TCV7100F - Toshiba America Electronic Components
TCV7100F
TOSHIBA CMOS Integrated Circuit Silicon Monolithic
TCV7100F
Buck DC-DC Converter IC
The TCV7100F is a single-chip buck DC-DC converter IC. The
TCV7100F contains high-speed and low-on-resistance power
MOSFETs for the main switch and synchronous rectifier to achieve
high efficiency.
Features
•
Enables up to 2.5 A of load current (IOUT) with a minimum of
external components.
•
High efficiency: η = 95% (typ.)
(@VIN = 5 V, VOUT = 3.3 V, IOUT = 1 A)
HSON8-P-0505-1.27
Weight: 0.068 g (typ.)
•
Operating voltage range: VIN = 2.7 to 5.5 V
•
Low ON-resistance: RDS (ON) = 0.12 Ω (high side) / 0.12 Ω (low-side) typical (@VIN = 5 V, Tj = 25°C)
•
High oscillation frequency: fOSC = 800 kHz (typ.)
•
Feedback voltage: VFB = 0.8 V ± 1% (@Tj = 25°C)
•
Uses internal phase compensation to achieve high efficiency with a minimum of external components.
•
Allows the use of a small surface-mount ceramic capacitor as an output filter capacitor.
•
Housed in a small surface-mount package (SOP Advance) with a low thermal resistance.
•
Soft-start time adjustable by an external capacitor
Part Marking
Pin Assignment
LX
Part Number (or abbreviation code)
8
EN
SS
7
6
VFB
5
Lot No.
TCV
7100F
The dot (•) on the top surface indicates pin 1.
*:
1
2
3
4
PGND
VIN1
VIN2
SGND
The lot number consists of three digits. The first digit represents the last digit of the year of manufacture, and the
following two digits indicates the week of manufacture between 01 and either 52 or 53.
Manufacturing week code
(The first week of the year is 01; the last week is 52 or 53.)
Manufacturing year code (last digit of the year of manufacture)
This product has a MOS structure and is sensitive to electrostatic discharge. Handle with care.
The product(s) in this document (“Product”) contain functions intended to protect the Product from temporary
small overloads such as minor short-term overcurrent, or overheating. The protective functions do not necessarily
protect Product under all circumstances. When incorporating Product into your system, please design the system (1)
to avoid such overloads upon the Product, and (2) to shut down or otherwise relieve the Product of such overload
conditions immediately upon occurrence. For details, please refer to the notes appearing below in this document and
other documents referenced in this document.
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TCV7100F
Ordering Information
Part Number
Shipping
TCV7100F (TE12L, Q)
Embossed tape (3000 units per reel)
Block Diagram
VIN2
VIN1
Current detection
Oscillator
Under
voltage
lockout
Slope
Compensation
Control logic
Driver
LX
Constant-current
source (8 μA)
VFB
Short-Circuit
Protection
Error amplifier
SS
Phase compensation
EN
Soft Start
PGND
Ref. Voltage (0.8 V)
SGND
Pin Description
Pin No.
Symbol
1
PGND
2
VIN1
3
VIN2
4
SGND
5
VFB
Description
Ground pin for the output section
Input pin for the output section
This pin is placed in the standby state if VEN = low. Standby current is 10 μA or less.
Input pin for the control section
This pin is placed in the standby state if VEN = low. Standby current is 10 μA or less.
Ground pin for the control section
Feedback pin
This input is fed into an internal error amplifier with a reference voltage of 0.8 V (typ.).
Soft-start pin
6
SS
When the SS input is left open, the soft-start time is 1 ms (typ.). The soft-start time can be adjusted
with an external capacitor. The external capacitor is charged from a 8-μA (typ.) constant-current
source, and the reference voltage of the error amplifier is regulated between 0 V and 0.8 V. The
external capacitor is discharged when EN = low and in case of undervoltage lockout or thermal
shutdown.
Enable pin
7
EN
When EN ≥ 1.5 V (@ VIN = 5 V), the internal circuitry is allowed to operate and thus enable the
switching operation of the output section. When EN ≤ 0.5 V (@ VIN = 5 V), the internal circuitry is
disabled, putting the TCV7100F in Standby mode.
This pin has an internal pull-down resistor of approx. 500 kΩ.
8
LX
Switch pin
This pin is connected to high-side P-channel MOSFET and low-side N-channel MOSFET.
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TCV7100F
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Input pin voltage for the output section
VIN1
−0.3 to 6
V
Input pin voltage for the control section
VIN2
−0.3 to 6
V
Feedback pin voltage
VFB
−0.3 to 6
V
Soft-start pin voltage
VSS
−0.3 to 6
V
Enable pin voltage
VEN
−0.3 to 6
V
VEN-VIN2
VEN – VIN2 < 0.3
V
VLX
−0.3 to 6
V
ILX
±3.0
A
PD
2.2
W
Tjopr
−40 to125
°C
Tj
150
°C
Tstg
−55 to150
°C
VEN – VIN2 voltage difference
Switch pin voltage
(Note 1)
Switch pin current
Power dissipation
(Note 2)
Operating junction temperature
Junction temperature
(Note 3)
Storage temperature
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc)
Note 1: The switch pin voltage (VLX) doesn’t include the peak voltage generated by TCV7100F’s switching.
A negative voltage generated in dead time is permitted among the switch pin current (ILX).
Thermal Resistance Characteristics
Characteristics
Symbol
Max
Unit
Thermal resistance, junction to ambient
Rth (j-a)
44.6
(Note 2)
°C/W
Thermal resistance, junction to case
Rth (j-c)
4.17
°C/W
Note 2:
Glass epoxy board
FR-4
25.4 × 25.4 × 0.8
(Unit: mm)
Single-pulse measurement: pulse width t=10(s)
Note 3: The TCV7100F may into thermal shutdown at the rated maximum junction temperature. Thermal design is
required to ensure that the rated maximum operating junction temperature, Tjopr, will not be exceeded.
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TCV7100F
Electrical Characteristics (Tj = 25°C, VIN1 = VIN2 = 2.7 to 5.5 V, unless otherwise specified)
Characteristics
Operating input voltage
Operating current
Symbol
Test Condition
Min
Typ.
Max
Unit
VIN (OPR)
⎯
2.7
⎯
5.5
V
VIN1 = VIN2 = VEN = VFB = 5 V
⎯
450
600
μA
VOUT (OPR)
VEN = VIN1 = VIN2
0.8
⎯
⎯
V
IIN (STBY) 1
VIN1 = VIN2 = 5 V, VEN = 0 V
VFB = 0.8 V
⎯
⎯
10
IIN (STBY) 2
VIN1 = VIN2 = 3.3 V, VEN = 0 V
VFB = 0.8 V
⎯
⎯
10
ILEAK (H)
VIN1 = VIN2 = 5 V, VEN = 0 V
VFB = 0.8 V, VLX = 0 V
⎯
⎯
10
VIH (EN) 1
VIN1 = VIN2 = 5 V
1.5
⎯
⎯
VIH (EN) 2
VIN1 = VIN2 = 3.3 V
1.5
⎯
⎯
VIL (EN) 1
VIN1 = VIN2 = 5 V
⎯
⎯
0.5
VIL (EN) 2
VIN1 = VIN2 = 3.3 V
⎯
⎯
0.5
IIH (EN) 1
VIN1 = VIN2 = 5 V, VEN = 5 V
6
⎯
13
IIH (EN) 2
VIN1 = VIN2 = 3.3 V, VEN = 3.3 V
4
⎯
9
0.792
0.8
0.808
0.792
0.8
0.808
VIN1 = VIN2 = 2.7 to 5.5 V
VFB = VIN2
−1
⎯
1
RDS (ON) (H) 1
VIN1 = VIN2 = 5 V, VEN = 5 V
ILX = −1 A
⎯
0.12
⎯
RDS (ON) (H) 2
VIN1 = VIN2 = 3.3 V, VEN = 3.3 V
ILX = −1 A
⎯
0.13
⎯
RDS (ON) (L) 1
VIN1 = VIN2 = 5 V, VEN = 5 V
ILX = 1 A
⎯
0.12
⎯
RDS (ON) (L) 2
VIN1 = VIN2 = 3.3 V, VEN = 3.3 V
ILX = 1 A
⎯
0.13
⎯
VIN1 = VIN2 = VEN = 5 V
640
800
960
kHz
0.5
1
1.5
ms
IIN
Output voltage range
Standby current
High-side switch leakage current
EN threshold voltage
EN input current
VFB1
VFB input voltage
VFB2
VFB input current
IFB
High-side switch on-state resistance
Low-side switch on-state resistance
Oscillation frequency
fOSC
VIN = 5 V, VEN = 5 V
Tj = 0 to 85℃
VIN = 3.3 V, VEN = 3.3 V
Tj = 0 to 85℃
μA
μA
V
μA
V
μA
Ω
Ω
Internal soft-start time
tSS
VIN1 = VIN2 = 5 V, IOUT = 0 A,
Measured between 0% and 90% points
at VOUT.
External soft-start charge current
ISS
VIN1 = VIN2 = 5 V, VEN = 5 V
−5
−8
−11
μA
VIN1 = VIN2 = 2.7 to 5.5 V
⎯
⎯
100
%
TSD
VIN1 = VIN2 = 5 V
⎯
150
⎯
Hysteresis
ΔTSD
VIN1 = VIN2 = 5 V
⎯
15
⎯
Detection voltage
VUV
VEN = VIN1 = VIN2
2.35
2.45
2.6
Recovery voltage
VUVR
VEN = VIN1 = VIN2
2.45
2.55
2.7
Hysteresis
ΔVUV
VEN = VIN1 = VIN2
⎯
0.1
⎯
VIN1 = VIN2 = 5 V, VOUT = 2 V
2.9
4.2
⎯
High-side switch duty cycle
Thermal
shutdown (TSD)
Undervoltage
lockout (UVLO)
LX current limit
Detection
temperature
Dmax
ILIM
4
°C
V
A
2010-02-24
TCV7100F
Note on Electrical Characteristics
The test condition Tj = 25°C means a state where any drifts in electrical characteristics incurred by an increase in
the chip’s junction temperature can be ignored during pulse testing.
Application Circuit Example
Figure 1 shows a typical application circuit using a low-ESR electrolytic or ceramic capacitor for COUT.
VIN
VIN1
VIN2
EN
EN
CIN
CC
LX
L
TCV7100F
VOUT
RFB1
VFB
SS
COUT
CSS
SGND
PGND
RFB2
GND
GND
Figure 1 TCV7100F Application Circuit Example
Component values (reference [email protected] VIN = 5 V, VOUT = 3.3 V, Ta = 25°C)
CIN: Input filter capacitor = 10 μF
(ceramic capacitor: GRM21BB30J106K manufactured by Murata Manufacturing Co., Ltd.)
COUT: Output filter capacitor = 47 μF
(ceramic capacitor: GRM31CB30J476M manufactured by Murata Manufacturing Co., Ltd.)
RFB1: Output voltage setting resistor = 7.5 kΩ
RFB2: Output voltage setting resistor = 2.4 kΩ
L: Inductor = 2.2 μH (RLF7030T-2R2M5R4 manufactured by TDK-EPC Corporation)
CSS is a capacitor for adjusting the soft-start time.
CC is a decoupling capacitor of Input pin for the control section.
(Connect it when the circuit operation is unstable due to the board layout or a feature of the CIN.)
Examples of Component Values (For Reference Only)
Output Voltage Setting
VOUT
Inductance
L
Input Capacitance
CIN
Output Capacitance
COUT
Feedback Resistor
RFB1
Feedback Resistor
RFB2
1.2 V
2.2 μH
10 μF
68 μF
7.5 kΩ
15 kΩ
1.51 V
2.2 μH
10 μF
68 μF
16 kΩ
18 kΩ
1.8 V
2.2 μH
10 μF
68 μF
15 kΩ
12 kΩ
2.5 V
2.2 μH
10 μF
47 μF
5.1 kΩ
2.4 kΩ
3.3 V
2.2 μH
10 μF
47 μF
7.5 kΩ
2.4 kΩ
Component values need to be adjusted, depending on the TCV7100F’s I/O conditions and the board layout.
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TCV7100F
Application Notes
Inductor Selection
The inductance required for inductor L can be calculated as follows:
VIN: Input voltage (V)
VIN − VOUT VOUT
VOUT: Output voltage (V)
L=
⋅
············· (1)
fosc ⋅ ΔIL
VIN
fosc: Oscillation frequency = 800 kHz (typ.)
ΔIL: Inductor ripple current (A)
*: Generally, ΔIL should be set to approximately 30% of the maximum output current. Since the maximum
output current of the TCV7100F is 2.5 A, ΔIL should be 0.75 A or so. The inductor should have a current
rating greater than the peak output current of 2.9 A. If the inductor current rating is exceeded, the inductor
becomes saturated, leading to an unstable DC-DC converter operation.
L=
=
VIN − VOUT VOUT
⋅
fosc ⋅ ΔIL
VIN
5 V − 3.3 V 3.3 V ············ (2)
⋅
800kHz ⋅ 0.75A 5 V
ΔIL
When VIN = 5 V and VOUT = 3.3 V, the required inductance can be calculated as follows. Be sure to select an
appropriate inductor, taking the input voltage range into account.
IL
0
T=
= 1.87 μH
V
TON = Τ ⋅ OUT
VIN
1
fosc
Figure 2 Inductor Current Waveform
Setting the Output Voltage
A resistive voltage divider is connected as shown in Figure 3 to set the output voltage; it is given by Equation 3
based on the reference voltage of the error amplifier (0.8 V typ.), which is connected to the Feedback pin, VFB.
RFB1 should be up to 30 kΩ or so, because an extremely large-value RFB1 incurs a delay due to parasitic
capacitance at the VFB pin. It is recommended that resistors with a precision of ±1% or higher be used for RFB1
and RFB2.
LX
VFB
⎛
⎞
R
= 0.8 V × ⎜⎜1 + FB1 ⎟⎟ ·········· (3)
R
FB2 ⎠
⎝
VOUT
RFB2 RFB1
⎛
⎞
R
VOUT = VFB ⋅ ⎜⎜1 + FB1 ⎟⎟
R
FB2 ⎠
⎝
Figure 3 Output Voltage Setting Resistors
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TCV7100F
Output Filter Capacitor Selection
Use a low-ESR electrolytic or ceramic capacitor as the output filter capacitor. Since a capacitor is generally
sensitive to temperature, choose one with excellent temperature characteristics. As a rule of thumb, its
capacitance should be 30 μF or greater for applications where VOUT ≥ 2 V, and 60 μF or greater for applications
where VOUT < 2 V. The capacitance should be set to an optimal value that meets the system’s ripple voltage
requirement and transient load response characteristics. The phase margin tends to decrease as the output
voltage is getting low. Enlarge a capacitance for output flatness when phase margin is insufficient, or the
transient load response characteristics cannot be satisfied. Since the ceramic capacitor has a very low ESR value,
it helps reduce the output ripple voltage; however, because the ceramic capacitor provides less phase margin, it
should be thoroughly evaluated.
Output filter capacitors with a smaller value mentioned above can be used by adding a phase compensation
circuit to the VFB pin. For example, suppose using two 10-μF ceramic capacitors as output filter capacitors; then
the phase compensation circuit should be programmed as follows:
*
*
VFB
20 μF
CP1
RFB1
VOUT
COUT
Set the upper cut-off frequency of CP1 and RFB1 to
approx. 80 kHz (fOSC/10). ····················· (4)
Choose the value of CP2 to produce zero-frequency at
1/10th the upper cut-off frequency. ········· (5)
If RFB2 is less than half of RFB1, RP and CP2 are not
necessary.··········································· (6)
(Only CP1 allows programming of VOUT above
1.8 V.)
RFB2
*
LX
RP CP2
CP1 (μF) = 2 / RFB1 (Ω) ··············· (4)
CP2 (μF) = CP1 (μF) × 10 ············· (5)
RFB2 // RP = RFB1 / 2 ····················· (6)
Figure 4 Phase Compensation Circuit
Examples of Component Values in the Phase Compensation Circuit (For Reference Only)
The following values need tuning, depending on the TCV7100F’s I/O conditions and the board layout.
VOUT
COUT
RFB1
RFB2
RP
CP1
CP2
1.2 V
10 μF × 2
7.5 kΩ
15 kΩ
4.7 kΩ
270 pF
2700 pF
1.51 V
10 μF × 2
16 kΩ
18 kΩ
15 kΩ
120 pF
1200 pF
1.8 V
10 μF × 2
15 kΩ
12 kΩ
⎯
180 pF
⎯
2.5 V
10 μF × 2
5.1 kΩ
2.4 kΩ
⎯
390 pF
⎯
3.3 V
10 μF × 2
7.5 kΩ
2.4 kΩ
⎯
270 pF
⎯
The phase compensation circuit shown above delivers good transient load response characteristics with
small-value output filter capacitors by programming f0 (the frequency at which the open-loop gain is equal to
0dB) to a high frequency. For output filter capacitors, use low-ESR ceramic capacitors with excellent temperature
characteristics (such as the JIS B characteristic). Although the external phase compensation circuit improves
noise immunity, they should be thoroughly evaluated to ensure that the system’s ripple voltage requirement and
transient load response characteristics are met.
Soft-Start Feature
The TCV7100F has a soft-start feature.
If the SS pin is left open, the soft-start time, tSS, for VOUT defaults to 1 ms (typ.) internally.
The soft-start time can be extended by adding an external capacitor (CSS) between the SS and SGND pins. The
soft-start time can be calculated as follows:
t SS2 = 0.1 ⋅ C SS ··························· (7)
tSS2: Soft-start time (in seconds) when an external capacitor is
connected between SS and SGND.
CSS: Capacitor value (μF)
The soft-start feature is activated when the TCV7100F exits the undervoltage lockout (UVLO) state after
power-up and when the voltage at the EN pin has changed from logic low to logic high.
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TCV7100F
Overcurrent Protection(OCP)
The TCV7100F has maximum current limiting. The TCV7100F limits the ON time of high side switching
transistor and decreases output voltage when the peak value of the Lx terminal current exceeds switching
terminal peak current limitation ILIM=4.2A(typ.).
Undervoltage Lockout (UVLO)
The TCV7100F has undervoltage lockout (UVLO) protection circuitry. The TCV7100F does not provide output
voltage (VOUT) until the input voltage has reached VUVR (2.55 V typ.). UVLO has hysteresis of 0.1 V (typ.). After
the switch turns on, if VIN2 drops below VUV (2.45 V typ.), UVLO shuts off the switch at VOUT.
Undervoltage lockout
recovery voltage VUVR
Undervoltage lockout
detection voltage VUV
VIN2
Hysteresis: ΔVUV
GND
Switching operation starts
VOUT
GND
Switching operation
stops
Soft start
Figure 5 Undervoltage Lockout Operation
Thermal Shutdown (TSD)
The TCV7100F provides thermal shutdown. When the junction temperature continues to rise and reaches TSD
(150°C typ.), the TCV7100F goes into thermal shutdown and shuts off the power supply. TSD has a hysteresis of
about 15°C (typ.). The device is enabled again when the junction temperature has dropped by approximately
15°C from the TSD trip point. The device resumes the power supply when the soft-start circuit is activated upon
recovery from TSD state.
Thermal shutdown is intended to protect the device against abnormal system conditions. It should be ensured
that the TSD circuit will not be activated during normal operation of the system.
TSD detection
temperature: TSD
Recovery from TSD
Hysteresis: ΔTSD
Tj
0
Switching operation starts
VOUT
GND
Switching operation stops
Soft start
Figure 6 Thermal Shutdown Operation
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TCV7100F
Usage Precautions
•
The input voltage, output voltage, output current and temperature conditions should be considered when
selecting capacitors, inductors and resistors. These components should be evaluated on an actual system
prototype for best selection.
•
External components such as capacitors, inductors and resistors should be placed as close to the TCV7100F as
possible.
•
The TCV7100F has an ESD diode between the EN and VIN2 pins. The voltage between these pins should satisfy
VEN − VIN2 < 0.3 V.
•
CIN should be connected as close to the PGND and VIN1 pins as possible. Operation might become unstable due
to board layout. In that case, add a decoupling capacitor (CC) of 0.1 μF to 1 μF between the SGND and VIN2 pins.
•
The minimum programmable output voltage is 0.8 V (typ.). If the difference between the input and output
voltages is small, the output voltage might not be regulated accurately and fluctuate significantly.
•
When TCV7100F is in operation, a negative voltage is generated since regeneration current flows through the
switch pin (LX). Even if the current flows through the low side parasitic diode during the dead time of switching
transistor, operation is undisturbed so an external flywheel diode is unnecessary. If there is the possibility of an
external negative voltage generation, add a diode for protection.
•
SGND pin is connected with the back of IC chip and serves as the heat radiation pin. Secure the area of a GND
pattern as large as possible for greater of heat radiation.
•
The overcurrent protection circuits in the Product are designed to temporarily protect Product from minor
overcurrent of brief duration. When the overcurrent protective function in the Product activates, immediately
cease application of overcurrent to Product. Improper usage of Product, such as application of current to Product
exceeding the absolute maximum ratings, could cause the overcurrent protection circuit not to operate properly
and/or damage Product permanently even before the protection circuit starts to operate.
•
The thermal shutdown circuits in the Product are designed to temporarily protect Product from minor
overheating of brief duration. When the overheating protective function in the Product activates, immediately
correct the overheating situation. Improper usage of Product, such as the application of heat to Product
exceeding the absolute maximum ratings, could cause the overheating protection circuit not to operate properly
and/or damage Product permanently even before the protection circuit starts to operate.
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TCV7100F
Typical Performance Characteristics
IIN – VIN
IIN – Tj
600
600
(μA)
IIN
400
Operating current
Operating current
IIN
(μA)
VEN = VFB = VIN
Tj = 25°C
200
2
4
Input voltage
VIN
200
0
−50
0
0
400
6
VEN = VIN = 5 V
VFB = VIN
−25
EN threshold voltage
VIH(EN), VIL(EN) (V)
Operating current
IIN
(μA)
0
25
50
Junction temperature
Tj
75
Tj
100
125
(°C)
1.5
VIH(EN)
1
VIL(EN)
0.5
0
125
−50
−25
(°C)
0
25
VIH(EN), VIL(EN) – Tj
75
50
Junction temperature
Tj
100
125
(°C)
IIH(EN) – VEN
2
20
VIN = 5.5 V
VIN = 3.3 V
Tj = 25°C
16
EN input current
IIH(EN) (μA)
1.5
EN threshold voltage
VIH(EN), VIL(EN) (V)
100
VIN = 5 V
200
−25
75
VIH(EN), VIL(EN) – Tj
VEN = VIN = 3.3 V
VFB = VIN
−50
50
2
400
0
25
Junction temperature
(V)
IIN – Tj
600
0
VIH(EN)
1
VIL(EN)
12
8
0.5
4
0
0
−50
−25
0
25
50
Junction temperature
75
Tj
100
125
0
(°C)
1
2
3
4
EN input voltage VEN
10
5
6
(V)
2010-02-24
TCV7100F
IIH(EN) – Tj
VUV, VUVR – Tj
20
2.6
VIN = 5 V
VEN = 5 V
Undervoltage lockout voltage
VUV, VUVR (V)
EN input current
IIH(EN) (μA)
16
12
8
4
Recovery voltage
(VUVR)
2.5
Detection voltage
(VUV)
2.4
VEN = VIN
0
−50
−25
0
25
50
75
Junction temperature
Tj
100
2.3
−50
125
−25
(°C)
0
25
50
75
Junction temperature
VOUT – VIN
(V)
1.5
VFB input voltage VFB
(V)
Output voltage VOUT
(°C)
VEN = VIN
VOUT = 1.2 V
Tj = 25°C
VEN = VIN
Tj = 25°C
1
0.5
0
0.81
0.8
0.79
0.78
2.2
2.3
2.4
2.5
Input voltage
VIN
2.6
2.7
2
3
(V)
4
Input voltage
VFB – Tj
0.82
VIN
6
(V)
VFB – Tj
VFB (V)
VIN = 5 V
VOUT = 1.2 V
VEN = VIN
0.81
0.8
0.79
0.78
−50
5
0.82
VFB input voltage
VFB (V)
125
VFB – VIN
0.82
2
VFB input voltage
Tj
100
VIN = 3.3 V
VOUT = 1.2 V
VEN = VIN
0.81
0.8
0.79
0.78
−25
0
25
50
Junction temperature
75
Tj
100
−50
125
(°C)
−25
0
25
50
Junction temperature
11
75
Tj
100
125
(°C)
2010-02-24
TCV7100F
fosc – VIN
fosc – Tj
1000
fosc (kHz)
Tj = 25°C
900
Oscillation frequency
Oscillation frequency
fosc (kHz)
1000
800
700
600
2
3
4
Input voltage
5
VIN
VIN = 5 V
900
800
700
600
−50
6
−25
(V)
0
25
50
Junction temperature
ISS – VIN
75
Tj
(°C)
ISS – Tj
VIN = 5 V
Tj = 25°C
−2
External soft-start charge current
ISS (μA)
External soft-start charge current
ISS (μA)
125
0
0
−4
−6
−8
−10
−12
100
2
3
4
Input voltage
5
VIN
−2
−4
−6
−8
−10
−12
−50
6
(V)
−25
0
25
50
Junction temperature
75
Tj
100
125
(°C)
ISS – Tj
0
External soft-start charge current
ISS (μA)
VIN = 3.3 V
−2
−4
−6
−8
−10
−12
−50
−25
0
25
50
Junction temperature
75
Tj
100
125
(°C)
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2010-02-24
TCV7100F
ΔVOUT – IOUT
ΔVOUT – IOUT
20
(mV)
10
VIN = 5 V, VOUT = 3.3 V
L = 2.2 μH, COUT = 47 μF
Ta = 25°C
Output voltage ΔVOUT
(mV)
20
Output voltage ΔVOUT
30
0
−10
−20
−30
VIN = 5 V, VOUT = 1.2 V
L = 2.2 μH, COUT = 68 μF
Ta = 25°C
10
0
−10
−20
0
1
2
Output current
IOUT
3
0
(A)
1
Output current
ΔVOUT – IOUT
VIN = 3.3 V, VOUT = 1.2 V
L = 2.2 μH, COUT = 68 μF
Ta = 25°C
VOUT = 3.3 V, IOUT = 10 mA
L = 2.2 μH, COUT = 47 μF
Ta = 25°C
(mV)
30
10
Output voltage ΔVOUT
(mV)
Output voltage ΔVOUT
(A)
40
0
−10
−20
0
20
10
0
−10
−20
−30
−40
1
2
Output current
IOUT
3
2
(A)
3
4
Input voltage
ΔVOUT – VIN
5
VIN
6
(V)
η – IOUT
20
100
VOUT = 1.2 V, IOUT = 10 mA
L = 2.2 μH, COUT = 68 μF
Ta = 25°C
80
(%)
10
Efficiency η
(mV)
IOUT
3
ΔVOUT – VIN
20
Output voltage ΔVOUT
2
0
−10
−20
60
40
VIN = 5 V, VOUT = 3.3 V
L = 2.2 μH, COUT = 47 μF
Ta = 25°C
20
0
2
3
4
Input voltage
5
VIN
6
0
(V)
1
Output current
13
2
IOUT
3
(A)
2010-02-24
TCV7100F
η – IOUT
η – IOUT
80
80
60
Efficiency η
Efficiency η
(%)
100
(%)
100
40
VIN = 5 V, VOUT = 1.2 V
L = 2.2 μH, COUT = 68 μF
Ta = 25°C
20
0
0
60
40
VIN = 3.3 V, VOUT = 1.2 V
L = 2.2 μH, COUT = 68 μF
Ta = 25°C
20
0
1
2
Output current
IOUT
0
3
(A)
IOUT
3
(A)
Overcurrent Protection
4
2
Output voltage VOUT
1.5
1
Input voltage:
VIN = 2.7 V
VOUT = 3.3 V, Ta = 25°C
L = 2.2 μH, COUT = 47 μF
(V)
VOUT = 1.2 V, Ta = 25°C
L = 2.2 μH, COUT = 68 μF
(V)
Output voltage VOUT
2
Output current
Overcurrent Protection
Input voltage:
VIN = 5.5 V
0.5
0
1
3
Input voltage:
VIN = 5.5 V
2
1
0
2
3
4
Output current
IOUT
5
2
(A)
3
4
Output current
Startup Characteristics
(Internal Soft-Start Time)
IOUT
5
(A)
Startup Characteristics
(CSS = 0.1 μF)
VIN = 5 V
VOUT = 3.3 V
Ta = 25°C
VIN = 5 V
VOUT = 3.3 V
Ta = 25°C
CSS = 0.1μF
Output voltage:
VOUT: (1 V/div)
Output voltage:
VOUT: (1 V/div)
EN voltage: VEN = L → H
EN voltage: VEN = L → H
200 μs/div
2 ms/div
14
2010-02-24
TCV7100F
Load Response Characteristics
Load Response Characteristics
VIN = 5 V, VOUT = 3.3 V, Ta = 25°C
L = 2.2 μH, COUT = 47 μF
VIN = 5 V, VOUT = 1.2 V, Ta = 25°C
L = 2.2 μH, COUT = 68 μF
Output voltage: VOUT (100 mV/div)
Output voltage: VOUT (100 mV/div)
Output current: IOUT
(10 mA → 2 A → 10 mA)
Output current: IOUT
(10 mA → 2 A → 10 mA)
200 μs/div
200 μs/div
Load Response Characteristics
Load Response Characteristics
VIN = 3.3 V, VOUT = 1.2 V, Ta = 25°C
L = 2.2 μH, COUT = 68 μF
VIN = 5 V, VOUT = 1.2 V, Ta = 25°C
L = 2.2 μH, COUT = 68 μF
Output voltage: VOUT (100 mV/div)
Output voltage: VOUT (50 mV/div)
Output current: IOUT
(10 mA → 2 A → 10 mA)
Output current: IOUT
(1.25 A → 2.5 A → 1.25 A)
200 μs/div
200 μs/div
Load Response Characteristics
(with an External Phase Compensation Circuit)
VIN = 5 V, VOUT = 1.2 V, Ta = 25°C
L = 2.2 μH, COUT = 10 μF × 2
RP = 4.7 kΩ, CP1 = 270 pF, CP2 = 2700 pF
Output voltage: VOUT (50 mV/div)
Output current: IOUT
(1.25 A → 2.5 A → 1.25 A)
200 μs/div
15
2010-02-24
TCV7100F
Package Dimensions
HSON8-P-0505-1.27
Unit: mm
Weight: 0.068 g (typ.)
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2010-02-24
TCV7100F
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public
impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the
aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign
Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software
or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
17
2010-02-24
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