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DDR4 SDRAM Memory

Product Guide

SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION

AND SPECIFICATIONS WITHOUT NOTICE.

Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind.

This document and all information discussed herein remain the sole and exclusive property of

Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise.

Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply.

For updates or additional information about Samsung products, contact your nearest Samsung office.

All brand names, trademarks and registered trademarks belong to their respective owners.

- 1 -

Oct. 2016

Product Guide

Oct. 2016

DDR4 SDRAM Memory

1. DDR4 SDRAM MEMORY ORDERING INFORMATION

SAMSUNG Memory

DRAM

DRAM Type

Density

Bit Organization

1 2 3 4 5 6 7 8 9 10 11

K 4 A X X X X X X X - X X X X

Speed

Temp & Power

Package Type

Revision

Interface (V

DD

, V

DDQ

)

# of Internal Banks

1. SAMSUNG Memory : K

2. DRAM : 4

3. DRAM Type

A : DDR4 SDRAM (1.2V VDD)

4. Density

4G : 4Gb

8G : 8Gb

AG : 16Gb

BG : 32Gb

5. Bit Organization

04 : x 4

08 : x 8

16 : x16

6. # of Internal Banks

5 : 16 Banks

7. Interface ( V

DD

, V

DDQ

)

W : POD (1.2V, 1.2V)

8. Revision

E

F

C

D

G

M

A

B

: 1st Gen.

: 2nd Gen.

: 3rd Gen.

: 4th Gen.

: 5th Gen.

: 6th Gen.

: 7th Gen.

: 8th Gen.

9. Package Type

B

M

2

4

: FBGA (Halogen-free & Lead-free, Flip Chip)

: FBGA (Halogen-free & Lead-free, DDP)

: FBGA (Halogen-free & Lead-free, 2H TSV)

: FBGA (Halogen-free & Lead-free, 4H TSV)

10. Temp & Power

I

C : Commercial Temp.( 0°C ~ 85°C) & Normal Power

: Industrial Temp.(-40°C ~ 95°C) & Normal Power

11. Speed

PB

RC

TD

RB

TC

WD

: DDR4-2133 (1066MHz @ CL=15, tRCD=15, tRP=15)

: DDR4-2400 (1200MHz @ CL=17, tRCD=17, tRP=17)

: DDR4-2666 (1333MHz @ CL=19, tRCD=19, tRP=19)

: DDR4-2133 (1066MHz @ CL=17, tRCD=15, tRP=15)

: DDR4-2400 (1200MHz @ CL=19, tRCD=17, tRP=17)

: DDR4-2666 (1333MHz @ CL=22, tRCD=19, tRP=19)

- 2 -

Product Guide

Oct. 2016

DDR4 SDRAM Memory

2. DDR4 SDRAM Component Product Guide

Density Banks Part Number

Package & Power,

Temp.

& Speed

BCPB/RC

BCPB/RC

Org.

1G x 4

512M x 8

VDD Voltage

1.2V

4Gb D-die

16Banks

(4Bank Groups)

8Banks

(2Bank Groups)

K4A4G045WD

K4A4G085WD

K4A4G165WD

4Gb E-die

16Banks

(4Bank Groups)

K4A4G045WE

K4A4G085WE

8Banks

(2Bank Groups)

K4A4G165WE

16Banks

(4Bank Groups)

K4A8G045WB

8Gb B-die

K4A8G085WB

8Banks

(2Bank Groups)

K4A8G165WB

8Gb C-die

16Banks

(4Bank Groups)

K4A8G045WC

K4A8G085WC

8Banks

(2Bank Groups)

K4A8G165WC

NOTE:

1) Need to contact SAMSUNG for TD (2666Mbps) availability

BCPB/RC

BCPB/RC/TD

1)

BCPB/RC/TD

1)

BCPB/RC/TD

1)

BCPB/RC/TD 1)

BCPB/RC/TD 1)

BCPB/RC/TD 1)

BCRC/TD

1)

BCRC/TD

1)

BCRC/TD

1)

256M x 16

1G x 4

512M x 8

256M x 16

2G x 4

1G x 8

512M x 16

2G x 4

1G x 8

512M x 16

1.2V

1.2V

1.2V

1.2V

1.2V

1.2V

1.2V

PKG

78 ball FBGA

96 ball FBGA

78 ball FBGA

96 ball FBGA

78 ball FBGA

96 ball FBGA

78 ball FBGA

96 ball FBGA

Avail.

MP

MP

MP

CS

‘16 4Q

NOTE

- 3 -

Product Guide

Oct. 2016

DDR4 SDRAM Memory

3. DDR4 SDRAM Module Ordering Information

1 2 3 4 5 6 7 8 9 10 11 12 13

M X X X A X X X X X X X - X X X X

Memory Module

DIMM Type

Data bits

DRAM Component Type

Depth

# of Banks in Comp. & Interface

Bit Organization

1. Memory Module : M

Memory buffer

Speed

Temp & Power

PCB Revision

Package

Component Revision

8. Component Revision

M : 1st Gen.

B :

F :

3rd Gen.

5th Gen.

7th Gen.

A :

C :

E :

G :

2nd Gen.

4th Gen.

6th Gen.

8th Gen.

2. DIMM Type

3 : DIMM

4 : SODIMM

3. Data Bits

71: x64 260pin Unbuffered SODIMM

74 : x72 260pin ECC Unbuffered SODIMM

78: x64 288pin Unbuffered DIMM

86 : x72 288pin Load Reduced DIMM

91: x72 288pin ECC Unbuffered DIMM

92: x72 288pin VLP Registered DIMM

93 : x72 288pin Registered DIMM

9. Package

B : FBGA (Halogen-free & Lead-free, Flip Chip)

M

2

4

: FBGA (Halogen-free & Lead-free, DDP)

: FBGA (Halogen-free & Lead-free, 2H TSV)

: FBGA (Halogen-free & Lead-free, 4H TSV)

10. PCB Revision

0 : None

2 : 2nd Rev.

4 : 4th Rev.

1 : 1st Rev.

3 : 3rd Rev.

4. DRAM Component Type

A : DDR4 SDRAM (1.2V VDD)

11. Temp & Power

C : Commercial Temp.( 0°C ~ 85°C) & Normal Power

5. Depth

56

51

1G

: 256M

: 512M

: 1G

2G

4G

: 2G

: 4G

8G : 8G

AG : 16G

1K

2K

: 1G (for 8Gb)

: 2G (for 8Gb)

4K

8K

AK

: 4G (for 8Gb)

: 8G (for 8Gb)

: 16G

6. # of Banks in comp. & Interface

4 : 16Banks & POD-1.2V

12. Speed

PB

RC

TD

: DDR4-2133 (1066MHz @ CL=15, tRCD=15, tRP=15)

: DDR4-2400 (1200MHz @ CL=17, tRCD=17, tRP=17)

: DDR4-2666 (1333MHz @ CL=19, tRCD=19, tRP=19)

: DDR4-2133 (1066MHz @ CL=17, tRCD=15, tRP=15) RB

TC

WD

: DDR4-2400 (1200MHz @ CL=19, tRCD=17, tRP=17)

: DDR4-2666 (1333MHz @ CL=22, tRCD=19, tRP=19)

7. Bit Organization

0 : x 4

3 : x 8

4 : x 16

- 4 -

Product Guide

4. DDR4 SDRAM Module Product Guide

Oct. 2016

DDR4 SDRAM Memory

4.1 288Pin DDR4 Registered DIMM

288Pin DDR4 Registered DIMM

Org.

Density Part Number

Temp &

Power &

Speed

Raw Card Composition

Comp.

Version

512G x 72 4GB M393A5143DB0 CPB D (1Rx8) 512M x8 * 9pcs 4Gb D-die

Internal

Banks

Rank

16 1

512G x 72 4GB M393A5143DB0

1G x72

1G x72

1G x72

1G x72

1G x 72

1G x 72

1G x 72

1G x 72

1G x 72

1G x 72

1G x 72

1G x 72

1G x 72

8GB M393A1G40DB0

8GB M393A1G40DB1

8GB M393A1G43DB0

8GB M393A1G43DB1

8GB M393A1G40EB1

8GB M393A1G40EB1

8GB M393A1G40EB1

8GB M393A1G43EB1

8GB M393A1G43EB1

8GB M393A1G43EB1

8GB M393A1K43BB0

8GB M393A1K43BB0

8GB M393A1K43BB0

2G x72 16GB M393A2G40DB0

2G x72 16GB M393A2G40DB1

2G x72 16GB M393A2G40EB1

2G x72 16GB M393A2G40EB1

2G x72 16GB M393A2G40EB1

2G x72 16GB M393A2K40BB0

2G x72 16GB M393A2K40BB1

2G x72 16GB M393A2K40BB1

2G x72 16GB M393A2K43BB1

2G x72 16GB M393A2K43BB1

CRC D (1Rx8)

CPB C (1Rx4)

CRC C (1Rx4)

CPB E (2Rx8)

CRC E (2Rx8)

CPB C (1Rx4)

CRC C (1Rx4)

CTD C (1Rx4)

CPB E (2Rx8)

CRC E (2Rx8)

CTD E (2Rx8)

CPB D (1Rx8)

CRC D (1Rx8)

CTD D (1Rx8)

CPB A (2Rx4)

CRC A (2Rx4)

CPB A (2Rx4)

CRC A (2Rx4)

CTD A (2Rx4)

CPB C (1Rx4)

CRC C (1Rx4)

CTD C (1Rx4)

CPB E (2Rx8)

CRC E (2Rx8)

512M x8 * 9pcs 4Gb D-die

1G x4 * 18pcs 4Gb D-die

1G x4 * 18pcs 4Gb D-die

512M x8 * 18pcs 4Gb D-die

512M x8 * 18pcs 4Gb D-die

1G x4 * 18pcs 4Gb E-die

1G x4 * 18pcs 4Gb E-die

1G x4 * 18pcs 4Gb E-die

512M x8 * 18pcs 4Gb E-die

512M x8 * 18pcs 4Gb E-die

512M x8 * 18pcs 4Gb E-die

1G x8 * 9pcs 8Gb B-die

1G x8 * 9pcs 8Gb B-die

1G x8 * 9pcs 8Gb B-die

1G x4 * 36pcs 4Gb D-die

1G x4 * 36pcs 4Gb D-die

1G x4 * 36pcs 4Gb E-die

1G x4 * 36pcs 4Gb E-die

1G x4 * 36pcs 4Gb E-die

2G x4 * 18pcs 8Gb B-die

2G x4 * 18pcs 8Gb B-die

2G x4 * 18pcs 8Gb B-die

1G x8 * 18pcs 8Gb B-die

1G x8 * 18pcs 8Gb B-die

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

1

1

1

2

2

1

1

1

2

2

2

1

1

1

2

2

2

2

2

1

1

1

2

2

PKG Height Avail.

NOTE

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

EOL

4Q’17

EOL

4Q’17

EOL

3Q’17

EOL

3Q’17

EOL

3Q’17

EOL

3Q’17

MP

MP

MP

MP

MP

MP

MP

MP

MP

EOL

2Q’17

EOL

2Q’17

MP

MP

MP

MP

MP

MP

MP

MP

- 5 -

Product Guide

2G x72 16GB M393A2K43BB1

4G x72 32GB M393A4K40BB0

CTD E (2Rx8)

CPB A (2Rx4)

1G x8 * 18pcs 8Gb B-die 16

2G x4 * 36pcs 8Gb B-die 16

4G x72 32GB M393A4K40BB1 CRC A (2Rx4) 2G x4 * 36pcs 8Gb B-die 16

4G x72 32GB M393A4K40BB1

8G x72

8G x72

8G x 72

64GB

64GB

64GB

M393A8K40B21

M393A8K40B21

M393A8K40B21

16G x 72 128GB M393AAK40B41

16G x 72 128GB M393AAK40B41

CTD A (2Rx4) 2G x4 * 36pcs 8Gb B-die

CRB A (4Rx4)

CTC A (4Rx4)

CWD A (4Rx4)

CTC A (8Rx4)

CWD A (8Rx4)

2H TSV

4G x4 * 36pcs 8Gb B-die

2H TSV

4G x4 * 36pcs 8Gb B-die

2H TSV

4G x4 * 36pcs 8Gb B-die

4H TSV

8G x4 * 36pcs 8Gb B-die

4H TSV

8G x4 * 36pcs 8Gb B-die

16

16

16

16

16

16

Oct. 2016

DDR4 SDRAM Memory

4

8

4

4

8

2

2

2

2

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

MP

MP

MP

MP

MP

MP

CS

4Q’16

MP

CS

4Q’16

4.2 288Pin DDR4 Load Reduced DIMM

288Pin DDR4 Load Reduced DIMM

Org.

Density Part Number

Temp &

Power &

Speed

Raw Card Composition

Comp.

Version

4G x72 32GB M386A4G40DM0 CPB

4G x72 32GB M386A4G40DM1 CRC

4G x72 32GB M386A4G40EM2 CPB

4G x72 32GB M386A4G40EM2 CRC

D (4Rx4)

D (4Rx4)

D (4Rx4)

D (4Rx4)

DDP

2G x4 * 36pcs 4Gb D-die

DDP

2G x4 * 36pcs 4Gb D-die

DDP

2G x4 * 36pcs 4Gb E-die

DDP

2G x4 * 36pcs 4Gb E-die

Internal

Banks

Rank

16

16

16

16

4

4

4

4

4G x72 32GB M386A4K40BB0 CRC A (2Rx4) 2G x4 * 36pcs 8Gb B-die 16 2

8G x72 64GB M386A8K40BM1 CPB

8G x72 64GB M386A8K40BM1 CRC

8G x72 64GB M386A8K40BM2 CTD

16G x72 128GB M386AAK40B40 CTC

D (4Rx4)

D (4Rx4)

D (4Rx4)

A (8Rx4)

16G x72 128GB M386AAK40B40 CWD A (8Rx4)

DDP

4G x4 * 36pcs 8Gb B-die

DDP

4G x4 * 36pcs 8Gb B-die

DDP

4G x4 * 36pcs 8Gb B-die

4H TSV

8G x4 * 36pcs 8Gb B-die

4H TSV

8G x4 * 36pcs 8Gb B-die

16

16

16

16

16

4

4

4

8

8

PKG Height Avail.

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

MP

MP

MP

MP

MP

31.25mm

TBD

EOL

4Q’17

EOL

4Q’17

CS

1Q’17

CS

1Q’17

NOTE

- 6 -

Product Guide

Oct. 2016

DDR4 SDRAM Memory

4.3 288Pin DDR4 VLP Registered DIMM

288Pin DDR4 VLP Registered DIMM

Org.

Density Part Number

Temp &

Power &

Speed

Raw Card Composition

Comp.

Version

2G x72 16GB M392A2G40DM0

2G x72 16GB M392A2K43BB0

CPB

CPB

J (2Rx4)

H (2Rx8)

DDP

2G x4 * 18pcs 4Gb D-die

1G x8

*

18pcs 8Gb B-die

Internal

Banks

Rank

16

16

2

2

2G x72 16GB M392A2K43BB0

4G x72 32GB M392A4K40BM0

4G x72 32GB M392A4K40BM0

CRC

CPB

CRC

H(2Rx8)

J (2Rx4)

J (2Rx4)

1G x8

*

18pcs 8Gb B-die

DDP

4G x4

*

18pcs 8Gb B-die

DDP

4G x4

*

18pcs 8Gb B-die

16

16

16

2

2

2

PKG Height Avail.

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

18.75mm

18.75mm

18.75mm

18.75mm

18.75mm

EOL

4Q’17

MP

MP

MP

MP

NOTE

4.4 260Pin DDR4 ECC SODIMM

Org.

Density Part Number

Temp &

Power &

Speed

Raw Card

260Pin DDR4 ECC SODIMM

Composition

Comp.

Version

1G x72 8GB M474A1G43DB0 CPB G (2Rx8) 512M x8 * 18pcs 4Gb D-die

Internal

Banks

Rank

16 2

1G x72 8GB M474A1G43DB1

1G x72 8GB M474A1G43EB1

1G x72 8GB M474A1G43EB1

1G x72 8GB M474A1G43EB1

2G x72 16GB M474A2K43BB1

2G x72 16GB M474A2K43BB1

2G x72 16GB M474A2K43BB1

CRC

CPB

CRC

CTD

CPB

CRC

CTD

G (2Rx8) 512M x8 * 18pcs 4Gb D-die

G (2Rx8) 512M x8 * 18pcs 4Gb E-die

G (2Rx8) 512M x8 * 18pcs 4Gb E-die

G (2Rx8) 512M x8 * 18pcs 4Gb E-die

G (2Rx8)

G (2Rx8)

G (2Rx8)

1G x8 * 18pcs 8Gb B-die

1G x8 * 18pcs 8Gb B-die

1G x8 * 18pcs 8Gb B-die

16

16

16

16

16

16

16

2

2

2

2

2

2

2

PKG

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

Height

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

Avail.

EOL

4Q’17

ELO

4Q’17

MP

NOTE

MP

TBD

MP

MP

TBD

- 7 -

Product Guide

Oct. 2016

DDR4 SDRAM Memory

4.5 260Pin DDR4 Non ECC SODIMM

260Pin DDR4 Non ECC SODIMM

Org.

Density Part Number

Temp &

Power &

Speed

Raw Card Composition

Comp.

Version

256M x64 2GB M471A5644EB0 CPB A (1Rx16) 256M x16

*

4pcs 4Gb E-die

Internal

Banks

Rank

16 1

256M x64 2GB M471A5644EB0

512M x64 4GB M471A5143DB0

512M x64 4GB M471A5143EB0

512M x64 4GB M471A5143EB1

512M x64 4GB M471A5244BB0

512M x64 4GB M471A5244BB0

512M x64 4GB M471A5244BB0

512M x64 4GB M471A5244CB0

512M x64 4GB M471A5244CB0

1G x64 8GB M471A1G43DB0

1G x 64 8GB M471A1G43EB1

1G x 64 8GB M471A1G43EB1

1G x 64 8GB M471A1K43BB0

1G x 64 8GB M471A1K43BB1

1G x 64 8GB M471A1K43BB1

1G x 64 8GB M471A1K43CB1

1G x 64 8GB M471A1K43CB1

2G x 64 16GB M471A2K43BB1

2G x 64 16GB M471A2K43BB1

2G x 64 16GB M471A2K43BB1

2G x 64 16GB M471A2K43CB1

2G x 64 16GB M471A2K43CB1

CRC

CPB

CPB

CRC

CPB

CRC

CTD

CRC

CTD

CPB

CPB

CRC

CPB

CRC

CTD

CRC

CTD

CPB

CRC

CTD

CRC

CTD

A(1Rx16) 256M x16

*

4pcs 4Gb E-die

A (1Rx8) 512M x8 * 8pcs 4Gb D-die

A (1Rx8) 512M x8

*

8pcs 4Gb E-die

A (1Rx8) 512M x8

*

8pcs 4Gb E-die

A (1Rx16) 512M x16 * 8pcs 8Gb B-die

A (1Rx16) 512M x16 * 8pcs 8Gb B-die

A (1Rx16) 512M x16 * 8pcs 8Gb B-die

A (1Rx16) 512M x16 * 8pcs 8Gb C-die

A (1Rx16) 512M x16 * 8pcs 8Gb C-die

E (2Rx8) 512M x8 * 16pcs 4Gb D-die

E (2Rx8) 512M x8

*

16pcs 4Gb E-die

E (2Rx8) 512M x8

*

16pcs 4Gb E-die

A (1Rx8) 1G x8

*

8pcs 8Gb B-die

A (1Rx8) 1G x8

*

8pcs 8Gb B-die

A (1Rx16)

A (1Rx16)

A (1Rx16)

E (2Rx8)

E (2Rx8)

E (2Rx8)

E (2Rx8)

E (2Rx8)

1G x16 * 8pcs 8Gb B-die

1G x16 * 8pcs 8Gb C-die

1G x16 * 8pcs 8Gb C-die

1G x8

*

16pcs 8Gb B-die

1G x8

*

16pcs 8Gb B-die

1G x8 * 16pcs 8Gb C-die

1G x8 * 16pcs 8Gb C-die

1G x8 * 16pcs 8Gb C-die

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

1

1

1

1

1

1

1

1

1

2

2

2

1

1

1

1

1

2

2

2

2

2

PKG

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

96ball

FBGA

96ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

Height

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

30mm

Avail.

EOL

1Q’18

EOL

1Q’18

EOL

1Q’17

MP

MP

MP

MP

MP

MP

MP

MP

MP

MP

MP

MP

MP

MP

MP

MP

MP

MP

MP

MP

NOTE

- 8 -

Product Guide

Oct. 2016

DDR4 SDRAM Memory

4.6 288Pin DDR4 ECC UDIMM

Org.

Density Part Number

512M x72 4GB M391A5143EB1

Temp &

Power &

Speed

CPB

Raw Card

288Pin DDR4 ECC UDIMM

Composition

Comp.

Version

D (1Rx8) 512M x8

*

9pcs 4Gb E-die

Internal

Banks

Rank

16 1

512M x72 4GB M391A5143EB1

512M x72 4GB M391A5143EB1

1G x72

1G x72

1G x72

1G x72

1G x72

1G x72

1G x72

1G x72

8GB M391A1G43DB0

8GB M391A1G43DB1

8GB M391A1G43EB1

8GB M391A1G43EB1

8GB M391A1G43EB1

8GB M391A1K43BB1

8GB M391A1K43BB1

8GB M391A1K43BB1

2G x72 16GB M391A2K43BB1

2G x72 16GB M391A2K43BB1

2G x72 16GB M391A2K43BB1

CRC

CTD

CPB

CRC

CTD

CPB

CRC

CPB

CRC

CTD

CPB

CRC

CTD

D (1Rx8) 512M x8

*

9pcs 4Gb E-die

D (1Rx8) 512M x8

*

9pcs 4Gb E-die

E (2Rx8) 512M x8

*

18pcs 4Gb D-die

E (2Rx8) 512M x8

*

18pcs 4Gb D-die

E (2Rx8) 512M x8

*

18pcs 4Gb E-die

E (2Rx8) 512M x8

*

18pcs 4Gb E-die

E (2Rx8) 512M x8

*

18pcs 4Gb E-die

D (1Rx8)

D (1Rx8)

D (1Rx8)

E (2Rx8)

E (2Rx8)

E (2Rx8)

1G x8 * 9pcs 8Gb B-die

1G x8 * 9pcs 8Gb B-die

1G x8 * 9pcs 8Gb B-die

1G x8

*

18pcs 8Gb B-die

1G x8

*

18pcs 8Gb B-die

1G x8

*

18pcs 8Gb B-die

16

16

16

16

16

16

16

16

16

16

16

16

16

1

1

2

2

2

2

2

1

1

1

2

2

2

PKG Height Avail.

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

31.25mm

31.25mm

31.25mm

TBD

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

MP

MP

EOL

2Q’17

EOL

2Q’17

31.25mm

TBD

MP

MP

MP

MP

MP

MP

MP

31.25mm

TBD

NOTE

- 9 -

Product Guide

Oct. 2016

DDR4 SDRAM Memory

4.7 288Pin DDR4 Non ECC UDIMM

288Pin DDR4 Non ECC UDIMM

Org.

Density Part Number

Temp &

Power &

Speed

Raw Card Composition

Comp.

Version

256M x64 2GB M378A5644EB0 CPB A (1Rx16) 256M x16 * 8psc 4Gb E-die

Internal

Banks

Rank

16 1

256M x64 2GB M378A5644EB0

512M x64 4GB M378A5143DB0

512M x64 4GB M378A5143EB1

512M x64 4GB M378A5143EB1

512M x64 4GB M378A5244BB0

512M x64 4GB M378A5244BB0

512M x64 4GB M378A5244BB0

512M x64 4GB M378A5244CB0

512M x64 4GB M378A5244CB0

1G x64

1G x64

1G x64

1G x64

1G x64

1G x64

1G x64

1G x64

8GB M378A1G43DB0

8GB M378A1G43EB1

8GB M378A1G43EB1

8GB M378A1K43BB1

8GB M378A1K43BB2

8GB M378A1K43BB2

8GB M378A1K43CB2

8GB M378A1K43CB2

2G x64 16GB M378A2K43BB1

2G x64 16GB M378A2K43BB1

2G x64 16GB M378A2K43BB1

2G x64 16GB M378A2K43CB1

2G x64 16GB M378A2K43CB1

CRC

CPB

CPB

CRC

CPB

CRC

CTD

CRC

CTD

CPB

CPB

CRC

CPB

CRC

CTD

CRC

CTD

CPB

CRC

CTD

CRC

CTD

C (1Rx16) 256M x16 * 8psc 4Gb E-die

A (1Rx8) 512M x8 * 8pcs 4Gb D-die

A (1Rx8) 512M x8 * 8pcs 4Gb E-die

A (1Rx8) 512M x8 * 8pcs 4Gb E-die

C (1Rx16) 512M x16 * 4psc 8Gb B-die

C (1Rx16) 512M x16 * 4psc 8Gb B-die

C (1Rx16) 512M x16 * 4psc 8Gb B-die

C (1Rx16) 512M x16 * 4psc 8Gb C-die

C (1Rx16) 512M x16 * 4psc 8Gb C-die

B (2Rx8) 512M x8 * 16pcs 4Gb D-die

B (2Rx8) 512M x8 * 16pcs 4Gb E-die

B (2Rx8) 512M x8 * 16pcs 4Gb E-die

A (1Rx8)

A (1Rx8)

A (1Rx8)

A (1Rx8)

A (1Rx8)

B (2Rx8)

B (2Rx8)

B (2Rx8)

B (2Rx8)

B (2Rx8)

1G x8 * 8pcs 8Gb B-die

1G x8 * 8pcs 8Gb B-die

1G x8 * 8psc 8Gb B-die

1G x8 * 8psc 8Gb C-die

1G x8 * 8psc 8Gb C-die

1G x8 * 16pcs 8Gb B-die

1G x8 * 16pcs 8Gb B-die

1G x8 * 16psc 8Gb B-die

1G x8 * 16psc 8Gb C-die

1G x8 * 16psc 8Gb C-die

4

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

16

1

1

1

1

1

1

1

1

1

2

2

2

1

1

1

1

1

2

2

2

2

2

PKG Height Avail.

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

96ball

FBGA

96ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

78ball

FBGA

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

31.25mm

EOL

EOL

EOL

1Q’17

MP

MP

MP

MP

MP

MP

MP

EOL

1Q’17

MP

MP

MP

MP

MP

MP

MP

MP

MP

MP

MP

MP

NOTE

- 10 -

Product Guide

Oct. 2016

DDR4 SDRAM Memory

5. RDIMM, LRDIMM Memory Buffer Information

5.1 Label Example

Country

C06T0006213305BA3F YYWW

32GB 4Rx4 PC3L -10600R-09-12-AB1-D4

M386A4G40DM0-CPB

5.2 JEDEC Description Information

1. Module total capacity, in gigabytes, for primary bus (ECC not counted)

2. Number of package ranks of memory installed and number of logical ranks per package rank

3. Device organization (data bit width) of SDRAMs used on this assembly

4. SDRAM and support component supply voltage (VDD)

blank = 1.2 V operable

5. Module speed in Mb/s/data pin

6. SDRAM speed grade

7. Module Type

E = Unbuffered DIMM ("UDIMM"), x64 primary + 8 bit ECC module data bus

L = Load Reduced DIMM (“LRDIMM”), x64 primary + 8 bit ECC module data bus

R = Registered DIMM ("RDIMM"), x64 primary + 8 bit ECC module data bus

S = Small Outline DIMM ("SO-DIMM"), no ECC (x64 bit module data bus)

U = Unbuffered DIMM ("UDIMM"), no ECC (x64 bit module data bus)

T = Unbuffered 72-bit small outline DIMM ("72b-SO-DIMM"), x64 primary + 8bit ECC module data bus

8. Reference design file used for this design (if applicable)

A = Reference design for raw card ’A’ is used for this assembly

B = Reference design for raw card ’B’ is used for this assembly

AC = Reference design for raw card ’AC’ is used for this assembly (example only)

ZZ = None of the JEDEC standard reference designs were used for this assembly

9. Revision number of the reference design used

0 = Initial release

1 = First revision

2 = Second revision

P = Pre-release or Engineering sample

Z = To be used when reference raw card = ZZ

10. JEDEC SPD Revision Encoding and Additions level used on this DIMM

5.3 RCD (& Data Buffer) Information

(These codes are only used SAMSUNG, Not JEDEC)

11&12. RCD, Data Buffer Revision & Vendor used on this DIMM

Jedec Desctription on label

DC0

MB1

P20

MC0

DC3

MA0

DB0

PA0

Buffer Vendor

IDT

Montage

Inphi

Montage

IDT

Montage

IDT

Inphi

RCD ver

C0

B1

GS02

C0

C0

A0

B0

A0

DB ver (Only LRDIMM)

B1

A1

GS01

B0

A3

A1

B0

A0

- 11 -

Product Guide

6. Package Dimension

Oct. 2016

DDR4 SDRAM Memory

78ball FBGA for

4Gb D-die (x4/x8) / DDP 8Gb D-die (x4) / 4H 16Gb D-die (x4)

4Gb E-die (x4/x8)

8Gb B-die (x4/x8) / DDP 16Gb B-die (x4) / 2H 16Gb B-die (x4) / 4H 32Gb B-die (x4)

8Gb C-die (x4/x8)

(Datum A)

(Datum B)

G

H

E

F

C

D

A

B

J

K

L

M

N

78 - Æ0.48 Solder ball

(Post Reflow Æ0.50 ± 0.05)

0.2

M A B

0.80

7.50 0.10

0.80 x 8  6.40

1.60

3.20

9 8 7 6 5 4 3 2 1

BOTTOM VIEW

A

#A1 INDEX MARK

B

#A1 7.50 0.10

TOP VIEW

0.37 0.05

1.10 0.10

- 12 -

Product Guide

96ball FBGA for

4Gb D-die (x16) / 4Gb E-die (x16)

8Gb B-die (x16) / 8Gb C-die (x16)

(Datum A)

(Datum B)

L

M

N

P

J

K

R

T

G

H

E

F

C

D

A

B

96 - 0.48 Solder ball

(Post reflow 0.50 ± 0.05)

0.2

M A B

7.50  0.10

0.80

x 8 = 6.40

0.80

1.60

3.20

9 8 7 6 5 4 3 2 1

(0.30)

(0.60)

A

#A1 INDEX MARK

MOLDING AREA

B

BOTTOM VIEW

Oct. 2016

DDR4 SDRAM Memory

#A1

7.50 0.10

TOP VIEW

0.37 0.05

1.10 0.10

- 13 -

Product Guide

7. Module Dimension x72 288pin DDR4 SDRAM RDIMM x72 288pin DDR4 SDRAM LRDIMM x72 288pin DDR4 SDRAM ECC UDIMM x64 288pin DDR4 SDRAM Non ECC UDIMM

133.35

Oct. 2016

DDR4 SDRAM Memory

Units : Millimeters

Max 3.9

64.60

126.65

56.10

3.35

C

0.6 ± 0.03

0.85

Detail B,E

0.25

A E D B

9.35

10.20

Detail C

1.4 ± 0.10

4.30

9.35

10.20

Detail D

1.50 ± 0.05

Detail A

3.85 ± 0.10

- 14 -

Product Guide x72 260pin DDR4 SDRAM ECC SODIMM x64 260pin DDR4 SDRAM Non ECC SODIMM

69.60

65.60

Oct. 2016

DDR4 SDRAM Memory

Max 3.7

Units : Millimeters

1.2 ± 0.10

35.50

A B

28.50

1.375

1.00 ± 0.05

4.00 ± 0.10

Detail A

0.35 ± 0.03

0.50

2.55

0.30 MAX

Detail B

- 15 -

Product Guide x72 288pin DDR4 SDRAM VLP RDIMM

133.35

64.60

126.65

56.10

C

0.6 ± 0.03

0.85

Detail B,E

0.25

A E D B

9.35

10.20

Detail C

Oct. 2016

DDR4 SDRAM Memory

Units : Millimeters

Max 3.9

1.4 ± 0.10

4.30

1.50 ± 0.05

Detail A

3.85 ± 0.10

9.35

10.20

Detail D

- 16 -

Product Guide

Oct. 2016

DDR4 SDRAM Memory x72 288pin DDR4 SDRAM VLP RDIMM Heat Spreader Design Guide (DDP)

1. FRONT

9.9

8.9

50.81

127 ± 0.12

21.49

21.49

50.81

Caution

"Hot surface"

63.68

0.4

0.8 ± 0.05

2. BACK

9.9

8.9

50.81

127 ± 0.12

21.49

21.49

50.81

"Hot surface"

3. CLIP

6.8 ± 0.1

3.80

+0.5

-0.8

35.82

± 0.12

- 17 -

Product Guide

Oct. 2016

DDR4 SDRAM Memory

x72 288pin DDR4 SDRAM RDIMM Heat Spreader Design Guide (TSV)

1. FRONT PART

5.785

133.15

+0.40

-0.20

130.45 ± 0.2

31.1

17.02

6.075

127

2. BACK PART

3. CLIP PART

39.3 ± 0.2

R4

7 ± 0.12

Clip open size

3.2 ± 0.6

- 18 -

Product Guide

Oct. 2016

DDR4 SDRAM Memory x72 288pin DDR4 SDRAM LRDIMM Heat Spreader Design Guide (DDP)

1. FRONT PART

133.15

+0.40

-0.20

130.45 ± 0.2

127 ± 0.25

2. BACK PART

3. CLIP PART

39.3 ± 0.2

7 ± 0.12

Clip open size

3.2 ± 0.6

- 19 -

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