Computer-On-Module
Computer-On-Module
COM Express
Modules
Mini
Compact
Basic
Carrier Boards
Qseven
Modules
Carrier Boards
Revision Control • Long Product Life Cycle
Expertise on Carrier Board Design
COM Express® Mini Computer-On-Module
1. Customized evaluation of carrier board design
Atom
Atom
Develop
Manufacture
BT9A3 Series
CD9A3 Series
Intel® Atom™ E3800 series
Intel® AtomTM D2550/N2800/N2600
Chipset
N/A
Intel® NM10
Memory
1GB/2GB/4GB DDR3L onboard
2GB DDR3 onboard
Display
LVDS, DDI
LVDS, DDI
1 Intel
1 Intel
USB 3.0
1
N/A
USB 2.0
8
8
RS232/422/485
N/A
N/A
RS232
N/A
N/A
SATA 3.0
N/A
N/A
SATA 2.0
2
2
SSD
N/A
Yes (optional)
IDE, FDD
N/A
N/A
CF
N/A
N/A
PCIe x16
N/A
N/A
PCIe x4
N/A
N/A
PCIe x1
3
3
Mini PCIe
N/A
N/A
PCI
N/A
N/A
8-bit
8-bit
HDA
HDA
LPC
N/A
N/A
CAN-bus
N/A
N/A
TPM
(optional)
Yes
N/A
Watchdog
Yes
Yes
Power Input
4.75V~20V
4.75V~20V
Compliance
R2.1, Type 10
R2.1, Type 10
Dimensions
84mm x 55mm
84mm x 55mm
Model
2. Customized BIOS and software services
BIOS
SDK
API
Processor
BSP
3. Customized validation and testing
Ethernet
USB
4. Customized product life cycle management
● Revision control
● Continuous supply of components and stock inventory management
● Support and services
5. Carrier board design guide
● We provide schematics/placement and layout to aid you in
designing your own carrier board
Storage
2
4
3
Serial
2
4
3
1
1
1
2
2
11
10
1 40
U50
203
204
1
DDR3_2
203
2
1
10
DDR3_1
204
8
206
2
208
10
2
8
206
5
1
208
30
8
1
CR960
61 59 57 55 53 51 49 47 45 43 41 39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1
42 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2
20
BG
BF
BE
BD
BC
BB
BA
AY
AW
AV
AU
AT
AR
AP
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
20
30
8
U17
21 20
30
31
2
1
10
73
71
1 2
16
3 4
4
1
5
6 7
3
8
9
10
SSD
5
49 47 45 43 41 39 37 35 33 31 29 27 25
42 40 38 36 34
72
B
1
20
71
E
A
L
M
G
H
J
U
V
W
N
P
R
C
AB
AC
F
B
T
6
17
72
8
74
5
B
73
10
E
E
C
74
BJ
BH
BG
BF
BE
BD
BC
BB
BA
AY
AW
AU
AT
AR
AP
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
U
R
N
L
J
G
E
D
C
B
A
1
1
18 17 15 13 11 9 7 5 3 1
12 10 8 6 4 2
11
-
CPU_FAN
2
D
1
+
1
2
1
G
S
37
48
D2
1
36
SPI
G1 S1
205
207
G2
D1
205
A
C
1
C
D1
1
12
A
G2
C
25
A
A
207
S1
G1
D2
1
1
C
24
13
1
A
1
D
G
S
C
Expansion
1
C
REV.2
MADE IN TAIWAN
3
1
3
2
4
1
2
4
4
3
1
4
2
3
2
1
2
6. EAPI Programming Guide
● Backlight function
● I2C Bus function
● GPIO function
● Storage function
● Watchdog function
7. Customized embedded OS
8. Customized API library for functions like Watchdog, GPIO, Backlight, etc.
Watchdog
www.dfi.com
GPIO
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Digital I/O
Audio
Controller
Modules
Mini
COM Express
Mini
Design
Computer-On-Module
Coming Soon
Intel® AtomTM E3800 Series
COM Express® Mini
Intel® AtomTM E3800 Series
COM Express® Mini
BT9A3 Series
BT9A3 Series
Features
Intel Atom
D2550/2800/
2600
Intel NM10
MEMORY
STORAGE
EXPANSION
PROCESSOR
• Intel® AtomTM/Intel® Celeron® processors
• BGA 1170 packaging technology
• 22nm process technology
Please refer to the Ordering Information below
1GB/2GB/4GB DDR3L onboard
4GB/8GB/16GB eMMC onboard (optional)
3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 LVDS, 1 DDI (HDMI/DVI/DP)
1 HDA
9 USB: 1 USB 3.0, 8 USB 2.0
2 SATA 2.0
8-bit DIO
1 LAN
COM Express® R2.1 Mini, Type 10
84mm x 55mm (3.30" x 2.16")
DDR3
TOP Soon
Coming
LAN
DIMENSIONS
850C
DDR3
-400C
DDR3L
onboard
BOTTOM
USB 3.0
SATA 2.0
Wide
Temperature
eMMC
Availability: May 2014
Mechanical Drawing
STORAGE
• Supports 4GB, 8GB and 16GB eMMC onboard (optional)
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
DAMAGE FREE INTELLIGENCE
• Monitors CPU/system temperature and overheat alarm
• Monitors Vcore/Vgfx/VDDR/3V3 voltages and failure alarm
• Monitors CPU/system fan speed and failure alarm
• Watchdog timer function
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics
• Supports LVDS and DDI interfaces
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to
1920x1200 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
• HDMI, DVI: resolution up to 2560x1600 @ 24Hz
• DP: resolution up to 2560x1600 @ 60Hz
• Supports hardware acceleration for DirectX 11, OCL 1.2, OGL 3.2,
H.264, MPEG2, MVC, VC-1, WMV9 and VP8
BIOS
• 16Mbit SPI BIOS
POWER CONSUMPTION
• TBD
OS SUPPORT
• TBD
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Block Diagram
91.00
87.00
0.00
4.00
TEMPERATURE
• Operating
- Atom: 0oC to 60oC, -20oC to 70oC, -40oC to 85oC
- Celeron: 0oC to 60oC
• Storage: -40oC to 85oC
ONBOARD LAN FEATURES
• Intel® I210 Gigabit Ethernet Controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
91.00
87.00
91.00
87.00
SYSTEM MEMORY
• 1GB/2GB/4GB DDR3L onboard
• Supports DDR3L 1333MHz
• Supports dual channel memory interface
EXPANSION INTERFACES
• Supports 1 USB 3.0 port
• Supports 8 USB 2.0 ports
- 4 integrated USB 2.0 ports
- 1 USB HSIC for 4 USB 2.0 ports
• Supports 3 PCIe x1 (default); or 1 PCIe x4 (PCIe port 3 share with on
board LAN by default)
• Supports LPC interface
• Supports I2C interface
• Supports SMBus interface
• Suppotrs 2 serial interfaces (TX/RX)
• Supports 8-bit Digital I/O
SERIAL ATA (SATA) INTERFACE
• Supports 2 Serial ATA interfaces
• SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
Top View
DDI
LVDS
HUMIDITY
• 5% to 90%
eDP
POWER INPUT
• 4.75V~20V, 5VSB, VCC_RTC (ATX mode)
• 4.75V~20V, VCC_RTC (AT mode)
PCB
• Dimensions
- COM Express® Mini
- 84mm (3.30") x 55mm (2.16")
• Compliance
- PICMG COM Express® R2.1, Type 10
PTN3460
TRUSTED PLATFORM MODULE (TPM) - optional
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password
protection
LPC Bus
0.00
4.00
0.00
4.00
SLP/LID
91.00
76.00
0.00
4.00
WDT
System Fan
PWM/TACH
I2C Bus
Embedded
Controller
IT8528
DDR3
1333MHz
Dual Channel
EEPROM
DDR3L 1GB
8x onboard
SM Bus
8-bit DIO
TCA6408A
Coming Soon
Bottom View
HD Audio
Atom E3800 Series
/Celeron
C/D
A/B
Serial Port1, 2 Tx/Rx
USB 3.0 1x
USB 2.0 4x
USB 2.0 4x
14.00
USB4604I
USB HSIC
MMC Bus
SATA 2.0 2x
2.00
0.00
PCIe x1
eMMC
(Optional)
PCIe x1
0.00
12.50
70.20
PCIe x1
PCIe x1 (Opt.)
GLAN
53.00
SPI
Flash
Intel® GLAN
I210
PCIe x1
Switch
Ordering Information
Model Name
BT9A3
-
Temperature
Memory
eMMC
B
1
0
1: 1GB
B: 0oC to 60oC
T: -40oC to 85oC 2: 2GB
4: 4GB
0:
4:
8:
1:
Processors
None
4GB
8GB
16GB
E45
E45: Intel® AtomTM E3845, Quad Core, 2M Cache, 1.91GHz, 10W
E27: Intel® AtomTM E3827, Dual Core, 1M Cache, 1.75GHz, 8W
E26: Intel® AtomTM E3826, Dual Core, 1M Cache, 1.46GHz, 7W
E25: Intel® AtomTM E3825, Dual Core, 1M Cache, 1.33GHz, 6W
E15: Intel® AtomTM E3815, Single Core, 0.5M Cache, 1.46GHz, 5W
J00: Intel® Celeron® J1900, Quad Core, 2M Cache, up to 2.42GHz, 10W
N20: Intel® Celeron® N2920, Quad Core, 2M Cache, 2.00GHz, 7.5W
20.00
Heat sink
22.00
Module PCB
Heat spreader
Standoff
www.dfi.com
2.00
11.00
55.00
Fan
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
Optional Items
• 1 BT9A3 board
• 1 QR (Quick Reference)
• 1 DVD
• COM100-B carrier board kit
• Heat sink: TBD
• Heat sink with fan: TBD
Modules
Mini
COM Express
Mini
CPU Fan
Specifications
Computer-On-Module
Atom
Intel® AtomTM D2550/N2800/N2600
COM Express® Mini
Intel® AtomTM D2550/N2800/N2600
COM Express® Mini
CD9A3 Series
CD9A3 Series
Features
Intel Atom
D2550/2800/
2600
Intel NM10
MEMORY
EXPANSION
DDR3
TOP
LAN
DIMENSIONS
SSD
DDR3
PROCESSOR
• CD9A3-25B20:
- Intel® AtomTM D2550, 1.86GHz, 2x 512K L2, 10W TDP, dual-core
- Cooling option: heatsink with cooling fan
• CD9A3-28B20:
- Intel® AtomTM N2800, 1.86GHz, 2x 512K L2, 6.5W TDP, dual-core
- Cooling option: heatsink (fanless solution)
• CD9A3-26B20:
- Intel® AtomTM N2600, 1.6GHz, 2x 512K L2, 3.5W TDP, dual-core
- Cooling option: heatsink (fanless solution)
2GB DDR3 onboard
3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 LVDS, 1 DDI (HDMI/DVI/DP)
8 USB 2.0
2 SATA 2.0
8-bit DIO
1 LAN
COM Express® R2.1 Mini, Type 10
84mm x 55mm (3.30" x 2.16")
Optional
DDR3
onboard
8 USB
2 SATA
CHIPSET
• Intel® NM10 Express chipset
R2.1
Type10
BOTTOM
Mechanical Drawing
Block Diagram
Ø2.70(*4 pcs)
51.00
47.00
51.00
47.00
Top View
0.00
4.00
5.80
0.00
63.50
43.50
40.00
85.00
4.50
76.00
60.00
47.00
2.00
COM Express Type 10 Board to Board Connector
Bottom View
2.00
0.00
CORE
LVDS
(24 bit, Single Channel)
0.00
4.00
80.00
76.00
0.00
4.00
Processor
VR12/IMVP7
Graphics
CORE
DDI
CORE
Intel® Atom™
D2550/N2800/N2600
Memory
Controller
DMI 4x/2x
(Direct Media
Interface)
PCIe x1 3x
GLAN
I210
MDI
PCIe x1
DDR3 8x
total 2GB
DDR3 800/1066MHz
non-ECC
Single Channel
ONBOARD GRAPHICS FEATURES
•Intel® GMA 3650 (Intel® AtomTM D2550/N2800)
Intel® GMA 3600 (Intel® AtomTM N2600)
• Supports LVDS and DDI interfaces
• LVDS: resolution up to 1440x900 @ 60Hz, 18/24bit (Intel® AtomTM
D2550); resolution up to 1366x768 @ 60Hz, 18bit (Intel® AtomTM
N2800/N2600)
• Digital Display Interface: HDMI, DVI and DP
• HDMI, DVI: resolution up to 1920x1200 @ 60Hz
• DP: resolution up to 1600x1200 @ 60Hz
•Supports Hardware H.264/AVC, MPEG-2 video decoder, VC-1,
DirectX 9, 1080p decoder
EXPANSION INTERFACES
•Supports 8 USB 2.0 ports
•Supports 3 PCIe x1 interfaces
•Supports LPC interface
•Supports SMBus interface
•Supports I2C interface
•Supports 2 serial interfaces (TX/RX)
•Supports 8-bit Digital I/O
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature
• Monitors CPU fan speed
• Monitors Vcore/VCC RTC/DDR3 voltages
• Watchdog timer function
BIOS
• 16Mbit SPI BIOS
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -40oC to 85oC
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
HUMIDITY
• 10% to 90%
ONBOARD LAN FEATURES
• Intel® I210AT Gigabit Ethernet Controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
• Supports wire management
POWER INPUT
•4.75V~20V, 5VSB, VCC_RTC (ATX mode)
•4.75V~20V, VCC_RTC (AT mode)
SERIAL ATA (SATA) INTERFACE
• Supports 2 Serial ATA interfaces
• SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
PCB
•Dimensions
- COM Express® Mini
- 84mm (3.30") x 55mm (2.16")
•Compliance
- PICMG COM Express® R2.1, Type 10
SSD (optional)
• 4GB/8GB/16GB/32GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
USB 2.0 8x
LPC
8-bit
DIO
SMBus
WDT
EC
IT8518VG
SYS Fan
Intel® NM10
Express Chipset
Serial port 2x
I2C
Backup EEPROM
HDA Link
6.50
SPI
SPI Flash
SATA 2.0 2x
SSD (optional)
Heatsink
CK505
SYSTEM MEMORY
•2GB DDR3 onboard
WATCHDOG TIMER
• Watchdog timeout programmable via software
from 1 to 256 seconds
Ordering Information
Model Name
CD9A3-25B20
CD9A3-28B20
CD9A3-26B20
Part Number
777-CD9A31-0F0G
777-CD9A31-1F0G
777-CD9A31-2F0G
Description
Intel® AtomTM D2550, onboard DDR3 2GB
Intel® AtomTM N2800, onboard DDR3 2GB
Intel® AtomTM N2600, onboard DDR3 2GB
Module PCB
Packing List
8.00
Module PCB
The height of the
highest parts 3.50
Carrier Board
Heat sink height: 9.8mm
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
• 1 CD9A3 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• COM100-B carrier board kit
• Heat sink: A71-011020-000G
• Heat sink with fan: 761-CD9030-000G
Modules
Mini
COM Express
Mini
CPU Fan
Specifications
Computer-On-Module
Atom
COM Express® Compact Computer-On-Module
ULT
COM Express® Compact Computer-On-Module
QM77
QM67
HM55
Coming Soon
4th Generation Intel® CoreTM
3rd/2nd Generation Intel® CoreTM
Chipset
N/A
Intel® QM77
Memory
2GB/4GB/8GB DDR3L onboard
Display
Processor
Ethernet
USB 3.0
HR908-B
CP908-B
3rd/2nd Generation Intel® CoreTM
Intel® CoreTM i7/i5/i3/Celeron®
Chipset
Intel® QM67
Intel® HM55
1 DDR3/DDR3L SODIMM up to 8GB
Memory
1 DDR3/DDR3L SODIMM up to 8GB
1 DDR3 SODIMM
up to 4GB
VGA, LVDS, DDI
3 Independent Displays
VGA, LVDS, DDI
Display
VGA, LVDS, DDI
VGA, LVDS
1 Intel
1 Intel
1 Intel
1 Intel
2
4
USB 3.0
4
N/A
USB
Model
Processor
Ethernet
USB
USB 2.0
8
4
USB 2.0
4
8
SATA 3.0
3
2
SATA 3.0
N/A
N/A
SATA 2.0
N/A
2
SATA 2.0
8
4
Storage
Storage
SSD
Yes
N/A
SSD
N/A
N/A
IDE, FDD
N/A
N/A
IDE, FDD
N/A
1 IDE
PCIe x16
N/A
1
PCIe x16
1
1
1
1
PCIe x4
1
N/A
PCIe x1
3
4
N/A
4
4-bit input and 4-bit output
8-bit
PCIe x4
Expansion
Expansion
PCIe x1
2
3
N/A
N/A
Digital I/O
8-bit
4-bit input and 4-bit output
Audio Controller
HDA
HDA
Audio Controller
HDA
HDA
LPC
Yes
Yes
LPC
Yes
Yes
SMBus
Yes
Yes
SMBus
Yes
Yes
CAN-bus
N/A
N/A
CAN-bus
N/A
N/A
TPM
(optional)
Yes
N/A
TPM
(optional)
N/A
N/A
Watchdog
Yes
Yes
Watchdog
Yes
Yes
Power Input
12V
12V
Power Input
12V
12V
Compliance
R2.1, Type 6
R2.0, Type 6
Compliance
R2.0, Type 6
R1.0, Type 2
Dimensions
95mm x 95mm
95mm x 95mm
Dimensions
95mm x 95mm
95mm x 95mm
PCI
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
PCI
Digital I/O
Computer-On-Module
CR908-B
Modules
Mini
COM Express
Compact
HU968
Model
COM Express® Compact Computer-On-Module
Atom
Atom
Atom
CD905-B Series
LR905-B Series
COM Express® Compact Computer-On-Module
AMD G-Series
AMD G-Series SoC
Coming Soon
Intel® Atom™ E3800 series
Chipset
Intel® AtomTM
D2550/N2800/N2600
Intel® Atom™ D525/D425/N455
N/A
Intel® NM10
Intel® ICH8M
Memory
2 DDR3L SODIMM up to 8GB
1 DDR3 SODIMM up to 4GB
(-B2550/-B2800)
1 DDR3 SODIMM up to 2GB (-B2600)
1 DDR3 SODIMM up to 4GB
(-B18D/-B18S)
1 DDR3 SODIMM up to 2GB (-B18M)
Display
VGA, LVDS, DDI
VGA, LVDS
VGA, LVDS
1 Intel
1 Intel
1 Intel
Ethernet
Processor
OT905-BT56N
OT905-BT40N
AMD® Embedded G-Series SoC
AMD® G-Series
Chipset
N/A
AMD® A55E
Memory
1 DDR3 SODIMM up to8GB
1 DDR3 SODIMM up to 8GB
Display
VGA, DP/LVDS, DP
VGA, LVDS
1 Intel
1 Intel
USB 3.0
2
N/A
Ethernet
USB
USB 3.0
1
N/A
N/A
USB 2.0
6
8
USB 2.0
8
8
8
SATA 3.0
2
4
SATA 3.0
N/A
N/A
N/A
SATA 2.0
N/A
N/A
SATA 2.0
2
2
3
RAID
N/A
0/1/5/10
SSD
N/A
N/A
N/A
Yes (option)
N/A
IDE, FDD
N/A
1 IDE
1 IDE
IDE, FDD
N/A
1 IDE
PCIe x16
N/A
N/A
N/A
PCIe x16
N/A
N/A
PCIe x4
N/A
N/A
Supports either 5 PCIe x1 or 1 PCIe x4
PCIe x4
1
N/A
PCIe x1
3
4
N/A
PCIe x1
1
6
Mini PCIe
N/A
N/A
N/A
4
4
PCI
N/A
4
Digital I/O
8-bit
8-bit
8-bit
Digital I/O
8-bit
8-bit
Audio Controller
HDA
HDA
HDA
Audio Controller
HDA
HDA
LPC
Yes
N/A
Yes
LPC
Yes
Yes
SMBus
Yes
N/A
Yes
SMBus
Yes
Yes
CAN-bus
N/A
N/A
N/A
CAN-bus
N/A
N/A
TPM
(optional)
Yes
N/A
N/A
TPM (optional)
Yes
Yes
Watchdog
Yes
Yes
Yes
Watchdog
Yes
Yes
Power Input
12V
12V
12V
Power Input
12V
12V
Compliance
R2.1, Type 6
R2.0, Type 2
R1.0, Type 2
Compliance
R2.1, Type 6
R2.0, Type 2
Dimensions
95mm x 95mm
95mm x 95mm
95mm x 95mm
Dimensions
95mm x 95mm
95mm x 95mm
USB
Storage
Storage
Expansion
PCI
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
SSD
Expansion
Computer-On-Module
Processor
KB968
Model
Modules
Mini
COM Express
Compact
BT968 Series
Model
4th Gen Intel® CoreTM
COM Express® Compact
4th Gen Intel® CoreTM
COM Express® Compact
HU968
HU968
ULT
Features
Specifications
MEMORY
EXPANSION
Intel Atom
E3840/E3823/
E3822/E3821/
E3810
Coming Soon
LAN
DIMENSIONS
SYSTEM MEMORY
• 2GB/4GB/8GB DDR3L onboard
• Supports DDR3L 1600MHz
• Supports dual channel memory interface
SSD
Availability: Apr 2014
Optional
DDR3L
AMT
SATA 3.0
USB 3.0
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
• Watchdog timer function
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics GT Series
• Supports VGA, LVDS and DDI interfaces
• VGA: resolution up to 1920x1080 @ 60Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to
1920x1200 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
• HDMI, DVI: resolution up to 4096x2304 @ 24Hz
• DP: resolution up to 3200x2000 @ 60Hz
• Intel® Clear Video Technology
• Intel® Advanced Vector Extensions (Intel® AVX) Instructions
• Supports DirectX 11.1, OpenGL 3.2, OpenCL 1.2
BIOS
•TBD
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
POWER
• Input: 12V, VCC_RTC, 5VSB (option)
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Mechanical Drawing
Block Diagram
91.00
87.00
0.00
4.00
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 5% to 90%
SSD (optional)
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
Top View
0.00
4.00
OS SUPPORT
• TBD
SERIAL ATA (SATA) INTERFACE
•Supports 3 SATA 3.0 with data transfer rate up to 6Gb/s
•Integrated Advanced Host Controller Interface (AHCI) controller
91.00
87.00
91.00
87.00
POWER CONSUMPTION
• TBD
ONBOARD LAN FEATURES
• Intel® I218LM with iAMT9.0 Gigabit Ethernet Phy
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
LVDS Port
(Dual Channel)
0.00
4.00
eDP to LVDS
91.00
76.00
0.00
4.00
INTEL ACTIVE MANAGEMENT TECHNOLOGY (AMT)
• Supports iAMT9.0
• Out-of-band system access
• Remote troubleshooting and recovery
• Hardware-based agent presence checking
• Proactive alerting
• Remote hardware and software asset tracking
eDP
R.G.B
DDI Port A
DP to VGA
DDI Port A
DDI Port B
CMOS Backup
EEPROM
SM Bus
DDR3 1600MHz
Dual Channel
LPC Bus
Coming Soon
TRUSTED PLATFORM MODULE (TPM) - optional
•Provides a Trusted PC for secure transactions
•Provides software license protection, enforcement and password
protection
DDR3L 8x
2GB/4GB
HD Audio
8-bit DIO
Bottom View
I2C Bus
TPM 1.2
WDT
Embedded SLB9635
Controller (optional)
IT8518E
Sys Fan
PWM/TACH
4th Generation
®
Intel Core™ i7/i5/i3;
®
Intel Celeron™
USB 3.0
USB 2.0 8x
2.00
0.00
USB_SS 1,2
C/D
A/B
14.00
Serial Port1,
2 Tx/Rx
PCB
• Dimensions
- COM Express® Compact
- 95mm (3.74") x 95mm (3.74")
• Compliance
- PICMG COM Express® R2.1, Type 6
SATA 3.0 3x
0.00
12.50
70.20
SSD Chip
(Optional)
SATA 2
PCIe GEN2 (4 x1 or 2 x2 or 1 x4)
LAN
53.00
Intel® GLAN
I218LM
PCIe x1, Lane 3
PCIe GEN2 (1 x1 or 1 x2)
PCIe GEN2 (1 x1 or SATA 3.0)
SPI ROM
SPI I/F
SPI Bus
Ordering Information
Model Name
HU968
-
Temperature
Memory
SSD
B
2
0
B: 0oC to 60oC
2: 2GB
4: 4GB
8: 8GB
0:
2:
4:
8:
1:
3:
6:
Processors
None
2GB
4GB
8GB
16GB
32GB
64GB
4650U
4650U: Intel® CoreTM i7-4650U, 4M Cache, up to 3.3 GHz, 15W
4300U: Intel® CoreTM i5-4300U, 3M Cache, up to 2.9 GHz, 15W
4010U: Intel® CoreTM i3-4010U, 3M Cache, 1.7 GHz, 15W
2980U: Intel® Celeron® 2980U, 2M Cache, 1.6 GHz, 15W
20.00
Heat sink
22.00
Module PCB
Heat spreader
Standoff
www.dfi.com
2.00
11.00
55.00
Fan
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 HU968 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• COM331-B carrier board kit
• COM101-BAT carrier board kit
Computer-On-Module
DDR3 SODIMM
EXPANSION INTERFACES
• Supports 2 USB 3.0 interfaces
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x4; or 2 PCIe x2; or 4 PCIe x1 interfaces
• Supports 2 PCIe x1; or 1 PCIe x1 and 1 SATA 3.0 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 8-bit Digital I/O
Modules
Mini
COM Express
Compact
CPU Fan
PROCESSOR
• 4th generation Intel® CoreTM processors
• BGA 1168 packaging technology
• 22nm process technology
Please refer to the Ordering Information below
2GB/4GB/8GB DDR3L onboard
1 PCIe x4, 2 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 1 DDI (HDMI/DVI/DP)
10 USB: 2 USB 3.0, 8 USB 2.0
3 SATA 3.0
SSD (optional)
8-bit DIO
1 LAN
COM Express® R2.1 Compact, Type 6
95mm x 95mm (3.74" x 3.74")
3rd/2nd Gen Intel® CoreTM
COM Express® Compact
3rd/2nd Gen Intel® CoreTM
COM Express® Compact
CR908-B
CR908-B
QM77
Features
Specifications
MEMORY
EXPANSION
BGA 1023
DDR3/DDR3L
SODIMM
Intel QM77
Mechanical Drawing
SYSTEM MEMORY
• One 204-pin SODIMM socket
• Supports DDR3 SODIMM
3rd Generation Processors
2nd Generation Processors
DDR3 1066/1333/1600MHz
DDR3 1066/1333MHz (i5/i3/Celeron)
DDR3 1600MHz (i7)
• Supports DDR3L SODIMM
- 1066/1333MHz when operating at 1.35V
- 1066/1333/1600MHz when operating at 1.5V
•Supports up to 8GB system memory
•DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies
are supported for x8 and x16 devices, unbuffered, non-ECC
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000 (3rd generation processors)
• Intel® HD Graphics 3000 (2nd generation processors)
• Intel® HD Graphics (Intel® CeleronTM processors)
• Supports VGA, LVDS and DDI interfaces
• VGA: resolution up to 1920x1200 @ 60Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit,
resolution up to 1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP and SDVO
• HDMI, DVI, DP: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing - Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
• Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)
Block Diagram
91.00
87.00
0.00
4.00
91.00
87.00
CHIPSET
• Intel® QM77 Express chipset
91.00
87.00
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
ONBOARD LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
95.00
Top View
95.00
91.00
0.00
4.00
76.00
0.00
4.00
0.00
4.00
DDR3/
DDR3L
SODIMM
Ø2.70(*4 pcs)
Channel A
1066/1333/
1600MHz
Processor
CORE CORE CORE
CMOS Backup
EEPROM
SM Bus
CORE
IMVP7
(Vcore,Vgfx)
3rd/2nd Generation;
Intel® Core™ i7/i5/i3
Graphics
CORE
2nd Gen Processors
8-bit DIO
GPIO,WDT,I2C
(Embedded
Controller)
I2C Bus
WDT
DDI Port C
0.00
12.50
70.20
SATA 2.0 2x, SATA 3.0 2x
LVDS (Dual Channel)
87.00
CRT
PCIe x1, Lane 6x
Mobile Intel®
QM77
Express Chipset
DDI Port D
USB 3.0 4x
2nd SPI Bus
Serial Port1, 2 TX/RX
3rd Gen Processors
PCIe x1 Lane 7
Sys FAN PWM/TACH_IN
PCIe x1, Lane 8
95.00
87.00
LAN Ports
Intel® GLAN
PHY 82579LM
2nd Gen Processors
Fan
Heat spreader
11.00 22.00
Module PCB
www.dfi.com
3.25
55.00
53.00
Heat sink
standoff
BIOS
• 64Mbit UEFI SPI BIOS
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature
• Monitors CPU fan speed
• Monitors Vcore/VGFX/DDR voltages
• Watchdog timer function
POWER CONSUMPTION
• 35.42 W with i7-3612QE at 2.1GHz and 1x 2GB DDR3 SODIMM
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
TEMPERATURE
• Operating: 0ooC to 60ooC
• Storage: -20 C to 85 C
HUMIDITY
• 10% to 90%
POWER
• Input: 12V, 5VSB, VCC_RTC
PCB
•Dimensions
- COM Express® Compact
- 95mm (3.74") x 95mm (3.74")
•Compliance
- PICMG COM Express® R2.1 Compact form factor, Type 6
CERTIFICATION
• CE, FCC Class B, UL, RoHS
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Model Name
CR908-B3120ME
CR908-B810E
CR908-B847E
CR908-B827E
Part Number
777-CR9081-400G
777-CR9081-E00G
777-CR9081-F00G
777-CR9081-700G
Description
Intel® CoreTM i3-3120ME, 3M Cache, 2.40 GHz, 35W
Intel® CeleronTM B810E, 2M Cache, 1.6GHz, 35W
Intel® CeleronTM 847E, 2M Cache, 1.1GHz, 17W
Intel® CeleronTM 827E, 1.5M Cache, 1.4GHz, 17W
The following processors will be available upon request. Please contact your sales representative for more information.
USB 2.0 8x
95.00
53.00
DDI Port B/SDVO Port B
C/D
A/B
2.00
0.00
3rd Gen Processors
SM Bus
LPC Bus
EXPANSION INTERFACES
•Supports 8 USB 2.0 interfaces (4 supports USB 3.0)
•Supports 1 PCIe x16 interface
- Supports Gen 3.0
- Configurations (supported only via a riser card):
: One x8 (GFX) and two x4 (I/O)
: Two x8 (GFX, I/O)
: One x16 (GFX, I/O)
•Supports 1 PCIe x4 and 3 PCIe x1 (default); or 7 PCIe x1 interfaces
•Supports LPC interface
•Supports SMBus interface
•Supports I2C interface
•Supports 2 serial interfaces (TX/RX)
•Supports 4-bit input and 4-bit output GPIO
Ordering Information
®
Intel FDI
(Flexible Display
Interface)
HD Audio
Bottom View
14.00
USB INTERFACE
• XHCI Host Controller supports up to 4 super speed USB 3.0 ports
PEG 16x LANES
Memory
Controller
DMI x4
(Direct Media
Interface)
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
Model Name
CR908-B3615QE
CR908-B3612QE
CR908-B3555LE
CR908-B3517UE
CR908-B3610ME
CR908-B3217UE
CR908-B1020E
CR908-B1047UE
CR908-B927UE
CR908-B2715QE
CR908-B2655LE
CR908-B2610UE
CR908-B2515E
CR908-B2310E
CR908-B2340UE
CR908-B807UE
Part Number
777-CR9081-600G
777-CR9081-000G
777-CR9081-100G
777-CR9081-200G
777-CR9081-300G
777-CR9081-500G
777-CR9081-I00G
777-CR9081-J00G
777-CR9081-K00G
777-CR9081-800G
777-CR9081-900G
777-CR9081-A00G
777-CR9081-B00G
777-CR9081-C00G
777-CR9081-D00G
777-CR9081-G00G
Description
Intel® CoreTM i7-3615QE, 6M Cache, up to 3.30 GHz, 45W
Intel® CoreTM i7-3612QE, 6M Cache, up to 3.10 GHz, 35W
Intel® CoreTM i7-3555LE, 4M Cache, up to 3.20 GHz, 25W
Intel® CoreTM i7-3517UE, 4M Cache, up to 2.80 GHz, 17W
Intel® CoreTM i5-3610ME, 3M Cache, up to 3.30 GHz, 35W
Intel® CoreTM i3-3217UE, 3M Cache, 1.60 GHz, 17W
Intel® CeleronTM 1020E, 2M Cache, 2.20 GHz, 35W
Intel® CeleronTM 1047UE, 2M Cache, 1.40 GHz, 17W
Intel® CeleronTM 927UE, 1M Cache, 1.50 GHz, 17W
Intel® CoreTM i7-2715QE, 6M Cache, up to 3.00 GHz, 45W
Intel® CoreTM i7-2655LE, 4M Cache, up to 2.90 GHz, 25W
Intel® CoreTM i7-2610UE, 4M Cache, up to 2.40 GHz, 17W
Intel® CoreTM i5-2515E, 3M Cache, up to 3.10 GHz, 35W
Intel® CoreTM i3-2310E, 3M Cache, 2.10 GHz, 35W
Intel® CoreTM i3-2340UE, 3M Cache, 1.30 GHz, 17W
Intel® CeleronTM 807UE, 1M Cache, 1.00 GHz, 10W
Packing List
• 1 CR908 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
•
•
•
•
•
COM331-B carrier board kit
COM101-BAT carrier board kit
Heat spreader: TBD
Heat sink with fan:A71-111008-000G
Heat spreader with heat sink and fan: 761-CR9080-000G (CR908-B3615QE)
Computer-On-Module
CPU Fan
LAN
DIMENSIONS
PROCESSOR
•BGA 1023 packaging technology
- 3rd generation Intel® CoreTM processors (22nm process technology)
- 2nd generation Intel® CoreTM processors (32nm process technology)
Please refer to the Ordering Information below
Modules
Mini
COM Express
Compact
1 DDR3/DDR3L SODIMM up to 8GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP/SDVO)
8 USB: 4 USB 3.0/2.0, 4 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Compact, Type 6
95mm x 95mm (3.74" x 3.74")
3rd/2nd Gen Intel® CoreTM
COM Express® Compact
3rd/2nd Gen Intel® CoreTM
COM Express® Compact
HR908-B
HR908-B
QM67
Features
MEMORY
EXPANSION
DDR3/DDR3L
SODIMM
Intel QM67
Mechanical Drawing
91.00
87.00
0.00
4.00
91.00
87.00
95.00
Top View
95.00
91.00
0.00
4.00
76.00
0.00
4.00
Channel A (DDR3)
1066/1333/1600MHz
Channel A (DDR3L)
1066/1333MHz
0.00
4.00
DDR3/
DDR3L
SODIMM
Ø2.70(*4 pcs)
CHIPSET
• Intel® QM67 Express chipset
SYSTEM MEMORY
• One 204-pin SODIMM socket
• Supports DDR3 SODIMM
3rd Generation Processors
2nd Generation Processors
DDR3 1066/1333/1600MHz
DDR3 1066/1333MHz (i5/i3/Celeron)
DDR3 1600MHz (i7)
• Supports DDR3L SODIMM
- 1066/1333MHz when operating at 1.35V
- 1066/1333/1600MHz when operating at 1.5V
•Supports up to 8GB system memory
•DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered, non-ECC
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000 (3rd generation processors)
• Intel® HD Graphics 3000 (2nd generation processors)
• Intel® HD Graphics (Intel® CeleronTM processors)
• Supports VGA, LVDS and DDI interfaces
• VGA: resolution up to 1920x1200 @ 60Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit,
resolution up to 1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP and SDVO
• HDMI, DVI, DP: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing - Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
• Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)
Block Diagram
91.00
87.00
Please refer to the Ordering Information below
Processor
CORE CORE CORE
IMVP7
(Vcore,Vgfx)
Graphics
CORE
PEG 16x LANES
Memory
Controller
DMI
(Direct Media
Interface)
2nd Gen Processors
LVDS (Dual Channel)
0.00
12.50
70.20
CRT
PCIe x1 6x
Mobile Intel® QM67
(Platform
Controller Hub)
SPI
87.00
Serial Port 2x
System Fan PWM/TACH_IN
95.00
87.00
LAN Ports
PCIe x1, Lane 8
Intel® GLAN
PHY 82579LM
Fan
Heat spreader
11.00 22.00
Module PCB
standoff
www.dfi.com
3.25
55.00
53.00
Heat sink
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
C/D
A/B
PCIe x1 Lane 7
SATA 2.0 2x, SATA 3.0 2x
95.00
53.00
DDP Port D
USB 2.0 8x
2.00
0.00
TEMPERATURE
• Operating: 0ooC to 60ooC
• Storage: -20 C to 85 C
POWER
• Input: 12V, 5VSB, VCC_RTC
DDP Port C
14.00
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
ONBOARD LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
DDP Port B/SDVO Port B
LPC Bus
GPIO/
2
WDT/I C
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature
• Monitors CPU fan speed
• Monitors Vcore/VGFX/DDR voltages
• Watchdog timer function
HUMIDITY
• 10% to 90%
3rd Gen Processors
SM Bus
Bottom View
BIOS
• 64Mbit UEFI SPI BIOS
PCB
•Dimensions ®
- COM Express Compact
- 95mm (3.74") x 95mm (3.74")
•Compliance
- PICMG COM Express® R2.1 Compact form factor, Type 6
Ordering Information
®
Intel FDI
(Flexible Display
Interface)
HD Audio
EXPANSION INTERFACES
•Supports 8 USB 2.0 interfaces
•Supports 1 PCIe x16 interface
- Supports Gen 3.0 (3rd generation processors)
- Configurations (supported only via a riser card):
: One x8 (GFX) and two x4 (I/O)
: Two x8 (GFX, I/O)
: One x16 (GFX, I/O)
•Supports 1 PCIe x4 and 3 PCIe x1 (default); or 7 PCIe x1 interfaces
•Supports LPC interface
•Supports SMBus interface
•Supports I2C interface
•Supports 2 serial interfaces (TX/RX)
•Supports 4-bit input and 4-bit output GPIO
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
CORE
3rd/2nd Generation
Intel® Core™ i7/i5/i3
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
Model Name
HR908-B3120ME
HR908-B810E
HR908-B847E
HR908-B827E
Part Number
777-HR9081-400G
777-HR9081-E00G
777-HR9081-F00G
777-HR9081-700G
Description
Intel® CoreTM i3-3120ME, 3M Cache, 2.40 GHz, 35W
Intel® CeleronTM B810E, 2M Cache, 1.6GHz, 35W
Intel® CeleronTM 847E, 2M Cache, 1.1GHz, 17W
Intel® CeleronTM 827E, 1.5M Cache, 1.4GHz, 17W
The following processors will be available upon request. Please contact your sales representative for more information.
Model Name
Part Number
Description
HR908-B3615QE
777-HR9081-600G
Intel® CoreTM i7-3615QE, 6M Cache, up to 3.30 GHz, 45W
HR908-B3612QE
777-HR9081-000G
Intel® CoreTM i7-3612QE, 6M Cache, up to 3.10 GHz, 35W
HR908-B3555LE
777-HR9081-100G
Intel® CoreTM i7-3555LE, 4M Cache, up to 3.20 GHz, 25W
HR908-B3517UE
777-HR9081-200G
Intel® CoreTM i7-3517UE, 4M Cache, up to 2.80 GHz, 17W
HR908-B3610ME
777-HR9081-300G
Intel® CoreTM i5-3610ME, 3M Cache, up to 3.30 GHz, 35W
3rd Gen Processors
HR908-B3217UE
777-HR9081-500G
Intel® CoreTM i3-3217UE, 3M Cache, 1.60 GHz, 17W
HR908-B1020E
777-HR9081-H00G
Intel® CeleronTM 1020E, 2M Cache, 2.20 GHz, 35W
HR908-B1047UE
777-HR9081-I00G
Intel® CeleronTM 1047UE, 2M Cache, 1.40 GHz, 17W
HR908-B927UE
777-HR9081-J00G
Intel® CeleronTM 927UE, 1M Cache, 1.50 GHz, 17W
HR908-B2715QE
777-HR9081-800G
Intel® CoreTM i7-2715QE, 6M Cache, up to 3.00 GHz, 45W
HR908-B2655LE
777-HR9081-900G
Intel® CoreTM i7-2655LE, 4M Cache, up to 2.90 GHz, 25W
HR908-B2610UE
777-HR9081-A00G
Intel® CoreTM i7-2610UE, 4M Cache, up to 2.40 GHz, 17W
HR908-B2515E
777-HR9081-B00G
Intel® CoreTM i5-2515E, 3M Cache, up to 3.10 GHz, 35W
2nd Gen Processors
HR908-B2310E
777-HR9081-C00G
Intel® CoreTM i3-2310E, 3M Cache, 2.10 GHz, 35W
HR908-B2340UE
777-HR9081-D00G
Intel® CoreTM i3-2340UE, 3M Cache, 1.30 GHz, 17W
HR908-B807UE
777-HR9081-G00G
Intel® CeleronTM 807UE, 1M Cache, 1.00 GHz, 10W
Packing List
• 1 HR908 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
•
•
•
•
•
COM331-B carrier board kit
COM101-BAT carrier board kit
Heat spreader: TBD
Heat spreader with heat sink and fan: TBD
Heat sink with fan: A71-111008-000G
Computer-On-Module
LAN
DIMENSIONS
PROCESSOR
•BGA 1023 packaging technology
- 3rd generation Intel® CoreTM processors (22nm process technology)
- 2nd generation Intel® CoreTM processors (32nm process technology)
Modules
Mini
COM Express
Compact
1 DDR3/DDR3L SODIMM up to 8GB
1 PCIe x16, 1 PCIe x4, 3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP/SDVO)
8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Compact, Type 6
95mm x 95mm (3.74" x 3.74")
BGA 1023
CPU Fan
Specifications
Intel® AtomTM E3800 Series
COM Express® Compact
Intel® AtomTM E3800 Series
COM Express® Compact
BT968 Series
BT968 Series
Atom
Features
Specifications
MEMORY
STORAGE
EXPANSION
Intel Atom
E3840/E3823/
E3822/E3821/
E3810
Coming Soon
LAN
DIMENSIONS
SYSTEM MEMORY
• Two 204-pin DDR3L SODIMM socket
• Supports DDR3L 1066/1333MHz
• Supports dual channel memory interface
• Supports up to 8GB system memory
• DRAM device technologies: 1Gb, 2Gb, 4Gb and 8Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered, nonECC
-400C
DDR3L
Mechanical Drawing
USB 3.0
SATA 2.0
Wide
Temperature
eMMC
Block Diagram
91.00
87.00
0.00
4.00
91.00
87.00
91.00
87.00
DAMAGE FREE INTELLIGENCE
• Monitors CPU/system temperature and overheat alarm
• Monitors Vcore/Vgfx/VDDR/3V3 voltages and failure alarm
• Monitors CPU/system fan speed and failure alarm
• Watchdog timer function
STORAGE
• Supports 4GB, 8GB and 16GB eMMC onboard (optional)
850C
Availability: Apr 2014
EXPANSION INTERFACES
• Supports 1 USB 3.0 port
• Supports 8 USB 2.0 ports
- 4 integrated USB 2.0 ports
- 1 USB HSIC for 4 USB 2.0 Ports
• Supports 3 PCIe x1 (default); or 1 PCIe x4 (PCIe port 3 share with on
board LAN by default)
• Supports LPC interface
• Supports I2C interface
• Supports SMBus interface
• Suppotrs 2 serial interfaces (TX/RX)
• Supports 8-bit Digital I/O
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics
• Supports VGA, LVDS (default)/DDI and DDI interfaces
• Supports 2 display interfaces at the same time
• VGA: 24-bit, resolution up to 2560x1600 @ 60Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to
1920x1200 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
• HDMI, DVI: resolution up to 2560x1600 @ 24Hz
• DP: resolution up to 2560x1600 @ 60Hz
• Supports hardware acceleration for DirectX 11, OCL 1.2, OGL 3.2,
H.264, MPEG2, MVC, VC-1, WMV9 and VP8
BIOS
• TBD
POWER CONSUMPTION
• TBD
OS SUPPORT
• TBD
TEMPERATURE
• Operating
- Atom: 0oC to 60oC, -20oC to 70oC, -40oC to 85oC
- Celeron: 0oC to 60oC
• Storage: -40oC to 85oC
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Top View
LVDS Port
(Dual Channel)
IMVP7
DDI
eDP to LVDS
DDI Port 0
VGA
0.00
4.00
LPC Bus
0.00
4.00
91.00
76.00
0.00
4.00
SLP/LID
WDT
I2C Bus
Controller
IT8518E
DDR3L Memory
Slot 2x
DDR3
1066/1333MHz
Dual Channel
EEPROM
SM Bus
8-bit DIO
Bottom View
Serial Port1, 2 Tx/Rx
USB 3.0 Port 1
C/D
A/B
Coming Soon
Atom E3800 Series
/Celeron
TCA6408A
POWER INPUT
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
SERIAL ATA (SATA) INTERFACE
• Supports 2 Serial ATA interfaces
• SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
DDI Port 1
TPM 1.2
SLB9635
Fan PWM/ Embedded
(optional)
TACH_IN
HUMIDITY
• 5% to 90%
ONBOARD LAN FEATURES
• Intel® I210AT Gigabit Ethernet Controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
PCB
• Dimensions
- COM Express® Compact
- 95mm (3.74") x 95mm (3.74")
• Compliance
- PICMG COM Express® R2.1, Type 6
TRUSTED PLATFORM MODULE (TPM) - optional
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password
protection
HD Audio
USB 2.0 4x
USB 2.0 4x
14.00
USB4604
USB HSIC
eMMC
SATA 2.0 2x
2.00
0.00
eMMC
(Optional)
0.00
12.50
70.20
PCIe GEN2 (3 x1 or 1 x4)
LAN
Intel® GLAN
I210AT
PCIe x1
SPI Bus
53.00
SPI Flash
Ordering Information
Model Name
BT968
-
Temperature
Memory
eMMC
B
S
0
S: Socket
B: 0oC to 60oC
T: -40oC to 85oC
0:
4:
8:
1:
Processors
None
4GB
8GB
16GB
E45
E45: Intel® AtomTM E3845, Quad Core, 2M Cache, 1.91GHz, 10W
E27: Intel® AtomTM E3827, Dual Core, 1M Cache, 1.75GHz, 8W
E26: Intel® AtomTM E3826, Dual Core, 1M Cache, 1.46GHz, 7W
E25: Intel® AtomTM E3825, Dual Core, 1M Cache, 1.33GHz, 6W
E15: Intel® AtomTM E3815, Single Core, 0.5M Cache, 1.46GHz, 5W
J00: Intel® Celeron® J1900, Quad Core, 2M Cache, up to 2.42GHz, 10W
N20: Intel® Celeron® N2920, Quad Core, 2M Cache, 2.00GHz, 7.5W
20.00
Heat sink
22.00
Module PCB
Heat spreader
Standoff
www.dfi.com
2.00
11.00
55.00
Fan
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 BT968 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• COM331-B carrier board kit
• COM101-BAT carrier board kit
• Heat spreader with heat sink: TBD
Computer-On-Module
DDR3 SODIMM
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
Modules
Mini
COM Express
Compact
CPU Fan
PROCESSOR
• Intel® AtomTM/Intel® Celeron® processors
• BGA 1170 packaging technology
• 22nm process technology
Please refer to the Ordering Information below
2 DDR3L SODIMM up to 8GB
4GB/8GB/16GB eMMC onboard (optional)
3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 1 DDI (HDMI/DVI/DP)
1 HDA
9 USB: 1 USB 3.0, 8 USB 2.0
2 SATA 2.0
8-bit DIO
1 LAN
COM Express® R2.1 Compact, Type 6
95mm x 95mm (3.74" x 3.74")
Intel® AtomTM D2550/N2800/N2600
COM Express® Compact
Intel® AtomTM D2550/N2800/N2600
COM Express® Compact
CD905-B Series
CD905-B Series
Atom
Features
Specifications
MEMORY
Intel Atom
D2550/
N2800/
N2600
DDR3
SODIMM
EXPANSION
Intel M10
LAN
DIMENSIONS
Mechanical Drawing
SYSTEM MEMORY
•One 204-pin DDR3 SODIMM socket
•Supports DDR3 1066MHz (Intel® AtomTM D2550/N2800)
Supports DDR3 800MHz (Intel® AtomTM N2600)
•Supports single channel memory interface
•Supports up to 4GB system memory (Intel® AtomTM D2550/N2800)
Supports up to 2GB system memory (Intel® AtomTM N2600)
•DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered,
non-ECC
Block Diagram
ONBOARD GRAPHICS FEATURES
•Intel® GMA 3650 (Intel® AtomTM D2550/N2800)
Intel® GMA 3600 (Intel® AtomTM N2600)
•Supports LVDS and VGA interfaces
•LVDS: Chrontel CH7511B, 24-bit, dual channel, resolution up to
1920x1200 @ 60Hz
•VGA: resolution up to 1920x1200 @ 60Hz
•Supports Hardware H.264/AVC, MPEG-2 video decoder,
VC-1, DirectX 9, 1080p decoder
91.00
87.00
0.00
4.00
91.00
87.00
91.00
87.00
95.00
Top View
0.00
4.00
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
IMVP7
(Vcore,Vgfx)
0.00
4.00
95.00
91.00
76.00
0.00
4.00
VGA
Ø2.70(*4 pcs)
Analog
Display
Processor
CORE CORE CORE
eDP to LVDS
DDI
Signal
CK505
SODIMM 1x
DDR3 1066MHz
(-B2550/-B2800)
SODIMM 1x
DDR3 800MHz
(-B2600)
Intel® Atom™ D2550 (-B2550)
Intel® Atom™ N2800 (-B2800)
Intel® Atom™ N2600 (-B2600)
Graphics
CORE
ONBOARD LAN FEATURES
• Intel® 82574 Gigabit Ethernet Controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
• Supports wire management
CORE
Memory
Controller
Bottom View
SERIAL ATA (SATA) INTERFACE
• Supports 2 Serial ATA interfaces
• SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
DMI
(Direct Media
Interface)
PCI 4x
Intel® NM10
Express Chipset
PCIe x1 3x
SPI
SPI
EC
IT8518E
POWER CONSUMPTION
• 24.51 W with D2550 at 1.86GHz and 1x 1GB DDR3 SODIMM
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 10% to 90%
POWER INPUT
•12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
PCB
•Dimensions
- COM Express® Compact
- 95mm (3.74") x 95mm (3.74")
•Compliance
- PICMG COM Express® R2.0, Type 2
CERTIFICATION
• CE
• FCC Class B
• RoHS
• UL
SPI Flash
LPC Bus
IDE
87.00
PCIe x1 1x
95.00
BIOS
• 16Mbit SPI BIOS
LPC Bus
I2C
GLAN
82574L
PCIe x1 1x
4.00
4.00
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/VGFX/1.5V voltages and failure alarm
• Watchdog timer function
C/D
A/B
0.00
12.50
70.20
4.00
33.40
HDA
USB 2.0 8x
95.00
87.00
EXPANSION INTERFACES
•Supports 8 USB 2.0 ports
•Supports 4 PCIe x1 interfaces
•Supports 4 PCI interfaces
•Supports LPC interface
•Supports I2C interface
•Supports 1 IDE interface
•Supports 8-bit Digital I/O
IT8208M
PCI Arbiter
SATA 2.0 2x
14.00
2.00
0.00
CHIPSET
• Intel® NM10 Express chipset
WATCHDOG TIMER (optional)
• Watchdog timeout programmable via software from 1 to 256 seconds
JMB 368
XIO 3130
76.00
83.50
Ordering Information
Model Name
CD905-B2550
CD905-B2800
CD905-B2600
Part Number
777-CD9051-000G
777-CD9051-800G
777-CD9051-600G
Description
Intel® AtomTM D2550, 1.86GHz, 10W TDP
Intel® AtomTM N2800, 1.86GHz, 6.5W TDP
Intel® AtomTM N2600, 1.6GHz, 3.5W TDP
Module PCB
33.40
23.40
35.40
Cooler
Module PCB The height
of the highest parts
2.00
3.50
1.60
Standoff
Carrier Board
5.0 or 8.0 mm
Heat sink height: 23.40mm
Heat spreader height: 11mm
Heat spreader with heat sink and fan height: 43mm
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 CD905-B board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
•
•
•
•
•
•
COM330-B carrier board kit
COM630-B carrier board kit
Heat spreader: TBD
Heat sink: A71-011003-000G
Heat sink with fan: A71-111006-000G
Heat spreader with heat sink and fan: TBD
Computer-On-Module
System Fan
PROCESSOR
• CD905-B2550:
- Intel® AtomTM D2550, 1.86GHz, 2x 512K L2, 10W TDP, dual-core
- Cooling option: heatsink with cooling fan
• CD905-B2800:
- Intel® AtomTM N2800, 1.86GHz, 2x 512K L2, 6.5W TDP, dual-core
- Cooling option: heatsink (fanless solution)
• CD905-B2600:
- Intel® AtomTM N2600, 1.6GHz, 2x 512K L2, 3.5W TDP, dual-core
- Cooling option: heatsink (fanless solution)
Modules
Mini
COM Express
Compact
1 DDR3 SODIMM up to 4GB (-B2550/-B2800)
1 DDR3 SODIMM up to 2GB (-B2600)
4 PCIe x1, 4 PCI
1 LPC, 1 I2C, 1 IDE
1 VGA, 1 LVDS
8 USB 2.0
2 SATA 2.0
8-bit DIO
1 LAN
COM Express® R2.0 Compact, Type 2
95mm x 95mm (3.74" x 3.74")
AMD® Embedded G-Series SoC
COM Express® Compact
KB968
KB968
Features
Specifications
MEMORY
EXPANSION
AMD® Embedded
G-Series SoC
Mechanical Drawing
SYSTEM MEMORY
• One 204-pin DDR3 SODIMM socket
• Supports DDR3 1066/1333/1600MHz
• Supports single channel memory interface
• Supports up to 8GB system memory
• DRAM device technologies: 1Gb, 2Gb, 4Gb and 8Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered, nonECC
ONBOARD GRAPHICS FEATURES
• Advanced discrete-level GPU integrated in the processor
• Supports VGA, DP/LVDS and DP interfaces
• VGA: resolution up to 2048x1536 @ 60Hz
• LVDS: 18-bit, single channel, resolution up to 1600x900 @ 60Hz
• DP: resolution up to 4096x2160 @ 30Hz
• Supports hardware acceleration for DirectX 11.1, H.264, MPEG-2,
MPEG-4 AVC, VC-1 and WMV
Block Diagram
POWER CONSUMPTION
• TBD
91.00
87.00
0.00
4.00
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
ONBOARD LAN FEATURES
• Intel® WGI210AT Gigabit Ethernet Controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Top View
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
SERIAL ATA (SATA) INTERFACE
• Supports 2 Serial ATA interfaces
• SATA 3.0 with data transfer rate up to 6Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
0.00
4.00
0.00
4.00
91.00
0.00
4.00
76.00
LVDS Port
(Single Channel)
LTDP0
1066~1600MT/s
PCIe GEN2 (GFX 1 x4)
CMOS Backup
EEPROM
TDP1
HUMIDITY
• 5% to 90%
POWER INPUT
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
SSD (optional)
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
UNBUFFERED
DDR3 SODIMM
VGA
DDI Port 1
PCB
• Dimensions
- COM Express® Compact
- 95mm (3.74") x 95mm (3.74")
• Compliance
- PICMG COM Express® R2.1, Type 6
SM Bus
HD Audio
LPC Bus
8-bit DIO
LPC
I2C Bus
Bottom View
WDT
Embedded TPM 1.2
Controller SLB9635
IT8518E (optional)
AMD Embedded
G-Series SoC
USB 3.0
Sys Fan
PWM/TACH
USB 2.0 8x
14.00
USB_SS 0,1
C/D
A/B
Serial Port1,
2 Tx/Rx
TRUSTED PLATFORM MODULE (TPM) - optional
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password
protection
SATA 3.0 2x
2.00
0.00
0.00
12.50
70.20
SSD Chip
(Optional)
LAN
SATA 1
PCIe GEN2
(1 x4 or 4 x1
GPP 0,1,2,3
53.00
LAN
SPI ROM
GPP 3
SPI I/F
SPI Bus
SD Card I/F (Optional)
Ordering Information
Model Name
KB968
-
Temperature Memory
SSD
B
S
0
B: 0oC to 60oC
S: Socket
0:
2:
4:
8:
1:
3:
6:
20.00
Heat sink
22.00
55.00
Fan
Module PCB
Processors
None
2GB
4GB
8GB
16GB
32GB
64GB
420C
420C: AMD® GX420CA, Quad Core, 2M Cache, 2.0GHz, 25W
415G: AMD® GX415GA, Quad Core, 2M Cache, 1.5GHz, 15W
217G: AMD® GX217GA, Dual Core, 1M Cache, 1.65GHz, 15W
210H: AMD® GX210HA, Dual Core, 1M Cache, 1.0GHz, 9W
Heat spreader
2.00
Standoff
www.dfi.com
DAMAGE FREE INTELLIGENCE
• Monitors APU temperature
• Monitors APU fan speed
• Monitors APU_VDD/APU_VDDNB/APU_VDDIO_SUS/1V8/0V95
voltages
• Watchdog timer function
BIOS
• 32Mbit SPI BIOS
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
91.00
87.00
91.00
87.00
EXPANSION INTERFACES
• Supports 8 USB 2.0 ports (first 2 USB ports support up to USB 3.0)
• Supports 1 PCIe x4 (GFX)
• Supports 4 PCIe x1 (GPP, GPP3 is connected to onboard LAN by
default)
• Supports LPC interface
• Supports I2C interface
• Supports SMBus interface
• Supports 2 serial interfaces (TX/RX)
• Supports 8-bit Digital I/O
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 KB968 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• COM331-B carrier board kit
• COM101-BAT carrier board kit
• Heat spreader with heat sink and fan: 761-KB9680-000G
Computer-On-Module
DDR3 SODIMM
LAN
DIMENSIONS
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
Modules
Mini
COM Express
Compact
CPU Fan
APU (Accelerated Processing Unit)
• AMD® Embedded G-Series SoC FT3 BGA
• 28nm process technology
Please refer to the Ordering Information below
1 DDR3 SODIMM up to 8GB
1 PCIe x4, 4 PCIe x1
1 LPC, 1 I2C, 1 SMBus, 2 serial
1 VGA, 1 DP/LVDS, 1 DP
8 USB: 2 USB 3.0/2.0, 6 USB 2.0
2 SATA 3.0
8-bit DIO
1 LAN
COM Express® R2.1 Compact, Type 6
95mm x 95mm (3.74" x 3.74")
11.00
G-Series
SoC
AMD® Embedded G-Series SoC
COM Express® Compact
AMD® Embedded G-Series
COM Express® Compact
AMD® Embedded G-Series
COM Express® Compact
OT905-B Series
OT905-B Series
G-Series
Features
Specifications
MEMORY
EXPANSION
CPU Fan
AMD
T56N/T40N
AMD A55E
Mechanical Drawing
LAN
DIMENSIONS
91.00
87.00
0.00
4.00
Top View
LVDS
0.00
4.00
CH7511B
DDI Port1
Processor
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
DDR3
SODIMM
CORE CORE
91.00
76.00
0.00
4.00
ONBOARD LAN FEATURES
• Intel® 82574L Gigabit Ethernet Controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
AMD T40N
®
APU-PCIe Port 0-3
Graphics
CORE
Memory
Controller
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• SATA 3.0 with data transfer rate up to 6Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
Bottom View
UMI x4
AMD TSI
14.00
FCH-PCIe Port 0-1
GLAN
PCI
FCH-PCIe
Port 2
Intel®
82574L
FCH-PCIe Port 3
HDA
95.00
87.00
4.00
33.40
AMD® A55E
Express Chipset
SATA 3.0 4x
USB 2.0 8x
LPC Bus
WTD
95.00
87.00
EC_GPIO
JMB368
EC
ITE8518E
SPI Flash
4.00
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/Vnb/1.5V voltages and failure alarm
• Watchdog timer function
BIOS
• 32Mbit SPI BIOS
POWER CONSUMPTION
• 17.21 W with T40N at 1.0GHz and 1x 2GB DDR3 SODIMM
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
IDE INTERFACE
• JMicron JMB368 PCI Express to PATA host controller
• DMA mode: Ultra ATA up to 100MB/s
• PIO mode: up to 16MB/s
POWER INPUT
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
PCB
• Dimensions
- COM Express® Compact
- 95mm (3.74") x 95mm (3.74")
• Compliance
- PICMG COM Express® R2.0, Type 2
CERTIFICATION
• CE
• FCC Class B
• RoHS
• UL
IDE
TPM
(option)
SPI
76.00
83.50
4.00
C/D
0.00
12.50
70.20
A/B
2.00
0.00
WATCHDOG TIMER
• Watchdog timeout programmable via software from
1 to 256 seconds
HUMIDITY
• 10% to 90%
Max 8GB
AMD® T56N
VGA
Ø2.70(*4 pcs)
EXPANSION INTERFACES
• Supports 8 USB 2.0 ports
• Supports 6 PCIe x1 interfaces
• Supports 4 PCI interfaces
• Supports 8-bit Digital I/O
• Supports 1 IDE interface
• Supports LPC interface
• Supports SMBus interface
ONBOARD GRAPHICS FEATURES
• Advanced discrete-level GPU integrated in the processor
- AMD RadeonTM HD 6320 (OT905-BT56N)
- AMD RadeonTM HD 6290 (OT905-BT40N)
• Supports LVDS and VGA interfaces
• LVDS: Chrontel CH7511B, 24-bit, dual channel, resolution up to
1920x1200 @ 60Hz
• VGA: resolution up to 2048x1536 @ 60Hz (OT905-BT56N); resolution
up to 1920x1200 @ 60Hz (OT905-BT40N)
• Supports AMD Turbo Core 2.0 technology
• Supports DirectX 11, OpenGL 3.2 and OpenCL 1.1
• Supports Hardware H.264, MPEG4 Part 2, VC-1, and MPEG2 decode
91.00
87.00
0.00
4.00
CHIPSET
• AMD® A55E Controller Hub
SYSTEM MEMORY
• One 204-pin DDR3 SODIMM socket
• Supports DDR3 1066/1333MHz (OT905-BT56N)
Supports DDR3 1066MHz (OT905-BT40N)
• Supports single channel memory interface
• Supports up to 8GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM
technologies are supported for x8 and x16 devices,
unbuffered, non-ECC
Block Diagram
91.00
87.00
TRUSTED PLATFORM MODULE (TPM) - optional
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password
protection
Ordering Information
Model Name
OT905-BT56N
OT905-BT40N
Part Number
777-OT9051-000G
777-OT9051-500G
Description
AMD® T56N, 1.65GHz, 18W TPD
AMD® T40N, 1.00GHz, 9W TPD
33.40
Module PCB
23.40
35.40
Cooler
Module PCB The height
of the highest parts
2.00
3.50
1.60
Standoff
Carrier Board
5.0 or 8.0 mm
Heat spreader height: 11mm
Heat spreader with heat sink and fan height: 43mm
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 OT905-BT56N or OT905-BT40N board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
•
•
•
•
COM330-B carrier board kit
Heat sink with fan: 761-011004-000G
Heat spreader: TBD
Heat spreader with heat sink and fan: TBD
Computer-On-Module
DDR3
SODIMM
APU (Accelerated Processing Unit)
• OT905-BT56N:
- AMD® T56N, 1.65GHz, 2x 512KB L2, 18W TDP, dual-core
- Cooling option: heat sink with cooling fan
• OT905-BT40N:
- AMD® T40N, 1.0GHz, 2x 512KB L2, 9W TDP, dual-core
- Cooling option: heat sink with cooling fan
Modules
Mini
COM Express
Compact
1 DDR3 SODIMM up to 8GB
6 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 IDE
1 VGA, 1 LVDS
8 USB 2.0
4 SATA 3.0
8-bit DIO
1 LAN
COM Express® R2.0 Compact, Type 2
95mm x 95mm (3.74" x 3.74")
COM Express® Basic Computer-On-Module
QM87
QM87
HM961-QM87
Model
HM960-QM87
4th Generation
Intel® Core™ i7/i5/i3
Processor
2 DDR3L ECC SODIMM
up to 16GB
Memory
Display
COM Express® Basic Computer-On-Module
2 DDR3L SODIMM
up to 16GB
QM87
HM920-QM87
4th Generation
Intel® Core™ i7/i5/i3
2 DDR3L SODIMM
up to 16GB
HM86
HM86
HM961-HM86
HM960-HM86
4th Generation
Intel® Core™ i7/i5/i3
2 DDR3L ECC SODIMM
up to 16GB
2 DDR3L SODIMM
up to 16GB
HM86
QM77
HM76
HM920-HM86
CR960-QM77
CR960-HM76
4th Generation
Intel® Core™ i7/i5/i3
3rd/2nd Generation
Intel® Core™ i7/i5/i3
3rd/2nd Generation
Intel® Core™ i7/i5/i3
2 DDR3L SODIMM
up to 16GB
2 DDR3/DDR3L SODIMM
up to 16GB
2 DDR3/DDR3L SODIMM
up to 16GB
VGA, LVDS, DDI
VGA, LVDS
VGA, LVDS and DDI
VGA, LVDS and DDI
1 Intel
1 Intel
1 Intel
1 Intel
1 Intel
1 Intel
USB 3.0
4
N/A
2
N/A
4
4
USB 2.0
8
8
8
8
8
8
RS232/422/485
N/A
N/A
N/A
N/A
N/A
N/A
RS232
N/A
N/A
N/A
N/A
N/A
N/A
SATA 3.0
4
4
2
2
2
2
SATA 2.0
N/A
N/A
2
1
2
2
SSD
Yes (option)
Yes (option)
Yes (option)
Yes (option)
Yes (option)
Yes (option)
IDE
N/A
N/A
N/A
1
N/A
N/A
CF
N/A
N/A
N/A
N/A
N/A
N/A
1
1
1
1
1
1
PCIe x4
N/A
N/A
N/A
N/A
N/A
N/A
PCIe x1
7
6
7
6
7
7
Mini PCIe
N/A
N/A
N/A
N/A
N/A
N/A
PCI
N/A
4
N/A
4
N/A
N/A
4-bit input and 4-bit output
4-bit input and 4-bit output
4-bit input and 4-bit output
4-bit input and 4-bit output
4-bit input and 4-bit output
4-bit input and 4-bit output
HDA
HDA
HDA
HDA
HDA
HDA
LPC
Yes
Yes
Yes
Yes
Yes
Yes
SMBus
Yes
Yes
Yes
Yes
Yes
Yes
CAN-bus
N/A
N/A
N/A
N/A
N/A
N/A
TPM (optional)
Yes
Yes
Yes
Yes
Yes
Yes
Watchdog
Yes
Yes
Yes
Yes
Yes
Yes
Power Input
12V, VCC_RTC, 5VSB (option)
12V, VCC_RTC, 5VSB (option)
12V, VCC_RTC, 5VSB (option)
12V, VCC_RTC, 5VSB
(option)
5VSB (option), 12V,
VCC_RTC
5VSB (option), 12V,
VCC_RTC
Compliance
R2.1, Type 6
R2.1, Type 2
R2.1, Type 6
R2.1, Type 2
R2.1, Type 6
R2.1, Type 6
Dimensions
95mm x 125mm
95mm x 125mm
95mm x 125mm
95mm x 125mm
95mm x 125mm
95mm x 125mm
Ethernet
USB
Serial
Storage
PCIe x16
Expansion
Digital I/O
Audio
Controller
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Modules
Mini
COM Express
Basic
VGA, LVDS
Computer-On-Module
VGA, LVDS, DDI
COM Express® Basic Computer-On-Module
QM77
HM76
QM77
QM77
COM Express® Basic Computer-On-Module
QM67
HM65
QM67
HM55
AMD R-Series
AMD R-Series
Coming Soon
CR902-B
Model
CR902-BL
CR901-B
CR900-B
HR902-B
HR902-BL
HR900-B
CP900-B
CM960-B
CM901-B
3rd/2nd Generation
Intel® Core™ i7/i5/i3
3rd/2nd Generation
Intel® Core™ i7/i5/i3
Intel® Core™ i7/i5
Intel® Celeron®
AMD® A70M
AMD® A70M
Memory
2 DDR3/DDR3L SODIMM
up to 16GB
2 DDR3/DDR3L SODIMM
up to 16GB
2 DDR3 SODIMM
up to 16GB
2 DDR3 SODIMM
up to 16GB
2 DDR3 SODIMM
up to 8GB
2 DDR3 SODIMM
up to 16GB
2 DDR3 SODIMM
up to 16GB
Display
VGA, LVDS, DDI
VGA, LVDS, DDI
VGA, LVDS
VGA, LVDS
3 Independent Displays
DP, DP/LVDS, DP/VGA
3 Independent Displays
DP, DP/LVDS, DP/VGA
1 Intel
1 Intel
1 Intel
1 Intel
1 Intel
N/A
N/A
N/A
4
4
Ethernet
3 Independent
Displays
VGA, LVDS, DDI
1 Intel
VGA, LVDS
1 Intel
USB 3.0
N/A
USB 2.0
8
8
8
8
8
4
4
RS232/422/485
N/A
N/A
N/A
N/A
N/A
N/A
N/A
RS232
N/A
N/A
N/A
N/A
N/A
N/A
N/A
SATA 3.0
2
2
2
2
N/A
4
4
SATA 2.0
2
2
2
2
4
N/A
N/A
N/A
Yes (option)
N/A
N/A
N/A
Yes (option)
Yes (option)
1 IDE
1 IDE
1 IDE
N/A
N/A
4
N/A
USB
Serial
Storage
SSD
IDE, FDD
CF
N/A
1 IDE
N/A
N/A
N/A
N/A
N/A
N/A
N/A
1
1
1
1
1
N/A
1
PCIe x8
N/A
N/A
N/A
N/A
N/A
1
N/A
PCIe x1
5
5
5
4
7
7
N/A
N/A
N/A
N/A
N/A
4
4
4
N/A
N/A
PCIe x16
Expansion
1 IDE
Mini PCIe
PCI
5
N/A
4
Digital I/O
7
N/A
N/A
4
8-bit
4-bit input and 4-bit output
8-bit
8-bit
8-bit
8-bit
8-bit
HDA
HDA
HDA
HDA
HDA
HDA
HDA
LPC
Yes
Yes
Yes
Yes
Yes
Yes
Yes
SMBus
Yes
N/A
Yes
Yes
Yes
N/A
N/A
CAN-bus
N/A
N/A
N/A
N/A
N/A
N/A
N/A
TPM (optional)
N/A
N/A
N/A
N/A
N/A
N/A
Watchdog
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Power Input
12V
12V
12V
12V
12V
12V/5VSB
12V/5VSB
Compliance
R2.1, Type 2
R2.1, Type 2
R1.0, Type 2
R1.0, Type 2
R2.1, Type 6
R2.1, Type 6
Dimensions
95mm x 125mm
95mm x 125mm
95mm x 125mm
95mm x 125mm
95mm x 125mm
95mm x 125mm
Audio
Controller
www.dfi.com
N/A
Yes
R2.1, Type 6
R2.1, Type 2
95mm x 125mm
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Modules
Mini
COM Express
Basic
3rd/2nd Generation
Intel® Core™ i7/i5/i3
Computer-On-Module
3rd/2nd Generation
Intel® Core™ i7/i5/i3
Processor
4th Gen Intel® CoreTM
COM Express® Basic
4th Gen Intel® CoreTM
COM Express® Basic
HM961-QM87
HM961-QM87
QM87
BGA 1364
DDR3L_2
SODIMM
Features
Specifications
MEMORY
EXPANSION
DDR3L_1
SODIMM
Intel QM87
CPU Fan
LAN
DIMENSIONS
• 4th generation Intel® CoreTM processors
• BGA 1364 packaging technology
• 22nm process technology
Please refer to the Ordering Information below
®
• Intel QM87 Express Chipset
SYSTEM MEMORY
• Two 204-pin DDR3L SODIMM sockets
• Supports DDR3L 1333/1600MHz SODIMM
•Supports up to 16GB system memory
•DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3L DRAM technologies
are supported for x8 and x16 devices, unbuffered, ECC
SSD
AMT
USB 3.0
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
BIOS
•AMI BIOS
- 64Mbit SPI BIOS
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
POWER
• Input: 12V, VCC_RTC, 5VSB (option)
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
125.15
121.08
91.08
37.48
4.08
0.00
POWER CONSUMPTION
• TBD
ONBOARD LAN FEATURES
0.00
4.08
• Intel® I217LM with iAMT9.0 Gigabit Ethernet Phy
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
4.08
12.84
OS SUPPORT
• TBD
SERIAL ATA (SATA) INTERFACE
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
• Supports RAID 0/1/5/10
• Supports Intel® Smart Response Technology
HUMIDITY
• 5% to 90%
USB INTERFACE
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 6
Top View
•Supports 4 SATA 3.0 with data transfer rate up to 6Gb/s
•Integrated Advanced Host Controller Interface (AHCI) controller
45.61
LVDS Ports
79.64
91.08
95.15
eDP
PTN
3460
91.08
104.85
121.08
119.07
80.08
4.08
DDR3L SODIMM
(ECC Memory)
DDR3L SODIMM
(ECC Memory)
Processor
CORE CORE CORE
Channel A
1333/1600MHz
Channel B
1333/1600MHz
Coming Soon
CORE
Graphics
CORE
SSD (optional)
PEG 16x LANES
Memory
Controller
DMI x4
(Direct Media
Interface)
• XHCI Host Controller supports up to 4 super speed USB 3.0 ports
VR12.5
(Vcore)
4th Generation
Intel® Core™ i7/i5/i3
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
Intel® FDI
(Flexible Display
Interface)
INTEL ACTIVE MANAGEMENT TECHNOLOGY (AMT)
HD Audio
LPC Bus
DDI Port B
Bottom View
Backup
EEPROM
2.00
0.00
LPC TPM 1.2
SLB9635(option)
I2C Bus
WDT
SLP/LID
0.00
12.50
70.20
Embedded
Controller
Serial Port 1, 2
Tx/Rx
4 in/4 out
DIO
53.00
DDI Port C
SM Bus
SM Bus
DIO
DDI Port D
Mobile
Intel® QM87
Express Chipset
PCIe x1 Lane 7
PCIe x1 Lane 8
(Opt. share with onboard LAN)
CRT
PCIe x1, Lane 1~6
2nd SPI Bus
SATA Port 4
Sys FAN PWM/TACH_IN
LAN Port
Supports iAMT9.0
Out-of-band system access
Remote troubleshooting and recovery
Hardware-based agent presence checking
Proactive alerting
Remote hardware and software asset tracking
USB 3.0 4x
USB 2.0 8x
SATA 3.0 4x
C/D
A/B
14.00
•
•
•
•
•
•
SSD Chip
(option)
Ordering Information
Model Name
HM961
-
Chipset
Temperature Memory
SSD
QM87
B
S
0
B: 0oC to 60oC
S: Socket
0:
2:
4:
8:
1:
3:
6:
PCIe x1, Lane 8
Intel® GLAN
PHY I217LM
None
2GB
4GB
8GB
16GB
32GB
64GB
4700EQ
4700EQ: Intel® CoreTM i7-4700EQ, 6M Cache, up to 3.4 GHz, 47W
4400E: Intel® CoreTM i5-4400E, 3M Cache, up to 3.3 GHz, 37W
4402E: Intel® CoreTM i5-4402E, 3M Cache, up to 2.7 GHz, 25W
4100E: Intel® CoreTM i3-4100E, 3M Cache, up to 2.4 GHz, 37W
4102E: Intel® CoreTM i3-4102E, 3M Cache, up to 1.6 GHz, 25W
Heat spreader
22.00
Module PCB
Packing List
2.00
11.00
55.00
20.00
Heat sink and fan
Processors
-
standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
• 1 HM961 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• COM331-B carrier board kit
• COM101-BAT carrier board kit
• Heat spreader with heat sink and fan: TBD
Modules
Mini
COM Express
Basic
Block Diagram
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4600
• Supports 1 VGA, 1 LVDS and 3 DDI
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to
1920x1200 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
•HDMI: resolution up to 4096x2304 @ 24Hz or 2560x1600 @ 60Hz
•DVI: resolution up to 1920x1200 @ 60Hz
•DP: resolution up to 3840x2160 @ 60Hz
• Intel® Clear Video Technology
• Intel® Advanced Vector Extensions (Intel® AVX) Instructions
• Supports DirectX 11.1, OpenGL 3.2, OpenCL 1.2
Computer-On-Module
Mechanical Drawing
Optional
SATA 3.0
EXPANSION INTERFACES
• Supports 4 USB 3.0 interfaces
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x16 Gen 3 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
CHIPSET
Availability: Mar 2014
ECC
Memory
TRUSTED PLATFORM MODULE (TPM) - optional
•Provides a Trusted PC for secure transactions
•Provides software license protection, enforcement and password
protection
PROCESSOR
2 DDR3L ECC SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 I2C, 1 SMBus, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP)
12 USB: 4 USB 3.0, 8 USB 2.0
4 SATA 3.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
4th Gen Intel® CoreTM
COM Express® Basic
4th Gen Intel® CoreTM
COM Express® Basic
HM960-QM87
HM960-QM87
QM87
BGA 1364
DDR3L_2
SODIMM
Features
Specifications
MEMORY
EXPANSION
DDR3L_1
SODIMM
Intel QM87
CPU Fan
LAN
DIMENSIONS
• 4th generation Intel® CoreTM processors
• BGA 1364 packaging technology
• 22nm process technology
Please refer to the Ordering Information below
®
• Intel QM87 Express Chipset
SYSTEM MEMORY
• Two 204-pin DDR3L SODIMM sockets
• Supports DDR3L 1333/1600MHz SODIMM
•Supports up to 16GB system memory
•DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3L DRAM technologies
are supported for x8 and x16 devices, unbuffered, non-ECC
SSD
DDR3L
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
BIOS
•AMI BIOS
- 64Mbit SPI BIOS
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
POWER
• Input: 12V, VCC_RTC, 5VSB (option)
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
125.15
121.08
91.08
37.48
4.08
0.00
POWER CONSUMPTION
• TBD
ONBOARD LAN FEATURES
0.00
4.08
• Intel® I217LM with iAMT9.0 Gigabit Ethernet Phy
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
4.08
12.84
OS SUPPORT
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
Top View
SERIAL ATA (SATA) INTERFACE
•Supports 4 SATA 3.0 with data transfer rate up to 6Gb/s
•Integrated Advanced Host Controller Interface (AHCI) controller
45.61
LVDS Ports
79.64
91.08
95.15
eDP
PTN
3460
91.08
104.85
121.08
119.07
80.08
4.08
DDR3L
SODIMM
DDR3L
SODIMM
• Supports RAID 0/1/5/10
• Supports Intel® Smart Response Technology
Processor
CORE CORE CORE
Channel A
1333/1600MHz
Channel B
1333/1600MHz
CORE
VR12.5
(Vcore)
4th Generation;
Intel® Core™ i7/i5/i3
Graphics
CORE
PEG 16x LANES
Memory
Controller
DMI x4
(Direct Media
Interface)
Backup
EEPROM
LPC TPM 1.2
SLB9635(option)
2.00
0.00
DDI Port C
WDT
Sys FAN PWM/
TACH_IN/
SLP/LID
Embedded
Controller
0.00
12.50
70.20
SM Bus
4 in/4 out
DIO
53.00
SM Bus
DIO
Serial Port 1, 2 Tx/Rx
DDI Port D
Mobile
Intel® QM87
Express Chipset
SATA 3.0 4x
PCIe x1 Lane 7
PCIe x1 Lane 8
(Opt. share with onboard LAN)
CRT
PCIe x1, Lane 1~6
SATA Ports
SPI Bus
LAN Port
SSD (optional)
• 2GB/4GB/8GB/16GB/32GB/64GB
HUMIDITY
• 5% to 90%
•
•
•
•
•
•
Supports iAMT9.0
Out-of-band system access
Remote troubleshooting and recovery
Hardware-based agent presence checking
Proactive alerting
Remote hardware and software asset tracking
SSD Chip
(option)
Ordering Information
Model Name
HM960
-
Chipset
Temperature Memory
SSD
QM87
B
S
0
B: 0oC to 60oC
S: Socket
0:
2:
4:
8:
1:
3:
6:
PCIe x1, Lane 8
Intel® GLAN
PHY I217LM
20.00
Heat sink and fan
Processors
None
2GB
4GB
8GB
16GB
32GB
64GB
4700EQ
4700EQ: Intel® CoreTM i7-4700EQ, 6M Cache, up to 3.4 GHz, 47W
4400E: Intel® CoreTM i5-4400E, 3M Cache, up to 3.3 GHz, 37W
4402E: Intel® CoreTM i5-4402E, 3M Cache, up to 2.7 GHz, 25W
4100E: Intel® CoreTM i3-4100E, 3M Cache, up to 2.4 GHz, 37W
4102E: Intel® CoreTM i3-4102E, 3M Cache, up to 1.6 GHz, 25W
Heat spreader
22.00
Module PCB
Packing List
2.00
11.00
55.00
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 6
USB 3.0 4x
HD Audio
USB 2.0 8x
C/D
A/B
14.00
• XHCI Host Controller supports up to 4 super speed USB 3.0 ports
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
INTEL ACTIVE MANAGEMENT TECHNOLOGY (AMT)
DDI Port B
I2C Bus
USB INTERFACE
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
Intel® FDI
(Flexible Display
Interface)
LPC Bus
Bottom View
(based on Intel's Windows XP support list)
standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
• 1 HM960 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• COM331-B carrier board kit
• COM101-BAT carrier board kit
• Heat spreader with heat sink and fan: 761-HSWMBL-000G
Modules
Mini
COM Express
Basic
Block Diagram
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4600
• Supports 1 VGA, 1 LVDS and 3 DDI
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to
1920x1200 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
•HDMI: resolution up to 4096x2304 @ 24Hz or 2560x1600 @ 60Hz
•DVI: resolution up to 1920x1200 @ 60Hz
•DP: resolution up to 3840x2160 @ 60Hz
• Intel® Clear Video Technology
• Intel® Advanced Vector Extensions (Intel® AVX) Instructions
• Supports DirectX 11.1, OpenGL 3.2, OpenCL 1.2
Computer-On-Module
Mechanical Drawing
USB 3.0
SATA 3.0
EXPANSION INTERFACES
• Supports 4 USB 3.0 interfaces
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x16 Gen 3 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
CHIPSET
Optional
AMT
TRUSTED PLATFORM MODULE (TPM) - optional
•Provides a Trusted PC for secure transactions
•Provides software license protection, enforcement and password
protection
PROCESSOR
2 DDR3L SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 I2C, 1 SMBus, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP)
12 USB: 4 USB 3.0, 8 USB 2.0
4 SATA 3.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
4th Gen Intel® CoreTM
COM Express® Basic
4th Gen Intel® CoreTM
COM Express® Basic
HM920-QM87
HM920-QM87
QM87
BGA 1364
DDR3L_2
SODIMM
Features
Specifications
MEMORY
EXPANSION
DDR3L_1
SODIMM
Intel QM87
CPU Fan
PROCESSOR
• 4th generation Intel® CoreTM processors
• BGA 1364 packaging technology
• 22nm process technology
Please refer to the Ordering Information below
2 DDR3L SODIMM up to 16GB
1 PCIe x16, 6 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 I2C, 1 IDE
1 VGA, 1 LVDS
8 USB 2.0
4 SATA 3.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 2
95mm x 125mm (3.74" x 4.9")
LAN
DIMENSIONS
121.00
117.00
87.00
0.00
4.00
0.00
4.00
76.00
117.00
0.00
4.00
LVDS Port
eDP
PTN
3460
DDR3L
SODIMM
DDR3L
SODIMM
Processor
CORE CORE CORE
Channel A
1333/1600MHz
POWER CONSUMPTION
• TBD
OS SUPPORT
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
Channel B
1333/1600MHz
Graphics
CORE
VR12.5
(Vcore)
PCIe x1
LANE7
IT8892E
PCIe to PCI
PCI BUS
LPC Bus
SATA
Port
Embedded
Controller
WDT
53.00
SM Bus
4 in/4 out
DIO
SM Bus
DIO
Mobile Intel®
QM87
Express Chipset
88SA8052
SATA to PATA
IDE BUS
Ordering Information
Model Name
HM920
USB 2.0 8x
SATA 3.0 4x
-
Chipset
Temperature Memory
SSD
QM87
B
S
0
B: 0oC to 60oC
S: Socket
0:
2:
4:
8:
1:
3:
6:
CRT
PCIe x1, Lane 1~6
LAN Port
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 2
C/D
A/B
0.00
12.50
70.20
LPC TPM 1.2
SLB9635(option)
I2C
Bus
HUMIDITY
• 5% to 90%
INTEL ACTIVE MANAGEMENT TECHNOLOGY (AMT)
• Supports iAMT9.0
• Out-of-band system access
• Remote troubleshooting and recovery
• Hardware-based agent presence checking
• Proactive alerting
• Remote hardware and software asset tracking
Intel® FDI
(Flexible Display
Interface)
14.00
CMOS
backup
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
PEG 16x LANES
Memory
Controller
Bottom View
2.00
0.00
(based on Intel's Windows XP support list)
SSD-optional
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
CORE
4th Generation;
Intel® Core™ i7/i5/i3
DMI x4
(Direct Media
Interface)
SATA Port
PCIe x1, Lane 8
SSD Chip
(option)
Intel® GLAN
PHY I217LM
Heat sink and fan
20.00
POWER
• Input: 12V, VCC_RTC, 5VSB (optional)
SERIAL ATA (SATA) INTERFACE
•Supports 4 SATA 3.0 with data transfer rate up to 6Gb/s
•Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
• Supports Intel® Smart Response Technology
45.39
Processors
None
2GB
4GB
8GB
16GB
32GB
64GB
4700EQ
4700EQ: Intel® CoreTM i7-4700EQ, 6M Cache, up to 3.4 GHz, 47W
4400E: Intel® CoreTM i5-4400E, 3M Cache, up to 3.3 GHz, 37W
4402E: Intel® CoreTM i5-4402E, 3M Cache, up to 2.7 GHz, 25W
4100E: Intel® CoreTM i3-4100E, 3M Cache, up to 2.4 GHz, 37W
4102E: Intel® CoreTM i3-4102E, 3M Cache, up to 1.6 GHz, 25W
Heat spreader
22.00
Module PCB
Packing List
2.00
11.00
55.00
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
ONBOARD LAN FEATURES
• Intel® I217LM with iAMT9.0 Gigabit Ethernet Phy
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Top View
0.00
4.00
BIOS
•AMI BIOS
- 64Mbit SPI BIOS
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
91.00
87.00
91.00
87.00
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
• 1 HM920 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• COM330-B carrier board kit
• Heat spreader with heat sink and fan: 761-HSWMBL-000G
Modules
Mini
COM Express
Basic
Block Diagram
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4600
• Supports 1 VGA and 1 LVDS
• VGA: resolution up to 2048x1536 @ 60Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to
1920x1200 @ 60Hz
• Intel® Clear Video Technology
• Intel® Advanced Vector Extensions (Intel® AVX) Instructions
• Supports DirectX 11.1, OpenGL 3.2, OpenCL 1.2
Computer-On-Module
Mechanical Drawing
USB 2.0
SATA 3.0
EXPANSION INTERFACES
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x16 Gen 3 interface
• Supports 6 PCIe x1 interfaces
• Supports 4 PCI interfaces (PCI 2.3)
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports IDE interface
• Supports 4-bit input and 4-bit output GPIO
SYSTEM MEMORY
• Two 204-pin DDR3L SODIMM sockets
• Supports DDR3L 1333/1600MHz SODIMM
•Supports up to 16GB system memory
•DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3L DRAM
technologies are supported for x8 and x16 devices, unbuffered, nonECC
Optional
DDR3L
TRUSTED PLATFORM MODULE (TPM) - optional
•Provides a Trusted PC for secure transactions
•Provides software license protection, enforcement and password
protection
CHIPSET
• Intel® QM87 Express Chipset
SSD
AMT 9.0
IDE INTERFACE
• Supports up to two IDE devices
• DMA mode: Ultra ATA up to 100MB/s
4th Gen Intel® CoreTM
COM Express® Basic
4th Gen Intel® CoreTM
COM Express® Basic
HM961-HM86
HM961-HM86
HM86
BGA 1364
DDR3L_2
SODIMM
Features
Specifications
MEMORY
EXPANSION
DDR3L_1
SODIMM
Intel HM86
CPU Fan
PROCESSOR
• 4th generation Intel® CoreTM processors
• BGA 1364 packaging technology
• 22nm process technology
Please refer to the Ordering Information below
2 DDR3L ECC SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP)
2 USB 3.0, 8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
LAN
DIMENSIONS
Availability: Mar 2014
CHIPSET
• Intel® HM86 Express Chipset
SYSTEM MEMORY
• Two 204-pin DDR3L SODIMM sockets
• Supports DDR3L 1333/1600MHz SODIMM
•Supports up to 16GB system memory
•DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3L DRAM
technologies are supported for x8 and x16 devices, unbuffered, ECC
SSD
Optional
ECC
Memory
USB 3.0
SATA 3.0
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4600
• Supports 1 VGA, 1 LVDS and 3 DDI
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to
1920x1200 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
•HDMI: resolution up to 4096x2304 @ 24Hz or 2560x1600 @ 60Hz
•DVI: resolution up to 1920x1200 @ 60Hz
•DP: resolution up to 3840x2160 @ 60Hz
• Intel® Clear Video Technology
• Intel® Advanced Vector Extensions (Intel® AVX) Instructions
• Supports DirectX 11.1, OpenGL 3.2, OpenCL 1.2
BIOS
•AMI BIOS
- 64Mbit SPI BIOS
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
POWER
• Input: 12V, VCC_RTC, 5VSB (option)
POWER CONSUMPTION
• TBD
OS SUPPORT
• TBD
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
125.15
121.08
91.08
37.48
4.08
0.00
0.00
4.08
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
ONBOARD LAN FEATURES
• Intel® I217LM Gigabit Ethernet Phy
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
4.08
12.84
HUMIDITY
• 5% to 90%
Top View
SERIAL ATA (SATA) INTERFACE
•Supports 2 SATA 3.0, and 2 SATA 2.0
•Supports 2 SATA 3.0, 1 SATA 2.0, and 1 SSD (optional)
•Integrated Advanced Host Controller Interface (AHCI) controller
45.61
LVDS Ports
79.64
91.08
95.15
eDP
PTN
3460
91.08
104.85
121.08
119.07
80.08
4.08
DDR3L SODIMM
(ECC Memory)
DDR3L SODIMM
(ECC Memory)
Processor
CORE CORE CORE
Channel A
1333/1600MHz
Channel B
1333/1600MHz
Coming Soon
Graphics
CORE
VR12.5
(Vcore)
SSD - optional
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
PEG 16x LANES
Memory
Controller
DMI x4
(Direct Media
Interface)
USB INTERFACE
• XHCI Host Controller supports up to 2 super speed USB 3.0 ports
CORE
4th Generation
Intel® Core™ i7/i5/i3
Intel® FDI
(Flexible Display
Interface)
TRUSTED PLATFORM MODULE (TPM) - optional
•Provides a Trusted PC for secure transactions
•Provides software license protection, enforcement and password
protection
HD Audio
LPC Bus
DDI Port B
Bottom View
Backup
EEPROM
2.00
0.00
LPC TPM 1.2
SLB9635(option)
I2C Bus
WDT
SLP/LID
0.00
12.50
70.20
Embedded
Controller
Serial Port 1, 2
Tx/Rx
4 in/4 out
DIO
53.00
DDI Port C
SM Bus
SM Bus
DIO
DDI Port D
Mobile
Intel® HM86
Express Chipset
USB 3.0 4x
PCIe x1 Lane 7
USB 2.0 8x
SATA 3.0 2x, SATA 2.0 2x
PCIe x1 Lane 8
(Opt. share with onboard LAN)
CRT
PCIe x1, Lane 1~6
2nd SPI Bus
SATA Port 4
Sys FAN PWM/TACH_IN
LAN Port
C/D
A/B
14.00
SSD Chip
(option)
Ordering Information
Model Name
HM961
-
Chipset
Temperature Memory
SSD
HM86
B
S
0
B: 0oC to 60oC
S: Socket
0:
2:
4:
8:
1:
3:
6:
PCIe x1, Lane 8
Intel® GLAN
PHY I217LM
20.00
Heat sink and fan
Processors
None
2GB
4GB
8GB
16GB
32GB
64GB
4700EQ
4700EQ: Intel® CoreTM i7-4700EQ, 6M Cache, up to 3.4 GHz, 47W
4400E: Intel® CoreTM i5-4400E, 3M Cache, up to 3.3 GHz, 37W
4402E: Intel® CoreTM i5-4402E, 3M Cache, up to 2.7 GHz, 25W
4100E: Intel® CoreTM i3-4100E, 3M Cache, up to 2.4 GHz, 37W
4102E: Intel® CoreTM i3-4102E, 3M Cache, up to 1.6 GHz, 25W
Heat spreader
22.00
Module PCB
Packing List
2.00
11.00
55.00
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 6
standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
• 1 HM961 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• COM331-B carrier board kit
• COM101-BAT carrier board kit
• Heat spreader with heat sink and fan: TBD
Modules
Mini
COM Express
Basic
Block Diagram
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
Computer-On-Module
Mechanical Drawing
DIO
EXPANSION INTERFACES
• Supports 2 USB 3.0 interfaces
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x16 Gen 3 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
4th Gen Intel® CoreTM
COM Express® Basic
4th Gen Intel® CoreTM
COM Express® Basic
HM960-HM86
HM960-HM86
HM86
BGA 1364
DDR3L_2
SODIMM
Features
Specifications
MEMORY
EXPANSION
DDR3L_1
SODIMM
Intel HM86
CPU Fan
PROCESSOR
• 4th generation Intel® CoreTM processors
• BGA 1364 packaging technology
• 22nm process technology
Please refer to the Ordering Information below
2 DDR3L SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP)
2 USB 3.0, 8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
LAN
DIMENSIONS
CHIPSET
• Intel® HM86 Express Chipset
SYSTEM MEMORY
• Two 204-pin DDR3L SODIMM sockets
• Supports DDR3L 1333/1600MHz SODIMM
•Supports up to 16GB system memory
•DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3L DRAM
technologies are supported for x8 and x16 devices, unbuffered, nonECC
SSD
Optional
DDR3L
USB 3.0
SATA 3.0
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4600
• Supports 1 VGA, 1 LVDS and 3 DDI
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to
1920x1200 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
•HDMI: resolution up to 4096x2304 @ 24Hz or 2560x1600 @ 60Hz
•DVI: resolution up to 1920x1200 @ 60Hz
•DP: resolution up to 3840x2160 @ 60Hz
• Intel® Clear Video Technology
• Intel® Advanced Vector Extensions (Intel® AVX) Instructions
• Supports DirectX 11.1, OpenGL 3.2, OpenCL 1.2
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
POWER
• Input: 12V, VCC_RTC, 5VSB (option)
POWER CONSUMPTION
• TBD
125.15
121.08
91.08
37.48
4.08
0.00
OS SUPPORT
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
0.00
4.08
(based on Intel's Windows XP support list)
ONBOARD LAN FEATURES
• Intel® I217LM Gigabit Ethernet Phy
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
4.08
12.84
Top View
LVDS Ports
eDP
PTN
3460
79.64
91.08
104.85
121.08
119.07
80.08
4.08
DDR3L
SODIMM
DDR3L
SODIMM
Processor
CORE CORE CORE
Channel A
1333/1600MHz
Channel B
1333/1600MHz
CORE
PEG 16x LANES
Memory
Controller
DMI x4
(Direct Media
Interface)
HUMIDITY
• 5% to 90%
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 6
USB INTERFACE
• XHCI Host Controller supports up to 2 super speed USB 3.0 ports
VR12.5
(Vcore)
4th Generation;
Intel® Core™ i7/i5/i3
Graphics
CORE
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
SERIAL ATA (SATA) INTERFACE
•Supports 2 SATA 3.0, and 2 SATA 2.0
•Supports 2 SATA 3.0, 1 SATA 2.0, and 1 SSD (optional)
•Integrated Advanced Host Controller Interface (AHCI) controller
45.61
91.08
95.15
BIOS
•AMI BIOS
- 64Mbit SPI BIOS
SSD - optional
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
®
Intel FDI
(Flexible Display
Interface)
LPC Bus
Backup
EEPROM
Bottom View
DDI Port B
LPC TPM 1.2
SLB9635(option)
2
I C Bus
2.00
0.00
DDI Port C
WDT
Sys FAN PWM/
TACH_IN/
SLP/LID
Embedded
Controller
SM Bus
0.00
12.50
70.20
4 in/4 out
DIO
53.00
SM Bus
DIO
Serial Port 1, 2 Tx/Rx
DDI Port D
Mobile
Intel® HM86
Express Chipset
USB 3.0 2x
PCIe x1 Lane 7
HD Audio
USB 2.0 8x
SATA 3.0 2x, SATA 2.0 2x
PCIe x1 Lane 8
(Opt. share with onboard LAN)
CRT
PCIe x1, Lane 1~6
SATA Ports
SPI Bus
LAN Port
C/D
A/B
14.00
TRUSTED PLATFORM MODULE (TPM) - optional
•Provides a Trusted PC for secure transactions
•Provides software license protection, enforcement and password
protection
SSD Chip
(option)
Ordering Information
Model Name
HM960
-
Chipset
Temperature Memory
SSD
HM86
B
S
0
B: 0oC to 60oC
S: Socket
0:
2:
4:
8:
1:
3:
6:
PCIe x1, Lane 8
Intel® GLAN
PHY I217LM
None
2GB
4GB
8GB
16GB
32GB
64GB
4700EQ
4700EQ: Intel® CoreTM i7-4700EQ, 6M Cache, up to 3.4 GHz, 47W
4400E: Intel® CoreTM i5-4400E, 3M Cache, up to 3.3 GHz, 37W
4402E: Intel® CoreTM i5-4402E, 3M Cache, up to 2.7 GHz, 25W
4100E: Intel® CoreTM i3-4100E, 3M Cache, up to 2.4 GHz, 37W
4102E: Intel® CoreTM i3-4102E, 3M Cache, up to 1.6 GHz, 25W
Heat spreader
22.00
Module PCB
11.00
55.00
20.00
Heat sink and fan
Processors
-
2.00
Packing List
standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
• 1 HM960 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• COM331-B carrier board kit
• COM101-BAT carrier board kit
• Heat spreader with heat sink and fan: 761-HSWMBL-000G
Modules
Mini
COM Express
Basic
Block Diagram
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
Computer-On-Module
Mechanical Drawing
DIO
EXPANSION INTERFACES
• Supports 2 USB 3.0 interfaces
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x16 Gen 3 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
4th Gen Intel® CoreTM
COM Express® Basic
4th Gen Intel® CoreTM
COM Express® Basic
HM920-HM86
HM920-HM86
HM86
BGA 1364
DDR3L_2
SODIMM
Features
Specifications
MEMORY
EXPANSION
DDR3L_1
SODIMM
Intel HM86
CPU Fan
PROCESSOR
• 4th generation Intel® CoreTM processors
• BGA 1364 packaging technology
• 22nm process technology
Please refer to the Ordering Information below
2 DDR3L SODIMM up to 16GB
1 PCIe x16, 6 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 I2C, 1 IDE
1 VGA, 1 LVDS
8 USB 2.0
3 SATA: 2 SATA 3.0, 1 SATA 2.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 2
95mm x 125mm (3.74" x 4.9")
LAN
DIMENSIONS
SYSTEM MEMORY
• Two 204-pin DDR3L SODIMM sockets
• Supports DDR3L 1333/1600MHz SODIMM
•Supports up to 16GB system memory
•DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3L DRAM
technologies are supported for x8 and x16 devices, unbuffered, nonECC
SSD
USB 2.0
SATA 3.0
121.00
117.00
87.00
0.00
4.00
Top View
POWER CONSUMPTION
• TBD
0.00
4.00
76.00
117.00
0.00
4.00
LVDS Port
eDP
PTN
3460
DDR3L
SODIMM
Processor
CORE CORE CORE
Channel A
1333/1600MHz
(based on Intel's Windows XP support list)
Channel B
1333/1600MHz
Graphics
CORE
VR12.5
(Vcore)
PEG 16x LANES
Memory
Controller
Bottom View
PCIe x1
LANE7
IT8892E
PCIe to PCI
HUMIDITY
• 5% to 90%
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 2
TRUSTED PLATFORM MODULE (TPM) - optional
•Provides a Trusted PC for secure transactions
•Provides software license protection, enforcement and password
protection
Intel® FDI
(Flexible Display
Interface)
14.00
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
SSD - optional
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
CORE
4th Generation;
Intel® Core™ i7/i5/i3
DMI x4
(Direct Media
Interface)
PCI BUS
LPC Bus
CMOS
backup
I2C
Bus
Embedded
Controller
SM Bus
4 in/4 out
DIO
LPC TPM 1.2
SLB9635(option)
SATA
Port
WDT
53.00
C/D
0.00
12.50
70.20
A/B
2.00
0.00
SM Bus
DIO
Mobile Intel®
HM86
Express Chipset
88SA8052
SATA to PATA
IDE BUS
Ordering Information
Model Name
USB 2.0 8x
HM920
SATA 3.0 2x, SATA 2.0 1x
-
Chipset
Temperature Memory
SSD
HM86
B
S
0
B: 0oC to 60oC
S: Socket
0:
2:
4:
8:
1:
3:
6:
CRT
PCIe x1, Lane 1~6
LAN Port
SATA Port
PCIe x1, Lane 8
SSD Chip
(option)
Intel® GLAN
PHY I217LM
Heat sink and fan
20.00
OS SUPPORT
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
SERIAL ATA (SATA) INTERFACE
•Supports 2 SATA 3.0, 1 SATA 2.0, and 1 IDE
•Supports 2 SATA 3.0, 1 IDE, and 1 SSD (optional)
•Integrated Advanced Host Controller Interface (AHCI) controller
DDR3L
SODIMM
Processors
None
2GB
4GB
8GB
16GB
32GB
64GB
4700EQ
4700EQ: Intel® CoreTM i7-4700EQ, 6M Cache, up to 3.4 GHz, 47W
4400E: Intel® CoreTM i5-4400E, 3M Cache, up to 3.3 GHz, 37W
4402E: Intel® CoreTM i5-4402E, 3M Cache, up to 2.7 GHz, 25W
4100E: Intel® CoreTM i3-4100E, 3M Cache, up to 2.4 GHz, 37W
4102E: Intel® CoreTM i3-4102E, 3M Cache, up to 1.6 GHz, 25W
Heat spreader
22.00
Module PCB
Packing List
2.00
11.00
55.00
POWER
• Input: 12V, VCC_RTC, 5VSB (optional)
ONBOARD LAN FEATURES
• Intel® I217LM Gigabit Ethernet Phy
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
45.39
0.00
4.00
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
91.00
87.00
91.00
87.00
BIOS
•AMI BIOS
- 64Mbit SPI BIOS
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4600
• Supports 1 VGA and 1 LVDS
• VGA: resolution up to 2048x1536 @ 60Hz
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to
1920x1200 @ 60Hz
• Intel® Clear Video Technology
• Intel® Advanced Vector Extensions (Intel® AVX) Instructions
• Supports DirectX 11.1, OpenGL 3.2, OpenCL 1.2
standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
• 1 HM920 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• COM330-B carrier board kit
• Heat spreader with heat sink and fan: 761-HSWMBL-000G
Modules
Mini
COM Express
Basic
Block Diagram
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
Computer-On-Module
Mechanical Drawing
DIO
EXPANSION INTERFACES
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x16 Gen 3 interface
• Supports 6 PCIe x1 interfaces
• Supports 4 PCI interfaces (PCI 2.3)
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports IDE interface
• Supports 4-bit input and 4-bit output GPIO
CHIPSET
• Intel® HM86 Express Chipset
Optional
DDR3L
IDE INTERFACE
• Supports up to two IDE devices
• DMA mode: Ultra ATA up to 100MB/s
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
CR960-QM77
CR960-QM77
QM77
BGA 1023
DDR3_2
SODIMM
Features
Specifications
MEMORY
EXPANSION
2 DDR3/DDR3L SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP/SDVO)
12 USB: 4 USB 3.0, 8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
DDR3_1
SODIMM
Intel QM77
CPU Fan
LAN
DIMENSIONS
SSD
Optional
DDR3
SODIMM
DDR3
SODIMM
87.00
Channel A
1333/1600MHz
Processor
CORE CORE CORE
Channel B
1333/1600MHz
CORE
PEG 16X LANES
Memory
Controller
117.00
121.00
76.00
0.00
4.00
FDI
SLP/LID
WDT
Serial Port 0/1
System Fan Embedded
PWM/TACH_IN
DMI x4
(Direct Media
Interface)
LPC TPM
1.2 (Opt.)
Controler
DDI Port C
2
IC
Backup
EEPROM
DDI Port D
SM Bus
8bit DIO
DIO SMBus
HD Audio
USB 2.0 8x
2.00
0.00
SATA 2.0 4x
LVDS (Dual Channel)
0.00
12.50
70.20
14.00
CRT
Panther Point
Mobile
Intel® QM77/HM76
CR960
Chipset
-
QM77
USB 3.0 4x
PCIe x1/ Lane 7
PCIe x1/ Lane 8
(Opt. share with on board LAN)
PCIe x1/Lanes 1~6
SPI Bus
125.00
SATA Ports 4
(Opt.)
SPI Flash
87.00
LAN Ports
SSD Chip
PCIe x1, Lane 8
95.00
87.00
Intel® GLAN
PHY 82579LM
Fan
22.00
Heatsink
11.00
55.00
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
TEMPERATURE
• 0oC to 60oC
HUMIDITY
• 5% to 90%
POWER
• Input: 5VSB (option), 12V, VCC_RTC
PCB
• Dimensions: 95mm (3.74") x 125mm (4.9")
• Compliance: PICMG COM Express® R2.1 basic form factor, Type 6
Ordering Information
Model Name
DDI Port B/SDVO Port B
C/D
A/B
Bottom View
53.00
BIOS
• 64Mbit SPI BIOS
SERIAL ATA (SATA) INTERFACE
•Supports 4 Serial ATA interfaces
•2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
•Integrated Advanced Host Controller Interface (AHCI) controller
•Supports RAID 0/1/5/10
LPC Bus
www.dfi.com
EXPANSION INTERFACES
•Supports 4 USB 3.0 ports
•Supports 8 USB 2.0 ports
•Supports 1 PCIe x16 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports I2C interface
• Supports SMBus interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
ONBOARD
LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
IMVP7
(Vcore,Vgfx)
3rd/2nd Generation
Intel® Core™ i7/i5/i3
Graphics
CORE
91.00
125.00
53.00
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
95.00 Top View
87.00
91.00
SYSTEM MEMORY
•Two 204-pin DDR3/DDR3L SODIMM sockets
• 3rd generation processors
- Supports DDR3/DDR3L 1333/1600 MHz (i7/i5/i3)
- Supports DDR3/DDR3L 1066/1333/1600 MHz (i7 Quad Core)
• 2nd generation processors
- Supports DDR3 1066/1333 MHz (i7/i5/i3/Celeron)
- Supports DDR3 1066/1333/1600 MHz (i7 Quad Core)
•Supports dual channel memory interface
•Supports up to 16GB system memory
•DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered, nonECC
Heat spreader
Module PCB
Standoff
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 CR960 board
• 1 QR (Quick Reference)
• 1 DVD
Temperature Memory
SSD
B
S
0
B: 0oC to 60oC
S: Socket
0:
2:
4:
8:
1:
3:
6:
Processors
None
2GB
4GB
8GB
16GB
32GB
64GB
3615QE
3rd Generation
3615QE: Intel® CoreTM i7-3615QE, 6M Cache, up to 3.30 GHz, 45W
3612QE: Intel® CoreTM i7-3612QE, 6M Cache, up to 3.10 GHz, 35W
3555LE: Intel® CoreTM i7-3555LE, 4M Cache, up to 3.20 GHz, 25W
3517UE: Intel® CoreTM i7-3517UE, 4M Cache, up to 2.80 GHz, 17W
3610ME: Intel® CoreTM i5-3610ME, 3M Cache, up to 3.30 GHz, 35W
3120ME: Intel® CoreTM i3-3120ME, 3M Cache, 2.40 GHz, 35W
3217UE: Intel® CoreTM i3-3217UE, 3M Cache, 1.60 GHz, 17W
1020E: Intel® CeleronTM 1020E, 2M Cache, 2.20 GHz, 35W
1047UE: Intel® CeleronTM 1047UE, 2M Cache, 1.40 GHz, 17W
927UE: Intel® CeleronTM 927UE, 1M Cache, 1.50 GHz, 17W
2nd Generation
2715QE: Intel® CoreTM i7-2715QE, 6M Cache, up to 3.00 GHz, 45W
2655LE: Intel® CoreTM i7-2655LE, 4M Cache, up to 2.90 GHz, 25W
2610UE: Intel® CoreTM i7-2610UE, 4M Cache, up to 2.40 GHz, 17W
2515E: Intel® CoreTM i5-2515E, 3M Cache, up to 3.10 GHz, 35W
2310E: Intel® CoreTM i3-2310E, 3M Cache, 2.10 GHz, 35W
2340UE: Intel® CoreTM i3-2340UE, 3M Cache, 1.30 GHz, 17W
810E: Intel® CeleronTM B810E, 2M Cache, 1.6GHz, 35W
847E: Intel® CeleronTM 847E, 2M Cache, 1.1GHz, 17W
827E: Intel® CeleronTM 827E, 1.5M Cache, 1.4GHz, 17W
807UE: Intel® CeleronTM 807UE, 1M Cache, 1.00 GHz, 10W
Optional Items
• COM331-B carrier board kit
• COM101-BAT carrier board kit
• Heat spreader with heat sink and fan: 761-CR9601-000G
Modules
Mini
COM Express
Basic
121.00
117.00
87.00
4.00
0.00
4.00
0.00
0.00
SSD (optional)
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
CHIPSET
• Intel® QM77 Express Chipset
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000 (3rd generation processors)
• Intel® HD Graphics 3000 (2nd generation processors)
• Intel® HD Graphics (Intel® CeleronTM processors)
• Supports VGA, LVDS and DDI interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit,
resolution up to 1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP or SDVO (for Port B)
• HDMI, DVI, DP: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing - Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
• Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)
Block Diagram
4.00
TRUSTED PLATFORM MODULE (TPM) - optional
•Provides a Trusted PC for secure transactions
•Provides software license protection, enforcement and password
protection
Computer-On-Module
Mechanical Drawing
PROCESSOR
•BGA 1023 packaging technology
- 3rd generation Intel® CoreTM processors (22nm process technology)
- 2nd generation Intel® CoreTM processors (32nm process technology)
Please refer to the Ordering Information below
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
CR960-HM76
CR960-HM76
HM76
BGA 1023
DDR3_2
SODIMM
Features
Specifications
MEMORY
EXPANSION
2 DDR3/DDR3L SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP/SDVO)
12 USB: 4 USB 3.0, 8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
SSD (optional)
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
DDR3_1
SODIMM
Intel HM76
CPU Fan
LAN
DIMENSIONS
SSD
Optional
HM76
SYSTEM MEMORY
•Two 204-pin DDR3/DDR3L SODIMM sockets
• 3rd generation processors
- Supports DDR3/DDR3L 1333/1600 MHz (i7/i5/i3)
- Supports DDR3/DDR3L 1066/1333/1600 MHz (i7 Quad Core)
• 2nd generation processors
- Supports DDR3 1066/1333 MHz (i7/i5/i3/Celeron)
- Supports DDR3 1066/1333/1600 MHz (i7 Quad Core)
•Supports dual channel memory interface
•Supports up to 16GB system memory
•DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered, nonECC
DDR3
SODIMM
DDR3
SODIMM
87.00
Channel A
1333/1600MHz
Processor
CORE CORE CORE
Channel B
1333/1600MHz
CORE
IMVP7
(Vcore,Vgfx)
PEG 16X LANES
117.00
121.00
0.00
4.00
76.00
Memory
Controller
FDI
SLP/LID
WDT
Serial Port 0/1
System Fan Embedded
PWM/TACH_IN
OS SUPPORT
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows XP Professional x86 & SP3 (32-bit)
TEMPERATURE
• 0oC to 60oC
HUMIDITY
• 5% to 90%
Model Name
LPC TPM
1.2 (Opt.)
DDI Port C
2
IC
DDI Port D
SM Bus
8bit DIO
DIO SMBus
HD Audio
USB 2.0 8x
2.00
0.00
SATA 2.0 4x
LVDS (Dual Channel)
0.00
12.50
70.20
14.00
CRT
CR960
DDI Port B/SDVO Port B
Controler
Backup
EEPROM
Panther Point
Mobile
Intel® QM77/HM76
Chipset
-
HM76
USB 3.0 4x
PCIe x1/ Lane 7
PCIe x1/ Lane 8
(Opt. share with on board LAN)
PCIe x1/Lanes 1~6
SPI Bus
125.00
87.00
SATA Ports 4
(Opt.)
SPI Flash
LAN Ports
SSD Chip
PCIe x1, Lane 8
Intel® GLAN
PHY 82579LM
95.00
87.00
POWER
• Input: 5VSB (option), 12V, VCC_RTC
PCB
• Dimensions: 95mm (3.74") x 125mm (4.9")
• Compliance: PICMG COM Express® R2.1 basic form factor, Type 6
Ordering Information
DMI x4
(Direct Media
Interface)
C/D
A/B
Bottom View
Fan
Temperature Memory
SSD
B
S
0
B: 0oC to 60oC
S: Socket
0:
2:
4:
8:
1:
3:
6:
Processors
None
2GB
4GB
8GB
16GB
32GB
64GB
3615QE
3rd Generation
3615QE: Intel® CoreTM i7-3615QE, 6M Cache, up to 3.30 GHz, 45W
3612QE: Intel® CoreTM i7-3612QE, 6M Cache, up to 3.10 GHz, 35W
3555LE: Intel® CoreTM i7-3555LE, 4M Cache, up to 3.20 GHz, 25W
3517UE: Intel® CoreTM i7-3517UE, 4M Cache, up to 2.80 GHz, 17W
3610ME: Intel® CoreTM i5-3610ME, 3M Cache, up to 3.30 GHz, 35W
3120ME: Intel® CoreTM i3-3120ME, 3M Cache, 2.40 GHz, 35W
3217UE: Intel® CoreTM i3-3217UE, 3M Cache, 1.60 GHz, 17W
1020E: Intel® CeleronTM 1020E, 2M Cache, 2.20 GHz, 35W
1047UE: Intel® CeleronTM 1047UE, 2M Cache, 1.40 GHz, 17W
927UE: Intel® CeleronTM 927UE, 1M Cache, 1.50 GHz, 17W
2nd Generation
2715QE: Intel® CoreTM i7-2715QE, 6M Cache, up to 3.00 GHz, 45W
2655LE: Intel® CoreTM i7-2655LE, 4M Cache, up to 2.90 GHz, 25W
2610UE: Intel® CoreTM i7-2610UE, 4M Cache, up to 2.40 GHz, 17W
2515E: Intel® CoreTM i5-2515E, 3M Cache, up to 3.10 GHz, 35W
2310E: Intel® CoreTM i3-2310E, 3M Cache, 2.10 GHz, 35W
2340UE: Intel® CoreTM i3-2340UE, 3M Cache, 1.30 GHz, 17W
810E: Intel® CeleronTM B810E, 2M Cache, 1.6GHz, 35W
847E: Intel® CeleronTM 847E, 2M Cache, 1.1GHz, 17W
827E: Intel® CeleronTM 827E, 1.5M Cache, 1.4GHz, 17W
807UE: Intel® CeleronTM 807UE, 1M Cache, 1.00 GHz, 10W
22.00
Heatsink
11.00
55.00
BIOS
• 64Mbit SPI BIOS
SERIAL ATA (SATA) INTERFACE
•Supports 4 Serial ATA interfaces
•2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
•Integrated Advanced Host Controller Interface (AHCI) controller
LPC Bus
53.00
EXPANSION INTERFACES
•Supports 4 USB 3.0 ports
•Supports 8 USB 2.0 ports
•Supports 1 PCIe x16 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports I2C interface
• Supports SMBus interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
ONBOARD
LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
3rd/2nd Generation
Intel® Core™ i7/i5/i3
Graphics
CORE
91.00
125.00
53.00
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
95.00 Top View
87.00
91.00
SSD (optional)
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
www.dfi.com
Heat spreader
Module PCB
Standoff
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 CR960 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• COM331-B carrier board kit
• COM101-BAT carrier board kit
• Heat spreader with heat sink and fan: 761-CR9601-000G
Modules
Mini
COM Express
Basic
121.00
117.00
87.00
4.00
0.00
4.00
0.00
0.00
CHIPSET
• Intel® HM76 Express Chipset
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000 (3rd generation processors)
• Intel® HD Graphics 3000 (2nd generation processors)
• Intel® HD Graphics (Intel® CeleronTM processors)
• Supports VGA, LVDS and DDI interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit,
resolution up to 1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP or SDVO (for Port B)
• HDMI, DVI, DP: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing - Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
• Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors
Block Diagram
4.00
TRUSTED PLATFORM MODULE (TPM) - optional
•Provides a Trusted PC for secure transactions
•Provides software license protection, enforcement and password
protection
Computer-On-Module
Mechanical Drawing
PROCESSOR
•BGA 1023 packaging technology
- 3rd generation Intel® CoreTM processors (22nm process technology)
- 2nd generation Intel® CoreTM processors (32nm process technology)
Please refer to the Ordering Information below
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
CR902-B
CR902-B
Features
QM77
BGA 1023
DDR3_2
SODIMM
Features
MEMORY
EXPANSION
2 DDR3/DDR3L SODIMM up to 16GB
1 PCIe x16, 1 PCIe x4 and 1 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 IDE
1 VGA, 1 LVDS, 2 DDI (HDMI/DVI/DP/SDVO)
8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
8-bit DIO
1 LAN
COM Express® R2.1 Basic, Type 2
95mm x 125mm (3.74" x 4.9")
DDR3_1
SODIMM
Intel QM77
LAN
DIMENSIONS
CPU Fan
DDR3/
DDR3L
8 DIO
GbE LAN
USB 2.0
SATA 3.0
121.00
117.00
87.00
0.00
4.00
4.00
0.00
4.00
0.00
•BGA 1023 packaging technology
- 3rd generation Intel® CoreTM processors (22nm process technology)
- 2nd generation Intel® CoreTM processors (32nm process technology)
Please refer to the Ordering Information below
CHIPSET
®
• Intel QM77 Express Chipset
SYSTEM MEMORY
•Two 204-pin DDR3/DDR3L SODIMM sockets
• 3rd generation processors
- Supports DDR3/DDR3L 1333/1600 MHz (i7/i5/i3)
- Supports DDR3/DDR3L 1067/1333/1600 MHz (i7 Quad Core)
• 2nd generation processors
- Supports DDR3 1066/1333 MHz (i7/i5/i3/Celeron)
- Supports DDR3 1066/1333/1600 MHz (i7 Quad Core)
•Supports dual channel memory interface
•Supports up to 16GB system memory
•DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies
are supported for x8 and x16 devices, unbuffered, non-ECC
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000 (3rd generation processors)
• Intel® HD Graphics 3000 (2nd generation processors)
• Intel® HD Graphics (Intel® CeleronTM processors)
• Supports LVDS, VGA and DDI interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit,
resolution up to 1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP or SDVO
• HDMI, DVI, DP, SDVO: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing - Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
• Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)
95.00
121.00
117.00
76.00
0.00
4.00
125.00
70.20
12.50
0.00
DDR3
SODIMM
0.00
2.00
DDR3
SODIMM
12.00
Channel A
1066/1333/1600
MHz
Channel B
1066/1333/1600
MHz
Processor
CORE CORE CORE
CORE
Graphics
CORE
CMOS
Backup EEPROM
Memory
Controller
3rd Gen Processors
Intel® FDI
(Flexible Display
Interface)
2nd Gen Processors
Bottom View
Port B: SDVO/
HDMI/DVI
SATA 2.0 2x, SATA 3.0 2x
53.00
LVDS (Dual Channel)
CRT
PCIe x1 5x
Mobile Intel® QM77
(CR902-B)
Mobile Intel® HM76
(CR902-BL)
PCIe x1
Lane 7
C/D
A/B
LPC Bus
USB 2.0 8x
PEG/SDVO/
HDMI/DP Mux
Port C: HDMI/DVI/DP
Multiplexer
Switch
SM Bus
HD Audio
PCIe to
PCI
PCI Bus
PCIe to
PATA
IDE Bus
2nd SPI Bus
LAN Ports
PCIe x1, Lane 8
PCIe x1
Lane 6
Intel® GLAN
PHY 82579LM
22.00
Heat spreader
Module PCB
11.00
54.60
20.00
Heat sink with fan
Standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Monitors CPU temperature and overheat alarm
Monitors CPU fan speed and failure alarm
Monitors Vcore/VCCRTC/DDR/+1.05V/VCCSA voltages and failure alarm
Watchdog timer function
BIOS
• 64Mbit SPI BIOS
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
TEMPERATURE
o
o
• 0 C to 60 C
POWER
PEG 16x LANES
DMI x4
(Direct Media
Interface)
•
•
•
•
• Input: 5VSB (option), 12V, VCC_RTC
PCB
• Dimensions: 95mm (3.74") x 125mm (4.9")
• Compliance: PICMG COM Express® R2.1 basic form factor, Type 2
CERTIFICATION
• CE, FCC Class B, RoHS
Ordering Information
IMVP7
(Vcore,Vgfx)
3rd/2nd Generation
Intel® Core™ i7/i5/i3
DAMAGE FREE INTELLIGENCE
ONBOARD LAN FEATURES
•Supports 4 Serial ATA interfaces
•2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
•Integrated Advanced Host Controller Interface (AHCI) controller
•Supports RAID 0/1/5/10
Ø2.70(*7 pcs)
• Supports up to two IDE devices
• DMA mode: Ultra ATA up to 100MB/s
• PIO mode: up to 16MB/s
• 10% to 90%
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
87.00
91.00
IDE INTERFACE
HUMIDITY
SERIAL ATA (SATA) INTERFACE
87.00
91.00
•Supports 8 USB 2.0 ports
•Supports 1 PCIe x16 interface (multiplex digital display interface)
•Supports 2 DDI (multiplex with PCIe x16)
- Port B for SDVO/HDMI/DVI
- Port C for HDMI/DVI/DisplayPort
• Supports 1 PCIe x4 and 1 PCIe x1 (default); or 5 PCIe x1 interfaces
• Supports 4 PCI interfaces (PCI 2.3 interface)
• Supports LPC interface
• Supports SMBus interface
• Supports IDE interface
• Supports 8-bit Digital I/O
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Top View
EXPANSION INTERFACES
Model Name
CR902-B3120ME
CR902-B810E
CR902-B847E
CR902-B827E
Part Number
777-CR9021-510G
777-CR9021-C10G
777-CR9021-D10G
777-CR9021-E10G
Description
Intel® CoreTM i3-3120ME, 3M Cache, 2.40 GHz, 35W
Intel® CeleronTM B810E, 2M Cache, 1.6GHz, 35W
Intel® CeleronTM 847E, 2M Cache, 1.1GHz, 17W
Intel® CeleronTM 827E, 1.5M Cache, 1.4GHz, 17W
The following processors will be available upon request. Please contact your sales representative for more information.
Model Name
Part Number
Description
CR902-B3615QE
777-CR9021-010G
Intel® CoreTM i7-3615QE, 6M Cache, up to 3.30 GHz, 45W
CR902-B3612QE
777-CR9021-110G
Intel® CoreTM i7-3612QE, 6M Cache, up to 3.10 GHz, 35W
CR902-B3555LE
777-CR9021-210G
Intel® CoreTM i7-3555LE, 4M Cache, up to 3.20 GHz, 25W
CR902-B3517UE
777-CR9021-310G
Intel® CoreTM i7-3517UE, 4M Cache, up to 2.80 GHz, 17W
CR902-B3610ME
777-CR9021-410G
Intel® CoreTM i5-3610ME, 3M Cache, up to 3.30 GHz, 35W
3rd Gen Processors
CR902-B3217UE
777-CR9021-G10G
Intel® CoreTM i3-3217UE, 3M Cache, 1.60 GHz, 17W
CR902-B1020E
777-CR9021-H10G
Intel® CeleronTM 1020E, 2M Cache, 2.20 GHz, 35W
CR902-B1047UE
777-CR9021-I10G
Intel® CeleronTM 1047UE, 2M Cache, 1.40 GHz, 17W
CR902-B927UE
777-CR9021-J10G
Intel® CeleronTM 927UE, 1M Cache, 1.50 GHz, 17W
CR902-B2715QE
777-CR9021-610G
Intel® CoreTM i7-2715QE, 6M Cache, up to 3.00 GHz, 45W
CR902-B2655LE
777-CR9021-710G
Intel® CoreTM i7-2655LE, 4M Cache, up to 2.90 GHz, 25W
CR902-B2610UE
777-CR9021-810G
Intel® CoreTM i7-2610UE, 4M Cache, up to 2.40 GHz, 17W
CR902-B2515E
777-CR9021-910G
Intel® CoreTM i5-2515E, 3M Cache, up to 3.10 GHz, 35W
2nd Gen Processors
CR902-B2310E
777-CR9021-A10G
Intel® CoreTM i3-2310E, 3M Cache, 2.10 GHz, 35W
CR902-B2340UE
777-CR9021-B10G
Intel® CoreTM i3-2340UE, 3M Cache, 1.30 GHz, 17W
CR902-B807UE
777-CR9021-F10G
Intel® CeleronTM 807UE, 1M Cache, 1.00 GHz, 10W
Packing List
• 1 CR902 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• COM330-B carrier board kit
• Heat spreader with heat sink and fan: 761-HR9020-300G
(CR902-B3120ME, CR902-B810E, CR902-B847E, CR902-B827E)
Modules
Mini
COM Express
Basic
Block Diagram
PROCESSOR
Computer-On-Module
Mechanical Drawing
Specifications
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
CR902-BL
CR902-BL
HM76
BGA 1023
DDR3_2
SODIMM
Features
MEMORY
EXPANSION
2 DDR3/DDR3L SODIMM up to 16GB
1 PCIe x16, 1 PCIe x4 and 1 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 IDE
1 VGA, 1 LVDS, 2 DDI (HDMI/DVI/DP/SDVO)
8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
8-bit DIO
1 LAN
COM Express® R2.1 Basic, Type 2
95mm x 125mm (3.74" x 4.9")
DDR3_1
SODIMM
Intel HM76
LAN
DIMENSIONS
CPU Fan
DDR3/
DDR3L
8 DIO
121.00
117.00
87.00
0.00
4.00
4.00
0.00
Top View
87.00
91.00
Ø2.70(*7 pcs)
DDR3
SODIMM
70.20
12.50
0.00
DDR3
SODIMM
0.00
2.00
Channel A
1066/1333/1600
MHz
Channel B
1066/1333/1600
MHz
Processor
CORE CORE CORE
Graphics
CORE
CMOS
Backup EEPROM
12.00
IMVP7
(Vcore,Vgfx)
3rd/2nd Generation
Intel® Core™ i7/i5/i3
Port B: SDVO/
HDMI/DVI
USB 2.0 8x
SATA 2.0 2x, SATA 3.0 2x
LVDS (Dual Channel)
53.00
CRT
PCIe x1 5x
Mobile Intel® QM77
(CR902-B)
Mobile Intel® HM76
(CR902-BL)
PCIe x1
Lane 7
PEG/SDVO/
HDMI/DP Mux
PCIe to
PCI
PCI Bus
PCIe to
PATA
IDE Bus
2nd SPI Bus
LAN Ports
PCIe x1, Lane 8
PCIe x1
Lane 6
Intel® GLAN
PHY 82579LM
22.00
Heat spreader
Module PCB
11.00
54.60
20.00
Heat sink with fan
Standoff
www.dfi.com
TEMPERATURE
• 0oC to 60oC
POWER
• Input: 5VSB (option), 12V, VCC_RTC
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
2nd Gen Processors
C/D
A/B
LPC Bus
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
ONBOARD
LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
3rd Gen Processors
Multiplexer
Switch
HD Audio
BIOS
• 64Mbit SPI BIOS
HUMIDITY
• 10% to 90%
PEG 16x LANES
®
Intel FDI
(Flexible Display
Interface)
SM Bus
Bottom View
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/VCCRTC/DDR/+1.05V/VCCSA voltages and failure
alarm
• Watchdog timer function
PCB
• Dimensions: 95mm (3.74") x 125mm (4.9")
• Compliance: PICMG COM Express® R2.1 basic form factor, Type 2
CERTIFICATION
• CE, FCC Class B, RoHS
Ordering Information
Memory
Controller
DMI x4
(Direct Media
Interface)
IDE INTERFACE
• Supports up to two IDE devices
• DMA mode: Ultra ATA up to 100MB/s
• PIO mode: up to 16MB/s
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
SERIAL ATA (SATA) INTERFACE
•Supports 4 Serial ATA interfaces
•2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
•Integrated Advanced Host Controller Interface (AHCI) controller
CORE
Port C: HDMI/DVI/DP
95.00
125.00
121.00
117.00
0.00
4.00
76.00
87.00
91.00
SYSTEM MEMORY
•Two 204-pin DDR3/DDR3L SODIMM sockets
• 3rd generation processors
- Supports DDR3/DDR3L 1333/1600 MHz (i7/i5/i3)
- Supports DDR3/DDR3L 1067/1333/1600 MHz (i7 Quad Core)
• 2nd generation processors
- Supports DDR3 1066/1333 MHz (i7/i5/i3/Celeron)
- Supports DDR3 1066/1333/1600 MHz (i7 Quad Core)
•Supports dual channel memory interface
•Supports up to 16GB system memory
•DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered,
non-ECC
EXPANSION INTERFACES
•Supports 8 USB 2.0 ports
•Supports 1 PCIe x16 interface (multiplex digital display interface)
•Supports 2 DDI (multiplex with PCIe x16)
- Port B for SDVO/HDMI/DVI
- Port C for HDMI/DVI/DisplayPort
• Supports 1 PCIe x4 and 1 PCIe x1 (default); or 5 PCIe x1 interfaces
• Supports 4 PCI interfaces (PCI 2.3 interface)
• Supports LPC interface
• Supports SMBus interface
• Supports IDE interface
• Supports 8-bit Digital I/O
Model Name
CR902-BL3120ME
CR902-BL810E
CR902-BL847E
CR902-BL827E
Part Number
777-CR9021-500G
777-CR9021-C00G
777-CR9021-D00G
777-CR9021-E00G
Description
Intel® CoreTM i3-3120ME, 3M Cache, 2.40 GHz, 35W
Intel® CeleronTM B810E, 2M Cache, 1.6GHz, 35W
Intel® CeleronTM 847E, 2M Cache, 1.1GHz, 17W
Intel® CeleronTM 827E, 1.5M Cache, 1.4GHz, 17W
The following processors will be available upon request. Please contact your sales representative for more information.
Model Name
Part Number
Description
CR902-BL3615QE
777-CR9021-000G
Intel® CoreTM i7-3615QE, 6M Cache, up to 3.30 GHz, 45W
CR902-BL3612QE
777-CR9021-100G
Intel® CoreTM i7-3612QE, 6M Cache, up to 3.10 GHz, 35W
CR902-BL3555LE
777-CR9021-200G
Intel® CoreTM i7-3555LE, 4M Cache, up to 3.20 GHz, 25W
CR902-BL3517UE
777-CR9021-300G
Intel® CoreTM i7-3517UE, 4M Cache, up to 2.80 GHz, 17W
CR902-BL3610ME 777-CR9021-400G
Intel® CoreTM i5-3610ME, 3M Cache, up to 3.30 GHz, 35W
3rd Gen Processors
CR902-BL3217UE
777-CR9021-G00G
Intel® CoreTM i3-3217UE, 3M Cache, 1.60 GHz, 17W
CR902-BL1020E
777-CR9021-H00G
Intel® CeleronTM 1020E, 2M Cache, 2.20 GHz, 35W
CR902-BL1047UE
777-CR9021-I00G
Intel® CeleronTM 1047UE, 2M Cache, 1.40 GHz, 17W
CR902-BL927UE
777-CR9021-J00G
Intel® CeleronTM 927UE, 1M Cache, 1.50 GHz, 17W
CR902-BL2715QE
777-CR9021-600G
Intel® CoreTM i7-2715QE, 6M Cache, up to 3.00 GHz, 45W
CR902-BL2655LE
777-CR9021-700G
Intel® CoreTM i7-2655LE, 4M Cache, up to 2.90 GHz, 25W
CR902-BL2610UE
777-CR9021-800G
Intel® CoreTM i7-2610UE, 4M Cache, up to 2.40 GHz, 17W
CR902-BL2515E
777-CR9021-900G
Intel® CoreTM i5-2515E, 3M Cache, up to 3.10 GHz, 35W
2nd Gen Processors
CR902-BL2310E
777-CR9021-A00G
Intel® CoreTM i3-2310E, 3M Cache, 2.10 GHz, 35W
CR902-BL2340UE
777-CR9021-B00G
Intel® CoreTM i3-2340UE, 3M Cache, 1.30 GHz, 17W
CR902-BL807UE
777-CR9021-F00G
Intel® CeleronTM 807UE, 1M Cache, 1.00 GHz, 10W
Packing List
• 1 CR902 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• COM330-B carrier board kit
• Heat spreader with heat sink and fan: 761-HR9020-300G
(CR902-BL3120ME, CR902-BL810E, CR902-BL847E, CR902-BL827E)
Modules
Mini
COM Express
Basic
Block Diagram
4.00
0.00
CHIPSET
• Intel® HM76 Express Chipset
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000 (3rd generation processors)
• Intel® HD Graphics 3000 (2nd generation processors)
• Intel® HD Graphics (Intel® CeleronTM processors)
• Supports LVDS, VGA and DDI interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit,
resolution up to 1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP or SDVO
• HDMI, DVI, DP, SDVO: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing - Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
• Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)
GbE LAN
USB 2.0
SATA 3.0
PROCESSOR
•BGA 1023 packaging technology
- 3rd generation Intel® CoreTM processors (22nm process technology)
- 2nd generation Intel® CoreTM processors (32nm process technology)
Please refer to the Ordering Information below
Computer-On-Module
Mechanical Drawing
Specifications
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
CR901-B
CR901-B
QM77
Socket G2
988B
DDR3_2
SODIMM
Features
MEMORY
EXPANSION
2 DDR3/DDR3L SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
1 VGA, 1 LVDS, 3 DDI (HDMI/DVI/DP/SDVO)
12 USB: 4 USB 3.0, 8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
DDR3_1
SODIMM
Intel QM77
CPU Fan
Specifications
LAN
DIMENSIONS
PROCESSOR
• Socket G2 988B for:
- 3rd Generation Intel® CoreTM processors (22nm process technology)
: Intel® Core™ i7-3610QE (6M Cache, up to 3.3 GHz); 45W
: Intel® Core™ i5-3610ME (3M Cache, up to 3.3 GHz); 35W
: Intel® Core™ i3-3120ME (3M Cache, 2.4 GHz); 35W
- 2nd Generation Intel® CoreTM processors (32nm process technology)
: Intel® Core™ i7-2710QE (6M Cache, up to 3.0 GHz); 45W
: Intel® Core™ i5-2510E (3M Cache, up to 3.1 GHz); 35W
: Intel® Core™ i3-2330E (3M Cache, 2.2 GHz); 35W
: Intel® Celeron® B810 (2M Cache, 1.6 GHz); 35W
CHIPSET
• Intel® QM77 Express chipset
SYSTEM MEMORY
• Two 204-pin SODIMM sockets
• Supports DDR3 SODIMM
121.00
117.00
87.00
0.00
4.08
• Supports DDR3L SODIMM
- 1066/1333MHz when operating at 1.35V
- 1066/1333/1600MHz when operating at 1.5V
•Supports dual channel memory interface
•Supports up to 16GB system memory
•DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered,
non-ECC
Ø2.70(*7 pcs)
91.00
87.00
87.00
95.00
43.67
Top View
76.00
37.41
0.00
4.08
117.00
0.00
4.00
DDR3
SODIMM
125.00
DDR3
SODIMM
Channel A
1066/1333/
1600MHz
Channel B
1066/1333/
1600MHz
Processor
CORE CORE CORE
CMOS Backup
EEPROM
Bottom View
SM Bus
CORE
3rd Generation;
Intel® Core™ i7/i5/i3
2nd Generation;
Intel® Core™ i7/i5/i3; Intel® Celeron™
Graphics
CORE
IMVP7
(Vcore,Vgfx)
PEG 16x LANES
Memory
Controller
DMI x4
(Direct Media
Interface)
SM Bus
HD Audio
BIOS
• 64Mbit SPI BIOS
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
DDI Port B/SDVO Port B
LPC Bus
14.00
DDI Port C
GPIO,WDT,I2C
(Embedded
Controller)
I2C Bus
WDT
95.00
87.00
4.00
LPC TPM 1.2
SLB9635(option)
8-bit DIO
DDI Port D
USB 2.0 8x
SATA 2.0 2x, SATA 3.0 2x
LVDS (Dual Channel)
Mobile Intel® QM77
Express Chipset
USB 3.0 4x
CRT
PCIe x1 Lane 7
PCIe x1, Lane 1~6
95.00
87.00
2nd SPI Bus
Serial Port1, 2 TX/RX
Sys FAN PWM/TACH_IN
4.00
LAN Ports
4.00
PCIe x1 Lane 8
(Opt. share with onboard LAN)
SATA Port4
PCIe x1, Lane 8
76.00
34.70
USB INTERFACE
• XHCI Host Controller supports up to 4 super speed USB 3.0 ports
2.00
1.60
CarrierBoard
Standoff
Heat spreader height: 11mm
Heat spreader with heat sink and fan height: 43mm
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
HUMIDITY
• 10% to 90%
POWER
• Input: 5VSB (option), 12V, VCC_RTC
PCB
•Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
•Compliance
- PICMG COM Express® R2.1, Type 6
CERTIFICATION
• CE, FCC Class B, UL, RoHS
SSD Chip
(option)
Ordering Information
Model Name
CR901-B
Part Number
777-CR9011-000G
Description
3rd/2nd generation Intel® CoreTM processors
Packing List
3.50
Module PCB The height of
the highest parts
POWER CONSUMPTION
• 63.06 W with i7-3610QE at 2.30GHz and 2x 2GB DDR3 SODIMM
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
Module PCB
24.70
36.70
Cooler
34.70
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
Intel® GLAN
PHY 82579LM
24.70
5.0 or 8.0 mm
C/D
0.00
12.50
70.20
A/B
2.00
0.00
DAMAGE FREE INTELLIGENCE
• Detects CPU temperature
• Detects CPU fan speed
• Detects Vcore/VGFX/DDR voltages
• Watchdog timer function
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000
• Supports VGA, LVDS and DDI interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit,
resolution up to 1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP and SDVO (for Port B)
• HDMI, DVI, DP: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing - Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0
ONBOARD LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
®
Intel FDI
(Flexible Display
Interface)
EXPANSION INTERFACES
•Supports 12 USB interfaces
- 4 USB 3.0
- 8 USB 2.0
•Supports 1 PCIe x16 interface
- Supports Gen 3.0 (3rd generation processors)
- Supports Gen 2.0 (2nd generation processors)
- Configurations (supported only via a riser card):
: One x8 (GFX) and two x4 (I/O)
: Two x8 (GFX, I/O)
: One x16 (GFX, I/O)
•Supports 1 PCIe x4 and 3 PCIe x1 (default); or 7 PCIe x1 interfaces
•Supports LPC interface
•Supports SMBus interface
•Supports I2C interface
•Supports 2 serial interfaces (TX/RX)
•Supports 4-bit input and 4-bit output GPIO
•
•
•
•
1
1
1
1
CR901-B board
Heat sink kit
QR (Quick Reference)
DVD
Optional Items
•
•
•
•
•
COM331-B carrier board kit
COM101-BAT carrier board kit
Heat spreader: TBD
Heat sink with fan: 761-111007-000G
Heat spreader with heat sink and fan: TBD
Modules
Mini
COM Express
Basic
Block Diagram
TRUSTED PLATFORM MODULE (TPM) - optional
•Provides a Trusted PC for secure transactions
•Provides software license protection, enforcement and password
protection
Computer-On-Module
Mechanical Drawing
3rd Generation Processors
2nd Generation Processors
DDR3 1066/1333/1600MHz
DDR3 1066/1333MHz (i5/i3/Celeron)
DDR3 1600MHz (i7)
SSD (optional)
• 4GB/8GB/16GB/32GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
CR900-B
CR900-B
QM77
Features
Socket G2 988B
DDR3_1
SODIMM
Specifications
MEMORY
EXPANSION
DDR3_2
SODIMM
Intel QM77
CPU Fan
PROCESSOR
• Socket G2 988B for:
- 3rd Generation Intel® CoreTM processors (22nm process technology)
: Intel® Core™ i7-3610QE (6M Cache, up to 3.3 GHz); 45W
: Intel® Core™ i5-3610ME (3M Cache, up to 3.3 GHz); 35W
: Intel® Core™ i3-3120ME (3M Cache, 2.4 GHz); 35W
- 2nd Generation Intel® CoreTM processors (32nm process technology)
: Intel® Core™ i7-2710QE (6M Cache, up to 3.0 GHz); 45W
: Intel® Core™ i5-2510E (3M Cache, up to 3.1 GHz); 35W
: Intel® Core™ i3-2330E (3M Cache, 2.2 GHz); 35W
: Intel® Celeron® B810 (2M Cache, 1.6 GHz); 35W
2 DDR3/DDR3L SODIMM up to 16GB
1 PCIe x16, 5 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 I2C, 1 IDE
1 VGA, 1 LVDS
8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
4-bit input and 4-bit output GPIO
1 LAN
COM Express® R2.1 Basic, Type 2
95mm x 125mm (3.74" x 4.9")
LAN
DIMENSIONS
CHIPSET
• Intel® QM77 Express Chipset
SYSTEM MEMORY
• Two 204-pin SODIMM sockets
• Supports DDR3 SODIMM
121.00
117.00
87.00
0.00
4.00
• Supports DDR3L SODIMM
- 1066/1333MHz when operating at 1.35V
- 1066/1333/1600MHz when operating at 1.5V
•Supports dual channel memory interface
•Supports up to 16GB system memory
•DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered,
non-ECC
91.00
87.00
91.00
87.00
95.00
43.67
0.00
4.00
Top View
0.00
4.00
76.00
37.41
0.00
4.00
121.00
117.00
125.00
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000
• Supports LVDS and VGA interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel: 36/48-bit, resolution
up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing - Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0
Channel A
1066/1333/
1600MHz
DDR3
SODIMM
Ø2.70(*7 pcs)
Channel B
1066/1333/
1600MHz
DDR3
SODIMM
Processor
CORE CORE CORE
CMOS Backup
EEPROM
SM Bus
Bottom View
CORE
IMVP7
(Vcore,Vgfx)
3rd Generation;
Intel® Core™ i7/i5/i3
2nd Generation;
Intel® Core™ i7/i5/i3; Intel® Celeron™
Graphics
CORE
PEG 16x LANES
Memory
Controller
DMI x4
(Direct Media
Interface)
Intel® FDI
(Flexible Display
Interface)
SM Bus
PCI Bus
HD Audio
LPC Bus
2.00
0.00
IDE Bus
USB 2.0 8x
SATA 2.0 2x, SATA 3.0 2x
95.00
87.00
4.00
PCIe x1,Lane 7
GPIO,WDT,I2C
(Embedded
Controller)
I2C Bus
WDT
0.00
12.50
70.20
34.70
LPC TPM 1.2
SLB9635(option)
8-bit DIO
LVDS (Dual Channel)
Mobile Intel® QM77
Express Chipset
PCIe to
PATA
JMB368
CRT
PCIe x1, Lane 1-5
PCIe x1, Lane 6
2nd SPI Bus
95.00
87.00
LAN Ports
PCIe x1, Lane 8
SATA Port4
Intel GLAN
PHY 82579LM
®
SSD Chip
(option)
C/D
A/B
14.00
IT8892E
PCIe to
PCI Bridge
EXPANSION INTERFACES
•Supports 8 USB 2.0/1.1 interfaces
•Supports 4 PCI slots (PCI 2.3 interface)
•Supports 1 PCIe x16 interface
- Supports Gen 3.0 (3rd generation processors)
- Supports Gen 2.0 (2nd generation processors)
- Configurations (supported only via a riser card):
: One x8 (GFX) and two x4 (I/O)
: Two x8 (GFX, I/O)
: One x16 (GFX, I/O)
•Supports 1 PCIe x1 and 1 PCIe x4 (default); or 5 PCIe x1 interfaces
•Supports LPC interface
•Supports SMBus interface
•Supports I2C interface
•Supports IDE interface
•Supports 4-bit input and 4-bit output GPIO
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature
• Monitors CPU fan speed
• Monitors Vcore/VGFX/DDR/1.05V/VCCSA voltages
• Watchdog timer function
BIOS
• 64Mbit SPI BIOS
POWER CONSUMPTION
• 59.78 W with i7-3610QE at 2.30GHz and 2x 1GB DDR3 SODIMM
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
ONBOARD LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
HUMIDITY
• 10% to 90%
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
POWER
• Input: 5VSB (option), 12V, VCC_RTC
PCB
•Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
•Compliance
- PICMG COM Express® R2.1, Type 2
CERTIFICATION
• CE
• FCC Class B
• RoHS
• UL
IDE INTERFACE
• Supports up to two IDE devices
• DMA mode: Ultra ATA up to 100MB/s
• PIO mode: up to 16MB/s
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
4.00
Ordering Information
4.00
76.00
Model Name
CR900-B
Cooler
36.70
34.70
24.70
2.00
1.60
Description
3rd/2nd generation Intel® CoreTM processors
Module PCB
3.50
Module PCB
The height of the
highest parts
standoff
CarrierBoard
5.0 or 8.0 mm
Heat spreader height: 11mm
Heat spreader with heat sink and fan height: 43mm
www.dfi.com
Part Number
777-CR9001-000G
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 CR900-B board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
•
•
•
•
COM330-B carrier board kit
Heat spreader: TBD
Heat sink with fan: 761-111007-000G
Heat spreader with heat sink and fan: TBD
Modules
Mini
COM Express
Basic
Block Diagram
TRUSTED PLATFORM MODULE (TPM) - optional
•Provides a Trusted PC for secure transactions
•Provides software license protection, enforcement and password
protection
Computer-On-Module
Mechanical Drawing
3rd Generation Processors
2nd Generation Processors
DDR3 1066/1333/1600MHz
DDR3 1066/1333MHz (i5/i3/Celeron)
DDR3 1600MHz (i7)
SSD (optional)
• 4GB/8GB/16GB/32GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
HR902-B
HR902-B
QM67
Features
DDR3_1
SODIMM
BGA 1023
MEMORY
EXPANSION
2 DDR3 SODIMM up to 16GB
1 PCIe x16, 1 PCIe x4 and 1 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 IDE
1 VGA, 1 LVDS, 2 DDI (HDMI/DVI/DP/SDVO)
8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
8-bit DIO
1 LAN
COM Express® R2.1 Basic, Type 2
95mm x 125mm (3.74" x 4.9")
DDR3_2
SODIMM
Intel QM67
LAN
DIMENSIONS
CPU fan
DDR3
8 DIO
GbE LAN
USB 2.0
SATA 3.0
121.00
117.00
87.00
0.00
4.00
4.00
0.00
4.00
0.00
SYSTEM MEMORY
• Two 204-pin DDR3 SODIMM sockets
• 3rd generation processors
- Supports DDR3/DDR3L 1333/1600 MHz (i7/i5/i3)
- Supports DDR3/DDR3L 1067/1333/1600 MHz (i7 Quad Core)
• 2nd generation processors
- Supports DDR3 1066/1333 MHz (i7/i5/i3/Celeron)
- Supports DDR3 1066/1333/1600 MHz (i7 Quad Core)
• Supports dual channel memory interface
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered,
non-ECC
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000 (3rd generation processors)
• Intel® HD Graphics 3000 (2nd generation processors)
• Intel® HD Graphics (Intel® CeleronTM processors)
• Supports LVDS, VGA and DDI interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit,
resolution up to 1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP or SDVO
• HDMI, DVI, DP, SDVO: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) support for accelerating video
processing
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
• Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)
125.00
121.00
117.00
0.00
4.00
76.00
87.00
91.00
ONBOARD
LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Top View
87.00
91.00
Ø2.70(*7 pcs)
DDR3
SODIMM
70.20
12.50
0.00
DDR3
SODIMM
0.00
2.00
Channel A
1066/1333/1600
MHz
Channel B
1066/1333/1600
MHz
Processor
CORE CORE CORE
CMOS
Backup EEPROM
12.00
IMVP7
(Vcore,Vgfx)
3rd/2nd Generation
Intel® Core™ i7/i5/i3
Graphics
CORE
Port B: SDVO/
HDMI/DVI
SATA 2.0 2x, SATA 3.0 2x
LVDS (Dual Channel)
CRT
PCIe x1 5x
Mobile Intel® QM67
(HR902-B)
Mobile Intel® HM65
(HR902-BL)
PEG/SDVO/
HDMI/DP Mux
PCIe x1
Lane 7
PCIe to
PCI
PCI Bus
PCIe to
PATA
IDE Bus
2nd SPI Bus
LAN Ports
PCIe x1, Lane 8
PCIe x1
Lane 6
Intel® GLAN
PHY 82579LM
22.00
Heat spreader
Module PCB
11.00
54.60
20.00
Heat sink with fan
Standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
2nd Gen Processors
C/D
A/B
LPC Bus
USB 2.0 8x
53.00
3rd Gen Processors
®
Multiplexer
Switch
HD Audio
Bottom View
PEG 16x LANES
Intel FDI
(Flexible Display
Interface)
SM Bus
EXPANSION INTERFACES
•Supports 8 USB 2.0 ports
•Supports 1 PCIe x16 interface (multiplex digital display interface)
•Supports 2 DDI (multiplex with PCIe x16)
- Port B for HDMI/DVI/SDVO
- Port C for HDMI/DVI/DisplayPort
• Supports 1 PCIe x4 and 1 PCIe x1 (default); or 5 PCIe x1 interfaces
• Supports 4 PCI interfaces (PCI 2.3 interface)
• Supports LPC interface
• Supports SMBus interface
• Supports IDE interface
• Supports 8-bit Digital I/O
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/VCCRTC/DDR/+1.05V/VCCSA
• Watchdog timer function
BIOS
• 64Mbit SPI BIOS
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
TEMPERATURE
• 0oC to 60oC
HUMIDITY
• 10% to 90%
POWER
• Input: 5VSB (option), 12V, VCC_RTC
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1 basic form factor, Type 2
CERTIFICATION
• CE, FCC Class B, RoHS
Ordering Information
Memory
Controller
DMI x4
(Direct Media
Interface)
SERIAL ATA (SATA) INTERFACE
•Supports 4 Serial ATA interfaces
•2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
•Integrated Advanced Host Controller Interface (AHCI) controller
•Supports RAID 0/1/5/10
CORE
Port C: HDMI/DVI/DP
95.00
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
IDE INTERFACE
• Supports up to two IDE devices
• DMA mode: Ultra ATA up to 100MB/s
• PIO mode: up to 16MB/s
Model Name
HR902-B3120ME
HR902-B810E
HR902-B847E
HR902-B827E
Part Number
777-HR9021-510G
777-HR9021-C10G
777-HR9021-D10G
777-HR9021-E10G
Description
Intel® CoreTM i3-3120ME, 3M Cache, 2.40 GHz, 35W
Intel® CeleronTM B810E, 2M Cache, 1.6GHz, 35W
Intel® CeleronTM 847E, 2M Cache, 1.1GHz, 17W
Intel® CeleronTM 827E, 1.5M Cache, 1.4GHz, 17W
The following processors will be available upon request. Please contact your sales representative for more information.
Model Name
Part Number
Description
HR902-B3615QE
777-HR9021-010G
Intel® CoreTM i7-3615QE, 6M Cache, up to 3.30 GHz, 45W
HR902-B3612QE
777-HR9021-110G
Intel® CoreTM i7-3612QE, 6M Cache, up to 3.10 GHz, 35W
HR902-B3555LE
777-HR9021-210G
Intel® CoreTM i7-3555LE, 4M Cache, up to 3.20 GHz, 25W
HR902-B3517UE
777-HR9021-310G
Intel® CoreTM i7-3517UE, 4M Cache, up to 2.80 GHz, 17W
HR902-B3610ME
777-HR9021-410G
Intel® CoreTM i5-3610ME, 3M Cache, up to 3.30 GHz, 35W
3rd Gen Processors
HR902-B3217UE
777-HR9021-G10G
Intel® CoreTM i3-3217UE, 3M Cache, 1.60 GHz, 17W
HR902-B1020E
777-HR9021-H10G
Intel® CeleronTM 1020E, 2M Cache, 2.20 GHz, 35W
HR902-B1047UE
777-HR9021-I10G
Intel® CeleronTM 1047UE, 2M Cache, 1.40 GHz, 17W
HR902-B927UE
777-HR9021-J10G
Intel® CeleronTM 927UE, 1M Cache, 1.50 GHz, 17W
HR902-B2715QE
777-HR9021-610G
Intel® CoreTM i7-2715QE, 6M Cache, up to 3.00 GHz, 45W
HR902-B2655LE
777-HR9021-710G
Intel® CoreTM i7-2655LE, 4M Cache, up to 2.90 GHz, 25W
HR902-B2610UE
777-HR9021-810G
Intel® CoreTM i7-2610UE, 4M Cache, up to 2.40 GHz, 17W
HR902-B2515E
777-HR9021-910G
Intel® CoreTM i5-2515E, 3M Cache, up to 3.10 GHz, 35W
2nd Gen Processors
HR902-B2310E
777-HR9021-A10G
Intel® CoreTM i3-2310E, 3M Cache, 2.10 GHz, 35W
HR902-B2340UE
777-HR9021-B10G
Intel® CoreTM i3-2340UE, 3M Cache, 1.30 GHz, 17W
HR902-B807UE
777-HR9021-F10G
Intel® CeleronTM 807UE, 1M Cache, 1.00 GHz, 10W
Packing List
• 1 HR902 board
• 1 QR (Quick Reference)
• 1 Drivers/utilities disk
Optional Items
• COM330-B carrier board kit
• Heat spreader with heat sink and fan: 761-HR9020-300G
(HR902-B3120ME, HR902-B810E, HR902-B847E, HR902-B827E)
Modules
Mini
COM Express
Basic
Block Diagram
PROCESSOR
•BGA 1023 packaging technology
- 3rd generation Intel® CoreTM processors (22nm process technology)
- 2nd generation Intel® CoreTM processors (32nm process technology)
Please refer to the Ordering Information below
CHIPSET
• Intel® QM67 Express Chipset
Computer-On-Module
Mechanical Drawing
Specifications
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
HR902-BL
HR902-BL
HM65
Features
DDR3_1
SODIMM
BGA 1023
MEMORY
EXPANSION
2 DDR3 SODIMM up to 16GB
1 PCIe x16, 1 PCIe x4 and 1 PCIe x1, 4 PCI
1 LPC, 1 SMBus, 1 IDE
1 VGA, 1 LVDS, 2 DDI (HDMI/DVI/DP/SDVO)
8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
8-bit DIO
1 LAN
COM Express® R2.1 Basic, Type 2
95mm x 125mm (3.74" x 4.9")
DDR3_2
SODIMM
Intel HM65
LAN
DIMENSIONS
CPU fan
DDR3
8 DIO
GbE LAN
USB 2.0
SATA 3.0
IDE INTERFACE
• Supports up to two IDE devices
• DMA mode: Ultra ATA up to 100MB/s
• PIO mode: up to 16MB/s
CHIPSET
• Intel® HM65 Express Chipset
EXPANSION INTERFACES
•Supports 8 USB 2.0 ports
•Supports 1 PCIe x16 interface (multiplex digital display interface)
•Supports 2 DDI (multiplex with PCIe x16)
- Port B for HDMI/DVI/SDVO
- Port C for HDMI/DVI/DisplayPort
• Supports 1 PCIe x4 and 1 PCIe x1 (default); or 5 PCIe x1 interfaces
• Supports 4 PCI interfaces (PCI 2.3 interface)
• Supports LPC interface
• Supports SMBus interface
• Supports IDE interface
• Supports 8-bit Digital I/O
Please refer to the Ordering Information below
SYSTEM MEMORY
• Two 204-pin DDR3 SODIMM sockets
• 3rd generation processors
- Supports DDR3/DDR3L 1333/1600 MHz (i7/i5/i3)
- Supports DDR3/DDR3L 1067/1333/1600 MHz (i7 Quad Core)
• 2nd generation processors
- Supports DDR3 1066/1333 MHz (i7/i5/i3/Celeron)
- Supports DDR3 1066/1333/1600 MHz (i7 Quad Core)
• Supports dual channel memory interface
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered,
non-ECC
121.00
117.00
87.00
0.00
4.00
4.00
0.00
95.00
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
Processor
Ø2.70(*7 pcs)
70.20
12.50
0.00
DDR3
SODIMM
DDR3
SODIMM
0.00
2.00
12.00
Channel A
1066/1333/1600
MHz
Channel B
1066/1333/1600
MHz
CORE CORE CORE
CORE
IMVP7
(Vcore,Vgfx)
3rd/2nd Generation
Intel® Core™ i7/i5/i3
Graphics
CORE
CMOS
Backup EEPROM
Memory
Controller
DMI x4
(Direct Media
Interface)
HD Audio
Port B: SDVO/
HDMI/DVI
USB 2.0 8x
SATA 2.0 2x, SATA 3.0 2x
53.00
CRT
PCIe x1 5x
Mobile Intel® QM67
(HR902-B)
Mobile Intel® HM65
(HR902-BL)
PCIe x1
Lane 7
PCIe to
PCI
PCI Bus
PCIe to
PATA
IDE Bus
2nd SPI Bus
LAN Ports
PCIe x1, Lane 8
PCIe x1
Lane 6
Intel® GLAN
PHY 82579LM
22.00
Heat spreader
Module PCB
11.00
54.60
20.00
Heat sink with fan
Standoff
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
2nd Gen Processors
PEG/SDVO/
HDMI/DP Mux
C/D
A/B
LPC Bus
LVDS (Dual Channel)
3rd Gen Processors
PEG 16x LANES
Multiplexer
Switch
BIOS
• 64Mbit SPI BIOS
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
TEMPERATURE
• 0oC to 60oC
HUMIDITY
• 10% to 90%
POWER
• Input: 5VSB (option), 12V, VCC_RTC
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1 basic form factor, Type 2
CERTIFICATION
• CE, FCC Class B, RoHS
Ordering Information
Intel® FDI
(Flexible Display
Interface)
SM Bus
Bottom View
www.dfi.com
SERIAL ATA (SATA) INTERFACE
•Supports 4 Serial ATA interfaces
•2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
•Integrated Advanced Host Controller Interface (AHCI) controller
87.00
91.00
Port C: HDMI/DVI/DP
125.00
121.00
117.00
0.00
4.00
76.00
87.00
91.00
ONBOARD
LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Top View
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/VCCRTC/DDR/+1.05V/VCCSA
• Watchdog timer function
Model Name
Part Number
HR902-BL3120ME
HR902-BL810E
HR902-BL847E
HR902-BL827E
777-HR9021-500G
777-HR9021-C00G
777-HR9021-D00G
777-HR9021-E00G
Description
Intel® CoreTM i3-3120ME, 3M Cache, 2.40 GHz, 35W
Intel® CeleronTM B810E, 2M Cache, 1.6GHz, 35W
Intel® CeleronTM 847E, 2M Cache, 1.1GHz, 17W
Intel® CeleronTM 827E, 1.5M Cache, 1.4GHz, 17W
The following processors will be available upon request. Please contact your sales representative for more information.
Model Name
Part Number
Description
HR902-BL3615QE
777-HR9021-000G
Intel® CoreTM i7-3615QE, 6M Cache, up to 3.30 GHz, 45W
HR902-BL3612QE
777-HR9021-100G
Intel® CoreTM i7-3612QE, 6M Cache, up to 3.10 GHz, 35W
HR902-BL3555LE
777-HR9021-200G
Intel® CoreTM i7-3555LE, 4M Cache, up to 3.20 GHz, 25W
HR902-BL3517UE
777-HR9021-300G
Intel® CoreTM i7-3517UE, 4M Cache, up to 2.80 GHz, 17W
HR902-BL3610ME
777-HR9021-400G
Intel® CoreTM i5-3610ME, 3M Cache, up to 3.30 GHz, 35W
3rd Gen Processors
HR902-BL3217UE
777-HR9021-G00G
Intel® CoreTM i3-3217UE, 3M Cache, 1.60 GHz, 17W
HR902-BL1020E
777-HR9021-H00G
Intel® CeleronTM 1020E, 2M Cache, 2.20 GHz, 35W
HR902-BL1047UE
777-HR9021-I00G
Intel® CeleronTM 1047UE, 2M Cache, 1.40 GHz, 17W
HR902-BL927UE
777-HR9021-J00G
Intel® CeleronTM 927UE, 1M Cache, 1.50 GHz, 17W
HR902-BL2715QE
777-HR9021-600G
Intel® CoreTM i7-2715QE, 6M Cache, up to 3.00 GHz, 45W
HR902-BL2655LE
777-HR9021-700G
Intel® CoreTM i7-2655LE, 4M Cache, up to 2.90 GHz, 25W
HR902-BL2610UE
777-HR9021-800G
Intel® CoreTM i7-2610UE, 4M Cache, up to 2.40 GHz, 17W
HR902-BL2515E
777-HR9021-900G
Intel® CoreTM i5-2515E, 3M Cache, up to 3.10 GHz, 35W
2nd Gen Processors
HR902-BL2310E
777-HR9021-A00G
Intel® CoreTM i3-2310E, 3M Cache, 2.10 GHz, 35W
HR902-BL2340UE
777-HR9021-B00G
Intel® CoreTM i3-2340UE, 3M Cache, 1.30 GHz, 17W
HR902-BL807UE
777-HR9021-F00G
Intel® CeleronTM 807UE, 1M Cache, 1.00 GHz, 10W
Packing List
• 1 HR902 board
• 1 QR (Quick Reference)
• 1 Drivers/utilities disk
Optional Items
• COM330-B carrier board kit
• Heat spreader with heat sink and fan: 761-HR9020-300G
(HR902-BL3120ME, HR902-BL810E, HR902-BL847E, HR902-BL827E)
Modules
Mini
COM Express
Basic
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000 (3rd generation processors)
• Intel® HD Graphics 3000 (2nd generation processors)
• Intel® HD Graphics (Intel® CeleronTM processors)
• Supports LVDS, VGA and DDI interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit,
resolution up to 1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DVI, DP or SDVO
• HDMI, DVI, DP, SDVO: resolution up to 1920x1200 @ 60Hz
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) support for accelerating video
processing
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
• Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)
Block Diagram
4.00
0.00
PROCESSOR
•BGA 1023 packaging technology
- 3rd generation Intel® CoreTM processors (22nm process technology)
- 2nd generation Intel® CoreTM processors (32nm process technology)
Computer-On-Module
Mechanical Drawing
Specifications
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
3rd/2nd Gen Intel® CoreTM
COM Express® Basic
HR900-B
HR900-B
QM67
Features
DDR3_1
SODIMM
Socket 988B
MEMORY
EXPANSION
PROCESSOR
• Socket G2 988B for:
- 3rd Generation Intel® CoreTM processors (22nm process technology)
: Intel® Core™ i7-3610QE (6M Cache, up to 3.3 GHz); 45W
: Intel® Core™ i5-3610ME (3M Cache, up to 3.3 GHz); 35W
: Intel® Core™ i3-3120ME (3M Cache, 2.4 GHz); 35W
- 2nd Generation Intel® CoreTM processors (32nm process technology)
: Intel® Core™ i7-2710QE (6M Cache, up to 3.0 GHz); 45W
: Intel® Core™ i5-2510E (3M Cache, up to 3.1 GHz); 35W
: Intel® Core™ i3-2330E (3M Cache, 2.2 GHz); 35W
: Intel® Celeron® B810 (2M Cache, 1.6 GHz); 35W
• Intel® Advanced Vector Extensions (Intel® AVX) Instructions
• Intel® Turbo Boost Technology
2 DDR3 SODIMM up to 16GB
5 PCIe x1, 1 PCIe x16, 4 PCI
1 LPC, 1 SMBus, 1 IDE
1 VGA, 1 LVDS, 2 DDI (HDMI/DP/SDVO)
Multiplex digital display with PCIe x16
8 USB 2.0
4 SATA: 2 SATA 3.0, 2 SATA 2.0
8-bit DIO
1 LAN
COM Express® R1.0 Basic, Type 2
95mm x 125mm (3.74" x 4.9")
DDR3_2
SODIMM
Intel QM67
Specifications
CPU fan
LAN
DIMENSIONS
CHIPSET
• Intel® QM67 Express Chipset
SYSTEM MEMORY
• Two 204-pin DDR3 SODIMM sockets
• Supports
DDR3 SODIMM
3rd Generation
Processors
2nd Generation Processors
121.00
117.00
87.00
0.00
4.00
• Supports dual channel memory interface
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered,
non-ECC
91.00
87.00
95.00
91.00
87.00
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics 4000 (3rd generation processors)
• Intel® HD Graphics 3000 (2nd generation processors)
• Intel® HD Graphics (Intel® Celeron® processors)
• Supports VGA, LVDS and DDI interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel - 36/48-bit,
resolution up to 1920x1200 @ 60Hz
• Digital Display Interfaces: HDMI, DP and SDVO (for Port B)
• HDMI, DP: resolution up to 1920x1200 @ 60Hz
• Supports 6 or 16 Graphics Execution Units (EUs) (3rd generation processors)
• Supports 6 or 12 Graphics Execution Units (EUs) (2nd generation processors)
• Intel® Clear Video Technology
• DirectX Video Acceleration (DXVA) support for accelerating
video processing
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors)
• Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors)
Top View
1
0.00
4.00
4.00
125.00
121.00
117.00
76.00
0.00
4.00
Ø2.70(*6 pcs)
DDR3
SODIMM
DDR3
SODIMM
Channel A
1066/1333/
1600MHz
Channel B
1066/1333/
1600MHz
Processor
CORE CORE CORE
IMVP7
(Vcore,Vgfx)
Intel® Core™ i7/i5/i3;
Intel® Celeron™
Graphics
CORE
PEG 16x LANES
Memory
Controller
DMI x4
(Direct Media
Interface)
Bottom View
CORE
Intel® FDI
(Flexible Display
Interface)
PEG/SDVO/
HDMI/DP Mux
SM Bus
SATA 2.0 2x, SATA 3.0 2x
LVDS (Dual Channel)
CRT
95.00
87.00
4.00
Port B: SDVO/HDMI
LPC Bus
USB 2.0 8x
PCIe x1 5x
Mobile Intel® QM67
(Platform
Controller Hub)
PCIe x1
Lane 5
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
C/D
0.00
12.50
70.20
A/B
2.00
0.00
34.60
Switch
HD Audio
14.00
Port C: HDMI/DP
0.00
PCIe to
PCI
PCI Bus
PCIe to
PATA
IDE Bus
8-bit DIO
95.00
87.00
LAN Ports
PCIe x1, Lane 8
PCIe x1
Lane 7
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
TEMPERATURE
• 0oC to 60oC
HUMIDITY
• 10% to 90%
POWER
• Input: 12V, 5VSB (optional), VCC_RTC
PCB
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R1.0, Type 2
CERTIFICATION
• CE, FCC Class B, UL, RoHS
1
Ordering Information
4.00
34.60
24.60
Part Number
777-HR9002-000G
Description
3rd/2nd generation Intel® CoreTM processors
Module PCB
Module PCB The height
of the highest parts
8.00
3.50
Carrier Board
Standoff
Heat spreader height: 11mm
Heat spreader with heat sink and fan height: 43mm
www.dfi.com
POWER CONSUMPTION
• 54.70 W with i7-2710QE at 2.10GHz and 2x 4GB DDR3 SODIMM
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 2 SATA 2.0 with data transfer rate up to 3Gb/s
2 SATA 3.0 with data transfer rate up to 6Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
Model Name
HR900-B
76.00
4.00
1.60
BIOS
• 64Mbit UEFI SPI BIOS
Intel® GLAN
PHY 82579LM
Cooler
2.00
ONBOARD LAN FEATURES
• Intel® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/VGFX/1.5V voltages and failure alarm
• Watchdog timer function
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 HR900-B board
• 1 QR (Quick Reference)
• 1 Drivers/utilities disk
Optional Items
•
•
•
•
COM630-B carrier board kit
Heat spreader: TBD
Heat sink with fan: A71-111009-001G
Heat spreader with heat sink and fan: TBD
Modules
Mini
COM Express
Basic
Block Diagram
DDR3 1066/1333MHz (i5/i3/Celeron)
DDR3 1600MHz (i7)
EXPANSION INTERFACES
• Supports 8 USB ports (USB 1.1/2.0 host controllers)
• Supports 4 PCI slots (PCI 2.3 interface)
• Supports PCIe x16 / SDVO / HDMI / Display Port switchable interface
- Uses QM67's DDI (Digital Display Interface) Port B for SDVO/ HDMI
and DDI Port C for Display Port / HDMI
- VBIOS default setting at Port C only; VBIOS settings modified
upon request
• Supports 1 PCIE x16 interface
- Supports Gen 3.0 (3rd generation processors)
- Supports Gen 2.0 (2nd generation processors)
• Supports 5 PCIE x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports IDE interface
• Supports 8-bit Digital I/O
Computer-On-Module
Mechanical Drawing
DDR3 1066/1333/1600MHz
IDE INTERFACE
• Supports up to two IDE devices
• DMA mode: Ultra ATA up to 100MB/s
• PIO mode: up to 16MB/s
AMD® Embedded R-Series
COM Express® Basic
AMD® Embedded R-Series
COM Express® Basic
CM960-B
CM960-B
R-Series
Features
PGA (FS1r2)
socket
DDR3_2
SODIMM
Coming Soon
AMD A70M
Specifications
MEMORY
EXPANSION
DDR3_1
SODIMM
CPU fan
LAN
DIMENSIONS
Availability: Mar 2014
SYSTEM MEMORY
•Two 204-pin DDR3 SODIMM sockets
•Supports DDR3 (1.5V), LVDDR3(1.35V), ULVDDR3 (1.25V) up to
1600MHz
•Supports dual channel memory interface
•Supports up to 16GB system memory
•DRAM device technologies: 1Gb, 2Gb, 4Gb and 8Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered,
non-ECC
121.00
117.00
87.00
50.80
0.00
4.00
LVDS (Dual Channel)
95.00
Top View
DDI Port 2
DP to LVDS
TRANSLATOR
CH7511B
Processor
DISPLAY Port
SWITCH
PI3VDP12412
0.00
4.00
0.00
4.00
CORE CORE CORE CORE
B
A
PCIe GEN2
(1x4 or 4x1)
GPP 0,1,2,3
125.00
DP0
0.00
4.00
76.00
121.00
117.00
CMOS Backup
EEPROM
Ø2.70(*7 pcs)
800~1600MT/s
AMD Embedded
R-Series APUs
Graphics
CORE
Memory
Controller
UNBUFFERED
DDR3 SODIMM 2x
DDI Port 1
DP2
DP1
UMI-Link x4
ONBOARD LAN FEATURES
• Intel® I210AT Gigabit Ethernet controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 5% to 90%
B
SM Bus
DDI Port 3
HD Audio
POWER
• Input: 12V, 5VSB (optional), VCC_RTC
SSD (optional)
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
PCB
•Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
•Compliance
- PICMG COM Express® R2.1, Type 6
TRUSTED PLATFORM MODULE (TPM) - optional
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password
protection
DISPLAY Port
SWITCH
PI3VDP12412
A
POWER CONSUMPTION
• TBD
OS SUPPORT
• TBD
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
PCIe GEN2 x8
BIOS
• 32Mbit SPI BIOS
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 4 SATA 3.0 with data transfer rate up to 6Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1
91.00
87.00
45.34
ONBOARD GRAPHICS FEATURES
• Supports DP, DP/LVDS and DP/VGA interfaces
•VGA: resolution up to 1920x1600 @ 60Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel: 36/48-bit, resolution
up to 1920x1200 @ 60 Hz
• DP: resolution up to 4096x2160 @ 30Hz
DAMAGE FREE INTELLIGENCE
• Monitors APU temperature
• Monitors APU fan speed
• Monitors APU_VDD/APU_VDDNB/APU_VDDIO_SUS/1V2/1V1 voltages
• Watchdog timer function
LPC Bus
I2C Bus/SM Bus
8-bit DIO
Embedded
Controller
IT8518E
LPC
TPM 1.2
SLB9635
(optional)
USB 3.0
USB_SS 0,1,2,3
Sys Fan
PWM/TACH
C/D
A/B
WDT
Serial Port1,
2 Tx/Rx
USB 2.0 8x
Coming Soon
SATA 3.0 4x
SSD Chip
(Optional)
Bottom View
LAN
14.00
2.00
0.00
SATA 4
AMD A70M FCH
PCIe GEN2 x1
GPP 1,2
PCIe GEN2 x1
Intel GbE
I210AT
GPP 0
SPI I/F
SPI ROM
SPI Bus
VGA
GPP 3
Ordering Information
Model Name
CM960
Chipset
-
A70M
SD Card I/F (Optional)
0.00
12.50
70.20
4.00
95.00
87.00
4.00
www.dfi.com
SSD
B
S
0
B: 0oC to 60oC
S: Socket
0:
2:
4:
8:
1:
3:
6:
Processors
- 464L
464L: AMD® R-464L, Quad Core, 2x 2M Cache, up to 3.2GHz, 35W
460H: AMD® R-460H, Quad Core, 2x 2M Cache, up to 2.8GHz, 35W
460L: AMD® R-460L, Quad Core, 2x 2M Cache, up to 2.8GHz, 25W
452L: AMD® R-452L, Qual Core, 2x 2M Cache, up to 2.4GHz, 19W
260H: AMD® R-260H, Dual Core, 2M Cache, up to 2.6GHz, 17W
252F: AMD® R-252F, Dual Core, 1M Cache, up to 2.4GHz, 17W
None
2GB
4GB
8GB
16GB
32GB
64GB
Packing List
95.00
87.00
34.20
Temperature Memory
• 1 CM960-B board
• 1 QR (Quick Reference)
• 1 DVD
4.00
76.00
83.00
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Heat sink with fan
Optional Items
•
•
•
•
•
COM331-B carrier board kit
COM101-BAT carrier board kit
Heat spreader: TBD
Heat spreader with heat sink and fan: TBD
Heat sink with fan: TBD
Modules
Mini
COM Express
Basic
Block Diagram
91.00
87.00
EXPANSION INTERFACES
•Supports 8 USB 2.0 ports (first 4 USB ports support up to USB 3.0)
•Supports 1 PCIe x8 interface
•Supports 7 PCIe x1 interfaces (the first 4 PCIe x1 can be configured
to support PCIe x4)
•Supports LPC interface
•Supports SMBus interface
•Supports I2C interface
•Supports 2 serial interfaces (TX/RX)
•Supports 8-bit Digital I/O (4 In, 4 Out)
Computer-On-Module
RAID
USB 3.0
SATA 3.0
Optional
USB INTERFACE
• XHCI Host Controller supports up to 4 super speed USB 3.0 ports
CHIPSET
• AMD® A70M Fusion Controller Hub
R2.1
Type6
SSD
Mechanical Drawing
APU
• AMD® Embedded R-Series APUs
• FP2 BGA packaging technology
• 32nm process technology
Please refer to the Ordering Information below
2 DDR3 SODIMM up to 16GB
1 PCIe x8, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
3 Independent Displays
1 DP, 1 DP/LVDS, 1 DP/VGA
8 USB: 4 USB 3.0, 4 USB 2.0
4 SATA 3.0
SSD (optional)
8-bit DIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
AMD® Embedded R-Series
COM Express® Basic
AMD® Embedded R-Series
COM Express® Basic
CM901-B
CM901-B
R-Series
Features
PGA (FS1r2)
socket
DDR3_2
SODIMM
Specifications
MEMORY
EXPANSION
AMD A70M
DDR3_1
SODIMM
CPU fan
LAN
DIMENSIONS
Optional
RAID
USB 3.0
SATA 3.0
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
95.00
Top View
ONBOARD LAN FEATURES
• Intel® 82574L Gigabit Ethernet controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
0.00
4.00
0.00
4.00
125.00
121.00
117.00
0.00
4.00
76.00
LVDS (Dual Channel)
DDI Port 2
Ø2.70(*7 pcs)
DP to LVDS
TRANSLATOR
CH7511B
Processor
CORE CORE CORE CORE
B
A
DISPLAY Port
SWITCH
PI3VDP12412
DP0
PCIe GEN2
(1x4 or 4x1)
GPP 0,1,2,3
CMOS Backup
EEPROM
Bottom View
SM Bus
800~1600MT/s
AMD Embedded
R-Series APUs
Graphics
CORE
Memory
Controller
UNBUFFERED
DDR3 SODIMM 2x
SSD (optional)
• 4GB/8GB/16GB/32GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
PCIe GEN2 x16
DDI Port 1
DP2
DP1
UMI-Link x4
DISPLAY Port
SWITCH
PI3VDP12412
A
USB INTERFACE
• XHCI Host Controller supports up to 4 super speed USB 3.0 ports
B
SM Bus
DDI Port 3
HD Audio
LPC Bus
14.00
2.00
0.00
8-bit DIO
I2C Bus
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
LPC
TPM 1.2
SLB9635
(option)
USB 3.0
USB_SS 0,1,2,3
Sys Fan
PWM/TACH
BIOS
• 32Mbit SPI BIOS
POWER CONSUMPTION
• 31.12 W with R-464L at 2.3GHz and 2x 1GB DDR3 SODIMM
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -40oC to 85oC
HUMIDITY
• 10% to 90%
POWER
• Input: 12V, 5VSB (optional), VCC_RTC
PCB
•Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
•Compliance
- PICMG COM Express® R2.1, Type 6
CERTIFICATION
• CE
• FCC Class B
• RoHS
C/D
A/B
0.00
12.50
70.20
Embedded
Controller
Serial Port1, IT8518E
2 Tx/Rx
WDT
SERIAL ATA (SATA) INTERFACE
• Supports 4 Serial ATA interfaces
• 4 SATA 3.0 with data transfer rate up to 6Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1
DAMAGE FREE INTELLIGENCE
• Monitors APU temperature
• Monitors APU fan speed
• Monitors APU_VDD/APU_VDDNB/APU_VDDIO_SUS/1V2/1V1 voltages
• Watchdog timer function
USB 2.0 8x
4.00
34.20
95.00
87.00
SATA 3.0 4x
SSD Chip
(Optional)
LAN
SATA 4
AMD A70M FCH
PCIe GEN2 x1
GPP 1,2
PCIe GEN2 x1
Intel GbE
LAN82574L
GPP 3
GPP 0
SPI I/F
SPI ROM
SPI Bus
95.00
87.00
VGA
SD Card I/F (Optional)
Ordering Information
4.00
4.00
76.00
83.00
Model Name
CM901-B
34.20
24.20
Heat sink with fan
2.00
Module PCB
3.50
Module PCB
The height
of the highest parts
8.00
1.60
Standoff
Carrier Board
Heat spreader height: 11mm
Heat spreader with heat sink and fan height: 53mm
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Part Number
777-CM9011-000G
Description
AMD® Embedded R-Series APUs
Packing List
• 1 CM901-B board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
•
•
•
•
•
COM331-B carrier board kit
COM101-BAT carrier board kit
Heat spreader: TBD
Heat spreader with heat sink and fan: TBD
Heat sink with fan: TBD
Modules
Mini
COM Express
Basic
121.00
117.00
87.00
50.80
0.00
4.00
ONBOARD GRAPHICS FEATURES
• Supports DP, DP/LVDS and DP/VGA interfaces
•VGA: resolution up to 1920x1600 @ 60Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel: 36/48-bit, resolution
up to 1920x1200 @ 60 Hz
• DP: resolution up to 4096x2160 @ 30Hz
91.00
87.00
45.34
SYSTEM MEMORY
•Two 204-pin DDR3 SODIMM sockets
•Supports DDR3 (1.5V), LVDDR3(1.35V), ULVDDR3 (1.25V) up to
1600MHz
•Supports dual channel memory interface
•Supports up to 16GB system memory
•DRAM device technologies: 1Gb, 2Gb, 4Gb and 8Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuffered,
non-ECC
EXPANSION INTERFACES
•Supports 8 USB 2.0 ports (first 4 USB ports support up to USB 3.0)
•Supports 1 PCIe x16 interface
•Supports 7 PCIe x1 interfaces (the first 4 PCIe x1 can be configured
to support PCIe x4)
•Supports LPC interface
•Supports SMBus interface
•Supports I2C interface
•Supports 2 serial interfaces (TX/RX)
•Supports 8-bit Digital I/O (4 In, 4 Out)
Computer-On-Module
Block Diagram
91.00
87.00
TRUSTED PLATFORM MODULE (TPM) - optional
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password
protection
CHIPSET
• AMD® A70M Fusion Controller Hub
R2.1
Type6
SSD
Mechanical Drawing
APU
• AMD® Embedded R-Series APUs
: R-464L Quad-core 2.3GHz, 35W
: R-460H Quad-core 1.9GHZ, 35W
: R-272F Dual-core 2.7GHz, 35W
: R-268D Dual-core 2.5GHz, 35W
• PGA (FS1r2) socket
• 32nm process technology
2 DDR3 SODIMM up to 16GB
1 PCIe x16, 7 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 2 serial
3 Independent Displays
DP, DP/LVDS, DP/VGA
8 USB: 4 USB 3.0/2.0, 4 USB 2.0
4 SATA 3.0
8-bit DIO
1 LAN
COM Express® R2.1 Basic, Type 6
95mm x 125mm (3.74" x 4.9")
Carrier Board COM Express®
Carrier Board COM Express®
Module and Carrier Board Matrix
Carrier Board
COM100-B
COM331-B
COM330-B
COM630-B
Display
VGA, DisplayPort,
LVDS
DisplayPort, LVDS
VGA, DisplayPort,
LVDS
VGA, LVDS
VGA, LVDS
1
1
1
1
1
USB 3.0
2 Rear
2 Rear
4 Rear
N/A
N/A
USB 2.0
4 Rear
4 Rear
4 Rear
4 Rear,
4 by pin header
4 Rear, 4 by pin header
RS232/422/485
N/A
N/A
N/A
N/A
N/A
RS232
N/A
2 Rear
1 Rear,
1 by pin header
3 Rear,
1 by pin header
3 Rear, 1 by pin header
N/A
N/A
N/A
N/A
1
SATA 3.0
1
1
2
2
N/A
SATA 2.0
N/A
N/A
2
2
4
SSD
N/A
N/A
N/A
N/A
N/A
IDE, FDD
N/A
N/A
N/A
N/A
1 IDE, 1 FDD
CF
N/A
N/A
N/A
1
1
PCIe x16
N/A
N/A
1
1
1
PCIe x4
N/A
N/A
1
1
N/A
PCIe x1
1
1
2
N/A
2
Mini PCIe
2
3
1
1
N/A
N/A
N/A
N/A
2
8-bit
8-bit
8-bit
HDA
HDA
LPC
Yes
SMBus
Ethernet
USB
Serial
Parallel
Model
COM331-B
COM330-B
COM630-B
Mini-ITX
Mini-ITX
microATX
microATX
ATX
R2.1, Type 6
R2.1, Type 10
R2.0, Type 6
R2.1, Type 2
R1.0, Type 2
Type
BT9A3
R2.1, Type 10
●
CD9A3
R2.1, Type 10
●
HU968
R2.1, Type 6
●
●
CR908-B
R2.1, Type 6
●
●
HR908-B
R2.1, Type 6
●
●
CP908-B
R1.0, Type 2
Mini
Compact BT968
R2.1, Type 6
●
●
●
●
●
CD905-B
R2.0, Type 2
LR905-B18
R1.0, Type 2
KB968
R2.1, Type 6
OT905-B
R2.0, Type 2
HM961-QM87
R2.1, Type 6
●
●
HM960-QM87
R2.1, Type 6
●
●
HM920-QM87
R2.1, Type 2
HM961-HM86
R2.1, Type 6
●
●
HM960-HM86
R2.1, Type 6
●
●
HM920-HM86
R2.1, Type 2
4
CR960-QM77
R2.1, Type 6
●
●
8-bit
8-bit
CR960-HM76
R2.1, Type 6
●
●
HDA
HDA
HDA
CR902-B
R2.1, Type 2
●
Yes
Yes
Yes
Yes
CR902-BL
R2.1, Type 2
●
Yes
Yes
Yes
Yes
N/A
CR901-B
R2.1, Type 6
CAN-bus
N/A
N/A
N/A
N/A
N/A
CR900-B
R2.1, Type 2
●
HR902-B
R2.1, Type 2
ExpressCard
N/A
Yes
Yes
Yes
N/A
●
HR902-BL
R2.1, Type 2
●
Watchdog
N/A
Yes
N/A
N/A
Yes
HR900-B
R1.0, Type 2
●
Power Input
DC-in
DC-in
24-pin ATX
24-pin ATX
24-pin ATX
CP900-B
R1.0, Type 2
●
Compliance
R2.1, Type 6
R2.1, Type 10
R2.0, Type 6
R2.0, Type 2
R1.0, Type 2
CM960-B
R2.1, Type 6
●
●
Dimensions
170mm x 170mm
170mm x 170mm
244mm x 244mm
244mm x 244mm
305mm x 244mm
CM901-B
R2.1, Type 6
●
●
Storage
Expansion
PCI
Digital I/O
Audio
Controller
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
●
●
●
●
●
●
Basic
●
●
Modules
Carrier
Board Mini
COM101-BAT
COM100-B
Computer-On-Module
Model
COM101-BAT
COM Express® Carrier Board
COM Express® Carrier Board
COM101-BAT
COM101-BAT
Features
USB 2.0 LAN
Line-in/
Surround
Line-out
Specifications
ONBOARD GRAPHICS FEATURES
•Display ports
- 1 DisplayPort
- 1 VGA
- 1 24-bit dual channel LVDS
EXPANSION
VGA
Mic-in/
Center+Subwoofer
DC-in jack
USB 3.0
DisplayPort
SMBus
I2C
LPC
Smart
Battery 2
PCIe x1
Smart
Battery 1
SATA 3.0
1 PCIe x1
2 Mini PCIe
1 SIM
DISPLAY OUTPUTS 1 DisplayPort
1 VGA
1 LVDS
LAN
1 LAN
USB
6 USB: 2 USB 3.0, 4 USB 2.0
STORAGE
1 SATA 3.0
DIO
8-bit DIO
DIMENSIONS
170mm x 170mm (6.7" x 6.7")
Supports Compact and Basic modules
COM Express
connector
Compact
LVDS LCD
Panel
DIO
Basic
SIM
GLAN
PCIE x1
Audio
Audio Codec
LPC
Front Audio
SATA 3.0
Smart Charger
47.37
TYPE 6
PCIE 2
USB 7
PCIE/USB 8
Connector
Row AB
Charger Status
GPIO
SM Bus
SYS Fan
110.87
118.13
121.87
127.10
151.87
SATA
USB 2.0 4x
HUMIDITY
• 10% to 90%
DIGITAL I/O
• 8-bit Digital I/O connector
- 4-bit GPI (General Purpose Input)
- 4-bit GPO (General Purpose Output)
POWER OUTPUT
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, 5V, VCC_RTC (AT mode)
12V, VCC_RTC (AT mode)
REAR PANEL I/O PORTS
• 19V DC-in jack
• 1 DisplayPort
• 1 RJ45 LAN port
• 2 USB 3.0 ports
• 4 USB 2.0 ports
• 1 VGA port
• Line-in/Surround, Line out, Mic-in/Center+Subwoofer jacks
PCB
• Dimensions
- Mini-ITX form factor
- 170mm (6.7") x 170mm (6.7")
• Compliance
- PICMG COM Express® R2.1, Type 6
Connector
Row CD
USB 3.0 2x
DisplayPort
LVDS
VGA
SPI
SLP & LID
159.84
163.65
157.48
111.92
104.78
80.63
71.92
24.92
0.00
6.35
www.dfi.com
STORAGE
• 1 SATA 3.0 port with data transfer rate up to 6Gb/s
TYPE 6
Mini PCIE x1
(SIM)
Mini PCIE x1
(mSATA Opt.)
151.87
154.94
159.84
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
GPIO
93.93
105.07
110.87
ONBOARD USB FEATURES
•2 USB 3.0 ports
•4 USB 2.0 ports
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
•
•
•
•
•
•
1
1
1
1
1
1
COM101-BAT board
SATA data cable
SATA power cable
I/O shield
QR (Quick Reference)
DVD
Optional Items
•
•
•
•
SATA data cable
Serial ATA power cable
I/O shield
Power adapter (60W, 12V) : 671-106002-102G
Modules
Carrier
Board Mini
157.48
151.76
123.38
111.92
94.89
73.83
71.92
54.83
38.92
26.92
24.92
21.23
0.00
10.16
0.00
22.86
ROM INTERFACE
• 1 SPI interface
- Supports up to 64Mbit
I/O CONNECTORS
• 2 3-pin connector for general purpose serial interface (Type 6)
• 1 LVDS LCD panel connector
• 1 LCD/inverter power connector
• 1 8-bit Digital I/O connector
• 1 front audio connector for line-out and mic-in jacks
• 1 S/PDIF connector
• 1 SATA 3.0 port
• 1 SATA power connector
• 2 Smart battery charger connectors
• 1 LPC connector
• 1 I2C connector
• 1 SMBus connector
• 1 front panel connector
• 1 fan connector
Block Diagram
10.16
ONBOARD AUDIO FEATURES
•Realtek ALC886 7.1-channel High Definition Audio
•Audio outputs: Mic-in/Center+Subwoofer, line-in/surround and
line out
•S/PDIF audio interface
Computer-On-Module
Mechanical Drawing
EXPANSION SLOTS
• 1 PCIe x1 slot (PCIe 2.0)
• 2 Mini PCIe slots (PCIe 2.0)
- 1 slot supports PCIe and USB signals for 3G module
- 1 slot supports PCIe, USB or mSATA signal
- Supports half/full size Mini PCIe card
• 1 SIM card socket
COM Express® Carrier Board
COM Express® Carrier Board
COM100-B
USB 2.0
Line-in/
Surround
COM100-B
LAN
Features
COM 1
Specifications
ONBOARD GRAPHICS FEATURES
•Display ports
- 1 DisplayPort
- 1 24-bit single channel LVDS
EXPANSION
Line-out
Mic-in/
Center+Subwoofer
DC-in jack
USB 3.0
DisplayPort
COM 2
LPC
PCIe x1
SATA Power
1 PCIe x1
3 Mini PCIe
1 SIM
DISPLAY OUTPUTS 1 DisplayPort
1 LVDS
LAN
1 LAN
COM
2 COM
USB
6 USB: 2 USB 3.0, 4 USB 2.0
STORAGE
1 SATA 3.0
DIO
8-bit DIO
DIMENSIONS
170mm x 170mm (6.7" x 6.7")
ONBOARD AUDIO FEATURES
•Realtek ALC886 7.1-channel High Definition Audio
•Audio outputs: Mic-in/Center+Subwoofer, line-in/surround and
line out
•S/PDIF audio interface
ONBOARD USB FEATURES
•2 USB 3.0 ports
•4 USB 2.0 ports
SMBus
SATA 3.0
Charger
connector
Mini
DIO
COM Express
connector
PCIe x1 and
USB signal
8 DIO
1 SATA
7 USB
SIM slot
STORAGE
• 1 SATA 3.0 port with data transfer rate up to 6Gb/s
2 COM
DIGITAL I/O
• 8-bit Digital I/O connector
- 4-bit GPI (General Purpose Input)
- 4-bit GPO (General Purpose Output)
I2C
LVDS LCD
Panel
Supports Mini modules
System Fan
PCIe x1/
mSATA signal
Serial Interface
Block Diagram
151.76
163.65
124.83
94.89
73.83
54.83
21.23
0.00
6.35
PCIE x1
GLAN
PCIE
Audio Codec
10.16
0.00
SATA 3.0
22.86
SMBus
USB
TYPE 10
PCIE
USB
PCIE
44.14
Smart Charger
I2C
91.14
Connector
Row AB
SATA
Serial Port 2x
Mini PCIE x1
DAMAGE FREE INTELLIGENCE
•Legacy Super I/O support (option)
- Monitors 5V/1.5V/12V/3.3V
- Monitors SIO_Fan
ROM INTERFACE
• 1 SPI interface
- Supports up to 64Mbit
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 10% to 90%
POWER OUTPUT
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, 5V, VCC_RTC (AT mode)
12V, VCC_RTC (AT mode)
PCB
• Dimensions
- Mini-ITX form factor
- 170mm (6.7") x 170mm (6.7")
• Compliance
- PICMG COM Express® R2.1, Type 10
Mini PCIE x1
Mini PCIE x1
(mSATA Opt.)
USB 2.0 4x
LVDS
GPIO
SYS Fan
LPC Super IO
Display Port
163.65
157.48
www.dfi.com
110.21
34.21
154.94
159.84
SLP & LID
COM 2x
USB 3.0 2x
LPC
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
Fan
•
•
•
•
•
•
1
1
1
1
1
1
COM100-B board
SATA data cable
SATA power cable
I/O shield
QR (Quick Reference)
DVD
Optional Items
•
•
•
•
SATA data cable
Serial ATA power cable
I/O shield
Power adapter (60W, 12V) : 671-106002-102G
Modules
Carrier
Board Mini
Mechanical Drawing
I/O CONNECTORS
• 1 serial interface for 2 serial ports (TX/RX)
• 1 LVDS LCD panel connector
• 1 LCD/inverter power connector
• 1 8-bit Digital I/O connector
• 1 front audio connector for line-out and mic-in jacks
• 1 S/PDIF connector
• 1 SATA 3.0 port
• 1 SATA power connector
• 1 Smart battery charger connector
• 1 LPC connector
• 1 I2C connector
• 1 SMBus connector
• 1 front panel connector
• 2 fan connectors
SUPPORTED COM EXPRESS MODULE
• Mini form factor
Computer-On-Module
REAR PANEL I/O PORTS
• 5V~19V DC-in jack
• 2 DB-9 RS232 serial ports
• 1 DisplayPort
• 1 RJ45 LAN port
• 2 USB 3.0 ports
• 4 USB 2.0 ports
• Line-in/Surround, Line out, Mic-in/Center+Subwoofer jacks
LCD/inverter Power
PCIe x1, USB and
3G signal
EXPANSION SLOTS
• 1 PCIe x1 slot (PCIe 2.0)
• 3 Mini PCIe slots (PCIe 2.0)
- 1 slot supports PCIe and USB signals for 3G module
- 1 slot supports PCIe and USB signals
- 1 slot supports PCIe or mSATA signal
- Supports half/full size Mini PCIe card
• 1 SIM card socket
COM Express® Carrier Board
COM Express® Carrier Board
COM331-B
COM331-B
USB 2.0
LAN
Line-in
Features
COM1
Line-out
Mic-in
USB 3.0
DisplayPort 2
VGA
DisplayPort 1
USB 3.0
SATA 2.0
PCIe x1
PCIe x1
SATA 3.0
PCIe x4
PCIe x16
COM2
COM Express
connector
Specifications
EXPANSION
1 PCIe x16, 1 PCIe x4, 2 PCIe x1
1 Mini PCIe (PCIe signal only)
DISPLAY OUTPUTS 1 VGA, 3 DisplayPorts, 1 LVDS
LAN
1 LAN
COM
2 COM
USB
8 USB: 4 USB 3.0, 4 USB 2.0
STORAGE
4 SATA: 2 SATA 3.0, 2 SATA 2.0
1 SDIO
DIO
8-bit DIO
DIMENSIONS
244mm x 244mm (9.6" x 9.6")
SIO _Fan 1
LVDS LCD
Panel
LVDS/inverter
power
Supports Compact and Basic modules
Compact
Basic
Mini PCIe
SMBus
REAR PANEL I/O PORTS
• 1 DB-9 RS232 serial port
• 1 DB-15 VGA port
• 2 DisplayPorts
• 1 RJ45 LAN port
• 4 USB 3.0 ports
• 4 USB 2.0 ports
• Line-in/Surround, Line out, Mic-in/Center+Subwoofer jacks
DIO
SDIO
SIO_Fan 2
System fan
+12V power
ATX power
Display Port 3
Serial Interface
Serial Interface
GLAN
209.55
203.20
197.48
171.72
137.63
110.63
63.51
82.61
47.28
45.72
26.97
6.65
0.00
13.67
34.29
10.16
Audio Codec
10.16
0.00
PCIe 6x
TYPE 6
USB 2.0 8x
1
2
1
22.86
SATA 3.0 2x
LVDS
Connector
Row
A+B
VGA
SATA 2.0 2x
46.94
GPIO
58.59
A32
A31
B31
B32
71.09
DAMAGE FREE INTELLIGENCE
•Legacy Super I/O support (option)
- Monitors 5V/1.5V/12V/3.3V
- Monitors SIO_Fan 1/SIO_Fan 2/System fan
ROM INTERFACE
• 1 SPI interface
- Supports up to 64Mbit
• 1 LPC/FWH interface
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 10% to 90%
POWER OUTPUT
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, 5V, VCC_RTC (AT mode)
12V, VCC_RTC (AT mode)
PCB
• Dimensions
- microATX form factor
- 244mm (9.6") x 244mm (9.6")
• Compliance
- PICMG COM Express® R2.0, Type 6
CERTIFICATION
• CE
• FCC Class B
• RoHS
EXPANSION SLOTS
• 1 PCIe x16 Gen 3 slot
• 1 PCIe x4 Gen 2 slot
• 2 PCIe x1 slots (PCIe 2.0)
• 1 Mini PCIe slot (PCIe 2.0) (PCIe signal only)
- USB signal: optional
- Supports half/full size Mini PCIe card
LPC Bus
Super I/O
(Option)
COM 2x
FAN Connector
2x
134.59
COM331
145.59
154.94
154.94
H8
175.59
Mini PCIe
TYPE 6
PCIe x16
Connector
Row
C+D
Packing List
227.33
233.68
227.33
233.68
209.55
203.20
162.89
122.89
89.89
77.89
75.89
45.72
34.29
20.32
www.dfi.com
USB 3.0 4x
Display Port 3x
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
•
•
•
•
•
•
1
2
1
1
1
1
COM331-B board
Serial ATA data cables
COM port cable (with bracket)
I/O shield
QR (Quick Reference)
DVD
Optional Items
•
•
•
•
Serial ATA data cable
COM port cable
I/O shield
Serial ATA power cable
Modules
Carrier
Board Mini
Block Diagram
I/O CONNECTORS
• 1 connector for 1 external RS232 serial port
• 2 serial interface connectors (TX/RX)
• 1 SDIO slot
• 1 DisplayPort
• 1 LVDS LCD panel connector
• 1 LCD/inverter power connector
• 1 8-bit Digital I/O connector
• 1 front audio connector for line-out and mic-in jacks
• 1 S/PDIF connector
• 4 Serial ATA ports
• 1 LPC connector
• 1 I2C connector
• 1 SMBus connector
• 1 24-pin ATX power connector
• 1 4-pin 12V power connector
• 1 chassis intrusion connector
• 1 front panel connector
• 3 fan connectors
SUPPORTED COM EXPRESS MODULES
• Basic
• Compact
Computer-On-Module
Mechanical Drawing
STORAGE
• 4 Serial ATA ports
- 2 SATA 3.0 ports with data transfer rate up to 6Gb/s
- 2 SATA 2.0 ports with data transfer rate up to 3Gb/s
DIGITAL I/O
• 8-bit Digital I/O connector
- 4-bit GPI (General Purpose Input)
- 4-bit GPO (General Purpose Output)
LPC
COM Express
connector
ONBOARD AUDIO FEATURES
• Realtek ALC886 5.1-channel High Definition Audio
• Audio outputs: Mic-in/Center+Subwoofer,
line-in/surround and line out
• S/PDIF audio interface
COM Express® Carrier Board
COM Express® Carrier Board
COM330-B
LAN
Line-in
COM330-B
Features
COM2
COM4
PS/2 Mouse
Line-out
(option)
USB 2.0
VGA
(option)
COM1
SATA 3.0
PCI 2
PCIe x4
PCI 1
PCIe x16
USB 6-7
Specifications
ONBOARD AUDIO FEATURES
• Realtek ALC886 5.1-channel High Definition Audio
• Audio outputs: Mic-in/Center+Subwoofer,
line-in/surround and line out
• S/PDIF audio interface
EXPANSION
PS/2 KB
Mic-in
Features
COM3
SATA 2.0
LPC
COM Express
connector
1 PCIe x16, 1 PCIe x4, 2 PCI
1 Mini PCIe (PCIe signal only)
DISPLAY OUTPUTS 1 VGA, 1 LVDS
LAN
1 LAN
COM
4 COM
USB
8 USB 2.0
STORAGE
4 SATA: 2 SATA 3.0, 2 SATA 2.0
1 CF
DIO
8-bit DIO
DIMENSIONS
244mm x 244mm (9.6" x 9.6")
STORAGE
• 4 Serial ATA ports
- 2 SATA 3.0 ports with data transfer rate up to 6Gb/s
- 2 SATA 2.0 ports with data transfer rate up to 3Gb/s
• 1 CompactFlash socket
COM Express
connector
USB 4-5
ATX power
LVDS LCD
Panel
Compact
DIGITAL I/O
• 8-bit Digital I/O connector
- 4-bit GPI (General Purpose Input)
- 4-bit GPO (General Purpose Output)
Supports Compact and Basic modules
+12V power
LVDS/Inverter
Power
Basic
SIO_Fan 3
DIO
SIO_Fan 2
CF
Mini PCIe SMBus
REAR PANEL I/O PORTS
• 3 DB-9 RS232 serial ports
• 1 DB-15 VGA port
• 1 RJ45 LAN port
• 4 USB 2.0/1.1 ports
• Line-in/Surround, Line out, Mic-in/Center+Subwoofer jacks
• 1 mini-DIN-6 PS/2 mouse port (option)
• 1 mini-DIN-6 PS/2 keyboard port (option)
SIO_Fan 1
Giga LAN
209.55
203.20
197.50
171.43
135.34
109.18
87.57
65.78
47.28
45.72
26.97
13.67
6.65
0.00
34.29
0.00
USB2.0
USB 8x
SATA3.0
SATA 2x
22.86
29.25
Mini PCIe
Audio Codec
10.16
10.16
PCIe 4x
TYPE 2
Connector
Row
A+B
LVDS
VGA
SATA2.0
SATA 2x
ROM INTERFACE
• 1 SPI interface
- Supports up to 64Mbit
• 1 LPC/FWH interface
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• 10% to 90%
POWER OUTPUT
• 12V, 5VSB, VCC_RTC (ATX mode)
12V, 5V, VCC_RTC (AT mode)
12V, VCC_RTC (AT mode)
PCB
• Dimensions
- microATX form factor
- 244mm (9.6") x 244mm (9.6")
• Compliance
- PICMG COM Express® R2.0, Type 2
CERTIFICATION
• CE
• FCC Class B
• RoHS
SPI
46.94
GPIO
58.26
I/O Controller
LPC Bus
Super I/O
(Opt.)
COM 4x
121.76
132.76
154.94
DAMAGE FREE INTELLIGENCE
• Legacy Super I/O support (option)
- Monitors 5V/1.5V/12V/3.3V
- Monitors SIO_Fan 1/SIO_Fan 2/SIO_Fan 3
PS/2 Keyboard
FAN Connector
PS/2 Mouse
154.94
162.76
CF
227.33
232.06
227.33
233.68
209.55
203.20
167.20
127.20
94.20
82.20
80.20
45.72
34.29
20.32
www.dfi.com
PCI 2x
PEG
IDE Bus
TYPE 2
Connector
Row
C+D
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
•
•
•
•
•
•
•
1
2
1
1
1
1
1
COM330-B board
Serial ATA data cables
USB port cable (with bracket)
COM port cable (with bracket)
I/O shield
QR (Quick Reference)
DVD
Optional Items
•
•
•
•
•
Serial ATA data cable
COM port cable
USB port cable
I/O shield
Serial ATA power cable
Modules
Carrier
Board Mini
Block Diagram
SUPPORTED COM EXPRESS MODULES
• Basic
• Compact
Computer-On-Module
Mechanical Drawing
I/O CONNECTORS
• 2 connectors for 4 external USB 2.0/1.1 ports
• 1 connector for 1 external RS232 serial port
• 1 LVDS LCD panel connector
• 1 LCD/inverter power connector
• 1 8-bit Digital I/O connector
• 1 front audio connector for line-out and mic-in jacks
• 1 S/PDIF connector
• 4 Serial ATA ports
• 1 LPC connector
• 1 I2C connector
• 1 SMBus connector
• 1 24-pin ATX power connector
• 1 4-pin 12V power connector
• 1 chassis intrusion connector
• 1 front panel connector
• 3 fan connectors
EXPANSION SLOTS
• 1 PCIe x16 Gen 3 slot
• 1 PCIe x4 Gen 2 slot
• 1 Mini PCIe slot (PCIe 2.0) (PCIe signal only)
- USB signal: optional
- Supports half/full size Mini PCIe card
• 2 PCI slots (PCI 2.3)
COM Express® Carrier Board
COM Express® Carrier Board
COM630-B
COM630-B
LAN COM4
Mic-in
Line-in
Line-out
COM2
USB 3
PS/2 Mouse
PS/2 K/B
USB 2
VGA
COM1
USB 0-1
DIO
PCIe x1
PCIe x1
PCI 1
PCI 2
PCI 3
Parallel
PCI 4
PCIe x16
Features
EXPANSION
DISPLAY OUTPUTS
LAN
COM
USB
PARALLEL
STORAGE
COM 3
COM Express
connector
COM Express
connector
Compact
FDD
SATA 0-1
DIO
DIMENSIONS
Specifications
AUDIO FEATURES
• Realtek ALC262 audio codec (ALC655 optional)
• 6-channel audio output
1 PCIe x16, 2 PCIe x1, 4 PCI
1 VGA, 1 LVDS
1 LAN
4 COM
8 USB 2.0
1 Parallel
4 SATA 2.0
1 CF
1 IDE
1 FDD
8-bit DIO
305mm x 244mm (12" x 9.6")
SERIAL ATA FEATURES
• SATA speed up to 3Gb/s
• Four SATA ports
IDE FEATURES
• Supports up to Ultra ATA 100
• One IDE channel supports up to 2 IDE devices
BIOS FEATURES (optional)
• FWH/LPC interface
• Supports up to 4Mbit flash ROM
• PLCC32 socket
• Supports WP# jumper
• Carrier board ROM enable/disable function supported
Basic
Front
panel
IDE
ATX power
Supports Compact and Basic modules
I/O CHIP 1 FEATURES
• Winbond 83627HG-AW controller
• LPC interface
• Supports Smart fan
• Default I/O port address "2eh"
CompactFlash socket USB 4-7 SATA 2-3 LVDS LCD Panel
Mechanical Drawing
Block Diagram
Giga LAN
288.29
281.94
276.22
250.38
214.44
187.95
166.33
144.55
124.46
65.07
78.74
44.75
24.43
16.51
4.11
0.00
USB 8x
10.16
LVDS
0.00
Audio Codec
TYPE 2
USB2.0
LVDS Bus
VGA
Connector
Row
A+B
REAR PANEL I/O PORTS
• 1 mini-DIN-6 PS/2 mouse port
• 1 mini-DIN-6 PS/2 keyboard port
• 3 DB-9 serial ports
• 1 DB-15 VGA port
• 1 RJ45 LAN port
• 4 USB 2.0/1.1 ports
• Mic-in, line-in and line-out
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• Operating: 10% to 90%
COM EXPRESS CONNECTORS
• Two 220-pin COM Express standard connectors
• Module connector pin: Tyco 3-631849-6
Dimensions
•Dimensions
- ATX form factor
- 305mm (12") x 244mm (9.6")
•Compliance
- PICMG COM Express® R1.0, Type 2
CERTIFICATION
• CE
• FCC Class B
• UL
• RoHS
MSIC Logic
22.86
49.80
I/O Controller
93.98
COM 4x
LPC Bus
PS/2 Keyboard
FAN Connector
PS/2 Mouse
FDD
Super I/O
125.80
154.94
154.94
166.80
COM630
Packing List
196.80
227.33
227.33
271.48
281.94
256.48
235.48
169.48
124.46
0.00
IDE
TYPE 2
SATA 4x
Connector
Row
C+D
PCIe
www.dfi.com
LPC Bus
PCI 5x
PCIe x1 Port 1-2
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
•
•
•
•
•
•
•
•
1
1
1
1
1
1
1
1
COM630-B board
USB port cable
Serial ATA data cable
Serial ATA power cable
IDE cable
FDD cable
I/O shield
QR (Quick Reference)
Optional Items
•
•
•
•
•
Serial ATA data cable
IDE cable
USB port cable
I/O shield
Serial ATA power cable
Modules
Carrier
Board Mini
EXPANSION SLOTS
• 1 CompactFlash socket
• 1 PCI Express x16 (Graphics or Dual SDVO)
• 2 PCI Express x1
• 4 PCI slots (PCI 2.3, 32-bit, 33MHz)
DAMAGE FREE INTELLIGENCE
• Monitors system temperature and overheat alarm
• Monitors system fan speed and failure alarm
Computer-On-Module
I/O CHIP 2 FEATURES
• Fintek F81216D controller
• LPC interface
• Supports 4 COM ports
• Supports IrDA
• Watchdog timer function
• Default I/O port address "4eh"
I/O CONNECTORS
• 2 connectors for 4 additional external USB 2.0/1.1 ports
• 1 connector for an external serial port
• 1 LVDS LCD panel connector
• 1 LCD/inverter power connector
• 1 Digital I/O connector
• 1 Digital I/O power connector
• 1 front audio connector for line-out and mic-in jacks
• 1 CD-in internal audio connector
• 1 S/PDIF-in/out connector
• 1 GPIO connector
• 1 connector for IrDA interface
• 4 Serial ATA connectors
• 1 40-pin IDE connector
• 1 FDD connector
• 1 parallel connector (optional)
• 1 24-pin ATX power connector
• 1 4-pin 12V power connector
• 1 Wake-On-Ring connector
• 1 chassis open connector
• 1 front panel connector
• 3 fan connectors
• 1 diagnostic LED (optional)
Qseven Computer-On-Module
Qseven Computer-On-Module
Freescale
Atom
700C
-200C
Processor
-200C
-400C
-400C
Wide
Temperature
Wide
Temperature
Wide
Temperature
Atom
Atom
700C
850C
850C
Wide
Temperature
Model
Atom
Module
Carrier Board
Module
Carrier Board
Module
Module
Carrier Board
Module
Carrier Board
FS700 Series
Q7A-551
BT700
Q7X-151
QB702-B
QB701-B
Q7-100
QB700-B
Q7-951
Intel® Atom™ E6x0T
Intel® Atom™ E6xxT/E6xx
Intel Atom™
E3800 series
®
Freescale i.MX 6 series
Intel® Atom™ E6xx
Memory
1GB DDR3 onboard
N/A
1GB/2GB/4GB
DDR3L onboard
N/A
1GB DDR2 onboard
1GB DDR2 onboard
N/A
512MB/ 1GB
DDR2 onboard
N/A
Display
HDMI, LVDS
HDMI, LVDS
LVDS, DDI
LVDS
LVDS, SDVO
LVDS, SDVO
DVI, VGA, LVDS
LVDS, SDVO
VGA, LVDS
1
1
1
1
1 Micrel
1 Micrel
2
1 Micrel
1
USB 3.0
N/A
N/A
1
2
N/A
N/A
N/A
N/A
N/A
USB 2.0
4 USB 2.0, 1 USB OTG
2 Rear, 1 USB OTG
6
2
8 USB 2.0
7 USB host and
1 USB host/client
4 Rear, 4 by pin
header (1 USB client)
6 USB ports
1 USB client
2 Rear, 4 by pin header
RS232/422/485
N/A
1
N/A
N/A
N/A
N/A
N/A
N/A
1 by pin header
RS232
N/A
2 Rear
N/A
2 Rear
N/A
N/A
2 Rear
N/A
1 Rear
SATA 3.0
N/A
N/A
N/A
1
N/A
N/A
2
N/A
N/A
SATA 2.0
1
1
2
N/A
2
1
N/A
2
2
SSD
N/A
N/A
N/A
N/A
N/A
2GB (-B620T012)
4GB (-B640T122)
N/A
N/A
N/A
SDIO
Yes
N/A
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Mini PCIe
N/A
2
N/A
N/A
N/A
N/A
1
N/A
1
PCIe x16
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
PCIe x4
N/A
N/A
N/A
1
N/A
N/A
N/A
N/A
N/A
PCIe x1
1
N/A
3
N/A
3
3
1
3
N/A
N/A
N/A
N/A
N/A
1
N/A
Yes
N/A
N/A
I2C
Yes
N/A
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Digital I/O
N/A
8-bit
8-bit
8-bit
8-bit
N/A
8-bit
N/A
8-bit
I2S
I2S
HDA
HDA
HDA
HDA
HDA
HDA
HDA
LPC
N/A
N/A
Yes
Yes
Yes
Yes
Yes
Yes
Yes
SMBus
N/A
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
CAN-bus
Yes
Yes
N/A
Yes
Yes
Yes
Yes
Yes
Yes
TPM (optional)
N/A
N/A
Yes
N/A
Yes
Yes
N/A
N/A
Yes
Watchdog
Yes
N/A
Yes
Yes
Yes
Yes
N/A
Yes
N/A
Power Input
5V
2-pin DC-in
5V
12V DC-in
5V
5V
24-pin ATX
5V
12V
Compliance
Qseven R1.2
N/A
Qseven R2.0
N/A
Qseven R1.2
Qseven R1.2
N/A
Qseven R1.1
N/A
Dimensions
70mm x 70mm
190mm x 102mm
70mm x 70mm
170mm x 170mm
70mm x 70mm
70mm x 70mm
170mm x 170mm
70mm x 70mm
102mm x 147mm
Ethernet
USB
Serial
Storage
Audio
Controller
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Modules Mini
Qseven
ExpressCard
Computer-On-Module
Expansion
Freescale i.MX6 Series
Qseven
Freescale i.MX6 Series
Qseven
FS700 Series
FS700 Series
Freescale
Features
Freescale
i.MX6 series
USB HUB
USB2514BI
PMIC
Specifications
MEMORY
STORAGE
DISPLAY OUTPUTS
EXPANSION
SDIO/MMC
DDR3
DDR3
TOP
LAN
Atheros
AR8033
eMMC
DIMENSIONS
PROCESSOR
•Freescale i.MX 6 series processors
- i.MX6Q: i.MX 6Quad at 1.0GHz, Four Cortex-A9 cores
- i.MX6D: i.MX 6Dual at 1.0GHz, Two Cortex-A9 cores
- i.MX6L: i.MX 6DualLite at 1.0GHz, Two Cortex-A9 cores
- i.MX6S: i.MX 6Solo at 1.0GHz, One Cortex-A9 core
1GB/2GB DDR3 onboard
4GB/8GB/16GB eMMC onboard
1 HDMI, 2 LVDS
1 PCIe x1
1 I2C, 1 CAN-bus
4 USB 2.0, 1 USB OTG
1 SATA 2.0
1 SDIO/MMC
1 RS232
1 10/100Mbps LAN (FS700E)
1 Gigabit LAN (FS700)
SYSTEM MEMORY
•DDR3 onboard
•Onboard memory: 1GB/2GB
Qseven R1.2
70mm x 70mm (2.76" x 2.76")
DDR3
700C
DDR3
-200C
eMMC
BOTTOM
Wide
Temperature
SDIO/MMC
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
STORAGE
•Supports 4GB, 8GB and 16GB eMMC onboard
POWER
• Input: 5V standby, 5V
ONBOARD GRAPHICS FEATURES
• Supports HDMI and LVDS interfaces
• HDMI: resolution up to 1920x1200 @ 60Hz
• LVDS: 18/24-bit, single channel, resolution up to 2560x1600 @ 60Hz
•Supports 3D and 2D graphics
•Multi-stream-capable HD video engine delivering 1080p60 decode,
1080p30 encode and 3D video playback
POWER CONSUMPTION
• TBD
ONBOARD AUDIO FEATURES
• Supports I2S interface
Mechanical Drawing
SERIAL ATA (SATA) INTERFACE
• Supports 1 SATA 2.0 interface (Quad and Dual processors only)
• SATA speed up to 3Gb/s (SATA 2.0)
70.00
64.90
56.50
23.65
2.50
0.00
0.00
3.00
ONBOARD LAN FEATURES
• One Atheros AR8033 Ethernet PHY
• Supports 10Mbps, 100Mbps data transmission (FS700E)
• Supports 10Mbps, 100Mbps and 1Gbps data transmission (FS700)
Block Diagram
3.95
24 bits LVDS
11.53
24 bits LVDS
18.00
DDR3
SD4
Backlight
EXPANSION INTERFACES
• Supports 4 USB 2.0 interfaces
• Supports 1 USB OTG (Type B) interface
• Supports 1 PCIe x1 interface
• Supports 1 RS232 serial interface
• Supports 1 I2C interface
• Supports CAN-bus (Controller-Area Network) interface
SDIO/MMC
• Supports 1 SDIO/MMC
• Supports SDA Standard Ver 1.0, SD memory card specification
Ver 2.0, SDIO card specification Ver 1.0, MMC System specification
Ver 4.1
• Conforms to Secure Digital Host Controller (SDHC) speed class 6
OS SUPPORT
• Linux
• Android
- Quad, Dual and DualLite processors only
- 8GB eMMC required
TEMPERATURE
• Operating
- Quad: -20oC to 70oC (TBD)
- Dual, DualLite, Solo: 0oC to 60oC
• Storage: -30oC to 80oC
HUMIDITY
• 5% to 90%
PCB
• Dimensions
- Qseven form factor
- 70mm (2.76") x 70mm (2.76")
• Compliance
- Qseven specification revision 1.2
eMMC
SD2
HDMI
Top View
38.92
MDI
I2C
RGMII
MIPI CSI
UART5
66.06
AMXM Golden Finger
52.00
67.00
70.00
GLAN PHY
SATA
Freescale
i.MX6
PCIe
SPI 1
CAN Bus
SDIO (SD3)
HDA (I2S)
Reset
USB OTG
USB 0-3
Power
USB Hub
PMIC
Sensor
Camera
Ordering Information
Model Name
Part Number
Description
FS700E-M60-6Q1041
FS700E-M60-6D1041
FS700E-M60-6L1041
FS700E-M60-6S1041
777-FS70E1-EF0G
777-FS70E1-DF0G
777-FS70E1-CF0G
777-FS70E1-500G
i.MX
i.MX
i.MX
i.MX
USB
Power
Packing List
• 1 FS700E/FS700-M60 board
• 1 QR (Quick Reference)
• 1 DVD
www.dfi.com
6Quad, onboard DDR3 1GB, eMMC 4GB, RoHS, -20oC to 70oC (TBD)
6Dual, onboard DDR3 1GB, eMMC 4GB, RoHS, 0oC~60oC
6DualLite, onboard DDR3 1GB, eMMC 4GB, RoHS, 0oC~60oC
6Solo, onboard DDR3 1GB, eMMC 4GB, RoHS, 0oC~60oC
The following models will be available upon request. Please contact your sales representative for more information.
Model Name
Part Number
Description
FS700-M60-6Q1041 777-FS7001-EF0G
i.MX 6Quad, onboard DDR3 1GB, eMMC 4GB, RoHS, -20oC to 70oC (TBD)
FS700-M60-6D1041 777-FS7001-DF0G
i.MX 6Dual, onboard DDR3 1GB, eMMC 4GB, RoHS, 0oC~60oC
FS700-M60-6L1041 777-FS7001-CF0G
i.MX 6DualLite, onboard DDR3 1GB, eMMC 4GB, RoHS, 0oC~60oC
FS700-M60-6S1041 777-FS7001-500G
i.MX 6Solo, onboard DDR3 1GB, eMMC 4GB, RoHS, 0oC~60oC
Power ON
Bottom View
UART1
micro SD
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Optional Items
• Q7A-551 carrier board kit
Modules Mini
Qseven
Computer-On-Module
I2C 2
Qseven Carrier Board
Qseven Carrier Board
Q7A-551
COM 1
DC-in
LAN
Q7A-551
USB 0-1
Features
Line-out/
Mic-in HDMI
Specifications
ONBOARD GRAPHICS FEATURES
•Display ports
- 1 HDMI
- 2 24-bit single channel LVDS
EXPANSION
USB OTG
DIO
SIM
PCIe x1
and USB
signal
SATA 2.0
PCIe x1,
USB and
mSATA
signal
HDD
Power
CAN
Bus
Front
panel
COM2
LVDS LCD Panel
MXM
Connector
2 Mini PCIe
1 SIM
DISPLAY OUTPUTS 1 HDMI, 1 LVDS
LAN
1 LAN
COM
3 COM
USB
2 USB 2.0, 1 USB OTG
STORAGE
1 SATA 2.0
1 SD/MMC
DIO
12-bit DIO
DIMENSIONS
190mm x 102mm (7.48" x 4.02")
DDR3
onboard
SD/MMC
SDIO/MMC
CAN-bus
9~36V
DC-in
ONBOARD AUDIO FEATURES
•Supports I2S audio interface
• 2 1W audio amplifier connectors (left and right sides)
ONBOARD USB FEATURES
•2 USB 2.0 ports
•1 USB OTG port
STORAGE
• 1 SATA 2.0 port with data transfer rate up to 3Gb/s
• 1 SD/MMC socket
SATA 2.0
COM 3
For FS700 Series
FS700-M60
Q7A-551
HUMIDITY
• 10% to 90%
BOARD TO BOARD CONNECTORS
• One MXM connector
DIMENSIONS
• 190mm (7.48") x 102mm (4.02")
I/O CONNECTORS
• 1 connector for an external RS232/422/485 serial port
• 1 LVDS LCD panel connector
• 1 SATA 2.0 port
• 1 CAN-bus connector
• 1 front panel connector
• 1 power switch connector
• 2 1W audio amplifier connectors (left and right sides)
• 1 12-bit Digital I/O connector
11.30
6.00
1.20
45.21
Block Diagram
187.00
190.00
184.50
182.50
184.50
GLAN
148.50
148.56
139.99
131.50
Audio Codec
mSATA
USB 2x
115.00
104.40
102.60
88.50
85.99
72.49
70.86
53.78
USB OTG
CAN Bus
PCIe
HDA
USB
Mini PCIe 2x
SATA2.0
SPI
USB2.0
USB OTG
Q7
MXM
Connector
LVDS
HDMI
Digital I/O
COM 3x
SDIO
44.50
37.26
30.50
22.50
Packing List
16.35
5.00
5.00
www.dfi.com
17.49
7.00
6.75
5.00
0.00
50.08
75.30
85.00
102.00
0.00
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
•
•
•
•
•
1
1
1
1
1
Q7A-551 board
SATA data cable
I/O shield
QR (Quick Reference)
DVD
Optional Items
•
•
•
•
SATA data cable
Serial ATA power cable
I/O shield
Power adapter (60W, 12V) : 671-106002-102G
Modules Mini
Qseven
87.55
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
Computer-On-Module
75.30
72.00
Mechanical Drawing
PANEL I/O PORTS
• 2 USB 2.0 ports
• 1 USB OTG port
• 2 DB-9 serial ports
- 1 RS232/422/485
- 1 RS232 (debug or UART)
• 1 RJ45 LAN port
• 1 HDMI port
• 1 Line-out/Mic-in jack
• 1 9~36V DC-in jack
EXPANSION SLOTS
• 2 Mini PCIe slots
- 1 slot supports PCIe and USB signals
- 1 slot supports PCIe, USB and mSATA signals
- Supports full size Mini PCIe card
• 1 SIM card socket
Intel® AtomTM E3800 Series
Qseven
Intel® AtomTM E3800 Series
Qseven
BT700
BT700
Atom
Features
MEMORY
STORAGE
EXPANSION
Intel Atom
E3800 Series
1GB/2GB/4GB DDR3L onboard
4GB/8GB/16GB eMMC onboard (optional)
3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 1 serial
1 LVDS, 1 DDI (HDMI/DVI/DP)
1 HDA
7 USB: 1 USB 3.0, 6 USB 2.0
2 SATA 2.0
1 SDIO
8-bit DIO
1 LAN
Qseven R2.0
70mm x 70mm (2.76" x 2.76")
DDR3L
DDR3L
DDR3L
DDR3L
Specifications
TOP
LAN
DIMENSIONS
DDR3L
850C
DDR3L
DDR3L
DDR3L
-400C
BOTTOM
Wide
Temperature
Availability: Mar 2014
USB 3.0
70.00
56.48
0.00
LVDS
Top View
32.86
33.33
PTN3460
eDP
1GB/2GB/4GB
DDR3L onboard
LPC
SM Bus
Ø2.50 (*4pcs)
PCIe x1 3x
AMXM Golden Finger
SPI Flash
16Mbit
Atom E3800
Series
/Celeron
SDIO
2
Serial TX/RX
USB 3.0 1x
CLK Gen
Model Name
USB
HSIC
-
Temperature
Memory
eMMC
B
1
0
1: 1GB
B: 0oC to 60oC
T: -40oC to 85oC 2: 2GB
4: 4GB
PCIe x1
PCIe x1
5.00
OS SUPPORT
• TBD
TEMPERATURE
• Operating
- Atom: 0oC to 60oC, -20oC to 70oC, -40oC to 85oC
- Celeron: 0oC to 60oC
• Storage: -40oC to 85oC
HUMIDITY
• 5% to 95%
SDIO INTERFACE
• Supports 1 SDIO
• Supports SDA Standard Ver 1.0, SD memory card specification
Ver 2.0, SDIO card specification Ver 1.0
• Conforms to Secure Digital Host Controller (SDHC) speed class 6
BT700
USB HSIC
GLAN
I210
POWER CONSUMPTION
• TBD
POWER
• Input: VCC_RTC, 5V standby, 5V
PCB
• Dimensions
- Qseven form factor
- 70mm (2.76") x 70mm (2.76")
• Compliance
- Qseven specification revision 2.0
Ordering Information
USB 2.0 4x
GbE
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
BIOS
• 16Mbit SPI Flash BIOS
4G/8G
eMMC
(optional)
20.20
SATA 2.0 2x
DAMAGE FREE INTELLIGENCE
• Monitors CPU temperature
• Monitors CPU fan speed
• Monitors Vcore/VGFX/DDR/1.05V/VCCSA voltages
• Watchdog timer function
eMMC
I C Bus
USB 2.0 2x
ONBOARD GRAPHICS FEATURES
• Intel® HD Graphics
• Supports LVDS and DDI interfaces
• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to
1920x1200 @ 60Hz
• Digital Display Interface: HDMI, DVI and DP
• HDMI, DVI: resolution up to 2560x1600 @ 24Hz
• DP: resolution up to 2560x1600 @ 60Hz
• Supports hardware acceleration for DirectX 11, OCL 1.2, OGL 3.2,
H.264, MPEG2, MVC, VC-1, WMV9 and VP8
0:
4:
8:
1:
Processors
None
4GB
8GB
16GB
E45
E45: Intel® AtomTM E3845, Quad Core, 2M Cache, 1.91GHz, 10W
E27: Intel® AtomTM E3827, Dual Core, 1M Cache, 1.75GHz, 8W
E26: Intel® AtomTM E3826, Dual Core, 1M Cache, 1.46GHz, 7W
E25: Intel® AtomTM E3825, Dual Core, 1M Cache, 1.33GHz, 6W
E15: Intel® AtomTM E3815, Single Core, 0.5M Cache, 1.46GHz, 5W
J00: Intel® Celeron® J1900, Quad Core, 2M Cache, up to 2.42GHz, 10W
N20: Intel® Celeron® N2920, Quad Core, 2M Cache, 2.00GHz, 7.5W
1.20
Heatsink
Module PCB
Carrier PCB
1.60
Heatspreader
Standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 BT700 board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• Q7X-151 carrier board kit
Modules Mini
Qseven
Bottom View
Coming Soon
STORAGE
• Supports 4GB, 8GB and 16GB eMMC onboard (optional)
TRUSTED PLATFORM MODULE (TPM) - optional
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password
protection
Switch
8.00
SYSTEM MEMORY
• 1GB/2GB/4GB DDR3L onboard
• Supports DDR3L 1066/1333MHz
Computer-On-Module
70.00
EXPANSION INTERFACES
• Supports 1 USB 3.0 port
• Supports 4 USB 2.0 ports
• Supports 1 USB HSIC for 2 USB 2.0 (default); or 4 USB 2.0 ports
• Supports 3 PCIe x1 (GPP, GPP3 is connected to onboard LAN by
default)
• Supports LPC interface
• Supports I2C interface
• Supports SMBus interface
• Suppotrs 1 serial interface (TX/RX)
• Supports 8-bit Digital I/O
SERIAL ATA (SATA) INTERFACE
• Supports 2 Serial ATA interfaces
• SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
eDP
HDA
56.50
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
ONBOARD LAN FEATURES
• Intel® WGI210 Gigabit Ethernet Controller
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Block Diagram
52.00
27.74
18.00
0.00
Mechanical Drawing
SDIO
SATA 2.0
DDR3L
onboard
PROCESSOR
• Intel® AtomTM/Intel® Celeron® processors
• BGA 1170 packaging technology
• 22nm process technology
Please refer to the Ordering Information below
Qseven Carrier Board
Qseven Carrier Board
Q7X-151
Q7X-151
Features
COM 3
LAN
Line-in/ Surround
Line-out
USB 2.0
EXPANSION
DISPLAY OUTPUTS
LAN
COM
USB
STORAGE
DC-in
DP
Mic-in/Center+
Subwoofer
COM 4
USB 3.0
ry
na
imi
rel
I2C
P
SM Bus
SATA Power
SATA 3.0
PCIe x4
mSATA
UART
DIO
DIMENSIONS
Specifications
ONBOARD GRAPHICS FEATURES
•Display ports
- 1 dual channel LVDS (standard); or
2 embedded DisplayPort to dual channel PTN3460 LVDS (optional)
1 PCIe x4
1 LVDS
1 LAN
2 COM
4 USB: 2 USB 3.0, 2 USB 2.0
1 SATA 3.0
1 mSATA
8-bit DIO
170mm x 170mm (6.7" x 6.7")
ONBOARD AUDIO FEATURES
•Realtek ALC886 5.1-channel High Definition Audio (standard); or
Realtek ALC5640-VB 2-channel I2S Audio interface (optional)
•Audio outputs: Mic-in/Center+Subwoofer, line-in/surround and
line out
ONBOARD USB FEATURES
•With Module BT700: 1 USB 3.0 and 6 USB 2.0 ports (standard); or
8 USB 2.0 ports (optional)
•USB 2.0 port 1 supports USB OTG (optional)
Serial
MXM
Connector
System
Fan_1
CAN-bus
USB 3.0
GbE LAN
SATA 3.0
12V DC-in
For BT700
CAN-bus
LVDS LCD
panel
LPC
System
Fan_3
DIO
LCD/Inverter
power
System
Fan_2
LCD/Inverter
power
Q7X-151
Availability: May 2014
BT700
WATCHDOG TIMER
• Watchdog timeout programmable via software from 1 to 255 seconds
DAMAGE FREE INTELLIGENCE
• Monitors system temperature and overheat alarm
• Monitors system fan speed and failure alarm
ROM INTERFACE
• 1 SPI interface
- Supports up to 64Mbit
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
STORAGE
• 1 SATA 3.0 port with data transfer rate up to 6Gb/s
- SATA port provides adequate space for SATA DOM
• 1 mSATA port
HUMIDITY
• 5% to 90%
DIGITAL I/O
• 8-bit Digital I/O connector
BOARD TO BOARD CONNECTORS
• One MXM connector
REAR PANEL I/O PORTS
• 1 12V DC-in jack
• 2 DB-9 RS232 serial ports
• 1 DP port
• 1 RJ45 LAN port
• 2 USB 3.0 ports
• 2 USB 2.0 type A ports
• 1 USB OTG type Mini B port (optional)
• Mic-in/Center+Subwoofer, line-in/surround and line out jacks
DIMENSIONS
• Mini-ITX form factor
• 170mm (6.7") x 170mm (6.7")
142.80
125.82
133.90
103.32
85.47
69.80
43.02
25.11
9.94
0.00
3.20
3.18
0.00
3.18
0. 00
24.47
GLAN
PCIe x4
SATA3.0
Serial Port
39.47
Coming Soon
SM Bus
I2C Bus
CAN Bus
USB2.0
port 2-3
Display Port
88.47
101.82
101.82
85.47
0.00
3.20
142.80
139.47
133.90
95.22
111.34
95.22
ALC886
Front
Audio
(Opt.)
ALC5640-VB
COM 2x
SIO Fan
OR
OR
Super I/O
LPC Bus
USB Mini B 1x (Opt.)
SPI Sensor
SPI ROM
SPI Header
USB2.0 port 0-1
USB 3.0 2x
OR
GPIO 8-bit (Opt.)
www.dfi.com
Q7
Connector
SDIO
Audio
mSATA
USB 2.0 2x
USB2.0 port 1/
USB OTG
SLP & LID
73.47
SATA 1x
USB2.0 port 4-7
LPC
OR
OR
eDP
eDP
USB 2.0 4x (Opt.)
Packing List
LVDS
PTN3460
PTN3460
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
LVDS (Opt.)
LVDS (Opt.)
•
•
•
•
•
1
1
1
1
1
Q7X-151 board
Serial ATA data cable
I/O shield
QR (Quick Reference)
DVD
Optional Items
•
•
•
•
Serial ATA data cable
COM port cable
I/O shield
Power adapter (60W, 12V) : 671-106002-102G
Modules Mini
Qseven
I/O CONNECTORS
• 2 connectors for 4 external USB 2.0/1.1 ports (optional)
• 1 UART port
• 1 serial interface for 1 serial port (TX/RX)
• 3 LVDS LCD panel connectors
• 3 LCD/inverter power connectors
• 1 8-bit Digital I/O connector
• 1 front audio connector for line-out and mic-in jacks
• 1 SATA 3.0 port
• 1 SATA power connector
• 1 mSATA port
• 1 SDIO slot
• 1 LPC connector
• 1 I2C connector
• 1 SMBus connector
• 1 CAN-bus connector
• 1 front panel connector
• 3 fan connectors
Computer-On-Module
Block Diagram
Mechanical Drawing
EXPANSION SLOTS
• 1 PCIe x4 slot
Intel® AtomTM E600 Series
Qseven
Intel® AtomTM E600 Series
Qseven
QB702-B
QB702-B
Atom
Features
Micrel
KSZ9021RNI
USB HUB
USB2514BI
Specifications
MEMORY
EXPANSION
PMIC
1GB DDR2 onboard
3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 1 CAN-bus, 1 serial
1 LVDS, 1 SDVO
8 USB 2.0
2 SATA 2.0
1 SDIO/MMC
1 ExpressCard
1 LAN
Qseven R1.2
70mm x 70mm (2.76" x 2.76")
Intel
Atom E6x0T
Intel
EG20T PCH
DDR2
SPI Flash
16Mbit BIOS
DDR2
DDR2
DDR2
TOP
LAN
DIMENSIONS
SSD
SLB9635
850C
DDR2
-400C
DDR2
DDR2
DDR2
onboard
Wide
Temperature
DDR2
SD/MMC
ExpressCard
CAN-bus
BOTTOM
(512KB L2 cache, 600 MHz, 3.3W)
(512KB L2 cache, 1.0 GHz, 3.6W)
EXPANSION INTERFACES
• Supports 8 USB 2.0 interfaces:
- 7 Host and 1 Host/Client (selectable)
• Supports 3 PCIe x1 interfaces
• Supports 1 LPC interface
• Supports 1 SMBus interface
• Supports 1 I2C interface
• Supports CAN-bus (Controller-Area Network) interface
• Supports ExpressCard (PCIe signal only)
• Supports 1 serial interface (TX/RX)
(512KB L2 cache, 1.3 GHz, 3.6W)
(512KB L2 cache, 1.6 GHz, 4.5W)
CHIPSET
• Intel® EG20T PCH
SYSTEM MEMORY
• 1GB DDR2 onboard
• Supports memory down (single 32-bit channel)
ONBOARD GRAPHICS FEATURES
•Intel® GMA 600
•Supports up to 400MHz graphics frequency
•Ultra low power integrated 3D graphics
•High definition hardware video decoder and encoder engine
•Supports LVDS and SDVO interfaces
- LVDS: Supports pixel clock depths of 18/24-bit, single channel,
max. pixel clock of 80MHz, equates to 1280x768 @ 60Hz
- SDVO: Up to 160MHz pixel clock, equates to 1280x1024 @ 85Hz
ONBOARD LAN FEATURES
• Integrated Intel® PCH GbE MAC
• One Micrel KSZ9021RNI Ethernet PHY
• Supports 10Mbps, 100Mbps and 1Gbps data transmission
• IEEE 802.3 (10/100Mbps) and IEEE 802.3ab (1Gbps) compliant
0.00
Top View
32.86
TRUSTED PLATFORM MODULE (TPM) - optional
•Provides a Trusted PC for secure transactions
•Provides software license protection, enforcement and password
protection
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
70.00
56.48
Block Diagram
52.00
27.74
18.00
0.00
Mechanical Drawing
PROCESSOR
•QB702-B620T102
- Intel® AtomTM E620T
•QB702-B640T102
- Intel® AtomTM E640T
•QB702-B660T102
- Intel® AtomTM E660T
•QB702-B680T102
- Intel® AtomTM E680T
33.33
Processor
SDVO
56.50
Ø2.50 (*4pcs)
CORE CORE
LPC
CORE CORE
SM Bus
Atom E6xx Series
PCIe x1 3x
Graphics
CORE
Memory
Controller
Bottom View
Micro
controllerPIC16F690
CB_PWRBTN
WDI
I2C_DAT/CLO
AMXM Golden Finger
WDTO
LVDS_DIMMING
+5V
PMIC
DC/DC
LDO
PCIe x1
CLK Gen
POWER
• Input: VCC_RTC, 5V standby, 5V
• Supports ATX/AT mode
POWER CONSUMPTION
• 7.6 W with E680 at 1.6GHz and 1GB DDR2 onboard
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
HUMIDITY
• 10% to 90%
SSD (optional)
• 2GB/4GB/8GB/16GB/32GB
SDIO/MMC INTERFACE
• Supports 1 SDIO/MMC
• Supports SDA Standard Ver 1.0, SD memory card specification
Ver 2.0, SDIO card specification Ver 1.0, MMC System specification
Ver 4.1
• Conforms to Secure Digital Host Controller (SDHC) speed class 6
PCB
• Dimensions
- Qseven form factor
- 70mm (2.76") x 70mm (2.76")
• Compliance
- Qseven specification revision 1.2
SDIO/MMC
2
I C Bus
8.00
CAN Bus
20.20
USB Client
EG20T
Serial RX/TX
USB Hub
USB 5
SATA 2x
SSD
5.00
Ordering Information
Model Name
QB702-B620T102
QB702-B640T102
QB702-B660T102
QB702-B680T102
USB 0-4
USB 5-7
SPI
EEPROM
Part Number
777-QB7021-4C0G
777-QB7021-5C0G
777-QB7021-6C0G
777-QB7021-7C0G
Description
Intel® AtomTM
Intel® AtomTM
Intel® AtomTM
Intel® AtomTM
E620T,
E640T,
E660T,
E680T,
600 MHz, 3.3W, onboard DDR2 1GB, RoHS
1.0 GHz, 3.6W, onboard DDR2 1GB, RoHS
1.3 GHz, 3.6W, onboard DDR2 1GB, RoHS
1.6 GHz, 4.5W, onboard DDR2 1GB, RoHS
Port 1 (optional)
1.20
Heatsink
Module PCB
GbE
PHY
KSZ9021RNI
GMII
Carrier PCB
1.60
Heatspreader
Standoff
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 QB702-B board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• Q7-100 carrier board kit
• Heat spreader with heat sink: 761-Q70000-000G
• Heat spreader: A71-012002-000G
Modules Mini
Qseven
SPI Flash
16Mbit
SPI
DDR2 8x
1Gbit x8
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
Computer-On-Module
70.00
HDA
BIOS
•AMI BIOS
- 16Mbit SPI Flash BIOS (UEFI BIOS)
TEMPERATURE
• Operating: -40oC to 85oC
• Storage: -40oC to 85oC
SERIAL ATA (SATA) INTERFACE
• Supports 2 SATA interfaces
- One port shared with SSD
• SATA speed up to 3Gb/s (SATA 2.0)
LVDS
ENERGY EFFICIENT DESIGN
• Supports ACPI 2.0/1.0 specification
• Enhanced Intel® SpeedStep Technology
Intel® AtomTM E600 Series
Qseven
Intel® AtomTM E600 Series
Qseven
QB701-B
QB701-B
Atom
Features
Micrel
KSZ9021RNI
USB HUB
USB2514BI
MEMORY
EXPANSION
512MB/1GB/2GB DDR2 SDRAM onboard
3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 1 CAN-bus, 1 serial
1 LVDS, 1 SDVO
7 USB Host and 1 USB Host/Client
2 SATA 2.0
1 SDIO/MMC
1 LAN
Qseven R1.2
70mm x 70mm (2.76" x 2.76")
Intel
Atom E6xx
Intel
EG20T PCH
DDR2
SPI Flash
16Mbit BIOS
DDR2
DDR2
DDR2
LAN
DIMENSIONS
TOP
SLB9635
Specifications
SSD
700C
DDR2
SSD
-200C
DDR2
onboard
Wide
Temperature
DDR2
DDR2
Optional
2 SATA
CAN-bus
70.00
52.00
Block Diagram
33.33
LVDS
56.50
56.50
70.00
Processor
HDA
CORE CORE
LPC
CORE CORE
SM Bus
Atom E6xx Series
PCIe x1 3x
Ø2.50 (*4pcs)
Bottom View
LVDS_DIMMING
Bottom View
Micro
controllerPIC16F690
CB_PWRBTN
WDI
I2C_DAT/CLO
AMXM Golden Finger
WDTO
+5V
SPI
CLK Gen
SDIO/MMC
2
I C Bus
CAN Bus
USB Client
EG20T
Serial RX/TX
USB 0-4
USB Hub
USB 5-7
POWER
• Input: VCC_RTC, 5V standby, 5V
POWER CONSUMPTION
• 12.42 W with E660T at 1.3GHz and 1GB DDR2 onboard
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
PCB
• Dimensions
- Qseven form factor
- 70mm (2.76") x 70mm (2.76")
• Compliance
- Qseven specification revision 1.2
CERTIFICATION
• CE, FCC Class B, UL, RoHS
Ordering Information
Memory
Controller
PCIe x1
BIOS
• 16Mbit SPI Flash BIOS (UEFI BIOS)
DDR2 8x
1Gbit x8
Graphics
CORE
PMIC
DC/DC
LDO
ENERGY EFFICIENT DESIGN
• Supports ACPI 2.0/1.0 specification
• Enhanced Intel® SpeedStep Technology
SPI
EEPROM
Model Name
QB701-B620T201
QB701-B620T101
QB701-B620T011
QB701-B640T201
QB701-B640T101
QB701-B640T121
QB701-B660T101
QB701-B680T101
QB701-B680T201
QB701-B620100
QB701-B640100
QB701-B660100
QB701-B680100
Part Number
777-QB7011-4F0G
777-QB7011-4C0G
777-QB7011-4A0G
777-QB7011-5F0G
777-QB7011-5C0G
777-QB7011-5E0G
777-QB7011-6C0G
777-QB7011-7C0G
777-QB7011-7F0G
777-QB7011-0C0G
777-QB7011-1C0G
777-QB7011-2C0G
777-QB7011-3C0G
Description
Intel® AtomTM E620T, onboard DDR2 2GB, -20oC to 70oC
Intel® AtomTM E620T, onboard DDR2 1GB, -20oC to 70oC
Intel® AtomTM E620T, onboard DDR2 512MB, 2GB SSD onboard, -20oC to 70oC
Intel® AtomTM E640T, onboard DDR2 2GB, -20oC to 70oC
Intel® AtomTM E640T, onboard DDR2 1GB, -20oC to 70oC
Intel® AtomTM E640T, onboard DDR2 1GB, 4GB SSD onboard, -20oC to 70oC
Intel® AtomTM E660T, onboard DDR2 1GB, -20oC to 70oC
Intel® AtomTM E680T, onboard DDR2 1GB, -20oC to 70oC
Intel® AtomTM E680T, onboard DDR2 2GB, -20oC to 70oC
Intel® AtomTM E620, onboard DDR2 1GB, 0oC to 60oC
Intel® AtomTM E640, onboard DDR2 1GB, 0oC to 60oC
Intel® AtomTM E660, onboard DDR2 1GB, 0oC to 60oC
Intel® AtomTM E680, onboard DDR2 1GB, 0oC to 60oC
USB 5
SATA 2x
SSD
20.00
20.00
GbE
Port 1 (optional)
PHY
KSZ9021RNI
GMII
Heatsink
20.00
5.00
1.60
1.20
5.00
www.dfi.com
1.60
Standoff
Standoff
20.00
Carrier
ModulePCB
PCB
Carrier PCB
1.20
Heatsink
Module PCB
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 QB701-B board
• 1 QR (Quick Reference)
• 1 Drivers/utilities disk
Optional Items
• Q7-100 carrier board kit
• Heat sink: A71-012001-000G
Modules Mini
Qseven
SPI Flash
16Mbit
WATCHDOG TIMER
• Software programmable from 1 to 255 seconds
Computer-On-Module
Ø2.50 (*4pcs)
70.00
SDVO
EXPANSION INTERFACES
• Supports USB interface:
- 7 Host and 1 Host/Client (selectable)
• Supports 3 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I2C interface
• Supports CAN-bus (Controller-Area Network) interface
• Supports 1 serial interface (TX/RX)
HUMIDITY
• 10% to 90%
SDIO/MMC INTERFACE
• Supports 1 SDIO/MMC
• Supports SDA Standard Ver 1.0, SD memory card specification
Ver 2.0, SDIO card specification Ver 1.0, MMC System specification
Ver 4.1
• Conforms to Secure Digital Host Controller (SDHC) speed class 6
Top View
33.33
Top View
32.86
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
TRUSTED PLATFORM MODULE (TPM) - optional
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and
password protection
0.00
32.86
ONBOARD GRAPHICS FEATURES
• Intel® GMA 600
• Supports up to 400MHz graphics frequency
• Ultra low power integrated 3D graphics
• High definition hardware video decoder and encoder engine
• Supports LVDS and SDVO interfaces
- LVDS: Supports pixel clock depths of 18/24-bit,
single channel, max. pixel clock of 80MHz,
equates to 1280x768 @ 60Hz
- SDVO: Up to 160MHz pixel clock, equates to 1280x1024 @ 85Hz
SERIAL ATA (SATA) INTERFACE
• Supports two Serial ATA interfaces
- One port shared with SSD
• SATA speed up to 3Gb/s (SATA 2.0)
70.00
56.48
52.00
27.74
18.00
27.74
0.00
18.00
0.00
56.48
BOTTOM
0.00
CHIPSET
• Intel® EG20T PCH (Platform Controller Hub)
ONBOARD LAN FEATURES
• Integrated Intel® PCH GbE MAC
• One Micrel KSZ9021RNI Ethernet PHY
• Supports 10Mbps, 100Mbps and 1Gbps data transmission
• IEEE 802.3 (10/100Mbps) and IEEE 802.3ab (1Gbps) compliant
DDR2
Mechanical Drawing
PROCESSOR
• Intel® AtomTM E600 Series processors
Please refer to the Ordering Information below
Qseven Carrier Board
Qseven Carrier Board
Q7-100
Line-in/ Surround
LAN 2
Q7-100
LAN 1
Features
COM 1
VGA
Line-out
Specifications
GRAPHICS FEATURES
• Chrontel CH7317B (SDVO to RGB DAC)
EXPANSION
Mic-in/Center+
Subwoofer
COM 2
USB 0-1
DVI-I
(DVI-D signal)
USB 2-3
Front Audio
S/PDIF
LCD/
Inverter
power
Realtek
ALC886
LVDS LCD
panel
MXM
Connector
SPI
PCIe x1
Mini PCIe
1 PCIe x1, 1 Mini PCIe
1 ExpressCard
DISPLAY OUTPUTS 1 DVI-I, 1 VGA, 1 LVDS
LAN
2 LAN
COM
2 COM
USB
8 USB 2.0
STORAGE
2 SATA 3.0
1 SD/MMC
DIO
8-bit DIO
DIMENSIONS
170mm x 170mm (6.7" x 6.7")
LAN FEATURES
• 2 LAN ports
- LAN1: Gigabit Ethernet supported by the Qseven module
- LAN2: Realtek RTL8111DL PCIe Gigabit Ethernet controller
AUDIO FEATURES
• Realtek ALC886 5.1-channel High Definition Audio
• Audio outputs: Mic-in/Center+Subwoofer, line-in/surround
and line out
• S/PDIF audio interface
SATA
USB
I2C
SM Bus
CAN-bus
ExpressCard
2 SATA
8 USB
2 GbE LAN
DIO
ExpressCard
Front panel
For QB702-B and QB701-B
CAN-bus
System fan
ATX power
SD/MMC slot
Q7-100
QB701-B/
QB702-B
I/O CHIP FEATURES
• Winbond 83627DHG-P controller
• LPC interface
• Supports system fan
• Default I/O port address "2Eh"
EXPANSION SLOTS
• 1 PCIe x1 slot
• 1 Mini PCIe slot
- Supports half/full size Mini PCIe card
• 1 ExpressCard slot
Block Diagram
TEMPERATURE
• Operating: 0oC to 60oC
• Storage: -20oC to 85oC
HUMIDITY
• Operating: 10% to 90%
BOARD TO BOARD CONNECTORS
• One MXM connector
Dimensions
• Mini-ITX form factor
• 170mm (6.7") x 170mm (6.7")
CERTIFICATION
• CE
• FCC Class B
• RoHS
163.83
157.48
151.78
148.65
125.71
89.62
59.43
36.91
17.75
6.35
1.57
0.00
10.16
10.16
SPI
Interface
0.00
17
1
22.86
1
2
5
6
3
2
1
46.94
54.80
68.30
149.90
85.90
8
1
2
1
122.30
3
SPI
VGA
CH7317
CH7318
DVI
LVDS
ALC886
GLAN
(RTL8111DL)
GLAN
SDVO
Interface
USB
Interface
LVDS
Interface
W83627DHG-P
USB 2.0 8x
Serial ATA
Q7
Interface
Connector SDIO SATA II 2x
Interface
PCIe x1
Interface
GPIO 8 Ports
H/W Monitor
CASE Open
CPU/SYS FAN
KB/MS
RS232 2x
SD CARD
Mini PCIe x1
PCIe x1
Front
Audio
SPDIF
A
C
Packing List
1
154.94
160.02
154.94
160.02
157.48
163.83
149.90
134.90
100.90
85.90
0.00
6.35
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
•
•
•
•
•
1
1
1
1
1
Q7-100 board
Serial ATA data cable
I/O shield
QR (Quick Reference)
DVD
Optional Items
•
•
•
•
SATA data cable
Serial ATA power cable
I/O shield
USB port cable
Modules Mini
Qseven
REAR PANEL I/O PORTS
• 2 DB-9 RS232 serial ports
• 1 DB-15 VGA port
• 1 DVI-I port (DVI-D signal)
• 2 RJ45 LAN ports
• 4 USB 2.0/1.1 ports
• Mic-in/Center+Subwoofer, line-in/surround and line out
DAMAGE FREE INTELLIGENCE
• Monitors system temperature and overheat alarm
• Monitors system fan speed and failure alarm
Computer-On-Module
Mechanical Drawing
STORAGE
• 2 SATA 3.0 ports with data transfer rate up to 6Gb/s
• 1 SD/MMC slot
I/O CONNECTORS
• 2 connectors for 4 external USB 2.0/1.1 ports
• 1 LPC connector
• 1 I2C connector
• 1 CAN-bus connector
• 1 LVDS LCD panel connector
- 18/24-bit single channel
• 1 LCD/inverter power connector
• 1 8-bit Digital I/O connector
• 1 front audio connector for line-out and mic-in jacks
• 1 S/PDIF connector
• 2 Serial ATA connectors
• 1 24-pin ATX power connector
• 1 chassis intrusion connector
• 1 front panel connector
• 2 fan connectors
Intel® AtomTM E600 Series
Qseven
Intel® AtomTM E600 Series
Qseven
QB700-B
DDR2
1Gbit x8
DDR2
1Gbit x8
Micrel
KSZ9021RNI
SPI EEPROM
512Kbit
Intel Atom
E6xx
Features
MEMORY
EXPANSION
SPI Flash
16Mbit BIOS
LAN
DIMENSIONS
CAN-bus
PROCESSOR
• Intel® AtomTM
• Intel® AtomTM
• Intel® AtomTM
• Intel® AtomTM
1 GbE LAN
7 USB
2 SATA
E680
E660
E640
E620
:
:
:
:
EXPANSION INTERFACES
• Supports 6 USB ports (USB 1.1/2.0 host controllers)
• Supports 1 USB Client interface
• Supports LPC interface
• Supports SMB and I2C interfaces
• Supports 3 PCIe x1 interfaces
• Supports CAN-bus (Controller-Area Network) interface
QB700-B680
QB700-B660
QB700-B640
QB700-B620
CHIPSET
• Intel® EG20T PCH (Platform Controller Hub)
SYSTEM MEMORY
• Supports memory down (single 32-bit channel)
• Supports DDR2 800MHz
• Supports up to 1GB system memory (default: 512MB)
DDR2
onboard
70.00
Block Diagram
52.00
36.41
18.00
0.00
Mechanical Drawing
Specifications
512MB DDR2 SDRAM onboard
3 PCIe x1
1 LPC, 1 SMBus, 1 I2C, 1 CAN-bus
1 LVDS, 1 SDVO
6 USB 2.0, 1 USB Client
2 SATA 2.0
1 SDIO/MMC
1 LAN
Qseven R1.1
70mm x 70mm (2.76" x 2.76")
Intel EG20T
ONBOARD GRAPHICS FEATURES
• Intel® GMA 600
• Supports up to 400MHz graphics frequency
• Ultra low power integrated 3D graphics
• High definition hardware video decoder and encoder engine
• Supports LVDS and SDVO interfaces
- LVDS: Supports pixel clock depths of 18/24-bit, single channel,
max. pixel clock of 80MHz, equates to 1280x768 @ 60Hz
- SDVO: Up to 160MHz pixel clock, equates to 1280x1024 @ 85Hz
ONBOARD AUDIO FEATURES
• Supports High Definition Audio interface
0.00
2.50
ONBOARD LAN FEATURES
• Integrated Intel® PCH GbE MAC
• One Micrel KSZ9021RNI Ethernet PHY
• Supports 10Mbps, 100Mbps and 1Gbps data transmission
• IEEE 802.3 (10/100Mbps) and IEEE 802.3ab (1Gbps) compliant
21.15
Top View
49.47
Watchdog
56.50
41.11
70.00
67.00
LVDS
3.00
Processor
SDVO
Ø2.50 (*4pcs)
DDR2
Onboard
Max 1GB
HDA
®
Intel Atom™
E6xx Series
SM Bus
SPI
PCIe 3x
PMIC
DC/DC
LDO
PCIe
Chipset
SATA 2x
Model Name
QB700-B680
Intel® EG20T PCH
(Platform
Controller Hub)
I C Bus
20.00
QB700-B660
QB700-B640
CAN Bus
RGMII
POWER CONSUMPTION
• 15.94 W with E680 at 1.6GHz and 512MB DDR2 onboard
OS SUPPORT
• Windows XP Professional x86 & SP3 (32-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
TEMPERATURE
• 0oC to 60oC
HUMIDITY
• 10% to 90%
PCB
• Dimensions
- Qseven form factor
- 70mm (2.76") x 70mm (2.76")
• Compliance
- Qseven specification revision 1.1
CERTIFICATION
• CE
• FCC Class B
• RoHS
Ordering Information
USB Client
2
POWER
• Input: VCC_RTC, 5V standby, 5V
CLK Gen
USB 6x
SDIO/MMC
GbE
SDIO/MMC INTERFACE
• Supports 1 SD/SDIO/MMC
• Supports SDA Standard Ver 1.0, SD memory card specification
Ver 2.0, SDIO card specification Ver 1.0, MMC System
specification Ver 4.1
• Conforms to Secure Digital Host Controller (SDHC) speed class 6
ENERGY EFFICIENT DESIGN
• Supports ACPI 2.0/1.0 specification
• Enhanced Intel® SpeedStep Technology
QB700-B620
Part Number
777-QB7001-310G
777-QB7001-300G
777-QB7001-210G
777-QB7001-200G
777-QB7001-110G
777-QB7001-100G
777-QB7001-010G
777-QB7001-000G
Description
Intel® AtomTM E680, onboard DDR2 1GB
Intel® AtomTM E680, onboard DDR2 512MB
Intel® AtomTM E660, onboard DDR2 1GB
Intel® AtomTM E660, onboard DDR2 512MB
Intel® AtomTM E640, onboard DDR2 1GB
Intel® AtomTM E640, onboard DDR2 512MB
Intel® AtomTM E620, onboard DDR2 1GB
Intel® AtomTM E620, onboard DDR2 512MB
PHY
KSZ9021RNI
Heatsink
Standoff
1.60
1.20
Carrier PCB
20.00
Module PCB
www.dfi.com
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
Packing List
• 1 QB700-B board
• 1 QR (Quick Reference)
• 1 DVD
Optional Items
• Q7-951 carrier board kit
• Heat sink: A71-012000-000G
Modules Mini
Qseven
Bottom View
SERIAL ATA (SATA) INTERFACE
• Supports two Serial ATA interfaces
• SATA speed up to 3Gb/s (SATA 2.0)
BIOS
• 16Mbit SPI Flash BIOS (UEFI BIOS)
Computer-On-Module
LPC
5.00
Atom
QB700-B
Qseven Carrier Board
Qseven Carrier Board
Q7-951
Line-out
LAN
Q7-951
USB 0-1
VGA
COM1
Features
12V DC-in
I2C
DIO
DIO Power
COM2
CAN-bus
Front Audio
Realtek
ALC262
EXPANSION
DISPLAY OUTPUTS
LAN
COM
USB
STORAGE
Mini PCIe
USB Client
MXM
USB 2-3
USB 4-5
SATA1
DIO
DIMENSIONS
Specifications
GRAPHICS FEATURES
• Chrontel CH7317B (SDVO to RGB DAC)
1 Mini PCIe
1 VGA, 1 LVDS
1 LAN
2 COM
6 USB 2.0, 1 USB Client
2 SATA 2.0
1 SDIO/MMC
8-bit DIO
102mm x 147mm (4.02" x 5.79")
AUDIO FEATURES
• Realtek ALC262 audio codec
• 2-channel audio output
SERIAL ATA (SATA) FEATURES
• Two Serial ATA ports
• SATA speed up to 3Gb/s (SATA 2.0)
TPM FEATURES (optional)
• Infineon SLB9635TT12
LVDS
LCD panel
SATA0
External
power
LPC
LCD/Inverter power
7 USB
2 SATA
1 GbE LAN
2 Displays
CAN-bus
For QB700-B
Q7-951
I/O CHIP FEATURES
• Winbond 83627DHG-P controller
• LPC interface
• Supports system fan
• Default I/O port address "2Eh"
DAMAGE FREE INTELLIGENCE
• Monitors system temperature and overheat alarm
• Monitors system fan speed and failure alarm
EXPANSION SLOTS
• 1 SDIO/MMC socket
• 1 Mini PCIe socket
- Supports half/full size Mini PCIe card
QB700-B
TEMPERATURE
• 0oC to 60oC
HUMIDITY
• Operating: 10% to 90%
DIMENSIONS
• 3.5" form factor
• 102mm (4.02") x 147mm (5.79")
CERTIFICATION
• CE
• FCC Class B
• RoHS
142.80
125.82
133.90
103.32
85.47
69.80
43.02
25.11
9.94
0.00
3.20
3.18
0. 00
LPC Bus
Audio Codec
24.47
39.47
USB 6x
USB Client
SATA 2x
73.47
SDIO
88.47
I C Bus
101.82
101.82
85.47
0.00
3.20
142.80
139.47
133.90
95.22
111.34
95.22
USB 2.0
SATA II
Winbond
LPC
TPM (Opt.)
Q7
MXM
Connector
System Fan
Digital I/O
COM 1
COM 2
LVDS
SDVO
Chrontel
CH7317
VGA
Mini PCIe
2
Giga LAN
Packing List
•
•
•
•
•
•
DFI is a UL certified factory. The UL certificate of some models may not be available at the time the Product Guide was printed.
1
1
1
1
1
1
Q7-951 board
Serial ATA data cable
Power cable
COM cable
QR (Quick Reference)
DVD
Optional Items
•
•
•
•
SATA data cable
COM port cable
I/O shield
Power adapter (60W, 12V) : 671-106002-102G
Modules Mini
Qseven
Block Diagram
3.18
0.00
www.dfi.com
BOARD TO BOARD CONNECTORS
• One MXM connector
Computer-On-Module
Mechanical Drawing
REAR PANEL I/O PORTS
• 1 12V DC-in jack
• 1 DB-15 VGA port
• 1 DB-9 RS232 serial port
• 2 USB 2.0/1.1 ports
• 1 RJ45 LAN port
• 1 line-out jack
I/O CONNECTORS
• 2 connectors for 4 external USB 2.0/1.1 ports
• 1 connector for an external RS232/422/485 serial port
• 1 LPC connector
• 1 SMBus connector
• 1 I2C connector
• 1 CAN-bus connector
• 1 USB client connector
• 1 LVDS LCD panel connector
- 18/24-bit single channel
• 1 LCD/inverter power connector
• 1 8-bit Digital I/O connector
• 1 Digital I/O power connector
• 1 audio connector for line-in, line-out and mic-in jacks
• 1 S/PDIF connector
• 2 Serial ATA connectors
• 1 4-pin 12V power connector
• 1 chassis intrusion connector
• 1 front panel connector
• 1 fan connector
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