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DDR4 SDRAM Memory
Product Guide
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AND SPECIFICATIONS WITHOUT NOTICE.
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All brand names, trademarks and registered trademarks belong to their respective owners.
- 1 -
Oct. 2016
Product Guide
Oct. 2016
DDR4 SDRAM Memory
1. DDR4 SDRAM MEMORY ORDERING INFORMATION
SAMSUNG Memory
DRAM
DRAM Type
Density
Bit Organization
1 2 3 4 5 6 7 8 9 10 11
K 4 A X X X X X X X - X X X X
Speed
Temp & Power
Package Type
Revision
Interface (V
DD
, V
DDQ
)
# of Internal Banks
1. SAMSUNG Memory : K
2. DRAM : 4
3. DRAM Type
A : DDR4 SDRAM (1.2V VDD)
4. Density
4G : 4Gb
8G : 8Gb
AG : 16Gb
BG : 32Gb
5. Bit Organization
04 : x 4
08 : x 8
16 : x16
6. # of Internal Banks
5 : 16 Banks
7. Interface ( V
DD
, V
DDQ
)
W : POD (1.2V, 1.2V)
8. Revision
E
F
C
D
G
M
A
B
: 1st Gen.
: 2nd Gen.
: 3rd Gen.
: 4th Gen.
: 5th Gen.
: 6th Gen.
: 7th Gen.
: 8th Gen.
9. Package Type
B
M
2
4
: FBGA (Halogen-free & Lead-free, Flip Chip)
: FBGA (Halogen-free & Lead-free, DDP)
: FBGA (Halogen-free & Lead-free, 2H TSV)
: FBGA (Halogen-free & Lead-free, 4H TSV)
10. Temp & Power
I
C : Commercial Temp.( 0°C ~ 85°C) & Normal Power
: Industrial Temp.(-40°C ~ 95°C) & Normal Power
11. Speed
PB
RC
TD
RB
TC
WD
: DDR4-2133 (1066MHz @ CL=15, tRCD=15, tRP=15)
: DDR4-2400 (1200MHz @ CL=17, tRCD=17, tRP=17)
: DDR4-2666 (1333MHz @ CL=19, tRCD=19, tRP=19)
: DDR4-2133 (1066MHz @ CL=17, tRCD=15, tRP=15)
: DDR4-2400 (1200MHz @ CL=19, tRCD=17, tRP=17)
: DDR4-2666 (1333MHz @ CL=22, tRCD=19, tRP=19)
- 2 -
Product Guide
Oct. 2016
DDR4 SDRAM Memory
2. DDR4 SDRAM Component Product Guide
Density Banks Part Number
Package & Power,
Temp.
& Speed
BCPB/RC
BCPB/RC
Org.
1G x 4
512M x 8
VDD Voltage
1.2V
4Gb D-die
16Banks
(4Bank Groups)
8Banks
(2Bank Groups)
K4A4G045WD
K4A4G085WD
K4A4G165WD
4Gb E-die
16Banks
(4Bank Groups)
K4A4G045WE
K4A4G085WE
8Banks
(2Bank Groups)
K4A4G165WE
16Banks
(4Bank Groups)
K4A8G045WB
8Gb B-die
K4A8G085WB
8Banks
(2Bank Groups)
K4A8G165WB
8Gb C-die
16Banks
(4Bank Groups)
K4A8G045WC
K4A8G085WC
8Banks
(2Bank Groups)
K4A8G165WC
NOTE:
1) Need to contact SAMSUNG for TD (2666Mbps) availability
BCPB/RC
BCPB/RC/TD
1)
BCPB/RC/TD
1)
BCPB/RC/TD
1)
BCPB/RC/TD 1)
BCPB/RC/TD 1)
BCPB/RC/TD 1)
BCRC/TD
1)
BCRC/TD
1)
BCRC/TD
1)
256M x 16
1G x 4
512M x 8
256M x 16
2G x 4
1G x 8
512M x 16
2G x 4
1G x 8
512M x 16
1.2V
1.2V
1.2V
1.2V
1.2V
1.2V
1.2V
PKG
78 ball FBGA
96 ball FBGA
78 ball FBGA
96 ball FBGA
78 ball FBGA
96 ball FBGA
78 ball FBGA
96 ball FBGA
Avail.
MP
MP
MP
CS
‘16 4Q
NOTE
- 3 -
Product Guide
Oct. 2016
DDR4 SDRAM Memory
3. DDR4 SDRAM Module Ordering Information
1 2 3 4 5 6 7 8 9 10 11 12 13
M X X X A X X X X X X X - X X X X
Memory Module
DIMM Type
Data bits
DRAM Component Type
Depth
# of Banks in Comp. & Interface
Bit Organization
1. Memory Module : M
Memory buffer
Speed
Temp & Power
PCB Revision
Package
Component Revision
8. Component Revision
M : 1st Gen.
B :
F :
3rd Gen.
5th Gen.
7th Gen.
A :
C :
E :
G :
2nd Gen.
4th Gen.
6th Gen.
8th Gen.
2. DIMM Type
3 : DIMM
4 : SODIMM
3. Data Bits
71: x64 260pin Unbuffered SODIMM
74 : x72 260pin ECC Unbuffered SODIMM
78: x64 288pin Unbuffered DIMM
86 : x72 288pin Load Reduced DIMM
91: x72 288pin ECC Unbuffered DIMM
92: x72 288pin VLP Registered DIMM
93 : x72 288pin Registered DIMM
9. Package
B : FBGA (Halogen-free & Lead-free, Flip Chip)
M
2
4
: FBGA (Halogen-free & Lead-free, DDP)
: FBGA (Halogen-free & Lead-free, 2H TSV)
: FBGA (Halogen-free & Lead-free, 4H TSV)
10. PCB Revision
0 : None
2 : 2nd Rev.
4 : 4th Rev.
1 : 1st Rev.
3 : 3rd Rev.
4. DRAM Component Type
A : DDR4 SDRAM (1.2V VDD)
11. Temp & Power
C : Commercial Temp.( 0°C ~ 85°C) & Normal Power
5. Depth
56
51
1G
: 256M
: 512M
: 1G
2G
4G
: 2G
: 4G
8G : 8G
AG : 16G
1K
2K
: 1G (for 8Gb)
: 2G (for 8Gb)
4K
8K
AK
: 4G (for 8Gb)
: 8G (for 8Gb)
: 16G
6. # of Banks in comp. & Interface
4 : 16Banks & POD-1.2V
12. Speed
PB
RC
TD
: DDR4-2133 (1066MHz @ CL=15, tRCD=15, tRP=15)
: DDR4-2400 (1200MHz @ CL=17, tRCD=17, tRP=17)
: DDR4-2666 (1333MHz @ CL=19, tRCD=19, tRP=19)
: DDR4-2133 (1066MHz @ CL=17, tRCD=15, tRP=15) RB
TC
WD
: DDR4-2400 (1200MHz @ CL=19, tRCD=17, tRP=17)
: DDR4-2666 (1333MHz @ CL=22, tRCD=19, tRP=19)
7. Bit Organization
0 : x 4
3 : x 8
4 : x 16
- 4 -
Product Guide
4. DDR4 SDRAM Module Product Guide
Oct. 2016
DDR4 SDRAM Memory
4.1 288Pin DDR4 Registered DIMM
288Pin DDR4 Registered DIMM
Org.
Density Part Number
Temp &
Power &
Speed
Raw Card Composition
Comp.
Version
512G x 72 4GB M393A5143DB0 CPB D (1Rx8) 512M x8 * 9pcs 4Gb D-die
Internal
Banks
Rank
16 1
512G x 72 4GB M393A5143DB0
1G x72
1G x72
1G x72
1G x72
1G x 72
1G x 72
1G x 72
1G x 72
1G x 72
1G x 72
1G x 72
1G x 72
1G x 72
8GB M393A1G40DB0
8GB M393A1G40DB1
8GB M393A1G43DB0
8GB M393A1G43DB1
8GB M393A1G40EB1
8GB M393A1G40EB1
8GB M393A1G40EB1
8GB M393A1G43EB1
8GB M393A1G43EB1
8GB M393A1G43EB1
8GB M393A1K43BB0
8GB M393A1K43BB0
8GB M393A1K43BB0
2G x72 16GB M393A2G40DB0
2G x72 16GB M393A2G40DB1
2G x72 16GB M393A2G40EB1
2G x72 16GB M393A2G40EB1
2G x72 16GB M393A2G40EB1
2G x72 16GB M393A2K40BB0
2G x72 16GB M393A2K40BB1
2G x72 16GB M393A2K40BB1
2G x72 16GB M393A2K43BB1
2G x72 16GB M393A2K43BB1
CRC D (1Rx8)
CPB C (1Rx4)
CRC C (1Rx4)
CPB E (2Rx8)
CRC E (2Rx8)
CPB C (1Rx4)
CRC C (1Rx4)
CTD C (1Rx4)
CPB E (2Rx8)
CRC E (2Rx8)
CTD E (2Rx8)
CPB D (1Rx8)
CRC D (1Rx8)
CTD D (1Rx8)
CPB A (2Rx4)
CRC A (2Rx4)
CPB A (2Rx4)
CRC A (2Rx4)
CTD A (2Rx4)
CPB C (1Rx4)
CRC C (1Rx4)
CTD C (1Rx4)
CPB E (2Rx8)
CRC E (2Rx8)
512M x8 * 9pcs 4Gb D-die
1G x4 * 18pcs 4Gb D-die
1G x4 * 18pcs 4Gb D-die
512M x8 * 18pcs 4Gb D-die
512M x8 * 18pcs 4Gb D-die
1G x4 * 18pcs 4Gb E-die
1G x4 * 18pcs 4Gb E-die
1G x4 * 18pcs 4Gb E-die
512M x8 * 18pcs 4Gb E-die
512M x8 * 18pcs 4Gb E-die
512M x8 * 18pcs 4Gb E-die
1G x8 * 9pcs 8Gb B-die
1G x8 * 9pcs 8Gb B-die
1G x8 * 9pcs 8Gb B-die
1G x4 * 36pcs 4Gb D-die
1G x4 * 36pcs 4Gb D-die
1G x4 * 36pcs 4Gb E-die
1G x4 * 36pcs 4Gb E-die
1G x4 * 36pcs 4Gb E-die
2G x4 * 18pcs 8Gb B-die
2G x4 * 18pcs 8Gb B-die
2G x4 * 18pcs 8Gb B-die
1G x8 * 18pcs 8Gb B-die
1G x8 * 18pcs 8Gb B-die
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
1
1
1
2
2
1
1
1
2
2
2
1
1
1
2
2
2
2
2
1
1
1
2
2
PKG Height Avail.
NOTE
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
EOL
4Q’17
EOL
4Q’17
EOL
3Q’17
EOL
3Q’17
EOL
3Q’17
EOL
3Q’17
MP
MP
MP
MP
MP
MP
MP
MP
MP
EOL
2Q’17
EOL
2Q’17
MP
MP
MP
MP
MP
MP
MP
MP
- 5 -
Product Guide
2G x72 16GB M393A2K43BB1
4G x72 32GB M393A4K40BB0
CTD E (2Rx8)
CPB A (2Rx4)
1G x8 * 18pcs 8Gb B-die 16
2G x4 * 36pcs 8Gb B-die 16
4G x72 32GB M393A4K40BB1 CRC A (2Rx4) 2G x4 * 36pcs 8Gb B-die 16
4G x72 32GB M393A4K40BB1
8G x72
8G x72
8G x 72
64GB
64GB
64GB
M393A8K40B21
M393A8K40B21
M393A8K40B21
16G x 72 128GB M393AAK40B41
16G x 72 128GB M393AAK40B41
CTD A (2Rx4) 2G x4 * 36pcs 8Gb B-die
CRB A (4Rx4)
CTC A (4Rx4)
CWD A (4Rx4)
CTC A (8Rx4)
CWD A (8Rx4)
2H TSV
4G x4 * 36pcs 8Gb B-die
2H TSV
4G x4 * 36pcs 8Gb B-die
2H TSV
4G x4 * 36pcs 8Gb B-die
4H TSV
8G x4 * 36pcs 8Gb B-die
4H TSV
8G x4 * 36pcs 8Gb B-die
16
16
16
16
16
16
Oct. 2016
DDR4 SDRAM Memory
4
8
4
4
8
2
2
2
2
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
MP
MP
MP
MP
MP
MP
CS
4Q’16
MP
CS
4Q’16
4.2 288Pin DDR4 Load Reduced DIMM
288Pin DDR4 Load Reduced DIMM
Org.
Density Part Number
Temp &
Power &
Speed
Raw Card Composition
Comp.
Version
4G x72 32GB M386A4G40DM0 CPB
4G x72 32GB M386A4G40DM1 CRC
4G x72 32GB M386A4G40EM2 CPB
4G x72 32GB M386A4G40EM2 CRC
D (4Rx4)
D (4Rx4)
D (4Rx4)
D (4Rx4)
DDP
2G x4 * 36pcs 4Gb D-die
DDP
2G x4 * 36pcs 4Gb D-die
DDP
2G x4 * 36pcs 4Gb E-die
DDP
2G x4 * 36pcs 4Gb E-die
Internal
Banks
Rank
16
16
16
16
4
4
4
4
4G x72 32GB M386A4K40BB0 CRC A (2Rx4) 2G x4 * 36pcs 8Gb B-die 16 2
8G x72 64GB M386A8K40BM1 CPB
8G x72 64GB M386A8K40BM1 CRC
8G x72 64GB M386A8K40BM2 CTD
16G x72 128GB M386AAK40B40 CTC
D (4Rx4)
D (4Rx4)
D (4Rx4)
A (8Rx4)
16G x72 128GB M386AAK40B40 CWD A (8Rx4)
DDP
4G x4 * 36pcs 8Gb B-die
DDP
4G x4 * 36pcs 8Gb B-die
DDP
4G x4 * 36pcs 8Gb B-die
4H TSV
8G x4 * 36pcs 8Gb B-die
4H TSV
8G x4 * 36pcs 8Gb B-die
16
16
16
16
16
4
4
4
8
8
PKG Height Avail.
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
MP
MP
MP
MP
MP
31.25mm
TBD
EOL
4Q’17
EOL
4Q’17
CS
1Q’17
CS
1Q’17
NOTE
- 6 -
Product Guide
Oct. 2016
DDR4 SDRAM Memory
4.3 288Pin DDR4 VLP Registered DIMM
288Pin DDR4 VLP Registered DIMM
Org.
Density Part Number
Temp &
Power &
Speed
Raw Card Composition
Comp.
Version
2G x72 16GB M392A2G40DM0
2G x72 16GB M392A2K43BB0
CPB
CPB
J (2Rx4)
H (2Rx8)
DDP
2G x4 * 18pcs 4Gb D-die
1G x8
*
18pcs 8Gb B-die
Internal
Banks
Rank
16
16
2
2
2G x72 16GB M392A2K43BB0
4G x72 32GB M392A4K40BM0
4G x72 32GB M392A4K40BM0
CRC
CPB
CRC
H(2Rx8)
J (2Rx4)
J (2Rx4)
1G x8
*
18pcs 8Gb B-die
DDP
4G x4
*
18pcs 8Gb B-die
DDP
4G x4
*
18pcs 8Gb B-die
16
16
16
2
2
2
PKG Height Avail.
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
18.75mm
18.75mm
18.75mm
18.75mm
18.75mm
EOL
4Q’17
MP
MP
MP
MP
NOTE
4.4 260Pin DDR4 ECC SODIMM
Org.
Density Part Number
Temp &
Power &
Speed
Raw Card
260Pin DDR4 ECC SODIMM
Composition
Comp.
Version
1G x72 8GB M474A1G43DB0 CPB G (2Rx8) 512M x8 * 18pcs 4Gb D-die
Internal
Banks
Rank
16 2
1G x72 8GB M474A1G43DB1
1G x72 8GB M474A1G43EB1
1G x72 8GB M474A1G43EB1
1G x72 8GB M474A1G43EB1
2G x72 16GB M474A2K43BB1
2G x72 16GB M474A2K43BB1
2G x72 16GB M474A2K43BB1
CRC
CPB
CRC
CTD
CPB
CRC
CTD
G (2Rx8) 512M x8 * 18pcs 4Gb D-die
G (2Rx8) 512M x8 * 18pcs 4Gb E-die
G (2Rx8) 512M x8 * 18pcs 4Gb E-die
G (2Rx8) 512M x8 * 18pcs 4Gb E-die
G (2Rx8)
G (2Rx8)
G (2Rx8)
1G x8 * 18pcs 8Gb B-die
1G x8 * 18pcs 8Gb B-die
1G x8 * 18pcs 8Gb B-die
16
16
16
16
16
16
16
2
2
2
2
2
2
2
PKG
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
Height
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
Avail.
EOL
4Q’17
ELO
4Q’17
MP
NOTE
MP
TBD
MP
MP
TBD
- 7 -
Product Guide
Oct. 2016
DDR4 SDRAM Memory
4.5 260Pin DDR4 Non ECC SODIMM
260Pin DDR4 Non ECC SODIMM
Org.
Density Part Number
Temp &
Power &
Speed
Raw Card Composition
Comp.
Version
256M x64 2GB M471A5644EB0 CPB A (1Rx16) 256M x16
*
4pcs 4Gb E-die
Internal
Banks
Rank
16 1
256M x64 2GB M471A5644EB0
512M x64 4GB M471A5143DB0
512M x64 4GB M471A5143EB0
512M x64 4GB M471A5143EB1
512M x64 4GB M471A5244BB0
512M x64 4GB M471A5244BB0
512M x64 4GB M471A5244BB0
512M x64 4GB M471A5244CB0
512M x64 4GB M471A5244CB0
1G x64 8GB M471A1G43DB0
1G x 64 8GB M471A1G43EB1
1G x 64 8GB M471A1G43EB1
1G x 64 8GB M471A1K43BB0
1G x 64 8GB M471A1K43BB1
1G x 64 8GB M471A1K43BB1
1G x 64 8GB M471A1K43CB1
1G x 64 8GB M471A1K43CB1
2G x 64 16GB M471A2K43BB1
2G x 64 16GB M471A2K43BB1
2G x 64 16GB M471A2K43BB1
2G x 64 16GB M471A2K43CB1
2G x 64 16GB M471A2K43CB1
CRC
CPB
CPB
CRC
CPB
CRC
CTD
CRC
CTD
CPB
CPB
CRC
CPB
CRC
CTD
CRC
CTD
CPB
CRC
CTD
CRC
CTD
A(1Rx16) 256M x16
*
4pcs 4Gb E-die
A (1Rx8) 512M x8 * 8pcs 4Gb D-die
A (1Rx8) 512M x8
*
8pcs 4Gb E-die
A (1Rx8) 512M x8
*
8pcs 4Gb E-die
A (1Rx16) 512M x16 * 8pcs 8Gb B-die
A (1Rx16) 512M x16 * 8pcs 8Gb B-die
A (1Rx16) 512M x16 * 8pcs 8Gb B-die
A (1Rx16) 512M x16 * 8pcs 8Gb C-die
A (1Rx16) 512M x16 * 8pcs 8Gb C-die
E (2Rx8) 512M x8 * 16pcs 4Gb D-die
E (2Rx8) 512M x8
*
16pcs 4Gb E-die
E (2Rx8) 512M x8
*
16pcs 4Gb E-die
A (1Rx8) 1G x8
*
8pcs 8Gb B-die
A (1Rx8) 1G x8
*
8pcs 8Gb B-die
A (1Rx16)
A (1Rx16)
A (1Rx16)
E (2Rx8)
E (2Rx8)
E (2Rx8)
E (2Rx8)
E (2Rx8)
1G x16 * 8pcs 8Gb B-die
1G x16 * 8pcs 8Gb C-die
1G x16 * 8pcs 8Gb C-die
1G x8
*
16pcs 8Gb B-die
1G x8
*
16pcs 8Gb B-die
1G x8 * 16pcs 8Gb C-die
1G x8 * 16pcs 8Gb C-die
1G x8 * 16pcs 8Gb C-die
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
1
1
1
1
1
1
1
1
1
2
2
2
1
1
1
1
1
2
2
2
2
2
PKG
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
96ball
FBGA
96ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
Height
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
30mm
Avail.
EOL
1Q’18
EOL
1Q’18
EOL
1Q’17
MP
MP
MP
MP
MP
MP
MP
MP
MP
MP
MP
MP
MP
MP
MP
MP
MP
MP
MP
MP
NOTE
- 8 -
Product Guide
Oct. 2016
DDR4 SDRAM Memory
4.6 288Pin DDR4 ECC UDIMM
Org.
Density Part Number
512M x72 4GB M391A5143EB1
Temp &
Power &
Speed
CPB
Raw Card
288Pin DDR4 ECC UDIMM
Composition
Comp.
Version
D (1Rx8) 512M x8
*
9pcs 4Gb E-die
Internal
Banks
Rank
16 1
512M x72 4GB M391A5143EB1
512M x72 4GB M391A5143EB1
1G x72
1G x72
1G x72
1G x72
1G x72
1G x72
1G x72
1G x72
8GB M391A1G43DB0
8GB M391A1G43DB1
8GB M391A1G43EB1
8GB M391A1G43EB1
8GB M391A1G43EB1
8GB M391A1K43BB1
8GB M391A1K43BB1
8GB M391A1K43BB1
2G x72 16GB M391A2K43BB1
2G x72 16GB M391A2K43BB1
2G x72 16GB M391A2K43BB1
CRC
CTD
CPB
CRC
CTD
CPB
CRC
CPB
CRC
CTD
CPB
CRC
CTD
D (1Rx8) 512M x8
*
9pcs 4Gb E-die
D (1Rx8) 512M x8
*
9pcs 4Gb E-die
E (2Rx8) 512M x8
*
18pcs 4Gb D-die
E (2Rx8) 512M x8
*
18pcs 4Gb D-die
E (2Rx8) 512M x8
*
18pcs 4Gb E-die
E (2Rx8) 512M x8
*
18pcs 4Gb E-die
E (2Rx8) 512M x8
*
18pcs 4Gb E-die
D (1Rx8)
D (1Rx8)
D (1Rx8)
E (2Rx8)
E (2Rx8)
E (2Rx8)
1G x8 * 9pcs 8Gb B-die
1G x8 * 9pcs 8Gb B-die
1G x8 * 9pcs 8Gb B-die
1G x8
*
18pcs 8Gb B-die
1G x8
*
18pcs 8Gb B-die
1G x8
*
18pcs 8Gb B-die
16
16
16
16
16
16
16
16
16
16
16
16
16
1
1
2
2
2
2
2
1
1
1
2
2
2
PKG Height Avail.
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
31.25mm
31.25mm
31.25mm
TBD
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
MP
MP
EOL
2Q’17
EOL
2Q’17
31.25mm
TBD
MP
MP
MP
MP
MP
MP
MP
31.25mm
TBD
NOTE
- 9 -
Product Guide
Oct. 2016
DDR4 SDRAM Memory
4.7 288Pin DDR4 Non ECC UDIMM
288Pin DDR4 Non ECC UDIMM
Org.
Density Part Number
Temp &
Power &
Speed
Raw Card Composition
Comp.
Version
256M x64 2GB M378A5644EB0 CPB A (1Rx16) 256M x16 * 8psc 4Gb E-die
Internal
Banks
Rank
16 1
256M x64 2GB M378A5644EB0
512M x64 4GB M378A5143DB0
512M x64 4GB M378A5143EB1
512M x64 4GB M378A5143EB1
512M x64 4GB M378A5244BB0
512M x64 4GB M378A5244BB0
512M x64 4GB M378A5244BB0
512M x64 4GB M378A5244CB0
512M x64 4GB M378A5244CB0
1G x64
1G x64
1G x64
1G x64
1G x64
1G x64
1G x64
1G x64
8GB M378A1G43DB0
8GB M378A1G43EB1
8GB M378A1G43EB1
8GB M378A1K43BB1
8GB M378A1K43BB2
8GB M378A1K43BB2
8GB M378A1K43CB2
8GB M378A1K43CB2
2G x64 16GB M378A2K43BB1
2G x64 16GB M378A2K43BB1
2G x64 16GB M378A2K43BB1
2G x64 16GB M378A2K43CB1
2G x64 16GB M378A2K43CB1
CRC
CPB
CPB
CRC
CPB
CRC
CTD
CRC
CTD
CPB
CPB
CRC
CPB
CRC
CTD
CRC
CTD
CPB
CRC
CTD
CRC
CTD
C (1Rx16) 256M x16 * 8psc 4Gb E-die
A (1Rx8) 512M x8 * 8pcs 4Gb D-die
A (1Rx8) 512M x8 * 8pcs 4Gb E-die
A (1Rx8) 512M x8 * 8pcs 4Gb E-die
C (1Rx16) 512M x16 * 4psc 8Gb B-die
C (1Rx16) 512M x16 * 4psc 8Gb B-die
C (1Rx16) 512M x16 * 4psc 8Gb B-die
C (1Rx16) 512M x16 * 4psc 8Gb C-die
C (1Rx16) 512M x16 * 4psc 8Gb C-die
B (2Rx8) 512M x8 * 16pcs 4Gb D-die
B (2Rx8) 512M x8 * 16pcs 4Gb E-die
B (2Rx8) 512M x8 * 16pcs 4Gb E-die
A (1Rx8)
A (1Rx8)
A (1Rx8)
A (1Rx8)
A (1Rx8)
B (2Rx8)
B (2Rx8)
B (2Rx8)
B (2Rx8)
B (2Rx8)
1G x8 * 8pcs 8Gb B-die
1G x8 * 8pcs 8Gb B-die
1G x8 * 8psc 8Gb B-die
1G x8 * 8psc 8Gb C-die
1G x8 * 8psc 8Gb C-die
1G x8 * 16pcs 8Gb B-die
1G x8 * 16pcs 8Gb B-die
1G x8 * 16psc 8Gb B-die
1G x8 * 16psc 8Gb C-die
1G x8 * 16psc 8Gb C-die
4
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
1
1
1
1
1
1
1
1
1
2
2
2
1
1
1
1
1
2
2
2
2
2
PKG Height Avail.
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
96ball
FBGA
96ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
78ball
FBGA
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
31.25mm
EOL
EOL
EOL
1Q’17
MP
MP
MP
MP
MP
MP
MP
EOL
1Q’17
MP
MP
MP
MP
MP
MP
MP
MP
MP
MP
MP
MP
NOTE
- 10 -
Product Guide
Oct. 2016
DDR4 SDRAM Memory
5. RDIMM, LRDIMM Memory Buffer Information
5.1 Label Example
Country
C06T0006213305BA3F YYWW
32GB 4Rx4 PC3L -10600R-09-12-AB1-D4
M386A4G40DM0-CPB
5.2 JEDEC Description Information
1. Module total capacity, in gigabytes, for primary bus (ECC not counted)
2. Number of package ranks of memory installed and number of logical ranks per package rank
3. Device organization (data bit width) of SDRAMs used on this assembly
4. SDRAM and support component supply voltage (VDD)
blank = 1.2 V operable
5. Module speed in Mb/s/data pin
6. SDRAM speed grade
7. Module Type
E = Unbuffered DIMM ("UDIMM"), x64 primary + 8 bit ECC module data bus
L = Load Reduced DIMM (“LRDIMM”), x64 primary + 8 bit ECC module data bus
R = Registered DIMM ("RDIMM"), x64 primary + 8 bit ECC module data bus
S = Small Outline DIMM ("SO-DIMM"), no ECC (x64 bit module data bus)
U = Unbuffered DIMM ("UDIMM"), no ECC (x64 bit module data bus)
T = Unbuffered 72-bit small outline DIMM ("72b-SO-DIMM"), x64 primary + 8bit ECC module data bus
8. Reference design file used for this design (if applicable)
A = Reference design for raw card ’A’ is used for this assembly
B = Reference design for raw card ’B’ is used for this assembly
AC = Reference design for raw card ’AC’ is used for this assembly (example only)
ZZ = None of the JEDEC standard reference designs were used for this assembly
9. Revision number of the reference design used
0 = Initial release
1 = First revision
2 = Second revision
P = Pre-release or Engineering sample
Z = To be used when reference raw card = ZZ
10. JEDEC SPD Revision Encoding and Additions level used on this DIMM
5.3 RCD (& Data Buffer) Information
(These codes are only used SAMSUNG, Not JEDEC)
11&12. RCD, Data Buffer Revision & Vendor used on this DIMM
Jedec Desctription on label
DC0
MB1
P20
MC0
DC3
MA0
DB0
PA0
Buffer Vendor
IDT
Montage
Inphi
Montage
IDT
Montage
IDT
Inphi
RCD ver
C0
B1
GS02
C0
C0
A0
B0
A0
DB ver (Only LRDIMM)
B1
A1
GS01
B0
A3
A1
B0
A0
- 11 -
Product Guide
6. Package Dimension
Oct. 2016
DDR4 SDRAM Memory
78ball FBGA for
4Gb D-die (x4/x8) / DDP 8Gb D-die (x4) / 4H 16Gb D-die (x4)
4Gb E-die (x4/x8)
8Gb B-die (x4/x8) / DDP 16Gb B-die (x4) / 2H 16Gb B-die (x4) / 4H 32Gb B-die (x4)
8Gb C-die (x4/x8)
(Datum A)
(Datum B)
G
H
E
F
C
D
A
B
J
K
L
M
N
78 - Æ0.48 Solder ball
(Post Reflow Æ0.50 ± 0.05)
0.2
M A B
0.80
7.50 0.10
0.80 x 8 6.40
1.60
3.20
9 8 7 6 5 4 3 2 1
BOTTOM VIEW
A
#A1 INDEX MARK
B
#A1 7.50 0.10
TOP VIEW
0.37 0.05
1.10 0.10
- 12 -
Product Guide
96ball FBGA for
4Gb D-die (x16) / 4Gb E-die (x16)
8Gb B-die (x16) / 8Gb C-die (x16)
(Datum A)
(Datum B)
L
M
N
P
J
K
R
T
G
H
E
F
C
D
A
B
96 - 0.48 Solder ball
(Post reflow 0.50 ± 0.05)
0.2
M A B
7.50 0.10
0.80
x 8 = 6.40
0.80
1.60
3.20
9 8 7 6 5 4 3 2 1
(0.30)
(0.60)
A
#A1 INDEX MARK
MOLDING AREA
B
BOTTOM VIEW
Oct. 2016
DDR4 SDRAM Memory
#A1
7.50 0.10
TOP VIEW
0.37 0.05
1.10 0.10
- 13 -
Product Guide
7. Module Dimension x72 288pin DDR4 SDRAM RDIMM x72 288pin DDR4 SDRAM LRDIMM x72 288pin DDR4 SDRAM ECC UDIMM x64 288pin DDR4 SDRAM Non ECC UDIMM
133.35
Oct. 2016
DDR4 SDRAM Memory
Units : Millimeters
Max 3.9
64.60
126.65
56.10
3.35
C
0.6 ± 0.03
0.85
Detail B,E
0.25
A E D B
9.35
10.20
Detail C
1.4 ± 0.10
4.30
9.35
10.20
Detail D
1.50 ± 0.05
Detail A
3.85 ± 0.10
- 14 -
Product Guide x72 260pin DDR4 SDRAM ECC SODIMM x64 260pin DDR4 SDRAM Non ECC SODIMM
69.60
65.60
Oct. 2016
DDR4 SDRAM Memory
Max 3.7
Units : Millimeters
1.2 ± 0.10
35.50
A B
28.50
1.375
1.00 ± 0.05
4.00 ± 0.10
Detail A
0.35 ± 0.03
0.50
2.55
0.30 MAX
Detail B
- 15 -
Product Guide x72 288pin DDR4 SDRAM VLP RDIMM
133.35
64.60
126.65
56.10
C
0.6 ± 0.03
0.85
Detail B,E
0.25
A E D B
9.35
10.20
Detail C
Oct. 2016
DDR4 SDRAM Memory
Units : Millimeters
Max 3.9
1.4 ± 0.10
4.30
1.50 ± 0.05
Detail A
3.85 ± 0.10
9.35
10.20
Detail D
- 16 -
Product Guide
Oct. 2016
DDR4 SDRAM Memory x72 288pin DDR4 SDRAM VLP RDIMM Heat Spreader Design Guide (DDP)
1. FRONT
9.9
8.9
50.81
127 ± 0.12
21.49
21.49
50.81
Caution
"Hot surface"
63.68
0.4
0.8 ± 0.05
2. BACK
9.9
8.9
50.81
127 ± 0.12
21.49
21.49
50.81
"Hot surface"
3. CLIP
6.8 ± 0.1
3.80
+0.5
-0.8
35.82
± 0.12
- 17 -
Product Guide
Oct. 2016
DDR4 SDRAM Memory
x72 288pin DDR4 SDRAM RDIMM Heat Spreader Design Guide (TSV)
1. FRONT PART
5.785
133.15
+0.40
-0.20
130.45 ± 0.2
31.1
17.02
6.075
127
2. BACK PART
3. CLIP PART
39.3 ± 0.2
R4
7 ± 0.12
Clip open size
3.2 ± 0.6
- 18 -
Product Guide
Oct. 2016
DDR4 SDRAM Memory x72 288pin DDR4 SDRAM LRDIMM Heat Spreader Design Guide (DDP)
1. FRONT PART
133.15
+0.40
-0.20
130.45 ± 0.2
127 ± 0.25
2. BACK PART
3. CLIP PART
39.3 ± 0.2
7 ± 0.12
Clip open size
3.2 ± 0.6
- 19 -
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