM_RX1

EGSM_RX2

DCS_RX1

DCS_RX2

PCS_RX1

PCS_RX2

DCS_PCS_TX

EGSM_TX

UMTS_TX_RX

C529

TP3

C531

33p

L524

1.5nH

L522

18nH

GND6

GND5

VCC

GND4

GND3

GSM_OUT

U501

DCS_PCS_IN

TQM7M5003

TX_EN

VBATT

GND1

GND2

VRAMP

GSM_IN

C507

1.5nH

C512

C513

WCDMA_2100

C536

68p

R506

(1%)

2.2K

GSM_PA_BAND

GSM_PA_EN

LGE Internal Use Only

- 106 -

Only for training and service purposes

4. TROUBLE SHOOTING

STAR

Check TP1

If GSM over 31dBm ?

If DCS/PCS over 28dBm ?

Check TP2, TP3

If TP2 over 29dBm ?

If TP3 over 25dBm ?

YES

GSM/DCS/PCS

Tx is Ok

Check other part

Check ANT. SW

Module

Refer to chapter 3.4

Check PAM Block

OK ?

Refer to chapter 3.6.4

Check Soldering of

PAM (U101)

If problems stiil exist, replace

PAM.

YES

Problems resolved?

YES

Check TXVCO

Refer to chapter 3.6.1

GSM/DCS/PCS

Tx is OK

Change the Board

Only for training and service purposes

- 107 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.6.4 Checking PAM Block

PAM Control Signal

TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc <

2.6V,

TP2. GSM_PA_EN : Power Amp Enable

(Power ON : higher than 2.5V , Power OFF : lower than 0.7V)

TP3. +VPWR : PAM Supply Voltage Vcc higher than 3.28V

C530

33p

C531

33p

L524

1.5nH

L522

18nH

GND6

GND5

VCC

GND4

GND3

GSM_OUT

GND2

U501

DCS_PCS_IN

TQM7M5003

TX_EN

VBATT

GND1

VRAMP

GSM_IN

TP1

C536

68p

R506

(1%)

2.2K

C544

100p

TP3

R513

C543

22u

GSM_PA_BAND

GSM_PA_EN

GSM_PA_RAMP

VBATT

TP2

R516 15

R522

270

R518 15

R523

270

R520

220

R521

220

R524

LGE Internal Use Only

- 108 -

Only for training and service purposes

4.6.5 Checking RF Rx Block

4. TROUBLE SHOOTING

L507

5.1nH

L513

5.1nH

L508

7.5nH

DCS Band Rx

1805-1880 MHz

C514

1000p

L511

7.5nH

L516

10nH

GSM Band Rx

925-960 MHz

L520

10nH

L517

9.1nH

L519

9.1nH

C527

1000p

L500

3.3nH

PCS Band Rx

1930-1990 MHz

L501

3.6nH

R507 100

(1%)

R508 0

(1%)

L510

3.3nH

FB500

VREG_RFTX_2.85V

C515

33p

CP2_OUT

UHF_LO_BUFF

C521

680p

(1%)

R501

4.3K

(change to 4.53k)

C526

6.8n

ECHU1C682JX5

R503 11.3K

(1%)

C525

0.01u

L505

3.6nH

C508 33p

C504

1000p

C516

33p

CP_HOLD2

CP2

VDDA9

RX_VCO_IN

R_BIAS

GSM1800_INN

GSM1800_INP

VDDA10

GSM900_INP

GSM900_INN

VDDA11

RTR6250D

U500

Only for training and service purposes

- 109 -

LGE Internal Use Only

4. TROUBLE SHOOTING

LGE Internal Use Only

- 110 -

Only for training and service purposes

4. TROUBLE SHOOTING

BB Trouble Shooting

4.7 Power on trouble

Power on sequence of KS10 is :

PWR key press

→ KEY_ON_SW_N go to low (D405, PM6650-1M KPDPWR_N pin#24) → PM6650-

1M Power Up

→ VREG_MSMC_1.375V(C735), VREG_MSME_1.8V(C736),

VREG_MSMP_2.7V(C730), VREG_MSMA_2.6V(C726), VREG_TCXO_2.85V(C710) power up

→

PON_RESET_N assert to MSM and PON assert to STn8810

→ VDD_IO_2.7V(C304),

VDD_IO_1.8V(C311),AP_VCORE(C314),AP_VPLL(C328),AP_VFUSE(C329) power up -> CPU and

Phone booting & PS_HOLD(D700) assert High to PMIC(PM6650-1M)

Start

Battery voltg. higher than 3.22V?

YES

Press PWR key

Keypad LED on?

YES

VA100 high to low when key press?

YES

Change or charging the

Battery

Follow the LED trouble shoot

Check open Pattern of power button

Change the Main board

YES

Is clock ok?

X100 : 19.2M

X600 : 32.768Khz

YES

Change the Main board

Check the TXCO

Only for training and service purposes

- 111 -

LGE Internal Use Only

4. TROUBLE SHOOTING

PS_HOLD(D700)

VDD_IO_2.7V(C304)

X100

VDD_IO_1.8V(C311)

AP_VFUSE(C329)

AP_VPLL(C328)

AP_VCORE(C314)

LGE Internal Use Only

- 112 -

Only for training and service purposes

4. TROUBLE SHOOTING

KEY_ON_SW_N (D405)

VREG_TCXO_2.85V(C710)

VREG_MSMA_2.6V(C726)

VREG_MSMP_2.7V(C730)

X500

X700

VREG_MSME_1.8V(C736)

VREG_MSMC_1.375V(C735)

Only for training and service purposes

- 113 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.8 USB trouble

USB Initial sequence of KS10 is :

USB connected to KS10

→ USB_VBUS_IN(VA205) go to 5V

→ USB_VBUS_EN go to high (Q702 Pin_2) → USB_VBUS(D701) go to 5V

→ USB_D+(VA202) go to 3.3V → 48M Crystal on → USB_DATA is triggered → USB work

Start

Cable is insert?

YES

USB_VBUS is about to 5V?

YES

USB_D+ is about to 3.3V?

YES

48MHz is run?

YES

Change the Main board

VA202 (USB_D+)

VA205(USB_VBUS_IN)

Cable insert

Check Q702, D701

USB cable

Check VA202

Check X600

D701(USB_D+)

X600(48MHz)

LGE Internal Use Only

- 114 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.9 SIM detect trouble

USB Initial sequence of KS10 is :

VREG_USIM_2.85V(C739 of PM6650) go to 2.85V

→ USIM clock, reset and data triggered

→ USIM IF work (Schematic and place are refer to SIM technical brief)

Start

Re-insert the SIM card

Work well?

VREG_USIM_2.85V is 3.0V?

USIM_P_CLK is run?

YES

Change SIM card

Yes

Work well?

Change the Main board

Yes

End

Check J300, C739,

VA300,VA301,

VA302,VA303

End

VA300 (USIM_P_DATA)

C739 (VREG_USIM_2.85V)

J300

VA303 (VREG_USIM_2.85V)

VA302(USIM_P_RST_N) VA301 (USIM_P_CLK)

Only for training and service purposes

- 115 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.10 Key sense trouble

Key Sense sequence of KS10 is :

Default condition ROW(0-3) is 2.7V

→ Press the key → Corresponding ROW(x) and COL(x) go to

→ Key sensing by key coder IC (U404) → Key coder IC send the key information to CPU by I2C interface

START

Check the RA400 with no key press

ROW(0-4) is 2.7V?

Yes

Check the RA400 with key press

Check RA400

ROW(0-4),

COL(0-4) is 0V?

Change the side key

Yes

Check Metal

DOME SHEET

Sub & Main board

Side Key

Work well?

Change FPCB

YES

Work well?

YES

Change Sub board

Work well?

YES

Check R414, 415, C418,TP407,TP406

Work well?

Change the Main board

YES

End

Dome sheet

LGE Internal Use Only

- 116 -

Only for training and service purposes

4. TROUBLE SHOOTING

AP_VDD_IO_2.7V

TP406 TP407 C418

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

RA400

SW400

SW403

SW406

SW409

R414 R415 RA400 U404

KEY_ROW(0:3)

R414

AP_VDD_IO_2.7V

R414 R415

3.3K

R415

I2CSCL1

I2CSDA1

KEY_COL(4:7)

KEY_COL(4)

KEY_COL(5)

KEY_COL(6)

KEY_COL(7)

Wake_INP6

Wake_INP7

K_Out4

K_Out5

K_Out6

K_Out7

Gen_IO_2

Gen_IO_3

U404

LM8333GGR8_NOPB

K_Out3

K_Out2

K_Out1

K_Out0

_RESET

Int_Rx

WD_Out

Int_Tx

KEY_COL(3)

KEY_COL(2)

KEY_COL(1)

KEY_COL(0)

KEYCODER_RSTN

TP406

KEYCODER_INT

TP407

TP406

C418 C419

0.1u

TP407

C418

AP_VDD_IO_2.7V

KEY_COL(3:0)

Schematic of key sense part

Only for training and service purposes

- 117 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.11 Keypad backlight trouble

Key Pad Back Light is on as below :

Key pressing

→ STn8810 commend MSM6275 lighting the Key LED →

MSM 6275 KPD_DRV_N go to Low

→ LED On (Key Pad LED controlled by PM6650)

Start

Key press

AP_+VPWR is OK?

Yes

Signal KPD_DRV_N is Low?

Yes

Only Sub board LED is not work?

Some LED is not work?

Work well?

En d

Yes

Check device short :

LD400~407 and R402~412 (Main)

LD101~108 and R106~114 (Sub)

Change the main board

Check connection between Main and FPCB and between FPCB and Sub

Check device open :

LD400~407 and R402~412 (Main)

LD101~108 and R106~114 (Sub)

Change the main & Sub board

R400 (AP_+VPWR)

VA400 (KPD_DRV_N)

LD400~407 and R402~412 (Main)

LD101~108 and R106~114 (Sub)

LGE Internal Use Only

- 118 -

Only for training and service purposes

4. TROUBLE SHOOTING

Main

AP_+VPWR

LD400

R402 100ohm

SSC-TWH104-HLS

LD402

R405 100ohm

SSC-TWH104-HLS

LD404

R408 100ohm

SSC-TWH104-HLS

LD406

R411 100ohm

SSC-TWH104-HLS

R400 (AP_+VPWR)

LD401

R403 100ohm

SSC-TWH104-HLS

LD403

R406 100ohm

SSC-TWH104-HLS

LD405

R409 100ohm

SSC-TWH104-HLS

LD407

R412 100ohm

SSC-TWH104-HLS

KPD_DRV_N

VA400 (KPD_DRV_N)

VA400

EVL14K02200

LD400~407 and R402~412 (Main)

SUB

AP_+VPWR

KPD_DRV_N

LD100

R106 100ohm

SSC-TWH104-HLS

LD103

R109 100ohm

SSC-TWH104-HLS

LD105

R111 100ohm

SSC-TWH104-HLS

LD107

R113 100ohm

SSC-TWH104-HLS

LD101

R107 100ohm

SSC-TWH104-HLS

LD104

R110 100ohm

SSC-TWH104-HLS

LD106

R112 100ohm

SSC-TWH104-HLS

LD108

R114 100ohm

SSC-TWH104-HLS

LD102

SSC-TWH104-HLS

VA100

EVL14K02200

LD100~108 and R106~114 (Sub)

Schematic of keypad backlight part

Only for training and service purposes

- 119 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.12 Folder on/off trouble

Folder On/Off(Close/Open) is worked as below :

Folder On/Off Event

→ Flip(U402 pin 1,key board) is triggered(Open : about 2.7V, Close : 0V)

→ Key coder IC(U404) sense the Folder Flip Event → Key coder IC send the key information to CPU by I2C interface

Start

Check the magnet in folder Assy

Yes

Approach the magnet to U402

Insert the magnet

YES

FLIP(U402p in 1) is 0V?

Yes

Work well?

Check R414, 415, C418,TP407,TP406

Check the U402

And check the R413 for AP_VDD_IO_2.7V

Change the Main Board

Work well?

Yes

End

C418

TP407

TP406

R414

RA400

R415

U404

U402

R413 magnet

LGE Internal Use Only

- 120 -

Only for training and service purposes

4. TROUBLE SHOOTING

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_ROW(0:3)

R414

AP_VDD_IO_2.7V

R415

R414 R415

3.3K

I2CSCL1

I2CSDA1

KEY_COL(4:7)

KEY_COL(4)

KEY_COL(5)

KEY_COL(6)

KEY_COL(7)

Wake_INP6

Wake_INP7

K_Out4

K_Out5

K_Out6

K_Out7

Gen_IO_2

Gen_IO_3

U404

LM8333GGR8_NOPB

U404

C418 C419

0.1u

AP_VDD_IO_2.7V

K_Out3

K_Out2

K_Out1

K_Out0

_RESET

Int_Rx

WD_Out

Int_Tx

KEY_COL(3)

KEY_COL(2)

KEY_COL(1)

KEY_COL(0)

KEYCODER_RSTN

TP406

KEYCODER_INT

TP407

TP406

TP407

KEY_COL(3:0)

C418

AP_VDD_IO_2.7V

RA400

SW400

SW403

FOLDER_DETECT

SW406

SW409

R413

AP_VDD_IO_2.7V

R413

100K

C413

U402 A3212EEH-T

OUTPUT VDD

NC1

U402

GND1

NC2

GND2

PGND

EUSY0200301

C414

0.1u

FOLDER_SENSE

Schematic of Folder on/off part

Only for training and service purposes

- 121 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.13 Micro SD trouble

Micro SD is worked as below :

Micro SD insertion

→ Card Detect (SD_INT) goes to low → STn8810 detect SD_INT and assert VMMC_3.1V by STw4810

→ go working

Start

Insert the Micro SD Card

Does the micro SD icon appears ?

YES

Work well?

YES

End

SD_INT(C343,NA) is be low ?

YES

Check VMMC_3.1V is over 2.85V?

YES

Check the Pull up resistor

R309, R310,R311,R313,R314

Change the main board

R313

R314

C339 (VMMC_3.1V)

R311 R309

R310

C343 (SD_INT)

LGE Internal Use Only

- 122 -

Only for training and service purposes

4. TROUBLE SHOOTING

SD_DAT(1)

SD_DAT(0)

SD_CLK

SD_CMD

SD_DAT(3)

SD_DAT(2)

R311

R309

R310

R313

R314

VMMC_3.1V

C339

S300

GCC110-8S-R-E1000

GND SWB SWA

GND

C339 (VMMC_3.1V)

C343

SD_INT

C343 (SD_INT)

Schematic of Micro SD

Only for training and service purposes

- 123 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.14 Charging trouble

Charging Current Flow

4.2~4.25V

6 5 4

1 2 3

USB Cable

(5.0V)

USB_VBUS

USB Charging control

Charging current sensing

Q700

ICHARGE

Route as equal length as possible! -> ICHARGE, ICHARGEOUT

ICHARGEOUT

2012

Main

Battery

+VPWR

VBATT

Q602

Q700

QST4

Pass control Tr

(ON)

USB_CTL_N

Q701

Q701

NC1

NUS5530MN

Drain_B

Collector_B

Collector Emitter

Source Base

Drain NC2

Gate

TA Charging control

+5V_PWR

CHG_CNT_N

BATT_FET_N

(4.6V)

Pass control Tr

(ON)

Battery FET

(ON)

Battery charging circuit !!!!!

Battery charging control

• Charging Procedure

- Connecting TA or USB Cable

- Control the charging current by PM6650-1M IC using USB_CNT_N or CHG_CNT_N signal

- Charging Current flows into the battery by control BATT_FET_N

• Check Point

- Connection of TA or USB Cable

- Charging current path

- Battery

• Trouble Shooting Setup

- Connect TA or USB Cable and battery to the phone

• Trouble Shooting Procedure

- Check the charger connector

- Check the charging current path

- Check the battery

LGE Internal Use Only

- 124 -

Only for training and service purposes

4. TROUBLE SHOOTING

Start

Check the pin and battery

Connect terminals of I/O connector

Connection OK?

Yes

Is the TA voltage 4.8V?

Is the USB voltage 5.0V?

Yes

Check the Q700,Q701

Yes

Charging OK?

Change the board

Yes

Change I/O connector

Change TA/USB cable

END

Only for training and service purposes

- 125 -

LGE Internal Use Only

4. TROUBLE SHOOTING

VBAT

Q701

GND

Q700

LGE Internal Use Only

- 126 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.15 Audio trouble

4.15.1 Receiver path

Voice Receiver path as below:

MSM6275A Ear1ON/Ear1OP

→ U202(audio codec) → CN201(b’d to b’d connector for LCD Module)

→ CN102(LCD b’d to b’d connector of LCD FPCB) → R100, R101 → Receiver

Start

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out

Hear the tone to the receiver?

Change the Receiver

YES

END

The sine wave appear at

C225,C226?

YES

The sine wave appear at

R211,C212?

YES

The sine wave appear at

R100,R101 of LCD FPCB?

Check connector pin or change the LCD FPCB

YES

Change the Main board

Check the U202 or

Change the Main board

Check the pads of Receiver

Can you hear the tone?

END

YES

Only for training and service purposes

- 127 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Receiver pads

R100, R101 Receiver

LCD connector

R211, R212

C225, C226

LGE Internal Use Only

- 128 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.15.2 Voice path for headset

Voice path for Head_Set as below:

MSM6275A HPH_R, HPH_L

→ C222,C224 U202(audio codec) → FB702, FB704 → C242,C244

→ #4, #5 pin of CN202 headset Jack

Start

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out

And insert head_Set

Headset insertion detection in the Main LCD Display OK?

Check #8 pin of CN202 or change the Main b'd

YES

The sine wave appear at

C222,C224 ?

Change the Main board

YES

The sine wave appear at

C242,C244 ?

YES

Can you hear the tone?

YES

END

Check the U202 or change the Main b'd

Check the CN202 or change the Main b'd

Only for training and service purposes

- 129 -

LGE Internal Use Only

4. TROUBLE SHOOTING

C242

C244

CN202

C242

C244

LGE Internal Use Only

Schematic of voice path

- 130 -

Only for training and service purposes

4. TROUBLE SHOOTING

U202

C222

C222 C224

WM_DVDD WM_AVDD

WM_HPH_R

WM_HPH_L

WM_RXP

WM_RXN

WM_MIC1N

WM_MIC1P

WM_MIC2N

WM_MIC2P

WM_MICBIAS

C222 1u

C224

C225

C226

C224

LINE1

LINE2

RXP

RXN

ACIN

ACOP

MIC1N

MIC1

MIC2N

MIC2

MICBIAS

C234

4.7u

U202

WM8753LEB-RV

C235

4.7u

C236

4.7u

AU_19.2M

WM_AVDD WM_DVDD

Schematic of voice path

OUT4

OUT3

LOUT1

MONO2

MONO1

C229

C230

ROUT1

LOUT2

ROUT2

WM_MONO2

WM_MONO1

WM_ROUT1

WM_LOUT2

WM_ROUT2

100K R213

100K R214

100K R215

Only for training and service purposes

- 131 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.15.3 Sound path for headset

Multimedia Sound path for Head_Set as below:

STN8810(msptxd0)

→ U202(audio codec) → C242,C244 → #4,#5 pin of CN202 headset Jack

Start

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out

And insert head_Set

Headset insertion detection in the Main LCD Display OK?

Check #8 pin of CN202 or change the Main b'd

YES

The sine wave appear at

C242,C244 ?

YES

Can you hear the tone?

YES

END

Check the U202 or change the Main b'd

Check the CN202 or change the Main b'd

CN202

FB503 1000

FB245

CN202

C242, C244

100K R219

R222 68

R223 68

C242 33u

C244 33u

1608 1

U205

OUT

C241

C240

WM_MIC2N

WM_MIC2P

WM_LOUT1

WM_ROUT1

USB_D+

USB_D-

EAR_SENSE_N

VBATT

REMOTE_PWR_ON

+5V_PWR

LGE Internal Use Only

- 132 -

Only for training and service purposes

4. TROUBLE SHOOTING

CN202

Headset connector

C242, C244

U202

Audio codec

C222, C224

Only for training and service purposes

- 133 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.15.4 Loud speaker path (voice speaker phone)

Loud speaker path as below:

MSM6275A HPH_R, HPH_L

→ C222,C224 → U202(audio codec) → C262,C267 → U208

(Speaker AMP)

→ pads of speaker → Speaker

Start

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out

Set phone with speaker phone mode

The sine wave appear at

C222,C224?

YES

The sine wave appear at

C262, C267?

YES

The sine wave appear at pads of speaker?

YES

Can you hear the tone?

Change the Main board

Check the U202 or

Change the Main board

Check the U208 and R229, R233

Change the speaker

END

YES

LGE Internal Use Only

- 134 -

Only for training and service purposes

4. TROUBLE SHOOTING

WM_HPH_R

WM_HPH_L

WM_RXN

C222

C224

C225

C226

LINE1

LINE2

RXP

RXN

ACIN

ACOP

MIC1N

C222, C224

U202

WM8753LEB-RV

WM_ROUT2

C262

0.068u

C262, C267 R229, R233

R229

10K

C261

R230 68K

SPK_AMP_EN

WM_LOUT2

C267

0.068u

R233

10K

C266

0.22u

U208 TPA6205A1DRBR

_SHUTDOWN VDD

BYPASS VO-

IN+

IN-

VO+

GND

PGND

R232 68K

C268 NA

SPKL-

SPKL+

Only for training and service purposes

- 135 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.15.5 Loud speaker path (VT, multimedia play, etc)

Loud speaker path (VT, multimedia play) as below:

STN8810(msptxd0)

→ U202(audio codec) → C262,C267 → U208 (Speaker AMP) → pads of speaker

→ Speaker

Start

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out

Set phone with speaker phone mode

The sine wave appear at

C262, C267?

YES

The sine wave appear at pads of speaker?

YES

Can you hear the tone?

END

YES

Check the U202 or

Change the Main board

Check the U208 and R229, R233

Change the speaker

LGE Internal Use Only

- 136 -

Only for training and service purposes

4. TROUBLE SHOOTING

U202

WM8753LEB-RV

MONO2

MONO1

C229

C230

ROUT1

LOUT2

ROUT2

WM_MONO2

WM_MONO1

WM_ROUT1

WM_LOUT2

WM_ROUT2

Audio Codec

WM_ROUT2

C262

0.068u

C262, C267 R229, R233

R229

10K

C261

R230 68K

SPK_AMP_EN

WM_LOUT2

C267

0.068u

R233

10K

C266

0.22u

U208 TPA6205A1DRBR

_SHUTDOWN VDD

BYPASS VO-

IN+ VO+

INGND

PGND

R232 68K

C268 NA

Speaker AMP

SPKL-

SPKL+

Only for training and service purposes

- 137 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Pads of Speaker

R711

C723

C722

U208 (Speaker Amp)

R229, R233

C262, C267

U202 (audio codec)

LGE Internal Use Only

- 138 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.15.6 Microphone for main MIC

Main Microphone path as below:

MIC

→ C245,C248 → U202(audio codec) → C229,C230 → MSM6275A →

MIC feed back gain logic

→ MSM internal CODEC

WM_DVDD

R221

C245,C248

MIC200

SUMY0009203

WM_MICBIAS

WM_MIC1P

C245 1u

C246

39p

C247

10p

C251

39p

C248 1u

C252

39p

WM_MIC1N

WM_HPH_R

WM_HPH_L

WM_RXP

WM_RXN

WM_MIC1N

WM_MIC1P

WM_MIC2N

WM_MIC2P

WM_MICBIAS

C222

C224

C225

C226

LINE1

LINE2

RXP

RXN

ACIN

ACOP

MIC1N

MIC1

MIC2N

MIC2

MICBIAS

C234

4.7u

WM_AVDD

U202

WM8753LEB-RV

[audio codec]

C235

4.7u

C236

4.7u

[main MIC]

AU_19.2M

WM_AVDD WM_DVDD

C229,C230

OUT4

OUT3

LOUT1

MONO2

MONO1

C229

C230

ROUT1

LOUT2

ROUT2

WM_MONO2

WM_MONO1

WM_ROUT1

WM_LOUT2

WM_ROUT2

100K R213

100K R214

100K R215

Start

Make a call

MIC_BIAS(C102) is 2.7V?

YES make some sound or voice to MIC

Can you scoping some sound signal at C245,C248?

Change the Main B'd

Change the MIC

Can you scoping some sound signal at C229,C230?

YES

Work well?

YES

END

Check the U202 or

Change the Main B'd

L600

100nH

C600

10p

C607

0.1u

10%

Place near

MSM pin W18

(CODEC VSS)

C608 C609 C610 C611

NA NA NA NA

SDCC_DAT1_GPIO99

SDCC_DAT2_GPIO100

F25

M25

M26

[MSM6275A]

Only for training and service purposes

- 139 -

LGE Internal Use Only

4. TROUBLE SHOOTING

C245, C248

MIC200 (MIC for Handset)

C229, C239

LGE Internal Use Only

- 140 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.15.7 Microphone for headset

MIC for Head_Set path as below:

Insert Headset

→ EAR_SENSE_N(pin8) go 0V → MSM6275A and STN8810 sense Head_Set insertion

→ MIC signal → U202(audio codec) → MSM6275.

CN202

C240,C241

FB503 1000

FB245

R222 68

R223 68

C242 33u

C244 33u

1608

R225 NA

AP_VDD_IO_1.8V

C239

10p

C237

10u

R217

2.2K

100K R219

U205

OUT

G1 G2

NFM21PC105B1A3

R216

USB_VBUS_IN

UART_TXD

UART_RXD

C238

0.1u

VIN-

VIN+

VCC

GND

OUT

U203

NCS2200SQ2T2G

R218

330K

C240 1u

C241 1u

WM_MIC2N

WM_MIC2P

WM_LOUT1

WM_ROUT1

USB_D+

USB_D-

EAR_SENSE_N

VBATT

REMOTE_PWR_ON

+5V_PWR

R224

470K

HOOK_SENSE

CONNECTOR VBATT_SENSE PIN CHECK!!

VBATT_SENSE

VREG_MSMP_2.7V

C253

33u

CN203

VBAT_TEMP

C260

0.1u

[CN202(headset connector)]

WM_DVDD WM_AVDD

WM_HPH_R

WM_HPH_L

WM_RXP

WM_RXN

C222

C224

C225

C226

WM_MIC1N

WM_MIC1P

WM_MIC2N

WM_MIC2P

WM_MICBIAS

LINE1

LINE2

RXP

RXN

ACIN

ACOP

MIC1N

MIC1

MIC2N

MIC2

MICBIAS

U202

WM8753LEB-RV

[audio codec]

C234

4.7u

C229,C230

OUT4

OUT3

LOUT1

MONO2

MONO1

C229

C230

WM_MONO2

WM_MONO1

ROUT1

LOUT2

ROUT2

WM_ROUT1

WM_LOUT2

WM_ROUT2

Start

Make a call

Try change the head set

EAR_SENSE_N is 0V?

YES

MIC_BIAS is 2.7V ?

YES make some sound or voice to MIC

YES

END

Change the Main b'd

Can you scoping some sound signal at C240,C241?

YES

Can you scoping some sound signal at C229,C230?

YES

Work well?

YES

END

Change the MIC

Check the U202 or

Change the Main B'd

L600

100nH

C600

10p

C607

0.1u

10%

Place near

MSM pin W18

(CODEC VSS)

C608 C609 C610

NA NA NA

C611

SDCC_DAT1_GPIO99

SDCC_DAT2_GPIO100

SDCC_DAT3_GPIO101

MDP_VSYNC_SECONDA_GPIO104

MDP_VSYNC_PRIMARY_GPIO105

F25

M25

M26

AE3

AD2

[MSM6275A]

Only for training and service purposes

- 141 -

LGE Internal Use Only

4. TROUBLE SHOOTING

C240

#8 pin of ear connector to check EAR_SENSE_N

C237

Capacitor to check MIC bias (2.7V)

C240

LGE Internal Use Only

- 142 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.16 Camera trouble

Camera control signals are generated by STN8810 and directly connected with STN8810.

KS10 has two cameras. The one is a 2 Mega Camera, the other is VGA camera.

2M START

Check the camera conn. and reconnect the camera

Camera is OK?

STN8810 output signal check

(2M_RSTn_CAM, CAM_PWR_EN))

Yes

Check AP_VDD_CAM_2.7V,

AP_VDD_CAM_1.8V

End

Change the LDO (U301, U303)

Yes

Check master clock

OSC X200 output

Yes

Check the CCIRCLK_CAM

(FL201 #2)

Yes

Change the OSC (X200)

Check the EMI/ESD filter

(FL201 #8)

Yes

Change the camera

Change the Filter (FL201)

Yes

End

Camera is OK

Change the Main board

Only for training and service purposes

- 143 -

LGE Internal Use Only

4. TROUBLE SHOOTING

2M_RSTn_CAM

CAM_PWR_EN

24MHZ OSC output

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

LGE Internal Use Only

FL201

- 144 -

Only for training and service purposes

4. TROUBLE SHOOTING

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

CCIRICLK_CAM

2M_RSTn_CAM

I2CSDA0_CAM

I2CSCL0_CAM

2M_PWDN

LOW

HIGH

Driven

Hi-Z

C207

2M_CAMERA

CN200

G3 G4

AXK7L34227

CCIRID(7)_CAM

CCIRID(6)_CAM

CCIRID(5)_CAM

CCIRID(4)_CAM

CCIRID(3)_CAM

CCIRID(2)_CAM

CCIRID(1)_CAM

CCIRID(0)_CAM

CCIRIVS_CAM

CCIRIHS_CAM

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

CSC3R270000BEVRS00 X200

OUT VDD

2 1

GND TRI_OPEN

27MHz

R207 100K

2M_RSTn_CAM

2M_RSTn_CAM

I2CSDA0_CAM

I2CSCL0_CAM

FL203

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

EVRC18S03Q015050R

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

2M_RSTn

I2CSDA0_SW

I2CSCL0_SW

C214

0.01u

CCIRIHS_CAM

CCIRIVS_CAM

CCIRICLK_CAM

CAMCLK_27MHZ_CAM

FL201 (#2)

CAM_PWR_EN

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

FL201

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

EVRC18S03Q015050R

CCIRIHS

CCIRIVS

CCIRICLK

CAMCLK_27MHZ

AP_+VPWR

AP_VDD_CAM_2.7V

24MHZ OSC output

U303

MIC5219-2.7YM5

IN OUT

GND

EN BYP

C305

CAM_PWR_EN

C306

470p

C307

2.2u

Only for training and service purposes

- 145 -

LGE Internal Use Only

4. TROUBLE SHOOTING

VGA START

Check the camera & 70-pin main conn.

And reconnect these connectors

Camera is OK?

STN8810 output signal check

(VGA_RSTn, VGA_STNADBY)

Yes

Check AP_VDD_CAM_2.7V,

AP_VDD_CAM_1.8V

Yes

Check master clock

(CAMCLK_27MHZ : R206)

Yes

Check the EMI/ESD filter

(FL201 #1)

Yes

Check the CCIRCLK

(R719)

Yes

End

Change the LDO (U301, U303)

Change the Filter (FL201)

Check the CCIRCLK (in FPCB)

(R104 in slider FPCB))

Yes

Change the camera

Change the slider FPCB

Yes

Camera is OK

Change the Main board

Yes

End

LGE Internal Use Only

- 146 -

Only for training and service purposes

VGA_STANDBY

R719 (CCIRICLK)

FL201

4. TROUBLE SHOOTING

VGA_RSTn

R104 (CCIRICLK)

AP_VDD_CAM_1.8V

AP_VDD_CAM_2.7V

Only for training and service purposes

- 147 -

CAMCLK_27MHZ

LGE Internal Use Only

4. TROUBLE SHOOTING

VGA_RSTn

R719 (CCIRICLK)

CCIRIHS

VGA_RSTn

A0_CAM

L0_CAM

CCIRICLK

15050R

MAIIN-SLIDER CON-HEADER

CN201

G1 G2

R718

R719

RECEIVER+

RECEIVER-

RECEIVER--

MOT_PWR-

WLED_CTL

LCD_NRESET

FB224

VGA_STANDBY

FB221

FB223

FB230

FB233

R720

R721

R722

R723

R724

R725

R726

R727

R728

CAMCLK_27MH

FB225

FB229

FB232

FB235

FB227

FB231

FB234

FB236

VGA_STANDBY

CCIRIHS_CAM

CCIRIVS_CAM

CCIRICLK_CAM

CAMCLK_27MHZ_CAM

FL201 (#1)

MCAM_27M

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

FL201

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

EVRC18S03Q015050R

CCIRIHS

CCIRIVS

CCIRICLK

CAMCLK_27MHZ

R206 0

CAMCLK_27MHZ

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

CCIRIHS_CAM

VGA_RSTn

I2CSDA0_CAM

I2CSCL0_CAM

CCIRICLK_CAM

R104

R104 (CCIRICLK)

LGE Internal Use Only

AP_VDD_CAM_2.7V

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

CN102

G1 G2

VGA_CAMERA

CN100

AXK720145G

I2CSCL0_CAM

I2CSDA0_CAM

CCIRIHS_CAM

CCIRIVS_CAM

CCIRID(7)_CAM

CCIRID(6)_CAM

C102

VGA_RSTn

AP_VDD_CAM_1.8V

C100

0.1u

CAMCLK_27MHZ

C101

0.1u

Schematic of VGA camera part

- 148 -

Only for training and service purposes

4. TROUBLE SHOOTING

4.17 Main LCD trouble

Main LCD control signals are generated by STN8810. Those signal’s path are :

STN8810 -> 70-pin main connector(CN201 in main PCB) -> 70-pin connector (CN102 in slider FPCB)

-> 40-pin connector (CN101 in slider FPCB) -> 40-pin connector (CN101 in SUB PCB) -> LCD zip connector (CN100 in SUB PCB) -> LCD Module

START

Press END key to turn the power on

Is the circuit powered?

Yes

Disconnect and reconnect

70-pin , 40-pin B to B, and 35-pin zip connector

Follow the Power ON trouble shooting

Yes

LCD display OK?

Check AP_VDD_LCD_2.8V, LCD_NRESET,

LCD_DATA(0) in Main BD

Change the Main BD

Change the slider FPCB

& re-check

Yes

Change the SUB BD

Yes

Check the same signal in SUB BD

Yes

Display OK?

Change the LCD module

Yes

The LCD works

End

Only for training and service purposes

- 149 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Main BD

LCD_NRESET

SUB BD

LCD_NRESET

LCD_DATA(0) AP_VDD_LCD_2.8V

LCD_DATA(0)

AP_VDD_LCD_2.8V

LGE Internal Use Only

- 150 -

Only for training and service purposes

4. TROUBLE SHOOTING

CCIRIHS

VGA_RSTn

SDA0_CAM

CSCL0_CAM

CCIRICLK

3Q015050R

LCD_NRESET

VGA_STANDBY

MAIIN-SLIDER CON-HEADER

CN201

G1 G2

R718

R719

RECEIVER+

RECEIVER-

RECEIVER--

MOT_PWR-

WLED_CTL

FB224

FB221

FB223

FB230

FB233

R720

R721

R722

R723

R724

R725

R726

R727

R728

CCIRIVS

CCIRID(7)

CCIRID(6)

CCIRID(5)

CCIRID(4)

CCIRID(3)

CCIRID(2)

CCIRID(1)

CCIRID(0)

CAMCLK_27MHZ_CAM

FB225

FB229

FB232

FB235

FB227

FB231

FB234

FB236

AP_VDD_LCD_2.8V

AP_+VPWR

FB222

LCD_NRESET LCD_DATA(0)

AP_VDD_LCD_2.8V

AP_VDD_LCD_2.8V

R102

100K

LCD Connector

(lower contact)

R103 100K

R104 100K

CN100

R115 0

C105

820p

XF2B-3545-31A-P

LED1

LED2

LED3

LED4

LED_ANODE

LCD_VS

DIS_CSN

DIS_RS

DIS_WEN

LCD_DATA(0:15)

TP100

TP101

LCD_DATA(0)

LCD_DATA(1)

LCD_DATA(2)

LCD_DATA(3)

LCD_DATA(4)

LCD_DATA(5)

LCD_DATA(6)

LCD_DATA(7)

LCD_DATA(8)

LCD_DATA(9)

LCD_DATA(10)

LCD_DATA(11)

LCD_DATA(12)

LCD_DATA(13)

LCD_DATA(14)

LCD_DATA(15)

LCD_DATA(0)

LCD_NRESET

TP102

LCD_NRESET

Only for training and service purposes

Schematic of LCD part

- 151 -

LGE Internal Use Only

4. TROUBLE SHOOTING

4.18 Bluetooth trouble

Bluetooth control signals are generated by STN8810.

Those signal’s path are : STN8810

→ AP_VDD_IO_1.8V and AP_VDD_BT_2.7V is asserted →

CLK32K is asserted

→ Bluetooth ON → BT_RESETN is High CLK_REQ_OUT_1 is High →

REF_CLK_IN is asserted

→ transmit/receive data/control through UART → transmit/receive voice data through PCM I/F

AP_VDD_BT_2.7V

PON

AP_+VPWR

C402

AP_VDD_BT_2.7V

U400

GND

MIC5219-2.7YM5

OUT

BYP

C403

470p

C400

33u

URXD0

UCTS0N

X400

X400 CSC3M192000EEVRS00

VDD OUT

1 2

TRI_OPEN GND

19.2MHz

C401

0.1u

UTXD0

URTS0N

BT_RESETN

CLK32K

PCMCLK

PCMSYNC

PCMDATAIN

PCMDATAOUT

AP_VDD_IO_1.8V

AP_VDD_BT_2.7V

R715

TP400

R401

U401

RESET_N

REF_CLK_IN

LP_CLK

STLC2500C

BT_WAKEUP

CLK_REQ_OUT_1

UART_TXD

UART_RTS

UART_RXD

UART_CTS

PCM_CLK

PCM_SYNC

PCM_A

PCM_B

GPIO_16

GPIO_8

GPIO_9

GPIO_10

GPIO_0

CLK_REQ_IN_1

CLK_REQ_IN_2

HOST_WAKEUP

CONFIG_1

CONFIG_3

CONFIG_2

CLK_REQ_OUT2

TOUT_IP_QN

TOUT_IN_QP

GPIO_11

VSS_RF1

VSS_RF2

RFP

RFN

VSS_DIG1

VSS_DIG2

VDD_D

VDD_IO_A

VDD_IO_B

VDD_CLD

VDD_HV_A

VDD_HV_D

VSS_ANA1

VSS_ANA2

VSS_ANA3

VDD_DSM

VDD_N

VDD_CL

VDD_RF

AF_PRG

FL400

DEA212450BT-7043C1

FL400

BP1

BP2

U_BP

BP_DC

R404

ANT400

FEED

NC1

NC2

R404

Figure. Schematic of Bluetooth Interface

LGE Internal Use Only

- 152 -

Only for training and service purposes

4. TROUBLE SHOOTING

Bluetooth RF Test

TC-3000A (Bluetooth Tester)

1. Set phone to bluetooth test-mode:

Enter Test Mode(*#32*36907#)

→ Module Test Set → BT DUT → BT DUT ON

2. Connect phone to bluetooth tester

3. Set channel to 39

4. Measure output-power

5. Check TP1 : output-power > -6 dBm

Only for training and service purposes

- 153 -

LGE Internal Use Only

4. TROUBLE SHOOTING

Set the bluetooth ON

AP_VDD_BT_2.7V is asserted?

REF_CLK_IN is asserted?

RF Power (R404)

< -6 dBm?

Check FL400 soldering

Bluetooth is work well?

END

Check LDO

(U400) Pin#5

Check Oscillator

(X400)

Check BT Antenna

(ANT400) soldering

ANT400

R404

FL400

Change the main board

U400 X400

LGE Internal Use Only

- 154 -

Only for training and service purposes

5. DOWNLOAD

5.1 Composition omposition

5.1.1 PC OS

- Windows 2000(SP4) & Windows XP(SP2)

- RAM : 256M

- USB : 1.1 or 2.0

5.1.2 D/L Tool

- TA-25G

- 3G USB DLC

- USB HUB : Support 1.1 with 2.0

4 ~7 ports USB

Using the external power (Adaptor)

5.1.3 Program

- LGDP2 program: V32

5.1.4 Solution for KS10

- AP : Nomadik application processors

- MP : Qualcomm application processors

<TA-25G> <3G USB DLC> <USB Hub>

Only for training and service purposes

- 155 -

LGE Internal Use Only

5. DOWNLOAD

5.2 LGDP2 Program install LGDP2 Program install

5.2.1 The "LGDP2_for set-up zip" file is downloaded on CSMG site.

5.2.2 The "LGDP2_for set-up zip" file is unzip as same name in PC.

5.2.3 Select "First LGDP2_set-up" folder.

5.2.4 Open "serial_number" file.

5.2.5 Double click "LGDP2_31_INCLUDE_LGDP1_Setup" file.

LGE Internal Use Only

- 156 -

Only for training and service purposes

5.2.6 Click “Next” button.

5.2.7 Writing Serial number and then click “Next” button.

5. DOWNLOAD

5.2.8 Click “Install” button.

Only for training and service purposes

- 157 -

LGE Internal Use Only

5. DOWNLOAD

5.2.9 Click “Finish” button.

LGE Internal Use Only

- 158 -

Only for training and service purposes

5. DOWNLOAD

5.3 USB Driver setup USB Driver setup

5.3.1 Setup the USB driver for MP.

5.3.1.1 Select "LG USB Modem Driver 4"1".7(WHQL)" in "LGDP2_for set-up" folder.

5.3.1.2 Double click

“LGUSBModemDriver_WHQL_Eng_Ver_4.7”

Only for training and service purposes

- 159 -

LGE Internal Use Only

5. DOWNLOAD

5.3.1.3 Click “Next” button. 5.3.1.4 Click “OK” button.

LGE Internal Use Only

- 160 -

Only for training and service purposes

5. DOWNLOAD

5.3.2 Setup the KS10 USB driver for AP.

5.3.2.1 Copy "KS10_USB_20070426" folder in "LGDP2_for set-up" folder.

5.3.2.2 And then paste this folder on "DOWNLOAD" folder in

C driver as below picture.

Only for training and service purposes

- 161 -

LGE Internal Use Only

5. DOWNLOAD

5.4 KS10 LGDP2 run file & DLL file setup

5.4.1 Setup the KS10 run file & DLL file.

5.4.1.1 Copy "LGDP2_V32" file &

"Model" folder in "LGDP2_for setup" folder.

5.4.1.2 And then paste these file & folder on "DOWNLOAD" folder in C driver.

LGE Internal Use Only

- 162 -

Only for training and service purposes

5. DOWNLOAD

5.5 Execute LGDP2 program

5.5.1 Double click “LGDP2_V32” file in "DOWNLOAD" folder.

5.5.2 Click “LOGIN” button.

Only for training and service purposes

- 163 -

LGE Internal Use Only

5. DOWNLOAD

5.5.3 You choose the "UMTS" in "Division" Box

5.5.4 Click “OK” button.

LGE Internal Use Only

- 164 -

Only for training and service purposes

5. DOWNLOAD

5.5.5 Click “Operation(C)” on menu and then select “Config”.

5.5.6 Click “OK” button.

* Ignore these below message

5.5.7 Click “All” icon.

Only for training and service purposes

- 165 -

LGE Internal Use Only

5. DOWNLOAD

5.5.8 Choose the "KS10.DLL" file on "Model" folder in "Download" folder.

5.5.9 Click “Run Download Configuration” button.

5.5.10 Select AP download & Old Version Binary & MP Download icons.

Explain Old Version Binary icon

It is control "Binary" type.

We use old type Binary in now so, you should be check this category.

But in the future, We will release the new Binary.

So, If the new Binary is released, you don't check

"Old Version Binary" category.

LGE Internal Use Only

- 166 -

Only for training and service purposes

5. DOWNLOAD

5.5.11 Insert “SW-KS10-STN8810-V10a-MAY-05-2007

-OPEN-IT-SEC-OFC” in "KS10" folder on "Model" folder after click

"..." icon on "BIN" Box right side.

5.5.12 Insert “KS10M.Dll” in "KS10_DLL" folder on "Model" folder after click "..." icon on "DLL" Box right side.

Only for training and service purposes

- 167 -

LGE Internal Use Only

5. DOWNLOAD

5.5.13 Insert “SW-KS10-MSM6275-V10a-MAY-05-2007

-OPEN-IT-SEC-OFC.dz” in "KS10" folder on "Model" folder after click "..." icon on "BIN" Box right side.

5.5.14 Click “OK” button.

LGE Internal Use Only

- 168 -

Only for training and service purposes

5.5.15 Click “OK” button.

5.5.16 Click “START” button and then connect phone.

5. DOWNLOAD

5.5.17 PC create New hardware driver.

Only for training and service purposes

- 169 -

LGE Internal Use Only

5. DOWNLOAD

5.5.18 Click “Next” button.

5.5.19 Select “

1

5.5.20 Select “

2

LGE Internal Use Only

- 170 -

Only for training and service purposes

5. DOWNLOAD

5.5.21 Select "KS10_USB_Driver_20070426" folder in "DOWNLOAD" folder.

5.5.22 Click the "lgjoyusb" file.

5.5.23 Click “OK” button.

Only for training and service purposes

- 171 -

LGE Internal Use Only

5. DOWNLOAD

5.5.24 Click “OK” button.

5.5.25 Click “Finish” button.

5.5.26 the LGDP2 program is running automatically.

LGE Internal Use Only

- 172 -

Only for training and service purposes

5. DOWNLOAD

5.5.27 Remember a first com ports No..

5.5.28 It is displayed "Fail" message after completing AP downloading.

Don’t disconnection phone.

5.5.29 Click mouse right button on “My computer”. Then select

“Manage”.

Only for training and service purposes

- 173 -

LGE Internal Use Only

5. DOWNLOAD

5.5.30 Follow up as below step. Device Manager

> >

click mouse right button

>

5.5.31 Select “Port settings” icon. Then click “Advanced” button.

LGE Internal Use Only

- 174 -

Only for training and service purposes

5. DOWNLOAD

5.5.32 You should select com port No. which first com No. plus 40 is for MP. ex) First com port : com 4 port Select com 44 (= 4+ 40 ) port

5.5.33 Click “OK” button.

Only for training and service purposes

- 175 -

LGE Internal Use Only

5. DOWNLOAD

5.5.34 Click “OK” button.

5.5.35 Checking com port number.

LGE Internal Use Only

- 176 -

Only for training and service purposes

5.5.36 Disconnect and reconnect the phone.

And then the program is running automatically.

5. DOWNLOAD

5.5.37 Running the LGDP2 program.

❇ If you want to download the other phone, you just do from 5-17 to 5-36

category on this Guide.

Only for training and service purposes

- 177 -

LGE Internal Use Only

6. BLOCK DIAGRAM

6.1 GSM & WCDMA RF Block

Fig 2.1-1.UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram

LGE Internal Use Only

- 178 -

Only for training and service purposes

6. BLOCK DIAGRAM

Table 2.1-1. RF Block Component

Only for training and service purposes

- 179 -

LGE Internal Use Only

6. BLOCK DIAGRAM

6.2 Interface Diagram

KS10 Interface Diagram

LGE Internal Use Only

- 180 -

Only for training and service purposes

Main RF signal (black)

GSM TX : GSM Tx RF signal

GSM RX : GSM Rx RF signal

DCS TX : DCS Tx RF signal

DCS RX : DCS Rx RF signal

PCS TX : PCS Tx RF signal

PCS RX : PCS Rx RF signal

UMTS TX : UMTS Tx RF signal

UMTS RX : UMTS Rx RF signal

TX_I/Q : I/Q for Tx of RF

RX_I/Q : I/Q for Rx of RF

Control signal(red)

ANT_SEL 0,1,2 : Ant Switch Module Mode Selection

(WCDMA, GSM Tx/Rx, DCS Tx/Rx, PCS Tx/Rx)

GSM PA_CTL Signal

GSM_PA_BAND : DCS or PCS /GSM Mode Selection

GSM_PA_EN : Power Amp Gain Control Enable

GSM_PA_RAMP : Power Amp Gain Control

GSM/DCS/PCS_VCO_EN

GSM_TX_VCO_0_EN_N : GSM band Tx VCO Enable

GSM_TX_VCO_1_EN_N : DCS or PCS band Tx VCO Enable

UMTS PA_CTL Signal

TX_AGC_ADJ : WCDMA Tx Power Level Control

HDET1 : WCDMA Tx High Power Level Control

PA_ON : WCDMA Tx Power Amp Enable

W_VMODE_N : WCDMA Tx Power Amp Gain Control

TRK_LO_ADJ : TCXO(19.2M) Control

6. BLOCK DIAGRAM

Only for training and service purposes

- 181 -

LGE Internal Use Only

6. BLOCK DIAGRAM

*Top Side

LGE Internal Use Only

- 182 -

Only for training and service purposes

*Bottom Side

6. BLOCK DIAGRAM

Only for training and service purposes

- 183 -

LGE Internal Use Only

6. BLOCK DIAGRAM

6.3 KS10 Modem & Baseband Block Diagram

LGE Internal Use Only

- 184 -

Only for training and service purposes

6. BLOCK DIAGRAM

6.4 KS10 Application Processor Block Diagram

Only for training and service purposes

- 185 -

LGE Internal Use Only

6. BLOCK DIAGRAM

6.5 KS10 Audio & BT Block Diagram

ANT

Filter

BT_19.2M

STLC2500C

(BT)

UART

PCM

UART0

MSPRXD0

I2S

MSPRCK0

MSPRFS0

STN8810

(CPU)

GPIO

I2CSCL0

I2CSDA0

AU_19.2M

Level

Shifter

PCM

MIC_BIAS

MIC1

GPIO

WM_DACDAT

LOUT2

ROUT2

WM_MSPRXD0

GPIO

Switch

WM_BCLK

WM_LRC

GPIO

OUT3

LOUT1

ROUT1

Level

Shifter

WM_8753

(Audio Codec.)

WM_MSPTCK0

WM_MSPTFS0

I2S

PM_SCL

PM_SDA

SCL

SDA

MIC2

MSM

RXP

RSN

WM_MONO1

WM_MONO2

AMP

SPK_AMP_SD_N

MIC

Speaker

Receiver

Head Set

HOOK_SENSE_N

EAR_SENSE_N

LGE Internal Use Only

- 186 -

Only for training and service purposes

6. BLOCK DIAGRAM

6.6 KS10 Camera Block Diagram

Each part (2M camera & VGA camera) supports the Hi-Z state in power down mode.

Data[7:0]

VSYNC

HSYNC

PCLK

2M_nReset

2M_PWDN

CAM_PWR_EN

I2CSDA0

ON/OFF

OSC

MCLK

Slide

2M Camera module

Level

Shifter

VGA Camera module

MCLK

VGA_nRESET

VGA_STANDBY

CAM power

1.2V

Slide

CAM power

2.7V

Only for training and service purposes

- 187 -

LGE Internal Use Only

6. BLOCK DIAGRAM

6.7 KS10 LCD Block Diagram

Slide

LCD power

2.8V

Data[15:0] nCS1 nWE

RS nRESET

CPU

WLED_EN

Backlight

Driver

Control

LCD module

(Hitachi 2.4íí)

LGE Internal Use Only

- 188 -

Only for training and service purposes

6. BLOCK DIAGRAM

6.8 KS10 Power Distribution Diagram

Power

VBAT

Charging

Circuit

+VPWR

VREG_MSMA

_2.6V

VREG_MSMC

_1.375

PM6650

(PMIC)

VREG_MSMP

_2.7V

VREG_MSME

_1.8V

VREG_USIM

_2.85V

VREG_TCXO

_2.85V

VREG_SYNTH

_2.85V

VREG_RFTX

_2.85V

VREG_RFR

_2.85V

Power ON/Off

Logic

AP_+VPWR

MSM6275

TY90009800

COGG

(Memory)

USIM

(Socket)

RF Block

Vibrator

Key Pad

LED

TPA6205A1DRBR

(Audio AMP)

BH33FB1WHFV

(LDO Audio)

AU_3.3V

BH18LB1WHFY

(LDO MCAM)

CAM_1.8V

MIC5219-2.7

(LDO CAM)

CAM_2.7V

R1114N281D-TR-F

(LDO LCD)

AAT3151IWP_T1

(LCD Backlight

Driver)

LCD_2.8V

MAX4717

(AU SW)

WM8753LEB

(Audio Codec.)

2M_CAMERA

(Connector)

VGA_CAM

(Connector)

LCD

(Connector)

VDD_IO

AP_VDD_IO_1.8V

STw4810

(PMIC)

VUSB_3.1V

VMMC_3.1V

TransFlash

(Connector)

SLAS4717EPMTR2G

(USB SW)

Reset

Logic

VCORE/

VPLL/

VFUSE

VDDIOC/D/E

VDDQ/DDR/NAND

STn8810

(CPU)

RST

VDDIOA/B/F

ST2378

(Level Shifter)

STLC2500

(BT)

MIC5219-2.7

(LDO IO)

AP_VDD_IO_2.7V

Key Pad

Array pull up

LM8333

(Key Coder)

NLAS3158MNR2G

(UART SW)

A3212EEH-T

(Folder Sense)

Key Pad

Array pull up

(Folder)

Only for training and service purposes

- 189 -

LGE Internal Use Only

6. BLOCK DIAGRAM

6.9 KS10 Clock Distribution Diagram

19.2MHz

OSC

19.2MHz

L/S

19.2MHz

TCXO

19.2MHz

RTR6250_TCXO

RFR6250_TCXO

RF Block

19.2MHz

MXTALI

PWREN

19.2MHz

CLKOUT0

L/S

27MHz

VGA Camera

Nomadik

27MHz

OSC

27MHz

2M Camera

AU_PWR_EN

SXTALI

19.2MHz

OSC

WM9712 (Audio Codec.)

PWREN

TCXO_EN

STw4810

CLK_32K

Request_MC

32.768KHz

CLK_32K_IN

32.768KHz

L/S

19.2MHz

32.768KHz

REF_CLK_IN CLK_REQ_OUT_1

STLC2500C (BT)

LP_CLK

SLEEP CLK

PM6650

TCXO_OUT

19.2MHz

TCXO

MSM6275

32.768KHz

(X-tal)

USB 48MHz

(X-tal)

LGE Internal Use Only

- 190 -

Only for training and service purposes

7. CIRCUIT DIAGRAM

1 1

VDDIOE

AP_VDD_IO_1.8V

CPU_19.2M

CLK32K

PORN

MCAM_CLK_OUT

VDDIOD

R104

AP_TMS

AP_TDO

AP_TDI

AP_TCK

AP_TRST_N

C21

C22

C19

C20

D20

D17

MXTALI

MXTALO

SXTALI

SXTALO

PORN

CLKOUT0

H24

TMS

TDO

TDI

TCK

TRSTN

TAPSEL

N22

D23

L11

SCANEN

SCANMOD

TSTCLK

VDDOK

PWREN

D21

D19

E20

E19

F19

BATOK

VDDOK

PWREN

REMAP1_SMPREGN

REMAP0_SMDIRN

VDDIOD

EBI2_DATA(0:15)

R110

4.7K

VDDIOA

VDDIOD

R109

100K

R113

10K

EAR_SENSE_N

TP100

TP101

VGA_STANDBY_AP

EBI2_WE_N

EBI2_OE_N

AP_RTCK

TP102

R111 10K

HCSN_ETMCLK_XTICLK

UART_SW

EBI2_ADDR(2)

EBI2_ADDR(1)

HPI_EME_MOD_ETMPSTA1_XTIDAT

HPI_EME_APE_ETMPSTA2_XTIDAT

HPIEV_IT_STATE_ETMTRIGIN E12

EBI2_DATA(15) C11

D11 EBI2_DATA(14)

EBI2_DATA(13)

EBI2_DATA(12)

EBI2_DATA(11)

E11

C10

D10

N3 EBI2_DATA(10)

EBI2_DATA(9)

EBI2_DATA(8)

EBI2_DATA(7)

EBI2_DATA(6)

EBI2_DATA(5)

EBI2_DATA(4)

EBI2_DATA(3)

EBI2_DATA(2)

EBI2_DATA(1)

EBI2_DATA(0)

TP103

M24

W21

J21

J22

K22

M23

SMAD10

SMPS1N

SMPS0N

SMCS1N

SMCS0N

SMAD9

L24

P21

N23

K23

L23

K24

M22

N24

J23

L22

J24

P24

Y23

Y24

W22

V23

T23

T22

SMWEN

SMOEN

SMAD0

SMAD1

SMAD2

SMAD3

SMAD4

SMAD5

SMAD6

SMAD7

SMAD8

SMWAITN

SMFWPN

SMFRSTN

SMA_DQ0

SMA_DQ1

SMA_DQ2

SMA_DQ3

H23

E18

AE7

AE8

AE19

AE20

V24

U24

P23

P22

V22

U23

U22

W24

SMA_DQ4

SMA_DQ5

SMA_DQ6

SMA_DQ7

SMA_DQ8

SMA_DQ9

SMA_DQ10

R23

R22

T24

R24

SMA_DQ11

SMA_DQ12

SMA_DQ13

SMA_DQ14

SMA_DQ15

SMPIOWN

SMPIOIS16N

TMPWNG0

TMPWNG1

NANDWP0N

NANDWP01

HCSN

HALEN_SSPRXD

HADR2_URXD1

HADR1_UTXD1

HADR0

HBHEN

HWRN_SSPFRM

HRDN_SSPCLK

HRDY_RTCK

HPIEV

HDAT15

HDAT14_MSPSCK1

HDAT13

HDAT12

HDAT11_MSPTFS1

HDAT10_MSPTXD1

HDAT9

HDAT8

HDAT7

HDAT6

HDAT5

HDAT4

HDAT3

HDAT2

HDAT1

HDAT0

VDDIOA VDDIOB VDDIOC

AP_VDD_IO_1.8V

REMOTE_PWR_ON

VCC

U102

GND

NL17SZ08XV5T2

REMOTE_PWR_ON_AP

VDDIOD VDDIOE VDDIOF VDD12

VDDNAND VDDDDR VDDA VDDQ AP_VFUSE

U100

STN8810S12B2V1

AP_VDD_IO_1.8V

C153

0.1u

REQUEST_MC

X100

VDD

CSC3M192000EEVRS00

OUT

TRI_OPEN GND

19.2MHz

PWREN

AU_CLK_EN

AP_VDD_IO_1.8V

0.1u

C151

VCC

U101

C152

GND

NL17SZ08XV5T2

AP_VDD_IO_1.8V

0.1u

C154

VCC

U103

GND

NL17SZ08XV5T2

CPU_19.2M

AU_19.2M

CCPDAP

CCPDAN

CCPCKP

CCPCKN

CCPRSET

E10

AA6

AA5

AD5

AC4

AB4

AA4

AB3

AA3

AA7

AC8

AD8

AC6

AB5

AC5

CLPWR

CLLPHS

CLPCK

CLFPVS

CLACDE

CLLE

CLCD17

CLCD16

CLCD15

CLCD14

CLCD13

CLCD12

CLCD11

CLCD10

CLCD9

CLCD8

CLCD7

CLCD6

CLCD5

CLCD4

CLCD3

CLCD2

CLCD1

CLCD0

DU1

DU2

L25

T25

GND63

GND64

GND65

GND66

GND67

AE25

AE26

AF24

AF25

AF26

GPIO3

GPIO4

GPIO5

GPIO6

GPIO19

GPIO21

GPIO22

GPIO26

GPIO28

GPIO29

GPIO34

GPIO35

GPIO36

GPIO37

GPIO38

GPIO53

GPIO54

GPIO58_SSPTXD

GPIO76

GPIO91

GPIO92

F15

AD7

AD6

D22

D16

C16

C17

D18

C18

AB8

AB7

AC7

UTXD0

URXD0

UCTS0N

URTS0N

URXD2

AB6

USBVP

USBVM

USBRCV

USBSDA

USBINTN

USBOEN

USBSCL

E24

F22

F23

E22

G22

G23

E23

KEYCODER_RSTN

KEYCODER_INT

PWR_BTN

HOOK_SENSE

MSPTCK0

MSPRFS0

MSPRCK0

2M_RSTN_AP

LEVEL_SHIFT_EN

WLED_CTL

AU_PWR_EN

LCD_PWR_EN

CAM_PWR_EN

USB_SW

UTXD2

I2CSCL1

I2CSDA1

BT_RESETN

2M_PWDN_AP

HPI_IT_MOD_ETMSYNCA_XTIDAT

HPI_IT_APE_ETMPSTA0_XTIDAT

UTXD0

URXD0

UCTS0N

URTS0N

URXD2

USBVP

USBVM

USBRCV

USBSDA

USBINTN

USBOEN

USBSCL

I2CSCL0

I2CSDA0

PWLOUT

E21

I2CSCL0

I2CSDA0

IT_WAKE_UP_AP

CCIRID7_CCIROD7

CCIRID6_CCIROD6

CCIRID5_CCIROD5

CCIRID4_CCIROD4

CCIRID3_CCIROD3

CCIRID2_CCIROD2

CCIRID1_CCIROD1

CCIRID0_CCIROD0

CCIRIIVS

CCIRIHS

CCIRICLK_CCIROCLK

CCIRID(7)

CCIRID(6)

CCIRID(5)

CCIRID(4)

CCIRID(3)

CCIRID(2)

CCIRID(1)

CCIRID(0)

CCIRIVS

CCIRIHS

CCIRICLK

VDDIOE

DIS_CSN

DIS_RS

LCD_VS

DIS_WEN

VGA_RSTN

LCD_NRESET

LCD_DATA(15)

LCD_DATA(14)

LCD_DATA(13)

LCD_DATA(12)

LCD_DATA(11)

LCD_DATA(10)

LCD_DATA(9)

LCD_DATA(8)

LCD_DATA(7)

LCD_DATA(6)

LCD_DATA(5)

LCD_DATA(4)

LCD_DATA(3)

LCD_DATA(2)

LCD_DATA(1)

LCD_DATA(0)

LCD_DATA(0:15)

VDDIOC

VDDIOD

VDDIOE

VDDQ

VDDDDR

VDDNAND

AP_VDD_IO_1.8V

R101

VDD12

R102

VDDA

R103

AP_VCORE

AP_VPLL

VDDQ VDDDDR

C112

0.1u

C113

0.1u

C114

0.1u

C115

0.1u

C116

0.1u

C117

0.1u

C118

0.1u

C119

0.1u

VDDNAND

C110

0.1u

C111

0.1u

VDD12

C120

0.1u

C121

0.1u

C122

0.1u

C123

0.1u

C124

0.1u

VDDIOD

C129

0.1u

C130

0.1u

C131

0.1u

C132

0.1u

C133

0.1u

VDDIOC

C138

0.1u

C139

0.1u

C140

0.1u

C141

0.1u

C142

0.1u

C125

0.1u

C126

0.1u

C127

0.1u

C128

0.1u

VDDIOE

C134

0.1u

C135

0.1u

VDDIOF

C136

0.1u

C137

0.1u

C143

0.1u

C144

0.1u

VDDIOA VDDIOB

C145

0.1u

C146

0.1u

C147

0.1u

C148

0.1u

C149

0.1u

C150

0.1u

VDDIOA

R114

AP_VDD_IO_2.7V

VDDIOB

VDDIOF

Section

Designer

Checked

Date

MAY

2006

Sign & Name

LGE

MODEL

DRAWING

JOY 1.3

AP CPU & Memory

1/7

1 1 4

Only for training and service purposes

- 191 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

WM_BCLK

MSPRCK0

AU_SW

MSPTCK0

AP_AU_3.3V

WM_AVDD

R201

C203

10u

AP_VDD_IO_1.8V

WM_DVDD

WM_HPH_R

WM_HPH_L

WM_RXP

WM_RXN

WM_MIC1N

WM_MIC1P

WM_MIC2N

WM_MIC2P

WM_MICBIAS

R208

C219

10u

AU_19.2M

WM_DVDD

C222

C224

C225

C226

LINE1

LINE2

RXP

RXN

ACIN

ACOP

MIC1N

MIC1

MIC2N

MIC2

MICBIAS

C234

4.7u

U206

SLAS4717EPMTR2G

VCC NO2

NO1

COM1

IN1

NC1

COM2

IN2

NC2

GND

WM_ROUT2

C262

0.068u

SPK_AMP_EN

WM_LOUT2

C267

0.068u

R200

180K

0.015u

0.1u

C200

C202

R205

180K

0.015u

C206

0.1u

C208

WM_DVDD

C235

4.7u

C236

4.7u

WM_AVDD WM_DVDD

U202

WM8753LEB-RV

WM_DACDAT

WM_LRC

MSPRFS0

WM_MSPRXD0

MSPTFS0

0.1u

C201

R203

470K

0.1u

C209

MSM6725 EXT FILTER

PLACE CLOSE TO MSM

WM_AVDD

MICFBN

MICINP

MICOUTN

MICOUTP

MICINN

MICFBP

OUT4

OUT3

LOUT1

MONO2

MONO1

ROUT1

LOUT2

ROUT2

100K R213

100K R214

100K R215

U204

GND

VCC

NLAS4157DFT2G

CCIRID(3)_CAM

CCIRID(2)_CAM

CCIRID(1)_CAM

CCIRID(0)_CAM

CCIRIHS_CAM

CCIRIVS_CAM

CCIRICLK_CAM

CAMCLK_27MHZ_CAM

CCIRID(7)_CAM

CCIRID(6)_CAM

CCIRID(5)_CAM

CCIRID(4)_CAM

C229

C230

WM_DVDD

WM_MONO2

WM_MONO1

WM_ROUT1

WM_LOUT2

WM_ROUT2

VT_SW

MSPRXD0

AP_VDD_CAM_2.7V

AP_VDD_IO_2.7V

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

I2CSDA0_SW

MCAM_27M

I2CSCL0_SW

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

FL200

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

EVRC18S03Q015050R

INOUT_A4 INOUT_B4

INOUT_A3

INOUT_A2

INOUT_B3

INOUT_B2

FL201

INOUT_A1 INOUT_B1

EVRC18S03Q015050R

R206 0

CCIRID(3)

CCIRID(2)

CCIRID(1)

CCIRID(0)

CCIRIHS

CCIRIVS

CCIRICLK

CAMCLK_27MHZ

I2CSDA0

I2CSCL0

CAM_PWR_EN

U200

SLAS4717EPMTR2G

VCC NO2

NO1

COM1

IN1

NC1

COM2

IN2

NC2

GND

CCIRICLK_CAM

2M_RSTn_CAM

I2CSDA0_CAM

I2CSCL0_CAM

2M_PWDN

C207

2M_CAMERA

CN200

CCIRID(7)_CAM

CCIRID(6)_CAM

CCIRID(5)_CAM

CCIRID(4)_CAM

CCIRID(3)_CAM

CCIRID(2)_CAM

CCIRID(1)_CAM

CCIRID(0)_CAM

CSC3R270000BEVRS00

OUT

GND

X200

VDD

TRI_OPEN

27MHz

R207 100K

CCIRIVS_CAM

CCIRIHS_CAM

LOW Driven

G3 G4

C214

0.01u

AXK7L34227

HIGH Hi-Z

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

FL202

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

EVRC18S03Q015050R

CCIRID(7)

CCIRID(6)

CCIRID(5)

CCIRID(4)

R209

C223

R211

C227

10p

R212

WM_LOUT1

RECEIVER--

RECEIVER+

RECEIVER-

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

CCIRIHS

VGA_RSTn

I2CSDA0_CAM

I2CSCL0_CAM

LCD_VS

DIS_CSN

DIS_RS

DIS_WEN

CCIRICLK

MAIIN-SLIDER CON-HEADER

CN201

G1 G2

R718

R719

RECEIVER+

RECEIVER-

RECEIVER--

MOT_PWR-

FL206 EVRC18S03Q015050R

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

WLED_CTL

LCD_NRESET

FB224

VGA_STANDBY

KPD_DRV_N

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_COL(4)

KEY_COL(5)

KEY_COL(6)

KEY_COL(7)

FB221

FB223

FB230

FB233

R720

R721

R722

R723

R724

R725

R726

R727

R728

CCIRIVS

CCIRID(7)

CCIRID(6)

CCIRID(5)

CCIRID(4)

CCIRID(3)

CCIRID(2)

CCIRID(1)

CCIRID(0)

CAMCLK_27MHZ_CAM

FB225

FB229

FB232

FB235

FB237

FB239

FB241

FB243

FB227

FB231

FB234

FB236

FB238

FB240

FB242

FB244

AP_VDD_LCD_2.8V

AP_+VPWR

FB222

G3 G4

AXK7L70227

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

EVRC14S03Q030100R FL208

2M_RSTn_CAM

I2CSDA0_CAM

I2CSCL0_CAM

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

EVRC14S03Q030100R FL204

INOUT_B4

INOUT_B3

INOUT_B2

INOUT_B1

INOUT_A4

INOUT_A3

INOUT_A2

INOUT_A1

EVRC14S03Q030100R FL205

INOUT_B4 INOUT_A4

INOUT_B3 INOUT_A3

INOUT_B2 INOUT_A2

INOUT_B1 INOUT_A1

9 1

EVRC14S03Q030100R FL207

LCD_DATA(7)

LCD_DATA(5)

LCD_DATA(3)

LCD_DATA(1)

FL203

INOUT_A1

INOUT_A2

INOUT_A3

INOUT_A4

EVRC18S03Q015050R

INOUT_B1

INOUT_B2

INOUT_B3

INOUT_B4

2M_RSTn

I2CSDA0_SW

I2CSCL0_SW

VREG_MSMP_2.7V

LCD_DATA(6)

LCD_DATA(4)

LCD_DATA(2)

LCD_DATA(0)

LCD_DATA(8)

LCD_DATA(10)

LCD_DATA(12)

LCD_DATA(14)

+VPWR

R210

100K

MSM_UART_RXD_IN

LCD_DATA(15)

LCD_DATA(13)

LCD_DATA(11)

LCD_DATA(9)

USB_D+

USB_D-

USB_VBUS

VBATT

KEY_ON_SW_N

MSM_UART_TXD

MSM_UART_RXD_IN

AP_VDD_IO_2.7V

VREG_MSMP_2.7V

V+

GND COM

MSM_UART_TXD

REMOTE_PWR_ON

TP202

TP203

TP204

MSM_UART_RXD

MSM_UART_RXD_IN

CTS

RTS

DSR

NC4

NC3

NC2

VBAT

ON_SW

NC1

UTXD

URXD

PWR

VBAT

ON_SW

UFLS

GND

GND

2.5G

UT200

MIC200

SUMY0009203

WM_MICBIAS

C246

39p

C247

10p

C251

39p

C245 1u

C248 1u

C252

39p

WM_MIC1P

WM_MIC1N

CN202

FB503 1000

FB245

R222 68

R223 68

C242

R225

1608

33u

C244 33u

AP_VDD_IO_1.8V

100K R219

C239

10p

C237

10u

U205

OUT

G1 G2

NFM21PC105B1A3

R217

2.2K

C241

C240

R216

C238

0.1u

VIN4

VCC

VIN+ 3

GND

OUT

U203

NCS2200SQ2T2G

R218

330K

WM_MIC2N

WM_MIC2P

WM_LOUT1

WM_ROUT1

USB_D+

USB_D-

EAR_SENSE_N

VBATT

REMOTE_PWR_ON

+5V_PWR

USB_VBUS_IN

UART_TXD

UART_RXD

R224

470K

HOOK_SENSE

CONNECTOR VBATT_SENSE PIN CHECK!!

VBATT_SENSE

VREG_MSMP_2.7V

C253

33u

CN203

VBAT_TEMP

C260

0.1u

C261

R229

10K

R233

10K

C266

0.22u

R230 68K

U208 TPA6205A1DRBR

_SHUTDOWN VDD

BYPASS VO-

IN+

IN-

VO+

GND

PGND

R232 68K

C268 NA

SPKL-

SPKL+

C263

2.2u

AP_+VPWR

SPKL+

SPKL-

06.02.22 spk connect to contact type

SPK PAD size 2 by2

OUT200

OUT201

U207

SRC

GATE

OUT

VCC

DRAIN_THERMAL

NUS3065MUTAG

DRAIN

CNTRL

GND

TA OVP Circuit

CAD for EMC Noise

Between (VBATT & +5V_PWR) and (Mic signal)

Section

Designer

Date

MAY

2006

Sign & Name

LGE

Checked

Approved

MODEL

DRAWING

NAME

JOY 1.3

Sheet/

Sheets

2/7

AUDIO & 18PIN & CAMERA

SPEAKER AMP

LG Electronics Inc.

DRAWING

NO.

LG(42)-A-5505-10:01

1 2 3 4 5 6 7 8 9

LG Electronics Inc.

LGE Internal Use Only

- 192 -

Only for training and service purposes

7. CIRCUIT DIAGRAM

SLEEP_CLK

AU_PWR_EN

AU_CLK_EN

PORN

7 8 9 10

AP_VDD_IO_1.8V

VREG_MSMP_2.7V

AP_VDD_IO_1.8V

AP_+VPWR

AP_VCORE

AP_+VPWR

AP_VDD_IO_1.8V

0.1u C300

0.1u

C301

U304

TP300

ST1G3234BJR

MSM_RESIN_N

C802

0.1u

VCC NO2

R729 100K

NO1

COM1

IN1

COM2

IN2

NC2

NC1

GND

NLAS5223BMNR2G

U300

TP301

IT_WAKE_UP_AP

IT_WAKE_UP

C310

4.7u

L300

4.7uH

C311

22u

L301

4.7uH

C313

4.7u

C314

22u

PON

AP_VDD_IO_2.7V

CLK32K

R303 47K

IT_WAKE_UP

REQUEST_MC

U308

0.1u

C326

PWREN

VDDOK

AP_VDD_IO_1.8V

ST1G3234BJR

U311

VCC

5 NL17SZ32XV5T2

GND

U312

VCC

NL17SZ08XV5T2

GND

SW_RESET

AP_VDD_IO_1.8V

PM_SCL

PM_SDA

R304

USBVP

USBOEN

USBVM

USBRCV

USBINTN

USBSCL

USBSDA

MCCLK

MCFBCLK

MCCMDDIR

MCCMD

MCDAT0DIR

MCDAT0

MCDAT31DIR

MCDAT1

MCDAT3

MCDAT2DIR

MCDAT2

TP302

TP303

TP305

C317

0.1u

VBAT_DIG

VMINUS_DIG

PON

CLK32K_IN

MASTER_CLK

IT_WAKE_UP

REQUEST_MC

TCXO_EN

PWREN

VDDOK

PORN

CLK32K

SW_RESET

SCL

SDA

USBVP

USBOEN

USBVM

USBRCV

USBINTN

USBSCL

USBSDA

MCCLK

MCFBCLK

MCCMDDIR

MCCMD

MCDAT0DIR

MCDATA0

MCDATA31DIR

MCDATA1

MCDATA3

MCDAT2DIR

MCDATA2

C335

C336

PON

AP_+VPWR

C302

AP_VDD_IO_2.7V

U302

MIC5219-2.7YM5

IN OUT

GND

EN BYP

R300

C303

470p

C304

2.2u

U310

STW4810AHDT_LF

VBAT_VPLL_FUSE

VPLL

VFUSE

VREF_18

VBAT_VAUX

VAUX

VBAT_USB

VMINUS_USB

H10

J10

VUSB

VBUS

F10

G10

E10

LATCHCLK

CLKOUT

VBAT_MMC

VMMC

DATAOUT3

DATAOUT2

DATAOUT1

DATAOUT0

CMDOUT

GPO1

GPO2

C318

C319

C324

C334

0.1u

0.47u

C327

R305 22

C328 C329

1u 1u

R306 22

C332

2.2u

TP304

C330 C331

1u 4.7u

AP_VPLL

AP_VFUSE

VUSB_3.1V

USB_VBUS

AP_USB_D+

AP_USB_D-

VMMC_3.1V

SD_DAT(1)

SD_DAT(0)

SD_CLK

SD_CMD

SD_DAT(3)

SD_DAT(2)

11 12 13 14 15 16

CAM_PWR_EN

AP_+VPWR

C308

U301

STBY

GND

VIN

BH18LB1WHFV

BGND

VOUT

AP_VDD_CAM_1.8V

C309

2.2u

CAM_PWR_EN

AP_+VPWR

AP_VDD_CAM_2.7V

C305

U303

MIC5219-2.7YM5

IN OUT

GND

EN BYP

C306

470p

C307

2.2u

AU_PWR_EN

AP_+VPWR

C325

U307

STBY

GND

VIN

BH33FB1WHFV

BGND

VOUT

AP_VDD_LCD_2.8V

AP_+VPWR

AP_AU_3.3V

C321

2.2u

LCD_PWR_EN

C322

U306

VDD

GND

R1114N281D-TR-F

VOUT

C323

C320

33u

AP_+VPWR

R308 0

smd_1608h_5_r

+VPWR

VMMC_3.1V

SD_DAT(1)

SD_DAT(0)

SD_CLK

SD_CMD

SD_DAT(3)

SD_DAT(2)

S300

GCC110-8S-R-E1000

GND SWB SWA

GND

AP_VDD_IO_2.7V

AP_VDD_IO_1.8V

MCAM_CLK_OUT

0.1u

C337

0.1u

U313

ST1G3234BJR

C338

MCAM_27M

USIM_P_RST_N

USIM_P_CLK

VREG_USIM_2.85V

J300

VCC

RST

CLK

GND

VPP

I_O

USIM_P_DATA

C339

C343

SD_INT

USIM Connector

MAY

2006

JOY 1.3

3/7

AP POWER & T-Flash CON

1 1

Only for training and service purposes

- 193 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

KEY_COL(4:7)

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_COL(0)

KEY_COL(1)

KEY_COL(2)

KEY_ROW(0:3)

AP_VDD_IO_2.7V

MSM_USB_D+

USB_D+

USB_SW

AP_USB_D+

VUSB_3.1V

U406

SLAS4717EPMTR2G

VCC NO2

NO1

COM1

IN1

NC1

COM2

IN2

NC2

GND

SW400

SW403

SW406

SW409

SW401

SW404

SW407

SW410

SW402

SW405

SW408

SW411

AP_VDD_IO_2.7V

R414 R415

3.3K

I2CSCL1

I2CSDA1

MSM_USB_D-

USB_D-

AP_USB_D-

KEY_ROW(0)

KEY_COL(3)

KEY_ROW(1)

KEY_ON_SW_N

KEY_COL(3)

KEY_ROW(2)

KEY_COL(4)

KEY_COL(5)

KEY_COL(6)

KEY_COL(7)

Wake_INP6

Wake_INP7

K_Out4

K_Out5

K_Out6

K_Out7

Gen_IO_2

Gen_IO_3

U404

LM8333GGR8_NOPB

K_Out3

K_Out2

K_Out1

K_Out0

_RESET

Int_Rx

WD_Out

Int_Tx

KEY_COL(3)

KEY_COL(2)

KEY_COL(1)

KEY_COL(0)

TP406

KEYCODER_RSTN

KEYCODER_INT

TP407

KEY_COL(3:0)

C418 C419

0.1u

AP_VDD_IO_2.7V

USB SWITCH

CN400

CN401

KPD_DRV_N

LD400

R402 100ohm

SSC-TWH104-HLS

LD402

R405 100ohm

SSC-TWH104-HLS

LD404

R408 100ohm

SSC-TWH104-HLS

LD406

R411 100ohm

SSC-TWH104-HLS

LD401

R403 100ohm

SSC-TWH104-HLS

LD403

R406 100ohm

SSC-TWH104-HLS

LD405

R409 100ohm

SSC-TWH104-HLS

LD407

R412 100ohm

SSC-TWH104-HLS

VA400

EVL14K02200

AP_VDD_IO_2.7V

FOLDER_DETECT

C413

R413

100K

U402 A3212EEH-T

OUTPUT VDD

NC1 NC2

GND2

GND1 PGND

EUSY0200301

C414

0.1u

AP_VDD_IO_1.8V

C416

0.1u

WM_ADCDAT

WM_DACDAT

WM_LRC

WM_BCLK

8 9 10

PON

AP_VDD_BT_2.7V

AP_+VPWR

C402

U400

GND

MIC5219-2.7YM5

OUT

BYP

C403

470p

C400

33u

AP_+VPWR

FOLDER_SENSE

U405

IOVL1

IOVL2

IOVL3

IOVL4

IOVL5

ST2378EBJR

VCC

IOVCC1

IOVCC2

IOVCC3

IOVCC4

IOVCC5

IOVL6

IOVL7

IOVCC6

IOVCC7

IOVL8

GND

IOVCC8

PCMDATAOUT

PCMDATAIN

PCMSYNC

PCMCLK

AP_VDD_BT_2.7V

12 13

VDD

TRI_OPEN

C401

0.1u

19.2MHz

UTXD0

URTS0N

PCMCLK

PCMSYNC

PCMDATAIN

PCMDATAOUT

OUT

GND

AP_VDD_IO_1.8V

BT_RESETN

CLK32K

AP_VDD_BT_2.7V

R715

TP400

R401

U401

RESET_N

REF_CLK_IN

LP_CLK

STLC2500C

BT_WAKEUP

CLK_REQ_OUT_1

UART_TXD

UART_RTS

UART_RXD

UART_CTS

PCM_CLK

PCM_SYNC

PCM_A

PCM_B

GPIO_16

GPIO_8

GPIO_9

GPIO_10

GPIO_0

CLK_REQ_IN_1

CLK_REQ_IN_2

HOST_WAKEUP

CONFIG_1

CONFIG_3

CONFIG_2

CLK_REQ_OUT2

TOUT_IP_QN

TOUT_IN_QP

GPIO_11

VSS_RF1

VSS_RF2

RFP

RFN

VSS_DIG1

VSS_DIG2

VDD_D

VDD_IO_A

VDD_IO_B

VDD_CLD

VDD_HV_A

VDD_HV_D

VSS_ANA1

VSS_ANA2

VSS_ANA3

VDD_DSM

VDD_N

VDD_CL

VDD_RF

AF_PRG

AP_VDD_IO_2.7V

C417

0.1u

LEVEL_SHIFT_EN

DEA212450BT-7043C1

FL400

BP1

BP2

U_BP

BP_DC

R404

ANT400

FEED

NC1

NC2

UART SWITCH

URXD0

UCTS0N

AP_VDD_IO_2.7V

UART_TXD

UTXD2

UART_RXD

URXD2

R450

R416

100K

U403

0B0

1B0

GND1

GND2

VCC2

VCC1

0B1

1B1

NLAS3158MNR2G

R417

100K

R451

C415

0.1u

MSM_UART_TXD

UART_SW

MSM_UART_RXD

AP_VDD_IO_1.8V

AP_VDD_IO_2.7V

JTAG_PS_HOLD

MSM_RESIN_N

MSM_TDO

MSM_RTCK

MSM_TCK

MSM_TMS

MSM_TDI

MSM_TRST_N

JTAG-JIG-FPCB-CON

VREG_MSMP_2.7V

CN402

AP_TDO

AP_RTCK

AP_TCK

AP_TMS

AP_TDI

AP_TRST_N

C422

0.1u

PM_SCL

PM_SDA

2M_PWDN_AP

2M_RSTN_AP

VGA_STANDBY_AP

TP420

U407

IOVL1

IOVL2

IOVL3

IOVL4

IOVL5

IOVL6

IOVL7

IOVL8

GND

ST2378EBJR

VCC

IOVCC1

IOVCC2

IOVCC3

IOVCC4

IOVCC5

IOVCC6

IOVCC7

IOVCC8

R420

TP419

1K R421 1K

I2CSCL0

I2CSDA0

2M_PWDN

2M_RSTN

VGA_STANDBY

TP421

LEVEL_SHIFT_EN

C421

0.1u

MAY

2006

JOY 1.3

4/7

BT & KEYCODER

USB SW & LEVEL SHIFTER

LGE Internal Use Only

- 194 -

Only for training and service purposes

7. CIRCUIT DIAGRAM

ANT500

1 1

C500

L502

C502

SW500

KMS-512

ANT501

ANT_SEL0

ANT_SEL1

ANT_SEL2

VREG_RFR_2.85V

GSM/EDGE

WCDMA

WCDMA_2100

C509

47p

C519

47p

C520

0.1u

+VPWR

C510

47p

L514 7.5nH

C511

47p

ANTENNA SWITCH MODULE LOGIC

GSM900 TX

DCS/PCS TX

PCS RX

UMTS 2100

DCS RX

GSM 900 RX

IN_A

HIGH

LOW

IN_B

LOW

HIGH

LOW

IN_C

LOW

HIGH

LOW

HIGH

LOW

L523

22nH

C501 56p

L504

56nH

C528

C530

33p

ESHS-L090UB

GND1

GND2

GND3

GND4

GND5

GND6

VC1

VC2

VC3

FL500

EGSM_RX1

EGSM_RX2

DCS_RX1

DCS_RX2

PCS_RX1

PCS_RX2

DCS_PCS_TX

EGSM_TX

UMTS_TX_RX

C531

33p

L524

1.5nH

C568

22u

C570

0.01u

C571

0.01u

C529

L522

18nH

GND6

GND5

VCC

GND4

GND3

GSM_OUT

GND2

U501

DCS_PCS_IN

TQM7M5003

TX_EN

VBATT

GND1

VRAMP

GSM_IN

C560 1.8nH

EFCH1950TDC1

U503

OUT IN

5 2

L525

8.2nH

C507

1.5nH

C512

C513

L526

3.9nH

C561

22p

WCDMA_2100

C536

68p

R506 2.2K

(1%)

GSM_PA_BAND

GSM_PA_EN

C544

100p

WCDMA_2100_TX_OUT

R529 6.2K

C569

15p

W_VMODE_N

C543

22u

R513

GSM_PA_RAMP

VBATT

R516 15

R522

270

R518 15

R523

270

R520

220

R521

220

R524

C558

0.01u

11 13

L500

3.3nH

L501

3.6nH

L507

5.1nH

L513

5.1nH

L516

10nH

L520

10nH

MQW5V0C869M

OUT_GSM

OUT_DCSPCS

U502

SW1

SW2

GND5

GND6

GND7

GND8

GND1

GND2

GND3

GND4

L508

7.5nH

L511

7.5nH

L510

3.3nH

C504

1000p

L505

3.6nH

C508 33p

L517

9.1nH

C514

1000p

FB500

VREG_RFTX_2.85V

C515

33p

CP2_OUT

UHF_LO_BUFF

C521

680p

(1%)

R501

4.3K

(change to 4.53k)

C526

6.8n

ECHU1C682JX5

R503 11.3K

(1%)

C525

0.01u

C516

33p

L519

9.1nH

C527

1000p

R507 100

(1%)

C537

120p

R510

100

(1%)

R508 0

(1%)

C535

330p

C539

5.6n

ECHU1C562JX5

C541 82p

VREG_MSMP_2.7V

TX_ON

R514 100ohm

C545

0.01u

FB502

C554

33p

C553

4.7u

tcc_1608h_9_r

C556

15p

C555

0.1uF

C557

15p

C546

1000p

C547

100p

VREG_RFTX_2.85V

R517 100ohm

R519 100ohm

GSM_TX_VCO_0_EN_N

GSM_TX_VCO_1_EN_N

TX VCO CONTROL LOGIC

SW2 SW1

GSM850/900

DCS1800/PCS1900

NO OSCILLATION

HIGH

LOW

HIGH

LOW

HIGH

CP_HOLD2

CP2

VDDA9

RX_VCO_IN

R_BIAS

GSM1800_INN

GSM1800_INP

VDDA10

GSM900_INP

GSM900_INN

VDDA11

TX_MOD_CP

VDDA12

TX_VCO_FB

UMC4N

Q500

VREG_RFTX_2.85V

PA_ON TCXO_PM

RTR6250_TCXO

RFR6250_TCXO

VREG_TCXO_2.85V

C559 100p

C562 1000p

C563 1000p

RTR6250D

U500

TCXO

19.2MHz

OUT GND

VCC VCONT

X500

R525

100ohm

C564

0.01u

C517

0.1uF

RX_IN

RX_IP

RX_QN

RX_QP

VDDA4

VCO_TUNE

VTUNE_REF

VDDA3

TCXO

VDDA2

VDDA1

FAQ1

CP1

CP_HOLD1

C566

0.1uF

C567

1000p

C549

33p

R500

TRK_LO_ADJ

C522

33p

C550

100p

L503

2.2uH

C503

47p

L506

2.2uH

L509

2.2uH

C505

47p

L512

2.2uH

L515

47nH

C551

0.1uF

L518

47nH

R504 0

R505 0

R509 3.3K

(1%)

C540

0.01u

C538

3.9n

ECHU1C392JX5

R512

6.2K

(1%)

C542

390p

C532

33p

C533

33p

FB501

C548

4.7u

VREG_RFTX_2.85V

C523

100p

R526

80.6K

(1%)

R527

68K

C524

0.1uF

L521

47nH

C534

0.1uF

R515 1K

C552

4700p

C518

4.7u

Thermistor Circuit

R528

470K

(1%)

DAC_REF

TX_I_M

TX_I_P

TX_Q_M

TX_Q_P

VREG_SYNTH_2.85V

RX0_I_M

RX0_I_P

RX0_Q_M

RX0_Q_P

VREG_RFTX_2.85V

RTR6250_TCXO

WCDMA_2100_TX_OUT

TX_AGC_ADJ

VREG_RFTX_2.85V

RF_SBST

RF_SBDT

RF_SBCK

PA_THERM

C565

0.068u

RFIN COMM

VOPS VRMS

ADL5500 U504

HDET1

C573

0.1u

C574

100p

C572

1500p

ACMD-7601 U506

RX TX

R530

3.9nH

1.2p

L527

C575

1.8nH

GND2

GND3

RFOUT

GND4

VCC2

GND5

AWT6277R

VREF

VMODE

GND1

RFIN

VCC1

U505

IMT_RX_P

IMT_RX_M

IMT_RX_P

L528

2.7nH

C580

ILNA_OUT

FL501

B7827 2

5 4

L529

33nH

C581

12p

VREG_TCXO_2.85V

L530

2.2nH

L531

2.7nH

C585

100p

C582

100p

C583

0.1u

IMT_RX_M

ILNA_OUT

C586

1.2p

VREG_RFR_2.85V

C587

680p

PLNA_OUT

ILNA_OUT

PLNA_BIAS

PLNA_IN

ILNA_BIAS

ILNA_IN

VDDRF3

RX_IP

RX_IM

RX_QP

RX_QM

VDDA2

(1%)

PGND

GLNA_BIAS

GLNA_IN

R_BIAS

VDDA8

SBST

SBDT

SBCK

VDDM

GRX_IP

GRX_IM

GRX_QP

GRX_QM

R532

11.3K

C592

100p

C593

4.7u

R534

RF_SBST

RF_SBDT

RF_SBCK

C589

10p

C590

R533

VREG_MSMP_2.7V

Section

Designer

Date

MAY

2006

Sign & Name

LGE

MODEL JOY 1.3

5/7

C594

0.1u

C598

0.1u

C595

10p

C599

100p

RX0_Q_M

RX0_Q_P

RX0_I_M

RX0_I_P

R535

CP2_OUT

C800

100p

C597

100p

UHF_LO_BUFF

RFR6250_TCXO

Checked

DRAWING

1 1 6

Only for training and service purposes

- 195 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

1 2

USB 48M CLK

USB_XTALIN

X600

EXRY0002401

48MHz

R600

USB_XTALOUT

SDRAM_ADDR(0:14)

C SDRAM_DATA(0:31)

NAND_CLE

NAND_CS_N

EBI2_OE_N

EBI2_WE_N

NAND_ALE

NAND_READY

EBI2_DATA(0:15)

EBI2_DATA(15)

EBI2_DATA(14)

EBI2_DATA(13)

EBI2_DATA(12)

EBI2_DATA(11)

EBI2_DATA(10)

EBI2_DATA(9)

EBI2_DATA(8)

EBI2_DATA(7)

EBI2_DATA(6)

EBI2_DATA(5)

EBI2_DATA(4)

EBI2_DATA(3)

EBI2_DATA(2)

EBI2_DATA(1)

EBI2_DATA(0)

SDRAM_DATA(31)

SDRAM_DATA(30)

SDRAM_DATA(29)

SDRAM_DATA(28)

SDRAM_DATA(27)

SDRAM_DATA(26)

SDRAM_DATA(25)

SDRAM_DATA(24)

SDRAM_DATA(23)

SDRAM_DATA(22)

SDRAM_DATA(21)

SDRAM_DATA(20)

SDRAM_DATA(19)

SDRAM_DATA(18)

SDRAM_DATA(17)

SDRAM_DATA(16)

SDRAM_DATA(15)

SDRAM_DATA(14)

SDRAM_DATA(13)

SDRAM_DATA(12)

SDRAM_DATA(11)

SDRAM_DATA(10)

SDRAM_DATA(9)

SDRAM_DATA(8)

SDRAM_DATA(7)

SDRAM_DATA(6)

SDRAM_DATA(5)

SDRAM_DATA(4)

SDRAM_DATA(3)

SDRAM_DATA(2)

SDRAM_DATA(1)

SDRAM_DATA(0)

EBI2_ADDR(2)

EBI2_ADDR(1)

AA10

AC9

W10

AA9

AA7

AE5

D2_14

D2_13

AE7

AC8

AA8

AC7

D2_11

D2_10

D2_9

D2_8

D2_7

AF5

D2_12

D2_6

D2_5

AC6

AE4

D2_15

D2_4

D2_3

D2_2

AF3

D2_1

AC5

D2_0

AF13

A2_20_GPIO34

AA14

A2_19

T13

A2_18

AC14

A2_17

AE14

A2_16

W13

A2_15

AC13

A2_14

AA13

A2_13

AF12

A2_12

AE12

A2_11

AC12

AA12

A2_10

W12

A2_9

T12

A2_8

AC11

AA11

AE9

A2_7

A2_6

AC10

W11

AF9

A2_5

A2_4

A2_3

A2_2

A2_1

SDRAM1_D31

SDRAM1_D30

SDRAM1_D29

SDRAM1_D28

SDRAM1_D27

SDRAM1_D26

SDRAM1_D25

SDRAM1_D24

SDRAM1_D23

SDRAM1_D22

SDRAM1_D21

SDRAM1_D20

R11

SDRAM1_D19

SDRAM1_D18

SDRAM1_D17

SDRAM1_D16

SDRAM1_D15

SDRAM1_D14

SDRAM1_D13

SDRAM1_D12

SDRAM1_D11

SDRAM1_D10

SDRAM1_D9

SDRAM1_D8

SDRAM1_D7

SDRAM1_D6

AB4

SDRAM1_D5

SDRAM1_D4

SDRAM1_D3

AB2

SDRAM1_D2

SDRAM1_D1

SDRAM1_D0

AC15

AF14

XMEM2_CS_N1

LCD_CS_N_GPIO38

AF10

AF7

UB2_N

W14

XMEM2_CS_N0

OE2_N

AF4

WE2_N

AE10

LB2_N_A2_0

T14

NAND2_FLASH_READY_GPIO33

LG(42)-A-5505-10:01

1 2 3 4

5 6

WDOG_EN (1:Enable , 0:Disable)

Default Pull-up

VREG_MSMP_2.7V

U600-1

MSM6275_A

TP601

C606

100p

8 9 10 11 12 13 14 15 16

C600

10p

L600

100nH

1005 0.1uF 16V +80/-20%

2012 10uF 6.3V +80/-20% Ceramic

VREG_MSMC_1.375V

MODE

MODE2 MODE1 MODE0

0 0 0

0 1 0

BOOT_MODE2 BOOT_MODE

X 0

0 1

1 1

BOOT_MODE3

( Default Pull-Down)

Native, ARM JTAG

Native, MSM JTAG

NOR boot

8-bit, NAND boot

16-bit, NAND boot

Normal boot

Trusted boot

VREG_MSME_1.8V

VREG_MSMP_2.7V

ADC

HKADC[0] - AMUX_OUT

HKADC[1] - VBATT_SENSE

HKADC[2] - HDET1

HKADC[3]

HKADC[4] - PCB_Rev_ADC

HKADC[5] - CHARGER_THERM

PMIC_AUXIN[1]

PMIC_AUXIN[2] - PA_THERM

C601

10u

(2012)

C602

0.01u

HKADC(5):PCB_Rev_ADC

150K : 10K : 0.016V

150K : 47K : 0.62V

150K : 68K : 0.81V

150K : 100K : 1.04V

150K : 150K : 1.30V

150K : 300K : 1.73V

150K : 470K : 1.97V

150K : 680K : 2.13V

150K : 750K : 2.17V

VREG_MSMA_2.6V

(CAD : 10uF=>Input MSMA_2.6V)

C603

10u

C604

0.1uF

C605

0.1uF

C607

0.1u

10%

Place near

MSM pin W18

(CODEC VSS)

C608 C609 C610 C611

NA NA NA NA

C612

0.01u

C613

0.01u

C614

0.01u

C615

0.1uF

C616

0.01u

C617

0.01u

C618

0.1uF

C619

0.1uF

C620

0.1uF

SDCC_DAT1_GPIO99

SDCC_DAT2_GPIO100

SDCC_DAT3_GPIO101

MDP_VSYNC_SECONDA_GPIO104

MDP_VSYNC_PRIMARY_GPIO105

F25

M25

M26

AE3

AD2

WDOG_STB_SBCK1_GPIO0

SBDT1_GPIO1

PA_ON1_GPIO2

GRFC9_GPIO12

CAMCLK_PO_GP_MN_GPIO13

GPIO28

USB_RX_DATA_GPIO29

XMEM2_CS_N2_GPIO35

XMEM2_CS_N3_GPIO36

LCD_EN_GPIO37

GPIO43

SYNTH2_GPIO65

GPIO66

XMEM1_CS_N1_GPIO76

XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77

UART3_RFR_N_GPIO87

UART2_DP_RX_DATA_GPIO89

SYNTH0_GP_PDM0_GPIO92

SBST1_GPIO93

AA1

L25

F18

H18

W15

AA15

AE13

H25

F26

H11

J21

N19

TX_AGC_ADJ

TRK_LO_ADJ

TCXO_EN_GPIO94

PA_ON0

H13

L13

F19

F17

Q_OUT_N

Q_OUT

I_OUT_N

I_OUT

DAC_REF

A12

B12

A13

B13

F12

Q_IM_CH1

Q_IP_CH1

I_IM_CH1

I_IP_CH1

Q_IM_CH0

Q_IP_CH0

I_IM_CH0

I_IP_CH0

W23

V23

V25

W25

AA25

Y25

AB25

AC25

GP_PDM2_PA_RANGE1

GP_PDM1_PA_RANGE0

D17

H17

TRST_N

TCK

TMS

TDI

TDO

RTCK

H15

D16

F15

D15

A17

H16

AUX_PCM_CLK_GRFC14_GPIO80

AUX_PCM_DIN_GRFC13_GPIO14

AUX_PCM_DOUT_GRFC12_GPIO103

AUX_PCM_SYNC_GRFC11_GPIO102

TX_ON_GRFC10

K19

N21

H12

GRFC8_GPIO11

GRFC7_GPIO10

GRFX6_GPIO9

GRFC5_AUX_SBST_GPIO8

GRFC4_AUX_SBCK_GPIO7

GRFC3_GPIO6

GRFC2_GPIO5

GRFC1_AUX_SBDT_GPIO4

GRFC0_GPIO3

T23

T19

D11

H10

F10

BT_CLK_GPIO25

BT_SBST_GPIO24

BT_SBCK_GPIO23

BT_SBDT_GPIO22

BT_TX_RX_N_GPIO21

BT_DATA_GPIO20

G23

F23

E26

E25

H21

R19

MDDIC_DATP

MDDIC_DATN

MDDIC_STBP

MDDIC_STBN

A22

A23

B22

B23

TP602

PWR_BTN

USB_PWR_EN

HCSN_ETMCLK_XTICLK

FOLDER_DETECT

C631

1000p

C621

1000p

C632

1000p

C622

1000p

C633

1000p

C623

1000p

C634

1000p

EAR_SENSE_N

Near to MSM

TCXO_EN

PA_ON

(WCMDA 2100PAM Enable)

TX_Q_M

TX_Q_P

TX_I_M

TX_I_P

DAC_REF

R607

R608

C644

0.01u

C645

33nF

TX_AGC_ADJ

TRK_LO_ADJ

VREG_MSMP_2.7V

RX0_Q_M

RX0_Q_P

RX0_I_M

RX0_I_P

(WCMDA PAM MODE)

W_VMODE_N

MSM_TRST_N

MSM_TCK

MSM_TMS

MSM_TDI

MSM_TDO

MSM_RTCK

VSS_PAD1_0

VSS_PAD1_1

VSS_PAD1_2

VSS_PAD1_3

VSS_PAD1_4

AF6

VSS_PAD2_0

AF11

VSS_PAD2_1

AF15

VSS_PAD2_2

R26

B17

A15

VSS_PAD3_0

VSS_PAD3_1

VSS_PAD3_2

VSS_PAD3_3

A18

A21

D13

D19

VSSA1

VSSA2

VSSA3

P26

VSSA4

U19

VSSA5

V26

VSSA6

W16

VSSA7

W18

VSSA8

VSSA9

W26

VSSA10

AB26

VSSA11

AC16

VSSA12

AC26

VSSA13

AD25

VSSA14

AF23

AF24

VSSA15

VSSA16 TX_ON

ANT_SEL2

ANT_SEL1

ANT_SEL0

GSM_TX_VCO_0_EN_N

GSM_TX_VCO_1_EN_N

GSM_PA_BAND

GSM_PA_EN

HPIEV_IT_STATE_ETMTRIGIN

HPI_EME_APE_ETMPSTA2_XTIDAT

HPI_EME_MOD_ETMPSTA1_XTIDAT

HPI_IT_MOD_ETMSYNCA_XTIDAT

HPI_IT_APE_ETMPSTA0_XTIDAT

C624

0.01u

C625

0.01u

C626

0.01u

C635

0.01u

C636

1000p

C637

1000p

C627

0.01u

C638

1000p

U600-2

MSM6275_B w18 (Analog VSS guard ring for CODEC)

C628

0.1uF

C639

0.1uF

R606

C629

0.1uF

C640

0.1uF

for VSS_THERMAL

C641

0.1uF

RESERVED

(PLLOUT_TEST)

C26

VSS_DIG_0

VSS_DIG_1

VSS_DIG_2

VSS_DIG_3

VSS_DIG_4

VSS_DIG_5

VSS_DIG_6

VSS_DIG_7

VSS_DIG_8

VSS_DIG_9

VSS_DIG_10

VSS_DIG_11

VSS_DIG_12

AC1

AF8

AF16

T26

G26

D26

A24

A14

A11

VSS40

VSS41

VSS42

VSS43

VSS44

VSS45

VSS46

VSS47

VSS48

VSS49

VSS50

VSS51

AA6

AA21

AC4

AC23

AE1

AE2

AE25

AE26

AF1

AF2

AF25

AF26

2200p cap => place between

D12(VDDA1) and F12(DAC_REF)

DAC_REF

Near to B18 (VDD_PLL)

VREG_MSMA_2.6V

C642

0.1u

10%

C643

0.01u

C646

0.1u

10%

Place near

MSM pin AD26

(Check CAM_DATA PINOUT !!!!)

8 9

Section

Designer

Checked

Approved

Date

MAY

2006

Sign & Name

LGE

MODEL

LG Electronics Inc.

DRAWING

NAME

DRAWING

NO.

JOY 1.3

MODEM CPU

Sheet/

Sheets

6/7

LG Electronics Inc.

LGE Internal Use Only

- 196 -

Only for training and service purposes

7. CIRCUIT DIAGRAM

1 1 7 8 9 10 11

+5V_PWR

PMIC_VPWR_BYPASS

VDD_MSMC : 4.7uF

VDD_MSME : 4.7uF

VDD_PA : 4.7uF

VDD_MSM : 0.1uF

VDD_ANA : 0.1uF

VDD_RUIM : 0.1uF

VDD_RF : 0.1uF

VDD_WLAN : 0.1uF

VDD_MAIN : 0.1uF

VDD_SPKR : NA

+VPWR

Artwork --> Place resistor and capacitor close to PM6650 !!

USB_VBUS

C724

C725

0.1u

C729

VBATT

ICHARGE

CHG_CNT_N

ICHARGEOUT

BATT_FET_N

MSM_RESIN_N

D701

RB521S-30

USB_OE_N

USB_CTL_N

USB_DAT

MSM_USB_D+

USB_SE0

MSM_USB_D-

47K R710

1u C732

Power Line --> Route carefully!!!!!

Draw the Artwork_line thickly !!!!!

--->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-

+VPWR +VPWR

ADC_BYP

VCHG

ISNS_P

CHG_CTL_N

ISNS_M

VBAT

BAT_FET_N

FLSH_DRV_N

PON_RESET_N

VREG_USB

USB_ID

VREG_5V

USB_OE_N

VSW_5V

USB_CTL_N

USB_VBUS

USB_DAT

USB_D_P

USB_SE0

USB_D_M

GP1_DRV_N(MPP7)

+VPWR

100K

R711

U700

PM6650-1M

L700

4.7uH

L701

4.7uH

REF_BYP

REF_GND

REF_ISET

VCOIN

MSM_INT_N

TCXO_IN

PS_HOLD

VREG_MSMA

TCXO_EN

VDD_ANA

TCXO_OUT

VDD_MSM

SBST

VREG_MSMP

SBCK

VBACKUP

SBDT

XTAL_OUT

SLEEP_CLK

XTAL_IN

RUIM_RST(MPP6)

0.1u

C723

R705

121K

+VPWR

REMOTE_PWR_ON

1u C715

VREG_MSMP_2.7V

BAT700

ML414RM_F9CL

R704 470K

RB521S-30

PM_INT_N

TCXO_PM

D700

PS_HOLD

R708

PM_SBST

PM_SBCK

PM_SBDT

SLEEP_CLK

USIM_P_RST_N

C733

18p

4.7u

C726

R707

TCXO_EN

BUFF_TCXO smd_1608h_9_r smd_1608h_9_r

4.7u

C730

C734

18p

Load=12.5p

R709 0

JTAG_PS_HOLD

VREG_MSMA_2.6V

VREG_MSMP_2.7V

Artwork --> Place crystal and load caps close to PM6650 !!

Route carefully to avoid corrupting sensitive analog and RF signals!!!!!

----->> PM_SBDT , PM_SBCK , PM_SBST , PM_INT_N

SDRAM_ADDR(0:12)

RESOUT_EBI2_N

NAND_CS_N

NAND_READY

VREG_MSME_1.8V

VREG_MSMP_2.7V

EBI2_WE_N

SDRAM_RAS_N

SDRAM_WE_N

SDRAM_CAS_N

SDRAM_CLK

SDRAM_CS_N(0)

NAND_ALE

NAND_CLE

EBI2_OE_N

SDRAM_CLK_EN

SDRAM_ADDR(13)

SDRAM_ADDR(14)

SDRAM_ADDR(0)

SDRAM_ADDR(1)

SDRAM_ADDR(2)

SDRAM_ADDR(3)

SDRAM_ADDR(4)

SDRAM_ADDR(5)

SDRAM_ADDR(6)

SDRAM_ADDR(7)

SDRAM_ADDR(8)

SDRAM_ADDR(9)

SDRAM_ADDR(10)

SDRAM_ADDR(11)

SDRAM_ADDR(12)

NC82

NC83

NC84

NC85

NC86

NC87

NC88

NC89

NC132

NC131

NC71

NC72

NC73

NC74

NC75

NC76

NC77

NC78

NC79

NC80

NC81

J12

K10

K11

K13

K14

L11

L14

M12

VCCQD1

VCCQD2

K12

VCCN2

G13

L13

P13

U10

U13

VSS1

VSS2

VSS3

VSS4

VSS5

VSS6

VSS7

VSS8

VSS9

VSS10

VSS11

VSS12

A10

A11

A12

D12

C12

D11

C11

D10

C10

M10

_WP

_WEN

_RAS

_WED

_CAS

CLK

_CS

ALE

CLE

_CE

_RE

RY__BY

CKE

BA0

BA1

D13

V12

VCCD1

VCCD2

VCCD3

VCCD4

VCCD5

VCCD6

12 13

U701

TY90009800COGG

EUSY0297301

14 15 16

SDRAM_DATA(0:31)

DQ0

DQ1

DQ2

DQ3

DQ4

DQ5

DQ6

DQ7

DQ8

T11

U11

V11

T12

U12

T10

V10

P10

R10

P11

R11

P12

R12

R13

DQ9

DQ10

DQ11

DQ12

DQ13

DQ14

DQ15

DQ16

DQ17

DQ18

DQ19

DQ20

DQ21

DQ22

DQ23

DQ24

DQ25

DQ26

DQ27

DQ28

DQ29

DQ30

DQ31

DQM0

DQM1

DQM2

DQM3

IO1

IO2

IO3

IO4

IO5

IO6

IO7

IO8

M11

M13

L10

L12

H12

H10

G12

NC22

NC23

NC24

NC25

NC26

NC27

NC28

NC29

B12

B13

B14

C13

A14

B11

C14

D14

E10

E11

A11

A12

A13

NC10

NC11

NC12

NC13

NC14

NC15

NC16

NC17

NC18

NC19

NC20

NC21

NC1

NC2

NC3

NC4

NC5

NC6

NC7

NC8

NC9

SDRAM_DATA(0)

SDRAM_DATA(1)

SDRAM_DATA(2)

SDRAM_DATA(3)

SDRAM_DATA(4)

SDRAM_DATA(5)

SDRAM_DATA(6)

SDRAM_DATA(7)

SDRAM_DATA(8)

SDRAM_DATA(9)

SDRAM_DATA(10)

SDRAM_DATA(11)

SDRAM_DATA(12)

SDRAM_DATA(13)

SDRAM_DATA(14)

SDRAM_DATA(15)

SDRAM_DATA(16)

SDRAM_DATA(17)

SDRAM_DATA(18)

SDRAM_DATA(19)

SDRAM_DATA(20)

SDRAM_DATA(21)

SDRAM_DATA(22)

SDRAM_DATA(23)

SDRAM_DATA(24)

SDRAM_DATA(25)

SDRAM_DATA(26)

SDRAM_DATA(27)

SDRAM_DATA(28)

SDRAM_DATA(29)

SDRAM_DATA(30)

SDRAM_DATA(31)

EBI2_DATA(0)

EBI2_DATA(1)

EBI2_DATA(2)

EBI2_DATA(3)

EBI2_DATA(4)

EBI2_DATA(5)

EBI2_DATA(6)

EBI2_DATA(7)

SDRAM_DQM(0)

SDRAM_DQM(1)

SDRAM_DQM(2)

SDRAM_DQM(3)

EBI2_DATA(0:7)

USB_VBUS

6 5 4 Q700

QST4

1 2 3

ICHARGE

Route as equal length as possible! -> ICHARGE, ICHARGEOUT

ICHARGEOUT

2012

+VPWR

VBATT

Q701

NC1

Collector

Source

Drain

NUS5530MN

Drain_B

Collector_B

Emitter

Base

NC2

Gate

USB_CTL_N

+5V_PWR

CHG_CNT_N

BATT_FET_N

USB_VBUS_IN USB_VBUS

R730 NA

USB_PWR_EN

KRX102E

Q702

USB Booting Protection

Battery charging circuit !!!!!

MAY

2006

JOY 1.3

MODEM POWER

7/7

Only for training and service purposes

- 197 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

7 8 9 10 11 12 13 14 15 16

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_COL(4)

KEY_COL(5)

KEY_COL(6)

AP_VDD_LCD_2.8V

R102

100K

LCD Connector

(lower contact)

R103 100K

R104 100K

R115 0

C105

820p

LED1

LED2

LED3

LED4

LED_ANODE

LCD_VS

DIS_CSN

DIS_RS

DIS_WEN

TP100

TP101

LCD_DATA(0)

LCD_DATA(1)

LCD_DATA(2)

LCD_DATA(3)

LCD_DATA(4)

LCD_DATA(5)

LCD_DATA(6)

LCD_DATA(7)

LCD_DATA(8)

LCD_DATA(9)

LCD_DATA(10)

LCD_DATA(11)

LCD_DATA(12)

LCD_DATA(13)

LCD_DATA(14)

LCD_DATA(15)

LCD_NRESET

TP102

LCD_DATA(0:15)

XF2B-3545-31A-P

LCD_DATA(0)

LCD_DATA(2)

LCD_DATA(15)

LCD_DATA(13)

D100

PLR0504F

D102

PLR0504F

LCD_DATA(4)

LCD_DATA(6)

LCD_DATA(10) DIS_WEN

LCD_DATA(8) LCD_DATA(7)

LCD_DATA(12)

LCD_DATA(14)

LCD_DATA(11)

LCD_DATA(9)

D101

PLR0504F

D103

PLR0504F

LCD_DATA(5)

DIS_CSN

LCD_DATA(1)

LCD_DATA(3)

D104

PLR0504F

LCD_VS

DIS_RS

AP_+VPWR

LED_ANODE

C102

C103

4.7u

WLED_CTL

U100

VIN

AAT3151IWP_T1

C1+

VOUT

C1-

C2+

EN_SET

GND

PGND

C2-

C100

C101

LED1

LED2

LED3

LED4

LCD_Backlight driver

SW100

SW103

SW106

SW109

SW101

SW104

SW107

SW110

SW102

SW105

SW108

SW111

AP_+VPWR

FUNCTION KEYPAD LED

KPD_DRV_N

LD100

R106 100ohm

SSC-TWH104-HLS

LD103

R109 100ohm

SSC-TWH104-HLS

LD105

R111 100ohm

SSC-TWH104-HLS

LD107

R113 100ohm

SSC-TWH104-HLS

LD101

R107 100ohm

SSC-TWH104-HLS

LD104

R110 100ohm

SSC-TWH104-HLS

LD106

R112 100ohm

SSC-TWH104-HLS

LD108

R114 100ohm

SSC-TWH104-HLS

LD102

SSC-TWH104-HLS

VA100

EVL14K02200

AP_+VPWR

LCD_DATA(0)

LCD_DATA(2)

LCD_DATA(4)

LCD_DATA(6)

LCD_DATA(8)

LCD_DATA(10)

LCD_DATA(12)

LCD_DATA(14)

LCD_DATA(15)

LCD_DATA(13)

LCD_DATA(11)

LCD_DATA(9)

LCD_DATA(7)

LCD_DATA(5)

LCD_DATA(3)

LCD_DATA(1)

FUNCTION-SLIDER CON-HEADER

CN101

KEY_COL(7)

KEY_COL(6)

KEY_COL(5)

KEY_COL(4)

KEY_ROW(3)

KEY_ROW(2)

KEY_ROW(1)

KEY_ROW(0)

KPD_DRV_N

LCD_NRESET

DIS_WEN

DIS_RS

DIS_CSN

LCD_VS

WLED_CTL

AP_VDD_LCD_2.8V

2006

JOY 1.3

LCD & FUNCTION KEY

1/1

LGE Internal Use Only

- 198 -

Only for training and service purposes

7. CIRCUIT DIAGRAM

3 3

VGA_STANDBY

CAMCLK_27MHZ_CAM

CCIRICLK_CAM

CCIRID(0)_CAM

CCIRID(1)_CAM

CCIRID(2)_CAM

CCIRID(3)_CAM

CCIRID(4)_CAM

CCIRID(5)_CAM

7 8 9 10 11 12 13 14 15 16

AP_VDD_CAM_2.7V

VGA_CAMERA

CN100

AXK720145G

I2CSCL0_CAM

I2CSDA0_CAM

CCIRIHS_CAM

CCIRIVS_CAM

CCIRID(7)_CAM

CCIRID(6)_CAM

C102

VGA_RSTn

C100

0.1u

MAIIN-SLIDER CON-SOCKET

AP_VDD_CAM_1.8V

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

CCIRIHS_CAM

VGA_RSTn

I2CSDA0_CAM

I2CSCL0_CAM

CCIRICLK_CAM

R104

RECEIVER+

RECEIVER-

RECEIVER--

MOT_PWR-

WLED_CTL

LCD_VS

DIS_CSN

DIS_RS

DIS_WEN

LCD_NRESET

VGA_STANDBY

KPD_DRV_N

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_COL(4)

KEY_COL(5)

KEY_COL(6)

KEY_COL(7)

CN102

G1 G2

G3 G4

CAMCLK_27MHZ_CAM

AP_+VPWR

AP_VDD_LCD_2.8V

CCIRIVS_CAM

CCIRID(7)_CAM

CCIRID(6)_CAM

CCIRID(5)_CAM

CCIRID(4)_CAM

CCIRID(3)_CAM

CCIRID(2)_CAM

CCIRID(1)_CAM

CCIRID(0)_CAM

C101

0.1u

AP_+VPWR

RECEIVER+

RECEIVER-

RECEIVER--

OUT102

OUT103

R100 0

R101 0

R103 NA

VA100

EVLC18S02015

AP_+VPWR

L100 56nH

D100

RB521S-30

VA101

EVLC18S02015

FUNCTION-SLIDER CON-SOCKET

CN101

MOT_PWR-

OUT100

OUT101

KEY_COL(7)

KEY_COL(6)

KEY_COL(5)

KEY_COL(4)

KEY_ROW(3)

KEY_ROW(2)

KEY_ROW(1)

KEY_ROW(0)

KPD_DRV_N

LCD_NRESET

DIS_WEN

DIS_RS

DIS_CSN

LCD_VS

AP_VDD_LCD_2.8V

WLED_CTL

TP105 TP106 TP107 TP108 TP109

MAY

2006

JOY 1.3

SLIDER FPCB

1/1

4 4

Only for training and service purposes

- 199 -

LGE Internal Use Only

7. CIRCUIT DIAGRAM

1 2 3 4 5 6 7 8 9 10

LGIC(42)-A-5505-10:01

LGE Internal Use Only

2 3 4

CN?

VOLUME SIDE KEY

KB100

VOLUME UP

VOLUME DOWN

KB101

TP2 TP1

Iss.

Notice No.

Date Name

Section

Designer

Checked

Approved

Date

AUG

2006

Sign & Name

MODEL

JOY

DRAWING

NAME

VOLUME_SIDEKEY_FPCB

Sheet/

Sheets

1/1

LG Electronics Inc.

DRAWING

NO.

Rev_C

LG Electronics Inc.

- 200 -

Only for training and service purposes

7. CIRCUIT DIAGRAM

1 2 3

4 5 6 7 8 9 10

LGIC(42)-A-5505-10:01

Only for training and service purposes

3 4

CN100

KB100

POWER KEY

KB101

CAMERA KEY

TP1 TP2

Iss.

Notice No.

Date Name

Section

Designer

Checked

Approved

Date

AUG

2006

Sign & Name

LGE

LG Electronics Inc.

MODEL

JOY

DRAWING

NAME

POWER_Camera_BUTTON

Sheet/

Sheets

1/1

DRAWING

NO.

LG Electronics Inc.

- 201 -

LGE Internal Use Only

8. PCB LAYOUT

LGE Internal Use Only

- 202 -

Only for training and service purposes

8. PCB LAYOUT

Only for training and service purposes

- 203 -

LGE Internal Use Only

8. PCB LAYOUT

LGE Internal Use Only

- 204 -

LGMC

Only for training and service purposes

8. PCB LAYOUT

Only for training and service purposes

- 205 -

LGE Internal Use Only

8. PCB LAYOUT

LGE Internal Use Only

- 206 -

Only for training and service purposes

8. PCB LAYOUT

Only for training and service purposes

- 207 -

LGE Internal Use Only

- 208 -

Only for training and service purposes

9. Usage of Hot-Kimchi

9.1 Usage of Hot-Kimchi

9.1.1 Calibration

Model Name

9. Usage of Hot-Kimchi

Calibration only

• Procedure

1. Click SETTING in menu, and logic operation in sub-menu.

Choose “1” in LOGIC MODE (means calibration alone)

2.Select the model name which you want in list box

3.Click Start button to calibrate a phone

Only for training and service purposes

- 209 -

LGE Internal Use Only

9. Usage of Hot-Kimchi

9.1.2 Basic Setting

• Contents

✔ Click SETTING in menu, and logic operation in sub-menu.

✔ You can select how to control AT comm, Testset, and Power supply in DLL Operating

Mode.

✔ You can set UART Port and logic mode. (mode 1 : Calibration alone)

✔ You can set Result File’s name type. If you choose “TIME”, the saved files’ name is saved in a run - time.

✔ You can run the multi mode (S/B1,S/B2 : You can use S/B1 for only one port.)

✔ You can set the path of HOTKIMCHI program.

LGE Internal Use Only

- 210 -

Only for training and service purposes

9.1.3 Log of Calibration and Test

9. Usage of Hot-Kimchi

• Contents

✔ On Running, Log window is created in center area. It displays logs of command, and measurements of Calibration or Autotest.

✔ The result files are saved in the directory “~janghee\debug\Cal”, “~janghee\debug\Auto”, or “~janghee\debug\CalAuto”.

Only for training and service purposes

- 211 -

LGE Internal Use Only

10. Engineering Mode

A. About Engineering Mode

Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset.

B. Access Codes

The key sequence for switching the engineering mode on is *#001*2580#. Pressing END will switch back to non-engineering mode operation.

Engineering Mode

1. Version

Info

2. Device

Test

3. F actory

Reset

4. MTC 5. Save

Log

AP/MP/HW

Factory

Auto All Test

LCD

LED

Vibrator

Sound

Camera

Keypad

MP Msg Viewer

RTC Test

Options of in Main view :

- Set AP Debugmode On

- Set MP Debugmode On

LGE Internal Use Only

- 212 -

Only for training and service purposes

10. Engineering Mode

10.1 Version Info

10.1.1 AP/MP/HW Version

10.1.2 Factory Version

10.2 Device Test

10.2.1 Auto All Test

LCD On/Off -> Keypad LED On/Off -> Color Auto Test -> Ringtone Test -> Vibrator Test ->

Keypad Test

10.2.2 LCD

1) Auto Color Test

Red -> Green -> Blue -> Balck -> White To exit test, press the right arrow key.

2) Color Table Test : display the RGB table

10.2.3 LED

1) Backlight Test

This controls brightness of Backlight. When entering into the menu, the present backlight-value in the phone is displayed. Use Left/Right key to adjust the level of brightness.

2) Keypad Light Test

This controls brightness of keypad light. When entering into the menu, the present keypad light-value in the phone is displayed. Use Left/Right key to adjust the level of brightness of keypad.

3) Blinking Test

Keypad & LCD Backlight blinking test.

10.2.4 Vibrator

This menu is to test the vibration mode.

10.2.5 Sound

1) Ringtone Test

This menu is test ring tone.

2) Audio Calibration

This menu is to test db value of each volume level

3) Vocoder Calibration

This menu is to test db value of each frequency of codec.

Only for training and service purposes

- 213 -

LGE Internal Use Only

10. Engineering Mode

4) Echo Cancelation

This menu is to test echo cancellation parameter of codec.

5) Sound Calibration

This menu is to test volume gain of codec.

6) Loopback Test

This menu is to test the vibration mode.

7) AES/ACS Tunning

This menu is to test acoustic echo cancellation/suppression.

10.2.6 Camera

Camera application will be launched.

10.2.7 Keypad

This menu is to test all keys.

10.2.8 MP Msg Viewer

This menu is to display messages from MP

10.2.9 RTC Test

This menu is to display current time.

10.3 Factory Reset

This menu is to restore factory setting value.

10.4 MTC

Not to use.

10.5 Save Log

To save the latest log messages.

In Main view

Options

Set AP Debugmode On : UART switch is changed to AP / MP side

Set MP Debugmode On : not to use.

LGE Internal Use Only

- 214 -

Only for training and service purposes

- 215 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.1 EXPLODED VIEW

22 23

53 54

57 63

LGE Internal Use Only

- 216 -

Only for training and service purposes

- 217 -

LGE Internal Use Only

- 218 -

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.2 Replacement Parts

<Mechanic component>

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Level

Location

Part Name

IMT,FOLDER

AAAY00 ADDITION

MCCZ00 CAP

MCJZ00 COVER

MLAC00 LABEL,BARCODE

MLAJ00 LABEL,MASTER BOX

MPBZ00 PAD

MPCY00 PALLET

APEY00 PHONE

ACGM00 COVER ASSY,REAR

MCCC00 CAP,EARPHONE JACK

MCCF00 CAP,MOBILE SWITCH

MCCG00 CAP,MULTIMEDIA CARD

MCJN00 COVER,REAR

MDAD00 DECO,CAMERA

MGAD00 GASKET,SHIELD FORM

MGAE00 GASKET,DUST

MGAE01 GASKET,DUST

MHGB00 HOLDER,CARD

MIDZ00 INSULATOR

MIDZ01 INSULATOR

MLAB00 LABEL,A/S

MLAN00 LABEL,QUALCOMM

MLEA00 LOCKER,BATTERY

MLEY00 LOCKER

MPBH00 PAD,MIKE

MPBL00 PAD,MSM

MPBN00 PAD,SPEAKER

MPBN01 PAD,SPEAKER

MPBT00 PAD,CAMERA

MSDB00 SPRING,COIL

MTAA00 TAPE,DECO

MTAB00 TAPE,PROTECTION

Part Number

TIFF0011101

AAAY0123901

MCCZ0021601 BOX, TW, , , , ,

MCJZ0046701 BOX, TW, , , , ,

Spec

MLAC0004501 Export(105*40)

MLAJ0004401 LABEL,MASTER BOX(for C1300i NEW_CGR)

MPBZ0155609 BOX, TW, , , , ,

MPCY0012403 COMPLEX, (empty), , , , ,

APEY0241401

ACGM0079901

MCCC0040001 COMPLEX, (empty), , , , ,

MCCF0041201 MOLD, Urethane Rubber S190A, , , , ,

MCCG0006801 COMPLEX, (empty), , , , ,

MCJN0058801 MOLD, PC LUPOY SC-1004ML, , , , ,

MDAD0026001 ELECTROFORMING, Ni, , , , ,

MGAD0140101 COMPLEX, (empty), , , , ,

MGAE0000401 COMPLEX, (empty), , , , ,

MGAE0000501 COMPLEX, (empty), , , , ,

MHGB0001801 PRESS, STS, 0.2T, , , ,

MIDZ0131001 COMPLEX, (empty), , , , ,

MIDZ0131101 COMPLEX, (empty), , , , ,

MLAB0001102 C2000 USASV DIA 4.0

MLAN0000603 White,95C

MLEA0035001 MOLD, PC LUPOY SC-1004ML, , , , ,

MLEY0000801 SIM LOCKER

MPBH0030201 COMPLEX, (empty), , , , ,

MPBL0005201 COMPLEX, (empty), , , , ,

MPBN0038201 COMPLEX, (empty), , , , ,

MPBN0041401 COMPLEX, (empty), , , , ,

MPBT0037801 COMPLEX, (empty), , , , ,

MSDB0003901 CUTTING, BeCu, , , , ,

MTAA0131201 COMPLEX, (empty), , , , ,

MTAB0170801 COMPLEX, (empty), , , , ,

Color Remark

Metal Black

Without Color

DARK BLUE

Metal Black

Black

Without Color

White

Transparent

Black

Silver

Without Color

Silver

Without Color

Only for training and service purposes

- 219 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

MTAZ00 TAPE

Part Name

MWAE00 WINDOW,CAMERA

MBJC00 BUTTON,FUNCTION

MBJN00 BUTTON,VOLUME

MCJK00 COVER,FRONT

MICE00 INSERT,NUT

MDAG00 DECO,FRONT

MIDZ00

MIDZ01

MIDZ02

MPBH00

MTAA00

MTAB00

INSULATOR

PAD,MIKE

TAPE,DECO

TAPE,PROTECTION

MTAB01 TAPE,PROTECTION

ACGR00

COVER

ASSY,SLIDE(LOWER)

MCJV00 COVER,SLIDE(LOWER)

MDAY00 DECO

MMAA00 MAGNET,SWITCH

MPBG00 PAD,LCD

MPBU00

MTAF00

MTAZ00

MTAZ01

PAD,CONNECTOR

TAPE,MOTOR

TAPE

MTAZ02 TAPE

ACGS00

COVER

ASSY,SLIDE(UPPER)

MBFF00 BRACKET,LCD

MCJW00 COVER,SLIDE(UPPER)

MICC00 INSERT,FRONT(UPPER)

MFBB00 FILTER,RECEIVER

MKAC00 KEYPAD,FUNCTION

MPBG00 PAD,LCD

MPBJ00 PAD,MOTOR

MPBM00 PAD,RECEIVER

MPBT00 PAD,CAMERA

MPBZ00 PAD

MTAB00 TAPE,PROTECTION

Part Number Spec

MTAZ0181001 COMPLEX, (empty), , , , ,

MWAE0020901 CUTTING, NS, , , , ,

MBJC0020501 COMPLEX, (empty), , 51.9, 104, 12.2,

MBJN0010101 COMPLEX, (empty), , 51.9, 104, 12.2,

MCJK0064501 MOLD, PC LUPOY SC-1004ML, , 51.9, 104, 12.2,

MICE0000801 EXTRUSION, LDPE, , , , ,

MDAG0023701 MOLD, POM TX-31, , 51.9, 104, 12.2,

MIDZ0130401 COMPLEX, (empty), , , , ,

MIDZ0130501 COMPLEX, (empty), , , , ,

MIDZ0130601 COMPLEX, (empty), , , , ,

MPBH0027601 COMPLEX, (empty), , , , ,

MTAA0131301 COMPLEX, (empty), , , , ,

MTAB0148801 COMPLEX, (empty), , , , ,

MTAB0170201 COMPLEX, (empty), , , , ,

ACGR0008301

MCJV0008401 MOLD, PC LUPOY SC-1004ML, , 51.9, 104, 7.6,

MDAY0032901 MOLD, POM TX-31, , 51.9, 104, 12.2,

MMAA0000901 G7000 12x2x0.7t

MPBG0056401 COMPLEX, (empty), , , , ,

MPBU0000501 COMPLEX, (empty), , , , ,

MTAF0010701 COMPLEX, (empty), , , , ,

MTAZ0181101 COMPLEX, (empty), , , , ,

MTAZ0181201 COMPLEX, (empty), , , , ,

MTAZ0181301 COMPLEX, (empty), , , , ,

ACGS0009301

MBFF0011801 CASTING, Al Alloy, , , , ,

MCJW0009801 CASTING, Al Alloy, , 51.9, 104, 7.6,

MICC0010001 D2.2 L2.0 KURL 45

MFBB0020401 COMPLEX, (empty), , , , ,

MKAC0009501 MOLD, ABS MP-220, , 51.9, 104, 7.6,

MPBG0056301 COMPLEX, (empty), , , , ,

MPBJ0040701 COMPLEX, (empty), , , , ,

MPBM0017401 COMPLEX, (empty), , , , ,

MPBT0037901 COMPLEX, (empty), , , , ,

MPBZ0172101 COMPLEX, (empty), , , , ,

MTAB0153501 COMPLEX, (empty), , , , ,

Black

Metal Silver

Without Color

Black

Gold

Without Color

Black

Without Color

Color

Without Color

Black

Gold

Black

Without Color

Remark

80,83

LGE Internal Use Only

- 220 -

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

Part Name

MTAD00 TAPE,WINDOW

MWAC00 WINDOW,LCD

ARDY00 RAIL ASSY,SLIDE

GMEY00 SCREW MACHINE,BIND

GMZZ00 SCREW MACHINE

GMZZ01 SCREW MACHINE

MCCH00 CAP,SCREW

MGAD00

MGAE00

MGAE01

MGAE02

MIDZ00

MIDZ01

MIDZ02

MIDZ03

MKAZ00

MLAZ00

GASKET,SHIELD FORM

GASKET,DUST

INSULATOR

KEYPAD

LABEL

MPBF00 PAD,FLEXIBLE PCB

MPBZ00 PAD

MPBZ01 PAD

MTAB00 TAPE,PROTECTION

MTAB01 TAPE,PROTECTION

MBFP00 BRACKET,CAMERA

MTAK00 TAPE,CAMERA

MTAZ00 TAPE

MLAZ00 LABEL

Part Number Spec

MTAD0064501 COMPLEX, (empty), , , , ,

MWAC0072201 CUTTING, PMMA MR 200, , 51.9, 104, 12.2,

ARDY0001601

GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK

GMZZ0022101 1.4 mm,1.7 mm,MSWR3(BK) ,A ,+ ,- ,

GMZZ0020501 3.5 mm,1.5 mm,SWCH18A ,A ,+ ,- ,

MCCH0093901 MOLD, Urethane Rubber S190A, , , , ,

MGAD0139601 COMPLEX, (empty), , , , ,

MGAE0000101 COMPLEX, (empty), , , , ,

MGAE0000201 COMPLEX, (empty), , , , ,

MGAE0000301 COMPLEX, (empty), , , , ,

MIDZ0130701 COMPLEX, (empty), , , , ,

MIDZ0130801 COMPLEX, (empty), , , , ,

MIDZ0135601 COMPLEX, (empty), , , , ,

MIDZ0143101 COMPLEX, (empty), , , , ,

MKAZ0033201 MOLD, ABS MP-220, , , , ,

MLAZ0038303 PRINTING, (empty), , , , ,

MPBF0021901 COMPLEX, (empty), , , , ,

MPBZ0172201 COMPLEX, (empty), , , , ,

MPBZ0183901 COMPLEX, (empty), , , , ,

MTAB0170401 COMPLEX, (empty), , , , ,

MTAB0176601 COMPLEX, (empty), , , , ,

MBFP0006501 MOLD, PC LUPOY SC-1004ML, , , , ,

MTAK0000701 COMPLEX, (empty), , , , ,

MTAZ0189701 COMPLEX, (empty), , , , ,

MLAZ0038301 PID Label 4 Array

Color

Without Color

Black

Without Color

Black

Without Color

Black

White

Without Color

Black

Without Color

Remark

82,85

Only for training and service purposes

- 221 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.2 Replacement Parts

<Main component>

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Level

Location

Part Name

SNGF00 ANTENNA,GSM,FIXED

SUSY00 SPEAKER

ACGQ00 COVER ASSY,SLIDE

ACGK00 COVER ASSY,FRONT

SACY00 PCB ASSY,FLEXIBLE

SACB00

PCB

ASSY,FLEXIBLE,INSERT

SACE00 PCB ASSY,FLEXIBLE,SMT

SACC00

PCB ASSY,FLEXIBLE,SMT

BOTTOM

CN100

CONNECTOR,BOARD TO

BOARD

SACD00

PCB ASSY,FLEXIBLE,SMT

TOP

C100 CAP,CERAMIC,CHIP

C101

C102

CN101

CN102

CAP,CERAMIC,CHIP

CONNECTOR,BOARD TO

BOARD

CONNECTOR,BOARD TO

BOARD

Part Number Spec

SNGF0024701

3.0 ,-2 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL ,;

,QUAD ,-2.0 ,50 ,3.0

SUSY0022601 PIN ,8 ohm,90 dB,17 mm,Spring Contact Type

ACGQ0013301

ACGK0080001

SACY0053101 LCD FPCB

SACB0035701

SACE0048001

SACC0028501

ENBY0019501

SACD0039101

20 PIN,.4 mm,ETC , ,H=1.5, Socket

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ENBY0035901

ENBY0022901

40 PIN,0.4 mm,ETC , ,H=1.0, Plug

70 PIN,0.4 mm,ETC , ,H=0.9, Plug

D100

FB100

FB101

L100

R100

R101

R104

VA100

VA101

DIODE,SWITCHING

FILTER,BEAD,CHIP

INDUCTOR,CHIP

RES,CHIP,MAKER

VARISTOR

SPCY00 PCB,FLEXIBLE

SAJY00 PCB ASSY,SUB

SAJB00 PCB ASSY,SUB,INSERT

ADCA00 DOME ASSY,METAL

SAJE00 PCB ASSY,SUB,SMT

EDSY0011901

EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,

IR=30uA(VR=10V)

SFBH0000903 600 ohm,1005 ,

ELCH0005007 56 nH,J ,1005 ,R/TP ,

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

SEVY0003801 18 V, ,SMD ,

SPCY0072601 POLYI ,.4 mm,MULTI-4 , SLIDE-FPCB

SAJY0022201

SAJB0010801

ADCA0062701

SAJE0016601

Color

Black

Without Color

Remark

LGE Internal Use Only

- 222 -

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

R101

R102

R103

R104

D101

D102

D103

D104

R106

R107

R111

R112

R115

U100

Level

Location

Part Name

SAJC00

PCB ASSY,SUB,SMT

BOTTOM

C100

C101

CAP,CERAMIC,CHIP

C102

C103

CAP,CERAMIC,CHIP

C104 CAP,CERAMIC,CHIP

CN100 CONNECTOR,FFC/FPC

CN101

D100

CONNECTOR,BOARD TO

BOARD

DIODE,TVS

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

7 VA101 DIODE,TVS

Part Number Spec

VA102

VA103

VA105

VA107

ZD100

DIODE,TVS

ZD101 DIODE,TVS

SAJD00 PCB ASSY,SUB,SMT TOP

LD100 DIODE,LED,CHIP

SAJC0014901

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ENQY0010901 35 PIN,0.3 mm,ETC , ,H=1.2

ENBY0036001 40 PIN,0.4 mm,ETC , ,H=1.0, Socket

EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

EUSY0337001 TDFN33 ,12 PIN,R/TP ,3x3x1.0

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

SAJD0017001

EDLH0012501 Snow White ,1608 ,R/TP ,color concept

Color Remark

Only for training and service purposes

- 223 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

LD101

Part Name

DIODE,LED,CHIP

LD102

LD103

DIODE,LED,CHIP

LD104

LD105

LD106

LD107

DIODE,LED,CHIP

LD108

R108

R109

R110

R113

R114

VA100

VA104

VA106

SPJY00

SJMY00

SURY00

SVCY00

SVLM00

DIODE,LED,CHIP

RES,CHIP

VARISTOR

DIODE,TVS

PCB,SUB

VIBRATOR,MOTOR

RECEIVER

CAMERA

LCD MODULE

Part Number Spec

EDLH0012501 Snow White ,1608 ,R/TP ,color concept

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

SEVY0000702 14 V,10% ,SMD ,

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

SPJY0025701 FR-4 ,0.8 mm,SBL 6 ,KS10

SJMY0006508 3 V,.08 A,10*3.45 ,17mm , ,3V , , ,12500 , , , ,38

SURY0012801

SVCY0014001 CMOS ,VGA ,5.5x11.4x3.2t, Magna 1/7.4"

SVLM0020701

MAIN ,2.4" 240*320 ,42.88*60.65 ,262k ,TFT ,TM

,BD663474 ,

Color

GMEY00 SCREW MACHINE,BIND

MCCH00 CAP,SCREW

MCCH01 CAP,SCREW

MLAK00 LABEL,MODEL

SAFY00 PCB ASSY,MAIN

SAFB00 PCB ASSY,MAIN,INSERT

ACMY00 CAMERA ASSY

ABFZ00 BRACKET ASSY

GMEY0011201

MCCH0094001

MCCH0097701

MLAK0006901

SAFY0184101

SAFB0071301

ACMY0005701

ABFZ0011401

1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK

COMPLEX, (empty), , , , ,

MOLD, Urethane Rubber S190A, , , , ,

SVCY00 CAMERA

ADCA00 DOME ASSY,METAL

SVCY0014101 CMOS ,MEGA ,2M AF(FPCB,Micron 1/4" SOC2020,90')

ADCA0062801

MAAA00

ABSORBER,ELECTROMAG

NETIC WAVE

MAAA0000101 COMPLEX, (empty), , , , ,

SPKY00 PCB,SIDEKEY SPKY0034201 POLYI ,0.2 mm,DOUBLE ,POWER_SIDE_KEY

SPKY01 PCB,SIDEKEY

SAFF00 PCB ASSY,MAIN,SMT

SPKY0034401 POLYI ,0.2 mm,DOUBLE ,SIDE KEY(Volume)

SAFF0105101

Without Color

Black

Without Color

Remark

LGE Internal Use Only

- 224 -

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

C126

C127

C128

C129

C130

C131

C132

C120

C121

C122

C123

C116

C117

C118

C119

C124

C125

Level

Location

Part Name

SAFC00

PCB ASSY,MAIN,SMT

BOTTOM

ANT400 ANTENNA,GSM,FIXED

BAT700 BATTERY,CELL,LITHIUM

C100

C101

C102

C103

C104

CAP,CERAMIC,CHIP

C109

C110

C111

C112

C105

C106

C107

C108

C113

C114

C115

CAP,CERAMIC,CHIP

Part Number Spec

SAFC0084601

SNGF0023801 3.0 ,-2.0 dBd,, ,Chip, bluetooth ,; ,SINGLE ,-2.0 ,50 ,3.0

SBCL0001305 3 V,1 mAh,COIN ,SMT Temp.260 degree. PB-Free B/B

ECCH0000275 0.33 uF,16V,Z,Y5V,HD,1608,R/TP

ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000275 0.33 uF,16V,Z,Y5V,HD,1608,R/TP

ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000275 0.33 uF,16V,Z,Y5V,HD,1608,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

Color Remark

Only for training and service purposes

- 225 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

C133

Part Name

CAP,CERAMIC,CHIP

C134

C135

CAP,CERAMIC,CHIP

C136

C137

C138

C139

CAP,CERAMIC,CHIP

C200

C201

C202

C203

C150

C151

C153

C154

C204

C205

C206

C144

C145

C146

C147

C140

C141

C142

C143

C148

C149

C220

C221

C222

C224

C225

C207

C208

C209

C219

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

Part Number Spec

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000157 15 nF,16V,K,X7R,HD,1005,R/TP

ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000157 15 nF,16V,K,X7R,HD,1005,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

Color Remark

LGE Internal Use Only

- 226 -

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

C260

C262

C263

C264

C265

C266

C254

C255

C256

C257

C258

C259

C247

C248

C249

C250

C251

C252

C241

C242

C243

C244

C234

C235

C236

C240

C245

C246

Level

Location

C226

Part Name

CAP,CHIP,MAKER

C227

C228

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C229

C230

C232

C233

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,TANTAL,CHIP

CAP,CERAMIC,CHIP

CAP,TANTAL,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C253 CAP,TANTAL,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

Part Number Spec

ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP

ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

ECTH0002002

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty]

,[empty]

ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP

ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP

ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0002004 0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP

Color Remark

Only for training and service purposes

- 227 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

C267

Part Name

CAP,CERAMIC,CHIP

C300

C301

CAP,CERAMIC,CHIP

C302

C303

C304

C305

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C327

C328

C329

C330

C321

C324

C325

C326

C331

C332

C334

C312

C313

C314

C317

C306

C307

C310

C311

C318

C319

C337

C338

C339

C340

C341

C342

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

C400 CAP,TANTAL,CHIP 6

6 C401 CAP,CERAMIC,CHIP

Part Number Spec

ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECZH0001503 0.47 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECTH0002002

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty]

,[empty]

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

Color Remark

LGE Internal Use Only

- 228 -

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

C507

C508

C509

C510

C503

C504

C505

C506

C511

C514

C515

C416

C417

C421

C422

C409

C410

C411

C412

C500

C501

C520

C521

C522

C523

C524

C516

C517

C518

C519

Level

Location

C402

Part Name

CAP,CHIP,MAKER

C403

C404

C405

C406

C407

C408

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

RES,CHIP,MAKER

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

INDUCTOR,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

Part Number Spec

ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP

ECCH0000182

ECZH0001211

ECCH0000182

ERHZ0000401

ECZH0000841

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

0 ohm,1/16W ,J ,1005 ,R/TP

56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ELCH0001033 1.5 nH,S ,1005 ,R/TP ,PBFREE

ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

CAP,CHIP,MAKER

CAP,TANTAL,CHIP,MAKER

CAP,CERAMIC,CHIP

ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECTZ0006002 4.7 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECZH0001122 680 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

Color Remark

Only for training and service purposes

- 229 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

C544

C545

C550

C551

C552

C553

C546

C547

C548

C549

C554

C555

Level

Location

C525

Part Name

CAP,CERAMIC,CHIP

C526

C527

CAP,FILM,MPP

CAP,CERAMIC,CHIP

C530

C531

C532

C533

CAP,CHIP,MAKER

C538

C539

C540

C541

C542

C534

C535

C536

C537

6 C543

Part Number

ECCH0000155

ECFD0000604

ECCH0000143

ECZH0000830

Spec

10 nF,16V,K,X7R,HD,1005,R/TP

6.8 nF,16V ,J ,NI ,SMD ,2012 mm,R/TP

1 nF,50V,K,X7R,HD,1005,R/TP

33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,FILM,MPP

CAP,CERAMIC,CHIP

CAP,TANTAL,CHIP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000137 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP

ECFD0000703 3900 pF,16V ,J ,NI ,SMD ,2012 mm,R/TP

ECFD0000614 5.6 nF,16V ,J ,NI ,SMD ,2012 mm,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000127 82 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000138 390 pF,50V,K,X7R,HD,1005,R/TP

ECTH0001704

22 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,[empty] , ,2.2X1.25X1.2MM ,[empty] ,[empty] ,[empty]

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

CAP,TANTAL,CHIP,MAKER ECTZ0006002 4.7 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

CAP,CHIP,MAKER

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

CAP,CHIP,MAKER ECZH0001106 4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP

CAP,TANTAL,CHIP,MAKER ECTZ0006002 4.7 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

CAP,CHIP,MAKER

ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

C556

C557

C559

C560

C561

C562

C563

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

INDUCTOR,CHIP

CAP,CERAMIC,CHIP

ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ELCH0005010 1.8 nH,S ,1005 ,R/TP ,

ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

Color Remark

LGE Internal Use Only

- 230 -

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

C566

Part Name

CAP,CHIP,MAKER

C567

C568

CAP,CERAMIC,CHIP

CAP,TANTAL,CHIP

C570

C571

C572

C573

CAP,CERAMIC,CHIP

C615

C616

C617

C618

C607

C612

C613

C614

C619

C620

C621

C601

C602

C603

C604

C574

C575

C580

C600

C605

C606

C626

C627

C628

C629

C630

C622

C623

C624

C625

CAP,CHIP,MAKER

INDUCTOR,CHIP

RES,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

Part Number Spec

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECTH0001903 22 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000145 1.5 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ELCH0005010 1.8 nH,S ,1005 ,R/TP ,

ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP

Color Remark

Only for training and service purposes

- 231 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

C631

Part Name

CAP,CERAMIC,CHIP

C632

C633

CAP,CERAMIC,CHIP

C634

C635

C636

C637

CAP,CERAMIC,CHIP

C638

C639

C640

C641

C642

C643

C644

C645

C646

C802

CN200

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CONNECTOR,BOARD TO

BOARD

Part Number Spec

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

CN202

CN203

CN402

D201

D300

D301

CONNECTOR,I/O

CONNECTOR,ETC

CONNECTOR,BOARD TO

BOARD

DIODE,TVS

ENBY0015601 34 PIN,0.4 mm,STRAIGHT ,AU ,0.9MM HEIGHT

ENRY0006801

18 PIN,0.4 mm,ETC , , ,; ,18 ,0.40MM ,ANGLE

,RECEPTACLE ,SMD ,R/TP ,

ENZY0017601 3 PIN,2.5 mm,ETC , ,H=2.5

ENBY0016701 20 PIN,0.4 mm,STRAIGHT ,AU ,0.9 STACKING,MALE

D400

D401

D402

D700

FB245

FB500

FB501

FB502

FB503

DIODE,TVS

DIODE,SWITCHING

FILTER,BEAD,CHIP

EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE

EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

EDSY0011901

EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,

IR=30uA(VR=10V)

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0000903 600 ohm,1005 ,

SFBH0002301 1000 ohm,1608 ,CHIP FERRITE BEAD BLM11

Color Remark

LGE Internal Use Only

- 232 -

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

FL400

FL500

Part Name

FILTER,SAW

FILTER,SEPERATOR

L507

L508

L509

L510

L503

L504

L505

L506

L511

L512

L513

J300

L300

L301

L302

L500

L501

L502

L518

L519

L520

L521

L514

L515

L516

L517

L522

L523

INDUCTOR,CHIP

L524

L525

L526

L527

INDUCTOR,CHIP

CAP,CERAMIC,CHIP

L600 INDUCTOR,CHIP

MIC200 MICROPHONE

CONN,SOCKET

INDUCTOR,SMD,POWER

INDUCTOR,CHIP

CAP,CHIP,MAKER

INDUCTOR,CHIP

Part Number Spec

SFSY0027301 2450 MHz,2.0*1.5*1.0 ,SMD ,Pb-free_B/T_SAW

SFAY0007601

900.1800 ,1900.2100 , dB, dB, dB, dB,ETC ,GSM

TRIPLE, WCDMA2100 Quad Band FEM, 6.5X4.8X1.5

Size

ENSY0001602 6 PIN,ETC ,5 IRECTIONAL ,2.54 mm,K(GC200)

ELCP0009401 4.7 uH,M ,2.8*2.6*1.0 ,R/TP ,

ELCH0001022 56 nH,J ,1005 ,R/TP ,Pb Free

ELCH0001405 3.3 nH,S ,1005 ,R/TP ,PBFREE

ELCH0003816 3.6 nH,S ,1005 ,R/TP ,

ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ELCH0010401 2.2 uH,M ,1005 ,R/TP ,

ELCH0001022 56 nH,J ,1005 ,R/TP ,Pb Free

ELCH0003816 3.6 nH,S ,1005 ,R/TP ,

ELCH0010401 2.2 uH,M ,1005 ,R/TP ,

ELCH0003814 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005

ELCH0003817 7.5 nH,J ,1005 ,R/TP ,

ELCH0010401 2.2 uH,M ,1005 ,R/TP ,

ELCH0001405 3.3 nH,S ,1005 ,R/TP ,PBFREE

ELCH0003817 7.5 nH,J ,1005 ,R/TP ,

ELCH0010401 2.2 uH,M ,1005 ,R/TP ,

ELCH0003814 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005

ELCH0003817 7.5 nH,J ,1005 ,R/TP ,

ELCH0001421 47 nH,J ,1005 ,R/TP ,PBFREE

ELCH0001428 10 nH,J ,1005 ,R/TP ,

ELCH0003818 9.1 nH,J ,1005 ,R/TP ,

ELCH0001421 47 nH,J ,1005 ,R/TP ,PBFREE

ELCH0003818 9.1 nH,J ,1005 ,R/TP ,

ELCH0001428 10 nH,J ,1005 ,R/TP ,

ELCH0001421 47 nH,J ,1005 ,R/TP ,PBFREE

ELCH0001402 18 nH,J ,1005 ,R/TP ,Pb Free

ELCH0001413 22 nH,J ,1005 ,R/TP ,PBFREE

ELCH0001404 1.5 nH,S,1005,R/TP

ELCH0005016 8.2 nH,J ,1005 ,R/TP ,

ELCH0005012 3.9 nH,S ,1005 ,R/TP ,

ECCH0000701 1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ELCH0005009 100 nH,J ,1005 ,R/TP ,

SUMY0009203 UNIT ,42 dB,4*1.5 ,Reverse TYPE

Color Remark

Only for training and service purposes

- 233 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

Q700

Part Name

TR,BJT,PNP

6 Q701 TR,FET,P-CHANNEL

RES,CHIP,MAKER

R111

R112

R113

R114

R107

R108

R109

R110

R115

R200

R201

R100

R101

R102

R103

R105

R106

R214

R215

R221

R222

R223

R224

R226

R206

R208

R210

R211

R202

R203

R204

R205

R212

R213

Part Number Spec

EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680

EQFP0008601

DFN8 ,1.3 W,-20 V,-3.9 A,R/TP ,Intergrated power

MOSFET with PNP Transistor

ERHZ0000295 51 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000459 3 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000433 180 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000433 180 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP

Color Remark

LGE Internal Use Only

- 234 -

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

R227

Part Name

RES,CHIP,MAKER

R228

R229

RES,CHIP

RES,CHIP,MAKER

R230

R231

R232

R233

RES,CHIP,MAKER

R410

R420

R421

R500

R314

R315

R401

R404

R501

R502

R503

R307

R308

R309

R310

R300

R303

R305

R306

R311

R313

R508

R509

R510

R511

R512

R504

R505

R506

R507

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

Part Number Spec

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHY0011601 11 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000507 68 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000507 68 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000287 47 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000701 0 ohm,1/10W ,J ,1608 ,R/TP

ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHY0000101 0 ohm,1/16W,F,1005,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHY0000253 4.3K ohm,1/16W,J,1005,R/TP

ERHZ0000286 4700 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0003203 11.3 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHY0000186 2.2 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP

ERHY0000101 0 ohm,1/16W,F,1005,R/TP

ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000307 6200 ohm,1/16W ,F ,1005 ,R/TP

Color Remark

Only for training and service purposes

- 235 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

R513

Part Name

RES,CHIP,MAKER

R514

R515

RES,CHIP

RES,CHIP,MAKER

R516

R517

R518

R519

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

RES,CHIP

R607

R608

R609

R610

R603

R604

R605

R606

R611

R713

R714

R524

R530

R531

R600

R520

R521

R522

R523

R601

R602

RES,CHIP

RES,CHIP,MAKER

INDUCTOR,CHIP

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

R715

R729

R730

S300

RES,CHIP,MAKER

CONN,SOCKET

SW500 CONN,RF SWITCH

U100 IC

U101

U102

Part Number Spec

ERHZ0000701 0 ohm,1/10W ,J ,1608 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000419 15 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000419 15 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003501 220 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000531 270 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

ELCH0005012 3.9 nH,S ,1005 ,R/TP ,

ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0000105 51 ohm,1/16W,F,1005,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0003901 .1 ohm,1/4W ,F ,2012 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000701 0 ohm,1/10W ,J ,1608 ,R/TP

ENSY0018901 8 PIN,ETC , ,2.54 mm,Micro-SD, Reverse

ENWY0002304 STRAIGHT ,SMD ,0.8 dB,MUSE MODEL

EUSY0269702

BGA(14*14) ,355 PIN,R/TP ,1Gbit NAND+512Mbit DDR

SDRAM, 3G Smart Phone for Open OS MAP

EUSY0149402 SOT-553 ,5 PIN,R/TP ,Single 2 Input AND Gate

Color Remark

LGE Internal Use Only

- 236 -

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

U103 IC

U201

U202

U204 IC

U206

U208

U300

U302

U303

U304

U307

U308

Part Name

U310 IC

U311

U312

U313 IC

U400

U401

U405

U407

U500 IC

U501 PAM

U502 VCO

U503

U504

FILTER,SAW

U505 PAM

U506 DUPLEXER,GSM

U507

COUPLER,RF

DIRECTIONAL

U600 IC

VA200 VARISTOR

Part Number Spec

EUSY0149402 SOT-553 ,5 PIN,R/TP ,Single 2 Input AND Gate

EUSY0198601 SOT-666 ,6 PIN,R/TP ,Single SPDT Analog Switch

EUSY0269401 I2C Dual Codec ,48 PIN,R/TP ,

EUSY0263301

SC-88(2.0x2.1) ,6 PIN,R/TP ,Single SPDT Switch, Pb

Free

EUSY0317101 WQFN ,10 PIN,R/TP ,1.8*1.4*0.75

EUSY0335701 QFN ,8 PIN,R/TP ,1.2W, Mono, Differencial Audio AMP

EUSY0300101

EUSY0064501

EUSY0241401

WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog

Switch, PB-Free

SOT-23-5 ,5 PIN,R/TP ,2.7V LDO

REGULATOR,PBFREE

SOT-23-5 ,5 PIN,R/TP ,2.7V LDO

REGULATOR,PBFREE

FLIP-CHIP 5 ,5 PIN,R/TP ,1-BIT DUAL SUP. BUS

BUFFER LEVEL TRANS / 26 OHM SERIES ON A

EUSY0223003

HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH

OUTPUT CONTROL / 3.3V

EUSY0241401

FLIP-CHIP 5 ,5 PIN,R/TP ,1-BIT DUAL SUP. BUS

BUFFER LEVEL TRANS / 26 OHM SERIES ON A

EUSY0269501

TFBGA ,84 PIN,R/TP ,PMIC for Application Processor

Engine of STM, Pb Free

EUSY0162301 SOT-553 ,5 PIN,R/TP ,Single 2 Input OR Gate

EUSY0149402 SOT-553 ,5 PIN,R/TP ,Single 2 Input AND Gate

EUSY0241401

FLIP-CHIP 5 ,5 PIN,R/TP ,1-BIT DUAL SUP. BUS

BUFFER LEVEL TRANS / 26 OHM SERIES ON A

EUSY0064501

SOT-23-5 ,5 PIN,R/TP ,2.7V LDO

REGULATOR,PBFREE

EUSY0293401 VFBGA ,48 PIN,R/TP ,Bluetooth Single Chip(V2.0+EDR)

EUSY0269201 Flip-Chip20 ,20 PIN,R/TP ,8 bit Level Translator, Pb Free

EUSY0203802

QFN ,56 PIN,R/TP ,GSM/WCDMA TRANSMITTER &

GSM RECEIVER

SMPY0013501 35 dBm,51 %, A, dBc, dB,7x7x1.1 ,SMD ,Polar Edge

EXSC0009201

MHz, PPM, pF,SMD ,5.5*4.8*1.5 ,824MHz ~ 915MHz,

1710MHz ~ 1910MHz, 14pin

SFSY0023001 1950 MHz,2.0*1.4*0.8 ,SMD ,5pin, Unbal-Unbal, 50//50

EUSY0280501 , PIN,R/TP ,

SMPY0013301 dBm,43 %, A,-40 dBc,26 dB,4x4x1.1 ,SMD ,2.1GHz,

HSDPA

SDGY0000701

1950 MHz,2140 MHz,1.6 dB,1 dB,45 dB,51 dB,3.8*3.8*1.4 ,SMD ,WCDMA (FBAR)

SCDY0003402

-20 dB,-0.25 dB,-35 dB,1.0*0.58*0.35 ,SMD ,1850M ~

1910M, 4pin, Pb Free

EUSY0241701

BALL CSP ,409 PIN,R/TP

,WCDMA/GSM/GPRS/EDGE/HSDPA MODEM

SEVY0003801 18 V, ,SMD ,

Color Remark

Only for training and service purposes

- 237 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

VA201

Part Name

VARISTOR

VA208

VA209

VA210

VA211

VARISTOR

DIODE,TVS

VA212

VA213

VA300

VA301

VARISTOR

Part Number Spec

SEVY0003801 18 V, ,SMD ,

SEVY0001001 14 V, ,SMD ,50pF, 1005

SEVY0003602 5.6 V, ,SMD ,1005, 60pF

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

SEVY0003801 18 V, ,SMD ,

VA302

VA303

X100

X400

X600

VARISTOR

OSCILLATOR

RESONATOR

SAFD00 PCB ASSY,MAIN,SMT TOP

C210 CAP,CERAMIC,CHIP

SEVY0003801 18 V, ,SMD ,

SEVY0003901 5.5 V, ,SMD ,480pF, 1005

EXSY0022201

19.2 MHz,20 PPM,15 pF,SMD ,3.2*2.5*1.0 ,1.71V ~

1.89V, -20'C ~ +70'C ,; ,19.2MHz ,20PPM ,1.8V ,3.2 ,2.5

,1.0 , ,SMD ,R/TP

EXSY0022201

19.2 MHz,20 PPM,15 pF,SMD ,3.2*2.5*1.0 ,1.71V ~

1.89V, -20'C ~ +70'C ,; ,19.2MHz ,20PPM ,1.8V ,3.2 ,2.5

,1.0 , ,SMD ,R/TP

EXRY0002401

48 MHz,.5 %,14 pF,SMD ,2.0*1.2*0.65 ,Outgoing

Tolerance 0.2%, 0.05% at -40'C ~ +85C, Built-In Cap

SAFD0083601

ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP

C215

C216

C217

C218

C211

C212

C213

C214

C237

C238

C239

C308

C309

C320

C322

C413

C414

CAP,CERAMIC,CHIP

CAP,TANTAL,CHIP

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,TANTAL,CHIP

CAP,CERAMIC,CHIP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP

ECTH0002201

ECCH0000182

ECCH0000110

10 uF,6.3V ,M ,STD ,1608 ,R/TP

0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

10 pF,50V,D,NP0,TC,1005,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

ECTH0002002

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty]

,[empty]

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

Color Remark

LGE Internal Use Only

- 238 -

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

C415

Part Name

CAP,CERAMIC,CHIP

C418

C419

CAP,CERAMIC,CHIP

C420

C558

C564

C565

CAP,CERAMIC,CHIP

C591

C592

C593

C594

C587

C588

C589

C590

C595

C596

C597

C581

C582

C583

C584

C569

C577

C578

C579

C585

C586

C598

C599

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C700 CAP,TANTAL,CHIP

C701

C702

C703

C704

C705

CAP,CERAMIC,CHIP

Part Number Spec

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP

ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP

ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000853 8.2 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000173 1.2 pF,16V ,B ,NP0 ,TC ,1005 ,R/TP

ECZH0001122 680 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

ECZH0000839 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

ECTH0002002

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty]

,[empty]

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

Color Remark

Only for training and service purposes

- 239 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

C706

Part Name

CAP,CERAMIC,CHIP

C707

C708

CAP,CHIP,MAKER

C709

C710

C711

C712

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

C727

C728

C729

C730

C723

C724

C725

C726

C731

C732

C733

C717

C718

C719

C720

C713

C714

C715

C716

C721

C722

C738

C739

C760

C761

C800

C734

C735

C736

C737

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

CAP,CERAMIC,CHIP

CAP,CHIP,MAKER

Part Number Spec

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP

ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

Color Remark

LGE Internal Use Only

- 240 -

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

CN201

D200

Part Name

CONNECTOR,BOARD TO

BOARD

DIODE,TVS

6 D403 DIODE,TVS

D404

D405

D701

FB204

FB205

FB206

FB207

FB221

FB222

FB223

FB224

FB225

FB227

FB229

FB230

FB231

FB232

FB233

FB234

FB235

FB236

FB237

FB238

FB239

DIODE,TVS

DIODE,SWITCHING

FILTER,BEAD,CHIP

Part Number Spec

ENBY0022801 70 PIN,0.4 mm,ETC , ,H=0.9, Socket

EDTY0008602 SOD-323 ,13.3 V,400 W,R/TP ,PB-FREE

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

EDSY0011901

EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,

IR=30uA(VR=10V)

SFBH0000903 600 ohm,1005 ,

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0000903 600 ohm,1005 ,

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

Color Remark

Only for training and service purposes

- 241 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

Part Name

FB240 FILTER,BEAD,CHIP

FB241

FB242

FB243

FILTER,BEAD,CHIP

FB244 FILTER,BEAD,CHIP

FL200

FL201

FL202

FL203

FL204

FL205

FL206

FL207

FL208

FILTER,EMI/POWER

FL501 FILTER,SAW

L532

L533

L700

L701

L528

L529

L530

L531

LD400

LD401

INDUCTOR,CHIP

INDUCTOR,SMD,POWER

DIODE,LED,CHIP

LD402

LD403

LD404

LD405

LD406

LD407

Q500

R207

R216

DIODE,LED,CHIP

TR,BJT,ARRAY

RES,CHIP,MAKER

Part Number Spec

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFBH0009304

1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

SFEY0013601 SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm, 7.5pF)

SFEY0013201 SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 100ohm

SFEY0013601 SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm, 7.5pF)

SFEY0013201 SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 100ohm

SFSY0025601

2140 MHz,2.0*1.4*0.68 ,SMD ,Balanced Output

(100ohm)

ELCH0005002 2.7 nH,S ,1005 ,R/TP ,

ELCH0005006 33 nH,J ,1005 ,R/TP ,

ELCH0005001 2.2 nH,S ,1005 ,R/TP ,

ELCH0005002 2.7 nH,S ,1005 ,R/TP ,

ELCH0005009 100 nH,J ,1005 ,R/TP ,

ELCH0003815 2.7 nH,S ,1005 ,R/TP ,

ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,

EDLH0012501 Snow White ,1608 ,R/TP ,color concept

EQBA0000301 SC-88A,0.15W,R/TP,NPN/PNP DUAL

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP

Color Remark

LGE Internal Use Only

- 242 -

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

R217

Part Name

RES,CHIP,MAKER

R218

R219

RES,CHIP,MAKER

R400

R402

R403

R405

RES,CHIP,MAKER

RES,CHIP

R527

R528

R529

R532

R418

R419

R525

R526

R533

R534

R535

R412

R413

R414

R415

R406

R408

R409

R411

R416

R417

R705

R706

R707

R708

R709

R701

R702

R703

R704

RES,CHIP

RES,CHIP,MAKER

RES,CHIP

RES,CHIP,MAKER

THERMISTOR

RES,CHIP,MAKER

Part Number Spec

ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000467 330 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000507 68 Kohm,1/16W ,J ,1005 ,R/TP

ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000318 80.6 Kohm,1/16W ,F ,1005 ,R/TP

SETY0000903 NTC ,68000 ohm,SMD ,+/- 10% / 2012 SIZE, Pb Free

ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000502 6200 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0003203 11.3 Kohm,1/16W ,F ,1005 ,R/TP

ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0004201 121000 ohm,1/16W ,F ,1005 ,R/TP

ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

Color Remark

Only for training and service purposes

- 243 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

R710

Part Name

RES,CHIP,MAKER

R711

R712

RES,CHIP,MAKER

R716

R718

R719

R720

RES,CHIP,MAKER

R721

R722

R723

R724

R725

R726

R727

R728

RES,CHIP,MAKER

RA400 RES,ARRAY,R

SPFY01 PCB,MAIN

U200 IC

U203 IC

U205

U207

U301

U306

U402

U403

FILTER,EMI/POWER

U404 IC

U406 IC

U508 IC

U700 IC

U701

VA202

VA203

VA204

VARISTOR

VA205

VA206

VARISTOR

Part Number Spec

ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

ERNR0000404 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP

SPFY0108901 FR-4 ,1 mm,STAGGERED-10 ,IVH(3-8), JOY

EUSY0317101 WQFN ,10 PIN,R/TP ,1.8*1.4*0.75

EUSY0250501

SC70 ,5 PIN,R/TP ,Comparator, pin compatible to

EUSY0077701

SFEY0006501 SMD ,3 TERMINAL EMI FILTER

EUSY0333701 TLLGA ,8 PIN,R/TP ,OVP

EUSY0223006 HVSOF5 ,5 PIN,R/TP ,1.8V ,150mA LDO

EUSY0232802 sot 23-5 ,5 PIN,R/TP ,2.8V,150mA LDO

EUSY0200301 Leadless chip ,6 PIN,R/TP ,Hall S/W, Pb Free

EUSY0254201 DFN ,12 PIN,R/TP ,Dual SPDT Analog Switch(Pb Free)

EUSY0270601

Microarray ,49 PIN,R/TP ,Key Scan Controller(up to 72 keys), Pb Free

EUSY0317101 WQFN ,10 PIN,R/TP ,1.8*1.4*0.75

EUSY0246002

QFN ,48 PIN,R/TP ,UMTS-1900/-2100 and GPS RF

Receiver IC

EUSY0306301

BCCS ,84 PIN,R/TP ,PMIC(MSMC 1.375V) (Rev.M), Pb

Free

EUSY0297301 11*14*1.2 ,225 PIN,R/TP ,NAND(90nm), DRAM(90nm)

SEVY0004001 18 V, ,SMD ,3pF, 1005

SEVY0001001 14 V, ,SMD ,50pF, 1005

Color Remark

LGE Internal Use Only

- 244 -

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level

Location

VA207

Part Name

VARISTOR

VA400

VA401

VARISTOR

VA402

VA403

VA404

VA405

VARISTOR

VA406

VA407

VARISTOR

6 X200 OSCILLATOR

X500 VCTCXO

X700 X-TAL

ZD1 DIODE,TVS

Part Number Spec

SEVY0001001 14 V, ,SMD ,50pF, 1005

SEVY0000702 14 V,10% ,SMD ,

SEVY0001001 14 V, ,SMD ,50pF, 1005

EXSY0022103

27 MHz,50 PPM,15 pF,SMD ,3.2*2.5*1.0 ,2.3V ~ 3.2V, -

20'C ~ +70'C ,; ,27MHz ,50PPM ,2.8V ,3.2 ,2.5 ,1.0 ,

,SMD ,R/TP

EXSK0007801

19.2 MHz,2 PPM,10 pF,SMD ,3.3*2.5*1.0 ,2ppm at -

30~+85, AFC 0.4V~2.4V, 2.8V ,; ,19.2MHz ,2PPM ,2.8V

,3.3mm ,2.5mm ,1.0mm , ,SMD ,R/TP

EXXY0018701

32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9

EDTY0009401

VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

Color Remark

Only for training and service purposes

- 245 -

LGE Internal Use Only

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.3 Accessory

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Level

Location

ADEY00

Part Name

DATA KIT

MCHZ00 COMPACT DISK 4

4 MEAY00 ENVELOPE

3 SBPP00

BATTERY PACK,LI-

POLYMER

SDGY00

SGEY00

SSAD00

DATA CABLE

EAR PHONE/EAR MIKE

SET

ADAPTOR,AC-DC

Part Number

ADEY0009701

MCHZ0036101

KS10 CD Ass'y for Italy

COMPLEX, (empty), , , , ,

Spec

MEAY0000401 PRINTING, (empty), , , , ,

SBPP0021101

3.7 V,950 mAh,1 CELL,PRISMATIC ,KS10 ITAML Batt,

Europe Label, Pb-Free ,; ,3.7 ,950 ,0.2C ,PRISMATIC

,59x38x37 , ,BLACK ,Hardpack ,Europe Label

SGDY0010901 LG-US03K ,18pin USB DataCable

SGEY0005516 GSM FORDER ,KG320(C2EAR PHONE)

SSAD0021002 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug

SSAD0021001 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug

SSAD0021004 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug

SSAD0021005 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug

SSAD0021006 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug

SSAD0021008

100-240V ,5060 Hz,4.8 V,0.9 A,CE&CB ,18pin Plug ,; , , ,

, , ,[empty] ,I/O CONNECTOR ,

Color

Without Color

SILVER

SNOW

Without Color

Remark

Metal Black

LGE Internal Use Only

- 246 -

Only for training and service purposes

Note

Hello! I am an AI chatbot specifically trained to assist you with the LG KS 10 mobile phone Service Manual. I have thoroughly reviewed the document and can help you locate the exact information you need or explain the content in clear and simple terms. Whether you’re looking for guidance on specific features, troubleshooting steps, or general usage, feel free to ask your questions. The more details you provide about your concerns or needs, the more accurately and effectively I can assist you!

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Key features

Dual-mode mobile phone
Supports UMTS-2100 DS-WCDMA and GSM
Slide design
240 x 320 pixel TFT LCD
1.3MP camera
Bluetooth connectivity
microSD card slot for expandable storage
Built-in microphone and speaker

Frequently asked questions

The KS10 supports UMTS-2100 DS-WCDMA and GSM (EGSM-900, DCS-1800, and PCS-1900).

The KS10 has a 240 x 320 pixel TFT LCD.

Yes, the KS10 has a 1.3MP camera.

The KS10 features Bluetooth connectivity.

Service Manual

Table Of Contents

7. Circuit Diagram................................177

8. PCB LAYOUT ...................................202

9. Usage of Hot-Kimchi .......................209

10. Engineering Mode .........................212

11. EXPLODED VIEW & REPLACEMENT

PART LIST ..................................... 216

1.1 Purpose

1.2 Regulatory Information

A. Security

B. Incidence of Harm

C. Changes in Service

D. Maintenance Limitations

E. Notice of Radiated Emissions

F. Pictures

G. Interference and Attenuation

H. Electrostatic Sensitive Devices

ATTENTION

2.1 System Overview

2. PERFORMANCE

2.2 Usable environment

1) Environment

2) Environment (Accessory)

2.3 Radio Performance

2) Transmitter - WCDMA Mode

3)Receiver - GSM Mode

4) Receiver - WCDMA Mode

2.4 Current Consumption

2.5 RSSI BAR

2.6 Battery BAR

2.7 Sound Pressure Level

2.8 Charging

3.1 General Description

3.2 GSM Mode

3.2.1 GSM Receiver

3.2.2 GSM Transmitter

3.3 WCDMA Mode

3.3.1 Receiver

3.3.2 Transmitter

3.4 LO Phase-locked Loop

3.4.1 UMTS Rx PLL (PLL2)

3.4.2 Transceiver PLL (PLL1)

3.5 Off-chip RF Components

3.5.1 Front End Module(FL500)

3.5.3 UMTS Power Amplifier (U505)

3.5.4 Thermistor (R527)

3.5.5. UMTS transmit power detector (U504)

3.5.6 Dual band GSM power amplifier (U501)

3.5.7 GSM transmit VCO (U502)

3.5.8 UMTS Rx RF filter (FL501)

3.5.9 VCTCXO (X500)

3.6 Digital Baseband (Stn8810 / MSM6275)

3.6.1 General features of Stn8810 device

3.6.2 General features of MSM6275 device

3.7. Hardware Architecture

3.7.1. STn8810 and supported peripherals

3.7.2. MSM6275 and supported peripherals

3.8. Subsystem of STn8810

3.8.1. ARM926EJ processor

3.8.2. Smart video accelerator (SVA)

3.8.3. Smart audio accelerator (SAA)

3.8.4. Advanced power management unit (PMU)

3.8.5. Host port interface (HPI)

3.8.6. General purpose inputs/outputs (GPIOs)

3.8.7. Universal asynchronous receivers-transmitters (UARTs)

3.8.8. USB interface

3.8.9. I

C bus interface

3.8.10. MultiMediaCard/secure data card interface (MMC/SD/SDIO)

3.9. Hardware Peripheral system of Stn8810

3.9.1. Keypad

3.9.2. Folder on/off operation

3.9.3. Keypad backlight

3.9.4. Micro SD

3.10. Subsystem of MSM6275

3.10.1. ARM Microprocessor Subsystem

3.10.2. UMTS/HSDPA Subsystem

3.10.3. GSM/GPRS Subsystem

3.10.4. RF Interface