Untitled - QNV Solutions

Untitled - QNV Solutions
Table of Contents
Table of Contents
About ADLINK
A Global Company ..................................................................................................................................................................
Design and Manufacturing Services ......................................................................................................................................
P2
P4
Technology
IoT Solutions .........................................................................................................................................................................
SEMA .....................................................................................................................................................................................
SEMA Cloud .............................................................................................................................................................................
Designed for Extreme Ruggedness .......................................................................................................................................
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Applications
Medical ....................................................................................................................................................................................
Industrial Automation ............................................................................................................................................................
Transportation ........................................................................................................................................................................
Infotainment ...........................................................................................................................................................................
Defense ...................................................................................................................................................................................
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Product Introduction and Selection Guides
Computer-on-Modules
COM Express ..........................................................................................................................................................................................................
Type 7 Basic size: Express-BD7, Carrier Board and Starter Kit ..........................................................................................
Type 6 Basic size: Express-SL/SLE, Express-BL, Express-BE ...............................................................................................
Type 6 Basic size: Express-HL/HLE, Express-IB ..................................................................................................................
Type 6 Compact size: cExpress-SL, cExpress-BL, cExpress-HL ...........................................................................................
Type 6 Compact size: cExpress-AL, cExpress-BW, cExpress-BT .........................................................................................
Type 6 Carrier Board and Starter Kit ..................................................................................................................................
Type 10 Mini size: nanoX-AL, nanoX-BT, nanoX-TC, nanoX-TCR .........................................................................................
Type 10 Carrier Board and Starter Kit ...............................................................................................................................
Type 2 Basic size: Express-HL2, Express-IBE2, cExpress-BT2, Express-CVC ......................................................................
Type 2 Carrier Board and Starter Kit .................................................................................................................................
Engineering Test Tools .......................................................................................................................................................
SMARC ...................................................................................................................................................................................................................
SMARC x85-based: LEC-BW, LEC-BTS, LEC-BT ....................................................................................................................
SMARC ARM-based LEC-iMX6, LEC-iMX6-2G ......................................................................................................................
SMARC Starter Kits .............................................................................................................................................................
Qseven ....................................................................................................................................................................................................................
Qseven Standard size: Q7-BW, Q7-BT and Carrier Board ...................................................................................................
ETX ...........................................................................................................................................................................................................................
ETX Module: ETX-BT and Carrier Board .............................................................................................................................
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Small Form Factor Single Board Computers
PC/104 ...................................................................................................................................................................................................................
PCI/104 SBCs: CM3-BT4-E3845, CM3-BT1-E3815 ..............................................................................................................
PCI/104-Express SBC: CM-920 and PC/104-Plus SBC: CM2-BT2-E3825 .............................................................................
PC/104 SBCs: CM1-BT1, CM1-86DX3, CM1-86DX2, CM-430 ..............................................................................................
Mini-ITX ..................................................................................................................................................................................................................
High Performance Mini-ITX Embedded Boards: AmITX-SL-G, AmITX-HL-G, AmITX-BE-G .................................................
Low Power Consumption Mini-ITX Embedded Boards: AmITX-BW-I, AmITX-BT-I, AmITX-IB-I ..........................................
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P1
A Global Company
ADLINK, a manufacturer of embedded computing technology, leads the field with integration of computing
power, rugged design, high availability, and industrial I/O. Dedicated to test & measurement, industrial
automation, defense and aerospace, gaming, communications, medical, and transportation applications,
ADLINK has made a name for itself providing reliable products of superior quality for cost-effective solutions,
allowing our customers around the world to significantly reduce time-to-market burdens while increasing their
competitive edge.
By providing leading-edge application-ready platforms and industrial building blocks, ADLINK empowers our
customers, allowing them to minimize total cost of ownership (TOC) with customization and system integration
advantages, keeping manufacturing costs low and extending product lifecycles.
ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and is active in several
standards organizations, including the PCI Industrial Computer Manufacturers Group (PICMG), the PXI Systems
Alliance (PXISA), and the Standardization Group for Embedded Technologies (SGET).
ADLINK is a global company with headquarters in Taiwan; manufacturing in Taiwan and China; R&D and
integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support
offices. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX
Taiwan Stock Exchange (stock code: 6166).ADLINK products are currently available in over 40 countries across 5
continents, supported by worldwide distribution networks and offices and over 1600 employees.
P2
About ADLINK
Products and Services
Computer on Modules
Embedded Computing
With the combined experience and technical knowledge
of ADLINK, Ampro Computers and LiPPERT Embedded
Computers, ADLINK is able to provide a wide range of
Computer-on-Modules and Small Form Factor (SFF) Single
Board Computers. Our Extreme Rugged product lines have
wide operating temperature ranges and meet MIL-STD shock
and vibration specifications.
ADLINK works closely with Intel® to ensure that we develop and
introduce innovative computing technologies by implementing
embedded computing roadmaps and selecting computer solutions
that best fit our target markets. This enables ADLINK to provide
the highest quality and performance products with the long life
cycles required by our embedded computing customers.
ADLINK offers Extreme Rugged COM Express modules
in Basic, Compact and Mini sizes that are suited for highend graphics applications, military computers, high speed
communications and other embedded applications.
Computer-on-Modules
COM Express
SMARC
Qseven
ETX
Network Appliances
Outdoor Rugged Servers Media Cloud Servers
AdvancedTCA 6U/3U CompactPCI Platforms VPX Blades and Development Kits
Extreme Rugged Systems
Embedded Flash Storage
SFF Single Board Computers
Measurement and Automation
ADLINK's single board computers (SBCs) encompass a variety
of form factors (e.g., PC/104 and Mini-ITX), processors, clock
speeds, memory configurations, I/O options and operating
systems. These diverse options service the IoT's varied design
and budget requirements.
ADLINK’s is dedicated to providing reliable, top quality products
for industrial I/O control, motion control, digital imaging,
data acquisition, and modular instrument applications. Our
comprehensive portfolio of measurement and automation
products, application ready platforms, and easy-to-use software
packages, with integrated value-added service, continually meet
and exceed customer requirements for industrial automation
systems, machine vision systems, and automated test and
measurement equipment.
SFF Single Board Computers
PC/104 family
Mini-ITX
PXI & Modular Instruments
Data Acquisition
GPIB & Bus Expansion
Machine Vision
Motion Control
Distributed I/O
Intelligent Computing Platforms
Handheld computers
SEMA and SEMA Cloud
Mobile and Panel Computing
ADLINK's Smart Embedded Management Agent (SEMA) and
SEMA Cloud offer users the entire infrastructure required.
for an industrial grade end-to-end IoT solution connecting
embedded devices to the cloud. Customers do not need to
develop their own cloud solution, avoiding laborious checking
of hardware compatibility, finding a suitable cloud server,
implementing data encryption or developing proprietary
communication protocols. In addition to individual devices,
SEMA Cloud includes encrypted data transfer to our cloud
infrastructure and an intuitive graphical user interface (GUI)
to monitor and/or control devices from any location at any
time via the Internet.
ADLINK is dedicated to providing rugged mobile and panel
computing products for industrial applications, including industrial
automation, logistics management and medical. We specialize in
meeting the needs of harsh and demanding environments, as well
as mobile deployments in industrial settings.
Tablet PCs
Industrial Monitors and Panel Computers
Medical Monitors and Panel Computers
Industrial Grade Cloud Solution
SEMA and SEMA Cloud
P3
Design and Manufacturing Services
To fulfill your requirement of high quality, cost-effective products,
with quick time to market in product development, ADLINK has
established and assembled an Design and Manufacturing Services
team to cater to the specific demands that off-the-shelf products
could not meet.
From embedded computers, data acquisition cards, and CompactPCI
systems to related software packages, our DMS design team has
the expertise to rapidly prototype upon the approval of finalized
specifications. In addition, the winning of ISO-9001 certification
ensures the exactitude of our research and development
procedures with the highest product quality.
ADLINK owns and operates the manufacturing facilities in our Asia
headquarters. Complete capabilities include our own PCB layout
teams, SMT lines, system integration, and test capabilities. In short,
ADLINK controls the whole manufacturing process, from layout and
design to prototyping and volume production.
Customer Services
ADLINK is not only devoted to providing local service worldwide, but also to providing convenient online service, The following
services are available around the clock on the Internet.
eRMA
ADLINK customers can send their RMA requests via our eRMA system. After obtaining an RMA number, you can track your RMA
status online at any time.
Partner Center
The ADLINK Partner Center is specifically designed for worldwide sales and marketing support to allow our global sales
representatives and distributors access to real-time product and marketing information and materials as soon as they are released
at ADLINK headquarters. More than a resource database, the ADLINK Partner Center will also facilitate your business in serving
customers.
Ask An Expert
This is the place to get help for ADLINK products. 'Ask an Expert' provides answers to commonly asked questions, or you can click on
the 'Ask a Question' tab to contact ADLINK's knowledgeable staff about a specific product or issue. ADLINK AAE (Ask an Expert) is
available 24/7 online and is staffed by dedicated professionals who are available to address customers' needs and answers question.
All issues and comments are recorded into a database and can be tracked/reviewed at anytime. ADLINK customers are invited to
access the AAE system at: http://www.adlinktech.com/AAE
P4
About ADLINK
Environmental Protection Policy
ADLINK implemented a Green Product Policy in May 2004 to align the purchasing and use of green products meeting requirements
from international environment protection statutes. Environmental protection is a top priority for the management at ADLINK.
Measures have been taken to ensure that our products have little impact on the environment. In addition to planning a leadless
process, the affect on the environment of components and raw materials will also be reduced. The Green Product concept has been
built into our new product development system to ensure protection of the environment and continued business success.
RoHS Compliant Computing
ADLINK is committed to fulfill its social responsibility to global environmental preservation through compliance with the European
Union's Restriction of Hazardous Substances (RoHS) directive, which restricts the use of harmful substances such as lead, mercury
and cadmium in new equipment.
Most end-user applications in which ADLINK products are used do not require RoHS compliance. However, ADLINK will actively
work with customers whose products are not RoHS exempt under category 8 or category 9 classifications. Our lead-free production
line and process, including solder paste, solder bar and process control parameters, has been developed and standardized in our
manufacturing system.
Conflict Free Minerals Policy
ADLINK will not knowingly procure material supplies and components that contain minerals that directly or indirectly finance or
benefit armed groups in the Democratic Republic of Congo (DRC) or an adjoining country.
We urge our suppliers to support this policy in their own procurement guidelines and provide us with accurate country of origin
information.
ADLINK shall:
Comply fully with requests from EICC-GeSI.
Conduct a reasonable country of origin inquiry to clarify the origins of the Gold, Tantalum, Tungsten and Tin used in our products.
Establish reasonable objectives and targets with a goal of ascertaining and minimizing ADLINK's risk. With a goal of continuous
improvement for our Conflict Free Minerals Program, develop a means to measure objectives and targets. ADLINK will also review,
revise and report these measures, and overall program updates, on an annual basis.
Empower all employees, suppliers, vendors and contractors to take ownership in complying with the Conflict Free Minerals Policy
and to escalate risks in the supply chain to management's attention.
Effectively communicate to all employees this Conflict Free Minerals Policy and our Conflict Free Minerals Program.
Management Flow
The management flow of ADLINK's Green Policy begins during the development stage of a product. Only parts and raw materials
that meet RoHS requirements are sourced. Our engineers specifically design products using only qualified components. A lead-free
process ensures that manufactured products are "green." Green products do not contain environmentally hazardous elements and
can easily be recycled.
REACH Declaration
The Registration, Evaluation, Authorization and Restriction of Chemicals Regulation 1907/2006, commonly referred to as "REACH",
is Europe's new chemicals legislation. The products that we supply are non-chemical products and under normal and reasonable use,
they will not release harmful substance. Furthermore, we will immediately inform you in correspondence to REACH-Article 33 if any
substance of content (as from a content of >0.1%) in our products will be classified alarming by the European Agency for Chemicals
ECHA.
P5
IoT Solutions
IoT Solutions with Proven Building Blocks, Intelligent
Gateways, and Cloud-Based Remote Management
Embedded platforms are in transformation, evolving from standalone compute systems to becoming
part of the Internet of Things (IoT). More than just Internet-enabled, these intelligent systems are
networked and communicating, gathering and sharing information that enables insight and solves
problems. Improving healthcare, enabling intelligent transportation systems, and modernizing
manufacturing, intelligent IoT devices are delivering benefits to a wide range of industries, empowering
business transformation all over the world.
While the concept of sharing and analyzing business information is not new, the IoT leapfrogs
piecemeal, proprietary data applications by enabling time-sensitive data capture, access, analytics and
action with standards-based third-party vendor solutions. Software, hardware and end-user applications
work together in real-time to expand network access, functionality and intelligent performance to
unlock data that was previously hidden. Now capitalizing on the business value of real-time data
analytics is no longer limited to enterprises with the resources to develop their own proprietary
systems. Through proven, standardized system components, today's IoT is flexible, widely deployable,
and already enabling intelligent data applications in the mainstream business world.
ADLINK's standards-based building blocks enable compact, rugged devices for non-stop data gathering;
high performance gateways for securely connecting devices and systems for effective real-time
communication of data; and secure cloud services for ensuring system health and performance.
End-to-end solutions to build your IoT
ADLINK offers a full range of products for the IoT ecosystem from edge devices
to cloud control centers, including I/O modules, embedded modules, embedded
systems based on industry standard form factors, mobile computers, network
infrastructure, and cloud services to help you to create your own IoT. We
provide Application Ready Intelligent Platforms and services to support and
distinguish you with fast time-to-market and reduce development efforts of
new applications. ADLINK also works closely with our customers to understand
their unique requirements for individual devices or end-to-end solutions, and
helps customers to solve the development challenges of their particular market.
Create business value with intelligent and central
management
ADLINK's embedded building blocks and systems have ADLINK's Smart
Embedded Management Agent (SEMA) and SEMA Cloud capabilities built-in
to enable those devices for remote management and the data exchange to
and from the cloud. SEMA Cloud allows you to securely and remotely monitor
system status, diagnose problems and handle system management tasks from
anywhere at any time over the Internet. With the convenience of integrated
remote monitoring, control and configuration using SEMA Cloud, you can
collect and analyze all the data on a unified platform and transform it into
business insights to drive operational efficiency.
High bandwidth network infrastructure for big data
processes
The network infrastructure plays a critical role as the connectivity platform for
control and operational systems, sensors, machines, and devices in the Industrial
IoT. It must provide secure and high bandwidth pathways able to support
billions of connected devices, people, processes. ADLINK's industrial networking
products for network infrastructure offer the outstanding communications
capabilities that are necessary to handle the needs of big data for today and
into the future.
P6
Technology
Remote Management Has Broad Business Value
Remote management through the SEMA Cloud delivers broad business value; ready access to system health is now available to all
industries, and can be implemented in nearly any embedded arena. For example, a telecommunications base station can be serviced
prior to failure or key parts to refrigeration equipment can be replaced upon prediction of performance issues. Likewise, HVAC
maintenance can be scheduled according to the actual system usage, rather than being performed on a fixed schedule.
System monitoring and management services also add a revenue-generating opportunity to the IoT. Instead of end-users handling
system management in-house, IoT providers can outsource monitoring, management and maintenance of devices and systems to
provide greater convenience and higher efficiency for their customers. IoT value extends even further as data can be used to improve
business operations beyond equipment maintenance. With real-time data, operators understand how machines are used and can
apply appropriate actions. Machines can be shut down during periods of low of user activity, rerouted to support increased demand,
or restocked quickly to meet customer preferences.
Centralized Cloud Access Adds Business Value
Intelligent middleware and web-based services, such as ADLINK’s Smart Embedded Management Agent (SEMA) remote management
interface working together with the SEMA Cloud, facilitate the pushing and pulling of data in real-time for anytime, anywhere access.
Pushing data to the cloud enables operators to verify, monitor and manage system performance from a single, central location improving reliability and reducing management costs. For example, the M2M stack in SEMA Cloud pushes system data to the cloud
server via any kind of TCP/IP connection. System managers have easy and secure access to data and analytics through any commercial
cloud portal, using any device (e.g., PC, tablet, smart phone).
Cloud-based remote management furthers system management by enabling observation anytime, anywhere. Embedded
management agents continuously upload data through an encrypted Transport Layer Security (TLS, the successor protocol of Secure
Sockets Layer or SSL) connection. This information can be displayed on the user's information dashboard, for example temperature
and power consumption for different parts of the embedded system.
SEMA Cloud and the always-on IoT framework together enable a new level of system reliability, preventing downtime more
effectively than previously possible for offline devices. Operators can proactively interact with the system, detecting potential issues
in advance, as well as responding quickly to system failures.
P7
IoT Enables More Intelligent Application of Data
The Internet of Things is enabling devices and systems
to collect and share data to enable real-time business
value. Yet, the IoT’s complexity and cost have been
daunting enough to restrict deployments to only those
firms who can afford to develop their own proprietary
systems for data analytics. To date, the market has
remained fragmented, costly and without standardsbased solutions.
Connected systems can do more by using the
intelligence produced by embedded processing in realtime. With centralized data and sophisticated analytics,
volumes of previously unused or archived data can now
add immediate business value. IoT end-user data can
fuel modern applications like smart cities, automated
factories, in-vehicle safety systems, intelligent
transportation, energy grid automation, and connected
health services. Using ADLINK’s comprehensive
framework for standards-based IoT functionality,
more industries can embrace IoT business advantages.
IoT development and deployment are much simpler,
devices and systems get to market much more quickly,
and risk is removed from the equation. Allied
with Intel and supported by both a rugged design
pedigree and real-world IoT experience, ADLINK
is superbly poised to help developers and OEMs
innovate high performance IoT designs.
Standards-based Technology Enables Mainstream IoT
Intelligent data-gathering devices are enabled by small, high performance building block components; intelligent
gateways provide ready-made platforms to ensure connectivity that effectively moves the data; and innovative
cloud services optimize non-stop data access and system health analytics.
IoT Gateways
The IoT requires effective communication between distributed intelligent devices and the network or cloud infrastructure. ADLINK’s
gateway solutions provide a pre-validated hardware and software platform for sharing data from device-to-cloud - enabling device
security, smart connectivity, rich network options, and powerful device management.
ADLINK’s embedded IoT gateway platforms provide an extremely compact footprint, with options based on the Intel® Quark™ SoC
X1000 Series and Atom™ SoC E3800 processors. Communications options are flexible, and ADLINK’s platform supports a spectrum
of options such as Wi-Fi, 3G and LTE. Integration with McAfee Embedded Control provides complete protection from unwanted
applications, including comprehensive change policy enforcement and compliance management. This simple, lightweight software
technology is essential to securing IoT and also makes IoT devices resilient to malware infections and attacks. Combined with ADLINK’s
Smart Embedded Management Agent (SEMA) Cloud, system operators have both the remote manageability and security critical to IoT
deployments.
ADLINK’s new family of intelligent gateway solutions supports Intel® Gateway Solutions for IoT, a family of platforms designed to
connect a wide range of devices. What
makes them intelligent? ADLINK’s gateway
solutions are built on open architecture to
ensure interoperability between systems,
enable wide application development, and
allow easy services deployment. These
platforms include scalable Intel-based
microprocessors for low power performance,
and integrate a Wind River operating system
and middleware that provides all critical
elements to manage and communicate
with IoT devices. Developers are enabled
with a sustainable and secure software
development environment based on the
Wind River Intelligent Device Platform
XT. This development tool features preintegrated components that are fully tested
Factory Performance Optimization and Process Control Monitoring
and ready-to-use in securing, managing and
ADLINK's embedded IoT gateway platform with rich IO interfaces, allowing connection to a wide variety of devices
connecting intelligent gateways.
for automated data collection and analysis enables active early warning systems to avoid unexpected downtime in
industrial automation.
P8
Technology
Enabling IoT Devices with Proven Building Blocks
More than a standalone system or typical handheld device, IoT systems and devices function as part of a larger application.
These smart devices gather data through sensors and user applications and can vary dramatically in terms of form and function.
A handheld device used to track fleet management activities, an intelligent safety system within a smart vehicle, a computerintegrated manufacturing (CIM) solution capturing production data on a factory assembly line - these “things” and many more like
them all have a potential role in bringing IoT value to global business.
An IoT device does not have to be handheld or mobile, and is essentially any computing engine in an endpoint solution that enables
that solution to be intelligent and connected. An IoT device can be the hardware/software solution inside the dashboard of a car
that enables automation via a mobile app. A device can live inside a pharmaceutical vending machine, accessing a cloud database
to retrieve secure patient data required to dispense prescriptions. For developers, the challenge depends on the application. IoT
devices and systems may need to be low power or high performance. For cost effectiveness, they consistently need to be flexible,
upgradable, rugged, manageable, and standards-based.
Computer-on-Modules
Small IoT devices are often based on Computer-on-Modules (COMs), enabling performance and
versatility in a very small footprint. ADLINK’s COMs address a spectrum of power and performance
options in standards that include COM Express®, Qseven® and SMARC® (Smart Mobility
ARChitecture). These solutions provide solid options for graphics-intensive, mobile, applications,
such as medical imaging and emergency response.
PC/104 Single Boards Computers and Mini-ITX Embedded Boards
ADLINK’s single board computers (SBCs) encompass a variety of form factors (e.g., PC/104
and Mini-ITX), processors, clock speeds, memory configurations, I/O options and operating
systems. These diverse options service the IoT’s varied design and budget requirements,
bringing field-proven reliability and performance to connected, intelligent platforms such as
in-vehicle and infrastructure applications in transportation applications.
Processor Blades
ADLINK offers rugged, blade-based technology in multiple form factors to serve a variety of
industries: CompactPCI® for intelligent transportation applications such as networked security
and safety, or vehicle control and diagnostics; AdvancedTCA® for next-generation telecom and
datacom applications such as video transcoding, packet processing and 4G/LTE backup; and a VPX
product line to meet the demands of rugged environments in military applications where size,
weight, and power (SWaP) matter.
Industrial I/O and Control Systems
ADLINK has extensive field experience and works closely with customers to understand
their requirements in industrial automation design. The IoT data acquired by ADLINK’s
various I/O modules and systems, including data acquisition (DAQ) cards, remote I/O
modules, and digital imaging, are designed for all manner of industrial settings and keep
production running smoothly and safely.
Industrial Tablets
ADLINK's industrial tablets enable faster time-to-market and reduced development costs for
system integrators. With integrated WWAN or WLAN capability, real-time IoT data can be
accessed easily anywhere to monitor and control equipment and optimize operation performance
in factories, asset tracking and building automation.
P9
SEMA
Intelligent Middleware to Monitor and Control your devices
Downtime of devices or systems is not acceptable in today's industries. To help customers to analyze their
systems and take counter measures for preventive maintenance, ADLINK has developed a tool which is
able to monitor and collect system performance and status information from the hardware in a timely,
flexible and precise manner: the Smart Embedded Management Agent (SEMA).
SEMA Overview
Time-to-Market (TTM) and Total-Costs-of-Ownership (TCO) are key aspects to producing competitive
products. To combine TTM and TCO in a reliable manner, a solid and reliable platform is fundamental. To
assist in this endeavor, every ADLINK computer-on-module (COM), single board computer (SBC) and MiniITX product is equipped with a Board Management Controller (BMC) device supporting SEMA.
Selection of SEMA Board Controller Functions
Initially designed for power
sequencing tasks, the BMC has
evolved to include many new and
useful features throughout the
years. Measuring system voltages
and currents, controlling fan speed,
accessing GPIOs and I2C bus are
only a few examples of these new
capabilities. Being compatible
with the latest PICMG Embedded
Application Programming Interface
specification (EAPI) reduces your
effort to port existing calls to
SEMA to nearly zero! On top of that
SEMA provides an extended set of
functions e.g. to show and control
CPU Operation Mode, to read out
HDD S.M.A.R.T. data or to read out a comprehensive set of system data.
Functional Overview
Providing the interface from the hardware to
the operating system is one of SEMA's most
important functions. The BMC first collects
all relevant information from the chipset and
other sources. Using the I2C driver and the
Extended EAPI the application layer fetches
the data and presents it to the user. The
application can be a local customer specific
implementation or the SEMA Dashboard
which can access the Extended EAPI also
remotely and which shows the data in userfriendly graphic interfaces, suitable for
supervision and troubleshooting.
Application Layer
Your Application
Extended EAPI
Extended EAPI Library
Driver Layer
I2C Protocol
Hardware / Firmware Layer
BMC
Controller
P 10
SEMA Application
(Dashboard)
I2C-bus
Chipset
Technology
SEMA Features
At the heart of SEMA is the Board Management Controller (BMC) supporting SEMA functions. The SEMA Extended EAPI provides
access to all functions then. And a webbased Dashboard allows to monitor remotely one or multiple devices / computer modules.
So SEMA comprises:
SEMA Board Management Controller HW and FW
SEMA Extended EAPI Library
SEMA Dashboard
SEMA supports the following functions and information:
CPU Operation Modes
User Area Access
Memory Information
Alerts for Power and Temperature Consumption
Network Information
I2C Bus Control
ACPI Power Management
Temperatures(CPU and Board)
HDD S.M.A.R.T
Bios Updates
Board Information
(Serial Number, Part Number, Firmware Version...)
Heartbeat
Fan Control
Power Consumption
GPIO Control
Forensic information is available after system or module failures includes minimum and maximum temperature of the CPU and
system, as well as HDD S.M.A.R.T information - all of which can be used to analyze system or module failure.
SEMA is available for Linux and Windows operating systems and for various HW platforms.
Intelligent Middleware
Online Portal
MXE-500i-9245
iMX6-9365
TLS/SSL
TR50
HTTPS
Custom Data
P 11
SEMA Cloud
The End-to-End Iot Application Enablement Platform
Downtime of devices or systems is not acceptable in today’s industries. To help
customers to analyze their systems and take counter measures for preventive
maintenance, ADLINK has developed a tool which is able to monitor and collect
system performance and status information from the hardware in a timely, flexible
and precise manner: the Smart Embedded Management Agent (SEMA).
By combining SEMA intelligent middleware with cloud connectivity, ADLINK takes
remote management technology a step further than previous generations. By
employing full connectivity, from edge to cloud to end application, SEMA-enabled
embedded devices can connect to the cloud without additional design requirements.
Pushing data to the cloud enables operators to verify, monitor and control system
performance from a single, central location – improving reliability and reducing
management costs.
Manage and control all devices with one click
Avoid system downtime by predictive maintenance
Integration of operational device data to business processes
Reducing the Total Cost of Ownership
Manage and control all devices with one click
Integrate an unlimited number of devices into the SEMA Cloud service
Monitoring and control all devices from anywhere at anytime
Reduce downtime and increase system reliability
Avoid system downtime with Predictive Maintenance
Proactively respond as irregularities are identified
Automatic event processing avoids system downtime
Assign threshold to any kind of data
Assign alerts when thresholds are crossed
Stay informed about irregularities by SMS and email Notifications
Integration of operational device data to business processes
vertical networked/ integration of embedded systems with business processes -> interface to ERP systems (e.g. SAP, SQL)
Reducing Total Cost of Ownership
Concurrently run common tasks for predefined
groups of devices
Remotely apply Software and Firmware
updates to devices
Save costs by avoiding on-site maintenance.
Being a holistic solution, ADLINK’s SEMA Cloud
is an IoT Application Eablement Platform
offering users the entire infrastructure
required. Customers do not need to develop
their own cloud solution, avoiding laborious
checking of hardware compatibility, finding
a suitable cloud server, implementing
data encryption or developing proprietary
communication protocols. SEMA Cloud is based
on ADLINK products. In addition to individual
devices, it includes encrypted data transfer
to our cloud infrastructure and an intuitive
graphical user interface (GUI) to monitor and/
or control devices from any location at any time
via the Internet.
P 12
Technology
ADLINK devices
All SEMA-enabled ADLINK products feature a Board
Management Controller (BMC). The BMC collects all
relevant data from the chipset and other sources and
provides it to a software layer, which prepares the data
and transfers it to the cloud via encrypted communication
(TLS).
Devices transmit data via Ethernet , Wireless LAN or /
cellular network to the cloud
Integrate external sensors using a Software
Development Kit (SDK)
Integrate exernal devices via MQTT/TR50 protocol
using an easy to use web application programming
interface (WebAPI)
Additional customer data can be transferred While Embedded Computing and Measurement and Automation Solutions form
ADLINK’s core offerings for many vertical markets, ADLINK is also focused on developing gateways to implement the Internetof-Things (IoT). Smart gateways collect data from sensors, which are not capable of autonomously transferring information to
the cloud. These gateways require a wide range of different interfaces and the relevant communication protocols to provide the
connection between sensors and the cloud infrastructure. So that legacy devices can be included, rarely used and uncommon may
need to be accommodated. Intelligent filtering of data by gateways reduces the bandwidth required.
ADLINK´s Global Cloud Server Infrastructure
ADLINK’s cloud services meet the highest safety standards and the highest demands on reliability. ADLINK´s cloud services are hosted
in Germany. Other locations in USA and Japan can be offered on request. Customers have the following key functions at their disposal:
ADLINK´s SEMA Cloud Gateway/Agent
The SEMA Cloud Gateway offers the ability of a device to interwork with the Cloud Server. The SEMA Cloud Gateway provides an
Operation Rule Processor and a local data base, so it is possible to execute rules and analysis of data and to take action locally
on device already before data is transferred to the cloud. If the devices lose the connection to the cloud, it will recognize the lost
connection and will store all data until the connection is reestablished. The contact of the devices for transmitting data can be
planned. At pre-defined times the device establishes a connection to the cloud and sends or receives data. That is possible for
2G/3G/4G connections. ADLINK´s Cloud agent is running on the most popular embedded OSes. It is available for Windows, Linux and
Android in 32/64Bit and it is usable on x86 and ARM architectures.
Operation Rule Processor: executes rules and analysis locally on the devicen the device
Not-always connected mode (2G/3G/4G)
Device Management
Manage connected devices with unique ID
Monitor data connection for quality and reliability
Re-establish connection and collect buffered data if connection has been lost
Store the data from field clients (optional)
SDK for customer specific data
connect your own sensors to devices
push your own data from device to the cloud
Data Management
Store the data from field clients in cloud database
Connection Management, including server availability and traffic control
Interface to ERP systems (e.g. SAP, SQL)
Download of any kind of files to one or multiple devices, e.g. to perform Firmware upgrades
Event Processing
Analyze device and sensor data using defined rules for device and data type
Trigger SEMA calls when preset threshold values are exceeded (e.g. send SMS or email notification, initiate system shutdown)
Operation Rule Processor: rules can be processed on cloud platform and locally on device level.
P 13
The Architecture of SEMA Cloud Use Case: Vending Machines
The following scenario demonstrates the various functions of ADLINK’s SEMA Cloud services, highlights potential savings and
illustrates its benefits.
Use Case: Vending Machines
Vending machines have been in use by retailers for many years as self-serve solutions to sell beverages, snacks, and tickets to
consumers. In recent years, vending machines have proliferated both in numbers and diversity. They can be found in many public
locations as well as private facilities, selling different types of goods and services. They are also becoming more and more intelligent,
supporting better user interfaces and offering more selection.
Situation
High cost of maintenance and support (software updates, troubleshooting and repairs)
Revenue loss when a vending machine goes out of order These challenges can be met with an Internet of Things (IoT) solution
enabled through two-way communication between vending machines and a cloud server. In the machine-to-cloud direction,
hardware status information and business data are periodically sent to the cloud server. Hardware status information is processed
in real-time for health assessment and failure detection. Data is stored in a database for further analysis and modeling. In the
cloud-to-machine direction, commands and data can be sent to manage, control, and configure the vending machines. This
includes performing remote diagnostics as well as pushing software updates to all devices as required.
Solution Architecture
Shown below is the end-to-end architecture of the Vending Machine Management and Analytics solution based on hardware,
software, and cloud technologies from ADLINK. In this solution, new and/or legacy vending machines are connected to the internet
via broadband or wireless connection. Data from vending machines are then aggregated and stored on the cloud. From there, the
data can be accessed via web-based dashboard, or retrieved by external applications for analytics purposes. Commands and data can
also be sent from the cloud to remotely manage and control the vending machines.
The key building blocks of the solution are:
Intelligent vending machines based on an ADLINK
board/module or custom solution, collecting device
data and supporting remote management, control and
configuration.
ADLINK IoT Gateways, aggregating data from multiple
vending machines and connecting securely to the cloud.
ADLINK SEMA Cloud solution, enabling edge-to-cloud
integration and supporting cloud-based management of
vending machines and real-time monitoring of machine
data.
ADLINK SEMA Cloud WebAPI
IoT Solution Benefits
Retailers have the most to benefit from this IoT solution
for vending machine management and analytics.
Operational expenses are significantly lowered due to
reduced resources directed at on-site care, maintenance
and repairs. Moreover, Internet based monitoring helps
to optimize delivery schedules and streamline logistics.
Business performance will also greatly benefit from an
increase in vending machine uptime. Pricing of sold goods
can be dynamically adjusted and simplified inventory
tracking helps optimize the range of available goods. Last
but not least, increased transparency improves business
insights into the entire sales process.
P 14
Remote Monitoring, Control and Diagnosis
Report Business Data
Firmware Updates
Technology
Environmental Protection Policy
ADLINK implemented a Green Product Policy in May 2004 to align the purchasing and use of green products meeting requirements
from international environment protection statutes. Environmental protection is a top priority for the management at ADLINK.
Measures have been taken to ensure that our products have little impact on the environment. In addition to planning a leadless
process, the affect on the environment of components and raw materials will also be reduced. The Green Product concept has been
built into our new product development system to ensure protection of the environment and continued business success.
P 15
Designed for Extreme Ruggedness
Introduction
By merging with Ampro in 2008, a wider selection of products and services is provided to ADLINK
customers, as well as the opportunity for ADLINK to develop more rugged devices aimed at new markets.
The addition of Ampro enables ADLINK to offer Extreme Rugged products and services for applications
that must endure the extremes of temperature, shock, and vibration encountered in harsh environments.
For a quarter century Ampro was a leading global provider of modular embedded computing solutions
for rugged and extreme rugged applications. Ampro's mission was to provide time saving solutions for
embedded systems designers that accelerate the product deployment process.
Applications
ADLINK has Extreme Rugged™ and rugged grade embedded solutions for extended temperature range
operation and high shock & vibration environments in a wide variety of markets.
Medical
ADLINK boards and systems are utilized in a variety of medical
applications and delicate procedures. Our products adhere to the
strictest of medical standards and provide unsurpassed reliability.
Defense
Extreme Rugged™ boards withstand intensities of military
environments. With the ability to endure temperatures from
-40°C to +85°C, our boards are able to perform precisely in harsh
conditions experienced all over the world.
Industrial
ADLINK’s broad range of form factors provide scalability in
performance, connectivity, size and energy requirements along
with modular flexibility, longevity and ruggedness to ensure our
products meet customer needs. With designs based upon open
standards, ADLINK boards and systems are easy to maintain and
upgrade.
Aviation
ADLINK single board computers (SBCs) and computer-on-modules
(COMs) easily perform under the extreme conditions of flight.
Able to operate at temperatures from -40°C to +85°C, our Extreme
Rugged™ boards easily withstand the conditions experienced at
high altitudes.
Transportation
Moving people and goods from one place to another is a
critical part of every society. One mistake can cause a ripple
effect through an entire economy. In both public and private
transportation, ADLINK boards provide rugged quality and
comprehensive data processing.
P 16
Technology
Design Methodology
True Ruggedness by Design
Many manufacturers claim to offer ruggedized products that give the impression of durability under tough conditions. The term
ruggedized often refers to desktop grade designs which are screened at high temperatures with high yield fallout. At ADLINK, we
believe that ruggedness should be inherent in the design. Our products are designed for industrial use, unlike many competitors
who make commercial-grade products and target the industrial market.
Our Extreme Rugged boards and systems are designed for harsh environments from the ground up. Extreme Rugged Development
Guidelines and Design Rules are incorporated into ADLINK products to "design in" the ability to withstand wide temperature range
operation and extreme shock & vibration. Special attention and care is given to component selection; circuit design; PCB thickness,
layout and materials; thermal solutions; enclosure design; and manufacturing process.
Robust testing, including the Highly Accelerated Life Test (HALT), ensures that products meet the rugged design requirements to
allow them to satisfy the demands for which Extreme Rugged products are intended. All products with the Extended Temperature
option are then burned in with the ETT Production Screening process to ensure long term reliability over the full Extreme Rugged
temperature range
Highly Accelerated Life Test – HALT
ADLINK rugged designs are verified using HALT during the product development process. The process consists of progressively
increased extremes of temperature (both high and low), rapid thermal transition, six-axis vibration, and finally, combined
temperature and vibration stress. During each test, stress is progressively increased while key subsystems are exercised, such as
the CPU, I/O ports, disk controllers and video. If a failure is detected, the failure is evaluated and immediate fixes are made. Testing
continues until destruct limits are reached. Failures and the physical damage found at the destruct limits provide data which is used
to improve the ruggedness of the product design. HALT test reports for the final product are available for customers to review.
These reports are very useful for demonstrating the design reliability of ADLINK products to customers with wide temperature
range requirements and high shock & vibration applications.
P 17
Shock & Vibration
ADLINK Extreme Rugged boards implement the following to meet shock and vibration requirements:
Thicker circuit boards
High retention capability sockets
Test fastening of all high mass components
Epoxy reinforced bonding of vulnerable components (if required)
Immersion silver plating
Extreme Rugged board products are shock and vibration tested to meet the MIL-STD-202G standard. This includes subjecting the
product to multiple 50 G shocks and 11.95 Grms of random vibration between 100 Hz and 1000 Hz along each axis. The units under
test are operational during vibration testing, with functional diagnostics performed on all hardware subsystems. After shock stresses
have been applied, the products are tested for functionality. Extreme Rugged systems are subjected to MIL-STD-810G vibration tests
for operational service in ground vehicles and functional shock tests.
Voltage and Temperature Margin Test
The Voltage and Temperature Margin Test suite is used during the product development process to subject the product to
temperatures well outside the intended operating temperature range (-40°C to +85°C for Extreme Rugged products†). The product
is simultaneously subjected to minimum and maximum rated voltages (±5%). This process verifies products are functional and stable
over combined extremes of both temperature and voltage, and ensures wide design margins resulting in long-term reliability under
all specified operating conditions.
Extended Temperature Testing
Assures your product will function in extreme temperatures
ADLINK Extreme Rugged products are designed for operation over an extended temperature range. To ensure optimal performance
and reliability of our products, Extended Temperature Testing (ETT) procedures are implemented over the entire product
development cycle. The following table outlines the ETT procedures followed during design, engineering verification and pilot run.
Design Check
Verify that the board can function over and beyond the full extended temperature range
by performing Functional and Burn-In tests at lower and upper temperature extremes.
Engineering
Verification
Verify that the board design meets extended temperature range and voltage margin specification
(perform Functional, Burn-In & Boot Up Tests over full extended temperature range), apply Thermal Shock Test.
Pilot Run
Verify that the board is ready for production
(perform functional tests and burn in, determine ETT yield)
ETT Production Screening
Step 5
Step 4
Step 7
Step 6
‒ 85°C ‒
1.2 °C/min
1.7 °C/min
1.5 °C/min
‒ 25°C ‒
‒ 0°C ‒
‒ -40°C ‒
Duration (minutes)
2 mins
40 mins
25°C
25°C → - 40°C
Power On
10 mins
20 mins
– 40°C
Power Off
Initial Check Temp Drop
P 18
Step 3
Step 2
Temperature ( °C )
ADLINK boards and systems are sold with a
"Standard" or "Extended" temperature rating.
To obtain the "Extended" temperature rating
(-40°C to +85°C for most Extreme Rugged
board products), customers must order the
optional Extended Temperature Testing
(ETT) service. Each "ETT" unit will be tested in
production to verify that it will operate over
the specified temperature range. A label is
applied to the product to indicate that it has
met the "Extended" temperature rating and
the test results are entered into a database.
The data collected is used for internal quality
assurance audits and customers may request
summarized test results of their product. The
screening profile used for this test is shown in
the graph below.
Step 1
Soak
Power On
Burn In
70 mins
10 mins
Power Off
Temp Rise
20 mins
85°C
– 40°C → 85°C
Power On
Soak
Burn In
50 mins
10 mins
Power Off
Temp Drop
20 mins
25°C
85°C → 25°C
Soak
Power On
Burn In
Technology
Conformal Coating
Prevents short circuits, corrosion, dendritic growth and
electromigration
Industrial, military, naval and airborne applications often expose boards to corrosive conditions
including humidity, salt spray, fungus and other contaminants. Conformal coating, a protective
material applied over electronic circuitry, can prevent short circuits, corrosion, dendritic growth
and electromigration of metals between conductors.
Based on Ampro’s proven heritage, ADLINK’s conformal coating process has provided enhanced
reliability and corrosion protection for over 20 years. The coating is applied by spraying, dipping
or flow coating the circuit board assembly. This coating is typically three mils (0.003”) thick.
ADLINK generally uses HumiSeal 1B31 Acrylic coating, although epoxy, urethane, paraxylylene
and silicone based coatings are also available upon request. Acrylic coatings are fast drying
and offer high moisture resistance, excellent flexibility and superior dielectric properties. The
coating is also easy to repair, and usually contains a UV safety tracer for ease of inspection
under a black light.
Extended Life Cycle
To support your ongoing production needs, the Lifecycle SolutionsSM program has been created for ADLINK products. From
component selection to strategic partnerships to component lifecycle management, ADLINK goes the extra mile to ensure that
standard, semi-custom and custom boards can be produced with no more than minor changes for years to come. When changes are
necessary, ADLINK provides advance notification and guidance through the transition to new hardware or BIOS extensions. And our
dedication to industry standards enables us to provide new products and product roadmaps that enable smooth resolution of end-oflife (EOL) migration issues.
The Lifecycle SolutionsSM program offers numerous long-term benefits, including:
ADLINK strives for a 7-year lifecycle for standard and semi-custom boards and systems.
During that period, ADLINK builds boards with the same components.
ADLINK provides 60-day written notice of necessary changes that affect form, fit or function of the board.
For End of Life (EOL) products, ADLINK gives you as much notice as possible to place orders and up to one full year to receive
shipments.
ADLINK secures long-term commitments from component suppliers before components are designed in, and works closely with
manufacturers and distributors to ensure long-term availability.
When suppliers notify us about upcoming component obsolescence, we determine migration alternatives and work with you early
on rather than delaying notification that can result in higher costs and inconvenience to you.
MIL-STD
MIL-STD is an abbreviation for United States Military Standard. These standards are used to help achieve standardization objectives
by the U.S. Department of Defense. Each standard has a number and a revision denoted by a letter of the alphabet (e.g. A, B, C, …).
Boards: Extreme Rugged board products are tested in accordance with MIL-STD-202G, the Department of Defense Test Method
Standard for Electronic and Electrical Component Parts:
Vibration: MIL-STD-202G, Method 214A, Table 214-I, Condition D (Operating: 11.95 Grms, 50-2000 Hz, each axis)
Shock: MIL-STD-202G, Method 213B, Table 213-1, Condition A (Non-operating: 50 G peak value, 11 ms duration, half-sine)
Systems: Extreme Rugged system products are tested in accordance with MIL-STD-810G, the Department of Defense Test Method
Standard for Environmental Engineering Considerations and Laboratory Tests:
Vibration: MIL-STD-810G, Method 514.6, Procedure I, Category 20 – Ground Vehicles
Shock: MIL-STD-810G, Method 516.6, Procedure I – Functional Shock (Operating: 40 G, 11 ms)
P 19
Medical
Optimized Patient Treatment Powered By Computeron-Modules
ADLINK’s intelligent platforms and Rugged by Design technologies are purpose-built for healthcare
settings, improving patient diagnosis and treatment options, and giving designers a competitive
edge with scalable, reliable solutions optimized for the rigors of modern medicine. For medical
device developers and manufacturers, ADLINK is your complete supplier of intelligent embedded
products. Development time is reduced, and medical device manufacturers can focus on their core
competencies in creating competitive, high performance healthcare applications.
Applications
Ultrasound
Operating room
Ambulance-based telemedicine
Patient’s Information System
Mobile medical devices
Bed-side care and entertainment
Benefits
Saving lives in real-time
Flexible and robust
Long lifecycle support
Accelerate time-to-market
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P 20
Express-SL
cExpress-SL
nanoX-AL
COM Express Basic Size Type
6 Module with 6th Gen Intel®
Core™ and Celeron® Processors
COM Express Compact Size
Type 6 Module with
6th Gen Intel® Core® and
Celeron® Processors
COM Express Mini Size
Type 10 Module with Next
Generation Processors
Applications
Enabling Longevity with Extended Product Lifecycles and Predictable Roadmaps
Medical designers are driven by the need for rapid product development that includes well-defined products that also offer
extended lifecycles. Medical design expertise and industry knowledge are key factors in achieving such product attributes. Trusted
partnerships support the competitive designs through shared engineering knowledge and expertise. The extended lifecycles are
achieved by combining careful component selection, BOM screening and, if necessary, our supply chain manages the end-of-life (EOL)
materials to meet product needs. Our in-house design and development capabilities expertly support engineers in long-life solutions,
including product planning and managing EOL transitions. Product lifecycles of seven years are typical for most products, and event
longer on a case-by-case basis.
Flexible, Robust Platforms Create Medical Market Advantage
With a strong understanding of how to design for patient safety, ADLINK's medical industry offerings range from low power, batterydriven, portable diagnostic systems to fixed-installation systems delivering extreme processing for high-definition imaging. ADLINK's
market advantage is our ability to facilitate the right solution at the right level of performance, including design and development
expertise. Our customers are expertly supported by our highly skilled team of hardware and software engineers, trained and
knowledgeable in the applications and concerns facing medical designers.Our SMARC modules are designed for portable or small
stationary systems with application scenarios especially for medical diagnoses and are especially designed suited for medical systems
requiring high performance graphics.
COM-based Mobile Platforms Enable Healthcare Anywhere
Advancements in medical imaging are broadly improving diagnosis and treatment options, with particular value in mobile healthcare
applications. As performance-to-power ratios advance with processor improvements, a wider range of mobile and visual applications
can capitalize on advanced graphics in portable devices, enabling better real-time analysis and diagnostics.
ADLINK’s latest COM Express products incorporate the latest processors, enabling significant improvements over previous processor
generations. Advanced power capabilities allow designers to customize power-to-performance ratios to suit specific applications.
New low power states extend battery life and improve cooling options for mobile applications, allowing passive cooling with no
venting or fans.
Quality through Certifications
ADLINK employs a state-of-the-art quality assurance system and all facilities are ISO-9001 certified. Many of the products have
received 60601-1 as well as UL, FCC, CSA and CE certifications. In addition, ADLINK's own manufacturing site is ISO 13485 certified,
providing the necessary documentation and processes for medical products.
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Dual or Quad Core Processor
Mini-ITX Embedded Board
with 6th Gen Intel® Core™
i7/i5/i3 Desktop Processor
P 21
Industrial Automation
Intelligent Platforms for Rugged Industrial Systems
Industrial automation applications rely on efficient, rugged embedded platforms. By utilizing
ADLINK’s embedded systems based on the optimum microprocessor architecture and the inter
communication between automated processes and embedded computers, the requirements for
industrial automation applications can be effectively fulfilled.
Robotics, Test and Measurement, Manufacturing Control and Visual applications all require real-time
capability, image recognition, and a networked infrastructure. ADLINK's computer-on-modules meet
these requirements, include standard interfaces such as Ethernet, PCI, PCIe, UART and USB, that are
brought out through standardized connectors to a custom carrier board which is designed for the
specific automation application ADLINK’s wide ranging product portfolio offers a complete solution
ideal for your specific industrial automation applications.
Applications
Welding Robots
Machine Automation
Textile Manufacturing
Test, Measurement and Control
Signal Acquisition and Generation
Factory Automation and Environmental
Intelligent Building Automation
Benefits
Easily integrated with standard IPC and motion, vision control boards
Industrial quality with high performance to cost
Validation for hard environment
Fast time to market
Best price/performance
Long life support
P 22
Applications
Going to Extremes to Ensure Industrial Performance
Development of Rugged by Design embedded computing solutions is at the core of ADLINK’s long company history, strengthened by
the integration of industry leader Ampro Computers. ADLINK’s Rugged by Design process subjects all rugged and Extreme Rugged™
products to MIL-STD shock, vibration and temperature testing during the product development process, rather than requalification
after the fact.
ADLINK’s Extreme Rugged™ boards and systems surpass industrial performance requirements vand meet or exceed MIL
specifications. Component selection, circuit design, printed circuit board (PCB) layout and materials, thermal solutions, enclosure
design and ISO- and TUV-certified development processes are handled with precision and validated by robust test methods including
MIL-STD-810 or MIL-STD-202 shock and vibration testing, as well as Highly Accelerated Life Testing (HALT).
Combining Power and Data for Streamlined Deployment
ADLINK's computer-on-modules are ideal for a wide spectrum manufacturing environments, and are deployed in severe computing
settings such as coal mining, materials handling, wafer processing, scanning and printing, 3D vision and robotics guidance and a
broad range of machine vision implementations. By offering innovative single cable solutions that deliver power over the data or
communication cable, ADLINK simplifies installation, diminishes maintenance requirements and reduces total cost-of-ownership
(TCO) for a broad range of industrial end-users.
Cloud-based Remote System Monitoring and Maintenance
ADLINK’s proprietary Smart Embedded Management Agent (SEMA) was developed to address the need for better housekeeping
tasks in the context of systems based on complex processors and chipsets. At the box-level, SEMA monitors BIOS, power,
temperature, watchdog and board information, and is distinguished by being able to manage systems that are standalone, connected
or remote.
ADLINK’s sophisticated preventive maintenance features add significant value for industrial customers, enabling advanced
functionality in contrast to typical third party toolkits or utilities. SEMA allows users to monitor their systems in real-time, stores
important data such as up-times and maximum temperatures, can call for help when needed, and can be easily managed and
monitored from a cloud-based interface.
Compact Vision Systems Enable 3D Guided Robotics
Advancements in 3D robot guidance have improved accuracy and speed in automated assembly and pick-and-place operations.
3D calibration is the essential first step, establishing the relationship between the robot, camera and object coordinates. Pattern
matching follows, allowing the robot to acquire object position and orientation, and then determine trajectory based on the
collected 3D data.
Industrial Design Leadership and Expertise
For industrial contractors and integrators, ADLINK is your complete supplier of Rugged by Design products, including systems that
provide robust, fault-free connectivity, as well as the wide, high speed I/O required to support the broad and growing spectrum of
industrial automation.
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P 23
Transportation
Flexible System Solutions for Intelligent Transportation
Systems
ADLINK delivers specialized embedded systems for railways, public transportation, heavy vehicles
and marine applications. Besides delivering hardware solutions, ADLINK supports specific software
environments that the transportation field requires such as: WEC 7/8, WES 7/8, VxWorks, QNX, and
RealTime Linux and Windows NT/2000.
Applications
Advanced Public Transportation Systems (APTS)
Wireless Communications Systems based on GPS and GSM
Traffic Light Synchronization
Platform Synchronization Management
Passenger Information Systems
Benefits
Guaranteed long-life product availability and system compatibility
Fast integration of the traditional IBIS bus with the latest GPS and RF communication systems in
a limited space
High reliability against shock and vibration
Easy management of remote boot by Intel® Pre-boot Execution Environment (PXE)
System development cycle is significantly reduced and facilitates later system upgrades and
maintenance
P 24
Applications
Remote Monitoring Solution with Reliability, Scalability and Manageability
Achieving robust and reliable connections between devices in a real-time monitoring & control system to ensure undisrupted
and accurate data transmission to and from the moving and vibrating railway environment is of supreme importance and poses
a challenge for engineers or system developers. Considering the particularities of the operating environment of rolling stock, all
devices onboard must be capable of withstanding harsh and constant shock and vibrations and extreme temperatures in widely
varying geographic locations. Systems used for rail transport need to be particularly rugged to deliver higher reliability and stability
to maintain non-stop operations.
ADLINK’s computer-on-modules meet the connectivity, ruggedness, manageability, longevity and scalability needs of rail
transportation applications. ADLINK’s modules provide high speed serial buses supporting Control Area Network (CAN) protocol, an
industrial standard developed for internal networking of automotive and other vehicles to deliver a high degree of data consistency
with error detection mechanisms.
Extending Deployments with Planned Product Lifecycles and Predictable Roadmaps
ADLINK, as one of the most active players in the computer-on-modules market, provides continuing support for the form factor by
revamping our product range with upgraded performance and new features enabled by the latest technologies. System developers
can use any of our new modules as a drop-in replacement to easily upgrade older systems at minimum cost and maximum scalability
to extend service life longevity.
The modules deliver the newest newest available connectivity features, such as two SATA 3Gb/s ports via onboard connectors and
ADLINK's Smart Embedded Management Agent (SEMA) to provide remote monitoring and management. Comprised of a hardware
board controller and a software suite, SEMA's remote hardware monitoring and control capabilities allow administrators or engineers
in the control center to remotely implement real-time management.
Versatile Computer-on-Modules Enable Intelligent Transportation Networks
ADLINK’s COM Express products enable transit agencies to communicate with customers and dispatch, maintain fleets and collect
and analyze operating data. Intelligent bus networks rely on smart COM-based onboard systems, controlling vehicle run switches,
front and rear doors, wheelchair ramps, stop requests, odometers, emergency alarms and more. Integrated GPS enables recording
of driving data and supports both wireless and cellular transmission, and Class A-certified devices allow testing against SAE
International standards.
Intelligent transportation networks combine an ADLINK rugged COM Express module, incorporating the latest processors, with a
custom baseboard. These systems are proven to be tolerant to higher levels of shock and vibration, and integrated Mini PCI Express
slots support 802.11 a/b/g/n and cellular modems for robust connectivity. Many of ADLINK’s COM Express products are further
validated Extreme Rugged™.
Flexible, Robust Platforms Enhance ITS Development
ADLINK’s rugged technologies are optimized for mission-critical train control and operation, networked security and safety, and high
performance passenger infotainment. Our extensive roster of Rugged by Design board-level, box-level and user interface solutions
provide reliability and flexibility across the spectrum of intelligent transportation systems - enabling high performance, faster timeto-market and reduced development costs for transportation system developers.
ADLINK’s customers are further supported with ongoing access to our team of highly skilled customer hardware and software
support engineers, expertly trained and knowledgeable in the applications and concerns facing transportation customers.
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P 25
Infotainment
Efficient Data Collection and Processing
Worldwide growth of the retail and gaming industry fueled by increased numbers of entertainments
and diverse lives along with advancements in technologies has opened up windows of opportunity for
system and service providers. New user interfaces such as self-service kiosks have refreshed the user
experience and helped create a more efficient and profitable business model for the betting industry
by reducing the number of ticketing counters and operating staff, shortening customer waiting times,
and maximizing end users’ requested information that can be issued in a limited time period.
Applications
Benefits
Kiosks (e.g. ATM, POS)
Betting machines
Reduced maintenance cost
Vending machines
Lottery terminals
Increased customer satisfaction
Digital signage
Slot machines
Customer information collection and sharing
Connecting Digital with Real Lives
ADLINK Infotainment solution for Gaming and Retail services include ATMs, floor plan guides, lottery &
slot machines and supermarket self-service kiosks. ADLINK computer-on-modules a nd Mini-TX embedded
boards provide flexible connection possibilities for system integrators to link and manage multiple
peripherals to meet application needs. Video lottery terminal and slot machines must sustain continuous
operation; thus, hardware stability and ease of maintenance become essential. ADLINK's extensive and
capabilities in hardware design and software development combined with our self-owned manufacturing
base allows us to provide reliable products of superior quality for cost-effective solutions.
Providing Personalized Corresponding Services
In the retail environment, multimedia digital signage that combines entertainment and information is one
of the best ways to communicate with consumers. Intelligent display panels powered by ADLINK products
can be installed above checkout counters or in other suitable locations. Supermarket self-service kiosks
are stand-alone terminals that integrate environment information, promotional products, membership
management and other relevant data through interactive multimedia communication.
Analyzed Big Data Turns to Revenue
ADLINK's SEMA-equipped computer-on-modules connect seamlessly to our SEMA Cloud solution to enable
remote monitoring, autonomous status analysis, custom data collection, and initiation of appropriate
actions. All collected data, including sensor measurements and management commands, are available any
place, at any time via encrypted data connection. With SEMA Cloud, managers of the infotainment services
can monitor the status of their machines from any location and react promptly to events and incidents.
The necessity for on-site visits is minimized and mean-time-to-repair is significantly reduced.
SEMA Cloud brings a business value-add by allowing the collection and analysis of “big data” from devices
like betting kiosks in the system. Vendors, operators and service providers will be able to acquire valuable
information about consumer behavior, helping them to develop a more profound insight into their
business and increase their competitive edge.
Related Products
P 26
AmITX-BW-I
AmITX-SL-G
Express-SL/SLE
Mini-ITX Motherboard
with Intel® Pentium® and
Celeron® Processors
Mini-ITX Embedded Board
with 6th Gen Intel® Core™
i7/i5/i3 Desktop Processor
COM Express Basic Size Type6
Module with 6th Gen Intel® Xeon®,
Core™ and Celeron® Processors
with ECC/non-ECC support
Defense
Applications
Extreme Rugged Computing for Defense and Aviation
Capitalizing on a rugged design pedigree spanning more than 25 years of military design advancements
and leadership, ADLINK’s Extreme Rugged™ systems, platforms and products meet the rigors and
technology readiness level (TRL) of military deployments, providing optimal Size, Weight, Power and Cost
(SWaP-C), high bandwidth and proven rugged performance in open architecture COTS-based solutions.
Originating Rugged by Design
ADLINK‘s Rugged by Design process means all Extreme Rugged products are subjected to MIL-STD shock,
vibration, and temperature testing during the product development process and not simply re-qualified
after the fact. This unique purpose-built approach ensures performance, availability and reliability
optimized for the rigors of mission-critical embedded environments.
ADLINK‘s Extreme Rugged boards and systems meet or exceed MIL specifications, incorporate thoughtful
design decisions regarding component selection, circuit board (PCB) layout and materials, thermal
solutions, enclosure design and manufacturing process, all supported by an industry leading testing
process. Extensive voltage and temperature margin tests validate ADLINK‘s Extreme Rugged products
during the development process, in addition to full MIL-STD-810 or MIL-STD-202 shock and vibration
testing. ADLINK‘s ISO- and TUV-certified development process features Highly Accelerated Life Testing
(HALT), and all Extreme Rugged products are available wiht conformal coating.
Long-Term Military Design Success
Our mandate is to solve rugged design challenges, maintaining high responsiveness to military customer
needs while enabling value, performance, flexibility and longevity for extended deployments. By offering
in-house design with manufacturing — a service combination as valuable as it is rare in our industry — we
maximize rugged design capabilities and capitalize on smart design principles such as Application Ready
Intelligent Platforms (ARIPs) that integrate both hardware and software to facilitate better performance,
faster time-to-market and reduced risk and cost of ownership.
Committed Standards Leadership
ADLINK supports COTS technology and open systems, offering flexible technologies and platforms.
Deployable as system imgredients or fully formed systems that ensure right-sized rugged performance,
ADLINK products blend hardware and software elements into intelligent platforms that enable a tangible
competitive edge in time-to-market.
Innovative Embedded Products and Capabilities
Signal processing is a critical element in today‘s mil/aero platforms, whether the computing application is
handling command and control, intelligence, surveillance or reconnaissance (C4ISR). Systems must provide
robust, fault-free connectivity, as well as the wide, high-speed I/O required to support visible spectrum
and infrared (IR) cameras, radar and other fast, high-definition sensors. ADLINK offers the latest Intel®
Core™ i7/i5/i3-based computing solutions, including multiprocessor SBCs as well as multiprocessor plus
GPGPUs and computing sub-systems, which enable and optimize mission-critical digital signal processing,
acceleration and compression.
Related Products
CM1-86DX3
CM2-BT2
CM-920
PC/104 Single Board
Computer with
Vortex86DX3 SoC
Extreme Rugged™ PC/104-Plus
Single Board Computer with
Intel® Atom™ Processor SoC
Extreme Rugged™ PCI/104Express Single Board Computer
with 3rd Generation Intel®
Core™ Processor
P 27
Computer-on-Modules
COM Express
A computer-on-module (COM) is a complete computer built on a
single circuit board. However, unlike a single-board computer, the
COM lacks the standard interfaces for input/output and connection
to peripherals. These signals are brought out through standardized
connectors to a custom carrier board which is designed for the
specific embedded application.
The COM on carrier board concept:
Reduces development time by eliminating the need to design core components of the system
Developer can focus on core competency in the design of the custom carrier board
Allows easy upgrades without a complete board redesign
Lowers the threshold for total project quantities
Reduces time-to-market for the final product
Right Size for the Right Jobs
The COM Express standard (PICMG COM.0) is based on serial interfaces including PCI Express, SATA, USB,
LVDS, and SDVO, allowing designers to utilize the latest technologies for future applications. ADLINK
offers Extreme Rugged™ COM Express modules in Basic (125 x 95 mm), Compact (95 x 95 mm) and Mini
(84 x 55 mm) sizes that are suited for high-end graphics applications, military computers, high speed
communications and other embedded applications.
We Know COM Express
Although many companies develop COM Express modules, most are not actively involved in the
development of the COM Express specification. In contrast, ADLINK has heavily invested in the
development and maintenance of the PICMG COM Express specification since its creation. ADLINK was
chair of the PICMG subcommittee that was tasked with defining the COM Express COM.0 Revision 2.0.
specification update As a leading participant in the creation of the specification, ADLINK is in a unique
position to influence its direction. By doing so, ADLINK has a deep understanding of the meaning and
intention of the specification and applies this knowledge in the design of our COM Express products.
Comparison of Type 2, 6 and 10 Pinouts
The release of COM Express COM.0 Revision 2.0 brings Computer-on-Modules in line with current and
future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI
Express Gen 2, and USB 3.0. The newer Type 6 pinout is based on the popular Type 2 pinout, but with
legacy functions replaced by Digital Display interfaces (DDI), additional PCI Express lanes, and reserved
pins for future technologies. The new Type 10 pinout is based on the Type 1 pinout with only the A-B
connector that is used in the “Mini” form factor. The Type 10 pinout provides additional flexibility for
developers by freeing up pins reserved for SATA and PCIe for future technologies and using the second
LVDS channel, VGA and TV-out pins to support SDVO (via DDI). Both Type 6 and Type 10 pinouts support
the SPI Interface, which was unavailable in COM.0 Rev. 1.0.
P 28
COM Express
New COM Express 3.0, Type 7*
*COM Express Type 7 pinout is still under reviewing in PICMG,
please refer to ADLINK website for the updated specification.
125 mm
AB Connector
CD Connector
One Gigabit Ethernet port
Parallel ATA, IDE port
Alternatedefinition assigns this to two
additional Gigabit Ethernet ports
LPC interface
Four Serial ATA channels
Eight USB 2.0 ports
Six PCI Express® Lanes x1
Dual 24-bit LVDS channels
Analog VGA
TV-out ports (SDTV/HDTV)
Eight GPIO pins
Keyboard
95 mm
High Definition Audio
32-bit PCI™ v2.3 bus
Alternate definition assigns this to ten
additional PCI Express® x1 lanes
PCI Express® x16 for Graphics
These pins can also be assigned to two
SDVO extensions (multiplexed)
SMB and I2C bus
+12 V primary power input
Power / Thermal control
+5 V standby and 3.3 V RTC
+12 V primary power input
Above connector assignments comply with PICMG® COM.0
COM Express® Module, Basic Form Factor
P 29
COM Express® Type 7
Modules
Basic Size
Product Name
Express-BD7
CPU
Intel® Xeon® Processor D Family SoC
Xeon® D-1548 2.0GHz 12MB, 45W (8C)
Xeon® D-1537 1.7GHz 12MB, 35W (8C)
Xeon® D-1528 1.9GHz 9MB, 35W (6C)
Xeon® D-1527 2.2GHz 6MB, 35W (4C)
Note: Other SKUs (including extended temp.) will be released later, please check ADLINK website
Main Chipset
-
Memory
Up to 32 GB ECC/non-ECC Dual Channel DDR4 at 2400/2133 MHz
Cache
Up to 12MB, dependent on SoC SKUs
BIOS Type
AMI EFI with Intel® AMT support
TPM support (opt)
TPM 1.2/2.0
Integrated Graphics Support
-
Graphics Features
-
LAN
10G: 2x 10GBASE-KR (from SOC)
2x 10GBASE-KR (from IC, option)
GbE: Intel® i219LM
USB
4x USB 1.1/2.0/3.0
Serial ATA
4x SATA 6Gb/s
PCI Express
PCI Express x16 (Gen3)
(1x16 or 2 x8 or 1 x8 plus 2 x4)
7x PCI Express x1 (Gen3)
(x4, x2, x1 available)
Management Bus
I2C, SMBus
SEMA Support
Yes
Power Supply
Std: 12V±5% / 5Vsb ±5% (ATX) 12V±5% (AT)
Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5 ~20V (AT)
Operating Temperature
0°C to +60°C
-40°C to +85°C (opt.)
OS support
Windows Server, Windows 7, Linux
Form Factor & Compatibility
PICMG COM.0 R3.0, Type 7
Basic size: 95 x 125 mm (L x W)
Notes:
・ COM Express Type 7 pinout is still under review. Please refer to ADLINK website for the updated specification.
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 30
Core Module Interface
Reference Carrier Board
10G Ethernet Add-on Cards
Express-BASE7
SFP+ Card
PICMG COM Express Revision 3.0, Type 7
10G Fiber PHY
Inphi CS4223 SFP+ PHY
Features
Input: up to four 10GBASE-KR
Output: up to four SFP+ connectors
305 mm x 244 mm (ATX)
1 PCI Express x4 slot
Expansion Busses
10GBASE-T Card
3 PCI Express x1 slots
1 PCI Express x16 slot (PCIe Gen3 lanes)
1 PCI Express x16 slot (routes up to four 10G Ethernet signals
from COM Express module to 10G Ethernet add-on card)
POST LEDs
Onboard diagnostics for BIOS POST
Secondary BIOS
SPI flash
Audio
TBD
Super I/O
Winbond WF83627DHG on LPC bus
Digital I/O
I2C to GPIO bridge PCA9535
Connectors
COM Express 220-pin (Type 7)
VGA
TBD
LVDS
TBD
Digital Display Interface
TBD
Flat Panel Control
TBD
Audio
TBD
SATA
2x SATA, 2x eSATA
LAN
10/100/1000BASE-T compatible RJ-45 on I/O panel
USB 2.0
4x USB 1.0/2.0, 4x USB 1.0/2.0/3.0
Serial Port
1x DB-9 on I/O panel, 1x onboard 10-pin header
KB/Mouse
2x 6-pin mini DIN
Feature Connectors
SMBus, I2C, module control signals
Miscellaneous
Reset, Power LED, HDD LED, Buzzer
10G Fiber PHY
Intel® X557 10GBASE-T PHY
Features
Input: up to four 10GBASE-KR
Output: up to four RJ-45 connectors
Starter Kit
Product Name
COM Express Type 7 Starter Kit Plus
The Type 7 Starter Kit Plus consists of a COM Express Type 7 core
module with ATX size reference carrier board that offers one PCIe x16
Express slot with proprietary pinout for 10G Ethernet add-on card, one
PCI Express graphics slot x16, 0ne PCI Express x4 slot and three PCI
Express x1 slots, Serial ATA, USB 3.0/2.0, Gigabit LAN, and Super I/O.
All necessary cables are included.
・ Live Linux USB stick with SEMA pre-installed
・ Schematics, Design Guide, and User Manuals
・ ADLINK USB stick with Documentation,
Drivers, BSPs, Libraries
Features
・ Express-BASE7 Reference Carrier Board
・ 10G Ethernet Add-on Card
・ COM Express Type 7 Module (optional)
・ CPU, Memory (optional)
・ Thermal Solution (optional)
Note: All specifications are subject to change without further notice.
P 31
COM Express® Type 6
Basic Size
Modules
Product Name
Express-SL/Express-SLE
Express-BL
6th Gen. Intel Xeon E3 family
E3-GT4e (TBC), E3-1505M/E3-1505L
Intel® Core™ i7-6820EQ/6822EQ
i5-6440EQ/6442E Q, i3-6100E/6102E
Intel® Celeron® (TBC)
5th Gen. Intel Xeon
E3-1278L/1258L
®
Intel Core™ i7-5850EQ/5700EQ
®
CPU
®
®
Express-BE
®
AMD® R-Series APU
RX-427BB/425BB/225FB
(cTDP support on i7 SKUs)
(cTDP support on specific SKUs)
Chipset
Intel® QM170/HM170 (for non-ECC)/
CM236 (for ECC)
Intel® QM87
AMD® A77E
Memory
Up to 32 GB ECC/non-ECC Dual Channel DDR4
at 2133/1867 MHz
(ECC support dependent on CPU/PCH SKU)
Up to 32 GB non-ECC Dual Channel DDR3L at
1600/1333 MHz
Up to 16 GB non-ECC Dual Channel
DDR3L at 1600/1333 MHz
BIOS Type
AMI EFI with Intel®
AMT 11.0 support
(No AMT support with HM170)
AMI EFI with Intel®
AMT 10.0 support
AMI EFI
TPM Support (opt)
Atmel AT97SC3204
Atmel AT97SC3204
Atmel AT97SC3204
Integrated Graphics
18/24-bit singl/dual LVDS, eDP (opt.)
3x DDI ports supporting DP/HDMI/DVI
18/24-bit singl/dual LVDS, eDP (opt.)
3x DDI ports supporting DP/HDMI/DVI
VGA
18/24-bit singl/dual LVDS
3x DDI ports supporting DP/HDMI/DVI
(Up to 4 independent display)
Graphics Features
DirectX 12/11.2/11.1/11/10.1/10/9, OpenGL
4.4/4.3 and ES 2.0, OpenCL 2.1, 2.0/1.2
Note: support H.265/HEVC
DirectX 11.1/11.1+/11/10.1/10/9
OpenGL 4.3
DirectX 11.1/10.1/10/9,
OpenGL 4.2 and ES 2.0
OpenCL 1.2, OpenCV
LAN
Intel® i219LM, GbE
Intel® i218LM, GbE
Intel® i210LM, GbE
USB
4x USB 1.1/2.0/3.0, 4x USB 1.1/2.0
4x USB 1.1/2.0/3.0, 4x USB 1.1/2.0
4x USB 1.1/2.0/3.0, 4x USB 1.1/2.0
Serial ATA
4x SATA 6Gb/s
4x SATA 6Gb/s
4x SATA 6Gb/s
PCI Express
PCI Express x16 (Gen3)
(1x16 or 2x8 or 1x8 plus 2x4)
8x PCI Express x1 (Gen3)
(x4, x2, x1 available)
PCI Express x16 (Gen3)
(1x16 or 2x8 or 1x8 plus 2x4)
7x PCI Express x1 (Gen3)
(x4, x2, x1 available)
PCI Express x16 (Gen3)
(1x16 or 2x8 or 1x8 plus 1x4)
7x PCI Express x1 (Gen3)
(x4, x2, x1 available)
Audio
HDA integrated in PCH
supporting ALC886
HDA integrated in PCH
supporting ALC886
AMD Audio Coprocessor
supporting ALC886
Management Bus
I2C, SMBus
I2C, SMBus
I2C, SMBus
SEMA Support
Yes
Yes
Yes
Std: 12V±5% / 5Vsb ±5% (ATX) / 12V±5% (AT)
Std: 12V±5% / 5Vsb ±5% (ATX) / 12V±5% (AT)
Std: 12V±5% / 5Vsb ±5% (ATX) / 12V±5% (AT)
Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5 ~20V (AT)
Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5 ~20V (AT)
Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5 ~20V (AT)
Operating
Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
OS support
Windows 10/8.1 64-bit, Windows 7 32/64-bit,
Linux 64-bit, VxWork (TBD)
(WES 7 32/64-bit, Linux 64-bit, VxWork TBD)
Win 7/8.1, WES 7, WE8 Std., Linux, VxWorks
Win 7/8, Linux, WES 7/8, Linux
Power Supply
FormFactor &
Compatibillity
PICMG COM.0 R2.1, Type 6
Basic size: 95 x 125 mm (L x W)
Notes:
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 32
Basic Size
Modules
Product Name
Express-HL/HLE
Express-IB
CPU
4th Gen. Intel® Core™, i7-4860EQ/4700EQ
i5-4400E/4402E, i3-4100E/4102E
Intel® Celeron® 2000E/2002E
Intel® Core™
i7-3615QE/3612QE/3555LE/3517UE
i5-3610ME, i3-3120ME/3217UE
Intel® Celeron® 1020E/1047UE/927UE
Chipset
Intel® QM87, Intel® HM86
Intel® QM77
Memory
Up to 16 GB Dual Channel
DDR3L at 1600/1333 MHz
Up to 16 GB non-ECC Dual Channel
DDR3L at 1600/1333 MHz
(ECC support on Express-HLE)
BIOS Type
AMI EFI with Intel®
AMT 9.0 support
(no AMT support with HM86)
AMI EFI with Intel®
AMT 8.0 support
TPM Support (opt.)
Atmel AT97SC3204
Infineon SLB9635TT
Integrated Graphics
18/24-bit singl/dual LVDS
3x DDI ports supporting DP/HDMI/DVI
VGA
18/24-bit singl/dual LVDS
3x DDI ports supporting DP/HDMI/DVI (DDI 1 supports SDVO)
VGA
Graphics Features
DirectX* 11/10.1/10/9, OpenGL* 3.0
DirectX 11, OpenGL 3.1, OpenCL 1.1
LAN
Intel® i217LM, GbE
Intel® WG82579LM, GbE
USB
QM87: 4x USB 1.1/2.0/3.0 , 4x USB 1.1/2.0
HM86: 2x USB 1.1/2.0/3.0 , 6x USB 1.1/2.0
4x USB 1.1/2.0/3.0
4x USB 1.1/2.0
Serial ATA
4x SATA 6Gb/s (QM87)
2x SATA 6Gb/s & 2x SATA 3Gb/s (HM86)
2x SATA 3Gb/s,
2x SATA 6Gb/s
PCI Express
PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4)
7x PCI Express x1 (Gen2) (x4, x2, x1 available)
PCI Express x16 (Gen3) (1x16 or 2x8 or 1x8 plus 2x4)
7x PCI Express x1 (Gen2) (x4, x2, x1 available)
Audio
HDA integrated in PCH supporting ALC886
HDA integrated in PCH supporting ALC886
Management Bus
I2C, SMBus
I2C, SMBus
SEMA Support
Yes
-
Std: 12V±5% / 5Vsb ±5% (ATX) 12V±5% (AT)
Std: 12V±5% / 5Vsb ±5% (ATX) 12V±5% (AT)
Wide: 8.5-20 V / 5Vsb ±5% (ATX) 8.5 ~20V (AT)
Wide: 8.5-19 V / 5Vsb ±5% (ATX) 8.5 ~19V (AT)
Operating Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-20°C to +70°C
OS support
Win7/8, Linux, WES 7/8,
Linux , VxWorks, QNX
WES 7, Linux, VxWorks
Power Supply
FormFactor & Compatibillity
PICMG COM.0 R2.1, Type 6
Basic size: 95 x 125 mm (L x W)
Note:
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 33
COM Express® Type 6
Compact Size
Modules
Product Name
cExpress-SL
cExpress-BL
cExpress-HL
CPU
6th Gen. lntel® Core™
i7-6600U/i5-6300U/i3-6100U
Intel® Celeron® 3955U
5th Gen. Intel® Core™
i7-5650U/i5-5350U/i3-5010U
Intel® Celeron® 3765U
4th Gen. lntel® Core™
i7-4650/i5-4300U/i3-4010U
(cTDP support on specific SKUs)
(cTDP support on specific SKUs)
Intel Celeron® 2980U
Chipset
-
-
-
Memory
Up to 32 GB non-ECC Dual Channel
DDR4 at 2133/1867 MHz
Up to 32 GB non-ECC Dual Channel
DDR3L at 1600/1333 MHz
Up to 16 GB non-ECC Dual Channel
DDR3L at 1600/1333 MHz
BIOS Type
AMI EFI with Intel®
AMT 11.0 support
AMI EFI with Intel®
AMT 10.0 support
AMI EFI with Intel®
AMT 9.0 support
TPM Support (opt.)
Atmel AT97SC3204
Atmel AT97SC3204
Atmel AT97SC3204
Integrated Graphics
18/24-bit singl/dual LVDS, eDP (opt.)
2x DDI ports supporting DP/HDMI/DVI
18/24-bit singl/dual LVDS, eDP (opt.)
2x DDI ports supporting DP/HDMI/DVI
VGA
18/24-bit singl/dual LVDS
2x DDI ports supporting DP/HDMI/DVI
VGA
Graphics
Features
DirectX 12/11.2/11.1/11/10.1/10/9
OpenGL 4.4/4.3 and ES 2.0
OpenCL 2.1, 2.0/1.2
Note: support H.265/HEVC
DirectX 11.1/11.1+/10.1/10/9
OpenGL 4.2/4.0
DirectX 11/10.1/10/9
OpenGL 3.0
LAN
Intel® i219LM, GbE
Intel® i218LM, GbE
4x SATA 6Gb/s
USB
4x USB 1.1/2.0/3.0
4x USB 1.1/2.0
2x USB 1.1/2.0/3.0
6x USB 1.1/2.0
2x USB 1.1/2.0/3.0
6x USB 1.1/2.0
Serial ATA
Core™ i7/i5: 3x SATA 6Gb/s
Core™ i3/Celeron®: 2x SATA 6Gb/s
4x SATA 6Gb/s
4x SATA 6Gb/s
PCI Express
5 PCIe x1 (Gen2)
(x4, x2, x1 available)
Note: Up to 6 PCIe x1 without GbE support
(opt.)
4x PCIe x1 (Gen2)
(x4, x2, x1 available)
Note: Up to 5 PCIe x1 without GbE support
(opt.)
4x PCIe x1 (Gen2)
(x4, x2, x1 available)
Audio
HDA integrated in SOC
supporting ALC886
HDA integrated in SOC
supporting ALC886
HDA integrated in SOC
supporting ALC886
Management Bus
I2C, SMBus
I2C, SMBus
I2C, SMBus
SEMA Support
Yes
Yes
Yes
Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)
Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)
Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)
Wide: 5~20 V / 5Vsb ±5% (ATX), 5 ~20V (AT)
Wide: 5~20 V / 5Vsb ±5% (ATX), 5 ~20V (AT)
Wide: 5~20 V / 5Vsb ±5% (ATX), 5 ~20V (AT)
Operating Temperature
0°C to +60°C
-40°C to +85°C (opt.)
'0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C (opt.)
OS support
Win10/Win 8.1/7, WES 7, Linux, VxWorks
Win 7/8.1, WES 7, WE8 Std,
Linux, VxWorks
Win 7/8, Linux, WES 7/8,
Linux , VxWorks
Power Supply
Form Factor &
Compatibility
P 34
PICMG COM.0 R2.1, Type 6
Compact size: 95 x 95 mm (L x W)
Notes:
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
Compact Size
Modules
Product Name
cExpress-AL
cExpress-BW
cExpress-BT
CPU
Future Intel® Processor
Intel Pentium N3710
Intel® Celeron® N3160/N3060/N3010
Intel® Atom® x5-E8000
Future Intel® Atom™ Processor
Intel® Atom™ E3800 Series SoC
Intel® Celeron® N2930/J1900
Chipset
-
-
-
Memory
Up to 16 GB non-ECC Dual channel
DDR3L at 1867/1600 MHz
Up to 8 GB non-ECC Dual channel
DDR3L at 1600/1333 MHz
Up to 8 GB non-ECC Dual Channel
DDR3L at 1333/1066 MHz
BIOS Type
AMI Aptio EFI
AMI Aptio EFI
AMI Aptio EFI
TPM Support (opt.)
TPM 1.2/2.0
ATMEL AT97SC3204
ATMEL AT97SC3204
Integrated Graphics
eDP, 18/24-bit singl/dual LVDS (opt.)
2x DDI ports supporting DP/HDMI/DVI
eDP, 18/24-bit singl/dual LVDS (opt.)
3x DDI ports supporting DP/HDMI/DVI
Note: DDI 3 muxed with eDP/LVDS
2x DDI ports supporting DP/HDMI/DVI
VGA
18/24-bit singl/dual LVDS (opt.)
®
®
Graphics
Features
newest DirectX, OpenGL/CL
DirectX 11.1,
OpenGL 4.2, ES 3.0, OpenCL 1.2
DirectX 11,
OpenGL 3.2, ES 2.0, OpenCL 1.1
LAN
Intel® i210/i211 series, GbE
Intel® i210IT, GbE
Intel® i210LM, GbE
USB
2x USB 1.1/2.0/3.0
6x USB 1.1/2.0
4x USB 1.1/2.0/3.0
4x USB 1.1/2.0
1x USB 1.1/2.0/3.0
6x USB 1.1/2.0
Serial ATA
2x SATA 6Gb/s
2x SATA 6Gb/s
2x SATA 3Gb/s
PCI Express
Up to 5 PCIe x1 (Gen2) with PCIe switch
(x4, x2, x1 available)
3 PCIe x1 (Gen2) (x2, x1 available)
Note: Up to 5 PCIe x1 with PCIe switch (opt.)
3 PCIe x1 (Gen2) (x2, x1 available)
Note: Up to 4 PCIe x1
without GbE support (opt.)
Audio
HDA integrated in SOC
supporting ALC886
HDA integrated in SOC
supporting ALC886
HDA integrated in SOC
supporting ALC886
Management Bus
I2C, SMBus
I2C, SMBus
I2C, SMBus
Onboard Storage
8GB/16GB/32GB (opt.)
8GB/16GB/32GB (opt.)
8GB/16GB/32GB (opt.)
SD Signal
Yes
Yes (opt.)
Yes (mini SD sockete on module)
SEMA Support
Yes
Yes
Yes
Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)
Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)
Wide: 5~20 V / 5Vsb ±5% (ATX), 5 ~20V (AT
Wide: 5~20 V / 5Vsb ±5% (ATX), 5 ~20V (AT)
Std:12V±5% / 5Vsb ±5% (ATX), 12V±5% (AT)
Power Supply
Wide: 4.75~20 V / 5Vsb ±5% (ATX),
4.75 ~20V (AT)
Operating Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
0°C to +60°C
-40°C to +85°C (opt.)
OS support
Win 10/7, WES7, Linux, VxWorks
Win 10 IOT Enterprise
Win 7/8, WES 7, Linux, VxWorks
Win 7/8, Linux, WES 7, WE8 Std., VxWorks,
QNX
Form Factor &
Compatibility
PICMG COM.0 R2.1, Type 6
Compact size: 95 x 95 mm (L x W)
Notes:
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 35
COM Express® Type 6
Starter Kit
Reference Carrier Board
COM Express Type 6 Starter Kit Plus
Express-BASE6
The Type 6 Starter Kit Plus consists of a COM Express Type 6 core module
(opt.) with ATX size reference carrier board that offers one PCIe x16 Express
slot with proprietary pinout for a DDI adapter card, one PCI Express graphics
slot x16, one PCI Express x4 slot and three PCI Express x1 slots, Serial ATA,
VGA, LVDS, USB 3.0/2.0, Gigabit LAN, and Super I/O. All necessary cables
are included.
CPU
PICMG COM Express Revision 2.0, Type 6
Core Module
Interface
305 mm x 244 mm (ATX)
1 PCI Express x4 slot
3 PCI Express x1 slots
• Live Linux USB stick with SEMA pre-installed
Expansion Busses
1 ExpressCard slot
• Schematics, Design Guide, and User Manuals
1 PCI Express x16 / SDVO slot
• ADLINK USB stick with Documentation Drivers,
BSPs, Libraries
• Express-BASE6 Reference Carrier Board
• T6-DDI (3 DisplayPort or HDMI)
Features
POST LEDs
Onboard diagnostics for BIOS POST
Secondary BIOS
SPI flash
Audio Codec
Realtek ALC886 HDA
Super I/O
Winbond WF83627DHG on LPC bus
Digital I/O
Extensive GPIO (through PCA9535)
Connectors
Two COM Express x 220-pin (Type 6)
VGA
DB-15 connector
LVDS
Onboard 34-pin header
Digital Display
Interface
3x DDI ports to HDMI/DVI/DP (through T6-DDI)
Audio Interface
Mic/Line-in/Line-out on I/O panel
S/PDIF on header/jack
SATA
2x SATA, 2x eSATA
LAN
10/100/1000BASE-T compatible RJ-45 on I/O panel
USB 2.0
4x USB 1.0/2.0
4x USB 1.0/2.0/3.0
Serial Port
1x DB-9 connector (from Super I/O)
3x onboard 10-pin header (one from Super I/O, two from
COM Express module)
KB/Mouse
2x 6-pin mini DIN
Feature Connectors
SMBus, I2C, module control signals
Miscellaneous
Reset button, Lid button, Sleep button, Power button,
Power LED, HDD LED, Buzzer
Smart Battery
Support
One 10-pin header for Smart Battery management
communications (connects to ADLINK BattMan board)
• DisplayPort to DVI cable
• P16TO28 (PCIex 16 to PCIe x8 x2 adapter)
• DB40 Debug Card
• All necessary cables and power supply
• COM Express Type 6 Module (optional)
• Memory (optional)
• Thermal Solution (optional)
Note: All specifications are subject to change without further notice.
P 36
COM Express® Type 10
Mini Size
Modules
Product Name
nanoX-AL
nanoX-BT
nanoX-TC
nanoX-TCR
CPU
Future Intel® Processor
Intel® Atom™ E3800 Series SoC
Intel® Celeron® N2930/J1900
Intel® Atom™ E680/E660/E640/
E620T
Intel® Atom™ E680T/E660T/
E640T/E620T
Chipset
-
-
Intel® EG20T PCH
Intel® EG20T PCH
Memory
Soldered memory,
Up to 8GB non-ECC/ECC
DDR3L at 1867/1600 MHz
Soldered memory,
Up to 4GB non-ECC
DDR3L at 1333 MHz
Soldered memory,
Up to 2 GB non-ECC
DDR2 at 800MHz
Soldered memory,
Up to 1 GB non-ECC
DDR2 at 800 MHz
(opt. 512MB or 2GB)
(ECC is optional)
BIOS Type
AMI Aptio EFI
AMI Aptio EFI
AMI Aptio EFI
AMI Aptio EFI
TPM support (opt)
-
-
-
-
Integrated
Graphics
18/24-bit single channel LVDS,
eDP (opt.)
1x DDI ports supporting DP/
HDMI/DVI
18/24-bit single channel LVDS,
eDP (opt.)
1x DDI ports supporting DP/
HDMI/DVI
18/24-bit single channel LVDS
1x SDVO
18/24-bit single channel LVDS
1x SDVO
Graphics Features
DirectX (latest vers.), OpenGL/CL
DirectX 11, OpenGL 3.2, ES 2.0
OpenCL 1.1
LAN
Intel® i210/i211 family, GbE
Intel® i210LM, GbE
Realtek RTL8211CL, GbE
Intel® 82574IT, GbE
USB
2x USB 1.1/2.0/3.0
6x USB 1.1/2.0
USB client (TBC)
1x USB 1.1/2.0/3.0
3x USB 1.1/2.0
1x USB 1.1/2.0 client
6x USB 1.1/2.0
1x USB 1.1/2.0 client
6x USB 1.1/2.0
1x USB 1.1/2.0 client
Serial ATA
2x SATA 6Gb/s
2x SATA 3Gb/s
2x SATA 1.5Gb/s
2x SATA 1.5Gb/s
PCI Express
4x PCIe x1 (Gen2)
(x4, x2, x1 available)
3x PCIe x1 (Gen2)
(up to 4 PCIe x1
without GbE, opt.)
3x PCIe x1
(up to 4 PCIe x1
without PCH support, opt.)
2x PCIe x1
(up to 3 PCIe x1
without PCH support, opt.)
Audio
HDA integrated in SoC
supporting ALC262
HDA integrated in SoC
supporting ALC262
HDA integrated in SoC
supporting ALC888
HDA integrated in SoC
supporting ALC888
Management Bus
I2C, SMBus
I2C, SMBus
I2C, SMBus
I2C, SMBus
Onboard Storage
8GB/16GB/32GB (opt.)
8GB/16GB/32GB (opt.)
-
4GB/8GB/16GB (opt.)
SD Signal
Yes
Yes (opt.)
Yes
Yes
SEMA Support
Yes
Yes
-
-
Std:12V±5% / 5Vsb ±5% (ATX),
12V±5% (AT)
Std: 12V±5% / 5Vsb ±5% (ATX)
or 12V±5% (AT)
Std:12V±5% / 5Vsb ±5% (ATX),
12V±5% (AT)
Std:12V±5% / 5Vsb ±5% (ATX),
12V±5% (AT)
Wide: 4.75~20 V / 5Vsb ±5%
(ATX), 4.75 ~20V (AT)
Wide: 5~14V / 5Vsb (ATX)
or 5~14V (AT)
Wide: 4.75~21 V / 5Vsb ±5%
(ATX), 4.75 ~21V (AT)
Wide: 4.75~21 V / 5Vsb ±5%
(ATX), 4.75 ~21V (AT)
Operating
Temperature
0°C to +60°C, -40°C to +85°C
(opt. for selected SKUs only)
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-20°C to +70°C
-40°C to +85°C (opt.)
OS support
Win 10/7, WES7, Linux, VxWorks
Win 10 IOT Enterprise
Win 7/8, Linux, WES 7,
WE8 Std., VxWorks
Windows XPe, WES7, WinCE 6.0,
WEC7, Linux, VxWorks
Windows XPe, WES7, WinCE 6.0,
WEC7, Linux, VxWorks
Power Supply
Form Factor &
Compatibility
PICMG COM.0 R2.1, Type 10
Mini size: 84 x 55 mm (L x W)
Notes:
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 37
COM Express® Type 10
Starter Kit
Reference Carrier Board
nanoX Starter Kit Plus
miniBASE-10R
The nanoX Starter Kit Plus consists of a COM Express® Type 10 core module
(opt.) with a reference carrier board that provides two PCIe Mini Card slots
(one supports mSATA), two RJ-45 LAN ports, one SATA port, two USB 3.0,
two USB 2.0, one USB client, two DB-9 COM, one SD card socket, and Mic/
Linein/ Line-out, one DP port, LVDS/eDP connector and Smart Battery
support (opt.). All necessary cables are included.
• Live Linux USB stick with SEMA pre-installed
Core module interface
PICMG COM Express Revision 2.1, Type 10 modules
Dimensions
150 mm x 142 mm
POST LEDs
Onboard diagnostics for BIOS POST
Secondary BIOS
SPI flash
Audio Codec
Realtek ALC262 HDA
Audio Interface
Line-in, Line-out, Mic-in on I/O panel
S/PDIF on jack
Digital I/O
Extensive GPIO (through PCA9535)
LAN
2x 10/100/1000BASE-T compatible RJ-45 on I/O panel
(one from COM Express module, one from Intel i210
controller on carrier board)
Connectors
1x 220-pin (Type 10)
LVDS/eDP
Onboard 30-pin header
Display Port
1x DisplayPort connector
SATA
1x SATA
PCIe Mini Card
2x onboard sockets (one supports mSATA)
USB
2x USB 1.0/2.0/3.0
2x USB 1.0/2.0
1x USB client
Serial Port
2x DB-9 connectors
SD card
1x socket onboard
Feature Connectors
SMBus, I2C, module control signals
Miscellaneous
Reset button, Lid button, Sleep button, Power button,
Power LED, HDD LED
Smart Battery Support
Integrated Smart Battery managemet system
• Schematics, Design Guide, and User Manuals
• ADLINK USB stick with Documentation, Drivers,
BSPs, Libraries
• miniBASE-10R Reference Carrier Board
• DB40 Debug Card
Features
• DisplayPort to VGA cable
• All necessary cables and power supply
• COM Express Type 10 Module (optional)
• Thermal Solution (optional)
• Flat LVDS panel and cable (optional)
• Smart Battery (optional)
Note: All specifications are subject to change without further notice.
P 38
COM Express® Type 2
Basic Size
Modules
Compact Size
Product Name
Express-HL2
Express-IBE2
cExpress-BT2
Express-CVC
CPU
4th Gen. Intel Core™
i7-4860EQ/4700EQ,
i5-4400E/4402E, i3-4100E/4102E
Intel® Celeron® 2000E/2002E
Intel Core™
i7-3615QE/3612QE/
3555LE/3517UE
i5-3610ME, i3-3120ME/3217UE
Intel® Atom™ E3800 Series SoC
Intel® Celeron® N2930/J1900
Intel® Atom™ N2600/N2800/D2550
Chipset
Intel® QM87 Express
Intel® HM86 Express
Intel® QM77 Express
-
Intel® NM10
Memory
Up to 16 GB non-ECC
Dual Channel
DDR3L at 1600/1333 MHz
Up to 16 GB non-ECC
Dual Channel
DDR3L at 1600/1333 MHz
Up to 8 GB non-ECC
Dual Channel
DDR3L at 1333/1066 MHz
Up to 4 GB non-ECC
Single Channel
DDR3 at 1066/800 MHz
BIOS Type
AMI EFI with
Intel® AMT 9.0 support
AMI EFI with
Intel® iAMT support
AMI Aptio EFI
AMI Aptio EFI
TPM Support (opt.)
Atmel AT97SC3204
Atmel AT97SC3204
Atmel AT97SC3204
Atmel AT97SC3204
Integrated Graphics
18/24-bit single/dual channel LVDS
VGA
18/24-bit single/dual channel LVDS
VGA, SDVO (on PEG)
18/24-bit single/dual channel LVDS
VGA
18/24-bit single/dual channel LVDS
VGA
Graphics Features
DirectX* 11/10.1/10/9, OpenGL 3.0
DirectX 11, OpenGL 3.1,
OpenCL 1.1
DirectX 11,
OpenGL 3.2, ES 2.0, OpenCL 1.1
DirectX 9
LAN
Intel i217LM, GbE
Intel WG82579LM, GbE
Intel® i210LM, GbE
Intel i210LM, GbE
USB
8x USB 1.0/2.0
8x USB 1.0/2.0
7x USB 1.1/2.0
8x USB 1.1/2.0
Parallel ATA (IDE)
one channel, one device
one channel, one device
one channel, one device
one channel, one device
Serial ATA
4x SATA 6Gb/s (QM87)
3x SATA6Gb/s (HM86)
2x SATA 3 Gb/s,
2x SATA 6 Gb/s
1x SATA 3Gb/s
(up to 2x SATA 3Gb/s
without PATA support)
1x SATA 3Gb/s
(up to 2x SATA 3Gb/s
without PATA support)
PCI Express/PCI
PCI Express x16 (Gen3)
(1x16 or 2x8 or 1x8 plus 2x4)
6x PCI Express x1 (Gen2)
(x4, x2, x1 available); 1x PCI
PCI Express x16 (Gen3)
(1x16 or 2x8 or 1x8 plus 2x4)
5x PCI Express x1 (Gen2)
(x4, x2, x1 available); 1x PCI
2x PCI Express x1 (Gen2)
(x2, x1 available); 1x PCI
3x PCI Express x1 (Gen2)
(x2, x1 available); 1x PCI
Audio
HDA integrated in SoC
supporting ALC880
HDA integrated in SoC
supporting ALC880
HDA integrated in SoC
supporting ALC880
HDA integrated in SoC
supporting ALC880
Management Bus
I2C, SMBus
I2C, SMBus
I2C, SMBus
I2C, SMBus
Onboard Storage
-
-
8GB/16GB/32GB (opt.)
-
SEMA Support
Yes
Yes
Yes
Yes
Power Supply
Std: 12V±5% / 5Vsb ±5% (ATX)
or 12V±5% (AT)
Wide: 8.5~20 V / 5Vsb ±5% (ATX)
or 8.5~20V (AT)
Std: 12V±5% / 5Vsb ±5% (ATX)
or 12V±5% (AT)
Wide: 8.5~20 V / 5Vsb ±5% (ATX)
or 8.5~20V (AT)
Std: 12V±5% / 5Vsb ±5% (ATX)
or 12V±5% (AT)
Wide: 5~20 V / 5Vsb ±5% (ATX) or
5~20V (AT)
Std: 12V±5% / 5Vsb ±5% (ATX)
or 12V±5% (AT)
Wide: 5~20 V / 5Vsb ±5% (ATX) or
5~20V (AT)
Operating
Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C,
-40°C to +85°C (opt. for Atom™ E3800)
0°C to +60°C
OS support
Win 7/8, Linux, WES 7/8,
Linux , VxWorks
Windows XPe, WES7,
Linux, VxWorks
Win 7/8, Linux, WES 7, WE8 Std.
Windows XPe, WES 7, WEC 7,
Linux, VxWorks
Form Factor &
Compatibility
PICMG COM.0 R2.1, Type 2
Basic size: 95 x 125 mm (L x W)
PICMG COM.0 R2.1, Type 2
Compact size: 95 x 95 mm (L x W)
Win 7/8, Linux, WES 7, WE8 Std.
Windows XPe, WES 7, WEC 7,
Linux, VxWorks
®
®
Notes:
・ TPM support by BOM option
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 39
COM Express® Type 2
Reference Carrier Board
Product Name
Express-BASE
Core Module Interface
PICMG COM Express Revision 2.0, Type 2
Dimensions
305 mm x 244 mm (AT/ATX)
2x 32-bit PCI v2.3 slots
Expansion Busses
Starter Kit
Type 2 Starter Kit Plus
The Starter Kit consists of a COM Express Type 2 core module
with ATX size reference carrier board that offers one PCI Express
graphics slot x16 , four PCI Express x1 slot, two PCI slots, Serial
ATA, SDVO, VGA, LVDS, TV-out, USB 2,0, Gigabit LAN, and Super
I/O. All necessary cables are included.
5x PCI Express x1 slots
Standard Items
1x PCI Express x16 / SDVO slot
POST LEDs
Onboard diagnostics for BIOS POST
Secondary BIOS
LPC & SPI flash
Audio Codec
Realtek ALC880 HDA
Super I/O
Winbond WF83627HG on LPC Bus
Connectors
2x 220-pin (Type 2)
VGA
DB15 connector
LVDS
Onboard 34-pin header
PATA
"1x 40-pin header
SATA
4x SATA connectors
• Express-BASE reference carrier board
• Accessory kit:
• IDE cable
• SATA cable
• TV out cable
• CF adapter
• PCI 2-slot riser card
Features
• USB Stick with documentation, drivers,
libraries, and BSPs for Linux,
Windows CE, XPe
• Carrier Design Guide and product manuals
Optional Items
• COM ExpressR Type 2 module
ExpressCard
One socket onboard
LAN
10/100/1000BASE-T compatible RJ45 on I/O panel
USB 2.0
6x USB 2.0 connector
1x USB 2.0 header
1x USB 2.0 through ExpressCard
Serial Port
One DB-9 on rear I/O panel
one 10-pin header onboard
Parallel Port
One DB-25 on rear I/O panel
KB/Mouse
Two 6-pin mini DIN
Digital I/O
-
Feature Connectors
SMBus, I2C, module control signals
Miscellaneous
Reset button, Lid button, Sleep button, Power button,
Power LED, HDD LED
Smart Battery Support
One 10-pin header for Smart Battery management
communications
(connects to ADLINK BattMan board)
Note: All specifications are subject to change without further notice.
P 40
with CPU of your choice
• Memory of your choice
• Thermal solution of your choice
(heatspreader, heatsink)
Engineering Test Tools
DB40 Debug Module
PCIe x16-to-two-x8 Adapter Card
The DB40 Debug Card is designed for debugging of COM Express and PC/104
boards. It includes the following features:
The ADLINK PCIe x16-to-two-x8 adapter card can be used with modules that
support bifurbication on the PEG x16 interface. The card reroutes the PCIe x16 to
two x8 and allows testing of two independent PCIe add-on cards with
x8/x4/x2/x1 width.
• Port 80/81 decoding for Power On Self Test (POST) via LPC
• Interface to SPI Flash for BIOS update
• Interface to Board Management Controller (BMC) for update
• Power and Reset buttons and status LEDs
The DB40 Debug card can only be used on products that have the appropriate
FFC debug connector designed for this purpose.
Ordering Information
Model Number
DB40
Description
Multipurpose debug board
BattMan
Smart Battery Management Reference Platform
The BattMan Smart Battery Management Reference Platform allows developers
to first verify on a system level and then easily implement the same type of battery
power design into their own carrier board. BattMan supports single battery mode
or balanced loading and unloading using two batteries.
Ordering Information
Model Number
P16TO28
StarterKit-Battman
Description
Smart Battery Management Reference
Platform for COM Express® modules
(includes two Smart Batteries, 19V adapter
and USB key)
PCIe x16-to-two-x8 adapter card
Flat Panel Transfer Board
The Flat Panel Transfer Board (FPTB) supports prototyping and verification of
LVDS and TTL flat panel displays . The module includes an LVDS-to-TTL
converter to allow users to implement TTL displays with COM modules that
support LVDS only. Onboard PWM circuitry supports backlight control for LVDS
and TTL displays.
Ordering Information
Model Number
Description
Ordering Information
Model Number
FPTB
LVDS cable for
FPTB
Description
Flat Panel Transfer Board for LVDS-to-TTL signal
conversion
Reference carrier LVDS output to FPTB LVDS input cable
Note: All specifications are subject to change without further notice.
P 41
SMARC
Supported by a number of embedded computing module vendors, the
Smart Mobility ARChitecture (SMARC) specification provides an openstandard definition for ARM and x86-based embedded computing solutions,
optimized for low power, cost efficiency and high performance. SMARC also
provides support for systems that need more compact solutions than are
offered by PC-oriented form factors.
A Green Solution for Embedded
Connectivity
As ARM SoCs do not need the support chips of a PC
platform and draw less power, the amount of board
space required for power converters and power
supply lines is greatly reduced. This allows the use
of a smaller form factor, facilitating applications
of SMARC-based modules in low-power portable
equipment. SMARC CPU modules generally
have an actual power intake between 2W to 6W,
allowing for passive cooling, thus, further reducing
subsequent design effort and overall cost.
Ideal Solution for Mobile Devices
By choosing SMARC, systems integrators can take
full advantage of the user-interface options available
to mobile device OEMs; options that are not usually
found in x86-based embedded-computing systems. For
example, SMARC not only supports a direct parallel
display bus for low-cost connection to a wide variety
of thin-film transistor LCDs, but also supports a display
interface compatible with the MIPI specification. This
provides access to the smaller, low cost display modules
employed in smartphones and tablets as they find their
way into the embedded market.
Ultra-low Power Consumption
Advantages
SMARC has been adopted by multiple vendors
and promises to form the basis of a successful
commercial ecosystem. The connection system
employed by SMARC offers a number of benefits
over competing systems. SMARC is based on the
new 314-pin MXM-III connector qualified for PCI
Express Gen3. The MXM-III connector guarantees
a high degree of signal integrity, required by high
frequency serial interfaces that are commonly
supported by ARM SoCs. For example, on 2.5 GHz
signals as employed by PCI Express Gen2, the
insertion loss of the MXM-III connector is just 0.5
dB. In comparison, the insertion loss encountered
on the connection scheme used by older generation
MXM connectors such as the 200 pin MXM-II
connector is significantly higher at 3 dB.
SMARC Pinout
Up to 3 independent displays
Parallel LCD, LVDS, HDMI/DP
LCD support: panel & backlight enable, power
management
Up to 2 independent cameras
Parallel and MIPI CSI serial cameras
1x GbE
3x PCIe x1 with support signals
3x USB 2.0, one is USB 2.0 OTG/client
1x SATA
1x SDIO
1x eMMC (may be boot device)
2x SPI, 3x I2S, 4x I2C, 1x S/PDIF
4x serial (2x 2-wire, 2x 4-wire)
2x CAN
12x GPIO
Boot select, force recovery, watchdog, power
management
P 42
AFB: pin assignment is dependent on module
use case (e.g. USB 3.0, GbE, SATA, fieldbus)
A further advantage of SMARC over other small
module formats is its support for a wider input voltage
range, reducing the need to use additional DC/DC
converters on the core module and resulting overall
power dissipation. A SMARC module can support
input voltages from 3 V to 5.25 V. Many other formats
originally designed to support PC-class hardware are
restricted to a nominal 5 V input. To take advantage of
the greater I/O diversity of ARM-based SoCs, SMARC
uses a different mix of connection options than those
offered by COM Express or Qseven. In contrast to the
PCI Express focus of COM Express, SMARC provides
options for different types of video and graphics
output, serial buses such as I2C and I2S, both USB host
and client, serial and parallel camera interfaces and
support for standard flash-memory card formats such
as SD and eMMC.
Based on the proven MXM-III connector that has been
successfully employed on MXM video modules for
several years, SMARC defines two sizes of module: a
full-size module that measures 82 mm x 80 mm, and a
short module for more compact systems that measures
82 mm x 50 mm. The edge connector supports 314
electrical contacts, supports up to PCI Express Gen3
transfer rates, and has a temperature range extending
from -45°C to +85°C. For systems that are to be used
in harsh environments, shock- and vibration-proof
versions of the connector are available.
SMARC
SMARC®
x86-based
Modules
Product Name
LEC-BW
LEC-BTS
LEC-BT
CPU
Intel® Celeron® /Pentium®
N3000 Series SoC
Intel® Atom™ E3800 Series SoC
Intel® Atom™ E3800 Series SoC
Memory
Up to 8GB DDR3L
at 1600 MT/s
Up to 4GB DDR3L
at 1333/1066 MHz non-ECC
Up to 8GB DDR3L
at 1333/1066 MHz with ECC
Cache
L2: 2 MB
L2: 512kB to 2 MB
L2: 512 kB to 2 MB
Boot Loader
AMI UEFI BIOS
AMI UEFI BIOS
AMI UEFI BIOS
Graphics Features
DirectX 12/11.2,
OpenGL 4.2/3.3,
OpenCL 1.2
DirectX 11.1,
OpenGLES 2.0,
OpenGL 3.2
DirectX 11.1,
OpenGLES 2.0,
OpenGL 3.2
Integrated Graphics
8th Gen Intel® graphics core architecture,
supports 3 independent displays
4K graphic resolution
(up to 3840 x 2160 @ 30fps)
7th Gen Intel® graphics core architecture,
supports 2 independent displays
7th Gen Intel® graphics core architecture,
supports 2 independent displays
LAN
Intel® i211 MAC/PHY
supporting 10/100/1000 GbE
Intel® i210IT MAC/PHY
supporting 10/100/1000 GbE
Intel® i210IT MAC/PHY
supporting 10/100/1000 GbE
USB
1x USB 3.0 host
2x USB 2.0 host
1x USB 2.0 client
1x USB 3.0 host
2x USB 2.0 host
1x USB 2.0 client
1x USB 3.0 host
2x USB 2.0 host
1x USB 2.0 client
Serial ATA
2x SATA 6Gb/s
1x SDIO/SD
1x eMMC
2x SATA 3Gb/s
1x SDIO/SD
1x eMMC
2x SATA 3Gb/s
1x SDIO/SD
Audio
HDA
HDA
HDA
PCI Express
3x PCIe x1
3x PCIe x1
3x PCIe x1
SEMA Support
Yes
Yes
Yes
Power Supply
3.0 V ~ 5.25 V DC ±5%
3.0 V ~ 5.25 V DC ±5%
3.0 V ~ 5.25 V DC ±5%
Operating
Temperature
0°C to +60°C
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C (opt.)
Formfactor &
Compatibility
Operating
Systems
SMARC short size module,
82 x 50 mm (W x L)
Windows 7, 8.1, 10,
Yocto Linux, Android
Linux, VxWorks, Android,
Windows 7/8, WEC7
SMARC full size module
82 x 80 mm (W x L)
Linux, VxWorks, Android,
Windows 7/8, WEC7
Note: All specifications are subject to change without further notice.
P 43
SMARC®
ARM-based
Modules
Product Name
LEC-iMX6
LEC-iMX6/2GbE
CPU
Freescale i.MX6 Quad, Dual,
DualLite and Solo Processors
Freescale i.MX6 Quad and Dual Processors
Memory
Up to 4GB DDR3L at 1066 MHz
Up to 4GB DDR3L at 1066 MHz
Cache
L2: 512kB to 1 MB
L2: 512kB to 1 MB
Boot Loader
U-Boot
U-Boot
Integrated Graphics
2D/3D graphics processor
2D/3D graphics processor
Graphics Features
3D 1080p video processing
3D 1080p video processing
LAN
1x GbE
2x GbE
USB
2x USB 2.0 host
1x USB OTG
2x USB 2.0 host
1x USB OTG
Serial ATA
1x SATA 3Gb/s (Quad and Dual only)
1x SDIO/SD
1x eMMC
1x SATA 3Gb/s (Quad and Dual only)
1x SDIO/SD
1x eMMC
Audio
Located on carrier
S/PDIF
Located on carrier
S/PDIF
PCI Express
1x PCIe x1
-
SEMA Support
Yes
Yes
Power Supply
3.0 V ~ 5.25 V DC ±5%
3.0 V ~ 5.25 V DC ±5%
Operating
Temperature
0°C to +60°C
-40°C to +85°C
0°C to +60°C
-40°C to +85°C
Operation
Systems
Linux, Android, WEC7, QNX
Linux, Android, WEC7, QNX
Formfactor &
Compatibility
Note: All specifications are subject to change without further notice.
P 44
SMARC short size module,
82 x 50 mm (W x L)
SMARC Starter Kits
Product Name
LEC-Starter Kit R1
The Starter Kit consists of a SMARC compliant LEC-BASE R1 carrier board,
7" Flat Panel display 800 x 400 with assembly and USB touch cable,
SD card and USB stick, interface cables and an AC/DC adapter.
• SMARC compliant LEC-BASE R1 carrier board
• 7” flat panel 800 x 400 display with assembly and USB touch cable
Features
• SD card and USB stick
• Interface cables (one way open) for camera, GPIO, power management, I2S and SPI
• AC/DC adapter, power cord and universal socket
• Modules: LEC-iMX6, LEC-iMX6/2GbE
Optional Items
• Heatsing for LEC-iMX6 or LEC-iMX6/2GbE
• Software: BSP depending on Operating System
Product Name
LEC-Starter Kit R2
The LEC-Starterkit R2 consists of a SMARC compliant LEC-BASE R1 carrier board,
data media, interface cables, AC/DC adapter, power cord, universal socket to EU plug,
an universal power socket (male) and is suitable for LEC-BT or LEC-BTS modules.
• SMARC compliant LEC-BASE R1 carrier board
• SD card and USB stick
Features
• Interface cables for camera, GPIO, power management, SPI, I2C and LVDS
• AC/DC adapter, power cord and universal socket
• Modules: LEC-BT, LEC-BTS or LEC-BW
Optional Items
• Heatsink: for LEC-BT, LEC-BTS or LEC-BW
• Software: BSP for selected Operating System
Note: All specifications are subject to change without further notice.
P 45
Qseven
Qseven® is a Computer-on-Module (COM) standard for
small sized and highly integrated systems adopted by
SGET. The Qseven concept is an off-the-shelf, multivendor, Computer-on-Module that integrates all the
core components of a common PC and is mounted onto
an application-specific carrier board.
Small Footprint, Low Power Envelope
Qseven modules have a standardized form factor of
70 mm x 70 mm or 40 mm x 70 mm and have specified
pinouts based on the high-speed MXM connector,
regardless of the vendor. The Qseven module provides
the functional requirements for an embedded
application, which include, but are not limited to,
graphics, audio, mass storage, network and multiple
USB ports. A single ruggedized 230 pin MXM connector
provides the carrier board interface to carry all the
I/O signals to and from the Qseven module. This MXM
connector is a well-known and proven high-speed signal
interface connector that is commonly used for PCI
Express graphics cards in notebooks.
The Qseven footprint is smaller than that of COM
Express or ETX, responding to system designers’
needs for minimal space. Qseven’s power consumption
envelope is below a 12watt, whereas SMARC’s target
is below 6W and COM Express can be well above 20W.
Therefore, Qseven designs provide mid-range power
values between those of SMARC and COM Express. The
Qseven pincount is 230 compared to 314 and 440 for
SMARC and COM Express (Type 2), respectively. Thus, it
is optimized for designs with lower board-to-board pin
requirements.
Product Name
P 46
4x PCI Express
2x SATA, max. 8x USB2.0, max. 2x USB 3.0
Triple display support
LVDS, DP, HDMI
HDA or I2S
Ethernet 10/100/1000Mbit
1x UART
1x LPC
1x SDIO 8-bit for SD/MMC cards
1x SMBus
1x I2C
1x SPI
1x CAN
Watchdog trigger, power button,
power good, reset button
LID button, sleep button
Suspend to RAM (S3 mode), wake,
battery low alarm
Thermal & fan control
Q7-Starterkit R1
The Q7-Starterkit consists of a Qseven compliant Q7-BASE R1 carrier board,
SD card, USB stick, ATX power supply, US power cord, EU power cord.
Standard Items
Qseven Pinout:
• Qseven compliant Q7-BASE R1 carrier board
• SD card, 4GB SDHC Card (Class 10)
• USB stick (8GB USB 2.0 Flash Drives)
• 300 Watt ATX power supply
• US power cord, 10A at 125V
• EU power cord, 220V
Qseven
Qseven®
Product Name
Q7-BASE R1
Product Name
Q7-BW
Q7-BT
Displays
HDMI, 18/24-bit dual channel LVDS
with backlight connector
CPU
Intel® Celeron®
Pentium® N3000 Series SoC
Intel® Atom™ E3800 Processor
Series SoC
SDIO
4/8-bit SDIO for MMC/SD
Memory
Up to 8GB DDR3L
at 1600 MT/s
Up to 8GB DDR3L
at 1333/1066 MHz
SPI
1x SPI interface
1x SMBus
1x misc.
Cache
L2: 2 MB
L2: 512kB to 2MB
Integrated Graphics
HD Audio
1x HD audio codec ALC886
1x line in
1x line out
1x microphone
1x S/PDIF in/out
8th Gen Intel® graphics core
architecture, supports three
independent displays 4K video
(up to 3840 x 2160 @ 30fps)
7th Gen Intel® graphics core
architecture, supports two
independent displays
Graphics Features
DirectX 12/11.2,
OpenGL 4.2/3.3, OpenCL 1.2
DirectX 11.1,
OpenGLES 2.0, OpenGL 3.2
LAN
Intel® i211 MAC/PHY
supporting 10/100/1000 GbE
Intel® i210IT MAC/PHY
supporting 10/100/1000 GbE
USB
1x USB 3.0
5x USB 2.0 host
1x USB 2.0 client
1x USB 3.0
5x USB 2.0 host
1x USB 2.0 client
Serial ATA
2x SATA 6Gb/s or
1x SATA 6Gb/s and
1x SATA SSD
2x SATA 3Gb/s or
1x SATA 3Gb/s and
1x SATA SSD
Audio
HDA
HDA
PCI Express
3x PCIe x1
3x PCIe x1
eMMC
4 GB to 64 GB (opt.)
4 GB to 64 GB (opt.)
SEMA Support
Yes
Yes
Camera
2x MIPI CSI 4L/2L
camera interfaces
1x MIPI CSI 4L/1L
camera interface
Power Supply
5.0V DC ±5%
5.0V DC ±5%
I²C
1x I²C
Asynchronous
Serial Port
1x asynchronous serial port (UART)
CAN Bus
1x CAN bus interface
USB
1x USB 3.0
5x USB 2.0 host
1x USB 2.0 client
PCI Express
3x PCIe x1, 1x PCIe Mini Card
SATA
2x SATA
LAN
GbE
Boot Source Select
SPI, eMMC, SD card, SATA
Miscellaneous
PPC/TPM connector
2x COM
1x LPT
2x PS/2 for keyboard & mouse
7-segment display for BIOS post code
status LEDs and control buttons
Power Modes
ATX/AT mode
Standard Voltage
Input
5.0V ±5%, ±50mV ripple, 12V, 3.3V
from ATX connector
Operating
Temperature
0°C to +60°C
0°C to +60°C
-40°C to +85°C (opt.)
Standby Voltage
Input
5.0V ±5%, ±50mV ripple from ATX connector
Operating
Systems
Windows 7, 8.1, 10,
Yocto Linux, Android
Win 7, 8, WEC 7, Yocto Linux
RTC Voltage Input
2.7V to 3.3V, dependent on module
Board Connector
MXM2 230-pin edge connector
Formfactor &
Compatibillity
Qseven v2.0
70 x 70 mm
Note: All specifications are subject to change without further notice.
P 47
ETX
The ETX® modules includes most generic functions needed for almost any application,
such as graphics, Ethernet, audio, IDE, FDD, keyboard/mouse, parallel, serial, and USB
ports. ETX modules are available in different performance levels with CPU speeds
to match your requirements. A custom designed carrier board complements the ETX
core module with additional functionality that is required for a specific application.
The carrier board provides the interface to connect the module to peripherals such as hard disk, mouse,
and display. Connectors on the carrier board can be placed exactly where needed to optimize the final
package and minimize cabling. This results in a more reliable product and simplified system integration.
A single carrier board can be used with different ETX modules when the same functionality is required at
different performance levels, allowing great ease in end product diversification.
Software Support
To ensure software development does not lag behind hardware development, we provide a full set of
BSPs to get you up and running in no time. BSPs for the following operating systems are provided:
Embedded Linux Development Kit
Linux BSP
Windows CE .Net BSP
VxWorks BSP
Windows XP Embedded support
Fastest Time to Market
The concept of using custom carrier boards combined with off-the-shelf Computer-on-Modules is an
excellent solution when you need to customize, but lack the time or quantity for a complete design from
the ground up. The average time to design a carrier board is less than half of that for a full custom OEM
board. ETX is economically feasible for system integration projects with production volumes in the range
of 500 to 10,000 pcs per year.
The ETX concept is well accepted and has numerous advantages over full custom designs. It reduces
engineering complexity, lowers the threshold for total project quantity, and last but not least, brings
your product to the market in no time.
P 48
ETX
ETX®
Product Name
ETX-BT
Product Name
ETX-Proto
Form Factor &
Compatibility
ETX 3.02
Size: 95 x 114 mm
Interface
ETX v3.0
Intel® Atom™ Processor
E3800 Family SoC
Audio
Onboard amplifier with Line-in, Speaker-out and
Mic
Line-In/Line-Out, Speaker-out
Video
VGA: DB-15 connector
for analog VGA displays
LVDS: Onboard header LVDS
TV-out: Onboard header
for PAL/NTSC TV
Expansion Buses
Four 32-bit PCI slots
Three16-bit ISA slots
One Mini PCI slot
CPU
Intel® Celeron® Processors
N2930/J1900
Chipset
-
Memory
Up to 4GB DDR3L at
1333/1066MHz
Cache
L2: 512 kB to 2MB
BIOS Type
AMI Aptio EFI
TPM support (opt.)
Atmel AT97SC3204
USB
Four ports 1.1/2.0 compatible
Integrated Graphics
Decode: H.264, MPEG2, MVC, VC-1, WMV9 and
VP8
Encode: H.264, MPEG2 and MVC
LAN
RJ-45
Graphics Features
DirectX 11, OCL 1.1,
OGL ES Halt/2.0/1.1, OGL 3.2
Serial Port
2x 16550 compatible RS-232 ports
2x additional ports COM3/4 from secondary multi
I/O
LAN
Intel® i211 MAC/PHY, supporting 10/100 Mbps
(GbE via onboard connector)
IDE Port
Four IDE devices (two connectors)
USB
4x USB 2.0
Parallel ATA (IDE)
2x PATA IDE
Parallel Port
One port SSP, ECP, and EEP mode
Serial ATA
2x SATA 3Gb/s
KB/Mouse
Audio
Integrated on E3800 SoC, supports,
Realtek ALC 262
Two 6-pin mini DIN connectors
(on rear I/O panel)
SEMA Support
Yes
KB/Mouse
Two 6-pin mini DIN connectors
(on rear I/O panel)
Power Supply
5V±5% / 5Vsb ±5% (ATX)
5V±5% (AT)
Operating
Temperature
0°C to +60°C
-40°C to +85°C (optional)
Power Modes
ATX and AT onboard
Onboard reset and ATX switches
OS support
Windows 7/8 Linux,
(WES7, WE8 Std., WEC7; Linux, VxWorks)
Formfactor
304.8 x 190 mm
Note:
・ Optional TPM support for special bill of materials
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 49
PC/104
True Ruggedness by Design for Extreme Harsh
Environments
ADLINK CoreModule® products provide unmatched
fanless operation over temperature extremes,
resistance to shock and vibration, conformal coating,
embedded BIOS, and a long product life reputation.
The CoreModule® continues to distinguish itself
as an Extreme Rugged™ product for a multitude of
applications. CoreModule® products are stackable
SBCs with a PC/104 footprint (90 × 96 mm) for
rugged and compact embedded systems. They
feature unmatched fanless operation over extreme
temperature ranges, resistance to shock and
vibration, optional conformal coating, no “wings
(protrusions outside the board footprint), and a long
product
0.6”
3.8”
J1
P1
[opt.]
0
J1
3.6”
0
PC/104 is a family of embedded computer standards which define both a physical form factor and
computer bus. The PC/104 concept was originally devised by Ampro in 1987, and later standardized by the
PC/104 Consortium in 1992. The name PC/104 comes from the SA (or PC/AT) bus and the 104 pins on the
connector.
The distinguishing features of the PC/104 family that makes it more suited to embedded systems than
motherboards with expansion cards are:
Compact size (90 x 96 mm)
No backplane – modules stack together like building blocks
Interoperability with boards from numerous manufacturers
Based on familiar PC technology for ease of design and development
Rugged construction: stacking bus connectors and corner mounting holes
The PC/104-Plus specification establishes a standard for the use of a high speed PCI bus in embedded
applications. Incorporating the PCI bus within the industry proven PC/104 form-factor brings many
advantages to its users, including fast data transfer over a PCI bus, low cost due to PC/104’s unique selfstacking bus, and high reliability due to PC/104’s inherent ruggedness.
The PC/104 Consortium has established the PCI/104 Express a high speed PCI bus in embedded
applications. Incorporating the PCI bus within the industry proven PC/104 form-factor brings many
advantages to its users, including fast data transfer over a PCI bus, low cost due to PC/104’s unique selfstacking bus, and high reliability due to PC/104’s inherent ruggedness.
The PC/104 Consortium has established the PCI/104 Express Specification in order to support the highperformance PCI Express interface while retaining compatibility with the existing PC/104 infrastructure.
PCI/104 Express preserves the key attributes of PC/104 such as compact size (90 x 96 mm), stackability,
ruggedness, and compatibility with PC technology. PCIe/104 is PCI/104-Express without the PCI bus.
PC/104, PCI-104 PC/104-Plus &
PCI/104-Express
ADLINK products currently come in four flavors
of PC/104:
PCI Connector
PC/104 TM
PC/104- Plus TM
ISA Connector
ISA Connector
PC/104: ISA bus only
PC/104-Plus: PCI and ISA busses
ISA Bus
ISA and PCI Bus
PCI-104: PCI bus only
PCI/104-Express: PCI bus and PCI Express bus
PCI Connector
PCI-104 TM
PCI Connector
PCI/104-Express
TM
Stackable PCIe Connector
P 50
PCI Bus
PCI and PCIe Bus
PC/104
PCI/104
PCI-104
Group
Product Name
CM3-BT4-E3845
CM3-BT1-E3815
CPU
Intel® Atom™ E3845 SoC
Intel® Atom™ E3815 SoC
Cache
Primary 32 KiB, 8-way L1 instruction cache and
24 KiB, 6-way L1 write-back data cache
Primary 32 KiB, 8-way L1 instruction cache and
24 KiB, 6-way L1 write-back data cache
Memory
Up to 4 GB DDR3L SO-DIMM
Up to 4 GB DDR3L SO-DIMM
PATA / SATA
1x SATA 3G/s shared with mSATA
(opt. 2nd SATA 3Gb/s port w/o mSATA support)
1x SATA 3Gb/s shared with mSATA
Serial Port
4x RS-232/485
2x RS-232/485
USB
3x USB 2.0
3x USB 2.0
GPIO
8
8
Audio
HDA
HDA
LAN
2x GbE
1x GbE
Graphics
Intel® HD graphics
Intel® HD graphics
Video
VGA
VGA
Flat Panel
Single/dual channel 18/24-bit LVDS
Single/dual channel 18/24-bit LVDS
SEMA Support
Yes
Yes
Operating
Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C (opt.)
OS support
Windows 7, Windows 8, WEC7,
Linux, VxWorks
Windows 7, Windows 8, WEC7,
Linux, VxWorks
Dimensions
(W x H)
90 x 96 mm
90 x 96 mm
Note: All specifications are subject to change without further notice.
P 51
PCI/104-Express and PC/104-Plus
Modules
PCI/104-Express
PC/104-Plus
Product Name
CM-920
CM2-BT2-E3825
CPU
Intel® Core™ i7-3517UE
Intel® Celeron® 807UE
Intel® Atom™ E3825 SoC
Cache
4MB/1MB Level 3
Primary 32 KiB, 8-way L1 instruction cache and 24 KiB,
6-way L1 write-back data cache
Memory
Up to 4 GB soldered ECC DDR3
Up to 4GB DDR3L SODIMM
PATA / SATA
2x SATA 6Gb/s
1x SATA 3Gb/s shared with mSATA
(optional 2nd SATA 3GB/s port w/o mSATA support)
Serial Port
2x RS-232
4x RS-232/485
USB
4x USB 2.0
3x USB 2.0
GPIO
-
8
Audio
available on HDMI port
HDA
LAN
2x GbE
2x GbE
Graphics
Intel® HD Graphics
Intel® HD Graphics
Video
VGA, HDMI/DVI, DisplayPort
VGA
Flat Panel
Dual channel 18/24-bit LVDS
Single/dual channel 18/24-bit LVDS
SEMA Support
-
Yes
Operating
Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C (opt.)
OS support
Windows 7, Windows XP, WEC7,
Linux, VxWorks
Windows 7, Windows 8, WEC7,
Linux, VxWorks
Dimensions
(W x H)
116 x 96 mm
90 x 96 mm
Note: All specifications are subject to change without further notice.
P 52
PC/104
PC/104
Modules
Product Name
CM1-BT1-E3815
CM1-86DX3
CM1-86DX2
CM-430
CPU
Intel® Atom™ E3815 SoC
Vortex86DX3 SoC
Vortex86DX2 SoC
Vortex86DX SoC
Cache
Primary 32 KiB, 8-way L1
instruction cache and 24 KiB,
6-way L1 write-back data
cache
L2: 512kB
L1 I: 16kB
L1 D: 16kB
L2: 256kB
L1 I: 16kB
L1 D: 16kB
Memory
Up to 4 GB DDR3L SO-DIMM
2 GB soldered DDR3L
512MB/1GB soldered DDR2
256MB soldered DDR2
PATA / SATA
1x SATA 3Gb/s shared with
mSATA
(opt. 2nd SATA 3Gb/s port w/o
mSATA support)
1x SATA 1.5Gb/s
(or CFast)
1x SATA 1.5Gb/s
EIDE
Serial Port
4x RS-232/485
2x RS-232
2x RS-232/422/485
Up to 4x RS-232/485
4x RS232
2x RS232/485
USB
3x USB 2.0
2x USB 2.0
3x USB 2.0
2x USB 2.0
GPIO
8
8
8
8
Audio
HDA
-
HDA
-
LAN
2x GbE
1x GbE
1x 10/100 Mbit
1x GbE
1x 10/100 Mbit
1x 10/100 Mbit
Graphics
Intel® HD Graphics
Integrated 2D graphics
Integrated 2D graphics
Integrated 2D graphics
Video
VGA
VGA
VGA
VGA
Flat Panel
Single/dual channel
18/24-bit LVDS
Single channel
18/24-bit TTL/TFT
Single channel
18/24-bit LVDS
TTL/TFT
SEMA Support
Yes
Yes
Yes
-
Operating
Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C
(opt., contact for availability)
0°C to +60°C
-40°C to +85°C (opt.)
0°C to +60°C
-40°C to +85°C (opt.)
OS support
Windows 7, Windows 8, WEC7,
Linux, VxWorks
WES2009, WES7,
Linux, QNX
on request: WEC7, Windows
CE 6.0
Windows XP, Linux,
Windows CE
Windows CE 5.0/6.0,
QNX v6.3
Dimensions
(W x H)
90 x 96 mm
90 x 96 mm
90 x 96 mm
90 x 96 mm
Note: All specifications are subject to change without further notice.
P 53
Mini-ITX
Smaller form factor for today's compact systems
Industry trends indicate that users require a smaller and lower cost solution for their system
requirements. Mini-ITX has a smaller board size and lower keep-out zones to enable a reduced chassis
size for systems placed on the user’s desk, mounted on a display, or installed in space-restrictive
environments.
7.50" (19.05 cm)
9.00
6.75" (17 cm)
6.75
9.625" (24.5 cm)
9.625
12.00
9.625" (24.5 cm)
Mini-ITX
Flex-ATX
Micro-ATX
ATX
In addition to deployment in smaller chassis designed around the Mini-ITX form factor, these boards are
compatible with ATX and microATX chassis without the need to retool the I/O shield. Mini-ITX embedded
boards are ideal for applications in industrial automation, self-service kiosks, and other infotainment
driven solutions.
Flexible, high speed and better connectivity
ADLINK Mini-ITX embedded boards support the latest Intel and AMD processors to deliver a high
performance and space-saving platform for a wide array of embedded computing applications. Along with
its compact footprint, this product line supports high processing speeds and high-bandwidth network
connectivity with PCI Express®-based Gigabit Ethernet. Coupled with ample memory, diverse I/O, storage,
and audio interfaces, ADLINK Mini-ITX embedded boards are suitable for multimedia, automation control,
and gaming applications requiring a compact, easy-to deploy, and cost-effective mainboard.
Special I/O for vertical markets
Electro-mechabical compatibility with
in the AmlTX-XX-G Mini-ITX family
•
Vertical on-board USB2.0 port
•
HDMI
•
Dual PCIe Expansion
•
Optional LVDS support
• Internal Aubio Header
•
Multi Displayport
• Internal Feature Header
•
PCIe slot for extemal graphice
• TPM Header
• SPI Header
• Optional Socketed SPI BIOS
Easy Development and Maintenance
•
BMC on-board
SEMA and SEMA Cloud support IoT
deployment
•
P 54
Others
•
SATADOM support
•
Optional TPM on-board
•
ATX or 12VDC-only power input
•
Latch able connectors
Mini-ITX
Infotainment Applications
ADLINK Infotainment solutions are ideal for gaming and retail services including ATMs, floor plan guides, lottery & slot machines and
supermarket self-service kiosks. ADLINK Mini-ITX embedded boards provide flexible connection possibilities for system integrators to
link and manage multiple peripherals to meet application needs. Video lottery terminals and slot machines must sustain continuous
operation, meaning hardware stability and ease of maintenance become essential. ADLINK's extensive experience and capabilities in
hardware design and software development combined with our self-owned manufacturing base allows us to provide reliable products
of superior quality for different solutions.
In the retail environment, multimedia digital signage that combines entertainment and information is one of the best ways to
communicate with consumers. Intelligent display panels powered by ADLINK Mini-ITX embedded boards can be installed above
checkout counters or in other suitable locations. Supermarket self-service kiosks are stand-alone terminals which integrate
environment information, promotional products, membership management and other relevant data through interactive multimedia
communication.
Medical applications require highly accurate video imaging with low latency during surgical procedures, such as X-ray, ultrasound,
and endoscopy. This market presents diverse opportunities for embedded designers, fueled by demand for real-time data processing
and sharing, high definition imaging and graphics displays, and creative, compact solutions that enable healthcare anywhere. ADLINK
expertly solves these medical design challenges, offering intelligent embedded platforms that help OEMs/ODMs innovate, reduce
risk and accelerate time-to-market with solutions validated for high performance and complex regulatory requirements. For medical
device developers and manufacturers, ADLINK is your complete supplier of Mini-ITX embedded boards that provide robust, faultfree connectivity, as well as the wide range of high-speed I/O required to support the broad and growing spectrum of imaging and
diagnostics applications. Development time is reduced, and medical device manufacturers can focus on their core competencies in
creating competitive, high performance healthcare applications.
Retail
Requirements
Applications
•
Time to market
•
Processing performance
Medical
Gaming
•
High performance
HD graphics
•
Vertical on-board USB
connector
•
Multi DisplayPort/HDMI/
LVDS outputs
•
Meet GLI criteria
•
Kiosks (e.g. ATM, POS)
•
Ultrasound
•
Betting machines
•
Vending machines
•
MRI
•
Lottery terminals
•
Digital signages
•
Point-of-care terminal
•
Slot machines
•
Patient bedside terminal
P 55
Mini-ITX Embedded Boards
High Performance
Group
Product Name
AmITX-SL-G
AmITX-HL-G
AmITX-BE-G
CPU
6th Gen. Intel® Core™
i7-6700/6700TE
i5-6500/-6500TE
i3-6100/6100TE
4th Gen. Intel® Core™
i7-4700S/4770TE/4790S
i5-4570S/4570TE/4590S
i3-4330/4330TE/4360/4350T
AMD® R series RX-427BB/425BB/225FB
Intel® Pentium® G4400/G4400TE
Intel® Celeron® G3900/G3900TE
Intel® Pentium® G3420/G3320TE
Intel® Celeron® G1820/G1820TE
Chipset
Q170 and H110
PQ87 and H81
AMD A77E
Memory
Up to 32 GB non-ECC Dual Channel
DDR4 at 2133/1866 MHz
Up to 16 GB non-ECC Dual Channel
DDR3/DDRL3 at 1600/1333 MHz
Up to 16 GB non-ECC Dual Channel
DDRL3 at 1600/1333 MHz
Integrated Graphics
Intel® Gen 9 graphics
3 DisplayPort, LVDS co-lay with eDP (opt.)
3 DispayPort, LVDS (opt.)
AMD® Radeon HD 9000
4 DisplayPort, LVDS (opt.)
SATA
3x SATA 6 Gb/s
Q87: 3x SATA 6 Gb/s
H81: 1x SATA 3 Gb/s and 2x SATA 6Gb/s
3x SATA 6.0 Gb/s
LAN
1x Intel® i219LM, GbE
1x Intel® i211AT, GbE
1x Intel® i218LM, GbE
1x Intel® i211AT, GbE
2x Intel® i211AT, GbE
1x RS-232/422/485
3x RS-232
Serial Port
USB
Expansion Slots
Q170: 7x USB 3.0, 4x USB 2.0
H110: 4x USB 3.0, 7x USB 2.0
Q87: 4x USB 3.0, 9x USB 2.0
H81: 2x USB 3.0, 11x USB 2.0
4x USB 3.0
9x USB 2.0
1x PCIe x16, 1x PCIe x1
1x full size Mini PCIe + USB or mSATA
1x half size Mini PCIe+USB
1x PCIe x16, 1x PCIe x1
1x full size Mini PCIe + USB or mSATA
1x half size Mini PCIe + USB
1x SPI header for external BIOS
1x PCIe x16, 1x PCIe x1
1x full size Mini PCIe + USB or mSATA
1x half size Mini PCIe + USB
1x SPI header for external BIOS
1x SPI header for external BIOS
SEMA Support
Yes
Power Supply
12V ±5% / 5Vsb ±5% (ATX), 12V ±5% (AT)
Onboard headers for fan and SATA power
Operating
Temperature
0˚C to +60˚C
Form Factor &
Compatibility
170 mm x 170 mm (L x W)
OS support
Win10/Win 8.1/7, WES 7, Linux, VxWorks
Note: All specifications are subject to change without further notice.
P 56
WES 7/8
Linux, VxWorks
Windows 7/8,
WES 7/8, Linux
Low Power Consumption
Group
Product Name
AmITX-AL-I
AmITX-BW-I
AmITX-BT-I
CPU
Future Intel® Processor
Intel® Pentium® N3710
Intel® Celeron® N3160/N3060/N3010
Future Intel® Atom™ Processor
Intel® Atom™ E3800 series SoC
Intel® Celeron® N2930/J1900
Memory
Up to 16 GB non-ECC Dual Channel
DDR3L at 1867/1600 MHz
Up to 8GB non-ECC Dual Channel
DDR3L at 1600/1333 MHz
Up to 8 GB non-ECC Dual Channel
DDRL3 at 1333/1066 MHz
SATA
2x SATA 6 Gb/s
2x SATA 6 Gb/s
2x SATA 3 Gb/s
2x Intel® i211AT, GbE
LAN
Serial port
2x RS-232/422/485
4x RS-232
2x RS-232/422/485
4x RS-232
3x RS-232/422/485
3x RS-232
4x USB 1.1/2.0/3.0
4x USB 1.1/2.0
USB
Integrated Graphics
1x HDMI, 2 DisplayPort, LVDS, eDP (opt.)
1x HDMI, 2 DisplayPort, LVDS, eDP (opt.)
VGA, HDMI, LVDS
Expansion slots
1x PCIe x1, 1x Mini-PCIe, 1x mSATA
1x SPI header for external BIOS
1x PCIe x1, 1x Mini-PCIe, 1x mSATA
1x SPI header for external BIOS
1x PCIe x1, 1x Mini-PCIe, 1x mSATA
1x SPI header for external BIOS
SEMA Support
Yes
Power Supply
12V ±5%
Supports ATX/AT mode
Onboard headers for fan and SATA power
12V ±5%
Supports ATX/AT mode
Onboard headers for fan and SATA power
Std: 12V ±5% / 5Vsb ±5% (ATX ),
12V ±5% (AT)
Supports ATX/AT mode
Onboard headers for fan and SATA power
Operating
Temperature
0°C to +60°C
-40°C to +85°C (opt.)
0˚C to +60˚C
0°C to 60°C
-40°C to + 85°C (opt.)
Form Factor &
Compatibility
OS support
170 mm x 170 mm (L x W)
Win 10/7, WES7, Linux, VxWorks
Win 10 IOT Enterprise
Windows 7/8, WES 7, Linux, VxWorks
Windows 7/8, Linux, VxWorks
Note:
・ Optional TPM support for special bill of materials
・ Optional -40°C to +85°C support: Standard product with 100% ETT screening available for selected CPU SKUs and std. 12V power supply only
・ All specifications are subject to change without further notice.
P 57
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