SBC brochure - Onyx Healthcare
S i ng l e B o ard Co mp ut er
Selection Guide 2016
R e th i n k
usa.onyx-healthcare.com
Healt hcare
Technology
Medical Device ODM/OEM Service
ONYX Healthcare USA, Inc. is an ISO 13485 & 9001 certified and FDA registered manufacturer with
15+ years of medical design experiences, leverages embedded computing technology to design
and manufacture medical grade (UL/EN60601) embedded boards and fanless medical AIO system
platforms as the building block to medical device OEM service .
Why do medical device companies select ONYX?
One Stop Shop Design Maunfacturing Service :
Embedded Board > Open Frame Platform > Fanless Medical All-in-One System
Competitive Design Cost & Shorter Design Cycle:
CE/FCC Class B, EN/UL60601 Certified Medical Computing Prototype Platform
OEM/ODM Customizable CPU, HDD, SSD, Memory, LCD, Touchscreen, WIFI, Private Label, Unit
Color, BIOS, Buttons, Form Factor
Customer Service & Technical Support:
Local Product Development Center & RMA Support (Turnaround Time: ~ 10 Business Days)
Deal Registration Protection: Yes
Product Longevity: 5 ~ 7 Year
Standard Warranty: 2 Years
Extended Warranty: 5+ Years
PACS Image Processing: Hardware/Software DICOM Compliant
Infection Control: Fanless Design, IP65 (Front), IPX1 (Whole)
Safety Certification: CCC, CSA, RoHS, EN/UL60601, CE/FCC Class B
IoT Ready: Windows/Linux/Wind River OS + McAfee Encryption Control
Index
Pico-ITX Boards
PICO-BT01
PICO-CV01
PICO-HD01
PICO-IMX6
BIO-ST01-L1U2
BIO-ST01-M1U1
BIO-ST02-C4M1
3.94” x 2.84”
17
17
18
18
19
19
19
4.35” x 6.5”
20
20
21
21
21
EPIC Boards
About Us
2
Index
3
Single Board Computers
Performance & Expansion Driven Medical ODM
Embedded Motherboards
EMB-BT1
EMB-BT2
EMB-BT4
EMB-BT7
EMB-BSW1
EMB-Q170A
EMB-Q170B
EMB-H110B
EMB-Q87A
EMB-H81A
EMB-H81B
EMB-QM87A
EMB-Q77A
EMB-B75A
EMB-B75B
EMB-QM77
EMB-H61A
EMB-H61B
EMB-QM67
EMB-CV2
EMB-KB1
EMB-A70M
EMB-A50M
IMBI-QM57
EPC-CV1
IMBA-Q87A
IMBA-Q77
IMBA-967
IMBA-H61A
IMBM-Q170A
IMBM-Q87A
IMBM-B75A
IMBM-H61A
IMBM-H61B
6.7” x 6.7”
4.53” x 6.5”
12” x 9.6”
9.6” x 9.6”
4
4
5
5
6
6
6
7
7
7
8
8
8
9
9
9
10
10
10
11
11
11
12
12
12
13
13
13
14
14
14
15
15
15
Compact Boards
PCM-QM77
PCM-LN02
EPIC-BDU7
EPIC-QM77
EPIC-BT07
EPIC-CV07
EPIC-5536
SubCompact Boards
GENE-SKU6
GENE-QM87
GENE-QM77 Rev.A
GENE-QM77 Rev.B
GENE-BSW5
GENE-BT05
GENE-CV05
GENE-1350
3.75” x 4”
22
22
23
23
24
24
25
25
Computer on Modules
Medical Device with Client Proprietary Board
Com Express CPU Modules
4.92” x 3.75”
COM-SKHB6
3.75” x 3.75”
COM-SKUC6
4.92” x 3.75”
COM-QM87
COM-QM77 Rev.B
COM-HM76
3.74” x 3.74”
COM-KB
COM-BT
COM-BYTC2
COM-CV Rev. B
COM-CV Rev.A11
3.31” x 2.17”
NanoCOM-BT
NanoCOM-CV Rev.A
NanoCOM-CV Rev.B
26
26
26
27
27
27
28
28
29
29
30
30
30
SMARC CPU Modules
uCOM-BT
3.23” x 1.96”
31
SMARC Carrier Boards
ECB-960T
6.69” x 6.69”
31
XTX/ETX CPU Modules
XTX-BSW
4.5” x 3.74”
31
Qseven CPU Modules
AQ7-IMX6
AQ7-BT
2.75” x 2.75”
32
32
Qseven Carrier Boards
8” x 5.75”
16
16
ECB-970-A10
ECB-970-A10-01
9.65” x 9.65”
33
33
Embedde d M o th e r b o ard s
Single Board Computers
Model
EMB-BT1
EMB-BT2
System
Processor
Chipset
Intel® Atom™ J1900 Processor (4C, 10W TDP), N2807 (2C, 4.3W TDP),
E3845 (4C , 10W TDP), E3825 Processor (2C, 6W TDP)
Intergrate into SoC
Memory
DDR3L SODIMM x 2 Max 8GB for J1900/E3845,x 1 Max 4GB
for N2807, x 1 Max 8GB for E3825, Non-ECC, un-buffered memory
I/O Chipset
Ethernet
Audio
TPM
Fintech 81866D
Realtek 8111G x 2
Realtek® ALC887
Infineon SLB9635 TT 1.2 (default : No)
mSATA(PCIe+USB optional) + SIM Card (default: No) x 1,
Mini-PCIe x 1, PCIe [x1] x 1
Expansion Slots
Graphics
Graphics Chipset
VGA
DVI
HDMI
Display Port
LVDS
Intel® HD Graphics
Up to 1920 x 1200 @60 Hz
—
Up to 1920 x 1200 @60 Hz
—
Up to 1920 x 1080 @60Hz,
Dual Channel 18/24-bit (via CH7511)
—
Voltage/PWM
eDP
Backlight Control
Environment & Power & ME
12V DC
Power Requirement
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
Operating Humidity
0% ~ 90%RH, non-condensing
Certificate
CE & FCC
Form Factor
Mini-ITX 6.7" x 6.7" (170mm x 170mm)
MTBF (Hours)
111,131
Panel I/O Ports
USB
USB 3.0 x 1, USB 2.0 x 2
Display I/O
VGA x 1, HDMI x 1
Audio I/O
Line-out x 1
LAN I/O
RJ-45 x 2
Serial Port
COM (RS-232) x 1
PS/2 Port
—
Others
DC Jack x 1
Internal I/O Connectors
Storage
SATA3 x 2, SATA2 x 2 (1 colay with mSATA), mSATA x 1
USB
USB 2.0 x 5
Display I/O
LVDS x 1
Audio I/O
AAFP x 1
Serial Port
COM (RS-232) x 4, COM (RS-232/422/485) x 1
PS/2 Port
1
Parallel Port
SPP/EPP Mode
DIO
8-bit programmable (4-in/4-out) x 1
Chassis Fan x 1
FAN
mSATA(PCIe+USB optional) x 1, PCIe [x1] x 1
Intel® HD Graphics
Up to 1920 x 1200 @60 Hz
—
—
—
Dual LVDS, Up to 1920 x 1080 @60Hz,
Dual Channel 18/24-bit (via CH7511)
—
Voltage/PWM
ATX
32°F ~ 140°F (0°C ~ 60°C)
0% ~ 90%RH, non-condensing
CE & FCC
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
290,990
USB 2.0 x 6
VGA x 1
Mic-in x 1, Line-out x 1
RJ-45 x 2
COM (RS-232/422/485) x 1, COM (RS-232) x 2
1
—
SATA2 x 2 (1 colay with mSATA), mSATA x 1
USB 2.0 x 4
LVDS x 2
AAFP x 1, Speaker x 1
COM (RS-232) x 3
—
—
8-bit programmable (4-in/4-out) x 1
Chassis Fan x 1
Power
12V AUX x 1, AT/ATX mode select jumper (default : No) x 1
24-pin ATX x 1, AT/ATX mode select jumper
(default : No) x 1
Others
miniPCIe x 1, PCIe [x1] x 1,
SIM Card Socket(default : No) x 1, LPT x 1,
Front Panel x 1, CMOS jumper x 1
Front Panel x 1, CMOS jumper x 1
Windows® 7/8.1/10 for 32/64-bit, Linux Fedora
Windows® 7/8.1 for 32/64-bit, Linux Fedora
OS
OS Support
4
Intel® Atom™ J1900 Processor (4C @ 2.00 GHz
CPU, 688/854 MHz GFX, 10W TDP)
Intergrate into SoC
DDR3L 1333 MHz SODIMM x 2 up to 8 GB, Non-ECC,
un-buffered memory
Fintech 81866D
Realtek 8111G x 2
Realtek® ALC887
Infineon SLB9635 TT 1.2 (default : No)
Note: All Specifications are subject to change without notice
Model
EMB-BT4
EMB-BT7
System
Processor
Chipset
Memory
I/O Chipset
Ethernet
Audio
TPM
Expansion Slots
Graphics
Graphics Chipset
VGA
DVI
HDMI
Display Port
LVDS
Intel® Atom™ J1900 Processor (4C, 10W TDP),
N2807 (2C, 4.3W TDP)
Intergrate into SoC
DDR3L SODIMM x 2 up to 8 GB for J1900, x 1 up to
4 GB for N2807, Non-ECC, un-buffered memory
Fintech 81866D
Realtek 8111G x 1
Realtek® ALC887
Infineon SLB9635 TT 1.2 (default : No)
mSATA(PCIe+USB optional) + SIM Card (default:
No) x 1, Mini-PCIe x 1
Intel® Atom™ E3845 Processor (4C @ 1.91 GHz
CPU, 542/792 MHz GFX, 10W TDP)
Intergrate into SoC
DDR3L 1333 MHz SODIMM x 1 up to 8 GB, ECC, unbuffered memory
Fintech 81866D
Realtek 8111G x 2
Realtek® ALC887
Infineon SLB9635 TT 1.2 (default : No)
mSATA(PCIe+USB optional) + SIM Card (default:
No) x 1, Mini-PCIe x 1, PCIe [x1] x 1
Intel® HD Graphics
Up to 1920 x 1200 @60 Hz
—
Up to 1920 x 1200 @60 Hz
—
Up to 1920 x 1080 @60Hz, Dual Channel 18/24bit (via CH7511)
—
Voltage/PWM
Intel® HD Graphics
Up to 1920 x 1200 @60 Hz
—
Up to 1920 x 1200 @60 Hz
—
Up to 1920 x 1080 @60Hz, Dual Channel 18/24bit (via CH7511)
—
Voltage/PWM
eDP
Backlight Control
Environment & Power & ME
12V DC
Power Requirement
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
Operating Humidity
0% ~ 90%RH, non-condensing
Certificate
CE & FCC
Form Factor
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
MTBF (Hours)
295,750
Panel I/O Ports
USB 3.0 x 1, USB 2.0 x 2
USB
Display I/O
HDMI x 1
Audio I/O
Line in x 1, Line-out x 1
LAN I/O
RJ-45 x 1
Serial Port
COM (RS-232) x 1
PS/2 Port
—
Others
DC Jack x 1
Internal I/O Connectors
SATA3 x 2, SATA2 x 2 (1 colay with mSATA), mSATA x 1
Storage
USB
USB 2.0 x 5
Display I/O
VGA x 1, LVDS x 1
Audio I/O
AAFP x 1
Serial Port
COM (RS-232) x 4, COM (RS-232/422/485) x 1
PS/2 Port
1
Parallel Port
SPP/EPP Mode
DIO
8-bit programmable (4-in/4-out) x 1
Chassis Fan x 1
FAN
12V DC
32°F ~ 140°F (0°C ~ 60°C)
0% ~ 90%RH, non-condensing
CE & FCC
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
283,770
USB 3.0 x 1, USB 2.0 x 2
VGA x 1, HDMI x 1
Line-out x 1
RJ-45 x 2
COM (RS-232) x 1
—
DC Jack x 1
SATA3 x 2, SATA2 x 2 (1 colay with mSATA), mSATA x 1
USB 2.0 x 5
LVDS x 1
AAFP x 1
COM (RS-232) x 4, COM (RS-232/422/485) x 1
1
SPP/EPP Mode
8-bit programmable (4-in/4-out) x 1
Chassis Fan x 1
Power
12V AUX x 1, AT/ATX mode select jumper (default
: No) x 1
12V AUX x 1, AT/ATX mode select jumper (default
: No) x 1
Others
miniPCIe x 1, PCIe [x1] x 1, SIM Card
Socket(default : No) x 1, LPT x 1, Front Panel x 1,
CMOS jumper x 1
miniPCIe x 1, PCIe [x1] x 1, SIM Card
Socket(default : No) x 1, LPT x 1, Front Panel x 1,
CMOS jumper x 1
Windows® 7/8.1 for 32/64-bit, Linux Fedora
Windows® 7/8.1 for 32/64-bit, Linux Fedora
OS
OS Support
Note: All Specifications are subject to change without notice
Embedde d M o th e r b o ard s
Single Board Computers
usa.onyx-healthcare.com
5
Embedde d M o th e r b o ard s
Single Board Computers
Model
EMB-BSW1
EMB-Q170A
Processor
Intel® Atom™ N3710 Processor, (4C , ~6W TDP) Intel® 6th Gen. Core™ i7/i5/i3, LGA1151 Socket
Intel® Atom™ N3060 Processor, (2C, ~6W TDP) Processor, Max. 65W TDPs
Intel® 6th Gen. Core™ i7/i5/i3, LGA1151 Socket
Processor, Max. 65W TDPs
Chipset
Intergrate into SoC
Intel® Q170
Memory
DDR3L 1600 MHz SODIMM x 2 up to 8 GB, Non- DDR4 2133/1867 MHz SODIMM x 2,
ECC, un-buffered memory
Up to 32GB, Non-ECC, Un-buffered Memory
DDR4 2133/1867 MHz SODIMM x 2,
Up to 32GB, Non-ECC, Un-buffered Memory
I/O Chipset
Ethernet
Audio
TPM
F81866D
NCT6791D
NCT6791D
Intel® i211AT x 2
Intel® 219LM x 1, Intel® i211AT x 1
—
Realtek® ALC3236
Realtek® ALC887
Realtek® ALC887
Infineon SLB96XX TT 1.2/2.0 (default: No)
Infineon SLB96XX TT 1.2/2.0 (default: No)
Infineon SLB96XX TT 1.2/2.0 (default: No)
Expansion Slots
mSATA(PCIe+USB optional) x 1, Mini-PCIe x 1
PCIe [x16] x 1, M.2 M-key(22x80mm) x 1
PCIe [x4] x 1, M.2 M key (22 x 80mm) x 1, M.2 E
key (22 x 30mm) x 1
Intel® HD Graphics
Intel® HD Graphics
Intel® HD Graphics
—
Up to 1920 x 1200 @60 Hz
—
—
—
—
Graphics
Graphics Chipset
VGA
DVI
HDMI
Intel® Q170
Up to 2560 x 1600 @60 Hz, 3840 x 2160 @30Hz —
Up to 4096 x 2160 @24 Hz ; 3840 x 2160 @60
Hz, with Digital Audio
Display Port
—
Up to 4096 x 2160 @24 Hz / 3840 x 2160 @60 Up to 4096 x 2160 @24 Hz / 3840 x 2160 @60
Hz, with Digital Audio
Hz, with Digital Audio
LVDS
Up to 1920 x 1080 @60Hz, Dual Channel 18/24bit (via CH7511)
—
Up to 1920 x 1200 @60 Hz, Dual Channel 18/24bit
—
UP to 4096 x 2340 @60Hz
—
Voltage/PWM
ATX
12V DC
32°F ~140°F (0°C ~ 60°C)
32°F ~140°F (0°C ~ 60°C)
0% ~ 90%RH, non-condensing
0% ~ 90% RH, non-condensing
CE & FCC
CE & FCC
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
—
—
USB 3.0 x 4, USB 2.0 x 2
USB 3.0 x 4
VGA x 1, DP x 3
DP x 2
Mic-in x 1, Line-out x 1
Mic-in x 1, Line-out x 1
RJ-45 x 2
RJ-45 x 2
—
—
1
—
—
DC Jack x 1
SATA3 x 2, M.2 M-key x 1
SATA3 x 4, M.2 M key x 1, M.2 E key x 1
USB 2.0 x 4
USB 2.0 x 6
—
40-pin LVDS x 1, 40-pin eDP x 1
Speaker x 1
AAFP x 1, Speaker x 1
eDP
Up to 2560 x 1440 @60Hz
Backlight Control
Voltage/PWM, use HW control
Environment & Power & ME
12-24V DC (wide range: 12V-5% ~ 24V +10%)
Power Requirement
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
Operating Humidity
0% ~ 90%RH, non-condensing
Certificate
CE & FCC
Form Factor
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
MTBF (Hours)
—
Panel I/O Ports
USB 3.0 x 2
USB
Display I/O
HDMI x 2
Audio I/O
Mic-in x 1, Line-out x 1
LAN I/O
RJ-45 x 2
Serial Port
—
PS/2 Port
—
Others
DC Jack x 1
Internal I/O Connectors
SATA3 x 3 (1 colay with mSATA), mSATA x 1
Storage
USB
USB 3.0 x 2, USB 2.0 x 6
Display I/O
LVDS or eDP x 1
Audio I/O
Speaker x 1
Serial Port
COM (RS-232) x 5, COM (RS-232/422/485) x 1
PS/2 Port
1
Parallel Port
—
DIO
8-bit programmable (4-in/4-out) x 1
FAN
Chassis Fan x 1
6
EMB-Q170B
System
COM (RS-232/422/485) x 1, COM (RS-232) x 1 COM (RS-232/422/485) x 1
—
—
—
—
8-bit programmable (4-in/4-out) x 1
8-bit programmable (4-in/4-out) x 1
CPU Fan x 1, Chassis Fan x 1
CPU Fan x 1, Chassis Fan x 1
Power
12V AUX Power Connector x 1, AT/ATX mode
select jumper (optional) x 1
12V AUX x 1, AT/ATX mode select jumper (default 12V AUX x 1, AT/ATX mode select jumper (default
: No) x 1
: No) x 1
Others
Front Panel x 1, CMOS jumper x 1
Front Panel x 1, Chassis Intrusion x 1, Buzzer x 1, Front Panel x 1, Chassis Intrusion x 1, Buzzer x 1,
CMOS jumper x 1
CMOS jumper x 1
OS
OS Support
Windows® 7/8.1/10 for 32/64-bit, Linux Fedora Windows® 7/8.1/10 for 32/64-bit, Linux Fedora Windows® 7/8.1/10 for 32/64-bit, Linux Fedora
Note: All Specifications are subject to change without notice
Model
EMB-H110B
EMB-Q87A
EMB-H81A
System
Processor
Intel® 6th Gen. Core™ i7/i5/i3, LGA1151 Socket Intel® 4th Gen. Core™ i Series 22nm LGA1150
Processor, Max. 65W TDPs
socket Processor, Max. 65W TDPs
Intel®4th Gen. Core™ i Series 22nm LGA1150
socket Processor, Max. 65W, TDPs
Chipset
Intel® H110
Intel® H81
Memory
DDR4 2133/1867 MHz SODIMM x 2, Up to 32GB, DDR3 1333/1600 MHz SODIMM x 2, Up to 16GB, DDR3 1333/1600 MHz SODIMM x 2, Up to 16GB,
Non-ECC, Un-buffered Memory
Non-ECC, Un-buffered Memory
Non-ECC, Un-buffered Memory
I/O Chipset
Ethernet
Audio
TPM
NCT6791D
NCT6791D
NCT6791D
Realtek 8111G x 2
Intel® I217LM x 1, Intel® I210AT x 1
Realtek 8111G x 2
Realtek® ALC887
Realtek® ALC887
Realtek® ALC887
Infineon SLB96XX TT 1.2/2.0 (default: No)
Infineon SLB96XX TT 1.2/2.0 (default: No)
Infineon SLB9635 TT 1.2
Expansion Slots
PCIe [x1] x 1, mSATA(PCIe+USB optional) x 1,
Mini-PCIe x 1
PCIe [x4] x 1, mSATA(PCIe+USB optional) x 1,
Mini-PCIe x 1
PCIe [x1] x 1, mSATA(PCIe+USB optional) x 1,
Mini-PCIex 1
—
Intel® HD Graphics
Intel® HD Graphics
—
Up to 1920 x 1200 @60 Hz
Up to 1920 x 1200 @60 Hz
—
—
—
Graphics
Graphics Chipset
VGA
DVI
Intel® Q87
HDMI
Up to 4096 x 2160 @24 Hz ; 3840 x 2160 @60 Hz, Up to 4096 x 2160 @24 Hz ; 3840 x 2160 @60 Hz, Up to 4096 x 2160 @24 Hz / 3840 x 2160 @60 Hz,
with Digital Audio
with Digital Audio
with Digital Audio
Display Port
Up to 4096 x 2160 @24 Hz / 3840 x 2160 @60 Hz, Up to 4096 x 2160 @24 Hz ; 3840 x 2160 @60 Hz, Up to 4096 x 2160 @24 Hz / 3840 x 2160 @60 Hz,
with Digital Audio
with Digital Audio
with Digital Audio
LVDS
Up to 1920 x 1200 @60 Hz, Dual Channel 18/24- Up to 1920 x 1200 @60 Hz, Dual Channel 18/24- Up to 1920 x 1200 @60 Hz, Dual Channel 18/24bit colay
bit
bit
eDP
UP to 4096 x 2340 @60Hz
Backlight Control
Voltage/PWM
Environment & Power & ME
12V DC
Power Requirement
Operating Temperature 32°F ~140°F (0°C ~ 60°C)
Operating Humidity
0% ~ 90%RH, non-condensing
Certificate
CE & FCC
Form Factor
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
MTBF (Hours)
—
Panel I/O Ports
USB 3.0 x 4
USB
Display I/O
DP/HDMI (BOM Change) x 2
Audio I/O
Mic-in x 1, Line-out x 1
LAN I/O
RJ-45 x 2
Serial Port
—
PS/2 Port
—
Others
DC Jack x 1
Internal I/O Connectors
SATA3 x 2, mSATA x 1
Storage
USB
USB 2.0 x 4
Display I/O
40-pin LVDS x 1, 40-pin eDP x 1
Audio I/O
AAFP x 1, Speaker x 1
Serial Port
COM (RS-232/422/485) x 1, COM (RS-232) x 1
PS/2 Port
—
Parallel Port
—
DIO
8-bit programmable (4-in/4-out) x 1
FAN
CPU Fan x 1, Chassis Fan x 1
—
—
Voltage/PWM
Voltage/PWM
12-24V DC (wide rage:12V-5%~ 24V+10%)
12-24V DC (wide rage:12V-5%~ 24V+10%)
32°F ~140°F (0°C ~ 60°C)
32°F ~140°F (0°C ~ 60°C)
0% ~ 90%RH, non-condensing
0% ~ 90%RH, non-condensing
CE & FCC
CE & FCC
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
104,363
288,850
USB 3.0 x 4
USB 3.0 x 2, USB 2.0 x 2
HDMI x 1, DP x 1
HDMI x 1, DP x 1
Mic-in x 1, Line-out x 1
Mic-in x 1, Line-out x 1
RJ-45 x 2
RJ-45 x 2
—
—
—
—
DC Jack x 1
DC Jack x 1
SATA3 x 4, mSATA x 1
SATA3 x 2, SATA2 x 1, mSATA x 1
USB 2.0 x 6
USB 2.0 x 6 USB (2 colay with Mini-Card)
VGA x 1, LVDS x 1
VGA x 1, LVDS x 1
AAFP x 1, Speaker x 1, DMIC (optional) x 1
AAFP x 1, Speaker x 1
COM (RS-232) x 2
COM (RS-232) x 1, COM (RS-232/422/485) x 1
1
1
—
—
8-bit programmable (4-in/4-out) x 1
8-bit programmable (4-in/4-out) x 1
CPU Fan x 1, Chassis Fan x 1
CPU Fan x 1, Chassis Fan x 1
Power
12V AUX x 1, AT/ATX mode select jumper (default : 12V AUX x 1, AT/ATX mode select jumper (default : 12V AUX x 1, AT/ATX mode select jumper (default :
No) x 1
No) x 1
No) x 1
Others
Front Panel x 1, Chassis Intrusion x 1, Buzzer x 1,
CMOS jumper x 1
Front Panel x 1, Chassis Intrusion x 1, CMOS
jumper x 1
Front Panel x 1, Chassis Intrusion x 1, Buzzer x 1,
CMOS jumper x 1
Windows® 7/8.1/10 for 32/64-bit, Linux Fedora
Windows® 7/8.1/10 for 32/64-bit, Linux Fedora
Windows® 7/8.1/10 for 32/64-bit, Linux Fedora
OS
OS Support
Note: All Specifications are subject to change without notice
usa.onyx-healthcare.com
Embedde d M o th e r b o ard s
Single Board Computers
7
Embedde d M o th e r b o ard s
Single Board Computers
Model
EMB-H81B
EMB-QM87A
EMB-Q77A
System
Processor
Intel®4th Gen. Core™ i Series 22nm LGA1150
socket Processor, Max. 65W, TDPs
On board Intel® 4th generation BGA 1364
Processor
Intel® 3rd/2nd Generation Core™ I series
LGA1155 socket Processor
Chipset
Intel® H81
Intel® QM87
Intel® Q77 Express Chipset
Memory
DDR3 1333/1600 MHz SODIMM x 2, Up to 16GB, Dual-Channel with 204-pin SDRAM x 2, DDR3L
Non-ECC, Un-buffered Memory
1600/1333, up to 16GB
DDR3 1333/1600 MHz SODIMM x 2, Up to 16GB,
Non-ECC, Un-buffered Memory
I/O Chipset
NCT6791D
Fintek F81866D-I
NCT 6779D
Ethernet
Realtek 8111G x 2
Intel® I217-LM / Realtek RTL 8111E x 2
Intel® 82579LM (Support Intel® I AMT 8.X) x 1,
Intel® 82583V x 1
Audio
TPM
Expansion Slots
Graphics
Graphics Chipset
VGA
DVI
Realtek® ALC887
Realtek® ALC892/886/662
Realtek® ALC887
Infineon SLB9635 TT 1.2
Infineon SLB9635TT 1.2(Optional)
Infineon SLB9635 TT 1.2 (optional)
HDMI
Up to 4096 x 2160 @24 Hz / 3840 x 2160 @60 Hz,
1
with Digital Audio
—
Display Port
Up to 4096 x 2160 @24 Hz / 3840 x 2160 @60 Hz,
—
with Digital Audio
—
PCIe [x1] x 1, mSATA(PCIe+USB optional) x 1, Mini-PCIe x 1 PCIe [x16] x 1, Mini-PCIe x 1
PCIe [x16] x 1, Mini-PCIe(mSATA optional) x 1
Intel® HD Graphics
Intel® Core™i7/i5/i3 + QM87
Intel® HD Graphics
Up to 1920 x 1200 @60 Hz
1
Up to 1920 x 1200 @60Hz (via DVI-I)
—
—
Up to 1920 x 1200 @60Hz
LVDS
Up to 1920 x 1200 @60 Hz, Dual Channel 18/24-bit
eDP
—
Backlight Control
Voltage/PWM
Environment & Power & ME
12-24V DC (wide rage:12V-5%~ 24V+10%)
Power Requirement
Operating Temperature 32°F ~140°F (0°C ~ 60°C)
Operating Humidity
0% ~ 90% R/H, non-condensing
Certificate
CE & FCC
Form Factor
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
MTBF (Hours)
288,850
Panel I/O Ports
USB 3.0 x 2, USB 2.0 x 2
USB
Display I/O
HDMI x 1, DP x 1
Audio I/O
Mic-in x 1, Line-out x 1
LAN I/O
RJ-45 x 2
Serial Port
—
PS/2 Port
—
Others
DC Jack x 1
Internal I/O Connectors
SATA3 x 2, SATA2 x 1, mSATA x 1
Storage
USB
USB 2.0 x 6 USB (2 colay with Mini-Card)
Display I/O
VGA x 1, LVDS x 1
Audio I/O
AAFP x 1, Speaker x 1
Serial Port
COM (RS-232) x 1, COM (RS-232/422/485) x 1
PS/2 Port
1
Parallel Port
—
DIO
8-bit programmable (4-in/4-out) x 1
FAN
CPU Fan x 1, Chassis Fan x 1
1
—
—
—
Voltage/PWM
—
12V DC
ATX
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C)
0% ~ 90% R/H, non-condensing
0% ~ 90% R/H, non-condensing
CE/FCC
CE & FCC
Mini-ITX 6.7” x 6.7” (170mm x 170mm)
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
106,000
95,000
USB 3.0 x 4
USB 3.0 x 2, USB 2.0 x 6
HDMI x 3, VGA x 1
DVI-D x 1, DVI-I x 1
Line-in, Mic-in, Line-out
Mic-in x 1, Line in x 1, Line-out x 1
RJ-45 x 2
RJ-45 x 2
RS-232/422/485 x 1
—
1
—
—
—
SATA3 x 4, SATA 2 x 2, Support RAID 0,1,5,10
SATA3 x 2, SATA2 x 2
USB 3.0 x 2, USB 2.0 x 4
USB 3.0 x 2, USB 2.0 x 1
LVDS x 1
—
—
AAFP x 1, speaker x 1
RS-232 x 4
COM (RS-232) x 1, COM (RS-232/422/485) x 1
—
—
—
—
8-bit programmable (4-in/4-out) x 1
8-bit programmable (4-in/4-out) x 1
CPU Fan x 1, Chassis Fan x 1
CPU Fan x 1, Chassis Fan x 1
Power
12V AUX x 1, AT/ATX mode select jumper (default :
8-pin connector x 1
No) x 1
24-pin ATX x 1, 12V AUX x 1, AT/ATX mode select
jumper x 1
Others
Front Panel x 1, Chassis Intrusion x 1, Buzzer x 1,
CMOS jumper x 1
—
Front Panel x 1, Chassis Intrusion x 1, CMOS
jumper x 1
Windows® 7/8.1/10 for 32/64-bit, Linux Fedora
Windows® 7/8.1 for 32/64-bit, Linux Fedora
Windows® XP 32/64-bit, Windows® 7 32/64-bit
(WHQL), Windows® 8 (WHQL), Linux Fedora
OS
OS Support
8
Note: All Specifications are subject to change without notice
Model
EMB-B75A
EMB-B75B
EMB-QM77
System
Processor
Intel® 3rd/2nd Generation Core™ I series
LGA1155 socket Processor
Intel® 3rd/2nd Generation Core™ I series
LGA1155 socket Processor
Socket Intel® 3rd generation rPGA988 Processor
Chipset
Intel® B75 Express Chipset
Intel® B75 Express Chipset
Intel® QM77
Memory
DDR3 1333/1600 MHz SODIMM x 2, Up to 16GB, DDR3 1333/1600 MHz SODIMM x 2, Up to 16GB, Dual-Channel with 204-pin SDRAM x 2, DDR3
Non-ECC, Un-buffered Memory
Non-ECC, Un-buffered Memory
1600/1333/1066, up to 16GB
I/O Chipset
Ethernet
Audio
TPM
Expansion Slots
Graphics
Graphics Chipset
VGA
DVI
HDMI
Display Port
ITE 8728F
ITE 8728F
ITE IT8728F+Fintek F81216DG
Realtek 8111F x 2
Realtek 8111F x 1
Intel® WG82579LM / Realtek 8111E x 2
Realtek® ALC887
Realtek® ALC887
Realtek® ALC892/886/662
Infineon SLB9635 TT 1.2
—
Infineon SLB9635TT 1.2
PCI-E [x16] x 1
PCIe [x16] x 1
PCIe [x16] x 1, Mini-PCIe x 1, CFast x 1
Intel® HD Graphics
Intel® HD Graphics
Intel® Core™i7/i5/i3 + QM77
Up to 1920 x 1200 @60Hz
Up to 1920 x 1200 @60Hz
1
—
—
1
Up to 1920 x 1080 @60Hz
Up to 1920 x 1080 @60Hz
1 (by SKU)
—
—
2 (by SKU)
LVDS
—
Up to 1920 x 1200 @60 Hz, Dual Channel 18/241
bit, support EDID LVDS autodetect
eDP
—
Backlight Control
—
Environment & Power & ME
ATX
Power Requirement
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
Operating Humidity
0% ~ 90%RH, non-condensing
Certificate
CE & FCC
Form Factor
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
MTBF (Hours)
116,656
Panel I/O Ports
USB 3.0 x 2, USB 2.0 x 2
USB
Display I/O
VGA x 1, HDMI x 3
Audio I/O
Mic-in x 1, Line in x 1, Line-out x 1
LAN I/O
RJ-45 x 2
Serial Port
—
PS/2 Port
2
Others
—
Internal I/O Connectors
SATA3 x 1, SATA2 x 2
Storage
USB
USB 3.0 x 2, USB 2.0 x 4
Display I/O
—
Audio I/O
—
Serial Port
COM (RS-232) x 1, COM (RS-232/422/485) x 1
PS/2 Port
—
Parallel Port
—
DIO
8-bit programmable (4-in/4-out) x 1
FAN
CPU Fan x 1, Chassis Fan x 1
Power
12V AUX x 1, 24-pin ATX x 1
Others
Front panel x 1
OS
OS Support
Windows® XP 32-bit, Windows® 7 32/64-bit,
Linux Fedora
—
—
—
Voltage/PWM
ATX
12V DC
32°F ~ 131°F (0°C ~ 55°C)
32°F ~ 140°F (0°C ~ 60°C)
0% ~ 90%RH, non-condensing
0% ~ 90% R/H, non-condensing
CE & FCC
CE/FCC
Mini-ITX 6.7" x 6.7" (170mm x 170mm)
Mini-ITX 6.7” x 6.7” (170mm x 170mm)
199,397
60,000
USB 3.0 x 2, USB 2.0 x 2
USB 3.0 x 4
VGA x 1, HDMI x 2 (1 optional)
DP x 2 or DP x 1+HDMI x 1, DVI-D x 1
Mic-in x 1, Line in x 1, Line-out x 1
Line-in, Mic-in, Line-out
RJ-45 x 1
RJ-45 x 2
RS-232 x 1
RS-232/422/485 x 1
2
1
—
—
SATA3 x 1, SATA2 x 1
SATA3 x 2, SATA2 x 2, Support RAID 0,1,5,10
USB 2.0 x 4
USB 2.0 x 6
LVDS x 1
VGAx 1, LVDSx 1
—
—
COM (RS-232) x 1
COM (RS-232) x 1
—
—
—
—
8-bit programmable (4-in/4-out) x 1
8-bit programmable (4-in/4-out) x 1
CPU Fan x 1, Chassis Fan x 1
CPU Fan x 1, Chassis Fan x 1
12V AUX x 1, 24-pin ATX x 1
12V AUX x 1
Front panel x 1
—
Windows® XP 32-bit, Windows® 7 32/64-bit,
Linux Fedora
Windows® XP/7 for 32/64-bit, Linux Fedora
Note: All Specifications are subject to change without notice
usa.onyx-healthcare.com
Embedde d M o th e r b o ard s
Single Board Computers
9
Embedde d M o th e r b o ard s
Single Board Computers
Model
EMB-H61A
EMB-H61B
EMB-QM67
System
Processor
Intel® 3rd/2nd Generation Core™ I series, 32nm Intel® 3rd/2nd Generation Core™ I series, 32nm
Integrated Intel® Atom™ processor D2550
LGA1155 socket Processors, up to 35W
LGA1155 socket Processors, up to 35W
Chipset
Intel® H61
Intel® H61
Intel® NM10
Memory
DDR3 1333/1600 MHz SODIMM x 2,
Up to 16GB, Non-ECC, Un-buffered Memory
DDR3 1333/1600 MHz SODIMM x 2,
Up to 16GB, Non-ECC, Un-buffered Memory
SO-DIMM x 2, max. 4GB, DDR3 800/1066 MHz,
non-ECC, un-buffered memory
I/O Chipset
Ethernet
Audio
TPM
Fintek F81866D-I
Fintek F81866D-I
ITE IT8783F
Realtek 8111E x 2
Realtek 8111F x 2
Realtek 8111E x 2
Realtek® ALC887
Realtek® ALC887
VIA 1708S
Infineon SLB9635 TT 1.2
Infineon SLB9635 TT 1.2
—
Expansion Slots
PCIe [x4] x 1,Mini-PCIe(mSATA optional) +
SIM Card x 1
PCIe [x4] x 1,Mini-PCIe(mSATA optional) + SIM
Card x 1
PCIe [x1] x 1, Mini-PCIe(mSATA optional) + SIM
Card x 1
Intel® HD Graphics
Intel® HD Graphics
Intel® HD Graphics
Up to 2048 x 1536 @ 75 Hz
Up to 2048 x 1536 @ 75 Hz
Up to 1920 x 1200 @60 Hz
Up to 1920 x 1200 @60 Hz
—
Up to 1920 x 1200 @60 Hz
Up to 1920 x 1200 @60 Hz
Up to 1920 x 1200 @60 Hz
—
—
—
—
Up to 1920 x 1200 @60 Hz, Dual Channel
18/24-bit
Up to 1920 x 1200 @60 Hz, Dual Channel
18/24-bit
Up to 1440 x 900 @60Hz, Single Channel
18/24 bit
eDP
—
Backlight Control
Voltage/PWM
Environment & Power & ME
12V DC
Power Requirement
Operating Temperature
32~131°F (0~55°C)
Operating Humidity
0% ~ 90%RH, non-condensing
Certificate
CE & FCC
Form Factor
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
MTBF (Hours)
117,673
Panel I/O Ports
USB 2.0 x 6
USB
Display I/O
VGA x 1, DVI-D x 1, HDMI x 1
Audio I/O
Mic-in x 1, Line in x 1, Line-out x 1
LAN I/O
RJ-45 x 2
Serial Port
COM (RS-232/422/485) x 1
PS/2 Port
1
Others
—
Internal I/O Connectors
SATA x 2, mSATA x 1
Storage
USB
USB 2.0 x 2
Display I/O
LVDS x 1
Audio I/O
—
—
—
Voltage/PWM
Voltage/PWM
12V DC
12V DC
32~131°F (0~55°C)
32°F ~ 140°F (0°C ~ 60°C)
0% ~ 90%RH, non-condensing
0% ~ 90%RH, non-condensing
CE & FCC
CE & FCC
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
211,000
178,817
USB 2.0 x 6
USB 2.0 x 4
VGA x 1, HDMI x 2
VGA x 1, DVI-D x 1
Mic-in x 1, Line in x 1, Line-out x 1
Mic-in x 1, Line in x 1, Line-out x 1
RJ-45 x 2
RJ-45 x 2
COM (RS-232/422/485) x 1
COM (RS-232/422/485) x 1, COM (RS-232) x 1
1
—
—
DC Jack x 1
SATA x 2, Mini-Card slot x 1
SATA x 2, mSATA x 1
USB 2.0 x 2
USB 2.0 x 2
LVDS x 1
LVDS x 1
—
—
Serial Port
COM (RS-232) x 5
COM header x 5 (RS-232)
COM header x 3, COM2 External Power
Selection Jumper x 1
PS/2 Port
Parallel Port
DIO
FAN
Power
—
—
1
—
—
LPT header x 1
8-bit programmable (4-in/4-out) x 1
8-bit programmable (4-in/4-out) x 1
8-bit programmable (4-in/4-out) x 1
CPU Fan x 1, Chassis Fan x 1
CPU Fan x 1, Chassis Fan x 1
CPU Fan x 1, Chassis Fan x 1
12V AUX x 1, AT/ATX mode select jumper x 1
12V AUX x 1, AT/ATX mode select jumper x 1
12V AUX x 1, AT/ATX mode select jumper x 1
Others
SIM Card Socket x 1, Front Panel x 1, CMOS
jumper x 1
SIM Card Socket x 1, Front Panel x 1, CMOS
jumper x 1
SIM Card Socket x 1, Front Panel x 1, WDT
Function Switch x 1, CMOS jumper x 1
Windows® XP 32-bit, Windows® 7 32/64-bit,
Linux Fedora
Windows® XP 32-bit, Windows® 7 32/64-bit,
Linux Fedora
Windows® XP/7 32-bit, Linux Fedora
Graphics
Graphics Chipset
VGA
DVI
HDMI
Display Port
LVDS
OS
OS Support
Note
10
Note: All Specifications are subject to change without notice
Model
EMB-CV2
EMB-KB1
EMB-A70M
System
Processor
Intel® Atom™ D2550 B3 Processor Dual Core
1.86 GHz
AMD 1st generation APU SoC (FT3 BGA Package), On board AMD® Embedded R-260H/R-460L
Quad(2G,1.5G), Dual (1.6G,1.0G)
APU(Dual Core) up to 25W
Chipset
Intel® ICH10R
—
Memory
Dual-Channel with 204-pin SDRAM x 2, DDR3
1066, up to 4GB
SO-DIMM x 2, max. 16GB, DDR3(L) 1600/1333 SO-DIMM x 2, DDR3 1333/1066 MHz,
MHz , Non-ECC, un-buffered memory
up to 16GB
I/O Chipset
Ethernet
Audio
TPM
Winbond W83627DHG-P
Fintek F81866D-I
ITE IT8728
Realtek® 8111E x 2
Realtek 8111F x 2
Realtek® 8111E x 2
Via VT1705
Realtek® ALC887 with Amplifier
Realtek® ALC892
—
Infineon SLB9635 TT 1.2 (default: No)
—
Expansion Slots
PCIe [x4] x 1
PCIe [x4] x 1, Mini-PCIe + SIM Card (mSATA
optional) x 1, Mini-PCIe x 1
PCIe [x4] x 1, Mini-PCIe x 1, mSATA x 1
Intel® Atom™ D2550 B3 Processor
Sea Islands Family (Integrated)
AMD® M3/A70M
1
Up to 1920 x 1200 @60 Hz
—
1
Up to 1920 x 1200 @60 Hz
—
—
—
4
—
—
—
1
Up to 1920 x 1080 @60Hz, Dual Channel 18/24
—
bit (via CH7511)
Graphics
Graphics Chipset
VGA
DVI
HDMI
Display Port
LVDS
Embedde d M o th e r b o ard s
Single Board Computers
AMD® M3/A70M
eDP
—
Backlight Control
Voltage
Environment & Power & ME
12V DC
Power Requirement
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
Operating Humidity
0% ~ 90% R/H, non-condensing
Certificate
CE/FCC
Form Factor
Mini-ITX 6.7” x 6.7” (170mm x 170mm)
MTBF (Hours)
107,000
Panel I/O Ports
USB 2.0 x 4
USB
Display I/O
DVI-D x 1, VGA x 1
Audio I/O
Line-in, Mic-in, Line-out
LAN I/O
RJ-45 x 2
Serial Port
RS-232 x 1, RS-232/422/485 x 1
PS/2 Port
—
Others
DC Jack x 1
Internal I/O Connectors
SATA2 x 6
Storage
USB
USB 2.0 x 4
Display I/O
LVDS x 1
Audio I/O
—
Serial Port
—
PS/2 Port
—
Parallel Port
—
DIO
8-bit programmable (4-in/4-out) x 1
FAN
CPU Fan x 1, Chassis Fan x 1
Power
12V AUX x 1
—
—
Voltage/PWM
Voltage
ATX
12V DC
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C)
0% ~ 90%RH, non-condensing
0% ~ 90% R/H, non-condensing
CE & FCC
CE/FCC
Mini-ITX, 6.7” x 6.7” (170mm x 170mm)
Mini-ITX 6.7” x 6.7” (170mm x 170mm)
140,000
88,000
USB 3.0 x 2, USB 2.0 x 2
USB 2.0 x 1
VGA x 1, DVI-D x 1
HDMI x 4
Mic-in x 1, Line-out x 1
Mic-in, Line-out
RJ-45 x 2
RJ-45 x 2
Others
—
SIM Card Socket x 1, Front Panel x 1, Buzzer x 1,
—
CMOS jumper x 1
OS
OS Support
Windows® XP/7 for 32/64-bit, Linux Fedora
Windows® XP/7 for 32/64-bit, Linux Fedora
COM (RS-232/422/485) x 1, COM (RS-232) x 1 —
2
—
—
—
SATA x 2, mSATA x 2
SATA2 x 2
USB 2.0 x 4
USB 3.0 x 2, USB 2.0 x 4
LVDS x 1
—
Speaker x 1
—
COM header x 4 (RS-232)
RS-232 x 1, RS-232/422/485 x 1
—
—
—
—
8-bit programmable (4-in/4-out) x 1
8-bit programmable (4-in/4-out) x 1
CPU Fan x 1, Chassis Fan x 1
CPU Fan x 1, Chassis Fan x 1
12V AUX x 1, 24-pin ATX x 1
12V AUX x 1
Windows® XP/7 for 32/64-bit, Linux Fedora
Note
Note: All Specifications are subject to change without notice
usa.onyx-healthcare.com
11
Embedde d M o th e r b o ard s
Single Board Computers
Model
EMB-A50M
IMBI-QM57
EPC-CV1
System
Processor
On board AMD® Fusion APU T56N/T44R
Socket Intel® Core i rPGA988 Processor
Integrated Intel® Atom™ N2600/N2800
processor
Chipset
AMD® M1/A50M
Intel® QM57
Intel® NM10
Memory
SO-DIMM x 2, DDR3 1066/800 MHz, up to 8GB
Dual-Channel with 204-pin SDRAM x 2, DDR3
1066/800, up to 8GB
SO-DIMM x 1, DDR3 800/1066 MHz, non-ECC,
un-buffered memory
I/O Chipset
Ethernet
Audio
TPM
Expansion Slots
Graphics
Graphics Chipset
VGA
DVI
HDMI
Display Port
LVDS
eDP
ITE IT8771E
ITE IT8728F
Fintek 81866D-I
Realtek® 8111E x 2
Intel® 82577LM / 82574L, Gigabit LAN x 2
Realtek 8111F x 2
Realtek® ALC892
Realtek® ALC888
Realtek 887 x 1, Audio Amplifier EUA 2012A x 1
—
—
—
PCIe [x4] x 1, Mini-PCIe x 1, mSATA x 1
PCIe [x4] x 1, Mini-PCIe x 1, PCI x 1, CF x 1
Mini-PCIe x 2
AMD® M1/A50M
Intel® Core™i7/i5 + QM57
—
—
1
Up to 1920 x 1200 @60 Hz
1
1
—
1
1
Up to 1920 x 1200 @60 Hz
—
—
—
—
1
Up to 1920 x 1280 @60Hz, 18-bit single channel
—
—
—
Backlight Control
Voltage
Voltage
Voltage/ PWM, 1 x DC 5V/12V for LCD backlight
inverter board
12V DC
12V DC
32°F ~ 140°F (0°C ~ 60°C)
14°F ~ 140°F (-10°C ~ 60°C)
0% ~ 90% R/H, non-condensing
0% ~ 90% RH, non-condensing
CE/FCC
CE & FCC class B
Mini-ITX 6.7” x 6.7” (170mm x 170mm)
EPIC Form Factor, 4.53"x6.5" (115mmx165mm)
56,000
228,000
USB 2.0 x 4
USB2.0 x 4
HDMI x 1, DVI-D x 1, VGA x 1
HDMI x 1
Line-in, Mic-in, Line-out
—
RJ-45 x 2
RJ-45 x 2
RS-232 x 1
COM x 1 (RS-232/422/485)
Mini-Din PS/2 K/B and Mouse x 1
—
—
DC Jack x 1
SATA 3.0 Gb/s x 3, Support RAID 0,1,5,10
SATA x 2, mSATA x 2
USB 2.0 x 4
USB 2.0 x 2
LVDSx1
VGA x 1, LVDS x 1
—
Line-out/ Mic-in Pin header x 1, SPDIF x 1
RS-232 x 2, RS-232/422/485 x 1
RS-232 pin header x 3
—
1
—
—
8-bit programmable (4-in/4-out)
8-bit programmable (4-in/4-out) x 1
Environment & Power & ME
12V DC
Power Requirement
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
Operating Humidity
0% ~ 90% R/H, non-condensing
Certificate
CE/FCC
Form Factor
Mini-ITX 6.7” x 6.7” (170mm x 170mm)
MTBF (Hours)
70,000
Panel I/O Ports
USB 2.0 x 6
USB
Display I/O
HDMI x 1, DVI-Dx1
Audio I/O
Line-in, Mic-in, Line-out
LAN I/O
RJ-45 x 2
Serial Port
—
PS/2 Port
1
Others
—
Internal I/O Connectors
SATA2 x 5
Storage
USB
USB 3.0 x 2, USB 2.0 x 4
Display I/O
—
Audio I/O
—
Serial Port
RS-232 x 3, RS-232/422/485 x 1
PS/2 Port
—
Parallel Port
—
DIO
8-bit programmable (4-in/4-out) x 1
FAN
CPU Fan x 1, Chassis Fan x 1
CPU Fan connector(s) (4-pin) x 1, Chassis Fan
connector(s) (4-pin) x 1
Chassis Fan x 1
Power
12V AUX x 1, 24-pin ATX x 1
24-pin ATX connector x 1, 4-pin connector x 1
2-pin 12V DC x 1
Others
—
—
SIM card connector x 1, Front panel x 1, 4-pin
Amplifier connector x 1
Windows® XP/7 for 32/64-bit, Linux Fedora
Windows® XP, Windows® 7 32/64-bit, Linux
Fedora
Windows® XP/7 32-bit, Linux Fedora
OS
OS Support
Note
12
Note: All Specifications are subject to change without notice
Model
IMBA-Q87A
IMBA-Q77
IMBA-967
System
Processor
Intel® 4th Generation Core™ i7/i5/i3/Pentium®/
Celeron® 22nm LGA 1150 socket Processor
Socket Intel® 3rd generation LGA 1155
Processor
Socket Intel® 2rd generation LGA 1155
Processor
Chipset
Intel® Q87
Intel® Q77
Intel® Q67
Memory
240-pin DIMM x 4, max. 32GB, DDR3 1600/1333, Dual-Channel with 240-pin DRAM x 4, DDR3
Dual Channel
1600/1333/1066, up to 32GB
Dual-Channel with 240-pin DRAM x 4, DDR3
1333/1066, up to 32GB
I/O Chipset
NCT6791D, F81216HD
Winbond W83627DHG
Winbond W83627DHG
Ethernet
LAN1: Intel® PHY I217LM Giga LAN, LAN2:
Intel® I210AT Giga LAN
Intel® 82579 / 82583V, Gigabit LAN x 2
Intel® 82579LM / 82574L, Gigabit LAN x 2
Audio
TPM
Realtek® ALC887 (Colay with ALC886)
Realtek® ALC662
Realtek® ALC662
20-1 PIN header for TPM1.2/FW3.19
Infineon SLB9635TT 1.2(Optional)
Infineon SLB9635TT 1.2(Optional)
Expansion Slots
PCIe [x16]x 1, PCIe [x4] x 1, PCI x 5
PCIe [x16] x 1, PCIe [x4] x 1, PCIe [x1] x 2, PCI x PCIe [x16] x 1, PCIe [x4] x 1, PCIe [x1] x 1, PCI x
3
4
Graphics
Intel® HD Graphics
Graphics Chipset
VGA
Up to 1920 x 1200 @60Hz
DVI
Up to 1920 x 1200 @60Hz
HDMI
HDMI 1.4, up to 4096 x 2610 @24Hz
Display Port
DP 1.2, up to 2560 x 1440 @60Hz
LVDS
—
Backlight Control
—
Environment & Power & ME
Intel® Core™i7/i5/i3 + Q77
Intel® Core™i7/i5/i3 + Q67
1
1
1
1
1 (by SKU)
1
2 (by SKU)
—
1
—
Voltage/PWM
Voltage
Power Requirement
24-pin ATX connector x 1, 8 pin ATX 12V Power
connector x 1
12V DC
12V DC
Operating Temperature
Operating Humidity
Certificate
Form Factor
MTBF (Hours)
Panel I/O Ports
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C)
0% ~ 90% RH, non-condensing
0% ~ 90% R/H, non-condensing
0% ~ 90% R/H, non-condensing
CE & FCC Class A
CE/FCC
CE/FCC
ATX, 12" x 9.6" (305 mm x 244 mm)
ATX, 12" x 9.6" (305 mm x 244 mm)
ATX, 12" x 9.6" (305 mm x 244 mm)
86,000
56,000
52,000
USB
USB 3.0 x 4, USB 2.0 port x 2
USB 3.0 x 2 with Type A connectors,
USB 2.0 x 2 with Type A connectors
USB 2.0 x 4 with Type A connectors
Display I/O
DVI-D x 1, HDMI x 1, DP x 1 (or DVI-D x1, HDMIx2,
DP x 2 or DP x 1+HDMI x 1, DVI-D x 1
by BKU)
HDMI x 1, DVI-D x 1, VGA x 1
Audio I/O
LAN I/O
Serial Port
PS/2 Port
Internal I/O Connectors
Line-in, Mic-in, Line-out
Line-in, Mic-in, Line-out
Line-in, Mic-in, Line-out
RJ-45 x 2
RJ-45 x 2
RJ-45 x 2
RS-232/422/485 x 1
RS-232/422/485 x 1
RS-232 x 1
Combo Port (Keyboard & Mouse) x 1
Mini-Din PS/2 K/B and Mouse x 1
Mini-Din PS/2 K/B and Mouse x 1
Storage
SATA 6.0Gb/s x 6, Supports RAID 0/1/5/10
SATA 6.0 Gb/s x 2, SATA 3.0 Gb/s x 4, Support SATA 6.0 Gb/s x 2, SATA 3.0 Gb/s x 4, Support
RAID 0,1,5,10
RAID 0,1,5,10
USB
Display I/O
Audio I/O
Serial Port
PS/2 Port
Parallel Port
DIO
FAN
Power
Others
OS
USB 2.0 x 8
USB 3.0 x 2, USB 2.0 x 6
USB 2.0 x 8
VGA x 1
VGA x 1, LVDS x 1
—
—
—
—
RS-232 header x 5
RS-232 x 5
RS-232 x 3, RS-232/422/485 x 1
—
—
—
LPT connector x 1
—
LPT x 1
8-bit x 1 (In/Out programmable)
8-bit programmable (4-in/4-out)
8-bit programmable (4-in/4-out)
4 pin CPU Fan x 1, 4-pin Chassis Fan x 2
4 pin CPU Fan x 1, 4-pin Chassis Fan x 1
4 pin CPU Fan x 1, 4-pin Chassis Fan x 1
—
24-pin ATX connector x 1, 4-pin connector x 1
24-pin ATX connector x 1, 4-pin connector x 1
—
—
IrDA x 1
OS Support
Windows® 7 32/64-bit, Windows® 8.1 32/64bit, Linux Fedora
Windows® XP, Windows® 7 32/64-bit, Linux
Fedora
Windows® XP 32-bit, Windows® 7 32/64-bit,
Windows® 8 32/64-bit
Embedde d M o th e r b o ard s
Single Board Computers
Note
Note: All Specifications are subject to change without notice
usa.onyx-healthcare.com
13
Embedde d M o th e r b o ard s
Single Board Computers
Model
IMBA-H61A
IMBM-Q170A
IMBM-Q87A
System
Processor
Intel® 6th Generation(Skylake-S) Core™ i7/i5/
Intel® 3rd/ 2nd Generation Core™ i7/i5/i3/
i3/Pentium®/ Celeron® 14nm LGA1151 Socket
Pentium® / Celeron® 22nm LGA 1155 Processors
Processor
Intel® 4th Generation Core™ i7/i5/i3/Pentium®/
Celeron® 22nm LGA 1150 socket Processor
Chipset
Intel® H61
Intel® Q170
Intel® Q87
Memory
240-pin DIMM x 2, max. 16GB,
DDR3 1333/1066/800 , Dual channel
288-pin DIMM x 4, max. 64GB,
DDR4 2133/1867, Dual channel
240-pin DIMM x 4, max. 32GB,
DDR3 1600/1333, Dual channel
I/O Chipset
NCT6776F
NCT6791D, F81216HD
NCT6791D, F81216HD
Ethernet
Realtek RTL8111F Giga LAN x 2
LAN1: Intel® PHY I219LM Giga LAN, LAN2: Intel® LAN1: Intel® PHY I217LM Giga LAN, LAN2: Intel®
I211AT Giga LAN
I210AT Giga LAN
Audio
TPM
Realtek® ALC887 (Colay with ALC886)
Realtek® ALC887 (Colay with ALC886)
Realtek® ALC887 (Colay with ALC886)
20-1 PIN header for TPM1.2/FW3.19
20-1 PIN header for TPM1.2/FW3.19
20-1 PIN header for TPM1.2/FW3.19
Expansion Slots
PCIe [x16] x 1, PCIe [x1]x 2, PCI x 4, Full/Half Size PCIe [x16] x 1, PCIe [x4](open edge) x 1, PCIe[x1] PCIe [x16] x 1, PCIe [x4]x 1, PCI x 2, Half size
Mini-card x 1
(open edge) x 1, PCI x 1
Mini-Card x 1 (PCIe + USB or mSATA optional)
Graphics
Intel® HD Graphics
Graphics Chipset
VGA
Up to 1920 x 1200 @60 Hz
DVI
Up to 1920 x 1200 @60 Hz
HDMI
—
Display Port
—
LVDS
—
Backlight Control
—
Environment & Power & ME
Intel® HD Graphics
Intel® HD Graphics
Up to 1920 x 1200 @60Hz
Up to 1920 x 1200 @60Hz
Up to 1920 x 1200 @60Hz
Up to 1920 x 1200 @60Hz
HDMI 1.4 up to 4096 x 2160 @24Hz
—
—
DP 1.2, up to 3840 x 2160 @60Hz
—
—
—
—
Power Requirement
24-pin ATX connector x 1, 4-pin ATX 12V Power
connector x 1
24-pin ATX connector x 1, 8 pin ATX 12V Power
connector x 1
24-pin ATX connector x 1, 8 pin ATX 12V Power
connector x 1
Operating Temperature
Operating Humidity
Certificate
Form Factor
MTBF (Hours)
Panel I/O Ports
USB
Display I/O
Audio I/O
LAN I/O
Serial Port
PS/2 Port
Internal I/O Connectors
Storage
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C)
0%~90%RH, non-condensing
0% ~ 90% RH, non-condensing
0% ~ 90% RH, non-condensing
CE & FCC Class A
CE & FCC Class A
CE & FCC Class A
ATX, 12" x 9.6" (305 mm x 244 mm)
Micro-ATX, 9.6” x 9.6” (244mm x 244mm)
Micro-ATX, 9.6” x 9.6” (244mm x 244mm)
136,599
—
100,000
USB 2.0 x 4
USB 3.0 x 10
USB 3.0 x 4, USB 2.0 x6
VGA x 1, DVI-D x 1
DVI-I x 1, HDMI x 2
DVI-D x 1, DP x 2, VGA x 1
Line-in, Mic-in, Line-out
Line-in, Mic-in, Line-out
Line-in, Mic-in, Line-out
RJ-45 x 2
RJ-45 x 2
RJ-45 x 2
USB
Display I/O
Audio I/O
Serial Port
PS/2 Port
Parallel Port
DIO
FAN
DB-9 COM x 2 (COM2 support RS-232/422/485) DB-9 COM x 1 (support RS-232/422/485)
—
Keyboard Connector x 1, Mouse Connector x 1
Combo Port (Keyboard & Mouse) x 1
Combo Port (Keyboard & Mouse) x 1
SATA 3.0Gb/s x 4
SATA 6.0Gb/s x 6, Supports RAID 0/1/5/10
SATA 6.0Gb/s x 5, Supports RAID 0/1/5/10;
USB 2.0 x 5
USB 2.0 x 4
Half size Mini-Card (PCIe + USB, mSATA optional)
x 1, USB 2.0 x 2
—
—
—
—
Speaker header x 1 (Line-out)
—
RS-232 header x 4
RS-232 header x 5
RS-232 header x 5, RS-232/422/485 x 1
—
—
—
LPT connector x 1, Support SPP/EPP/ECP Mode —
—
8-bit x 1 (In/Out programmable)
8-bit x 1 (In/Out programmable)
8-bit x 1 (In/Out programmable)
4 pin CPU Fan x 1, 4-pin Chassis Fan x 1
4 pin CPU Fan x 1, 4-pin Chassis Fan x 2
4 pin CPU Fan x 1, 4-pin Chassis Fan x 2
Front panel header x 1, Clear CMOS jumper x
1, TPM header x 1, BIOS flash header (2[x4]P
p=1.27mm) x 1
Front panel header x 1, Clear CMOS jumper x
1, TPM header x 1, BIOS flash header (2[x4]P
p=1.27mm) x 1, Chassis Intrusion x 1
Front panel header x 1, Clear CMOS jumper x
1, TPM header x 1, BIOS flash header (2[x4]P
p=1.27mm) x 1, Chassis Intrusion x 1
Others
OS
—
—
—
OS Support
Windows® XP 32-bit, Windows® 7 32/64-bit,
Windows® 8 32/64-bit
Windows® 7 32/64-bit, Windows® 8.1 64-bit,
Windows® 10 64-bit, ,Linux Fedora 64bit
Windows® 7 32/64-bit, Windows® 8 32/64-bit,
Linux Fedora
Power
Note
14
Note: All Specifications are subject to change without notice
Model
IMBM-B75A
IMBM-H61A
IMBM-H61B
System
Processor
Intel® 3rd/ 2nd Generation Core™ i7/i5/i3/
Intel® 3rd/ 2nd Generation Core™ i7/i5/i3/
Intel® 3rd/ 2nd Generation Core™ i7/i5/i3/
Pentium®/ Celeron® 22nm LGA 1155 Processors Pentium®/ Celeron® 22nm LGA 1155 Processors Pentium®/ Celeron® 22nm LGA 1155 Processors
Chipset
Intel® B75
Memory
240-pin DIMM x 4, max. 32GB, DDR3 1600/1333,240-pin DIMM x 2, max. 16GB, DDR3
Dual channel
1333/1066/800, Dual channel
240-pin DIMM x 2, max. 16GB, DDR3
1333/1066/800, Dual channel
I/O Chipset
Ethernet
Audio
TPM
ITE IT8783F
Fintech 81866D+81216HD
Fintech 81866D+81216HD
Realtek RTL8111F Giga LAN x 2
Realtek RTL8111F Giga LAN x 2
Realtek RTL8111F Giga LAN x 2
Realtek® ALC887
Realtek ALC887
Realtek ALC887
Infineon SLB9635 TT 1.2
—
—
Expansion Slots
PCIe[x16] x 1, PCIe[x4] x 1, PCI x 2
PCIe [x16]x 1, PCIe [x1]x 1, PCI x 1, Half Size MiniPCIe [x16] x 1, PCI x 2, Half Size Mini-Card x 1
Card x 1
Graphics
Intel® HD Graphics
Graphics Chipset
VGA
Up to 1920 x 1200 @60Hz
DVI
—
HDMI
Up to 1920 x 1080 @60Hz
Display Port
—
LVDS
—
Backlight Control
—
Environment & Power & ME
Intel® H61
Intel® H61
Intel® HD Graphics
Intel® HD Graphics
Up to 1920 x 1200 @75Hz
Up to 1920 x 1200 @75Hz
Up to 1920 x 1200 @60 Hz
—
—
—
—
—
Up to 1920 x 1200 @60 Hz
Up to 1920 x 1200 @60 Hz
Voltage/ PWM
Voltage/ PWM
Power Requirement
24-pin ATX connector x 1, 8 pin ATX 12V Power
connector x 1
24-pin ATX connector x 1, 4-pin ATX 12V Power
connector x 1
24-pin ATX connector x 1, 4-pin ATX 12V Power
connector x 1
Operating Temperature
Operating Humidity
Certificate
Form Factor
MTBF (Hours)
Panel I/O Ports
USB
Display I/O
Audio I/O
LAN I/O
Serial Port
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C)
0% ~ 90% RH, non-condensing
0% ~ 80% RH , non-condensing
0% ~ 80% RH , non-condensing
CE & FCC Class A
CE & FCC Class A
CE & FCC Class A
Micro-ATX, 9.6” x 9.6” (244mm x 244mm)
Micro-ATX, 9.6” x 9.6” (244mm x 244mm)
Micro-ATX, 9.6” x 9.6” (244mm x 244mm)
83,621
87,274
—
USB 3.0 x 2, USB 2.0 port x 2
USB 2.0 x 4 port
USB 2.0 port x 4
VGA x 1, HDMI x 3
VGA x 1, DVI-D x 1,
VGA x 2
Line-in, Mic-in, Line-out
Line-in, Mic-in, Line-out
Line-in, Mic-in, Line-out
RJ-45 x 2
RJ-45 x 2
RJ-45 x 2
—
RS232 DB-9 connector x 2
RS232 DB-9 connector x 2
PS/2 Port
Keyboard Mouse Connector x 1, mouse connector
Keyboard Connector x 1, Mouse Connector x 1
x1
Keyboard Connector x 1, Mouse Connector x 1
SATA 6.0Gb/s x 1, SATA 3.0Gb/s x 4
SATA 3.0Gb/s x 3, CFast Socket x 1
SATA 3.0Gb/s x 3, CFast™ Socket x 1
USB 3.0 x 2, USB 2.0 x 4
USB 2.0 x 4
USB 2.0 x 4
—
—
—
—
—
—
RS-232/422/485 x 1, RS-232 header x 4
RS-232/422/485 x 2, RS-232 x9
RS-232/422/485 x 2, RS-232 x9
—
—
—
Internal I/O Connectors
Storage
USB
Display I/O
Audio I/O
Serial Port
PS/2 Port
Parallel Port
DIO
Embedde d M o th e r b o ard s
Single Board Computers
LPT connector x 1, Support SPP/EPP/ECP Mode LPT connector x 1, Support SPP/EPP/ECP Mode LPT connector x 1, Support SPP/EPP/ECP Mode
8-bit x 1 (In/Out programmable)
8-bit x 1 (In/Out programmable)
8-bit x 1 (In/Out programmable)
FAN
4 pin CPU Fan x 1, 4-pin Chassis Fan x 2
4 pin CPU Fan x 1, 4-pin Chassis Fan x 1
4 pin CPU Fan x 1, 4-pin Chassis Fan x 2 (Fan2
optional)
Power
Front panel header x 2, IrDA header x 1, Clear
CMOS jumper x 1, BIOS flash header (2[x4]P
p=1.27mm) x 1
Front panel header x 1, Clear CMOS jumper x 1,
BIOS flash header (2[x4]P p=1.27mm) x 1
Front panel header x 1, Clear CMOS jumper x 1,
BIOS flash header (2[x4]P p=1.27mm) x 1
Others
OS
IrDA x 1
—
—
OS Support
Windows® XP 32/64-bit, Windows® 7 32/64-bit, Windows® XP 32-bit, Windows® 7 32/64-bit,
Linux Fedora
Linux Fedora
Windows® XP 32-bit, Windows® 7 32/64-bit,
Linux Fedora
Note
Note: All Specifications are subject to change without notice
usa.onyx-healthcare.com
15
C o mpa c t Bo a rd s
Single Board Computers
Model
PCM-QM77
PCM-LN02
System
Form Factor
5.25" Compact Board
5.25" Compact Board
CPU
Intel® Core™ i7/i5/i3/Celeron® IVY bridge and Sandy Bridge
(Socket-G2 based)
Onboard Intel® Atom™ N455/D525
CPU Frequency
Up to 2.5 GHz
Up to 1.83 GHz
Chipset
Intel® QM77/HM76
PineView™ D/M DDR3 + ICH8M
Memory Type
DDR3 1066/1333/1600, SODIMM x 2 up to 16G
Onboard 2 GB /4 GB DDR3 667/800
Max. Memory Capacity
8 GB
4 GB
BIOS
UEFI
AMI 8MB
Wake on LAN
Yes
Yes
Watchdog Timer
255 Levels
255 Levels
Power Requirement
ATX/DC12V
+12V & ATX co-lay
Power Supply Type
ATX
ATX/ DC-12V
Power Consumption
(Typical)
—
—
Dimension (L x W)
8" x 5.75" (203mm x 146mm)
8" x 5.75" (203mm x 146mm)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C)
Storage Temperature
-40°F ~ 176°F (-40°C ~ 80°C)
-40°F ~ 176°F (-40°C ~ 80°C)
Operating Humidity
0% ~ 90% relative humidity, non-condensing
0% ~ 90% relative humidity, non-condensing
MTBF (Hours)
60,000
—
Certification
CE/FCC
CE/FCC
VGA/LCD Controller
Intel® Core™ i7/i5/i3 integrated
Integrated
Video Output
CRT, LVDS LCD, DVI-I
CRT, TTL (Optional), or LVDS 18/24 bit
Backlight Inverter Supply
Max. 12V
Max. 12V
Ethernet
Intel® 82579LM x 1, Intel® 82583V x 1, 10/100/1000BaseTX need Pin header for LAN
Intel® 82567V x 1, Intel® 82583V x 1, 10/100/1000Base-TX
x2
Audio
Realtek ALC892, 2.1CH
ALC888-GR, 2 CH
USB Port
USB3.0 x 4, USB 2.0 x 4
USB2.0 x 6
Serial Port
RS-232 x 8, RS-232/422/485 x 2
RS-232 x 5, RS-232/422/485 x 1
Parallel Port
SPP/EPP/ECP x 1 or FDD Function
SPP/EPP/ECP x 1
HDD Interface
SATA 3.0 x 2, SATA 2.0 x 2
UDMA33 x 1, SATA 2 x 2
FDD Interface
—
—
SSD
CFast,mSATA
CompactFlash™
Expansion Slot
PCI-Express [x16], Mini-Card or mSATA, PCI, Mini PCI
Digital I/O (8 in/8 out), iAMT 8.0 support , 5V/12V Voltage
output
PCMCIA x 1, PC-104-Plus, Two mini-card (1st: full size+SIM;
2nd: half size) on the top side; CF x 1, LAN connector Pin
header Type
DIO
16 bit
8 bit
TPM
Optional
Optional
Touch
Optional
—
Display
I/O
Note
16
Note: All Specifications are subject to change without notice
Model
PICO-BT01
P i co -I TX Bo a rd s
Single Board Computers
PICO-CV01
System
Form Factor
Pico-ITX
Pico-ITX
CPU
Onboard Intel® Atom™ E3845 or Celeron® J1900/N2807
Processor SoC
Intel® Atom™ N2600 Processor
CPU Frequency
Up to 2.0 GHz
1.6 GHz Dual Core
Chipset
Intel® E3845/J1900/N2807
N2600 + NM10
Memory Type
204-pin DDR3L SODIMM x 1, DDR3L 1066/1333, Max 8GB
SODIMM DDR3 1066MHz
Max. Memory Capacity
Up to 8GB
2 GB
BIOS
AMI/SPI
AMI 32MB
Wake On LAN
Yes
Yes
Watchdog Timer
1-255 steps by software program
255 Level
Power Requirement
+12VDC
+12V only
Power Supply Type
AT/ATX (default), lockable connector optional
AT / ATX
Power Consumption
(Typical)
Intel® Celeron® J1900 2.0GHz ,DDR3L 1333 MHz 8 GB,
[email protected]+12V
Intel® Atom™ N2600 1.6GHz,DDR3 800MHz 2GB,
[email protected]
System Cooling
Heat-spreader, heatsink or cooler optional
Faness, Heat-sink
Dimension
3.94" x 2.84" (100mm x 72mm)
3.94" x 2.84" (100mm x 72mm)
Gross Weight
0.88lb (0.4 kg)
1.1 lb (0.5 kg)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C),
-4°F ~ 158°F (-20°C ~ 70°C) WiTas I
Storage Temperature
-40˚F ~ 176˚F (-40˚C ~ 80˚C)
-40°F ~ 176°F (-40°C ~ 80°C )
Operating Humidity
0% ~ 90% relative humidity, non-condensing
0% ~ 90% relative humidity, non-condensing
MTBF (Hours)
80,000
95,000
Certification
CE,FCC
CE,FCC
Chipset
Intel® E3845/J1900/N2807
Intel® Atom™ N2600 integration
Resolution
VGA up to 2048 x 1152 @60Hz
or DP up to 2560 x 1400 @60Hz
LVDS (18/24-bit) up to 1400 x 900 @60Hz
VGA up to 1920x1200 @60Hz
uHDMI up to 1920 x 1200 @60Hz
LVDS (18it) up to 1366 x768 @60Hz
LCD Interface
18/24-bit Single LVDS
18-bit Single Channel LVDS with PWM function
Storage/SSD
SATA II 3.0Gb/s x 1, mSATA/Mini-Card (Full-size) x 1
SATA II 3.0Gb/s x 1, mSATA/Mini-Cardx1
Ethernet
Intel® Gigabit Ethernet i211AT 10/100/1000Base-TX x 1
Realtek RTL 8111E, 10/100/1000Base-TX x 1
USB Port
USB 3.0 x 1 Rear IO, USB 2.0 x 1 Rear IO and x 1 Pin header
USB2.0 x 5
Serial Port
RS-232 x 1, RS-232/422/485 x 1 (Ring /+5V/+12V)
RS-232 x 1, RS-232/422/485 x 1
Audio
Line-out x 1
Audio Buzzer x 1, HD Audio Codec(ALC662) for Mic-in/Line-in/
Line-out
DIO
4-bit (2-in, 2-out)
4-bit (2-in, 2-out)
Expansion Slot
Mini-Card (Half-size) x 1, BIO x 1
—
SIM
Option by BIO Board
—
TPM
—
—
Touch
—
—
Display
I/O
Note
Note: All Specifications are subject to change without notice
usa.onyx-healthcare.com
17
P i co -I TX Bo a rd s
Single Board Computers
Model
PICO-HD01
PICO-IMX6
System
Form Factor
Pico-ITX
Pico-ITX
CPU
AMD G-series T40E (Dual Core)/T40R (Single Core)
Processor
Freescale i.MX6 Quad 1.0 GHz Automotive
Freescale I.MX6 Dual Lite 1.0 GHz Ex. Consumer
CPU Frequency
1.0 GHz Dual Core
1.0 GHz Dual/Quad Core
Chipset
G-Series T40E+ A50M
i.MX6
Memory Type
SODIMM DDR3 1066MHz
1GB DDR3
Max. Memory Capacity
4 GB
2GB
BIOS
AMI 32Mb
—
Wake On LAN
YES
—
Watchdog Timer
255 Levels
Integrated
Power Requirement
+12V only
12V
Power Supply Type
AT/ATX
AT
Power Consumption (Typical) AMD T-40R 1.0 GHz, DDR3 1066MHz 2GB, [email protected] DC
[email protected], full load, Quad CPU
System Cooling
Faness, Heat-sink
Fanless, Heat-sink
Dimension
3.94" x 2.84" (100mm x 72mm)
3.94" x 2.84" (100mm x 72mm)
Gross Weight
1.1 lb (0.5 kg)
0.88lb (0.4 kg)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
0°C ~ 60°C, -40°C ~ 85°C (optional)
Storage Temperature
-40˚F ~ 176˚F (-40˚C ~ 80˚C)
-40°C ~ 85°C
Operating Humidity
0% ~ 90% relative humidity, non-condensing
0% ~ 90% relative humidity, non-condensing
MTBF (Hours)
89,000
80,000
Certification
CE,FCC
CE/FCC
Chipset
Integrated decoders in AMD G-series
Freescale i.MX6
Resolution
VGA up to 1920x1200 @60Hz
uHDMI up to 1920 x 1200 @60Hz
LVDS (18it) up to 1366 x768 @60Hz
mHDMI, LVDS
LCD Interface
18it Single Channel LVDS with PWM function
1 CH 18b LVDS x 1
Storage/SSD
SATA II 3.0Gb/s x 1, mSATA/Mini-Card x 1
SATA w/SATA PWR connector, eMMC up to 16GB
Ethernet
Realtek RTL 8111E, 10/100/1000Base-TX x 1
GbE x 1
USB Port
USB2.0 x 5
Up to 4, one OTG port
Serial Port
RS-232 x 1, RS-232/422/485 x 1
4-wire UART x 2
Audio
Audio Buzzer x 1, HD Audio Codec (ALC662) for Mic-in/
Line-in/Line-out
Line-in, Speaker out, mic
DIO
4-bit (2-in, 2-out)
8-bit
Expansion Slot
—
Mini-Card (Quad only), CAN Bus (optional)
SIM
—
Optional
TPM
—
—
Touch
—
—
Display
I/O
Note
18
Note: All Specifications are subject to change without notice
Model
BIO-ST01-L1U2
BIO-ST01-M1U1
P i co -I TX Bo a rd s
Single Board Computers
BIO-ST02-C4M1
System
Form Factor
2.5“ Board
2.5“ Board
2.5“ Board
BIO
80 Pin Hi-speed Board to board
connector
80 Pin Hi-speed Board to board
connector
80 Pin hi-speed Board to board
connector
Power Requirement
Power from MB by BIO
Power from MB by BIO
Power from MB by BIO
Board Size
3.94" x 2.84" (100mm x 72mm)
3.94" x 2.84" (100mm x 72mm)
3.94" x 2.84" (100mm x 72mm)
Gross Weight
200g
200g
200g
Operation Temperature
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F( 0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C)
Storage Temperature
-40 °F ~ 176°F (-40°C ~ 80°C)
-40 °F ~ 176°F (-40°C ~ 80°C)
-40 °F ~ 176°F (-40°C ~ 80°C)
Operation Humidity
0% ~ 90% relative humidity, noncondensing
0% ~ 90% relative humidity, noncondensing
0% ~ 90% relative humidity, noncondensing
PCIe
Realtek 811E, 10/100/1000Base-TX,
RJ-45 x 1
Mini-Card x 1
Mini-Card x 1 (full size)
USB
USB 2.0 x2 on rear I/O
USB 2.0 x 1 on rear I/O
USB 2.0 x 1 on rear I/O
Audio
Dual Channel Audio output with 2W
Amp.
Dual Channel Audio output with 2W
Amp.
—
SIM
—
SIM Slot x 1
SIM Slot x 1
Serial Port
—
—
COM1, COM2 RS-232 by Pin Header,
COM3, COM4 RS-232 on Rear I/O
Expansion Interface
SMbus x 1, GPIO x 1
SMbus x 1, GPIO x 1
I/O
Note
Note: All Specifications are subject to change without notice
usa.onyx-healthcare.com
19
EP I C Bo a rds
Single Board Computers
Model
EPIC-BDU7
EPIC-QM77
System
Form Factor
EPIC
EPIC
CPU
Intel® 5th Generation Intel® Core™ i3/i5/i7 ULT Processor SoC
Intel® Core™ i7/i5/i3/Celeron® (BGA based,<=25W )
CPU Frequency
Up to 2.2 GHz
Up to 2.5 GHz
Chipset
5th Generation Intel® Core™ i series ULT Processor SoC
Intel® PCH QM77/HM76
Memory Type
DDR3L 1333/1600, SODIMM x 1
DDR3 1066/1333/1600, SODIMM x 1
Max. Memory Capacity
Up to 8G
Up to 8G
BIOS
UEFI
UEFI
Wake on LAN
Yes
Yes
Watchdog Timer
255 Levels
255 Levels
Power Requirement
+12V or 9-24V AT/ATX (default)
DC12V
Power Supply Type
AT/ ATX
AT/ ATX
Power Consumption (Typical) 38.8W
—
Dimension (L x W)
4.53" x 6.50" (115mm x 165mm)
4.53" x 6.50" (115mm x 165mm)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C)
Storage Temperature
-40°F ~ 176°F (-40°C ~ 80°C)
-40°F ~ 176°F (-40°C ~ 80°C)
Operating Humidity
0% ~ 90% relative humidity, non-condensing
0% ~ 90% relative humidity, non-condensing
MTBF (Hours)
63,000
—
Certification
CE/FCC
CE/FCC
VGA/LCD Controller
5th Generation Intel® Core™ i series
ULT Processor SoC
Intel® Core™ i7/i5/i3 integrated
Video Output
Triple independent Displays: VGA, LVDS,
DP, LVDS (Optional), eDP (Optional)
CRT+2 LVDS(eDP+Internal LVDS),
CRT+HDMI, CRT+DVI, DVI+HDMI
Backlight Inverter Supply
Max. 12V
Max. 12V
Ethernet
Intel® WGI211AT x 1/ WGI218LM x 1,
RJ-45 x 2
Intel® 82579LM x 1/Intel® 82583V x 1,
10/100/1000Base
Audio
High Definition Audio Interface
High Definition Audio Interface
USB Port
USB2.0 x 4, USB3.0 x 2
USB2.0 x 4, USB3.0 x 2
Serial Port
COM: RS-232 x 4, COM2, COM3: RS232/422/485 x 2 (Ring/+5V/+12V)
RS-232 x 5 , RS-232/422/485 x 1
(COM2)
Parallel Port
SPP/EPP/ECP x 1
SPP/EPP/ECP x 1
HDD Interface
SATA 3.0 x 2
SATA3 x 2
FDD Interface
—
—
SSD
mSATA (Share with half-size Mini-Card
by BIOS)
mSATA x 1
Expansion Slot
Mini Card x 1, SIM x1 (Optional), PCI104 (Optional), 16 bit DIO or LPT, PS/2 x
1
Mini Card x 1, 16 bit DIO or LPT, PCI104
DIO
16 bit
16 bit
TPM
Optional
Optional
Touch
Optional
Optional
Display
I/O
Note
20
Note: All Specifications are subject to change without notice
Model
EPIC-BT07
EPIC-CV07
EP I C Bo a rds
Single Board Computers
EPIC-5536
System
Form Factor
EPIC
EPIC
CPU
Intel® Atom™/ Celeron® E3845/J1900/N2807
Intel® Atom™ D2550/N2800/N2600
AMD Geode™ LX 800
CPU Frequency
Up to 2.0 GHz
1.6 GHz ~ 2.13 GHz
Up to 500 MHz
Chipset
Intel® Atom™/ Celeron® SOC
Intel® Atom™ D2550/N2600 + NM10
AMD CS5536
Memory Type
DDR3L 1333, SODIMM x 1
DDR3 800/1066 MHz
SDRAM DDR333 (DDR400 optional),
SODIMM x 1
Max. Memory Capacity
Up to 8G
Up to 4G
1 GB
BIOS
AMI
AMI 4MB
Award 1 MB
Wake on LAN
Yes
Yes
Yes
Watchdog Timer
255 Levels
255 Level
255 Levels
Power Requirement
+12V or 9-24V AT/ATX(default)
+12V
+12V
Power Supply Type
AT/ ATX
AT/ATX
AT/ATX
Power Consumption
(Typical)
11.8W
—
AMD Geode™ LX 800 500 MHz, DDR333
1 GB, [email protected]
Dimension (L x W)
4.53" x 6.50" (115mm x 165mm)
(165mm x 115mm)
4.53" x 6.50" (115mm x 165mm)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
32 °F ~ 140 °F (0 °C ~ 60 °C);
-4 °F ~ 158 °F (-20 °C ~ 70 °C) For WiTAS 1
32°F ~ 140°F (0°C ~ 60°C)
Storage Temperature
-40°F ~ 176°F (-40°C ~ 80°C)
-40 °F ~ 176 °F (-40 °C ~ 80 °C)
-40°F ~ 176°F (-40°C ~ 80°C)
Operating Humidity
0% ~ 90% relative humidity, noncondensing
10~80%, non-condensing
0% ~ 90% relative humidity, noncondensing
MTBF (Hours)
110,000
—
70,000
Certification
CE/FCC
CE/FCC
CE/FCC
VGA/LCD Controller
Intel® Atom™/ Celeron® SOC
Intel® Atom™ D2550/ N2600 integrated
AMD Geode™ +TI SN75LVDS83
Video Output
CRT, LVDS, HDMI
CRT, LVDS, DVI (optional, need to change connector)
CRT, LVDS & TTL
Backlight Inverter Supply
Max. 12V
Max. 12V
Max. 12V
Ethernet
Intel® i211 Gigabit Ethernet, RJ-45 x 2
Giga LAN Realtek 8111E x 2
10/100Base-TX x 2, Realtek 8100C
(Optional Gigabit LAN)
Audio
High Definition Audio Interface
ALC662 co-lay ALC886/892
High Definition Audio (HDA)
USB Port
USB2.0 x 5, USB3.0 x 1
USB 2.0 x 7
USB2.0 x 4 (Does not support wake-up function)
Serial Port
COM1, 4, 5, 6 : RS-232 x 4, COM2, 3 :
RS-232/422/485 x 1 (Ring/ +5V/ +12V)
RS-232 x 7, RS-232/422/485 x 1 (COM
2)
RS-232 x 3, TTL only/ GPS x1, RS232/422/485 x 1
Parallel Port
SPP/EPP/ECP x 1
SPP/EPP/ECP x 1
SPP/EPP/ECP x 1
HDD Interface
SATA 2.0 x 1
SATA 2.0 x 1
UDMA100 x 1, SATA 1 x 2
FDD Interface
—
None
FDD x 1
SSD
mSATA x 1 (Share with half-size MiniCard by BOM)
mSATA
CompactFlash™
Expansion Slot
Mini-Card x 1, SIM x 1 (Only E3800 series),
PCI-104 x 1 (optional), 16 bit DIO or LPT,
SMbus x 1, I2C x 1 (optional), PS/2 x 1
PCI-104 x 1, Mini-Card x 2 (One support
mSATA), Touch Panel feature (Optional),
8 pin DIO 4 in/4out
PC/104-plus
DIO
16 bit
16 bit
8-bit
TPM
Optional
—
—
Touch
Optional
Yes
—
EPIC
Display
I/O
Note
Note: All Specifications are subject to change without notice
usa.onyx-healthcare.com
21
SubC o mpa c t Bo ar d s
Single Board Computers
Model
GENE-SKU6
GENE-QM87
System
Form Factor
3.5'' SubCompact Board
3.5'' SubCompact Board
CPU
Intel® Skylake-U Processor SoC
Onboard Intel® 4th Generation Core™
i5-4402E Processor
CPU Frequency
Up to 2.4/3.0 GHz
Up to 2.7GHz
Chipset
Intel® Skylake-U Processor SoC
Intel® PCH QM87
Memory Type
DDR4 1866/2133, SODIMM x1
DDR3L 1333/1600, SODIMM x 1
Max. Memory Capacity
Up to 8GB
8 GB
BIOS
UEFI
SPI type
Wake on LAN
Yes
Yes
Watchdog Timer
255 Levels
255 Levels
Power Requirement
+9~36V or +12V
+12V
Power Supply Type
AT/ ATX
AT/ ATX
Power Consumption
(Typical)
—
Intel® Core™ i5-4402E 1.6 GHz, DDR3L
1600 8GB, [email protected]+12V
Dimension (L x W)
5.75" x 4" (146mm x 101.7mm)
5.75" x 4" (146mm x 101.7mm)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 61°C)
Storage Temperature
-40°F ~ 176°F (-40°C ~ 81°C)
-40°F ~ 176°F (-40°C ~ 81°C)
Operating Humidity
0% ~ 90% relative humidity, noncondensing
0% ~ 91% relative humidity, noncondensing
MTBF (Hours)
—
105,000
Certification
CE/FCC
CE/FCC
VGA/LCD Controller
Intel® Skylake-U Processor SoC
Intel® Haswell BGA integrated
Video Output
DVI-I+LVDS, DVI-I + CRT , DVI-I+eDP,
CRT+LVDS, CRT+eDP , DP+LVDS
CRT+LVDS, CRT+HDMI, LVDS+DVI,
LVDS+DVI, LVDS+HDMI, DVI+HDMI,
(Real I/O as GENE-QM77 Rev.B)
Backlight Inverter Supply
Up to 24-bit dual-channel LVDS x 2
Up to 24-bit dual-channel LVDS x 2
Ethernet
Intel® i210, 10/100/1000Base, RJ 45 x2
(Support EtherCAT)
Intel® I211AT, I217LM ,Intel®I210
10/100/1000Base-TX x2
Audio
High Definition Audio Interface
High Definition Audio Interface
USB Port
USB 3.0 x 4, USB 2.0 x 2
USB2.0 x 6, USB3.0 x 2
Serial Port
RS-232 x 1 , RS-232/422/485 x 3
RS-232 x 3 , RS-232/422/485 x 1
Parallel Port
SPP/EPP/ECP x 1 (Option, share with
DIO)
—
HDD Interface
SATA 3.0 x 1, +5V SATA power connector x 1
SATA 3.0 (6 Gbps) x 2
FDD Interface
—
—
SSD
mSATA (share with half-size Mini-Card
and selective by BIOS)
CFast™, mSATA (share with Mini-Card
by jumper),
Expansion Slot
BIO x 1, Mini-Card x 2 and default is mSATA x
1 (half-size), Mini-Card x 1 (Full-size)
Mini-Card x 1
DIO
8 bit
8 bit
TPM
x1
x1
Touch
x1
x1
Display
I/O
Note
22
Note: All Specifications are subject to change without notice
Model
GENE-QM77 Rev. A
GENE-QM77 Rev. B
SubC o mpa c t Bo ar d s
Single Board Computers
System
Form Factor
3.5'' SubCompact Board
3.5'' SubCompact Board
CPU
Intel® Core™ i7/i5/i3/Celeron®
(Socket-G2 based )
Intel® Core™ i7/i3/Celeron® (BGA
based,17W)
CPU Frequency
Up to 2.7 GHz
Up to 1.8 GHz
Chipset
Intel® PCH QM77/HM76
Intel® PCH QM77/MH76
Memory Type
DDR3 1333/1600, SODIMM x 1
DDR3 1066/1333/1600, SODIMM x 1
Max. Memory Capacity
8 GB
8 GB
BIOS
SPI type
SPI type
Wake on LAN
Yes
Yes
Watchdog Timer
255 Levels
255 Levels
Power Requirement
+12V
+12V
Power Supply Type
AT/ ATX
AT/ ATX
Power Consumption
(Typical)
Intel® Core™ i7-3610QE 2.3 GHz, DDR3 1333 8 GB, [email protected]+12V
Intel® Core™ i5-3610ME 2.7 GHz, DDR3 1333 8 GB, [email protected]+12V
Intel® Core™ i7-3555LE 2.5 GHz, DDR3
1333 8 GB, [email protected]+12V
Dimension (L x W)
5.75" x 4" (146mm x 101.6mm)
5.75" x 4" (146mm x 101.6mm)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C)
Storage Temperature
-40°F ~ 176°F (-40°C ~ 80°C)
-40°F ~ 176°F (-40°C ~ 80°C)
Operating Humidity
0% ~ 90% relative humidity, noncondensing
0% ~ 90% relative humidity, noncondensing
MTBF (Hours)
51,000
50,000
Certification
CE/FCC
CE/FCC
VGA/LCD Controller
Intel® Core™ i7/i5/i3/Celeron® integrated
Intel® Core™ i7/i3/Celeron®integrated
Video Output
CRT+LVDS, CRT+DVI, LVDS+DVI,
LVDS+LVDS
CRT+LVDS, CRT+DVI, CRT+HDMI,
LVDS+DVI, LVDS+HDMI, DVI+HDMI,
LVDS+LVDS
Backlight Inverter Supply
Up to 24-bit dual-channel LVDS x 2
Up to 24-bit dual-channel LVDS x 2
Ethernet
Intel® 82579LM , Realtek RTL-8111E,
10/100/1000Base
Intel® 82579LM , Realtek RTL-8111E,
10/100/1000Base
Audio
High Definition Audio Interface
High Definition Audio Interface
USB Port
USB2.0 x 6 , USB3.0 x 2
USB2.0 x 6 , USB3.0 x 2
Serial Port
RS-232 x 3 , RS-232/422/485 x 1
RS-232 x 3 , RS-232/422/485 x 1
Parallel Port
SPP/EPP/ECP x 1 (sharded with DIO, By BIOS setting)
SPP/EPP/ECP x 1 (By BIOS setting)
HDD Interface
SATA 3.0 (6 Gbps) x 2
SATA 3.0 (6 Gbps) x 2
FDD Interface
—
—
SSD
CFast™, mSATA (share with Mini-Card
by BOM)
CFast™, mSATA (share with Mini-Card
by BOM)
Expansion Slot
Mini-Card x 1
Mini-Card x 1
DIO
8 bit
8 bit
TPM
x1
x1
Touch
x1
x1
Display
I/O
Note
Note: All Specifications are subject to change without notice
usa.onyx-healthcare.com
23
SubC o mpa c t Bo ar d s
Single Board Computers
Model
GENE-BSW5
GENE-BT05
System
Form Factor
3.5'' SubCompact Board
3.5'' SubCompact Board
CPU
Intel® Pentium® & Celeron® M/D
Processor SoC
Intel® N2930/N2807/J1900/E3845/
E3825
CPU Frequency
Up to 2.6 GHz
Up to 2.0GHz
Chipset
Intel® Pentium® & Celeron® M/D
Processor SoC
Intel® N2930/N2807/J1900/E3845/
E3825
Memory Type
DDR3L 1600, SODIMM x 1
DDR3L 1066/1333, SODIMM x 1
Max. Memory Capacity
Up to 8 GB
Up to 8G
BIOS
UEFI
UEFI
Wake on LAN
Yes
Yes
Watchdog Timer
255 Levels
255 Level
Power Requirement
+12V
+12V
Power Supply Type
AT/ ATX
AT/ATX
Power Consumption
(Typical)
Intel® Pentium® N3700 @ 2.40 GHz,
DDR 3L 1600MHz, 8G, [email protected]+12V
Intel® N2930, DDR3L 1600MHz 8G,
[email protected]+12V
Dimension (L x W)
5.75" x 4" (146mm x 101.7mm)
5.75" x 4" (146mm x 101.6mm)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C) or WiTAS 2
(E3825)
Storage Temperature
-40°F ~ 176°F (-40°C ~ 81°C)
-40°F ~ 176°F (-40°C ~ 80°C)
Operating Humidity
0% ~ 90% relative humidity, noncondensing
0% ~ 90% relative humidity, noncondensing
MTBF (Hours)
81,000
111,000
Certification
CE/FCC
CE/FCC
VGA/LCD Controller
Intel® Pentium® & Celeron® M/D SoC
Intel® N2930/N2807/J1900/E3845/
E3825
Video Output
LVDS x 2 + VGA (HDMI is optional,
shared with LVDS2)
CRT+LVDS, HDMI+LVDS , CRT+HDMI
Backlight Inverter Supply
Up to 24-bit dual-channel LVDS
Up to 24-bit dual-channel LVDS x 1
Ethernet
Realtek RTL-8111E, 10/100/1000Base,
RJ-45 x2
Intel® I211 (or 210), 10/100/1000BaseTX, RJ-45 x 2
Audio
High Definition Audio Interface
High definition audio interface
USB Port
USB3.0 x 2, USB2.0 x 3
USB2.0 x 3, USB 3.0 x 1
Serial Port
RS-232/422/485 x 2, RS-232 x 4
RS-232 x 2 , RS-232/422/485 x 2
Parallel Port
SPP/EPP/ECP x 1 (Option, share with
DIO)
SPP/EPP/ECP x 1
HDD Interface
SATA 3.0 x 1
SATA 2.0 x 1
FDD Interface
—
—
SSD
mSATA x 1 (half-size)
CFast™ (alternative with mSATA by BOM
and also occupy one Mini-Card location)
Expansion Slot
Mini-Card x 1(Full-size)
Mini-Card x 2 (Full-size x 1, Half-size x 1)
DIO
8 bit
8 bit
TPM
x1
x1
Touch
x 1 (USB interface)
x1
Display
I/O
Note
24
Note: All Specifications are subject to change without notice
Model
Model
GENE-CV05
GENE-1350
SubC o mpa c t Bo ar d s
Single Board Computers
System
System
Form Factor
3.5'' SubCompact Board
Form Factor
3.5"
CPU
Intel® Atom™ D2550/N2800/N2600
Processor
TI OMAP™ 3503/3530 600 MHz
CPU Frequency
Up to 1.86GHz
System Memory
Onboard 128/256 MB (Optional) LP DDR RAM
Chipset
Intel® NM10
Ethernet
Davicom DM9000AEP, 10/100Base-TX, RJ-45 x 1
Memory Type
DDR3 800/1066, SODIMM x 1
Boot Loader
Microsoft Windows® CE 6.0 or Linux - Kernal 2.6.32
Max. Memory Capacity
4 GB
Watchdog Timer
Generate a time-out system reset
BIOS
SPI type
Expansion Interface
Mini-Card (with USB interface only) x 2, Proprietary Expansion Slot x 1
Wake on LAN
Yes
Battery
Lithium battery
Watchdog Timer
255 Levels
Battery Charger
Linear tech LTC4100
Power Requirement
+12V
Power Requirement
+9V to +24V DC
Power Supply Type
AT/ ATX
TI OMAP™ 3530, 128/256 MB LP DDR,
[email protected]+12V
Board Size
5.75"(L) x 4"(W) (146mm x 101.6mm)
Power Consumption
(Typical)
Intel® Atom™ N2800, DDR3 1333 4 GB,
[email protected]+12V
Intel® Atom™ N2600, DDR3 1066 2 GB,
[email protected]+12V
Intel® Atom™ D2550, DDR3 1333 4 GB,
[email protected]+12V
Power Consumption (Typical)
Gross Weight
0.88 lb (0.4 kg)
Operating Temperature
32°F ~ 158°F (0°C ~ 70°C)
-4°F ~ 158°F (-20°C ~ 70°C) for WiTAS 1
-40°F ~ 176°F (-40°C ~ 80°C) for WiTAS 2
Dimension (L x W)
5.75" x 4" (146mm x 101.6mm)
Storage Temperature
-40°F ~ 176°F (-40°C ~ 80°C)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
Operating Humidity
0% ~ 90% relative humidity, non-condensing
Storage Temperature
-40°F ~ 176°F (-40°C ~ 80°C)
MTBF (Hours)
100,000
Operating Humidity
0% ~ 90% relative humidity, noncondensing
Display
VGA/LCD Controller
TI OMAP™ 3
MTBF (Hours)
62,000
Video Output
Certification
CE/FCC
Up to 1280 x 768 for LCD
Up to 1024 x 768 for CRT
Backlight Inverter Supply
I/O
Storage
Output Interface
Universal Serial Bus
Digtial I/O
Up to 18-bit single channel TTL/LVDS LCD
Audio
Line-in, Line-out, Mic-in, Speaker-out (1W Amplifier)
Touch Screen
Supports 4-wire resistive touch screen
Keypad Interface
Supports 6 x 6 matrix keypad
Motion Sensor
—
Display
VGA/LCD Controller
Intel® Atom™ D2550/N2800/N2600 integrated
Video Output
CRT+LVDS, CRT+DVI, LVDS+DVI,
LVDS+LVDS
Backlight Inverter Supply
Up to 24-bit Dual-Channel LVDS
I/O
Ethernet
Realtek RTL 8111E x 2,
10/100/1000Base-TX, RJ-45 x 2
Audio
High definition audio interface
USB Port
USB2.0 x 6
Serial Port
RS-232 x 5 , RS-232/422/485 x 1
Parallel Port
SPP/EPP/ECP x 1 (Shared with COM6 by BOM)
HDD Interface
SATA 2.0 x 1
FDD Interface
—
SSD
CFast™ (alternative with mSATA by BOM
and also occupy one Mini-Card location)
Expansion Slot
Mini-Card x 1
DIO
8 bit
TPM
x1
Touch
x1
256 MB NAND Flash, SD, MicroSD
RS-232 x 1, RS-232/422/485 (auto flow) x 1, TTL UART x 1
USB2.0 Host x 2, USB2.0 Client x 1
Supports 8-bit (Programmable)
Note
Note
Note: All Specifications are subject to change without notice
usa.onyx-healthcare.com
25
C o m Ex pre ss C PU M o d ul es
Computer on Modules
Model
COM-SKHB6
COM-SKUC6
COM-QM87
System
Form Factor
COM Express Basic Size
COM Express Compact Size
COM Express, Basic, Pin-out Type 6
CPU
Onboard 6th Gen Intel® Core™ H-series
Processor, BGA type
Onboard 6th Gen Intel® Core™ U-series
Processor, BGA type
Onboard 4th Generation Intel® Core™ i5
Processor
CPU Frequency
Up to i7-6820EQ 2.8 GHz, vPro™
Up to i7-6600U 2.6 GHz, vPro™
Up to 2.7GHz
Chipset
Onboard 6th Gen Intel® Core™ H-series
Processor
Onboard 6th Gen Intel® Core™ U-series
Processor
Intel® PCH QM87
Memory Type
DDR4, SODIMM x2, ECC Support
DDR3L 1333/1600, SODIMM x 1
DDR3/DDR3L 1333/1600, SODIMM x 2,
Supports Dual Channel function
Max. Memory Capacity
32GB
8 GB
16GB
BIOS
AMI BIOS, Legacy Free
AMI BIOS, Legacy Free
AMI BIOS
Wake on LAN
Yes
Yes
Yes
Watchdog Timer
255 levels
255 levels
255 Levels
Power Requirement
Standard: +12V
Standard: +12V
Nominal: +12V
Power Supply Type
AT/ATX Selection
AT/ATX Selection
AT/ ATX
Power Consumption
(Typical)
Intel® i7-6820EQ 2.8GHz, DDR4 16GB,
[email protected]
Intel® i3-6100U 2.3GHz, 8GB DDR3L,
[email protected]
Intel® Core™ i5-4400E 2.7GHz, DDR3
1600 8GB, 3.21A @+12V
Dimension (L x W)
4.92" x 3.75" (125mm x 95mm)
3.75in x 3.75in (95mm x 95mm)
4.92" x 3.74" (125mm x 95mm)
Operating Temperature
32˚F ~ 140˚F (0˚C ~ 60˚C)
32˚F ~ 140˚F (0˚C ~ 60˚C)
32°F ~ 140°F (0°C ~ 60°C)
Storage Temperature
-4˚F ~ 158˚F (-20˚C ~ 70˚C)
-4˚F ~ 158˚F (-20˚C ~ 70˚C)
-40°F ~ 176°F (-40°C ~ 80°C)
Operating Humidity
10% ~90% relative humidity, noncondensing
10% ~90% relative humidity, noncondensing
0% ~ 90% relative humidity, noncondensing
MTBF (Hours)
80,000
80,000
80,000
Certification
CE/FCC Class A
CE/FCC Class A
CE/FCC
VGA/LCD Controller
Onboard 6th Gen Intel® Core™ H-series
Processor, GT2
Onboard 6th Gen Intel® Core™ U-series
Processor, GT2/GT1
Intel® Core™ i7/i5/i3 Celeron®
integrated
Video Output
VGA, LVDS/eDP, DDI x2
VGA, LVDS/eDP, DDI x 1 (up to 2)
CRT, LVDS LCD, DDI
Backlight Inverter Supply
—
—
—
Ethernet
Intel® I219, Gigabit Ethernet
Intel® I219, Gigabit Ethernet
Intel® 217LM, Gigabit Ethernet
Audio
HD Audio
HD Audio
High definition audio
USB Port
USB2.0 x 8, USB3.0 x 4
USB2.0 x8, USB3.0 x4
USB2.0 x 8, USB3.0 x 4
Serial Port
2-Wire UART (Tx/Rx) x2
2-Wire UART (Tx/Rx) x2
Tx/Rx x 2
Parallel Port
—
—
—
HDD Interface
SATA x 4
SATA x 3 (SATA Port 3 optional)
SATA x 4
Onboard SSD
—
—
—
Display
I/O
Expansion Slot
PCIe[x16] x 1, PCIe[x1] x8, I2C, LPC,
SMBus
PCIe[x1] x8, I2C, LPC, SMBus
PCI-Express[x1] x 7 (Gen 2.0)
PCI-Express[x16] x 1 (Gen 3.0)
Configurable to 2 x 8-lane PCI Express
Ports
Configurable to 1 x 8-lane or 2 x 4-lane
PCI Express Ports
LPC Bus x 1, SM Bus x 1, I2C x 1
DIO
GPIO 8-bit
GPIO 8-bit
GPIO 8-bit
TPM
Optional
Optional
Optional
Note
26
Note: All Specifications are subject to change without notice
Model
COM-QM77 Rev. B
COM-HM76
COM-KB
System
Form Factor
COM Express, Basic, Pin-out Type 6
COM Express, Basic Module, Pin-out
Type 6
COM Express, Compact Module, Pin-out
type 6
CPU
On board 3rd Gen. Intel® Core™ i7/i5/
i3/Celeron® (FCBGA1023)
Socket G2 for Intel® 2nd & 3rd
generation Core™ i7/i5/i3/Pentium®/
Celeron® processor
AMD® Embedded G-Series SoC APU
CPU Frequency
Up to 2.5GHz
Up to i7-3610QE, Quad core, 2.3GHz
Quad(2G), Dual (1.6G)
Chipset
Intel® PCH QM77/HM76
Intel® HM76
AMD® Embedded G-Series SoC
Memory Type
DDR3 1333/1600, SODIMM x 2,
Supports Dual Channel function
Non-ECC DDR3L 1333/1600
AMD GX-420CA SoC with AMD
Radeon™ HD 8400E Graphics(Quad)
GX-217GA SoC with AMD Radeon™ HD
8280E Graphics (Dual)
Max. Memory Capacity
Max. 16GB
Max. 8 GB
MAX. 8 GB
BIOS
AMI BIOS
AMI BIOS
AMI BIOS
Wake on LAN
Yes
Yes
Yes
Watchdog Timer
255 Levels
255 Levels
255 Levels
Power Requirement
Nominal: +12V
Nominal: +12V
Nominal: +12V, Optional: +8.5V ~ +19V
Power Supply Type
AT/ ATX
AT/ ATX
AT/ATX
Power Consumption (Typical)
Intel® Core™ i3-3217UE 1.6GHz, DDR3
1066 4GB, 2.23A @+12V
i7-3610QE 2.3GHz, DDR3L 8GB,
[email protected], [email protected], [email protected]
100% loading on ECB-920A
AMD GX-420CA 2.0GHz, 8GB memory,
100% load, [email protected]
Dimension (L x W)
4.92" x 3.74" (125mm x 95mm)
4.92" x 3.75" (125mm x 95mm)
3.74" x 3.74" (95mm x 95mm)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
- 4°F ~ 158°F (-20°C ~ 70°C) for WiTAS 1
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C)
Storage Temperature
-40°F ~ 176°F (-40°C ~ 80°C)
-40°F ~ 176°F (-40°C ~ 80°C)
-40°F ~ 176°F (-40°C ~ 80°C)
Operating Humidity
0% ~ 90% relative humidity, noncondensing
0% ~ 90% relative humidity, noncondensing
0% ~ 90% relative humidity, noncondensing
MTBF (Hours)
80,000
150,000
80,000
Certification
CE/FCC
CE/FCC
CE/FCC
Intel® Core™ i7/i5/i3 Celeron®
integrated
Intel® Core™ i7/ i5/i3/Celeron®
processor integrated
AMD® eKabini integrated
Video Output
CRT, LVDS LCD, DDI x 2
CRT, 18/24-bit Dual-channel LVDS, DDI
x2
CRT, 24-bit dual channel LVDS, eDP/
LVDS (18 x 1), DDI x 2
Backlight Inverter Supply
—
—
—
Ethernet
Intel® 82579LM, Gigabit Ethernet
Intel® 82579LM for 10/1000/1000Base-TX
Realtek® 8111E, Gigabit Ethernet
Audio
High definition audio
High Definition Audio Interface
High Definition Audio Interface
USB Port
USB 2.0 x 8, USB 3.0 x 4
USB 2.0 x 8, USB 3.0 x 4
USB 2.0 x 8 , USB 3.0 x 2
Serial Port
Tx/Rx x 2
Tx/Rx x 2
Tx/Rx x 2
Parallel Port
—
—
—
HDD Interface
SATA 2 x 4
SATA x 4
SATA x 2
Onboard SSD
—
—
—
Expansion Slot
PCI-Express [x16] x 1, PCI-Express [x1]
x 7, LPC Bus x 1, SM Bus x 1, I2C x 1
PCI-Express [x16] x 1, PCI-Express [1] x
7, LPC bus x 1, SMBus x 1
PCI-Express [x1] x 5, LPC bus x 1,
SMBus x 2, PCI-Express[x4] x 1 (PEG)
DIO
GPIO 8-bit
GPIO 8-bit
GPIO 8-bit
TPM
Optional
—
—
Com Express CPU Modules
Computer on Modules
Display
VGA/LCD Controller
I/O
Note
Note: All Specifications are subject to change without notice
usa.onyx-healthcare.com
27
C o m Ex pre ss C PU M o d ul es
Computer on Modules
Model
COM-BT
COM-BYTC2
System
Form Factor
COM Express, Compact, Pin-out Type 6
COM Express, Compact Size
CPU
Onboard Intel® Atom™ SoC
Onboard Intel® Atom™ Processor SoC
CPU Frequency
Intel® Atom™N2930 (1.83 GHz), N2807 (1.58 GHz), E3845
(1.91 GHz), E3827 (1.75 GHz), E3826 (1.46 GHz), E3825 (1.33
GHz), E3815 (1.46 GHz), J1900 (2.0 GHz)
Up to J1900 1.91 GHz, Quad core
Chipset
Intel® Atom™ SoC
Intel® Atom™ SoC
Memory Type
DDR3L 1066/1333 MHz SODIMM x 1
DDR3L 1066/1333, SODIMM x 1
Max. Memory Capacity
8 GB
8GB
BIOS
AMI BIOS
AMI BIOS, Legacy Free
Wake on LAN
Yes
Yes
Watchdog Timer
255 Levels
255 levels
Power Requirement
Nominal: +12V
Standard: +12V
Power Supply Type
AT/ ATX
AT/ATX Selection
Power Consumption (Typical)
[email protected], full load, J1900
[email protected], full load, N2807
[email protected] 12V with J1900, full load
Dimension (L x W)
3.74" x 3.74" (95mm x 95mm)
3.75" x 3.75" (95mm x 95mm)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
32˚F ~ 140˚F (0˚C ~ 60˚C)
Storage Temperature
-40°F ~ 176°F (-40°C ~ 80°C)
-4˚F ~ 158˚F (-20˚C ~ 70˚C)
Operating Humidity
0% ~ 90% relative humidity, non-condensing
10% ~90% relative humidity, non-condensing
MTBF (Hours)
80,000
80,000
Certification
CE/FCC
CE/FCC Class A
VGA/LCD Controller
Intel® Atom™ SoC Integrated
Intel® Atom™ SoC
Video Output
CRT, LVDS LCD, DDI, eDP (on module, by switch)
VGA, LVDS, eDP
Backlight Inverter Supply
—
—
Ethernet
Intel® 211, Gigabit Ethernet
Intel® I210IT, Gigabit Ethernet
Audio
High Definition Audio Interface
HD Audio
USB Port
USB 2.0 x 6, USB 2.0/3.0 x 1
USB2.0 x 7
Serial Port
Tx/Rx x 2
—
Parallel Port
—
—
HDD Interface
SATA x 2
SATA x 1, PATA x 1
Onboard SSD
—
—
Expansion Slot
PCI-Express[x1] x 3 (Gen 2.0)
LPC Bus x 1
SMbus x 1
PCIe [x1] x 2
PCI x 4
I2C
LPC
SMBus
DIO
GPIO 8-bit
GPIO 8-bit
TPM
Optional
Optional
Display
I/O
Note
28
Note: All Specifications are subject to change without notice
Model
COM-CV Rev. B
COM-CV Rev. A11
System
Form Factor
COM Express, Compact, Pin-out Type 6
COM Express, Compact, Pin-out Type 2
CPU
Onboard Intel® Atom™ D2550/N2600,
Dual Core Processors up to 1.86 GHz
Onboard Intel® Atom™ D2550/N2600
Dual Core Processors up to 1.86 GHz
CPU Frequency
Up to 1.86 GHz
Up to 1.86 GHz
Chipset
Intel® NM10
Intel® NM10
Memory Type
DDR3 1066, SODIMM x 1
DDR3 1066, SODIMM x 1
Max. Memory Capacity
Up to 4 GB
Up to 4 GB
BIOS
AMI BIOS
AMI BIOS
Wake on LAN
Yes
Yes
Watchdog Timer
255 Levels
255 Levels
Power Requirement
Nominal: +12V
Nominal: +12V
Power Supply Type
AT/ ATX
AT/ ATX
Power Consumption (Typical)
Intel® D2550 1.86 GHz, DDR3
1066/4GB, [email protected]+12V
Intel® D2550 1.86 GHz, DDR3
1066/4GB, [email protected]+12V
Dimension (L x W)
3.74" x 3.74" (95mm x 95mm)
3.74" x 3.74" (95mm x 95mm)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C) (D2550/N2600)
-40°F ~ 185°F (-40°C ~ 85°C)(N2600)
32°F ~ 140°F (0°C ~ 60°C)
Storage Temperature
-40°F ~ 176°F (-40°C ~ 80°C)
-40°F ~ 176°F (-40°C ~ 80°C)
Operating Humidity
0% ~ 90% relative humidity, noncondensing
0% ~ 90% relative humidity, noncondensing
MTBF (Hours)
80,000
80,000
Certification
CE/FCC
CE/FCC
VGA/LCD Controller
Intel® Atom™ D2550/N2600 Processor
integrated
Intel® Atom™ D2550/N2600 Processor
integrated
Video Output
CRT/ LVDS LCD/ DDI x 1
CRT/ LVDS LCD
Backlight Inverter Supply
—
—
Ethernet
Intel® 82583V, Gigabit Ethernet
Intel® 82583V, Gigabit Ethernet
Audio
High Definition Audio Interface
High Definition Audio Interface
USB Port
USB2.0 x 8, USB3.0 x 2
USB2.0 x 8
Serial Port
Tx/Rx x 2
From LPC interface
Parallel Port
—
From LPC interface
HDD Interface
SATA 2 x 2
SATA 2 x 4, PATA x 1
Onboard SSD
—
—
Expansion Slot
PCI-Express [x1] x 4
LPC Bus x 1
SM Bus x 1
PCI-Express [x1] x 3
32-bit PCI x 2
LPC Bus x 1
SM Bus x 1
DIO
GPIO 8-bit
GPIO 8-bit
TPM
Optional
—
Com Express CPU Modules
Computer on Modules
Display
I/O
Note
Note: All Specifications are subject to change without notice
usa.onyx-healthcare.com
29
C o m Ex pre ss C PU M o d ul es
Computer on Modules
Model
NanoCOM-BT
NanoCOM-CV Rev. A NanoCOM-CV Rev. B
System
Form Factor
COM Express, Nano Module,Pin-out
Type 10
COM Express, Ultra (Nano) Module, Pinout Type 1
COM Express, Ultra (Nano) Module, Pinout Type 10
CPU
Intel® Atom™/ Celeron® SOC
Processor (M/I)
Onboard Intel® Atom™ N2600
Onboard Intel® Atom™ N2600
CPU Frequency
Up to E3845, 1.91 GHz
Up to 1.6GHz
Up to 1.6GHz
Chipset
Intel® Atom™/ Celeron® SOC Processor
Intel® NM10
Intel® NM10
Memory Type
Onboard DDR3L
Non-ECC DDR3 800
Non-ECC DDR3 800
Max. Memory Capacity
2 GB DDR3L Onboard (up to 4 GB)
2GB, DDR3 onboard
2GB, DDR3 onboard
BIOS
AMI BIOS
AMI BIOS
AMI BIOS
Wake on LAN
Yes
Yes
Yes
Watchdog Timer
255 Levels
255 Levels
255 Levels
Power Requirement
Standard : +12V, AT/ATX
Optional: +5V, AT/ATX
Nominal: +12V
Nominal: +12V
Power Supply Type
AT/ATX
Nominal: +12V, +4.75V ~ +14.7V
(Optional)
Nominal: +12V, +4.75V ~ +14.7V
(Optional)
Power Consumption (Typical) [email protected], full load, E3845
[email protected], full load, N2600
[email protected], full load, N2600
Dimension (L x W)
3.31" x 2.17" (84mm x 55mm)
3.31" x 2.17" (84mm x 55mm)
3.31" x 2.17" (84mm x 55mm)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
-40°F ~ 185°F (-40°C ~ 80°C) by
E3845/E3825
32°F ~ 140°F (0°C ~ 60°C),
-40°F ~ 185°F (-40°C ~ 85°C) for WiTAS
2
32°F ~ 140°F (0°C ~ 60°C),
-40°F ~ 185°F (-40°C ~ 85°C) for
WiTAS 2
Storage Temperature
-40°F ~ 176°F (-40°C ~ 80°C)
-40°F ~ 185°F (-40°C ~ 85°C)
-40°F ~ 185°F (-40°C ~ 85°C)
Operating Humidity
0% ~ 90% relative humidity, noncondensing
0% ~ 90% relative humidity, noncondensing
0% ~ 90% relative humidity, noncondensing
MTBF (Hours)
90,000
80,000
80,000
Certification
CE/FCC
CE/FCC
CE/FCC
VGA/LCD Controller
Intel® Atom SOC
Intel® Atom™ N2600 integrated
Intel® Atom™ N2600 integrated
Video Output
LVDS LCD/eDP, DDI x 1
LVDS, CRT
LVDS, DDI
Backlight Inverter Supply
—
—
—
Ethernet
Intel®
Intel® 82583V
Intel® 82583V
Audio
High Definition Audio Interface
Mic-in, Line-in, Line-out
Mic-in, Line-in, Line-out
USB Port
USB2.0 x 8
USB 2.0 x 8 via NM10
USB 2.0 x 8 via NM10
Serial Port
Tx/Rx x 2
—
TX/RX x 2
Parallel Port
From LPC interface
—
—
HDD Interface
SATA 3.0 Gb/s x 2, SATA 2 x 3
SATA 3.0Gb/s x 2 (one shared with SSD)
SATA 3.0Gb/s x 2 (one shared with SSD)
Onboard SSD
Optional eMMC support
Optional up to 4GB
Optional up to 4GB
Expansion Slot
PCI-Express [x1] x 3, 32-bit PCI x2
LPC Bus x 1
SM Bus x 1
PCI-Express [x1] x 3
LPC bus x 1
SMBus x 1
PCI-Express [x1] x 3
LPC bus x 1
SMBus x 1
DIO
GPIO 8-bit
GPIO 8-bit
GPIO 8-bit
TPM
—
—
—
Display
I/O
Note
30
Note: All Specifications are subject to change without notice
Model
XTX-BSW
ECB-960T
uCOM-BT
System
Form Factor
XTX
CPU
Onboard Intel® Atom™ N3000 Processor SoC,
D1 stepping
CPU Frequency
Up to 1.86GHz
up to 1.91 GHz
—
Chipset
Onboard Intel® Atom™ N3000 Processor SoC,
D1 stepping
Intel® Atom™ E3800 series
—
Memory Type
DDR3L 1066 MHz, SODIMM x 1
Onboard DDR3L
—
Max. Memory Capacity
8 GB
2 GB (optional to 4 GB)
—
BIOS
AMI BIOS
AMI BIOS
—
Wake on LAN
Yes
No
—
Watchdog Timer
255 Levels
255 Levels
—
Power Requirement
+5V
Normal: 3.3V - 5V
+12V DC; +8~20VDC-in on seperate connector
Power Supply Type
AT/ ATX
SMARC Version 1.1
Intel® Atom™ SOC Processor
Mini-ITX form Factor (170mmx 170mm)
—
AT/ ATX
—
Power Consumption (Typical) —
[email protected], full load, E3845
—
Dimension (L x W)
4.5" x 3.74" (114mm x 95mm)
3.23" x 1.96" (82 x 50 mm)
6.69" x 6.69" (170mm x 170mm)
Operating Temperature
32°F ~ 140°F (0°C ~ 60°C)
32 °F ~ 140 °F (0 °C ~ 60 °C)
32 °F ~ 140 °F (0 °C ~ 60 °C)
Storage Temperature
-40°F ~ 176°F (-40°C ~ 80°C)
-40°F ~ 185°F (-40°C ~ 85°C)
-4 °F ~ 158 °F (-20 °C ~ 70 °C)
Operating Humidity
0% ~ 90% relative humidity, non-condensing
0% ~ 90% relative humidity, non-condensing
10% ~ 80% relative humidity, non-condensing
MTBF (Hours)
80,000
80,000
80,000
Certification
CE/FCC
CE/FCC
—
VGA/LCD Controller
Intel® Atom™ N3000 Processor integrated
Intel® Atom SOC
—
Video Output
CRT, LVDS LCD, DP (optional)
24-bit LVDS LCD/eDP, HDMI
18/24-bit Single channel LVDS
Backlight Inverter Supply
—
—
—
Ethernet
Realtek 8105E, 10/100Base-TX
Intel® I211AT, 10/1000/1000Base-TX
—
Audio
Realtek ALC892
HD Audio x 1
Line-in, Line-out, Microphone
USB Port
USB2.0 x 5
USB3.0 x 1, USB2.0 x 2
USB3.0 x 1, USB2.0 x 5
Serial Port
2
UART x 2 (1 for TX/RX/RTS#/ CTS#; 1 for TX/RX)
2-wire x 1, 4-wire x 1
Parallel Port
1
—
—
HDD Interface
SATA x 2 (one shared with PATA), PATA x 1
SATA x 2
SATA x 1
FDD Interface
—
—
—
SSD
—
Optional for onboard eMMC
—
PCI Express [x1] x 2, PCI
PCI Express [x1] x 3
I2C, SMBus x 1, SDIO
SPI x 2, SPI 0 for boot only
PCI-Express [x1] x 3 via adapter card
DIO
—
GPIO, 9 bit (up to 12 bit)
—
TPM
—
—
—
Note
LPC not supported
—
microSD card x 1
I2C:Client mode
Display
SMARC CUP Module and Carrier Board, XTX CPU Module
Computer on Modules
I/O
Expansion Slot
Note: All Specifications are subject to change without notice
usa.onyx-healthcare.com
31
Qsev en C P U M o d ul es
Computer on Modules
Model
AQ7-IMX6
AQ7-BT
System
Form Factor
Qseven Rev. 2.0
Qseven Rev.2.0
CPU
Freescale® i.MX6 SoC Processor
Intel® Atom™ SOC Processor
CPU Frequency
1.0 GHz (Dual lite), 1.2 GHz(Quad)
up to 1.91GHz
Chipset
Freescale® i.MX6 Quad 1.0GHz Processor
Freescale® i.MX6 Quad 1.2GHz Processor
Freescale® i.MX6 Dual Lite 800MHz Processor
Intel® Atom™ E3800 series
Memory Type
Onboard DDR3 1066MHz (Quad)
Onboard DDR3 800MHz (Dual lite)
Onboard DDR3L
Max. Memory Capacity
Onboard DDR3 1066MHz, 1GB, up to 2GB (Quad)
BIOS
—
AMI BIOS
Wake on LAN
No
No
Watchdog Timer
255 level (per levelo 0.5 sec)
255 Levels
Power Requirement
+5V
+5V
Power Supply Type
AT/ ATX
AT/ ATX
Power Consumption (Typical)
Freescale iMX6 Quad 1.2GHZ, DDR3 1GB,
eMMC 8GB, 5.375W (w/ECB-970)
[email protected], full load, E3845
Dimension (L x W)
2.75" x 2.75" (70mm x 70mm)
2.75" x 2.75" (70mm x 70mm)
Operating Temperature
32 °F ~ 140 °F (0 °C ~ 60 °C)
-40 °F ~ 185 °F (-40 °C ~ 80 °C) WiTAS 2
32 °F ~ 140 °F (0 °C ~ 60 °C)
-40 °F ~ 185 °F (-40 °C ~ 80 °C) by E3825
Storage Temperature
-40°F ~ 185°F (-40°C ~ 85°C)
-40°F ~ 185°F (-40°C ~ 85°C)
Operating Humidity
0% ~ 90% relative humidity, non-condensing
0% ~ 90% relative humidity, non-condensing
MTBF (Hours)
100,000
80,000
Certification
CE/FCC
CE/FCC
Onboard DDR3 800MHz, 1GB, up to 2GB (Dual lite)
2GB (Optional to 4 GB)
Display
VGA/LCD Controller
Freescale® i.MX6 Quad 1.0GHz Processor
Freescale® i.MX6 Quad 1.2GHz Processor
Intel® Atom™ SOC
Freescale® i.MX6 Dual Lite 800MHz Processor
Video Output
Backlight Inverter Supply
LVDS x 2 (24-bit x 1)/ LVDS x 1 (24-bit x 2), HDMI 1.4 24-bit LVDS LCD, DDI x 1
—
—
Ethernet
Micrel® KSZ9021RNI, 10/1000/1000Base-TX
Intel® I210IT, 10/1000/1000Base-TX
Audio
I2S x 1
High Definition Audio Interface
USB Port
USB 2.0 x 5 (Shared with USB OTG client x 1)
USB 2.0 x 6, USB 3.0 x 1
Serial Port
4-Wire UART x 1
4-Wire UART x 1, 2-wire UART x 1
Parallel Port
—
—
HDD Interface
SATA 3.0GB/s x 1 (Quad)
SATA x 2, 1 share with onboard SSD
FDD Interface
—
—
SSD
eMMC x 1 (optional)
Optional
Expansion Slot
PCI Express [x1] x 1
CAN Bus x 1
I2C x 1
SDIO x 1
PCI Express [x1] x 3
LPC Bus x 1(shared with GPIO)
SMbus x 2
DIO
8 bit
GPIO 8-bit (shared w/ LPC, optional)
TPM
—
—
I/O
Note
32
Note: All Specifications are subject to change without notice
Model
ECB-970-A10
ECB-970-A10-01
System
X86 (A10)
ARM (A10-01)
Form Factor
Micro ATX
Micro ATX
I/O Chipset
—
—
Ethernet
10/100/1000Base-TX, RJ-45 x 1 (From CPU module)
10/100/1000Base-TX, RJ-45 x 1 (From CPU module)
Expansion
Interface PCI-E [x4] x 1(For Super I/O Card only), LPC
Connector x 1
PCI-E [x1] x 1
Power Requirement
+5V DC
+5V DC
Power Consumption (Typical) —
3~5 Watt @5V
Board Size
9.65" x 9.65" (243.84mm x 243.84mm)
9.65" x 9.65" (243.84mm x 243.84mm)
Gross Weight
1.32 lb (0.6 kg)
1.32 lb (0.6 kg)
Operation Temperature
32°F ~ 140°F (0°C ~ 60°C)
32°F ~ 140°F (0°C ~ 60°C)
Storage Temperature
-40°F ~ 185°F (-40°C ~ 85°C)
-40°F ~ 185°F (-40°C ~ 85°C)
Operation Humidity
0% ~ 90% relative humidity, non-condensing
0% ~ 90% relative humidity, non-condensing
MTBF (Hours)
75,000
75,000
VGA/LCD Controller
VGA x 1
—
Video Output
18-bit Single Channel LVDS
24-bit Dual-Channel LVDS
Backlight Inverter Supply
—
LVDS x 2, eDP x 2, HDMI x 1
Storage
SATA x 2, SDIO x 1
SATA 2 x 1
Serial Port
RS-232 x 1, RS-232/422/485 x 1
One, For debug only
Parallel Port
—
—
USB
USB 2.0 x 8, USB 3.0 x 2
USB 2.0 x 5 (one shared with USB OTG)
PS/2 Port
—
—
I2C
—
1
Audio
Line-out, Microphone
Headphone
Debug LED
Port 80
—
Qseven Carrier Boards
Computer on Modules
Display
I/O
Note
Note: All Specifications are subject to change without notice
usa.onyx-healthcare.com
33
M emo
34
Memo
Note: All Specifications are subject to change without notice
N o t e : A l l S p e c i fi c a t i o n s a r e s u b j e c t t o c h a n g e w i t h o u t n o t i c e
Note: All Specifications are subject to change without notice
N o t e : A l l S p e c i fi c a t i o n s a r e s u b j e c t t o c h a n g e w i t h o u t n o t i c e
usa.onyx-healthcare.com
usa.onyx-healthcare.com
M emo
Memo
35
Onyx Healthcare USA, Inc
America Headquarter
324 West Blueridge Ave.
Orange, CA 92865
Tel: +1-714-792-0774
Fax: +1-714-792-0481
E-mail: [email protected]
Signle Board Computer
Selection Guide 2016
usa.onyx-healthcare.com
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