CC1120-CC1190 BoosterPack
Application Report
SWRA492 – October 2015
CC112x-CC1190 BoosterPack
Prasad Movva
ABSTRACT
As the module is designed to support both LaunchPad™ and SmartRF™ Studio platforms, configure the
board by changing the on-board jumper positions according to your application. The default configuration
of the jumpers on the BoosterPack™ module is set for LaunchPad applications. The interface details of
CC112x-CC1190 BoosterPack with LaunchPad and SmartRF Studio applications are shown in the
subsequent sections of this document. The pass through connection feature on this BoosterPack allows to
plug-in other BoosterPack modules to create multiple applications.
1
Introduction
The CC112x-CC1190 BoosterPack module is designed to use with the MSP-EXP430F5529 [10] and
MSP-EXP430G2553 [11] LaunchPad development kits and as well as to work as a stand-alone module by
using SmartRF Studio application software. The module is equipped with an integrated PCB trace
antenna, which operates in the US 902~928 MHz and European 869~870 MHz ISM frequency bands. The
module is certified to use on Sigfox wireless networks in US with a valid license from Sigfox. The CC112xCC1190 BoosterPack module is shown in Figure 1 and Figure 2.
The RF performance of CC112x-CC1190 BoosterPack is similar to the RF performance of the CC1120CC1190 EM. For the expected performance when using this design under FCC Section 15.247 in the 902928 MHz frequency band, see Using the CC1190 Front End with CC112x and CC120x under FCC 15.247
(SWRA387). The CC112x family of devices is fully integrated single-chip radio transceivers designed for
high performance at very low power and low-voltage operation in cost effective wireless systems. All filters
are integrated, removing the need for costly external IF filters. The device is mainly intended for the
Industrial, Scientific and Medical (ISM) and Short Range Device (SRD) frequency bands at 164-192 MHz,
410-480 MHz and 820-960 MHz.
The CC1190 is a range extender for 850-950 MHz RF transceivers, transmitters, and System-on-Chip
(SoC) devices from Texas Instruments. It increases the link budget by providing a power amplifier (PA) for
increased output power, and a low-noise amplifier (LNA) with low noise figure for improved receiver
sensitivity in addition to switches and RF matching for simple design of high performance wireless
systems
Using the CC1190 Front End with CC112x and CC120x under FCC 15.247 (SWRA387) is also applicable
for CC1121, CC1125, and CC120x.
Figure 1. CC112x-CC1190 BoosterPack - Top Side
LaunchPad, SmartRF, BoosterPack are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
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1
Introduction
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Figure 2. CC112x-CC1190 BoosterPack - Bottom Side
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Introduction
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1.1
Acronyms and Definitions
Table 1. Acronyms and Definitions
Acronym
Definition
BP
BoosterPack
EM
Evaluation Module
FCC
Federal Communications Commission
HGM
High Gain Mode
LNA
Low Noise Amplifier
LGM
Low Gain Mode
PA
Power Amplifier
PCB
Printed Circuit Board
PER
Packet Error Rate
RF
Radio Frequency
RSSI
Receive Signal Strength Indicator
RX
Receive, Receive Mode
SRS
SmartRF Studio
TX
2
Transmit, Transmit Mode
Absolute Maximum Ratings
The absolute maximum ratings and operating conditions listed in the CC1120 data sheet [1] and the
CC1190 data sheet [3] must be followed at all times. Stress exceeding one or more of these limiting
values may cause permanent damage to any of the devices.
3
Electrical Specifications
As the CC112x-CC1190 BoosterPack performance is similar to CC1120-CC1190EM. For the detailed
electrical specifications, see [8].
3.1
Operating Conditions
Table 2. Operating Conditions
Parameter
Min
Max
Unit
Operating Frequency
850
950
MHz
Operating Supply Voltage
4.0
5.5
V
400
mA
-40
+85
°C
Operating Supply Current at 5 V
Operating Temperature
4
CC1190 Control Logic
The control logic for CC1190 for different modes are shown in Table 3.
Table 3. CC1190 Control Logic
PA_EN
LNA_EN
HGM
Mode of Operation
0
0
X
Power Down
0
1
0
RX LGM
0
1
1
RX HGM
1
0
0
TX LGM
1
0
1
TX HGM
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CC112x-CC1190 BP Control and Interface Connections
5
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CC112x-CC1190 BP Control and Interface Connections
The control and interface connector details of CC112x-CC1190 BP module is shown in Figure 3. The
CCC112x-CC1190 BoosterPack can be used with either LaunchPad or as a stand-alone module along
with SmartRF Studio. The jumpers on connectors P6 and P7 should be configured as per the requirement.
• J4 – USB Interface Connector for SmartRF Studio application
• SW1 – USB Reset Switch
• P1 – Debug (CC Debugger) Interface connector
• P2 and P3 – LaunchPad Interface Connectors
• P6 – CC1190 Control selection jumpers
• P7 – Power Supply selection jumpers
Figure 3. CC112x-CC1190 BP – Connectors
6
CC112x-CC1190 BP Interface With MSP430 LaunchPad
The CC112x-CC1190 BP module is compatible to use with the MSP-EXP430F5529 and MSPEXP430G2553 LauchPad development kits. The CC112x-CC1190 BoosterPack can be interfaced with the
LaunchPad by using the following steps.
1. Install the CC112x-CC1190 BoosterPack on to the LaunchPad as shown in Figure 4.
Figure 4. CC112x-CC1190 BoosterPack With LaunchPad
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2. Power Supply Selection:
Connector P7 on the BoosterPack is used in selecting the options for power supply.
For use with MSP-EXP430F5529 LaunchPad, place the Jumper in between P7-2 to P7-3 to select the
LaunchPad supply as the power source to the BoosterPack. The location of the connector P7 with the
jumper position is shown in Figure 5.
For use with MSP-EXP430G2553 LaunchPad, remove the Jumper from P7 and connect an external 5
V (400 mA capable) power supply Positive lead to the center pin (2) of P7 and the Ground lead to the
nearby Ground Pad.
Figure 5. PS Jumper Location for LaunchPad Application
3. CC1190 Control:
The CC1190 on the BoosterPack can be controlled directly from the LaunchPad by using the control
signals HGM, LNA_EN and PA_EN. HGM can be controlled only through hardware jumper selection
on the BoosterPak and the other two control signals LNA_EN and PA_EN can be controlled with the
combination of software from the LaunchPad and hardware jumper selection on the BoosterPack.
Connector P6 on the BoosterPack is used for CC1190 control signals selection. For the details of logic
for different modes (TX, RX and Power Down) of the CC1190 operation, see the Section 4. The
placement of jumpers on P6 is shown in Figure 6.
(a) High Gain Mode: Place Jumper on P6-1 to P6-2
(b) Low Gain Mode: Place Jumper on P6-3 to P6-4
(c) LNA_EN: Place Jumper on P6-5 to P6-6
(d) PA_EN: Place Jumper on P6-9 to P6-10
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Figure 6. CC1190 Jumper Location for LaunchPad Application
4. Connect USB cable to the MSP-EXP430F5529 [10] or MSP-EXP430G2553 [11], the LaunchPad being
used.
5. Run the program (example PER test) on the LaunchPad. For details, see the CC112x-CC1190 Boost
Software Examples (SWRA493).
7
CC112x-CC1190 BP Interface With SmartRF Studio
The CC112x-CC1190 BoosterPack can be controlled directly from SmartRF Studio 7 software [6] to
evaluate performance and functionality. The SmartRF Studio software is highly recommended for
obtaining optimum register settings. The jumpers on the connectors P6 and P7 should be configured as
per the required mode and it is shown in the following steps.
1. Connect the USB cable from the PC to the J4 of the BoosterPack as shown in Figure 7.
Figure 7. CC112x-CC1190 BP With USB Cable
2. Power Supply Selection:
Place the Jumper in between P7-1 to P7-2 to select the USB supply as the power source for the
BoosterPack. The location of P7 with Jumper position is shown in Figure 8.
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Figure 8. PS Jumper Location for SmartRFStudio Application
3. CC1190 Control:
The CC1190 on the BoosterPack can be controlled directly from the SmartRF Studio. Connector P6 on
the BoosterPack is used for CC1190 control signals selection. Refer to CC1190 Control Logic section
for the details of logic for different modes (TX, RX and Power Down) of CC1190 operation. HGM,
LNA_EN and PA_EN control signals are used to control CC1190. HGM can be controlled only through
hardware jumper selection on the BoosterPak and the other two control signals LNA_EN and PA_EN
can be controlled with the combination of Register settings from the SmartRF Studio and hardware
jumper selection on the BoosterPack. The Jumper configurations for different modes of operations are
shown below.
4. Transmit Continuous Mode:
Place the Jumpers as shown below:
(a) High Gain Mode: Place Jumper on P6-1 to P6-2
(b) Low Gain Mode: Place Jumper on P6-3 to P6-4
(c) LNA_EN: Place Jumper on P6-7 to P6-8 and set IOCG2 = 0x33 on SRS
(d) PA_EN: Place Jumper on P6-11 to P6-12 and set IOCG0 = 0x73 on SRS
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Figure 9. CC1190 Jumper Placement for TxCont -SRS Application
5. Receive Continuous Mode:
Place the Jumpers as shown below:
(a) High Gain Mode: Place Jumper on P6-1 to P6-2
(b) Low Gain Mode: Place Jumper on P6-3 to P6-4
(c) LNA_EN: Place Jumper on P6-7 to P6-8 and set IOCG2 = 0x73 on SRS
(d) PA_EN: Place Jumper on P6-11 to P6-12 and set IOCG0 = 0x33 on SRS
Figure 10. CC1190 Jumper Placement for RxCont -SRS Application
6. Transmit Packet Mode:
Place the Jumpers as shown below:
(a) High Gain Mode: Place Jumper on P6-1 to P6-2
(b) Low Gain Mode: Place Jumper on P6-3 to P6-4
(c) LNA_EN: Place Link on P6-4 to P6-5 (in high-gain mode)
(d) LNA_EN: Place Link on P6-1 to P6-5 (in low-gain mode)
(e) PA_EN: Place Jumper on P6-11 to P6-12
(f) Register settings on SRS: Default settings
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Figure 11. CC1190 Jumper Placement for Tx Packet Mode -SRS
7. Receive Packet Mode:
Place the Jumpers as shown below:
(a) High Gain Mode: Place Jumper on P6-1 to P6-2
(b) Low Gain Mode: Place Jumper on P6-3 to P6-4
(c) LNA_EN: Place Jumper on P6-3 to P6-5 (in high-gain mode)
(d) LNA_EN: Place Link on P6-2 to P6-5 (in low-gain mode)
(e) PA_EN: Place Jumper on P6-11 to P6-12
(f) Register settings on SRS: Default settings
Figure 12. CC1190 Jumper Placement for Rx Packet Mode -SRS
7.1
SmartRF Studio Configuration
The CC1120-CC1190 BoosterPack can be configured using the SmartRF Studio 7 software [6]. The
SmartRF Studio software is highly recommended for obtaining optimum register settings. Use the
following steps:
1. Open SmartRFStudio on the PC. It shows "CC112x" in the List of Connected Devies Window. A
screen shot of SRS window is shown in Figure 13.
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Figure 13. SmartRF Studio Window
2. Double Click on CC112x (in List of connected devices in SRS window).
3. It opens up another window called “Device Control Panel”, which is shown in Figure 14.
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Figure 14. Device Control Panel Window –SmartRF Studio
4. Follow the steps 1 through 6 in the same order as shown in figure 14.
(a) Step-1 – Select Range Extender (CC1190) option.
(b) Step-2 – Select Mode – Packet Tx for Transmit board and Packet Rx for Receive board.
(c) Step-3 – Select Typical Setting – For example 300 bps.
(d) Step-4 – Select Carrier Frequency – For example 915 MHz.
(e) Step-5 – Select the Number of packets to be sent or Received, for example, Infinite.
(f) Step-6 – Click on the “Start” button either for Transmit or Receive.
(g) Tx Status or Rx status can be seen in the status area, for example, Tx Status.
(h) Receive packets can be seen Receive packets window.
8
Reference Design
The CC1120-CC1190 BoosterPack reference design includes schematic and gerber files [4]. The same
design can be used for both 915 MHz and 868 MHz applications with different bill of materials. The same
design can also be used for SigFox applications in 915 MHz frequency band with different bill of materials.
It is highly recommended to follow the reference design for optimum performance. The reference design
also includes bill of materials with manufacturers and part numbers.
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Reference Design
8.1
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Power Decoupling
Proper power supply decoupling must be used for optimum performance. The capacitors C31, C32 and
C33 ensure good RF ground after L7 and thus prevent RF leakage into the power supply lines causing
oscillations. The power supply filtering consisting of C27, C28 and L4 ensure well defined impedance
looking towards the power supply.
8.2
Input/Output Matching and Filtering
The PA and the LNA of the CC1190 are single ended input/output. A balun is required to transform the
differential LNA input of the CC112x to single ended output of the CC1190 PA. The values of the matching
components between the SAW filter and the CC1190 PA input are chosen to present optimum source
impedance to the CC1190 PA input with respect to stability.
The resistive pad (12dB) in between the PA output of CC112x to the input of the Balun is an option for
SigFox application. This pad allows the use of higher power levels from CC112x to drive CC1190 in order
to use the fine resolution power step sizes available at higher power levels of CC112x in adjusting the
output power of CC1190. The power level should be set to high on CC112x, when this module used for
SigFox application. This resistive pad is not required for applications other than SigFox.
The CC1190 PA performance is highly dependent on the impedance presented at the output, and the LNA
performance is highly dependent on the impedance presented at the input. The impedance is defined by
L7 and all components towards the antenna. These components also ensure the required filtering of
harmonics to pass regulatory requirements.
The layout and component values need to be copied exactly to obtain the same performance as
presented in this application report.
8.3
Bias Resistor
R11 is a bias resistor. The bias resistor is used to set an accurate bias current for internal use in the
CC1190.
8.4
SAW Filter
A SAW is recommended for the CC112x-CC1190 BoosterPack design to attenuate spurs below the carrier
frequency that will otherwise violate spurious emission limits under Section 15.209 and 15.205 The SAW
filter is matched to the CC1190 PA input/LNA output impedance using a series inductor and a shunt
capacitor.
8.5
Debug Connector
Debug connector P1 can be used to interface with CC Debugger and to flash CC2511 with the USBBootloader program.
8.6
Reset Switch
Reset switch SW1 can be used to reset the USB port of the BoosterPack.
8.7
PCB Layout Considerations
The Texas Instruments reference design uses a 1.24 mm (0.049”) 4-layer PCB solution. Note that the
different layers have different thickness. It is recommended to follow the recommendation given in the
CC1120–CC1190 BoosterPack reference design [4] to ensure optimum performance.
The top layer is used for components and signal routing, and the open areas are filled with metallization
connected to ground using several vias. The areas under the two chips are used for grounding and must
be well connected to the ground plane with multiple vias. Footprint recommendation for the CC1190 is
provided in the CC1190 data sheet [3].
Layer two is a complete ground plane and is not used for any routing. This is done to ensure short return
current paths. The low impedance of the ground plane prevents any unwanted signal coupling between
any of the nodes that are decoupled to it.
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Layer three is a mixed plane. The power supply and some of the digital lines are routed on this layer.
Wider traces were used for power supply routing. The open areas are filled with metallization connected to
ground using several vias.
Layer four is used for routing, and as for layer one, open areas are filled with metallization connected to
ground using several vias.
8.8
Shielding
RF shielding is necessary to keep the radiated harmonics below the regulatory limits.
9
References
1. CC1120 High-Performance RF Transceiver for Narrowband Systems Data Sheet (SWRS112)
2. CC112X/CC1175 Low-Power High Performance Sub-1 GHz RF Transceivers/Transmitter User's Guide
(SWRU295)
3. CC1190 850 – 950 MHz RF Front End Data Sheet (SWRS089)
4. CC112x–CC1190 BoosterPack 915/868 MHz Reference Design (SWRR145)
5. CC1120_CC1190EM 915MHz Reference Design 1.0.1 (SWRR089)
6. CC1120-CC1190EM868 Reference Design (SWRR092)
7. CC112x-CC1190 Boost Software Examples (SWRA493)
8. Using the CC1190 Front End With CC112x and CC120x Under FCC 15.247 (SWRA387)
9. CC Debugger User's Guide (SWRU197)
10. MSP430F5529 LaunchPad™ Development Kit (MSP‑EXP430F5529LP) User's Guide (SLAU533)
11. MSP-EXP430G2 LaunchPad Evaluation Kit User's Guide (SLAU318)
12. FCC Rules
13. SmartRF Studio 7 v1.18.0 (SWRC176)
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•
•
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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