Texas Instruments | MSP430 | User's Manual | Texas Instruments MSP430 User's Manual

Texas Instruments MSP430 User's Manual
MSP430 Hardware Tools
User's Guide
Literature Number: SLAU278F
May 2009 – Revised December 2010
2
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
Contents
....................................................................................................................................... 9
Get Started Now! ............................................................................................................... 13
1.1
Flash Emulation Tool (FET) Overview .................................................................................. 14
1.2
Kit Contents, MSP-FET430PIF .......................................................................................... 14
1.3
Kit Contents, eZ430-F2013 .............................................................................................. 14
1.4
Kit Contents, eZ430-T2012 .............................................................................................. 14
1.5
Kit Contents, eZ430-RF2500 ............................................................................................ 15
1.6
Kit Contents, eZ430-RF2500T ........................................................................................... 15
1.7
Kit Contents, eZ430-RF2500-SEH ...................................................................................... 15
1.8
Kit Contents, eZ430-Chronos-xxx ....................................................................................... 15
1.9
Kit Contents, MSP-FET430UIF .......................................................................................... 15
1.10 Kit Contents, MSP-FET430xx ............................................................................................ 16
1.11 Kit Contents, FET430Fx137RF900 ..................................................................................... 17
1.12 Kit Contents, MSP-TS430xx ............................................................................................. 17
1.13 Kit Contents, EM430Fx137RF900 ....................................................................................... 19
1.14 Hardware Installation, MSP-FET430PIF ............................................................................... 19
1.15 Hardware Installation, MSP-FET430UIF ............................................................................... 20
1.16 Hardware Installation, eZ430-F2013, eZ430-RF2500, eZ430-Chronos ............................................ 20
1.17 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430Fx137RF900, EM430Fx137RF900 ...... 20
1.18 Important MSP430 Documents on the CD-ROM and Web .......................................................... 21
Design Considerations for In-Circuit Programming ............................................................... 23
2.1
Signal Connections for In-System Programming and Debugging ................................................... 24
2.2
External Power ............................................................................................................. 27
2.3
Bootstrap Loader (BSL) .................................................................................................. 27
Frequently Asked Questions and Known Issues ................................................................... 29
A.1
Hardware FAQs ............................................................................................................ 30
A.2
Known Issues .............................................................................................................. 32
Hardware .......................................................................................................................... 33
B.1
MSP-TS430PW14 ......................................................................................................... 34
B.2
MSP-TS430L092 .......................................................................................................... 37
B.3
MSP-TS430L092 Active Cable .......................................................................................... 40
B.4
MSP-TS430PW24 ......................................................................................................... 43
B.5
MSP-TS430DW28 ......................................................................................................... 46
B.6
MSP-TS430PW28 ......................................................................................................... 49
B.7
MSP-TS430PW28A ....................................................................................................... 52
B.8
MSP-TS430DA38 .......................................................................................................... 55
B.9
MSP-TS430QFN23x0 ..................................................................................................... 58
B.10 MSP-TS430RSB40 ........................................................................................................ 61
B.11 MSP-TS430RHA40A ...................................................................................................... 64
B.12 MSP-TS430DL48 .......................................................................................................... 67
B.13 MSP-TS430RGZ48B ...................................................................................................... 70
B.14 MSP-TS430PM64 ......................................................................................................... 73
B.15 MSP-TS430PM64A ....................................................................................................... 76
B.16 MSP-TS430RGC64B ..................................................................................................... 79
Preface
1
2
A
B
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Contents
© 2009–2010, Texas Instruments Incorporated
3
www.ti.com
B.17
B.18
B.19
B.20
B.21
B.22
B.23
B.24
B.25
B.26
B.27
B.28
B.29
MSP-TS430RGC64USB .................................................................................................. 82
MSP-TS430PN80 .......................................................................................................... 86
MSP-TS430PN80A ........................................................................................................ 89
MSP-TS430PN80USB .................................................................................................... 91
MSP-TS430PZ100 ........................................................................................................ 96
MSP-TS430PZ100A ....................................................................................................... 99
MSP-TS430PZ100B ..................................................................................................... 102
MSP-TS430PZ5x100 .................................................................................................... 105
MSP-TS430PZ100USB ................................................................................................. 107
EM430F5137RF900 ..................................................................................................... 112
EM430F6137RF900 ..................................................................................................... 116
MSP-FET430PIF ......................................................................................................... 120
MSP-FET430UIF ......................................................................................................... 122
B.29.1 MSP-FET430UIF Revision History .......................................................................... 127
.............................................................................................. 129
C.1
Hardware Installation .................................................................................................... 130
Document Revision History ........................................................................................................ 136
C
Hardware Installation Guide
4
Contents
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
www.ti.com
List of Figures
2-1.
Signal Connections for 4-Wire JTAG Communication ................................................................ 25
2-2.
Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) ............................................... 26
B-1.
MSP-TS430PW14 Target Socket Module, Schematic
B-2.
MSP-TS430PW14 Target Socket Module, PCB
B-3.
B-4.
B-5.
B-6.
B-7.
B-8.
B-9.
B-10.
B-11.
B-12.
B-13.
B-14.
B-15.
B-16.
B-17.
B-18.
B-19.
B-20.
B-21.
B-22.
B-23.
B-24.
B-25.
B-26.
B-27.
B-28.
B-29.
B-30.
B-31.
B-32.
B-33.
B-34.
B-35.
B-36.
B-37.
B-38.
B-39.
B-40.
B-41.
B-42.
B-43.
B-44.
B-45.
............................................................... 34
...................................................................... 35
MSP-TS430L092 Target Socket Module, Schematic ................................................................. 37
MSP-TS430L092 Target Socket Module, PCB ........................................................................ 38
MSP-TS430L092 Active Cable Target Socket Module, Schematic ................................................. 40
MSP-TS430L092 Active Cable Target Socket Module, PCB ........................................................ 41
MSP-TS430PW24 Target Socket Module, Schematic ............................................................... 43
MSP-TS430PW24 Target Socket Module, PCB ...................................................................... 44
MSP-TS430DW28 Target Socket Module, Schematic ............................................................... 46
MSP-TS430DW28 Target Socket Module, PCB ...................................................................... 47
MSP-TS430PW28 Target Socket Module, Schematic ............................................................... 49
MSP-TS430PW28 Target Socket Module, PCB ...................................................................... 50
MSP-TS430PW28A Target Socket Module, Schematic .............................................................. 52
MSP-TS430PW28A Target Socket Module, PCB (Red) ............................................................. 53
MSP-TS430DA38 Target Socket Module, Schematic ................................................................ 55
MSP-TS430DA38 Target Socket Module, PCB ....................................................................... 56
MSP-TS430QFN23x0 Target Socket Module, Schematic ........................................................... 58
MSP-TS430QFN23x0 Target Socket Module, PCB .................................................................. 59
MSP-TS430RSB40 Target Socket Module, Schematic .............................................................. 61
MSP-TS430RSB40 Target Socket Module, PCB ..................................................................... 62
MSP-TS430RHA40A Target Socket Module, Schematic ............................................................ 64
MSP-TS430RHA40A Target Socket Module, PCB ................................................................... 65
MSP-TS430DL48 Target Socket Module, Schematic ................................................................ 67
MSP-TS430DL48 Target Socket Module, PCB ....................................................................... 68
MSP-TS430RGZ48B Target Socket Module, Schematic ............................................................ 70
MSP-TS430RGZ48B Target Socket Module, PCB ................................................................... 71
MSP-TS430PM64 Target Socket Module, Schematic ................................................................ 73
MSP-TS430PM64 Target Socket Module, PCB ....................................................................... 74
MSP-TS430PM64A Target Socket Module, Schematic .............................................................. 76
MSP-TS430PM64A Target Socket Module, PCB ..................................................................... 77
MSP-TS430RGC64B Target Socket Module, Schematic ............................................................ 79
MSP-TS430RGC64B Target Socket Module, PCB ................................................................... 80
MSP-TS430RGC64USB Target Socket Module, Schematic ........................................................ 82
MSP-TS430RGC64USB Target Socket Module, PCB ............................................................... 83
MSP-TS430PN80 Target Socket Module, Schematic ................................................................ 86
MSP-TS430PN80 Target Socket Module, PCB ....................................................................... 87
MSP-TS430PN80A Target Socket Module, Schematic .............................................................. 89
MSP-TS430PN80A Target Socket Module, PCB ..................................................................... 90
MSP-TS430PN80USB Target Socket Module, Schematic .......................................................... 92
MSP-TS430PN80USB Target Socket Module, PCB.................................................................. 93
MSP-TS430PZ100 Target Socket Module, Schematic ............................................................... 96
MSP-TS430PZ100 Target Socket Module, PCB ...................................................................... 97
MSP-TS430PZ100A Target Socket Module, Schematic ............................................................. 99
MSP-TS430PZ100A Target Socket Module, PCB ................................................................... 100
MSP-TS430PZ100B Target Socket Module, Schematic............................................................ 102
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
List of Figures
© 2009–2010, Texas Instruments Incorporated
5
www.ti.com
B-46. MSP-TS430PZ100B Target Socket Module, PCB ................................................................... 103
B-47. MSP-TS430PZ5x100 Target Socket Module, Schematic
..........................................................
105
B-48. MSP-TS430PZ5x100 Target Socket Module, PCB.................................................................. 106
B-49. MSP-TS430PZ100USB Target Socket Module, Schematic ........................................................ 108
B-50. MSP-TS430PZ100USB Target Socket Module, PCB ............................................................... 109
B-51. EM430F5137RF900 Target Socket Module, Schematic ............................................................ 112
B-52. EM430F5137RF900 Target Socket Module, PCB ................................................................... 113
B-53. EM430F6137RF900 Target Socket Module, Schematic ............................................................ 116
B-54. EM430F6137RF900 Target Socket Module, PCB ................................................................... 117
B-55. MSP-FET430PIF FET Interface Module, Schematic ................................................................ 120
B-56. MSP-FET430PIF FET Interface Module, PCB ....................................................................... 121
122
B-58. MSP-FET430UIF USB Interface, Schematic (2 of 4)
123
B-59.
124
B-60.
B-61.
C-1.
C-2.
C-3.
C-4.
C-5.
C-6.
C-7.
6
...............................................................
...............................................................
MSP-FET430UIF USB Interface, Schematic (3 of 4) ...............................................................
MSP-FET430UIF USB Interface, Schematic (4 of 4) ...............................................................
MSP-FET430UIF USB Interface, PCB ................................................................................
Windows XP Hardware Recognition...................................................................................
Windows XP Hardware Wizard ........................................................................................
Windows XP Driver Location Selection Folder .......................................................................
Windows XP Driver Installation ........................................................................................
Device Manager Using MSP-FET430UIF or eZ430-F2013 (CCE and CCS Only) ..............................
Device Manager Using MSP-FET430UIF or eZ430-F2013 (IAR Only) ...........................................
Device Manager Using eZ430-RF2500 (CCE/CCS and IAR) ......................................................
B-57. MSP-FET430UIF USB Interface, Schematic (1 of 4)
List of Figures
125
126
130
130
131
132
133
134
135
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
www.ti.com
List of Tables
..................................................................................
1-1.
Flash Emulation Tool (FET) Features
1-2.
Individual Kit Contents, MSP-TS430xx ................................................................................. 18
B-1.
MSP-TS430PW14 Bill of Materials ...................................................................................... 36
B-2.
MSP-TS430L092 Bill of Materials ....................................................................................... 39
B-3.
MSP-TS430L092 JP1 Settings .......................................................................................... 41
B-4.
MSP-TS430L092 Active Cable Bill of Materials ....................................................................... 42
B-5.
MSP-TS430PW24 Bill of Materials ...................................................................................... 45
B-6.
MSP-TS430DW28 Bill of Materials...................................................................................... 48
B-7.
MSP-TS430PW28 Bill of Materials
B-8.
MSP-TS430PW28A Bill of Materials .................................................................................... 54
B-9.
MSP-TS430DA38 Bill of Materials ...................................................................................... 57
.....................................................................................
14
51
B-10. MSP-TS430QFN23x0 Bill of Materials.................................................................................. 60
B-11. MSP-TS430RSB40 Bill of Materials
....................................................................................
63
B-12. MSP-TS430RHA40A Bill of Materials................................................................................... 66
B-13. MSP-TS430DL48 Bill of Materials ....................................................................................... 69
B-14. MSP-TS430RGZ48B Bill of Materials................................................................................... 72
B-15. MSP-TS430PM64 Bill of Materials ...................................................................................... 75
B-16. MSP-TS430PM64A Bill of Materials .................................................................................... 78
B-17. MSP-TS430RGC64B Bill of Materials .................................................................................. 81
B-18. MSP-TS430RGC64USB Bill of Materials............................................................................... 84
B-19. MSP-TS430PN80 Bill of Materials ...................................................................................... 88
....................................................................................
MSP-TS430PN80USB Bill of Materials .................................................................................
MSP-TS430PZ100 Bill of Materials .....................................................................................
MSP-TS430PZ100A Bill of Materials ..................................................................................
MSP-TS430PZ100B Bill of Materials ..................................................................................
MSP-TS430PZ5x100 Bill of Materials .................................................................................
MSP-TS430PZ100USB Bill of Materials ..............................................................................
EM430F5137RF900 Bill of Materials ..................................................................................
EM430F6137RF900 Bill of Materials ..................................................................................
B-20. MSP-TS430PN80A Bill of Materials
B-21.
B-22.
B-23.
B-24.
B-25.
B-26.
B-27.
B-28.
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
List of Tables
© 2009–2010, Texas Instruments Incorporated
91
94
98
101
104
107
110
114
118
7
8
List of Tables
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
Preface
SLAU278F – May 2009 – Revised December 2010
Read This First
About This Manual
This manual describes the hardware of the Texas Instruments MSP-FET430 Flash Emulation Tool (FET).
The FET is the program development tool for the MSP430 ultra-low-power microcontroller. Both available
interface types, the parallel port interface and the USB interface, are described.
How to Use This Manual
Read and follow the instructions in Chapter 1. This chapter lists the contents of the FET, provides
instructions on installing the hardware and according software drivers. After you see how quick and easy it
is to use the development tools, TI recommends that you read all of this manual.
This manual describes the setup and operation of the FET but does not fully describe the MSP430™
microcontrollers or the development software systems. For details of these items, see the appropriate TI
documents listed in Section 1.18.
This manual applies to the following tools (and devices):
• MSP-FET430PIF (debug interface with parallel port connection, for all MSP430 flash-based devices)
• MSP-FET430UIF (debug interface with USB connection, for all MSP430 flash-based devices)
• eZ430-F2013 (USB stick form factor interface with attached MSP430F2013 target, for all
MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21 and MSP430G2x31 devices)
• eZ430-T2012 (three MSP430F2012 based target boards)
• eZ430-RF2500 (USB stick form factor interface with attached MSP430F2274/CC2500 target, for all
MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21 and
MSP430G2x31 devices)
• eZ430-RF2500T (one MSP430F2274/CC2500 target board including battery pack)
• eZ430-RF2500-SEH (USB stick form factor interface with attached MSP430F2274/CC2500 target and
solar energy harvesting module)
• eZ430-Chronos-xxx (USB stick form factor interface with CC430F6137 based development system
contained in a watch. Includes <1 GHz RF USB access point)
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Read This First
© 2009–2010, Texas Instruments Incorporated
9
How to Use This Manual
www.ti.com
The following tools contain the USB debug interface (MSP-FET430UIF) and the respective target socket
module:
• MSP-FET430U14 (for MSP430F20xx, MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21
and MSP430G2x31 devices in 14-pin PW packages)
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
MSP-FET430U092 (for MSP430FL092 devices in 14-pin PW packages)
MSP-FET430U24 (for MSP430AFE2xx devices in 24-pin PW packages)
MSP-FET430U28 (for MSP430F11xx(A) devices in 20- and 28-pin DW or PW packages)
MSP-FET430U28A (for MSP430F20xx and MSP430G2xxx devices in 14-, 20-, and 28-pin PW)
MSP-FET430U38 (for MSP430F22x2 and MSP430F22x4 devices in 38-pin DA packages)
MSP-FET430U23x0 (for MSP430F23x0 devices in 40-pin RHA packages)
MSP-FET430U40 (for MSP430F51x1, MSP430F51x2 devices in 40-pin RSB packages)
MSP-FET430U40A (for MSP430FR572x, MSP430FR573x devices in 40-pin RHA packages)
MSP-FET430U48 (for MSP430F22x2 and MSP430F22x4 devices in 48-pin DL packages)
MSP-FET430U48B (for MSP430F534x devices in 48-pin RGZ packages)
MSP-FET430U64 (for MSP430F13x, MSP430F14x, MSP430F14x1, MSP430F15x, MSP430F16x(1),
MSP430F23x, MSP430F24x, MSP430F24xx, MSP430F261x, MSP430F41x, MSP430F42x(A),
MSP430FE42x(A), MSP430FE42x2, and MSP430FW42x devices in 64-pin PM packages)
MSP-FET430U64A (for MSP430F41x2 devices in 64-pin PM packages)
MSP-FET430U64B (for MSP430F530x devices in 64-pin RGC packages)
MSP-FET430U64USB (for MSP430F550x, MSP430F551x, MSP430552x, devices in 64-pin RGC
packages
MSP-FET430U80 (for MSP430F241x, MSP430F261x, MSP430F43x, MSP430F43x1, MSP430FG43x,
MSP430F47x, and MSP430FG47x devices in 80-pin PN packages)
MSP-FET430U80A (for MSP430F532x devices in 80-pin PN packages)
MSP-FET430U80USB (for MSP430F552x devices with USB peripheral in 80-pin PN packages)
MSP-FET430U100 (for MSP430F43x, MSP430F43x1, MSP430F44x, MSP430FG461x, and
MSP430F47xx devices in 100-pin PZ packages)
MSP-FET430U100A (for MSP430F471xx devices in 100-pin PZ packages - red PCB)
MSP-FET430U5x100 (for MSP430F54xx(A) devices and the MSP430BT5190 in 100-pin PZ packages)
MSP-FET430U100USB (for MSP430F663x and MSP430F563x devices in 100-pin PZ packages)
FET430F5137RF900 (for CC430F513x devices in 48-pin RGZ packages)
FET430F6137RF900 (for CC430F612x and CC430F613x devices in 64-pin RGC packages)
Stand-alone target-socket modules (without debug interface):
• MSP-TS430PW14 (for MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21 and
MSP430G2x31 devices in 14-pin PW packages)
• MSP-TS430L092 (for MSP430FL092 devices in 14-pin PW packages)
• MSP-TS430PW24 (for MSP430AFE2xx devices in 24-pin PW packages)
• MSP-TS430DW28 (for MSP430F11xx(A) devices in 28-in DW packages)
• MSP-TS430PW28 (for MSP430F11xx(A) devices in 28-in PW packages)
• MSP-TS430PW28A (for MSP430F20xx and MSP430G2xxx devices in 14, 20 and 28-pin PW)
• MSP-TS430DA38 (for MSP430F22x2 and MSP430F22x4 devices in 38-pin DA packages)
• MSP-TS430QFN23x0 (for MSP430F23x0 devices in 40-pin RHA packages)
• MSP-TS430RSB40 (for MSP430F51x1, MSP430F51x2 devices in 40-pin RSB packages)
• MSP-TS430RHA40A ((for MSP430FR572x, MSP430FR573x devices in 40-pin RHA packages)
• MSP-TS430DL48 (for MSP430F22x2 and MSP430F22x4 devices in 48-pin DL packages)
• MSP-TS430RGZ48B (for MSP430F534x devices in 48-pin RGZ packages)
• MSP-TS430PM64 (for MSP430F13x, MSP430F14x, MSP430F14x1, MSP430F15x, MSP430F16x(1),
MSP430F23x, MSP430F24x, MSP430F24xx, MSP430F261x, MSP430F41x, MSP430F42x(A),
MSP430FE42x(A), MSP430FE42x2, and MSP430FW42x devices in 64-pin PM packages)
• MSP-TS430PM64A (for MSP430F41x2 devices in 64-pin PM packages)
10
Read This First
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
Information About Cautions and Warnings
www.ti.com
•
•
•
•
MSP-TS430RGC64B (for MSP430F530x devices in 64-pin RGC packages)
MSP-TS430RGC64USB (for MSP430F550x, MSP430F551x, MSP430552x, devices in 64-pin RGC
packages)
MSP-TS430PN80 (for MSP430F241x, MSP430F261x, MSP430F43x, MSP430F43x1, MSP430FG43x,
MSP430F47x, and MSP430FG47x devices in 80-pin PN packages)
MSP-TS430PN80A (for MSP430F532x devices in 80-pin PN packages)
MSP-TS430PN80USB (for MSP430F552x devices with USB peripheral in 80-pin PN packages)
MSP-TS430PZ100 (for MSP430F43x, MSP430F43x1, MSP430F44x, MSP430FG461x, and
MSP430F47xx devices in 100-pin PZ packages)
MSP-TS430PZ100A (for MSP430F471xx devices in 100-pin PZ packages — red PCB)
MSP-TS430PZ5x100 (for MSP430F54xx(A) and the MSP430BT5190 devices in 100-pin PZ packages)
•
•
•
MSP-TS430PZ100USB (for MSP430F663x and MSP430F563x devices in 100-pin PZ packages)
EM430F5137RF900 (with integrated CC430F5137 IC in a 48-pin RGZ package)
EM430F6137RF900 (with integrated CC430F6137 IC in a 64-pin RGC package)
•
•
•
•
These tools contain the most up-to-date materials available at the time of packaging. For the latest
materials (data sheets, user's guides, software, application information, etc.), visit the TI MSP430 web site
at www.ti.com/msp430 or contact your local TI sales office.
Information About Cautions and Warnings
This document may contain cautions and warnings.
CAUTION
This is an example of a caution statement.
A caution statement describes a situation that could potentially damage your
software or equipment.
WARNING
This is an example of a warning statement.
A warning statement describes a situation that could potentially
cause harm to you.
The information in a caution or a warning is provided for your protection. Read each caution and warning
carefully.
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Read This First
© 2009–2010, Texas Instruments Incorporated
11
Related Documentation From Texas Instruments
www.ti.com
Related Documentation From Texas Instruments
MSP430 development tools documentation:
CCS for MSP430 User's Guide, literature number SLAU157
Code Composer Studio v4.x Core Edition, CCS Mediawiki
IAR for MSP430 User's Guide, literature number SLAU138
IAR Embedded Workbench KickStart, SLAC050
eZ430-F2013 Development Tool User's Guide, literature number SLAU176
eZ430-RF2480 User's Guide, literature number SWRA176
eZ430-RF2500 Development Tool User's Guide, literature number SLAU227
eZ430-RF2500-SEH Development Tool User's Guide, literature number SLAU273
eZ430-Chronos Development Tool User's Guide, literature number SLAU292
MSP430xxxx device user's guides:
MSP430x1xx Family User's Guide, literature number SLAU049
MSP430x2xx Family User's Guide, literature number SLAU144
MSP430x3xx Family User's Guide, literature number SLAU012
MSP430x4xx Family User's Guide, literature number SLAU056
MSP430x5xx Family User's Guide, literature number SLAU208
CC430 Family User's Guide, literature number SLAU259
If You Need Assistance
Support for the MSP430 devices and the FET development tools is provided by the Texas Instruments
Product Information Center (PIC). Contact information for the PIC can be found on the TI web site at
www.ti.com/support. The Texas Instruments E2E Community support forums for the MSP430 provide
open interaction with peer engineers, TI engineers, and other experts. Additional device-specific
information can be found on the MSP430 web site.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can
radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable
protection against radio-frequency interference. Operation of this equipment in other environments may
cause interference with radio communications, in which case, the user is required to take whatever
measures may be required to correct this interference at his own expense.
12
Read This First
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
Chapter 1
SLAU278F – May 2009 – Revised December 2010
Get Started Now!
This chapter lists the contents of the FET and provides instruction on installing the hardware.
Topic
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
1.13
1.14
1.15
1.16
1.17
1.18
...........................................................................................................................
Flash Emulation Tool (FET) Overview ..................................................................
Kit Contents, MSP-FET430PIF .............................................................................
Kit Contents, eZ430-F2013 ..................................................................................
Kit Contents, eZ430-T2012 ..................................................................................
Kit Contents, eZ430-RF2500 ................................................................................
Kit Contents, eZ430-RF2500T ..............................................................................
Kit Contents, eZ430-RF2500-SEH ........................................................................
Kit Contents, eZ430-Chronos-xxx ........................................................................
Kit Contents, MSP-FET430UIF .............................................................................
Kit Contents, MSP-FET430xx ..............................................................................
Kit Contents, FET430Fx137RF900 ........................................................................
Kit Contents, MSP-TS430xx ................................................................................
Kit Contents, EM430Fx137RF900 .........................................................................
Hardware Installation, MSP-FET430PIF ................................................................
Hardware Installation, MSP-FET430UIF ................................................................
Hardware Installation, eZ430-F2013, eZ430-RF2500, eZ430-Chronos ........................
Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430Fx137RF900,
EM430Fx137RF900 ............................................................................................
Important MSP430 Documents on the CD-ROM and Web .......................................
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Get Started Now!
© 2009–2010, Texas Instruments Incorporated
Page
14
14
14
14
15
15
15
15
15
16
17
17
19
19
20
20
20
21
13
Flash Emulation Tool (FET) Overview
1.1
www.ti.com
Flash Emulation Tool (FET) Overview
TI offers several flash emulation tools according to different requirements.
Table 1-1. Flash Emulation Tool (FET) Features
eZ430-F2013
eZ430-RF2500
eZ430-Chronos
MSPFET430UIF
MSP-FET430PIF
X
X
Supports all MSP430 and CC430
flash-based devices ('F1xx, 'F2xx,
'F4xx, 'F5xx, 'F6xx, 'G2xx, 'L092)
Supports only 'F20xx, 'G2x01,
'G2x11, 'G2x21, 'G2x31
X
Supports only MSP430F20xx,
'F21x2, 'F22xx, 'G2x01, 'G2x11,
'G2x21, 'G2x31
X
Supports only
CC430F51xx, 'F61xx,
MSP430F20xx, 'F21x2, 'F22xx,
'F41x2, 'F54xx, 'F54xxA, 'F55xx
X
Allows fuse blow
X
Adjustable target supply voltage
X
Fixed 2.8-V target supply voltage
X
Fixed 3.6-V target supply voltage
X
X
X
X
X
X
X
X
4-wire JTAG
X
2-wire JTAG (1)
Application UART
Supported by CCE
X
X
Supported by CCS
X
X
Supported by IAR
X
X
(1)
(2)
1.2
X
X
X (2)
X
X
X
The 2-wire JTAG debug interface is also referred to as Spy-Bi-Wire (SBW) interface.
Not supported by default. Driver installation needs to be selected manually during the CCS installation process.
One
One
One
One
One
READ ME FIRST document
MSP430 CD-ROM
MSP-FET430PIF interface module
25-conductor cable
14-conductor cable
One QUICK START GUIDE document
One eZ430-F2013 CD-ROM
One eZ430-F2013 development tool including one MSP430F2013 target board
Kit Contents, eZ430-T2012
•
14
X
Kit Contents, eZ430-F2013
•
•
•
1.4
X
Kit Contents, MSP-FET430PIF
•
•
•
•
•
1.3
X
X
Three MSP430F2012-based target boards
Get Started Now!
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
Kit Contents, eZ430-RF2500
www.ti.com
1.5
Kit Contents, eZ430-RF2500
•
•
•
•
•
1.6
One eZ430-RF2500T target board
One AAA battery pack with expansion board (batteries included)
Kit Contents, eZ430-RF2500-SEH
•
•
•
•
•
1.8
QUICK START GUIDE document
eZ430-RF2500 CD-ROM
eZ430-RF2500 development tool including one MSP430F2274/CC2500 target board
eZ430-RF2500T target board
AAA battery pack with expansion board (batteries included)
Kit Contents, eZ430-RF2500T
•
•
1.7
One
One
One
One
One
One MSP430 development tool CD containing documentation and development software
One eZ430-RF USB debugging interface
Two eZ430-RF2500T wireless target boards
One SEH-01 solar energy harvester board
One AAA battery pack with expansion board (batteries included)
Kit Contents, eZ430-Chronos-xxx
'433, '868, '915
• One QUICK START GUIDE document
• One eZ430-Chronos CD-ROM
• One ez430-Chronos emulator
• One screwdriver
• Two spare screws
eZ430-Chronos-433:
– One 433-MHz eZ430-Chronos watch (battery included)
– One 433-MHz eZ430-Chronos access point
eZ430-Chronos-868:
– One 868-MHz eZ430-Chronos watch (battery included)
– One 868-MHz eZ430-Chronos access point
eZ430-Chronos-915:
– One 915-MHz eZ430-Chronos watch (battery included)
– One 915-MHz eZ430-Chronos access point
1.9
Kit Contents, MSP-FET430UIF
•
•
•
•
•
One
One
One
One
One
READ ME FIRST document
MSP430 CD-ROM
MSP-FET430UIF interface module
USB cable
14-conductor cable
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Get Started Now!
© 2009–2010, Texas Instruments Incorporated
15
Kit Contents, MSP-FET430xx
www.ti.com
1.10 Kit Contents, MSP-FET430xx
'U14, 'U092, 'U24, 'U28, 'U28A, 'U38, 'U23x0, 'U40, 'U40A, 'U48, 'U48B, 'U64, 'U64A, 'U64USB, 'U80,
'U80USB, 'U100, 'U100A, 'U100B, 'U5x100, 'U100USB
• One READ ME FIRST document
• One MSP430 CD-ROM
• One MSP-FET430UIF USB interface module. This is the unit that has a USB B-connector on one end
of the case, and a 2×7-pin male connector on the other end of the case.
• One USB cable
• One 32.768-kHz crystal from Micro Crystal (except MSP-FET430U24)
• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)
• One 14-Pin JTAG conductor cable
• One small box containing two MSP430 device samples (See table for Sample Type)
• One target socket module. To check the devices used for each board and a summary of the board,
see Table 1-2. MSP-TS430xx below is the target socket module for each MSP-FET430Uxx kit.
MSP-FET430U14: One MSP-TS430PW14 target socket module.
MSP-FET430U092: One MSP-TS430L092 target socket module with Active Cable.
MSP-FET430U24: One MSP-TS430PW24 target socket module.
MSP-FET430U28: One MSP-TS430PW28 target socket module.
MSP-FET430U28A: One MSP-TS430PW28A target socket module.
MSP-FET430U38: One MSP-TS430DA38 target socket module..
MSP-FET430U23x0: One MSP-TS430QFN23x0 (former name MSP-TS430QFN40) target socket
module.
MSP-FET430U40: One MSP-TS430RSB40 target socket module.
MSP-FET430U48: One MSP-TS430DL48 target socket module.
MSP-FET430U48B: One MSP-TS430RGZ48B target socket module.
MSP-FET430U64: One MSP-TS430PM64 target socket module.
MSP-FET430U64A: One MSP-TS430PM64A target socket module.
MSP-FET430U64B: One MSP-TS430RGC64B target socket module.
MSP-FET430U64USB: One MSP-TS430RGC64USB target socket module.
MSP-FET430U80: One MSP-TS430PN80 target socket module.
MSP-FET430U80A: One MSP-TS430PN80A target socket module.
MSP-FET430U80USB: One MSP-TS430PN80USB target socket module.
MSP-FET430U100: One MSP-TS430PZ100 target socket module.
MSP-FET430U100A: One MSP-TS430PZ100A target socket module
MSP-FET430U100B: One MSP-TS430PZ100B target socket module
MSP-FET430U5x100: One MSP-TS430PZ5x100 target socket module.
MSP-FET430U100USB: One MSP-TS430PZ100USB target socket module.
Consult the device data sheets for device specifications. Device errata can be found in the respective
device product folder on the web provided as a PDF document. Depending on the device, errata may also
be found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.
16
Get Started Now!
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
Kit Contents, FET430Fx137RF900
www.ti.com
1.11 Kit Contents, FET430Fx137RF900
•
•
•
•
•
•
•
•
•
•
•
•
One READ ME FIRST document
One legal notice
One MSP430 CD-ROM
One MSP-FET430UIF interface module
Two target socket module
MSP-FET430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on which
is soldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also present
on the PCB
MSP-FET430F6137RF900: Two EM430F6137RF900 target socket modules. This is the PCB on which
is soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also present
on the PCB
Two CC430EM battery packs
Four AAA batteries
Two 868-/915-MHz antennas
Two 32.768-kHz crystals
18 PCB 2x4-pin headers
One USB cable
One 14-Pin JTAG conductor cable
1.12 Kit Contents, MSP-TS430xx
'PW14, 'L092, 'PW24, 'DW28, 'PW28, 'PW28A, 'DA38, 'QFN32x0, 'RSB40, 'DL48, 'RGZ48B, 'PM64,
'PM64A, 'RGC64B, 'RGC64USB, 'PN80, 'PN80A, 'PN80USB, 'PZ100, 'PZ100A, 'PZ100B, 'PZ5x100,
'PZ100USB
• One READ ME FIRST document
• One MSP430 CD-ROM
• One 32.768-kHz crystal from Micro Crystal (except MSP-TS430PW24)
• One target socket module
• A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)
• One small box containing two MSP430 device samples (See table for Sample Type)
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Get Started Now!
© 2009–2010, Texas Instruments Incorporated
17
Kit Contents, MSP-TS430xx
www.ti.com
Table 1-2. Individual Kit Contents, MSP-TS430xx
18
Target Socket
Module
Socket Type
Supported Devices
MSP-TS430PW14
14-pin PW
(TSSOP ZIF)
MSP430F20xx, 'G2x01,
'G2x11, 'G2x21, 'G2x31
Included Devices
Headers / Comment
2 x MSP430F2013IPW
Four PCB 1×7-pin headers (two
male and two female
MSP-TS430L092
14-pin PW
(TSSOP ZIF)
MSP-TS430L092
2 x MSP430L092IPW
Four PCB 1×7-pin headers (two
male and two female). A
"Micro-MaTch" 10-pin female
connector is also present on the
PCB which connects the kit with an
'Active Cable' PCB, this 'Active
Cable' PCB is connected by 14 Pin
JTAG cable with the FET430UIF
MSP-TS430PW24
24-pin PW
(TSSOP ZIF)
MSP430AFE2xx
2 x MSP430AFE253IPW
Four PCB 1×12-pin headers (two
male and two female
MSP-TS430DW28
28-pin DW
(SSOP ZIF)
MSP-TS430PW28
MSP430F11x1, 'F11x2,
'F12x 'F12x2 'F21xx.
2 x MSP430F123IDW
Supports devices in 20and 28-pin DA packages
Four PCB 1×12-pin headers (two
male and two female
28-pin PW
(TSSOP ZIF)
MSP430F11x1, 'F11x2,
'F12x, 'F12x2, 'F21xx
2 x MSP430F2132IPW
Four PCB 1×12-pin headers (two
male and two female
MSP-TS430PW28A
28-pin PW
(TSSOP ZIF)
MSP430F20xx,
MSP430G2xxx in 14-,
20-, and 28-pin PW
packages
2x
MSP430G2452IPW28
Four PCB 1×12-pin headers (two
male and two female
MSP-TS430DA38
38-pin DA
(TSSOP ZIF)
MSP430F22xx
2 x MSP430F2274IDA
Four PCB 1×19-pin headers (two
male and two female
MSPTS430QFN23x0
40-pin RHA
(QFN ZIF)
MSP430F23x0
2 x MSP430F2370IRHA
Eight PCB 1×10-pin headers (four
male and four female
MSP-TS430RSB40
40-pin RSB
(QFN ZIF)
MSP430F51x1, 'F51x2
2 x MSP430F5172IRSB
Eight PCB 1×10-pin headers (four
male and four female
MSP-TS430RHA40A
40-pin RHA
(QFN ZIF)
MSP430FR572x,
'FR573x
2x
MSP430FR5739IRHA
Eight PCB 1×10-pin headers (four
male and four female
MSP-TS430DL48
48-pin DL
(TSSOP ZIF)
MSP430F42x0
2 x MSP430F4270IDL
Four PCB 2×12-pin headers (two
male and two female
MSP-TS430RGZ48B
48-pin RGZ
(QFN ZIF)
MSP430F534x
2 x MSP430F5342IRGZ
Eight PCB 1×12-pin headers (four
male and four female
MSP-TS430PM64
64-pin PM
(QFP ZIF)
MSP430F13x, 'F14x,
'F14x1, 'F15x, 'F16x(1),
'F23x, 'F24x, 'F24xx,
'F261x, 'F41x, 'F42x(A),
'FE42x(A), 'FE42x2,
'FW42x
TS Kit: 2 x
MSP430F2618IPM;
FET Kit: 2 x
MSP430F417IPM and 2
x MSP430F169IPM
Eight PCB 1×16-pin headers (four
male and four female
MSP-TS430PM64A
64-pin PM
(QFP ZIF)
MSP430F41x2
2 x MSP430F4152IPM
Eight PCB 1×16-pin headers (four
male and four female
MSPTS430RGC64B
64-pin RGC
(QFN ZIF)
MSP430F530x
2 x MSP430F5310IRGC
Eight PCB 1×16-pin headers (four
male and four female
MSPTS430RGC64USB
64-pin RGC
(QFN ZIF)
MSP430F550x, 'F551x,
'F552x
2 x MSP430F5510IRGC
and/or 2 x
MSP430F5528IRGC
Eight PCB 1×16-pin headers (four
male and four female
MSP-TS430PN80
80-pin PN
(QFP ZIF)
MSP430F241x, 'F261x,
'F43x, 'F43x1, 'FG43x,
'F47x, 'FG47x
2 x MSP430FG439IPN
Eight PCB 1×20-pin headers (four
male and four female
MSP-TS430PN80A
80-pin PN
(QFP ZIF)
MSP430F532x
2 x MSP430F5329IPN
Eight PCB 1×20-pin headers (four
male and four female
MSPTS430PN80USB
80-pin PN
(QFP ZIF)
MSP430F552x, 'F551x
2 x MSP430F5529IPN
Eight PCB 1×20-pin headers (four
male and four female
MSP-TS430PZ100
100-pin PZ
(QFP ZIF)
MSP430F43x, 'F43x1,
'F44x, 'FG461x, 'F47xx
2 x MSP430FG4619IPZ
Eight PCB 1×25-pin headers (four
male and four female
MSP-TS430PZ100A
100-pin PZ
(QFP ZIF)
MSP430F471xx
2 x MSP430F47197IPZ
Eight PCB 1×25-pin headers (four
male and four female
Get Started Now!
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
Kit Contents, EM430Fx137RF900
www.ti.com
Table 1-2. Individual Kit Contents, MSP-TS430xx (continued)
Target Socket
Module
Socket Type
Supported Devices
MSP-TS430PZ100B
100-pin PZ
(QFP ZIF)
MSP430F67xx
MSPTS430PZ5x100
MSPTS430PZ100USB
Included Devices
Headers / Comment
2 x MSP430F6733IPZ
Eight PCB 1×25-pin headers (four
male and four female
100-pin PZ
(QFP ZIF)
MSP430F543x,MSP430
2 x MSP430F5438IPZ
BT5190IPZ
Eight PCB 1×25-pin headers (four
male and four female
100-pin PZ
(QFP ZIF)
MSP430F663x, 'F563x
Eight PCB 1×25-pin headers (four
male and four female
2 x MSP430F6638IPZ
See the device data sheets for device specifications. Device errata can be found in the respective device
product folder on the web provided as a PDF document. Depending on the device, errata may also be
found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.
1.13 Kit Contents, EM430Fx137RF900
•
•
•
•
•
•
•
•
•
One READ ME FIRST document
One legal notice
One MSP430 CD-ROM
Two target socket module
MSP-EM430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on which
is soldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also present
on the PCB
MSP-EM430F6137RF900: Two EM430F6137RF900 target socket modules. This is the PCB on which
is soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also present
on the PCB
Two CC430EM battery packs
Four AAA batteries
Two 868-/915-MHz antennas
Two 32.768-kHz crystals
18 PCB 2×4-pin headers
1.14 Hardware Installation, MSP-FET430PIF
Follow these steps to install the hardware for the MSP-FET430PIF tools:
1. Use the 25-conductor cable to connect the FET interface module to the parallel port of the PC. The
necessary driver for accessing the PC parallel port is installed automatically during CCE/CCS or IAR
Embedded Workbench installation. Note that a restart is required after the CCE/CCS or IAR
Embedded Workbench installation for the driver to become active.
2. Use the 14-conductor cable to connect the parallel-port debug interface module to a target board, such
as an MSP-TS430xxx target socket module. Module schematics and PCBs are shown in Appendix B.
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Get Started Now!
© 2009–2010, Texas Instruments Incorporated
19
Hardware Installation, MSP-FET430UIF
www.ti.com
1.15 Hardware Installation, MSP-FET430UIF
Follow these steps to install the hardware for the MSP-FET430UIF tool:
1. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FET
should be recognized, as the USB device driver should have been installed with the IDE (Code
Composer Essentials/Studio or IAR Embedded Workbench).. If the install wizard starts, follow the
prompts and point the wizard to the driver files.
The default location for CCE is C:\Program Files\Texas Instruments\MSP430_USB_DRIVERS_v3\.
The default location for CCS is C:\Program Files\Texas Instruments\ccs4\emulation\drivers\msp430\.
The default location for IAR Embedded Workbench is <Installation Root>\Embedded Workbench x.x\
430\bin\WinXP.
Detailed driver installation instructions can be found in Appendix C.
2. After connecting to a PC, the USB FET performs a self-test during which the red LED flashes for
approximately two seconds. If the self-test passes successfully, the green LED stays on.
3. Use the 14-conductor cable to connect the USB-FET interface module to a target board, such as an
MSP-TS430xxx target socket module.
4. Ensure that the MSP430 device is securely seated in the socket, and that its pin 1 (indicated with a
circular indentation on the top surface) aligns with the "1" mark on the PCB.
5. Compared to the parallel-port debug interface, the USB FET has additional features including JTAG
security fuse blow and adjustable target VCC (1.8 V to 3.6 V). Supply the module with up to 100 mA.
1.16 Hardware Installation, eZ430-F2013, eZ430-RF2500, eZ430-Chronos
Follow these steps to install the hardware for the eZ430-F2013 and eZ430-RF2500 tools:
1. Connect the eZ430-F2013, eZ430-RF2500 and eZ430-Chronos to a USB port of the PC.
2. The USB FET should be recognized by the PC. The USB device driver should have been installed with
the IDE (Code Composer Studio or IAR Embedded Workbench - Code Composer Essentials only
supports eZ430-F2013 and eZ430-RF2500). If the install wizard starts, follow the prompts and point
the wizard to the driver files.
The default location for CCE is C:\Program Files\Texas Instruments\MSP430_USB_DRIVERS_v3\.
The default location for CCS is C:\Program Files\Texas Instruments\ccs4\emulation\drivers\msp430\.
The default location for IAR Embedded Workbench is <Installation Root>\Embedded Workbench x.x\
430\bin\WinXP.
Detailed driver installation instructions can be found in Appendix C.
1.17 Hardware Installation, MSP-FET430Uxx, MSP-TS430xxx, FET430Fx137RF900,
EM430Fx137RF900
MSP-FET430Uxx – 'U14, 'U092, ,U24, 'U28, 'U28A, 'U38, 'U23x0, 'U40, 'U40A, 'U48, 'U48B, 'U64,
'U64A, 'U64USB, 'U80, 'U80USB, 'U100, 'U100A, 'U100B, 'U5x100, 'U100USB
TS430xxx – 'PW14, 'L092, 'PW24, 'DW28, 'PW28, 'PW28A, 'DA38, 'QFN32x0, 'RSB40, 'DL48,
'RGZ48B, 'PM64, 'PM64A, 'RGC64B, 'RGC64USB, 'PN80, 'PN80A, 'PN80USB, 'PZ100, 'PZ100A,
'PZ100B, 'PZ5x100, 'PZ100USB
Follow these steps to install the hardware for the MSP-FET430Uxx and MSP-TS430xxx tools:
1. Connect the MSP-FET430PIF or MSP-FET430UIF debug interface to the appropriate port of the PC.
Use the 14-conductor cable to connect the FET interface module to the supplied target socket module.
2. Ensure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a
circular indentation on the top surface) aligns with the "1" mark on the PCB.
3. Ensure that the two jumpers (LED and VCC) near the 2×7-pin male connector are in place. Illustrations
of the target socket modules and their parts are found in Appendix B.
NOTE: Regarding 'U38, see FAQ Hardware #2 in Appendix A.
20
Get Started Now!
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
www.ti.com
Important MSP430 Documents on the CD-ROM and Web
1.18 Important MSP430 Documents on the CD-ROM and Web
The primary sources of MSP430 information are the device-specific data sheet and user's guide. The most
up-to-date versions of these documents that are available at the time of production are provided on the
CD-ROM included with this tool. The MSP430 web site (www.ti.com/msp430) contains the most recent
version of these documents.
PDF documents describing the CCS tools (CCS IDE, the assembler, the C compiler, the linker, and the
librarian) are in the msp430\documentation folder. A Code Composer Studio specific Wiki page (FAQ) is
available, and the Texas Instruments E2E Community support forums for the MSP430 and Code
Composer Studio v4 provide additional help besides the product help and Welcome page.
PDF documents describing the IAR tools (Workbench/C-SPY, the assembler, the C compiler, the linker,
and the librarian) are in the common\doc and 430\doc folders. Supplements to the documents (i.e., the
latest information) are available in HTML format in the same directories. 430\doc\readme_start.htm
provides a convenient starting point for navigating the IAR documentation.
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Get Started Now!
© 2009–2010, Texas Instruments Incorporated
21
22
Get Started Now!
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
Chapter 2
SLAU278F – May 2009 – Revised December 2010
Design Considerations for In-Circuit Programming
This chapter presents signal requirements for in-circuit programming of the MSP430.
Topic
2.1
2.2
2.3
...........................................................................................................................
Page
Signal Connections for In-System Programming and Debugging ............................ 24
External Power .................................................................................................. 27
Bootstrap Loader (BSL) ..................................................................................... 27
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Design Considerations for In-Circuit Programming
© 2009–2010, Texas Instruments Incorporated
23
Signal Connections for In-System Programming and Debugging
2.1
www.ti.com
Signal Connections for In-System Programming and Debugging
MSP-FET430PIF, MSP-FET430UIF, MSP-GANG430, MSP-PRGS430
With the proper connections, the debugger and an FET hardware JTAG interface (such as the
MSP-FET430PIF and MSP-FET430UIF) can be used to program and debug code on the target board. In
addition, the connections also support the MSP-GANG430 or MSP-PRGS430 production programmers,
thus providing an easy way to program prototype boards, if desired.
Figure 2-1 shows the connections between the 14-pin FET interface module connector and the target
device required to support in-system programming and debugging for 4-wire JTAG communication.
Figure 2-2 shows the connections for 2-wire JTAG mode (Spy-Bi-Wire). While 4-wire JTAG mode is
supported on all MSP430 devices, 2-wire JTAG mode is available on selected devices only. See the CCS
User's Guide for MSP430 (SLAU157) or IAR for MSP430 User's Guide (SLAU138) for information on
which interface method can be used on which device.
The connections for the FET interface module and the MSP-GANG430 or MSP-PRGS430 are identical.
Both the FET interface module and MSP-GANG430 can supply VCC to the target board (via pin 2). In
addition, the FET interface module and MSP-GANG430 have a VCC-sense feature that, if used, requires
an alternate connection (pin 4 instead of pin 2). The VCC-sense feature senses the local VCC present on the
target board (i.e., a battery or other local power supply) and adjusts the output signals accordingly. If the
target board is to be powered by a local VCC, then the connection to pin 4 on the JTAG should be made,
and not the connection to pin 2. This utilizes the VCC-sense feature and prevents any contention that might
occur if the local on-board VCC were connected to the VCC supplied from the FET interface module or the
MSP-GANG430. If the VCC-sense feature is not necessary (i.e., the target board is to be powered from the
FET interface module or the GANG430) the VCC connection is made to pin 2 on the JTAG header and no
connection is made to pin 4. Figure 2-1 and Figure 2-2 show a jumper block that supports both scenarios
of supplying VCC to the target board. If this flexibility is not required, the desired VCC connections may be
hard-wired eliminating the jumper block. Pins 2 and 4 must not be connected simultaneously.
Note that in 4-wire JTAG communication mode (see Figure 2-1), the connection of the target RST signal
to the JTAG connector is optional when using devices that support only 4-wire JTAG communication
mode. However, when using devices that support 2-wire JTAG communication mode in 4-wire JTAG
mode, the RST connection must be made. The MSP430 development tools and device programmers
perform a target reset by issuing a JTAG command to gain control over the device. However, if this is
unsuccessful, the RST signal of the JTAG connector may be used by the development tool or device
programmer as an additional way to assert a device reset.
24
Design Considerations for In-Circuit Programming
© 2009–2010, Texas Instruments Incorporated
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Signal Connections for In-System Programming and Debugging
www.ti.com
VCC
J1 (see Note A)
VCC/AVCC/DVCC
J2 (see Note A)
R1
47 kW
(see Note B)
C2
10 µF
C3
0.1 µF
MSP430Fxxx
JTAG
VCC TOOL
VCC TARGET
TEST/VPP
RST/NMI
2
1
4
3
6
5
8
7
10
9
12
11
14
13
TDO/TDI
TDO/TDI
TDI/VPP
TDI/VPP
TMS
TMS
TCK
TCK
GND
RST (see Note D)
TEST/VPP (see Note C)
C1
10 nF/2.2 nF
(see Notes B and E)
VSS/AVSS/DVSS
A
Make either connection J1 in case a local target power supply is used or connection J2 to power target from the
debug/programming adapter.
B
The RST/NMI pin R1/C1 configuration is device family dependent. See the respective MSP430 family user's guide for
the recommended configuration.
C
The TEST pin is available only on MSP430 family members with multiplexed JTAG pins. See the device-specific data
sheet to determine if this pin is available.
D
The connection to the JTAG connector RST pin is optional when using 4-wire JTAG communication mode
capable-only devices and not required for device programming or debugging. However, this connection is required
when using 2-wire JTAG communication mode capable devices in 4-wire JTAG mode.
E
When using 2-wire JTAG communication capable devices in 4-wire JTAG mode, the upper limit for C1 should not
exceed 2.2 nF. This applies to both TI FET interface modules (LPT/USB FET).
Figure 2-1. Signal Connections for 4-Wire JTAG Communication
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Design Considerations for In-Circuit Programming
© 2009–2010, Texas Instruments Incorporated
25
Signal Connections for In-System Programming and Debugging
www.ti.com
VCC
J1 (see Note A)
VCC/AVCC/DVCC
J2 (see Note A)
R1
47 kW
(see Note B)
C2
10 µF
C3
0.1 µF
MSP430Fxxx
JTAG
VCC TOOL
VCC TARGET
TEST/VPP
2
1
4
3
6
5
8
7
10
9
12
11
14
13
TDO/TDI
RST/NMI/SBWTDIO
TCK
GND
R2
330 W
(see Note C)
TEST/SBWTCK
C1
2.2 nF
(see Note B)
VSS/AVSS/DVSS
A
Make either connection J1 in case a local target power supply is used or connection J2 to power target from the
debug/programming adapter.
B
The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during
JTAG access and that any capacitance attached to this signal may affect the ability to establish a connection with the
device. The upper limit for C1 is 2.2 nF when using current TI FET interface modules (USB FET).
C
R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow voltage that is supplied by the
TEST/VPP pin during the fuse blow process. If fuse blow functionality is not needed, R2 is not required (populate
0 ?), and do not connect TEST/VPP to TEST/SBWTCK.
Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire)
26
Design Considerations for In-Circuit Programming
© 2009–2010, Texas Instruments Incorporated
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
External Power
www.ti.com
2.2
External Power
The PC parallel port can source a limited amount of current. Because of the ultra-low-power requirement
of the MSP430, a standalone FET does not exceed the available current. However, if additional circuitry is
added to the tool, this current limit could be exceeded. In this case, external power can be supplied to the
tool via connections provided on the target socket modules. See the schematics and pictorials of the
target socket modules in Appendix B to locate the external power connectors.
The MSP-FET430UIF can supply targets with up to 100 mA through pin 2 of the 14-pin connector. VCC for
the target can be selected between 1.8 V and 5 V in steps of 0.1 V. Alternatively, the target can be
supplied externally. In this case, the external voltage should be connected to pin 4 of the 14-pin connector.
The MSP-FET430UIF then adjusts the level of the JTAG signals to external VCC automatically. Only pin 2
(MSP-FET430UIF supplies target) or pin 4 (target is externally supplied) must be connected; not both at
the same time.
When a target socket module is powered from an external supply, the external supply powers the device
on the target socket module and any user circuitry connected to the target socket module, and the FET
interface module continues to be powered from the PC via the parallel port. If the externally supplied
voltage differs from that of the FET interface module, the target socket module must be modified so that
the externally supplied voltage is routed to the FET interface module (so that it may adjust its output
voltage levels accordingly). See the target socket module schematics in Appendix B.
2.3
Bootstrap Loader (BSL)
The JTAG pins provide access to the flash memory of the MSP430Fxxx devices. On some devices, these
pins are shared with the device port pins, and this sharing of pins can complicate a design (or sharing may
not be possible). As an alternative to using the JTAG pins, most MSP430Fxxx devices contain a program
(a "bootstrap loader") that permits the flash memory to be erased and programmed using a reduced set of
signals. The MSP430 Programming Via the Bootstrap Loader User's Guide (SLAU319) describes this
interface. TI does not produce a BSL tool. However, customers can easily develop their own BSL tools
using the information in the application reports, or BSL tools can be purchased from third parties. See the
MSP430 web site for the application reports and a list of MSP430 third-party tool developers.
TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind (i.e., TI suggests
providing access to these signals via, for example, a header).
See FAQ Hardware #11 for a second alternative to sharing the JTAG and port pins.
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Design Considerations for In-Circuit Programming
© 2009–2010, Texas Instruments Incorporated
27
28
Design Considerations for In-Circuit Programming
© 2009–2010, Texas Instruments Incorporated
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Appendix A
SLAU278F – May 2009 – Revised December 2010
Frequently Asked Questions and Known Issues
This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware.
Topic
A.1
A.2
...........................................................................................................................
Page
Hardware FAQs ................................................................................................. 30
Known Issues ................................................................................................... 32
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Frequently Asked Questions and Known Issues
© 2009–2010, Texas Instruments Incorporated
29
Hardware FAQs
A.1
www.ti.com
Hardware FAQs
1. The state of the device (CPU registers, RAM memory, etc.) is undefined following a reset.
Exceptions to the above statement are that the PC is loaded with the word at 0xFFFE (i.e., the reset
vector), the status register is cleared, and the peripheral registers (SFRs) are initialized as documented
in the device family user's guides. The CCE/CCS debugger and C-SPY reset the device after
programming it.
2. MSP430F22xx Target Socket Module (MSP-TS430DA38) – Important Information
Due to the large capacitive coupling introduced by the device socket between the adjacent signals
XIN/P2.6 (socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb the
LFXT1 low-frequency crystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire
(2-wire) JTAG configuration and only to the period while a debug session is active.
Workarounds:
• Use the 4-wire JTAG mode debug configuration instead of the Spy-Bi-Wire (2-wire) JTAG
configuration. This can be achieved by placing jumpers JP4 through JP9 accordingly.
• Use the debugger option "Run Free" that can be selected from the Advanced Run drop-down
menu (at top of Debug View). This prevents the debugger from accessing the MSP430 while the
application is running. Note that, in this mode, a manual halt is required to see if a breakpoint was
hit. See the IDE documentation for more information on this feature.
• Use an external clock source to drive XIN directly.
3. With current interface hardware and software, there is a weakness when adapting target boards
that are powered externally. This leads to an accidental fuse check in the MSP430. This is valid for
PIF and UIF but is mainly seen on UIF. A solution is being developed.
Workarounds:
• Connect RST/NMI pin to JTAG header (pin 11), LPT/USB tools are able to pull the RST line, which
also resets the device internal fuse logic.
• Use the debugger option "Release JTAG On Go" that can be selected from the IDE drop-down
menu. This prevents the debugger from accessing the MSP430 while the application is running.
Note that in this mode, a manual halt is required to see if a breakpoint was hit. See the IDE
documentation for more information on this feature.
• Use an external clock source to drive XIN directly.
4. The 14-conductor cable connecting the FET interface module and the target socket module must not
exceed 8 inches (20 centimeters) in length.
5. The signal assignment on the 14-conductor cable is identical for the parallel port interface and the
USB FET.
6. To utilize the on-chip ADC voltage references, C6 (10 ?F, 6.3 V, low leakage) must be installed on
the target socket module.
7. To utilize the charge pump on the devices with LCD+ Module, C4 (10 ?F, low leakage) must be
installed on the target socket module.
8. Crystals/resonators Q1 and Q2 (if applicable) are not provided on the target socket module. For
MSP430 devices that contain user-selectable loading capacitors, the effective capacitance is the
selected capacitance plus 3 pF (pad capacitance) divided by two.
9. Crystals/resonators have no effect upon the operation of the tool and the CCE/CCS debugger or
C-SPY (as any required clocking/timing is derived from the internal DCO/FLL).
10. On 20-pin and 28-pin devices with multiplexed port/JTAG pins (P1.4 to P1.7), to use these pin in
their port capacity:
For CCE/CCS: "Run Free" (in Run pull-down menu at top of Debug View) must be selected.
For C-SPY: "Release JTAG On Go" must be selected.
11. As an alternative to sharing the JTAG and port pins (on 20 and 28 pin devices), consider using
an MSP430 device that is a "superset" of the smaller device. A very powerful feature of the
MSP430 is that the family members are code and architecturally compatible, so code developed on
one device (for example, one without shared JTAG and port pins) ports effortlessly to another
(assuming an equivalent set of peripherals).
30
Frequently Asked Questions and Known Issues
© 2009–2010, Texas Instruments Incorporated
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware FAQs
www.ti.com
12. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI.
Customers should erase the information memory before its first use. Main memory of packaged
devices is blank when the device is delivered from TI.
13. The device current increases by approximately 10 ?A when a device in low-power mode is
stopped [using Halt (CCE/CCS) or Esc (C-SPY)] and then the low-power mode is restored [using
Run (CCE/CCS) or Go (C-SPY)]. This behavior appears to happen on all devices except the
MSP430F12x.
14. The following ZIF sockets are used in the FET tools and target socket modules:
• 14-pin device (PW package): Enplas OTS-14-065-01
• 14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146
• 24-pin package (PW package): Enplas OTS-24(28)-0.65-02
• 28-pin device (DW package): Wells-CTI 652 D028
• 28-pin device (PW package): Enplas OTS-28-0.65-01
• 38-pin device (DA package): Yamaichi IC189-0382-037
• 40-pin device (RHA package): Enplas QFN-40B-0.5-01
• 40-pin device (RSB package): Enplas QFN-40B-0.4
• 48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001
• 48-pin device (DL package): Yamaichi IC51-0482-1163
• 64-pin device (PM package): Yamaichi IC51-0644-807
• 64-pin device (RGC package): Yamaichi QFN11T064-006
• 80-pin device (PN package): Yamaichi IC201-0804-014
• 100-pin device (PZ package): Yamaichi IC201-1004-008
Enplas: www.enplas.com
Wells-CTI: www.wellscti.com
Yamaichi: www.yamaichi.us
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Frequently Asked Questions and Known Issues
© 2009–2010, Texas Instruments Incorporated
31
Known Issues
A.2
www.ti.com
Known Issues
MSP-FET430PIF
Some PCs do not supply 5 V through the parallel port
Problem Description
Device identification problems with modern PCs, because the parallel port often does not
deliver 5 V as was common with earlier hardware.
1. When connected to a laptop, the test signal is clamped to 2.5 V.
2. When the external VCC becomes less than 3 V, up to 10 mA is flowing in the adapter
via pin 4 (sense).
Solution
Measure the voltage level of the parallel port. If it is too low, provide external 5 V to the
VCC pads of the interface. The jumper on a the target socket must be switched to
external power.
MSP-FET430UIF
Current detection algorithm of the UIF firmware
Problem Description
If high current is detected, the ICC Monitor algorithm stays in a loop of frequently
switching on and off the target power supply. This power switching puts some MSP430
devices such as the MSP430F5438 in a state that requires a power cycle to return the
device to JTAG control.
A side issue is that if the UIF firmware has entered this switch on / switch off loop, it is
not possible to turn off the power supply to the target by calling MSP430_VCC(0). A
power cycle is required to remove the device from this state.
Solution
32
IAR KickStart and Code Composer Essentials that have the MSP430.dll version
2.04.00.003 and higher do not show this problem. Update the software development tool
to this version or higher to update the MSP-FET430UIF firmware.
Frequently Asked Questions and Known Issues
© 2009–2010, Texas Instruments Incorporated
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Appendix B
SLAU278F – May 2009 – Revised December 2010
Hardware
This appendix contains information relating to the FET hardware, including schematics, PCB pictorials,
and bills of materials. All other tools, such as the eZ430 series, are described in separate product-specific
user's guides.
Topic
...........................................................................................................................
B.1
B.2
B.3
B.4
B.5
B.6
B.7
B.8
B.9
B.10
B.11
B.12
B.13
B.14
B.15
B.16
B.17
B.18
B.19
B.20
B.21
B.22
B.23
B.24
B.25
B.26
B.27
B.28
B.29
Page
MSP-TS430PW14 ............................................................................................... 34
MSP-TS430L092 ................................................................................................ 37
MSP-TS430L092 Active Cable ............................................................................. 40
MSP-TS430PW24 ............................................................................................... 43
MSP-TS430DW28 ............................................................................................... 46
MSP-TS430PW28 ............................................................................................... 49
MSP-TS430PW28A ............................................................................................. 52
MSP-TS430DA38 ............................................................................................... 55
MSP-TS430QFN23x0 .......................................................................................... 58
MSP-TS430RSB40 ............................................................................................. 61
MSP-TS430RHA40A ........................................................................................... 64
MSP-TS430DL48 ................................................................................................ 67
MSP-TS430RGZ48B ........................................................................................... 70
MSP-TS430PM64 ............................................................................................... 73
MSP-TS430PM64A ............................................................................................. 76
MSP-TS430RGC64B ........................................................................................... 79
MSP-TS430RGC64USB ....................................................................................... 82
MSP-TS430PN80 ............................................................................................... 86
MSP-TS430PN80A ............................................................................................. 89
MSP-TS430PN80USB ......................................................................................... 91
MSP-TS430PZ100 .............................................................................................. 96
MSP-TS430PZ100A ............................................................................................ 99
MSP-TS430PZ100B .......................................................................................... 102
MSP-TS430PZ5x100 ......................................................................................... 105
MSP-TS430PZ100USB ...................................................................................... 107
EM430F5137RF900 ........................................................................................... 112
EM430F6137RF900 ........................................................................................... 116
MSP-FET430PIF ............................................................................................... 120
MSP-FET430UIF ............................................................................................... 122
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
33
MSP-TS430PW14
B.1
www.ti.com
MSP-TS430PW14
Figure B-1. MSP-TS430PW14 Target Socket Module, Schematic
34
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PW14
www.ti.com
Connector J3
External power connector
Jumper J5 to 'ext'
LED connected to P1.0
Jumpers J7 to J12
Close 1-2 to debug in
Spy-Bi-Wire Mode.
Close 2-3 to debug in
4-wire JTAG mode.
Jumper J4
Open to disconnect LED
Orient Pin 1 of
MSP430 device
Jumper J6
Open to measure current
Figure B-2. MSP-TS430PW14 Target Socket Module, PCB
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
35
MSP-TS430PW14
www.ti.com
Table B-1. MSP-TS430PW14 Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C7
1
10uF/10V, Tantal Size B 511-1463-2-ND
3
C3, C5
1
100nF, SMD0805
4
C8
0
2.2nF, SMD0805
5
D1
1
green LED, SMD0603
475-1056-2-ND
6
J1, J2
0
7-pin header, TH
"SAM1029-07NDSAM1213-07-ND"
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder: Header: Receptacle
7
J3, J5, J7,
J8, J9, J10,
J11, J12
8
3-pin header, male, TH
SAM1035-03-ND
Place jumpers on headers J5, J7, J8,
J9, J10, J11, J12; Pos 1-2
8
J4, J6
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
Jumper
15-38-1024-ND
Place on: J5, J7-J12; Pos 1-2
9
36
Description
DigiKey Part No.
Comment
DNP
478-3351-2-ND
DNP: C3
DNP
10
JTAG
1
14-pin connector, male,
TH
HRP14H-ND
12
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
DNP: keep vias free of solder
12.5pF
13
R2, R3
2
330 Ω, SMD0805
541-330ATR-ND
15
R5
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: OTS-14-0.65-01
17
PCB
1
56 x 53 mm
18
Adhesive
plastic feet
4
about 6mm width, 2mm
height
19
MSP430
2
MSP430F2013IPW
Manuf.: Enplas
2 layers
e.g., 3M Bumpons Part
No. SJ-5302
Hardware
Apply to corners at bottom side
DNP: enclosed with kit, supplied by TI
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430L092
www.ti.com
B.2
MSP-TS430L092
Figure B-3. MSP-TS430L092 Target Socket Module, Schematic
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
37
MSP-TS430L092
www.ti.com
Settings of the MSP-TS430L092 Target Socket
Figure B-4 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning is
recommended:
• JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read.
• JP2 and JP3 connect device supply with boost converter. They can be opened to measure device
current consumption. For default operation, they should be closed.
Figure B-4. MSP-TS430L092 Target Socket Module, PCB
38
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430L092
www.ti.com
Table B-2. MSP-TS430L092 Bill of Materials
Pos.
Ref Des No.
No. Per
Board
1
C1, C2
2
330nF, SMD0603
2
C5
1
100n, SMD0603
3
C6
1
10u, SMD0805
4
C10
1
100n, SMD0603
5
EEPROM1
1
M95512 SO08 (SO8)
7
J1, J2
2
Description
DigiKey Part No.
ST Micro M95160R
Comment
Digikey: 497-8688-1-ND
DNP: headers and
receptacles enclosed with kit.
Keep vias free of solder.
7-pin header, TH
SAM1213-07-ND
: Header
SAM1035-07-ND
: Receptacle
8
J3
1
3-pin header, male, TH
SAM1035-03-ND
9
J4, J5
2
FE4L, FE4H
4 pol. Stiftreihe
11
J13
1
MICRO_STECKV_10
12
JP1, JP2,JP3
3
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
15
L1
1
33uH, SMD0806
LQH2MCN330K02L
Farnell: 151-5557
16
LED1, LED4
2
LEDCHIPLED_0603
17
Q2
1
BC817-16LT1SMD
18
R0, R6, R7
3
2K7, SMD0603
19
R1
1
1k, SMD0603
20
R2
1
47k, SMD0603
21
R4,R5, R8,
R10, RC, RD
6
10k, SMD0603
22
RA
1
3.9k, SMD0603
23
RB
1
6.8k, SMD0603
24
U1
1
14 Pin Socket IC189-0142-146
Manuf. Yamaichi
22
MSP430
2
MSP430L092PWR
DNP: enclosed with kit. Is
supplied by TI
DNP; Keep vias free of
solder.
Reichelt:
MicroMaTch-Connector: MM
FL 10G
Farnell: 1686065
BC817-16LT1SMD
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
SOT23-BEC
Hardware
© 2009–2010, Texas Instruments Incorporated
39
MSP-TS430L092 Active Cable
B.3
www.ti.com
MSP-TS430L092 Active Cable
Figure B-5. MSP-TS430L092 Active Cable Target Socket Module, Schematic
40
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430L092 Active Cable
www.ti.com
Figure B-6 shows the PCB layout for the Active Cable. The following pinning is possible:
• JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-3.
Table B-3. MSP-TS430L092 JP1 Settings
•
Jumper 1
Jumper 2
Description
Off
Off
The active cable has no power and does not function.
Off
On
The active cable receives power from target socket. For this option, the
target socket must have its own power supply.
On
Off
The active cable receives power from the JTAG connector.
On
On
The JTAG connector powers the active cable and the target socket. For
this option, the target socket must not have its own power source, as this
would cause a not defined state.
JP2 is for reset. For the standard MSP-TS430L092, this jumper must be set. It sets the reset pin to
high and can also control it. Without this jumper on the MSP-TS430L092, reset is set to zero.
Figure B-6. MSP-TS430L092 Active Cable Target Socket Module, PCB
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
41
MSP-TS430L092 Active Cable
www.ti.com
Table B-4. MSP-TS430L092 Active Cable Bill of Materials
42
Pos.
Ref Des
No. Per
Board
1
C1, C3, C5,
C6
4
100nF, SMD0603
2
C2, C4
2
1uF, SMD0805
3
R1, R10
2
10K, SMD0603
4
R2
1
4K7, SMD0603
5
R5, R6, R7,
R9
4
100, SMD0603
6
R8
1
680k, SMD0603
7
R11, R15
2
1K, SMD0603
8
R12
0
SMD0603
DNP
9
R13
0
SMD0603
DNP
10
R14
1
0, SMD0603
11
IC1
1
SN74AUC1G04DBVR
12
IC2, IC3, IC4
3
SN74AUC2G125DCTR
Description
DigiKey Part No.
Comment
Manu: TI
Manu: TI
13
J2
1
MICRO_STECKV_10
Reichelt:
MicroMaTch-Connector: MM
FL 10G
14
JP1
1
2x2 Header
JP2Q
Put jumper on Position 1 and
2. Do not mix direction.
15
JP2
1
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
16
JTAG
1
14-pin connector, male, TH
HRP14H-ND
Digi-Key:
BC817-25LT1GOSCT-ND
SOT23-5
17
Q1
1
BC817-25LT1SMD,
SOT23-BEC
18
U1, U2
2
TLVH431IDBVR
Hardware
Manu: TI
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PW24
www.ti.com
B.4
MSP-TS430PW24
Figure B-7. MSP-TS430PW24 Target Socket Module, Schematic
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
43
MSP-TS430PW24
www.ti.com
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper JP2
Open to measure current
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
D1 LED connected to P1.0
Jumper JP3
Open to disconnect LED
Figure B-8. MSP-TS430PW24 Target Socket Module, PCB
44
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PW24
www.ti.com
Table B-5. MSP-TS430PW24 Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C5
1
2.2nF, SMD0805
3
C3, C7
2
10uF/10V, SMD0805
4
C4, C6, C8
3
100nF, SMD0805
478-3351-2-ND
5
D1
1
green LED, SMD0805
P516TR-ND
6
J1, J2
0
12-pin header, TH
"SAM1029-07NDSAM1213-07-ND"
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder. (Header & Receptacle)
7
J5, JP1,
JP4, JP5,
JP6, JP7,
JP8, JP9
8
3-pin header, male, TH
SAM1035-03-ND
Place jumper on 1-2 of JP4-JP9
Place on 1-2 on JP1
8
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
Jumper
15-38-1024-ND
see Pos 7 an 8
HRP14H-ND
9
Description
DigiKey Part No.
Comment
DNP
10
JTAG
1
14-pin connector, male,
TH
11
Q1
0
Crystal
12
R1, R7
2
330 Ω, SMD0805
541-330ATR-ND
13
R5, R6,
R8, R9,
2
0 Ohm, SMD0805
541-000ATR-ND
14
R4
1
47k Ohm, SMD0805
541-47000ATR-ND
Manuf.: Enplas
2 layers
15
U1
1
Socket: OTS
24(28)-065-02-00
16
PCB
1
68.5 x 61 mm
17
Adhesive
plastic feet
4
about 6mm width, 2mm
height
18
MSP430
2
MSP430AFE2xx
DNP: keep vias free of solder
e.g., 3M Bumpons Part
No. SJ-5302
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
DNP R5, R6
Apply to corners at bottom side
DNP: enclosed with kit, supplied by TI
Hardware
© 2009–2010, Texas Instruments Incorporated
45
MSP-TS430DW28
B.5
www.ti.com
MSP-TS430DW28
Figure B-9. MSP-TS430DW28 Target Socket Module, Schematic
46
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430DW28
www.ti.com
LED connected to P1.0
Jumper J4
Open to disconnect LED
Jumper J5
Open to measure current
Connector J3
External power connector
Remove R8 and jumper R9
Orient Pin 1 of
MSP430 device
Figure B-10. MSP-TS430DW28 Target Socket Module, PCB
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
47
MSP-TS430DW28
www.ti.com
Table B-6. MSP-TS430DW28 Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C5
1
100nF, SMD0805
3
C7
1
10uF/10V Tantal Elko B
4
C8
1
10nF
SMD0805
5
D1
1
LED3 T1 3mm yellow
RS: 228-4991
6
Q1
0
QUARZ, Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
DNP: Cover holes while soldering
12.5pF
7
J1, J2
2
14-pin header, TH male
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder.: Header: Receptacle
2
14-pin header, TH
female
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder.: Header: Receptacle
7.1
48
Description
DigiKey Part No.
Comment
DNP: C1, C2, Cover holes while
soldering
8
J3
1
3-Pin Connector, male
9
J4, J5
2
2-Pin Connector, male
10
BOOTST
0
ML10, 10-Pin Conn., m
RS: 482-115
11
JTAG
1
ML14, 14-Pin Conn., m
RS: 482-121
12
R1, R2,
R6, R7,
R8,R9,
R10, R11
4
0R, SMD0805
13
R3
1
560R, SMD0805
14
R5
1
47K, SMD0805
15
U1
1
SOP28DW socket
16
U2
0
TSSOP
With jumper
DNP, Cover holes while soldering
DNP: R1, R2, R9, R10
Yamaichi:
IC189-0282-042
Hardware
DNP
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PW28
www.ti.com
B.6
MSP-TS430PW28
Figure B-11. MSP-TS430PW28 Target Socket Module, Schematic
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
49
MSP-TS430PW28
www.ti.com
Jumper JP4 to JP9:
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP1
1-2 (int): Power supply via JTAG interface
2-3 (ext): External Power Supply
Jumper JP2
Open to measure current
Orient Pin 1 of Device
Jumper JP3
Open to disconnect LED
LED D1 connected to P5.1
Figure B-12. MSP-TS430PW28 Target Socket Module, PCB
50
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PW28
www.ti.com
Table B-7. MSP-TS430PW28 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C3
1
10uF/10V Tantal Elko B
3
C4
1
100nF, SMD0805
4
C5
0
2.2nF, SMD0805
5
D1
1
LED green SMD0603
6
Q1
0
QUARZ, Crystal
7
J1, J2
7.1
(1)
Description
(1)
DigiKey Part No.
Comment
DNP: C1, C2 , Cover holes
while soldering
DNP
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
DNP: Cover holes and
neighboring holes while
soldering
14-pin header, TH male
DNP: Headers and
receptacles enclosed with
kit.Keep vias free of
solder.: Header:
Receptacle
2
14-pin header, TH female
DNP: headers and
receptacles enclosed with
kit.Keep vias free of
solder.: Header:
Receptacle
2
8
J5, IP1
1
3-Pin Connector , male
8a
JP1, JP4,
JP5, JP6,
JP7, JP8,
JP9
7
3-Pin Connector , male
Jumper on Pos 1-2
9
JP2, JP3
2
2-Pin Connector , male
with Jumper
10
BOOTST
0
ML10, 10-Pin Conn. , m
RS: 482-115
11
JTAG
1
ML14, 14-Pin Conn. , m
RS: 482-121
12
R1, R7
2
330R, SMD0805
12
R2, R3, R5,
R6
0
0R, SMD0805
14
R4
1
47K, SMD0805
15
U1
1
SOP28PW socket
DNP: Cover holes while
soldering
DNP
Enplas: OTS-28-0.65-01
PCB 66 x 79 mm, two layers; Rubber stand off, four pieces
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
51
MSP-TS430PW28A
B.7
www.ti.com
MSP-TS430PW28A
Figure B-13. MSP-TS430PW28A Target Socket Module, Schematic
52
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PW28A
www.ti.com
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper JP2
Open to measure current
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Jumper JP3
Open to disconnect LED
D1 LED connected to P1.0
Figure B-14. MSP-TS430PW28A Target Socket Module, PCB (Red)
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
53
MSP-TS430PW28A
www.ti.com
Table B-8. MSP-TS430PW28A Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C5
1
2.2nF, SMD0805
3
C3
1
10uF/10V, SMD0805
4
C4, C6,
2
100nF, SMD0805
478-3351-2-ND
5
D1
1
green LED, SMD0805
P516TR-ND
6
J1, J2
0
14-pin header, TH
7
J5, JP1,
JP4, JP5,
JP6, JP7,
JP8, JP9
8
3-pin header, male, TH
SAM1035-03-ND
Place jumper on 1-2 of JP4-JP9
Place on 1-2 on JP1
8
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
Jumper
15-38-1024-ND
see Pos 7 an 8
14-pin connector, male,
TH
HRP14H-ND
9
54
Description
DigiKey Part No.
Comment
DNP
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder: (Header & Receptacle)
10
JTAG
1
11
BOOTST
0
12
Q1
0
Crystal
Micro Crystal MS3V
32.768kHz, C(Load) =
12.5pF
13
R1, R7
2
330 Ω, SMD0805
541-330ATR-ND
14
R2, R3,R5,
R6,
0
0 Ohm, SMD0805
541-000ATR-ND
15
R4
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: OTS-28-0.65-01
17
PCB
1
63.5 x 64.8 mm
18
Adhesive
plastic feet
4
about 6mm width, 2mm
height
19
MSP430
2
MSP430G2553IPW28
DNP Keep vias free of solder
DNP: keep vias free of solder
DNP R2, R3,R5, R6
Manuf.: Enplas
2 layers
e.g., 3M Bumpons Part
No. SJ-5302
Hardware
Apply to corners at bottom side
DNP: enclosed with kit, supplied by TI
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430DA38
www.ti.com
B.8
MSP-TS430DA38
Figure B-15. MSP-TS430DA38 Target Socket Module, Schematic
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
55
MSP-TS430DA38
www.ti.com
Jumpers JP4 to JP9
Close 1-2 to debug in
Spy-Bi-Wire Mode,
Close 2-3 to debug in
4-wire JTAG Mode
LED connected to P1.0
Jumper JP3
Open to disconnect LED
Orient pin 1 of
MSP430 device
Jumper JP2
Open to measure current
Connector J3
External power connector
Jumper JP1 to 'ext'
Figure B-16. MSP-TS430DA38 Target Socket Module, PCB
56
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430DA38
www.ti.com
Table B-9. MSP-TS430DA38 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C7
1
10uF/10V, Tantal Size B
511-1463-2-ND
3
C5
1
100nF, SMD0805
478-3351-2-ND
4
C8
0
2.2nF, SMD0805
5
D1
1
green LED, SMD0603
Description
DigiKey Part No.
Comment
DNP
DNP
475-1056-2-ND
6
J1, J2
0
19-pin header, TH
"SAM1029-19NDSAM1213-19-ND"
DNP: headers and
receptacles enclosed with
kit.Keep vias free of
solder.: Header:
Receptacle
7
"J3, JP1,
JP4, JP5,
JP6, JP7,
JP8, JP9"
8
3-pin header, male, TH
SAM1035-03-ND
Place jumpers on headers
JP1, JP4,JP5, JP6, JP7,
JP8, JP9; Pos 1-2
8
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
Jumper
15-38-1024-ND
Place on: JP1 - JP9; Pos
1-2
HRP14H-ND
9
10
JTAG
1
14-pin connector, male, TH
11
BOOTST
0
10-pin connector, male, TH
12
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
13
R1, R3
2
330 Ω, SMD0805
541-330ATR-ND
14
R10, R11
0
0 Ω, SMD0805
541-000ATR-ND
15
R5
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: IC189-0382--037
Manuf.: Yamaichi
17
PCB
1
67 x 66 mm
2 layers
18
Adhesive
Plastic feet
4
~6mm width, 2mm height
19
MSP430
2
MSP430F2274IDA
DNP: Keep vias free of
solder
e.g., 3M Bumpons Part No.
SJ-5302
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
DNP: Keep vias free of
solder
DNP
Apply to corners at bottom
side
DNP: enclosed with kit
supplied by TI
Hardware
© 2009–2010, Texas Instruments Incorporated
57
MSP-TS430QFN23x0
B.9
www.ti.com
MSP-TS430QFN23x0
Figure B-17. MSP-TS430QFN23x0 Target Socket Module, Schematic
58
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430QFN23x0
www.ti.com
Connector J5
External power connector
Jumper JP1 to 'ext'
Jumper JP2
Open to measure current
Jumper JP3
Open to disconnect LED
LED connected
to P1.0
Figure B-18. MSP-TS430QFN23x0 Target Socket Module, PCB
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
59
MSP-TS430QFN23x0
www.ti.com
Table B-10. MSP-TS430QFN23x0 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C3
1
10uF/10V, Tantal Size B
511-1463-2-ND
3
C4
1
100nF, SMD0805
478-3351-2-ND
4
C5
1
10nF, SMD0805
478-1383-2-ND
5
D1
1
green LED, SMD0603
475-1056-2-ND
DigiKey Part No.
Comment
DNP
6
J1, J2, J3,
J4
0
10-pin header, TH
DNP: headers and
receptacles enclosed with
SAM1034-10-NDSAM1212kit.Keep vias free of
10-ND
solder.: Header:
Receptacle
7
J5, JP1
2
3-pin header, male, TH
SAM1035-03-ND
Place jumper on header
JP1; Pos 1-2.
8
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
Place on: JP1, JP2, JP3
9
60
Description
3
Jumper
15-38-1024-ND
10
JTAG
1
14-pin connector, male, TH
HRP14H-ND
11
BOOTST
0
10-pin connector, male, TH
12
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
13
R1
1
330 Ω, SMD0805
541-330ATR-ND
14
R2, R3
0
0 Ω, SMD0805
541-000ATR-ND
15
R4
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: QFN-40B-0.5-01
17
PCB
1
79 x 66 mm
18
Adhesive
Plastic feet
4
~6mm width, 2mm height
19
MSP430
2
MSP430F2370IRHA
DNP: Keep vias free of
solder
DNP: Keep vias free of
solder
DNP
Manuf.: Enplas
2 layers
e.g., 3M Bumpons Part No.
SJ-5302
Hardware
Apply to corners at bottom
side
DNP: enclosed with kit
supplied by TI
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430RSB40
www.ti.com
B.10 MSP-TS430RSB40
Figure B-19. MSP-TS430RSB40 Target Socket Module, Schematic
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
61
MSP-TS430RSB40
www.ti.com
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper JP2
Open to measure current
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Jumper JP3
Open to disconnect LED
D1 LED connected to P1.0
Figure B-20. MSP-TS430RSB40 Target Socket Module, PCB
62
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430RSB40
www.ti.com
Table B-11. MSP-TS430RSB40 Bill of Materials
Ref Des
No. Per
Board
Description
1
C1, C2
0
12pF, SMD0805
2
C3, C7, C10,
C12
3
10uF/10V, SMD 0805
445-1371-1-ND
DNP C12
3
C4, C6, C8,
C11
3
100nF, SMD0805
311-1245-2-ND
DNP C11
4
C5
1
2.2nF, SMD0805
5
C9
1
470nF, SMD0805
6
D1
1
green LED, SMD0805
Pos.
DigiKey Part No.
Comment
DNP: C1, C2
P516TR-ND
10-pin header, TH
DNP: headers and
receptacles enclosed with kit.
Keep vias free of solder. :
Header : Receptacle
4
10-pin header, TH
DNP: headers and
receptacles enclosed with kit.
Keep vias free of solder. :
Header : Receptacle
8
JP1,
JP4,JP5,
JP6, JP7,
JP8, JP9, J5,
JP10
9
3-pin header, male, TH
SAM1035-03-ND
Jumper: 1-2 on JP1, JP10;
2-3 on JP4-JP9
place jumper on header
7
J1, J2, J3, J4
7.1
4
9
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
10
JTAG
1
14-pin connector, male, TH
HRP14H-ND
11
BOOTST
0
10-pin connector, male, TH
12
U1
1
QFN-40B-0.4_
ENPLAS_SOCKET
Enplas
13
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
12.5pF
DNP: Q1. Keep vias free of
solder
10
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3,
JP4, JP5, JP6, JP7, JP8,
JP9, JP10
15
16
R1,R7
2
330R SMD0805
17
R2, R3, R5,
R6, R8, R9,
R10
3
0R SMD0805
18
R4
1
47k SMD0805
19
MSP430
2
MSP430F5132
20
Rubber stand
off
4
DNP. Keep vias free of
solder
DNP R2, R3, R5, R6
DNP: enclosed with kit. Is
supplied by TI
select appropriate; e.g.,
Buerklin: 20H1724
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
apply to corners at bottom
side
Hardware
© 2009–2010, Texas Instruments Incorporated
63
MSP-TS430RHA40A
www.ti.com
B.11 MSP-TS430RHA40A
Figure B-21. MSP-TS430RHA40A Target Socket Module, Schematic
64
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430RHA40A
www.ti.com
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper JP2
Open to measure current
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
D1 LED connected to P1.0
Jumper JP3
Open to disconnect LED
Orient Pin 1 of MSP430 device
Figure B-22. MSP-TS430RHA40A Target Socket Module, PCB
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
65
MSP-TS430RHA40A
www.ti.com
Table B-12. MSP-TS430RHA40A Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP: C1, C2
2
C5
0
2.2nF, SMD0805
DNP C12
3
C3, C7
2
10uF/10V, SMD0805 5
4
C4, C6
2
100nF, SMD0805
5
C9
1
470nF, SMD0805
6
D1
1
green LED, SMD0805
7
J1, J2, J3,
J4
4
10-pin header, TH
DNP: headers and receptacles
enclosed with kit. Keep vias free of
solder. : Header : Receptacle
4
10-pin header, TH
DNP: headers and receptacles
enclosed with kit. Keep vias free of
solder. : Header : Receptacle
8
J5, JP1,
JP4, JP5,
JP6, JP7,
JP8, JP9
8
3-pin header, male, TH
SAM1035-03-ND
Place jumper on 1-2 of JP4-JP9;
Place on 1-2 on JP1
9
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
9
Jumper
15-38-1024-ND
see Pos 8 an 9
HRP14H-ND
7.1
10
11
JTAG
1
14-pin connector, male,
TH
12
BOOTST
0
10-pin connector, male,
TH
13
U1
1
Socket: QFN-40B-0.5-01
DigiKey Part No.
Comment
DNP C11
478-3351-2-ND
P516TR-ND
DNP. Keep vias free of solder
Manuf.: Enplas
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
12.5pF
15
R1,R7
2
330R SMD0805
541-330ATR-ND
16
R2, R3,
R5, R6,
R8, R9,
2
0 Ohm, SMD0805
541-000ATR-ND
17
R4
1
47k SMD0805
18
PCB
1
79 x 66 mm
19
Rubber
stand off
4
20
MSP430
2
14
66
Description
DNP: Q1. Keep vias free of solder
DNP:R2, R3, R5, R6
2 layers
select appropriate; e.g.,
Buerklin: 20H1724
MSP430N5736IRHA
Hardware
apply to corners at bottom side
DNP: enclosed with kit. Is supplied by
TI
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430DL48
www.ti.com
B.12 MSP-TS430DL48
Figure B-23. MSP-TS430DL48 Target Socket Module, Schematic
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
67
MSP-TS430DL48
www.ti.com
Jumper J5
Open to measure current
LED connected
to P1.0
Connector J3
External power connector
Jumper JP1 to ‘ext’
Jumper J4
Open to
disconnect LED
Orient pin 1 of
MSP430 device
Figure B-24. MSP-TS430DL48 Target Socket Module, PCB
68
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430DL48
www.ti.com
Table B-13. MSP-TS430DL48 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C4, C7
2
10uF/10V, Tantal Size B
511-1463-2-ND
3
C3, C5
2
100nF, SMD0805
478-3351-2-ND
4
C8
1
10nF, SMD0805
478-1383-2-ND
5
D1
1
yellow LED, TH, 3mm, T1
511-1251-ND
Description
DigiKey Part No.
Comment
DNP
6
J1, J2
0
24-pin header, TH
DNP: Headers and
receptacles enclosed with
SAM1034-12-NDSAM1212kit.Keep vias free of
12-ND
solder.: Header:
Receptacle
7
J3, JP1, JP2
2
3-pin header, male, TH
SAM1035-03-ND
Place jumper on header
JP1; Pos 1-2. DNP: JP2
8
J4, J5
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
Place on: JP1, J4, J5
3
Jumper
15-38-1024-ND
10
9
JTAG
1
14-pin connector, male, TH
HRP14H-ND
11
BOOTST
0
10-pin connector, male, TH
12
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
13
R3
1
560 Ω, SMD0805
541-560ATR-ND
14
R4, R6, R7,
R12
2
0 Ω, SMD0805
541-000ATR-ND
15
R5
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: IC51-1387
KS-15186
Manuf.: Yamaichi
17
PCB
1
58 x 66 mm
2 layers
18
Adhesive
Plastic feet
4
~6mm width, 2mm height
19
MSP430
2
MSP430F4270IDL
DNP: Keep vias free of
solder
e.g., 3M Bumpons Part No.
SJ-5302
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
DNP: Keep vias free of
solder
DNP: R6, R7
Apply to corners at bottom
side
DNP: Enclosed with kit
supplied by TI
Hardware
© 2009–2010, Texas Instruments Incorporated
69
MSP-TS430RGZ48B
www.ti.com
B.13 MSP-TS430RGZ48B
Figure B-25. MSP-TS430RGZ48B Target Socket Module, Schematic
70
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430RGZ48B
www.ti.com
Connector J5
External power connector
Jumper JP1 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP1
Open to measure current
Orient Pin 1 of MSP430 device
Jumper JP2
Open to disconnect LED
D1 LED connected to P1.0
Figure B-26. MSP-TS430RGZ48B Target Socket Module, PCB
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
71
MSP-TS430RGZ48B
www.ti.com
Table B-14. MSP-TS430RGZ48B Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
2
C3, C4
0
47pF, SMD0805
DNP
3
C6, C7,
C12
3
10uF/6.3V, SMD0805
4
C5, C11,
C13, C14
4
100nF, SMD0805
5
C8
1
2.2nF, SMD0805
6
C9
1
470nF, SMD0805
478-1403-2-ND
7
D1
1
green LED, SMD0805
P516TR-ND
8
J1, J2, J3,
J4
0
12-pin header, TH
SAM1029-12-ND
(Header)
SAM1213-12-ND
(Receptacle)
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder:
9
J5
1
3-pin header, male, TH
10
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 on JP5,
JP6, JP7, JP8, JP9, JP10 place
jumpers on pins 1-2 on JP3,
11
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
Jumper
15-38-1024-ND
See Pos. 10and Pos. 11
HRP14H-ND
12
72
Description
DigiKey Part No.
Comment
311-1245-2-ND
13
JTAG
1
14-pin connector, male,
TH
14
BOOTST
0
10-pin connector, male,
TH
15
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
DNP: Q1 Keep vias free of solder
12.5pF
16
Q2
0
Crystal
Q2: 4MHz Buerklin:
78D134
17
Insulating
disk to Q2
0
Insulating disk to Q2
http://www.ettinger.de/Ar
t_Detail.cfm?ART_ART
NUM=70.08.121
18
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
19
R1, R2,
R4, R6,
R8,
R9,R10,
R11, R12
3
0 Ohm, SMD0805
541-000ATR-ND
20
R5
1
47k Ω, SMD0805
541-47000ATR-ND
21
U1
1
Socket:
QFN11T048008_A101121_RGZ48
Manuf.: Yamaichi
22
PCB
1
81 x 76 mm
2 layers
23
Adhesive
plastic feet
4
about 6mm width, 2mm
height
24
MSP430
2
MSP430F5342IRGZ
"DNP Keep vias free of solder"
e.g., 3M Bumpons Part
No. SJ-5302
Hardware
DNP: Q2 Keep vias free of solder
DNP: R6, R8, R9, R10, R11,R12
Apply to corners at bottom side
DNP: enclosed with kit, supplied by TI
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PM64
www.ti.com
B.14 MSP-TS430PM64
NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be
made.
Figure B-27. MSP-TS430PM64 Target Socket Module, Schematic
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
73
MSP-TS430PM64
www.ti.com
Connector J5
External power connection
Remove R8 and jumper R9
LED connected
to pin 12
Jumper J7
Open to measure current
Jumper J6
Open to disconnect LED
Orient Pin 1 of
MSP430 device
Figure B-28. MSP-TS430PM64 Target Socket Module, PCB
74
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PM64
www.ti.com
Table B-15. MSP-TS430PM64 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
1.1
C3, C4
0
47pF, SMD0805
DNP: Only
recommendation. Check
your crystal spec.
2
C6, C7
1
10uF/10V, Tantal Size B
511-1463-2-ND
3
C5
1
100nF, SMD0805
478-3351-2-ND
4
C8
1
10nF, SMD0805
478-1383-2-ND
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3,
J4
0
16-pin header, TH
DNP: Headers and
receptacles enclosed with
SAM1029-16-NDSAM1213kit.Keep vias free of
16-ND
solder.: Header:
Receptacle
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
J6, J7
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
2
Jumper
15-38-1024-ND
Place on: J6, J7
HRP14H-ND
11
Description
DigiKey Part No.
Comment
DNP: C6
12
JTAG
1
14-pin connector, male, TH
13
BOOTST
0
10-pin connector, male, TH
14
Q1, Q2
0
Crystal
Q1: Micro Crystal
MS1V-T1K 32.768kHz,
C(Load) = 12.5pF
15
R3
1
330 Ω, SMD0805
541-330ATR-ND
16
R1, R2, R4,
R6, R7, R8,
R9, R10,
R11, R12,
R13, R14
3
0 Ω, SMD0805
541-000ATR-ND
17
R5
1
47k Ω, SMD0805
541-47000ATR-ND
18
U1
1
Socket: IC51-0644-807
Manuf.: Yamaichi
19
PCB
1
78 x 75 mm
2 layers
20
Rubber
standoff
4
21
MSP430
22
DNP: Keep vias free of
solder
select appropriate
MSP430F2619IPM
MSP430F417IPM
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
DNP: Keep vias free of
solder
DNP: R4, R6, R7, R9, R10,
R11, R12, R13, R14
Apply to corners at bottom
side
DNP: Enclosed with kit
supplied by TI
Hardware
© 2009–2010, Texas Instruments Incorporated
75
MSP-TS430PM64A
www.ti.com
B.15 MSP-TS430PM64A
Figure B-29. MSP-TS430PM64A Target Socket Module, Schematic
76
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PM64A
www.ti.com
Jumper JP3
1-2 (int): Power supply via JTAG interface
2-3 (ext): External Power Supply
Jumper JP4 to JP9:
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP2
Open to measure current
Orient Pin 1 of Device
Jumper JP1
Open to disconnect LED
LED D1 connected to P5.1
Figure B-30. MSP-TS430PM64A Target Socket Module, PCB
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
77
MSP-TS430PM64A
www.ti.com
Table B-16. MSP-TS430PM64A Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2,
0
12pF, SMD0805
DNP
2
C3
0
2.2nF, SMD0805
DNP
3
C6,
1
10uF/10V, Tantal Size B
511-1463-2-ND
4
C4, C5
2
100nF, SMD0805
478-3351-2-ND
5
D1
1
green LED, SMD0805
P516TR-ND
DigiKey Part No.
Comment
6
J1, J2, J3,
J4
0
16-pin header, TH
DNP: Headers and
receptacles enclosed with
SAM1029-16-NDSAM1213kit. Keep vias free of
16-ND
solder.: Header:
Receptacle
7
J5, JP3,
JP4, JP5,
JP6, JP7,
JP8, JP9
8
3-pin header, male, TH
SAM1035-03-ND
8
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
2
Jumper
15-38-1024-ND
Place on: J6, J7
HRP14H-ND
9
78
Description
10
JTAG
1
14-pin connector, male, TH
11
BOOTST
0
10-pin connector, male, TH
12
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
13
R3, R6
2
330 Ω, SMD0805
541-330ATR-ND
14
R1, R2, R5,
R7, R9, R10,
R11, R13,
R14
2
0 Ω, SMD0805
541-000ATR-ND
15
R4
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: IC51-0644-807
Manuf.: Yamaichi
17
PCB
1
78 x 75 mm
4 layers
18
Rubber
stand off
4
19
MSP430
2
DNP: Keep vias free of
solder
select appropriate
MSP430F4152IPM
Hardware
DNP: Keep vias free of
solder
DNP: R5, R7, R9, R10,
R11, R13, R14
Apply to corners at bottom
side
DNP: Enclosed with kit
supplied by TI
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430RGC64B
www.ti.com
B.16 MSP-TS430RGC64B
Figure B-31. MSP-TS430RGC64B Target Socket Module, Schematic
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
79
MSP-TS430RGC64B
www.ti.com
Connector J5
External power connector
Jumper JP3 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
If the system should
be supplied via LDOI (J6),
close JP4 and
set JP3 to external
Orient Pin 1 of MSP430 device
D1 LED connected to P1.0
Jumper JP2
Open to disconnect LED
Figure B-32. MSP-TS430RGC64B Target Socket Module, PCB
80
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430RGC64B
www.ti.com
Table B-17. MSP-TS430RGC64B Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
2
C3, C4
0
47pF, SMD0805
DNP
3
C6, C7,
C10
3
10uF/6.3V, SMD0805
4
C5, C11,
C13, C14,
C15
5
100nF, SMD0805
5
C8
1
2.2nF, SMD0805
6
C9
1
470nF, SMD0805
7
C16
1
4.7uF, SMD0805
8
C17
1
220nF, SMD0805
9
D1
1
green LED, SMD0805
P516TR-ND
10
J1, J2, J3,
J4
0
16-pin header, TH
SAM1029-16-ND
(Header)
SAM1213-16-ND
(Receptacle)
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder:
11
J5 , J6
2
3-pin header, male, TH
12
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 on JP5,
JP6, JP7, JP8, JP9, JP10 place
jumpers on pins 1-2 on JP3,
13
JP1, JP2,
JP4
3
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
10
Jumper
15-38-1024-ND
See Pos. 12 and Pos. 13
HRP14H-ND
14
Description
DigiKey Part No.
Comment
311-1245-2-ND
478-1403-2-ND
15
JTAG
1
14-pin connector, male,
TH
16
BOOTST
0
10-pin connector, male,
TH
17
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
DNP: Q1 Keep vias free of solder
12.5pF
18
Q2
0
Crystal
Q2: 4MHz Buerklin:
78D134
19
Insulating
disk to Q2
0
Insulating disk to Q2
http://www.ettinger.de/Ar
t_Detail.cfm?ART_ART
NUM=70.08.121
20
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
21
R1, R2,
R4, R6,
R8,
R9,R10,
R11, R12
3
0 Ohm, SMD0805
541-000ATR-ND
22
R5
1
47k Ω, SMD0805
541-47000ATR-ND
23
U1
1
Socket:
QFN11T064-006-N-HSP
Manuf.: Yamaichi
24
PCB
1
85 x 76 mm
2 layers
25
Adhesive
plastic feet
4
about 6mm width, 2mm
height
2
MSP430F5310 RGC
26
D3,D4
27
MSP430
"DNP Keep vias free of solder"
e.g., 3M Bumpons Part
No. SJ-5302
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
DNP: Q2 Keep vias free of solder
DNP: R6, R8, R9, R10, R11,R12
Apply to corners at bottom side
DNP: enclosed with kit, supplied by TI
Hardware
© 2009–2010, Texas Instruments Incorporated
81
MSP-TS430RGC64USB
www.ti.com
B.17 MSP-TS430RGC64USB
Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately
0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for
example, to run the MCU at 3.0 V, set it to 3.3 V.
Figure B-33. MSP-TS430RGC64USB Target Socket Module, Schematic
82
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430RGC64USB
www.ti.com
Figure B-34. MSP-TS430RGC64USB Target Socket Module, PCB
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
83
MSP-TS430RGC64USB
www.ti.com
Table B-18. MSP-TS430RGC64USB Bill of Materials
Pos.
Ref Des
No. Per
Board
1
C1, C2
0
12pF, SMD0805
1.1
C3, C4
2
47pF, SMD0805
2
C6, C7
2
10uF/6.3V, Tantal Size B
511-1463-2-ND
3
C5, C11,
C13, C14
4
100nF, SMD0805
311-1245-2-ND
3.1
C10, C12
0
10uF, SMD0805
4
C8
1
2.2nF, SMD0805
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3, J4
DigiKey Part No.
Comment
DNP: C1, C2
DNP: C10, C12
DNP: headers and
receptacles enclosed with kit.
Keep vias free of solder.
16-pin header, TH
SAM1029-16-ND
: Header
SAM1213-16-ND
: Receptacle
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
JP5, JP6,
JP7, JP8,
JP9, JP10
6
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
10
JP1, JP2,
JP4
3
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
11
JP3
1
3-pin header, male, TH
SAM1035-03-ND
place jumper on pins 1-2
10
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3,
JP4, JP5, JP6, JP7, JP8,
JP9, JP10
12
84
4
Description
13
JTAG
1
14-pin connector, male, TH
HRP14H-ND
14
Q1
0
Crystal
Q1: Micro Crystal MS1V-T1K
DNP: Q1
32.768kHz, C(Load) =
Keep vias free of solder"
12.5pF
15
Q2
1
Crystal
Q2: 4MHz Buerklin: 78D134
16
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
17
R1, R2, R4,
R6, R8, R9,
R12
2
0 Ω, SMD0805
541-000ATR-ND
18
R10
1
100 Ω, SMD0805
Buerklin: 07E500
18
R11
1
1M Ω, SMD0805
18
R5
1
47k Ω, SMD0805
19
U1
1
Socket: QFN11T064-006
Manuf.: Yamaichi
20
PCB
1
79 x 77 mm
2 layers
21
Rubber stand
off
4
22
MSP430
2
MSP430F5509 RGC
23
Insulating
disk to Q2
1
Insulating disk to Q2
http://www.ettinger.de/Art_De
tail.cfm?ART_ARTNUM=70.0
8.121
27
C33
1
220n SMD0603
Buerklin: 53D2074
28
C35
1
10p SMD0603
Buerklin: 56D102
29
C36
1
10p SMD0603
Buerklin: 56D102
30
C38
1
220n SMD0603
Buerklin: 53D2074
31
C39
1
4u7 SMD0603
Buerklin: 53D2086
32
C40
1
0.1u SMD0603
Buerklin: 53D2068
33
D2, D3, D4
3
LL103A
Buerklin: 24S3406
DNP: R4, R6, R8, R9, R12
541-47000ATR-ND
Buerklin: 20H1724
apply to corners at bottom
side
DNP: enclosed with kit. Is
supplied by TI
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430RGC64USB
www.ti.com
Table B-18. MSP-TS430RGC64USB Bill of Materials (continued)
Ref Des
No. Per
Board
34
IC7
1
TPD4E004
36
LED
0
JP3QE
SAM1032-03-ND
DNP
37
LED1
0
LEDCHIPLED_0603
FARNELL: 852-9833
DNP
38
LED2
0
LEDCHIPLED_0603
FARNELL: 852-9868
DNP
39
LED3
0
LEDCHIPLED_0603
FARNELL: 852-9841
DNP
40
R13, R15,
R16
0
470R
Buerklin: 07E564
DNP
41
R33
1
1k4 / 1k5
Buerklin: 07E612
42
R34
1
27R
Buerklin: 07E444
43
R35
1
27R
Buerklin: 07E444
44
R36
1
33k
Buerklin: 07E740
45
S1
0
PB
P12225STB-ND
DNP
46
S2
0
PB
P12225STB-ND
DNP
46
S3
1
PB
P12225STB-ND
47
USB1
1
USB_RECEPTACLE
FARNELL: 117-7885
Pos.
Description
DigiKey Part No.
Comment
Manu: TI
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
85
MSP-TS430PN80
www.ti.com
B.18 MSP-TS430PN80
NOTE: For MSP430F(G)47x devices:
Connect pins 7 and 10 (GND) externally to DVSS (see data sheet).
Connect load capacitance on Vref pin 60 when SD16 is used (see data sheet).
Figure B-35. MSP-TS430PN80 Target Socket Module, Schematic
86
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PN80
www.ti.com
LED connected to pin 12
Connector J5
External power connection
Remove R8 and jumper R9
Jumper J6
Open to disconnect LED
Orient Pin 1 of MSP430 device
Figure B-36. MSP-TS430PN80 Target Socket Module, PCB
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
87
MSP-TS430PN80
www.ti.com
Table B-19. MSP-TS430PN80 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP: C1, C2
1.1
C3, C4
0
47pF, SMD0805
DNP: Only
recommendation. Check
your crystal spec.
2
C6, C7
1
10uF/10V, Tantal Size B
511-1463-2-ND
3
C5
1
100nF, SMD0805
478-3351-2-ND
4
C8
1
10nF, SMD0805
478-1383-2-ND
5
D1
1
green LED, SMD0603
475-1056-2-ND
DigiKey Part No.
Comment
6
J1, J2, J3,
J4
0
25-pin header, TH
DNP: Headers and
receptacles enclosed with
SAM1029-20-NDSAM1213kit.Keep vias free of
20-ND
solder.: Header:
Receptacle
7
J5, JP1
2
3-pin header, male, TH
SAM1035-03-ND
8
J6, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
3
Jumper
15-38-1024-ND
Place on: J6, JP2,
JP1/Pos1-2
HRP14H-ND
9
88
Description
10
JTAG
1
14-pin connector, male, TH
11
BOOTST
0
10-pin connector, male, TH
12
Q1, Q2
0
Crystal
Q1: Micro Crystal
MS1V-T1K 32.768kHz,
C(Load) = 12.5pF
13
R3
1
560 Ω, SMD0805
541-560ATR-ND
14
R1, R2, R4,
R6, R7, R10,
R11, R12
2
0 Ω, SMD0805
541-000ATR-ND
15
R5
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: IC201-0804-014
17
PCB
1
77 x 77 mm
18
Adhesive
Plastic feet
4
~6mm width, 2mm height
19
MSP430
2
MSP430FG439IPN
DNP: Keep vias free of
solder
DNP: Keep vias free of
solder
DNP: R4, R6, R7, R10,
R11, R12
Manuf.: Yamaichi
2 layers
e.g., 3M Bumpons Part No.
SJ-5302
Hardware
Apply to corners at bottom
side
DNP: Enclosed with kit
supplied by TI
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PN80A
www.ti.com
B.19 MSP-TS430PN80A
Figure B-37. MSP-TS430PN80A Target Socket Module, Schematic
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
89
MSP-TS430PN80A
www.ti.com
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector J5
External power connector
Jumper JP3 to "ext"
Orient Pin 1 of MSP430 device
If the system should
be supplied via LDOI (J6),
close JP4 and
set JP3 to external
Jumper JP2
Open to disconnect LED
D1 LED connected to P1.0
Figure B-38. MSP-TS430PN80A Target Socket Module, PCB
90
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PN80USB
www.ti.com
Table B-20. MSP-TS430PN80A Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
2
C3, C4
0
47pF, SMD0805
DNP
3
C6, C7,
C10, C12
3
10uF/6.3V, SMD0805
DNP C10
4
C5, C11,
C13, C14,
C15
5
100nF, SMD0805
5
C8
1
2.2nF, SMD0805
6
C9
1
470nF, SMD0805
7
C16
1
4.7uF, SMD0805
8
C17
1
220nF, SMD0805
9
D1
1
green LED, SMD0805
P516TR-ND
10
J1, J2, J3,
J4
0
20-pin header, TH
SAM1029-20-ND
(Header)
SAM1213-20-ND
(Receptacle)
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder:
11
J5 , J6
2
3-pin header, male, TH
12
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 on JP5,
JP6, JP7, JP8, JP9, JP10 place
jumpers on pins 1-2 on JP3,
13
JP1, JP2,
JP4
3
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
10
Jumper
15-38-1024-ND
See Pos. 12 and Pos. 13
HRP14H-ND
14
Description
DigiKey Part No.
Comment
311-1245-2-ND
478-1403-2-ND
15
JTAG
1
14-pin connector, male,
TH
16
BOOTST
0
10-pin connector, male,
TH
17
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
DNP: Q1 Keep vias free of solder
12.5pF
18
Q2
0
Crystal
Q2: 4MHz Buerklin:
78D134
19
Insulating
disk to Q2
0
Insulating disk to Q2
http://www.ettinger.de/Ar
t_Detail.cfm?ART_ART
NUM=70.08.121
20
D3,D4
2
LL103A
Buerklin: 24S3406
21
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
22
R1, R2,
R4, R6,
R8,
R9,R10,
R11, R12
3
0 Ohm, SMD0805
541-000ATR-ND
23
R5
1
47k Ω, SMD0805
541-47000ATR-ND
24
U1
1
Socket:IC201-0804-014
Manuf.: Yamaichi
25
PCB
1
77 x 91 mm
2 layers
26
Adhesive
plastic feet
4
about 6mm width, 2mm
height
27
MSP430
2
MSP430F5329IPN
"DNP Keep vias free of solder"
e.g., 3M Bumpons Part
No. SJ-5302
DNP: Q2 Keep vias free of solder
DNP: R6, R8, R9, R10, R11,R12
Apply to corners at bottom side
DNP: enclosed with kit, supplied by TI
B.20 MSP-TS430PN80USB
Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately
0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for
example, to run the MCU at 3.0 V, set it to 3.3 V.
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
91
MSP-TS430PN80USB
www.ti.com
NOTE: R11 should be populated.
Figure B-39. MSP-TS430PN80USB Target Socket Module, Schematic
92
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PN80USB
www.ti.com
Jumper JP3
1-2 (int): Power supply via JTAG debug interface
2-3 (ext): External power supply
USB Connector
Jumper JP1
Open to measure current
Connector J5
External power connector
Jumper JP3 to ‘ext’
Jumper JP4
Close for USB bus powered
device
Jumper JP5 to JP10
Close 1-2 to debug in Spy-BiWire mode.
Close 2-3 to debug in 4-wire
JTAG mode.
BSL invoke button S3
LED connected to P1.0
Jumper JP2
Open to disconnect LED
Figure B-40. MSP-TS430PN80USB Target Socket Module, PCB
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
93
MSP-TS430PN80USB
www.ti.com
Table B-21. MSP-TS430PN80USB Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
1.1
C3, C4
2
47pF, SMD0805
2
C6, C7
2
10uF/6.3V, Tantal Size B
511-1463-2-ND
3
C5, C11,
C13, C14
4
100nF, SMD0805
311-1245-2-ND
3.1
C10, C12
0
10uF, SMD0805
311-1245-2-ND
4
C8
1
2.2nF, SMD0805
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3,
J4
7.1
20-pin header, TH
DigiKey Part No.
Comment
DNP: C1, C2
DNP: C10, C12
SAM1029-20-ND
DNP: headers and
receptacles enclosed with
kit. Keep vias free of
solder.: Header:
Receptacle
DNP: headers and
receptacles enclosed with
kit. Keep vias free of
solder.: Header:
Receptacle
4
20-pin header, TH
SAM1213-20-ND
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
JP5, JP6,
JP7,
JP8,JP9,
JP10
6
3-pin header, male, TH
SAM1035-03-ND
Place jumpers on pins 2-3
10
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
JP4
1
SAM1035-02-ND
Place jumper only on one
pin
JP3
1
3-pin header, male, TH
SAM1035-03-ND
Place jumper on pins 1-2
10
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3,
JP4, JP5, JP6, JP7, JP8,
JP9, JP10
11
12
94
4
Description
13
JTAG
1
14-pin connector, male, TH
HRP14H-ND
14
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
15
Q2
1
Crystal
"Q2: 4MHzBuerklin:
78D134"
16
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
17
R1, R2, R4,
R6, R8, R9,
R12
2
0 Ω, SMD0805
541-000ATR-ND
18
R10
1
100 Ω, SMD0805
Buerklin: 07E500
18
R11
0
1M Ω, SMD0805
18
R5
1
47k Ω, SMD0805
19
U1
1
Socket:IC201-0804-014
Manuf.: Yamaichi
20
PCB
1
79 x 77 mm
2 layers
21
Rubber
standoff
4
22
MSP430
2
MSP430F5529
23
Insulating
disk to Q2
1
Insulating disk to Q2
http://www.ettinger.de/Art_
Detail.cfm?ART_ARTNUM
=70.08.121
27
C33
1
220n
Buerklin: 53D2074
28
C35
1
10p
Buerklin: 56D102
DNP: Q1 Keep vias free of
solder
DNP: R4, R6, R8, R9, R12
DNP
541-47000ATR-ND
Buerklin: 20H1724
Apply to corners at bottom
side
DNP: Enclosed with kit
supplied by TI
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PN80USB
www.ti.com
Table B-21. MSP-TS430PN80USB Bill of Materials (continued)
Pos.
Ref Des
No. per
Board
29
C36
1
10p
Buerklin: 56D102
30
C38
1
220n
Buerklin: 53D2074
31
C39
1
4u7
Buerklin: 53D2086
32
C40
1
0.1u
Buerklin: 53D2068
33
D2, D3, D4
3
LL103A
Buerklin: 24S3406
34
IC7
1
TPD4E004
36
LED
0
JP3QE
SAM1032-03-ND
DNP
37
LED1
0
LEDCHIPLED_0603
FARNELL: 852-9833
DNP
38
LED2
0
LEDCHIPLED_0603
FARNELL: 852-9868
DNP
39
LED3
0
LEDCHIPLED_0603
FARNELL: 852-9841
DNP
40
R13, R15,
R16
0
470R
Buerklin: 07E564
DNP
41
R33
1
1k4
Buerklin: 07E612
42
R34
1
27R
Buerklin: 07E444
43
R35
1
27R
Buerklin: 07E444
44
R36
1
33k
Buerklin: 07E740
45
S1
0
PB
P12225STB-ND
DNP
46
S2
0
PB
P12225STB-ND
DNP
46
S3
1
PB
P12225STB-ND
47
USB1
1
USB_RECEPTACLE
FARNELL: 117-7885
Description
DigiKey Part No.
Comment
Manu: TI
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
95
MSP-TS430PZ100
www.ti.com
B.21 MSP-TS430PZ100
NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be
made.
Figure B-41. MSP-TS430PZ100 Target Socket Module, Schematic
96
Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PZ100
www.ti.com
Jumper J6
Open to disconnect LED
Jumper J7
Open to measure current
LED connected to pin 12
Connector J5
External power connection
Remove R8 and jumper R9
Orient Pin 1 of MSP430 device
Figure B-42. MSP-TS430PZ100 Target Socket Module, PCB
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
97
MSP-TS430PZ100
www.ti.com
Table B-22. MSP-TS430PZ100 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2,
0
12pF, SMD0805
DNP
1b
C3, C4
0
47pF, SMD0805
DNP: Only
recommendation. Check
your crystal spec.
2
C6, C7
1
10uF/10V, Tantal Size B
511-1463-2-ND
3
C5
1
100nF, SMD0805
478-3351-2-ND
4
C8
1
10nF, SMD0805
478-1383-2-ND
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
yellow LED, TH, 3mm, T1
511-1251-ND
7
J1, J2, J3,
J4
0
25-pin header, TH
DNP: Headers and
receptacles enclosed with
SAM1029-25-NDSAM1213kit.Keep vias free of
25-ND
solder.: Header:
Receptacle
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
J6, J7
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
2
Jumper
15-38-1024-ND
Place on: J6, J7
HRP14H-ND
10
98
Description
DigiKey Part No.
Comment
DNP: C6
11
JTAG
1
14-pin connector, male, TH
12
BOOTST
0
10-pin connector, male, TH
13
Q1, Q2
0
Crystal
Q1: Micro Crystal
MS1V-T1K 32.768kHz,
C(Load) = 12.5pF
14
R3
1
330 Ω, SMD0805
541-330ATR-ND
15
R1, R2, R4,
R8, R9, R10,
R11, R12
3
0 Ω, SMD0805
541-000ATR-ND
16
R5
1
47k Ω, SMD0805
541-47000ATR-ND
17
U1
1
"Socket: IC201-1004-008or
IC357-1004-53N"
Manuf.: Yamaichi
18
PCB
1
82 x 90 mm
2 layers
19
Adhesive
Plastic feet
4
~6mm width, 2mm height
20
MSP430
2
MSP430FG4619IPZ
DNP: Keep vias free of
solder
e.g., 3M Bumpons Part No.
SJ-5302
Hardware
DNP: Keep vias free of
solder
DNP: R4, R9, R10, R12
Apply to corners at bottom
side
DNP: enclosed with kit
supplied by TI
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PZ100A
www.ti.com
B.22 MSP-TS430PZ100A
Figure B-43. MSP-TS430PZ100A Target Socket Module, Schematic
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
Hardware
© 2009–2010, Texas Instruments Incorporated
99
MSP-TS430PZ100A
www.ti.com
Jumper JP3
1-2 (int): Power supply via JTAG interface
2-3 (ext): External Power Supply
Jumper JP1
Open to measure current
Jumper JP2
Open to disconnect LED
LED D1 connected to P5.1
Orient Pin 1 of Device
Figure B-44. MSP-TS430PZ100A Target Socket Module, PCB
100 Hardware
SLAU278F – May 2009 – Revised December 2010
Submit Documentation Feedback
© 2009–2010, Texas Instruments Incorporated
MSP-TS430PZ100A
www.ti.com
Table B-23. MSP-TS430PZ100A Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
1b
C3, C4
0
47pF, SMD0805
DNP: Only
recommendation. Check
your crystal spec.
2
C7, C9
2
10uF/10V, Tantal Size B
511-1463-2-ND
3
C5, C11,
C14
3
100nF, SMD0805
311-1245-2-ND
4
C8
1
10nF, SMD0805
478-1358-1-ND
5
C6
0
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
67-1553-1-ND
7
J1, J2, J3,
J4
0
25-pin header, TH
DNP: Headers and
receptacles enclosed with
SAM1029-25-NDSAM1213kit.Keep vias free of
25-ND
solder.: Header:
Receptacle
Description
DigiKey Part No.
Comment
DNP
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
10
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
pPlace jumper on header
11
JP3
1
3-pin header, male, TH
SAM1035-03-ND
Place jumper on pins 1-2
3
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3
HRP14H-ND
12
13
JTAG
1
14-pin connector, male, TH
14
BOOTST
0
10-pin connector, male, TH
15
Q1, Q2
0
Crystal
Q1: Micro Crystal
MS1V-T1K 32.768kHz,
C(Load) = 12.5pF
16
R3
1
330 Ω, SMD0805
541-330ATR-ND
17
R1, R2, R4,
R6, R7, R8,
R9, R10,
R11, R12
2
0 Ω, SMD0805
541-000ATR-ND
18
R5
1
47k Ω, SMD0805
541-47000ATR-ND
19
U1
1
Socket: IC357-1004-53N
Manuf.: Yamaichi
20
PCB
1
90 x 82 mm
4 layers
21
Rubber
standoff
4
22
MSP430
2
DNP: Keep vias fr
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising