FAN2514/FAN2515 200 mA CMOS LDO Regulators with Fast Start

FAN2514/FAN2515 200 mA CMOS LDO Regulators with Fast Start

www.fairchildsemi.com

FAN2514, FAN2515

200 mA CMOS LDO Regulators with Fast Start Enable

Features

• Ultra Low Power Consumption

• Enable optimized for CDMA time phases

• 200 mV dropout voltage at 200 mA

• 75 µA ground current at 200 mA

• Enable/Shutdown Control

• SOT23-5 package

• Thermal limiting

• 300 mA peak current

Applications

• Cellular Phones and accessories

• PDAs

• Portable cameras and video recorders

• Laptop, notebook and palmtop computers

Description

The FAN2514/15 family of micropower low-dropout voltage regulators utilize CMOS technology to offer a new level of cost-effective performance in GSM, TDMA, and CDMA cellular handsets, Laptop and Notebook portable computers, and other portable devices. Features include extremely low power consumption and low shutdown current, low dropout voltage, exceptional loop stability able to accommodate a wide variety of external capacitors, and the compact SOT23-5 surface-mount package. In addition, the FAN2514/15 family offer the fast power-cycle time required in CDMA handset applications. The products offer significant improvements over older BiCMOS designs and are pin-compatible with many popular devices. The output is thermally protected against overload.

The FAN2514 and FAN2515 devices are distinguished by the assignment of pin 4:

FAN2514:

pin 4 – ADJ, allowing the user to adjust the output voltage over a wide range using an external voltage divider.

FAN2514-XX:

pin 4 – BYP, to which a bypass capacitor may be connected for optimal noise performance. Output voltage is fixed, indicated by the suffix XX.

FAN2515-XX:

pin 4 – ERR, a flag which indicates that the output voltage has dropped below the specified minimum due to a fault condition.

The standard fixed output voltages available are 2.5V, 2.6V,

2.7V, 2.8V, 2.85V, 3.0V, and 3.3V. Custom output voltage are also available: please contact your local Fairchild Sales

Office for information.

Block Diagrams

EN

VIN

Bandgap

Error

Amplifier p

VIN

Bandgap

EN

Error

Amplifier p

BYP

Thermal

Sense

FAN2514

VOUT

ADJ

GND

VIN

Bandgap

EN p

VOUT

GND

Error

Amplifier

ERR

Thermal

Sense

FAN2514-XX

VOUT

Thermal

Sense

FAN2515-XX

GND

REV. 1.1.0 01/10/13

PRODUCT SPECIFICATION

Pin Assignments

FAN2514/FAN2515

V

IN

1

GND

2

EN

3

5

V

OUT

4

ADJ/BYP/ERR

Pin No.

1.

2.

3.

FAN2514

V

IN

GND

EN

4.

ADJ

5. V

OUT

FAN2514-XX

V

IN

GND

EN

BYP

V

OUT

FAN2515-XX

V

IN

GND

EN

ERR

V

OUT

Pin Descriptions

Pin Name Pin No.

Type

ADJ 4 Input

BYP

ERR

EN

V

IN

V

OUT

GND

1

5

2

4

4

3

Passive

Open drain

Digital Input

Power in

Power out

Power

Pin Function Description

FAN2514 Adjust.

Ratio of potential divider from VOUT to ADJ determines output voltage.

FAN2514-XX Bypass.

Connect 470 pF capacitor for noise reduction.

FAN2515-XX Error.

Error flag output.

0:

Output voltage < 95% of nominal.

1:

Output voltage > 95% of nominal.

Enable.

0:

Shutdown V

OUT

.

1:

Enable V

OUT

.

Voltage Input.

Supply voltage input.

Voltage Output.

Regulated output voltage.

Ground.

Functional Description

Designed utilizing CMOS process technology, the

FAN2514/15 family of products are carefully optimized for use in compact battery-powered devices, offering a unique combination of low power consumption, extremely low dropout voltages, high tolerance for a variety of output capacitors, and the ability to disable the output to less than

1µA under user control. In the circuit, a difference amplifier controls the current through a series-pass P-Channel

MOSFET, comparing the load voltage at the output with an onboard low-drift bandgap reference. The series resistance of the pass P-Channel MOSFET is approximately 1

, resulting in an unusually low dropout voltage under load when compared to older bipolar pass-transistor designs.

Protection circuitry is provided onboard for overload conditions. In conditions where the device reaches temperatures exceeding the specified maximums, an onboard circuit shuts down the output, where it remains suspended until it has cooled before re-enabling. The user is also free to shut down the device using the Enable control pin at any time.

Careful design of the output regulator amplifier assures loop stability over a wide range of ESR values in the external output capacitor. A wide range of values and types can be accomodated, allowing the user to select a capacitor meeting his space, cost, and performance requirements, and enjoy reliable operation over temperature, load, and tolerance variations.

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REV. 1.1.0 01/10/13

FAN2514/FAN2515 PRODUCT SPECIFICATION

Depending on the model selected, a number of control and status functions are available to enhance the operation of the

LDO regulator. An Enable pin, available on all devices, allows the user to shut down the regulator output to conserve power, reducing supply current to less than 1µA. The adjustable-voltage versions of the device utilize pin 4 to connect to an external voltage divider which feeds back to the regulator error amplifier, thereby setting the voltage as desired. Two other functions are available at pin 4 in the fixed-voltage versions: in noise-sensitive applications, an external Bypass capacitor connection is provided that allows the user to achieve optimal noise performance at the output, while the Error output functions as a diagnostic flag to indicate that the output voltage has dropped more than 5% below the nominal fixed voltage.

Applications Information

External Capacitors – Selection

The FAN2514/15 allows the user to utilize a wide variety of capacitors compared to other LDO products. An innovative design approach offers significantly reduced sensitivity to

ESR (Effective Series Resistance), which degrades regulator loop stability in older designs. While the improvements featured in the FAN2514/15 family greatly simplify the design task, capacitor quality still must be considered if the designer is to achieve optimal circuit performance. In general, ceramic capacitors offer superior ESR performance, at a lower cost and a smaller case size than tantalums. Those with

X7R or Y5Vdielectric offer the best temperature coefficient characteristics. The combination of tolerance and variation over temperature in some capacitor types can result in significant variations, resulting in unstable performance over rated conditions.

Input Capacitor

An input capacitor of 2.2µF (nominal value) or greater, connected between the Input pin and Ground, located in close proximity to the device, will improve transient response and noise rejection. Higher values will offer superior input ripple rejection and transient response. An input capacitor is recommended when the input source, either a battery or a regulated AC voltage, is located far from the device. Any good quality ceramic, tantalum, or metal film capacitor will give acceptable performance, however tantalum capacitors with a surge current rating appropriate to the application must be selected to avoid catastrophic failure.

Output Capacitor

An output capacitor is required to maintain regulator loop stability. Unlike many other LDO regulators, the

FAN2514/15 family of products are nearly insensitve to output capacitor ESR. Stable operation will be achieved with a wide variety of capacitors with ESR values ranging from

10m

to 10

or more. Tantalum or aluminum electrolytic, or multilayer ceramic types can all be used. A nominal value of at least 1µF is recommended.

Bypass Capacitor (FAN2514 Only)

In the fixed-voltage configuration, connecting a capacitor between the bypass pin and ground can significantly reduce noise on the output. Values ranging from 470pF to 10nF can be used, depending on the sensitivity to output noise in the application.

At the high-impedance Bypass pin, care must be taken in the circuit layout to minimize noise pickup, and capacitors must be selected to minimize current loading (leakage). Noise pickup from external sources can be considerable. Leakage currents into the Bypass pin will directly affect regulator accuracy and should be kept as low as possible; thus, highquality ceramic and film types are recommended for their low leakage characteristics. Cost-sensitive applications not concerned with noise can omit this capacitor.

Control Functions

Enable Pin

Applying a voltage of 0.8V or less at the Enable pin will disable the output, reducing the quiescent output current to less than 1µA, while a voltage of 1.5V or greater will enable the device. If this shutdown function is not needed, the pin can simply be connected to the V

IN

pin. Allowing this pin to float will cause erratic operation.

Error Flag (FAN2515 only)

To indicate conditions such as input voltage dropout

(low V

IN

), overheating, or overloading (excessive output current), the ERR pin indicates a fault condition. It is an open-drain output which is HIGH when the voltage at V

OUT is greater than 95% of the nominal rated output voltage and

LOW when V

OUT

is less than 95% or the rated output voltage, as specified in the error trip level characteristics.

A logic pullup resistor of 100K

is recommended at this output. The pin can be left disconnected if unused.

Thermal Protection

The FAN2514/15 is designed to supply high peak output currents of up to 1A for brief periods, however this output load will cause the device temperature to increase and exceed maximum ratings due to power dissipation. During output overload conditions, when the die temperature exceeds the shutdown limit temperature of 150°C, onboard thermal protection will disable the output until the temperature drops below this limit, at which point the output is then re-enabled.

During a thermal shutdown situation the user may assert the power-down function at the Enable pin, reducing power consumption to the minimum level I

GND

· V

IN

.

REV. 1.1.0 01/10/13

3

PRODUCT SPECIFICATION FAN2514/FAN2515

Thermal Characteristics

The FAN2514/15 is designed to supply 200mA at the specified output voltage with an operating die (junction) temperature of up to 125°C. Once the power dissipation and thermal resistance is known, the maximum junction temperature of the device can be calculated. While the power dissipation is calculated from known electrical parameters, the thermal resistance is a result of the thermal characteristics of the compact SOT23-5 surface-mount package and the surrounding PC Board copper to which it is mounted.

The power dissipation is equal to the product of the input-tooutput voltage differential and the output current plus the ground current multiplied by the input voltage, or:

P

D

=

(

V

IN

– V

OUT

)

I

OUT

+ V

IN

I

GND

The ground pin current I

GND

can be found in the charts provided in the Electrical Characteristics section.

The relationship describing the thermal behavior of the package is:

P

)

=

T

θ

JA

– T

A

------------------------------where T

J(max)

is the maximum allowable junction temperature of the die, which is 125°C, and T

A ing temperature.

θ

is the ambient operat-

JA

is dependent on the surrounding PC board layout and can be empirically obtained. While the

θ

JC

(junction-to-case) of the SOT23-5 package is specified at

130°C /W, the

θ

JA

of the minimum PWB footprint will be at least 235°C /W. This can be improved upon by providing a heat sink of surrounding copper ground on the PWB.

Depending on the size of the copper area, the resulting

θ

JA can range from approximately 180°C /W for one square inch to nearly 130°C /W for 4 square inches. The addition of backside copper with through-holes, stiffeners, and other enhancements can also aid in reducing this value. The heat contributed by the dissipation of other devices located nearby must be included in design considerations.

Once the limiting parameters in these two relationships have been determined, the design can be modified to ensure that the device remains within specified operating conditions.

If overload conditions are not considered, it is possible for the device to enter a thermal cycling loop, in which the circuit enters a shutdown condition, cools, re-enables, and then again overheats and shuts down repeatedly due to an unmanaged fault condition.

Operation of Adjustable Version

The adjustable version of the FAN2514/15 includes an input pin ADJ which allows the user to select an output voltage ranging from 1.8V to near V

IN

, using an external resistor divider. The voltage V

ADJ

presented to the ADJ pin is fed to the onboard error amplifier which adjusts the output voltage until V

ADJ

is equal to the onboard bandgap reference voltage of 1.3V(typ). The equation is:

V

OUT

= 1.3V

×

1 +

R upper

----------------

R lower

The total value of the resistor chain should not exceed

250K

total to keep the error amplifier biased during no-load conditions. Programming output voltages very near

V

IN

need to allow for the magnitude and variation of the dropout voltage V

DO

over load, supply, and temperature variations. Note that the low-leakage FET input to the

CMOS Error Amplifier induces no bias current error to the calculation.

General PWB Layout Considerations

To achieve the full performance of the device, careful circuit layout and grounding technique must be observed. Establishing a small local ground, to which the GND pin, the output and bypass capacitors are connected, is recommended, while the input capacitor should be grounded to the main ground plane. The quiet local ground is then routed back to the main ground plane using feedthrough vias. In general, the highfrequency compensation components (input, bypass, and output capacitors) should be located as close to the device as possible. The proximity of the output capacitor is especially important to achieve optimal noise compensation from the onboard error amplifier, especially during high load conditions. A large copper area in the local ground will provide the heat sinking discussed above when high power dissipation significantly increases the temperature of the device.

Component-side copper provides significantly better thermal performance for this surface-mount device, compared to that obtained when using only copper planes on the underside.

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REV. 1.1.0 01/10/13

FAN2514/FAN2515 PRODUCT SPECIFICATION

Absolute Maximum Ratings

(beyond which the device may be damaged)

1

Parameter

Power Supply Voltages

V

IN

(Measured to GND)

Enable Input (EN)

Applied voltage (Measured to GND)

2

ERR Output

Applied voltage (Measured to GND)

2

Power

Dissipation

3

Temperature

Junction

Lead Soldering (5 seconds)

Storage

Electrostatic Discharge

4

Min

0

0

0

-65

-65

4

Typ Max

7

7

7

Internally limited

150

260

150

Unit

V

V

V

°C

°C

°C kV

Notes:

1. Functional operation under any of these conditions is NOT implied. Performance and reliability are guaranteed only if Operating Conditions are not exceeded.

2. Applied voltage must be current limited to specified range.

3. Based upon thermally limited junction temperature:

P

D

=

T

Θ

JA

– T

A

-------------------------------

4. Human Body Model is 4kV minimum using Mil Std. 883E, method 3015.7. Machine Model is 400V minimum using JEDEC method A115-A.

Recommended Operating Conditions

Parameter

V

IN

Input Voltage Range

Min

2.7

Nom Max

6.5

Units

V

V

EN

V

ERR

T

J

θ

JA

θ

JC

Enable Input Voltage

ERR Flag Voltage

Junction Temperature

Thermal resistance

Thermal resistance

0

-40

220

130

V

IN

V

IN

+125

V

V

°C

°C/W

°C/W

REV. 1.1.0 01/10/13

5

PRODUCT SPECIFICATION FAN2514/FAN2515

Electrical Characteristics

(Notes 1, 2)

Symbol

Regulator

V

DO

Parameter

Drop Out Voltage

Conditions Min.

Typ.

Max.

Units

I

OUT

= 100 µA

I

OUT

= 50 mA

I

OUT

= 100 mA

I

OUT

= 150 mA

I

OUT

= 200 mA

2.5

50

100

150

170

4

75

140

180

200

2

1.40

V

O

Output Voltage Accuracy

V

REF

Reference Voltage Accuracy, Adjustable

Mode

V

O

3

Output Voltage Accuracy, Adjustable Mode

I

GND

Protection

Ground Pin Current

V

IL

V

IH

I

IH

I

I

Current Limit

I

GSD

T

SH

Shut-Down Current

Thermal Protection Shutdown Temperature

E

TL

ERR Trip Level

Enable Input

Logic Low Voltage

Logic High Voltage

Input Current High

Input Current Low

Switching Characteristics

(Notes 1, 2)

Parameter

Enable Input

4

Response time

Error Flag (FAN2515-XX)

Response time

Conditions

I

OUT

= 200 mA

EN = 0V

FAN2515 only

Min.

-2

1.24

-6

Thermally Protected

150

90

2.0

Typ.

1.32

95

1.2

1.4

Max.

500

6

75

1

99

0.4

1

1

%

µA

µA

°C

%

V

V

µA

µA

Unit

µsec

3 msec

Performance Characteristics

(Notes 1, 2)

Symbol

V

OUT

/

V

IN

V

OUT

/V

OUT e

N

PSRR

Parameter

Line regulation

Load regulation

Output noise

Power Supply Rejection

Conditions

V

IN

= (V

OUT

+ 1) to 6.5V

I

OUT

= 0.1 to 200mA

10Hz–1KHz

C

OUT

C

BYP

= 10µF,

= 0.01µF

>10KHz,

C

OUT

C

BYP

= 10µF,

= 0.01µF

120 Hz,

C

OUT

C

BYP

= 10µF,

= 0.01µF

Min.

Typ.

Max.

Units

0.3

1.0

<7

<0.01

43

Notes:

1. Unless otherwise stated, T

A

2. Bold values indicate -40

T

= 25°C, V

IN

J

125°C.

= V

OUT

+ 1V, I

OUT

= 100µA, V

IH

> 2.0 V.

3. The adjustable version, has a bandgap voltage range of 1.24V to 1.40V with a nominal value of 1.32V.

4. When using repeated cycling.

2.0

%

µV/

/

% dB

V

Hz mV mV mV mV mV

%

V

6

REV. 1.1.0 01/10/13

FAN2514/FAN2515

Typical Performance Characteristics

Power Supply

Rejection Ratio

100

80

I

OUT

= 100

µ

A

C

OUT

= 1.0

µ

F Cer.

60

40

20

V

IN

= 4.0V

V

OUT

= 3.0V

0

10

100

1k 10k 100k 1M 10M

Frequency (Hz)

Power Supply

Rejection Ratio

100

80

V

IN

= 4.0V

V

OUT

= 3.0V

I

OUT

= 10mA

C

OUT

= 1.0

µ

F Cer.

60

40

20

0

10 100 1k 10k 100k 1M 10M

Frequency (Hz)

Power Supply

Rejection Ratio

100

80

I

OUT

= 200mA

C

OUT

= 1.0

µ

F Cer.

60

V

IN

= 4.0V

V

OUT

= 3.0V

40

20

0

10 100 1k 10k 100k 1M 10M

Frequency (Hz)

Power Supply

Rejection Ratio

100

80

V

IN

= 4.0V

V

OUT

= 3.0V

60

40

20

I

OUT

= 100

µ

A

C

C

OUT

BYP

= 10

µ

F Cer.

= 0.01

µ

F

0

10

100 1k 10k 100k 1M 10M

Frequency (Hz)

Power Supply

Rejection Ratio

100

80

I

OUT

= 100mA

C

C

OUT

BYP

= 10

µ

F Cer.

= 0.01

µ

F

60

40

V

IN

= 4.0V

V

OUT

= 3.0V

20

0

10 100

1k 10k 100k 1M 10M

Frequency (Hz)

Power Supply

Rejection Ratio

100

80

I

OUT

= 200mA

C

C

OUT

BYP

= 10

µ

F Cer.

= 0.01

µ

F

60

V

IN

= 4.0V

V

OUT

= 3.0V

40

20

0

10 100

1k 10k 100k 1M 10M

Frequency (Hz)

70

Power Supply

Rejection Ratio vs. Voltage

60

I

OUT

= 100

µ

A

10mA

50

40

30

20

10

0

3.1

100mA

200mA

C

OUT

C

BYP

= 10

µ

F Cer.

= 0.01

µ

F

3.6

Voltage (V)

4.1

REV. 1.1.0 01/10/13

10

1

0.1

Noise Performance

V

IN

= 4V

V

OUT

= 3V

0.01

0.001

C

C

I

OUT

BYP

= 1.0

µ

F

= 0.01

µ

F

L

= 10

µ

A

0.0001

10 100 1k 10k 100k 1M

Frequency (Hz)

PRODUCT SPECIFICATION

Power Supply

Rejection Ratio

100

80

V

IN

= 4.0V

V

OUT

= 3.0V

I

OUT

= 100mA

C

OUT

= 1.0

µ

F Cer.

60

40

20

0

10 100 1k 10k 100k 1M 10M

Frequency (Hz)

Power Supply

Rejection Ratio

100

80

60

V

IN

= 4.0V

V

OUT

= 3.0V

I

OUT

= 10mA

C

OUT

C

BYP

= 10

µ

F Cer.

= 0.01

µ

F

40

20

0

10

100 1k 10k 100k 1M 10M

Frequency (Hz)

70

Power Supply

Rejection Ratio vs. Voltage

I

OUT

= 100

µ

A

60

10mA

50

40

30

20

10

0

3.1

100mA

200mA

C

OUT

= 1.0

µ

F Cer.

3.6

Voltage (V)

4.1

40.00

38.00

Ground Pin Current

36.00

34.00

32.00

30.00

0.1

1 10 100

Load Current (mA)

7

PRODUCT SPECIFICATION

Typical Performance Characteristics

(continued)

70.00

60.00

50.00

40.00

30.00

20.00

10.00

0.00

3.0

Ground Pin Current

V

OUT

I

OUT

= 3V

= 100

µ

A

4.0

5.0

6.0

Input Voltage (V)

7.0

70.00

60.00

50.00

40.00

30.00

20.00

10.00

0.00

3.0

Ground Pin Current

V

OUT

I

OUT

= 3V

= 300mA

4.0

5.0

6.0

Input Voltage (V)

7.0

Ground Pin Current

75

50

V

V

I

L

IN

= 4V

OUT

= 3V

= 200mA

25

0

-40

0 40

80

Temperature (

°

C)

125

150.00

120.00

90.00

60.00

30.00

0.00

0.1

Dropout Voltage

50 100 150

Output Current (mA)

200

Dropout Voltage

8

6

4

2

I

L

= 100

µ

A

0

-40 0 40 80

Temperature (

°

C)

125

Functional Characteristics

Enable Pin Delay

Enable

Dropout Voltage

200

150

100

50

I

L

= 200mA

0

-40 0 40 80

Temperature (

°

C)

125

V

OUT

Time (20

µ s/div)

Shutdown Delay

V

OUT

Disable

Time (20

µ s/div)

FAN2514/FAN2515

Ground Pin Current

75

50

V

IN

= 4V

V

I

L

OUT

= 3V

= 100

µ

A

25

0

-40 0 40 80

Temperature (

°

C)

125

Dropout Characteristics

3.5

3.0

2.5

V

OUT

= 3V

R

OUT

= 30K

2.0

R

OUT

= 20

1.5

1.0

0.5

0.0

0.0

1.0

2.0

3.0

Input Voltage (V)

4.0

5.0

Output Voltage vs. Temperature

3.05

3

2.95

2.9

2.85

-40

0

V

IN

= 4V

Typical 3V device

I

L

= 100

µ

A

40

80

Temperature (

°

C)

125

8

REV. 1.1.0 01/10/13

PRODUCT SPECIFICATION

Mechanical Dimensions

5-Lead SOT-23-5 (S) Package

B c

D

A

A1

E

L

α e e1

H

Symbol

Inches

Min.

Max.

.035

.000

.008

.003

.106

.057

.006

.020

.010

.122

.059

.071

.037 BSC

.075 BSC

.087

.126

.004

0

°

.024

10

°

Millimeters

Min.

Max.

.90

.00

.20

.08

2.70

1.45

.15

.50

.25

3.10

1.50

1.80

.95 BSC

1.90 BSC

2.20

3.20

.10

0

°

.60

10

°

Notes

B e

L

FAN2514/FAN2515

Notes:

1. Package outline exclusive of mold flash & metal burr.

2.

3.

Package outline exclusive of solder plating.

EIAJ Ref Number SC-74A.

E

H e1

D c

A1

A

9

REV. 1.1.0 01/10/13

PRODUCT SPECIFICATION

Ordering Information

Product Number

FAN2514SX

FAN2514S30X

FAN2515S25X

V

OUT

Adj.

3.0

2.5

Pin 4 Function

Adjust

Bypass

Error output

FAN2514/FAN2515

Package Marking

AGA

AGW

AHE

Tape and Reel Information

Quantity

3000

Reel Size

7"

Width

8mm

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO

ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME

ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;

NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES

OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR

CORPORATION. As used herein:

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.

2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

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