GOODRAM Industrial CFast TM Version 1.1
WILK ELEKTRONIK S.A.
ul. Mikołowska 42, 43-173 Łaziska Górne, Poland
Website: www.goodram.com | www.wilk.com.pl
Tel: +48 (32) 736 90 00
Fax: +48 (32) 736 90 01
Wilk Elektronik S.A.
GOODRAM Industrial CFast TM
Version 1.1
All rights are strictly reserved. Any portion of this paper shall not be reproduced, copied, or
translated to any other forms without permission from Wilk Elektronik S.A.
This document is subjected to change without any notice.
Please contact your Wilk Elektronik S.A. sales representative for details as to environmental matters such as
the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS
Directive. Wilk Elektronik S.A. assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
Contents
1.
Overview .................................................................................................................................................... 5
2.
Introduction ............................................................................................................................................... 1
2.1.
General Description ..................................................................................................................... 1
2.2.
Controller Block Diagram ............................................................................................................. 1
2.3.
Product Block Diagram ................................................................................................................ 2
2.4.
Flash Management ...................................................................................................................... 2
3.
Product Specifications ............................................................................................................................... 7
4.
Environmental Specifications .................................................................................................................... 9
5.
4.1.
Environmental Conditions ........................................................................................................... 9
4.2.
Shock .......................................................................................................................................... 10
4.3.
Vibration .................................................................................................................................... 10
4.4.
Drop ........................................................................................................................................... 10
4.5.
Bending ...................................................................................................................................... 11
4.6.
Torque........................................................................................................................................ 11
4.7.
Electrostatic Discharge (ESD) ..................................................................................................... 11
4.8.
EMI Compliance ......................................................................................................................... 11
4.9.
MTBF .......................................................................................................................................... 11
4.10.
Certification & Compliance ........................................................................................................ 12
Electrical Specifications ........................................................................................................................... 12
5.1.
Supply Voltage ........................................................................................................................... 12
5.2.
Power Consumption .................................................................................................................. 12
6.
Interface .................................................................................................................................................. 13
6.1.
7.
8.
Pin Assignment and Descriptions .............................................................................................. 13
Supported Commands ............................................................................................................................. 14
7.1.
ATA Command List ..................................................................................................................... 14
7.2.
Identify Device Data................................................................................................................... 16
Physical Dimension .................................................................................................................................. 21
1. Overview



Capacity
■ SLC: 1GB to 32GB
■ MLC: 4GB up to 64GB
SATA Interface
■ SATA Revision 3.0
■ SATA 1.5Gbps, 3Gbps, and 6Gbps
interface
Flash Interface
Flash Type: SLC, MLC
■ 1pc or 2pcs of TSOP
Performance
■ Read: up to 240 MB/s
■ Write: up to 150 MB/s
Power ConsumptionNote1
■ Active mode: < 1577mW
■ Idle mode: < 300mW
■ DEVSLP mode: < 5mW
TBW (Terabyte Written) Note2
■ 158TBW for 64GB


■



MTBF
■ More than 1,000,000 hours
Advanced Flash Management
■ Static and Dynamic Wear Leveling
■ Bad Block Management
■ TRIM
■ SMART
■ Over-Provision
Firmware Update
Low Power Management
■ DEVSLP Mode
■ DIPM/HIPM Mode
Temperature Range
■ Sliver grade: 0°C ~ 70°C
■ Diamond grade: -40°C ~ 85°C
RoHS compliant
■



Notes:
1. Please see “5.2 Power Consumption” for details.
2. Please see “TBW (Terabyte Written)” in Chapter 3” for details.
2. Introduction
2.1. General Description
CFastTM delivers all the advantages of Flash Disk technology with the Serial ATA III interface and is fully
compliant with the standard CFast form factor. Given the features of the low power consumption, small
form factor, and high shock-resistance, CFastTM is an attractive solution to replace the conventional [PATAinterfaced] CompactFlash card in industrial applications or markets where performance is a major concern.
CFastTM, consisting of a SATA-based 7-pin standard interface for data segment and 17-pin for power and
controller segment, is designed to operate at a maximum operating frequency of 300MHz with 40MHz
external crystal. Its capacity could provide a wide range up to 64GB. Moreover, it can reach up to 240MB/s
read as well as 120MB/s write high performance based on Toggle 2.0 MLC flash (with 32MB SDR enabled
and measured by CrystalDiskMark v3.0).
2.2. Controller Block Diagram
2.3. Product Block Diagram
2.4. Flash Management

Error Correction Code (ECC)
Flash memory cells will deteriorate with use, which might generate random bit errors in the stored data.
Thus, PS3109 CFast applies the BCH ECC Algorithm, which can detect and correct errors occur during Read
process, ensure data been read correctly, as well as protect data from corruption.

Wear Leveling
NAND Flash devices can only undergo a limited number of program/erase cycles, and in most cases, the
flash media are not used evenly. If some areas get updated more frequently than others, the lifetime of the
device would be reduced significantly. Thus, Wear Leveling technique is applied to extend the lifespan of
NAND Flash by evenly distributing write and erase cycles across the media.
It provides advanced Wear Leveling algorithm, which can efficiently spread out the flash usage through the
whole flash media area. Moreover, by implementing both dynamic and static Wear Leveling algorithms, the
life expectancy of the NAND Flash is greatly improved.

Bad Block Management
Bad blocks are blocks that include one or more invalid bits, and their reliability is not guaranteed. Blocks
that are identified and marked as bad by the manufacturer are referred to as “Initial Bad Blocks”. Bad
blocks that are developed during the lifespan of the flash are named “Later Bad Blocks”. implements an
efficient bad block management algorithm to detect the factory-produced bad blocks and manages any bad
blocks that appear with use. This practice further prevents data being stored into bad blocks and improves
the data reliability.

TRIM
TRIM is a feature which helps improve the read/write performance and speed of Solid-State Drives (SSD).
Unlike Hard Disk Drives (HDD), SSDs are not able to overwrite existing data, so the available space gradually
becomes smaller with each use. With the TRIM command, the operating system can inform the SSD which
blocks of data are no longer in use and can be removed permanently. Thus, the SSD will perform the erase
action, which prevents unused data from occupying blocks all the time.

SMART
SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is an open standard that
allows a hard disk drive to automatically detect its health and report potential failures. When a failure is
recorded by SMART, users can choose to replace the drive to prevent unexpected outage or data loss.
Moreover, SMART can inform users of impending failures while there is still time to perform proactive
actions, such as copy data to another device.

Over-Provision
Over Provisioning refers to the inclusion of extra NAND capacity in a SSD, which is not visible and cannot be
used by users. With Over Provisioning, the performance and IOPS (Input/Output Operations per Second) is
improved by providing the controller additional space to manage P/E cycles, which enhances the reliability
and endurance as well. Moreover, the write amplification of the SSD becomes lower when the controller
writes data to the flash.

Firmware Upgrade
Firmware can be considered as a set of instructions on how the device communicates with the host.
Firmware will be upgraded when new features are added, compatibility issues are fixed, or read/write
performance gets improved.

Low Power Management
o
DEVSLP Mode
With the increasing need of aggressive power/battery life, SATA interfaces include a new feature, Device
Sleep (DEVSLP) mode, which helps further reduce the power consumption of the device. DEVSLP enables
the device to completely power down the device PHY and other sub-systems, making the device reach a
new level of lower power operation. The DEVSLP does not specify the exact power level a device can
achieve in the DEVSLP mode, but the power usage can be dropped down to 5mW or less.
o
DIPM/HIPM Mode
SATA interfaces contain two low power management states for power saving: Partial and Slumber modes.
For Partial mode, the device has to resume to full operation within 10 microseconds, whereas the device
will spend 10 milliseconds to become fully operational in the Slumber mode. SATA interfaces allow low
power modes to be initiated by Host (HIPM, Host Initiated Power Management) or Device (DIPM, Device
Initiated Power Management). As for HIPM, Partial or Slumber mode can be invoked directly by the
software. For DIPM, the device will send requests to enter Partial or Slumber mode.

Flushing Mechanism for Power Loss Protection
Power Loss Protection is a mechanism to prevent data loss during unexpected power failure. DRAM is a
volatile memory and frequently used as temporary cache or buffer between the controller and the NAND
flash to improve the SSD performance. However, one major concern of the DRAM is that it is not able to
keep data during power failure. Accordingly, the PS3109 applies the GuaranteedFlush Technology, which
requests the controller to transfer data to the cache. For PS3109 CFast card, SDR performs as a cache, and
its sizes is 32MB. Only when the data is fully committed to the NAND flash will the controller send
acknowledgement (ACK) to the host. Such implementation can prevent false-positive performance and the
risk of power cycling issues.
Additionally, it is critical for a controller to shorten the time the in-flight data stays in the cache. Thus, ’s
PS3109 applies an algorithm to reduce the amount of data resides in the cache to provide a better
performance. This SmartCacheFlush technology allows incoming data to only have a “pit stop” in the cache
and then move to the NAND flash at once. If the flash is jammed due to particular file sizes (random 4K),
the cache will be treated as an “organizer”, consolidating incoming data into groups before written into the
flash to improve write amplification.
In sum, with this Flush Management, PS3109 proves to provide the reliability required by consumer,
industrial, and enterprise-level application.

Advanced Self-Defense Mechanism
o
Secure Erase
Secure Erase is a standard ATA command and will write all “0xFF” to fully wipe all the data on hard drives
and SSDs. When this command is issued, the SSD controller will empty its storage blocks and return to its
factory default settings.
o
Write Protect
When a SSD contains too many bad blocks and data are continuously written in, then the SSD might not be
used anymore. Thus, Write Protect is a mechanism to prevent data from being written in and protect the
accuracy of data that are already stored in the SSD.

SSD Lifetime Management
o
Terabytes Written (TBW)
TBW (Terabytes Written) is a measurement of SSDs’ expected lifespan, which represents the amount of
data written to the device. To calculate the TBW of a SSD, the following equation is applied:
TBW = [(NAND Endurance) x (SSD Capacity) x (WLE)] / WAF
NAND Endurance: NAND endurance refers to the P/E (Program/Erase) cycle of a NAND flash. Typically, the
P/E cycle of MLC is 3K.
SSD Capacity: The SSD capacity is the specific capacity in total of a SSD.
WLE: Wear Leveling Efficiency (WLE) represents the ratio of the average amount of erases on all the blocks
to the erases on any block at maximum.
WAF: Write Amplification Factor (WAF) is a numerical value representing the ratio between the amount of
data that a SSD controller needs to write and the amount of data that the host’s flash controller
writes. A better WAF, which is near 1, guarantees better endurance and lower frequency of data
written to flash memory.

Thermal Monitor
Thermal monitors are devices for measuring temperature, and can be found in SSDs in order to issue
warnings when SSDs go beyond a certain temperature. The higher temperature the thermal monitor
detects, the more power the SSD consumes, causing the SSD to get aging quickly. Hence, the processing
speed of a SSD should be under control to prevent temperature from exceeding a certain range.
Meanwhile, the SSD can achieve power savings.

Adaptive Performance Tuning Technology
o
Throughput
Based on the available space of the disk, PS3109 will regulate the read/write speed and manage the
performance of throughput. When there still remains a lot of space, the firmware will continuously perform
read/write action. There is still no need to implement garbage collection to allocate and release memory,
which will accelerate the read/write processing to improve the performance. Contrarily, when the space is
going to be used up, PS3109 will slow down the read/write processing, and implement garbage collection
to release memory. Hence, read/write performance will become slower.
o
Predict Fetch
Normally, when the Host tries to read data from the SSD, the SSD will only perform one read action after
receiving one command. However, PS3109 applies Predict Fetch to improve the read speed. When the Host
issues sequential read commands to the SSD, the SSD will automatically release that the following will also
be read commands. Thus, before receiving the next command, flash has already prepared the data.
Accordingly, this accelerates the data processing time, and the host does not need to wait so long to
receive data.
3. Product Specifications


Capacity
o
SLC: From 1GB up to 32GB
o
MLC: From 4GB up to 64GB
Electrical/Physical Interface
o
o


SATA Interface
–
Compliant with SATA Revision 3.0
–
Compatible with SATA 1.5Gbps, 3Gbps and 6Gbps interface
–
Support power management
–
Support expanded register for SATA protocol 48 bits addressing mode
–
Embedded BIST function for SATA PHY for low cost mass production
Flash IO
–
Support 1.8V and 3.3V voltage level
–
Support 1.8V for ONFI Flash
–
Support 3.3V for conventional Asynchronous Flash
NAND Flash Interface
o
Toshiba 24nm/19nm SLC, MLC, Toggle1.0 and Toggle2.0
o
Build-in hardware ECC circuit (up to 72bit/1KB)
o
Support all types of SLC/MLC large block: 8KB/page and 16K/page NAND Flash
o
Support ONFI 2.3 interface: 2 channels at maximum
o
Bus Width: 8/16 bit
o
Contain 1pc or 2pcs of TSOP Flash
ECC Scheme
o
PS3109 CFast can correct up to 72 bits error in 1K Byte data.

Performance
Sequential
Capacity
Flash Structure
Flash Type
Read
Write
8GB
8GB x 1
Type B
118.80
45.51
16GB
8GB x 2
Type B
238.30
86.84
32GB
16GB x 2
Type B
248.40
154.40
64GB
32GB x 2
Type B
248.40
154.40
NOTES:
1. The performance is tested by CrystalDiskMark.
2. Samples are made of Toshiba 19nm MLC NAND Flash.
3. Performance may vary from flash configuration, SDR configuration, and platform.
4. The table above is for your reference only. The criteria for MP (mass production) and for
accepting goods shall be discussed based on different flash configuration.

TBW (Terabytes Written)
Capacity
Flash Structure
TBW
16GB
16GB x 1
39.71
32GB
16GB x 2
79.42
64GB
32GB x 2
158.84
NOTES:
1. Samples are made of Toshiba 19nm Toggle NAND Flash.
2. TBW may vary from flash configuration, SDR configuration, and platform.

Build-in 32-bit micro‐controller

UART function

GPIO

Support SMART and TRIM commands
4. Environmental Specifications
4.1. Environmental Conditions

Temperature and Humidity
o


Storage Temperature Range: -40°C to 85°C
Operation Temperature Range
o
Silver grade: 0°C ~ 70°C
o
Diamond grade: -40°C ~ 85°C
Humidity:
o
Silver grade : RH 93% under 40°C (in operation)
o
Diamond grade : RH 95% under 55°C (in operation)
High Temperature Test Condition
Temperature
Humidity
Operation (Silver)
70°C
0% RH
Storage (Silver)
85°C
0% RH
Operation (Diamond) 85°C
0% RH
Storage (Diamond)
85°C
0% RH
Result: No any abnormality is detected.
Low Temperature Test Condition
Temperature
Humidity
Operation (Silver)
0°C
0% RH
Storage (Silver)
-40°C
0% RH
Operation (Diamond) -40°C
0% RH
Storage (Diamond)
-40°C
0% RH
Result: No any abnormality is detected.
High Humidity Test Condition
Temperature
Humidity
Operation (Silver)
40°C
Storage (Silver)
40°C
Operation (Diamond)
55°C
Storage (Diamond)
55°C
Result: No any abnormality is detected.
93% RH
95% RH
95% RH
95% RH
Test Time
72 hours
72 hours
72 hours
168 hours
Test Time
72 hours
72 hours
72 hours
168 hours
Test Time
24 hours
72 hours
72 hours
96 hours
Temperature Cycle Test
Temperature
Test Time
0°C
30 min
70°C
30 min
-40°C
30 min
85°C
30 min
-40°C
30 min
85°C
30 min
-40°C
30 min
85°C
30 min
Operation (Sliver)
Cycle
10 Cycles
Storage (Sliver)
10 Cycles
Operation (Diamond)
20 Cycles
Storage (Diamond)
50 Cycles
Result: No any abnormality is detected.
4.2. Shock
PS3109 CFast Shock Specification
Acceleration Force Half Sin Pulse Duration
Non-operational
1500G
0.5ms
Result: No any abnormality is detected when power on.
4.3. Vibration
PS3109 CFast Vibration Specification
Condition
Vibration Orientation
Non-operational
Frequency/Displacement
Frequency/Acceleration
20Hz~80Hz/1.52mm
80Hz~2000Hz/20G
X, Y, Z axis/30 min for
each
Result: No any abnormality is detected when power on.
4.4. Drop
PS3109 CFast Drop Specification
Height of Drop
Number of Drop
Non-operational
110cm free fall
6 face of each unit
Result: No any abnormality is detected when power on.
4.5. Bending
PS3109 CFast Bending Specification
Force
Action
Non-operational
≥ 20N
Hold 1min/5times
Result: No any abnormality is detected when power on.
4.6. Torque
PS3109 CFast Torque Specification
Force
Action
Non-operational
0.5N-m or ±2.5 deg
Hold 5min/5times
Result: No any abnormality is detected when power on.
4.7. Electrostatic Discharge (ESD)
Device
CFast
Capacity
64GB
PS3109 CFast Contact ESD Specification
Temperature Relative Humidity
+/- 4KV
24.0°C
49% (RH)
Device functions are affected, but
EUT will be back to its normal or
operational state automatically.
Result
PASS
4.8. EMI Compliance



FCC: CISPR22
CE: EN55022
BSMI 13438
4.9. MTBF
MTBF, an acronym for Mean Time Between Failures, is a measure of a device’s reliability. Its value
represents the average time between a repair and the next failure. The measure is typically in units of
hours. The higher the MTBF value, the higher the reliability of the device. The predicted result of ’s PS3109
CFast is more than 1,000,000 hours.
4.10.



Certification & Compliance
RoHS
SATA III (SATA Rev. 3.0)
Up to ATA/ATAPI-8 (Including S.M.A.R.T)
5. Electrical Specifications
5.1. Supply Voltage
Supply Voltage of PS3109 CFast
Parameter
Rating
Operating Voltage
3.3V, +/- 5%
Max. Ripple
100mV, 0~30MHz
5.2. Power Consumption
Power Consumption of PS3109 CFast
Current
Flash
Structure
Read
Write
Idle
Partial
Slumber
DEVSLP
16GB
8GB x 2
904
838
276
62
43
4.9
32GB
16GB x 2
1369
1210
292
76
58
4.6
64GB
32GB x 2
1577
1278
301
81
63
4.3
Unit: mW
NOTES:
1.
2.
3.
4.
Samples are made of Toshiba NAND Flash.
The operating voltage is 3.3V.
Power Consumption may vary from flash configuration, SDR configuration, or platform.
Sequential R/W is measured while testing 4000MB sequential R/W 5 times by CrystalDiskMark.
6. Interface
6.1. Pin Assignment and Descriptions
Signal Pin and Power Pin Assignment and Description of PS3109 CFast
Pin #
Segment
Pin
Definition
Type
Meting
Description
Sequence
st
S1
SATA
SGND
Signal GND
Ground for signal integrity
1
S2
SATA
A+
SATA Differential
Signal Pair A
2
S3
SATA
A-
SATA Differential
Signal Pair A
2
S4
SATA
SGND
Signal GND
Ground for signal integrity
1
S5
SATA
B-
SATA Differential
Signal Pair B
2
S6
SATA
B+
SATA Differential
Signal Pair B
2
S7
SATA
SGND
Signal GND
Ground for signal integrity
1
Card Detect In
3
nd
nd
st
nd
nd
st
Key
Key
PC1
PWR/CTL
CDI
Input
PC2
PWR/CTL
PGND
Device GND
PC3
PWR/CTL
DEVSLP
DEVSLP Card Input
PC4
rd
st
1
nd
DevSleep Power State Enable
2
PWR/CTL
Reserved
2
PC5
PWR/CTL
Reserved
2
PC6
PWR/CTL
Reserved
2
PC7
PWR/CTL
PGND
Device GND
PC8
PWR/CTL
LED1
LED Output
LED Output
2
PC9
PWR/CTL
LED2
LED Output
LED Output
2
PC10
PWR/CTL
Reserved
2
nd
nd
nd
st
1
nd
nd
nd
nd
Reserved
2
GND
Card output, connect to PGND on card
2
PWR
3.3V
Device Power (3.3V)
2
PWR/CTL
PWR
3.3V
Device Power (3.3V)
2
PC15
PWR/CTL
PGND
Device GND
Device Ground
1
PC16
PWR/CTL
PGND
Device GND
Device Ground
1
PC17
PWR/CTL
CDO
Output
Card Detect Out
3
PC11
PWR/CTL
PC12
PWR/CTL
IFDet
PC13
PWR/CTL
PC14
7. Supported Commands
7.1. ATA Command List
ATA Command List
Op Code
Description
Op Code
Description
00h
NOP
97h
IDLE
06h
Data Set Management
98h
CHECK POWER MODE
Recalibrate
99h
SLEEP
20h
Read Sectors
B0h
SMART
21h
Read Sectors without Retry
B1h
DEVICE CONFIGURATION
24h
Read Sectors EXT
C4h
Read Multiple
25h
Read DMA EXT
C5h
Write Multiple
27h
Read Native Max Address EXT
C6h
Set Multiple Mode
29h
Read Multiple EXT
C8h
Read DMA
2Fh
Read Log EXT
C9h
Read DMA without Retry
30h
Write Sectors
CAh
Write DMA
31h
Write Sectors without Retry
CBh
Write DMA without Retry
34h
Write Sectors EXT
CEh
Write Multiple FUA EXT
10h-1Fh
nd
nd
nd
st
st
rd
35h
Write DMA EXT
E0h
Standby Immediate
37h
Set Native Max Address EXT
E1h
Idle Immediate
38h
CFA WRITE SECTORS WITHOUT ERASE
E2h
Standby
39h
Write Multiple EXT
E3h
Idle
3Dh
Write DMA FUA EXT
E4h
Read Buffer
3Fh
Write Long EXT
E5h
Check Power Mode
40h
Read Verify Sectors
E6h
Sleep
41h
Read Verify Sectors without Retry
E7h
Flush Cache
42h
Read Verify Sectors EXT
E8h
Write Buffer
45h
WRITE UNCORRECTABLE EXT
EAh
Flush Cache EXT
60h
Read FPDMA Queued
ECh
Identify Device
61h
Write FPDMA Queued
EFh
Set Features
Seek
F1h
Security Set Password
90h
Execute Device Diagnostic
F2h
Security Unlock
91h
Initialize Device Parameters
F3h
Security Erase Prepare
92h
Download Microcode
F4h
Security Erase Unit
93h
DOWNLOAD MICROCODE DMA
F5h
Security Freeze Lock
94h
STANDBY IMMEDIATE
F6h
Security Disable Password
95h
IDLE IMMEDIATE
F8h
Read Native Max Address
96h
STANDBY
F9h
Set Max Address
70h-7Fh
7.2. Identify Device Data
The following table details the sector data returned by the IDENTIFY DEVICE command.
List of Device Identification
F: Fixed
Word
V: Variable
Default Value
Description
X: Both
0
F
0040h
General configuration bit-significant information
1
X
*1
2
V
C837h
Specific configuration
3
X
0010h
Obsolete – Number of logical heads (16)
4-5
X
00000000h
6
X
003Fh
7-8
V
00000000h
9
X
0000h
Retired
10-19
F
Varies
Serial number (20 ASCII characters)
20-21
X
0000h
Retired
22
X
0000h
Obsolete
23-26
F
Varies
Firmware revision (8 ASCII characters)
27-46
F
Varies
Model number (xxxxxxxx)
47
F
8010h
7:0- Maximum number of sectors transferred per
interrupt on MULTIPLE commands
48
F
4000h
Trusted Computing feature set options(not support)
49
F
2F00h
Capabilities
50
F
4000h
Capabilities
51-52
X
000000000h
53
F
0007h
Obsolete – Number of logical cylinders
Retired
Obsolete – Number of logical sectors per logical track
(63)
Reserved for assignment by the Compact Flash
Association
Obsolete
Words 88 and 70:64 valid
54
X
*1
Obsolete – Number of logical cylinders
55
X
0010h
Obsolete – Number of logical heads (16)
56
X
003Fh
Obsolete – Number of logical sectors per track (63)
57-58
X
*2
59
F
0110h
Number of sectors transferred per interrupt on
MULTIPLE commands
60-61
F
*3
Maximum number of sector ( 28bit LBA mode)
62
X
0000h
Obsolete
63
F
0407h
Multi-word DMA modes supported/selected
64
F
0003h
PIO modes supported
65
F
0078h
Minimum Multiword DMA transfer cycle time per
word
66
F
0078h
Manufacturer’s recommended Multiword DMA
transfer cycle time
67
F
0078h
Minimum PIO transfer cycle time without flow control
68
F
0078h
Minimum PIO transfer cycle time with IORDY flow
control
69
F
0100h
Additional Supported (support download microcode
DMA)
70
F
0000h
Reserved
71-74
F
000000000000000
0h
75
F
001Fh
Queue depth
76
F
670eh
Serial SATA capabilities
77
F
0084h
Serial ATA Additional Capabilities
78
F
014Ch
Serial ATA features supported
79
V
0040h
Serial ATA features enabled
80
F
07F8h
Major Version Number
81
F
0000h
Minor Version Number
Obsolete – Current capacity in sectors
Reserved for the IDENTIFY PACKET DEVICE command
82
F
346bh
Command set supported
83
F
7d09h
Command set supported
84
F
6063h
Command set/feature supported extension
85
V
3469h
Command set/feature enabled
86
V
bc01h
Command set/feature enabled
87
V
6063h
Command set/feature default
88
V
003Fh
Ultra DMA Modes
89
F
0001h
Time required for security erase unit completion
90
F
001Eh
Time required for Enhanced security erase
completion
91
V
0000h
Current advanced power management value
92
V
FFFEh
Master Password Revision Code
93
F
0000h
Hardware reset result. The contents of the bits (12:0)
of this word can be changed only during the
execution of hardware reset.
94
V
0000h
Vendor’s recommended and actual acoustic
management value
95
F
0000h
Stream Minimum Request Size
96
V
0000h
Streaming Transfer Time – DMA
97
V
0000h
Streaming Access Latency – DMA and PIO
98-99
F
0000h
Streaming Performance Granularity
100-103
V
*4
104
V
0000h
Streaming Transfer Time – PIO
105
F
0008h
Maximum number of 512-byte blocks per DATA SET
MANAGEMENT command
106
F
4000h
Physical sector size/Logical sector size
107
F
0000h
Inter-seek delay for ISO-7779 acoustic testing in
microseconds
108-111
F
000000000000000
Maximum user LBA for 48 bit Address feature set
Unique ID
0h
112-115
F
000000000000000
0h
Reserved
116
V
0000h
Reserved
117-118
F
00000000h
119
F
4014h
Supported settings
120
F
4014h
Command set/Feature Enabled/Supported
121-126
F
0h
Reserved
127
F
0h
Removable Media Status Notification feature set
support
128
V
0021h
Security status
129-140
X
0h
Vendor specific
141
X
0001h
Vendor specific
142-159
X
0h
Vendor specific
160
F
0h
Compact Flash Association (CFA) power mode 1
161-167
X
0h
Reserved for assignment by the CFA
168
F
3h 2.5 inch
Words per logical Sector
Device Nominal Form Factor
4h 1.8 inch
5h Less than 1.8
inch
169
F
0001h
170-173
F
0h
Additional Product Identifier
0h
Reserve
174-175
DATA SET MANAGEMENT command is supported
176-205
V
0h
Current media serial number
206
F
0h
SCT Command Transport
207-208
F
0h
Reserved
209
F
4000h
Alignment of logical blocks within a physical block
210-211
V
0000h
Write-Read-Verify Sector Count Mode 3 (not support)
212-213
F
214-216
0000h
Write-Read-Verify Sector Count Mode 2 (not support)
0000h
NV Cache relate (not support)
Non-rotating media device
217
F
0001h
218
F
0h
Reserved
219
F
0h
NV Cache relate (not support)
220
V
0h
Write read verify feature set current mode
0h
Reserved
221
222
F
107Fh
Transport major version number
223
F
0h
Transport minor version number
224-229
0h
reserved
230-233
0h
Extend number of user addressable sectors
234
0001h
Minimum number of 512-byte data blocks per
DOWNLOAD MICROCODE command for mode 03h
235
0080h
Maximum number of 512-byte data blocks per
DOWNLOAD MICROCODE command for mode 03h
236-254
F
0h
255
X
XXA5h
Reserved
Integrity word (Checksum and Signature)
XX is variable
List of Device Identification for Each Capacity
Capacity
*1
*2
*3
*4
(GB)
(Word 1/Word 54)
(Word 57 – 58)
(Word 60 – 61)
(Word 100 – 103)
4
1E5Dh
778E30h
778E30h
778E30h
8
3CA5h
EEC9B0h
EEC9B0h
EEC9B0h
16
3FFFh
FBFC10h
1DD40B0h
1DD40B0h
24
3FFFh
FBFC10h
2CBB7B0h
2CBB7B0h
32
3FFFh
FBFC10h
3BA2EB0h
3BA2EB0h
64
3FFFh
FBFC10h
7740AB0h
7740AB0h
128
3FFFh
FBFC10h
EE7C2B0h
EE7C2B0h
256
3FFFh
FBFC10h
FFFFFFFh
1DCF32B0h
8. Physical Dimension
CFastTM Type I: 36.4mm (L) x 42.8mm (W) x 3.3mm (H)
Warning
• Do not bend, crush, drop, or place heavy objects on top of the Product. Do not use tweezers, pliers, or similar items
that could damage the Product. Take particular care when inserting or removing the Product. Stop using the Product
when the Product does not work properly. Failure to follow these instructions could result in fire, damage to the
Product and/or other property, and/or personal injury including burns and electric shock.
• Keep out of reach of small children. Accidental swallowing may cause suffocation or injury. Contact a doctor
immediately if you suspect a child has swallowed the Product. .
• Do not directly touch the interface pins, put them in contact with metal, strike them with hard objects, or cause
them to short. Do not expose to static electricity.
• Do not disassemble or modify the Product. This may cause electric shock, damage to the Product, or fire.
Notes on usage
• The Product contains nonvolatile semiconductor memory. Do not use the Product in accordance with a method of
usage other than that written in the manual. This may cause the destruction or loss of data.
• To protect against accidental data loss, you should back up your data frequently on more than one type of storage
media. **** Corporation assumes no liability for destruction or loss of data recorded on the Card for any reason.
• When used over a long period of time or repeatedly, the reading, writing and deleting capabilities of the Product will
eventually fail, and the performance speed of the Product may decrease below the original speed specific to the
Product's applicable class.
• If the Product is to be transferred or destroyed, note that the data it contained may still be recoverable unless it is
permanently deleted by third-party deletion software or similar means beforehand.
Product applications and design.
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office
equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as
expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that
require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss
of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use
includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical
equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment,
equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to
electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless
specifically permitted in this document.
No parts of this document may be reproduced , stored in a retrieval system, or transmitted, in any form or by any
means, mechanical ,electric, photocopying, recording or otherwise, without permission of Wilk Elektronik S.A.
Wilk Elektronik S.A does not make any warranty ,express or implied, with respect to this document, including as to
licensing, Non-infringement , merchantability or fitness for a particular purpose.
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