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Thinkstation-specs » ThinkStation P410
Version: 2.0 Dec 6, 2016
THINKSTATION P410
Product Overview
The ThinkStation® P410 offers a higher core count and memory capacity than any entry‐
level workstation in the market, with the latest high‐performance Intel® Xeon® processors
with Turbo Max 3.0, NVIDIA® Quadro® professional graphics, cutting‐edge storage
technologies, including M.2, and innovative Flex module support for easy customization.
Closing the gap in price and performance between entry‐level and mainstream
workstations, the P410 is positioned between two Grantley‐based dual socket workstations,
the P710 and P910, and the Denlow‐refresh single socket workstations, P310.
The P410 motherboard consists of the Intel® C612 Chipset, a single LGA2011‐3 processor
socket, supporting Intel® Xeon processors with up to 8 cores. Memory support consists of
error‐correcting code (ECC) unbuffered Double Data Rate 4 (DDR4) Synchronous Dynamic
Random Access Memory (SDRAM). Maximum memory support of up to 128GB.
SECTION I: SYSTEM OVERVIEW
Operating Systems
Preloaded
Genuine Windows 10® Professional 64‐bit
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Genuine Windows 10DG to 7® Professional 64‐bit
Genuine Windows 10® 64‐bit
Supported
Red Hat Enterprise Linux 7
Motherboard – P410
Form Factor
Board Size
10″ x 9.6″ (254mm x 244mm)
Layout
Custom ATX
Motherboard Core
Processor Support
Intel® Xeon™ Quad Core (Broadwell EP)
Intel® Xeon™ Six Core (Broadwell EP)
Intel® Xeon™ Eight Core (Broadwell EP)
Socket Type
Socket‐R3 (LGA 2011)
Memory Support
1600/1866/2133/2400 MHz
QPI (GTPS)
6.4/8.0/9.6 GTPS Links
Voltage Regulator
Intel VR12.5 – 145W TDP Capable
Chipset (PCH)
Wellsburg (Intel 612)
Flash
16MB + Depoped 16MB
HW Monitor
Super I/O
Nuvoton NCT6683D
Clock
Wellsburg (Intel 612) Native isCLK
Audio
Realtek ALC662
Ethernet
Intel Clarkville WGI218LM
SAS
Optional via Flex Adapter
Memory
Slots
4 Slots, 2 Slots on each side of CPU
Channels
4 Channels per CPU
Type
DDR4 288‐Pin, 1600/1866/2133/2400 MHz RDIMM support
ECC Support
YES
Speed
Up to 2400 MHz
Max DIMM Size
Up to 32GB RDIMM
Max System Memory
Up to 128GB RDIMM
Ethernet
Vendor
Intel, Clarkville WGI218LM
Count
1
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EEPROM
None for Clarkville
Speeds
10/100/1000 Mbps
Functions
PXE, ASF, WOL, Jumbo Frames, Teaming
Connectors
(1) x RJ45 on Rear I/O
Audio
Vendor
Realtek
Type
HD (5.1)
Internal Speaker
Yes, using SSM2211 amplifier
Connectors
(3) x Rear 3.5mm Jacks (Line In, Line Out, Microphone In)
Global Headphone Jack (Headphone + MIC in
(1) x 2‐Pin Internal Speaker Header
Video
Onboard
<Not Supported>
Adapter
(2) x PCI‐E 3.0 16‐Lane Slots
Additional adapters may be supported in x4 slots for Spec Bids
Multi‐GPU Support
BIOS supported, card dependent
Storage
Floppy
None
IDE
None
SATA/SAS
(5) x SATA Connectors, Gen. 3
(1) x eSATA Connector, Gen. 3
SATA RAID 0,1,5,10 supported natively via Intel Controller
eSATA
(1) x eSATA Connector, Gen. 3
Slots
Slot 1 (Near CPU)
PCIe x16, gen3, with Latch, Full Length, FH
Slot 2
PCIe x8, gen 3, Open Ended, Full Length, FH
Slot 3
PCIe x16, gen3, with Latch, Full Length, FH
Slot 4 (Near Edge 410)
PCIe x4, gen 3, Open Ended, Full Length, FH
Internal I/O
USB 3.0
6 total (2 front, 4 rear)
USB 2.0
4 Total (2 Rear, 2 Internal to MCR)
PS/2
Yes (2)
Audio
2×7‐pin (Mic In, Headphone) Global Version
COM2
None
Clear CMOS
3‐Pin Clear CMOS Header
Speaker
2‐Pin Internal Speaker Header
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Chassis Intrusion
2‐Pin Chassis Intrusion Switch Header
Firewire
None
Rear I/O
COM
(1) x Serial Port (COM1)
eSATA
(1) x eSATA Port (Gen. 2), optional via bracket
LPT
None
Video
<No Onboard Video>
Audio
Microphone‐In, Line In, Line Out
Ethernet
(1) x RJ45
USB 2.0
(2) x USB 2.0 Ports
USB 3.0
(4) x USB 3.0 Ports
Firewire
Optional
Thermal
Temp Sensors
Ambient Thermal Sensor – Thermal diode Connected to Super I/O
VR1 Thermal Sensor – Thermal diode Connected to Super I/O
VR2 Thermal Sensor‐ Thermal diode Connected to Super I/O
PSU Thermal Sensor
Fans
Rear SYSTEM Fan x1 4‐pin header with 4‐pin key
Front Fan 4‐pin header with 4 pin key
ODD bay Fan 4‐pin header with 3‐pin key
PSU Fan Main PSU power connector
CPU Fan Header x1 4‐pin header with 4‐pin key
Power Connectors
Main
ATX power connector 2×7
Memory & CPU
ATX power connector 2×2
Graphics
Security
TPM
Version 1.2, Infineon SLB9660TT1.2
Asset ID
Yes, 1024X8bit
vPro
Intel vPro for WS (AMT 9.x)
BIOS
Vendor
AMI
Chassis Summary
Chassis Information
Format
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25L Rack Mountable Tower
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Dimensions
425mm H x 175mm W x 431mm D
Weight
14.5 KG
Color
PSU
450 watt 92% efficient
Thermal Solutions
Rear Fan Standard – Optional Front fan required for some configurations
One (1) additional front fan required for high‐power PCIE adapters and to retain
the flex slot (mezzanine) adapter
Physical Security & Serviceability
Access Panel
Tool‐less side cover removal
Optical Drive
Tool‐less
Hard Drives
Tool‐less
Expansion Cards
Tool‐less
Processor Socket
Tool‐less
Color coded User Touch Points
Yes
Color‐coordinated Cables and Connectors
Yes
Memory
Tool‐less
System Board
Tool‐less
Green Color Power LED on Front of
Computer
Yes
Restore CD/DVD Set
Restore system to original factory shipping
image – Can be obtained via Lenovo Support
Cable Lock Support
Yes, Optional Kensington Cable Lock
Serial, Parallel, USB, Audio, Network,
Enable/Disable Port Control
Yes
Power‐On Password
Yes
Setup Password
Yes
NIC LEDs (integrated)
Yes
Security Chip
Yes
Access Panel Key Lock
Optional
Boot Sequence Control
Yes
Padlock Support
Yes, loop in rear for optional padlock,
prevents side panel removal
Boot without keyboard and/or mouse
Yes
Operating Environment
Air Temperature
Operating: 10°C to 35°C (50°F to 95°F)
Storage: ‐40°C to 60°C (‐40°F to 140°F) in original shipping carton
Storage: ‐10°C to 60°C (14°F to 140°F) without carton
Humidity
Relative Humidity Operating: 10% to 80% (non‐condensing)
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Relative Humidity Storage/Transit: 10% to 90% (non‐condensing)
Wet Bulb Temperature Operating: 25°C max
Wet Bulb Temperature Non‐operating: 40°C max
Altitude
Operating: ‐15.2 m to 3048 m (‐50 ft to 10 000 ft)
Regulations and Standards
EMC
FCC (DoC)/Canada
CE (EMC)
VCCI
JEIDA
C‐Tick
BSMI
CCIB
Safety
FCC (DoC)/Canada
CE (EMC)
VCCI
JEIDA
C‐Tick
BSMI
CCIB
PSB
CE (LVD)
Environmentals
Energy Star Program Requirements for Computers: Version 6.0 (select models)
Energy Star
EPEAT™ Gold rating (select models)
EPEAT
ErP Lot‐6 2014 (via system setup option; default on for systems shipped to EMEA.)
Hazardous Substances
Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1%
hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated
diphenol ethers (PBDE).
Products do not contain Asbestos.
Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC),
hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons,
carbontetrachloride, 1,1,1‐trichloroethane, methyl bromide
Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005%
polychlorinated terphenyl (PCT) in preparation.
Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10‐
13 carbon atoms in the chain containing at least 48% per mass of chlorine in the
SCCP
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Parts with direct and prolonged skin contact do not release nickel in concentrations
above 0.5 microgram/cm²/week.
SECTION II: SUPPORTED COMPONENTS
CPU Specifications
2S Processor SKUs – These SKUs have 2 QPI links and are targeted for dual CPU systems but will also work on
single CPU systems
Intel Xeon E5‐2637 v4 – 4 Cores, 3.5GHz, 15MB Cache, DDR4‐2400, Turbo, HT,135W
Intel Xeon E5‐2630 v4 – 10 Cores, 2.2 GHz, 8.0 QPI, 25MB Cache, DDR4‐2133 , Turbo, HT, 85W
Intel Xeon E5‐2623 v4 – 4 Cores,2.6GHz, 8.0GT/s QPI, 10MB Cache, DDR4‐2133, Turbo, HT, 85W
Intel Xeon E5‐2620 v4 – 8 Cores, 2.1GHz, 8.0GT/s QPI, 20MB Cache, DDR4‐2133, Turbo, HT, 85W
Intel Xeon E5‐2603 v4 – 6 Cores, 1.7 GHz, 6.4 QPI, 15MB Cache, DDR4‐1866 , 85W
Intel Xeon E5‐2609 v4 – 8 Cores, 1.7 GHz, 6.4 QPI, 20MB Cache, DDR4‐1866 , 85W
Notes
Intel processor numbers are not a measurement of higher performance. Processor numbers
differentiate features within each processor family, not across different processor families.
Multi core technologies are designed to improve performance of multithreaded software
products and hardware‐aware multitasking operating systems and may require appropriate
operating system software for full benefits; check with software provider to determine
suitability; not all customers or software applications will necessarily benefit from use of
these technologies.
64‐bit computing on Intel® 64 architecture requires a computer system with a processor,
chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64
architecture. Processors will not operate (including 32‐bit operation) without an Intel® 64
architecture‐enabled BIOS. Performance will vary depending on your hardware and software
configurations
Memory Specifications
RDIMMs – 2400MHz
8GB DDR4 ECC RDIMM PC4‐2400
16GB DDR4 ECC RDIMM PC4‐2400
32GB DDR4 ECC RDIMM PC4‐2400
Storage – Hard Drive/SSD Specifications
3.5″ SATA Hard Disk Drive (HDD)
500GB SATA – 7200rpm, 6Gb/s, 3.5″
1TB SATA – 7200rpm, 6Gb/s, 3.5″
2TB SATA – 7200rpm, 6Gb/s, 3.5″
3TB SATA – 7200rpm, 6Gb/s, 3.5″
3.5″ Enterprise SATA Hard Disk Drive (HDD)
4TB SATA – 7200rpm, 6Gb/s, 3.5″
6TB SATA – 7200rpm, 6Gb/s, 3.5″
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3.5″ Hybrid Drive
1TB SATA – 7200rpm, 6Gb/s, 3.5″ Hybrid
2.5″ SAS Hard Disk Drive (HDD)
300GB SAS – 10000rpm, 12Gb/s, 2.5″
600GB SAS – 10000rpm, 12Gb/s, 2.5″
2.5″ SATA Solid State Drive (SSD)
256GB SATA SSD, 6Gb/s, 2.5″ Non‐OPAL
256GB SATA SSD, 6Gb/s, 2.5″ OPAL
512GB SATA SSD, 6Gb/s, 2.5″ Non‐OPAL
1 TB SATA SSD , 6Gb/s, 2.5″ Non‐OPAL
180GB SATA SDD.6Gb/s, , 2.5″ OPAL
240GB SATA SDD.6Gb/s, , 2.5″ OPAL
480GB SATA SDD.6Gb/s, , 2.5″ OPAL
M.2 (NGFF) PCIe Solid State Drive (SSD)
256 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4, OPAL NVMe
512 GB M.2 PCIe – Solid State Drive (SSD), Gen3x4, NVMe
RAID
Supported RAID levels for a system will vary from the stated capabilities of the RAID
controller due to dependencies on the number and capacity of physical disks in the system
and on customer requirements for performance, fault tolerance, or data redundancy. Max
support RAID 0,1,5,10
RAID levels and requirements:
RAID 0 (striping) provides increased performance by writing data across multiple
drives.
RAID 1 (mirroring) provides fault tolerance by writing the data on two drives.
RAID 5 (striping with parity) uses distributed parity data to provide fault tolerance
more efficiently than RAID 1. Requires three or more drives.
RAID 10 (or RAID 1+0) combines
RAID 1 and RAID 0 to create a stripe of mirrors that is fault tolerant while offering
increased performance. Requires four drives.
Optional Hard Disk Drive Controllers
LSI 9340‐8i SATA/SAS IOC RAID adpater
Optical Drive/Removable Media
DVD‐ROM Drive (SATA)
DVD‐ROM Drive – 16x/48x (SATA)
DVD Burner/CD‐RW Rambo Drive (SATA)
DVD Burner/CD‐RW Rambo Drive (SATA)
Blu‐Ray Burner Drive (SATA)
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Blu‐Ray Burner Drive w/AACS encryption (SATA)
DVD Burner/CD‐RW Rambo Drive (Slim SATA)
DVD Burner/CD‐RW Rambo Drive (9.5mm Slim SATA)
Media Card Reader
Front 9 in 1 Media Card reader Standard
Front 29 in 1 Media card reader, USB3.0, MPOB, 760mm (Requires FLEX Module)
Keyboard
Preferred Pro Fullsize Keyboard (USB)
Preferred Pro Fullsize Keyboard (PS/2)
Smart Card KYB
Chicony KUF1256 fingerprint KB Win8
Lenovo Slim New F5 USB Keyboard
Pointing Devices
Optical Wheel Mouse (1000 DPI), USB – red wheel
Lenovo USB Laser Mouse for win7 and win10
PS2 black optical mouse with new logo
3DConnexion CadMouse
Graphics Cards
Nvidia Quadro P5000 (DVI‐D,4xDP) – 16GB GDDR5 with Short extender
Nvidia NVS310 (DP x 2) – 1GB DDR3
Nvidia NVS315 (with DMS‐59 to Dual DVI single link dongle) – 1GB GDDR3
Nvidia NVS315 (with DMS‐59 to Dual Display Port dongle) – 1GB GDDR3
Nvidia NVS 510 (mini DP x 4) – 2GB DDR3
NVS 810 (miniDPx8) – 4GB DDR3 ATX ATX with short extender kit
2 x NVS 810 (miniDPx8) – 4GB DDR3 ATX with short extender kit
Nvidia Quadro K420(DP/DVI) – 2GB DDR3‐ ATX
Nvidia Quadro K620 (DVI, DP) – 2GB DDR3 ATX
Nvidia Quadro K1200 (Mini Dp x 4) – 4GB GDDR5 HP
Nvidia Quadro M2000 (Dp x 4) – 4GB ATX
NVIDIA Quadro M4000(DP x4) – 8GB GDDR5 ATX with short extender – HP kit
2 x NVIDIA Quadro M4000(DP x4) – 8GB GDDR5 ATX with short extender – HP kit
Nvidia Quadro M5000 (DVI, DP x 4) – 8GB GDDR5‐ ATX short extender kit
NVIDIA Stereo 3D Bracket
Nvidia Stereo 3D Connector Bracket
FLEX Components
Flex Bay: Formerly known as ODD bays. Will support not only ODD, but
also HDDs and Flex Module
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Flex Module: Module supported in the Flex Bay with several options
integrated. Will support slim ODD, High Speed Media Card Reader or 2
universal ports supporting IEEE1394, eSATA, etc…
PCIe
Network
Intel I210‐T1 Single Port Gigabit Ethernet Adapter
Intel I350‐T2 Dual Port Gigabit Ethernet Adapter
Intel I350‐T4 Quad Port Gigabit Ethernet Adapter
Bitland BN8E88 1000M PCIE ASF FH
Thunderbolt
Intel Thunderbolt PCIe Add‐In‐Card
IEE 1394
IEEE 1394a (Firewire‐400) PCI Express x1 Adapter (1 external, 1 internal port)
USB
USB 3.0 PCI Express x1 Adapter
Wifi Card
PCI‐E 1X Wifi Card with BT HP Kit (Snowfield Peak 2 8260 AC)
Parallel Card
Sunix 1 – Port IEEE1284 Parallel PCI Express x1 Communication card full Height
PCIe to M.2 Adapter Card
PCIE x4 to M.2 (For NVMe SSD) – HP
SECTION III: SYSTEM TECHNICAL SPECIFICATIONS
Power Supply Specifications
Power Supply
450W PSU
Operating Voltage Range
90‐264VAC
Rated Voltage Range
100‐240V
Rated Line Frequency
50/60Hz
Operating Line Frequency Range
47Hz/63Hz
Rated Input Current
8A‐4A
Power Supply Fan
120x25mm, 1800rpm max
ENERGY STAR® qualified (Config Dependent)
*System level select models
80 PLUS Compliant
Yes 80 PLUS Platinum
Built‐in Self Test (BIST) LED
N
Surge Tolerant Full Ranging Power Supply (withstands power surges
up to 2000V)
YES
Aux Power Drop
Single Drop 6Pin
Click here to access the ThinkStation Power Calculator.
BIOS Specifications
WMI Support
Compliant with Microsoft WBEM and the DMTF
Common Information Model
ROM‐Based Setup Utility (F1)
System Configuration Setup program available
at power‐on with F1 key
Bootblock Recovery
Recovers system BIOS when Flash ROM
corrupted.
Replicated Setup
Saves System Configuration settings to file
that can then be used replicated to other
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systems.
Boot Control
Boot control available through ROM‐Based
Setup Utility or with F12 key at power‐on
Memory Change Alert
Power‐on Error message in event of decrease
in system memory
Thermal Alert
Power‐on Error message in event of fan
failure
Asset Tag
Support ability to set SMBIOS Type 2
Baseboard Asset Tag field.
System/Emergency ROM Flash
Recovery with Video
Support process to recover system BIOS when
Flash ROM corrupted
Remote Wakeup/Remote Shutdown
System admin can power on/off a client
computer from remote location to provide
maintenance
Quick Resume time
Support lor power S3 (suspend to RAM) and
prompt resume times
ROM revision level
System UEFI (BIOS) version reported in
SMBIOS Type 0 structure and in BIOS Setup
Keyboard‐less Operation
System can be booted without a keyboard
Per‐port Control
Allows I/O ports to be individually
enabled/disabled through ROM‐based setup
or WMI interface
Adaptive Cooling
Fans dynamically controlled by system BIOS
based on temperature. User has ability to
provide custom fan control table
Security
User and Administrator passwords can protect
boot and ROM‐base Setup. Chassis intrusion
detection protect
Intel(R) AMT (includes ASF 2.0)
Allows system to be supported from a remote
location
Intel(R) TXT
Intel(R) Trusted Execution Technology
provides a security foundation to build
protections against software base attacks.
Memory modes
Supports mirroring, lock step, and sparing
memory modes
Windows 8 ready
Supports Windows 8 requirements – Secure
flash, UEFI v 2.3.1 spec
Industry Standard Specification
Support
UEFI
Unified Extensible Firmware Interface
v2.3.1d
ACPI (Advanced Configuration and
power Management Interface)
Advanced Configuration and Power Interface
v5.0
ASF 2.0
DMTF Alert Standard Format Specification
v2.0
ATA (IDE)
AT Attachment 6 with Packet Interface
(ATA/ATAPI‐6)
CD Boot
“El Torito” Bootable CD‐Rom Format
Specification, Version 1.0
EHCI
Enhanced Host Controller Interface for
Universal Serial Bus, Revision 1.0
PCI
PCI Local Bus v3.0
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PC Firmware Specification 3.1
PCI Express
PCI Express Base Specification 3.0
SATA
Serial ATA Revision 3.0 Specification
TPM
Trusted Computing Group TPM Specification
Version 1.2
UHCI
Universal Host Controller Interface Design
Guide, Revision 1.1
USB
Universal Serial Bus Revision 1.1
Universal Serial Bus v2.0
Universal Serial Bus v3.0
SMBIOS
DMTF System Management Spec v2.8.0
Social and Environmental Responsibility
Quality Control
Lenovo is a member of an eco declaration system that enforces regular independent
quality control
Hazardous substances and preparation
Products do not contain more than; 0.1% lead, 0.01% cadmium, 0.1% mercury, 0.1%
hexavalent chromium, 0.1% polybrominated biphenyls (PBB) or 0.1% polybrominated
diphenyl ethers (PBDE). (See legal
reference and Note B1
Products do not contain Asbestos
Products do not contain Ozone Depleting Substances: Chlorofluorocarbons (CFC),
hydrobromofluorocarbons (HBFC), hydrochlorofluorcarbons (HCFC), Halons,
carbontetrachloride, 1,1,1‐trichloroethane, methyl bromide
Products do not contain more than; 0.005% polychlorinated biphenyl (PCB), 0.005%
polychlorinated terphenyl (PCT) in preparation
Products do not contain more than 0.1% short chain chloroparaffins (SCCP) with 10‐
13 carbon atoms in the chain containing at least 48% per mass of chlorine in the
SCCP
Parts with direct and prolonged skin contact do not release nickel in concentrations
above 0.5 microgram/cm²/week
REACH Article 33 information about substances in articles is available
at: http://www.lenovo.com/social_responsibility/us/en/ThinkGreen_products.html#environment
Batteries
If the product contains a battery or an accumulator, it is labeled with the disposal
symbol and if it contains more than 0.0005% of mercury (for button cells only) by
weight, or more than 0.004% of lead,it shall be marked with the chemical symbol for
the metal concerned, Hg or Pb. Information on proper disposal is provided in user
manual
Button cells used in the product do not contain more than 2% by weight of mercury.
Other batteries or accumulators do not contain more than 0.0005% of mercury or
0.002% of cadmium
Batteries and accumulators are easily removable by either users or service providers
(as dependent on the design of the product). Exception: Batteries that are
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permanently installed for safety, performance, medical or data integrity reasons do
not have to be “easily removable
Safety, EMC connection to the telephone network and labeling
The product complies with legally required safety standards as specified
The product complies with legally required standards for electromagnetic
compatibility
If product is intended for connection to a public telecom network or contains a radio
transmitter, it complies with legally required standards for radio and
telecommunication devices
The product is labeled to show conformance with applicable legal requirements
Product packaging
Packaging and packaging components do not contain more than 0.01% lead, mercury,
cadmium and hexavalent chromium by weight of these together.
Plastic packaging material is marked according to ISO 11469 referring ISO 1043
The product packaging material is free from ozone depleting substances as specified
in the Montreal Protocol
Manageability
Industry Standard Specifications
This product meets the following industry standard specifications for
manageability functionality:
Intel LAN with AMT
Remote Manageability Software Solutions
Lenovo ThinkStation is supported on the following remote manageability
software consoles:
Lenovo ThinkManagement Console
LANDesk Management Suite for ThinkVantage Technologies
(www.landesk.com/lenovo)
Microsoft System Center Configuration Manager
System Software Manager
Lenovo ThinkStation supports software management tools from the
ThinkVantage System Update suite:
System Update
Update Retriever
Thin Installer
Service, Support, and Warranty
On‐site Warranty and Service: Three‐years, limited warranty and service
offering delivers on‐site, next business‐day service for parts and labor and
includes free telephone support 8am – 5pm. Global coverage ensures that any
product purchased in one country and transferred to another, non‐restricted
country will remain fully covered under the original warranty and service
offering.
Go to www.lenovo.com/support and www.lenovo.com/warranty for more details
SECTION IV: COMPONENT SPECIFICATIONS
HDD Specifications
3.5″ SATA Hard Disk Drive (HDD)
500GB SATA – 7200rpm, 6Gb/s, 3.5″
1TB SATA – 7200rpm, 6Gb/s, 3.5″
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2TB SATA – 7200rpm, 6Gb/s, 3.5″
3TB SATA – 7200rpm, 6Gb/s, 3.5″
3.5″ Enterprise SATA Hard Disk Drive
(HDD)
4TB SATA – 7200rpm, 6Gb/s, 3.5″
6TB SATA – 7200rpm, 6Gb/s, 3.5″
3.5″ Hybrid Drive
1TB SATA – 7200rpm, 6Gb/s, 3.5″
Hybrid
2.5″ SAS Hard Disk Drive (HDD)
300GB SAS – 10000rpm, 12Gb/s, 2.5″
600GB SAS – 10000rpm, 12Gb/s, 2.5″
2.5 10K SAS 300G/600G
(Model:Thunderbolt)
Connector
SAS
Transfer Rate
12Gb
Performance
Spindle Speed(RPM)
10,000 +/‐
Power off to Spindle Stop(sec) 20 sec
DC Power to Drive Ready(sec)
20 sec
Receipt of Start Unit
Command to Drive Ready(sec)
20 sec
Average Latency(sec)
2
Power Management
Input(VDC)
+5v +‐ 5%+12v +‐ 5%
Typical(Watts)
6.01
Idle(Watts)
3.44
Dimensions
Height(mm – Max)
15
Width(mm)
69.85
Depth(mm – Max)
100.45
Weight(grams)
199(maximum)
Temperature
Operating(C) Ambient
5 to 55
Operating(C) Base Casting
60 max
Non‐Operating(C) Ambient
‐40 to 70
Gradient(C per Hour)
20 max
Shock
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Operating(Gs @2ms)
25
Non‐Operating(Gs @2ms)
400
3.5 7200 Enterprise
4T/6T (Model:Makara)
3.5 7200 Enterprise
4T/6T
(Model:MakaraBP)
3.5″ 7200 2T/3T
(Model:Grenada BP‐R
)
3.5″ 7200 500G/1T
(Model:Pharaoh
Oasis)
3.5″ 7200RPM
Hybrid2T/1T
(Model:Grenada BP2H
)
Connector
SATA
SATA
SATA
SATA
SATA
Transfer Rate (Gb/sec)
600MB/sec
600MB/sec
600MB/sec
600MB/sec
600MB/sec
Spindle Speed(RPM)
7200
7200
7200
7200
7200
Power off to Spindle
Stop(sec)
23 max
23 max
11 max
10 max
11 max
DC Power to Drive
Ready(sec)
30 max
30 max
10 max
10 max
Receipt of Start Unit
Command to Drive
Ready(sec)
30 max
30 max
17 max
10 max
Average Latency(msec)
4.16
4.16
4.16
4.16
4.16
Input(VDC)
+5v +‐ 5%+12v +‐ 5%
+5v +‐ 5%+12v +‐ 5%
+5v +‐ 5%+12v +‐ 5%
+5v +‐ 5%+12v +‐ 5%
+5v +‐ 5%+12v +‐ 5%
Typical(Watts)
10.62(6T)
10(6T)
8 max
5.57 max
6.7 max
Idle(Watts)
8(6T)
6.2(6T)
5.4 (Idle 2)
4.21
4.5 (Idle 2)
Height(mm – Max)
26.11
26.11
26.1
20
26.11
Width(mm)
101.6
101.6
101.6
101.6
101.6
Depth(mm – Max)
146.99
146.99
146.99
146.99
146.99
Weight(grams)
780 max
705 max
626 max
415 max
535
5 to 60
5 to 60
0 to 60
0 to 60
0 to 60
Non‐Operating(C)
Ambient
‐40 to 70
‐40 to 70
‐40 to 70
‐40 to 70
‐40 to 70
Gradient(C per Hour)
20 max
20 max
30 max
30 max
30 max
Operating(Gs @ 2ms)
70(read) 40(write)
70(read) 40(write)
70 max
80 max
80 max
Non‐Operating(Gs @ 2ms)
250 6T,300 other
250 6T,300 other
350 max
300 max
300 max
Performance
Power Management
Dimensions
Temperature
Operating(C) Ambient
Operating(C) Base Casting
Shock
SSD Specifications
2.5″ SATA Solid State Drive (SSD)
128GB SATA SSD, 6Gb/s, , 2.5″ Non‐
OPAL
256GB SATA SSD, 6Gb/s, , 2.5″ Non‐
OPAL
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Thinkstation-specs » ThinkStation P410
256GB SATA SSD, 6Gb/s, , 2.5″ OPAL
512GB SATA SSD, 6Gb/s, , 2.5″ Non‐
OPAL
1 TB SATA SSD , 6Gb/s, , 2.5″ Non‐
OPAL
180GB SATA SSD. 6Gb/s. , 2.5″ OPAL
240GB SATA SSD, 6Gb/s, , 2.5″ OPAL
480GB SATA SSD, 6Gb/s, , 2.5″ OPAL
M.2 (NGFF) PCIe Solid State Drive
(SSD)
256 GB M.2 PCIe – Solid State Drive
(SSD), Gen3x4, OPAL NVMe
512 GB M.2 PCIe – Solid State Drive
(SSD), Gen3x4, NVMe
180GB SATA
SSD. 6Gb/s.
OPAL.2.5″
240GB SATA SSD, 480GB SATA SSD,
6Gb/s,OPAL.
6Gb/s,OPAL.
2.5″
2.5″
128GB SATA
SSD, 6Gb/s,
2.5″ Non‐
OPAL
256GB SATA
SSD, 6Gb/s,
2.5″ OPAL
256GB SATA
SSD, 6Gb/s,
2.5″ Non‐
OPAL
512GB SATA
SSD, 6Gb/s,
2.5″ Non‐
OPAL
512GB SATA
SSD, 6Gb/s,
2.5″ OPAL
Min Sequential
Read
540 MB/s
540 MB/s
540 MB/s
460 MB/s
520 MB/s
520 MB/s
520 MB/s
530 MB/s
Min Sequential
Write
490 MB/s
490 MB/s
490 MB/s
270 MB/s
450 MB/s
450 MB/s
440 MB/s
495 MB/s
Min Random Read
(8GB Span)
41000 IOPS
41000 IOPS
48000 IOPS
77000 IOPS
92000 IOPS
92000 IOPS
86000 IOPS
70000 IOPS
Min Random Write
(8GB Span)
49000 IOPS
49000 IOPS
37000 IOPS
60000 IOPS
38000 IOPS
38000 IOPS
53000 IOPS
60000 IOPS
Min Power – Active
165 mW
165 mW
165 mW
155 mW
155 mW
155 mW
155 mW
100 mW
Min Power – Idle
55 mW
55 mW
55 mW
75 mW
75 mW
75 mW
75 mW
40 mW
Min MTBF
1.2 M hours
1.2 M hours
1.2 M hours
1.5 M hours
1.5M hours
1.5M hours
1.5M hours
1.5M hours
Hardware
Encryption
AES 256 bit
AES 256 bit
AES 256 bit
AES 256 bit
AES 256 bit
AES 256 bit
AES 256 bit
AES 256 bit
1 TB SATA SSD , 6Gb/s, 2.5″
Non‐OPAL
2 TB SATA SSD , 6Gb/s, 2.5″
OPAL
Min Sequential Read
560 MB/s
530 MB/s
Min Sequential Write
510 MB/s
500 MB/s
Min Random Read (8GB Span)
100,000 IOPS
920,000 IOPS
Min Random Write (8GB Span)
88,000 IOPS
83,000 IOPS
Min Power – Active
150 mW
150 mW
Min Power – Idle
70 mW
110 mW
Min MTBF
1.5M hours
1.5M hours
Hardware Encryption
AES 256 bit
AES 256 bit
Interface
PCIe Gen3 x4 OPAL NVMe
PCIe Gen3 x4 NVMe
Capacity
256GB
512GB
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Thinkstation-specs » ThinkStation P410
Performance
Sequential Read
2,250 MB/s
2,600 MB/s
Sequential Write
1,250 MB/s
1,500 MB/s
Random Read
295,000 IOPS
310,000 IOPS
Random Write
93,000 IOPS
100,000 IOPS
6.5W
5.5W
Power Consumption
HDD Controllers
LSI 9340‐8i SATA/SAS IOC RAID adpater
LSI 9340‐8i SATA/SAS IOC RAID adpater
PCI Bus
x8 lane PCI Express® 3.0
PCI Modes
RAID Levels
RAID 0, 1, 5, 10, 50 and JBOD mod
Data Transfer Rates
Up to 12Gb/s per port
PCI Card Type
PCI Voltage
+3.3V, +12V
PCI Power
Bracket
Full Height and Low‐Profile
Certification Level
Internal Connectors
2 HD Mini‐SAS SFF8643 (Vertical mount)
Optical Drives Specifications
DVD‐ROM Drive – 16x/48x
(SATA)
DVD Burner/CD‐RW Rambo
Drive (SATA)
Blu‐Ray Burner Drive
w/AACS encryption (SATA)
DVD Burner/CD‐RW Rambo
Drive (9.5mm Slim SATA)
Description
5.25‐inch, half‐height, tray‐
load
5.25‐inch, half‐height, tray‐
load
5.25‐inch, half‐height, tray‐
load
9.5mm slim, tray‐load
Mounting
Orientation
Either horizontal or vertical
Either horizontal or vertical
Either horizontal or vertical
Either horizontal or vertical
Interface Type
SATA/ATAPI
SATA/ATAPI
SATA/ATAPI
SATA/ATAPI
Dimensions
(WxHxD) 15.0 x 4.4 x 20.3
cm (5.9 x 1.7 x 8.0 in)
(WxHxD) 15.0 x 4.4 x 20.3 cm (WxHxD) 15.0 x 4.4 x 20.3 cm (WxHxD) 128 x 9.5 x 127cm
(5.9 x 1.7 x 8.0 in)
(5.9 x 1.7 x 8.0 in)
MAX
Disc Capacity DVD‐
ROM
Single layer: Up to 4.7 GB
Double layer: Up to 8.5 GB
Single layer: Up to 4.7 GB
Double layer: Up to 8.5 GB
Single layer: Up to 4.7 GB
Double layer: Up to 8.5 GB
Single layer: Up to 4.7 GB
Double layer: Up to 8.5 GB
DVD‐ROM Single
Layer
< 140 ms (typical)
< 140 ms (typical)
< 140 ms (typical)
< 160 ms (typical)
CD‐ROM Mode 1
< 125 ms (typical)
< 125 ms (typical)
< 125 ms (typical)
< 140 ms (typical)
Full Stroke DVD
< 250 ms (seek)
< 250 ms (seek)
< 250 ms (seek)
< 250 ms (seek)
Full Stroke CD
< 210 ms (seek)
< 210 ms (seek)
< 210 ms (seek)
< 210 ms (seek)
Source
SATA DC power receptacle
SATA DC power receptacle
SATA DC power receptacle
SATA DC power receptacle
DC Power
5 VDC ± 5%‐100 mV ripple p‐p 5 VDC ± 5%‐100 mV ripple p‐p
5 VDC ± 5%‐100 mV ripple p‐p
5 VDC ± 5%‐100 mV ripple p‐p
Access Times
Power
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Requirements
Thinkstation-specs » ThinkStation P410
12 VDC ± 10%‐200 mV ripple
p‐p
12 VDC ± 10%‐200 mV ripple
p‐p
12 VDC ± 10%‐200 mV ripple
p‐p
5 VDC – <1000 mA typical, <
1600 mA
5 VDC – <1000 mA typical, <
1600 mA
5 VDC – <1100 mA typical, <
2000 mA
5 VDC – <1000 mA typical, <
1500 mA
maximum
maximum
maximum
maximum
12 VDC – < 1000 mA typical,
< 2000 mA
12 VDC – < 1000 mA typical, < 12 VDC – < 1600 mA typical, <
2000 mA
2500 mA
maximum
maximum
maximum
Temperature
5° to 50° C (41° to 122° F)
5° to 50° C (41° to 122° F)
5° to 50° C (41° to 122° F)
5° to 50° C (41° to 122° F)
Relative Humidity
8% to 80%
8% to 80%
8% to 80%
8% to 80%
Maximum Wet Bulb
Temperature
30° C (86° F)
30° C (86° F)
30° C (86° F)
30° C (86° F)
Operating Systems
Supported
Windows 10 Professional or
Home 64‐bit
Windows 10 Professional or
Home 64‐bit
Windows 10 Professional or
Home 64‐bit
Windows 10 Professional or
Home 64‐bit
Windows 7 Professional 64‐
bit
Windows 7 Professional 64‐
bit
Windows 7 Professional 64‐
bit
Windows 7 Professional 64‐
bit
Red Hat Enterprise
Linux(RHEL) 7.2
Red Hat Enterprise
Linux(RHEL) 7.2
Red Hat Enterprise
Linux(RHEL) 7.2
Red Hat Enterprise
Linux(RHEL) 7.2
Desktop/Workstation. No
driver is required for this
device. Native support is
provided by the operating
system.
Desktop/Workstation. No
driver is required for this
device. Native support is
provided by the operating
system.
Desktop/Workstation. No
driver is required for this
device. Native support is
provided by the operating
system.
Desktop/Workstation. No
driver is required for this
device. Native support is
provided by the operating
system.
DC Current
Operating
Environmental
Graphics Cards
# CUDA Cores
P6000
P5000
M5000
M4000
M2000
3840
2560
2048
1664
768
4.3 TFLOPs
2.6 TFLOPs
1.8 TFLOPs
Single Precision
PCIe Gen
3
3
3
3
3
Memory Size
24G
16G
8 GB
8 GB
4GB
Memory BW
433 GB/s
288 GB/s
211 GB/s
192 GB/s
105.7 GB/s
Slots + Display Connectors
4xDP+DVI‐D
4xDP+DVI‐D
4x DP + 1x DVI
4x DP
4x DP
Display Support
5
5
4
4
4
Advanced Display
SDI, SYNC, Stereo
SDI, SYNC, Stereo
SDI, SYNC, Stereo
SDI, SYNC, Stereo
N/A
Board Power
250W
180Wd
150 W
120 W
75W
SLI Support
Yes
Yes
Yes
Yes
No
Form Factor
FH
FH
FH
K2200
K1200
K620
K420
# CUDA Cores
640
512
384
192
Single Precision
1.3 TFLOPs
1 TFLOPs
0.8 TFLOPs
0.3 TFLOPs
PCIe Gen
2
2
2
2
Memory Size
4 GB
4GB
2 GB
1 GB
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Thinkstation-specs » ThinkStation P410
Memory BW
80 GB/s
80 GB/s
29 GB/s
29 GB/s
Slots + Display Connectors
2x DP + DVI
4x mDP
DP + DVI
DP + DVI
Display Support
4
4
4
4
Advanced Display
N/A
N/A
N/A
N/A
Board Power
68 W
46 W
45 W
41 W
SLI Support
No
No
No
No
Form Factor
FH
LP
HH
HH
NVS310
NVS315
NVS510
NVS810
# CUDA Cores
48
48
192
1024(512 per GPU)
PCIe Gen
2
2
2
3
Memory Size
512 MB
1GB
2GB
4GB
Memory BW
14 GB/s
14 GB/s
28.5 GB/s
28.8 GB/s
Slots + Display Connectors
DP
DMS‐59
Mini DP
Mini DP
Max Display
2
2
4
8
Max Power
19.5 W
19.3 W
35 W
68 W
Max Resolution
2560 × 1600 at 60Hz
(DP)
2560 × 1600 at
60Hz (DP)
3840×2160 at 60Hz
(DP)
4096×2160 at 30Hz
(DP)
Form Factor
LP
LP
LP
FH
Networking
Connector
RJ‐45
Controller
Intel, Clarkville WGI218LM
Intel i218 Gigabit Ethernet – LM
Lithography
40 nm
TDP
0.5 W
Operating Temperature Range
0°C to 85°C
# of Ports
Single
Data Rate Per Port
1 Gbps
Jumbo Frames Supported
Yes
1000Base‐T
Yes
Supported Under vPro
Yes
Other
MEDIA CARD READER
9 in 1
29 in 1
Description
Description
The Media card reader device is standard in our Pseries
The Media card reader mounts into our FLEX
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Thinkstation-specs » ThinkStation P410
products The device connects to a 2×5 two channel USB
header on the motherboard of the system. There is no USB
controller card provided. Please see the Disc Formats section
below for a list of flash memory card formats that are
supported.
module which fits into a standard 5.25″ Optical
bay.
Mounting Orientation The Media Card Reader can not be
changed and is hard wired into the system
Mounting Orientation The Media Card Reader can
not be changed, it only fits into the FLEX Module
one way.
Interface Type
Interface Type
USB 2.0 (one channel dedicated to the separate USB port;
one channel dedicated to the flash memory card slots)
USB 3.0 (one channel dedicated to the separate
USB port; one channel dedicated to the flash
memory card slots)
Disc Formats
Disc Formats
SD
xD‐H
SDHC
xD‐M
SDXC
Micro SD
Mini SD
Micro SDHC
Mini SDHC
SD
Micro SD*
SDHC
Micro SDHC*
SDXC
Micro SDXC*
Mini SD
RS‐MMC
Mini SDHC
MMC
MultiMediaCard (MMC)
MMC Micro
Reduced Size MultiMediaCard (RS MMC)
MMC Mobile
(MMC Plus)
MMC Plus
(MMC Mobile)
M2
CompactFlash Card Type I (CF Type 1)
CF Type 2
MicroDrive (MD)
Memory Stick (MS)
Memory Stick Select
MS Duo
MS PRO
MS PRO DuMS PRO‐HG Duo
MS XS Duo
MS XC‐HG Duo
MS HG Micro*
MS XC Micro*
MS XC‐HG Micro*
MMC Micro
Memory Stick Micro (M2)*
*Available with adapter
http://thinkstation-specs.com/thinkstation-p410/
*Available with adapter
20/22
8/31/2017
Thinkstation-specs » ThinkStation P410
IEEE 1394a (Firewire‐400) PCI Express x1 Adapter (1 internal port, 1 external port)
Data Transfer Rate
Supports up to 400 Mbps
Devices Supported
IEEE‐1394 compliant devices
Bus Type
PCIe card full height PCIe slots
Ports
One IEEE‐1394a bilingual 6‐Pin Connector (Rear)
System Requirements
Genuine Windows 10® Professional 64‐bit, Genuine Windows 10DG to 7®
Professional 64‐big
Not supported on Linux.
Premium® III or higher processor 128‐MB RAM 1‐GB Hard Drive CD‐ROM drive
Built in sound system available PCI slot
Temperature –
50° to 131° F (10° to 55° C)
Operating
Temperature – Storage
–22° to 140° F (–30° to 60° C)
Relative Humidity –
20% to 80%
Operating
Compliances
FCC Part 15B, cULus 60950, CE Mark EN55022B(1995)/EN55024‐
1998 STD, Taiwan BSMI CNS13438, Korea MIC
Intel I210‐T1 Single Port Gigabit
Ethernet Adapter
Intel I350‐T2 Dual Port Gigabit
Ethernet Adapter
Intel I350‐T4 Quad Port Gigabit
Ethernet Adapter
Cable Medium
Copper
Copper
Copper
Cabling Type
RJ‐45 Category‐5, up to 100 m
Cat 5 up to 100m
Cat 5 up to 100m
Bracket Height
Low Profile and Full Height
Low Profile and Full Height
Low Profile and Full Height
TDP
1W
4.4W
5W
# of Ports
Single
Dual
Quad
System Interface Type
PCIe 2.1(2.5GT/s)
PCIe v2.1 (5.0GT/s)
PCIe v2.1 (5.0GT/s)
Yes
Yes
Intel® Virtualization
Technology for
Connectivity (VT‐c)
Speed & Slot Width
2.5 GT/s, x1 Lane
5 GT/s, x4 Lane
5 GT/s, x4 Lane
Controller
Intel I210
Intel I350
Intel I350
iWARP/RDMA
No
No
No
Intel® Ethernet Power
Management
Yes
Yes
Yes
Intel® Data Direct I/O
Technology
No
Intelligent Offloads
Yes
Yes
Yes
iSCSI, NFS
iSCSI, NFS
Storage Over Ethernet
On‐chip QoS and Traffic
Management
No
Yes
Yes
Flexible Port
Partitioning
No
Yes
Yes
http://thinkstation-specs.com/thinkstation-p410/
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Thinkstation-specs » ThinkStation P410
Virtual Machine Device
Queues (VMDq)
No
Yes
Yes
PCI‐SIG* SR‐IOV Capable
No
Yes
Yes
http://thinkstation-specs.com/thinkstation-p410/
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