Computer-On-Modules Industrial Mainboards

Computer-On-Modules Industrial Mainboards
Intelligent Solutions
Computer-On-Modules
Industrial Mainboards
Edition | 2014/15
Technology Partners
MSC Technologies
at a Glance
Content
MSC is a premier partner of Intel® and AMD,
and as a result has early access to design data
MSC Technologies
|
3
for all new microprocessor generations. Based
on latest silicon technology, MSC is developing
Solution Concepts
|
4
cutting-edge solutions for COM Express, Qseven and ETX module products which we produce
Internet of Things
|
5
in our own factories. Under our lifecycle management we have full control of our embedded
COM-Module
products’ long life support.
Selector
The Embedded Boards Solutions unit within
But the computing board is only the beginning:
MSC Technologies is specializing in the design
MSC is offering a wide choice of TFT displays,
and production of highly integrated standard
touch solutions, DRAM and Flash memory
board-level products as well as customer-spe-
modules and cards as well as wireless interface
cific board solutions. The standard embedded
solutions. This way MSC represents a one-stop
COM products (Computer-On-Module) are
shopping partner offering our customers the
available in a variety of variants and versions,
full solution to their electronic requirements.
but also can be easily customized to satisfy the
|12
requirements of volume OEM customers.
Vertical Market Solutions
MSC’s components and board-level products
Next to x86 technologies, our Qseven and
COM Express™
| 8-15
nanoRISC modules also utilize ARM products
®
from Freescale™ and Texas Instruments. Our
Qseven™
|16-23
partnership with BIOS/UEFI vendor AMI has
augmented our in-house software engineering
ETX |24-25
®
nanoRISC ®
|26-28
trial and Building Automation, Medical, POS/
from some of the world’s leading computer
POI and Signage, Transportation/Logistics,
board manufacturers. Before becoming part
Energy, Automotive and Mobile Devices as well
of our board-level offering, these boards had
as in Gaming applications.
design and production quality, high level of
Design and Production
Expertise
|29-30
Synergy at Work
MSC is entering our customers‘ development
We are cooperating with the leading industrial
single-board manufacturers of the world and
BIOS and
have selected their highest quality, long-term
Secure Boot
cycles where they want us to. We can provide
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31
just a COM module so that the target system can
start with a proven, functional computing building
available boards to offer to our customers as
part of our embedded products' portfolio.
MSC is offering single-board computers (SBC)
support and long-term availability.
the source code which is a key incentive for
choosing our products.
and custom developments are used in Indus-
to pass a meticulous selection process for their
capabilities and competencies in the BIOS/
UEFI development including customization of
To complement our range of COM products,
block, or we can custom-design a complete sub-
Industrial Mainboard
Selector
|32-22
system based on the customer‘s requirements.
Industrial
Mainboards
2 | www.msc-technologies.eu
|34-38
3
Solution
Concepts
MSC Technologies – The Solution Company
Standard, Customized
In the Embedded Boards Unit of MSC Tech-
and Full-Custom Baseboard
nologies, we can provide a wide choice of
Along with our families of Computer-On-Mod-
solutions for the electronic needs of our
ule products, we are offering a number of
customers. We will help our customers to find
carefully designed Evaluation Boards and
the solution to their requirements quickly,
Application Boards which are meant to be used
help them to bring it to their market first, and
for laboratory tests as well as standard carrier
provide world-class support during and after
boards for applications in which the design
the development phase. MSC has been in the
of a specialized carrier board is not foreseen.
electronic development industry for many
From a certain minimum production volume,
decades, and has several design groups of ex-
MSC is offering to custom-populate these car-
perienced engineers doing hardware and soft-
rier boards or even perform a customization
ware (BIOS, Firmware, Drivers) design. We are
in the design thereby adapting the standard
working at the forefront of technology and
board to better suit the target application. For
have a stack of proven modular building blocks
some cases a full-custom development of a
Industry 4.0
the same giving the system designer the option
for any new design at hand which will reduce
COM carrier board may be required, and again
A Subset of the Internet of Things
to upgrade/downgrade the system in order to
development time and risk.
MSC will consider such a design if certain pro-
As the world becomes networked and things
achieve different price/performance points.
duction volume criteria are met or exceeded.
become intelligent, the production processes in
COM – Computer-On-Module
Internet of Things
the industrial environment will gain vastly from
Local Intelligence
Our COM products are based on open stan-
SBC – Industrial Single-Board-Computer
the growth of information sharing and active
The Internet of Things would be impossible
dards and modular designs, and effectively
Clearly COM is the more flexible and elegant
control cut-through. The Intelligent Factory, as
without intelligent “things“, and that means
simplify any system design and integration.
approach, but there are many applications
depicted in the above drawing, is merely a part of
computing devices inside the network nodes
COM products enable the system designer
where the solution has to be a single board, and
the intelligent world and seamlessly blends into
which are sensors, actors, information collec-
to focus on the end products. As a founding
therefore MSC is providing a wide selection of
the networked world of the Internet of Things.
tors or decision makers in control of larger ma-
Member of the SGeT.org consortium, MSC is
high-quality embedded SBCs in the most
actively driving new standards enabling further
popular formats, as well as the accessories to
Scalability
large and powerful computer will be required
advances in COM technologies. MSC is commit-
put them at work most efficiently. From ATX
Only Computer-On-Module solutions come
or a small system consuming little power and
ted to open specifications such as Qseven™
format to Pico-ITX, we can provide a suitable
with built-in scalability of performance, power
generating little heat.
and is an executive member of the PCI Indus-
solution offering the right computing perfor-
and cost. COM boards will be plugged on a car-
trial Computer Manufacturer Group (PICMG),
mance, power consumption and cost to suit the
rier board which adapts the I/O of the COM to
With our COM products used for either alterna-
an organization promoting open industry stan-
applications‘ requirements.
the local environment. This board can remain
tive, a wide choice of computing power classes
dards like COM Express™. COM products are
the same even if the computer module gets
exists which can reach up to high-performance
designed for reliability, 24/7 operation, quality,
swapped to a similar one with more/less com-
multi-core engines and down to very small,
longevity and for industrial OEM applications.
puting performance and likewise more/less pow-
power-nibbling microcomputer boards. Similar-
er consumption and related cost. In most cases,
ly, Single-Board Computers are available giving
even the software of the system can remain
a wide choice of power and performance.
4 | www.msc-technologies.eu
chines. Depending on the task to perform, a
5
COM-Module
Selector
CPU Range
CPU Cores
max. Memory
Extension Bus Support
Specials
OS Support
Module Size
(mm)
Typ. Power
Dissipation (W)
Performance
Module Standard
C6B-8S
Intel® Core™ i3, i5, i7, Intel® Celeron® (4th generation)
1.5 – 3.4 GHz
2 /4
16 GB DDR3L
SO-DIMM
PCI Express™
TPM 1.2, 4K resolution
supported, ISF ready
Windows® 7, 8, Linux
95 x 125
35 / 55
High
COM Express™ Type 6
9
CXB-8S
Intel® Core™ i3, i5, i7, Intel® Celeron® (4th generation)
1.5 – 3.4 GHz
2 /4
16 GB DDR3L
SO-DIMM
PCI Express™, PCI
TPM 1.2
4K resolution supported
Windows® 7, 8, Linux
95 x 125
35 / 55
High
COM Express™ Type 2
9
C6B-7S
Intel® Core™ i3, i5, i7, Intel® Celeron® (3rd generation)
1.0 – 2.7 GHz
1/2 /4
16 GB DDR3
SO-DIMM
PCI Express™
TPM 1.2
Windows® 7, 8, XP, Linux
95 x 125
25 / 65
High
COM Express™ Type 6
10
CXB-6SI
Intel® Core™ i3, i5, i7 (3rd generation)
1.6 – 2.7 GHz
2/4
16 GB DDR3
SO-DIMM
PCI Express™, PCI
TPM 1.2
Windows® 7, 8, XP, Linux
95 x 125
35 / 65
High
COM Express™ Type 2
10
C6C-BT
Intel® Atom™ E38xx, Celeron® N2920, J1900
1.33 - 2.42 GHz
1/2/4
8 GB DDR3L
SO-DIMM
PCI Express™
TPM 1.2 MicroSD socket
Windows® 7, 8, Linux
95 x 95
8 / 14
Medium
COM Express™ Type 6
11
CXC-BT
Intel® Atom™ E38xx, Celeron® N2920, J1900
1.33 - 2.42 GHz
1/2/4
8 GB DDR3L
SO-DIMM
PCI Express™, PCI
TPM 1.2, MicroSD socket
Windows® 7, 8, Linux
95 x 95
8 / 14
Medium
COM Express™ Type 2
11
C6C-GX
AMD G-Series SOC
1.0 - 2.0 GHz.
2/4
16 GB DDR3
SO-DIMM
PCI Express™
TPM 1.2, MicroSD socket
Windows® 7, 8, Linux
95 x 95
12 /30
Medium
COM Express™ Type 6
12
C6C-A7
AMD R-Series (R-460L, R-452L, R-260H, R252L)
1.6 - 2.8 GHz
2/4
16 GB DDR3
SO-DIMM
PCI Express™
TPM 1.2, MicroSD socket
4K resolution supported
Windows® 7, 8, XP, Linux
95 x 95
25 / 35
High
COM Express™ Type 6
12
CXC-PV525
Intel® Atom™ D525 1.8 GHz
N455 1.66 GHz
2
1
2 / 4 GB DDR3
SO-DIMM
PCI Express™, PCI
TPM 1.2, SATA Flash
Windows® 7, XP
Windows® EC7, Linux
95 x 95
8 / 15
Medium
COM Express™ Type 2
13
C10M-BT
Intel® Atom™ E38xx, Celeron® N2920, J1900
1.33 - 2.42 GHz
1/2/4
8 GB DDR3L soldered
ECC opt.
PCI Express™
TPM 1.2, eMMC
Windows® 7, 8, Linux
55 x 84
8 / 14
Medium
COM Express™ Type 10
13
Intel® Atom™ E38xx SOC
E3845 1.91GHz, E3827 1.75GHz, E3826 1.46GHz,
E3825 1.33GHz, E3815 1.46GHz
1/2/4
8 GB DDR3L soldered
ECC opt.
PCI Express™
TPM 1.2
SATA Flash
eMMC Flash
Windows® 7, 8, Linux
Windows® EC7
70 x 70
6/12
Medium
Qseven 2.0
17
Freescale® i.MX6 0.8 / 1.2GHz
1/2/4
4 GB DDR3 soldered
PCI Express™
TPM 1.2, SATA Flash
Linux, Windows® EC7
70 x 70
4/7
Medium
Qseven 1.2 / 2.0
17
Q7-TI8168
Texas Instruments DM8168
1.2 GHz
1 + DSP
1 GB DDR3 soldered
PCI Express™
DSP C674x compliant
SATA Flash, Flash, Ext. Temp.
Linux, Android
70 x 70
9
Medium
Qseven 1.2
18
Q7-A50M
AMD G-Series
T40E/T40R 1.0GHz, AMD G-T16R 615MHz
2
4 GB DDR3 soldered
PCI Express™
TPM 1.2
SATA Flash
Windows® 7, 8, XP, Linux
70 x 70
8/9
Medium
Qseven 1.2
18
Q7-TCTC-FD
Intel® Atom™ E6x0
0.6 - 1.6 GHz
1
2 GB DDR2 soldered
PCI Express™
TPM 1.2, CAN, SATA, Flash,
Ext. temp.
Windows® 7, XP, Linux
70 x 70
7
Entry / Medium
Qseven 1.2
19
ETE-PV510
Intel® Atom™ D510 1.66 GHz
N450 1.66 GHz
2
1
2 GB DDR2
SO-DIMM
PCI, ISA
SATA, PATA
6x USB
Windows® 7, XP
Windows® EC7, Linux
95 x 114
8 / 15
Medium
ETX 3.2
25
ETE-GLX3
AMD Geode
LX800 @ 0.9 W, 500 MHz
1
1 GB DDR SO-DIMM
PCI, ISA (subset)
SATA, PATA CF socket
Windows® 7, XP
Windows® EC7, Linux
95 x 114
5.5
Entry
ETX 3.2
25
Freescale® i.MX6, 0.8 / 1.2GHz
1/2/4
4 GB DDR3 soldered
Processor Bus
eMMC, MicroSD socket, NAND Linux, Windows® EC7
Flash, Ext. Temp
50 x 70
4/7
Medium
nanoRISC
27
Texas Instruments AM335x, 300 - 800 MHz
1
512 MB DDR2 soldered
Processor Bus
NAND Flash
CAN, µSD Slot, Ext. temp
50 x 70
2.5
Entry
nanoRISC
27
Product Name
Page
COM Express™ Family
Qseven™ Family
Q7-BT
Q7-IMX6
ETX®/ET(e) Family
nanoRISC® Family
nanoRISC-IMX6
nanoRISC-AM335X
6 | www.msc-technologies.eu
Linux
7
COM Express™
MSC C6B-8S
Intel® Core™ - 4th Generation
NEW
Type 6
95 x 125
35 / 55 W
Based on Intel’s 4th generation Core™ processors this Type 6 COM Express module supports
the latest digital display interfaces like DisplayPort, HDMI and DVI and controls up to three
independent displays. USB 3.0 interfaces connect to the fastest peripheral devices available.
Highlights
• Intel® Core™ i7-4700EQ (quad-core, 2.4/3.4GHz)
• Four SATA mass storage interfaces, up to 6Gb/s
• Intel Core™ i5-4400E (dual-core, 2.7/3.3GHz)
• Three DisplayPort/HDMI/DVI interfaces
• Intel Core™ i5-4402E (dual-core, 1.6/2.7GHz)
• Two Embedded DisplayPort interfaces
• Intel Core™ i3-4100E (dual-core, 2.4GHz)
• LVDS (24 Bit, dual channel) and CRT interface
• Intel Core™ i3-4102E (dual-core, 1.6GHz)
• Triple independent display support
• Intel Celeron 2000E (dual-core, 2.2GHz)
• DirectX 11.1, OpenGL 3.2, OpenCL 1.2
• Intel Celeron 2002E (dual-core, 1.5GHz)
• Resolution up to 3800 x 2400
• Intel HD Graphics GT1/GT2
• Seven PCI Express™ x1 lanes
• Intel 8-Series chipset
• Four USB 3.0 and four USB 2.0 interfaces
• Up to 16GB DDR3L-1600 SDRAM, dual-channel
• Trusted Platform Module
®
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MSC CXB-8S
Intel® Core™ - 4th Generation
NEW
Type 2
COM Express™
95 x 125
35 / 55 W
Also based on Intel’s 4th generation Core™ processors this COM Express module with Type 2
pin-out has been designed as an upgrade product for exisiting system designs still using legacy
interfaces like PCI bus and PATA.
COM Express™ was defined by the PICMG (PCI
adopted and the support for USB 3.0, PCI Ex-
Industrial Computer Manufacturers Group) as an
press™ Gen 2 and additional digital display inter-
Highlights
open specification without hidden hooks. Hence,
faces has been included. Most of these changes
• Intel® Core™ i7-4700EQ (quad-core, 2.4/3.4GHz)
• Up to four SATA 6Gb/s mass storage interfaces
this standard is supported by a large number
require new pin-outs, like Type 6 and Type 10.
• Intel Core™ i5-4400E (dual-core, 2.7/3.3GHz)
• One PATA/IDE mass storage interface
• Intel Core™ i5-4402E (dual-core, 1.6/2.7GHz)
• LVDS (24 Bit, dual-channel) and CRT interface
®
of suppliers offering interchangeability of their
®
®
COM Express™ products. The latest revisions in-
MSC has introduced products based on these
• Intel Core™ i3-4100E (dual-core, 2.4GHz)
• Triple independent display support (option)
troduced various changes in the COM Express
new pin-outs while still offering new technolo-
• Intel Core™ i3-4102E (dual-core, 1.6GHz)
• DirectX 11.1, OpenGL 3.2, OpenCL 1.2
standard. New module formats have been
gies on Type 2 products as well.
• Intel Celeron 2000E (dual-core, 2.2GHz)
• Resolution up to 3800 x 2400
• Intel Celeron 2002E (dual-core, 1.5GHz)
• PCI Bus, six PCI Express x1 lanes
• Intel HD Graphics GT1/GT2
• Eight USB 2.0 interfaces
• Intel 8-Series chipset
• Trusted Platform Module
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• Up to 16GB DDR3L-1600 SDRAM, dual-channel
8 | www.msc-technologies.eu
9
COM Express™
COM Express™
MSC C6B-7S
MSC C6C-BT
Intel Core™ - 3rd Generation
Intel® Atom™ / Celeron® SOC
Type 6
Type 6
®
95 x 125
25 / 65 W
Based on Intel’s 3rd generation Core™ processors this Type 6 COM Express module supports
the latest digital display interfaces, up to three independent displays and USB 3.0. Ultra-low
power variants with only 17W CPU power dissipation allow passively cooled system designs.
95 x 95
8 / 14 W
NEW
Based on Intel‘s multi-core system-on-chip (SOC) Atom generation this COM Express Type 6
module brings display interfaces like DisplayPort, HDMI 1.4a and DVI, supports dual independent
displays, USB 3.0 and fast DDR3L memory on a compact, power saving and cost-efficient module.
-40 +85 °C
Highlights
Highlights
• Intel Core™ i7-3612QE (quad-core, 2.1GHz)
• Up to 16GB DDR3-1600 SDRAM, dual channel
• Intel Atom E3845 quad-core 1.91GHz, 10W TDP
• Up to 8GB DDR3L SDRAM, dual-channel
• Intel Core™ i7-3615QE (quad-core, 2.3GHz)
• Three DisplayPort/HDMI/DVI interfaces
• Intel Atom E3827 dual-core 1.75GHz, 8W TDP
• Two SATA 3Gb/s mass storage interfaces
• Intel Core™ i7-3555LE (quad-core, 2.5GHz)
• Two Embedded DisplayPort interfaces
• Intel Atom E3826 dual -core 1.46GHz, 7W TDP
• MicroSD card socket
• Intel Core™ i7-3517UE (dual-core, 1.7GHz)
• LVDS (24 Bit, dual channel) and CRT interface
• Intel Atom E3825 dual -core 1.33GHz, 6W TDP
• DisplayPort/HDMI/DVI interface
• Intel Core™ i5-3610ME (dual-core, 2.7GHz)
• Triple independent display support
• Intel Atom E3815 single-core 1.46GHz, 5W TDP
• LVDS/Embedded DisplayPort interface
• Intel Core™ i3-3120ME (dual-core, 2.4GHz)
• DirectX 11, OpenGL 3.1, OpenCL 1.1
• Intel Celeron N2920
• VGA interface
• Intel Core™ i3-3217UE (dual-core, 1.6GHz)
• Resolution up to 2560 x 1600
• Intel Celeron 1020E (dual-core, 2.2GHz)
• Seven PCI Express x1 lanes, four SATA-300
• Intel Celeron 1047UE (dual-core, 1.4GHz)
• Four USB 3.0 and four USB 2.0 interfaces
• Intel Celeron 927UE (single-core, 1.5GHz)
• Trusted Platform Module
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quad-core 1.86/2.00GHz, 7.5W TDP
• Intel Celeron J1900
quad-core 2.00/2.42GHz, 10W TDP
• Integrated Intel Gen. 7 HD graphics
MSC CXB-6SI
MSC CXC-BT
Intel Core™ - 3rd Generation
Intel® Atom™ / Celeron® SOC
Type 2
Type 2
®
95 x 125
25 / 65 W
This COM Express module family with Type 2 pin-out is based on Intel’s 3rd generation Core™
processors and has been designed as an upgrade product for exisiting system designs still
using legacy interfaces like PCI bus and PATA. Ultra-low power variants with only 17W CPU
power dissipation allow passively cooled system designs.
95 x 95
8 / 14 W
• Two independent displays supported
• DirectX 11.1, OpenGL 3.2, OpenCL 1.1
• One USB 3.0 and up to seven USB 2.0 interface
• Trusted Platform Module (option)
NEW
Also based on Intel’s multi-core system-on-chip (SOC) Atom generation this compact COM
Express module with Type 2 pin-out has been designed as an upgrade product for exisiting
system designs still using legacy interfaces like PCI bus and PATA.
-40 +85 °C
Highlights
Highlights
• Intel Atom E3845 quad-core 1.91GHz, 10W TDP
• Up to 8GB DDR3L SDRAM, dual-channel
• Intel Core™ i7-3612QE (quad-core, 2.1GHz)
• Up to 16GB DDR3-1600 SDRAM, dual channel
• Intel Atom E3827 dual-core 1.75GHz, 8W TDP
• One (two) SATA 3Gb/s mass storage interface
• Intel Core™ i7-3615QE (quad-core, 2.3GHz)
• Four SATA-300, one PATA mass storage interfaces
• Intel Atom E3826 dual -core 1.46GHz, 7W TDP
• One (zero) PATA/IDE mass storage interface
• Intel Core™ i7-3555LE (quad-core, 2.5GHz)
• LVDS (24 Bit, dual channel) and CRT interface
• Intel Atom E3825 dual -core 1.33GHz, 6W TDP
• MicroSD card socket
• Intel Core™ i7-3517UE (dual-core, 1.7GHz)
• Triple independent display support
• Intel Atom E3815 single-core 1.46GHz, 5W TDP
• LVDS 24bit, dual-channel
• Intel Core™ i5-3610ME (dual-core, 2.7GHz)
• DirectX 11, OpenGL 3.1, OpenCL 1.1
• Intel Celeron N2930
• VGA interface
• Intel Core™ i3-3120ME (dual-core, 2.4GHz)
• Resolution up to 2560 x 1600
• Intel Core™ i3-3217UE (dual-core, 1.6GHz)
• PCI Bus, five PCI Express x1 lanes
• Intel Celeron 1020E (dual-core, 2.2GHz)
• Eight USB 2.0 interfaces
• Intel Celeron 1047UE (dual-core, 1.4GHz)
• Trusted Platform Module
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quad-core 1.83/2.16GHz, 7.5W TDP
• Intel Celeron J1900
quad-core 2.00/2.42GHz, 10W TDP
• Integrated Intel Gen. 7 HD graphics
• Two independent displays supported
• DirectX 11.1, OpenGL 3.2, OpenCL 1.1
• Eight USB 2.0 interfaces
• Trusted Platform Module (option)
• Intel Celeron 927UE (single-core, 1.5GHz)
®
10 | www.msc-technologies.eu
®
11
COM Express™
COM Express™
MSC C6C-GX
ded Solutions
n Graphics
Intel Atom™ Single-/Dual-Core
Type 6
Type 2
Segments: Embedded and Server
This compact COM Express
Type 6 module is based on AMD‘s Embedded G-Series SOC platform,
Opteron
95 x 95
Embedded
a high-performance, low-power System-on-Chip solution with outstanding HD graphics and
12 / 30 W
-40
+85 °C
Embedded Solutions
53120B
multimedia capabilities. The power saving and cost-efficient module offers dual independent
Embedded Solutions
“R” Series X
53057B
95 x 95
8 / 15 W
(showcase specific Opteron X86
technology platform)
Embedded Solutions
“G” SeriesB
Embedded Solutions
Geode
Radeon HD 8400E
• AMD GX-415GA quad-core 1.5GHz, 15W TDP,
Radeon HD 8330E
Embedded Solutions
Radeon Graphics
53121B
• AMD GX-217GA dual-core 1.65GHz, 15W TDP,
Embedded Solutions
Opteron X
53116B
Embedded Solutions
Opteron A
(For future use)
Radeon
HD 8280E
• AMD GX-210HA dual-core 1.0GHz, 9W TDP,
Radeon HD 8310E
(For future use)
Highlights
• Intel Atom™ N455 (1.66GHz, single-core)
• Two SATA 3Gb/s mass storage interfaces
• Integrated Intel GMA 3150
• MicroSD card socket
• Intel ICH8M I /O controller hub
• DisplayPort/HDMI/DVI interface
• Up to 4 GB DDR3 SDRAM
• Five PCI Express™ x1 lanes
• LVDS/Embedded DisplayPort interface
• Three SATA-300, one PATA interfaces
• Eight USB 2.0 interfaces
• VGA interface
• Dual independent display supported
®
®
resolution up to 1366 x 768
• CRT interface,
resolution up to 2048 x 1536
• Two independent displays supported
PAGE 12
MSC C6C-A7
MSC C10M-BT
AMD Embedded R-Series
Intel® Atom™ / Celeron® SOC
Type 6
Type 10
Based on AMD‘s Embedded R-Series platform this compact COM Express Type 6 module offers
95 x 125
25 / 35 W
unprecedented integrated graphics and multi-display capabilities. It brings quad independent
display support, DirectX 11 and USB 3.0. Turbo overclocking and accelerated video encoding /
decoding support graphics- and video-centric applications.
Opteron
Highlights
Embedded Solutions
“R” Series A
Opteron Family
53117B
Radeon HD 7620G
Opteron X
53118B
(showcase specific Opteron X86
technology platform)
Opteron A
53119B
(For future use)
• AMD R-252F dual-core 1.7/2.3GHz, 17W TDP ,
Radeon HD 7400G
Embedded Solutions
Geode
• AMD R-452L quad-core 1.6/2.4GHz, 19W TDP,
Radeon HD 7600G
• AMD R-260H dual-core 2.1/2.6GHz, 17W TDP,
Radeon HD 7500G
Embedded Solutions
Opteron A
(For future use)
8 / 14 W
-40 +85 °C
Based on Intel‘s multi-core system-on-chip (SOC) Atom generation this COM Express Type 10 module brings dual independent display support, DirectX 11.1 and fast DDR3L memory on a very compact, power saving and cost-efficient COM Express Mini module. The rugged design with soldered
memory, optional ECC support and extended temperature range opens new application areas.
• Four SATA-300 mass storage interfaces
• Intel Atom E3845 quad-core 1.91GHz, 10W TDP
• Up to 8GB DDR3L SDRAM (ECC option)
• MicroSD card socket, bootable
• Intel Atom E3827 dual-core 1.75GHz, 8W TDP
• Two SATA 3Gb/s mass storage interfaces
• Three DisplayPort/HDMI/DVI interfaces
• Intel Atom E3826 dual -core 1.46GHz, 7W TDP
• eMMC SSD (optional)
• LVDS/Embedded DisplayPort interface
• Intel Atom E3825 dual -core 1.33GHz, 6W TDP
• DisplayPort/HDMI/DVI interface
• VGA interface
• Intel Atom E3815 single-core 1.46GHz, 5W TDP
• LVDS/Embedded DisplayPort interface
• Four independent displays supported
• Intel Celeron N2930
• VGA interface
• DirectX 11, OpenGL 4.2, OpenCL 1.1
• Resolution up to 4000 x 2000 @ 30 Hz
• Integrated AMD HD 7000G graphics
• Six PCI Express x1 lanes
• Up to 16GB DDR3-1333 SDRAM, dual-channel
• Four USB 3.0 and four USB 2.0 interfaces
12 | www.msc-technologies.eu
55 x 84
NEW
Highlights
• AMD R-460L quad-core 2.0/2.8GHz, 25W TDP,
Embedded Solutions
Opteron X
53116B
• LVDS interface (18 bit, single-channel),
• Up to 16GB DDR3 SDRAM, dual-channel
®
• Two USB 3.0 and six USB 2.0 interfaces
AMD PRODUCT BADGE GUIDELINES
Embedded Solutions
“G” SeriesB
legacy interfaces like PCI bus and PATA.
• DirectX 11.1, OpenGL 4.2, OpenCL 1.2
• Integrated AMD HD 8000E graphics
Embedded Solutions
“R” Series X
53057B
offering dual-core computing performance at low power consumption. The design supports
• Intel® Atom™ D525 (1.8GHz, dual-core),
• AMD GX-420CA quad-core 2.0GHz, 25W TDP,
Embedded Solutions
“G” Series X
53058B
The COM Express Type 2 module is based on Intel‘s second generation Atom™ CPU technology
Embedded Solutions
Family fast DDR3
Opteron X memory and
Opteron AUSB 3.0.
display
support, DirectXOpteron
11.1,
“R” Series A
53117B
53118B
53119B
Highlights
bedded
dded Solutions
ies X
B
NEW
AMD Embedded G-Series SOC
gments: Embedded and Server
dded Solutions
B
MSC CXC-PV525
quad-core 1.83/2.16GHz, 7.5W TDP
• Intel Celeron J1900
quad-core 2.00/2.42GHz, 10W TDP
• Integrated Intel Gen. 7 HD graphics
• Two independent displays supported
• DirectX 11.1, OpenGL 3.2, OpenCL 1.1
• One USB 3.0, up to seven USB 2.0 interfaces
• Trusted Platform Module (option)
13
COM Express™
305 x 244
COM Express™
MSC C6-MB-EVA
MSC C6-SK
Evaluation Motherboard
Starterkit for COM Express
Type 6
Type 6
This versatile carrier board was designed for evaluation, prototyping and software development.
The COM Express Starterkit for Type 6 modules is available for the whole range of MSC’s Type 6
It provides the interface infrastructure for COM Express Type 6 modules and offers various PC
product portfolio and contains all necessary products to quickly enable the user to run and eval-
type connectors for external access.
uate COM Express Type 6 modules. The kit does not contain a COM Express module in order to
give the user greater flexibility as to which particular module version and CPU core and speed
variant is desired.
Highlights
• Socket for COM Express Type 6 modules in
• LVDS interface
• Embedded DisplayPort connector
Highlights
• One PCI Express x4 slot
• HD audio codec; six audio jacks and SPDIF
• COM Express Type 6 baseboard
• VGA / DVI connector
• Four PCI Express x1 slots
• LAN interface
• 2x 4GB DDR3 SO-DIMM memory modules
• Baseboard size 184 x 140 mm
• One PCI Express x16 PEG slot
• mSATA and Mini PCI Express sockets
• Active heatsink with fan for COM Express
• Getting Started Manual with download links
• Four SATA connectors
• Various additional COM Express specific interfaces
• Type 6 module socket (Basic or Compact)
• Four USB 3.0, four USB 2.0 interfaces
• ATX-style power connector
• 3x DisplayPort/ HDMI connector
• Two DisplayPort/HDMI connectors
• POST code LED display
• VGA/DVI connector
• ATX form factor
Basic or Compact form factor
for drivers, BSP and other support tools
• Optional 15”TFT display kit with cables
COM Express™
Cooling Solutions
MSC C6-AD-T6T2
Small Evaluation Board
Type 6
184 x 140
Depending on the computing performance,
MSC has developed various solutions that help
This compact platform for evaluating and prototyping system electronics provides the interfaces
processor technology and system environ-
the system designer to quickly solve the heat
necessary for COM Express Type 6 modules and offers various I/O connectors for peripherals.
ment, COM Express modules require different
dissipation problems and ensure optimal envi-
cooling measures.
ronmental conditions for the module.
Highlights
• Socket for COM Express Type 6 modules in
Basic or Compact form factor
• VGA/DVI connector
• HD audio codec on board
• PCI Express x4 slot
• LAN interface
• Four SATA connectors
• Various additional COM Express specific interfaces
• Four USB 3.0 interfaces
• ATX-style power connector
• Three DisplayPort/HDMI connectors
14 | www.msc-technologies.eu
Heatspreaders
Passive cooling
Active cooling
Standardized thermal interfaces for easy
Optimized heatsinks for best cooling
Heatsinks combined with a dedicated
integration in customers' cooling con-
performance even in industrial envi-
speed controlled fan. Off-the-shelf solu-
cepts and full interchangeability.
ronments.
tions for demanding ambient conditions.
15
Qseven™
MSC Q7-BT
Intel® Atom™ E3800 SOC Rev. 2.0
70 x 70
7/12 W
-40 +85 °C
NEW
The MSC Q7-BT module is based on the Qseven Rev. 2.0 standard and uses Intel‘s multi-core
System-On-Chip (SOC) Atom E3800 generation based on Intel’s 22nm processor technology.
The quad-core, dual-core or single-core Atom processor provides outstanding computing and
graphics power and is accompanied by a comprehensive set of peripherals.
Highlights
• Intel Atom E3845 quad-core 1.91GHz, 10W TDP
• Integrated Intel Gen. 7 HD Graphics
• Intel Atom E3827 dual-core 1.75GHz, 8W TDP
• HDMI up to 1920x1200
• Intel Atom E3826 dual -core 1.46GHz, 7W TDP
• DisplayPort 1.1a up to 2560x1600
• Intel Atom E3825 dual -core 1.33GHz, 6W TDP
• Dual-Channel LVDS 24 or 18 bit up to 1920x1200
• Intel Atom E3815 single-core 1.46GHz, 5W TDP
• 3x PCI Express x1 Gen. 2.0 ports, GbE LAN
• Up to 8 GB DDR3L SDRAM (opt. ECC)
• USB 3.0 Host, optional USB 3.0 Device
• Up to 64GB SATA Flash Disk (optional)
• Up to 6x USB 2.0 Host, optional USB 2.0 Device
• Up to 16GB eMMC Flash (optional)
• UART, LPC, I2S Audio, SPI, I2C, SMBus, SDIO, TPM
• 2x SATA interfaces (1 used for opt. Flash Disk)
MSC Q7-A50M
AMD Embedded G-Series APU
Qseven™
70 x 70
6/8 W
The latest embedded Computer-On-Module
The Qseven™ specification has been extended to
standard for entry level performance and low
include module architectures based on the ARM
power applications with a very attractive price
processor which is renowned for its excellent
performance ratio. Qseven is an open standard
performance to power ratio. Providing differ-
The MSC Q7-A50M module is based on AMD’s Embedded G-Series offering dual-core or single-core CPUs and a powerful GPU in a single embedded Accelerated Processing Unit (APU).
The MSC Q7-A50M module features the AMD T40E dual-core or the T40R or T16R single-core CPUs,
DDR3 SDRAM and the AMD A50M I/O Controller Hub and optionally up to 32MB of Flash Disk.
EMBEDDED
SOLUTIONS
G-SERIES APU
Highlights
• AMD G-Series APU
• Dual-Channel LVDS 24 bit or 18 bit up
of the SGeT Standardization Group. Taking ad-
ent processor architectures and a wide range
vantage of the ongoing development in proces-
of modules for commercial and extended tem-
• T40R Single-Core, 1.0 GHz, 5.5W TDP
• Dual independent display support
sor technology towards smaller and more power
perature together with matching baseboards,
• T16R Single-Core, 615 MHz, 4.5W TDP
• 4x PCI Express x1 ports
efficient CPUs, Qseven has in recent years be-
the MSC Qseven family leads the way to feature
• AMD A50M I/O Controller Hub
• 2x SATA interfaces
come the most widely adopted new standard for
rich and small, low power modular systems.
• 2GB DDR3 SDRAM
• 8x USB 2.0, HD audio, LPC, SPI
• Gigabit Ethernet
• OS support: Windows® 8, 7 , XP, Linux
small form factor modules.
• T40E Dual-Core, 1.0 GHz, 6.4W TDP
to 1920 x 1200 @60Hz
• HDMI/DVI or DisplayPort 1.1a
up to 1920 x 1200 @60Hz
16 | www.msc-technologies.eu
17
Qseven™
70 x 70
Qseven™
MSC Q7-IMX6
MSC Q7-TCTC-FD
Freescale i.MX6 ARM MPU
Intel® Atom™ E6xx
The MSC Q7-BT module is based on Freescale’s i.MX6 CPU offering quad-core, dual-core and
single-core ARM Cortex™-A9 performance at very low power consumption. The MSC Q7-IMX6
70 x 70
®
4/6 W
-40 +85 °C
CPU Module incorporates the Freescale quad-core, dual-core or single-core processor with up
to 1.2 GHz, up to 4GB DDR3 DRAM and up to 32GB eMMC Flash memory as well as an extensive
7W
The MSC Q7-TCTC-FD module is based on the Intel‘s E6x0 Atom™ CPU and the EG20T Platform
Controller Hub. The module provides up to 2GB DDR2 DRAM and optionally up to 8GB on-board
SATA Flash Disk.
-40 +85 °C
set of interface controllers.
Highlights
• Intel® Atom™ E6x0 (up to 1.6GHz) with
Highlights
• Freescale™ i.MX6 ARM Cortex™-A9 CPU:
®
i.MX6 Quad, Dual, DualLite, Solo up to 1.2GHz
-40 +85 °C
• Up to 2GB DDR2 SDRAM, soldered
• Up to two SATA-300 mass storage interfaces
• Triple independent display support
• Optional 4 / 8 GB on board Flash SSD, bootable
• Six USB 2.0 hosts, one USB2.0 client
• Up to 4 GB DDR3 SDRAM
• One SATA interface (3Gbit/s,
• Gigabit Ethernet interface
• CAN Bus, mini SDIO socket
• LVDS (18 / 24 Bit) up to 1280 x 768 @ 60Hz
• Industrial temperature versions available
• SDVO up to 1920 x 1080
• OS support: Windows 7, XP, Linux
not for single-core CPU)
• Gigabit Ethernet
• Up to 8 USB2.0 ports, AC’97 audio
• PCI Express x1 port
• OS support: Linux, Windows EC7
• HDMI/DVI up to 1920 x 1200 @30Hz
9W
also usable as 2 separate channels
• Three PCI Express x1 lanes
• “Triple-Play” Graphics and Video Subsystem
• Up to 8 GB NAND Flash
70 x 70
integrated Graphics EG20T PCH
• Dual-Channel LVDS 18/24 bit up to 1920 x 1200
• Dual independent display support
(Android on request)
MSC Q7-TI8168
MSC Q7-MB-RP2
TI DaVinci DSP+ARM MPU
Reference Platform Qseven 1.2
The MSC Q7-TI8168 MPU module incorporates a high performance DM8168 MPU @ 1.2 GHz
305 x 173
The Qseven Rev. 1.2 Reference Platform MSC Q7-MB-RP2 offers a large variety of interfaces
with DDR3 memory, Gigabit Ethernet and industrial interfaces including Flash memory.
commonly used in industrial applications such as Gigabit LAN, USB 2.0, 1x RS232, CAN and
It provides a combination of an ARM Cortex ™ A8 RISC MPU with Texas Instrument’s C674x
LVDS/ADD2 for display attachment. In addition PCI Express is supported with four PCIe x1 slots.
VLIW DSP core offering up to 8000 MMACS.
This platform for rapid prototyping helps to evaluate and test Qseven modules.
Highlights
Highlights
®
• Texas Instruments TMS320DM8168
• HDMI/DVI up to 1920 x 1080 resolution
• Four PCI Express x1 slots
• COM1 / COM2, LPT, fan control and HW monitor
• ARM Cortex™-A8 CPU up to 1.2 GHz
• Single-channel LVDS 24 bit
• One ADD2 slot for SDVO / DP / HDMI
• CAN transceiver
• Mini PCI Express, ExpressCard socket
• HD audio codec, AC97 connector
®
• DSP Subsystem C674x up to 1.0 GHz
up to 1280 x 720 resolution
• 1GB DDR3 SDRAM
• Dual independent display support
• MMC / SD Card socket
• Up to eight USB interfaces
• 2GB Flash SSD soldered on board
• Two SATA interfaces
• Two SATA onboard connectors
• LVDS display via Jili30
• Gigabit Ethernet
• Six USB 2.0, HD audio
• Two Super I / O (Winbond/SMSC)
• One PCI Express x1 port
• OS support: Linux (Android on request)
18 | www.msc-technologies.eu
19
Qseven™
Qseven™
MSC Q7-MB-EP6
Embedded Platform Qseven Rev. 2.0
148 x 102
MSC Q7-MB-EP3
NEW
The Qseven™ Rev. 2.0 Embedded Platform MSC Q7-MB-EP6 offers a variety of embedded
Embedded Platform VGA
148 x 102
The Qseven™ Rev. 1.2 Embedded Platform MSC Q7-MB-EP3 offers a number of embedded
interfaces such as dual Gigabit LAN, USB 3.0, USB 2.0, RS232/485 and CAN as well as HDMI,
interfaces such as Gigabit LAN, USB 2.0, RS232 and CAN as well as LVDS and VGA derived from
DisplayPort and LVDS display interfaces. In addition a mini PCI Express™, an mSATA and an SD
SDVO. In addition an SD Card socket is supported. Module slot on top side.
Card socket are supported. Module slot on bottom side.
Highlights
Highlights
• HDMI and DisplayPort connectors for direct
• USB 3.0 host connector
• One VGA port up to 1920 x 1200
• One mini-USB 2.0 client connector
• 2x USB 2.0 host connector
• Mini PCI Express slot
• Optional touch screen controller on board
• Dual Gigabit Ethernet
• 1x USB 2.0 on pin header
• MMC / SD Card socket
• Optional LVDS display via Jili30
• Mini PCI Express card slot
• 1x microUSB 2.0 OTG connector
• Two SATA onboard connectors
• Backlight interface 3.3 / 5 / 12VDC
• MMC/SD card and mSATA card sockets
• LVDS / eDP via Jili30 connector
• One RS-232 D-Sub9 connector
• HD audio codec (6 channel), one channel to front
• 1x SATA connector
• Backlight interface 3.3 / 5 / 12VDC
• Four USB 2.0 interfaces, two external
• Wide input range from 10 - 28VDC
• RS-232 on DB9 connector
• SPI / I2C / SMBus, CAN bus, I2S audio
• One CAN interface
• RS-485 and RS-232 on pin header
• Wide input range from 10 - 28VDC
output of TMDS signals from Qseven module
• LPC / GPIO on pin header
148 x 102
MSC Q7-MB-EP4
MSC Q7-MB-EP2
Embedded Platform DDI
Embedded Platform DVI
The Qseven™ Rev. 1.2 Embedded Platform MSC Q7-MB-EP4 offers many interfaces often used
148 x 102
The Qseven™ Rev. 1.2 Embedded Platform MSC Q7-MB-EP2 offers many embedded inter-
in embedded applications such as dual Gigabit LAN, USB 2.0, RS232, CAN and LVDS as well as
faces such as dual Gigabit LAN, USB 2.0, RS232, CAN and LVDS as well as DVI derived from SDVO.
DVI/HDMI. In addition a mini PCI Express™ and an mSATA slot as well as an SD-Card socket are
In addition an SD-Card socket is supported. Module slot on bottom side.
supported. Module slot on bottom side.
Highlights
Highlights
• One DVI port up to 1920 x 1080 for Qseven
modules with SDVO
• One DVI port up to 1920 x 1080
• One CAN interface
for Qseven modules with SDVO
• One CAN interface
• Six USB 2.0 interfaces, four external
• Six USB 2.0 interfaces, four external
• Dual Gigabit Ethernet
• Touch screen controller onboard
• Dual Gigabit Ethernet
• Touch screen controller on board
• Mini PCI Express slot
• LVDS display connection via Jili30
• Mini PCI Express slot
• LVDS display connection via Jili30
• MMC/SD Card socket
• Backlight interface 3.3 / 5 / 12VDC
• MMC/SD Card socket
• Backlight interface 3.3 / 5 / 12VDC
• Two SATA onboard connectors
• Wide input range from 10 - 28VDC
• Two SATA onboard connectors
• Size 148 x 102 mm
• One RS-232 onboard pin header
• One RS-232 onboard pin header
• Wide input range from 10 - 28VDC
20 | www.msc-technologies.eu
21
Qseven™
Qseven™
Qseven™
Cooling Solutions
MSC Q7-SK-BT-EP6
Qseven 2.0 Starterkit
NEW
For all its Qseven modules, MSC is offering tai-
MSC is providing a heatspreader for each Qseven
lored cooling solutions which perfectly fit the
module, and a single-piece heatsink for the high-
The Qseven Starterkit for Qseven 2.0 modules with the Intel Atom E3800 is based on the 3.5”
geometry of the COM product.
er-performance modules.
Qseven carrier board MSC Q7-MB-EP6 and contains all necessary products to quickly enable
the user to run and evaluate Qseven modules built to the Rev. 2.0 specification. The kit does
not contain a Qseven module in order to give the user greater flexibility as to which particular
Heatspreaders
Heatsinks
module version and CPU core and speed variant is desired.
Highlights
• 3.5” Qseven carrier board with socket for
Qseven Rev. 2.0 modules MSC Q7-BT
A heatspreader offers a blank surface allowing to
A heatsink is shaped like the heatspreader,
mount a cooling device or to contact the metal
but shows cooling fins on the upper side so
• Heatsink suitable for all module
housing of a system, while the underside provides
as to maximize the surface used to dissipate
variants of the Q7-BT family
contact areas for the heat generating parts of the
heat into the surrounding air.
module’s geometry.
(not included)
• 12V power supply and cable kit included for
immediate operation of the Starter Kit
• HDMI and DisplayPort graphics output
• LVDS graphics output on standard 30-pin connector;
backlight connector includes dimming output
• 2x Ethernet (10/100/1000 LAN) connectors
• SATA, USB 3.0, 3x USB 2.0, USB 2.0 OTG, 3x UARTs
• Mini PCI Express and mSATA Card slots
• SD Card socket
• Resource CD with drivers, manuals etc.
175 x 117
MSC Q7-MB-EP-02 BOX
MSC Q7-SK
Qseven Enclosure for Q7-MB-EP2/4
Qseven 1.2 Starterkits
The enclosure MSC Q7-MB-EP-02 BOS-001 was designed for use with the Qseven platform boards
The Qseven Starterkits for Qseven 1.2 modules are available in versions for the Freescale i.MX6,
MSC Q7-MB-EP2/4. The enclosure provides suitable cut-outs for the baseboards’ connectors plus
AMD Embedded G-Series, Texas Instruments DM8168 and the Intel Atom E6x0. The kits are
two optional cut-outs for D-Sub9 connectors for serial lines available on the baseboards.
based on the 3.5” Qseven carrier boards MSC Q7-MB-EPx and contain all necessary products to
quickly enable the user to run and evaluate Qseven modules. The kits do not contain a Qseven
module allowing the user to select the most suitable one from MSC’s wide offerings.
Highlights
• Compact dimensions:
• Front plate with cut-outs for EP2/4
interface connectors:
Highlights
• Material 1.5 mm sheet metal, RAL7032
- DVI, 4x USB, 2x Ethernet
• 3.5” Qseven carrier board with socket for
• Optional DIN Rail Adaptor
- 2x optional D-Sub9 for serial lines or CAN
175 x 117 x 60 mm (L x W x H)
• Cooling slots on two sides improve air flow
inside the housing
Qseven Rev. 1.2 modules (not included)
backlight connector includes dimming output
• Heatsink suitable for the chosen module family
• 2x Gigabit Ethernet connectors
• 12V power supply and cable kit included for
• SATA, 4x USB 2.0, USB 2.0 OTG
immediate operation of the Starter Kit
22 | www.msc-technologies.eu
• LVDS graphics output on standard 30-pin connector;
• HD audio or I2S audio
• Resource CD with drivers, manuals etc.
• Mini-PCI-Express and mSATA Card slots
• HDMI/DisplayPort or DVI graphics output
• SD Card socket
23
ETX®
MSC ETE-PV510
Intel® Atom™ Single-/Dual-Core
95 x 114
8 / 15 W
The module is based on Intel‘s second generation Atom™ technology offering dual-core
computing performance and low power consumption. The processor with integrated graphics
offers high graphics performance and many I / O options.
Highlights
• Intel® Atom™ D510 (1.66GHz, dual-core),
• CRT interface, resolution up to 2048 x 1536
• Intel Atom™ N450 (1.66GHz, single-core),
• Dual independent display supported
• Integrated Intel GMA 3150 graphics
• Six USB 2.0 interfaces
• Intel ICH8M I/O controller hub
• OS support: Windows 7, EC7, XP, Linux
®
®
®
• Up to 2GB DDR2 SDRAM
• LVDS interface (18 bit, single-channel),
resolution up to 1366 x 768
MSC ETE-GLX3
AMD Geode LX800
Segments: Embedded and Server
Embedded
ETX®
Opteron
95 x 125
5.5 W
Embedded Solutions
53120B
The ETX
specification V3.02 allows the life-
with low power dissipation and support for leg-
time of existing designs to be extended by
acy interfaces such as the ISA bus, PS/2, LPT or
years without the need to change the familiar
COM1/COM2. Processors are offered in the per-
®
legacy interfaces. ETX will continue to be the
formance range from 500 MHz AMD Geode LX
platform of choice for systems requiring CPUs
to 1.66 MHz dual-core Intel Atom.
®
Embedded Solutions
“R” Series A
tion with entry level computing performance and lowest power requirements. Two PATA interfaces
OpteronSATA
X
Opteron A
and on-board
offer various
storage capabilities.
53118B
53119B
Opteron Family
53117B
(showcase specific Opteron X86
technology platform)
(For future use)
Highlights
• AMD® LX800 @ 0.9W processor (500MHz)
Embedded Solutions
“G” Series X
53058B
Embedded Solutions
“G” SeriesB
Embedded Solutions
Geode
®
Embedded Solutions
Radeon Graphics
53121B
AMD PRODUCT BADGE GUIDELINES
24 | www.msc-technologies.eu
Embedded Solutions
“R” Series X
53057B
This design is based on the AMD LX800 @ 0.9W processor and offers a rich feature set in combina-
Embedded Solutions
Opteron X
53116B
Embedded Solutions
Opteron A
(For future use)
• Companion chip AMD Geode™ CS5536
• Integrated LCD TFT graphics
(LVDS and TTL options)
• Up to 1 GB DDR SDRAM
• PCI Bus
• CompactFlash slot
• ISA Bus (subset)
• Two SATA interfaces
• OS support: Windows 7, EC7, XP, Linux
• Two PATA interfaces
PAGE 12
25
nanoRISC®
MSC NANORISC-IMX6
Freescale i.MX6 ARM MPU
70 x 50
2.5 /4.5 W
-40 +85 °C
NEW
The MSC NANORISC-IMX6 module is based on the Freescale® Cortex™-A9 processor i.MX6x
which is available as quad-core, dual-core and single-core CPU. On the module it is combined
with up to 4GB DDR3 SDRAM, up to 4GB SLC NAND Flash, optionally up to 64GB eMMC Flash
and Gigabit Ethernet LAN.
Highlights
• Freescale® i.MX6 Cortex™-A9, 1/2/4 core(s)
CPU clocked up to 1.2GHz
• Graphics Interfaces: HDMI/DVI, LVDS, RGB up to
1920 x 1080, dual independent display support
• Up to 4GByte DDR3 SDRAM soldered
• Video decoder and scaler
• Up to 4GByte SLC NAND Flash soldered
• CAN 2.0B, 3x UART, 2x SPI, 2x I²C
• Up to 64Gbyte eMMC Flash
• I²S audio interface
• Gigabit Ethernet interface
• SD V3.0 / SDIO V2.0 / MMC V4.3
• USB 2.0 Host
• Parallel bus interface
• USB 2.0 OTG Host/Client High Speed
• Camera interface ITU656 / CSI
MSC NANORISC- AM335X
Texas Instruments® AM335X
nanoRISC®
®
70 x 50
2.0 W
-40 +85 °C
The MSC NANORISC-AM335X module is based on the Texas Instruments® Cortex™-A8 processor
AM335x family which ranges from 300 to 800MHz. On the module it is combined with up to
512MB DDR3 SDRAM, up to 512MB SLC NAND Flash, optionally up to 64GB eMMC Flash and
10/100 Ethernet LAN, optionally second LAN or GbE LAN.
The nanoRISC module standard has been created
nanoRISC modules can be used as a processing
for applications requiring a small form factor and
“supercomponent”, while users only need to add
lowest power consumption.
application-specific periphery. The 230-pin MXM
Highlights
connector used as interface to the baseboard is
• Texas Instruments Cortex™-A8 CPU AM335x
clocked up to 800MHz
• CAN 2.0B, 3x UART, 2x SPI, 2x I²C
The nanoRISC modules simplify the design of
inexpensive but robust and proven. A variety of
embedded systems by providing a processor
easy-to-use interfaces are available. All popular
• Up to 512MB DDR3 SDRAM soldered
• SD V2.0 / SDIO V1.0 / MMC V4.2
core with an extensive set of interfaces on a
embedded interfaces are included, and addi-
• Up to 512MB SLC NAND Flash soldered
• Optional SGX530 graphics acceleration
small form factor board. Boot loader and adap-
tional interfaces can be provided by adding
• Up to 64GB eMMC Flash soldered
• Optional industrial (Realtime) Ethernet
tations for popular Operating Systems will be
suitable controllers on the baseboard and con-
• 10/100 Base-T Ethernet Interface
• Commercial and extended commercial
provided by MSC so that design times will be
necting them to the processor bus available on
• Optional 2nd 10/100 LAN or GbE
shortened dramatically.
the MXM connector.
• USB 2.0 HS Host, USB 2.0 HS OTG
• RGB 16/18/24 bit up to 1366 x 768
26 | www.msc-technologies.eu
• I²S audio interface
temperature range
• Support for Linux
(Android, Windows EC7 on demand)
27
nanoRISC®
Design and Production
Expertise
MSC NANORISC-MB2
Embedded Platform
160 x 110
-40 +85 °C
The Evaluation Platform MSC NANORISC MB2 offers dual LAN, USB, UARTs, audio and graphics
Module Design
Firmware Expertise
RGB 18/24 Bit and extension connectors for graphics, SATA, PCIe, CAN (CPU I/O), Local Bus, I²C
Industrial applications require module designs
With today’s highly integrated CPUs the hard-
and SPI. In addition touch controllers for projected capacitive touches and for resistive touches are
to be a balance between performance, price,
ware designs from different module vendors
provided. An SD Card socket is supported.
size, reliability and power dissipation. These
tend to be similar. The BIOS/UEFI or micro-
factors are incorporated into our design guide-
controller firmware not only ensures interop-
lines ensuring that our designers select compo-
erability, but also makes the modules config-
Highlights
• Socket for nanoRISC compatible modules
• ITU656 video input interface on ext. connector
nents appropriately for longevity, low power
urable for special requirements. MSC’s large
• LCD panel interfaces with RGB TTL output
• 2x COM ports on 9pin Sub-D connector
consumption and multiple sourcing to ensure
BIOS/UEFI engineering team has throughout
• Backlight power 8..20VDC
• I2S audio codec with standard audio connectors
the best availability. By adopting COM technol-
the years adopted a variety of BIOS/UEFI from
• Graphics extension connector for optional
• SD Card socket
ogy in the form of COM Express™, Qseven™,
various vendors for our modules and accumu-
• PCIe, SATA, CAN, Local Bus, SPI, I2S
ETX or nanoRISC in your system design mini-
lated significant experience and know-how to
mizes your efforts and engineering competen-
be able to support any custom specific BIOS/
graphics modules (LVDS, HDMI)
• 2x 10/100 Base-T Ethernet interface or GbE
on extension pad field
®
®
• 2x USB Host, USB OTG Host/Client port
• Battery charger support (Lithium cell)
cies required for high speed design and provide
UEFI. We ensure direct support, maximum ex-
• Touch Screen support (capacitive + resistive)
• 8..20V power supply input
you a clearly defined upgrade path.
pertise and rapid reaction to customer demand.
All new designs are based on the latest UEFI
Custom Development
implementations, and as a standard API they
While modules require a carrier board to oper-
follow the common EAPI definition for COM
ate, complete custom designs may be the right
Express and Qseven.
MSC NANORISC-SK
solution for high volume projects. These may
Evaluation and Development Kit
include single board requirements or special
Product Support
application demands using FPGA or DSP sup-
MSC uses a tracking system for all product sup-
port. MSC offers such custom product devel-
port issues related to our module technolo-
opment including the production and logistics
gies, ensuring quick and professional support.
The MSC NANORISC-SK is a complete, ready-to-run Starterkit for MSC’s range of nanoRISC
according to your needs. This also includes
This helps customers to register their issues
processor modules. It consists of the nanoRISC Embedded Platform board MB2, a 7-inch WVGA
mechanical design, certification support and
and the communication is maintained until
display with capacitive touch and a suitable power supply.
regulatory requirements like ISO 13485.
the reported issues are resolved. Our support
group also offers services such as compliance
Custom Adaptation
measurements on customers carrier boards
The intermediate step, before a full custom
as well as schematic and PCB layout design
design, is the adaptation of existing standard
review consultancies for volume OEMs. With a
• Complete range of usable interfaces
products to your requirement by tuning the firm-
private login to our support portal, customers
• GbE or 2x 10/100 Base-T (dep. on module)
ware, special assembly or integration of memory,
are able to download restricted design support
• Power supply included
• 1 or 2 USB Host Port (dep. on module)
heatsink or display kits. This approach combines
documents, BIOS updates or special drivers.
• Integrated Debug Adapter on-board
• USB OTG Port (dep. on module)
standard products with some customization for
• SD Card with pre-installed Linux or Android
• CAN Bus, 2x COM Ports on 9-pin Sub-D
a fast time to market and minimized engineering
Please use www.msc-technologies.eu to get
• I2S or AC97 audio codec with standard
efforts. MSC offers a broad spectrum of exper-
your personal user account.
Highlights
• Evaluation and Development Kit for all
nanoRISC modules
®
• Includes 7" LCD panel 800 x 480 pixels with
all required interface cables
Operating System to be ordered with CPU
module of choice
• nanoRISC CPU module not contained
- please order separately
audio connectors
tise and distribution products which can be combined with our modules and carrier boards.
28 | www.msc-technologies.eu
29
Design and Production
Expertise / Support
BIOS and Secure Boot
Built-in Security
Operating systems
On our website www.msc-technologies.eu you
Secure booting
New technologies
for embedded modules and boards
will find detailed information on MSC's embed-
– MSC’s enhanced security features
MSC continuously improves its BIOS solutions
In addition to our BIOS competence, we are
ded products. This includes data sheets, user's
In many of our COM products we have imple-
with new functions and technologies, such as
also focusing on operating system support for
manuals, mechanical data and other design
mented the most advanced BIOS technologies
UEFI, Intel® Virtualization Technology, VT-d
our customers. Starterkits and board support
support documentation. On the software side,
such as UEFI architecture plus MSC Secure Boot
Virtualized I/O Support, Intel® Advanced Man-
packages for different board and operating
BIOS updates, drivers for multiple operating
enhancements. Using encryption algorithms,
agement Technology and Intel® Trusted Execu-
system platforms are available. Customized
systems and BSPs for typical embedded operat-
digitally signed storage devices and a Trusted
tion Technology. Continuous improvement of
driver support for dedicated applications can
ing systems such as WES7, WEC7, and WinCE are
Platform Module (TPM) these products pro-
security functions is also one of the most chal-
be offered on request. Major operating system
available for download. In addition, application
vide full TCG (Trusted Computing Group) com-
lenging tasks to meet the growing demand for
support is available for Microsoft Windows
®
notes, videos, whitepapers and FAQs provide
pliance and additional security against attacks,
safer embedded systems. MSC is maintaining
XP (embedded),
deeper technical insight on specific topics. Part
protection from software theft or misuse.
user friendly interfaces, such as EPI (Extended
Embedded Compact 7, Linux and
of the information provided is only available for
Android, depending on the architecture of
registered customers. If you are a customer
BIOS customization
tion Programming Interface) to allow low-level
the individual module. QNX and VxWorks are
using MSC products then you can register us-
Our BIOS solutions have been adapted to our
control of non-volatile memory, I2C bus, back-
supported on project request. For more details
ing the link in the top line of the website to
customers’ special industrial requirements,
light, watchdog timer etc.
see the table on pages 6/7 and our product
gain access to this private portal.
such as flat panel display support, booting
8, Windows
Windows
®
®
7, Windows
®
®
Panel interface) and EAPI (Embedded Applica-
pages on www.msc-technologies.eu
from various devices, extensive power and
Other Support services
thermal management or initialization of cus-
Product Support
Our support group also offers services such
tomer specific devices.
The MSC Embedded Solutions group has a
as compliance measurements for customer
dedicated support team that works in close co-
carrier boards as well as schematic and PCB
operation with the module hardware and soft-
layout design review consultancy for volume
ware developers. This rapid access to design
OEMs. If you cannot find the information
resources allows us to help our customers to
you need or if you have additional questions
achieve fast time to market. All technical issues
please use the email or telephone contact
from our customers are tracked in an internal
address below :
BOOT BLOCK
SEND HASH VALUES
Public Key System BIOS
SYSTEM BIOS
SEND HASH VALUES
system, thus ensuring timely response and
enabling the support group to make use of a
Email:support@msc-technologies.eu
large technical knowledge database.
Phone: +49 (0)8165 906-200
Check signature
TPM
Signature System BIOS
Public Key MBR, Boot Loader
Check signatures
MASTER BOOT RECORD (MBR)
SEND HASH VALUES
MSC web-based Support Center
Signature MBR
Customers can contact our support group by
phone or email, but we also provide an exten-
BOOT LOADER
SEND HASH VALUES
sive website for delivering as much information
as possible to help customers design-in with
our products.
CHECK TPM CONTENT
Signature Boot Loader
Public Key OS etc. (optional)
Check signature
(optional)
OS KERNEL,
APPLICATION PROGRAMS, ETC.
Signature OS etc.
30 | www.msc-technologies.eu
31
Industrial Mainboard
Selector
Product
Name
D3236-S
D3231-S
D3243-S
MI980
D3313-S
Form
Factor
ATX
µATX
Mini-ITX
Mini-ITX
Mini-ITX
Size
243.8 x
304.8 mm
CPU
Socket LGA1150, max. 95W TDP
Intel® Core™ i7 / i5 / i3 – 4xxx processor series
Intel® “TE” Haswell based embedded processor series
Intel® Pentium® - G3xxx processor series
Intel® Celeron® - G18xx processor series
243.8 x
243.8 mm
Socket LGA1150, max. 95W TDP
Intel® Core™ i7 / i5 / i3 – 4xxx processor series
Intel® “TE” Haswell based embedded processor series
Intel® Pentium® - G3xxx processor series
Intel® Celeron® - G18xx processor series
170 x
170 mm
Socket LGA1150, max. 95W TDP
Intel® Core™ i7 / i5 / i3 – 4xxx processor series
Intel® “TE” Haswell based embedded processor series
Intel® Pentium® - G3xxx processor series
Intel® Celeron® - G18xx processor series
170 x
170 mm
170 x
170 mm
MI980VF-4700EQ - Intel® QM87/Core i7-4700EQ
(2.4GHz)
MI980VF-4400E - Intel® QM87/Core i5-4400E (2.7GHz)
MI980F-4100E - Intel® HM86 /Core i3-4100E (2.4GHz)
D3313-S1 - AMD GX-210HA SOC (1.0GHz, dual-core)
D3313-S2 - AMD GX-217GA SOC (1,65GHz, dual-core)
D3313-S3 - AMD GX-420A SOC (2,00 GHz, quad-core)
max. Memory
Extensions
Specials
OS Support
Typ. Power Dissi tion (W)
Performance
Page
4 x DDR3-1600 DIMM slots
up to 32 GByte
1 x PCIe x16 Gen.3
1 x PCIe x16 (4 Lanes) Gen.2
1 x PCIe x8 (1 Lane) Gen.2
1 x PCI 32-Bit
6 x USB2.0 external / 4 x USB2.0 internal
2 x USB3.0 external / 2 x USB3.0 internal
1 x COM external / 1 x COM internal
1 x LPT port internal
6 x SATA III
1 x mSATA socket
1 x USB socket (stick/dongle) onboard
BIOS-POST/-Boot & OS – HW Watchdog
EraseDisk (BIOS Feature) included
8-Bit GPIO, TPM 1.2
Softwaretools (Flash, BIOS Setup, OEMIDENT, LVDS Tool etc.)
Windows® 7
Windows® 8.1
Linux
N/A
High
34
4 x DDR3-1600 DIMM slots
up to 32 GByte
1 x PCIe x16 Gen.3
1 x PCIe x16 (4 Lanes) Gen.2
1 x PCIe x8 (1 Lane) Gen.2
4 x PCI 32-Bit
6 x USB2.0 external / 4 x USB2.0 internal
2 x USB3.0 external / 2 x USB3.0 internal
1 x COM external / 1 x COM internal
1 x LPT port internal
6 x SATA III
1 x mSATA socket
1 x USB socket (stick/dongle) onboard
BIOS-POST/-Boot & OS – HW Watchdog
EraseDisk (BIOS Feature) included
8-Bit GPIO, TPM 1.2
Softwaretools (Flash, BIOS Setup, OEMIDENT, LVDS Tool etc.)
Windows® 7
Windows® 8.1
Linux
N/A
High
34
2 x DDR3-1600 SO-DIMM slots
up to 16 GByte
1 x PCIe x16 Gen.3
1 x Mini-PCIe socket
6 x USB2.0 external / 3 x USB2.0 internal
2 x USB3.0 external / 2 x USB3.0 internal
1 x COM external / 1 x COM internal
1 x LPT port internal
5 x SATA III
Dual Power Supply (ATX compliant & 12V only)
1 x mSATA socket
1 x USB socket (stick/dongle) onboard
BIOS-POST/-Boot & OS – HW Watchdog
EraseDisk (BIOS Feature) included
8-Bit GPIO, TPM 1.2
Softwaretools (Flash, BIOS Setup, OEMIDENT, LVDS Tool etc.)
Windows® 7
Windows® 8.1
Linux
N/A
High
35
2 x DDR3-1600 SO-DIMM slots
up to 16 GByte
1 x PCIe x16 Gen.3
2 x Mini-PCIe socket
1 x mSATA socket (shared with 1 MiniPCIe)
2 x USB2.0 external / 4 x USB2.0 internal
4 x USB3.0 external
5 x COM RS-232 / 1 x COM RS-232/422/485
MI980VF Series: 4x SATA III, 2x SATA II
MI980F: 2x SATA III, 2x SATA II
1 x mSATA socket
6 x COM
8-Bit GPIO
iSMART support
Watchdog timer
Core™ i7-4700EG = 47W max. TDP
Core™ i5-4400E = 37W max. TDP
Core™ i3-4100E = 37W max. TDP
High
35
2 x DDR3-1600 SO-DIMM slots
up to 16 GByte
1 x PCIe x4 (Gen. 2)
1 x Mini-PCIe socket incl. USB 2.0
1 x mSATA socket
4 x USB2.0 external / 2 x USB2.0 internal
2 x USB3.0 internal
2 x COM internal / 1 x COM external
1 x LPT port internal
2 x SATA III
Dual-Range DC Power Supply 12V / 19-24V
D3313-S1 - designed for fanless operation
1 x mSATA socket
1 x USB socket (stick/dongle) onboard
BIOS-POST/-Boot & OS – HW Watchdog
EraseDisk (BIOS Feature) included
8-Bit GPIO, TPM 1.2
Softwaretools (Flash, BIOS Setup, OEMIDENT, LVDS Tool etc.)
AMD GX-210HA = 9W max. TDP
AMD GX-217GA = 15W max. TDP
AMD GX-420A = 25W max. TDP
Medium
36
Thin-ITX Low profile (max. 2cm height)
fanless
12V DC IN
1 x mSATA socket
8-Bit GPIO
2W Amplifier onboard
Intel® Celeron® J900 = 10W max. TDP
Entry
36
Windows® 7
Windows® 8.x
Core™ i7-4700EG = 47W max. TDP
Core™ i5-4400E = 37W max. TDP
Core™ i3-4102E = 25W max. TDP
High
37
Windows® 7
Windows® 8.x
AMD GX-415GA = 15W max. TDP
(AMD GX-217GA = 15W max. TDP)
(AMD GX-210HA = 9W max. TDP)
Medium
37
Intel® Celeron® N2930 = 7.5W max. TDP
Intel® Celeron® N2807 = 4.3W max. TDP
Entry
38
MX1900J
Mini-ITX
170 x
170 mm
Intel® Baytrail-D J1900 2.0GHz quad-core SoC
(Optional support for Baytrail-I & Baytrail-M SoC)
2 x DDR3-1333 SO-DIMM slots
up to 8 GByte
1x Full Size Mini-PCIe with mSATA Support
1x Half Size Mini-PCIe
4x USB 3.0, 4x USB 2.0
1x COM RS-232 internal
1x LPT internal
2 x SATA
ECM-QM87
3,5" SBC
146 x
101 mm
Intel® Core™ i7-4700EQ, quad-core, 2.4GHz, 6M Cache
Intel® Core™ i5-4400E, dual-core, 2.7GHz, 3M Cache
Intel® Core™ i3-4102E, dual-core, 1.6GHz, 3M Cache
1 x DDR3-1600 SO-DIMM slots
up to 8 Gbyte
1x Mini-PCIe with mSATA Support
6x USB 3.0, 2x USB 2.0
1x COM RS-232, 1x COM RS-232/422/485
2 x S-ATA III
12V DC IN
1 x mSATA socket
8-Bit GPIO
Watchdog
1 x DDR3-1600 SO-DIMM slots
up to 8 Gbyte
1x Mini-PCIe with mSATA Support
1x CompactFlash Type I/II Socket
(Support InnoDisk CF-SATA)
2x USB 3.0, 6x USB 2.0
1x COM RS-232, 1x COM RS-232/422/485
2 x S-ATA III
+12V - +26V wide range power supply
1x mSATA socket
1x CompactFlash
8-Bit GPIO
Watchdog
Optional built-in touch screen interface
1 x DDR3-1333 SO-DIMM slots
up to 8 Gbyte
1x Full Size Mini-PCIe
1 x Half Size Mini-PCIe or 1x Half Size mSATA
1x CFast™
1x USB 3.0, 3x USB 2.0
2x COM RS-232, 2 x COM RS-232/422/485
1 x S-ATA II
+12V DCpower supply
1x mSATA socket (optional)
1x Cfast™
8-Bit GPIO
Optional built-in Touch Screen interface
Optional TPM
ECM-KA
GENE-BT05
3,5" SBC
3,5" SBC
146 x
101 mm
146 x
101 mm
32 | www.msc-technologies.eu
AMD G-Series GX-415GA SoC (1,5GHz, quad-core)
(Optional GX-217GA 1.65GHz/GX-210HA 1.0GHz)
Intel® Celeron® N2930 1,83GHz, quad-core
Intel® Celeron® N2807 1,58GHz, dual-core
Windows® 7
Windows® 8.x
Windows® 7
Windows® 8.1
Linux
Windows® 7
Windows® 8.x
Windows® 7
Windows® 8.x
33
Industrial Mainboards
243.8 x 304.8
Industrial Mainboards
D3236-S
Fujitsu D3243-S
ATX
Mini-ITX
The Fujitsu industrial mainboard D3236-S is the best choice for industrial requirements.
170 x 170
Fujitsu industrial Mini-ITX mainboard with Intel® Q87 Express chipset supporting DDR3 1600
Produced in the German Fujitsu mainboard factory in Augsburg, the D3236-S fulfills the
SDRAM memory and 4th generation Intel® Core™ i3 / i5 / i7 processors (Socket LGA1150). The
highest quality needs. Featured by the Intel® Q87 Express chipset, the 4th Generation of
Fujitsu D3243-S is designed and approved for 24/7 continuous operation also in enhanced tem-
Intel
®
Core™ processors are supported. The Fujitsu D3236-S is designed and approved for
perature ranges up to 60°C.
24/7 continuous operation also in enhanced temperature ranges up to 60°C.
Highlights
Highlights
• Intel HD Graphics
®
(integrated in processor, e.g. HD4600)
• BIOS-POST/-Boot & OS
• Mini-ITX (17cm x 17 cm)
• 2x Intel GbE LAN onboard (incl. teaming support)
• Intel HD Graphics
• BIOS-POST/-Boot & OS
®
(integrated in processor, e.g. HD4600)
– HW Watchdog onboard
– HW Watchdog onboard
• 1x PCIe x16 Gen3, 1x PCIe x16 Gen2
• Mainboard “Made in Germany”
• 1x PCIe x16 Gen3, 1 x MiniPCIe
• Mainboard “Made in Germany”
• 1x PCIe x8, 4x PCI 32-Bit
• Designed & approved for
• 1x mSATA (SATA III)
• Designed & approved for
• USB 2.0 / 3.0 and USB socket
(stick/dongle) onboard
• 2x Intel GbE LAN onboard
• Dual Power Supply (ATX compliant & 12V only)
24/7 continuous operation
• Intel vPro 2014= Intel iAMT9.1
®
• USB 2.0 / 3.0 and USB socket
®
(CPU support required)
(stick/dongle) onboard
24/7 continuous operation
• Intel® vPro 2014= Intel® iAMT9.1
(CPU support required)
(incl. teaming support)
243.8 x 243.8
D3231-S
MI980
µATX
Mini-ITX
Powered by the Intel® Q87 Express chipset supporting DDR3 1600 SDRAM memory and 4th gener-
170 x 170
The MI980 Mini-ITX supports the 4th generation Intel® Core™ i3 / i5/ i7 processors. This moth-
ation Intel® Core™ i3 / i5 / i7 processors (Socket LGA1150). The Fujitsu D3231-S is designed and ap-
erboard is based on the mobile Intel® QM87 and HM86 Express chipsets which offer an increase
proved for 24/7 continuous operation also in enhanced temperature ranges up to 60°C.
in graphics and CPU performance over previous generations. The new board design was developed primarily for the industrial and embedded markets that require high processing capability, but at the same time are constrained by power limits.
Highlights
• Intel HD Graphics
®
(integrated in processor, e.g. HD4600)
• BIOS-POST/-Boot & OS
– HW Watchdog onboard
Highlights
• 1x PCIe x16 Gen3, 1x PCIe x16 Gen2
• Mainboard “Made in Germany”
• 2x DDR3/DDR3L SO-DIMM, Max. 16GB
• iAMT (9.0), vPro, iSMART
• 1x Pcie x8, 2x PCI 32-Bit
• Designed & approved for
• Integrated VGA, supports DVI-I/
• 6x USB 2.0, 4x USB 3.0,
• USB 2.0 / 3.0 and USB socket
(stick/dongle) onboard
• 2x Intel GbE LAN onboard
24/7 continuous operation
• Intel vPro 2014= Intel iAMT9.1
®
®
(CPU support required)
DVI-D/ LVDS or eDP/ DisplayPort
• 6x COM, 4x SATA III, 2x SATA II
• 2x Intel PCIe Gigabit LAN
• 1x PCIe x16
• Watchdog timer, Digital I/O
• 2x Mini PCIe x1
®
(incl. teaming support)
34 | www.msc-technologies.eu
35
Industrial Mainboards
170 x 170
Industrial Mainboards
D3313-S
ECM-QM87
Mini-ITX
3.5"
The Fujitsu industrial Mini-ITX mainboard D3313-S is a very interesting platform for industrial ap-
146 x 101
ECM-QM87 3.5” SBC (Single Board Computer) designed based on the 4th generation Intel®
plications with different needs. Due to the AMD embedded G-Series SoC processor platform, the
Core™ processors and the mobile Intel® QM87 Express chipset architecture featuring high per-
D3313-S is able to fulfill needs from low power consumption with the AMD embedded GX210HA
formance, power efficiency, security, reliability and remote management capabilities. It is a
SoC up to high graphic performance with the AMD embedded GX-420CA quad-core processor. The
compact, complete computer built on a single circuit board with rich I/O connectors and expan-
Fujitsu D3313-S is designed for 24/7 continuous operation and equipped with 24Bit dual channel
sion sockets. The ECM-QM87 is an ideal solution for thin and light weight Intelligent systems,
LVDS, Display-Port and DVI Interfaces.
Digital Signage systems, Point-Of-Sale systems, compact Medical Imaging Processing machines
and industrial HMI where space saving, performance, reliability and longevity are top priority.
Highlights
• Mini-ITX Format (17cmx17cm)
• 3x serial port and 1x parallel port onboard
Highlights
• AMD Radeon integrated graphics on board
• Dual-Range DC Power Supply 12V / 19-24V
• Highlights
• Dual Gigabit Ethernet
• DVI-I, DP V1.2 and dual-channel LVDS
• BIOS-POST/-Boot & OS – HW Watchdog onboard
• 1x 204-pin DDR3L SODIMM
• Triple Display
• 2x GbE LAN oboard, 1 x mSATA (SATAIII)
• Mainboard “Made in Germany”
• Up to 8GB 1333/1600 SDRAM
• 2x SATA III, 1x MiniPCIe Card (Support mSATA)
• 1x PCIe x16 (4 Lanes) Gen2, 1x miniPCIe
• Designed for fanless operation (D3313-S1)
• Dual-channel 18/24-bit LVDS, HDMI, VGA
• 6x USB 3.0, 2x USB 2.0, 2x COM, 8-bit DIO
• 6x USB 2.0 / 2x USB 3.0 on board
• Designed & approved for 24/7 continuous operation
• Realtek ALC892 Supports 5.1-CH Audio
• iAMT 9.0
• Socket for internal USB stick
170 x 170
MX1900J
ECM-KA
Mini-ITX
3.5"
The MX1900J is a quad-core Bay Trail 4th generation Atom™ thin Mini-ITX motherboard for thin
146 x 101
The ECM-KA is a 3.5” SBC (Single Board Computer) powered by the AMD Embedded G-Series 1st
clients, entry level digital signage and retail POS systems. It is a single stack, low-profile and fan
generation SoC APU based on 28nm design technology. It provides extremely low power con-
less Mini-ITX motherboard. The rear I/O interface includes four USB 3.0, one Display-Port, one
sumption, high graphic performance, multimedia and a small footprint and is designed to meet
VGA, one Gigabit LAN, optional secondary Gigabit LAN, mic-in, line-out and runs on DC power.
demands for the embedded market, such as Industrial Controls and Automation, Thin Clients,
The MX1900J’s low profile has a board height of approximately 20mm.
SMB storage server, Surveillance, Communication and Data Acquisition applications.
Highlights
Highlights
• Intel Baytrail-D Platform
• 1x Intel i211-AT Gigabit LAN
• Fanless and thin (low profile)
• Supports Dual Display via DP, VGA
®
and/or 18/24-bit dual-channel LVDS
• Onboard AMD Embedded G-Series Quad-core
• Dual View ( HDMI, LVDS, VGA)
• 12V DC Power
GX-415GA 1.5GHz SoC (Optional GX-217GA
• 2x Gigabit Ethernet, HD Audio
• 1x Full Size Mini-PCIe with mSATA Support
1.6GHz/GX-210HA 1.0GHz)
• 2x SATA III, 1x Mini PCIe, 1x CF
®
• 1x Half Size Mini-PCIe
• 1x 204-pin DDR3 SODIMM Socket
• 2x USB 3.0, 6x USB 2.0, 2s COM, 8-bit DIO
• 4x USB 3.0, 4x USB 2.0
36 | www.msc-technologies.eu
37
Industrial Mainboards
Industrial Mainboards
Industrial Mainboards
Accessories & Services
GENE-BT05
3.5"
146 x 101
The GENE-BT05 is equipped with an Intel® Celeron® N2930/N2807 processor. The graphics engine
Graphic Cards
Hard Drives
Optical Drives
Processors
Memory
Wireless
LCD Cable &
Service
Assembly
Service
of GENE-BT05 supports CRT/LCD, HDMI/ LCD simultaneous and dual view displays. This model applies two Mini-Card and LPC bus for flexible expansions. Moreover, one SATA 3.0Gb/s, one CFast™,
and optional half-size mSATA provide ample storage. This brand new sub-compact board is developed to cater to the requirements of Automation, Medical, Ticket Machine, Transportation, Gaming,
KIOSK, and POS/POI applications.
Highlights
• Onboard Intel® Celeron®
• 2x MiniPCIe (1x full-size, 1x half-size)
N2930/N2807 Processor
• +12V-only operation
• 1x DDR3L 1066/1333MHz SODIMM
• Onboard 4/5/8-wire resistive
• 2x Gigabit Ethernet
touch screen controller (optional)
• CRT, 18/24-bit dual-channel LVDS LCD, HDMI
• AAEON Hi-Safe/SDK/Utility supported
• Dual-channel HD audio
• 1x mSATA (optional)
• 1x SATA 3.0Gb/s, 1x CFast™
• Onboard Trusted Platform Module (optional)
• 1x USB3.0, 3x USB2.0, 4x COM, 8-bit Digital I/O
In case you are still looking for
the right product, MSC offers a
lot of other popular formfactor
boards on request.
Chrontel
Pico-ITX
Nano-ITX
EPIC
PC/104
5,25"
38 | www.msc-technologies.eu
39
Intelligent Solutions
Headquarters Stutensee
MSC Technologies GmbH
Industriestraße 16
76297 Stutensee
t +49 7249 910 - 0
f +49 7249 910 7993
info@msc-technologies.eu
www.msc-technologies.eu
Germany
Aachen Pascalstr. 16 • 52076 Aachen t +49 2408 709 0
Berlin Tempelhofer Ufer 37 • 10963 Berlin t +49 30 720089 0
Düsseldorf Max-Planck-Str.15a-c • 40699 Erkrath t +49 211 92593 0
Hannover Gaußstraße 10 • 31275 Lehrte t +49 5132 5099 680
Jena Göschwitzer Straße 25 • 07745 Jena t +49 3641 6825 0
Koblenz Auf dem Hahnenberg 19 • 55218 Mühlheim t +49 2630 96239 11
Maudach Torfstecherring 4 • 67067 Ludwigshafen t +49 621 58649 113
Neufahrn Zeppelinstr. 1a • 85375 Neufahrn t +49 8165 906 100
Nürnberg Vogelweiherstr. 20 • 90441 Nürnberg t +49 911 43970 0
Stuttgart Gutenbergstraße 15 • 70771 Leinfelden-Echterdingen t +49 711 78260 380
Wiesbaden Borsigstraße 36 • 65205 Wiesbaden t +49 6122 5871 422
Austria (also responsible for Slovenia )
Aredstrasse 13 • A - 2544 Leobersdorf t +43 (2256) 63975-13
Romania
Pipera-Tunari 4c Voluntari • 077190 Ilfov (Bucharest)
t +40 21 529 6911
Hungary
Budafoki út 91-93 West Irodahaz • 1117 Budapest
t +36 1 436 72 29
Switzerland
Industriestr. 25 • CH - 8604 Volketswil t +41 43 355 33 66
Benelux countries Stadionstraat 2, 6th fl. • NL - 4815 NG BREDA t +31 76 5722400
Czech Republic/Poland
Nádražní 2369/10 • CZ - 678 01 Blansko t +420 516 411 494-15
Turkey
Inonu Cd. Seylan Is Merkezi 83/6 Kozyatagi • TR - 34736 Istanbul t +90 216 411-2333
Spain
Calle Chile 10, 2nd Planta, Oficina 222 • ES - 28290 Las Matas, Madrid t +34 91 721 69 51
Fermín Calbetón Nº4 Planta 3 • 20600 Eibar (Guipúzcoa) t +34 943 257 105
© MSC Technologies GmbH . All rights reserved. Although great care has been taken in preparing this printed matter, MSC can not be held responsible for any errors or omissions.
All information in here is subject to change without notice. All hardware and software names used are trade names and/or trademarks of the respective manufacturer.
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