SBC brochure - Onyx Healthcare
S i ng l e B o ard Co mp ut er Selection Guide 2016 R e th i n k usa.onyx-healthcare.com Healt hcare Technology Medical Device ODM/OEM Service ONYX Healthcare USA, Inc. is an ISO 13485 & 9001 certified and FDA registered manufacturer with 15+ years of medical design experiences, leverages embedded computing technology to design and manufacture medical grade (UL/EN60601) embedded boards and fanless medical AIO system platforms as the building block to medical device OEM service . Why do medical device companies select ONYX? One Stop Shop Design Maunfacturing Service : Embedded Board > Open Frame Platform > Fanless Medical All-in-One System Competitive Design Cost & Shorter Design Cycle: CE/FCC Class B, EN/UL60601 Certified Medical Computing Prototype Platform OEM/ODM Customizable CPU, HDD, SSD, Memory, LCD, Touchscreen, WIFI, Private Label, Unit Color, BIOS, Buttons, Form Factor Customer Service & Technical Support: Local Product Development Center & RMA Support (Turnaround Time: ~ 10 Business Days) Deal Registration Protection: Yes Product Longevity: 5 ~ 7 Year Standard Warranty: 2 Years Extended Warranty: 5+ Years PACS Image Processing: Hardware/Software DICOM Compliant Infection Control: Fanless Design, IP65 (Front), IPX1 (Whole) Safety Certification: CCC, CSA, RoHS, EN/UL60601, CE/FCC Class B IoT Ready: Windows/Linux/Wind River OS + McAfee Encryption Control Index Pico-ITX Boards PICO-BT01 PICO-CV01 PICO-HD01 PICO-IMX6 BIO-ST01-L1U2 BIO-ST01-M1U1 BIO-ST02-C4M1 3.94” x 2.84” 17 17 18 18 19 19 19 4.35” x 6.5” 20 20 21 21 21 EPIC Boards About Us 2 Index 3 Single Board Computers Performance & Expansion Driven Medical ODM Embedded Motherboards EMB-BT1 EMB-BT2 EMB-BT4 EMB-BT7 EMB-BSW1 EMB-Q170A EMB-Q170B EMB-H110B EMB-Q87A EMB-H81A EMB-H81B EMB-QM87A EMB-Q77A EMB-B75A EMB-B75B EMB-QM77 EMB-H61A EMB-H61B EMB-QM67 EMB-CV2 EMB-KB1 EMB-A70M EMB-A50M IMBI-QM57 EPC-CV1 IMBA-Q87A IMBA-Q77 IMBA-967 IMBA-H61A IMBM-Q170A IMBM-Q87A IMBM-B75A IMBM-H61A IMBM-H61B 6.7” x 6.7” 4.53” x 6.5” 12” x 9.6” 9.6” x 9.6” 4 4 5 5 6 6 6 7 7 7 8 8 8 9 9 9 10 10 10 11 11 11 12 12 12 13 13 13 14 14 14 15 15 15 Compact Boards PCM-QM77 PCM-LN02 EPIC-BDU7 EPIC-QM77 EPIC-BT07 EPIC-CV07 EPIC-5536 SubCompact Boards GENE-SKU6 GENE-QM87 GENE-QM77 Rev.A GENE-QM77 Rev.B GENE-BSW5 GENE-BT05 GENE-CV05 GENE-1350 3.75” x 4” 22 22 23 23 24 24 25 25 Computer on Modules Medical Device with Client Proprietary Board Com Express CPU Modules 4.92” x 3.75” COM-SKHB6 3.75” x 3.75” COM-SKUC6 4.92” x 3.75” COM-QM87 COM-QM77 Rev.B COM-HM76 3.74” x 3.74” COM-KB COM-BT COM-BYTC2 COM-CV Rev. B COM-CV Rev.A11 3.31” x 2.17” NanoCOM-BT NanoCOM-CV Rev.A NanoCOM-CV Rev.B 26 26 26 27 27 27 28 28 29 29 30 30 30 SMARC CPU Modules uCOM-BT 3.23” x 1.96” 31 SMARC Carrier Boards ECB-960T 6.69” x 6.69” 31 XTX/ETX CPU Modules XTX-BSW 4.5” x 3.74” 31 Qseven CPU Modules AQ7-IMX6 AQ7-BT 2.75” x 2.75” 32 32 Qseven Carrier Boards 8” x 5.75” 16 16 ECB-970-A10 ECB-970-A10-01 9.65” x 9.65” 33 33 Embedde d M o th e r b o ard s Single Board Computers Model EMB-BT1 EMB-BT2 System Processor Chipset Intel® Atom™ J1900 Processor (4C, 10W TDP), N2807 (2C, 4.3W TDP), E3845 (4C , 10W TDP), E3825 Processor (2C, 6W TDP) Intergrate into SoC Memory DDR3L SODIMM x 2 Max 8GB for J1900/E3845,x 1 Max 4GB for N2807, x 1 Max 8GB for E3825, Non-ECC, un-buffered memory I/O Chipset Ethernet Audio TPM Fintech 81866D Realtek 8111G x 2 Realtek® ALC887 Infineon SLB9635 TT 1.2 (default : No) mSATA(PCIe+USB optional) + SIM Card (default: No) x 1, Mini-PCIe x 1, PCIe [x1] x 1 Expansion Slots Graphics Graphics Chipset VGA DVI HDMI Display Port LVDS Intel® HD Graphics Up to 1920 x 1200 @60 Hz — Up to 1920 x 1200 @60 Hz — Up to 1920 x 1080 @60Hz, Dual Channel 18/24-bit (via CH7511) — Voltage/PWM eDP Backlight Control Environment & Power & ME 12V DC Power Requirement Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) Operating Humidity 0% ~ 90%RH, non-condensing Certificate CE & FCC Form Factor Mini-ITX 6.7" x 6.7" (170mm x 170mm) MTBF (Hours) 111,131 Panel I/O Ports USB USB 3.0 x 1, USB 2.0 x 2 Display I/O VGA x 1, HDMI x 1 Audio I/O Line-out x 1 LAN I/O RJ-45 x 2 Serial Port COM (RS-232) x 1 PS/2 Port — Others DC Jack x 1 Internal I/O Connectors Storage SATA3 x 2, SATA2 x 2 (1 colay with mSATA), mSATA x 1 USB USB 2.0 x 5 Display I/O LVDS x 1 Audio I/O AAFP x 1 Serial Port COM (RS-232) x 4, COM (RS-232/422/485) x 1 PS/2 Port 1 Parallel Port SPP/EPP Mode DIO 8-bit programmable (4-in/4-out) x 1 Chassis Fan x 1 FAN mSATA(PCIe+USB optional) x 1, PCIe [x1] x 1 Intel® HD Graphics Up to 1920 x 1200 @60 Hz — — — Dual LVDS, Up to 1920 x 1080 @60Hz, Dual Channel 18/24-bit (via CH7511) — Voltage/PWM ATX 32°F ~ 140°F (0°C ~ 60°C) 0% ~ 90%RH, non-condensing CE & FCC Mini-ITX, 6.7” x 6.7” (170mm x 170mm) 290,990 USB 2.0 x 6 VGA x 1 Mic-in x 1, Line-out x 1 RJ-45 x 2 COM (RS-232/422/485) x 1, COM (RS-232) x 2 1 — SATA2 x 2 (1 colay with mSATA), mSATA x 1 USB 2.0 x 4 LVDS x 2 AAFP x 1, Speaker x 1 COM (RS-232) x 3 — — 8-bit programmable (4-in/4-out) x 1 Chassis Fan x 1 Power 12V AUX x 1, AT/ATX mode select jumper (default : No) x 1 24-pin ATX x 1, AT/ATX mode select jumper (default : No) x 1 Others miniPCIe x 1, PCIe [x1] x 1, SIM Card Socket(default : No) x 1, LPT x 1, Front Panel x 1, CMOS jumper x 1 Front Panel x 1, CMOS jumper x 1 Windows® 7/8.1/10 for 32/64-bit, Linux Fedora Windows® 7/8.1 for 32/64-bit, Linux Fedora OS OS Support 4 Intel® Atom™ J1900 Processor (4C @ 2.00 GHz CPU, 688/854 MHz GFX, 10W TDP) Intergrate into SoC DDR3L 1333 MHz SODIMM x 2 up to 8 GB, Non-ECC, un-buffered memory Fintech 81866D Realtek 8111G x 2 Realtek® ALC887 Infineon SLB9635 TT 1.2 (default : No) Note: All Specifications are subject to change without notice Model EMB-BT4 EMB-BT7 System Processor Chipset Memory I/O Chipset Ethernet Audio TPM Expansion Slots Graphics Graphics Chipset VGA DVI HDMI Display Port LVDS Intel® Atom™ J1900 Processor (4C, 10W TDP), N2807 (2C, 4.3W TDP) Intergrate into SoC DDR3L SODIMM x 2 up to 8 GB for J1900, x 1 up to 4 GB for N2807, Non-ECC, un-buffered memory Fintech 81866D Realtek 8111G x 1 Realtek® ALC887 Infineon SLB9635 TT 1.2 (default : No) mSATA(PCIe+USB optional) + SIM Card (default: No) x 1, Mini-PCIe x 1 Intel® Atom™ E3845 Processor (4C @ 1.91 GHz CPU, 542/792 MHz GFX, 10W TDP) Intergrate into SoC DDR3L 1333 MHz SODIMM x 1 up to 8 GB, ECC, unbuffered memory Fintech 81866D Realtek 8111G x 2 Realtek® ALC887 Infineon SLB9635 TT 1.2 (default : No) mSATA(PCIe+USB optional) + SIM Card (default: No) x 1, Mini-PCIe x 1, PCIe [x1] x 1 Intel® HD Graphics Up to 1920 x 1200 @60 Hz — Up to 1920 x 1200 @60 Hz — Up to 1920 x 1080 @60Hz, Dual Channel 18/24bit (via CH7511) — Voltage/PWM Intel® HD Graphics Up to 1920 x 1200 @60 Hz — Up to 1920 x 1200 @60 Hz — Up to 1920 x 1080 @60Hz, Dual Channel 18/24bit (via CH7511) — Voltage/PWM eDP Backlight Control Environment & Power & ME 12V DC Power Requirement Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) Operating Humidity 0% ~ 90%RH, non-condensing Certificate CE & FCC Form Factor Mini-ITX, 6.7” x 6.7” (170mm x 170mm) MTBF (Hours) 295,750 Panel I/O Ports USB 3.0 x 1, USB 2.0 x 2 USB Display I/O HDMI x 1 Audio I/O Line in x 1, Line-out x 1 LAN I/O RJ-45 x 1 Serial Port COM (RS-232) x 1 PS/2 Port — Others DC Jack x 1 Internal I/O Connectors SATA3 x 2, SATA2 x 2 (1 colay with mSATA), mSATA x 1 Storage USB USB 2.0 x 5 Display I/O VGA x 1, LVDS x 1 Audio I/O AAFP x 1 Serial Port COM (RS-232) x 4, COM (RS-232/422/485) x 1 PS/2 Port 1 Parallel Port SPP/EPP Mode DIO 8-bit programmable (4-in/4-out) x 1 Chassis Fan x 1 FAN 12V DC 32°F ~ 140°F (0°C ~ 60°C) 0% ~ 90%RH, non-condensing CE & FCC Mini-ITX, 6.7” x 6.7” (170mm x 170mm) 283,770 USB 3.0 x 1, USB 2.0 x 2 VGA x 1, HDMI x 1 Line-out x 1 RJ-45 x 2 COM (RS-232) x 1 — DC Jack x 1 SATA3 x 2, SATA2 x 2 (1 colay with mSATA), mSATA x 1 USB 2.0 x 5 LVDS x 1 AAFP x 1 COM (RS-232) x 4, COM (RS-232/422/485) x 1 1 SPP/EPP Mode 8-bit programmable (4-in/4-out) x 1 Chassis Fan x 1 Power 12V AUX x 1, AT/ATX mode select jumper (default : No) x 1 12V AUX x 1, AT/ATX mode select jumper (default : No) x 1 Others miniPCIe x 1, PCIe [x1] x 1, SIM Card Socket(default : No) x 1, LPT x 1, Front Panel x 1, CMOS jumper x 1 miniPCIe x 1, PCIe [x1] x 1, SIM Card Socket(default : No) x 1, LPT x 1, Front Panel x 1, CMOS jumper x 1 Windows® 7/8.1 for 32/64-bit, Linux Fedora Windows® 7/8.1 for 32/64-bit, Linux Fedora OS OS Support Note: All Specifications are subject to change without notice Embedde d M o th e r b o ard s Single Board Computers usa.onyx-healthcare.com 5 Embedde d M o th e r b o ard s Single Board Computers Model EMB-BSW1 EMB-Q170A Processor Intel® Atom™ N3710 Processor, (4C , ~6W TDP) Intel® 6th Gen. Core™ i7/i5/i3, LGA1151 Socket Intel® Atom™ N3060 Processor, (2C, ~6W TDP) Processor, Max. 65W TDPs Intel® 6th Gen. Core™ i7/i5/i3, LGA1151 Socket Processor, Max. 65W TDPs Chipset Intergrate into SoC Intel® Q170 Memory DDR3L 1600 MHz SODIMM x 2 up to 8 GB, Non- DDR4 2133/1867 MHz SODIMM x 2, ECC, un-buffered memory Up to 32GB, Non-ECC, Un-buffered Memory DDR4 2133/1867 MHz SODIMM x 2, Up to 32GB, Non-ECC, Un-buffered Memory I/O Chipset Ethernet Audio TPM F81866D NCT6791D NCT6791D Intel® i211AT x 2 Intel® 219LM x 1, Intel® i211AT x 1 — Realtek® ALC3236 Realtek® ALC887 Realtek® ALC887 Infineon SLB96XX TT 1.2/2.0 (default: No) Infineon SLB96XX TT 1.2/2.0 (default: No) Infineon SLB96XX TT 1.2/2.0 (default: No) Expansion Slots mSATA(PCIe+USB optional) x 1, Mini-PCIe x 1 PCIe [x16] x 1, M.2 M-key(22x80mm) x 1 PCIe [x4] x 1, M.2 M key (22 x 80mm) x 1, M.2 E key (22 x 30mm) x 1 Intel® HD Graphics Intel® HD Graphics Intel® HD Graphics — Up to 1920 x 1200 @60 Hz — — — — Graphics Graphics Chipset VGA DVI HDMI Intel® Q170 Up to 2560 x 1600 @60 Hz, 3840 x 2160 @30Hz — Up to 4096 x 2160 @24 Hz ; 3840 x 2160 @60 Hz, with Digital Audio Display Port — Up to 4096 x 2160 @24 Hz / 3840 x 2160 @60 Up to 4096 x 2160 @24 Hz / 3840 x 2160 @60 Hz, with Digital Audio Hz, with Digital Audio LVDS Up to 1920 x 1080 @60Hz, Dual Channel 18/24bit (via CH7511) — Up to 1920 x 1200 @60 Hz, Dual Channel 18/24bit — UP to 4096 x 2340 @60Hz — Voltage/PWM ATX 12V DC 32°F ~140°F (0°C ~ 60°C) 32°F ~140°F (0°C ~ 60°C) 0% ~ 90%RH, non-condensing 0% ~ 90% RH, non-condensing CE & FCC CE & FCC Mini-ITX, 6.7” x 6.7” (170mm x 170mm) Mini-ITX, 6.7” x 6.7” (170mm x 170mm) — — USB 3.0 x 4, USB 2.0 x 2 USB 3.0 x 4 VGA x 1, DP x 3 DP x 2 Mic-in x 1, Line-out x 1 Mic-in x 1, Line-out x 1 RJ-45 x 2 RJ-45 x 2 — — 1 — — DC Jack x 1 SATA3 x 2, M.2 M-key x 1 SATA3 x 4, M.2 M key x 1, M.2 E key x 1 USB 2.0 x 4 USB 2.0 x 6 — 40-pin LVDS x 1, 40-pin eDP x 1 Speaker x 1 AAFP x 1, Speaker x 1 eDP Up to 2560 x 1440 @60Hz Backlight Control Voltage/PWM, use HW control Environment & Power & ME 12-24V DC (wide range: 12V-5% ~ 24V +10%) Power Requirement Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) Operating Humidity 0% ~ 90%RH, non-condensing Certificate CE & FCC Form Factor Mini-ITX, 6.7” x 6.7” (170mm x 170mm) MTBF (Hours) — Panel I/O Ports USB 3.0 x 2 USB Display I/O HDMI x 2 Audio I/O Mic-in x 1, Line-out x 1 LAN I/O RJ-45 x 2 Serial Port — PS/2 Port — Others DC Jack x 1 Internal I/O Connectors SATA3 x 3 (1 colay with mSATA), mSATA x 1 Storage USB USB 3.0 x 2, USB 2.0 x 6 Display I/O LVDS or eDP x 1 Audio I/O Speaker x 1 Serial Port COM (RS-232) x 5, COM (RS-232/422/485) x 1 PS/2 Port 1 Parallel Port — DIO 8-bit programmable (4-in/4-out) x 1 FAN Chassis Fan x 1 6 EMB-Q170B System COM (RS-232/422/485) x 1, COM (RS-232) x 1 COM (RS-232/422/485) x 1 — — — — 8-bit programmable (4-in/4-out) x 1 8-bit programmable (4-in/4-out) x 1 CPU Fan x 1, Chassis Fan x 1 CPU Fan x 1, Chassis Fan x 1 Power 12V AUX Power Connector x 1, AT/ATX mode select jumper (optional) x 1 12V AUX x 1, AT/ATX mode select jumper (default 12V AUX x 1, AT/ATX mode select jumper (default : No) x 1 : No) x 1 Others Front Panel x 1, CMOS jumper x 1 Front Panel x 1, Chassis Intrusion x 1, Buzzer x 1, Front Panel x 1, Chassis Intrusion x 1, Buzzer x 1, CMOS jumper x 1 CMOS jumper x 1 OS OS Support Windows® 7/8.1/10 for 32/64-bit, Linux Fedora Windows® 7/8.1/10 for 32/64-bit, Linux Fedora Windows® 7/8.1/10 for 32/64-bit, Linux Fedora Note: All Specifications are subject to change without notice Model EMB-H110B EMB-Q87A EMB-H81A System Processor Intel® 6th Gen. Core™ i7/i5/i3, LGA1151 Socket Intel® 4th Gen. Core™ i Series 22nm LGA1150 Processor, Max. 65W TDPs socket Processor, Max. 65W TDPs Intel®4th Gen. Core™ i Series 22nm LGA1150 socket Processor, Max. 65W, TDPs Chipset Intel® H110 Intel® H81 Memory DDR4 2133/1867 MHz SODIMM x 2, Up to 32GB, DDR3 1333/1600 MHz SODIMM x 2, Up to 16GB, DDR3 1333/1600 MHz SODIMM x 2, Up to 16GB, Non-ECC, Un-buffered Memory Non-ECC, Un-buffered Memory Non-ECC, Un-buffered Memory I/O Chipset Ethernet Audio TPM NCT6791D NCT6791D NCT6791D Realtek 8111G x 2 Intel® I217LM x 1, Intel® I210AT x 1 Realtek 8111G x 2 Realtek® ALC887 Realtek® ALC887 Realtek® ALC887 Infineon SLB96XX TT 1.2/2.0 (default: No) Infineon SLB96XX TT 1.2/2.0 (default: No) Infineon SLB9635 TT 1.2 Expansion Slots PCIe [x1] x 1, mSATA(PCIe+USB optional) x 1, Mini-PCIe x 1 PCIe [x4] x 1, mSATA(PCIe+USB optional) x 1, Mini-PCIe x 1 PCIe [x1] x 1, mSATA(PCIe+USB optional) x 1, Mini-PCIex 1 — Intel® HD Graphics Intel® HD Graphics — Up to 1920 x 1200 @60 Hz Up to 1920 x 1200 @60 Hz — — — Graphics Graphics Chipset VGA DVI Intel® Q87 HDMI Up to 4096 x 2160 @24 Hz ; 3840 x 2160 @60 Hz, Up to 4096 x 2160 @24 Hz ; 3840 x 2160 @60 Hz, Up to 4096 x 2160 @24 Hz / 3840 x 2160 @60 Hz, with Digital Audio with Digital Audio with Digital Audio Display Port Up to 4096 x 2160 @24 Hz / 3840 x 2160 @60 Hz, Up to 4096 x 2160 @24 Hz ; 3840 x 2160 @60 Hz, Up to 4096 x 2160 @24 Hz / 3840 x 2160 @60 Hz, with Digital Audio with Digital Audio with Digital Audio LVDS Up to 1920 x 1200 @60 Hz, Dual Channel 18/24- Up to 1920 x 1200 @60 Hz, Dual Channel 18/24- Up to 1920 x 1200 @60 Hz, Dual Channel 18/24bit colay bit bit eDP UP to 4096 x 2340 @60Hz Backlight Control Voltage/PWM Environment & Power & ME 12V DC Power Requirement Operating Temperature 32°F ~140°F (0°C ~ 60°C) Operating Humidity 0% ~ 90%RH, non-condensing Certificate CE & FCC Form Factor Mini-ITX, 6.7” x 6.7” (170mm x 170mm) MTBF (Hours) — Panel I/O Ports USB 3.0 x 4 USB Display I/O DP/HDMI (BOM Change) x 2 Audio I/O Mic-in x 1, Line-out x 1 LAN I/O RJ-45 x 2 Serial Port — PS/2 Port — Others DC Jack x 1 Internal I/O Connectors SATA3 x 2, mSATA x 1 Storage USB USB 2.0 x 4 Display I/O 40-pin LVDS x 1, 40-pin eDP x 1 Audio I/O AAFP x 1, Speaker x 1 Serial Port COM (RS-232/422/485) x 1, COM (RS-232) x 1 PS/2 Port — Parallel Port — DIO 8-bit programmable (4-in/4-out) x 1 FAN CPU Fan x 1, Chassis Fan x 1 — — Voltage/PWM Voltage/PWM 12-24V DC (wide rage:12V-5%~ 24V+10%) 12-24V DC (wide rage:12V-5%~ 24V+10%) 32°F ~140°F (0°C ~ 60°C) 32°F ~140°F (0°C ~ 60°C) 0% ~ 90%RH, non-condensing 0% ~ 90%RH, non-condensing CE & FCC CE & FCC Mini-ITX, 6.7” x 6.7” (170mm x 170mm) Mini-ITX, 6.7” x 6.7” (170mm x 170mm) 104,363 288,850 USB 3.0 x 4 USB 3.0 x 2, USB 2.0 x 2 HDMI x 1, DP x 1 HDMI x 1, DP x 1 Mic-in x 1, Line-out x 1 Mic-in x 1, Line-out x 1 RJ-45 x 2 RJ-45 x 2 — — — — DC Jack x 1 DC Jack x 1 SATA3 x 4, mSATA x 1 SATA3 x 2, SATA2 x 1, mSATA x 1 USB 2.0 x 6 USB 2.0 x 6 USB (2 colay with Mini-Card) VGA x 1, LVDS x 1 VGA x 1, LVDS x 1 AAFP x 1, Speaker x 1, DMIC (optional) x 1 AAFP x 1, Speaker x 1 COM (RS-232) x 2 COM (RS-232) x 1, COM (RS-232/422/485) x 1 1 1 — — 8-bit programmable (4-in/4-out) x 1 8-bit programmable (4-in/4-out) x 1 CPU Fan x 1, Chassis Fan x 1 CPU Fan x 1, Chassis Fan x 1 Power 12V AUX x 1, AT/ATX mode select jumper (default : 12V AUX x 1, AT/ATX mode select jumper (default : 12V AUX x 1, AT/ATX mode select jumper (default : No) x 1 No) x 1 No) x 1 Others Front Panel x 1, Chassis Intrusion x 1, Buzzer x 1, CMOS jumper x 1 Front Panel x 1, Chassis Intrusion x 1, CMOS jumper x 1 Front Panel x 1, Chassis Intrusion x 1, Buzzer x 1, CMOS jumper x 1 Windows® 7/8.1/10 for 32/64-bit, Linux Fedora Windows® 7/8.1/10 for 32/64-bit, Linux Fedora Windows® 7/8.1/10 for 32/64-bit, Linux Fedora OS OS Support Note: All Specifications are subject to change without notice usa.onyx-healthcare.com Embedde d M o th e r b o ard s Single Board Computers 7 Embedde d M o th e r b o ard s Single Board Computers Model EMB-H81B EMB-QM87A EMB-Q77A System Processor Intel®4th Gen. Core™ i Series 22nm LGA1150 socket Processor, Max. 65W, TDPs On board Intel® 4th generation BGA 1364 Processor Intel® 3rd/2nd Generation Core™ I series LGA1155 socket Processor Chipset Intel® H81 Intel® QM87 Intel® Q77 Express Chipset Memory DDR3 1333/1600 MHz SODIMM x 2, Up to 16GB, Dual-Channel with 204-pin SDRAM x 2, DDR3L Non-ECC, Un-buffered Memory 1600/1333, up to 16GB DDR3 1333/1600 MHz SODIMM x 2, Up to 16GB, Non-ECC, Un-buffered Memory I/O Chipset NCT6791D Fintek F81866D-I NCT 6779D Ethernet Realtek 8111G x 2 Intel® I217-LM / Realtek RTL 8111E x 2 Intel® 82579LM (Support Intel® I AMT 8.X) x 1, Intel® 82583V x 1 Audio TPM Expansion Slots Graphics Graphics Chipset VGA DVI Realtek® ALC887 Realtek® ALC892/886/662 Realtek® ALC887 Infineon SLB9635 TT 1.2 Infineon SLB9635TT 1.2(Optional) Infineon SLB9635 TT 1.2 (optional) HDMI Up to 4096 x 2160 @24 Hz / 3840 x 2160 @60 Hz, 1 with Digital Audio — Display Port Up to 4096 x 2160 @24 Hz / 3840 x 2160 @60 Hz, — with Digital Audio — PCIe [x1] x 1, mSATA(PCIe+USB optional) x 1, Mini-PCIe x 1 PCIe [x16] x 1, Mini-PCIe x 1 PCIe [x16] x 1, Mini-PCIe(mSATA optional) x 1 Intel® HD Graphics Intel® Core™i7/i5/i3 + QM87 Intel® HD Graphics Up to 1920 x 1200 @60 Hz 1 Up to 1920 x 1200 @60Hz (via DVI-I) — — Up to 1920 x 1200 @60Hz LVDS Up to 1920 x 1200 @60 Hz, Dual Channel 18/24-bit eDP — Backlight Control Voltage/PWM Environment & Power & ME 12-24V DC (wide rage:12V-5%~ 24V+10%) Power Requirement Operating Temperature 32°F ~140°F (0°C ~ 60°C) Operating Humidity 0% ~ 90% R/H, non-condensing Certificate CE & FCC Form Factor Mini-ITX, 6.7” x 6.7” (170mm x 170mm) MTBF (Hours) 288,850 Panel I/O Ports USB 3.0 x 2, USB 2.0 x 2 USB Display I/O HDMI x 1, DP x 1 Audio I/O Mic-in x 1, Line-out x 1 LAN I/O RJ-45 x 2 Serial Port — PS/2 Port — Others DC Jack x 1 Internal I/O Connectors SATA3 x 2, SATA2 x 1, mSATA x 1 Storage USB USB 2.0 x 6 USB (2 colay with Mini-Card) Display I/O VGA x 1, LVDS x 1 Audio I/O AAFP x 1, Speaker x 1 Serial Port COM (RS-232) x 1, COM (RS-232/422/485) x 1 PS/2 Port 1 Parallel Port — DIO 8-bit programmable (4-in/4-out) x 1 FAN CPU Fan x 1, Chassis Fan x 1 1 — — — Voltage/PWM — 12V DC ATX 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 0% ~ 90% R/H, non-condensing 0% ~ 90% R/H, non-condensing CE/FCC CE & FCC Mini-ITX 6.7” x 6.7” (170mm x 170mm) Mini-ITX, 6.7” x 6.7” (170mm x 170mm) 106,000 95,000 USB 3.0 x 4 USB 3.0 x 2, USB 2.0 x 6 HDMI x 3, VGA x 1 DVI-D x 1, DVI-I x 1 Line-in, Mic-in, Line-out Mic-in x 1, Line in x 1, Line-out x 1 RJ-45 x 2 RJ-45 x 2 RS-232/422/485 x 1 — 1 — — — SATA3 x 4, SATA 2 x 2, Support RAID 0,1,5,10 SATA3 x 2, SATA2 x 2 USB 3.0 x 2, USB 2.0 x 4 USB 3.0 x 2, USB 2.0 x 1 LVDS x 1 — — AAFP x 1, speaker x 1 RS-232 x 4 COM (RS-232) x 1, COM (RS-232/422/485) x 1 — — — — 8-bit programmable (4-in/4-out) x 1 8-bit programmable (4-in/4-out) x 1 CPU Fan x 1, Chassis Fan x 1 CPU Fan x 1, Chassis Fan x 1 Power 12V AUX x 1, AT/ATX mode select jumper (default : 8-pin connector x 1 No) x 1 24-pin ATX x 1, 12V AUX x 1, AT/ATX mode select jumper x 1 Others Front Panel x 1, Chassis Intrusion x 1, Buzzer x 1, CMOS jumper x 1 — Front Panel x 1, Chassis Intrusion x 1, CMOS jumper x 1 Windows® 7/8.1/10 for 32/64-bit, Linux Fedora Windows® 7/8.1 for 32/64-bit, Linux Fedora Windows® XP 32/64-bit, Windows® 7 32/64-bit (WHQL), Windows® 8 (WHQL), Linux Fedora OS OS Support 8 Note: All Specifications are subject to change without notice Model EMB-B75A EMB-B75B EMB-QM77 System Processor Intel® 3rd/2nd Generation Core™ I series LGA1155 socket Processor Intel® 3rd/2nd Generation Core™ I series LGA1155 socket Processor Socket Intel® 3rd generation rPGA988 Processor Chipset Intel® B75 Express Chipset Intel® B75 Express Chipset Intel® QM77 Memory DDR3 1333/1600 MHz SODIMM x 2, Up to 16GB, DDR3 1333/1600 MHz SODIMM x 2, Up to 16GB, Dual-Channel with 204-pin SDRAM x 2, DDR3 Non-ECC, Un-buffered Memory Non-ECC, Un-buffered Memory 1600/1333/1066, up to 16GB I/O Chipset Ethernet Audio TPM Expansion Slots Graphics Graphics Chipset VGA DVI HDMI Display Port ITE 8728F ITE 8728F ITE IT8728F+Fintek F81216DG Realtek 8111F x 2 Realtek 8111F x 1 Intel® WG82579LM / Realtek 8111E x 2 Realtek® ALC887 Realtek® ALC887 Realtek® ALC892/886/662 Infineon SLB9635 TT 1.2 — Infineon SLB9635TT 1.2 PCI-E [x16] x 1 PCIe [x16] x 1 PCIe [x16] x 1, Mini-PCIe x 1, CFast x 1 Intel® HD Graphics Intel® HD Graphics Intel® Core™i7/i5/i3 + QM77 Up to 1920 x 1200 @60Hz Up to 1920 x 1200 @60Hz 1 — — 1 Up to 1920 x 1080 @60Hz Up to 1920 x 1080 @60Hz 1 (by SKU) — — 2 (by SKU) LVDS — Up to 1920 x 1200 @60 Hz, Dual Channel 18/241 bit, support EDID LVDS autodetect eDP — Backlight Control — Environment & Power & ME ATX Power Requirement Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) Operating Humidity 0% ~ 90%RH, non-condensing Certificate CE & FCC Form Factor Mini-ITX, 6.7” x 6.7” (170mm x 170mm) MTBF (Hours) 116,656 Panel I/O Ports USB 3.0 x 2, USB 2.0 x 2 USB Display I/O VGA x 1, HDMI x 3 Audio I/O Mic-in x 1, Line in x 1, Line-out x 1 LAN I/O RJ-45 x 2 Serial Port — PS/2 Port 2 Others — Internal I/O Connectors SATA3 x 1, SATA2 x 2 Storage USB USB 3.0 x 2, USB 2.0 x 4 Display I/O — Audio I/O — Serial Port COM (RS-232) x 1, COM (RS-232/422/485) x 1 PS/2 Port — Parallel Port — DIO 8-bit programmable (4-in/4-out) x 1 FAN CPU Fan x 1, Chassis Fan x 1 Power 12V AUX x 1, 24-pin ATX x 1 Others Front panel x 1 OS OS Support Windows® XP 32-bit, Windows® 7 32/64-bit, Linux Fedora — — — Voltage/PWM ATX 12V DC 32°F ~ 131°F (0°C ~ 55°C) 32°F ~ 140°F (0°C ~ 60°C) 0% ~ 90%RH, non-condensing 0% ~ 90% R/H, non-condensing CE & FCC CE/FCC Mini-ITX 6.7" x 6.7" (170mm x 170mm) Mini-ITX 6.7” x 6.7” (170mm x 170mm) 199,397 60,000 USB 3.0 x 2, USB 2.0 x 2 USB 3.0 x 4 VGA x 1, HDMI x 2 (1 optional) DP x 2 or DP x 1+HDMI x 1, DVI-D x 1 Mic-in x 1, Line in x 1, Line-out x 1 Line-in, Mic-in, Line-out RJ-45 x 1 RJ-45 x 2 RS-232 x 1 RS-232/422/485 x 1 2 1 — — SATA3 x 1, SATA2 x 1 SATA3 x 2, SATA2 x 2, Support RAID 0,1,5,10 USB 2.0 x 4 USB 2.0 x 6 LVDS x 1 VGAx 1, LVDSx 1 — — COM (RS-232) x 1 COM (RS-232) x 1 — — — — 8-bit programmable (4-in/4-out) x 1 8-bit programmable (4-in/4-out) x 1 CPU Fan x 1, Chassis Fan x 1 CPU Fan x 1, Chassis Fan x 1 12V AUX x 1, 24-pin ATX x 1 12V AUX x 1 Front panel x 1 — Windows® XP 32-bit, Windows® 7 32/64-bit, Linux Fedora Windows® XP/7 for 32/64-bit, Linux Fedora Note: All Specifications are subject to change without notice usa.onyx-healthcare.com Embedde d M o th e r b o ard s Single Board Computers 9 Embedde d M o th e r b o ard s Single Board Computers Model EMB-H61A EMB-H61B EMB-QM67 System Processor Intel® 3rd/2nd Generation Core™ I series, 32nm Intel® 3rd/2nd Generation Core™ I series, 32nm Integrated Intel® Atom™ processor D2550 LGA1155 socket Processors, up to 35W LGA1155 socket Processors, up to 35W Chipset Intel® H61 Intel® H61 Intel® NM10 Memory DDR3 1333/1600 MHz SODIMM x 2, Up to 16GB, Non-ECC, Un-buffered Memory DDR3 1333/1600 MHz SODIMM x 2, Up to 16GB, Non-ECC, Un-buffered Memory SO-DIMM x 2, max. 4GB, DDR3 800/1066 MHz, non-ECC, un-buffered memory I/O Chipset Ethernet Audio TPM Fintek F81866D-I Fintek F81866D-I ITE IT8783F Realtek 8111E x 2 Realtek 8111F x 2 Realtek 8111E x 2 Realtek® ALC887 Realtek® ALC887 VIA 1708S Infineon SLB9635 TT 1.2 Infineon SLB9635 TT 1.2 — Expansion Slots PCIe [x4] x 1,Mini-PCIe(mSATA optional) + SIM Card x 1 PCIe [x4] x 1,Mini-PCIe(mSATA optional) + SIM Card x 1 PCIe [x1] x 1, Mini-PCIe(mSATA optional) + SIM Card x 1 Intel® HD Graphics Intel® HD Graphics Intel® HD Graphics Up to 2048 x 1536 @ 75 Hz Up to 2048 x 1536 @ 75 Hz Up to 1920 x 1200 @60 Hz Up to 1920 x 1200 @60 Hz — Up to 1920 x 1200 @60 Hz Up to 1920 x 1200 @60 Hz Up to 1920 x 1200 @60 Hz — — — — Up to 1920 x 1200 @60 Hz, Dual Channel 18/24-bit Up to 1920 x 1200 @60 Hz, Dual Channel 18/24-bit Up to 1440 x 900 @60Hz, Single Channel 18/24 bit eDP — Backlight Control Voltage/PWM Environment & Power & ME 12V DC Power Requirement Operating Temperature 32~131°F (0~55°C) Operating Humidity 0% ~ 90%RH, non-condensing Certificate CE & FCC Form Factor Mini-ITX, 6.7” x 6.7” (170mm x 170mm) MTBF (Hours) 117,673 Panel I/O Ports USB 2.0 x 6 USB Display I/O VGA x 1, DVI-D x 1, HDMI x 1 Audio I/O Mic-in x 1, Line in x 1, Line-out x 1 LAN I/O RJ-45 x 2 Serial Port COM (RS-232/422/485) x 1 PS/2 Port 1 Others — Internal I/O Connectors SATA x 2, mSATA x 1 Storage USB USB 2.0 x 2 Display I/O LVDS x 1 Audio I/O — — — Voltage/PWM Voltage/PWM 12V DC 12V DC 32~131°F (0~55°C) 32°F ~ 140°F (0°C ~ 60°C) 0% ~ 90%RH, non-condensing 0% ~ 90%RH, non-condensing CE & FCC CE & FCC Mini-ITX, 6.7” x 6.7” (170mm x 170mm) Mini-ITX, 6.7” x 6.7” (170mm x 170mm) 211,000 178,817 USB 2.0 x 6 USB 2.0 x 4 VGA x 1, HDMI x 2 VGA x 1, DVI-D x 1 Mic-in x 1, Line in x 1, Line-out x 1 Mic-in x 1, Line in x 1, Line-out x 1 RJ-45 x 2 RJ-45 x 2 COM (RS-232/422/485) x 1 COM (RS-232/422/485) x 1, COM (RS-232) x 1 1 — — DC Jack x 1 SATA x 2, Mini-Card slot x 1 SATA x 2, mSATA x 1 USB 2.0 x 2 USB 2.0 x 2 LVDS x 1 LVDS x 1 — — Serial Port COM (RS-232) x 5 COM header x 5 (RS-232) COM header x 3, COM2 External Power Selection Jumper x 1 PS/2 Port Parallel Port DIO FAN Power — — 1 — — LPT header x 1 8-bit programmable (4-in/4-out) x 1 8-bit programmable (4-in/4-out) x 1 8-bit programmable (4-in/4-out) x 1 CPU Fan x 1, Chassis Fan x 1 CPU Fan x 1, Chassis Fan x 1 CPU Fan x 1, Chassis Fan x 1 12V AUX x 1, AT/ATX mode select jumper x 1 12V AUX x 1, AT/ATX mode select jumper x 1 12V AUX x 1, AT/ATX mode select jumper x 1 Others SIM Card Socket x 1, Front Panel x 1, CMOS jumper x 1 SIM Card Socket x 1, Front Panel x 1, CMOS jumper x 1 SIM Card Socket x 1, Front Panel x 1, WDT Function Switch x 1, CMOS jumper x 1 Windows® XP 32-bit, Windows® 7 32/64-bit, Linux Fedora Windows® XP 32-bit, Windows® 7 32/64-bit, Linux Fedora Windows® XP/7 32-bit, Linux Fedora Graphics Graphics Chipset VGA DVI HDMI Display Port LVDS OS OS Support Note 10 Note: All Specifications are subject to change without notice Model EMB-CV2 EMB-KB1 EMB-A70M System Processor Intel® Atom™ D2550 B3 Processor Dual Core 1.86 GHz AMD 1st generation APU SoC (FT3 BGA Package), On board AMD® Embedded R-260H/R-460L Quad(2G,1.5G), Dual (1.6G,1.0G) APU(Dual Core) up to 25W Chipset Intel® ICH10R — Memory Dual-Channel with 204-pin SDRAM x 2, DDR3 1066, up to 4GB SO-DIMM x 2, max. 16GB, DDR3(L) 1600/1333 SO-DIMM x 2, DDR3 1333/1066 MHz, MHz , Non-ECC, un-buffered memory up to 16GB I/O Chipset Ethernet Audio TPM Winbond W83627DHG-P Fintek F81866D-I ITE IT8728 Realtek® 8111E x 2 Realtek 8111F x 2 Realtek® 8111E x 2 Via VT1705 Realtek® ALC887 with Amplifier Realtek® ALC892 — Infineon SLB9635 TT 1.2 (default: No) — Expansion Slots PCIe [x4] x 1 PCIe [x4] x 1, Mini-PCIe + SIM Card (mSATA optional) x 1, Mini-PCIe x 1 PCIe [x4] x 1, Mini-PCIe x 1, mSATA x 1 Intel® Atom™ D2550 B3 Processor Sea Islands Family (Integrated) AMD® M3/A70M 1 Up to 1920 x 1200 @60 Hz — 1 Up to 1920 x 1200 @60 Hz — — — 4 — — — 1 Up to 1920 x 1080 @60Hz, Dual Channel 18/24 — bit (via CH7511) Graphics Graphics Chipset VGA DVI HDMI Display Port LVDS Embedde d M o th e r b o ard s Single Board Computers AMD® M3/A70M eDP — Backlight Control Voltage Environment & Power & ME 12V DC Power Requirement Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) Operating Humidity 0% ~ 90% R/H, non-condensing Certificate CE/FCC Form Factor Mini-ITX 6.7” x 6.7” (170mm x 170mm) MTBF (Hours) 107,000 Panel I/O Ports USB 2.0 x 4 USB Display I/O DVI-D x 1, VGA x 1 Audio I/O Line-in, Mic-in, Line-out LAN I/O RJ-45 x 2 Serial Port RS-232 x 1, RS-232/422/485 x 1 PS/2 Port — Others DC Jack x 1 Internal I/O Connectors SATA2 x 6 Storage USB USB 2.0 x 4 Display I/O LVDS x 1 Audio I/O — Serial Port — PS/2 Port — Parallel Port — DIO 8-bit programmable (4-in/4-out) x 1 FAN CPU Fan x 1, Chassis Fan x 1 Power 12V AUX x 1 — — Voltage/PWM Voltage ATX 12V DC 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 0% ~ 90%RH, non-condensing 0% ~ 90% R/H, non-condensing CE & FCC CE/FCC Mini-ITX, 6.7” x 6.7” (170mm x 170mm) Mini-ITX 6.7” x 6.7” (170mm x 170mm) 140,000 88,000 USB 3.0 x 2, USB 2.0 x 2 USB 2.0 x 1 VGA x 1, DVI-D x 1 HDMI x 4 Mic-in x 1, Line-out x 1 Mic-in, Line-out RJ-45 x 2 RJ-45 x 2 Others — SIM Card Socket x 1, Front Panel x 1, Buzzer x 1, — CMOS jumper x 1 OS OS Support Windows® XP/7 for 32/64-bit, Linux Fedora Windows® XP/7 for 32/64-bit, Linux Fedora COM (RS-232/422/485) x 1, COM (RS-232) x 1 — 2 — — — SATA x 2, mSATA x 2 SATA2 x 2 USB 2.0 x 4 USB 3.0 x 2, USB 2.0 x 4 LVDS x 1 — Speaker x 1 — COM header x 4 (RS-232) RS-232 x 1, RS-232/422/485 x 1 — — — — 8-bit programmable (4-in/4-out) x 1 8-bit programmable (4-in/4-out) x 1 CPU Fan x 1, Chassis Fan x 1 CPU Fan x 1, Chassis Fan x 1 12V AUX x 1, 24-pin ATX x 1 12V AUX x 1 Windows® XP/7 for 32/64-bit, Linux Fedora Note Note: All Specifications are subject to change without notice usa.onyx-healthcare.com 11 Embedde d M o th e r b o ard s Single Board Computers Model EMB-A50M IMBI-QM57 EPC-CV1 System Processor On board AMD® Fusion APU T56N/T44R Socket Intel® Core i rPGA988 Processor Integrated Intel® Atom™ N2600/N2800 processor Chipset AMD® M1/A50M Intel® QM57 Intel® NM10 Memory SO-DIMM x 2, DDR3 1066/800 MHz, up to 8GB Dual-Channel with 204-pin SDRAM x 2, DDR3 1066/800, up to 8GB SO-DIMM x 1, DDR3 800/1066 MHz, non-ECC, un-buffered memory I/O Chipset Ethernet Audio TPM Expansion Slots Graphics Graphics Chipset VGA DVI HDMI Display Port LVDS eDP ITE IT8771E ITE IT8728F Fintek 81866D-I Realtek® 8111E x 2 Intel® 82577LM / 82574L, Gigabit LAN x 2 Realtek 8111F x 2 Realtek® ALC892 Realtek® ALC888 Realtek 887 x 1, Audio Amplifier EUA 2012A x 1 — — — PCIe [x4] x 1, Mini-PCIe x 1, mSATA x 1 PCIe [x4] x 1, Mini-PCIe x 1, PCI x 1, CF x 1 Mini-PCIe x 2 AMD® M1/A50M Intel® Core™i7/i5 + QM57 — — 1 Up to 1920 x 1200 @60 Hz 1 1 — 1 1 Up to 1920 x 1200 @60 Hz — — — — 1 Up to 1920 x 1280 @60Hz, 18-bit single channel — — — Backlight Control Voltage Voltage Voltage/ PWM, 1 x DC 5V/12V for LCD backlight inverter board 12V DC 12V DC 32°F ~ 140°F (0°C ~ 60°C) 14°F ~ 140°F (-10°C ~ 60°C) 0% ~ 90% R/H, non-condensing 0% ~ 90% RH, non-condensing CE/FCC CE & FCC class B Mini-ITX 6.7” x 6.7” (170mm x 170mm) EPIC Form Factor, 4.53"x6.5" (115mmx165mm) 56,000 228,000 USB 2.0 x 4 USB2.0 x 4 HDMI x 1, DVI-D x 1, VGA x 1 HDMI x 1 Line-in, Mic-in, Line-out — RJ-45 x 2 RJ-45 x 2 RS-232 x 1 COM x 1 (RS-232/422/485) Mini-Din PS/2 K/B and Mouse x 1 — — DC Jack x 1 SATA 3.0 Gb/s x 3, Support RAID 0,1,5,10 SATA x 2, mSATA x 2 USB 2.0 x 4 USB 2.0 x 2 LVDSx1 VGA x 1, LVDS x 1 — Line-out/ Mic-in Pin header x 1, SPDIF x 1 RS-232 x 2, RS-232/422/485 x 1 RS-232 pin header x 3 — 1 — — 8-bit programmable (4-in/4-out) 8-bit programmable (4-in/4-out) x 1 Environment & Power & ME 12V DC Power Requirement Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) Operating Humidity 0% ~ 90% R/H, non-condensing Certificate CE/FCC Form Factor Mini-ITX 6.7” x 6.7” (170mm x 170mm) MTBF (Hours) 70,000 Panel I/O Ports USB 2.0 x 6 USB Display I/O HDMI x 1, DVI-Dx1 Audio I/O Line-in, Mic-in, Line-out LAN I/O RJ-45 x 2 Serial Port — PS/2 Port 1 Others — Internal I/O Connectors SATA2 x 5 Storage USB USB 3.0 x 2, USB 2.0 x 4 Display I/O — Audio I/O — Serial Port RS-232 x 3, RS-232/422/485 x 1 PS/2 Port — Parallel Port — DIO 8-bit programmable (4-in/4-out) x 1 FAN CPU Fan x 1, Chassis Fan x 1 CPU Fan connector(s) (4-pin) x 1, Chassis Fan connector(s) (4-pin) x 1 Chassis Fan x 1 Power 12V AUX x 1, 24-pin ATX x 1 24-pin ATX connector x 1, 4-pin connector x 1 2-pin 12V DC x 1 Others — — SIM card connector x 1, Front panel x 1, 4-pin Amplifier connector x 1 Windows® XP/7 for 32/64-bit, Linux Fedora Windows® XP, Windows® 7 32/64-bit, Linux Fedora Windows® XP/7 32-bit, Linux Fedora OS OS Support Note 12 Note: All Specifications are subject to change without notice Model IMBA-Q87A IMBA-Q77 IMBA-967 System Processor Intel® 4th Generation Core™ i7/i5/i3/Pentium®/ Celeron® 22nm LGA 1150 socket Processor Socket Intel® 3rd generation LGA 1155 Processor Socket Intel® 2rd generation LGA 1155 Processor Chipset Intel® Q87 Intel® Q77 Intel® Q67 Memory 240-pin DIMM x 4, max. 32GB, DDR3 1600/1333, Dual-Channel with 240-pin DRAM x 4, DDR3 Dual Channel 1600/1333/1066, up to 32GB Dual-Channel with 240-pin DRAM x 4, DDR3 1333/1066, up to 32GB I/O Chipset NCT6791D, F81216HD Winbond W83627DHG Winbond W83627DHG Ethernet LAN1: Intel® PHY I217LM Giga LAN, LAN2: Intel® I210AT Giga LAN Intel® 82579 / 82583V, Gigabit LAN x 2 Intel® 82579LM / 82574L, Gigabit LAN x 2 Audio TPM Realtek® ALC887 (Colay with ALC886) Realtek® ALC662 Realtek® ALC662 20-1 PIN header for TPM1.2/FW3.19 Infineon SLB9635TT 1.2(Optional) Infineon SLB9635TT 1.2(Optional) Expansion Slots PCIe [x16]x 1, PCIe [x4] x 1, PCI x 5 PCIe [x16] x 1, PCIe [x4] x 1, PCIe [x1] x 2, PCI x PCIe [x16] x 1, PCIe [x4] x 1, PCIe [x1] x 1, PCI x 3 4 Graphics Intel® HD Graphics Graphics Chipset VGA Up to 1920 x 1200 @60Hz DVI Up to 1920 x 1200 @60Hz HDMI HDMI 1.4, up to 4096 x 2610 @24Hz Display Port DP 1.2, up to 2560 x 1440 @60Hz LVDS — Backlight Control — Environment & Power & ME Intel® Core™i7/i5/i3 + Q77 Intel® Core™i7/i5/i3 + Q67 1 1 1 1 1 (by SKU) 1 2 (by SKU) — 1 — Voltage/PWM Voltage Power Requirement 24-pin ATX connector x 1, 8 pin ATX 12V Power connector x 1 12V DC 12V DC Operating Temperature Operating Humidity Certificate Form Factor MTBF (Hours) Panel I/O Ports 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 0% ~ 90% RH, non-condensing 0% ~ 90% R/H, non-condensing 0% ~ 90% R/H, non-condensing CE & FCC Class A CE/FCC CE/FCC ATX, 12" x 9.6" (305 mm x 244 mm) ATX, 12" x 9.6" (305 mm x 244 mm) ATX, 12" x 9.6" (305 mm x 244 mm) 86,000 56,000 52,000 USB USB 3.0 x 4, USB 2.0 port x 2 USB 3.0 x 2 with Type A connectors, USB 2.0 x 2 with Type A connectors USB 2.0 x 4 with Type A connectors Display I/O DVI-D x 1, HDMI x 1, DP x 1 (or DVI-D x1, HDMIx2, DP x 2 or DP x 1+HDMI x 1, DVI-D x 1 by BKU) HDMI x 1, DVI-D x 1, VGA x 1 Audio I/O LAN I/O Serial Port PS/2 Port Internal I/O Connectors Line-in, Mic-in, Line-out Line-in, Mic-in, Line-out Line-in, Mic-in, Line-out RJ-45 x 2 RJ-45 x 2 RJ-45 x 2 RS-232/422/485 x 1 RS-232/422/485 x 1 RS-232 x 1 Combo Port (Keyboard & Mouse) x 1 Mini-Din PS/2 K/B and Mouse x 1 Mini-Din PS/2 K/B and Mouse x 1 Storage SATA 6.0Gb/s x 6, Supports RAID 0/1/5/10 SATA 6.0 Gb/s x 2, SATA 3.0 Gb/s x 4, Support SATA 6.0 Gb/s x 2, SATA 3.0 Gb/s x 4, Support RAID 0,1,5,10 RAID 0,1,5,10 USB Display I/O Audio I/O Serial Port PS/2 Port Parallel Port DIO FAN Power Others OS USB 2.0 x 8 USB 3.0 x 2, USB 2.0 x 6 USB 2.0 x 8 VGA x 1 VGA x 1, LVDS x 1 — — — — RS-232 header x 5 RS-232 x 5 RS-232 x 3, RS-232/422/485 x 1 — — — LPT connector x 1 — LPT x 1 8-bit x 1 (In/Out programmable) 8-bit programmable (4-in/4-out) 8-bit programmable (4-in/4-out) 4 pin CPU Fan x 1, 4-pin Chassis Fan x 2 4 pin CPU Fan x 1, 4-pin Chassis Fan x 1 4 pin CPU Fan x 1, 4-pin Chassis Fan x 1 — 24-pin ATX connector x 1, 4-pin connector x 1 24-pin ATX connector x 1, 4-pin connector x 1 — — IrDA x 1 OS Support Windows® 7 32/64-bit, Windows® 8.1 32/64bit, Linux Fedora Windows® XP, Windows® 7 32/64-bit, Linux Fedora Windows® XP 32-bit, Windows® 7 32/64-bit, Windows® 8 32/64-bit Embedde d M o th e r b o ard s Single Board Computers Note Note: All Specifications are subject to change without notice usa.onyx-healthcare.com 13 Embedde d M o th e r b o ard s Single Board Computers Model IMBA-H61A IMBM-Q170A IMBM-Q87A System Processor Intel® 6th Generation(Skylake-S) Core™ i7/i5/ Intel® 3rd/ 2nd Generation Core™ i7/i5/i3/ i3/Pentium®/ Celeron® 14nm LGA1151 Socket Pentium® / Celeron® 22nm LGA 1155 Processors Processor Intel® 4th Generation Core™ i7/i5/i3/Pentium®/ Celeron® 22nm LGA 1150 socket Processor Chipset Intel® H61 Intel® Q170 Intel® Q87 Memory 240-pin DIMM x 2, max. 16GB, DDR3 1333/1066/800 , Dual channel 288-pin DIMM x 4, max. 64GB, DDR4 2133/1867, Dual channel 240-pin DIMM x 4, max. 32GB, DDR3 1600/1333, Dual channel I/O Chipset NCT6776F NCT6791D, F81216HD NCT6791D, F81216HD Ethernet Realtek RTL8111F Giga LAN x 2 LAN1: Intel® PHY I219LM Giga LAN, LAN2: Intel® LAN1: Intel® PHY I217LM Giga LAN, LAN2: Intel® I211AT Giga LAN I210AT Giga LAN Audio TPM Realtek® ALC887 (Colay with ALC886) Realtek® ALC887 (Colay with ALC886) Realtek® ALC887 (Colay with ALC886) 20-1 PIN header for TPM1.2/FW3.19 20-1 PIN header for TPM1.2/FW3.19 20-1 PIN header for TPM1.2/FW3.19 Expansion Slots PCIe [x16] x 1, PCIe [x1]x 2, PCI x 4, Full/Half Size PCIe [x16] x 1, PCIe [x4](open edge) x 1, PCIe[x1] PCIe [x16] x 1, PCIe [x4]x 1, PCI x 2, Half size Mini-card x 1 (open edge) x 1, PCI x 1 Mini-Card x 1 (PCIe + USB or mSATA optional) Graphics Intel® HD Graphics Graphics Chipset VGA Up to 1920 x 1200 @60 Hz DVI Up to 1920 x 1200 @60 Hz HDMI — Display Port — LVDS — Backlight Control — Environment & Power & ME Intel® HD Graphics Intel® HD Graphics Up to 1920 x 1200 @60Hz Up to 1920 x 1200 @60Hz Up to 1920 x 1200 @60Hz Up to 1920 x 1200 @60Hz HDMI 1.4 up to 4096 x 2160 @24Hz — — DP 1.2, up to 3840 x 2160 @60Hz — — — — Power Requirement 24-pin ATX connector x 1, 4-pin ATX 12V Power connector x 1 24-pin ATX connector x 1, 8 pin ATX 12V Power connector x 1 24-pin ATX connector x 1, 8 pin ATX 12V Power connector x 1 Operating Temperature Operating Humidity Certificate Form Factor MTBF (Hours) Panel I/O Ports USB Display I/O Audio I/O LAN I/O Serial Port PS/2 Port Internal I/O Connectors Storage 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 0%~90%RH, non-condensing 0% ~ 90% RH, non-condensing 0% ~ 90% RH, non-condensing CE & FCC Class A CE & FCC Class A CE & FCC Class A ATX, 12" x 9.6" (305 mm x 244 mm) Micro-ATX, 9.6” x 9.6” (244mm x 244mm) Micro-ATX, 9.6” x 9.6” (244mm x 244mm) 136,599 — 100,000 USB 2.0 x 4 USB 3.0 x 10 USB 3.0 x 4, USB 2.0 x6 VGA x 1, DVI-D x 1 DVI-I x 1, HDMI x 2 DVI-D x 1, DP x 2, VGA x 1 Line-in, Mic-in, Line-out Line-in, Mic-in, Line-out Line-in, Mic-in, Line-out RJ-45 x 2 RJ-45 x 2 RJ-45 x 2 USB Display I/O Audio I/O Serial Port PS/2 Port Parallel Port DIO FAN DB-9 COM x 2 (COM2 support RS-232/422/485) DB-9 COM x 1 (support RS-232/422/485) — Keyboard Connector x 1, Mouse Connector x 1 Combo Port (Keyboard & Mouse) x 1 Combo Port (Keyboard & Mouse) x 1 SATA 3.0Gb/s x 4 SATA 6.0Gb/s x 6, Supports RAID 0/1/5/10 SATA 6.0Gb/s x 5, Supports RAID 0/1/5/10; USB 2.0 x 5 USB 2.0 x 4 Half size Mini-Card (PCIe + USB, mSATA optional) x 1, USB 2.0 x 2 — — — — Speaker header x 1 (Line-out) — RS-232 header x 4 RS-232 header x 5 RS-232 header x 5, RS-232/422/485 x 1 — — — LPT connector x 1, Support SPP/EPP/ECP Mode — — 8-bit x 1 (In/Out programmable) 8-bit x 1 (In/Out programmable) 8-bit x 1 (In/Out programmable) 4 pin CPU Fan x 1, 4-pin Chassis Fan x 1 4 pin CPU Fan x 1, 4-pin Chassis Fan x 2 4 pin CPU Fan x 1, 4-pin Chassis Fan x 2 Front panel header x 1, Clear CMOS jumper x 1, TPM header x 1, BIOS flash header (2[x4]P p=1.27mm) x 1 Front panel header x 1, Clear CMOS jumper x 1, TPM header x 1, BIOS flash header (2[x4]P p=1.27mm) x 1, Chassis Intrusion x 1 Front panel header x 1, Clear CMOS jumper x 1, TPM header x 1, BIOS flash header (2[x4]P p=1.27mm) x 1, Chassis Intrusion x 1 Others OS — — — OS Support Windows® XP 32-bit, Windows® 7 32/64-bit, Windows® 8 32/64-bit Windows® 7 32/64-bit, Windows® 8.1 64-bit, Windows® 10 64-bit, ,Linux Fedora 64bit Windows® 7 32/64-bit, Windows® 8 32/64-bit, Linux Fedora Power Note 14 Note: All Specifications are subject to change without notice Model IMBM-B75A IMBM-H61A IMBM-H61B System Processor Intel® 3rd/ 2nd Generation Core™ i7/i5/i3/ Intel® 3rd/ 2nd Generation Core™ i7/i5/i3/ Intel® 3rd/ 2nd Generation Core™ i7/i5/i3/ Pentium®/ Celeron® 22nm LGA 1155 Processors Pentium®/ Celeron® 22nm LGA 1155 Processors Pentium®/ Celeron® 22nm LGA 1155 Processors Chipset Intel® B75 Memory 240-pin DIMM x 4, max. 32GB, DDR3 1600/1333,240-pin DIMM x 2, max. 16GB, DDR3 Dual channel 1333/1066/800, Dual channel 240-pin DIMM x 2, max. 16GB, DDR3 1333/1066/800, Dual channel I/O Chipset Ethernet Audio TPM ITE IT8783F Fintech 81866D+81216HD Fintech 81866D+81216HD Realtek RTL8111F Giga LAN x 2 Realtek RTL8111F Giga LAN x 2 Realtek RTL8111F Giga LAN x 2 Realtek® ALC887 Realtek ALC887 Realtek ALC887 Infineon SLB9635 TT 1.2 — — Expansion Slots PCIe[x16] x 1, PCIe[x4] x 1, PCI x 2 PCIe [x16]x 1, PCIe [x1]x 1, PCI x 1, Half Size MiniPCIe [x16] x 1, PCI x 2, Half Size Mini-Card x 1 Card x 1 Graphics Intel® HD Graphics Graphics Chipset VGA Up to 1920 x 1200 @60Hz DVI — HDMI Up to 1920 x 1080 @60Hz Display Port — LVDS — Backlight Control — Environment & Power & ME Intel® H61 Intel® H61 Intel® HD Graphics Intel® HD Graphics Up to 1920 x 1200 @75Hz Up to 1920 x 1200 @75Hz Up to 1920 x 1200 @60 Hz — — — — — Up to 1920 x 1200 @60 Hz Up to 1920 x 1200 @60 Hz Voltage/ PWM Voltage/ PWM Power Requirement 24-pin ATX connector x 1, 8 pin ATX 12V Power connector x 1 24-pin ATX connector x 1, 4-pin ATX 12V Power connector x 1 24-pin ATX connector x 1, 4-pin ATX 12V Power connector x 1 Operating Temperature Operating Humidity Certificate Form Factor MTBF (Hours) Panel I/O Ports USB Display I/O Audio I/O LAN I/O Serial Port 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) 0% ~ 90% RH, non-condensing 0% ~ 80% RH , non-condensing 0% ~ 80% RH , non-condensing CE & FCC Class A CE & FCC Class A CE & FCC Class A Micro-ATX, 9.6” x 9.6” (244mm x 244mm) Micro-ATX, 9.6” x 9.6” (244mm x 244mm) Micro-ATX, 9.6” x 9.6” (244mm x 244mm) 83,621 87,274 — USB 3.0 x 2, USB 2.0 port x 2 USB 2.0 x 4 port USB 2.0 port x 4 VGA x 1, HDMI x 3 VGA x 1, DVI-D x 1, VGA x 2 Line-in, Mic-in, Line-out Line-in, Mic-in, Line-out Line-in, Mic-in, Line-out RJ-45 x 2 RJ-45 x 2 RJ-45 x 2 — RS232 DB-9 connector x 2 RS232 DB-9 connector x 2 PS/2 Port Keyboard Mouse Connector x 1, mouse connector Keyboard Connector x 1, Mouse Connector x 1 x1 Keyboard Connector x 1, Mouse Connector x 1 SATA 6.0Gb/s x 1, SATA 3.0Gb/s x 4 SATA 3.0Gb/s x 3, CFast Socket x 1 SATA 3.0Gb/s x 3, CFast™ Socket x 1 USB 3.0 x 2, USB 2.0 x 4 USB 2.0 x 4 USB 2.0 x 4 — — — — — — RS-232/422/485 x 1, RS-232 header x 4 RS-232/422/485 x 2, RS-232 x9 RS-232/422/485 x 2, RS-232 x9 — — — Internal I/O Connectors Storage USB Display I/O Audio I/O Serial Port PS/2 Port Parallel Port DIO Embedde d M o th e r b o ard s Single Board Computers LPT connector x 1, Support SPP/EPP/ECP Mode LPT connector x 1, Support SPP/EPP/ECP Mode LPT connector x 1, Support SPP/EPP/ECP Mode 8-bit x 1 (In/Out programmable) 8-bit x 1 (In/Out programmable) 8-bit x 1 (In/Out programmable) FAN 4 pin CPU Fan x 1, 4-pin Chassis Fan x 2 4 pin CPU Fan x 1, 4-pin Chassis Fan x 1 4 pin CPU Fan x 1, 4-pin Chassis Fan x 2 (Fan2 optional) Power Front panel header x 2, IrDA header x 1, Clear CMOS jumper x 1, BIOS flash header (2[x4]P p=1.27mm) x 1 Front panel header x 1, Clear CMOS jumper x 1, BIOS flash header (2[x4]P p=1.27mm) x 1 Front panel header x 1, Clear CMOS jumper x 1, BIOS flash header (2[x4]P p=1.27mm) x 1 Others OS IrDA x 1 — — OS Support Windows® XP 32/64-bit, Windows® 7 32/64-bit, Windows® XP 32-bit, Windows® 7 32/64-bit, Linux Fedora Linux Fedora Windows® XP 32-bit, Windows® 7 32/64-bit, Linux Fedora Note Note: All Specifications are subject to change without notice usa.onyx-healthcare.com 15 C o mpa c t Bo a rd s Single Board Computers Model PCM-QM77 PCM-LN02 System Form Factor 5.25" Compact Board 5.25" Compact Board CPU Intel® Core™ i7/i5/i3/Celeron® IVY bridge and Sandy Bridge (Socket-G2 based) Onboard Intel® Atom™ N455/D525 CPU Frequency Up to 2.5 GHz Up to 1.83 GHz Chipset Intel® QM77/HM76 PineView™ D/M DDR3 + ICH8M Memory Type DDR3 1066/1333/1600, SODIMM x 2 up to 16G Onboard 2 GB /4 GB DDR3 667/800 Max. Memory Capacity 8 GB 4 GB BIOS UEFI AMI 8MB Wake on LAN Yes Yes Watchdog Timer 255 Levels 255 Levels Power Requirement ATX/DC12V +12V & ATX co-lay Power Supply Type ATX ATX/ DC-12V Power Consumption (Typical) — — Dimension (L x W) 8" x 5.75" (203mm x 146mm) 8" x 5.75" (203mm x 146mm) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) Storage Temperature -40°F ~ 176°F (-40°C ~ 80°C) -40°F ~ 176°F (-40°C ~ 80°C) Operating Humidity 0% ~ 90% relative humidity, non-condensing 0% ~ 90% relative humidity, non-condensing MTBF (Hours) 60,000 — Certification CE/FCC CE/FCC VGA/LCD Controller Intel® Core™ i7/i5/i3 integrated Integrated Video Output CRT, LVDS LCD, DVI-I CRT, TTL (Optional), or LVDS 18/24 bit Backlight Inverter Supply Max. 12V Max. 12V Ethernet Intel® 82579LM x 1, Intel® 82583V x 1, 10/100/1000BaseTX need Pin header for LAN Intel® 82567V x 1, Intel® 82583V x 1, 10/100/1000Base-TX x2 Audio Realtek ALC892, 2.1CH ALC888-GR, 2 CH USB Port USB3.0 x 4, USB 2.0 x 4 USB2.0 x 6 Serial Port RS-232 x 8, RS-232/422/485 x 2 RS-232 x 5, RS-232/422/485 x 1 Parallel Port SPP/EPP/ECP x 1 or FDD Function SPP/EPP/ECP x 1 HDD Interface SATA 3.0 x 2, SATA 2.0 x 2 UDMA33 x 1, SATA 2 x 2 FDD Interface — — SSD CFast,mSATA CompactFlash™ Expansion Slot PCI-Express [x16], Mini-Card or mSATA, PCI, Mini PCI Digital I/O (8 in/8 out), iAMT 8.0 support , 5V/12V Voltage output PCMCIA x 1, PC-104-Plus, Two mini-card (1st: full size+SIM; 2nd: half size) on the top side; CF x 1, LAN connector Pin header Type DIO 16 bit 8 bit TPM Optional Optional Touch Optional — Display I/O Note 16 Note: All Specifications are subject to change without notice Model PICO-BT01 P i co -I TX Bo a rd s Single Board Computers PICO-CV01 System Form Factor Pico-ITX Pico-ITX CPU Onboard Intel® Atom™ E3845 or Celeron® J1900/N2807 Processor SoC Intel® Atom™ N2600 Processor CPU Frequency Up to 2.0 GHz 1.6 GHz Dual Core Chipset Intel® E3845/J1900/N2807 N2600 + NM10 Memory Type 204-pin DDR3L SODIMM x 1, DDR3L 1066/1333, Max 8GB SODIMM DDR3 1066MHz Max. Memory Capacity Up to 8GB 2 GB BIOS AMI/SPI AMI 32MB Wake On LAN Yes Yes Watchdog Timer 1-255 steps by software program 255 Level Power Requirement +12VDC +12V only Power Supply Type AT/ATX (default), lockable connector optional AT / ATX Power Consumption (Typical) Intel® Celeron® J1900 2.0GHz ,DDR3L 1333 MHz 8 GB, [email protected]+12V Intel® Atom™ N2600 1.6GHz,DDR3 800MHz 2GB, [email protected] System Cooling Heat-spreader, heatsink or cooler optional Faness, Heat-sink Dimension 3.94" x 2.84" (100mm x 72mm) 3.94" x 2.84" (100mm x 72mm) Gross Weight 0.88lb (0.4 kg) 1.1 lb (0.5 kg) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C), -4°F ~ 158°F (-20°C ~ 70°C) WiTas I Storage Temperature -40˚F ~ 176˚F (-40˚C ~ 80˚C) -40°F ~ 176°F (-40°C ~ 80°C ) Operating Humidity 0% ~ 90% relative humidity, non-condensing 0% ~ 90% relative humidity, non-condensing MTBF (Hours) 80,000 95,000 Certification CE,FCC CE,FCC Chipset Intel® E3845/J1900/N2807 Intel® Atom™ N2600 integration Resolution VGA up to 2048 x 1152 @60Hz or DP up to 2560 x 1400 @60Hz LVDS (18/24-bit) up to 1400 x 900 @60Hz VGA up to 1920x1200 @60Hz uHDMI up to 1920 x 1200 @60Hz LVDS (18it) up to 1366 x768 @60Hz LCD Interface 18/24-bit Single LVDS 18-bit Single Channel LVDS with PWM function Storage/SSD SATA II 3.0Gb/s x 1, mSATA/Mini-Card (Full-size) x 1 SATA II 3.0Gb/s x 1, mSATA/Mini-Cardx1 Ethernet Intel® Gigabit Ethernet i211AT 10/100/1000Base-TX x 1 Realtek RTL 8111E, 10/100/1000Base-TX x 1 USB Port USB 3.0 x 1 Rear IO, USB 2.0 x 1 Rear IO and x 1 Pin header USB2.0 x 5 Serial Port RS-232 x 1, RS-232/422/485 x 1 (Ring /+5V/+12V) RS-232 x 1, RS-232/422/485 x 1 Audio Line-out x 1 Audio Buzzer x 1, HD Audio Codec(ALC662) for Mic-in/Line-in/ Line-out DIO 4-bit (2-in, 2-out) 4-bit (2-in, 2-out) Expansion Slot Mini-Card (Half-size) x 1, BIO x 1 — SIM Option by BIO Board — TPM — — Touch — — Display I/O Note Note: All Specifications are subject to change without notice usa.onyx-healthcare.com 17 P i co -I TX Bo a rd s Single Board Computers Model PICO-HD01 PICO-IMX6 System Form Factor Pico-ITX Pico-ITX CPU AMD G-series T40E (Dual Core)/T40R (Single Core) Processor Freescale i.MX6 Quad 1.0 GHz Automotive Freescale I.MX6 Dual Lite 1.0 GHz Ex. Consumer CPU Frequency 1.0 GHz Dual Core 1.0 GHz Dual/Quad Core Chipset G-Series T40E+ A50M i.MX6 Memory Type SODIMM DDR3 1066MHz 1GB DDR3 Max. Memory Capacity 4 GB 2GB BIOS AMI 32Mb — Wake On LAN YES — Watchdog Timer 255 Levels Integrated Power Requirement +12V only 12V Power Supply Type AT/ATX AT Power Consumption (Typical) AMD T-40R 1.0 GHz, DDR3 1066MHz 2GB, [email protected] DC [email protected], full load, Quad CPU System Cooling Faness, Heat-sink Fanless, Heat-sink Dimension 3.94" x 2.84" (100mm x 72mm) 3.94" x 2.84" (100mm x 72mm) Gross Weight 1.1 lb (0.5 kg) 0.88lb (0.4 kg) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) 0°C ~ 60°C, -40°C ~ 85°C (optional) Storage Temperature -40˚F ~ 176˚F (-40˚C ~ 80˚C) -40°C ~ 85°C Operating Humidity 0% ~ 90% relative humidity, non-condensing 0% ~ 90% relative humidity, non-condensing MTBF (Hours) 89,000 80,000 Certification CE,FCC CE/FCC Chipset Integrated decoders in AMD G-series Freescale i.MX6 Resolution VGA up to 1920x1200 @60Hz uHDMI up to 1920 x 1200 @60Hz LVDS (18it) up to 1366 x768 @60Hz mHDMI, LVDS LCD Interface 18it Single Channel LVDS with PWM function 1 CH 18b LVDS x 1 Storage/SSD SATA II 3.0Gb/s x 1, mSATA/Mini-Card x 1 SATA w/SATA PWR connector, eMMC up to 16GB Ethernet Realtek RTL 8111E, 10/100/1000Base-TX x 1 GbE x 1 USB Port USB2.0 x 5 Up to 4, one OTG port Serial Port RS-232 x 1, RS-232/422/485 x 1 4-wire UART x 2 Audio Audio Buzzer x 1, HD Audio Codec (ALC662) for Mic-in/ Line-in/Line-out Line-in, Speaker out, mic DIO 4-bit (2-in, 2-out) 8-bit Expansion Slot — Mini-Card (Quad only), CAN Bus (optional) SIM — Optional TPM — — Touch — — Display I/O Note 18 Note: All Specifications are subject to change without notice Model BIO-ST01-L1U2 BIO-ST01-M1U1 P i co -I TX Bo a rd s Single Board Computers BIO-ST02-C4M1 System Form Factor 2.5“ Board 2.5“ Board 2.5“ Board BIO 80 Pin Hi-speed Board to board connector 80 Pin Hi-speed Board to board connector 80 Pin hi-speed Board to board connector Power Requirement Power from MB by BIO Power from MB by BIO Power from MB by BIO Board Size 3.94" x 2.84" (100mm x 72mm) 3.94" x 2.84" (100mm x 72mm) 3.94" x 2.84" (100mm x 72mm) Gross Weight 200g 200g 200g Operation Temperature 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F( 0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) Storage Temperature -40 °F ~ 176°F (-40°C ~ 80°C) -40 °F ~ 176°F (-40°C ~ 80°C) -40 °F ~ 176°F (-40°C ~ 80°C) Operation Humidity 0% ~ 90% relative humidity, noncondensing 0% ~ 90% relative humidity, noncondensing 0% ~ 90% relative humidity, noncondensing PCIe Realtek 811E, 10/100/1000Base-TX, RJ-45 x 1 Mini-Card x 1 Mini-Card x 1 (full size) USB USB 2.0 x2 on rear I/O USB 2.0 x 1 on rear I/O USB 2.0 x 1 on rear I/O Audio Dual Channel Audio output with 2W Amp. Dual Channel Audio output with 2W Amp. — SIM — SIM Slot x 1 SIM Slot x 1 Serial Port — — COM1, COM2 RS-232 by Pin Header, COM3, COM4 RS-232 on Rear I/O Expansion Interface SMbus x 1, GPIO x 1 SMbus x 1, GPIO x 1 I/O Note Note: All Specifications are subject to change without notice usa.onyx-healthcare.com 19 EP I C Bo a rds Single Board Computers Model EPIC-BDU7 EPIC-QM77 System Form Factor EPIC EPIC CPU Intel® 5th Generation Intel® Core™ i3/i5/i7 ULT Processor SoC Intel® Core™ i7/i5/i3/Celeron® (BGA based,<=25W ) CPU Frequency Up to 2.2 GHz Up to 2.5 GHz Chipset 5th Generation Intel® Core™ i series ULT Processor SoC Intel® PCH QM77/HM76 Memory Type DDR3L 1333/1600, SODIMM x 1 DDR3 1066/1333/1600, SODIMM x 1 Max. Memory Capacity Up to 8G Up to 8G BIOS UEFI UEFI Wake on LAN Yes Yes Watchdog Timer 255 Levels 255 Levels Power Requirement +12V or 9-24V AT/ATX (default) DC12V Power Supply Type AT/ ATX AT/ ATX Power Consumption (Typical) 38.8W — Dimension (L x W) 4.53" x 6.50" (115mm x 165mm) 4.53" x 6.50" (115mm x 165mm) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) Storage Temperature -40°F ~ 176°F (-40°C ~ 80°C) -40°F ~ 176°F (-40°C ~ 80°C) Operating Humidity 0% ~ 90% relative humidity, non-condensing 0% ~ 90% relative humidity, non-condensing MTBF (Hours) 63,000 — Certification CE/FCC CE/FCC VGA/LCD Controller 5th Generation Intel® Core™ i series ULT Processor SoC Intel® Core™ i7/i5/i3 integrated Video Output Triple independent Displays: VGA, LVDS, DP, LVDS (Optional), eDP (Optional) CRT+2 LVDS(eDP+Internal LVDS), CRT+HDMI, CRT+DVI, DVI+HDMI Backlight Inverter Supply Max. 12V Max. 12V Ethernet Intel® WGI211AT x 1/ WGI218LM x 1, RJ-45 x 2 Intel® 82579LM x 1/Intel® 82583V x 1, 10/100/1000Base Audio High Definition Audio Interface High Definition Audio Interface USB Port USB2.0 x 4, USB3.0 x 2 USB2.0 x 4, USB3.0 x 2 Serial Port COM: RS-232 x 4, COM2, COM3: RS232/422/485 x 2 (Ring/+5V/+12V) RS-232 x 5 , RS-232/422/485 x 1 (COM2) Parallel Port SPP/EPP/ECP x 1 SPP/EPP/ECP x 1 HDD Interface SATA 3.0 x 2 SATA3 x 2 FDD Interface — — SSD mSATA (Share with half-size Mini-Card by BIOS) mSATA x 1 Expansion Slot Mini Card x 1, SIM x1 (Optional), PCI104 (Optional), 16 bit DIO or LPT, PS/2 x 1 Mini Card x 1, 16 bit DIO or LPT, PCI104 DIO 16 bit 16 bit TPM Optional Optional Touch Optional Optional Display I/O Note 20 Note: All Specifications are subject to change without notice Model EPIC-BT07 EPIC-CV07 EP I C Bo a rds Single Board Computers EPIC-5536 System Form Factor EPIC EPIC CPU Intel® Atom™/ Celeron® E3845/J1900/N2807 Intel® Atom™ D2550/N2800/N2600 AMD Geode™ LX 800 CPU Frequency Up to 2.0 GHz 1.6 GHz ~ 2.13 GHz Up to 500 MHz Chipset Intel® Atom™/ Celeron® SOC Intel® Atom™ D2550/N2600 + NM10 AMD CS5536 Memory Type DDR3L 1333, SODIMM x 1 DDR3 800/1066 MHz SDRAM DDR333 (DDR400 optional), SODIMM x 1 Max. Memory Capacity Up to 8G Up to 4G 1 GB BIOS AMI AMI 4MB Award 1 MB Wake on LAN Yes Yes Yes Watchdog Timer 255 Levels 255 Level 255 Levels Power Requirement +12V or 9-24V AT/ATX(default) +12V +12V Power Supply Type AT/ ATX AT/ATX AT/ATX Power Consumption (Typical) 11.8W — AMD Geode™ LX 800 500 MHz, DDR333 1 GB, [email protected] Dimension (L x W) 4.53" x 6.50" (115mm x 165mm) (165mm x 115mm) 4.53" x 6.50" (115mm x 165mm) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) 32 °F ~ 140 °F (0 °C ~ 60 °C); -4 °F ~ 158 °F (-20 °C ~ 70 °C) For WiTAS 1 32°F ~ 140°F (0°C ~ 60°C) Storage Temperature -40°F ~ 176°F (-40°C ~ 80°C) -40 °F ~ 176 °F (-40 °C ~ 80 °C) -40°F ~ 176°F (-40°C ~ 80°C) Operating Humidity 0% ~ 90% relative humidity, noncondensing 10~80%, non-condensing 0% ~ 90% relative humidity, noncondensing MTBF (Hours) 110,000 — 70,000 Certification CE/FCC CE/FCC CE/FCC VGA/LCD Controller Intel® Atom™/ Celeron® SOC Intel® Atom™ D2550/ N2600 integrated AMD Geode™ +TI SN75LVDS83 Video Output CRT, LVDS, HDMI CRT, LVDS, DVI (optional, need to change connector) CRT, LVDS & TTL Backlight Inverter Supply Max. 12V Max. 12V Max. 12V Ethernet Intel® i211 Gigabit Ethernet, RJ-45 x 2 Giga LAN Realtek 8111E x 2 10/100Base-TX x 2, Realtek 8100C (Optional Gigabit LAN) Audio High Definition Audio Interface ALC662 co-lay ALC886/892 High Definition Audio (HDA) USB Port USB2.0 x 5, USB3.0 x 1 USB 2.0 x 7 USB2.0 x 4 (Does not support wake-up function) Serial Port COM1, 4, 5, 6 : RS-232 x 4, COM2, 3 : RS-232/422/485 x 1 (Ring/ +5V/ +12V) RS-232 x 7, RS-232/422/485 x 1 (COM 2) RS-232 x 3, TTL only/ GPS x1, RS232/422/485 x 1 Parallel Port SPP/EPP/ECP x 1 SPP/EPP/ECP x 1 SPP/EPP/ECP x 1 HDD Interface SATA 2.0 x 1 SATA 2.0 x 1 UDMA100 x 1, SATA 1 x 2 FDD Interface — None FDD x 1 SSD mSATA x 1 (Share with half-size MiniCard by BOM) mSATA CompactFlash™ Expansion Slot Mini-Card x 1, SIM x 1 (Only E3800 series), PCI-104 x 1 (optional), 16 bit DIO or LPT, SMbus x 1, I2C x 1 (optional), PS/2 x 1 PCI-104 x 1, Mini-Card x 2 (One support mSATA), Touch Panel feature (Optional), 8 pin DIO 4 in/4out PC/104-plus DIO 16 bit 16 bit 8-bit TPM Optional — — Touch Optional Yes — EPIC Display I/O Note Note: All Specifications are subject to change without notice usa.onyx-healthcare.com 21 SubC o mpa c t Bo ar d s Single Board Computers Model GENE-SKU6 GENE-QM87 System Form Factor 3.5'' SubCompact Board 3.5'' SubCompact Board CPU Intel® Skylake-U Processor SoC Onboard Intel® 4th Generation Core™ i5-4402E Processor CPU Frequency Up to 2.4/3.0 GHz Up to 2.7GHz Chipset Intel® Skylake-U Processor SoC Intel® PCH QM87 Memory Type DDR4 1866/2133, SODIMM x1 DDR3L 1333/1600, SODIMM x 1 Max. Memory Capacity Up to 8GB 8 GB BIOS UEFI SPI type Wake on LAN Yes Yes Watchdog Timer 255 Levels 255 Levels Power Requirement +9~36V or +12V +12V Power Supply Type AT/ ATX AT/ ATX Power Consumption (Typical) — Intel® Core™ i5-4402E 1.6 GHz, DDR3L 1600 8GB, [email protected]+12V Dimension (L x W) 5.75" x 4" (146mm x 101.7mm) 5.75" x 4" (146mm x 101.7mm) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 61°C) Storage Temperature -40°F ~ 176°F (-40°C ~ 81°C) -40°F ~ 176°F (-40°C ~ 81°C) Operating Humidity 0% ~ 90% relative humidity, noncondensing 0% ~ 91% relative humidity, noncondensing MTBF (Hours) — 105,000 Certification CE/FCC CE/FCC VGA/LCD Controller Intel® Skylake-U Processor SoC Intel® Haswell BGA integrated Video Output DVI-I+LVDS, DVI-I + CRT , DVI-I+eDP, CRT+LVDS, CRT+eDP , DP+LVDS CRT+LVDS, CRT+HDMI, LVDS+DVI, LVDS+DVI, LVDS+HDMI, DVI+HDMI, (Real I/O as GENE-QM77 Rev.B) Backlight Inverter Supply Up to 24-bit dual-channel LVDS x 2 Up to 24-bit dual-channel LVDS x 2 Ethernet Intel® i210, 10/100/1000Base, RJ 45 x2 (Support EtherCAT) Intel® I211AT, I217LM ,Intel®I210 10/100/1000Base-TX x2 Audio High Definition Audio Interface High Definition Audio Interface USB Port USB 3.0 x 4, USB 2.0 x 2 USB2.0 x 6, USB3.0 x 2 Serial Port RS-232 x 1 , RS-232/422/485 x 3 RS-232 x 3 , RS-232/422/485 x 1 Parallel Port SPP/EPP/ECP x 1 (Option, share with DIO) — HDD Interface SATA 3.0 x 1, +5V SATA power connector x 1 SATA 3.0 (6 Gbps) x 2 FDD Interface — — SSD mSATA (share with half-size Mini-Card and selective by BIOS) CFast™, mSATA (share with Mini-Card by jumper), Expansion Slot BIO x 1, Mini-Card x 2 and default is mSATA x 1 (half-size), Mini-Card x 1 (Full-size) Mini-Card x 1 DIO 8 bit 8 bit TPM x1 x1 Touch x1 x1 Display I/O Note 22 Note: All Specifications are subject to change without notice Model GENE-QM77 Rev. A GENE-QM77 Rev. B SubC o mpa c t Bo ar d s Single Board Computers System Form Factor 3.5'' SubCompact Board 3.5'' SubCompact Board CPU Intel® Core™ i7/i5/i3/Celeron® (Socket-G2 based ) Intel® Core™ i7/i3/Celeron® (BGA based,17W) CPU Frequency Up to 2.7 GHz Up to 1.8 GHz Chipset Intel® PCH QM77/HM76 Intel® PCH QM77/MH76 Memory Type DDR3 1333/1600, SODIMM x 1 DDR3 1066/1333/1600, SODIMM x 1 Max. Memory Capacity 8 GB 8 GB BIOS SPI type SPI type Wake on LAN Yes Yes Watchdog Timer 255 Levels 255 Levels Power Requirement +12V +12V Power Supply Type AT/ ATX AT/ ATX Power Consumption (Typical) Intel® Core™ i7-3610QE 2.3 GHz, DDR3 1333 8 GB, [email protected]+12V Intel® Core™ i5-3610ME 2.7 GHz, DDR3 1333 8 GB, [email protected]+12V Intel® Core™ i7-3555LE 2.5 GHz, DDR3 1333 8 GB, [email protected]+12V Dimension (L x W) 5.75" x 4" (146mm x 101.6mm) 5.75" x 4" (146mm x 101.6mm) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) Storage Temperature -40°F ~ 176°F (-40°C ~ 80°C) -40°F ~ 176°F (-40°C ~ 80°C) Operating Humidity 0% ~ 90% relative humidity, noncondensing 0% ~ 90% relative humidity, noncondensing MTBF (Hours) 51,000 50,000 Certification CE/FCC CE/FCC VGA/LCD Controller Intel® Core™ i7/i5/i3/Celeron® integrated Intel® Core™ i7/i3/Celeron®integrated Video Output CRT+LVDS, CRT+DVI, LVDS+DVI, LVDS+LVDS CRT+LVDS, CRT+DVI, CRT+HDMI, LVDS+DVI, LVDS+HDMI, DVI+HDMI, LVDS+LVDS Backlight Inverter Supply Up to 24-bit dual-channel LVDS x 2 Up to 24-bit dual-channel LVDS x 2 Ethernet Intel® 82579LM , Realtek RTL-8111E, 10/100/1000Base Intel® 82579LM , Realtek RTL-8111E, 10/100/1000Base Audio High Definition Audio Interface High Definition Audio Interface USB Port USB2.0 x 6 , USB3.0 x 2 USB2.0 x 6 , USB3.0 x 2 Serial Port RS-232 x 3 , RS-232/422/485 x 1 RS-232 x 3 , RS-232/422/485 x 1 Parallel Port SPP/EPP/ECP x 1 (sharded with DIO, By BIOS setting) SPP/EPP/ECP x 1 (By BIOS setting) HDD Interface SATA 3.0 (6 Gbps) x 2 SATA 3.0 (6 Gbps) x 2 FDD Interface — — SSD CFast™, mSATA (share with Mini-Card by BOM) CFast™, mSATA (share with Mini-Card by BOM) Expansion Slot Mini-Card x 1 Mini-Card x 1 DIO 8 bit 8 bit TPM x1 x1 Touch x1 x1 Display I/O Note Note: All Specifications are subject to change without notice usa.onyx-healthcare.com 23 SubC o mpa c t Bo ar d s Single Board Computers Model GENE-BSW5 GENE-BT05 System Form Factor 3.5'' SubCompact Board 3.5'' SubCompact Board CPU Intel® Pentium® & Celeron® M/D Processor SoC Intel® N2930/N2807/J1900/E3845/ E3825 CPU Frequency Up to 2.6 GHz Up to 2.0GHz Chipset Intel® Pentium® & Celeron® M/D Processor SoC Intel® N2930/N2807/J1900/E3845/ E3825 Memory Type DDR3L 1600, SODIMM x 1 DDR3L 1066/1333, SODIMM x 1 Max. Memory Capacity Up to 8 GB Up to 8G BIOS UEFI UEFI Wake on LAN Yes Yes Watchdog Timer 255 Levels 255 Level Power Requirement +12V +12V Power Supply Type AT/ ATX AT/ATX Power Consumption (Typical) Intel® Pentium® N3700 @ 2.40 GHz, DDR 3L 1600MHz, 8G, [email protected]+12V Intel® N2930, DDR3L 1600MHz 8G, [email protected]+12V Dimension (L x W) 5.75" x 4" (146mm x 101.7mm) 5.75" x 4" (146mm x 101.6mm) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) or WiTAS 2 (E3825) Storage Temperature -40°F ~ 176°F (-40°C ~ 81°C) -40°F ~ 176°F (-40°C ~ 80°C) Operating Humidity 0% ~ 90% relative humidity, noncondensing 0% ~ 90% relative humidity, noncondensing MTBF (Hours) 81,000 111,000 Certification CE/FCC CE/FCC VGA/LCD Controller Intel® Pentium® & Celeron® M/D SoC Intel® N2930/N2807/J1900/E3845/ E3825 Video Output LVDS x 2 + VGA (HDMI is optional, shared with LVDS2) CRT+LVDS, HDMI+LVDS , CRT+HDMI Backlight Inverter Supply Up to 24-bit dual-channel LVDS Up to 24-bit dual-channel LVDS x 1 Ethernet Realtek RTL-8111E, 10/100/1000Base, RJ-45 x2 Intel® I211 (or 210), 10/100/1000BaseTX, RJ-45 x 2 Audio High Definition Audio Interface High definition audio interface USB Port USB3.0 x 2, USB2.0 x 3 USB2.0 x 3, USB 3.0 x 1 Serial Port RS-232/422/485 x 2, RS-232 x 4 RS-232 x 2 , RS-232/422/485 x 2 Parallel Port SPP/EPP/ECP x 1 (Option, share with DIO) SPP/EPP/ECP x 1 HDD Interface SATA 3.0 x 1 SATA 2.0 x 1 FDD Interface — — SSD mSATA x 1 (half-size) CFast™ (alternative with mSATA by BOM and also occupy one Mini-Card location) Expansion Slot Mini-Card x 1(Full-size) Mini-Card x 2 (Full-size x 1, Half-size x 1) DIO 8 bit 8 bit TPM x1 x1 Touch x 1 (USB interface) x1 Display I/O Note 24 Note: All Specifications are subject to change without notice Model Model GENE-CV05 GENE-1350 SubC o mpa c t Bo ar d s Single Board Computers System System Form Factor 3.5'' SubCompact Board Form Factor 3.5" CPU Intel® Atom™ D2550/N2800/N2600 Processor TI OMAP™ 3503/3530 600 MHz CPU Frequency Up to 1.86GHz System Memory Onboard 128/256 MB (Optional) LP DDR RAM Chipset Intel® NM10 Ethernet Davicom DM9000AEP, 10/100Base-TX, RJ-45 x 1 Memory Type DDR3 800/1066, SODIMM x 1 Boot Loader Microsoft Windows® CE 6.0 or Linux - Kernal 2.6.32 Max. Memory Capacity 4 GB Watchdog Timer Generate a time-out system reset BIOS SPI type Expansion Interface Mini-Card (with USB interface only) x 2, Proprietary Expansion Slot x 1 Wake on LAN Yes Battery Lithium battery Watchdog Timer 255 Levels Battery Charger Linear tech LTC4100 Power Requirement +12V Power Requirement +9V to +24V DC Power Supply Type AT/ ATX TI OMAP™ 3530, 128/256 MB LP DDR, [email protected]+12V Board Size 5.75"(L) x 4"(W) (146mm x 101.6mm) Power Consumption (Typical) Intel® Atom™ N2800, DDR3 1333 4 GB, [email protected]+12V Intel® Atom™ N2600, DDR3 1066 2 GB, [email protected]+12V Intel® Atom™ D2550, DDR3 1333 4 GB, [email protected]+12V Power Consumption (Typical) Gross Weight 0.88 lb (0.4 kg) Operating Temperature 32°F ~ 158°F (0°C ~ 70°C) -4°F ~ 158°F (-20°C ~ 70°C) for WiTAS 1 -40°F ~ 176°F (-40°C ~ 80°C) for WiTAS 2 Dimension (L x W) 5.75" x 4" (146mm x 101.6mm) Storage Temperature -40°F ~ 176°F (-40°C ~ 80°C) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) Operating Humidity 0% ~ 90% relative humidity, non-condensing Storage Temperature -40°F ~ 176°F (-40°C ~ 80°C) MTBF (Hours) 100,000 Operating Humidity 0% ~ 90% relative humidity, noncondensing Display VGA/LCD Controller TI OMAP™ 3 MTBF (Hours) 62,000 Video Output Certification CE/FCC Up to 1280 x 768 for LCD Up to 1024 x 768 for CRT Backlight Inverter Supply I/O Storage Output Interface Universal Serial Bus Digtial I/O Up to 18-bit single channel TTL/LVDS LCD Audio Line-in, Line-out, Mic-in, Speaker-out (1W Amplifier) Touch Screen Supports 4-wire resistive touch screen Keypad Interface Supports 6 x 6 matrix keypad Motion Sensor — Display VGA/LCD Controller Intel® Atom™ D2550/N2800/N2600 integrated Video Output CRT+LVDS, CRT+DVI, LVDS+DVI, LVDS+LVDS Backlight Inverter Supply Up to 24-bit Dual-Channel LVDS I/O Ethernet Realtek RTL 8111E x 2, 10/100/1000Base-TX, RJ-45 x 2 Audio High definition audio interface USB Port USB2.0 x 6 Serial Port RS-232 x 5 , RS-232/422/485 x 1 Parallel Port SPP/EPP/ECP x 1 (Shared with COM6 by BOM) HDD Interface SATA 2.0 x 1 FDD Interface — SSD CFast™ (alternative with mSATA by BOM and also occupy one Mini-Card location) Expansion Slot Mini-Card x 1 DIO 8 bit TPM x1 Touch x1 256 MB NAND Flash, SD, MicroSD RS-232 x 1, RS-232/422/485 (auto flow) x 1, TTL UART x 1 USB2.0 Host x 2, USB2.0 Client x 1 Supports 8-bit (Programmable) Note Note Note: All Specifications are subject to change without notice usa.onyx-healthcare.com 25 C o m Ex pre ss C PU M o d ul es Computer on Modules Model COM-SKHB6 COM-SKUC6 COM-QM87 System Form Factor COM Express Basic Size COM Express Compact Size COM Express, Basic, Pin-out Type 6 CPU Onboard 6th Gen Intel® Core™ H-series Processor, BGA type Onboard 6th Gen Intel® Core™ U-series Processor, BGA type Onboard 4th Generation Intel® Core™ i5 Processor CPU Frequency Up to i7-6820EQ 2.8 GHz, vPro™ Up to i7-6600U 2.6 GHz, vPro™ Up to 2.7GHz Chipset Onboard 6th Gen Intel® Core™ H-series Processor Onboard 6th Gen Intel® Core™ U-series Processor Intel® PCH QM87 Memory Type DDR4, SODIMM x2, ECC Support DDR3L 1333/1600, SODIMM x 1 DDR3/DDR3L 1333/1600, SODIMM x 2, Supports Dual Channel function Max. Memory Capacity 32GB 8 GB 16GB BIOS AMI BIOS, Legacy Free AMI BIOS, Legacy Free AMI BIOS Wake on LAN Yes Yes Yes Watchdog Timer 255 levels 255 levels 255 Levels Power Requirement Standard: +12V Standard: +12V Nominal: +12V Power Supply Type AT/ATX Selection AT/ATX Selection AT/ ATX Power Consumption (Typical) Intel® i7-6820EQ 2.8GHz, DDR4 16GB, [email protected] Intel® i3-6100U 2.3GHz, 8GB DDR3L, [email protected] Intel® Core™ i5-4400E 2.7GHz, DDR3 1600 8GB, 3.21A @+12V Dimension (L x W) 4.92" x 3.75" (125mm x 95mm) 3.75in x 3.75in (95mm x 95mm) 4.92" x 3.74" (125mm x 95mm) Operating Temperature 32˚F ~ 140˚F (0˚C ~ 60˚C) 32˚F ~ 140˚F (0˚C ~ 60˚C) 32°F ~ 140°F (0°C ~ 60°C) Storage Temperature -4˚F ~ 158˚F (-20˚C ~ 70˚C) -4˚F ~ 158˚F (-20˚C ~ 70˚C) -40°F ~ 176°F (-40°C ~ 80°C) Operating Humidity 10% ~90% relative humidity, noncondensing 10% ~90% relative humidity, noncondensing 0% ~ 90% relative humidity, noncondensing MTBF (Hours) 80,000 80,000 80,000 Certification CE/FCC Class A CE/FCC Class A CE/FCC VGA/LCD Controller Onboard 6th Gen Intel® Core™ H-series Processor, GT2 Onboard 6th Gen Intel® Core™ U-series Processor, GT2/GT1 Intel® Core™ i7/i5/i3 Celeron® integrated Video Output VGA, LVDS/eDP, DDI x2 VGA, LVDS/eDP, DDI x 1 (up to 2) CRT, LVDS LCD, DDI Backlight Inverter Supply — — — Ethernet Intel® I219, Gigabit Ethernet Intel® I219, Gigabit Ethernet Intel® 217LM, Gigabit Ethernet Audio HD Audio HD Audio High definition audio USB Port USB2.0 x 8, USB3.0 x 4 USB2.0 x8, USB3.0 x4 USB2.0 x 8, USB3.0 x 4 Serial Port 2-Wire UART (Tx/Rx) x2 2-Wire UART (Tx/Rx) x2 Tx/Rx x 2 Parallel Port — — — HDD Interface SATA x 4 SATA x 3 (SATA Port 3 optional) SATA x 4 Onboard SSD — — — Display I/O Expansion Slot PCIe[x16] x 1, PCIe[x1] x8, I2C, LPC, SMBus PCIe[x1] x8, I2C, LPC, SMBus PCI-Express[x1] x 7 (Gen 2.0) PCI-Express[x16] x 1 (Gen 3.0) Configurable to 2 x 8-lane PCI Express Ports Configurable to 1 x 8-lane or 2 x 4-lane PCI Express Ports LPC Bus x 1, SM Bus x 1, I2C x 1 DIO GPIO 8-bit GPIO 8-bit GPIO 8-bit TPM Optional Optional Optional Note 26 Note: All Specifications are subject to change without notice Model COM-QM77 Rev. B COM-HM76 COM-KB System Form Factor COM Express, Basic, Pin-out Type 6 COM Express, Basic Module, Pin-out Type 6 COM Express, Compact Module, Pin-out type 6 CPU On board 3rd Gen. Intel® Core™ i7/i5/ i3/Celeron® (FCBGA1023) Socket G2 for Intel® 2nd & 3rd generation Core™ i7/i5/i3/Pentium®/ Celeron® processor AMD® Embedded G-Series SoC APU CPU Frequency Up to 2.5GHz Up to i7-3610QE, Quad core, 2.3GHz Quad(2G), Dual (1.6G) Chipset Intel® PCH QM77/HM76 Intel® HM76 AMD® Embedded G-Series SoC Memory Type DDR3 1333/1600, SODIMM x 2, Supports Dual Channel function Non-ECC DDR3L 1333/1600 AMD GX-420CA SoC with AMD Radeon™ HD 8400E Graphics(Quad) GX-217GA SoC with AMD Radeon™ HD 8280E Graphics (Dual) Max. Memory Capacity Max. 16GB Max. 8 GB MAX. 8 GB BIOS AMI BIOS AMI BIOS AMI BIOS Wake on LAN Yes Yes Yes Watchdog Timer 255 Levels 255 Levels 255 Levels Power Requirement Nominal: +12V Nominal: +12V Nominal: +12V, Optional: +8.5V ~ +19V Power Supply Type AT/ ATX AT/ ATX AT/ATX Power Consumption (Typical) Intel® Core™ i3-3217UE 1.6GHz, DDR3 1066 4GB, 2.23A @+12V i7-3610QE 2.3GHz, DDR3L 8GB, [email protected], [email protected], [email protected] 100% loading on ECB-920A AMD GX-420CA 2.0GHz, 8GB memory, 100% load, [email protected] Dimension (L x W) 4.92" x 3.74" (125mm x 95mm) 4.92" x 3.75" (125mm x 95mm) 3.74" x 3.74" (95mm x 95mm) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) - 4°F ~ 158°F (-20°C ~ 70°C) for WiTAS 1 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) Storage Temperature -40°F ~ 176°F (-40°C ~ 80°C) -40°F ~ 176°F (-40°C ~ 80°C) -40°F ~ 176°F (-40°C ~ 80°C) Operating Humidity 0% ~ 90% relative humidity, noncondensing 0% ~ 90% relative humidity, noncondensing 0% ~ 90% relative humidity, noncondensing MTBF (Hours) 80,000 150,000 80,000 Certification CE/FCC CE/FCC CE/FCC Intel® Core™ i7/i5/i3 Celeron® integrated Intel® Core™ i7/ i5/i3/Celeron® processor integrated AMD® eKabini integrated Video Output CRT, LVDS LCD, DDI x 2 CRT, 18/24-bit Dual-channel LVDS, DDI x2 CRT, 24-bit dual channel LVDS, eDP/ LVDS (18 x 1), DDI x 2 Backlight Inverter Supply — — — Ethernet Intel® 82579LM, Gigabit Ethernet Intel® 82579LM for 10/1000/1000Base-TX Realtek® 8111E, Gigabit Ethernet Audio High definition audio High Definition Audio Interface High Definition Audio Interface USB Port USB 2.0 x 8, USB 3.0 x 4 USB 2.0 x 8, USB 3.0 x 4 USB 2.0 x 8 , USB 3.0 x 2 Serial Port Tx/Rx x 2 Tx/Rx x 2 Tx/Rx x 2 Parallel Port — — — HDD Interface SATA 2 x 4 SATA x 4 SATA x 2 Onboard SSD — — — Expansion Slot PCI-Express [x16] x 1, PCI-Express [x1] x 7, LPC Bus x 1, SM Bus x 1, I2C x 1 PCI-Express [x16] x 1, PCI-Express [1] x 7, LPC bus x 1, SMBus x 1 PCI-Express [x1] x 5, LPC bus x 1, SMBus x 2, PCI-Express[x4] x 1 (PEG) DIO GPIO 8-bit GPIO 8-bit GPIO 8-bit TPM Optional — — Com Express CPU Modules Computer on Modules Display VGA/LCD Controller I/O Note Note: All Specifications are subject to change without notice usa.onyx-healthcare.com 27 C o m Ex pre ss C PU M o d ul es Computer on Modules Model COM-BT COM-BYTC2 System Form Factor COM Express, Compact, Pin-out Type 6 COM Express, Compact Size CPU Onboard Intel® Atom™ SoC Onboard Intel® Atom™ Processor SoC CPU Frequency Intel® Atom™N2930 (1.83 GHz), N2807 (1.58 GHz), E3845 (1.91 GHz), E3827 (1.75 GHz), E3826 (1.46 GHz), E3825 (1.33 GHz), E3815 (1.46 GHz), J1900 (2.0 GHz) Up to J1900 1.91 GHz, Quad core Chipset Intel® Atom™ SoC Intel® Atom™ SoC Memory Type DDR3L 1066/1333 MHz SODIMM x 1 DDR3L 1066/1333, SODIMM x 1 Max. Memory Capacity 8 GB 8GB BIOS AMI BIOS AMI BIOS, Legacy Free Wake on LAN Yes Yes Watchdog Timer 255 Levels 255 levels Power Requirement Nominal: +12V Standard: +12V Power Supply Type AT/ ATX AT/ATX Selection Power Consumption (Typical) [email protected], full load, J1900 [email protected], full load, N2807 [email protected] 12V with J1900, full load Dimension (L x W) 3.74" x 3.74" (95mm x 95mm) 3.75" x 3.75" (95mm x 95mm) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) 32˚F ~ 140˚F (0˚C ~ 60˚C) Storage Temperature -40°F ~ 176°F (-40°C ~ 80°C) -4˚F ~ 158˚F (-20˚C ~ 70˚C) Operating Humidity 0% ~ 90% relative humidity, non-condensing 10% ~90% relative humidity, non-condensing MTBF (Hours) 80,000 80,000 Certification CE/FCC CE/FCC Class A VGA/LCD Controller Intel® Atom™ SoC Integrated Intel® Atom™ SoC Video Output CRT, LVDS LCD, DDI, eDP (on module, by switch) VGA, LVDS, eDP Backlight Inverter Supply — — Ethernet Intel® 211, Gigabit Ethernet Intel® I210IT, Gigabit Ethernet Audio High Definition Audio Interface HD Audio USB Port USB 2.0 x 6, USB 2.0/3.0 x 1 USB2.0 x 7 Serial Port Tx/Rx x 2 — Parallel Port — — HDD Interface SATA x 2 SATA x 1, PATA x 1 Onboard SSD — — Expansion Slot PCI-Express[x1] x 3 (Gen 2.0) LPC Bus x 1 SMbus x 1 PCIe [x1] x 2 PCI x 4 I2C LPC SMBus DIO GPIO 8-bit GPIO 8-bit TPM Optional Optional Display I/O Note 28 Note: All Specifications are subject to change without notice Model COM-CV Rev. B COM-CV Rev. A11 System Form Factor COM Express, Compact, Pin-out Type 6 COM Express, Compact, Pin-out Type 2 CPU Onboard Intel® Atom™ D2550/N2600, Dual Core Processors up to 1.86 GHz Onboard Intel® Atom™ D2550/N2600 Dual Core Processors up to 1.86 GHz CPU Frequency Up to 1.86 GHz Up to 1.86 GHz Chipset Intel® NM10 Intel® NM10 Memory Type DDR3 1066, SODIMM x 1 DDR3 1066, SODIMM x 1 Max. Memory Capacity Up to 4 GB Up to 4 GB BIOS AMI BIOS AMI BIOS Wake on LAN Yes Yes Watchdog Timer 255 Levels 255 Levels Power Requirement Nominal: +12V Nominal: +12V Power Supply Type AT/ ATX AT/ ATX Power Consumption (Typical) Intel® D2550 1.86 GHz, DDR3 1066/4GB, [email protected]+12V Intel® D2550 1.86 GHz, DDR3 1066/4GB, [email protected]+12V Dimension (L x W) 3.74" x 3.74" (95mm x 95mm) 3.74" x 3.74" (95mm x 95mm) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) (D2550/N2600) -40°F ~ 185°F (-40°C ~ 85°C)(N2600) 32°F ~ 140°F (0°C ~ 60°C) Storage Temperature -40°F ~ 176°F (-40°C ~ 80°C) -40°F ~ 176°F (-40°C ~ 80°C) Operating Humidity 0% ~ 90% relative humidity, noncondensing 0% ~ 90% relative humidity, noncondensing MTBF (Hours) 80,000 80,000 Certification CE/FCC CE/FCC VGA/LCD Controller Intel® Atom™ D2550/N2600 Processor integrated Intel® Atom™ D2550/N2600 Processor integrated Video Output CRT/ LVDS LCD/ DDI x 1 CRT/ LVDS LCD Backlight Inverter Supply — — Ethernet Intel® 82583V, Gigabit Ethernet Intel® 82583V, Gigabit Ethernet Audio High Definition Audio Interface High Definition Audio Interface USB Port USB2.0 x 8, USB3.0 x 2 USB2.0 x 8 Serial Port Tx/Rx x 2 From LPC interface Parallel Port — From LPC interface HDD Interface SATA 2 x 2 SATA 2 x 4, PATA x 1 Onboard SSD — — Expansion Slot PCI-Express [x1] x 4 LPC Bus x 1 SM Bus x 1 PCI-Express [x1] x 3 32-bit PCI x 2 LPC Bus x 1 SM Bus x 1 DIO GPIO 8-bit GPIO 8-bit TPM Optional — Com Express CPU Modules Computer on Modules Display I/O Note Note: All Specifications are subject to change without notice usa.onyx-healthcare.com 29 C o m Ex pre ss C PU M o d ul es Computer on Modules Model NanoCOM-BT NanoCOM-CV Rev. A NanoCOM-CV Rev. B System Form Factor COM Express, Nano Module,Pin-out Type 10 COM Express, Ultra (Nano) Module, Pinout Type 1 COM Express, Ultra (Nano) Module, Pinout Type 10 CPU Intel® Atom™/ Celeron® SOC Processor (M/I) Onboard Intel® Atom™ N2600 Onboard Intel® Atom™ N2600 CPU Frequency Up to E3845, 1.91 GHz Up to 1.6GHz Up to 1.6GHz Chipset Intel® Atom™/ Celeron® SOC Processor Intel® NM10 Intel® NM10 Memory Type Onboard DDR3L Non-ECC DDR3 800 Non-ECC DDR3 800 Max. Memory Capacity 2 GB DDR3L Onboard (up to 4 GB) 2GB, DDR3 onboard 2GB, DDR3 onboard BIOS AMI BIOS AMI BIOS AMI BIOS Wake on LAN Yes Yes Yes Watchdog Timer 255 Levels 255 Levels 255 Levels Power Requirement Standard : +12V, AT/ATX Optional: +5V, AT/ATX Nominal: +12V Nominal: +12V Power Supply Type AT/ATX Nominal: +12V, +4.75V ~ +14.7V (Optional) Nominal: +12V, +4.75V ~ +14.7V (Optional) Power Consumption (Typical) [email protected], full load, E3845 [email protected], full load, N2600 [email protected], full load, N2600 Dimension (L x W) 3.31" x 2.17" (84mm x 55mm) 3.31" x 2.17" (84mm x 55mm) 3.31" x 2.17" (84mm x 55mm) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) -40°F ~ 185°F (-40°C ~ 80°C) by E3845/E3825 32°F ~ 140°F (0°C ~ 60°C), -40°F ~ 185°F (-40°C ~ 85°C) for WiTAS 2 32°F ~ 140°F (0°C ~ 60°C), -40°F ~ 185°F (-40°C ~ 85°C) for WiTAS 2 Storage Temperature -40°F ~ 176°F (-40°C ~ 80°C) -40°F ~ 185°F (-40°C ~ 85°C) -40°F ~ 185°F (-40°C ~ 85°C) Operating Humidity 0% ~ 90% relative humidity, noncondensing 0% ~ 90% relative humidity, noncondensing 0% ~ 90% relative humidity, noncondensing MTBF (Hours) 90,000 80,000 80,000 Certification CE/FCC CE/FCC CE/FCC VGA/LCD Controller Intel® Atom SOC Intel® Atom™ N2600 integrated Intel® Atom™ N2600 integrated Video Output LVDS LCD/eDP, DDI x 1 LVDS, CRT LVDS, DDI Backlight Inverter Supply — — — Ethernet Intel® Intel® 82583V Intel® 82583V Audio High Definition Audio Interface Mic-in, Line-in, Line-out Mic-in, Line-in, Line-out USB Port USB2.0 x 8 USB 2.0 x 8 via NM10 USB 2.0 x 8 via NM10 Serial Port Tx/Rx x 2 — TX/RX x 2 Parallel Port From LPC interface — — HDD Interface SATA 3.0 Gb/s x 2, SATA 2 x 3 SATA 3.0Gb/s x 2 (one shared with SSD) SATA 3.0Gb/s x 2 (one shared with SSD) Onboard SSD Optional eMMC support Optional up to 4GB Optional up to 4GB Expansion Slot PCI-Express [x1] x 3, 32-bit PCI x2 LPC Bus x 1 SM Bus x 1 PCI-Express [x1] x 3 LPC bus x 1 SMBus x 1 PCI-Express [x1] x 3 LPC bus x 1 SMBus x 1 DIO GPIO 8-bit GPIO 8-bit GPIO 8-bit TPM — — — Display I/O Note 30 Note: All Specifications are subject to change without notice Model XTX-BSW ECB-960T uCOM-BT System Form Factor XTX CPU Onboard Intel® Atom™ N3000 Processor SoC, D1 stepping CPU Frequency Up to 1.86GHz up to 1.91 GHz — Chipset Onboard Intel® Atom™ N3000 Processor SoC, D1 stepping Intel® Atom™ E3800 series — Memory Type DDR3L 1066 MHz, SODIMM x 1 Onboard DDR3L — Max. Memory Capacity 8 GB 2 GB (optional to 4 GB) — BIOS AMI BIOS AMI BIOS — Wake on LAN Yes No — Watchdog Timer 255 Levels 255 Levels — Power Requirement +5V Normal: 3.3V - 5V +12V DC; +8~20VDC-in on seperate connector Power Supply Type AT/ ATX SMARC Version 1.1 Intel® Atom™ SOC Processor Mini-ITX form Factor (170mmx 170mm) — AT/ ATX — Power Consumption (Typical) — [email protected], full load, E3845 — Dimension (L x W) 4.5" x 3.74" (114mm x 95mm) 3.23" x 1.96" (82 x 50 mm) 6.69" x 6.69" (170mm x 170mm) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) 32 °F ~ 140 °F (0 °C ~ 60 °C) 32 °F ~ 140 °F (0 °C ~ 60 °C) Storage Temperature -40°F ~ 176°F (-40°C ~ 80°C) -40°F ~ 185°F (-40°C ~ 85°C) -4 °F ~ 158 °F (-20 °C ~ 70 °C) Operating Humidity 0% ~ 90% relative humidity, non-condensing 0% ~ 90% relative humidity, non-condensing 10% ~ 80% relative humidity, non-condensing MTBF (Hours) 80,000 80,000 80,000 Certification CE/FCC CE/FCC — VGA/LCD Controller Intel® Atom™ N3000 Processor integrated Intel® Atom SOC — Video Output CRT, LVDS LCD, DP (optional) 24-bit LVDS LCD/eDP, HDMI 18/24-bit Single channel LVDS Backlight Inverter Supply — — — Ethernet Realtek 8105E, 10/100Base-TX Intel® I211AT, 10/1000/1000Base-TX — Audio Realtek ALC892 HD Audio x 1 Line-in, Line-out, Microphone USB Port USB2.0 x 5 USB3.0 x 1, USB2.0 x 2 USB3.0 x 1, USB2.0 x 5 Serial Port 2 UART x 2 (1 for TX/RX/RTS#/ CTS#; 1 for TX/RX) 2-wire x 1, 4-wire x 1 Parallel Port 1 — — HDD Interface SATA x 2 (one shared with PATA), PATA x 1 SATA x 2 SATA x 1 FDD Interface — — — SSD — Optional for onboard eMMC — PCI Express [x1] x 2, PCI PCI Express [x1] x 3 I2C, SMBus x 1, SDIO SPI x 2, SPI 0 for boot only PCI-Express [x1] x 3 via adapter card DIO — GPIO, 9 bit (up to 12 bit) — TPM — — — Note LPC not supported — microSD card x 1 I2C:Client mode Display SMARC CUP Module and Carrier Board, XTX CPU Module Computer on Modules I/O Expansion Slot Note: All Specifications are subject to change without notice usa.onyx-healthcare.com 31 Qsev en C P U M o d ul es Computer on Modules Model AQ7-IMX6 AQ7-BT System Form Factor Qseven Rev. 2.0 Qseven Rev.2.0 CPU Freescale® i.MX6 SoC Processor Intel® Atom™ SOC Processor CPU Frequency 1.0 GHz (Dual lite), 1.2 GHz(Quad) up to 1.91GHz Chipset Freescale® i.MX6 Quad 1.0GHz Processor Freescale® i.MX6 Quad 1.2GHz Processor Freescale® i.MX6 Dual Lite 800MHz Processor Intel® Atom™ E3800 series Memory Type Onboard DDR3 1066MHz (Quad) Onboard DDR3 800MHz (Dual lite) Onboard DDR3L Max. Memory Capacity Onboard DDR3 1066MHz, 1GB, up to 2GB (Quad) BIOS — AMI BIOS Wake on LAN No No Watchdog Timer 255 level (per levelo 0.5 sec) 255 Levels Power Requirement +5V +5V Power Supply Type AT/ ATX AT/ ATX Power Consumption (Typical) Freescale iMX6 Quad 1.2GHZ, DDR3 1GB, eMMC 8GB, 5.375W (w/ECB-970) [email protected], full load, E3845 Dimension (L x W) 2.75" x 2.75" (70mm x 70mm) 2.75" x 2.75" (70mm x 70mm) Operating Temperature 32 °F ~ 140 °F (0 °C ~ 60 °C) -40 °F ~ 185 °F (-40 °C ~ 80 °C) WiTAS 2 32 °F ~ 140 °F (0 °C ~ 60 °C) -40 °F ~ 185 °F (-40 °C ~ 80 °C) by E3825 Storage Temperature -40°F ~ 185°F (-40°C ~ 85°C) -40°F ~ 185°F (-40°C ~ 85°C) Operating Humidity 0% ~ 90% relative humidity, non-condensing 0% ~ 90% relative humidity, non-condensing MTBF (Hours) 100,000 80,000 Certification CE/FCC CE/FCC Onboard DDR3 800MHz, 1GB, up to 2GB (Dual lite) 2GB (Optional to 4 GB) Display VGA/LCD Controller Freescale® i.MX6 Quad 1.0GHz Processor Freescale® i.MX6 Quad 1.2GHz Processor Intel® Atom™ SOC Freescale® i.MX6 Dual Lite 800MHz Processor Video Output Backlight Inverter Supply LVDS x 2 (24-bit x 1)/ LVDS x 1 (24-bit x 2), HDMI 1.4 24-bit LVDS LCD, DDI x 1 — — Ethernet Micrel® KSZ9021RNI, 10/1000/1000Base-TX Intel® I210IT, 10/1000/1000Base-TX Audio I2S x 1 High Definition Audio Interface USB Port USB 2.0 x 5 (Shared with USB OTG client x 1) USB 2.0 x 6, USB 3.0 x 1 Serial Port 4-Wire UART x 1 4-Wire UART x 1, 2-wire UART x 1 Parallel Port — — HDD Interface SATA 3.0GB/s x 1 (Quad) SATA x 2, 1 share with onboard SSD FDD Interface — — SSD eMMC x 1 (optional) Optional Expansion Slot PCI Express [x1] x 1 CAN Bus x 1 I2C x 1 SDIO x 1 PCI Express [x1] x 3 LPC Bus x 1(shared with GPIO) SMbus x 2 DIO 8 bit GPIO 8-bit (shared w/ LPC, optional) TPM — — I/O Note 32 Note: All Specifications are subject to change without notice Model ECB-970-A10 ECB-970-A10-01 System X86 (A10) ARM (A10-01) Form Factor Micro ATX Micro ATX I/O Chipset — — Ethernet 10/100/1000Base-TX, RJ-45 x 1 (From CPU module) 10/100/1000Base-TX, RJ-45 x 1 (From CPU module) Expansion Interface PCI-E [x4] x 1(For Super I/O Card only), LPC Connector x 1 PCI-E [x1] x 1 Power Requirement +5V DC +5V DC Power Consumption (Typical) — 3~5 Watt @5V Board Size 9.65" x 9.65" (243.84mm x 243.84mm) 9.65" x 9.65" (243.84mm x 243.84mm) Gross Weight 1.32 lb (0.6 kg) 1.32 lb (0.6 kg) Operation Temperature 32°F ~ 140°F (0°C ~ 60°C) 32°F ~ 140°F (0°C ~ 60°C) Storage Temperature -40°F ~ 185°F (-40°C ~ 85°C) -40°F ~ 185°F (-40°C ~ 85°C) Operation Humidity 0% ~ 90% relative humidity, non-condensing 0% ~ 90% relative humidity, non-condensing MTBF (Hours) 75,000 75,000 VGA/LCD Controller VGA x 1 — Video Output 18-bit Single Channel LVDS 24-bit Dual-Channel LVDS Backlight Inverter Supply — LVDS x 2, eDP x 2, HDMI x 1 Storage SATA x 2, SDIO x 1 SATA 2 x 1 Serial Port RS-232 x 1, RS-232/422/485 x 1 One, For debug only Parallel Port — — USB USB 2.0 x 8, USB 3.0 x 2 USB 2.0 x 5 (one shared with USB OTG) PS/2 Port — — I2C — 1 Audio Line-out, Microphone Headphone Debug LED Port 80 — Qseven Carrier Boards Computer on Modules Display I/O Note Note: All Specifications are subject to change without notice usa.onyx-healthcare.com 33 M emo 34 Memo Note: All Specifications are subject to change without notice N o t e : A l l S p e c i fi c a t i o n s a r e s u b j e c t t o c h a n g e w i t h o u t n o t i c e Note: All Specifications are subject to change without notice N o t e : A l l S p e c i fi c a t i o n s a r e s u b j e c t t o c h a n g e w i t h o u t n o t i c e usa.onyx-healthcare.com usa.onyx-healthcare.com M emo Memo 35 Onyx Healthcare USA, Inc America Headquarter 324 West Blueridge Ave. Orange, CA 92865 Tel: +1-714-792-0774 Fax: +1-714-792-0481 E-mail: [email protected] Signle Board Computer Selection Guide 2016 usa.onyx-healthcare.com
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